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43
|
|---|
Metal S-MATE
|
foils O
|
with O
|
printed O
|
conductors S-MATE
|
and O
|
insulators S-MATE
|
were O
|
prepared O
|
separately O
|
from O
|
the O
|
UAM S-MANP
|
process S-CONPRI
|
thereby O
|
separating O
|
the O
|
electronics S-CONPRI
|
preparation O
|
from O
|
the O
|
part B-CONPRI
|
consolidation E-CONPRI
|
. O
|
A O
|
dual O
|
material S-MATE
|
polymer O
|
layer S-PARA
|
exhibited O
|
the O
|
best O
|
electrically S-CONPRI
|
insulating O
|
properties S-CONPRI
|
, O
|
while O
|
providing O
|
mechanical S-APPL
|
protection O
|
of O
|
printed B-MACEQ
|
conductive E-MACEQ
|
tracks O
|
stable O
|
up O
|
to O
|
100 O
|
°C O
|
. O
|
General O
|
design S-FEAT
|
and O
|
UAM S-MANP
|
process S-CONPRI
|
recommendations O
|
are O
|
given O
|
for O
|
3D S-CONPRI
|
embedded O
|
electronics S-CONPRI
|
in O
|
a O
|
metal B-CONPRI
|
matrix E-CONPRI
|
. O
|
Functionally B-MATE
|
graded I-MATE
|
metals E-MATE
|
fabricated S-CONPRI
|
using O
|
high-temperature O
|
additive B-MANP
|
manufacturing E-MANP
|
can O
|
form O
|
intermetallics S-MATE
|
that O
|
fracture S-CONPRI
|
during O
|
printing O
|
due O
|
to O
|
thermal B-PRO
|
stresses E-PRO
|
generated O
|
by O
|
the O
|
heat B-CONPRI
|
source E-CONPRI
|
. O
|
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