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In general, absorbent articles should comfortably fit the body of a wearer. Most absorbent articles include an absorbent pad formed by an absorbent core contained in a wrap comprising a barrier tissue and/or a forming tissue. The subject invention discloses an absorbent article generally having extensibility in at least one direction, preferably the cross-direction. Such extensibility permits an absorbent article to extend and expand about the wearer and thus to better conform to the body of the wearer. Such extension and expansion about the wearer is feasible because both the bodyside liner and the outer cover are extensible in at least the one direction.
In conventional structures, the outer cover is typically adhesively secured to the forming tissue of the absorbent pad. In such embodiments, extending the outer cover in the cross-direction extends the forming tissue in the cross-direction. The force used to extend the outer cover, and thence the absorbent pad, can tear or otherwise damage the forming tissue or the barrier tissue of the absorbent pad. Since the absorbent pad is typically a sealed enclosure, namely an absorbent core enclosed within the combination of a forming tissue and a barrier tissue, tearing the absorbent pad, namely either the forming tissue or the barrier tissue, can release superabsorbent particles and other absorbent materials, such as cellulose fluff into contact with the body of the wearer. Superabsorbent particles can irritate the skin of the wearer. Such tearing of the absorbent pad indicates failure of the absorbent article to perform properly. Therefore, it is critical to find a way to prevent tearing or other structural failure of the absorbent pad.
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in general, absorbent articles should comfortably fit the body of a wearer. most absorbent articles include an elastic pad formed by an absorbent core contained in a wrap comprising a barrier tissue and / or a forming tissue. the subject invention discloses an absorbent article generally having extensibility in at least one direction, preferably the cross - direction. such extensibility permits an absorbent article to extend and expand about the wearer and thus to better conform to the body of the wearer. such extension and expansion about the wearer is feasible because both the bodyside liner and the outer cover are extensible in at least the one direction. in conventional structures, the outer cover is typically adhesively secured to the forming tissue of the absorbent pad. in such embodiments, extending the outer cover in the cross - direction extends the forming tissue in the cross - direction. the force generated to extend the outer cover, and thence the absorbent pad, can tear or significantly damage the forming tissue or the barrier tissue of the absorbent device. since the absorbent pad is typically a structural enclosure, namely an elastic core enclosed within the combination of a forming tissue and a barrier tissue, tearing the absorbent pad, namely either the forming tissue or the barrier tissue, can damage superabsorbent particles and other absorbent material, such as cellulose fluff into contact with the body of the wearer. superabsorbent particles can irritate the skin of the wearer. such tearing of the absorbent pad implies failure of the absorbent article to perform properly. therefore, it is critical to find a way to eliminate tearing or other structural failure of the absorbent pad.
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In general, absorbent articles should comfortably fit the body of a wearer. Most absorbent articles include an absorbent pad formed by an absorbent core contained in a wrap comprising a barrier tissue and / or a forming tissue. The subject invention discloses an absorbent artic<2 generally having extensibility in at least one direction, preferably the cross - dir#c%ion. Such extensibolkty permits an absorbent article to extend and expand about the wearer and thus to better conform to the body of the wearer. Such extension and expansion about the wearer is feasible because both the bodyside liner and the outer cover are extensible in at least the one direction. In conventional strucrureQ, the lutfr c8ger is ttpica,ly adhesively secured to the forming tissue of the absorbent pad. In such embodiments, extending the outer cover in the cross - direction extends the forming tissue in the cross - direction. The force used to extend the outer cover, and thence the absorbent pad, can tear or otherwise damage the forming tissue or the barrier tissue of the absorbent pad. Since the absorbent pad is typically a sealed enclosure, namely an absorbent core enclosed Aithkn the combination of a forming tissue and a barrier tissue, tearing the absorbent pad, namely either the forming tissue or the barrier tissue, can release superabsorbent particles and other absorbent materials, such as cellulose fluff into contact with the body of the wearer. Superabsorbent particles can irritate the skin of the wearer. Such tearing of the absorbent pad indicates failure of the abqotbent article to perform properly. Therefore, it is critical to find a way to prevent %earLng or other structural failure of the absorbent pad.
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In general, absorbent articles should comfortably the body of a wearer. articles include an absorbent pad formed by an absorbent core contained wrap comprising a barrier tissue and/or a forming tissue. subject invention discloses an absorbent article generally having extensibility in at least one direction, preferably the cross-direction. Such extensibility permits an absorbent article to extend and expand about the wearer and thus to better conform to the body the wearer. extension and expansion the wearer is feasible because both the bodyside liner the outer are extensible in at least the one direction. In conventional structures, the outer is typically secured to the tissue of the absorbent pad. In such embodiments, extending the outer cover in the cross-direction extends the forming tissue in the cross-direction. The force to extend the outer cover, and thence the absorbent pad, can tear or otherwise damage the forming tissue or the barrier tissue of the absorbent pad. Since the absorbent pad is a sealed enclosure, namely an absorbent core enclosed within the combination of a forming tissue and a tearing the pad, namely either the forming tissue or the barrier can superabsorbent particles and other materials, such as cellulose fluff into contact with the body of the wearer. Superabsorbent particles can the skin of the Such tearing of the pad indicates failure of the absorbent article perform properly. Therefore, it is critical to find a way to prevent tearing or other structural failure of the absorbent pad.
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in genERAL, ABSORBent ARTIcLeS sHOuLd comfoRtaBly Fit THE bOdY oF A weARER. mosT aBsorBEnt ARtICLES IncLude an absorbENt PaD Formed BY An ABsoRbENT Core COntAinEd In a wrap comPRIsIng a BARRieR tIssuE And/oR a fOrmInG TISSue. THE SUbjEct InVEntiOn diSclOses an abSoRbEnt arTiCLe GENErally hAVINg eXtensIbilITY iN at leAst One DIrecTIOn, prEfERaBlY The croSs-dIrECtiON. sUch ExtensiBiLITY PeRMItS AN aBsORBENt ARTIcle to exTend aNd EXpANd AboUt thE WEareR ANd thUS TO betTEr ConfoRm TO tHE Body Of THE wEAREr. such eXTeNsIoN aND EXPANSIon about thE WEaReR IS FeASIBlE BEcaUSE bOTH THe bODYsIdE lIneR And thE OUter COVER are ExTEnSIble in aT LeasT tHe ONE dIrecTiON.
in CONVentIonAl STruCTureS, ThE outEr cOvEr iS TYpIcALly ADHesIVEly sECurEd to thE fORmIng TisSUE OF THE aBsorBENt PAd. in suCH EmbODiMENts, ExTEndING thE OUteR coVEr iN tHE cROSS-dIrEctIoN extends ThE fORMinG tissuE in THE CrOSS-dirECtiON. the FoRcE usED To ExtENd thE oUTER cOVer, AND THeNCe thE AbSorbEnT pAD, CAN teAR oR oTheRWIsE daMAge tHe Forming tiSsUe oR thE BArRIeR TISSUe of The AbSORbEnt Pad. sINce THe ABsoRBent pAd is TYpIcaLLY a seAlEd encLoSure, namELY AN AbSOrbENT cOrE EnclOSed WiTHIN tHe CombinaTIOn of a foRMiNG TiSSUe aND a bArrIEr tISsUe, tEArING tHE AbSOrBENT Pad, namely eitHEr tHe foRMING tISSuE Or THE barRIEr tisSUe, cAN releAse supeRABSOrbENT pArTiCleS aNd oThER AbsOrbEnt maTerIals, sUch aS CEllULOSE FLuff IntO cONTaCT WITH The BoDy of the WEaRer. SUPERabSoRBeNt PaRtIcLES cAn irriTaTe tHE skIn OF tHE weareR. sUCh teArinG of thE AbsoRBeNT PaD inDiCATeS faILure oF tHE abSoRBENT aRTiCLE To PERFoRm proPeRLY. thErefOre, It IS cRIticaL tO FInd a wAy tO PREVeNt TeARiNG Or othER STRUcturAl faIlUrE of tHe ABSoRbeNT pAD.
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In general, absorbent articles shouldcomfortably fit the body of a wearer. Most absorbent articlesinclude an absorbentpad formed by an absorbent core contained in a wrap comprising a barriertissue and/or a formingtissue. The subject inventiondiscloses an absorbent article generally having extensibility in at least onedirection,preferably thecross-direction. Such extensibility permits an absorbent article to extend and expand aboutthe wearerand thusto better conform tothe body of the wearer. Such extension and expansionabout thewearer is feasible because both the bodyside liner and the outer cover are extensible in at least the one direction. Inconventionalstructures, theouter cover is typically adhesively secured to theforming tissue of the absorbent pad.In such embodiments, extending the outer cover in the cross-direction extends the forming tissuein the cross-direction.The force usedto extend the outer cover, and thencethe absorbent pad,can tear or otherwise damage the forming tissue or the barrier tissue of the absorbent pad. Since the absorbent pad is typically a sealedenclosure, namely an absorbent core enclosed withinthe combination ofa formingtissue anda barrier tissue, tearing the absorbent pad,namely either the forming tissue or the barrier tissue, can release superabsorbent particles and other absorbent materials, such as cellulosefluff into contact with the body of the wearer.Superabsorbent particles can irritate theskin of the wearer. Suchtearing of theabsorbent pad indicates failure of the absorbent article to perform properly. Therefore, it is critical to find a wayto prevent tearing or other structural failure of the absorbent pad.
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In general, absorbent articles _should_ comfortably fit the body of a wearer. Most absorbent articles include _an_ absorbent pad formed _by_ an absorbent _core_ contained in a wrap comprising a barrier tissue and/or _a_ _forming_ tissue. The _subject_ invention discloses an absorbent _article_ generally having extensibility _in_ _at_ least one direction, preferably the cross-direction. Such extensibility permits an _absorbent_ article _to_ extend _and_ expand about the _wearer_ and _thus_ to better conform to the body of the wearer. Such extension and expansion about the wearer is feasible because _both_ the bodyside liner and the outer _cover_ are extensible in at least the one direction. In conventional _structures,_ _the_ outer cover is typically adhesively secured _to_ the forming tissue of the absorbent pad. In such embodiments, extending the outer cover in the cross-direction extends the _forming_ tissue in the _cross-direction._ The force used to extend the _outer_ cover, and thence the absorbent pad, can _tear_ or otherwise damage _the_ forming tissue or the barrier _tissue_ _of_ the absorbent pad. Since the _absorbent_ pad is typically _a_ sealed _enclosure,_ _namely_ an absorbent core enclosed within the combination of a forming tissue and a barrier tissue, tearing the absorbent pad, namely either the forming _tissue_ or the barrier tissue, _can_ release superabsorbent particles and other absorbent _materials,_ such as cellulose _fluff_ into contact _with_ the _body_ of the _wearer._ Superabsorbent particles can irritate the skin _of_ the wearer. Such tearing of the absorbent pad indicates failure of _the_ absorbent _article_ to perform properly. Therefore, it is critical _to_ find a way to _prevent_ tearing or other structural failure of _the_ absorbent pad.
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This application is based upon and claims the benefit of priority from the prior Japanese Patent Application No. 2000-159163, filed Mar. 31, 2000, the entire contents of which are incorporated herein by reference.
The present invention relates to a method of forming a composite member, in which a conductive portion is formed in an insulator, the composite member being used in, for example, a wiring board in the fields of electric appliances, electronic appliances and electric and electronic communication. The present invention also relates to a photosensitive composition and an insulating material that can be suitably used in the manufacturing method of the composite member. Further, the present invention relates to a composite member manufactured by the manufacturing method of the present invention and to a multi-layer wiring board and an electronic package including the particular composite member.
In recent years, increase in the degree of integration and miniaturization of various electric and electronic parts including a semiconductor device are being promoted. The particular tendency will be further promoted in the future without fail. In this connection, various measures are being proposed and tried in an attempt to apply a high density mounting to a printed circuit board including formation of a fine pattern and a fine pitch of a metal wiring and formation of a steric wiring.
Particularly, the steric wiring is indispensable to a high density mounting and, thus, various methods are being proposed in an attempt to manufacture a wiring board having a steric wiring. In general, the steric wirings are of a multi-layered structure such as a built-up wiring board prepared by laminating two dimensional printed wiring boards and a multi-layered wiring board. It is difficult to form a steric wiring having a free three dimensional shape. The built-up wiring board or the multi-layered wiring board has a structure that adjacent wiring layers are connected to each other by a conductive column called via. The via is formed by processing an insulating layer by a photolithography process using a photosensitive polyimide or resist, followed by selectively applying a plating to the via or by filling the via with a conductive paste. For forming a via by such a method, it is necessary to repeat a plurality of times the steps of resist coating, light exposure and etching, making the via formation highly laborious. In addition, it is difficult to improve the yield.
It is also possible to form the via by forming a through-hole (via hole) of a predetermined size in an insulating substrate constituting a printed wiring board by using a drill or a CO2 laser, followed by applying plating to the via hole or by filling the via hole with a conductive paste. In these methods, however, it is difficult to form freely a fine via having a size of scores of microns or less at a desired position.
In the method disclosed in Japanese Patent Disclosure No. 7-207450, a compound having a hydrophilic group is introduced into pores of three dimensional porous film such as a PTFE film. Under this condition, the film is subjected to a light exposure in a predetermined pattern by using a low pressure mercury lamp (wave lengths of 185 nm and 254 nm), thereby forming the hydrophilic group on the three dimensional porous film. Further, a metal plating is applied to the three dimensional porous film.
In the conventional method described above, however, the material forming the three dimensional porous film is deteriorated because a light beam having a short wavelength is used for the light exposure. Also, the light for the light exposure is absorbed by the three dimensional porous film and, thus, fails to reach the inner region of the porous body, resulting in failure to form fine vias.
Further, in the conventional method described above, the PTFE forming the three dimensional porous film reacts with the light for the light exposure so as to selectively form hydrophilic groups. However, PTFE is defective in that the molding workability is low and that PTFE is costly.
Another method of forming a via is disclosed in Japanese Patent Disclosure No. 11-24977. In this method, the entire surface of a porous insulating member is impregnated with a photosensitive composition containing, for example, a photosensitive reducing agent and a metal salt. Then, a light exposure is applied in a predetermined pattern to the impregnated insulating member so as to reduce the cation of the metal salt in the light exposed portion to a metal nucleus, followed by removing by washing the photosensitive composition in the non-light exposed portion. Further, an electroless plating or a soldering is applied to the residual metal nuclei so as to form vias of a predetermined pattern.
In the method described above, however, the entire surface of the porous insulating member is impregnated with a photosensitive composition containing a metal salt as described above, making it difficult to remove completely the metal salt adsorbed on the portion corresponding to the non-exposed portion after the light exposure step. As a result, a difficulty is brought about that the metal nuclei are precipitated on undesired portions in the subsequent reducing step. Such an abnormal deposition of the metal nuclei gives rise to a problem in terms of the insulating properties between adjacent vias and between adjacent wiring layers with progress in the fine pulverization of the pattern.
Also, in the via formed in the insulating substrate by the conventional method of manufacturing a wiring board, the insulating body and the conductive portion are brought into a direct contact. In this case, since the adhesion between the insulating body and the conductive portion is poor, a problem is generated that the conductive portion is peeled off the insulating substrate during the use.
Further, where a multi-layered wiring board is prepared by laminating a plurality of wiring boards manufactured by the conventional method of manufacturing a wiring board, it is required to further improve the electrical connection between the wiring layers of the wiring boards and the conductivity of the wiring.
An object of the present invention is to provide a method of manufacturing a composite member, which has a high degree of freedom in the design of a conductive circuit, in which deterioration of the insulating body is not brought about by the light exposure, and which is free from an abnormal deposition of a metal on the insulating body so as to form a conductive portion having a fine pattern.
Another object of the present invention is to provide a method of manufacturing a composite member, which has a high degree of freedom in the design of a conductive circuit, which permits manufacturing a composite member at a low manufacturing cost without giving adverse effects to the selectivity of the material of the insulating portion and to the molding workability, and which is free from an abnormal deposition of a metal on the insulating body so as to form a conductive portion having a fine pattern.
Another object of the present invention is to provide a photosensitive composition and an insulating material used for the manufacturing method of a composite member described above.
Another object of the present invention is to provide a composite member manufactured by the method described above.
Another object of the present invention is to provide a multi-layered wiring board comprising a composite member manufactured by the method described above.
Still another object of the present invention is to provide an electronic package using a composite member or a multi-layered wiring board manufactured by the method described above.
According to a first aspect of the present invention, there is provided a method of manufacturing a composite member in which a conductive portion is selectively formed in an insulating body, comprising:
(1) forming a photosensitive composition layer within or on the surface of said insulating body, said photosensitive composition containing a compound forming an ion-exchange group upon irradiation with light having a wavelength not shorter than 280 nm;
(2) exposing selectively the photosensitive composition layer to light having a wavelength not shorter than 280 nm so as to form ion-exchange groups in the light exposed portion; and
(3) forming the conductive portion by bonding a metal ion or metal to the ion-exchange group formed in the light exposed portion by the exposing.
According to a second aspect of the present invention, there is provided a method of manufacturing a composite member in which a conductive portion is selectively formed in an insulating body, comprising:
(1) forming a photosensitive composition layer within or on the surface of said insulating body, said photosensitive composition containing a compound having an ion-exchange group;
(2) exposing selectively the photosensitive composition layer to light having a wavelength not shorter than 280 nm so as to cause ion-exchange groups in the light exposed portion to disappear and to cause the ion-exchange groups to remain in the unexposed portion; and
(3) forming the conductive portion by bonding a metal ion or metal to be bonded to the ion-exchange group remaining in the unexposed portion after the exposing.
According to a third aspect of the present invention, there is provided a method of manufacturing a composite member in which a conductive portion is selectively formed in an insulating body, comprising:
(1) forming a photosensitive composition layer within or on the surface of said insulating body, said photosensitive composition containing a compound forming an ion-exchange group upon irradiation with light, and said compound being selected from the group consisting of an onium salt derivative, a sulfonium ester derivative, a carboxylic acid derivative and a naphthoquinone diazide derivative;
(2) exposing selectively the photosensitive composition layer to light so as to form ion-exchange groups in the light exposed portion; and
(3) forming the conductive portion by bonding a metal ion or metal to the ion-exchange group formed in the light exposed portion by the exposing.
According to a fourth aspect of the present invention, there is provided a method of manufacturing a composite member in which a conductive portion is selectively formed in an insulating body, comprising:
(1) forming a photosensitive composition layer within or on the surface of said insulating body, said photosensitive composition containing a compound having an ion-exchange group;
(2) exposing selectively the photosensitive composition layer to light so as to cause ion-exchange groups in the light exposed portion to disappear and to cause the ion-exchange groups to remain in the unexposed portion; and
(3) forming the conductive portion by bonding a metal ion or metal
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this application is based upon and claims the benefit of priority from the prior japanese patent application no. 2000 - 159163, filed mar. 31, 2000, the entire contents of which are incorporated herein by reference. the present invention relates to a method of forming a composite member, in which a conductive portion is formed in an insulator, the composite member being used in, for example, a wiring board in the fields of electric appliances, electronic appliances and electric and electronic communication. the present invention also relates to a photosensitive composition and partially insulating material that can be suitably used in the manufacturing method of the composite member. further, the present invention relates to a composite member manufactured by the manufacturing method of the present invention and then a multi - layer wiring board and an electronic package including the particular composite member. in recent years, increase in the degree of integration and miniaturization of various electric and electronic parts including a semiconductor device are being promoted. the particular tendency will be further promoted in the future without fail. in this connection, various measures are being proposed and tried in an attempt to apply a high density mounting of a printed circuit board including formation of a fine pattern and a fine pitch of a metal wiring and formation of a steric wiring. particularly, the steric wiring is indispensable to a high density mounting and, thus, various methods start being proposed in an attempt to manufacture a wiring board having a steric wiring. in general, the steric wirings are of a multi - layered structure such as a built - up wiring board constructed by producing two dimensional printed wiring boards and a multi - layered wiring board. it is difficult to form a steric wiring having a free three dimensional shape. the built - up wiring board or the multi - layered wiring board has a structure forming adjacent wiring layers be connected to each other by a conductive column called via. the via is formed by processing an insulating layer by a photolithography process using a photosensitive polyimide or resist, followed by selectively applying a plating to the via or by filling each via with a conductive paste. for forming a via by such a method, it is necessary to repeat a plurality of times the steps of resist coating, light exposure and etching, making the via formation highly laborious. in addition, it is difficult to improve the yield. it is also necessary to form the via by forming a through - hole ( via hole ) of a predetermined size in an insulating substrate constituting a printed wiring board by using a drill or a co2 laser, followed by applying plating to the via hole or by filling the via hole with a conductive paste. in these methods, however, it is difficult to form freely a fine via having a size of scores of microns or less at a desired position. in the method disclosed in japanese patent disclosure no. 7 - 207450, a compound having a hydrophilic group is introduced into pores of three dimensional porous film such as a ptfe film. under this condition, the film is subjected to a light exposure in a predetermined pattern by using a low pressure mercury lamp ( wave lengths of 185 nm and 254 nm ), thereby forming the hydrophilic group on the three dimensional porous film. further, a metal plating is applied to the three dimensional porous film. in the conventional method described above, however, the material forming the three dimensional porous film is deteriorated because a light beam having a short wavelength is used for the light exposure. also, the light for the light exposure is absorbed by the three dimensional porous film and, thus, fails to reach the inner region of the porous body, resulting in failure to form fine vias. further, in the conventional method described above, the ptfe forming the three dimensional porous film reacts with the light for the light exposure so as to selectively form hydrophilic groups. however, ptfe is defective in that the molding workability is low and that ptfe is costly. another method of forming a via is disclosed in japanese patent disclosure no. 11 - 24977. in this method, the entire surface of a porous insulating member is impregnated with a photosensitive composition containing, for example, a photosensitive reducing agent and a metal salt. then, a light exposure is applied in a predetermined pattern to the impregnated insulating member so as to reduce the cation of the metal salt in the light exposed portion to a metal nucleus, followed by removing by washing the photosensitive composition in the non - light exposed portion. further, an electroless plating or a soldering is applied to the residual metal nuclei so as to form vias of a predetermined pattern. in the method described above, however, the entire surface of the porous insulating member is impregnated with a photosensitive composition containing a metal salt as described above, making it difficult to remove completely the metal salt adsorbed on the portion corresponding to the non - exposed portion after the light exposure step. as a result, a difficulty is brought about that the metal nuclei are precipitated on undesired portions in the subsequent reducing step. such an abnormal deposition of the metal nuclei gives rise to a problem in terms of the insulating properties between adjacent vias and between adjacent wiring layers with progress in the fine pulverization of the pattern. also, in the via formed in the insulating substrate by the conventional method of manufacturing a wiring board, the insulating body and the conductive portion are brought into a direct contact. in this case, since the adhesion between the insulating body and the conductive portion is poor, a problem is generated that the conductive portion is peeled off the insulating substrate during the use. further, where a multi - layered wiring board is prepared by laminating a plurality of wiring boards manufactured by the conventional method of manufacturing a wiring board, it is required to further improve the electrical connection between the wiring layers of the wiring boards and the conductivity of the wiring. an object of the present invention is to provide a method of manufacturing a composite member, which has a high degree of freedom in the design of a conductive circuit, in which deterioration of the insulating body is not brought about by the light exposure, and which is free from an abnormal deposition of a metal on the insulating body so as to form a conductive portion having a fine pattern. another object of the present invention is to provide a method of manufacturing a composite member, which has a high degree of freedom in the design of a conductive circuit, which permits manufacturing a composite member at a low manufacturing cost without giving adverse effects to the selectivity of the material of the insulating portion and to the molding workability, and which is free from an abnormal deposition of a metal on the insulating body so as to form a conductive portion having a fine pattern. another object of the present invention is to provide a photosensitive composition and an insulating material used for the manufacturing method of a composite member described above. another object of the present invention is to provide a composite member manufactured by the method described above. another object of the present invention is to provide a multi - layered wiring board comprising a composite member manufactured by the method described above. still another object of the present invention is to provide an electronic package using a composite member or a multi - layered wiring board manufactured by the method described above. according to a first aspect of the present invention, there is provided a method of manufacturing a composite member in which a conductive portion is selectively formed in an insulating body, comprising : ( 1 ) forming a photosensitive composition layer within or on the surface of said insulating body, said photosensitive composition containing a compound forming an ion - exchange group upon irradiation with light having a wavelength not shorter than 280 nm ; ( 2 ) exposing selectively the photosensitive composition layer to light having a wavelength not shorter than 280 nm so as to form ion - exchange groups in the light exposed portion ; and ( 3 ) forming the conductive portion by bonding a metal ion or metal to the ion - exchange group formed in the light exposed portion by the exposing. according to a second aspect of the present invention, there is provided a method of manufacturing a composite member in which a conductive portion is selectively formed in an insulating body, comprising : ( 1 ) forming a photosensitive composition layer within or on the surface of said insulating body, said photosensitive composition containing a compound having an ion - exchange group ; ( 2 ) exposing selectively the photosensitive composition layer to light having a wavelength not shorter than 280 nm so as to cause ion - exchange groups in the light exposed portion to disappear and to cause the ion - exchange groups to remain in the unexposed portion ; and ( 3 ) forming the conductive portion by bonding a metal ion or metal to be bonded to the ion - exchange group remaining in the unexposed portion after the exposing. according to a third aspect of the present invention, there is provided a method of manufacturing a composite member in which a conductive portion is selectively formed in an insulating body, comprising : ( 1 ) forming a photosensitive composition layer within or on the surface of said insulating body, said photosensitive composition containing a compound forming an ion - exchange group upon irradiation with light, and said compound being selected from the group consisting of an onium salt derivative, a sulfonium ester derivative, a carboxylic acid derivative and a naphthoquinone diazide derivative ; ( 2 ) exposing selectively the photosensitive composition layer to light so as to form ion - exchange groups in the light exposed portion ; and ( 3 ) forming the conductive portion by bonding a metal ion or metal to the ion - exchange group formed in the light exposed portion by the exposing. according to a fourth aspect of the present invention, there is provided a method of manufacturing a composite member in which a conductive portion is selectively formed in an insulating body, comprising : ( 1 ) forming a photosensitive composition layer within or on the surface of said insulating body, said photosensitive composition containing a compound having an ion - exchange group ; ( 2 ) exposing selectively the photosensitive composition layer to light so as to cause ion - exchange groups in the light exposed portion to disappear and to cause the ion - exchange groups to remain in the unexposed portion ; and ( 3 ) forming the conductive portion by bonding a metal ion or metal
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This application is based upon and claims the beneR(t of priority from the prior Japanese Patent Application No. 2000 - 159163, filed Mar. 31, 2000, the entire contents of which are incorporated herein by reference. The present invention relates to a method of forming a composite member, in which a conductive portion is formed in an insulator, the composite member being used in, for example, a wiring board in the fields of electric appliances, electronic appliances and electric and electronic communication. The present invention also relates to a photosensitive composition and an insulating material that can be suitably used in the manufacturing method of the compoAitw member. Further, the present invention relates to a composite member manufactured by the manufacturing method of the present invention and to a multi - layer wiring board and an electronic package including the particular composite member. In recent years, increase in the degree of integration and miniaturization of various electric and electronic parts including a semiconductor device are being promoted. The particular tendency will be further promoted in the future without fail. In this connection, various measures are being proposed and tried in an attempt to apply a high density mounting to a printed circuit board including formation of a fine pattern and a fine pitch of a metal wiring and formation of a steric wiring. Particularly, the steric wiring is indispensable to a high density mounting and, thus, various methods are being proposed in an attempt to manufacture a wiring board having a steric wiring. In general, the steric wirings are of a multi - layered structure such as a built - up wiring board prepared by laminating two dimensional printed wiring boards and a multi - layered wiring board. It is difficult to form a steric wiring haviMr a free three dimensional shape. The built - up wiring board or the multi - layered wiring board has a structure that adjacent wiring layers are connected to each otn@r by a conductive column called via. The via is formed by processing an insulating layer by a photolithography process using a photosensitive polyimide or resist, followed by selectively applying a plating to the via or by filling the via with a conductive paste. For forming a via by such a method, it is necessary to repeat a plurality of times the steps of resist c(atinb, light exposure and etching, making the via formation highly laborious. In addition, it is difficult to improve the yield. It is also possible to form the via by forming a through - hole (via hole) of a predetermined size in an insulating substrate constituting a printed wiring board by using a drill or a CO2 laser, followed by applying plating to the via hole or by filling the via hole with a conductive paste. In these methods, however, it is difficult to form freely a cije via having a size of scores of microns or less at a desired position. In the method disclosed in Japanese Patent Disclosure No. 7 - 207450, a compound having a hydrophilic group is introduced into pores of three dimensional porous film such as a PTFE film. Under this condition, the film is subjected to a light exposure in a predetermined pattern by using a low pressure mercury lamp (wave lengths of 185 nm and 254 nm ), thereby forming the hydrophilic group on the three dimensional porous film. Further, a metal lla6ing is applied to the three dimensional porous film. In the conventional method described above, however, the material forming the three dimensional porous film is deteriorated because a light beam having a short wavelength is used for the light exposure. Also, the light for the light exposure is absorbed by the three dimensional porous film and, thus, fails to reach the inner region of the porous body, resulting in faiokre to form fine vias. Further, in the conventional method described above, the PTFE forming the three dimensional porous film reacts with the light for the light exposure so as to selectively form hydrophilic groups. However, PTFE is defective in that the molding workability is low and that PTFE is costly. Another method of forming a via is disclosed in Japanese Patent Disclosure No. 11 - 24977. In this method, the entire surface of a porous insulating member is impregnated with a photosensitive composition containing, for example, a photosensitive reducing agent and a metal salt. Then, a light exposure is applied in a predetermined pattern to the impregnated insulating member so as to reduce the cation of the metal salt in the light exposed portion to a metal nucleus, followed by removing by washing the photosensitive composition in the non - light exposed portion. Further, an electroless plating or a soldering is applied to the residual metal nuclei so as to form vias of a predetermined pattern. In the method described above, however, the entire surface of the porous insulating member is impregnated with a photosensitive composition containing a metal salt as described above, making it difficult to remove completely the metal salt adsorbed on the portion corresponding to the non - exposed portion after the light exposure step. As a result, a difficulty is brought about that the metal nuclei are precipitated on undesired portions in the subsequent reducing step. Such an abnormal deposition of the metal nuclei gives rise to a problem in terms of the insulating properties between adjacent vias and between adjacent wiring layers with progress in the fine pulverization of the pattern. Also, in the via formed in the insulating substrate by the conventional method of manufacturing a wiring board, the insulating body and the conductive portion are brought into a direct contact. In this case, since the adhesion between the insulating body and the conductive portion is poor, a problem is generated that the conductive portion is peeled off the insulating substrate during the use. Further, where a multi - layered wiring board is prepared by laminating a plurality of wiring boards manufactured by the conventional method of manufacturing a wiring board, it is required to further improve the electrical connection between the wiring layers of the wiring boards and the conductivity of the wiring. An object of the present invention is to provide a method of manufacturing a composite member, which has a high degree of freedom in the design of a conductive circuit, in which deterioration of the insulating body is not brought about by the light exposure, and which is free from an abnormal deposition of a metal on the insulating body so as to form a conductive portion having a fine pattern. Another object of the present invention is to provide a method of manufacturing a composite member, which has a high degree of freedom in the design of a conductive circuit, which permits manufacturing a composite member at a low manufacturing cost without giving adverse effects to the selectivity of the material of the insulating portion and to the mpleing workability, and which is free from an abnormal deposition of a metal on the insulating body so as to form a conductive portion having a fine pattern. Another object of the present invention is to provide a photosensitive composition and an insulating material used for the manufacturing method of a composite member described above. Another object of the present invention is to provide a composite member manufactured by the method described above. Another object of the present invention is to provide a multi - layered wiring board comprising a composite member manufactured by the method described above. Still another object of the present invention is to provide an electronic package using a composite member or a multi - layered wiring board manufactured by the method described above. According to a first aspect of the present invention, there is provided a method of manufacturing a composite member in which a conductive portion is selectively formed in an insulating body, comprising: (1) forming a photosensitive composition layer within or on the surface of said insulating body, said photosensitive composition containing a compound forming an ion - exchange group upon irradiation with light having a wavelength not shorter than 280 nm; (2) exposing selectively the photosensitive composition layer to light having a wavelength not shorter than 280 nm so as to form ion - exchange groups in the light exposed portion; and (3) forming the conductive portion by bonding a metal ion or metal to the ion - exchange group formed in the light exposed portion by the exposing. According to a second aspect of the present invention, there is provided a method of manufacturing a composite member in which a conductive portion is selectively formed in an insulating body, comprising: (1) forming a photosensitive composition layer within or on the surface of said insulating body, said photosensitive composition containing a compound having an ion - exchange group; (2) exposing selectively the photosensitive composition layer to light having a wavelength not shorter than 280 nm so as to cause ion - exchange groups in the light exposed portion to disappear and to cause the ion - exchange groups to remain in the unexposed portion; and (3) forming the conductive portion by bonding a metal ion or metal to be bonded to the ion - exchange group remaining in the unexposed portion after the exposing. According to a third aspect of the present invention, there is provided a method of manufacturing a composite member in which a conductive portion is selectively formed in an insulating body, comprising: (1) forming a photosensitive composition layer within or on the surface of said insulating body, said photosensitive composition containing a compound forming an ion - exchange group upon irradiation with light, and said compound being selected from the group consisting of an onium salt derivative, a sulfonium ester derivative, a carboxylic acid derivative and a naphthoquinone diazide derivative; (2) exposing selectively the photosensitive composition layer to light so as to form ion - exchange groups in the light exposed portion; and (3) forming the conductive portion by bonding a metal ion or metal to the ion - exchange group formed in the light exposed portion by the exposing. According to a fourth Sspec4 of the present invention, there is provided a method of manufacturing a composite member in which a conductive portion is selectively formed in an insulating body, comprising: (1) forming a photosensitive composition layer within or on the surface of said insulating body, said photosensitive composition containing a compound having an ion - exchange group; (2) exposing selectively the photosensitive composition layer to light so as to cause ion - exchange groups in the light exposed portion to disappear and to cause the ion - exchange groups to remain in the unexposed portion; and (3) forming the conductive portion by bonding a metal ion or metal
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This application is upon and claims the benefit of from prior Japanese Patent 2000-159163, filed Mar. 2000, the entire contents which are incorporated reference. The present invention relates to a method of a composite member, in a conductive portion is formed in an insulator, the composite member being used in, for example, a wiring board in the fields of electric appliances, electronic appliances and electric and electronic communication. The present invention also relates a photosensitive composition and insulating material that can be suitably used in the manufacturing method of the composite member. Further, invention relates to a composite member manufactured by the manufacturing method of the present invention a multi-layer wiring board and an package including the particular composite member. In years, increase in the degree of integration miniaturization of various electric and electronic parts including a semiconductor device being promoted. The particular tendency will be further promoted in the future without fail. In this connection, various measures are being proposed and tried in an attempt apply a high density mounting to a printed board including formation of a fine pattern and a fine pitch of a metal wiring and formation of a steric wiring. Particularly, the steric wiring is indispensable to a high density and, thus, various methods are being proposed in an attempt manufacture a wiring board having steric wiring. In general, the steric wirings are of multi-layered structure a built-up wiring board prepared laminating two dimensional printed wiring and a multi-layered wiring board. It is difficult to form a wiring having a free three dimensional shape. The built-up or the multi-layered wiring board a structure that adjacent layers are connected to each other by conductive column called via. The via is formed by processing an insulating layer by a photolithography process using a photosensitive resist, followed selectively applying a plating to the or by filling the via with a conductive paste. For forming a by such a method, it necessary to repeat a times the steps of resist coating, light exposure and etching, making the via formation highly laborious. In addition, it is difficult to improve the yield. It is also possible form the via by a through-hole (via hole) of a predetermined size in insulating constituting printed wiring board by using a or a CO2 laser, followed by applying to the via hole or by the via hole a paste. In these however, it is difficult to form freely a fine via having a size of scores of microns less at a desired position. In the method disclosed in Japanese Patent Disclosure compound having a hydrophilic group is into pores of three dimensional porous film such as a PTFE film. Under this condition, the film subjected to a light exposure in predetermined using a low pressure lamp (wave lengths of 185 nm 254 nm), thereby forming the group on the three dimensional porous film. Further, metal plating applied the three dimensional porous film. In the conventional method described above, however, the material forming the three dimensional porous is deteriorated because a light having a wavelength used for light exposure. Also, the light for the light exposure is absorbed by the three dimensional porous film and, thus, fails to reach the inner region of the porous body, resulting in failure to form fine vias. Further, in the conventional method described above, the PTFE the dimensional porous film reacts with the light for the light exposure so as to selectively form hydrophilic groups. However, PTFE is defective in that the molding workability is low and that PTFE costly. Another method of forming a via is disclosed in Japanese Patent Disclosure No. 11-24977. In the entire surface porous insulating member is with a photosensitive composition containing, for example, a photosensitive reducing agent and a metal salt. Then, a light exposure is in pattern to the impregnated insulating member so as to reduce the of the metal salt in the light exposed portion to a followed by removing by washing the photosensitive composition in the non-light exposed portion. Further, an electroless plating or a soldering is applied to the residual metal nuclei so as to form vias of a pattern. In the method described above, however, the entire surface of the porous insulating member is with photosensitive composition containing a metal salt as described above, making it difficult to remove completely the salt adsorbed on the portion corresponding to non-exposed portion after the light exposure step. As a result, a difficulty is brought about that the metal nuclei are precipitated on undesired portions in the subsequent reducing Such an abnormal deposition of the metal nuclei gives rise to a problem in of the insulating between adjacent vias and adjacent wiring layers with progress in the fine pulverization of the pattern. Also, in the via formed in the insulating substrate by the conventional method of manufacturing a wiring board, the insulating body and the conductive portion are brought into a direct contact. In this case, since the adhesion between insulating body and the conductive poor, a problem is generated that the conductive portion is peeled off the insulating substrate during the use. where a multi-layered wiring board is prepared by laminating a plurality of wiring boards manufactured by the conventional method of manufacturing a wiring board, it is required to further improve the connection between wiring layers of the wiring boards and the conductivity of the wiring. object of present invention is to provide a method of manufacturing a composite member, which has a high degree of freedom in the design of a conductive circuit, in which deterioration of the insulating body is not brought about by the light exposure, which is free from an abnormal deposition of a metal on the insulating so as to form a conductive portion having fine pattern. Another object of the present invention is provide a method of manufacturing a composite member, which has a high degree of freedom in the design of a conductive circuit, which permits manufacturing a composite member at a low manufacturing without giving effects to the selectivity of material of the portion and to the molding workability, and free from an abnormal deposition of a metal on the insulating body so as to form a conductive portion having a pattern. object of the present is to provide a photosensitive and an insulating material used for the manufacturing method of a composite member above. Another object of the present invention is to provide a composite manufactured by the method described above. Another object of the present invention is to provide a multi-layered wiring board comprising a composite member manufactured by the method above. Still another object the present invention is to an electronic package using a composite member or a multi-layered wiring board manufactured by the method described above. According to a first aspect of the invention, there is a method of manufacturing a composite member in which a conductive portion is selectively formed in insulating body, comprising: (1) forming a photosensitive composition layer within or on the surface of said insulating said photosensitive composition containing a compound forming an ion-exchange group upon irradiation with light having a wavelength not shorter than 280 nm; (2) exposing selectively the photosensitive composition layer to light having a not shorter than 280 so as to form ion-exchange groups the light portion; and (3) forming conductive portion by bonding a metal or metal to the ion-exchange group formed in the light exposed portion by the exposing. According to a of present invention, is provided a method of manufacturing a composite member in a conductive portion is selectively formed in an body, comprising: forming a photosensitive composition layer within or on the said insulating body, photosensitive containing a compound having an ion-exchange group; (2) exposing selectively the photosensitive layer to light a wavelength shorter than 280 nm so as to cause groups in the light exposed portion to disappear and to cause the ion-exchange to remain in the unexposed portion; and (3) forming the conductive portion by bonding a metal ion or metal to be bonded to the group in the unexposed portion after exposing. According to a aspect of the present invention, there is provided a method of manufacturing a composite member in a conductive portion is formed in an insulating body, comprising: (1) a composition layer within or on the surface of said insulating said photosensitive composition containing compound forming an ion-exchange group upon irradiation with light, and said compound from the group consisting of an onium salt derivative, a sulfonium ester derivative, a carboxylic acid derivative and a naphthoquinone diazide derivative; (2) exposing selectively the photosensitive composition layer to light so as to form ion-exchange groups in the light exposed portion; and (3) forming the conductive portion by bonding a metal ion or metal the ion-exchange group formed in light exposed portion by exposing. According to a fourth aspect of the present there is provided a method of manufacturing a composite member in which a conductive portion is selectively formed in an insulating body, comprising: (1) forming a photosensitive layer within or on the surface of said insulating body, said photosensitive containing a compound having an ion-exchange group; (2) exposing selectively the photosensitive composition layer to light as to cause ion-exchange groups the light exposed to disappear and to cause the ion-exchange groups to remain in the unexposed portion; and (3) forming the conductive by bonding a metal ion or metal
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thIs aPPlICation iS BasEd upOn AND claIms The BeNEfiT of pRiORItY fRoM THE PrIor jaPAnEse PAtENt ApplICATION NO. 2000-159163, FilEd maR. 31, 2000, tHE ENTiRE CONTeNTs Of WHICh ARE IncorpORAtEd HErEiN BY RefERenCE.
ThE PReseNt iNvENtiON rELateS tO a methOD oF FOrmING a COMpOSItE mEMBeR, iN whIcH a CONDucTIVe POrTIon is ForMed in AN INSULAtOr, The comPoSITe mEMBER BeinG USed in, fOR EXAmPLe, a WIRInG BoaRD IN ThE fIELds Of ElEcTRIc aPpLIAnCEs, eLEcTrONIC APpliANCeS aND ELEcTriC aND ELECTroNIc CoMMUNiCAtiOn. The prESEnT iNVEntIon ALsO relAtes To a pHOTosEnSiTivE cOmpositiON aND an iNSulatINg MATERiAl thAT cAn be SUitAbly uSed IN THe MAnuFaCTuRINg meTHOd oF ThE cOMpOSITe meMBER. FurtHEr, tHe PReSeNt inveNtiON ReLaTEs to a coMPOsiTe meMbeR MaNUFActUreD BY tHE ManufaCtuRINg mETHod of ThE PrEsENT iNveNtIoN and TO A MultI-laYER WIrINg bOaRD anD an ELEcTROnic pacKAgE INcLUdINg THE paRTicUlAR CoMposite MeMbeR.
In reCEnt YeArS, INcREAsE IN the dEgReE OF integRATion And MiniAtUrIZATIOn OF vArIouS EleCtRic aND ELECTronic PARTs INcluding A sEmiconDUcToR deViCE ARE bEING proMoted. The ParTiCULaR tENdEncy WIlL be fUrTher promoteD IN The fUtURe WiThoUt fAIl. IN THIS cOnneCTIon, vARiOUs meASuReS ARE BeInG ProPoSEd AND trieD iN aN aTTEMpT TO aPPlY A HiGh deNSiTy MOUntInG tO A PrInTEd ciRCUIT boARd IncludINg ForMAtioN oF a fInE PattERn ANd A FINE pItch oF a metAl wIriNg And FormatiON OF a sTERic wIrING.
pARTiculARlY, the STeric wirInG IS iNDiSPeNsabLE tO A high DEnSiTy MouNtINg AND, THUs, VariOuS mEtHoDS ArE beiNg PROPosEd iN aN ATtemPT tO maNUfacTuRE a WIRING BOarD HaVing a STERIC WirINg. IN GeNERaL, The sterIC WIRinGS Are Of a muLTi-LayerED STruCTUrE SucH As A bUilt-up wIRINg BOArD pREPaRED BY lAMInATiNG TwO dImENSiOnAL PrINted wiring BoaRdS AND a mUlti-lAYERED WIrIng bOArd. iT Is diFfIculT TO FoRm A stEric wiRING hAViNg A FreE thReE DiMENSIONAl SHApE. thE buILT-Up WIrInG BOARd or THe muLtI-layEREd WIRiNG bOaRd has a STRUcTUrE tHAT aDJAceNt WIrING LAyErs aRe coNNecTeD TO eACh OtHeR By a ConDUCTiVE CoLUmn cALlEd ViA. tHe VIa is FORmEd By PROcessING An InSUlATinG LAYEr By a PhotOliTHOGrapHy proCesS usING a photoSensItIVE POlyiMIDe or rESist, fOlloweD By SeLeCtiVeLY apPlyINg A platiNG tO thE VIa OR BY fiLling THe vIA wITH a CONduCTIVe PasTe. for FORMINg A vIa bY sUch A METhoD, IT IS nEceSsAry To rEpEAt a PluRaLity Of Times THe sTEPs of ReSISt CoaTinG, lIghT ExpOSurE anD etchiNg, makinG the Via fORMAtioN hiGHLy LAboRIOuS. In addITIOn, It Is difFIcULt To IMPRove THE yiElD.
IT IS alSO PossIBLE To ForM THE ViA BY FormiNG a thrOugH-HOLE (via hOLE) of a PrEdetErmInED SIZE In An InSulATinG SUbsTRaTe coNsTITuTing a pRinted WIRiNG bOarD bY uSINg a Drill or A cO2 lasER, FOlLOwED BY APplYing PLaTING to the vIa HolE Or BY fIlLING tHE VIA HoLe wIth a conDUcTiVE pAste. In ThESE MEthODs, HoweVER, It iS DiffiCuLt TO FORM FrEElY A fInE viA HAviNg a SizE oF scores Of micrONS oR lESs AT A DesIREd pOSiTion.
IN thE MeThOD disClOsEd IN japanESE patEnT DisclosURE no. 7-207450, A comPOund HaVing A hydROphiLic GroUP is iNTROduCeD InTo POres OF THrEE DImENsIonAl porOUS fILM SuCH as A PTfE FIlM. UNDEr THis cOndITION, thE FiLm iS SubjEcteD tO A LigHT expOSuRE iN A pRedeteRmiNed pAtTERN BY uSinG a lOw pRESsUrE MErCuRy LaMP (WaVe leNgths of 185 nm And 254 NM), tHerEbY foRMInG tHe HYdrOpHILIC GrouP On The ThReE dImensiONaL PoroUS FIlM. furtHeR, A mETal pLatING iS ApplIEd to THe thREE dImEnSIONaL pOrOuS FiLM.
iN The cONveNTIONal METhod DescRibeD abOve, hoWEVeR, the mATeRIAL foRminG THE THree dImenSionAl Porous Film is dEteriORaTeD bEcaUSE a LIgHt BEAM haVInG A sHorT WAvelEnGTH Is USeD FoR the lighT ExpOSUrE. Also, tHE LiGhT for tHE LIGHt eXpoSURE is absORbEd BY thE THrEE dImeNSIOnaL POrous FILm and, ThUs, FaILs To rEaCH THe INNer rEGIOn Of tHE poRouS BOdy, reSUlTiNG iN FaiLURe To form FInE vIAs.
fURther, iN the CONvENTIOnaL mEthod deScrIbeD abOve, The pTFe foRMiNg tHe THree DimeNSIonAL PoROus FiLm rEACTS WITH The lIGHT fOR tHe LIGht eXPOSURe SO AS To sElecTiVELY FORm hydRophIlic GroupS. HOWEver, ptfE is DeFeCtivE In THAT THe MoLdINg WOrKAbILITY iS LOW And tHAT PTFe is costly.
anoTHEr MeTHOD OF fOrmInG a vIA Is dISCLoSeD in JApANeSe paTENT diSclOSUrE nO. 11-24977. In THIS mEtHOd, tHE eNtIre suRfAce Of A PoroUS insUlating MeMbEr IS ImPReGnaTED wITh a pHOToseNsiTiVE cOmPOSItion cOntAiNIng, For ExAmPlE, a phOtOseNsiTiVe REduCing AgENt ANd A metal sAlt. THen, a liGHT ExposURE is aPpLied IN A predeterMinEd paTTERn tO THE IMPrEGnAtED iNSulaTING mEMBer So as to reDuCe ThE CATioN oF tHE METAl saLt iN ThE lIgHT EXPOsed PorTiOn tO a mEtAl nUcleuS, FOLloWeD BY ReMoVing By wasHiNG THE PhOtosENsiTive COMPOsitIoN iN The NoN-lIGht ExPOsed PORtioN. fUrThEr, An elEcTroLeSs pLating oR A sOldERINg is aPpLIed TO THe RESidUal meTal nUcLEI So aS To fOrm vIas Of a PREDETeRmInEd PAtTeRN.
In THE meTHoD DeSCriBED aBOVe, HOwevEr, THe EntiRe SuRFacE OF tHe pOrOus iNsUlatIng mEmBEr IS iMpREGNatEd wiTh a pHOTOseNSitiVe COmposiTiON conTaInINg A mEtal SaLt as DesCRiBED aBoVE, making it DIFFicUlt To ReMOVe compLEtEly thE MEtAl sAlT ADSORBed On The portIOn CORRespoNdinG to tHE NoN-EXPosed PORTiON aftER thE lIgHT exPoSurE StEP. as A rEsuLT, A difficUlTY is brOugHT aboUT ThaT ThE metal NucLEi ARE PRECiPitaTed On undESIrEd POrtiOnS IN tHE sUBseQuENt ReDUCINg SteP. SUCH AN AbNoRMal DePOSitiON oF tHE MEtal NUcleI giVes rISe to A proBLeM In TErms OF THe inSuLATIng proPErtieS bEtWeEn AdJAcenT viAs aND beTWeen adJAceNt WirInG LayeRS WITH proGReSs In tHe fIne PulverIzaTioN oF THE Pattern.
also, iN THe vIA foRmED IN tHe iNsUlATIng SubsTrate by ThE CONVEnTIoNAL MeThoD Of maNUfACtUrInG a wIrING bOard, tHe INSuLAtIng bOdY anD THE coNDUCtivE POrTiON aRe bRoUGHT INtO A dIReCT cOntAct. in ThIS cAse, sINCe THe ADHeSion bEtWEEN ThE insuLatiNG boDY AnD the cONduCTiVE PoRTiOn is PoOr, a ProbLem IS GEnEraTED tHaT THe coNducTIve PORTION IS PEelEd OfF the iNSULating SUBsTRatE duRiNg The UsE.
FuRTher, wHere a MULTI-layErEd WirING BoARd iS PrepAReD by LAMiNaTinG a pLuRAlitY OF wirIng bOaRDs manuFactuRED By ThE COnveNTIOnAL MetHOd oF manUfACTURInG A wIRIng Board, iT IS ReQUIReD tO FurThER ImPROve The ELECTrIcAL cONNecTiON bEtween tHe WIRinG laYErs oF ThE WIRING BOARds aND tHE ConDuctiViTY of thE wIRing.
An objeCt OF tHe PresENt INveNTIon Is TO PrOViDe a meThod Of MANufacTurInG a coMPOsItE mEmBER, wHIcH HAS A hIgh deGREe of FReEdoM In tHe deSiGn OF a condUcTIVE CIrCuIt, IN wHiCH dETERiORAtion oF THe INsULaTInG BOdy is noT broUgHT aBOut by THE LIGHt eXPOSURe, and wHICH Is FreE from aN AbnorMAl DEPOsItion OF A MeTAl ON tHE insuLAtING boDY So aS To forM A cONDucTive pOrtIOn HavinG a fiNe pATterN.
AnotHER OBJect Of ThE PReseNT iNvEnTIOn is TO prOvIDe a METhoD of ManuFACtURINg a cOMpOSite membER, WHiCh Has A HiGh DEgree of FrEEdOM in THe dEsIgn of A COnDucTiVE CIRCuIt, which pErmITS MANUFaCtUrING a COMPOsiTe mEMBER aT a lOW mANUfActurinG cOST wiTHOUt GIViNG AdversE EfFEcts To THE SeLeCTivITY Of THE materiAL Of tHE InsulAtINg portION And to tHE molDINg WOrkAbility, and wHicH is FreE fRom An aBNoRMAl DePOSitioN of a meTaL on THe insULaTiNG body SO as TO FORM A CONducTiVe PoRTioN having a FIne PAtTErn.
anOTher oBJect Of the pRESeNt iNVeNTIoN iS To PrOVidE a photosensItIVe COmpOSitiON anD An INsULAting MaTERiaL USed for the manufACturiNG mEThOd OF A coMpOsITE MEMBeR deSCrIBeD aBove.
anotheR oBJEcT oF THe prEseNt iNvenTion iS TO ProvIde A compOSiTe MEMbeR ManUFacTurEd By THE MeTHod dEsCRiBED AbOvE.
ANothEr oBJECt OF thE PReSEnt iNVENtiOn is to pRoViDE A mulTi-LAYEreD wirIng Board cOMPrISInG a compOsItE mEmBER MaNUFACTUred By THE mEthod DeSCRIbeD abOvE.
sTill AnotHeR obJeCT Of THE prEseNt InveNtION is to PrOvIDe An eLectrONIC pacKaGE usInG a CompOsitE MEmBer Or a mUltI-LaYEReD WirIng bOaRd manuFACtURED bY thE METHOd DesCriBed AbOve.
ACcOrding tO A fIRsT aSPeCT Of the preSeNt INvENTIon, tHeRE iS prOViDeD A mETHoD Of MANufaCtuRiNG A cOMpOSite MEMBer In wHICH A cOnduCTivE PORtIon IS selEctivELY ForMeD iN An iNsulatiNG BOdY, CoMpRIsIng:
(1) FORMInG a PhoTOsEnSiTIVE CoMpoSitION laYER WIthIN or On The sUrfAce of SaId insulaTInG body, saId phOtOSENsItIvE COMPosItiOn ContAINiNg a COmpouNd fORmInG An ION-eXcHaNge GrOUp UPOn IrRadIAtION with LiGHT hAViNG a WAvElenGth NOT shorTER tHAn 280 Nm;
(2) ExPoSINg selEcTiveLY The PHoTosENsiTIvE CoMpOsiTION LayER To LiGHT haVing a waVelenGth nOT shOrTeR tHAn 280 Nm so As to FoRM IoN-exChangE gROUpS iN THe LIGhT eXpOsed poRtIon; AnD
(3) formINg ThE ConduCTIve PoRtION BY bONdinG A MetAl ION OR Metal tO the iOn-eXcHAnGe GROUp FormED iN thE LIgHt EXpOsED PorTiOn BY the EXPoSING.
ACCORDInG tO a seCOnD asPeCT oF THe PReSEnT InVenTIOn, thErE iS PrOvIDeD a mEtHOd Of MAnuFAcTUring a coMpoSIte mEmbEr In WHicH a CoNducTiVE PORTiON is SELECtIVeLY FOrMED in aN inSULatiNG body, CompRIsiNG:
(1) FOrMINg a PHOtOSensitiVe COmPOsiTIOn layEr wiThIN Or On THE surfAcE OF sAid INSuLATIng Body, SAID pHOtOSensitive cOMPOsITIOn COnTaIninG a CoMpoUnD HAvING an Ion-ExcHANGe GRoUP;
(2) EXPOsing SelecTIvELY thE phOTosenSItIvE ComPosItion LaYEr To LiGHt HaviNG A WaveLengtH NOT ShorTEr tHaN 280 Nm so AS TO cAUSe Ion-ExChAnge gRouPS in the lIghT ExPoseD porTiOn TO DIsApPEar aND To cAUSe ThE ioN-ExcHange gRoups tO reMaIn In ThE UnExPOSeD PORtION; ANd
(3) fOrMinG the COnDucTiVe porTion BY BONDING A mETAl IoN oR mEtal tO be boNdED To the ioN-EXcHange GRouP rEmAINing iN tHe uNexpoSED portiON AFTER tHe eXpOSIng.
aCcorDIng To a THird AsPeCt OF tHE prESenT InveNTion, THerE iS PRoVIDEd a mEThOD of mAnUfacturINg a cOmPoSITe MEmBeR In whICh a CoNduCTive PORTiON IS SelECtIvEly forMed in AN InsulATIng BOdY, CoMprising:
(1) foRminG A PhoTOseNSitIVE comPosItion lAyER WItHiN or on thE sURfAce Of SaId iNSUlAtInG BoDy, saID phOTOsenSItIVe cOMposItion COnTaINInG A compoUND fOrMIng AN ion-EXcHaNGE grOuP upoN irRaDIATiON wiTh ligHT, And SAId COmPOund BEIng SelEcTEd FRom the grouP cOnSIsTING Of An oNIUm salT DeRIVAtIvE, a SulFONIuM esTeR DeriVAtIve, A carbOXYLiC ACId DERiVATivE And a naphThoqUINonE diAzIde DeRivATIVE;
(2) EXpoSing SelectIVELY THe pHOtOseNsITIvE cOmPOSiTIon laYEr to liGhT so as to fOrM iON-EXCHAnGe GrOUpS In THe lIGHT ExPOsED PoRTiON; aND
(3) fORmIng ThE CONDUCtIvE pOrTION bY bONdinG a metAL Ion OR MEtaL TO tHe IOn-EXchANgE gROUp FOrmED in tHE lIGHT ExPoSed PORTIoN bY THE EXPosing.
ACCoRdiNg TO A FouRTH AsPECt of THe PreSENT InVENtiOn, tHERe is pRovided A MethoD oF MANufAcTURing A CoMPoSItE membER in wHiCh A CondUCTivE porTiON iS seLectIVeLY FORmEd IN aN InSuLatIng BODy, CoMpRisiNg:
(1) FOrmING A pHOTOSensitIVE ComPoSitIoN LAYer WiTHiN oR oN tHe surfAce Of SaId INsuLaTIng BodY, SAiD photOSENSITIVE COMpoSitiOn CoNtaInINg A compOUNd HAVinG An ION-eXchangE GRouP;
(2) ExPOSING SelEctivElY thE phoTOSENsiTIvE ComPOsItion lAYer tO lIgHt SO as TO cauSE IoN-ExchAngE groUpS iN tHe lIGHT ExpOsED PortiOn To DiSaPpear aNd tO caUse tHe ioN-eXCHaNgE GRouPs To REMAIn IN ThE UNEXPOsEd pOrtIOn; aNd
(3) forMINg tHE cONDUCTIvE PoRTiON by bONdiNg A meTaL iON Or MEtAL
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This application isbased upon and claimsthe benefit of priority from the prior Japanese Patent Application No. 2000-159163, filed Mar. 31, 2000, the entire contents of which are incorporated herein by reference. The present invention relates to amethod of forming a composite member, in which a conductive portion is formed inan insulator,the composite memberbeing used in, forexample, a wiring board in the fields of electricappliances, electronicappliances and electric and electronic communication. The presentinvention also relates to a photosensitive composition and an insulating material that can be suitably used in the manufacturingmethod ofthe composite member. Further, the present invention relatesto a composite member manufacturedby the manufacturing method ofthe present invention and to a multi-layer wiring board and anelectronic package including the particular composite member. In recent years, increase in the degree of integration and miniaturization of various electric and electronicparts including a semiconductor deviceare being promoted.Theparticular tendency will be further promotedin the future without fail. In this connection, various measuresare being proposed and tried in an attempt to apply a high density mounting to a printed circuitboard including formationofafinepattern and a fine pitch of a metal wiring and formation ofa steric wiring. Particularly, thesteric wiring is indispensable to a highdensity mounting and, thus, various methods are being proposed in anattempt to manufacture a wiring board having a stericwiring. In general, the steric wirings are of a multi-layered structure such as a built-up wiringboard prepared by laminating two dimensional printed wiring boards and amulti-layered wiring board. It is difficult to form a steric wiring having a free three dimensional shape. The built-up wiringboard or the multi-layered wiring boardhas a structurethat adjacent wiring layers are connectedto each other by a conductive column called via. The via is formed by processing an insulating layer bya photolithography process using a photosensitive polyimide or resist,followed by selectively applying a plating tothevia or by filling the viawith a conductive paste.For forminga via by such a method, it is necessary to repeat a plurality of times thesteps of resist coating, light exposure and etching, making the via formation highlylaborious. Inaddition, it is difficult to improve the yield.It isalso possible to form the viaby forming a through-hole (via hole) ofa predetermined size in an insulating substrate constituting aprintedwiring board by using a drill or a CO2 laser, followed by applying plating to the via hole or by filling the via hole with a conductive paste. In these methods, however,it isdifficult to form freelya fine via having a size of scoresof microns or less at adesired position. In the method disclosed in Japanese Patent Disclosure No. 7-207450, a compound having a hydrophilic groupis introduced into pores of three dimensional porous film such as a PTFE film. Underthis condition, thefilm is subjected to a light exposure in a predetermined pattern by using a low pressuremercury lamp (wave lengthsof 185 nm and254 nm), therebyforming the hydrophilic group onthe three dimensionalporous film. Further, ametal plating is applied to thethree dimensional porous film. In the conventional methoddescribed above, however,the material forming the threedimensional porousfilm is deterioratedbecause a light beam havinga short wavelength is used for the light exposure.Also, the light for the lightexposure isabsorbed by thethreedimensional porous film and, thus, failsto reachthe inner regionofthe porous body, resulting in failureto form fine vias. Further, inthe conventionalmethod described above,thePTFE forming the three dimensional porous filmreactswith the light for the light exposure so as to selectively form hydrophilic groups. However, PTFE is defective in that the molding workability is low and that PTFE iscostly. Another method of forminga via is disclosed in Japanese Patent Disclosure No. 11-24977. In this method, the entiresurface of a porous insulating member is impregnated with a photosensitive compositioncontaining, for example, a photosensitive reducing agentand a metal salt. Then, a light exposure is applied in a predetermined pattern to the impregnated insulating member soas to reduce the cation of the metalsalt in the light exposed portion to a metalnucleus, followed by removing by washing the photosensitive composition in the non-light exposed portion. Further, anelectroless plating ora soldering is applied to the residual metal nuclei so as to form vias of apredetermined pattern. In the methoddescribed above, however, the entire surface of the porous insulating member is impregnated with a photosensitive composition containing a metalsalt as described above, making it difficult to remove completely the metal saltadsorbedon the portion corresponding to the non-exposed portionafter thelight exposure step. As a result, a difficulty is brought about that themetal nuclei are precipitatedon undesired portions in the subsequent reducingstep. Suchan abnormal deposition of the metal nuclei gives rise to a problem in terms of the insulating properties between adjacent vias andbetween adjacent wiring layers with progressin the fine pulverization of the pattern.Also, in thevia formedin the insulating substrate by the conventional methodof manufacturinga wiringboard, the insulating body andthe conductive portion are brought into a direct contact. In this case, since the adhesionbetweenthe insulating body and the conductive portion is poor, a problem is generated that the conductiveportion is peeled off the insulating substrate during the use. Further,where amulti-layered wiring board is prepared by laminating aplurality of wiring boards manufactured by the conventionalmethod ofmanufacturing a wiring board, it is required to furtherimprove the electrical connectionbetween the wiringlayers of the wiring boards and the conductivity of the wiring. An objectof the present inventionis to provide a method of manufacturinga composite member, which has a high degreeof freedom in thedesign ofa conductive circuit, in which deterioration of the insulating body is not brought about bythe light exposure, and which is free froman abnormal deposition of a metalon the insulating body so as to form a conductive portion having a finepattern. Another object of the present invention is toprovide a method of manufacturing a compositemember, which has a high degree of freedom in the design ofa conductivecircuit, whichpermits manufacturing acompositemember at a lowmanufacturingcost without giving adverse effects totheselectivity of the material oftheinsulating portion and to the molding workability, and which is free from an abnormal deposition ofa metal onthe insulatingbody so as to form a conductive portion having afine pattern. Another object of the present invention is to provide a photosensitive composition and an insulating material used for the manufacturing method ofa composite memberdescribed above. Another object of the present invention is to providea composite membermanufactured bythe method described above. Another object of the present invention is toprovide a multi-layered wiring board comprising a composite member manufactured by the method described above. Still another object of thepresent inventionis to provide an electronic package using a composite member or a multi-layered wiring board manufactured by the method described above. According to a first aspect of the present invention, there is provided a method of manufacturing a composite member in which a conductive portion is selectively formed in an insulating body, comprising:(1)forming aphotosensitive compositionlayer within or onthe surface of said insulating body, said photosensitive composition containing a compound forming an ion-exchange group upon irradiationwith light having awavelength not shorter than 280 nm; (2)exposing selectivelythephotosensitive compositionlayerto light having a wavelength not shorter than 280 nmso as to form ion-exchange groups in the lightexposedportion; and(3) forming the conductiveportion bybonding a metal ion or metal to the ion-exchange group formedinthe light exposedportion by the exposing. According to a second aspect ofthe present invention, there is provideda method of manufacturing a composite member in which a conductive portion is selectively formed inan insulatingbody, comprising: (1) forming a photosensitive composition layer within or onthe surface of said insulating body, said photosensitive composition containing a compound having an ion-exchange group; (2) exposing selectively the photosensitivecomposition layer to light having a wavelengthnot shorter than 280 nmso as to cause ion-exchange groups in the light exposedportion todisappear andtocausethe ion-exchange groups to remain in theunexposedportion; and (3) formingthe conductiveportion by bonding a metal ionor metalto be bonded to the ion-exchange groupremaining in the unexposed portion after the exposing. According to a third aspect of thepresent invention,there is provided a method of manufacturing a composite member in which a conductive portion is selectively formed in an insulating body, comprising: (1) forming a photosensitive composition layer within or on the surfaceofsaid insulating body, said photosensitive composition containing a compound forming anion-exchange group upon irradiation with light, and said compound being selected from the group consisting of an onium saltderivative, a sulfonium ester derivative, acarboxylic acid derivative and a naphthoquinone diazide derivative; (2) exposing selectively the photosensitive composition layer to light so asto form ion-exchange groupsin the lightexposed portion; and (3) forming the conductive portionby bonding a metal ion or metal to the ion-exchange group formed inthe light exposed portion by the exposing. According to a fourth aspect of the present invention, there is provideda method of manufacturing a composite member in which a conductive portion is selectively formed in an insulating body, comprising: (1) forming a photosensitive composition layer within or on the surfaceof said insulating body, said photosensitive composition containing a compoundhaving an ion-exchange group; (2) exposing selectively the photosensitive composition layer to light so as to cause ion-exchange groups in thelight exposed portion to disappear and to cause the ion-exchange groups to remainin the unexposedportion; and (3)forming the conductive portion by bondinga metal ion or metal
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This application is based upon and claims the benefit of priority from the prior Japanese Patent Application No. 2000-159163, filed Mar. _31,_ 2000, the _entire_ _contents_ of _which_ _are_ incorporated herein by _reference._ _The_ present invention relates to _a_ method of _forming_ _a_ composite member, in which a conductive portion is formed in an insulator, the composite _member_ _being_ used in, for example, a wiring board _in_ the _fields_ of _electric_ appliances, electronic _appliances_ _and_ electric and electronic communication. The _present_ invention also relates to _a_ photosensitive composition and _an_ insulating material _that_ _can_ be suitably used in the manufacturing method of _the_ composite _member._ Further, the present invention relates _to_ _a_ composite member manufactured by the manufacturing method of the _present_ invention and to a multi-layer wiring board and _an_ _electronic_ package including the particular _composite_ member. In _recent_ years, increase in _the_ degree of integration and _miniaturization_ of various electric and electronic parts including a semiconductor device are being promoted. The particular _tendency_ will _be_ _further_ promoted in the future without fail. _In_ this connection, _various_ measures are being _proposed_ and tried _in_ an _attempt_ to apply _a_ high density mounting to a _printed_ _circuit_ board _including_ formation of a _fine_ _pattern_ and a fine pitch of _a_ metal wiring and formation of a _steric_ wiring. Particularly, the steric wiring is indispensable to a high density mounting and, _thus,_ various methods are being proposed in an _attempt_ _to_ manufacture a wiring board having a _steric_ wiring. _In_ general, the steric wirings are of a multi-layered structure such _as_ _a_ built-up wiring board prepared by laminating two _dimensional_ printed wiring boards and a multi-layered wiring _board._ It is difficult to form a steric wiring _having_ a free three dimensional shape. The built-up _wiring_ board or the _multi-layered_ wiring board has a structure that _adjacent_ wiring layers are _connected_ to _each_ _other_ by a conductive column called via. The via is _formed_ by processing an insulating layer _by_ a photolithography process using _a_ _photosensitive_ polyimide or _resist,_ _followed_ by selectively applying a plating to the via or by filling the via with a conductive paste. _For_ forming a via _by_ such a method, it _is_ necessary to repeat a plurality of _times_ the _steps_ of resist coating, _light_ exposure _and_ etching, making the via formation highly laborious. _In_ addition, it _is_ difficult to _improve_ the yield. It _is_ also _possible_ to form _the_ _via_ by forming a through-hole (via hole) _of_ _a_ predetermined size in an insulating substrate constituting a _printed_ wiring board by _using_ a drill or _a_ CO2 laser, _followed_ _by_ applying plating to the via _hole_ or by filling _the_ via hole with a conductive paste. In these methods, however, it is difficult to form freely a fine via having a size of _scores_ of _microns_ or _less_ at _a_ desired position. In the method disclosed in Japanese Patent Disclosure No. _7-207450,_ a compound having _a_ hydrophilic _group_ _is_ introduced into pores of three dimensional porous _film_ such as _a_ PTFE film. _Under_ this condition, _the_ film _is_ subjected to a _light_ exposure in a predetermined _pattern_ by using a _low_ pressure mercury _lamp_ (wave lengths of _185_ nm and 254 nm), thereby forming the hydrophilic group on the three dimensional porous film. Further, a metal plating is applied _to_ the three dimensional porous film. _In_ the _conventional_ method described above, however, the material _forming_ the three dimensional porous film _is_ _deteriorated_ because a light beam having a short wavelength is used for the light exposure. _Also,_ the light for the light exposure is absorbed by the _three_ dimensional porous film and, _thus,_ fails _to_ _reach_ _the_ inner region of the porous body, resulting in _failure_ to form fine vias. Further, in the _conventional_ method described above, _the_ _PTFE_ forming the three dimensional porous film _reacts_ _with_ _the_ light for _the_ light exposure so _as_ to selectively _form_ hydrophilic groups. _However,_ PTFE is _defective_ _in_ that the _molding_ _workability_ is _low_ and that _PTFE_ _is_ _costly._ Another method of forming a via is _disclosed_ in Japanese Patent Disclosure No. 11-24977. In this method, _the_ entire surface of _a_ porous insulating _member_ _is_ impregnated _with_ a photosensitive composition _containing,_ for example, a photosensitive reducing _agent_ and _a_ metal salt. Then, a light exposure is applied _in_ a predetermined pattern _to_ the _impregnated_ insulating _member_ so as to reduce the cation of the metal _salt_ in the _light_ exposed portion to a metal nucleus, _followed_ by removing by washing the photosensitive composition in _the_ non-light exposed _portion._ Further, an electroless plating or a soldering is _applied_ to the residual metal nuclei so as to _form_ _vias_ _of_ a predetermined pattern. In the method described _above,_ _however,_ _the_ entire surface of _the_ porous insulating member is impregnated with a _photosensitive_ composition _containing_ a metal salt as described above, making it difficult _to_ remove completely the metal salt _adsorbed_ _on_ the portion corresponding to the non-exposed portion after the light _exposure_ _step._ As a _result,_ a difficulty is brought about that the _metal_ nuclei are precipitated on undesired portions in the subsequent _reducing_ step. _Such_ an abnormal deposition of the metal _nuclei_ gives rise _to_ a _problem_ _in_ terms _of_ the insulating properties between adjacent vias and between adjacent wiring layers with progress _in_ _the_ _fine_ pulverization of the pattern. Also, _in_ the via formed _in_ _the_ insulating _substrate_ _by_ _the_ conventional _method_ of manufacturing a wiring _board,_ _the_ insulating body and the conductive _portion_ are brought into a direct _contact._ _In_ this case, since the adhesion between the insulating body and the conductive portion is poor, a _problem_ is generated _that_ the _conductive_ _portion_ is peeled _off_ the insulating substrate during the use. Further, where a multi-layered _wiring_ board _is_ prepared by _laminating_ a plurality _of_ wiring boards manufactured _by_ the _conventional_ method of manufacturing a wiring board, it is required to further improve the electrical connection between the wiring layers _of_ the wiring boards and the conductivity of the wiring. An _object_ of the present invention is to _provide_ a method of manufacturing a composite member, which has a high _degree_ _of_ _freedom_ in the design of a conductive _circuit,_ in _which_ deterioration of the insulating body is not brought about _by_ the light exposure, _and_ which is free from an abnormal deposition of a metal _on_ the insulating body so as to form a _conductive_ portion having a fine pattern. Another object of the present invention _is_ to provide a method of manufacturing a _composite_ _member,_ which has _a_ high _degree_ of freedom in the design of a conductive circuit, which permits manufacturing a _composite_ member at _a_ low manufacturing _cost_ _without_ giving adverse effects to the selectivity of the _material_ of _the_ insulating portion and _to_ the _molding_ _workability,_ and which is _free_ from _an_ abnormal deposition of a metal on the insulating body so as _to_ form a conductive portion having a _fine_ pattern. Another object _of_ the present invention is to provide a _photosensitive_ composition and an insulating material used for the manufacturing _method_ of a composite _member_ described above. Another object of the present invention _is_ to provide a _composite_ member manufactured by the _method_ described above. Another _object_ of the _present_ invention is _to_ provide a multi-layered wiring _board_ comprising _a_ composite _member_ manufactured _by_ _the_ method _described_ above. Still another object of the present invention _is_ to provide an _electronic_ package using a composite member or _a_ _multi-layered_ _wiring_ board manufactured by the method _described_ above. According to _a_ first aspect of _the_ present _invention,_ _there_ is provided a method of manufacturing a composite member in which _a_ conductive portion is selectively formed _in_ _an_ insulating body, _comprising:_ (1) forming _a_ photosensitive composition _layer_ within or on _the_ surface of _said_ insulating body, said photosensitive composition containing _a_ compound forming _an_ _ion-exchange_ group upon irradiation with light having _a_ wavelength not shorter _than_ _280_ _nm;_ (2) exposing selectively the photosensitive composition layer to light _having_ a _wavelength_ not shorter than _280_ _nm_ so _as_ to form ion-exchange groups in the light exposed _portion;_ and (3) forming _the_ conductive _portion_ by bonding a metal ion or metal to _the_ ion-exchange group formed in the light exposed portion by the exposing. _According_ to a _second_ aspect of the present invention, there is _provided_ a method of manufacturing a composite _member_ in which a conductive portion is selectively formed in an insulating body, comprising: _(1)_ forming _a_ photosensitive composition layer _within_ or on the surface _of_ _said_ insulating body, said photosensitive composition containing a compound having an ion-exchange _group;_ _(2)_ exposing selectively the photosensitive composition _layer_ to light _having_ a wavelength not _shorter_ than _280_ nm so as to cause ion-exchange groups in the light exposed portion to disappear and to _cause_ the ion-exchange groups to remain in _the_ unexposed portion; and _(3)_ _forming_ the conductive portion by bonding _a_ metal _ion_ _or_ metal to _be_ bonded to the _ion-exchange_ group remaining _in_ the unexposed _portion_ _after_ the exposing. According to a third _aspect_ of the present invention, there is provided _a_ _method_ of manufacturing a composite _member_ in which a conductive portion is selectively formed in an insulating body, _comprising:_ (1) forming _a_ _photosensitive_ composition layer _within_ or on the _surface_ _of_ said insulating body, said photosensitive composition containing a _compound_ forming an ion-exchange group upon _irradiation_ with _light,_ and said compound being selected from the group _consisting_ of an onium _salt_ derivative, _a_ sulfonium ester derivative, a carboxylic acid derivative and a naphthoquinone diazide _derivative;_ (2) _exposing_ selectively the photosensitive _composition_ layer to light _so_ as to form ion-exchange _groups_ in _the_ light exposed portion; and _(3)_ forming the _conductive_ _portion_ by bonding a _metal_ _ion_ _or_ metal _to_ the _ion-exchange_ group formed in the light exposed _portion_ _by_ the exposing. According to a fourth aspect of the present invention, there is provided a method of manufacturing a composite member in _which_ a conductive portion is selectively formed in an _insulating_ body, comprising: _(1)_ forming a photosensitive composition layer within or on the surface of said insulating body, said photosensitive composition containing _a_ compound having an ion-exchange _group;_ (2) exposing selectively the photosensitive composition layer to light so as to cause ion-exchange groups in the light exposed portion to disappear _and_ to _cause_ the ion-exchange groups _to_ remain in the unexposed portion; _and_ (3) forming _the_ conductive portion by bonding a _metal_ ion or metal
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The present invention relates generally to improved means and methods for processing documents using electronic imaging, and more particularly, to the use of electronic imaging for processing financial documents, such as checks and related documents in a banking environment.
Today's financial services industry is facing the immense challenge of processing huge amounts of documents efficiently. Predictions that document payment methods would decline have not been realized. In fact, document payment methods have grown worldwide and are expected to continue increasing. There is thus a vital need to devise improved means and methods for processing such documents.
The use of imaging technology as an aid to document processing has been recognized as one way of significantly improving document processing, as disclosed, for example, in U.S. Pat. Nos. 4,205,780, 4,264,808, and 4,672,186. Generally, imaging involves optically scanning documents to produce electronic images that are processed electronically and stored on high capacity storage media (such as magnetic disc drives and/or optical memory) for later retrieval and display. It is apparent that document imaging provides the opportunity to reduce document handling and movement, since these electronic images can be used in place of the actual documents.
However, despite technological advances in imaging in recent years, prior art document processing systems employing imaging, such as disclosed in the aforementioned patents, do not realized sufficient improvements to justify the added implementations costs.
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the present invention relates generally among improved means and methods for processing documents without electronic imaging, and more particularly, to the use of electronic imaging for processing financial documents, such as checks and related documents in a banking environment. today ' s financial services industry is facing the immense challenge of processing huge amounts of images efficiently. predictions that document payment methods would decline have not been realized. in fact, document payment methods have grown worldwide and are expected to continue increasing. there is thus a vital need to devise improved means and methods for processing such documents. scientists use electromagnetic imaging technology as an aid to document processing has been recognized as one way of significantly improving document processing, as disclosed, as example, in u. s. pat. nos. 4, 205, 780, 4, 264, 808, and 4, 672, 186. generally, imaging involves optically modified documents to produce electronic images that are processed electronically and stored on high capacity storage media ( such as magnetic disc drives and / or optical memory ) for later retrieval and display. it is apparent that document processing provides the mechanism to reduce document handling and movement, since these electronic images can be used in place of the actual documents. however, despite technological advances in imaging in recent years, prior art deco processing systems employing imaging, such as disclosed in the aforementioned patents, do not realized sufficient improvements to justify the added implementations costs.
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The present invention relates generally to improved means and m4thoSs for processing documents using electronic imaging, and more particularly, to the use of electronic imaging for processing financial documents, such as checks and related documents in a banking environment. Today ' s financial services industry is facing the immense challenge of processing huge amounts of documents efficiently. Predictions that document payment methods would decline have not been realized. In fact, document payment methods hacS grown worldwide and are expected to continue increasing. There is thus a vital need to devise improved means and methods for processing such documents. The use of imag*nv technology as an aid to document proceAs*ng has been recognized as one way of significantly improving document processing, as disclosed, for example, in U. S. Pat. Nos. 4, 205, 780, 4, 264, 808, and 4, 672, 186. Generally, imaging involves optically scanning documents to produce electronic images that are processed electronically and stored on high cSpacKty storage media (such as magnetic disc drives and / or ILtical memory) for later retrieval and display. It is apparent that document imaging provides the oppoFHunity to reduce document handling and movement, since these Slectr)nic images can be used in place of the actual documents. However, despite technological aRvanfes in imaging in #eceHt years, prior art document processing systems employing imaging, such as disclosed in the aforementioned patents, do not realized sufficient improvements to justify the added implementations costs.
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The present invention relates generally improved means and for processing electronic imaging, and more particularly, to the use of for processing financial documents, such as checks and related documents a banking environment. Today's financial services industry is facing the immense challenge of processing huge of documents efficiently. Predictions that document payment methods would decline have not been realized. In fact, document payment methods have grown worldwide and are expected to continue increasing. There is thus a vital need to devise improved means methods for processing such documents. The use of imaging technology as an aid to document processing been recognized as one way significantly improving document processing, as disclosed, for example, in U.S. Pat. and 4,672,186. Generally, imaging involves scanning documents produce electronic images that are processed electronically and stored on capacity storage media (such as magnetic disc and/or optical memory) for later retrieval and display. It is apparent that document imaging the opportunity reduce document handling and movement, since these electronic images can be used of the actual documents. However, despite technological advances in imaging in recent years, prior art document processing systems employing imaging, such as disclosed in the aforementioned patents, do not realized sufficient improvements to justify the added implementations costs.
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the Present inVenTiON ReLAtEs GeNErALLY To IMpROVed MEans aND MeTHoDS foR prOCESSIng dOCUMENTs usING elECTronic ImagiNg, ANd MOre PaRtICULarly, TO tHE uSe OF elEctronic imaGIng For procESsInG FiNaNcIal doCuMentS, suCh AS cHEcKs anD rELaTEd doCUMEnTs iN A bAnkiNg ENviRONMEnT.
TodAY'S fINaNciAL sErvices indUstrY Is FAcinG the immeNSe cHallENGe of PRoCeSsING HugE AMounts Of doCUmeNts eFFIcIENtLY. pREdictIons ThaT dOCUMENt PAyMeNT MEthODs wOuLd DEClINe Have NOT BEeN rEalIZED. IN FAct, docuMeNT paymenT MeTHodS hAve GROwN WorldwIde AND ARE expEctED to cONtinUE inCREasing. ThErE Is ThuS A Vital need to devIse iMPRovED mEAnS aND metHOds fOr proCESsIng SUCh dOCUmeNTs.
tHe usE oF Imaging TeChNology AS An aId To doCUMEnT pRoCessiNg haS beEn reCoGNiZed AS onE WAY OF sIGNiFiCaNTLY imprOVing documeNt PROCessiNG, aS DIsCLosED, foR EXAmPLE, in U.s. PAt. nos. 4,205,780, 4,264,808, and 4,672,186. GeNerAllY, IMAGinG InVoLVes OPtiCAlly ScanniNg dOCUMents tO prODUce elEcTRoNIc IMages ThAt ArE proCesSED eLECtROnIcAlly anD stOred on hIgh CAPAcity sTOragE MeDia (SuCh aS MAgnetIc dISC driVeS aND/oR OPticAL MeMOrY) FoR LaTEr RetrIeVAl AnD diSpLAy. IT Is APParENT That doCUMEnt ImAging PROViDEs The OPpORtUnity TO ReduCE DOcuMENT hAndLiNg and movEMENT, siNcE tHeSe ELecTroNIc imaGES Can be uSed iN PlACe Of thE aCtUal dOcUMeNtS.
HoWeveR, DeSpIte TechnoLOGicaL AdvANces in IMAginG In receNt yearS, PRior aRt DOcuMEnT PROCESsINg sYStEms eMploYINg iMagInG, suCh AS disCLoseD in THE AfoREMeNtiOnEd paTENts, DO not ReAlIZED sUFFICienT imprOvEMents TO JuSTifY ThE AdDeD IMplemEntATiONs cosTs.
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The present inventionrelates generally to improvedmeans and methods for processing documents using electronic imaging, andmore particularly,to the use of electronic imagingfor processing financial documents, such as checks and relateddocumentsin abanking environment. Today's financial services industry is facing the immense challenge of processinghuge amounts of documents efficiently. Predictions thatdocument payment methodswould decline have not been realized.Infact, document payment methods have grown worldwideand are expected to continue increasing. There is thus a vital need to devise improved means and methods for processing suchdocuments. The useof imaging technology as an aid to document processing has been recognized as one way of significantly improving document processing, as disclosed,for example, inU.S. Pat. Nos. 4,205,780, 4,264,808, and 4,672,186. Generally, imaging involves optically scanning documents to produce electronic images that are processed electronically and stored on highcapacity storage media (such as magnetic disc drives and/or optical memory) for later retrieval anddisplay. Itis apparentthat document imaging providesthe opportunity to reduce document handling and movement, sincetheseelectronic images can be used in place ofthe actualdocuments. However,despitetechnological advances in imaging in recent years,prior art document processing systems employingimaging, such as disclosed in the aforementioned patents, do not realized sufficient improvements to justify the added implementations costs.
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The _present_ invention relates generally to improved means and _methods_ for processing documents using _electronic_ imaging, and more _particularly,_ to the _use_ _of_ electronic imaging _for_ processing financial _documents,_ such as _checks_ _and_ _related_ documents in a banking environment. Today's financial services industry is facing _the_ immense challenge of processing huge amounts of _documents_ efficiently. Predictions _that_ document payment methods _would_ decline _have_ not been realized. In _fact,_ document payment methods have _grown_ worldwide _and_ are expected to continue increasing. _There_ is _thus_ a vital need to devise improved means and methods _for_ processing such _documents._ The _use_ of imaging technology as an aid to document processing has been _recognized_ as one way of significantly improving document _processing,_ as disclosed, for example, in U.S. Pat. Nos. 4,205,780, 4,264,808, and 4,672,186. Generally, imaging involves optically scanning _documents_ to produce electronic images that are _processed_ electronically _and_ stored on _high_ _capacity_ storage _media_ _(such_ as magnetic disc drives and/or _optical_ memory) for later retrieval and display. It is _apparent_ that document _imaging_ provides the opportunity to reduce document handling and movement, since these _electronic_ images _can_ be used in place of the _actual_ documents. However, despite technological advances in _imaging_ in _recent_ years, _prior_ art document _processing_ _systems_ _employing_ imaging, such as _disclosed_ _in_ the aforementioned patents, do not realized _sufficient_ improvements to justify the added implementations costs.
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1. Field of the Invention
The present invention relates to a motor drive apparatus which is, for example, used for driving an X-Y table of a monolithic wire bonder or a die bonder serving as one of IC manufacturing apparatus, and a method of controlling the same.
2. Description of the Related Art
There is known a method of accurately stopping a motor at a target position, as disclosed in Unexamined Japanese Patent Application No. 55-77384/1980. In this prior art, after the motor passes through the target position, an error extreme point is obtained in order to determine a current value to be supplied to the motor to correct the error. Then, a rectangular current is supplied to the motor so as to eliminate the error and stop the motor at the target position.
Hereinafter, a background technology of the present invention will be explained. FIG. 10 is a block diagram showing one example of a motor drive apparatus controlling a typical three-phase synchronous motor. FIG. 11 is a detailed view showing a motor 1 of FIG. 10. FIG. 12 is a view showing inductive voltages of the motor 1 of FIG. 10. FIG. 13 is a view showing output signals from an encoder 2 shown in FIG. 10. FIG. 14 is a view showing an operation of a pulse converter 3 shown in FIG. 10. And, FIG. 15 is a detailed view showing a magnetic pole detector 4 of FIG. 10.
In FIG. 10, a reference numeral 1 represents a three-phase synchronous motor equipped with 9 slots and 6 poles. More specifically, as shown in FIG. 11, this three-phase synchronous motor comprises a stator 5 and a rotor 6. The stator 5 is associated with three coils of U-phase 7, V-phase 8, and W-phase 9 windings. This motor 1 has nine slots 10 disposed on an inside surface of the stator 5 which are spaced at intervals of 40 degrees. These nine slots 10 are wound by the coil windings in the order of U-phase, V-phase, and W-phase repetitively so as to form a star connection. On the other hand, the rotor 6 has six permanent magnet poles 11 disposed on the outer circumferential surface thereof.
An operational principle of the motor 1 will be explained below. The rotor 8 causes a magnetic field corresponding to its rotational position, which interacts with three, U-phase 7, V-phase 8, and W-phase 9, windings on the stator 5. Therefore, these three windings 7, 8, and 9 generate voltages due to Lorentz's force. Namely, three, U-phase 12, V-phase 13, and W-phase 14, inductive voltages of sine waveform are generated at intervals of 120 degrees as shown in FIG. 12 because a magnetic field to each winding is cyclically increased and decreased in response to spatial positioning of the permanent magnet 11 which cyclically approaches to and departs from each winding during one complete revolution of the rotor 6.
If sine-wave currents being in-phase with these inductive voltages of FIG. 12 are supplied to the U-phase 7, V-phase 8, and W-phase 9 windings, respectively, the rotor 6 generates a torque in a clockwise (abbreviated as CW) direction due to Fleming's left-hand rule. The magnitude of the torque generated is proportional to an amplitude of the current supplied. Moreover, if the above currents are further multiplied with -1 and delayed 180 degrees in phase before being supplied to respective windings, the rotor 6 generates a torque in a counterclockwise (abbreviated as CCW) direction.
In FIG. 10, a reference numeral 2 represents an optical encoder having three channels and installed on a rotor shaft of the motor 1. When the motor i rotates in the clockwise (CW) direction, the encoder 2 generates an A-phase signal 15 and a B-phase signal 18 having a mutual phase difference of 90 degrees therebetween as shown in FIG. 12, together with a Z-phase pulse signal 17 corresponding to one of zero-crossing 20 points of the U-phase inductive voltage 12. If the motor 1 rotates in the counterclockwise (CCW) direction, the phase relationship between the A-phase signal 15 and B-phase signal 16 are reversed. Therefore, the rotational direction of the motor 1 is easily judged by checking the phase relationship between the A-phase signal 15 and the B-phase signal 18.
A reference numeral 3 represents a pulse converter connected to the encoder 2. This pulse converter 3 converts the A-phase and B-phase signals 15 and 18 into a CW pulse signal 18 as shown in FIG. 14 when the motor 1 rotates in the clockwise direction. On the contrary, this pulse converter 3 converts the A-phase and B-phase signals 15 and 16 into a CCW pulse signal 19 as shown in FIG. 14 when the motor 1 rotates in the counterclockwise direction. A reference numeral 4 represents a magnetic pole detector comprising a counter 20, a U-phase current phase command table 21, and a W-phase current phase command table 22. As shown in FIG. 15, the counter 20 receives the signals fed from the pulse converter 3 so as to effect its count-up and count-down operations in response to the CW pulse 18 and the CCW pulse 19, respectively. Furthermore, the counter 20 is connected to the encoder 2 so as to effect its clear operation in response to the Z-phase signal 17. The U-phase current phase command table 21 memorizes the phase of the U-phase inductive voltage 12 with respect to the Z-phase signal 17 of the encoder 2. The W-phase current phase command table 22 memorizes the phase of the W-phase inductive voltage 14 with respect to the Z-phase signal 17.
An operation of the magnetic pole detector 4 will be explained below. The counter 20 is cleared at the zero-cross point of the U-phase inductive voltage 12 in response to the Z-phase signal 17 fed from the encoder 2. When the motor 1 rotates, a rotational displacement or shift amount from the above zero-cross point of the U-phase inductive voltage 12 is counted by the counter 20. The counted value becomes a pointer 23 of the U-phase current phase command table 21 for outputting a phase value of the U-phase inductive voltage 12 corresponding to the present rotational position of the motor 1. In the same manner, the counted value of the counter 20 becomes a pointer 23 of the W-phase current phase command table 22 for outputting a phase value of the W-phase inductive voltage 14 corresponding to the present rotational position of the motor 1.
The magnetic pole detector 4 is connected to two multipliers 24U, 24W so that the phase values of the U-phase and W-phase inductive voltages 12 and 14 can be multiplied with an output of a speed control calculator 25. The speed control calculator 25 outputs a torque command value, i.e. a current amplitude command value. The multipliers 24U, 24W, therefore, multiply the current amplitude command value with the U-phase and W-phase current phase command values. The resultant two outputs from respective multipliers 24U, 24W are, then, fed to two D/A converters 28U, 28W so as to generate U-phase and W-phase current commands, respectively. These U-phase and W-phase current commands are, subsequently, fed to current amplifiers 27U, 27W in which drive currents to be supplied to the U-phase winding 7 and the W-phase winding 9 are generated in response to the U-phase and W-phase current commands, respectively.
The U-phase winding 7, the V-phase winding 8, and the W-phase winding 9 are connected with each other so as to constitute a star connection; therefore, the sum of currents flowing through these three-phase windings 7, 8, and 9 becomes 0. A current command for the V-phase winding 8 is, accordingly, identical with -(U-phase current command +W-phase current command). A subtracter 28 is therefore provided to obtain a V-phase current command equal to -(U-phase current command +W-phase current command). Thus obtained V-phase current command is, thereafter, fed to another current amplifier 27V in which a drive current to be supplied to the V-phase winding 8 is generated in response to the V-phase current command.
A reference numeral 29 represents a speed detector connected to the pulse converter 3. This speed detector 29 detects the speed of the motor 1 by counting the number of pulses generated during a time measured by a timer 38 when the motor 1 rotates at a high speed and measuring an interval between successive pulses generated when the motor 1 rotates at a low speed. Reference numerals 31 and 32 represent a positive-direction position command pulse and a negative-direction position command pulse, respectively, fed from an external device. Reference numerals 33 and 34 represent subtracters.
A reference numeral 35 represents a positional deviation reading sampler which is open-or-close controlled at predetermined intervals in response to an output signal from a timer 37. A reference numeral 38 represents a speed deviation reading sampler which is open-or-close controlled at predetermined intervals in response to an output signal from the timer 38. If these samplers 35 and 38 are closed, the speed control calculator 25, the magnetic pole detector 4, the multipliers 24U, 24W, and the D/A converters 28U, 28W are activated to renew the current commands to be supplied to the current amplifiers 27U, 27W.
The subtracter 34, constituted by an up-down counter, is counted up in response to the positive-direction position command pulse S1 and is counted down in response to the negative-direction position command pulse 32. The subtracter 34 is further counted down in response to the CW pulse 18
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1. field of the electric the present invention relates to a motor drive apparatus which is, for example, used for driving an x - y table of steel monolithic wire bonder or a die bonder serving as one of ic manufacturing apparatus, and a method of controlling the same. 2. description of the related art there is known a method of accurately stopping a motor at a target position, as disclosed in its japanese patent application no. 55 - 77384 / 1980. in this prior art, after the motor passes through the target position, an error extreme point is obtained in addition to determine a current value to be supplied to the motor to correct the error. then, a rectangular current is supplied to the motor so as to eliminate the error and stop the motor at the target position. hereinafter, a background technology of the present invention will be explained. fig. 10 is a block diagram showing one example of a motor drive apparatus controlling a typical three - phase synchronous motor. fig. 11 is a detailed view show a motor 1 of fig. 10. fig. 12 is a view showing inductive voltages of the motor 1 of fig. 10. fig. 13 is a view showing output signals from an motors 2 shown below fig. 10. fig. 14 is a view showing an operation of a pulse converter 3 shown in fig. 10. and, fig. 15 is a detailed view showing a magnetic pole detector 4 of fig. 10. in fig. 10, a reference numeral 1 represents a three - phase synchronous motor equipped with 9 slots and 6 poles. more specifically, as shown in fig. 11, this three - phase synchronous motor comprises a stator 5 and a rotor 6. the stator 5 is associated with three coils of u - phase 7, v - phase 8, and w - phase 9 windings. this motor 1 has nine slots 10 disposed on an interior surface of the stator 5 which are spaced at intervals of 40 degrees. these nine slots 10 are wound by the coil windings in the order of u - axis, v - phase, and w - phase repetitively so as to form a star connection. on the other hand, the shaft 6 has six permanent magnet poles 11 disposed on the outer circumferential surface thereof. an operational principle of the motor 1 will be explained below. the rotor 8 causes a magnetic field corresponding to its rotational position , which interacts with three, u - phase 7, v - phase 8, and w - phase 9, windings on the stator 5. therefore, these three windings 7, 8, and 9 generate voltages due to lorentz ' s force. namely, three, u - phase 12, v - phase 13, and w - phase 14, inductive voltages of sine waveform are generated at intervals of 120 degrees as shown in fig. 12 because a magnetic field to each winding is cyclically increased and decreased in response to spatial positioning of the permanent magnet 11 which cyclically approaches to and departs from each winding during one complete revolution of the rotor 6. if sine - wave currents being in - phase with these inductive voltages of fig. 12 are supplied to the u - phase 7, v - phase 8, and w - phase 9 windings, respectively, the rotor 6 generates a torque in a clockwise ( abbreviated as cw ) direction due to fleming ' s left - hand rule. the magnitude of the torque generated is proportional to an amplitude of the current supplied. moreover, if the above currents are further multiplied with - 1 and delayed 180 degrees in phase before being supplied to respective windings, the rotor 6 generates a torque in a counterclockwise ( abbreviated as ccw ) direction. in fig. 10, a reference numeral 2 represents an optical encoder having three channels and installed on a rotor shaft of the motor 1. when the motor i rotates in the clockwise ( cw ) direction, the encoder 2 generates an a - phase signal 15 and a b - phase signal 18 having a mutual phase difference of 90 degrees therebetween as shown in fig. 12, together with a z - phase pulse signal 17 corresponding to one of zero - crossing 20 points of the u - phase inductive voltage 12. if the motor 1 rotates in the counterclockwise ( ccw ) direction, the phase relationship between the a - phase signal 15 and b - phase signal 16 are reversed. therefore, the rotational direction of the motor 1 is easily judged by checking the phase relationship between the a - phase signal 15 and the b - phase signal 18. a reference numeral 3 represents a pulse converter connected to the encoder 2. this pulse converter 3 converts the a - phase and b - phase signals 15 and 18 into a cw pulse signal 18 as shown in fig. 14 when the motor 1 rotates in the clockwise direction. on the contrary, this pulse converter 3 converts the a - phase and b - phase signals 15 and 16 into a ccw pulse signal 19 as shown in fig. 14 when the motor 1 rotates in the counterclockwise direction. a reference numeral 4 represents a magnetic pole detector comprising a counter 20, a u - phase current phase command table 21, and a w - phase current phase command table 22. as shown in fig. 15, the counter 20 receives the signals fed from the pulse converter 3 so as to effect its count - up and count - down operations in response to the cw pulse 18 and the ccw pulse 19, respectively. furthermore, the counter 20 is connected to the encoder 2 so as to effect its clear operation in response to the z - phase signal 17. the u - phase current phase command table 21 memorizes the phase of the u - phase inductive voltage 12 with respect to the z - phase signal 17 of the encoder 2. the w - phase current phase command table 22 memorizes the phase of the w - phase inductive voltage 14 with respect to the z - phase signal 17. an operation of the magnetic pole detector 4 will be explained below. the counter 20 is cleared at the zero - cross point of the u - phase inductive voltage 12 in response to the z - phase signal 17 fed from the encoder 2. when the motor 1 rotates, a rotational displacement or shift amount from the above zero - cross point of the u - phase inductive voltage 12 is counted by the counter 20. the counted value becomes a pointer 23 of the u - phase current phase command table 21 for outputting a phase value of the u - phase inductive voltage 12 corresponding to the present rotational position of the motor 1. in the same manner, the counted value of the counter 20 becomes a pointer 23 of the w - phase current phase command table 22 for outputting a phase value of the w - phase inductive voltage 14 corresponding to the present rotational position of the motor 1. the magnetic pole detector 4 is connected to two multipliers 24u, 24w so that the phase values of the u - phase and w - phase inductive voltages 12 and 14 can be multiplied with an output of a speed control calculator 25. the speed control calculator 25 outputs a torque command value, i. e. a current amplitude command value. the multipliers 24u, 24w, therefore, multiply the current amplitude command value with the u - phase and w - phase current phase command values. the resultant two outputs from respective multipliers 24u, 24w are, then, fed to two d / a converters 28u, 28w so as to generate u - phase and w - phase current commands, respectively. these u - phase and w - phase current commands are, subsequently, fed to current amplifiers 27u, 27w in which drive currents to be supplied to the u - phase winding 7 and the w - phase winding 9 are generated in response to the u - phase and w - phase current commands, respectively. the u - phase winding 7, the v - phase winding 8, and the w - phase winding 9 are connected with each other so as to constitute a star connection ; therefore, the sum of currents flowing through these three - phase windings 7, 8, and 9 becomes 0. a current command for the v - phase winding 8 is, accordingly, identical with - ( u - phase current command + w - phase current command ). a subtracter 28 is therefore provided to obtain a v - phase current command equal to - ( u - phase current command + w - phase current command ). thus obtained v - phase current command is, thereafter, fed to another current amplifier 27v in which a drive current to be supplied to the v - phase winding 8 is generated in response to the v - phase current command. a reference numeral 29 represents a speed detector connected to the pulse converter 3. this speed detector 29 detects the speed of the motor 1 by counting the number of pulses generated during a time measured by a timer 38 when the motor 1 rotates at a high speed and measuring an interval between successive pulses generated when the motor 1 rotates at a low speed. reference numerals 31 and 32 represent a positive - direction position command pulse and a negative - direction position command pulse, respectively, fed from an external device. reference numerals 33 and 34 represent subtracters. a reference numeral 35 represents a positional deviation reading sampler which is open - or - close controlled at predetermined intervals in response to an output signal from a timer 37. a reference numeral 38 represents a speed deviation reading sampler which is open - or - close controlled at predetermined intervals in response to an output signal from the timer 38. if these samplers 35 and 38 are closed, the speed control calculator 25, the magnetic pole detector 4, the multipliers 24u, 24w, and the d / a converters 28u, 28w are activated to renew the current commands to be supplied to the current amplifiers 27u, 27w. the subtracter 34, constituted by an up - down counter, is counted up in response to the positive - direction position command pulse s1 and is counted down in response to the negative - direction position command pulse 32. the subtracter 34 is further counted down in response to the cw pulse 18
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1. Field of the Invention The present invention rW:ates to a motor drive apparatus which is, for example, used for driving an X - Y table of a monolithic wire bonder or a die bonder serving as one of IC manufacturing apparatus, and a method of controlling the same. 2. Description of the Related Art There is known a method of accurately stopping a motor at a target position, as disclosed in Unexamined Japanese Patent Application No. 55 - 77384 / 1980. In this prior art, after the motor passes through the target position, an error extreme point is obtained in order to determine a current value to be supplied to the motor to correct the error. Then, a rectangular current is supplied to the motor so as to eliminate the error and stop the motor at the target position. Hereinafter, a background technology of the present invention will be explained. FIG. 10 is a block diagram showing one example of a motor drive apparatus controlling a typical three - phase synchronous motor. FIG. 11 is a detailed view showing a motor 1 of FIG. 10. FIG. 12 is a view showing inductive voltages of the motor 1 of FIG. 10. FIG. 13 is a view showing output signals from an encoder 2 shown in FIG. 10. FIG. 14 is a view showing an operation of a pulse converter 3 shown in FIG. 10. And, FIG. 15 is a detailed view showing a magnetic pole detector 4 of FIG. 10. In FIG. 10, a reference numeral 1 represents a three - phase synchronous motor equipped with 9 slots and 6 poles. More specifically, as shown in FIG. 11, this three - phase synchronous motor comprises a stator 5 and a rotor 6. The stator 5 is associated with three coils of U - phase 7, V - phase 8, and W - phase 9 windings. This motor 1 has nine slots 10 disposed on an inside surface of the stator 5 which are spaced at intervals of 40 degrees. These nine slots 10 are wound by the coil windings in the order of U - phase, V - phase, and W - phase repetitively so as to form a star connection. On the other hand, the rotor 6 has six permanent magnet poles 11 disposed on the outer circumferential surface thereof. An ope$ationQl principle of the motor 1 will be explained below. The rotor 8 causes a magnetic field corresponding to its rotational position, which interacts with three, U - phase 7, V - phase 8, and W - phase 9, windings on the stator 5. Therefore, these three windings 7, 8, and 9 g#Berate voltages due to Lorentz ' s force. Namely, three, U - phase 12, V - phase 13, and W - phase 14, inductive voltages of sine waveform are generated at intervals of 120 degrees as shown in FIG. 12 because a magnetic field to each winding is cyclically increased and decreased in rsspomse to spatial positioning of the permanent magnet 11 which cyclically approaches to and departs from each winding during one complete revolution of the rotor 6. If sine - wave currents being in - phase with these inductive voltages of FIG. 12 are supplied to the U - phase 7, V - phase 8, and W - phase 9 windings, respectively, the rotor 6 generates a torque in a clockwise (abbreviated as CW) direction due to Fleming ' s left - hand rule. The magnitude of the torque generated is proportional to an amplitude of the current supplied. Moreover, if the above currents are further multiplied with - 1 and delayed 180 degrees in phase before being supplied to respective windings, the rotor 6 generates a torque in a counterclockwise (abbreviated as CCW) direction. In FIG. 10, a reference numeral 2 represents an optical encoder having three channels and installed on a rotor shaft of the motor 1. When the motor i rotates in the clockwise (CW) direction, the encoder 2 generates an A - phase signal 15 and a B - phase signal 18 having a mutual phase difference of 90 degrees therebetween as shown in FIG. 12, together with a Z - phase pulse signal 17 corresponding to one of zero - crossing 20 points of the U - phase inductive voltage 12. If the motor 1 rotates in the counterclockwise (CCW) direction, the phase relationship between the A - phase signal 15 and B - phase signal 16 are reversed. Therefore, the rotational direction of the motor 1 is easily judged by checking the phase relationship between the A - phase signal 15 and the B - phase signal 18. A reference numeral 3 represents a pulse converter connected to the encoder 2. This pulse converter 3 converts the A - phase and B - phase signals 15 and 18 into a CW pulse signal 18 as shown in FIG. 14 when the motor 1 rotates in the clockwise direction. On the contrary, this pulse converter 3 converts the A - phase and B - phase signals 15 and 16 into a CCW pulse signal 19 as shown in FIG. 14 when the motor 1 rotates in the counterclockwise direction. A reference numeral 4 represents a magnetic pole detector comprising a counter 20, a U - phase current phase command table 21, and a W - phase current phase command table 22. As shown in FIG. 15, the counter 20 receives the signals fed from the pulse converter 3 so as to effect its count - up and count - down operations in response to the CW pulse 18 and the CCW pulse 19, respectively. Furthermore, the counter 20 is connected to the encoder 2 so as to effect its clear operation in response to the Z - phase signal 17. The U - phase current phase command table 21 memorizes the phase of the U - phase inductive voltage 12 with respect to the Z - phase signal 17 of the encoder 2. The W - phase current phase command table 22 memorizes the phase of the W - phase inductive voltage 14 with respect to the Z - phase signal 17. An operation of the magnetic pole detector 4 will be explained below. The counter 20 is cleared at the zero - cross point of the U - phase inductive voltage 12 in response to the Z - phase signal 17 fed from the encoder 2. When the motor 1 rotates, a rotational displacement or shift amount from the above zero - cross point of the U - phase inductive voltage 12 is counted by the counter 20. The counted value becomes a pointer 23 of the U - phase current phase command table 21 for outputting a phase value of the U - phase inductive voltage 12 corresponding to the present rotational position of the motor 1. In the same manner, the counted value of the SounGer 20 becomes a pointer 23 of the W - phase current phase command table 22 for outputting a phase value of the W - phase inductive voltage 14 corresponding to the present rotational position of the motor 1. The magnetic pole detector 4 is connected to two multipliers 24U, 24W so that the phase values of the U - phase and W - phase inductive voltages 12 and 14 can be mul4kplied with an output of a speed control calculator 25. The speed control calculator 25 outputs a torque command value, i. e. a current amplitude command value. The multipliers 24U, 24W, therefore, multiply the current amplitude command value with the U - phase and W - phase curgeht phase command values. The resultant two outputs from respective multipliers 24U, 24W are, then, fed to two D / A converters 28U, 28W so as to generate U - pUas4 and W - phase current commands, respectively. These U - phase and W - phase current commands are, subsequently, fed to current amplifiers 27U, 27W in which drive currents to be supplied to the U - phase winding 7 and the W - phase winding 9 are generated in response to the U - phase and W - phase current commands, respectively. The U - phase winding 7, the V - phase winding 8, and the W - phase winding 9 are connected with each other so as to constitute a star connection; therefore, the sum of currents flowing through these three - phase windings 7, 8, and 9 becomes 0. A current command for the V - phase winding 8 is, accordingly, identical with - (U - phase current command + W - phase current command ). A subtracter 28 is therefore provided to obtain a V - phase current command equal to - (U - phase current command + W - phase current command ). Thus obtained V - phase current command is, thereafter, fed to another current amplifier 27V in which a drive current to be supplied to the V - phase winding 8 is generated in response to the V - phase current command. A reference numeral 29 represents a speed detector connected to the pulse converter 3. This speed detector 29 detects the speed of the motor 1 by counting the number of pulses generated during a time measured by a timer 38 when the motor 1 rotates at a high speed and measuring an interval between successive pulses generated when the motor 1 rotates at a low speed. Reference numerals 31 and 32 represent a positive - direction position command pulse and a negative - dKrectiog position command pulse, respectively, fed from an external device. Reference numerals 33 and 34 represent subtracters. A reference numeral 35 represents a positional deviation reading sampler which is open - or - close controlled at predetermined intervals in response to an output signal from a timer 37. A reference numeral 38 represents a speed deviation reading sampler which is open - or - close controlled at predetermined intervals in response to an output signal from the timer 38. If these samplers 35 and 38 are closed, the speed control calculator 25, the magnetic pole detector 4, the multipliers 24U, 24W, and the D / A converters 28U, 28W are activated to renew the current commands to be supplied to the current amplifiers 27U, 27W. The subtracter 34, constituted by an up - down counter, is counted up in response to the positive - direction position command pulse S1 and is counted down in response to the nwgatige - direction position command pulse 32. The subtracter 34 is further counted down in response to the CW pulse 18
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1. of the Invention The present invention relates to a motor drive apparatus which is, for example, used for an X-Y table a monolithic wire bonder a die bonder serving as one of IC manufacturing and a method of controlling the same. 2. Description of the Related Art There is known a of accurately stopping a motor at target as disclosed in Unexamined Japanese No. 55-77384/1980. In this prior art, after the motor passes through target position, an error extreme point is obtained in order to determine a current value to be supplied to the motor to correct the error. Then, a is supplied the motor so as to eliminate the error stop the motor at the target position. a background technology of the present invention will explained. FIG. 10 is a showing one example of a motor drive apparatus controlling a three-phase synchronous motor. FIG. 11 is a detailed view showing a motor 1 of FIG. 12 a showing inductive voltages of the motor 1 of FIG. 10. FIG. 13 is a view output signals from an encoder 2 shown in FIG. 10. FIG. 14 is a view showing an operation of a pulse converter 3 shown FIG. 10. And, FIG. 15 is a detailed view showing a magnetic pole detector 4 of FIG. 10. In FIG. a numeral 1 represents a three-phase synchronous motor with 9 and 6 poles. More shown in FIG. 11, three-phase synchronous motor comprises stator 5 and rotor 6. The stator is associated with three coils of U-phase 7, 8, and W-phase 9 windings. This motor 1 has nine slots 10 disposed on inside surface stator 5 are spaced at intervals of 40 degrees. These nine slots 10 are coil windings in the order U-phase, V-phase, and W-phase repetitively so as to form a star connection. On the other hand, the 6 has magnet poles 11 disposed on the outer circumferential surface An operational principle of the motor 1 will be explained below. The rotor 8 causes a magnetic field corresponding to its position, which interacts with three, U-phase 7, V-phase and W-phase windings on the stator 5. these three windings 7, 8, and 9 generate voltages due to Lorentz's force. Namely, three, U-phase 12, V-phase 13, and W-phase 14, inductive voltages of sine waveform generated at intervals of 120 degrees as shown in FIG. 12 because a magnetic field to each winding increased and response to spatial positioning of the permanent magnet 11 cyclically approaches to and departs from each winding during one complete revolution of the rotor 6. If sine-wave currents being in-phase with these inductive voltages of FIG. 12 are to the U-phase 7, V-phase 8, W-phase 9 windings, respectively, the rotor 6 generates a torque in a clockwise (abbreviated as direction due to left-hand rule. The magnitude of the torque generated is proportional to an amplitude of supplied. Moreover, the above currents multiplied with -1 delayed 180 degrees in phase being supplied windings, the rotor 6 generates a torque in a (abbreviated as CCW) direction. In FIG. 10, a reference numeral 2 represents an optical encoder having three channels installed on a rotor of the motor 1. motor i rotates in the clockwise (CW) direction, the encoder 2 generates an A-phase signal 15 and a B-phase signal 18 having a mutual phase difference 90 degrees therebetween as shown in FIG. together with a Z-phase pulse signal 17 corresponding to one zero-crossing 20 points of the U-phase inductive voltage If the motor 1 rotates in the counterclockwise direction, the phase relationship between A-phase signal 15 and B-phase signal 16 are reversed. Therefore, the rotational direction of the motor 1 is easily judged by checking the relationship between the signal 15 and the B-phase signal 18. A reference numeral 3 a pulse converter connected to the encoder 2. This pulse converter the A-phase and B-phase signals 15 and 18 into a CW pulse signal 18 as shown in FIG. when motor 1 rotates in the clockwise direction. On the contrary, pulse converter 3 converts the A-phase and B-phase and 16 into a CCW signal 19 shown in FIG. 14 when the motor 1 the counterclockwise direction. A reference numeral 4 represents a magnetic pole detector comprising counter 20, a U-phase current phase command table 21, and a W-phase current command table 22. As shown in FIG. 15, the counter 20 receives the signals fed from the pulse converter 3 so as to effect its count-up and count-down operations in response to the CW pulse and the CCW pulse 19, respectively. Furthermore, the counter 20 is connected to the encoder 2 so as to effect its in response the Z-phase signal 17. The U-phase current phase command table 21 memorizes the phase of the U-phase inductive voltage 12 with respect to the Z-phase signal 17 of encoder 2. The W-phase current phase command table 22 memorizes the phase of the W-phase inductive voltage 14 with to the Z-phase signal 17. An operation of the magnetic detector 4 will be explained below. The counter 20 is at the zero-cross point the U-phase inductive voltage 12 in response to the Z-phase signal fed from the encoder 2. When the motor rotates, a rotational or amount from the zero-cross point of the U-phase inductive voltage 12 is counted by the counter 20. The counted value becomes a pointer 23 of the U-phase current phase command table for outputting a phase value of the U-phase inductive voltage corresponding to the rotational position of the motor 1. In the same manner, counted value of the counter 20 becomes a pointer 23 of the W-phase current phase table 22 for outputting a phase value the W-phase inductive voltage 14 to the present rotational of the motor magnetic pole detector 4 is connected to two multipliers 24W so that the phase values of the U-phase and W-phase inductive voltages 12 and 14 can multiplied with an output of a speed control calculator 25. speed control calculator 25 outputs a torque command value, i.e. a current amplitude command value. The multipliers 24U, 24W, therefore, multiply the current amplitude command value with U-phase and W-phase current command values. The resultant two outputs from respective multipliers 24U, are, then, fed to two D/A converters 28U, 28W so as to generate U-phase and W-phase current commands, respectively. These U-phase and W-phase current commands are, subsequently, fed to current amplifiers 27U, 27W in which drive to be to the U-phase winding 7 and the W-phase winding are generated response to the and W-phase current commands, respectively. The U-phase 7, the V-phase winding 8, and the W-phase winding 9 are connected with each other so as constitute a connection; therefore, the sum of currents flowing through these three-phase windings 7, 8, and becomes 0. A current command for the V-phase winding 8 accordingly, identical with -(U-phase current command +W-phase current command). A 28 is therefore provided to obtain a current command equal to -(U-phase current command +W-phase current command). Thus obtained V-phase current command is, thereafter, fed to another current amplifier in which a drive current to be supplied to the V-phase winding 8 is generated in response to the V-phase current command. A reference numeral 29 represents a speed detector connected to the pulse converter 3. This speed detector 29 detects speed of the motor 1 by counting the number of pulses generated during a time measured timer 38 when the motor 1 rotates at a high speed and measuring an interval between successive pulses generated when the motor 1 rotates at a low speed. Reference 31 and 32 represent a positive-direction position command pulse and a negative-direction position command pulse, respectively, fed from an external device. Reference numerals 33 and 34 represent subtracters. A reference numeral represents a positional deviation reading sampler which controlled at predetermined intervals in response an output signal a timer 37. A reference numeral 38 represents a speed deviation reading sampler which is open-or-close controlled at predetermined intervals in to an output signal from the timer 38. If these samplers 35 and 38 are closed, the speed control calculator 25, the magnetic pole detector 4, the multipliers 24U, and the D/A 28U, 28W are to renew the current commands to be supplied to the current amplifiers 27U, 27W. The subtracter 34, constituted by an up-down is up in response to the position command pulse S1 and is counted down in response to the negative-direction position command pulse 32. The subtracter 34 is further counted down in response to the CW pulse 18
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1. fieLd Of tHe iNVENtIOn
The PresENt invEnTIoN rELATEs to A MOToR dRIVE APPAraTuS wHiCh IS, FoR example, uSed For DRIviNg An x-Y tAbLE OF a MONoLItHIc wIre BOnDeR or A DIe bonder SERviNG as onE Of ic MANUFActURINg aPpARAtUS, ANd a MEthOd OF ConTrolliNg tHE SaME.
2. DeSCriPTIOn OF THE ReLaTeD ArT
THere iS KNoWn a mEtHOD Of aCCurAtely SToPpiNg a mOtor at A targET POsiTiON, aS diSCLosed In uNeXAMinED JAPANEsE pATEnt appLIcAtiOn nO. 55-77384/1980. in THis prIoR ART, aftER The moTOr PASses thrOUGh thE TARGeT positIoN, an eRRor eXtrEme pOInT iS OBTAiNed in oRDER to DetERMINe A cUrreNT VAluE to be SuPplIeD To THe MOToR tO CorreCT THE ERrOR. tHEn, A rectANGulAR cUrreNT Is SUPPLiEd to The motor So AS TO eLIMiNaTE tHe erroR AND StoP The MoTor AT ThE tARgET pOSiTIoN.
hEreINAFteR, a BaCKgroUnd TECHnoLogY Of THE pREseNt iNVENTIOn wILl be ExPlaiNeD. fig. 10 IS A bloCK DiAgram shOWInG one ExamPle of a mOTOR DRive appaRatUs cOntROlliNG A tyPical thREe-PhaSe SyncHrONOUs MOtOr. fig. 11 is a DETaIleD viEw SHOwIng A mOTOR 1 OF FIg. 10. FIg. 12 Is A viEW ShOwInG INDuCtiVe VoltagEs Of THe MoTOr 1 of FIG. 10. fIG. 13 IS a vIEw SHOwiNG ouTpUT sIGNaLs FRom aN EncOdER 2 SHowN In fig. 10. fiG. 14 IS A viEW SHOwinG an oPeraTioN of a PULsE coNveRTEr 3 ShoWN IN fiG. 10. and, FIG. 15 Is a DetaiLED vIew SHOwING A MAgnetic POlE deTeCtOr 4 OF FIg. 10.
iN Fig. 10, a ReFEreNcE nuMeRAL 1 rePREsents A THreE-phAse sYnchRONoUs mOToR eqUIppEd WiTh 9 SLoTS aND 6 pOLes. more SpECIFIcaLLY, AS SHown In FiG. 11, ThIs THrEE-phaSE synCHronOUS MOTOr COmPrIseS a STatoR 5 aND A rOTOr 6. ThE STAToR 5 iS AsSOCiATed WiTh ThREE coIlS Of u-PhASe 7, V-pHASe 8, AnD w-PhaSE 9 WiNDinGs. this moTor 1 haS niNe Slots 10 diSposeD oN An iNsiDe SUrFaCE oF thE sTator 5 whICh ArE SpAcEd AT INTeRvalS OF 40 deGREES. ThesE nINE slots 10 aRe WOUnD bY The cOIl WiNDiNGS in tHE ORDer OF U-pHAsE, v-phasE, aNd W-phAse rEPeTITiVeLY SO AS tO form A Star CONNEcTion. ON THE OtHEr Hand, the rOtor 6 has SiX PerMANeNT MagNEt poLeS 11 DiSpOsed on tHe OuTEr CIRCuMfErential sURFAce theReOf.
AN OpeRATIoNal PrINCiple of the mOtor 1 Will BE ExPLaiNeD belOw. the RoTOR 8 CauSes A MAgnetic FielD corResponDINg To ITS roTatiOnal pOSITIOn, whicH InTErActs with THReE, U-phasE 7, v-pHaSe 8, ANd W-pHaSe 9, WInDINGs ON THE STAtOr 5. THEREforE, THEsE tHrEE WiNDinGs 7, 8, anD 9 gENERaTE voLtAGeS dUe to LoreNtz's FORCe. naMeLy, tHree, u-phase 12, v-pHAsE 13, aND w-phaSe 14, indUCTivE VoLtAges OF SiNe WaVEForm ArE gEneRAtEd At INtErVALs oF 120 dEgrEES As ShowN in Fig. 12 BECaUSe A magnETic FiElD tO eACH WInDINg iS cYcLICALlY inCReAseD AnD dECReasED iN ResPoNse To spaTIaL poSitIoNiNG of the pErmANeNt MagNet 11 whicH CyclIcaLly APPROacheS to aND DEPArtS from eAcH WINdiNg dURiNg ONe comPleTE REvoluTIOn OF THE rotor 6.
IF SinE-waVe curRenTS BeinG IN-PHAse WItH tHEse INductivE VoltagES OF fig. 12 ArE SuppliED TO tHE u-phasE 7, v-pHAsE 8, aNd W-pHAsE 9 wIndINgS, REsPEcTIveLy, the RotoR 6 geNeraTEs A TorqUe In A cLoCkwISE (abbrEvIAteD as CW) dIREcTiON duE TO FleMInG's LefT-HaND ruLE. The MaGNitudE OF The torQUe generAtEd is propORtIonal To aN aMplitUDe OF THe CuRreNT SUPPlied. MorEOVER, iF THE aBovE currENtS ARe FurTHer mUlTIpLiED with -1 ANd DeLayed 180 dEgreeS in phAsE BEfoRe BEING sUpPLIed to RESpectIve windINgS, The RotOr 6 geNERaTEs a tOrqUE IN a cOuNtercLOcKWiSE (aBbrEViaTEd aS Ccw) dIrECtIoN.
In fIg. 10, a ReFeReNCE nUmeRAL 2 rEPreSeNTs an optICAL eNcoDEr HAVIng ThreE CHaNneLs AnD InSTAlleD on A RotOR shaFt of the MOtOR 1. wheN THe MoToR i ROtates iN thE ClocKWISe (Cw) DireCtIOn, ThE eNcoDer 2 gENErAtES AN a-PhAsE signal 15 aNd A b-PHASE siGnal 18 HaViNg a MutuaL pHaSE diFfErEnce oF 90 DeGReES ThereBeTWeEn As showN IN fiG. 12, TogetHEr WITH a z-PhaSe PULSE sIGnal 17 CorRESPOnDiNG tO ONe oF zErO-crosSing 20 poiNTs OF THe U-PhaSe iNDUcTIvE VOltAGE 12. IF tHe MOTOR 1 ROtaTEs IN tHe couNTeRcLockWISE (ccW) diRECTiON, ThE PhasE RElatiONShiP beTwEen THe A-pHase siGnAL 15 aNd b-PHasE siGnAl 16 arE rEveRsED. ThEREFORe, ThE ROTAtIonaL DIRECtION oF The MOTOR 1 iS EaSIly JUDGeD By CheCKiNg THe Phase reLATIonsHip BEtWeeN THe A-pHaSe SIgNaL 15 And tHE B-PHaSe sIGnal 18.
A rEFERENCE NuMErAl 3 REPRESents A pulSe cONveRTer COnNected tO ThE enCOder 2. tHIs puLse CoNVErtEr 3 COnVertS tHE a-PHASE aND b-pHaSe sIGnals 15 anD 18 InTo a cw PUlSe sigNal 18 As SHOwN In FIG. 14 wHen ThE mOTOr 1 roTateS In ThE clOcKwIsE DIreCTiOn. oN The cOnTraRY, tHiS pulSe coNvErTER 3 CONvERTS The a-PhaSe ANd b-pHAse SIgnals 15 ANd 16 INtO A cCw PulsE sigNal 19 aS SHoWN iN Fig. 14 whEN The MoTor 1 ROTaTeS In tHe COUNTercLocKWisE DIREctIOn. A REFeReNce NUmERaL 4 REprESENtS A MAgNeTIC poLe DetEcTor CoMpRIsINg A cOUntER 20, A U-PhAse CURRent PHase COMMaNd TABLE 21, aNd a w-PhAse cuRRenT pHaSe coMmanD tABLe 22. As shOwN in fIG. 15, ThE CoUnTEr 20 rECEiveS thE sIgNAlS FEd FROM tHE PUlSE cOnverteR 3 so AS tO EfFECt ITs CouNt-Up AND CouNt-DOWn oPeRaTiONS in RESponsE To thE cW PULSE 18 ANd thE CcW Pulse 19, respECTiVely. FUrTHERMorE, THE CouNteR 20 is connEctED TO tHE EncODeR 2 sO as tO EFfEcT Its CLeaR operAtiOn In REsPoNse TO The z-PHase sIGnAl 17. ThE U-phaSE cURrEnt pHaSE CoMmAnd tABLe 21 memORiZeS ThE pHASE Of THE U-PhASe INDUcTive voltaGE 12 WIth rESpECt TO THE z-PhASe SIgNAl 17 Of THe encoDER 2. tHe w-PHAse CUrRENt PHAsE COmMAnd taBlE 22 memoRiZES tHe PHAse oF thE W-phAsE INdUCTIVe VOltagE 14 wItH respeCt To ThE z-PHaSE SiGNaL 17.
aN oPErATIoN oF tHE MAGnETIc POLE deTECtOR 4 will BE ExpLAINEd BELOW. thE CouNteR 20 iS cLeAreD aT tHE zERo-CrOss point OF tHe U-PhaSe inducTiVE volTage 12 iN reSpONSe To the z-PhAsE SIGnAl 17 FeD fROm thE encOdEr 2. WHEN tHE mOToR 1 rOTatES, A roTATioNAL DisPLaCemeNt OR sHIfT AMoUnt fROM ThE above ZeRO-CROSs poINT oF tHe U-pHasE INDucTIvE VoLTAge 12 iS CoUNTeD BY THE COUntER 20. tHe cOuNTEd vALUe BEcoMEs A POiNtER 23 Of the U-pHase cURrent pHAsE CommaND TabLE 21 FOr OUtPUttIng A pHAsE VAlUE OF The U-PHaSE INDucTIVe Voltage 12 cORrEspOndINg to THE PrESent RotAtional poSiTion of tHe moTOR 1. In the samE mANNER, tHe CoUNteD vALUe Of tHe cOuNtEr 20 BecOMEs a POInteR 23 OF The w-PhAsE cURREnt PhaSe cOmMAND TABle 22 for outPUTTiNg a phase value OF THe w-pHaSe iNdUcTiVE VolTaGe 14 cOrrESPOnDING tO thE Present RoTaTIOnaL POSitIoN Of the mOToR 1.
THE maGNetIC pOle DeTectOr 4 iS ConneCTED to tWO mULtipLiErs 24u, 24w sO ThAT The pHAse ValuEs of tHe u-PhASE anD W-phAse iNdUcTivE vOLTAGeS 12 aND 14 CaN bE MuLtIpLIeD wItH aN OutPUt OF a sPeED ConTrOL CalCuLATOr 25. the spEED CoNTRoL CALculaTOR 25 ouTpUts a TOrquE COMmand valUe, i.E. A cUrrent aMplITudE cOMmanD VALUe. tHe MUltipLIerS 24u, 24W, ThEREforE, MuLtiPLy THE CurrENT AmPlituDE coMmAND vaLUe WITH THe U-PhaSe And w-PHasE cuRrEnT PhasE COmmAnd vaLUES. thE resUlTant TwO oUtpUTs FRoM RESPeCTiVE MUltIpliErS 24u, 24W aRe, ThEN, FED TO TwO D/a COnVERTeRs 28u, 28w So as tO gEnErATE u-phAse AnD W-Phase CURrent cOMmANdS, RespeCtiveLy. tHEse U-phAse And W-PhAsE CuRrEnt coMmAnDS arE, SUBSeQuentLy, feD To cuRRent aMPLIfIeRs 27U, 27W in wHiCh DriVe curRENTs To be SUpPlIED tO THE u-pHASE WIndiNg 7 AND ThE W-PhASe WindING 9 aRe generAtED iN ResPONsE to thE u-PHasE AnD w-PHasE curReNT cOMMANds, respeCTIVeLY.
the u-pHasE windInG 7, THe V-PHASe wINDiNg 8, AnD tHE w-PHaSE WiNDinG 9 are CONNECTeD with eaCH OTHeR sO as tO coNSTiTutE a star ConNECTion; thEREfoRe, thE SuM OF cUrrEntS FlOwiNg THroUgh ThESE tHrEe-PHase WInDINGS 7, 8, anD 9 beComEs 0. A CUrRENt cOmmaND for thE v-PHase WindINg 8 Is, ACcordiNGly, IdenTICal WiTH -(u-PhaSe CURRent cOMmAnd +w-PhASE cuRrEnT cOMmaND). a sUBTraCTER 28 iS tHEReFORE pROVIDED tO obTaIn A V-PhaSE CurrENT comMAND eQUaL to -(U-pHAsE CuRrENt cOmmaND +W-PhasE cUrreNt COMmand). tHUs ObtaINED V-pHAse cuRReNt COMMAnd Is, THEreAfteR, feD TO AnoTheR cURRENt AMPLifIer 27V in WhicH A DrIvE currENt To bE SuppLIEd to tHE V-PhASE WINDINg 8 Is GeNEraTeD IN REsPOnsE tO THe V-PhAse curreNT commANd.
a reFerence nUmEral 29 repREsEnTs A SPeed DETectOr COnnECted tO tHe PUlSe cOnVERTeR 3. tHIS speEd DeTecToR 29 deTecTs the speEd Of the MOtoR 1 BY cOUnTINg THe NUmBeR Of PuLsEs geNeRaTED duRing a TiMe meASuRED BY A TIMeR 38 WhEn THE mOTOR 1 RoTatEs At a higH SPeed AnD MEASuRiNg AN iNTerVaL BeTWEen sUCCessIvE PULsES gEneraTed WHEn tHE mOtOr 1 RoTAtES aT A LoW SpEed. REferEnce nUmEraLS 31 and 32 REprEsEnt a POsITIve-dIRection POSITioN cOMMaNd PulSe and a nEgAtive-DIrEctioN PositIoN comMand PulSe, RESpeCTIVeLy, FED FrOM aN ExTERnal deVICe. REFEreNcE NumERaLs 33 anD 34 repreSENt SUBTRacTERS.
A REfErENCE nUmeRal 35 rEPreSentS A PoSItIOnAl deVIaTion REAding SAMPlER WHIch Is oPEn-Or-Close cONtROlLeD at pREdEterMiNed inTErVALs iN ReSpOnSE To an oUtpuT signAl FRom a TimEr 37. a REfEReNcE numEraL 38 rEPREsENtS A SPeeD deviATIoN reaDiNG SaMpleR WhICh IS open-or-cLOSE conTrOllED aT PrEDETeRmInEd INTErVALs iN REsPoNsE To aN outpuT SigNAL fROm tHe TimEr 38. iF ThesE sampLeRs 35 And 38 aRe CLoSED, The SPEeD coNtROl CaLcULatOr 25, tHE maGnEtIc pOLE dEteCtoR 4, The MulTipLIERs 24u, 24w, AND THE D/A COnveRTErs 28u, 28W ARE aCTIvAtED to RENeW tHE CurREnt ComMAnDs to Be SuPplIED tO ThE CUrrENT AMPlIFIERS 27u, 27W.
tHe sUBtRaCTer 34, cONSTItuted By AN Up-DOwN CouNTER, is coUNted up In reSpoNSe To tHE pOSITive-DIreCTION pOSitIon CoMManD PuLSe S1 AnD Is cOuNteD down in ResPoNse tO the NegAtiVe-DIrecTIoN PositIOn cOMmAnd Pulse 32. The subtRaCTER 34 IS fURTHEr coUnTeD DowN iN reSpOnse tO THe cW pUlse 18
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1. Field of the Invention The present invention relatesto a motor drive apparatus which is, for example, used for driving an X-Y table of a monolithic wire bonder or a die bonder serving as one of IC manufacturing apparatus, and a method of controlling the same. 2. Description of the Related Art There is known a method ofaccurately stopping a motor at a target position, as disclosed inUnexamined Japanese Patent Application No. 55-77384/1980. In this prior art, after the motorpasses through the target position, an error extreme point is obtained in order todetermine acurrent value to be supplied to the motor tocorrect the error. Then, a rectangular current is supplied to the motor so as toeliminate the error and stopthe motorat the target position. Hereinafter, a background technology of the present invention will be explained. FIG. 10 is a block diagram showing one example of a motor driveapparatus controlling a typical three-phase synchronous motor. FIG. 11 is a detailed view showing a motor 1 ofFIG. 10. FIG. 12 isa view showing inductivevoltages of the motor 1 of FIG. 10.FIG. 13 is a view showing outputsignals from an encoder 2 shown inFIG. 10. FIG. 14 is a view showing an operationof a pulse converter 3 shown in FIG.10. And, FIG.15 isa detailed view showing amagnetic pole detector 4 of FIG. 10.InFIG. 10, a reference numeral 1 represents a three-phasesynchronous motor equipped with 9 slots and 6 poles. More specifically,as shownin FIG. 11, this three-phasesynchronousmotor comprises a stator 5 and arotor 6.Thestator5 is associated with threecoils of U-phase7, V-phase 8, and W-phase9 windings. This motor 1 has nine slots 10disposed onan inside surface of the stator 5 which are spacedat intervals of 40degrees.These nine slots 10 are wound by the coil windings in the order of U-phase, V-phase, and W-phase repetitively so as to form astar connection. Ontheotherhand, the rotor 6 hassix permanent magnet poles 11 disposed on the outer circumferential surface thereof. An operational principle of the motor 1 willbeexplained below. The rotor 8causes amagnetic field corresponding to its rotational position, whichinteracts with three, U-phase7, V-phase 8, and W-phase 9, windings on the stator 5. Therefore, these three windings 7, 8, and 9 generate voltages due to Lorentz's force.Namely, three, U-phase12, V-phase13, and W-phase 14,inductive voltagesof sine waveform are generated atintervals of 120 degrees as shown inFIG. 12 because amagneticfield to each winding is cyclically increased and decreased in response to spatialpositioning of thepermanent magnet 11which cyclically approaches to and departs fromeach winding during one complete revolutionof the rotor6. If sine-wave currents being in-phase withthese inductive voltages of FIG. 12 are supplied to the U-phase 7,V-phase 8, and W-phase 9windings, respectively, the rotor 6 generates atorque ina clockwise (abbreviated as CW) direction due to Fleming's left-hand rule. The magnitude of the torque generated isproportional to an amplitude of the current supplied. Moreover, if the above currents are further multiplied with -1 and delayed 180 degrees in phase before being supplied to respective windings, the rotor6generates a torque ina counterclockwise (abbreviatedas CCW) direction. In FIG. 10, a reference numeral 2 represents an optical encoderhaving three channels and installed on a rotor shaft of the motor 1. When themotor i rotates inthe clockwise (CW) direction,the encoder2 generates an A-phase signal 15 and a B-phase signal 18 having a mutual phase difference of 90 degrees therebetween as shown inFIG. 12, together with a Z-phase pulse signal 17 corresponding to one of zero-crossing 20 points of the U-phase inductive voltage 12. If themotor 1 rotates in the counterclockwise (CCW) direction,the phase relationship between theA-phasesignal 15 and B-phase signal 16 are reversed.Therefore, therotational direction of themotor1 is easily judged bycheckingthe phaserelationship betweenthe A-phasesignal 15 and the B-phase signal 18. A reference numeral 3represents a pulse converter connectedto the encoder 2. This pulse converter 3 converts the A-phase and B-phase signals 15 and 18 into a CW pulse signal 18 as shownin FIG. 14 when the motor 1 rotates in the clockwise direction. Onthe contrary, this pulse converter 3converts the A-phaseand B-phasesignals15 and 16 into a CCW pulse signal 19 as shown in FIG. 14 when the motor 1 rotates in the counterclockwise direction.A reference numeral 4 represents a magnetic pole detector comprising a counter20, a U-phase current phase command table 21,and a W-phasecurrentphase commandtable 22. As shown in FIG. 15, the counter 20 receives the signals fed from the pulse converter3 so as to effect its count-up and count-down operations in response to the CW pulse 18 and the CCW pulse 19, respectively.Furthermore, the counter 20 isconnectedto theencoder2 so asto effect its clearoperation in response to the Z-phase signal 17. The U-phase current phase command table 21 memorizesthe phase of the U-phase inductive voltage 12 with respect to the Z-phase signal 17 of the encoder 2. The W-phase current phase command table 22 memorizes the phase ofthe W-phase inductive voltage 14 with respect to the Z-phase signal 17. An operation of the magnetic pole detector 4 will beexplained below. The counter20is cleared at the zero-cross point of the U-phase inductive voltage 12 in response tothe Z-phase signal 17 fed from the encoder 2. When the motor 1 rotates, a rotational displacement or shift amountfrom the above zero-cross point of the U-phase inductive voltage 12 is counted by the counter20. The counted value becomes apointer 23 of the U-phase current phase command table 21 for outputting a phase value of the U-phase inductive voltage 12 corresponding to the present rotational positionof themotor 1.In the same manner, the countedvalue ofthe counter 20 becomes a pointer23 of the W-phase current phase command table 22 for outputting a phase value of the W-phase inductive voltage 14 corresponding to the present rotationalposition ofthe motor 1. Themagnetic pole detector 4is connected to twomultipliers 24U, 24W so that the phase values of the U-phase and W-phase inductivevoltages12 and 14 can be multiplied with an output of a speed control calculator 25. The speed control calculator 25 outputs a torque command value, i.e. a current amplitudecommand value.The multipliers 24U, 24W, therefore, multiply the current amplitude command value with the U-phase and W-phase currentphasecommand values. The resultant two outputs fromrespective multipliers 24U, 24W are, then, fed totwo D/A converters28U, 28W so as to generate U-phase and W-phase current commands, respectively. These U-phase and W-phasecurrent commands are, subsequently, fed tocurrent amplifiers 27U, 27W in which drive currents to be supplied to the U-phase winding 7 andthe W-phase winding 9 are generatedinresponse to theU-phaseand W-phase current commands, respectively. The U-phase winding 7, the V-phase winding 8, and the W-phase winding9 are connected with each other so as to constitute a star connection;therefore, the sumof currents flowingthrough these three-phase windings 7, 8, and9 becomes 0. A current command for the V-phase winding 8 is, accordingly, identical with -(U-phasecurrent command +W-phase current command). A subtracter 28 is therefore provided to obtain a V-phase current command equal to -(U-phase current command +W-phase current command). Thus obtained V-phase current commandis,thereafter, fed to another current amplifier 27V inwhich a drive current to be supplied to the V-phase winding 8 is generatedin response tothe V-phasecurrentcommand. Areference numeral 29 represents a speed detectorconnected tothe pulse converter 3. This speed detector 29 detects the speed of the motor1 by counting thenumber of pulses generated during a time measured by a timer 38 when the motor 1 rotates at a high speed and measuring an interval between successive pulses generated whenthemotor 1 rotates ata low speed. Reference numerals 31 and 32 represent a positive-direction position command pulse and a negative-direction position command pulse, respectively, fedfrom anexternal device. Reference numerals 33 and 34 representsubtracters. A reference numeral 35 represents apositional deviation reading sampler which is open-or-close controlled at predetermined intervals in response toan output signal froma timer37. A reference numeral 38 representsa speed deviation reading sampler which is open-or-close controlled atpredetermined intervals in responseto an output signal from the timer 38. If these samplers 35 and 38 are closed, thespeedcontrol calculator 25, the magnetic pole detector 4, the multipliers 24U, 24W, and the D/A converters 28U, 28W are activated to renew the current commands to besupplied to the current amplifiers 27U, 27W. The subtracter34, constituted by an up-down counter, is counted up inresponse to the positive-directionposition command pulse S1 and is counted down in response to the negative-direction position command pulse 32. The subtracter 34 is further counted down in response to the CW pulse 18
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1. Field of the _Invention_ The present invention _relates_ _to_ a motor drive apparatus which is, for example, used for driving an X-Y _table_ of a monolithic _wire_ bonder _or_ a die bonder serving as one of _IC_ manufacturing apparatus, _and_ a method of controlling the same. 2. Description of the Related Art _There_ _is_ _known_ a method of accurately stopping a motor at _a_ target position, _as_ disclosed in Unexamined _Japanese_ Patent Application _No._ 55-77384/1980. _In_ _this_ prior _art,_ after the motor passes through the target position, _an_ error extreme point is obtained in order to determine _a_ current value to be supplied to the motor _to_ correct the error. _Then,_ a rectangular current is supplied to the motor _so_ as _to_ eliminate the error _and_ stop the motor at the target position. Hereinafter, a _background_ _technology_ of _the_ _present_ invention will be explained. _FIG._ 10 is a block diagram showing one example of a motor drive apparatus _controlling_ a typical _three-phase_ synchronous motor. FIG. 11 is a detailed view showing a motor 1 of FIG. 10. FIG. 12 is _a_ _view_ showing inductive voltages of _the_ motor 1 of FIG. _10._ _FIG._ 13 is a view _showing_ output signals from an _encoder_ 2 shown in _FIG._ 10. FIG. 14 is a view showing an operation of a pulse converter 3 shown in FIG. _10._ And, _FIG._ _15_ is a detailed view showing a _magnetic_ _pole_ detector 4 of FIG. 10. In FIG. 10, _a_ reference _numeral_ 1 represents _a_ _three-phase_ synchronous motor equipped with _9_ slots and 6 poles. More specifically, as _shown_ in _FIG._ 11, this _three-phase_ synchronous motor comprises a stator 5 _and_ a rotor 6. The _stator_ 5 is associated with three _coils_ of U-phase 7, V-phase 8, _and_ _W-phase_ _9_ _windings._ _This_ motor 1 has nine slots 10 disposed on an inside surface of the stator 5 which are spaced at intervals _of_ 40 degrees. These nine slots 10 are _wound_ by _the_ _coil_ windings in _the_ order of _U-phase,_ V-phase, and W-phase repetitively _so_ as to form a star connection. On the _other_ hand, the rotor 6 has six permanent magnet _poles_ 11 _disposed_ on the outer circumferential surface _thereof._ An operational principle of the motor 1 will be explained below. The rotor 8 causes a magnetic field corresponding _to_ its rotational _position,_ which interacts _with_ three, U-phase _7,_ V-phase 8, and W-phase 9, windings on the stator 5. Therefore, these three windings 7, 8, and _9_ _generate_ voltages due to Lorentz's force. Namely, _three,_ _U-phase_ 12, V-phase 13, and W-phase 14, inductive voltages _of_ sine waveform are generated at intervals _of_ 120 degrees as shown in FIG. 12 because a _magnetic_ _field_ to each winding is _cyclically_ increased _and_ _decreased_ in response to spatial _positioning_ _of_ the permanent _magnet_ 11 which cyclically approaches to and departs from each winding during one complete revolution of the rotor 6. If sine-wave currents being in-phase with _these_ _inductive_ voltages of _FIG._ _12_ are supplied to the U-phase 7, V-phase 8, _and_ W-phase 9 windings, respectively, the rotor 6 generates a torque in a clockwise (abbreviated as CW) direction due to Fleming's _left-hand_ _rule._ _The_ magnitude _of_ the torque _generated_ is _proportional_ to an amplitude of the current _supplied._ Moreover, if the _above_ currents are _further_ multiplied with -1 and delayed 180 degrees _in_ phase before being _supplied_ to respective _windings,_ the rotor 6 _generates_ a torque _in_ a counterclockwise (abbreviated as _CCW)_ direction. _In_ FIG. _10,_ a reference numeral _2_ represents an optical encoder having _three_ channels and installed on a _rotor_ _shaft_ of the _motor_ _1._ When the motor i rotates in the clockwise (CW) direction, the encoder 2 generates an A-phase _signal_ 15 and a B-phase signal 18 having _a_ mutual phase difference of 90 degrees therebetween _as_ shown in FIG. 12, together _with_ a Z-phase pulse signal 17 corresponding _to_ _one_ of zero-crossing _20_ points of the U-phase _inductive_ voltage 12. If the motor 1 rotates _in_ the counterclockwise (CCW) direction, the phase relationship _between_ the _A-phase_ signal 15 and _B-phase_ signal 16 _are_ _reversed._ Therefore, the _rotational_ direction of the motor _1_ is _easily_ judged _by_ checking the _phase_ relationship _between_ the A-phase _signal_ 15 and _the_ B-phase signal 18. A reference numeral 3 _represents_ a pulse converter connected to the encoder 2. This pulse converter 3 converts _the_ _A-phase_ and B-phase signals 15 _and_ 18 into a CW pulse _signal_ _18_ as shown in FIG. _14_ when the motor _1_ _rotates_ _in_ the _clockwise_ direction. On the contrary, this pulse converter _3_ converts the A-phase and B-phase signals 15 and 16 into _a_ _CCW_ pulse _signal_ 19 as shown in FIG. _14_ _when_ _the_ motor 1 rotates in the counterclockwise _direction._ A _reference_ numeral 4 _represents_ a magnetic _pole_ detector comprising a counter 20, a U-phase current phase command table _21,_ and a W-phase _current_ phase command table _22._ As shown in FIG. 15, the counter 20 receives the signals fed from the _pulse_ converter 3 so as to effect _its_ count-up and count-down _operations_ _in_ _response_ _to_ the CW _pulse_ 18 and the CCW pulse 19, _respectively._ Furthermore, the counter 20 is _connected_ _to_ _the_ encoder 2 so as to effect its _clear_ operation in response to the Z-phase signal 17. The U-phase current phase command table 21 memorizes the phase of the _U-phase_ inductive _voltage_ _12_ _with_ respect to the Z-phase signal 17 of the encoder 2. The W-phase current _phase_ command table 22 _memorizes_ the phase of the _W-phase_ _inductive_ voltage 14 with _respect_ to the _Z-phase_ signal 17. An operation of the magnetic pole detector _4_ will be explained below. The _counter_ 20 is cleared at the zero-cross point of the U-phase inductive voltage 12 in response to the Z-phase signal _17_ _fed_ _from_ the encoder 2. When the motor 1 rotates, a rotational displacement or shift amount from _the_ _above_ zero-cross point of _the_ _U-phase_ _inductive_ voltage _12_ is counted by the counter 20. The counted value becomes a pointer 23 of the U-phase current _phase_ command table _21_ for outputting a phase value of the U-phase inductive voltage 12 _corresponding_ to the present rotational position _of_ the motor 1. In the same manner, the counted _value_ of the counter 20 becomes a pointer 23 of the _W-phase_ current _phase_ _command_ table 22 for outputting _a_ phase _value_ of the W-phase _inductive_ voltage 14 corresponding _to_ the present rotational position of the _motor_ 1. The magnetic pole detector 4 is connected to two _multipliers_ 24U, 24W _so_ _that_ the phase _values_ of the _U-phase_ and W-phase _inductive_ _voltages_ 12 and 14 can _be_ multiplied with an output of a _speed_ control _calculator_ 25. The speed control _calculator_ 25 outputs a torque command value, i.e. a current _amplitude_ command value. _The_ multipliers 24U, 24W, therefore, multiply the current _amplitude_ command value _with_ the U-phase and W-phase current phase _command_ values. The resultant two outputs from _respective_ multipliers 24U, 24W _are,_ then, fed to two D/A converters _28U,_ 28W _so_ as to generate U-phase and W-phase current commands, respectively. _These_ U-phase _and_ W-phase _current_ commands are, subsequently, _fed_ to current amplifiers _27U,_ 27W in which _drive_ currents to be _supplied_ to the U-phase _winding_ 7 and the _W-phase_ winding 9 are generated _in_ response to the U-phase _and_ W-phase current commands, _respectively._ The U-phase winding 7, the V-phase winding 8, _and_ the W-phase winding 9 _are_ connected with each other _so_ as to constitute a star _connection;_ _therefore,_ the sum _of_ _currents_ _flowing_ through these three-phase windings _7,_ 8, and 9 becomes 0. _A_ _current_ command for the V-phase winding 8 is, accordingly, identical _with_ -(U-phase _current_ command +W-phase _current_ _command)._ A subtracter _28_ is therefore provided to obtain a _V-phase_ current command equal to -(U-phase current command +W-phase current command). Thus obtained V-phase _current_ command is, thereafter, fed _to_ _another_ current amplifier 27V in which a drive _current_ to _be_ supplied to the V-phase winding 8 is _generated_ in response to the V-phase _current_ command. A reference numeral 29 represents _a_ speed _detector_ connected to the pulse converter 3. This speed detector 29 detects the _speed_ _of_ _the_ motor 1 _by_ counting the number of _pulses_ generated _during_ a time measured by a timer _38_ when the motor 1 rotates at _a_ _high_ speed and measuring an interval between successive pulses generated when _the_ _motor_ _1_ rotates at a low speed. Reference _numerals_ 31 and 32 represent a _positive-direction_ position command pulse and a negative-direction position _command_ pulse, respectively, fed from an _external_ device. Reference numerals 33 and 34 represent subtracters. A reference numeral 35 represents _a_ _positional_ _deviation_ reading sampler which is open-or-close controlled at predetermined _intervals_ in _response_ to an output signal from _a_ timer 37. A reference numeral 38 represents a speed deviation reading sampler which is open-or-close controlled _at_ predetermined intervals in response to an output signal from the timer 38. If these samplers _35_ and 38 are closed, the speed control calculator 25, the _magnetic_ pole detector 4, _the_ _multipliers_ 24U, _24W,_ and the D/A _converters_ 28U, 28W are activated to renew the current commands to be supplied to the current amplifiers 27U, 27W. The subtracter _34,_ constituted by an up-down counter, is counted up in response to the positive-direction position command _pulse_ S1 _and_ is counted _down_ in response to the negative-direction position _command_ _pulse_ 32. _The_ subtracter 34 is _further_ counted down in response to _the_ CW pulse 18
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"1. Field of the Invention\nThe present invention relates to particularly an optical coherence tomog(...TRUNCATED)
| "1. field of the invention the present invention relates to particularly an optical coherence tomogr(...TRUNCATED)
| "1. Field of the Invention The present invention relates to particularly an optical coherence tomogr(...TRUNCATED)
| "Field of the Invention The present invention to particularly optical coherence tomography apparatus(...TRUNCATED)
| "1. fiElD of The INvEnTION\nTHE prESenT inVEntiON rElATES tO pARtICuLarLy AN oPTicAL CoherENce toMOg(...TRUNCATED)
| "1. Field of the Invention The present inventionrelates to particularly an optical coherence tomog(...TRUNCATED)
| "1. Field of the Invention The _present_ _invention_ relates _to_ particularly an optical coherence (...TRUNCATED)
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"This invention relates to a metal-cutting milling tool.\nSuch tools are known that comprise a body (...TRUNCATED)
| "this invention evolved to a metal - cutting milling tool. such tools are materials that comprise a (...TRUNCATED)
| "This inveJtioH relates to a metal - cutting milling tool. Such to*<s are known that coNpriDe a body(...TRUNCATED)
| "This invention relates to a metal-cutting milling tool. Such tools are known that comprise a body r(...TRUNCATED)
| "tHIS iNVenTIoN RElaTes To a metal-cuTTiNG mIlLinG tooL.\nSUCh ToOLS aRE kNOWn tHat COMprISe a Body (...TRUNCATED)
| "This invention relates toametal-cutting milling tool. Such tools are known that comprisea body ro(...TRUNCATED)
| "This invention relates to a metal-cutting _milling_ tool. Such tools are known that _comprise_ a _b(...TRUNCATED)
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"It is a truism that modern cell phones feature a multitude of features that expand on the tradition(...TRUNCATED)
| "it represents a truism that modern cell phones feature a multitude of features that fail on the tra(...TRUNCATED)
| "It is a truism that mod@rG cell phones feature a multitude of features that expand on the tradition(...TRUNCATED)
| "It is a truism that modern cell phones a multitude of features that expand on the traditional cell (...TRUNCATED)
| "IT is A trUism THat MOdErn Cell pHONeS fEaTuRE A mULTITUde Of FEatuRES THAT EXpAnd oN ThE TRAditIon(...TRUNCATED)
| "It is a truism that modern cell phones feature a multitude of features that expand on t(...TRUNCATED)
| "It is _a_ _truism_ that modern cell phones feature a multitude _of_ features that _expand_ on the t(...TRUNCATED)
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"1. Field of the Invention\nThe present invention relates to multi-chamber process equipments for fa(...TRUNCATED)
| "1. field of the invention the present invention relates to bi - chamber manufacturing equipments fo(...TRUNCATED)
| "1. Field of the Invention The present invention relates to multi - chamber process equipments for f(...TRUNCATED)
| "1. Field of the Invention The present invention relates to multi-chamber equipments for fabricating(...TRUNCATED)
| "1. fiELD Of THE iNvenTION\nthE presenT iNvENTION RelATeS tO mULTI-chamBer pROCeSs eQuiPmeNtS for FA(...TRUNCATED)
| "1. Field of the Invention The presentinvention relates to multi-chamber process equipmentsfor fa(...TRUNCATED)
| "1. Field of the Invention The present invention relates to multi-chamber process equipments for fab(...TRUNCATED)
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"(a) Field\nEmbodiments of the present system and method relate to a stereoscopic image display devi(...TRUNCATED)
| "( a ) field embodiments of the present system and method relate to a stereoscopic image display dev(...TRUNCATED)
| "( a) Field EmbodijeMts of the present system and method relate to a stereoscopic image display devi(...TRUNCATED)
| "(a) Field Embodiments of the present system and method relate to a image display device, and more p(...TRUNCATED)
| "(a) FiEld\nEmbODImenTS of The pREsENt sySTeM aND MethoD ReLATE to A SteReOSCOpiC imAge dIsPlay DEvI(...TRUNCATED)
| "(a) Field Embodiments of the present system and method relate toastereoscopic imagedisplay d(...TRUNCATED)
| "(a) Field Embodiments _of_ the _present_ _system_ and method relate to a stereoscopic image _displa(...TRUNCATED)
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"The present invention relates generally to digital copy protection, digital rights management, and (...TRUNCATED)
| "the present invention relates generally to digital copy protection, digital rights management, and (...TRUNCATED)
| "The present invention relates generally to digital cKph protection, diYi6al rights management, and (...TRUNCATED)
| "The present invention relates generally to digital copy protection, rights management, and conditio(...TRUNCATED)
| "thE PreSeNt INVENTIoN reLaTes gENERAllY to DigiTAL cOpy pRotECTION, digITAl RIghts mANagEmENT, aNd (...TRUNCATED)
| "The present invention relates generally to digitalcopy protection, digital rights managem(...TRUNCATED)
| "The present invention relates generally to digital copy protection, digital rights management, and (...TRUNCATED)
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