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akumar33
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manufacturing

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through O
the O
thickness O
of O
the O
bead S-CHAR
are O
found O
to O
be S-MATE
affected O
by O
nozzle S-MACEQ
height O
during O
deposition S-CONPRI
. O
Significant O
improvements O
to O
the O
throughput S-CHAR
of O
additive B-MANP
manufacturing E-MANP
( O
AM S-MANP
) O
processes S-CONPRI
are O
essential O
to O
their O
cost-effectiveness O
and O
competitiveness O
with O
traditional O
processing O
routes O
. O
Moreover O
, O
high-throughput O
AM B-MANP
processes E-MANP
, O
in O
combination O
with O
the O
geometric O
versatility O
of O
AM S-MANP
, O
will O
enable O
entirely O
new O
workflows S-CONPRI
for O
product B-FEAT
design E-FEAT
and O
customization O
. O
We O
present O
the O
design S-FEAT
and O
validation S-CONPRI
of O
a O
desktop-scale O
extrusion B-MANP
AM E-MANP
system O
that O
achieves O
a O
much O
greater O
build B-CHAR
rate E-CHAR
than O
benchmarked O
commercial O
systems O
. O
This O