srobertsphd/mit-labnetwork · Datasets at Hugging Face

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1 Research Circle
Niskayuna, NY 12309
518 312-5646
Robert.macdonald at ge.com
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From rober074 at umn.edu Fri Sep 1 14:38:36 2023
From: rober074 at umn.edu (Kevin Roberts)
Date: Fri, 1 Sep 2023 13:38:36 -0500
Subject: [labnetwork] Polish Si wafer edge
In-Reply-To: <DM6PR03MB3529D28785E8DF55E2A702F99EE4A@DM6PR03MB3529.namprd03.prod.outlook.com>
References: <DM6PR03MB3529D28785E8DF55E2A702F99EE4A@DM6PR03MB3529.namprd03.prod.outlook.com>
Message-ID: <CA+Bu-4o2PWX6Jx1iirm=Kxs-FjqNXm7+=8EFt27PnAc3pV5Otw@mail.gmail.com>
Bob,
At one point I was involved in making surgical scalpels from silicon, and
this required putting a beveled edge in silicon (15 or 20 degrees, just
like cutlery) and then chemically sharpening the edge. I would purchase
wafer dicing blades which had an angled edge to them instead of being flat.
I would get these blades from Thermoccarbon in Casselberry, FL. You could
ask them if they'd be willing to sell you some 45 degree'd blades; my guess
is they make these.
ThermoCarbon: https://dicing.com/
Regards,
Kevin
On Fri, Sep 1, 2023 at 11:38?AM Geil, Bob <bob.geil at unc.edu> wrote:
> We have a need to take standard Si wafers and polish them at 45 degrees on
> an edge. We want to couple in an infrared beam. Does anyone know how we
> might be able to achieve this?
>
> -Bob
>
> Technical Director ? CHANL
> Dept. of Chemistry ? UNC-CH
> 223 Chapman Hall, CB 3216
> Chapel Hill, NC 27599
> bob.geil at unc.edu <https://chanl.unc.edu/>
>
>
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork
>
--
Kevin Roberts
Staff Scientist
Minnesota Nano Center
University of Minnesota
140 Physics & Nanotechnology Bldg.
115 Union St. SE
Minneapolis, MN 55455
rober074 at umn.edu
612-624-7092 direct
612-625-5012 fax
http://www.mnc.umn.edu
<http://www.nnin.org/>
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From Peter.Lomax at ed.ac.uk Mon Sep 4 04:48:51 2023
From: Peter.Lomax at ed.ac.uk (Peter Lomax)
Date: Mon, 4 Sep 2023 08:48:51 +0000
Subject: [labnetwork] Your favorite wafer bonder
In-Reply-To: <8b74af41a50543b887ab30c1d0d26296@ge.com>
References: <8b74af41a50543b887ab30c1d0d26296@ge.com>
Message-ID: <PAVPR05MB99045F7DAD5FFF4AE9AD456DC8E9A@PAVPR05MB9904.eurprd05.prod.outlook.com>
Hi,
We have a circa 20 year old Karl Suss anodic bonder, which can also do fusion bonding. Generally works well, doesn't have any alignment capability but has some tooling so you can align in a Karl Suss mask aligner then transfer to the bonder.
If I could improve it I would make it easier for doing stacks of three wafers - this is an option for Karl Suss but expensive - we can sort of get round it with conducting copper tape.
Support has been OK but seems to need something almost every time it is used! Over the ast year has probably been used 20 times and just on the one project.
Cheers
Peter
From: labnetwork <labnetwork-bounces at mtl.mit.edu> On Behalf Of Macdonald, Robert (GE Aerospace, US)
Sent: 01 September 2023 19:24
To: labnetwork at mtl.mit.edu
Subject: [labnetwork] Your favorite wafer bonder
This email was sent to you by someone outside the University.
You should only click on links or attachments if you are certain that the email is genuine and the content is safe.
Wafer bonding has advanced a great deal in the last twenty years. Industrial tools have incorporated many improvements in wafer handing and process capabilities.
But many of the bonders I encounter in University labs have not incorporated all those improvements.
I am wondering: What wafer bonder are you using in your facility? What vintage is it? How much use does it get? What types of bonds are you supporting (anodic, fusion, frit, polymer, etc)? What improvements to these tools would you like to see?
Thanks,
Rob
Robert MacDonald
MEMS Engineer
GE Research
1 Research Circle
Niskayuna, NY 12309
518 312-5646
Robert.macdonald at ge.com<mailto:Robert.macdonald at ge.com>
The University of Edinburgh is a charitable body, registered in Scotland, with registration number SC005336. Is e buidheann carthannais a th' ann an Oilthigh Dh?n ?ideann, cl?raichte an Alba, ?ireamh cl?raidh SC005336.
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From sbyoo at ucdavis.edu Mon Sep 4 11:26:45 2023
From: sbyoo at ucdavis.edu (S. J. Ben Yoo)
Date: Mon, 4 Sep 2023 08:26:45 -0700
Subject: [labnetwork] Your favorite wafer bonder
In-Reply-To: <PAVPR05MB99045F7DAD5FFF4AE9AD456DC8E9A@PAVPR05MB9904.eurprd05.prod.outlook.com>

1 Research Circle

Niskayuna, NY 12309

518 312-5646

Robert.macdonald at ge.com

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From rober074 at umn.edu Fri Sep 1 14:38:36 2023

From: rober074 at umn.edu (Kevin Roberts)

Date: Fri, 1 Sep 2023 13:38:36 -0500

Subject: [labnetwork] Polish Si wafer edge

In-Reply-To: <DM6PR03MB3529D28785E8DF55E2A702F99EE4A@DM6PR03MB3529.namprd03.prod.outlook.com>

References: <DM6PR03MB3529D28785E8DF55E2A702F99EE4A@DM6PR03MB3529.namprd03.prod.outlook.com>

Message-ID: <CA+Bu-4o2PWX6Jx1iirm=Kxs-FjqNXm7+=8EFt27PnAc3pV5Otw@mail.gmail.com>

Bob,

At one point I was involved in making surgical scalpels from silicon, and

this required putting a beveled edge in silicon (15 or 20 degrees, just

like cutlery) and then chemically sharpening the edge. I would purchase

wafer dicing blades which had an angled edge to them instead of being flat.

I would get these blades from Thermoccarbon in Casselberry, FL. You could

ask them if they'd be willing to sell you some 45 degree'd blades; my guess

is they make these.

ThermoCarbon: https://dicing.com/

Regards,

Kevin

On Fri, Sep 1, 2023 at 11:38?AM Geil, Bob <bob.geil at unc.edu> wrote:

> We have a need to take standard Si wafers and polish them at 45 degrees on

> an edge. We want to couple in an infrared beam. Does anyone know how we

> might be able to achieve this?

>

> -Bob

>

> Technical Director ? CHANL

> Dept. of Chemistry ? UNC-CH

> 223 Chapman Hall, CB 3216

> Chapel Hill, NC 27599

> bob.geil at unc.edu <https://chanl.unc.edu/>

>

> _______________________________________________

> labnetwork mailing list

> labnetwork at mtl.mit.edu

> https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork

>

--

Kevin Roberts

Staff Scientist

Minnesota Nano Center

University of Minnesota

140 Physics & Nanotechnology Bldg.

115 Union St. SE

Minneapolis, MN 55455

rober074 at umn.edu

612-624-7092 direct

612-625-5012 fax

http://www.mnc.umn.edu

<http://www.nnin.org/>

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From Peter.Lomax at ed.ac.uk Mon Sep 4 04:48:51 2023

From: Peter.Lomax at ed.ac.uk (Peter Lomax)

Date: Mon, 4 Sep 2023 08:48:51 +0000

Subject: [labnetwork] Your favorite wafer bonder

In-Reply-To: <8b74af41a50543b887ab30c1d0d26296@ge.com>

References: <8b74af41a50543b887ab30c1d0d26296@ge.com>

Message-ID: <PAVPR05MB99045F7DAD5FFF4AE9AD456DC8E9A@PAVPR05MB9904.eurprd05.prod.outlook.com>

Hi,

We have a circa 20 year old Karl Suss anodic bonder, which can also do fusion bonding. Generally works well, doesn't have any alignment capability but has some tooling so you can align in a Karl Suss mask aligner then transfer to the bonder.

If I could improve it I would make it easier for doing stacks of three wafers - this is an option for Karl Suss but expensive - we can sort of get round it with conducting copper tape.

Support has been OK but seems to need something almost every time it is used! Over the ast year has probably been used 20 times and just on the one project.

Cheers

Peter

From: labnetwork <labnetwork-bounces at mtl.mit.edu> On Behalf Of Macdonald, Robert (GE Aerospace, US)

Sent: 01 September 2023 19:24

To: labnetwork at mtl.mit.edu

Subject: [labnetwork] Your favorite wafer bonder

This email was sent to you by someone outside the University.

You should only click on links or attachments if you are certain that the email is genuine and the content is safe.

Wafer bonding has advanced a great deal in the last twenty years. Industrial tools have incorporated many improvements in wafer handing and process capabilities.

But many of the bonders I encounter in University labs have not incorporated all those improvements.

I am wondering: What wafer bonder are you using in your facility? What vintage is it? How much use does it get? What types of bonds are you supporting (anodic, fusion, frit, polymer, etc)? What improvements to these tools would you like to see?

Thanks,

Rob

Robert MacDonald

MEMS Engineer

GE Research

1 Research Circle

Niskayuna, NY 12309

518 312-5646

Robert.macdonald at ge.com<mailto:Robert.macdonald at ge.com>

The University of Edinburgh is a charitable body, registered in Scotland, with registration number SC005336. Is e buidheann carthannais a th' ann an Oilthigh Dh?n ?ideann, cl?raichte an Alba, ?ireamh cl?raidh SC005336.

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From sbyoo at ucdavis.edu Mon Sep 4 11:26:45 2023

From: sbyoo at ucdavis.edu (S. J. Ben Yoo)

Date: Mon, 4 Sep 2023 08:26:45 -0700

Subject: [labnetwork] Your favorite wafer bonder

In-Reply-To: <PAVPR05MB99045F7DAD5FFF4AE9AD456DC8E9A@PAVPR05MB9904.eurprd05.prod.outlook.com>