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akumar33
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manufacturing

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that O
is O
designed S-FEAT
to O
drastically O
reduce O
compute B-PARA
time E-PARA
when O
integrated O
in O
to O
a O
process B-CONPRI
design I-CONPRI
optimization E-CONPRI
routine O
. O
In O
this O
first O
manuscript S-CONPRI
, O
we O
introduce O
a O
thermal B-CONPRI
circuit I-CONPRI
network E-CONPRI
( O
TCN S-CONPRI
) O
model S-CONPRI
to O
estimate O
the O
part O
temperature S-PARA
history O
during O
PBF S-MANP
, O
a O
major O
computational O
bottleneck S-CONPRI
in O
PBF B-CONPRI
simulation E-CONPRI
. O
In O
the O
TCN B-CONPRI
model E-CONPRI
, O
we O
are O
modeling S-ENAT
conductive B-CONPRI
heat I-CONPRI
transfer E-CONPRI
through O
both O
the O
part O
and O
support B-FEAT
structure E-FEAT
by O
dividing O
the O
part O
into O
thermal B-CONPRI
circuit I-CONPRI
elements E-CONPRI
( O
TCEs S-CONPRI
) O
, O
which O
consists O
of O
thermal O
nodes O
represented O
by O
thermal B-CONPRI
capacitances E-CONPRI
that O
are O
connected O
by O
resistors S-MACEQ
, O
and O