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akumar33
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manufacturing

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. O
The O
close O
agreement O
between O
the O
framework S-CONPRI
's O
predictions S-CONPRI
and O
the O
experimental B-CONPRI
data E-CONPRI
demonstrates O
that O
the O
surface B-CONPRI
asperities E-CONPRI
soften O
due O
to O
frictional O
heating S-MANP
, O
while O
acoustic B-CONPRI
softening I-CONPRI
effects E-CONPRI
are O
insignificant O
. O
The O
junction S-APPL
growth O
model S-CONPRI
is O
used O
to O
identify O
parameter S-CONPRI
sets O
for O
ultrasonic B-MANP
spot I-MANP
welding E-MANP
and O
ultrasonic B-MANP
additive I-MANP
manufacturing E-MANP
that O
maximize O
the O
weld B-PRO
strength E-PRO
while O
simultaneously O
minimizing O
the O
thermal O
excursion O
at O
the O
weld S-FEAT
interface S-CONPRI
. O
It O
is O
found O
that O
in O
ultrasonic B-MANP
spot I-MANP
welding E-MANP
, O
certain O
processing O
conditions O
can O
cause O
interfacial B-CONPRI
melting E-CONPRI
, O
although O
melting S-MANP
is O
not O
required O
to O
form O
strong O
bonds O
. O