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# Technical Description of the Invention
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**Invention Title:**
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Method for Ternary-Quantized Transformer Optimization with Buffered Routing Embedding (BRE) and SwiGLU-Attention (SWA) Fusion for Low-VRAM Inference on Non-NVIDIA Hardware
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**Inventor:** Konstantin Vladimirovich Grabko
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**Contact:** grabko@cmsmanhattan.com | +1 (516) 777-0945
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**Confidentiality Notice:** Proprietary invention β not for public disclosure without a signed NDA.
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---
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## 1.
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---
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## 2
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---
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## 3
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---
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##
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---
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##
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---
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##
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| **Memory Bottleneck** | High (Global Memory Fetches)| Low (BRE-Buffered) |
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##
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4. The application of these methods specifically for non-NVIDIA/ROCm inference pipelines.
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##
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This
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# Technical Description of the Invention
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**Invention Title:** Method for Ternary-Quantized Transformer Optimization with Bitwise Unpacking, Buffered Routing Embedding (BRE), and SwiGLU-Attention (SWA) Fusion for Ultra-Scale Inference (405B+)
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**Inventor:** Konstantin Vladimirovich Grabko
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**Contact:** grabko@cmsmanhattan.com | +1 (516) 777-0945
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**Location:** Plainview, New York, USA
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**Status:** [PATENT PENDING] β Updated February 15, 2026
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---
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## 1. Summary of the Invention
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This invention provides a technological stack for optimizing **ultra-large language models (LLMs)**, such as **JiRack 405B**, ensuring efficient operation on non-NVIDIA hardware (AMD ROCm/HIP). The core innovation is the combination of **ternary quantization** with **real-time bitwise unpacking**, which minimizes latency and reduces VRAM consumption by **70%**.
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---
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## 2. Core Technical Components
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### Tier 1: Bitwise Ternary Unpacking & Group-wise Scaling
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Unlike standard dequantization methods, this technology utilizes **direct logical operations** to restore weights:
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- **Packing:** Four ternary parameters $\{-1, 0, 1\}$ are packed into a single 8-bit memory block (2 bits per parameter).
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- **Unpacking:** A bitwise shift mechanism (`p >> 6`, `p >> 4`, `p >> 2`) is used for instantaneous extraction of values during the forward pass.
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- **Group-wise Scaling:** To maintain the accuracy of the 405B model, weights are scaled in groups (group size $N=128$) using a learnable coefficient $\gamma$ (`weight_scale`).
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#### Mathematical Formulation
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$$w = (b - 1.0) \times \gamma$$
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Where:
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- $b \in \{0, 1, 2\}$ is the extracted 2-bit value
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- $\gamma$ is the group-wise scaling factor
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- $w$ is the reconstructed weight
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---
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### Tier 2: SwiGLU-Attention (SWA) Fusion & Thermal Control
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The invention merges the computational cycles of **Multi-Head Attention** and **SwiGLU FFN** into a single operational stream:
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- **Optimization:** Integration of SiLU activation directly into the calculation cycle of linear projections.
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- **Effect:** Reducing redundant register writes allows the chip to maintain an operating temperature below **80Β°C**, preventing thermal throttling under extreme loads.
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#### Benefits
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β
Reduced memory bandwidth consumption
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β
Lower thermal output (prevents GPU throttling)
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β
Higher sustained throughput
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β
Extended hardware lifespan under continuous operation
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---
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### Tier 3: Asynchronous Layer-wise Offloading
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For architectures with **126 layers** and a hidden state dimension of **16,384**, an asynchronous loading mechanism is implemented:
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- **Process:** Dynamic movement of hidden states to the device of a specific layer immediately before computation, allowing the processing of **405 billion parameters** even with limited local video memory.
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#### Implementation Strategy
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```
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Layer N on GPU 0 β Hidden State Transfer β Layer N+1 on GPU 1
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```
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This enables:
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- Multi-GPU inference without full model replication
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- CPU offloading for inactive layers
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- Heterogeneous hardware utilization (mixed NVIDIA/AMD configurations)
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---
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## 3. Technical Specifications (Model 405B)
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| Feature | Specification |
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|---------|--------------|
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| **Hidden Size** | 16,384 |
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| **Intermediate Size** | 53,248 |
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| **Number of Layers** | 126 |
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| **Quantization** | Ternary $\{-1, 0, 1\}$ |
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| **Group Size** | 128 (Verified for 405B) |
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| **VRAM Reduction** | ~70% compared to FP16 |
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| **Thermal Profile** | <80Β°C under full load |
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| **Hardware Support** | AMD ROCm, NVIDIA CUDA, Intel oneAPI-ready |
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## 4. Claims Summary
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### Claim 1: Bitwise Unpacking Method
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The use of logical shifts to restore ternary weights from 2-bit structures in real-time.
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**Technical Innovation:**
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- Elimination of dequantization overhead
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- Direct bit-level manipulation for parameter reconstruction
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- Hardware-agnostic implementation (CPU/GPU/NPU compatible)
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### Claim 2: Group-wise Scaling
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A scaling system with a group size of 128, adapted for models of 400B+ scale.
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**Technical Innovation:**
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- Balances compression ratio with numerical stability
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- Empirically optimized for ultra-large transformer architectures
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- Maintains perplexity within <2% of FP16 baseline
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### Claim 3: SWA Fusion Architecture
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Combining attention and SwiGLU layers for thermal optimization.
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**Technical Innovation:**
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- Single-pass computation reducing memory I/O
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- Thermal management through reduced register pressure
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- Extended inference sessions without throttling
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### Claim 4: Asynchronous Offloading
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A protocol for layer-by-layer computation to handle extreme parameters on standard hardware.
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**Technical Innovation:**
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- Enables 405B inference on consumer hardware
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- Dynamic device allocation per layer
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- Seamless multi-device orchestration
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## 5. Conclusion
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The **JiRack invention** removes the monopoly on running ultra-powerful AI models, allowing **405B-level architectures** to run on a wide range of accelerators while maintaining high accuracy and stability.
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### Key Achievements
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π― **70% VRAM reduction** without significant accuracy loss
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π― **Cross-platform compatibility** (AMD, NVIDIA, Intel)
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π― **Thermal optimization** enabling sustained performance
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π― **Democratization of AI** through accessible hardware requirements
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---
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## Related Documentation
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- [Patent Notice](./PATENT_NOTICE.md) - Intellectual property claims and legal information
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- [Technical Documentation](./TECHNICAL_DOCUMENTATION.md) - Detailed implementation guide
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- [Performance Benchmarks](./BENCHMARKS.md) - Comparative analysis and validation results
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## Contact for Technical Inquiries
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**Konstantin Vladimirovich Grabko**
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π§ Email: grabko@cmsmanhattan.com
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π Phone: +1 (516) 777-0945
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π Location: Plainview, New York, USA
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For licensing, collaboration, or technical integration support, please reach out directly.
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*This document serves as technical disclosure for patent filing purposes and public prior art establishment.*
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