Daily Papers

Developing effective visual inspection models remains challenging due to the scarcity of defect data. While image generation models have been used to synthesize defect images, producing highly realistic defects remains difficult. We propose DefectFill, a novel method for realistic defect generation that requires only a few reference defect images. It leverages a fine-tuned inpainting diffusion model, optimized with our custom loss functions incorporating defect, object, and attention terms. It enables precise capture of detailed, localized defect features and their seamless integration into defect-free objects. Additionally, our Low-Fidelity Selection method further enhances the defect sample quality. Experiments show that DefectFill generates high-quality defect images, enabling visual inspection models to achieve state-of-the-art performance on the MVTec AD dataset.

Reliable anomaly detection in photovoltaic (PV) modules is critical for maintaining solar energy efficiency. However, developing robust computer vision models for PV inspection is constrained by the scarcity of large-scale, diverse, and balanced datasets. This study introduces PV-DDPM, a spatially conditioned denoising diffusion probabilistic model that generates anomalous electroluminescence (EL) images across four PV cell types: multi-crystalline silicon (multi-c-Si), mono-crystalline silicon (mono-c-Si), half-cut multi-c-Si, and interdigitated back contact (IBC) with dogbone interconnect. PV-DDPM enables controlled synthesis of single-defect and multi-defect scenarios by conditioning on binary masks representing structural features and defect positions. To the best of our knowledge, this is the first framework that jointly models multiple PV cell types while supporting simultaneous generation of diverse anomaly types. We also introduce E-SCDD, an enhanced version of the SCDD dataset, comprising 1,000 pixel-wise annotated EL images spanning 30 semantic classes, and 1,768 unlabeled synthetic samples. Quantitative evaluation shows our generated images achieve a Fréchet Inception Distance (FID) of 4.10 and Kernel Inception Distance (KID) of 0.0023 pm 0.0007 across all categories. Training the vision--language anomaly detection model AA-CLIP on E-SCDD, compared to the SCDD dataset, improves pixel-level AUC and average precision by 1.70 and 8.34 points, respectively.

In recent years, Printed Circuit Boards (PCB) have become the backbone of a large number of consumer electronic devices leading to a surge in their production. This has made it imperative to employ automatic inspection systems to identify manufacturing defects in PCB before they are installed in the respective systems. An important task in this regard is the classification of defects as either true or pseudo defects, which decides if the PCB is to be re-manufactured or not. This work proposes a novel approach to detect most common defects in the PCBs. The problem has been approached by employing highly discriminative features based on multi-scale wavelet transform, which are further boosted by using a kernalized version of the support vector machines (SVM). A real world printed circuit board dataset has been used for quantitative analysis. Experimental results demonstrated the efficacy of the proposed method.

Previous works for PCB defect detection based on image difference and image processing techniques have already achieved promising performance. However, they sometimes fall short because of the unaccounted defect patterns or over-sensitivity about some hyper-parameters. In this work, we design a deep model that accurately detects PCB defects from an input pair of a detect-free template and a defective tested image. A novel group pyramid pooling module is proposed to efficiently extract features of a large range of resolutions, which are merged by group to predict PCB defect of corresponding scales. To train the deep model, a dataset is established, namely DeepPCB, which contains 1,500 image pairs with annotations including positions of 6 common types of PCB defects. Experiment results validate the effectiveness and efficiency of the proposed model by achieving 98.6% mAP @ 62 FPS on DeepPCB dataset. This dataset is now available at: https://github.com/tangsanli5201/DeepPCB.

Manufacturing wafers is an intricate task involving thousands of steps. Defect Pattern Recognition (DPR) of wafer maps is crucial to find the root cause of the issue and further improving the yield in the wafer foundry. Mixed-type DPR is much more complicated compared to single-type DPR due to varied spatial features, the uncertainty of defects, and the number of defects present. To accurately predict the number of defects as well as the types of defects, we propose a novel compact deformable convolutional transformer (DC Transformer). Specifically, DC Transformer focuses on the global features present in the wafer map by virtue of learnable deformable kernels and multi-head attention to the global features. The proposed method succinctly models the internal relationship between the wafer maps and the defects. DC Transformer is evaluated on a real dataset containing 38 defect patterns. Experimental results show that DC Transformer performs exceptionally well in recognizing both single and mixed-type defects. The proposed method outperforms the current state of the models by a considerable margin

Artificial Intelligence (AI)-driven defect inspection is pivotal in industrial manufacturing. Yet, many methods, tailored to specific pipelines, grapple with diverse product portfolios and evolving processes. Addressing this, we present the Incremental Unified Framework (IUF), which can reduce the feature conflict problem when continuously integrating new objects in the pipeline, making it advantageous in object-incremental learning scenarios. Employing a state-of-the-art transformer, we introduce Object-Aware Self-Attention (OASA) to delineate distinct semantic boundaries. Semantic Compression Loss (SCL) is integrated to optimize non-primary semantic space, enhancing network adaptability for novel objects. Additionally, we prioritize retaining the features of established objects during weight updates. Demonstrating prowess in both image and pixel-level defect inspection, our approach achieves state-of-the-art performance, proving indispensable for dynamic and scalable industrial inspections. Our code will be released at https://github.com/jqtangust/IUF.

Due to scarcity of anomaly situations in the early manufacturing stage, an unsupervised anomaly detection (UAD) approach is widely adopted which only uses normal samples for training. This approach is based on the assumption that the trained UAD model will accurately reconstruct normal patterns but struggles with unseen anomalous patterns. To enhance the UAD performance, reconstruction-by-inpainting based methods have recently been investigated, especially on the masking strategy of suspected defective regions. However, there are still issues to overcome: 1) time-consuming inference due to multiple masking, 2) output inconsistency by random masking strategy, and 3) inaccurate reconstruction of normal patterns when the masked area is large. Motivated by this, we propose a novel reconstruction-by-inpainting method, dubbed Excision And Recovery (EAR), that features single deterministic masking based on the ImageNet pre-trained DINO-ViT and visual obfuscation for hint-providing. Experimental results on the MVTec AD dataset show that deterministic masking by pre-trained attention effectively cuts out suspected defective regions and resolve the aforementioned issues 1 and 2. Also, hint-providing by mosaicing proves to enhance the UAD performance than emptying those regions by binary masking, thereby overcomes issue 3. Our approach achieves a high UAD performance without any change of the neural network structure. Thus, we suggest that EAR be adopted in various manufacturing industries as a practically deployable solution.

Identifying defect patterns in a wafer map during manufacturing is crucial to find the root cause of the underlying issue and provides valuable insights on improving yield in the foundry. Currently used methods use deep neural networks to identify the defects. These methods are generally very huge and have significant inference time. They also require GPU support to efficiently operate. All these issues make these models not fit for on-line prediction in the manufacturing foundry. In this paper, we propose an extremely simple yet effective technique to extract features from wafer images. The proposed method is extremely fast, intuitive, and non-parametric while being explainable. The experiment results show that the proposed pipeline outperforms conventional deep learning models. Our feature extraction requires no training or fine-tuning while preserving the relative shape and location of data points as revealed by our interpretability analysis.

Genuine leather, such as the hides of cows, crocodiles, lizards and goats usually contain natural and artificial defects, like holes, fly bites, tick marks, veining, cuts, wrinkles and others. A traditional solution to identify the defects is by manual defect inspection, which involves skilled experts. It is time consuming and may incur a high error rate and results in low productivity. This paper presents a series of automatic image processing processes to perform the classification of leather defects by adopting deep learning approaches. Particularly, the leather images are first partitioned into small patches,then it undergoes a pre-processing technique, namely the Canny edge detection to enhance defect visualization. Next, artificial neural network (ANN) and convolutional neural network (CNN) are employed to extract the rich image features. The best classification result achieved is 80.3 %, evaluated on a data set that consists of 2000 samples. In addition, the performance metrics such as confusion matrix and Receiver Operating Characteristic (ROC) are reported to demonstrate the efficiency of the method proposed.

Unsupervised texture anomaly detection has been a concerning topic in a vast amount of industrial processes. Patterned textures inspection, particularly in the context of fabric defect detection, is indeed a widely encountered use case. This task involves handling a diverse spectrum of colors and textile types, encompassing a wide range of fabrics. Given the extensive variability in colors, textures, and defect types, fabric defect detection poses a complex and challenging problem in the field of patterned textures inspection. In this article, we propose a knowledge distillation-based approach tailored specifically for addressing the challenge of unsupervised anomaly detection in textures resembling fabrics. Our method aims to redefine the recently introduced reverse distillation approach, which advocates for an encoder-decoder design to mitigate classifier bias and to prevent the student from reconstructing anomalies. In this study, we present a new reverse distillation technique for the specific task of fabric defect detection. Our approach involves a meticulous design selection that strategically highlights high-level features. To demonstrate the capabilities of our approach both in terms of performance and inference speed, we conducted a series of experiments on multiple texture datasets, including MVTEC AD, AITEX, and TILDA, alongside conducting experiments on a dataset acquired from a textile manufacturing facility. The main contributions of this paper are the following: a robust texture anomaly detector utilizing a reverse knowledge-distillation technique suitable for both anomaly detection and domain generalization and a novel dataset encompassing a diverse range of fabrics and defects.

We introduce a Three-Dimensional Convolutional Variational Autoencoder (3D-CVAE) for automated anomaly detection in Electron Energy Loss Spectroscopy Spectrum Imaging (EELS-SI) data. Our approach leverages the full three-dimensional structure of EELS-SI data to detect subtle spectral anomalies while preserving both spatial and spectral correlations across the datacube. By employing negative log-likelihood loss and training on bulk spectra, the model learns to reconstruct bulk features characteristic of the defect-free material. In exploring methods for anomaly detection, we evaluated both our 3D-CVAE approach and Principal Component Analysis (PCA), testing their performance using Fe L-edge peak shifts designed to simulate material defects. Our results show that 3D-CVAE achieves superior anomaly detection and maintains consistent performance across various shift magnitudes. The method demonstrates clear bimodal separation between normal and anomalous spectra, enabling reliable classification. Further analysis verifies that lower dimensional representations are robust to anomalies in the data. While performance advantages over PCA diminish with decreasing anomaly concentration, our method maintains high reconstruction quality even in challenging, noise-dominated spectral regions. This approach provides a robust framework for unsupervised automated detection of spectral anomalies in EELS-SI data, particularly valuable for analyzing complex material systems.

In industrial anomaly detection (IAD), accurately identifying defects amidst diverse anomalies and under varying imaging conditions remains a significant challenge. Traditional approaches often struggle with high false-positive rates, frequently misclassifying normal shadows and surface deformations as defects, an issue that becomes particularly pronounced in products with complex and intricate surface features. To address these challenges, we introduce PA-CLIP, a zero-shot anomaly detection method that reduces background noise and enhances defect detection through a pseudo-anomaly-based framework. The proposed method integrates a multiscale feature aggregation strategy for capturing detailed global and local information, two memory banks for distinguishing background information, including normal patterns and pseudo-anomalies, from true anomaly features, and a decision-making module designed to minimize false positives caused by environmental variations while maintaining high defect sensitivity. Demonstrated on the MVTec AD and VisA datasets, PA-CLIP outperforms existing zero-shot methods, providing a robust solution for industrial defect detection.

Large Language Models (LLMs) excel at tasks like language processing, strategy games, and reasoning but struggle to build generalizable internal representations essential for adaptive decision-making in agents. For agents to effectively navigate complex environments, they must construct reliable world models. While LLMs perform well on specific benchmarks, they often fail to generalize, leading to brittle representations that limit their real-world effectiveness. Understanding how LLMs build internal world models is key to developing agents capable of consistent, adaptive behavior across tasks. We analyze OthelloGPT, a GPT-based model trained on Othello gameplay, as a controlled testbed for studying representation learning. Despite being trained solely on next-token prediction with random valid moves, OthelloGPT shows meaningful layer-wise progression in understanding board state and gameplay. Early layers capture static attributes like board edges, while deeper layers reflect dynamic tile changes. To interpret these representations, we compare Sparse Autoencoders (SAEs) with linear probes, finding that SAEs offer more robust, disentangled insights into compositional features, whereas linear probes mainly detect features useful for classification. We use SAEs to decode features related to tile color and tile stability, a previously unexamined feature that reflects complex gameplay concepts like board control and long-term planning. We study the progression of linear probe accuracy and tile color using both SAE's and linear probes to compare their effectiveness at capturing what the model is learning. Although we begin with a smaller language model, OthelloGPT, this study establishes a framework for understanding the internal representations learned by GPT models, transformers, and LLMs more broadly. Our code is publicly available: https://github.com/ALT-JS/OthelloSAE.