id stringlengths 24 24 | title stringlengths 3 59 | context stringlengths 151 3.71k | question stringlengths 12 217 | answers dict |
|---|---|---|---|---|
572fe9d5a23a5019007fcb2e | Printed_circuit_board | Through-hole manufacture adds to board cost by requiring many holes to be drilled accurately, and limits the available routing area for signal traces on layers immediately below the top layer on multi-layer boards since the holes must pass through all layers to the opposite side. Once surface-mounting came into use, sm... | What components can be surface mounted to save space? | {
"text": [
"small-sized SMD components"
],
"answer_start": [
318
]
} |
572fe9d5a23a5019007fcb2f | Printed_circuit_board | Through-hole manufacture adds to board cost by requiring many holes to be drilled accurately, and limits the available routing area for signal traces on layers immediately below the top layer on multi-layer boards since the holes must pass through all layers to the opposite side. Once surface-mounting came into use, sm... | A component might not be able to be made any smaller because of its mechanical limitations or what other need? | {
"text": [
"power requirements"
],
"answer_start": [
462
]
} |
572ff7d704bcaa1900d76f5b | Printed_circuit_board | Surface-mount technology emerged in the 1960s, gained momentum in the early 1980s and became widely used by the mid-1990s. Components were mechanically redesigned to have small metal tabs or end caps that could be soldered directly onto the PCB surface, instead of wire leads to pass through holes. Components became muc... | When did surface-mount become a commonly used manufacturing process? | {
"text": [
"mid-1990s"
],
"answer_start": [
112
]
} |
572ff7d704bcaa1900d76f5c | Printed_circuit_board | Surface-mount technology emerged in the 1960s, gained momentum in the early 1980s and became widely used by the mid-1990s. Components were mechanically redesigned to have small metal tabs or end caps that could be soldered directly onto the PCB surface, instead of wire leads to pass through holes. Components became muc... | What did the new components with end tabs replace? | {
"text": [
"wire leads"
],
"answer_start": [
265
]
} |
572ff7d704bcaa1900d76f5d | Printed_circuit_board | Surface-mount technology emerged in the 1960s, gained momentum in the early 1980s and became widely used by the mid-1990s. Components were mechanically redesigned to have small metal tabs or end caps that could be soldered directly onto the PCB surface, instead of wire leads to pass through holes. Components became muc... | What improvement is possible with surface-mounting that enables higher production and lower labor costs? | {
"text": [
"automation"
],
"answer_start": [
561
]
} |
572ff7d704bcaa1900d76f5e | Printed_circuit_board | Surface-mount technology emerged in the 1960s, gained momentum in the early 1980s and became widely used by the mid-1990s. Components were mechanically redesigned to have small metal tabs or end caps that could be soldered directly onto the PCB surface, instead of wire leads to pass through holes. Components became muc... | What are SMDs? | {
"text": [
"surface mount devices"
],
"answer_start": [
863
]
} |
572ff7d704bcaa1900d76f5f | Printed_circuit_board | Surface-mount technology emerged in the 1960s, gained momentum in the early 1980s and became widely used by the mid-1990s. Components were mechanically redesigned to have small metal tabs or end caps that could be soldered directly onto the PCB surface, instead of wire leads to pass through holes. Components became muc... | Is it the chip or the package that influences the price of an SMD more? | {
"text": [
"chip"
],
"answer_start": [
919
]
} |
572ff9bf04bcaa1900d76f95 | Printed_circuit_board | Each trace consists of a flat, narrow part of the copper foil that remains after etching. The resistance, determined by width and thickness, of the traces must be sufficiently low for the current the conductor will carry. Power and ground traces may need to be wider than signal traces. In a multi-layer board one entire... | What process is a trace left over from? | {
"text": [
"etching"
],
"answer_start": [
81
]
} |
572ff9bf04bcaa1900d76f96 | Printed_circuit_board | Each trace consists of a flat, narrow part of the copper foil that remains after etching. The resistance, determined by width and thickness, of the traces must be sufficiently low for the current the conductor will carry. Power and ground traces may need to be wider than signal traces. In a multi-layer board one entire... | Along with thickness, what determines the resistance of a trace? | {
"text": [
"width"
],
"answer_start": [
120
]
} |
572ff9bf04bcaa1900d76f97 | Printed_circuit_board | Each trace consists of a flat, narrow part of the copper foil that remains after etching. The resistance, determined by width and thickness, of the traces must be sufficiently low for the current the conductor will carry. Power and ground traces may need to be wider than signal traces. In a multi-layer board one entire... | What type of trace is often narrower than a ground trace? | {
"text": [
"signal"
],
"answer_start": [
272
]
} |
572ff9bf04bcaa1900d76f98 | Printed_circuit_board | Each trace consists of a flat, narrow part of the copper foil that remains after etching. The resistance, determined by width and thickness, of the traces must be sufficiently low for the current the conductor will carry. Power and ground traces may need to be wider than signal traces. In a multi-layer board one entire... | In a multi-layer board, what metal would a ground plane be mostly made out of? | {
"text": [
"copper"
],
"answer_start": [
347
]
} |
572ff9bf04bcaa1900d76f99 | Printed_circuit_board | Each trace consists of a flat, narrow part of the copper foil that remains after etching. The resistance, determined by width and thickness, of the traces must be sufficiently low for the current the conductor will carry. Power and ground traces may need to be wider than signal traces. In a multi-layer board one entire... | What type of circuits use a stripline and microstrip format? | {
"text": [
"microwave circuits"
],
"answer_start": [
415
]
} |
572ffb33a23a5019007fcbfb | Printed_circuit_board | The cloth or fiber material used, resin material, and the cloth to resin ratio determine the laminate's type designation (FR-4, CEM-1, G-10, etc.) and therefore the characteristics of the laminate produced. Important characteristics are the level to which the laminate is fire retardant, the dielectric constant (er), th... | What element of a laminate is designated by the cloth to resin ratio, among other things? | {
"text": [
"type designation"
],
"answer_start": [
104
]
} |
572ffb33a23a5019007fcbfc | Printed_circuit_board | The cloth or fiber material used, resin material, and the cloth to resin ratio determine the laminate's type designation (FR-4, CEM-1, G-10, etc.) and therefore the characteristics of the laminate produced. Important characteristics are the level to which the laminate is fire retardant, the dielectric constant (er), th... | What's the name for the measurement of a laminate's change in thickness as its temperature changes? | {
"text": [
"Z-axis expansion coefficient"
],
"answer_start": [
429
]
} |
572ffb33a23a5019007fcbfd | Printed_circuit_board | The cloth or fiber material used, resin material, and the cloth to resin ratio determine the laminate's type designation (FR-4, CEM-1, G-10, etc.) and therefore the characteristics of the laminate produced. Important characteristics are the level to which the laminate is fire retardant, the dielectric constant (er), th... | What's the abbreviation for the glass transition temperature of a laminate? | {
"text": [
"Tg"
],
"answer_start": [
416
]
} |
572fffeb947a6a140053cf38 | Printed_circuit_board | There are quite a few different dielectrics that can be chosen to provide different insulating values depending on the requirements of the circuit. Some of these dielectrics are polytetrafluoroethylene (Teflon), FR-4, FR-1, CEM-1 or CEM-3. Well known pre-preg materials used in the PCB industry are FR-2 (phenolic cotton... | What's the common name of polytetrafluoroethylene? | {
"text": [
"Teflon"
],
"answer_start": [
203
]
} |
572fffeb947a6a140053cf39 | Printed_circuit_board | There are quite a few different dielectrics that can be chosen to provide different insulating values depending on the requirements of the circuit. Some of these dielectrics are polytetrafluoroethylene (Teflon), FR-4, FR-1, CEM-1 or CEM-3. Well known pre-preg materials used in the PCB industry are FR-2 (phenolic cotton... | What pre-preg material is designated by "FR-2"? | {
"text": [
"phenolic cotton paper"
],
"answer_start": [
305
]
} |
572fffeb947a6a140053cf3a | Printed_circuit_board | There are quite a few different dielectrics that can be chosen to provide different insulating values depending on the requirements of the circuit. Some of these dielectrics are polytetrafluoroethylene (Teflon), FR-4, FR-1, CEM-1 or CEM-3. Well known pre-preg materials used in the PCB industry are FR-2 (phenolic cotton... | To what type of packaging is thermal expansion particularly critical? | {
"text": [
"ball grid array"
],
"answer_start": [
713
]
} |
572fffeb947a6a140053cf3b | Printed_circuit_board | There are quite a few different dielectrics that can be chosen to provide different insulating values depending on the requirements of the circuit. Some of these dielectrics are polytetrafluoroethylene (Teflon), FR-4, FR-1, CEM-1 or CEM-3. Well known pre-preg materials used in the PCB industry are FR-2 (phenolic cotton... | What material delivers optimum dimensional stability? | {
"text": [
"glass fiber"
],
"answer_start": [
767
]
} |
572fffeb947a6a140053cf3c | Printed_circuit_board | There are quite a few different dielectrics that can be chosen to provide different insulating values depending on the requirements of the circuit. Some of these dielectrics are polytetrafluoroethylene (Teflon), FR-4, FR-1, CEM-1 or CEM-3. Well known pre-preg materials used in the PCB industry are FR-2 (phenolic cotton... | What dielectric is matte glass and polyester? | {
"text": [
"FR-6"
],
"answer_start": [
420
]
} |
57301001947a6a140053d018 | Printed_circuit_board | The reinforcement type defines two major classes of materials - woven and non-woven. Woven reinforcements are cheaper, but the high dielectric constant of glass may not be favorable for many higher-frequency applications. The spatially nonhomogeneous structure also introduces local variations in electrical parameters, ... | Along with the non-woven class, what makes up the reinforcement type materials? | {
"text": [
"woven"
],
"answer_start": [
64
]
} |
57301001947a6a140053d019 | Printed_circuit_board | The reinforcement type defines two major classes of materials - woven and non-woven. Woven reinforcements are cheaper, but the high dielectric constant of glass may not be favorable for many higher-frequency applications. The spatially nonhomogeneous structure also introduces local variations in electrical parameters, ... | Which is the more expensive reinforcement type? | {
"text": [
"non-woven"
],
"answer_start": [
74
]
} |
57301001947a6a140053d01a | Printed_circuit_board | The reinforcement type defines two major classes of materials - woven and non-woven. Woven reinforcements are cheaper, but the high dielectric constant of glass may not be favorable for many higher-frequency applications. The spatially nonhomogeneous structure also introduces local variations in electrical parameters, ... | What type of structure do woven reinforcements have that cause them to have variation in their electrical parameters? | {
"text": [
"spatially nonhomogeneous"
],
"answer_start": [
226
]
} |
57301001947a6a140053d01b | Printed_circuit_board | The reinforcement type defines two major classes of materials - woven and non-woven. Woven reinforcements are cheaper, but the high dielectric constant of glass may not be favorable for many higher-frequency applications. The spatially nonhomogeneous structure also introduces local variations in electrical parameters, ... | Which ratio varies because of the structure of woven reinforcements? | {
"text": [
"resin/glass"
],
"answer_start": [
337
]
} |
57301001947a6a140053d01c | Printed_circuit_board | The reinforcement type defines two major classes of materials - woven and non-woven. Woven reinforcements are cheaper, but the high dielectric constant of glass may not be favorable for many higher-frequency applications. The spatially nonhomogeneous structure also introduces local variations in electrical parameters, ... | For what kind of applications are non-woven reinforcement materials better than woven ones? | {
"text": [
"RF/analog"
],
"answer_start": [
510
]
} |
57301192a23a5019007fcceb | Printed_circuit_board | At the glass transition temperature the resin in the composite softens and significantly increases thermal expansion; exceeding Tg then exerts mechanical overload on the board components - e.g. the joints and the vias. Below Tg the thermal expansion of the resin roughly matches copper and glass, above it gets significa... | What's the temperature at which resin softens and expands called? | {
"text": [
"glass transition temperature"
],
"answer_start": [
7
]
} |
57301192a23a5019007fccec | Printed_circuit_board | At the glass transition temperature the resin in the composite softens and significantly increases thermal expansion; exceeding Tg then exerts mechanical overload on the board components - e.g. the joints and the vias. Below Tg the thermal expansion of the resin roughly matches copper and glass, above it gets significa... | Along with vias, what makes up the components of a board? | {
"text": [
"joints"
],
"answer_start": [
198
]
} |
57301192a23a5019007fcced | Printed_circuit_board | At the glass transition temperature the resin in the composite softens and significantly increases thermal expansion; exceeding Tg then exerts mechanical overload on the board components - e.g. the joints and the vias. Below Tg the thermal expansion of the resin roughly matches copper and glass, above it gets significa... | What will happen to the components when the temperature of resin goes above that of glass transition? | {
"text": [
"mechanical overload"
],
"answer_start": [
143
]
} |
57301192a23a5019007fccee | Printed_circuit_board | At the glass transition temperature the resin in the composite softens and significantly increases thermal expansion; exceeding Tg then exerts mechanical overload on the board components - e.g. the joints and the vias. Below Tg the thermal expansion of the resin roughly matches copper and glass, above it gets significa... | When resin stays below Tg, its thermal expansion is similar to that of copper and what other material? | {
"text": [
"glass"
],
"answer_start": [
290
]
} |
57301192a23a5019007fccef | Printed_circuit_board | At the glass transition temperature the resin in the composite softens and significantly increases thermal expansion; exceeding Tg then exerts mechanical overload on the board components - e.g. the joints and the vias. Below Tg the thermal expansion of the resin roughly matches copper and glass, above it gets significa... | What do thick boards require to resist plating failure? | {
"text": [
"high Tg matrix"
],
"answer_start": [
655
]
} |
5730132704bcaa1900d7711d | Printed_circuit_board | Moisture absorption occurs when the material is exposed to high humidity or water. Both the resin and the reinforcement may absorb water; water may be also soaked by capillary forces through voids in the materials and along the reinforcement. Epoxies of the FR-4 materials aren't too susceptible, with absorption of only... | What will happen to the materials when a board gets wet or is in a humid area? | {
"text": [
"Moisture absorption"
],
"answer_start": [
0
]
} |
5730132704bcaa1900d7711e | Printed_circuit_board | Moisture absorption occurs when the material is exposed to high humidity or water. Both the resin and the reinforcement may absorb water; water may be also soaked by capillary forces through voids in the materials and along the reinforcement. Epoxies of the FR-4 materials aren't too susceptible, with absorption of only... | If materials absorb moisture and then are heated enough to vaporize the water, the board might show delamination or what other type of damage? | {
"text": [
"cracking"
],
"answer_start": [
765
]
} |
5730132704bcaa1900d7711f | Printed_circuit_board | Moisture absorption occurs when the material is exposed to high humidity or water. Both the resin and the reinforcement may absorb water; water may be also soaked by capillary forces through voids in the materials and along the reinforcement. Epoxies of the FR-4 materials aren't too susceptible, with absorption of only... | What percentage absorption do F-4 epoxies have? | {
"text": [
"0.15%"
],
"answer_start": [
321
]
} |
5730132704bcaa1900d77120 | Printed_circuit_board | Moisture absorption occurs when the material is exposed to high humidity or water. Both the resin and the reinforcement may absorb water; water may be also soaked by capillary forces through voids in the materials and along the reinforcement. Epoxies of the FR-4 materials aren't too susceptible, with absorption of only... | What's the approximate relative dielectric constant of most materials in circuit boards? | {
"text": [
"4"
],
"answer_start": [
671
]
} |
5730132704bcaa1900d77121 | Printed_circuit_board | Moisture absorption occurs when the material is exposed to high humidity or water. Both the resin and the reinforcement may absorb water; water may be also soaked by capillary forces through voids in the materials and along the reinforcement. Epoxies of the FR-4 materials aren't too susceptible, with absorption of only... | What material has an absorption rate of only 0.01%? | {
"text": [
"Teflon"
],
"answer_start": [
328
]
} |
57301519b2c2fd1400568827 | Printed_circuit_board | The printed circuit board industry defines heavy copper as layers exceeding three ounces of copper, or approximately 0.0042 inches (4.2 mils, 105 μm) thick. PCB designers and fabricators often use heavy copper when design and manufacturing circuit boards in order to increase current-carrying capacity as well as resista... | What's the minimum amount of copper a layer in a PCB can have to be considered "heavy copper"? | {
"text": [
"three ounces"
],
"answer_start": [
76
]
} |
57301519b2c2fd1400568828 | Printed_circuit_board | The printed circuit board industry defines heavy copper as layers exceeding three ounces of copper, or approximately 0.0042 inches (4.2 mils, 105 μm) thick. PCB designers and fabricators often use heavy copper when design and manufacturing circuit boards in order to increase current-carrying capacity as well as resista... | About how thick would a PCB layer be if it contained three oz. of copper? | {
"text": [
"0.0042 inches"
],
"answer_start": [
117
]
} |
57301519b2c2fd1400568829 | Printed_circuit_board | The printed circuit board industry defines heavy copper as layers exceeding three ounces of copper, or approximately 0.0042 inches (4.2 mils, 105 μm) thick. PCB designers and fabricators often use heavy copper when design and manufacturing circuit boards in order to increase current-carrying capacity as well as resista... | What will a circuit board with heavy copper carry very well? | {
"text": [
"current"
],
"answer_start": [
276
]
} |
57301519b2c2fd140056882a | Printed_circuit_board | The printed circuit board industry defines heavy copper as layers exceeding three ounces of copper, or approximately 0.0042 inches (4.2 mils, 105 μm) thick. PCB designers and fabricators often use heavy copper when design and manufacturing circuit boards in order to increase current-carrying capacity as well as resista... | What would a PCB designer use heavy copper to make their circuit board resist? | {
"text": [
"thermal strains"
],
"answer_start": [
327
]
} |
57301519b2c2fd140056882b | Printed_circuit_board | The printed circuit board industry defines heavy copper as layers exceeding three ounces of copper, or approximately 0.0042 inches (4.2 mils, 105 μm) thick. PCB designers and fabricators often use heavy copper when design and manufacturing circuit boards in order to increase current-carrying capacity as well as resista... | Where does the heat go when it leaves heavy copper-plated vias? | {
"text": [
"external heat sinks"
],
"answer_start": [
386
]
} |
573016ea04bcaa1900d7715f | Printed_circuit_board | Since it was quite easy to stack interconnections (wires) inside the embedding matrix, the approach allowed designers to forget completely about the routing of wires (usually a time-consuming operation of PCB design): Anywhere the designer needs a connection, the machine will draw a wire in straight line from one locat... | What arduous aspect of the process can designers skip in Multiwire? | {
"text": [
"routing of wires"
],
"answer_start": [
149
]
} |
573016ea04bcaa1900d77160 | Printed_circuit_board | Since it was quite easy to stack interconnections (wires) inside the embedding matrix, the approach allowed designers to forget completely about the routing of wires (usually a time-consuming operation of PCB design): Anywhere the designer needs a connection, the machine will draw a wire in straight line from one locat... | What does the machine create by drawing a straight line between two points on the board? | {
"text": [
"a connection"
],
"answer_start": [
246
]
} |
573016ea04bcaa1900d77161 | Printed_circuit_board | Since it was quite easy to stack interconnections (wires) inside the embedding matrix, the approach allowed designers to forget completely about the routing of wires (usually a time-consuming operation of PCB design): Anywhere the designer needs a connection, the machine will draw a wire in straight line from one locat... | Along with quick design times, what problem does Multiwire cut down on? | {
"text": [
"crosstalk"
],
"answer_start": [
456
]
} |
573016ea04bcaa1900d77162 | Printed_circuit_board | Since it was quite easy to stack interconnections (wires) inside the embedding matrix, the approach allowed designers to forget completely about the routing of wires (usually a time-consuming operation of PCB design): Anywhere the designer needs a connection, the machine will draw a wire in straight line from one locat... | What makes Multiwire impractical to use when large quantities of a board are needed? | {
"text": [
"cost"
],
"answer_start": [
573
]
} |
573016ea04bcaa1900d77163 | Printed_circuit_board | Since it was quite easy to stack interconnections (wires) inside the embedding matrix, the approach allowed designers to forget completely about the routing of wires (usually a time-consuming operation of PCB design): Anywhere the designer needs a connection, the machine will draw a wire in straight line from one locat... | In simple language, what are the interconnections in an embedding matrix? | {
"text": [
"wires"
],
"answer_start": [
51
]
} |
57301cee947a6a140053d11e | Printed_circuit_board | Cordwood construction can save significant space and was often used with wire-ended components in applications where space was at a premium (such as missile guidance and telemetry systems) and in high-speed computers, where short traces were important. In cordwood construction, axial-leaded components were mounted betw... | What type of construction is best for applications that need to portion space carefully? | {
"text": [
"Cordwood"
],
"answer_start": [
0
]
} |
57301cee947a6a140053d11f | Printed_circuit_board | Cordwood construction can save significant space and was often used with wire-ended components in applications where space was at a premium (such as missile guidance and telemetry systems) and in high-speed computers, where short traces were important. In cordwood construction, axial-leaded components were mounted betw... | What gets mounted in the middle of two parallel planes in a cordwood construction? | {
"text": [
"axial-leaded components"
],
"answer_start": [
279
]
} |
57301cee947a6a140053d120 | Printed_circuit_board | Cordwood construction can save significant space and was often used with wire-ended components in applications where space was at a premium (such as missile guidance and telemetry systems) and in high-speed computers, where short traces were important. In cordwood construction, axial-leaded components were mounted betw... | What do insulating cards prevent between interconnection layers? | {
"text": [
"shorting"
],
"answer_start": [
531
]
} |
57301cee947a6a140053d121 | Printed_circuit_board | Cordwood construction can save significant space and was often used with wire-ended components in applications where space was at a premium (such as missile guidance and telemetry systems) and in high-speed computers, where short traces were important. In cordwood construction, axial-leaded components were mounted betw... | What type of component has to be used in cordwood construction to its detriment? | {
"text": [
"nickel-leaded"
],
"answer_start": [
793
]
} |
57301cee947a6a140053d122 | Printed_circuit_board | Cordwood construction can save significant space and was often used with wire-ended components in applications where space was at a premium (such as missile guidance and telemetry systems) and in high-speed computers, where short traces were important. In cordwood construction, axial-leaded components were mounted betw... | What force caused the physical damage to components that affected the Apollo program? | {
"text": [
"Differential thermal expansion"
],
"answer_start": [
880
]
} |
57301ef4a23a5019007fcdcf | Printed_circuit_board | Development of the methods used in modern printed circuit boards started early in the 20th century. In 1903, a German inventor, Albert Hanson, described flat foil conductors laminated to an insulating board, in multiple layers. Thomas Edison experimented with chemical methods of plating conductors onto linen paper in 1... | Who was the German inventor who wrote in 1903 about conductors being laminated in layers to a board? | {
"text": [
"Albert Hanson"
],
"answer_start": [
128
]
} |
57301ef4a23a5019007fcdd0 | Printed_circuit_board | Development of the methods used in modern printed circuit boards started early in the 20th century. In 1903, a German inventor, Albert Hanson, described flat foil conductors laminated to an insulating board, in multiple layers. Thomas Edison experimented with chemical methods of plating conductors onto linen paper in 1... | What material did Thomas Edison experiment with by trying to chemically attach conductors to it? | {
"text": [
"linen paper"
],
"answer_start": [
304
]
} |
57301ef4a23a5019007fcdd1 | Printed_circuit_board | Development of the methods used in modern printed circuit boards started early in the 20th century. In 1903, a German inventor, Albert Hanson, described flat foil conductors laminated to an insulating board, in multiple layers. Thomas Edison experimented with chemical methods of plating conductors onto linen paper in 1... | What year did Arthur Berry patent his print-and-etch method? | {
"text": [
"1913"
],
"answer_start": [
341
]
} |
57301ef4a23a5019007fcdd2 | Printed_circuit_board | Development of the methods used in modern printed circuit boards started early in the 20th century. In 1903, a German inventor, Albert Hanson, described flat foil conductors laminated to an insulating board, in multiple layers. Thomas Edison experimented with chemical methods of plating conductors onto linen paper in 1... | In Max Schoop's method, what was used to create the flame-sprayed pattern on the board? | {
"text": [
"a patterned mask"
],
"answer_start": [
487
]
} |
57301ef4a23a5019007fcdd3 | Printed_circuit_board | Development of the methods used in modern printed circuit boards started early in the 20th century. In 1903, a German inventor, Albert Hanson, described flat foil conductors laminated to an insulating board, in multiple layers. Thomas Edison experimented with chemical methods of plating conductors onto linen paper in 1... | Who obtained a patent in 1927 for his method of electroplating circuit patterns? | {
"text": [
"Charles Ducas"
],
"answer_start": [
505
]
} |
57302051947a6a140053d14c | Printed_circuit_board | The Austrian engineer Paul Eisler invented the printed circuit as part of a radio set while working in England around 1936. Around 1943 the USA began to use the technology on a large scale to make proximity fuses for use in World War II. After the war, in 1948, the USA released the invention for commercial use. Printed... | What was Paul Eisler making when he came up with the printed circuit? | {
"text": [
"a radio set"
],
"answer_start": [
74
]
} |
57302051947a6a140053d14d | Printed_circuit_board | The Austrian engineer Paul Eisler invented the printed circuit as part of a radio set while working in England around 1936. Around 1943 the USA began to use the technology on a large scale to make proximity fuses for use in World War II. After the war, in 1948, the USA released the invention for commercial use. Printed... | What event prompted the United States to adopt the printed circuit to make proximity fuses? | {
"text": [
"World War II"
],
"answer_start": [
224
]
} |
57302051947a6a140053d14e | Printed_circuit_board | The Austrian engineer Paul Eisler invented the printed circuit as part of a radio set while working in England around 1936. Around 1943 the USA began to use the technology on a large scale to make proximity fuses for use in World War II. After the war, in 1948, the USA released the invention for commercial use. Printed... | When was the printed circuit released for commercial use in the U.S.? | {
"text": [
"1948"
],
"answer_start": [
256
]
} |
57302051947a6a140053d14f | Printed_circuit_board | The Austrian engineer Paul Eisler invented the printed circuit as part of a radio set while working in England around 1936. Around 1943 the USA began to use the technology on a large scale to make proximity fuses for use in World War II. After the war, in 1948, the USA released the invention for commercial use. Printed... | Who was working on the same type of large-scale application of printed circuits as the U.S. in Britain in the mid-1950s? | {
"text": [
"Geoffrey Dummer"
],
"answer_start": [
552
]
} |
57302051947a6a140053d150 | Printed_circuit_board | The Austrian engineer Paul Eisler invented the printed circuit as part of a radio set while working in England around 1936. Around 1943 the USA began to use the technology on a large scale to make proximity fuses for use in World War II. After the war, in 1948, the USA released the invention for commercial use. Printed... | What process was created by the U.S. Army that led to innovation in consumer electronics? | {
"text": [
"Auto-Sembly"
],
"answer_start": [
412
]
} |
5730221db2c2fd1400568909 | Printed_circuit_board | During World War II, the development of the anti-aircraft proximity fuse required an electronic circuit that could withstand being fired from a gun, and could be produced in quantity. The Centralab Division of Globe Union submitted a proposal which met the requirements: a ceramic plate would be screenprinted with metal... | What company developed the first electronic circuit that could be mass produced and was durable enough to be fired from a gun? | {
"text": [
"Globe Union"
],
"answer_start": [
210
]
} |
5730221db2c2fd140056890a | Printed_circuit_board | During World War II, the development of the anti-aircraft proximity fuse required an electronic circuit that could withstand being fired from a gun, and could be produced in quantity. The Centralab Division of Globe Union submitted a proposal which met the requirements: a ceramic plate would be screenprinted with metal... | What was the plate used for anti-aircraft proximity fuses in World War II made out of? | {
"text": [
"ceramic"
],
"answer_start": [
273
]
} |
5730221db2c2fd140056890b | Printed_circuit_board | During World War II, the development of the anti-aircraft proximity fuse required an electronic circuit that could withstand being fired from a gun, and could be produced in quantity. The Centralab Division of Globe Union submitted a proposal which met the requirements: a ceramic plate would be screenprinted with metal... | Who was in charge of the Centralab Division of Globe Union when the PCB used in anti-aircraft fuses was invented? | {
"text": [
"Harry W. Rubinstein"
],
"answer_start": [
696
]
} |
5730221db2c2fd140056890c | Printed_circuit_board | During World War II, the development of the anti-aircraft proximity fuse required an electronic circuit that could withstand being fired from a gun, and could be produced in quantity. The Centralab Division of Globe Union submitted a proposal which met the requirements: a ceramic plate would be screenprinted with metal... | What award did Rubinstein win in 1984 for his contributions? | {
"text": [
"Cledo Brunetti Award"
],
"answer_start": [
782
]
} |
5730221db2c2fd140056890d | Printed_circuit_board | During World War II, the development of the anti-aircraft proximity fuse required an electronic circuit that could withstand being fired from a gun, and could be produced in quantity. The Centralab Division of Globe Union submitted a proposal which met the requirements: a ceramic plate would be screenprinted with metal... | Where did Harry Rubinstein attend college? | {
"text": [
"University of Wisconsin-Madison"
],
"answer_start": [
988
]
} |
57302364b2c2fd1400568927 | Printed_circuit_board | Originally, every electronic component had wire leads, and the PCB had holes drilled for each wire of each component. The components' leads were then passed through the holes and soldered to the PCB trace. This method of assembly is called through-hole construction. In 1949, Moe Abramson and Stanislaus F. Danko of the ... | What type of construction was originally used for all electronic components? | {
"text": [
"through-hole"
],
"answer_start": [
240
]
} |
57302364b2c2fd1400568928 | Printed_circuit_board | Originally, every electronic component had wire leads, and the PCB had holes drilled for each wire of each component. The components' leads were then passed through the holes and soldered to the PCB trace. This method of assembly is called through-hole construction. In 1949, Moe Abramson and Stanislaus F. Danko of the ... | In what year was the Auto-Sembly process created? | {
"text": [
"1949"
],
"answer_start": [
270
]
} |
57302364b2c2fd1400568929 | Printed_circuit_board | Originally, every electronic component had wire leads, and the PCB had holes drilled for each wire of each component. The components' leads were then passed through the holes and soldered to the PCB trace. This method of assembly is called through-hole construction. In 1949, Moe Abramson and Stanislaus F. Danko of the ... | Although two men developed the Auto-Sembly process, to whom was the patent officially granted? | {
"text": [
"U.S. Army"
],
"answer_start": [
539
]
} |
57302364b2c2fd140056892a | Printed_circuit_board | Originally, every electronic component had wire leads, and the PCB had holes drilled for each wire of each component. The components' leads were then passed through the holes and soldered to the PCB trace. This method of assembly is called through-hole construction. In 1949, Moe Abramson and Stanislaus F. Danko of the ... | What year was the patent for the Auto-Sembly process granted? | {
"text": [
"1956"
],
"answer_start": [
514
]
} |
57302364b2c2fd140056892b | Printed_circuit_board | Originally, every electronic component had wire leads, and the PCB had holes drilled for each wire of each component. The components' leads were then passed through the holes and soldered to the PCB trace. This method of assembly is called through-hole construction. In 1949, Moe Abramson and Stanislaus F. Danko of the ... | Which part of the Auto-Sembly manufacturing process is the most costly? | {
"text": [
"drilling holes"
],
"answer_start": [
887
]
} |
572fa78c04bcaa1900d76b55 | Greeks | Greek colonies and communities have been historically established on the shores of the Mediterranean Sea and Black Sea, but the Greek people have always been centered around the Aegean and Ionian seas, where the Greek language has been spoken since the Bronze Age. Until the early 20th century, Greeks were distributed b... | When was the emergence of the Greek spoken dialect believed to have started ? | {
"text": [
"the Greek language has been spoken since the Bronze Age."
],
"answer_start": [
208
]
} |
572fa95304bcaa1900d76b70 | Greeks | The evolution of Proto-Greek should be considered within the context of an early Paleo-Balkan sprachbund that makes it difficult to delineate exact boundaries between individual languages. The characteristically Greek representation of word-initial laryngeals by prothetic vowels is shared, for one, by the Armenian lang... | What is commonly seen in the Greek language that is not a constant ? | {
"text": [
"The characteristically Greek representation of word-initial laryngeals by prothetic vowels"
],
"answer_start": [
189
]
} |
572fab80947a6a140053cb44 | Greeks | Around 1200 BC, the Dorians, another Greek-speaking people, followed from Epirus. Traditionally, historians have believed that the Dorian invasion caused the collapse of the Mycenaean civilization, but it is likely the main attack was made by seafaring raiders (sea peoples) who sailed into the eastern Mediterranean aro... | What group of people came with others who left the geographical and historical region in southeastern Europe, now a mutual region between Greece and Albania ? | {
"text": [
"the Dorians"
],
"answer_start": [
16
]
} |
572fab80947a6a140053cb45 | Greeks | Around 1200 BC, the Dorians, another Greek-speaking people, followed from Epirus. Traditionally, historians have believed that the Dorian invasion caused the collapse of the Mycenaean civilization, but it is likely the main attack was made by seafaring raiders (sea peoples) who sailed into the eastern Mediterranean aro... | When did these groups make the migration ? | {
"text": [
"Around 1200 BC"
],
"answer_start": [
0
]
} |
572fab80947a6a140053cb46 | Greeks | Around 1200 BC, the Dorians, another Greek-speaking people, followed from Epirus. Traditionally, historians have believed that the Dorian invasion caused the collapse of the Mycenaean civilization, but it is likely the main attack was made by seafaring raiders (sea peoples) who sailed into the eastern Mediterranean aro... | What civilization is the group credited with putting an end to ? | {
"text": [
"the Mycenaean civilization,"
],
"answer_start": [
170
]
} |
572faeefa23a5019007fc891 | Greeks | The Greeks of classical antiquity idealized their Mycenaean ancestors and the Mycenaean period as a glorious era of heroes, closeness of the gods and material wealth. The Homeric Epics (i.e. Iliad and Odyssey) were especially and generally accepted as part of the Greek past and it was not until the 19th century that sc... | How did the Greeks look upon their forebears ? | {
"text": [
"Greeks of classical antiquity idealized their Mycenaean ancestors"
],
"answer_start": [
4
]
} |
572faeefa23a5019007fc894 | Greeks | The Greeks of classical antiquity idealized their Mycenaean ancestors and the Mycenaean period as a glorious era of heroes, closeness of the gods and material wealth. The Homeric Epics (i.e. Iliad and Odyssey) were especially and generally accepted as part of the Greek past and it was not until the 19th century that sc... | Who was the author of these tales ? | {
"text": [
"Homer"
],
"answer_start": [
345
]
} |
572faeefa23a5019007fc895 | Greeks | The Greeks of classical antiquity idealized their Mycenaean ancestors and the Mycenaean period as a glorious era of heroes, closeness of the gods and material wealth. The Homeric Epics (i.e. Iliad and Odyssey) were especially and generally accepted as part of the Greek past and it was not until the 19th century that sc... | What were the names of some of the figures for the established religion that are based on ancestral ties ? | {
"text": [
"Zeus, Poseidon and Hades"
],
"answer_start": [
477
]
} |
572fb178a23a5019007fc8ac | Greeks | The ethnogenesis of the Greek nation is linked to the development of Pan-Hellenism in the 8th century BC. According to some scholars, the foundational event was the Olympic Games in 776 BC, when the idea of a common Hellenism among the Greek tribes was first translated into a shared cultural experience and Hellenism wa... | When did this event occur ? | {
"text": [
"development of Pan-Hellenism in the 8th century BC."
],
"answer_start": [
54
]
} |
572fb178a23a5019007fc8ad | Greeks | The ethnogenesis of the Greek nation is linked to the development of Pan-Hellenism in the 8th century BC. According to some scholars, the foundational event was the Olympic Games in 776 BC, when the idea of a common Hellenism among the Greek tribes was first translated into a shared cultural experience and Hellenism wa... | What national sporting event was held during this time period still goes on in celebration today ? | {
"text": [
"the foundational event was the Olympic Games in 776 BC,"
],
"answer_start": [
134
]
} |
572fb178a23a5019007fc8af | Greeks | The ethnogenesis of the Greek nation is linked to the development of Pan-Hellenism in the 8th century BC. According to some scholars, the foundational event was the Olympic Games in 776 BC, when the idea of a common Hellenism among the Greek tribes was first translated into a shared cultural experience and Hellenism wa... | What famous spiritual guide and God was a devotional temple made to in the 8th century ? | {
"text": [
"Oracle of Apollo at Delphi"
],
"answer_start": [
546
]
} |
572fb550a23a5019007fc8d1 | Greeks | In any case, Alexander's toppling of the Achaemenid Empire, after his victories at the battles of the Granicus, Issus and Gaugamela, and his advance as far as modern-day Pakistan and Tajikistan, provided an important outlet for Greek culture, via the creation of colonies and trade routes along the way. While the Alexan... | What Macedonian ruler helped to advance Greek beliefs and ways of life ? | {
"text": [
"Alexander"
],
"answer_start": [
13
]
} |
572fb550a23a5019007fc8d3 | Greeks | In any case, Alexander's toppling of the Achaemenid Empire, after his victories at the battles of the Granicus, Issus and Gaugamela, and his advance as far as modern-day Pakistan and Tajikistan, provided an important outlet for Greek culture, via the creation of colonies and trade routes along the way. While the Alexan... | What types of cities did the expansion of the great ruler inspire ? | {
"text": [
"Hellenistic cities"
],
"answer_start": [
597
]
} |
572fb550a23a5019007fc8d5 | Greeks | In any case, Alexander's toppling of the Achaemenid Empire, after his victories at the battles of the Granicus, Issus and Gaugamela, and his advance as far as modern-day Pakistan and Tajikistan, provided an important outlet for Greek culture, via the creation of colonies and trade routes along the way. While the Alexan... | Name a city that the Greeks nested in ? | {
"text": [
"cities like Alexandria, Antioch and Seleucia."
],
"answer_start": [
609
]
} |
572fb70e947a6a140053cbd7 | Greeks | This age saw the Greeks move towards larger cities and a reduction in the importance of the city-state. These larger cities were parts of the still larger Kingdoms of the Diadochi. Greeks, however, remained aware of their past, chiefly through the study of the works of Homer and the classical authors. An important fact... | What did the Greeks wants to be imparted to their descendants ? | {
"text": [
"the transmission of the Hellenic paideia to the next generation."
],
"answer_start": [
551
]
} |
572fb85804bcaa1900d76c31 | Greeks | In the religious sphere, this was a period of profound change. The spiritual revolution that took place, saw a waning of the old Greek religion, whose decline beginning in the 3rd century BC continued with the introduction of new religious movements from the East. The cults of deities like Isis and Mithra were introduc... | When did the religions of the past begin to dissipate ? | {
"text": [
"decline beginning in the 3rd century BC"
],
"answer_start": [
151
]
} |
572fb85804bcaa1900d76c32 | Greeks | In the religious sphere, this was a period of profound change. The spiritual revolution that took place, saw a waning of the old Greek religion, whose decline beginning in the 3rd century BC continued with the introduction of new religious movements from the East. The cults of deities like Isis and Mithra were introduc... | What encouraged the change of faith ? | {
"text": [
"with the introduction of new religious movements from the East."
],
"answer_start": [
201
]
} |
572fb85804bcaa1900d76c34 | Greeks | In the religious sphere, this was a period of profound change. The spiritual revolution that took place, saw a waning of the old Greek religion, whose decline beginning in the 3rd century BC continued with the introduction of new religious movements from the East. The cults of deities like Isis and Mithra were introduc... | What group was significant in the expansion of the Christian faith ? | {
"text": [
"Hellenized East were instrumental in the spread of early Christianity"
],
"answer_start": [
379
]
} |
572fba31947a6a140053cbee | Greeks | Of the new eastern religions introduced into the Greek world, the most successful was Christianity. From the early centuries of the Common Era, the Greeks identified as Romaioi ("Romans"), by that time the name ‘Hellenes’ denoted pagans. While ethnic distinctions still existed in the Roman Empire, they became secondary... | What alternative name were the Greeks known by ? | {
"text": [
"the Greeks identified as Romaioi (\"Romans\")"
],
"answer_start": [
144
]
} |
572fba31947a6a140053cbef | Greeks | Of the new eastern religions introduced into the Greek world, the most successful was Christianity. From the early centuries of the Common Era, the Greeks identified as Romaioi ("Romans"), by that time the name ‘Hellenes’ denoted pagans. While ethnic distinctions still existed in the Roman Empire, they became secondary... | What did the label of Hellenes come to stand for during the Common Era of Greece ? | {
"text": [
"the name ‘Hellenes’ denoted pagans"
],
"answer_start": [
202
]
} |
572fba31947a6a140053cbf0 | Greeks | Of the new eastern religions introduced into the Greek world, the most successful was Christianity. From the early centuries of the Common Era, the Greeks identified as Romaioi ("Romans"), by that time the name ‘Hellenes’ denoted pagans. While ethnic distinctions still existed in the Roman Empire, they became secondary... | Did the Roman world consider one ethnocentric lineage to be a great concern ? | {
"text": [
"secondary to religious considerations"
],
"answer_start": [
311
]
} |
572fbc0804bcaa1900d76c41 | Greeks | The Eastern Roman Empire – today conventionally named the Byzantine Empire, a name not in use during its own time – became increasingly influenced by Greek culture after the 7th century, when Emperor Heraclius (AD 575 - 641) decided to make Greek the empire's official language. Certainly from then on, but likely earlie... | When did the Byzantine Kingdom come under the impact of the Greeks. | {
"text": [
"influenced by Greek culture after the 7th century,"
],
"answer_start": [
136
]
} |
572fbc0804bcaa1900d76c42 | Greeks | The Eastern Roman Empire – today conventionally named the Byzantine Empire, a name not in use during its own time – became increasingly influenced by Greek culture after the 7th century, when Emperor Heraclius (AD 575 - 641) decided to make Greek the empire's official language. Certainly from then on, but likely earlie... | Who ruled Rome during this time period ? | {
"text": [
"Emperor Heraclius (AD 575 - 641)"
],
"answer_start": [
192
]
} |
572fbc0804bcaa1900d76c43 | Greeks | The Eastern Roman Empire – today conventionally named the Byzantine Empire, a name not in use during its own time – became increasingly influenced by Greek culture after the 7th century, when Emperor Heraclius (AD 575 - 641) decided to make Greek the empire's official language. Certainly from then on, but likely earlie... | What decision did he make that influenced the culture in an attempt to make things more homogeneous ? | {
"text": [
"decided to make Greek the empire's official language."
],
"answer_start": [
225
]
} |
572fbc0804bcaa1900d76c45 | Greeks | The Eastern Roman Empire – today conventionally named the Byzantine Empire, a name not in use during its own time – became increasingly influenced by Greek culture after the 7th century, when Emperor Heraclius (AD 575 - 641) decided to make Greek the empire's official language. Certainly from then on, but likely earlie... | Who was favored by those who lived in the west and mainly used another form of well know verbal language ? | {
"text": [
"the Latin West started to favour the Franks"
],
"answer_start": [
685
]
} |
572fbf48a23a5019007fc942 | Greeks | A distinct Greek political identity re-emerged in the 11th century in educated circles and became more forceful after the fall of Constantinople to the Crusaders of the Fourth Crusade in 1204, so that when the empire was revived in 1261, it became in many ways a Greek national state. That new notion of nationhood engen... | When did the nation reestablish itself ? | {
"text": [
"empire was revived in 1261"
],
"answer_start": [
210
]
} |
572fbf48a23a5019007fc943 | Greeks | A distinct Greek political identity re-emerged in the 11th century in educated circles and became more forceful after the fall of Constantinople to the Crusaders of the Fourth Crusade in 1204, so that when the empire was revived in 1261, it became in many ways a Greek national state. That new notion of nationhood engen... | What was the specialty of great Pietho and what is famous for ? | {
"text": [
"philosopher Gemistus Pletho, who abandoned Christianity."
],
"answer_start": [
409
]
} |
572fbf48a23a5019007fc945 | Greeks | A distinct Greek political identity re-emerged in the 11th century in educated circles and became more forceful after the fall of Constantinople to the Crusaders of the Fourth Crusade in 1204, so that when the empire was revived in 1261, it became in many ways a Greek national state. That new notion of nationhood engen... | Which factoring war was on gong in 1828 and shares the of a previous scuttle ? ? | {
"text": [
"second Russo-Turkish War"
],
"answer_start": [
989
]
} |
572fc0c9b2c2fd14005683e5 | Greeks | Following the Fall of Constantinople on 29 May 1453, many Greeks sought better employment and education opportunities by leaving for the West, particularly Italy, Central Europe, Germany and Russia. Greeks are greatly credited for the European cultural revolution, later called, the Renaissance. In Greek-inhabited terri... | When did the emperor Constantine lose rule over in 1453 ? | {
"text": [
"Fall of Constantinople on 29 May 1453"
],
"answer_start": [
14
]
} |
572fc26a04bcaa1900d76c8d | Greeks | For those that remained under the Ottoman Empire's millet system, religion was the defining characteristic of national groups (milletler), so the exonym "Greeks" (Rumlar from the name Rhomaioi) was applied by the Ottomans to all members of the Orthodox Church, regardless of their language or ethnic origin. The Greek sp... | How were the population factions of the Ottoman Empire classified ? | {
"text": [
"religion was the defining characteristic of national groups"
],
"answer_start": [
66
]
} |
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