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Manufacturer: SPTS |
Model: 320 PC |
Description: Reactive Ion Etcher -Manual loading for laboratory use |
Version: UP TO 200 mm |
Vintage: 01.05.1995 |
Quantity: 1 |
Comments: |
-Manual loading |
-includes PC control system. |
-Software version 2.3.00 datalog |
-includes STS end-point detector |
-includes Leybold mechanical pump with oil mist filter. |
-includes Leybold turbo pump |
-Leybold turbo pump controller type: Turbotronix NT 151 / 361 |
-RF generator type: ENI ACG6 |
-Includes process module chiller type BETTA TECH CU500. COOLANT: |
GALDEN.(SEE SDI ID 106971) |
-Cathode diameter: 30 cm |
-Cathode area: 706.5 cm2 |
-RF forward power range: 10 to 600 watts |
-Chamber max pressure: 500 mtorr |
-Chamber base vacuum: 1mTorr |
-Substrate sizes: 2 to 8 inch and small fragments |
-Number of gas lines available: 8 |
Reactive Ion Etching is a technique which is used to selectively etch |
thin films in micro-electronic devices. It used both physical and |
chemical etching. An appropriate gas mixture needs to be selected to |
obtain the best process results. |
Etch rates can be adjusted by changing the electrode bias, RF power, |
chamber pressure and the gas flow rates. RIE can provide highly |
anisotropic surfaces. |
With the STS 320PC, recipes can be changed easily to allow the |
processing of new materials. |
POSSIBLE SUBSTRATE SIZES: 2 INCH, 4 INCH, 5, INCH, 6 INCH AND 8 INCH, |
FRAGMENTS |
GASES USED: CF4, O2, CHF3, SF6, CF4 + N2 |
SUBSTRATES THAT CAN BE ETCHED: SiO2, PolySilicon, SiN |
Yours sincerely, |
SDI Fabsurplus Italia SRL |
Stephen Howe |
Company Owner |
email: info at fabsurplus.com |
Mobile (Italy) : +39 335-710-7756 |
WWW.FABSURPLUS.COM |
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From mpleil at unm.edu Wed May 31 16:39:19 2023 |
From: mpleil at unm.edu (Matthias Pleil) |
Date: Wed, 31 May 2023 20:39:19 +0000 |
Subject: [labnetwork] LAM 490 etcher available |
Message-ID: <DS0PR07MB9913A0C46D4BB3D0F5549E5BC7489@DS0PR07MB9913.namprd07.prod.outlook.com> |
Hello Lab Network Team, |
We have a LAM etcher up for bid - in case you are interested, we had it donated to us years ago, never installed it. |
Here is the online bid service with more details. |
The auction is now live for the UNM LAM490B Poly/Nitride Etcher<https://www.govdeals.com/index.cfm?fa=Main.Item&itemid=861&acctid=5083>. Auction ends 6/10/23 at 12:15PM MT. |
Kind Regards, |
Matthias Pleil, Ph.D. |
Director Manufacturing Engineering Program |
UNM MTTC Cleanroom Manager |
Research Professor & Senior Lecturer III of Mech. Eng - UNM |
PI - Support Center for Microsystems Education |
Find great curriculum at: www.scme-support.org<http://www.scme-support.org/> |
(505)272-7157 |
Join the MNTeSIG Team at www.mntesig.net<http://www.mntesig.net/> |
[cid:91567e30-cd9a-4ff5-92a8-60d46ab127e1] |
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From delima1 at llnl.gov Wed May 31 17:30:04 2023 |
From: delima1 at llnl.gov (DeLima, Terri L.) |
Date: Wed, 31 May 2023 21:30:04 +0000 |
Subject: [labnetwork] Alternative wastewater treatment systems |
Message-ID: <BY5PR09MB5524F66607777C71ECDE4EE191489@BY5PR09MB5524.namprd09.prod.outlook.com> |
I'm interested in an alternative to our current wastewater retention system. Has anyone looked into wastewater treatment systems such as treat & recycle or zero discharge systems? |
* What type of alternative wastewater treatment system do you use? |
* How effective is the system at removing contaminants from wastewater? |
* How cost-effective is the system? |
* What challenges have you faced in implementing this alternative wastewater solution? |
Thank you for your time and consideration. I look forward to hearing from you soon. |
Sincerely, |
Terri DeLima |
Operations Manager |
Center for Micro/Nano Technology & Bioengineering |
Phone: 925-423-4526 |
Mobile: 925-315-0731 |
Email: delima1 at llnl.gov<mailto:delima1 at llnl.gov> |
7000 East Ave L-222 |
Livermore , CA 94550 |
Lawrence Livermore National Laboratory (LLNL)<https://www.google.com/url?sa=t&rct=j&q=&esrc=s&source=web&cd=1&cad=rja&ved=0CCcQFjAA&url=https%3A%2F%2Fwww.llnl.gov%2F&ei=AWvxUv64C8XYyAGcyYGYBQ&usg=AFQjCNE2zEfMLOrvp3oztLKwd7XmYy_4og&bvm=bv.60444564,d.aWc> |
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