| |
|
|
| expansion: |
| seed: 42 |
| max_variants_per_seed: 8 |
|
|
| axes: |
| board_type: |
| - "motherboard" |
| - "laptop pcb" |
| - "graphics card" |
| - "server board" |
| - "smartphone pcb" |
| - "RAM module scrap" |
| condition: |
| - "damaged" |
| - "stripped" |
| - "scrap" |
| - "desoldered" |
| - "blowtorched" |
| - "cannibalized" |
| view: |
| - "macro close up" |
| - "top view" |
| - "bottom view" |
| - "high resolution" |
| - "recycling yard" |
| - "junk yard scrap" |
|
|
| classes: |
| cpu_socket: |
| seeds: |
| - "CPU socket PCB" |
| - "LGA socket motherboard" |
| - "PGA processor socket" |
| - "empty cpu socket board" |
| - "laptop CPU socket close up" |
| - "server motherboard socket LGA 1700" |
| multilingual: |
| zh: |
| - "CPU插座 主板" |
| - "处理器插槽" |
| de: |
| - "Prozessorsockel Mainboard" |
|
|
| gold_finger: |
| seeds: |
| - "PCIe gold fingers" |
| - "RAM edge connector contacts" |
| - "PCB gold finger pins" |
| - "gold plated pcb edge" |
| - "stripped gold edge fingers PCB" |
| - "gold finger pin recovery scrap" |
| multilingual: |
| zh: |
| - "PCB 金手指" |
| - "内存条金手指" |
| de: |
| - "Goldkontakte Leiterplatte" |
|
|
| ic_chip: |
| seeds: |
| - "BGA chip motherboard" |
| - "SMD IC chip PCB" |
| - "microchip printed circuit board" |
| - "QFP IC package board" |
| - "desoldered BGA footprint" |
| - "chipset heatsink removed motherboard" |
| multilingual: |
| zh: |
| - "主板 芯片" |
| - "集成电路 电子废弃物" |
| de: |
| - "Mikrochip Leiterplatte" |
|
|
| tantalum_capacitor: |
| seeds: |
| - "SMD tantalum capacitor PCB" |
| - "yellow tantalum capacitor board" |
| - "surface mount tantalum capacitor" |
| - "black tantalum cap SMD" |
| - "tantalum capacitors ewaste scrap" |
| multilingual: |
| zh: |
| - "钽电容 主板" |
| de: |
| - "Tantalkondensator Mainboard" |
|
|
| forcibly_desoldered_pad: |
| seeds: |
| - "desoldered PCB pads blowtorch" |
| - "removed chip solder pads burnt flux" |
| - "stripped motherboard pads torn traces" |
| - "cannibalized circuit board exposed pads" |
| - "hot air desoldered SMD pads" |
| - "salvaged chips board footprint scrap" |
| - "blowtorched PCB desoldered pads" |
| - "desoldered chip footprint torn traces" |
| - "heatgun removed IC solder pads" |
| - "cannibalized motherboard chip pads" |
| - "burnt flux desoldered footprint scrap" |
| - "PCB solder pad lifted trace damage" |
| - "desoldered BGA pad array scrap" |
| - "removed SMD chip solder footprint" |
| multilingual: |
| zh: |
| - "拆焊 焊盘 主板" |
| - "吹焊 芯片 焊盘 损毁" |
| - "拆芯片 焊盘 损坏 PCB" |
| de: |
| - "Entlötete Pads Leiterplatte" |
| - "Entlötete SMD Pads Platine Schrott" |
| ja: |
| - "デソルダリング 済 基板 パッド" |
|
|
| factory_unpopulated_pad: |
| seeds: |
| - "unpopulated PCB pads SMD" |
| - "empty IC footprint circuit board" |
| - "bare PCB solder mask footprint" |
| - "unpopulated SMD pads clean silkscreen" |
| - "unpopulated SMD PCB solder pads" |
| - "bare solder mask footprint empty IC" |
| - "unpopulated PCB silkscreen solder pads" |
| - "empty component footprint circuit board" |
| - "unpopulated SMD capacitor pads" |
| - "PCB unpopulated BGA footprint clean" |
| - "unpopulated SMT pads bare copper" |
| multilingual: |
| zh: |
| - "未焊 接 焊盘 PCB" |
| - "空焊盘 线路板 没焊" |
| de: |
| - "Unbestückte Pads Leiterplatte" |
| - "Unbestückte SMD Pads Leiterplatte" |
| ja: |
| - "未実装 PCB パッド 基板" |
|
|
| occluded_region: |
| seeds: |
| - "dusty dirty ewaste circuit board" |
| - "motherboard heatsink covered chips" |
| - "metal shield covered PCB board" |
| - "corroded scrap motherboard" |
| - "dusty dirty scrap circuit board close up" |
| - "PCB heatsink metal shield covered components" |
| - "dust covered motherboard IC chips" |
| - "corroded dirty ewaste PCB board" |
| - "metal EMI shield covered circuit board" |
| - "dusty server board heatsink covered" |
| multilingual: |
| zh: |
| - "灰尘 覆盖 电子线路板" |
| - "散热片 遮挡 主板 芯片" |
| de: |
| - "Verschmutzte Leiterplatte Schrott" |
| - "Verschmutzte Platine Staub Kühlkörper" |
|
|
