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Embedded B-ENAT
electronics E-ENAT
and O
sensors S-MACEQ
are O
becoming O
increasingly O
important O
for O
the O
development O
of O
Industry B-ENAT
4.0 E-ENAT
. O
For O
small O
components S-MACEQ
, O
space O
constraints O
lead S-MATE
to O
full O
3D B-CONPRI
integration E-CONPRI
requirements O
that O
are O
only O
achievable O
through O
Additive B-MANP
Manufacturing E-MANP
. O
Manufacturing S-MANP
metal O
components S-MACEQ
usually O
require O
high O
temperatures S-PARA
incompatible O
with O
electronics S-CONPRI
but O
Ultrasonic B-MANP
Additive I-MANP
Manufacturing E-MANP
( O
UAM S-MANP
) O
can O
produce O
components S-MACEQ
with O
mechanical B-CONPRI
properties E-CONPRI
close O
to O
bulk O
, O
but O
with O
the O
integration O
of O
internal O
embedded B-ENAT
electronics E-ENAT
, O
sensors S-MACEQ
or O
optics S-APPL
. O
This O
paper O
describes O
a O
novel O
manufacturing S-MANP
route O
for O
embedding O
electronics S-CONPRI
with O
3D S-CONPRI
via O
connectors O
in O
an O
aluminium B-MATE
matrix E-MATE
. O