Unnamed: 0 int64 0 350k | level_0 int64 0 351k | ApplicationNumber int64 9.75M 96.1M | ArtUnit int64 1.6k 3.99k | Abstract stringlengths 1 8.37k | Claims stringlengths 3 292k | abstract-claims stringlengths 68 293k | TechCenter int64 1.6k 3.9k |
|---|---|---|---|---|---|---|---|
11,200 | 11,200 | 14,996,472 | 2,835 | A cooling arrangement has a circuit board and a plurality of electronic components in operable communication with the circuit board. An enclosure is attached to the circuit board being configured to retain a fluid around at least one of the plurality of electronic components. The circuit board with the enclosure is attached thereto being removably connectable to a motherboard. | 1. A cooling arrangement comprising:
a circuit board; a plurality of electronic components in operable communication with the circuit board; and an enclosure attached to the circuit board being configured to retain a fluid around at least one of the plurality of electronic components, said circuit board with the enclosure attached thereto being removably connectable to a motherboard. 2. The cooling arrangement as set forth in claim 1, wherein said plurality of said electronic components includes at least one power transistor and at least one control circuit, and said enclosure enclosing said at least one power transistor, said at least one control circuit being outside said enclosure. 3. The cooling arrangement as set forth in claim 2, wherein there are a plurality of said transistors and a plurality of enclosures each enclosing one of said plurality of transistors, with a plurality of control circuits positioned outside of said plurality of enclosures. 4. The cooling arrangement as set forth in claim 1, wherein said plurality of electronic components includes a transistor and a control circuit received within said enclosure. 5. The cooling arrangement as set forth in claim 1, wherein said enclosure is provided with a feature to allow expansion of a fluid within said enclosure. 6. The cooling arrangement as set forth in claim 5, wherein a pressure relief valve allows fluid to move outwardly of a chamber surrounding said transistor. 7. The cooling arrangement as set forth in claim 5, wherein said enclosure includes at least one flexible wall, said wall can expand to accommodate an increase in volume of said fluid. 8. The cooling arrangement as set forth in claim 7, wherein said fluid is a liquid and said enclosure is also provided with a compressible gas, with said compressible gas allowing expansion of said liquid. 9. The cooling arrangement as set forth in claim 5, wherein said fluid is a liquid and said enclosure is also provided with a compressible gas, with said compressible gas allowing expansion of said liquid. 10. A control module comprising:
a motherboard and a plurality of removable circuit boards, and at least one of said circuit boards being provided with immersion cooling of an electronic component surrounded by an enclosure that does not enclose others of said plurality of circuit boards. 11. The control module as set forth in claim 10, wherein said at least one of said circuit boards has at least one power transistor and at least one control circuit, and said enclosure enclosing said at least one power transistor, said at least one control circuit being outside said enclosure. 12. The control module as set forth in claim 11, wherein there are a plurality of said transistors and a plurality of enclosures each enclosing one of said plurality of transistors, with a plurality of control circuits positioned outside of said plurality of enclosures. 13. The control module as set forth in claim 12, wherein said enclosure is provided with a feature to allow expansion of a fluid within said enclosure. 14. The control module as set forth in claim 10, wherein said at least one of said circuit board is enclosed entirely in said enclosure and at least one circuit board including a transistor and a control circuit all received within said enclosure, with others of said plurality of circuit boards being outside said enclosure. 15. The control module as set forth in claim 14, wherein said enclosure is provided with a feature to allow expansion of a fluid within said enclosure. 16. The control module as set forth in claim 10, wherein said enclosure is provided with a feature to allow expansion of a fluid within said enclosure. 17. The control module as set forth in claim 16, wherein a pressure relief valve allows fluid to move outwardly of a chamber surrounding said transistor. 18. The control module as set forth in claim 16, wherein said enclosure includes at least one flexible wall, said wall can expand to accommodate an increase in volume of said fluid. 19. The control module as set forth in claim 18, wherein said fluid is a liquid and said enclosure is also provided with a compressible gas, with said compressible gas allowing expansion of said liquid. 20. The control module as set forth in claim 16, wherein said fluid is a liquid and said enclosure is also provided with a compressible gas, with said compressible gas allowing expansion of said liquid. | A cooling arrangement has a circuit board and a plurality of electronic components in operable communication with the circuit board. An enclosure is attached to the circuit board being configured to retain a fluid around at least one of the plurality of electronic components. The circuit board with the enclosure is attached thereto being removably connectable to a motherboard.1. A cooling arrangement comprising:
a circuit board; a plurality of electronic components in operable communication with the circuit board; and an enclosure attached to the circuit board being configured to retain a fluid around at least one of the plurality of electronic components, said circuit board with the enclosure attached thereto being removably connectable to a motherboard. 2. The cooling arrangement as set forth in claim 1, wherein said plurality of said electronic components includes at least one power transistor and at least one control circuit, and said enclosure enclosing said at least one power transistor, said at least one control circuit being outside said enclosure. 3. The cooling arrangement as set forth in claim 2, wherein there are a plurality of said transistors and a plurality of enclosures each enclosing one of said plurality of transistors, with a plurality of control circuits positioned outside of said plurality of enclosures. 4. The cooling arrangement as set forth in claim 1, wherein said plurality of electronic components includes a transistor and a control circuit received within said enclosure. 5. The cooling arrangement as set forth in claim 1, wherein said enclosure is provided with a feature to allow expansion of a fluid within said enclosure. 6. The cooling arrangement as set forth in claim 5, wherein a pressure relief valve allows fluid to move outwardly of a chamber surrounding said transistor. 7. The cooling arrangement as set forth in claim 5, wherein said enclosure includes at least one flexible wall, said wall can expand to accommodate an increase in volume of said fluid. 8. The cooling arrangement as set forth in claim 7, wherein said fluid is a liquid and said enclosure is also provided with a compressible gas, with said compressible gas allowing expansion of said liquid. 9. The cooling arrangement as set forth in claim 5, wherein said fluid is a liquid and said enclosure is also provided with a compressible gas, with said compressible gas allowing expansion of said liquid. 10. A control module comprising:
a motherboard and a plurality of removable circuit boards, and at least one of said circuit boards being provided with immersion cooling of an electronic component surrounded by an enclosure that does not enclose others of said plurality of circuit boards. 11. The control module as set forth in claim 10, wherein said at least one of said circuit boards has at least one power transistor and at least one control circuit, and said enclosure enclosing said at least one power transistor, said at least one control circuit being outside said enclosure. 12. The control module as set forth in claim 11, wherein there are a plurality of said transistors and a plurality of enclosures each enclosing one of said plurality of transistors, with a plurality of control circuits positioned outside of said plurality of enclosures. 13. The control module as set forth in claim 12, wherein said enclosure is provided with a feature to allow expansion of a fluid within said enclosure. 14. The control module as set forth in claim 10, wherein said at least one of said circuit board is enclosed entirely in said enclosure and at least one circuit board including a transistor and a control circuit all received within said enclosure, with others of said plurality of circuit boards being outside said enclosure. 15. The control module as set forth in claim 14, wherein said enclosure is provided with a feature to allow expansion of a fluid within said enclosure. 16. The control module as set forth in claim 10, wherein said enclosure is provided with a feature to allow expansion of a fluid within said enclosure. 17. The control module as set forth in claim 16, wherein a pressure relief valve allows fluid to move outwardly of a chamber surrounding said transistor. 18. The control module as set forth in claim 16, wherein said enclosure includes at least one flexible wall, said wall can expand to accommodate an increase in volume of said fluid. 19. The control module as set forth in claim 18, wherein said fluid is a liquid and said enclosure is also provided with a compressible gas, with said compressible gas allowing expansion of said liquid. 20. The control module as set forth in claim 16, wherein said fluid is a liquid and said enclosure is also provided with a compressible gas, with said compressible gas allowing expansion of said liquid. | 2,800 |
11,201 | 11,201 | 14,130,224 | 2,855 | The present invention relates to a downhole tool ( 1 ) for determining laterals in a borehole wall ( 3 ) or a borehole casing ( 4 ), comprising a tool housing ( 5 ) extending along a longitudinal axis ( 6 ) and having a circumference perpendicular to the longitudinal axis and adapted to be lowered into a well, and a plurality of sonic transceivers ( 7 ), each sonic transceiver transmitting sonic signals ( 8 ) from the housing and receiving sonic signals reflected from the borehole wall or borehole casing in a pre-defined angular segment ( 9 ), wherein the plurality of sonic transceivers are arranged along the circumference of the tool housing having a mutual distance and are capable of transmitting sonic signals radially away from the tool housing in an entire central angle of 360 degrees towards the borehole wall or borehole casing and wherein, during use, one sonic transceiver, during a pulse time, transmits a sonic signal in the predefined angular segment of that sonic transmitter, and wherein one sonic transceiver, during a subsequent echo time, receives a reflected sonic signal from the borehole wall or borehole casing, and wherein an absence of the received reflected sonic signal, during the subsequent echo time, indicates a lateral. Furthermore, the invention relates to a downhole system and a method of determining a position of a lateral. | 1. A downhole tool (1) for determining laterals in a borehole wall (3) or a borehole casing (4), comprising:
a tool housing (5) extending along a longitudinal axis (6) and having a circumference perpendicular to the longitudinal axis and adapted to be lowered into a well, and a plurality of sonic transceivers (7), each sonic transceiver transmitting sonic signals from the housing and receiving sonic signals (8) reflected from the borehole wall or borehole casing in a predefined angular segment (9),
wherein the plurality of sonic transceivers are arranged along the circumference of the tool housing having a mutual distance and are capable of transmitting sonic signals radially away from the tool housing in an entire central angle of 360 degrees towards the borehole wall or borehole casing and wherein, during use, one sonic transceiver, during a pulse time, transmits a sonic signal in the predefined angular segment of that sonic transmitter, and wherein one sonic transceiver, during a subsequent echo time, receives a reflected sonic signal from the borehole wall or borehole casing, and wherein an absence of the received reflected sonic signal, during the subsequent echo time, indicates a lateral, and wherein the downhole tool further comprises a magnetic profiler for measuring a magnetic profile of the borehole casing. 2. A downhole tool according to claim 1, wherein the magnetic profiler is capable of applying a magnetic field and measuring a change in the magnetic field. 3. A downhole tool according to claim 2, wherein the change in the magnetic field is measured as a function of an interaction between the borehole casing and the magnetic field. 4. A downhole tool according to claim 1, wherein the sonic transceivers are arranged equidistantly along the circumference of the tool housing, having a fixed mutual distance. 5. A downhole tool according to claim 1, wherein the sonic transceivers are arranged along the circumference of the tool housing in a regular pattern. 6. A downhole tool according to claim 1, wherein more than one transceiver are receiving during the echo time. 7. A downhole tool according to claim 1, wherein more than one transceiver are transmitting during the pulse time. 8. A downhole tool according to claim 1 wherein the downhole tool comprises at least four sonic transceivers, each transceiver being capable of transmitting sonic signals covering at least one forth of the entire central angle such as at least eight sonic transceivers, each transceiver being capable of transmitting sonic signals covering at least one eighth of the entire central angle. 9. A downhole tool according to claim 1, wherein the downhole tool comprises an array of sonic transceivers capable of transmitting sonic signals covering the entire central angle. 10. A downhole tool according to claim 1, wherein a plurality of sonic signals can be transmitted during the pulse time in different predefined angular segments. 11. A downhole tool according to claim 1, wherein the sonic transceivers are capable of transmitting sonic signals having different predefined amplitudes and phases. 12. A downhole tool according to claim 1, further comprising a plurality of second sonic transceivers (10) arranged at a longitudinal distance away from the plurality of sonic transceivers and arranged along the circumference of the tool housing having a mutual distance and being capable of transmitting sonic signals radially away from the tool housing in an entire central angle of 360 degrees towards the borehole wall or borehole. 13. A downhole system (200) comprising:
a wireline (14), a tool string (100), a driving unit (11), a lateral locator (12), and an operational tool (13) for operating in a lateral,
wherein the system further comprises a downhole tool for determining laterals according to claim 1. 14. A downhole system according to claim 13, further comprising a magnetic profiler. 15. A downhole system according to claim 13 the operational tool is a logging tool, a key tool, a milling tool or a drilling tool. 16. A downhole system according to claim 13, further comprising a positioning tool (not shown), such as a casing collar locator. 17. A method of determining a position of a lateral comprising the steps of:
moving the downhole tool according to claim 1 to a first position in the borehole, conducting a series of pulse/echo measurements comprising:
transmitting a sonic signal by a sonic transceiver in a first angular segment during a first pulse time,
recording if a reflected sonic signal is received by a sonic transceiver during a first echo time,
transmitting a sonic signal by a neighbouring sonic transceiver in a second angular segment during a second pulse time, and
recording if a reflected sonic signal is received by a sonic transceiver during a second echo time,
continuing the series of pulse/echo measurements at the first position until all angular segments along the entire circumference of the tool housing has been investigated using the plurality of sonic transceivers, moving the downhole tool to a second position in the borehole, conducting a second series of pulse/echo measurements at the second position in the borehole, determining the position of the lateral from the absence of received reflected sonic signals in a subset of the measurements, indicating the position of the lateral, and recording a magnetic profile for each recording by the sonic transceiver. 18. A method according to claim 17, further comprising the step of performing a plurality of measurements using the method according to claim 17 and subsequently combining several recordings by the sonic transceiver having matching recorded magnetic profiles. 19. A method according to claims 17, further comprising the step of inserting an operational tool into the lateral. 20. A method according to claim 17, further comprising a step of forcing the downhole tool into the lateral with a lateral locator tool. | The present invention relates to a downhole tool ( 1 ) for determining laterals in a borehole wall ( 3 ) or a borehole casing ( 4 ), comprising a tool housing ( 5 ) extending along a longitudinal axis ( 6 ) and having a circumference perpendicular to the longitudinal axis and adapted to be lowered into a well, and a plurality of sonic transceivers ( 7 ), each sonic transceiver transmitting sonic signals ( 8 ) from the housing and receiving sonic signals reflected from the borehole wall or borehole casing in a pre-defined angular segment ( 9 ), wherein the plurality of sonic transceivers are arranged along the circumference of the tool housing having a mutual distance and are capable of transmitting sonic signals radially away from the tool housing in an entire central angle of 360 degrees towards the borehole wall or borehole casing and wherein, during use, one sonic transceiver, during a pulse time, transmits a sonic signal in the predefined angular segment of that sonic transmitter, and wherein one sonic transceiver, during a subsequent echo time, receives a reflected sonic signal from the borehole wall or borehole casing, and wherein an absence of the received reflected sonic signal, during the subsequent echo time, indicates a lateral. Furthermore, the invention relates to a downhole system and a method of determining a position of a lateral.1. A downhole tool (1) for determining laterals in a borehole wall (3) or a borehole casing (4), comprising:
a tool housing (5) extending along a longitudinal axis (6) and having a circumference perpendicular to the longitudinal axis and adapted to be lowered into a well, and a plurality of sonic transceivers (7), each sonic transceiver transmitting sonic signals from the housing and receiving sonic signals (8) reflected from the borehole wall or borehole casing in a predefined angular segment (9),
wherein the plurality of sonic transceivers are arranged along the circumference of the tool housing having a mutual distance and are capable of transmitting sonic signals radially away from the tool housing in an entire central angle of 360 degrees towards the borehole wall or borehole casing and wherein, during use, one sonic transceiver, during a pulse time, transmits a sonic signal in the predefined angular segment of that sonic transmitter, and wherein one sonic transceiver, during a subsequent echo time, receives a reflected sonic signal from the borehole wall or borehole casing, and wherein an absence of the received reflected sonic signal, during the subsequent echo time, indicates a lateral, and wherein the downhole tool further comprises a magnetic profiler for measuring a magnetic profile of the borehole casing. 2. A downhole tool according to claim 1, wherein the magnetic profiler is capable of applying a magnetic field and measuring a change in the magnetic field. 3. A downhole tool according to claim 2, wherein the change in the magnetic field is measured as a function of an interaction between the borehole casing and the magnetic field. 4. A downhole tool according to claim 1, wherein the sonic transceivers are arranged equidistantly along the circumference of the tool housing, having a fixed mutual distance. 5. A downhole tool according to claim 1, wherein the sonic transceivers are arranged along the circumference of the tool housing in a regular pattern. 6. A downhole tool according to claim 1, wherein more than one transceiver are receiving during the echo time. 7. A downhole tool according to claim 1, wherein more than one transceiver are transmitting during the pulse time. 8. A downhole tool according to claim 1 wherein the downhole tool comprises at least four sonic transceivers, each transceiver being capable of transmitting sonic signals covering at least one forth of the entire central angle such as at least eight sonic transceivers, each transceiver being capable of transmitting sonic signals covering at least one eighth of the entire central angle. 9. A downhole tool according to claim 1, wherein the downhole tool comprises an array of sonic transceivers capable of transmitting sonic signals covering the entire central angle. 10. A downhole tool according to claim 1, wherein a plurality of sonic signals can be transmitted during the pulse time in different predefined angular segments. 11. A downhole tool according to claim 1, wherein the sonic transceivers are capable of transmitting sonic signals having different predefined amplitudes and phases. 12. A downhole tool according to claim 1, further comprising a plurality of second sonic transceivers (10) arranged at a longitudinal distance away from the plurality of sonic transceivers and arranged along the circumference of the tool housing having a mutual distance and being capable of transmitting sonic signals radially away from the tool housing in an entire central angle of 360 degrees towards the borehole wall or borehole. 13. A downhole system (200) comprising:
a wireline (14), a tool string (100), a driving unit (11), a lateral locator (12), and an operational tool (13) for operating in a lateral,
wherein the system further comprises a downhole tool for determining laterals according to claim 1. 14. A downhole system according to claim 13, further comprising a magnetic profiler. 15. A downhole system according to claim 13 the operational tool is a logging tool, a key tool, a milling tool or a drilling tool. 16. A downhole system according to claim 13, further comprising a positioning tool (not shown), such as a casing collar locator. 17. A method of determining a position of a lateral comprising the steps of:
moving the downhole tool according to claim 1 to a first position in the borehole, conducting a series of pulse/echo measurements comprising:
transmitting a sonic signal by a sonic transceiver in a first angular segment during a first pulse time,
recording if a reflected sonic signal is received by a sonic transceiver during a first echo time,
transmitting a sonic signal by a neighbouring sonic transceiver in a second angular segment during a second pulse time, and
recording if a reflected sonic signal is received by a sonic transceiver during a second echo time,
continuing the series of pulse/echo measurements at the first position until all angular segments along the entire circumference of the tool housing has been investigated using the plurality of sonic transceivers, moving the downhole tool to a second position in the borehole, conducting a second series of pulse/echo measurements at the second position in the borehole, determining the position of the lateral from the absence of received reflected sonic signals in a subset of the measurements, indicating the position of the lateral, and recording a magnetic profile for each recording by the sonic transceiver. 18. A method according to claim 17, further comprising the step of performing a plurality of measurements using the method according to claim 17 and subsequently combining several recordings by the sonic transceiver having matching recorded magnetic profiles. 19. A method according to claims 17, further comprising the step of inserting an operational tool into the lateral. 20. A method according to claim 17, further comprising a step of forcing the downhole tool into the lateral with a lateral locator tool. | 2,800 |
11,202 | 11,202 | 14,052,067 | 2,862 | A condition diagnosing method capable of executing condition diagnosis considering a secular change is provided. A condition diagnosing method includes a first diagnosing step of determining presence or absence of abnormality in diagnosis data by a latest one class support vector machine, and diagnosing the diagnosis data determined as abnormal as relating to a failure, and a second diagnosing step of determining presence or absence of abnormality in the diagnosis data determined as abnormal in the first diagnosing step by an initial one class support vector machine, diagnosing the diagnosis data determined as abnormal as relating to secular deterioration, and diagnosing the diagnosis data determined as not abnormal as normal. | 1. A condition diagnosing method comprising:
a first diagnosing step of determining presence or absence of abnormality in diagnosis data by a latest one class support vector machine, and diagnosing the diagnosis data determined as abnormal as relating to a failure; and a second diagnosing step of determining presence or absence of abnormality in the diagnosis data determined as abnormal in the first diagnosing step by an initial one class support vector machine, diagnosing the diagnosis data determined as abnormal as relating to secular deterioration, and diagnosing the diagnosis data determined as not abnormal as normal, wherein the latest one class support vector machine is constructed by performing additional learning with the diagnosis data obtained from a diagnosis target at the time of the diagnosis, and the initial one class support vector machine is constructed by training with the data obtained when the diagnosis target was initially manufactured. 2. A condition diagnosing method comprising:
a third diagnosing step of determining presence or absence of abnormality in diagnosis data by an initial one class support vector machine, and diagnosing the diagnosis data determined as not abnormal as normal; and a fourth diagnosing step of determining presence or absence of abnormality in the diagnosis data determined as abnormal in the third diagnosing step by a latest one class support vector machine, diagnosing the diagnosis data determined as abnormal as relating to a failure, and diagnosing the diagnosis data determined as not abnormal as relating to secular deterioration, wherein the latest one class support vector machine is constructed by performing additional learning with the diagnosis data obtained from a diagnosis target at the time of the diagnosis, and the initial one class support vector machine is constructed by training with the data obtained when the diagnosis target was initially manufactured. 3. The condition diagnosing method according to claim 1, wherein
in the additional learning, a distance between the added diagnosis data and a previous normal region is handled as an evaluation function, and a kernel parameter σ of the latest one class support vector machine is updated. 4. The condition diagnosing method according to claim 2, wherein
in the additional learning, a distance between the added diagnosis data and a previous normal region is handled as an evaluation function, and a kernel parameter σ of the latest one class support vector machine is updated. 5. The condition diagnosing method according to claim 3, wherein
the kernel parameter σ is not updated when a maximum value of a result of arithmetic of the evaluation function with the added diagnosis data is equal to or lower than a predetermined threshold. 6. The condition diagnosing method according to claim 4, wherein
the kernel parameter σ is not updated when a maximum value of a result of arithmetic of the evaluation function with the added diagnosis data is equal to or lower than a predetermined threshold. 7. The condition diagnosing method according to claim 3, wherein
the additional learning handles the diagnosis data not included in the previous normal region as targets of the additional learning, and excludes the diagnosis data included in the previous normal region from the targets of the additional learning. 8. The condition diagnosing method according to claim 4, wherein
the additional learning handles the diagnosis data not included in the previous normal region as targets of the additional learning, and excludes the diagnosis data included in the previous normal region from the targets of the additional learning. 9. The condition diagnosing method according to claim 1, wherein
one or both of the latest one class support vector machine and the initial one class support vector machine is constructed by applying the kernel specified in the following formula (8), provided that m is 1, 2, 3, . . . M.
[
Math
1
]
κ
(
x
,
z
)
=
exp
(
-
x
1
-
z
1
2
σ
2
2
)
exp
(
-
x
-
z
2
σ
2
)
formula
(
8
) 10. The condition diagnosing method according to claim 2, wherein
one or both of the latest one class support vector machine and the initial one class support vector machine is constructed by applying the kernel specified in the following formula (8), provided that m is 1, 2, 3, . . . M.
[
Math
1
]
κ
(
x
,
z
)
=
exp
(
-
x
1
-
z
1
2
σ
2
2
)
exp
(
-
x
-
z
2
σ
2
)
formula
(
8
) 11. A condition diagnosing device comprising:
a first diagnosing unit determining presence or absence of abnormality in diagnosis data by a latest one class support vector machine, and diagnosing the diagnosis data determined as abnormal as relating to a failure; and a second diagnosing unit of determining presence or absence of abnormality in the diagnosis data determined as abnormal by the first diagnosing unit by an initial one class support vector machine, diagnosing the diagnosis data determined as abnormal as relating to secular deterioration, and diagnosing the diagnosis data determined as not abnormal as normal, wherein the latest one class support vector machine is constructed by performing additional learning with the diagnosis data obtained from a diagnosis target at the time of the diagnosis, and the initial one class support vector machine is constructed by training with the data obtained when the diagnosis target was initially manufactured. 12. A condition diagnosing method comprising:
a third diagnosing unit of determining presence or absence of abnormality in diagnosis data by an initial one class support vector machine, and diagnosing the diagnosis data determined as not abnormal as normal; and a fourth diagnosing unit of determining presence or absence of abnormality in the diagnosis data determined as abnormal by the third diagnosing unit by a latest one class support vector machine, diagnosing the diagnosis data determined as abnormal as relating to a failure, and diagnosing the diagnosis data determined as not abnormal as relating to secular deterioration, wherein the latest one class support vector machine is constructed by performing additional learning with the diagnosis data obtained from a diagnosis target at the time of the diagnosis, and the initial one class support vector machine is constructed by training with the data obtained when the diagnosis target was initially manufactured. | A condition diagnosing method capable of executing condition diagnosis considering a secular change is provided. A condition diagnosing method includes a first diagnosing step of determining presence or absence of abnormality in diagnosis data by a latest one class support vector machine, and diagnosing the diagnosis data determined as abnormal as relating to a failure, and a second diagnosing step of determining presence or absence of abnormality in the diagnosis data determined as abnormal in the first diagnosing step by an initial one class support vector machine, diagnosing the diagnosis data determined as abnormal as relating to secular deterioration, and diagnosing the diagnosis data determined as not abnormal as normal.1. A condition diagnosing method comprising:
a first diagnosing step of determining presence or absence of abnormality in diagnosis data by a latest one class support vector machine, and diagnosing the diagnosis data determined as abnormal as relating to a failure; and a second diagnosing step of determining presence or absence of abnormality in the diagnosis data determined as abnormal in the first diagnosing step by an initial one class support vector machine, diagnosing the diagnosis data determined as abnormal as relating to secular deterioration, and diagnosing the diagnosis data determined as not abnormal as normal, wherein the latest one class support vector machine is constructed by performing additional learning with the diagnosis data obtained from a diagnosis target at the time of the diagnosis, and the initial one class support vector machine is constructed by training with the data obtained when the diagnosis target was initially manufactured. 2. A condition diagnosing method comprising:
a third diagnosing step of determining presence or absence of abnormality in diagnosis data by an initial one class support vector machine, and diagnosing the diagnosis data determined as not abnormal as normal; and a fourth diagnosing step of determining presence or absence of abnormality in the diagnosis data determined as abnormal in the third diagnosing step by a latest one class support vector machine, diagnosing the diagnosis data determined as abnormal as relating to a failure, and diagnosing the diagnosis data determined as not abnormal as relating to secular deterioration, wherein the latest one class support vector machine is constructed by performing additional learning with the diagnosis data obtained from a diagnosis target at the time of the diagnosis, and the initial one class support vector machine is constructed by training with the data obtained when the diagnosis target was initially manufactured. 3. The condition diagnosing method according to claim 1, wherein
in the additional learning, a distance between the added diagnosis data and a previous normal region is handled as an evaluation function, and a kernel parameter σ of the latest one class support vector machine is updated. 4. The condition diagnosing method according to claim 2, wherein
in the additional learning, a distance between the added diagnosis data and a previous normal region is handled as an evaluation function, and a kernel parameter σ of the latest one class support vector machine is updated. 5. The condition diagnosing method according to claim 3, wherein
the kernel parameter σ is not updated when a maximum value of a result of arithmetic of the evaluation function with the added diagnosis data is equal to or lower than a predetermined threshold. 6. The condition diagnosing method according to claim 4, wherein
the kernel parameter σ is not updated when a maximum value of a result of arithmetic of the evaluation function with the added diagnosis data is equal to or lower than a predetermined threshold. 7. The condition diagnosing method according to claim 3, wherein
the additional learning handles the diagnosis data not included in the previous normal region as targets of the additional learning, and excludes the diagnosis data included in the previous normal region from the targets of the additional learning. 8. The condition diagnosing method according to claim 4, wherein
the additional learning handles the diagnosis data not included in the previous normal region as targets of the additional learning, and excludes the diagnosis data included in the previous normal region from the targets of the additional learning. 9. The condition diagnosing method according to claim 1, wherein
one or both of the latest one class support vector machine and the initial one class support vector machine is constructed by applying the kernel specified in the following formula (8), provided that m is 1, 2, 3, . . . M.
[
Math
1
]
κ
(
x
,
z
)
=
exp
(
-
x
1
-
z
1
2
σ
2
2
)
exp
(
-
x
-
z
2
σ
2
)
formula
(
8
) 10. The condition diagnosing method according to claim 2, wherein
one or both of the latest one class support vector machine and the initial one class support vector machine is constructed by applying the kernel specified in the following formula (8), provided that m is 1, 2, 3, . . . M.
[
Math
1
]
κ
(
x
,
z
)
=
exp
(
-
x
1
-
z
1
2
σ
2
2
)
exp
(
-
x
-
z
2
σ
2
)
formula
(
8
) 11. A condition diagnosing device comprising:
a first diagnosing unit determining presence or absence of abnormality in diagnosis data by a latest one class support vector machine, and diagnosing the diagnosis data determined as abnormal as relating to a failure; and a second diagnosing unit of determining presence or absence of abnormality in the diagnosis data determined as abnormal by the first diagnosing unit by an initial one class support vector machine, diagnosing the diagnosis data determined as abnormal as relating to secular deterioration, and diagnosing the diagnosis data determined as not abnormal as normal, wherein the latest one class support vector machine is constructed by performing additional learning with the diagnosis data obtained from a diagnosis target at the time of the diagnosis, and the initial one class support vector machine is constructed by training with the data obtained when the diagnosis target was initially manufactured. 12. A condition diagnosing method comprising:
a third diagnosing unit of determining presence or absence of abnormality in diagnosis data by an initial one class support vector machine, and diagnosing the diagnosis data determined as not abnormal as normal; and a fourth diagnosing unit of determining presence or absence of abnormality in the diagnosis data determined as abnormal by the third diagnosing unit by a latest one class support vector machine, diagnosing the diagnosis data determined as abnormal as relating to a failure, and diagnosing the diagnosis data determined as not abnormal as relating to secular deterioration, wherein the latest one class support vector machine is constructed by performing additional learning with the diagnosis data obtained from a diagnosis target at the time of the diagnosis, and the initial one class support vector machine is constructed by training with the data obtained when the diagnosis target was initially manufactured. | 2,800 |
11,203 | 11,203 | 13,772,014 | 2,862 | A system and method for translating performance characteristics of a system from one system condition to another system condition includes sensing, at a current system condition, a first system performance parameter and a second system performance parameter. The first and second system performance parameters correspond to a measured performance characteristic value of the system. A first reference performance datum associated with the first and second system performance parameters at the current system condition, and a second reference performance datum associated with the first and second system performance parameters at a selected reference system condition are both retrieved from a memory. A difference between the first and second reference performance data is calculated to generate a translation value. The measured performance characteristic value of the system is then translated an amount equal to the data translation value, whereby a corrected performance characteristic value at the selected reference system condition is generated. | 1. A method for translating performance characteristics of a system from one system condition to another system condition, the method comprising the steps of:
sensing, at a current system condition, a first system performance parameter and a second system performance parameter, the first and second system performance parameters corresponding to a measured performance characteristic value of the system; retrieving, from a memory, a first reference performance datum associated with the first and second system performance parameters at the current system condition; retrieving, from the memory, a second reference performance datum associated with the first and second system performance parameters at a selected reference system condition; calculating, in a processor, a difference between the first reference performance datum and the second reference performance datum, to thereby generate a translation value; and translating, in the processor, the measured performance characteristic value of the system an amount equal to the data translation value, to thereby generate a corrected performance characteristic value of the system at the selected reference system condition. 2. The method of claim 1, further comprising:
applying transfer functions to at least one of the first and second system performance parameters to thereby generate phase compensated performance data representative of a steady state relationship between the first and second system performance parameters; and using the phase compensated performance data to determine the measured performance characteristic value of the system. 3. The method of claim 1, further comprising:
for each corrected performance characteristic value, calculating an estimate of the first system performance parameter at a predetermined value of the second system performance parameter using two previously stored performance characteristic curves representative of the steady state relationship between the first and second system performance parameters. 4. The method of claim 3, wherein:
the predetermined value of the second parameter is a predetermined maximum rated value of the second parameter; and the calculated estimate of the first parameter is a calculated estimate of a maximum value of the first value at the predetermined maximum rated value of the second parameter. 5. The method of claim 4, further comprising:
subtracting the maximum value of the first value from a predetermined first parameter limit value to obtain a first parameter margin. 6. The method of claim 3, further comprising:
filtering each of the calculated estimates of the first parameter to generate filtered first parameter estimate values; detecting whether the filtered first parameter estimate values have changed by a predetermined magnitude; and generating a reset signal if the filtered first parameter estimate values have changed by the predetermined magnitude. 7. The method of claim 3, further comprising:
providing a predetermined number of data storage bins, each data storage bin representative of a predefined value range of the second parameter; storing the corrected performance characteristic values in an appropriate one of the data storage bins; and generating a performance characteristic curve from the corrected performance characteristic values stored in each of the data storage bins. 8. The method of claim 8, further comprising:
recursively calculating a mean and a standard deviation of the corrected performance characteristic values stored in each of the data storage bins; and generating the performance characteristic curve using the recursively calculated mean and standard deviation values. 9. A method of translating performance characteristics for a gas turbine engine from one engine condition to another engine condition, comprising the steps of:
sensing, at a current engine condition, a first engine performance parameter and a second engine performance parameter, the first and second engine performance parameters corresponding to a measured performance characteristic value of the engine; retrieving, from a memory, a first reference performance datum associated with the first and second engine performance parameters at the current engine condition; retrieving, from the memory, a second reference performance datum associated with the first and second engine performance parameters at a selected reference engine condition; calculating, in a processor, a difference between the first reference performance datum and the second reference performance datum, to thereby generate a translation value; and translating, in the processor, the measured performance characteristic value of the engine an amount equal to the data translation value, to thereby generate a corrected performance characteristic value of the engine at the selected reference engine condition. 10. The method of claim 9, further comprising:
applying transfer functions to at least one of the first and second system performance parameters to thereby generate phase compensated performance data representative of a steady state relationship between the first and second engine performance parameters; and using the phase compensated performance data to determine the measured performance characteristic value of the system. 11. The method of claim 9, further comprising:
for each corrected performance characteristic value, calculating an estimate of the first engine performance parameter at a predetermined value of the second engine performance parameter using two previously stored performance characteristic curves representative of the steady state relationship between the first and second engine performance parameters. 12. The method of claim 11, wherein:
the first engine performance parameter is power turbine inlet temperature; the second engine performance parameter is engine torque; the predetermined value of the second engine performance parameter is maximum rated power torque; and the calculated estimate of the first engine performance parameter is a calculated estimate of power turbine inlet temperature at the maximum rated power torque. 13. The method of claim 12, further comprising:
providing a predetermined number of data storage bins, each data storage bin representative of a predefined value range of engine torque; storing the corrected performance characteristic values in an appropriate one of the data storage bins; and generating a performance characteristic curve from the corrected performance characteristic values stored in each of the data storage bins. 14. The method of claim 13, further comprising:
recursively calculating a mean and a standard deviation of the corrected performance characteristic values stored in each of the data storage bins; and generating the performance characteristic curve using the recursively calculated mean and standard deviation values. 15. The method of claim 12, further comprising:
calculating power turbine inlet temperature margin from a predetermined power turbine inlet temperature limit value and the calculated estimate of power turbine inlet temperature at the maximum rated power torque; and calculating power available from the engine. 16. A gas turbine engine continuous performance analysis system, comprising:
a first sensor operable to sense, at a current flight condition, a first engine performance parameter and supply first engine performance parameter data representative of the first engine performance parameter; a second sensor operable to sense, at the current flight condition, a second engine performance parameter and supply second engine performance parameter data representative of the second engine performance parameter; memory having stored therein reference performance data associated with the first and second engine performance parameters at a plurality of flight conditions; and a processor in operable communication with the first sensor, the second sensor, and the memory, the processor coupled to receive the first and second engine performance parameter data from the first and second sensors, respectively, and configured, upon receipt thereof, to:
retrieve, from the memory, a first reference performance datum associated with the first and second engine performance parameters at the current flight condition;
retrieve, from the memory, a second reference performance datum associated with the first and second engine performance parameters at a selected reference flight condition;
calculate a difference between the first reference performance datum and the second reference performance datum, to thereby generate a translation value; and
translate the measured performance characteristic value of the engine an amount equal to the data translation value, to thereby generate a corrected performance characteristic value of the engine at the selected reference flight condition. 17. The system of claim 16, wherein the processor is further configured to:
apply transfer functions to at least one of the first and second system performance parameters to thereby generate phase compensated performance data representative of a steady state relationship between the first and second engine performance parameters; and use the phase compensated performance data to determine the measured performance characteristic value of the system. 18. The system of claim 16, wherein the processor is further configured to:
calculate, for each corrected performance characteristic value, an estimate of the first engine performance parameter at a predetermined value of the second engine performance parameter using two previously stored performance characteristic curves representative of the steady state relationship between the first and second engine performance parameters. | A system and method for translating performance characteristics of a system from one system condition to another system condition includes sensing, at a current system condition, a first system performance parameter and a second system performance parameter. The first and second system performance parameters correspond to a measured performance characteristic value of the system. A first reference performance datum associated with the first and second system performance parameters at the current system condition, and a second reference performance datum associated with the first and second system performance parameters at a selected reference system condition are both retrieved from a memory. A difference between the first and second reference performance data is calculated to generate a translation value. The measured performance characteristic value of the system is then translated an amount equal to the data translation value, whereby a corrected performance characteristic value at the selected reference system condition is generated.1. A method for translating performance characteristics of a system from one system condition to another system condition, the method comprising the steps of:
sensing, at a current system condition, a first system performance parameter and a second system performance parameter, the first and second system performance parameters corresponding to a measured performance characteristic value of the system; retrieving, from a memory, a first reference performance datum associated with the first and second system performance parameters at the current system condition; retrieving, from the memory, a second reference performance datum associated with the first and second system performance parameters at a selected reference system condition; calculating, in a processor, a difference between the first reference performance datum and the second reference performance datum, to thereby generate a translation value; and translating, in the processor, the measured performance characteristic value of the system an amount equal to the data translation value, to thereby generate a corrected performance characteristic value of the system at the selected reference system condition. 2. The method of claim 1, further comprising:
applying transfer functions to at least one of the first and second system performance parameters to thereby generate phase compensated performance data representative of a steady state relationship between the first and second system performance parameters; and using the phase compensated performance data to determine the measured performance characteristic value of the system. 3. The method of claim 1, further comprising:
for each corrected performance characteristic value, calculating an estimate of the first system performance parameter at a predetermined value of the second system performance parameter using two previously stored performance characteristic curves representative of the steady state relationship between the first and second system performance parameters. 4. The method of claim 3, wherein:
the predetermined value of the second parameter is a predetermined maximum rated value of the second parameter; and the calculated estimate of the first parameter is a calculated estimate of a maximum value of the first value at the predetermined maximum rated value of the second parameter. 5. The method of claim 4, further comprising:
subtracting the maximum value of the first value from a predetermined first parameter limit value to obtain a first parameter margin. 6. The method of claim 3, further comprising:
filtering each of the calculated estimates of the first parameter to generate filtered first parameter estimate values; detecting whether the filtered first parameter estimate values have changed by a predetermined magnitude; and generating a reset signal if the filtered first parameter estimate values have changed by the predetermined magnitude. 7. The method of claim 3, further comprising:
providing a predetermined number of data storage bins, each data storage bin representative of a predefined value range of the second parameter; storing the corrected performance characteristic values in an appropriate one of the data storage bins; and generating a performance characteristic curve from the corrected performance characteristic values stored in each of the data storage bins. 8. The method of claim 8, further comprising:
recursively calculating a mean and a standard deviation of the corrected performance characteristic values stored in each of the data storage bins; and generating the performance characteristic curve using the recursively calculated mean and standard deviation values. 9. A method of translating performance characteristics for a gas turbine engine from one engine condition to another engine condition, comprising the steps of:
sensing, at a current engine condition, a first engine performance parameter and a second engine performance parameter, the first and second engine performance parameters corresponding to a measured performance characteristic value of the engine; retrieving, from a memory, a first reference performance datum associated with the first and second engine performance parameters at the current engine condition; retrieving, from the memory, a second reference performance datum associated with the first and second engine performance parameters at a selected reference engine condition; calculating, in a processor, a difference between the first reference performance datum and the second reference performance datum, to thereby generate a translation value; and translating, in the processor, the measured performance characteristic value of the engine an amount equal to the data translation value, to thereby generate a corrected performance characteristic value of the engine at the selected reference engine condition. 10. The method of claim 9, further comprising:
applying transfer functions to at least one of the first and second system performance parameters to thereby generate phase compensated performance data representative of a steady state relationship between the first and second engine performance parameters; and using the phase compensated performance data to determine the measured performance characteristic value of the system. 11. The method of claim 9, further comprising:
for each corrected performance characteristic value, calculating an estimate of the first engine performance parameter at a predetermined value of the second engine performance parameter using two previously stored performance characteristic curves representative of the steady state relationship between the first and second engine performance parameters. 12. The method of claim 11, wherein:
the first engine performance parameter is power turbine inlet temperature; the second engine performance parameter is engine torque; the predetermined value of the second engine performance parameter is maximum rated power torque; and the calculated estimate of the first engine performance parameter is a calculated estimate of power turbine inlet temperature at the maximum rated power torque. 13. The method of claim 12, further comprising:
providing a predetermined number of data storage bins, each data storage bin representative of a predefined value range of engine torque; storing the corrected performance characteristic values in an appropriate one of the data storage bins; and generating a performance characteristic curve from the corrected performance characteristic values stored in each of the data storage bins. 14. The method of claim 13, further comprising:
recursively calculating a mean and a standard deviation of the corrected performance characteristic values stored in each of the data storage bins; and generating the performance characteristic curve using the recursively calculated mean and standard deviation values. 15. The method of claim 12, further comprising:
calculating power turbine inlet temperature margin from a predetermined power turbine inlet temperature limit value and the calculated estimate of power turbine inlet temperature at the maximum rated power torque; and calculating power available from the engine. 16. A gas turbine engine continuous performance analysis system, comprising:
a first sensor operable to sense, at a current flight condition, a first engine performance parameter and supply first engine performance parameter data representative of the first engine performance parameter; a second sensor operable to sense, at the current flight condition, a second engine performance parameter and supply second engine performance parameter data representative of the second engine performance parameter; memory having stored therein reference performance data associated with the first and second engine performance parameters at a plurality of flight conditions; and a processor in operable communication with the first sensor, the second sensor, and the memory, the processor coupled to receive the first and second engine performance parameter data from the first and second sensors, respectively, and configured, upon receipt thereof, to:
retrieve, from the memory, a first reference performance datum associated with the first and second engine performance parameters at the current flight condition;
retrieve, from the memory, a second reference performance datum associated with the first and second engine performance parameters at a selected reference flight condition;
calculate a difference between the first reference performance datum and the second reference performance datum, to thereby generate a translation value; and
translate the measured performance characteristic value of the engine an amount equal to the data translation value, to thereby generate a corrected performance characteristic value of the engine at the selected reference flight condition. 17. The system of claim 16, wherein the processor is further configured to:
apply transfer functions to at least one of the first and second system performance parameters to thereby generate phase compensated performance data representative of a steady state relationship between the first and second engine performance parameters; and use the phase compensated performance data to determine the measured performance characteristic value of the system. 18. The system of claim 16, wherein the processor is further configured to:
calculate, for each corrected performance characteristic value, an estimate of the first engine performance parameter at a predetermined value of the second engine performance parameter using two previously stored performance characteristic curves representative of the steady state relationship between the first and second engine performance parameters. | 2,800 |
11,204 | 11,204 | 15,287,561 | 2,894 | A leadframe ( 100 ) for electronic systems comprising a first sub-leadframe ( 110 ) connected by links ( 150 ) to a second sub-leadframe ( 120 ), the first and second sub-leadframe connected by tiebars ( 111, 121 ) to a frame ( 130 ); and each link having a neck ( 151 ) suitable for bending the link, the necks arrayed in a line ( 170 ) operable as the axis for bending the second sub-leadframe towards the first sub-leadframe with the necks operable as rotation pivots. | 1. A leadframe for electronic systems comprising:
a first sub-leadframe connected by links to a second sub-leadframe, the first and second sub-leadframe connected by tiebars to a frame; and each link having a neck suitable for bending the link, the necks arrayed in a line operable as the axis for bending the second sub-leadframe towards the first sub-leadframe with the necks operable as rotation pivots. 2. The leadframe of claim 1 wherein the first and second sub-leadframes and the frame are cut from a flat metal sheet having a first surface and an opposite second surface. 3. The leadframe of claim 2 wherein the first sub-leadframe includes a pad suitable as substrate of the electronic system. 4. The leadframe of claim 3 wherein the pad further includes through-holes extending into elongated grooves across the first surface, the through-holes and the grooves suitable for channeling a viscous encapsulation compound. 5. The leadframe of claim 3 wherein the second sub-leadframe includes a set of leads having wide portions in an area approximately matching the area of the pad, and narrow portions outside the matched area. 6. The leadframe of claim 5 wherein the wide portions of the leads have first recesses in the first surface and second recesses in the second surface. 7. The leadframe of claim 6 wherein the first and the second recesses of the leads have a metallurgical configuration suitable for solder attachment. 8. A packaged electronic system comprising:
a vertical stack including a second sub-leadframe aligned over and insulated from a first sub-leadframe, the first sub-leadframe having a pad suitable as substrate of the system, and the second sub-leadframe having leads with narrow and wide portions, the wide portions having first recesses facing the pad, and second recesses facing away from the pad; a semiconductor chip disposed between the first recesses and the pad; discrete components attached to the second recesses, topping the second subs leadframe; and the vertical stack including the first sub-leadframe, the chip, the second sub-leadframe, and the components encapsulated in a packaging compound, leaving the leads un-encapsulated. 9. The system of claim 8 wherein the discrete components include passive components such as capacitors, resistors, and inductances. 10. The system of claim 8 wherein the insulation between the first and second sub-leadframe derives from packaging compound channeled between the first and second sub-leadframes during the encapsulation process. | A leadframe ( 100 ) for electronic systems comprising a first sub-leadframe ( 110 ) connected by links ( 150 ) to a second sub-leadframe ( 120 ), the first and second sub-leadframe connected by tiebars ( 111, 121 ) to a frame ( 130 ); and each link having a neck ( 151 ) suitable for bending the link, the necks arrayed in a line ( 170 ) operable as the axis for bending the second sub-leadframe towards the first sub-leadframe with the necks operable as rotation pivots.1. A leadframe for electronic systems comprising:
a first sub-leadframe connected by links to a second sub-leadframe, the first and second sub-leadframe connected by tiebars to a frame; and each link having a neck suitable for bending the link, the necks arrayed in a line operable as the axis for bending the second sub-leadframe towards the first sub-leadframe with the necks operable as rotation pivots. 2. The leadframe of claim 1 wherein the first and second sub-leadframes and the frame are cut from a flat metal sheet having a first surface and an opposite second surface. 3. The leadframe of claim 2 wherein the first sub-leadframe includes a pad suitable as substrate of the electronic system. 4. The leadframe of claim 3 wherein the pad further includes through-holes extending into elongated grooves across the first surface, the through-holes and the grooves suitable for channeling a viscous encapsulation compound. 5. The leadframe of claim 3 wherein the second sub-leadframe includes a set of leads having wide portions in an area approximately matching the area of the pad, and narrow portions outside the matched area. 6. The leadframe of claim 5 wherein the wide portions of the leads have first recesses in the first surface and second recesses in the second surface. 7. The leadframe of claim 6 wherein the first and the second recesses of the leads have a metallurgical configuration suitable for solder attachment. 8. A packaged electronic system comprising:
a vertical stack including a second sub-leadframe aligned over and insulated from a first sub-leadframe, the first sub-leadframe having a pad suitable as substrate of the system, and the second sub-leadframe having leads with narrow and wide portions, the wide portions having first recesses facing the pad, and second recesses facing away from the pad; a semiconductor chip disposed between the first recesses and the pad; discrete components attached to the second recesses, topping the second subs leadframe; and the vertical stack including the first sub-leadframe, the chip, the second sub-leadframe, and the components encapsulated in a packaging compound, leaving the leads un-encapsulated. 9. The system of claim 8 wherein the discrete components include passive components such as capacitors, resistors, and inductances. 10. The system of claim 8 wherein the insulation between the first and second sub-leadframe derives from packaging compound channeled between the first and second sub-leadframes during the encapsulation process. | 2,800 |
11,205 | 11,205 | 13,947,210 | 2,864 | A multilevel triggering system of a signal analysis instrument outputs a complex trigger signal. The triggering system includes a trigger controlled buffer for receiving and buffering an input signal, triggering function modules, and a triggering matrix. Each triggering function module performs a corresponding triggering function for detecting a corresponding triggering condition. The triggering matrix includes multiple triggering levels, each of which is configurable to include at least one trigger block and each trigger block being configurable to implement one of the triggering function modules. Each trigger block generates a corresponding block trigger when the triggering condition of the corresponding triggering function module is detected in the buffered input signal. Each triggering level generates a corresponding level trigger when the at least one trigger block in the triggering level generates the corresponding block trigger, and the triggering matrix generates the complex trigger signal when the triggering levels generate corresponding level triggers. | 1. A multilevel triggering system of a signal analysis instrument for outputting a complex trigger signal, the system comprising:
a trigger controlled buffer configured to receive and buffer an input signal; a plurality of triggering function modules, each triggering function module being configured to perform a corresponding triggering function for detecting a corresponding triggering condition; and a triggering matrix comprising a plurality of triggering levels, each triggering level being configurable to include at least one trigger block and each trigger block being configurable to implement one of the plurality of triggering function modules, each trigger block generating a corresponding block trigger when the triggering condition of the corresponding triggering function module is detected in the buffered input signal, wherein each triggering level of the plurality of triggering levels is configured to generate a corresponding level trigger when the at least one trigger block in the triggering level generates the corresponding block trigger, and wherein the triggering matrix is configured to generate the complex trigger signal when the plurality of triggering levels generate corresponding level triggers. 2. The system of claim 1, further comprising:
a trigger block library configured to store the plurality of triggering function modules, the trigger block library being accessible by the triggering matrix for populating the at least one trigger block of each triggering level. 3. The system of claim 1, wherein each triggering level of the plurality of triggering levels is further configured to receives a different portion of the buffered input signal. 4. The system of claim 1, wherein a second triggering level of the plurality of triggering levels receives the buffered input signal only when a preceding first triggering level of the plurality of triggering levels generates a corresponding first level trigger. 5. The system of claim 4, wherein a third triggering level of the plurality of triggering levels receives the buffered input signal only when the second triggering level of the plurality of triggering levels generates a corresponding second level trigger. 6. The system of claim 1, wherein the plurality of triggering function modules have uniform input and output interfaces. 7. The system of claim 1, wherein at least one parameter of the triggering condition of each triggering function module is configurable by a user. 8. The system of claim 1, wherein the trigger controlled buffer comprises a first-in first-out (FIFO) buffer. 9. The system of claim 2, wherein each trigger block comprises a copy of one of the plurality of triggering modules from the trigger block library. 10. The system of claim 9, wherein the plurality of triggering function modules include at least two of a frequency mask triggering function, a power level triggering function, a time domain triggering function, a frequency shape triggering function, a time-frequency triggering function, and a modulation based triggering function. 11. A computer readable medium storing software, executable by a processor, for multilevel triggering of a signal analysis instrument to output a complex trigger signal, the computer readable medium comprising:
first level code including a plurality of first trigger blocks configurable to implement a corresponding plurality of different triggering function modules for implementing different trigger functions responsive to corresponding triggering conditions, each first trigger block generating a corresponding first block trigger when the triggering conditions of the triggering function modules are detected in a first portion of an input signal, and the first level code generating a corresponding first level trigger in accordance with a first logical expression incorporating the corresponding first block triggers generated by the first trigger blocks, respectively; and second level code including a plurality of second trigger blocks configurable to implement a corresponding plurality of different triggering function modules for implementing different trigger functions responsive to corresponding triggering conditions, each second trigger block generating a corresponding second block trigger when the triggering conditions of the triggering function modules are detected in a second portion of the input signal, and the second level code generating a corresponding second level trigger in accordance with a second logical expression incorporating the corresponding second block triggers generated by the second trigger blocks, respectively, wherein the complex trigger signal is generated when the first and second level codes generate corresponding first and second level triggers, respectively. 12. The computer readable medium of claim 11, wherein the input signal is buffered by a trigger controlled buffer in order to provide the first and second portions of the input signal to the first and second level codes, respectively. 13. The computer readable medium of claim 11, further comprising:
a trigger block library for storing the different triggering function modules, each triggering function module being configured to perform a corresponding triggering function for detecting a corresponding triggering condition, wherein the first and second trigger blocks are populated using the plurality of different triggering function modules from the trigger block library. 14. The system of claim 13, wherein the plurality of different triggering function modules include at least two of a frequency mask triggering function, a power level triggering function, a time domain triggering function, a frequency shape triggering function, a time-frequency triggering function, and a modulation based triggering function. 15. The system of claim 14, wherein the plurality of different triggering function modules have uniform input and output interfaces. 16. A signal analysis instrument comprising:
a radio frequency (RF) downconverter configured to receive an RF input signal from a test device and to provide a downconverted analog input signal; an analog to digital converter (ADC) configured to convert the analog input signal to a digital input signal; and a triggering system configured to receive the digital input signal and to selectively output a complex trigger signal based on characteristics of the digital input signal, the triggering system comprising:
a trigger controlled buffer configured to buffer the digital input signal and to selectively output a detected signal in response to the complex trigger signal;
a trigger block library configured to store a plurality of triggering function modules, each triggering function module being configured to perform a corresponding triggering function for detecting a corresponding triggering condition; and
a triggering matrix comprising a plurality of triggering levels, each triggering level being configurable to include at least one trigger block and each trigger block being configurable to implement one of the plurality of triggering function modules from the trigger block library, each trigger block generating a corresponding block trigger when the triggering condition of the corresponding triggering function module is detected in the buffered input signal;
wherein each triggering level of the plurality of triggering levels is configured to generate a corresponding level trigger when the at least one trigger block in the triggering level generates the corresponding block trigger, and wherein the triggering matrix is configured to generate the complex trigger signal when the plurality of triggering levels generate corresponding level triggers. 17. The signal analysis instrument of claim 16, further comprising:
a processing system configured to analyze the detected signal output by the trigger controlled buffer in response to the complex trigger signal selectively output by the triggering system, 18. The signal analysis instrument of claim 16, wherein the triggering system comprises at least one field-programmable gate array (FPGA) configured to implement functionality of at least the triggering matrix. 19. The signal analysis instrument of claim 16, wherein the triggering system comprises at least one central processing unit (CPU) configured to implement functionality of at least the triggering matrix. 20. The signal analysis instrument of claim 1, wherein each triggering level of the plurality of triggering levels is further configured to receives a different portion of the buffered input signal from the trigger controlled buffer. | A multilevel triggering system of a signal analysis instrument outputs a complex trigger signal. The triggering system includes a trigger controlled buffer for receiving and buffering an input signal, triggering function modules, and a triggering matrix. Each triggering function module performs a corresponding triggering function for detecting a corresponding triggering condition. The triggering matrix includes multiple triggering levels, each of which is configurable to include at least one trigger block and each trigger block being configurable to implement one of the triggering function modules. Each trigger block generates a corresponding block trigger when the triggering condition of the corresponding triggering function module is detected in the buffered input signal. Each triggering level generates a corresponding level trigger when the at least one trigger block in the triggering level generates the corresponding block trigger, and the triggering matrix generates the complex trigger signal when the triggering levels generate corresponding level triggers.1. A multilevel triggering system of a signal analysis instrument for outputting a complex trigger signal, the system comprising:
a trigger controlled buffer configured to receive and buffer an input signal; a plurality of triggering function modules, each triggering function module being configured to perform a corresponding triggering function for detecting a corresponding triggering condition; and a triggering matrix comprising a plurality of triggering levels, each triggering level being configurable to include at least one trigger block and each trigger block being configurable to implement one of the plurality of triggering function modules, each trigger block generating a corresponding block trigger when the triggering condition of the corresponding triggering function module is detected in the buffered input signal, wherein each triggering level of the plurality of triggering levels is configured to generate a corresponding level trigger when the at least one trigger block in the triggering level generates the corresponding block trigger, and wherein the triggering matrix is configured to generate the complex trigger signal when the plurality of triggering levels generate corresponding level triggers. 2. The system of claim 1, further comprising:
a trigger block library configured to store the plurality of triggering function modules, the trigger block library being accessible by the triggering matrix for populating the at least one trigger block of each triggering level. 3. The system of claim 1, wherein each triggering level of the plurality of triggering levels is further configured to receives a different portion of the buffered input signal. 4. The system of claim 1, wherein a second triggering level of the plurality of triggering levels receives the buffered input signal only when a preceding first triggering level of the plurality of triggering levels generates a corresponding first level trigger. 5. The system of claim 4, wherein a third triggering level of the plurality of triggering levels receives the buffered input signal only when the second triggering level of the plurality of triggering levels generates a corresponding second level trigger. 6. The system of claim 1, wherein the plurality of triggering function modules have uniform input and output interfaces. 7. The system of claim 1, wherein at least one parameter of the triggering condition of each triggering function module is configurable by a user. 8. The system of claim 1, wherein the trigger controlled buffer comprises a first-in first-out (FIFO) buffer. 9. The system of claim 2, wherein each trigger block comprises a copy of one of the plurality of triggering modules from the trigger block library. 10. The system of claim 9, wherein the plurality of triggering function modules include at least two of a frequency mask triggering function, a power level triggering function, a time domain triggering function, a frequency shape triggering function, a time-frequency triggering function, and a modulation based triggering function. 11. A computer readable medium storing software, executable by a processor, for multilevel triggering of a signal analysis instrument to output a complex trigger signal, the computer readable medium comprising:
first level code including a plurality of first trigger blocks configurable to implement a corresponding plurality of different triggering function modules for implementing different trigger functions responsive to corresponding triggering conditions, each first trigger block generating a corresponding first block trigger when the triggering conditions of the triggering function modules are detected in a first portion of an input signal, and the first level code generating a corresponding first level trigger in accordance with a first logical expression incorporating the corresponding first block triggers generated by the first trigger blocks, respectively; and second level code including a plurality of second trigger blocks configurable to implement a corresponding plurality of different triggering function modules for implementing different trigger functions responsive to corresponding triggering conditions, each second trigger block generating a corresponding second block trigger when the triggering conditions of the triggering function modules are detected in a second portion of the input signal, and the second level code generating a corresponding second level trigger in accordance with a second logical expression incorporating the corresponding second block triggers generated by the second trigger blocks, respectively, wherein the complex trigger signal is generated when the first and second level codes generate corresponding first and second level triggers, respectively. 12. The computer readable medium of claim 11, wherein the input signal is buffered by a trigger controlled buffer in order to provide the first and second portions of the input signal to the first and second level codes, respectively. 13. The computer readable medium of claim 11, further comprising:
a trigger block library for storing the different triggering function modules, each triggering function module being configured to perform a corresponding triggering function for detecting a corresponding triggering condition, wherein the first and second trigger blocks are populated using the plurality of different triggering function modules from the trigger block library. 14. The system of claim 13, wherein the plurality of different triggering function modules include at least two of a frequency mask triggering function, a power level triggering function, a time domain triggering function, a frequency shape triggering function, a time-frequency triggering function, and a modulation based triggering function. 15. The system of claim 14, wherein the plurality of different triggering function modules have uniform input and output interfaces. 16. A signal analysis instrument comprising:
a radio frequency (RF) downconverter configured to receive an RF input signal from a test device and to provide a downconverted analog input signal; an analog to digital converter (ADC) configured to convert the analog input signal to a digital input signal; and a triggering system configured to receive the digital input signal and to selectively output a complex trigger signal based on characteristics of the digital input signal, the triggering system comprising:
a trigger controlled buffer configured to buffer the digital input signal and to selectively output a detected signal in response to the complex trigger signal;
a trigger block library configured to store a plurality of triggering function modules, each triggering function module being configured to perform a corresponding triggering function for detecting a corresponding triggering condition; and
a triggering matrix comprising a plurality of triggering levels, each triggering level being configurable to include at least one trigger block and each trigger block being configurable to implement one of the plurality of triggering function modules from the trigger block library, each trigger block generating a corresponding block trigger when the triggering condition of the corresponding triggering function module is detected in the buffered input signal;
wherein each triggering level of the plurality of triggering levels is configured to generate a corresponding level trigger when the at least one trigger block in the triggering level generates the corresponding block trigger, and wherein the triggering matrix is configured to generate the complex trigger signal when the plurality of triggering levels generate corresponding level triggers. 17. The signal analysis instrument of claim 16, further comprising:
a processing system configured to analyze the detected signal output by the trigger controlled buffer in response to the complex trigger signal selectively output by the triggering system, 18. The signal analysis instrument of claim 16, wherein the triggering system comprises at least one field-programmable gate array (FPGA) configured to implement functionality of at least the triggering matrix. 19. The signal analysis instrument of claim 16, wherein the triggering system comprises at least one central processing unit (CPU) configured to implement functionality of at least the triggering matrix. 20. The signal analysis instrument of claim 1, wherein each triggering level of the plurality of triggering levels is further configured to receives a different portion of the buffered input signal from the trigger controlled buffer. | 2,800 |
11,206 | 11,206 | 14,463,907 | 2,837 | There is disclosed a music yielding system including a controller, an outlet, a tracer, and a portal. The outlet may yield one or more sets of musical notes conforming to one or more requisites. The controller may cause one or more criteria to be set determining conformance of one or more of the sets of musical notes to one or more of the requisites. The tracer may calculate and transmit one or more correlations within one or more of the sets of musical notes. The portal may transfer one or more of the sets of musical note between one or more origins and one or more destinations. | 1. A music-yielding system, comprising:
one or more outlets comprising:
circuits and software to perform actions comprising:
yielding one or more outlet-sets comprising:
one or more musical notes
conforming in one or more predetermined minimum degrees to one or more requisites; and
setting one or more set-criteria determining one or more degrees of conformance of one or more of the outlet-sets to one or more of the requisites; and
one or more controllers comprising:
circuits and software to perform actions comprising:
receiving one or more controller-input indications comprising:
one or more of the requisites; and
causing one or more of the set-criteria to be set to one or more set-functions formulated from one or more set-parameters comprising:
one or more of the requisites. 2. The music-yielding system of claim 1, further comprising:
one or more tracers comprising:
circuits and software to perform actions comprising:
calculating one or more correlations within one or more of the outlet-sets; and
transmitting one or more tracer-output indications comprising:
one or more of the correlations. 3. The music-yielding system of claim 2,
wherein the transmitting one or more of the tracer-output indications further comprises:
performing in near-synchrony with one or more progressions of one or more of the outlet-sets;
wherein one or more of the requisites further comprises:
one or more selections from the group consisting of:
one or more note-set lengths, one or more note-ranges, one or more maximum note-distances, one or more starting notes, one or more first note-directions, one or more first note-topologies, one or more present musical interval-sets and one or more absent musical interval-sets; and
wherein one or more of the correlations further comprises:
one or more selections from the group consisting of:
one or more musical parts, one or more musical voices, one or more echoic memory note depths, one or more note values, one or more musical intervals, one or more second note-topologies and one or more second note-directions. 4. The music-yielding system of claim 1, further comprising:
one or more portals comprising:
circuits and software to perform actions comprising:
receiving one or more portal-input indications comprising:
one or more portal-origins; and
one or more portal-destinations; and
transferring one or more portal-objects from one or more of the portal-origins to one or more of the portal-destinations. 5. The music-yielding system of claim 4,
wherein one or more of the portal-objects further comprises:
one or more portal-sets comprising:
one or more musical notes; and
wherein one or more of the controllers comprising:
circuits and software performs actions further comprising:
calculating one or more imputed-requisites of one or more of the portal-sets; and
transmitting one or more imputed-output indications comprising:
one or more of the imputed-requisites. 6. The music-yielding system of claim 4,
wherein one or more of the portal-objects further comprises:
one or more portal-sets comprising:
one or more musical notes; and
wherein the system further comprises:
one or more tracers comprising:
circuits and software to perform actions comprising:
calculating one or more correlations within one or more of the portal-sets; and
transmitting one or more tracer-output indications comprising:
one or more of the correlations. 7. The music-yielding system of claim 6,
wherein the transmitting one or more of the tracer-output indications further comprises:
performing in near-synchrony with one or more progressions of one or more of the portal-sets;
wherein one or more of the requisites further comprises:
one or more selections from the group consisting of:
one or more note-set lengths, one or more note-ranges, one or more maximum note-distances, one or more starting notes, one or more first note-directions, one or more first note-topologies, one or more present musical interval-sets, one or more absent musical interval-sets and one or more recital-sets comprising:
one or more musical notes;
wherein one or more of the portal-objects further comprises:
one or more selections from the group consisting of:
one or more of the outlet-sets, one or more of the predetermined minimum degrees of conforming, one or more of the requisites, one or more of the set-criteria, one or more of the controller-input indications, one or more of the set-functions, one or more of the set-parameters, one or more of the correlations and one or more of the tracer-output indications;
wherein one or more of the portal-origins further comprises:
one or more selections from the group consisting of:
one or more of the outlets, one or more of the controllers, one or more first processes comprised within one or more environments external to the system and one or more first data files comprised within one or more of the environments external to the system;
wherein one or more of the portal-destinations further comprises:
one or more selections from the group consisting of:
one or more of the outlets, one or more of the controllers, one or more of the tracers, one or more second processes comprised within one or more of the environments external to the system and one or more second data files comprised within one or more of the environments external to the system; and
wherein one or more of the correlations further comprises:
one or more selections from the group consisting of:
one or more musical parts, one or more musical voices, one or more echoic memory note depths, one or more note values, one or more musical intervals, one or more second note-topologies and one or more second note-directions. 8. The music-yielding system of claim 1,
wherein one or more of the outlets comprising:
circuits and software performs actions further comprising:
transmitting one or more outlet-effects of one or more of the requisites upon one or more of the outlets; and
wherein one or more of the controllers comprising:
circuits and software performs actions further comprising:
receiving one or more of the outlet-effects; and
transmitting one or more controller-output indications comprising:
one or more of the outlet-effects. 9. The music-yielding system of claim 1,
wherein one or more of the outlets are comprised within one or more pluralities of two or more of the outlets; wherein one or more of the controllers are comprised within one or more pluralities of two or more of the controllers; wherein one or more of the outlets in one or more of the pluralities of outlets comprises:
circuits and software to perform actions comprising:
yielding one or more outlet-sets comprising:
one or more musical notes
conforming in one or more predetermined minimum degrees to one or more requisites; and
setting one or more set-criteria determining one or more degrees of conformance of one or more of the outlet-sets to one or more of the requisites;
wherein one or more of the controllers in one or more of the pluralities of controllers comprises:
circuits and software to perform actions comprising:
receiving one or more controller-input indications comprising:
one or more of the requisites; and
causing one or more of the set-criteria to be set to one or more set-functions formulated from one or more set-parameters comprising:
one or more of the requisites;
wherein one or more of the outlets in one or more of the pluralities of outlets comprising:
circuits and software performs actions further comprising:
assembling one or more set-families comprising:
one or more of the outlet-sets
conforming in one or more predetermined minimum degrees to one or more requisite-family associations comprising:
one or more of the requisites of one or more of the controllers in one or more of the pluralities of controllers; and
one or more of the set-families; and
setting one or more family-criteria determining one or more degrees of conformance of one or more of the set-families to one or more of the requisite-family associations; and
wherein one or more of the controllers in one or more of the pluralities of controllers comprising:
circuits and software performs actions further comprising:
receiving one or more plurality-input indications comprising:
one or more of the requisite-family associations; and
causing one or more of the family-criteria to be set to one or more family-functions formulated from one or more family-parameters comprising:
one or more of the requisite-family associations. 10. The music-yielding system of claim 1, wherein one or more of the controllers comprising:
circuits and software performs actions further comprising:
calculating one or more counts of one or more of the outlet-sets conforming in one or more predetermined minimum degrees to one or more of the requisites; and
transmitting one or more counter-output indications comprising:
one or more of the counts. 11. A method for controlling one or more music-yielding outlets, the method comprising:
receiving one or more controlling-input indications comprising:
one or more requisites of one or more outlet-sets comprising:
one or more notes of the music; and
causing one or more set-criteria determining one or more degrees of conformance of one or more of the outlet-sets to one or more of the requisites to be set to one or more set-functions formulated from one or more set-parameters comprising: one or more of the requisites. 12. The method for controlling one or more music-yielding outlets of claim 11, the method further comprising:
calculating one or more correlations within one or more of the outlet-sets; and transmitting one or more tracing-output indications comprising:
one or more of the correlations. 13. The method for controlling one or more music-yielding outlets of claim 12,
wherein the transmitting one or more of the tracing-output indications further comprises:
performing in near-synchrony with one or more progressions of one or more of the outlet-sets;
wherein one or more of the requisites further comprises:
one or more selected from the group consisting of:
one or more note-set lengths, one or more note-ranges, one or more maximum note-distances, one or more starting notes, one or more first note-directions, one or more first note-topologies, one or more present musical interval-sets and one or more absent musical interval-sets; and
wherein one or more of the correlations further comprises:
one or more selected from the group consisting of:
one or more musical parts, one or more musical voices, one or more echoic memory note depths, one or more note values, one or more musical intervals, one or more second note-topologies and one or more second note-directions. 14. The method for controlling one or more music-yielding outlets of claim 11, the method further comprising:
receiving one or more porting-input indications comprising:
one or more porting-origins; and
one or more porting-destinations; and
transferring one or more porting-objects from one or more of the porting-origins to one or more of the porting-destinations. 15. The method for controlling one or more music-yielding outlets of claim 14,
wherein one or more of the porting-objects further comprises:
one or more porting-sets comprising:
one or more musical notes; and
wherein the method further comprises:
calculating one or more imputed-requisites of one or more of the porting-sets; and
transmitting one or more imputed-output indications comprising:
one or more of the imputed-requisites. 16. The method for controlling one or more music-yielding outlets of claim 14,
wherein one or more of the porting-objects further comprises:
one or more porting-sets comprising:
one or more musical notes; and
wherein the method further comprises:
calculating one or more correlations within one or more of the porting-sets; and
transmitting one or more tracing-output indications comprising:
one or more of the correlations. 17. The method for controlling one or more music-yielding outlets of claim 16, wherein the transmitting one or more of the tracing-output indications further comprises:
performing in near-synchrony with one or more progressions of one or more of the porting-sets; wherein one or more of the requisites further comprises:
one or more selected from the group consisting of:
one or more note-set lengths, one or more note-ranges, one or more maximum note-distances, one or more starting notes, one or more first note-directions, one or more first note-topologies, one or more present musical interval-sets, one or more absent musical interval-sets and one or more recital-sets comprising:
one or more musical notes;
wherein one or more of the porting-objects further comprises:
one or more selections from the group consisting of:
one or more of the outlet-sets, one or more of the requisites, one or more of the set-criteria, one or more of the controlling-input indications, one or more of the set-functions, one or more of the set-parameters, one or more of the correlations and one or more of the tracing-output indications;
wherein one or more of the porting-origins further comprises:
one or more selected from the group consisting of:
one or more of the music-yielding outlets, the receiving one or more controlling-input indications, the causing one or more set-criteria to be set, one or more first processes comprised within one or more environments external to one or more of the music-yielding outlets and one or more first data files comprised within one or more of the environments external to one or more of the music-yielding outlets;
wherein one or more of the porting-destinations further comprises:
one or more selected from the group consisting of:
one or more of the music-yielding outlets, the receiving one or more controlling-input indications, the causing one or more set-criteria to be set, the calculating one or more correlations, one or more second processes comprised within one or more of the environments external to one or more of the music-yielding outlets and one or more second data files comprised within one or more of the environments external to one or more of the music-yielding outlets; and
wherein one or more of the correlations further comprises:
one or more selected from the group consisting of:
one or more musical parts, one or more musical voices, one or more echoic memory note depths, one or more note values, one or more musical intervals, one or more second note-topologies and one or more second note-directions. 18. The method for controlling one or more music-yielding outlets of claim 11, the method further comprising:
receiving one or more outlet-effects of one or more of the requisites upon one or more of the music-yielding outlets; transmitting one or more controlling-output indications comprising:
one or more of the outlet-effects. 19. The method for controlling one or more music-yielding outlets of claim 11,
wherein the method further controls one or more pluralities of two or more of the music-yielding outlets, one or more of the music-yielding outlets in one or more of the pluralities of music-yielding outlets further assembling one or more set-families comprising:
one or more of the outlet-sets;
wherein the method comprises:
receiving one or more controlling-input indications comprising:
one or more requisites of one or more outlet-sets comprising:
one or more notes of the music; and
causing one or more set-criteria determining one or more degrees of conformance of one or more of the outlet-sets to one or more of the requisites to be set to one or more set-functions formulated from one or more set-parameters comprising:
one or more of the requisites; and
wherein the method further comprises:
receiving one or more plurality-input indications comprising:
one or more requisite-family associations comprising:
one or more of the requisites; and
one or more of the set-families; and
causing one or more family-criteria determining one or more degrees of conformance of one or more of the set-families to be set to one or more family-functions formulated from one or more family-parameters comprising:
one or more of the requisite-family associations. 20. The method for controlling one or more music-yielding outlets of claim 11, the method further comprising:
calculating one or more counts of one or more of the outlet-sets conforming in one or more predetermined minimum degrees to one or more of the requisites; and transmitting one or more counting-output indications comprising:
one or more of the counts. 21. A computing device for controlling one or more music-yielding outlets, the computing device comprising:
one or more non-transitory machine readable storage mediums storing one or more instructions that, when executed, cause the computing device to perform actions comprising:
receiving one or more controlling-input indications comprising:
one or more requisites of one or more outlet-sets comprising:
one or more notes of the music; and
causing one or more set-criteria determining one or more degrees of conformance of one or more of the outlet-sets to one or more of the requisites to be set to one or more set-functions formulated from one or more set-parameters comprising:
one or more of the requisites. 22. The computing device for controlling one or more music-yielding outlets of claim 21,
wherein the actions performed further comprise:
receiving one or more porting-input indications comprising:
one or more porting-origins; and
one or more porting-destinations; and
transferring one or more porting-objects from one or more of the porting-origins to one or more of the porting-destinations. 23. The computing device for controlling one or more music-yielding outlets of claim 22,
wherein one or more of the porting-objects further comprises:
one or more porting-sets comprising:
one or more musical notes; and
wherein the actions performed further comprise:
calculating one or more imputed-requisites of one or more of the porting-sets; and
transmitting one or more imputed-output indications comprising:
one or more of the imputed-requisites. 24. The computing device for controlling one or more music-yielding outlets of claim 22, wherein the actions performed further comprise:
calculating one or more counts of one or more of the outlet-sets conforming in one or more predetermined minimum degrees to one or more of the requisites; and transmitting one or more counting-output indications comprising:
one or more of the counts;
wherein one or more of the requisites further comprises:
one or more selected from the group consisting of:
one or more note-set lengths, one or more note-ranges, one or more maximum note-distances, one or more starting notes, one or more note-directions, one or more note-topologies, one or more present musical interval-sets, one or more absent musical interval-sets and one or more recital-sets comprising:
one or more musical notes;
wherein one or more of the porting-objects further comprises:
one or more selections from the group consisting of:
one or more of the outlet-sets, one or more of the requisites, one or more of the set-criteria, one or more of the controlling-input indications, one or more of the set-functions and one or more of the set-parameters;
wherein one or more of the porting-origins further comprises:
one or more selected from the group consisting of:
one or more of the music-yielding outlets, the receiving one or more controlling-input indications, the causing one or more set-criteria to be set, one or more first processes comprised within one or more environments external to one or more of the music-yielding outlets and one or more first data files comprised within one or more of the environments external to one or more of the music-yielding outlets; and
wherein one or more of the porting-destinations further comprises:
one or more selected from the group consisting of:
one or more of the music-yielding outlets, the receiving one or more controlling-input indications, the causing one or more set-criteria to be set, one or more second processes comprised within one or more of the environments external to one or more of the music-yielding outlets and one or more second data files comprised within one or more of the environments external to one or more of the music-yielding outlets. 25. The computing device for controlling one or more music-yielding outlets of claim 21, wherein the actions performed further comprise:
receiving one or more outlet-effects of one or more of the requisites upon one or more of the music-yielding outlets; and transmitting one or more controlling-output indications comprising:
one or more of the outlet-effects. 26. The computing device for controlling one or more music-yielding outlets of claim 21, wherein the computing device further controls one or more pluralities of two or more of the music-yielding outlets, one or more of the music-yielding outlets in one or more of the pluralities of music-yielding outlets further assembling one or more set-families comprising:
one or more of the outlet-sets;
wherein the computing device comprises:
one or more non-transitory machine readable storage mediums storing one or more instructions that, when executed, cause the computing device to perform actions comprising:
receiving one or more controlling-input indications comprising:
one or more requisites of one or more outlet-sets comprising:
one or more notes of the music; and
causing one or more set-criteria determining one or more degrees of conformance of one or more of the outlet-sets to one or more of the requisites to be set to one or more set-functions formulated from one or more set-parameters comprising:
one or more of the requisites; and
wherein the actions performed further comprise:
receiving one or more plurality-input indications comprising:
one or more requisite-family associations comprising:
one or more of the requisites; and
one or more of the set-families; and
causing one or more family-criteria determining one or more degrees of conformance of one or more of the set-families to be set to one or more family-functions formulated from one or more family-parameters comprising:
one or more of the requisite-family associations. 27. The computing device for controlling one or more music-yielding outlets of claim 21, further comprising:
one or more processors; one or more memories; and one or more storage-devices. 28. A computing device for tracing music, the computing device comprising:
one or more non-transitory machine readable storage mediums storing one or more instructions that, when executed, cause the computing device to perform actions comprising:
calculating one or more correlations within one or more tracing-sets comprising:
one or more notes of the music; and
transmitting one or more tracing-output indications comprising:
one or more of the correlations. 29. The computing device for tracing music of claim 28,
wherein the transmitting one or more of the tracing-output indications further comprises:
performing in near-synchrony with one or more progressions of one or more of the tracing-sets; and
wherein one or more of the correlations further comprises:
one or more selected from the group consisting of:
one or more musical parts, one or more musical voices, one or more echoic memory note depths, one or more note values, one or more musical intervals, one or more note-topologies and one or more note-directions. 30. The computing device for tracing music of claim 28, further comprising:
one or more processors; one or more memories; and one or more storage-devices. | There is disclosed a music yielding system including a controller, an outlet, a tracer, and a portal. The outlet may yield one or more sets of musical notes conforming to one or more requisites. The controller may cause one or more criteria to be set determining conformance of one or more of the sets of musical notes to one or more of the requisites. The tracer may calculate and transmit one or more correlations within one or more of the sets of musical notes. The portal may transfer one or more of the sets of musical note between one or more origins and one or more destinations.1. A music-yielding system, comprising:
one or more outlets comprising:
circuits and software to perform actions comprising:
yielding one or more outlet-sets comprising:
one or more musical notes
conforming in one or more predetermined minimum degrees to one or more requisites; and
setting one or more set-criteria determining one or more degrees of conformance of one or more of the outlet-sets to one or more of the requisites; and
one or more controllers comprising:
circuits and software to perform actions comprising:
receiving one or more controller-input indications comprising:
one or more of the requisites; and
causing one or more of the set-criteria to be set to one or more set-functions formulated from one or more set-parameters comprising:
one or more of the requisites. 2. The music-yielding system of claim 1, further comprising:
one or more tracers comprising:
circuits and software to perform actions comprising:
calculating one or more correlations within one or more of the outlet-sets; and
transmitting one or more tracer-output indications comprising:
one or more of the correlations. 3. The music-yielding system of claim 2,
wherein the transmitting one or more of the tracer-output indications further comprises:
performing in near-synchrony with one or more progressions of one or more of the outlet-sets;
wherein one or more of the requisites further comprises:
one or more selections from the group consisting of:
one or more note-set lengths, one or more note-ranges, one or more maximum note-distances, one or more starting notes, one or more first note-directions, one or more first note-topologies, one or more present musical interval-sets and one or more absent musical interval-sets; and
wherein one or more of the correlations further comprises:
one or more selections from the group consisting of:
one or more musical parts, one or more musical voices, one or more echoic memory note depths, one or more note values, one or more musical intervals, one or more second note-topologies and one or more second note-directions. 4. The music-yielding system of claim 1, further comprising:
one or more portals comprising:
circuits and software to perform actions comprising:
receiving one or more portal-input indications comprising:
one or more portal-origins; and
one or more portal-destinations; and
transferring one or more portal-objects from one or more of the portal-origins to one or more of the portal-destinations. 5. The music-yielding system of claim 4,
wherein one or more of the portal-objects further comprises:
one or more portal-sets comprising:
one or more musical notes; and
wherein one or more of the controllers comprising:
circuits and software performs actions further comprising:
calculating one or more imputed-requisites of one or more of the portal-sets; and
transmitting one or more imputed-output indications comprising:
one or more of the imputed-requisites. 6. The music-yielding system of claim 4,
wherein one or more of the portal-objects further comprises:
one or more portal-sets comprising:
one or more musical notes; and
wherein the system further comprises:
one or more tracers comprising:
circuits and software to perform actions comprising:
calculating one or more correlations within one or more of the portal-sets; and
transmitting one or more tracer-output indications comprising:
one or more of the correlations. 7. The music-yielding system of claim 6,
wherein the transmitting one or more of the tracer-output indications further comprises:
performing in near-synchrony with one or more progressions of one or more of the portal-sets;
wherein one or more of the requisites further comprises:
one or more selections from the group consisting of:
one or more note-set lengths, one or more note-ranges, one or more maximum note-distances, one or more starting notes, one or more first note-directions, one or more first note-topologies, one or more present musical interval-sets, one or more absent musical interval-sets and one or more recital-sets comprising:
one or more musical notes;
wherein one or more of the portal-objects further comprises:
one or more selections from the group consisting of:
one or more of the outlet-sets, one or more of the predetermined minimum degrees of conforming, one or more of the requisites, one or more of the set-criteria, one or more of the controller-input indications, one or more of the set-functions, one or more of the set-parameters, one or more of the correlations and one or more of the tracer-output indications;
wherein one or more of the portal-origins further comprises:
one or more selections from the group consisting of:
one or more of the outlets, one or more of the controllers, one or more first processes comprised within one or more environments external to the system and one or more first data files comprised within one or more of the environments external to the system;
wherein one or more of the portal-destinations further comprises:
one or more selections from the group consisting of:
one or more of the outlets, one or more of the controllers, one or more of the tracers, one or more second processes comprised within one or more of the environments external to the system and one or more second data files comprised within one or more of the environments external to the system; and
wherein one or more of the correlations further comprises:
one or more selections from the group consisting of:
one or more musical parts, one or more musical voices, one or more echoic memory note depths, one or more note values, one or more musical intervals, one or more second note-topologies and one or more second note-directions. 8. The music-yielding system of claim 1,
wherein one or more of the outlets comprising:
circuits and software performs actions further comprising:
transmitting one or more outlet-effects of one or more of the requisites upon one or more of the outlets; and
wherein one or more of the controllers comprising:
circuits and software performs actions further comprising:
receiving one or more of the outlet-effects; and
transmitting one or more controller-output indications comprising:
one or more of the outlet-effects. 9. The music-yielding system of claim 1,
wherein one or more of the outlets are comprised within one or more pluralities of two or more of the outlets; wherein one or more of the controllers are comprised within one or more pluralities of two or more of the controllers; wherein one or more of the outlets in one or more of the pluralities of outlets comprises:
circuits and software to perform actions comprising:
yielding one or more outlet-sets comprising:
one or more musical notes
conforming in one or more predetermined minimum degrees to one or more requisites; and
setting one or more set-criteria determining one or more degrees of conformance of one or more of the outlet-sets to one or more of the requisites;
wherein one or more of the controllers in one or more of the pluralities of controllers comprises:
circuits and software to perform actions comprising:
receiving one or more controller-input indications comprising:
one or more of the requisites; and
causing one or more of the set-criteria to be set to one or more set-functions formulated from one or more set-parameters comprising:
one or more of the requisites;
wherein one or more of the outlets in one or more of the pluralities of outlets comprising:
circuits and software performs actions further comprising:
assembling one or more set-families comprising:
one or more of the outlet-sets
conforming in one or more predetermined minimum degrees to one or more requisite-family associations comprising:
one or more of the requisites of one or more of the controllers in one or more of the pluralities of controllers; and
one or more of the set-families; and
setting one or more family-criteria determining one or more degrees of conformance of one or more of the set-families to one or more of the requisite-family associations; and
wherein one or more of the controllers in one or more of the pluralities of controllers comprising:
circuits and software performs actions further comprising:
receiving one or more plurality-input indications comprising:
one or more of the requisite-family associations; and
causing one or more of the family-criteria to be set to one or more family-functions formulated from one or more family-parameters comprising:
one or more of the requisite-family associations. 10. The music-yielding system of claim 1, wherein one or more of the controllers comprising:
circuits and software performs actions further comprising:
calculating one or more counts of one or more of the outlet-sets conforming in one or more predetermined minimum degrees to one or more of the requisites; and
transmitting one or more counter-output indications comprising:
one or more of the counts. 11. A method for controlling one or more music-yielding outlets, the method comprising:
receiving one or more controlling-input indications comprising:
one or more requisites of one or more outlet-sets comprising:
one or more notes of the music; and
causing one or more set-criteria determining one or more degrees of conformance of one or more of the outlet-sets to one or more of the requisites to be set to one or more set-functions formulated from one or more set-parameters comprising: one or more of the requisites. 12. The method for controlling one or more music-yielding outlets of claim 11, the method further comprising:
calculating one or more correlations within one or more of the outlet-sets; and transmitting one or more tracing-output indications comprising:
one or more of the correlations. 13. The method for controlling one or more music-yielding outlets of claim 12,
wherein the transmitting one or more of the tracing-output indications further comprises:
performing in near-synchrony with one or more progressions of one or more of the outlet-sets;
wherein one or more of the requisites further comprises:
one or more selected from the group consisting of:
one or more note-set lengths, one or more note-ranges, one or more maximum note-distances, one or more starting notes, one or more first note-directions, one or more first note-topologies, one or more present musical interval-sets and one or more absent musical interval-sets; and
wherein one or more of the correlations further comprises:
one or more selected from the group consisting of:
one or more musical parts, one or more musical voices, one or more echoic memory note depths, one or more note values, one or more musical intervals, one or more second note-topologies and one or more second note-directions. 14. The method for controlling one or more music-yielding outlets of claim 11, the method further comprising:
receiving one or more porting-input indications comprising:
one or more porting-origins; and
one or more porting-destinations; and
transferring one or more porting-objects from one or more of the porting-origins to one or more of the porting-destinations. 15. The method for controlling one or more music-yielding outlets of claim 14,
wherein one or more of the porting-objects further comprises:
one or more porting-sets comprising:
one or more musical notes; and
wherein the method further comprises:
calculating one or more imputed-requisites of one or more of the porting-sets; and
transmitting one or more imputed-output indications comprising:
one or more of the imputed-requisites. 16. The method for controlling one or more music-yielding outlets of claim 14,
wherein one or more of the porting-objects further comprises:
one or more porting-sets comprising:
one or more musical notes; and
wherein the method further comprises:
calculating one or more correlations within one or more of the porting-sets; and
transmitting one or more tracing-output indications comprising:
one or more of the correlations. 17. The method for controlling one or more music-yielding outlets of claim 16, wherein the transmitting one or more of the tracing-output indications further comprises:
performing in near-synchrony with one or more progressions of one or more of the porting-sets; wherein one or more of the requisites further comprises:
one or more selected from the group consisting of:
one or more note-set lengths, one or more note-ranges, one or more maximum note-distances, one or more starting notes, one or more first note-directions, one or more first note-topologies, one or more present musical interval-sets, one or more absent musical interval-sets and one or more recital-sets comprising:
one or more musical notes;
wherein one or more of the porting-objects further comprises:
one or more selections from the group consisting of:
one or more of the outlet-sets, one or more of the requisites, one or more of the set-criteria, one or more of the controlling-input indications, one or more of the set-functions, one or more of the set-parameters, one or more of the correlations and one or more of the tracing-output indications;
wherein one or more of the porting-origins further comprises:
one or more selected from the group consisting of:
one or more of the music-yielding outlets, the receiving one or more controlling-input indications, the causing one or more set-criteria to be set, one or more first processes comprised within one or more environments external to one or more of the music-yielding outlets and one or more first data files comprised within one or more of the environments external to one or more of the music-yielding outlets;
wherein one or more of the porting-destinations further comprises:
one or more selected from the group consisting of:
one or more of the music-yielding outlets, the receiving one or more controlling-input indications, the causing one or more set-criteria to be set, the calculating one or more correlations, one or more second processes comprised within one or more of the environments external to one or more of the music-yielding outlets and one or more second data files comprised within one or more of the environments external to one or more of the music-yielding outlets; and
wherein one or more of the correlations further comprises:
one or more selected from the group consisting of:
one or more musical parts, one or more musical voices, one or more echoic memory note depths, one or more note values, one or more musical intervals, one or more second note-topologies and one or more second note-directions. 18. The method for controlling one or more music-yielding outlets of claim 11, the method further comprising:
receiving one or more outlet-effects of one or more of the requisites upon one or more of the music-yielding outlets; transmitting one or more controlling-output indications comprising:
one or more of the outlet-effects. 19. The method for controlling one or more music-yielding outlets of claim 11,
wherein the method further controls one or more pluralities of two or more of the music-yielding outlets, one or more of the music-yielding outlets in one or more of the pluralities of music-yielding outlets further assembling one or more set-families comprising:
one or more of the outlet-sets;
wherein the method comprises:
receiving one or more controlling-input indications comprising:
one or more requisites of one or more outlet-sets comprising:
one or more notes of the music; and
causing one or more set-criteria determining one or more degrees of conformance of one or more of the outlet-sets to one or more of the requisites to be set to one or more set-functions formulated from one or more set-parameters comprising:
one or more of the requisites; and
wherein the method further comprises:
receiving one or more plurality-input indications comprising:
one or more requisite-family associations comprising:
one or more of the requisites; and
one or more of the set-families; and
causing one or more family-criteria determining one or more degrees of conformance of one or more of the set-families to be set to one or more family-functions formulated from one or more family-parameters comprising:
one or more of the requisite-family associations. 20. The method for controlling one or more music-yielding outlets of claim 11, the method further comprising:
calculating one or more counts of one or more of the outlet-sets conforming in one or more predetermined minimum degrees to one or more of the requisites; and transmitting one or more counting-output indications comprising:
one or more of the counts. 21. A computing device for controlling one or more music-yielding outlets, the computing device comprising:
one or more non-transitory machine readable storage mediums storing one or more instructions that, when executed, cause the computing device to perform actions comprising:
receiving one or more controlling-input indications comprising:
one or more requisites of one or more outlet-sets comprising:
one or more notes of the music; and
causing one or more set-criteria determining one or more degrees of conformance of one or more of the outlet-sets to one or more of the requisites to be set to one or more set-functions formulated from one or more set-parameters comprising:
one or more of the requisites. 22. The computing device for controlling one or more music-yielding outlets of claim 21,
wherein the actions performed further comprise:
receiving one or more porting-input indications comprising:
one or more porting-origins; and
one or more porting-destinations; and
transferring one or more porting-objects from one or more of the porting-origins to one or more of the porting-destinations. 23. The computing device for controlling one or more music-yielding outlets of claim 22,
wherein one or more of the porting-objects further comprises:
one or more porting-sets comprising:
one or more musical notes; and
wherein the actions performed further comprise:
calculating one or more imputed-requisites of one or more of the porting-sets; and
transmitting one or more imputed-output indications comprising:
one or more of the imputed-requisites. 24. The computing device for controlling one or more music-yielding outlets of claim 22, wherein the actions performed further comprise:
calculating one or more counts of one or more of the outlet-sets conforming in one or more predetermined minimum degrees to one or more of the requisites; and transmitting one or more counting-output indications comprising:
one or more of the counts;
wherein one or more of the requisites further comprises:
one or more selected from the group consisting of:
one or more note-set lengths, one or more note-ranges, one or more maximum note-distances, one or more starting notes, one or more note-directions, one or more note-topologies, one or more present musical interval-sets, one or more absent musical interval-sets and one or more recital-sets comprising:
one or more musical notes;
wherein one or more of the porting-objects further comprises:
one or more selections from the group consisting of:
one or more of the outlet-sets, one or more of the requisites, one or more of the set-criteria, one or more of the controlling-input indications, one or more of the set-functions and one or more of the set-parameters;
wherein one or more of the porting-origins further comprises:
one or more selected from the group consisting of:
one or more of the music-yielding outlets, the receiving one or more controlling-input indications, the causing one or more set-criteria to be set, one or more first processes comprised within one or more environments external to one or more of the music-yielding outlets and one or more first data files comprised within one or more of the environments external to one or more of the music-yielding outlets; and
wherein one or more of the porting-destinations further comprises:
one or more selected from the group consisting of:
one or more of the music-yielding outlets, the receiving one or more controlling-input indications, the causing one or more set-criteria to be set, one or more second processes comprised within one or more of the environments external to one or more of the music-yielding outlets and one or more second data files comprised within one or more of the environments external to one or more of the music-yielding outlets. 25. The computing device for controlling one or more music-yielding outlets of claim 21, wherein the actions performed further comprise:
receiving one or more outlet-effects of one or more of the requisites upon one or more of the music-yielding outlets; and transmitting one or more controlling-output indications comprising:
one or more of the outlet-effects. 26. The computing device for controlling one or more music-yielding outlets of claim 21, wherein the computing device further controls one or more pluralities of two or more of the music-yielding outlets, one or more of the music-yielding outlets in one or more of the pluralities of music-yielding outlets further assembling one or more set-families comprising:
one or more of the outlet-sets;
wherein the computing device comprises:
one or more non-transitory machine readable storage mediums storing one or more instructions that, when executed, cause the computing device to perform actions comprising:
receiving one or more controlling-input indications comprising:
one or more requisites of one or more outlet-sets comprising:
one or more notes of the music; and
causing one or more set-criteria determining one or more degrees of conformance of one or more of the outlet-sets to one or more of the requisites to be set to one or more set-functions formulated from one or more set-parameters comprising:
one or more of the requisites; and
wherein the actions performed further comprise:
receiving one or more plurality-input indications comprising:
one or more requisite-family associations comprising:
one or more of the requisites; and
one or more of the set-families; and
causing one or more family-criteria determining one or more degrees of conformance of one or more of the set-families to be set to one or more family-functions formulated from one or more family-parameters comprising:
one or more of the requisite-family associations. 27. The computing device for controlling one or more music-yielding outlets of claim 21, further comprising:
one or more processors; one or more memories; and one or more storage-devices. 28. A computing device for tracing music, the computing device comprising:
one or more non-transitory machine readable storage mediums storing one or more instructions that, when executed, cause the computing device to perform actions comprising:
calculating one or more correlations within one or more tracing-sets comprising:
one or more notes of the music; and
transmitting one or more tracing-output indications comprising:
one or more of the correlations. 29. The computing device for tracing music of claim 28,
wherein the transmitting one or more of the tracing-output indications further comprises:
performing in near-synchrony with one or more progressions of one or more of the tracing-sets; and
wherein one or more of the correlations further comprises:
one or more selected from the group consisting of:
one or more musical parts, one or more musical voices, one or more echoic memory note depths, one or more note values, one or more musical intervals, one or more note-topologies and one or more note-directions. 30. The computing device for tracing music of claim 28, further comprising:
one or more processors; one or more memories; and one or more storage-devices. | 2,800 |
11,207 | 11,207 | 15,551,021 | 2,875 | A public transport land vehicle, in particular of the bus type, includes a passenger compartment intended to accommodate several people, and at least one technical compartment which can be accessed from the passenger compartment, at least one technical compartment, called upper compartment, is arranged on/in the upper wall of the passenger compartment. | 1. A public transport land vehicle, in particular of the bus type, comprising: a passenger compartment intended to accommodate several people seated or standing in an aisle; several technical compartments, called upper compartments, which can be accessed from said passenger compartment, arranged on/in the upper wall of said passenger compartment and each having the form of a longitudinal conduit;
two upper technical compartments for ventilation; and
an upper technical compartment for lighting, positioned between said upper technical compartments for ventilation. 2. The vehicle according to claim 1, characterized in that at least one upper technical compartment is arranged in a central area of the upper wall. 3. The vehicle according to claim 1, characterized in that at least one upper technical compartment has the form of a longitudinal conduit extending in the longitudinal direction of said passenger compartment, over at least a part of the length of said passenger compartment. 4. The vehicle according to claim 1, characterized in that it also comprises at least one upper technical compartment for:
display, and/or housing pipes or electrical cables. 5. The vehicle according to claim 1, characterized in that at least one upper technical compartment comprises longitudinal side vents which make it possible for air to pass from the outside to the inside of said vehicle. 6. The vehicle according to claim 1, characterized in that it comprises at least two adjacent upper compartments, containing a common wall. 7. The vehicle according to claim 1, characterized in that it comprises at least one, in particular two, longitudinal side wall(s) the upper part of which, in particular at the join with the upper wall, is at least partially transparent, or comprises at least one window or skylight allowing light to pass to the inside of the passenger compartment. 8. The vehicle according to claim 1, characterized in that at least one upper technical compartment is provided with a cover which rotates between a closed position, preventing access to said upper technical compartment, and an open position, allowing access to said upper technical compartment. 9. The vehicle according to claim 8, characterized in that at least one upper technical compartment is provided with at least one means of holding the cover of said compartment in an open position. 10. The vehicle according to claim 8, characterized in that at least one upper technical compartment is provided with at least one means for locking the cover of said compartment in a closed position. 11. The vehicle according to claim 1, characterized in that at least one upper technical compartment is provided with several covers, at least one of said covers being able to be opened independently of the other covers. 12. The vehicle according to claim 1, characterized in that at least one upper technical compartment comprises at least one opening for a cable or fluid to pass through, or also an opening for communicating with another compartment, technical or otherwise, located in the passenger compartment or outside the passenger compartment. 13. The vehicle according to claim 1, characterized in that at least one upper technical compartment is made from plastic or from metal. 14. The vehicle according to claim 1, characterized in that it is a bus, coach or tired tram, in particular electric. | A public transport land vehicle, in particular of the bus type, includes a passenger compartment intended to accommodate several people, and at least one technical compartment which can be accessed from the passenger compartment, at least one technical compartment, called upper compartment, is arranged on/in the upper wall of the passenger compartment.1. A public transport land vehicle, in particular of the bus type, comprising: a passenger compartment intended to accommodate several people seated or standing in an aisle; several technical compartments, called upper compartments, which can be accessed from said passenger compartment, arranged on/in the upper wall of said passenger compartment and each having the form of a longitudinal conduit;
two upper technical compartments for ventilation; and
an upper technical compartment for lighting, positioned between said upper technical compartments for ventilation. 2. The vehicle according to claim 1, characterized in that at least one upper technical compartment is arranged in a central area of the upper wall. 3. The vehicle according to claim 1, characterized in that at least one upper technical compartment has the form of a longitudinal conduit extending in the longitudinal direction of said passenger compartment, over at least a part of the length of said passenger compartment. 4. The vehicle according to claim 1, characterized in that it also comprises at least one upper technical compartment for:
display, and/or housing pipes or electrical cables. 5. The vehicle according to claim 1, characterized in that at least one upper technical compartment comprises longitudinal side vents which make it possible for air to pass from the outside to the inside of said vehicle. 6. The vehicle according to claim 1, characterized in that it comprises at least two adjacent upper compartments, containing a common wall. 7. The vehicle according to claim 1, characterized in that it comprises at least one, in particular two, longitudinal side wall(s) the upper part of which, in particular at the join with the upper wall, is at least partially transparent, or comprises at least one window or skylight allowing light to pass to the inside of the passenger compartment. 8. The vehicle according to claim 1, characterized in that at least one upper technical compartment is provided with a cover which rotates between a closed position, preventing access to said upper technical compartment, and an open position, allowing access to said upper technical compartment. 9. The vehicle according to claim 8, characterized in that at least one upper technical compartment is provided with at least one means of holding the cover of said compartment in an open position. 10. The vehicle according to claim 8, characterized in that at least one upper technical compartment is provided with at least one means for locking the cover of said compartment in a closed position. 11. The vehicle according to claim 1, characterized in that at least one upper technical compartment is provided with several covers, at least one of said covers being able to be opened independently of the other covers. 12. The vehicle according to claim 1, characterized in that at least one upper technical compartment comprises at least one opening for a cable or fluid to pass through, or also an opening for communicating with another compartment, technical or otherwise, located in the passenger compartment or outside the passenger compartment. 13. The vehicle according to claim 1, characterized in that at least one upper technical compartment is made from plastic or from metal. 14. The vehicle according to claim 1, characterized in that it is a bus, coach or tired tram, in particular electric. | 2,800 |
11,208 | 11,208 | 15,390,332 | 2,855 | A scoop and level for scooping a portion of granulated material and leveling the contents of the scoop. The scoop may have a volume suitable for brewing a single serving of brewed beverage, and in particular, for brewing a single serving of espresso. The lever is attached to the scoop and slides over the scoop to displace excess material, thus providing a desired amount material for precessing, for example, for preparing a beverage. A scoop handle may further include a tamper opposite to the scoop. The tamper may be used to tamp brewing material after scooping, leveling, and pouring the brewing material into a holder. | 1. A scoop and level, comprising:
a scoop arm including:
a grip end of the scoop arm; and
a scoop end of the scoop arm opposite to the grip end;
a scoop residing at the scoop end of the scoop arm; and an articulating level attached to the scoop arm and movable from a first position for scooping to a second position for leveling material in the scoop. 2. The scoop and level of claim 1, wherein the level is a sliding level. 3. The scoop and level of claim 2, wherein:
the scoop arm includes a longitudinal slot; and the level includes an inverted T retained in the slot and slidable in the slot. 4. The scoop and level of claim 3, wherein the level further includes a level arm connecting the level to the inverted T. 5. The scoop and level of claim 4, wherein the level further includes a thumb piece connected to the level arm for sliding the level over the scoop. 6. The scoop and level of claim 5, wherein the grip end of the scoop arm includes a tamper opposite to the scoop and configured to tamp brewing material measured by the scoop and level and poured into a brewing cartridge. 7. The scoop and level of claim 6, wherein a guide hole pin resides on a face of the tamper opposite to the scoop and configured to retain a bottom plug for insertion into a brewing cartridge base to close the brewing cartridge base. 8. The scoop and level of claim 6, wherein the bottom plug is insertable into a base bottom of the brewing cartridge base. 9. The scoop and level of claim 6, wherein the level includes a fork comprising a generally flat semi-circular arc of about 180 degrees for sliding over the scoop. 10. The scoop and level of claim 9, wherein the fork rests on a rim of the scoop when not in use, and slides horizontally to remove excess material from the scoop. 11. The scoop and level of claim 1, wherein the level is a pivoting level. 12. The scoop and level of claim 11, wherein the pivoting level includes a level arm pivotally engaging the scoop arm between the grip end and the scoop and a fork pivotable from the first position to the second position for leveling material in the scoop. 13. The scoop and level of claim 12, wherein in the first position, the level arm resides on a first side of the scoop arm and in the second position the level arm is pivoted across the scoop arm. 14. The scoop and level of claim 13, wherein the grip end of the scoop arm includes a tamper opposite to the scoop and configured to tamp brewing material measured by the scoop and level and poured into a brewing cartridge. 15. The scoop and level of claim 14, wherein a guide hole pin resides on a face of the tamper opposite to the scoop and configured to retain a bottom plug for insertion into a brewing cartridge base to close the brewing cartridge base. 16. The scoop and level of claim 15, wherein the bottom plug is insertable into a base bottom of the brewing cartridge base. 17. The scoop and level of claim 13, wherein the articulating level comprises a level arm, a pivot, and a sickle opposite to the pivot, the sickle forming semi-circular arc of about 180 degrees for sliding over the scoop 18. The scoop and level of claim 17, wherein the sickle rests on a rim of the scoop when not in use, and slides horizontally to remove excess material from the scoop. 19. A scoop and level, comprising:
an scoop arm including:
a grip end of the scoop arm; and
a scoop end of the scoop arm opposite to the grip end;
a lengthwise running slot in the scoop arm; a horizontally sliding level longitudinally slidably attached to the scoop arm, the sliding level including:
a level arm;
an inverted T at a first end of the level arm slideably engaging the slot; and
a generally flat fork on a second end of the level arm opposite to the first end and horizontally slidable from a first position to a second position for leveling material in the scoop; and
a thumb piece connected to the level arm for sliding the fork over the scoop. 20. A scoop and level, comprising:
an scoop arm including:
a grip end of the scoop arm; and
a scoop end of the scoop arm opposite to the grip end;
a scoop residing at the scoop end of the scoop arm; a horizontally pivoting level pivotally attached to the scoop arm between the grip end and the scoop end, the pivoting level including:
a level arm;
an pivot at a first end of the level arm pivotally cooperating with the scoop arm to provide horizontal pivoting of the level arm; and
a generally flat sickle on a second end of the level arm opposite to the first end and horizontally pivotable from a first position to a second position for leveling material in the scoop,
wherein in the first position, the level arm resides on a first side of the scoop arm and in the second position the level arm is pivoted across the scoop arm. | A scoop and level for scooping a portion of granulated material and leveling the contents of the scoop. The scoop may have a volume suitable for brewing a single serving of brewed beverage, and in particular, for brewing a single serving of espresso. The lever is attached to the scoop and slides over the scoop to displace excess material, thus providing a desired amount material for precessing, for example, for preparing a beverage. A scoop handle may further include a tamper opposite to the scoop. The tamper may be used to tamp brewing material after scooping, leveling, and pouring the brewing material into a holder.1. A scoop and level, comprising:
a scoop arm including:
a grip end of the scoop arm; and
a scoop end of the scoop arm opposite to the grip end;
a scoop residing at the scoop end of the scoop arm; and an articulating level attached to the scoop arm and movable from a first position for scooping to a second position for leveling material in the scoop. 2. The scoop and level of claim 1, wherein the level is a sliding level. 3. The scoop and level of claim 2, wherein:
the scoop arm includes a longitudinal slot; and the level includes an inverted T retained in the slot and slidable in the slot. 4. The scoop and level of claim 3, wherein the level further includes a level arm connecting the level to the inverted T. 5. The scoop and level of claim 4, wherein the level further includes a thumb piece connected to the level arm for sliding the level over the scoop. 6. The scoop and level of claim 5, wherein the grip end of the scoop arm includes a tamper opposite to the scoop and configured to tamp brewing material measured by the scoop and level and poured into a brewing cartridge. 7. The scoop and level of claim 6, wherein a guide hole pin resides on a face of the tamper opposite to the scoop and configured to retain a bottom plug for insertion into a brewing cartridge base to close the brewing cartridge base. 8. The scoop and level of claim 6, wherein the bottom plug is insertable into a base bottom of the brewing cartridge base. 9. The scoop and level of claim 6, wherein the level includes a fork comprising a generally flat semi-circular arc of about 180 degrees for sliding over the scoop. 10. The scoop and level of claim 9, wherein the fork rests on a rim of the scoop when not in use, and slides horizontally to remove excess material from the scoop. 11. The scoop and level of claim 1, wherein the level is a pivoting level. 12. The scoop and level of claim 11, wherein the pivoting level includes a level arm pivotally engaging the scoop arm between the grip end and the scoop and a fork pivotable from the first position to the second position for leveling material in the scoop. 13. The scoop and level of claim 12, wherein in the first position, the level arm resides on a first side of the scoop arm and in the second position the level arm is pivoted across the scoop arm. 14. The scoop and level of claim 13, wherein the grip end of the scoop arm includes a tamper opposite to the scoop and configured to tamp brewing material measured by the scoop and level and poured into a brewing cartridge. 15. The scoop and level of claim 14, wherein a guide hole pin resides on a face of the tamper opposite to the scoop and configured to retain a bottom plug for insertion into a brewing cartridge base to close the brewing cartridge base. 16. The scoop and level of claim 15, wherein the bottom plug is insertable into a base bottom of the brewing cartridge base. 17. The scoop and level of claim 13, wherein the articulating level comprises a level arm, a pivot, and a sickle opposite to the pivot, the sickle forming semi-circular arc of about 180 degrees for sliding over the scoop 18. The scoop and level of claim 17, wherein the sickle rests on a rim of the scoop when not in use, and slides horizontally to remove excess material from the scoop. 19. A scoop and level, comprising:
an scoop arm including:
a grip end of the scoop arm; and
a scoop end of the scoop arm opposite to the grip end;
a lengthwise running slot in the scoop arm; a horizontally sliding level longitudinally slidably attached to the scoop arm, the sliding level including:
a level arm;
an inverted T at a first end of the level arm slideably engaging the slot; and
a generally flat fork on a second end of the level arm opposite to the first end and horizontally slidable from a first position to a second position for leveling material in the scoop; and
a thumb piece connected to the level arm for sliding the fork over the scoop. 20. A scoop and level, comprising:
an scoop arm including:
a grip end of the scoop arm; and
a scoop end of the scoop arm opposite to the grip end;
a scoop residing at the scoop end of the scoop arm; a horizontally pivoting level pivotally attached to the scoop arm between the grip end and the scoop end, the pivoting level including:
a level arm;
an pivot at a first end of the level arm pivotally cooperating with the scoop arm to provide horizontal pivoting of the level arm; and
a generally flat sickle on a second end of the level arm opposite to the first end and horizontally pivotable from a first position to a second position for leveling material in the scoop,
wherein in the first position, the level arm resides on a first side of the scoop arm and in the second position the level arm is pivoted across the scoop arm. | 2,800 |
11,209 | 11,209 | 14,101,282 | 2,813 | Solid state radiation sensors include a floating gate (FG) structure having a large control capacitor region disposed on thick dielectric portion over a control gate (CG) implemented by an isolated P-well region, and a tunneling capacitor region disposed on thin gate oxide dielectric over another tunneling gate (TG) isolated P-well region. Opposite voltages (e.g., +5V/−5V) are respectively applied to the CG and TG P-well regions to charge the FG structure by Fowler-Nordheim tunneling. During exposure, radiation striking the sensor discharges the FG structure by generating electron-hole pairs in the dielectric portion separating the CG P-well region and the control capacitor region. After exposure, the total ionizing dose (TID) is calculated, e.g., by measuring the threshold voltage shift of a CMOS readout inverter controlled by the residual charge stored on the FG structure. Sensor performance is enhanced by metal plates, utilizing two control capacitors, or modifying the FG electrode layout. | 1. A solid state direct radiation sensing device including a plurality of sensors formed on a semiconductor substrate, wherein each sensor comprises:
at least one control gate including a first isolated P-well region formed in the substrate; a dielectric portion formed on said substrate and disposed over the first isolated P-well region; and a first floating gate structure including a control capacitor region disposed on the dielectric portion and over the first isolated P-well region. 2. The sensor device of claim 1, wherein each said sensor further comprises:
at least one tunneling gate including a second isolated P-well region formed in the substrate and separated from said first isolated P-well region by an N-well region; and a gate oxide layer including a tunneling gate oxide portion disposed over the second isolated P-well region, wherein the first floating gate structure further includes a tunneling capacitor region disposed on the tunneling gate oxide portion and over the second isolated P-well region, and wherein a first thickness of the dielectric layer is at least five times greater than a second thickness of said gate oxide layer. 3. The sensor device of claim 2,
wherein the first isolated P-well region, the dielectric portion and the control capacitor region of the first floating gate structure form a first capacitor having a first capacitance, wherein the second isolated P-well region, the tunneling gate oxide portion and the tunneling capacitor region of the first floating gate structure form a second capacitor having a second capacitance, and wherein the first capacitance is at least five times greater than the second capacitance. 4. The sensor device of claim 2,
wherein the first floating gate structure of each said sensor further includes at least one readout region, and wherein said each sensor further comprises at least one readout transistor having source and drain regions disposed in the substrate under said at least one readout region. 5. The sensor device according to claim 4, wherein said readout circuit of each said sensor comprises a CMOS inverter including a PMOS transistor having source and drain terminals formed in an N-well region of said substrate and having a gate structure formed by a third region of said first floating gate structure, and an NMOS transistor including source and drain terminals formed in a P-well region of said substrate and having a gate structure formed by a fourth region of said first floating gate structure. 6. The sensor device of claim 4, further comprising a control circuit fabricated on the substrate, said control circuit including:
means for applying opposite programming voltages on the control gate and the tunneling gate of each said sensor during a pre-exposure period such that Fowler-Nordheim tunneling occurs between the second isolated P-well region and the first floating gate structure, whereby an initial charge is stored on the first floating gate structure of each said sensor; and means for reading a residual charge stored on the first floating gate structure of each said sensor after said pre-exposure period, whereby an amount of radiation absorbed by said each sensor is determined by a difference between the first and second charge amounts. 7. The sensor device of claim 1, wherein each said sensor further comprises a second dielectric layer disposed over the first floating gate structure, wherein the control gate further comprises a metal plate disposed on the second dielectric layer and positioned over the control capacitor region of the first floating gate structure, wherein the metal plate of said each sensor is electrically connected to the first isolated P-well region of said each sensor. 8. The sensor device of claim 7,
wherein the first isolated P-well region, the dielectric portion and the control capacitor region of the first floating gate structure form a first control capacitor having a first capacitance, wherein the metal plate, the second dielectric layer and the control capacitor region of the first floating gate structure form a second control capacitor having a second capacitance that is substantially equal to the first capacitance of the first control capacitor. 9. The sensor device of claim 2,
wherein each said sensor further comprises a second floating gate structure including a second control capacitor region disposed on the dielectric portion and over the first isolated P-well region, wherein the control capacitor region of the first floating gate structures and the second control capacitor region of the second floating gate structures comprise comb-like polycrystalline silicon structures having a plurality of parallel fingers, and wherein the first and second floating gate structures are arranged such that the plurality of parallel fingers of the first floating gate structure are interdigitated with the plurality of parallel fingers of the second floating gate structure. 10. The sensor device of claim 9,
wherein said at least one tunneling gate of each said sensor comprises a first tunneling gate including said second isolated P-well region and a second tunneling gate including a third isolated P-well region formed in the substrate and separated from said first and second isolated P-well regions, wherein the second floating gate structure of each said sensor further comprises a second tunneling capacitor region disposed over the third isolated P-well region, and wherein the sensor device further comprises means for applying a first programming voltage on the control gate, a second programming voltage on the first tunneling gate and third programming voltage on the second tunneling gate of each said sensor during a pre-exposure period such that Fowler-Nordheim tunneling of holes occurs between the substrate and the first floating gate structure and Fowler-Nordheim tunneling of electrons occurs between the substrate and the second floating gate structure, whereby an initial net-positive charge is stored on the first floating gate structure and initial net-negative charge is stored on the second floating gate structure. 11. The sensor device of claim 1,
wherein said at least one control gate of each said sensor comprises a first control gate including said first isolated P-well region and a second control gate, wherein both of said first and second control gate of said each sensor are capacitively coupled to said floating gate structure of said each sensor, and wherein the sensor device further comprises means for respectively applying opposite biasing voltages on the first control gate and the second control gate during an exposure period. 12. The sensor device of claim 11,
wherein the control capacitor region of each said floating gate structure includes a first control capacitor region portion that is capacitively coupled to said first control gate, and a second control capacitor region portion, and wherein said second control gate of each said sensor includes a third isolated P-well region formed in the substrate below the second control capacitor region portion of said each floating gate structure. 13. The sensor device of claim 11, wherein each said sensor further comprises a second dielectric layer disposed over the first floating gate structure, wherein the second control gate of each said sensor comprises a metal plate disposed on the second dielectric layer and positioned over the control capacitor region of the first floating gate structure of said each sensor. 14. The sensor device of claim 4,
wherein said plurality of sensors disposed in a plurality of parallel rows such that first and second rows of said plurality of rows are separated by a first space, and wherein said sensor device further comprises a first bitline structure operably connected to each said sensor in at least one of said first and second rows. 15. The sensor device of claim 14,
wherein the control capacitor region of said each sensor is disposed between said least one readout transistor and said at least one tunneling gate, wherein said plurality of sensors are arranged in an alternating pattern such that the tunneling gates of each said sensor in said first and second rows are disposed in said first space disposed between said first and second rows, and such that said readout transistors of each said sensor in said second row are disposed in a second space between said second row and a third row of said plurality of parallel rows, and wherein said sensor device further comprises a second bitline structure extending along said second space and operably connected to the readout circuitry of each said sensor in said second and third rows. 16. The sensor device of claim 5,
wherein the third and fourth readout regions of the floating gate of each said sensor has a width in the range of 22 nanometers (nm) and 1 micron (μm), and wherein the FG control capacitor region has a width in a range of 1 μm and 1000 μm and a length in the range of 1 μm and 1000 μm. 17. A solid state direct radiation sensor formed on a semiconductor substrate, the sensor comprising:
a control gate including a first isolated well region formed in the substrate; a tunneling gate including a second isolated well region formed in the substrate; a first dielectric portion disposed over the first isolated well region; a second dielectric portion disposed over the second isolated well region; and a floating gate structure including: a first region disposed on the dielectric portion such that the first region forms a first capacitance with the control gate, and a second region disposed on the second dielectric portion such that the second region forms a second capacitance with the tunneling gate, wherein a thickness of the first dielectric portion is at least five times greater than a thickness of the second dielectric portion, and wherein the first and second capacitances are set such that Fowler-Nordheim tunneling is facilitated during a charging period when a first voltage potential is supplied to the control gate and a second voltage potential is supplied to the tunneling gate, thereby storing a first charge amount on the floating gate structure. 18. The sensor according to claim 17, wherein the first and second isolated well regions comprise spaced-apart P-well regions entirely disposed over a first N-well region formed in the substrate, and respectively surrounded by second N-well regions extending from an upper surface of the substrate to the deep N-well region. 19. The sensor according to claim 17, further comprising a readout circuit including at least one transistor having a gate structure formed by a third region of said floating gate structure. 20. The sensor according to claim 19, wherein said readout circuit includes a CMOS inverter comprising:
a PMOS readout transistor having source and drain terminals formed in a N-well region of said substrate and having a gate structure formed by said third region of said first floating gate structure; an NMOS readout transistor including source and drain terminals formed in an P-well region of said substrate and having a gate structure formed by a fourth region of said first floating gate structure; a PMOS transfer gate connected between the PMOS readout transistor and an output node; and an NMOS transfer gate connected between the NMOS readout transistor and the output node. 21. A solid state direct radiation sensor formed on a semiconductor substrate, the sensor comprising:
an N-well region formed in said substrate, said N-well region including a deep N-well portion entirely disposed inside said substrate and extending under an entirety of said N-well region, and at least one second N-well portion extending from the deep N-well portion to a surface of said substrate and disposed in a peripheral area of said N-well region; a control gate including a first isolated P-well region entirely disposed in the N-well region; a tunneling gate including a second isolated P-well region entirely disposed in the N-well region; a dielectric portion disposed over the first isolated P-well region; a gate oxide dielectric portion disposed on the substrate surface over the second isolated P-well region; a readout circuit including at least one readout transistor having source and drain regions formed in the substrate and disposed outside of said N-well region; and a floating gate structure including a first region disposed on the dielectric portion, a second region disposed on the gate oxide dielectric portion, and a third region extending over the source and drain regions of the at least one readout transistor. 22. The sensor according to claim 21, wherein said readout circuit includes a CMOS inverter comprising:
a PMOS readout transistor having source and drain terminals formed in a N-well region of said substrate and having a gate structure formed by said third region of said first floating gate structure; an NMOS readout transistor including source and drain terminals formed in an P-well region of said substrate and having a gate structure formed by a fourth region of said first floating gate structure; a PMOS transfer gate connected between the PMOS readout transistor and an output node; and an NMOS transfer gate connected between the NMOS readout transistor and the output node. 23. A CMOS circuit including a functional circuit and a solid state direct radiation sensing device formed on a semiconductor substrate, wherein the sensing device includes a plurality of sensors for generating dosage data and means for transmitting the dosage data to the functional circuit, wherein the functional circuit includes means for automatically correcting circuit operating parameters in accordance with said transmitted dosage data, and wherein each sensor of said sensing device comprises:
at least one control gate including a first isolated P-well region formed in the substrate; a dielectric portion formed on said substrate and disposed over the first isolated P-well region; and a first floating gate structure including a control capacitor region disposed on the dielectric portion and over the first isolated P-well region. | Solid state radiation sensors include a floating gate (FG) structure having a large control capacitor region disposed on thick dielectric portion over a control gate (CG) implemented by an isolated P-well region, and a tunneling capacitor region disposed on thin gate oxide dielectric over another tunneling gate (TG) isolated P-well region. Opposite voltages (e.g., +5V/−5V) are respectively applied to the CG and TG P-well regions to charge the FG structure by Fowler-Nordheim tunneling. During exposure, radiation striking the sensor discharges the FG structure by generating electron-hole pairs in the dielectric portion separating the CG P-well region and the control capacitor region. After exposure, the total ionizing dose (TID) is calculated, e.g., by measuring the threshold voltage shift of a CMOS readout inverter controlled by the residual charge stored on the FG structure. Sensor performance is enhanced by metal plates, utilizing two control capacitors, or modifying the FG electrode layout.1. A solid state direct radiation sensing device including a plurality of sensors formed on a semiconductor substrate, wherein each sensor comprises:
at least one control gate including a first isolated P-well region formed in the substrate; a dielectric portion formed on said substrate and disposed over the first isolated P-well region; and a first floating gate structure including a control capacitor region disposed on the dielectric portion and over the first isolated P-well region. 2. The sensor device of claim 1, wherein each said sensor further comprises:
at least one tunneling gate including a second isolated P-well region formed in the substrate and separated from said first isolated P-well region by an N-well region; and a gate oxide layer including a tunneling gate oxide portion disposed over the second isolated P-well region, wherein the first floating gate structure further includes a tunneling capacitor region disposed on the tunneling gate oxide portion and over the second isolated P-well region, and wherein a first thickness of the dielectric layer is at least five times greater than a second thickness of said gate oxide layer. 3. The sensor device of claim 2,
wherein the first isolated P-well region, the dielectric portion and the control capacitor region of the first floating gate structure form a first capacitor having a first capacitance, wherein the second isolated P-well region, the tunneling gate oxide portion and the tunneling capacitor region of the first floating gate structure form a second capacitor having a second capacitance, and wherein the first capacitance is at least five times greater than the second capacitance. 4. The sensor device of claim 2,
wherein the first floating gate structure of each said sensor further includes at least one readout region, and wherein said each sensor further comprises at least one readout transistor having source and drain regions disposed in the substrate under said at least one readout region. 5. The sensor device according to claim 4, wherein said readout circuit of each said sensor comprises a CMOS inverter including a PMOS transistor having source and drain terminals formed in an N-well region of said substrate and having a gate structure formed by a third region of said first floating gate structure, and an NMOS transistor including source and drain terminals formed in a P-well region of said substrate and having a gate structure formed by a fourth region of said first floating gate structure. 6. The sensor device of claim 4, further comprising a control circuit fabricated on the substrate, said control circuit including:
means for applying opposite programming voltages on the control gate and the tunneling gate of each said sensor during a pre-exposure period such that Fowler-Nordheim tunneling occurs between the second isolated P-well region and the first floating gate structure, whereby an initial charge is stored on the first floating gate structure of each said sensor; and means for reading a residual charge stored on the first floating gate structure of each said sensor after said pre-exposure period, whereby an amount of radiation absorbed by said each sensor is determined by a difference between the first and second charge amounts. 7. The sensor device of claim 1, wherein each said sensor further comprises a second dielectric layer disposed over the first floating gate structure, wherein the control gate further comprises a metal plate disposed on the second dielectric layer and positioned over the control capacitor region of the first floating gate structure, wherein the metal plate of said each sensor is electrically connected to the first isolated P-well region of said each sensor. 8. The sensor device of claim 7,
wherein the first isolated P-well region, the dielectric portion and the control capacitor region of the first floating gate structure form a first control capacitor having a first capacitance, wherein the metal plate, the second dielectric layer and the control capacitor region of the first floating gate structure form a second control capacitor having a second capacitance that is substantially equal to the first capacitance of the first control capacitor. 9. The sensor device of claim 2,
wherein each said sensor further comprises a second floating gate structure including a second control capacitor region disposed on the dielectric portion and over the first isolated P-well region, wherein the control capacitor region of the first floating gate structures and the second control capacitor region of the second floating gate structures comprise comb-like polycrystalline silicon structures having a plurality of parallel fingers, and wherein the first and second floating gate structures are arranged such that the plurality of parallel fingers of the first floating gate structure are interdigitated with the plurality of parallel fingers of the second floating gate structure. 10. The sensor device of claim 9,
wherein said at least one tunneling gate of each said sensor comprises a first tunneling gate including said second isolated P-well region and a second tunneling gate including a third isolated P-well region formed in the substrate and separated from said first and second isolated P-well regions, wherein the second floating gate structure of each said sensor further comprises a second tunneling capacitor region disposed over the third isolated P-well region, and wherein the sensor device further comprises means for applying a first programming voltage on the control gate, a second programming voltage on the first tunneling gate and third programming voltage on the second tunneling gate of each said sensor during a pre-exposure period such that Fowler-Nordheim tunneling of holes occurs between the substrate and the first floating gate structure and Fowler-Nordheim tunneling of electrons occurs between the substrate and the second floating gate structure, whereby an initial net-positive charge is stored on the first floating gate structure and initial net-negative charge is stored on the second floating gate structure. 11. The sensor device of claim 1,
wherein said at least one control gate of each said sensor comprises a first control gate including said first isolated P-well region and a second control gate, wherein both of said first and second control gate of said each sensor are capacitively coupled to said floating gate structure of said each sensor, and wherein the sensor device further comprises means for respectively applying opposite biasing voltages on the first control gate and the second control gate during an exposure period. 12. The sensor device of claim 11,
wherein the control capacitor region of each said floating gate structure includes a first control capacitor region portion that is capacitively coupled to said first control gate, and a second control capacitor region portion, and wherein said second control gate of each said sensor includes a third isolated P-well region formed in the substrate below the second control capacitor region portion of said each floating gate structure. 13. The sensor device of claim 11, wherein each said sensor further comprises a second dielectric layer disposed over the first floating gate structure, wherein the second control gate of each said sensor comprises a metal plate disposed on the second dielectric layer and positioned over the control capacitor region of the first floating gate structure of said each sensor. 14. The sensor device of claim 4,
wherein said plurality of sensors disposed in a plurality of parallel rows such that first and second rows of said plurality of rows are separated by a first space, and wherein said sensor device further comprises a first bitline structure operably connected to each said sensor in at least one of said first and second rows. 15. The sensor device of claim 14,
wherein the control capacitor region of said each sensor is disposed between said least one readout transistor and said at least one tunneling gate, wherein said plurality of sensors are arranged in an alternating pattern such that the tunneling gates of each said sensor in said first and second rows are disposed in said first space disposed between said first and second rows, and such that said readout transistors of each said sensor in said second row are disposed in a second space between said second row and a third row of said plurality of parallel rows, and wherein said sensor device further comprises a second bitline structure extending along said second space and operably connected to the readout circuitry of each said sensor in said second and third rows. 16. The sensor device of claim 5,
wherein the third and fourth readout regions of the floating gate of each said sensor has a width in the range of 22 nanometers (nm) and 1 micron (μm), and wherein the FG control capacitor region has a width in a range of 1 μm and 1000 μm and a length in the range of 1 μm and 1000 μm. 17. A solid state direct radiation sensor formed on a semiconductor substrate, the sensor comprising:
a control gate including a first isolated well region formed in the substrate; a tunneling gate including a second isolated well region formed in the substrate; a first dielectric portion disposed over the first isolated well region; a second dielectric portion disposed over the second isolated well region; and a floating gate structure including: a first region disposed on the dielectric portion such that the first region forms a first capacitance with the control gate, and a second region disposed on the second dielectric portion such that the second region forms a second capacitance with the tunneling gate, wherein a thickness of the first dielectric portion is at least five times greater than a thickness of the second dielectric portion, and wherein the first and second capacitances are set such that Fowler-Nordheim tunneling is facilitated during a charging period when a first voltage potential is supplied to the control gate and a second voltage potential is supplied to the tunneling gate, thereby storing a first charge amount on the floating gate structure. 18. The sensor according to claim 17, wherein the first and second isolated well regions comprise spaced-apart P-well regions entirely disposed over a first N-well region formed in the substrate, and respectively surrounded by second N-well regions extending from an upper surface of the substrate to the deep N-well region. 19. The sensor according to claim 17, further comprising a readout circuit including at least one transistor having a gate structure formed by a third region of said floating gate structure. 20. The sensor according to claim 19, wherein said readout circuit includes a CMOS inverter comprising:
a PMOS readout transistor having source and drain terminals formed in a N-well region of said substrate and having a gate structure formed by said third region of said first floating gate structure; an NMOS readout transistor including source and drain terminals formed in an P-well region of said substrate and having a gate structure formed by a fourth region of said first floating gate structure; a PMOS transfer gate connected between the PMOS readout transistor and an output node; and an NMOS transfer gate connected between the NMOS readout transistor and the output node. 21. A solid state direct radiation sensor formed on a semiconductor substrate, the sensor comprising:
an N-well region formed in said substrate, said N-well region including a deep N-well portion entirely disposed inside said substrate and extending under an entirety of said N-well region, and at least one second N-well portion extending from the deep N-well portion to a surface of said substrate and disposed in a peripheral area of said N-well region; a control gate including a first isolated P-well region entirely disposed in the N-well region; a tunneling gate including a second isolated P-well region entirely disposed in the N-well region; a dielectric portion disposed over the first isolated P-well region; a gate oxide dielectric portion disposed on the substrate surface over the second isolated P-well region; a readout circuit including at least one readout transistor having source and drain regions formed in the substrate and disposed outside of said N-well region; and a floating gate structure including a first region disposed on the dielectric portion, a second region disposed on the gate oxide dielectric portion, and a third region extending over the source and drain regions of the at least one readout transistor. 22. The sensor according to claim 21, wherein said readout circuit includes a CMOS inverter comprising:
a PMOS readout transistor having source and drain terminals formed in a N-well region of said substrate and having a gate structure formed by said third region of said first floating gate structure; an NMOS readout transistor including source and drain terminals formed in an P-well region of said substrate and having a gate structure formed by a fourth region of said first floating gate structure; a PMOS transfer gate connected between the PMOS readout transistor and an output node; and an NMOS transfer gate connected between the NMOS readout transistor and the output node. 23. A CMOS circuit including a functional circuit and a solid state direct radiation sensing device formed on a semiconductor substrate, wherein the sensing device includes a plurality of sensors for generating dosage data and means for transmitting the dosage data to the functional circuit, wherein the functional circuit includes means for automatically correcting circuit operating parameters in accordance with said transmitted dosage data, and wherein each sensor of said sensing device comprises:
at least one control gate including a first isolated P-well region formed in the substrate; a dielectric portion formed on said substrate and disposed over the first isolated P-well region; and a first floating gate structure including a control capacitor region disposed on the dielectric portion and over the first isolated P-well region. | 2,800 |
11,210 | 11,210 | 14,927,244 | 2,884 | Improvement of the dynamic range of a radiation detector is described. In one embodiment, one or more non-destructive readout operations are performed during a radiation exposure event to acquire data used to improve the dynamic range of the detector. In one implementation, one or more non-destructive readouts of pixels are performed prior to saturation of the pixels during an X-ray exposure so as to obtain non-saturated measurements at the pixels. In an additional implementation, non-destructive readouts of pixels are performed between exposure events so as to obtain an estimate of electronic noise during a multi-exposure examination. | 1. An imaging method, comprising:
exposing an object undergoing imaging to an X-ray exposure over a time interval; over the time interval, performing one or more non-destructive readout operations of a set of detector pixels, wherein each non-destructive readout operation measures a charge at each respective pixel at the time of the readout operation and wherein each non-destructive readout operation does not reset the overall charge at the pixel; estimating charge accumulation information for a subset of pixels that saturate over the time interval; and generating an image using the estimated charge accumulation information for the subset of pixels. 2. The imaging method of claim 1, wherein the object undergoing imaging is a tissue sample of that is not uniformly thick across an imaging area. 3. The imaging method of claim 2, wherein the tissue sample comprises compressed breast tissue. 4. The imaging method of claim 1, wherein the set of detector pixels comprise amplification and charge buffering circuitry within each respective pixel. 5. The imaging method of claim 1, wherein the set of detector pixels are part of a complementary metal-oxide semiconductor (CMOS) radiation detector. 6. The imaging method of claim 1, further comprising:
estimating the X-ray exposure rate based on the charges measured by the one or more non-destructive readout operations. 7. The imaging method of claim 1, wherein the set of detector pixels readout using the one or more non-destructive readout operations comprise a sparse image array of an overall detector. 8. The imaging method of claim 1, wherein the one or more non-destructive readout operations are performed at a frame rate greater than 100 frames per second. 9. The imaging method of claim 1, wherein estimating charge accumulation information for the subset of pixels that saturate over the time interval reduces the loss of attenuation information for the subset of pixels. 10. The imaging method of claim 1, wherein estimating charge accumulation information for the subset of pixels that saturate over the time interval increases the dynamic range of the set of pixels. 11. An imaging method, comprising:
exposing an object undergoing imaging to two or more X-ray exposures, wherein each exposure is performed after repositioning of one or more imager components and wherein no X-ray exposure occurs during repositioning of the one or more imager components; between X-ray exposures when no X-ray exposure occurs, performing two or more non-destructive readout operations of a set of detector pixels, wherein each non-destructive readout operation measures a charge at each respective pixel at the time of the readout operation and wherein each non-destructive readout operation does not reset the overall charge at the pixel; and generating a reduced noise image by synthesizing the images generated from the two or more non-destructive readout operations. 12. The imaging method of claim 11, wherein each exposure if performed at a different view angle. 13. The imaging method of claim 11, wherein the set of detector pixels are part of a complementary metal-oxide semiconductor (CMOS) radiation detector. 14. The imaging method of claim 11 wherein generating the reduced noise image comprises compensating for a measure of the electronic noise. 15. The imaging method of claim 11, wherein repositioning of one or more imager components comprises rotating a gantry or C-arm to which one or both of an X-ray source or X-ray detector are mounted. 16. The imaging method of claim 11, wherein the reduced noise image has increased dynamic range over a range of pixels relative to reconstructions where no non-destructive readout operations are performed.. 17. An imaging system, comprising:
an X-ray source configured to emit X-rays; a complementary metal-oxide semiconductor (CMOS) radiation detector comprising a plurality of pixels configured to accumulate charge when exposed to the emitted X-rays, wherein each pixel is capable of non-destructive readout such that a charge is readout from each respective pixel without resetting the respective pixel; one or both of a controller or processing component configured to: command non-destructive readout of some or all of the plurality of pixels over an exposure interval to measure a charge at each read out pixel at the time of the non-destructive readout; estimate charge accumulation information for a subset of pixels that saturate over the time interval; and generate an image using the estimated charge accumulation information for the subset of pixels. 18. The imaging system of claim 17, wherein the non-destructive readout of some or all of the plurality of pixels over the exposure interval comprises reading out a sparse image array relative to the plurality of pixels comprising the CMOS radiation detector. 19. An imaging system, comprising:
an X-ray source configured to emit X-rays; a complementary metal-oxide semiconductor (CMOS) radiation detector comprising a plurality of pixels configured to accumulate charge when exposed to the emitted X-rays, wherein each pixel is capable of non-destructive readout such that a charge is readout from each respective pixel without resetting the respective pixel; a positioner configured to reposition one or both of the X-ray source or CMOS radiation detector between two or more exposure events, wherein the X-ray source does not emit X-rays while being repositioned; one or both of a controller or processing component configured to: perform two or more non-destructive readout operations of a set of detector pixels between exposure events, wherein each non-destructive readout operation measures a charge at each respective pixel at the time of the readout operation; generate an estimate of electronic noise for each pixel of the subset of pixels using the measures of charge generated by the two or more non-destructive readout operations; and generate an image using the estimates of electronic noise. 20. The imaging system of claim 19, wherein the positioned comprises a gantry or C-arm to which one or both of the X-ray source or the CMOS radiation detector are mounted. | Improvement of the dynamic range of a radiation detector is described. In one embodiment, one or more non-destructive readout operations are performed during a radiation exposure event to acquire data used to improve the dynamic range of the detector. In one implementation, one or more non-destructive readouts of pixels are performed prior to saturation of the pixels during an X-ray exposure so as to obtain non-saturated measurements at the pixels. In an additional implementation, non-destructive readouts of pixels are performed between exposure events so as to obtain an estimate of electronic noise during a multi-exposure examination.1. An imaging method, comprising:
exposing an object undergoing imaging to an X-ray exposure over a time interval; over the time interval, performing one or more non-destructive readout operations of a set of detector pixels, wherein each non-destructive readout operation measures a charge at each respective pixel at the time of the readout operation and wherein each non-destructive readout operation does not reset the overall charge at the pixel; estimating charge accumulation information for a subset of pixels that saturate over the time interval; and generating an image using the estimated charge accumulation information for the subset of pixels. 2. The imaging method of claim 1, wherein the object undergoing imaging is a tissue sample of that is not uniformly thick across an imaging area. 3. The imaging method of claim 2, wherein the tissue sample comprises compressed breast tissue. 4. The imaging method of claim 1, wherein the set of detector pixels comprise amplification and charge buffering circuitry within each respective pixel. 5. The imaging method of claim 1, wherein the set of detector pixels are part of a complementary metal-oxide semiconductor (CMOS) radiation detector. 6. The imaging method of claim 1, further comprising:
estimating the X-ray exposure rate based on the charges measured by the one or more non-destructive readout operations. 7. The imaging method of claim 1, wherein the set of detector pixels readout using the one or more non-destructive readout operations comprise a sparse image array of an overall detector. 8. The imaging method of claim 1, wherein the one or more non-destructive readout operations are performed at a frame rate greater than 100 frames per second. 9. The imaging method of claim 1, wherein estimating charge accumulation information for the subset of pixels that saturate over the time interval reduces the loss of attenuation information for the subset of pixels. 10. The imaging method of claim 1, wherein estimating charge accumulation information for the subset of pixels that saturate over the time interval increases the dynamic range of the set of pixels. 11. An imaging method, comprising:
exposing an object undergoing imaging to two or more X-ray exposures, wherein each exposure is performed after repositioning of one or more imager components and wherein no X-ray exposure occurs during repositioning of the one or more imager components; between X-ray exposures when no X-ray exposure occurs, performing two or more non-destructive readout operations of a set of detector pixels, wherein each non-destructive readout operation measures a charge at each respective pixel at the time of the readout operation and wherein each non-destructive readout operation does not reset the overall charge at the pixel; and generating a reduced noise image by synthesizing the images generated from the two or more non-destructive readout operations. 12. The imaging method of claim 11, wherein each exposure if performed at a different view angle. 13. The imaging method of claim 11, wherein the set of detector pixels are part of a complementary metal-oxide semiconductor (CMOS) radiation detector. 14. The imaging method of claim 11 wherein generating the reduced noise image comprises compensating for a measure of the electronic noise. 15. The imaging method of claim 11, wherein repositioning of one or more imager components comprises rotating a gantry or C-arm to which one or both of an X-ray source or X-ray detector are mounted. 16. The imaging method of claim 11, wherein the reduced noise image has increased dynamic range over a range of pixels relative to reconstructions where no non-destructive readout operations are performed.. 17. An imaging system, comprising:
an X-ray source configured to emit X-rays; a complementary metal-oxide semiconductor (CMOS) radiation detector comprising a plurality of pixels configured to accumulate charge when exposed to the emitted X-rays, wherein each pixel is capable of non-destructive readout such that a charge is readout from each respective pixel without resetting the respective pixel; one or both of a controller or processing component configured to: command non-destructive readout of some or all of the plurality of pixels over an exposure interval to measure a charge at each read out pixel at the time of the non-destructive readout; estimate charge accumulation information for a subset of pixels that saturate over the time interval; and generate an image using the estimated charge accumulation information for the subset of pixels. 18. The imaging system of claim 17, wherein the non-destructive readout of some or all of the plurality of pixels over the exposure interval comprises reading out a sparse image array relative to the plurality of pixels comprising the CMOS radiation detector. 19. An imaging system, comprising:
an X-ray source configured to emit X-rays; a complementary metal-oxide semiconductor (CMOS) radiation detector comprising a plurality of pixels configured to accumulate charge when exposed to the emitted X-rays, wherein each pixel is capable of non-destructive readout such that a charge is readout from each respective pixel without resetting the respective pixel; a positioner configured to reposition one or both of the X-ray source or CMOS radiation detector between two or more exposure events, wherein the X-ray source does not emit X-rays while being repositioned; one or both of a controller or processing component configured to: perform two or more non-destructive readout operations of a set of detector pixels between exposure events, wherein each non-destructive readout operation measures a charge at each respective pixel at the time of the readout operation; generate an estimate of electronic noise for each pixel of the subset of pixels using the measures of charge generated by the two or more non-destructive readout operations; and generate an image using the estimates of electronic noise. 20. The imaging system of claim 19, wherein the positioned comprises a gantry or C-arm to which one or both of the X-ray source or the CMOS radiation detector are mounted. | 2,800 |
11,211 | 11,211 | 11,958,646 | 2,816 | A method for forming an integrated circuit system is provided including forming a substrate having a core region and a periphery region, forming a charge storage stack over the substrate in the core region, forming a gate stack with a stack header having a metal portion over the substrate in the periphery region, and forming a memory system with the stack header over the charge storage stack. | 1. A method for forming an integrated circuit system comprising:
forming a substrate having a core region and a periphery region; forming a charge storage stack over the substrate in the core region; forming a gate stack with a stack header having a metal portion over the substrate in the periphery region; and forming a memory system with the stack header over the charge storage stack. 2. The method as claimed in claim 1 wherein forming the charge storage stack includes:
forming a first insulator liner over the substrate; forming a charge trap liner over the first insulator liner; and forming a second insulator liner over the charge trap liner. 3. The method as claimed in claim 1 further comprising forming the stack header includes:
forming a semi-conducting portion over the substrate; forming a transition portion over the semi-conducting portion; and forming the metal portion over the transition portion. 4. The method as claimed in claim 1 further comprising forming memory cells with an inner doped region in the substrate under a gap between memory stacks of the memory system. 5. The method as claimed in claim 1 further comprising forming an electronic system or a subsystem with the integrated circuit system. 6. A method for forming an integrated circuit system comprising:
forming a substrate having a core region and a periphery region; forming a charge storage stack over the substrate in the core region; forming a dielectric liner over the substrate in the periphery region; forming a gate stack with a stack header having tungsten portion over the dielectric liner; and forming a memory system with the stack header over the charge storage stack. 7. The method as claimed in claim 6 further comprising forming the stack header includes:
forming a semi-conducting portion over the substrate; forming a transition portion having nitride over the semi-conducting portion; and forming the tungsten portion over the transition portion. 8. The method as claimed in claim 6 further comprising:
forming an outer doped region in the core region; forming a periphery doped region in the periphery region; and forming a low resistivity layer on the outer doped region and the periphery doped region. 9. The method as claimed in claim 6 further comprising forming a periphery doped region in the substrate in the periphery region not under the gate stack. 10. The method as claimed in claim 6 wherein forming the substrate having the core region and the periphery region includes forming an isolation structure in the substrate between the core region and the periphery region. 11. An integrated circuit system comprising:
a substrate having a core region and a periphery region; a charge storage stack over the substrate in the core region; a gate stack having a stack header having a metal portion over the substrate in the periphery region; and a memory system having the stack header over the charge storage stack. 12. The system as claimed in claim 11 wherein the charge storage stack includes:
a first insulator liner over the substrate; a charge trap liner over the first insulator liner; and a second insulator liner over the charge trap liner. 13. The system as claimed in claim 11 wherein the stack header includes:
a semi-conducting portion over the substrate; a transition portion over the semi-conducting portion; and the metal portion over the transition portion. 14. The system as claimed in claim 11 further comprising memory cells having an inner doped region in the substrate under a gap between memory stacks of the memory system. 15. The system as claimed in claim 11 further comprising an electronic system or a subsystem with the integrated circuit system. 16. The system as claimed in claim 11 wherein:
the substrate is a semiconductor substrate having the core region and the periphery region; the charge storage stack has silicon rich nitride over the substrate in the core region; the gate stack has the stack header over a dielectric liner, the dielectric liner is over the substrate in the periphery region; and the memory system, having the stack header over the charge storage stack, has a memory stack having the stack header. 17. The system as claimed in claim 16 wherein the stack header includes:
a semi-conducting portion over the substrate; a transition portion having nitride over the semi-conducting portion; and the tungsten portion over the transition portion. 18. The system as claimed in claim 16 further comprising:
an outer doped region in the core region; a periphery doped region in the periphery region; and a low resistivity layer on the outer doped region and the periphery doped region. 19. The system as claimed in claim 16 further comprising a periphery doped region in the substrate in the periphery region not under the gate stack. 20. The system as claimed in claim 16 further comprising an isolation structure in the substrate between the core region and the periphery region. | A method for forming an integrated circuit system is provided including forming a substrate having a core region and a periphery region, forming a charge storage stack over the substrate in the core region, forming a gate stack with a stack header having a metal portion over the substrate in the periphery region, and forming a memory system with the stack header over the charge storage stack.1. A method for forming an integrated circuit system comprising:
forming a substrate having a core region and a periphery region; forming a charge storage stack over the substrate in the core region; forming a gate stack with a stack header having a metal portion over the substrate in the periphery region; and forming a memory system with the stack header over the charge storage stack. 2. The method as claimed in claim 1 wherein forming the charge storage stack includes:
forming a first insulator liner over the substrate; forming a charge trap liner over the first insulator liner; and forming a second insulator liner over the charge trap liner. 3. The method as claimed in claim 1 further comprising forming the stack header includes:
forming a semi-conducting portion over the substrate; forming a transition portion over the semi-conducting portion; and forming the metal portion over the transition portion. 4. The method as claimed in claim 1 further comprising forming memory cells with an inner doped region in the substrate under a gap between memory stacks of the memory system. 5. The method as claimed in claim 1 further comprising forming an electronic system or a subsystem with the integrated circuit system. 6. A method for forming an integrated circuit system comprising:
forming a substrate having a core region and a periphery region; forming a charge storage stack over the substrate in the core region; forming a dielectric liner over the substrate in the periphery region; forming a gate stack with a stack header having tungsten portion over the dielectric liner; and forming a memory system with the stack header over the charge storage stack. 7. The method as claimed in claim 6 further comprising forming the stack header includes:
forming a semi-conducting portion over the substrate; forming a transition portion having nitride over the semi-conducting portion; and forming the tungsten portion over the transition portion. 8. The method as claimed in claim 6 further comprising:
forming an outer doped region in the core region; forming a periphery doped region in the periphery region; and forming a low resistivity layer on the outer doped region and the periphery doped region. 9. The method as claimed in claim 6 further comprising forming a periphery doped region in the substrate in the periphery region not under the gate stack. 10. The method as claimed in claim 6 wherein forming the substrate having the core region and the periphery region includes forming an isolation structure in the substrate between the core region and the periphery region. 11. An integrated circuit system comprising:
a substrate having a core region and a periphery region; a charge storage stack over the substrate in the core region; a gate stack having a stack header having a metal portion over the substrate in the periphery region; and a memory system having the stack header over the charge storage stack. 12. The system as claimed in claim 11 wherein the charge storage stack includes:
a first insulator liner over the substrate; a charge trap liner over the first insulator liner; and a second insulator liner over the charge trap liner. 13. The system as claimed in claim 11 wherein the stack header includes:
a semi-conducting portion over the substrate; a transition portion over the semi-conducting portion; and the metal portion over the transition portion. 14. The system as claimed in claim 11 further comprising memory cells having an inner doped region in the substrate under a gap between memory stacks of the memory system. 15. The system as claimed in claim 11 further comprising an electronic system or a subsystem with the integrated circuit system. 16. The system as claimed in claim 11 wherein:
the substrate is a semiconductor substrate having the core region and the periphery region; the charge storage stack has silicon rich nitride over the substrate in the core region; the gate stack has the stack header over a dielectric liner, the dielectric liner is over the substrate in the periphery region; and the memory system, having the stack header over the charge storage stack, has a memory stack having the stack header. 17. The system as claimed in claim 16 wherein the stack header includes:
a semi-conducting portion over the substrate; a transition portion having nitride over the semi-conducting portion; and the tungsten portion over the transition portion. 18. The system as claimed in claim 16 further comprising:
an outer doped region in the core region; a periphery doped region in the periphery region; and a low resistivity layer on the outer doped region and the periphery doped region. 19. The system as claimed in claim 16 further comprising a periphery doped region in the substrate in the periphery region not under the gate stack. 20. The system as claimed in claim 16 further comprising an isolation structure in the substrate between the core region and the periphery region. | 2,800 |
11,212 | 11,212 | 14,130,312 | 2,837 | The invention relates to a toe-in actuator ( 16 ), in particular a relay for an electric starter device ( 10 ) for internal combustion engines, said toe-in actuator providing a movable armature ( 168 ) and an armature return element ( 171 ) in a housing ( 156 ). The armature ( 168 ) is split into at least two armature parts ( 216, 218 ), and at least one damping element ( 220, 220 a, 220 b, 220 c, 220 d ) is provided between the at least two armature parts ( 216, 218 ). | 1. A toe-in actuator (16), comprising a casing (156), in which a movable armature (168) and an armature return element (171) are received, characterized in that the armature (168) is split into at least two armature parts (216, 218) and at least one damping element (220, 220 a, 220 b, 220 c, 220 d) is provided between the at least two armature parts (216, 218). 2. The toe-in actuator (16) as claimed in claim 1, characterized in that the splitting of the armature (168) into the at least two armature parts (216, 218) runs in the axial direction. 3. The toe-in actuator (16) as claimed in claim 1, characterized in that splitting of the armature (168) is designed such that at least one armature part (216) of the at least two armature parts (216, 218) has a mass smaller than further armature parts (218). 4. The toe-in actuator (16) as claimed in claim 3, characterized in that the at least one armature part (216) that has the mass smaller than the further armature parts (216, 218), is formed on an inner periphery of the armature (168). 5. The toe-in actuator (16) as claimed in claim 1, characterized in that an end face (212) of the armature (168) is split into end faces (212 a, 212 b) of the at least two armature parts (216, 218), and at least one armature part (218) has a mass higher than further armature parts, wherein this at least one armature part (218) forms an end stop (212 a) on the end face (212) of the armature (168). 6. The toe-in actuator (16) as claimed in claim 1, characterized in that the at least one damping element (220, 220 a, 220 b, 220 c, 220 d) is provided as an axial damping element (220, 220 a, 220 b, 220 c, 220 d) between at least two contact surfaces (252, 252 a, 252 b) of the at least two armature parts (216, 218). 7. The toe-in actuator (16) as claimed in claim 1, characterized in that the at least one damping element (220, 220 a, 220 b, 220 c, 220 d) comprises a resilient damping material having a Shore hardness between 10 and 70. 8. The toe-in actuator (16) as claimed in claim 1, characterized in that end faces of the at least two armature parts (216, 218), in a part of the armature (168) pointing away from the armature return element (171), have axial projections (240 a, 240 b) that engage in one another. 9. The toe-in actuator (16) as claimed in claim 8, characterized in that at least one damping element (220 a, 220 b) is provided between the projections (240 a, 240 b) of the at least two armature parts (218, 216). 10. The toe-in actuator (16) as claimed in claim 3, characterized in that the at least one armature part (216) that has the mass smaller than the further armature parts (216, 218), is formed on an outer periphery of the armature (168). 11. The toe-in actuator (16) as claimed in claim 3, characterized in that the at least one armature part (216) that has the mass smaller than the further armature parts (216, 218), is formed within the armature (168) between an inner and an outer periphery of the armature (168). | The invention relates to a toe-in actuator ( 16 ), in particular a relay for an electric starter device ( 10 ) for internal combustion engines, said toe-in actuator providing a movable armature ( 168 ) and an armature return element ( 171 ) in a housing ( 156 ). The armature ( 168 ) is split into at least two armature parts ( 216, 218 ), and at least one damping element ( 220, 220 a, 220 b, 220 c, 220 d ) is provided between the at least two armature parts ( 216, 218 ).1. A toe-in actuator (16), comprising a casing (156), in which a movable armature (168) and an armature return element (171) are received, characterized in that the armature (168) is split into at least two armature parts (216, 218) and at least one damping element (220, 220 a, 220 b, 220 c, 220 d) is provided between the at least two armature parts (216, 218). 2. The toe-in actuator (16) as claimed in claim 1, characterized in that the splitting of the armature (168) into the at least two armature parts (216, 218) runs in the axial direction. 3. The toe-in actuator (16) as claimed in claim 1, characterized in that splitting of the armature (168) is designed such that at least one armature part (216) of the at least two armature parts (216, 218) has a mass smaller than further armature parts (218). 4. The toe-in actuator (16) as claimed in claim 3, characterized in that the at least one armature part (216) that has the mass smaller than the further armature parts (216, 218), is formed on an inner periphery of the armature (168). 5. The toe-in actuator (16) as claimed in claim 1, characterized in that an end face (212) of the armature (168) is split into end faces (212 a, 212 b) of the at least two armature parts (216, 218), and at least one armature part (218) has a mass higher than further armature parts, wherein this at least one armature part (218) forms an end stop (212 a) on the end face (212) of the armature (168). 6. The toe-in actuator (16) as claimed in claim 1, characterized in that the at least one damping element (220, 220 a, 220 b, 220 c, 220 d) is provided as an axial damping element (220, 220 a, 220 b, 220 c, 220 d) between at least two contact surfaces (252, 252 a, 252 b) of the at least two armature parts (216, 218). 7. The toe-in actuator (16) as claimed in claim 1, characterized in that the at least one damping element (220, 220 a, 220 b, 220 c, 220 d) comprises a resilient damping material having a Shore hardness between 10 and 70. 8. The toe-in actuator (16) as claimed in claim 1, characterized in that end faces of the at least two armature parts (216, 218), in a part of the armature (168) pointing away from the armature return element (171), have axial projections (240 a, 240 b) that engage in one another. 9. The toe-in actuator (16) as claimed in claim 8, characterized in that at least one damping element (220 a, 220 b) is provided between the projections (240 a, 240 b) of the at least two armature parts (218, 216). 10. The toe-in actuator (16) as claimed in claim 3, characterized in that the at least one armature part (216) that has the mass smaller than the further armature parts (216, 218), is formed on an outer periphery of the armature (168). 11. The toe-in actuator (16) as claimed in claim 3, characterized in that the at least one armature part (216) that has the mass smaller than the further armature parts (216, 218), is formed within the armature (168) between an inner and an outer periphery of the armature (168). | 2,800 |
11,213 | 11,213 | 13,478,010 | 2,891 | Some embodiments include semiconductor constructions. The constructions have an electrically conductive post extending through a semiconductor die. The post has an upper surface above a backside surface of the die, and has a sidewall surface extending between the backside surface and the upper surface. A photosensitive material is over the backside surface and along the sidewall surface. Electrically conductive material is directly against the upper surface of the post. The electrically conductive material is configured as a cap over the post. The cap has an edge that extends laterally outwardly beyond the post and encircles the post. An entirety of the edge is directly over the photosensitive material. Some embodiments include methods of forming semiconductor constructions having photosensitive material adjacent through-wafer interconnects, and having electrically conductive material caps over and directly against upper surfaces of the interconnects and directly against an upper surface of the photosensitive material. | 1. A semiconductor construction comprising:
an electrically conductive post extending through a semiconductor die; the post having an upper surface above a backside surface of the die, and having a sidewall surface extending between the backside surface and the upper surface; a photosensitive material over the backside surface and along the sidewall surface; and electrically conductive material directly against the upper surface of the post; the electrically conductive material being configured as a cap over the post; the cap having an edge that extends laterally outwardly beyond the post and encircles the post; an entirety of the edge being directly over the photosensitive material. 2. The semiconductor construction of claim 1 wherein an upper surface of the photosensitive material directly under said edge of the cap is below an upper surface of the post. 3. The semiconductor construction of claim 1 wherein an upper surface of the photosensitive material adjacent the post is approximately coplanar with an upper surface of the post. 4. The semiconductor construction of claim 3 wherein an upper surface of the photosensitive material directly under said edge of the cap is above an upper surface of the post. 5. The semiconductor construction of claim 1 wherein the entirety of the edge of the electrically conductive material is directly against the photosensitive material. 6. The semiconductor construction of claim 1 wherein the photosensitive material comprises one or more materials selected from the group consisting of siloxane-containing materials, epoxy acrylate-containing materials, polyimide-containing materials, and poly(benzoxazole)-containing materials. 7. The semiconductor construction of claim 1 wherein the photosensitive material is directly against a semiconductor material of the semiconductor die. 8. The semiconductor construction of claim 1 wherein one or more electrically insulative materials are between the photosensitive material and semiconductor material of the semiconductor die. 9. The semiconductor construction of claim 1 wherein the photosensitive material is directly against the sidewall surface of the post. 10. The semiconductor construction of claim 1 wherein one or more electrically insulative materials are between the photosensitive material and sidewall surface of the post. 11. The semiconductor construction of claim 1 wherein the post comprises copper; and wherein one or more copper barrier materials are between the photosensitive material and the copper of the post. 12. A semiconductor construction comprising:
a plurality of electrically conductive posts extending through a semiconductor die; the posts having upper surfaces above a backside surface of the die, and having sidewall surfaces extending between the backside surface and the upper surfaces; a photosensitive material over the backside surface and along the sidewall surfaces; electrically conductive material caps directly against the upper surfaces of the posts and directly over regions of the photosensitive material adjacent the posts; and the photosensitive material having a first thickness in regions between the caps and a second thickness in regions directly under the caps, the second thickness being less than the first thickness; upper surfaces of the second thickness regions being below the upper surfaces of the posts. 13. The semiconductor construction of claim 12 wherein the second thickness regions extend outwardly beyond edges of the caps. 14. The semiconductor construction of claim 12 wherein silicon dioxide is between the photosensitive material and sidewall surfaces of the electrically conductive posts. 15. The semiconductor construction of claim 12 wherein the electrically conductive posts comprise copper; and wherein one or more ruthenium-containing materials are between the photosensitive material and the copper of the electrically conductive posts. 16. A semiconductor construction comprising:
a plurality of electrically conductive posts extending through a semiconductor die; the posts having upper surfaces above a backside surface of the die, and having sidewall surfaces extending between the backside surface and the upper surfaces; a photosensitive material over the backside surface and along the sidewall surfaces; electrically conductive material caps directly against the upper surfaces of the posts and directly over regions of the photosensitive material adjacent the posts; and the photosensitive material having a first thickness in regions between the posts and a second thickness in regions adjacent the posts, the second thickness being less than the first thickness; upper surfaces of the first thickness regions being above the upper surfaces of the posts. 17. The semiconductor construction of claim 16 wherein upper surfaces of the second thickness regions are approximately coplanar with upper surfaces of at least some of the electrically conductive posts. 18. The semiconductor construction of claim 16 wherein the caps have edges over the first thickness regions of the photosensitive material. 19-26. (canceled) | Some embodiments include semiconductor constructions. The constructions have an electrically conductive post extending through a semiconductor die. The post has an upper surface above a backside surface of the die, and has a sidewall surface extending between the backside surface and the upper surface. A photosensitive material is over the backside surface and along the sidewall surface. Electrically conductive material is directly against the upper surface of the post. The electrically conductive material is configured as a cap over the post. The cap has an edge that extends laterally outwardly beyond the post and encircles the post. An entirety of the edge is directly over the photosensitive material. Some embodiments include methods of forming semiconductor constructions having photosensitive material adjacent through-wafer interconnects, and having electrically conductive material caps over and directly against upper surfaces of the interconnects and directly against an upper surface of the photosensitive material.1. A semiconductor construction comprising:
an electrically conductive post extending through a semiconductor die; the post having an upper surface above a backside surface of the die, and having a sidewall surface extending between the backside surface and the upper surface; a photosensitive material over the backside surface and along the sidewall surface; and electrically conductive material directly against the upper surface of the post; the electrically conductive material being configured as a cap over the post; the cap having an edge that extends laterally outwardly beyond the post and encircles the post; an entirety of the edge being directly over the photosensitive material. 2. The semiconductor construction of claim 1 wherein an upper surface of the photosensitive material directly under said edge of the cap is below an upper surface of the post. 3. The semiconductor construction of claim 1 wherein an upper surface of the photosensitive material adjacent the post is approximately coplanar with an upper surface of the post. 4. The semiconductor construction of claim 3 wherein an upper surface of the photosensitive material directly under said edge of the cap is above an upper surface of the post. 5. The semiconductor construction of claim 1 wherein the entirety of the edge of the electrically conductive material is directly against the photosensitive material. 6. The semiconductor construction of claim 1 wherein the photosensitive material comprises one or more materials selected from the group consisting of siloxane-containing materials, epoxy acrylate-containing materials, polyimide-containing materials, and poly(benzoxazole)-containing materials. 7. The semiconductor construction of claim 1 wherein the photosensitive material is directly against a semiconductor material of the semiconductor die. 8. The semiconductor construction of claim 1 wherein one or more electrically insulative materials are between the photosensitive material and semiconductor material of the semiconductor die. 9. The semiconductor construction of claim 1 wherein the photosensitive material is directly against the sidewall surface of the post. 10. The semiconductor construction of claim 1 wherein one or more electrically insulative materials are between the photosensitive material and sidewall surface of the post. 11. The semiconductor construction of claim 1 wherein the post comprises copper; and wherein one or more copper barrier materials are between the photosensitive material and the copper of the post. 12. A semiconductor construction comprising:
a plurality of electrically conductive posts extending through a semiconductor die; the posts having upper surfaces above a backside surface of the die, and having sidewall surfaces extending between the backside surface and the upper surfaces; a photosensitive material over the backside surface and along the sidewall surfaces; electrically conductive material caps directly against the upper surfaces of the posts and directly over regions of the photosensitive material adjacent the posts; and the photosensitive material having a first thickness in regions between the caps and a second thickness in regions directly under the caps, the second thickness being less than the first thickness; upper surfaces of the second thickness regions being below the upper surfaces of the posts. 13. The semiconductor construction of claim 12 wherein the second thickness regions extend outwardly beyond edges of the caps. 14. The semiconductor construction of claim 12 wherein silicon dioxide is between the photosensitive material and sidewall surfaces of the electrically conductive posts. 15. The semiconductor construction of claim 12 wherein the electrically conductive posts comprise copper; and wherein one or more ruthenium-containing materials are between the photosensitive material and the copper of the electrically conductive posts. 16. A semiconductor construction comprising:
a plurality of electrically conductive posts extending through a semiconductor die; the posts having upper surfaces above a backside surface of the die, and having sidewall surfaces extending between the backside surface and the upper surfaces; a photosensitive material over the backside surface and along the sidewall surfaces; electrically conductive material caps directly against the upper surfaces of the posts and directly over regions of the photosensitive material adjacent the posts; and the photosensitive material having a first thickness in regions between the posts and a second thickness in regions adjacent the posts, the second thickness being less than the first thickness; upper surfaces of the first thickness regions being above the upper surfaces of the posts. 17. The semiconductor construction of claim 16 wherein upper surfaces of the second thickness regions are approximately coplanar with upper surfaces of at least some of the electrically conductive posts. 18. The semiconductor construction of claim 16 wherein the caps have edges over the first thickness regions of the photosensitive material. 19-26. (canceled) | 2,800 |
11,214 | 11,214 | 14,956,279 | 2,892 | A scalable switching regulator architecture may include an integrated inductor. The integrated inductor may include vias or pillars in a multi-layer substrate, with selected vias coupled at one end by a redistribution layer of the multi-layer substrate and, variously, coupled at another end by a metal layer of a silicon integrated circuit chip or by a further redistribution layer of the multi-layer substrate. The vias may be coupled to the silicon integrated circuit chip by micro-balls, with the vias and micro-balls arranged in arrays. | 1. A package including an integrated circuit, comprising:
an integrated circuit (IC) chip including a system-on-chip (SoC) and a voltage regulator, the voltage regulator including first and second transistors connected in series; a multi-layer substrate coupled to the IC chip by micro-bumps, including at least one array of micro-bumps, the multi-layer substrate including at least one redistribution layer and a plurality of vias, with selected vias extending from selected ones of the micro-bumps of the at least one array of micro-bumps coupled by the at least one redistribution layer in pairs, with the selected vias electrically coupled to others of the selected vias about the micro-bumps; wherein the selected vias and the micro-bumps of the at least one array of micro-bumps form at least part of an inductor structure; and wherein the at least part of an inductor structure is positioned to correspond to a layout area of the first and second transistors of the voltage regulator. 2. The package including an integrated circuit of claim 1, wherein the multi-layer substrate includes a redistribution layer electrically coupling the selected vias to others of the selected vias about the micro-bumps. 3. The package including an integrated circuit of claim 1, wherein a metal layer of the IC chip electrically couples the selected vias to others of the selected vias about the micro-bumps. 4. The package including an integrated circuit of claim 1, wherein the at least one array of micro-bumps are arranged in a pattern and connected so as to form at least one closed loop magnetic field during operation of the IC chip. 5. The package including an integrated circuit of claim 1, wherein the micro-bumps include micro-bumps for power and ground connections, and the micro-bumps for power and ground connections are about opposite sides of the at least one array of micro-bumps. 6. The package including an integrated circuit of claim 1, wherein the at least one array of micro-bumps includes a first array of micro-bumps and a second array of micro-bumps, each of the first array of micro-bumps and the second array of micro bumps including a first set of micro-bumps and a second set of micro-bumps, the first set of micro-bumps being arranged in a pair of parallel lines, the second set of micro-bumps being arranged in a further pair of parallel lines parallel to the pair of parallel lines, the lines of the further parallel lines being separated by the pair of parallel lines of the first set of micro-bumps, the first set of micro-bumps of the first and second micro-bump arrays being configured for passage of current in a first direction and the second set of micro-bumps of the first and second micro-bump arrays being configured for passage of current in a second direction, the second direction opposite the first direction. 7. The package including an integrated circuit of claim 6, wherein the at least one array of micro-bumps includes a third array of micro-bumps between the first array of micro-bumps and the second array of micro-bumps, the third array of micro-bumps including the first set of micro-bumps and the second set of micro-bumps, the first set of micro-bumps of the third micro-bump array being configured for passage of current in the second direction and the second set of micro-bumps of the third micro-bump array being configured for passage of current in the first direction. 8. The package including an integrated circuit of claim 1, wherein a volume of the multi-layer substrate defined by the selected ones of the vias includes a magnetic material. 9. The package including an integrated circuit of claim 8, wherein the magnetic material is a ferrite. 10. A method for use in providing a system-on-chip (SoC) including an embedded voltage regulator, comprising:
forming a redistribution layer for a multi-layer substrate; forming at least one array of vias in the multi-layer substrate, the at least one array of vias forming at least part of an inductor, at least some of the vias of the at least one array of vias electrically connected by connections provided by the redistribution layer; depositing a magnetic material between vias of the at least one array of vias; connecting an IC chip including the voltage regulator to the at least one array of vias, the IC chip connected to the at least one array of vias by at least one array of micro-bumps, the at least one array of micro-bumps underlying a layout of switching transistors of the voltage regulator, at least some of the micro-bumps electrically connected by connections provided by a metal layer of the IC chip, the at least one array of vias, the at least one array of micro-bumps, the connections provided by the redistribution layer and the connections provided by the metal layer forming an inductor. 11. The method of claim 10 further comprising forming connections between the multi-layer substrate and a printed circuit board using a plurality of solder balls on the substrate. 12. The method of claim 10, wherein the at least one array of vias comprises a first array of vias and a second array of vias, with the connections provided by the metal layer of the IC chip and the connections provided by the redistribution layer arranged such that current flowing in a first set of vias of the first array of vias and the second array of vias would flow in a direction opposite to that of a second set of vias of the first array of vias and the second array of vias, with, for each array, vias of the first set of vias being flanked by vias of the second set of vias. 13. The method of claim 12, wherein each of the first and second sets of vias includes vias linearly arranged. 14. The method of claim 10, wherein the magnetic material comprises ferrite. 15. The method of claim 12, further comprising forming a plurality of third vias providing a power supply path and a plurality of fourth vias providing a ground path, with the plurality of third vias and the plurality of fourth vias on opposing sides of the first array of vias and the second array of vias. 16. The method of claim 12, wherein the voltage regulator includes a high side switch and a low side switch coupled in series, between a higher voltage source and a lower voltage source, and the IC chip is connected to the vias such that the high side switch and the low side switch overlay the first array of vias and the second array of vias. 17. The method of claim 16, wherein the voltage regulator further includes a bypass switch coupling an inductor node to a load output node. 18. The method of claim 17, wherein the connections provided by the redistribution layer and the metal layer of the IC chip serve to provide connections to maximize inductance applied to a signal on the inductor node and minimize inductance applied to signals from the higher voltage source and the lower voltage source. | A scalable switching regulator architecture may include an integrated inductor. The integrated inductor may include vias or pillars in a multi-layer substrate, with selected vias coupled at one end by a redistribution layer of the multi-layer substrate and, variously, coupled at another end by a metal layer of a silicon integrated circuit chip or by a further redistribution layer of the multi-layer substrate. The vias may be coupled to the silicon integrated circuit chip by micro-balls, with the vias and micro-balls arranged in arrays.1. A package including an integrated circuit, comprising:
an integrated circuit (IC) chip including a system-on-chip (SoC) and a voltage regulator, the voltage regulator including first and second transistors connected in series; a multi-layer substrate coupled to the IC chip by micro-bumps, including at least one array of micro-bumps, the multi-layer substrate including at least one redistribution layer and a plurality of vias, with selected vias extending from selected ones of the micro-bumps of the at least one array of micro-bumps coupled by the at least one redistribution layer in pairs, with the selected vias electrically coupled to others of the selected vias about the micro-bumps; wherein the selected vias and the micro-bumps of the at least one array of micro-bumps form at least part of an inductor structure; and wherein the at least part of an inductor structure is positioned to correspond to a layout area of the first and second transistors of the voltage regulator. 2. The package including an integrated circuit of claim 1, wherein the multi-layer substrate includes a redistribution layer electrically coupling the selected vias to others of the selected vias about the micro-bumps. 3. The package including an integrated circuit of claim 1, wherein a metal layer of the IC chip electrically couples the selected vias to others of the selected vias about the micro-bumps. 4. The package including an integrated circuit of claim 1, wherein the at least one array of micro-bumps are arranged in a pattern and connected so as to form at least one closed loop magnetic field during operation of the IC chip. 5. The package including an integrated circuit of claim 1, wherein the micro-bumps include micro-bumps for power and ground connections, and the micro-bumps for power and ground connections are about opposite sides of the at least one array of micro-bumps. 6. The package including an integrated circuit of claim 1, wherein the at least one array of micro-bumps includes a first array of micro-bumps and a second array of micro-bumps, each of the first array of micro-bumps and the second array of micro bumps including a first set of micro-bumps and a second set of micro-bumps, the first set of micro-bumps being arranged in a pair of parallel lines, the second set of micro-bumps being arranged in a further pair of parallel lines parallel to the pair of parallel lines, the lines of the further parallel lines being separated by the pair of parallel lines of the first set of micro-bumps, the first set of micro-bumps of the first and second micro-bump arrays being configured for passage of current in a first direction and the second set of micro-bumps of the first and second micro-bump arrays being configured for passage of current in a second direction, the second direction opposite the first direction. 7. The package including an integrated circuit of claim 6, wherein the at least one array of micro-bumps includes a third array of micro-bumps between the first array of micro-bumps and the second array of micro-bumps, the third array of micro-bumps including the first set of micro-bumps and the second set of micro-bumps, the first set of micro-bumps of the third micro-bump array being configured for passage of current in the second direction and the second set of micro-bumps of the third micro-bump array being configured for passage of current in the first direction. 8. The package including an integrated circuit of claim 1, wherein a volume of the multi-layer substrate defined by the selected ones of the vias includes a magnetic material. 9. The package including an integrated circuit of claim 8, wherein the magnetic material is a ferrite. 10. A method for use in providing a system-on-chip (SoC) including an embedded voltage regulator, comprising:
forming a redistribution layer for a multi-layer substrate; forming at least one array of vias in the multi-layer substrate, the at least one array of vias forming at least part of an inductor, at least some of the vias of the at least one array of vias electrically connected by connections provided by the redistribution layer; depositing a magnetic material between vias of the at least one array of vias; connecting an IC chip including the voltage regulator to the at least one array of vias, the IC chip connected to the at least one array of vias by at least one array of micro-bumps, the at least one array of micro-bumps underlying a layout of switching transistors of the voltage regulator, at least some of the micro-bumps electrically connected by connections provided by a metal layer of the IC chip, the at least one array of vias, the at least one array of micro-bumps, the connections provided by the redistribution layer and the connections provided by the metal layer forming an inductor. 11. The method of claim 10 further comprising forming connections between the multi-layer substrate and a printed circuit board using a plurality of solder balls on the substrate. 12. The method of claim 10, wherein the at least one array of vias comprises a first array of vias and a second array of vias, with the connections provided by the metal layer of the IC chip and the connections provided by the redistribution layer arranged such that current flowing in a first set of vias of the first array of vias and the second array of vias would flow in a direction opposite to that of a second set of vias of the first array of vias and the second array of vias, with, for each array, vias of the first set of vias being flanked by vias of the second set of vias. 13. The method of claim 12, wherein each of the first and second sets of vias includes vias linearly arranged. 14. The method of claim 10, wherein the magnetic material comprises ferrite. 15. The method of claim 12, further comprising forming a plurality of third vias providing a power supply path and a plurality of fourth vias providing a ground path, with the plurality of third vias and the plurality of fourth vias on opposing sides of the first array of vias and the second array of vias. 16. The method of claim 12, wherein the voltage regulator includes a high side switch and a low side switch coupled in series, between a higher voltage source and a lower voltage source, and the IC chip is connected to the vias such that the high side switch and the low side switch overlay the first array of vias and the second array of vias. 17. The method of claim 16, wherein the voltage regulator further includes a bypass switch coupling an inductor node to a load output node. 18. The method of claim 17, wherein the connections provided by the redistribution layer and the metal layer of the IC chip serve to provide connections to maximize inductance applied to a signal on the inductor node and minimize inductance applied to signals from the higher voltage source and the lower voltage source. | 2,800 |
11,215 | 11,215 | 13,811,055 | 2,853 | Provided are a transfer roller 33 that transfers an image formed on a transfer film 46 to a card, peeling member 34 b that peels off the transfer film 46 from the card after transferring the image, and transfer roller up-and-down means 61 and peeling member up-and-down means 62 for respectively moving the transfer roller 33 and the peeling member 34 b up and down. By this means, the transfer roller 33 and the peeling member 34 b are moved up and down respectively at predetermined timing before transfer and after transfer, and it is thereby possible to always perform stable image formation without causing the transfer film to become damaged and/or deformed. | 1. A printing device for forming an image on a card-shaped recording medium, comprising:
a medium transport path in which the recording medium is transported; an image formation section, provided on the medium transport path, having a platen; medium transport means for transporting the recording medium to the image formation section; a film unit that transports a transfer film to the image formation section; a transfer roller that transfers an image formed on the transfer film to the recording medium; transfer roller up-and-down means for moving the transfer roller up and down between an actuation position in press-contact with the recording medium in the image formation section and a retracted position separated therefrom; a peeling member disposed on the downstream side in a medium transport direction of the transfer roller to peel off the transfer film of which the image is transferred in the image formation section from the recording medium; peeling member up-and-down means for moving the peeling member up and down between an actuation position for peeling off the transfer film of which the image is transferred to the recording medium and a retracted position separated from the recording medium; and control means for controlling the transfer member up-and-down means and the peeling member up-and-down means, wherein the control means shifts the transfer roller from the actuation position to the retracted position after a rear end of the recording medium passes through the transfer roller, and shifts the peeling member from the actuation position to the retracted position after the rear end of the recording medium passes through the peeling member. 2. The printing device according to claim 1, wherein the film unit is comprised of a unit frame attached to a device frame to be attachable and detachable,
a pair of spools provided on the unit frame to wind the transfer film, a guide member that guides the transfer film wound around the pair of spools toward the image formation section, and the peeling member that peels off the transfer film of which the image is transferred in the image formation section from the recording medium, and the peeling member is attached to the unit frame to be able to shift between the actuation position for peeling off the transfer film of which the image is transferred to the recording medium and the retracted position separated from the recording medium. 3. The printing device according to claim 2, wherein the transfer roller and the peeling member are respectively attached to the device frame and the unit frame of the transfer unit to be able to shift between respective actuation positions and respective retracted positions, and the transfer roller up-and-down means and the peeling member up-and-down means are comprised of a first shift member that shifts the transfer roller between the actuation position and the retracted position, a second shift member that shifts the peeling member between the actuation position and the retracted position, and a common drive motor that drives the first and second shift members. 4. The printing device according to claim 3, wherein the first shift member and the second shift member are comprised of a rotating cam coupled to a rotating shaft of the drive motor,
a first up-and-down member that shifts the transfer roller between the actuation position and the retracted position by rotation of the rotating cam, and a second up-and-down member that shifts the peeling member between the actuation position and the retracted position. 5. The Printing device according to claim 4, wherein the transfer roller is comprised of a transfer roller that heats and transfers the image formed on the transfer film to the recording medium,
the transfer roller is provided with a cover member that covers at least a part of a periphery of the roller, and the cover member is interlocked with the first up-and-down member so as to cover the periphery of the roller when the transfer roller is in the retracted position, while retracting when the transfer roller is in the actuation position. 6. A printing device, wherein the printing device is the printing device according to claim 1, and further has printing means for printing an image on the transfer film, and the printing means is comprised of an ink ribbon and a thermal head to print on the transfer film carried to the image formation section. 7. A printing device for transferring an image from a transfer film to a card-shaped recording medium, comprising:
a medium transport path in which the recording medium is transported; an image formation section, provided on the medium transport path, having a platen; medium transport means for transporting the recording medium to the image formation section; film transport means for transporting the transfer film to the image formation section; a film path formed by the film transport means; a transfer roller that transfers an image information record portion formed on the transfer film to the recording medium; transfer roller up-and-down means for moving the transfer roller up and down between an actuation position in press-contact with the recording medium in the image formation section and a retracted position separated from therefrom; a peeling member disposed on the downstream side in a medium transport direction of the transfer roller to peel off the transfer film of which the image is transferred in the image formation section from the recording medium; peeling member up-and-down means for moving the peeling member up and down between an actuation position for peeling off the transfer film from the recording medium with the film path brought into contact with the medium transport path and a retracted position separated from the medium transport path; and control means for controlling the medium transport means, the film transport means, the transfer roller up-and-down means and the peeling member up-and-down means, wherein the control means transports the recording medium and the transfer film to the image formation section to perform alignment processing for the recording medium and the image information record portion after shifting the peeling member to the actuation position, and after the processing, shifts the transfer roller to the actuation position to perform transfer processing. 8. The printing device according to claim 7, wherein the peeling member is a roller that constitutes the film transport means. 9. The printing device according to claim 8, wherein the roller exists on the downstream side in the transport direction of the recording medium than the transfer roller, and shifts in a direction orthogonal to the medium transport path. 10. The printing device according to claim 9, wherein the roller shifts to release contact between the film path and the medium transport path, after the transfer means releases pressing of the film-shaped medium against the recording medium due to finish of transfer. 11. The printing device according to claim 7, further comprising:
detection means for detecting a stop position of the image information record portion in the alignment processing,
wherein after transporting the image formation record portion of the transfer film to the image formation section to align in the alignment processing, the control means corrects a transport amount of the recording medium to the transfer start position corresponding to a detection result of the detection means, and transports the recording medium to the image formation section. 12. The printing device according to claim 11, wherein the recording medium transport means is driven by a stepping motor, and the film transport means is driven by a DC motor. 13. The printing device according to claim 12, wherein the detection means has an encoder that generates clock pulses synchronized with rotation of the DC motor, and detects a deviation amount from the transfer start position due to overrun of the DC motor since halt control of the film transport means by counting the clock pulses. 14. The printing device according to claim 13, wherein the alignment processing means adjusts a rotation amount of the stepping motor corresponding to the stop position of the image information record portion detected based on a count value of the clock pulses, and performs alignment of the image information record portion and the card. 15. A printing device for transferring an image from a transfer film to a card-shaped recording medium, comprising:
a medium transport path in which the recording medium is transported; an image formation section, provided on the medium transport path, having a platen; medium transport means for transporting the recording medium to the image formation section; film transport means for transporting the transfer film to the image formation section; a film path formed by the film transport means; a transfer roller that transfers an image information record portion formed on the transfer film to the recording medium; transfer roller up-and-down means for moving the transfer roller up and down between an actuation position in press-contact with the recording medium in the image formation section and a retracted position separated therefrom; a peeling member disposed on the downstream side in a recording medium transport direction of the transfer roller to peel off the transfer film of which the image is transferred in the image formation section from the recording medium; peeling member up-and-down means for moving the peeling member up and down between an actuation position for peeling off the transfer film from the recording medium with the film path brought into contact with the medium transport path and a retracted position separated from the medium transport path; and control means for controlling the medium transport means, the film transport means, the transfer member up-and-down means and the peeling member up-and-down means, wherein the control means transports the recording medium and the transfer film to the image formation section to perform alignment processing for the recording medium and the image information record portion after shifting the peeling member to the actuation position, shifts the transfer roller to the actuation position to start transfer processing after the alignment processing, shifts the transfer roller from the actuation position to the retracted position after a rear end of the recording medium passes through the transfer roller, and shifts the peeling member from the actuation position to the retracted position after the rear end of the recording medium passes through the peeling member. 16. A printing method for transferring an image from a transfer film to a card-shaped recording medium in a printing device comprising:
a medium transport path in which the recording medium is transported, an image formation section, provided on the medium transport path, having a platen, medium transport means for transporting the recording medium to the image formation section, film transport means for transporting the transfer film to the image formation section, a film path formed by the film transport means, a transfer roller that transfers an image information record portion formed on the transfer film to the recording medium, transfer roller up-and-down means for moving the transfer roller up and down between an actuation position in press-contact with the recording medium in the image formation section and a retracted position separated from therefrom, a peeling member disposed on the downstream side in a recording medium transport direction of the transfer roller to peel off the transfer film of which the image is transferred in the image formation section from the recording medium, peeling member up-and-down means for moving the peeling member up and down between an actuation position for peeling off the transfer film from the recording medium with the film path brought into contact with the medium transport path and a retracted position separated from the medium transport path, and control means for controlling the medium transport means, the film transport means, the transfer member up-and-down means and the peeling member up-and-down means, comprising: a peeling member shifting step of shifting the peeling member to the actuation position; an alignment processing step of transporting the recording medium and the transfer film respectively to a transfer start position to perform alignment processing after shifting the peeling member; and a transfer step of shifting the transfer roller from the retracted position to the actuation position to transfer an image to the recording medium after the alignment processing. 17. The printing method according to claim 16, wherein in the alignment processing step, after transporting the transfer film to the transfer start position, the recording medium is transported to the transfer start position corresponding to a stop position of the image information record portion. 18. The printing method according to claim 16, further comprising:
a transfer roller retracting step of shifting the transfer roller from the actuation position to the retracted position after a rear end of the recording medium passes through the transfer roller, after the transfer step; and a peeling member retracting step of shifting the peeling member from the actuation position to the retracted position after the rear end of the recording medium passes through the peeling member. 19. A printing method for transferring an image from a transfer film to a card-shaped recording medium in a printing device comprising:
a medium transport path in which the recording medium is transported, an image formation section, provided on the medium transport path, having a platen, medium transport means for transporting the recording medium to the image formation section, film transport means for transporting the transfer film to the image formation section, a film path formed by the film transport means, a transfer roller that transfers an image information record portion formed on the transfer film to the recording medium, transfer roller up-and-down means for moving the transfer roller up and down between an actuation position in press-contact with the recording medium in the image formation section and a retracted position separated therefrom, a peeling member disposed on the downstream side in a recording medium transport direction of the transfer roller to peel off the transfer film of which the image is transferred in the image formation section from the recording medium, peeling member up-and-down means for moving the peeling member up and down between an actuation position for peeling off the transfer film from the recording medium with the film path brought into contact with the medium transport path and a retracted position separated from the medium transport path, and control means for controlling the medium transport means, the film transport means, the transfer member up-and-down means and the peeling member up-and-down means, comprising: a transfer step of shifting the transfer roller and the peeling member to respective actuation positions to transfer an image from the transfer film to the recording medium; a transfer roller retracting step of shifting the transfer roller from the actuation position to the retracted position after a rear end of the recording medium passes through the transfer roller; and a peeling member retracting step of shifting the peeling member from the actuation position to the retracted position after the rear end of the recording medium passes through the peeling member. | Provided are a transfer roller 33 that transfers an image formed on a transfer film 46 to a card, peeling member 34 b that peels off the transfer film 46 from the card after transferring the image, and transfer roller up-and-down means 61 and peeling member up-and-down means 62 for respectively moving the transfer roller 33 and the peeling member 34 b up and down. By this means, the transfer roller 33 and the peeling member 34 b are moved up and down respectively at predetermined timing before transfer and after transfer, and it is thereby possible to always perform stable image formation without causing the transfer film to become damaged and/or deformed.1. A printing device for forming an image on a card-shaped recording medium, comprising:
a medium transport path in which the recording medium is transported; an image formation section, provided on the medium transport path, having a platen; medium transport means for transporting the recording medium to the image formation section; a film unit that transports a transfer film to the image formation section; a transfer roller that transfers an image formed on the transfer film to the recording medium; transfer roller up-and-down means for moving the transfer roller up and down between an actuation position in press-contact with the recording medium in the image formation section and a retracted position separated therefrom; a peeling member disposed on the downstream side in a medium transport direction of the transfer roller to peel off the transfer film of which the image is transferred in the image formation section from the recording medium; peeling member up-and-down means for moving the peeling member up and down between an actuation position for peeling off the transfer film of which the image is transferred to the recording medium and a retracted position separated from the recording medium; and control means for controlling the transfer member up-and-down means and the peeling member up-and-down means, wherein the control means shifts the transfer roller from the actuation position to the retracted position after a rear end of the recording medium passes through the transfer roller, and shifts the peeling member from the actuation position to the retracted position after the rear end of the recording medium passes through the peeling member. 2. The printing device according to claim 1, wherein the film unit is comprised of a unit frame attached to a device frame to be attachable and detachable,
a pair of spools provided on the unit frame to wind the transfer film, a guide member that guides the transfer film wound around the pair of spools toward the image formation section, and the peeling member that peels off the transfer film of which the image is transferred in the image formation section from the recording medium, and the peeling member is attached to the unit frame to be able to shift between the actuation position for peeling off the transfer film of which the image is transferred to the recording medium and the retracted position separated from the recording medium. 3. The printing device according to claim 2, wherein the transfer roller and the peeling member are respectively attached to the device frame and the unit frame of the transfer unit to be able to shift between respective actuation positions and respective retracted positions, and the transfer roller up-and-down means and the peeling member up-and-down means are comprised of a first shift member that shifts the transfer roller between the actuation position and the retracted position, a second shift member that shifts the peeling member between the actuation position and the retracted position, and a common drive motor that drives the first and second shift members. 4. The printing device according to claim 3, wherein the first shift member and the second shift member are comprised of a rotating cam coupled to a rotating shaft of the drive motor,
a first up-and-down member that shifts the transfer roller between the actuation position and the retracted position by rotation of the rotating cam, and a second up-and-down member that shifts the peeling member between the actuation position and the retracted position. 5. The Printing device according to claim 4, wherein the transfer roller is comprised of a transfer roller that heats and transfers the image formed on the transfer film to the recording medium,
the transfer roller is provided with a cover member that covers at least a part of a periphery of the roller, and the cover member is interlocked with the first up-and-down member so as to cover the periphery of the roller when the transfer roller is in the retracted position, while retracting when the transfer roller is in the actuation position. 6. A printing device, wherein the printing device is the printing device according to claim 1, and further has printing means for printing an image on the transfer film, and the printing means is comprised of an ink ribbon and a thermal head to print on the transfer film carried to the image formation section. 7. A printing device for transferring an image from a transfer film to a card-shaped recording medium, comprising:
a medium transport path in which the recording medium is transported; an image formation section, provided on the medium transport path, having a platen; medium transport means for transporting the recording medium to the image formation section; film transport means for transporting the transfer film to the image formation section; a film path formed by the film transport means; a transfer roller that transfers an image information record portion formed on the transfer film to the recording medium; transfer roller up-and-down means for moving the transfer roller up and down between an actuation position in press-contact with the recording medium in the image formation section and a retracted position separated from therefrom; a peeling member disposed on the downstream side in a medium transport direction of the transfer roller to peel off the transfer film of which the image is transferred in the image formation section from the recording medium; peeling member up-and-down means for moving the peeling member up and down between an actuation position for peeling off the transfer film from the recording medium with the film path brought into contact with the medium transport path and a retracted position separated from the medium transport path; and control means for controlling the medium transport means, the film transport means, the transfer roller up-and-down means and the peeling member up-and-down means, wherein the control means transports the recording medium and the transfer film to the image formation section to perform alignment processing for the recording medium and the image information record portion after shifting the peeling member to the actuation position, and after the processing, shifts the transfer roller to the actuation position to perform transfer processing. 8. The printing device according to claim 7, wherein the peeling member is a roller that constitutes the film transport means. 9. The printing device according to claim 8, wherein the roller exists on the downstream side in the transport direction of the recording medium than the transfer roller, and shifts in a direction orthogonal to the medium transport path. 10. The printing device according to claim 9, wherein the roller shifts to release contact between the film path and the medium transport path, after the transfer means releases pressing of the film-shaped medium against the recording medium due to finish of transfer. 11. The printing device according to claim 7, further comprising:
detection means for detecting a stop position of the image information record portion in the alignment processing,
wherein after transporting the image formation record portion of the transfer film to the image formation section to align in the alignment processing, the control means corrects a transport amount of the recording medium to the transfer start position corresponding to a detection result of the detection means, and transports the recording medium to the image formation section. 12. The printing device according to claim 11, wherein the recording medium transport means is driven by a stepping motor, and the film transport means is driven by a DC motor. 13. The printing device according to claim 12, wherein the detection means has an encoder that generates clock pulses synchronized with rotation of the DC motor, and detects a deviation amount from the transfer start position due to overrun of the DC motor since halt control of the film transport means by counting the clock pulses. 14. The printing device according to claim 13, wherein the alignment processing means adjusts a rotation amount of the stepping motor corresponding to the stop position of the image information record portion detected based on a count value of the clock pulses, and performs alignment of the image information record portion and the card. 15. A printing device for transferring an image from a transfer film to a card-shaped recording medium, comprising:
a medium transport path in which the recording medium is transported; an image formation section, provided on the medium transport path, having a platen; medium transport means for transporting the recording medium to the image formation section; film transport means for transporting the transfer film to the image formation section; a film path formed by the film transport means; a transfer roller that transfers an image information record portion formed on the transfer film to the recording medium; transfer roller up-and-down means for moving the transfer roller up and down between an actuation position in press-contact with the recording medium in the image formation section and a retracted position separated therefrom; a peeling member disposed on the downstream side in a recording medium transport direction of the transfer roller to peel off the transfer film of which the image is transferred in the image formation section from the recording medium; peeling member up-and-down means for moving the peeling member up and down between an actuation position for peeling off the transfer film from the recording medium with the film path brought into contact with the medium transport path and a retracted position separated from the medium transport path; and control means for controlling the medium transport means, the film transport means, the transfer member up-and-down means and the peeling member up-and-down means, wherein the control means transports the recording medium and the transfer film to the image formation section to perform alignment processing for the recording medium and the image information record portion after shifting the peeling member to the actuation position, shifts the transfer roller to the actuation position to start transfer processing after the alignment processing, shifts the transfer roller from the actuation position to the retracted position after a rear end of the recording medium passes through the transfer roller, and shifts the peeling member from the actuation position to the retracted position after the rear end of the recording medium passes through the peeling member. 16. A printing method for transferring an image from a transfer film to a card-shaped recording medium in a printing device comprising:
a medium transport path in which the recording medium is transported, an image formation section, provided on the medium transport path, having a platen, medium transport means for transporting the recording medium to the image formation section, film transport means for transporting the transfer film to the image formation section, a film path formed by the film transport means, a transfer roller that transfers an image information record portion formed on the transfer film to the recording medium, transfer roller up-and-down means for moving the transfer roller up and down between an actuation position in press-contact with the recording medium in the image formation section and a retracted position separated from therefrom, a peeling member disposed on the downstream side in a recording medium transport direction of the transfer roller to peel off the transfer film of which the image is transferred in the image formation section from the recording medium, peeling member up-and-down means for moving the peeling member up and down between an actuation position for peeling off the transfer film from the recording medium with the film path brought into contact with the medium transport path and a retracted position separated from the medium transport path, and control means for controlling the medium transport means, the film transport means, the transfer member up-and-down means and the peeling member up-and-down means, comprising: a peeling member shifting step of shifting the peeling member to the actuation position; an alignment processing step of transporting the recording medium and the transfer film respectively to a transfer start position to perform alignment processing after shifting the peeling member; and a transfer step of shifting the transfer roller from the retracted position to the actuation position to transfer an image to the recording medium after the alignment processing. 17. The printing method according to claim 16, wherein in the alignment processing step, after transporting the transfer film to the transfer start position, the recording medium is transported to the transfer start position corresponding to a stop position of the image information record portion. 18. The printing method according to claim 16, further comprising:
a transfer roller retracting step of shifting the transfer roller from the actuation position to the retracted position after a rear end of the recording medium passes through the transfer roller, after the transfer step; and a peeling member retracting step of shifting the peeling member from the actuation position to the retracted position after the rear end of the recording medium passes through the peeling member. 19. A printing method for transferring an image from a transfer film to a card-shaped recording medium in a printing device comprising:
a medium transport path in which the recording medium is transported, an image formation section, provided on the medium transport path, having a platen, medium transport means for transporting the recording medium to the image formation section, film transport means for transporting the transfer film to the image formation section, a film path formed by the film transport means, a transfer roller that transfers an image information record portion formed on the transfer film to the recording medium, transfer roller up-and-down means for moving the transfer roller up and down between an actuation position in press-contact with the recording medium in the image formation section and a retracted position separated therefrom, a peeling member disposed on the downstream side in a recording medium transport direction of the transfer roller to peel off the transfer film of which the image is transferred in the image formation section from the recording medium, peeling member up-and-down means for moving the peeling member up and down between an actuation position for peeling off the transfer film from the recording medium with the film path brought into contact with the medium transport path and a retracted position separated from the medium transport path, and control means for controlling the medium transport means, the film transport means, the transfer member up-and-down means and the peeling member up-and-down means, comprising: a transfer step of shifting the transfer roller and the peeling member to respective actuation positions to transfer an image from the transfer film to the recording medium; a transfer roller retracting step of shifting the transfer roller from the actuation position to the retracted position after a rear end of the recording medium passes through the transfer roller; and a peeling member retracting step of shifting the peeling member from the actuation position to the retracted position after the rear end of the recording medium passes through the peeling member. | 2,800 |
11,216 | 11,216 | 15,088,375 | 2,844 | An intelligent sensor-activated light control device including at least one ambient light sensor is described herein. In one exemplary, non-limiting embodiment, the motion is detected via one or more motion sensors. An ambient light level is then determined using one or more ambient light sensors, and a light control device causes light to be output at an output light level associated with the determined ambient light level. In one embodiment, the output light level is further determined based on a current time interval during with which the motion is detected. | 1. A method for dynamically adjusting output light levels, the method comprising:
determining, in response to motion being detected by at least one motion sensor, an ambient light level within a local environment using at least one ambient light sensor; determining a first output light level and a second output light level stored within memory, wherein the first and second output light levels are associated with the ambient light level that was determined in response to the motion being detected; determining that the first output light level is associated with a first time interval, and that the second output light level is associated with a second time interval; determining that the motion was detected at an occurrence within the first time interval; selecting the first output light level in response to determining the ambient light level and determining that the motion was detected at the occurrence; and causing, using a light control device, light to be output at the selected first output light level. 2-6. (canceled) 7. The method of claim 1, further comprising:
receiving a user input to adjust the first output light level such that the light control device causes light to be output at a third output light level; and storing, in memory, the third output light level as being associated with the ambient light level. 8. The method of claim 7, wherein storing further comprises:
determining that receiving the user input occurred within a third time interval; and storing the third output light level to also be associated with the third time interval. 9. The method of claim 1, wherein:
the at least one ambient light sensor comprises a plurality of ambient light sensors; and each ambient light sensor of the plurality of ambient light sensors is located at a different position within the local environment. 10. The method of claim 9, where determining the ambient light level further comprises:
determining a particular ambient light level for each ambient light sensor of the plurality of ambient light sensors; and determining an average ambient light level based on the particular ambient light level of each ambient light sensor. 11. An intelligent sensor-activated light control device, comprising:
at least one motion sensor structured to detect motion within a local environment within which the at least one motion sensor is located; at least one ambient light sensor structured to determine an ambient light level within the local environment in response to the motion being detected by the at least one motion sensor; memory that stores a first output light that is associated with a first time interval, and a second output light level that is associated with a second time interval, wherein the first and second output light levels are each associated with the ambient light level; a timer; a light control device structured to cause light to be output; and at least one processor structured to:
determine, using the timer, that the motion was detected at an occurrence within the first time interval;
select the first output light level in response to determining the ambient light level and determining that the motion was detected at the occurrence; and
cause, using the light control device, light to be output at the selected first output light level. 12. (canceled) 13. (canceled) 14. The intelligent sensor-activated light control device of claim 11, further comprising:
an input mechanism structured to detect an adjustment to the first output light level. 15. The intelligent sensor-activated light control device of claim 14, wherein the at least one processor is further structured to:
determine a third output light level for the light control device to cause light to be output at based on the adjustment; cause, using the light control device, light to be output at the third output light level; and store, in the memory, the third output light level as being associated with the ambient light level. 16. The intelligent sensor-activated light control device of claim 15, wherein the at least one processor is further structured to:
store, in the memory, the third output light level as also being associated with a time interval during which the adjustment is detected. 17. The intelligent sensor-activated light control device of claim 11, wherein the output light level corresponds to a default output light level, the at least one processor is further structured to:
determine a new output light level to be stored within memory as being associated with the ambient light level. 18. An intelligent sensor-activated light control system, comprising:
at least one motion sensor positioned at a first location within a local environment; at least one ambient light sensor positioned at a second location within the local environment; a light control device positioned at a third location within the local environment; a timer; memory that stores a plurality of output light levels and a plurality of ambient light levels; communications circuitry; and at least one processor structured to:
receive, using the communications circuitry, an ambient light level determined by the at least one ambient light sensor for the local environment in response to motion being detected by the at least one motion sensor;
determine, from the memory, a first output light level that is associated with a first time interval, and a second output light level that is associated with a second time interval, wherein the first and second output light levels are associated with the ambient light level;
determine, using the timer, that the motion was detected at an occurrence within the first time interval;
select, from the memory, the first output light level in response to determining the ambient light level and determining that the motion was detected at the occurrence; and
provide, using the communications circuitry, instructions to the lighting device to output light at the selected first output light level. 19. The intelligent sensor-activated light control system of claim 18, wherein the at least one processor is further structured to:
receive, using the communications circuitry, an indication that motion was detected by the at least one motion sensor. 20. The intelligent sensor-activated light control system of claim 18, wherein the at least one ambient light sensor comprises a first ambient light sensor located at the first location and a second ambient light sensor located at a fourth location within the local environment, the at least one processor is further structured to:
receive, using the communications circuitry, an additional ambient light level that was determined by the second ambient light sensor in response to the motion being detected; determine an average ambient light level within the local environment based on the ambient light level determined by the first ambient light sensor and the additional ambient light level received that was determined by the second ambient light sensor. 21. The method of claim 1, wherein each of the first and second output light levels corresponds to a one hour time interval within a twenty-four hour clock. 22. The method of claim 1, wherein each time interval is measured in at least one of:
seconds; minutes; hours; days; weeks; months; and years. | An intelligent sensor-activated light control device including at least one ambient light sensor is described herein. In one exemplary, non-limiting embodiment, the motion is detected via one or more motion sensors. An ambient light level is then determined using one or more ambient light sensors, and a light control device causes light to be output at an output light level associated with the determined ambient light level. In one embodiment, the output light level is further determined based on a current time interval during with which the motion is detected.1. A method for dynamically adjusting output light levels, the method comprising:
determining, in response to motion being detected by at least one motion sensor, an ambient light level within a local environment using at least one ambient light sensor; determining a first output light level and a second output light level stored within memory, wherein the first and second output light levels are associated with the ambient light level that was determined in response to the motion being detected; determining that the first output light level is associated with a first time interval, and that the second output light level is associated with a second time interval; determining that the motion was detected at an occurrence within the first time interval; selecting the first output light level in response to determining the ambient light level and determining that the motion was detected at the occurrence; and causing, using a light control device, light to be output at the selected first output light level. 2-6. (canceled) 7. The method of claim 1, further comprising:
receiving a user input to adjust the first output light level such that the light control device causes light to be output at a third output light level; and storing, in memory, the third output light level as being associated with the ambient light level. 8. The method of claim 7, wherein storing further comprises:
determining that receiving the user input occurred within a third time interval; and storing the third output light level to also be associated with the third time interval. 9. The method of claim 1, wherein:
the at least one ambient light sensor comprises a plurality of ambient light sensors; and each ambient light sensor of the plurality of ambient light sensors is located at a different position within the local environment. 10. The method of claim 9, where determining the ambient light level further comprises:
determining a particular ambient light level for each ambient light sensor of the plurality of ambient light sensors; and determining an average ambient light level based on the particular ambient light level of each ambient light sensor. 11. An intelligent sensor-activated light control device, comprising:
at least one motion sensor structured to detect motion within a local environment within which the at least one motion sensor is located; at least one ambient light sensor structured to determine an ambient light level within the local environment in response to the motion being detected by the at least one motion sensor; memory that stores a first output light that is associated with a first time interval, and a second output light level that is associated with a second time interval, wherein the first and second output light levels are each associated with the ambient light level; a timer; a light control device structured to cause light to be output; and at least one processor structured to:
determine, using the timer, that the motion was detected at an occurrence within the first time interval;
select the first output light level in response to determining the ambient light level and determining that the motion was detected at the occurrence; and
cause, using the light control device, light to be output at the selected first output light level. 12. (canceled) 13. (canceled) 14. The intelligent sensor-activated light control device of claim 11, further comprising:
an input mechanism structured to detect an adjustment to the first output light level. 15. The intelligent sensor-activated light control device of claim 14, wherein the at least one processor is further structured to:
determine a third output light level for the light control device to cause light to be output at based on the adjustment; cause, using the light control device, light to be output at the third output light level; and store, in the memory, the third output light level as being associated with the ambient light level. 16. The intelligent sensor-activated light control device of claim 15, wherein the at least one processor is further structured to:
store, in the memory, the third output light level as also being associated with a time interval during which the adjustment is detected. 17. The intelligent sensor-activated light control device of claim 11, wherein the output light level corresponds to a default output light level, the at least one processor is further structured to:
determine a new output light level to be stored within memory as being associated with the ambient light level. 18. An intelligent sensor-activated light control system, comprising:
at least one motion sensor positioned at a first location within a local environment; at least one ambient light sensor positioned at a second location within the local environment; a light control device positioned at a third location within the local environment; a timer; memory that stores a plurality of output light levels and a plurality of ambient light levels; communications circuitry; and at least one processor structured to:
receive, using the communications circuitry, an ambient light level determined by the at least one ambient light sensor for the local environment in response to motion being detected by the at least one motion sensor;
determine, from the memory, a first output light level that is associated with a first time interval, and a second output light level that is associated with a second time interval, wherein the first and second output light levels are associated with the ambient light level;
determine, using the timer, that the motion was detected at an occurrence within the first time interval;
select, from the memory, the first output light level in response to determining the ambient light level and determining that the motion was detected at the occurrence; and
provide, using the communications circuitry, instructions to the lighting device to output light at the selected first output light level. 19. The intelligent sensor-activated light control system of claim 18, wherein the at least one processor is further structured to:
receive, using the communications circuitry, an indication that motion was detected by the at least one motion sensor. 20. The intelligent sensor-activated light control system of claim 18, wherein the at least one ambient light sensor comprises a first ambient light sensor located at the first location and a second ambient light sensor located at a fourth location within the local environment, the at least one processor is further structured to:
receive, using the communications circuitry, an additional ambient light level that was determined by the second ambient light sensor in response to the motion being detected; determine an average ambient light level within the local environment based on the ambient light level determined by the first ambient light sensor and the additional ambient light level received that was determined by the second ambient light sensor. 21. The method of claim 1, wherein each of the first and second output light levels corresponds to a one hour time interval within a twenty-four hour clock. 22. The method of claim 1, wherein each time interval is measured in at least one of:
seconds; minutes; hours; days; weeks; months; and years. | 2,800 |
11,217 | 11,217 | 15,135,688 | 2,836 | Energy apparatuses, energy systems, and energy management methods may include energy storage. More particularly, energy apparatuses, energy systems, and energy management methods may include at least one of: energy source health data, weather data, or energy load prioritization data. The energy apparatuses, energy systems, and energy management methods may automatically control flow of energy based on at least one of: energy source health data, weather data, or energy load prioritization data. | 1. An energy conversion apparatus, comprising:
at least one first reconfigurable energy source input, wherein the at least one first reconfigurable energy source input is reconfigurable based upon first energy source characteristic data received by the energy conversion apparatus; at least one second reconfigurable energy source input, wherein the at least one second reconfigurable energy source input is reconfigurable based upon second energy source characteristic data received by the energy conversion apparatus; at least one energy storage device connection; and at least one energy load output, wherein the energy conversion apparatus is configured to provide energy to the at least one energy load output based upon the first and second energy source characteristic data, and further based on a quantity of energy stored in at least one energy storage device. 2. The energy conversion apparatus as in claim 1, wherein the at least one energy storage device connection is reconfigurable based upon energy storage device characteristic data received by the energy conversion apparatus. 3. The energy conversion apparatus as in claim 1, wherein the at least one energy load output is reconfigurable based upon energy load characteristic data received by the energy conversion apparatus. 4. The energy conversion apparatus as in claim 1, wherein at least one of: the first energy source characteristic data, or the second energy source characteristic data is automatically received by the energy conversion apparatus when a respective energy source is connected to the energy conversion apparatus. 5. The energy conversion apparatus as in claim 1, further comprising:
a user interface device, wherein at least one of: the first energy source characteristic data, or the second energy source characteristic data is received by the energy conversion apparatus via the user interface device. 6. The energy conversion apparatus as in claim 1, further comprising:
an energy conversion device, wherein the energy conversion device is configured to perform at least one of: rectify alternating electric current to direct electric current, invert direct electric current to alternating electric current, or convert a first direct electric current source value to a second direct current source value. 7. The energy conversion apparatus of claim 6, wherein the energy conversion device is bidirectional. 8. The energy conversion apparatus of claim 1, wherein the energy conversion apparatus automatically receives weather data, and wherein the energy conversion device automatically determines an amount of energy to provide to the at least one energy load connection from the first energy source input and the second energy source input based on the weather data. 9. The energy conversion apparatus of claim 1, wherein the energy conversion apparatus automatically receives energy source health data, and wherein the energy conversion device automatically determines an amount of energy to provide to the at least one energy load connection from the first energy source input and the second energy source input based on the energy source health data. 10. The energy conversion apparatus of claim 1, further comprising:
at least one second energy load output, wherein the energy conversion device automatically receives energy load priority data, and wherein the energy conversion device determines energy flow to a respective energy load based upon the energy load priority data. 11. An energy management system, comprising:
at least one energy conversion apparatus having at least two energy source inputs, at least one energy storage device connection, and at least one energy load output; and a controller having at least one energy source health data input and at least one energy conversion apparatus output, wherein the controller generates the at least one energy conversion apparatus output based upon energy source health data received via the at least one energy source health data input. 12. The energy management system as in claim 11, wherein the energy source health data is representative of at least one of: a health of at least one energy source, a health of at least one connection to at least one energy source, or availability of a primary energy source to at least one secondary energy source. 13. The energy management system of claim 11, wherein the energy source health data includes weather data that is representative of at least one of: a solar radiation value, or a wind speed value. 14. The energy system of claim 11, wherein the controller automatically receives energy storage device health data, and wherein the controller automatically determines an amount of energy to provide to the at least one energy load connection from the first energy source input and the second energy source input based on the energy storage device health data. 15. The energy conversion apparatus of claim 11, further comprising:
at least one second energy load output, wherein the controller automatically receives energy load priority data, and wherein the controller determines energy flow to a respective energy load based upon the energy load priority data. 16. An energy management system, comprising:
at least one energy conversion apparatus having at least one energy source input, at least one energy storage device connection, and at least two energy load outputs; and a controller having at least one energy load priority data input and at least one energy conversion apparatus output, wherein the controller generates the at least one energy conversion apparatus output based upon energy load priority data received via the at least one energy load priority data input. 17. The energy conversion apparatus of claim 16, wherein the controller automatically receives energy source health data, and wherein the controller determines energy flow based upon the energy source health data. 18. The energy management system as in claim 17, wherein the energy source health data is representative of at least one of: a health of at least one energy source, a health of at least one connection to at least one energy source, or availability of a primary energy source to at least one secondary energy source. 19. The energy management system of claim 17, wherein the energy source health data includes weather data that is representative of at least one of: a solar radiation value, or a wind speed value. 20. The energy system of claim 17, wherein the controller automatically receives energy storage device health data, and wherein the controller automatically determines an amount of energy to provide to at least one energy load connection from the energy source input and the energy device connection based on the energy storage device health data. | Energy apparatuses, energy systems, and energy management methods may include energy storage. More particularly, energy apparatuses, energy systems, and energy management methods may include at least one of: energy source health data, weather data, or energy load prioritization data. The energy apparatuses, energy systems, and energy management methods may automatically control flow of energy based on at least one of: energy source health data, weather data, or energy load prioritization data.1. An energy conversion apparatus, comprising:
at least one first reconfigurable energy source input, wherein the at least one first reconfigurable energy source input is reconfigurable based upon first energy source characteristic data received by the energy conversion apparatus; at least one second reconfigurable energy source input, wherein the at least one second reconfigurable energy source input is reconfigurable based upon second energy source characteristic data received by the energy conversion apparatus; at least one energy storage device connection; and at least one energy load output, wherein the energy conversion apparatus is configured to provide energy to the at least one energy load output based upon the first and second energy source characteristic data, and further based on a quantity of energy stored in at least one energy storage device. 2. The energy conversion apparatus as in claim 1, wherein the at least one energy storage device connection is reconfigurable based upon energy storage device characteristic data received by the energy conversion apparatus. 3. The energy conversion apparatus as in claim 1, wherein the at least one energy load output is reconfigurable based upon energy load characteristic data received by the energy conversion apparatus. 4. The energy conversion apparatus as in claim 1, wherein at least one of: the first energy source characteristic data, or the second energy source characteristic data is automatically received by the energy conversion apparatus when a respective energy source is connected to the energy conversion apparatus. 5. The energy conversion apparatus as in claim 1, further comprising:
a user interface device, wherein at least one of: the first energy source characteristic data, or the second energy source characteristic data is received by the energy conversion apparatus via the user interface device. 6. The energy conversion apparatus as in claim 1, further comprising:
an energy conversion device, wherein the energy conversion device is configured to perform at least one of: rectify alternating electric current to direct electric current, invert direct electric current to alternating electric current, or convert a first direct electric current source value to a second direct current source value. 7. The energy conversion apparatus of claim 6, wherein the energy conversion device is bidirectional. 8. The energy conversion apparatus of claim 1, wherein the energy conversion apparatus automatically receives weather data, and wherein the energy conversion device automatically determines an amount of energy to provide to the at least one energy load connection from the first energy source input and the second energy source input based on the weather data. 9. The energy conversion apparatus of claim 1, wherein the energy conversion apparatus automatically receives energy source health data, and wherein the energy conversion device automatically determines an amount of energy to provide to the at least one energy load connection from the first energy source input and the second energy source input based on the energy source health data. 10. The energy conversion apparatus of claim 1, further comprising:
at least one second energy load output, wherein the energy conversion device automatically receives energy load priority data, and wherein the energy conversion device determines energy flow to a respective energy load based upon the energy load priority data. 11. An energy management system, comprising:
at least one energy conversion apparatus having at least two energy source inputs, at least one energy storage device connection, and at least one energy load output; and a controller having at least one energy source health data input and at least one energy conversion apparatus output, wherein the controller generates the at least one energy conversion apparatus output based upon energy source health data received via the at least one energy source health data input. 12. The energy management system as in claim 11, wherein the energy source health data is representative of at least one of: a health of at least one energy source, a health of at least one connection to at least one energy source, or availability of a primary energy source to at least one secondary energy source. 13. The energy management system of claim 11, wherein the energy source health data includes weather data that is representative of at least one of: a solar radiation value, or a wind speed value. 14. The energy system of claim 11, wherein the controller automatically receives energy storage device health data, and wherein the controller automatically determines an amount of energy to provide to the at least one energy load connection from the first energy source input and the second energy source input based on the energy storage device health data. 15. The energy conversion apparatus of claim 11, further comprising:
at least one second energy load output, wherein the controller automatically receives energy load priority data, and wherein the controller determines energy flow to a respective energy load based upon the energy load priority data. 16. An energy management system, comprising:
at least one energy conversion apparatus having at least one energy source input, at least one energy storage device connection, and at least two energy load outputs; and a controller having at least one energy load priority data input and at least one energy conversion apparatus output, wherein the controller generates the at least one energy conversion apparatus output based upon energy load priority data received via the at least one energy load priority data input. 17. The energy conversion apparatus of claim 16, wherein the controller automatically receives energy source health data, and wherein the controller determines energy flow based upon the energy source health data. 18. The energy management system as in claim 17, wherein the energy source health data is representative of at least one of: a health of at least one energy source, a health of at least one connection to at least one energy source, or availability of a primary energy source to at least one secondary energy source. 19. The energy management system of claim 17, wherein the energy source health data includes weather data that is representative of at least one of: a solar radiation value, or a wind speed value. 20. The energy system of claim 17, wherein the controller automatically receives energy storage device health data, and wherein the controller automatically determines an amount of energy to provide to at least one energy load connection from the energy source input and the energy device connection based on the energy storage device health data. | 2,800 |
11,218 | 11,218 | 13,230,071 | 2,862 | An apparatus and method for estimating a parameter of interest of an earth formation involving an electromagnetic transient response of an earth formation and a two thin-sheet conductor model of the earth formation. The method may include generating an electromagnetic transient response in the earth formation, generating a signal indicative of the response, and estimating the at least one parameter of interest using the signal. The method may also include estimating a boundary distance using the at least one parameter of interest. The apparatus may include at least one antenna configured to generate the electromagnetic response in the earth formation and at least one processor configured to estimate the at least one processor based on the electromagnetic transient response. | 1. A method of estimating at least one parameter of interest of an earth formation, comprising:
estimating the at least one parameter of interest using a two thin-sheet conductor model with electromagnetic transient information obtained using a receiver in a borehole penetrating the earth formation. 2. The method of claim 1, further comprising:
generating an electromagnetic transient response in the earth formation using a transmitter; and obtaining the electromagnetic transient information from the electromagnetic transient response using the receiver. 3. The method of claim 3, wherein the electromagnetic transient information is obtained at least three different depths. 4. The method of claim 1, wherein the at least one parameter of interest includes at least one of: (i) a conductance distribution, (ii) a resistivity profile, and (iii) a conductivity profile. 5. The method of claim 1, further comprising:
estimating at least one boundary distance using the at least one parameter of interest. 6. The method of claim 1, further comprising:
conveying the receiver in the borehole. 7. The method of claim 1, wherein the two thin-sheet conductor model includes an upper sheet and a lower sheet, and wherein using the two thin-sheet conductor model includes estimating a conductance and a distance for the upper sheet and the lower sheet. 8. The method of claim 7, wherein estimating the conductance of and the distance to each of the two thin-sheet conductors includes solving:
V
≈
V
|
z
=
-
H
1
+
V
|
z
=
H
2
=
Mm
-
2
π
S
1
·
9
r
2
-
6
m
-
2
[
r
2
+
m
-
2
]
7
/
2
+
Mm
+
2
π
S
2
·
9
r
2
-
6
m
+
2
[
r
2
+
m
+
2
]
7
/
2
,
where
m
-
=
2
H
1
+
2
t
μ
0
S
1
+
h
,
m
+
=
2
H
2
+
2
t
μ
0
S
2
-
h
,
V is a voltage of an electromagnetic transient detected at the receiver, M is an electric moment of a transmitter, r is a horizontal distance from the transmitter, H1 is the distance to the upper sheet, H2 is the distance to the lower sheet, S1 is the conductance of the upper sheet, S2 is the conductance of the lower sheet, μ0 is magnetic permeability, z is a vertical distance from the transmitter, h is a vertical distance between the transmitter and the receiver, and t is time. 9. An apparatus for estimating a parameter of interest of an earth formation, comprising:
at least one antenna configured to generate an electromagnetic transient response in the earth formation and configured to generate a electromagnetic transient information based on the electromagnetic transient response; and at least one processor configured to estimate at least one parameter of interest of the earth formation using the electromagnetic transient information. 10. The apparatus of claim 9, wherein the at least one antenna includes at least one transmitter antenna and at least one receiver antenna, the at least one transmitter antenna being configured to generate the electromagnetic transient response and the at least one receiver antenna being configured to generate the electromagnetic information based on the electromagnetic transient response. 11. The apparatus of claim 9, wherein the at least one parameter of interest includes at least one of: (i) a conductivity distribution and (ii) a resistivity profile. 12. The apparatus of claim 9, wherein the at least one processor is further configured to estimate at least one boundary distance using the at least one parameter of interest. 13. The apparatus of claim 9, further comprising:
a carrier configured to be conveyed in a borehole penetrating the earth formation, wherein the at least one transmitter and at least one receiver are disposed on the carrier. 14. A non-transitory computer-readable medium product having stored thereon instructions that, when executed by at least one processor, perform a method, the method comprising:
estimating at least one parameter of interest using a two thin-sheet conductor model with electromagnetic transient information obtained using a receiver in a borehole penetrating the earth formation. 15. The non-transitory computer-readable medium product of claim 14 further comprising at least one of: (i) a ROM, (ii) an EPROM, (iii) an EEPROM, (iv) a flash memory, and (v) an optical disk. | An apparatus and method for estimating a parameter of interest of an earth formation involving an electromagnetic transient response of an earth formation and a two thin-sheet conductor model of the earth formation. The method may include generating an electromagnetic transient response in the earth formation, generating a signal indicative of the response, and estimating the at least one parameter of interest using the signal. The method may also include estimating a boundary distance using the at least one parameter of interest. The apparatus may include at least one antenna configured to generate the electromagnetic response in the earth formation and at least one processor configured to estimate the at least one processor based on the electromagnetic transient response.1. A method of estimating at least one parameter of interest of an earth formation, comprising:
estimating the at least one parameter of interest using a two thin-sheet conductor model with electromagnetic transient information obtained using a receiver in a borehole penetrating the earth formation. 2. The method of claim 1, further comprising:
generating an electromagnetic transient response in the earth formation using a transmitter; and obtaining the electromagnetic transient information from the electromagnetic transient response using the receiver. 3. The method of claim 3, wherein the electromagnetic transient information is obtained at least three different depths. 4. The method of claim 1, wherein the at least one parameter of interest includes at least one of: (i) a conductance distribution, (ii) a resistivity profile, and (iii) a conductivity profile. 5. The method of claim 1, further comprising:
estimating at least one boundary distance using the at least one parameter of interest. 6. The method of claim 1, further comprising:
conveying the receiver in the borehole. 7. The method of claim 1, wherein the two thin-sheet conductor model includes an upper sheet and a lower sheet, and wherein using the two thin-sheet conductor model includes estimating a conductance and a distance for the upper sheet and the lower sheet. 8. The method of claim 7, wherein estimating the conductance of and the distance to each of the two thin-sheet conductors includes solving:
V
≈
V
|
z
=
-
H
1
+
V
|
z
=
H
2
=
Mm
-
2
π
S
1
·
9
r
2
-
6
m
-
2
[
r
2
+
m
-
2
]
7
/
2
+
Mm
+
2
π
S
2
·
9
r
2
-
6
m
+
2
[
r
2
+
m
+
2
]
7
/
2
,
where
m
-
=
2
H
1
+
2
t
μ
0
S
1
+
h
,
m
+
=
2
H
2
+
2
t
μ
0
S
2
-
h
,
V is a voltage of an electromagnetic transient detected at the receiver, M is an electric moment of a transmitter, r is a horizontal distance from the transmitter, H1 is the distance to the upper sheet, H2 is the distance to the lower sheet, S1 is the conductance of the upper sheet, S2 is the conductance of the lower sheet, μ0 is magnetic permeability, z is a vertical distance from the transmitter, h is a vertical distance between the transmitter and the receiver, and t is time. 9. An apparatus for estimating a parameter of interest of an earth formation, comprising:
at least one antenna configured to generate an electromagnetic transient response in the earth formation and configured to generate a electromagnetic transient information based on the electromagnetic transient response; and at least one processor configured to estimate at least one parameter of interest of the earth formation using the electromagnetic transient information. 10. The apparatus of claim 9, wherein the at least one antenna includes at least one transmitter antenna and at least one receiver antenna, the at least one transmitter antenna being configured to generate the electromagnetic transient response and the at least one receiver antenna being configured to generate the electromagnetic information based on the electromagnetic transient response. 11. The apparatus of claim 9, wherein the at least one parameter of interest includes at least one of: (i) a conductivity distribution and (ii) a resistivity profile. 12. The apparatus of claim 9, wherein the at least one processor is further configured to estimate at least one boundary distance using the at least one parameter of interest. 13. The apparatus of claim 9, further comprising:
a carrier configured to be conveyed in a borehole penetrating the earth formation, wherein the at least one transmitter and at least one receiver are disposed on the carrier. 14. A non-transitory computer-readable medium product having stored thereon instructions that, when executed by at least one processor, perform a method, the method comprising:
estimating at least one parameter of interest using a two thin-sheet conductor model with electromagnetic transient information obtained using a receiver in a borehole penetrating the earth formation. 15. The non-transitory computer-readable medium product of claim 14 further comprising at least one of: (i) a ROM, (ii) an EPROM, (iii) an EEPROM, (iv) a flash memory, and (v) an optical disk. | 2,800 |
11,219 | 11,219 | 15,336,995 | 2,849 | An integrated circuit may have two signal paths: an open-loop modulator (which may comprise a digital-input Class-D amplifier) and a closed-loop modulator (which may comprise an analog-input Class-D amplifier). A control subsystem may be capable of selecting either of the open-loop modulator or the closed-loop modulator as a selected path based on one or more characteristics (e.g., signal magnitude) of an input audio signal. For example, for higher-magnitude signals, the closed-loop modulator may be selected while the open-loop modulator may be selected for lower-magnitude signals. In some instances, when the open-loop modulator is selected as the selected path, the closed-loop modulator may power off, which may reduce power consumption. In addition, one or more techniques may be applied to reduce or eliminate user-perceptible audio artifacts caused by switching between the open-loop modulator and the closed-loop modulator, and vice versa. | 1. A system comprising:
an open-loop modulator configured to receive an input signal and generate an output signal based on the input signal when the open-loop modulator is selected as a selected path; a closed-loop modulator configured to receive the input signal and generate a closed-loop output signal based on the input signal when the closed-loop modulator is selected as the selected path; and a control subsystem configured to select one of the open-loop modulator and the closed-loop modulator as the selected path based on one or more characteristics of the input signal. 2. The system of claim 1, wherein the open-loop modulator comprises a digital-input Class-D amplifier. 3. The system of claim 1, wherein the closed-loop modulator comprises an analog-input Class-D amplifier. 4. The system of claim 1, wherein the open-loop modulator and the closed-loop modulator each comprise and share:
a switched output stage configured to drive an output load with the output signal; and a predriver stage configured to drive one or more predriver signals to the output stage based on the input signal, wherein the output signal is a function of the one or more predriver signals. 5. The system of claim 4, wherein the predriver generates the one or more predriver signals based on a control signal which is a function of the input signal. 6. The system of claim 5, wherein the control signal is a pulse-width modulated signal. 7. The system of claim 1, wherein the input signal is a pulse-width modulated signal. 8. The system of claim 1, wherein the control subsystem is configured to power on the closed-loop modulator for a period of time prior to switching selection of the selected path from the open-loop modulator to the closed-loop modulator. 9. The system of claim 1, wherein the control subsystem is configured to select the selected path based on a magnitude of the input signal. 10. The system of claim 1, wherein the control subsystem is configured to select the selected path based on whether a magnitude of the input signal crosses a threshold value within a period of time after a zero-crossing event of the input signal. 11. The system of claim 10, wherein the control subsystem is configured to:
select the closed-loop modulator as the selected path when the magnitude of the input signal crosses above the threshold value within a period of time after a zero-crossing event of the input signal; and select the open-loop modulator as the selected path when the magnitude of the input signal remains below the threshold value within a period of time after a zero-crossing event of the input signal. 12. The system of claim 1, wherein the control subsystem is configured to select the selected path based on a slew rate of the input signal at a zero-crossing event of the input signal. 13. The system of claim 12, wherein the control subsystem is configured to:
select the closed-loop modulator as the selected path when a magnitude of the slew rate of the input signal is greater than a threshold slew rate at the zero-crossing; and select the open-loop modulator as the selected path when the magnitude of the slew rate of the input signal is lesser than a threshold slew rate at the zero-crossing. 14. The system of claim 1, wherein the open-loop modulator includes a digital equalization filter configured to match a transfer function of the open-loop modulator to a transfer function of the closed-loop modulator. 15. The system of claim 14, wherein the digital equalization filter may be calibrated in accordance with a calibration operation to match the transfer function of the open-loop modulator to the transfer function of the closed-loop modulator. 16. The system of claim 1, wherein the closed-loop modulator comprises a low-pass filter configured to convert an error signal equal to the difference between the analog version of the input signal and a feedback signal generated by the closed-loop modulator into a filtered error signal. 17. The system of claim 16, wherein the closed-loop modulator further comprises a feedforward path that bypasses the low-pass filter and combines the input signal with the filtered error signal. 18. The system of claim 1, wherein the controller is further configured to power off the closed-loop modulator when the open-loop modulator is the selected path. 19. A method comprising:
selecting one of an open-loop modulator and a closed-loop modulator based on one or more characteristics of an input signal; generating an output signal based on the input signal by the open-loop modulator when the open-loop modulator is selected as a selected path; and generating an output signal based on the input signal by the closed-loop modulator when the closed-loop modulator is selected as a selected path. 20. The method of claim 19, wherein the open-loop modulator comprises a digital-input Class-D amplifier. 21. The method of claim 19, wherein the closed-loop modulator comprises an analog-input Class-D amplifier. 22. The method of claim 19, further comprising:
driving an output load with the output signal by a switched output stage shared by the open-loop modulator and the closed-loop modulator; and drive one or more predriver signals to the output stage based on the input signal by a predriver shared the open-loop modulator and the closed-loop modulator, wherein the output signal is a function of the one or more predriver signals. 23. The method of claim 22, further comprising generating the one or more predriver signals based on a control signal which is a function of the input signal. 24. The method of claim 23, wherein the control signal is a pulse-width modulated signal. 25. The method of claim 19, wherein the input signal is a pulse-width modulated signal. 26. The method of claim 19, further comprising powering on the closed-loop Class-D modulator for a period of time prior to switching selection of the selected path from the open-loop modulator to the closed-loop modulator. 27. The method of claim 19, further comprising selecting the selected path based on a magnitude of the input signal. 28. The method of claim 19, further comprising selecting the selected path based on whether a magnitude of the input signal crosses a threshold value within a period of time after a zero-crossing event of the input signal. 29. The method of claim 28, further comprising:
selecting the closed-loop modulator as the selected path when the magnitude of the input signal crosses above the threshold value within a period of time after a zero-crossing event of the input signal; and selecting the open-loop modulator as the selected path when the magnitude of the input signal remains below the threshold value within a period of time after a zero-crossing event of the input signal. 30. The method of claim 19, further comprising selecting the selected path based on a slew rate of the input signal at a zero-crossing event of the input signal. 31. The method of claim 30, further comprising:
selecting the closed-loop modulator as the selected path when a magnitude of the slew rate of the input signal is greater than a threshold slew rate at the zero-crossing; and selecting the open-loop modulator as the selected path when the magnitude of the slew rate of the input signal is lesser than a threshold slew rate at the zero-crossing. 32. The method of claim 19, further comprising applying a digital equalization filter within the open-loop modulator to match a transfer function of the open-loop modulator to a transfer function of the closed-loop modulator. 33. The method of claim 32, further comprising calibrating the digital equalization filter in accordance with a calibration operation to match the transfer function of the open-loop modulator to the transfer function of the closed-loop modulator. 34. The method of claim 19, further comprising converting by a low-pass filter within the closed-loop modulator an error signal equal to the difference between the analog version of the input signal and a feedback signal generated by the closed-loop modulator into a filtered error signal. 35. The method of claim 34, further comprising bypassing the low-pass filter with a feedforward path that combines the input signal with the filtered error signal. 36. The method of claim 19, further comprising powering off the closed-loop modulator when the open-loop modulator is the selected path. 37. The method of claim 19, wherein the open-loop modulator is a digital open-loop modulator. 38. The method of claim 19, wherein the closed-loop modulator is an analog closed-loop modulator. 39. The method of claim 19, comprising
selecting the closed-loop modulator as the selected path when the magnitude of the input signal is above a threshold value; and selecting the open-loop modulator as the selected path when the magnitude of the input signal is below the threshold value. 40. The system of claim 1, wherein the open-loop modulator is a digital open-loop modulator. 41. The system of claim 1, wherein the closed-loop modulator is an analog closed-loop modulator. 42. The method of claim 19, wherein the control subsystem is configured to:
select the closed-loop modulator as the selected path when the magnitude of the input signal is above a threshold value; and select the open-loop modulator as the selected path when the magnitude of the input signal is below the threshold value. | An integrated circuit may have two signal paths: an open-loop modulator (which may comprise a digital-input Class-D amplifier) and a closed-loop modulator (which may comprise an analog-input Class-D amplifier). A control subsystem may be capable of selecting either of the open-loop modulator or the closed-loop modulator as a selected path based on one or more characteristics (e.g., signal magnitude) of an input audio signal. For example, for higher-magnitude signals, the closed-loop modulator may be selected while the open-loop modulator may be selected for lower-magnitude signals. In some instances, when the open-loop modulator is selected as the selected path, the closed-loop modulator may power off, which may reduce power consumption. In addition, one or more techniques may be applied to reduce or eliminate user-perceptible audio artifacts caused by switching between the open-loop modulator and the closed-loop modulator, and vice versa.1. A system comprising:
an open-loop modulator configured to receive an input signal and generate an output signal based on the input signal when the open-loop modulator is selected as a selected path; a closed-loop modulator configured to receive the input signal and generate a closed-loop output signal based on the input signal when the closed-loop modulator is selected as the selected path; and a control subsystem configured to select one of the open-loop modulator and the closed-loop modulator as the selected path based on one or more characteristics of the input signal. 2. The system of claim 1, wherein the open-loop modulator comprises a digital-input Class-D amplifier. 3. The system of claim 1, wherein the closed-loop modulator comprises an analog-input Class-D amplifier. 4. The system of claim 1, wherein the open-loop modulator and the closed-loop modulator each comprise and share:
a switched output stage configured to drive an output load with the output signal; and a predriver stage configured to drive one or more predriver signals to the output stage based on the input signal, wherein the output signal is a function of the one or more predriver signals. 5. The system of claim 4, wherein the predriver generates the one or more predriver signals based on a control signal which is a function of the input signal. 6. The system of claim 5, wherein the control signal is a pulse-width modulated signal. 7. The system of claim 1, wherein the input signal is a pulse-width modulated signal. 8. The system of claim 1, wherein the control subsystem is configured to power on the closed-loop modulator for a period of time prior to switching selection of the selected path from the open-loop modulator to the closed-loop modulator. 9. The system of claim 1, wherein the control subsystem is configured to select the selected path based on a magnitude of the input signal. 10. The system of claim 1, wherein the control subsystem is configured to select the selected path based on whether a magnitude of the input signal crosses a threshold value within a period of time after a zero-crossing event of the input signal. 11. The system of claim 10, wherein the control subsystem is configured to:
select the closed-loop modulator as the selected path when the magnitude of the input signal crosses above the threshold value within a period of time after a zero-crossing event of the input signal; and select the open-loop modulator as the selected path when the magnitude of the input signal remains below the threshold value within a period of time after a zero-crossing event of the input signal. 12. The system of claim 1, wherein the control subsystem is configured to select the selected path based on a slew rate of the input signal at a zero-crossing event of the input signal. 13. The system of claim 12, wherein the control subsystem is configured to:
select the closed-loop modulator as the selected path when a magnitude of the slew rate of the input signal is greater than a threshold slew rate at the zero-crossing; and select the open-loop modulator as the selected path when the magnitude of the slew rate of the input signal is lesser than a threshold slew rate at the zero-crossing. 14. The system of claim 1, wherein the open-loop modulator includes a digital equalization filter configured to match a transfer function of the open-loop modulator to a transfer function of the closed-loop modulator. 15. The system of claim 14, wherein the digital equalization filter may be calibrated in accordance with a calibration operation to match the transfer function of the open-loop modulator to the transfer function of the closed-loop modulator. 16. The system of claim 1, wherein the closed-loop modulator comprises a low-pass filter configured to convert an error signal equal to the difference between the analog version of the input signal and a feedback signal generated by the closed-loop modulator into a filtered error signal. 17. The system of claim 16, wherein the closed-loop modulator further comprises a feedforward path that bypasses the low-pass filter and combines the input signal with the filtered error signal. 18. The system of claim 1, wherein the controller is further configured to power off the closed-loop modulator when the open-loop modulator is the selected path. 19. A method comprising:
selecting one of an open-loop modulator and a closed-loop modulator based on one or more characteristics of an input signal; generating an output signal based on the input signal by the open-loop modulator when the open-loop modulator is selected as a selected path; and generating an output signal based on the input signal by the closed-loop modulator when the closed-loop modulator is selected as a selected path. 20. The method of claim 19, wherein the open-loop modulator comprises a digital-input Class-D amplifier. 21. The method of claim 19, wherein the closed-loop modulator comprises an analog-input Class-D amplifier. 22. The method of claim 19, further comprising:
driving an output load with the output signal by a switched output stage shared by the open-loop modulator and the closed-loop modulator; and drive one or more predriver signals to the output stage based on the input signal by a predriver shared the open-loop modulator and the closed-loop modulator, wherein the output signal is a function of the one or more predriver signals. 23. The method of claim 22, further comprising generating the one or more predriver signals based on a control signal which is a function of the input signal. 24. The method of claim 23, wherein the control signal is a pulse-width modulated signal. 25. The method of claim 19, wherein the input signal is a pulse-width modulated signal. 26. The method of claim 19, further comprising powering on the closed-loop Class-D modulator for a period of time prior to switching selection of the selected path from the open-loop modulator to the closed-loop modulator. 27. The method of claim 19, further comprising selecting the selected path based on a magnitude of the input signal. 28. The method of claim 19, further comprising selecting the selected path based on whether a magnitude of the input signal crosses a threshold value within a period of time after a zero-crossing event of the input signal. 29. The method of claim 28, further comprising:
selecting the closed-loop modulator as the selected path when the magnitude of the input signal crosses above the threshold value within a period of time after a zero-crossing event of the input signal; and selecting the open-loop modulator as the selected path when the magnitude of the input signal remains below the threshold value within a period of time after a zero-crossing event of the input signal. 30. The method of claim 19, further comprising selecting the selected path based on a slew rate of the input signal at a zero-crossing event of the input signal. 31. The method of claim 30, further comprising:
selecting the closed-loop modulator as the selected path when a magnitude of the slew rate of the input signal is greater than a threshold slew rate at the zero-crossing; and selecting the open-loop modulator as the selected path when the magnitude of the slew rate of the input signal is lesser than a threshold slew rate at the zero-crossing. 32. The method of claim 19, further comprising applying a digital equalization filter within the open-loop modulator to match a transfer function of the open-loop modulator to a transfer function of the closed-loop modulator. 33. The method of claim 32, further comprising calibrating the digital equalization filter in accordance with a calibration operation to match the transfer function of the open-loop modulator to the transfer function of the closed-loop modulator. 34. The method of claim 19, further comprising converting by a low-pass filter within the closed-loop modulator an error signal equal to the difference between the analog version of the input signal and a feedback signal generated by the closed-loop modulator into a filtered error signal. 35. The method of claim 34, further comprising bypassing the low-pass filter with a feedforward path that combines the input signal with the filtered error signal. 36. The method of claim 19, further comprising powering off the closed-loop modulator when the open-loop modulator is the selected path. 37. The method of claim 19, wherein the open-loop modulator is a digital open-loop modulator. 38. The method of claim 19, wherein the closed-loop modulator is an analog closed-loop modulator. 39. The method of claim 19, comprising
selecting the closed-loop modulator as the selected path when the magnitude of the input signal is above a threshold value; and selecting the open-loop modulator as the selected path when the magnitude of the input signal is below the threshold value. 40. The system of claim 1, wherein the open-loop modulator is a digital open-loop modulator. 41. The system of claim 1, wherein the closed-loop modulator is an analog closed-loop modulator. 42. The method of claim 19, wherein the control subsystem is configured to:
select the closed-loop modulator as the selected path when the magnitude of the input signal is above a threshold value; and select the open-loop modulator as the selected path when the magnitude of the input signal is below the threshold value. | 2,800 |
11,220 | 11,220 | 14,698,789 | 2,872 | A diffraction grating comprises a substrate (with index n sub ) with a surface facing an optical medium (with index n med <n sub ), a dielectric or semiconductor layer of thickness t on the substrate surface (with index n L ≠n sub ), and a set of diffractive elements on the layer (with index n R ≠n med ). The diffractive elements comprise a set of ridges protruding into the optical medium, which fills trenches between the ridges, and are characterized by a spacing Λ, a width d, and a height h. Over an operational wavelength range, λ/2n sub <Λ<λ/(n sub +n med ). An optical signal incident on the diffractive elements from within the substrate at an incidence angle exceeding the critical angle, n sub , n med , n L , n R , Λ, d, h, and t result in wavelength-dependent, first-order diffraction efficiency of the grating greater than a prescribed level over the operational wavelength range for both s- and p-polarized optical signals. | 1. A diffraction grating comprising:
(a) a substrate comprising a dielectric or semiconductor substrate material substantially transparent over a range of operational wavelengths with a substrate refractive index nsub, and having a first surface facing an optical medium with a medium refractive index nmed that is less than nsub; (b) a dielectric or semiconductor layer formed on the first surface of the substrate, substantially transparent over the operational wavelength range, and characterized by a layer refractive index nL and a layer thickness t, wherein nL differs from both nsub and nmed; (c) a set of diffractive elements formed on the layer on the first surface of the substrate, wherein (i) the diffractive elements comprise a set of protruding ridges of a dielectric or semiconductor ridge material, (ii) the ridge material is substantially transparent over the operational wavelength range and has a ridge refractive index nR that differs from nmed, (iii) the ridges are characterized by a ridge spacing Λ, a ridge width d, and a ridge height h, and (iv) the ridges are separated by intervening trenches substantially filled with the optical medium, wherein: (d) λ/2nsub<Λ<λ/(nsub+nmed) over the operational wavelength range; and (e) nsub, nmed, nL, nR, Λ, d, h, and t result in wavelength-dependent, first-order diffraction efficiency of the grating greater than a prescribed level over the operational wavelength range for both s- and p-polarized optical signals incident on the diffractive elements from within the substrate at an incidence angle θin that exceeds a critical angle θc=sin−1(nmed/nsub). 2. The diffraction grating of claim 1 wherein the operational wavelength range is from about 1500 nm to about 1600 nm. 3. The diffraction grating of claim 1 wherein the operational wavelength range is from about 1525 nm to about 1565 nm. 4. The diffraction grating of claim 1 wherein the operational wavelength range is from about 1250 nm to about 1350 nm. 5. The diffraction grating of claim 1 wherein the operational wavelength range is from about 850 nm to about 950 nm. 6. The diffraction grating of claim 1 wherein the prescribed level of diffraction efficiency is about 80%. 7. The diffraction grating of claim 1 wherein the prescribed level of diffraction efficiency is about 90%. 8. The diffraction grating of claim 1 wherein a maximum of the p-polarized diffraction efficiency substantially coincides with a maximum of the s-polarized diffraction efficiency, so that polarization dependent loss PDL is less than a prescribed level over the operational wavelength range for an optical signal incident on the diffractive elements from within the substrate at an incidence angle θin that exceeds a critical angle θc=sin−1(nmed/nsub). 9. The diffraction grating of claim 8 wherein the prescribed level of polarization dependent loss is about 0.5 dB. 10. The diffraction grating of claim 1 wherein the substrate comprises a prism having second surface that is not parallel to the first surface, wherein the first and second surfaces are arranged so that an optical signal transmitted through the first surface is incident on the diffractive elements from within the substrate at an incidence angle θin that exceeds the critical angle θc. 11. The diffraction grating of claim 1 wherein:
(i) the substrate is arranged so as to receive an optical signal in the operational wavelength range that is incident on the diffractive elements from within the substrate at an incidence angle θin that exceeds the critical angle θc; and
(ii) nsub, nmed, Λ, and θin result in near-Littrow diffraction of the optical signal. 12. The diffraction grating of claim 1 wherein the substrate material comprises optical glass, doped or undoped silica, silicon nitride, silicon oxynitride, silicon, one or more semiconductors, one or more semiconductor oxides, or one or more metal oxides. 13. The diffraction grating of claim 1 wherein the optical medium comprises vacuum, air, a gaseous medium, or a liquid medium. 14. The diffraction grating of claim 1 wherein the ridge material comprises silicon nitride, silicon oxynitride, silicon, one or more semiconductors, one or more semiconductor oxides, or one or more metal oxides. 15. The diffraction grating of claim 1 wherein the layer comprises silicon nitride, silicon oxynitride, silicon, one or more semiconductors, one or more semiconductor oxides, or one or more metal oxides. 16. The diffraction grating of claim 1 wherein nL≠nR. 17. The diffraction grating of claim 1 wherein nL=nR. 18. The diffraction grating of claim 17 wherein the layer and the ridges comprise the same material. 19. A method for forming the diffraction grating of claim 18, the method comprising etching to an etch depth substantially equal to the ridge height h a substantially uniform layer of the ridge material, on the first surface of the substrate, of thickness substantially equal to a sum of the ridge height h and the layer thickness t. 20. A method for forming the diffraction grating of claim 1, the method comprising etching to an etch depth substantially equal to the ridge height h a substantially uniform layer of the ridge material, on the dielectric or semiconductor layer on the first surface of the substrate, of thickness substantially equal to the ridge height h. 21. The method of claim 20 wherein the dielectric or semiconductor layer on the first surface of the substrate comprises a material that exhibits an etch rate substantially smaller than an etch rate exhibited by the ridge material. | A diffraction grating comprises a substrate (with index n sub ) with a surface facing an optical medium (with index n med <n sub ), a dielectric or semiconductor layer of thickness t on the substrate surface (with index n L ≠n sub ), and a set of diffractive elements on the layer (with index n R ≠n med ). The diffractive elements comprise a set of ridges protruding into the optical medium, which fills trenches between the ridges, and are characterized by a spacing Λ, a width d, and a height h. Over an operational wavelength range, λ/2n sub <Λ<λ/(n sub +n med ). An optical signal incident on the diffractive elements from within the substrate at an incidence angle exceeding the critical angle, n sub , n med , n L , n R , Λ, d, h, and t result in wavelength-dependent, first-order diffraction efficiency of the grating greater than a prescribed level over the operational wavelength range for both s- and p-polarized optical signals.1. A diffraction grating comprising:
(a) a substrate comprising a dielectric or semiconductor substrate material substantially transparent over a range of operational wavelengths with a substrate refractive index nsub, and having a first surface facing an optical medium with a medium refractive index nmed that is less than nsub; (b) a dielectric or semiconductor layer formed on the first surface of the substrate, substantially transparent over the operational wavelength range, and characterized by a layer refractive index nL and a layer thickness t, wherein nL differs from both nsub and nmed; (c) a set of diffractive elements formed on the layer on the first surface of the substrate, wherein (i) the diffractive elements comprise a set of protruding ridges of a dielectric or semiconductor ridge material, (ii) the ridge material is substantially transparent over the operational wavelength range and has a ridge refractive index nR that differs from nmed, (iii) the ridges are characterized by a ridge spacing Λ, a ridge width d, and a ridge height h, and (iv) the ridges are separated by intervening trenches substantially filled with the optical medium, wherein: (d) λ/2nsub<Λ<λ/(nsub+nmed) over the operational wavelength range; and (e) nsub, nmed, nL, nR, Λ, d, h, and t result in wavelength-dependent, first-order diffraction efficiency of the grating greater than a prescribed level over the operational wavelength range for both s- and p-polarized optical signals incident on the diffractive elements from within the substrate at an incidence angle θin that exceeds a critical angle θc=sin−1(nmed/nsub). 2. The diffraction grating of claim 1 wherein the operational wavelength range is from about 1500 nm to about 1600 nm. 3. The diffraction grating of claim 1 wherein the operational wavelength range is from about 1525 nm to about 1565 nm. 4. The diffraction grating of claim 1 wherein the operational wavelength range is from about 1250 nm to about 1350 nm. 5. The diffraction grating of claim 1 wherein the operational wavelength range is from about 850 nm to about 950 nm. 6. The diffraction grating of claim 1 wherein the prescribed level of diffraction efficiency is about 80%. 7. The diffraction grating of claim 1 wherein the prescribed level of diffraction efficiency is about 90%. 8. The diffraction grating of claim 1 wherein a maximum of the p-polarized diffraction efficiency substantially coincides with a maximum of the s-polarized diffraction efficiency, so that polarization dependent loss PDL is less than a prescribed level over the operational wavelength range for an optical signal incident on the diffractive elements from within the substrate at an incidence angle θin that exceeds a critical angle θc=sin−1(nmed/nsub). 9. The diffraction grating of claim 8 wherein the prescribed level of polarization dependent loss is about 0.5 dB. 10. The diffraction grating of claim 1 wherein the substrate comprises a prism having second surface that is not parallel to the first surface, wherein the first and second surfaces are arranged so that an optical signal transmitted through the first surface is incident on the diffractive elements from within the substrate at an incidence angle θin that exceeds the critical angle θc. 11. The diffraction grating of claim 1 wherein:
(i) the substrate is arranged so as to receive an optical signal in the operational wavelength range that is incident on the diffractive elements from within the substrate at an incidence angle θin that exceeds the critical angle θc; and
(ii) nsub, nmed, Λ, and θin result in near-Littrow diffraction of the optical signal. 12. The diffraction grating of claim 1 wherein the substrate material comprises optical glass, doped or undoped silica, silicon nitride, silicon oxynitride, silicon, one or more semiconductors, one or more semiconductor oxides, or one or more metal oxides. 13. The diffraction grating of claim 1 wherein the optical medium comprises vacuum, air, a gaseous medium, or a liquid medium. 14. The diffraction grating of claim 1 wherein the ridge material comprises silicon nitride, silicon oxynitride, silicon, one or more semiconductors, one or more semiconductor oxides, or one or more metal oxides. 15. The diffraction grating of claim 1 wherein the layer comprises silicon nitride, silicon oxynitride, silicon, one or more semiconductors, one or more semiconductor oxides, or one or more metal oxides. 16. The diffraction grating of claim 1 wherein nL≠nR. 17. The diffraction grating of claim 1 wherein nL=nR. 18. The diffraction grating of claim 17 wherein the layer and the ridges comprise the same material. 19. A method for forming the diffraction grating of claim 18, the method comprising etching to an etch depth substantially equal to the ridge height h a substantially uniform layer of the ridge material, on the first surface of the substrate, of thickness substantially equal to a sum of the ridge height h and the layer thickness t. 20. A method for forming the diffraction grating of claim 1, the method comprising etching to an etch depth substantially equal to the ridge height h a substantially uniform layer of the ridge material, on the dielectric or semiconductor layer on the first surface of the substrate, of thickness substantially equal to the ridge height h. 21. The method of claim 20 wherein the dielectric or semiconductor layer on the first surface of the substrate comprises a material that exhibits an etch rate substantially smaller than an etch rate exhibited by the ridge material. | 2,800 |
11,221 | 11,221 | 13,388,061 | 2,896 | When constructing compensators for radiation therapy using ion or proton radiation beams, a computer-aided compensator editing method includes overlaying an initial 3D compensator model on an anatomical image of a target mass (e.g., a tumor) in a patient, along with radiation dose distribution information. A user manipulates pixels or voxels in the compensator model on a display, and a processor automatically adjusts the dose distribution according to the user edits. The user iteratively adjusts the compensator model until the dose distribution is optimized, at which time the optimized compensator model is stored to memory and/or output to a machining device that constructs a compensator from | 1. A system that facilitates optimizing a computer-generated 3D compensator model for use in radiotherapy treatment planning, including:
a graphical user interface including a display and a user input device; a processor that executes computer-executable instructions stored in a memory, the instructions including:
displaying on the display, to a user, a compensator model;
receiving user input from the user input device comprising edits to the compensator model;
optimizing the compensator model based on the user input; and
storing the optimized compensator model to the memory or computer-readable storage medium. 2. The system according to claim 1, the instructions further including:
displaying a plurality of editing tools to a user; re-computing the radiation dose distribution based on the optimized compensator model; and displaying the re-computed radiation dose distribution on the display; wherein the compensator model is projected onto an anatomical patient image with radiation dose distribution overlaid on the patient image; wherein the optimized compensator model is stored to the memory or computer-readable storage medium upon user approval of the optimized compensator model. 3. The system according to claim 1, the instructions further including:
stepping through and displaying a plurality of anatomical slices of the patient image; and in response to receiving the user input edits, editing pixels in the compensator model for each slice of the patient image. 4. The system according to claim 1, the instructions further including:
displaying to the user, on the display, a plurality of 2D cross-sectional planes of the compensator model showing thickness gradients of the compensator model during optimization. 5. The system according to claim 1, the instructions further including:
displaying, on the display, the optimized compensator model and an original compensator model to the user for comparison; permitting the user to accept or reject changes to the original compensator model; and in response to input from the user on the user input device, iteratively editing the compensator model. 6. The system according to claim 1, the instructions further including:
outputting an optimized compensator model to a machine that constructs a compensator according to the optimized compensator model. 7. The system according to claim 1, the instructions further including:
inputting ranked radiation dose distribution objectives with the user input device; optimizing the compensator model to meet the dose distribution objectives in the ranked order; and displaying the optimized compensator model and dose distribution to the user on the display. 8. The system according to claim 1, further including:
a compensator constructed using the optimized compensator model. 9. The system according to claim 1, further including:
a radiation beam generator that generates a radiation beam that is passed through the compensator when treating a patient for whom the compensator is constructed; wherein the radiation beam generator generates one of an ion beam and a proton beam. 10. A method of computer-aided compensator model optimization for compensators used in radiotherapy treatment, including:
displaying a compensator model on a patient image of an anatomical region of a patient; receiving user input edits to the compensator model; updating the compensator model based on the user input; and storing the updated compensator model to memory or computer-readable storage medium. 11. The method according to claim 10, further including:
computing a radiation dose distribution for ion or proton beam radiation passing through the compensator model into the anatomical region; displaying to a user the compensator model projected onto anatomical patient image with the radiation dose distribution overlaid on the patient image; re-computing the radiation dose distribution based on the updated compensator model; displaying the re-computed radiation dose distribution overlaid on the patient image; and storing the updated compensator model to memory or computer-readable storage medium upon user approval of the updated compensator model. 12. The method according to claim 10, further including:
stepping through and displaying a plurality of anatomical slices of the patient image; and receiving the user input comprising edits to pixels in each slice of the patient image. 13. The method according to claim 10, further including:
displaying to the user a plurality of 2D cross-sectional planes of the compensator model showing thickness gradients of the compensator model. 14. The method according to claim 10, further including:
displaying the updated compensator model and an original compensator model to the user for comparison; permitting the user to accept or reject changes to the original compensator model; and iteratively editing the compensator model until the compensator model is optimized. 15. The method according to claim 14, further including:
outputting an optimized compensator model to a machine that constructs a compensator according to the optimized compensator model. 16. The method according to claim 10, further including:
receiving user input comprising ranked radiation dose distribution objectives; optimizing the compensator model to meet the dose distribution objectives in the order in which they are ranked; and displaying the optimized compensator model and dose distribution to the user. 17. The method according to claim 10, further including:
identifying lateral and distal sections of a computerized model of the target mass and a junction between the lateral and distal sections; making a virtual cut in the model along the junction; iteratively adjusting contours of the lateral and distal sections in order to optimize dose distribution; and displaying dose distribution overlaid on a patient image that includes the target mass for user evaluation during dose distribution optimization. 18. A method of optimizing radiation dose distribution for an irregularly-shaped target mass in a patient while mitigating radiation dose to a nearby organ, including:
identifying lateral and distal sections of a computerized model of the target mass and a junction between the lateral and distal sections; making a virtual cut in the model along the junction; iteratively adjusting contours of the lateral and distal sections in order to optimize a radiation dose distribution; and displaying dose distribution overlaid on a patient image that includes the target mass for user evaluation during dose distribution optimization. 19. The method according to claim 18, further including:
adjusting radiation beam parameters according to the optimized dose distribution; and applying a proton or ion beam to the target mass in the patient according to the adjusted radiation beam parameters. 20. The method according to claim 18, further including:
overlaying a compensator model on a patient image of an anatomical region of a patient; computing the radiation dose distribution for ion or proton beam radiation passing through the compensator model into the anatomical region; displaying to a user the compensator model projected onto the patient image with the radiation dose distribution overlaid on the patient image; receiving user input edits to pixels in the compensator model; updating the compensator model based on the user input; storing the updated compensator model to memory upon user approval of the updated compensator model. | When constructing compensators for radiation therapy using ion or proton radiation beams, a computer-aided compensator editing method includes overlaying an initial 3D compensator model on an anatomical image of a target mass (e.g., a tumor) in a patient, along with radiation dose distribution information. A user manipulates pixels or voxels in the compensator model on a display, and a processor automatically adjusts the dose distribution according to the user edits. The user iteratively adjusts the compensator model until the dose distribution is optimized, at which time the optimized compensator model is stored to memory and/or output to a machining device that constructs a compensator from1. A system that facilitates optimizing a computer-generated 3D compensator model for use in radiotherapy treatment planning, including:
a graphical user interface including a display and a user input device; a processor that executes computer-executable instructions stored in a memory, the instructions including:
displaying on the display, to a user, a compensator model;
receiving user input from the user input device comprising edits to the compensator model;
optimizing the compensator model based on the user input; and
storing the optimized compensator model to the memory or computer-readable storage medium. 2. The system according to claim 1, the instructions further including:
displaying a plurality of editing tools to a user; re-computing the radiation dose distribution based on the optimized compensator model; and displaying the re-computed radiation dose distribution on the display; wherein the compensator model is projected onto an anatomical patient image with radiation dose distribution overlaid on the patient image; wherein the optimized compensator model is stored to the memory or computer-readable storage medium upon user approval of the optimized compensator model. 3. The system according to claim 1, the instructions further including:
stepping through and displaying a plurality of anatomical slices of the patient image; and in response to receiving the user input edits, editing pixels in the compensator model for each slice of the patient image. 4. The system according to claim 1, the instructions further including:
displaying to the user, on the display, a plurality of 2D cross-sectional planes of the compensator model showing thickness gradients of the compensator model during optimization. 5. The system according to claim 1, the instructions further including:
displaying, on the display, the optimized compensator model and an original compensator model to the user for comparison; permitting the user to accept or reject changes to the original compensator model; and in response to input from the user on the user input device, iteratively editing the compensator model. 6. The system according to claim 1, the instructions further including:
outputting an optimized compensator model to a machine that constructs a compensator according to the optimized compensator model. 7. The system according to claim 1, the instructions further including:
inputting ranked radiation dose distribution objectives with the user input device; optimizing the compensator model to meet the dose distribution objectives in the ranked order; and displaying the optimized compensator model and dose distribution to the user on the display. 8. The system according to claim 1, further including:
a compensator constructed using the optimized compensator model. 9. The system according to claim 1, further including:
a radiation beam generator that generates a radiation beam that is passed through the compensator when treating a patient for whom the compensator is constructed; wherein the radiation beam generator generates one of an ion beam and a proton beam. 10. A method of computer-aided compensator model optimization for compensators used in radiotherapy treatment, including:
displaying a compensator model on a patient image of an anatomical region of a patient; receiving user input edits to the compensator model; updating the compensator model based on the user input; and storing the updated compensator model to memory or computer-readable storage medium. 11. The method according to claim 10, further including:
computing a radiation dose distribution for ion or proton beam radiation passing through the compensator model into the anatomical region; displaying to a user the compensator model projected onto anatomical patient image with the radiation dose distribution overlaid on the patient image; re-computing the radiation dose distribution based on the updated compensator model; displaying the re-computed radiation dose distribution overlaid on the patient image; and storing the updated compensator model to memory or computer-readable storage medium upon user approval of the updated compensator model. 12. The method according to claim 10, further including:
stepping through and displaying a plurality of anatomical slices of the patient image; and receiving the user input comprising edits to pixels in each slice of the patient image. 13. The method according to claim 10, further including:
displaying to the user a plurality of 2D cross-sectional planes of the compensator model showing thickness gradients of the compensator model. 14. The method according to claim 10, further including:
displaying the updated compensator model and an original compensator model to the user for comparison; permitting the user to accept or reject changes to the original compensator model; and iteratively editing the compensator model until the compensator model is optimized. 15. The method according to claim 14, further including:
outputting an optimized compensator model to a machine that constructs a compensator according to the optimized compensator model. 16. The method according to claim 10, further including:
receiving user input comprising ranked radiation dose distribution objectives; optimizing the compensator model to meet the dose distribution objectives in the order in which they are ranked; and displaying the optimized compensator model and dose distribution to the user. 17. The method according to claim 10, further including:
identifying lateral and distal sections of a computerized model of the target mass and a junction between the lateral and distal sections; making a virtual cut in the model along the junction; iteratively adjusting contours of the lateral and distal sections in order to optimize dose distribution; and displaying dose distribution overlaid on a patient image that includes the target mass for user evaluation during dose distribution optimization. 18. A method of optimizing radiation dose distribution for an irregularly-shaped target mass in a patient while mitigating radiation dose to a nearby organ, including:
identifying lateral and distal sections of a computerized model of the target mass and a junction between the lateral and distal sections; making a virtual cut in the model along the junction; iteratively adjusting contours of the lateral and distal sections in order to optimize a radiation dose distribution; and displaying dose distribution overlaid on a patient image that includes the target mass for user evaluation during dose distribution optimization. 19. The method according to claim 18, further including:
adjusting radiation beam parameters according to the optimized dose distribution; and applying a proton or ion beam to the target mass in the patient according to the adjusted radiation beam parameters. 20. The method according to claim 18, further including:
overlaying a compensator model on a patient image of an anatomical region of a patient; computing the radiation dose distribution for ion or proton beam radiation passing through the compensator model into the anatomical region; displaying to a user the compensator model projected onto the patient image with the radiation dose distribution overlaid on the patient image; receiving user input edits to pixels in the compensator model; updating the compensator model based on the user input; storing the updated compensator model to memory upon user approval of the updated compensator model. | 2,800 |
11,222 | 11,222 | 13,347,883 | 2,864 | The present disclosure relates to borehole logging methods and apparatuses for estimating a parameter of interest of an earth formation using logging data acquired in a borehole penetrating the earth formation. The method may include estimating the at least one parameter of interest using a statistical analysis of logging data acquired by at least one sensor, wherein the statistical analysis is applied over interval plurality of intervals within the logging data. The logging data may include one or more of: gamma ray data and spontaneous potential data. The method may include acquiring logging data with the at least one sensor. The method may also include estimating a confidence level for the at least one estimated parameter. The apparatus may include at least one sensor configured to generate logging data information about an earth formation; and at least one processor configured perform at least some of the steps of the method. | 1. A method of estimating at least one parameter of interest of an earth formation, comprising:
estimating the at least one parameter of interest using a statistical analysis of logging data acquired by at least one sensor, wherein the statistical analysis is applied over a plurality of overlapping intervals within the logging data. 2. The method of claim 1, further comprising:
acquiring the logging data using the at least one sensor. 3. The method of claim 2, further comprising:
conveying the at least one sensor in a borehole penetrating the earth formation. 4. The method of claim 1, wherein the at least one parameter of interest includes at least one of: (i) a location of a shale layer and (ii) a shale index/volume. 5. The method of claim 4, wherein the location of the shale layer estimation includes using a count of intervals in the plurality of intervals and a count of shale classifications in the plurality of intervals. 6. The method of claim 4, wherein the shale percentage estimation includes using an estimated sand line and an estimated shale line. 7. The method of claim 1, wherein the at least one parameter of interest is estimated in real time. 8. The method of claim 1, further comprising:
estimating a confidence level for the at least one estimated parameter of interest. 9. The method of claim 1, wherein the logging data comprises data from at least one of: (i) a gamma ray log and (ii) a spontaneous potential log. 10. The method of claim 1, wherein each of the plurality of overlapping intervals has an identical length. 11. The method of claim 1, wherein each of the overlapping intervals has a region that does not overlap with at least one other of the overlapping intervals. 12. An apparatus for estimating at least one parameter of interest in an earth formation, comprising:
a carrier configured to be conveyed in the borehole; at least sensor disposed on the carrier and configured to acquire logging data; and at least one processor configured to:
estimate at least one parameter of interest using a statistical analysis of the logging data acquired by the at least one sensor, wherein the statistical analysis is applied over a plurality of intervals within the logging data. 13. The apparatus of claim 12, wherein the at least one parameter of interest includes at least one of: (i) a location of a shale layer and (ii) a shale index/volume. 14. The apparatus of claim 12, wherein the at least one processor is configured to estimate the at least one parameter of interest in real time. 15. The apparatus of claim 12, the at least one process being further configured to:
estimate a confidence level for the at least one estimated parameter of interest. 16. The apparatus of claim 12, wherein the logging data comprises data from at least one of: (i) a gamma ray log and (ii) a spontaneous potential log. 17. The apparatus of claim 12, wherein each of the plurality of overlapping intervals has an identical length. 18. The apparatus of claim 12, wherein each of the overlapping intervals has a region that does not overlap with at least one other of the overlapping intervals. 19. A non-transitory computer-readable medium product having stored thereon instructions that, when executed by at least one processor, cause the at least one processor to perform a method, the method comprising:
estimating the at least one parameter of interest using a statistical analysis of logging data acquired by at least one sensor, wherein the statistical analysis is applied over interval plurality of intervals within the logging data. 20. The non-transitory computer-readable medium product of claim 19 further comprising at least one of: (i) a ROM, (ii) an EPROM, (iii) an EEPROM, (iv) a flash memory, and (v) an optical disk. | The present disclosure relates to borehole logging methods and apparatuses for estimating a parameter of interest of an earth formation using logging data acquired in a borehole penetrating the earth formation. The method may include estimating the at least one parameter of interest using a statistical analysis of logging data acquired by at least one sensor, wherein the statistical analysis is applied over interval plurality of intervals within the logging data. The logging data may include one or more of: gamma ray data and spontaneous potential data. The method may include acquiring logging data with the at least one sensor. The method may also include estimating a confidence level for the at least one estimated parameter. The apparatus may include at least one sensor configured to generate logging data information about an earth formation; and at least one processor configured perform at least some of the steps of the method.1. A method of estimating at least one parameter of interest of an earth formation, comprising:
estimating the at least one parameter of interest using a statistical analysis of logging data acquired by at least one sensor, wherein the statistical analysis is applied over a plurality of overlapping intervals within the logging data. 2. The method of claim 1, further comprising:
acquiring the logging data using the at least one sensor. 3. The method of claim 2, further comprising:
conveying the at least one sensor in a borehole penetrating the earth formation. 4. The method of claim 1, wherein the at least one parameter of interest includes at least one of: (i) a location of a shale layer and (ii) a shale index/volume. 5. The method of claim 4, wherein the location of the shale layer estimation includes using a count of intervals in the plurality of intervals and a count of shale classifications in the plurality of intervals. 6. The method of claim 4, wherein the shale percentage estimation includes using an estimated sand line and an estimated shale line. 7. The method of claim 1, wherein the at least one parameter of interest is estimated in real time. 8. The method of claim 1, further comprising:
estimating a confidence level for the at least one estimated parameter of interest. 9. The method of claim 1, wherein the logging data comprises data from at least one of: (i) a gamma ray log and (ii) a spontaneous potential log. 10. The method of claim 1, wherein each of the plurality of overlapping intervals has an identical length. 11. The method of claim 1, wherein each of the overlapping intervals has a region that does not overlap with at least one other of the overlapping intervals. 12. An apparatus for estimating at least one parameter of interest in an earth formation, comprising:
a carrier configured to be conveyed in the borehole; at least sensor disposed on the carrier and configured to acquire logging data; and at least one processor configured to:
estimate at least one parameter of interest using a statistical analysis of the logging data acquired by the at least one sensor, wherein the statistical analysis is applied over a plurality of intervals within the logging data. 13. The apparatus of claim 12, wherein the at least one parameter of interest includes at least one of: (i) a location of a shale layer and (ii) a shale index/volume. 14. The apparatus of claim 12, wherein the at least one processor is configured to estimate the at least one parameter of interest in real time. 15. The apparatus of claim 12, the at least one process being further configured to:
estimate a confidence level for the at least one estimated parameter of interest. 16. The apparatus of claim 12, wherein the logging data comprises data from at least one of: (i) a gamma ray log and (ii) a spontaneous potential log. 17. The apparatus of claim 12, wherein each of the plurality of overlapping intervals has an identical length. 18. The apparatus of claim 12, wherein each of the overlapping intervals has a region that does not overlap with at least one other of the overlapping intervals. 19. A non-transitory computer-readable medium product having stored thereon instructions that, when executed by at least one processor, cause the at least one processor to perform a method, the method comprising:
estimating the at least one parameter of interest using a statistical analysis of logging data acquired by at least one sensor, wherein the statistical analysis is applied over interval plurality of intervals within the logging data. 20. The non-transitory computer-readable medium product of claim 19 further comprising at least one of: (i) a ROM, (ii) an EPROM, (iii) an EEPROM, (iv) a flash memory, and (v) an optical disk. | 2,800 |
11,223 | 11,223 | 14,425,019 | 2,881 | An UV reactor system that allows single or multiple flange-less reactors to be installed between the flanges of existing piping systems. Benefits include reduced installation space and lamp placement flexibility to improve UV treatment. Each reactor can be rotated, pre and post installation, to provide multiple positions for the radiation sources that are included in each reactor. | 1. A reactor comprising:
a plurality of mounting holes adapted to be align-able with the mounting holes of a piping flange; a substantially tubular irradiation cavity having a longitudinal axis that is parallel to the plurality of mounting holes; and a radiation source being removably disposed within the irradiation cavity; whereby the reactor can be removably secured between the flanges of an existing piping system. 2. The reactor of claim 1 further comprising:
the radiation source being elongated;
the longitudinal axis of the radiation source being perpendicular to the longitudinal axis of the irradiation cavity. 3. First and second reactors, each comprising:
a plurality of mounting holes adapted to be align-able with the mounting holes of a piping flange; a substantially tubular irradiation cavity having a longitudinal axis that is parallel to the plurality of mounting holes; a radiation source being removably disposed within the irradiation cavity; whereby the first and second reactors can be removably secured to each other, between the flanges of an existing piping system, wherein the irradiation cavities of the first and second reactors have a substantially common longitudinal axis; further whereby the first and second reactors can be selectively arranged, relative to each other, in a plurality of positions around the substantially common longitudinal axis. 4. The reactors of claim 3 further comprising:
the radiation source being elongated;
the longitudinal axis of the radiation source being perpendicular to the longitudinal axis of the irradiation cavity. | An UV reactor system that allows single or multiple flange-less reactors to be installed between the flanges of existing piping systems. Benefits include reduced installation space and lamp placement flexibility to improve UV treatment. Each reactor can be rotated, pre and post installation, to provide multiple positions for the radiation sources that are included in each reactor.1. A reactor comprising:
a plurality of mounting holes adapted to be align-able with the mounting holes of a piping flange; a substantially tubular irradiation cavity having a longitudinal axis that is parallel to the plurality of mounting holes; and a radiation source being removably disposed within the irradiation cavity; whereby the reactor can be removably secured between the flanges of an existing piping system. 2. The reactor of claim 1 further comprising:
the radiation source being elongated;
the longitudinal axis of the radiation source being perpendicular to the longitudinal axis of the irradiation cavity. 3. First and second reactors, each comprising:
a plurality of mounting holes adapted to be align-able with the mounting holes of a piping flange; a substantially tubular irradiation cavity having a longitudinal axis that is parallel to the plurality of mounting holes; a radiation source being removably disposed within the irradiation cavity; whereby the first and second reactors can be removably secured to each other, between the flanges of an existing piping system, wherein the irradiation cavities of the first and second reactors have a substantially common longitudinal axis; further whereby the first and second reactors can be selectively arranged, relative to each other, in a plurality of positions around the substantially common longitudinal axis. 4. The reactors of claim 3 further comprising:
the radiation source being elongated;
the longitudinal axis of the radiation source being perpendicular to the longitudinal axis of the irradiation cavity. | 2,800 |
11,224 | 11,224 | 15,344,735 | 2,818 | A transistor device having reduced electrical field at the gate oxide interface is disclosed. In one embodiment, the transistor device comprises a gate, a source, and a drain, wherein the gate is at least partially in contact with a gate oxide. The transistor device has a P+ region within a JFET region of the transistor device in order to reduce an electrical field on the gate oxide. | 1. A transistor device comprising a gate, a source, and a drain, wherein the gate is at least partially in contact with a gate oxide, where at least one doped region resides within a junction field effect (JFET) region and is completely below a top surface of the JFET region and within the JFET region in order to reduce an electrical field on the gate oxide. 2. A transistor device according to claim 1, wherein a body of the transistor device comprises silicon carbide. 3. A transistor device according to claim 1, wherein the at least one doped region is substantially in the middle of the JFET region. 4. A transistor device according to claim 1, wherein the at least one doped region is connected to the source, which effectively shields the electrical field from a side of the transistor device having the drain. 5. A transistor device according to claim 1, wherein the at least one doped region is between about approximately 0.1 microns and about approximately 0.3 microns in depth. 6. A transistor device according to claim 1, wherein the at least one doped region is between about approximately 0.5 microns and about approximately 1.0 microns in width. 7. A transistor device according to claim 1, wherein a width of the JFET region is between about approximately 2.0 and about approximately 3.6 microns. 8. A transistor device according to claim 1, wherein the at least one doped region is a P region. 9. A transistor device having a gate that is at least partially in contact with a gate oxide, a source, and a drain, the transistor device comprising:
a well region of a first conductivity type; a region of a second conductivity type on the well region; a buried channel layer adjacent a first surface of the transistor device, the buried channel layer extending across a portion of the region of the second conductivity type and being at least partially covered by the gate oxide where the transistor device has a reduced electrical field on the gate oxide; a junction field effect (JFET) region adjacent the well region; a drift layer below the well region; a region of the first conductivity type at the JFET region and the region of the second conductivity type; and first and second regions of the first conductivity type introduced at the JFET region, wherein the well region is implanted to a first depth within the transistor device and at least one of the first and second regions is implanted at a second depth within the JFET region that is between half the first depth and the first depth of the well region. 10. A transistor device according to claim 9, wherein the first and second regions of the first conductivity type introduced at the JFET region reduces an electrical field at the gate oxide. 11. A transistor device according to claim 9, wherein the transistor device is an MOSFET. 12. A transistor device according to claim 9, wherein the transistor device is 13. A transistor device according to claim 9, wherein the transistor device is a metal-oxide-semiconductor controlled thyristor. 14. A transistor device according to claim 9, wherein the first conductivity type is P+, and the second conductivity type is N+. 15. A transistor device according to claim 9, wherein a body of the transistor device comprises silicon carbide. 16. A transistor device according to claim 9, wherein one of the first and second regions of the first conductivity type introduced at the JFET region is a P+ region and is introduced substantially in the middle of the JFET region. 17. A transistor device according to claim 9, wherein one of the first and second regions of the first conductivity type introduced at the JFET region is a P+ region and is connected to the source, which effectively shields the electrical field from a side of the transistor device having the drain. 18. A transistor device according to claim 9, wherein one of the first and second regions of the first conductivity type introduced within the JFET region is a P+ region and is shallower in depth than the well region. 19. A transistor device according to claim 9, wherein one of the first and second regions of the first conductivity type introduced within the JFET region is a P+ region and is between about approximately 0.1 microns and about approximately 0.3 microns in depth. 20. A transistor device according to claim 9, wherein one of the first and second regions of the first conductivity type introduced within the JFET region is a P+ region and is between about approximately 0.5 microns and about approximately 1.0 microns in width. 21. A transistor device according to claim 9, wherein a width of the JFET region is between about approximately 2.0 and about approximately 3.6 microns. | A transistor device having reduced electrical field at the gate oxide interface is disclosed. In one embodiment, the transistor device comprises a gate, a source, and a drain, wherein the gate is at least partially in contact with a gate oxide. The transistor device has a P+ region within a JFET region of the transistor device in order to reduce an electrical field on the gate oxide.1. A transistor device comprising a gate, a source, and a drain, wherein the gate is at least partially in contact with a gate oxide, where at least one doped region resides within a junction field effect (JFET) region and is completely below a top surface of the JFET region and within the JFET region in order to reduce an electrical field on the gate oxide. 2. A transistor device according to claim 1, wherein a body of the transistor device comprises silicon carbide. 3. A transistor device according to claim 1, wherein the at least one doped region is substantially in the middle of the JFET region. 4. A transistor device according to claim 1, wherein the at least one doped region is connected to the source, which effectively shields the electrical field from a side of the transistor device having the drain. 5. A transistor device according to claim 1, wherein the at least one doped region is between about approximately 0.1 microns and about approximately 0.3 microns in depth. 6. A transistor device according to claim 1, wherein the at least one doped region is between about approximately 0.5 microns and about approximately 1.0 microns in width. 7. A transistor device according to claim 1, wherein a width of the JFET region is between about approximately 2.0 and about approximately 3.6 microns. 8. A transistor device according to claim 1, wherein the at least one doped region is a P region. 9. A transistor device having a gate that is at least partially in contact with a gate oxide, a source, and a drain, the transistor device comprising:
a well region of a first conductivity type; a region of a second conductivity type on the well region; a buried channel layer adjacent a first surface of the transistor device, the buried channel layer extending across a portion of the region of the second conductivity type and being at least partially covered by the gate oxide where the transistor device has a reduced electrical field on the gate oxide; a junction field effect (JFET) region adjacent the well region; a drift layer below the well region; a region of the first conductivity type at the JFET region and the region of the second conductivity type; and first and second regions of the first conductivity type introduced at the JFET region, wherein the well region is implanted to a first depth within the transistor device and at least one of the first and second regions is implanted at a second depth within the JFET region that is between half the first depth and the first depth of the well region. 10. A transistor device according to claim 9, wherein the first and second regions of the first conductivity type introduced at the JFET region reduces an electrical field at the gate oxide. 11. A transistor device according to claim 9, wherein the transistor device is an MOSFET. 12. A transistor device according to claim 9, wherein the transistor device is 13. A transistor device according to claim 9, wherein the transistor device is a metal-oxide-semiconductor controlled thyristor. 14. A transistor device according to claim 9, wherein the first conductivity type is P+, and the second conductivity type is N+. 15. A transistor device according to claim 9, wherein a body of the transistor device comprises silicon carbide. 16. A transistor device according to claim 9, wherein one of the first and second regions of the first conductivity type introduced at the JFET region is a P+ region and is introduced substantially in the middle of the JFET region. 17. A transistor device according to claim 9, wherein one of the first and second regions of the first conductivity type introduced at the JFET region is a P+ region and is connected to the source, which effectively shields the electrical field from a side of the transistor device having the drain. 18. A transistor device according to claim 9, wherein one of the first and second regions of the first conductivity type introduced within the JFET region is a P+ region and is shallower in depth than the well region. 19. A transistor device according to claim 9, wherein one of the first and second regions of the first conductivity type introduced within the JFET region is a P+ region and is between about approximately 0.1 microns and about approximately 0.3 microns in depth. 20. A transistor device according to claim 9, wherein one of the first and second regions of the first conductivity type introduced within the JFET region is a P+ region and is between about approximately 0.5 microns and about approximately 1.0 microns in width. 21. A transistor device according to claim 9, wherein a width of the JFET region is between about approximately 2.0 and about approximately 3.6 microns. | 2,800 |
11,225 | 11,225 | 13,790,443 | 2,872 | An imaging optical system, in particular a projection objective, for microlithography, includes optical elements to guide electromagnetic radiation with a wavelength in a path to image an object field into an image plane. The imaging optical system includes a pupil, having coordinates (p, q), which, together with the image field, having coordinates (x, y) of the optical system, spans an extended 4-dimensional pupil space, having coordinates (x, y, p, q), as a function of which a wavefront W(x, y, p, q) of the radiation passing through the optical system is defined. The wavefront W can therefore be defined in the pupil plane as a function of an extended 4-dimensional pupil space spanned by the image field (x, y) and the pupil (p, q) as W(x, y, p, q)=W(t), with t=(x, y, p, q). | 1. An imaging optical system, comprising:
optical elements configured to guide electromagnetic radiation with a wavelength λ in an imaging beam path to image an object field into an image field, the optical elements comprising a first optical element, wherein:
the imaging optical system has a pupil with first and second coordinates;
the image field has first and second coordinates;
the image field and the pupil span an extended 4-dimensional pupil space having the first and second coordinates of the pupil and the first and second coordinates of the image plane;
during use of the optical imaging system, a wavefront of the electromagnetic radiation passing through the imaging optical system is defined as a function of the extended 4-dimensional pupil space;
the first optical element has a non-rotationally symmetrical surface with a two-dimensional surface deviation relative to every rotationally symmetrical surface;
the two-dimensional surface deviation has a difference between its greatest elevation and its deepest valley of at least λ;
for each point of the object field, a sub-aperture ratio of the non-rotationally symmetrical surface deviates by at least 0.01 from a sub-aperture ratio of every other surface of the optical elements at the point of the object field;
the non-rotationally symmetric surface of the first optical element is configured so that, by displacing the first optical element relative to the other optical elements, a change to the wavefront occurs;
the change to wavefront has a portion with at least 2-fold symmetry;
a maximum value of the wavefront change in the extended 4-dimensional pupil space is at least 1×10−5 of the wavelength λ; and
the imaging optical system is a microlithography imaging optical system. 2. The imaging optical system of claim 1, wherein a minimum distance between the first optical element and its adjacent optical elements is five centimeters. 3. The imaging optical system of claim 1, wherein the sub-aperture ratio for each of the optical elements deviates by at least 0.01 from the respective sub-aperture ratio of the other optical elements. 4. The imaging optical system of claim 1, wherein the optical elements are configured such that every combination of two of the optical elements has the optical effect of a non-rotationally symmetrical optical element. 5. The imaging optical system to of claim 1, wherein all of the non-rotationally symmetrical surfaces of the optical system are disposed in planes which are not conjugate to one another. 6. The imaging optical system to of claim 1, wherein the optical elements comprise mirrors. 7. The imaging optical system of claim 1, wherein the electromagnetic radiation is EUV radiation. 8. The imaging optical system of claim 1, wherein at least three of the optical elements have a non-rotationally symmetrical surface. 9. The imaging optical system of claim 1, wherein displacing the first optical element comprises rotating the first optical element. 10. The imaging optical system of claim 1, wherein displacing the first optical element comprises rotating and/or tilting the first optical element relative to a reference axis disposed perpendicular to the image plane. 11. The imaging optical system of claim 1, wherein the imaging optical system is configured so that rotating the first optical element changes an astigmatism of the imaging optical system. 12. The imaging optical system of claim 1, wherein displacing the first optical comprises rotating the first optical element relative to an axis of rotation which runs through a center point of a sphere best-adapted to the non-rotationally symmetrical surface. 13. The imaging optical system of claim 1, wherein displacing the first optical element comprises shifting the first optical element. 14. The imaging optical system of claim 1, wherein a non-rotationally symmetrical portion of the non-rotationally symmetric surface of the first optical element has an n-fold symmetry, and the value of n is at least two. 15. The imaging optical system of claim 1, wherein a non-rotationally symmetrical portion of the non-rotationally symmetric surface of the first optical element has an astigmatic form. 16. The imaging optical system of claim 1, wherein the non-rotationally symmetric surface of the first optical element has a rotationally symmetrical portion, and the amplitude of the rotationally symmetrical portion is small in comparison to the amplitude of the non-rotationally symmetrical portion. 17. The imaging optical system of claim 1, wherein the imaging optical system comprises four to eight optical elements with a non-rotationally symmetrical surface. 18. An imaging optical system, comprising:
optical elements configured to guide electromagnetic radiation with a wavelength λ in an imaging beam path to image an object field into an image field, the optical elements comprising a first optical element, wherein:
the imaging optical system has a pupil with first and second coordinates;
the image field has first and second coordinates;
the image field and the pupil span an extended 4-dimensional pupil space having the first and second coordinates of the pupil and the first and second coordinates of the image plane;
during use of the optical imaging system, a wavefront of the electromagnetic radiation passing through the imaging optical system is defined as a function of the extended 4-dimensional pupil space;
the first optical element has a non-rotationally symmetrical surface with a two-dimensional surface deviation relative to every rotationally symmetrical surface;
the two-dimensional surface deviation has a difference between its greatest elevation and its deepest valley of at least λ;
for each point of the object field, a sub-aperture ratio of the non-rotationally symmetrical surface deviates by at least 0.01 from a sub-aperture ratio of every other surface of the optical elements at the point of the object field;
the non-rotationally symmetric surface of the first optical element is configured so that, by displacing the first optical element relative to the other optical elements, a change to the wavefront occurs;
the change to wavefront cannot occur by displacing an optical element of the imaging optical system which has a symmetrical surface;
a maximum value of the wavefront change in the extended 4-dimensional pupil space is at least 1×10−5 of the wavelength λ; and
the imaging optical system is a microlithography imaging optical system. 19. An imaging optical system, comprising:
optical elements configured to guide electromagnetic radiation with a wavelength λ in an imaging beam path to image an object field from an object plane into an image plane, wherein:
at least two of the optical elements have a non mirror-symmetrical surface which deviates at at least one point from each mirror-symmetrical surface by at least λ/10;
at each point of the object field, sub-aperture ratios of the non-mirror-symmetrical surfaces deviate from each other by at least 0.01; and
the imaging optical system is a microlithography imaging optical system. 20. An optical element comprising a non-mirror symmetrical surface configured to change a wavefront of incoming radiation with a wavelength λ, the non-mirror symmetrical surface deviating by at least 10λ from each mirror symmetrical surface at at least one point, the optical element being configured to be used in a microlithography imaging optical system. 21. A mirror element comprising a non-rotationally symmetrical surface configured to change a wavefront of incoming radiation with a wavelength λ in the EUV wavelength range, the non-rotationally symmetrical surface having a deviation of at least 500λ in relation to each rotationally symmetrical surface at at least one point, the optical element being configured to be used in a microlithography imaging optical system. 22. A method, comprising:
using an algorithm to determine surface shapes of optical elements of a microlithography optical imaging system so that a wavefront error of the entire optical imaging system is at most a pre-specified value; and using the algorithm to modify at least one of the surface shapes by additive overlaying with a manipulation form configured so that, when displacing the optical element having the modified surface shape, the wavefront error of the optical system changes. 23. The method of claim 22, further comprising using a further algorithm to change the non-modified surface shapes to at least partially compensate for a change to the wavefront error of the optical system brought about by the modification of the at least one optical surface shape in the non-displaced state. 24. The method of claim 23, further comprising determining a manipulator quality and a compensation quality with respect to the manipulation form used,
wherein:
the manipulator quality specifies to what extent the characteristic of the wavefront error can be changed in the desired way by displacing the optical element comprising the manipulation form; and
the compensation quality specifies to what extent the change to the wavefront error, which is produced by modifying the at least one optical surface shape with the manipulation form in the non-displaced state, is compensated by the change to the surface shapes of the optical elements not modified by a manipulation form; and
the method further comprises, based on the manipulator quality determined and of the compensation quality, deciding whether to use the manipulation form used in the design. 25. The method of claim 22, wherein the imaging optical system is configured to operate with a wavelength λ, the manipulation form defines a non-rotationally symmetrical surface which has a respective two-dimensional surface deviation in relation to every rotationally symmetrical surface, and the two-dimensional surface deviation has a difference between its greatest elevation and its deepest valley of at least λ. 26. The method of claim 22, wherein:
the manipulation form is configured so that, when displacing the optical element having the modified surface shape, the characteristic of the wavefront error of the optical system changes so that the change to the wavefront error is brought about which has a portion with at least 2-fold symmetry; and a maximum value of the wavefront change in an extended 4-dimensional pupil space is at least 1×10−5 of the wavelength λ. 27. The method of claim 22, wherein the manipulation form is configured so that, when displacing the optical element having the modified surface shape, the wavefront error of the optical system changes so that the wavefront error is specifically corrected by a Zernike image error. 28. The method of claim 22, wherein determining the manipulation form comprises:
pre-specifying a number of base forms; simulatedly modifying the surface shaped provided for the manipulation form by additively overlaying with a base form; calculating an effect of at least one displacement of the optical element having the modified surface shape upon the wavefront error for each of the base forms; and using a further algorithm to select a set of base forms based on a desired manipulation effect and generation of the manipulation form by combining the selected base forms. 29. A method, comprising:
using a merit function of an algorithm to determine surface shapes of optical elements of a microlithography optical imaging system, the merit function comprising as evaluation parameters a wavefront error of the entire optical imaging system and at least one manipulation sensitivity defined by an effect of a displacement of one of the optical elements un an aberration of the optical imaging system defined by a pre-specified characteristic of the wavefront error. | An imaging optical system, in particular a projection objective, for microlithography, includes optical elements to guide electromagnetic radiation with a wavelength in a path to image an object field into an image plane. The imaging optical system includes a pupil, having coordinates (p, q), which, together with the image field, having coordinates (x, y) of the optical system, spans an extended 4-dimensional pupil space, having coordinates (x, y, p, q), as a function of which a wavefront W(x, y, p, q) of the radiation passing through the optical system is defined. The wavefront W can therefore be defined in the pupil plane as a function of an extended 4-dimensional pupil space spanned by the image field (x, y) and the pupil (p, q) as W(x, y, p, q)=W(t), with t=(x, y, p, q).1. An imaging optical system, comprising:
optical elements configured to guide electromagnetic radiation with a wavelength λ in an imaging beam path to image an object field into an image field, the optical elements comprising a first optical element, wherein:
the imaging optical system has a pupil with first and second coordinates;
the image field has first and second coordinates;
the image field and the pupil span an extended 4-dimensional pupil space having the first and second coordinates of the pupil and the first and second coordinates of the image plane;
during use of the optical imaging system, a wavefront of the electromagnetic radiation passing through the imaging optical system is defined as a function of the extended 4-dimensional pupil space;
the first optical element has a non-rotationally symmetrical surface with a two-dimensional surface deviation relative to every rotationally symmetrical surface;
the two-dimensional surface deviation has a difference between its greatest elevation and its deepest valley of at least λ;
for each point of the object field, a sub-aperture ratio of the non-rotationally symmetrical surface deviates by at least 0.01 from a sub-aperture ratio of every other surface of the optical elements at the point of the object field;
the non-rotationally symmetric surface of the first optical element is configured so that, by displacing the first optical element relative to the other optical elements, a change to the wavefront occurs;
the change to wavefront has a portion with at least 2-fold symmetry;
a maximum value of the wavefront change in the extended 4-dimensional pupil space is at least 1×10−5 of the wavelength λ; and
the imaging optical system is a microlithography imaging optical system. 2. The imaging optical system of claim 1, wherein a minimum distance between the first optical element and its adjacent optical elements is five centimeters. 3. The imaging optical system of claim 1, wherein the sub-aperture ratio for each of the optical elements deviates by at least 0.01 from the respective sub-aperture ratio of the other optical elements. 4. The imaging optical system of claim 1, wherein the optical elements are configured such that every combination of two of the optical elements has the optical effect of a non-rotationally symmetrical optical element. 5. The imaging optical system to of claim 1, wherein all of the non-rotationally symmetrical surfaces of the optical system are disposed in planes which are not conjugate to one another. 6. The imaging optical system to of claim 1, wherein the optical elements comprise mirrors. 7. The imaging optical system of claim 1, wherein the electromagnetic radiation is EUV radiation. 8. The imaging optical system of claim 1, wherein at least three of the optical elements have a non-rotationally symmetrical surface. 9. The imaging optical system of claim 1, wherein displacing the first optical element comprises rotating the first optical element. 10. The imaging optical system of claim 1, wherein displacing the first optical element comprises rotating and/or tilting the first optical element relative to a reference axis disposed perpendicular to the image plane. 11. The imaging optical system of claim 1, wherein the imaging optical system is configured so that rotating the first optical element changes an astigmatism of the imaging optical system. 12. The imaging optical system of claim 1, wherein displacing the first optical comprises rotating the first optical element relative to an axis of rotation which runs through a center point of a sphere best-adapted to the non-rotationally symmetrical surface. 13. The imaging optical system of claim 1, wherein displacing the first optical element comprises shifting the first optical element. 14. The imaging optical system of claim 1, wherein a non-rotationally symmetrical portion of the non-rotationally symmetric surface of the first optical element has an n-fold symmetry, and the value of n is at least two. 15. The imaging optical system of claim 1, wherein a non-rotationally symmetrical portion of the non-rotationally symmetric surface of the first optical element has an astigmatic form. 16. The imaging optical system of claim 1, wherein the non-rotationally symmetric surface of the first optical element has a rotationally symmetrical portion, and the amplitude of the rotationally symmetrical portion is small in comparison to the amplitude of the non-rotationally symmetrical portion. 17. The imaging optical system of claim 1, wherein the imaging optical system comprises four to eight optical elements with a non-rotationally symmetrical surface. 18. An imaging optical system, comprising:
optical elements configured to guide electromagnetic radiation with a wavelength λ in an imaging beam path to image an object field into an image field, the optical elements comprising a first optical element, wherein:
the imaging optical system has a pupil with first and second coordinates;
the image field has first and second coordinates;
the image field and the pupil span an extended 4-dimensional pupil space having the first and second coordinates of the pupil and the first and second coordinates of the image plane;
during use of the optical imaging system, a wavefront of the electromagnetic radiation passing through the imaging optical system is defined as a function of the extended 4-dimensional pupil space;
the first optical element has a non-rotationally symmetrical surface with a two-dimensional surface deviation relative to every rotationally symmetrical surface;
the two-dimensional surface deviation has a difference between its greatest elevation and its deepest valley of at least λ;
for each point of the object field, a sub-aperture ratio of the non-rotationally symmetrical surface deviates by at least 0.01 from a sub-aperture ratio of every other surface of the optical elements at the point of the object field;
the non-rotationally symmetric surface of the first optical element is configured so that, by displacing the first optical element relative to the other optical elements, a change to the wavefront occurs;
the change to wavefront cannot occur by displacing an optical element of the imaging optical system which has a symmetrical surface;
a maximum value of the wavefront change in the extended 4-dimensional pupil space is at least 1×10−5 of the wavelength λ; and
the imaging optical system is a microlithography imaging optical system. 19. An imaging optical system, comprising:
optical elements configured to guide electromagnetic radiation with a wavelength λ in an imaging beam path to image an object field from an object plane into an image plane, wherein:
at least two of the optical elements have a non mirror-symmetrical surface which deviates at at least one point from each mirror-symmetrical surface by at least λ/10;
at each point of the object field, sub-aperture ratios of the non-mirror-symmetrical surfaces deviate from each other by at least 0.01; and
the imaging optical system is a microlithography imaging optical system. 20. An optical element comprising a non-mirror symmetrical surface configured to change a wavefront of incoming radiation with a wavelength λ, the non-mirror symmetrical surface deviating by at least 10λ from each mirror symmetrical surface at at least one point, the optical element being configured to be used in a microlithography imaging optical system. 21. A mirror element comprising a non-rotationally symmetrical surface configured to change a wavefront of incoming radiation with a wavelength λ in the EUV wavelength range, the non-rotationally symmetrical surface having a deviation of at least 500λ in relation to each rotationally symmetrical surface at at least one point, the optical element being configured to be used in a microlithography imaging optical system. 22. A method, comprising:
using an algorithm to determine surface shapes of optical elements of a microlithography optical imaging system so that a wavefront error of the entire optical imaging system is at most a pre-specified value; and using the algorithm to modify at least one of the surface shapes by additive overlaying with a manipulation form configured so that, when displacing the optical element having the modified surface shape, the wavefront error of the optical system changes. 23. The method of claim 22, further comprising using a further algorithm to change the non-modified surface shapes to at least partially compensate for a change to the wavefront error of the optical system brought about by the modification of the at least one optical surface shape in the non-displaced state. 24. The method of claim 23, further comprising determining a manipulator quality and a compensation quality with respect to the manipulation form used,
wherein:
the manipulator quality specifies to what extent the characteristic of the wavefront error can be changed in the desired way by displacing the optical element comprising the manipulation form; and
the compensation quality specifies to what extent the change to the wavefront error, which is produced by modifying the at least one optical surface shape with the manipulation form in the non-displaced state, is compensated by the change to the surface shapes of the optical elements not modified by a manipulation form; and
the method further comprises, based on the manipulator quality determined and of the compensation quality, deciding whether to use the manipulation form used in the design. 25. The method of claim 22, wherein the imaging optical system is configured to operate with a wavelength λ, the manipulation form defines a non-rotationally symmetrical surface which has a respective two-dimensional surface deviation in relation to every rotationally symmetrical surface, and the two-dimensional surface deviation has a difference between its greatest elevation and its deepest valley of at least λ. 26. The method of claim 22, wherein:
the manipulation form is configured so that, when displacing the optical element having the modified surface shape, the characteristic of the wavefront error of the optical system changes so that the change to the wavefront error is brought about which has a portion with at least 2-fold symmetry; and a maximum value of the wavefront change in an extended 4-dimensional pupil space is at least 1×10−5 of the wavelength λ. 27. The method of claim 22, wherein the manipulation form is configured so that, when displacing the optical element having the modified surface shape, the wavefront error of the optical system changes so that the wavefront error is specifically corrected by a Zernike image error. 28. The method of claim 22, wherein determining the manipulation form comprises:
pre-specifying a number of base forms; simulatedly modifying the surface shaped provided for the manipulation form by additively overlaying with a base form; calculating an effect of at least one displacement of the optical element having the modified surface shape upon the wavefront error for each of the base forms; and using a further algorithm to select a set of base forms based on a desired manipulation effect and generation of the manipulation form by combining the selected base forms. 29. A method, comprising:
using a merit function of an algorithm to determine surface shapes of optical elements of a microlithography optical imaging system, the merit function comprising as evaluation parameters a wavefront error of the entire optical imaging system and at least one manipulation sensitivity defined by an effect of a displacement of one of the optical elements un an aberration of the optical imaging system defined by a pre-specified characteristic of the wavefront error. | 2,800 |
11,226 | 11,226 | 13,976,093 | 2,862 | Systems and methods of enabling a battery system to intelligently provide its current support capability include logic to determine current battery power status information. The current battery power status information may be compared with a set of programmed battery power status information to determine a match. There may be logic to indicate the current battery power status information based on the match. | 1-27. (canceled) 28. A computer-implemented method comprising:
receiving a support requirement related to a battery system; determining current battery power status information of the battery system; comparing the current battery power status information with programmed battery power status information to determine a match, wherein the programmed battery power status information is stored in a memory of the battery system; indicating the current battery power status information based on the match between the current battery power status information and the programmed battery power status information; and indicating whether the support requirement can be satisfied based on the indicated current battery power status information. 29. The method of claim 28, wherein indicating the current battery power status information comprises setting one or more bits of a register of an interface of the battery system. 30. The method of claim 28, wherein the current battery power status information is determined based on at least one of a voltage parameter, a current parameter and a resistance parameter. 31. The method of claim 28, wherein the programmed battery power status information is set by a manufacturer of the battery system and is modifiable. 32. The method of claim 28, wherein the current battery power status information is determined periodically or based on a request. 33. An apparatus comprising:
logic to determine current battery power status information of a battery system; logic to compare the current battery power status information with a set of programmed battery power status information to determine a match; and logic to indicate the current battery power status information based on the match. 34. The apparatus of claim 33, wherein the set of programmed battery power status information is to be stored in a memory of the battery system. 35. The apparatus of claim 33, wherein the logic to indicate the current battery power status information based on the match includes a logic to set one or more bits of a register of the battery system to reflect the match. 36. The apparatus of claim 35, wherein the logic to determine the current battery power status information is configured to perform periodically or based on a request. 37. The apparatus of claim 33, wherein the current battery power status information is to be determined based on at least one of a voltage parameter, a current parameter, and a resistance parameter. 38. The apparatus of claim 37, wherein the at least one of the voltage parameters, the current parameters, and the resistance parameters are programmable. 39. The apparatus of claim 33, wherein the set of programmed battery power status information includes one or more ranges. 40. A system comprising:
a processor; and a battery system coupled with the processor, wherein the battery system is configured to determine current battery power status information and to provide the current battery power status information based on a match with a member of a set of programmed battery power status information. 41. The system of claim 40, wherein the current battery power status information is to be determined periodically. 42. The system of claim 40, wherein the current battery power status information is to be determined based on a request. 43. The system of claim 40, wherein the battery system includes a memory and the set of programmed battery power status information is stored in the memory of the battery system. 44. The system of claim 40, wherein the battery system includes a register configured to enable the processor to access the current battery power status information based on the set of programmed battery power status information. 45. The system of claim 40, wherein the set of programmed battery power status information is to be determined by a manufacturer of the battery system. 46. The system of claim 45, wherein the set of programmed battery power status information is to be modifiable. 47. A computer-implemented method comprising:
determining current battery power status information of a battery system; and comparing the current battery power status information with programmed battery power status information to determine a match, wherein the programmed battery power status information is stored in a memory of the battery system. 48. The method of claim 47, further comprising receiving a support requirement related to the battery system. 49. The method of claim 48, further comprising indicating the current battery power status information based on the match between the current battery power status information and the programmed battery power status information. 50. The method of claim 49, wherein indicating the current battery power status information comprises setting one or more bits of a register of an interface of the battery system. 51. The method of claim 49, further comprising indicating whether the support requirement can be satisfied based on the indicated current battery power status information. 52. The method of claim 47, wherein the current battery power status information is determined based on at least one of a voltage parameter, a current parameter and a resistance parameter. 53. The method of claim 47, wherein the programmed battery power status information is set by a manufacturer of the battery system and is modifiable. 54. The method of claim 53, wherein the current battery power status information is determined periodically or based on a request. | Systems and methods of enabling a battery system to intelligently provide its current support capability include logic to determine current battery power status information. The current battery power status information may be compared with a set of programmed battery power status information to determine a match. There may be logic to indicate the current battery power status information based on the match.1-27. (canceled) 28. A computer-implemented method comprising:
receiving a support requirement related to a battery system; determining current battery power status information of the battery system; comparing the current battery power status information with programmed battery power status information to determine a match, wherein the programmed battery power status information is stored in a memory of the battery system; indicating the current battery power status information based on the match between the current battery power status information and the programmed battery power status information; and indicating whether the support requirement can be satisfied based on the indicated current battery power status information. 29. The method of claim 28, wherein indicating the current battery power status information comprises setting one or more bits of a register of an interface of the battery system. 30. The method of claim 28, wherein the current battery power status information is determined based on at least one of a voltage parameter, a current parameter and a resistance parameter. 31. The method of claim 28, wherein the programmed battery power status information is set by a manufacturer of the battery system and is modifiable. 32. The method of claim 28, wherein the current battery power status information is determined periodically or based on a request. 33. An apparatus comprising:
logic to determine current battery power status information of a battery system; logic to compare the current battery power status information with a set of programmed battery power status information to determine a match; and logic to indicate the current battery power status information based on the match. 34. The apparatus of claim 33, wherein the set of programmed battery power status information is to be stored in a memory of the battery system. 35. The apparatus of claim 33, wherein the logic to indicate the current battery power status information based on the match includes a logic to set one or more bits of a register of the battery system to reflect the match. 36. The apparatus of claim 35, wherein the logic to determine the current battery power status information is configured to perform periodically or based on a request. 37. The apparatus of claim 33, wherein the current battery power status information is to be determined based on at least one of a voltage parameter, a current parameter, and a resistance parameter. 38. The apparatus of claim 37, wherein the at least one of the voltage parameters, the current parameters, and the resistance parameters are programmable. 39. The apparatus of claim 33, wherein the set of programmed battery power status information includes one or more ranges. 40. A system comprising:
a processor; and a battery system coupled with the processor, wherein the battery system is configured to determine current battery power status information and to provide the current battery power status information based on a match with a member of a set of programmed battery power status information. 41. The system of claim 40, wherein the current battery power status information is to be determined periodically. 42. The system of claim 40, wherein the current battery power status information is to be determined based on a request. 43. The system of claim 40, wherein the battery system includes a memory and the set of programmed battery power status information is stored in the memory of the battery system. 44. The system of claim 40, wherein the battery system includes a register configured to enable the processor to access the current battery power status information based on the set of programmed battery power status information. 45. The system of claim 40, wherein the set of programmed battery power status information is to be determined by a manufacturer of the battery system. 46. The system of claim 45, wherein the set of programmed battery power status information is to be modifiable. 47. A computer-implemented method comprising:
determining current battery power status information of a battery system; and comparing the current battery power status information with programmed battery power status information to determine a match, wherein the programmed battery power status information is stored in a memory of the battery system. 48. The method of claim 47, further comprising receiving a support requirement related to the battery system. 49. The method of claim 48, further comprising indicating the current battery power status information based on the match between the current battery power status information and the programmed battery power status information. 50. The method of claim 49, wherein indicating the current battery power status information comprises setting one or more bits of a register of an interface of the battery system. 51. The method of claim 49, further comprising indicating whether the support requirement can be satisfied based on the indicated current battery power status information. 52. The method of claim 47, wherein the current battery power status information is determined based on at least one of a voltage parameter, a current parameter and a resistance parameter. 53. The method of claim 47, wherein the programmed battery power status information is set by a manufacturer of the battery system and is modifiable. 54. The method of claim 53, wherein the current battery power status information is determined periodically or based on a request. | 2,800 |
11,227 | 11,227 | 15,176,232 | 2,832 | A high voltage power generating system includes a first poly-phase permanent magnet generator including at least one control winding and a plurality of power windings, a second poly-phase permanent magnet generator including at least one control winding and a plurality of power windings, the first and second poly-phase permanent magnet generators being arranged in series in at least one operational mode, and the first poly-phase permanent magnet generator being phase shifted relative to the second poly-phase permanent magnet generator such that residual voltage output of the first poly-phase permanent magnet generator is offset by the second poly-phase permanent magnet generator during a first operational mode. | 1. A high voltage power generating system comprising:
a first poly-phase permanent magnet generator including at least one control winding and a plurality of power windings; a second poly-phase permanent magnet generator including at least one control winding and a plurality of power windings; the first and second poly-phase permanent magnet generators being arranged in series in at least one operational mode; and the first poly-phase permanent magnet generator being phase shifted relative to the second poly-phase permanent magnet generator such that residual voltage output of the first poly-phase permanent magnet generator is offset by the second poly-phase permanent magnet generator during a first operational mode. 2. The high voltage power generating system of claim 1, wherein the first operational mode is a short circuit condition at a power generating bus. 3. The high voltage power generating system of claim 1, wherein the first poly-phase permanent magnet generator is connected to an input of the second poly-phase permanent magnet generator via a first set of switches and connected to a first power generating bus via a second set of switches, the first set of switches and the second set of switches having an inverted state relative to each other. 4. The high voltage power generating system of claim 3, wherein an input of the second poly-phase permanent magnet generator is connected to a second power generating bus via a third set of switches, and an output of the second poly-phase permanent magnet generator is connected to the first power generating bus via a fourth set of switches, the third set of switches and the fourth set of switches having an inverted state relative to each other. 5. The high voltage power generating system of claim 4, wherein the state of each set of switches is controlled by a generator control unit, and wherein the first set of switches and the third set of switches are closed during said first operational mode. 6. The high voltage power generating system of claim 4, wherein the first power generating bus and the second power generating bus are AC busses. 7. The high voltage power generating system of claim 4, wherein the first power generating bus and the second power generating bus are DC busses. 8. The high voltage power generating system of claim 1, further comprising a selectively removable neutral node connected to an output of said second poly-phase permanent magnet generator via a DC rectifier. 9. The high voltage power generating system of claim 1, wherein each of said poly-phase permanent magnet generators has an identical number of phases. 10. The high voltage power generating system of claim 9, wherein each of said poly-phase permanent magnet generators has three phases. 11. A method for achieving null output voltage of a power generating system including multiple permanent magnet generators comprising:
reducing a control current of a first permanent magnet generator to zero; detecting a residual output of the first permanent magnet generator; and controlling a control current to a second permanent magnet generator, such that the second permanent magnet generator generates an offsetting voltage, thereby reducing the residual voltage to 0 volts. 12. The method of claim 11, wherein reducing the control current of the first permanent magnet generator to zero, detecting the residual output of the first permanent magnet generator, and controlling a control current to a second permanent magnet generator, such that the second permanent magnet generator generates an offsetting voltage, are performed in response to detecting a short circuit event at a power generating bus. 13. The method of claim 12, further comprising reconfiguring a power generating system such that the first permanent magnet generator and the second permanent magnet generator are arranged in series in response to detecting the short circuit event. 14. The method of claim 13, wherein reconfiguring the power generating system comprises inverting at least a first, second, third and fourth set of switches. 15. The method of claim 11, further comprising removing a selectively removable neutral node from said second permanent magnet generator. 16. The method of claim 15, wherein removing the selectively removable neutral node comprises opening a switch. | A high voltage power generating system includes a first poly-phase permanent magnet generator including at least one control winding and a plurality of power windings, a second poly-phase permanent magnet generator including at least one control winding and a plurality of power windings, the first and second poly-phase permanent magnet generators being arranged in series in at least one operational mode, and the first poly-phase permanent magnet generator being phase shifted relative to the second poly-phase permanent magnet generator such that residual voltage output of the first poly-phase permanent magnet generator is offset by the second poly-phase permanent magnet generator during a first operational mode.1. A high voltage power generating system comprising:
a first poly-phase permanent magnet generator including at least one control winding and a plurality of power windings; a second poly-phase permanent magnet generator including at least one control winding and a plurality of power windings; the first and second poly-phase permanent magnet generators being arranged in series in at least one operational mode; and the first poly-phase permanent magnet generator being phase shifted relative to the second poly-phase permanent magnet generator such that residual voltage output of the first poly-phase permanent magnet generator is offset by the second poly-phase permanent magnet generator during a first operational mode. 2. The high voltage power generating system of claim 1, wherein the first operational mode is a short circuit condition at a power generating bus. 3. The high voltage power generating system of claim 1, wherein the first poly-phase permanent magnet generator is connected to an input of the second poly-phase permanent magnet generator via a first set of switches and connected to a first power generating bus via a second set of switches, the first set of switches and the second set of switches having an inverted state relative to each other. 4. The high voltage power generating system of claim 3, wherein an input of the second poly-phase permanent magnet generator is connected to a second power generating bus via a third set of switches, and an output of the second poly-phase permanent magnet generator is connected to the first power generating bus via a fourth set of switches, the third set of switches and the fourth set of switches having an inverted state relative to each other. 5. The high voltage power generating system of claim 4, wherein the state of each set of switches is controlled by a generator control unit, and wherein the first set of switches and the third set of switches are closed during said first operational mode. 6. The high voltage power generating system of claim 4, wherein the first power generating bus and the second power generating bus are AC busses. 7. The high voltage power generating system of claim 4, wherein the first power generating bus and the second power generating bus are DC busses. 8. The high voltage power generating system of claim 1, further comprising a selectively removable neutral node connected to an output of said second poly-phase permanent magnet generator via a DC rectifier. 9. The high voltage power generating system of claim 1, wherein each of said poly-phase permanent magnet generators has an identical number of phases. 10. The high voltage power generating system of claim 9, wherein each of said poly-phase permanent magnet generators has three phases. 11. A method for achieving null output voltage of a power generating system including multiple permanent magnet generators comprising:
reducing a control current of a first permanent magnet generator to zero; detecting a residual output of the first permanent magnet generator; and controlling a control current to a second permanent magnet generator, such that the second permanent magnet generator generates an offsetting voltage, thereby reducing the residual voltage to 0 volts. 12. The method of claim 11, wherein reducing the control current of the first permanent magnet generator to zero, detecting the residual output of the first permanent magnet generator, and controlling a control current to a second permanent magnet generator, such that the second permanent magnet generator generates an offsetting voltage, are performed in response to detecting a short circuit event at a power generating bus. 13. The method of claim 12, further comprising reconfiguring a power generating system such that the first permanent magnet generator and the second permanent magnet generator are arranged in series in response to detecting the short circuit event. 14. The method of claim 13, wherein reconfiguring the power generating system comprises inverting at least a first, second, third and fourth set of switches. 15. The method of claim 11, further comprising removing a selectively removable neutral node from said second permanent magnet generator. 16. The method of claim 15, wherein removing the selectively removable neutral node comprises opening a switch. | 2,800 |
11,228 | 11,228 | 14,800,719 | 2,845 | An antenna structure includes a central grounding line and a spiral antenna. The central grounding line is linear and has two end portions provided with a grounding point and a first open point, respectively. The spiral antenna has two end portions provided with a feeding point and a second open point, respectively. The spiral antenna winds around the central grounding line while extending in the direction from the grounding point to the first open point, with the second open point positioned proximate to the first open point, wherein the spiral antenna and the central grounding line are spaced apart by an axial distance, thereby allowing the antenna structure to receive and transmit a radio frequency signal with circular polarization. | 1. An antenna structure, comprising:
a central grounding line being linear and having two end portions provided with a grounding point and a first open point, respectively; and a spiral antenna having two end portions provided with a feeding point and a second open point, respectively, wherein the spiral antenna winds around the central grounding line while extending in a direction from the grounding point to the first open point, with the second open point positioned proximate to the first open point, wherein the spiral antenna and the central grounding line are spaced apart by an axial distance, thereby allowing the antenna structure to receive and transmit a radio frequency signal with circular polarization; wherein the grounding point connects with a system ground plane, wherein the antenna structure is adapted to receive a radio frequency signal from a radio frequency signal transmission unit via the feeding point of the spiral antenna only and enable the radio frequency signal to undergo resonance through a current path which begins at the feeding point and ends between the second open point and the first open point and thereby send the radio frequency signal with circular polarization. 2. The antenna structure of claim 1, wherein a total length of the central grounding line equals a quarter wavelength of the radio frequency signal with circular polarization. 3. The antenna structure of claim 1, wherein a total length of the spiral antenna equals a wavelength of the radio frequency signal with circular polarization. 4. The antenna structure of claim 1, wherein a distance between the grounding point and the first open point of the central grounding line substantially equals a distance between the feeding point and the second open point of the spiral antenna. 5. The antenna structure of claim 1, wherein a polarization direction of the radio frequency signal with circular polarization parallels to the central grounding line and extends from the grounding point to the first open point. 6. (canceled) 7. The antenna structure of claim 1, wherein the axial distance between the spiral antenna and the central grounding line is directly proportional to a Q-factor (Quality factor) of the radio frequency signal with circular polarization. | An antenna structure includes a central grounding line and a spiral antenna. The central grounding line is linear and has two end portions provided with a grounding point and a first open point, respectively. The spiral antenna has two end portions provided with a feeding point and a second open point, respectively. The spiral antenna winds around the central grounding line while extending in the direction from the grounding point to the first open point, with the second open point positioned proximate to the first open point, wherein the spiral antenna and the central grounding line are spaced apart by an axial distance, thereby allowing the antenna structure to receive and transmit a radio frequency signal with circular polarization.1. An antenna structure, comprising:
a central grounding line being linear and having two end portions provided with a grounding point and a first open point, respectively; and a spiral antenna having two end portions provided with a feeding point and a second open point, respectively, wherein the spiral antenna winds around the central grounding line while extending in a direction from the grounding point to the first open point, with the second open point positioned proximate to the first open point, wherein the spiral antenna and the central grounding line are spaced apart by an axial distance, thereby allowing the antenna structure to receive and transmit a radio frequency signal with circular polarization; wherein the grounding point connects with a system ground plane, wherein the antenna structure is adapted to receive a radio frequency signal from a radio frequency signal transmission unit via the feeding point of the spiral antenna only and enable the radio frequency signal to undergo resonance through a current path which begins at the feeding point and ends between the second open point and the first open point and thereby send the radio frequency signal with circular polarization. 2. The antenna structure of claim 1, wherein a total length of the central grounding line equals a quarter wavelength of the radio frequency signal with circular polarization. 3. The antenna structure of claim 1, wherein a total length of the spiral antenna equals a wavelength of the radio frequency signal with circular polarization. 4. The antenna structure of claim 1, wherein a distance between the grounding point and the first open point of the central grounding line substantially equals a distance between the feeding point and the second open point of the spiral antenna. 5. The antenna structure of claim 1, wherein a polarization direction of the radio frequency signal with circular polarization parallels to the central grounding line and extends from the grounding point to the first open point. 6. (canceled) 7. The antenna structure of claim 1, wherein the axial distance between the spiral antenna and the central grounding line is directly proportional to a Q-factor (Quality factor) of the radio frequency signal with circular polarization. | 2,800 |
11,229 | 11,229 | 14,616,829 | 2,832 | A rotary electric machine is installed such that a central axis of a rotating shaft is horizontal, and coolant suction apertures are formed at positions on a cylindrical portion of a frame that are vertically above first and second coil ends, and strip-shaped insulating papers are inserted such that a thickness direction is in a radial direction between radially adjacent conductor portions of portions of the conductor wire that constitute the first and second coil ends, and are disposed so as to extend circumferentially across positions that are vertically below the coolant suction apertures inside the first and second coil ends. | 1. A rotary electric machine comprising:
a housing; a rotor that is fixed to a rotating shaft that is rotatably supported by said housing so as to be disposed inside said housing; an armature including:
an annular armature core in which slots are arranged circumferentially so as to open radially inward; and
an armature winding that is constituted by a plurality of coils that are each produced by bending and shaping a conductor wire, and that are mounted to said armature core,
said armature being disposed so as to be coaxial to said rotor so as to surround said rotor, and being held by said housing,
said rotary electric machine being installed such that a central axis of said rotating shaft is horizontal, and a liquid coolant being blown onto a coil end of said armature winding from a coolant suction aperture that is formed on said housing to cool said armature winding, wherein: said coolant suction aperture is formed at a position on said housing that is vertically above said coil end; and a strip-shaped insulating paper is inserted such that a thickness direction is in a radial direction between radially adjacent conductor portions of a portion of said conductor wire that constitutes said coil end, and is disposed so as to extend circumferentially across a position that is vertically below said coolant suction aperture inside said coil end. 2. The rotary electric machine according to claim 1, wherein:
m layers of said insulating paper that is inserted between said radially adjacent conductor portions are disposed in a radial direction, where m is an integer that is greater than or equal to 1; and a penetrating aperture that allows said liquid coolant to pass through is formed on each of said m layers of insulating paper that are disposed in said radial direction. 3. The rotary electric machine according to claim 2, wherein said penetrating aperture is formed on said insulating paper so as to overlap when viewed from a radially outer side of said coil end with a gap that is formed between said conductor portions that are on opposite sides of said insulating paper. 4. The rotary electric machine according to claim 1, wherein:
m layers of said insulating paper that is inserted between said radially adjacent conductor portions are disposed in a radial direction, where m is an integer that is greater than or equal to 2; and a penetrating aperture that allows said liquid coolant to pass through is formed on each of said insulating papers except for said insulating paper that is positioned radially innermost. 5. The rotary electric machine according to claim 4, wherein said penetrating aperture is formed on said insulating paper so as to overlap when viewed from a radially outer side of said coil end with a gap that is formed between said conductor portions that are on opposite sides of said insulating paper. 6. The rotary electric machine according to claim 1, wherein a central bore is formed at a central axial position of said rotating shaft, a nozzle is formed so as to branch off radially from said central bore at a position of said coil end on said rotating shaft, and said liquid coolant is supplied to said central bore during operation, and is blown onto said coil end from said nozzle. | A rotary electric machine is installed such that a central axis of a rotating shaft is horizontal, and coolant suction apertures are formed at positions on a cylindrical portion of a frame that are vertically above first and second coil ends, and strip-shaped insulating papers are inserted such that a thickness direction is in a radial direction between radially adjacent conductor portions of portions of the conductor wire that constitute the first and second coil ends, and are disposed so as to extend circumferentially across positions that are vertically below the coolant suction apertures inside the first and second coil ends.1. A rotary electric machine comprising:
a housing; a rotor that is fixed to a rotating shaft that is rotatably supported by said housing so as to be disposed inside said housing; an armature including:
an annular armature core in which slots are arranged circumferentially so as to open radially inward; and
an armature winding that is constituted by a plurality of coils that are each produced by bending and shaping a conductor wire, and that are mounted to said armature core,
said armature being disposed so as to be coaxial to said rotor so as to surround said rotor, and being held by said housing,
said rotary electric machine being installed such that a central axis of said rotating shaft is horizontal, and a liquid coolant being blown onto a coil end of said armature winding from a coolant suction aperture that is formed on said housing to cool said armature winding, wherein: said coolant suction aperture is formed at a position on said housing that is vertically above said coil end; and a strip-shaped insulating paper is inserted such that a thickness direction is in a radial direction between radially adjacent conductor portions of a portion of said conductor wire that constitutes said coil end, and is disposed so as to extend circumferentially across a position that is vertically below said coolant suction aperture inside said coil end. 2. The rotary electric machine according to claim 1, wherein:
m layers of said insulating paper that is inserted between said radially adjacent conductor portions are disposed in a radial direction, where m is an integer that is greater than or equal to 1; and a penetrating aperture that allows said liquid coolant to pass through is formed on each of said m layers of insulating paper that are disposed in said radial direction. 3. The rotary electric machine according to claim 2, wherein said penetrating aperture is formed on said insulating paper so as to overlap when viewed from a radially outer side of said coil end with a gap that is formed between said conductor portions that are on opposite sides of said insulating paper. 4. The rotary electric machine according to claim 1, wherein:
m layers of said insulating paper that is inserted between said radially adjacent conductor portions are disposed in a radial direction, where m is an integer that is greater than or equal to 2; and a penetrating aperture that allows said liquid coolant to pass through is formed on each of said insulating papers except for said insulating paper that is positioned radially innermost. 5. The rotary electric machine according to claim 4, wherein said penetrating aperture is formed on said insulating paper so as to overlap when viewed from a radially outer side of said coil end with a gap that is formed between said conductor portions that are on opposite sides of said insulating paper. 6. The rotary electric machine according to claim 1, wherein a central bore is formed at a central axial position of said rotating shaft, a nozzle is formed so as to branch off radially from said central bore at a position of said coil end on said rotating shaft, and said liquid coolant is supplied to said central bore during operation, and is blown onto said coil end from said nozzle. | 2,800 |
11,230 | 11,230 | 14,771,571 | 2,837 | A winding layer pitch compensation for an air-core reactor which has at least two radially spaced apart concentric winding layers, includes a first set of strip-shaped star sheets, each of which is configured to be arranged radially below or above the winding layers and which are provided with at least one receiving slot along an edge extending from that edge, a second set of strip-shaped compensation sheets, each of which is provided with at least one insert slot along an extending from another edge, where a compensation sheet can be inserted into each receiving slot of a star sheet in a formfitting manner, where the star sheet engages into the insert slot of the compensation sheet in a formfitting manner, and where the slot depths of at least two receiving slots of the set of star sheets are different. | 1-8. (canceled) 9. A winding layer pitch compensation for an air-core reactor, which has at least two radially spaced apart concentric winding layers, comprising:
a first set of strip-shaped star sheets, each of said first strip-shaped star sheets being for a radial arrangement below and above the winding layers and being provided along an edge with at least one receiving slot emanating from the edge; a second set of strip-shaped compensation sheets, each of said second set of strip-shaped compensation sheets being provided along another edge with at least one insert slot emanating from the other edge, wherein a compensation sheet of second set of strip-shaped compensation sheets is insertable in a form fitting manner into each receiving slot of a star sheet and the star sheet in this case engages in a form fit into a respective insert slot; and wherein slot depths of at least two receiving slots of the first set of strip-shaped star sheets are different. 10. The winding layer pitch compensation as claimed in claim 9, wherein each of said first set of strip-shaped star sheets has at least two receiving slots spaced apart from one another, emanating from the edge, of which the slot depths are different. 11. The winding layer pitch compensation as claimed in claim 9, wherein that the first set of strip-shaped star sheets are made of metal and the receiving slots are milled into said first set of strip-shaped star sheets. 12. The winding layer pitch compensation as claimed in claim 10, wherein that the first set of strip-shaped star sheets are made of metal and the receiving slots are milled into said first set of strip-shaped star sheets. 13. The winding layer pitch compensation as claimed in claim 9, wherein the second set of strip-shaped compensation sheets along with the respective insert slot are molded or cut from plastic. 14. The winding layer pitch compensation as claimed in claim 9, wherein slot widths of at least two receiving slots of a star sheet of the first set of strip-shaped star sheets are different and the second set of strip-shaped compensation sheets have correspondingly adapted different thicknesses. 15. The winding layer pitch compensation as claimed in claim 9, wherein a plurality of the first set of strip-shaped star sheets are welded at one of their ends to form a star. 16. The winding layer pitch compensation as claimed in claim 9, wherein the first set of strip-shaped star sheets do not reach into a central air space of the air-core reactor when installed. 17. The winding layer pitch compensation as claimed in claim 9, wherein the first set of strip-shaped star sheets have anchorages for spacer strips or tensioning bandages extending between the at least two radially spaced apart concentric winding layers. | A winding layer pitch compensation for an air-core reactor which has at least two radially spaced apart concentric winding layers, includes a first set of strip-shaped star sheets, each of which is configured to be arranged radially below or above the winding layers and which are provided with at least one receiving slot along an edge extending from that edge, a second set of strip-shaped compensation sheets, each of which is provided with at least one insert slot along an extending from another edge, where a compensation sheet can be inserted into each receiving slot of a star sheet in a formfitting manner, where the star sheet engages into the insert slot of the compensation sheet in a formfitting manner, and where the slot depths of at least two receiving slots of the set of star sheets are different.1-8. (canceled) 9. A winding layer pitch compensation for an air-core reactor, which has at least two radially spaced apart concentric winding layers, comprising:
a first set of strip-shaped star sheets, each of said first strip-shaped star sheets being for a radial arrangement below and above the winding layers and being provided along an edge with at least one receiving slot emanating from the edge; a second set of strip-shaped compensation sheets, each of said second set of strip-shaped compensation sheets being provided along another edge with at least one insert slot emanating from the other edge, wherein a compensation sheet of second set of strip-shaped compensation sheets is insertable in a form fitting manner into each receiving slot of a star sheet and the star sheet in this case engages in a form fit into a respective insert slot; and wherein slot depths of at least two receiving slots of the first set of strip-shaped star sheets are different. 10. The winding layer pitch compensation as claimed in claim 9, wherein each of said first set of strip-shaped star sheets has at least two receiving slots spaced apart from one another, emanating from the edge, of which the slot depths are different. 11. The winding layer pitch compensation as claimed in claim 9, wherein that the first set of strip-shaped star sheets are made of metal and the receiving slots are milled into said first set of strip-shaped star sheets. 12. The winding layer pitch compensation as claimed in claim 10, wherein that the first set of strip-shaped star sheets are made of metal and the receiving slots are milled into said first set of strip-shaped star sheets. 13. The winding layer pitch compensation as claimed in claim 9, wherein the second set of strip-shaped compensation sheets along with the respective insert slot are molded or cut from plastic. 14. The winding layer pitch compensation as claimed in claim 9, wherein slot widths of at least two receiving slots of a star sheet of the first set of strip-shaped star sheets are different and the second set of strip-shaped compensation sheets have correspondingly adapted different thicknesses. 15. The winding layer pitch compensation as claimed in claim 9, wherein a plurality of the first set of strip-shaped star sheets are welded at one of their ends to form a star. 16. The winding layer pitch compensation as claimed in claim 9, wherein the first set of strip-shaped star sheets do not reach into a central air space of the air-core reactor when installed. 17. The winding layer pitch compensation as claimed in claim 9, wherein the first set of strip-shaped star sheets have anchorages for spacer strips or tensioning bandages extending between the at least two radially spaced apart concentric winding layers. | 2,800 |
11,231 | 11,231 | 14,838,805 | 2,838 | A maximum power point tracking controller includes an input port for electrically coupling to an electric power source, an output port for electrically coupling to a load, a control switching device, and a control subsystem. The control switching device is adapted to repeatedly switch between its conductive and non-conductive states to transfer power from the input port to the output port. The control subsystem is adapted to control switching of the control switching device to regulate a voltage across the input port, based at least in part on a signal representing current flowing out of the output port, to maximize a signal representing power out of the output port. | 1. A method for transferring electric power between an electric power source and a load using a maximum power point tracking controller, comprising the step of controlling switching of a control switching device of the maximum power point tracking controller, based at least in part on a signal representing current flowing through energy storage inductance of the maximum power point tracking controller, to regulate a voltage across the electric power source, such that: (a) the voltage across the electric power source is greater than or equal to a voltage across the load, and (b) a signal representing power transferred to the load is maximized. 2. The method of claim 1, further comprising controlling switching of the control switching device partially based on the signal representing current flowing out of the output port and a difference between the magnitude of the voltage across the electric power source and a reference voltage. 3. The method of claim 2, further comprising varying a magnitude of the reference voltage to maximize the signal representing power transferred to the load. 4. A method for determining a signal representing power in a maximum power point tracking (MPPT) controller, comprising the steps of:
filtering a signal representing current flowing out of an output port of the MPPT controller to obtain a signal representing average current flowing out of the output port; filtering a signal representing voltage across the output port to obtain a signal representing average voltage across the output port; scaling the signal representing average current flowing out of the output port to obtain a scaled signal representing average current flowing out of the output port; scaling the signal representing average voltage across the output port to obtain a scaled signal representing average voltage across the output port; and multiplying the scaled signal representing average current flowing out of the output port by the scaled signal representing average voltage across the output port to obtain the signal representing power. 5. A system for determining a signal representing power in a maximum power point tracking (MPPT) controller, comprising:
a voltage filter subsystem adapted to generate a signal representing average voltage across an output port of the MPPT controller by filtering a signal representing voltage across the output port; a current filter subsystem adapted to generate a signal representing average current flowing out of the output port by filtering a signal representing current flowing out the output port; a voltage scaling subsystem adapted to generate a scaled signal representing average voltage across the output port by scaling the signal representing average voltage across the output port to be within a first predetermined range; a current scaling subsystem adapted to generate a scaled signal representing average current flowing out of the output port by scaling the signal representing average current flowing out the output port to be within a second predetermined range; and a multiplier adapted to determine the signal representing power from a product of the scaled signal representing average voltage across the output port and the scaled signal representing average current flowing out of the output port. 6. The system of claim 5, the multiplier comprising:
a first input port adapted to receive the scaled signal representing average voltage across the output port; a second input port adapted to receive the scaled signal representing average current flowing out of the output port; an output port adapted to provide the signal representing power; a first field effect transistor electrically coupled in series with the first input port; a second field effect transistor electrically coupled in series with the second input port; a third field effect transistor electrically coupled in series with the output port; and control circuitry adapted to control each of the first, second, and third field effect transistors such that a magnitude of current flowing into the output port is proportional to a product of (a) a magnitude of current flowing into the first input port, and (b) a magnitude of current flowing into the second input port. 7. The system of claim 6, a gate of the first field effect transistor being electrically coupled to a gate of the third field effect transistor. 8. The system of claim 7, further comprising:
fourth and fifth field effect transistors forming a current mirror configured such that a magnitude of a drain-to-source current flowing through the fifth field effect transistor is equal to Iref, and a magnitude of a drain-to-source current flowing through the fourth field effect transistor is equal to Iref/m; and a first amplifier adapted to control the gate of the first field effect transistor such that a voltage across the first field effect transistor is equal to a voltage across the fourth field effect transistor. 9. The system of claim 8, a gate of the second field effect transistor being electrically coupled to a gate of the fourth field effect transistor and a gate of the fifth field effect transistor. 10. The system of claim 9, wherein the second field effect transistor has a channel resistance equal to R/m, and the fourth and fifth field effect transistors each have a channel resistance equal to R, when the second, fourth, and fifth transistors are driven by a common gate-to-source voltage. 11. The system of claim 10, further comprising a second amplifier and a sixth transistor configured to control the magnitude of current flowing into the output port such that a voltage across the second field effect transistor is equal to a voltage across the third field effect transistor. 12. The system of claim 6, the current scaling subsystem comprising:
a transconductance subsystem adapted to convert the signal representing average current flowing out the output port to the scaled signal representing average current flowing out of the output port, the transconductance subsystem including a programmable resistor adapted to set a gain of the transconductance subsystem; and control logic adapted to set a resistance of the programmable resistor to adjust the gain of the transconductance subsystem such that a magnitude of the scaled signal representing average current flowing out of the output port is at least as large as a first threshold value. 13. The system of claim 12, the transconductance subsystem further including:
a transistor electrically coupled to the programmable resistor; and an amplifier adapted to control the transistor to regulate a voltage across the programmable resistor in response to the signal representing average current flowing out of the output port. 14. The system of claim 13, the control logic further adapted to set a gain of the transconductance subsystem to a minimum value in response to a first external signal. 15. The system of claim 14, the control logic further adapted to increment the gain of the transconductance subsystem in response to a second external signal, until the magnitude of the scaled signal representing current flowing out of the output port is at least as large as the first threshold value. 16. The system of claim 15, the transconductance system further comprising a current mirror adapted to generate the scaled signal representing average current flowing out of the output port in response to current flowing through the programmable resistor. 17. The system of claim 12, the current filter subsystem comprising:
an integrator subsystem adapted to operate in a bipolar domain to filter an alternating current component of the signal representing current flowing out the output port; and transconductance circuitry adapted to operate in a unipolar domain to generate the signal representing average current flowing out of the output port from an average value of the signal representing current flowing out the output port. 18. The system of claim 17, wherein:
the integrator subsystem is adapted to generate an integrator signal representing the average value of the signal representing current flowing out the output port; and the transconductance circuitry comprises a first transconductance amplifier adapted to generate the signal representing average current flowing out of the output port, from the integrator signal. 19. The system of claim 18, the integrator subsystem comprising:
an integrator having an inverting input terminal and a non-inverting input terminal; and a resistive device electrically coupled across the input terminals of integrator; the non-inverting input terminal of the integrator being electrically coupled to a reference node via a voltage source, the inverting input terminal of the integrator being electrically coupled to a first node, and the current filter subsystem arranged such that the signal representing current flowing out the output port flows out of the first node. 20. The system of claim 19, the transconductance circuitry further comprising a second transconductance amplifier adapted to generate a direct current component of the signal representing current flowing out the output port, from the integrator signal. | A maximum power point tracking controller includes an input port for electrically coupling to an electric power source, an output port for electrically coupling to a load, a control switching device, and a control subsystem. The control switching device is adapted to repeatedly switch between its conductive and non-conductive states to transfer power from the input port to the output port. The control subsystem is adapted to control switching of the control switching device to regulate a voltage across the input port, based at least in part on a signal representing current flowing out of the output port, to maximize a signal representing power out of the output port.1. A method for transferring electric power between an electric power source and a load using a maximum power point tracking controller, comprising the step of controlling switching of a control switching device of the maximum power point tracking controller, based at least in part on a signal representing current flowing through energy storage inductance of the maximum power point tracking controller, to regulate a voltage across the electric power source, such that: (a) the voltage across the electric power source is greater than or equal to a voltage across the load, and (b) a signal representing power transferred to the load is maximized. 2. The method of claim 1, further comprising controlling switching of the control switching device partially based on the signal representing current flowing out of the output port and a difference between the magnitude of the voltage across the electric power source and a reference voltage. 3. The method of claim 2, further comprising varying a magnitude of the reference voltage to maximize the signal representing power transferred to the load. 4. A method for determining a signal representing power in a maximum power point tracking (MPPT) controller, comprising the steps of:
filtering a signal representing current flowing out of an output port of the MPPT controller to obtain a signal representing average current flowing out of the output port; filtering a signal representing voltage across the output port to obtain a signal representing average voltage across the output port; scaling the signal representing average current flowing out of the output port to obtain a scaled signal representing average current flowing out of the output port; scaling the signal representing average voltage across the output port to obtain a scaled signal representing average voltage across the output port; and multiplying the scaled signal representing average current flowing out of the output port by the scaled signal representing average voltage across the output port to obtain the signal representing power. 5. A system for determining a signal representing power in a maximum power point tracking (MPPT) controller, comprising:
a voltage filter subsystem adapted to generate a signal representing average voltage across an output port of the MPPT controller by filtering a signal representing voltage across the output port; a current filter subsystem adapted to generate a signal representing average current flowing out of the output port by filtering a signal representing current flowing out the output port; a voltage scaling subsystem adapted to generate a scaled signal representing average voltage across the output port by scaling the signal representing average voltage across the output port to be within a first predetermined range; a current scaling subsystem adapted to generate a scaled signal representing average current flowing out of the output port by scaling the signal representing average current flowing out the output port to be within a second predetermined range; and a multiplier adapted to determine the signal representing power from a product of the scaled signal representing average voltage across the output port and the scaled signal representing average current flowing out of the output port. 6. The system of claim 5, the multiplier comprising:
a first input port adapted to receive the scaled signal representing average voltage across the output port; a second input port adapted to receive the scaled signal representing average current flowing out of the output port; an output port adapted to provide the signal representing power; a first field effect transistor electrically coupled in series with the first input port; a second field effect transistor electrically coupled in series with the second input port; a third field effect transistor electrically coupled in series with the output port; and control circuitry adapted to control each of the first, second, and third field effect transistors such that a magnitude of current flowing into the output port is proportional to a product of (a) a magnitude of current flowing into the first input port, and (b) a magnitude of current flowing into the second input port. 7. The system of claim 6, a gate of the first field effect transistor being electrically coupled to a gate of the third field effect transistor. 8. The system of claim 7, further comprising:
fourth and fifth field effect transistors forming a current mirror configured such that a magnitude of a drain-to-source current flowing through the fifth field effect transistor is equal to Iref, and a magnitude of a drain-to-source current flowing through the fourth field effect transistor is equal to Iref/m; and a first amplifier adapted to control the gate of the first field effect transistor such that a voltage across the first field effect transistor is equal to a voltage across the fourth field effect transistor. 9. The system of claim 8, a gate of the second field effect transistor being electrically coupled to a gate of the fourth field effect transistor and a gate of the fifth field effect transistor. 10. The system of claim 9, wherein the second field effect transistor has a channel resistance equal to R/m, and the fourth and fifth field effect transistors each have a channel resistance equal to R, when the second, fourth, and fifth transistors are driven by a common gate-to-source voltage. 11. The system of claim 10, further comprising a second amplifier and a sixth transistor configured to control the magnitude of current flowing into the output port such that a voltage across the second field effect transistor is equal to a voltage across the third field effect transistor. 12. The system of claim 6, the current scaling subsystem comprising:
a transconductance subsystem adapted to convert the signal representing average current flowing out the output port to the scaled signal representing average current flowing out of the output port, the transconductance subsystem including a programmable resistor adapted to set a gain of the transconductance subsystem; and control logic adapted to set a resistance of the programmable resistor to adjust the gain of the transconductance subsystem such that a magnitude of the scaled signal representing average current flowing out of the output port is at least as large as a first threshold value. 13. The system of claim 12, the transconductance subsystem further including:
a transistor electrically coupled to the programmable resistor; and an amplifier adapted to control the transistor to regulate a voltage across the programmable resistor in response to the signal representing average current flowing out of the output port. 14. The system of claim 13, the control logic further adapted to set a gain of the transconductance subsystem to a minimum value in response to a first external signal. 15. The system of claim 14, the control logic further adapted to increment the gain of the transconductance subsystem in response to a second external signal, until the magnitude of the scaled signal representing current flowing out of the output port is at least as large as the first threshold value. 16. The system of claim 15, the transconductance system further comprising a current mirror adapted to generate the scaled signal representing average current flowing out of the output port in response to current flowing through the programmable resistor. 17. The system of claim 12, the current filter subsystem comprising:
an integrator subsystem adapted to operate in a bipolar domain to filter an alternating current component of the signal representing current flowing out the output port; and transconductance circuitry adapted to operate in a unipolar domain to generate the signal representing average current flowing out of the output port from an average value of the signal representing current flowing out the output port. 18. The system of claim 17, wherein:
the integrator subsystem is adapted to generate an integrator signal representing the average value of the signal representing current flowing out the output port; and the transconductance circuitry comprises a first transconductance amplifier adapted to generate the signal representing average current flowing out of the output port, from the integrator signal. 19. The system of claim 18, the integrator subsystem comprising:
an integrator having an inverting input terminal and a non-inverting input terminal; and a resistive device electrically coupled across the input terminals of integrator; the non-inverting input terminal of the integrator being electrically coupled to a reference node via a voltage source, the inverting input terminal of the integrator being electrically coupled to a first node, and the current filter subsystem arranged such that the signal representing current flowing out the output port flows out of the first node. 20. The system of claim 19, the transconductance circuitry further comprising a second transconductance amplifier adapted to generate a direct current component of the signal representing current flowing out the output port, from the integrator signal. | 2,800 |
11,232 | 11,232 | 14,589,551 | 2,872 | Electromechanical light modulators and backlight providing efficient, low cost and high performance displays. | 1. A display comprising:
a plurality of modulators each including a shutter having light transmitting regions, and a substrate having a surface and a plurality of embedded light reflectors, wherein said embedded light reflectors cause light to exit the substrate from said surface of the substrate and converge at respective light transmitting regions of the shutter. 2. The display of the claim 1 further includes a light absorbing layer having a plurality of light transmitting regions, wherein light transmitting through the light transmitting regions of the shutter transmits through respective light transmitting regions of the light absorbing layer. 3. The display of the claim 1 wherein said substrate further includes a light input surface that is optically coupled to a light guide via an optical layer having a refractive index that is smaller than a refractive index of the light guide. 4. The display of the claim 1 wherein said embedded light reflectors having a curved surface with a cross section having a radius of curvature between 20 to 80 micrometer. 5. The display of the claim 1 wherein said shutter having a first and a second end, supported over a surface with a plurality of supports attached at said first and second ends, the supports attached at said first and second ends are inclined with respect to each other and are inclined with respect to the surface. 6. The display of the claim 1 wherein said shutter supported over the surface with a plurality of cantilever beams that are formed between the shutter and the surface. 8. The display of the claim 1 wherein said shutter supported over the surface with a plurality of cantilever beams located between the shutter and the surface, said cantilever beams are spaced from the shutter by a first gap and spaced from the surface by a second gap. 9. The display of the claim 1 wherein said shutter having a first and a second end, supported over a surface with a plurality of supports attached at said first and second ends, wherein said supports attached at said first end are substantially straight and said supports attached at said second end are curved. 10. The display of the claim 1 wherein said shutter supported over the surface with a plurality of supports that are formed from a conductor and provide an electrical connection from the surface to the shutter. 11. The display of the claim 1 wherein said shutter includes a flange extending from an edge of the shutter and forms an electrostatic actuator with a fixed electrode. 12. The display of the claim 1 wherein said shutter includes a flange extending from an edge of the shutter, said shutter supported over a surface with a plurality of supports that are positioned substantially parallel to the surface and are inclined with respect to a surface of the flange. 13. The display of the claim 1 wherein each said modulator further includes an actuator that applies a first force to the shutter and moves the shutter substantially in a lateral direction with respect to the first force in a plane substantially parallel to the surface of the substrate. 14. The display of the claim 1 further includes a light absorbing layer having light transmitting regions and wherein said shutter having light blocking regions and said light transmitting regions of the light absorbing layer are larger than the light transmitting regions of the shutter and are smaller than the light blocking regions of the shutter. 15. The display of the claim 1 wherein each said modulator further includes a first and a second electrode in which said first and second electrodes are formed on the shutter. 16. The display of the claim 1 further includes a light diffuser layer for diffusing light transmitting through the light transmitting regions of the shutter. 17. The display of the claim 1 further includes a light diffuser layer and a light absorbing layer formed on the light diffuser layer, said light absorbing layer having light transmitting regions and light blocking regions. 18. The display of the claim 1 further includes a backlight including a rear light absorber for absorbing light reflected from the shutter. 19. The display of the claim 1 further includes a light absorbing layer formed from a conductive material. 20. The display of the claim 1 further includes a light absorbing layer formed from a conductive material and said shutter includes a first and a second electrode, each said first and second electrodes forms an electrostatic actuator with the conductive light absorbing layer. | Electromechanical light modulators and backlight providing efficient, low cost and high performance displays.1. A display comprising:
a plurality of modulators each including a shutter having light transmitting regions, and a substrate having a surface and a plurality of embedded light reflectors, wherein said embedded light reflectors cause light to exit the substrate from said surface of the substrate and converge at respective light transmitting regions of the shutter. 2. The display of the claim 1 further includes a light absorbing layer having a plurality of light transmitting regions, wherein light transmitting through the light transmitting regions of the shutter transmits through respective light transmitting regions of the light absorbing layer. 3. The display of the claim 1 wherein said substrate further includes a light input surface that is optically coupled to a light guide via an optical layer having a refractive index that is smaller than a refractive index of the light guide. 4. The display of the claim 1 wherein said embedded light reflectors having a curved surface with a cross section having a radius of curvature between 20 to 80 micrometer. 5. The display of the claim 1 wherein said shutter having a first and a second end, supported over a surface with a plurality of supports attached at said first and second ends, the supports attached at said first and second ends are inclined with respect to each other and are inclined with respect to the surface. 6. The display of the claim 1 wherein said shutter supported over the surface with a plurality of cantilever beams that are formed between the shutter and the surface. 8. The display of the claim 1 wherein said shutter supported over the surface with a plurality of cantilever beams located between the shutter and the surface, said cantilever beams are spaced from the shutter by a first gap and spaced from the surface by a second gap. 9. The display of the claim 1 wherein said shutter having a first and a second end, supported over a surface with a plurality of supports attached at said first and second ends, wherein said supports attached at said first end are substantially straight and said supports attached at said second end are curved. 10. The display of the claim 1 wherein said shutter supported over the surface with a plurality of supports that are formed from a conductor and provide an electrical connection from the surface to the shutter. 11. The display of the claim 1 wherein said shutter includes a flange extending from an edge of the shutter and forms an electrostatic actuator with a fixed electrode. 12. The display of the claim 1 wherein said shutter includes a flange extending from an edge of the shutter, said shutter supported over a surface with a plurality of supports that are positioned substantially parallel to the surface and are inclined with respect to a surface of the flange. 13. The display of the claim 1 wherein each said modulator further includes an actuator that applies a first force to the shutter and moves the shutter substantially in a lateral direction with respect to the first force in a plane substantially parallel to the surface of the substrate. 14. The display of the claim 1 further includes a light absorbing layer having light transmitting regions and wherein said shutter having light blocking regions and said light transmitting regions of the light absorbing layer are larger than the light transmitting regions of the shutter and are smaller than the light blocking regions of the shutter. 15. The display of the claim 1 wherein each said modulator further includes a first and a second electrode in which said first and second electrodes are formed on the shutter. 16. The display of the claim 1 further includes a light diffuser layer for diffusing light transmitting through the light transmitting regions of the shutter. 17. The display of the claim 1 further includes a light diffuser layer and a light absorbing layer formed on the light diffuser layer, said light absorbing layer having light transmitting regions and light blocking regions. 18. The display of the claim 1 further includes a backlight including a rear light absorber for absorbing light reflected from the shutter. 19. The display of the claim 1 further includes a light absorbing layer formed from a conductive material. 20. The display of the claim 1 further includes a light absorbing layer formed from a conductive material and said shutter includes a first and a second electrode, each said first and second electrodes forms an electrostatic actuator with the conductive light absorbing layer. | 2,800 |
11,233 | 11,233 | 14,915,641 | 2,872 | The invention relates to a perimeter or a campimeter with a visible fixation point and a method used in them. The method comprises at least the following steps:
producing a fixation point having a first visual appearance to be shown to a patient; producing a stimulus shown to the patient at a stimulus time-point at a pre-defined location; activating a response device by the patient upon noticing the stimulus at a response time-point; changing the fixation point to have a second visual appearance for a fixation point second visual appearance time interval near the stimulus time-point. | 1. A method used in a standard automated perimetry (SAP) perimeter or campimeter with a visible fixation point, the method comprising at least the following steps:
producing a fixation point (101) having a first visual appearance (101 a) to be shown to a patient (100); producing a stimulus (105) shown to the patient at a stimulus time-point at a pre-defined location; activating a response device (103) by the patient upon noticing the stimulus at a response time-point;
characterized in
changing the fixation point to have a second visual appearance (101 b) for a fixation point second visual appearance time interval near the stimulus time-point by starting the fixation point second visual appearance time interval not earlier than 1 second before the stimulus time-point;
changing the fixation point back to have the first visual appearance (101 a) after the fixation point second visual appearance time interval has ended or after patient has responded. 2. A method according to claim 1, characterized in that ambient light sensors (15) are used to adjust intensity i.e. luminance of the stimuli and fixation points during a test based on illumination of perimeter surface so that luminance contrast can be set at the desired level. 3. A method according to claim 1, characterized in
starting the fixation point second visual appearance time interval less than 200 ms before the stimulus time-point or sometimes up to 1 second later, and/or ending the fixation point second visual appearance time interval not later than 2 seconds, typically 0.5 . . . 1 second, after the stimulus time-point, or after the fixation point second visual appearance is shown, or after patient has responded. 4. A method according to claim 1, characterized in recording whether the patient activates the response device during a response time interval or not. 5. A method according to claim 1, characterized in producing a second stimulus shown to the patient at a second stimulus time-point after a stimulus time interval from either the previous stimulus time-point or the previous response time-point. 6. A method according to claim 5, characterized in varying one or more of:
the stimulus time interval light intensity of the stimulus stimulus size stimulus color stimulus location. 7. A method according to claim 5, characterized in varying the position of the fixation point shown to the patient. 8. A method according to claim 1, characterized in changing the fixation point to have a third visual appearance for a time interval near the stimulus time-point when the patient should not activate the response device even if he/she saw the stimulus. 9. A standard automated perimetry (SAP) perimeter or campimeter with a visible fixation point comprising
means for producing a fixation point (101) having a first visual appearance (101 a) to be shown to a patient (100); means for producing a stimulus (105) shown to the patient at a stimulus time-point; a response device (103) adapted to be activated by the patient upon noticing the stimulus at a response time-point;
characterized in that the means for producing a fixation point are arranged to
change the fixation point to have a second visual appearance (101 b) for a fixation point second visual appearance time interval near the stimulus time-point, starting the fixation point second visual appearance time interval not earlier than 1 second before the stimulus time-point;
change the fixation point back to have the first visual appearance (101 a) after the fixation point second visual appearance time interval has ended or after patient has responded. 10. A perimetry or a campimeter according to claim 9, characterized in that ambient light sensors (15) are used to adjust intensity i.e. luminance of the stimuli and fixation points during a test based on illumination of perimeter surface so that luminance contrast can be set at the desired level. 11. A stand-alone medical device (1) for testing a patient, which comprises in one-piece configuration:
a first testing device comprising a perimeter surface (2) having a first side (3) to be viewed by the patient during testing and second side (4) not to be seen by the patient during testing, one or more second testing devices (5, 7) from the group of: a) a visual acuity measurement device to be viewed by the patient during testing of visual acuity, b) a contrast sensitivity testing device to be viewed by the patient during testing of contrast sensitivity, c) a glare testing device to be viewed by the patient during testing of glare, user interface device (7, 18) for controlling the use of the first and second testing devices, a perimeter or a campimeter according to claim 9. | The invention relates to a perimeter or a campimeter with a visible fixation point and a method used in them. The method comprises at least the following steps:
producing a fixation point having a first visual appearance to be shown to a patient; producing a stimulus shown to the patient at a stimulus time-point at a pre-defined location; activating a response device by the patient upon noticing the stimulus at a response time-point; changing the fixation point to have a second visual appearance for a fixation point second visual appearance time interval near the stimulus time-point.1. A method used in a standard automated perimetry (SAP) perimeter or campimeter with a visible fixation point, the method comprising at least the following steps:
producing a fixation point (101) having a first visual appearance (101 a) to be shown to a patient (100); producing a stimulus (105) shown to the patient at a stimulus time-point at a pre-defined location; activating a response device (103) by the patient upon noticing the stimulus at a response time-point;
characterized in
changing the fixation point to have a second visual appearance (101 b) for a fixation point second visual appearance time interval near the stimulus time-point by starting the fixation point second visual appearance time interval not earlier than 1 second before the stimulus time-point;
changing the fixation point back to have the first visual appearance (101 a) after the fixation point second visual appearance time interval has ended or after patient has responded. 2. A method according to claim 1, characterized in that ambient light sensors (15) are used to adjust intensity i.e. luminance of the stimuli and fixation points during a test based on illumination of perimeter surface so that luminance contrast can be set at the desired level. 3. A method according to claim 1, characterized in
starting the fixation point second visual appearance time interval less than 200 ms before the stimulus time-point or sometimes up to 1 second later, and/or ending the fixation point second visual appearance time interval not later than 2 seconds, typically 0.5 . . . 1 second, after the stimulus time-point, or after the fixation point second visual appearance is shown, or after patient has responded. 4. A method according to claim 1, characterized in recording whether the patient activates the response device during a response time interval or not. 5. A method according to claim 1, characterized in producing a second stimulus shown to the patient at a second stimulus time-point after a stimulus time interval from either the previous stimulus time-point or the previous response time-point. 6. A method according to claim 5, characterized in varying one or more of:
the stimulus time interval light intensity of the stimulus stimulus size stimulus color stimulus location. 7. A method according to claim 5, characterized in varying the position of the fixation point shown to the patient. 8. A method according to claim 1, characterized in changing the fixation point to have a third visual appearance for a time interval near the stimulus time-point when the patient should not activate the response device even if he/she saw the stimulus. 9. A standard automated perimetry (SAP) perimeter or campimeter with a visible fixation point comprising
means for producing a fixation point (101) having a first visual appearance (101 a) to be shown to a patient (100); means for producing a stimulus (105) shown to the patient at a stimulus time-point; a response device (103) adapted to be activated by the patient upon noticing the stimulus at a response time-point;
characterized in that the means for producing a fixation point are arranged to
change the fixation point to have a second visual appearance (101 b) for a fixation point second visual appearance time interval near the stimulus time-point, starting the fixation point second visual appearance time interval not earlier than 1 second before the stimulus time-point;
change the fixation point back to have the first visual appearance (101 a) after the fixation point second visual appearance time interval has ended or after patient has responded. 10. A perimetry or a campimeter according to claim 9, characterized in that ambient light sensors (15) are used to adjust intensity i.e. luminance of the stimuli and fixation points during a test based on illumination of perimeter surface so that luminance contrast can be set at the desired level. 11. A stand-alone medical device (1) for testing a patient, which comprises in one-piece configuration:
a first testing device comprising a perimeter surface (2) having a first side (3) to be viewed by the patient during testing and second side (4) not to be seen by the patient during testing, one or more second testing devices (5, 7) from the group of: a) a visual acuity measurement device to be viewed by the patient during testing of visual acuity, b) a contrast sensitivity testing device to be viewed by the patient during testing of contrast sensitivity, c) a glare testing device to be viewed by the patient during testing of glare, user interface device (7, 18) for controlling the use of the first and second testing devices, a perimeter or a campimeter according to claim 9. | 2,800 |
11,234 | 11,234 | 14,329,461 | 2,859 | An example battery inspection aid includes a label having a temperature responsive portion that indicates temperature changes and a strain responsive portion that indicates positional changes. An example method of inspecting a battery includes detecting changes in a temperature of a battery from a temperature responsive portion of a label, and detecting changes in a strain of the battery from a strain responsive portion of the label. | 1. An inspection aid, comprising:
a label having a temperature responsive portion that indicates temperature changes, and a strain responsive portion that indicates positional changes. 2. The inspection aid of claim 1, wherein the temperature responsive portion comprises a thermochromic material that changes color in response to temperature changes. 3. The inspection aid of claim 2, wherein the thermochromic material comprises thermochromic ink. 4. The inspection aid of claim 1, wherein the strain responsive portion comprises a plurality of reference coordinates that move relative to each other in response to expansion or contraction of the label. 5. The inspection aid of claim 4, wherein a first one of the plurality of the reference points is spaced a distance from a second one of the plurality of reference points, wherein the distance increases in response to a pressure within a battery increasing, and the distance decreases in response to the pressure within the battery decreasing. 6. The inspection aid of claim 1, further comprising an identification portion of the label, the identification portion containing identification information. 7. The inspection aid of claim 6, wherein the identification portion provides at least some of the temperature responsive portion and at least some of the strain responsive portion. 8. The inspection aid of claim 6, wherein the identification portion comprises a bar code. 9. The inspection aid of claim 6, wherein the identification portion comprises a quick response code. 10. The inspection aid of claim 1, wherein the label is attached to a battery cell of an electric vehicle. 11. The inspection aid of claim 1, wherein the label is printed on a lithium ion battery cell. 12. A method of inspecting, comprising:
detecting changes in a temperature of a battery from a temperature responsive portion of a label; and detecting changes in a strain of the battery from a strain responsive portion of the label. 13. The method of claim 12, wherein changes in a color of the temperature responsive portion indicate a change in temperature. 14. The method of claim 13, wherein the strain responsive portion comprises reference coordinates, and a change in a relative position of the reference coordinates indicate a change in strain. 15. The method of claim 14, further comprising optically reading the label to collect the color and the position. 16. The method of claim 14, wherein a distance between at least some of the reference coordinates that increases over time indicates tensile strain, and a distance between at least some of the reference coordinates that decreases over time indicates compressive strain. 17. The method of claim 16, further comprising estimating pressure within the battery using strain. 18. The method of claim 12, further comprising collecting identification information about the battery during an optical reading of an information portion of the label. 19. The method of claim 12, further comprising securing the label directly to the battery. 20. The method of claim 12, further comprising painting the label directly on the battery. 21. The method of claim 12, further comprising referencing a database during the detecting, the database comprising at least one reference color associated with at least one temperature, a measurement of strain associated with a pressure, or both. 22. The method of claim 21, further comprising updating the database using information from during the detecting. 23. The method of claim 12, further comprising diagnosing that a battery should be replaced based on the changes in the temperature, the changes in the strain, or both. | An example battery inspection aid includes a label having a temperature responsive portion that indicates temperature changes and a strain responsive portion that indicates positional changes. An example method of inspecting a battery includes detecting changes in a temperature of a battery from a temperature responsive portion of a label, and detecting changes in a strain of the battery from a strain responsive portion of the label.1. An inspection aid, comprising:
a label having a temperature responsive portion that indicates temperature changes, and a strain responsive portion that indicates positional changes. 2. The inspection aid of claim 1, wherein the temperature responsive portion comprises a thermochromic material that changes color in response to temperature changes. 3. The inspection aid of claim 2, wherein the thermochromic material comprises thermochromic ink. 4. The inspection aid of claim 1, wherein the strain responsive portion comprises a plurality of reference coordinates that move relative to each other in response to expansion or contraction of the label. 5. The inspection aid of claim 4, wherein a first one of the plurality of the reference points is spaced a distance from a second one of the plurality of reference points, wherein the distance increases in response to a pressure within a battery increasing, and the distance decreases in response to the pressure within the battery decreasing. 6. The inspection aid of claim 1, further comprising an identification portion of the label, the identification portion containing identification information. 7. The inspection aid of claim 6, wherein the identification portion provides at least some of the temperature responsive portion and at least some of the strain responsive portion. 8. The inspection aid of claim 6, wherein the identification portion comprises a bar code. 9. The inspection aid of claim 6, wherein the identification portion comprises a quick response code. 10. The inspection aid of claim 1, wherein the label is attached to a battery cell of an electric vehicle. 11. The inspection aid of claim 1, wherein the label is printed on a lithium ion battery cell. 12. A method of inspecting, comprising:
detecting changes in a temperature of a battery from a temperature responsive portion of a label; and detecting changes in a strain of the battery from a strain responsive portion of the label. 13. The method of claim 12, wherein changes in a color of the temperature responsive portion indicate a change in temperature. 14. The method of claim 13, wherein the strain responsive portion comprises reference coordinates, and a change in a relative position of the reference coordinates indicate a change in strain. 15. The method of claim 14, further comprising optically reading the label to collect the color and the position. 16. The method of claim 14, wherein a distance between at least some of the reference coordinates that increases over time indicates tensile strain, and a distance between at least some of the reference coordinates that decreases over time indicates compressive strain. 17. The method of claim 16, further comprising estimating pressure within the battery using strain. 18. The method of claim 12, further comprising collecting identification information about the battery during an optical reading of an information portion of the label. 19. The method of claim 12, further comprising securing the label directly to the battery. 20. The method of claim 12, further comprising painting the label directly on the battery. 21. The method of claim 12, further comprising referencing a database during the detecting, the database comprising at least one reference color associated with at least one temperature, a measurement of strain associated with a pressure, or both. 22. The method of claim 21, further comprising updating the database using information from during the detecting. 23. The method of claim 12, further comprising diagnosing that a battery should be replaced based on the changes in the temperature, the changes in the strain, or both. | 2,800 |
11,235 | 11,235 | 13,731,749 | 2,862 | Power outages and restorations at telecommunications subscribers' premises can be automatically detected and reported in a manner that is sensitive to subscriber privacy concerns. A server device receives, from a network terminal device installed at a subscriber premise, an alert that the network terminal device has lost primary power from a power grid. The server device determines a physical address of a location for the network terminal and associates the physical address of the network terminal location with particular power grid equipment. The server device determines whether a power outage of the power grid has occurred and outputs a notification of the power outage associated with the particular power grid equipment when the power outage is determined to occur. | 1. A method, comprising:
receiving, by one or more server devices and from a network terminal device installed at a subscriber premise, an alert that the network terminal device has lost primary power from a power grid; determining, by the one or more server devices, a physical address of a location for the network terminal; associating, by the one or more server devices, the physical address of the network terminal location with particular power grid equipment; determining, by the one or more server devices, whether a power outage of the power grid has occurred; and outputting, by the server device, a notification of the power outage associated with the particular power grid equipment when the power outage is determined to occur. 2. The method of claim 1, wherein associating the physical address of the network terminal location with particular power grid equipment comprises:
matching, in a subscriber data table, an identifier of the network terminal with a subscriber address; and deriving a first hash value from the physical address using a particular hash function. 3. The method of claim 2, wherein associating the physical address of the network terminal location with particular power grid equipment further comprises:
storing an equipment table that relates multiple pieces of power grid equipment with second hash values derived from physical addresses of a power grid customer, wherein derivation of the second hash value uses the particular hash function; and comparing the first hash value to the second hash values to identify a match. 4. The method of claim 3, wherein the notification of the power outage is not associated with a single physical address of the location for the network terminal. 5. The method of claim 3, wherein the physical address of the network terminal location from the subscriber data table and the physical addresses of the power grid customers from the equipment table are stored in the same format. 6. The method of claim 5, wherein the first hash value and the second hash values are configured to prevent reverse calculations to determine the physical address. 7. The method of claim 1, wherein the notification of the power outage includes:
an identifier for the particular power grid equipment; and one or more of a notification code and a time. 8. The method of claim 1, wherein outputting a notification of the power outage includes notifying a power provider that is responsible for managing or operating the power grid. 9. The method of claim 1, wherein the notification of the power outage does not include the physical address of the network terminal location. 10. The method of claim 1, further comprising:
receiving, from the network terminal device, another alert that the network terminal device is receiving power from the power grid; determining whether the power outage of the power grid has been remedied; and outputting another notification that the power outage has been remedied when the power outage is determined to have been remedied, wherein the other notification includes an indication of the particular power grid equipment. 11. The method of claim 1, wherein determining whether a power outage of the power grid has occurred includes:
analyzing a plurality of other alerts received from a plurality of respective network terminal devices. 12. A system comprising:
a first server device including:
a first memory to store:
a plurality of instructions, and
a subscriber data structure associating multiple network terminal devices with addresses of corresponding subscriber premises that receive power from a power grid; and
a first processor configured to:
receive, from a network terminal device installed at a subscriber premise, an alert that the network terminal device has lost primary power from the power grid,
determine, based on the subscriber data structure, a physical address of a location for the network terminal,
generate a first hash value based on the physical address of the network terminal location,
determine whether a power outage within the power grid has occurred, and
output an indication of the power outage that includes the first hash value when the power outage is determined to have occurred. 13. The system of claim 12, further comprising:
a second server device including:
a second memory to store:
a plurality of instructions, and
an equipment data structure that relates multiple pieces of power grid equipment with second hash values derived from physical addresses of power grid customers; and
a second processor configured to:
receive, from the first server device, the indication of the power outage,
compare the first hash value to the second hash values to identify a match, and
output a notification of the power outage that includes particular power grid equipment related to the matching one of the second hash values. 14. The system of claim 13, wherein the first hash value and the second hash value are derived using the same hash function. 15. The system of claim 13, wherein the physical address of the network terminal location and the physical addresses of the power grid customers are stored in the same format. 16. The system of claim 13, wherein, when outputting the notification of the power outage, the second processor is further configured to:
notify a power provider that is responsible for managing or operating the power grid. 17. The system of claim 12, wherein the notification of the power outage includes:
an identifier for the particular power grid equipment; and one or more of a notification code and a time. 18. A method, comprising:
generating, by a server device, a reference database of network terminal identifiers for network terminals associated with a service provider and power equipment identifiers for power equipment associated with a power provider; receiving, by the server device and from a network terminal device installed at a subscriber premise, an outage alert that the network terminal device has lost primary power from a power grid, wherein the outage alert includes a network terminal identifier for the network terminal device; matching, by the server device and based on the reference database, the network terminal identifier in the outage alert to a corresponding power equipment identifier; and sending, by the server device and to a device associated with the power provider, an outage notification that includes information from the outage alert and the power equipment identifier. 19. The method of claim 18, wherein generating the reference database includes:
receiving, from a device associated with the service provider, a first database excerpt including network terminal identifiers and first hash values of corresponding subscriber addresses; receiving, from the device associated with the power provider, a second database excerpt including power equipment identifiers and second hash values of corresponding addresses for power equipment; and matching the first hash values to the second hash values to create the reference database. 20. The method of claim 19, wherein each of the power equipment identifiers is associated with more than one of the second hash values of corresponding addresses such that matching the network terminal identifier in the outage alert to the corresponding power equipment identifier precludes identification of a particular one of the subscriber addresses. 21. The method of claim 19, wherein the server device is managed by a third party that is different than the service provider and the power provider. 22. The method of claim 19, wherein the subscriber addresses and the address for power equipment include physical addresses in a standard format. 23. A non-transitory computer-readable medium comprising one or more instructions to:
generate a reference database of network terminal identifiers for network terminals associated with a service provider and power equipment identifiers for power equipment associated with a power provider; receive an outage alert originating from a network terminal device installed at a subscriber premise, the outage alert indicating that the network terminal device has lost primary power from a power grid, wherein the outage alert includes a network terminal identifier for the network terminal device; match, based on the reference database, the network terminal identifier in the outage alert to a corresponding power equipment identifier; and send, to a device associated with the power provider, an outage notification that includes information from the outage alert and the power equipment identifier. 24. The non-transitory computer-readable medium of claim 23, further comprising instructions to:
receive, from a device associated with the service provider, a first database excerpt including network terminal identifiers and first hash values of corresponding subscriber addresses; and receive, from the device associated with the power provider, a second database excerpt including power equipment identifiers and second hash values of corresponding addresses for power equipment, wherein each of the power equipment identifiers is associated with more than one of the second hash values. | Power outages and restorations at telecommunications subscribers' premises can be automatically detected and reported in a manner that is sensitive to subscriber privacy concerns. A server device receives, from a network terminal device installed at a subscriber premise, an alert that the network terminal device has lost primary power from a power grid. The server device determines a physical address of a location for the network terminal and associates the physical address of the network terminal location with particular power grid equipment. The server device determines whether a power outage of the power grid has occurred and outputs a notification of the power outage associated with the particular power grid equipment when the power outage is determined to occur.1. A method, comprising:
receiving, by one or more server devices and from a network terminal device installed at a subscriber premise, an alert that the network terminal device has lost primary power from a power grid; determining, by the one or more server devices, a physical address of a location for the network terminal; associating, by the one or more server devices, the physical address of the network terminal location with particular power grid equipment; determining, by the one or more server devices, whether a power outage of the power grid has occurred; and outputting, by the server device, a notification of the power outage associated with the particular power grid equipment when the power outage is determined to occur. 2. The method of claim 1, wherein associating the physical address of the network terminal location with particular power grid equipment comprises:
matching, in a subscriber data table, an identifier of the network terminal with a subscriber address; and deriving a first hash value from the physical address using a particular hash function. 3. The method of claim 2, wherein associating the physical address of the network terminal location with particular power grid equipment further comprises:
storing an equipment table that relates multiple pieces of power grid equipment with second hash values derived from physical addresses of a power grid customer, wherein derivation of the second hash value uses the particular hash function; and comparing the first hash value to the second hash values to identify a match. 4. The method of claim 3, wherein the notification of the power outage is not associated with a single physical address of the location for the network terminal. 5. The method of claim 3, wherein the physical address of the network terminal location from the subscriber data table and the physical addresses of the power grid customers from the equipment table are stored in the same format. 6. The method of claim 5, wherein the first hash value and the second hash values are configured to prevent reverse calculations to determine the physical address. 7. The method of claim 1, wherein the notification of the power outage includes:
an identifier for the particular power grid equipment; and one or more of a notification code and a time. 8. The method of claim 1, wherein outputting a notification of the power outage includes notifying a power provider that is responsible for managing or operating the power grid. 9. The method of claim 1, wherein the notification of the power outage does not include the physical address of the network terminal location. 10. The method of claim 1, further comprising:
receiving, from the network terminal device, another alert that the network terminal device is receiving power from the power grid; determining whether the power outage of the power grid has been remedied; and outputting another notification that the power outage has been remedied when the power outage is determined to have been remedied, wherein the other notification includes an indication of the particular power grid equipment. 11. The method of claim 1, wherein determining whether a power outage of the power grid has occurred includes:
analyzing a plurality of other alerts received from a plurality of respective network terminal devices. 12. A system comprising:
a first server device including:
a first memory to store:
a plurality of instructions, and
a subscriber data structure associating multiple network terminal devices with addresses of corresponding subscriber premises that receive power from a power grid; and
a first processor configured to:
receive, from a network terminal device installed at a subscriber premise, an alert that the network terminal device has lost primary power from the power grid,
determine, based on the subscriber data structure, a physical address of a location for the network terminal,
generate a first hash value based on the physical address of the network terminal location,
determine whether a power outage within the power grid has occurred, and
output an indication of the power outage that includes the first hash value when the power outage is determined to have occurred. 13. The system of claim 12, further comprising:
a second server device including:
a second memory to store:
a plurality of instructions, and
an equipment data structure that relates multiple pieces of power grid equipment with second hash values derived from physical addresses of power grid customers; and
a second processor configured to:
receive, from the first server device, the indication of the power outage,
compare the first hash value to the second hash values to identify a match, and
output a notification of the power outage that includes particular power grid equipment related to the matching one of the second hash values. 14. The system of claim 13, wherein the first hash value and the second hash value are derived using the same hash function. 15. The system of claim 13, wherein the physical address of the network terminal location and the physical addresses of the power grid customers are stored in the same format. 16. The system of claim 13, wherein, when outputting the notification of the power outage, the second processor is further configured to:
notify a power provider that is responsible for managing or operating the power grid. 17. The system of claim 12, wherein the notification of the power outage includes:
an identifier for the particular power grid equipment; and one or more of a notification code and a time. 18. A method, comprising:
generating, by a server device, a reference database of network terminal identifiers for network terminals associated with a service provider and power equipment identifiers for power equipment associated with a power provider; receiving, by the server device and from a network terminal device installed at a subscriber premise, an outage alert that the network terminal device has lost primary power from a power grid, wherein the outage alert includes a network terminal identifier for the network terminal device; matching, by the server device and based on the reference database, the network terminal identifier in the outage alert to a corresponding power equipment identifier; and sending, by the server device and to a device associated with the power provider, an outage notification that includes information from the outage alert and the power equipment identifier. 19. The method of claim 18, wherein generating the reference database includes:
receiving, from a device associated with the service provider, a first database excerpt including network terminal identifiers and first hash values of corresponding subscriber addresses; receiving, from the device associated with the power provider, a second database excerpt including power equipment identifiers and second hash values of corresponding addresses for power equipment; and matching the first hash values to the second hash values to create the reference database. 20. The method of claim 19, wherein each of the power equipment identifiers is associated with more than one of the second hash values of corresponding addresses such that matching the network terminal identifier in the outage alert to the corresponding power equipment identifier precludes identification of a particular one of the subscriber addresses. 21. The method of claim 19, wherein the server device is managed by a third party that is different than the service provider and the power provider. 22. The method of claim 19, wherein the subscriber addresses and the address for power equipment include physical addresses in a standard format. 23. A non-transitory computer-readable medium comprising one or more instructions to:
generate a reference database of network terminal identifiers for network terminals associated with a service provider and power equipment identifiers for power equipment associated with a power provider; receive an outage alert originating from a network terminal device installed at a subscriber premise, the outage alert indicating that the network terminal device has lost primary power from a power grid, wherein the outage alert includes a network terminal identifier for the network terminal device; match, based on the reference database, the network terminal identifier in the outage alert to a corresponding power equipment identifier; and send, to a device associated with the power provider, an outage notification that includes information from the outage alert and the power equipment identifier. 24. The non-transitory computer-readable medium of claim 23, further comprising instructions to:
receive, from a device associated with the service provider, a first database excerpt including network terminal identifiers and first hash values of corresponding subscriber addresses; and receive, from the device associated with the power provider, a second database excerpt including power equipment identifiers and second hash values of corresponding addresses for power equipment, wherein each of the power equipment identifiers is associated with more than one of the second hash values. | 2,800 |
11,236 | 11,236 | 15,344,760 | 2,816 | Embodiments are related to systems and methods for forming vias in a substrate, and more particularly to systems and methods for forming vias in a substrate with non-via processing intervening between via processing steps. | 1. A method for forming vias in a substrate, the method comprising:
performing a via pre-definition on a substrate wherein at least one deformation is created that is visible at the surface of the substrate; forming a non-via structure on the substrate after the via pre-definition; and forming a via in the substrate after forming the non-via structure on the substrate such that the via is formed in the substrate at a location guided by the deformation. 2. The method of claim 1, wherein the via pre-definition is performed on the substrate prior to formation of any non-via structure on the substrate. 3. The method of claim 1, wherein the via pre-definition is performed on the substrate prior to any other processing on the substrate. 4. The method of claim 1, wherein the via pre-definition includes using laser energy to create the at least one deformation at the surface of the substrate. 5. The method of claim 1, wherein forming the via is done using an etching process. 6. The method of claim 5, wherein the etching process is selected from a group consisting of: a wet etch, and a dry etch. 7. The method of claim 1, wherein a ratio of an area of an opening of the via to an area of an opening of the deformation is at least 5:1. 8. The method of claim 1, wherein a ratio of an area of an opening of the via to an area of an opening of the deformation is at least 3:1. 9. The method of claim 1, wherein performing the via pre-definition on the substrate is done when the substrate is secured to a first substrate carrier, and wherein forming the via in the substrate is done when the substrate is secured to a second substrate carrier. 10. The method of claim 1, wherein a material of the substrate is selected from a group consisting of: glass, ceramic, polymer, metal, and a combination of two or more of glass, ceramic, polymer, and metal. 11. The method of claim 1, wherein the non-via structure is selected from a group consisting of: a well capable of receiving a fluidically assembled micro-element, a transistor, an electric contact, an optical device, a sensor structure, an antenna structure, a photovoltaic structure, a film or coating on the substrate surface, and an electrically conductive trace. 12. A method for forming vias in a substrate, the method comprising:
providing a substrate including at least one deformation at a first surface of the substrate; performing non-via related processing on a selected surface of the substrate; and forming a via in the substrate after performing the non-via related processing such that the via is formed in the substrate at a location selected using the deformation for alignment. 13. The method of claim 12, wherein the selected surface is selected from a group consisting of: the first surface, and a second surface. 14. The method of claim 12, wherein during the forming the via in the substrate, the substrate is secured to a substrate carrier such that the first surface of the substrate is exposed to processing. 15. The method of claim 14, wherein the selected surface of the substrate is a second surface of the substrate; and wherein during the performing non-via related processing on the selected surface of the substrate, the substrate is secured to the substrate carrier such that the second surface of the substrate is exposed to processing. 16. The method of claim 14, wherein the selected surface of the substrate is the first surface of the substrate; and wherein during the performing non-via related processing on the selected surface of the substrate, the substrate is secured to the substrate carrier such that the first surface of the substrate is exposed to processing. 17. The method of claim 12, wherein performing the non-via related processing on the selected surface of the substrate results in a non-via structure on the selected surface of the substrate. 18. The method of claim 17, wherein the non-via structure is selected from a group consisting of: a well capable of receiving a fluidically assembled micro-element, a transistor, an electric contact, an optical device, a sensor structure, an antenna structure, a photovoltaic structure, a film or coating on the substrate surface, and an electrically conductive trace. 19. The method of claim 12, wherein the method further comprises:
performing via pre-definition to yield the at least one deformation at the first surface of the substrate. 20. The method of claim 12, wherein forming the via is done using an etching process. 21. The method of claim 12, wherein a material of the substrate is selected from a group consisting of: glass, ceramic, and a combination of glass and ceramic. 22. (canceled) 23. A method for forming vias in a substrate, the method comprising:
performing a via pre-definition on a substrate wherein at least one deformation is created at the surface of the substrate; forming a non-via structure on the substrate after the via pre-definition; and forming a via in the substrate after forming the non-via structure on the substrate such that the via is formed in the substrate at a location corresponding to the deformation, wherein a ratio of an area of an opening of the via to an area of an opening of the deformation is at least 3:1. 24. The method of claim 1, wherein the substrate is made of a substrate material, and wherein forming the via in the substrate includes displacing a portion of the substrate material. 25. The method of claim 24, wherein displacing the portion of the substrate material includes removing at least some of the portion of the substrate material. 26. The method of claim 12, wherein the substrate is made of a substrate material, and wherein forming the via in the substrate includes displacing a portion of the substrate material. 27. The method of claim 26, wherein displacing the portion of the substrate material includes removing at least some of the portion of the substrate material. | Embodiments are related to systems and methods for forming vias in a substrate, and more particularly to systems and methods for forming vias in a substrate with non-via processing intervening between via processing steps.1. A method for forming vias in a substrate, the method comprising:
performing a via pre-definition on a substrate wherein at least one deformation is created that is visible at the surface of the substrate; forming a non-via structure on the substrate after the via pre-definition; and forming a via in the substrate after forming the non-via structure on the substrate such that the via is formed in the substrate at a location guided by the deformation. 2. The method of claim 1, wherein the via pre-definition is performed on the substrate prior to formation of any non-via structure on the substrate. 3. The method of claim 1, wherein the via pre-definition is performed on the substrate prior to any other processing on the substrate. 4. The method of claim 1, wherein the via pre-definition includes using laser energy to create the at least one deformation at the surface of the substrate. 5. The method of claim 1, wherein forming the via is done using an etching process. 6. The method of claim 5, wherein the etching process is selected from a group consisting of: a wet etch, and a dry etch. 7. The method of claim 1, wherein a ratio of an area of an opening of the via to an area of an opening of the deformation is at least 5:1. 8. The method of claim 1, wherein a ratio of an area of an opening of the via to an area of an opening of the deformation is at least 3:1. 9. The method of claim 1, wherein performing the via pre-definition on the substrate is done when the substrate is secured to a first substrate carrier, and wherein forming the via in the substrate is done when the substrate is secured to a second substrate carrier. 10. The method of claim 1, wherein a material of the substrate is selected from a group consisting of: glass, ceramic, polymer, metal, and a combination of two or more of glass, ceramic, polymer, and metal. 11. The method of claim 1, wherein the non-via structure is selected from a group consisting of: a well capable of receiving a fluidically assembled micro-element, a transistor, an electric contact, an optical device, a sensor structure, an antenna structure, a photovoltaic structure, a film or coating on the substrate surface, and an electrically conductive trace. 12. A method for forming vias in a substrate, the method comprising:
providing a substrate including at least one deformation at a first surface of the substrate; performing non-via related processing on a selected surface of the substrate; and forming a via in the substrate after performing the non-via related processing such that the via is formed in the substrate at a location selected using the deformation for alignment. 13. The method of claim 12, wherein the selected surface is selected from a group consisting of: the first surface, and a second surface. 14. The method of claim 12, wherein during the forming the via in the substrate, the substrate is secured to a substrate carrier such that the first surface of the substrate is exposed to processing. 15. The method of claim 14, wherein the selected surface of the substrate is a second surface of the substrate; and wherein during the performing non-via related processing on the selected surface of the substrate, the substrate is secured to the substrate carrier such that the second surface of the substrate is exposed to processing. 16. The method of claim 14, wherein the selected surface of the substrate is the first surface of the substrate; and wherein during the performing non-via related processing on the selected surface of the substrate, the substrate is secured to the substrate carrier such that the first surface of the substrate is exposed to processing. 17. The method of claim 12, wherein performing the non-via related processing on the selected surface of the substrate results in a non-via structure on the selected surface of the substrate. 18. The method of claim 17, wherein the non-via structure is selected from a group consisting of: a well capable of receiving a fluidically assembled micro-element, a transistor, an electric contact, an optical device, a sensor structure, an antenna structure, a photovoltaic structure, a film or coating on the substrate surface, and an electrically conductive trace. 19. The method of claim 12, wherein the method further comprises:
performing via pre-definition to yield the at least one deformation at the first surface of the substrate. 20. The method of claim 12, wherein forming the via is done using an etching process. 21. The method of claim 12, wherein a material of the substrate is selected from a group consisting of: glass, ceramic, and a combination of glass and ceramic. 22. (canceled) 23. A method for forming vias in a substrate, the method comprising:
performing a via pre-definition on a substrate wherein at least one deformation is created at the surface of the substrate; forming a non-via structure on the substrate after the via pre-definition; and forming a via in the substrate after forming the non-via structure on the substrate such that the via is formed in the substrate at a location corresponding to the deformation, wherein a ratio of an area of an opening of the via to an area of an opening of the deformation is at least 3:1. 24. The method of claim 1, wherein the substrate is made of a substrate material, and wherein forming the via in the substrate includes displacing a portion of the substrate material. 25. The method of claim 24, wherein displacing the portion of the substrate material includes removing at least some of the portion of the substrate material. 26. The method of claim 12, wherein the substrate is made of a substrate material, and wherein forming the via in the substrate includes displacing a portion of the substrate material. 27. The method of claim 26, wherein displacing the portion of the substrate material includes removing at least some of the portion of the substrate material. | 2,800 |
11,237 | 11,237 | 12,406,232 | 2,862 | In accordance with certain embodiments of the present disclosure, a system for determining risk of loss to a wetland habitat is provided. The system comprises a computer, the computer configured to receive light detection and ranging data about a wetland habitat elevation and calculate the frequency distribution of the wetland habitat elevation based on the light detection and ranging data. The computer is further configured to calculate a skewness statistic based on the frequency distribution of the wetland habitat elevation, the skewness statistic being negative, zero, or positive. The computer is configured to calculate risk of loss to the wetland habitat by utilizing the skewness statistic. | 1. A system for determining risk of loss to a wetland habitat comprising:
a computer, the computer configured to receive light detection and ranging data about a wetland habitat elevation and calculate the frequency distribution of the wetland habitat elevation based on the light detection and ranging data; the computer further configured to calculate a skewness statistic based on the frequency distribution of the wetland habitat elevation, the skewness statistic being negative, zero, or positive; and the computer configured to calculate risk of loss to the wetland habitat by utilizing the skewness statistic. 2. The system of claim 1, wherein the skewness statistic is calculated using the following formula:
skewness
=
∑
i
-
1
N
(
Y
i
-
Y
_
)
3
(
N
-
1
)
s
3
where N is equal to the number of samples of the wetland habitat elevation, Yi are the values of the set of N elevations, Y is the mean of all elevations, and s is the standard deviation. 3. The system of claim 1, wherein a negative skewness statistic indicates a lower risk of loss than a positive skewness statistic. 4. The system of claim 1, wherein the risk of loss is presented graphically. 5. The system of claim 1, wherein the risk of loss is presented through the Internet. 6. The system of claim 1, wherein a positive skewness statistic indicates an unstable wetland habitat. 7. The system of claim 1, wherein a negative skewness statistic indicates a stable wetland habitat. 8. The system of claim 1, wherein the computer receives light detection and ranging data about a wetland habitat elevation through the Internet. 9. The system of claim 1, wherein the computer is connected to a printer configured to stores print the risk of loss to the wetland habitat. 10. A system for determining risk of loss to a wetland habitat comprising:
a computer, the computer configured to receive light detection and ranging data about a wetland habitat elevation and calculate the frequency distribution of the wetland habitat elevation based on the light detection and ranging data; the computer configured to calculate a skewness statistic based on the frequency distribution of the wetland habitat elevation, wherein the skewness statistic is calculated using the following formula:
skewness
=
∑
i
-
1
N
(
Y
i
-
Y
_
)
3
(
N
-
1
)
s
3
where N is equal to the number of samples of the wetland habitat elevation, Yi are the values of the set of N elevations, Y is the mean of all elevations, and s is the standard deviation, the skewness statistic being negative, zero, or positive; and
the computer configured to calculate risk of loss to the wetland habitat by utilizing the skewness statistic. 11. The system of claim 1, wherein the computer is capable of displaying the risk of loss to the wetland habitat. 12. The system of claim 11, wherein the computer is configured to present a map of the wetland habitat. 13. The system of claim 10, wherein a negative skewness statistic indicates a lower risk of loss than a positive skewness statistic. 14. The system of claim 10, wherein the risk of loss is presented graphically. 15. The system of claim 10, wherein the risk of loss is presented through the Internet. 16. The system of claim 10, wherein a positive skewness statistic indicates an unstable wetland habitat. 17. The system of claim 10, wherein a negative skewness statistic indicates a stable wetland habitat. 18. A method for determining risk of loss to a wetland habitat comprising:
calculating a risk of loss to a wetland habitat by utilizing a computer and light detection and ranging data about a wetland habitat elevation, the computer configured to receive the light detection and ranging data and calculate the frequency distribution of the wetland habitat elevation based on the light detection and ranging data, the computer further configured to calculate a skewness statistic based on the frequency distribution of the wetland habitat elevation, the skewness statistic being negative, zero, or positive, and the computer configured to calculate risk of loss to the wetland habitat by utilizing the skewness statistic. 19. The method of claim 18, wherein the skewness statistic is calculated using the following formula:
skewness
=
∑
i
-
1
N
(
Y
i
-
Y
_
)
3
(
N
-
1
)
s
3
where N is equal to the number of samples of the wetland habitat elevation, Yi are the values of the set of N elevations, Y is the mean of all elevations, and s is the standard deviation. 20. The method of claim 18, wherein a negative skewness statistic indicates a lower risk of loss than a positive skewness statistic. | In accordance with certain embodiments of the present disclosure, a system for determining risk of loss to a wetland habitat is provided. The system comprises a computer, the computer configured to receive light detection and ranging data about a wetland habitat elevation and calculate the frequency distribution of the wetland habitat elevation based on the light detection and ranging data. The computer is further configured to calculate a skewness statistic based on the frequency distribution of the wetland habitat elevation, the skewness statistic being negative, zero, or positive. The computer is configured to calculate risk of loss to the wetland habitat by utilizing the skewness statistic.1. A system for determining risk of loss to a wetland habitat comprising:
a computer, the computer configured to receive light detection and ranging data about a wetland habitat elevation and calculate the frequency distribution of the wetland habitat elevation based on the light detection and ranging data; the computer further configured to calculate a skewness statistic based on the frequency distribution of the wetland habitat elevation, the skewness statistic being negative, zero, or positive; and the computer configured to calculate risk of loss to the wetland habitat by utilizing the skewness statistic. 2. The system of claim 1, wherein the skewness statistic is calculated using the following formula:
skewness
=
∑
i
-
1
N
(
Y
i
-
Y
_
)
3
(
N
-
1
)
s
3
where N is equal to the number of samples of the wetland habitat elevation, Yi are the values of the set of N elevations, Y is the mean of all elevations, and s is the standard deviation. 3. The system of claim 1, wherein a negative skewness statistic indicates a lower risk of loss than a positive skewness statistic. 4. The system of claim 1, wherein the risk of loss is presented graphically. 5. The system of claim 1, wherein the risk of loss is presented through the Internet. 6. The system of claim 1, wherein a positive skewness statistic indicates an unstable wetland habitat. 7. The system of claim 1, wherein a negative skewness statistic indicates a stable wetland habitat. 8. The system of claim 1, wherein the computer receives light detection and ranging data about a wetland habitat elevation through the Internet. 9. The system of claim 1, wherein the computer is connected to a printer configured to stores print the risk of loss to the wetland habitat. 10. A system for determining risk of loss to a wetland habitat comprising:
a computer, the computer configured to receive light detection and ranging data about a wetland habitat elevation and calculate the frequency distribution of the wetland habitat elevation based on the light detection and ranging data; the computer configured to calculate a skewness statistic based on the frequency distribution of the wetland habitat elevation, wherein the skewness statistic is calculated using the following formula:
skewness
=
∑
i
-
1
N
(
Y
i
-
Y
_
)
3
(
N
-
1
)
s
3
where N is equal to the number of samples of the wetland habitat elevation, Yi are the values of the set of N elevations, Y is the mean of all elevations, and s is the standard deviation, the skewness statistic being negative, zero, or positive; and
the computer configured to calculate risk of loss to the wetland habitat by utilizing the skewness statistic. 11. The system of claim 1, wherein the computer is capable of displaying the risk of loss to the wetland habitat. 12. The system of claim 11, wherein the computer is configured to present a map of the wetland habitat. 13. The system of claim 10, wherein a negative skewness statistic indicates a lower risk of loss than a positive skewness statistic. 14. The system of claim 10, wherein the risk of loss is presented graphically. 15. The system of claim 10, wherein the risk of loss is presented through the Internet. 16. The system of claim 10, wherein a positive skewness statistic indicates an unstable wetland habitat. 17. The system of claim 10, wherein a negative skewness statistic indicates a stable wetland habitat. 18. A method for determining risk of loss to a wetland habitat comprising:
calculating a risk of loss to a wetland habitat by utilizing a computer and light detection and ranging data about a wetland habitat elevation, the computer configured to receive the light detection and ranging data and calculate the frequency distribution of the wetland habitat elevation based on the light detection and ranging data, the computer further configured to calculate a skewness statistic based on the frequency distribution of the wetland habitat elevation, the skewness statistic being negative, zero, or positive, and the computer configured to calculate risk of loss to the wetland habitat by utilizing the skewness statistic. 19. The method of claim 18, wherein the skewness statistic is calculated using the following formula:
skewness
=
∑
i
-
1
N
(
Y
i
-
Y
_
)
3
(
N
-
1
)
s
3
where N is equal to the number of samples of the wetland habitat elevation, Yi are the values of the set of N elevations, Y is the mean of all elevations, and s is the standard deviation. 20. The method of claim 18, wherein a negative skewness statistic indicates a lower risk of loss than a positive skewness statistic. | 2,800 |
11,238 | 11,238 | 14,701,097 | 2,842 | A shift register capable of preventing leakage current and a display device using the same are disclosed. The shift register includes a plurality of stages. Each stage includes a set unit setting a Q node in response to a start pulse or previous output, an inverter for controlling a QB node to have a logic state opposite to that of the Q node, an output unit for outputting any one input clock or a gate off voltage in response to the logic states of the Q and QB nodes, a reset unit including a reset switching element, the reset switching element resetting the Q node with a first reset voltage in response to a reset pulse or next output, and a noise cleaner resetting the Q node with a second reset voltage in response to the QB node. When the reset switching element is turned off, the first reset voltage is greater than a voltage of the reset pulse or the next output for the current. | 1. A shift register comprising a plurality of stages, the shift register configured to drive gate lines of a display device,
wherein each of the plurality of stages includes: a set unit configured to set a first control node with a set voltage in response to a start pulse or a previous output for a current stage supplied from any one of previous stages; an inverter configured to control a second control node to have a logic state opposite to a logic state of the first control node; an output unit configured to output any one input clock of a plurality of clocks or a gate off voltage in response to the logic states of the first control node and the second control node; a reset unit including a reset switching element, the reset switching element configured to reset the first control node with a first reset voltage in response to a reset pulse or a next output for the current stage supplied from any of next stages; and a noise cleaner configured to reset the first control node with a second reset voltage in response to the second control node, and wherein when the reset switching element is turned off, the first reset voltage is greater than a voltage supplied to a gate of the reset switching element. 2. The shift register according to claim 1, wherein:
the output unit includes a scan output unit including a pull-up switching element configured to output the input clock as a scan output in response to the first control node and a pull-down switching element configured to output a first gate off voltage as the scan output in response to the second control node, or the output unit includes: the scan output unit; and a carry output unit including a carry pull-up switching element configured to output the input clock or any one of carry clocks included in the plurality of clocks as a carry output in response to the first control node and a carry pull-down switching element configured to output a second gate off voltage as the carry output in response to the second control node, and the output unit supplies at least one of the scan output and the carry output as at least one of a previous output for any one of the next stages and a next output for any one of the previous stages, wherein: when the scan output is output as at least one of the previous output for any one of the next stages and the next output for any one of the previous stages, the first gate off voltage is the gate off voltage, and when the carry output is output as at least one of the previous output for any one of the next stages and the next output for any one of the previous stages, the second gate off voltage is the gate off voltage. 3. The shift register according to claim 2, wherein:
the reset unit includes: a first transistor as the reset switching element, a second transistor configured to supply the first reset voltage to the first transistor in response to the reset pulse or the next output for the current stage supplied to the gate of the first transistor; and a third transistor configured to supply an offset voltage to a connection node between the first and second transistors in response to the logic state of the first control node, wherein the first reset voltage is any one of a predetermined voltage, the input clock, the carry clock, the scan output, and the carry output. 4. The shift register according to claim 2, wherein:
the noise cleaner includes: first and second transistors connected between the first control node and the second reset voltage in series to connect the first control node to the second reset voltage in response to the logic state of the second control node; and a third transistor configured to supply an offset voltage to a connection node between the first and second transistors of the noise cleaner in response to the logic state of the first control node, wherein the second reset voltage is any one of a predetermined voltage, the scan output, and the carry output. 5. The shift register according to claim 2, wherein:
the set unit includes: first and second transistors connected to the first control node and the set voltage in series to connect the first control node to the set voltage in response to the logic state of a control terminal; and a third transistor configured to supply an offset voltage to a connection node between the first and second transistors of the set unit in response to the logic state of the first control node, wherein: the control terminal receives any one of the start pulse, a previous carry output for the current stage and a previous scan output for the current stage as the previous output for the current stage, and the set voltage is any one of a predetermined voltage, the previous carry output for the current stage and the previous scan output for the current stage. 6. The shift register according to claim 2, wherein:
the carry pull-down switching element includes: first and second transistors connected between an output terminal of the carry output and the second reset voltage in series to connect the output terminal of the carry output to the second reset voltage in response to the logic state of the second control node; and a third transistor configured to supply an offset voltage to a connection node between the first and second transistors in response to the logic state of the first control node, the second reset voltage is any one of the second gate off voltage, the input clock and the carry clock. 7. The shift register according to claim 2, wherein:
the first gate off voltage is a first predetermined voltage, the first reset voltage is the second predetermined voltage, the second gate off voltage and the second reset voltage are a third predetermined voltage, when the next output has the first predetermined voltage of the scan output, the reset switching element is turned off by the first predetermined voltage being less than the second predetermined voltage and the third predetermined voltage is less than the second predetermined voltage, and when the next output has the third predetermined voltage of the carry output, the reset switching element is turned off by the third predetermined voltage being less than the second predetermined voltage. 8. The shift register according to claim 2, wherein:
the plurality of clocks includes n-phase clocks (n being a natural number of 2 or more), high pulses of which are sequentially phase-shifted and circulated, or the plurality of clocks includes the n-phase clocks and m-phase carry clocks (m being a natural number of 2 or more). 9. The shift register according to claim 1, further comprising a QB reset transistor configured to reset the second control node with a predetermined low side voltage of the inverter in response to the start pulse or the previous output for the current stage. 10. A shift register comprising a plurality of stages, the shift register configured to drive gate lines of a display device,
wherein each of the plurality of stages includes: an output unit configured to output any one input clock of a plurality of clocks or a gate off voltage in response to logic states of a first control node and a second control node; a noise cleaner configured to connect a previous output for a current stage and the first control node in response to a previous clock used in a previous stage as a previous output for the current stage at any one of previous stages; and a controller configured to control the second control node to have a logic state opposite to the logic state of the first control node in some periods, and wherein the noise cleaner includes: first and second transistors connected between the first control node and the previous output for the current stage in series to connect the first control node and the previous output for the current stage in response to a logic state of the previous clock for the current stage, and a third transistor configured to supply an offset voltage to a connection node between the first and second transistors in response to the logic state of the first control node. 11. The shift register according to claim 10, wherein:
the output unit includes a scan output unit including a pull-up switching element configured to output the input clock as a scan output in response to the first control node and a pull-down switching element configured to output a first gate off voltage as the scan output in response to the second control node, or the output unit includes: the scan output unit; and a carry output unit including a carry pull-up switching element configured to output the input clock or any one of carry clocks included in the plurality of clocks as a carry output in response to the first control node and a carry pull-down switching element configured to output a second gate off voltage as the carry output in response to the second control node, and the output unit supplies at least one of the scan output and the carry output as at least one of a previous output for any one of next stages and a next output for any one of the previous stages, wherein: when the scan output is output as at least one of the previous output for any one of the next stages and the next output for any one of the previous stages, the first gate off voltage is the gate off voltage, and when the carry output is output as at least one of the previous output for any one of the next stages and the next output for any one of the previous stages, the second gate off voltage is the gate off voltage and the previous clock for the current stage receives the previous clock used in the previous stage for the current stage. 12. The shift register according to claim 11, further comprising:
a set unit configured to set the first control node with a set voltage in response to a start pulse or the previous output for the current stage; and a reset unit configured to reset the first control node with a reset voltage in response to a reset pulse or a next output for the current stage from any one of the next stages. 13. The shift register according to claim 12, wherein:
the set unit includes: first and second set unit transistors connected between the first control node and the set voltage in series to connect the first control node to the set voltage in response to the logic state of a control terminal; and a third set unit transistor configured to supply a set unit offset voltage to a set unit connection node between the first and second set unit transistors in response to the logic state of the first control node, wherein: the control terminal receives any one of the start pulse, a previous carry output for the current stage and a previous scan output for the current stage as the previous output for the current stage, and the set voltage is any one of a predetermined voltage, the previous carry output for the current stage and the previous scan output for the current stage. 14. The shift register according to claim 12, wherein:
the reset unit includes: first and second reset unit transistors connected between the first control node and the reset voltage to connect the first control node to the reset voltage in response to the reset pulse or a logic state of the next output for the current stage; and a third reset unit transistor configured to supply a reset unit offset voltage to a reset unit connection node between the first and second reset unit transistors in response to the logic state of the first control node, wherein the reset voltage is any one of a predetermined voltage, the input clock, the carry clock, the scan output, and the carry output. 15. The shift register according to claim 10, wherein:
the controller: has a clock which does not overlap the input clock of the output unit among the plurality of clocks, includes a reset transistor configured to reset the second control node to a a first predetermined voltage in response to the first control node and, either a capacitor configured to carry the input clock to the second control node or a set transistor configured to supply the input clock to the second control node in response to a second predetermined voltage. 16. The shift register according to claim 10, wherein the controller includes an inverter configured to control the second control node to have the logic state opposite to the logic state of the first control node, and
the inverter includes: a first inverter unit transistor configured to supply a first predetermined voltage or the previous clock to a connection node in response to the first predetermined voltage or the previous clock; a second inverter unit transistor configured to connect the connection node and the a second predetermined voltage in response to the logic state of the first control node; a third inverter unit transistor configured to supply the first predetermined voltage or the previous clock to the second control node in response to the logic state of the connection node; and a fourth inverter unit transistor configured to connect the second control node and the supply terminal of the second predetermined voltage in response to the logic state of the first control node. 17. The shift register according to claim 10, wherein the plurality of clocks includes k-phase clocks, high pulses of which are sequentially phase-shifted and circulated, and adjacent clocks partially overlap. 18. A display device using the shift register according to claim 8 comprising the plurality of stages respectively connected to a plurality of gate lines of a display panel. 19. A display device using the shift register according to claim 9 comprising the plurality of stages respectively connected to a plurality of gate lines of a display panel. 20. A display device using the shift register according to claim 17 comprising the plurality of stages respectively connected to a plurality of gate lines of a display panel. | A shift register capable of preventing leakage current and a display device using the same are disclosed. The shift register includes a plurality of stages. Each stage includes a set unit setting a Q node in response to a start pulse or previous output, an inverter for controlling a QB node to have a logic state opposite to that of the Q node, an output unit for outputting any one input clock or a gate off voltage in response to the logic states of the Q and QB nodes, a reset unit including a reset switching element, the reset switching element resetting the Q node with a first reset voltage in response to a reset pulse or next output, and a noise cleaner resetting the Q node with a second reset voltage in response to the QB node. When the reset switching element is turned off, the first reset voltage is greater than a voltage of the reset pulse or the next output for the current.1. A shift register comprising a plurality of stages, the shift register configured to drive gate lines of a display device,
wherein each of the plurality of stages includes: a set unit configured to set a first control node with a set voltage in response to a start pulse or a previous output for a current stage supplied from any one of previous stages; an inverter configured to control a second control node to have a logic state opposite to a logic state of the first control node; an output unit configured to output any one input clock of a plurality of clocks or a gate off voltage in response to the logic states of the first control node and the second control node; a reset unit including a reset switching element, the reset switching element configured to reset the first control node with a first reset voltage in response to a reset pulse or a next output for the current stage supplied from any of next stages; and a noise cleaner configured to reset the first control node with a second reset voltage in response to the second control node, and wherein when the reset switching element is turned off, the first reset voltage is greater than a voltage supplied to a gate of the reset switching element. 2. The shift register according to claim 1, wherein:
the output unit includes a scan output unit including a pull-up switching element configured to output the input clock as a scan output in response to the first control node and a pull-down switching element configured to output a first gate off voltage as the scan output in response to the second control node, or the output unit includes: the scan output unit; and a carry output unit including a carry pull-up switching element configured to output the input clock or any one of carry clocks included in the plurality of clocks as a carry output in response to the first control node and a carry pull-down switching element configured to output a second gate off voltage as the carry output in response to the second control node, and the output unit supplies at least one of the scan output and the carry output as at least one of a previous output for any one of the next stages and a next output for any one of the previous stages, wherein: when the scan output is output as at least one of the previous output for any one of the next stages and the next output for any one of the previous stages, the first gate off voltage is the gate off voltage, and when the carry output is output as at least one of the previous output for any one of the next stages and the next output for any one of the previous stages, the second gate off voltage is the gate off voltage. 3. The shift register according to claim 2, wherein:
the reset unit includes: a first transistor as the reset switching element, a second transistor configured to supply the first reset voltage to the first transistor in response to the reset pulse or the next output for the current stage supplied to the gate of the first transistor; and a third transistor configured to supply an offset voltage to a connection node between the first and second transistors in response to the logic state of the first control node, wherein the first reset voltage is any one of a predetermined voltage, the input clock, the carry clock, the scan output, and the carry output. 4. The shift register according to claim 2, wherein:
the noise cleaner includes: first and second transistors connected between the first control node and the second reset voltage in series to connect the first control node to the second reset voltage in response to the logic state of the second control node; and a third transistor configured to supply an offset voltage to a connection node between the first and second transistors of the noise cleaner in response to the logic state of the first control node, wherein the second reset voltage is any one of a predetermined voltage, the scan output, and the carry output. 5. The shift register according to claim 2, wherein:
the set unit includes: first and second transistors connected to the first control node and the set voltage in series to connect the first control node to the set voltage in response to the logic state of a control terminal; and a third transistor configured to supply an offset voltage to a connection node between the first and second transistors of the set unit in response to the logic state of the first control node, wherein: the control terminal receives any one of the start pulse, a previous carry output for the current stage and a previous scan output for the current stage as the previous output for the current stage, and the set voltage is any one of a predetermined voltage, the previous carry output for the current stage and the previous scan output for the current stage. 6. The shift register according to claim 2, wherein:
the carry pull-down switching element includes: first and second transistors connected between an output terminal of the carry output and the second reset voltage in series to connect the output terminal of the carry output to the second reset voltage in response to the logic state of the second control node; and a third transistor configured to supply an offset voltage to a connection node between the first and second transistors in response to the logic state of the first control node, the second reset voltage is any one of the second gate off voltage, the input clock and the carry clock. 7. The shift register according to claim 2, wherein:
the first gate off voltage is a first predetermined voltage, the first reset voltage is the second predetermined voltage, the second gate off voltage and the second reset voltage are a third predetermined voltage, when the next output has the first predetermined voltage of the scan output, the reset switching element is turned off by the first predetermined voltage being less than the second predetermined voltage and the third predetermined voltage is less than the second predetermined voltage, and when the next output has the third predetermined voltage of the carry output, the reset switching element is turned off by the third predetermined voltage being less than the second predetermined voltage. 8. The shift register according to claim 2, wherein:
the plurality of clocks includes n-phase clocks (n being a natural number of 2 or more), high pulses of which are sequentially phase-shifted and circulated, or the plurality of clocks includes the n-phase clocks and m-phase carry clocks (m being a natural number of 2 or more). 9. The shift register according to claim 1, further comprising a QB reset transistor configured to reset the second control node with a predetermined low side voltage of the inverter in response to the start pulse or the previous output for the current stage. 10. A shift register comprising a plurality of stages, the shift register configured to drive gate lines of a display device,
wherein each of the plurality of stages includes: an output unit configured to output any one input clock of a plurality of clocks or a gate off voltage in response to logic states of a first control node and a second control node; a noise cleaner configured to connect a previous output for a current stage and the first control node in response to a previous clock used in a previous stage as a previous output for the current stage at any one of previous stages; and a controller configured to control the second control node to have a logic state opposite to the logic state of the first control node in some periods, and wherein the noise cleaner includes: first and second transistors connected between the first control node and the previous output for the current stage in series to connect the first control node and the previous output for the current stage in response to a logic state of the previous clock for the current stage, and a third transistor configured to supply an offset voltage to a connection node between the first and second transistors in response to the logic state of the first control node. 11. The shift register according to claim 10, wherein:
the output unit includes a scan output unit including a pull-up switching element configured to output the input clock as a scan output in response to the first control node and a pull-down switching element configured to output a first gate off voltage as the scan output in response to the second control node, or the output unit includes: the scan output unit; and a carry output unit including a carry pull-up switching element configured to output the input clock or any one of carry clocks included in the plurality of clocks as a carry output in response to the first control node and a carry pull-down switching element configured to output a second gate off voltage as the carry output in response to the second control node, and the output unit supplies at least one of the scan output and the carry output as at least one of a previous output for any one of next stages and a next output for any one of the previous stages, wherein: when the scan output is output as at least one of the previous output for any one of the next stages and the next output for any one of the previous stages, the first gate off voltage is the gate off voltage, and when the carry output is output as at least one of the previous output for any one of the next stages and the next output for any one of the previous stages, the second gate off voltage is the gate off voltage and the previous clock for the current stage receives the previous clock used in the previous stage for the current stage. 12. The shift register according to claim 11, further comprising:
a set unit configured to set the first control node with a set voltage in response to a start pulse or the previous output for the current stage; and a reset unit configured to reset the first control node with a reset voltage in response to a reset pulse or a next output for the current stage from any one of the next stages. 13. The shift register according to claim 12, wherein:
the set unit includes: first and second set unit transistors connected between the first control node and the set voltage in series to connect the first control node to the set voltage in response to the logic state of a control terminal; and a third set unit transistor configured to supply a set unit offset voltage to a set unit connection node between the first and second set unit transistors in response to the logic state of the first control node, wherein: the control terminal receives any one of the start pulse, a previous carry output for the current stage and a previous scan output for the current stage as the previous output for the current stage, and the set voltage is any one of a predetermined voltage, the previous carry output for the current stage and the previous scan output for the current stage. 14. The shift register according to claim 12, wherein:
the reset unit includes: first and second reset unit transistors connected between the first control node and the reset voltage to connect the first control node to the reset voltage in response to the reset pulse or a logic state of the next output for the current stage; and a third reset unit transistor configured to supply a reset unit offset voltage to a reset unit connection node between the first and second reset unit transistors in response to the logic state of the first control node, wherein the reset voltage is any one of a predetermined voltage, the input clock, the carry clock, the scan output, and the carry output. 15. The shift register according to claim 10, wherein:
the controller: has a clock which does not overlap the input clock of the output unit among the plurality of clocks, includes a reset transistor configured to reset the second control node to a a first predetermined voltage in response to the first control node and, either a capacitor configured to carry the input clock to the second control node or a set transistor configured to supply the input clock to the second control node in response to a second predetermined voltage. 16. The shift register according to claim 10, wherein the controller includes an inverter configured to control the second control node to have the logic state opposite to the logic state of the first control node, and
the inverter includes: a first inverter unit transistor configured to supply a first predetermined voltage or the previous clock to a connection node in response to the first predetermined voltage or the previous clock; a second inverter unit transistor configured to connect the connection node and the a second predetermined voltage in response to the logic state of the first control node; a third inverter unit transistor configured to supply the first predetermined voltage or the previous clock to the second control node in response to the logic state of the connection node; and a fourth inverter unit transistor configured to connect the second control node and the supply terminal of the second predetermined voltage in response to the logic state of the first control node. 17. The shift register according to claim 10, wherein the plurality of clocks includes k-phase clocks, high pulses of which are sequentially phase-shifted and circulated, and adjacent clocks partially overlap. 18. A display device using the shift register according to claim 8 comprising the plurality of stages respectively connected to a plurality of gate lines of a display panel. 19. A display device using the shift register according to claim 9 comprising the plurality of stages respectively connected to a plurality of gate lines of a display panel. 20. A display device using the shift register according to claim 17 comprising the plurality of stages respectively connected to a plurality of gate lines of a display panel. | 2,800 |
11,239 | 11,239 | 15,445,926 | 2,842 | Methods and systems of reducing a substrate noise in a charge pump having a flying capacitor are provided. An input node of the flying capacitor is pre-charged at a first slew rate. The input node of the flying capacitor is charged at a second slew rate that is faster than the first slew rate. The input node of the flying capacitor is pre-discharged at a third slew rate. The input node of the flying capacitor is discharged at a fourth slew rate that is faster than the first slew rate. | 1. A charge pump, comprising:
a flying capacitor coupled between a drive node and an output; a first drive switch coupled between a first supply and the drive node and operative to charge the flying capacitor; a second drive switch coupled between a second supply and the drive node and operative to discharge the flying capacitor; a third switch coupled between the first supply and the drive node and operative to pre-charge the drive node; and a fourth switch coupled between the second supply and the drive node and operative to pre-discharge the drive node, wherein a slew rate of the third switch is slower than a slew rate of the first switch. 2. The charge pump of claim 1, wherein the third switch is configured to be turned ON before the first switch is turned ON. 3. The charge pump of claim 2, wherein the third switch is configured to be kept ON while the first switch is ON. 4. The charge pump of claim 1, wherein the fourth switch is configured to be turned ON before the second switch is turned ON. 5. The charge pump of claim 4, wherein the fourth switch is configured to be kept ON while the second switch is ON. 6. The charge pump of claim 1, further comprising:
a first current source coupled between the first supply and the drive node; and a second current source coupled between the second supply and the fourth switch. 7. (canceled) 8. The charge pump of claim 1, wherein a slew rate of the fourth switch is slower than a slew rate of the second switch. 9. The charge pump of claim 1, wherein a current I1 through the third switch and a current I2 through the second switch is based on:
a parasitic capacitance Cp at the drive node; the first supply VS+; the second supply VS−; and an inverse of a period of the first and second drive switches, wherein,
I 1and I 2≥4×C p(V S+ −V S−)−F osc 10. A method of reducing a substrate noise in a charge pump having a flying capacitor, the method comprising:
pre-charging an input node of the flying capacitor at a first slew rate; charging the input node of the flying capacitor at a second slew rate that is faster than the first slew rate; pre-discharging the input node of the flying capacitor at a third slew rate; and discharging the input node of the flying capacitor at a fourth slew rate that is faster than the first slew rate. 11. The method of claim 10, wherein:
the pre-charging the input node of the flying capacitor is to a first predetermined voltage level; the charging the input node of the flying capacitor is to a second predetermined voltage level that is above the first predetermined voltage level; the pre-discharging the input node of the flying capacitor is to a third predetermined voltage level; and the discharging the input node of the flying capacitor is to a fourth predetermined voltage level that is below the third predetermined voltage level. 12. The method of claim 10, wherein:
the first and third slew rates are substantially similar; and the second and fourth slew rates are substantially similar. 13. The method of claim 10, wherein:
the charging the input node of the flying capacitor comprises turning ON a first switch, thereby creating a path between a first voltage supply and the input node of the flying capacitor; and the discharging the input node of the flying capacitor comprises turning ON a second switch, thereby creating a path between a second voltage supply and the input node of the flying capacitor. 14. The method of claim 13, wherein:
the pre-charging the input node of the flying capacitor comprises turning ON a third switch, thereby creating a path between a first current source and the input node of the flying capacitor; and the pre-discharging the input node of the flying capacitor comprises turning ON a fourth switch, thereby creating a path between a second current source and the input node of the flying capacitor. 15. The method of claim 14, further comprising, for each charge cycle, turning ON the third switch before turning ON the first switch. 16. The method of claim 15, further comprising keeping the third switch ON while the first switch is ON. 17. The method of claim 14, further comprising, for each discharge cycle, turning ON the fourth switch before turning ON the second switch. 18. The method of claim 17, further comprising keeping the fourth switch ON while the second switch is ON. 19. The method of claim 14, wherein a slew rate of the third switch is slower than a slew rate of the first switch. 20. The method of claim 14, wherein a slew rate of the fourth switch is slower than a slew rate of the second switch. | Methods and systems of reducing a substrate noise in a charge pump having a flying capacitor are provided. An input node of the flying capacitor is pre-charged at a first slew rate. The input node of the flying capacitor is charged at a second slew rate that is faster than the first slew rate. The input node of the flying capacitor is pre-discharged at a third slew rate. The input node of the flying capacitor is discharged at a fourth slew rate that is faster than the first slew rate.1. A charge pump, comprising:
a flying capacitor coupled between a drive node and an output; a first drive switch coupled between a first supply and the drive node and operative to charge the flying capacitor; a second drive switch coupled between a second supply and the drive node and operative to discharge the flying capacitor; a third switch coupled between the first supply and the drive node and operative to pre-charge the drive node; and a fourth switch coupled between the second supply and the drive node and operative to pre-discharge the drive node, wherein a slew rate of the third switch is slower than a slew rate of the first switch. 2. The charge pump of claim 1, wherein the third switch is configured to be turned ON before the first switch is turned ON. 3. The charge pump of claim 2, wherein the third switch is configured to be kept ON while the first switch is ON. 4. The charge pump of claim 1, wherein the fourth switch is configured to be turned ON before the second switch is turned ON. 5. The charge pump of claim 4, wherein the fourth switch is configured to be kept ON while the second switch is ON. 6. The charge pump of claim 1, further comprising:
a first current source coupled between the first supply and the drive node; and a second current source coupled between the second supply and the fourth switch. 7. (canceled) 8. The charge pump of claim 1, wherein a slew rate of the fourth switch is slower than a slew rate of the second switch. 9. The charge pump of claim 1, wherein a current I1 through the third switch and a current I2 through the second switch is based on:
a parasitic capacitance Cp at the drive node; the first supply VS+; the second supply VS−; and an inverse of a period of the first and second drive switches, wherein,
I 1and I 2≥4×C p(V S+ −V S−)−F osc 10. A method of reducing a substrate noise in a charge pump having a flying capacitor, the method comprising:
pre-charging an input node of the flying capacitor at a first slew rate; charging the input node of the flying capacitor at a second slew rate that is faster than the first slew rate; pre-discharging the input node of the flying capacitor at a third slew rate; and discharging the input node of the flying capacitor at a fourth slew rate that is faster than the first slew rate. 11. The method of claim 10, wherein:
the pre-charging the input node of the flying capacitor is to a first predetermined voltage level; the charging the input node of the flying capacitor is to a second predetermined voltage level that is above the first predetermined voltage level; the pre-discharging the input node of the flying capacitor is to a third predetermined voltage level; and the discharging the input node of the flying capacitor is to a fourth predetermined voltage level that is below the third predetermined voltage level. 12. The method of claim 10, wherein:
the first and third slew rates are substantially similar; and the second and fourth slew rates are substantially similar. 13. The method of claim 10, wherein:
the charging the input node of the flying capacitor comprises turning ON a first switch, thereby creating a path between a first voltage supply and the input node of the flying capacitor; and the discharging the input node of the flying capacitor comprises turning ON a second switch, thereby creating a path between a second voltage supply and the input node of the flying capacitor. 14. The method of claim 13, wherein:
the pre-charging the input node of the flying capacitor comprises turning ON a third switch, thereby creating a path between a first current source and the input node of the flying capacitor; and the pre-discharging the input node of the flying capacitor comprises turning ON a fourth switch, thereby creating a path between a second current source and the input node of the flying capacitor. 15. The method of claim 14, further comprising, for each charge cycle, turning ON the third switch before turning ON the first switch. 16. The method of claim 15, further comprising keeping the third switch ON while the first switch is ON. 17. The method of claim 14, further comprising, for each discharge cycle, turning ON the fourth switch before turning ON the second switch. 18. The method of claim 17, further comprising keeping the fourth switch ON while the second switch is ON. 19. The method of claim 14, wherein a slew rate of the third switch is slower than a slew rate of the first switch. 20. The method of claim 14, wherein a slew rate of the fourth switch is slower than a slew rate of the second switch. | 2,800 |
11,240 | 11,240 | 15,730,128 | 2,843 | A matching circuit performs output impedance matching for an amplifier that amplifies an input signal and outputs an amplified signal. The matching circuit includes a low pass filter and a high pass filter. The ground of the low pass filter and the ground of the high pass filter are isolated from each other. | 1. A matching circuit that performs output impedance matching for an amplifier, the matching circuit comprising:
a low pass filter; and a high pass filter, wherein a ground of the low pass filter and a ground of the high pass filter are isolated from each other. 2. The matching circuit according to claim 1, further comprising
a parallel resonant circuit, wherein the low pass filter is configured to attenuate a third harmonic component of an amplified signal output from the amplifier, and wherein the parallel resonant circuit is configured to attenuate a second harmonic component of the amplified signal. 3. The matching circuit according to claim 2,
wherein the low pass filter includes an LC series resonant circuit configured to attenuate the third harmonic component of the amplified signal. 4. The matching circuit according to claim 1, further comprising
a parallel resonant circuit, wherein the low pass filter is configured to attenuate a second harmonic component of an amplified signal output from the amplifier, and wherein the parallel resonant circuit is configured to attenuate a third harmonic component of the amplified signal. 5. The matching circuit according to claim 4,
wherein the low pass filter includes an LC series resonant circuit configured to attenuate the second harmonic component of the amplified signal. 6. The matching circuit according to claim 1,
wherein the low pass filter includes:
an inductor connected in series with a signal line of the low pass filter, and
a plurality of capacitors connected in shunt between the ground of the low pass filter and the signal line. 7. The matching circuit according to claim 2,
wherein the low pass filter includes:
an inductor connected in series with a signal line of the low pass filter, and
a plurality of capacitors connected in shunt between the ground of the low pass filter and the signal line. 8. The matching circuit according to claim 4,
wherein the low pass filter includes:
an inductor connected in series with a signal line of the low pass filter, and
a plurality of capacitors connected in shunt between the ground of the low pass filter and the signal line. 9. The matching circuit according to claim 1,
wherein the low pass filter includes:
an inductor connected in series with a signal line of the low pass filter, and
a single capacitor connected in shunt between the ground of the low pass filter and the signal line. 10. The matching circuit according to claim 2,
wherein the low pass filter includes:
an inductor connected in series with a signal line of the low pass filter, and
a single capacitor connected in shunt between the ground of the low pass filter and the signal line. 11. The matching circuit according to claim 4,
wherein the low pass filter includes:
an inductor connected in series with a signal line of the low pass filter, and
a single capacitor connected in shunt between the ground of the low pass filter and the signal line. | A matching circuit performs output impedance matching for an amplifier that amplifies an input signal and outputs an amplified signal. The matching circuit includes a low pass filter and a high pass filter. The ground of the low pass filter and the ground of the high pass filter are isolated from each other.1. A matching circuit that performs output impedance matching for an amplifier, the matching circuit comprising:
a low pass filter; and a high pass filter, wherein a ground of the low pass filter and a ground of the high pass filter are isolated from each other. 2. The matching circuit according to claim 1, further comprising
a parallel resonant circuit, wherein the low pass filter is configured to attenuate a third harmonic component of an amplified signal output from the amplifier, and wherein the parallel resonant circuit is configured to attenuate a second harmonic component of the amplified signal. 3. The matching circuit according to claim 2,
wherein the low pass filter includes an LC series resonant circuit configured to attenuate the third harmonic component of the amplified signal. 4. The matching circuit according to claim 1, further comprising
a parallel resonant circuit, wherein the low pass filter is configured to attenuate a second harmonic component of an amplified signal output from the amplifier, and wherein the parallel resonant circuit is configured to attenuate a third harmonic component of the amplified signal. 5. The matching circuit according to claim 4,
wherein the low pass filter includes an LC series resonant circuit configured to attenuate the second harmonic component of the amplified signal. 6. The matching circuit according to claim 1,
wherein the low pass filter includes:
an inductor connected in series with a signal line of the low pass filter, and
a plurality of capacitors connected in shunt between the ground of the low pass filter and the signal line. 7. The matching circuit according to claim 2,
wherein the low pass filter includes:
an inductor connected in series with a signal line of the low pass filter, and
a plurality of capacitors connected in shunt between the ground of the low pass filter and the signal line. 8. The matching circuit according to claim 4,
wherein the low pass filter includes:
an inductor connected in series with a signal line of the low pass filter, and
a plurality of capacitors connected in shunt between the ground of the low pass filter and the signal line. 9. The matching circuit according to claim 1,
wherein the low pass filter includes:
an inductor connected in series with a signal line of the low pass filter, and
a single capacitor connected in shunt between the ground of the low pass filter and the signal line. 10. The matching circuit according to claim 2,
wherein the low pass filter includes:
an inductor connected in series with a signal line of the low pass filter, and
a single capacitor connected in shunt between the ground of the low pass filter and the signal line. 11. The matching circuit according to claim 4,
wherein the low pass filter includes:
an inductor connected in series with a signal line of the low pass filter, and
a single capacitor connected in shunt between the ground of the low pass filter and the signal line. | 2,800 |
11,241 | 11,241 | 15,468,159 | 2,883 | A high backscattering fiber comprising a perturbed segment in which the perturbed segment reflects a relative power that is more than three (3) decibels (dB) above Rayleigh scattering. The high backscattering fiber also exhibits a coupling loss of less than 0.5 dB. | 1. A high backscattering fiber, comprising:
a coupling loss of less than 0.5 decibels (dB) when coupled to a transmission fiber; and a perturbed segment comprising an index perturbation (Δn(x, y, z)) that causes reflection of relative power (Rp→r(λ, z, l)) that is greater than three (3) dB above Rayleigh scattering. 2. The fiber of claim 1, wherein:
R
p
→
r
(
λ
,
z
,
l
)
≈
1
l
μ
p
,
r
2
π
λ
∫
z
-
1
2
z
+
1
2
Δ
n
z
(
z
′
)
e
i2
π
z′
n
eff
,
p
+
n
eff
,
r
λ
dz
′
2
,
l represents an integration length;
neff,p represents an effective index corresponding to p;
neff,r represents an effective index corresponding to r;
μp,r represents a modal overlap coefficient such that:
μ
p
,
r
:
=
∫
∫
-
∞
∞
E
p
(
x
,
y
)
Δ
n
x
,
y
(
x
,
y
)
E
r
⋆
(
x
,
y
)
dxdy
∫
∫
-
∞
∞
E
p
(
x
,
y
)
2
dxdy
∫
∫
-
∞
∞
E
r
(
x
,
y
)
2
dxdy
,
wherein:
Ep(x,y) represents eigenmodes of p;
Er(x,y) represents eigenmodes of r; and
Er*(x,y) represents the conjugate transpose of Er(x,y). 3. The fiber of claim 1, wherein Rp→r(λ, z, l) is greater than 10 dB above Rayleigh scattering for wavelengths (λ) of:
1542.5 nm≦λ≦1557.5 nm 4. The fiber of claim 1 further comprising an optical pump, the optical pump having a wavelength outside of the range of wavelengths for which relative power is greater than 3 dB above Rayleigh scattering. 5. The fiber of claim 1, wherein:
n (total)(x,y,z)=n x,y(x,y)+Δn (total)(x,y,z),
wherein; nx,y(x,y) represents an unperturbed refractive index;
Δn (total)(x,y,z)=Δn (Rayleigh)(x,y,z)+Δn(x,y,z);
Δn(x, y, z) represents a transverse dependence of the index perturbation; and Δnz(z) represents a longitudinal dependence of the index perturbation. 6. The fiber of claim 5, wherein:
Δn(x,y,z)≧2·10−7; and
the sensor has a total sensor length that exceeds 119.5 centimeters (cm). 7. The fiber of claim 5, wherein:
Δn(x,y,z)≧2·10−7; and
Rp→r(λ, z, l)≧−80 dB/mm in a wavelength (λ) range of 1550±7.5 nanometers (nm),
wherein:
l=1 millimeter (mm). 8. The fiber of claim 5, wherein:
Δn(x,y,z)≧2·10−6;
l≈0.3 millimeters (mm) Rp→r(λ, z, l)≧−60 dB·(1/mm) in a wavelength (λ) range of 1550±7.5 nanometers (nm). 9. The fiber of claim 5, wherein:
Δn(x,y,z)≧2·10−7. | A high backscattering fiber comprising a perturbed segment in which the perturbed segment reflects a relative power that is more than three (3) decibels (dB) above Rayleigh scattering. The high backscattering fiber also exhibits a coupling loss of less than 0.5 dB.1. A high backscattering fiber, comprising:
a coupling loss of less than 0.5 decibels (dB) when coupled to a transmission fiber; and a perturbed segment comprising an index perturbation (Δn(x, y, z)) that causes reflection of relative power (Rp→r(λ, z, l)) that is greater than three (3) dB above Rayleigh scattering. 2. The fiber of claim 1, wherein:
R
p
→
r
(
λ
,
z
,
l
)
≈
1
l
μ
p
,
r
2
π
λ
∫
z
-
1
2
z
+
1
2
Δ
n
z
(
z
′
)
e
i2
π
z′
n
eff
,
p
+
n
eff
,
r
λ
dz
′
2
,
l represents an integration length;
neff,p represents an effective index corresponding to p;
neff,r represents an effective index corresponding to r;
μp,r represents a modal overlap coefficient such that:
μ
p
,
r
:
=
∫
∫
-
∞
∞
E
p
(
x
,
y
)
Δ
n
x
,
y
(
x
,
y
)
E
r
⋆
(
x
,
y
)
dxdy
∫
∫
-
∞
∞
E
p
(
x
,
y
)
2
dxdy
∫
∫
-
∞
∞
E
r
(
x
,
y
)
2
dxdy
,
wherein:
Ep(x,y) represents eigenmodes of p;
Er(x,y) represents eigenmodes of r; and
Er*(x,y) represents the conjugate transpose of Er(x,y). 3. The fiber of claim 1, wherein Rp→r(λ, z, l) is greater than 10 dB above Rayleigh scattering for wavelengths (λ) of:
1542.5 nm≦λ≦1557.5 nm 4. The fiber of claim 1 further comprising an optical pump, the optical pump having a wavelength outside of the range of wavelengths for which relative power is greater than 3 dB above Rayleigh scattering. 5. The fiber of claim 1, wherein:
n (total)(x,y,z)=n x,y(x,y)+Δn (total)(x,y,z),
wherein; nx,y(x,y) represents an unperturbed refractive index;
Δn (total)(x,y,z)=Δn (Rayleigh)(x,y,z)+Δn(x,y,z);
Δn(x, y, z) represents a transverse dependence of the index perturbation; and Δnz(z) represents a longitudinal dependence of the index perturbation. 6. The fiber of claim 5, wherein:
Δn(x,y,z)≧2·10−7; and
the sensor has a total sensor length that exceeds 119.5 centimeters (cm). 7. The fiber of claim 5, wherein:
Δn(x,y,z)≧2·10−7; and
Rp→r(λ, z, l)≧−80 dB/mm in a wavelength (λ) range of 1550±7.5 nanometers (nm),
wherein:
l=1 millimeter (mm). 8. The fiber of claim 5, wherein:
Δn(x,y,z)≧2·10−6;
l≈0.3 millimeters (mm) Rp→r(λ, z, l)≧−60 dB·(1/mm) in a wavelength (λ) range of 1550±7.5 nanometers (nm). 9. The fiber of claim 5, wherein:
Δn(x,y,z)≧2·10−7. | 2,800 |
11,242 | 11,242 | 14,059,532 | 2,845 | An extendable and reconfigurable antenna apparatus includes at least one conductive monopole antenna element. An extended antenna element is provided including a junction. A conductive tube is mechanically coupled to the extended antenna element by an insulating coupler to form an assembly. Placement of the assembly over the monopole antenna element converts the monopole antenna element into a center conductor of a coaxial transmission line electrically coupled to the extended antenna element at the junction. | 1. An extendable and reconfigurable antenna apparatus, comprising:
at least one conductive monopole antenna element; an extended antenna element including a junction; an insulating coupler; and a conductive tube mechanically coupled to the extended antenna element by the insulating coupler to form an assembly, wherein placement of the assembly over the monopole antenna element converts the monopole antenna element into a center conductor of a coaxial transmission line electrically coupled to the extended antenna element at the junction. 2. The apparatus of claim 1, wherein the junction of the extended antenna element is configured to mechanically clasp and electrically connect to the monopole antenna element, wherein the junction serves as an electrical feed point of the extended antenna element. 3. The apparatus of claim 1, wherein the conductive tube is integral with a ground plane of a module, the ground plane defining an external fascia of an interchangeable module. 4. The apparatus of claim 1, wherein the monopole antenna element is mechanically coupled to a first fascia of a communication device, and wherein the conductive tube is configured to abut the first fascia upon placement of the assembly. 5. The apparatus of claim 1, wherein the extended antenna element is a monopole element. 6. The apparatus of claim 1, wherein the extended antenna element is a dipole element. 7. The apparatus of claim 1, wherein the extended antenna element is a loop antenna. 8. The apparatus of claim 1, wherein the extended antenna element is a slot antenna. 9. The apparatus of claim 1, wherein the monopole antenna element has the same impedance match as the extended antenna element upon placement of the assembly. 10. The apparatus of claim 1, wherein the extended antenna element provides a different polarization than the monopole antenna element. 11. The apparatus of claim 1, wherein the extended antenna element has the same operating frequency as the monopole antenna element. 12. A communication device including a modular extendable and reconfigurable antenna apparatus, the apparatus of the communication device comprising:
at least one conductive monopole antenna element; an extended antenna element including a junction; an insulating coupler; and a conductive tube mechanically coupled to the extended antenna element by the insulating coupler to form an assembly, wherein placement of the assembly over the monopole antenna element converts the monopole antenna element into a center conductor of a coaxial transmission line electrically coupled to the extended antenna element at the junction. 13. The device of claim 12, wherein the conductive tube is integral with an external fascia of a module that is interchangeable with the communication device. | An extendable and reconfigurable antenna apparatus includes at least one conductive monopole antenna element. An extended antenna element is provided including a junction. A conductive tube is mechanically coupled to the extended antenna element by an insulating coupler to form an assembly. Placement of the assembly over the monopole antenna element converts the monopole antenna element into a center conductor of a coaxial transmission line electrically coupled to the extended antenna element at the junction.1. An extendable and reconfigurable antenna apparatus, comprising:
at least one conductive monopole antenna element; an extended antenna element including a junction; an insulating coupler; and a conductive tube mechanically coupled to the extended antenna element by the insulating coupler to form an assembly, wherein placement of the assembly over the monopole antenna element converts the monopole antenna element into a center conductor of a coaxial transmission line electrically coupled to the extended antenna element at the junction. 2. The apparatus of claim 1, wherein the junction of the extended antenna element is configured to mechanically clasp and electrically connect to the monopole antenna element, wherein the junction serves as an electrical feed point of the extended antenna element. 3. The apparatus of claim 1, wherein the conductive tube is integral with a ground plane of a module, the ground plane defining an external fascia of an interchangeable module. 4. The apparatus of claim 1, wherein the monopole antenna element is mechanically coupled to a first fascia of a communication device, and wherein the conductive tube is configured to abut the first fascia upon placement of the assembly. 5. The apparatus of claim 1, wherein the extended antenna element is a monopole element. 6. The apparatus of claim 1, wherein the extended antenna element is a dipole element. 7. The apparatus of claim 1, wherein the extended antenna element is a loop antenna. 8. The apparatus of claim 1, wherein the extended antenna element is a slot antenna. 9. The apparatus of claim 1, wherein the monopole antenna element has the same impedance match as the extended antenna element upon placement of the assembly. 10. The apparatus of claim 1, wherein the extended antenna element provides a different polarization than the monopole antenna element. 11. The apparatus of claim 1, wherein the extended antenna element has the same operating frequency as the monopole antenna element. 12. A communication device including a modular extendable and reconfigurable antenna apparatus, the apparatus of the communication device comprising:
at least one conductive monopole antenna element; an extended antenna element including a junction; an insulating coupler; and a conductive tube mechanically coupled to the extended antenna element by the insulating coupler to form an assembly, wherein placement of the assembly over the monopole antenna element converts the monopole antenna element into a center conductor of a coaxial transmission line electrically coupled to the extended antenna element at the junction. 13. The device of claim 12, wherein the conductive tube is integral with an external fascia of a module that is interchangeable with the communication device. | 2,800 |
11,243 | 11,243 | 13,940,170 | 2,834 | The present invention relates to a heat-sink base provided with heat-sink fin portions, it manufacturing method and a motor provided with the heat-sink base. The base is produced by pouring cast metal into a mold cavity to replace a pattern having a predetermined sublimation temperature. The base includes a preformed heat-sink member comprising a plurality of heat-sink fin portions and at least one anchor portion embedded at least partially in the pattern, and a base body comprising an enclosed base portion and a holder portion for receiving and holding the at least one anchor portion. By virtue of the invented method, the heat-sink member having an extremely thin thickness can be mounted on the base body and the overall surface area of the heat-sink base is increased considerably. | 1. A heat-sink base provided with heat-sink fin portions, produced by pouring cast metal into a mold cavity to replace a pattern having a predetermined sublimation temperature, the heat-sink base comprising:
a preformed heat-sink member, comprising a plurality of heat-sink fin portions and at least one anchor portion which has been once embedded at least partially in the pattern; and a base body, comprising an enclosed base portion and a holder portion for receiving and holding the at least one anchor portion. 2. The heat-sink base according to claim 1, wherein the preformed heat-sink member comprises a plurality of heat-sink plates, each comprising the anchor portion, the heat-sink fin portion and a closing-up portion, and wherein everyone of the heat-sink plates is brought in contact with an adjacent one of the heat-sink plates to constitute a closed ventilation channel by virtue of their anchor portions, heat-sink fin portions and closing-up portions. 3. The heat-sink base according to claim 1, wherein everyone of the anchor portions is engaged with an adjacent one of the anchor portions and everyone of the closing-up portions is engaged with an adjacent one of the closing-up portions, with the heat-sink portions being left disengaged. 4. A method for producing a heat-sink base provided with heat-sink fin portions, wherein the heat-sink base comprises a preformed heat-sink member and a base body, and the heat-sink member comprises at least one anchor portion, the method comprising the steps of:
a) placing a pattern having a predetermined sublimation temperature and inserted with the at least one anchor portion into a chamber, wherein the preformed heat-sink member has a predetermined melting point; b) filling the chamber with molding sand having a phase transformation temperature higher than the sublimation temperature of the pattern, thereby defining a space occupied by the pattern and the heat-sink member; c) melting a base material to its molten state, wherein the base material has a melting point higher than the predetermined sublimation temperature of the pattern and lower than the phase transformation temperature of the molding sand; d) pouring the molten base material into the space to make the pattern sublimated; and e) cooling the base material to a temperature below its melting point, so that the pattern is replaced by the base material to produce the base body inserted with the at least one anchor portion of the heat-sink member. 5. The method according to claim 4, wherein the step a) further comprises the sub-steps of:
a1) inserting the at least one anchor portion of the heat-sink member into the pattern; and a2) placing the pattern inserted with the at least one anchor portion of the heat-sink member into the chamber. 6. The method according to claim 4, further comprising, prior to the step a), a step a3) of placing the heat-sink member into a mold having a mold cavity complementary to the pattern and the heat-sink member, and forming the pattern having the predetermined sublimation temperature in the mold cavity by foam molding. 7. The method according to claim 4, further comprising, subsequent to the step e), a step f) of removing the molding sand. 8. A heat-sink base provided with heat-sink fin portions, which is produced by the method according to claim 4 and comprises the preformed heat-sink member and the base body according to claim 4. 9. A motor provided with a heat-sink base, comprising a rotor, a stator and a motor housing that encloses and is thermally connected to the rotor and/or the stator, the motor being characterized in that:
the motor housing is a heat-sink base provided with heat-sink fin portions, wherein the heat-sink base is produced by pouring cast metal into a mold cavity to replace a pattern having a predetermined sublimation temperature and the heat-sink base comprises: a preformed heat-sink member, comprising a plurality of heat-sink fin portions and at least one anchor portion which has been once embedded at least partially in the pattern; and a base body, comprising an enclosed base portion and a holder portion for receiving and holding the at least one anchor portion. | The present invention relates to a heat-sink base provided with heat-sink fin portions, it manufacturing method and a motor provided with the heat-sink base. The base is produced by pouring cast metal into a mold cavity to replace a pattern having a predetermined sublimation temperature. The base includes a preformed heat-sink member comprising a plurality of heat-sink fin portions and at least one anchor portion embedded at least partially in the pattern, and a base body comprising an enclosed base portion and a holder portion for receiving and holding the at least one anchor portion. By virtue of the invented method, the heat-sink member having an extremely thin thickness can be mounted on the base body and the overall surface area of the heat-sink base is increased considerably.1. A heat-sink base provided with heat-sink fin portions, produced by pouring cast metal into a mold cavity to replace a pattern having a predetermined sublimation temperature, the heat-sink base comprising:
a preformed heat-sink member, comprising a plurality of heat-sink fin portions and at least one anchor portion which has been once embedded at least partially in the pattern; and a base body, comprising an enclosed base portion and a holder portion for receiving and holding the at least one anchor portion. 2. The heat-sink base according to claim 1, wherein the preformed heat-sink member comprises a plurality of heat-sink plates, each comprising the anchor portion, the heat-sink fin portion and a closing-up portion, and wherein everyone of the heat-sink plates is brought in contact with an adjacent one of the heat-sink plates to constitute a closed ventilation channel by virtue of their anchor portions, heat-sink fin portions and closing-up portions. 3. The heat-sink base according to claim 1, wherein everyone of the anchor portions is engaged with an adjacent one of the anchor portions and everyone of the closing-up portions is engaged with an adjacent one of the closing-up portions, with the heat-sink portions being left disengaged. 4. A method for producing a heat-sink base provided with heat-sink fin portions, wherein the heat-sink base comprises a preformed heat-sink member and a base body, and the heat-sink member comprises at least one anchor portion, the method comprising the steps of:
a) placing a pattern having a predetermined sublimation temperature and inserted with the at least one anchor portion into a chamber, wherein the preformed heat-sink member has a predetermined melting point; b) filling the chamber with molding sand having a phase transformation temperature higher than the sublimation temperature of the pattern, thereby defining a space occupied by the pattern and the heat-sink member; c) melting a base material to its molten state, wherein the base material has a melting point higher than the predetermined sublimation temperature of the pattern and lower than the phase transformation temperature of the molding sand; d) pouring the molten base material into the space to make the pattern sublimated; and e) cooling the base material to a temperature below its melting point, so that the pattern is replaced by the base material to produce the base body inserted with the at least one anchor portion of the heat-sink member. 5. The method according to claim 4, wherein the step a) further comprises the sub-steps of:
a1) inserting the at least one anchor portion of the heat-sink member into the pattern; and a2) placing the pattern inserted with the at least one anchor portion of the heat-sink member into the chamber. 6. The method according to claim 4, further comprising, prior to the step a), a step a3) of placing the heat-sink member into a mold having a mold cavity complementary to the pattern and the heat-sink member, and forming the pattern having the predetermined sublimation temperature in the mold cavity by foam molding. 7. The method according to claim 4, further comprising, subsequent to the step e), a step f) of removing the molding sand. 8. A heat-sink base provided with heat-sink fin portions, which is produced by the method according to claim 4 and comprises the preformed heat-sink member and the base body according to claim 4. 9. A motor provided with a heat-sink base, comprising a rotor, a stator and a motor housing that encloses and is thermally connected to the rotor and/or the stator, the motor being characterized in that:
the motor housing is a heat-sink base provided with heat-sink fin portions, wherein the heat-sink base is produced by pouring cast metal into a mold cavity to replace a pattern having a predetermined sublimation temperature and the heat-sink base comprises: a preformed heat-sink member, comprising a plurality of heat-sink fin portions and at least one anchor portion which has been once embedded at least partially in the pattern; and a base body, comprising an enclosed base portion and a holder portion for receiving and holding the at least one anchor portion. | 2,800 |
11,244 | 11,244 | 14,570,062 | 2,898 | A half-bridge circuit includes a low-side transistor and a high-side transistor each having a load path and a control terminal, and a high-side drive circuit having a level shifter with a level shifter transistor. The low-side transistor and the level shifter transistor are integrated in a common semiconductor body. | 1. A half-bridge circuit, comprising:
a low-side transistor and a high-side transistor each comprising a load path and a control terminal; a high-side drive circuit comprising a level shifter with a level shifter transistor; and wherein the low-side transistor and the level shifter transistor are integrated in a common semiconductor body. 2. The half-bridge circuit of claim 1,
wherein the low side transistor is arranged in a first device region of the semiconductor body and comprises at least one source region, a drain region, and at least one body region, at least one drift region of a first doping type and at least one compensation region of a second doping complementary to the first doping type, and a gate electrode arranged adjacent to the at least one body region and dielectrically insulated from the body region by a gate dielectric; and wherein the level-shifter transistor is arranged in a second device region of the semiconductor body, the second device region comprising a well-like structure of the second doping type surrounding a first semiconductor region of the first doping type, the further semiconductor device comprising device regions arranged in first semiconductor region. 3. The half-bridge circuit of claim 1, further comprising a diode integrated in the common semiconductor body. 4. The half-bridge circuit of claim 2, further comprising in the semiconductor body a second semiconductor region of the first doping type having a higher doping concentration than the first semiconductor region and arranged between the well-like structure and the first semiconductor region. 5. The half-bridge circuit of claim 2, wherein the well-like structure comprises a bottom section and sidewall sections, and wherein the second semiconductor region is only arranged between the bottom section of the well-like structure and the first semiconductor region. 6. The half-bridge circuit of claim 2, wherein the second device region is arranged distant to the first device region in a lateral direction of the semiconductor body. 7. The half-bridge circuit of claim 6, wherein an edge region is arranged between the first device region and the second device region, the edge region comprising a plurality of first edge regions of the first doping type extending in a vertical direction of the semiconductor body, and a plurality of second edge regions of the second doping type extending in a vertical direction of the semiconductor body, each first edge region adjoining at least one second edge region. 8. The half-bridge circuit of claim 2, wherein the semiconductor body comprises a first surface, and wherein the well-like structure extends to the first surface and comprises in the region of the first surface a section doped higher than remaining sections of the well-like structure. 9. The half-bridge circuit of claim 2, wherein the low-side transistor comprises a plurality of transistors cells each comprising a source region, a body region, a drift region and a compensation region and having the drain region in common. 10. The half-bridge circuit of claim 2, wherein the semiconductor body further comprises:
a first semiconductor layer forming the drain region; and a second semiconductor layer arranged above the first semiconductor layer, the second semiconductor layer comprising the second device region and the at least one drift region, the at least one compensation region, the at least one source region and the at least one body region of the power transistor. 11. The half-bridge circuit of claim 2, wherein the level-shifter transistor is implemented as a lateral high voltage transistor. 12. The half-bridge circuit of claim 11, wherein the lateral high-voltage transistor comprises:
a further source region and a further drain region arranged in the first semiconductor region and distant in a lateral direction of the semiconductor body; at least one further drift region and a further body region, wherein the further body region is arranged between the further source region and the at least one further drift region, and the at least one further drift region is arranged between the further body region and the further drain region; and a further gate electrode arranged adjacent to the further body region and dielectrically insulated from the further body region by a further gate dielectric. 13. The half-bridge circuit of claim 12, wherein a part of the first semiconductor region forms the at least one further drift region. 14. The half-bridge circuit of claim 12, wherein the lateral high voltage transistor further comprises at least one compensation region of a doping type complementary to the doping type of the at least one drift region and adjoining the at least one drift region. 15. The half-bridge circuit of claim 14, wherein the at least one compensation region of the lateral high voltage transistor is connected to the further body region or the further source region. 16. The half-bridge circuit of claim 14, wherein the at least one further drift region is of the same doping type as the first semiconductor region and has a higher doping concentration. 17. The half-bridge circuit of claim 14, wherein the further device region is arranged between the first device region and an edge of the semiconductor body, wherein the further drain region is arranged closer to the edge of the semiconductor body than the further source region. | A half-bridge circuit includes a low-side transistor and a high-side transistor each having a load path and a control terminal, and a high-side drive circuit having a level shifter with a level shifter transistor. The low-side transistor and the level shifter transistor are integrated in a common semiconductor body.1. A half-bridge circuit, comprising:
a low-side transistor and a high-side transistor each comprising a load path and a control terminal; a high-side drive circuit comprising a level shifter with a level shifter transistor; and wherein the low-side transistor and the level shifter transistor are integrated in a common semiconductor body. 2. The half-bridge circuit of claim 1,
wherein the low side transistor is arranged in a first device region of the semiconductor body and comprises at least one source region, a drain region, and at least one body region, at least one drift region of a first doping type and at least one compensation region of a second doping complementary to the first doping type, and a gate electrode arranged adjacent to the at least one body region and dielectrically insulated from the body region by a gate dielectric; and wherein the level-shifter transistor is arranged in a second device region of the semiconductor body, the second device region comprising a well-like structure of the second doping type surrounding a first semiconductor region of the first doping type, the further semiconductor device comprising device regions arranged in first semiconductor region. 3. The half-bridge circuit of claim 1, further comprising a diode integrated in the common semiconductor body. 4. The half-bridge circuit of claim 2, further comprising in the semiconductor body a second semiconductor region of the first doping type having a higher doping concentration than the first semiconductor region and arranged between the well-like structure and the first semiconductor region. 5. The half-bridge circuit of claim 2, wherein the well-like structure comprises a bottom section and sidewall sections, and wherein the second semiconductor region is only arranged between the bottom section of the well-like structure and the first semiconductor region. 6. The half-bridge circuit of claim 2, wherein the second device region is arranged distant to the first device region in a lateral direction of the semiconductor body. 7. The half-bridge circuit of claim 6, wherein an edge region is arranged between the first device region and the second device region, the edge region comprising a plurality of first edge regions of the first doping type extending in a vertical direction of the semiconductor body, and a plurality of second edge regions of the second doping type extending in a vertical direction of the semiconductor body, each first edge region adjoining at least one second edge region. 8. The half-bridge circuit of claim 2, wherein the semiconductor body comprises a first surface, and wherein the well-like structure extends to the first surface and comprises in the region of the first surface a section doped higher than remaining sections of the well-like structure. 9. The half-bridge circuit of claim 2, wherein the low-side transistor comprises a plurality of transistors cells each comprising a source region, a body region, a drift region and a compensation region and having the drain region in common. 10. The half-bridge circuit of claim 2, wherein the semiconductor body further comprises:
a first semiconductor layer forming the drain region; and a second semiconductor layer arranged above the first semiconductor layer, the second semiconductor layer comprising the second device region and the at least one drift region, the at least one compensation region, the at least one source region and the at least one body region of the power transistor. 11. The half-bridge circuit of claim 2, wherein the level-shifter transistor is implemented as a lateral high voltage transistor. 12. The half-bridge circuit of claim 11, wherein the lateral high-voltage transistor comprises:
a further source region and a further drain region arranged in the first semiconductor region and distant in a lateral direction of the semiconductor body; at least one further drift region and a further body region, wherein the further body region is arranged between the further source region and the at least one further drift region, and the at least one further drift region is arranged between the further body region and the further drain region; and a further gate electrode arranged adjacent to the further body region and dielectrically insulated from the further body region by a further gate dielectric. 13. The half-bridge circuit of claim 12, wherein a part of the first semiconductor region forms the at least one further drift region. 14. The half-bridge circuit of claim 12, wherein the lateral high voltage transistor further comprises at least one compensation region of a doping type complementary to the doping type of the at least one drift region and adjoining the at least one drift region. 15. The half-bridge circuit of claim 14, wherein the at least one compensation region of the lateral high voltage transistor is connected to the further body region or the further source region. 16. The half-bridge circuit of claim 14, wherein the at least one further drift region is of the same doping type as the first semiconductor region and has a higher doping concentration. 17. The half-bridge circuit of claim 14, wherein the further device region is arranged between the first device region and an edge of the semiconductor body, wherein the further drain region is arranged closer to the edge of the semiconductor body than the further source region. | 2,800 |
11,245 | 11,245 | 15,537,299 | 2,816 | The invention provides a lighting device configured to provide white lighting device light, the lighting device comprising (i) a light source, configured to provide blue light source light, and (ii) a luminescent material element, configured to absorb at least part of the blue light source light and to convert into luminescent material light, wherein the luminescent material element comprises a luminescent material which consists for at least 80 wt. % of a M 2-2x Eu 2x Si 5-y Al y O y N 8-y phosphor, wherein M comprises one or more of Mg, Ca, Sr, Ba, with a molar ratio of (Mg+Ca+Sr)/(Ba)≦0.1, wherein x is in the range of 0.001-0.02, wherein y is in the range of ≦0.2, and wherein the white lighting device light comprises said blue light source light and said luminescent material light. | 1. A lighting device configured to provide white lighting device light the lighting device comprising (i) a light source configured to provide blue light source light, and (ii) a luminescent material element, configured to absorb at least part of the blue light source light and to convert into luminescent material light with a peak emission wavelength in the range of 570-580 nm, wherein the luminescent material element comprises a luminescent material which consists for at least 80 wt. % of a M2-2xEu2xSi5-yAlyOyN8-y phosphor, wherein M comprises one or more of Mg, Ca, Sr, Ba, with a molar ratio of (Mg+Ca+Sr)/(Ba)≦0.1, wherein x is in the range of 0.001-0.01, wherein y is in the range of ≦0.2, wherein an emission of the M2-2xEu2xSi5-yAlyOyN8-y phosphor has a full width half maximum (FWHM) of 2200 cm−1 or less, and wherein the white lighting device light comprises said blue light source light and said luminescent material light. 2. The lighting device according to claim 1, wherein (Mg+Ca+Sr)/(Ba)≦0.05. 3. The lighting device according to claim 1, wherein (Mg+Ca+Sr)/(Ba)≦0.01. 4. The lighting device according to claim 1, wherein y is in the range of ≦0.02. 5. The lighting device according to claim 1, wherein the light source comprises a solid state light source with a light emitting surface. 6. The lighting device according to claim 5, wherein the light source is configured to provide having a dominant wavelength in the range of 435-470 nm. 7. The lighting device according to claim 5, wherein the light source is configured to provide having a dominant wavelength in the range of 445-460 nm. 8. The lighting device according to claim 5, wherein the luminescent material element is in physical contact with the light emitting surface of the solid state light source. 9. The lighting device according to claim 1, wherein the luminescent material element comprises a transparent material with the luminescent material embedded therein. 10. The lighting device according to claim 1, wherein the luminescent material element comprises a silicone matrix with the luminescent material embedded therein. 11. The lighting device according to claim 1, wherein the luminescent material comprises for less than 20 wt. % of a second phosphor selected from the group of cerium comprising garnet materials. 12. The lighting device according to claim 1, wherein the phosphor is obtainable by heating of a mixture of Eu2Si5N8, BaH2 and Si3N4 at a temperature in the range of 1550-1800° C. under a neutral or reducing atmosphere. 13. Use of the lighting device according to claim 1, in a decorative lighting application or a signal lighting application. | The invention provides a lighting device configured to provide white lighting device light, the lighting device comprising (i) a light source, configured to provide blue light source light, and (ii) a luminescent material element, configured to absorb at least part of the blue light source light and to convert into luminescent material light, wherein the luminescent material element comprises a luminescent material which consists for at least 80 wt. % of a M 2-2x Eu 2x Si 5-y Al y O y N 8-y phosphor, wherein M comprises one or more of Mg, Ca, Sr, Ba, with a molar ratio of (Mg+Ca+Sr)/(Ba)≦0.1, wherein x is in the range of 0.001-0.02, wherein y is in the range of ≦0.2, and wherein the white lighting device light comprises said blue light source light and said luminescent material light.1. A lighting device configured to provide white lighting device light the lighting device comprising (i) a light source configured to provide blue light source light, and (ii) a luminescent material element, configured to absorb at least part of the blue light source light and to convert into luminescent material light with a peak emission wavelength in the range of 570-580 nm, wherein the luminescent material element comprises a luminescent material which consists for at least 80 wt. % of a M2-2xEu2xSi5-yAlyOyN8-y phosphor, wherein M comprises one or more of Mg, Ca, Sr, Ba, with a molar ratio of (Mg+Ca+Sr)/(Ba)≦0.1, wherein x is in the range of 0.001-0.01, wherein y is in the range of ≦0.2, wherein an emission of the M2-2xEu2xSi5-yAlyOyN8-y phosphor has a full width half maximum (FWHM) of 2200 cm−1 or less, and wherein the white lighting device light comprises said blue light source light and said luminescent material light. 2. The lighting device according to claim 1, wherein (Mg+Ca+Sr)/(Ba)≦0.05. 3. The lighting device according to claim 1, wherein (Mg+Ca+Sr)/(Ba)≦0.01. 4. The lighting device according to claim 1, wherein y is in the range of ≦0.02. 5. The lighting device according to claim 1, wherein the light source comprises a solid state light source with a light emitting surface. 6. The lighting device according to claim 5, wherein the light source is configured to provide having a dominant wavelength in the range of 435-470 nm. 7. The lighting device according to claim 5, wherein the light source is configured to provide having a dominant wavelength in the range of 445-460 nm. 8. The lighting device according to claim 5, wherein the luminescent material element is in physical contact with the light emitting surface of the solid state light source. 9. The lighting device according to claim 1, wherein the luminescent material element comprises a transparent material with the luminescent material embedded therein. 10. The lighting device according to claim 1, wherein the luminescent material element comprises a silicone matrix with the luminescent material embedded therein. 11. The lighting device according to claim 1, wherein the luminescent material comprises for less than 20 wt. % of a second phosphor selected from the group of cerium comprising garnet materials. 12. The lighting device according to claim 1, wherein the phosphor is obtainable by heating of a mixture of Eu2Si5N8, BaH2 and Si3N4 at a temperature in the range of 1550-1800° C. under a neutral or reducing atmosphere. 13. Use of the lighting device according to claim 1, in a decorative lighting application or a signal lighting application. | 2,800 |
11,246 | 11,246 | 14,795,576 | 2,851 | A method and system for generating high density registration maps for masks is disclosed. A data preparation module generates a plurality of anchor points of the mask. Additionally, the data preparation module generates a plurality of sample points. Weights are generated as well in the data preparation module and the weights are used later on in the data fusion module. The positions of anchor points are measured with a registration tool in a mask coordinate system according to a generated recipe. The positions of sample points are determined with an inspection tool in a mask coordinate system according to a generated recipe. The measured positions of the anchor points and the measured positions of the sample points are passed to a data fusion module where a registration map is determined. | 1. A method for generating a high density registration map for a mask comprising:
a) generating in a data preparation module from a design database of the mask and from a noise model of a registration tool a plurality of anchor points and a recipe for the registration tool; b) generating in the data preparation module from the design database of the mask and from a noise model of an inspection tool a plurality of sample points and a recipe for the inspection tool; c) generating weights in the data preparation module; d) measuring positions of the anchor points in a mask coordinate system with the registration tool according to the recipe; e) measuring positions of the sample points in the mask coordinate system with respect to sample points on a same or adjacent swaths with the inspection tool according to the recipe; and f) passing the positions of the anchor points and the positions of the sample points to a data fusion module, to determine a corrected set of registration points under the influence of the weights of an anchor point on adjacent sample points. 2. The method of claim 1, wherein a graphical representation of the registration map of the mask is displayed on a display showing the corrected set of registration points, wherein each registration point is provided with an error vector. 3. The method of claim 1, wherein the sample points, the anchor points and the weights are determined by a mask error enhancement function. 4. The method of claim 1, wherein the number of anchor points is less than the number of sample points. 5. The method of claim 4 wherein approximately 103 anchor points are generated. 6. The method of claim 4, wherein approximately 106 sample points are generated. 7. The method of claim 1, wherein the sample points, which are measured by the inspection tool, are cast over an entirety of the mask by the data fusion module, according to the weights, into a mask coordinate frame as established by the registration tool to obtain the registration map of the mask. 8. The method of claim 7, wherein the weights are used to determine an influence of a specific anchor point on the adjacent sample points in the mask coordinate frame. 9. The method of claim 7, wherein bounds are established for potential errors between sample points according to a predetermined interpolation scheme. 10. The method of claim 9, wherein the predetermined interpolation is realized by using influence functions. 11. The method of claim 2, wherein a user can regrid the registration map displayed on the display over the sample points over a different set of points. 12. The method of claim 11, wherein the different set of points is on a regularly spaced grid. 13. A system for generating a high density registration map for a mask comprising:
a data preparation software module which generates a plurality of anchor points, a plurality of sample points, a plurality of weights and at least one first recipe and at least one second recipe; a registration tool connected to the data preparation software module to determine data for positions of the anchor points on the mask as well as image render parameters learned from the mask with regard to the at least one first recipe; an inspection tool connected to the data preparation software module to determine data for positions of the sample points on the mask with regard to the at least one second recipe; and a data fusion software module connected to the registration tool, the inspection tool and the data preparation software module in order to generate with the weights at least one registration map with a corrected set of registration points. 14. The system according to claim 13, wherein the data preparation software module has at least a first input for providing mask design data in order to render an image of the mask for the registration tool and the inspection tool, and a second input for providing a noise model for the registration tool and the inspection tool. 15. The system according to claim 13, wherein a first recipe module is connected to an anchor point output of the data preparation software module and connected to an input of the registration tool, and a second recipe module is connected to a sample point output of the data preparation software module and connected to an input of the inspection tool. 16. The system of claim 13, wherein the data fusion software module is configured to take the data for the positions of the anchor points via an output of the registration tool and the data for the positions of the sample points via an output of the inspection tool and to generate a corrected set of registration points along with the weights. 17. The system of claim 16, wherein a display is connected to the data fusion module for displaying bounded interpolation errors between anchor points over an entirety of the mask. 18. The system of claim 13, wherein the number of anchor points is less than the number of sample points. 19. A computer program product disposed on a non-transitory computer readable medium comprising:
computer executable process steps operable to control a computer for:
obtaining positions of a plurality of anchor points in a mask coordinate system measured by a registration tool according to a predetermined recipe for the registration tool;
obtaining positions of a plurality of sample points in the mask coordinate system measured by an inspection tool according to a predetermined recipe for the inspection tool; and
calculating from the positions of the anchor points and the positions of the sample points with an influence of weights of anchor points on adjacent sample points on a registration map. 20. The computer program product of claim 19, wherein the weights, the predetermined recipe for the registration tool and the predetermined recipe for the inspection tool are obtained from a data preparation software module. 21. The computer program product of claim 19, wherein data of the positions of the anchor points and the positions of the sample points are used to generate along with the weights a corrected set of registration points and bounded interpolation errors between anchor points over an entirety of a mask. | A method and system for generating high density registration maps for masks is disclosed. A data preparation module generates a plurality of anchor points of the mask. Additionally, the data preparation module generates a plurality of sample points. Weights are generated as well in the data preparation module and the weights are used later on in the data fusion module. The positions of anchor points are measured with a registration tool in a mask coordinate system according to a generated recipe. The positions of sample points are determined with an inspection tool in a mask coordinate system according to a generated recipe. The measured positions of the anchor points and the measured positions of the sample points are passed to a data fusion module where a registration map is determined.1. A method for generating a high density registration map for a mask comprising:
a) generating in a data preparation module from a design database of the mask and from a noise model of a registration tool a plurality of anchor points and a recipe for the registration tool; b) generating in the data preparation module from the design database of the mask and from a noise model of an inspection tool a plurality of sample points and a recipe for the inspection tool; c) generating weights in the data preparation module; d) measuring positions of the anchor points in a mask coordinate system with the registration tool according to the recipe; e) measuring positions of the sample points in the mask coordinate system with respect to sample points on a same or adjacent swaths with the inspection tool according to the recipe; and f) passing the positions of the anchor points and the positions of the sample points to a data fusion module, to determine a corrected set of registration points under the influence of the weights of an anchor point on adjacent sample points. 2. The method of claim 1, wherein a graphical representation of the registration map of the mask is displayed on a display showing the corrected set of registration points, wherein each registration point is provided with an error vector. 3. The method of claim 1, wherein the sample points, the anchor points and the weights are determined by a mask error enhancement function. 4. The method of claim 1, wherein the number of anchor points is less than the number of sample points. 5. The method of claim 4 wherein approximately 103 anchor points are generated. 6. The method of claim 4, wherein approximately 106 sample points are generated. 7. The method of claim 1, wherein the sample points, which are measured by the inspection tool, are cast over an entirety of the mask by the data fusion module, according to the weights, into a mask coordinate frame as established by the registration tool to obtain the registration map of the mask. 8. The method of claim 7, wherein the weights are used to determine an influence of a specific anchor point on the adjacent sample points in the mask coordinate frame. 9. The method of claim 7, wherein bounds are established for potential errors between sample points according to a predetermined interpolation scheme. 10. The method of claim 9, wherein the predetermined interpolation is realized by using influence functions. 11. The method of claim 2, wherein a user can regrid the registration map displayed on the display over the sample points over a different set of points. 12. The method of claim 11, wherein the different set of points is on a regularly spaced grid. 13. A system for generating a high density registration map for a mask comprising:
a data preparation software module which generates a plurality of anchor points, a plurality of sample points, a plurality of weights and at least one first recipe and at least one second recipe; a registration tool connected to the data preparation software module to determine data for positions of the anchor points on the mask as well as image render parameters learned from the mask with regard to the at least one first recipe; an inspection tool connected to the data preparation software module to determine data for positions of the sample points on the mask with regard to the at least one second recipe; and a data fusion software module connected to the registration tool, the inspection tool and the data preparation software module in order to generate with the weights at least one registration map with a corrected set of registration points. 14. The system according to claim 13, wherein the data preparation software module has at least a first input for providing mask design data in order to render an image of the mask for the registration tool and the inspection tool, and a second input for providing a noise model for the registration tool and the inspection tool. 15. The system according to claim 13, wherein a first recipe module is connected to an anchor point output of the data preparation software module and connected to an input of the registration tool, and a second recipe module is connected to a sample point output of the data preparation software module and connected to an input of the inspection tool. 16. The system of claim 13, wherein the data fusion software module is configured to take the data for the positions of the anchor points via an output of the registration tool and the data for the positions of the sample points via an output of the inspection tool and to generate a corrected set of registration points along with the weights. 17. The system of claim 16, wherein a display is connected to the data fusion module for displaying bounded interpolation errors between anchor points over an entirety of the mask. 18. The system of claim 13, wherein the number of anchor points is less than the number of sample points. 19. A computer program product disposed on a non-transitory computer readable medium comprising:
computer executable process steps operable to control a computer for:
obtaining positions of a plurality of anchor points in a mask coordinate system measured by a registration tool according to a predetermined recipe for the registration tool;
obtaining positions of a plurality of sample points in the mask coordinate system measured by an inspection tool according to a predetermined recipe for the inspection tool; and
calculating from the positions of the anchor points and the positions of the sample points with an influence of weights of anchor points on adjacent sample points on a registration map. 20. The computer program product of claim 19, wherein the weights, the predetermined recipe for the registration tool and the predetermined recipe for the inspection tool are obtained from a data preparation software module. 21. The computer program product of claim 19, wherein data of the positions of the anchor points and the positions of the sample points are used to generate along with the weights a corrected set of registration points and bounded interpolation errors between anchor points over an entirety of a mask. | 2,800 |
11,247 | 11,247 | 14,525,366 | 2,875 | A combined grab handle and light source assembly includes an outer housing having a cavity and an open side. A grab handle and light source subassembly is rotatably mounted within that housing and is displaceable between a first position wherein a grab handle is provided on the open side and a light source assembly is hidden from view within the cavity and in a second position wherein the light source is provided on the open side and the grab handle is hidden from view within the cavity. | 1. A combined grab handle and light source assembly, comprising:
a door having a first face and a second face; a grab handle carried on said first face; and a light source carried on said second face. 2. The assembly of claim 1, wherein said grab handle is oriented in a first direction and said light source is oriented in a second direction. 3. The assembly of claim 1, wherein said first face is opposite said second face. 4. The assembly of claim 1, further including an outer housing, said door being received in said outer housing. 5. The assembly of claim 4, wherein said door is pivotally mounted in said outer housing. 6. The assembly of claim 5, wherein said door includes a first end wall, a second end wall, a first pivot pin on said first end wall and a second opposed pivot pin on said second end wall. 7. The assembly of claim 6, wherein said first face and said second face extend between said first and second end walls. 8. The assembly of claim 7, wherein said first end wall includes a first electrical contact and said second end wall includes a second electrical contact. 9. The assembly of claim 8, wherein said light source includes an LED and a cooperating lens. 10. The assembly of claim 8, wherein said light source includes an incandescent bulb and a cooperating lens. 11. The assembly of claim 4, further including a reinforcement bracket secured to said outer housing. 12. The assembly of claim 11 wherein said reinforcement bracket is u-shaped. 13. A combined grab handle and light source assembly, comprising:
an outer housing including a cavity and an open side; a grab handle and light source subassembly rotatably mounted in said housing and displaceable between a first position wherein a grab handle is provided on said open side and a second position wherein a light source is provided on said open side. 14. The assembly of claim 1, further including a reinforcement bracket secured to said outer housing. 15. The assembly of claim 14, wherein said reinforcement bracket is u-shaped. 16. The assembly of claim 13, wherein said subassembly includes a revolving door having a first end and a second end. 17. The assembly of claim 16, further including a first pivot pin on said first end and a second pivot pin on said second end. 18. The assembly of claim 17, further including a first electrical contact on said first end and a second electrical contact on said second end. 19. A method of decluttering a headliner of a vehicle, comprising:
providing a grab handle and a light source on a door that is displaceable between a first position wherein said grab handle is exposed for use and said light source is hidden and a second position wherein said light source is exposed for use and said grab handle is hidden. | A combined grab handle and light source assembly includes an outer housing having a cavity and an open side. A grab handle and light source subassembly is rotatably mounted within that housing and is displaceable between a first position wherein a grab handle is provided on the open side and a light source assembly is hidden from view within the cavity and in a second position wherein the light source is provided on the open side and the grab handle is hidden from view within the cavity.1. A combined grab handle and light source assembly, comprising:
a door having a first face and a second face; a grab handle carried on said first face; and a light source carried on said second face. 2. The assembly of claim 1, wherein said grab handle is oriented in a first direction and said light source is oriented in a second direction. 3. The assembly of claim 1, wherein said first face is opposite said second face. 4. The assembly of claim 1, further including an outer housing, said door being received in said outer housing. 5. The assembly of claim 4, wherein said door is pivotally mounted in said outer housing. 6. The assembly of claim 5, wherein said door includes a first end wall, a second end wall, a first pivot pin on said first end wall and a second opposed pivot pin on said second end wall. 7. The assembly of claim 6, wherein said first face and said second face extend between said first and second end walls. 8. The assembly of claim 7, wherein said first end wall includes a first electrical contact and said second end wall includes a second electrical contact. 9. The assembly of claim 8, wherein said light source includes an LED and a cooperating lens. 10. The assembly of claim 8, wherein said light source includes an incandescent bulb and a cooperating lens. 11. The assembly of claim 4, further including a reinforcement bracket secured to said outer housing. 12. The assembly of claim 11 wherein said reinforcement bracket is u-shaped. 13. A combined grab handle and light source assembly, comprising:
an outer housing including a cavity and an open side; a grab handle and light source subassembly rotatably mounted in said housing and displaceable between a first position wherein a grab handle is provided on said open side and a second position wherein a light source is provided on said open side. 14. The assembly of claim 1, further including a reinforcement bracket secured to said outer housing. 15. The assembly of claim 14, wherein said reinforcement bracket is u-shaped. 16. The assembly of claim 13, wherein said subassembly includes a revolving door having a first end and a second end. 17. The assembly of claim 16, further including a first pivot pin on said first end and a second pivot pin on said second end. 18. The assembly of claim 17, further including a first electrical contact on said first end and a second electrical contact on said second end. 19. A method of decluttering a headliner of a vehicle, comprising:
providing a grab handle and a light source on a door that is displaceable between a first position wherein said grab handle is exposed for use and said light source is hidden and a second position wherein said light source is exposed for use and said grab handle is hidden. | 2,800 |
11,248 | 11,248 | 14,441,644 | 2,849 | The invention relates to a power distribution track system, in particular, to a DC power distribution track system, comprising a track ( 3 ) with position markers ( 17 ) representing positional information being indicative of the respective longitudinal position. The system further comprises an electrical device like a luminair connected to the track ( 3 ) at a longitudinal position, wherein the electrical device comprises a reading unit for reading out the positional information represented by the position marker at the longitudinal position at which the electrical device is connected. Since the reading unit reads out the positional information at the respective longitudinal position represented by the respective position marker, positional information can be provided, which can be used for automatically determining the longitudinal position of the electrical device, especially without requiring an installer installing the electrical device to determine the position of the electrical device. | 1. A power distribution track system for distributing power via a track, the power distribution track system comprising:
the track, wherein the track comprises position markers at different longitudinal positions along the track, wherein the position markers represent positional information being indicative of the respective longitudinal position, an electrical device connected to the track at a longitudinal position, wherein the electrical device comprises a reading unit for reading out the positional information represented by the position marker at the longitudinal position at which the electrical device is connected. 2. The power distribution track system as defined in claim 1, wherein the position markers form digital codes for indicating the respective longitudinal position. 3. The power distribution track system as defined in claim 2, wherein the digital code of a position marker is formed by a sequence of electrically conductive regions and electrically insulated regions. 4. The power distribution track system as defined in claim 3, wherein for each position marker a minimal number of electrically conductive regions is at least present, wherein the minimal number is larger than one. 5. The power distribution track system as defined in claim 2, wherein the digital code of a position marker is formed by a sequence of a) hole positions or indentation positions and b) non-hole positions or non-indentation positions. 6. The power distribution track system as defined in claim 1, wherein the position markers form a Gray code. 7. The power distribution track system as defined in claim 1, wherein the power distribution track system comprises several tracks, wherein the position markers are further adapted to be indicative of the position of the respective track. 8. The power distribution track system as defined in claim 1, wherein the electrical device comprises an electrical connector for electrically connecting the electrical device to the track for allowing the electrical device to receive power from or provide power to the track, wherein the electrical connector comprises the reading unit for reading out the positional information represented by the respective position marker. 9. The power distribution track system as defined in claim 1, wherein the power distribution track system comprises a position determining device for determining the longitudinal position of the electrical device based on the positional information. 10. A track for a power distribution track system for distributing power as defined in claim 1, wherein the track comprises position markers at different longitudinal positions along the track, wherein the position markers represent positional information being indicative of the respective longitudinal position. 11. An electrical device for a power distribution track system for distributing power as defined in claim 1, wherein the electrical device is adapted to be connected to the track of the power distribution track system at a longitudinal position, wherein the electrical device comprises a reading unit for reading out the positional information at the longitudinal position at which the electrical device is connected. 12. An electrical connector for electrically connecting an electrical device of the power distribution track system defined in claim 1 to a track of the power distribution track system, wherein the electrical connector comprises a reading unit for reading out the positional information at the longitudinal position at which the electrical device is connected. 13. A position determining device for a power distribution track system as defined in claim 1, wherein the position determining device is adapted to determine the longitudinal position of the electrical device based on the positional information. 14. A position determining method for determining the position of an electrical device along a track of a power distribution track system as defined in claim 1, wherein the position determining method comprises:
reading out the positional information represented by the position marker at the longitudinal position of the track, at which the electrical device is connected, by the reading unit, determining the longitudinal position of the electrical device based on the positional information by a position determining device. 15. A position determining computer program for determining the position of an electrical device along a track of a power distribution track system as defined in claim 1, the position determining computer program comprising program code means for causing a power distribution track system as defined in claim 1 to carry out the steps of a position determining method when the position determining computer program is run on a computer controlling the power distribution track system. | The invention relates to a power distribution track system, in particular, to a DC power distribution track system, comprising a track ( 3 ) with position markers ( 17 ) representing positional information being indicative of the respective longitudinal position. The system further comprises an electrical device like a luminair connected to the track ( 3 ) at a longitudinal position, wherein the electrical device comprises a reading unit for reading out the positional information represented by the position marker at the longitudinal position at which the electrical device is connected. Since the reading unit reads out the positional information at the respective longitudinal position represented by the respective position marker, positional information can be provided, which can be used for automatically determining the longitudinal position of the electrical device, especially without requiring an installer installing the electrical device to determine the position of the electrical device.1. A power distribution track system for distributing power via a track, the power distribution track system comprising:
the track, wherein the track comprises position markers at different longitudinal positions along the track, wherein the position markers represent positional information being indicative of the respective longitudinal position, an electrical device connected to the track at a longitudinal position, wherein the electrical device comprises a reading unit for reading out the positional information represented by the position marker at the longitudinal position at which the electrical device is connected. 2. The power distribution track system as defined in claim 1, wherein the position markers form digital codes for indicating the respective longitudinal position. 3. The power distribution track system as defined in claim 2, wherein the digital code of a position marker is formed by a sequence of electrically conductive regions and electrically insulated regions. 4. The power distribution track system as defined in claim 3, wherein for each position marker a minimal number of electrically conductive regions is at least present, wherein the minimal number is larger than one. 5. The power distribution track system as defined in claim 2, wherein the digital code of a position marker is formed by a sequence of a) hole positions or indentation positions and b) non-hole positions or non-indentation positions. 6. The power distribution track system as defined in claim 1, wherein the position markers form a Gray code. 7. The power distribution track system as defined in claim 1, wherein the power distribution track system comprises several tracks, wherein the position markers are further adapted to be indicative of the position of the respective track. 8. The power distribution track system as defined in claim 1, wherein the electrical device comprises an electrical connector for electrically connecting the electrical device to the track for allowing the electrical device to receive power from or provide power to the track, wherein the electrical connector comprises the reading unit for reading out the positional information represented by the respective position marker. 9. The power distribution track system as defined in claim 1, wherein the power distribution track system comprises a position determining device for determining the longitudinal position of the electrical device based on the positional information. 10. A track for a power distribution track system for distributing power as defined in claim 1, wherein the track comprises position markers at different longitudinal positions along the track, wherein the position markers represent positional information being indicative of the respective longitudinal position. 11. An electrical device for a power distribution track system for distributing power as defined in claim 1, wherein the electrical device is adapted to be connected to the track of the power distribution track system at a longitudinal position, wherein the electrical device comprises a reading unit for reading out the positional information at the longitudinal position at which the electrical device is connected. 12. An electrical connector for electrically connecting an electrical device of the power distribution track system defined in claim 1 to a track of the power distribution track system, wherein the electrical connector comprises a reading unit for reading out the positional information at the longitudinal position at which the electrical device is connected. 13. A position determining device for a power distribution track system as defined in claim 1, wherein the position determining device is adapted to determine the longitudinal position of the electrical device based on the positional information. 14. A position determining method for determining the position of an electrical device along a track of a power distribution track system as defined in claim 1, wherein the position determining method comprises:
reading out the positional information represented by the position marker at the longitudinal position of the track, at which the electrical device is connected, by the reading unit, determining the longitudinal position of the electrical device based on the positional information by a position determining device. 15. A position determining computer program for determining the position of an electrical device along a track of a power distribution track system as defined in claim 1, the position determining computer program comprising program code means for causing a power distribution track system as defined in claim 1 to carry out the steps of a position determining method when the position determining computer program is run on a computer controlling the power distribution track system. | 2,800 |
11,249 | 11,249 | 15,483,453 | 2,844 | A lighting controller comprises power circuitry, transmitter circuitry, a touch-sensitive panel, and processing circuitry. The power circuitry is configured to relay power from the lighting controller to a solid state lighting fixture wired to the lighting controller. The transmitter circuitry is configured to wirelessly exchange signals with the solid state lighting fixture. The touch-sensitive panel is configured to emit light and receive touch input from a user. The processing circuitry is electrically coupled to the power circuitry, the transmitter circuitry, and the touch-sensitive panel. The processing circuitry is configured to wirelessly control, via the transmitter circuitry, the attribute of light emitted by the solid state lighting fixture in accordance with the touch input received via the touch-sensitive panel and control the light emitted from the touch-sensitive panel to indicate the attribute as the attribute is wirelessly controlled. | 1. A lighting controller comprising:
power circuitry configured to relay power from the lighting controller to a solid state lighting fixture wired to the lighting controller; transmitter circuitry configured to wirelessly exchange signals with the solid state lighting fixture; a touch-sensitive panel configured to emit light and receive touch input from a user; processing circuitry electrically coupled to the power circuitry, the transmitter circuitry, and the touch-sensitive panel, wherein the processing circuitry is configured to:
wirelessly control, via the transmitter circuitry, an attribute of light emitted by the solid state lighting fixture in accordance with the touch input received via the touch-sensitive panel; and
control the light emitted from the touch-sensitive panel to illuminate an area around the lighting controller and correspondingly indicate the attribute as the attribute is wirelessly controlled. 2. The lighting controller of claim 1, wherein the processing circuitry is further configured to interpret the touch input received from the user via the touch-sensitive panel, based on which of a brightness control mode and a color temperature control mode of the lighting controller is active, to determine a control signal for wirelessly controlling a brightness attribute or a color temperature attribute of the light emitted by the solid state lighting fixture. 3. The lighting controller of claim 2, wherein the processing circuitry is further configured to toggle between the brightness and color temperature control modes responsive to a double-tap of the touch-sensitive panel or a pressing of the touch-sensitive panel longer than a threshold duration. 4. The lighting controller of claim 2, further comprising a series of solid state indicator lights, wherein the processing circuitry is further configured to control the series of solid state indicator lights to visually indicate which of the brightness control mode and the color temperature control mode is active. 5. The lighting controller of claim 4, wherein to visually indicate which of the brightness control mode and the color temperature control mode is active, the processing circuitry is configured to:
responsive to one of the brightness and color temperature control modes being active, set a first majority of the series of solid state indicator lights to illuminated and a first remainder of the series of solid state indicator lights to extinguished; responsive to the other of the brightness and color temperature control modes being active, set a second majority of the series of solid state indicator lights to extinguished and a second remainder of the series of solid state indicator lights to illuminated. 6. The lighting controller of claim 5, wherein the processing circuitry is further configured to select which of the series of solid state indicator lights is included in the first or second remainder of the series of solid state indicator lights to visually indicate the attribute of the light emitted relative to a supported range for the attribute. 7. The lighting controller of claim 2, wherein the touch input is a sliding touch input and to determine the control signal the processing circuitry is configured to determine, within a range of supported configuration values, a configuration value to indicate via the control signal based on a length over which the sliding touch input was received via the touch-sensitive panel. 8. The lighting controller of claim 7, further comprising at least one feedback device communicatively coupled to the processing circuitry, the at least one feedback device comprising a haptic feedback actuator, an audio device, or both;
wherein, to determine the configuration value within the range of supported configuration values, the processing circuitry is configured to:
responsive to the brightness control mode being active, determine a brightness value between minimum and maximum supported brightness values;
responsive to the color temperature control mode being active, determine a color temperature value between minimum and maximum supported warmth values;
wherein the processing circuitry is further configured to, responsive to determining that the configuration value is equal to a value at either end of the range of supported configuration values, provide feedback to the user using the haptic feedback actuator, the audio device, or both. 9. The lighting controller of claim 1, wherein the attribute is a brightness attribute or a color temperature attribute of light emitted by the solid state lighting fixture, and wherein to control the light emitted from the touch-sensitive panel the processing circuitry is configured to control the light emitted from the touch-sensitive panel to indicate both the brightness attribute and the color temperature attribute. 10. The lighting controller of claim 1, wherein the processing circuitry is further configured to, responsive to a user selecting a different lighting fixture to wirelessly control via the touch-sensitive panel, update the light emitted from the touch-sensitive panel to indicate a brightness and color temperature of the different lighting fixture as the different lighting fixture is wirelessly controlled by the lighting controller, wherein the lighting controller is not wired to provide power to the different lighting fixture. 11. A method of controlling solid state lighting, wherein the method is implemented by a lighting controller and comprises:
relaying power from the lighting controller to a solid state lighting fixture wired to the lighting controller; wirelessly controlling an attribute of light emitted by the solid state lighting fixture in accordance with touch input received from a user via a touch-sensitive panel of the lighting controller; and emitting light from the touch-sensitive panel to illuminate an area around the lighting controller and correspondingly indicate the attribute as the attribute is wirelessly controlled. 12. The method of claim 11, further comprising interpreting the touch input received from the user via the touch-sensitive panel, based on which of a brightness control mode and a color temperature control mode of the lighting controller is active, to determine a control signal for wirelessly controlling a brightness attribute or a color temperature attribute of the light emitted by the solid state lighting fixture. 13. The method of claim 12, further comprising toggling between the brightness and color temperature control modes responsive to a double-tap of the touch-sensitive panel or a pressing of the touch-sensitive panel longer than a threshold duration. 14. The method of claim 12, further comprising visually indicating which of the brightness control mode and the color temperature control mode is active via a series of solid state indicator lights of the lighting controller. 15. The method of claim 14, wherein visually indicating which of the brightness control mode and the color temperature control mode is active comprises:
responsive to one of the brightness and color temperature control modes being active, setting a first majority of the series of solid state indicator lights to illuminated and a first remainder of the series of solid state indicator lights to extinguished; responsive to the other of the brightness and color temperature control modes being active, setting a second majority of the series of solid state indicator lights to extinguished and a second remainder of the series of solid state indicator lights to illuminated. 16. The method of claim 15, further comprising selecting which of the series of solid state indicator lights is included in the first or second remainder of the series of solid state indicator lights to visually indicate the attribute of the light emitted relative to a supported range for the attribute. 17. The method of claim 12, wherein the touch input is a sliding touch input and determining the control signal comprises determining, within a range of supported configuration values, a configuration value to indicate via the control signal based on a length over which the sliding touch input was received via the touch-sensitive panel. 18. The method of claim 17:
wherein determining the configuration value within the range of supported configuration values comprises:
responsive to the brightness control mode being active, determining a brightness value between minimum and maximum supported brightness values;
responsive to the color temperature control mode being active, determining a color temperature value between minimum and maximum supported warmth values;
further comprising, responsive to determining that the configuration value is equal to a value at either end of the range of supported configuration values, providing feedback to the user, the feedback comprising haptic feedback, audio feedback, or both. 19. The method of claim 11, wherein the attribute is a brightness attribute or a color temperature attribute of light emitted by the solid state lighting fixture, and wherein emitting light from the touch-sensitive panel comprises emitting light from the touch-sensitive panel to indicate both the brightness attribute and the color temperature attribute. 20. The method of claim 11, further comprising responsive to a user selecting a different lighting fixture to wirelessly control via the touch-sensitive panel, updating the light emitted from the touch-sensitive panel to indicate a brightness and color temperature of the different lighting fixture as the different lighting fixture is wirelessly controlled by the lighting controller, wherein the lighting controller is not wired to provide power to the different lighting fixture. | A lighting controller comprises power circuitry, transmitter circuitry, a touch-sensitive panel, and processing circuitry. The power circuitry is configured to relay power from the lighting controller to a solid state lighting fixture wired to the lighting controller. The transmitter circuitry is configured to wirelessly exchange signals with the solid state lighting fixture. The touch-sensitive panel is configured to emit light and receive touch input from a user. The processing circuitry is electrically coupled to the power circuitry, the transmitter circuitry, and the touch-sensitive panel. The processing circuitry is configured to wirelessly control, via the transmitter circuitry, the attribute of light emitted by the solid state lighting fixture in accordance with the touch input received via the touch-sensitive panel and control the light emitted from the touch-sensitive panel to indicate the attribute as the attribute is wirelessly controlled.1. A lighting controller comprising:
power circuitry configured to relay power from the lighting controller to a solid state lighting fixture wired to the lighting controller; transmitter circuitry configured to wirelessly exchange signals with the solid state lighting fixture; a touch-sensitive panel configured to emit light and receive touch input from a user; processing circuitry electrically coupled to the power circuitry, the transmitter circuitry, and the touch-sensitive panel, wherein the processing circuitry is configured to:
wirelessly control, via the transmitter circuitry, an attribute of light emitted by the solid state lighting fixture in accordance with the touch input received via the touch-sensitive panel; and
control the light emitted from the touch-sensitive panel to illuminate an area around the lighting controller and correspondingly indicate the attribute as the attribute is wirelessly controlled. 2. The lighting controller of claim 1, wherein the processing circuitry is further configured to interpret the touch input received from the user via the touch-sensitive panel, based on which of a brightness control mode and a color temperature control mode of the lighting controller is active, to determine a control signal for wirelessly controlling a brightness attribute or a color temperature attribute of the light emitted by the solid state lighting fixture. 3. The lighting controller of claim 2, wherein the processing circuitry is further configured to toggle between the brightness and color temperature control modes responsive to a double-tap of the touch-sensitive panel or a pressing of the touch-sensitive panel longer than a threshold duration. 4. The lighting controller of claim 2, further comprising a series of solid state indicator lights, wherein the processing circuitry is further configured to control the series of solid state indicator lights to visually indicate which of the brightness control mode and the color temperature control mode is active. 5. The lighting controller of claim 4, wherein to visually indicate which of the brightness control mode and the color temperature control mode is active, the processing circuitry is configured to:
responsive to one of the brightness and color temperature control modes being active, set a first majority of the series of solid state indicator lights to illuminated and a first remainder of the series of solid state indicator lights to extinguished; responsive to the other of the brightness and color temperature control modes being active, set a second majority of the series of solid state indicator lights to extinguished and a second remainder of the series of solid state indicator lights to illuminated. 6. The lighting controller of claim 5, wherein the processing circuitry is further configured to select which of the series of solid state indicator lights is included in the first or second remainder of the series of solid state indicator lights to visually indicate the attribute of the light emitted relative to a supported range for the attribute. 7. The lighting controller of claim 2, wherein the touch input is a sliding touch input and to determine the control signal the processing circuitry is configured to determine, within a range of supported configuration values, a configuration value to indicate via the control signal based on a length over which the sliding touch input was received via the touch-sensitive panel. 8. The lighting controller of claim 7, further comprising at least one feedback device communicatively coupled to the processing circuitry, the at least one feedback device comprising a haptic feedback actuator, an audio device, or both;
wherein, to determine the configuration value within the range of supported configuration values, the processing circuitry is configured to:
responsive to the brightness control mode being active, determine a brightness value between minimum and maximum supported brightness values;
responsive to the color temperature control mode being active, determine a color temperature value between minimum and maximum supported warmth values;
wherein the processing circuitry is further configured to, responsive to determining that the configuration value is equal to a value at either end of the range of supported configuration values, provide feedback to the user using the haptic feedback actuator, the audio device, or both. 9. The lighting controller of claim 1, wherein the attribute is a brightness attribute or a color temperature attribute of light emitted by the solid state lighting fixture, and wherein to control the light emitted from the touch-sensitive panel the processing circuitry is configured to control the light emitted from the touch-sensitive panel to indicate both the brightness attribute and the color temperature attribute. 10. The lighting controller of claim 1, wherein the processing circuitry is further configured to, responsive to a user selecting a different lighting fixture to wirelessly control via the touch-sensitive panel, update the light emitted from the touch-sensitive panel to indicate a brightness and color temperature of the different lighting fixture as the different lighting fixture is wirelessly controlled by the lighting controller, wherein the lighting controller is not wired to provide power to the different lighting fixture. 11. A method of controlling solid state lighting, wherein the method is implemented by a lighting controller and comprises:
relaying power from the lighting controller to a solid state lighting fixture wired to the lighting controller; wirelessly controlling an attribute of light emitted by the solid state lighting fixture in accordance with touch input received from a user via a touch-sensitive panel of the lighting controller; and emitting light from the touch-sensitive panel to illuminate an area around the lighting controller and correspondingly indicate the attribute as the attribute is wirelessly controlled. 12. The method of claim 11, further comprising interpreting the touch input received from the user via the touch-sensitive panel, based on which of a brightness control mode and a color temperature control mode of the lighting controller is active, to determine a control signal for wirelessly controlling a brightness attribute or a color temperature attribute of the light emitted by the solid state lighting fixture. 13. The method of claim 12, further comprising toggling between the brightness and color temperature control modes responsive to a double-tap of the touch-sensitive panel or a pressing of the touch-sensitive panel longer than a threshold duration. 14. The method of claim 12, further comprising visually indicating which of the brightness control mode and the color temperature control mode is active via a series of solid state indicator lights of the lighting controller. 15. The method of claim 14, wherein visually indicating which of the brightness control mode and the color temperature control mode is active comprises:
responsive to one of the brightness and color temperature control modes being active, setting a first majority of the series of solid state indicator lights to illuminated and a first remainder of the series of solid state indicator lights to extinguished; responsive to the other of the brightness and color temperature control modes being active, setting a second majority of the series of solid state indicator lights to extinguished and a second remainder of the series of solid state indicator lights to illuminated. 16. The method of claim 15, further comprising selecting which of the series of solid state indicator lights is included in the first or second remainder of the series of solid state indicator lights to visually indicate the attribute of the light emitted relative to a supported range for the attribute. 17. The method of claim 12, wherein the touch input is a sliding touch input and determining the control signal comprises determining, within a range of supported configuration values, a configuration value to indicate via the control signal based on a length over which the sliding touch input was received via the touch-sensitive panel. 18. The method of claim 17:
wherein determining the configuration value within the range of supported configuration values comprises:
responsive to the brightness control mode being active, determining a brightness value between minimum and maximum supported brightness values;
responsive to the color temperature control mode being active, determining a color temperature value between minimum and maximum supported warmth values;
further comprising, responsive to determining that the configuration value is equal to a value at either end of the range of supported configuration values, providing feedback to the user, the feedback comprising haptic feedback, audio feedback, or both. 19. The method of claim 11, wherein the attribute is a brightness attribute or a color temperature attribute of light emitted by the solid state lighting fixture, and wherein emitting light from the touch-sensitive panel comprises emitting light from the touch-sensitive panel to indicate both the brightness attribute and the color temperature attribute. 20. The method of claim 11, further comprising responsive to a user selecting a different lighting fixture to wirelessly control via the touch-sensitive panel, updating the light emitted from the touch-sensitive panel to indicate a brightness and color temperature of the different lighting fixture as the different lighting fixture is wirelessly controlled by the lighting controller, wherein the lighting controller is not wired to provide power to the different lighting fixture. | 2,800 |
11,250 | 11,250 | 15,019,083 | 2,813 | The present disclosure describes methods and systems, including computer-implemented methods, computer program products, and computer systems, for smoothing seismic data. One computer-implemented method includes obtaining, by a hardware data processing apparatus, a plurality of seismic data samples; forming, by the hardware data processing apparatus, guiding vectors using the plurality of seismic data samples and a plurality of guiding structure attributes; generating, by the hardware data processing apparatus, a structure guided directional weighted vector filter using the guiding vectors and a plurality of weighting factors; filtering, by the hardware data processing apparatus, the seismic data samples using the structure guided directional weighted vector filter to generate smoothed seismic data; and initiating output of the smoothed seismic data. | 1. A method for smoothing seismic data used in a reservoir modeling, comprising:
obtaining, by a hardware data processing apparatus, a plurality of seismic data samples; forming, by the hardware data processing apparatus, guiding vectors using the plurality of seismic data samples and a plurality of guiding structure attributes, wherein the plurality of guiding structure attributes are calculated based on the a plurality of seismic data samples; generating, by the hardware data processing apparatus, a structure guided directional weighted vector filter using the guiding vectors and a plurality of weighting factors; filtering, by the hardware data processing apparatus, the seismic data samples using the structure guided directional weighted vector filter to generate smoothed seismic data; and initiating output of the smoothed seismic data. 2. The method of claim 1, further comprising:
updating the plurality of seismic data samples using the smoothed seismic data; and repeating the forming, generating, and filtering until a satisfactory criteria is met. 3. The method of claim 1, wherein the plurality of seismic data samples comprise amplitude data. 4. The method of claim 1, wherein the plurality of seismic data samples comprise 3-dimensional (3D) post-stack seismic data, and the plurality of seismic data samples are segmented into horizontal 2-dimensional (2D) blocks for filtering. 5. The method of claim 1, wherein the plurality of guiding structure attributes include at least one of an edge detection attribute or a skeleton attribute. 6. The method of claim 1, wherein the plurality of weighting factors are generated using an anisotropic Gaussian function. 7. The method of claim 1, wherein the plurality of weighting factors are generated based on a structure tensor analysis. 8. The method of claim 1, further comprising:
updating the plurality of guiding structure attributes based on the smoothed seismic data; and initiating output of the updated guiding structure attributes. 9. A non-transitory, computer-readable medium storing computer-readable instructions, the instructions executable by a computer and configured to:
obtain, by a hardware data processing apparatus, a plurality of seismic data samples; form, by the hardware data processing apparatus, guiding vectors using the plurality of seismic data samples and a plurality of guiding structure attributes, wherein the plurality of guiding structure attributes are calculated based on the a plurality of seismic data samples; generate, by the hardware data processing apparatus, a structure guided directional weighted vector filter using the guiding vectors and a plurality of weighting factors; filter, by the hardware data processing apparatus, the seismic data samples using the structure guided directional weighted vector filter to generate smoothed seismic data; and initiate output of the smoothed seismic data. 10. The non-transitory, computer-readable medium of claim 9, wherein the instructions are further configured to:
update the plurality of seismic data samples using the smoothed seismic data; and repeat the forming, generating, and filtering until a satisfactory criteria is met. 11. The non-transitory, computer-readable medium of claim 9, wherein the plurality of seismic data samples comprise amplitude data. 12. The non-transitory, computer-readable medium of claim 9, wherein the plurality of seismic data samples comprise 3-dimensional (3D) post-stack seismic data, and the plurality of seismic data samples are segmented into horizontal 2-dimensional (2D) blocks for filtering. 13. The non-transitory, computer-readable medium of claim 9, wherein the plurality of guiding structure attributes include at least one of an edge detection attribute or a skeleton attribute. 14. The non-transitory, computer-readable medium of claim 9, wherein the plurality of weighting factors are generated using an anisotropic Gaussian function. 15. The non-transitory, computer-readable medium of claim 9, wherein the plurality of weighting factors are generated based on a structure tensor analysis. 16. The non-transitory, computer-readable medium of claim 9, wherein the instructions are further configured to:
update the plurality of guiding structure attributes based on the smoothed seismic data; and initiate output of the updated guiding structure attributes. 17. A computer system, comprising:
a hardware processor interoperably coupled with a computer memory and configured to:
obtain a plurality of seismic data samples;
form guiding vectors using the plurality of seismic data samples and a plurality of guiding structure attributes, wherein the plurality of guiding structure attributes are calculated based on the a plurality of seismic data samples;
generate a structure guided directional weighted vector filter using the guiding vectors and a plurality of weighting factors;
filter the seismic data samples using the structure guided directional weighted vector filter to generate smoothed seismic data; and
initiate output of the smoothed seismic data. 18. The computer system of claim 17, wherein the hardware processor is further configured to:
update the plurality of seismic data samples using the smoothed seismic data; and repeat the forming, generating, and filtering until a satisfactory criteria is met. 19. The computer system of claim 17, wherein the plurality of seismic data samples comprise amplitude data. 20. The computer system of claim 17, wherein the plurality of seismic data samples comprise 3-dimensional (3D) post-stack seismic data, and the plurality of seismic data samples are segmented into horizontal 2-dimensional (2D) blocks for filtering. 21. The computer system of claim 17, wherein the plurality of guiding structure attributes include at least one of an edge detection attribute or a skeleton attribute. 22. The computer system of claim 17, wherein the plurality of weighting factors are generated using an anisotropic Gaussian function. 23. The computer system of claim 17, wherein the plurality of weighting factors are generated based on a structure tensor analysis. 24. The computer system of claim 17, wherein the hardware processor is further configured to:
update the plurality of guiding structure attributes based on the smoothed seismic data; and initiate output of the updated guiding structure attributes. | The present disclosure describes methods and systems, including computer-implemented methods, computer program products, and computer systems, for smoothing seismic data. One computer-implemented method includes obtaining, by a hardware data processing apparatus, a plurality of seismic data samples; forming, by the hardware data processing apparatus, guiding vectors using the plurality of seismic data samples and a plurality of guiding structure attributes; generating, by the hardware data processing apparatus, a structure guided directional weighted vector filter using the guiding vectors and a plurality of weighting factors; filtering, by the hardware data processing apparatus, the seismic data samples using the structure guided directional weighted vector filter to generate smoothed seismic data; and initiating output of the smoothed seismic data.1. A method for smoothing seismic data used in a reservoir modeling, comprising:
obtaining, by a hardware data processing apparatus, a plurality of seismic data samples; forming, by the hardware data processing apparatus, guiding vectors using the plurality of seismic data samples and a plurality of guiding structure attributes, wherein the plurality of guiding structure attributes are calculated based on the a plurality of seismic data samples; generating, by the hardware data processing apparatus, a structure guided directional weighted vector filter using the guiding vectors and a plurality of weighting factors; filtering, by the hardware data processing apparatus, the seismic data samples using the structure guided directional weighted vector filter to generate smoothed seismic data; and initiating output of the smoothed seismic data. 2. The method of claim 1, further comprising:
updating the plurality of seismic data samples using the smoothed seismic data; and repeating the forming, generating, and filtering until a satisfactory criteria is met. 3. The method of claim 1, wherein the plurality of seismic data samples comprise amplitude data. 4. The method of claim 1, wherein the plurality of seismic data samples comprise 3-dimensional (3D) post-stack seismic data, and the plurality of seismic data samples are segmented into horizontal 2-dimensional (2D) blocks for filtering. 5. The method of claim 1, wherein the plurality of guiding structure attributes include at least one of an edge detection attribute or a skeleton attribute. 6. The method of claim 1, wherein the plurality of weighting factors are generated using an anisotropic Gaussian function. 7. The method of claim 1, wherein the plurality of weighting factors are generated based on a structure tensor analysis. 8. The method of claim 1, further comprising:
updating the plurality of guiding structure attributes based on the smoothed seismic data; and initiating output of the updated guiding structure attributes. 9. A non-transitory, computer-readable medium storing computer-readable instructions, the instructions executable by a computer and configured to:
obtain, by a hardware data processing apparatus, a plurality of seismic data samples; form, by the hardware data processing apparatus, guiding vectors using the plurality of seismic data samples and a plurality of guiding structure attributes, wherein the plurality of guiding structure attributes are calculated based on the a plurality of seismic data samples; generate, by the hardware data processing apparatus, a structure guided directional weighted vector filter using the guiding vectors and a plurality of weighting factors; filter, by the hardware data processing apparatus, the seismic data samples using the structure guided directional weighted vector filter to generate smoothed seismic data; and initiate output of the smoothed seismic data. 10. The non-transitory, computer-readable medium of claim 9, wherein the instructions are further configured to:
update the plurality of seismic data samples using the smoothed seismic data; and repeat the forming, generating, and filtering until a satisfactory criteria is met. 11. The non-transitory, computer-readable medium of claim 9, wherein the plurality of seismic data samples comprise amplitude data. 12. The non-transitory, computer-readable medium of claim 9, wherein the plurality of seismic data samples comprise 3-dimensional (3D) post-stack seismic data, and the plurality of seismic data samples are segmented into horizontal 2-dimensional (2D) blocks for filtering. 13. The non-transitory, computer-readable medium of claim 9, wherein the plurality of guiding structure attributes include at least one of an edge detection attribute or a skeleton attribute. 14. The non-transitory, computer-readable medium of claim 9, wherein the plurality of weighting factors are generated using an anisotropic Gaussian function. 15. The non-transitory, computer-readable medium of claim 9, wherein the plurality of weighting factors are generated based on a structure tensor analysis. 16. The non-transitory, computer-readable medium of claim 9, wherein the instructions are further configured to:
update the plurality of guiding structure attributes based on the smoothed seismic data; and initiate output of the updated guiding structure attributes. 17. A computer system, comprising:
a hardware processor interoperably coupled with a computer memory and configured to:
obtain a plurality of seismic data samples;
form guiding vectors using the plurality of seismic data samples and a plurality of guiding structure attributes, wherein the plurality of guiding structure attributes are calculated based on the a plurality of seismic data samples;
generate a structure guided directional weighted vector filter using the guiding vectors and a plurality of weighting factors;
filter the seismic data samples using the structure guided directional weighted vector filter to generate smoothed seismic data; and
initiate output of the smoothed seismic data. 18. The computer system of claim 17, wherein the hardware processor is further configured to:
update the plurality of seismic data samples using the smoothed seismic data; and repeat the forming, generating, and filtering until a satisfactory criteria is met. 19. The computer system of claim 17, wherein the plurality of seismic data samples comprise amplitude data. 20. The computer system of claim 17, wherein the plurality of seismic data samples comprise 3-dimensional (3D) post-stack seismic data, and the plurality of seismic data samples are segmented into horizontal 2-dimensional (2D) blocks for filtering. 21. The computer system of claim 17, wherein the plurality of guiding structure attributes include at least one of an edge detection attribute or a skeleton attribute. 22. The computer system of claim 17, wherein the plurality of weighting factors are generated using an anisotropic Gaussian function. 23. The computer system of claim 17, wherein the plurality of weighting factors are generated based on a structure tensor analysis. 24. The computer system of claim 17, wherein the hardware processor is further configured to:
update the plurality of guiding structure attributes based on the smoothed seismic data; and initiate output of the updated guiding structure attributes. | 2,800 |
11,251 | 11,251 | 14,772,543 | 2,872 | The invention provides an autostereoscopic display which combines a display panel with a transparent mode and switchable optical arrangement for directing different views in different spatial directions to enable autostereoscopic viewing, and which also has a transparent mode. The display has (at least) at least a 3D autostereoscopic display mode in which the display is driven and the optical arrangement is used for generating views, and a transparent display mode in which the display and optical arrangement are driven to transparent modes to provide an undistorted view of the image behind the display. | 1. A transparent autostereoscopic display comprising:
a display panel having a display mode and a transparent mode in which the display panel is substantially transparent and the display has a window mode; and a polarization independent optical arrangement for directing different views in different spatial directions to enable autostereoscopic viewing, wherein the optical arrangement is switchable between a multi-view mode and a transparent non-lensing mode in which light is transmitted independent of its polarisation, and wherein the display has at least a 3D autostereoscopic display mode in which the 1 display panel is driven to the display mode and the optical arrangement is driven to the multi-view mode, and a transparent display mode in which the display is driven to the transparent mode and the optical arrangement is driven to the transparent non-lensing mode. 2. A display as claimed in claim 1, wherein the display panel is a display panel chosen from the group consisting of transparent organic light-emitting diode display panels, electrowetting pixel display panels, electrofluidic pixel display panels, in-plane-electrophoretic pixel display panels, and roll-out MEMS pixels display panels. 3. A display as claimed in claim 1, wherein the switchable optical arrangement comprises:
electrowetting microlens cells; electrowetting lenticulars cells; or an optical adjuster beam shaper comprising a pair of birefringent lenticular lens arrays with a switchable LC material between the lenticular lens arrays. 4. A display as claimed in claim 1, further comprising a switchable optical diffuser or switchable absorber on the opposite side of the display panel to the switchable optical arrangement. 5. A display as claimed in claim 1, wherein the display panel comprises pixels which are transparent when turned off. 6. A display as claimed in claim 1, wherein the display panel comprises transparent OLED pixels, and the switchable optical arrangement comprises electrowetting lenses. 7. A display as claimed in claim 1, wherein the display panel comprises opaque pixels which occupy less than 50% of the display area. 8. A display as claimed in claim 7, wherein the pixels comprise a rear reflector (60 a). 9. A display as claimed in claim 1, comprising a controller for controlling the switching of the switchable optical arrangement and the pixels in synchronism, and to control a duty cycle of the switching to vary the ratio of display transparency to displayed image brightness. 10. A display as claimed in claim 1, wherein the switchable optical arrangement comprises electrowetting lens segments forming an array of Fresnel lenses, with each Fresnel lens formed from a set of lens segments. 11. A display as claimed in claim 10, comprising a controller for controlling the switching of the microfluidic lens segments between the multi-view mode and the non-lensing mode and to vary the pitch of the Fresnel lenses when in the multi-view mode by varying the number of lens segments forming each Fresnel lens. 12. A display as claimed in claim 1, wherein the display is controllable to be driven to:
a transparent mode; an autostereoscopic display mode; or a 2D display mode with the switchable optical arrangement turned off and the display panel turned on. 13. A display as claimed in claim 12, wherein the display is further controllable to be driven to:
a first hybrid mode comprising at least one region of 2D display content and a transparent region; or a second hybrid mode comprising at least one region of 3D display content and a transparent region; or a third hybrid mode comprising at least one region of 2D display content and at least one region of 3D display content. 14. A display as claimed in claim 13, wherein the display is further controllable to be driven to:
a fourth hybrid mode comprising at least one region of 2D display content, at least one region of 3D display content and a transparent region. 15. A hand held device, shop window or advertisement window comprising a display as claimed in claim 1. | The invention provides an autostereoscopic display which combines a display panel with a transparent mode and switchable optical arrangement for directing different views in different spatial directions to enable autostereoscopic viewing, and which also has a transparent mode. The display has (at least) at least a 3D autostereoscopic display mode in which the display is driven and the optical arrangement is used for generating views, and a transparent display mode in which the display and optical arrangement are driven to transparent modes to provide an undistorted view of the image behind the display.1. A transparent autostereoscopic display comprising:
a display panel having a display mode and a transparent mode in which the display panel is substantially transparent and the display has a window mode; and a polarization independent optical arrangement for directing different views in different spatial directions to enable autostereoscopic viewing, wherein the optical arrangement is switchable between a multi-view mode and a transparent non-lensing mode in which light is transmitted independent of its polarisation, and wherein the display has at least a 3D autostereoscopic display mode in which the 1 display panel is driven to the display mode and the optical arrangement is driven to the multi-view mode, and a transparent display mode in which the display is driven to the transparent mode and the optical arrangement is driven to the transparent non-lensing mode. 2. A display as claimed in claim 1, wherein the display panel is a display panel chosen from the group consisting of transparent organic light-emitting diode display panels, electrowetting pixel display panels, electrofluidic pixel display panels, in-plane-electrophoretic pixel display panels, and roll-out MEMS pixels display panels. 3. A display as claimed in claim 1, wherein the switchable optical arrangement comprises:
electrowetting microlens cells; electrowetting lenticulars cells; or an optical adjuster beam shaper comprising a pair of birefringent lenticular lens arrays with a switchable LC material between the lenticular lens arrays. 4. A display as claimed in claim 1, further comprising a switchable optical diffuser or switchable absorber on the opposite side of the display panel to the switchable optical arrangement. 5. A display as claimed in claim 1, wherein the display panel comprises pixels which are transparent when turned off. 6. A display as claimed in claim 1, wherein the display panel comprises transparent OLED pixels, and the switchable optical arrangement comprises electrowetting lenses. 7. A display as claimed in claim 1, wherein the display panel comprises opaque pixels which occupy less than 50% of the display area. 8. A display as claimed in claim 7, wherein the pixels comprise a rear reflector (60 a). 9. A display as claimed in claim 1, comprising a controller for controlling the switching of the switchable optical arrangement and the pixels in synchronism, and to control a duty cycle of the switching to vary the ratio of display transparency to displayed image brightness. 10. A display as claimed in claim 1, wherein the switchable optical arrangement comprises electrowetting lens segments forming an array of Fresnel lenses, with each Fresnel lens formed from a set of lens segments. 11. A display as claimed in claim 10, comprising a controller for controlling the switching of the microfluidic lens segments between the multi-view mode and the non-lensing mode and to vary the pitch of the Fresnel lenses when in the multi-view mode by varying the number of lens segments forming each Fresnel lens. 12. A display as claimed in claim 1, wherein the display is controllable to be driven to:
a transparent mode; an autostereoscopic display mode; or a 2D display mode with the switchable optical arrangement turned off and the display panel turned on. 13. A display as claimed in claim 12, wherein the display is further controllable to be driven to:
a first hybrid mode comprising at least one region of 2D display content and a transparent region; or a second hybrid mode comprising at least one region of 3D display content and a transparent region; or a third hybrid mode comprising at least one region of 2D display content and at least one region of 3D display content. 14. A display as claimed in claim 13, wherein the display is further controllable to be driven to:
a fourth hybrid mode comprising at least one region of 2D display content, at least one region of 3D display content and a transparent region. 15. A hand held device, shop window or advertisement window comprising a display as claimed in claim 1. | 2,800 |
11,252 | 11,252 | 13,589,228 | 2,858 | A system and method for performing diagnostics in a medium voltage drive. The system includes a power cell and a bypass mechanism. The bypass mechanism is operably connected to output terminals of the power cell and configured to create a shunt path between the output terminals. The bypass mechanism includes a communication interface configured to transmit a bypass signal to a communication interface associated with the power cell in response to a state change. The method of performing diagnostics includes a controller transmitting an input voltage to a bypass mechanism of the power supply, thereby causing a state change of the bypass mechanism. The controller receives a signal from the power cell, wherein the signal indicates the power cell has detected the state change of the bypass mechanism. The controller then determines if the power cell is correctly associated with the bypass mechanism. | 1. A system comprising:
a power cell comprising:
a first output terminal and a second output terminal, and
a first communication interface; and
a bypass mechanism operably connected to the first output terminal and the second output terminal and configured to create a shunt path between the first output terminal and the second output terminal, the bypass mechanism comprising a second communication interface configured to transmit a bypass signal to the first communication interface in response to a change in state of the bypass mechanism. 2. The system of claim 1, wherein the first communication interface comprises a photo-detector. 3. The system of claim 2, wherein the second communication interface comprises a photo-diode configured to produce and direct light at the photo-detector. 4. The system of claim 1, wherein the power cell is operably connected to the controller and configured to output a signal to the controller in response to the first communication interface detecting the bypass signal. 5. The system of claim 1, wherein the first communication interface and the second communication interface are configured to establish a unidirectional communication link. 6. The system of claim 1, wherein the first communication interface and the second communication interface are configured to establish a bi-directional communication link. 7. A power supply comprising:
a multi-winding device having a primary winding and a plurality of three-phase secondary windings; a controller; a plurality of power cells operably connected to controller, wherein each power cell is connected to a different three-phase secondary winding of the multi-winding device, wherein each of the plurality of power cells comprises:
a first output terminal and a second output terminal, and
a first communication interface; and
a plurality of bypass mechanisms, wherein at least one of the plurality of bypass mechanisms is operably connected to an associated one of the plurality of power cells and configured to create a shunt path between the first output terminal and the second output terminal, each of the plurality of bypass mechanisms comprising a second communication interface configured to transmit a bypass signal to the first communication interface of the associated power cell in response to a change in state of the bypass mechanism. 8. The system of claim 7, wherein the first communication interface comprises a photo-detector. 9. The system of claim 8, wherein the second communication interface comprises a photo-diode configured to produce and direct light at the photo-detector. 10. The system of claim 7, wherein the power cell is operably connected to the controller and configured to output a signal to the controller in response to the first communication interface detecting the bypass signal. 11. The system of claim 7, wherein the first communication interface and the second communication interface are configured to establish a unidirectional communication link. 12. The system of claim 7, wherein the first communication interface and the second communication interface are configured to establish a bi-directional communication link. 13. A method of performing diagnostics on a power supply, the method comprising:
transmitting, by a controller, an input voltage to a bypass mechanism of the power supply, wherein the input voltage causes a state change of the bypass mechanism; receiving, by the controller, a signal from a power cell, wherein the signal indicates the power cell has detected the state change of the bypass mechanism; and determining, by the controller, if the power cell is associated with the bypass mechanism. 14. The method of claim 14, further comprising determining one or more errors associated with the bypass mechanism if the controller determines the power cell is not associated with the bypass mechanism. | A system and method for performing diagnostics in a medium voltage drive. The system includes a power cell and a bypass mechanism. The bypass mechanism is operably connected to output terminals of the power cell and configured to create a shunt path between the output terminals. The bypass mechanism includes a communication interface configured to transmit a bypass signal to a communication interface associated with the power cell in response to a state change. The method of performing diagnostics includes a controller transmitting an input voltage to a bypass mechanism of the power supply, thereby causing a state change of the bypass mechanism. The controller receives a signal from the power cell, wherein the signal indicates the power cell has detected the state change of the bypass mechanism. The controller then determines if the power cell is correctly associated with the bypass mechanism.1. A system comprising:
a power cell comprising:
a first output terminal and a second output terminal, and
a first communication interface; and
a bypass mechanism operably connected to the first output terminal and the second output terminal and configured to create a shunt path between the first output terminal and the second output terminal, the bypass mechanism comprising a second communication interface configured to transmit a bypass signal to the first communication interface in response to a change in state of the bypass mechanism. 2. The system of claim 1, wherein the first communication interface comprises a photo-detector. 3. The system of claim 2, wherein the second communication interface comprises a photo-diode configured to produce and direct light at the photo-detector. 4. The system of claim 1, wherein the power cell is operably connected to the controller and configured to output a signal to the controller in response to the first communication interface detecting the bypass signal. 5. The system of claim 1, wherein the first communication interface and the second communication interface are configured to establish a unidirectional communication link. 6. The system of claim 1, wherein the first communication interface and the second communication interface are configured to establish a bi-directional communication link. 7. A power supply comprising:
a multi-winding device having a primary winding and a plurality of three-phase secondary windings; a controller; a plurality of power cells operably connected to controller, wherein each power cell is connected to a different three-phase secondary winding of the multi-winding device, wherein each of the plurality of power cells comprises:
a first output terminal and a second output terminal, and
a first communication interface; and
a plurality of bypass mechanisms, wherein at least one of the plurality of bypass mechanisms is operably connected to an associated one of the plurality of power cells and configured to create a shunt path between the first output terminal and the second output terminal, each of the plurality of bypass mechanisms comprising a second communication interface configured to transmit a bypass signal to the first communication interface of the associated power cell in response to a change in state of the bypass mechanism. 8. The system of claim 7, wherein the first communication interface comprises a photo-detector. 9. The system of claim 8, wherein the second communication interface comprises a photo-diode configured to produce and direct light at the photo-detector. 10. The system of claim 7, wherein the power cell is operably connected to the controller and configured to output a signal to the controller in response to the first communication interface detecting the bypass signal. 11. The system of claim 7, wherein the first communication interface and the second communication interface are configured to establish a unidirectional communication link. 12. The system of claim 7, wherein the first communication interface and the second communication interface are configured to establish a bi-directional communication link. 13. A method of performing diagnostics on a power supply, the method comprising:
transmitting, by a controller, an input voltage to a bypass mechanism of the power supply, wherein the input voltage causes a state change of the bypass mechanism; receiving, by the controller, a signal from a power cell, wherein the signal indicates the power cell has detected the state change of the bypass mechanism; and determining, by the controller, if the power cell is associated with the bypass mechanism. 14. The method of claim 14, further comprising determining one or more errors associated with the bypass mechanism if the controller determines the power cell is not associated with the bypass mechanism. | 2,800 |
11,253 | 11,253 | 14,923,086 | 2,875 | An edge-emitting light bar assembly for a vehicle includes a light-transmitting, edge light-diffusing optical fiber and an at least partially light-transmitting extruded or pultruded coating surrounding the optical fiber to provide a single-layer coated optical fiber. At least one light source is provided for emitting light rays to impinge on an end of the optical fiber. A housing connected to an end of the coated optical fiber and surrounding the at least one light source is provided. The light bar assembly may include a light source disposed at each opposed end of the optical fiber. The single layer coating may include one or more of a colored tint or dye, a frosted material, and a plurality of light reflective or refractive inclusions. Optionally, a portion of the single-layer coating includes an opaque material disposed to direct emitted light rays in a predetermined direction relative to the optical fiber. | 1. A light bar for a vehicle, comprising:
a light-transmitting and edge-emitting optical fiber; and an at least partially light-transmitting single-layer extruded or pultruded coating surrounding the optical fiber. 2. The light bar of claim 1, wherein the single-layer coating defines a cross-sectional geometry selected from one of circular, oval, hexagonal, rectangular, square, triangular, and surface-patterned. 3. The light bar of claim 1, wherein the single layer coating comprises one or more of a colored tint or dye, a frosted material, and a plurality of light reflective or refractive inclusions. 4. The light bar of claim 4, wherein the plurality of light reflective or refractive inclusions are selected from one or more of reflective or refractive particles, mica, glass chips, bubbles, cenospheres, and titanium dioxide particles. 5. A light bar assembly for a vehicle, comprising:
a light-transmitting and edge-emitting optical fiber; an at least partially light-transmitting extruded or pultruded coating surrounding the optical fiber to provide a single-layer coated optical fiber; at least one light source for emitting light rays to impinge on an end of the optical fiber; and a housing connected to an end of the coated optical fiber and surrounding the at least one light source. 6. The assembly of claim 5, further including a focusing lens disposed in the housing between the at least one light source and the optical fiber. 7. The assembly of claim 5, further including a power source operatively connected to the at least one light source. 8. The assembly of claim 5, including a light source disposed at each opposed end of the optical fiber. 9. The assembly of claim 5, wherein the single-layer coating defines a cross-sectional geometry selected from one of circular, oval, hexagonal, rectangular, square, triangular, and surface-patterned. 10. The assembly of claim 5, wherein the at least one light source is a laser light-emitting diode or a light-emitting diode. 11. The assembly of claim 5, wherein a portion of the single-layer coating comprises an opaque material disposed to direct emitted light rays in a predetermined direction relative to the optical fiber. 12. The assembly of claim 5, wherein the single layer coating comprises one or more of a colored tint or dye, a frosted material, and a plurality of light reflective or refractive inclusions. 13. The assembly of claim 12, wherein the plurality of light reflective or refractive inclusions are selected from one or more of reflective or refractive particles, mica, glass chips, bubbles, cenospheres, and titanium dioxide particles. 14. A vehicle including the assembly of claim 5. 15. A method for providing an edge-emitting light bar for a vehicle, comprising:
providing a light-transmitting and edge-emitting optical fiber; extruding or pultruding an at least partially light-transmitting coating material about the optical fiber to provide a single-layer coated optical fiber; and cutting the coated optical fiber to a desired length. 16. The method of claim 15, including extruding or pultruding the coating material through an extruder configured to provide the single-layer coating defining a cross-sectional geometry selected from one of circular, oval, hexagonal, rectangular, square, and triangular. 17. The method of claim 16, further including extruding or pultruding the coating material through an extruder configured to provide the single-layer coating defining a surface pattern. 18. The method of claim 15, including providing the coating material comprising one or more of a colored tint or dye, a frosted material, and a plurality of light reflective or refractive inclusions. 19. The method of claim 18, including selecting the plurality of light reflective or refractive inclusions from one or more of reflective or refractive particles, mica, glass chips, bubbles, cenospheres, and titanium dioxide particles. 20. The method of claim 15, further including subjecting the cut coated optical fiber to a post-forming process comprising heating sufficiently to soften the coating material, bending the cut coated optical fiber to a desired configuration, and cooling. | An edge-emitting light bar assembly for a vehicle includes a light-transmitting, edge light-diffusing optical fiber and an at least partially light-transmitting extruded or pultruded coating surrounding the optical fiber to provide a single-layer coated optical fiber. At least one light source is provided for emitting light rays to impinge on an end of the optical fiber. A housing connected to an end of the coated optical fiber and surrounding the at least one light source is provided. The light bar assembly may include a light source disposed at each opposed end of the optical fiber. The single layer coating may include one or more of a colored tint or dye, a frosted material, and a plurality of light reflective or refractive inclusions. Optionally, a portion of the single-layer coating includes an opaque material disposed to direct emitted light rays in a predetermined direction relative to the optical fiber.1. A light bar for a vehicle, comprising:
a light-transmitting and edge-emitting optical fiber; and an at least partially light-transmitting single-layer extruded or pultruded coating surrounding the optical fiber. 2. The light bar of claim 1, wherein the single-layer coating defines a cross-sectional geometry selected from one of circular, oval, hexagonal, rectangular, square, triangular, and surface-patterned. 3. The light bar of claim 1, wherein the single layer coating comprises one or more of a colored tint or dye, a frosted material, and a plurality of light reflective or refractive inclusions. 4. The light bar of claim 4, wherein the plurality of light reflective or refractive inclusions are selected from one or more of reflective or refractive particles, mica, glass chips, bubbles, cenospheres, and titanium dioxide particles. 5. A light bar assembly for a vehicle, comprising:
a light-transmitting and edge-emitting optical fiber; an at least partially light-transmitting extruded or pultruded coating surrounding the optical fiber to provide a single-layer coated optical fiber; at least one light source for emitting light rays to impinge on an end of the optical fiber; and a housing connected to an end of the coated optical fiber and surrounding the at least one light source. 6. The assembly of claim 5, further including a focusing lens disposed in the housing between the at least one light source and the optical fiber. 7. The assembly of claim 5, further including a power source operatively connected to the at least one light source. 8. The assembly of claim 5, including a light source disposed at each opposed end of the optical fiber. 9. The assembly of claim 5, wherein the single-layer coating defines a cross-sectional geometry selected from one of circular, oval, hexagonal, rectangular, square, triangular, and surface-patterned. 10. The assembly of claim 5, wherein the at least one light source is a laser light-emitting diode or a light-emitting diode. 11. The assembly of claim 5, wherein a portion of the single-layer coating comprises an opaque material disposed to direct emitted light rays in a predetermined direction relative to the optical fiber. 12. The assembly of claim 5, wherein the single layer coating comprises one or more of a colored tint or dye, a frosted material, and a plurality of light reflective or refractive inclusions. 13. The assembly of claim 12, wherein the plurality of light reflective or refractive inclusions are selected from one or more of reflective or refractive particles, mica, glass chips, bubbles, cenospheres, and titanium dioxide particles. 14. A vehicle including the assembly of claim 5. 15. A method for providing an edge-emitting light bar for a vehicle, comprising:
providing a light-transmitting and edge-emitting optical fiber; extruding or pultruding an at least partially light-transmitting coating material about the optical fiber to provide a single-layer coated optical fiber; and cutting the coated optical fiber to a desired length. 16. The method of claim 15, including extruding or pultruding the coating material through an extruder configured to provide the single-layer coating defining a cross-sectional geometry selected from one of circular, oval, hexagonal, rectangular, square, and triangular. 17. The method of claim 16, further including extruding or pultruding the coating material through an extruder configured to provide the single-layer coating defining a surface pattern. 18. The method of claim 15, including providing the coating material comprising one or more of a colored tint or dye, a frosted material, and a plurality of light reflective or refractive inclusions. 19. The method of claim 18, including selecting the plurality of light reflective or refractive inclusions from one or more of reflective or refractive particles, mica, glass chips, bubbles, cenospheres, and titanium dioxide particles. 20. The method of claim 15, further including subjecting the cut coated optical fiber to a post-forming process comprising heating sufficiently to soften the coating material, bending the cut coated optical fiber to a desired configuration, and cooling. | 2,800 |
11,254 | 11,254 | 15,670,257 | 2,874 | The present disclosure relates to fiber optic connection systems including fiber optic connector having retractable noses for protecting bare fiber ends of ferrule-less connectors. In certain examples, the retractable noses are used in combination with protective shutters. In other examples, the retractable noses can accommodate multiple optical fibers. | 1. A fiber optic connector comprising:
a connector body having a front end and an opposite rear end, the connector body defining a longitudinal axis that extends through the connector body in an orientation that extends from the front end to the rear end of the connector body; an optical fiber that extends through the connector body from the rear end to the front end, the optical fiber having a fiber end accessible at the front end of the connector body; a nose piece mounted at the front end of the connector body, the nose piece defining a fiber passage through which the optical fiber extends, the nose piece being movable along the longitudinal axis between an extended position where a front end portion of the optical fiber is protected within the fiber passage and a retracted position where the front end portion of the optical fiber projects forwardly beyond the nose piece; and a shutter mounted at the front end of the connector body, the shutter being moveable between a first position where the shutter covers the nose piece and a second position where the nose piece is exposed. 2. The fiber optic connector of claim 1, wherein the nose piece is spring biased toward the extended position, and wherein the nose piece retracts back into the connector body as the nose piece moves from the extended position toward the retracted position. 3. The fiber optic connector of claim 2, wherein the shutter pivots relative to the connector body as the shutter moves between the first and second positions. 4. The fiber optic connector of claim 1, wherein the front end portion of the optical fiber is a bare glass portion that does not have a ferrule secured thereto. 5. The fiber optic connector of claim 3, further comprising a latch for retaining the shutter in the first position. 6. A fiber optic connection system comprising:
first and second fiber optic connectors each including:
a connector body having a front end and an opposite rear end, the connector body defining a longitudinal axis that extends through the connector body in an orientation that extends from the front end to the rear end of the connector body;
an optical fiber that extends through the connector body from the rear end to the front end, the optical fiber having a fiber end accessible at the front end of the connector body;
a nose piece mounted at the front end of the connector body, the nose piece defining a fiber passage through which the optical fiber extends, the nose piece being movable along the longitudinal axis between an extended position where a front end portion of the optical fiber is protected within the fiber passage and a retracted position where the front end portion of the optical fiber projects forwardly beyond the nose piece; and
a shutter mounted at the front end of the connector body, the shutter being moveable between a first position where the shutter covers the nose piece and a second position where the nose piece is exposed; and
an adapter for coupling the first and second fiber optic connectors together such that optical signals can be conveyed between the optical fibers of the first and second fiber optic connectors, the adapter having an alignment passage for receiving and co-axially aligning the front end portions of the optical fibers. 7. The fiber optic connection system of claim 6, wherein the adapter includes opposite first and second adapter ports for respectively receiving the first and second connectors, wherein the shutters move from the first positon to the second position as the first and second fiber optic connectors are inserted into their respective first and second ports, and wherein the nose pieces move from the extended positions to the retracted positions as the first and second connectors are inserted into their respective first and second ports. 8. The fiber optic connection system of claim 7, where shutters move at least partially toward the second positions prior to the nose pieces beginning to move from the extended positions toward the retracted positions. 9. The fiber optic connection system of claim 8, wherein the fiber passages of the nose pieces co-axially align with the alignment passage of the adapter to assist in guiding the front end portions of the optical fibers into the alignment passage. 10. The fiber optic connection system of claim 9, wherein the alignment passage is defined by an open sided groove, and wherein the adapter includes resilient structures for biasing the front end portions of the optical fibers into the open sided groove. 11. The fiber optic connection system of claim 10, wherein the alignment passage is defined by a fiber alignment structure of the adapter, wherein the fiber alignment structure includes first and second opposite ends, and wherein the nose pieces of the first and second connectors respectively abut against the first and second ends of the fiber alignment structure when the first and second connectors are inserted into the first and second ports. 12. A fiber optic connector comprising:
a connector body having a front end and an opposite rear end, the connector body defining a longitudinal axis that extends through the connector body in an orientation that extends from the front end to the rear end of the connector body; a plurality of optical fibers that extend through the connector body from the rear end to the front end, the optical fibers having fiber ends accessible at the front end of the connector body; and a nose piece mounted at the front end of the connector body, the nose piece defining a plurality of fiber passages through which the optical fibers extend, the nose piece being movable along the longitudinal axis between an extended position where front end portions of the optical fibers are protected within the fiber passages and a retracted position where the front end portions of the optical fibers project forwardly beyond the nose piece. 13. The fiber optic connector of claim 12, wherein the fiber optic connector includes a fiber anchoring region for anchoring the optical fibers relative to the connector body, and wherein the fiber optic connector defines a fiber buckling region between the fiber anchoring region and the front end portions of the optical fibers. 14. The fiber optic connector of claim 13, wherein the fiber optic connector includes a stack of fiber management trays positioned within the connector body, the fiber management trays defining a separate fiber buckling slot corresponding to each of the optical fibers, the fiber anchoring region also being defined within the stack of fiber management trays. 15. The fiber optic connector of claim 14, wherein the nose piece moves along the longitudinal axis relative to the stack of fiber management trays, and wherein the fiber buckling slots align with the fiber passages of the nose piece. 16. The fiber optic connector of claim 12, wherein the fiber optic connector is configured to interface with a fiber optic adapter, wherein the fiber optic adapter includes alignment projections, wherein the connector body defines alignment openings that receive the alignment projections when the fiber optic connector is inserted into the fiber optic adapter, wherein the nose piece has flanges positioned within the fiber optic connector, and wherein the alignment projections contact the flanges to push the nose piece form the extend portion to the retracted position as the fiber optic connector is inserted into the fiber optic adapter. 17. The fiber optic connector of claim 16, wherein the fiber optic adapter includes a stack of alignment trays that define an array of v-grooves for receiving the front end portions of the optical fibers. | The present disclosure relates to fiber optic connection systems including fiber optic connector having retractable noses for protecting bare fiber ends of ferrule-less connectors. In certain examples, the retractable noses are used in combination with protective shutters. In other examples, the retractable noses can accommodate multiple optical fibers.1. A fiber optic connector comprising:
a connector body having a front end and an opposite rear end, the connector body defining a longitudinal axis that extends through the connector body in an orientation that extends from the front end to the rear end of the connector body; an optical fiber that extends through the connector body from the rear end to the front end, the optical fiber having a fiber end accessible at the front end of the connector body; a nose piece mounted at the front end of the connector body, the nose piece defining a fiber passage through which the optical fiber extends, the nose piece being movable along the longitudinal axis between an extended position where a front end portion of the optical fiber is protected within the fiber passage and a retracted position where the front end portion of the optical fiber projects forwardly beyond the nose piece; and a shutter mounted at the front end of the connector body, the shutter being moveable between a first position where the shutter covers the nose piece and a second position where the nose piece is exposed. 2. The fiber optic connector of claim 1, wherein the nose piece is spring biased toward the extended position, and wherein the nose piece retracts back into the connector body as the nose piece moves from the extended position toward the retracted position. 3. The fiber optic connector of claim 2, wherein the shutter pivots relative to the connector body as the shutter moves between the first and second positions. 4. The fiber optic connector of claim 1, wherein the front end portion of the optical fiber is a bare glass portion that does not have a ferrule secured thereto. 5. The fiber optic connector of claim 3, further comprising a latch for retaining the shutter in the first position. 6. A fiber optic connection system comprising:
first and second fiber optic connectors each including:
a connector body having a front end and an opposite rear end, the connector body defining a longitudinal axis that extends through the connector body in an orientation that extends from the front end to the rear end of the connector body;
an optical fiber that extends through the connector body from the rear end to the front end, the optical fiber having a fiber end accessible at the front end of the connector body;
a nose piece mounted at the front end of the connector body, the nose piece defining a fiber passage through which the optical fiber extends, the nose piece being movable along the longitudinal axis between an extended position where a front end portion of the optical fiber is protected within the fiber passage and a retracted position where the front end portion of the optical fiber projects forwardly beyond the nose piece; and
a shutter mounted at the front end of the connector body, the shutter being moveable between a first position where the shutter covers the nose piece and a second position where the nose piece is exposed; and
an adapter for coupling the first and second fiber optic connectors together such that optical signals can be conveyed between the optical fibers of the first and second fiber optic connectors, the adapter having an alignment passage for receiving and co-axially aligning the front end portions of the optical fibers. 7. The fiber optic connection system of claim 6, wherein the adapter includes opposite first and second adapter ports for respectively receiving the first and second connectors, wherein the shutters move from the first positon to the second position as the first and second fiber optic connectors are inserted into their respective first and second ports, and wherein the nose pieces move from the extended positions to the retracted positions as the first and second connectors are inserted into their respective first and second ports. 8. The fiber optic connection system of claim 7, where shutters move at least partially toward the second positions prior to the nose pieces beginning to move from the extended positions toward the retracted positions. 9. The fiber optic connection system of claim 8, wherein the fiber passages of the nose pieces co-axially align with the alignment passage of the adapter to assist in guiding the front end portions of the optical fibers into the alignment passage. 10. The fiber optic connection system of claim 9, wherein the alignment passage is defined by an open sided groove, and wherein the adapter includes resilient structures for biasing the front end portions of the optical fibers into the open sided groove. 11. The fiber optic connection system of claim 10, wherein the alignment passage is defined by a fiber alignment structure of the adapter, wherein the fiber alignment structure includes first and second opposite ends, and wherein the nose pieces of the first and second connectors respectively abut against the first and second ends of the fiber alignment structure when the first and second connectors are inserted into the first and second ports. 12. A fiber optic connector comprising:
a connector body having a front end and an opposite rear end, the connector body defining a longitudinal axis that extends through the connector body in an orientation that extends from the front end to the rear end of the connector body; a plurality of optical fibers that extend through the connector body from the rear end to the front end, the optical fibers having fiber ends accessible at the front end of the connector body; and a nose piece mounted at the front end of the connector body, the nose piece defining a plurality of fiber passages through which the optical fibers extend, the nose piece being movable along the longitudinal axis between an extended position where front end portions of the optical fibers are protected within the fiber passages and a retracted position where the front end portions of the optical fibers project forwardly beyond the nose piece. 13. The fiber optic connector of claim 12, wherein the fiber optic connector includes a fiber anchoring region for anchoring the optical fibers relative to the connector body, and wherein the fiber optic connector defines a fiber buckling region between the fiber anchoring region and the front end portions of the optical fibers. 14. The fiber optic connector of claim 13, wherein the fiber optic connector includes a stack of fiber management trays positioned within the connector body, the fiber management trays defining a separate fiber buckling slot corresponding to each of the optical fibers, the fiber anchoring region also being defined within the stack of fiber management trays. 15. The fiber optic connector of claim 14, wherein the nose piece moves along the longitudinal axis relative to the stack of fiber management trays, and wherein the fiber buckling slots align with the fiber passages of the nose piece. 16. The fiber optic connector of claim 12, wherein the fiber optic connector is configured to interface with a fiber optic adapter, wherein the fiber optic adapter includes alignment projections, wherein the connector body defines alignment openings that receive the alignment projections when the fiber optic connector is inserted into the fiber optic adapter, wherein the nose piece has flanges positioned within the fiber optic connector, and wherein the alignment projections contact the flanges to push the nose piece form the extend portion to the retracted position as the fiber optic connector is inserted into the fiber optic adapter. 17. The fiber optic connector of claim 16, wherein the fiber optic adapter includes a stack of alignment trays that define an array of v-grooves for receiving the front end portions of the optical fibers. | 2,800 |
11,255 | 11,255 | 14,263,630 | 2,811 | An active pixel image sensor includes a photodiode structure which enables high near-infrared modulation transfer function and high quantum efficiency, with low pinning voltage for a medium- to large-size pixel. The photodiode includes a shallow photodiode region and a deep photodiode region both of a first dopant type, where the length of the shallow photodiode region is larger than the length of the deep photodiode region; and a shallow depleting region and a deep depleting region both of a second dopant type. The deep depleting region surrounds the deep photodiode region on at least two opposite sides. | 1. An image sensing device comprising:
a photodiode region of a first dopant type, the photodiode region including a shallow photodiode region and a first deep photodiode region, wherein a length of the shallow photodiode region is larger than a length of the first deep photodiode region; and a depleting region of a second dopant type, the depleting region including a shallow depleting region and a deep depleting region, wherein the deep depleting region surrounds the first deep photodiode region on at least two opposite sides, wherein the second dopant type is of opposite dopant type to the first dopant type. 2. The image sensing device according to claim 1, wherein the entire photodiode region is configured to be fully depleted of carriers during a photodiode reset. 3. The image sensing device according to claim 1, wherein a depth of the first deep photodiode region is substantially equal to a depth of the deep depleting region. 4. The image sensing device according to claim 1, wherein the photodiode region further includes a second deep photodiode region, wherein a length of the second deep photodiode region is larger than the length of the first deep photodiode region. 5. The image sensing device according to claim 4, wherein the second deep photodiode region is deeper than the deep depleting region. 6. The image sensing device according to claim 1, further comprising a gate oxide layer. 7. The image sensing device according to claim 6, wherein the first deep photodiode region and the deep depleting region are formed before the gate oxide layer. 8. The image sensing device according to claim 6, wherein the photodiode region is formed before the gate oxide layer, and the depleting region is formed after the gate oxide layer. 9. The image sensing device according to claim 6, wherein the depleting region is formed before the gate oxide layer, and the photodiode region is formed after the gate oxide layer. 10. The image sensing device according to claim 1, wherein the image sensing device is configured as a back-side illumination type image sensing device. 11. An electronic apparatus comprising:
an optical system; an image sensing device configured to receive incident light from the optical system, wherein the image sensing device is an image sensing device according to claim 1; and a signal processor configured to receive signals from the image sensing device and output data. 12. A method of manufacturing an image sensing device comprising:
forming a photodiode region of a first dopant type, the photodiode region including a shallow photodiode region and a first deep photodiode region, wherein a length of the shallow photodiode region is larger than a length of the first deep photodiode region; and forming a depleting region of a second dopant type, the depleting region including a shallow depleting region and a deep depleting region, wherein the deep depleting region surrounds the first deep photodiode region on at least two opposite sides, wherein the second dopant type is of opposite dopant type to the first dopant type. 13. The method of manufacturing an image sensing device according to claim 12, wherein the entire photodiode region is configured to be fully depleted of carriers during a photodiode reset. 14. The method of manufacturing an image sensing device according to claim 12, wherein a depth of the first deep photodiode region is substantially equal to a depth of the deep depleting region. 15. The method of manufacturing an image sensing device according to claim 12, wherein the photodiode region further includes a second deep photodiode region, wherein a length of the second deep photodiode region is larger than the length of the first deep photodiode region. 16. The method of manufacturing an image sensing device according to claim 15, wherein the second deep photodiode region is deeper than the deep depleting region. 17. The method of manufacturing an image sensing device according to claim 12, further comprising forming a gate oxide layer. 18. The method of manufacturing an image sensing device according to claim 17, further comprising forming the first deep photodiode region and the deep depleting region before forming the gate oxide layer. 19. The method of manufacturing an image sensing device according to claim 17, further comprising forming the photodiode region before forming the gate oxide layer, and forming the depleting region after forming the gate oxide layer. 20. The method of manufacturing an image sensing device according to claim 17, further comprising forming the depleting region before forming the gate oxide layer, and forming the photodiode region after forming the gate oxide layer. 21. The method of manufacturing an image sensing device according to claim 12, wherein the image sensing device is configured as a back-side illumination type image sensing device. | An active pixel image sensor includes a photodiode structure which enables high near-infrared modulation transfer function and high quantum efficiency, with low pinning voltage for a medium- to large-size pixel. The photodiode includes a shallow photodiode region and a deep photodiode region both of a first dopant type, where the length of the shallow photodiode region is larger than the length of the deep photodiode region; and a shallow depleting region and a deep depleting region both of a second dopant type. The deep depleting region surrounds the deep photodiode region on at least two opposite sides.1. An image sensing device comprising:
a photodiode region of a first dopant type, the photodiode region including a shallow photodiode region and a first deep photodiode region, wherein a length of the shallow photodiode region is larger than a length of the first deep photodiode region; and a depleting region of a second dopant type, the depleting region including a shallow depleting region and a deep depleting region, wherein the deep depleting region surrounds the first deep photodiode region on at least two opposite sides, wherein the second dopant type is of opposite dopant type to the first dopant type. 2. The image sensing device according to claim 1, wherein the entire photodiode region is configured to be fully depleted of carriers during a photodiode reset. 3. The image sensing device according to claim 1, wherein a depth of the first deep photodiode region is substantially equal to a depth of the deep depleting region. 4. The image sensing device according to claim 1, wherein the photodiode region further includes a second deep photodiode region, wherein a length of the second deep photodiode region is larger than the length of the first deep photodiode region. 5. The image sensing device according to claim 4, wherein the second deep photodiode region is deeper than the deep depleting region. 6. The image sensing device according to claim 1, further comprising a gate oxide layer. 7. The image sensing device according to claim 6, wherein the first deep photodiode region and the deep depleting region are formed before the gate oxide layer. 8. The image sensing device according to claim 6, wherein the photodiode region is formed before the gate oxide layer, and the depleting region is formed after the gate oxide layer. 9. The image sensing device according to claim 6, wherein the depleting region is formed before the gate oxide layer, and the photodiode region is formed after the gate oxide layer. 10. The image sensing device according to claim 1, wherein the image sensing device is configured as a back-side illumination type image sensing device. 11. An electronic apparatus comprising:
an optical system; an image sensing device configured to receive incident light from the optical system, wherein the image sensing device is an image sensing device according to claim 1; and a signal processor configured to receive signals from the image sensing device and output data. 12. A method of manufacturing an image sensing device comprising:
forming a photodiode region of a first dopant type, the photodiode region including a shallow photodiode region and a first deep photodiode region, wherein a length of the shallow photodiode region is larger than a length of the first deep photodiode region; and forming a depleting region of a second dopant type, the depleting region including a shallow depleting region and a deep depleting region, wherein the deep depleting region surrounds the first deep photodiode region on at least two opposite sides, wherein the second dopant type is of opposite dopant type to the first dopant type. 13. The method of manufacturing an image sensing device according to claim 12, wherein the entire photodiode region is configured to be fully depleted of carriers during a photodiode reset. 14. The method of manufacturing an image sensing device according to claim 12, wherein a depth of the first deep photodiode region is substantially equal to a depth of the deep depleting region. 15. The method of manufacturing an image sensing device according to claim 12, wherein the photodiode region further includes a second deep photodiode region, wherein a length of the second deep photodiode region is larger than the length of the first deep photodiode region. 16. The method of manufacturing an image sensing device according to claim 15, wherein the second deep photodiode region is deeper than the deep depleting region. 17. The method of manufacturing an image sensing device according to claim 12, further comprising forming a gate oxide layer. 18. The method of manufacturing an image sensing device according to claim 17, further comprising forming the first deep photodiode region and the deep depleting region before forming the gate oxide layer. 19. The method of manufacturing an image sensing device according to claim 17, further comprising forming the photodiode region before forming the gate oxide layer, and forming the depleting region after forming the gate oxide layer. 20. The method of manufacturing an image sensing device according to claim 17, further comprising forming the depleting region before forming the gate oxide layer, and forming the photodiode region after forming the gate oxide layer. 21. The method of manufacturing an image sensing device according to claim 12, wherein the image sensing device is configured as a back-side illumination type image sensing device. | 2,800 |
11,256 | 11,256 | 14,847,999 | 2,891 | Radio frequency identification (RFID) tags and processes for manufacturing the same. The RFID device generally includes (1) a metal antenna and/or inductor; (2) a dielectric layer thereon, to support and insulate integrated circuitry from the metal antenna and/or inductor; (3) a plurality of diodes and a plurality of transistors on the dielectric layer, the diodes having at least one layer in common with the transistors; and (4) a plurality of capacitors in electrical communication with the metal antenna and/or inductor and at least some of the diodes, the plurality of capacitors having at least one layer in common with the plurality of diodes and/or with contacts to the diodes and transistors. The method preferably integrates liquid silicon-containing ink deposition into a cost effective, integrated manufacturing process for the manufacture of RFID circuits. Furthermore, the present RFID tags generally provide higher performance (e.g., improved electrical characteristics) as compared to tags containing organic electronic devices. | 1. A device, comprising:
a) an electrically active substrate; b) a dielectric layer thereon, configured to insulate integrated circuitry from said metal-containing substrate; c) a plurality of diodes and a plurality of thin film transistors on said dielectric layer, said diodes having at least one first semiconductor layer in common with said thin film transistors, said at least one first semiconductor layer being formed from a liquid-phase ink comprising silicon; and d) a plurality of capacitors in electrical communication with at least some of said diodes, said plurality of capacitors having at least one metal layer in common with contacts to said diodes and thin film transistors. 2. The device of claim 1, wherein said plurality of diodes have at least two different semiconductor layers in common with said plurality of thin film transistors. 3. The device of claim 2, wherein a first of said at least two different semiconductor layers comprises a lightly doped inorganic semiconductor and a second of said at least two different semiconductor layers comprises a heavily doped inorganic semiconductor. 4. The device of claim 1, wherein said plurality of diodes comprise diode-wired thin film transistors. 5. The device of claim 1, further comprising an interlayer dielectric on or over said plurality of thin film transistors. 6. The device of claim 5, further comprising a metallization layer over said interlayer dielectric, in electrical communication with said plurality of diodes and said plurality of thin film transistors. 7. The device of claim 6, wherein said plurality of capacitors have an upper plate comprising said metallization layer. 8. The device of claim 1, comprising a logic block and a memory block, said logic block communicating with said memory block and comprising a first subset of said thin film transistors, and said memory block comprising a first subset of said diodes and/or a second subset of said thin film transistors. 9. The device of claim 8, further comprising an input/output control (sub)block comprising a third subset of said thin film transistors. 10. The device of claim 1, wherein the plurality of thin film transistors is in a first region of the device and the plurality of diodes is in a second region of the device. 11. The device of claim 1, wherein the electrically active substrate comprises a metal foil. 12. An integrated circuit comprising:
a) an electrically active substrate; b) a dielectric layer on the substrate; c) a plurality of first semiconductor layer elements formed from a liquid-phase ink comprising silicon, the plurality of first semiconductor layer elements comprising a thin film transistor channel region in a first region of the substrate and a first diode layer element in a second region of the substrate; d) a plurality of second semiconductor layer elements comprising a second semiconductor layer in the first region of the substrate and a second diode layer element in the second region of the substrate; and e) a plurality of metal elements on or over the first semiconductor layer elements and the second semiconductor layer elements, the metal elements comprising (i) a metal contact on or over the first and second semiconductor layer elements in the first region of the substrate, (ii) a metal gate over the thin film transistor channel region, (iii) a diode contact on or over the first and second semiconductor layer elements in the second region of the substrate, and (iv) a capacitor plate in a third region of the substrate. 13. The integrated circuit of claim 12, wherein the electrically active substrate comprises a metal foil. 14. The integrated circuit of claim 12, further comprising a capacitor in a third region of the substrate, wherein the plurality of first semiconductor layer elements comprise at least one lower capacitor plate and the plurality of metal elements comprise at least one upper capacitor plate in the third region of the substrate. 15. A method of making an integrated circuit, comprising:
a) forming a dielectric layer on an electrically active substrate; b) forming, from a first silicon-containing ink, a plurality of first semiconductor elements in a first pattern on the dielectric layer, said first semiconductor layer elements comprising a thin film transistor channel region in a first region of the substrate and a first diode layer element in a second region of the substrate; c) forming a plurality of second semiconductor layer elements different from said first semiconductor layer elements in a second pattern on at least one of said first semiconductor layer elements and said dielectric layer, said second semiconductor layer elements comprising a second semiconductor layer in the first region of the electrically active substrate and a second diode layer element in the second region of the electrically active substrate; and d) forming a plurality of metal elements on or over the first semiconductor layer elements and the second semiconductor layer elements, the metal elements comprising a metal contact in the first region of the electrically active substrate, a metal gate over the thin film transistor channel region, a diode contact in the second region of the electrically active substrate, and a capacitor plate in a third region of the electrically active substrate. 16. The method of claim 15, wherein said electrically active substrate comprises a metal foil. 17. The method of claim 15, wherein at least one of said plurality of first and second semiconductor layer elements further comprises at least one capacitor plate in said third region of the electrically active substrate. 18. The method of claim 15, further comprising, before forming said plurality of metal elements, growing an oxide on exposed surfaces of said first semiconductor layer elements and/or second semiconductor layer elements. 19. The method of claim 15, wherein forming at least one of said first and second semiconductor layer elements comprises printing a corresponding silicon-containing ink. 20. The method of claim 15, further comprising, before forming said plurality of metal elements, forming an interlayer dielectric on or over said first and second semiconductor layer elements, and forming a plurality of openings in said interlayer dielectric to expose surfaces of at least some of said first and second semiconductor layer elements. | Radio frequency identification (RFID) tags and processes for manufacturing the same. The RFID device generally includes (1) a metal antenna and/or inductor; (2) a dielectric layer thereon, to support and insulate integrated circuitry from the metal antenna and/or inductor; (3) a plurality of diodes and a plurality of transistors on the dielectric layer, the diodes having at least one layer in common with the transistors; and (4) a plurality of capacitors in electrical communication with the metal antenna and/or inductor and at least some of the diodes, the plurality of capacitors having at least one layer in common with the plurality of diodes and/or with contacts to the diodes and transistors. The method preferably integrates liquid silicon-containing ink deposition into a cost effective, integrated manufacturing process for the manufacture of RFID circuits. Furthermore, the present RFID tags generally provide higher performance (e.g., improved electrical characteristics) as compared to tags containing organic electronic devices.1. A device, comprising:
a) an electrically active substrate; b) a dielectric layer thereon, configured to insulate integrated circuitry from said metal-containing substrate; c) a plurality of diodes and a plurality of thin film transistors on said dielectric layer, said diodes having at least one first semiconductor layer in common with said thin film transistors, said at least one first semiconductor layer being formed from a liquid-phase ink comprising silicon; and d) a plurality of capacitors in electrical communication with at least some of said diodes, said plurality of capacitors having at least one metal layer in common with contacts to said diodes and thin film transistors. 2. The device of claim 1, wherein said plurality of diodes have at least two different semiconductor layers in common with said plurality of thin film transistors. 3. The device of claim 2, wherein a first of said at least two different semiconductor layers comprises a lightly doped inorganic semiconductor and a second of said at least two different semiconductor layers comprises a heavily doped inorganic semiconductor. 4. The device of claim 1, wherein said plurality of diodes comprise diode-wired thin film transistors. 5. The device of claim 1, further comprising an interlayer dielectric on or over said plurality of thin film transistors. 6. The device of claim 5, further comprising a metallization layer over said interlayer dielectric, in electrical communication with said plurality of diodes and said plurality of thin film transistors. 7. The device of claim 6, wherein said plurality of capacitors have an upper plate comprising said metallization layer. 8. The device of claim 1, comprising a logic block and a memory block, said logic block communicating with said memory block and comprising a first subset of said thin film transistors, and said memory block comprising a first subset of said diodes and/or a second subset of said thin film transistors. 9. The device of claim 8, further comprising an input/output control (sub)block comprising a third subset of said thin film transistors. 10. The device of claim 1, wherein the plurality of thin film transistors is in a first region of the device and the plurality of diodes is in a second region of the device. 11. The device of claim 1, wherein the electrically active substrate comprises a metal foil. 12. An integrated circuit comprising:
a) an electrically active substrate; b) a dielectric layer on the substrate; c) a plurality of first semiconductor layer elements formed from a liquid-phase ink comprising silicon, the plurality of first semiconductor layer elements comprising a thin film transistor channel region in a first region of the substrate and a first diode layer element in a second region of the substrate; d) a plurality of second semiconductor layer elements comprising a second semiconductor layer in the first region of the substrate and a second diode layer element in the second region of the substrate; and e) a plurality of metal elements on or over the first semiconductor layer elements and the second semiconductor layer elements, the metal elements comprising (i) a metal contact on or over the first and second semiconductor layer elements in the first region of the substrate, (ii) a metal gate over the thin film transistor channel region, (iii) a diode contact on or over the first and second semiconductor layer elements in the second region of the substrate, and (iv) a capacitor plate in a third region of the substrate. 13. The integrated circuit of claim 12, wherein the electrically active substrate comprises a metal foil. 14. The integrated circuit of claim 12, further comprising a capacitor in a third region of the substrate, wherein the plurality of first semiconductor layer elements comprise at least one lower capacitor plate and the plurality of metal elements comprise at least one upper capacitor plate in the third region of the substrate. 15. A method of making an integrated circuit, comprising:
a) forming a dielectric layer on an electrically active substrate; b) forming, from a first silicon-containing ink, a plurality of first semiconductor elements in a first pattern on the dielectric layer, said first semiconductor layer elements comprising a thin film transistor channel region in a first region of the substrate and a first diode layer element in a second region of the substrate; c) forming a plurality of second semiconductor layer elements different from said first semiconductor layer elements in a second pattern on at least one of said first semiconductor layer elements and said dielectric layer, said second semiconductor layer elements comprising a second semiconductor layer in the first region of the electrically active substrate and a second diode layer element in the second region of the electrically active substrate; and d) forming a plurality of metal elements on or over the first semiconductor layer elements and the second semiconductor layer elements, the metal elements comprising a metal contact in the first region of the electrically active substrate, a metal gate over the thin film transistor channel region, a diode contact in the second region of the electrically active substrate, and a capacitor plate in a third region of the electrically active substrate. 16. The method of claim 15, wherein said electrically active substrate comprises a metal foil. 17. The method of claim 15, wherein at least one of said plurality of first and second semiconductor layer elements further comprises at least one capacitor plate in said third region of the electrically active substrate. 18. The method of claim 15, further comprising, before forming said plurality of metal elements, growing an oxide on exposed surfaces of said first semiconductor layer elements and/or second semiconductor layer elements. 19. The method of claim 15, wherein forming at least one of said first and second semiconductor layer elements comprises printing a corresponding silicon-containing ink. 20. The method of claim 15, further comprising, before forming said plurality of metal elements, forming an interlayer dielectric on or over said first and second semiconductor layer elements, and forming a plurality of openings in said interlayer dielectric to expose surfaces of at least some of said first and second semiconductor layer elements. | 2,800 |
11,257 | 11,257 | 14,945,742 | 2,856 | A gas sensor is provided which includes a hollow metallic housing, a sensor device installed in the housing, and a seal disposed in the housing to hermetically isolate between the housing and the sensor device. The housing has an inner shoulder formed on an inner periphery thereof. The seal is retained on the inner shoulder. The seal is made up of a powder body and a glass body. The powder body is made of inorganic powder and mounted on the inner shoulder. The glass body is arranged on the powder body and has a varying coefficient of thermal expansion which alleviates a difference in thermal expansion between the sensor device and the housing, thereby ensuring the stability of hermetic sealing ability of the seal in high-temperature environments. | 1. A gas sensor comprising:
a metallic housing which has a given length with a front end and a rear end, the housing also having a hole formed therein; an inner shoulder formed on an inner periphery of the housing to define a rear hole portion of the hole of the housing, the rear hole portion being closer to the rear end of the housing than the inner shoulder is; a sensor device which is disposed in the hole of the housing and includes a gas sensing device with a ceramic outer surface or an assembly of a ceramic body and the gas sensing device inserted into the ceramic body; and a seal which hermetically seals between the sensor device and the housing, the seal being disposed in the rear hole portion of the housing and including a powder body and a glass body, the powder body being made of inorganic powder and mounted on the inner shoulder within the rear hole portion, the glass body being arranged on the powder body and having a graduated thermal expansion structure which alleviates a difference in thermal expansion between the sensor device and the housing. 2. A gas sensor as set forth in claim 1, wherein the hole of the housing also has a front hole portion which is closer to the front end of the housing than the rear hole portion is, the rear hole portion being greater in inner diameter than the front hole portion, and wherein the inner shoulder is located at a boundary between the front hole portion and the rear hole portion, the inner shoulder extending substantially perpendicular or inclining to the inner periphery of the housing. 3. A gas sensor as set forth in claim 1, wherein the inner shoulder is defined by a protrusion which is formed on the inner periphery of the housing and faces inwardly within the hole of the housing. 4. A gas sensor as set forth in claim 1, wherein the glass body includes a plurality of glass layers whose coefficient of thermal expansion become greater stepwise outwardly in a radial direction of the glass body. 5. A gas sensor as set forth in claim 1, wherein the inorganic powder making the powder body is talc. 6. A gas sensor as set forth in claim 1, wherein the sensor device is made only of the gas sensing device. 7. A gas sensor as set forth in claim 1, wherein the glass body has a length in an axial direction of the gas sensor, the length being 1 to 8 mm. | A gas sensor is provided which includes a hollow metallic housing, a sensor device installed in the housing, and a seal disposed in the housing to hermetically isolate between the housing and the sensor device. The housing has an inner shoulder formed on an inner periphery thereof. The seal is retained on the inner shoulder. The seal is made up of a powder body and a glass body. The powder body is made of inorganic powder and mounted on the inner shoulder. The glass body is arranged on the powder body and has a varying coefficient of thermal expansion which alleviates a difference in thermal expansion between the sensor device and the housing, thereby ensuring the stability of hermetic sealing ability of the seal in high-temperature environments.1. A gas sensor comprising:
a metallic housing which has a given length with a front end and a rear end, the housing also having a hole formed therein; an inner shoulder formed on an inner periphery of the housing to define a rear hole portion of the hole of the housing, the rear hole portion being closer to the rear end of the housing than the inner shoulder is; a sensor device which is disposed in the hole of the housing and includes a gas sensing device with a ceramic outer surface or an assembly of a ceramic body and the gas sensing device inserted into the ceramic body; and a seal which hermetically seals between the sensor device and the housing, the seal being disposed in the rear hole portion of the housing and including a powder body and a glass body, the powder body being made of inorganic powder and mounted on the inner shoulder within the rear hole portion, the glass body being arranged on the powder body and having a graduated thermal expansion structure which alleviates a difference in thermal expansion between the sensor device and the housing. 2. A gas sensor as set forth in claim 1, wherein the hole of the housing also has a front hole portion which is closer to the front end of the housing than the rear hole portion is, the rear hole portion being greater in inner diameter than the front hole portion, and wherein the inner shoulder is located at a boundary between the front hole portion and the rear hole portion, the inner shoulder extending substantially perpendicular or inclining to the inner periphery of the housing. 3. A gas sensor as set forth in claim 1, wherein the inner shoulder is defined by a protrusion which is formed on the inner periphery of the housing and faces inwardly within the hole of the housing. 4. A gas sensor as set forth in claim 1, wherein the glass body includes a plurality of glass layers whose coefficient of thermal expansion become greater stepwise outwardly in a radial direction of the glass body. 5. A gas sensor as set forth in claim 1, wherein the inorganic powder making the powder body is talc. 6. A gas sensor as set forth in claim 1, wherein the sensor device is made only of the gas sensing device. 7. A gas sensor as set forth in claim 1, wherein the glass body has a length in an axial direction of the gas sensor, the length being 1 to 8 mm. | 2,800 |
11,258 | 11,258 | 14,899,898 | 2,847 | A method for manufacturing an electrical cable includes providing at least one core including an electrical conductor, and arranging at least one copper sheath around the at least one core. The arranging of the copper sheath includes providing at least one foil of copper having two opposite first edges; bending the foil of copper around the core until the first edges of the foil of copper are contacted with each other; welding the first edges of the foil of copper to each other to form a corresponding solder jointwelded joint; and deposing a copper coating on at least portions of the surface of the foil of copper at the welded joint. The deposing the copper coating is carried out by means of a thermal spray process. | 1-12. (canceled) 13. A method for manufacturing a power cable comprising:
providing at least one core comprising an electrical conductor; arranging at least one copper sheath around the at least one core, said arranging the copper sheath comprising: providing at least one copper foil having two opposite first edges; bending the copper foil around the core until the first edges of the copper foil are contacted to each other; welding the first edges of the copper foil to each other to form a corresponding welded joint; and deposing a copper coating on copper foil at the welded joint, wherein said deposing the copper coating is carried out by a thermal spray process. 14. The method of claim 13, wherein said deposing the copper coating is carried out by a thermal spray process selected from flame spray and cold spray processes. 15. The method of claim 14, wherein the flame spray process is selected from flare powder spray and high-velocity oxyfuel spray. 16. The method of claim 14, wherein said deposing the copper coating is carried out by cold spray process. 17. The method of claim 15, further comprising, after welding the first edges and before deposing the copper coating:
roughening copper foil at substantially the welded joint. 18. The method of claim 17, wherein said roughening comprises:
propelling a stream of abrasive material against the surface of the foil of copper at the welded joint. 19. The method of claim 13, wherein the cable is a multi-core cable comprising a plurality of cores, said arranging at least one copper sheath around the at least one core comprising:
arranging a respective copper sheath around each core. 20. The method of claim 13, wherein deposing a copper coating provides a copper coating having a thickness of from 100 μm to 500 μm. 21. The method of claim 13, wherein deposing a copper coating provides a copper coating having a thickness of from 150 μm to 300 μm. 22. A power cable comprising:
at least one core comprising an electrical conductor; at least one copper sheath surrounding the at least one core, the copper sheath having a welded joint; and a thermal sprayed copper coating on at least the welded joint. 23. The power cable of claim 22, wherein said cable is an underwater cable. 24. The power cable of claim 22, wherein said cable is an underground cable. | A method for manufacturing an electrical cable includes providing at least one core including an electrical conductor, and arranging at least one copper sheath around the at least one core. The arranging of the copper sheath includes providing at least one foil of copper having two opposite first edges; bending the foil of copper around the core until the first edges of the foil of copper are contacted with each other; welding the first edges of the foil of copper to each other to form a corresponding solder jointwelded joint; and deposing a copper coating on at least portions of the surface of the foil of copper at the welded joint. The deposing the copper coating is carried out by means of a thermal spray process.1-12. (canceled) 13. A method for manufacturing a power cable comprising:
providing at least one core comprising an electrical conductor; arranging at least one copper sheath around the at least one core, said arranging the copper sheath comprising: providing at least one copper foil having two opposite first edges; bending the copper foil around the core until the first edges of the copper foil are contacted to each other; welding the first edges of the copper foil to each other to form a corresponding welded joint; and deposing a copper coating on copper foil at the welded joint, wherein said deposing the copper coating is carried out by a thermal spray process. 14. The method of claim 13, wherein said deposing the copper coating is carried out by a thermal spray process selected from flame spray and cold spray processes. 15. The method of claim 14, wherein the flame spray process is selected from flare powder spray and high-velocity oxyfuel spray. 16. The method of claim 14, wherein said deposing the copper coating is carried out by cold spray process. 17. The method of claim 15, further comprising, after welding the first edges and before deposing the copper coating:
roughening copper foil at substantially the welded joint. 18. The method of claim 17, wherein said roughening comprises:
propelling a stream of abrasive material against the surface of the foil of copper at the welded joint. 19. The method of claim 13, wherein the cable is a multi-core cable comprising a plurality of cores, said arranging at least one copper sheath around the at least one core comprising:
arranging a respective copper sheath around each core. 20. The method of claim 13, wherein deposing a copper coating provides a copper coating having a thickness of from 100 μm to 500 μm. 21. The method of claim 13, wherein deposing a copper coating provides a copper coating having a thickness of from 150 μm to 300 μm. 22. A power cable comprising:
at least one core comprising an electrical conductor; at least one copper sheath surrounding the at least one core, the copper sheath having a welded joint; and a thermal sprayed copper coating on at least the welded joint. 23. The power cable of claim 22, wherein said cable is an underwater cable. 24. The power cable of claim 22, wherein said cable is an underground cable. | 2,800 |
11,259 | 11,259 | 15,584,727 | 2,896 | A light trapping optical structure employing an optically transmissive layer with a plurality of light deflecting elements. The transparent layer is defined by opposing broad-area surfaces extending parallel to each other. The light deflecting elements deflect light propagating transversely through the optically transmissive layer at a sufficiently high bend angle with respect to a surface normal, above a critical angle of a Total Internal Reflection. The deflected light is retained by means of at least TIR in the system which allows for longer light propagation paths through a photoabsorptive layer that may be associated with the optically transmissive layer for an improved light absorption. The light trapping optical structure may further employ a focusing array of light collectors being pairwise associated with the respective light deflecting elements. | 1. A light trapping optical structure, comprising:
a layer of an optically transmissive material defined by a first broad-area surface and an opposing second broad-area surface extending generally parallel to said first broad-area surface, each of said first and second broad-area surfaces being characterized by a stepped drop in a refractive index outwardly from said layer of an optically transmissive material and by a critical angle of a Total Internal Reflection; a plurality of light deflecting elements associated with said layer of an optically transmissive material, said plurality of light deflecting elements being distributed over a prevailing plane of said layer of an optically transmissive material according to a predetermined pattern; and a reflective surface located outside of said layer of an optically transmissive material, extending parallel to said prevailing plane, and disposed in energy exchange relationship with said layer of an optically transmissive material; wherein said light deflecting elements are spaced apart from by each other by spacing areas that are greater than apertures of said light deflecting elements such that a cumulative aperture of said plurality of light deflecting elements is substantially smaller than areas of said first and second broad-area surfaces; wherein said layer of an optically transmissive material is configured to receive light on either the first or the second broad-area surface, and wherein at least one of said plurality of light deflecting elements is configured to deflect a light ray propagating transversely through said layer of an optically transmissive material away from a surface normal so as to form a sufficiently high propagation angle of said light ray with respect to said surface normal, above said critical angle of a Total Internal Reflection. 2. A light trapping optical structure as recited in claim 1, comprising an optically absorptive layer disposed between said layer of an optically transmissive material and said reflective surface, wherein said optically absorptive layer is configured to partially absorb and partially transmit light along a transverse propagation direction. 3. A light trapping optical structure as recited in claim 1, comprising an optically absorptive layer disposed between said layer of an optically transmissive material and configured for a multiple transverse light passage. 4. A light trapping optical structure as recited in claim 1, comprising an optically absorptive layer disposed between said layer of an optically transmissive material and said reflective surface, wherein said optically absorptive layer is configured to partially absorb and partially transmit light along a transverse propagation direction, and wherein said optically absorptive layer includes light harvesting elements configured to convert the absorbed light into a useful energy. 5. A light trapping optical structure as recited in claim 1, comprising an optically absorptive layer disposed between said layer of an optically transmissive material and said reflective surface, wherein said optically absorptive layer is configured to partially absorb and partially transmit light along a transverse propagation direction, and wherein said optically absorptive layer is a part of a photovoltaic device. 6. A light trapping optical structure as recited in claim 1, wherein each of said plurality of light deflecting elements includes light diffusing or scattering elements. 7. A light trapping optical structure as recited in claim 1, wherein each of said plurality of light deflecting elements includes a light-scattering textured area. 8. A light trapping optical structure as recited in claim 1, wherein each of said plurality of light deflecting elements comprises light-scattering substance deposited to either the first or the second broad-area surface. 9. A light trapping optical structure as recited in claim 1, wherein each of said plurality of light deflecting elements comprises a prismatic surface relief feature formed in or on said first or second broad-area surface. 10. A light trapping optical structure as recited in claim 1, wherein at least one of said plurality of light deflecting elements comprises a discontinuity in either the first broad area surface or the second broad area surface. 11. A light trapping optical structure as recited in claim 1, wherein said reflective surface is mirrored to provide for a specular reflectivity. 12. A light trapping optical structure as recited in claim 1, wherein a cumulative light receiving aperture of said light deflecting elements is less than an area of each of the first and second broad-area surfaces. 13. A light trapping optical structure as recited in claim 1, wherein said layer of an optically transmissive material is configured to receive light on the first broad-area surface and output light from the second broad-area surface. 14. A light trapping optical structure as recited in claim 1, wherein said layer of an optically transmissive material is configured to receive light on the first broad-area surface and output at least a portion of light from the first broad-area surface. 15. A light trapping optical structure as recited in claim 1, wherein said layer of an optically transmissive material is configured to receive light on both the first and second broad-area surfaces and output light from both the first and second broad-area surfaces. 16. A light trapping optical structure as recited in claim 1, comprising a planar array of optical elements distributed over said first broad-area surface with an air gap therebetween and adapted for collecting, concentrating or collimating light impinging onto said planar array. 17. A light trapping optical structure, comprising:
a broad-area refractive surface; an opposing broad-area reflective surface spaced apart from said broad-area refractive surface by a predetermined distance; a layer of an optically transmissive material disposed between said broad-area refractive surface and said broad-area reflective surface, said layer of an optically transmissive material being separated from said broad-area reflective surface by at least one optical interface characterized by a stepped change in a refractive index; a plurality of light deflecting elements associated with said layer of an optically transmissive material, said plurality of light deflecting elements being distributed over a prevailing plane of said layer of an optically transmissive material and having a cumulative aperture substantially smaller than an area of said layer of an optically transmissive material; wherein said broad-area refractive surface is configured to admit light into a space defined by said broad-area refractive surface and said broad-area reflective surface, wherein each of said light deflecting elements is configured to intercept a portion of light propagating within said space and communicate said light a different propagation angle with respect to a normal to said refractive surface; wherein at least a portion of light admitted into said space is redirected to result in a multiple transverse passage through said layer of an optically transmissive material. 18. A light trapping optical structure as recited in claim 17, comprising a photoabsorptive layer disposed between said layer of an optically transmissive material and said broad-area reflective surface, said photoabsorptive layer configured to absorb only a portion of light in a single pass along a transverse direction. 19. A light trapping optical structure as recited in claim 17, comprising a planar optical array adapted for collecting, concentrating or collimating light propagated within said space. 20. A light trapping optical structure as recited in claim 17, wherein said broad-area refractive surface includes surface relief features configured to redirect light. | A light trapping optical structure employing an optically transmissive layer with a plurality of light deflecting elements. The transparent layer is defined by opposing broad-area surfaces extending parallel to each other. The light deflecting elements deflect light propagating transversely through the optically transmissive layer at a sufficiently high bend angle with respect to a surface normal, above a critical angle of a Total Internal Reflection. The deflected light is retained by means of at least TIR in the system which allows for longer light propagation paths through a photoabsorptive layer that may be associated with the optically transmissive layer for an improved light absorption. The light trapping optical structure may further employ a focusing array of light collectors being pairwise associated with the respective light deflecting elements.1. A light trapping optical structure, comprising:
a layer of an optically transmissive material defined by a first broad-area surface and an opposing second broad-area surface extending generally parallel to said first broad-area surface, each of said first and second broad-area surfaces being characterized by a stepped drop in a refractive index outwardly from said layer of an optically transmissive material and by a critical angle of a Total Internal Reflection; a plurality of light deflecting elements associated with said layer of an optically transmissive material, said plurality of light deflecting elements being distributed over a prevailing plane of said layer of an optically transmissive material according to a predetermined pattern; and a reflective surface located outside of said layer of an optically transmissive material, extending parallel to said prevailing plane, and disposed in energy exchange relationship with said layer of an optically transmissive material; wherein said light deflecting elements are spaced apart from by each other by spacing areas that are greater than apertures of said light deflecting elements such that a cumulative aperture of said plurality of light deflecting elements is substantially smaller than areas of said first and second broad-area surfaces; wherein said layer of an optically transmissive material is configured to receive light on either the first or the second broad-area surface, and wherein at least one of said plurality of light deflecting elements is configured to deflect a light ray propagating transversely through said layer of an optically transmissive material away from a surface normal so as to form a sufficiently high propagation angle of said light ray with respect to said surface normal, above said critical angle of a Total Internal Reflection. 2. A light trapping optical structure as recited in claim 1, comprising an optically absorptive layer disposed between said layer of an optically transmissive material and said reflective surface, wherein said optically absorptive layer is configured to partially absorb and partially transmit light along a transverse propagation direction. 3. A light trapping optical structure as recited in claim 1, comprising an optically absorptive layer disposed between said layer of an optically transmissive material and configured for a multiple transverse light passage. 4. A light trapping optical structure as recited in claim 1, comprising an optically absorptive layer disposed between said layer of an optically transmissive material and said reflective surface, wherein said optically absorptive layer is configured to partially absorb and partially transmit light along a transverse propagation direction, and wherein said optically absorptive layer includes light harvesting elements configured to convert the absorbed light into a useful energy. 5. A light trapping optical structure as recited in claim 1, comprising an optically absorptive layer disposed between said layer of an optically transmissive material and said reflective surface, wherein said optically absorptive layer is configured to partially absorb and partially transmit light along a transverse propagation direction, and wherein said optically absorptive layer is a part of a photovoltaic device. 6. A light trapping optical structure as recited in claim 1, wherein each of said plurality of light deflecting elements includes light diffusing or scattering elements. 7. A light trapping optical structure as recited in claim 1, wherein each of said plurality of light deflecting elements includes a light-scattering textured area. 8. A light trapping optical structure as recited in claim 1, wherein each of said plurality of light deflecting elements comprises light-scattering substance deposited to either the first or the second broad-area surface. 9. A light trapping optical structure as recited in claim 1, wherein each of said plurality of light deflecting elements comprises a prismatic surface relief feature formed in or on said first or second broad-area surface. 10. A light trapping optical structure as recited in claim 1, wherein at least one of said plurality of light deflecting elements comprises a discontinuity in either the first broad area surface or the second broad area surface. 11. A light trapping optical structure as recited in claim 1, wherein said reflective surface is mirrored to provide for a specular reflectivity. 12. A light trapping optical structure as recited in claim 1, wherein a cumulative light receiving aperture of said light deflecting elements is less than an area of each of the first and second broad-area surfaces. 13. A light trapping optical structure as recited in claim 1, wherein said layer of an optically transmissive material is configured to receive light on the first broad-area surface and output light from the second broad-area surface. 14. A light trapping optical structure as recited in claim 1, wherein said layer of an optically transmissive material is configured to receive light on the first broad-area surface and output at least a portion of light from the first broad-area surface. 15. A light trapping optical structure as recited in claim 1, wherein said layer of an optically transmissive material is configured to receive light on both the first and second broad-area surfaces and output light from both the first and second broad-area surfaces. 16. A light trapping optical structure as recited in claim 1, comprising a planar array of optical elements distributed over said first broad-area surface with an air gap therebetween and adapted for collecting, concentrating or collimating light impinging onto said planar array. 17. A light trapping optical structure, comprising:
a broad-area refractive surface; an opposing broad-area reflective surface spaced apart from said broad-area refractive surface by a predetermined distance; a layer of an optically transmissive material disposed between said broad-area refractive surface and said broad-area reflective surface, said layer of an optically transmissive material being separated from said broad-area reflective surface by at least one optical interface characterized by a stepped change in a refractive index; a plurality of light deflecting elements associated with said layer of an optically transmissive material, said plurality of light deflecting elements being distributed over a prevailing plane of said layer of an optically transmissive material and having a cumulative aperture substantially smaller than an area of said layer of an optically transmissive material; wherein said broad-area refractive surface is configured to admit light into a space defined by said broad-area refractive surface and said broad-area reflective surface, wherein each of said light deflecting elements is configured to intercept a portion of light propagating within said space and communicate said light a different propagation angle with respect to a normal to said refractive surface; wherein at least a portion of light admitted into said space is redirected to result in a multiple transverse passage through said layer of an optically transmissive material. 18. A light trapping optical structure as recited in claim 17, comprising a photoabsorptive layer disposed between said layer of an optically transmissive material and said broad-area reflective surface, said photoabsorptive layer configured to absorb only a portion of light in a single pass along a transverse direction. 19. A light trapping optical structure as recited in claim 17, comprising a planar optical array adapted for collecting, concentrating or collimating light propagated within said space. 20. A light trapping optical structure as recited in claim 17, wherein said broad-area refractive surface includes surface relief features configured to redirect light. | 2,800 |
11,260 | 11,260 | 13,578,901 | 2,864 | Disclosed are a wire harness continuity inspection method and a wire harness continuity inspection program capable of shortening the time required for a success/failure determination step. A first specification regarded as necessary for a first partitioned area A and a second specification regarded as necessary for a second partitioned area B are compared, the presence/absence of a shared specification is determined, and when there is at least one shared specification, region-based connector/wiring information described regarding any first wire harness arrangeable in the first partitioned area A and any second wire harness arrangeable in the second partitioned area B is created for the combination of the first wire harness and the second wire harness only. | 1. A wire harness continuity inspection method comprising:
a reference step of referencing a first specification code allocated to a first partitioned area partitioning a vehicle space and a second specification code allocated to a second partitioned area partitioning the vehicle space; a determination step of comparing the first specification with the second specification and determining the presence/absence of a shared specification; a creation step of, when there is at least one shared specification, creating first region-based connector/wiring information described regarding any first wire harness arrangeable in the first partitioned area and any second wire harness arrangeable in the second partitioned area for the combination of the first wire harness and the second wire harness only; and an inspection step of inspecting the presence/absence of an error in a connection of electric wires in the created first region-based connector/wiring information. 2. The wire harness continuity inspection method according to claim 1, wherein, in the creation step, when there is at least one specification shared by the first specification and a third specification allocated to a third partitioned area partitioning the vehicle space, second region-based connector/wiring information described regarding any first wire harness arrangeable in the first partitioned area and any third wire harness arrangeable in the third partitioned area is created for the combination of the first wire harness and the third wire harness only, excluding the combination of the first wire harness and the third wire harness described in the first region-based connector/wiring information created previously. 3. A program which causes a computer to execute the steps of the wire harness continuity inspection method according to claim 1. | Disclosed are a wire harness continuity inspection method and a wire harness continuity inspection program capable of shortening the time required for a success/failure determination step. A first specification regarded as necessary for a first partitioned area A and a second specification regarded as necessary for a second partitioned area B are compared, the presence/absence of a shared specification is determined, and when there is at least one shared specification, region-based connector/wiring information described regarding any first wire harness arrangeable in the first partitioned area A and any second wire harness arrangeable in the second partitioned area B is created for the combination of the first wire harness and the second wire harness only.1. A wire harness continuity inspection method comprising:
a reference step of referencing a first specification code allocated to a first partitioned area partitioning a vehicle space and a second specification code allocated to a second partitioned area partitioning the vehicle space; a determination step of comparing the first specification with the second specification and determining the presence/absence of a shared specification; a creation step of, when there is at least one shared specification, creating first region-based connector/wiring information described regarding any first wire harness arrangeable in the first partitioned area and any second wire harness arrangeable in the second partitioned area for the combination of the first wire harness and the second wire harness only; and an inspection step of inspecting the presence/absence of an error in a connection of electric wires in the created first region-based connector/wiring information. 2. The wire harness continuity inspection method according to claim 1, wherein, in the creation step, when there is at least one specification shared by the first specification and a third specification allocated to a third partitioned area partitioning the vehicle space, second region-based connector/wiring information described regarding any first wire harness arrangeable in the first partitioned area and any third wire harness arrangeable in the third partitioned area is created for the combination of the first wire harness and the third wire harness only, excluding the combination of the first wire harness and the third wire harness described in the first region-based connector/wiring information created previously. 3. A program which causes a computer to execute the steps of the wire harness continuity inspection method according to claim 1. | 2,800 |
11,261 | 11,261 | 13,021,969 | 2,892 | A high frequency power supply module ( 800 ) of a synchronous Buck converter having the control die ( 810 ) directly soldered drain-down to the pad ( 801 ) of a leadframe; pad ( 801 ) is connected to V IN and the V IN connection to control die ( 810 ) exhibits vanishing impedance and inductance, thus reducing the amplitude and duration of switch node voltage ringing by more than 90%. Consequently, the input current enters the control die terminal vertically from the pad. The switch node clip ( 840 ), topping the control die ( 810 ), is designed with an area large enough to place the sync die ( 820 ) drain-down on top of the control die; the current continues to flow vertically through the converter stack. The active area of the sync die is equal to or greater than the active area of the control die; the physical area of the sync die is equal to or greater than the physical area of the control die. The source terminal of sync die ( 820 ) is connected to ground by clip ( 860 ) designed to act as a heat spreader. | 1. A power supply module having an electrical input terminal and a ground terminal, comprising: a leadframe including an die pad and leads, of which the pad is the electrical input terminal and at least on lead is a ground terminal; and
a synchronous Buck converter including a control FET die, a by a synchronous FET die stacked on top of the control FET die; the control FET die having a first physical area, a first active area, a first source terminal on a first side of the die, and a first drain terminal on a second side of the die, opposite the first side; the synchronous FET die having a second source terminal on a first side of the die, and a second drain terminal on a second side of the die, opposite the first side; and the first drain terminal of the control FET die directly affixed to the die pad, the second source terminal of the synchronous FET die connected to the ground terminal by a metal clip. 2. The power supply module of claim 1 wherein the synchronous FET die has a second physical area not smaller than the first physical area, a second active area not smaller than the first active area, and the second drain terminal attached to the first source terminal. 3. The power supply module of claim 2 wherein the control FET and the synchronous FET are n-type MOSFETs. 4. The power supply module of claim 3 wherein the leads are positioned in line with sides of the pad. 5. The power supply module of claim 4 further including a first metal clip operable as the switch node terminal of the converter soldered onto the first source terminal and the second drain terminal and having a ridge connecting to respective leads. 6. The power supply module of claim 1, in which the metal clip is soldered onto the second source terminal and having one or more ridges connecting to respective leads. 7. The power supply module of claim 6, in which the control FET has a first gate terminal and the synchronous FET has a second gate terminal. 8. The power supply module of claim 7 further including wire bonds connecting the first and second gate terminals to leads. 9. The power supply module of claim 8 further including a packaging compound encapsulating the converter, clips, and wire bonds, leaving un-encapsulated the surfaces of the pad and leads intended for connection to external parts. 10. A power supply module comprising a first electrical path between an external input terminal and a control field effect transistor (FET), and a second electrical path between an external ground terminal and a synchronous FET; and in which the first electrical path is less electrically resistive than the second electrical path. 11. The power supply module of claim 10, in which the second electrical path includes a metal clip. 12. The power supply module of claim 10, in which the first electrical path includes a metal pad soldered to a FET die. 13. The power supply module of claim 11, in which the metal clip contacts the external ground terminal and the synchronous FET die. 14. The power supply module of claim 13, in which the metal clip contacts the synchronous FET die at a source terminal. 15. The power supply module of claim 10, further comprising an external switch node terminal. 16. The power supply module of claim 15, in which the external switch node terminal is connected to a metal clip. 17. The power supply module of claim 16, in which the metal clip contacts both the control FET and the synchronous FET. 18. The power supply module of claim 17, in which the control FET is soldered to a first surface of the metal clip and the synchronous FET is soldered to a second surface of the metal clip. 19. The power supply module of claim 18, in which the metal clip is soldered to a source terminal of the control FET and to a drain terminal of the synchronous FET. 20. The power supply module of claim 10, further comprising an external switch node terminal and in which the external input terminal is disposed between the external switch node terminal and the external ground terminal. | A high frequency power supply module ( 800 ) of a synchronous Buck converter having the control die ( 810 ) directly soldered drain-down to the pad ( 801 ) of a leadframe; pad ( 801 ) is connected to V IN and the V IN connection to control die ( 810 ) exhibits vanishing impedance and inductance, thus reducing the amplitude and duration of switch node voltage ringing by more than 90%. Consequently, the input current enters the control die terminal vertically from the pad. The switch node clip ( 840 ), topping the control die ( 810 ), is designed with an area large enough to place the sync die ( 820 ) drain-down on top of the control die; the current continues to flow vertically through the converter stack. The active area of the sync die is equal to or greater than the active area of the control die; the physical area of the sync die is equal to or greater than the physical area of the control die. The source terminal of sync die ( 820 ) is connected to ground by clip ( 860 ) designed to act as a heat spreader.1. A power supply module having an electrical input terminal and a ground terminal, comprising: a leadframe including an die pad and leads, of which the pad is the electrical input terminal and at least on lead is a ground terminal; and
a synchronous Buck converter including a control FET die, a by a synchronous FET die stacked on top of the control FET die; the control FET die having a first physical area, a first active area, a first source terminal on a first side of the die, and a first drain terminal on a second side of the die, opposite the first side; the synchronous FET die having a second source terminal on a first side of the die, and a second drain terminal on a second side of the die, opposite the first side; and the first drain terminal of the control FET die directly affixed to the die pad, the second source terminal of the synchronous FET die connected to the ground terminal by a metal clip. 2. The power supply module of claim 1 wherein the synchronous FET die has a second physical area not smaller than the first physical area, a second active area not smaller than the first active area, and the second drain terminal attached to the first source terminal. 3. The power supply module of claim 2 wherein the control FET and the synchronous FET are n-type MOSFETs. 4. The power supply module of claim 3 wherein the leads are positioned in line with sides of the pad. 5. The power supply module of claim 4 further including a first metal clip operable as the switch node terminal of the converter soldered onto the first source terminal and the second drain terminal and having a ridge connecting to respective leads. 6. The power supply module of claim 1, in which the metal clip is soldered onto the second source terminal and having one or more ridges connecting to respective leads. 7. The power supply module of claim 6, in which the control FET has a first gate terminal and the synchronous FET has a second gate terminal. 8. The power supply module of claim 7 further including wire bonds connecting the first and second gate terminals to leads. 9. The power supply module of claim 8 further including a packaging compound encapsulating the converter, clips, and wire bonds, leaving un-encapsulated the surfaces of the pad and leads intended for connection to external parts. 10. A power supply module comprising a first electrical path between an external input terminal and a control field effect transistor (FET), and a second electrical path between an external ground terminal and a synchronous FET; and in which the first electrical path is less electrically resistive than the second electrical path. 11. The power supply module of claim 10, in which the second electrical path includes a metal clip. 12. The power supply module of claim 10, in which the first electrical path includes a metal pad soldered to a FET die. 13. The power supply module of claim 11, in which the metal clip contacts the external ground terminal and the synchronous FET die. 14. The power supply module of claim 13, in which the metal clip contacts the synchronous FET die at a source terminal. 15. The power supply module of claim 10, further comprising an external switch node terminal. 16. The power supply module of claim 15, in which the external switch node terminal is connected to a metal clip. 17. The power supply module of claim 16, in which the metal clip contacts both the control FET and the synchronous FET. 18. The power supply module of claim 17, in which the control FET is soldered to a first surface of the metal clip and the synchronous FET is soldered to a second surface of the metal clip. 19. The power supply module of claim 18, in which the metal clip is soldered to a source terminal of the control FET and to a drain terminal of the synchronous FET. 20. The power supply module of claim 10, further comprising an external switch node terminal and in which the external input terminal is disposed between the external switch node terminal and the external ground terminal. | 2,800 |
11,262 | 11,262 | 14,879,715 | 2,834 | An electrodynamic machine is disclosed that includes a magnetic field generator and an armature in a linear moving relationship with each other along a first axis. A swash plate rotates about a second axis parallel to and offset from the first axis. The swash plate comprises a surface in slidable engagement with an end of the magnetic field generator or an end of the armature. This swash plate surface is at a controllably variable angle to the second axis, and provides provides a linear displacement between the magnetic field generator and the armature in response to rotation of the swash plate. | 1. An electrodynamic machine, comprising
a magnetic field generator and an armature in a linear moving relationship with each other along a first axis; and a swash plate rotating about a second axis parallel to and offset from the first axis, the swash plate comprising a surface in slidable engagement with an end of the magnetic field generator or an end of the armature, said surface being at a controllably variable angle to the second axis, thereby providing linear displacement between the magnetic field generator and the armature in response to rotation of the swash plate. 2. The electrodynamic machine of claim 1, wherein the wherein the magnetic field generator is in slidable engagement with the angled surface of the swash plate. 3. The electrodynamic machine of claim 1, wherein the armature is in slidable engagement with the swash plate surface. 4. The electrodynamic machine of claim 1, wherein the magnetic field generator comprises a permanent magnet. 5. The electrodynamic machine of claim 1, comprising a plurality of magnetic field generators or armatures having ends in slidable engagement with the swash plate surface. 6. The electrodynamic machine of claim 1, further comprising a slipper component disposed between the swash plate surface and the end of the magnetic field generator or armature that is in slidable engagement with the swash plate surface. 7. The electrodynamic machine of claim 6, wherein the slipper component comprises a flat surface in slidable engagement with the swash plate surface, and a curved surface in rotational engagement with a curved surface on the end of the magnetic field generator or armature. 8. The electrodynamic machine of claim 1, further comprising a sensor to determine the angle of the angled surface of the swash plate with respect to the second axis. 9. The electrodynamic machine of claim 1, further comprising an actuator operatively connected to the swash plate for varying the angle of the angled swash plate surface with respect to the second axis. 10. The electrodynamic machine of claim 9, wherein the actuator comprises a pivot linkage actuated by a push rod. 11. The electrodynamic machine of claim 10, further comprising a position sensor to determine the position of the push rod. 12. The electrodynamic machine of claim 10, wherein the push rod is actuated linearly along a third axis parallel to or coincident with the first axis by a linear actuator. 13. The electrodynamic machine of claim 12, wherein the linear actuator is selected from a rotary electric motor coupled with a screw mechanism, a pneumatic linear actuator, a hydraulic linear actuator, or an electrical linear actuator. 14. An electrodynamic system comprising the electrodynamic machine of claim 1 and a controller in operative communication with the swash plate for controlling the angle of the angled swash plate surface. 15. The electrodynamic system according to claim 14, wherein the controller is configured to increase the angle of the angled swash plate surface with respect to the second axis in response to an increase in the electrodynamic machine's EMF, a reduction in the electrodynamic machine's phase current, a reduction in the electrodynamic machine's torque, or a combination comprising any of the foregoing. 16. A method of operating the electrodynamic machine of claim 1, comprising rotating the swash plate about the second axis, thereby causing linear displacement between the magnetic field generator and the armature along the first axis. 17. The method of claim 16, further comprising controlling the angle of the angled swash plate surface with respect to the second axis. 18. The method of claim 17, wherein the angle of the angled swash plate surface with respect to the second axis is increased in response to an increase during operation as a motor of the electrodynamic machine's EMF, a reduction in the electrodynamic machine's phase current, a reduction in the electrodynamic machine's torque, or a combination comprising any of the foregoing. | An electrodynamic machine is disclosed that includes a magnetic field generator and an armature in a linear moving relationship with each other along a first axis. A swash plate rotates about a second axis parallel to and offset from the first axis. The swash plate comprises a surface in slidable engagement with an end of the magnetic field generator or an end of the armature. This swash plate surface is at a controllably variable angle to the second axis, and provides provides a linear displacement between the magnetic field generator and the armature in response to rotation of the swash plate.1. An electrodynamic machine, comprising
a magnetic field generator and an armature in a linear moving relationship with each other along a first axis; and a swash plate rotating about a second axis parallel to and offset from the first axis, the swash plate comprising a surface in slidable engagement with an end of the magnetic field generator or an end of the armature, said surface being at a controllably variable angle to the second axis, thereby providing linear displacement between the magnetic field generator and the armature in response to rotation of the swash plate. 2. The electrodynamic machine of claim 1, wherein the wherein the magnetic field generator is in slidable engagement with the angled surface of the swash plate. 3. The electrodynamic machine of claim 1, wherein the armature is in slidable engagement with the swash plate surface. 4. The electrodynamic machine of claim 1, wherein the magnetic field generator comprises a permanent magnet. 5. The electrodynamic machine of claim 1, comprising a plurality of magnetic field generators or armatures having ends in slidable engagement with the swash plate surface. 6. The electrodynamic machine of claim 1, further comprising a slipper component disposed between the swash plate surface and the end of the magnetic field generator or armature that is in slidable engagement with the swash plate surface. 7. The electrodynamic machine of claim 6, wherein the slipper component comprises a flat surface in slidable engagement with the swash plate surface, and a curved surface in rotational engagement with a curved surface on the end of the magnetic field generator or armature. 8. The electrodynamic machine of claim 1, further comprising a sensor to determine the angle of the angled surface of the swash plate with respect to the second axis. 9. The electrodynamic machine of claim 1, further comprising an actuator operatively connected to the swash plate for varying the angle of the angled swash plate surface with respect to the second axis. 10. The electrodynamic machine of claim 9, wherein the actuator comprises a pivot linkage actuated by a push rod. 11. The electrodynamic machine of claim 10, further comprising a position sensor to determine the position of the push rod. 12. The electrodynamic machine of claim 10, wherein the push rod is actuated linearly along a third axis parallel to or coincident with the first axis by a linear actuator. 13. The electrodynamic machine of claim 12, wherein the linear actuator is selected from a rotary electric motor coupled with a screw mechanism, a pneumatic linear actuator, a hydraulic linear actuator, or an electrical linear actuator. 14. An electrodynamic system comprising the electrodynamic machine of claim 1 and a controller in operative communication with the swash plate for controlling the angle of the angled swash plate surface. 15. The electrodynamic system according to claim 14, wherein the controller is configured to increase the angle of the angled swash plate surface with respect to the second axis in response to an increase in the electrodynamic machine's EMF, a reduction in the electrodynamic machine's phase current, a reduction in the electrodynamic machine's torque, or a combination comprising any of the foregoing. 16. A method of operating the electrodynamic machine of claim 1, comprising rotating the swash plate about the second axis, thereby causing linear displacement between the magnetic field generator and the armature along the first axis. 17. The method of claim 16, further comprising controlling the angle of the angled swash plate surface with respect to the second axis. 18. The method of claim 17, wherein the angle of the angled swash plate surface with respect to the second axis is increased in response to an increase during operation as a motor of the electrodynamic machine's EMF, a reduction in the electrodynamic machine's phase current, a reduction in the electrodynamic machine's torque, or a combination comprising any of the foregoing. | 2,800 |
11,263 | 11,263 | 13,742,923 | 2,864 | An electromagnetic (EM) data acquisition method for a geological formation may include operating EM measurement devices to determine phase and amplitude data from the geological formation. The EM measurement devices may include at least one first EM measurement device within a borehole in the geological formation, and at least one second EM measurement device at a surface of the geological formation. The method may further include processing the phase data independent from the amplitude data to generate a geological constituent map of the geological formation, and identifying different geological constituents in the geological constituent map based upon the measured amplitude data. | 1. An electromagnetic (EM) data acquisition method for a geological formation, the method comprising:
operating a plurality of EM measurement devices to determine phase and amplitude data from the geological formation, the plurality of EM measurement devices comprising at least one first EM measurement device within a borehole in the geological formation, and at least one second EM measurement device at a surface of the geological formation; processing the phase data independent from the amplitude data to generate a geological constituent map of the geological formation; and identifying different geological constituents in the geological constituent map based upon the measured amplitude data. 2. The method of claim 1 wherein processing the phase data comprises processing the phase data with at least one inversion algorithm using a processor. 3. The method of claim 1 wherein the amplitude data corresponds to a resistivity of the geological formation; and wherein identifying comprises identifying the different geological constituents by comparing the amplitude data to reference resistivity data. 4. The method of claim 1 wherein the at least one second EM measurement device comprises an array of EM transmitters; and wherein the at least one first EM measurement device comprises at least one EM receiver. 5. The method of claim 4 wherein operating the plurality of EM measurement devices comprises sequentially operating the array of EM transmitters so that the amplitude data comprises sequential amplitude data. 6. The method of claim 5 wherein identifying comprises identifying the different geological constituents based upon a subset of the sequential amplitude data. 7. The method of claim 1 wherein the at least one second EM measurement device comprises an array of EM receivers; and wherein the at least one first EM measurement device comprises at least one EM transmitter. 8. The method of claim 1 further comprising determining in-ground amplitude data; and wherein identifying comprises identifying the different geological constituents further based upon the in-ground amplitude data. 9. A well-logging system comprising:
a plurality of EM measurement devices to determine phase and amplitude data from a geological formation, said plurality of EM measurement devices comprising at least one first EM measurement device within a borehole in the geological formation, and at least one second EM measurement device at a surface of the geological formation; and a processor to
process the phase data independent from the amplitude data to generate a geological constituent map of the geological formation, and
identify different geological constituents in the geological constituent map based upon the measured amplitude data. 10. The well-logging system of claim 9 wherein said processor processes the phase data with at least one inversion algorithm. 11. The well-logging system of claim 9 wherein the amplitude data corresponds to a resistivity of the geological formation; and wherein said processor identifies the different geological constituents by comparing the amplitude data to reference resistivity data. 12. The well-logging system of claim 9 wherein said at least one second EM measurement device comprises an array of EM transmitters; and wherein said at least one first EM measurement device comprises at least one EM receiver. 13. The well-logging system of claim 12 wherein said array of EM transmitters is sequentially operated so that the amplitude data comprises sequential amplitude data. 14. The well-logging system of claim 13 wherein said processor identifies the different geological constituents based upon a subset of the sequential amplitude data. 15. A non-transitory computer-readable medium having computer-executable instructions for causing a computer to perform steps comprising:
for phase and amplitude data determined by a plurality of EM measurement devices from a geological formation, processing the phase data independent from the amplitude data to generate a geological constituent map of the geological formation, wherein the plurality of EM measurement devices comprise at least one first EM measurement device within a borehole in the geological formation and at least one second EM measurement device at a surface of the geological formation; and identifying different geological constituents in the geological constituent map based upon the measured amplitude data. 16. The non-transitory computer-readable medium of claim 15 wherein processing the phase data comprises processing the phase data with at least one inversion algorithm. 17. The non-transitory computer-readable medium of claim 15 wherein the amplitude data corresponds to a resistivity of the geological formation; and wherein identifying comprises identifying the different geological constituents by comparing the amplitude data to reference resistivity data. 18. The non-transitory computer-readable medium of claim 15 wherein the at least one second EM measurement device comprises an array of EM transmitters; and wherein the at least one first EM measurement device comprises at least one EM receiver. 19. The non-transitory computer-readable medium of claim 18 wherein the array of EM transmitters are sequentially operated so that the amplitude data comprises sequential amplitude data; and wherein identifying comprises identifying the different geological constituents based upon a subset of the sequential amplitude data. 20. The non-transitory computer-readable medium of claim 15 wherein identifying comprises identifying the different geological constituents further based upon in-ground amplitude data. | An electromagnetic (EM) data acquisition method for a geological formation may include operating EM measurement devices to determine phase and amplitude data from the geological formation. The EM measurement devices may include at least one first EM measurement device within a borehole in the geological formation, and at least one second EM measurement device at a surface of the geological formation. The method may further include processing the phase data independent from the amplitude data to generate a geological constituent map of the geological formation, and identifying different geological constituents in the geological constituent map based upon the measured amplitude data.1. An electromagnetic (EM) data acquisition method for a geological formation, the method comprising:
operating a plurality of EM measurement devices to determine phase and amplitude data from the geological formation, the plurality of EM measurement devices comprising at least one first EM measurement device within a borehole in the geological formation, and at least one second EM measurement device at a surface of the geological formation; processing the phase data independent from the amplitude data to generate a geological constituent map of the geological formation; and identifying different geological constituents in the geological constituent map based upon the measured amplitude data. 2. The method of claim 1 wherein processing the phase data comprises processing the phase data with at least one inversion algorithm using a processor. 3. The method of claim 1 wherein the amplitude data corresponds to a resistivity of the geological formation; and wherein identifying comprises identifying the different geological constituents by comparing the amplitude data to reference resistivity data. 4. The method of claim 1 wherein the at least one second EM measurement device comprises an array of EM transmitters; and wherein the at least one first EM measurement device comprises at least one EM receiver. 5. The method of claim 4 wherein operating the plurality of EM measurement devices comprises sequentially operating the array of EM transmitters so that the amplitude data comprises sequential amplitude data. 6. The method of claim 5 wherein identifying comprises identifying the different geological constituents based upon a subset of the sequential amplitude data. 7. The method of claim 1 wherein the at least one second EM measurement device comprises an array of EM receivers; and wherein the at least one first EM measurement device comprises at least one EM transmitter. 8. The method of claim 1 further comprising determining in-ground amplitude data; and wherein identifying comprises identifying the different geological constituents further based upon the in-ground amplitude data. 9. A well-logging system comprising:
a plurality of EM measurement devices to determine phase and amplitude data from a geological formation, said plurality of EM measurement devices comprising at least one first EM measurement device within a borehole in the geological formation, and at least one second EM measurement device at a surface of the geological formation; and a processor to
process the phase data independent from the amplitude data to generate a geological constituent map of the geological formation, and
identify different geological constituents in the geological constituent map based upon the measured amplitude data. 10. The well-logging system of claim 9 wherein said processor processes the phase data with at least one inversion algorithm. 11. The well-logging system of claim 9 wherein the amplitude data corresponds to a resistivity of the geological formation; and wherein said processor identifies the different geological constituents by comparing the amplitude data to reference resistivity data. 12. The well-logging system of claim 9 wherein said at least one second EM measurement device comprises an array of EM transmitters; and wherein said at least one first EM measurement device comprises at least one EM receiver. 13. The well-logging system of claim 12 wherein said array of EM transmitters is sequentially operated so that the amplitude data comprises sequential amplitude data. 14. The well-logging system of claim 13 wherein said processor identifies the different geological constituents based upon a subset of the sequential amplitude data. 15. A non-transitory computer-readable medium having computer-executable instructions for causing a computer to perform steps comprising:
for phase and amplitude data determined by a plurality of EM measurement devices from a geological formation, processing the phase data independent from the amplitude data to generate a geological constituent map of the geological formation, wherein the plurality of EM measurement devices comprise at least one first EM measurement device within a borehole in the geological formation and at least one second EM measurement device at a surface of the geological formation; and identifying different geological constituents in the geological constituent map based upon the measured amplitude data. 16. The non-transitory computer-readable medium of claim 15 wherein processing the phase data comprises processing the phase data with at least one inversion algorithm. 17. The non-transitory computer-readable medium of claim 15 wherein the amplitude data corresponds to a resistivity of the geological formation; and wherein identifying comprises identifying the different geological constituents by comparing the amplitude data to reference resistivity data. 18. The non-transitory computer-readable medium of claim 15 wherein the at least one second EM measurement device comprises an array of EM transmitters; and wherein the at least one first EM measurement device comprises at least one EM receiver. 19. The non-transitory computer-readable medium of claim 18 wherein the array of EM transmitters are sequentially operated so that the amplitude data comprises sequential amplitude data; and wherein identifying comprises identifying the different geological constituents based upon a subset of the sequential amplitude data. 20. The non-transitory computer-readable medium of claim 15 wherein identifying comprises identifying the different geological constituents further based upon in-ground amplitude data. | 2,800 |
11,264 | 11,264 | 15,007,272 | 2,847 | A terminal assembly configured to terminate the shield of a shielded cable having an inner conductor, an inner insulator surrounding the inner conductor, an outer conductor forming a shield surrounding the inner insulator, and an outer insulator surrounding the outer conductor. The terminal assembly includes a generally cylindrical outer ferrule formed of a conductive material and a generally cylindrical inner ferrule formed of a resilient compressible dielectric material. At least a portion of the inner ferrule is disposed within the outer ferrule and a portion of the shielded cable is disposed within the inner ferrule. A portion of the outer conductor is disposed intermediate the inner and outer ferrules and is in intimate contact therewith. | 1. A terminal assembly configured to terminate a shielded cable having an inner conductor, an inner insulator surrounding the inner conductor, an outer conductor surrounding the inner insulator, and an outer insulator surrounding the outer conductor, said terminal assembly comprising:
a generally cylindrical outer ferrule formed of a conductive material; and a generally cylindrical inner ferrule formed of a resilient compressible dielectric material, wherein the at least a portion of the inner ferrule is disposed within the outer ferrule and a portion of the shielded cable is disposed within the inner ferrule and wherein a portion of the outer conductor is disposed intermediate the inner ferrule and the outer ferrule and is in intimate contact therewith. 2. The terminal assembly according to claim 1, wherein the resilient compressible dielectric material is a silicone-based material. 3. The terminal assembly according to claim 1, wherein the resilient compressible dielectric material has a Shore A durometer hardness between 30 and 80. 4. The terminal assembly according to claim 1, wherein the inner ferrule has a generally constant outside diameter. 5. The terminal assembly according to claim 1, wherein the outer ferrule is crimped to the inner ferrule and wherein the inner ferrule is elastically deformed by the outer ferrule. 6. The terminal assembly according to claim 5, wherein an inner surface of the outer ferrule defines a projection configured to contact and indent the outer conductor and the inner ferrule. 7. The terminal assembly according to claim 6, wherein the inner ferrule defines a circumferential rib protruding beyond the outer ferrule. 8. The terminal assembly according to claim 7, wherein the inner ferrule defines a plurality of circumferential ribs protruding beyond the outer ferrule and wherein an outer diameter of each circumferential rib is substantially uniform. 9. The terminal assembly according to claim 8, wherein the plurality of circumferential ribs are resilient. 10. A terminal assembly terminating a shielded cable wherein a metallic inner wire cable covered by an inner insulator is sheathed by braided metallic wires on an outer periphery of the inner insulator and further covered by an outer insulator surrounding the braided metallic wires and wherein the braided metallic wires are exposed at one end of the shielded cable, said terminal assembly comprising:
a generally cylindrical inner ferrule formed of a resilient compressible dielectric material inserted between the outer insulator and the exposed braided metallic wires bent back over the inner ferrule; and a generally cylindrical outer ferrule formed of a conductive material crimped over the exposed braided metallic wires, wherein at least a portion of the inner ferrule is disposed within the outer ferrule and wherein a portion of the exposed braided metallic wires are disposed intermediate the inner ferrule and the outer ferrule and is in intimate contact therewith. 11. The terminal assembly according to claim 10, wherein the resilient compressible dielectric material is a silicone-based material. 12. The terminal assembly according to claim 10, wherein the resilient compressible dielectric material has a Shore A durometer hardness between 30 and 80. 13. The terminal assembly according to claim 10, wherein the inner ferrule has a generally constant outside diameter. 14. The terminal assembly according to claim 10, wherein an inner surface of the outer ferrule defines a projection configured to contact and indent the exposed braided metallic wires and the inner ferrule. 15. The terminal assembly according to claim 10, wherein the inner ferrule defines a circumferential rib protruding beyond the outer ferrule. 16. The terminal assembly according to claim 15, wherein the inner ferrule defines a plurality of circumferential ribs protruding beyond the outer ferrule and wherein an outer diameter of each circumferential rib is substantially uniform. 17. The terminal assembly according to claim 16, wherein the plurality of circumferential ribs are resilient. | A terminal assembly configured to terminate the shield of a shielded cable having an inner conductor, an inner insulator surrounding the inner conductor, an outer conductor forming a shield surrounding the inner insulator, and an outer insulator surrounding the outer conductor. The terminal assembly includes a generally cylindrical outer ferrule formed of a conductive material and a generally cylindrical inner ferrule formed of a resilient compressible dielectric material. At least a portion of the inner ferrule is disposed within the outer ferrule and a portion of the shielded cable is disposed within the inner ferrule. A portion of the outer conductor is disposed intermediate the inner and outer ferrules and is in intimate contact therewith.1. A terminal assembly configured to terminate a shielded cable having an inner conductor, an inner insulator surrounding the inner conductor, an outer conductor surrounding the inner insulator, and an outer insulator surrounding the outer conductor, said terminal assembly comprising:
a generally cylindrical outer ferrule formed of a conductive material; and a generally cylindrical inner ferrule formed of a resilient compressible dielectric material, wherein the at least a portion of the inner ferrule is disposed within the outer ferrule and a portion of the shielded cable is disposed within the inner ferrule and wherein a portion of the outer conductor is disposed intermediate the inner ferrule and the outer ferrule and is in intimate contact therewith. 2. The terminal assembly according to claim 1, wherein the resilient compressible dielectric material is a silicone-based material. 3. The terminal assembly according to claim 1, wherein the resilient compressible dielectric material has a Shore A durometer hardness between 30 and 80. 4. The terminal assembly according to claim 1, wherein the inner ferrule has a generally constant outside diameter. 5. The terminal assembly according to claim 1, wherein the outer ferrule is crimped to the inner ferrule and wherein the inner ferrule is elastically deformed by the outer ferrule. 6. The terminal assembly according to claim 5, wherein an inner surface of the outer ferrule defines a projection configured to contact and indent the outer conductor and the inner ferrule. 7. The terminal assembly according to claim 6, wherein the inner ferrule defines a circumferential rib protruding beyond the outer ferrule. 8. The terminal assembly according to claim 7, wherein the inner ferrule defines a plurality of circumferential ribs protruding beyond the outer ferrule and wherein an outer diameter of each circumferential rib is substantially uniform. 9. The terminal assembly according to claim 8, wherein the plurality of circumferential ribs are resilient. 10. A terminal assembly terminating a shielded cable wherein a metallic inner wire cable covered by an inner insulator is sheathed by braided metallic wires on an outer periphery of the inner insulator and further covered by an outer insulator surrounding the braided metallic wires and wherein the braided metallic wires are exposed at one end of the shielded cable, said terminal assembly comprising:
a generally cylindrical inner ferrule formed of a resilient compressible dielectric material inserted between the outer insulator and the exposed braided metallic wires bent back over the inner ferrule; and a generally cylindrical outer ferrule formed of a conductive material crimped over the exposed braided metallic wires, wherein at least a portion of the inner ferrule is disposed within the outer ferrule and wherein a portion of the exposed braided metallic wires are disposed intermediate the inner ferrule and the outer ferrule and is in intimate contact therewith. 11. The terminal assembly according to claim 10, wherein the resilient compressible dielectric material is a silicone-based material. 12. The terminal assembly according to claim 10, wherein the resilient compressible dielectric material has a Shore A durometer hardness between 30 and 80. 13. The terminal assembly according to claim 10, wherein the inner ferrule has a generally constant outside diameter. 14. The terminal assembly according to claim 10, wherein an inner surface of the outer ferrule defines a projection configured to contact and indent the exposed braided metallic wires and the inner ferrule. 15. The terminal assembly according to claim 10, wherein the inner ferrule defines a circumferential rib protruding beyond the outer ferrule. 16. The terminal assembly according to claim 15, wherein the inner ferrule defines a plurality of circumferential ribs protruding beyond the outer ferrule and wherein an outer diameter of each circumferential rib is substantially uniform. 17. The terminal assembly according to claim 16, wherein the plurality of circumferential ribs are resilient. | 2,800 |
11,265 | 11,265 | 15,360,861 | 2,852 | Blowout preventers, fluid pressure systems and portions thereof may be tested for leaks utilizing either a pressure decay rate method test or a volumetric leak rate method test of a hydrostatic pressure. The method provides for a means of resolving the nonlinear relationship between volumetric loss and test pressure utilizing either a pressure decay rate method test or a volumetric leak rate method test of a hydrostatic pressure test into a single dimensionless number that approximates the diameter of an orifice. | 1. A method of pressure testing a fluid system for leaks at a specified test pressure comprising;
a) pressurizing the system to the test pressure by introducing pressure intensifying fluid under pressure into the system, b) measuring for a finite time period the amount of added intensifying fluid required to maintain the system at the specified test pressure, and c) determining the resultant apparent orifice factor. 2. The method according to claim 1 wherein the apparent orifice factor is determined by the following formula
O=Vi/√P
where O=apparent orifice factor, Vi=volume loss rate, and P=test pressure. 3. The method of claim 1 wherein the fluid system is a blowout preventer for an oil/gas well. 4. A method of pressure testing a fluid system for leaks at a specified test pressure comprising;
a) pressurizing the system to the test pressure by introducing pressure intensifying fluid under pressure into the system, b) determining the apparent compressibility factor of the system, c) measuring the pressure decay rate of the system, d) determining the leak rate by dividing the apparent compressibility factor by the pressure decay rate, e) calculating the apparent orifice factor. 5. The method according to claim 4 wherein the apparent compressibility factor is determined by the following formula
Va/PSIA=ACF
where Va=Incremental volume change of intensifying fluid, PSIA=incremental pressure change of the intensification pressure (psia), and ACF=apparent compressibility factor. | Blowout preventers, fluid pressure systems and portions thereof may be tested for leaks utilizing either a pressure decay rate method test or a volumetric leak rate method test of a hydrostatic pressure. The method provides for a means of resolving the nonlinear relationship between volumetric loss and test pressure utilizing either a pressure decay rate method test or a volumetric leak rate method test of a hydrostatic pressure test into a single dimensionless number that approximates the diameter of an orifice.1. A method of pressure testing a fluid system for leaks at a specified test pressure comprising;
a) pressurizing the system to the test pressure by introducing pressure intensifying fluid under pressure into the system, b) measuring for a finite time period the amount of added intensifying fluid required to maintain the system at the specified test pressure, and c) determining the resultant apparent orifice factor. 2. The method according to claim 1 wherein the apparent orifice factor is determined by the following formula
O=Vi/√P
where O=apparent orifice factor, Vi=volume loss rate, and P=test pressure. 3. The method of claim 1 wherein the fluid system is a blowout preventer for an oil/gas well. 4. A method of pressure testing a fluid system for leaks at a specified test pressure comprising;
a) pressurizing the system to the test pressure by introducing pressure intensifying fluid under pressure into the system, b) determining the apparent compressibility factor of the system, c) measuring the pressure decay rate of the system, d) determining the leak rate by dividing the apparent compressibility factor by the pressure decay rate, e) calculating the apparent orifice factor. 5. The method according to claim 4 wherein the apparent compressibility factor is determined by the following formula
Va/PSIA=ACF
where Va=Incremental volume change of intensifying fluid, PSIA=incremental pressure change of the intensification pressure (psia), and ACF=apparent compressibility factor. | 2,800 |
11,266 | 11,266 | 14,619,487 | 2,812 | A method for combined interpolation and primary estimation can include performing a plurality of interpolations on received seismic data, performing a plurality of primary estimations on the received seismic data, and performing a combination of interpolation and primary estimation. Performing the combination can include generating reestimated primaries via a second primary estimation with input of a second interpolation, where output of the first primary estimation is input to the second interpolation. | 1. A method, comprising:
processing, by a machine, received seismic data, wherein the processing comprises:
performing, by the machine, a first interpolation on the received seismic data;
performing, by the machine, a first primary estimation on the first interpolated seismic data, wherein output of the first primary estimation includes:
estimated primaries; and
estimated multiples;
performing, by the machine, a second interpolation on the output of the first primary estimation; and
performing, by the machine, a second primary estimation on second interpolated seismic data, wherein output of the second primary estimation includes:
reestimated primaries; and
reestimated multiples. 2. The method of claim 1, comprising:
performing, by the machine, a third interpolation on the output of the second primary estimation; and performing, by the machine, a third primary estimation on the third interpolated seismic date, wherein output of the third primary estimation includes:
reestimated primaries; and
reestimated multiples. 3. A method, comprising:
processing, by a machine, received seismic data, wherein the processing comprises:
performing, by the machine, a plurality of interpolations on the received seismic data;
performing, by the machine, a plurality of primary estimations on the received seismic data, wherein performing the plurality of primary estimations includes generating estimated primaries via a first primary estimation with input of a first interpolation; and
performing, by the machine, a combination of interpolation and primary estimation by:
generating reestimated primaries via a second primary estimation with input of a second interpolation;
wherein output of the first primary estimation is input to the second interpolation. 4. The method of claim 3, comprising:
generating estimated multiples via the first primary estimation with input of the first interpolation; and generating reestimated multiples via a third primary estimation with input of a third interpolation; wherein output of the first primary estimation is input to the third interpolation. 5. The method of claim 4, comprising:
generating the reestimated primaries and the reestimated multiples via the estimated primaries and the estimated multiples output by the first primary estimation, each being processed separately with input of different second and third interpolations for the second and third primary estimations, respectively. 6. The method of claim 5, wherein the estimated primaries and the estimated multiples each being processed separately with the input of the different second and third interpolations comprises performing each interpolation separately with its own different differential normal move out velocity. 7. The method of claim 3, wherein performing, by the machine, the plurality of interpolations, comprises:
execution of machine-readable instructions to perform a differential normal move out technique. 8. The method of claim 3, wherein performing, by the machine, the plurality of primary estimations, comprises:
execution of machine-readable instructions to perform a sparse inversion technique for primary estimation. 9. The method of claim 8, wherein performing, by the machine, the combination of interpolation and primary estimation, comprises:
performing the sparse inversion technique for primary estimation to include an update of a primary impulse response by:
calculation of first update directions for at least some of the received seismic data; and
interpolation of second update directions for at least some of the first interpolated seismic data. 10. The method of claim 9, wherein the interpolation of the second update directions for the at least some of the first interpolated seismic data includes execution of a differential normal move out technique. 11. The method of claim 9, wherein execution of the update includes scaling of the update with a scaling factor such that:
an objective function value decreases by calculation of first scaling factors for at least some of the received seismic data; and interpolation of second scaling factors occurs for at least some of the first interpolated seismic data. 12. The method of claim 11, wherein the interpolation of the second scaling factors for the at least some of the first interpolated seismic data includes execution of a differential normal move out technique. 13. A system, comprising:
an interpolation engine to perform a first interpolation of non-received seismic data based on received seismic data; an estimation engine to determine estimated primaries and estimated multiples based on the received seismic data and the first interpolated seismic data; and a combination engine to combine a second interpolation into estimated primaries or the estimated multiples, such that:
the second interpolation uses information generated by the estimated primaries or the estimated multiples; and
a reestimation of the estimated primaries or the estimated multiples uses information generated by the second interpolation. 14. The system of claim 13, wherein the interpolation engine performs the interpolation by execution of machine-readable instructions for a differential normal move out technique. 15. The system of claim 13, wherein the estimation engine performs primary estimation by execution of machine-readable instructions for primary estimation using a sparse inversion technique. 16. The system of claim 13, wherein the combination engine performs the combination of the second interpolation into the estimated primaries by execution of machine-readable instructions. 17. The system of claim 15, wherein the combination engine enables the primary estimation by sparse inversion technique to include execution of an update of a primary impulse response by:
calculation of first update directions for at least some of the received seismic data; and interpolation of second update directions for at least some of the first interpolated seismic data. 18. The system of claim 17, wherein the interpolation of the second update directions for the at least some of the first interpolated seismic data includes execution of a differential normal move out technique. 19. The system of claim 17, wherein execution of the update includes scaling of the update with a scaling factor such that:
an objective function value decreases by calculation of first scaling factors for at least some of the received seismic data; and interpolation of second scaling factors occurs for at least some of the first interpolated seismic data. 20. The system of claim 19, wherein the interpolation of the second scaling factors for the at least some of the first interpolated seismic data includes execution of a differential normal move out technique. 21. The system of claim 13, comprising an output engine to output at least one of estimated primaries and estimated multiples. 22. A non-transitory machine-readable medium storing instructions executable by a processing resource to cause a machine to:
perform an primary estimation by inversion on received seismic data; and incorporate performance of interpolation during the performance of the primary estimation by inversion. 23. The medium of claim 22, wherein the interpolation is performed by execution of machine-readable instructions for a differential normal move out technique. 24. The medium of claim 22, wherein the instructions executable to incorporate the performance of the interpolation during the performance of the primary estimation by inversion comprise instructions executable to:
include interpolated seismic data within the primary estimation by inversion to substitute for a number of calculations during the performance of the primary estimation by inversion. 25. The medium of claim 24, wherein to substitute for the number of calculations comprises reduction of a number of calculations per iteration of the performance of the primary estimation by inversion. 26. The medium of claim 24, wherein to substitute for the number of calculations comprises at least one of:
substitution of an interpolated update direction of a primary impulse response for at least one calculation of an update direction; and substitution of an interpolated scaling factor for at least one calculation of a scaling factor to scale an update such that an objective function value decreases. 27. The medium of claim 22, comprising instructions to perform a preliminary interpolation on the received seismic data prior to performance of the primary estimation by inversion. 28. The medium of claim 22, comprising instructions to output at least one of estimated primaries or estimated multiples. 29. A method of generating a geophysical data product, the method comprising:
obtaining geophysical data from a marine seismic survey; processing the geophysical data to generate the geophysical data product, wherein processing the geophysical data comprises:
performing a plurality of interpolations on the geophysical data;
performing a plurality of primary estimations on the geophysical data, wherein performing the plurality of primary estimations includes generating estimated primaries via a first primary estimation with input of a first interpolation; and
performing a combination of interpolation and primary estimations by:
generating reestimated primaries via a second primary estimation with input of a second interpolation;
wherein output of the first primary estimation is input to the second interpolation. 30. The method of claim 29, further comprising recording the geophysical data product on a non-transitory, tangible machine-readable medium suitable for importing onshore. | A method for combined interpolation and primary estimation can include performing a plurality of interpolations on received seismic data, performing a plurality of primary estimations on the received seismic data, and performing a combination of interpolation and primary estimation. Performing the combination can include generating reestimated primaries via a second primary estimation with input of a second interpolation, where output of the first primary estimation is input to the second interpolation.1. A method, comprising:
processing, by a machine, received seismic data, wherein the processing comprises:
performing, by the machine, a first interpolation on the received seismic data;
performing, by the machine, a first primary estimation on the first interpolated seismic data, wherein output of the first primary estimation includes:
estimated primaries; and
estimated multiples;
performing, by the machine, a second interpolation on the output of the first primary estimation; and
performing, by the machine, a second primary estimation on second interpolated seismic data, wherein output of the second primary estimation includes:
reestimated primaries; and
reestimated multiples. 2. The method of claim 1, comprising:
performing, by the machine, a third interpolation on the output of the second primary estimation; and performing, by the machine, a third primary estimation on the third interpolated seismic date, wherein output of the third primary estimation includes:
reestimated primaries; and
reestimated multiples. 3. A method, comprising:
processing, by a machine, received seismic data, wherein the processing comprises:
performing, by the machine, a plurality of interpolations on the received seismic data;
performing, by the machine, a plurality of primary estimations on the received seismic data, wherein performing the plurality of primary estimations includes generating estimated primaries via a first primary estimation with input of a first interpolation; and
performing, by the machine, a combination of interpolation and primary estimation by:
generating reestimated primaries via a second primary estimation with input of a second interpolation;
wherein output of the first primary estimation is input to the second interpolation. 4. The method of claim 3, comprising:
generating estimated multiples via the first primary estimation with input of the first interpolation; and generating reestimated multiples via a third primary estimation with input of a third interpolation; wherein output of the first primary estimation is input to the third interpolation. 5. The method of claim 4, comprising:
generating the reestimated primaries and the reestimated multiples via the estimated primaries and the estimated multiples output by the first primary estimation, each being processed separately with input of different second and third interpolations for the second and third primary estimations, respectively. 6. The method of claim 5, wherein the estimated primaries and the estimated multiples each being processed separately with the input of the different second and third interpolations comprises performing each interpolation separately with its own different differential normal move out velocity. 7. The method of claim 3, wherein performing, by the machine, the plurality of interpolations, comprises:
execution of machine-readable instructions to perform a differential normal move out technique. 8. The method of claim 3, wherein performing, by the machine, the plurality of primary estimations, comprises:
execution of machine-readable instructions to perform a sparse inversion technique for primary estimation. 9. The method of claim 8, wherein performing, by the machine, the combination of interpolation and primary estimation, comprises:
performing the sparse inversion technique for primary estimation to include an update of a primary impulse response by:
calculation of first update directions for at least some of the received seismic data; and
interpolation of second update directions for at least some of the first interpolated seismic data. 10. The method of claim 9, wherein the interpolation of the second update directions for the at least some of the first interpolated seismic data includes execution of a differential normal move out technique. 11. The method of claim 9, wherein execution of the update includes scaling of the update with a scaling factor such that:
an objective function value decreases by calculation of first scaling factors for at least some of the received seismic data; and interpolation of second scaling factors occurs for at least some of the first interpolated seismic data. 12. The method of claim 11, wherein the interpolation of the second scaling factors for the at least some of the first interpolated seismic data includes execution of a differential normal move out technique. 13. A system, comprising:
an interpolation engine to perform a first interpolation of non-received seismic data based on received seismic data; an estimation engine to determine estimated primaries and estimated multiples based on the received seismic data and the first interpolated seismic data; and a combination engine to combine a second interpolation into estimated primaries or the estimated multiples, such that:
the second interpolation uses information generated by the estimated primaries or the estimated multiples; and
a reestimation of the estimated primaries or the estimated multiples uses information generated by the second interpolation. 14. The system of claim 13, wherein the interpolation engine performs the interpolation by execution of machine-readable instructions for a differential normal move out technique. 15. The system of claim 13, wherein the estimation engine performs primary estimation by execution of machine-readable instructions for primary estimation using a sparse inversion technique. 16. The system of claim 13, wherein the combination engine performs the combination of the second interpolation into the estimated primaries by execution of machine-readable instructions. 17. The system of claim 15, wherein the combination engine enables the primary estimation by sparse inversion technique to include execution of an update of a primary impulse response by:
calculation of first update directions for at least some of the received seismic data; and interpolation of second update directions for at least some of the first interpolated seismic data. 18. The system of claim 17, wherein the interpolation of the second update directions for the at least some of the first interpolated seismic data includes execution of a differential normal move out technique. 19. The system of claim 17, wherein execution of the update includes scaling of the update with a scaling factor such that:
an objective function value decreases by calculation of first scaling factors for at least some of the received seismic data; and interpolation of second scaling factors occurs for at least some of the first interpolated seismic data. 20. The system of claim 19, wherein the interpolation of the second scaling factors for the at least some of the first interpolated seismic data includes execution of a differential normal move out technique. 21. The system of claim 13, comprising an output engine to output at least one of estimated primaries and estimated multiples. 22. A non-transitory machine-readable medium storing instructions executable by a processing resource to cause a machine to:
perform an primary estimation by inversion on received seismic data; and incorporate performance of interpolation during the performance of the primary estimation by inversion. 23. The medium of claim 22, wherein the interpolation is performed by execution of machine-readable instructions for a differential normal move out technique. 24. The medium of claim 22, wherein the instructions executable to incorporate the performance of the interpolation during the performance of the primary estimation by inversion comprise instructions executable to:
include interpolated seismic data within the primary estimation by inversion to substitute for a number of calculations during the performance of the primary estimation by inversion. 25. The medium of claim 24, wherein to substitute for the number of calculations comprises reduction of a number of calculations per iteration of the performance of the primary estimation by inversion. 26. The medium of claim 24, wherein to substitute for the number of calculations comprises at least one of:
substitution of an interpolated update direction of a primary impulse response for at least one calculation of an update direction; and substitution of an interpolated scaling factor for at least one calculation of a scaling factor to scale an update such that an objective function value decreases. 27. The medium of claim 22, comprising instructions to perform a preliminary interpolation on the received seismic data prior to performance of the primary estimation by inversion. 28. The medium of claim 22, comprising instructions to output at least one of estimated primaries or estimated multiples. 29. A method of generating a geophysical data product, the method comprising:
obtaining geophysical data from a marine seismic survey; processing the geophysical data to generate the geophysical data product, wherein processing the geophysical data comprises:
performing a plurality of interpolations on the geophysical data;
performing a plurality of primary estimations on the geophysical data, wherein performing the plurality of primary estimations includes generating estimated primaries via a first primary estimation with input of a first interpolation; and
performing a combination of interpolation and primary estimations by:
generating reestimated primaries via a second primary estimation with input of a second interpolation;
wherein output of the first primary estimation is input to the second interpolation. 30. The method of claim 29, further comprising recording the geophysical data product on a non-transitory, tangible machine-readable medium suitable for importing onshore. | 2,800 |
11,267 | 11,267 | 15,193,610 | 2,859 | A toteable or wearable fashion item configured to provide an electronic charge to a mobile electronic device. The item includes a battery including a battery housing enclosing at least one battery cell and at least one electronic connection port in communication with the battery cell. The battery is secured relative to the fashion item within a concealing enclosure which defines at least one connection port opening which facilitates access to the at least one electronic connection port. The battery is substantially concealed except through the at least one connection port opening. | 1. A toteable or wearable fashion item configured to provide an electronic charge to a mobile electronic device, comprising:
a battery including a battery housing enclosing at least one battery cell and at least one electronic connection port in communication with the battery cell; wherein the battery is secured relative to the fashion item within a concealing enclosure, the enclosure defining at least one connection port opening which facilitates access to the at least one electronic connection port, and wherein the battery is substantially concealed except through the at least one connection port opening. 2. The toteable or wearable fashion item according to claim 1 wherein the enclosure includes a pouch secured to the fashion item. 3. The toteable or wearable fashion item according to claim 2 wherein the enclosure is defined by the pouch and a portion of the fashion item. 4. The toteable or wearable fashion item according to claim 2 wherein the fashion item is a bag defining a main interior chamber and the pouch is secured within the main interior chamber. 5. The toteable or wearable fashion item according to claim 4 wherein the pouch is secured within a pocket within the main interior chamber. 6. The toteable or wearable fashion item according to claim 5 wherein the pocket is closeable. 7. The toteable or wearable fashion item according to claim 1 further comprising a universal connecting wire including a USB connector on one end and a pin connector on the other end. 8. The toteable or wearable fashion item according to claim 7 further comprising at least one adapter having a female pin connector port and a male connector having a configuration other than a pin connector. 9. The toteable or wearable fashion item according to claim 7 further comprising at least one multiport adapter having a female pin connector port and two or more male connectors. 10. The toteable or wearable fashion item according to claim 1 wherein the fashion item is selected from one of a handbag, shoulder bag, messenger bag, roller bag, garment bag, luggage, wallet or camera bag. 11. The toteable or wearable fashion item according to claim 1 wherein the fashion item is a clothing item. 12. The toteable or wearable fashion item according to claim 11 wherein the clothing item is selected from one of pants, shorts, a jacket, a shirt or a belt. 13. The toteable or wearable fashion item according to claim 11 wherein the clothing item includes a pocket and the pouch is secured within the pocket. 14. The toteable or wearable fashion item, according to claim 1 wherein the battery housing is irremovably secured within the enclosure. 15. The toteable or wearable fashion item according to claim 14 wherein the battery housing is stitched within the enclosure. 16. The toteable or wearable fashion item according to claim 1 wherein the at least one electronic connection port includes a USB port extending into the battery housing and a pin port extending into the battery housing. 17. The toteable or wearable fashion item according to claim 16 wherein the at least one opening is aligned with the USB port and the pin port. 18. The toteable or wearable fashion item according to claim 2 wherein the pouch is secured within a chamber of the fashion item and the chamber is without battery specific passages extending to an outside surface thereof such that the aesthetic appearance of the fashion item is not affected. 19. The toteable or wearable fashion item according to claim 1 wherein the enclosure includes a sealable opening. 20. The toteable or wearable fashion item according to claim 1 wherein a connecting wire extends through the at least one opening and is connected to the battery housing. | A toteable or wearable fashion item configured to provide an electronic charge to a mobile electronic device. The item includes a battery including a battery housing enclosing at least one battery cell and at least one electronic connection port in communication with the battery cell. The battery is secured relative to the fashion item within a concealing enclosure which defines at least one connection port opening which facilitates access to the at least one electronic connection port. The battery is substantially concealed except through the at least one connection port opening.1. A toteable or wearable fashion item configured to provide an electronic charge to a mobile electronic device, comprising:
a battery including a battery housing enclosing at least one battery cell and at least one electronic connection port in communication with the battery cell; wherein the battery is secured relative to the fashion item within a concealing enclosure, the enclosure defining at least one connection port opening which facilitates access to the at least one electronic connection port, and wherein the battery is substantially concealed except through the at least one connection port opening. 2. The toteable or wearable fashion item according to claim 1 wherein the enclosure includes a pouch secured to the fashion item. 3. The toteable or wearable fashion item according to claim 2 wherein the enclosure is defined by the pouch and a portion of the fashion item. 4. The toteable or wearable fashion item according to claim 2 wherein the fashion item is a bag defining a main interior chamber and the pouch is secured within the main interior chamber. 5. The toteable or wearable fashion item according to claim 4 wherein the pouch is secured within a pocket within the main interior chamber. 6. The toteable or wearable fashion item according to claim 5 wherein the pocket is closeable. 7. The toteable or wearable fashion item according to claim 1 further comprising a universal connecting wire including a USB connector on one end and a pin connector on the other end. 8. The toteable or wearable fashion item according to claim 7 further comprising at least one adapter having a female pin connector port and a male connector having a configuration other than a pin connector. 9. The toteable or wearable fashion item according to claim 7 further comprising at least one multiport adapter having a female pin connector port and two or more male connectors. 10. The toteable or wearable fashion item according to claim 1 wherein the fashion item is selected from one of a handbag, shoulder bag, messenger bag, roller bag, garment bag, luggage, wallet or camera bag. 11. The toteable or wearable fashion item according to claim 1 wherein the fashion item is a clothing item. 12. The toteable or wearable fashion item according to claim 11 wherein the clothing item is selected from one of pants, shorts, a jacket, a shirt or a belt. 13. The toteable or wearable fashion item according to claim 11 wherein the clothing item includes a pocket and the pouch is secured within the pocket. 14. The toteable or wearable fashion item, according to claim 1 wherein the battery housing is irremovably secured within the enclosure. 15. The toteable or wearable fashion item according to claim 14 wherein the battery housing is stitched within the enclosure. 16. The toteable or wearable fashion item according to claim 1 wherein the at least one electronic connection port includes a USB port extending into the battery housing and a pin port extending into the battery housing. 17. The toteable or wearable fashion item according to claim 16 wherein the at least one opening is aligned with the USB port and the pin port. 18. The toteable or wearable fashion item according to claim 2 wherein the pouch is secured within a chamber of the fashion item and the chamber is without battery specific passages extending to an outside surface thereof such that the aesthetic appearance of the fashion item is not affected. 19. The toteable or wearable fashion item according to claim 1 wherein the enclosure includes a sealable opening. 20. The toteable or wearable fashion item according to claim 1 wherein a connecting wire extends through the at least one opening and is connected to the battery housing. | 2,800 |
11,268 | 11,268 | 14,455,749 | 2,825 | A method for an erase operation on a nonvolatile memory array with low-latency erase suspend is described. The nonvolatile memory array comprises a plurality of blocks of memory cells, each block comprising a plurality of sectors of memory cells. The method includes, in response to an erase command identifying a block in the plurality of blocks in the array, erasing the plurality of sectors in the identified block, and determining whether there are over-erased cells in each sector. The method includes recording the over-erased cells for the sector. The method also includes responsive to suspend before a soft program pulse for the sector, applying a correction pulse to the recorded cells. | 1. A circuit comprising:
a nonvolatile memory array comprising a plurality of blocks of memory cells, each block comprising a plurality of sectors of memory cells; and control logic, the control logic configured to respond to an erase command identifying a block in the plurality of blocks in the array, to erase a current sector of the plurality of sectors of the identified block, and to determine whether there are over-erased cells in the current sector of the plurality of sectors. 2. The circuit of claim 1, wherein the control logic is configured to apply a soft program pulse to the current sector after determining whether there are over-erased cells in the current sector. 3. The circuit of claim 2, wherein the control logic is configured to record the over-erased cells, and responsive to suspend before the soft program pulse for the current sector, to apply a correction pulse to the recorded cells. 4. The circuit of claim 3, wherein the correction pulse increases threshold voltages of the recorded cells. 5. The circuit of claim 3, wherein a single over-erased cell is recorded in the current sector. 6. The circuit of claim 1, wherein the control logic is configured to erase the current sector by applying an erase bias that reduces threshold voltage of memory cells in the current sector. 7. The circuit of claim 6, wherein the control logic is further configured to verify whether memory cells in the current sector have threshold voltages below a first verify level, wherein the over-erased cells are a subset of memory cells in the current sector that have threshold voltages below a second verify level, the second verify level being lower than the first verify level. 8. A method comprising:
in response to an erase command identifying a block in a plurality of blocks of memory cells in a nonvolatile memory array, each block of the plurality of blocks comprising a plurality of sectors of memory cells, erasing a current sector of the identified block, and determining whether there are over-erased cells in the current sector. 9. The method of claim 8, further comprising applying a soft program pulse to the current sector after determining whether there are over-erased cells in the current sector. 10. The method of claim 9, further comprising recording the over-erased cells, and responsive to suspend before the soft program pulse for the current sector, applying a correction pulse to the recorded cells. 11. The method of claim 10, wherein the correction pulse increases threshold voltages of the recorded cells. 12. The method of claim 10, wherein a single over-erased cell is recorded in the current sector. 13. The method of claim 8, comprising erasing the current sector by applying an erase bias that reduces threshold voltage of memory cells in the current sector. 14. The method of claim 13, further comprising verifying whether memory cells in the current sector have threshold voltages below a first verify level, wherein the over-erased cells are a subset of memory cells in the current sector that have threshold voltages below a second verify level, the second verify level being lower than the first verify level. 15. A circuit comprising:
a nonvolatile memory array; and control logic, the control logic being configured to:
respond to an erase command identifying a block of memory cells in the array, by executing an erase operation including an erase sequence applying an erase bias that reduces threshold voltages of memory cells in the block, and an erase verify sequence that determines whether the memory cells in the block have threshold voltages below a first erase verify level, and that identifies a memory cell in the block that has a threshold voltage below a second erase verify level, different from the first erase verify level; and
respond to an erase suspend command by executing an erase suspend operation suspending the erase operation, including applying a bias arrangement to the identified cell increasing the threshold voltage of the identified memory cell, and allowing the control logic to execute another operation on the memory array. 16. The circuit of claim 15, wherein the erase operation includes a pre-program sequence before the erase sequence. 17. The circuit of claim 15, wherein the erase operation includes applying a soft program sequence after the erase verify sequence. 18. The circuit of claim 15, wherein:
the erase operation includes a plurality of cycles, each cycle including applying the erase sequence and erase verify sequence to a corresponding sector of the block, until all sectors of the block are erased, and wherein the erase operation includes applying a soft program sequence after the erase verify sequence for each sector of the block. 19. The circuit of claim 15, wherein the erase verify sequence iteratively identifies a subset of memory cells in the block that have threshold voltages below the second erase verify level, the subset of memory cells having the lowest threshold voltages among the memory cells in the block that have threshold voltages below the second erase verify level. 20. The circuit of claim 1 wherein, after erasing the current sector and determining whether there are over-erased cells in the current sector, the control logic is further configured to erase a next sector and determine if there are over-erased cells in the next sector, and to continue to erase and determine if there are over-erased cells, sector by sector, for each sector in the plurality of sectors. 21. The method of claim 8 further comprising, after erasing the current sector and determining whether there are over-erased cells in the current sector, erasing a next sector and determining if there are over-erased cells in the next sector, and continuing to erase and determine if there are over-erased cells, sector by sector, for each sector in the plurality of sectors. | A method for an erase operation on a nonvolatile memory array with low-latency erase suspend is described. The nonvolatile memory array comprises a plurality of blocks of memory cells, each block comprising a plurality of sectors of memory cells. The method includes, in response to an erase command identifying a block in the plurality of blocks in the array, erasing the plurality of sectors in the identified block, and determining whether there are over-erased cells in each sector. The method includes recording the over-erased cells for the sector. The method also includes responsive to suspend before a soft program pulse for the sector, applying a correction pulse to the recorded cells.1. A circuit comprising:
a nonvolatile memory array comprising a plurality of blocks of memory cells, each block comprising a plurality of sectors of memory cells; and control logic, the control logic configured to respond to an erase command identifying a block in the plurality of blocks in the array, to erase a current sector of the plurality of sectors of the identified block, and to determine whether there are over-erased cells in the current sector of the plurality of sectors. 2. The circuit of claim 1, wherein the control logic is configured to apply a soft program pulse to the current sector after determining whether there are over-erased cells in the current sector. 3. The circuit of claim 2, wherein the control logic is configured to record the over-erased cells, and responsive to suspend before the soft program pulse for the current sector, to apply a correction pulse to the recorded cells. 4. The circuit of claim 3, wherein the correction pulse increases threshold voltages of the recorded cells. 5. The circuit of claim 3, wherein a single over-erased cell is recorded in the current sector. 6. The circuit of claim 1, wherein the control logic is configured to erase the current sector by applying an erase bias that reduces threshold voltage of memory cells in the current sector. 7. The circuit of claim 6, wherein the control logic is further configured to verify whether memory cells in the current sector have threshold voltages below a first verify level, wherein the over-erased cells are a subset of memory cells in the current sector that have threshold voltages below a second verify level, the second verify level being lower than the first verify level. 8. A method comprising:
in response to an erase command identifying a block in a plurality of blocks of memory cells in a nonvolatile memory array, each block of the plurality of blocks comprising a plurality of sectors of memory cells, erasing a current sector of the identified block, and determining whether there are over-erased cells in the current sector. 9. The method of claim 8, further comprising applying a soft program pulse to the current sector after determining whether there are over-erased cells in the current sector. 10. The method of claim 9, further comprising recording the over-erased cells, and responsive to suspend before the soft program pulse for the current sector, applying a correction pulse to the recorded cells. 11. The method of claim 10, wherein the correction pulse increases threshold voltages of the recorded cells. 12. The method of claim 10, wherein a single over-erased cell is recorded in the current sector. 13. The method of claim 8, comprising erasing the current sector by applying an erase bias that reduces threshold voltage of memory cells in the current sector. 14. The method of claim 13, further comprising verifying whether memory cells in the current sector have threshold voltages below a first verify level, wherein the over-erased cells are a subset of memory cells in the current sector that have threshold voltages below a second verify level, the second verify level being lower than the first verify level. 15. A circuit comprising:
a nonvolatile memory array; and control logic, the control logic being configured to:
respond to an erase command identifying a block of memory cells in the array, by executing an erase operation including an erase sequence applying an erase bias that reduces threshold voltages of memory cells in the block, and an erase verify sequence that determines whether the memory cells in the block have threshold voltages below a first erase verify level, and that identifies a memory cell in the block that has a threshold voltage below a second erase verify level, different from the first erase verify level; and
respond to an erase suspend command by executing an erase suspend operation suspending the erase operation, including applying a bias arrangement to the identified cell increasing the threshold voltage of the identified memory cell, and allowing the control logic to execute another operation on the memory array. 16. The circuit of claim 15, wherein the erase operation includes a pre-program sequence before the erase sequence. 17. The circuit of claim 15, wherein the erase operation includes applying a soft program sequence after the erase verify sequence. 18. The circuit of claim 15, wherein:
the erase operation includes a plurality of cycles, each cycle including applying the erase sequence and erase verify sequence to a corresponding sector of the block, until all sectors of the block are erased, and wherein the erase operation includes applying a soft program sequence after the erase verify sequence for each sector of the block. 19. The circuit of claim 15, wherein the erase verify sequence iteratively identifies a subset of memory cells in the block that have threshold voltages below the second erase verify level, the subset of memory cells having the lowest threshold voltages among the memory cells in the block that have threshold voltages below the second erase verify level. 20. The circuit of claim 1 wherein, after erasing the current sector and determining whether there are over-erased cells in the current sector, the control logic is further configured to erase a next sector and determine if there are over-erased cells in the next sector, and to continue to erase and determine if there are over-erased cells, sector by sector, for each sector in the plurality of sectors. 21. The method of claim 8 further comprising, after erasing the current sector and determining whether there are over-erased cells in the current sector, erasing a next sector and determining if there are over-erased cells in the next sector, and continuing to erase and determine if there are over-erased cells, sector by sector, for each sector in the plurality of sectors. | 2,800 |
11,269 | 11,269 | 14,906,511 | 2,881 | An example method for analyzing drilling fluid used in a drilling operation within a subterranean formation may include receiving a drilling fluid sample from a flow of drilling fluid at a surface of the subterranean formation. A chemical composition of the drilling fluid sample may be determined using a mass spectrometer. A formation characteristic of the subterranean formation may be determined using the determined chemical composition. Determining the chemical composition of the drilling fluid sample may include determining the chemical composition of at least one of extracted gas from the drilling fluid sample and a liquid portion of the drilling fluid sample. | 1. A method for analyzing drilling fluid used in a drilling operation within a subterranean formation, comprising:
receiving a drilling fluid sample from a flow of drilling fluid at a surface of the subterranean formation; determining a chemical composition of the drilling fluid sample using a mass spectrometer; and determining a formation characteristic of the subterranean formation using the determined chemical composition. 2. The method of claim 1, wherein determining a chemical composition of the drilling fluid sample comprises determining the chemical composition of at least one of extracted gas from the drilling fluid sample and a liquid portion of the drilling fluid sample. 3. The method of claim 2, further comprising extracting gas from the drilling fluid sample using at least one of a continuously stirred vessel, distillation column, flash column, and separator column. 4. The method of claim 3, further comprising altering a temperature of the drilling fluid sample using at least one of a shell and tube heat exchanger, a thermoelectric heat exchanger, an electric heat exchanger, a finned tube heat exchanger, and a u-tube heat exchanger. 5. The method of claim 3, wherein extracting gas from the drilling fluid sample comprises introducing a carrier gas into the extracted gas. 6. The method of claim 2, further comprising altering the liquid portion of the drilling fluid sample. 7. The method of claim 6, wherein altering the liquid portion of the drilling fluid sample comprises at least one of diluting of the liquid portion in a solvent, contacting the liquid portion with an immiscible solvent, aerating the liquid portion with atmospheric or purified gasses, or performing pyrolysis on the liquid portion. 8. The method of claim 1, wherein determining the formation characteristic using the determined chemical composition comprises comparing the determined chemical composition to known chemical compositions of subterranean formations. 9. The method of claim 1, wherein the formation characteristic comprises at least one of a type of rock in the subterranean formation, the presence of hydrocarbons in the subterranean formation, the production potential for a strata of the subterranean formation, and the movement of fluid within the strata. 10. The method of claim 1, wherein receiving the drilling fluid sample from the flow of drilling fluid at the surface of the subterranean formation comprises receiving the drilling fluid sample from at least one of a return line, a mud tank, a gumbo box, a shale shaker, a suction line, and a stand pipe. 11. A system for analyzing drilling fluid used in a drilling operation within a subterranean formation, comprising:
a fluid circulation system positioned at the surface of the subterranean formation and configured to pump a flow of drilling fluid into and receive the flow of drilling fluid from a borehole in the subterranean formation; a drilling fluid analyzer in fluid communication with the fluid circulation system to receive and analyze a drilling fluid sample from the flow of drilling fluid; and an information handling system comprising a processor and a memory device containing a set of instructions that, when executed by the processor, cause the processor to
receive an output from the drilling fluid analyzer;
determine a chemical composition of the drilling fluid sample; and
determine a formation characteristic of the subterranean formation based, at least in part, on the determined chemical composition of the drilling fluid sample. 12. The system of claim 11, wherein
the drilling fluid analyzer analyzes at least one of extracted gas from the drilling fluid sample and a liquid portion of the drilling fluid sample; and the set of instructions that causes the processor to determine the chemical composition of the drilling fluid sample further causes the processor to determine the chemical composition of at least one of the extracted gas and the liquid portion. 13. The system of claim 12, wherein the drilling fluid analyzer comprises at least one of a continuously stirred vessel, distillation column, flash column, and separator column. 14. The system of claim 13, wherein the drilling fluid analyzer further comprises at least one of a shell and tube heat exchanger, a thermoelectric heat exchanger, an electric heat exchanger, a finned tube heat exchanger, and a u-tube heat exchanger. 15. The system of claim 12, wherein the drilling fluid analyzer comprises a sample preparation unit that at least one of dilutes the liquid portion in a solvent, contacts the liquid portion with an immiscible solvent, aerates the liquid portion with atmospheric or purified gasses, and performs pyrolysis on the liquid portion. 16. The system of claim 11, wherein the set of instructions that causes the processor to determine the formation characteristic based, at least in part, on the determined chemical composition further causes the processor to compare the determined chemical composition to known chemical compositions of subterranean formations. 17. The system of claim 11, wherein the formation characteristic comprises at least one of a type of rock in the subterranean formation, the presence of hydrocarbons in the subterranean formation, the production potential for a strata of the subterranean formation, and the movement of fluid within the strata. 18. The system of claim 11, wherein the drilling fluid analyzer receives the drilling fluid sample at least one of continuously or periodically from the flow of drilling fluid. 19. The system of claim 11, wherein the fluid circulation system comprises at least one of a return line, a mud tank, a gumbo box, a shale shaker, a suction line, and a stand pipe. 20. The system of claim 11, wherein the drilling fluid analyzer comprises a mass spectrometer. | An example method for analyzing drilling fluid used in a drilling operation within a subterranean formation may include receiving a drilling fluid sample from a flow of drilling fluid at a surface of the subterranean formation. A chemical composition of the drilling fluid sample may be determined using a mass spectrometer. A formation characteristic of the subterranean formation may be determined using the determined chemical composition. Determining the chemical composition of the drilling fluid sample may include determining the chemical composition of at least one of extracted gas from the drilling fluid sample and a liquid portion of the drilling fluid sample.1. A method for analyzing drilling fluid used in a drilling operation within a subterranean formation, comprising:
receiving a drilling fluid sample from a flow of drilling fluid at a surface of the subterranean formation; determining a chemical composition of the drilling fluid sample using a mass spectrometer; and determining a formation characteristic of the subterranean formation using the determined chemical composition. 2. The method of claim 1, wherein determining a chemical composition of the drilling fluid sample comprises determining the chemical composition of at least one of extracted gas from the drilling fluid sample and a liquid portion of the drilling fluid sample. 3. The method of claim 2, further comprising extracting gas from the drilling fluid sample using at least one of a continuously stirred vessel, distillation column, flash column, and separator column. 4. The method of claim 3, further comprising altering a temperature of the drilling fluid sample using at least one of a shell and tube heat exchanger, a thermoelectric heat exchanger, an electric heat exchanger, a finned tube heat exchanger, and a u-tube heat exchanger. 5. The method of claim 3, wherein extracting gas from the drilling fluid sample comprises introducing a carrier gas into the extracted gas. 6. The method of claim 2, further comprising altering the liquid portion of the drilling fluid sample. 7. The method of claim 6, wherein altering the liquid portion of the drilling fluid sample comprises at least one of diluting of the liquid portion in a solvent, contacting the liquid portion with an immiscible solvent, aerating the liquid portion with atmospheric or purified gasses, or performing pyrolysis on the liquid portion. 8. The method of claim 1, wherein determining the formation characteristic using the determined chemical composition comprises comparing the determined chemical composition to known chemical compositions of subterranean formations. 9. The method of claim 1, wherein the formation characteristic comprises at least one of a type of rock in the subterranean formation, the presence of hydrocarbons in the subterranean formation, the production potential for a strata of the subterranean formation, and the movement of fluid within the strata. 10. The method of claim 1, wherein receiving the drilling fluid sample from the flow of drilling fluid at the surface of the subterranean formation comprises receiving the drilling fluid sample from at least one of a return line, a mud tank, a gumbo box, a shale shaker, a suction line, and a stand pipe. 11. A system for analyzing drilling fluid used in a drilling operation within a subterranean formation, comprising:
a fluid circulation system positioned at the surface of the subterranean formation and configured to pump a flow of drilling fluid into and receive the flow of drilling fluid from a borehole in the subterranean formation; a drilling fluid analyzer in fluid communication with the fluid circulation system to receive and analyze a drilling fluid sample from the flow of drilling fluid; and an information handling system comprising a processor and a memory device containing a set of instructions that, when executed by the processor, cause the processor to
receive an output from the drilling fluid analyzer;
determine a chemical composition of the drilling fluid sample; and
determine a formation characteristic of the subterranean formation based, at least in part, on the determined chemical composition of the drilling fluid sample. 12. The system of claim 11, wherein
the drilling fluid analyzer analyzes at least one of extracted gas from the drilling fluid sample and a liquid portion of the drilling fluid sample; and the set of instructions that causes the processor to determine the chemical composition of the drilling fluid sample further causes the processor to determine the chemical composition of at least one of the extracted gas and the liquid portion. 13. The system of claim 12, wherein the drilling fluid analyzer comprises at least one of a continuously stirred vessel, distillation column, flash column, and separator column. 14. The system of claim 13, wherein the drilling fluid analyzer further comprises at least one of a shell and tube heat exchanger, a thermoelectric heat exchanger, an electric heat exchanger, a finned tube heat exchanger, and a u-tube heat exchanger. 15. The system of claim 12, wherein the drilling fluid analyzer comprises a sample preparation unit that at least one of dilutes the liquid portion in a solvent, contacts the liquid portion with an immiscible solvent, aerates the liquid portion with atmospheric or purified gasses, and performs pyrolysis on the liquid portion. 16. The system of claim 11, wherein the set of instructions that causes the processor to determine the formation characteristic based, at least in part, on the determined chemical composition further causes the processor to compare the determined chemical composition to known chemical compositions of subterranean formations. 17. The system of claim 11, wherein the formation characteristic comprises at least one of a type of rock in the subterranean formation, the presence of hydrocarbons in the subterranean formation, the production potential for a strata of the subterranean formation, and the movement of fluid within the strata. 18. The system of claim 11, wherein the drilling fluid analyzer receives the drilling fluid sample at least one of continuously or periodically from the flow of drilling fluid. 19. The system of claim 11, wherein the fluid circulation system comprises at least one of a return line, a mud tank, a gumbo box, a shale shaker, a suction line, and a stand pipe. 20. The system of claim 11, wherein the drilling fluid analyzer comprises a mass spectrometer. | 2,800 |
11,270 | 11,270 | 13,462,060 | 2,884 | The invention relates to a neutron detector ( 1 ) comprising a semiconductor detector substrate ( 10 ) and a conductive neutron converting layer ( 20 ), such as of TiB 2 . The neutron detector ( 1 ) thereby comprises a conductive contact made of a neutron conversion material ( 20 ). | 1. A neutron detector comprising:
a semiconductor detector substrate having a front side and a back side; a first electrical contact present on said front side and comprises a conductive neutron converting layer; and a second electrical contact present on said back side and comprises a conductive layer. 2. The neutron detector according to claim 1, wherein said conductive neutron converting layer is made of a conductive material comprising isotopes that are sensitive to neutrons and convert incident neutrons to detectable particle species. 3. The neutron detector according to claim 1, wherein said conductive neutron converting layer is made of a conductive boride material. 4. The neutron detector according to claim 3, wherein said conductive neutron converting layer is made of titanium diboride. 5. The neutron detector according to claim 4, wherein said conductive neutron converting layer is made of enriched titanium diboride with regard to a 10B isotope and boron in said enriched titanium diboride is present in at least 20% as said 10B isotope. 6. The neutron detector according to claim 1, wherein said conductive neutron converting layer has a thickness from about 100 nm to about 1 μm. 7. The neutron detector according to claim 1, wherein said semiconductor detector substrate comprises a three-dimensional structure in said front side. 8. The neutron detector according to claim 7, wherein said front side is serrated forming multiple sawteeth and said first electrical contact is deposited on said sawteeth. 9. The neutron detector according to claim 1, wherein said first electrical contact comprises a conductive gluing layer arranged between said conductive neutron converting layer and said semiconductor detector substrate. 10. The neutron detector according to claim 9, wherein said conductive gluing layer is one of a titanium layer and a chrome layer. 11. The neutron detector according to claim 9, wherein said conductive gluing layer has a thickness from about 10 nm to about 100 nm. 12. The neutron detector according to claim 1, wherein said first electrical contact comprises a conductive metal layer arranged on a first side of said conductive neutron converting layer that is opposite to a second side of said conductive neutron converting layer facing said semiconductor detector substrate. 13. The neutron detector according to claim 12, wherein said conductive metal layer is made of a metal selected from a group consisting of aluminum, silver, gold and titanium. 14. The neutron detector according to claim 12, wherein said conductive metal layer is made of a same conductive metal material as said conductive layer and has a thickness that is substantially the same as a thickness of said conductive layer. 15. The neutron detector according to claim 1, wherein said conductive layer is a conductive metal layer made of a metal selected from a group consisting of aluminum, silver, gold and titanium. 16. The neutron detector according to claim 1, wherein said conductive layer has a thickness from about 100 nm to about 1 μm. 17. The neutron detector according to claim 1, wherein said neutron detector is a pixel-based neutron detector with said conductive layer arranged in a form of multiple separate metal portions forming a grid on said back side. 18. The neutron detector according to claim 17, wherein said semiconductor detector substrate is doped to comprise a PN-junction and a distance between said PN-junction in said semiconductor detector substrate and said neutron converting layer is longer than a distance between said PN-junction in said semiconductor detector substrate and said conductive layer. 19. The neutron detector according to claim 1, wherein said semiconductor detector substrate is a silicon-based detector substrate. 20. The neutron detector according to claim 1, wherein said semiconductor detector substrate is doped to comprise a PN-junction. 21. The neutron detector according to claim 20, wherein said semiconductor detector substrate has a p-type semiconductive part facing said conductive neutron converting layer and a remaining n-type semiconductive part. 22. The neutron detector according to claim 20, wherein a distance between said PN-junction in said semiconductor detector substrate and said neutron converting layer is shorter than a distance between said PN-junction in said semiconductor detector substrate and said conductive layer. 23. The neutron detector according to claim 1, wherein said neutron detector is configured to detect at least one of thermal neutrons, epithermal neutrons and resonance neutrons. 24. The neutron detector according to claim 1, further comprising:
a second semiconductor detector layer having a front side and a back side, said back side of said second semiconductor detector layer is connected to a first side of said first electrical contact opposite to a second side of said first electrical contact connected to said semiconductor detector layer; and a third electrical contact present on said back side of said second semiconductor and comprises a conductive layer. | The invention relates to a neutron detector ( 1 ) comprising a semiconductor detector substrate ( 10 ) and a conductive neutron converting layer ( 20 ), such as of TiB 2 . The neutron detector ( 1 ) thereby comprises a conductive contact made of a neutron conversion material ( 20 ).1. A neutron detector comprising:
a semiconductor detector substrate having a front side and a back side; a first electrical contact present on said front side and comprises a conductive neutron converting layer; and a second electrical contact present on said back side and comprises a conductive layer. 2. The neutron detector according to claim 1, wherein said conductive neutron converting layer is made of a conductive material comprising isotopes that are sensitive to neutrons and convert incident neutrons to detectable particle species. 3. The neutron detector according to claim 1, wherein said conductive neutron converting layer is made of a conductive boride material. 4. The neutron detector according to claim 3, wherein said conductive neutron converting layer is made of titanium diboride. 5. The neutron detector according to claim 4, wherein said conductive neutron converting layer is made of enriched titanium diboride with regard to a 10B isotope and boron in said enriched titanium diboride is present in at least 20% as said 10B isotope. 6. The neutron detector according to claim 1, wherein said conductive neutron converting layer has a thickness from about 100 nm to about 1 μm. 7. The neutron detector according to claim 1, wherein said semiconductor detector substrate comprises a three-dimensional structure in said front side. 8. The neutron detector according to claim 7, wherein said front side is serrated forming multiple sawteeth and said first electrical contact is deposited on said sawteeth. 9. The neutron detector according to claim 1, wherein said first electrical contact comprises a conductive gluing layer arranged between said conductive neutron converting layer and said semiconductor detector substrate. 10. The neutron detector according to claim 9, wherein said conductive gluing layer is one of a titanium layer and a chrome layer. 11. The neutron detector according to claim 9, wherein said conductive gluing layer has a thickness from about 10 nm to about 100 nm. 12. The neutron detector according to claim 1, wherein said first electrical contact comprises a conductive metal layer arranged on a first side of said conductive neutron converting layer that is opposite to a second side of said conductive neutron converting layer facing said semiconductor detector substrate. 13. The neutron detector according to claim 12, wherein said conductive metal layer is made of a metal selected from a group consisting of aluminum, silver, gold and titanium. 14. The neutron detector according to claim 12, wherein said conductive metal layer is made of a same conductive metal material as said conductive layer and has a thickness that is substantially the same as a thickness of said conductive layer. 15. The neutron detector according to claim 1, wherein said conductive layer is a conductive metal layer made of a metal selected from a group consisting of aluminum, silver, gold and titanium. 16. The neutron detector according to claim 1, wherein said conductive layer has a thickness from about 100 nm to about 1 μm. 17. The neutron detector according to claim 1, wherein said neutron detector is a pixel-based neutron detector with said conductive layer arranged in a form of multiple separate metal portions forming a grid on said back side. 18. The neutron detector according to claim 17, wherein said semiconductor detector substrate is doped to comprise a PN-junction and a distance between said PN-junction in said semiconductor detector substrate and said neutron converting layer is longer than a distance between said PN-junction in said semiconductor detector substrate and said conductive layer. 19. The neutron detector according to claim 1, wherein said semiconductor detector substrate is a silicon-based detector substrate. 20. The neutron detector according to claim 1, wherein said semiconductor detector substrate is doped to comprise a PN-junction. 21. The neutron detector according to claim 20, wherein said semiconductor detector substrate has a p-type semiconductive part facing said conductive neutron converting layer and a remaining n-type semiconductive part. 22. The neutron detector according to claim 20, wherein a distance between said PN-junction in said semiconductor detector substrate and said neutron converting layer is shorter than a distance between said PN-junction in said semiconductor detector substrate and said conductive layer. 23. The neutron detector according to claim 1, wherein said neutron detector is configured to detect at least one of thermal neutrons, epithermal neutrons and resonance neutrons. 24. The neutron detector according to claim 1, further comprising:
a second semiconductor detector layer having a front side and a back side, said back side of said second semiconductor detector layer is connected to a first side of said first electrical contact opposite to a second side of said first electrical contact connected to said semiconductor detector layer; and a third electrical contact present on said back side of said second semiconductor and comprises a conductive layer. | 2,800 |
11,271 | 11,271 | 14,126,056 | 2,872 | A method is provided for addressing myopia progression or inclination to myopia in which the influence of accommodative lag stress on myopia is reduced or eliminated to counter eye axial length growth. User depth of focus is increased to relieve stress from overall accommodative effort and stress from accommodation and accommodative lag to retard myopia progression and enable continuous and long tem treatment by the user. | 1. A method of inhibiting or reducing myopic progression in a person comprising:
enabling clear distance vision; and while maintaining clear distance vision and without introducing diffractive effects, increasing depth of focus in the person's eyes so as to enable relief of accommodative stress during near vision. 2. A method, according to claim 1, and wherein:
the step of increasing depth of focus comprises creating an unfocused optical blur surrounding an image on the person's fovea. 3. A method, according to claim 2, and further comprising:
providing an optical surface that enables an increase in depth of focus. 4. A method, according to claim 3, and wherein:
the depth of focus increase is at least +0.25 diopters. 5. A method, according to claim 4, and wherein:
the depth of focus increase is +0.25 diopters to +1.00 diopters. 6-14. (canceled) 15. A method, according to claim 1, and wherein:
accommodative lag in the user is reduced by at least +0.25 diopters. 16. A method, according to claim 15, and wherein:
the reduction in accommodative lag is in the range of +0.25 diopters to +2.00 diopters. 17. A method, according to claim 1, and wherein:
the step of enabling clear distance vision comprises providing distance correction power and a peak refractive power in the range of +1 to +10 diopters greater than the distance correction power. 18. A method of designing a refractive lens for inhibiting or reducing myopic progression, comprising:
determining a person's unaided eye depth of focus; defining a treatment lens having a continuous power distribution configured to increase the person's depth of focus when in use. 19. An ophthalmic lens comprising:
an apex having distance vision correcting power; a power distribution increasing smoothly radially outward, from the apex to a peak power rise more positive than the distance vision correcting power; the power distribution having a first power at design point between the vision-correcting power and the peak power rise, the power of the distribution between the apex and design point sufficiently like in power to the distance vision correcting power to contribute to distance correction; the first power sufficient to create blur outside the design point; the power distribution power outside the design point sufficient to create a blur surrounding images on the user's fovea. 20. An ophthalmic lens according to claim 19 wherein the peak power rise is in the range of +1 to +10 diopters. 21. An ophthalmic lens according to claim 19 and wherein the design point is at a radial distance from the apex in the range of 0.5 millimeters and 1.5 millimeters. 22. An ophthalmic lens according to claim 19 and wherein:
the lens is configured to reduce a user's lag of accommodation at least 0.25 diopters. 23. An ophthalmic lens according to claim 19 and wherein:
the lens is an intraocular lens. 24. An ophthalmic lens according to claim 19 and wherein:
the lens is formed in a person's optical tissue. 25. A method of inhibiting or reducing myopic progression in a person comprising:
providing the lens of claim 24 to a person for use in the eye. 26. A method of inhibiting or reducing myopic progression in a person comprising:
forming an optical surface in a person's eye, the optical surface configured to increase the person's depth of focus during use. 27. A method for treating myopia, comprising the steps of:
providing a lens having a central region about the apex of the lens which yields clear distance vision, and an optical blur region immediately surrounding said central region which yields an unfocused optical image; such that the lens provides an induced aperture and an increased depth of focus; and applying said lens according to a protocol designed to inhibit or reduce myopic progression in the eye. 28. The method of claim 27 wherein the protocol enables relief of accommodative stress in the eye. 29. The method of claim 28 wherein said depth of focus is at least +0.25 diopters. 30. A method, according to claim 28, and wherein:
the user has a reduction in accommodative lag of at least +0.25 diopters. 31. A method, according to claim 28, wherein:
the reduction in accommodative lag is in the range of +0.25 to +2.0 diopters. 32. The method of claim 27 wherein said central region has a distance correction. 33. The method of claim 27 wherein:
said blur region comprises an optical surface creating a power distribution that varies smoothly from an apical power at the apex designed for distance correction through rapidly changing power surrounding said apical power. 34. A method for treating myopia, comprising the steps of:
providing a lens having a central region about the apex of the lens which yields clear distance vision, and a blur region immediately surrounding said central region which has a power distribution changing smoothly from said central region outwardly to a maximum power greater than an apical power, said rapidly increasing power distribution yielding an unfocused optical blur to the optical image, such that the lens provides an induced aperture and an increased depth of focus; and applying said lens according to a protocol designed to inhibit or reduce myopic progression in the eye. 35. The method of claim 34 wherein the protocol enables relief of accommodative stress in the eye. 36. A method, according to claim 34, and wherein:
the user has a reduction in accommodative lag of at least +0.25 diopters. 37. The method of claim 34 wherein said depth of focus is at least +0.25 diopters. 38. The method of claim 34 wherein said central region has a distance correction. 39. A method of designing a refractive lens for inhibiting or reducing myopic progression, comprising:
determining a person's unaided eye depth of focus; defining a treatment lens having a continuous power distribution configured to increase the person's depth of focus when in use; and applying said lens according to a protocol designed to inhibit or reduce myopic progression in the eye. 40. The method of claim 39 wherein said protocol includes having an individual wear said lens over an extended period of consecutive days but not necessarily when sleeping. 41. An method for treating myopia using an ophthalmic lens comprising:
providing an ophthalmic lens having an apex having distance vision correcting power; a power distribution increasing smoothly radially outward from the apex to a peak power rise more positive than the distance vision correcting power; wherein the power distribution has a first power at a design point between the vision-correcting power and the peak power rise, the power of the distribution between the apex and design point being sufficiently like in power to the distance vision correcting power to contribute to distance correction; the first power being sufficient to create blur outside the design point; the power distribution power outside the design point being sufficient to create a blur surrounding images on the user's fovea; and applying said lens according to a protocol designed to inhibit or reduce myopic progression in the eye. | A method is provided for addressing myopia progression or inclination to myopia in which the influence of accommodative lag stress on myopia is reduced or eliminated to counter eye axial length growth. User depth of focus is increased to relieve stress from overall accommodative effort and stress from accommodation and accommodative lag to retard myopia progression and enable continuous and long tem treatment by the user.1. A method of inhibiting or reducing myopic progression in a person comprising:
enabling clear distance vision; and while maintaining clear distance vision and without introducing diffractive effects, increasing depth of focus in the person's eyes so as to enable relief of accommodative stress during near vision. 2. A method, according to claim 1, and wherein:
the step of increasing depth of focus comprises creating an unfocused optical blur surrounding an image on the person's fovea. 3. A method, according to claim 2, and further comprising:
providing an optical surface that enables an increase in depth of focus. 4. A method, according to claim 3, and wherein:
the depth of focus increase is at least +0.25 diopters. 5. A method, according to claim 4, and wherein:
the depth of focus increase is +0.25 diopters to +1.00 diopters. 6-14. (canceled) 15. A method, according to claim 1, and wherein:
accommodative lag in the user is reduced by at least +0.25 diopters. 16. A method, according to claim 15, and wherein:
the reduction in accommodative lag is in the range of +0.25 diopters to +2.00 diopters. 17. A method, according to claim 1, and wherein:
the step of enabling clear distance vision comprises providing distance correction power and a peak refractive power in the range of +1 to +10 diopters greater than the distance correction power. 18. A method of designing a refractive lens for inhibiting or reducing myopic progression, comprising:
determining a person's unaided eye depth of focus; defining a treatment lens having a continuous power distribution configured to increase the person's depth of focus when in use. 19. An ophthalmic lens comprising:
an apex having distance vision correcting power; a power distribution increasing smoothly radially outward, from the apex to a peak power rise more positive than the distance vision correcting power; the power distribution having a first power at design point between the vision-correcting power and the peak power rise, the power of the distribution between the apex and design point sufficiently like in power to the distance vision correcting power to contribute to distance correction; the first power sufficient to create blur outside the design point; the power distribution power outside the design point sufficient to create a blur surrounding images on the user's fovea. 20. An ophthalmic lens according to claim 19 wherein the peak power rise is in the range of +1 to +10 diopters. 21. An ophthalmic lens according to claim 19 and wherein the design point is at a radial distance from the apex in the range of 0.5 millimeters and 1.5 millimeters. 22. An ophthalmic lens according to claim 19 and wherein:
the lens is configured to reduce a user's lag of accommodation at least 0.25 diopters. 23. An ophthalmic lens according to claim 19 and wherein:
the lens is an intraocular lens. 24. An ophthalmic lens according to claim 19 and wherein:
the lens is formed in a person's optical tissue. 25. A method of inhibiting or reducing myopic progression in a person comprising:
providing the lens of claim 24 to a person for use in the eye. 26. A method of inhibiting or reducing myopic progression in a person comprising:
forming an optical surface in a person's eye, the optical surface configured to increase the person's depth of focus during use. 27. A method for treating myopia, comprising the steps of:
providing a lens having a central region about the apex of the lens which yields clear distance vision, and an optical blur region immediately surrounding said central region which yields an unfocused optical image; such that the lens provides an induced aperture and an increased depth of focus; and applying said lens according to a protocol designed to inhibit or reduce myopic progression in the eye. 28. The method of claim 27 wherein the protocol enables relief of accommodative stress in the eye. 29. The method of claim 28 wherein said depth of focus is at least +0.25 diopters. 30. A method, according to claim 28, and wherein:
the user has a reduction in accommodative lag of at least +0.25 diopters. 31. A method, according to claim 28, wherein:
the reduction in accommodative lag is in the range of +0.25 to +2.0 diopters. 32. The method of claim 27 wherein said central region has a distance correction. 33. The method of claim 27 wherein:
said blur region comprises an optical surface creating a power distribution that varies smoothly from an apical power at the apex designed for distance correction through rapidly changing power surrounding said apical power. 34. A method for treating myopia, comprising the steps of:
providing a lens having a central region about the apex of the lens which yields clear distance vision, and a blur region immediately surrounding said central region which has a power distribution changing smoothly from said central region outwardly to a maximum power greater than an apical power, said rapidly increasing power distribution yielding an unfocused optical blur to the optical image, such that the lens provides an induced aperture and an increased depth of focus; and applying said lens according to a protocol designed to inhibit or reduce myopic progression in the eye. 35. The method of claim 34 wherein the protocol enables relief of accommodative stress in the eye. 36. A method, according to claim 34, and wherein:
the user has a reduction in accommodative lag of at least +0.25 diopters. 37. The method of claim 34 wherein said depth of focus is at least +0.25 diopters. 38. The method of claim 34 wherein said central region has a distance correction. 39. A method of designing a refractive lens for inhibiting or reducing myopic progression, comprising:
determining a person's unaided eye depth of focus; defining a treatment lens having a continuous power distribution configured to increase the person's depth of focus when in use; and applying said lens according to a protocol designed to inhibit or reduce myopic progression in the eye. 40. The method of claim 39 wherein said protocol includes having an individual wear said lens over an extended period of consecutive days but not necessarily when sleeping. 41. An method for treating myopia using an ophthalmic lens comprising:
providing an ophthalmic lens having an apex having distance vision correcting power; a power distribution increasing smoothly radially outward from the apex to a peak power rise more positive than the distance vision correcting power; wherein the power distribution has a first power at a design point between the vision-correcting power and the peak power rise, the power of the distribution between the apex and design point being sufficiently like in power to the distance vision correcting power to contribute to distance correction; the first power being sufficient to create blur outside the design point; the power distribution power outside the design point being sufficient to create a blur surrounding images on the user's fovea; and applying said lens according to a protocol designed to inhibit or reduce myopic progression in the eye. | 2,800 |
11,272 | 11,272 | 15,058,106 | 2,876 | Provided is a Device, a System, applications and an associated Ecosystem for the consistent and reliable production, creation, generation, management and utilization of two-dimensional (‘2D’) barcodes (‘Codes’) featuring embedded Images, designating the alignment position and alignment size of the embedding Images in 2D Codes and enabling the corresponding outputted Code files by the Device System to be downloaded and or showcased digitally within all forms of digital advertising, media, television, mobile telephony and the world wide web as well as integrated with the production processes for consumer products and packaged goods, printed products, merchandise and other items featuring such 2D Codes creating a public telecommunications platform and or private intranet services featuring a searchable database, directory and or registry of the 2D Codes with embedded Images that have been created by, produced by and outputted by the Device or System. | 1. A system for producing a 2D (2-Dimensional) code with an embedded image for an automated machine generated process, comprising a processor that produces the 2D code with an embedded image by:
i) obtaining character string information to be encoded for a 2D code and graphic data to be embedded in the described 2D code; ii reducing the obtained character string information: ii) generating a 2D code by encoding the obtained information; and ii) embedding the image of a predetermined size and optionally alignment at a predetermined location on the 2D code, wherein the image is of a size and alignment that allows for the code to be decoded properly. 2. A system as described in claim 1, wherein the system generates a plurality of same or different 2D codes with same or different images, wherein all the images embedded in the 2D codes have the same size and alignment. 3. A system as described in claim 1, wherein the system generates both a plurality of same codes and plurality of different codes. 4. A system as described in claim 1, wherein the system generates the 2D codes with different character string information. 5. A system as described in claim 1, wherein the system generates a same image on a plurality of codes that are different. 6. A system as described in claim 1, wherein the system generates a same image on a plurality of identical 2D codes. 7. A system as described in claim 1, wherein all images are produced with a same maximum size possible without substantially diminishing the accuracy of decoding the 2D codes. 8. A system us described in claim 1, wherein a ratio of space covered by the image compared to the code is about ⅓ to about 1/12. 9. A system as described in claim 1, wherein a ratio of space covered by the image compared to the code is about 1/9. 10. A system as described in claim 1, wherein tentative alignment and error calculation are not necessary due to the code and image having predetermined locations. 11. A system as described in claim 1, wherein the image is selected from the group consisting at least one of a letter, multiple letters or initials, a word, a keyboard symbol, an icon, an emblem, a shape, a design, a logo, a trademark, a face, an avatar, a picture, a brand, a number, a plurality of numbers, and combinations thereof. 12. A system as described in claim 1, wherein the code has about 0 to about 50 characters. 13. A system as described in claim 1, wherein the 2D code is QR code. 14. A system us described in claim 1, further comprising a memory for storing a program to be executed by a processor, and an interface that facilitates viewing a 2D code with an embedded image. 15. A system as described in claim 1, wherein a ratio of space covered by the image compared to the code is about ⅓ to about 1/12; and 16. A system as described in claim 1, wherein the code has less than about 100 characters. 17. A method for producing a 2D (2 Dimensional) code with an embedded image by un automated machine generated process, comprising;
i) obtaining character string information to be encoded fur a 2D code and graphic data be embedded in the described 2D code; ii) generating a 2D code by encoding the obtained information; and iii) embedding the image of a predetermined size and optionally alignment at a predetermined location in the 2D code, wherein the image is of a size that allows for the code to be properly decoded. 18. A system for producing a 2D (2D-Dimensional) code with an embedded image for an automated machine generated process, comprising a processor that produces the 2D code with an embedded image by:
i) obtaining character string information to be encoded for a 2D code and graphic data to be embedded in the described 2D code; ii) determining based on a number of characters where graphic data can be placed on a 2D code and a maximum size of the embedded image; and iii) generating the 2D code with the embedded image. 19. The system of claim 18, wherein the system blocks certain positions for embedding an image, allowing the image to be embedded elsewhere on the 2D code. | Provided is a Device, a System, applications and an associated Ecosystem for the consistent and reliable production, creation, generation, management and utilization of two-dimensional (‘2D’) barcodes (‘Codes’) featuring embedded Images, designating the alignment position and alignment size of the embedding Images in 2D Codes and enabling the corresponding outputted Code files by the Device System to be downloaded and or showcased digitally within all forms of digital advertising, media, television, mobile telephony and the world wide web as well as integrated with the production processes for consumer products and packaged goods, printed products, merchandise and other items featuring such 2D Codes creating a public telecommunications platform and or private intranet services featuring a searchable database, directory and or registry of the 2D Codes with embedded Images that have been created by, produced by and outputted by the Device or System.1. A system for producing a 2D (2-Dimensional) code with an embedded image for an automated machine generated process, comprising a processor that produces the 2D code with an embedded image by:
i) obtaining character string information to be encoded for a 2D code and graphic data to be embedded in the described 2D code; ii reducing the obtained character string information: ii) generating a 2D code by encoding the obtained information; and ii) embedding the image of a predetermined size and optionally alignment at a predetermined location on the 2D code, wherein the image is of a size and alignment that allows for the code to be decoded properly. 2. A system as described in claim 1, wherein the system generates a plurality of same or different 2D codes with same or different images, wherein all the images embedded in the 2D codes have the same size and alignment. 3. A system as described in claim 1, wherein the system generates both a plurality of same codes and plurality of different codes. 4. A system as described in claim 1, wherein the system generates the 2D codes with different character string information. 5. A system as described in claim 1, wherein the system generates a same image on a plurality of codes that are different. 6. A system as described in claim 1, wherein the system generates a same image on a plurality of identical 2D codes. 7. A system as described in claim 1, wherein all images are produced with a same maximum size possible without substantially diminishing the accuracy of decoding the 2D codes. 8. A system us described in claim 1, wherein a ratio of space covered by the image compared to the code is about ⅓ to about 1/12. 9. A system as described in claim 1, wherein a ratio of space covered by the image compared to the code is about 1/9. 10. A system as described in claim 1, wherein tentative alignment and error calculation are not necessary due to the code and image having predetermined locations. 11. A system as described in claim 1, wherein the image is selected from the group consisting at least one of a letter, multiple letters or initials, a word, a keyboard symbol, an icon, an emblem, a shape, a design, a logo, a trademark, a face, an avatar, a picture, a brand, a number, a plurality of numbers, and combinations thereof. 12. A system as described in claim 1, wherein the code has about 0 to about 50 characters. 13. A system as described in claim 1, wherein the 2D code is QR code. 14. A system us described in claim 1, further comprising a memory for storing a program to be executed by a processor, and an interface that facilitates viewing a 2D code with an embedded image. 15. A system as described in claim 1, wherein a ratio of space covered by the image compared to the code is about ⅓ to about 1/12; and 16. A system as described in claim 1, wherein the code has less than about 100 characters. 17. A method for producing a 2D (2 Dimensional) code with an embedded image by un automated machine generated process, comprising;
i) obtaining character string information to be encoded fur a 2D code and graphic data be embedded in the described 2D code; ii) generating a 2D code by encoding the obtained information; and iii) embedding the image of a predetermined size and optionally alignment at a predetermined location in the 2D code, wherein the image is of a size that allows for the code to be properly decoded. 18. A system for producing a 2D (2D-Dimensional) code with an embedded image for an automated machine generated process, comprising a processor that produces the 2D code with an embedded image by:
i) obtaining character string information to be encoded for a 2D code and graphic data to be embedded in the described 2D code; ii) determining based on a number of characters where graphic data can be placed on a 2D code and a maximum size of the embedded image; and iii) generating the 2D code with the embedded image. 19. The system of claim 18, wherein the system blocks certain positions for embedding an image, allowing the image to be embedded elsewhere on the 2D code. | 2,800 |
11,273 | 11,273 | 15,080,320 | 2,835 | An electric connection box includes an electronic component unit and a housing into which the electronic component unit is mounted. The electronic component unit includes a bus bar plate that includes a metallic bus bar incorporated in a resin member and electronic components that are electrically connected to the bus bar and are mounted on the bus bar plate. The electronic components include a relay mounted on one surface of the bus bar plate and a resistor mounted on another surface that is the back side of the one surface of the bus bar plate. The resistor is arranged at a position overlapping with the relay in a thickness direction of the bus bar plate. | 1. An electronic component unit comprising:
a bus bar plate that includes a metallic bus bar incorporated in a resin member; and electronic components that are electrically connected to the bus bar and are mounted on the bus bar plate,
wherein
the electronic components include
a first electronic component that is mounted on one surface of the bus bar plate, and
a second electronic component that is mounted on another surface that is a back side of the one surface of the bus bar plate and is arranged at a position overlapping with the first electronic component in a thickness direction of the bus bar plate. 2. The electronic component unit according to claim 1, wherein
a terminal of at least one of the first electronic component and the second electronic component is connected to a press contact blade that is part of the bus bar and protruding from a surface of the bus bar plate. 3. An electric connection box comprising:
an electronic component unit including a bus bar plate that includes a metallic bus bar incorporated in a resin member and electronic components that are electrically connected to the bus bar and are mounted on the bus bar plate; and a housing into which the electronic component unit is mounted, wherein the electronic components includes
a first electronic component that is mounted on one surface of the bus bar plate, and
a second electronic component that is mounted on another surface that is a back side of the one surface of the bus bar plate and is arranged at a position overlapping with the first electronic component in a thickness direction of the bus bar plate. | An electric connection box includes an electronic component unit and a housing into which the electronic component unit is mounted. The electronic component unit includes a bus bar plate that includes a metallic bus bar incorporated in a resin member and electronic components that are electrically connected to the bus bar and are mounted on the bus bar plate. The electronic components include a relay mounted on one surface of the bus bar plate and a resistor mounted on another surface that is the back side of the one surface of the bus bar plate. The resistor is arranged at a position overlapping with the relay in a thickness direction of the bus bar plate.1. An electronic component unit comprising:
a bus bar plate that includes a metallic bus bar incorporated in a resin member; and electronic components that are electrically connected to the bus bar and are mounted on the bus bar plate,
wherein
the electronic components include
a first electronic component that is mounted on one surface of the bus bar plate, and
a second electronic component that is mounted on another surface that is a back side of the one surface of the bus bar plate and is arranged at a position overlapping with the first electronic component in a thickness direction of the bus bar plate. 2. The electronic component unit according to claim 1, wherein
a terminal of at least one of the first electronic component and the second electronic component is connected to a press contact blade that is part of the bus bar and protruding from a surface of the bus bar plate. 3. An electric connection box comprising:
an electronic component unit including a bus bar plate that includes a metallic bus bar incorporated in a resin member and electronic components that are electrically connected to the bus bar and are mounted on the bus bar plate; and a housing into which the electronic component unit is mounted, wherein the electronic components includes
a first electronic component that is mounted on one surface of the bus bar plate, and
a second electronic component that is mounted on another surface that is a back side of the one surface of the bus bar plate and is arranged at a position overlapping with the first electronic component in a thickness direction of the bus bar plate. | 2,800 |
11,274 | 11,274 | 12,761,281 | 2,858 | A method for determining structural dip of subsurface formations includes accepting as input multiaxial induction measurements made by passing electric current through a multiaxial transmitter disposed in a wellbore drilled through subsurface rock formations. Voltages induced in a multiaxial receiver disposed at a longitudinally spaced apart location along the wellbore are detected while moving the transmitter and receiver along the wellbore. The multiaxial voltage measurements are inverted into values of formation dip magnitude and formation dip azimuth. A parameter related to shale content of the rock formations is measured, and structural dip of the rock formations is determined by selecting dip magnitude and dip azimuth values occurring when the parameter exceeds a selected threshold. | 1. A method for determining structural dip of subsurface formations, comprising:
accepting as input multiaxial induction measurements made by passing electric current through a multiaxial transmitter disposed in a wellbore drilled through subsurface rock formations, and detecting voltages induced in a multiaxial receiver disposed at a longitudinally spaced apart location along the wellbore while moving the transmitter and receiver along the wellbore; inverting the multiaxial voltage measurements into values of formation dip magnitude and formation dip azimuth; measuring a parameter related to shale content of the rock formations; and determining structural dip of the rock formations by selecting dip magnitude and dip azimuth values occurring when the parameter exceeds a selected threshold. 2. The method of claim 1 wherein the parameter comprises gamma ray intensity. 3. The method of claim 1 further comprising measuring voltages induced in a plurality of longitudinally spaced apart triaxial receivers. 4. The method of claim 1 wherein the voltage measurements comprise three orthogonal direct coupled components and six cross-coupled components. 5. The method of claim 1 further comprising generating a structural map of the rock formations using the determined structural dip. 6. A method for well logging, comprising:
moving a multiaxial induction well logging instrument along a wellbore drilled through subsurface rock formations, the instrument including at least one multiaxial induction transmitter and at least one multiaxial receiver longitudinally spaced apart from the transmitter; passing electric current through the transmitter; detecting voltages induced in the receiver; inverting the detected voltages into values of dip magnitude and dip azimuth of the rock formations; measuring a parameter related to shale content of the rock formations; and determining a structural dip of the rock formations at locations along the wellbore wherein the measured parameter exceeds a selected threshold. 7. The method of claim 6 wherein the parameter comprises gamma ray intensity. 8. The method of claim 6 further comprising measuring voltages induced in a plurality of longitudinally spaced apart triaxial receivers. 9. The method of claim 7 wherein the voltage measurements at each receiver comprise three orthogonal direct coupled components and six cross-coupled components. 10. The method of claim 6 wherein the voltage measurements at the receiver comprise three orthogonal direct coupled components and six cross-coupled components. 11. The method of claim 6 further comprising generating a structural map of the rock formations using the determined structural dip. 12. The method of claim 6 wherein the instrument is moved at the end of an armored electrical cable. 13. The method of claim 6 wherein the instrument is coupled within a pipe moved along the wellbore. | A method for determining structural dip of subsurface formations includes accepting as input multiaxial induction measurements made by passing electric current through a multiaxial transmitter disposed in a wellbore drilled through subsurface rock formations. Voltages induced in a multiaxial receiver disposed at a longitudinally spaced apart location along the wellbore are detected while moving the transmitter and receiver along the wellbore. The multiaxial voltage measurements are inverted into values of formation dip magnitude and formation dip azimuth. A parameter related to shale content of the rock formations is measured, and structural dip of the rock formations is determined by selecting dip magnitude and dip azimuth values occurring when the parameter exceeds a selected threshold.1. A method for determining structural dip of subsurface formations, comprising:
accepting as input multiaxial induction measurements made by passing electric current through a multiaxial transmitter disposed in a wellbore drilled through subsurface rock formations, and detecting voltages induced in a multiaxial receiver disposed at a longitudinally spaced apart location along the wellbore while moving the transmitter and receiver along the wellbore; inverting the multiaxial voltage measurements into values of formation dip magnitude and formation dip azimuth; measuring a parameter related to shale content of the rock formations; and determining structural dip of the rock formations by selecting dip magnitude and dip azimuth values occurring when the parameter exceeds a selected threshold. 2. The method of claim 1 wherein the parameter comprises gamma ray intensity. 3. The method of claim 1 further comprising measuring voltages induced in a plurality of longitudinally spaced apart triaxial receivers. 4. The method of claim 1 wherein the voltage measurements comprise three orthogonal direct coupled components and six cross-coupled components. 5. The method of claim 1 further comprising generating a structural map of the rock formations using the determined structural dip. 6. A method for well logging, comprising:
moving a multiaxial induction well logging instrument along a wellbore drilled through subsurface rock formations, the instrument including at least one multiaxial induction transmitter and at least one multiaxial receiver longitudinally spaced apart from the transmitter; passing electric current through the transmitter; detecting voltages induced in the receiver; inverting the detected voltages into values of dip magnitude and dip azimuth of the rock formations; measuring a parameter related to shale content of the rock formations; and determining a structural dip of the rock formations at locations along the wellbore wherein the measured parameter exceeds a selected threshold. 7. The method of claim 6 wherein the parameter comprises gamma ray intensity. 8. The method of claim 6 further comprising measuring voltages induced in a plurality of longitudinally spaced apart triaxial receivers. 9. The method of claim 7 wherein the voltage measurements at each receiver comprise three orthogonal direct coupled components and six cross-coupled components. 10. The method of claim 6 wherein the voltage measurements at the receiver comprise three orthogonal direct coupled components and six cross-coupled components. 11. The method of claim 6 further comprising generating a structural map of the rock formations using the determined structural dip. 12. The method of claim 6 wherein the instrument is moved at the end of an armored electrical cable. 13. The method of claim 6 wherein the instrument is coupled within a pipe moved along the wellbore. | 2,800 |
11,275 | 11,275 | 15,410,288 | 2,895 | A method of forming a semiconductor package. Implementations include forming on a die backside an intermediate metal layer having multiple sublayers, each including a metal selected from the group consisting of titanium, nickel, copper, silver, and combinations thereof. A tin layer is deposited onto the intermediate metal layer and is then reflowed with a silver layer of a substrate to form an intermetallic layer having a melting temperature above 260 degrees Celsius and including an intermetallic consisting of silver and tin and/or an intermetallic consisting of copper and tin. Another method of forming a semiconductor package includes forming a bump on each of a plurality of exposed pads of a top side of a die, each exposed pad surrounded by a passivation layer, each bump including an intermediate metal layer as described above and a tin layer coupled to the intermediate metal layer is reflowed to form an intermetallic layer. | 1. A semiconductor package, comprising:
a die comprising a plurality of layers arranged in the following order:
a layer comprising titanium coupled to the die; and
an intermetallic layer comprising one of an intermetallic consisting of silver and
tin and an intermetallic consisting of copper and tin; and
a substrate comprising a copper layer coupled to the intermetallic layer; wherein the intermetallic layer has a melting temperature greater than 260 degrees Celsius. 2. The semiconductor package of claim 1, further comprising a layer comprising nickel between the layer comprising titanium and the intermetallic layer. 3. The semiconductor package of claim 1, further comprising a layer comprising copper between the layer comprising titanium and the intermetallic layer. 4. The semiconductor package of claim 1, wherein the layer comprising titanium is on a backside of the die. 5. The semiconductor package of claim 1, wherein the layer comprising titanium is on an exposed pad of the die. 6. A semiconductor package, comprising:
a die coupled to a first sublayer, the first sublayer coupled to a second sublayer, wherein the first sublayer and the second sublayer each comprise a metal selected from the group consisting of titanium, nickel, copper, chromium, and any combination thereof; and an intermetallic layer having a melting temperature greater than 260 degrees Celsius coupled to the second sublayer; wherein the intermetallic layer is formed by reflowing at least a portion of an intermediate layer and a tin layer with a silver layer of a substrate; wherein the intermediate layer comprises a plurality of sublayers comprising the first and second sublayer; and wherein the substrate is coupled to the intermetallic layer, the substrate comprising a copper layer directly coupled with the silver layer. 7. The package of claim 6, wherein the first sublayer comprises titanium. 8. The package of claim 6, wherein the second sublayer comprises nickel. 9. The package of claim 6, wherein the intermediate layer further comprises a copper layer. 10. The package of claim 6, wherein the intermediate layer further comprises a silver layer. 11. The package of claim 6, wherein the intermediate layer further comprises both a copper layer and a silver layer. 12. The package of claim 6, wherein the package is formed using one of no solder paste and no solder preform. 13. A semiconductor package, comprising:
a plurality of exposed pads on a top side of a die; a passivation layer on the top side of the die surrounding each exposed pad; and a bump coupled to each of the plurality of exposed pads; wherein each bump comprises a titanium sublayer, a nickel sublayer, and one of a silver and tin intermetallic layer and a copper and tin intermetallic layer, the one of the silver and tin intermetallic layer and the copper and tin intermetallic layer having a melting temperature greater than 260 degrees Celsius; wherein the one of the silver and tin intermetallic layer and the copper and tin intermetallic layer is formed by reflowing a tin layer and one of a silver layer and copper layer with a silver layer of a substrate; wherein the substrate is coupled to the one of the silver and tin intermetallic layer and the copper and tin intermetallic layer, the substrate comprising a copper layer directly coupled with the silver layer. 14. The package of claim 13, wherein the nickel sublayer is not directly coupled to a copper layer in the intermetallic layer. 15. The package of claim 13, wherein the nickel sublayer is between the titanium sublayer and one of the silver and tin intermetallic layer and the copper and tin intermetallic layer. 16. The package of claim 13, wherein the package is formed using one of no solder paste and no solder preform. | A method of forming a semiconductor package. Implementations include forming on a die backside an intermediate metal layer having multiple sublayers, each including a metal selected from the group consisting of titanium, nickel, copper, silver, and combinations thereof. A tin layer is deposited onto the intermediate metal layer and is then reflowed with a silver layer of a substrate to form an intermetallic layer having a melting temperature above 260 degrees Celsius and including an intermetallic consisting of silver and tin and/or an intermetallic consisting of copper and tin. Another method of forming a semiconductor package includes forming a bump on each of a plurality of exposed pads of a top side of a die, each exposed pad surrounded by a passivation layer, each bump including an intermediate metal layer as described above and a tin layer coupled to the intermediate metal layer is reflowed to form an intermetallic layer.1. A semiconductor package, comprising:
a die comprising a plurality of layers arranged in the following order:
a layer comprising titanium coupled to the die; and
an intermetallic layer comprising one of an intermetallic consisting of silver and
tin and an intermetallic consisting of copper and tin; and
a substrate comprising a copper layer coupled to the intermetallic layer; wherein the intermetallic layer has a melting temperature greater than 260 degrees Celsius. 2. The semiconductor package of claim 1, further comprising a layer comprising nickel between the layer comprising titanium and the intermetallic layer. 3. The semiconductor package of claim 1, further comprising a layer comprising copper between the layer comprising titanium and the intermetallic layer. 4. The semiconductor package of claim 1, wherein the layer comprising titanium is on a backside of the die. 5. The semiconductor package of claim 1, wherein the layer comprising titanium is on an exposed pad of the die. 6. A semiconductor package, comprising:
a die coupled to a first sublayer, the first sublayer coupled to a second sublayer, wherein the first sublayer and the second sublayer each comprise a metal selected from the group consisting of titanium, nickel, copper, chromium, and any combination thereof; and an intermetallic layer having a melting temperature greater than 260 degrees Celsius coupled to the second sublayer; wherein the intermetallic layer is formed by reflowing at least a portion of an intermediate layer and a tin layer with a silver layer of a substrate; wherein the intermediate layer comprises a plurality of sublayers comprising the first and second sublayer; and wherein the substrate is coupled to the intermetallic layer, the substrate comprising a copper layer directly coupled with the silver layer. 7. The package of claim 6, wherein the first sublayer comprises titanium. 8. The package of claim 6, wherein the second sublayer comprises nickel. 9. The package of claim 6, wherein the intermediate layer further comprises a copper layer. 10. The package of claim 6, wherein the intermediate layer further comprises a silver layer. 11. The package of claim 6, wherein the intermediate layer further comprises both a copper layer and a silver layer. 12. The package of claim 6, wherein the package is formed using one of no solder paste and no solder preform. 13. A semiconductor package, comprising:
a plurality of exposed pads on a top side of a die; a passivation layer on the top side of the die surrounding each exposed pad; and a bump coupled to each of the plurality of exposed pads; wherein each bump comprises a titanium sublayer, a nickel sublayer, and one of a silver and tin intermetallic layer and a copper and tin intermetallic layer, the one of the silver and tin intermetallic layer and the copper and tin intermetallic layer having a melting temperature greater than 260 degrees Celsius; wherein the one of the silver and tin intermetallic layer and the copper and tin intermetallic layer is formed by reflowing a tin layer and one of a silver layer and copper layer with a silver layer of a substrate; wherein the substrate is coupled to the one of the silver and tin intermetallic layer and the copper and tin intermetallic layer, the substrate comprising a copper layer directly coupled with the silver layer. 14. The package of claim 13, wherein the nickel sublayer is not directly coupled to a copper layer in the intermetallic layer. 15. The package of claim 13, wherein the nickel sublayer is between the titanium sublayer and one of the silver and tin intermetallic layer and the copper and tin intermetallic layer. 16. The package of claim 13, wherein the package is formed using one of no solder paste and no solder preform. | 2,800 |
11,276 | 11,276 | 14,251,861 | 2,867 | Magnetic position sensors, systems and methods are disclosed. In an embodiment, a position sensing system includes a magnetic field source; and a sensor module spaced apart from the magnetic field source, at least one of the magnetic field source or the sensor module configured to move relative to the other along a path, the sensor module configured to determine a position of the magnetic field source relative to the sensor module from a nonlinear function of a ratio of a first component of a magnetic field of the magnetic field source to a second component of the magnetic field of the magnetic field source. | 1. A position sensing system comprising:
a magnetic field source; and a sensor module spaced apart from the magnetic field source, at least one of the magnetic field source or the sensor module configured to move relative to the other along a path, the sensor module configured to determine a position of the magnetic field source relative to the sensor module from a nonlinear function of a ratio of a first component of a magnetic field of the magnetic field source to a second component of the magnetic field of the magnetic field source. 2. The system of claim 1, wherein the nonlinear function avoids saturation. 3. The system of claim 1, wherein the sensor module comprises a plurality of magnetic sensor elements that comprise at least one of Hall elements or magnetoresistive (xMR) elements. 4. The system of claim 1, wherein the magnetic field source has a vanishing octupole. 5. A method of sensing a linear position of an object comprising:
coupling one of a permanent magnet or a sensor to the object, the permanent magnet being magnetized in a z-direction; arranging the other of the sensor or the permanent magnet proximate to and spaced apart from the one of the permanent magnet or the sensor in a y-direction; sensing a change in an x-direction of a magnetic field component Bz of the permanent magnet by a first sensor element of the sensor; sensing a change in the y-direction of the magnetic field component Bz of the permanent magnet by a second sensor element of the sensor; determining a ratio of dBz/dx to dBz/dy; and determining a position of the object on the path from the ratio. 6. A method of sensing a linear position of an object comprising:
coupling one of a permanent magnet or a sensor to the object, the permanent magnet being magnetized in a y-direction; arranging the other of the a sensor or the permanent magnet proximate to and spaced apart from the one of the permanent magnet or the sensor in a y-direction and a z-direction; sensing a Bx component of a magnetic field of the permanent magnet by a first sensor element of the sensor; sensing a Bz component of the magnetic field of the permanent magnet by a second sensor element of the sensor; determining a nonlinear function of Bx and Bz; and determining a position of the object on the path from the nonlinear function. 7. A position sensing system comprising:
a dipole magnet homogenously magnetized in a z-direction and having a vanishing octupole moment; and a sensor module positioned proximate to but spaced apart from the dipole magnet and comprising a plurality of sensor elements to sense x, y and z components of a magnetic field of the dipole magnet, the sensor module configured to determine a relative position of the magnet to the sensor module from the x, y and z components of the magnetic field. 8. The system of claim 7, further comprising a magnetic shielding element arranged relative to the dipole magnet to create a dipole magnetic field. 9. The system of claim 8, wherein the magnetic shielding element has a relative permeability greater than 1. 10. The system of claim 8 wherein the magnetic shielding element has a shape selected from the group consisting of a panel, an arc, and a cylinder. 11. The system of claim 8, wherein the dipole magnet is coupled to the magnetic shielding element. 12. The system of claim 11, wherein the dipole magnet is hemispherical. 13. The system of claim 8, wherein the dipole magnet is spaced apart from the magnetic shielding element. | Magnetic position sensors, systems and methods are disclosed. In an embodiment, a position sensing system includes a magnetic field source; and a sensor module spaced apart from the magnetic field source, at least one of the magnetic field source or the sensor module configured to move relative to the other along a path, the sensor module configured to determine a position of the magnetic field source relative to the sensor module from a nonlinear function of a ratio of a first component of a magnetic field of the magnetic field source to a second component of the magnetic field of the magnetic field source.1. A position sensing system comprising:
a magnetic field source; and a sensor module spaced apart from the magnetic field source, at least one of the magnetic field source or the sensor module configured to move relative to the other along a path, the sensor module configured to determine a position of the magnetic field source relative to the sensor module from a nonlinear function of a ratio of a first component of a magnetic field of the magnetic field source to a second component of the magnetic field of the magnetic field source. 2. The system of claim 1, wherein the nonlinear function avoids saturation. 3. The system of claim 1, wherein the sensor module comprises a plurality of magnetic sensor elements that comprise at least one of Hall elements or magnetoresistive (xMR) elements. 4. The system of claim 1, wherein the magnetic field source has a vanishing octupole. 5. A method of sensing a linear position of an object comprising:
coupling one of a permanent magnet or a sensor to the object, the permanent magnet being magnetized in a z-direction; arranging the other of the sensor or the permanent magnet proximate to and spaced apart from the one of the permanent magnet or the sensor in a y-direction; sensing a change in an x-direction of a magnetic field component Bz of the permanent magnet by a first sensor element of the sensor; sensing a change in the y-direction of the magnetic field component Bz of the permanent magnet by a second sensor element of the sensor; determining a ratio of dBz/dx to dBz/dy; and determining a position of the object on the path from the ratio. 6. A method of sensing a linear position of an object comprising:
coupling one of a permanent magnet or a sensor to the object, the permanent magnet being magnetized in a y-direction; arranging the other of the a sensor or the permanent magnet proximate to and spaced apart from the one of the permanent magnet or the sensor in a y-direction and a z-direction; sensing a Bx component of a magnetic field of the permanent magnet by a first sensor element of the sensor; sensing a Bz component of the magnetic field of the permanent magnet by a second sensor element of the sensor; determining a nonlinear function of Bx and Bz; and determining a position of the object on the path from the nonlinear function. 7. A position sensing system comprising:
a dipole magnet homogenously magnetized in a z-direction and having a vanishing octupole moment; and a sensor module positioned proximate to but spaced apart from the dipole magnet and comprising a plurality of sensor elements to sense x, y and z components of a magnetic field of the dipole magnet, the sensor module configured to determine a relative position of the magnet to the sensor module from the x, y and z components of the magnetic field. 8. The system of claim 7, further comprising a magnetic shielding element arranged relative to the dipole magnet to create a dipole magnetic field. 9. The system of claim 8, wherein the magnetic shielding element has a relative permeability greater than 1. 10. The system of claim 8 wherein the magnetic shielding element has a shape selected from the group consisting of a panel, an arc, and a cylinder. 11. The system of claim 8, wherein the dipole magnet is coupled to the magnetic shielding element. 12. The system of claim 11, wherein the dipole magnet is hemispherical. 13. The system of claim 8, wherein the dipole magnet is spaced apart from the magnetic shielding element. | 2,800 |
11,277 | 11,277 | 15,003,812 | 2,814 | A method for fabricating a package-on-package assembly is provided. A carrier with a passivation layer on the carrier is provided. A redistribution layer (RDL) is formed on the passivation layer. The RDL comprises at least one dielectric layer and at least one metal layer. The at least one metal layer comprises a plurality of first bump pads and second bump pads exposed from a top surface of the at least one dielectric layer. The first bump pads are disposed within a chip mounting area, while the second pads are disposed within a peripheral area. At least one chip is then mounted on the first bump pads. The at least one chip is electrically connected to the RDL through first bumps on the first bump pads. A die package is then mounted on the second bump pads. The die package is electrically connected to the RDL through second bumps on the second bump pads. | 1. A method for fabricating a package-on-package (PoP) assembly, comprising:
providing a carrier with a first passivation layer on the carrier; forming a redistribution layer (RDL) on the first passivation layer, wherein the RDL comprises at least one dielectric layer and at least one metal layer, wherein the at least one metal layer comprises first bump pads and second bump pads exposed from a top surface of the at least one dielectric layer, wherein the first bump pads are disposed within a chip mounting area, and the second bump pads are disposed within a peripheral area around the chip mounting area; mounting at least one first chip on the first bump pads, wherein the at least one first chip is electrically connected to the RDL through first bumps on the first bump pads; mounting a die package comprising at least one second chip pre-encapsulated in a first molding compound on the second bump pads, wherein the die package is electrically connected to the RDL through second bumps on the second bump pads; and encapsulating the die package, the at least one chip, and the RDL in a second molding compound and curing the second molding compound at a temperature lower than a glass transition temperature of the first molding compound. 2. The method for fabricating a PoP assembly according to claim 1, wherein before mounting the at least one chip on the first bump pads, the method further comprises:
forming a second passivation layer on the at least one dielectric layer; forming first and second openings in the second passivation layer to expose respective first and second bump pads; and forming the first bumps on the respective first bump pads. 3. The method for fabricating a PoP assembly according to claim 1, wherein after mounting the die package on the second bump pads, the method further comprises:
de-bonding the carrier to thereby expose a major surface of the first passivation layer; forming solder balls in or on the first passivation layer; and performing a dicing process to singulate individual package-on-package assemblies. 4. The method for fabricating a PoP assembly according to claim 1, wherein providing the first passivation layer comprises providing an organic material. 5. The method for fabricating a PoP assembly according to claim 4, wherein providing the organic material comprises providing a polyimide. 6. The method for fabricating a PoP assembly according to claim 1, wherein providing the first passivation layer comprises providing an inorganic material. 7. The method for fabricating a PoP assembly according to claim 1, wherein providing the inorganic material comprises providing silicon nitride or silicon oxide. 8. The method for fabricating a PoP assembly according to claim 1, wherein forming the redistribution layer comprising the at least one metal layer comprises forming the redistribution layer comprising at least one layer of aluminum, copper, tungsten, titanium, or titanium nitride. 9. The method for fabricating a PoP assembly according to claim 2, wherein forming the second passivation layer comprises forming polyimide or a solder mask material. 10. The method for fabricating a PoP assembly according to claim 1, wherein mounting the die package comprises mounting a die package comprising second chips pre-encapsulated in the first molding compound. 11. A package-on-package (PoP) assembly, comprising:
a first passivation layer; a redistribution layer (RDL) on the first passivation layer wherein the RDL comprises at least one dielectric layer and at least one metal layer, wherein the at least one metal layer comprises first bump pads and second bump pads exposed from a top surface of the at least one dielectric layer, wherein the first bump pads are disposed within a chip mounting area, and the second bump pads are disposed within a peripheral area around the chip mounting area; at least one chip mounted on the first bump pads, wherein the at least one chip is electrically connected to the RDL through first bumps on the first bump pads; a die package on the second bump pads, wherein the die package is electrically connected to the RDL through second bumps on the second bump pads, and wherein the die package comprises a first molding compound; and a second molding compound encapsulating the die package and the RDL, the second molding compound having a curing temperature lower than a glass transition temperature of the first molding compound. 12. The package-on-package (PoP) assembly according to claim 11, further comprising:
a second passivation layer on the at least one dielectric layer; and first openings and second openings in the second passivation layer to expose respective first and second bump pads. 13. The package-on-package (PoP) assembly according to claim 11, wherein the first molding compound and the second molding compound have different compositions. | A method for fabricating a package-on-package assembly is provided. A carrier with a passivation layer on the carrier is provided. A redistribution layer (RDL) is formed on the passivation layer. The RDL comprises at least one dielectric layer and at least one metal layer. The at least one metal layer comprises a plurality of first bump pads and second bump pads exposed from a top surface of the at least one dielectric layer. The first bump pads are disposed within a chip mounting area, while the second pads are disposed within a peripheral area. At least one chip is then mounted on the first bump pads. The at least one chip is electrically connected to the RDL through first bumps on the first bump pads. A die package is then mounted on the second bump pads. The die package is electrically connected to the RDL through second bumps on the second bump pads.1. A method for fabricating a package-on-package (PoP) assembly, comprising:
providing a carrier with a first passivation layer on the carrier; forming a redistribution layer (RDL) on the first passivation layer, wherein the RDL comprises at least one dielectric layer and at least one metal layer, wherein the at least one metal layer comprises first bump pads and second bump pads exposed from a top surface of the at least one dielectric layer, wherein the first bump pads are disposed within a chip mounting area, and the second bump pads are disposed within a peripheral area around the chip mounting area; mounting at least one first chip on the first bump pads, wherein the at least one first chip is electrically connected to the RDL through first bumps on the first bump pads; mounting a die package comprising at least one second chip pre-encapsulated in a first molding compound on the second bump pads, wherein the die package is electrically connected to the RDL through second bumps on the second bump pads; and encapsulating the die package, the at least one chip, and the RDL in a second molding compound and curing the second molding compound at a temperature lower than a glass transition temperature of the first molding compound. 2. The method for fabricating a PoP assembly according to claim 1, wherein before mounting the at least one chip on the first bump pads, the method further comprises:
forming a second passivation layer on the at least one dielectric layer; forming first and second openings in the second passivation layer to expose respective first and second bump pads; and forming the first bumps on the respective first bump pads. 3. The method for fabricating a PoP assembly according to claim 1, wherein after mounting the die package on the second bump pads, the method further comprises:
de-bonding the carrier to thereby expose a major surface of the first passivation layer; forming solder balls in or on the first passivation layer; and performing a dicing process to singulate individual package-on-package assemblies. 4. The method for fabricating a PoP assembly according to claim 1, wherein providing the first passivation layer comprises providing an organic material. 5. The method for fabricating a PoP assembly according to claim 4, wherein providing the organic material comprises providing a polyimide. 6. The method for fabricating a PoP assembly according to claim 1, wherein providing the first passivation layer comprises providing an inorganic material. 7. The method for fabricating a PoP assembly according to claim 1, wherein providing the inorganic material comprises providing silicon nitride or silicon oxide. 8. The method for fabricating a PoP assembly according to claim 1, wherein forming the redistribution layer comprising the at least one metal layer comprises forming the redistribution layer comprising at least one layer of aluminum, copper, tungsten, titanium, or titanium nitride. 9. The method for fabricating a PoP assembly according to claim 2, wherein forming the second passivation layer comprises forming polyimide or a solder mask material. 10. The method for fabricating a PoP assembly according to claim 1, wherein mounting the die package comprises mounting a die package comprising second chips pre-encapsulated in the first molding compound. 11. A package-on-package (PoP) assembly, comprising:
a first passivation layer; a redistribution layer (RDL) on the first passivation layer wherein the RDL comprises at least one dielectric layer and at least one metal layer, wherein the at least one metal layer comprises first bump pads and second bump pads exposed from a top surface of the at least one dielectric layer, wherein the first bump pads are disposed within a chip mounting area, and the second bump pads are disposed within a peripheral area around the chip mounting area; at least one chip mounted on the first bump pads, wherein the at least one chip is electrically connected to the RDL through first bumps on the first bump pads; a die package on the second bump pads, wherein the die package is electrically connected to the RDL through second bumps on the second bump pads, and wherein the die package comprises a first molding compound; and a second molding compound encapsulating the die package and the RDL, the second molding compound having a curing temperature lower than a glass transition temperature of the first molding compound. 12. The package-on-package (PoP) assembly according to claim 11, further comprising:
a second passivation layer on the at least one dielectric layer; and first openings and second openings in the second passivation layer to expose respective first and second bump pads. 13. The package-on-package (PoP) assembly according to claim 11, wherein the first molding compound and the second molding compound have different compositions. | 2,800 |
11,278 | 11,278 | 14,473,075 | 2,832 | An electric drive system for a vehicle includes a first generator in communication with a first engine, a second generator in communication with a second engine, a first rectifier and a second rectifier. Each generator has a main winding, each main winding being independently excitable and generating an alternating current (AC) output. A main AC output of the main winding of the first generator is in communication with the first rectifier, and a main AC output of the main winding of the second generator is in communication with the second rectifier. When in drive mode, the first engine drives the first generator and the second engine drives the second generator, and the first and second generators supply power to a plurality of inverters coupled to the first and second rectifiers, the plurality of inverts supplying power to a plurality of electric wheel motors. | 1. Electric drive system for a vehicle comprising:
a first generator in communication with a first engine; a second generator in communication with a second engine; a first rectifier and a second rectifier; wherein each generator comprises a main winding, each main winding being independently excitable and generating an alternating current (AC) output, a main AC output of the main winding of the first generator in communication with the first rectifier, and a main AC output of the main winding of the second generator in communication with the second rectifier, wherein, when in drive mode, the first engine drives the first generator and the second engine drives the second generator, and the first and second generators supply power to a plurality of inverters coupled to the first and second rectifiers, the plurality of inverts supplying power to a plurality of electric wheel motors. 2. The electric drive system of claim 1, wherein the first and second rectifiers each comprise a direct current (DC) output, both DC outputs of the first and second rectifiers being connected to a main DC bus. 3. The electric drive system of claim 1, wherein each generator comprises an auxiliary winding, each auxiliary winding being independently excitable and generating an AC output. 4. The electric drive system of claim 3, wherein an auxiliary AC output of the auxiliary winding of the first generator is connected to a first auxiliary rectifier, and an auxiliary AC output of the auxiliary winding of the second generator is connected to a second auxiliary rectifier, both auxiliary rectifiers each comprising a direct current (DC) output, and both DC outputs of the auxiliary rectifiers being connected to an auxiliary DC bus. 5. The electric drive system of claim 2, wherein the plurality of inverters draws DC power from the main DC bus and supplies AC power to the plurality of electric wheel motors when in the drive mode. 6. The electric drive system of claim 2, wherein the main DC bus comprises separate DC busses for the first and second rectifiers. 7. Electric drive system of claim 1 configured to power a mining haul truck. 8. A method for providing electric power for a vehicle, the method comprising:
supplying electric power by at least two generators to at least four electric wheel motors, the at least two generators being in communication with at least two engines, wherein the electric power is supplied from a plurality of inverters for at least four electric wheel motors via at least two rectifiers, the at least two rectifiers being operably connected to the at least two generators. 9. The method of claim 8, wherein the at least two engines, the at least two generators and the at least four electric wheel motors are mounted on the vehicle. 10. The method of claim 8, wherein the at least four electric wheel motors are independently operable. 11. The method of claim 8, wherein the at least two generators are operated in parallel. 12. The method of claim 8, wherein outputs of the at least two generators are operably connected to the at least two rectifiers, the at least two rectifiers each comprising a direct current (DC) output, the DC output being connected to a main DC bus, and
wherein the outputs of the at least two generators are further operably connected to at least two auxiliary rectifiers, the at least two auxiliary rectifiers each comprising a direct current (DC) output, the DC output being connected to an auxiliary DC bus, the main DC bus and the auxiliary DC bus being operable in parallel. 13. The method of claim 8, wherein the vehicle is a mining haul truck. 14. An electric drive system comprising:
a first engine coupled to a first alternator, wherein the first alternator generates a first output and a second output; a second engine coupled to a second alternator, wherein the second alternator generates a third output and a fourth output; a first main rectifier operably connected to the first output of the first alternator; a first auxiliary rectifier operably connected to the second output of the first alternator; a second main rectifier operably connected to the third output of the second alternator; a second auxiliary rectifier operably connected to the fourth output of the second alternator; wherein the first and second main rectifiers each generate a direct current (DC) output, and both DC outputs of the main rectifiers are connected to a main DC bus, and wherein the first and second auxiliary rectifiers each generate a direct current (DC) output, and both DC outputs of the auxiliary rectifiers are connected to an auxiliary DC bus providing an auxiliary output for auxiliary devices, wherein the main DC bus provides electric power for a plurality of inverters in operable connection with wheel motors for driving wheels of a vehicle during drive mode. 15. The electric drive system of claim 14, wherein the main DC bus and the auxiliary DC bus are operable in parallel. 16. The electric drive system of claim 14, the plurality of inverters comprising a first inverter, a second inverter, a third inverter, and a fourth inverter,
wherein each inverter draws DC power from the main DC bus and generates an alternating current (AC) output for the wheel motors. 17. The electric drive system of claim 14 configured to power a mining haul truck. 18. The electric drive system of claim 17, wherein the first and second engines, the first and second alternators and the wheel motors are mounted on the mining haul truck. 19. The electric drive system of claim 14, wherein the wheel motors are independently operable. 20. The electric drive system of claim 14, wherein the first and second alternators are operated in parallel. | An electric drive system for a vehicle includes a first generator in communication with a first engine, a second generator in communication with a second engine, a first rectifier and a second rectifier. Each generator has a main winding, each main winding being independently excitable and generating an alternating current (AC) output. A main AC output of the main winding of the first generator is in communication with the first rectifier, and a main AC output of the main winding of the second generator is in communication with the second rectifier. When in drive mode, the first engine drives the first generator and the second engine drives the second generator, and the first and second generators supply power to a plurality of inverters coupled to the first and second rectifiers, the plurality of inverts supplying power to a plurality of electric wheel motors.1. Electric drive system for a vehicle comprising:
a first generator in communication with a first engine; a second generator in communication with a second engine; a first rectifier and a second rectifier; wherein each generator comprises a main winding, each main winding being independently excitable and generating an alternating current (AC) output, a main AC output of the main winding of the first generator in communication with the first rectifier, and a main AC output of the main winding of the second generator in communication with the second rectifier, wherein, when in drive mode, the first engine drives the first generator and the second engine drives the second generator, and the first and second generators supply power to a plurality of inverters coupled to the first and second rectifiers, the plurality of inverts supplying power to a plurality of electric wheel motors. 2. The electric drive system of claim 1, wherein the first and second rectifiers each comprise a direct current (DC) output, both DC outputs of the first and second rectifiers being connected to a main DC bus. 3. The electric drive system of claim 1, wherein each generator comprises an auxiliary winding, each auxiliary winding being independently excitable and generating an AC output. 4. The electric drive system of claim 3, wherein an auxiliary AC output of the auxiliary winding of the first generator is connected to a first auxiliary rectifier, and an auxiliary AC output of the auxiliary winding of the second generator is connected to a second auxiliary rectifier, both auxiliary rectifiers each comprising a direct current (DC) output, and both DC outputs of the auxiliary rectifiers being connected to an auxiliary DC bus. 5. The electric drive system of claim 2, wherein the plurality of inverters draws DC power from the main DC bus and supplies AC power to the plurality of electric wheel motors when in the drive mode. 6. The electric drive system of claim 2, wherein the main DC bus comprises separate DC busses for the first and second rectifiers. 7. Electric drive system of claim 1 configured to power a mining haul truck. 8. A method for providing electric power for a vehicle, the method comprising:
supplying electric power by at least two generators to at least four electric wheel motors, the at least two generators being in communication with at least two engines, wherein the electric power is supplied from a plurality of inverters for at least four electric wheel motors via at least two rectifiers, the at least two rectifiers being operably connected to the at least two generators. 9. The method of claim 8, wherein the at least two engines, the at least two generators and the at least four electric wheel motors are mounted on the vehicle. 10. The method of claim 8, wherein the at least four electric wheel motors are independently operable. 11. The method of claim 8, wherein the at least two generators are operated in parallel. 12. The method of claim 8, wherein outputs of the at least two generators are operably connected to the at least two rectifiers, the at least two rectifiers each comprising a direct current (DC) output, the DC output being connected to a main DC bus, and
wherein the outputs of the at least two generators are further operably connected to at least two auxiliary rectifiers, the at least two auxiliary rectifiers each comprising a direct current (DC) output, the DC output being connected to an auxiliary DC bus, the main DC bus and the auxiliary DC bus being operable in parallel. 13. The method of claim 8, wherein the vehicle is a mining haul truck. 14. An electric drive system comprising:
a first engine coupled to a first alternator, wherein the first alternator generates a first output and a second output; a second engine coupled to a second alternator, wherein the second alternator generates a third output and a fourth output; a first main rectifier operably connected to the first output of the first alternator; a first auxiliary rectifier operably connected to the second output of the first alternator; a second main rectifier operably connected to the third output of the second alternator; a second auxiliary rectifier operably connected to the fourth output of the second alternator; wherein the first and second main rectifiers each generate a direct current (DC) output, and both DC outputs of the main rectifiers are connected to a main DC bus, and wherein the first and second auxiliary rectifiers each generate a direct current (DC) output, and both DC outputs of the auxiliary rectifiers are connected to an auxiliary DC bus providing an auxiliary output for auxiliary devices, wherein the main DC bus provides electric power for a plurality of inverters in operable connection with wheel motors for driving wheels of a vehicle during drive mode. 15. The electric drive system of claim 14, wherein the main DC bus and the auxiliary DC bus are operable in parallel. 16. The electric drive system of claim 14, the plurality of inverters comprising a first inverter, a second inverter, a third inverter, and a fourth inverter,
wherein each inverter draws DC power from the main DC bus and generates an alternating current (AC) output for the wheel motors. 17. The electric drive system of claim 14 configured to power a mining haul truck. 18. The electric drive system of claim 17, wherein the first and second engines, the first and second alternators and the wheel motors are mounted on the mining haul truck. 19. The electric drive system of claim 14, wherein the wheel motors are independently operable. 20. The electric drive system of claim 14, wherein the first and second alternators are operated in parallel. | 2,800 |
11,279 | 11,279 | 14,792,767 | 2,837 | A ligature for a wind instrument is provided. The ligature includes a cord harness having a plurality of apertures extending transverse to a longitudinal axis of the cord harness, and an adjuster. The adjuster is connected to and extends transverse to the longitudinal axis of the cord harness. The ligature further includes a cord passing through the plurality of apertures in a spiral manner and engages a distal end of the adjuster. | 1. A ligature for a wind instrument comprising:
a cord harness having a plurality of apertures extending transverse to a longitudinal axis of the cord harness; an adjuster connected to and adjustably extendable relative to the cord harness; and a cord passing through the plurality of apertures in a spiral manner and engaging a distal end of the adjuster. 2. The ligature of claim 1, further comprising a sound adjusting positioner having a plurality of recesses, wherein the sound adjusting positioner is spaced from the cord harness and the cord passes through at least one of the plurality of recesses. 3. The ligature of claim 2, wherein the plurality of recesses of the sound adjusting positioner are spaced apart recesses. 4. The ligature of claim 1, wherein the adjuster comprises a threaded shaft for engaging female threads on the cord harness and a through hole about the distal end for receiving the cord. 5. The ligature of claim 1, wherein the cord harness includes a fastener about each of its anterior and posterior ends for securing the cord to the cord harness. 6. The ligature of claim 1, wherein the cord harness includes a barrier member at a bottom end of the cord harness. 7. The ligature of claim 1, wherein the adjuster comprises:
an elongated body having a curved surface front end, and
a cord guard that includes a posterior end having a counterbore recess slidingly engaged with the front end of the elongated body. 8. A wind instrument mouthpiece assembly comprising:
a mouthpiece; a reed; and a ligature securing the reed to the mouthpiece, the ligature including: a cord harness having a plurality of apertures extending transverse to a longitudinal axis of the mouthpiece, an adjuster adjustably extendable relative to the cord harness, and a cord wound about the mouthpiece, passing through the plurality of apertures, and engaging the adjuster. 9. (canceled) 10. The wind instrument mouthpiece of claim 8, wherein the adjuster includes:
a threaded body for threadedly engaging the cord harness; and a cord guard about a distal end of the threaded body for engaging the cord. 11. The wind instrument mouthpiece of claim 10, wherein the cord guard includes a through hole for the passage of the cord therethrough. 12. The wind instrument mouthpiece of claim 8, further comprising a sound adjusting positioner having a plurality of recesses, wherein the sound adjusting positioner is spaced from the cord harness and the cord passes through at least one of the plurality of recesses. 13. The wind instrument mouthpiece of claim 12, wherein the sound adjusting positioner is movable relative to the cord. 14. The wind instrument mouthpiece of claim 8, wherein the cord harness includes a fastener about each of its proximal and distal ends for securing the cord to the cord harness. 15. The wind instrument mouthpiece of claim 8, wherein the cord harness includes a barrier member at a bottom end of the cord harness. 16. An adjuster for a ligature of a wind instrument comprising:
an elongated body that includes:
a front end having a curved surface, and
a rear end opposite the front end; and
a cord guard that includes:
a posterior end that includes a recess engaged with the front end of the elongated body,
a recessed path, and
a retaining member. 17. The adjuster of claim 16, wherein the recess includes a planar surface that directly engages a most distal end of the front end of the elongated body. 18. The adjuster of claim 16, wherein the recess is a counter bore. 19. The adjuster of claim 16, wherein the recess includes a concave surface or a convex surface. 20. The adjuster of claim 16, wherein the elongated body further includes threads along a longitudinal length of the elongated body. 21. The adjuster of claim 16, wherein the front end is configured as a nipple. 22. (canceled) 23. The adjuster of claim 16, wherein the elongated body is rotatable relative to the cord guard. 24. The adjuster of claim 16, wherein the recessed path extends continuously from a first lateral side of the cord guard to an opposing second lateral side of the cord guard. 25. The adjuster of claim 16, wherein the retaining member extends across a width of the recessed path forming a through hole. | A ligature for a wind instrument is provided. The ligature includes a cord harness having a plurality of apertures extending transverse to a longitudinal axis of the cord harness, and an adjuster. The adjuster is connected to and extends transverse to the longitudinal axis of the cord harness. The ligature further includes a cord passing through the plurality of apertures in a spiral manner and engages a distal end of the adjuster.1. A ligature for a wind instrument comprising:
a cord harness having a plurality of apertures extending transverse to a longitudinal axis of the cord harness; an adjuster connected to and adjustably extendable relative to the cord harness; and a cord passing through the plurality of apertures in a spiral manner and engaging a distal end of the adjuster. 2. The ligature of claim 1, further comprising a sound adjusting positioner having a plurality of recesses, wherein the sound adjusting positioner is spaced from the cord harness and the cord passes through at least one of the plurality of recesses. 3. The ligature of claim 2, wherein the plurality of recesses of the sound adjusting positioner are spaced apart recesses. 4. The ligature of claim 1, wherein the adjuster comprises a threaded shaft for engaging female threads on the cord harness and a through hole about the distal end for receiving the cord. 5. The ligature of claim 1, wherein the cord harness includes a fastener about each of its anterior and posterior ends for securing the cord to the cord harness. 6. The ligature of claim 1, wherein the cord harness includes a barrier member at a bottom end of the cord harness. 7. The ligature of claim 1, wherein the adjuster comprises:
an elongated body having a curved surface front end, and
a cord guard that includes a posterior end having a counterbore recess slidingly engaged with the front end of the elongated body. 8. A wind instrument mouthpiece assembly comprising:
a mouthpiece; a reed; and a ligature securing the reed to the mouthpiece, the ligature including: a cord harness having a plurality of apertures extending transverse to a longitudinal axis of the mouthpiece, an adjuster adjustably extendable relative to the cord harness, and a cord wound about the mouthpiece, passing through the plurality of apertures, and engaging the adjuster. 9. (canceled) 10. The wind instrument mouthpiece of claim 8, wherein the adjuster includes:
a threaded body for threadedly engaging the cord harness; and a cord guard about a distal end of the threaded body for engaging the cord. 11. The wind instrument mouthpiece of claim 10, wherein the cord guard includes a through hole for the passage of the cord therethrough. 12. The wind instrument mouthpiece of claim 8, further comprising a sound adjusting positioner having a plurality of recesses, wherein the sound adjusting positioner is spaced from the cord harness and the cord passes through at least one of the plurality of recesses. 13. The wind instrument mouthpiece of claim 12, wherein the sound adjusting positioner is movable relative to the cord. 14. The wind instrument mouthpiece of claim 8, wherein the cord harness includes a fastener about each of its proximal and distal ends for securing the cord to the cord harness. 15. The wind instrument mouthpiece of claim 8, wherein the cord harness includes a barrier member at a bottom end of the cord harness. 16. An adjuster for a ligature of a wind instrument comprising:
an elongated body that includes:
a front end having a curved surface, and
a rear end opposite the front end; and
a cord guard that includes:
a posterior end that includes a recess engaged with the front end of the elongated body,
a recessed path, and
a retaining member. 17. The adjuster of claim 16, wherein the recess includes a planar surface that directly engages a most distal end of the front end of the elongated body. 18. The adjuster of claim 16, wherein the recess is a counter bore. 19. The adjuster of claim 16, wherein the recess includes a concave surface or a convex surface. 20. The adjuster of claim 16, wherein the elongated body further includes threads along a longitudinal length of the elongated body. 21. The adjuster of claim 16, wherein the front end is configured as a nipple. 22. (canceled) 23. The adjuster of claim 16, wherein the elongated body is rotatable relative to the cord guard. 24. The adjuster of claim 16, wherein the recessed path extends continuously from a first lateral side of the cord guard to an opposing second lateral side of the cord guard. 25. The adjuster of claim 16, wherein the retaining member extends across a width of the recessed path forming a through hole. | 2,800 |
11,280 | 11,280 | 14,135,244 | 2,858 | A sensor system includes a sensor device and a cover device. The sensor device includes an external surface on which at least one electrical test contact is arranged. The cover device includes at least partially an electrically insulating material and is mechanically connected to the sensor device. The cover device is configured to cover the at least one electrical test contact of the sensor device so as to prevent contact from being made to the at least one electrical test contact from outside the sensor system. | 1. A sensor system, comprising:
a sensor device having an external surface on which is arranged at least one electrical test contact; and a cover device including at least partially an electrically insulating material, the cover device mechanically connected to the sensor device; wherein the cover device is configured to cover the at least one electrical test contact of the sensor device so as to prevent contact from being made to the at least one electrical test contact from outside the sensor system. 2. The sensor system according to claim 1, wherein:
the cover device has an internal surface configured to face the external surface including the at least one test contact, and at least one further metallization is arranged on the internal surface, the at least one further metallization mechanically connected to the at least one electrical test contact. 3. The sensor system according to claim 1, further comprising:
at least one electrical connecting contact arranged on the external surface including the at least one test contact, wherein the cover device is configured to enable electrical contact to be made to the at least one electrical connecting contact from outside the sensor system. 4. The sensor system according to claim 3, wherein the cover device includes at least one of at least one first opening and at least one via electrically connected to the at least one electrical connecting contact to enable electrical contact to be made from outside the sensor system. 5. The sensor system according to claim 1, wherein:
the sensor device includes a sensor substrate configured to form the external surface including the at least one test contact, the cover device includes a cover substrate having a first segment corresponding to the external surface, and the first segment of the cover device and the external surface including the at least one test contact are connected together at least partially. 6. The sensor system according to claim 5, wherein the cover device includes a second segment configured to bound the first segment and at least partially enclose the sensor device at right angles to the external surface. 7. The sensor system according to claim 1, wherein:
at least one of the sensor device and the cover device includes at least one of an energy storage unit and an energy converter unit, and the at least one of the energy storage unit and the energy converter unit is configured to be used to supply the sensor device with power. 8. The sensor system according to claim 7, wherein:
the energy converter unit includes at least one of a photovoltaic cell and a thermoelectric generator, and the cover device includes at least one corresponding second opening. 9. The sensor system according to claim 8, further comprising at least one of a transparent protective layer and a thermally conductive material introduced at least partially in the second opening. 10. The sensor system according to claim 1, wherein at least one of the sensor device and the cover device includes an integrated circuit. 11. The sensor system according to claim 1, wherein:
the sensor device includes at least one access aperture, and the cover device includes at least one third opening corresponding to the at least one access aperture. 12. The sensor system according to claim 1, wherein at least one of the cover device and the sensor device includes at least one fastening mechanism configured to enable the sensor system to be fitted to another object. 13. The sensor system according to claim 12, wherein the at least one fastening mechanism is formed as one of a suction pad, a pin, an adhesive surface, a hook-and-loop fastener, an electrostatic pad and a magnet. 14. A cover device for a sensor system, comprising:
a sensor device having an external surface on which is arranged at least one electrical test contact; an at least partially electrically insulating material; and at least one fastening mechanism configured to enable the sensor system to be fitted to another object, wherein the cover device is configured such that, when a mechanical connection is made between the cover device and the sensor device, the cover device covers the at least one electrical test contact of the sensor device to prevent contact from being made to the at least one electrical test contact from outside the sensor system. 15. The cover device according to claim 14, wherein the at least one fastening mechanism is formed as one of a suction pad, a pin, an adhesive surface, a hook-and-loop fastener, an electrostatic pad, and a magnet. 16. The sensor system according to claim 10, wherein the integrated circuit is a wireless communications unit for data transmission. | A sensor system includes a sensor device and a cover device. The sensor device includes an external surface on which at least one electrical test contact is arranged. The cover device includes at least partially an electrically insulating material and is mechanically connected to the sensor device. The cover device is configured to cover the at least one electrical test contact of the sensor device so as to prevent contact from being made to the at least one electrical test contact from outside the sensor system.1. A sensor system, comprising:
a sensor device having an external surface on which is arranged at least one electrical test contact; and a cover device including at least partially an electrically insulating material, the cover device mechanically connected to the sensor device; wherein the cover device is configured to cover the at least one electrical test contact of the sensor device so as to prevent contact from being made to the at least one electrical test contact from outside the sensor system. 2. The sensor system according to claim 1, wherein:
the cover device has an internal surface configured to face the external surface including the at least one test contact, and at least one further metallization is arranged on the internal surface, the at least one further metallization mechanically connected to the at least one electrical test contact. 3. The sensor system according to claim 1, further comprising:
at least one electrical connecting contact arranged on the external surface including the at least one test contact, wherein the cover device is configured to enable electrical contact to be made to the at least one electrical connecting contact from outside the sensor system. 4. The sensor system according to claim 3, wherein the cover device includes at least one of at least one first opening and at least one via electrically connected to the at least one electrical connecting contact to enable electrical contact to be made from outside the sensor system. 5. The sensor system according to claim 1, wherein:
the sensor device includes a sensor substrate configured to form the external surface including the at least one test contact, the cover device includes a cover substrate having a first segment corresponding to the external surface, and the first segment of the cover device and the external surface including the at least one test contact are connected together at least partially. 6. The sensor system according to claim 5, wherein the cover device includes a second segment configured to bound the first segment and at least partially enclose the sensor device at right angles to the external surface. 7. The sensor system according to claim 1, wherein:
at least one of the sensor device and the cover device includes at least one of an energy storage unit and an energy converter unit, and the at least one of the energy storage unit and the energy converter unit is configured to be used to supply the sensor device with power. 8. The sensor system according to claim 7, wherein:
the energy converter unit includes at least one of a photovoltaic cell and a thermoelectric generator, and the cover device includes at least one corresponding second opening. 9. The sensor system according to claim 8, further comprising at least one of a transparent protective layer and a thermally conductive material introduced at least partially in the second opening. 10. The sensor system according to claim 1, wherein at least one of the sensor device and the cover device includes an integrated circuit. 11. The sensor system according to claim 1, wherein:
the sensor device includes at least one access aperture, and the cover device includes at least one third opening corresponding to the at least one access aperture. 12. The sensor system according to claim 1, wherein at least one of the cover device and the sensor device includes at least one fastening mechanism configured to enable the sensor system to be fitted to another object. 13. The sensor system according to claim 12, wherein the at least one fastening mechanism is formed as one of a suction pad, a pin, an adhesive surface, a hook-and-loop fastener, an electrostatic pad and a magnet. 14. A cover device for a sensor system, comprising:
a sensor device having an external surface on which is arranged at least one electrical test contact; an at least partially electrically insulating material; and at least one fastening mechanism configured to enable the sensor system to be fitted to another object, wherein the cover device is configured such that, when a mechanical connection is made between the cover device and the sensor device, the cover device covers the at least one electrical test contact of the sensor device to prevent contact from being made to the at least one electrical test contact from outside the sensor system. 15. The cover device according to claim 14, wherein the at least one fastening mechanism is formed as one of a suction pad, a pin, an adhesive surface, a hook-and-loop fastener, an electrostatic pad, and a magnet. 16. The sensor system according to claim 10, wherein the integrated circuit is a wireless communications unit for data transmission. | 2,800 |
11,281 | 11,281 | 12,174,329 | 2,814 | A III-nitride device that includes a silicon body having formed therein an integrated circuit and a III-nitride device formed over a surface of the silicon body. | 1. A semiconductor device, comprising:
a support substrate that includes a silicon body having an integrated circuit formed therein; and a III-nitride body comprising a III-nitride semiconductor device formed over a surface of said silicon body. 2. The device of claim 1, wherein said III-nitride body includes a III-nitride heterojunction comprised of a first III-nitride layer of one band gap and a second III-nitride layer of another band gap formed over said first III-nitride layer. 3. The device of claim 2, wherein said III-nitride body includes a buffer layer interposed between said III-nitride heterojunction and said silicon body. 4. The device of claim 1, further comprising another silicon body and an insulation body interposed between said silicon body and said another silicon body. 5. The device of claim 4, wherein said silicon body is comprised of (111) silicon. 6. The device of claim 4, wherein said another silicon body is comprised of (111) silicon. 7. The device of claim 4, wherein said another silicon body is comprised of (100) silicon. 8. The device of claim 4, wherein said insulation body is comprised of silicon dioxide. 9. The device of claim 4, wherein said insulation body is between 0.1 to 2 microns thick. 10. The device of claim 4, wherein said insulation body is about 0.5 microns thick. 11. The device of claim 4, wherein said insulation body binds said first silicon body to said second silicon body. 12. The device of claim 4, wherein said silicon body is N++ doped. 13. The device of claim 4, wherein said silicon body is P++ doped. 14. The device of claim 1, wherein said silicon body includes an epitaxially formed portion. 15. The device of claim 1, wherein said III-nitride body includes a power semiconductor device and said integrated circuit formed in said silicon body comprises logic devices for operating said power semiconductor device. 16. The device of claim 15, further comprising a via through said III-nitride body reaching said silicon body, and a conductor disposed within said via connecting an electrode of said power semiconductor device to said another silicon body. 17. The device of claim 1, further comprising an insulation body formed over said silicon body and said III-nitride body, said insulation body including a via, said via including a conductive body connecting said IC to said III-nitride body. | A III-nitride device that includes a silicon body having formed therein an integrated circuit and a III-nitride device formed over a surface of the silicon body.1. A semiconductor device, comprising:
a support substrate that includes a silicon body having an integrated circuit formed therein; and a III-nitride body comprising a III-nitride semiconductor device formed over a surface of said silicon body. 2. The device of claim 1, wherein said III-nitride body includes a III-nitride heterojunction comprised of a first III-nitride layer of one band gap and a second III-nitride layer of another band gap formed over said first III-nitride layer. 3. The device of claim 2, wherein said III-nitride body includes a buffer layer interposed between said III-nitride heterojunction and said silicon body. 4. The device of claim 1, further comprising another silicon body and an insulation body interposed between said silicon body and said another silicon body. 5. The device of claim 4, wherein said silicon body is comprised of (111) silicon. 6. The device of claim 4, wherein said another silicon body is comprised of (111) silicon. 7. The device of claim 4, wherein said another silicon body is comprised of (100) silicon. 8. The device of claim 4, wherein said insulation body is comprised of silicon dioxide. 9. The device of claim 4, wherein said insulation body is between 0.1 to 2 microns thick. 10. The device of claim 4, wherein said insulation body is about 0.5 microns thick. 11. The device of claim 4, wherein said insulation body binds said first silicon body to said second silicon body. 12. The device of claim 4, wherein said silicon body is N++ doped. 13. The device of claim 4, wherein said silicon body is P++ doped. 14. The device of claim 1, wherein said silicon body includes an epitaxially formed portion. 15. The device of claim 1, wherein said III-nitride body includes a power semiconductor device and said integrated circuit formed in said silicon body comprises logic devices for operating said power semiconductor device. 16. The device of claim 15, further comprising a via through said III-nitride body reaching said silicon body, and a conductor disposed within said via connecting an electrode of said power semiconductor device to said another silicon body. 17. The device of claim 1, further comprising an insulation body formed over said silicon body and said III-nitride body, said insulation body including a via, said via including a conductive body connecting said IC to said III-nitride body. | 2,800 |
11,282 | 11,282 | 14,192,506 | 2,835 | A modular enclosure system and kit for containing and regulating the flow of air in and around data center and gateway facility equipment (e.g., server racks, equipment racks, cabinets, data storage libraries). The modular enclosure system can readily be adapted to differing types of equipment and to the differing cooling needs of different equipment. The system includes lightweight, thermally insulated, modular, interconnectable wall and ceiling panels adapted to enclose the equipment and an inflow of cool air, vent panels adapted to regulate the flow of air into and out of the enclosure, and cable ports that allow cables to pass into and out of the enclosure while minimizing bypass airflow. | 1. A modular enclosure system for containing and regulating airflow around electronic and computer related equipment, the system comprising:
a plurality of interconnectable panels, each interconnectable panel defining an outer edge with at least a portion of the outer edge defining a first interconnection pattern, the first interconnection pattern connectable to a second interconnection pattern of an adjacent interconnectable panel to form at least one of a parallel or orthogonal interconnection between the adjacent interconnectable panels, the plurality of interconnectable panels interconnecting to form a first enclosure around electronic equipment and at least a portion of an airflow from a cool air source, the first enclosure comprising:
a first opening for intaking the at least a portion of the airflow from a cool air source at a first inflow rate into the first enclosure, wherein the at least a portion of the airflow cools the equipment; and
a second opening for exhausting the at least a portion of the airflow out of the first enclosure at a first outflow rate, the second opening comprising a flow-through area that regulates the first outflow rate of the at least a portion of the airflow out of the first enclosure thereby regulating the first inflow rate of the at least a portion of the airflow into the first opening. 2. The modular enclosure system of claim 1, wherein the second opening includes an adjustable opening structure in at least one of the plurality of interconnectable panels such that the flow-through area changes with each variable size. 3. The modular enclosure system of claim 2, wherein the adjustable opening structure comprises a butterfly vent for adjusting the flow-through area. 4. The modular enclosure system of claim 1, wherein the outer edge of each of the plurality of interconnectable panels defines one of a square or a rectangle. 5. The modular enclosure system of claim 4, wherein the first interconnection pattern comprises a first plurality of teeth, and the second interconnection pattern comprises a second plurality of teeth offset from the first plurality of teeth such that the first and the second plurality of teeth interlock. 6. The modular enclosure system of claim 5, wherein the first and the second plurality of teeth define a square-wave pattern. 7. The modular enclosure system of claim 5, wherein the first and the second plurality of teeth further comprise a low friction coating that eases interlocking of the first and the second plurality of teeth. 8. The modular enclosure system of claim 1, wherein the plurality of interconnectable panels are made from a thermally insulating material comprising at least one of plastic, mineral fiber, or foam. 9. The modular enclosure system of claim 1, wherein the first enclosure further comprises a third opening comprising an access door to access the electronic equipment within the first enclosure. 10. The modular enclosure system of claim 1, wherein the first enclosure further comprises a fourth opening for allowing cables to pass into and out of the first enclosure, the fourth opening comprising a sealing membrane that blocks bypass airflow thereby optimizing the first inflow rate and the first outflow rate. 11. The modular enclosure system of claim 10, wherein the sealing membrane is a grommet insert with brushes. 12. The modular enclosure system of claim 1, wherein the cool air source is a computer room air conditioner. 13. The modular enclosure system of claim 1, wherein each of the plurality of interconnectable panels further comprise at least one handle mechanism that eases connection between the first and the second interconnection pattern. 14. The modular enclosure system of claim 1, further comprising a support member that spans a top portion of the first enclosure and supports a positioning of the plurality of interconnectable panels on the top portion of the first enclosure by transferring at least a portion of a weight of the top portion to other portions of the first enclosure. 15. The modular enclosure system of claim 1, wherein the electronic equipment comprises a first rack of electronic equipment and a second rack of electronic equipment, the first enclosure containing the first rack of equipment and the at least a portion of an airflow, the plurality of interconnectable panels interconnecting to form a second enclosure around the second rack of electronic equipment, the second enclosure containing the second rack of equipment and the at least a portion of the airflow, the second enclosure comprising:
a fifth opening for intaking the at least a portion of an airflow from the cool air source at a second inflow rate into the second enclosure; and a sixth opening for exhausting the at least a portion of the airflow out of the first enclosure at a second outflow rate, the sixth opening comprising a sixth flow-through area that regulates the second outflow rate of the at least a portion of an airflow out of the second enclosure thereby regulating the second inflow rate of the at least a portion of the airflow into the fifth opening. 16. The modular enclosure system of claim 15, wherein regulating the second outflow rate of the at least a portion of the airflow out of the second enclosure regulates the first inflow rate of the at least a portion of the airflow into the first opening of the first enclosure. 17. A modular enclosure kit for containing and regulating airflow around data center or gateway facility equipment, the kit comprising:
a plurality of interconnectable panels, each interconnectable panel defining an outer edge with at least a portion of the outer edge defining a first interconnection pattern, the first interconnection pattern connectable to a second interconnection pattern of an adjacent interconnectable panel to form at least one of a parallel or orthogonal interconnection between the adjacent interconnectable panels, wherein the plurality of interconnectable panels are adapted to assemble a first enclosure by interconnecting the plurality of interconnectable panels to form an enclosure around electronic equipment to be cooled and at least a portion of an airflow from a cool air source, the enclosure comprising:
a first opening for intaking a portion of a cool airflow to cool the electronic equipment; and
a second opening for exhausting the portion of the cool airflow out of the first enclosure, wherein a size of the second opening is adjustable such that regulating the portion of the cool airflow out of the first enclosure thereby regulates the portion of the cool airflow into the first opening of the enclosure. 18. The modular enclosure kit of claim 17, wherein the outer edge of each of the plurality of interconnectable panels defines one of a square or a rectangle. 19. The modular enclosure system of claim 18, wherein the first interconnection pattern comprises a first plurality of teeth, and the second interconnection pattern comprises a second plurality of teeth offset such that the first and the second plurality of teeth interconnect. 20. The modular enclosure kit of claim 14, further comprising an access door that provides access to an interior of the first enclosure. | A modular enclosure system and kit for containing and regulating the flow of air in and around data center and gateway facility equipment (e.g., server racks, equipment racks, cabinets, data storage libraries). The modular enclosure system can readily be adapted to differing types of equipment and to the differing cooling needs of different equipment. The system includes lightweight, thermally insulated, modular, interconnectable wall and ceiling panels adapted to enclose the equipment and an inflow of cool air, vent panels adapted to regulate the flow of air into and out of the enclosure, and cable ports that allow cables to pass into and out of the enclosure while minimizing bypass airflow.1. A modular enclosure system for containing and regulating airflow around electronic and computer related equipment, the system comprising:
a plurality of interconnectable panels, each interconnectable panel defining an outer edge with at least a portion of the outer edge defining a first interconnection pattern, the first interconnection pattern connectable to a second interconnection pattern of an adjacent interconnectable panel to form at least one of a parallel or orthogonal interconnection between the adjacent interconnectable panels, the plurality of interconnectable panels interconnecting to form a first enclosure around electronic equipment and at least a portion of an airflow from a cool air source, the first enclosure comprising:
a first opening for intaking the at least a portion of the airflow from a cool air source at a first inflow rate into the first enclosure, wherein the at least a portion of the airflow cools the equipment; and
a second opening for exhausting the at least a portion of the airflow out of the first enclosure at a first outflow rate, the second opening comprising a flow-through area that regulates the first outflow rate of the at least a portion of the airflow out of the first enclosure thereby regulating the first inflow rate of the at least a portion of the airflow into the first opening. 2. The modular enclosure system of claim 1, wherein the second opening includes an adjustable opening structure in at least one of the plurality of interconnectable panels such that the flow-through area changes with each variable size. 3. The modular enclosure system of claim 2, wherein the adjustable opening structure comprises a butterfly vent for adjusting the flow-through area. 4. The modular enclosure system of claim 1, wherein the outer edge of each of the plurality of interconnectable panels defines one of a square or a rectangle. 5. The modular enclosure system of claim 4, wherein the first interconnection pattern comprises a first plurality of teeth, and the second interconnection pattern comprises a second plurality of teeth offset from the first plurality of teeth such that the first and the second plurality of teeth interlock. 6. The modular enclosure system of claim 5, wherein the first and the second plurality of teeth define a square-wave pattern. 7. The modular enclosure system of claim 5, wherein the first and the second plurality of teeth further comprise a low friction coating that eases interlocking of the first and the second plurality of teeth. 8. The modular enclosure system of claim 1, wherein the plurality of interconnectable panels are made from a thermally insulating material comprising at least one of plastic, mineral fiber, or foam. 9. The modular enclosure system of claim 1, wherein the first enclosure further comprises a third opening comprising an access door to access the electronic equipment within the first enclosure. 10. The modular enclosure system of claim 1, wherein the first enclosure further comprises a fourth opening for allowing cables to pass into and out of the first enclosure, the fourth opening comprising a sealing membrane that blocks bypass airflow thereby optimizing the first inflow rate and the first outflow rate. 11. The modular enclosure system of claim 10, wherein the sealing membrane is a grommet insert with brushes. 12. The modular enclosure system of claim 1, wherein the cool air source is a computer room air conditioner. 13. The modular enclosure system of claim 1, wherein each of the plurality of interconnectable panels further comprise at least one handle mechanism that eases connection between the first and the second interconnection pattern. 14. The modular enclosure system of claim 1, further comprising a support member that spans a top portion of the first enclosure and supports a positioning of the plurality of interconnectable panels on the top portion of the first enclosure by transferring at least a portion of a weight of the top portion to other portions of the first enclosure. 15. The modular enclosure system of claim 1, wherein the electronic equipment comprises a first rack of electronic equipment and a second rack of electronic equipment, the first enclosure containing the first rack of equipment and the at least a portion of an airflow, the plurality of interconnectable panels interconnecting to form a second enclosure around the second rack of electronic equipment, the second enclosure containing the second rack of equipment and the at least a portion of the airflow, the second enclosure comprising:
a fifth opening for intaking the at least a portion of an airflow from the cool air source at a second inflow rate into the second enclosure; and a sixth opening for exhausting the at least a portion of the airflow out of the first enclosure at a second outflow rate, the sixth opening comprising a sixth flow-through area that regulates the second outflow rate of the at least a portion of an airflow out of the second enclosure thereby regulating the second inflow rate of the at least a portion of the airflow into the fifth opening. 16. The modular enclosure system of claim 15, wherein regulating the second outflow rate of the at least a portion of the airflow out of the second enclosure regulates the first inflow rate of the at least a portion of the airflow into the first opening of the first enclosure. 17. A modular enclosure kit for containing and regulating airflow around data center or gateway facility equipment, the kit comprising:
a plurality of interconnectable panels, each interconnectable panel defining an outer edge with at least a portion of the outer edge defining a first interconnection pattern, the first interconnection pattern connectable to a second interconnection pattern of an adjacent interconnectable panel to form at least one of a parallel or orthogonal interconnection between the adjacent interconnectable panels, wherein the plurality of interconnectable panels are adapted to assemble a first enclosure by interconnecting the plurality of interconnectable panels to form an enclosure around electronic equipment to be cooled and at least a portion of an airflow from a cool air source, the enclosure comprising:
a first opening for intaking a portion of a cool airflow to cool the electronic equipment; and
a second opening for exhausting the portion of the cool airflow out of the first enclosure, wherein a size of the second opening is adjustable such that regulating the portion of the cool airflow out of the first enclosure thereby regulates the portion of the cool airflow into the first opening of the enclosure. 18. The modular enclosure kit of claim 17, wherein the outer edge of each of the plurality of interconnectable panels defines one of a square or a rectangle. 19. The modular enclosure system of claim 18, wherein the first interconnection pattern comprises a first plurality of teeth, and the second interconnection pattern comprises a second plurality of teeth offset such that the first and the second plurality of teeth interconnect. 20. The modular enclosure kit of claim 14, further comprising an access door that provides access to an interior of the first enclosure. | 2,800 |
11,283 | 11,283 | 14,970,538 | 2,872 | An autofocus system is disclosed. The autofocus system includes a lens assembly, an upper actuator, and a lower actuator. The upper and the lower actuators have stationary elements and movable elements. The lens assembly is attached to the movable elements of the upper and the lower actuators. The autofocus system allows three degrees of freedoms of translational adjustments and two degrees of freedoms of rotational adjustments. | 1. An autofocus system, comprising:
a lens assembly; an upper actuator comprising:
one or more upper stationary elements;
a first upper translation element to translate along a first direction;
a second upper translation element to translate along a second direction perpendicular to the first direction; and
a third upper translation element to translate along a third direction perpendicular to the first and the second directions;
and a lower actuator comprising:
one or more lower stationary elements;
a first lower translation element to translate along the first direction;
a second lower translation element to translate along the second direction; and
a third lower translation element to translate along the third direction;
wherein the lens assembly is attached to the first upper translation element of the upper actuator and the first lower translation element of the lower actuator. 2. The autofocus system of claim 1, wherein the translations of translation elements are driven by electrostatic comb drives. 3. The autofocus system of claim 1, wherein the lens assembly rotates about an axis parallel to the second direction when the first upper translation element translates a positive displacement along the first direction and the first lower translation element translates a negative displacement along the first direction. 4. The autofocus system of claim 1, further comprising a substrate located between the upper actuator and the lower actuator, the substrate having an annular opening to receive the lens assembly. 5. The autofocus system of claim 4, further comprising a first set of solder balls and a second set of solder balls, wherein the first set of solder balls connect the substrate and the upper actuator and the second set of solder balls connect the substrate and the lower actuator. 6. The autofocus system of claim 1, wherein the lens assembly comprises a single lens. 7. The autofocus system of claim 1, wherein the lens assembly comprises a barrel and one or more lenses. 8. An autofocus actuator, comprising:
one or more stationary elements; a first translation element to translate along a first direction; a second translation element to translate along a second direction perpendicular to the first direction; and a third translation element to translate along a third direction perpendicular to the first and the second directions; wherein the translations of translation elements are driven by electrostatic comb drives. 9. The autofocus actuator of claim 8, further comprising:
first relatively stationary electrodes extending from the second translation element; second relatively stationary electrodes extending from the third translation element; stationary electrodes extending from the one or more stationary elements; first movable electrodes extending from the first translation element and being interdigitated with the first relatively stationary electrodes to form one or more first comb drives; second movable electrodes extending from the second translation element and being interdigitated with the second relatively stationary electrodes to form one or more second comb drives; and third movable electrodes extending from the third translation element and being engaged with the stationary electrodes to form one or more third comb drives. 10. The autofocus actuator of claim 9, wherein the one or more first comb drives and the one or more second comb drives are in-plane comb drives and the one or more third comb drives are out-of-plane comb drives. 11. The autofocus actuator of claim 8, further comprising one or more first springs, one or more second springs, and one or more third springs, wherein
the first translation element is coupled by the one or more first springs to the second translation element; the second translation element is coupled by the one or more second springs to the third translation element; and the third translation element is coupled by the one or more third springs to the one or more stationary elements. 12. The autofocus actuator of claim 8, wherein the first translation element is electrically connected to ground. 13. The autofocus actuator of claim 8, wherein the second translation element comprises
a top layer comprising
one or more first components electrically connected to ground;
one or more second components electrically connected to one or more driving voltage potentials;
wherein the one or more first component and the one or more second component are separated by one or more gaps;
a middle insulation layer; and a bottom supporting layer. 14. The autofocus actuator of claim 8, wherein the third translation element comprises
a top layer comprising
one or more first components electrically connected to ground;
one or more second components electrically connected to one or more driving voltage potentials;
wherein the one or more first component and the one or more second component are separated by one or more gaps;
a middle insulation layer; and a bottom supporting layer. 15. The autofocus actuator of claim 8, wherein the second translation element has an annular opening to receive the first translation element. 16. The autofocus actuator of claim 8, wherein the third translation element has an annular opening to receive the second translation element. | An autofocus system is disclosed. The autofocus system includes a lens assembly, an upper actuator, and a lower actuator. The upper and the lower actuators have stationary elements and movable elements. The lens assembly is attached to the movable elements of the upper and the lower actuators. The autofocus system allows three degrees of freedoms of translational adjustments and two degrees of freedoms of rotational adjustments.1. An autofocus system, comprising:
a lens assembly; an upper actuator comprising:
one or more upper stationary elements;
a first upper translation element to translate along a first direction;
a second upper translation element to translate along a second direction perpendicular to the first direction; and
a third upper translation element to translate along a third direction perpendicular to the first and the second directions;
and a lower actuator comprising:
one or more lower stationary elements;
a first lower translation element to translate along the first direction;
a second lower translation element to translate along the second direction; and
a third lower translation element to translate along the third direction;
wherein the lens assembly is attached to the first upper translation element of the upper actuator and the first lower translation element of the lower actuator. 2. The autofocus system of claim 1, wherein the translations of translation elements are driven by electrostatic comb drives. 3. The autofocus system of claim 1, wherein the lens assembly rotates about an axis parallel to the second direction when the first upper translation element translates a positive displacement along the first direction and the first lower translation element translates a negative displacement along the first direction. 4. The autofocus system of claim 1, further comprising a substrate located between the upper actuator and the lower actuator, the substrate having an annular opening to receive the lens assembly. 5. The autofocus system of claim 4, further comprising a first set of solder balls and a second set of solder balls, wherein the first set of solder balls connect the substrate and the upper actuator and the second set of solder balls connect the substrate and the lower actuator. 6. The autofocus system of claim 1, wherein the lens assembly comprises a single lens. 7. The autofocus system of claim 1, wherein the lens assembly comprises a barrel and one or more lenses. 8. An autofocus actuator, comprising:
one or more stationary elements; a first translation element to translate along a first direction; a second translation element to translate along a second direction perpendicular to the first direction; and a third translation element to translate along a third direction perpendicular to the first and the second directions; wherein the translations of translation elements are driven by electrostatic comb drives. 9. The autofocus actuator of claim 8, further comprising:
first relatively stationary electrodes extending from the second translation element; second relatively stationary electrodes extending from the third translation element; stationary electrodes extending from the one or more stationary elements; first movable electrodes extending from the first translation element and being interdigitated with the first relatively stationary electrodes to form one or more first comb drives; second movable electrodes extending from the second translation element and being interdigitated with the second relatively stationary electrodes to form one or more second comb drives; and third movable electrodes extending from the third translation element and being engaged with the stationary electrodes to form one or more third comb drives. 10. The autofocus actuator of claim 9, wherein the one or more first comb drives and the one or more second comb drives are in-plane comb drives and the one or more third comb drives are out-of-plane comb drives. 11. The autofocus actuator of claim 8, further comprising one or more first springs, one or more second springs, and one or more third springs, wherein
the first translation element is coupled by the one or more first springs to the second translation element; the second translation element is coupled by the one or more second springs to the third translation element; and the third translation element is coupled by the one or more third springs to the one or more stationary elements. 12. The autofocus actuator of claim 8, wherein the first translation element is electrically connected to ground. 13. The autofocus actuator of claim 8, wherein the second translation element comprises
a top layer comprising
one or more first components electrically connected to ground;
one or more second components electrically connected to one or more driving voltage potentials;
wherein the one or more first component and the one or more second component are separated by one or more gaps;
a middle insulation layer; and a bottom supporting layer. 14. The autofocus actuator of claim 8, wherein the third translation element comprises
a top layer comprising
one or more first components electrically connected to ground;
one or more second components electrically connected to one or more driving voltage potentials;
wherein the one or more first component and the one or more second component are separated by one or more gaps;
a middle insulation layer; and a bottom supporting layer. 15. The autofocus actuator of claim 8, wherein the second translation element has an annular opening to receive the first translation element. 16. The autofocus actuator of claim 8, wherein the third translation element has an annular opening to receive the second translation element. | 2,800 |
11,284 | 11,284 | 14,987,762 | 2,872 | A zoom function system is disclosed. The zoom function system includes an upper lens assembly, a lower lens assembly, an upper actuator, and a lower actuator. The upper and the lower actuators have stationary elements and movable elements. The upper lens assembly is attached to one of the movable elements of the upper actuator. The lower lens assembly is attached to one of the movable elements of the lower actuator. The zoom function system allows three degrees of freedoms of translational adjustments of lens assemblies and is capable of realigning the lens assemblies to improve the qualities of images. | 1. A zoom function system, comprising:
an upper lens assembly; a lower lens assembly; an upper actuator comprising:
one or more upper stationary elements;
a first upper translation element to translate along a first direction;
a second upper translation element to translate along a second direction perpendicular to the first direction; and
a third upper translation element to translate along a third direction perpendicular to the first and the second directions; and
a lower actuator comprising:
one or more lower stationary elements;
a first lower translation element to translate along the first direction;
a second lower translation element to translate along the second direction; and
a third lower translation element to translate along the third direction;
wherein the upper lens assembly is attached to the first upper translation element of the upper actuator and the lower lens assembly is attached to the first lower translation element of the lower actuator. 2. The zoom function system of claim 1, wherein the translations of translation elements are driven by electrostatic comb drives. 3. The zoom function system of claim 1, wherein the upper lens assembly comprises a single upper lens and the lower lens assembly comprises a single lower lens. 4. The zoom function system of claim 1, wherein the upper lens assembly comprises an upper barrel and the lower lens assembly comprises a lower barrel. 5. The zoom function system of claim 1, further comprising
a mid-range lens assembly; a mid-range actuator comprising:
one or more mid-range stationary elements;
a first mid-range translation element to translate along the first direction;
a second mid-range translation element to translate along the second direction; and
a third mid-range translation element to translate along the third direction;
wherein the mid-range lens assembly is attached to the first mid-range translation element of the mid-range actuator. 6. The zoom function system of claim 5, further comprising a first set of solder balls and a second set of solder balls, wherein the first set of solder balls connect the mid-range actuator and the upper actuator and the second set of solder balls connect the mid-range actuator and the lower actuator. 7. The zoom function system of claim 1, further comprising one or more lens assemblies. 8. The zoom function system of claim 7, further comprising one or more actuators, wherein each of the one and more lens assemblies is attached to one of the one or more actuators. 9. The zoom function system of claim 1, further comprising:
first upper relatively stationary electrodes extending from the second upper translation element; second upper relatively stationary electrodes extending from the third upper translation element; upper stationary electrodes extending from the one or more upper stationary elements; first upper movable electrodes extending from the first upper translation element and being interdigitated with the first upper relatively stationary electrodes to form one or more first upper comb drives; second upper movable electrodes extending from the second upper translation element and being interdigitated with the second upper relatively stationary electrodes to form one or more second upper comb drives; and third upper movable electrodes extending from the third upper translation element and being engaged with the upper stationary electrodes to form one or more third upper comb drives. 10. The zoom function system of claim 9, wherein the one or more first upper comb drives and the one or more second upper comb drives are in-plane comb drives and the one or more third upper comb drives are out-of-plane comb drives. 11. The zoom function system of claim 1, further comprising one or more first upper springs, one or more second upper springs, and one or more third upper springs, wherein
the first upper translation element is coupled by the one or more first upper springs to the second upper translation element; the second upper translation element is coupled by the one or more second upper springs to the third upper translation element; and the third upper translation element is coupled by the one or more third upper springs to the one or more upper stationary elements. 12. The zoom function system of claim 1, wherein the first upper translation element is electrically connected to ground. 13. The zoom function system of claim 1, wherein the second upper translation element comprises
a top layer comprising
one or more first components electrically connected to ground;
one or more second components electrically connected to one or more driving voltage potentials;
wherein the one or more first component and the one or more second component are separated by one or more gaps;
a middle insulation layer; and a bottom supporting layer. 14. The zoom function system of claim 1, wherein the third upper translation element comprises
a top layer comprising
one or more first components electrically connected to ground;
one or more second components electrically connected to one or more driving voltage potentials;
wherein the one or more first component and the one or more second component are separated by one or more gaps;
a middle insulation layer; and a bottom supporting layer. 15. The zoom function system of claim 1, wherein the second upper translation element has an annular opening to receive the first upper translation element. 16. The zoom function system of claim 1, wherein the third upper translation element has an annular opening to receive the second upper translation element. 17. The zoom function system of claim 1, further integrating with an autofocus system comprising:
an autofocus lens assembly; an upper autofocus actuator; and a lower autofocus actuator; wherein the autofocus lens assembly is attached to the upper autofocus actuator and the lower autofocus actuator. | A zoom function system is disclosed. The zoom function system includes an upper lens assembly, a lower lens assembly, an upper actuator, and a lower actuator. The upper and the lower actuators have stationary elements and movable elements. The upper lens assembly is attached to one of the movable elements of the upper actuator. The lower lens assembly is attached to one of the movable elements of the lower actuator. The zoom function system allows three degrees of freedoms of translational adjustments of lens assemblies and is capable of realigning the lens assemblies to improve the qualities of images.1. A zoom function system, comprising:
an upper lens assembly; a lower lens assembly; an upper actuator comprising:
one or more upper stationary elements;
a first upper translation element to translate along a first direction;
a second upper translation element to translate along a second direction perpendicular to the first direction; and
a third upper translation element to translate along a third direction perpendicular to the first and the second directions; and
a lower actuator comprising:
one or more lower stationary elements;
a first lower translation element to translate along the first direction;
a second lower translation element to translate along the second direction; and
a third lower translation element to translate along the third direction;
wherein the upper lens assembly is attached to the first upper translation element of the upper actuator and the lower lens assembly is attached to the first lower translation element of the lower actuator. 2. The zoom function system of claim 1, wherein the translations of translation elements are driven by electrostatic comb drives. 3. The zoom function system of claim 1, wherein the upper lens assembly comprises a single upper lens and the lower lens assembly comprises a single lower lens. 4. The zoom function system of claim 1, wherein the upper lens assembly comprises an upper barrel and the lower lens assembly comprises a lower barrel. 5. The zoom function system of claim 1, further comprising
a mid-range lens assembly; a mid-range actuator comprising:
one or more mid-range stationary elements;
a first mid-range translation element to translate along the first direction;
a second mid-range translation element to translate along the second direction; and
a third mid-range translation element to translate along the third direction;
wherein the mid-range lens assembly is attached to the first mid-range translation element of the mid-range actuator. 6. The zoom function system of claim 5, further comprising a first set of solder balls and a second set of solder balls, wherein the first set of solder balls connect the mid-range actuator and the upper actuator and the second set of solder balls connect the mid-range actuator and the lower actuator. 7. The zoom function system of claim 1, further comprising one or more lens assemblies. 8. The zoom function system of claim 7, further comprising one or more actuators, wherein each of the one and more lens assemblies is attached to one of the one or more actuators. 9. The zoom function system of claim 1, further comprising:
first upper relatively stationary electrodes extending from the second upper translation element; second upper relatively stationary electrodes extending from the third upper translation element; upper stationary electrodes extending from the one or more upper stationary elements; first upper movable electrodes extending from the first upper translation element and being interdigitated with the first upper relatively stationary electrodes to form one or more first upper comb drives; second upper movable electrodes extending from the second upper translation element and being interdigitated with the second upper relatively stationary electrodes to form one or more second upper comb drives; and third upper movable electrodes extending from the third upper translation element and being engaged with the upper stationary electrodes to form one or more third upper comb drives. 10. The zoom function system of claim 9, wherein the one or more first upper comb drives and the one or more second upper comb drives are in-plane comb drives and the one or more third upper comb drives are out-of-plane comb drives. 11. The zoom function system of claim 1, further comprising one or more first upper springs, one or more second upper springs, and one or more third upper springs, wherein
the first upper translation element is coupled by the one or more first upper springs to the second upper translation element; the second upper translation element is coupled by the one or more second upper springs to the third upper translation element; and the third upper translation element is coupled by the one or more third upper springs to the one or more upper stationary elements. 12. The zoom function system of claim 1, wherein the first upper translation element is electrically connected to ground. 13. The zoom function system of claim 1, wherein the second upper translation element comprises
a top layer comprising
one or more first components electrically connected to ground;
one or more second components electrically connected to one or more driving voltage potentials;
wherein the one or more first component and the one or more second component are separated by one or more gaps;
a middle insulation layer; and a bottom supporting layer. 14. The zoom function system of claim 1, wherein the third upper translation element comprises
a top layer comprising
one or more first components electrically connected to ground;
one or more second components electrically connected to one or more driving voltage potentials;
wherein the one or more first component and the one or more second component are separated by one or more gaps;
a middle insulation layer; and a bottom supporting layer. 15. The zoom function system of claim 1, wherein the second upper translation element has an annular opening to receive the first upper translation element. 16. The zoom function system of claim 1, wherein the third upper translation element has an annular opening to receive the second upper translation element. 17. The zoom function system of claim 1, further integrating with an autofocus system comprising:
an autofocus lens assembly; an upper autofocus actuator; and a lower autofocus actuator; wherein the autofocus lens assembly is attached to the upper autofocus actuator and the lower autofocus actuator. | 2,800 |
11,285 | 11,285 | 15,001,618 | 2,859 | A vehicle includes a traction battery and a controller in communication with the battery and programmed to control battery charging in response to a user-selected one of a plurality of charging strategies having different charging rates based on detection of lithium plating in the battery. The charging strategies may include options for faster charging with an urgent or emergency charging strategy selectable a limited number of times to mitigate battery performance degradation associated with lithium plating. A method implemented by a vehicle controller in a vehicle having a traction battery, may include controlling, by the controller, battery charging in response to a user-selected charging strategy selected from one of a plurality of available charging strategies each having a different charging rate and displayed on a user interface in response to detection of lithium plating in the traction battery, at least one charging strategy associated with additional lithium plating if selected. | 1. A vehicle comprising:
a traction battery having a plurality of cells; and a controller in communication with the traction battery and programmed to control traction battery charging in response to a user-selected one of a plurality of charging strategies having different charging rates based on detection of lithium plating in the traction battery. 2. The vehicle of claim 1, the controller programmed to store an accumulated number of selections for at least one of the charging strategies, and to limit the number of selections for the at least one charging strategies. 3. The vehicle of claim 1, the controller programmed to prompt a user for a charging strategy selection in response to detection of lithium plating. 4. The vehicle of claim 1, the controller programmed to communicate with a linked mobile device to receive input associated with the user-selected charging strategy. 5. The vehicle of claim 1, the controller programmed to implement a default charging strategy to mitigate lithium plating in response to detection of lithium plating until a user-selected charging strategy is selected. 6. The vehicle of claim 5 wherein the default charging strategy reduces traction battery charging rate relative to a charging strategy where no lithium plating is detected. 7. The vehicle of claim 1, at least one of the plurality of charging strategies increasing battery charging current to a charging rate that results in lithium plating to reduce charging time. 8. The vehicle of claim 7, wherein the lithium plating is irreversible lithium plating. 9. The vehicle of claim 1, the controller programmed to detect lithium plating in response to a lithium plating indicator based on a difference between a measured open circuit voltage of the at least one cell and a previously stored open circuit voltage value. 10. The vehicle of claim 1, the controller programmed to detect lithium plating in response to a lithium plating indicator based on a ratio of the differential cell voltage and cell current during charging of the traction battery. 11. A vehicle having a traction battery with at least one cell, comprising:
a controller coupled to the traction battery and programmed to control traction battery charging in response to a user-selected charging strategy based on a prompt to select a charging strategy initiated in response to traction battery lithium plating being detected by the controller. 12. The vehicle of claim 11, the controller programmed to prompt a user for selection of one of a plurality of charging strategies, at least one of the plurality of charging strategies resulting in a charging current associated with additional lithium plating to reduce charging time. 13. The vehicle of claim 12, the controller programmed to limit a number of times the at least one of the plurality of charging strategies may be selected. 14. The vehicle of claim 12, the controller programmed to present the at least one of the plurality of charging strategies only if an accumulated number of selections of the at least one of the plurality of charging strategies is less than a predetermined number stored in a memory in communication with the controller. 15. The vehicle of claim 11 further comprising a display having a user interface configured to prompt a user for selection of one of a plurality of charging strategies each associated with a different charging rate and lithium plating level. 16. The vehicle of claim 11, the controller programmed to receive user input from a linked wireless device having a user interface configured to prompt a user to select one of a plurality of charging strategies. 17. The vehicle of claim 11, the controller programmed to operate at least one electrical accessory to warm the battery based on the user-selected charging strategy. 18. A method implemented by a vehicle controller in a vehicle having a traction battery, comprising:
controlling, by the controller, traction battery charging in response to a user-selected charging strategy selected from one of a plurality of available charging strategies each having a different charging rate and displayed on a user interface in response to detection of lithium plating in the traction battery, at least one charging strategy associated with additional lithium plating if selected. 19. The method of claim 18 further comprising displaying an estimated charging time for each of the plurality of available charging strategies on the user interface. 20. The method of claim 18 further comprising limiting user selection of the at least one charging strategy to a predetermined number of selections. | A vehicle includes a traction battery and a controller in communication with the battery and programmed to control battery charging in response to a user-selected one of a plurality of charging strategies having different charging rates based on detection of lithium plating in the battery. The charging strategies may include options for faster charging with an urgent or emergency charging strategy selectable a limited number of times to mitigate battery performance degradation associated with lithium plating. A method implemented by a vehicle controller in a vehicle having a traction battery, may include controlling, by the controller, battery charging in response to a user-selected charging strategy selected from one of a plurality of available charging strategies each having a different charging rate and displayed on a user interface in response to detection of lithium plating in the traction battery, at least one charging strategy associated with additional lithium plating if selected.1. A vehicle comprising:
a traction battery having a plurality of cells; and a controller in communication with the traction battery and programmed to control traction battery charging in response to a user-selected one of a plurality of charging strategies having different charging rates based on detection of lithium plating in the traction battery. 2. The vehicle of claim 1, the controller programmed to store an accumulated number of selections for at least one of the charging strategies, and to limit the number of selections for the at least one charging strategies. 3. The vehicle of claim 1, the controller programmed to prompt a user for a charging strategy selection in response to detection of lithium plating. 4. The vehicle of claim 1, the controller programmed to communicate with a linked mobile device to receive input associated with the user-selected charging strategy. 5. The vehicle of claim 1, the controller programmed to implement a default charging strategy to mitigate lithium plating in response to detection of lithium plating until a user-selected charging strategy is selected. 6. The vehicle of claim 5 wherein the default charging strategy reduces traction battery charging rate relative to a charging strategy where no lithium plating is detected. 7. The vehicle of claim 1, at least one of the plurality of charging strategies increasing battery charging current to a charging rate that results in lithium plating to reduce charging time. 8. The vehicle of claim 7, wherein the lithium plating is irreversible lithium plating. 9. The vehicle of claim 1, the controller programmed to detect lithium plating in response to a lithium plating indicator based on a difference between a measured open circuit voltage of the at least one cell and a previously stored open circuit voltage value. 10. The vehicle of claim 1, the controller programmed to detect lithium plating in response to a lithium plating indicator based on a ratio of the differential cell voltage and cell current during charging of the traction battery. 11. A vehicle having a traction battery with at least one cell, comprising:
a controller coupled to the traction battery and programmed to control traction battery charging in response to a user-selected charging strategy based on a prompt to select a charging strategy initiated in response to traction battery lithium plating being detected by the controller. 12. The vehicle of claim 11, the controller programmed to prompt a user for selection of one of a plurality of charging strategies, at least one of the plurality of charging strategies resulting in a charging current associated with additional lithium plating to reduce charging time. 13. The vehicle of claim 12, the controller programmed to limit a number of times the at least one of the plurality of charging strategies may be selected. 14. The vehicle of claim 12, the controller programmed to present the at least one of the plurality of charging strategies only if an accumulated number of selections of the at least one of the plurality of charging strategies is less than a predetermined number stored in a memory in communication with the controller. 15. The vehicle of claim 11 further comprising a display having a user interface configured to prompt a user for selection of one of a plurality of charging strategies each associated with a different charging rate and lithium plating level. 16. The vehicle of claim 11, the controller programmed to receive user input from a linked wireless device having a user interface configured to prompt a user to select one of a plurality of charging strategies. 17. The vehicle of claim 11, the controller programmed to operate at least one electrical accessory to warm the battery based on the user-selected charging strategy. 18. A method implemented by a vehicle controller in a vehicle having a traction battery, comprising:
controlling, by the controller, traction battery charging in response to a user-selected charging strategy selected from one of a plurality of available charging strategies each having a different charging rate and displayed on a user interface in response to detection of lithium plating in the traction battery, at least one charging strategy associated with additional lithium plating if selected. 19. The method of claim 18 further comprising displaying an estimated charging time for each of the plurality of available charging strategies on the user interface. 20. The method of claim 18 further comprising limiting user selection of the at least one charging strategy to a predetermined number of selections. | 2,800 |
11,286 | 11,286 | 15,466,553 | 2,865 | A power monitor may have more than one mode of operation to provide improved functionality for end users. For example, a first mode of operation may provide higher accuracy in determining information about devices but may also have higher latency in making determinations (e.g., identifying state changes of devices), and a second mode of operation may have lower accuracy but also lower latency to provide information more quickly to end users. The mode of operation of the power monitor may change depending on whether an end user is currently viewing information about devices. When a user is not viewing information about devices, the power monitor may operate in a first mode of operation (e.g., to improve accuracy), and when a user is viewing information about devices, the power monitor may operate in a second mode of operation (e.g., to provide updates more quickly). | 1. A system for providing information about devices in a building, the system comprising:
a power monitor comprising at least one processor and at least one memory, the power monitor configured to:
obtain a power monitoring signal by measuring an electrical property of a power line in the building, wherein the power line provides power to devices in the building;
process the power monitoring signal in a first mode of operation during a first time period to determine first information about devices in the building; and
process the power monitoring signal in a second mode of operation during a second time period to determine second information about devices in the building;
a user device comprising at least one processor and at least one memory, the user device configured to:
receive an input from a user to view information about devices in the building;
present the first information to the user, wherein the first information was determined by the power monitor before the user device received the input from the user; and
present the second information to the user, wherein the second information was determined by the power monitor after the user device received the input from the user;
at least one server computer comprising at least one processor and at least one memory, the at least one server computer configured to:
receive the first information from the power monitor and transmit the first information to the user device;
cause the power monitor to change from the first mode of operation to the second mode of operation after the user device receives the input from the user; and
receive the second information from the power monitor and transmit the second information to the user device. 2. The system of claim 1, wherein the input from the user comprises the user opening an application installed on the user device. 3. The system of claim 1, wherein:
the user device is configured to receive a second input from the user to stop viewing information about devices in the building; and the server computer is configured to cause the power monitor to change from the second mode of operation to the first mode of operation after the user device receives the second input from the user. 4. The system of claim 1, wherein the at least one server computer comprises a first server computer and a second server computer, and wherein:
the first server computer receives the first information from the power monitor and transmits the first information to the user device; and the second server computer receives the second information from the power monitor and transmits the second information to the user device. 5. The system of claim 4, wherein a network connection between the power monitor and the second server computer is a continuous network connection. 6. The system of claim 4, wherein a network connection between the power monitor and the first server computer is not a continuous network connection. 7. The system of claim 1, wherein the first time period and the second period do not overlap. 8. A computer-implemented method for providing information about devices in a building, the method implemented by at least one server computer and comprising:
receiving first information about devices in the building from a power monitor, wherein the power monitor determined the first information by operating in a first mode of operation and by measuring an electrical property of a power line in the building; receiving an identifier from the power monitor; storing the first information using the identifier received from the power monitor; receiving a message from a user device wherein the message indicates that a user of the user device is requesting to view information about devices in the building; receiving an identifier from the user device; causing the power monitor to change from the first mode of operation to a second mode of operation; retrieving the stored first information using the identifier received from the user device; transmitting the first information to the user device; receiving second information about devices in the building from the power monitor, wherein the power monitor determined the second information by operating in the second mode of operation and by measuring the electrical property of the power line in the building; and transmitting the second information to the user device. 9. The method of claim 8, wherein the first information comprises information about a state change of a first device and the second information comprises information about power usage of a second device. 10. The method of claim 8, wherein the second information is transmitted from the power monitor to the user device in real time. 11. The method of claim 8, comprising the step of modifying the first information before transmitting the first information to the user device. 12. The method of claim 8, wherein the identifier received from the power monitor is equal to the identifier received from the user device. 13. The method of claim 8, wherein
a first server computer receives the first information from the power monitor and transmits the first information to the user device; and a second server computer receives the second information from the power monitor and transmits the second information to the user device. 14. The method of claim 8, comprising the steps of:
receiving a message from a user device wherein the message indicates that a user of the user device is requesting to stop viewing information about devices in the building; and causing the power monitor to change from the second mode of operation to the first mode of operation. 15. One or more non-transitory computer-readable media comprising computer executable instructions that, when executed, cause at least one processor to perform actions comprising:
obtaining a first power monitoring signal by measuring an electrical property of a power line in the building, wherein the power line provides power to devices in the building; processing the first power monitoring signal in a first mode of operation during a first time period to determine first information about devices in the building; transmitting the first information about devices in the building to a server computer; receiving a message from the server computer to change from the first mode of operation to a second mode of operation; changing from the first mode of operation to the second mode of operation; obtaining a second power monitoring signal by measuring the electrical property of the power line in the building; processing the second power monitoring signal in the second mode of operation during a second time period to determine second information about devices in the building; transmitting the second information about devices in the building to the server computer; receiving a message from the server computer to change from the second mode of operation to the first mode of operation; and changing from the second mode of operation to the first mode of operation. 16. The one or more non-transitory computer-readable media of claim 15, wherein:
the message to change from the first mode of operation to the second mode of operation is received in response to a user performing an action to view information about devices in the building; and the message to change from the second mode of operation to the first mode of operation is received in response to the user performing an action to stop viewing information about devices in the building. 17. The one or more non-transitory computer-readable media of claim 15, wherein:
the first mode of operation comprises a historical mode of operation that operates at a higher accuracy and a higher latency; and the second mode of operation comprises a real-time mode of operation that operates at a lower accuracy and a lower latency. 18. The one or more non-transitory computer-readable media of claim 15, wherein the first mode of operation processes a larger number of features than the second mode of operation, or the first mode of operation adds a larger number of nodes to a search graph than the second mode of operation. 19. The one or more non-transitory computer-readable media of claim 15, wherein the power monitoring signal is obtained using at least one of a voltage sensor or a current sensor. 20. The one or more non-transitory computer-readable media of claim 15, wherein the power monitor determines the first information by processing the power monitoring signal with a plurality of mathematical models. | A power monitor may have more than one mode of operation to provide improved functionality for end users. For example, a first mode of operation may provide higher accuracy in determining information about devices but may also have higher latency in making determinations (e.g., identifying state changes of devices), and a second mode of operation may have lower accuracy but also lower latency to provide information more quickly to end users. The mode of operation of the power monitor may change depending on whether an end user is currently viewing information about devices. When a user is not viewing information about devices, the power monitor may operate in a first mode of operation (e.g., to improve accuracy), and when a user is viewing information about devices, the power monitor may operate in a second mode of operation (e.g., to provide updates more quickly).1. A system for providing information about devices in a building, the system comprising:
a power monitor comprising at least one processor and at least one memory, the power monitor configured to:
obtain a power monitoring signal by measuring an electrical property of a power line in the building, wherein the power line provides power to devices in the building;
process the power monitoring signal in a first mode of operation during a first time period to determine first information about devices in the building; and
process the power monitoring signal in a second mode of operation during a second time period to determine second information about devices in the building;
a user device comprising at least one processor and at least one memory, the user device configured to:
receive an input from a user to view information about devices in the building;
present the first information to the user, wherein the first information was determined by the power monitor before the user device received the input from the user; and
present the second information to the user, wherein the second information was determined by the power monitor after the user device received the input from the user;
at least one server computer comprising at least one processor and at least one memory, the at least one server computer configured to:
receive the first information from the power monitor and transmit the first information to the user device;
cause the power monitor to change from the first mode of operation to the second mode of operation after the user device receives the input from the user; and
receive the second information from the power monitor and transmit the second information to the user device. 2. The system of claim 1, wherein the input from the user comprises the user opening an application installed on the user device. 3. The system of claim 1, wherein:
the user device is configured to receive a second input from the user to stop viewing information about devices in the building; and the server computer is configured to cause the power monitor to change from the second mode of operation to the first mode of operation after the user device receives the second input from the user. 4. The system of claim 1, wherein the at least one server computer comprises a first server computer and a second server computer, and wherein:
the first server computer receives the first information from the power monitor and transmits the first information to the user device; and the second server computer receives the second information from the power monitor and transmits the second information to the user device. 5. The system of claim 4, wherein a network connection between the power monitor and the second server computer is a continuous network connection. 6. The system of claim 4, wherein a network connection between the power monitor and the first server computer is not a continuous network connection. 7. The system of claim 1, wherein the first time period and the second period do not overlap. 8. A computer-implemented method for providing information about devices in a building, the method implemented by at least one server computer and comprising:
receiving first information about devices in the building from a power monitor, wherein the power monitor determined the first information by operating in a first mode of operation and by measuring an electrical property of a power line in the building; receiving an identifier from the power monitor; storing the first information using the identifier received from the power monitor; receiving a message from a user device wherein the message indicates that a user of the user device is requesting to view information about devices in the building; receiving an identifier from the user device; causing the power monitor to change from the first mode of operation to a second mode of operation; retrieving the stored first information using the identifier received from the user device; transmitting the first information to the user device; receiving second information about devices in the building from the power monitor, wherein the power monitor determined the second information by operating in the second mode of operation and by measuring the electrical property of the power line in the building; and transmitting the second information to the user device. 9. The method of claim 8, wherein the first information comprises information about a state change of a first device and the second information comprises information about power usage of a second device. 10. The method of claim 8, wherein the second information is transmitted from the power monitor to the user device in real time. 11. The method of claim 8, comprising the step of modifying the first information before transmitting the first information to the user device. 12. The method of claim 8, wherein the identifier received from the power monitor is equal to the identifier received from the user device. 13. The method of claim 8, wherein
a first server computer receives the first information from the power monitor and transmits the first information to the user device; and a second server computer receives the second information from the power monitor and transmits the second information to the user device. 14. The method of claim 8, comprising the steps of:
receiving a message from a user device wherein the message indicates that a user of the user device is requesting to stop viewing information about devices in the building; and causing the power monitor to change from the second mode of operation to the first mode of operation. 15. One or more non-transitory computer-readable media comprising computer executable instructions that, when executed, cause at least one processor to perform actions comprising:
obtaining a first power monitoring signal by measuring an electrical property of a power line in the building, wherein the power line provides power to devices in the building; processing the first power monitoring signal in a first mode of operation during a first time period to determine first information about devices in the building; transmitting the first information about devices in the building to a server computer; receiving a message from the server computer to change from the first mode of operation to a second mode of operation; changing from the first mode of operation to the second mode of operation; obtaining a second power monitoring signal by measuring the electrical property of the power line in the building; processing the second power monitoring signal in the second mode of operation during a second time period to determine second information about devices in the building; transmitting the second information about devices in the building to the server computer; receiving a message from the server computer to change from the second mode of operation to the first mode of operation; and changing from the second mode of operation to the first mode of operation. 16. The one or more non-transitory computer-readable media of claim 15, wherein:
the message to change from the first mode of operation to the second mode of operation is received in response to a user performing an action to view information about devices in the building; and the message to change from the second mode of operation to the first mode of operation is received in response to the user performing an action to stop viewing information about devices in the building. 17. The one or more non-transitory computer-readable media of claim 15, wherein:
the first mode of operation comprises a historical mode of operation that operates at a higher accuracy and a higher latency; and the second mode of operation comprises a real-time mode of operation that operates at a lower accuracy and a lower latency. 18. The one or more non-transitory computer-readable media of claim 15, wherein the first mode of operation processes a larger number of features than the second mode of operation, or the first mode of operation adds a larger number of nodes to a search graph than the second mode of operation. 19. The one or more non-transitory computer-readable media of claim 15, wherein the power monitoring signal is obtained using at least one of a voltage sensor or a current sensor. 20. The one or more non-transitory computer-readable media of claim 15, wherein the power monitor determines the first information by processing the power monitoring signal with a plurality of mathematical models. | 2,800 |
11,287 | 11,287 | 15,378,369 | 2,845 | Aspects of the present disclosure may be directed to a multi-layer feed-board with all the functional components, including phase shifters, diplexers, and dipole element, employed thereon. Therefore, solder interfaces at cable to functional component interfaces are no longer necessary. Instead, component interfaces are within the confines of the multi-layer feed-board, thereby reducing PIM issues attributed to solder joint interfaces. | 1. A multi-band antenna, comprising:
a plurality of first radiating elements that are configured to transmit and receive signals in a first frequency band; a plurality of second radiating elements that are configured to transmit and receive signals in a second frequency band that is different from the first frequency band; and a multi-layer feed board that includes a first conductive layer including at least one first component that is associated with operation in the first frequency band and a second conductive layer including at least one second component that is associated with operation in the second frequency band. 2. The multi-band antenna of claim 1, wherein the first radiating elements and the second radiating elements are mounted on the multi-layer feed board. 3. The multi-band antenna of claim 2, further comprising a reflector having a front side and a back side, wherein the multi-layer feed board, the first radiating elements and the second radiating elements are positioned on the front side of the reflector. 4. The multi-band antenna of claim 1, wherein the back side of the reflector does not have any feed board mounted thereon. 5. The multi-band antenna of claim 1, wherein the multi-layer feed board includes a first phase shifter that is configured to operate on signals in the first frequency band and a second phase shifter that is configured to operate on signals in the second frequency band. 6. The multi-band antenna of claim 1, wherein the first phase shifter and the second phase shifter are on the same layer of the multi-layer feed board. 7. The multi-band antenna of claim 1, wherein the multi-layer feed board further comprises at least one diplexer. 8. The multi-band antenna of claim 1, wherein a plurality of first conductive traces on a first signal trace layer of the multi-layer feed board connect to the respective first radiating elements, and a plurality of second conductive traces on a second signal trace layer of the multi-layer feed board connect to the respective second radiating elements. 9. The multi-band antenna of claim 1, wherein the multi-layer feed board includes at least two signal trace layers and at least two ground layers, and a plurality of insulating layers. 10. A multi-layer feed board of an antenna, the multi-layer feed board comprising:
a first conductive layer including at least one first component associated with operation of the antenna in a first frequency band; and a second conductive layer including at least one second component associated with operation of the antenna in a second frequency band different than the first frequency band. | Aspects of the present disclosure may be directed to a multi-layer feed-board with all the functional components, including phase shifters, diplexers, and dipole element, employed thereon. Therefore, solder interfaces at cable to functional component interfaces are no longer necessary. Instead, component interfaces are within the confines of the multi-layer feed-board, thereby reducing PIM issues attributed to solder joint interfaces.1. A multi-band antenna, comprising:
a plurality of first radiating elements that are configured to transmit and receive signals in a first frequency band; a plurality of second radiating elements that are configured to transmit and receive signals in a second frequency band that is different from the first frequency band; and a multi-layer feed board that includes a first conductive layer including at least one first component that is associated with operation in the first frequency band and a second conductive layer including at least one second component that is associated with operation in the second frequency band. 2. The multi-band antenna of claim 1, wherein the first radiating elements and the second radiating elements are mounted on the multi-layer feed board. 3. The multi-band antenna of claim 2, further comprising a reflector having a front side and a back side, wherein the multi-layer feed board, the first radiating elements and the second radiating elements are positioned on the front side of the reflector. 4. The multi-band antenna of claim 1, wherein the back side of the reflector does not have any feed board mounted thereon. 5. The multi-band antenna of claim 1, wherein the multi-layer feed board includes a first phase shifter that is configured to operate on signals in the first frequency band and a second phase shifter that is configured to operate on signals in the second frequency band. 6. The multi-band antenna of claim 1, wherein the first phase shifter and the second phase shifter are on the same layer of the multi-layer feed board. 7. The multi-band antenna of claim 1, wherein the multi-layer feed board further comprises at least one diplexer. 8. The multi-band antenna of claim 1, wherein a plurality of first conductive traces on a first signal trace layer of the multi-layer feed board connect to the respective first radiating elements, and a plurality of second conductive traces on a second signal trace layer of the multi-layer feed board connect to the respective second radiating elements. 9. The multi-band antenna of claim 1, wherein the multi-layer feed board includes at least two signal trace layers and at least two ground layers, and a plurality of insulating layers. 10. A multi-layer feed board of an antenna, the multi-layer feed board comprising:
a first conductive layer including at least one first component associated with operation of the antenna in a first frequency band; and a second conductive layer including at least one second component associated with operation of the antenna in a second frequency band different than the first frequency band. | 2,800 |
11,288 | 11,288 | 15,230,179 | 2,899 | Implementations of semiconductor packages may include: a lead frame having at least one corner lead, the at least one corner lead positioned where two edges of the package meet, and the at least one lead having a half etch on a first portion of the lead and a half etch on a second portion of the lead. The first portion may extend internally into the package to create a mechanical mold compound lock between a mold compound of the package and the lead. The second portion may be located on at least one of the two edges of the package. | 1. A semiconductor package comprising:
a lead frame comprising at least one corner lead, the at least one corner lead positioned where two edges of the package meet, and the at least one corner lead having a half etch on a first portion of the lead and a half etch on a second portion of the lead; wherein the first portion extends internally into the package to create a mechanical mold compound lock between a mold compound of the package and the lead; wherein the second portion is located on at least one of the two edges of the package; and wherein the second portion is a portion of the at least one corner lead that contacts a mounting surface of the semiconductor package. 2. The semiconductor of claim 1, wherein the first portion is a portion of the at least one corner lead that does not contact a mounting surface of the semiconductor package. 3. The semiconductor of claim 1, wherein the first portion of the lead is configured to have space for coupling a wire bond thereto. 4. The semiconductor of claim 1, further comprising a second lead adjacent to the at least one corner lead where the second lead and the at least one corner lead have a lead pitch of at least 0.2 millimeters. 5. A semiconductor package comprising:
a lead frame comprising at least one lead that is located on an edge of the package, the at least one lead having a half etch on a first portion of the lead and a half etch on a second portion of the lead; wherein the first portion extends internally into the package to create a mechanical mold compound lock between a mold compound and the lead; wherein the second portion of the lead is located on the edge of the package; and wherein the second portion is a portion of the at least one lead that contacts a mounting surface of the semiconductor package. 6. The semiconductor of claim 5, wherein the first portion is a portion of the at least one lead that does not contact a mounting surface of the semiconductor package. 7. The semiconductor of claim 5, wherein the first portion of the lead is configured to have space for coupling a wire bond thereto. 8. The semiconductor of claim 5, further comprising a second lead adjacent to the at least one lead where the second lead and the at least one lead have a lead pitch of at least 0.2 millimeters. 9-14. (canceled) | Implementations of semiconductor packages may include: a lead frame having at least one corner lead, the at least one corner lead positioned where two edges of the package meet, and the at least one lead having a half etch on a first portion of the lead and a half etch on a second portion of the lead. The first portion may extend internally into the package to create a mechanical mold compound lock between a mold compound of the package and the lead. The second portion may be located on at least one of the two edges of the package.1. A semiconductor package comprising:
a lead frame comprising at least one corner lead, the at least one corner lead positioned where two edges of the package meet, and the at least one corner lead having a half etch on a first portion of the lead and a half etch on a second portion of the lead; wherein the first portion extends internally into the package to create a mechanical mold compound lock between a mold compound of the package and the lead; wherein the second portion is located on at least one of the two edges of the package; and wherein the second portion is a portion of the at least one corner lead that contacts a mounting surface of the semiconductor package. 2. The semiconductor of claim 1, wherein the first portion is a portion of the at least one corner lead that does not contact a mounting surface of the semiconductor package. 3. The semiconductor of claim 1, wherein the first portion of the lead is configured to have space for coupling a wire bond thereto. 4. The semiconductor of claim 1, further comprising a second lead adjacent to the at least one corner lead where the second lead and the at least one corner lead have a lead pitch of at least 0.2 millimeters. 5. A semiconductor package comprising:
a lead frame comprising at least one lead that is located on an edge of the package, the at least one lead having a half etch on a first portion of the lead and a half etch on a second portion of the lead; wherein the first portion extends internally into the package to create a mechanical mold compound lock between a mold compound and the lead; wherein the second portion of the lead is located on the edge of the package; and wherein the second portion is a portion of the at least one lead that contacts a mounting surface of the semiconductor package. 6. The semiconductor of claim 5, wherein the first portion is a portion of the at least one lead that does not contact a mounting surface of the semiconductor package. 7. The semiconductor of claim 5, wherein the first portion of the lead is configured to have space for coupling a wire bond thereto. 8. The semiconductor of claim 5, further comprising a second lead adjacent to the at least one lead where the second lead and the at least one lead have a lead pitch of at least 0.2 millimeters. 9-14. (canceled) | 2,800 |
11,289 | 11,289 | 15,201,905 | 2,814 | A microwave amplifier having a field effect transistor formed on an upper surface of a substrate. A de-Q'ing section connected to the field effect transistor includes: a de-Q'ing resistive via that passes through the substrate; and a de-Q'ing capacitor having one plate thereof connected a ground plane conductor through the de-Q'ing resistive via. | 1. A microwave amplifier, comprising:
a substrate; a field effect transistor, formed on an upper surface of the substrate, comprising:
a gate connected to an input signal;
a source connected to a ground plane conductor disposed on a bottom surface of the substrate through an electrically conductive via passing through the substrate; and
a drain connected to a drain voltage bus through a choke;
a transmission line having predetermined impedance characteristic, Z0; a de-Q'ing section coupled to the field effect transistor through the transmission line, comprising;
a de-Q'ing resistive via passing through the substrate;
a de-Q'ing capacitor having a first plate thereof connected to the drain voltage bus and a second plate thereof connected to the ground plane conductor through the de-Q'ing resistive via passing through the substrate;
wherein the first plate is dielectrically separated from the second plate, and
wherein the de-Q'ing resistive via is deposed under, and connected to, the second plate of the de-Q'ing capacitor, the de-Q'ing resistive via comprising a resistive material passing through the substrate between the second plate of the de-Q'ing capacitor and the ground plane conductor, the resistive material providing a resistance, R, in accordance with the predetermined impedance characteristics, Z0 of the transmission line. 2. The microwave amplifier recited in claim 1 wherein the resistive via comprises a hollow resistive material. 3. A microwave amplifier, comprising:
a substrate; a field effect transistor, formed on an upper surface of the substrate, comprising:
a gate connected to an input signal;
a source connected to a ground plane conductor disposed on a bottom surface of the substrate through an electrically conductive via passing through the substrate; and
a drain connected to a drain voltage buss through a choke;
a transmission line having predetermined impedance characteristic, Z0; a de-Q'ing section coupled to the field effect transistor through the transmission line, comprising:
a de-Q'ing resistive via; and
a de-Q'ing capacitor having a first plate thereof connected to the drain voltage bus and a second plate thereof disposed over, and connected to, one end of the de-Q'ing resistive via, the second plate being disposed on the upper surface of the substrate;
wherein the second plate is dielectrically separated from the first plate;
wherein the de-Q'ing resistive via passes between second plate of the de-Q'ing capacitor and the ground plane conductor, with a second end of the resistive via being connected to the ground plane conductor and
wherein the de-Q'ing resistive via comprises a resistive material passing through the substrate between second plate of the de-Q'ing capacitor and the ground plane conductor, the resistive material providing a resistance, R, in accordance with the predetermined impedance characteristic, Z0 of the transmission line. 4. The microwave amplifier recited in claim 3 wherein the resistive via comprises a hollow resistive material. | A microwave amplifier having a field effect transistor formed on an upper surface of a substrate. A de-Q'ing section connected to the field effect transistor includes: a de-Q'ing resistive via that passes through the substrate; and a de-Q'ing capacitor having one plate thereof connected a ground plane conductor through the de-Q'ing resistive via.1. A microwave amplifier, comprising:
a substrate; a field effect transistor, formed on an upper surface of the substrate, comprising:
a gate connected to an input signal;
a source connected to a ground plane conductor disposed on a bottom surface of the substrate through an electrically conductive via passing through the substrate; and
a drain connected to a drain voltage bus through a choke;
a transmission line having predetermined impedance characteristic, Z0; a de-Q'ing section coupled to the field effect transistor through the transmission line, comprising;
a de-Q'ing resistive via passing through the substrate;
a de-Q'ing capacitor having a first plate thereof connected to the drain voltage bus and a second plate thereof connected to the ground plane conductor through the de-Q'ing resistive via passing through the substrate;
wherein the first plate is dielectrically separated from the second plate, and
wherein the de-Q'ing resistive via is deposed under, and connected to, the second plate of the de-Q'ing capacitor, the de-Q'ing resistive via comprising a resistive material passing through the substrate between the second plate of the de-Q'ing capacitor and the ground plane conductor, the resistive material providing a resistance, R, in accordance with the predetermined impedance characteristics, Z0 of the transmission line. 2. The microwave amplifier recited in claim 1 wherein the resistive via comprises a hollow resistive material. 3. A microwave amplifier, comprising:
a substrate; a field effect transistor, formed on an upper surface of the substrate, comprising:
a gate connected to an input signal;
a source connected to a ground plane conductor disposed on a bottom surface of the substrate through an electrically conductive via passing through the substrate; and
a drain connected to a drain voltage buss through a choke;
a transmission line having predetermined impedance characteristic, Z0; a de-Q'ing section coupled to the field effect transistor through the transmission line, comprising:
a de-Q'ing resistive via; and
a de-Q'ing capacitor having a first plate thereof connected to the drain voltage bus and a second plate thereof disposed over, and connected to, one end of the de-Q'ing resistive via, the second plate being disposed on the upper surface of the substrate;
wherein the second plate is dielectrically separated from the first plate;
wherein the de-Q'ing resistive via passes between second plate of the de-Q'ing capacitor and the ground plane conductor, with a second end of the resistive via being connected to the ground plane conductor and
wherein the de-Q'ing resistive via comprises a resistive material passing through the substrate between second plate of the de-Q'ing capacitor and the ground plane conductor, the resistive material providing a resistance, R, in accordance with the predetermined impedance characteristic, Z0 of the transmission line. 4. The microwave amplifier recited in claim 3 wherein the resistive via comprises a hollow resistive material. | 2,800 |
11,290 | 11,290 | 14,910,587 | 2,812 | A drilling method includes collecting survey data at a drilling site, and determining a waypoint or borehole path based on the survey data. The drilling method also includes sending the survey data to a remote monitoring facility that applies corrections to the survey data. The drilling method also includes receiving the corrected survey data, and automatically updating the waypoint or borehole path based on the corrected survey data. | 1. A drilling method that comprises:
collecting survey data at a drilling site; determining a waypoint or borehole path based on the survey data; sending the survey data to a remote monitoring facility that applies corrections to the survey data; receiving the corrected survey data or a related correction message; and automatically updating the waypoint or borehole path based on the corrected survey data or a related correction message. 2. The method of claim 1, further comprising displaying an update acceptance prompt or alert notification related to the updated waypoint or borehole path. 3. The method of claim 2, wherein the update acceptance prompt or alert notification includes at least some of the corrected survey data. 4. The method of claim 2, wherein the update acceptance prompt or alert notification includes a plurality of response options. 5. The method of claim 1, further comprising displaying the updated waypoint or borehole path. 6. The method of claim 1, further comprising automatically adjusting a drilling trajectory based at least in part on the updated waypoint or borehole path. 7. The method of claim 1, further comprising manually adjusting a drilling trajectory based at least in part on the updated waypoint or borehole path. 8. The method of claim 1, wherein the survey data comprises time, depth, inclination, and azimuth data, magnetic field components, and gravitational field components. 9. The method of claim 1, according to any one of claims 1 to 7, wherein the survey data comprises passive ranging data. 10. The method of claim 1, wherein the corrections to the survey data are based at least at least one of observatory data, multi-station analysis, and an instrument performance model (IPM). 11. The method of claim 1, wherein the related correction message includes a survey tool replacement indicator. 12. A drilling system that comprises:
a survey tool that collects survey data; and at least one drilling site computer configured to receive the survey data from the survey tool, to determine a waypoint or borehole path based on the survey data, and to send the survey data to a remote monitoring facility, wherein the at least one drilling site computer is configured to automatically update the waypoint or borehole path based on corrected survey data or a related correction message received from the remote monitoring facility. 13. The system of claim 12, wherein the at least one drilling site computer is configured to display an update acceptance prompt or alert notification related to the updated waypoint or borehole path. 14. The system of claim 12, wherein the update acceptance prompt or alert notification includes a plurality of response options. 15. The system of claim 12, wherein the at least one drilling site computer displays the updated waypoint or borehole path. 16. The system of claim 12, wherein the at least one drilling site computer provides a drilling control interface that enables a drilling trajectory to be automatically adjusted based at least in part on the updated waypoint or borehole path. 17. The system of claim 12, wherein the at least one drilling site computer provides a drilling control interface that enables a drilling trajectory to be manually adjusted based at least in part on the updated waypoint or borehole path. 18. The system of claim 12, wherein the survey data comprises magnetic field components and gravitational field components. 19. The system claim 12, further comprising at least one computer at the remote monitoring facility configured to apply at least one of a BGGM correction, an IFR correction, an IIFR correction, and an instrument performance model (IPM) correction to the survey data. 20. The system of claim 12, further comprising at least one computer at the remote monitoring facility configured to apply a correction to the survey data based on multi-station analysis. 21. A system that comprises:
a first computer that determines a waypoint or borehole path based on survey data collected by a survey tool; and a second computer in communication with the first computer, wherein the second computer applies a correction to the survey data based on at least one of observatory data, multi-station analysis, and an instrument performance model (IPM), wherein the first computer automatically updates the waypoint or borehole path based on the corrected survey data or a related correction message. 22. The system of claim 21, further comprising a third computer in communication with the second computer, wherein the third computer receives alerts related to the corrected survey data. 23. The system of claim 22, wherein the third computer comprises a mobile computing device. | A drilling method includes collecting survey data at a drilling site, and determining a waypoint or borehole path based on the survey data. The drilling method also includes sending the survey data to a remote monitoring facility that applies corrections to the survey data. The drilling method also includes receiving the corrected survey data, and automatically updating the waypoint or borehole path based on the corrected survey data.1. A drilling method that comprises:
collecting survey data at a drilling site; determining a waypoint or borehole path based on the survey data; sending the survey data to a remote monitoring facility that applies corrections to the survey data; receiving the corrected survey data or a related correction message; and automatically updating the waypoint or borehole path based on the corrected survey data or a related correction message. 2. The method of claim 1, further comprising displaying an update acceptance prompt or alert notification related to the updated waypoint or borehole path. 3. The method of claim 2, wherein the update acceptance prompt or alert notification includes at least some of the corrected survey data. 4. The method of claim 2, wherein the update acceptance prompt or alert notification includes a plurality of response options. 5. The method of claim 1, further comprising displaying the updated waypoint or borehole path. 6. The method of claim 1, further comprising automatically adjusting a drilling trajectory based at least in part on the updated waypoint or borehole path. 7. The method of claim 1, further comprising manually adjusting a drilling trajectory based at least in part on the updated waypoint or borehole path. 8. The method of claim 1, wherein the survey data comprises time, depth, inclination, and azimuth data, magnetic field components, and gravitational field components. 9. The method of claim 1, according to any one of claims 1 to 7, wherein the survey data comprises passive ranging data. 10. The method of claim 1, wherein the corrections to the survey data are based at least at least one of observatory data, multi-station analysis, and an instrument performance model (IPM). 11. The method of claim 1, wherein the related correction message includes a survey tool replacement indicator. 12. A drilling system that comprises:
a survey tool that collects survey data; and at least one drilling site computer configured to receive the survey data from the survey tool, to determine a waypoint or borehole path based on the survey data, and to send the survey data to a remote monitoring facility, wherein the at least one drilling site computer is configured to automatically update the waypoint or borehole path based on corrected survey data or a related correction message received from the remote monitoring facility. 13. The system of claim 12, wherein the at least one drilling site computer is configured to display an update acceptance prompt or alert notification related to the updated waypoint or borehole path. 14. The system of claim 12, wherein the update acceptance prompt or alert notification includes a plurality of response options. 15. The system of claim 12, wherein the at least one drilling site computer displays the updated waypoint or borehole path. 16. The system of claim 12, wherein the at least one drilling site computer provides a drilling control interface that enables a drilling trajectory to be automatically adjusted based at least in part on the updated waypoint or borehole path. 17. The system of claim 12, wherein the at least one drilling site computer provides a drilling control interface that enables a drilling trajectory to be manually adjusted based at least in part on the updated waypoint or borehole path. 18. The system of claim 12, wherein the survey data comprises magnetic field components and gravitational field components. 19. The system claim 12, further comprising at least one computer at the remote monitoring facility configured to apply at least one of a BGGM correction, an IFR correction, an IIFR correction, and an instrument performance model (IPM) correction to the survey data. 20. The system of claim 12, further comprising at least one computer at the remote monitoring facility configured to apply a correction to the survey data based on multi-station analysis. 21. A system that comprises:
a first computer that determines a waypoint or borehole path based on survey data collected by a survey tool; and a second computer in communication with the first computer, wherein the second computer applies a correction to the survey data based on at least one of observatory data, multi-station analysis, and an instrument performance model (IPM), wherein the first computer automatically updates the waypoint or borehole path based on the corrected survey data or a related correction message. 22. The system of claim 21, further comprising a third computer in communication with the second computer, wherein the third computer receives alerts related to the corrected survey data. 23. The system of claim 22, wherein the third computer comprises a mobile computing device. | 2,800 |
11,291 | 11,291 | 13,049,287 | 2,883 | An optical modulator has a first branch and a second branch, both being connectable to an input, in particular to a light source. The first branch has an amplitude modulator and a phase shifter, and the amplitude modulator is operable by a first signal that is substantially sinusoidal. The second branch has an amplitude modulator that is operable by a second signal that is substantially 90 degree phase shifted to the first signal. A combining unit with two inputs and two outputs combines the optical fields of the first and second branches. Each output is arranged to supply an optical carrier. A combined optical modulator is formed with at least one such optical modulator. Further, there is provided a method for providing several optical carriers based on an input signal. | 1. An optical modulator, comprising:
a first branch and a second branch each connectable to an input; said first branch containing an amplitude modulator and a phase shifter, said amplitude modulator in said first branch being operable by a substantially sinusoidal first signal; said second branch containing an amplitude modulator that is operable by a second signal that is phase-shifted by substantially 90 degrees relative to the first signal; a combining unit having two inputs and two outputs and combining the optical fields of said first branch and said second branch; each of said outputs being arranged to supply an optical carrier. 2. The optical modulator according to claim 1, wherein said first and second branches are each connectable to a light source. 3. The optical modulator according to claim 1, comprising a two-beam interferometer. 4. The optical modulator according to claim 1, wherein said first branch and said second branch each comprises a Mach-Zehnder modulator. 5. The optical modulator according to claim 2, wherein a phase of said first branch or a phase of said second branch is adjusted to at least partially compensate a deficient suppression of a frequency of said light source. 6. The optical modulator according to claim 1, wherein each output of said combining unit is modulated with an electrical data signal into an optical output signal that is combined and conveyed via an optical fiber. 7. The optical modulator according to claim 1, which comprises a splitter connected to said output of said combining unit, a modulator connected to said splitter, and a polarization converter connected to said modulator, said polarization converter outputting a polarized output signal, and wherein the polarized output signal is combined and conveyed via an optical fiber. 8. The optical modulator according to claim 7, wherein said optical modulator comprises a third output carrying the signal of the input. 9. The optical modulator according to claim 1, configured to supply local oscillator signals in an optical component. 10. The optical modulator according to claim 9, configured to supply local oscillator signals in an optical line terminal. 11. The optical modulator according to claim 9, wherein each output of the optical modulator is connected to a receiver of the optical component. 12. A combined optical modulator, comprising a plurality of optical modulators each according to claim 1, disposed to receive a feed signal from a common light source. 13. A combined optical modulator, comprising a plurality of optical modulators each according to claim 1, said plurality of optical modulators including a first optical modulator, a second optical modulator, and a third optical modulator, said first optical modulator having a first output connected to an input of said second optical modulator and a second output connected to an input of said third optical modulator. 14. A combined optical modulator, comprising:
at least one combined optical modulator comprising a plurality of optical modulators each according to claim 1, disposed to receive a feed signal from a common light source; and at least one combined optical modulator comprising a plurality of optical modulators each according to claim 1, said plurality of optical modulators including a first optical modulator, a second optical modulator, and a third optical modulator, said first optical modulator having a first output connected to an input of said second optical modulator and a second output connected to an input of said third optical modulator. 15. A communication system, comprising at least one optical modulator according to claim 1. 16. A communication system, comprising at least one combined optical modulator formed of a plurality of optical modulators each according to claim 1 and disposed to receive a feed signal from a common light source. 17. A communication system, comprising at least one combined optical modulator formed of a plurality of optical modulators each according to claim 1 and disposed to receive a feed signal from a common light source, and at least one combined optical modulator formed of a plurality of optical modulators each according to claim 1 and including first, second, and third optical modulators, said first optical modulator having a first output connected to an input of said second optical modulator and a second output connected to an input of said third optical modulator. 18. A method for providing a plurality of optical carriers based on an input signal, the method which comprises:
feeding an input signal by a splitter to a first branch and to a second branch; modulating and phase-shifting the input signal by the first branch, thereby amplitude-modulating the input signal by a first, substantially sinusoidal signal; amplitude-modulating the input signal by a second signal in the second branch, wherein the second signal is phase-shifted by substantially 90 degrees relative to the first signal; combining the optical fields of the first branch and the second branch by a combining unit, wherein the combining unit supplies two outputs; and wherein each of the outputs provides an optical carrier. 19. The method according to claim 18, which comprises modulating each output of the combining unit with an electrical signal. 20. The method according to claim 18, which comprises modulating each output of the combining unit with an electrical signal to form a modulated signal, and feeding the modulated signal via a combiner onto an optical fiber. | An optical modulator has a first branch and a second branch, both being connectable to an input, in particular to a light source. The first branch has an amplitude modulator and a phase shifter, and the amplitude modulator is operable by a first signal that is substantially sinusoidal. The second branch has an amplitude modulator that is operable by a second signal that is substantially 90 degree phase shifted to the first signal. A combining unit with two inputs and two outputs combines the optical fields of the first and second branches. Each output is arranged to supply an optical carrier. A combined optical modulator is formed with at least one such optical modulator. Further, there is provided a method for providing several optical carriers based on an input signal.1. An optical modulator, comprising:
a first branch and a second branch each connectable to an input; said first branch containing an amplitude modulator and a phase shifter, said amplitude modulator in said first branch being operable by a substantially sinusoidal first signal; said second branch containing an amplitude modulator that is operable by a second signal that is phase-shifted by substantially 90 degrees relative to the first signal; a combining unit having two inputs and two outputs and combining the optical fields of said first branch and said second branch; each of said outputs being arranged to supply an optical carrier. 2. The optical modulator according to claim 1, wherein said first and second branches are each connectable to a light source. 3. The optical modulator according to claim 1, comprising a two-beam interferometer. 4. The optical modulator according to claim 1, wherein said first branch and said second branch each comprises a Mach-Zehnder modulator. 5. The optical modulator according to claim 2, wherein a phase of said first branch or a phase of said second branch is adjusted to at least partially compensate a deficient suppression of a frequency of said light source. 6. The optical modulator according to claim 1, wherein each output of said combining unit is modulated with an electrical data signal into an optical output signal that is combined and conveyed via an optical fiber. 7. The optical modulator according to claim 1, which comprises a splitter connected to said output of said combining unit, a modulator connected to said splitter, and a polarization converter connected to said modulator, said polarization converter outputting a polarized output signal, and wherein the polarized output signal is combined and conveyed via an optical fiber. 8. The optical modulator according to claim 7, wherein said optical modulator comprises a third output carrying the signal of the input. 9. The optical modulator according to claim 1, configured to supply local oscillator signals in an optical component. 10. The optical modulator according to claim 9, configured to supply local oscillator signals in an optical line terminal. 11. The optical modulator according to claim 9, wherein each output of the optical modulator is connected to a receiver of the optical component. 12. A combined optical modulator, comprising a plurality of optical modulators each according to claim 1, disposed to receive a feed signal from a common light source. 13. A combined optical modulator, comprising a plurality of optical modulators each according to claim 1, said plurality of optical modulators including a first optical modulator, a second optical modulator, and a third optical modulator, said first optical modulator having a first output connected to an input of said second optical modulator and a second output connected to an input of said third optical modulator. 14. A combined optical modulator, comprising:
at least one combined optical modulator comprising a plurality of optical modulators each according to claim 1, disposed to receive a feed signal from a common light source; and at least one combined optical modulator comprising a plurality of optical modulators each according to claim 1, said plurality of optical modulators including a first optical modulator, a second optical modulator, and a third optical modulator, said first optical modulator having a first output connected to an input of said second optical modulator and a second output connected to an input of said third optical modulator. 15. A communication system, comprising at least one optical modulator according to claim 1. 16. A communication system, comprising at least one combined optical modulator formed of a plurality of optical modulators each according to claim 1 and disposed to receive a feed signal from a common light source. 17. A communication system, comprising at least one combined optical modulator formed of a plurality of optical modulators each according to claim 1 and disposed to receive a feed signal from a common light source, and at least one combined optical modulator formed of a plurality of optical modulators each according to claim 1 and including first, second, and third optical modulators, said first optical modulator having a first output connected to an input of said second optical modulator and a second output connected to an input of said third optical modulator. 18. A method for providing a plurality of optical carriers based on an input signal, the method which comprises:
feeding an input signal by a splitter to a first branch and to a second branch; modulating and phase-shifting the input signal by the first branch, thereby amplitude-modulating the input signal by a first, substantially sinusoidal signal; amplitude-modulating the input signal by a second signal in the second branch, wherein the second signal is phase-shifted by substantially 90 degrees relative to the first signal; combining the optical fields of the first branch and the second branch by a combining unit, wherein the combining unit supplies two outputs; and wherein each of the outputs provides an optical carrier. 19. The method according to claim 18, which comprises modulating each output of the combining unit with an electrical signal. 20. The method according to claim 18, which comprises modulating each output of the combining unit with an electrical signal to form a modulated signal, and feeding the modulated signal via a combiner onto an optical fiber. | 2,800 |
11,292 | 11,292 | 13,823,333 | 2,865 | Device and methods for detecting/quantifying a fluorescent taggant in a liquid sample. Generally, the liquid samples are fuels having low concentrations (measured in ppb) of a fluorescent taggant. The detection/quantification generates a predicted concentration of the fluorescent tagging compound using a process selected from the group of a multivariate process, a background subtraction process, or a combination of both. The invention addresses the detection of an adulteration of gasoline and diesel fuels. | 1. A method for determining whether a liquid sample comprises a particular fluorescent tagging compound at a preset concentration, wherein the method comprises:
(a) obtaining a measured emission spectrum from the liquid sample, wherein the liquid sample is exposed to a light source that causes the particular fluorescent tagging compound to fluoresce over a spectral range; (b) generating a predicted concentration of the particular fluorescent tagging compound in the liquid sample, wherein the generating comprises a process selected from the group consisting of
(i) a multivariate process comprising:
(1) selecting a library that comprises a plurality of known emission spectra, wherein each of the plurality of known emission spectra is correlated to a known concentration of the particular fluorescent tagging compound, and
(2) utilizing the library and the measured emission spectrum to generate the predicted concentration of the particular fluorescent tagging compound in the liquid sample,
(ii) a background subtraction process comprising:
(1) determining a background emission spectrum from the measured emission spectrum,
(2) eliminating the background emission spectrum from the measured emission spectrum to obtain a predicted emission spectrum, and
(3) evaluating the predicted emission spectrum to generate the predicted concentration of the particular fluorescent tagging compound in the liquid sample, and
(iii) a combination of (i) and (ii); and
(c) comparing the predicted concentration of the particular fluorescent tagging compound in the liquid sample with the preset concentration of the particular fluorescent tagging compound in the liquid sample. 2. The method of claim 1, wherein
(a) the liquid sample is determined to comprise the particular fluorescent tagging compound at the preset concentration when the predicted concentration is within a present range of the particular fluorescent tagging compound in the liquid sample, and (b) the liquid sample is determined not to comprise the particular fluorescent tagging compound at the preset concentration when the predicted concentration is outside the present range of the particular fluorescent tagging compound in the liquid sample. 3. The method of claim 1 further comprising authenticating the liquid sample, wherein
(i) the liquid sample is determined to be authentic when the predicted concentration is within a preset percentage of the preset concentration of the particular fluorescent tagging compound in the liquid sample; and
(ii) the liquid sample is determined to not be authentic when the predicted concentration is outside the preset percentage of the preset concentration of the particular fluorescent tagging compound in the liquid sample. 4-7. (canceled) 8. The method of claim 1, wherein the particular fluorescent tagging compound is a first particular fluorescent tagging agent. 9. The method of claim 1, wherein
(a) the particular fluorescent tagging compound is a combination of (i) a first particular fluorescent tagging agent, and (ii) a second particular tagging agent; (b) the preset concentration is (i) a first preset concentration of the first particular fluorescent tagging agent, and (ii) a second preset concentration of the second particular fluorescent tagging agent; (c) the predicted concentration of the particular fluorescent tagging compound in the liquid sample comprises (i) a first predicted concentration of the first particular fluorescent tagging agent, and (ii) a second predicted concentration of the second particular fluorescent agent; and (d) the present range of the particular fluorescent tagging compound in the liquid sample comprises (i) a first present range of the first particular fluorescent tagging agent, and (ii) a second present range of the first particular fluorescent tagging agent. 10. The method of claim 1, wherein
(a) the particular fluorescent tagging compound is a combination of three or more particular fluorescent tagging agents; (b) the preset concentration is a preset concentration for each of the three or more particular fluorescent tagging agents; (c) the predicted concentration of the particular fluorescent tagging compound in the liquid sample comprises a predicted concentration for each of the three or more particular fluorescent tagging agents; and (d) the present range of the particular fluorescent tagging compound in the liquid sample comprises a present range for each of the three or more particular fluorescent tagging agents. 11-12. (canceled) 13. The method of claim 1, wherein the particular fluorescent tagging compound comprises a first particular fluorescent tagging agent having an emission fluorescence in a range of from about 500 nm to about 900 nm. 14. The method of claim 13, wherein
(a) the particular fluorescent tagging compound comprises a second particular fluorescent tagging agent; (b) the second particular fluorescent tagging agent has an emission fluorescence in a range of from about 500 nm to about 900 nm; and (c) the first particular fluorescent tagging agent and the second particular fluorescent tagging agent have different emission fluorescence in a range of from about 500 nm to about 900 nm. 15. The method of claim 14, wherein
(a) the particular fluorescent tagging compound comprises a third particular fluorescent tagging agent; (b) the third particular fluorescent tagging agent has an emission fluorescence in a range of from about 500 nm to about 900 nm; (c) the first particular fluorescent tagging agent, the second particular fluorescent tagging agent, and the third particular fluorescent tagging agent have different emission fluorescence in a range of from about 500 nm to about 900 nm. 16. (canceled) 17. The method of claim 1, wherein the spectral range comprises a range of from 500 nm to 900 nm. 18. The method of claim 1, wherein the liquid is selected from the group consisting of liquid petroleum hydrocarbon-based fuels, biologically-derived fuels (biofuels), and common industrial solvents. 19. The method of claim 1, wherein
(a) the liquid sample comprises a known type of liquid; and (b) the utilizing the library comprises utilizing only the measured emission spectrum measured from the known type of liquid in the library. 20. The method of claim 1, wherein
(a) the liquid sample is from a known geographical region; and (b) the utilizing the library comprises utilizing only the measured emission spectrum measured from that known geographical region. 21. The method of claim 1, wherein utilizing the library and the measured emission spectrum to generate the predicted concentration of the particular fluorescent tagging compound in the liquid sample comprises performing a multivariate analysis utilizing the library and the measured emission spectrum. 22. (canceled) 23. The method of claim 21, wherein the multivariate analysis comprises a partial least squares analysis. 24. The method of claim 23, wherein the multivariate analysis comprises a principal components regression analysis. 25. The method of claim 24, wherein the multivariate analysis yields a calibration model that comprises a plurality of spectral vectors correlation scores relating to concentration of the particular fluorescent tagging compound. 26. The method of claim 25, wherein the utilizing the library and the measured emission spectrum to generate the predicted concentration of the particular fluorescent tagging compound in the liquid sample further comprises using the calibration model to calculate the predicted concentration of the particular fluorescent tagging compound in the liquid sample. 27. The method of claim 1, wherein the determining the background emission spectrum comprises obtaining at least three data points from the measured emission spectrum and using these three data points to calculate the background emission spectrum. 28. The method of claim 27, wherein the calculating the background emission spectrum comprises fitting the three data points into a quadratic curve. 29. The method of claim 27, wherein the calculating the background emission spectrum comprises fitting the three data points into an exponential curve. 30. The method of claim 29, wherein the calculating the background emission spectrum comprises fitting the three data points into a linear combination of an exponential curve and a quadratic curve. 31. The method of claim 1, wherein the eliminating the background spectrum from the measured emission spectrum comprises subtracting the background spectrum from the measured emission spectrum. 32. The method of claim 1, wherein the evaluating the predicted emission spectrum to determine a predicted concentration of the particular fluorescent tagging compound in the liquid sample comprises calculating the area under the predicted emission spectrum. 33. The method of claim 1, wherein the evaluating the predicted emission spectrum to determine a predicted concentration of the particular fluorescent tagging compound in the liquid sample comprises evaluating at least one peak of the predicted emission spectrum. 34-63. (canceled) | Device and methods for detecting/quantifying a fluorescent taggant in a liquid sample. Generally, the liquid samples are fuels having low concentrations (measured in ppb) of a fluorescent taggant. The detection/quantification generates a predicted concentration of the fluorescent tagging compound using a process selected from the group of a multivariate process, a background subtraction process, or a combination of both. The invention addresses the detection of an adulteration of gasoline and diesel fuels.1. A method for determining whether a liquid sample comprises a particular fluorescent tagging compound at a preset concentration, wherein the method comprises:
(a) obtaining a measured emission spectrum from the liquid sample, wherein the liquid sample is exposed to a light source that causes the particular fluorescent tagging compound to fluoresce over a spectral range; (b) generating a predicted concentration of the particular fluorescent tagging compound in the liquid sample, wherein the generating comprises a process selected from the group consisting of
(i) a multivariate process comprising:
(1) selecting a library that comprises a plurality of known emission spectra, wherein each of the plurality of known emission spectra is correlated to a known concentration of the particular fluorescent tagging compound, and
(2) utilizing the library and the measured emission spectrum to generate the predicted concentration of the particular fluorescent tagging compound in the liquid sample,
(ii) a background subtraction process comprising:
(1) determining a background emission spectrum from the measured emission spectrum,
(2) eliminating the background emission spectrum from the measured emission spectrum to obtain a predicted emission spectrum, and
(3) evaluating the predicted emission spectrum to generate the predicted concentration of the particular fluorescent tagging compound in the liquid sample, and
(iii) a combination of (i) and (ii); and
(c) comparing the predicted concentration of the particular fluorescent tagging compound in the liquid sample with the preset concentration of the particular fluorescent tagging compound in the liquid sample. 2. The method of claim 1, wherein
(a) the liquid sample is determined to comprise the particular fluorescent tagging compound at the preset concentration when the predicted concentration is within a present range of the particular fluorescent tagging compound in the liquid sample, and (b) the liquid sample is determined not to comprise the particular fluorescent tagging compound at the preset concentration when the predicted concentration is outside the present range of the particular fluorescent tagging compound in the liquid sample. 3. The method of claim 1 further comprising authenticating the liquid sample, wherein
(i) the liquid sample is determined to be authentic when the predicted concentration is within a preset percentage of the preset concentration of the particular fluorescent tagging compound in the liquid sample; and
(ii) the liquid sample is determined to not be authentic when the predicted concentration is outside the preset percentage of the preset concentration of the particular fluorescent tagging compound in the liquid sample. 4-7. (canceled) 8. The method of claim 1, wherein the particular fluorescent tagging compound is a first particular fluorescent tagging agent. 9. The method of claim 1, wherein
(a) the particular fluorescent tagging compound is a combination of (i) a first particular fluorescent tagging agent, and (ii) a second particular tagging agent; (b) the preset concentration is (i) a first preset concentration of the first particular fluorescent tagging agent, and (ii) a second preset concentration of the second particular fluorescent tagging agent; (c) the predicted concentration of the particular fluorescent tagging compound in the liquid sample comprises (i) a first predicted concentration of the first particular fluorescent tagging agent, and (ii) a second predicted concentration of the second particular fluorescent agent; and (d) the present range of the particular fluorescent tagging compound in the liquid sample comprises (i) a first present range of the first particular fluorescent tagging agent, and (ii) a second present range of the first particular fluorescent tagging agent. 10. The method of claim 1, wherein
(a) the particular fluorescent tagging compound is a combination of three or more particular fluorescent tagging agents; (b) the preset concentration is a preset concentration for each of the three or more particular fluorescent tagging agents; (c) the predicted concentration of the particular fluorescent tagging compound in the liquid sample comprises a predicted concentration for each of the three or more particular fluorescent tagging agents; and (d) the present range of the particular fluorescent tagging compound in the liquid sample comprises a present range for each of the three or more particular fluorescent tagging agents. 11-12. (canceled) 13. The method of claim 1, wherein the particular fluorescent tagging compound comprises a first particular fluorescent tagging agent having an emission fluorescence in a range of from about 500 nm to about 900 nm. 14. The method of claim 13, wherein
(a) the particular fluorescent tagging compound comprises a second particular fluorescent tagging agent; (b) the second particular fluorescent tagging agent has an emission fluorescence in a range of from about 500 nm to about 900 nm; and (c) the first particular fluorescent tagging agent and the second particular fluorescent tagging agent have different emission fluorescence in a range of from about 500 nm to about 900 nm. 15. The method of claim 14, wherein
(a) the particular fluorescent tagging compound comprises a third particular fluorescent tagging agent; (b) the third particular fluorescent tagging agent has an emission fluorescence in a range of from about 500 nm to about 900 nm; (c) the first particular fluorescent tagging agent, the second particular fluorescent tagging agent, and the third particular fluorescent tagging agent have different emission fluorescence in a range of from about 500 nm to about 900 nm. 16. (canceled) 17. The method of claim 1, wherein the spectral range comprises a range of from 500 nm to 900 nm. 18. The method of claim 1, wherein the liquid is selected from the group consisting of liquid petroleum hydrocarbon-based fuels, biologically-derived fuels (biofuels), and common industrial solvents. 19. The method of claim 1, wherein
(a) the liquid sample comprises a known type of liquid; and (b) the utilizing the library comprises utilizing only the measured emission spectrum measured from the known type of liquid in the library. 20. The method of claim 1, wherein
(a) the liquid sample is from a known geographical region; and (b) the utilizing the library comprises utilizing only the measured emission spectrum measured from that known geographical region. 21. The method of claim 1, wherein utilizing the library and the measured emission spectrum to generate the predicted concentration of the particular fluorescent tagging compound in the liquid sample comprises performing a multivariate analysis utilizing the library and the measured emission spectrum. 22. (canceled) 23. The method of claim 21, wherein the multivariate analysis comprises a partial least squares analysis. 24. The method of claim 23, wherein the multivariate analysis comprises a principal components regression analysis. 25. The method of claim 24, wherein the multivariate analysis yields a calibration model that comprises a plurality of spectral vectors correlation scores relating to concentration of the particular fluorescent tagging compound. 26. The method of claim 25, wherein the utilizing the library and the measured emission spectrum to generate the predicted concentration of the particular fluorescent tagging compound in the liquid sample further comprises using the calibration model to calculate the predicted concentration of the particular fluorescent tagging compound in the liquid sample. 27. The method of claim 1, wherein the determining the background emission spectrum comprises obtaining at least three data points from the measured emission spectrum and using these three data points to calculate the background emission spectrum. 28. The method of claim 27, wherein the calculating the background emission spectrum comprises fitting the three data points into a quadratic curve. 29. The method of claim 27, wherein the calculating the background emission spectrum comprises fitting the three data points into an exponential curve. 30. The method of claim 29, wherein the calculating the background emission spectrum comprises fitting the three data points into a linear combination of an exponential curve and a quadratic curve. 31. The method of claim 1, wherein the eliminating the background spectrum from the measured emission spectrum comprises subtracting the background spectrum from the measured emission spectrum. 32. The method of claim 1, wherein the evaluating the predicted emission spectrum to determine a predicted concentration of the particular fluorescent tagging compound in the liquid sample comprises calculating the area under the predicted emission spectrum. 33. The method of claim 1, wherein the evaluating the predicted emission spectrum to determine a predicted concentration of the particular fluorescent tagging compound in the liquid sample comprises evaluating at least one peak of the predicted emission spectrum. 34-63. (canceled) | 2,800 |
11,293 | 11,293 | 15,204,035 | 2,883 | An optical fiber trunk cable breakout canister includes a main canister body, the main canister body extending between a first end opening and a second end opening and including a first end portion defining the first end opening and a second end portion defining the second end opening. The first end opening has a maximum width that is less than a maximum width of the second end opening. The breakout canister further includes a plate disposed within the second end portion. The breakout canister further includes a potting material disposed within the second end portion. The breakout canister further includes a retainer washer disposed within the main canister body. | 1. An optical fiber trunk cable breakout canister, comprising:
a main canister body, the main canister body extending between a first end opening and a second end opening and comprising a first end portion defining the first end opening and a second end portion defining the second end opening, the first end opening having a maximum width that is less than a maximum width of the second end opening; a plate disposed within the second end portion; a potting material disposed within the second end portion; and a retainer washer disposed within the main canister body. 2. The breakout canister of claim 1, wherein the main canister body further comprises an intermediate portion disposed between the first end portion and the second end portion, wherein a first intermediate opening is defined between the first end portion and the intermediate portion, and wherein the retainer washer has a maximum outer width greater than a maximum width of the first intermediate opening. 3. The breakout canister of claim 1, further comprising a plurality of nozzles extending from the plate within the second end portion, wherein the potting material surrounds each of the plurality of nozzles. 4. The breakout canister of claim 1, wherein the retainer washer is an internal tooth lock washer. 5. The breakout canister of claim 1, wherein the retainer washer is a first retainer washer, and further comprising a second retainer washer disposed within the main canister body. 6. The breakout canister of claim 5, wherein the second retainer washer is disposed within the second end portion. 7. The breakout canister of claim 5, wherein the second retainer washer is a plurality of second retainer washers. 8. The breakout canister of claim 5, wherein a maximum outer width of the second retainer washer is less than a maximum outer width of the first retainer washer. 9. The breakout canister of claim 1, wherein the main canister body further comprises an intermediate portion disposed between the first end portion and the second end portion, the intermediate portion having a conical shape. 10. The breakout canister of claim 9, wherein the retainer washer is disposed within the intermediate portion. 11. The breakout canister of claim 1, wherein the second end portion includes an internal stop, the stop disposed at a predetermined distance from the second end opening, and wherein the plate engages the stop. 12. The breakout canister of claim 11, further comprising a plurality of nozzles extending from the plate within the second end portion, and wherein a height of each of the plurality of nozzles is less than the predetermined distance. 13. The breakout canister of claim 11, wherein a cushioning element is disposed between the plate and the stop. 14. The breakout canister of claim 1, wherein the second end portion defines an internal groove, and further comprising a retainer member received partially within the groove. 15. The breakout canister of claim 14, wherein the retainer member is a retainer key. 16. The breakout canister of claim 1, wherein the first end portion includes an internal stop. 17. The breakout canister of claim 1, further comprising a second potting material disposed within first end portion. 18. An optical fiber trunk cable breakout assembly, comprising:
a trunk cable, the trunk cable comprising an outer jacket and a plurality of subunits extending from the outer jacket; and a breakout canister, comprising:
a main canister body, the main canister body extending between a first end opening and a second end opening and comprising a first end portion defining the first end opening and a second end portion defining the second end opening, the first end opening having a maximum width that is less than a maximum width of the second end opening, wherein the jacket extends through the first end opening and each of the plurality of subunits extends through the second end opening;
a plate disposed within the second end portion, wherein each of the plurality of subunits extends through the plate;
a potting material disposed within the second end portion, the potting material surrounding a portion of each of the plurality of subunits; and
a retainer washer disposed within the main canister body, the retainer washer surrounding and engaging the jacket. 19. The breakout assembly of claim 18, wherein the main canister body further comprises an intermediate portion disposed between the first end portion and the second end portion, wherein a first intermediate opening is defined between the first end portion and the intermediate portion, and wherein the retainer washer has a maximum outer width greater than a maximum width of the first intermediate opening. 20. The breakout assembly of claim 18, further comprising a plurality of nozzles extending from the plate within the second end portion, wherein each of the plurality of subunits extends through one of the plurality of nozzles and the potting material surrounds each of the plurality of nozzles. 21. The breakout assembly of claim 18, wherein the retainer washer is an internal tooth lock washer. 22. The breakout assembly of claim 18, wherein the retainer washer is a first retainer washer, and further comprising a second retainer washer disposed within main canister body, the second retainer washer surrounding and engaging one of the plurality of subunits. | An optical fiber trunk cable breakout canister includes a main canister body, the main canister body extending between a first end opening and a second end opening and including a first end portion defining the first end opening and a second end portion defining the second end opening. The first end opening has a maximum width that is less than a maximum width of the second end opening. The breakout canister further includes a plate disposed within the second end portion. The breakout canister further includes a potting material disposed within the second end portion. The breakout canister further includes a retainer washer disposed within the main canister body.1. An optical fiber trunk cable breakout canister, comprising:
a main canister body, the main canister body extending between a first end opening and a second end opening and comprising a first end portion defining the first end opening and a second end portion defining the second end opening, the first end opening having a maximum width that is less than a maximum width of the second end opening; a plate disposed within the second end portion; a potting material disposed within the second end portion; and a retainer washer disposed within the main canister body. 2. The breakout canister of claim 1, wherein the main canister body further comprises an intermediate portion disposed between the first end portion and the second end portion, wherein a first intermediate opening is defined between the first end portion and the intermediate portion, and wherein the retainer washer has a maximum outer width greater than a maximum width of the first intermediate opening. 3. The breakout canister of claim 1, further comprising a plurality of nozzles extending from the plate within the second end portion, wherein the potting material surrounds each of the plurality of nozzles. 4. The breakout canister of claim 1, wherein the retainer washer is an internal tooth lock washer. 5. The breakout canister of claim 1, wherein the retainer washer is a first retainer washer, and further comprising a second retainer washer disposed within the main canister body. 6. The breakout canister of claim 5, wherein the second retainer washer is disposed within the second end portion. 7. The breakout canister of claim 5, wherein the second retainer washer is a plurality of second retainer washers. 8. The breakout canister of claim 5, wherein a maximum outer width of the second retainer washer is less than a maximum outer width of the first retainer washer. 9. The breakout canister of claim 1, wherein the main canister body further comprises an intermediate portion disposed between the first end portion and the second end portion, the intermediate portion having a conical shape. 10. The breakout canister of claim 9, wherein the retainer washer is disposed within the intermediate portion. 11. The breakout canister of claim 1, wherein the second end portion includes an internal stop, the stop disposed at a predetermined distance from the second end opening, and wherein the plate engages the stop. 12. The breakout canister of claim 11, further comprising a plurality of nozzles extending from the plate within the second end portion, and wherein a height of each of the plurality of nozzles is less than the predetermined distance. 13. The breakout canister of claim 11, wherein a cushioning element is disposed between the plate and the stop. 14. The breakout canister of claim 1, wherein the second end portion defines an internal groove, and further comprising a retainer member received partially within the groove. 15. The breakout canister of claim 14, wherein the retainer member is a retainer key. 16. The breakout canister of claim 1, wherein the first end portion includes an internal stop. 17. The breakout canister of claim 1, further comprising a second potting material disposed within first end portion. 18. An optical fiber trunk cable breakout assembly, comprising:
a trunk cable, the trunk cable comprising an outer jacket and a plurality of subunits extending from the outer jacket; and a breakout canister, comprising:
a main canister body, the main canister body extending between a first end opening and a second end opening and comprising a first end portion defining the first end opening and a second end portion defining the second end opening, the first end opening having a maximum width that is less than a maximum width of the second end opening, wherein the jacket extends through the first end opening and each of the plurality of subunits extends through the second end opening;
a plate disposed within the second end portion, wherein each of the plurality of subunits extends through the plate;
a potting material disposed within the second end portion, the potting material surrounding a portion of each of the plurality of subunits; and
a retainer washer disposed within the main canister body, the retainer washer surrounding and engaging the jacket. 19. The breakout assembly of claim 18, wherein the main canister body further comprises an intermediate portion disposed between the first end portion and the second end portion, wherein a first intermediate opening is defined between the first end portion and the intermediate portion, and wherein the retainer washer has a maximum outer width greater than a maximum width of the first intermediate opening. 20. The breakout assembly of claim 18, further comprising a plurality of nozzles extending from the plate within the second end portion, wherein each of the plurality of subunits extends through one of the plurality of nozzles and the potting material surrounds each of the plurality of nozzles. 21. The breakout assembly of claim 18, wherein the retainer washer is an internal tooth lock washer. 22. The breakout assembly of claim 18, wherein the retainer washer is a first retainer washer, and further comprising a second retainer washer disposed within main canister body, the second retainer washer surrounding and engaging one of the plurality of subunits. | 2,800 |
11,294 | 11,294 | 14,534,311 | 2,845 | Devices, methods and production devices that relate to the forming of a coil on a semiconductor substrate are provided. Arranged within the coil is a metal filling, for example with a density of less than 20%. | 1. A device, comprising:
a semiconductor substrate, a coil formed on the semiconductor substrate, and a metal filling within the coil, the coil being a radio-frequency coil of at least one of a radio-frequency transmitting, receiving or transceiver device. 2. The device according to claim 1, the at least one metal filling comprising a plurality of metal layers, a density in each of the plurality of metal layers being less than 20%. 3. The device according to claim 1, wherein a density of the metal filling is below 20%. 4. The device according to claim 2, metallized regions of one of the plurality of metal layers being arranged offset in relation to metallized regions of the others of the plurality of metal layers. 5. The device according to claim 2, wherein the density is between 10% and 15%. 6. The device according to claim 3, wherein the density is between 10% and 15%. 7. The device according to claim 1, the metal filling in at least one metal layer comprising a pattern of metallized regions. 8. The device according to claim 7, each metallized region of the pattern having a size of between 0.5 μm·0.5 μm and 5 μm·5 μm. 9. The device according to claim 7, each metallized region of the pattern having an area of between 100% and 200% of a minimally possible size for a semiconductor process used for the manufacturing of the respective metal layer. 10. The device according to claim 7, a size of the metallized regions of the pattern being between 0.2 μm2 and 10 μm2. 11. The device according to claim 1, the metal filling in at least one metal layer having a density of less than 20%. 12. The device according to claim 1, the coil being formed on a substrate coupled with a communication circuit. 13. A method, comprising:
forming a coil on a semiconductor substrate, the coil being a radio-frequency coil of at least one of a radio-frequency transmitting, receiving or transceiver device, forming a metal filling within the coil. 14. The method according to claim 13, wherein forming the at least one metal filling comprises forming a plurality of metal layers, a density in each of the plurality of metal layers being less than 20%. 15. The method according to claim 13, wherein a density of the metal filling is below 20%. 16. The method according to claim 14, further comprising forming metallized regions of one of the plurality of metal layers offset in relation to metallized regions of the others of the plurality of metal layers. 17. The method according to claim 14, wherein the density is between 10% and 15%. 18. The method according to claim 13, wherein forming the metal filling in at least one metal layer comprises forming a pattern of metallized regions, a size of the metallized regions of the pattern being between 0.2 μm2 and 10 μm2. 19. An apparatus, comprising:
a metal depositing device, the metal depositing device being configured to form a coil and a metal filling within the coil on a semiconductor substrate, the coil being a coil of at least one of a radio-frequency transmitting, receiving or transceiver device. 20. The apparatus according to claim 19, the at least one metal filling comprising a plurality of metal layers, a density in each of the plurality of metal layers being less than 20%. | Devices, methods and production devices that relate to the forming of a coil on a semiconductor substrate are provided. Arranged within the coil is a metal filling, for example with a density of less than 20%.1. A device, comprising:
a semiconductor substrate, a coil formed on the semiconductor substrate, and a metal filling within the coil, the coil being a radio-frequency coil of at least one of a radio-frequency transmitting, receiving or transceiver device. 2. The device according to claim 1, the at least one metal filling comprising a plurality of metal layers, a density in each of the plurality of metal layers being less than 20%. 3. The device according to claim 1, wherein a density of the metal filling is below 20%. 4. The device according to claim 2, metallized regions of one of the plurality of metal layers being arranged offset in relation to metallized regions of the others of the plurality of metal layers. 5. The device according to claim 2, wherein the density is between 10% and 15%. 6. The device according to claim 3, wherein the density is between 10% and 15%. 7. The device according to claim 1, the metal filling in at least one metal layer comprising a pattern of metallized regions. 8. The device according to claim 7, each metallized region of the pattern having a size of between 0.5 μm·0.5 μm and 5 μm·5 μm. 9. The device according to claim 7, each metallized region of the pattern having an area of between 100% and 200% of a minimally possible size for a semiconductor process used for the manufacturing of the respective metal layer. 10. The device according to claim 7, a size of the metallized regions of the pattern being between 0.2 μm2 and 10 μm2. 11. The device according to claim 1, the metal filling in at least one metal layer having a density of less than 20%. 12. The device according to claim 1, the coil being formed on a substrate coupled with a communication circuit. 13. A method, comprising:
forming a coil on a semiconductor substrate, the coil being a radio-frequency coil of at least one of a radio-frequency transmitting, receiving or transceiver device, forming a metal filling within the coil. 14. The method according to claim 13, wherein forming the at least one metal filling comprises forming a plurality of metal layers, a density in each of the plurality of metal layers being less than 20%. 15. The method according to claim 13, wherein a density of the metal filling is below 20%. 16. The method according to claim 14, further comprising forming metallized regions of one of the plurality of metal layers offset in relation to metallized regions of the others of the plurality of metal layers. 17. The method according to claim 14, wherein the density is between 10% and 15%. 18. The method according to claim 13, wherein forming the metal filling in at least one metal layer comprises forming a pattern of metallized regions, a size of the metallized regions of the pattern being between 0.2 μm2 and 10 μm2. 19. An apparatus, comprising:
a metal depositing device, the metal depositing device being configured to form a coil and a metal filling within the coil on a semiconductor substrate, the coil being a coil of at least one of a radio-frequency transmitting, receiving or transceiver device. 20. The apparatus according to claim 19, the at least one metal filling comprising a plurality of metal layers, a density in each of the plurality of metal layers being less than 20%. | 2,800 |
11,295 | 11,295 | 14,759,519 | 2,825 | Downhole ranging from multiple wellbores. In one example, multiple transmitters and multiple receivers are disposed in multiple wellbores to exchange electromagnetic signals. By implementing a full compensation technique, a computer system determines multiple compensated signals. A compensated signal is determined from a signal received from a first wellbore and a second signal received from a second wellbore. In another example, a first transmitter is disposed in a first wellbore, a first receiver is disposed in a second wellbore, and either a second transmitter or a second receiver is disposed in either the first wellbore or the second wellbore. By implementing partial compensation techniques, a computer system determines compensated signals. Using the compensated signals, the computer system determines a position of a first wellbore relative to a second wellbore, and provides the position. | 1. A system for ranging in wellbores, the system comprising:
a plurality of transmitters disposed in a plurality of wellbores, each transmitter to transmit electromagnetic signals; a plurality of receivers disposed in the plurality of wellbores, each receiver to receive the electromagnetic signals transmitted by the plurality of transmitters; and a processor connected to the plurality of transmitters and the plurality of receivers, the processor configured to:
receive a plurality of signals from the plurality of receivers as sent by the plurality of transmitters,
from the received plurality of signals, determine a plurality of compensated signals, at least one compensated signal determined from a first signal received from a first wellbore of the plurality of wellbores and a second signal received from a second wellbore of the plurality of wellbores,
process the plurality of compensated signals to determine a position of the first wellbore of the plurality of wellbores relative to the second wellbore of the plurality of wellbores, and
provide the position of the first wellbore relative to the second wellbore. 2. The system of claim 1, wherein the first wellbore is a pre-existing production wellbore, and wherein either the plurality of receivers or the plurality of transmitters or a combination of at least one receiver and at least one transmitter are disposed in the production wellbore. 3. The system of claim 2, wherein either the plurality of receivers or the plurality of transmitters or a combination of at least one receiver and at least one transmitter are spaced apart and affixed to one or more portions of casings disposed within the production wellbore. 4. The system of claim 1, wherein the second wellbore is a steam-assisted gravity drainage (SAGD) wellbore being drilled, and wherein either the plurality of receivers or the plurality of transmitters or a combination of at least one receiver and at least one transmitter are disposed in the SAGD wellbore. 5. The system of claim 4, further comprising a measurement while drilling (MWD) tool disposed in the SAGD wellbore, wherein either the plurality of receivers or the plurality of transmitters or a combination of at least one receiver and at least one transmitter are affixed to the MWD tool. 6. The system of claim 4, wherein either the plurality of receivers or the plurality of transmitters or a combination of at least one receiver and at least one transmitter are spaced apart by a distance ranging between 2 feet and 50 feet. 7. The system of claim 1, wherein the first wellbore and the second wellbore are either substantially parallel to each other or substantially perpendicular to each other. 8. The system of claim 1, wherein the plurality of transmitters includes a first transmitter and the plurality of receivers includes a first receiver and a second receiver, and wherein the first transmitter, the first receiver and the second receiver are disposed in the plurality of wellbores such that an angle formed by a first line connecting the first receiver and the first transmitter and a second line connecting the second receiver and the first transmitter satisfies a threshold angle. 9. The system of claim 8, wherein the threshold angle is at least 5 degrees. 10. The system of claim 1, wherein the processor is further configured to measure a value of each of the plurality of signals as a complex voltage. 11. The system of claim 1, wherein the processor is further configured to:
receive the plurality of signals from a first plurality of locations of the plurality of transmitters and the plurality of receivers in the plurality of wellbores; and receive another plurality of signals from a second plurality of locations to which the plurality of transmitters and the plurality of receivers are moved in the plurality of wellbores. 12. The system of claim 1, further comprising a computer-readable storage medium to store the plurality of signals and the plurality of compensated signals. 13. The system of claim 1, wherein, to determine the plurality of compensated signals, the processor is configured, at a first time instant, to:
determine a first product of a value of a first signal transmitted by a first transmitter and received by a first receiver, and a value of a second signal transmitted by a second transmitter and received by a second receiver; determine a second product of a value of a third signal transmitted by the first transmitter and received by the second receiver, and a value of a fourth signal transmitted by the second transmitter and received by the first receiver; and divide the first product by the second product resulting in a first compensated signal. 14. The system of claim 13, wherein the processor is further configured, at a second time instant, to:
determine a third product of a value of a fifth signal transmitted by the first transmitter and received by the first receiver, and a value of a sixth signal transmitted by the second transmitter and received by the second receiver; determine a fourth product of a value of a seventh signal transmitted by the first transmitter and received by the second receiver, and a value of an eighth signal transmitted by the second transmitter and received by the first receiver; and divide the third product by the fourth product resulting in a second compensated signal. 15. The system of claim 14, wherein the processor is further configured to:
record the first compensated signal and the second compensated signal as a first function of time and a second function of time, respectively; and obtain a time-lapse measurement between the first instant and the second instant. 16. The system of claim 15, wherein, to obtain the time-lapse measurement between the first instant and the second instant, the processor is configured to:
apply a logarithmic function to the first function of time; apply a logarithmic function to the second function of time; and determine a difference between the logarithmic function applied to the first function of time and the logarithmic function applied to the second function of time. 17. The system of claim 14, wherein the plurality of transmitters and the plurality of receivers are stationary during the first time instant and the second time instant. 18. The system of claim 14, wherein either the plurality of transmitters or the plurality of receivers is mobile during either the first time instant or the second time instant. 19. The system of claim 1, wherein the processor is further configured to implement preprocessing techniques on the plurality of signals before determining the plurality of compensated signals. 20. A system for ranging in at least two wellbores, the system comprising:
a first transmitter disposed in a first wellbore to transmit electromagnetic signals; a first receiver disposed in a second wellbore to receive the electromagnetic signals transmitted by the first transmitter; either a second transmitter or a second receiver disposed in either the first wellbore or the second wellbore to communicate electromagnetic signals with the first transmitter or the first receiver; and a processor connected to the first transmitter, the first receiver, and either the second transmitter or the second receiver, the processor configured to:
receive a plurality of signals communicated by the first transmitter, the first receiver, and either the second transmitter or the second receiver, wherein the plurality of signals includes a signal that corresponds to an electromagnetic signal received by the first receiver from the first transmitter;
implement compensation techniques on the plurality of signals resulting in a plurality of compensated signals;
process the plurality of compensated signals to determine a position of a first wellbore of the at least two wellbores relative to a second wellbore of the at least two wellbores; and
provide the position of the first wellbore relative to the second wellbore. 21. The system of claim 20, comprising the second transmitter disposed in the first wellbore to transmit electromagnetic signals, wherein the first receiver is disposed in the second wellbore to receive the electromagnetic signals transmitted by the second transmitter, and wherein the processor is further configured to receive a signal that corresponds to an electromagnetic signal received by the first receiver from the second transmitter. 22. The system of claim 21, wherein the processor is further configured, at a first time instant, to divide a value of a first signal transmitted by the first transmitter and received by the first receiver by a value of a second signal transmitted by the second transmitter and received by the first receiver resulting in a first compensated signal. 23. The system of claim 22, wherein the processor is further configured, at a second time instant, to divide a value of a third signal transmitted by the first transmitter and received by the first receiver by a value of a fourth signal transmitted by the second transmitter and received by the first receiver resulting in a second compensated signal. 24. The system of claim 23, wherein the processor is further configured to:
record the first compensated signal and the second compensated signal as a first function of time and a second function of time, respectively; and obtain a time-lapse measurement between the first instant and the second instant. 25. The system of claim 24, wherein, to obtain the time-lapse measurement, the processor is configured to:
apply a logarithmic function to the first function of time; apply a logarithmic function to the second function of time; and determine a difference between the logarithmic function applied to the first function of time and the logarithmic function applied to the second function of time. 26. The system of claim 20, comprising the second receiver disposed in the second wellbore to receive the electromagnetic signals transmitted by the first transmitter, and wherein the processor is further configured to receive a signal that corresponds to an electromagnetic signal received by the second receiver from the first transmitter. 27. The system of claim 22, wherein the processor is further configured to divide a value of a third signal transmitted by the first transmitter and received by the first receiver by a value of a fourth signal transmitted by the first transmitter and received by the second receiver resulting in a second compensated signal. 28. The system of claim 26, wherein the first wellbore is a steam-assisted gravity drainage (SAGD) wellbore being drilled, and wherein either the first receiver or the first transmitter or the second receiver or the second transmitter is disposed in the SAGD wellbore. 29. The system of claim 28, wherein the second wellbore is a pre-existing production wellbore, and wherein either the first receiver or the first transmitter or the second receiver or the second transmitter is disposed in the pre-existing production wellbore. 30. The system of claim 26, further comprising a measurement while drilling (MWD) tool in the SAGD wellbore, wherein a combination including at least two of the first receiver, the first transmitter, the second receiver, or the second transmitter are affixed to and spaced apart on the MWD tool. 31. The system of claim 26, wherein the processor is further configured to measure a value of each of the plurality of signals as a complex voltage. 32. The system of claim 26, wherein the processor is configured to:
receive the plurality of signals received by the first receiver and the second receiver disposed at a first location and a second location, respectively, within the second wellbore from the first transmitter disposed at a third location within the first wellbore; and receive another plurality of signals received by the first receiver and the second receiver moved to a fourth location and a fifth location, respectively, within the second wellbore from the first transmitter disposed at the third location. 33. The system of claim 20, further comprising a computer-readable storage medium to store the plurality of signals and the compensated plurality of signals. 34. A computer-readable medium storing instructions executable by a processor to perform operations for ranging in wellbores, the operations comprising:
receiving a plurality of signals from a plurality of transmitters disposed in a plurality of wellbores to transmit electromagnetic signals and a plurality of receivers disposed in the plurality of wellbores to receive the electromagnetic signals transmitted by the plurality of transmitters, wherein each signal of the plurality of signals is received by each transmitter from each receiver, from the received plurality of signals, determining a plurality of compensated signals, at least one compensated signal determined from a first signal received from a first wellbore of the plurality of wellbores and a second signal received from a second wellbore of the plurality of wellbores, processing the plurality of compensated signals to determine a position of a first wellbore of the plurality of wellbores relative to a second wellbore of the plurality of wellbores, and providing the position of the first wellbore relative to the second wellbore. 35. A method for ranging in wellbores, the method comprising:
receiving, by a processor, a plurality of signals from a plurality of transmitters disposed in a plurality of wellbores to transmit electromagnetic signals and a plurality of receivers disposed in the plurality of wellbores to receive the electromagnetic signals transmitted by the plurality of transmitters, wherein each signal of the plurality of signals is received by each transmitter from each receiver, from the received plurality of signals, determining, by the processor, a plurality of compensated signals, at least one compensated signal determined from a first signal received from a first wellbore of the plurality of wellbores and a second signal received from a second wellbore of the plurality of wellbores, processing, by the processor, the plurality of compensated signals to determine a position of a first wellbore of the plurality of wellbores relative to a second wellbore of the plurality of wellbores, and providing, by the processor, the position of the first wellbore relative to the second wellbore. 36. A computer-readable medium storing instructions executable by a processor to perform operations for ranging in wellbores, the operations comprising:
receiving a plurality of signals communicated between a first transmitter disposed in a first wellbore to transmit electromagnetic signals, a first receiver disposed in a second wellbore to receive the electromagnetic signals transmitted by the first transmitter, and either a second transmitter or a second receiver disposed in either the first wellbore or the second wellbore to communicate electromagnetic signals with the first transmitter or the first receiver, wherein the plurality of signals includes a signal that corresponds to an electromagnetic signal received by the first receiver from the first transmitter; implementing compensation techniques on the plurality of signals resulting in a compensated plurality of signals; processing the compensated plurality of signals to determine a position of a first wellbore of the plurality of wellbores relative to a second wellbore of the plurality of wellbores; and providing the position of the first wellbore relative to the second wellbore. 37. A method for ranging in at least two wellbores, the method comprising:
receiving, by a processor, a plurality of signals communicated between a first transmitter disposed in a first wellbore to transmit electromagnetic signals, a first receiver disposed in a second wellbore to receive the electromagnetic signals transmitted by the first transmitter, and either a second transmitter or a second receiver disposed in either the first wellbore or the second wellbore to communicate electromagnetic signals with the first transmitter and the first receiver, wherein the plurality of signals includes a signal that corresponds to an electromagnetic signal received by the first receiver from the first transmitter; implementing, by the processor, compensation techniques on the plurality of signals resulting in a compensated plurality of signals; processing, by the processor, the compensated signals to determine a position of a first wellbore of the at least two wellbores relative to a second wellbore of the at least two wellbores; and providing, by the processor, the position of the first wellbore relative to the second wellbore. | Downhole ranging from multiple wellbores. In one example, multiple transmitters and multiple receivers are disposed in multiple wellbores to exchange electromagnetic signals. By implementing a full compensation technique, a computer system determines multiple compensated signals. A compensated signal is determined from a signal received from a first wellbore and a second signal received from a second wellbore. In another example, a first transmitter is disposed in a first wellbore, a first receiver is disposed in a second wellbore, and either a second transmitter or a second receiver is disposed in either the first wellbore or the second wellbore. By implementing partial compensation techniques, a computer system determines compensated signals. Using the compensated signals, the computer system determines a position of a first wellbore relative to a second wellbore, and provides the position.1. A system for ranging in wellbores, the system comprising:
a plurality of transmitters disposed in a plurality of wellbores, each transmitter to transmit electromagnetic signals; a plurality of receivers disposed in the plurality of wellbores, each receiver to receive the electromagnetic signals transmitted by the plurality of transmitters; and a processor connected to the plurality of transmitters and the plurality of receivers, the processor configured to:
receive a plurality of signals from the plurality of receivers as sent by the plurality of transmitters,
from the received plurality of signals, determine a plurality of compensated signals, at least one compensated signal determined from a first signal received from a first wellbore of the plurality of wellbores and a second signal received from a second wellbore of the plurality of wellbores,
process the plurality of compensated signals to determine a position of the first wellbore of the plurality of wellbores relative to the second wellbore of the plurality of wellbores, and
provide the position of the first wellbore relative to the second wellbore. 2. The system of claim 1, wherein the first wellbore is a pre-existing production wellbore, and wherein either the plurality of receivers or the plurality of transmitters or a combination of at least one receiver and at least one transmitter are disposed in the production wellbore. 3. The system of claim 2, wherein either the plurality of receivers or the plurality of transmitters or a combination of at least one receiver and at least one transmitter are spaced apart and affixed to one or more portions of casings disposed within the production wellbore. 4. The system of claim 1, wherein the second wellbore is a steam-assisted gravity drainage (SAGD) wellbore being drilled, and wherein either the plurality of receivers or the plurality of transmitters or a combination of at least one receiver and at least one transmitter are disposed in the SAGD wellbore. 5. The system of claim 4, further comprising a measurement while drilling (MWD) tool disposed in the SAGD wellbore, wherein either the plurality of receivers or the plurality of transmitters or a combination of at least one receiver and at least one transmitter are affixed to the MWD tool. 6. The system of claim 4, wherein either the plurality of receivers or the plurality of transmitters or a combination of at least one receiver and at least one transmitter are spaced apart by a distance ranging between 2 feet and 50 feet. 7. The system of claim 1, wherein the first wellbore and the second wellbore are either substantially parallel to each other or substantially perpendicular to each other. 8. The system of claim 1, wherein the plurality of transmitters includes a first transmitter and the plurality of receivers includes a first receiver and a second receiver, and wherein the first transmitter, the first receiver and the second receiver are disposed in the plurality of wellbores such that an angle formed by a first line connecting the first receiver and the first transmitter and a second line connecting the second receiver and the first transmitter satisfies a threshold angle. 9. The system of claim 8, wherein the threshold angle is at least 5 degrees. 10. The system of claim 1, wherein the processor is further configured to measure a value of each of the plurality of signals as a complex voltage. 11. The system of claim 1, wherein the processor is further configured to:
receive the plurality of signals from a first plurality of locations of the plurality of transmitters and the plurality of receivers in the plurality of wellbores; and receive another plurality of signals from a second plurality of locations to which the plurality of transmitters and the plurality of receivers are moved in the plurality of wellbores. 12. The system of claim 1, further comprising a computer-readable storage medium to store the plurality of signals and the plurality of compensated signals. 13. The system of claim 1, wherein, to determine the plurality of compensated signals, the processor is configured, at a first time instant, to:
determine a first product of a value of a first signal transmitted by a first transmitter and received by a first receiver, and a value of a second signal transmitted by a second transmitter and received by a second receiver; determine a second product of a value of a third signal transmitted by the first transmitter and received by the second receiver, and a value of a fourth signal transmitted by the second transmitter and received by the first receiver; and divide the first product by the second product resulting in a first compensated signal. 14. The system of claim 13, wherein the processor is further configured, at a second time instant, to:
determine a third product of a value of a fifth signal transmitted by the first transmitter and received by the first receiver, and a value of a sixth signal transmitted by the second transmitter and received by the second receiver; determine a fourth product of a value of a seventh signal transmitted by the first transmitter and received by the second receiver, and a value of an eighth signal transmitted by the second transmitter and received by the first receiver; and divide the third product by the fourth product resulting in a second compensated signal. 15. The system of claim 14, wherein the processor is further configured to:
record the first compensated signal and the second compensated signal as a first function of time and a second function of time, respectively; and obtain a time-lapse measurement between the first instant and the second instant. 16. The system of claim 15, wherein, to obtain the time-lapse measurement between the first instant and the second instant, the processor is configured to:
apply a logarithmic function to the first function of time; apply a logarithmic function to the second function of time; and determine a difference between the logarithmic function applied to the first function of time and the logarithmic function applied to the second function of time. 17. The system of claim 14, wherein the plurality of transmitters and the plurality of receivers are stationary during the first time instant and the second time instant. 18. The system of claim 14, wherein either the plurality of transmitters or the plurality of receivers is mobile during either the first time instant or the second time instant. 19. The system of claim 1, wherein the processor is further configured to implement preprocessing techniques on the plurality of signals before determining the plurality of compensated signals. 20. A system for ranging in at least two wellbores, the system comprising:
a first transmitter disposed in a first wellbore to transmit electromagnetic signals; a first receiver disposed in a second wellbore to receive the electromagnetic signals transmitted by the first transmitter; either a second transmitter or a second receiver disposed in either the first wellbore or the second wellbore to communicate electromagnetic signals with the first transmitter or the first receiver; and a processor connected to the first transmitter, the first receiver, and either the second transmitter or the second receiver, the processor configured to:
receive a plurality of signals communicated by the first transmitter, the first receiver, and either the second transmitter or the second receiver, wherein the plurality of signals includes a signal that corresponds to an electromagnetic signal received by the first receiver from the first transmitter;
implement compensation techniques on the plurality of signals resulting in a plurality of compensated signals;
process the plurality of compensated signals to determine a position of a first wellbore of the at least two wellbores relative to a second wellbore of the at least two wellbores; and
provide the position of the first wellbore relative to the second wellbore. 21. The system of claim 20, comprising the second transmitter disposed in the first wellbore to transmit electromagnetic signals, wherein the first receiver is disposed in the second wellbore to receive the electromagnetic signals transmitted by the second transmitter, and wherein the processor is further configured to receive a signal that corresponds to an electromagnetic signal received by the first receiver from the second transmitter. 22. The system of claim 21, wherein the processor is further configured, at a first time instant, to divide a value of a first signal transmitted by the first transmitter and received by the first receiver by a value of a second signal transmitted by the second transmitter and received by the first receiver resulting in a first compensated signal. 23. The system of claim 22, wherein the processor is further configured, at a second time instant, to divide a value of a third signal transmitted by the first transmitter and received by the first receiver by a value of a fourth signal transmitted by the second transmitter and received by the first receiver resulting in a second compensated signal. 24. The system of claim 23, wherein the processor is further configured to:
record the first compensated signal and the second compensated signal as a first function of time and a second function of time, respectively; and obtain a time-lapse measurement between the first instant and the second instant. 25. The system of claim 24, wherein, to obtain the time-lapse measurement, the processor is configured to:
apply a logarithmic function to the first function of time; apply a logarithmic function to the second function of time; and determine a difference between the logarithmic function applied to the first function of time and the logarithmic function applied to the second function of time. 26. The system of claim 20, comprising the second receiver disposed in the second wellbore to receive the electromagnetic signals transmitted by the first transmitter, and wherein the processor is further configured to receive a signal that corresponds to an electromagnetic signal received by the second receiver from the first transmitter. 27. The system of claim 22, wherein the processor is further configured to divide a value of a third signal transmitted by the first transmitter and received by the first receiver by a value of a fourth signal transmitted by the first transmitter and received by the second receiver resulting in a second compensated signal. 28. The system of claim 26, wherein the first wellbore is a steam-assisted gravity drainage (SAGD) wellbore being drilled, and wherein either the first receiver or the first transmitter or the second receiver or the second transmitter is disposed in the SAGD wellbore. 29. The system of claim 28, wherein the second wellbore is a pre-existing production wellbore, and wherein either the first receiver or the first transmitter or the second receiver or the second transmitter is disposed in the pre-existing production wellbore. 30. The system of claim 26, further comprising a measurement while drilling (MWD) tool in the SAGD wellbore, wherein a combination including at least two of the first receiver, the first transmitter, the second receiver, or the second transmitter are affixed to and spaced apart on the MWD tool. 31. The system of claim 26, wherein the processor is further configured to measure a value of each of the plurality of signals as a complex voltage. 32. The system of claim 26, wherein the processor is configured to:
receive the plurality of signals received by the first receiver and the second receiver disposed at a first location and a second location, respectively, within the second wellbore from the first transmitter disposed at a third location within the first wellbore; and receive another plurality of signals received by the first receiver and the second receiver moved to a fourth location and a fifth location, respectively, within the second wellbore from the first transmitter disposed at the third location. 33. The system of claim 20, further comprising a computer-readable storage medium to store the plurality of signals and the compensated plurality of signals. 34. A computer-readable medium storing instructions executable by a processor to perform operations for ranging in wellbores, the operations comprising:
receiving a plurality of signals from a plurality of transmitters disposed in a plurality of wellbores to transmit electromagnetic signals and a plurality of receivers disposed in the plurality of wellbores to receive the electromagnetic signals transmitted by the plurality of transmitters, wherein each signal of the plurality of signals is received by each transmitter from each receiver, from the received plurality of signals, determining a plurality of compensated signals, at least one compensated signal determined from a first signal received from a first wellbore of the plurality of wellbores and a second signal received from a second wellbore of the plurality of wellbores, processing the plurality of compensated signals to determine a position of a first wellbore of the plurality of wellbores relative to a second wellbore of the plurality of wellbores, and providing the position of the first wellbore relative to the second wellbore. 35. A method for ranging in wellbores, the method comprising:
receiving, by a processor, a plurality of signals from a plurality of transmitters disposed in a plurality of wellbores to transmit electromagnetic signals and a plurality of receivers disposed in the plurality of wellbores to receive the electromagnetic signals transmitted by the plurality of transmitters, wherein each signal of the plurality of signals is received by each transmitter from each receiver, from the received plurality of signals, determining, by the processor, a plurality of compensated signals, at least one compensated signal determined from a first signal received from a first wellbore of the plurality of wellbores and a second signal received from a second wellbore of the plurality of wellbores, processing, by the processor, the plurality of compensated signals to determine a position of a first wellbore of the plurality of wellbores relative to a second wellbore of the plurality of wellbores, and providing, by the processor, the position of the first wellbore relative to the second wellbore. 36. A computer-readable medium storing instructions executable by a processor to perform operations for ranging in wellbores, the operations comprising:
receiving a plurality of signals communicated between a first transmitter disposed in a first wellbore to transmit electromagnetic signals, a first receiver disposed in a second wellbore to receive the electromagnetic signals transmitted by the first transmitter, and either a second transmitter or a second receiver disposed in either the first wellbore or the second wellbore to communicate electromagnetic signals with the first transmitter or the first receiver, wherein the plurality of signals includes a signal that corresponds to an electromagnetic signal received by the first receiver from the first transmitter; implementing compensation techniques on the plurality of signals resulting in a compensated plurality of signals; processing the compensated plurality of signals to determine a position of a first wellbore of the plurality of wellbores relative to a second wellbore of the plurality of wellbores; and providing the position of the first wellbore relative to the second wellbore. 37. A method for ranging in at least two wellbores, the method comprising:
receiving, by a processor, a plurality of signals communicated between a first transmitter disposed in a first wellbore to transmit electromagnetic signals, a first receiver disposed in a second wellbore to receive the electromagnetic signals transmitted by the first transmitter, and either a second transmitter or a second receiver disposed in either the first wellbore or the second wellbore to communicate electromagnetic signals with the first transmitter and the first receiver, wherein the plurality of signals includes a signal that corresponds to an electromagnetic signal received by the first receiver from the first transmitter; implementing, by the processor, compensation techniques on the plurality of signals resulting in a compensated plurality of signals; processing, by the processor, the compensated signals to determine a position of a first wellbore of the at least two wellbores relative to a second wellbore of the at least two wellbores; and providing, by the processor, the position of the first wellbore relative to the second wellbore. | 2,800 |
11,296 | 11,296 | 13,659,405 | 2,863 | A mobile device may include at least one sensor that detects a characteristic of the mobile device selected from distance traveled, location, time, and g-force dynamics; a processor; and a tangible non-transitory computer readable storage medium containing instructions that, when executed on by the processor, are programmed to automatically detect that a wireless connection has been established between the mobile device and a vehicle, and in response to detecting the wireless connection between the mobile device and the vehicle, automatically start collecting vehicle operation data via the at least one sensor. The mobile device may automatically stop collecting the vehicle operation data in response to the vehicle being turned off. | 1. A mobile device comprising:
at least one sensor that detects a characteristic of the mobile device selected from distance traveled, location, time, and g-force dynamics; a processor; and a tangible non-transitory computer readable storage medium containing instructions that, when executed on by the processor, perform the following steps:
automatically detecting that a wireless connection has been established between the mobile device and a vehicle; and
in response to detecting the wireless connection between the mobile device and the vehicle, automatically starting to collect vehicle operation data via the at least one sensor. 2. The mobile device of claim 1, wherein the wireless connection between the mobile device and the vehicle is automatically established in response to the vehicle being started, such that the mobile device automatically connects with the vehicle and starts collect vehicle operation data in response to the vehicle being started, without interaction between the mobile device and a user. 3. The mobile device of claim 1, wherein the instructions are further configured to transmit the collected vehicle operation data from the mobile device to a remote processing computer. 4. The mobile device of claim 1, wherein the instructions are further configured to:
continue to collect vehicle operation data via the at least one sensor while the wireless connection between the mobile device and the vehicle is maintained; automatically detect that the wireless connection between the mobile device and the vehicle has been disconnected; and in response to detecting the disconnection of the wireless connection between the mobile device and the vehicle, automatically stop collecting vehicle operation data via the at least one sensor. 5. The mobile device of claim 1, wherein the instructions are further configured to automatically stop collecting vehicle operation data in response to the vehicle being turned off 6. The mobile device of claim 1, wherein the instructions are further configured to:
automatically obtain vehicle identification information from the vehicle; and link the vehicle identification information with the collected vehicle operation data for storage or transmission of the collected vehicle operation data. 7. The mobile device of claim 6, wherein the vehicle identification information comprises a MAC address associated with the vehicle. 8. The mobile device of claim 6, wherein the vehicle identification information comprises a Bluetooth MAC address associated with the vehicle. 9. The mobile device of claim 1, wherein the mobile device is a device selected from smartphone, cell phone, mobile telephone, personal digital assistant (PDA), laptop computer, and tablet-style computer. 10. The mobile device of claim 1, wherein the mobile device is a GPS device. 11. The mobile device of claim 1, wherein the wireless connection is a Bluetooth connection. 12. A method for automatically recording vehicle operation data, the method comprising:
automatically detecting that a wireless connection has been established between a mobile device and a vehicle associated with the mobile device; and in response to detecting the wireless connection between the mobile device and the vehicle, automatically starting to collect vehicle operation data via at least one sensor provided by the mobile device. 13. The method of claim 12, wherein the wireless connection between the mobile device and the vehicle is automatically established in response to the vehicle being started, such that the mobile device automatically connects with the vehicle and starts collect vehicle operation data in response to the vehicle being started, without interaction between the mobile device and a user. 14. The method of claim 12, further comprising transmitting the collected vehicle operation data from the mobile device to a remote processing computer. 15. The method of claim 12, further comprising:
continuing to collect vehicle operation data via the at least one sensor while the wireless connection between the mobile device and the vehicle is maintained; automatically detecting that the wireless connection between the mobile device and the vehicle has been disconnected; and in response to detecting the disconnection of the wireless connection between the mobile device and the vehicle, automatically stopping the collection of vehicle operation data via the at least one sensor. 16. The method of claim 12, comprising automatically stopping the collection of vehicle operation data in response to the vehicle being turned off. 17. The method of claim 12, further comprising:
automatically obtaining vehicle identification information from the vehicle; and linking the vehicle identification information with the collected vehicle operation data for storage or transmission of the collected vehicle operation data. 18. The method of claim 17, wherein the vehicle identification information comprises a MAC address associated with the vehicle. 19. The method of claim 17, wherein the vehicle identification information comprises a Bluetooth MAC address associated with the vehicle. 20. The method of claim 12, wherein the wireless connection is a Bluetooth connection. 21. The method of claim 12, wherein collecting vehicle operation data via at least one sensor provided by the mobile device comprises collecting a characteristic of the mobile computing device selected from distance traveled, location, time, and g-force dynamics via at least one sensor provided by the mobile device. 22. Computer instructions embodied in a tangible non-transitory computer readable storage medium, the computer instructions being executable by a processor to:
automatically detect that a wireless connection has been established between a mobile device and a vehicle associated with the mobile device; and in response to detecting the wireless connection between the mobile device and the vehicle, automatically start to collect vehicle operation data via at least one sensor provided by the mobile device, without interaction between the mobile device and a user. 23. The computer instructions of claim 22, further comprising transmitting the collected vehicle operation data from the mobile device to a remote processing computer. 24. The computer instructions of claim 22, wherein the computer instructions are further configured to:
continue to collect vehicle operation data via the at least one sensor while the wireless connection between the mobile device and the vehicle is maintained; automatically detect that the wireless connection between the mobile device and the vehicle has been disconnected; and in response to detecting the disconnection of the wireless connection between the mobile device and the vehicle, automatically stop collecting vehicle operation data via the at least one sensor. 25. The computer instructions of claim 22, wherein the computer instructions are configured to stop collecting vehicle operation data in response to the vehicle being turned off. 26. The computer instructions of claim 22, wherein the computer instructions are further configured to:
automatically obtain from the vehicle a MAC address associated with the vehicle; and link the vehicle MAC address with the collected vehicle operation data for storage or transmission of the collected vehicle operation data. 27. The computer instructions of claim 22, wherein collecting vehicle operation data via at least one sensor provided by the mobile device comprises collecting a characteristic of the mobile computing device selected from distance traveled, location, time, and g-force dynamics via at least one sensor provided by the mobile device. | A mobile device may include at least one sensor that detects a characteristic of the mobile device selected from distance traveled, location, time, and g-force dynamics; a processor; and a tangible non-transitory computer readable storage medium containing instructions that, when executed on by the processor, are programmed to automatically detect that a wireless connection has been established between the mobile device and a vehicle, and in response to detecting the wireless connection between the mobile device and the vehicle, automatically start collecting vehicle operation data via the at least one sensor. The mobile device may automatically stop collecting the vehicle operation data in response to the vehicle being turned off.1. A mobile device comprising:
at least one sensor that detects a characteristic of the mobile device selected from distance traveled, location, time, and g-force dynamics; a processor; and a tangible non-transitory computer readable storage medium containing instructions that, when executed on by the processor, perform the following steps:
automatically detecting that a wireless connection has been established between the mobile device and a vehicle; and
in response to detecting the wireless connection between the mobile device and the vehicle, automatically starting to collect vehicle operation data via the at least one sensor. 2. The mobile device of claim 1, wherein the wireless connection between the mobile device and the vehicle is automatically established in response to the vehicle being started, such that the mobile device automatically connects with the vehicle and starts collect vehicle operation data in response to the vehicle being started, without interaction between the mobile device and a user. 3. The mobile device of claim 1, wherein the instructions are further configured to transmit the collected vehicle operation data from the mobile device to a remote processing computer. 4. The mobile device of claim 1, wherein the instructions are further configured to:
continue to collect vehicle operation data via the at least one sensor while the wireless connection between the mobile device and the vehicle is maintained; automatically detect that the wireless connection between the mobile device and the vehicle has been disconnected; and in response to detecting the disconnection of the wireless connection between the mobile device and the vehicle, automatically stop collecting vehicle operation data via the at least one sensor. 5. The mobile device of claim 1, wherein the instructions are further configured to automatically stop collecting vehicle operation data in response to the vehicle being turned off 6. The mobile device of claim 1, wherein the instructions are further configured to:
automatically obtain vehicle identification information from the vehicle; and link the vehicle identification information with the collected vehicle operation data for storage or transmission of the collected vehicle operation data. 7. The mobile device of claim 6, wherein the vehicle identification information comprises a MAC address associated with the vehicle. 8. The mobile device of claim 6, wherein the vehicle identification information comprises a Bluetooth MAC address associated with the vehicle. 9. The mobile device of claim 1, wherein the mobile device is a device selected from smartphone, cell phone, mobile telephone, personal digital assistant (PDA), laptop computer, and tablet-style computer. 10. The mobile device of claim 1, wherein the mobile device is a GPS device. 11. The mobile device of claim 1, wherein the wireless connection is a Bluetooth connection. 12. A method for automatically recording vehicle operation data, the method comprising:
automatically detecting that a wireless connection has been established between a mobile device and a vehicle associated with the mobile device; and in response to detecting the wireless connection between the mobile device and the vehicle, automatically starting to collect vehicle operation data via at least one sensor provided by the mobile device. 13. The method of claim 12, wherein the wireless connection between the mobile device and the vehicle is automatically established in response to the vehicle being started, such that the mobile device automatically connects with the vehicle and starts collect vehicle operation data in response to the vehicle being started, without interaction between the mobile device and a user. 14. The method of claim 12, further comprising transmitting the collected vehicle operation data from the mobile device to a remote processing computer. 15. The method of claim 12, further comprising:
continuing to collect vehicle operation data via the at least one sensor while the wireless connection between the mobile device and the vehicle is maintained; automatically detecting that the wireless connection between the mobile device and the vehicle has been disconnected; and in response to detecting the disconnection of the wireless connection between the mobile device and the vehicle, automatically stopping the collection of vehicle operation data via the at least one sensor. 16. The method of claim 12, comprising automatically stopping the collection of vehicle operation data in response to the vehicle being turned off. 17. The method of claim 12, further comprising:
automatically obtaining vehicle identification information from the vehicle; and linking the vehicle identification information with the collected vehicle operation data for storage or transmission of the collected vehicle operation data. 18. The method of claim 17, wherein the vehicle identification information comprises a MAC address associated with the vehicle. 19. The method of claim 17, wherein the vehicle identification information comprises a Bluetooth MAC address associated with the vehicle. 20. The method of claim 12, wherein the wireless connection is a Bluetooth connection. 21. The method of claim 12, wherein collecting vehicle operation data via at least one sensor provided by the mobile device comprises collecting a characteristic of the mobile computing device selected from distance traveled, location, time, and g-force dynamics via at least one sensor provided by the mobile device. 22. Computer instructions embodied in a tangible non-transitory computer readable storage medium, the computer instructions being executable by a processor to:
automatically detect that a wireless connection has been established between a mobile device and a vehicle associated with the mobile device; and in response to detecting the wireless connection between the mobile device and the vehicle, automatically start to collect vehicle operation data via at least one sensor provided by the mobile device, without interaction between the mobile device and a user. 23. The computer instructions of claim 22, further comprising transmitting the collected vehicle operation data from the mobile device to a remote processing computer. 24. The computer instructions of claim 22, wherein the computer instructions are further configured to:
continue to collect vehicle operation data via the at least one sensor while the wireless connection between the mobile device and the vehicle is maintained; automatically detect that the wireless connection between the mobile device and the vehicle has been disconnected; and in response to detecting the disconnection of the wireless connection between the mobile device and the vehicle, automatically stop collecting vehicle operation data via the at least one sensor. 25. The computer instructions of claim 22, wherein the computer instructions are configured to stop collecting vehicle operation data in response to the vehicle being turned off. 26. The computer instructions of claim 22, wherein the computer instructions are further configured to:
automatically obtain from the vehicle a MAC address associated with the vehicle; and link the vehicle MAC address with the collected vehicle operation data for storage or transmission of the collected vehicle operation data. 27. The computer instructions of claim 22, wherein collecting vehicle operation data via at least one sensor provided by the mobile device comprises collecting a characteristic of the mobile computing device selected from distance traveled, location, time, and g-force dynamics via at least one sensor provided by the mobile device. | 2,800 |
11,297 | 11,297 | 15,438,322 | 2,893 | Methods for compensating for bow in a semiconductor structure comprising an epitaxial layer grown on a semiconductor substrate. The methods include forming an adhesion layer on the backside of the wafer, and forming a stress compensation layer on the adhesion layer. | 1. A method of compensating for bow in a semiconductor wafer comprising:
obtaining a semiconductor wafer including an epitaxial layer formed on a top major surface of a semiconductor substrate, the epitaxial layer causing a wafer bow across the surface of the semiconductor substrate: applying an adhesion layer across an exposed major surface of the semiconductor wafer; and depositing a stress compensation layer over the adhesion layer, the stress compensation layer exhibiting a high stress state and formed to a thickness sufficient to substantially reduce the amount of wafer bow. 2. The method as defined in claim 1 wherein the adhesion layer is applied across an exposed major surface of the epitaxial layer. 3. The method as defined in claim 1 wherein the adhesion layer is applied across an exposed bottom surface of the semiconductor substrate. 4. The method as defined in claim 1 wherein the adhesion layer comprises a dielectric material and is applied to a thickness no greater than 0.5 μm. 5. The method as defined in claim 4 wherein the adhesion layer dielectric material is selected from the group consisting of SiO2 and SiN. 6. The method as defined in claim 1 wherein the adhesion layer comprises a metal and is applied a thickness no greater than 0.02 μm. 7. The method as defined in claim 6 wherein the adhesion layer metal is selected from the group consisting of: titanium, titanium nitride, tungsten, tantalum, aluminum and gold. 8. The method as defined in claim 1 wherein the stress compensation layer is deposited using a chemical vapor deposition process to impart a defined high stress condition within the deposited layer. 9. The method as defined in claim 8 wherein a plasma chemical vapor deposition (PCVD) process is used. 10. The method as defined in claim 8 wherein a plasma-enhanced chemical vapor deposition (PECVD) process is used. 11. The method as defined in claim 8 wherein a deposition process temperature is selected to be no greater than subsequent device fabrication temperatures. 12. The method as defined in claim 1 wherein the stress compensation layer comprises a dielectric material. 13. The method as defined in claim 12 wherein the dielectric material is selected from the group consisting of: SiO2 and SiN. 14. The method as defined in claim 1 wherein the stress compensation layer comprises a metal selected from the group consisting of: titanium, tungsten, nickel, aluminum, tantalum, and allows thereof. 15. The method as defined in claim 1, wherein the method includes the additional steps of
prior to applying the adhesion layer, measuring an initial wafer bow exhibited by the obtained semiconductor wafer; subsequent to depositing the stress compensation layer, measuring a resultant wafer bow remaining in the structure; and if the remaining wafer bow is above a predetermined threshold, modifying the thickness of the stress compensation layer. 16. The method as defined in claim 15, wherein the thickness of the stress compensation layer is increased to reduce the resultant wafer bow. 17. The method as defined in claim 15, wherein the thickness of the stress compensation layer is decreased to reduce the resultant wafer bow. 18. A bow-compensated semiconductor wafer comprising:
a substrate of a semiconductor material, the substrate having first and second major surfaces; an epitaxial layer formed on the first major surface of the substrate, the combination of the substrate and the epitaxial layer creating a wafer bow across the semiconductor wafer; an adhesion layer formed on an exposed major surface of the semiconductor wafer; and a stress compensation layer formed on the adhesion layer, the stress compensation layer exhibiting a high stress state and formed to a thickness sufficient to reduce the created wafer bow. 19. The bow-compensated semiconductor wafer as defined in claim 18 wherein the adhesion layer comprises a metal layer formed on the second major surface of the substrate. 20. The bow-compensated semiconductor wafer as defined in claim 19 wherein the stress compensation layer comprises a PCVD dielectric layer deposited on the metal adhesion layer. | Methods for compensating for bow in a semiconductor structure comprising an epitaxial layer grown on a semiconductor substrate. The methods include forming an adhesion layer on the backside of the wafer, and forming a stress compensation layer on the adhesion layer.1. A method of compensating for bow in a semiconductor wafer comprising:
obtaining a semiconductor wafer including an epitaxial layer formed on a top major surface of a semiconductor substrate, the epitaxial layer causing a wafer bow across the surface of the semiconductor substrate: applying an adhesion layer across an exposed major surface of the semiconductor wafer; and depositing a stress compensation layer over the adhesion layer, the stress compensation layer exhibiting a high stress state and formed to a thickness sufficient to substantially reduce the amount of wafer bow. 2. The method as defined in claim 1 wherein the adhesion layer is applied across an exposed major surface of the epitaxial layer. 3. The method as defined in claim 1 wherein the adhesion layer is applied across an exposed bottom surface of the semiconductor substrate. 4. The method as defined in claim 1 wherein the adhesion layer comprises a dielectric material and is applied to a thickness no greater than 0.5 μm. 5. The method as defined in claim 4 wherein the adhesion layer dielectric material is selected from the group consisting of SiO2 and SiN. 6. The method as defined in claim 1 wherein the adhesion layer comprises a metal and is applied a thickness no greater than 0.02 μm. 7. The method as defined in claim 6 wherein the adhesion layer metal is selected from the group consisting of: titanium, titanium nitride, tungsten, tantalum, aluminum and gold. 8. The method as defined in claim 1 wherein the stress compensation layer is deposited using a chemical vapor deposition process to impart a defined high stress condition within the deposited layer. 9. The method as defined in claim 8 wherein a plasma chemical vapor deposition (PCVD) process is used. 10. The method as defined in claim 8 wherein a plasma-enhanced chemical vapor deposition (PECVD) process is used. 11. The method as defined in claim 8 wherein a deposition process temperature is selected to be no greater than subsequent device fabrication temperatures. 12. The method as defined in claim 1 wherein the stress compensation layer comprises a dielectric material. 13. The method as defined in claim 12 wherein the dielectric material is selected from the group consisting of: SiO2 and SiN. 14. The method as defined in claim 1 wherein the stress compensation layer comprises a metal selected from the group consisting of: titanium, tungsten, nickel, aluminum, tantalum, and allows thereof. 15. The method as defined in claim 1, wherein the method includes the additional steps of
prior to applying the adhesion layer, measuring an initial wafer bow exhibited by the obtained semiconductor wafer; subsequent to depositing the stress compensation layer, measuring a resultant wafer bow remaining in the structure; and if the remaining wafer bow is above a predetermined threshold, modifying the thickness of the stress compensation layer. 16. The method as defined in claim 15, wherein the thickness of the stress compensation layer is increased to reduce the resultant wafer bow. 17. The method as defined in claim 15, wherein the thickness of the stress compensation layer is decreased to reduce the resultant wafer bow. 18. A bow-compensated semiconductor wafer comprising:
a substrate of a semiconductor material, the substrate having first and second major surfaces; an epitaxial layer formed on the first major surface of the substrate, the combination of the substrate and the epitaxial layer creating a wafer bow across the semiconductor wafer; an adhesion layer formed on an exposed major surface of the semiconductor wafer; and a stress compensation layer formed on the adhesion layer, the stress compensation layer exhibiting a high stress state and formed to a thickness sufficient to reduce the created wafer bow. 19. The bow-compensated semiconductor wafer as defined in claim 18 wherein the adhesion layer comprises a metal layer formed on the second major surface of the substrate. 20. The bow-compensated semiconductor wafer as defined in claim 19 wherein the stress compensation layer comprises a PCVD dielectric layer deposited on the metal adhesion layer. | 2,800 |
11,298 | 11,298 | 13,827,171 | 2,844 | A control device for lights having at least one input wherein a coded resistor can be connected to the input, and having at least one input wherein a passive temperature sensor 20 a, 20 c , particularly a PTC or an NTC, can be connected to the same. The invention also relates to an arrangement of such a control device and at least one light. | 1. A control device for lights, for example passenger vehicle lights, and particularly LED lights, comprising:
at least one input; a coded resistor for at least one of nominal power, nominal current, or nominal voltage of a light or of a lamp connected to said input; a passive temperature sensor connected to said input, wherein said input is configured for both the connection of said coded resistor and for the connection of said passive temperature sensor. 2. The control device according to claim 1, further comprising a microcontroller viand an analog to digital converter, wherein said microcontroller is connected with said input via said analog to digital converter. 3. The control device according to claim 1, further comprising a reference potential connector and at least one pull-up resistor, wherein said input is connected with said reference potential connector via said pull-up resistor. 4. The control device according to claim 1, wherein said control device can be programmed to determine a configuration of said at least one input. 5. The control device according to claim 4, further comprising a storage device operable for storing said configuration of said at least one input. 6. The control device according to claim 1, further comprising an interface operable for inputting one of a configuration of said at least one input or an instruction for the selection of a saved configuration of said at least one input. 7. A light control apparatus, comprising:
at least one light having one or more lamps, wherein at least one light is provided with at least one coded resistor in which is encoded the nominal power, the nominal voltage and/or the nominal current of said one or more lamps for the light; a control device having at least a first input, and wherein the at least one coded resistor is connected to said first input, and wherein said first input is configured for connection of said coded resistor. 8. The apparatus according to claim 7, wherein said one of at least one light or a second light is provided with a temperature sensor, wherein said control device has at least a second input and wherein said temperature sensor is connected to said second input, and wherein said second input is configured for connection of said temperature sensor. 9. The control device according to claim 1, wherein said passive temperature sensor is one of a PTC resistor or a NTC resistor. | A control device for lights having at least one input wherein a coded resistor can be connected to the input, and having at least one input wherein a passive temperature sensor 20 a, 20 c , particularly a PTC or an NTC, can be connected to the same. The invention also relates to an arrangement of such a control device and at least one light.1. A control device for lights, for example passenger vehicle lights, and particularly LED lights, comprising:
at least one input; a coded resistor for at least one of nominal power, nominal current, or nominal voltage of a light or of a lamp connected to said input; a passive temperature sensor connected to said input, wherein said input is configured for both the connection of said coded resistor and for the connection of said passive temperature sensor. 2. The control device according to claim 1, further comprising a microcontroller viand an analog to digital converter, wherein said microcontroller is connected with said input via said analog to digital converter. 3. The control device according to claim 1, further comprising a reference potential connector and at least one pull-up resistor, wherein said input is connected with said reference potential connector via said pull-up resistor. 4. The control device according to claim 1, wherein said control device can be programmed to determine a configuration of said at least one input. 5. The control device according to claim 4, further comprising a storage device operable for storing said configuration of said at least one input. 6. The control device according to claim 1, further comprising an interface operable for inputting one of a configuration of said at least one input or an instruction for the selection of a saved configuration of said at least one input. 7. A light control apparatus, comprising:
at least one light having one or more lamps, wherein at least one light is provided with at least one coded resistor in which is encoded the nominal power, the nominal voltage and/or the nominal current of said one or more lamps for the light; a control device having at least a first input, and wherein the at least one coded resistor is connected to said first input, and wherein said first input is configured for connection of said coded resistor. 8. The apparatus according to claim 7, wherein said one of at least one light or a second light is provided with a temperature sensor, wherein said control device has at least a second input and wherein said temperature sensor is connected to said second input, and wherein said second input is configured for connection of said temperature sensor. 9. The control device according to claim 1, wherein said passive temperature sensor is one of a PTC resistor or a NTC resistor. | 2,800 |
11,299 | 11,299 | 14,567,161 | 2,829 | Embodiments of the disclosure include an electrostatic chuck assembly, a processing chamber and a method of maintaining a temperature of a substrate is provided. In one embodiment, an electrostatic chuck assembly is provided that includes an electrostatic chuck, a cooling plate and a gas box. The cooling plate includes a gas channel formed therein. The gas box is operable to control a flow of cooling gas through the gas channel. | 1. An electrostatic chuck assembly comprising:
an electrostatic chuck; a cooling plate disposed in contact with the electrostatic chuck, the cooling plate having a gas channel formed therein; and a gas box coupled to a first end and a second end of the gas channel in the cooling plate, the gas box operable to control a flow of cooling gas through the gas channel. 2. The electrostatic chuck assembly of claim 1, wherein the gas box further comprises:
a flow control valve operable to control the flow of cooling gas through the gas channel. 3. The electrostatic chuck assembly of claim 1, wherein the gas box further comprises:
a heat exchanger configured to control the temperature of the cooling gas delivery by the gas box to the gas channel of the cooling plate. 4. The electrostatic chuck assembly of claim 1, wherein the gas box is operable to maintain a temperature of the cooling gas provided to the electrostatic chuck between about 390 and about 405 degrees Celsius. 5. The electrostatic chuck assembly of claim 1, wherein the gas box is operable to maintain a temperature of the cooling gas provided to the electrostatic chuck within +/−7.5 degrees Celsius. 6. The electrostatic chuck assembly of claim 1, wherein the cooling plate is fabricated from copper. 7. The electrostatic chuck assembly of claim 1, wherein the gas channel formed in the cooling plate comprises a groove. 8. The electrostatic chuck assembly of claim 1, wherein the gas channel formed in the cooling plate is at least about 20.0 inches long for a 200 mm ESC. 9. A processing chamber comprising:
a chamber body having walls, a lid and a bottom which defines an interior processing volume; a gas cooled electrostatic chuck assembly disposed in the processing volume of the chamber body, the gas cooled electrostatic chuck assembly having a cooling plate, the cooling plate having a gas channel with a first end and a second end; and a gas box configured to control a flow of a cooling gas to the first end of the gas channel in the cooling plate and receive the cooling gas from the second end of the gas channel in the cooling plate. 10. The processing chamber of claim 9, wherein the gas box further comprises:
a flow control valve operable to control the flow of cooling gas through the gas channel. 11. The processing chamber of claim 9, wherein the gas box further comprises:
a heat exchanger configured to control the temperature of the cooling gas delivery by the gas box to the gas channel of the cooling plate. 12. The processing chamber of claim 9, wherein the gas box is operable to maintain a temperature of the cooling gas provided to the electrostatic chuck to limit the electrostatic chuck temperature between about 400 and about 410 degrees Celsius. 13. The processing chamber of claim 9, wherein the gas box is operable to maintain a temperature of the cooling gas provided to the electrostatic chuck within +/−7.5 degrees Celsius. 14. The processing chamber of claim 9, wherein the cooling plate is fabricated from copper. 15. The processing chamber of claim 9, wherein the gas channel formed in the cooling plate comprises a groove. 16. The processing chamber of claim 9, wherein the gas channel formed in the cooling plate is at least about 20.0 inches long for a 200 mm ESC. 17. A method for cooling a gas cooled electrostatic chuck assembly, the method comprising:
supplying a cooling gas to a gas box; flowing the cooling gas from the gas box through a cooling plate coupled to an electrostatic chuck; running the cooling gas from the cooling plate to the gas box; and running the cooling gas through a heat exchanger in the gas box to cool the cooling gas. 18. The method of claim 17 further comprising:
passing the cooling gas returning from the electrostatic chuck through a heat exchanger prior to exhausting the cooling gas from gas box. 19. The method of claim 17 further comprising:
maintaining the electrostatic chuck within +/−7.5 degrees Celsius of a desired step point temperature. 20. The method of claim 17, further comprising;
depositing a layer of AlN on a substrate utilizing a physical vapor deposition process. | Embodiments of the disclosure include an electrostatic chuck assembly, a processing chamber and a method of maintaining a temperature of a substrate is provided. In one embodiment, an electrostatic chuck assembly is provided that includes an electrostatic chuck, a cooling plate and a gas box. The cooling plate includes a gas channel formed therein. The gas box is operable to control a flow of cooling gas through the gas channel.1. An electrostatic chuck assembly comprising:
an electrostatic chuck; a cooling plate disposed in contact with the electrostatic chuck, the cooling plate having a gas channel formed therein; and a gas box coupled to a first end and a second end of the gas channel in the cooling plate, the gas box operable to control a flow of cooling gas through the gas channel. 2. The electrostatic chuck assembly of claim 1, wherein the gas box further comprises:
a flow control valve operable to control the flow of cooling gas through the gas channel. 3. The electrostatic chuck assembly of claim 1, wherein the gas box further comprises:
a heat exchanger configured to control the temperature of the cooling gas delivery by the gas box to the gas channel of the cooling plate. 4. The electrostatic chuck assembly of claim 1, wherein the gas box is operable to maintain a temperature of the cooling gas provided to the electrostatic chuck between about 390 and about 405 degrees Celsius. 5. The electrostatic chuck assembly of claim 1, wherein the gas box is operable to maintain a temperature of the cooling gas provided to the electrostatic chuck within +/−7.5 degrees Celsius. 6. The electrostatic chuck assembly of claim 1, wherein the cooling plate is fabricated from copper. 7. The electrostatic chuck assembly of claim 1, wherein the gas channel formed in the cooling plate comprises a groove. 8. The electrostatic chuck assembly of claim 1, wherein the gas channel formed in the cooling plate is at least about 20.0 inches long for a 200 mm ESC. 9. A processing chamber comprising:
a chamber body having walls, a lid and a bottom which defines an interior processing volume; a gas cooled electrostatic chuck assembly disposed in the processing volume of the chamber body, the gas cooled electrostatic chuck assembly having a cooling plate, the cooling plate having a gas channel with a first end and a second end; and a gas box configured to control a flow of a cooling gas to the first end of the gas channel in the cooling plate and receive the cooling gas from the second end of the gas channel in the cooling plate. 10. The processing chamber of claim 9, wherein the gas box further comprises:
a flow control valve operable to control the flow of cooling gas through the gas channel. 11. The processing chamber of claim 9, wherein the gas box further comprises:
a heat exchanger configured to control the temperature of the cooling gas delivery by the gas box to the gas channel of the cooling plate. 12. The processing chamber of claim 9, wherein the gas box is operable to maintain a temperature of the cooling gas provided to the electrostatic chuck to limit the electrostatic chuck temperature between about 400 and about 410 degrees Celsius. 13. The processing chamber of claim 9, wherein the gas box is operable to maintain a temperature of the cooling gas provided to the electrostatic chuck within +/−7.5 degrees Celsius. 14. The processing chamber of claim 9, wherein the cooling plate is fabricated from copper. 15. The processing chamber of claim 9, wherein the gas channel formed in the cooling plate comprises a groove. 16. The processing chamber of claim 9, wherein the gas channel formed in the cooling plate is at least about 20.0 inches long for a 200 mm ESC. 17. A method for cooling a gas cooled electrostatic chuck assembly, the method comprising:
supplying a cooling gas to a gas box; flowing the cooling gas from the gas box through a cooling plate coupled to an electrostatic chuck; running the cooling gas from the cooling plate to the gas box; and running the cooling gas through a heat exchanger in the gas box to cool the cooling gas. 18. The method of claim 17 further comprising:
passing the cooling gas returning from the electrostatic chuck through a heat exchanger prior to exhausting the cooling gas from gas box. 19. The method of claim 17 further comprising:
maintaining the electrostatic chuck within +/−7.5 degrees Celsius of a desired step point temperature. 20. The method of claim 17, further comprising;
depositing a layer of AlN on a substrate utilizing a physical vapor deposition process. | 2,800 |
Subsets and Splits
No community queries yet
The top public SQL queries from the community will appear here once available.