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Metal S-MATE
foils O
with O
printed O
conductors S-MATE
and O
insulators S-MATE
were O
prepared O
separately O
from O
the O
UAM S-MANP
process S-CONPRI
thereby O
separating O
the O
electronics S-CONPRI
preparation O
from O
the O
part B-CONPRI
consolidation E-CONPRI
. O
A O
dual O
material S-MATE
polymer O
layer S-PARA
exhibited O
the O
best O
electrically S-CONPRI
insulating O
properties S-CONPRI
, O
while O
providing O
mechanical S-APPL
protection O
of O
printed B-MACEQ
conductive E-MACEQ
tracks O
stable O
up O
to O
100 O
°C O
. O
General O
design S-FEAT
and O
UAM S-MANP
process S-CONPRI
recommendations O
are O
given O
for O
3D S-CONPRI
embedded O
electronics S-CONPRI
in O
a O
metal B-CONPRI
matrix E-CONPRI
. O
Functionally B-MATE
graded I-MATE
metals E-MATE
fabricated S-CONPRI
using O
high-temperature O
additive B-MANP
manufacturing E-MANP
can O
form O
intermetallics S-MATE
that O
fracture S-CONPRI
during O
printing O
due O
to O
thermal B-PRO
stresses E-PRO
generated O
by O
the O
heat B-CONPRI
source E-CONPRI
. O