Daily Papers

The chips contained in any electronic device are manufactured over circular silicon wafers, which are monitored by inspection machines at different production stages. Inspection machines detect and locate any defect within the wafer and return a Wafer Defect Map (WDM), i.e., a list of the coordinates where defects lie, which can be considered a huge, sparse, and binary image. In normal conditions, wafers exhibit a small number of randomly distributed defects, while defects grouped in specific patterns might indicate known or novel categories of failures in the production line. Needless to say, a primary concern of semiconductor industries is to identify these patterns and intervene as soon as possible to restore normal production conditions. Here we address WDM monitoring as an open-set recognition problem to accurately classify WDM in known categories and promptly detect novel patterns. In particular, we propose a comprehensive pipeline for wafer monitoring based on a Submanifold Sparse Convolutional Network, a deep architecture designed to process sparse data at an arbitrary resolution, which is trained on the known classes. To detect novelties, we define an outlier detector based on a Gaussian Mixture Model fitted on the latent representation of the classifier. Our experiments on a real dataset of WDMs show that directly processing full-resolution WDMs by Submanifold Sparse Convolutions yields superior classification performance on known classes than traditional Convolutional Neural Networks, which require a preliminary binning to reduce the size of the binary images representing WDMs. Moreover, our solution outperforms state-of-the-art open-set recognition solutions in detecting novelties.

As the globalization of semiconductor design and manufacturing processes continues, the demand for defect detection during integrated circuit fabrication stages is becoming increasingly critical, playing a significant role in enhancing the yield of semiconductor products. Traditional wafer map defect pattern detection methods involve manual inspection using electron microscopes to collect sample images, which are then assessed by experts for defects. This approach is labor-intensive and inefficient. Consequently, there is a pressing need to develop a model capable of automatically detecting defects as an alternative to manual operations. In this paper, we propose a method that initially employs a pre-trained VAE model to obtain the fault distribution information of the wafer map. This information serves as guidance, combined with the original image set for semi-supervised model training. During the semi-supervised training, we utilize a teacher-student network for iterative learning. The model presented in this paper is validated on the benchmark dataset WM-811K wafer dataset. The experimental results demonstrate superior classification accuracy and detection performance compared to state-of-the-art models, fulfilling the requirements for industrial applications. Compared to the original architecture, we have achieved significant performance improvement.

Manufacturing wafers is an intricate task involving thousands of steps. Defect Pattern Recognition (DPR) of wafer maps is crucial to find the root cause of the issue and further improving the yield in the wafer foundry. Mixed-type DPR is much more complicated compared to single-type DPR due to varied spatial features, the uncertainty of defects, and the number of defects present. To accurately predict the number of defects as well as the types of defects, we propose a novel compact deformable convolutional transformer (DC Transformer). Specifically, DC Transformer focuses on the global features present in the wafer map by virtue of learnable deformable kernels and multi-head attention to the global features. The proposed method succinctly models the internal relationship between the wafer maps and the defects. DC Transformer is evaluated on a real dataset containing 38 defect patterns. Experimental results show that DC Transformer performs exceptionally well in recognizing both single and mixed-type defects. The proposed method outperforms the current state of the models by a considerable margin

Identifying defect patterns in a wafer map during manufacturing is crucial to find the root cause of the underlying issue and provides valuable insights on improving yield in the foundry. Currently used methods use deep neural networks to identify the defects. These methods are generally very huge and have significant inference time. They also require GPU support to efficiently operate. All these issues make these models not fit for on-line prediction in the manufacturing foundry. In this paper, we propose an extremely simple yet effective technique to extract features from wafer images. The proposed method is extremely fast, intuitive, and non-parametric while being explainable. The experiment results show that the proposed pipeline outperforms conventional deep learning models. Our feature extraction requires no training or fine-tuning while preserving the relative shape and location of data points as revealed by our interpretability analysis.

Manufacturing wafers is an intricate task involving thousands of steps. Defect Pattern Recognition (DPR) of wafer maps is crucial for determining the root cause of production defects, which may further provide insight for yield improvement in wafer foundry. During manufacturing, various defects may appear standalone in the wafer or may appear as different combinations. Identifying multiple defects in a wafer is generally harder compared to identifying a single defect. Recently, deep learning methods have gained significant traction in mixed-type DPR. However, the complexity of defects requires complex and large models making them very difficult to operate on low-memory embedded devices typically used in fabrication labs. Another common issue is the unavailability of labeled data to train complex networks. In this work, we propose an unsupervised training routine to distill the knowledge of complex pre-trained models to lightweight deployment-ready models. We empirically show that this type of training compresses the model without sacrificing accuracy despite being up to 10 times smaller than the teacher model. The compressed model also manages to outperform contemporary state-of-the-art models.

This survey paper offers a comprehensive review of methodologies utilizing machine learning (ML) classification techniques for identifying wafer defects in semiconductor manufacturing. Despite the growing body of research demonstrating the effectiveness of ML in wafer defect identification, there is a noticeable absence of comprehensive reviews on this subject. This survey attempts to fill this void by amalgamating available literature and providing an in-depth analysis of the advantages, limitations, and potential applications of various ML classification algorithms in the realm of wafer defect detection. An innovative taxonomy of methodologies that we present provides a detailed classification of algorithms into more refined categories and techniques. This taxonomy follows a three-tier structure, starting from broad methodology categories and ending with specific techniques. It aids researchers in comprehending the complex relationships between different algorithms and their techniques. We employ a rigorous empirical and experimental evaluation to rank these varying techniques. For the empirical evaluation, we assess techniques based on a set of five criteria. The experimental evaluation ranks the algorithms employing the same techniques, sub-categories, and categories. Also the paper illuminates the future prospects of ML classification techniques for wafer defect identification, underscoring potential advancements and opportunities for further research in this field

Shrinking pattern dimensions leads to an increased variety of defect types in semiconductor devices. This has spurred innovation in patterning approaches such as Directed self-assembly (DSA) for which no traditional, automatic defect inspection software exists. Machine Learning-based SEM image analysis has become an increasingly popular research topic for defect inspection with supervised ML models often showing the best performance. However, little research has been done on obtaining a dataset with high-quality labels for these supervised models. In this work, we propose a method for obtaining coherent and complete labels for a dataset of hexagonal contact hole DSA patterns while requiring minimal quality control effort from a DSA expert. We show that YOLOv8, a state-of-the-art neural network, achieves defect detection precisions of more than 0.9 mAP on our final dataset which best reflects DSA expert defect labeling expectations. We discuss the strengths and limitations of our proposed labeling approach and suggest directions for future work in data-centric ML-based defect inspection.

Defect inspection is paramount within the closed-loop manufacturing system. However, existing datasets for defect inspection often lack precision and semantic granularity required for practical applications. In this paper, we introduce the Defect Spectrum, a comprehensive benchmark that offers precise, semantic-abundant, and large-scale annotations for a wide range of industrial defects. Building on four key industrial benchmarks, our dataset refines existing annotations and introduces rich semantic details, distinguishing multiple defect types within a single image. Furthermore, we introduce Defect-Gen, a two-stage diffusion-based generator designed to create high-quality and diverse defective images, even when working with limited datasets. The synthetic images generated by Defect-Gen significantly enhance the efficacy of defect inspection models. Overall, The Defect Spectrum dataset demonstrates its potential in defect inspection research, offering a solid platform for testing and refining advanced models.

The usage of electronic devices increases, and becomes predominant in most aspects of life. Surface Mount Technology (SMT) is the most common industrial method for manufacturing electric devices in which electrical components are mounted directly onto the surface of a Printed Circuit Board (PCB). Although the expansion of electronic devices affects our lives in a productive way, failures or defects in the manufacturing procedure of those devices might also be counterproductive and even harmful in some cases. It is therefore desired and sometimes crucial to ensure zero-defect quality in electronic devices and their production. While traditional Image Processing (IP) techniques are not sufficient to produce a complete solution, other promising methods like Deep Learning (DL) might also be challenging for PCB inspection, mainly because such methods require big adequate datasets which are missing, not available or not updated in the rapidly growing field of PCBs. Thus, PCB inspection is conventionally performed manually by human experts. Unsupervised Learning (UL) methods may potentially be suitable for PCB inspection, having learning capabilities on the one hand, while not relying on large datasets on the other. In this paper, we introduce ChangeChip, an automated and integrated change detection system for defect detection in PCBs, from soldering defects to missing or misaligned electronic elements, based on Computer Vision (CV) and UL. We achieve good quality defect detection by applying an unsupervised change detection between images of a golden PCB (reference) and the inspected PCB under various setting. In this work, we also present CD-PCB, a synthesized labeled dataset of 20 pairs of PCB images for evaluation of defect detection algorithms.

Addressing the uncertainty and variability in the quality of 3D printed metals can further the wide spread use of this technology. Process mapping for new alloys is crucial for determining optimal process parameters that consistently produce acceptable printing quality. Process mapping is typically performed by conventional methods and is used for the design of experiments and ex situ characterization of printed parts. On the other hand, in situ approaches are limited because their observable features are limited and they require complex high-cost setups to obtain temperature measurements to boost accuracy. Our method relaxes these limitations by incorporating the temporal features of molten metal dynamics during laser-metal interactions using video vision transformers and high-speed imaging. Our approach can be used in existing commercial machines and can provide in situ process maps for efficient defect and variability quantification. The generalizability of the approach is demonstrated by performing cross-dataset evaluations on alloys with different compositions and intrinsic thermofluid properties.

To efficiently deploy strong, often pre-trained feature extractors, recent Industrial Anomaly Detection and Segmentation (IADS) methods process low-resolution images, e.g., 224x224 pixels, obtained by downsampling the original input images. However, while numerous industrial applications demand the identification of both large and small defects, downsampling the input image to a low resolution may hinder a method's ability to pinpoint tiny anomalies. We propose a novel Teacher--Student paradigm to leverage strong pre-trained features while processing high-resolution input images very efficiently. The core idea concerns training two shallow MLPs (the Students) by nominal images so as to mimic the mappings between the patch embeddings induced by the self-attention layers of a frozen vision Transformer (the Teacher). Indeed, learning these mappings sets forth a challenging pretext task that small-capacity models are unlikely to accomplish on out-of-distribution data such as anomalous images. Our method can spot anomalies from high-resolution images and runs way faster than competitors, achieving state-of-the-art performance on MVTec AD and the best segmentation results on VisA. We also propose novel evaluation metrics to capture robustness to defect size, i.e., the ability to preserve good localisation from large anomalies to tiny ones. Evaluating our method also by these metrics reveals its neatly superior performance.

Anomaly detection is a crucial process in industrial manufacturing and has made significant advancements recently. However, there is a large variance between the data used in the development and the data collected by the production environment. Therefore, we present the Texture-AD benchmark based on representative texture-based anomaly detection to evaluate the effectiveness of unsupervised anomaly detection algorithms in real-world applications. This dataset includes images of 15 different cloth, 14 semiconductor wafers and 10 metal plates acquired under different optical schemes. In addition, it includes more than 10 different types of defects produced during real manufacturing processes, such as scratches, wrinkles, color variations and point defects, which are often more difficult to detect than existing datasets. All anomalous areas are provided with pixel-level annotations to facilitate comprehensive evaluation using anomaly detection models. Specifically, to adapt to diverse products in automated pipelines, we present a new evaluation method and results of baseline algorithms. The experimental results show that Texture-AD is a difficult challenge for state-of-the-art algorithms. To our knowledge, Texture-AD is the first dataset to be devoted to evaluating industrial defect detection algorithms in the real world. The dataset is available at https://XXX.

In this study, we applied the PointRend (Point-based Rendering) method to semiconductor defect segmentation. PointRend is an iterative segmentation algorithm inspired by image rendering in computer graphics, a new image segmentation method that can generate high-resolution segmentation masks. It can also be flexibly integrated into common instance segmentation meta-architecture such as Mask-RCNN and semantic meta-architecture such as FCN. We implemented a model, termed as SEMI-PointRend, to generate precise segmentation masks by applying the PointRend neural network module. In this paper, we focus on comparing the defect segmentation predictions of SEMI-PointRend and Mask-RCNN for various defect types (line-collapse, single bridge, thin bridge, multi bridge non-horizontal). We show that SEMI-PointRend can outperforms Mask R-CNN by up to 18.8% in terms of segmentation mean average precision.

The most widely used method for obtaining high-quality two-dimensional materials is through mechanical exfoliation of bulk crystals. Manual identification of suitable flakes from the resulting random distribution of crystal thicknesses and sizes on a substrate is a time-consuming, tedious task. Here, we present a platform for fully automated scanning, detection, and classification of two-dimensional materials, the source code of which we make openly available. Our platform is designed to be accurate, reliable, fast, and versatile in integrating new materials, making it suitable for everyday laboratory work. The implementation allows fully automated scanning and analysis of wafers with an average inference time of 100 ms for images of 2.3 Mpixels. The developed detection algorithm is based on a combination of the flakes' optical contrast toward the substrate and their geometric shape. We demonstrate that it is able to detect the majority of exfoliated flakes of various materials, with an average recall (AR50) between 67% and 89%. We also show that the algorithm can be trained with as few as five flakes of a given material, which we demonstrate for the examples of few-layer graphene, WSe_2, MoSe_2, CrI_3, 1T-TaS_2 and hexagonal BN. Our platform has been tested over a two-year period, during which more than 10^6 images of multiple different materials were acquired by over 30 individual researchers.

Surface defects are a primary source of yield loss in manufacturing, yet existing anomaly detection methods often fail in real-world deployment due to limited and unrepresentative datasets. To overcome this, we introduce 3D-ADAM, a 3D Anomaly Detection in Additive Manufacturing dataset, that is the first large-scale, industry-relevant dataset for RGB+3D surface defect detection in additive manufacturing. 3D-ADAM comprises 14,120 high-resolution scans of 217 unique parts, captured with four industrial depth sensors, and includes 27,346 annotated defects across 12 categories along with 27,346 annotations of machine element features in 16 classes. 3D-ADAM is captured in a real industrial environment and as such reflects real production conditions, including variations in part placement, sensor positioning, lighting, and partial occlusion. Benchmarking state-of-the-art models demonstrates that 3D-ADAM presents substantial challenges beyond existing datasets. Validation through expert labelling surveys with industry partners further confirms its industrial relevance. By providing this benchmark, 3D-ADAM establishes a foundation for advancing robust 3D anomaly detection capable of meeting manufacturing demands.

Reliable anomaly detection in photovoltaic (PV) modules is critical for maintaining solar energy efficiency. However, developing robust computer vision models for PV inspection is constrained by the scarcity of large-scale, diverse, and balanced datasets. This study introduces PV-DDPM, a spatially conditioned denoising diffusion probabilistic model that generates anomalous electroluminescence (EL) images across four PV cell types: multi-crystalline silicon (multi-c-Si), mono-crystalline silicon (mono-c-Si), half-cut multi-c-Si, and interdigitated back contact (IBC) with dogbone interconnect. PV-DDPM enables controlled synthesis of single-defect and multi-defect scenarios by conditioning on binary masks representing structural features and defect positions. To the best of our knowledge, this is the first framework that jointly models multiple PV cell types while supporting simultaneous generation of diverse anomaly types. We also introduce E-SCDD, an enhanced version of the SCDD dataset, comprising 1,000 pixel-wise annotated EL images spanning 30 semantic classes, and 1,768 unlabeled synthetic samples. Quantitative evaluation shows our generated images achieve a Fréchet Inception Distance (FID) of 4.10 and Kernel Inception Distance (KID) of 0.0023 pm 0.0007 across all categories. Training the vision--language anomaly detection model AA-CLIP on E-SCDD, compared to the SCDD dataset, improves pixel-level AUC and average precision by 1.70 and 8.34 points, respectively.

Synthetic dataset generation in Computer Vision, particularly for industrial applications, is still underexplored. Industrial defect segmentation, for instance, requires highly accurate labels, yet acquiring such data is costly and time-consuming. To address this challenge, we propose a novel diffusion-based pipeline for generating high-fidelity industrial datasets with minimal supervision. Our approach conditions the diffusion model on enriched bounding box representations to produce precise segmentation masks, ensuring realistic and accurately localized defect synthesis. Compared to existing layout-conditioned generative methods, our approach improves defect consistency and spatial accuracy. We introduce two quantitative metrics to evaluate the effectiveness of our method and assess its impact on a downstream segmentation task trained on real and synthetic data. Our results demonstrate that diffusion-based synthesis can bridge the gap between artificial and real-world industrial data, fostering more reliable and cost-efficient segmentation models. The code is publicly available at https://github.com/covisionlab/diffusion_labeling.

Anomaly Detection and Segmentation (AD&S) is crucial for industrial quality control. While existing methods excel in generating anomaly scores for each pixel, practical applications require producing a binary segmentation to identify anomalies. Due to the absence of labeled anomalies in many real scenarios, standard practices binarize these maps based on some statistics derived from a validation set containing only nominal samples, resulting in poor segmentation performance. This paper addresses this problem by proposing a test time training strategy to improve the segmentation performance. Indeed, at test time, we can extract rich features directly from anomalous samples to train a classifier that can discriminate defects effectively. Our general approach can work downstream to any AD&S method that provides an anomaly score map as output, even in multimodal settings. We demonstrate the effectiveness of our approach over baselines through extensive experimentation and evaluation on MVTec AD and MVTec 3D-AD.

Detecting surface anomalies of industrial materials poses a significant challenge within a myriad of industrial manufacturing processes. In recent times, various methodologies have emerged, capitalizing on the advantages of employing a network pre-trained on natural images for the extraction of representative features. Subsequently, these features are subjected to processing through a diverse range of techniques including memory banks, normalizing flow, and knowledge distillation, which have exhibited exceptional accuracy. This paper revisits approaches based on pre-trained features by introducing a novel method centered on target-specific embedding. To capture the most representative features of the texture under consideration, we employ a variant of a contrastive training procedure that incorporates both artificially generated defective samples and anomaly-free samples during training. Exploiting the intrinsic properties of surfaces, we derived a meaningful representation from the defect-free samples during training, facilitating a straightforward yet effective calculation of anomaly scores. The experiments conducted on the MVTEC AD and TILDA datasets demonstrate the competitiveness of our approach compared to state-of-the-art methods.

To coupe with the difficulties in the process of inspection and classification of defects in Printed Circuit Board (PCB), other researchers have proposed many methods. However, few of them published their dataset before, which hindered the introduction and comparison of new methods. In this paper, we published a synthesized PCB dataset containing 1386 images with 6 kinds of defects for the use of detection, classification and registration tasks. Besides, we proposed a reference based method to inspect and trained an end-to-end convolutional neural network to classify the defects. Unlike conventional approaches that require pixel-by-pixel processing, our method firstly locate the defects and then classify them by neural networks, which shows superior performance on our dataset.

Quality control is of vital importance during electronics production. As the methods of producing electronic circuits improve, there is an increasing chance of solder defects during assembling the printed circuit board (PCB). Many technologies have been incorporated for inspecting failed soldering, such as X-ray imaging, optical imaging, and thermal imaging. With some advanced algorithms, the new technologies are expected to control the production quality based on the digital images. However, current algorithms sometimes are not accurate enough to meet the quality control. Specialists are needed to do a follow-up checking. For automated X-ray inspection, joint of interest on the X-ray image is located by region of interest (ROI) and inspected by some algorithms. Some incorrect ROIs deteriorate the inspection algorithm. The high dimension of X-ray images and the varying sizes of image dimensions also challenge the inspection algorithms. On the other hand, recent advances on deep learning shed light on image-based tasks and are competitive to human levels. In this paper, deep learning is incorporated in X-ray imaging based quality control during PCB quality inspection. Two artificial intelligence (AI) based models are proposed and compared for joint defect detection. The noised ROI problem and the varying sizes of imaging dimension problem are addressed. The efficacy of the proposed methods are verified through experimenting on a real-world 3D X-ray dataset. By incorporating the proposed methods, specialist inspection workload is largely saved.

Industrial anomaly detection achieves progress thanks to datasets such as MVTec-AD and VisA. However, they suf- fer from limitations in terms of the number of defect sam- ples, types of defects, and availability of real-world scenes. These constraints inhibit researchers from further exploring the performance of industrial detection with higher accuracy. To this end, we propose a new large-scale anomaly detection dataset called 3CAD, which is derived from real 3C produc- tion lines. Specifically, the proposed 3CAD includes eight different types of manufactured parts, totaling 27,039 high- resolution images labeled with pixel-level anomalies. The key features of 3CAD are that it covers anomalous regions of different sizes, multiple anomaly types, and the possibility of multiple anomalous regions and multiple anomaly types per anomaly image. This is the largest and first anomaly de- tection dataset dedicated to 3C product quality control for community exploration and development. Meanwhile, we in- troduce a simple yet effective framework for unsupervised anomaly detection: a Coarse-to-Fine detection paradigm with Recovery Guidance (CFRG). To detect small defect anoma- lies, the proposed CFRG utilizes a coarse-to-fine detection paradigm. Specifically, we utilize a heterogeneous distilla- tion model for coarse localization and then fine localiza- tion through a segmentation model. In addition, to better capture normal patterns, we introduce recovery features as guidance. Finally, we report the results of our CFRG frame- work and popular anomaly detection methods on the 3CAD dataset, demonstrating strong competitiveness and providing a highly challenging benchmark to promote the development of the anomaly detection field. Data and code are available: https://github.com/EnquanYang2022/3CAD.

Automated detection of defects in Printed Circuit Board (PCB) manufacturing using Solder Paste Inspection (SPI) and Automated Optical Inspection (AOI) machines can help improve operational efficiency and significantly reduce the need for manual intervention. In this paper, using SPI-extracted features of 6 million pins, we demonstrate a data-centric approach to train Machine Learning (ML) models to detect PCB defects at three stages of PCB manufacturing. The 6 million PCB pins correspond to 2 million components that belong to 15,387 PCBs. Using a base extreme gradient boosting (XGBoost) ML model, we iterate on the data pre-processing step to improve detection performance. Combining pin-level SPI features using component and PCB IDs, we developed training instances also at the component and PCB level. This allows the ML model to capture any inter-pin, inter-component, or spatial effects that may not be apparent at the pin level. Models are trained at the pin, component, and PCB levels, and the detection results from the different models are combined to identify defective components.

Printed Circuit Boards are the foundation for the functioning of any electronic device, and therefore are an essential component for various industries such as automobile, communication, computation, etc. However, one of the challenges faced by the PCB manufacturers in the process of manufacturing of the PCBs is the faulty placement of its components including missing components. In the present scenario the infrastructure required to ensure adequate quality of the PCB requires a lot of time and effort. The authors present a novel solution for detecting missing components and classifying them in a resourceful manner. The presented algorithm focuses on pixel theory and object detection, which has been used in combination to optimize the results from the given dataset.

Although recent methods have tried to introduce large multimodal models (LMMs) into industrial anomaly detection (IAD), their generalization in the IAD field is far inferior to that for general purposes. We summarize the main reasons for this gap into two aspects. On one hand, general-purpose LMMs lack cognition of defects in the visual modality, thereby failing to sufficiently focus on defect areas. Therefore, we propose to modify the AnyRes structure of the LLaVA model, providing the potential anomalous areas identified by existing IAD models to the LMMs. On the other hand, existing methods mainly focus on identifying defects by learning defect patterns or comparing with normal samples, yet they fall short of understanding the causes of these defects. Considering that the generation of defects is closely related to the manufacturing process, we propose a manufacturing-driven IAD paradigm. An instruction-tuning dataset for IAD (InstructIAD) and a data organization approach for Chain-of-Thought with manufacturing (CoT-M) are designed to leverage the manufacturing process for IAD. Based on the above two modifications, we present Triad, a novel LMM-based method incorporating an expert-guided region-of-interest tokenizer and manufacturing process for industrial anomaly detection. Extensive experiments show that our Triad not only demonstrates competitive performance against current LMMs but also achieves further improved accuracy when equipped with manufacturing processes. Source code, training data, and pre-trained models will be publicly available at https://github.com/tzjtatata/Triad.

Depth maps are widely used in feed-forward 3D Gaussian Splatting (3DGS) pipelines by unprojecting them into 3D point clouds for novel view synthesis. This approach offers advantages such as efficient training, the use of known camera poses, and accurate geometry estimation. However, depth discontinuities at object boundaries often lead to fragmented or sparse point clouds, degrading rendering quality -- a well-known limitation of depth-based representations. To tackle this issue, we introduce PM-Loss, a novel regularization loss based on a pointmap predicted by a pre-trained transformer. Although the pointmap itself may be less accurate than the depth map, it effectively enforces geometric smoothness, especially around object boundaries. With the improved depth map, our method significantly improves the feed-forward 3DGS across various architectures and scenes, delivering consistently better rendering results. Our project page: https://aim-uofa.github.io/PMLoss

Despite progress in vision-based inspection algorithms, real-world industrial challenges -- specifically in data availability, quality, and complex production requirements -- often remain under-addressed. We introduce the VISION Datasets, a diverse collection of 14 industrial inspection datasets, uniquely poised to meet these challenges. Unlike previous datasets, VISION brings versatility to defect detection, offering annotation masks across all splits and catering to various detection methodologies. Our datasets also feature instance-segmentation annotation, enabling precise defect identification. With a total of 18k images encompassing 44 defect types, VISION strives to mirror a wide range of real-world production scenarios. By supporting two ongoing challenge competitions on the VISION Datasets, we hope to foster further advancements in vision-based industrial inspection.

In industrial anomaly detection (IAD), accurately identifying defects amidst diverse anomalies and under varying imaging conditions remains a significant challenge. Traditional approaches often struggle with high false-positive rates, frequently misclassifying normal shadows and surface deformations as defects, an issue that becomes particularly pronounced in products with complex and intricate surface features. To address these challenges, we introduce PA-CLIP, a zero-shot anomaly detection method that reduces background noise and enhances defect detection through a pseudo-anomaly-based framework. The proposed method integrates a multiscale feature aggregation strategy for capturing detailed global and local information, two memory banks for distinguishing background information, including normal patterns and pseudo-anomalies, from true anomaly features, and a decision-making module designed to minimize false positives caused by environmental variations while maintaining high defect sensitivity. Demonstrated on the MVTec AD and VisA datasets, PA-CLIP outperforms existing zero-shot methods, providing a robust solution for industrial defect detection.

Being able to spot defective parts is a critical component in large-scale industrial manufacturing. A particular challenge that we address in this work is the cold-start problem: fit a model using nominal (non-defective) example images only. While handcrafted solutions per class are possible, the goal is to build systems that work well simultaneously on many different tasks automatically. The best performing approaches combine embeddings from ImageNet models with an outlier detection model. In this paper, we extend on this line of work and propose PatchCore, which uses a maximally representative memory bank of nominal patch-features. PatchCore offers competitive inference times while achieving state-of-the-art performance for both detection and localization. On the challenging, widely used MVTec AD benchmark PatchCore achieves an image-level anomaly detection AUROC score of up to 99.6%, more than halving the error compared to the next best competitor. We further report competitive results on two additional datasets and also find competitive results in the few samples regime.^* Work done during a research internship at Amazon AWS. Code: github.com/amazon-research/patchcore-inspection.

The presence of point defects such as vacancies plays an important role in material design. Here, we demonstrate that a graph neural network (GNN) model trained only on perfect materials can also be used to predict vacancy formation energies (E_{vac}) of defect structures without the need for additional training data. Such GNN-based predictions are considerably faster than density functional theory (DFT) calculations with reasonable accuracy and show the potential that GNNs are able to capture a functional form for energy predictions. To test this strategy, we developed a DFT dataset of 508 E_{vac} consisting of 3D elemental solids, alloys, oxides, nitrides, and 2D monolayer materials. We analyzed and discussed the applicability of such direct and fast predictions. We applied the model to predict 192494 E_{vac} for 55723 materials in the JARVIS-DFT database.

Point defects play a central role in driving the properties of materials. First-principles methods are widely used to compute defect energetics and structures, including at scale for high-throughput defect databases. However, these methods are computationally expensive, making machine-learning force fields (MLFFs) an attractive alternative for accelerating structural relaxations. Most existing MLFFs are based on graph neural networks (GNNs), which can suffer from oversmoothing and poor representation of long-range interactions. Both of these issues are especially of concern when modeling point defects. To address these challenges, we introduce the Accelerated Deep Atomic Potential Transformer (ADAPT), an MLFF that replaces graph representations with a direct coordinates-in-space formulation and explicitly considers all pairwise atomic interactions. Atoms are treated as tokens, with a Transformer encoder modeling their interactions. Applied to a dataset of silicon point defects, ADAPT achieves a roughly 33 percent reduction in both force and energy prediction errors relative to a state-of-the-art GNN-based model, while requiring only a fraction of the computational cost.

Statistics of grain sizes and orientations in metals correlate to the material's mechanical properties. Reproducing representative volume elements for further analysis of deformation and failure in metals, like 316L stainless steel, is particularly important due to their wide use in manufacturing goods today. Two approaches, initially created for video games, were considered for the procedural generation of representative grain microstructures. The first is the Wave Function Collapse (WFC) algorithm, and the second is constraint propagation and probabilistic inference through Markov Junior, a free and open-source software. This study aimed to investigate these two algorithms' effectiveness in using reference electron backscatter diffraction (EBSD) maps and recreating a statistically similar one that could be used in further research. It utilized two stainless steel EBSD maps as references to test both algorithms. First, the WFC algorithm was too constricting and, thus, incapable of producing images that resembled EBSDs. The second, MarkovJunior, was much more effective in creating a Voronoi tessellation that could be used to create an EBSD map in Python. When comparing the results between the reference and the generated EBSD, we discovered that the orientation and volume fractions were extremely similar. With the study, it was concluded that MarkovJunior is an effective machine learning tool that can reproduce representative grain microstructures.

Unsupervised texture anomaly detection has been a concerning topic in a vast amount of industrial processes. Patterned textures inspection, particularly in the context of fabric defect detection, is indeed a widely encountered use case. This task involves handling a diverse spectrum of colors and textile types, encompassing a wide range of fabrics. Given the extensive variability in colors, textures, and defect types, fabric defect detection poses a complex and challenging problem in the field of patterned textures inspection. In this article, we propose a knowledge distillation-based approach tailored specifically for addressing the challenge of unsupervised anomaly detection in textures resembling fabrics. Our method aims to redefine the recently introduced reverse distillation approach, which advocates for an encoder-decoder design to mitigate classifier bias and to prevent the student from reconstructing anomalies. In this study, we present a new reverse distillation technique for the specific task of fabric defect detection. Our approach involves a meticulous design selection that strategically highlights high-level features. To demonstrate the capabilities of our approach both in terms of performance and inference speed, we conducted a series of experiments on multiple texture datasets, including MVTEC AD, AITEX, and TILDA, alongside conducting experiments on a dataset acquired from a textile manufacturing facility. The main contributions of this paper are the following: a robust texture anomaly detector utilizing a reverse knowledge-distillation technique suitable for both anomaly detection and domain generalization and a novel dataset encompassing a diverse range of fabrics and defects.

Industry 4.0 has revolutionized manufacturing by driving digitalization and shifting the paradigm toward additive manufacturing (AM). Fused Deposition Modeling (FDM), a key AM technology, enables the creation of highly customized, cost-effective products with minimal material waste through layer-by-layer extrusion, posing a significant challenge to traditional subtractive methods. However, the susceptibility of material extrusion techniques to errors often requires expert intervention to detect and mitigate defects that can severely compromise product quality. While automated error detection and machine learning models exist, their generalizability across diverse 3D printer setups, firmware, and sensors is limited, and deep learning methods require extensive labeled datasets, hindering scalability and adaptability. To address these challenges, we present a process monitoring and control framework that leverages pre-trained Large Language Models (LLMs) alongside 3D printers to detect and address printing defects. The LLM evaluates print quality by analyzing images captured after each layer or print segment, identifying failure modes and querying the printer for relevant parameters. It then generates and executes a corrective action plan. We validated the effectiveness of the proposed framework in identifying defects by comparing it against a control group of engineers with diverse AM expertise. Our evaluation demonstrated that LLM-based agents not only accurately identify common 3D printing errors, such as inconsistent extrusion, stringing, warping, and layer adhesion, but also effectively determine the parameters causing these failures and autonomously correct them without any need for human intervention.

Emerging AI accelerators increasingly adopt wafer-scale manufacturing technologies, integrating hundreds of thousands of AI cores in a mesh architecture with large distributed on-chip memory (tens of GB in total) and ultra-high on-chip memory bandwidth (tens of PB/s). However, current LLM inference systems, optimized for shared memory architectures like GPUs, fail to exploit these accelerators fully. We introduce WaferLLM, the first wafer-scale LLM inference system. WaferLLM is guided by a novel PLMR model (pronounced as "Plummer") that captures the unique hardware characteristics of wafer-scale architectures. Leveraging this model, WaferLLM pioneers wafer-scale LLM parallelism, optimizing the utilization of hundreds of thousands of on-chip cores. It also introduces MeshGEMM and MeshGEMV, the first GEMM and GEMV implementations designed to scale effectively on wafer-scale accelerators. Evaluations show that WaferLLM achieves up to 200times higher accelerator utilization than state-of-the-art methods. Leveraging a wafer-scale accelerator (Cerebras WSE2), WaferLLM delivers GEMV operations 606times faster and 16times more energy-efficient than on an NVIDIA A100 GPU. For full LLM inference, WaferLLM achieves 10-20times speedups over A100 GPU clusters running SGLang and vLLM. These advantages are expected to grow as wafer-scale AI models, software, and hardware continue to mature. WaferLLM is open-sourced at https://github.com/MeshInfra/WaferLLM.

In recent years, Printed Circuit Boards (PCB) have become the backbone of a large number of consumer electronic devices leading to a surge in their production. This has made it imperative to employ automatic inspection systems to identify manufacturing defects in PCB before they are installed in the respective systems. An important task in this regard is the classification of defects as either true or pseudo defects, which decides if the PCB is to be re-manufactured or not. This work proposes a novel approach to detect most common defects in the PCBs. The problem has been approached by employing highly discriminative features based on multi-scale wavelet transform, which are further boosted by using a kernalized version of the support vector machines (SVM). A real world printed circuit board dataset has been used for quantitative analysis. Experimental results demonstrated the efficacy of the proposed method.

3D anomaly detection plays a crucial role in monitoring parts for localized inherent defects in precision manufacturing. Embedding-based and reconstruction-based approaches are among the most popular and successful methods. However, there are two major challenges to the practical application of the current approaches: 1) the embedded models suffer the prohibitive computational and storage due to the memory bank structure; 2) the reconstructive models based on the MAE mechanism fail to detect anomalies in the unmasked regions. In this paper, we propose R3D-AD, reconstructing anomalous point clouds by diffusion model for precise 3D anomaly detection. Our approach capitalizes on the data distribution conversion of the diffusion process to entirely obscure the input's anomalous geometry. It step-wisely learns a strict point-level displacement behavior, which methodically corrects the aberrant points. To increase the generalization of the model, we further present a novel 3D anomaly simulation strategy named Patch-Gen to generate realistic and diverse defect shapes, which narrows the domain gap between training and testing. Our R3D-AD ensures a uniform spatial transformation, which allows straightforwardly generating anomaly results by distance comparison. Extensive experiments show that our R3D-AD outperforms previous state-of-the-art methods, achieving 73.4% Image-level AUROC on the Real3D-AD dataset and 74.9% Image-level AUROC on the Anomaly-ShapeNet dataset with an exceptional efficiency.

Denoising diffusion models have enabled high-quality image generation and editing. We present a method to localize the desired edit region implicit in a text instruction. We leverage InstructPix2Pix (IP2P) and identify the discrepancy between IP2P predictions with and without the instruction. This discrepancy is referred to as the relevance map. The relevance map conveys the importance of changing each pixel to achieve the edits, and is used to to guide the modifications. This guidance ensures that the irrelevant pixels remain unchanged. Relevance maps are further used to enhance the quality of text-guided editing of 3D scenes in the form of neural radiance fields. A field is trained on relevance maps of training views, denoted as the relevance field, defining the 3D region within which modifications should be made. We perform iterative updates on the training views guided by rendered relevance maps from the relevance field. Our method achieves state-of-the-art performance on both image and NeRF editing tasks. Project page: https://ashmrz.github.io/WatchYourSteps/

Recent surface anomaly detection methods excel at identifying structural anomalies, such as dents and scratches, but struggle with logical anomalies, such as irregular or missing object components. The best-performing logical anomaly detection approaches rely on aggregated pretrained features or handcrafted descriptors (most often derived from composition maps), which discard spatial and semantic information, leading to suboptimal performance. We propose SALAD, a semantics-aware discriminative logical anomaly detection method that incorporates a newly proposed composition branch to explicitly model the distribution of object composition maps, consequently learning important semantic relationships. Additionally, we introduce a novel procedure for extracting composition maps that requires no hand-made labels or category-specific information, in contrast to previous methods. By effectively modelling the composition map distribution, SALAD significantly improves upon state-of-the-art methods on the standard benchmark for logical anomaly detection, MVTec LOCO, achieving an impressive image-level AUROC of 96.1%. Code: https://github.com/MaticFuc/SALAD