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It O
is O
also O
shown O
that O
in O
ultrasonic B-MANP
additive I-MANP
manufacturing E-MANP
, O
the O
deposition B-PARA
rate E-PARA
is O
highest O
when O
the O
positions O
of O
the O
peak O
temperature S-PARA
and O
complete O
interfacial B-CONPRI
bonding E-CONPRI
coincide O
underneath O
the O
sonotrode S-MACEQ
. O
If O
the O
position O
of O
complete O
interfacial B-CONPRI
bonding E-CONPRI
leads O
the O
position O
of O
the O
peak O
temperature S-PARA
, O
there O
is O
excessive O
heating S-MANP
of O
the O
build S-PARA
, O
and O
the O
sonotrode S-MACEQ
velocity O
can O
be S-MATE
increased O
without O
degrading O
bond B-CONPRI
quality E-CONPRI
. O
Although O
Additive B-MANP
Manufacturing E-MANP
implementation O
is O
rapidly O
growing O
, O
industrial B-CONPRI
sectors E-CONPRI
are O
demanding O
an O
increase O
of O
manufactured S-CONPRI
part O
size O
which O
most O
extended O
processes S-CONPRI
, O
such O
as S-MATE
Selective O
Laser S-ENAT
Melting O
( O
SLM S-MANP