id stringlengths 24 24 | title stringlengths 3 59 | context stringlengths 151 3.71k | question stringlengths 12 217 | answers dict |
|---|---|---|---|---|
572fe9d5a23a5019007fcb2e | Printed_circuit_board | Through-hole manufacture adds to board cost by requiring many holes to be drilled accurately, and limits the available routing area for signal traces on layers immediately below the top layer on multi-layer boards since the holes must pass through all layers to the opposite side. Once surface-mounting came into use, small-sized SMD components were used where possible, with through-hole mounting only of components unsuitably large for surface-mounting due to power requirements or mechanical limitations, or subject to mechanical stress which might damage the PCB. | What components can be surface mounted to save space? | {
"text": [
"small-sized SMD components"
],
"answer_start": [
318
]
} |
572fe9d5a23a5019007fcb2f | Printed_circuit_board | Through-hole manufacture adds to board cost by requiring many holes to be drilled accurately, and limits the available routing area for signal traces on layers immediately below the top layer on multi-layer boards since the holes must pass through all layers to the opposite side. Once surface-mounting came into use, small-sized SMD components were used where possible, with through-hole mounting only of components unsuitably large for surface-mounting due to power requirements or mechanical limitations, or subject to mechanical stress which might damage the PCB. | A component might not be able to be made any smaller because of its mechanical limitations or what other need? | {
"text": [
"power requirements"
],
"answer_start": [
462
]
} |
572ff7d704bcaa1900d76f5b | Printed_circuit_board | Surface-mount technology emerged in the 1960s, gained momentum in the early 1980s and became widely used by the mid-1990s. Components were mechanically redesigned to have small metal tabs or end caps that could be soldered directly onto the PCB surface, instead of wire leads to pass through holes. Components became much smaller and component placement on both sides of the board became more common than with through-hole mounting, allowing much smaller PCB assemblies with much higher circuit densities. Surface mounting lends itself well to a high degree of automation, reducing labor costs and greatly increasing production rates. Components can be supplied mounted on carrier tapes. Surface mount components can be about one-quarter to one-tenth of the size and weight of through-hole components, and passive components much cheaper; prices of semiconductor surface mount devices (SMDs) are determined more by the chip itself than the package, with little price advantage over larger packages. Some wire-ended components, such as 1N4148 small-signal switch diodes, are actually significantly cheaper than SMD equivalents. | When did surface-mount become a commonly used manufacturing process? | {
"text": [
"mid-1990s"
],
"answer_start": [
112
]
} |
572ff7d704bcaa1900d76f5c | Printed_circuit_board | Surface-mount technology emerged in the 1960s, gained momentum in the early 1980s and became widely used by the mid-1990s. Components were mechanically redesigned to have small metal tabs or end caps that could be soldered directly onto the PCB surface, instead of wire leads to pass through holes. Components became much smaller and component placement on both sides of the board became more common than with through-hole mounting, allowing much smaller PCB assemblies with much higher circuit densities. Surface mounting lends itself well to a high degree of automation, reducing labor costs and greatly increasing production rates. Components can be supplied mounted on carrier tapes. Surface mount components can be about one-quarter to one-tenth of the size and weight of through-hole components, and passive components much cheaper; prices of semiconductor surface mount devices (SMDs) are determined more by the chip itself than the package, with little price advantage over larger packages. Some wire-ended components, such as 1N4148 small-signal switch diodes, are actually significantly cheaper than SMD equivalents. | What did the new components with end tabs replace? | {
"text": [
"wire leads"
],
"answer_start": [
265
]
} |
572ff7d704bcaa1900d76f5d | Printed_circuit_board | Surface-mount technology emerged in the 1960s, gained momentum in the early 1980s and became widely used by the mid-1990s. Components were mechanically redesigned to have small metal tabs or end caps that could be soldered directly onto the PCB surface, instead of wire leads to pass through holes. Components became much smaller and component placement on both sides of the board became more common than with through-hole mounting, allowing much smaller PCB assemblies with much higher circuit densities. Surface mounting lends itself well to a high degree of automation, reducing labor costs and greatly increasing production rates. Components can be supplied mounted on carrier tapes. Surface mount components can be about one-quarter to one-tenth of the size and weight of through-hole components, and passive components much cheaper; prices of semiconductor surface mount devices (SMDs) are determined more by the chip itself than the package, with little price advantage over larger packages. Some wire-ended components, such as 1N4148 small-signal switch diodes, are actually significantly cheaper than SMD equivalents. | What improvement is possible with surface-mounting that enables higher production and lower labor costs? | {
"text": [
"automation"
],
"answer_start": [
561
]
} |
572ff7d704bcaa1900d76f5e | Printed_circuit_board | Surface-mount technology emerged in the 1960s, gained momentum in the early 1980s and became widely used by the mid-1990s. Components were mechanically redesigned to have small metal tabs or end caps that could be soldered directly onto the PCB surface, instead of wire leads to pass through holes. Components became much smaller and component placement on both sides of the board became more common than with through-hole mounting, allowing much smaller PCB assemblies with much higher circuit densities. Surface mounting lends itself well to a high degree of automation, reducing labor costs and greatly increasing production rates. Components can be supplied mounted on carrier tapes. Surface mount components can be about one-quarter to one-tenth of the size and weight of through-hole components, and passive components much cheaper; prices of semiconductor surface mount devices (SMDs) are determined more by the chip itself than the package, with little price advantage over larger packages. Some wire-ended components, such as 1N4148 small-signal switch diodes, are actually significantly cheaper than SMD equivalents. | What are SMDs? | {
"text": [
"surface mount devices"
],
"answer_start": [
863
]
} |
572ff7d704bcaa1900d76f5f | Printed_circuit_board | Surface-mount technology emerged in the 1960s, gained momentum in the early 1980s and became widely used by the mid-1990s. Components were mechanically redesigned to have small metal tabs or end caps that could be soldered directly onto the PCB surface, instead of wire leads to pass through holes. Components became much smaller and component placement on both sides of the board became more common than with through-hole mounting, allowing much smaller PCB assemblies with much higher circuit densities. Surface mounting lends itself well to a high degree of automation, reducing labor costs and greatly increasing production rates. Components can be supplied mounted on carrier tapes. Surface mount components can be about one-quarter to one-tenth of the size and weight of through-hole components, and passive components much cheaper; prices of semiconductor surface mount devices (SMDs) are determined more by the chip itself than the package, with little price advantage over larger packages. Some wire-ended components, such as 1N4148 small-signal switch diodes, are actually significantly cheaper than SMD equivalents. | Is it the chip or the package that influences the price of an SMD more? | {
"text": [
"chip"
],
"answer_start": [
919
]
} |
572ff9bf04bcaa1900d76f95 | Printed_circuit_board | Each trace consists of a flat, narrow part of the copper foil that remains after etching. The resistance, determined by width and thickness, of the traces must be sufficiently low for the current the conductor will carry. Power and ground traces may need to be wider than signal traces. In a multi-layer board one entire layer may be mostly solid copper to act as a ground plane for shielding and power return. For microwave circuits, transmission lines can be laid out in the form of stripline and microstrip with carefully controlled dimensions to assure a consistent impedance. In radio-frequency and fast switching circuits the inductance and capacitance of the printed circuit board conductors become significant circuit elements, usually undesired; but they can be used as a deliberate part of the circuit design, obviating the need for additional discrete components. | What process is a trace left over from? | {
"text": [
"etching"
],
"answer_start": [
81
]
} |
572ff9bf04bcaa1900d76f96 | Printed_circuit_board | Each trace consists of a flat, narrow part of the copper foil that remains after etching. The resistance, determined by width and thickness, of the traces must be sufficiently low for the current the conductor will carry. Power and ground traces may need to be wider than signal traces. In a multi-layer board one entire layer may be mostly solid copper to act as a ground plane for shielding and power return. For microwave circuits, transmission lines can be laid out in the form of stripline and microstrip with carefully controlled dimensions to assure a consistent impedance. In radio-frequency and fast switching circuits the inductance and capacitance of the printed circuit board conductors become significant circuit elements, usually undesired; but they can be used as a deliberate part of the circuit design, obviating the need for additional discrete components. | Along with thickness, what determines the resistance of a trace? | {
"text": [
"width"
],
"answer_start": [
120
]
} |
572ff9bf04bcaa1900d76f97 | Printed_circuit_board | Each trace consists of a flat, narrow part of the copper foil that remains after etching. The resistance, determined by width and thickness, of the traces must be sufficiently low for the current the conductor will carry. Power and ground traces may need to be wider than signal traces. In a multi-layer board one entire layer may be mostly solid copper to act as a ground plane for shielding and power return. For microwave circuits, transmission lines can be laid out in the form of stripline and microstrip with carefully controlled dimensions to assure a consistent impedance. In radio-frequency and fast switching circuits the inductance and capacitance of the printed circuit board conductors become significant circuit elements, usually undesired; but they can be used as a deliberate part of the circuit design, obviating the need for additional discrete components. | What type of trace is often narrower than a ground trace? | {
"text": [
"signal"
],
"answer_start": [
272
]
} |
572ff9bf04bcaa1900d76f98 | Printed_circuit_board | Each trace consists of a flat, narrow part of the copper foil that remains after etching. The resistance, determined by width and thickness, of the traces must be sufficiently low for the current the conductor will carry. Power and ground traces may need to be wider than signal traces. In a multi-layer board one entire layer may be mostly solid copper to act as a ground plane for shielding and power return. For microwave circuits, transmission lines can be laid out in the form of stripline and microstrip with carefully controlled dimensions to assure a consistent impedance. In radio-frequency and fast switching circuits the inductance and capacitance of the printed circuit board conductors become significant circuit elements, usually undesired; but they can be used as a deliberate part of the circuit design, obviating the need for additional discrete components. | In a multi-layer board, what metal would a ground plane be mostly made out of? | {
"text": [
"copper"
],
"answer_start": [
347
]
} |
572ff9bf04bcaa1900d76f99 | Printed_circuit_board | Each trace consists of a flat, narrow part of the copper foil that remains after etching. The resistance, determined by width and thickness, of the traces must be sufficiently low for the current the conductor will carry. Power and ground traces may need to be wider than signal traces. In a multi-layer board one entire layer may be mostly solid copper to act as a ground plane for shielding and power return. For microwave circuits, transmission lines can be laid out in the form of stripline and microstrip with carefully controlled dimensions to assure a consistent impedance. In radio-frequency and fast switching circuits the inductance and capacitance of the printed circuit board conductors become significant circuit elements, usually undesired; but they can be used as a deliberate part of the circuit design, obviating the need for additional discrete components. | What type of circuits use a stripline and microstrip format? | {
"text": [
"microwave circuits"
],
"answer_start": [
415
]
} |
572ffb33a23a5019007fcbfb | Printed_circuit_board | The cloth or fiber material used, resin material, and the cloth to resin ratio determine the laminate's type designation (FR-4, CEM-1, G-10, etc.) and therefore the characteristics of the laminate produced. Important characteristics are the level to which the laminate is fire retardant, the dielectric constant (er), the loss factor (tδ), the tensile strength, the shear strength, the glass transition temperature (Tg), and the Z-axis expansion coefficient (how much the thickness changes with temperature). | What element of a laminate is designated by the cloth to resin ratio, among other things? | {
"text": [
"type designation"
],
"answer_start": [
104
]
} |
572ffb33a23a5019007fcbfc | Printed_circuit_board | The cloth or fiber material used, resin material, and the cloth to resin ratio determine the laminate's type designation (FR-4, CEM-1, G-10, etc.) and therefore the characteristics of the laminate produced. Important characteristics are the level to which the laminate is fire retardant, the dielectric constant (er), the loss factor (tδ), the tensile strength, the shear strength, the glass transition temperature (Tg), and the Z-axis expansion coefficient (how much the thickness changes with temperature). | What's the name for the measurement of a laminate's change in thickness as its temperature changes? | {
"text": [
"Z-axis expansion coefficient"
],
"answer_start": [
429
]
} |
572ffb33a23a5019007fcbfd | Printed_circuit_board | The cloth or fiber material used, resin material, and the cloth to resin ratio determine the laminate's type designation (FR-4, CEM-1, G-10, etc.) and therefore the characteristics of the laminate produced. Important characteristics are the level to which the laminate is fire retardant, the dielectric constant (er), the loss factor (tδ), the tensile strength, the shear strength, the glass transition temperature (Tg), and the Z-axis expansion coefficient (how much the thickness changes with temperature). | What's the abbreviation for the glass transition temperature of a laminate? | {
"text": [
"Tg"
],
"answer_start": [
416
]
} |
572fffeb947a6a140053cf38 | Printed_circuit_board | There are quite a few different dielectrics that can be chosen to provide different insulating values depending on the requirements of the circuit. Some of these dielectrics are polytetrafluoroethylene (Teflon), FR-4, FR-1, CEM-1 or CEM-3. Well known pre-preg materials used in the PCB industry are FR-2 (phenolic cotton paper), FR-3 (cotton paper and epoxy), FR-4 (woven glass and epoxy), FR-5 (woven glass and epoxy), FR-6 (matte glass and polyester), G-10 (woven glass and epoxy), CEM-1 (cotton paper and epoxy), CEM-2 (cotton paper and epoxy), CEM-3 (non-woven glass and epoxy), CEM-4 (woven glass and epoxy), CEM-5 (woven glass and polyester). Thermal expansion is an important consideration especially with ball grid array (BGA) and naked die technologies, and glass fiber offers the best dimensional stability. | What's the common name of polytetrafluoroethylene? | {
"text": [
"Teflon"
],
"answer_start": [
203
]
} |
572fffeb947a6a140053cf39 | Printed_circuit_board | There are quite a few different dielectrics that can be chosen to provide different insulating values depending on the requirements of the circuit. Some of these dielectrics are polytetrafluoroethylene (Teflon), FR-4, FR-1, CEM-1 or CEM-3. Well known pre-preg materials used in the PCB industry are FR-2 (phenolic cotton paper), FR-3 (cotton paper and epoxy), FR-4 (woven glass and epoxy), FR-5 (woven glass and epoxy), FR-6 (matte glass and polyester), G-10 (woven glass and epoxy), CEM-1 (cotton paper and epoxy), CEM-2 (cotton paper and epoxy), CEM-3 (non-woven glass and epoxy), CEM-4 (woven glass and epoxy), CEM-5 (woven glass and polyester). Thermal expansion is an important consideration especially with ball grid array (BGA) and naked die technologies, and glass fiber offers the best dimensional stability. | What pre-preg material is designated by "FR-2"? | {
"text": [
"phenolic cotton paper"
],
"answer_start": [
305
]
} |
572fffeb947a6a140053cf3a | Printed_circuit_board | There are quite a few different dielectrics that can be chosen to provide different insulating values depending on the requirements of the circuit. Some of these dielectrics are polytetrafluoroethylene (Teflon), FR-4, FR-1, CEM-1 or CEM-3. Well known pre-preg materials used in the PCB industry are FR-2 (phenolic cotton paper), FR-3 (cotton paper and epoxy), FR-4 (woven glass and epoxy), FR-5 (woven glass and epoxy), FR-6 (matte glass and polyester), G-10 (woven glass and epoxy), CEM-1 (cotton paper and epoxy), CEM-2 (cotton paper and epoxy), CEM-3 (non-woven glass and epoxy), CEM-4 (woven glass and epoxy), CEM-5 (woven glass and polyester). Thermal expansion is an important consideration especially with ball grid array (BGA) and naked die technologies, and glass fiber offers the best dimensional stability. | To what type of packaging is thermal expansion particularly critical? | {
"text": [
"ball grid array"
],
"answer_start": [
713
]
} |
572fffeb947a6a140053cf3b | Printed_circuit_board | There are quite a few different dielectrics that can be chosen to provide different insulating values depending on the requirements of the circuit. Some of these dielectrics are polytetrafluoroethylene (Teflon), FR-4, FR-1, CEM-1 or CEM-3. Well known pre-preg materials used in the PCB industry are FR-2 (phenolic cotton paper), FR-3 (cotton paper and epoxy), FR-4 (woven glass and epoxy), FR-5 (woven glass and epoxy), FR-6 (matte glass and polyester), G-10 (woven glass and epoxy), CEM-1 (cotton paper and epoxy), CEM-2 (cotton paper and epoxy), CEM-3 (non-woven glass and epoxy), CEM-4 (woven glass and epoxy), CEM-5 (woven glass and polyester). Thermal expansion is an important consideration especially with ball grid array (BGA) and naked die technologies, and glass fiber offers the best dimensional stability. | What material delivers optimum dimensional stability? | {
"text": [
"glass fiber"
],
"answer_start": [
767
]
} |
572fffeb947a6a140053cf3c | Printed_circuit_board | There are quite a few different dielectrics that can be chosen to provide different insulating values depending on the requirements of the circuit. Some of these dielectrics are polytetrafluoroethylene (Teflon), FR-4, FR-1, CEM-1 or CEM-3. Well known pre-preg materials used in the PCB industry are FR-2 (phenolic cotton paper), FR-3 (cotton paper and epoxy), FR-4 (woven glass and epoxy), FR-5 (woven glass and epoxy), FR-6 (matte glass and polyester), G-10 (woven glass and epoxy), CEM-1 (cotton paper and epoxy), CEM-2 (cotton paper and epoxy), CEM-3 (non-woven glass and epoxy), CEM-4 (woven glass and epoxy), CEM-5 (woven glass and polyester). Thermal expansion is an important consideration especially with ball grid array (BGA) and naked die technologies, and glass fiber offers the best dimensional stability. | What dielectric is matte glass and polyester? | {
"text": [
"FR-6"
],
"answer_start": [
420
]
} |
57301001947a6a140053d018 | Printed_circuit_board | The reinforcement type defines two major classes of materials - woven and non-woven. Woven reinforcements are cheaper, but the high dielectric constant of glass may not be favorable for many higher-frequency applications. The spatially nonhomogeneous structure also introduces local variations in electrical parameters, due to different resin/glass ratio at different areas of the weave pattern. Nonwoven reinforcements, or materials with low or no reinforcement, are more expensive but more suitable for some RF/analog applications. | Along with the non-woven class, what makes up the reinforcement type materials? | {
"text": [
"woven"
],
"answer_start": [
64
]
} |
57301001947a6a140053d019 | Printed_circuit_board | The reinforcement type defines two major classes of materials - woven and non-woven. Woven reinforcements are cheaper, but the high dielectric constant of glass may not be favorable for many higher-frequency applications. The spatially nonhomogeneous structure also introduces local variations in electrical parameters, due to different resin/glass ratio at different areas of the weave pattern. Nonwoven reinforcements, or materials with low or no reinforcement, are more expensive but more suitable for some RF/analog applications. | Which is the more expensive reinforcement type? | {
"text": [
"non-woven"
],
"answer_start": [
74
]
} |
57301001947a6a140053d01a | Printed_circuit_board | The reinforcement type defines two major classes of materials - woven and non-woven. Woven reinforcements are cheaper, but the high dielectric constant of glass may not be favorable for many higher-frequency applications. The spatially nonhomogeneous structure also introduces local variations in electrical parameters, due to different resin/glass ratio at different areas of the weave pattern. Nonwoven reinforcements, or materials with low or no reinforcement, are more expensive but more suitable for some RF/analog applications. | What type of structure do woven reinforcements have that cause them to have variation in their electrical parameters? | {
"text": [
"spatially nonhomogeneous"
],
"answer_start": [
226
]
} |
57301001947a6a140053d01b | Printed_circuit_board | The reinforcement type defines two major classes of materials - woven and non-woven. Woven reinforcements are cheaper, but the high dielectric constant of glass may not be favorable for many higher-frequency applications. The spatially nonhomogeneous structure also introduces local variations in electrical parameters, due to different resin/glass ratio at different areas of the weave pattern. Nonwoven reinforcements, or materials with low or no reinforcement, are more expensive but more suitable for some RF/analog applications. | Which ratio varies because of the structure of woven reinforcements? | {
"text": [
"resin/glass"
],
"answer_start": [
337
]
} |
57301001947a6a140053d01c | Printed_circuit_board | The reinforcement type defines two major classes of materials - woven and non-woven. Woven reinforcements are cheaper, but the high dielectric constant of glass may not be favorable for many higher-frequency applications. The spatially nonhomogeneous structure also introduces local variations in electrical parameters, due to different resin/glass ratio at different areas of the weave pattern. Nonwoven reinforcements, or materials with low or no reinforcement, are more expensive but more suitable for some RF/analog applications. | For what kind of applications are non-woven reinforcement materials better than woven ones? | {
"text": [
"RF/analog"
],
"answer_start": [
510
]
} |
57301192a23a5019007fcceb | Printed_circuit_board | At the glass transition temperature the resin in the composite softens and significantly increases thermal expansion; exceeding Tg then exerts mechanical overload on the board components - e.g. the joints and the vias. Below Tg the thermal expansion of the resin roughly matches copper and glass, above it gets significantly higher. As the reinforcement and copper confine the board along the plane, virtually all volume expansion projects to the thickness and stresses the plated-through holes. Repeated soldering or other exposition to higher temperatures can cause failure of the plating, especially with thicker boards; thick boards therefore require high Tg matrix. | What's the temperature at which resin softens and expands called? | {
"text": [
"glass transition temperature"
],
"answer_start": [
7
]
} |
57301192a23a5019007fccec | Printed_circuit_board | At the glass transition temperature the resin in the composite softens and significantly increases thermal expansion; exceeding Tg then exerts mechanical overload on the board components - e.g. the joints and the vias. Below Tg the thermal expansion of the resin roughly matches copper and glass, above it gets significantly higher. As the reinforcement and copper confine the board along the plane, virtually all volume expansion projects to the thickness and stresses the plated-through holes. Repeated soldering or other exposition to higher temperatures can cause failure of the plating, especially with thicker boards; thick boards therefore require high Tg matrix. | Along with vias, what makes up the components of a board? | {
"text": [
"joints"
],
"answer_start": [
198
]
} |
57301192a23a5019007fcced | Printed_circuit_board | At the glass transition temperature the resin in the composite softens and significantly increases thermal expansion; exceeding Tg then exerts mechanical overload on the board components - e.g. the joints and the vias. Below Tg the thermal expansion of the resin roughly matches copper and glass, above it gets significantly higher. As the reinforcement and copper confine the board along the plane, virtually all volume expansion projects to the thickness and stresses the plated-through holes. Repeated soldering or other exposition to higher temperatures can cause failure of the plating, especially with thicker boards; thick boards therefore require high Tg matrix. | What will happen to the components when the temperature of resin goes above that of glass transition? | {
"text": [
"mechanical overload"
],
"answer_start": [
143
]
} |
57301192a23a5019007fccee | Printed_circuit_board | At the glass transition temperature the resin in the composite softens and significantly increases thermal expansion; exceeding Tg then exerts mechanical overload on the board components - e.g. the joints and the vias. Below Tg the thermal expansion of the resin roughly matches copper and glass, above it gets significantly higher. As the reinforcement and copper confine the board along the plane, virtually all volume expansion projects to the thickness and stresses the plated-through holes. Repeated soldering or other exposition to higher temperatures can cause failure of the plating, especially with thicker boards; thick boards therefore require high Tg matrix. | When resin stays below Tg, its thermal expansion is similar to that of copper and what other material? | {
"text": [
"glass"
],
"answer_start": [
290
]
} |
57301192a23a5019007fccef | Printed_circuit_board | At the glass transition temperature the resin in the composite softens and significantly increases thermal expansion; exceeding Tg then exerts mechanical overload on the board components - e.g. the joints and the vias. Below Tg the thermal expansion of the resin roughly matches copper and glass, above it gets significantly higher. As the reinforcement and copper confine the board along the plane, virtually all volume expansion projects to the thickness and stresses the plated-through holes. Repeated soldering or other exposition to higher temperatures can cause failure of the plating, especially with thicker boards; thick boards therefore require high Tg matrix. | What do thick boards require to resist plating failure? | {
"text": [
"high Tg matrix"
],
"answer_start": [
655
]
} |
5730132704bcaa1900d7711d | Printed_circuit_board | Moisture absorption occurs when the material is exposed to high humidity or water. Both the resin and the reinforcement may absorb water; water may be also soaked by capillary forces through voids in the materials and along the reinforcement. Epoxies of the FR-4 materials aren't too susceptible, with absorption of only 0.15%. Teflon has very low absorption of 0.01%. Polyimides and cyanate esters, on the other side, suffer from high water absorption. Absorbed water can lead to significant degradation of key parameters; it impairs tracking resistance, breakdown voltage, and dielectric parameters. Relative dielectric constant of water is about 73, compared to about 4 for common circuitboard materials. Absorbed moisture can also vaporize on heating and cause cracking and delamination, the same effect responsible for "popcorning" damage on wet packaging of electronic parts. Careful baking of the substrates may be required. | What will happen to the materials when a board gets wet or is in a humid area? | {
"text": [
"Moisture absorption"
],
"answer_start": [
0
]
} |
5730132704bcaa1900d7711e | Printed_circuit_board | Moisture absorption occurs when the material is exposed to high humidity or water. Both the resin and the reinforcement may absorb water; water may be also soaked by capillary forces through voids in the materials and along the reinforcement. Epoxies of the FR-4 materials aren't too susceptible, with absorption of only 0.15%. Teflon has very low absorption of 0.01%. Polyimides and cyanate esters, on the other side, suffer from high water absorption. Absorbed water can lead to significant degradation of key parameters; it impairs tracking resistance, breakdown voltage, and dielectric parameters. Relative dielectric constant of water is about 73, compared to about 4 for common circuitboard materials. Absorbed moisture can also vaporize on heating and cause cracking and delamination, the same effect responsible for "popcorning" damage on wet packaging of electronic parts. Careful baking of the substrates may be required. | If materials absorb moisture and then are heated enough to vaporize the water, the board might show delamination or what other type of damage? | {
"text": [
"cracking"
],
"answer_start": [
765
]
} |
5730132704bcaa1900d7711f | Printed_circuit_board | Moisture absorption occurs when the material is exposed to high humidity or water. Both the resin and the reinforcement may absorb water; water may be also soaked by capillary forces through voids in the materials and along the reinforcement. Epoxies of the FR-4 materials aren't too susceptible, with absorption of only 0.15%. Teflon has very low absorption of 0.01%. Polyimides and cyanate esters, on the other side, suffer from high water absorption. Absorbed water can lead to significant degradation of key parameters; it impairs tracking resistance, breakdown voltage, and dielectric parameters. Relative dielectric constant of water is about 73, compared to about 4 for common circuitboard materials. Absorbed moisture can also vaporize on heating and cause cracking and delamination, the same effect responsible for "popcorning" damage on wet packaging of electronic parts. Careful baking of the substrates may be required. | What percentage absorption do F-4 epoxies have? | {
"text": [
"0.15%"
],
"answer_start": [
321
]
} |
5730132704bcaa1900d77120 | Printed_circuit_board | Moisture absorption occurs when the material is exposed to high humidity or water. Both the resin and the reinforcement may absorb water; water may be also soaked by capillary forces through voids in the materials and along the reinforcement. Epoxies of the FR-4 materials aren't too susceptible, with absorption of only 0.15%. Teflon has very low absorption of 0.01%. Polyimides and cyanate esters, on the other side, suffer from high water absorption. Absorbed water can lead to significant degradation of key parameters; it impairs tracking resistance, breakdown voltage, and dielectric parameters. Relative dielectric constant of water is about 73, compared to about 4 for common circuitboard materials. Absorbed moisture can also vaporize on heating and cause cracking and delamination, the same effect responsible for "popcorning" damage on wet packaging of electronic parts. Careful baking of the substrates may be required. | What's the approximate relative dielectric constant of most materials in circuit boards? | {
"text": [
"4"
],
"answer_start": [
671
]
} |
5730132704bcaa1900d77121 | Printed_circuit_board | Moisture absorption occurs when the material is exposed to high humidity or water. Both the resin and the reinforcement may absorb water; water may be also soaked by capillary forces through voids in the materials and along the reinforcement. Epoxies of the FR-4 materials aren't too susceptible, with absorption of only 0.15%. Teflon has very low absorption of 0.01%. Polyimides and cyanate esters, on the other side, suffer from high water absorption. Absorbed water can lead to significant degradation of key parameters; it impairs tracking resistance, breakdown voltage, and dielectric parameters. Relative dielectric constant of water is about 73, compared to about 4 for common circuitboard materials. Absorbed moisture can also vaporize on heating and cause cracking and delamination, the same effect responsible for "popcorning" damage on wet packaging of electronic parts. Careful baking of the substrates may be required. | What material has an absorption rate of only 0.01%? | {
"text": [
"Teflon"
],
"answer_start": [
328
]
} |
57301519b2c2fd1400568827 | Printed_circuit_board | The printed circuit board industry defines heavy copper as layers exceeding three ounces of copper, or approximately 0.0042 inches (4.2 mils, 105 μm) thick. PCB designers and fabricators often use heavy copper when design and manufacturing circuit boards in order to increase current-carrying capacity as well as resistance to thermal strains. Heavy copper plated vias transfer heat to external heat sinks. IPC 2152 is a standard for determining current-carrying capacity of printed circuit board traces. | What's the minimum amount of copper a layer in a PCB can have to be considered "heavy copper"? | {
"text": [
"three ounces"
],
"answer_start": [
76
]
} |
57301519b2c2fd1400568828 | Printed_circuit_board | The printed circuit board industry defines heavy copper as layers exceeding three ounces of copper, or approximately 0.0042 inches (4.2 mils, 105 μm) thick. PCB designers and fabricators often use heavy copper when design and manufacturing circuit boards in order to increase current-carrying capacity as well as resistance to thermal strains. Heavy copper plated vias transfer heat to external heat sinks. IPC 2152 is a standard for determining current-carrying capacity of printed circuit board traces. | About how thick would a PCB layer be if it contained three oz. of copper? | {
"text": [
"0.0042 inches"
],
"answer_start": [
117
]
} |
57301519b2c2fd1400568829 | Printed_circuit_board | The printed circuit board industry defines heavy copper as layers exceeding three ounces of copper, or approximately 0.0042 inches (4.2 mils, 105 μm) thick. PCB designers and fabricators often use heavy copper when design and manufacturing circuit boards in order to increase current-carrying capacity as well as resistance to thermal strains. Heavy copper plated vias transfer heat to external heat sinks. IPC 2152 is a standard for determining current-carrying capacity of printed circuit board traces. | What will a circuit board with heavy copper carry very well? | {
"text": [
"current"
],
"answer_start": [
276
]
} |
57301519b2c2fd140056882a | Printed_circuit_board | The printed circuit board industry defines heavy copper as layers exceeding three ounces of copper, or approximately 0.0042 inches (4.2 mils, 105 μm) thick. PCB designers and fabricators often use heavy copper when design and manufacturing circuit boards in order to increase current-carrying capacity as well as resistance to thermal strains. Heavy copper plated vias transfer heat to external heat sinks. IPC 2152 is a standard for determining current-carrying capacity of printed circuit board traces. | What would a PCB designer use heavy copper to make their circuit board resist? | {
"text": [
"thermal strains"
],
"answer_start": [
327
]
} |
57301519b2c2fd140056882b | Printed_circuit_board | The printed circuit board industry defines heavy copper as layers exceeding three ounces of copper, or approximately 0.0042 inches (4.2 mils, 105 μm) thick. PCB designers and fabricators often use heavy copper when design and manufacturing circuit boards in order to increase current-carrying capacity as well as resistance to thermal strains. Heavy copper plated vias transfer heat to external heat sinks. IPC 2152 is a standard for determining current-carrying capacity of printed circuit board traces. | Where does the heat go when it leaves heavy copper-plated vias? | {
"text": [
"external heat sinks"
],
"answer_start": [
386
]
} |
573016ea04bcaa1900d7715f | Printed_circuit_board | Since it was quite easy to stack interconnections (wires) inside the embedding matrix, the approach allowed designers to forget completely about the routing of wires (usually a time-consuming operation of PCB design): Anywhere the designer needs a connection, the machine will draw a wire in straight line from one location/pin to another. This led to very short design times (no complex algorithms to use even for high density designs) as well as reduced crosstalk (which is worse when wires run parallel to each other—which almost never happens in Multiwire), though the cost is too high to compete with cheaper PCB technologies when large quantities are needed. | What arduous aspect of the process can designers skip in Multiwire? | {
"text": [
"routing of wires"
],
"answer_start": [
149
]
} |
573016ea04bcaa1900d77160 | Printed_circuit_board | Since it was quite easy to stack interconnections (wires) inside the embedding matrix, the approach allowed designers to forget completely about the routing of wires (usually a time-consuming operation of PCB design): Anywhere the designer needs a connection, the machine will draw a wire in straight line from one location/pin to another. This led to very short design times (no complex algorithms to use even for high density designs) as well as reduced crosstalk (which is worse when wires run parallel to each other—which almost never happens in Multiwire), though the cost is too high to compete with cheaper PCB technologies when large quantities are needed. | What does the machine create by drawing a straight line between two points on the board? | {
"text": [
"a connection"
],
"answer_start": [
246
]
} |
573016ea04bcaa1900d77161 | Printed_circuit_board | Since it was quite easy to stack interconnections (wires) inside the embedding matrix, the approach allowed designers to forget completely about the routing of wires (usually a time-consuming operation of PCB design): Anywhere the designer needs a connection, the machine will draw a wire in straight line from one location/pin to another. This led to very short design times (no complex algorithms to use even for high density designs) as well as reduced crosstalk (which is worse when wires run parallel to each other—which almost never happens in Multiwire), though the cost is too high to compete with cheaper PCB technologies when large quantities are needed. | Along with quick design times, what problem does Multiwire cut down on? | {
"text": [
"crosstalk"
],
"answer_start": [
456
]
} |
573016ea04bcaa1900d77162 | Printed_circuit_board | Since it was quite easy to stack interconnections (wires) inside the embedding matrix, the approach allowed designers to forget completely about the routing of wires (usually a time-consuming operation of PCB design): Anywhere the designer needs a connection, the machine will draw a wire in straight line from one location/pin to another. This led to very short design times (no complex algorithms to use even for high density designs) as well as reduced crosstalk (which is worse when wires run parallel to each other—which almost never happens in Multiwire), though the cost is too high to compete with cheaper PCB technologies when large quantities are needed. | What makes Multiwire impractical to use when large quantities of a board are needed? | {
"text": [
"cost"
],
"answer_start": [
573
]
} |
573016ea04bcaa1900d77163 | Printed_circuit_board | Since it was quite easy to stack interconnections (wires) inside the embedding matrix, the approach allowed designers to forget completely about the routing of wires (usually a time-consuming operation of PCB design): Anywhere the designer needs a connection, the machine will draw a wire in straight line from one location/pin to another. This led to very short design times (no complex algorithms to use even for high density designs) as well as reduced crosstalk (which is worse when wires run parallel to each other—which almost never happens in Multiwire), though the cost is too high to compete with cheaper PCB technologies when large quantities are needed. | In simple language, what are the interconnections in an embedding matrix? | {
"text": [
"wires"
],
"answer_start": [
51
]
} |
57301cee947a6a140053d11e | Printed_circuit_board | Cordwood construction can save significant space and was often used with wire-ended components in applications where space was at a premium (such as missile guidance and telemetry systems) and in high-speed computers, where short traces were important. In cordwood construction, axial-leaded components were mounted between two parallel planes. The components were either soldered together with jumper wire, or they were connected to other components by thin nickel ribbon welded at right angles onto the component leads. To avoid shorting together different interconnection layers, thin insulating cards were placed between them. Perforations or holes in the cards allowed component leads to project through to the next interconnection layer. One disadvantage of this system was that special nickel-leaded components had to be used to allow the interconnecting welds to be made. Differential thermal expansion of the component could put pressure on the leads of the components and the PCB traces and cause physical damage (as was seen in several modules on the Apollo program). Additionally, components located in the interior are difficult to replace. Some versions of cordwood construction used soldered single-sided PCBs as the interconnection method (as pictured), allowing the use of normal-leaded components. | What type of construction is best for applications that need to portion space carefully? | {
"text": [
"Cordwood"
],
"answer_start": [
0
]
} |
57301cee947a6a140053d11f | Printed_circuit_board | Cordwood construction can save significant space and was often used with wire-ended components in applications where space was at a premium (such as missile guidance and telemetry systems) and in high-speed computers, where short traces were important. In cordwood construction, axial-leaded components were mounted between two parallel planes. The components were either soldered together with jumper wire, or they were connected to other components by thin nickel ribbon welded at right angles onto the component leads. To avoid shorting together different interconnection layers, thin insulating cards were placed between them. Perforations or holes in the cards allowed component leads to project through to the next interconnection layer. One disadvantage of this system was that special nickel-leaded components had to be used to allow the interconnecting welds to be made. Differential thermal expansion of the component could put pressure on the leads of the components and the PCB traces and cause physical damage (as was seen in several modules on the Apollo program). Additionally, components located in the interior are difficult to replace. Some versions of cordwood construction used soldered single-sided PCBs as the interconnection method (as pictured), allowing the use of normal-leaded components. | What gets mounted in the middle of two parallel planes in a cordwood construction? | {
"text": [
"axial-leaded components"
],
"answer_start": [
279
]
} |
57301cee947a6a140053d120 | Printed_circuit_board | Cordwood construction can save significant space and was often used with wire-ended components in applications where space was at a premium (such as missile guidance and telemetry systems) and in high-speed computers, where short traces were important. In cordwood construction, axial-leaded components were mounted between two parallel planes. The components were either soldered together with jumper wire, or they were connected to other components by thin nickel ribbon welded at right angles onto the component leads. To avoid shorting together different interconnection layers, thin insulating cards were placed between them. Perforations or holes in the cards allowed component leads to project through to the next interconnection layer. One disadvantage of this system was that special nickel-leaded components had to be used to allow the interconnecting welds to be made. Differential thermal expansion of the component could put pressure on the leads of the components and the PCB traces and cause physical damage (as was seen in several modules on the Apollo program). Additionally, components located in the interior are difficult to replace. Some versions of cordwood construction used soldered single-sided PCBs as the interconnection method (as pictured), allowing the use of normal-leaded components. | What do insulating cards prevent between interconnection layers? | {
"text": [
"shorting"
],
"answer_start": [
531
]
} |
57301cee947a6a140053d121 | Printed_circuit_board | Cordwood construction can save significant space and was often used with wire-ended components in applications where space was at a premium (such as missile guidance and telemetry systems) and in high-speed computers, where short traces were important. In cordwood construction, axial-leaded components were mounted between two parallel planes. The components were either soldered together with jumper wire, or they were connected to other components by thin nickel ribbon welded at right angles onto the component leads. To avoid shorting together different interconnection layers, thin insulating cards were placed between them. Perforations or holes in the cards allowed component leads to project through to the next interconnection layer. One disadvantage of this system was that special nickel-leaded components had to be used to allow the interconnecting welds to be made. Differential thermal expansion of the component could put pressure on the leads of the components and the PCB traces and cause physical damage (as was seen in several modules on the Apollo program). Additionally, components located in the interior are difficult to replace. Some versions of cordwood construction used soldered single-sided PCBs as the interconnection method (as pictured), allowing the use of normal-leaded components. | What type of component has to be used in cordwood construction to its detriment? | {
"text": [
"nickel-leaded"
],
"answer_start": [
793
]
} |
57301cee947a6a140053d122 | Printed_circuit_board | Cordwood construction can save significant space and was often used with wire-ended components in applications where space was at a premium (such as missile guidance and telemetry systems) and in high-speed computers, where short traces were important. In cordwood construction, axial-leaded components were mounted between two parallel planes. The components were either soldered together with jumper wire, or they were connected to other components by thin nickel ribbon welded at right angles onto the component leads. To avoid shorting together different interconnection layers, thin insulating cards were placed between them. Perforations or holes in the cards allowed component leads to project through to the next interconnection layer. One disadvantage of this system was that special nickel-leaded components had to be used to allow the interconnecting welds to be made. Differential thermal expansion of the component could put pressure on the leads of the components and the PCB traces and cause physical damage (as was seen in several modules on the Apollo program). Additionally, components located in the interior are difficult to replace. Some versions of cordwood construction used soldered single-sided PCBs as the interconnection method (as pictured), allowing the use of normal-leaded components. | What force caused the physical damage to components that affected the Apollo program? | {
"text": [
"Differential thermal expansion"
],
"answer_start": [
880
]
} |
57301ef4a23a5019007fcdcf | Printed_circuit_board | Development of the methods used in modern printed circuit boards started early in the 20th century. In 1903, a German inventor, Albert Hanson, described flat foil conductors laminated to an insulating board, in multiple layers. Thomas Edison experimented with chemical methods of plating conductors onto linen paper in 1904. Arthur Berry in 1913 patented a print-and-etch method in Britain, and in the United States Max Schoop obtained a patent to flame-spray metal onto a board through a patterned mask. Charles Ducas in 1927 patented a method of electroplating circuit patterns. | Who was the German inventor who wrote in 1903 about conductors being laminated in layers to a board? | {
"text": [
"Albert Hanson"
],
"answer_start": [
128
]
} |
57301ef4a23a5019007fcdd0 | Printed_circuit_board | Development of the methods used in modern printed circuit boards started early in the 20th century. In 1903, a German inventor, Albert Hanson, described flat foil conductors laminated to an insulating board, in multiple layers. Thomas Edison experimented with chemical methods of plating conductors onto linen paper in 1904. Arthur Berry in 1913 patented a print-and-etch method in Britain, and in the United States Max Schoop obtained a patent to flame-spray metal onto a board through a patterned mask. Charles Ducas in 1927 patented a method of electroplating circuit patterns. | What material did Thomas Edison experiment with by trying to chemically attach conductors to it? | {
"text": [
"linen paper"
],
"answer_start": [
304
]
} |
57301ef4a23a5019007fcdd1 | Printed_circuit_board | Development of the methods used in modern printed circuit boards started early in the 20th century. In 1903, a German inventor, Albert Hanson, described flat foil conductors laminated to an insulating board, in multiple layers. Thomas Edison experimented with chemical methods of plating conductors onto linen paper in 1904. Arthur Berry in 1913 patented a print-and-etch method in Britain, and in the United States Max Schoop obtained a patent to flame-spray metal onto a board through a patterned mask. Charles Ducas in 1927 patented a method of electroplating circuit patterns. | What year did Arthur Berry patent his print-and-etch method? | {
"text": [
"1913"
],
"answer_start": [
341
]
} |
57301ef4a23a5019007fcdd2 | Printed_circuit_board | Development of the methods used in modern printed circuit boards started early in the 20th century. In 1903, a German inventor, Albert Hanson, described flat foil conductors laminated to an insulating board, in multiple layers. Thomas Edison experimented with chemical methods of plating conductors onto linen paper in 1904. Arthur Berry in 1913 patented a print-and-etch method in Britain, and in the United States Max Schoop obtained a patent to flame-spray metal onto a board through a patterned mask. Charles Ducas in 1927 patented a method of electroplating circuit patterns. | In Max Schoop's method, what was used to create the flame-sprayed pattern on the board? | {
"text": [
"a patterned mask"
],
"answer_start": [
487
]
} |
57301ef4a23a5019007fcdd3 | Printed_circuit_board | Development of the methods used in modern printed circuit boards started early in the 20th century. In 1903, a German inventor, Albert Hanson, described flat foil conductors laminated to an insulating board, in multiple layers. Thomas Edison experimented with chemical methods of plating conductors onto linen paper in 1904. Arthur Berry in 1913 patented a print-and-etch method in Britain, and in the United States Max Schoop obtained a patent to flame-spray metal onto a board through a patterned mask. Charles Ducas in 1927 patented a method of electroplating circuit patterns. | Who obtained a patent in 1927 for his method of electroplating circuit patterns? | {
"text": [
"Charles Ducas"
],
"answer_start": [
505
]
} |
57302051947a6a140053d14c | Printed_circuit_board | The Austrian engineer Paul Eisler invented the printed circuit as part of a radio set while working in England around 1936. Around 1943 the USA began to use the technology on a large scale to make proximity fuses for use in World War II. After the war, in 1948, the USA released the invention for commercial use. Printed circuits did not become commonplace in consumer electronics until the mid-1950s, after the Auto-Sembly process was developed by the United States Army. At around the same time in Britain work along similar lines was carried out by Geoffrey Dummer, then at the RRDE. | What was Paul Eisler making when he came up with the printed circuit? | {
"text": [
"a radio set"
],
"answer_start": [
74
]
} |
57302051947a6a140053d14d | Printed_circuit_board | The Austrian engineer Paul Eisler invented the printed circuit as part of a radio set while working in England around 1936. Around 1943 the USA began to use the technology on a large scale to make proximity fuses for use in World War II. After the war, in 1948, the USA released the invention for commercial use. Printed circuits did not become commonplace in consumer electronics until the mid-1950s, after the Auto-Sembly process was developed by the United States Army. At around the same time in Britain work along similar lines was carried out by Geoffrey Dummer, then at the RRDE. | What event prompted the United States to adopt the printed circuit to make proximity fuses? | {
"text": [
"World War II"
],
"answer_start": [
224
]
} |
57302051947a6a140053d14e | Printed_circuit_board | The Austrian engineer Paul Eisler invented the printed circuit as part of a radio set while working in England around 1936. Around 1943 the USA began to use the technology on a large scale to make proximity fuses for use in World War II. After the war, in 1948, the USA released the invention for commercial use. Printed circuits did not become commonplace in consumer electronics until the mid-1950s, after the Auto-Sembly process was developed by the United States Army. At around the same time in Britain work along similar lines was carried out by Geoffrey Dummer, then at the RRDE. | When was the printed circuit released for commercial use in the U.S.? | {
"text": [
"1948"
],
"answer_start": [
256
]
} |
57302051947a6a140053d14f | Printed_circuit_board | The Austrian engineer Paul Eisler invented the printed circuit as part of a radio set while working in England around 1936. Around 1943 the USA began to use the technology on a large scale to make proximity fuses for use in World War II. After the war, in 1948, the USA released the invention for commercial use. Printed circuits did not become commonplace in consumer electronics until the mid-1950s, after the Auto-Sembly process was developed by the United States Army. At around the same time in Britain work along similar lines was carried out by Geoffrey Dummer, then at the RRDE. | Who was working on the same type of large-scale application of printed circuits as the U.S. in Britain in the mid-1950s? | {
"text": [
"Geoffrey Dummer"
],
"answer_start": [
552
]
} |
57302051947a6a140053d150 | Printed_circuit_board | The Austrian engineer Paul Eisler invented the printed circuit as part of a radio set while working in England around 1936. Around 1943 the USA began to use the technology on a large scale to make proximity fuses for use in World War II. After the war, in 1948, the USA released the invention for commercial use. Printed circuits did not become commonplace in consumer electronics until the mid-1950s, after the Auto-Sembly process was developed by the United States Army. At around the same time in Britain work along similar lines was carried out by Geoffrey Dummer, then at the RRDE. | What process was created by the U.S. Army that led to innovation in consumer electronics? | {
"text": [
"Auto-Sembly"
],
"answer_start": [
412
]
} |
5730221db2c2fd1400568909 | Printed_circuit_board | During World War II, the development of the anti-aircraft proximity fuse required an electronic circuit that could withstand being fired from a gun, and could be produced in quantity. The Centralab Division of Globe Union submitted a proposal which met the requirements: a ceramic plate would be screenprinted with metallic paint for conductors and carbon material for resistors, with ceramic disc capacitors and subminiature vacuum tubes soldered in place. The technique proved viable, and the resulting patent on the process, which was classified by the U.S. Army, was assigned to Globe Union. It was not until 1984 that the Institute of Electrical and Electronics Engineers (IEEE) awarded Mr. Harry W. Rubinstein, the former head of Globe Union's Centralab Division, its coveted Cledo Brunetti Award for early key contributions to the development of printed components and conductors on a common insulating substrate. As well, Mr. Rubinstein was honored in 1984 by his alma mater, the University of Wisconsin-Madison, for his innovations in the technology of printed electronic circuits and the fabrication of capacitors. | What company developed the first electronic circuit that could be mass produced and was durable enough to be fired from a gun? | {
"text": [
"Globe Union"
],
"answer_start": [
210
]
} |
5730221db2c2fd140056890a | Printed_circuit_board | During World War II, the development of the anti-aircraft proximity fuse required an electronic circuit that could withstand being fired from a gun, and could be produced in quantity. The Centralab Division of Globe Union submitted a proposal which met the requirements: a ceramic plate would be screenprinted with metallic paint for conductors and carbon material for resistors, with ceramic disc capacitors and subminiature vacuum tubes soldered in place. The technique proved viable, and the resulting patent on the process, which was classified by the U.S. Army, was assigned to Globe Union. It was not until 1984 that the Institute of Electrical and Electronics Engineers (IEEE) awarded Mr. Harry W. Rubinstein, the former head of Globe Union's Centralab Division, its coveted Cledo Brunetti Award for early key contributions to the development of printed components and conductors on a common insulating substrate. As well, Mr. Rubinstein was honored in 1984 by his alma mater, the University of Wisconsin-Madison, for his innovations in the technology of printed electronic circuits and the fabrication of capacitors. | What was the plate used for anti-aircraft proximity fuses in World War II made out of? | {
"text": [
"ceramic"
],
"answer_start": [
273
]
} |
5730221db2c2fd140056890b | Printed_circuit_board | During World War II, the development of the anti-aircraft proximity fuse required an electronic circuit that could withstand being fired from a gun, and could be produced in quantity. The Centralab Division of Globe Union submitted a proposal which met the requirements: a ceramic plate would be screenprinted with metallic paint for conductors and carbon material for resistors, with ceramic disc capacitors and subminiature vacuum tubes soldered in place. The technique proved viable, and the resulting patent on the process, which was classified by the U.S. Army, was assigned to Globe Union. It was not until 1984 that the Institute of Electrical and Electronics Engineers (IEEE) awarded Mr. Harry W. Rubinstein, the former head of Globe Union's Centralab Division, its coveted Cledo Brunetti Award for early key contributions to the development of printed components and conductors on a common insulating substrate. As well, Mr. Rubinstein was honored in 1984 by his alma mater, the University of Wisconsin-Madison, for his innovations in the technology of printed electronic circuits and the fabrication of capacitors. | Who was in charge of the Centralab Division of Globe Union when the PCB used in anti-aircraft fuses was invented? | {
"text": [
"Harry W. Rubinstein"
],
"answer_start": [
696
]
} |
5730221db2c2fd140056890c | Printed_circuit_board | During World War II, the development of the anti-aircraft proximity fuse required an electronic circuit that could withstand being fired from a gun, and could be produced in quantity. The Centralab Division of Globe Union submitted a proposal which met the requirements: a ceramic plate would be screenprinted with metallic paint for conductors and carbon material for resistors, with ceramic disc capacitors and subminiature vacuum tubes soldered in place. The technique proved viable, and the resulting patent on the process, which was classified by the U.S. Army, was assigned to Globe Union. It was not until 1984 that the Institute of Electrical and Electronics Engineers (IEEE) awarded Mr. Harry W. Rubinstein, the former head of Globe Union's Centralab Division, its coveted Cledo Brunetti Award for early key contributions to the development of printed components and conductors on a common insulating substrate. As well, Mr. Rubinstein was honored in 1984 by his alma mater, the University of Wisconsin-Madison, for his innovations in the technology of printed electronic circuits and the fabrication of capacitors. | What award did Rubinstein win in 1984 for his contributions? | {
"text": [
"Cledo Brunetti Award"
],
"answer_start": [
782
]
} |
5730221db2c2fd140056890d | Printed_circuit_board | During World War II, the development of the anti-aircraft proximity fuse required an electronic circuit that could withstand being fired from a gun, and could be produced in quantity. The Centralab Division of Globe Union submitted a proposal which met the requirements: a ceramic plate would be screenprinted with metallic paint for conductors and carbon material for resistors, with ceramic disc capacitors and subminiature vacuum tubes soldered in place. The technique proved viable, and the resulting patent on the process, which was classified by the U.S. Army, was assigned to Globe Union. It was not until 1984 that the Institute of Electrical and Electronics Engineers (IEEE) awarded Mr. Harry W. Rubinstein, the former head of Globe Union's Centralab Division, its coveted Cledo Brunetti Award for early key contributions to the development of printed components and conductors on a common insulating substrate. As well, Mr. Rubinstein was honored in 1984 by his alma mater, the University of Wisconsin-Madison, for his innovations in the technology of printed electronic circuits and the fabrication of capacitors. | Where did Harry Rubinstein attend college? | {
"text": [
"University of Wisconsin-Madison"
],
"answer_start": [
988
]
} |
57302364b2c2fd1400568927 | Printed_circuit_board | Originally, every electronic component had wire leads, and the PCB had holes drilled for each wire of each component. The components' leads were then passed through the holes and soldered to the PCB trace. This method of assembly is called through-hole construction. In 1949, Moe Abramson and Stanislaus F. Danko of the United States Army Signal Corps developed the Auto-Sembly process in which component leads were inserted into a copper foil interconnection pattern and dip soldered. The patent they obtained in 1956 was assigned to the U.S. Army. With the development of board lamination and etching techniques, this concept evolved into the standard printed circuit board fabrication process in use today. Soldering could be done automatically by passing the board over a ripple, or wave, of molten solder in a wave-soldering machine. However, the wires and holes are wasteful since drilling holes is expensive and the protruding wires are merely cut off. | What type of construction was originally used for all electronic components? | {
"text": [
"through-hole"
],
"answer_start": [
240
]
} |
57302364b2c2fd1400568928 | Printed_circuit_board | Originally, every electronic component had wire leads, and the PCB had holes drilled for each wire of each component. The components' leads were then passed through the holes and soldered to the PCB trace. This method of assembly is called through-hole construction. In 1949, Moe Abramson and Stanislaus F. Danko of the United States Army Signal Corps developed the Auto-Sembly process in which component leads were inserted into a copper foil interconnection pattern and dip soldered. The patent they obtained in 1956 was assigned to the U.S. Army. With the development of board lamination and etching techniques, this concept evolved into the standard printed circuit board fabrication process in use today. Soldering could be done automatically by passing the board over a ripple, or wave, of molten solder in a wave-soldering machine. However, the wires and holes are wasteful since drilling holes is expensive and the protruding wires are merely cut off. | In what year was the Auto-Sembly process created? | {
"text": [
"1949"
],
"answer_start": [
270
]
} |
57302364b2c2fd1400568929 | Printed_circuit_board | Originally, every electronic component had wire leads, and the PCB had holes drilled for each wire of each component. The components' leads were then passed through the holes and soldered to the PCB trace. This method of assembly is called through-hole construction. In 1949, Moe Abramson and Stanislaus F. Danko of the United States Army Signal Corps developed the Auto-Sembly process in which component leads were inserted into a copper foil interconnection pattern and dip soldered. The patent they obtained in 1956 was assigned to the U.S. Army. With the development of board lamination and etching techniques, this concept evolved into the standard printed circuit board fabrication process in use today. Soldering could be done automatically by passing the board over a ripple, or wave, of molten solder in a wave-soldering machine. However, the wires and holes are wasteful since drilling holes is expensive and the protruding wires are merely cut off. | Although two men developed the Auto-Sembly process, to whom was the patent officially granted? | {
"text": [
"U.S. Army"
],
"answer_start": [
539
]
} |
57302364b2c2fd140056892a | Printed_circuit_board | Originally, every electronic component had wire leads, and the PCB had holes drilled for each wire of each component. The components' leads were then passed through the holes and soldered to the PCB trace. This method of assembly is called through-hole construction. In 1949, Moe Abramson and Stanislaus F. Danko of the United States Army Signal Corps developed the Auto-Sembly process in which component leads were inserted into a copper foil interconnection pattern and dip soldered. The patent they obtained in 1956 was assigned to the U.S. Army. With the development of board lamination and etching techniques, this concept evolved into the standard printed circuit board fabrication process in use today. Soldering could be done automatically by passing the board over a ripple, or wave, of molten solder in a wave-soldering machine. However, the wires and holes are wasteful since drilling holes is expensive and the protruding wires are merely cut off. | What year was the patent for the Auto-Sembly process granted? | {
"text": [
"1956"
],
"answer_start": [
514
]
} |
57302364b2c2fd140056892b | Printed_circuit_board | Originally, every electronic component had wire leads, and the PCB had holes drilled for each wire of each component. The components' leads were then passed through the holes and soldered to the PCB trace. This method of assembly is called through-hole construction. In 1949, Moe Abramson and Stanislaus F. Danko of the United States Army Signal Corps developed the Auto-Sembly process in which component leads were inserted into a copper foil interconnection pattern and dip soldered. The patent they obtained in 1956 was assigned to the U.S. Army. With the development of board lamination and etching techniques, this concept evolved into the standard printed circuit board fabrication process in use today. Soldering could be done automatically by passing the board over a ripple, or wave, of molten solder in a wave-soldering machine. However, the wires and holes are wasteful since drilling holes is expensive and the protruding wires are merely cut off. | Which part of the Auto-Sembly manufacturing process is the most costly? | {
"text": [
"drilling holes"
],
"answer_start": [
887
]
} |
572fa78c04bcaa1900d76b55 | Greeks | Greek colonies and communities have been historically established on the shores of the Mediterranean Sea and Black Sea, but the Greek people have always been centered around the Aegean and Ionian seas, where the Greek language has been spoken since the Bronze Age. Until the early 20th century, Greeks were distributed between the Greek peninsula, the western coast of Asia Minor, the Black Sea coast, Cappadocia in central Anatolia, Egypt, the Balkans, Cyprus, and Constantinople. Many of these regions coincided to a large extent with the borders of the Byzantine Empire of the late 11th century and the Eastern Mediterranean areas of ancient Greek colonization. The cultural centers of the Greeks have included Athens, Thessalonica, Alexandria, Smyrna, and Constantinople at various periods. | When was the emergence of the Greek spoken dialect believed to have started ? | {
"text": [
"the Greek language has been spoken since the Bronze Age."
],
"answer_start": [
208
]
} |
572fa95304bcaa1900d76b70 | Greeks | The evolution of Proto-Greek should be considered within the context of an early Paleo-Balkan sprachbund that makes it difficult to delineate exact boundaries between individual languages. The characteristically Greek representation of word-initial laryngeals by prothetic vowels is shared, for one, by the Armenian language, which also seems to share some other phonological and morphological peculiarities of Greek; this has led some linguists to propose a hypothetical closer relationship between Greek and Armenian, although evidence remains scant. | What is commonly seen in the Greek language that is not a constant ? | {
"text": [
"The characteristically Greek representation of word-initial laryngeals by prothetic vowels"
],
"answer_start": [
189
]
} |
572fab80947a6a140053cb44 | Greeks | Around 1200 BC, the Dorians, another Greek-speaking people, followed from Epirus. Traditionally, historians have believed that the Dorian invasion caused the collapse of the Mycenaean civilization, but it is likely the main attack was made by seafaring raiders (sea peoples) who sailed into the eastern Mediterranean around 1180 BC. The Dorian invasion was followed by a poorly attested period of migrations, appropriately called the Greek Dark Ages, but by 800 BC the landscape of Archaic and Classical Greece was discernible. | What group of people came with others who left the geographical and historical region in southeastern Europe, now a mutual region between Greece and Albania ? | {
"text": [
"the Dorians"
],
"answer_start": [
16
]
} |
572fab80947a6a140053cb45 | Greeks | Around 1200 BC, the Dorians, another Greek-speaking people, followed from Epirus. Traditionally, historians have believed that the Dorian invasion caused the collapse of the Mycenaean civilization, but it is likely the main attack was made by seafaring raiders (sea peoples) who sailed into the eastern Mediterranean around 1180 BC. The Dorian invasion was followed by a poorly attested period of migrations, appropriately called the Greek Dark Ages, but by 800 BC the landscape of Archaic and Classical Greece was discernible. | When did these groups make the migration ? | {
"text": [
"Around 1200 BC"
],
"answer_start": [
0
]
} |
572fab80947a6a140053cb46 | Greeks | Around 1200 BC, the Dorians, another Greek-speaking people, followed from Epirus. Traditionally, historians have believed that the Dorian invasion caused the collapse of the Mycenaean civilization, but it is likely the main attack was made by seafaring raiders (sea peoples) who sailed into the eastern Mediterranean around 1180 BC. The Dorian invasion was followed by a poorly attested period of migrations, appropriately called the Greek Dark Ages, but by 800 BC the landscape of Archaic and Classical Greece was discernible. | What civilization is the group credited with putting an end to ? | {
"text": [
"the Mycenaean civilization,"
],
"answer_start": [
170
]
} |
572faeefa23a5019007fc891 | Greeks | The Greeks of classical antiquity idealized their Mycenaean ancestors and the Mycenaean period as a glorious era of heroes, closeness of the gods and material wealth. The Homeric Epics (i.e. Iliad and Odyssey) were especially and generally accepted as part of the Greek past and it was not until the 19th century that scholars began to question Homer's historicity. As part of the Mycenaean heritage that survived, the names of the gods and goddesses of Mycenaean Greece (e.g. Zeus, Poseidon and Hades) became major figures of the Olympian Pantheon of later antiquity. | How did the Greeks look upon their forebears ? | {
"text": [
"Greeks of classical antiquity idealized their Mycenaean ancestors"
],
"answer_start": [
4
]
} |
572faeefa23a5019007fc894 | Greeks | The Greeks of classical antiquity idealized their Mycenaean ancestors and the Mycenaean period as a glorious era of heroes, closeness of the gods and material wealth. The Homeric Epics (i.e. Iliad and Odyssey) were especially and generally accepted as part of the Greek past and it was not until the 19th century that scholars began to question Homer's historicity. As part of the Mycenaean heritage that survived, the names of the gods and goddesses of Mycenaean Greece (e.g. Zeus, Poseidon and Hades) became major figures of the Olympian Pantheon of later antiquity. | Who was the author of these tales ? | {
"text": [
"Homer"
],
"answer_start": [
345
]
} |
572faeefa23a5019007fc895 | Greeks | The Greeks of classical antiquity idealized their Mycenaean ancestors and the Mycenaean period as a glorious era of heroes, closeness of the gods and material wealth. The Homeric Epics (i.e. Iliad and Odyssey) were especially and generally accepted as part of the Greek past and it was not until the 19th century that scholars began to question Homer's historicity. As part of the Mycenaean heritage that survived, the names of the gods and goddesses of Mycenaean Greece (e.g. Zeus, Poseidon and Hades) became major figures of the Olympian Pantheon of later antiquity. | What were the names of some of the figures for the established religion that are based on ancestral ties ? | {
"text": [
"Zeus, Poseidon and Hades"
],
"answer_start": [
477
]
} |
572fb178a23a5019007fc8ac | Greeks | The ethnogenesis of the Greek nation is linked to the development of Pan-Hellenism in the 8th century BC. According to some scholars, the foundational event was the Olympic Games in 776 BC, when the idea of a common Hellenism among the Greek tribes was first translated into a shared cultural experience and Hellenism was primarily a matter of common culture. The works of Homer (i.e. Iliad and Odyssey) and Hesiod (i.e. Theogony) were written in the 8th century BC, becoming the basis of the national religion, ethos, history and mythology. The Oracle of Apollo at Delphi was established in this period. | When did this event occur ? | {
"text": [
"development of Pan-Hellenism in the 8th century BC."
],
"answer_start": [
54
]
} |
572fb178a23a5019007fc8ad | Greeks | The ethnogenesis of the Greek nation is linked to the development of Pan-Hellenism in the 8th century BC. According to some scholars, the foundational event was the Olympic Games in 776 BC, when the idea of a common Hellenism among the Greek tribes was first translated into a shared cultural experience and Hellenism was primarily a matter of common culture. The works of Homer (i.e. Iliad and Odyssey) and Hesiod (i.e. Theogony) were written in the 8th century BC, becoming the basis of the national religion, ethos, history and mythology. The Oracle of Apollo at Delphi was established in this period. | What national sporting event was held during this time period still goes on in celebration today ? | {
"text": [
"the foundational event was the Olympic Games in 776 BC,"
],
"answer_start": [
134
]
} |
572fb178a23a5019007fc8af | Greeks | The ethnogenesis of the Greek nation is linked to the development of Pan-Hellenism in the 8th century BC. According to some scholars, the foundational event was the Olympic Games in 776 BC, when the idea of a common Hellenism among the Greek tribes was first translated into a shared cultural experience and Hellenism was primarily a matter of common culture. The works of Homer (i.e. Iliad and Odyssey) and Hesiod (i.e. Theogony) were written in the 8th century BC, becoming the basis of the national religion, ethos, history and mythology. The Oracle of Apollo at Delphi was established in this period. | What famous spiritual guide and God was a devotional temple made to in the 8th century ? | {
"text": [
"Oracle of Apollo at Delphi"
],
"answer_start": [
546
]
} |
572fb550a23a5019007fc8d1 | Greeks | In any case, Alexander's toppling of the Achaemenid Empire, after his victories at the battles of the Granicus, Issus and Gaugamela, and his advance as far as modern-day Pakistan and Tajikistan, provided an important outlet for Greek culture, via the creation of colonies and trade routes along the way. While the Alexandrian empire did not survive its creator's death intact, the cultural implications of the spread of Hellenism across much of the Middle East and Asia were to prove long lived as Greek became the lingua franca, a position it retained even in Roman times. Many Greeks settled in Hellenistic cities like Alexandria, Antioch and Seleucia. Two thousand years later, there are still communities in Pakistan and Afghanistan, like the Kalash, who claim to be descended from Greek settlers. | What Macedonian ruler helped to advance Greek beliefs and ways of life ? | {
"text": [
"Alexander"
],
"answer_start": [
13
]
} |
572fb550a23a5019007fc8d3 | Greeks | In any case, Alexander's toppling of the Achaemenid Empire, after his victories at the battles of the Granicus, Issus and Gaugamela, and his advance as far as modern-day Pakistan and Tajikistan, provided an important outlet for Greek culture, via the creation of colonies and trade routes along the way. While the Alexandrian empire did not survive its creator's death intact, the cultural implications of the spread of Hellenism across much of the Middle East and Asia were to prove long lived as Greek became the lingua franca, a position it retained even in Roman times. Many Greeks settled in Hellenistic cities like Alexandria, Antioch and Seleucia. Two thousand years later, there are still communities in Pakistan and Afghanistan, like the Kalash, who claim to be descended from Greek settlers. | What types of cities did the expansion of the great ruler inspire ? | {
"text": [
"Hellenistic cities"
],
"answer_start": [
597
]
} |
572fb550a23a5019007fc8d5 | Greeks | In any case, Alexander's toppling of the Achaemenid Empire, after his victories at the battles of the Granicus, Issus and Gaugamela, and his advance as far as modern-day Pakistan and Tajikistan, provided an important outlet for Greek culture, via the creation of colonies and trade routes along the way. While the Alexandrian empire did not survive its creator's death intact, the cultural implications of the spread of Hellenism across much of the Middle East and Asia were to prove long lived as Greek became the lingua franca, a position it retained even in Roman times. Many Greeks settled in Hellenistic cities like Alexandria, Antioch and Seleucia. Two thousand years later, there are still communities in Pakistan and Afghanistan, like the Kalash, who claim to be descended from Greek settlers. | Name a city that the Greeks nested in ? | {
"text": [
"cities like Alexandria, Antioch and Seleucia."
],
"answer_start": [
609
]
} |
572fb70e947a6a140053cbd7 | Greeks | This age saw the Greeks move towards larger cities and a reduction in the importance of the city-state. These larger cities were parts of the still larger Kingdoms of the Diadochi. Greeks, however, remained aware of their past, chiefly through the study of the works of Homer and the classical authors. An important factor in maintaining Greek identity was contact with barbarian (non-Greek) peoples, which was deepened in the new cosmopolitan environment of the multi-ethnic Hellenistic kingdoms. This led to a strong desire among Greeks to organize the transmission of the Hellenic paideia to the next generation. Greek science, technology and mathematics are generally considered to have reached their peak during the Hellenistic period. | What did the Greeks wants to be imparted to their descendants ? | {
"text": [
"the transmission of the Hellenic paideia to the next generation."
],
"answer_start": [
551
]
} |
572fb85804bcaa1900d76c31 | Greeks | In the religious sphere, this was a period of profound change. The spiritual revolution that took place, saw a waning of the old Greek religion, whose decline beginning in the 3rd century BC continued with the introduction of new religious movements from the East. The cults of deities like Isis and Mithra were introduced into the Greek world. Greek-speaking communities of the Hellenized East were instrumental in the spread of early Christianity in the 2nd and 3rd centuries, and Christianity's early leaders and writers (notably St Paul) were generally Greek-speaking, though none were from Greece. However, Greece itself had a tendency to cling to paganism and was not one of the influential centers of early Christianity: in fact, some ancient Greek religious practices remained in vogue until the end of the 4th century, with some areas such as the southeastern Peloponnese remaining pagan until well into the 10th century AD. | When did the religions of the past begin to dissipate ? | {
"text": [
"decline beginning in the 3rd century BC"
],
"answer_start": [
151
]
} |
572fb85804bcaa1900d76c32 | Greeks | In the religious sphere, this was a period of profound change. The spiritual revolution that took place, saw a waning of the old Greek religion, whose decline beginning in the 3rd century BC continued with the introduction of new religious movements from the East. The cults of deities like Isis and Mithra were introduced into the Greek world. Greek-speaking communities of the Hellenized East were instrumental in the spread of early Christianity in the 2nd and 3rd centuries, and Christianity's early leaders and writers (notably St Paul) were generally Greek-speaking, though none were from Greece. However, Greece itself had a tendency to cling to paganism and was not one of the influential centers of early Christianity: in fact, some ancient Greek religious practices remained in vogue until the end of the 4th century, with some areas such as the southeastern Peloponnese remaining pagan until well into the 10th century AD. | What encouraged the change of faith ? | {
"text": [
"with the introduction of new religious movements from the East."
],
"answer_start": [
201
]
} |
572fb85804bcaa1900d76c34 | Greeks | In the religious sphere, this was a period of profound change. The spiritual revolution that took place, saw a waning of the old Greek religion, whose decline beginning in the 3rd century BC continued with the introduction of new religious movements from the East. The cults of deities like Isis and Mithra were introduced into the Greek world. Greek-speaking communities of the Hellenized East were instrumental in the spread of early Christianity in the 2nd and 3rd centuries, and Christianity's early leaders and writers (notably St Paul) were generally Greek-speaking, though none were from Greece. However, Greece itself had a tendency to cling to paganism and was not one of the influential centers of early Christianity: in fact, some ancient Greek religious practices remained in vogue until the end of the 4th century, with some areas such as the southeastern Peloponnese remaining pagan until well into the 10th century AD. | What group was significant in the expansion of the Christian faith ? | {
"text": [
"Hellenized East were instrumental in the spread of early Christianity"
],
"answer_start": [
379
]
} |
572fba31947a6a140053cbee | Greeks | Of the new eastern religions introduced into the Greek world, the most successful was Christianity. From the early centuries of the Common Era, the Greeks identified as Romaioi ("Romans"), by that time the name ‘Hellenes’ denoted pagans. While ethnic distinctions still existed in the Roman Empire, they became secondary to religious considerations and the renewed empire used Christianity as a tool to support its cohesion and promoted a robust Roman national identity. Concurrently the secular, urban civilization of late antiquity survived in the Eastern Mediterranean along with Greco-Roman educational system, although it was from Christianity that the culture's essential values were drawn. | What alternative name were the Greeks known by ? | {
"text": [
"the Greeks identified as Romaioi (\"Romans\")"
],
"answer_start": [
144
]
} |
572fba31947a6a140053cbef | Greeks | Of the new eastern religions introduced into the Greek world, the most successful was Christianity. From the early centuries of the Common Era, the Greeks identified as Romaioi ("Romans"), by that time the name ‘Hellenes’ denoted pagans. While ethnic distinctions still existed in the Roman Empire, they became secondary to religious considerations and the renewed empire used Christianity as a tool to support its cohesion and promoted a robust Roman national identity. Concurrently the secular, urban civilization of late antiquity survived in the Eastern Mediterranean along with Greco-Roman educational system, although it was from Christianity that the culture's essential values were drawn. | What did the label of Hellenes come to stand for during the Common Era of Greece ? | {
"text": [
"the name ‘Hellenes’ denoted pagans"
],
"answer_start": [
202
]
} |
572fba31947a6a140053cbf0 | Greeks | Of the new eastern religions introduced into the Greek world, the most successful was Christianity. From the early centuries of the Common Era, the Greeks identified as Romaioi ("Romans"), by that time the name ‘Hellenes’ denoted pagans. While ethnic distinctions still existed in the Roman Empire, they became secondary to religious considerations and the renewed empire used Christianity as a tool to support its cohesion and promoted a robust Roman national identity. Concurrently the secular, urban civilization of late antiquity survived in the Eastern Mediterranean along with Greco-Roman educational system, although it was from Christianity that the culture's essential values were drawn. | Did the Roman world consider one ethnocentric lineage to be a great concern ? | {
"text": [
"secondary to religious considerations"
],
"answer_start": [
311
]
} |
572fbc0804bcaa1900d76c41 | Greeks | The Eastern Roman Empire – today conventionally named the Byzantine Empire, a name not in use during its own time – became increasingly influenced by Greek culture after the 7th century, when Emperor Heraclius (AD 575 - 641) decided to make Greek the empire's official language. Certainly from then on, but likely earlier, the Roman and Greek cultures were virtually fused into a single Greco-Roman world. Although the Latin West recognized the Eastern Empire's claim to the Roman legacy for several centuries, after Pope Leo III crowned Charlemagne, king of the Franks, as the "Roman Emperor" on 25 December 800, an act which eventually led to the formation of the Holy Roman Empire, the Latin West started to favour the Franks and began to refer to the Eastern Roman Empire largely as the Empire of the Greeks (Imperium Graecorum). | When did the Byzantine Kingdom come under the impact of the Greeks. | {
"text": [
"influenced by Greek culture after the 7th century,"
],
"answer_start": [
136
]
} |
572fbc0804bcaa1900d76c42 | Greeks | The Eastern Roman Empire – today conventionally named the Byzantine Empire, a name not in use during its own time – became increasingly influenced by Greek culture after the 7th century, when Emperor Heraclius (AD 575 - 641) decided to make Greek the empire's official language. Certainly from then on, but likely earlier, the Roman and Greek cultures were virtually fused into a single Greco-Roman world. Although the Latin West recognized the Eastern Empire's claim to the Roman legacy for several centuries, after Pope Leo III crowned Charlemagne, king of the Franks, as the "Roman Emperor" on 25 December 800, an act which eventually led to the formation of the Holy Roman Empire, the Latin West started to favour the Franks and began to refer to the Eastern Roman Empire largely as the Empire of the Greeks (Imperium Graecorum). | Who ruled Rome during this time period ? | {
"text": [
"Emperor Heraclius (AD 575 - 641)"
],
"answer_start": [
192
]
} |
572fbc0804bcaa1900d76c43 | Greeks | The Eastern Roman Empire – today conventionally named the Byzantine Empire, a name not in use during its own time – became increasingly influenced by Greek culture after the 7th century, when Emperor Heraclius (AD 575 - 641) decided to make Greek the empire's official language. Certainly from then on, but likely earlier, the Roman and Greek cultures were virtually fused into a single Greco-Roman world. Although the Latin West recognized the Eastern Empire's claim to the Roman legacy for several centuries, after Pope Leo III crowned Charlemagne, king of the Franks, as the "Roman Emperor" on 25 December 800, an act which eventually led to the formation of the Holy Roman Empire, the Latin West started to favour the Franks and began to refer to the Eastern Roman Empire largely as the Empire of the Greeks (Imperium Graecorum). | What decision did he make that influenced the culture in an attempt to make things more homogeneous ? | {
"text": [
"decided to make Greek the empire's official language."
],
"answer_start": [
225
]
} |
572fbc0804bcaa1900d76c45 | Greeks | The Eastern Roman Empire – today conventionally named the Byzantine Empire, a name not in use during its own time – became increasingly influenced by Greek culture after the 7th century, when Emperor Heraclius (AD 575 - 641) decided to make Greek the empire's official language. Certainly from then on, but likely earlier, the Roman and Greek cultures were virtually fused into a single Greco-Roman world. Although the Latin West recognized the Eastern Empire's claim to the Roman legacy for several centuries, after Pope Leo III crowned Charlemagne, king of the Franks, as the "Roman Emperor" on 25 December 800, an act which eventually led to the formation of the Holy Roman Empire, the Latin West started to favour the Franks and began to refer to the Eastern Roman Empire largely as the Empire of the Greeks (Imperium Graecorum). | Who was favored by those who lived in the west and mainly used another form of well know verbal language ? | {
"text": [
"the Latin West started to favour the Franks"
],
"answer_start": [
685
]
} |
572fbf48a23a5019007fc942 | Greeks | A distinct Greek political identity re-emerged in the 11th century in educated circles and became more forceful after the fall of Constantinople to the Crusaders of the Fourth Crusade in 1204, so that when the empire was revived in 1261, it became in many ways a Greek national state. That new notion of nationhood engendered a deep interest in the classical past culminating in the ideas of the Neoplatonist philosopher Gemistus Pletho, who abandoned Christianity. However, it was the combination of Orthodox Christianity with a specifically Greek identity that shaped the Greeks' notion of themselves in the empire's twilight years. The interest in the Classical Greek heritage was complemented by a renewed emphasis on Greek Orthodox identity, which was reinforced in the late Medieval and Ottoman Greeks' links with their fellow Orthodox Christians in the Russian Empire. These were further strengthened following the fall of the Empire of Trebizond in 1461, after which and until the second Russo-Turkish War of 1828-29 hundreds of thousands of Pontic Greeks fled or migrated from the Pontic Alps and Armenian Highlands to southern Russia and the Russian South Caucasus (see also Greeks in Russia, Greeks in Armenia, Greeks in Georgia, and Caucasian Greeks). | When did the nation reestablish itself ? | {
"text": [
"empire was revived in 1261"
],
"answer_start": [
210
]
} |
572fbf48a23a5019007fc943 | Greeks | A distinct Greek political identity re-emerged in the 11th century in educated circles and became more forceful after the fall of Constantinople to the Crusaders of the Fourth Crusade in 1204, so that when the empire was revived in 1261, it became in many ways a Greek national state. That new notion of nationhood engendered a deep interest in the classical past culminating in the ideas of the Neoplatonist philosopher Gemistus Pletho, who abandoned Christianity. However, it was the combination of Orthodox Christianity with a specifically Greek identity that shaped the Greeks' notion of themselves in the empire's twilight years. The interest in the Classical Greek heritage was complemented by a renewed emphasis on Greek Orthodox identity, which was reinforced in the late Medieval and Ottoman Greeks' links with their fellow Orthodox Christians in the Russian Empire. These were further strengthened following the fall of the Empire of Trebizond in 1461, after which and until the second Russo-Turkish War of 1828-29 hundreds of thousands of Pontic Greeks fled or migrated from the Pontic Alps and Armenian Highlands to southern Russia and the Russian South Caucasus (see also Greeks in Russia, Greeks in Armenia, Greeks in Georgia, and Caucasian Greeks). | What was the specialty of great Pietho and what is famous for ? | {
"text": [
"philosopher Gemistus Pletho, who abandoned Christianity."
],
"answer_start": [
409
]
} |
572fbf48a23a5019007fc945 | Greeks | A distinct Greek political identity re-emerged in the 11th century in educated circles and became more forceful after the fall of Constantinople to the Crusaders of the Fourth Crusade in 1204, so that when the empire was revived in 1261, it became in many ways a Greek national state. That new notion of nationhood engendered a deep interest in the classical past culminating in the ideas of the Neoplatonist philosopher Gemistus Pletho, who abandoned Christianity. However, it was the combination of Orthodox Christianity with a specifically Greek identity that shaped the Greeks' notion of themselves in the empire's twilight years. The interest in the Classical Greek heritage was complemented by a renewed emphasis on Greek Orthodox identity, which was reinforced in the late Medieval and Ottoman Greeks' links with their fellow Orthodox Christians in the Russian Empire. These were further strengthened following the fall of the Empire of Trebizond in 1461, after which and until the second Russo-Turkish War of 1828-29 hundreds of thousands of Pontic Greeks fled or migrated from the Pontic Alps and Armenian Highlands to southern Russia and the Russian South Caucasus (see also Greeks in Russia, Greeks in Armenia, Greeks in Georgia, and Caucasian Greeks). | Which factoring war was on gong in 1828 and shares the of a previous scuttle ? ? | {
"text": [
"second Russo-Turkish War"
],
"answer_start": [
989
]
} |
572fc0c9b2c2fd14005683e5 | Greeks | Following the Fall of Constantinople on 29 May 1453, many Greeks sought better employment and education opportunities by leaving for the West, particularly Italy, Central Europe, Germany and Russia. Greeks are greatly credited for the European cultural revolution, later called, the Renaissance. In Greek-inhabited territory itself, Greeks came to play a leading role in the Ottoman Empire, due in part to the fact that the central hub of the empire, politically, culturally, and socially, was based on Western Thrace and Greek Macedonia, both in Northern Greece, and of course was centred on the mainly Greek-populated, former Byzantine capital, Constantinople. As a direct consequence of this situation, Greek-speakers came to play a hugely important role in the Ottoman trading and diplomatic establishment, as well as in the church. Added to this, in the first half of the Ottoman period men of Greek origin made up a significant proportion of the Ottoman army, navy, and state bureaucracy, having been levied as adolescents (along with especially Albanians and Serbs) into Ottoman service through the devshirme. Many Ottomans of Greek (or Albanian or Serb) origin were therefore to be found within the Ottoman forces which governed the provinces, from Ottoman Egypt, to Ottomans occupied Yemen and Algeria, frequently as provincial governors. | When did the emperor Constantine lose rule over in 1453 ? | {
"text": [
"Fall of Constantinople on 29 May 1453"
],
"answer_start": [
14
]
} |
572fc26a04bcaa1900d76c8d | Greeks | For those that remained under the Ottoman Empire's millet system, religion was the defining characteristic of national groups (milletler), so the exonym "Greeks" (Rumlar from the name Rhomaioi) was applied by the Ottomans to all members of the Orthodox Church, regardless of their language or ethnic origin. The Greek speakers were the only ethnic group to actually call themselves Romioi, (as opposed to being so named by others) and, at least those educated, considered their ethnicity (genos) to be Hellenic. There were, however, many Greeks who escaped the second-class status of Christians inherent in the Ottoman millet system, according to which Muslims were explicitly awarded senior status and preferential treatment. These Greeks either emigrated, particularly to their fellow Greek Orthodox protector, the Russian Empire, or simply converted to Islam, often only very superficially and whilst remaining crypto-Christian. The most notable examples of large-scale conversion to Turkish Islam among those today defined as Greek Muslims - excluding those who had to convert as a matter of course on being recruited through the devshirme - were to be found in Crete (Cretan Turks), Greek Macedonia (for example among the Vallahades of western Macedonia), and among Pontic Greeks in the Pontic Alps and Armenian Highlands. Several Ottoman sultans and princes were also of part Greek origin, with mothers who were either Greek concubines or princesses from Byzantine noble families, one famous example being sultan Selim the Grim, whose mother Gülbahar Hatun was a Pontic Greek. | How were the population factions of the Ottoman Empire classified ? | {
"text": [
"religion was the defining characteristic of national groups"
],
"answer_start": [
66
]
} |
Subsets and Splits
No community queries yet
The top public SQL queries from the community will appear here once available.