[System] You are an expert US patent attorney. Draft a set of independent and dependent claims based on the provided invention description. Use correct USPTO formatting.

[User]
Title: Semiconductor Device

Technical Field and Background:
In recent years, a stacked type semiconductor memory device has been proposed in which memory cells are integrated three-dimensionally. In such a stacked type semiconductor memory device, a stacked body in which electrode films and insulating films are stacked alternately is provided on a semiconductor substrate; and semiconductor pillars that pierce the stacked body are provided. Then, memory cells are formed at each intersection between the electrode films and the semiconductor pillars. Also, a drive circuit for driving the memory cells also is provided on the same semiconductor substrate.

Invention Disclosure:
A semiconductor device includes: a semiconductor substrate, a first portion and a second portion of an upper layer portion of the semiconductor substrate being conductive; an insulating member electrically isolating the first portion from the second portion; a first stacked body provided in a region directly above the second portion, the first stacked body including first insulating films and electrode films stacked alternately; a semiconductor pillar provided inside the first stacked body and extending in a stacking direction; a charge storage film provided between the semiconductor pillar and the electrode films; a second stacked body provided in a region directly above the first portion, the second stacked body including second insulating films and third insulating films stacked alternately; and two first conductive pillars provided inside the second stacked body extending in the stacking direction, lower ends thereof being connected to the first portion.

[Assistant]
1. A semiconductor device, comprising:
a semiconductor substrate, a first portion and a second portion of an upper layer portion of the semiconductor substrate being conductive;
an insulating member provided on the semiconductor substrate, the insulating member electrically isolating the first portion from the second portion;
a first stacked body provided in a region directly above the second portion of the semiconductor substrate, the first stacked body including a plurality of first insulating films and a plurality of electrode films, each of the first insulating films and each of the electrode films being stacked alternately;
a semiconductor pillar provided inside the first stacked body, the semiconductor pillar extending in a stacking direction of the first insulating films and the electrode films;
a charge storage film provided between the semiconductor pillar and the electrode films;
a second stacked body provided in a region directly above the first portion of the semiconductor substrate, the second stacked body including a plurality of second insulating films and a plurality of third insulating films, each of the second insulating films and each of the third insulating films being stacked alternately;
two first conductive pillars provided inside the second stacked body, the two first conductive pillars extending in the stacking direction, lower ends of the two first conductive pillars being connected to the first portion;
two second conductive pillars provided inside the second stacked body, the two second conductive pillars extending in the stacking direction; and
an interconnect provided on the second stacked body and connected between one of the two first conductive pillars and one of the two second conductive pillars,
the insulating member electrically isolating a third portion of the upper layer portion of the semiconductor substrate from the first portion and the second portion, the third portion being conductive,
lower ends of the two second conductive pillars being connected to the third portion.

2. The semiconductor device according to claim 1, wherein a diameter of the first conductive pillar is larger than a diameter of the semiconductor pillar.

3. The semiconductor device according to claim 1, wherein the first conductive pillars include silicon.

4. The semiconductor device according to claim 3, wherein the first conductive pillars include at least one type of element selected from the group consisting of arsenic, phosphorus, boron, and gallium.

5. The semiconductor device according to claim 1, further comprising a semiconductor plug provided on the semiconductor pillar,
the charge storage film being disposed around the semiconductor plug,
a composition of the semiconductor plug being the same as a composition of the first conductive pillars.

6. The semiconductor device according to claim 1, wherein a composition of the second insulating films is the same as a composition of the first insulating films.

7. The semiconductor device according to claim 1, wherein a thickness of the second insulating film is equal to a thickness of the first insulating film.

8. The semiconductor device according to claim 1, wherein a thickness of the third insulating film is equal to a thickness of the electrode film.

9. The semiconductor device according to claim 1, further comprising a fourth insulating film provided around the first conductive pillar, at least a portion of a film configuration of the fourth insulating film being the same as a film configuration of the charge storage film.

10. The semiconductor device according to claim 1, further comprising a core member provided inside the semiconductor pillar, the core member being insulative,
a configuration of the semiconductor pillar being a circular tube covering a side surface and a lower surface of the core member, a lower end of the circular tube being sealed,
configurations of the first conductive pillars being circular columns.

11. The semiconductor device according to claim 1, wherein the second insulating film includes silicon oxide, and the third insulating film includes silicon nitride.

12. A semiconductor device, comprising:
a semiconductor substrate, a first portion and a second portion of an upper layer portion of the semiconductor substrate being conductive;
an insulating member provided on the semiconductor substrate, the insulating member electrically isolating the first portion from the second portion;
a stacked body provided in a region directly above the second portion of the semiconductor substrate, the stacked body including a plurality of first insulating films and a plurality of electrode films, each of the first insulating films and each of the electrode films being stacked alternately;
a semiconductor pillar provided inside the stacked body, the semiconductor pillar extending in a stacking direction of the first insulating films and the electrode films;
a charge storage film provided between the semiconductor pillar and the electrode films;
a second insulating film provided in a region directly above the first portion of the semiconductor substrate;
two first conductive pillars provided inside the second insulating film, the two first conductive pillars extending in the stacking direction, lower ends of the two first conductive pillars being connected to the first portion;
two second conductive pillars provided inside the second insulating films, the two second conductive pillars extending in the stacking direction; and
an interconnect provided on the second insulating films, the interconnect being connected between one of the two first conductive pillars and one of the two second conductive pillars,
the insulating member electrically isolating a third portion of the upper layer portion of the semiconductor substrate from the first portion and the second portion, the third portion being conductive,
lower ends of the two second conductive pillars being connected to the third portion.

13. The semiconductor device according to claim 12, wherein a distance between the semiconductor substrate and an upper surface of the second insulating film is equal to a distance between the semiconductor substrate and an upper surface of the stacked body.

14. The semiconductor device according to claim 12, wherein a diameter of the first conductive pillar is larger than a diameter of the semiconductor pillar.

15. The semiconductor device according to claim 12, wherein the first conductive pillars include silicon.

16. The semiconductor device according to claim 12, further comprising a semiconductor plug provided on the semiconductor pillar,
the charge storage film being disposed around the semiconductor plug,
a composition of the semiconductor plug being the same as a composition of the first conductive pillars.

17. The semiconductor device according to claim 12, further comprising a third insulating film provided around the first conductive pillar, at least a portion of a film configuration of the third insulating film being the same as a film configuration of the charge storage film.

18. The semiconductor device according to claim 12, further comprising an insulating pillar provided inside the first conductive pillar, the insulating pillar extending in the stacking direction,
the first conductive pillar covering a side surface and a lower surface of the insulating pillar.


[System] You are an expert US patent attorney. Draft a set of independent and dependent claims based on the provided invention description. Use correct USPTO formatting.

[User]
Title: Charging Ram Assembly, And Pin Assembly And Securing Method Therefor

Technical Field and Background:
Field The disclosed concept relates to charging ram assemblies for electrical switching apparatus, such as, for example, circuit breakers. The disclosed concept also relates to pin assemblies for charging ram assemblies. The disclosed concept further relates to methods of securing pin members within charging ram assemblies. Background Information Electrical switching apparatus, such as circuit breakers, provide protection for electrical systems from electrical fault conditions such as, for example, current overloads, short circuits, abnormal voltage and other fault conditions. Typically, circuit breakers include an operating mechanism, which opens electrical contacts to interrupt the flow of current through the conductors of an electrical system in response to such fault conditions as detected, for example, by a trip unit. The electrical contacts include stationary electrical contacts and corresponding movable electrical contacts that are separable from the stationary electrical contacts. Among other components, the operating mechanisms of some low and medium voltage circuit breakers, for example, typically include charging ram assemblies that are used to store potential energy and release the potential energy to close the electrical contacts. The charging ram assemblies of many known circuit breakers commonly include a ram member, a guide pin, and a nut. During assembly, the nut is torqued onto an end of the guide pin and then riveted to hold the nut in place. In order to use the riveting process, the hardness of the guide pin must be undesirably limited. Because of the reduced hardness to accommodate the riveting process, mechanical endurance testing has shown that the rivet fails earlier than desired. More specifically, the force of the ram member causes the threads of the relatively soft guide pin to break or deform, causing the nut to slide with respect to the guide pin and the entire assembly to elongate. As a result, the ram member over-travels beyond its desired finish location and causes rigid components in the circuit breaker to be undesirably impacted. There is thus room for improvement in charging ram assemblies, and in pin assemblies and securing methods therefor.

Invention Disclosure:
A pin assembly is for a charging ram assembly of an electrical switching apparatus. The charging ram assembly has a biasing element, a ram member structured to bias the biasing element, and a plate member. The pin assembly includes a pin member structured to extend through the biasing element and the plate member, the pin member having an end portion; a first collar member and a second collar member coupled to the end portion; and a securing apparatus including a retaining member coupled to the first collar member and the second collar member in order to prevent the pin member from moving with respect to the first collar member and the second collar member.

[Assistant]
1. A pin assembly for a charging ram assembly of an electrical switching apparatus, said charging ram assembly comprising a biasing element, a ram member structured to bias said biasing element, and a plate member, said pin assembly comprising:
a pin member structured to extend through said biasing element and said plate member, said pin member having a first end portion and a second end portion disposed opposite and distal from said first end portion;
a plurality of collar members comprising a first collar member and a second collar member, said first collar member and said second collar member being coupled to said first end portion; and
a securing apparatus comprising a retaining member coupled to said first collar member and said second collar member in order to prevent said pin member from moving with respect to said first collar member and said second collar member,
wherein said first end portion has an annular-shaped grooved region; wherein each of said first collar member and said second collar member is disposed in said grooved region; wherein said securing apparatus further comprises a washer; wherein said grooved region has a first region and a second region extending from the first region; wherein the first region and the second region each have a diameter; wherein the diameter of the second region is greater than the diameter of the first region; wherein said washer is concentric with the second region; wherein each of said first collar member and said second collar member is concentric with the first region; wherein each of said first collar member and said second collar member comprises a first disc-shaped portion, a second disc-shaped portion disposed opposite the first portion, and a third disc-shaped portion extending between the first portion and the second portion; wherein the first portion, the second portion, and the third portion each have a width; and wherein the width of the third portion is greater than the width of the first portion and the width of the second portion.

2. The pin assembly of claim 1 wherein said retaining member engages the first portion, the second portion, and the third portion.

3. The pin assembly of claim 1 wherein each of said first collar member and said second collar member is semi annular-shaped.

4. The pin assembly of claim 3 wherein said first collar member is concave facing said second collar member; and wherein said second collar member is concave facing said first collar member.

5. The pin assembly of claim 1 wherein the first region comprises a first disc-shaped-surface, a second disc-shaped surface disposed opposite said first surface, and a third cylindrical-shaped surface extending between and being perpendicular to the first surface and the second surface; wherein each of said first collar member and said second collar member is flush with the third surface; and wherein each of said first collar member and said second collar member is structured to engage the first surface in order to prevent said pin member from moving with respect to said first collar member and said second collar member.

6. The pin assembly of claim 1 wherein said plurality of collar members further comprises a third collar member and a fourth collar member each coupled to said second end portion; and wherein said securing apparatus further comprises a second retaining member coupled to said third collar member and said fourth collar member in order to prevent said pin member from moving with respect to said third collar member and said fourth collar member.

7. The pin assembly of claim 1 wherein said first collar member does not engage said second collar member.

8. The pin assembly of claim 1 wherein said first collar member, said second collar member, and said retaining member are not threadably connected to said pin member.

9. The pin assembly of claim 1 wherein said pin member has a Rockwell Hardness greater than RC 45.

10. A charging ram assembly for an electrical switching apparatus, said charging ram assembly comprising:
a biasing element;
a ram member structured to bias said biasing element;
a plate member; and
a pin assembly comprising:
a pin member extending through said biasing element and said plate member, said pin member having a first end portion and a second end portion disposed opposite and distal from said first end portion,
a plurality of collar members comprising a first collar member and a second collar member, said first collar member and said second collar member being coupled to said first end portion, and
a securing apparatus comprising a retaining member coupled to said first collar member and said second collar member in order to prevent said pin member from moving with respect to said first collar member and said second collar member,
wherein said first end portion has an annular-shaped grooved region; wherein each of said first collar member and said second collar member is disposed in said grooved region; wherein said securing apparatus further comprises a washer; wherein said grooved region has a first region and a second region extending from the first region; wherein the first region and the second region each have a diameter; wherein the diameter of the second region is greater than the diameter of the first region; wherein said washer is concentric with the second region; wherein each of said first collar member and said second collar member is concentric with the first region; wherein each of said first collar member and said second collar member comprises a first disc-shaped portion, a second disc-shaped portion disposed opposite the first portion, and a third disc-shaped portion extending between the first portion and the second portion; wherein the first portion the second portion, and the third portion each have a width; and wherein the width of the third portion is greater than the width of the first portion and the width of the second portion.

11. The charging ram assembly of claim 10 wherein said plate member comprises a first surface and a second surface parallel to the first surface; wherein the first surface and the second surface face away from one another; wherein the first surface faces said biasing element and said ram member; and wherein the second surface faces each of said first collar member, said second collar member, and said retaining member.

12. A method of securing a pin member within a charging ram assembly of an electrical switching apparatus, said charging ram assembly comprising a biasing element, a ram member structured to bias said biasing element, and a plate member, the method comprising the steps of:
providing a pin assembly comprising said pin member, a first collar member, a second collar member, and a retaining member, said pin member having a first end portion and a second end portion disposed opposite and distal from said first end portion;
extending said pin member through said biasing element and said plate member;
disposing said first collar member and said second collar member on said first end portion; and
coupling said retaining member to said first collar member and said second collar member in order to prevent said pin member from moving with respect to said first collar member and said second collar member, wherein each of said first collar member and said second collar member comprises a first disc-shaped portion, a second disc-shaped portion disposed opposite the first portion, and a third disc-shaped portion extending between the first portion and the second portion; wherein the first portion, the second portion, and the third portion each have a width; wherein the width of the third portion is greater than the width of the first portion and the width of the second portion; and wherein the coupling step further comprises:
substantially enclosing each of said first collar member and said second collar member with said retaining member; and
employing a tool to move said retaining member from a first position to a second position, wherein in the first position said retaining member engages each respective first portion and each respective third portion, wherein in the first position said retaining member does not engage each respective second portion, and wherein, when said retaining member moves from the first position toward the second position, said retaining member moves radially inwardly toward the second portion.


[System] You are an expert US patent attorney. Draft a set of independent and dependent claims based on the provided invention description. Use correct USPTO formatting.

[User]
Title: Positioning Database Management Applied To Server-Based Positioning System

Technical Field and Background:
A modern wireless device can incorporate functions of a satellite positioning system receiver, a cellular transceiver, or a wireless transceiver. When a wireless device functions as a cellular transceiver and/or a wireless transceiver, the device can communicate wirelessly with a wireless communication network by employing radio frequency (RF) field propagation. The radio frequency, a frequency within the electromagnetic spectrum associated with radio wave propagation, is supplied to an antenna that creates an electromagnetic field that propagates through space. A component of a wireless communication network can be a wireless station, for example, a cellular base station of a cellular network, or an access point of a wireless local area network (LAN) or a wireless personal area network (PAN). The wireless station can allow a wireless device to communicate with a wired network through an access gateway. Oftentimes, the wireless station broadcasts a beacon signal that provides key information for wireless connections with wireless devices.

Invention Disclosure:
Systems and methods are provided for positioning determination for mobile devices. A system includes: a database configured to store positioning data associated with one or more base stations in a network, and a data management component configured to compare the parameters with one or more parameter thresholds, and update the positioning data based at least in part on the comparison of the parameters and the parameter thresholds. The updated positioning data is used for positioning determination of a mobile device.

[Assistant]
1. A method for managing positioning data within a database, the method comprising:
storing positioning data in a database, wherein the positioning data associates, for each location of multiple geographic locations to which a wireless station provides wireless service, a signal strength of a signal received from the wireless station at the respective location;
designating geographic reference points at respective geographic positions; and
iteratively refining the positions by repetitively
(i) grouping the locations into clusters, one cluster for each reference point, based on distances between the locations and the reference points, such that each cluster is a cluster of the geographic locations that are grouped into the cluster based on their distances from the cluster's reference point, and
(ii) calculating, for each cluster, a new geographic position of the reference point of the cluster based on the locations that are in the cluster;
receiving, from a wireless device, a signal strength value of a signal received by the wireless device from the wireless station;
selecting one of the clusters based on the signal strength value received from the wireless device; and
determining a location of the wireless device based on the selected cluster;
wherein iteratively refining the positions includes:
determining inter-reference-point distances between pairs of the reference points;
determine, from among the inter-reference-point distances, a minimum distance and a maximum distance; and
determining to remove one of the reference points based on a comparison between the minimum distance and the maximum distance.

2. The method of claim 1, wherein the iterative refining includes (iii) determining, for each reference point, a distance the reference has been changed by the calculating; and (iv) comparing, for each reference point, the determined distance to a distance threshold.

3. The method of claim 2, wherein operations (i)-(iv) are repeated until the compared distances are all less than the distance threshold.

4. The method of claim 1, wherein the calculating comprises calculating the new position of the reference point of the cluster as an average of the locations that are in the cluster.

5. The method of claim 4, wherein the average is a weighted average.

6. The method of claim 1, wherein each of the locations is identified in the database by coordinates that were determined by and wirelessly communicated by a wireless device that was at the location.

7. The method of claim 1, wherein the wireless service is of a cellular network, and the base station is a cellular base station of a cellular network.

8. The method of claim 1, wherein the wireless service is of a wireless local area network (LAN), and the base station is an access point of the wireless LAN.

9. A positioning management system comprising:
a database configured to store positioning data, wherein the positioning data associates, for each location of multiple geographic locations to which a wireless station provides wireless service, a signal strength of a signal received by the wireless station from the respective location; and
one or more processors configured to
designate geographic reference points at respective positions, and
iteratively refine the positions by repetitively (i) grouping the locations into clusters, one cluster for each reference point, based on distances between the locations and the reference points, such that each cluster is a cluster of the geographic locations that are grouped into the cluster based on their distances from the cluster's reference point, and (ii) calculating, for each cluster, a new position of the reference point of the cluster based on the locations that are in the cluster;
receive, from a wireless device, a signal strength value of a signal received by the wireless device from the wireless station;
select one of the clusters based on the signal strength value received from the wireless device; and
determine a location of the wireless device based on the selected cluster;
wherein iteratively refining the positions includes:
determining inter-reference-point distances between pairs of the reference points;
determine, from among the inter-reference-point distances, a minimum distance and a maximum distance; and
determining to remove one of the reference points based on a comparison between the minimum distance and the maximum distance.

10. The positioning management system of claim 9, wherein the iterative refining performed by the one or more processors further includes (iii) determining, for each reference point, a distance the reference has been changed by the calculating operation; and (iv) comparing, for each reference point, the determined distance to a distance threshold.

11. The positioning management system of claim 10, wherein the one or more processors are configured to repeat operations (i)-(iv) until the compared distances are all less than the distance threshold.

12. The positioning management system of claim 9, wherein the calculating comprises calculating the new position of the reference point of the cluster as an average of the locations that are in the cluster.

13. The positioning management system of claim 12, wherein the average is a weighted average.

14. The positioning management system of claim 9, wherein the database is configured to store each of the locations in terms of coordinates determined by, and wirelessly communicated by, a wireless device that was at the location.

15. The positioning management system of claim 9, wherein the wireless service is of a cellular network, and the base station is a base station of the cellular network.

16. The positioning management system of claim 9, wherein the wireless service is of a wireless local area network (LAN), and the base station is an access point of the wireless LAN.


[System] You are an expert US patent attorney. Draft a set of independent and dependent claims based on the provided invention description. Use correct USPTO formatting.

[User]
Title: Power Transmission Device For Vehicle

Technical Field and Background:
Patent Literatures 1, 2 and 3 identified below disclose torque-distribution type power transmission devices in four-wheel drive vehicles. More specifically, Patent Literature 1 discloses that a clutch for connecting and disconnecting drive power transmission is provided between a center drive shaft for transmitting rotary motion of a drive source (engine) to rear wheels and a differential unit for the rear wheels, and that switching is made between two-wheel drive and four-wheel drive through connection and disconnection, by the clutch, of the drive power transmission. Further, Patent Literatures 2 and 3 disclose that clutches are provided in corresponding relation to left and right wheels in a differential unit for the rear wheels, and that drive power is distributed to the left and right wheels through connection and disconnection, by the individual clutches, of the drive power transmission. If abnormality, such as galling or a spike (i.e., sharp rise) in clutch-pressing hydraulic pressure, has occurred in any of the clutches taking part in drive power distribution between the front and rear wheels in such a four-wheel drive vehicle, the front wheels and the rear wheels would be undesirably interconnected directly (namely, undesired drive force would be transmitted to both or either of the left and right wheels by the clutch being locked in an ON or engaged state), so that torque may undesirably increase sharply. In such a situation, cases and gears may get broken, and oil leakage, fire, etc. may occur. As a fail-safe function to obviate such risks, it has been conventional to provide a torque fuse (i.e., most torsionally-frangible portion or fracturing portion for emergency) in a suitable portion of a power transmission shaft. Namely, the most torsionally-frangible portion or fracturing portion for emergency in the form of a notch (recess) or the like is formed in the suitable portion of the power transmission shaft, so that, when torque exceeding a predetermined critical value has been applied to the power transmission shaft, the power transmission shaft is broken or fractured at the notch (recess) so as to free the rotation of the shaft. Such a portion (i.e., most torsionally-frangible portion or fracturing portion for emergency), formed in the power transmission shaft in such a manner that it has a reduced strength as a design approach and thus can be fractured when torque exceeding an acceptable range has been applied, is called a torque fuse. With the conventionally-known technique, however, the torque fuse is provided in a desired portion without appropriate consideration being made about the position where the torque fuse should be provided. Particularly, with the conventionally-known technique, such a torque fuse is not provided in a shaft portion that is to be connected with a rotation member (e.g., input-side rotation member) of the clutch; that is, it has been common to form the torque fuse in a shaft portion avoiding the connecting portion with the clutch. But, if the conventional torque-fuse-formed portion is disconnected or severed, the axis of the rotation member of the clutch would get misaligned, so that the clutch may irregularly whirling (move around violently) to prevent stable self-propelled rotation.

Invention Disclosure:
In a power transmission device for a vehicle, a boss portion of a clutch guide, which is an input-side rotation member of a clutch unit, includes: a spline portion spline-connected to a small-diameter portion at one end of a center shaft which is an input shaft; and a fitting portion that extends further from the spline portion in an axial direction to contact the outer circumference of a medium-diameter portion of the center shaft. A recess functioning as a torque fuse is formed in the medium-diameter portion of the center shaft corresponding to the fitting portion. When the center shaft is severed or disconnected at the recess, the medium-diameter portion of the severed cut center shaft can still remain within the fitting portion, so that appropriate centering can be secured and stable self-propulsion of the vehicle can be secured without unwanted misalignment of the axis of rotation of the clutch.

[Assistant]
1. A power transmission apparatus for a vehicle, comprising:
an input shaft to which is transmitted rotary motion from a drive source;
a clutch for transmitting rotary motion of the input shaft by disconnectably connecting drive power transmission; and
an output shaft connected to the clutch,
characterized in that the input shaft is spline-connected at one end thereof to an input-side rotation member of the clutch for rotating together with the input-side rotation member of the clutch,
in that the input-side rotation member of the clutch includes a boss portion that includes a spline portion spline-connected to the one end of the input shaft, and a fitting portion extending further from the spline portion in an axial direction into contact with an outer periphery of the input shaft, and
in that a portion of the input shaft that corresponds to the fitting portion has a recess formed therein for functioning as a torque fuse.

2. The power transmission apparatus for a vehicle as claimed in claim 1, which is a differential mechanism for distributing rotation of a drive shaft, to which is transmitted the rotary motion from the drive source, to left and right wheels, and
wherein the differential mechanism includes: a driving bevel gear rotatable integrally with the drive shaft; a driven bevel gear meshing with the driving bevel gear; a center shaft extending in a direction intersecting the drive shaft and rotatable integrally with the driven bevel gear; left and right clutch units disposed to left and right of the center shaft; and left and right output shafts for transmitting outputs of the left and right clutch units to the left and right wheels, respectively,
wherein the center shaft includes: a middle large-diameter portion; left and right medium-diameter portions located to left and right of the large-diameter portion; and left- and right-end small-diameter portions adjoining the left and right medium-diameter portions, the driven bevel gear being fixed to the large-diameter portion,
wherein the input shaft is the center shaft, the clutch is the left or right clutch unit, and the output shaft is the left or right output shaft,
wherein the boss portion of the input-side rotation member of the clutch is spline-connected to the small-diameter portion of the center shaft, and
wherein the recess functioning as the torque fuse is formed in the medium-diameter portion of the center shaft.

3. The power transmission apparatus for a vehicle as claimed in claim 1, wherein the recess functioning as the torque fuse is formed in correspondence with a portion of the fitting portion adjoining the spline portion.

4. The power transmission apparatus for a vehicle as claimed in claim 2, wherein the recess functioning as the torque fuse is formed in correspondence with a portion of the fitting portion adjoining the spline portion.


[System] You are an expert US patent attorney. Draft a set of independent and dependent claims based on the provided invention description. Use correct USPTO formatting.

[User]
Title: Transformable Logic And Routing Structures For Datapath Optimization

Technical Field and Background:
This relates to integrated circuits such as programmable integrated circuits. Programmable integrated circuits such as programmable logic devices (PLDs) are well known in the art. Programmable integrated circuits can be programmed by a user to implement a desired custom logic function. In a typical scenario, a logic designer uses computer-aided design (CAD) tools to design a custom logic circuit. When the design process is complete, the tools generate configuration data. The configuration data is loaded into programmable integrated circuit memory elements to configure the device to perform the functions of the custom logic circuit. In particular, the configuration data configures programmable interconnects, programmable routing circuits, and programmable logic circuits in the programmable integrated circuits. Conventional programmable integrated circuits perform routing with full un-biased connectivity, which assumes no relationship between the input signals. High level Hardware Description Language (HDL) such as OpenCL that can be used to program these integrated circuits can, however, be heavily datapath oriented. Conventional programmable integrated circuit do not take advantage of the regularity in datapath heavy designs. Designs having a high percentage of datapath logic are particularly inefficient when compared to a non-programmable implementation. On the other hand, designs with a low percentage of datapath logic exhibit wasted (unused) resources if the target architecture is designed so as to target the datapath regularity (e.g., arithmetic logic units connected with bus-based routing). It is within this context that the embodiments below arise.

Invention Disclosure:
Integrated circuits such as programmable integrated circuits may include programmable logic regions that can be configured to perform custom user functions. The programmable logic regions may include lookup table (LUT) circuitry driven using vectored multiplexing circuits. The vectored multiplexing circuits may include a first multiplexer stage controlled by common configuration bits, a second multiplexer stage, and means for connecting either outputs of the first multiplexer stage or the output of the second multiplexer stage to corresponding logic circuits. The vectored multiplexing circuits may be used to generate multiple signal variants to vectored lookup table circuitry. The vectored lookup table circuitry may include a first stage of LUTs sharing some number of inputs and a second stage of LUTs at least some of which can be switched out of use. The second stage of LUTs may have inputs that are deactivated in a fractured mode.

[Assistant]
1. An integrated circuit, comprising:
logic circuitry; and
a vectored multiplexing circuit that receives signals from a channel and that includes:
a first output;
a second output;
a third output;
a first multiplexing stage; and
a second multiplexing stage that is coupled in series with the first multiplexing stage and that drives the third output, wherein the first and second multiplexing stages are configured to simultaneously route to the logic circuitry a first partition of the channel via the first output and a second partition of the channel that is different than the first partition via the second output, and wherein the first and second multiplexing stages are further configured to route third and fourth partitions of the channel to the logic circuitry.

2. The integrated circuit of claim 1, further comprising:
memory elements that store configuration bits that are shared among each multiplexer in the first multiplexing stage.

3. The integrated circuit of claim 1, further comprising:
memory elements that store configuration bits that separately control respective multiplexers in the first multiplexing stage.

4. The integrated circuit of claim 1, wherein the second multiplexing stage includes only one multiplexer.

5. The integrated circuit of claim 1, wherein the second multiplexing stage includes two multiplexers.

6. The integrated circuit of claim 1, wherein the second multiplexing stage includes four multiplexers.

7. The integrated circuit of claim 1, wherein the logic circuitry comprises lookup table circuitry that receives the first and second partitions of the channel from the vectored multiplexing circuit.

8. An integrated circuit, comprising:
driver circuitry that generates an input signal of first and second variants; and
vectored lookup table circuitry that includes:
a first lookup table (LUT) stage; and
a second lookup table (LUT) stage connected in series with the first LUT stage, wherein the first LUT stage receives the input signal of the first and second variants from the driver circuitry in parallel.

9. The integrated circuit of claim 8, wherein the driver circuitry comprises a vectored multiplexing circuit that receives signals from a channel and that outputs a first channel partition that represents the first variant of the input signal and a second channel partition that represents the second variant of the input signal.

10. The integrated circuit of claim 8, wherein the first LUT stage includes lookup tables each having a first number of inputs, and wherein the second LUT stage includes lookup tables each having a second number of inputs that is greater than the first number of inputs.

11. The integrated circuit of claim 8, further comprising:
a plurality of memory elements that provides a first set of configuration data bits to the first LUT stage, wherein the first LUT stage provides a second set of configuration data bits to the second LUT stage.

12. The integrated circuit of claim 8, wherein the second LUT stage comprises:
a first LUT circuit;
a second LUT circuit;
a first multiplexer that selectively passes a ground voltage to the first LUT circuit; and
a second multiplexer that selectively passes the ground voltage to the second LUT circuit.

13. The integrated circuit of claim 8, wherein lookup table circuits in the first LUT stage share input signals.

14. The integrated circuit of claim 8, wherein lookup table circuits in the second LUT stage share input signals.

15. An integrated circuit, comprising:
a vectored multiplexer that receives signals from a channel and that simultaneously outputs a first channel partition and a second channel partition that is different than the first channel partition; and
vectored lookup table circuitry that receives the first channel partition and the second channel partition from the vectored multiplexer and that is operable in a first mode that is a function of a first number of user inputs and a second mode that is a function of a second number of user inputs that is different than the first number of user inputs.

16. The integrated circuit of claim 15, wherein the vectored multiplexer includes a first multiplexer stage and a second multiplexer stage coupled to an output of the first multiplexer stage.

17. The integrated circuit of claim 16, wherein the second multiplexer stages includes at least two multiplexers.

18. The integrated circuit of claim 15, wherein the vectored lookup table circuitry includes a first lookup table (LUT) stage and a second lookup table (LUT) stage coupled to an output of the first LUT stage.

19. The integrated circuit of claim 18, wherein the second LUT stage includes lookup tables that are selectively switched out of use.


[System] You are an expert US patent attorney. Draft a set of independent and dependent claims based on the provided invention description. Use correct USPTO formatting.

[User]
Title: Method For Controlling A Bluetooth Connection

Technical Field and Background:
Since a phone call while driving may distract the driver, in order to prevent this, a hands-free phone call has been widely used for enabling the driver to concentrate on driving without the use of hands. Early hands-free device is wired and mounted on a mobile phone holder, but in recent years, a product, in which Bluetooth technology is applied and thus the phone call is possible even while leaving the mobile phone in a bag or pocket, has gained popularity. Bluetooth is the technology according to a specification of the IEEE 802.15.1 short-range wireless communication technology, and it allows electronic devices such as a wireless terminal located within about 10 m, for example, a computer, a cell phone, a headset, a PDA, a printer, a mouse, a keyboard and the like to wirelessly communicate with each other in low cost and low power. General Bluetooth hands-free devices output an audio signal transmitted from a paired mobile phone or MP 3 player through a speaker provided in a vehicle, and transmit the user's voice signal inputted through a microphone provided in a vehicle to the mobile phone when a call function of the mobile phone is used. Conventional Bluetooth specification was defined so that a Bluetooth device connects when a request for the connection is received and disconnects when a request for releasing the connection. On the basis of this specification, most of the Bluetooth connectivity is maintained in the disconnected state when it is disconnected due to an error of one of devices and there is a problem which it is not reconnected. Also, in the process of applying Bluetooth technology to a vehicle, the problem of being disconnected and not being reconnected occurs frequently and this problem causes customer dissatisfaction.

Invention Disclosure:
A method for controlling a Bluetooth connection includes turning off an ignition of a vehicle. It is determined whether a terminal connected to a Bluetooth system provided in the vehicle exists or not. When it is determined that the connected terminal exists as a result of determining, a disconnection command for the Bluetooth connection is transmitted from the vehicle to the terminal. The Bluetooth system waits for a time predetermined by the Bluetooth system, after transmitting the disconnection command. After waiting for the predetermined time, it is determined whether a disconnection confirmation message responding to the disconnection command is received from the terminal or not. When it is determined that the disconnection message is received as a result of determining whether the disconnection message is received or not, the Bluetooth system is caused to enter into a sleep mode.

[Assistant]
1. A method for controlling a Bluetooth connection comprising, steps of:
turning off an ignition of a vehicle;
determining whether a terminal connected to a Bluetooth system provided in the vehicle exists or not after turning off the ignition of the vehicle;
when it is determined that the connected terminal exists as a result of determining, transmitting a disconnection command for the Bluetooth connection from the vehicle to the terminal;
waiting for a time predetermined by the Bluetooth system, after transmitting the disconnection command;
after waiting for the predetermined time, determining whether a disconnection confirmation message responding to the disconnection command is received from the terminal or not; and
when it is determined that the disconnection confirmation message is received as a result of determining whether the disconnection message is received or not, causing the Bluetooth system to enter into a sleep mode.

2. A method for controlling a Bluetooth connection according to claim 1, further comprising the step of returning to the step of transmitting the disconnection message, when it is determined that the disconnection message is not received as a result of determining whether the disconnection message is received or not.

3. A method for controlling a Bluetooth connection according to claim 1, wherein the predetermined time is a time to shut down a controller area network (CAN) provided in the vehicle.

4. A method for controlling a Bluetooth connection according to claim 1, wherein the predetermined time is a time for the Bluetooth system to store information on the Bluetooth connection in a memory.

5. A method for controlling a Bluetooth connection comprising, steps of:
turning off an ignition of a vehicle;
determining whether a terminal connected to a Bluetooth system provided in the vehicle exists or not;
when it is determined that the connected terminal exists as a result of determining, transmitting a disconnection command for the Bluetooth connection from the vehicle to the terminal after turning off an ignition of a vehicle;
waiting for a time predetermined by the Bluetooth system, after transmitting the disconnection command;
after waiting for the predetermined time, determining whether a disconnection confirmation message responding to the disconnection command is received from the terminal or not; and
when it is determined that the disconnection confirmation message is received as a result of determining whether the disconnection message is received or not, causing the Bluetooth system to enter into a sleep mode.


[System] You are an expert US patent attorney. Draft a set of independent and dependent claims based on the provided invention description. Use correct USPTO formatting.

[User]
Title: Image Sensor And Method For Manufacturing Same

Technical Field and Background:
Conventionally, X-rays for medical or industrial applications have been typically taken using films and screens. In this case, the use of resources and time becomes inefficient due to problems related to the development and storage of the taken films. Hence, digital-type image sensors are currently widely used. Such image sensors are classified into indirect conversion-type image sensors and direct conversion-type image sensors. Indirect conversion-type image sensors function such that X-rays are converted into visible light using a scintillator, after which the visible light is converted into an electrical signal. By comparison, direct conversion-type image sensors function such that X-rays are directly converted into an electrical signal using a photoconductive layer. Direct conversion-type image sensors are suitable for use in high-resolution systems because there is no need for an additional scintillator and the spreading of light does not occur. The photoconductive layer used in the direct conversion-type image sensor is formed using a variety of materials. Recently, the photoconductive layer has been made from a semiconductor material having high atomic weight, such as CdTe, CdZnTe, PbO, PbI 2 , HgI 2 , GaAs, Se, TlBr, and BiI 3 . However, such a photoconductive layer exhibits poor adhesion to aluminum or copper (Cu), which may be used in a front electrode, undesirably causing the photoconductive layer to come loose.

Invention Disclosure:
Disclosed is an image sensor, which is characterized by increased strength of adhesion between a photoconductive layer and a front electrode made of aluminum, and which includes a first electrode composed of aluminum, copper or an aluminum-copper alloy on a substrate, a buffer layer formed on the first electrode, a photoconductive layer formed on the buffer layer, and a second electrode formed on the photoconductive layer, wherein the buffer layer includes a material having higher strength of adhesion than the photoconductive layer to the first electrode.

[Assistant]
1. An image sensor, comprising:
a protective layer formed on a substrate and having at least one hole;
a first electrode formed in the at least one hole of the protective layer and comprising aluminum, copper or an aluminum-copper alloy on a substrate;
a buffer layer formed on the protective layer and the first electrode;
a photoconductive layer formed on the buffer layer; and
a second electrode formed on the photoconductive layer,
wherein the buffer layer comprises CdS or ZnTe and adheres the first electrode and the photoconductive layer.

2. The image sensor of claim 1, wherein the photoconductive layer comprises CdTe, CdZnTe, PbO, PbI 2, HgI 2, GaAs, Se, TlBr or BiI 3.

3. The image sensor of claim 1, wherein the buffer layer has a thickness of 1 to 5 μm.

4. The image sensor of claim 1, wherein the buffer layer is formed on at least a portion of a plurality of pixel regions for the image sensor.

5. The image sensor of claim 1, wherein the image sensor is an image sensor for detecting X-rays.

6. A method of manufacturing an image sensor, comprising:
forming a protectively layer having at least one hole on a substrate;
forming a first electrode in the at least one hole of the protective layer and comprising aluminum, copper or an aluminum-copper alloy on a substrate;
forming a buffer layer on the protective layer and the first electrode;
forming a photoconductive layer on the buffer layer; and
forming a second electrode on the photoconductive layer,
wherein the buffer layer comprises-CdS or ZnTe and adheres the first electrode and the photoconductive layer.

7. The method of claim 6, wherein the photoconductive layer comprises CdTe, CdZnTe, PbO, PbI 2, HgI 2, GaAs, Se, TlBr or BiI 3.

8. The method of claim 6, wherein the buffer layer has a thickness of 1 to 5 μm.

9. The method of claim 6, wherein the buffer layer is formed on at least a portion of a plurality of pixel regions for the image sensor.

10. The method of claim 6, wherein the image sensor is an image sensor for detecting X-rays.


[System] You are an expert US patent attorney. Draft a set of independent and dependent claims based on the provided invention description. Use correct USPTO formatting.

[User]
Title: Cable Mounting Bracket Apparatus And System

Technical Field and Background:
Historically, equipment from communication and electrical installations including; coaxial cables, conduit, wires, and other components which vertically traverse elevated structures have been fastened directly to worker access structures including; ladders, ladder cages, and hand rails. These structures have provided an immediate solution for equipment fastening. However, this type of installation has historically presented unsafe working conditions for the workers by obstructing and encumbering movement and rescue throughout access areas. Additionally, these installations may cause maintenance and/or structural damage when installed on areas which lack initial design and structural capability. Aside from fastening communication devices onto the aforementioned areas, a traditionally more acceptable installation includes welding or banding of communication brackets and raceways along the length of vertical steel. Many of these installations, however, have historically been of high cost and are associated with additional safety, structural, and maintenance issues. The United States Occupational Safety and Health Administration's (OSHA) current regulations stipulate against specific obstructive encumbrances upon or within worker or rescuer access areas. Other national U.S. and state agencies also provide regulatory and design stipulations further prohibiting obstructions into and within these areas. More specifically, traditional fastening of communication and electrical equipment onto areas such as ladders encumber the fluid motion of the workers' hands when grasping and transitioning along the side-rails. Fastening devices such as clamps and bolted connections commonly encumber foot placement on rungs and further create abrasion risks for the worker or rescuer. Many coaxial cables used in the telecommunication industry emit radio-frequency waves. When workers and rescuers are subjected to these close-proximity coaxial cable installations they face exposure to radio-frequency waves which are known to cause bodily harm. Elevated steel structures and associated access structures are commonly coated with expensive corrosion resistant high performance materials in order to limit corrosion through environmental exposure to the steel. Many of these materials need to be maintained according to industry standards derived from the Society for Protective Coatings, the National Association of Corrosion Engineers, and the American Water Works Association. When scheduled for routine maintenance and renovation work, many of the aforementioned traditional fastening methods are difficult to temporarily move off of or away from the steel. In some cases coordination of a temporary removal of the communication equipment may allow for a non-obstructed steel structure during its time of maintenance. Many of these cables and antennae are temporarily re-erected onto a Cell-On-Wheels (C.O.W.) which is usually an expensive and logistically difficult scenario. Due to the cost of the telecommunication equipment and ownership, many steel structure maintenance providers are prohibited from removing or repositioning such equipment. It is common for this telecommunication equipment to remain fastened to the coated steel surface, presenting a surface preparation and coating obstruction. This, in turn, causes the obstructed steel areas to not receive the proper corrosion repair and application of coatings. Furthermore, many installations induce abrasion and corrosion to the steel structure through cyclic abrasive action between coatings and fastening connections and by increasing the moisture content below and adjacent to the fastening area. A traditional method of fastening communications equipment away from access areas includes weld-fastening coated steel stand-off brackets in series along the structural steel body. The cables can then be secured to these firmly welded “stand-off” brackets. Welding steel brackets onto the structure, especially an existing structure, is usually expensive, time intensive, requires specialized equipment and certification. In the case of weld-fasting onto a coated steel structures, the installation procedure must include abrasive removal of the coatings and steel in the areas of welding. This creates a breach in the homogenous corrosion resistance application to the steel which may cause accelerated corrosion if left improperly repair coated.

Invention Disclosure:
A bracket and a cable mounting system which includes a bracket with a center panel or channel and with magnetic pads located on the distal ends of the center panel or channel so that the bracket may be attached to a structure by magnetic attraction. The cable mounting system may also consist of two brackets set a distance apart and a support rail placed in between and coupled to the brackets.

[Assistant]
1. A bracket for securing components to a surface of a structure with a radius of curvature, the bracket comprising;
a center connecting member with first and second ends;
at least two separate leg elements detachably secured to and extending outwardly and downwardly from the first and second ends of the connecting member and terminating at a distal end wherein a curvature of the distal end of the at least two leg elements is matched to a radius of curvature of the structure to which the bracket is to be secured;
at least one hole in the center connecting member for securing a component to the bracket; and
at least one magnetic pad secured to each distal end of the at least two leg elements, wherein due to the curvature of the at least two leg elements a surficial contact of each magnetic pad with the surface of the structure is maximized and the bracket has an aspect ratio of at least 10%.

2. The bracket of claim 1, wherein the at least two leg elements comprise a total of four legs.

3. The bracket of claim 1, wherein the magnetic pads comprise a magnet with a contact surface fitted into a socket.

4. The bracket of claim 1, wherein there is at least one hole in each of the at least two leg elements for securing components to the bracket.

5. The bracket of claim 1, wherein the components mounted to the bracket and secured to the structure are conduits and cables.

6. The bracket of claim 1, wherein the components are secured to the bracket using clamps.

7. A bracket for securing components to a surface of a structure, the bracket comprising;
a center panel with first and second ends and a mid-line about which the center panel is symmetrically bent, the angle of the bend is in the range of from about 5 to 45degrees relative to a flat center panel and the center panel includes at least one through hole;
at least one leg element extending outwardly from each of the first and second ends of the center panel;
a mounting member rotatably secured by a hinge to each of the at least one leg elements, wherein the mounting member is capable of a range of rotation about the at least one leg element of approximately 180 degrees; and
at least one magnetic element detachably secured to the mounting member, wherein the magnetic element maintains contact with the surface of the structure.

8. A bracket for securing components to a surface of a structure, the bracket comprising;
a channel member further comprising first and second longitudinally opposed ends, a floor and opposed side walls separated by the floor;
at least one leg element outwardly extending from the channel member and detachably secured to the channel member floor and proximate to each of the first and second ends of the channel member, wherein an angle of departure of the at least one leg element extending outwardly from the channel member is determined by the surface of the structure; and
at least one magnetic element detachably secured to each of the at least one leg elements, wherein the magnetic element maintains contact with the surface of the structure.

9. The bracket of claim 8, wherein the channel member side walls further comprise upper wall edges opposite a union of the opposed side walls with the channel floor.

10. The bracket of claim 8, wherein the upper wall edges are arcuately bent downward to facilitate engagement with clips for securing components to the bracket.

11. The bracket of claim 8, wherein the components are conduits and cables.

12. The bracket of claim 8, wherein the floor of the channel member has at least one through hole.

13. The bracket of claim 8, wherein the at least one leg element proximate to each of the first and second ends of the channel member is capable of being bent at an angle to increase contact between the at least one magnetic element, secured to each of the at least one leg elements, and the surface of the structure.

14. A system for securing at least one cable to a surface of a structure, the structure having a radius of curvature, the system comprising;
first and second brackets separated by a distance, the first and second brackets comprising:
a center connecting member with first and second ends;
at least two separate leg elements detachably secured to and extending outwardly and downwardly from the first and second ends of the center connecting member and terminating at a distal end wherein a curvature of the distal end of the at least two leg elements is matched to the radius of curvature of the structure;
at least one hole in the center connecting member for securing a component to the bracket; and
at least one hole in the distal end of each of the at least two leg elements for securing the bracket to the structure, wherein due to alignment of the curvature of the distal end of the at least two legs with the curvature of the structure a surficial contact of the distal end of the at least two legs with the structure is maximized;
at least one support rail with first and second ends wherein the support rail is curved to arc away from the structure and is secured through sockets attached to and underneath the center connecting member of the bracket, the first end of the support rail secured to the first bracket and the second end of the support rail secured to the second bracket; and
a cable secured to the rail and the first and second brackets.


[System] You are an expert US patent attorney. Draft a set of independent and dependent claims based on the provided invention description. Use correct USPTO formatting.

[User]
Title: Electro-Mechanical Brake For Increasing Braking Force

Technical Field and Background:
1. Field of the Invention The present invention relates to an electro-mechanical brake, and more particularly, to an electro-mechanical brake for increasing a braking force capable of achieving a stable driving by increasing the braking force. 2. Discussion of Related Art A brake for decreasing a speed is provided in a vehicle. In this case, a conventional brake is generally operated hydraulically. That is, the conventional brake amplifies a force depressing a pedal by hydraulic booster, converts this amplified force into a fluid-pressure, operates a piston by transferring the converted fluid-pressure to a cylinder, and pressurizes a disk rotating together with a wheel through a pad disposed in the front end of the piston. The conventional hydraulic brake has a function of decreasing a speed of a vehicle, but there is a problem that the manufacturing and management are inconvenient since it is constructed by a lot of components. Further, the conventional hydraulic brake has a problem that a braking distance becomes great since a braking response is relatively slow. For these reasons, an electro-mechanical brake has been proposed recently. Since the pressurization of the disk through the pad is performed by a driving of a motor, the electro-mechanical brake may have a simple structure and increase the braking response compared with the conventional hydraulic brake. However, since the conventional electro-mechanical brake pressurizes only an inner surface and an outer surface of the disk through an inner pad and an outer pad, there are problems in which a pressurization force is limited and the braking force and braking torque falls short of expectations In order to solve the problems, a method of increasing a capacity of a motor is being used, but in a large capacity of motor, there are problems such as limitations of installation and a burden of a cost since its size is great and its cost is expensive. In order to solve the problems, development of an electro-mechanical brake capable of increasing the braking force without increasing the capacity of the motor has been tried, but is in a situation in which a satisfactory result has not yet been obtained.

Invention Disclosure:
An electro-mechanical brake for increasing a braking force is provided. The electro-mechanical brake for increasing the braking force according to an embodiment of the present invention may include the upper pad together with the inner pad and the outer pad, the inner pad may pressurize the inner side surface of the disk by the movement of the moving block by the rotation of the screw, the outer pad may pressurize the outer side surface of the disk, the upper pad may also pressurize the cylindrical surface of the upper end of the disk, and thus the braking force may be increased since the additional braking force can be further generated by pressurizing the cylindrical surface of the upper end of the disk compared with a case of pressurizing the inner side surface and the outer side surface of the disk.

[Assistant]
1. An electro-mechanical brake for increasing a braking force, comprising:
a disk rotating together with a wheel of a vehicle, and including a first side surface (inner side surface), a second side surface (outer side surface), and a circumference surface;
a carrier coupled to a vehicle frame, and configured to accommodate an upper end portion of the disk, and including a pair of parallel side plates, each of said parallel side plates being provided with a sliding guide formed in the side plates;
a column installed to be movable along with the sliding guide, and including a screw rotating according to a driving of a motor inside;
a caliper coupled with the carrier, and configured to move by a contact with the column;
a moving block to be screwed by the screw, and moving in front and rear directions on the screw according to a rotation of the screw;
an inner pad configured to pressurize the inner side surface of the disk by moving to the inner side surface of the disk by the movement of the moving block;
an outer pad configured to pressurize the outer side surface of the disk by moving to the outer side surface of the disk by the movement of the moving block; and
an upper pad configured to pressurize the circumference surface of the disk by moving to the upper end of the disk by the movement of the moving block.

2. The electro-mechanical brake of claim 1, wherein the carrier comprises a moving member which is movable in a horizontal direction on a bottom surface of a rear end.

3. The electro-mechanical brake of claim 2, wherein the moving member is arranged in a rail formed in the bottom surface of the rear end of the carrier.

4. The electro-mechanical brake of claim 1, wherein the caliper comprises a first groove portion in which inclined surfaces are formed on both sides on an upper surface of an inner side adjacent to the upper pad.

5. The electro-mechanical brake of claim 1, wherein the column comprises a second groove portion in which inclined surfaces are formed on both sides on a front end adjacent to the inner pad.

6. The electro-mechanical brake of claim 1, wherein the column comprises a contact member moving by the movement of the moving block in a rear end.

7. The electro-mechanical brake of claim 6, wherein the contact member comprises a first arm extending to the moving block.

8. The electro-mechanical brake of claim 6, wherein the contact member includes both inner side surfaces formed to be apart from both side surfaces of the moving member included in the carrier, respectively, and both outer side surfaces formed to be apart from both inner side surfaces of the column, respectively.

9. The electro-mechanical brake of claim 1, wherein the inner pad is arranged in front of the column in a state to be apart from the inner side surface of the disk.

10. The electro-mechanical brake of claim 1, wherein the inner pad comprises a first protruding part, on which an inclined surface to contact with an inclined portion of a second groove portion formed in the column, is formed on a rear end.

11. The electro-mechanical brake of claim 1, wherein the inner pad comprises a second arm extending to the moving block.

12. The electro-mechanical brake of claim 11, wherein the second arm is formed in multi-stage.

13. The electro-mechanical brake of claim 1, wherein the outer pad is arranged in a front end of the carrier in a state to be apart from the outer side surface of the disk.

14. The electro-mechanical brake of claim 1, wherein the upper pad is arranged in a state to be apart from the cylindrical surface of the upper end of the disk.

15. The electro-mechanical brake of claim 1, wherein the upper pad comprises a second protruding part, on which an inclined surface to contact with an inclined surface of a first groove portion formed in the caliper, is formed on an upper end.

16. The electro-mechanical brake of claim 15, wherein the second protruding part is coupled to the moving member included in the carrier through a connection bar.


[System] You are an expert US patent attorney. Draft a set of independent and dependent claims based on the provided invention description. Use correct USPTO formatting.

[User]
Title: Liquid Crystal Display Panel, Array Substrate And Manufacturing Method For The Same

Technical Field and Background:
1. Field of the Invention The present invention relates to a liquid crystal display field, and more particularly to an array substrate, a manufacturing method for the same and a liquid crystal display panel having the array substrate. 2. Description of Related Art In a pixel structure of an array substrate as shown in FIG. 1 , a pixel electrode layer 11 requires to be electrically connected with a metal layer M of a TFT (Thin Film Transistor) through a contact hole (via) 13 formed in the passivation layer 12 . However, a thickness of the pixel electrode layer 11 is 40-60 nanometers and a thickness of the passivation layer 12 is 1.5-3 micrometers and an opening of the contact hole 13 is smaller such that the film- breaking probability of the pixel electrode layer 11 formed in the contact hole 13 is larger or a thickness of the pixel electrode layer 11 formed in the contact hole 13 is smaller. Therefore, a resistance value of the pixel electrode layer 11 at the contact hole portion 13 is higher so as to affect the display quality. In order to improve this problem, the conventional art provides a pixel structure as shown in FIG. 2 , a floating electrode layer 14 is added in the contact hole 13 , and the pixel electrode layer 11 is electrically connected to the TFT metal layer M through the bridging of the floating electrode layer 14 in order to decrease the resistance value and the film-breaking probability of the pixel electrode layer 11 at the contact hole 13 . However, in order to avoid a short circuit of the floating electrode layer 14 and a common electrode layer 15 , an edge distance between the common electrode layer 15 and the floating electrode layer 14 should be increased. Therefore, a size of the black matrix (BM) layer 16 is increased so as to decrease aperture ratio of the pixel.

Invention Disclosure:
The present invention provides an array substrate, and adds a floating electrode layer in a contact hole for realizing an electrical connection between a metal layer of a TFT and a pixel electrode layer such that the pixel electrode layer is electrically connected to the metal layer through a bridging of the floating layer so as to decrease a resistance value and decrease the film-breaking probability of the pixel electrode layer in the contact hole. Besides, an edge of the floating electrode layer is located in the contact hole so as to reduce a size of a black matrix, increase a pixel aperture ratio. The present invention also provides a method for manufacturing the array substrate and a liquid crystal display panel having the array substrate.

[Assistant]
1. An array substrate comprising:
a substrate;
a metal layer formed on the substrate;
a first passivation layer located on the metal layer, and the first passivation layer is provided with a first contact hole revealing a surface of the metal layer;
a floating electrode layer completely located in the first contact hole, and covering and directly contacted with a bottom surface of the first contact hole and one portion of side walls of the first contact hole connected with the bottom surface;
a common electrode layer disposed on the first passivation layer and located at a periphery of the first contact hole;
a second passivation layer located on the common electrode and the first passivation layer uncovered by the common electrode, and the second passivation layer is provided with a second contact hole which reveals a surface of the floating electrode layer; and
a pixel electrode layer located on the second passivation layer and inside the first contact hole and the second contact hole such that the pixel electrode layer is electrically connected to the metal layer through the first contact hole and the second contact hole;
wherein the pixel electrode layer is directly contacted with the other portion of the side walls of the first contact hole connected with the bottom surface.

2. The array substrate according to claim 1, wherein, the metal layer is one of a source electrode and a drain electrode of a thin film transistor of the array substrate.

3. The array substrate according to claim 1, wherein, the floating electrode layer and the common electrode layer are formed through a same mask process.

4. A liquid crystal display panel, comprising an array substrate and a color filter substrate disposed oppositely to and disposed separately with the array substrate, and the array substrate comprising:
a substrate;
a metal layer formed on the substrate;
a first passivation layer located on the metal layer, and the first passivation layer is provided with a first contact hole revealing a surface of the metal layer;
a floating electrode layer completely located in the first contact hole, and covering and directly contacted with a bottom surface of the first contact hole and one portion of side walls of the first contact hole connected with the bottom surface;
a common electrode layer disposed on the first passivation layer and located at a periphery of the first contact hole;
a second passivation layer located on the common electrode and the first passivation layer uncovered by the common electrode, and the second passivation layer is provided with a second contact hole which reveals a surface of the floating electrode layer; and
a pixel electrode layer located on the second passivation layer and inside the first contact hole and the second contact hole such that the pixel electrode layer is electrically connected to the metal layer through the first contact hole and the second contact hole;
wherein the pixel electrode layer is directly contacted with the other portion of the side walls of the first contact hole connected with the bottom surface.

5. The array substrate according to claim 4, wherein, the metal layer is one of a source electrode and a drain electrode of a thin film transistor of the array substrate.

6. The array substrate according to claim 4, wherein, the floating electrode layer and the common electrode layer are formed through a same mask process.

7. The array substrate according to claim 4, wherein, the color filter substrate includes a black matrix layer, and along a direction perpendicular to the array substrate, an edge of the black matrix layer is overlapped with an edge of the metal layer closed to the common electrode layer.

8. A manufacturing method for an array substrate, comprising:
forming a metal layer on a substrate;
forming a first passivation layer on the metal layer, and forming a first contact hole which reveals a surface of the metal layer at the first passivation layer;
forming a floating electrode layer in the first contact hole, and forming a common electrode layer on the first passivation layer, wherein, the floating electrode layer is completely located in the first contact hole, and covers and directly contacts with a bottom surface of the first contact hole and one portion of side walls of the first contact hole connected with the bottom surface, and the common electrode layer is located at a periphery of the first contact hole;
forming a second passivation layer in the first contact hole, on the common electrode layer and on the first passivation layer which is uncovered by the common electrode, and forming a second contact hole on the second passivation layer which reveals a surface of the floating electrode; and
forming a pixel electrode layer on the second passivation layer, in the first contact hole and the second contact hole such that the pixel electrode is electrically connected to the metal layer through the first contact hole and the second contact hole;
wherein the pixel electrode layer is directly contacted with the other portion of the side walls of the first contact hole connected with the bottom surface.

9. The method according to claim 8, wherein, the metal layer is one of a source electrode and a drain electrode of a thin film transistor of the array substrate.

10. The method according to claim 8, wherein, the floating electrode layer and the common electrode layer are formed through a same mask process.


[System] You are an expert US patent attorney. Draft a set of independent and dependent claims based on the provided invention description. Use correct USPTO formatting.

[User]
Title: Memory Device Constructions, Memory Cell Forming Methods, And Semiconductor Construction Forming Methods

Technical Field and Background:
Resistive random access memories may use a material capable of being configured in one of two different resistive states to store information. When configured in one of the resistive states, the material may have a high resistance to electrical current. In contrast, when configured in the other resistive state, the material may have a low resistance to electrical current. The resistive state in which the material is configured may be changed using electrical signals. For example, if the material is in a high-resistance state, the material may be configured to be in a low-resistance state by applying a voltage across the material. The resistive state may be persistent. For example, once configured in a resistive state, the material may stay in the resistive state even if neither a current nor a voltage is applied to the material. Furthermore, the configuration of the material may be repeatedly changed from the high-resistance state to the low-resistance state or from the low-resistance state to the high-resistance state.

Invention Disclosure:
Memory device constructions include a first column line extending parallel to a second column line, the first column line being above the second column line; a row line above the second column line and extending perpendicular to the first column line and the second column line; memory material disposed to be selectively and reversibly configured in one of two or more different resistive states; a first diode configured to conduct a first current between the first column line and the row line via the memory material; and a second diode configured to conduct a second current between the second column line and the row line via the memory material. In some embodiments, the first diode is a Schottky diode having a semiconductor anode and a metal cathode and the second diode is a Schottky diode having a metal anode and a semiconductor cathode.

[Assistant]
1. A method of forming a memory device construction, comprising:
forming a first horizontal column line;
forming a stack of materials above the first column line, the stack of materials comprising a row line over a memory material, the stack of materials having a pair of opposing sidewalls;
forming insulative spacers along the opposing sidewalls of the stack of materials;
forming conductive spacers along the insulative spacers;
forming a second horizontal column line parallel to the first horizontal column line; and
forming a diode configured to conduct a current between the first column line and the row line through the memory material.

2. The method of claim 1 wherein the diode is a first diode and the current is a first current, and further comprising forming a second diode configured to conduct a second current between the second column line and the row line through the memory material.

3. The method of claim 2 wherein the first diode is a Schottky diode comprising a semiconductor anode and a metal cathode.

4. The method of claim 3 wherein the semiconductor anode is elevationally above the memory material.

5. The method of claim 3 wherein the metal cathode extends vertically, a first portion of the metal cathode being elevationally higher than the row line and a second portion of the metal cathode being elevationally lower than the row line.

6. The method of claim 3 wherein the semiconductor anode is elevationally above the row line.

7. The method of claim 2 wherein the second diode is a Schottky diode comprising a semiconductor cathode and a metal anode.

8. The method of claim 7 wherein the memory material is in physical contact with the metal anode and is not in physical contact with the metal cathode.

9. The method of claim 1 wherein each of the spacers comprises an inner insulative spacer and an outer conductive spacer.

10. The method of claim 9 wherein the outer conductive spacer comprises a material selected from a metal material and a doped semiconductive material.

11. The method of claim 1 wherein the second horizontal column line is elevationally above the first horizontal column line.

12. A method of forming a memory cell, comprising:
forming a first electrode and a second electrode;
forming a binary memory material between the first and second electrodes, the binary memory material comprising a binary memory material selected from the group consisting of binary metal oxides, perovskite oxides, colossal magnetoresistives and polymers;
forming a diode between the first and second electrodes,
forming an electrically conductive material between the memory material and the diode, the diode being configured to conduct a first current from the second electrode to the first electrode through via the memory material and the electrically conductive material; and
forming a third electrode, the memory cell being configured to conduct a second current from the third electrode to the second electrode via the electrically conductive material and the memory material.

13. The method of claim 12 wherein the forming the memory material forms the memory material to be in physical contact with one of the first and second electrodes.

14. The method of claim 12 wherein the forming the electrically conductive material forms the electrically conductive material in physical contact with the memory material.

15. The method of claim 12 wherein the forming the diode forms the diode in physical contact with one of the first and second electrodes.

16. The method of claim 12 wherein the electrically conductive material is in physical contact with the diode.

17. The method of claim 12 wherein the memory material is formed in physical contact with a first planar surface of the first electrode and the diode is formed physically contacting a second planar surface of the second electrode, and wherein the first and second planar surfaces are orthogonal relative to one another.


[System] You are an expert US patent attorney. Draft a set of independent and dependent claims based on the provided invention description. Use correct USPTO formatting.

[User]
Title: Channel Steering For Implementing Coexistence Of Multiple Homogeneous Radios

Technical Field and Background:
With the emerging technologies of wireless networks, embedded systems, and the Internet, there is an ever increasing demand for larger network bandwidth and higher network speed from all kinds of electronic devices employed in various settings, from computing and managing data to online shopping and social networking. This is particularly relevant with electronic and digital content having become extensively used in shared, networked environments as compared to traditional stand-alone personal computers and mobile devices. As a result, data traffic, and especially wireless data traffic, has experience an enormous growth. In the meantime, more and more wireless technologies used in these electronic devices occupy the same or similar radio frequency bands (e.g., 2.4 GHz, 3.6 GHz, 5 GHz, or 60 GHz), which can create interference with one another, adversely affecting the network transmission as well as reception of the wireless network circuits onboard the electronic devices. Also, many of these electronic devices are mobile or portable devices which rely on limited power resources to operate, and typically transmitting or receiving data traffic in a noisy environment can have a negative impact on power consumption. Accordingly, it is desirable to provide methods and apparatuses that increase wireless network bandwidth, reduce wireless network interference, and reduce mobile device power consumption.

Invention Disclosure:
Techniques are disclosed for controlling, in a network device, multiple radio circuits operating in a same or similar frequency band and in close physical proximity. In some embodiments, the radio circuits operate on the same network protocol. The network device can include a coexistence controller coupled to the network circuits. According to some embodiments, the network circuits are each assigned a priority, and the coexistence controller can control operations between the network circuits by selectively adjusting one or more transmission operating parameters of a respective network circuit based on a plurality of operating criteria, which include each network circuit's priority. Among other benefits, the embodiments disclosed herein can increase wireless network bandwidth and reduce mobile device power consumption by providing coordination among the radio circuits so that the transmitting and receiving operations are performed in a way that they do not interfere with their respective antennas.

[Assistant]
1. A method for operating a network device having a plurality of wireless network circuits and a coexistence controller coupled to the network circuits, each of the network circuits operating in a same radio frequency band, the method comprising:
upon one or more client devices requesting for association, distributing, by the coexistence controller, the client devices to the network circuits based on one or more operating criteria,
wherein the network circuits are collocated on the network device.

2. The method of claim 1, further comprising:
moving a respective client device connected to a first network circuit to a second network circuit based on the operating criteria.

3. The method of claim 2, further comprising:
coordinating with the respective client in performing the moving using a switch announcement.

4. The method of claim 2, further comprising:
performing the moving when a data traffic workload aggregated from all client devices connected to the first network circuit exceeds or about to exceed a service capacity of the first network circuit.

5. The method of claim 2, further comprising:
performing the moving when an interference on the first network circuit exceeds a threshold.

6. The method of claim 2, further comprising:
performing the moving when a channel condition on the second network circuit becomes better than the first network circuit.

7. The method of claim 2, further comprising:
migrating connection information for the respective client device when the respective client device is moved from the first network circuit to the second network circuit.

8. The method of claim 1, further comprising:
enforcing a selection of the distributing by disallowing a respective client device from associating itself with a non-preferred network circuit.

9. The method of claim 1, further comprising:
temporarily stopping broadcasting a service set identifier for the non-preferred network circuit.

10. The method of claim 1, further comprising:
ignoring a probe request from a respective client device for associating with a non-preferred network circuit.

11. The method of claim 1, further comprising:
ignoring a probe request from a respective client device for associating with a non-preferred network circuit before a predetermined period of time expires;
allowing the respective client device to associate with the non-preferred network circuit after the period of time expires; and
moving the respective client device connected to the non-preferred network circuit to a preferred network circuit.

12. The method of claim 1, wherein the operating criteria include a priority that is assigned to each of the network circuits.

13. The method of claim 1, wherein the operating criteria include how much noise is observed by one or more radios of each network circuit.

14. The method of claim 1, wherein the operating criteria include based on what type of traffic each network circuit is assigned to process.

15. The method of claim 1, wherein the operating criteria include workload that each network circuit has.

16. The method of claim 1, wherein the operating criteria include performance requirement that the client devices request.

17. The method of claim 1, wherein each of the network circuits operates on a different channel.

18. The method of claim 1, wherein the network circuits each include individual media access control (MAC) layer and physical (PHY) layer circuitry.

19. The method of claim 1, wherein the coexistence controller controls each of the network circuits independently.

20. The method of claim 1, further comprising:
coordinating with another plurality of wireless network circuits on a respective client device so that the network circuits on the network device each communicate with a corresponding network circuit on the client using a uniquely designated channel.

21. The method of claim 1, wherein the network circuits include at least two network circuits operating on different channels in a 5 GHz frequency band.

22. The method of claim 2, further comprising:
coordinating with the respective client in performing the moving using a disassociation process.

23. The method of claim 2, further comprising:
coordinating with the respective client in performing the moving using a de-authentication process.