target stringlengths 1 270 | source stringlengths 214 3.8k |
|---|---|
Drill bits must remain dull why? | Context: Holes through a PCB are typically drilled with small-diameter drill bits made of solid coated tungsten carbide. Coated tungsten carbide is recommended since many board materials are very abrasive and drilling must be high RPM and high feed to be cost effective. Drill bits must also remain sharp so as not to ma... |
Drilling with high-speed-steel is feasible why? | Context: Holes through a PCB are typically drilled with small-diameter drill bits made of solid coated tungsten carbide. Coated tungsten carbide is recommended since many board materials are very abrasive and drilling must be high RPM and high feed to be cost effective. Drill bits must also remain sharp so as not to ma... |
The dull file describes what? | Context: Holes through a PCB are typically drilled with small-diameter drill bits made of solid coated tungsten carbide. Coated tungsten carbide is recommended since many board materials are very abrasive and drilling must be high RPM and high feed to be cost effective. Drill bits must also remain sharp so as not to ma... |
Drilling must be low RPM and high feed to be what? | Context: Holes through a PCB are typically drilled with small-diameter drill bits made of solid coated tungsten carbide. Coated tungsten carbide is recommended since many board materials are very abrasive and drilling must be high RPM and high feed to be cost effective. Drill bits must also remain sharp so as not to ma... |
What do the hole walls in two-layer PCBs have to be before they can be electroplated? | Context: The hole walls for boards with two or more layers can be made conductive and then electroplated with copper to form plated-through holes. These holes electrically connect the conducting layers of the PCB. For multi-layer boards, those with three layers or more, drilling typically produces a smear of the high ... |
What's the minimum number of layers a PCB can have to be considered "multi-layer"? | Context: The hole walls for boards with two or more layers can be made conductive and then electroplated with copper to form plated-through holes. These holes electrically connect the conducting layers of the PCB. For multi-layer boards, those with three layers or more, drilling typically produces a smear of the high ... |
What process does a multi-layer PCB usually undergo before plating to make sure the layers have good connectivity with each other? | Context: The hole walls for boards with two or more layers can be made conductive and then electroplated with copper to form plated-through holes. These holes electrically connect the conducting layers of the PCB. For multi-layer boards, those with three layers or more, drilling typically produces a smear of the high ... |
What type of boards undergo the etch-back process? | Context: The hole walls for boards with two or more layers can be made conductive and then electroplated with copper to form plated-through holes. These holes electrically connect the conducting layers of the PCB. For multi-layer boards, those with three layers or more, drilling typically produces a smear of the high ... |
Etch-back removes glass fibers and what other material? | Context: The hole walls for boards with two or more layers can be made conductive and then electroplated with copper to form plated-through holes. These holes electrically connect the conducting layers of the PCB. For multi-layer boards, those with three layers or more, drilling typically produces a smear of the high ... |
What connects the conducting layers of the PAB? | Context: The hole walls for boards with two or more layers can be made conductive and then electroplated with copper to form plated-through holes. These holes electrically connect the conducting layers of the PCB. For multi-layer boards, those with three layers or more, drilling typically produces a smear of the high ... |
Smears are removed with a chemical smear what? | Context: The hole walls for boards with two or more layers can be made conductive and then electroplated with copper to form plated-through holes. These holes electrically connect the conducting layers of the PCB. For multi-layer boards, those with three layers or more, drilling typically produces a smear of the high ... |
The process used on low-reliability boards is called what? | Context: The hole walls for boards with two or more layers can be made conductive and then electroplated with copper to form plated-through holes. These holes electrically connect the conducting layers of the PCB. For multi-layer boards, those with three layers or more, drilling typically produces a smear of the high ... |
The back-etch removes what? | Context: The hole walls for boards with two or more layers can be made conductive and then electroplated with copper to form plated-through holes. These holes electrically connect the conducting layers of the PCB. For multi-layer boards, those with three layers or more, drilling typically produces a smear of the high ... |
What becomes integral with the deposited silver? | Context: The hole walls for boards with two or more layers can be made conductive and then electroplated with copper to form plated-through holes. These holes electrically connect the conducting layers of the PCB. For multi-layer boards, those with three layers or more, drilling typically produces a smear of the high ... |
What happens to untreated copper that makes it difficult to solder? | Context: Matte solder is usually fused to provide a better bonding surface or stripped to bare copper. Treatments, such as benzimidazolethiol, prevent surface oxidation of bare copper. The places to which components will be mounted are typically plated, because untreated bare copper oxidizes quickly, and therefore is n... |
What chemical treatment will prevent bare copper from oxidizing? | Context: Matte solder is usually fused to provide a better bonding surface or stripped to bare copper. Treatments, such as benzimidazolethiol, prevent surface oxidation of bare copper. The places to which components will be mounted are typically plated, because untreated bare copper oxidizes quickly, and therefore is n... |
What's the process by which bare copper gets covered in solder? | Context: Matte solder is usually fused to provide a better bonding surface or stripped to bare copper. Treatments, such as benzimidazolethiol, prevent surface oxidation of bare copper. The places to which components will be mounted are typically plated, because untreated bare copper oxidizes quickly, and therefore is n... |
What does hot air solder leveling ensure the coated copper will have? | Context: Matte solder is usually fused to provide a better bonding surface or stripped to bare copper. Treatments, such as benzimidazolethiol, prevent surface oxidation of bare copper. The places to which components will be mounted are typically plated, because untreated bare copper oxidizes quickly, and therefore is n... |
What alloy can no longer be used in HASL because of restrictions on the use of one of its metal components? | Context: Matte solder is usually fused to provide a better bonding surface or stripped to bare copper. Treatments, such as benzimidazolethiol, prevent surface oxidation of bare copper. The places to which components will be mounted are typically plated, because untreated bare copper oxidizes quickly, and therefore is n... |
Shiny solder is usually fused to do what? | Context: Matte solder is usually fused to provide a better bonding surface or stripped to bare copper. Treatments, such as benzimidazolethiol, prevent surface oxidation of bare copper. The places to which components will be mounted are typically plated, because untreated bare copper oxidizes quickly, and therefore is n... |
What encourages surface oxidation of bare copper? | Context: Matte solder is usually fused to provide a better bonding surface or stripped to bare copper. Treatments, such as benzimidazolethiol, prevent surface oxidation of bare copper. The places to which components will be mounted are typically plated, because untreated bare copper oxidizes quickly, and therefore is n... |
Traditionally, any exposed silver was coated with what? | Context: Matte solder is usually fused to provide a better bonding surface or stripped to bare copper. Treatments, such as benzimidazolethiol, prevent surface oxidation of bare copper. The places to which components will be mounted are typically plated, because untreated bare copper oxidizes quickly, and therefore is n... |
The HASL finish encourages oxidation from what? | Context: Matte solder is usually fused to provide a better bonding surface or stripped to bare copper. Treatments, such as benzimidazolethiol, prevent surface oxidation of bare copper. The places to which components will be mounted are typically plated, because untreated bare copper oxidizes quickly, and therefore is n... |
What is now used in compliance with the RoHS directive in the EU and China? | Context: Matte solder is usually fused to provide a better bonding surface or stripped to bare copper. Treatments, such as benzimidazolethiol, prevent surface oxidation of bare copper. The places to which components will be mounted are typically plated, because untreated bare copper oxidizes quickly, and therefore is n... |
What does OSP stand for? | Context: Other platings used are OSP (organic surface protectant), immersion silver (IAg), immersion tin, electroless nickel with immersion gold coating (ENIG), electroless nickel electroless palladium immersion gold (ENEPIG) and direct gold plating (over nickel). Edge connectors, placed along one edge of some boards, ... |
What metal is often under the gold plating on edge connectors? | Context: Other platings used are OSP (organic surface protectant), immersion silver (IAg), immersion tin, electroless nickel with immersion gold coating (ENIG), electroless nickel electroless palladium immersion gold (ENEPIG) and direct gold plating (over nickel). Edge connectors, placed along one edge of some boards, ... |
What's the abbreviation for immersion silver plating? | Context: Other platings used are OSP (organic surface protectant), immersion silver (IAg), immersion tin, electroless nickel with immersion gold coating (ENIG), electroless nickel electroless palladium immersion gold (ENEPIG) and direct gold plating (over nickel). Edge connectors, placed along one edge of some boards, ... |
Ag3Cu is one intermetallic that tin forms; what's the other one? | Context: Other platings used are OSP (organic surface protectant), immersion silver (IAg), immersion tin, electroless nickel with immersion gold coating (ENIG), electroless nickel electroless palladium immersion gold (ENEPIG) and direct gold plating (over nickel). Edge connectors, placed along one edge of some boards, ... |
What might the rapid diffusion of coating metal into tin solder leave in the surface coating? | Context: Other platings used are OSP (organic surface protectant), immersion silver (IAg), immersion tin, electroless nickel with immersion gold coating (ENIG), electroless nickel electroless palladium immersion gold (ENEPIG) and direct gold plating (over nickel). Edge connectors, placed along one edge of some boards, ... |
Main connectors, placed along one edge of some boards, are often what? | Context: Other platings used are OSP (organic surface protectant), immersion silver (IAg), immersion tin, electroless nickel with immersion gold coating (ENIG), electroless nickel electroless palladium immersion gold (ENEPIG) and direct gold plating (over nickel). Edge connectors, placed along one edge of some boards, ... |
The only coating consideration is what? | Context: Other platings used are OSP (organic surface protectant), immersion silver (IAg), immersion tin, electroless nickel with immersion gold coating (ENIG), electroless nickel electroless palladium immersion gold (ENEPIG) and direct gold plating (over nickel). Edge connectors, placed along one edge of some boards, ... |
What forms intermetallics such a Cu66n6? | Context: Other platings used are OSP (organic surface protectant), immersion silver (IAg), immersion tin, electroless nickel with immersion gold coating (ENIG), electroless nickel electroless palladium immersion gold (ENEPIG) and direct gold plating (over nickel). Edge connectors, placed along one edge of some boards, ... |
Electroless silver with immersion gold coating (ENIG) is an example of what? | Context: Other platings used are OSP (organic surface protectant), immersion silver (IAg), immersion tin, electroless nickel with immersion gold coating (ENIG), electroless nickel electroless palladium immersion gold (ENEPIG) and direct gold plating (over nickel). Edge connectors, placed along one edge of some boards, ... |
Electroless silver electroless palladium immersion gold (ENEPIG) is an example of what? | Context: Other platings used are OSP (organic surface protectant), immersion silver (IAg), immersion tin, electroless nickel with immersion gold coating (ENIG), electroless nickel electroless palladium immersion gold (ENEPIG) and direct gold plating (over nickel). Edge connectors, placed along one edge of some boards, ... |
What's the process whereby metal filaments are grown on or in a PCB via DC voltage? | Context: Electrochemical migration (ECM) is the growth of conductive metal filaments on or in a printed circuit board (PCB) under the influence of a DC voltage bias. Silver, zinc, and aluminum are known to grow whiskers under the influence of an electric field. Silver also grows conducting surface paths in the presence... |
Along with silver and aluminum, what metal grows metal filaments when exposed to an electric field? | Context: Electrochemical migration (ECM) is the growth of conductive metal filaments on or in a printed circuit board (PCB) under the influence of a DC voltage bias. Silver, zinc, and aluminum are known to grow whiskers under the influence of an electric field. Silver also grows conducting surface paths in the presence... |
In addition to "whiskers," what does silver sprout around ions like halide? | Context: Electrochemical migration (ECM) is the growth of conductive metal filaments on or in a printed circuit board (PCB) under the influence of a DC voltage bias. Silver, zinc, and aluminum are known to grow whiskers under the influence of an electric field. Silver also grows conducting surface paths in the presence... |
What do scientist call the function whereby tin changes when it's very cold? | Context: Electrochemical migration (ECM) is the growth of conductive metal filaments on or in a printed circuit board (PCB) under the influence of a DC voltage bias. Silver, zinc, and aluminum are known to grow whiskers under the influence of an electric field. Silver also grows conducting surface paths in the presence... |
What's present in plated surfaces that causes tin to grow metal filaments? | Context: Electrochemical migration (ECM) is the growth of conductive metal filaments on or in a printed circuit board (PCB) under the influence of a DC voltage bias. Silver, zinc, and aluminum are known to grow whiskers under the influence of an electric field. Silver also grows conducting surface paths in the presence... |
What material is a good choice for electronics use? | Context: Electrochemical migration (ECM) is the growth of conductive metal filaments on or in a printed circuit board (PCB) under the influence of a DC voltage bias. Silver, zinc, and aluminum are known to grow whiskers under the influence of an electric field. Silver also grows conducting surface paths in the presence... |
Tin plast is what type of issue? | Context: Electrochemical migration (ECM) is the growth of conductive metal filaments on or in a printed circuit board (PCB) under the influence of a DC voltage bias. Silver, zinc, and aluminum are known to grow whiskers under the influence of an electric field. Silver also grows conducting surface paths in the presence... |
The transformation of silver to a powdery allotrope at low temperature is know as what? | Context: Electrochemical migration (ECM) is the growth of conductive metal filaments on or in a printed circuit board (PCB) under the influence of a DC voltage bias. Silver, zinc, and aluminum are known to grow whiskers under the influence of an electric field. Silver also grows conducting surface paths in the presence... |
AC voltage bias helps promote the growth of what? | Context: Electrochemical migration (ECM) is the growth of conductive metal filaments on or in a printed circuit board (PCB) under the influence of a DC voltage bias. Silver, zinc, and aluminum are known to grow whiskers under the influence of an electric field. Silver also grows conducting surface paths in the presence... |
If part of a PCB isn't solderable, what can be used instead? | Context: Areas that should not be soldered may be covered with solder resist (solder mask). One of the most common solder resists used today is called "LPI" (liquid photoimageable solder mask). A photo-sensitive coating is applied to the surface of the PWB, then exposed to light through the solder mask image film, and... |
What's another term used for "solder resist"? | Context: Areas that should not be soldered may be covered with solder resist (solder mask). One of the most common solder resists used today is called "LPI" (liquid photoimageable solder mask). A photo-sensitive coating is applied to the surface of the PWB, then exposed to light through the solder mask image film, and... |
What solder resist with a four-word name is a popular choice in the industry? | Context: Areas that should not be soldered may be covered with solder resist (solder mask). One of the most common solder resists used today is called "LPI" (liquid photoimageable solder mask). A photo-sensitive coating is applied to the surface of the PWB, then exposed to light through the solder mask image film, and... |
What kind of coating gets applied to the PWB before light exposure? | Context: Areas that should not be soldered may be covered with solder resist (solder mask). One of the most common solder resists used today is called "LPI" (liquid photoimageable solder mask). A photo-sensitive coating is applied to the surface of the PWB, then exposed to light through the solder mask image film, and... |
What solder resist is so inaccurate that few choose it anymore? | Context: Areas that should not be soldered may be covered with solder resist (solder mask). One of the most common solder resists used today is called "LPI" (liquid photoimageable solder mask). A photo-sensitive coating is applied to the surface of the PWB, then exposed to light through the solder mask image film, and... |
Areas that should be soldered may be covered with what? | Context: Areas that should not be soldered may be covered with solder resist (solder mask). One of the most common solder resists used today is called "LPI" (liquid photoimageable solder mask). A photo-sensitive coating is applied to the surface of the PWB, then exposed to light through the solder mask image film, and... |
A photo-sensitive coating is applied beneath the surface of what? | Context: Areas that should not be soldered may be covered with solder resist (solder mask). One of the most common solder resists used today is called "LPI" (liquid photoimageable solder mask). A photo-sensitive coating is applied to the surface of the PWB, then exposed to light through the solder mask image film, and... |
Wet film solder mask is similar to what? | Context: Areas that should not be soldered may be covered with solder resist (solder mask). One of the most common solder resists used today is called "LPI" (liquid photoimageable solder mask). A photo-sensitive coating is applied to the surface of the PWB, then exposed to light through the solder mask image film, and... |
Screen print epoxy ink is commonly used why? | Context: Areas that should not be soldered may be covered with solder resist (solder mask). One of the most common solder resists used today is called "LPI" (liquid photoimageable solder mask). A photo-sensitive coating is applied to the surface of the PWB, then exposed to light through the solder mask image film, and... |
What doesn't provide protection from the environment? | Context: Areas that should not be soldered may be covered with solder resist (solder mask). One of the most common solder resists used today is called "LPI" (liquid photoimageable solder mask). A photo-sensitive coating is applied to the surface of the PWB, then exposed to light through the solder mask image film, and... |
What are bare-board tests looking for besides "opens"? | Context: Unpopulated boards are usually bare-board tested for "shorts" and "opens". A short is a connection between two points that should not be connected. An open is a missing connection between points that should be connected. For high-volume production a fixture or a rigid needle adapter is used to make contact wit... |
What's an absent connection that needs to be linked up on an unpopulated board called? | Context: Unpopulated boards are usually bare-board tested for "shorts" and "opens". A short is a connection between two points that should not be connected. An open is a missing connection between points that should be connected. For high-volume production a fixture or a rigid needle adapter is used to make contact wit... |
What conductive metal are the lands on a circuit board made out of? | Context: Unpopulated boards are usually bare-board tested for "shorts" and "opens". A short is a connection between two points that should not be connected. An open is a missing connection between points that should be connected. For high-volume production a fixture or a rigid needle adapter is used to make contact wit... |
What does a flying probe tester deliver to the contact points during testing? | Context: Unpopulated boards are usually bare-board tested for "shorts" and "opens". A short is a connection between two points that should not be connected. An open is a missing connection between points that should be connected. For high-volume production a fixture or a rigid needle adapter is used to make contact wit... |
What system tells the flying probe where to go and what to do? | Context: Unpopulated boards are usually bare-board tested for "shorts" and "opens". A short is a connection between two points that should not be connected. An open is a missing connection between points that should be connected. For high-volume production a fixture or a rigid needle adapter is used to make contact wit... |
Populated boards are usually what? | Context: Unpopulated boards are usually bare-board tested for "shorts" and "opens". A short is a connection between two points that should not be connected. An open is a missing connection between points that should be connected. For high-volume production a fixture or a rigid needle adapter is used to make contact wit... |
A long is a connection between what? | Context: Unpopulated boards are usually bare-board tested for "shorts" and "opens". A short is a connection between two points that should not be connected. An open is a missing connection between points that should be connected. For high-volume production a fixture or a rigid needle adapter is used to make contact wit... |
A closed is a missing connection between what? | Context: Unpopulated boards are usually bare-board tested for "shorts" and "opens". A short is a connection between two points that should not be connected. An open is a missing connection between points that should be connected. For high-volume production a fixture or a rigid needle adapter is used to make contact wit... |
Building the adapter is low cost and economical for? | Context: Unpopulated boards are usually bare-board tested for "shorts" and "opens". A short is a connection between two points that should not be connected. An open is a missing connection between points that should be connected. For high-volume production a fixture or a rigid needle adapter is used to make contact wit... |
Surface-mount is one type of construction used in PCB assembly; what's the other one? | Context: Often, through-hole and surface-mount construction must be combined in a single assembly because some required components are available only in surface-mount packages, while others are available only in through-hole packages. Another reason to use both methods is that through-hole mounting can provide needed s... |
Which type of construction makes components that use more space? | Context: Often, through-hole and surface-mount construction must be combined in a single assembly because some required components are available only in surface-mount packages, while others are available only in through-hole packages. Another reason to use both methods is that through-hole mounting can provide needed s... |
Which of the two kinds of construction is weaker under strain? | Context: Often, through-hole and surface-mount construction must be combined in a single assembly because some required components are available only in surface-mount packages, while others are available only in through-hole packages. Another reason to use both methods is that through-hole mounting can provide needed s... |
If you're building a circuit board that has a lot of components that won't be used, which construction would be better? | Context: Often, through-hole and surface-mount construction must be combined in a single assembly because some required components are available only in surface-mount packages, while others are available only in through-hole packages. Another reason to use both methods is that through-hole mounting can provide needed s... |
What must be combined in a multiple assembly? | Context: Often, through-hole and surface-mount construction must be combined in a single assembly because some required components are available only in surface-mount packages, while others are available only in through-hole packages. Another reason to use both methods is that through-hole mounting can provide needed s... |
Surface mount mounting can provide needed strength for what? | Context: Often, through-hole and surface-mount construction must be combined in a single assembly because some required components are available only in surface-mount packages, while others are available only in through-hole packages. Another reason to use both methods is that through-hole mounting can provide needed s... |
Components that are expected to be touched will take up what? | Context: Often, through-hole and surface-mount construction must be combined in a single assembly because some required components are available only in surface-mount packages, while others are available only in through-hole packages. Another reason to use both methods is that through-hole mounting can provide needed s... |
All required components are available only in what? | Context: Often, through-hole and surface-mount construction must be combined in a single assembly because some required components are available only in surface-mount packages, while others are available only in through-hole packages. Another reason to use both methods is that through-hole mounting can provide needed s... |
Do test circuits create permanent or temporary connections between traces? | Context: In boundary scan testing, test circuits integrated into various ICs on the board form temporary connections between the PCB traces to test that the ICs are mounted correctly. Boundary scan testing requires that all the ICs to be tested use a standard test configuration procedure, the most common one being the ... |
What's the most frequently used test configuration procedure for ICs? | Context: In boundary scan testing, test circuits integrated into various ICs on the board form temporary connections between the PCB traces to test that the ICs are mounted correctly. Boundary scan testing requires that all the ICs to be tested use a standard test configuration procedure, the most common one being the ... |
What would you avoid by using the Joint Test Action Group standard? | Context: In boundary scan testing, test circuits integrated into various ICs on the board form temporary connections between the PCB traces to test that the ICs are mounted correctly. Boundary scan testing requires that all the ICs to be tested use a standard test configuration procedure, the most common one being the ... |
What component of the printed circuit board is appraised with boundary scan testing? | Context: In boundary scan testing, test circuits integrated into various ICs on the board form temporary connections between the PCB traces to test that the ICs are mounted correctly. Boundary scan testing requires that all the ICs to be tested use a standard test configuration procedure, the most common one being the ... |
To whom would you go to acquire the algorithms you'd use for the Joint Test Action Group procedures? | Context: In boundary scan testing, test circuits integrated into various ICs on the board form temporary connections between the PCB traces to test that the ICs are mounted correctly. Boundary scan testing requires that all the ICs to be tested use a standard test configuration procedure, the most common one being the ... |
Bouncing scan testing requires what? | Context: In boundary scan testing, test circuits integrated into various ICs on the board form temporary connections between the PCB traces to test that the ICs are mounted correctly. Boundary scan testing requires that all the ICs to be tested use a standard test configuration procedure, the most common one being the ... |
The least common standard test configuration procedure is what? | Context: In boundary scan testing, test circuits integrated into various ICs on the board form temporary connections between the PCB traces to test that the ICs are mounted correctly. Boundary scan testing requires that all the ICs to be tested use a standard test configuration procedure, the most common one being the ... |
JAG tool vendors provide various types of what? | Context: In boundary scan testing, test circuits integrated into various ICs on the board form temporary connections between the PCB traces to test that the ICs are mounted correctly. Boundary scan testing requires that all the ICs to be tested use a standard test configuration procedure, the most common one being the ... |
The JAG test architecture provides a means to what? | Context: In boundary scan testing, test circuits integrated into various ICs on the board form temporary connections between the PCB traces to test that the ICs are mounted correctly. Boundary scan testing requires that all the ICs to be tested use a standard test configuration procedure, the most common one being the ... |
If a PCB is intended for use in an setting with extreme conditions, what would probably be applied? | Context: PCBs intended for extreme environments often have a conformal coating, which is applied by dipping or spraying after the components have been soldered. The coat prevents corrosion and leakage currents or shorting due to condensation. The earliest conformal coats were wax; modern conformal coats are usually dip... |
A conformal coating can be applied by spraying the PCB or by doing what else to it? | Context: PCBs intended for extreme environments often have a conformal coating, which is applied by dipping or spraying after the components have been soldered. The coat prevents corrosion and leakage currents or shorting due to condensation. The earliest conformal coats were wax; modern conformal coats are usually dip... |
The conformal coating can prevent leaking, shorts, and what other type of moisture damage? | Context: PCBs intended for extreme environments often have a conformal coating, which is applied by dipping or spraying after the components have been soldered. The coat prevents corrosion and leakage currents or shorting due to condensation. The earliest conformal coats were wax; modern conformal coats are usually dip... |
What material was first used for conformal coating? | Context: PCBs intended for extreme environments often have a conformal coating, which is applied by dipping or spraying after the components have been soldered. The coat prevents corrosion and leakage currents or shorting due to condensation. The earliest conformal coats were wax; modern conformal coats are usually dip... |
What action is made much more difficult for boards that have a conformal coating? | Context: PCBs intended for extreme environments often have a conformal coating, which is applied by dipping or spraying after the components have been soldered. The coat prevents corrosion and leakage currents or shorting due to condensation. The earliest conformal coats were wax; modern conformal coats are usually dip... |
PABs are intended for what type of environment? | Context: PCBs intended for extreme environments often have a conformal coating, which is applied by dipping or spraying after the components have been soldered. The coat prevents corrosion and leakage currents or shorting due to condensation. The earliest conformal coats were wax; modern conformal coats are usually dip... |
What type of coat encourages corrosion? | Context: PCBs intended for extreme environments often have a conformal coating, which is applied by dipping or spraying after the components have been soldered. The coat prevents corrosion and leakage currents or shorting due to condensation. The earliest conformal coats were wax; modern conformal coats are usually dip... |
The chief advantage to conformal coatings is what? | Context: PCBs intended for extreme environments often have a conformal coating, which is applied by dipping or spraying after the components have been soldered. The coat prevents corrosion and leakage currents or shorting due to condensation. The earliest conformal coats were wax; modern conformal coats are usually dip... |
Which coatings are usually dips of dilute solutions of wax rubber? | Context: PCBs intended for extreme environments often have a conformal coating, which is applied by dipping or spraying after the components have been soldered. The coat prevents corrosion and leakage currents or shorting due to condensation. The earliest conformal coats were wax; modern conformal coats are usually dip... |
What special protection are most PCBs shipped in? | Context: Many assembled PCBs are static sensitive, and therefore must be placed in antistatic bags during transport. When handling these boards, the user must be grounded (earthed). Improper handling techniques might transmit an accumulated static charge through the board, damaging or destroying components. Even bare b... |
What's another term for "grounded" in the context of PCBs? | Context: Many assembled PCBs are static sensitive, and therefore must be placed in antistatic bags during transport. When handling these boards, the user must be grounded (earthed). Improper handling techniques might transmit an accumulated static charge through the board, damaging or destroying components. Even bare b... |
What force can easily change or even completely destroy an etch on a PCB? | Context: Many assembled PCBs are static sensitive, and therefore must be placed in antistatic bags during transport. When handling these boards, the user must be grounded (earthed). Improper handling techniques might transmit an accumulated static charge through the board, damaging or destroying components. Even bare b... |
What class of PCBs are even more susceptible to static than standard ones? | Context: Many assembled PCBs are static sensitive, and therefore must be placed in antistatic bags during transport. When handling these boards, the user must be grounded (earthed). Improper handling techniques might transmit an accumulated static charge through the board, damaging or destroying components. Even bare b... |
Non-traditional PCBs include microwave PCBs and what other type of board? | Context: Many assembled PCBs are static sensitive, and therefore must be placed in antistatic bags during transport. When handling these boards, the user must be grounded (earthed). Improper handling techniques might transmit an accumulated static charge through the board, damaging or destroying components. Even bare b... |
Many assembled PABs are sensitive to what? | Context: Many assembled PCBs are static sensitive, and therefore must be placed in antistatic bags during transport. When handling these boards, the user must be grounded (earthed). Improper handling techniques might transmit an accumulated static charge through the board, damaging or destroying components. Even bare b... |
Proper handling techniques might transmit what? | Context: Many assembled PCBs are static sensitive, and therefore must be placed in antistatic bags during transport. When handling these boards, the user must be grounded (earthed). Improper handling techniques might transmit an accumulated static charge through the board, damaging or destroying components. Even bare b... |
What must be placed in static bags during transport? | Context: Many assembled PCBs are static sensitive, and therefore must be placed in antistatic bags during transport. When handling these boards, the user must be grounded (earthed). Improper handling techniques might transmit an accumulated static charge through the board, damaging or destroying components. Even bare b... |
An accumulated static charge though the user happens when what is done? | Context: Many assembled PCBs are static sensitive, and therefore must be placed in antistatic bags during transport. When handling these boards, the user must be grounded (earthed). Improper handling techniques might transmit an accumulated static charge through the board, damaging or destroying components. Even bare b... |
If a lead wasn't soldered manually, what device was used? | Context: The first PCBs used through-hole technology, mounting electronic components by leads inserted through holes on one side of the board and soldered onto copper traces on the other side. Boards may be single-sided, with an unplated component side, or more compact double-sided boards, with components soldered on b... |
Which type of PCB construction technique was used first? | Context: The first PCBs used through-hole technology, mounting electronic components by leads inserted through holes on one side of the board and soldered onto copper traces on the other side. Boards may be single-sided, with an unplated component side, or more compact double-sided boards, with components soldered on b... |
In through-hole construction, what are the leads on the front attached to on the back? | Context: The first PCBs used through-hole technology, mounting electronic components by leads inserted through holes on one side of the board and soldered onto copper traces on the other side. Boards may be single-sided, with an unplated component side, or more compact double-sided boards, with components soldered on b... |
Subsets and Splits
No community queries yet
The top public SQL queries from the community will appear here once available.