text stringlengths 1 2.97k |
|---|
-- |
Ana N. Cohen [she/her/hers] |
Photolithography Cleanroom Technician |
Contractor | General Technical Services, LLC |
US Army Research Laboratory |
-- |
[labnetwork] Suss MA06 Mask Aligner |
Travis Venables venables at seas.upenn.edu |
Mon Jan 30 13:06:13 EST 2023 |
Hello, |
I am reaching out from UPENN's Quattrone Nanofabrication Facility. We have |
recently ordered some spare bulbs for our MA06 mask aligner that seem to |
have quite a long lead time. I was wondering if anyone had some spare units |
that we could borrow and replace upon the receipt of our newly ordered |
bulbs. Attached is a link to the specific bulb we are interested in. Thanks! |
https://rstvisions.com/products/osram-69200-hbo-1000w-d?_pos=1&_sid=c03e23b8 |
2&_ss=r |
-- |
Travis Venables |
Lead Cleanroom Equipment Engineer |
Quattrone Nanofabrication Facility |
University of Pennsylvania |
P: 215-898-1787 |
-------------- next part -------------- |
A non-text attachment was scrubbed... |
Name: smime.p7s |
Type: application/pkcs7-signature |
Size: 6587 bytes |
Desc: not available |
URL: <https://mtl.mit.edu/pipermail/labnetwork/attachments/20230203/c980e871/attachment.p7s> |
From James.Grant at glasgow.ac.uk Mon Feb 6 09:37:33 2023 |
From: James.Grant at glasgow.ac.uk (James Grant) |
Date: Mon, 6 Feb 2023 14:37:33 +0000 |
Subject: [labnetwork] SPTS Rapier Module - Laser/White Light Interferometry |
Message-ID: <LO2P302MB0043867A07D47A9DBB41821BB0DA9@LO2P302MB0043.GBRP302.PROD.OUTLOOK.COM> |
Hello, |
Hoping the community can feedback on their experiences. |
In 2019 we purchased an SPTS Rapier DSiE tool. As well as doing Bosch processing we also require the tool to do mixed process etching. Quite a few of our users, on our other Si etch tools (OIPT Estrelas and STS Multiplex), use mixed process to etch SOI materials or a-Si on fused silica substrates. These systems have Intellemetrics LEP 410/500 red laser interferometer units for the purpose of end-point detection. |
When we purchased the Rapier, SPTS did tell us that a laser end-point system could not be used. They encouraged us instead to use the Claritas OES system on the tool, however when we pointed out our typical use scenario (small substrate size, low % open area) they admitted that the Claritas would struggle to differentiate when to end-point. Our preferred laser interferometer vendor, Intellemetrics, say they have sold LEP 500 red laser interferometer units to SPTS but cannot say on what systems they have been used. |
We have found that EPFL use white light interferometry<https://www.epfl.ch/research/facilities/cmi/equipment/etching/spts-rapier/> end-point detection on their Rapier module - have contacted Phillipe Fluckiger separately. |
My question to the community is has anyone used a laser interferometry system on an SPTS Rapier? If so, could they feedback with their experiences. Apologies I'm asking such an open question! |
Cheers, |
James |
Dr. James Paul Grant |
Research Engineer in Plasma Processing |
Plasma Processing Group |
james.grant at glasgow.ac.uk<mailto:james.grant at glasgow.ac.uk> |
[cid:image001.png at 01D93A36.DE509BD0] |
www.JWNC.gla.ac.uk<http://www.jwnc.gla.ac.uk/> |
[cid:image002.png at 01D93A36.DE509BD0] LinkedIn.com/company/JWNC |
[cid:image003.png at 01D93A36.DE509BD0] @UofG_JWNC<https://twitter.com/uofg_jwnc> |
-------------- next part -------------- |
An HTML attachment was scrubbed... |
URL: <https://mtl.mit.edu/pipermail/labnetwork/attachments/20230206/92741551/attachment.html> |
-------------- next part -------------- |
A non-text attachment was scrubbed... |
Name: image001.png |
Type: image/png |
Size: 26666 bytes |
Desc: image001.png |
URL: <https://mtl.mit.edu/pipermail/labnetwork/attachments/20230206/92741551/attachment.png> |
-------------- next part -------------- |
A non-text attachment was scrubbed... |
Name: image002.png |
Type: image/png |
Size: 1538 bytes |
Desc: image002.png |
URL: <https://mtl.mit.edu/pipermail/labnetwork/attachments/20230206/92741551/attachment-0001.png> |
-------------- next part -------------- |
A non-text attachment was scrubbed... |
Name: image003.png |
Type: image/png |
Size: 1717 bytes |
Desc: image003.png |
URL: <https://mtl.mit.edu/pipermail/labnetwork/attachments/20230206/92741551/attachment-0002.png> |
From massey21 at llnl.gov Mon Feb 6 13:58:47 2023 |
From: massey21 at llnl.gov (Massey, Travis) |
Date: Mon, 6 Feb 2023 18:58:47 +0000 |
Subject: [labnetwork] Question: adhesion of metal to BPDA/PPD polyimide |
In-Reply-To: <3d0e9163-6746-d694-7209-b84abc4598be@physics.ubc.ca> |
References: <3d0e9163-6746-d694-7209-b84abc4598be@physics.ubc.ca> |
Message-ID: <BY5PR09MB5442BFB518C62303ADA6F2FBBBDA9@BY5PR09MB5442.namprd09.prod.outlook.com> |
Hi Mario, |
We use PI-2600 (2610 and 2611) extensively with Ti-Pt and Ti-Au metallization (sputtered). Films are 2 um and 5 um, respectively. |
Recipes and procedures are often tailored to specific toolsets and projects, so let?s start higher level with some general thoughts: |
1. I suggest a vacuum dehydration bake before each film deposition ? so, before the polyimide and again before the metal. We use our polyimide oven for this. The dehydration bake before metal dep has had a marked impact on our metal adhesion. |
2. Are you imizing your polyimide at >350 C under an inert (N2) atmosphere? We do 375C because nothing in our stack is that temperature sensitive. Occasionally our oven crashes before reaching 375C and I?ve seen bubbles beneath the metal and other issues down the line. I?ve heard of some people curing the polyimide at lower temperatures, and while you can drive off all the solvent and get a mechanically stable film, the imidization may be incomplete. |
3. Our process deviates from the datasheet on the softbake. We softbake for 10 minutes at 95C (so, lower temp for longer time). This is unusually cool for NMP drive-off, but the process has worked for our team since long before I arrived. If your films are thicker, you may need to increase one parameter or the other. |
4. Does your polyimide curing oven get used for organics other than polyimide? |
5. I avoid adhesion promoters between Si and PI unless it?s strictly necessary (and it?s generally not, for my processes). I view it as another variable and possible contaminant down the line ? this contamination possibility is why I bring it up here. That said, others in my facility have used adhesion promoters for polyimide on glass without issue? but it?s good to reduce variables where you can. |
I?m happy to discuss further if you have additional questions/issues or want a detailed procedure. |
Best, |
Travis Massey |
Lawrence Livermore National Laboratory |
7000 East Avenue, Livermore, CA 94550 |
925-422-9509 (desk) |
925-495-7103 (work cell) |
massey21 at llnl.gov<mailto:massey21 at llnl.gov> |
From: labnetwork <labnetwork-bounces at mtl.mit.edu> On Behalf Of Beaudoin, Mario |
Sent: Wednesday, February 1, 2023 11:08 AM |
Subsets and Splits
No community queries yet
The top public SQL queries from the community will appear here once available.