[System] You are an expert US patent attorney. Draft a set of independent and dependent claims based on the provided invention description. Use correct USPTO formatting.

[User]
Title: Detection Of Demapping Errors

Technical Field and Background:
Crosstalk (or inter-channel interference) is a major source of channel impairment for Multiple Input Multiple Output (MIMO) wired communication systems, such as Digital Subscriber Line (DSL) communication systems. As the demand for higher data rates increases, DSL systems are evolving toward higher frequency bands, wherein crosstalk between neighboring transmission lines (that is to say transmission lines that are in close vicinity over part or whole of their length, such as twisted copper pairs in a cable binder) is more pronounced (the higher frequency, the more coupling). Different strategies have been developed to mitigate crosstalk and to maximize effective throughput, reach and line stability. These techniques are gradually evolving from static or dynamic spectral management techniques to multi-user signal coordination (or vectoring). One technique for reducing inter-channel interference is joint signal precoding: the transmit data symbols are jointly passed through a precoder before being transmitted over the respective communication channels. The precoder is such that the concatenation of the precoder and the communication channels results in little or no inter-channel interference at the receivers. A further technique for reducing inter-channel interference is joint signal post-processing: the receive data symbols are jointly passed through a postcoder before being detected. The postcoder is such that the concatenation of the communication channels and the postcoder results in little or no inter-channel interference at the receivers. The choice of the vectoring group, that is to say the set of communication lines, the signals of which are jointly processed, is rather critical for achieving good crosstalk mitigation performances. within a vectoring group, each communication line is considered as a disturber line inducing crosstalk into the other communication lines of the group, and the same communication line is considered as a victim line receiving crosstalk from the other communication lines of the group. Crosstalk from lines that do not belong to the vectoring group is treated as alien noise and is not canceled. Ideally, the vectoring group should match the whole set of communication lines that physically and noticeably interact with each other. Yet, local loop unbundling on account of national regulation policies and/or limited vectoring capabilities may prevent such an exhaustive approach, in which case the vectoring group would include a sub-set only of all the physically interacting lines, thereby yielding limited vectoring gains. Signal vectoring is typically performed within a Distribution Point Unit (DPU), wherein all the data symbols concurrently transmitted over, or received from, all the subscriber lines of the vectoring group are available. For instance, signal vectoring is advantageously performed within a Digital Subscriber Line Access Multiplexer (DSLAM) deployed at a Central office (co) or as a fiber-fed remote unit closer to subscriber premises (street cabinet, pole cabinet, etc). Signal precoding is particularly appropriate for downstream communication (toward customer premises), while signal post-processing is particularly appropriate for upstream communication (from customer premises). Linear signal precoding and post-processing are advantageously implemented by means of matrix products. For instance, a linear precoder performs a matrix-product of a vector of transmit frequency samples with a precoding matrix, the precoding matrix being such that the overall channel matrix is diagonalized, meaning the off-diagonal coefficients of the overall channel, and thus the inter-channel interference, mostly reduce to zero. Practically, and as a first order approximation, the precoder superimposes anti-phase crosstalk pre-compensation signals over the victim line along with the direct signal that destructively interfere at the receiver with the actual crosstalk signals from the respective disturber lines. Similarly, a linear postcoder performs a matrix-product of a vector of received frequency samples with a crosstalk cancellation matrix, the crosstalk cancellation matrix being such that the overall channel matrix is diagonalized too. It is of utmost importance thus to get an accurate estimate of the actual crosstalk channels in order to appropriately initialize or update the precoder or postcoder coefficients.

Invention Disclosure:
At least one crosstalk probing sequence out of a set of orthogonal crosstalk probing sequences is assigned to the at least one respective disturber line for modulation at the given carrier frequency of at least one respective sequence of crosstalk probing symbols, and error samples are successively measured by a receiver coupled to the victim line at the given carrier frequency while the at least one sequence of crosstalk probing symbols are being transmitted over the at least one respective disturber line are fed back for crosstalk estimation. The received error samples are next correlated with at least one unassigned crosstalk probing sequence out of the set of orthogonal crosstalk probing sequences for detection of a demapping error in the received error samples.

[Assistant]
1. A vectoring controller comprising:
a memory having computer readable instructions stored thereon; and
at least one processor configured to execute the computer readable instructions to,
estimate at least one crosstalk coefficient at a given carrier frequency from at least one respective disturber line towards a victim line of a vectoring group,
assign at least one crosstalk probing sequence out of a set of orthogonal crosstalk probing sequences to the at least one respective disturber line for modulation at the given carrier frequency of at least one respective sequence of crosstalk probing symbols,
receive error samples as successively measured by a receiver coupled to the victim line at the given carrier frequency while the at least one sequence of crosstalk probing symbols are being transmitted over the at least one respective disturber line, and
correlate the received error samples with at least one unassigned crosstalk probing sequence out of the set of orthogonal crosstalk probing sequences for detection of a demapping error in the received error samples, the at least one unassigned crosstalk probing sequence being not actively used by any line of the vectoring group during the transmission of the at least one sequence of crosstalk probing symbols over the at least one respective disturber line.

2. A vectoring controller according to claim 1, wherein the vectoring controller is further configured to keep a desired number M of crosstalk probing sequences out of the set of orthogonal crosstalk probing sequences unassigned and available for detection of demapping errors.

3. A vectoring controller according to claim 2, wherein the set of orthogonal crosstalk probing sequences comprises crosstalk probing sequences of length L greater than or equal to N+M, N denoting the size of the vectoring group.

4. A vectoring controller according to claim 1, wherein the vectoring controller is further configured, if a demapping error is detected in the received error samples, to discard the received error samples for estimation of the at least one crosstalk coefficient.

5. A vectoring controller according to claim 1, wherein the vectoring controller is further configured to estimate the at least one crosstalk coefficient using a weighted combination of a new crosstalk estimate based on the received error samples and at least one further crosstalk estimate, and
wherein the weight applied to the new crosstalk estimate is a function of whether a demapping error has been detected in the received error samples.

6. A vectoring controller according to claim 1, wherein the vectoring controller is further configured to estimate the at least one crosstalk coefficient using a weighted combination of a new crosstalk estimate based on the received error samples and at least one further crosstalk estimate,
wherein the vectoring controller is further configured to correlate the received error samples with the at least one unassigned crosstalk probing sequence in order to determine how reliable the new crosstalk estimate is, and
wherein the weight applied to the new crosstalk estimate is a function of the so-determined reliability of the new crosstalk estimate.

7. A vectoring controller according to claim 5, wherein the at least one further crosstalk estimate is a crosstalk estimate obtained during a previous crosstalk estimation cycle.

8. A vectoring controller according to claim 5, wherein the at least one further crosstalk estimate is a crosstalk estimate obtained at a further carrier frequency nearby the given carrier frequency.

9. A vectoring controller according to claim 1, wherein the received error samples are indicative of error vectors between received frequency samples at the given carrier frequency and respective selected constellation points onto which the received frequency samples are demapped.

10. A vectoring controller according to claim 1, wherein the vectoring controller is further configured to use the result of the correlation of the received error samples with the at least one unassigned crosstalk probing sequence in a statistic, and to compare that statistic with a threshold to determine with a certain confidence whether a demapping error is present in the received error samples.

11. A vectoring controller according to claim 10, wherein the threshold value depends on the noise level at the given carrier frequency.

12. A vectoring controller according to claim 10, wherein the statistic is given by
max  { 1 M  ∑ m   u m , 1 M  ∑ m   v m  },
M being a non-null positive integer denoting a given number of unassigned pilot sequences for detection of demapping errors, u m and v m denoting the real and imaginary part respectively of the correlation of the error samples with a given one of the at least one unassigned crosstalk probing sequence.

13. An access node comprising a vectoring controller according to claim 1.

14. An access node according to claim 13, wherein the access node is a Digital Subscriber Line Access Multiplexer DSLAM.

15. A method comprising:
estimating at least one crosstalk coefficient at a given carrier frequency from at least one respective disturber line towards a victim line of a vectoring group,
assigning at least one crosstalk probing sequence out of a set of orthogonal crosstalk probing sequences to the at least one respective disturber line for modulation at the given carrier frequency of at least one respective sequence of crosstalk probing symbols,
receiving error samples as successively measured by a receiver coupled to the victim line at the given carrier frequency while the at least one sequence of crosstalk probing symbols are being transmitted over the at least one respective disturber line, and
correlating the received error samples with at least one unassigned crosstalk probing sequence out of the set of orthogonal crosstalk probing sequences for detection of a demapping error in the received error samples, the at least one unassigned crosstalk probing sequence being not actively used by any line of the vectoring group during the transmission of the at least one sequence of crosstalk probing symbols over the at least one respective disturber line.


[System] You are an expert US patent attorney. Draft a set of independent and dependent claims based on the provided invention description. Use correct USPTO formatting.

[User]
Title: Electric Vehicle Battery Systems With Exchangeable Parallel Electric Vehicle Battery Modules

Technical Field and Background:
Vehicles, such as but not limited to cars, trains, aircraft, and ships, are converting from combustible energy sources such as gasoline to using electric motors powered by batteries. For example, hybrid electric vehicles are now widely available that can use energy derived from a battery as well as another source, such as an internal combustion engine. In addition, full electrically-powered vehicles that use energy derived solely from a battery are also available to consumers. Many of these electric vehicles suffer from differing problems that prevent them from being widely adopted. For example, some electric vehicles have very limited range, which makes the cars less desirable to consumers. One method of increasing range has been a program wherein electric vehicles are designed to have their battery packs rapidly changed out, such as at a service station, much in the way that current consumers fill a tank with gasoline. In addition, replacement or repair of large lithium ion battery backs, such as those disposed within electric vehicles, can be quite expensive and even dangerous. The voltages generated by these battery packs are quite high and not user serviceable.

Invention Disclosure:
Systems and methods for electric vehicle battery systems with replaceable parallel electric vehicle battery modules are described herein. The electric vehicle battery system includes a plurality of electric vehicle battery modules connected in parallel. Each electric vehicle battery module includes a battery. Each electric vehicle battery module can also include a balancing circuit in electrical communication with a current path from the battery to an electric vehicle battery module output node. Each electric vehicle battery module also may have a current sensor in electromagnetic communication with the current path between the battery and the balancing circuit. The current sensor can be configured to sense a current level between the battery and the balancing circuit. The balancing circuit can be configured to balance the current level sensed by the current sensor of each electric vehicle battery module.

[Assistant]
1. An electric vehicle battery system, comprising:
a plurality of electric vehicle battery modules connected in parallel, each electric vehicle battery module comprising:
a battery;
a balancing circuit in electrical communication with a current path from the battery to an electric vehicle battery module output node, wherein the balancing circuit comprises a first pair of complementary switches that are electrically connected in parallel with the battery; and
a current sensor in electromagnetic communication with the current path between the battery and the balancing circuit, the current sensor configured to sense a current level between the battery and the balancing circuit,
wherein the balancing circuit is configured to balance the current level sensed by the current sensor of the electric vehicle battery module,
wherein the balancing circuit is configured to charge the battery when the battery module output node is in electromagnetic communication with a charging source, and
wherein the balancing circuit is configured to discharge the battery when the battery module output node is in electromagnetic communication with a load.

2. The electric vehicle battery system of claim 1, wherein the first pair of complementary switches includes first and second switches that are electrically connected in parallel with one another, the balancing circuit configured to discharge the battery by controlling a pulse width modulation of the first and second switches.

3. The electric vehicle battery system of claim 1, wherein the balancing circuit comprises a second pair of complementary switches that are electrically connected in parallel with the first pair of complementary switches.

4. The electric vehicle battery system of claim 3, wherein the second pair of complementary switches includes first and second switches that are electrically connected in parallel with one another, the balancing circuit configured to charge the battery by controlling a pulse width modulation of the first and second switches.

5. The electric vehicle battery system of claim 3, further comprising a smoothing circuit that is electrically connected in parallel with the first and second pairs of complementary switches.

6. The electric vehicle battery system of claim 5, wherein the smoothing circuit includes an inductor and a capacitor, the inductor electrically connected in parallel with the capacitor.

7. The electric vehicle battery system of claim 5, wherein each electric vehicle battery modules includes an inductor, the inductor electrically connected in series with the first and second pairs of complementary switches.

8. The electric vehicle battery system of claim 7, further comprising a capacitor electrically connected in parallel with the inductor.

9. The electric vehicle battery system of claim 8, wherein the capacitor is electrically connected in parallel to the plurality of electric vehicle battery modules.

10. The electric vehicle battery system of claim 3, further comprising a processor in electrical communication with the first and second pairs of complementary switches and the current sensor.

11. The electric vehicle battery system of claim 10, wherein the processor is configured to control an operation of the first and second pairs of complementary switches based on an output of the current sensor.

12. The electric vehicle battery system of claim 10, wherein the processor is configured to control an operation of the first and second pairs of complementary switches based on whether a disconnection condition has occurred.

13. The electric vehicle battery system of claim 1, wherein the current sensor includes a sense resistor and a comparator.

14. The electric vehicle battery system of claim 13, wherein the sense resistor is electrically connected in series with the battery and the comparator is electrically connected in parallel with the sense resistor, wherein the comparator determines a voltage or a current across the sense resistor.

15. The electric vehicle battery system of claim 1, wherein the balancing circuit is configured to disconnect the battery from the electric vehicle battery module output node when the current level sensed by the current sensor is beyond a threshold.

16. The electric vehicle battery system of claim 1, wherein the balancing circuit is configured to disconnect the battery from the electric vehicle battery module output node when a voltage level of the electric vehicle battery module is above an upper threshold or below a lower threshold.

17. The electric vehicle battery system of claim 1, wherein the balancing circuit is configured to disconnect the battery from the electric vehicle battery module output node when a temperature of the electric vehicle battery module is above an upper threshold or below a lower threshold.


[System] You are an expert US patent attorney. Draft a set of independent and dependent claims based on the provided invention description. Use correct USPTO formatting.

[User]
Title: Organic Light-Emitting Element

Technical Field and Background:
An organic light emitting device injects electrons and holes into an organic material layer from two electrodes to convert a current into a visible ray. The organic light emitting device may have a multilayer structure including two or more organic material layers. For example, the organic light emitting device may further include, in addition to a light emitting layer, if necessary, an electron or hole injection layer, an electron or hole blocking layer, or an electron or hole transport layer. Recently, according to diversification of the purpose of the organic light emitting device, research on materials that can improve performance of the organic light emitting device has been actively conducted.

Invention Disclosure:
The present application describes an organic light emitting device including a first layer, a second layer, and a third layer between a cathode and a light emitting layer or between light emitting units, in which the first layer includes an n-type organic material or metal oxide, the second layer includes a barrier material, and the third layer includes an n-type dopant.

[Assistant]
1. A stacked organic light emitting device comprising:
an anode,
a cathode provided to face the anode, and
two or more light emitting units provided between the anode and the cathode and including a light emitting layer,
wherein the stacked organic light emitting device further includes a first layer, a second layer, and a third layer sequentially provided in a direction from the cathode to the anode between the light emitting units,
the first layer includes an n-type organic material or metal oxide,
the second layer includes a barrier material, and
the third layer includes an n-type dopant,
wherein the light emitting unit coming into contact with the cathode includes the first layer, the second layer, and the third layer sequentially provided in a direction from the cathode to the light emitting layer between the cathode and the light emitting layer.

2. The stacked organic light emitting device of claim 1, wherein the barrier material of the second layer includes one kind or more of an organic-metal complex, a n-type organic material, and a p-type organic material.

3. The stacked organic light emitting device of claim 1, wherein the first layer is an undoped layer.

4. The stacked organic light emitting device of claim 1, wherein the first layer includes 2,3,5,6-tetrafluoro-7,7,8,8-tetracyanoquinodimethane (F4TCNQ), fluorine-substituted 3,4,9,10-perylenetetracarboxylic dianhydride (PTCDA), cyano-substituted PTCDA, naphthalenetetracarboxylic dianhydride (NTCDA), fluorine-substituted NTCDA, cyano-substituted NTCDA, a compound of the following Chemical Formula 1, MoO 3, Re 2 O 3, Al 2 O 3, CuI, WO 3, V 2 O 5, or 5,6,11,12-tetraphenylnaphthacene (rubrene):
in Chemical Formula 1,
R 1 to R 6 are each hydrogen, a halogen atom, nitrile (—CN), nitro (—NO 2 ), sulfonyl (—SO 2 R), sulfoxide (—SOR), sulfonamide (—SO 2 NR), sulfonate (—SO 3 R), trifluoromethyl (—CF 3 ), ester (—COOR), amide (—CONHR or —CONRR′), substituted or unsubstituted straight- or branch-chained C 1 -C 12 alkoxy, substituted or unsubstituted straight- or branch-chained C 1 -C 12 alkyl, substituted or unsubstituted straight- or branch-chained C 2 -C 12 alkenyl, substituted or unsubstituted aromatic or non-aromatic heterocycle, substituted or unsubstituted aryl, substituted or unsubstituted mono- or di-arylamine, or substituted or unsubstituted aralkylamine, and R and R′ are each substituted or unsubstituted C 1 -C 60 alkyl, substituted or unsubstituted aryl, or substituted or unsubstituted 5 to 7-membered heterocycle.

5. The stacked organic light emitting device of claim 1, wherein a doping concentration of the n-type dopant of the third layer is 30 wt % or less.

6. The stacked organic light emitting device of claim 1, wherein a doping concentration of the n-type dopant of the third layer is 10 wt % or less.

7. The stacked organic light emitting device of claim 1, further comprising:
an additional electron transport layer between the third layer and the light emitting layer of the light emitting unit coming into contact with the third layer.

8. The stacked organic light emitting device of claim 1, wherein at least one of the residual light emitting units other than the light emitting unit coming into contact with the anode further includes a p-type organic material layer coming into contact with the first layer.

9. The stacked organic light emitting device of claim 8, wherein a difference between a LUMO energy level of the first layer and a HOMO energy level of the p-type organic material layer is 2 eV or less.

10. The stacked organic light emitting device of claim 1, wherein the light emitting unit coming into contact with the anode further includes a layer of a same material as the first layer as an organic material layer coming into contact with the anode.

11. The organic light emitting device of claim 1, further comprising:
a substrate provided on an opposite surface of a surface of the cathode or the anode, on which the organic material layer is provided, and
a light extraction layer provided between the cathode or the anode and the substrate.

12. The organic light emitting device of claim 1, further comprising:
a substrate provided on an opposite surface of a surface of the cathode or the anode, on which the organic material layer is provided, and
a light extraction layer provided on an opposite surface of a surface of the substrate, on which the anode or the cathode is provided.

13. The organic light emitting device of claim 1, wherein the organic light emitting device is a flexible organic light emitting device.

14. A display comprising:
the organic light emitting device of claim 1.

15. A lighting comprising:
the organic light emitting device of claim 1.


[System] You are an expert US patent attorney. Draft a set of independent and dependent claims based on the provided invention description. Use correct USPTO formatting.

[User]
Title: Inflation Valve

Technical Field and Background:
Inflatable dunnage bags are commonly used for cushioning loads shipped in trucks, trailers and containers transported by ships, trucks or rail. This is often the case when the cargo only partially fills the container and there exists the possibility of shifting during transport that could cause damage. Typically known dunnage bags are constructed of one or more layers of paper surrounding a plastic lining. The paper protects the bags from tearing thus more layers are used in applications where the risk of damage to the dunnage bag is greater. Furthermore, for inflating and deflating the dunnage bag, a valve is attached by way of a hole cut in the bag during manufacture. The dunnage bags are shipped flat from the manufacturer, and are inflated by packing and loading personnel as the containers are loaded with cargo. The bag is firstly placed in the space that it will occupy as cargo is loaded into a container, secondly the inflation device is attached to a valve of the dunnage bag and subsequently the dunnage bag is filled with air until an appropriate air pressure within the bag is achieved. Often this occurs within a few seconds. Unfortunately the known type of inflation valves are difficult to operate and not flexible in operation and often do not seal correctly and thus suffer from important limitations. It is an object of the invention to suggest an inflation device which will assist in overcoming the aforesaid problems.

Invention Disclosure:
An inflation valve for inflating containers with non-rigid walls comprising a tubular body defining a passage with a first opening at one end and a second opening at its opposite end, adapted to be secured to a container; a sealing disc adapted to sealingly close off the second opening to the passage in the tubular body, and adapted to open the second opening mechanically when an inflation device is inserted into the passage through the first opening and thus gas may be passed into the container through the second opening, thereby moving the sealing disc away from the second opening; a guide member located within the passage of the tubular body; a spring adapted to assist the sealing disc to close off the second opening; and a gasket and/or sealing ring adapted to assist the sealing disc to close off the second opening.

[Assistant]
1. An inflation valve comprising:
(a) a tubular body defining a passage with a first opening at one end leading into the passage and a second opening at its opposite end leading into the passage, the tubular body configured to be secured to a container having non-rigid walls;
(b) a plastic plunger configured to sealingly close off the second opening to the passage in the tubular body, and the plunger configured to open the second opening mechanically when an inflation device is inserted into the passage through the first opening to facilitate gas flowing into the container through the second opening and thereby moving the plunger away from the second opening;
(c) a guide member located within the passage of the tubular body;
(d) a spring associated with the plunger and supported by the guide member, the spring configured to assist the plunger to close off the second opening;
(e) a gasket located in a cavity of the plunger and the gasket configured to assist the plunger to close off the second opening, and
(f) a pin configured to expand the guide member of the plunger.

2. The valve of claim 1, wherein the tubular body includes an annular protrusion configured to abut against the gasket to assist the plunger to close off the second opening.

3. The valve of claim 1, wherein the spring has an expanded height of between about 20 and 30 millimeters and a contracted height of between about 2 and 10 millimeters.

4. The valve of claim 1, wherein the tubular body includes at least one supporting member in the passage.

5. The valve of claim 1, further including a washer associated with the pin, wherein the washer and the pin are configured to lock the spring, the guide member and the plunger in a position.

6. The valve of claim 1, wherein the valve is a self-closing valve.

7. The valve of claim 1, further including a cap removably fitted over the tubular body to close the first opening of the passage.

8. The valve of claim 1, further including a deflating means for deflating the container.

9. The valve of claim 8, wherein the deflating means includes a tubular part with a cap member.

10. The valve of claim 9, wherein at least one of the tubular part or the cap member includes an aperture.

11. The valve of claim 8, wherein the deflating means is configured to open the second opening mechanically when the deflating means is inserted into the second opening and the deflating means facilitating gas flowing out of the container through the second opening.

12. The valve of claim 8, wherein the deflating means includes a locking means for locking the deflating means in pace to assist in self-deflating of the container without human assistance.

13. The valve of claim 8, wherein the deflating means is connected to the tubular body via a plastic connecting strip and a ring member configured to be removably located around the tubular body.

14. The valve of claim 1, wherein the spring is conically-shaped.

15. The valve of claim 1, wherein the spring is made of at least one of a metal material or a plastics material.

16. The valve of claim 1, wherein the guide member is plastic.

17. The valve of claim 1, wherein the plunger and the guide member are integrally formed.

18. The valve of claim 1, wherein the valve is used by venturi air flow guns and devices.

19. The valve of claim 1, wherein air entering the container through the inflation valve has an absolute pressure of about 9 bar.

20. The valve of claim 1, wherein the tubular body is provided with a flange to secure the inflation valve to the container.

21. The valve of claim 1, wherein the container is at least one of a dunnage bag, a sack or a flexible container to be pressurized.

22. The valve of claim 9, wherein (1) the tubular body is provided with an external protrusion and (2) the cap member is provided with a corresponding recess to receive the external protrusion.

23. The valve of claim 22, wherein the inflation device includes a filling nozzle having a recess corresponding with the external protrusion of the tubular body.

24. The valve of claim 1, wherein the tubular body is plastic and the tubular body is injection moulded.

25. The valve of claim 8, wherein the deflating means is plastic and the deflating means is injection moulded.

26. The valve of claim 1, wherein the gasket is made of at least one of a polyethylene sheet material, rubber or silicon.

27. The valve of claim 1, wherein the valve is a one-way valve or a semi-one way valve.

28. The valve of claim 1, wherein the valve is configured to enable the container to be deflated to create a vacuum in the container.


[System] You are an expert US patent attorney. Draft a set of independent and dependent claims based on the provided invention description. Use correct USPTO formatting.

[User]
Title: Accelerator Pedal Information Feedback System

Technical Field and Background:
In comparison with the vehicles using internal combustion engines, electric vehicles have many benefits such as low noise and low vibration. Generally, while driving the vehicle with the internal combustion engine, the driver can realize the loading condition of the engine and judge whether the operation of the vehicle is normal according to the vibration and noise generated by the engine. Due to the low noise and the low vibration of the electric vehicle, the driver cannot realize the operating condition of the electric vehicle according to the generated vibration and noise. Consequently, the possibility of causing breakdown of the electric vehicle in the overloading or overheating condition will be increased. Although the vehicle body is equipped with instruments, the driver may ignore the messages on the instruments if the traffic condition is crowded or the driving time period is very long.

Invention Disclosure:
An accelerator pedal information feedback system is provided for allowing the driver of the large electric vehicle to realize the status of the power system in real time. The information feedback system uses the power system information of the vehicle to calculate the systematic loading status information and feeds the information back to the driver. Consequently, the driver can realize the loading status of the power system in real time.

[Assistant]
1. An accelerator pedal information feedback system, comprising:
a base plate coupled with a vehicle structure to provide a mounting base;
a movable pedal disposed on the base plate;
a pedal angle sensor for sensing a displacement of the pedal;
a fixed elastic element for providing a fixed damping force to the pedal;
an adjustable elastic element;
a plurality of systematic status sensors; and
a control unit for controlling the adjustable elastic element to provide a variable damping force to the pedal according to an information provided by the plurality of systematic status sensors.

2. The accelerator pedal information feedback system of claim 1, wherein the fixed elastic element is a spring.

3. The accelerator pedal information feedback system of claim 1, wherein the fixed elastic element is an elastomer.

4. The accelerator pedal information feedback system of claim 1, wherein the adjustable elastic element is a spring.

5. The accelerator pedal information feedback system of claim 4, wherein the variable damping force is correspondingly changed when a preloading force applied to the spring is changed.

6. An accelerator pedal information feedback system of a electric vehicle, the accelerator pedal information feedback system comprising:
an accelerator pedal;
a first elastic element for providing a fixed damping force to the accelerator pedal;
a control unit for receiving a temperature information of a power system and calculating a systematic loading coefficient according to a mathematic formula containing the temperature information of the power system;
a second elastic element; and
a preloading adjustment mechanism for generating a variable damping force to the accelerator pedal according to the systematic loading coefficient, wherein a driver of the electric vehicle realizes a real-time loading condition of the power system according to a change of the variable damping force,
wherein the control unit further receives a temperature information of a battery, and a mathematic formula for calculating the systematic loading coefficient further contains the temperature information of the battery.

7. The accelerator pedal information feedback system of claim 6, wherein the control unit further receives a temperature information of a motor controller, and a mathematic formula for calculating the systematic loading coefficient further contains the temperature information of the motor controller.

8. The accelerator pedal information feedback system of claim 7, wherein the control unit further receives an inner temperature information of a motor, and a mathematic formula for calculating the systematic loading coefficient further contains the inner temperature information of the motor.

9. The accelerator pedal information feedback system of claim 6, wherein the control unit further receives a residual battery capacity information, and a mathematic formula for calculating the systematic loading coefficient further contains the residual battery capacity information.

10. The accelerator pedal information feedback system of claim 6, wherein the control unit further receives a cumulative driving time information, and a mathematic formula for calculating the systematic loading coefficient further contains the cumulative driving time information.

11. The accelerator pedal information feedback system of claim 6, wherein the control unit further receives a vehicle weight information, and a mathematic formula for calculating the systematic loading coefficient further contains the vehicle weight information.


[System] You are an expert US patent attorney. Draft a set of independent and dependent claims based on the provided invention description. Use correct USPTO formatting.

[User]
Title: Organic Light-Emitting Display Apparatus

Technical Field and Background:
1. Field Aspects of embodiments of the present invention relate to an organic light-emitting display apparatus. 2. Description of the Related Art In general, a display apparatus such as an organic light-emitting display apparatus including a thin film transistor (TFT) has been spotlighted because the display apparatus can be variously applied to a mobile display device such as a smartphone, a tablet personal computer (PC), an ultra-thin laptop, a digital camera, a video camera, or a personal digital assistant (PDA), or to an electric/electronic product such as an ultra-thin television (TV). A gap between a top surface and a bottom surface of an organic light-emitting display apparatus may be sealed to protect the organic light-emitting device from external impact or impurities. To this end, the gap between the top surface and the bottom surface may be coated with a sealing member, and by hardening the sealing member, the top surface and the bottom surface are bonded. The lifespan and reliability of the display may be affected by the degree of adhesion between the top and bottom surfaces bonded by the sealing member.

Invention Disclosure:
An organic light-emitting display apparatus includes a first substrate, a display unit defining an active area on the first substrate and including an insulating layer, a second substrate on the display unit, one or more signal lines outside the active area and on the insulating layer, and a sealant between the first substrate and the second substrate. The sealant bonds the first substrate and the second substrate, and covers at least a portion of the signal lines.

[Assistant]
1. An organic light-emitting display apparatus comprising:
a first substrate;
a display unit defining an active area on the first substrate and comprising a thin film transistor in the active area, the thin film transistor comprising an active layer, a gate electrode, a source electrode, and a drain electrode;
an interlayer insulating layer between the gate electrode and the source and drain electrodes;
a second substrate on the display unit;
a cathode power line outside the active area and on the interlayer insulating layer, the cathode power line being between the interlayer insulating layer and the second substrate; and
a sealant between the first substrate and the second substrate and bonding the first substrate and the second substrate,
wherein the interlayer insulating layer defines at least two first holes outside the active area, and the at least two first holes are filled with the sealant.

2. The organic light-emitting display apparatus of claim 1,
wherein the display unit further comprises an organic light-emitting device comprising a first electrode, a second electrode, and an intermediate layer between the first electrode and the second electrode, and
wherein the cathode power line is electrically connected to the second electrode.

3. The organic light-emitting display apparatus of claim 2, wherein
the thin film transistor is electrically connected to the first electrode,
the cathode power line comprises a same material as the source electrode and the drain electrode.

4. The organic light-emitting display apparatus of claim 3, further comprising
a gate insulating layer between the active layer and the gate electrode.

5. The organic light-emitting display apparatus of claim 2, wherein the sealant is separated from the second electrode.

6. The organic light-emitting display apparatus of claim 2, further comprising:
a passivation layer on the interlayer insulating layer; and
a metal layer on the passivation layer and electrically connecting the second electrode and the cathode power line.

7. The organic light-emitting display apparatus of claim 6, wherein the passivation layer covers at least a portion of the cathode power line.

8. The organic light-emitting display apparatus of claim 7, wherein the passivation layer covers at least an edge portion of the cathode power line between the cathode power line and the metal layer.

9. The organic light-emitting display apparatus of claim 6, wherein the metal layer comprises a same material as the first electrode.

10. The organic light-emitting display apparatus of claim 6, further comprising a pixel-defining layer covering the metal layer and having a contact hole, wherein the second electrode is on the pixel-defining layer and contacts the metal layer through the contact hole.

11. The organic light-emitting display apparatus of claim 10, wherein the pixel-defining layer is separated from the sealant.

12. The organic light-emitting display apparatus of claim 11, wherein the pixel-defining layer covers at least a portion of the cathode power line exposed between the sealant and the metal layer.

13. The organic light-emitting display apparatus of claim 10, wherein
the pixel-defining layer has a second hole, and
the sealant covers at least a portion of the pixel-defining layer and contacts the cathode power line through the second hole.

14. The organic light-emitting display apparatus of claim 4, wherein the gate insulating layer defines at least two third holes filled with the sealant, and
wherein each of the at least two third holes corresponds to each of the at least two first holes.


[System] You are an expert US patent attorney. Draft a set of independent and dependent claims based on the provided invention description. Use correct USPTO formatting.

[User]
Title: Co Or Ni And Cu Integration For Small And Large Features In Integrated Circuits

Technical Field and Background:
Integrated circuits (IC) include various semiconductor devices formed within or on layers of dielectric material that overlay a substrate. The devices formed in or on the dielectric layers may include MRS transistors, bipolar transistors, diodes, and diffused resistors. Other devices formed in or on the dielectric material may include thin film resistors and capacitors. Metal lines interconnect the semiconductor devices to power the devices and enable the devices to share and exchange information. Interconnects may extend horizontally between devices within a dielectric layer as well as vertically between dielectric layers. These metal lines are connected to each other by a series of interconnects. The electrical interconnects or metal lines are first patterned into the dielectric layers to form vertical and horizontal recessed features (vias and trenches) that are subsequently filled with metal. The resulting layer containing metal-filled lines residing in a dielectric is referred to as a metallization layer. A long-standing objective in the advancement of IC technology has been the scaling down of IC dimensions. Scaling-down of IC dimensions is critical to obtaining higher speed performance of ICs. An increase in IC performance is normally accompanied by a decrease in device area and/or an increase in device density. An increase in device density results in a decrease in via and trench dimensions (widths) used to form interconnects. However, as feature dimensions on wafers decrease, negative consequences may occur. For example, reduced-size features may result in less reliable interconnects. Copper interconnects are typically used in ICs. However, drawbacks of copper interconnects in small features include performance as a result of, for example, voids formed during deposition, electromigration tendencies of copper, line resistance, and via resistance. Therefore, there exists a need for the integration of copper and non-copper interconnects, the metal for a feature being selected depending on the size of the feature. Embodiments of the present disclosure are directed to an integration scheme for Cu and other metal interconnects to solve these and other problems.

Invention Disclosure:
In one embodiment of the present disclosure, a method for depositing metal in a feature on a workpiece is provided. The method includes electrochemically depositing a second metal layer on a first metal layer on a workpiece having at least two features of two different sizes in a dielectric layer, wherein the second metal layer is a copper layer and wherein the first metal layer includes a metal selected from the group consisting of cobalt and nickel, wherein the first metal layer completely fills the smallest feature but does not completely fill the largest feature.

[Assistant]
1. A method for depositing metal in a feature on a workpiece, the method comprising:
electrochemically depositing a second metal layer on a first metal layer on the workpiece having at least two features of two different sizes in a dielectric layer, wherein the second metal layer is a copper layer and wherein the first metal layer includes a metal selected from one of a group consisting of cobalt and nickel, wherein the first metal layer completely fills a smallest feature of the at least two features but does not completely fill a largest feature of the at least two features.

2. The method of claim 1, wherein one feature of the at least two features has a critical dimension comprising a width of less than or equal to 17 nm.

3. The method of claim 1, wherein one feature of the at least two features has a critical dimension comprising a width of greater than 20 nm.

4. The method of claim 1, further comprising heat treating the workpiece after deposition of the second metal layer.

5. The method of claim 4, wherein a temperature for heat treating the workpiece is in a temperature range of 150 degrees C. to 400 degrees C.

6. The method of claim 4, wherein heat treating the workpiece anneals the first and second metal layers.

7. The method of claim 4, wherein heat treating the workpiece reflows the second metal layer to at least partially fill the largest feature.

8. The method of claim 4, further comprising plasma treating the first metal layer using hydrogen plasma or hydrogen radicals (H*) prior to electrochemically depositing the second metal layer.

9. The method of claim 1, further comprising heat treating the first metal layer before depositing the second metal layer.

10. The method of claim 9, wherein heat treating the first metal layer is in a temperature range of 200 degrees C. to 400 degrees C.

11. The method of claim 1, wherein the second metal layer is a conformal or superconformal layer.

12. The method of claim 1, wherein the second metal layer includes an overburden.

13. The method of claim 1, wherein the second metal layer at least partially fills the largest feature without depositing an overburden on the workpiece.

14. The method of claim 1, further comprising electrochemically depositing a third metal layer on the second metal layer.

15. The method of claim 14, wherein the third metal layer is an overburden, a cap, a fill layer, a conformal conductive layer, or a superconformal conductive layer.

16. The method of claim 1, wherein the first metal layer is a first seed layer.

17. The method of claim 16, further comprising depositing a second seed layer on the first seed layer prior to deposition of the second metal layer.

18. The method of claim 17, wherein the second seed layer is different in metal composition from the first seed layer.

19. The method of claim 17, wherein the second seed layer is a copper seed layer.

20. The method of claim 1, wherein the second metal layer is deposited over an entire surface of the first metal layer.

21. The method of claim 1, wherein the second metal layer is a bottom-up fill layer.


[System] You are an expert US patent attorney. Draft a set of independent and dependent claims based on the provided invention description. Use correct USPTO formatting.

[User]
Title: Using Tensile Mask To Minimize Buckling In Substrate

Technical Field and Background:
Technical Field The present disclosure relates to semiconductor fabrication, and more specifically, to a method using a tensile hard mask to minimize buckling in a substrate, and the resulting intermediate semiconductor structure. Related Art In integrated circuit devices, groups of openings are formed in semiconductor substrates for use in forming a wide variety of structures such as capacitors, memory, fins, etc. One type of opening that is typically formed in groups in one area of the semiconductor substrate but not in other areas includes deep trenches. Groups of openings can be formed using any conventional process such as patterning a thick oxide mask over the semiconductor substrate, etching the pattern into the substrate in one area, and fully or partially removing the mask. After the openings are formed, the surface topography (or relief) of the area with the openings is typically lower compared to those areas without openings. Subsequent operations have difficulty with the resulting, uneven topography. For example, subsequent alignment and planarizing operations cannot effectively correct for the distortion, leading to variable structure positions and heights. One example structure that has different heights over the openings, e.g., trenches, compared to where no openings are provided include fin-gate structures. The height difference can be, for example, 60-70 nanometers, which is 3-4 times greater than presently acceptable tolerances. Consequently, the varied surface topography severely limits device yield.

Invention Disclosure:
A method for preventing buckling in a substrate using a tensile hard mask is provided. The method may include forming a mask over a substrate, the hard mask including a first area having a pattern for forming a plurality of openings and an adjacent second area free of openings, and the hard mask includes a tensile stress therein. The hard mask may be used to form the plurality of openings in the substrate. Partially eroding the hard mask leaves the substrate with the plurality of openings therein and a substantially planar surface, having diminished buckling.

[Assistant]
1. A method, comprising:
forming a hard mask over a substrate, the hard mask including a first area having a pattern for forming a plurality of openings, wherein the hard mask includes a tensile stress therein, and wherein the hard mask includes a plurality of layers, one layer of the plurality of layers including an undoped silicon glass (USG) stress layer for providing the tensile stress;
using the hard mask to form the plurality of openings in the substrate; and
partially eroding the hard mask, leaving the substrate with the plurality of openings therein and a substantially planar surface.

2. The method of claim 1, wherein the plurality of openings includes a plurality of deep trenches.

3. The method of claim 1, wherein the plurality of openings includes a plurality of trenches, and further comprising forming a plurality of fins in the substrate between pairs of the trenches.

4. The method of claim 1, wherein the tensile stress is approximately 100-400 MegaPascals.

5. The method of claim 1, wherein each opening in the plurality of openings has a width in a range of approximately 60-100 nanometers (nm).

6. The method of claim 1, wherein the hard mask further includes a second area free of openings adjacent to the first area, and wherein the substantially planar surface includes the first area and the second area.

7. A method, comprising:
forming a hard mask over a substrate, the hard mask including a first area having a pattern for forming a plurality of deep trenches, wherein the hard mask includes a tensile stress therein, and wherein the hard mask includes a plurality of layers, one layer of the plurality of layers including an undoped silicon glass (USG) stress layer for providing the tensile stress;
using the hard mask to form the plurality of deep trenches in the substrate; and
partially eroding the hard mask, leaving the substrate with the plurality of deep trenches therein and a substantially planar upper surface.

8. The method of claim 7, further comprising forming a plurality of fins in the substrate between pairs of the trenches.

9. The method of claim 7, wherein the tensile stress is approximately 100-400 MegaPascals.

10. The method of claim 7, wherein the hard mask further includes a second area free of openings adjacent to the first area, and wherein the substantially planar upper surface includes the first area and the second area.

11. A method, comprising:
forming a hard mask over a substrate, the hard mask including a first area having a pattern for forming a pair of elongate openings, wherein the hard mask includes a plurality of layers, one layer of the plurality of layers including an undoped silicon glass (USG) stress layer for providing a tensile stress;
forming the pair of elongate openings in the substrate, using the pattern of the hard mask, to define at least one fin on the substrate between the pair of elongate openings; and
partially eroding the hard mask to a yield a structure including the substrate with the pair of elongate openings, the at least one fin, and a substantially planar surface of the substrate.

12. The method of claim 11, wherein the tensile stress is approximately 100-400 MegaPascals.

13. The method of claim 11, wherein the hard mask further includes a second area free of openings adjacent to the first area, and wherein the second area defines at least a portion of the substantially planar surface.


[System] You are an expert US patent attorney. Draft a set of independent and dependent claims based on the provided invention description. Use correct USPTO formatting.

[User]
Title: Led Lighting Methods And Apparatus

Technical Field and Background:
Exterior lighting often involves illuminating different areas of an outdoor environment with different amounts of light, with lights of different colors and/or with lights that have beams of different widths. Often spotlights are used to illuminate particular features or elements of the outdoor environment. To support a wide range of lighting applications lighting installers currently carry or use a wide variety of different types of lights. Even for a given type of light to support different angles, amounts of light output and/or different colors, an installer may need to disassemble one or more light fixtures in a way that may compromise the integrity of the fixtures and replace one or more components such as lamps or color filters, to configure a fixture as desired. Such field operations can result in dirt or water being introduced into the fixture affecting bulb life or the overall reliability of the fixture as exposure of electrical elements to water and dirt may result in rapid corrosion. In view of the above it should be appreciated that there is a need for methods and/or apparatus which can support a wide variety of lighting configurations. It would be desirable if the supported lighting configurations included one or more of different beam angles, amount of light output, color of light output and/or direction of light output. Furthermore it would be desirable if changes in one or more of these characteristics could be made by an installer in the field without compromising the water tight integrity of a light fixture and/or without the need for specialized or expensive tools.

Invention Disclosure:
LED related lighting methods and apparatus are described. Various features relate to water tight light fixtures. Some of the fixtures are spotlights while other fixture are intended for in ground use. The light fixtures in at least some embodiments include power control features. In spotlight embodiments beam angle and power or light output can be controlled without opening the light assembly or compromising the water tight seals which also protect against dirt. In ground embodiments support tilt angle setting which allow a user to set the light fixture to one or more tilt angles. Beam angle can also be changed in some embodiments as well as power control. Beam angle, power control and tilt angle adjustments are supported in some embodiments but need not be supported in all embodiments with some embodiments using one or more of the described features but not all features.

[Assistant]
1. An LED light fixture, comprising:
an upper fixture main body;
an LED light source secured in the upper fixture main body;
a lower fixture main body including support arms between which said upper fixture main body is mounted by pivots;
a first tilt position stop for holding said upper fixture main body at one of a plurality of user selectable tilt positions;
a plurality of tilt position holes in a lower portion of at least one of said support arms, each of said tilt position holes corresponding to a different tilt position, said first tilt position stop being secured into one of the tilt position holes corresponding to a user selectable tilt position at which the upper fixture main body is set;
a first stopper bracket secured to a first bottom portion of a first side of the upper fixture main body; and
a first spring, the first spring being positioned between the first tilt position stop and the upper fixture main body forcing the first tilt position stop to extend out through a hole in the first stopper bracket and into said one of the tilt position holes corresponding to the user selectable tilt position at which the upper fixture main body is set.

2. The LED light fixture of claim 1, further comprising:
a second stopper bracket secured to a second bottom portion of a second side of the upper fixture main body; and
a second spring, the second spring being positioned between the second tilt position stop and the upper fixture main body forcing the second tilt position stop to extend out through a hole in the second stopper bracket and into one of the tilt position holes corresponding to the user selectable tilt position at which the upper fixture main body is set.

3. The LED light fixture of claim 1, wherein said first tilt position stop is a top button with a rounded head.

4. The LED light fixture of claim 3, wherein said pivots are pivot screws, each pivot screw having a threaded tip that screws into the upper fixture main body and a smooth shaft portion which extends through one of the support arms.

5. The LED light fixture of claim 1, wherein said tilt position holes include holes corresponding to a 0 degree tilt position, a 10 degree tilt position, a 20 degree tilt position, a −10 degree tilt position and a −20 degree tilt position.

6. The LED light fixture of claim 1, wherein said LED light fixture is a landscape lighting device, said LED light fixture further including:
a control apparatus for controlling current to the LED light source, the control apparatus comprising:
a user selectable control; and
a control circuit configured to control the LED light source to output light in an amount depending on a user selectable setting on the user selectable control, said control circuit including:
i) a current regulator for controlling the amount of current passing through the LED light source; and
ii) a dimming control circuit.

7. The LED light fixture of claim 6:
wherein said control circuit is an LED driver circuit for generating and controlling the flow of current through said LED light source; and
wherein said user selectable control is a dimming control knob in contact with a movable portion of a potentiometer, said moveable portion changing resistance of a portion of the dimming control circuit when moved.

8. The LED light fixture of claim 1 further comprising:
a control apparatus for controlling current to the LED light source in the LED light fixture, said LED light fixture being a landscape lighting device, the control apparatus comprising:
an LED driver;
a user control with a control setting indicator; and
the lower fixture main body including setting indicators, alignment of the control setting indicator on the user control with one of the setting indicators indicating to which of a plurality of user selectable settings the LED driver is set.

9. The LED light fixture of claim 8 wherein the LED driver of the control apparatus includes:
a control circuit configured to control the LED light source to output light in an amount depending on a user selectable setting on the user control, said control circuit including:
i) a current regulator for controlling the amount of current passing through the LED light source; and
ii) a dimming control circuit including a potentiometer.

10. The LED light fixture of claim 9 wherein said user control is a dimming control knob in contact with a movable portion of said potentiometer, said moveable portion changing resistance of a portion of the dimming control circuit when moved.

11. The LED light fixture of claim 9, wherein said lower fixture main body includes visible wattage markings adjacent corresponding setting indicators.

12. The LED light fixture of claim 9, wherein said lower fixture main body further includes a visible apparent power marking in close proximity to a wattage marking adjacent the setting indicator to which the apparent power marking and associated wattage marking correspond.

13. The LED light fixture of claim 9, wherein said lower fixture main body further includes a visible MR16 equivalent wattage marking in close proximity to a wattage marking adjacent the setting indicator to which an apparent power marking and associated wattage marking correspond.

14. The LED light fixture of claim 1 being a configurable lighting fixture further comprising:
a beam angle changing lens for directing light;
an element holder including at least a first guide pin, said element holder holding one of said lens or said LED light source; and
wherein said element holder is mounted in said upper fixture main body, said upper fixture main body including a first plurality of horizontal slots, each horizontal slot in said first plurality of horizontal slots corresponding to a different beam angle setting, said first guide pin being positioned in a first horizontal slot corresponding to a first beam angle to which the configurable lighting fixture is configured to support the element holder at a position within said fixture body corresponding to the first beam angle to which the configurable lighting fixture is set.

15. The LED light fixture of claim 14 further comprising:
a first vertical slot in a first side of said upper fixture main body joining said plurality of horizontal slots and allowing for repositioning of said element holder from said first horizontal slot to a second horizontal slot corresponding to a second beam angle.

16. The LED light fixture of claim 15, wherein the first and second horizontal slots have elongated end portions into which said first guide pin can be snapped.

17. The LED light fixture of claim 15, wherein an exterior top portion of the upper fixture main body is threaded, said first vertical slot extending through said threaded exterior top portion providing an opening into which the element holder first guide pin can be lowered into said first vertical slot prior to rotation of the element holder to position the first guide pin in the elongated end of the first horizontal slot.

18. An LED light fixture, comprising:
an upper fixture main body;
an LED light source secured in the upper fixture main body;
a lower fixture main body including support arms between which said upper fixture main body is mounted by pivots;
a first tilt position stop for holding said upper fixture main body at one of a plurality of user selectable tilt positions;
a plurality of tilt position holes in a lower portion of at least one of said support arms, each of said tilt position holes corresponding to a different tilt position, said first tilt position stop being secured into one of the tilt position holes corresponding to a user selectable tilt position at which the upper fixture main body is set;
a first stopper bracket secured to a first bottom portion of a first side of the upper fixture main body;
a first spring, the first spring being positioned between the first tilt position stop and the upper fixture main body forcing the first tilt position stop to extend out through a hole in the first stopper bracket and into said one of the tilt position holes corresponding to the user selectable tilt position at which the upper fixture main body is set; and
wherein said upper fixture main body is flat along the side portions which fit between the support arms and make thermal contact with said support arms which transfer and dissipate heat generated by the LED light source mounted in the upper fixture main body.

19. The LED light fixture of claim 18, wherein said lower fixture main body includes a power control module with a user controllable control knob which can be turned to one of a plurality of different user selectable power settings.

20. An LED light fixture, comprising:
an upper fixture main body;
an LED light source secured in the upper fixture main body;
a lower fixture main body including support arms between which said upper fixture main body is mounted by pivots;
a first tilt position stop for holding said upper fixture main body at one of a plurality of user selectable tilt positions;
a plurality of tilt position holes in a lower portion of at least one of said support arms, each of said tilt position holes corresponding to a different tilt position, said first tilt position stop being secured into one of the tilt position holes corresponding to a user selectable tilt position at which the upper fixture main body is set;
a first stopper bracket secured to a first bottom portion of a first side of the upper fixture main body;
a first spring, the first spring being positioned between the first tilt position stop and the upper fixture main body forcing the first tilt position stop to extend out through a hole in the first stopper bracket and into said one of the tilt position holes corresponding to the user selectable tilt position at which the upper fixture main body is set; and
a waterproof housing in which said upper fixture main body, LED light source, lower fixture main body and first tilt position stop are sealed after said upper fixture main body is set to one of the user selectable tilt positions.

21. The LED light fixture of claim 20, further comprising:
a pressure equalizing vent including a hole covered by a water vapor permeable material which blocks water droplets from passing through the water vapor permeable material.

22. The LED light fixture of claim 20, further comprising:
a protective glass;
a flexible seal;
and a cover which seals a top of said waterproof housing from water and dirt.


[System] You are an expert US patent attorney. Draft a set of independent and dependent claims based on the provided invention description. Use correct USPTO formatting.

[User]
Title: Multi-Tool For Fiber Optic Applications

Technical Field and Background:
With the ubiquitous use of fiber optic cables, testing of fiber optic cables and systems has become increasingly common. Unfortunately, fiber optic cabling is highly susceptible to damage from physical contact, scratches, and even dust particles. This sensitivity of fiber optic components presents a particular problem for technicians attempting to perform testing or repairs outside of a protected environment. In some instances, technicians actually travel with a portable “clean room” trailer (splice truck) to attempt to perform remote testing and repairs in a more suitable environment. Such splice trucks are simply not feasible for use in most of the remote locations in which fiber optic testing and repairs are now frequently made. Instead, technicians typically employ a variety of testing tools and devices which are carried by the technician to the site of the needed testing or repair. Specifically, many technicians now carry such various testing tools to remote locations such as, remote vaults, roof tops, and even to the top of 100 foot or higher cell towers. Again, the technician must now travel to these remote locations carrying all of their potentially needed tools with them. Due to the requirement to avoid dirt and contaminates, it is not uncommon for a technician to arrive at a location only to find that the needed tool is either crushed in a tool box, soiled with dust, or contaminated with moisture. Additionally, the technician may determine that they need a tool that they did not bring with them. Now an additional “truck roll” is needed to deliver a new or needed tool, thereby adding additional expense to the process. In addition to the above described issues, it is imperative that the technician also protects any loose fiber cable ends during the testing process. When performing testing operations, it is not uncommon for the end of disconnected fiber optic cable to become scratched or otherwise damaged.

Invention Disclosure:
A multi-tool for fiber optic applications is disclosed. In one embodiment, the multi-tool includes a male fiber loopback plug. The multi-tool further includes a fiber coupler having a first end and a second end. The first end of the fiber coupler is able to receive the male fiber loopback plug when the multi-tool is in a closed position. Also, the first end of the fiber coupler is able to receive a loose fiber cable end when the multi-tool is in an open position. The multi-tool also includes an end cap which can be removably coupled to the second end of the fiber coupler. The end cap and the fiber coupler cooperatively provide a protective housing for a fiber cable end when the end cap is removably coupled to the second end of the fiber coupler and the fiber cable end is inserted into the first end of the fiber coupler. Further, the male fiber loopback plug and the fiber coupler collectively make a female fiber loopback plug when the male fiber loopback plug is in a closed position and the end cap is removed from the second end of the fiber coupler. Also, a dust-resistant housing protectively encloses the male fiber loopback plug, the fiber coupler, and the end cap such that the multi-tool is protected from dust intrusion when the male fiber loopback plug is in the closed position and the cap is coupled to the second end of the fiber coupler.

[Assistant]
1. A multi-tool for fiber optic applications, said multi-tool comprising:
a male fiber loopback plug;
a fiber coupler comprising a first end and a second end, said first end of said fiber coupler receiving said male fiber loopback plug when said multi-tool is in a closed position, said first end of said fiber coupler configured to receive at least one loose fiber cable end when said multi-tool is in an open position;
an end cap configured to be removably coupled to said second end of said fiber coupler, said end cap and said fiber coupler cooperatively providing a protective housing for said at least one fiber cable end when said end cap is removably coupled to said second end of said fiber coupler and said at least one fiber cable end is inserted into said first end of said fiber coupler, said male fiber loopback plug and said fiber coupler collectively comprising a female fiber loopback plug when said male fiber loopback plug is in said closed position and said end cap is removed from said second end of said fiber coupler;
a dust-resistant housing integrated into said multi-tool, said dust resistant housing protectively enclosing said male fiber loopback plug, said fiber coupler, and said end cap, such that said multi-tool is protected from dust intrusion when said male fiber loopback plug is in said closed position and said cap is removably coupled to said second end of said fiber coupler;
a depressible portion in said dust-resistant housing, said depressible portion disposed proximate where said male fiber loopback plug couples to said first end of said fiber coupler when said multi-tool is in said closed position, said depressible portion configured for being manually depressed; and
a latch mechanism coupled to said male fiber loopback plug, said latch mechanism disposed on said male fiber loopback plug such that said latch mechanism resides proximate said depressible portion when said multi-tool is in said closed position, said latch mechanism configured to enable said multi-tool to be placed in said open position by manually depressing said depressible portion, activating said latch mechanism, and removing said male fiber loopback tool from said first end of said fiber coupler.

2. The multi-tool for fiber optic applications of claim 1, wherein said dust-resistant housing is crush resistant.

3. The multi-tool for fiber optic applications of claim 1, wherein said dust-resistant housing is fluid resistant.

4. The multi-tool for fiber optic applications of claim 1, wherein said male fiber loopback plug comprises an SC fiber loopback plug.

5. The multi-tool for fiber optic applications of claim 1, wherein said male fiber loopback plug comprises an LC fiber loopback plug.

6. The multi-tool for fiber optic applications of claim 1, wherein said dust-resistant housing has a color that signifies that said multi-tool is suited for a particular type of fiber optic application.

7. The multi-tool for fiber optic applications of claim 1, wherein said male fiber loopback plug is removably coupleable to said fiber coupler via a press fit mechanism.

8. The multi-tool for fiber optic applications of claim 1, wherein said end cap is removably coupleable to said second end of said fiber coupler via a press fit mechanism.

9. The multi-tool for fiber optic applications of claim 1, wherein said end cap further comprises:
an insertion feature which is removably insertable into said second end of said fiber coupler when said end cap is removably coupled to said second end of said fiber coupler.

10. The multi-tool for fiber optic applications of claim 1, further comprising:
an connector coupled to said dust-resistant housing, said connector configured to enable said multi-tool to be attached to a carrying device.

11. The multi-tool for fiber optic applications of claim 7, wherein said press fit mechanism is comprised of a rib-and-valley construction.

12. The multi-tool for fiber optic applications of claim 8, wherein said press fit mechanism is comprised of a rib-and-valley construction.


[System] You are an expert US patent attorney. Draft a set of independent and dependent claims based on the provided invention description. Use correct USPTO formatting.

[User]
Title: Float Adapter For Electrical Connector

Technical Field and Background:
A radio frequency (RF) connector is an electrical connector designed to work at radio frequencies in the multi-megahertz range. Typically, RF connectors are used in a variety of applications such as wireless telecommunications applications, including WiFi, PCS, radio, computer networks, test instruments, and antenna devices. In some instances, a number of individual connectors are ganged together into a single, larger connector housing for electrically and physically connecting two or more printed circuit boards. One example of an RF connector interface is the sub-miniature push-on (SMP) interface. SMP is commonly used in miniaturized high frequency coaxial modules and is offered in both push-on and snap-on mating styles and is often used for PC board-to-board interconnects. For these applications, the conventional SMP interface utilizes a male connector on each of the PC boards and a female-to-female adapter mounted in between to complete the connection. One problem with conventional RF connectors is that such connectors typically do not have the flexibility to customize the degree of axial or radial float between connectors. Another problem associated with conventional RF connectors is that the density of individual connectors is limited by the shape and design of the adapter. As RF connector applications have begun to require a greater number of individual connections between components, RF connectors using conventional designs have necessarily increased in size to accommodate this. Larger connectors require more physical space in order to provide the necessary contacts, which make the connectors less applicable to high density systems requiring smaller connectors and more expensive to produce. Accordingly, there is a need for an electrical connector, such an RF connector, with improved axial and radial float while also having a smaller profile.

Invention Disclosure:
A float adapter for an electrical connector that includes a conductive shell and an insulator received in the conductive shell. The insulator includes an engagement end, an interface end that is opposite the engagement end, and a reduced diameter middle portion therebetween. The insulator includes an inner bore that extends through the engagement end, the interface end, and the reduced diameter middle portion. The interface end has a lead-in tip portion that extends outside of the first end of the conductive shell. The lead-in tip portion has a tapered outer surface that terminates in an end face surface and a shoulder remote from the end face surface that defines an outer diameter that is larger than the inner diameter of the conductive shell. An inner contact is received in the inner bore of the insulator. The inner contact has socket openings at either end.

[Assistant]
1. An electrical connector assembly, comprising:
a first connector having at least one contact extending into at least one cavity;
a second connector having at least one contact extending into at least one cavity; and
at least one float adapter coupling said first and second connectors, said float adapter including:
a conductive shell having opposite first and second ends, said first end having an engagement member configured to engage a corresponding engagement member in said cavity of said first connector,
an insulator received in said conductive shell, said insulator including an engagement end and an interface end opposite said engagement end, a middle portion between said engagement and interface ends, said middle portion having a diameter that is smaller than a diameter of either said engagement end or said interface end, and an inner bore extending through said engagement and interface ends, and said reduced diameter middle portion, said interface end having a lead-in tip portion extending outside of said first end of said conductive shell, said lead-in tip portion having a shoulder defining an outer diameter that is larger than the inner diameter of said conductive shell, and said reduced diameter middle portion defining an annular space between said insulator and said conductive shell, and
an inner contact received in said inner bore of said insulator, said inner contact having first and second contacts at either end thereof for connecting with said contacts of said first and second connectors, respectively;
wherein said at least one float adapter provides axial and radial float between said first and second connectors.

2. An electrical connector assembly of claim 1, wherein
said engagement member of said conductive shell is one of an annular lip or groove; and
said engagement member of said cavity of said first connector is one of an annular lip or groove.

3. An electrical connector assembly according to claim 1, wherein
each of said contacts of said first and second connectors is either a socket or pin; and
each of said first and second contacts of said at least one float adapter is either a socket or pin.

4. An electrical connector assembly according to claim 1, wherein
said interface end of said insulator of at least one float adapter includes a tapered outer surface terminating in an end face surface, said shoulder being remote from said end face surface.

5. An electrical connector assembly according to claim 1, wherein
each of said first and second connectors is adapted to connect to a printed circuit board.

6. Method of assembly of a float adapter, comprising the steps of:
providing a conductive shell that has first and second ends;
providing an insulator, the insulator has an engagement end, an interface end opposite the engagement end, a middle portion therebetween, and an inner bore extending through the engagement end, the interface end, and the middle portion;
inserting the insulator into the conductive shell through the first end of the conductive shell such that the engagement end of the insulator expands to engage an inner portion of the conductive shell;
providing an inner contact that has first and second contact at either end thereof; and
inserting the inner contact through the second end of the conductive body shell and into the inner bore of the insulator.

7. A method of claim 6, wherein
the interface end having a lead-in tip portion extending outside of the first end of the conductive shell, the lead-in tip portion has a tapered outer surface terminating in an end face surface and a shoulder remote from the end face surface defining an outer diameter that is larger than the inner diameter of the conductive shell.

8. A method of claim 6, wherein
the insulator is inserted into the conductive shell until an engagement member of the insulator engages a corresponding engagement member of the conductive shell.

9. A method of claim 6, wherein
the middle portion defines an annular space between the insulator and the conductive shell.

10. A method of claim 6, wherein
the engagement end of the insulator includes at least one slot at a the engagement end to expand; and
the inner portion of the conductive shell is an inner flange.


[System] You are an expert US patent attorney. Draft a set of independent and dependent claims based on the provided invention description. Use correct USPTO formatting.

[User]
Title: Semiconductor Device

Technical Field and Background:
1. Field of the Invention The present invention relates to a semiconductor device having a function of overheat detection. 2. Description of the Related Art A semiconductor integrated circuit generates heat due to, for example, an operation of active elements and charges flowing into the semiconductor integrated circuit from outside thereof. A temperature sensing element is thus formed on the same substrate as the semiconductor integrated circuit to control the semiconductor integrated circuit based on a signal from the temperature sensing element, to thereby prevent abnormal operation and breakdown of the circuit due to overheating. As the temperature sensing element, for example, a PN junction is used, and the forward current of the PN junction is used for temperature sensing. To be specific, when a constant current flows through a PN junction in a forward direction, a potential difference appears between the both ends of the PN junction. The potential difference changes depending on, temperature, and hence the potential difference is used as a signal for overheat detection. In the field of semiconductor integrated circuits, downsizing has been promoted. Because a temperature increase of a semiconductor integrated circuit increases in inverse proportion to an area thereof, a local temperature increase has become intense along with the promotion of downsizing in recent years. As an amount of locally generated heat increases, a temperature sensed by a temperature sensing element increases depending on a substance between a heat generating source and the temperature sensing element, and a positional relationship therebetween. There may be two methods to be employed in order to solve this problem, to thereby correctly estimate the temperature of the heat generating source. Specifically, the heat generating source and the temperature sensing element are formed as close as possible, and a highly heat conductive substance is formed between the heat generating source and the temperature sensing element. When the temperature sensing element is formed on the same substrate as the heat generating source, problematic operation, namely, parasitic operation occurs as described in Japanese Patent No. 2701824 as a problem. Due to this problem, the heat generating source and the temperature sensing element cannot be formed closely. In view of this, a method disclosed in Japanese Patent No. 2701824 involves forming an insulating film between a heat generating source and a temperature sensing element, to thereby avoid a problem of a parasitic element. Silicon is most commonly used as a substrate and a silicon dioxide film is most commonly used as an insulating film in semiconductor devices. The heat generating source and the temperature sensing element can be formed closely with the silicon dioxide film formed therebetween, which serves as the insulating film. In this case, however, because heat conductivity of a silicon dioxide film is smaller than that of silicon, it takes time for the temperature sensing element to follow the temperature of the heat generating source. In short, a semiconductor device in which a temperature sensing element is formed on the same substrate as a heat generating source is disadvantageous in distance but is advantageous in heat conduction. On the other hand, a semiconductor device in which a heat generating source and a temperature sensing element are isolated from each other by an insulating film is advantageous in distance but is disadvantageous in heat conduction.

Invention Disclosure:
A power element and a temperature sensing element are formed on the same semiconductor substrate, and one end of a PN junction of the temperature sensing element is connected to a ground potential (VSS) or a power supply potential (VDD) through an intermediation of a resistor. A sum of a potential difference between both ends of the PN junction and a potential difference between both ends of the resistor is used as a temperature detection signal. The temperature sensing element can thus be formed in a recess formed in the power element while avoiding latch-up.

[Assistant]
1. A semiconductor device, comprising:
a semiconductor substrate;
a power element and a temperature sensing element formed adjacent to each other on the semiconductor substrate; and
a resistor formed around the temperature sensing element,
the temperature sensing element having a PN junction formed in the semiconductor substrate, the PN junction having a P-type region and an N-type region, one of the P-type region and the N-type region being connected to one of a ground potential VSS and a power supply potential VDD through an intermediation of the resistor,
the power element having a recess for accommodating the temperature sensing element therein, none of a well, a source, a drain, and a gate electrode of the power element being formed in the recess.

2. A semiconductor device according to claim 1, wherein a resistance value of the resistor is from 50Ω or more to 200 kΩ or less.

3. A semiconductor device according to claim 1, wherein the resistor is formed of polycrystalline silicon.

4. A semiconductor device according to claims 1,
wherein a first region having one polarity of the PN junction of the temperature sensing element is surrounded by a second region having another polarity of the PN junction of the temperature sensing element in plan view,
wherein the second region is surrounded by a third region having the same polarity as the semiconductor substrate in plan view,
wherein the second region has a second high concentration region having the same polarity as the second region,
wherein the third region has a third high concentration region having the same polarity as the third region, and
wherein at least part of the resistor is sandwiched between the second high concentration region and the third high concentration region.

5. A semiconductor device according to claim 4, wherein a width of the resistor is ½ or more of a distance between the second high concentration region and the third high concentration region.

6. A semiconductor device according to claims 1,
wherein the temperature sensing element has a rectangular shape, and
wherein at least two sides of the rectangular shape conform to an outer profile of the power element.

7. A semiconductor device according to claims 1,
wherein the temperature sensing element has a rectangular shape, and
wherein at least three sides of the rectangular shape conform to an outer profile of the power element.

8. A semiconductor device according to claims 1,
wherein the temperature sensing element has a rectangular shape, and
wherein at least four sides of the rectangular shape conform to an outer profile of the power element.

9. A semiconductor device according to claims 1, wherein a sum of a potential difference between both ends of the PN junction and a potential difference between both ends of the resistor is used as a temperature detection signal.

10. A semiconductor device according to claim 9, wherein the temperature detection signal is used to provide a delay function to a circuit configured to control the power element.

11. A semiconductor device according to claims 1, further comprising a pad,
wherein part of metal wiring for connecting the power element and the pad to each other is routed at least partially over the temperature sensing element.