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University (607)-592-1549 Work Cell |
Ithaca, New York 14853 (607)-342-1880 Personal Cell |
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From prk1 at sfu.ca Thu Jan 14 12:46:02 2010 |
From: prk1 at sfu.ca (Philip Kubik) |
Date: Thu, 14 Jan 2010 09:46:02 -0800 |
Subject: [labnetwork] Sputter Oxides & Metals in Same System? |
Message-ID: <5A457E7C3A2E488E965B2EC4B3B9FA6B@4dlabs.sfu.ca> |
We have a sputtering & evaporation system with 2 RF & 2 DC cathodes. To |
date, we have only sputtered metals but we are considering sputtering oxides |
as well. I wonder whether others think this is a good idea or not and what, |
if any, chamber cleaning and conditions procedures are used when switching |
between oxides & metals. Specifically, the metals currently used in the |
system are nickel, titanium, chromium, aluminum, & gold. The oxides that we |
are considering are SiO2, TiO2, ZnO, Al2O3, & ITO. |
I have heard that is not a good idea to sputter metals and oxides in the |
same system but I don't know the reasons for this. Also, I know that some |
labs have metals only & oxides only sputtering systems, whereas others have |
a sputtering system for both metals & oxides. My own experience is with a |
system in which SiO2, niobium, aluminum, & molybdenum were deposited. When |
metals were sputtered after SiO2 sputtering, there was a lot of arcing in |
the deposition chamber, which damaged the devices being fabricated on |
silicon wafers. Consequently, after oxide sputtering, the chamber was |
conditioned by oxygen glow discharge cleaning and a lengthy metal deposition |
until the arcing ceased. |
Any advice would be greatly appreciated. |
Regards, |
Philip Kubik |
_________________________ |
Philip Kubik, Ph.D. |
Cleanroom Engineer |
4D Labs, Simon Fraser University |
8888 University Dr. |
Burnaby, BC, Canada V5A 1S6 |
Office phone: 778-782-8026 |
Email: <mailto:Philip.Kubik at 4DLabs.ca> Kubik at 4DLabs.ca |
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From mcvittie at cis.Stanford.EDU Thu Jan 14 18:42:12 2010 |
From: mcvittie at cis.Stanford.EDU (Jim McVittie) |
Date: Thu, 14 Jan 2010 15:42:12 -0800 (PST) |
Subject: [labnetwork] Sputter Oxides & Metals in Same System? |
In-Reply-To: <5A457E7C3A2E488E965B2EC4B3B9FA6B@4dlabs.sfu.ca> |
Message-ID: <Pine.LNX.4.44.1001141540440.25565-100000@cis.Stanford.EDU> |
Hi, |
We have an AJA sputtering system with 5 confocal sputter guns and a single |
wafer holder in the center. The system is configured for sputtering up. We |
have no problem doing metals and dielectrics in the same system. The |
chimneys on the guns capture most of the stay deposition. In addition, we |
line the chamber walls with Al foil. We clean the chimneys by bead |
blasting during the weekly target change if they show flaking, and we |
change out the foil if it shows flaking. We do rf reactive sputtering, rf |
sputtering from dielectric targets and DC metal sputtering in the system. |
We have been doing this for 4 yrs with few problems. Once in a while we |
have to open the system up mid-week to bead blast a chimney, which has |
started flaking. |
Jim McVittie |
-------------------------------------------------------------- |
James (Jim) P. McVittie, Ph.D. Sr. Research Scientist |
Paul G. Allen Building Electrical Engineering |
Stanford Nanofabrication Facility jmcvittie at stanford.edu |
Stanford University Office: (650) 725-3640 |
Rm. 336X, 330 Serra Mall Lab: (650) 721-6834 |
Stanford, CA 94305-4075 Fax: (650) 723-4659 |
On Thu, 14 Jan 2010, Philip Kubik wrote: |
> We have a sputtering & evaporation system with 2 RF & 2 DC cathodes. To |
> date, we have only sputtered metals but we are considering sputtering oxides |
> as well. I wonder whether others think this is a good idea or not and what, |
> if any, chamber cleaning and conditions procedures are used when switching |
> between oxides & metals. Specifically, the metals currently used in the |
> system are nickel, titanium, chromium, aluminum, & gold. The oxides that we |
> are considering are SiO2, TiO2, ZnO, Al2O3, & ITO. |
> |
> I have heard that is not a good idea to sputter metals and oxides in the |
> same system but I don't know the reasons for this. Also, I know that some |
> labs have metals only & oxides only sputtering systems, whereas others have |
> a sputtering system for both metals & oxides. My own experience is with a |
> system in which SiO2, niobium, aluminum, & molybdenum were deposited. When |
> metals were sputtered after SiO2 sputtering, there was a lot of arcing in |
> the deposition chamber, which damaged the devices being fabricated on |
> silicon wafers. Consequently, after oxide sputtering, the chamber was |
> conditioned by oxygen glow discharge cleaning and a lengthy metal deposition |
> until the arcing ceased. |
> |
> Any advice would be greatly appreciated. |
> |
> Regards, |
> |
> Philip Kubik |
> |
> Philip Kubik, Ph.D. |
> Cleanroom Engineer |
> 4D Labs, Simon Fraser University |
> 8888 University Dr. |
> Burnaby, BC, Canada V5A 1S6 |
> Office phone: 778-782-8026 |
> |
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