Daily Papers

As is intrinsic to the fundamental goal of quantum computing, classical simulation of quantum algorithms is notoriously demanding in resource requirements. Nonetheless, simulation is critical to the success of the field and a requirement for algorithm development and validation, as well as hardware design. GPU-acceleration has become standard practice for simulation, and due to the exponential scaling inherent in classical methods, multi-GPU simulation can be required to achieve representative system sizes. In this case, inter-GPU communications can bottleneck performance. In this work, we present the introduction of MPI into the QED-C Application-Oriented Benchmarks to facilitate benchmarking on HPC systems. We review the advances in interconnect technology and the APIs for multi-GPU communication. We benchmark using a variety of interconnect paths, including the recent NVIDIA Grace Blackwell NVL72 architecture that represents the first product to expand high-bandwidth GPU-specialized interconnects across multiple nodes. We show that while improvements to GPU architecture have led to speedups of over 4.5X across the last few generations of GPUs, advances in interconnect performance have had a larger impact with over 16X performance improvements in time to solution for multi-GPU simulations.

Superconducting Digital (SCD) technology offers significant potential for enhancing the performance of next generation large scale compute workloads. By leveraging advanced lithography and a 300 mm platform, SCD devices can reduce energy consumption and boost computational power. This paper presents a cross-layer modeling approach to evaluate the system-level performance benefits of SCD architectures for Large Language Model (LLM) training and inference. Our findings, based on experimental data and Pulse Conserving Logic (PCL) design principles, demonstrate substantial performance gain in both training and inference. We are, thus, able to convincingly show that the SCD technology can address memory and interconnect limitations of present day solutions for next-generation compute systems.

Understanding Quantum Technologies 2025 is the 8th update of a free open science ebook that provides a 360 degrees overview of quantum technologies from science and technology to geopolitical and societal issues. It covers quantum physics history, quantum physics 101, gate-based quantum computing, quantum computing engineering (including quantum error corrections, quantum computing energetics and a new subsection of the effects of the Lieb-Robinson limit), quantum computing hardware (all qubit types, including quantum annealing and quantum simulation paradigms, history, science, research, implementation and vendors scientific and engineering approaches and roadmaps), quantum enabling technologies (cryogenics, control electronics, photonics, components fabs and manufacturing process, raw materials), unconventional computing (potential alternatives to quantum and classical computing), quantum computing algorithms, software development tools, resource estimate and benchmark tools, use case and case studies analysis methodologies, application use cases per market, quantum communications and cryptography (including QKD, PQC and QPU interconnect technologies), quantum sensing, quantum technologies around the world, quantum technologies societal impact and even quantum fake sciences. The main audience are computer science engineers, developers and IT specialists as well as quantum scientists and students who want to acquire a global view of how quantum technologies work, and particularly quantum computing. This version is an update to the 2024, 2023, 2022, and 2021 editions published respectively in October 2024, 2023, 2022 and 2021. An update log is provided at the end of the book.

This paper explores the potential of cryogenic semiconductor computing and superconductor electronics as promising alternatives to traditional semiconductor devices. As semiconductor devices face challenges such as increased leakage currents and reduced performance at higher temperatures, these novel technologies offer high performance and low power computation. Conventional semiconductor electronics operating at cryogenic temperatures (below -150{\deg}C or 123.15 K) can benefit from reduced leakage currents and improved electron mobility. On the other hand, superconductor electronics, operating below 10 K, allow electrons to flow without resistance, offering the potential for ultra-low-power, high-speed computation. This study presents a comprehensive performance modeling and analysis of these technologies and provides insights into their potential benefits and limitations. We implement models of in-order and out-of-order cores operating at high clock frequencies associated with superconductor electronics and cryogenic semiconductor computing in gem5. We evaluate the performance of these components using workloads representative of real-world applications like NPB, SPEC CPU2006, and GAPBS. Our results show the potential speedups achievable by these components and the limitations posed by cache bandwidth. This work provides valuable insights into the performance implications and design trade-offs associated with cryogenic and superconductor technologies, laying the foundation for future research in this field using gem5.

The usage of electronic devices increases, and becomes predominant in most aspects of life. Surface Mount Technology (SMT) is the most common industrial method for manufacturing electric devices in which electrical components are mounted directly onto the surface of a Printed Circuit Board (PCB). Although the expansion of electronic devices affects our lives in a productive way, failures or defects in the manufacturing procedure of those devices might also be counterproductive and even harmful in some cases. It is therefore desired and sometimes crucial to ensure zero-defect quality in electronic devices and their production. While traditional Image Processing (IP) techniques are not sufficient to produce a complete solution, other promising methods like Deep Learning (DL) might also be challenging for PCB inspection, mainly because such methods require big adequate datasets which are missing, not available or not updated in the rapidly growing field of PCBs. Thus, PCB inspection is conventionally performed manually by human experts. Unsupervised Learning (UL) methods may potentially be suitable for PCB inspection, having learning capabilities on the one hand, while not relying on large datasets on the other. In this paper, we introduce ChangeChip, an automated and integrated change detection system for defect detection in PCBs, from soldering defects to missing or misaligned electronic elements, based on Computer Vision (CV) and UL. We achieve good quality defect detection by applying an unsupervised change detection between images of a golden PCB (reference) and the inspected PCB under various setting. In this work, we also present CD-PCB, a synthesized labeled dataset of 20 pairs of PCB images for evaluation of defect detection algorithms.

Correlated electron systems are among the centerpieces of modern condensed matter sciences, where many interesting physical phenomena, such as metal-insulator transition and high-Tc superconductivity appear. Recent efforts have been focused on electrostatic doping of such materials to probe the underlying physics without introducing disorder as well as to build field-effect transistors that may complement conventional semiconductor metal-oxide-semiconductor field effect transistor (MOSFET) technology. This review focuses on metal-insulator transition mechanisms in correlated electron materials and three-terminal field effect devices utilizing such correlated oxides as the channel layer. We first describe how electron-disorder interaction, electron-phonon interaction and/or electron correlation in solids could modify the electronic properties of materials and lead to metal-insulator transitions. Then we analyze experimental efforts toward utilizing these transitions in field effect transistors and their underlying principles. It is pointed out that correlated electron systems show promise among these various materials displaying phase transitions for logic technologies. Furthermore, novel phenomena emerging from electronic correlation could enable new functionalities in field effect devices. We then briefly review unconventional electrostatic gating techniques, such as ionic liquid gating and ferroelectric gating, which enables ultra large carrier accumulation density in the correlated materials which could in turn lead to phase transitions. The review concludes with a brief discussion on the prospects and suggestions for future research directions in correlated oxide electronics for information processing.

Conventional semiconductor-based integrated circuits are gradually approaching fundamental scaling limits. Many prospective solutions have recently emerged to supplement or replace both the technology on which basic devices are built and the architecture of data processing. Neuromorphic circuits are a promising approach to computing where techniques used by the brain to achieve high efficiency are exploited. Many existing neuromorphic circuits rely on unconventional and useful properties of novel technologies to better mimic the operation of the brain. One such technology is single flux quantum (SFQ) logic -- a cryogenic superconductive technology in which the data are represented by quanta of magnetic flux (fluxons) produced and processed by Josephson junctions embedded within inductive loops. The movement of a fluxon within a circuit produces a quantized voltage pulse (SFQ pulse), resembling a neuronal spiking event. These circuits routinely operate at clock frequencies of tens to hundreds of gigahertz, making SFQ a natural technology for processing high frequency pulse trains. Prior proposals for SFQ neural networks often require energy-expensive fluxon conversions, involve heterogeneous technologies, or exclusively focus on device level behavior. In this paper, a design methodology for deep single flux quantum neuromorphic networks is presented. Synaptic and neuronal circuits based on SFQ technology are presented and characterized. Based on these primitives, a deep neuromorphic XOR network is evaluated as a case study, both at the architectural and circuit levels, achieving wide classification margins. The proposed methodology does not employ unconventional superconductive devices or semiconductor transistors. The resulting networks are tunable by an external current, making this proposed system an effective approach for scalable cryogenic neuromorphic computing.

Training large language models (LLMs) is known to be challenging because of the huge computational and memory capacity requirements. To address these issues, it is common to use a cluster of GPUs with 3D parallelism, which splits a model along the data batch, pipeline stage, and intra-layer tensor dimensions. However, the use of 3D parallelism produces the additional challenge of finding the optimal number of ways on each dimension and mapping the split models onto the GPUs. Several previous studies have attempted to automatically find the optimal configuration, but many of these lacked several important aspects. For instance, the heterogeneous nature of the interconnect speeds is often ignored. While the peak bandwidths for the interconnects are usually made equal, the actual attained bandwidth varies per link in real-world clusters. Combined with the critical path modeling that does not properly consider the communication, they easily fall into sub-optimal configurations. In addition, they often fail to consider the memory requirement per GPU, often recommending solutions that could not be executed. To address these challenges, we propose Pipette, which is an automatic fine-grained LLM training configurator for real-world clusters. By devising better performance models along with the memory estimator and fine-grained individual GPU assignment, Pipette achieves faster configurations that satisfy the memory constraints. We evaluated Pipette on large clusters to show that it provides a significant speedup over the prior art. The implementation of Pipette is available at https://github.com/yimjinkyu1/date2024_pipette.

Open-source EDA shows promising potential in unleashing EDA innovation and lowering the cost of chip design. This paper presents an open-source EDA project, iEDA, aiming for building a basic infrastructure for EDA technology evolution and closing the industrial-academic gap in the EDA area. iEDA now covers the whole flow of physical design (including Floorplan, Placement, CTS, Routing, Timing Optimization etc.), and part of the analysis tools (Static Timing Analysis and Power Analysis). To demonstrate the effectiveness of iEDA, we implement and tape out three chips of different scales (from 700k to 1.5M gates) on different process nodes (110nm and 28nm) with iEDA. iEDA is publicly available from the project home page http://ieda.oscc.cc.

Integrated circuits are a cornerstone of modern information technology, and analog wave-based architectures could enable fast and efficient processing beyond conventional charge electronics. In magnonics, spin waves provide a highly tunable, compact and energy-efficient medium for on-chip microwave signal transport and processing. However, progress has been limited to isolated elements or short devices, severely limiting the overall functional complexity and scalability. Here we realize the key elements of universal magnonic circuitry, using a single-step direct laser writing process in yttrium iron garnet, and monolithically cascade them in multi-stage programmable devices and networks. Using magneto-optical Kerr effect microscopy, we show efficient spin-wave propagation and preserved phase coherence in waveguide structures for hundreds of wavelengths. In coupled waveguides, we observe complete and periodic power transfer over several coupling lengths, and in phase shifters we achieve arbitrary, tunable phase delays. By cascading these elements, we realize programmable splitters, frequency demultiplexers, and phase-controlled 2x2 routers, where output power and relative phase can be programmed on demand via external fields. Finally, we realize programmable magnonic interferometric meshes for on-chip radio-frequency signal routing, with up to six magnonic inputs and outputs and seven cascaded stages, without the need for intermediate amplification. These direct-write cascaded networks bridge a long-standing gap in magnonic scalability, offering a viable pathway toward integrated, large-scale architectures for both classical and quantum processing.

The massive and large-scale design of foundational semiconductor integrated circuits (ICs) is crucial to sustaining the advancement of many emerging and future technologies, such as generative AI, 5G/6G, and quantum computing. Excitingly, recent studies have shown the great capabilities of foundational models in expediting the design of digital ICs. Yet, applying generative AI techniques to accelerate the design of analog ICs remains a significant challenge due to critical domain-specific issues, such as the lack of a comprehensive dataset and effective representation methods for analog circuits. This paper proposes, AnalogGenie, a textbf{Gen}erattextbf{i}ve textbf{e}ngine for automatic design/discovery of textbf{Analog} circuit topologies--the most challenging and creative task in the conventional manual design flow of analog ICs. AnalogGenie addresses two key gaps in the field: building a foundational comprehensive dataset of analog circuit topology and developing a scalable sequence-based graph representation universal to analog circuits. Experimental results show the remarkable generation performance of AnalogGenie in broadening the variety of analog ICs, increasing the number of devices within a single design, and discovering unseen circuit topologies far beyond any prior arts. Our work paves the way to transform the longstanding time-consuming manual design flow of analog ICs to an automatic and massive manner powered by generative AI. Our source code is available at https://github.com/xz-group/AnalogGenie.

Addressing the growing demands of artificial intelligence (AI) and data analytics requires new computing approaches. In this paper, we propose a reconfigurable hardware accelerator designed specifically for AI and data-intensive applications. Our architecture features a messaging-based intelligent computing scheme that allows for dynamic programming at runtime using a minimal instruction set. To assess our hardware's effectiveness, we conducted a case study in TSMC 28nm technology node. The simulation-based study involved analyzing a protein network using the computationally demanding PageRank algorithm. The results demonstrate that our hardware can analyze a 5,000-node protein network in just 213.6 milliseconds over 100 iterations. These outcomes signify the potential of our design to achieve cutting-edge performance in next-generation AI applications.

The integration of a complex set of Electronic Design Automation (EDA) tools to enhance interoperability is a critical concern for circuit designers. Recent advancements in large language models (LLMs) have showcased their exceptional capabilities in natural language processing and comprehension, offering a novel approach to interfacing with EDA tools. This research paper introduces ChatEDA, an autonomous agent for EDA empowered by a large language model, AutoMage, complemented by EDA tools serving as executors. ChatEDA streamlines the design flow from the Register-Transfer Level (RTL) to the Graphic Data System Version II (GDSII) by effectively managing task planning, script generation, and task execution. Through comprehensive experimental evaluations, ChatEDA has demonstrated its proficiency in handling diverse requirements, and our fine-tuned AutoMage model has exhibited superior performance compared to GPT-4 and other similar LLMs.

This work presents a novel monolithic 3D (M3D) FPGA architecture that leverages stackable back-end-of-line (BEOL) transistors to implement configuration memory and pass gates, significantly improving area, latency, and power efficiency. By integrating n-type (W-doped In_2O_3) and p-type (SnO) amorphous oxide semiconductor (AOS) transistors in the BEOL, Si SRAM configuration bits are substituted with a less leaky equivalent that can be programmed at logic-compatible voltages. BEOL-compatible AOS transistors are currently under extensive research and development in the device community, with investment by leading foundries, from which reported data is used to develop robust physics-based models in TCAD that enable circuit design. The use of AOS pass gates reduces the overhead of reconfigurable circuits by mapping FPGA switch block (SB) and connection block (CB) matrices above configurable logic blocks (CLBs), thereby increasing the proximity of logic elements and reducing latency. By interfacing with the latest Verilog-to-Routing (VTR) suite, an AOS-based M3D FPGA design implemented in 7 nm technology is demonstrated with 3.4x lower area-time squared product (AT^2), 27% lower critical path latency, and 26% lower reconfigurable routing block power on benchmarks including hyperdimensional computing and large language models (LLMs).

Exponential increases in scientific experimental data are outstripping the rate of progress in silicon technology. As a result, heterogeneous combinations of architectures and process or device technologies are increasingly important to meet the computing demands of future scientific experiments. However, the complexity of heterogeneous computing systems requires systematic modeling to understand performance. We present a model which addresses this need by framing key aspects of data collection pipelines and constraints, and combines them with the important vectors of technology that shape alternatives, computing metrics that allow complex alternatives to be compared. For instance, a data collection pipeline may be characterized by parameters such as sensor sampling rates, amount of data collected, and the overall relevancy of retrieved samples. Alternatives to this pipeline are enabled by hardware development vectors including advancing CMOS, GPUs, neuromorphic computing, and edge computing. By calculating metrics for each alternative such as overall F1 score, power, hardware cost, and energy expended per relevant sample, this model allows alternate data collection systems to be rigorously compared. To demonstrate this model's capability, we apply it to the CMS experiment (and planned HL-LHC upgrade) to evaluate and compare the application of novel technologies in the data acquisition system (DAQ). We demonstrate that improvements to early stages in the DAQ are highly beneficial, greatly reducing the resources required at later stages of processing (such as a 60% power reduction) and increasing the amount of relevant data retrieved from the experiment per unit power (improving from 0.065 to 0.31 samples/kJ) However, we predict further advances will be required in order to meet overall power and cost constraints for the DAQ.

Printed Circuit Board (PCB) schematic design plays an essential role in all areas of electronic industries. Unlike prior works that focus on digital or analog circuits alone, PCB design must handle heterogeneous digital, analog, and power signals while adhering to real-world IC packages and pin constraints. Automated PCB schematic design remains unexplored due to the scarcity of open-source data and the absence of simulation-based verification. We introduce PCBSchemaGen, the first training-free framework for PCB schematic design that comprises LLM agent and Constraint-guided synthesis. Our approach makes three contributions: 1. an LLM-based code generation paradigm with iterative feedback with domain-specific prompts. 2. a verification framework leveraging a real-world IC datasheet derived Knowledge Graph (KG) and Subgraph Isomorphism encoding pin-role semantics and topological constraints. 3. an extensive experiment on 23 PCB schematic tasks spanning digital, analog, and power domains. Results demonstrate that PCBSchemaGen significantly improves design accuracy and computational efficiency.

Recent advances in large language models have demonstrated their potential for automated generation of hardware description language (HDL) code from high-level prompts. Researchers have utilized fine-tuning to enhance the ability of these large language models (LLMs) in the field of Chip Design. However, the lack of Verilog data hinders further improvement in the quality of Verilog generation by LLMs. Additionally, the absence of a Verilog and Electronic Design Automation (EDA) script data augmentation framework significantly increases the time required to prepare the training dataset for LLM trainers. This paper proposes an automated design-data augmentation framework, which generates high-volume and high-quality natural language aligned with Verilog and EDA scripts. For Verilog generation, it translates Verilog files to an abstract syntax tree and then maps nodes to natural language with a predefined template. For Verilog repair, it uses predefined rules to generate the wrong verilog file and then pairs EDA Tool feedback with the right and wrong verilog file. For EDA Script generation, it uses existing LLM(GPT-3.5) to obtain the description of the Script. To evaluate the effectiveness of our data augmentation method, we finetune Llama2-13B and Llama2-7B models using the dataset generated by our augmentation framework. The results demonstrate a significant improvement in the Verilog generation tasks with LLMs. Moreover, the accuracy of Verilog generation surpasses that of the current state-of-the-art open-source Verilog generation model, increasing from 58.8% to 70.6% with the same benchmark. Our 13B model (ChipGPT-FT) has a pass rate improvement compared with GPT-3.5 in Verilog generation and outperforms in EDA script (i.e., SiliconCompiler) generation with only 200 EDA script data.

There can be numerous electronic components on a given PCB, making the task of visual inspection to detect defects very time-consuming and prone to error, especially at scale. There has thus been significant interest in automatic PCB component detection, particularly leveraging deep learning. However, deep neural networks typically require high computational resources, possibly limiting their feasibility in real-world use cases in manufacturing, which often involve high-volume and high-throughput detection with constrained edge computing resource availability. As a result of an exploration of efficient deep neural network architectures for this use case, we introduce PCBDet, an attention condenser network design that provides state-of-the-art inference throughput while achieving superior PCB component detection performance compared to other state-of-the-art efficient architecture designs. Experimental results show that PCBDet can achieve up to 2times inference speed-up on an ARM Cortex A72 processor when compared to an EfficientNet-based design while achieving sim2-4\% higher mAP on the FICS-PCB benchmark dataset.

Superconductor electronics (SCE) is a promising complementary and beyond CMOS technology. However, despite its practical benefits, the realization of SCE logic faces a significant challenge due to the absence of dense and scalable nonvolatile memory designs. While various nonvolatile memory technologies, including Non-destructive readout, vortex transitional memory (VTM), and magnetic memory, have been explored, achieving a superconductor random-access memory (RAM) crossbar array remains challenging. This paper introduces a novel, nonvolatile, high-density, and scalable VTM cell design for SCE applications. Our proposed design addresses scaling issues while boasting zero static power consumption characteristics. Our design leverages current summation, enabling analog multiply-accumulate operations -an essential feature for many in-memory computational tasks. We demonstrate the efficacy of our approach with a 32 x 32 superconductor memory array operating at 20 GHz. This design effectively addresses scaling issues and utilizes current summation that can be used for analog multiply-accumulate operations. Additionally, we showcase the accumulation property of the memory through analog simulations conducted on an 8 x 8 superconductor crossbar array.

Over the past two decades, 2D materials have rapidly evolved into a diverse and expanding family of material platforms. Many members of this materials class have demonstrated their potential to deliver transformative impact on fundamental research and technological applications across different fields. In this roadmap, we provide an overview of the key aspects of 2D material research and development, spanning synthesis, properties and commercial applications. We specifically present roadmaps for high impact 2D materials, including graphene and its derivatives, transition metal dichalcogenides, MXenes as well as their heterostructures and moiré systems. The discussions are organized into thematic sections covering emerging research areas (e.g., twisted electronics, moiré nano-optoelectronics, polaritronics, quantum photonics, and neuromorphic computing), breakthrough applications in key technologies (e.g., 2D transistors, energy storage, electrocatalysis, filtration and separation, thermal management, flexible electronics, sensing, electromagnetic interference shielding, and composites) and other important topics (computational discovery of novel materials, commercialization and standardization). This roadmap focuses on the current research landscape, future challenges and scientific and technological advances required to address, with the intent to provide useful references for promoting the development of 2D materials.

We present a 380-520 GHz balanced superconductor-insulator-superconductor (SIS) mixer on a single silicon substrate. All radio-frequency (RF) circuit components are fabricated on a 9 μm thick membrane. The intermediate frequency (IF) is separately amplified and combined. The balanced mixer chip, using Nb/Al/Al_{2}O_{3}/Nb SIS junctions, is mounted in a tellurium copper waveguide block at 4.2 K using Au beam lead contacts. We find uncorrected minimum receiver double-sideband noise temperatures of 70 K and a noise suppression of up to 18 dB, measured within a 440-495 GHz RF and a 4-8 GHz IF bandwidth, representing state-of-the-art device performance.

Deep Neural Networks (DNN) have achieved state-of-the-art results in a wide range of tasks, with the best results obtained with large training sets and large models. In the past, GPUs enabled these breakthroughs because of their greater computational speed. In the future, faster computation at both training and test time is likely to be crucial for further progress and for consumer applications on low-power devices. As a result, there is much interest in research and development of dedicated hardware for Deep Learning (DL). Binary weights, i.e., weights which are constrained to only two possible values (e.g. -1 or 1), would bring great benefits to specialized DL hardware by replacing many multiply-accumulate operations by simple accumulations, as multipliers are the most space and power-hungry components of the digital implementation of neural networks. We introduce BinaryConnect, a method which consists in training a DNN with binary weights during the forward and backward propagations, while retaining precision of the stored weights in which gradients are accumulated. Like other dropout schemes, we show that BinaryConnect acts as regularizer and we obtain near state-of-the-art results with BinaryConnect on the permutation-invariant MNIST, CIFAR-10 and SVHN.

Printed Electronics (PE) feature distinct and remarkable characteristics that make them a prominent technology for achieving true ubiquitous computing. This is particularly relevant in application domains that require conformal and ultra-low cost solutions, which have experienced limited penetration of computing until now. Unlike silicon-based technologies, PE offer unparalleled features such as non-recurring engineering costs, ultra-low manufacturing cost, and on-demand fabrication of conformal, flexible, non-toxic, and stretchable hardware. However, PE face certain limitations due to their large feature sizes, that impede the realization of complex circuits, such as machine learning classifiers. In this work, we address these limitations by leveraging the principles of Approximate Computing and Bespoke (fully-customized) design. We propose an automated framework for designing ultra-low power Multilayer Perceptron (MLP) classifiers which employs, for the first time, a holistic approach to approximate all functions of the MLP's neurons: multiplication, accumulation, and activation. Through comprehensive evaluation across various MLPs of varying size, our framework demonstrates the ability to enable battery-powered operation of even the most intricate MLP architecture examined, significantly surpassing the current state of the art.

Pre-routing timing prediction has been recently studied for evaluating the quality of a candidate cell placement in chip design. It involves directly estimating the timing metrics for both pin-level (slack, slew) and edge-level (net delay, cell delay), without time-consuming routing. However, it often suffers from signal decay and error accumulation due to the long timing paths in large-scale industrial circuits. To address these challenges, we propose a two-stage approach. First, we propose global circuit training to pre-train a graph auto-encoder that learns the global graph embedding from circuit netlist. Second, we use a novel node updating scheme for message passing on GCN, following the topological sorting sequence of the learned graph embedding and circuit graph. This scheme residually models the local time delay between two adjacent pins in the updating sequence, and extracts the lookup table information inside each cell via a new attention mechanism. To handle large-scale circuits efficiently, we introduce an order preserving partition scheme that reduces memory consumption while maintaining the topological dependencies. Experiments on 21 real world circuits achieve a new SOTA R2 of 0.93 for slack prediction, which is significantly surpasses 0.59 by previous SOTA method. Code will be available at: https://github.com/Thinklab-SJTU/EDA-AI.

IR drop analysis is essential in physical chip design to ensure the power integrity of on-chip power delivery networks. Traditional Electronic Design Automation (EDA) tools have become slow and expensive as transistor density scales. Recent works have introduced machine learning (ML)-based methods that formulate IR drop analysis as an image prediction problem. These existing ML approaches fail to capture both local and long-range dependencies and ignore crucial geometrical and topological information from physical layouts and logical connectivity. To address these limitations, we propose GIF, a Generative IR drop Framework that uses both geometrical and topological information to generate IR drop images. GIF fuses image and graph features to guide a conditional diffusion process, producing high-quality IR drop images. For instance, On the CircuitNet-N28 dataset, GIF achieves 0.78 SSIM, 0.95 Pearson correlation, 21.77 PSNR, and 0.026 NMAE, outperforming prior methods. These results demonstrate that our framework, using diffusion based multimodal conditioning, reliably generates high quality IR drop images. This shows that IR drop analysis can effectively leverage recent advances in generative modeling when geometric layout features and logical circuit topology are jointly modeled. By combining geometry aware spatial features with logical graph representations, GIF enables IR drop analysis to benefit from recent advances in generative modeling for structured image generation.

Circuit link prediction, which identifies missing component connections from incomplete netlists, is crucial in analog circuit design automation. However, existing methods face three main challenges: 1) Insufficient use of topological patterns in circuit graphs reduces prediction accuracy; 2) Data scarcity due to the complexity of annotations hinders model generalization; 3) Limited adaptability to various netlist formats restricts model flexibility. We propose Graph Neural Networks Based Analog Circuit Link Prediction (GNN-ACLP), a graph neural networks (GNNs) based method featuring three innovations to tackle these challenges. First, we introduce the SEAL (learning from Subgraphs, Embeddings, and Attributes for Link prediction) framework and achieve port-level accuracy in circuit link prediction. Second, we propose Netlist Babel Fish, a netlist format conversion tool that leverages retrieval-augmented generation (RAG) with a large language model (LLM) to enhance the compatibility of netlist formats. Finally, we build a comprehensive dataset, SpiceNetlist, comprising 775 annotated circuits of 7 different types across 10 component classes. Experiments demonstrate accuracy improvements of 16.08% on SpiceNetlist, 11.38% on Image2Net, and 16.01% on Masala-CHAI compared to the baseline in intra-dataset evaluation, while maintaining accuracy from 92.05% to 99.07% in cross-dataset evaluation, demonstrating robust feature transfer capabilities. However, its linear computational complexity makes processing large-scale netlists challenging and requires future addressing.