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akumar33
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manufacturing

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Low O
molecular O
weight S-PARA
gelators O
can O
facilitate O
direct O
writing O
of O
epoxy S-MATE
resin O
. O
Low O
viscosity S-PRO
ink S-MATE
preparation O
. O
Processing-enabled O
manipulation O
of O
matrix O
morphology S-CONPRI
. O
Cured S-MANP
epoxy O
resin S-MATE
kinetically O
traps O
low O
molecular O
weight S-PARA
gelator O
. O
Direct O
writing O
a O
thermosetting O
resin S-MATE
typically O
requires O
a O
rheological S-PRO
modifier O
or O
peripheral O
reaction O
rate-modulating O
equipment S-MACEQ
to O
enable O
shape B-CONPRI
fidelity E-CONPRI
during O
parts O
fabrication S-MANP
. O
These O
low O
molecular O
weight S-PARA
gelators O
( O
LMWG S-CONPRI
) O
are O
thermally B-MANP
activated E-MANP
to O
produce O
sufficient O
yield B-PRO
stress E-PRO
for O
self-supporting S-FEAT
, O
reactive O
, O
physical O
gels O
. O
Physical O
gelation O
occurs O
by O
assembly S-MANP
of O
the O