text
stringlengths
1
2.97k
The Departments of Chemistry and Physics at the University of
Louisville (UofL) seek applications for a tenure-track faculty position,
preferably at the assistant professor level. The applicant's research
program, which should be directed at the interface of Chemistry and
Physics, must involve projects that will make extensive use of the new
10,000 sq. ft. UofL Micro/Nano Cleanroom core facility
(www.louisville.edu/micronano); and she/he should possess a strong
background in cleanroom and micro/nano-fabrication techniques. The
position is expected to be tenured in the Chemistry Department with a
joint appointment in Physics, depending on the applicant?s
qualifications and interests. Accordingly, the successful candidate
should have a Ph.D. in Chemistry, Chemical Physics, or a related field,
as well as relevant postdoctoral experience. In addition to development
of a recognized, funded research program, the applicant should also
demonstrate a strong commitment to undergraduate and graduate teaching.
Applicants are requested to arrange for the transmission of an
up-to-date curriculum vitae, three letters of recommendation, and a
statement of research and teaching interests to: Chair,
Chemistry/Physics Search Committee, Department of Chemistry, University
of Louisville, Louisville, KY 40292, FAX 502-852-8149. Proof of
eligibility for U.S. employment will be required prior to employment.
Screening of applications will begin on October 15, 2007. For more
information, see www.louisville.edu/a-s/chemistry and
www.physics.louisville.edu. Women, African-Americans, and other
minorities are especially encouraged to apply.
-------------- next part --------------
An HTML attachment was scrubbed...
URL: <https://mtl.mit.edu/pipermail/labnetwork/attachments/20071023/40807393/attachment.html>
-------------- next part --------------
A non-text attachment was scrubbed...
Name: ChemFaculty search.pdf
Type: application/pdf
Size: 13975 bytes
Desc: not available
URL: <https://mtl.mit.edu/pipermail/labnetwork/attachments/20071023/40807393/attachment.pdf>
-------------- next part --------------
A non-text attachment was scrubbed...
Name: ChemFaculty search.doc
Type: application/msword
Size: 25600 bytes
Desc: not available
URL: <https://mtl.mit.edu/pipermail/labnetwork/attachments/20071023/40807393/attachment.doc>
From jpalmer at Princeton.EDU Fri Oct 26 16:39:53 2007
From: jpalmer at Princeton.EDU (Joseph E. Palmer)
Date: Fri, 26 Oct 2007 16:39:53 -0400
Subject: [labnetwork] Aluminum Sputtering
Message-ID: <47225099.705@princeton.edu>
Can anyone suggest any papers on sputtering aluminum? I am looking at
preventing the Al from depositing all over the chamber, as its light
weight allows it to go much further than other metals.
Thanks,
Joe Palmer
Facilities Manager,
PRISM Micro/Nano Fabrication Laboratory
Princeton University
--
"Freedom should never be confused with license, nor tolerance with acceptance." - Unknown
From pramod.karulkar at uaf.edu Sun Oct 28 16:10:27 2007
From: pramod.karulkar at uaf.edu (Pramod C. Karulkar)
Date: Sun, 28 Oct 2007 12:10:27 -0800
Subject: [labnetwork] Aluminum Sputtering
In-Reply-To: <47225099.705@princeton.edu>
Message-ID: <200710282010.l9SKAXnM407859@smtp.uaf.edu>
(1) Sputter as very low pressures. May help little bit.
(2) Use ion beam deposition. Entirely different technique.
(3) Modify your system to make it a quasi ion beam deposition system where
metal atoms are directed or channeled through a series of grids. There was
a commercial system like this long time ago for filling deep via. Problem
is you fill the grids to fast and have to clean them too often. You don't
use all the Aluminum. You cannot get enough throughput for any practical
use!
(4) There is a workaround. You place a chimney around your deposition
path. You can have it made at an air conditioning duct shop. You can use
coffee cans. Or you can use the large holiday popcorn cans. Once you
figure out what works, you can make more permanent , fancy chimney of steel
or aluminum.
(5) Cheap way to avoid having to clean system is to use aluminum foil
(liners of suitable material) everywhere you can to protect from build-up.
Hope it helps.
Pramod C. Karulkar, Ph. D.
President's Professor & Director
Office of Electronic Miniaturization
University of Alaska Fairbanks
3330 Industrial Avenue
Fairbanks, AK 99701
Office: 907 455 2008
Cell: 907 322 0225
Assistant : 907 455 2000
FAX 907 455 2019
-----Original Message-----
From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu]
On Behalf Of Joseph E. Palmer
Sent: Friday, October 26, 2007 12:40 PM
To: labnetwork at mtl.mit.edu
Subject: [labnetwork] Aluminum Sputtering
Can anyone suggest any papers on sputtering aluminum? I am looking at
preventing the Al from depositing all over the chamber, as its light
weight allows it to go much further than other metals.
Thanks,
Joe Palmer