add another Design Highlight: Engineered Waste Systems

semiconductor-fab-expansion.html

@@ -139,9 +139,9 @@
                     <h3 class="text-xl font-bold mt-8 mb-4">Design Highlights</h3>
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-                            <h4 class="font-bold mb-2">Vibration Control</h4>
+                            <h4 class="font-bold mb-2">Space Constaints</h4>
                             <p class="text-gray-600">
-                                Isolated slab-on-grade foundation with 2Hz natural frequency, supporting 300-ton lithography tools with <1μm/sec vibration criteria.
+                                Due to space constraints a new air handling unit to provide the required air changes per hour was not an option. After finalzing the laod calculations Essential Engineering determined  the required space pressurization and sensible load offset could be accomplished by utilizing the make-up air from an existing make-up air handling unit. The required air changes per hour was achieved by utilizing fan powered HEPA units (FFU). The design also  included a new humidificaiton system dedicated to the project.
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@@ -151,11 +151,17 @@
                             </p>
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-                            <h4 class="font-bold mb-2">Specialty Gases</h4>
+                            <h4 class="font-bold mb-2">Engineered Waste Systems</h4>
                             <p class="text-gray-600">
-                                50+ bulk gas delivery systems with <1ppb purity for process gases including NF3, Cl2, and HBr with redundant abatement systems.
+                                Acid, solvent and process waste collection with pH neutralization and specialized material compatibility for corrosive chemistries.
                             </p>
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+                        <div>
+                            <h4 class="font-bold mb-2">Specialty Gases</h4>
+<p class="text-gray-600">
+                                Ultra-high purity Nitrogen, Oxygen, Compressed Dry Air, Process Vacuum, 18 Megohm Deionized Water
+</p>
+                        </div>
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