[System] You are an expert US patent attorney. Draft a set of independent and dependent claims based on the provided invention description. Use correct USPTO formatting.

[User]
Title: Method For Processing Optical Signal, Optical Signal Sending Node And Optical Node

Technical Field and Background:
An optical transmission technology tends to develop towards single-channel with a higher rate (for example, single-channel with 400G/1T), higher spectral efficiency and high-order modulation format, and continuing increasing rate is thus still the most definite and important direction of development of optical transmission. There are many limits to high-speed transmission, mainly including two aspects: on one hand, the optical transmission technology develops towards high-spectral efficiency convergence transmission and high-speed service interface transmission, convergence of low speed to high speed for transmission is insignificant if spectral efficiency cannot be continuously improved, but it is also necessary to consider problems about transmission of a high-speed interface because there may be a high-speed Ethernet interface on a client side, and 400G may be a critical point of a spectral efficiency limit in the future; and on the other hand, the optical transmission technology develops towards long-distance (long-span and multi-span) transmission, and although a system OS to Noise Ratio (OSNR) may be increased by means of adopting a low-loss optical fibre, adopting a low-noise amplifier, reducing a span spacing and the like, achieved improvements are limited, and it is difficult to achieve a major breakthrough and implement a project. Along with increase of bearer network bandwidth requirements, a beyond-100G technology becomes a solution to increasing bandwidth requirements, and for no matter 400G or 1T beyond 100G, it is impossible for traditional 50 GHz fixed grid Wavelength Division Multiplexing (WDM) to provide a sufficient spectral width for implementation of the beyond-100G technology. Because of defects of a fixed grid, a requirement on a wider flexible grid is made. In the related technology, beyond-100G multi-rate mixed transmission and beyond-100G modulation format flexibility cause different channel bandwidth requirements, and if each channel is customized with a proper bandwidth, a system bandwidth may be fully utilized, thereby generating a flexible grid system. A requirement on an ultrahigh-speed WDM system continuously increases on the basis of a bandwidth requirement, so that a requirement on a flexible grid technology is introduced. However, many problems such as how to effectively implement frequency spectrum planning and management and achieve compatibility with an existing system are to be solved. For the problem of how to effectively implement frequency spectrum planning and management, for example, how to break a limit to a selected fixed rate under a beyond-100G condition, after introduction of a flexible grid technology in the related technology, there is yet no effective solution.

Invention Disclosure:
Provided are a method for processing an OS. The method includes: an OS sending node inserts OCh information into an overhead of an OMS of an OS; and/or, the OS sending node inserts the OCh information and optical carrier information into an OCh overhead of the OS, wherein the OCh information includes an identifier of the OCh, an NCF of an effective frequency slot of a media channel and a slot width of the effective frequency slot of the media channel, and a frequency slice granularity, and the optical carrier information includes: the number of optical carriers in the media channel, bit rates of the optical carriers in the media channel, modulation formats of the optical carriers in the media channel, NCFs of the optical carriers in the media channel, slot widths of the optical carriers in the media channel and a multiplexing method for the optical carriers.

[Assistant]
1. A method for processing an Optical Signal (OS), comprising:
inserting, by an OS sending node, Optical Channel (OCh) information into an Optical Multiplex Section (OMS) overhead of the OS; and
inserting, by the OS sending node, the OCh information and optical carrier information into an OCh overhead of the OS;
wherein the OCh information comprises an identifier of the OCh, a Nominal Central Frequency (NCF) of an effective frequency slot of a media channel and a slot width of the effective frequency slot of the media channel, a frequency slice granularity, wherein the optical carrier information comprises: the number of optical carriers in the media channel, bit rates of the optical carriers in the media channel, modulation formats of the optical carriers in the media channel, NCFs of the optical carriers in the media channel, slot widths of the optical carriers in the media channel and a multiplexing method for the optical carriers;
wherein when an OCh payload is supported by multiple media channels, the OCh information comprises the identifier of the OCh, an NCF of an effective frequency slot of each media channel supporting the OCh payload and slot widths of the effective frequency slots of all the media channels supporting the OCh payload, and a frequency slice granularity.

2. The method according to claim 1, wherein when different optical carriers in the media channel adopt different modulation formats and different bit rates, the optical carrier information comprises: a bit rate of each optical carrier in the media channel, a modulation format of each optical carrier in the media channel, an NCF of each optical carrier in the media channel and a slot width of each optical carrier in the media channel, and the multiplexing method for the optical carriers.

3. The method according to claim 2, wherein after the OS sending node inserts the OCh information and the optical carrier information into the overhead of the OCh of the OS, the method further comprises:
acquiring, by an intermediate optical node with a media channel matrix, the OCh information and the optical carrier information from the overhead of the OCh of the OS;
comparing, by the intermediate optical node, the acquired OCh information and optical carrier information with the expected OCh information and expected optical carrier information received from a local management plane or control plane respectively; and
based on that the acquired OCh information and optical carrier information are the same as the expected OCh information and the expected optical carrier information, switching, by the intermediate optical node, a demultiplexed media channel to another optical fibre connected with the optical node according to frequency spectrum cross connection information for configuration of media channels in the local management plane or control plane, and based on that the acquired OCh information and optical carrier information are different from the expected OCh information and the expected optical carrier information prompting, by the intermediate optical node, an alarm about a configuration error of the OCh of the OS.

4. The method according to claim 1, wherein after the OS sending node inserts the OCh information into the OMS overhead of the OS, the method further comprises:
receiving, by an intermediate optical node with a media channel matrix, the OS from the sending node;
comparing, by the intermediate optical node, the OCh information acquired from the OMS overhead of the OS with expected OCh information received from a local management plane or control plane; and
based on that the acquired OCh information is the same as the expected OCh information, demultiplexing, by the intermediate optical node, the media channel corresponding to the OCh from the OS according to the acquired OCh information, and based on that the acquired OCh information is different from the expected OCh information, prompting, by the intermediate optical node, an alarm about a configuration error of the OMS of the OS.

5. The method according to claim 4, wherein before the intermediate optical node receives the OS from the sending node, the method further comprises:
directly transmitting, by the management plane or the control plane, the expected OCh information to the intermediate optical node.

6. The method according to claim 1, wherein after the OS sending node inserts the OCh information and the optical carrier information into the overhead of the OCh of the OS, the method further comprises:
acquiring, by an intermediate optical node with a media channel matrix, the OCh information and the optical carrier information from the overhead of the OCh of the OS;
comparing, by the intermediate optical node, the acquired OCh information and optical carrier information with the expected OCh information and expected optical carrier information received from a local management plane or control plane respectively; and
based on that the acquired OCh information and optical carrier information are the same as the expected OCh information and the expected optical carrier information, switching, by the intermediate optical node, a demultiplexed media channel to another optical fibre connected with the optical node according to frequency spectrum cross connection information for configuration of media channels in the local management plane or control plane, and based on that the acquired OCh information and optical carrier information are different from the expected OCh information and the expected optical carrier information prompting, by the intermediate optical node, an alarm about a configuration error of the OCh of the OS.

7. The method according to claim 6, wherein before the intermediate optical node receives the OS from the sending node, the method further comprises:
directly transmitting, by the management plane or the control plane, the expected OCh information and the expected optical carrier information to the intermediate optical node.

8. The method according to claim 1, wherein after the OS sending node inserts the OCh information and the optical carrier information into the overhead of the OCh of the OS, the method further comprises:
when a destination node of a service born by the OS receives the OS, acquiring, by the destination node, the OCh information and the optical carrier information from the overhead of the OCh of the OS, and demodulating the OS according to the acquired OCh information and optical carrier information.

9. An Optical Signal (OS) sending node, comprising a hardware processor, configured to perform programming components stored in a memory, wherein the programming components comprise:
an insertion component configured to insert Optical Channel (OCh) information into an Optical Multiplex Section (OMS) overhead of an OS to be sent, and configured to insert the OCh information and optical carrier information into an OCh overhead of the OS;
wherein the OCh information comprises an identifier of the OCh, a Nominal Central Frequency (NCF) of an effective frequency slot of a media channel and a slot width of the effective frequency slot of the media channel, and a frequency slice granularity, wherein the optical carrier information comprises: the number of optical carriers in the media channel, bit rates of the optical carriers in the media channel, modulation formats of the optical carriers in the media channel, NCFs of the optical carriers in the media channel, slot widths of the optical carriers in the media channel, and a multiplexing method for the optical carriers;
wherein when an OCh payload is supported by multiple media channels, the OCh information comprises the identifier of the OCh, an NCF of an effective frequency slot of each media channel supporting the OCh payload and slot widths of the effective frequency slots of all the media channels supporting the OCh payload, and a frequency slice granularity.

10. An optical node with a media channel matrix, comprising a hardware processor, configured to perform programming components stored in a memory, wherein the programming components comprise:
a receiving component configured to receive an Optical Signal (OS) which bears service data from an upstream node;
a comparing component configured to compare Optical Channel (OCh) information acquired from an Optical Multiplex Section (OMS) overhead of the OS with expected OCh information received from a local management plane or control plane, wherein the OCh information comprises an identifier of an OCh, a Nominal Central Frequency (NCF) of an effective frequency slot of a media channel and a slot width of the effective frequency slot of the media channel, and a frequency slice granularity; and
an OMS processing component configured to, under the condition that the acquired OCh information is the same as the expected OCh information, demultiplex the media channel corresponding to the OCh from the OS according to the acquired OCh information, and under the condition that the acquired OCh information is different from the expected OCh information, prompt an alarm about a configuration error of the OMS of the OS;
wherein when an OCh payload is supported by multiple media channels, the OCh information comprises the identifier of the OCh, an NCF of an effective frequency slot of each media channel supporting the OCh payload and slot widths of the effective frequency slots of all the media channels supporting the OCh payload, and a frequency slice granularity.

11. An optical node with a media channel matrix, comprising a hardware processor, configured to perform programming components stored in a memory, wherein the programming components comprise:
an acquiring component configured to acquire OCh information and optical carrier information from an overhead of an Optical Channel (OCh) of a received Optical Signal (OS), wherein the OCh information comprises an identifier of the OCh, a Nominal Central Frequency (NCF) of an effective frequency slot of a media channel and a slot width of the effective frequency slot of the media channel, and a frequency slice granularity, and the optical carrier information comprises: the number of optical carriers in the media channel, bit rates of the optical carriers in the media channel, modulation formats of the optical carriers in the media channel, NCFs of the optical carriers in the media channel, slot widths of the optical carriers in the media channel and a multiplexing method for the optical carriers;
a judgment component configured to compare the acquired OCh information and optical carrier information with expected OCh information and expected optical carrier information received from a local management plane or control plane; and
an OCh processing component configured to, under the condition that the acquired OCh information and optical carrier information are the same as the expected OCh information and the expected optical carrier information, switch a demultiplexed media channel to another optical fibre connected with the optical node according to frequency spectrum cross connection information for configuration of media channels in the local management plane or control plane, and under the condition that the acquired OCh information and optical carrier information are different from the expected OCh information and the expected optical carrier information, prompt an alarm about a configuration error of the OCh of the OS;
wherein when an OCh payload is supported by multiple media channels, the OCh information comprises the identifier of the OCh, an NCF of an effective frequency slot of each media channel supporting the OCh payload and slot widths of the effective frequency slots of all the media channels supporting the OCh payload, and a frequency slice granularity.

12. The optical node according to claim 11, further comprising:
a demodulation component configured to demodulate the OS according to the OCh information and optical carrier information acquired from the overhead of the OCh by the acquiring component.


[System] You are an expert US patent attorney. Draft a set of independent and dependent claims based on the provided invention description. Use correct USPTO formatting.

[User]
Title: Ferroelectric Emitter For Electron Beam Emission And Radiation Generation

Technical Field and Background:
The invention, in some embodiments, relates to the field of electron beam emission and more particularly, but not exclusively, to ferroelectric emitters suitable for the emission of electron beams. The invention, in some embodiments, also relates to the field of millimeter waves, and more particularly, but not exclusively, to gyrotrons. Ferroelectric (FE) emitters have been investigated as a cold electron source for many applications including electron guns. After long period of scientific discussion regarding the emission mechanism, several experimental devices were demonstrated, and it was proven that the FE emitter can be integrated into microwave tubes [refs. 2-7]. Recent achievements extend the use of such emitters to S-band relativistic magnetrons [ref 8] and 95 GHz gyrotrons [ref 9]. Depending on the implementation, FE emitters may have one or more advantages including: FE emitters are cold emitters, FE emitters can withstand relatively high currents, have a relatively short (immediate) turn on time, need no conditioning, require modest vacuum to operate, and are relatively inexpensive. While thermionic emitters can emit long pulses and even continuous beams, plasma emitters such as FE emitters are limited to short-pulse operation [ref. 10]. Some of the factors which limit the duration of the pulses include the gap closure, and the plasma relaxation time that limits the pulse repetition frequency (PRF). The FE emission is a plasma-assisted effect. When an FE emitter is operated in an electron tube, surface plasma is ignited on a front electrode on the distal (front) side of the emitter and electrons are drawn towards the anode. Thus, an FE emitter is limited to short pulses (typically 100-300 ns). Pulse duration, PRF, and possible duty cycle of an electron tube are all determined by the emitter and limit the electron tube performance. Emitter lifetime is another limiting factor for ferroelectric emitters. Although FE emitters have an infinite shelf lifetime and do not need refreshing when not operative, during emitter operation generated surface plasma tends to damage the emitter surface and gradually degrades emitter performance. Lifetimes of FE emitters have been studied [refs. 11-13] where the emitters were operated in different PRF's in the range of 1 Hz-1 kHz. Research to prolong the pulse duration of electron beams generated in tubes having FE emitters has been done. Early attempts are reported in the work of Advani et al. [ref 14] where a 5 microsecond single pulse is achieved from an 11.4 cm diameter annular ferroelectric emitter. This emitter was designed for a gyrotron but it was not implemented in an FE tube, and no radiation was obtained. Prolonging of pulse duration in different plasma emitters, based on explosive emission, was reported by Engelko [ref 10] where multipoint ignition was used to overcome the plasma limitation, generating a 30 microsecond current pulse length. This demonstration included an electron gun, but radiation from an electron tube was not reported. Engleko's method was later implemented by Gleizer et al. [ref. 15] with FE emitters, obtaining single pulses of ˜6 microsecond, reporting an electron beam, but without generating radiation. Radiation from an FE tube has been reported by Hadas et al. [ref. 8], where an S-Band magnetron with an FE emitter was compared to the same tube with an explosive emission emitter. The use of the ferroelectric emitter extended the duration of the radiated pulse by 30% to 100 ns, and increased the microwave radiation power by ˜10%. It is clearly determined in the experiment that the FE emitter is ˜30% more efficient than an explosive emission emitter in the tested tube. In other studies demonstrating the integration of ferroelectric emitter in electron tubes in a gyrotron [refs. 3, 4], a PRF of 3 MHz and duty cycle of up to 50% was measured with 150 ns pulses. However, FE emitter tubes with long pulses were not reported.

Invention Disclosure:
Disclosed are methods and devices suitable for generating electron beams and pulses of radiation. Specifically, in some disclosed embodiments, multiple emitting electrodes of a ferroelectric emitter are sequentially activated, generating a relatively long electron beam pulse that is substantially a series of substantially consecutive short electron beam pulses generated by the sequentially-activated individual emitting electrodes.

[Assistant]
1. A ferroelectric emitter, comprising:
an emitter body having a distal face and a proximal face;
a proximal electrode in contact with at least a portion of the proximal face;
at least one first distal electrode, located at the distal face of the emitter body;
at least one first trigger;
wherein the first trigger is configured to activate the first distal electrode by applying potential pulses to the first distal electrode to cause a first plurality of electrons to be released from the first distal electrode to produce at least one first beam pulse;
at least one second distal electrode, located at the distal face of the emitter body;
at least one second trigger;
wherein the second trigger is configured to activate the second distal electrode independently from the activation of the first distal electrode by applying potential pulses to the second distal electrode to cause a second plurality of electrons to be released from the second distal electrode to produce at least one second beam pulse;
wherein the ferroelectric emitter is configured to produce an electron beam, consisting of the first beam pulse and the second beam pulse.

2. The ferroelectric emitter of claim 1, wherein the first distal electrode and the second distal electrode are coplanar.

3. The ferroelectric emitter of claim 1, wherein the ferroelectric emitter achieves a pulse repetition frequency of up to 3 MHZ, a duty cycle of the electron beam is from 0% to 100%, and a pulse length of the electron beam is up to 7.5 microseconds.

4. The ferroelectric emitter of claim 1, wherein the emitter body is made of a ferroelectric material.

5. The ferroelectric emitter of claim 1, wherein the at least two distal electrodes are exposed to plasma and are made of a conductive material.

6. The ferroelectric emitter of claim 1, wherein the proximal electrode is not exposed to plasma and is made of a conductive material.

7. The ferroelectric emitter of claim 1, wherein the proximal electrode is associated with a power source.

8. The ferroelectric emitter of claim 1, wherein the potential pulses have a width between 50 ns and 1000 ns.

9. A holder-emitter assembly, comprising:
an electrically-insulating holder having an open end; and
the ferroelectric emitter of claim 1 placed in the electrically-insulating holder,
wherein the open end of the electrically-insulating holder is covered with a conductive grid placed at a distance from the distal face of the ferroelectric emitter.

10. An electron gun, comprising:
a casing defining a chamber;
the holder-emitter assembly of claim 9 placed on a first end of the chamber;
an anode having a gap in the center placed on a second end of the chamber; and
an external gun solenoid inducing a constant axial magnetic field surrounding the electron gun.

11. The electron gun of claim 10, wherein the anode is grounded.

12. The electron gun of claim 10, wherein the casing is made of an insulator.

13. The electron gun of claim 10, wherein a DC potential is applied to the proximal electrode and to the grid.

14. The electron gun of claim 10, wherein the electron beam accelerated towards and past the grid by an electric field formed by a potential difference in the chamber.

15. The electron gun of claim 10, wherein the magnetic field induced by the external gun solenoid limits a radial expansion of the electrons released from the at least two distal electrodes and guides the electron beam through the gap of the anode.

16. A gyrotron tube driven by the electron gun of claim 10, comprising:
a tube solenoid configured to generate an magnetic field;
a cavity having a first end connecting the anode of the electron gun and a second end having an output window,
wherein the electron beam generated by the electron gun exits through the gap of the anode and enters the cavity from the first end of the cavity, and an electromagnetic radiation is emitted through the output window at the second end of the cavity; and
an electrons impact electron collector on a side of the cavity.

17. The gyrotron tube of claim 16, wherein the operation of the electron gun and the tube solenoid is synchronized so that the electron beam propagates through the magnetic field generated by tube solenoid.

18. The gyrotron tube of claim 16, wherein during an interaction of the electrons of the electron beam with the magnetic field generated by tube solenoid, the electrons are forced to adopt cyclotron motion in the magnetic field, thereby generating the electromagnetic radiation.

19. The gyrotron tube of claim 16, wherein the electrons impact electron collector is configured to dissipate heat and charge generated during the operation of the gyrotron.

20. A method for generating an electron beam, comprising:
a) providing a ferroelectric emitter, wherein the ferroelectric emitter comprises:
an emitter body having a distal face and a proximal face;
a proximal electrode in contact with at least a portion of the proximal face;
at least one first distal electrode, located at the distal face of the emitter body;
at least one first trigger;
wherein the first trigger is configured to activate the first distal electrode by applying potential pulses to the first distal electrode to cause a first plurality of electrons to be released from the first distal electrode to produce at least one first beam pulse;
at least one second distal electrode, located at the distal face of the emitter body;
at least one second trigger;
wherein the second trigger is configured to activate the second distal electrode independently from the activation of the first distal electrode by applying potential pulses to the second distal electrode to cause a second plurality of electrons to be released from the second distal electrode to produce at least one second beam pulse;
wherein the ferroelectric emitter is configured to produce an electron beam, consisting of the first beam pulse and the second beam pulse; and
independently activating the first trigger to produce the first beam pulse; and
independently activating the second trigger to produce the second beam pulse.

21. The method of claim 20, further comprising:
during said independently activating the first distal electrode and the second distal electrode, varying a duty cycle of said ferroelectric emitter.

22. The method of claim 21, wherein said varying the duty cycle of said ferroelectric emitter comprises changing at least one variable selected from the group of variables consisting of:
a pulse width of at least one of the first distal electrode and the second distal electrode;
an inter-pulse interval of at least one of the first distal electrode and the second distal electrode;
a pulse-repetition frequency of at least one of the first distal electrode and the second distal electrode; and
a duty cycle of at least one of the first distal electrode and the second distal electrode.

23. The method of claim 20, wherein said independently activation of the first distal electrode and the second distal electrode comprises:
from the first distal electrode, generating the first beam pulse for a first period of time having a first starting time, a first duration, and a first ending time; and
subsequent to said first starting time, from the second distal electrode, generating the second beam pulse for a second period of time having a second starting time, a second duration, and a second ending time,
wherein said second ending time is subsequent to said first ending time.

24. The method of claim 20, wherein said independently activation of the first distal electrode and the second distal electrode comprises:
from the first distal electrode, generating the first beam pulse for a first period of time having a first starting time, a first duration, and a first ending time; and
subsequent to said first ending time, from the second distal electrode, generating the second beam pulse for a second period of time having a second starting time, a second duration, and a second ending time.

25. A method of generating radiation comprising:
generating an electron beam pulse according to the method of claim 20; and
directing said generated electron beam pulse to enter a magnetic field, thereby generating radiation.

26. A method of generating radiation comprising:
generating an electron beam pulse according to the method of claim 20; and
directing said generated electron beam pulse to drive a radiation-generating device the radiation-generating device thereby generating radiation.

27. The method of claim 26, wherein said radiation-generating device is a gyrotron tube.

28. The method of claim 26, wherein the frequency of the generated radiation is between 1 and 300 GHz.

29. The method of claim 20, wherein the ferroelectric emitter achieves a pulse repetition frequency of up to 3 MHZ, a duty cycle of the electron beam is from 0% to 100%; and a pulse length of the electron beam is up to 7.5 microseconds.


[System] You are an expert US patent attorney. Draft a set of independent and dependent claims based on the provided invention description. Use correct USPTO formatting.

[User]
Title: Transmitter, Common Mode Transceiver Using The Same, And Operating Method Thereof

Technical Field and Background:
1. Field of the Invention The invention relates to a radio frequency technique, and particularly relates to a transmitter, a common mode transceiver using the transmitter and an operating method thereof. 2. Description of Related Art In a communication system, if a distance between two communication equipment is very far away, a problem that the two equipment have different ground potentials is encountered. According to a commonly used conventional technique, there are two solutions for resolving the above problem. Referring to FIG. 1 for the first conventional solution, FIG. 1 is a structural diagram of ground potential connection between the two communication equipment in the communication system. Besides that a transmission interface between the two communication equipment EQ 1 , EQ 2 is used for transmitting signals (for example, the transmitted signals include an interface voltage Vbus), ground potential signal pins of the two communication equipment are connected to achieve a same ground potential GND. However, such solution has two disadvantages, and the first disadvantage is that a connection port of the communication equipment is required to use the ground potential signal pin, and the second disadvantage is that when the ground potential between the two communication equipment EQ 1 and EQ 2 is excessively large, when the different ground potentials are forced to be connected, since a resistance of a connection line is in a micro-ohm level, a large current (I=V/R) is probably generated, and the large current is bound to produce a magnetic field to influence a normal signal communication, which may cause communication failure. Referring to FIG. 2 for the second conventional solution, FIG. 2 is a structural diagram of the two communication equipment in the communication system having a common mode range interface. The communication equipment EQ 1 and EQ 2 are implemented by common mode transceivers, and in a common mode voltage range, the communication equipment EQ 1 and EQ 2 are allowed to have different ground potentials. Referring to FIG. 3 , FIG. 3 is a structural diagram based on FIG. 2 , which illustrates a positive ground potential offset between the communication equipment EQ 1 and EQ 2 . For example, when the common mode voltage range of the communication equipment EQ 1 is 0V to 5V, and the positive ground potential offset is 7V, a demand of the common mode voltage range of the communication equipment EQ 2 is 7V to 12V. Moreover, referring to FIG. 4 , FIG. 4 is a structural diagram based on FIG. 2 , which illustrates a negative ground potential offset between the communication equipment EQ 1 and EQ 2 . For example, when the common mode voltage range of the communication equipment EQ 1 is 0V to 5V, and the negative ground potential offset is −7V, a demand of the common mode voltage range of the communication equipment EQ 2 is −7V to −2V. On the other hand, if the communication equipment EQ 2 is required to simultaneously deal with the positive ground potential offset and the negative ground potential offset, a demand of the common mode voltage range thereof is −7V to +12V. When the communication equipment EQ 1 and EQ 2 are all common mode transceivers, and the positive ground potential offset or the negative ground potential offset exists between the two communication equipment EQ 1 and EQ 2 , according to related regulation, signals are required to be normally transceived within the ground potential offset range and additional leakage is not allowed. Referring to FIG. 5 or FIG. 6 . FIG. 5 is a schematic diagram of a leakage path when a transmitter of the common mode transceiver has the positive ground potential offset. FIG. 6 is a schematic diagram of a leakage path when the transmitter of the common mode transceiver has the negative ground potential offset. Generally, a pull-up circuit 11 or a pull-down circuit 12 of the transmitter 10 of the transceiver all have a parasitic diode. In FIG. 5 , when the interface voltage Vbus is greater than a power voltage VDD, a leakage path where current flows from the interface voltage Vbus to the power voltage VDD through the parasitic diode is formed. Similarly, in FIG. 6 , when the interface voltage Vbus is smaller than the ground potential GND, a leakage path where current flows from the ground potential GND to the interface voltage Vbus through the parasitic diode is formed. In order to resolve the problem of the leakage path, referring to FIG. 7 , FIG.

Invention Disclosure:
A transmitter, a common mode transceiver using the same, and an operating method thereof are provided. The transmitter includes a first transistor group and a second transistor group. The first transistor group includes a first transistor connected in series with a second transistor, wherein the second transistor is applied a first well-tracking control. The second transistor group includes a third transistor connected in series with a fourth transistor, wherein the third transistor is applied a second well-tracking control. There is an output node between the first transistor group and the second transistor group, and the second transistor and the third transistor are coupled to the output node. The present invention can effectively block leakage paths in common mode operation, and can enhance ESD protection capability.

[Assistant]
1. A transmitter of a common mode transceiver, comprising:
a first transistor group, comprising a first transistor and a second transistor connected in series with each other, wherein the second transistors is applied a first well-tracking control; and
a second transistor group, comprising a third transistor and a fourth transistor connected in series with each other, wherein the third transistor is applied a second well-tracking control,
wherein there is an output node between the first transistor group and the second transistor group, and the second transistor and the third transistor are coupled to the output node.

2. The transmitter of the common mode transceiver as claimed in claim 1, further comprising:
a first circuit, coupled to the output node and a ground potential, and configured to perform transient voltage suppression.

3. The transmitter of the common mode transceiver as claimed in claim 1, wherein the second transistor has a second circuit, the second circuit performs the first well-tracking control, and controls a first well-voltage of the second transistor according to a first highest voltage exerted to a source or a drain of the second transistor; the third transistor has a third circuit, and the third circuit performs the second well-tracking control, and controls a second well-voltage of the third transistor according to a second highest voltage exerted to a source or a drain of the third transistor.

4. The transmitter of the common mode transceiver as claimed in claim 1, wherein the first transistor and the second transistor are respectively a low-voltage P-type metal oxide semiconductor transistor and a high-voltage P-type metal oxide semiconductor transistor, and a circuit area of the first transistor is configured between ½ and ¼ of a circuit area of the second transistor.

5. The transmitter of the common mode transceiver as claimed in claim 1, wherein the third transistor and the fourth transistor are respectively a high-voltage N-type metal oxide semiconductor transistor and a low-voltage N-type metal oxide semiconductor transistor, and a circuit area of the fourth transistor is configured between ½ and ¼ of a circuit area of the third transistor.

6. A common mode transceiver, comprising:
a transmitter, comprising:
an output stage, comprising:
a first transistor group, comprising a first transistor and a second transistor connected in series with each other, wherein the second transistor is applied a first well-tracking control; and
a second transistor group, comprising a third transistor and a fourth transistor connected in series with each other, wherein the third transistor is applied a second well-tracking control, there is an output node between the first transistor group and the second transistor group, and the second transistor and the third transistor are coupled to the output node; and

7. The common mode transceiver as claimed in claim 6, wherein the second transistor has a second circuit, the second circuit performs the first well-tracking control, and controls a first well-voltage of the second transistor according to a first highest voltage exerted to a source or a drain of the second transistor; the third transistor has a third circuit, and the third circuit performs the second well-tracking control, and controls a second well-voltage of the third transistor according to a second highest voltage exerted to a source or a drain of the third transistor.

8. The common mode transceiver as claimed in claim 6, wherein the first transistor and the second transistor are respectively a low-voltage P-type metal oxide semiconductor transistor and a high-voltage P-type metal oxide semiconductor transistor, and a circuit area of the first transistor is configured between ½ and ¼ of a circuit area of the second transistor.

9. The common mode transceiver as claimed in claim 6, wherein the third transistor and the fourth transistor are respectively a high-voltage N-type metal oxide semiconductor transistor and a low-voltage N-type metal oxide semiconductor transistor, and a circuit area of the fourth transistor is configured between ½ and ¼ of a circuit area of the third transistor.

10. An operating method of a common mode transceiver, comprising:
providing a first transistor group comprising a first transistor and a second transistor connected in series with each other;
providing a second transistor group comprising a third transistor and a fourth transistor connected in series with each other; and
respectively operating the second transistor and the third transistor by performing a first well-tracking control and a second well-tracking control.

11. The operating method of the common mode transceiver as claimed in claim 10, further comprising:
providing a first circuit coupled to the output node and a ground potential to perform transient voltage suppression.

12. The operating method of the common mode transceiver as claimed in claim 10, wherein the step of respectively operating the second transistor and the third transistor by performing the first well-tracking control and the second well-tracking control comprises:
configuring a second circuit to the second transistor, wherein the second circuit performs the first well-tracking control, and controls a first well-voltage of the second transistor according to a first highest voltage exerted to a source or a drain of the second transistor; and
configuring a third circuit to the third transistor, wherein the third circuit performs the second well-tracking control, and controls a second well-voltage of the third transistor according to a second highest voltage exerted to a source or a drain of the third transistor.

13. The operating method of the common mode transceiver as claimed in claim 10, wherein the first transistor and the second transistor are respectively a low-voltage P-type metal oxide semiconductor transistor and a high-voltage P-type metal oxide semiconductor transistor, and a circuit area of the first transistor is configured between ½ and ¼ of a circuit area of the second transistor.

14. The operating method of the common mode transceiver as claimed in claim 10, wherein the third transistor and the fourth transistor are respectively a high-voltage N-type metal oxide semiconductor transistor and a low-voltage N-type metal oxide semiconductor transistor, and a circuit area of the fourth transistor is configured between ½ and ¼ of a circuit area of the third transistor.


[System] You are an expert US patent attorney. Draft a set of independent and dependent claims based on the provided invention description. Use correct USPTO formatting.

[User]
Title: Backside Illuminated (Bsi) Cmos Image Sensor (Cis) With A Resonant Cavity And A Method For Manufacturing The Bsi Cis

Technical Field and Background:
Complementary metal oxide semiconductor (CMOS) image sensors (CIS) are manufactured using CMOS technology. In backside illuminated (BSI) CISs radiation sensed by the BSI CIS does not propagate through metal and dielectric layers. FIG. 1 includes various cross sections that illustrate the manufacturing process of a prior art BSI CIS. The manufacturing process may include: a. Manufacturing a sensor wafer 20 that may be an epitaxial (epi) sensor wafer. The sensor wafer 20 may include a bulk (Bulk Si) 21 , an active Silicon (Si) layer 22 which is an epitaxial grown Si, dielectric and metal layers (“back end”) 23 and first oxide adhesion layer 24 . b. Manufacturing a carrier wafer 30 which includes Si bulk 31 and a second oxide adhesion layer 32 . c. Bonding the sensor wafer 20 to the carrier wafer 30 to form wafer 40 by attaching the first and second oxide adhesion layers 24 and 32 to each other. d. Removing the Si bulk 21 to expose active Si layer 22 . e. On top of the active Si layer 22 adding layers such as micro lenses 41 , color filters (CFA) 42 and anti-reflective coating (ARC) layer 43 by a process that may include passivation, deposition of anti-reflecting coating, fabricating color filters, fabricating micro-lenses, and pad opening. ARC layer 43 prevents the reflection of light that propagates towards the active Si layer. In several applications, and especially for three dimensional imaging, there is a need for high resolution sensors (and thus small pixels sensor) which have good quantum efficiency (QE) in the Near Infrared (NIR) and good modulation transfer function (MTF)—providing no crosstalk between pixels. These requirements usually contradict each other since in NIR, the Si absorption coefficient is small, and a quite thick (much more than 10 microns) active Si layer is needed. Pixels with dimensions that are significantly smaller than the active Si layer thickness are prone to severe crosstalk due to lateral diffusion of the generated carriers. Furthermore, a typical request for such sensors is to be sensitive in a very narrow and specific wavelength, namely the light emitting diode (LED) and/or laser wavelength which this sensor is planned to detect. Other wavelengths are considered “background” illumination which has no contribution and in contrary add noise. An external narrow band optical filter is usually used to avoid it. Two known solution to the MTF/QE strong tradeoff are using high resistivity epitaxial material (epi) and using black Silicon. Using high resistivity material includes forming the sensor on a thick epi, but with very low doping level (high resistivity epi). This makes depletion regions much larger and the fields formed by the photodiode penetrate deep into the epi layer. The carriers are swept towards the surface by the field rather than by diffusion. This reduces significantly the cross-talk. Black Silicon is formed by processing the surface of the Si in order to change the direction of the incident photons. The black Silicon becomes a good NIR absorber even for shallow Si layer. Nevertheless, the issue of cross-talk remains and must be treated separately. There is a growing need to provide a BSI CIS that exhibit high resolution, good quantum efficiency in NIR and good MTF—providing no crosstalk between pixels.

Invention Disclosure:
A backside illuminated semiconductor image sensor that includes a Fabry-Perot resonator tuned to absorb near infrared (NIR) radiation; wherein the Fabry-Perot resonator comprises a front reflector, a back reflector and an active Silicon layer between the front reflector and the back reflector.

[Assistant]
1. A backside illuminated semiconductor image sensor that consists essentially of a bulk and a Fabry-Perot resonator, wherein the Fabey-Perot resonator is configured to sense light that passes through the bulk before reaching the Fabey-Perot resonator, wherein the Fabry-Perot resonator is tuned to absorb near infrared radiation; and wherein the Fabry-Perot resonator comprises a front reflector, a back reflector and an active Silicon layer between the front reflector and the back reflector.

2. The backside illuminated semiconductor image sensor according to claim 1, wherein the Fabry-Perot resonator comprises metal and dielectric layers that are positioned between the active Silicon layer and the back reflector.

3. The backside illuminated semiconductor image sensor according to claim 1, further comprising a bulk that differs from the back reflector and wherein the back reflector is made of metal.

4. The backside illuminated semiconductor image sensor according to claim 1, wherein the back reflector comprises multiple dielectric layers.

5. The backside illuminated semiconductor image sensor according to claim 1, wherein a thickness of the Fabry-Perot resonator ranges between one and ten microns.

6. The backside illuminated semiconductor image sensor according to claim 1, wherein the Fabry-Perot resonator has multiple spaced apart resonance wavelengths within a range that spans from 700 nanometers and 1000 nanometers.

7. The backside illuminated semiconductor image sensor according to claim 1, wherein the front reflector and the back reflector are fabricated from backend Silicon Oxide and Silicon Nitride dielectrics.

8. The backside illuminated semiconductor image sensor according to claim 1 wherein a reflectivity of the front reflector is 0.95 and a reflectivity of the back reflector is 0.8.

9. The backside illuminated semiconductor image sensor according to claim 1 wherein the backside illuminated semiconductor image sensor consists of the Fabry-Perot resonator and the bulk.

10. The backside illuminated semiconductor image sensor according to claim 1 wherein the Fabry-Perot resonator consists essentially of the front reflector, the back reflector, the active Silicon layer between the front reflector and the back reflector, and metal and dielectric layers that are positioned between the active Silicon layer and the back reflector.

11. The backside illuminated semiconductor image sensor according to claim 10, wherein the back reflector is made of metal.

12. The backside illuminated semiconductor image sensor according to claim 10, wherein the back reflector consists essentially of multiple dielectric layers.

13. The backside illuminated semiconductor image sensor according to claim 10, wherein a thickness of the Fabry-Perot resonator ranges between one and ten microns.

14. The backside illuminated semiconductor image sensor according to claim 10, wherein the front reflector and the back reflector are fabricated from backend Silicon Oxide and Silicon Nitride dielectrics.

15. The backside illuminated semiconductor image sensor according to claim 1 wherein the back reflector is embedded in dielectric and metal layers of the Fabey-Perot resonator.


[System] You are an expert US patent attorney. Draft a set of independent and dependent claims based on the provided invention description. Use correct USPTO formatting.

[User]
Title: Load And Torque Sensing Systems Utilizing Magnetic Key For Mechanical Engagement

Technical Field and Background:
There are numerous mechanical assemblies for bearing or transmitting forces where it is necessary to establish and maintain a physical relationship between two associated components by means of a third “locking” component such as a key or pin. As one example, a clevis pin is often held in place between the two legs of a clevis by means of a Cotter pin. The Cotter pin prevents the clevis pin from moving relative to the clevis or shackle. As another example, a shaft may be coupled to another shaft or a collar by means of a key or set of keys. Here, the key prevents relative rotational movement of the two components it “locks” together. In both of these examples, the third component; i.e., the Cotter pin or the key, is held in place either by a friction fit or by mechanical deformation after being set in place. In either case, disassembly of the system typically requires the use of tools and often requires replacement of the locking component, particularly if the system is reassembled numerous times. This disadvantage is particularly significant in the case of load and torque sensing systems used either in a design process or in a monitoring role where disassembly is frequent and/or components are fragile and/or expensive.

Invention Disclosure:
Torque is transmitted by way of a shaft having an axial groove formed as a keyway therein and a key held in the groove by means of a coin-shaped magnet located in a pocket formed in the floor of the groove. A second element, such as a coupling, is configured to receive the shaft and key therein and has a matching keyway.

[Assistant]
1. A torque transmitting apparatus comprising:
a ferromagnetic shaft having an axis of rotation and an outer surface; an elongate, axially extending keyway having a floor of pre-determined depth formed in said surface;
a ferromagnetic key magnetically held in the keyway and of a height greater than the depth of said floor so as to extend radially outwardly beyond said outer surface;
an annular coupling having an axial through bore with an interior surface dimensioned to receive said shaft therein; and
an elongate axially extending keyway substantially identical to the keyway in said shaft formed in said interior surface such that the shaft keyway and the coupling keyway can be aligned, the ferromagnetic key being disposed in both the shaft keyway and the coupling keyway thereby to create a torque transmitting couple between said shaft and said coupling.

2. The apparatus described in claim 1 wherein thekeyway in the shaft has having a formed in the floor thereof; and a magnet disposed in the cavity and flush with the floor to hold the key in the keyway.

3. The apparatus described in claim 1 wherein the keyways have closed ends so as to trap the key axially therein.

4. A torque transmitting system comprising:
a driving shaft having an outer surface;
a driven shaft having an outer surface;
a two-part coupling having inner surfaces configured to receive said shafts therein in coaxial alignment with one another;
each of said driving and driven shafts having a keyway formed in the outer surface thereof in a location which lies within a coupling part when in the coaxial aligned relationship;
each of said coupling parts having a keyway formed in an inner surface thereof with a configuration matching a keyway formed in the outer surface of the shaft located therein; and
keys fitted into the keyways created by the aligned shafts in respective coupling parts and held in said keyway solely substantially by magnetism to couple the shafts to one another through the two-part coupling for the transmission of torque.

5. A torque transmitting system defined in claim 4 wherein each of the keys is made of a ferromagnetic material to transmit magnetic flux therethrough, and each of said driving and driven shafts is made of a ferromagnetic material.

6. A load detector assembly comprising:
a ferromagnetic shaft;
a strain gage carried by the shaft for producing an electrical signal indicating a force supplied to the shaft so as to cause flexure thereof;
a keyway slot formed in the shaft;
an annular receiver body having an opening adapted to receive the shaft therein with a fit that allows relative rotation between the shaft and body opening;
a stop formed on the body adjacent said opening; and
a ferromagnetic key configured to fit in said shaft slot and an interfering contact with said stop to prevent relative rotation between the shaft and body;
said key being held in said slot and against said stop substantially exclusively by magnetism.

7. The load detector assembly described in claim 6 wherein said body is a shackle and the shaft supports a pulley.


[System] You are an expert US patent attorney. Draft a set of independent and dependent claims based on the provided invention description. Use correct USPTO formatting.

[User]
Title: High Temperature Control Knob

Technical Field and Background:
1. Technical Field of the Invention The invention relates to temperature control devices. More particularly the invention relates to temperature control devices for retrofitting appliances in order to prevent the temperature from exceeding a predetermined maximum temperature. Even more particularly, the invention pertains to a high temperature control knob which may be utilized on an existing appliance, such as a stove or oven, without the addition of additional electronic wiring to the appliance. 2. Prior Art The prior art includes devices for regulating temperature using sensors which are found on thermostat type devices. The prior art of record shows a number of devices for controlling the temperature of the surface of an oven. A problem with existing technology is that it is not easily adaptable to the numerous models of appliances in the market place to control the temperature of a substance, such as oil in a container. The invention discloses a high temperature control knob that may be used on any existing appliance.

Invention Disclosure:
The invention is a high temperature control knob that is installed on the power control knob stem of an existing appliance to prevent a material being heated from reaching a predetermined maximum temperature (e.g., the burning point temperature for oil), and thereby preventing an undesired event (e.g., a fire). The high temperature control knob comprises an alignment means having at least one stop that is adjustable about a set of temperature markings containing the predetermined maximum temperature, and may further comprise a dial with an arm that mounts of the power control knob stem. The at least one stop may be aligned to the predetermined maximum temperature by rotating the alignment means about the power control knob stem and tightening a fixing means to hold the alignment means in place. The arm of the dial contacts the at least one stop preventing the appliance from exceeding the predetermined maximum temperature.

[Assistant]
1. A high temperature control knob comprising an alignment means and a rear plate; the alignment means further comprising a disc portion and a raised portion; the alignment means having at least one stop; the alignment means disposed around a control knob stem; the control knob stem extending from a face of an appliance; the at least one stop being adjustable about an arc; the at least one stop arresting an arm of a dial when the dial is mounted on said control knob stem and turned along the arc contacting the at least one stop; and the alignment means located between the dial and the face of the appliance; the rear plate disposed placed around said control knob stem and affixed to the appliance; and the rear plate having a set of temperature markings disposed placed on the rear plate and to be observable when the alignment means is on the control knob stem; the rear plate disposed between the alignment means and the face of the appliance; and the face of the appliance having original temperature markings.

2. The high temperature control knob of claim 1, wherein
the raised portion is disposed circumferentially on the disc portion; the raised portion having the at least one stop; the raised portion disposed generally perpendicular to a longitudinal axis of the control knob stem; the disc portion having an adjusting means; the adjusting means being a first slot and a second slot; the first slot and the second slot configured to align with a threaded aperture and a second threaded aperture, respectively, of the appliance; the adjusting means disposed on an inner face of said disc portion; and the adjusting means allowing said disc portion to be rotated about the longitudinal axis of said control knob stem and fixed using a fixing means once the at least one stop is aligned with a predetermined maximum temperature.

3. The high temperature control knob of claim 2 wherein the fixing means is at least a first screw and a second screw of the appliance; the first screw configured to fit in a threaded aperture and the second screw configured to fit a second threaded aperture on the face of the appliance; the alignment means disposed about the control knob stem; the first screw passing through the first slot in the alignment means and further passing into the threaded aperture and the second screw passing through the second slot in the alignment means and further passing into the second threaded aperture; the fixing means fixing the alignment means relative to the face of the appliance.

4. The high temperature control knob of claim 3, wherein said alignment means is fixed relative to the face of the appliance by tightening the first screw into the threaded aperture and the second screw in the second threaded aperture on the face of the appliance; a head underside on each of the first screw and the second screw against the inner face of the disc portion around the first slot and the second slot.

5. The high temperature control knob of claim 2,
wherein at least a first slot on the inner face of the disc portion is disposed placed to allow for said disc portion to be turned along said control knob stem and fixed by tightening at least a first screw into a threaded aperture on the face of the appliance; a head underside of the first screw pressing against the inner face of the disc portion of the alignment means around the first slot.

6. The high temperature control knob of claim 1 wherein an adapter is sized to be placed in a depression of said dial, the adapter mounted on the control knob stem; and the adapter connecting the dial to the control knob stem.

7. The high temperature control knob of claim 1 further comprising the dial; the dial mounted using on the control knob stem using an adapter; a first end of the adapter inserted in a depression in the dial; and the control knob stem inserted in a second end of the adapter.

8. The high temperature control knob of claim 1 further comprising a fixing means; the fixing means being at least a first screw; at least the first screw passing through at least a first slot in the alignment means and further passing into at least a first threaded aperture located around the control knob stem; the fixing means fixing the alignment means relative to the face of the appliance.

9. A high temperature control knob comprising an alignment means, a rear plate, and a dial; the alignment means further comprising a disc portion and a raised portion; the dial of the high temperature control knob mounted on a control knob stem; the control knob stem located on a face of an appliance; the control knob stem having a longitudinal axis; said control knob stem rotating around the longitudinal axis of the control knob stem; said control knob stem extending from the face of the appliance; an arm of the dial movable to at least a predetermined maximum temperature; said alignment means having at least a one stop; at least the one stop aligned with at least the predetermined maximum temperature; the rear plate disposed between the face of the appliance and the alignment means; the face of the appliance having original temperature markings; and the rear plate configured to mask the original temperature markings; said alignment means attached to the face of the appliance; at least the one stop preventing the arm of the dial from turning past the predetermined maximum temperature.

10. The high temperature control knob of claim 9, wherein the raised portion is disposed circumferentially on said disc portion; the raised portion having at least the one stop; and at least a first slot disposed on an inner face of said disc portion allowing for said disc portion to be rotated about said control knob stem so that at least the one stop is aligned with the predetermined maximum temperature; and said alignment means fixed using a fixing means.

11. A high temperature control knob of claim 10 wherein the dial is mounted using an
adapter on the control knob stem;
a first end of the adapter inserted in a depression in the dial; and the control knob stem inserted in a second end of the adapter.

12. The high temperature control knob of claim 9 wherein the predetermined maximum
temperature is about an arc; and at least the one stop is aligned with the predetermined maximum temperature.

13. The high temperature control knob of claim 9 further wherein:
the dial is attached to the control knob stem and the arm moving along an arc by rotating the control knob stem; and
wherein at least the one stop of the alignment means is along the arc and aligned with the predetermined maximum temperature.

14. The high temperature control knob of claim 13 wherein the alignment means further comprises a fixing means; the fixing means fixing at least the one stop.

15. The high temperature control knob of claim 14 wherein the alignment means
comprises a disc portion and a raised portion; at least a first slot being located on the disc portion; the fixing means passing through at least the first slot in the alignment means and fixing the alignment means with at least the one stop relative to the face of the appliance.

16. The high temperature control knob of claim 15 wherein at least the first slot is located and sized for the fixing means; the first slot disposed to allow the fixing means to move along the first slot as the alignment means turns about the control knob stem; the fixing means passing through the first slot.

17. The high temperature control knob of claim 16 wherein the rear plate has a set of temperature markings and at least a first rear slot; the rear plate is attached to the appliance around the control knob stem of the control knob stem; the first rear slot aligned with the first slot; the first slot aligned with at least a first threaded aperture around the control knob stem; the fixing means disposed through the first slot and the first rear slot into the first threaded aperture.


[System] You are an expert US patent attorney. Draft a set of independent and dependent claims based on the provided invention description. Use correct USPTO formatting.

[User]
Title: 2G Support For 2G And 3G/4G Envelope Tracking Modulator

Technical Field and Background:
1. Field of the Invention The invention relates to envelope tracking modulated power supplies suitable for radio frequency power amplifier applications. The invention is particularly concerned with such power supplies in which a reference signal is used as an input to a low frequency path and a high frequency path, and in which each path generates separate outputs which are combined to form a supply voltage. 2. Description of the Related Art Envelope tracking power supplies for radio frequency power amplifiers are well-known in the art. Typically a reference signal is generated based on an envelope of an input signal to be amplified. An envelope tracking power supply generates a supply voltage for the power amplifier which tracks the envelope of the input signal to be amplified. FIG. 1 shows a prior art envelope tracking (ET) modulator architecture in which a frequency splitter 12 is used to divide an incoming envelope reference signal on line 10 into a high frequency (HF) path signal on line 14 and a low frequency (LF) path signal on line 16 . The frequency splitter 12 may include a low pass filter 18 in the low frequency path and a high pass filter 20 in the high frequency path. The signal in the LF path on line 16 is amplified by an efficient switched mode amplifier 22 , and the signal in the HF path on line 14 is amplified by a wideband linear amplifier 24 . A frequency selective combiner 26 is used to combine the signals in the LF and HF paths after amplification. In FIG. 1 the combiner 26 is illustrated as including a low frequency combining element 28 in the low frequency path, and a high frequency combining element 30 in the high frequency path. A combined signal from the combiner 26 on line 32 provides a feed to a load 34 , which in a typical application is a power amplifier (PA). An example of a power amplifier system incorporating a supply architecture such as illustrated in FIG. 1 can be found in “Band Separation and Efficiency Optimisation in Linear-Assisted Switching Power Amplifiers”, Yousefzadeh et al, [IEEE Power Electronics Specialists Conference 2008. FIG. 2 shows an alternative prior art arrangement in which the frequency selective combiner 26 is an inductor-capacitor (LC) combiner. The low frequency combining element is an inductor 28 a, and the high frequency combining element is a capacitor 30 a. In this arrangement a feedback path 36 takes a signal from the combiner (or modulator) output on line 32 , to the input of the linear amplifier 24 . The signal on the feedback path 36 is subtracted from the signal in the high frequency path on line 14 by subtractor 38 , to provide an input to the linear amplifier 24 . The inclusion of this feedback path 36 achieves improved tracking accuracy compared to the arrangement of FIG. 1 . An example of a power amplifier system incorporating a supply architecture such as illustrated in FIG. 2 can be found in “Efficiency Optimisation in Linear-Assisted Switching Power Converters for Envelope Tracking in RF Power Amplifiers”, Yousefzadeh et al, [IEEE Symposium on Circuits and Systems 2005. It is an aim of the invention to provide an improved envelope tracking modulated power supply which addresses one or more of the above-stated problems.

Invention Disclosure:
There is provided an amplification stage including an envelope tracking modulated supply for tracking a reference signal, comprising a low frequency path for tracking low frequency variations in the reference signal and for providing a first output voltage, and a high frequency path for tracking high frequency variations in the reference signal and for providing a second output voltage, and a combiner for combining the first and second output voltages to provide a third output voltage, the amplification stage further comprising a first amplifier arranged to receive the first output voltage as a supply voltage, and a second amplifier arranged to receive the third output voltage as a supply voltage, wherein the first and second amplifiers are enabled in different modes of operation.

[Assistant]
1. An amplification stage including an envelope tracking modulated supply for tracking a reference signal, comprising:
a low frequency path for tracking low frequency variations in the reference signal and for providing a first output voltage;
a full spectrum path for tracking the reference signal and for providing a second output voltage;
a combiner configured to combine the first and second output voltages to provide a third output voltage;
a first power amplifier configured to receive the first output voltage as a power supply voltage for the first power amplifier; and
a second power amplifier configured to receive the third output voltage as a power supply voltage, for the second power amplifier.

2. The amplification stage of claim 1, wherein:
the first power amplifier is disabled and the second power amplifier is enabled in a first mode of operation for the amplification stage; and
the second power amplifier is disabled and the first power amplifier is enabled in a second mode of operation for the amplification stage.

3. The amplification stage of claim 1, wherein the full spectrum path comprises a linear amplifier configured to amplify a version of the reference signal.

4. The amplification stage of claim 3, wherein the linear amplifier is enabled/disabled when the second power amplifier is enabled/disabled.

5. The amplification stage of claim 3, wherein the full spectrum path further comprises a feedback path from an output of the linear amplifier to an input of the linear amplifier.

6. The amplification stage of claim 3, wherein the full spectrum path further comprises a capacitor coupled between an output of the linear amplifier and the combiner.

7. The amplification stage of claim 3, wherein the full spectrum path further comprises a delay element coupled to an input of the linear amplifier.

8. The amplification stage of claim 1, wherein the full spectrum path further comprises a voltage source coupled to an input of the linear amplifier and configured to introduce an offset voltage to the input of the linear amplifier.

9. The amplification stage of claim 1, further comprising a switch configured to selectively connect a DC power supply with the first power amplifier, wherein if the switch is closed, the first power amplifier is configured to receive a DC voltage of the DC power supply as the power supply voltage for the first power amplifier.

10. The amplification stage of claim 1, wherein:
the first power amplifier is a power amplifier for a 2G or EDGE mode of operation; and
the second power amplifier is a power amplifier for a 3G or 4G mode of operation.

11. An RF amplifier including the amplification stage of claim 1.

12. A wireless communication system including the amplification stage of claim 1.

13. A wireless mobile device including the amplification stage of claim 1.

14. A method for providing power to multiple amplifiers in an amplification stage including an envelope tracking modulated supply for tracking a reference signal, the method comprising:
tracking low frequency variations in the reference signal with a low frequency path of the amplification stage to provide a first output voltage;
tracking the reference signal with a full spectrum path of the amplification stage to provide a second output voltage;
combining the first and second output voltages to provide a third output voltage;
powering a first power amplifier with the first output voltage; and
powering a second power amplifier with the third output voltage.

15. The method of claim 14, further comprising in a first mode of operation for the amplification stage:
enabling the first power amplifier; and
disabling the second power amplifier.

16. The method of claim 15, further comprising in a second mode of operation for the amplification stage:
disabling the first power amplifier; and
enabling the second power amplifier.

17. The method of claim 16, wherein the first mode of operation comprises a 2G mode of operation and wherein the second mode of operation comprises a 3G/4G mode of operation.

18. The method of claim 14, wherein tracking the reference signal with the full spectrum path of the amplification stage comprises amplifying a version of the reference signal.

19. The method of claim 14, wherein tracking the reference signal with the full spectrum path comprises applying an offset voltage to a version of the reference signal.

20. The method of claim 14, wherein tracking the reference signal with the full spectrum path comprises applying a delay to the reference signal.


[System] You are an expert US patent attorney. Draft a set of independent and dependent claims based on the provided invention description. Use correct USPTO formatting.

[User]
Title: Exploiting Or Avoiding Air Drag For An Aerial Vehicle

Technical Field and Background:
The number of Unmanned Aerial Vehicles (UAVs) in use has increased rapidly in recent times. Over the same time period, the different type of situations and applications in which these UAVs may be put to use has also grown in number. This is due at least in part to increase in the sophistication and the capabilities of the technologies that may be utilized with UAVs. For example, UAVs are currently used for sophisticated mapping and surveillance applications, and the use of UAVs is also being contemplated for delivery service applications. Some of these UAV applications may have requirements that a UAV to remain aloft for long periods of time or travel intensively without frequent breaks during which the UAV may be serviced. These types of requirements may place heavy demands on the power efficiency of a UAV and the efficiency of the power source of a UAV's motors. Demands on power may be compounded by air drag on surfaces of the UAV generated by the velocity of the UAV, or created by wind forces, acting counter to UAV movement in a desired direction. The influence of air drag on an UAV may also be complicated by the fact that an UAV may have directionality in its shape. For example, in some UAVs the front may generate low resistance against air pressure while the side may generate high resistance against air pressure.

Invention Disclosure:
Methods and apparatus for avoiding or exploiting air drag on an aerial vehicle are disclosed. In embodiments, the methods and apparatus may be implemented in a controller and used to increase the energy efficiency of an aerial vehicle. In the embodiments, at least one parameter associated with a force on an aerial vehicle is determined. A yaw setting for the aerial vehicle is then determined that exploits or avoids air drag on the aerial vehicle for energy efficiency. The yaw setting may be referenced to a yaw based on directionality in the shape of the aerial vehicle. In other embodiments, a drag associated with a force on an aerial vehicle is determined. It is then determined if there is a selected component in the drag based on a desired maneuver of the aerial vehicle. A yaw setting is then determined based on whether the selected component is in the drag.

[Assistant]
1. A controller for a rotary wing unmanned aerial vehicle having a plurality of rotary motors, the controller comprising:
a processing unit and memory including code, which when executed controls the processing unit to:
determine at least one parameter associated with force on the aerial vehicle as the controller controls the plurality of rotary motors to propel the aerial vehicle to move in a direction along a path;
determine a setting for a yaw of the aerial vehicle based on the at least one parameter, wherein the yaw defines an angle between an axis running from a first portion to a second portion of the aerial vehicle and the direction of movement of the aerial vehicle along the path, wherein the first portion is a leading edge of movement of the aerial vehicle along the path; and
set the yaw of the aerial vehicle based on the determined setting for the yaw, wherein the aerial vehicle is positioned according to the angle defined by the yaw by controlling the relative speeds of each of the plurality of rotary motors as the plurality of rotary motors propel the aerial vehicle to move in the direction along the path,
wherein the setting of the yaw of the aerial vehicle is determined based on a force parameter such that air drag is used to advantageously assist moving the aerial vehicle along the path or inhibit moving the aerial vehicle along the path.

2. The controller of claim 1, wherein at least one parameter comprises a drag and the code is executable to control the processing unit to determine the setting for the yaw by causing the processing unit to:
determine that the aerial vehicle is to move in the direction along the path; and,
determine the setting for the yaw of the aerial vehicle taking into account the influence of the drag on the aerial vehicle while the plurality of rotary motors propel the aerial vehicle to move in the direction along the path.

3. The controller of claim 2, wherein at least one parameter comprises a drag, the setting for the yaw comprises a first setting for the yaw, and the code is executable to control the processing unit to further cause the processing unit to:
determine that the aerial vehicle is to decelerate; and,
determine a second setting for the yaw of the aerial vehicle taking into account the influence of the drag on the aerial vehicle while decelerating.

4. The controller of claim 1, wherein the at least one parameter comprises a drag and the code is executable to control the processing unit to determine the setting for the yaw of the aerial vehicle by causing the processing unit to:
determine that a component is included in the drag; and,
determine the setting for the yaw of the aerial vehicle based on the drag and the determination that the component is included in the drag.

5. The controller of claim 1, wherein the at least one parameter comprises a drag and the code is executable to control the processing unit to determine the setting for the yaw of the aerial vehicle by causing the processing unit to:
determine a desired maneuver of the aerial vehicle;
determine if there is a selected component in the drag based on the drag and the desired maneuver; and,
determine the setting for the yaw of the aerial vehicle based on the drag and the determination of whether the selected component is in the drag.

6. The controller of claim 5, wherein the code is executable to control the processing unit to determine the setting for the yaw of the aerial vehicle based on the drag and the determination of whether the selected component is in the drag by controlling the processing unit to determine the setting for the yaw of the aerial vehicle parallel to the drag if the selected component is not in the drag.

7. The controller of claim 5, wherein the code is executable to control the processing unit to determine the setting for the yaw of the aerial vehicle based on the drag and the determination of whether the selected component is in the drag by controlling the processing unit to determine the setting for the yaw of the aerial vehicle perpendicular to a forward path of the aerial vehicle if the selected component is in the drag.

8. The controller of claim 1, wherein the code is executable to control the processing unit to determine the at least one parameter by causing the processing unit to:
determine a deviation of the aerial vehicle from the path;
determine a velocity of the aerial vehicle as the controller controls the plurality of rotary motors to propel the aerial vehicle to move in a direction along a path; and,
determine a drag on the aerial vehicle based on the deviation and the velocity.

9. The controller of claim 1, the code is executable to control the processing unit to determine the at least one parameter by causing the processing unit to:
turn off a global positioning satellite (GPS) lock and determine a drift of the aerial vehicle;
determine a velocity of the aerial vehicle as the controller controls the plurality of rotary motors to propel the aerial vehicle to move in a direction along a path; and,
determine a drag on the aerial vehicle based on the drift and the velocity.

10. The controller of claim 1, wherein the code is executable to control the processing unit to determine the at least one parameter by causing the processing unit to:
determine a wind direction and magnitude;
determine a velocity of the aerial vehicle; as the controller controls the plurality of rotary motors to propel the aerial vehicle to move in a direction along a path and,
determine a drag on the aerial vehicle based on the wind direction and magnitude, and the velocity.

11. An aerial vehicle comprising:
a plurality of rotary motors;
a processing unit providing control signals for the plurality of rotary motors; and memory including code, which when executed controls the processing unit to:
determine at least one parameter associated with forces on the aerial vehicle as the processing unit controls the plurality of rotary motors to propel the aerial vehicle to move in a direction along a path;
determine a setting for a yaw of the aerial vehicle based on the at least one parameter, wherein the yaw defines an angle between an axis running from a first portion to a second portion of the aerial vehicle and the direction of movement of the aerial vehicle along the path; and,
set the yaw of the aerial vehicle based on the determined setting for the yaw, wherein the aerial vehicle is positioned according to the angle defined by the yaw, by controlling the relative speeds of each of the plurality of rotary motors as the plurality of rotary motors propel the aerial vehicle in the direction along the path,
wherein the setting of the yaw of the aerial vehicle is determined based on a force parameter such that air drag is used to advantageously assist moving the aerial vehicle along the path or inhibit moving the aerial vehicle along the path.

12. The aerial vehicle of claim 11, wherein the code is executable to control the processing unit to determine the at least, one parameter by causing the processing unit to:
receive data measured in an external environment of the aerial vehicle; and,
determine at least one parameter associated with forces on the aerial vehicle based on the data.

13. The aerial vehicle of claim 11, wherein at least one parameter comprises a drag and the code is executable to control the processing unit to determine die setting for the yaw of the aerial vehicle by causing the processing unit to:
determine that the aerial vehicle is to move in the direction along the path; and,
determine the setting for the yaw of the aerial vehicle to reduce the influence of the drag on the aerial vehicle while the processing unit controls the plurality of rotary motors to propel the aerial vehicle to move in the direction along the path.

14. The aerial vehicle of claim 11, wherein at least one parameter comprises a drag and the code is executable to control the processing unit to determine the setting for the yaw of the aerial vehicle by causing the processing unit to:
determine that the aerial vehicle is to move in the direction along the path; and,
determine a yaw setting for the aerial vehicle to exploit the influence of the drag on the aerial vehicle while the processing unit controls the plurality of rotary motors to propel the aerial vehicle to moves in the direction along the path.

15. The aerial vehicle of claim 11, wherein at least one parameter comprises a drag, the setting for the yaw comprises a first setting for the yaw, and the code is executable to control the processing unit to further cause the processing unit to:
determine that the aerial vehicle is to decelerate; and,
determine a second-setting for the yaw of the aerial vehicle to exploit the influence of the drag on the aerial vehicle while decelerating.

16. The aerial vehicle of claim 11, wherein at least one parameter comprises a drag, the setting for the yaw comprises a first setting for the yaw, and the code is executable to control the processing unit to further cause the processing unit to:
determine that the aerial vehicle is to accelerate; and,
determine a second setting for the yaw of the aerial vehicle to reduce the influence of the drag on the aerial vehicle while accelerating.

17. A computer readable medium comprising instructions stored thereon, that when executed on a processor perform the steps of:
determining at least one parameter associated with forces on an aerial vehicle as the processor controls a plurality of rotary motors to propel the aerial vehicle to move in a direction along a path;
determining a setting for a yaw of the aerial vehicle based on the at least one parameter, wherein the yaw defines an angle between an axis running from a first portion to a second portion of the aerial vehicle and the direction of movement of the aerial vehicle along the path; and
initiating setting of the yaw of the aerial vehicle based on the determined setting for the yaw, wherein the aerial vehicle is positioned according to the angle defined by the yaw by controlling the relative speeds of each of the plurality of rotary motors as the plurality of rotary motors propel the aerial vehicle to move in the direction along the path,
wherein the setting of the yaw of the aerial vehicle is determined based on a force parameter such that air drag is used to advantageously assist moving the aerial vehicle along the path or inhibit moving the aerial vehicle along the path.

18. The computer readable medium of claim 17, wherein the at least one parameter comprises a drag and the instructions, when executed on the processor, further perform the steps of:
determining that the aerial vehicle is to move in the direction along the path; and,
determining the setting for the yaw of the aerial vehicle taking into account the influence of the drag on the aerial vehicle while the processor controls the plurality of rotary motors to propel the aerial vehicle to move in the direction along the path.

19. The computer readable medium of claim 17, wherein the at least one parameter comprises a drag, the setting for the yaw comprises a first setting for the yaw, and the instructions, when executed on the processor, further perform the steps of:
determining that the aerial vehicle is to decelerate; and,
determining a second setting for the yaw of the aerial vehicle taking into account the influence of the drag on the aerial vehicle while decelerating.

20. The computer readable medium of claim 17, wherein the instructions, when executed on the processor, further perform the steps of:
receiving data measured in an external environment of the aerial vehicle; and,
determining at least one parameter associated with forces on the aerial vehicle based on the data.


[System] You are an expert US patent attorney. Draft a set of independent and dependent claims based on the provided invention description. Use correct USPTO formatting.

[User]
Title: Mounting And Connector Structure For Electronic Apparatus

Technical Field and Background:
An electronic apparatus of which electronic components and connectors are mounted on a substrate, and accommodating the substrate in a casing is generally known. In addition, a configuration using a vertical connector to which a mating connector is attached and detached in a direction perpendicular to a surface of the substrate as a connector mounted on the substrate is known (refer to Japanese Patent Application Laid-Open Publication No. 2002-16369, for example). In the configuration that mounts the vertical connector on the substrate, a force acts in a normal direction of the substrate through the vertical connector when attaching and detaching the mating connector. Then, it is considered that a flexural deformation of the substrate occurs due to this force. Accordingly, there is a concern of occurrence of problems such as breakage in soldering portions of the electronic component and connector terminals. Incidentally, for a mounting method of connectors in an electronic apparatus, there is a method of screw-fixing the connectors to a die-cast-made casing. However, for a purpose of cost reduction or the like, when using a sheet-metal casing formed by steel sheet press instead of the die-cast-made casing, it is assumed that screw-fixing is not performed in terms of ensuring waterproofness. In this case, there is a strong concern that components may become damaged due to the attaching and detaching of the connector.

Invention Disclosure:
Mounting and connector structure for an electronic apparatus includes a substrate, a mounting connector mounted on a substrate surface of the substrate, and a mating connector is attached/detached to the mounting connector in a direction perpendicular to the substrate surface, and a casing having a first casing member disposed on a connector mounting surface of the substrate and a second casing member disposed on an opposite surface side of the connector mounting surface, and the casing accommodates the substrate and the mounting connector in an accommodation space which is formed by coupling the casing members to one another. The first casing member is in contact with a first surface that is a side where the mating connector is attached/detached in the mounting connector, and the second casing member is in contact with a second surface that is a side facing to the first surface in the mounting connector.

[Assistant]
1. A mounting and connector structure for an electronic apparatus comprising:
a substrate on which an electronic component is mounted;
a mounting connector mounted on a substrate surface of the substrate, and a mating connector is attached and detached to the mounting connector in a direction perpendicular to the substrate surface; and
a casing having a first casing member disposed on a connector mounting surface side of the substrate and a second casing member disposed on an opposite surface side of the connector mounting surface, and the casing accommodates the substrate and the mounting connector in an accommodation space which is formed by coupling the casing members to one another, wherein:
the first casing member is in contact with a first surface that is a side where the mating connector is attached and detached in the mounting connector,
the second casing member is in contact with a second surface that is a side facing to the first surface in the mounting connector,
each of the first casing member and the second casing member comprise at least one flange portion disposed on a respective periphery, and
the mounting connector is sandwiched between the at least one flange portion of the first casing member and the at least one flange portion of the second casing member.

2. The mounting and connector structure for the electronic apparatus according to claim 1, wherein,
the mounting connector includes an attaching and detaching portion to which the mating connector is attached and detached;
the first casing member has an opening for inserting the attaching and detaching portion; and
the first surface of the mounting connector is in contact at a position surrounding the opening in the first casing member.

3. The mounting and connector structure for the electronic apparatus according to claim 1, wherein,
the mounting connector includes a plurality of attaching and detaching portions to which the mating connector is attached and detached, and the plurality of attaching and detaching portions are arranged in a row,
at least two parts of the plurality of attaching and detaching portions away from each other in an arrangement direction in the first casing member contact the first surface of the mounting connector; and
at least two parts of the plurality of attaching and detaching portions away from each other in an arrangement direction in the second casing member contact the second surface of the mounting connector.

4. The mounting and connector structure for the electronic apparatus according to claim 2, wherein,
the mounting connector includes a plurality of attaching and detaching portions to which the mating connector is attached and detached, and the plurality of attaching and detaching portions are arranged in a row,
at least two parts of the plurality of attaching and detaching portions away from each other in an arrangement direction in the first casing member contact the first surface of the mounting connector; and
at least two parts of the plurality of attaching and detaching portions away from each other in an arrangement direction in the second casing member contact the second surface of the mounting connector.

5. The mounting and connector structure for the electronic apparatus according to claim 1, wherein,
the mounting connector has a protruding portion protruding to an outside of the substrate; and
the first surface and the second surface are formed on the protruding portion.

6. The mounting and connector structure for the electronic apparatus according to claim 1, wherein,
a first sealing part composed of a groove and a protrusion is formed in a joined portion of each casing member coupled to each other; and
a second sealing part that is continuous to the first sealing part is formed on a contact portion between the first casing member and the mounting connector, and on a contact portion between the second casing member and the mounting connector.

7. The mounting and connector structure for the electronic apparatus according to claim 6, wherein,
there is provided a sealant that is filled between the groove and the protrusion of each of the sealing part.