text stringlengths 1 2.97k |
|---|
To: labnetwork at mtl.mit.edu |
Subject: [labnetwork] Question: adhesion of metal to BPDA/PPD polyimide |
Dear Networkers, |
I'm new to polyimide processing. We have a student project that requires deposition of metal on polyimide (BPDA/PPD PI-2600 series from HD microsystems). We tried liftoff with depositon of Ti/Pt by Ebeam. Despite a 1min O2 plasma, albeit at low power, the metal was peeling off. Moreover, the photoresist was also peeling off from the polyimide. Does anyone have a good working recipe for metalization of polyimide? |
Thanks, |
Mario |
-- |
[cid:image001.jpg at 01D93A19.FC28DC70] |
-------------- next part -------------- |
An HTML attachment was scrubbed... |
URL: <https://mtl.mit.edu/pipermail/labnetwork/attachments/20230206/10a3b749/attachment.html> |
-------------- next part -------------- |
A non-text attachment was scrubbed... |
Name: image001.jpg |
Type: image/jpeg |
Size: 21446 bytes |
Desc: image001.jpg |
URL: <https://mtl.mit.edu/pipermail/labnetwork/attachments/20230206/10a3b749/attachment.jpg> |
From michael.rooks at yale.edu Mon Feb 6 15:47:26 2023 |
From: michael.rooks at yale.edu (Michael Rooks) |
Date: Mon, 6 Feb 2023 15:47:26 -0500 |
Subject: [labnetwork] job opening - yale nano |
Message-ID: <CAMH=Voj__Xrfvnsw8eobeg6s8fg6aRT2H3JyiCAL4HNGedw_GA@mail.gmail.com> |
Job opening at Yale University: e-beam lithography, electron microscopy, |
and AFM in a shared core facility. New Haven CT (USA), BS-level or higher. |
Check out the job posting here. |
<https://sjobs.brassring.com/TGnewUI/Search/Home/Home?partnerid=25053&siteid=5248#jobDetails=1570595_5248> |
-------------------------------- |
Michael Rooks |
Yale University |
nano.yale.edu |
-------------- next part -------------- |
An HTML attachment was scrubbed... |
URL: <https://mtl.mit.edu/pipermail/labnetwork/attachments/20230206/dc55cdc8/attachment.html> |
From daniel.woodie at cornell.edu Mon Feb 6 15:57:14 2023 |
From: daniel.woodie at cornell.edu (Dan P. Woodie) |
Date: Mon, 6 Feb 2023 20:57:14 +0000 |
Subject: [labnetwork] Question: adhesion of metal to BPDA/PPD polyimide |
In-Reply-To: <BY5PR09MB5442BFB518C62303ADA6F2FBBBDA9@BY5PR09MB5442.namprd09.prod.outlook.com> |
References: <3d0e9163-6746-d694-7209-b84abc4598be@physics.ubc.ca> |
<BY5PR09MB5442BFB518C62303ADA6F2FBBBDA9@BY5PR09MB5442.namprd09.prod.outlook.com> |
Message-ID: <BL0PR04MB4612EC999FB9E88614234AF3EFDA9@BL0PR04MB4612.namprd04.prod.outlook.com> |
A solid cure of the polyimide is critical, as the imidization reaction releases water as a by-product, which will cause bubbling and delamination issues for any films over it. The challenge is that you never reach 100% curing as it is an asymptotic approach. So, you need to ensure that the cure is done at a sufficiently long enough time and high enough temperature that no further cross-linking will occur during any subsequent steps. You may want to also consider using Cyclotene from Dow instead of polyimide. It has many properties like polyimide but does not have any volatile byproducts from the cross linking, so issues like this mostly go away. I used it for my thesis electroplating copper into some thick structures and is an improvement on polyimide in many aspects. |
Dan |
Daniel Woodie |
Interim Asst. Director of Facilities / Safety Manager / Facilities Engineer - (formerly an engineer at the Cornell NanoScale Facility) |
College of Engineering |
From: labnetwork <labnetwork-bounces at mtl.mit.edu> On Behalf Of Massey, Travis |
Sent: Monday, February 6, 2023 1:59 PM |
To: Beaudoin, Mario <beaudoin at physics.ubc.ca>; labnetwork at mtl.mit.edu |
Subject: Re: [labnetwork] Question: adhesion of metal to BPDA/PPD polyimide |
Hi Mario, |
We use PI-2600 (2610 and 2611) extensively with Ti-Pt and Ti-Au metallization (sputtered). Films are 2 um and 5 um, respectively. |
Recipes and procedures are often tailored to specific toolsets and projects, so let?s start higher level with some general thoughts: |
1. I suggest a vacuum dehydration bake before each film deposition ? so, before the polyimide and again before the metal. We use our polyimide oven for this. The dehydration bake before metal dep has had a marked impact on our metal adhesion. |
2. Are you imizing your polyimide at >350 C under an inert (N2) atmosphere? We do 375C because nothing in our stack is that temperature sensitive. Occasionally our oven crashes before reaching 375C and I?ve seen bubbles beneath the metal and other issues down the line. I?ve heard of some people curing the polyimide at lower temperatures, and while you can drive off all the solvent and get a mechanically stable film, the imidization may be incomplete. |
3. Our process deviates from the datasheet on the softbake. We softbake for 10 minutes at 95C (so, lower temp for longer time). This is unusually cool for NMP drive-off, but the process has worked for our team since long before I arrived. If your films are thicker, you may need to increase one parameter or the other. |
4. Does your polyimide curing oven get used for organics other than polyimide? |
5. I avoid adhesion promoters between Si and PI unless it?s strictly necessary (and it?s generally not, for my processes). I view it as another variable and possible contaminant down the line ? this contamination possibility is why I bring it up here. That said, others in my facility have used adhesion promoters for polyimide on glass without issue? but it?s good to reduce variables where you can. |
I?m happy to discuss further if you have additional questions/issues or want a detailed procedure. |
Best, |
Travis Massey |
Lawrence Livermore National Laboratory |
7000 East Avenue, Livermore, CA 94550 |
925-422-9509 (desk) |
925-495-7103 (work cell) |
massey21 at llnl.gov<mailto:massey21 at llnl.gov> |
From: labnetwork <labnetwork-bounces at mtl.mit.edu<mailto:labnetwork-bounces at mtl.mit.edu>> On Behalf Of Beaudoin, Mario |
Sent: Wednesday, February 1, 2023 11:08 AM |
To: labnetwork at mtl.mit.edu<mailto:labnetwork at mtl.mit.edu> |
Subject: [labnetwork] Question: adhesion of metal to BPDA/PPD polyimide |
Dear Networkers, |
I'm new to polyimide processing. We have a student project that requires deposition of metal on polyimide (BPDA/PPD PI-2600 series from HD microsystems). We tried liftoff with depositon of Ti/Pt by Ebeam. Despite a 1min O2 plasma, albeit at low power, the metal was peeling off. Moreover, the photoresist was also peeling off from the polyimide. Does anyone have a good working recipe for metalization of polyimide? |
Thanks, |
Mario |
-- |
[cid:image001.jpg at 01D93A43.AD93E170] |
-------------- next part -------------- |
An HTML attachment was scrubbed... |
URL: <https://mtl.mit.edu/pipermail/labnetwork/attachments/20230206/7af92ff4/attachment.html> |
-------------- next part -------------- |
A non-text attachment was scrubbed... |
Name: image001.jpg |
Type: image/jpeg |
Size: 21446 bytes |
Desc: image001.jpg |
URL: <https://mtl.mit.edu/pipermail/labnetwork/attachments/20230206/7af92ff4/attachment.jpg> |
From odc1n08 at soton.ac.uk Tue Feb 7 04:31:20 2023 |
From: odc1n08 at soton.ac.uk (Owain Clark) |
Date: Tue, 7 Feb 2023 09:31:20 +0000 |
Subject: [labnetwork] SPTS Rapier Module - Laser/White Light |
Interferometry |
In-Reply-To: <LO2P302MB0043867A07D47A9DBB41821BB0DA9@LO2P302MB0043.GBRP302.PROD.OUTLOOK.COM> |
References: <LO2P302MB0043867A07D47A9DBB41821BB0DA9@LO2P302MB0043.GBRP302.PROD.OUTLOOK.COM> |
Message-ID: <CWXP265MB487696001B032E4C8FA82D72B0DB9@CWXP265MB4876.GBRP265.PROD.OUTLOOK.COM> |
Hi James, we don't have a rapier but we have an intellemetrics system on an OIPT chamber here. If there is a suitable optical KF/NW standard 40mm+ port located normally above the wafer then I expect it would work fine. We use IR wavelength for better compatibility with Si+Si dielectrics. I integrated the system without an assistance from OIPT, it does not interact with the tool control s/w so you need to manually observe one and hit stop on the other. |
Downsides of our system are tricky to manually focus and get the back reflection in the detector plus you have to create your masks with an opening in the correct spot, with limited XY translation possible. Can't tell you anything about etch uniformity either. |
I agree with SPTS in general, OES is a better and more versatile method of etch detection. Particularly if you have a full spectrum based system, also can be useful for plasma diagnostics and chamber cleaning information so it is more than just etch process. An inferometer gives you none of that additional info. |
Make us an offer if you like, I can't remember the last time our system got used. It's easier/quicker to take wafers out part etch and use the ellipsometer to characterise... Very easy to detach from tool and reinstall elsewhere. |
BR, Owain |
Subsets and Splits
No community queries yet
The top public SQL queries from the community will appear here once available.