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expansion:
seed: 42
max_variants_per_seed: 8
axes:
board_type:
- "motherboard"
- "laptop pcb"
- "graphics card"
- "server board"
- "smartphone pcb"
- "RAM module scrap"
condition:
- "damaged"
- "stripped"
- "scrap"
- "desoldered"
- "blowtorched"
- "cannibalized"
view:
- "macro close up"
- "top view"
- "bottom view"
- "high resolution"
- "recycling yard"
- "junk yard scrap"
classes:
cpu_socket:
seeds:
- "CPU socket PCB"
- "LGA socket motherboard"
- "PGA processor socket"
- "empty cpu socket board"
- "laptop CPU socket close up"
- "server motherboard socket LGA 1700"
multilingual:
zh:
- "CPU插座 主板"
- "处理器插槽"
de:
- "Prozessorsockel Mainboard"
gold_finger:
seeds:
- "PCIe gold fingers"
- "RAM edge connector contacts"
- "PCB gold finger pins"
- "gold plated pcb edge"
- "stripped gold edge fingers PCB"
- "gold finger pin recovery scrap"
multilingual:
zh:
- "PCB 金手指"
- "内存条金手指"
de:
- "Goldkontakte Leiterplatte"
ic_chip:
seeds:
- "BGA chip motherboard"
- "SMD IC chip PCB"
- "microchip printed circuit board"
- "QFP IC package board"
- "desoldered BGA footprint"
- "chipset heatsink removed motherboard"
multilingual:
zh:
- "主板 芯片"
- "集成电路 电子废弃物"
de:
- "Mikrochip Leiterplatte"
tantalum_capacitor:
seeds:
- "SMD tantalum capacitor PCB"
- "yellow tantalum capacitor board"
- "surface mount tantalum capacitor"
- "black tantalum cap SMD"
- "tantalum capacitors ewaste scrap"
multilingual:
zh:
- "钽电容 主板"
de:
- "Tantalkondensator Mainboard"
forcibly_desoldered_pad:
seeds:
- "desoldered PCB pads blowtorch"
- "removed chip solder pads burnt flux"
- "stripped motherboard pads torn traces"
- "cannibalized circuit board exposed pads"
- "hot air desoldered SMD pads"
- "salvaged chips board footprint scrap"
- "blowtorched PCB desoldered pads"
- "desoldered chip footprint torn traces"
- "heatgun removed IC solder pads"
- "cannibalized motherboard chip pads"
- "burnt flux desoldered footprint scrap"
- "PCB solder pad lifted trace damage"
- "desoldered BGA pad array scrap"
- "removed SMD chip solder footprint"
multilingual:
zh:
- "拆焊 焊盘 主板"
- "吹焊 芯片 焊盘 损毁"
- "拆芯片 焊盘 损坏 PCB"
de:
- "Entlötete Pads Leiterplatte"
- "Entlötete SMD Pads Platine Schrott"
ja:
- "デソルダリング 済 基板 パッド"
factory_unpopulated_pad:
seeds:
- "unpopulated PCB pads SMD"
- "empty IC footprint circuit board"
- "bare PCB solder mask footprint"
- "unpopulated SMD pads clean silkscreen"
- "unpopulated SMD PCB solder pads"
- "bare solder mask footprint empty IC"
- "unpopulated PCB silkscreen solder pads"
- "empty component footprint circuit board"
- "unpopulated SMD capacitor pads"
- "PCB unpopulated BGA footprint clean"
- "unpopulated SMT pads bare copper"
multilingual:
zh:
- "未焊 接 焊盘 PCB"
- "空焊盘 线路板 没焊"
de:
- "Unbestückte Pads Leiterplatte"
- "Unbestückte SMD Pads Leiterplatte"
ja:
- "未実装 PCB パッド 基板"
occluded_region:
seeds:
- "dusty dirty ewaste circuit board"
- "motherboard heatsink covered chips"
- "metal shield covered PCB board"
- "corroded scrap motherboard"
- "dusty dirty scrap circuit board close up"
- "PCB heatsink metal shield covered components"
- "dust covered motherboard IC chips"
- "corroded dirty ewaste PCB board"
- "metal EMI shield covered circuit board"
- "dusty server board heatsink covered"
multilingual:
zh:
- "灰尘 覆盖 电子线路板"
- "散热片 遮挡 主板 芯片"
de:
- "Verschmutzte Leiterplatte Schrott"
- "Verschmutzte Platine Staub Kühlkörper"
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