Unnamed: 0 int64 0 350k | level_0 int64 0 351k | ApplicationNumber int64 9.75M 96.1M | ArtUnit int64 1.6k 3.99k | Abstract stringlengths 1 8.37k | Claims stringlengths 3 292k | abstract-claims stringlengths 68 293k | TechCenter int64 1.6k 3.9k |
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12,200 | 12,200 | 15,826,822 | 2,859 | Electrical devices such as tools or tool systems are described which receive electrical power from either a separable battery or an electrical power cord. In certain versions, the tools include both a power cord receptacle and a battery receiving region located along the exterior of the tool housing. The tools can be configured such that when a battery is powering the tool, connection of a power cord to the tool is precluded. The tools can also be configured so that when a power cord is connected to the tool, connection of a battery is precluded. In particular, a hybrid drain cleaning tool system is also described that includes a hybrid drain cleaning tool in combination with a separable battery. Also described are hybrid powered threader devices and hybrid powered saw devices. | 1. An electrically powered device comprising:
a housing defining an internal hollow region; an electrical power converter having an input and an output, the converter configured to receive an alternating electrical current at the input and produce a direct electrical current at the output, the converter disposed and mounted within the internal region of the housing; an electric motor disposed and mounted within the internal region of the housing, the electric motor in electrical communication with the output of the converter; a power cord receptacle accessible for engagement with a power cord along an exterior of the housing, the power cord receptacle in electrical communication with the input of the converter; a battery receiving region accessible along an exterior of the housing, the battery receiving region including provisions to releasably engage a battery to the device. 2. The device of claim 1 wherein the power cord receptacle includes (i) a recessed region along an exterior face of the housing, and (ii) a plurality of outwardly projecting electrical prongs disposed in the recessed region. 3. The device of claim 1 wherein the battery receiving region includes at least one electrical terminal for electrical connection with a corresponding terminal of a separable battery and at least one of (i) a latch for selective coupling with the separable battery and (ii) a track for selective sliding engagement with the separable battery. 4. The device of claim 1 wherein the electric motor is a direct current motor. 5. The device of claim 1 wherein the device is selected from the group of drain cleaning devices, threader devices, pipe cutting devices, saw devices, beveller devices, fetter devices, vacuum collection devices, and combinations thereof. 6. The device of claim 1 wherein the device is a drain cleaning device and further comprises:
a rotatable drain cleaning cable;
provisions for extending and retracting the drain cleaning cable relative to the device. 7. The device of claim 1 further comprising:
a battery configured for engagement with the battery receiving region of the device. 8. The device of claim 1 wherein upon placement of a battery in the battery receiving region and engagement of the battery to the device, access to the power cord receptacle from the exterior of the device is precluded. 9. The device of claim 1 wherein upon the battery receiving region being free of a battery placed therein, the power cord receptacle is accessible from the exterior of the device for engagement with a power cord. 10. The device of claim 1 wherein upon engagement and placement of a power cord in the power cord receptacle of the device, electrical connection of a battery in the battery receiving region of the device is precluded. 11. The device of claim 1 wherein the electrical power converter receives the electrical current at the input and provides the electrical current at the output such that a voltage of the electrical current at the output is less than a voltage of the electrical current at the input. 12. The device of claim 11 wherein the voltage of the electrical current at the input is within a range of 100 volts to 250 volts. 13. The device of claim 11 wherein the voltage of the electrical current at he output is within a range of from 6 to 60 volts. 14. An electrically powered device comprising:
a housing defining an internal hollow region; an electric motor disposed and mounted within the internal region of the housing; a power cord receptacle selectively accessible for engagement with a power cord along an exterior of the housing; a battery receiving region accessible along an exterior of the housing, the battery receiving region including provisions to releasably engage a battery to the device; wherein upon placement of a battery in the battery receiving region and engagement of the battery to the device, access to the power cord receptacle from the exterior of the device is precluded. 15. The device of claim 14 wherein upon the battery receiving region being free of a battery placed therein, the power cord receptacle is accessible from the exterior of the device for engagement with a power cord. 16. The device of claim 14 wherein upon engagement and placement of a power cord in the power cord receptacle of the device, electrical connection of a battery in the battery receiving region of the device is precluded. 17. The device of claim 14 wherein the power cord receptacle includes (i) a recessed region along an exterior face of the housing, and (ii) a plurality of outwardly projecting electrical prongs disposed in the recessed region. 18. The device of claim 14 wherein the battery receiving region includes at least one electrical terminal for electrical connection with a corresponding terminal of a separable battery and at least one of (i) a latch for selective coupling with the separable battery and (ii) a track for selective sliding engagement with the separable battery. 19. The device of claim 14 wherein the electric motor is a direct current motor. 20. The device of claim 14 wherein the device is selected from the group of drain cleaning devices, threader devices, pipe cutting devices, saw devices, beveller devices, fetter devices, vacuum collection devices, and combinations thereof. 21. The device of claim 14 wherein the device is a drain cleaning device and further comprises:
a rotatable drain cleaning cable;
provisions for extending and retracting the cable relative to the device. 22. The device of claim 14 further comprising:
a battery configured for engagement with the battery receiving region of the device. 23. The device of claim 14 further comprising:
an electrical power converter disposed and mounted within the internal region of the housing, the converter having an input and an output, the converter configured to receive an alternating electrical current at the input and produce a direct electrical current at the output. 24. The device of claim 23 wherein the electrical power converter receives the electrical current at the input and provides the electrical current at the output such that a voltage of the electrical current at the output is less than a voltage of the electrical current at the input. 25. The device of claim 24 wherein the voltage of the electrical current at the input is within a range of 100 volts to 250 volts. 26. The device of claim 25 wherein the voltage of the electrical current at the output is within a range of from 6 to 60 volts. 27. A drain cleaning device comprising:
a housing defining an internal hollow region; a rotatable drum; an electric motor disposed and mounted within the internal region of the housing, wherein upon actuation of the electric motor, the rotatable drum is rotated; a rotatable drain cleaning cable, at least partially disposed in the drum; provisions for extending and retracting the drain cleaning cable relative to the device; a power cord receptacle selectively accessible for engagement with a power cord along an exterior of the housing; a battery receiving region accessible along an exterior of the housing, the battery receiving region including provisions to releasably engage a battery to the device; wherein upon placement of a battery in the battery receiving region and engagement of the battery to the device, access to the power cord receptacle from the exterior of the device is precluded. 28. The drain cleaning device of claim 27 wherein upon the battery receiving region being free of a battery placed therein, the power cord receptacle is accessible from the exterior of the device for engagement with a power cord. 29. The drain cleaning device of claim 27 wherein upon engagement and placement of a power cord in the power cord receptacle of the device, electrical connection of a battery in the battery receiving region of the device is precluded. 30. The drain cleaning device of claim 27 wherein the power cord receptacle includes (i) a recessed region along an exterior face of the housing, and (ii) a plurality of outwardly projecting electrical prongs disposed in the recessed region. 31. The drain cleaning device of claim 27 wherein the battery receiving region includes at least one electrical terminal for electrical connection with a corresponding terminal of a separable battery and at least one of (i) a latch for selective coupling with the separable battery and (ii) a track for selective sliding engagement with the separable battery. 32. The drain cleaning device of claim 27 wherein the electric motor is a direct current motor. 33. The drain cleaning device of claim 27 further comprising:
a battery configured for engagement with the battery receiving region of the device. 34, The drain cleaning device of claim 27 further comprising:
a converter disposed and mounted within the internal region of the housing, the converter having an input and an output, the converter configured to receive an alternating electrical current at the input and produce a direct electrical current at the output. 35. The drain cleaning device of claim 27 wherein the electrical power converter receives the electrical current at the input and provides the electrical current at the output such that a voltage of the electrical current at the output is less than a voltage of the electrical current at the input. 36. The drain cleaning device of claim 35 wherein the voltage of the electrical current at the input is within a range of 100 volts to 250 volts. 37. The drain cleaning device of claim 35 wherein the voltage of the electrical current at the output is within a range of from 6 to 60 volts. 38. A powered threader device comprising:
a housing defining an internal hollow region; a rotatable drive for rotating a thread cutting assembly; an electric motor disposed and mounted within the internal region of the housing, wherein upon actuation of the electric motor, the thread cutting assembly is rotated; a power cord receptacle selectively accessible for engagement with a power cord along an exterior of the housing; a battery receiving region accessible along an exterior of the housing, the battery receiving region including provisions to releasably engage a battery o the device; wherein upon placement of a battery in the battery receiving region and engagement of the battery to the device, access to the power cord receptacle from the exterior of the device is precluded. 39. The powered threader device of claim 38 wherein upon the battery receiving region being free of a battery placed therein, the power cord receptacle is accessible from the exterior of the device for engagement with a power cord. 40. The powered threader device of claim 38 wherein upon engagement and placement of a power cord in the power cord receptacle of the device, electrical connection of a battery in the battery receiving region of the device is precluded. 41. The powered threader device of claim 38 wherein the power cord receptacle includes (i) a recessed region along an exterior face of the housing, and (ii) a plurality of outwardly projecting electrical prongs disposed in the recessed region. 42. The powered threader device of claim 38 wherein the battery receiving region includes at least one electrical terminal for electrical connection with a corresponding terminal of a separable battery and at least one of (i) a latch for selective coupling with the separable battery and (ii) a track for selective sliding engagement with the separable battery. 43. The powered threader device of claim 38 wherein the electric motor is a direct current motor. 44. The powered threader device of claim 38 further comprising:
a battery configured for engagement with the battery receiving region of the device. 45. The powered threader device of claim 38 further comprising:
a converter disposed and mounted within the internal region of the housing, the converter having an input and an output, the converter configured to receive an alternating electrical current at the input and produce a direct electrical current at the output. 46. The powered threader device of claim 38 wherein the electrical power converter receives the electrical current at the input and provides the electrical current at the output such that a voltage of the electrical current at the output is less than a voltage of the electrical current at the input. 47. The powered threader device of claim 46 wherein the voltage of the electrical current at the input is within a range of 100 volts to 250 volts. 48. The powered threader device of claim 46 wherein the voltage of the electrical current at the output is within a range of from 6 to 60 volts. 49. A powered saw device comprising:
a housing defining an internal hollow region; a rotatable drive for displacing a cutting blade; an electric motor disposed and mounted within the internal region of the housing, wherein upon actuation of the electric motor, the cutting blade is displaced; a power cord receptacle selectively accessible for engagement with a power cord along an exterior of the housing; a battery receiving region accessible along an exterior of the housing, the battery receiving region including provisions to releasably engage a battery to the device; wherein upon placement of a battery in the battery receiving region and engagement of the battery to the device, access to the power cord receptacle from the exterior of the device is precluded. 50. The powered saw device of claim 49 wherein upon the battery receiving region being free of a battery placed therein, the power cord receptacle is accessible from the exterior of the device for engagement with a power cord. 51. The powered saw device of claim 49 wherein upon engagement and placement of a power cord in the power cord receptacle of the device, electrical connection of a battery in the battery receiving region of the device is precluded. 52. The powered saw device of claim 49 wherein the power cord receptacle includes (i) a recessed region along an exterior face of the housing, and (ii) a plurality of outwardly projecting electrical prongs disposed in the recessed region. 53. The powered saw device of claim 49 wherein the battery receiving region includes at least one electrical terminal for electrical connection with a corresponding terminal of a separable battery and at least one of (i) a latch for selective coupling with the separable battery and (ii) a track for selective sliding engagement with the separable battery. 54. The powered saw device of claim 49 wherein the electric motor is a direct current motor. 55. The powered saw device of claim 49 further comprising:
a battery configured for engagement with the battery receiving region of the device. 56. The powered saw device of claim 49 further comprising:
a converter disposed and mounted within the internal region of the housing, the converter having an input and an output, the converter configured to receive an alternating electrical current at the input and produce a direct electrical current at the output. 57. The powered saw device of claim 49 wherein the electrical power converter receives the electrical current at the input and provides the electrical current at the output such that a voltage of the electrical current at the output is less than a voltage of the electrical current at the input. 58. The powered saw device of claim 57 wherein the voltage of the electrical current at the input is within a range of 100 volts to 250 volts. 59. The powered saw device of claim 57 wherein the voltage of the electrical current at the output is within a range of from 6 to 60 volts. | Electrical devices such as tools or tool systems are described which receive electrical power from either a separable battery or an electrical power cord. In certain versions, the tools include both a power cord receptacle and a battery receiving region located along the exterior of the tool housing. The tools can be configured such that when a battery is powering the tool, connection of a power cord to the tool is precluded. The tools can also be configured so that when a power cord is connected to the tool, connection of a battery is precluded. In particular, a hybrid drain cleaning tool system is also described that includes a hybrid drain cleaning tool in combination with a separable battery. Also described are hybrid powered threader devices and hybrid powered saw devices.1. An electrically powered device comprising:
a housing defining an internal hollow region; an electrical power converter having an input and an output, the converter configured to receive an alternating electrical current at the input and produce a direct electrical current at the output, the converter disposed and mounted within the internal region of the housing; an electric motor disposed and mounted within the internal region of the housing, the electric motor in electrical communication with the output of the converter; a power cord receptacle accessible for engagement with a power cord along an exterior of the housing, the power cord receptacle in electrical communication with the input of the converter; a battery receiving region accessible along an exterior of the housing, the battery receiving region including provisions to releasably engage a battery to the device. 2. The device of claim 1 wherein the power cord receptacle includes (i) a recessed region along an exterior face of the housing, and (ii) a plurality of outwardly projecting electrical prongs disposed in the recessed region. 3. The device of claim 1 wherein the battery receiving region includes at least one electrical terminal for electrical connection with a corresponding terminal of a separable battery and at least one of (i) a latch for selective coupling with the separable battery and (ii) a track for selective sliding engagement with the separable battery. 4. The device of claim 1 wherein the electric motor is a direct current motor. 5. The device of claim 1 wherein the device is selected from the group of drain cleaning devices, threader devices, pipe cutting devices, saw devices, beveller devices, fetter devices, vacuum collection devices, and combinations thereof. 6. The device of claim 1 wherein the device is a drain cleaning device and further comprises:
a rotatable drain cleaning cable;
provisions for extending and retracting the drain cleaning cable relative to the device. 7. The device of claim 1 further comprising:
a battery configured for engagement with the battery receiving region of the device. 8. The device of claim 1 wherein upon placement of a battery in the battery receiving region and engagement of the battery to the device, access to the power cord receptacle from the exterior of the device is precluded. 9. The device of claim 1 wherein upon the battery receiving region being free of a battery placed therein, the power cord receptacle is accessible from the exterior of the device for engagement with a power cord. 10. The device of claim 1 wherein upon engagement and placement of a power cord in the power cord receptacle of the device, electrical connection of a battery in the battery receiving region of the device is precluded. 11. The device of claim 1 wherein the electrical power converter receives the electrical current at the input and provides the electrical current at the output such that a voltage of the electrical current at the output is less than a voltage of the electrical current at the input. 12. The device of claim 11 wherein the voltage of the electrical current at the input is within a range of 100 volts to 250 volts. 13. The device of claim 11 wherein the voltage of the electrical current at he output is within a range of from 6 to 60 volts. 14. An electrically powered device comprising:
a housing defining an internal hollow region; an electric motor disposed and mounted within the internal region of the housing; a power cord receptacle selectively accessible for engagement with a power cord along an exterior of the housing; a battery receiving region accessible along an exterior of the housing, the battery receiving region including provisions to releasably engage a battery to the device; wherein upon placement of a battery in the battery receiving region and engagement of the battery to the device, access to the power cord receptacle from the exterior of the device is precluded. 15. The device of claim 14 wherein upon the battery receiving region being free of a battery placed therein, the power cord receptacle is accessible from the exterior of the device for engagement with a power cord. 16. The device of claim 14 wherein upon engagement and placement of a power cord in the power cord receptacle of the device, electrical connection of a battery in the battery receiving region of the device is precluded. 17. The device of claim 14 wherein the power cord receptacle includes (i) a recessed region along an exterior face of the housing, and (ii) a plurality of outwardly projecting electrical prongs disposed in the recessed region. 18. The device of claim 14 wherein the battery receiving region includes at least one electrical terminal for electrical connection with a corresponding terminal of a separable battery and at least one of (i) a latch for selective coupling with the separable battery and (ii) a track for selective sliding engagement with the separable battery. 19. The device of claim 14 wherein the electric motor is a direct current motor. 20. The device of claim 14 wherein the device is selected from the group of drain cleaning devices, threader devices, pipe cutting devices, saw devices, beveller devices, fetter devices, vacuum collection devices, and combinations thereof. 21. The device of claim 14 wherein the device is a drain cleaning device and further comprises:
a rotatable drain cleaning cable;
provisions for extending and retracting the cable relative to the device. 22. The device of claim 14 further comprising:
a battery configured for engagement with the battery receiving region of the device. 23. The device of claim 14 further comprising:
an electrical power converter disposed and mounted within the internal region of the housing, the converter having an input and an output, the converter configured to receive an alternating electrical current at the input and produce a direct electrical current at the output. 24. The device of claim 23 wherein the electrical power converter receives the electrical current at the input and provides the electrical current at the output such that a voltage of the electrical current at the output is less than a voltage of the electrical current at the input. 25. The device of claim 24 wherein the voltage of the electrical current at the input is within a range of 100 volts to 250 volts. 26. The device of claim 25 wherein the voltage of the electrical current at the output is within a range of from 6 to 60 volts. 27. A drain cleaning device comprising:
a housing defining an internal hollow region; a rotatable drum; an electric motor disposed and mounted within the internal region of the housing, wherein upon actuation of the electric motor, the rotatable drum is rotated; a rotatable drain cleaning cable, at least partially disposed in the drum; provisions for extending and retracting the drain cleaning cable relative to the device; a power cord receptacle selectively accessible for engagement with a power cord along an exterior of the housing; a battery receiving region accessible along an exterior of the housing, the battery receiving region including provisions to releasably engage a battery to the device; wherein upon placement of a battery in the battery receiving region and engagement of the battery to the device, access to the power cord receptacle from the exterior of the device is precluded. 28. The drain cleaning device of claim 27 wherein upon the battery receiving region being free of a battery placed therein, the power cord receptacle is accessible from the exterior of the device for engagement with a power cord. 29. The drain cleaning device of claim 27 wherein upon engagement and placement of a power cord in the power cord receptacle of the device, electrical connection of a battery in the battery receiving region of the device is precluded. 30. The drain cleaning device of claim 27 wherein the power cord receptacle includes (i) a recessed region along an exterior face of the housing, and (ii) a plurality of outwardly projecting electrical prongs disposed in the recessed region. 31. The drain cleaning device of claim 27 wherein the battery receiving region includes at least one electrical terminal for electrical connection with a corresponding terminal of a separable battery and at least one of (i) a latch for selective coupling with the separable battery and (ii) a track for selective sliding engagement with the separable battery. 32. The drain cleaning device of claim 27 wherein the electric motor is a direct current motor. 33. The drain cleaning device of claim 27 further comprising:
a battery configured for engagement with the battery receiving region of the device. 34, The drain cleaning device of claim 27 further comprising:
a converter disposed and mounted within the internal region of the housing, the converter having an input and an output, the converter configured to receive an alternating electrical current at the input and produce a direct electrical current at the output. 35. The drain cleaning device of claim 27 wherein the electrical power converter receives the electrical current at the input and provides the electrical current at the output such that a voltage of the electrical current at the output is less than a voltage of the electrical current at the input. 36. The drain cleaning device of claim 35 wherein the voltage of the electrical current at the input is within a range of 100 volts to 250 volts. 37. The drain cleaning device of claim 35 wherein the voltage of the electrical current at the output is within a range of from 6 to 60 volts. 38. A powered threader device comprising:
a housing defining an internal hollow region; a rotatable drive for rotating a thread cutting assembly; an electric motor disposed and mounted within the internal region of the housing, wherein upon actuation of the electric motor, the thread cutting assembly is rotated; a power cord receptacle selectively accessible for engagement with a power cord along an exterior of the housing; a battery receiving region accessible along an exterior of the housing, the battery receiving region including provisions to releasably engage a battery o the device; wherein upon placement of a battery in the battery receiving region and engagement of the battery to the device, access to the power cord receptacle from the exterior of the device is precluded. 39. The powered threader device of claim 38 wherein upon the battery receiving region being free of a battery placed therein, the power cord receptacle is accessible from the exterior of the device for engagement with a power cord. 40. The powered threader device of claim 38 wherein upon engagement and placement of a power cord in the power cord receptacle of the device, electrical connection of a battery in the battery receiving region of the device is precluded. 41. The powered threader device of claim 38 wherein the power cord receptacle includes (i) a recessed region along an exterior face of the housing, and (ii) a plurality of outwardly projecting electrical prongs disposed in the recessed region. 42. The powered threader device of claim 38 wherein the battery receiving region includes at least one electrical terminal for electrical connection with a corresponding terminal of a separable battery and at least one of (i) a latch for selective coupling with the separable battery and (ii) a track for selective sliding engagement with the separable battery. 43. The powered threader device of claim 38 wherein the electric motor is a direct current motor. 44. The powered threader device of claim 38 further comprising:
a battery configured for engagement with the battery receiving region of the device. 45. The powered threader device of claim 38 further comprising:
a converter disposed and mounted within the internal region of the housing, the converter having an input and an output, the converter configured to receive an alternating electrical current at the input and produce a direct electrical current at the output. 46. The powered threader device of claim 38 wherein the electrical power converter receives the electrical current at the input and provides the electrical current at the output such that a voltage of the electrical current at the output is less than a voltage of the electrical current at the input. 47. The powered threader device of claim 46 wherein the voltage of the electrical current at the input is within a range of 100 volts to 250 volts. 48. The powered threader device of claim 46 wherein the voltage of the electrical current at the output is within a range of from 6 to 60 volts. 49. A powered saw device comprising:
a housing defining an internal hollow region; a rotatable drive for displacing a cutting blade; an electric motor disposed and mounted within the internal region of the housing, wherein upon actuation of the electric motor, the cutting blade is displaced; a power cord receptacle selectively accessible for engagement with a power cord along an exterior of the housing; a battery receiving region accessible along an exterior of the housing, the battery receiving region including provisions to releasably engage a battery to the device; wherein upon placement of a battery in the battery receiving region and engagement of the battery to the device, access to the power cord receptacle from the exterior of the device is precluded. 50. The powered saw device of claim 49 wherein upon the battery receiving region being free of a battery placed therein, the power cord receptacle is accessible from the exterior of the device for engagement with a power cord. 51. The powered saw device of claim 49 wherein upon engagement and placement of a power cord in the power cord receptacle of the device, electrical connection of a battery in the battery receiving region of the device is precluded. 52. The powered saw device of claim 49 wherein the power cord receptacle includes (i) a recessed region along an exterior face of the housing, and (ii) a plurality of outwardly projecting electrical prongs disposed in the recessed region. 53. The powered saw device of claim 49 wherein the battery receiving region includes at least one electrical terminal for electrical connection with a corresponding terminal of a separable battery and at least one of (i) a latch for selective coupling with the separable battery and (ii) a track for selective sliding engagement with the separable battery. 54. The powered saw device of claim 49 wherein the electric motor is a direct current motor. 55. The powered saw device of claim 49 further comprising:
a battery configured for engagement with the battery receiving region of the device. 56. The powered saw device of claim 49 further comprising:
a converter disposed and mounted within the internal region of the housing, the converter having an input and an output, the converter configured to receive an alternating electrical current at the input and produce a direct electrical current at the output. 57. The powered saw device of claim 49 wherein the electrical power converter receives the electrical current at the input and provides the electrical current at the output such that a voltage of the electrical current at the output is less than a voltage of the electrical current at the input. 58. The powered saw device of claim 57 wherein the voltage of the electrical current at the input is within a range of 100 volts to 250 volts. 59. The powered saw device of claim 57 wherein the voltage of the electrical current at the output is within a range of from 6 to 60 volts. | 2,800 |
12,201 | 12,201 | 15,673,734 | 2,812 | In sonic examples, a method includes pre-stressing a flange, heating the flange to a die-attach temperature, and attaching a die to the flange at the die-attach temperature using a die-attach material. In some examples, the flange includes a metal material, the die-attach temperature may be at least two hundred degrees Celsius, and the die-attach material may include solder and/or an adhesive. In some examples, the method includes cooling the semiconductor die and metal flange to a room temperature after attaching the semiconductor die to the metal flange at the die-attach temperature using a die-attach material. | 1. A method comprising:
pre-stressing a flange; heating the flange to a die-attach temperature; and attaching a die to the flange at the die-attach temperature using a die-attach material. 2. The method of claim 1, wherein pre-stressing the flange comprises clamping the flange in a first direction. 3. The method of claim 2, wherein clamping the flange comprises hindering expansion of the flange in the first direction. 4. The method of claim 1, wherein pre-stressing the flange comprises positioning the flange in a fixture. 5. The method of claim 4, wherein positioning the flange in the fixture comprises positioning the flange in a fixture that hinders expansion of the flange in a first direction and in a second direction. 6. The method of claim 1, further comprising cooling the die and flange to a room temperature after attaching the die to the flange at the die-attach temperature using a die-attach material. 7. The method of claim 1,
wherein pre-stressing the flange comprises pre-stressing a copper flange; and wherein attaching the die comprises attaching a semiconductor die to the flange at the die-attach temperature using the die-attach material. 8. The method of claim 1,
wherein heating the flange to the die-attach temperature comprises heating the flange to at least two hundred degrees Celsius; and wherein attaching the die to the flange at the die-attach temperature using the die-attach material comprises attaching the die to the flange at least two hundred degrees Celsius using the die-attach material. 9. The method of claim 1, wherein attaching the die to the flange at the die-attach temperature using the die-attach material comprises attaching the die to the flange at the die-attach temperature using solder or an adhesive. 10. The method of claim 1,
wherein pre-stressing the flange comprises pre-stressing the flange while heating the flange to the die-attach temperature, and wherein heating the flange to the die-attach temperature while pre-stressing the flange comprises pre-stressing the flange. 11. A device comprising a die, die-attach material, and a flange, wherein the device is prepared by a process comprising the steps of:
pre-stressing a flange; heating the flange to a die-attach temperature; and attaching a die to the flange at the die-attach temperature using a die-attach material. 12. The device of claim 11, wherein pre-stressing the flange comprises clamping the flange in a first direction. 13. The device of claim 11, wherein pre-stressing the flange comprises positioning the flange in a fixture. 14. The device of claim 11, further comprising cooling the die and flange to a room temperature after attaching the die to the flange at the die-attach temperature using a die-attach material. 15. The device of claim 11,
wherein pre-stressing the flange comprises pre-stressing a copper flange; and wherein attaching the die comprises attaching a semiconductor die to the flange at the die-attach temperature using the die-attach material. 16. The device of claim 11,
wherein pre-stressing the flange comprises pre-stressing the flange while heating the flange to the die-attach temperature, and wherein heating the flange to the die-attach temperature while pre-stressing the flange comprises pre-stressing the flange. 17. The device of claim 11, wherein attaching the die to the flange at the die-attach temperature using the die-attach material comprises attaching the die to the flange at the die-attach temperature using solder or adhesive. 18. A method comprising:
pre-stressing a metal flange; heating the metal flange to a die-attach temperature of at least two hundred degrees Celsius; attaching a semiconductor die to the metal flange at the die-attach temperature using solder or an adhesive; and cooling the semiconductor die and metal flange to a room temperature after attaching the semiconductor die to the metal flange at the die-attach temperature using a die-attach material. 19. The method of claim 18, wherein pre-stressing the metal flange comprises clamping the metal flange in a first direction to hinder expansion of the metal flange in the first direction. 20. The method of claim 18, wherein pre-stressing the metal flange comprises positioning the metal flange in a fixture | In sonic examples, a method includes pre-stressing a flange, heating the flange to a die-attach temperature, and attaching a die to the flange at the die-attach temperature using a die-attach material. In some examples, the flange includes a metal material, the die-attach temperature may be at least two hundred degrees Celsius, and the die-attach material may include solder and/or an adhesive. In some examples, the method includes cooling the semiconductor die and metal flange to a room temperature after attaching the semiconductor die to the metal flange at the die-attach temperature using a die-attach material.1. A method comprising:
pre-stressing a flange; heating the flange to a die-attach temperature; and attaching a die to the flange at the die-attach temperature using a die-attach material. 2. The method of claim 1, wherein pre-stressing the flange comprises clamping the flange in a first direction. 3. The method of claim 2, wherein clamping the flange comprises hindering expansion of the flange in the first direction. 4. The method of claim 1, wherein pre-stressing the flange comprises positioning the flange in a fixture. 5. The method of claim 4, wherein positioning the flange in the fixture comprises positioning the flange in a fixture that hinders expansion of the flange in a first direction and in a second direction. 6. The method of claim 1, further comprising cooling the die and flange to a room temperature after attaching the die to the flange at the die-attach temperature using a die-attach material. 7. The method of claim 1,
wherein pre-stressing the flange comprises pre-stressing a copper flange; and wherein attaching the die comprises attaching a semiconductor die to the flange at the die-attach temperature using the die-attach material. 8. The method of claim 1,
wherein heating the flange to the die-attach temperature comprises heating the flange to at least two hundred degrees Celsius; and wherein attaching the die to the flange at the die-attach temperature using the die-attach material comprises attaching the die to the flange at least two hundred degrees Celsius using the die-attach material. 9. The method of claim 1, wherein attaching the die to the flange at the die-attach temperature using the die-attach material comprises attaching the die to the flange at the die-attach temperature using solder or an adhesive. 10. The method of claim 1,
wherein pre-stressing the flange comprises pre-stressing the flange while heating the flange to the die-attach temperature, and wherein heating the flange to the die-attach temperature while pre-stressing the flange comprises pre-stressing the flange. 11. A device comprising a die, die-attach material, and a flange, wherein the device is prepared by a process comprising the steps of:
pre-stressing a flange; heating the flange to a die-attach temperature; and attaching a die to the flange at the die-attach temperature using a die-attach material. 12. The device of claim 11, wherein pre-stressing the flange comprises clamping the flange in a first direction. 13. The device of claim 11, wherein pre-stressing the flange comprises positioning the flange in a fixture. 14. The device of claim 11, further comprising cooling the die and flange to a room temperature after attaching the die to the flange at the die-attach temperature using a die-attach material. 15. The device of claim 11,
wherein pre-stressing the flange comprises pre-stressing a copper flange; and wherein attaching the die comprises attaching a semiconductor die to the flange at the die-attach temperature using the die-attach material. 16. The device of claim 11,
wherein pre-stressing the flange comprises pre-stressing the flange while heating the flange to the die-attach temperature, and wherein heating the flange to the die-attach temperature while pre-stressing the flange comprises pre-stressing the flange. 17. The device of claim 11, wherein attaching the die to the flange at the die-attach temperature using the die-attach material comprises attaching the die to the flange at the die-attach temperature using solder or adhesive. 18. A method comprising:
pre-stressing a metal flange; heating the metal flange to a die-attach temperature of at least two hundred degrees Celsius; attaching a semiconductor die to the metal flange at the die-attach temperature using solder or an adhesive; and cooling the semiconductor die and metal flange to a room temperature after attaching the semiconductor die to the metal flange at the die-attach temperature using a die-attach material. 19. The method of claim 18, wherein pre-stressing the metal flange comprises clamping the metal flange in a first direction to hinder expansion of the metal flange in the first direction. 20. The method of claim 18, wherein pre-stressing the metal flange comprises positioning the metal flange in a fixture | 2,800 |
12,202 | 12,202 | 15,435,407 | 2,861 | An inspection system comprises a sensor array and a fluid chamber. The fluid chamber is configured to provide a fluid coupling environment between the sensor array and a structure. The fluid chamber comprises a bellows having a first side and a second side opposite the first side, wherein the first side is a flexible lip. | 1. An inspection system comprising:
a sensor array; and a fluid chamber configured to provide a fluid coupling environment between the sensor array and a structure, the fluid chamber comprising a bellows having a first side and a second side opposite the first side, wherein the first side is a flexible lip. 2. The inspection system of claim 1, wherein the flexible lip is configured to deform to seal against a surface of the structure. 3. The inspection system of claim 1, wherein the bellows is formed of a polymeric material. 4. The inspection system of claim 1, wherein the fluid chamber further comprises a top connected to the second side of the bellows, wherein the top has a fluid inlet and at least one fluid outlet, wherein the top is substantially rigid such that a shape of the top does not deform due to a force applied to the inspection system that deforms the bellows. 5. The inspection system of claim 4, wherein the fluid chamber further comprises a spacer configured to maintain a desired distance between the sensor array and a surface of the structure. 6. The inspection system of claim 5, wherein a portion of the spacer extends into the bellows. 7. The inspection system of claim 1, wherein the bellows further comprises corrugations, and wherein the flexible lip is a widest portion of one corrugation of the corrugations of the bellows. 8. The inspection system of claim 1, wherein the flexible lip is configured to deform in at least two axes. 9. The inspection system of claim 1, wherein the flexible lip is configured to use hydrostatic pressure to provide a force to maintain the bellows against a surface of the structure when fluid is present within the bellows. 10. An inspection system comprising:
a sensor array; and a fluid chamber containing the sensor array, the fluid chamber comprising:
a top having a fluid inlet and at least one fluid outlet;
a substantially rigid spacer connected to the top, wherein the spacer is configured to maintain a desired distance between the sensor array and a surface of a structure; and
a corrugated skirt having a flexible lip forming an opening, wherein the corrugated skirt is connected to the spacer, and wherein the flexible lip is configured to contact the surface of the structure. 11. The inspection system of claim 10, wherein the flexible lip is configured to deform a shape of the opening to conform to the surface of the structure. 12. The inspection system of claim 11, wherein the flexible lip is configured to deform the shape of the opening to conform to the surface of the structure such that a greater amount of fluid exits the fluid chamber through the at least one fluid outlet than through the opening. 13. The inspection system of claim 10, wherein the flexible lip is configured to deform to restrict fluid flow between the flexible lip and the surface of the structure. 14. The inspection system of claim 13, wherein the surface of the structure has a curvature, and wherein the flexible lip is configured to continually deform to contact the surface as the flexible lip moves across the surface of the structure. 15. The inspection system of claim 10, wherein the corrugated skirt is removable such that the corrugated skirt is interchangeable with a second corrugated skirt having a different geometry. 16. A method comprising:
applying a force to an inspection system to maintain a flexible lip of a bellows of the inspection system against a surface of a structure, wherein the bellows has a first side and a second side opposite the first side, and wherein the first side comprises the flexible lip; flowing a fluid into a fluid chamber configured to provide a fluid coupling environment between a sensor array of the inspection system and the surface of the structure while the force is applied to the inspection system, wherein the fluid chamber comprises the bellows; and inspecting the surface of the structure using the sensor array. 17. The method of claim 16 further comprising:
moving the inspection system along the surface of the structure, wherein at least one of applying the force to the inspection system or a hydrostatic force of the fluid flowing within the fluid chamber maintains contact between the flexible lip and the surface of the structure. 18. The method of claim 17, wherein the surface of the structure has a variable curvature, and wherein the flexible lip of the bellows changes shape as the bellows moves across the surface of the structure. 19. The method of claim 16, wherein applying the force to the inspection system deforms the flexible lip of the bellows to seal the fluid chamber against the structure. 20. The method of claim 16, wherein applying the force to the inspection system deforms the flexible lip to restrict fluid flow between the flexible lip and the surface of the structure such that a greater amount of fluid exits the fluid chamber through at least one fluid outlet of a top of the fluid chamber than between the flexible lip and the surface of the structure. | An inspection system comprises a sensor array and a fluid chamber. The fluid chamber is configured to provide a fluid coupling environment between the sensor array and a structure. The fluid chamber comprises a bellows having a first side and a second side opposite the first side, wherein the first side is a flexible lip.1. An inspection system comprising:
a sensor array; and a fluid chamber configured to provide a fluid coupling environment between the sensor array and a structure, the fluid chamber comprising a bellows having a first side and a second side opposite the first side, wherein the first side is a flexible lip. 2. The inspection system of claim 1, wherein the flexible lip is configured to deform to seal against a surface of the structure. 3. The inspection system of claim 1, wherein the bellows is formed of a polymeric material. 4. The inspection system of claim 1, wherein the fluid chamber further comprises a top connected to the second side of the bellows, wherein the top has a fluid inlet and at least one fluid outlet, wherein the top is substantially rigid such that a shape of the top does not deform due to a force applied to the inspection system that deforms the bellows. 5. The inspection system of claim 4, wherein the fluid chamber further comprises a spacer configured to maintain a desired distance between the sensor array and a surface of the structure. 6. The inspection system of claim 5, wherein a portion of the spacer extends into the bellows. 7. The inspection system of claim 1, wherein the bellows further comprises corrugations, and wherein the flexible lip is a widest portion of one corrugation of the corrugations of the bellows. 8. The inspection system of claim 1, wherein the flexible lip is configured to deform in at least two axes. 9. The inspection system of claim 1, wherein the flexible lip is configured to use hydrostatic pressure to provide a force to maintain the bellows against a surface of the structure when fluid is present within the bellows. 10. An inspection system comprising:
a sensor array; and a fluid chamber containing the sensor array, the fluid chamber comprising:
a top having a fluid inlet and at least one fluid outlet;
a substantially rigid spacer connected to the top, wherein the spacer is configured to maintain a desired distance between the sensor array and a surface of a structure; and
a corrugated skirt having a flexible lip forming an opening, wherein the corrugated skirt is connected to the spacer, and wherein the flexible lip is configured to contact the surface of the structure. 11. The inspection system of claim 10, wherein the flexible lip is configured to deform a shape of the opening to conform to the surface of the structure. 12. The inspection system of claim 11, wherein the flexible lip is configured to deform the shape of the opening to conform to the surface of the structure such that a greater amount of fluid exits the fluid chamber through the at least one fluid outlet than through the opening. 13. The inspection system of claim 10, wherein the flexible lip is configured to deform to restrict fluid flow between the flexible lip and the surface of the structure. 14. The inspection system of claim 13, wherein the surface of the structure has a curvature, and wherein the flexible lip is configured to continually deform to contact the surface as the flexible lip moves across the surface of the structure. 15. The inspection system of claim 10, wherein the corrugated skirt is removable such that the corrugated skirt is interchangeable with a second corrugated skirt having a different geometry. 16. A method comprising:
applying a force to an inspection system to maintain a flexible lip of a bellows of the inspection system against a surface of a structure, wherein the bellows has a first side and a second side opposite the first side, and wherein the first side comprises the flexible lip; flowing a fluid into a fluid chamber configured to provide a fluid coupling environment between a sensor array of the inspection system and the surface of the structure while the force is applied to the inspection system, wherein the fluid chamber comprises the bellows; and inspecting the surface of the structure using the sensor array. 17. The method of claim 16 further comprising:
moving the inspection system along the surface of the structure, wherein at least one of applying the force to the inspection system or a hydrostatic force of the fluid flowing within the fluid chamber maintains contact between the flexible lip and the surface of the structure. 18. The method of claim 17, wherein the surface of the structure has a variable curvature, and wherein the flexible lip of the bellows changes shape as the bellows moves across the surface of the structure. 19. The method of claim 16, wherein applying the force to the inspection system deforms the flexible lip of the bellows to seal the fluid chamber against the structure. 20. The method of claim 16, wherein applying the force to the inspection system deforms the flexible lip to restrict fluid flow between the flexible lip and the surface of the structure such that a greater amount of fluid exits the fluid chamber through at least one fluid outlet of a top of the fluid chamber than between the flexible lip and the surface of the structure. | 2,800 |
12,203 | 12,203 | 15,728,182 | 2,849 | A set and reset pulse generator circuit receives an input signal to generate a set signal and a reset signal pair. The set and reset pulse generator circuit includes a set circuit and a reset circuit. A cross-coupling circuit connects a voltage signal of the reset circuit to an output circuit of the set circuit, and another cross-coupling circuit connects a voltage signal of the set circuit to an output circuit of the reset circuit. The output circuit of the set circuit generates the set signal from the input signal, the voltage signal of the reset circuit, and the voltage signal of the set circuit. The output circuit of the reset circuit generates the reset signal from an inverted input signal, the voltage signal of the reset circuit, and the voltage signal of the set circuit. | 1. A set and reset pulse generator circuit, comprising:
a set circuit that is configured to receive an input signal, to generate a voltage on a node of the set circuit using the input signal, and to generate a set pulse in accordance with the input signal, the voltage on the node of the set circuit, and a voltage on a node of a reset circuit; the reset circuit that is configured to receive the input signal, to generate the voltage on the node of the reset circuit using the input signal, and to generate a reset pulse in accordance with the input signal, the voltage on the node of the set circuit, and the voltage on the node of the reset circuit; a first cross-coupling circuit that is configured to couple the voltage on the node of the set circuit to the reset circuit; and a second cross-coupling circuit that is configured to couple the voltage on the node of the reset circuit to the set circuit. 2. The set and reset pulse generator circuit of claim 1, wherein the set circuit is configured to charge a first capacitor using the input signal to generate the voltage on the node of the set circuit, and to generate the set pulse by performing a logical operation on the input signal, the voltage on the first capacitor, and the voltage on the node of the reset circuit. 3. The set and reset pulse generator circuit of claim 2, wherein the reset circuit is configured to invert the input signal to generate an inverted input signal, to charge a second capacitor using the inverted input signal to generate the voltage on the node of the reset circuit, and to generate the reset pulse by forming a logical operation on the inverted input signal, the voltage on the first capacitor, and the voltage on the second capacitor. 4. The set and reset pulse generator circuit of claim 2, wherein the set circuit comprises a first inverter circuit that is configured to charge the first capacitor in accordance with the input signal, the first capacitor, and an And gate that is configured to perform the logical operation to generate the set pulse. 5. The set and reset pulse generator circuit of claim 4, wherein the reset circuit comprises an inverter buffer that is configured to invert the input signal to generate an inverted input signal, a second capacitor, a second inverter circuit that is configured to charge the second capacitor in accordance with the inverted input signal, and an And gate that is configured to perform a logical And operation on the inverted input signal, the voltage on the first capacitor, and the voltage on the second capacitor to generate the reset pulse. 6. The set and reset pulse generator circuit of claim 5, wherein the first inverter circuit comprises a first pull-up transistor and a first pull-down transistor that are complementary switched in accordance with the input signal, and the second inverter circuit comprises a second pull-up transistor and a second pull-down transistor that are complementary switched in accordance with the inverted input signal. 7. The set and reset pulse generator circuit of claim 1, wherein the first cross-coupling circuit comprises a first hysteresis circuit and the second cross-coupling circuit comprises a second hysteresis circuit. 8. The set and reset pulse generator circuit of claim 1, wherein the first cross-coupling circuit comprises a first delay circuit and the second cross-coupling circuit comprises a second delay circuit. 9. A set and reset pulse generator circuit, comprising:
a first inverter circuit that is configured to receive an input signal, and to control a switching operation of a first transistor pair in accordance with the input signal to charge a first capacitor to generate a first voltage signal; a second inverter circuit that is configured to control a switching operation of a second transistor pair in accordance with an inverted input signal to charge a second capacitor to generate a second voltage signal; a first output circuit that is configured to generate a set signal based on the input signal, the first voltage signal, and the second voltage signal; a second output circuit that is configured to generate a reset signal based on the inverted input signal, the first voltage signal, and the second voltage signal; a first cross-coupling circuit that is configured to couple the first voltage signal to the second output circuit; and a second cross-coupling circuit that is configured to couple the second voltage signal to the first output circuit. 10. The set and reset pulse generator circuit of claim 9, wherein the first cross coupling circuit comprises a first hysteresis circuit that provides hysteresis to the first voltage signal, and the second cross-coupling circuit comprises a second hysteresis circuit that provides hysteresis to the second voltage signal. 11. The set and reset pulse generator circuit of claim 9, wherein the first cross-coupling circuitry further comprises a first delay circuit that delays the first voltage signal by a first delay value, and wherein the second cross-coupling circuit comprises a second delay circuit that delays the second voltage signal by a second delay value. 12. The set and reset pulse generator circuit of claim 9, the wherein the first cross-coupling circuit comprises a first buffer circuit, and the second cross-coupling circuit comprises a second buffer circuit. 13. The set and reset pulse generator circuit of claim 9, wherein the first transistor pair comprises a first pull-up transistor and a first pull-down transistor, and the second transistor pair comprises a second pull-up transistor and a second pull-down transistor. 14. The set and reset pulse generator circuit of claim 13, wherein the first pull-up transistor is a PMOS transistor and the first pull-down transistor is an NMOS transistor with the first pull-up transistor having a channel width that is wider than a channel width of the first pull-down transistor, and
wherein the second pull-up transistor is a PMOS transistor and the second pull-down transistor is an NMOS transistor with the second pull-up transistor having a channel width that is wider than a channel width of the second pull-down transistor. 15. The set and reset pulse generator circuit of claim 9, wherein the first output circuit comprises a first And gate that performs a logical And operation on the input signal, the first voltage signal, and the second voltage signal to generate the set signal. 16. The set and reset pulse generator circuit of claim 15, wherein the second output circuit comprises a second And gate that performs a logical And operation on the inverted input signal, the first voltage signal, and the second voltage signal to generate the reset signal. 17. A method of operating a set and reset pulse generator circuit, the method comprising:
receiving an input signal; generating a first voltage signal in accordance with the input signal; inverting the input signal to generate an inverted input signal; generating a second voltage signal in accordance with the inverted input signal; generating a set signal based on the input signal, the first voltage signal, and the second voltage signal; and generating a reset signal that is complementary to the set signal based on the inverted input signal, the first voltage signal, and the second voltage signal. 18. The method of claim 17, wherein generating the first voltage signal comprises:
controlling a switching operation of a first transistor pair in accordance with the input signal to charge a first capacitor that provides the first voltage signal. 19. The method of claim 18, wherein generating the second voltage signal comprises:
controlling a switching operation of a second transistor pair in accordance with the inverted input signal to charge a second capacitor that provides the second voltage signal. 20. The method of claim 19, wherein the set signal is generated by performing a logical And operation on the input signal, the first voltage signal, and the second voltage signal, and wherein the reset signal is generated by performing a logical And operation on the inverted input signal, the first voltage signal, and the second voltage signal. | A set and reset pulse generator circuit receives an input signal to generate a set signal and a reset signal pair. The set and reset pulse generator circuit includes a set circuit and a reset circuit. A cross-coupling circuit connects a voltage signal of the reset circuit to an output circuit of the set circuit, and another cross-coupling circuit connects a voltage signal of the set circuit to an output circuit of the reset circuit. The output circuit of the set circuit generates the set signal from the input signal, the voltage signal of the reset circuit, and the voltage signal of the set circuit. The output circuit of the reset circuit generates the reset signal from an inverted input signal, the voltage signal of the reset circuit, and the voltage signal of the set circuit.1. A set and reset pulse generator circuit, comprising:
a set circuit that is configured to receive an input signal, to generate a voltage on a node of the set circuit using the input signal, and to generate a set pulse in accordance with the input signal, the voltage on the node of the set circuit, and a voltage on a node of a reset circuit; the reset circuit that is configured to receive the input signal, to generate the voltage on the node of the reset circuit using the input signal, and to generate a reset pulse in accordance with the input signal, the voltage on the node of the set circuit, and the voltage on the node of the reset circuit; a first cross-coupling circuit that is configured to couple the voltage on the node of the set circuit to the reset circuit; and a second cross-coupling circuit that is configured to couple the voltage on the node of the reset circuit to the set circuit. 2. The set and reset pulse generator circuit of claim 1, wherein the set circuit is configured to charge a first capacitor using the input signal to generate the voltage on the node of the set circuit, and to generate the set pulse by performing a logical operation on the input signal, the voltage on the first capacitor, and the voltage on the node of the reset circuit. 3. The set and reset pulse generator circuit of claim 2, wherein the reset circuit is configured to invert the input signal to generate an inverted input signal, to charge a second capacitor using the inverted input signal to generate the voltage on the node of the reset circuit, and to generate the reset pulse by forming a logical operation on the inverted input signal, the voltage on the first capacitor, and the voltage on the second capacitor. 4. The set and reset pulse generator circuit of claim 2, wherein the set circuit comprises a first inverter circuit that is configured to charge the first capacitor in accordance with the input signal, the first capacitor, and an And gate that is configured to perform the logical operation to generate the set pulse. 5. The set and reset pulse generator circuit of claim 4, wherein the reset circuit comprises an inverter buffer that is configured to invert the input signal to generate an inverted input signal, a second capacitor, a second inverter circuit that is configured to charge the second capacitor in accordance with the inverted input signal, and an And gate that is configured to perform a logical And operation on the inverted input signal, the voltage on the first capacitor, and the voltage on the second capacitor to generate the reset pulse. 6. The set and reset pulse generator circuit of claim 5, wherein the first inverter circuit comprises a first pull-up transistor and a first pull-down transistor that are complementary switched in accordance with the input signal, and the second inverter circuit comprises a second pull-up transistor and a second pull-down transistor that are complementary switched in accordance with the inverted input signal. 7. The set and reset pulse generator circuit of claim 1, wherein the first cross-coupling circuit comprises a first hysteresis circuit and the second cross-coupling circuit comprises a second hysteresis circuit. 8. The set and reset pulse generator circuit of claim 1, wherein the first cross-coupling circuit comprises a first delay circuit and the second cross-coupling circuit comprises a second delay circuit. 9. A set and reset pulse generator circuit, comprising:
a first inverter circuit that is configured to receive an input signal, and to control a switching operation of a first transistor pair in accordance with the input signal to charge a first capacitor to generate a first voltage signal; a second inverter circuit that is configured to control a switching operation of a second transistor pair in accordance with an inverted input signal to charge a second capacitor to generate a second voltage signal; a first output circuit that is configured to generate a set signal based on the input signal, the first voltage signal, and the second voltage signal; a second output circuit that is configured to generate a reset signal based on the inverted input signal, the first voltage signal, and the second voltage signal; a first cross-coupling circuit that is configured to couple the first voltage signal to the second output circuit; and a second cross-coupling circuit that is configured to couple the second voltage signal to the first output circuit. 10. The set and reset pulse generator circuit of claim 9, wherein the first cross coupling circuit comprises a first hysteresis circuit that provides hysteresis to the first voltage signal, and the second cross-coupling circuit comprises a second hysteresis circuit that provides hysteresis to the second voltage signal. 11. The set and reset pulse generator circuit of claim 9, wherein the first cross-coupling circuitry further comprises a first delay circuit that delays the first voltage signal by a first delay value, and wherein the second cross-coupling circuit comprises a second delay circuit that delays the second voltage signal by a second delay value. 12. The set and reset pulse generator circuit of claim 9, the wherein the first cross-coupling circuit comprises a first buffer circuit, and the second cross-coupling circuit comprises a second buffer circuit. 13. The set and reset pulse generator circuit of claim 9, wherein the first transistor pair comprises a first pull-up transistor and a first pull-down transistor, and the second transistor pair comprises a second pull-up transistor and a second pull-down transistor. 14. The set and reset pulse generator circuit of claim 13, wherein the first pull-up transistor is a PMOS transistor and the first pull-down transistor is an NMOS transistor with the first pull-up transistor having a channel width that is wider than a channel width of the first pull-down transistor, and
wherein the second pull-up transistor is a PMOS transistor and the second pull-down transistor is an NMOS transistor with the second pull-up transistor having a channel width that is wider than a channel width of the second pull-down transistor. 15. The set and reset pulse generator circuit of claim 9, wherein the first output circuit comprises a first And gate that performs a logical And operation on the input signal, the first voltage signal, and the second voltage signal to generate the set signal. 16. The set and reset pulse generator circuit of claim 15, wherein the second output circuit comprises a second And gate that performs a logical And operation on the inverted input signal, the first voltage signal, and the second voltage signal to generate the reset signal. 17. A method of operating a set and reset pulse generator circuit, the method comprising:
receiving an input signal; generating a first voltage signal in accordance with the input signal; inverting the input signal to generate an inverted input signal; generating a second voltage signal in accordance with the inverted input signal; generating a set signal based on the input signal, the first voltage signal, and the second voltage signal; and generating a reset signal that is complementary to the set signal based on the inverted input signal, the first voltage signal, and the second voltage signal. 18. The method of claim 17, wherein generating the first voltage signal comprises:
controlling a switching operation of a first transistor pair in accordance with the input signal to charge a first capacitor that provides the first voltage signal. 19. The method of claim 18, wherein generating the second voltage signal comprises:
controlling a switching operation of a second transistor pair in accordance with the inverted input signal to charge a second capacitor that provides the second voltage signal. 20. The method of claim 19, wherein the set signal is generated by performing a logical And operation on the input signal, the first voltage signal, and the second voltage signal, and wherein the reset signal is generated by performing a logical And operation on the inverted input signal, the first voltage signal, and the second voltage signal. | 2,800 |
12,204 | 12,204 | 13,701,786 | 2,857 | One aspect of the present disclosure relates to a method of quantifying soil carbon in a unit of land. The method generally comprises the steps of (i) obtaining an estimated spatial distribution of carbon content in the unit of land, (ii) stratifying the unit of land into a plurality of strata based at least partly on the spatial distribution of carbon content, (iii) selecting one or more locations from each of one or more of the plurality of strata, the one or more locations being selected with randomness, (iv) determining sample carbon content associated with the one or more first locations and (v) determining total carbon content in the unit of land based at least partly on the sample carbon content. In another aspect, this method may be used to quantify soil carbon sequestered in a unit of land by repeating steps (iv) and (v) at a second time and thereafter determining the amount of carbon sequestered. Furthermore, in quantifying the soil carbon sequestered, steps (ii) and (iii) may also be repeated at the second time after re-stratification of the unit of land based on sample carbon determined at the first time. | 1-38. (canceled) 39. A method of quantifying soil carbon in a unit of land, the method comprising:
obtaining an estimated spatial distribution of carbon content in the unit of land; stratifying the unit of land into a plurality of strata based, at least partly, on the obtained estimated spatial distribution of carbon content; selecting one or more locations from each of one or more of the plurality of strata, the one or more locations being selected with randomness; determining sample carbon content associated with the one or more selected locations; and determining total carbon content in the unit of land based, at least partly, on the sample carbon content. 40. The method of claim 39, wherein obtaining the estimated spatial distribution of carbon content includes obtaining a regional prediction of spatial distribution of carbon content. 41. The method of claim 39, wherein obtaining the estimated spatial distribution of carbon content includes obtaining an estimated spatial distribution of carbon content based, at least partly, on information associated with the unit of land. 42. The method of claim 41, which includes downscaling the information associated with the unit of land. 43. The method of claim 39, wherein determining sample carbon content includes measuring the sample carbon content as measured sample carbon content. 44. The method of claim 39, wherein determining sample carbon content includes determining sample carbon content in one or more layers of measured mass of soil over a determined area of the unit of land. 45. The method of claim 44, wherein determining sample carbon content includes determining any one or more of: a cutting shoe diameter, a push depth, a pulled core length and a hole depth, associated with the measured mass of soil. 46. The method of claim 39, wherein determining sample carbon content includes determining composite carbon content from two or more of said locations. 47. The method of claim 46, wherein determining composite carbon content from two or more of said locations includes compositing respective two or more layers of equal mass of soil from the two or more of said locations. 48. The method of claim 39, wherein determining sample carbon content includes determining sample carbon content by at least one of: absolute, percentage or fractional weight or mass of carbon. 49. The method of claim 39, wherein determining total carbon content includes determining total carbon content in a predetermined mass of soil per unit area of the unit of land. 50. The method of claim 39, wherein stratifying the unit of land into the plurality of strata includes stratifying the unit of land into a designated quantity of strata. 51. The method of claim 50, wherein the quantity of strata is in the range of five to seven. 52. The method of claim 50, wherein stratifying the unit of land into the plurality of strata includes determining one or more stratum boundaries between the designated quantity of strata. 53. The method of claim 52, wherein determining the one or more stratum boundaries includes determining the one or more stratum boundaries based, at least partly, on the estimated spatial distribution of carbon content. 54. The method of claim 53, wherein determining the one or more stratum boundaries includes determining the stratum boundaries based, at least partly, on a cumulative function of the square root of frequencies of occurrence of carbon derived from the estimated spatial distribution of carbon content. 55. The method of claim 52, wherein determining one or more stratum boundaries includes determining one or more optimum stratum boundaries under Neyman allocation. 56. A method of quantifying soil carbon sequestered in a unit of land, the method comprising:
obtaining an estimated spatial distribution of carbon content in the unit of land; stratifying the unit of land into a plurality of strata based, at least partly, on the obtained estimated spatial distribution of carbon content; selecting one or more first locations from each of one or more of the plurality of strata, the one or more first locations being selected with randomness; determining at a first time, a first sample carbon content associated with the one or more first locations; determining first total carbon content in the unit of land based, at least partly, on the first sample carbon content; selecting one or more second locations from each of one or more of the plurality of strata, the one or more second locations being selected with randomness; determining at a second time, a second sample carbon content associated with the one or more second locations; determining second total carbon content of the unit of land based, at least partly, on the second sample carbon content; and determining an amount of sequestered carbon in the unit of land between the first time and the second time. 57. The method of claim 56, wherein determining the amount of sequestered carbon includes determining a difference between the first total carbon content and the second total carbon content. 58. A method of quantifying soil carbon sequestered in a unit of land, the method comprising:
obtaining an estimated spatial distribution of carbon content in the unit of land; stratifying the unit of land into a plurality of strata based, at least partly, on the obtained estimated spatial distribution of carbon content; selecting one or more first locations from each of one or more of the plurality of strata, the one or more first locations being selected with randomness; determining at a first time, a first sample carbon content associated with the one or more first locations; determining first total carbon content in the unit of land based, at least partly, on the first sample carbon content; re-stratifying the unit of land into a plurality of re-stratified strata based, at least partly, on the first sample carbon content; selecting one or more second locations from each of one or more of the plurality of re-stratified strata; determining at a second time, a second sample carbon content associated with the one or more second locations; determining second total carbon content in the unit of land based, at least partly, on the second sample carbon content; and determining an amount of sequestered carbon in the unit of land between the first time and the second time. | One aspect of the present disclosure relates to a method of quantifying soil carbon in a unit of land. The method generally comprises the steps of (i) obtaining an estimated spatial distribution of carbon content in the unit of land, (ii) stratifying the unit of land into a plurality of strata based at least partly on the spatial distribution of carbon content, (iii) selecting one or more locations from each of one or more of the plurality of strata, the one or more locations being selected with randomness, (iv) determining sample carbon content associated with the one or more first locations and (v) determining total carbon content in the unit of land based at least partly on the sample carbon content. In another aspect, this method may be used to quantify soil carbon sequestered in a unit of land by repeating steps (iv) and (v) at a second time and thereafter determining the amount of carbon sequestered. Furthermore, in quantifying the soil carbon sequestered, steps (ii) and (iii) may also be repeated at the second time after re-stratification of the unit of land based on sample carbon determined at the first time.1-38. (canceled) 39. A method of quantifying soil carbon in a unit of land, the method comprising:
obtaining an estimated spatial distribution of carbon content in the unit of land; stratifying the unit of land into a plurality of strata based, at least partly, on the obtained estimated spatial distribution of carbon content; selecting one or more locations from each of one or more of the plurality of strata, the one or more locations being selected with randomness; determining sample carbon content associated with the one or more selected locations; and determining total carbon content in the unit of land based, at least partly, on the sample carbon content. 40. The method of claim 39, wherein obtaining the estimated spatial distribution of carbon content includes obtaining a regional prediction of spatial distribution of carbon content. 41. The method of claim 39, wherein obtaining the estimated spatial distribution of carbon content includes obtaining an estimated spatial distribution of carbon content based, at least partly, on information associated with the unit of land. 42. The method of claim 41, which includes downscaling the information associated with the unit of land. 43. The method of claim 39, wherein determining sample carbon content includes measuring the sample carbon content as measured sample carbon content. 44. The method of claim 39, wherein determining sample carbon content includes determining sample carbon content in one or more layers of measured mass of soil over a determined area of the unit of land. 45. The method of claim 44, wherein determining sample carbon content includes determining any one or more of: a cutting shoe diameter, a push depth, a pulled core length and a hole depth, associated with the measured mass of soil. 46. The method of claim 39, wherein determining sample carbon content includes determining composite carbon content from two or more of said locations. 47. The method of claim 46, wherein determining composite carbon content from two or more of said locations includes compositing respective two or more layers of equal mass of soil from the two or more of said locations. 48. The method of claim 39, wherein determining sample carbon content includes determining sample carbon content by at least one of: absolute, percentage or fractional weight or mass of carbon. 49. The method of claim 39, wherein determining total carbon content includes determining total carbon content in a predetermined mass of soil per unit area of the unit of land. 50. The method of claim 39, wherein stratifying the unit of land into the plurality of strata includes stratifying the unit of land into a designated quantity of strata. 51. The method of claim 50, wherein the quantity of strata is in the range of five to seven. 52. The method of claim 50, wherein stratifying the unit of land into the plurality of strata includes determining one or more stratum boundaries between the designated quantity of strata. 53. The method of claim 52, wherein determining the one or more stratum boundaries includes determining the one or more stratum boundaries based, at least partly, on the estimated spatial distribution of carbon content. 54. The method of claim 53, wherein determining the one or more stratum boundaries includes determining the stratum boundaries based, at least partly, on a cumulative function of the square root of frequencies of occurrence of carbon derived from the estimated spatial distribution of carbon content. 55. The method of claim 52, wherein determining one or more stratum boundaries includes determining one or more optimum stratum boundaries under Neyman allocation. 56. A method of quantifying soil carbon sequestered in a unit of land, the method comprising:
obtaining an estimated spatial distribution of carbon content in the unit of land; stratifying the unit of land into a plurality of strata based, at least partly, on the obtained estimated spatial distribution of carbon content; selecting one or more first locations from each of one or more of the plurality of strata, the one or more first locations being selected with randomness; determining at a first time, a first sample carbon content associated with the one or more first locations; determining first total carbon content in the unit of land based, at least partly, on the first sample carbon content; selecting one or more second locations from each of one or more of the plurality of strata, the one or more second locations being selected with randomness; determining at a second time, a second sample carbon content associated with the one or more second locations; determining second total carbon content of the unit of land based, at least partly, on the second sample carbon content; and determining an amount of sequestered carbon in the unit of land between the first time and the second time. 57. The method of claim 56, wherein determining the amount of sequestered carbon includes determining a difference between the first total carbon content and the second total carbon content. 58. A method of quantifying soil carbon sequestered in a unit of land, the method comprising:
obtaining an estimated spatial distribution of carbon content in the unit of land; stratifying the unit of land into a plurality of strata based, at least partly, on the obtained estimated spatial distribution of carbon content; selecting one or more first locations from each of one or more of the plurality of strata, the one or more first locations being selected with randomness; determining at a first time, a first sample carbon content associated with the one or more first locations; determining first total carbon content in the unit of land based, at least partly, on the first sample carbon content; re-stratifying the unit of land into a plurality of re-stratified strata based, at least partly, on the first sample carbon content; selecting one or more second locations from each of one or more of the plurality of re-stratified strata; determining at a second time, a second sample carbon content associated with the one or more second locations; determining second total carbon content in the unit of land based, at least partly, on the second sample carbon content; and determining an amount of sequestered carbon in the unit of land between the first time and the second time. | 2,800 |
12,205 | 12,205 | 16,598,126 | 2,847 | Surface mount device (SMD) placement to control a signal path in a printed circuit board (PCB), including: adding, to a PCB, a plurality of signal path segments, each signal path segment of the plurality of signal path segments ending at corresponding pad of a plurality of pads, wherein a first pad of the plurality of pads is couplable to a second pad of the plurality of pads to create a first signal path and is couplable to a third pad of the plurality of pads to create a second signal path; and coupling, via a discrete SMD, the first pad and the second pad to create the first signal path comprising a first signal path segment of the plurality of signal path segments and a second signal path segment of the plurality of signal path segments. | 1-8. (canceled) 9. A printed circuit board (PCB) for surface mount device (SMD) placement to control a signal path in a PCB, comprising:
a plurality of signal path segments, each signal path segment of the plurality of signal path segments ending at corresponding pad of a plurality of pads, wherein a first pad of the plurality of pads is couplable to a second pad of the plurality of pads to create a first signal path and is couplable to a third pad of the plurality of pads to create a second signal path; and a discrete surface mount device coupling the first pad and the second pad to create the first signal path comprising a first signal path segment of the plurality of signal path segments and a second signal path segment of the plurality of signal path segments. 10. The PCB of claim 9, wherein the second signal path comprises the first signal path segment of the plurality of signal path segments and a third signal path segment of the plurality of signal path segments. 11. The PCB of claim 9, wherein the third pad is uncoupled to any other signal path segment of the plurality of signal path segments. 12. The PCB of claim 9, wherein the discrete SMD comprises a capacitor, a resistor, or an inductor. 13. The PCB of claim 9, wherein the PCB comprises a radio frequency (RF) PCB. 14. The PCB of claim 9, wherein the plurality of pads are arranged based on a dimension of the discrete SMD. 15. An apparatus, comprising:
a printed circuit board (PCB) for surface mount device (SMD) placement to control a signal path in a PCB, comprising:
a plurality of signal path segments, each signal path segment of the plurality of signal path segments ending at corresponding pad of a plurality of pads, wherein a first pad of the plurality of pads is couplable to a second pad of the plurality of pads to create a first signal path and is couplable to a third pad of the plurality of pads to create a second signal path; and
a discrete surface mount device coupling the first pad and the second pad to create the first signal path comprising a first signal path segment of the plurality of signal path segments and a second signal path segment of the plurality of signal path segments. 16. The apparatus of claim 15, wherein the second signal path comprises the first signal path segment of the plurality of signal path segments and a third signal path segment of the plurality of signal path segments. 17. The apparatus of claim 15, wherein the third pad is uncoupled to any other signal path segment of the plurality of signal path segments. 18. The apparatus of claim 15, wherein the discrete SMD comprises a capacitor, a resistor, or an inductor. 19. The apparatus of claim 15, wherein the PCB comprises a radio frequency (RF) PCB. 20. The apparatus of claim 15, wherein the plurality of pads are arranged based on a dimension of the discrete SMD. 21. A system, comprising:
an apparatus comprising a printed circuit board (PCB) for surface mount device (SMD) placement to control a signal path in a PCB, the PCB comprising:
a plurality of signal path segments, each signal path segment of the plurality of signal path segments ending at corresponding pad of a plurality of pads, wherein a first pad of the plurality of pads is couplable to a second pad of the plurality of pads to create a first signal path and is couplable to a third pad of the plurality of pads to create a second signal path; and
a discrete surface mount device coupling the first pad and the second pad to create the first signal path comprising a first signal path segment of the plurality of signal path segments and a second signal path segment of the plurality of signal path segments. 22. The system of claim 21, wherein the second signal path comprises the first signal path segment of the plurality of signal path segments and a third signal path segment of the plurality of signal path segments. 23. The system of claim 21, wherein the third pad is uncoupled to any other signal path segment of the plurality of signal path segments. 24. The system of claim 21, wherein the discrete SMD comprises a capacitor, a resistor, or an inductor. 25. The system of claim 21, wherein the PCB comprises a radio frequency (RF) PCB. 26. The PCB of claim 9, further comprising a plurality of vias, wherein each of the plurality of vias are separate from each of the plurality of pads. 27. The apparatus of claim 15, wherein the PCB further comprises a plurality of vias, wherein each of the plurality of vias are separate from each of the plurality of pads. 28. The system of claim 21, wherein the PCB further comprises a plurality of vias, wherein each of the plurality of vias are separate from each of the plurality of pads. 29. The PCB of claim 26, wherein the discrete surface mount device is soldered to the first pad and the second pad. 30. The apparatus of claim 27, wherein the discrete surface mount device is soldered to the first pad and the second pad. 31. The system of claim 28, wherein the discrete surface mount device is soldered to the first pad and the second pad. | Surface mount device (SMD) placement to control a signal path in a printed circuit board (PCB), including: adding, to a PCB, a plurality of signal path segments, each signal path segment of the plurality of signal path segments ending at corresponding pad of a plurality of pads, wherein a first pad of the plurality of pads is couplable to a second pad of the plurality of pads to create a first signal path and is couplable to a third pad of the plurality of pads to create a second signal path; and coupling, via a discrete SMD, the first pad and the second pad to create the first signal path comprising a first signal path segment of the plurality of signal path segments and a second signal path segment of the plurality of signal path segments.1-8. (canceled) 9. A printed circuit board (PCB) for surface mount device (SMD) placement to control a signal path in a PCB, comprising:
a plurality of signal path segments, each signal path segment of the plurality of signal path segments ending at corresponding pad of a plurality of pads, wherein a first pad of the plurality of pads is couplable to a second pad of the plurality of pads to create a first signal path and is couplable to a third pad of the plurality of pads to create a second signal path; and a discrete surface mount device coupling the first pad and the second pad to create the first signal path comprising a first signal path segment of the plurality of signal path segments and a second signal path segment of the plurality of signal path segments. 10. The PCB of claim 9, wherein the second signal path comprises the first signal path segment of the plurality of signal path segments and a third signal path segment of the plurality of signal path segments. 11. The PCB of claim 9, wherein the third pad is uncoupled to any other signal path segment of the plurality of signal path segments. 12. The PCB of claim 9, wherein the discrete SMD comprises a capacitor, a resistor, or an inductor. 13. The PCB of claim 9, wherein the PCB comprises a radio frequency (RF) PCB. 14. The PCB of claim 9, wherein the plurality of pads are arranged based on a dimension of the discrete SMD. 15. An apparatus, comprising:
a printed circuit board (PCB) for surface mount device (SMD) placement to control a signal path in a PCB, comprising:
a plurality of signal path segments, each signal path segment of the plurality of signal path segments ending at corresponding pad of a plurality of pads, wherein a first pad of the plurality of pads is couplable to a second pad of the plurality of pads to create a first signal path and is couplable to a third pad of the plurality of pads to create a second signal path; and
a discrete surface mount device coupling the first pad and the second pad to create the first signal path comprising a first signal path segment of the plurality of signal path segments and a second signal path segment of the plurality of signal path segments. 16. The apparatus of claim 15, wherein the second signal path comprises the first signal path segment of the plurality of signal path segments and a third signal path segment of the plurality of signal path segments. 17. The apparatus of claim 15, wherein the third pad is uncoupled to any other signal path segment of the plurality of signal path segments. 18. The apparatus of claim 15, wherein the discrete SMD comprises a capacitor, a resistor, or an inductor. 19. The apparatus of claim 15, wherein the PCB comprises a radio frequency (RF) PCB. 20. The apparatus of claim 15, wherein the plurality of pads are arranged based on a dimension of the discrete SMD. 21. A system, comprising:
an apparatus comprising a printed circuit board (PCB) for surface mount device (SMD) placement to control a signal path in a PCB, the PCB comprising:
a plurality of signal path segments, each signal path segment of the plurality of signal path segments ending at corresponding pad of a plurality of pads, wherein a first pad of the plurality of pads is couplable to a second pad of the plurality of pads to create a first signal path and is couplable to a third pad of the plurality of pads to create a second signal path; and
a discrete surface mount device coupling the first pad and the second pad to create the first signal path comprising a first signal path segment of the plurality of signal path segments and a second signal path segment of the plurality of signal path segments. 22. The system of claim 21, wherein the second signal path comprises the first signal path segment of the plurality of signal path segments and a third signal path segment of the plurality of signal path segments. 23. The system of claim 21, wherein the third pad is uncoupled to any other signal path segment of the plurality of signal path segments. 24. The system of claim 21, wherein the discrete SMD comprises a capacitor, a resistor, or an inductor. 25. The system of claim 21, wherein the PCB comprises a radio frequency (RF) PCB. 26. The PCB of claim 9, further comprising a plurality of vias, wherein each of the plurality of vias are separate from each of the plurality of pads. 27. The apparatus of claim 15, wherein the PCB further comprises a plurality of vias, wherein each of the plurality of vias are separate from each of the plurality of pads. 28. The system of claim 21, wherein the PCB further comprises a plurality of vias, wherein each of the plurality of vias are separate from each of the plurality of pads. 29. The PCB of claim 26, wherein the discrete surface mount device is soldered to the first pad and the second pad. 30. The apparatus of claim 27, wherein the discrete surface mount device is soldered to the first pad and the second pad. 31. The system of claim 28, wherein the discrete surface mount device is soldered to the first pad and the second pad. | 2,800 |
12,206 | 12,206 | 16,301,462 | 2,831 | The present invention relates to a medical coupling unit for electrical signal transmission between the medical coupling unit ( 1, 1 a, 1 b ) and a medical sensor ( 2, 2 a ) coupled to the medical coupling unit. The medical coupling unit comprises a coupling-side connector ( 10 ) comprising a plurality of first electrical contacts ( 11 ) in or on a first surface ( 12 ) and a plurality of second electrical contacts ( 13 ) in or on a second surface ( 14 ) opposite the first surface, and a connector interface ( 15 ) for analyzing electrical signals available at one or more of the plurality of first and second electrical contacts ( 11, 13 ) to detect one or more of presence of a medical sensor coupled to the medical coupling unit, the type of medical sensor coupled to the medical coupling unit, and the orientation of a sensor-side connector of a medical sensor coupled to the medical coupling unit. The present invention relates further to a sensor-side connector ( 20 ). | 1. A medical coupling unit for electrical signal transmission between the medical coupling unit and a medical sensor removably coupled to the medical coupling unit via a sensor-side connector, the medical coupling unit comprising:
a coupling-side connector comprising a plurality of first electrical contacts in or on a first surface and a plurality of second electrical contacts in or on a second surface opposite the first surface, a connector interface for analyzing electrical signals available at one or more of the plurality of first and second electrical contacts to detect one or more of presence of a medical sensor coupled to the medical coupling unit and the orientation of a sensor-side connector of a medical sensor coupled to the medical coupling unit by evaluating the impedance and/or voltage between predetermined electrical contacts. 2. The medical coupling unit as claimed in claim 1,
wherein said connector interface is configured to evaluate the impedance between one first electrical contact and one second electrical contact, serving as presence detection contacts, to detect if a medical sensor is coupled to the medical coupling unit and/or to detect the type of medical sensor. 3. The medical coupling unit as claimed in claim 1,
wherein said connector interface is configured to measure the voltage between one first electrical contact and one second electrical contact, serving as presence detection contacts, in response to a test current driven into one of said presence detection contacts. 4. The medical coupling unit as claimed in claim 2,
wherein said presence detection contacts are central electrical contacts among the plurality of first electrical contacts and the plurality of second electrical contacts, respectively. 5. The medical coupling unit as claimed in claim 1,
wherein said connector interface is configured to detect the number of shorted contacts to detect presence and/or type of a medical sensor coupled to the medical coupling unit and/or to detect orientation of a sensor-side connector of a medical sensor coupled to the medical coupling unit. 6. The medical coupling unit as claimed in claim 1,
wherein said connector interface is configured to evaluate the impedance between one or more pairs of electrical contacts to detect presence and/or type of a medical sensor coupled to the medical coupling unit and/or to detect orientation of a sensor-side connector of a medical sensor coupled to the medical coupling unit. 7. The medical coupling unit as claimed in claim 1, further comprising:
a measurement unit for evaluating electrical signals received at one or more of the plurality of first and second electrical contacts, and a measurement control unit for controlling the configuration and/or evaluation of the measurement unit based on the detected type and/or orientation of a medical sensor coupled to the medical coupling unit. 8. The medical coupling unit as claimed in claim 1,
further comprising a sensor control unit for controlling a connected medical sensor via the coupling-side connector and/or a power supply unit for supplying power to a connected medical sensor and/or to a connected sensor-side connector via the coupling-side connector. 9. The medical coupling unit as claimed in claim 1,
wherein said coupling-side connector is configured as plug for plugging into a sensor-side connector configured as socket or said coupling-side connector is configured as socket for plugging a sensor-side connector configured as plug into it. 10. A sensor-side connector for electrical signal transmission between a medical coupling unit and a medical sensor unit connected to the sensor-side connector and for removably coupling to the medical coupling unit, the sensor-side connector comprising:
a plurality of first electrical contacts in or on a first surface and a plurality of second electrical contacts in or on a second surface opposite the first surface, one or more internal connections for point symmetrically connecting one or more first electrical contacts with the respective second electrical contact, and protection circuitry comprising one or more sidactors coupled between a reference contact and/or protection resistors coupled between one or more input terminals, to which input signals from the sensor unit are coupled, and one or more of said first and second contacts. 11. (canceled) 12. (canceled) 13. The sensor-side connector as claimed in claim 10,
wherein one first electrical contact and one second electrical contact are arranged to connect to a shield contact of a cable connecting the sensor unit to the sensor-side connector. 14. The sensor-side connector as claimed in claim 13,
wherein said first and second contacts are central electrical contacts among the plurality of first electrical contacts and the plurality of second electrical contacts, respectively. 15. The sensor-side connector as claimed in claim 13, further comprising one or more of:
a diode coupled between said first and second contacts, a first impedance measurement resistor between a first contact and a second contact, a second impedance measurement resistor between a pair of first contacts or a pair of second contacts, and an electronic memory. | The present invention relates to a medical coupling unit for electrical signal transmission between the medical coupling unit ( 1, 1 a, 1 b ) and a medical sensor ( 2, 2 a ) coupled to the medical coupling unit. The medical coupling unit comprises a coupling-side connector ( 10 ) comprising a plurality of first electrical contacts ( 11 ) in or on a first surface ( 12 ) and a plurality of second electrical contacts ( 13 ) in or on a second surface ( 14 ) opposite the first surface, and a connector interface ( 15 ) for analyzing electrical signals available at one or more of the plurality of first and second electrical contacts ( 11, 13 ) to detect one or more of presence of a medical sensor coupled to the medical coupling unit, the type of medical sensor coupled to the medical coupling unit, and the orientation of a sensor-side connector of a medical sensor coupled to the medical coupling unit. The present invention relates further to a sensor-side connector ( 20 ).1. A medical coupling unit for electrical signal transmission between the medical coupling unit and a medical sensor removably coupled to the medical coupling unit via a sensor-side connector, the medical coupling unit comprising:
a coupling-side connector comprising a plurality of first electrical contacts in or on a first surface and a plurality of second electrical contacts in or on a second surface opposite the first surface, a connector interface for analyzing electrical signals available at one or more of the plurality of first and second electrical contacts to detect one or more of presence of a medical sensor coupled to the medical coupling unit and the orientation of a sensor-side connector of a medical sensor coupled to the medical coupling unit by evaluating the impedance and/or voltage between predetermined electrical contacts. 2. The medical coupling unit as claimed in claim 1,
wherein said connector interface is configured to evaluate the impedance between one first electrical contact and one second electrical contact, serving as presence detection contacts, to detect if a medical sensor is coupled to the medical coupling unit and/or to detect the type of medical sensor. 3. The medical coupling unit as claimed in claim 1,
wherein said connector interface is configured to measure the voltage between one first electrical contact and one second electrical contact, serving as presence detection contacts, in response to a test current driven into one of said presence detection contacts. 4. The medical coupling unit as claimed in claim 2,
wherein said presence detection contacts are central electrical contacts among the plurality of first electrical contacts and the plurality of second electrical contacts, respectively. 5. The medical coupling unit as claimed in claim 1,
wherein said connector interface is configured to detect the number of shorted contacts to detect presence and/or type of a medical sensor coupled to the medical coupling unit and/or to detect orientation of a sensor-side connector of a medical sensor coupled to the medical coupling unit. 6. The medical coupling unit as claimed in claim 1,
wherein said connector interface is configured to evaluate the impedance between one or more pairs of electrical contacts to detect presence and/or type of a medical sensor coupled to the medical coupling unit and/or to detect orientation of a sensor-side connector of a medical sensor coupled to the medical coupling unit. 7. The medical coupling unit as claimed in claim 1, further comprising:
a measurement unit for evaluating electrical signals received at one or more of the plurality of first and second electrical contacts, and a measurement control unit for controlling the configuration and/or evaluation of the measurement unit based on the detected type and/or orientation of a medical sensor coupled to the medical coupling unit. 8. The medical coupling unit as claimed in claim 1,
further comprising a sensor control unit for controlling a connected medical sensor via the coupling-side connector and/or a power supply unit for supplying power to a connected medical sensor and/or to a connected sensor-side connector via the coupling-side connector. 9. The medical coupling unit as claimed in claim 1,
wherein said coupling-side connector is configured as plug for plugging into a sensor-side connector configured as socket or said coupling-side connector is configured as socket for plugging a sensor-side connector configured as plug into it. 10. A sensor-side connector for electrical signal transmission between a medical coupling unit and a medical sensor unit connected to the sensor-side connector and for removably coupling to the medical coupling unit, the sensor-side connector comprising:
a plurality of first electrical contacts in or on a first surface and a plurality of second electrical contacts in or on a second surface opposite the first surface, one or more internal connections for point symmetrically connecting one or more first electrical contacts with the respective second electrical contact, and protection circuitry comprising one or more sidactors coupled between a reference contact and/or protection resistors coupled between one or more input terminals, to which input signals from the sensor unit are coupled, and one or more of said first and second contacts. 11. (canceled) 12. (canceled) 13. The sensor-side connector as claimed in claim 10,
wherein one first electrical contact and one second electrical contact are arranged to connect to a shield contact of a cable connecting the sensor unit to the sensor-side connector. 14. The sensor-side connector as claimed in claim 13,
wherein said first and second contacts are central electrical contacts among the plurality of first electrical contacts and the plurality of second electrical contacts, respectively. 15. The sensor-side connector as claimed in claim 13, further comprising one or more of:
a diode coupled between said first and second contacts, a first impedance measurement resistor between a first contact and a second contact, a second impedance measurement resistor between a pair of first contacts or a pair of second contacts, and an electronic memory. | 2,800 |
12,207 | 12,207 | 16,146,005 | 2,831 | Provided is a wall grommet, which can be installed through the surfaces of walls to route wiring in the walls' interior spaces. In particular, the wall grommet is configured for running power cords inside walls and presenting the electrical connectors of a power cord in a manner such that power cords are hidden from view. The grommet may comprise a housing, which defines an interior space that is adapted to hold either the female connector or male connector of a power cord. The housing may be configured to enclose and secure the electrical connector of the power cord in the housing. | 1. A power cord rated for use inside walls, comprising:
a type NM-B cable terminating with a female receptacle connector on one end and terminating with a male prong connector on another end; wherein the female receptacle connector and male prong connector are integrally formed with the type NM-B cable to form a unitary power cord; wherein each of the female receptacle connector and male prong connector comprises a body defining a front face providing electrical connection points, the body defining a longitudinal axis normal to the front face; wherein the type NM-B cable extends from the body of the female receptacle connector transversely to the longitudinal axis of the female receptacle connector; and wherein the type NM-B cable extends from the body of the male prong connector transversely to the longitudinal axis of the male prong connector. 2. The power cord of claim 1, wherein each of the female receptacle connector and male prong connector further comprises a flange extending from the body along a plane parallel to the front face or perpendicular to the longitudinal axis of the body. 3. The power cord of claim 2, wherein the flange of each of the female receptacle connector and male prong connector is offset from the front face along the longitudinal axis of the body. 4. The power cord of claim 2, wherein the flange of each of the female receptacle connector and male prong connector extends circumferentially around the body. 5. The power cord of claim 1, wherein the type NM-B cable extends from the body of the female receptacle connector at a 90° angle to the longitudinal axis of the female receptacle connector; and
wherein the type NM-B cable extends from the body of the male prong connector at a 90° angle to the longitudinal axis of the male prong connector. 6. A power cord rated for use inside walls, comprising:
a first electrical connector disposed at a first end of a cable that is rated for use inside walls and a second electrical connector disposed at a second end of the cable; wherein each of the first electrical connector and second electrical connector comprises a body defining a front face providing electrical connection points, the body defining a longitudinal axis normal to the front face; wherein the cable extends from the body of the first electrical connector transversely to the longitudinal axis of the first electrical connector; and wherein the cable extends from the body of the second electrical connector transversely to the longitudinal axis of the second electrical connector. 7. The power cord of claim 6, wherein each of the first electrical connector and second electrical connector further comprises a flange extending from the body along a plane parallel to the front face or perpendicular to the longitudinal axis of the body. 8. The power cord of claim 7, wherein the flange of each of the first electrical connector and second electrical connector is offset from the front face along the longitudinal axis of the body. 9. The power cord of claim 7, wherein the flange of each of the first electrical connector and second electrical connector extends circumferentially around the body 10. The power cord of claim 6, wherein the cable is a type NM-B cable. 11. The power cord of claim 6, wherein the first electrical connector is a female receptacle connector and the second electrical connector is a male prong connector. 12. The power cord of claim 6, wherein the first electrical connector and the second electrical connector are integrally formed with the cable to form a unitary power cord. 13. The power cord of claim 6, wherein the cable extends from the body of the first electrical connector at a 90° angle to the axis normal to the front face of the first electrical connector; and
wherein the cable extends from the body of the second electrical connector at a 90° angle to the axis normal to the front face of the second electrical connector. 14. An electrical connector assembly for routing power cords or audio/video cables inside a wall, the assembly comprising:
a power cord terminating with a first electrical connector integrally provided at a first end of the power cord and terminating with a second electrical connector integrally provided at a second end of the power cord; wherein the power cord comprises a type of cable that is rated for use inside walls; a first wall grommet comprising a housing configured to be secured to the first electrical connector at the first end of the power cord; and a second wall grommet comprising a housing configured to be secured to the second electrical connector at the second end of the power cord; wherein each of the first wall grommet and second wall grommet is configured to be inserted through a hole in a surface of a wall and mounted in the wall, such that the power cord can be routed through an interior space of the wall. 15. The electrical connector assembly according to claim 14,
wherein the housing of the first wall grommet is configured to be secured to the first electrical connector on the first end of the power cord such that the first electrical connector is recessed from the surface of the wall when the housing of the first wall grommet is mounted in the wall; and wherein the housing of the second wall grommet is configured to be secured to the second electrical connector on the second end of the power cord such that the second connector is recessed from the surface of the wall when the housing of the second wall grommet is mounted in the wall. 16. The electrical connector assembly according to claim 15, wherein the housing of each of the first wall grommet and the second wall grommet defines a front opening, a front interior space, a back interior space, and an interior wall separating the front interior space and the back interior space, the interior wall having a vertical portion defining a connector opening that connects the front interior space and the back interior space. 17. The electrical connector assembly according to claim 16,
wherein the back interior space defined by the housing of the first wall grommet is configured to accommodate the first electrical connector at the first end of the power cord, such that the first electrical connector at the first end of the power cord is accessible from the front opening and front interior space of the housing through the electrical-connector opening; and wherein the back interior space defined by the housing of the second wall grommet is configured to accommodate the second electrical connector at the second end of the power cord, such that the second electrical connector at the second end of the power cord is accessible from the front opening and front interior space of the housing through the electrical-connector opening. 18. The electrical connector assembly according to claim 17, wherein the housing of each of the first wall grommet and the second wall grommet defines a power cord opening to the back interior space configured to allow the power cord to extend out of the housing transversely to a longitudinal axis of the housing. 19. The electrical connector assembly according to claim 16,
wherein the housing of each of the first wall grommet and the second wall grommet further comprises an egress opening providing access to the front interior space of the housing; wherein a portion of the interior wall of each of the first wall grommet and the second wall grommet curves from a back edge of the wire egress opening toward the front interior space and the front opening; and wherein the curved portion of the interior wall and the egress opening of each of the first wall grommet and the second wall grommet are configured such that a cable can be routed from the front opening of the housing of either the first wall grommet or the second wall grommet, through the front interior space of the housing of that wall grommet, out through the egress opening of that wall grommet, and into the interior space of the wall when that housing is mounted in the wall. 20. The electrical connector assembly according to claim 16,
wherein each of the first and second electrical connectors comprises a flange configured to engage the interior wall of the housing around the electrical-connector opening; wherein each of the first and second electrical connectors comprises a front face protruding from the flange such that the front face of the electrical connector extends through the electrical-connector opening when the flange engages the interior wall of the housing around the electrical-connector opening. | Provided is a wall grommet, which can be installed through the surfaces of walls to route wiring in the walls' interior spaces. In particular, the wall grommet is configured for running power cords inside walls and presenting the electrical connectors of a power cord in a manner such that power cords are hidden from view. The grommet may comprise a housing, which defines an interior space that is adapted to hold either the female connector or male connector of a power cord. The housing may be configured to enclose and secure the electrical connector of the power cord in the housing.1. A power cord rated for use inside walls, comprising:
a type NM-B cable terminating with a female receptacle connector on one end and terminating with a male prong connector on another end; wherein the female receptacle connector and male prong connector are integrally formed with the type NM-B cable to form a unitary power cord; wherein each of the female receptacle connector and male prong connector comprises a body defining a front face providing electrical connection points, the body defining a longitudinal axis normal to the front face; wherein the type NM-B cable extends from the body of the female receptacle connector transversely to the longitudinal axis of the female receptacle connector; and wherein the type NM-B cable extends from the body of the male prong connector transversely to the longitudinal axis of the male prong connector. 2. The power cord of claim 1, wherein each of the female receptacle connector and male prong connector further comprises a flange extending from the body along a plane parallel to the front face or perpendicular to the longitudinal axis of the body. 3. The power cord of claim 2, wherein the flange of each of the female receptacle connector and male prong connector is offset from the front face along the longitudinal axis of the body. 4. The power cord of claim 2, wherein the flange of each of the female receptacle connector and male prong connector extends circumferentially around the body. 5. The power cord of claim 1, wherein the type NM-B cable extends from the body of the female receptacle connector at a 90° angle to the longitudinal axis of the female receptacle connector; and
wherein the type NM-B cable extends from the body of the male prong connector at a 90° angle to the longitudinal axis of the male prong connector. 6. A power cord rated for use inside walls, comprising:
a first electrical connector disposed at a first end of a cable that is rated for use inside walls and a second electrical connector disposed at a second end of the cable; wherein each of the first electrical connector and second electrical connector comprises a body defining a front face providing electrical connection points, the body defining a longitudinal axis normal to the front face; wherein the cable extends from the body of the first electrical connector transversely to the longitudinal axis of the first electrical connector; and wherein the cable extends from the body of the second electrical connector transversely to the longitudinal axis of the second electrical connector. 7. The power cord of claim 6, wherein each of the first electrical connector and second electrical connector further comprises a flange extending from the body along a plane parallel to the front face or perpendicular to the longitudinal axis of the body. 8. The power cord of claim 7, wherein the flange of each of the first electrical connector and second electrical connector is offset from the front face along the longitudinal axis of the body. 9. The power cord of claim 7, wherein the flange of each of the first electrical connector and second electrical connector extends circumferentially around the body 10. The power cord of claim 6, wherein the cable is a type NM-B cable. 11. The power cord of claim 6, wherein the first electrical connector is a female receptacle connector and the second electrical connector is a male prong connector. 12. The power cord of claim 6, wherein the first electrical connector and the second electrical connector are integrally formed with the cable to form a unitary power cord. 13. The power cord of claim 6, wherein the cable extends from the body of the first electrical connector at a 90° angle to the axis normal to the front face of the first electrical connector; and
wherein the cable extends from the body of the second electrical connector at a 90° angle to the axis normal to the front face of the second electrical connector. 14. An electrical connector assembly for routing power cords or audio/video cables inside a wall, the assembly comprising:
a power cord terminating with a first electrical connector integrally provided at a first end of the power cord and terminating with a second electrical connector integrally provided at a second end of the power cord; wherein the power cord comprises a type of cable that is rated for use inside walls; a first wall grommet comprising a housing configured to be secured to the first electrical connector at the first end of the power cord; and a second wall grommet comprising a housing configured to be secured to the second electrical connector at the second end of the power cord; wherein each of the first wall grommet and second wall grommet is configured to be inserted through a hole in a surface of a wall and mounted in the wall, such that the power cord can be routed through an interior space of the wall. 15. The electrical connector assembly according to claim 14,
wherein the housing of the first wall grommet is configured to be secured to the first electrical connector on the first end of the power cord such that the first electrical connector is recessed from the surface of the wall when the housing of the first wall grommet is mounted in the wall; and wherein the housing of the second wall grommet is configured to be secured to the second electrical connector on the second end of the power cord such that the second connector is recessed from the surface of the wall when the housing of the second wall grommet is mounted in the wall. 16. The electrical connector assembly according to claim 15, wherein the housing of each of the first wall grommet and the second wall grommet defines a front opening, a front interior space, a back interior space, and an interior wall separating the front interior space and the back interior space, the interior wall having a vertical portion defining a connector opening that connects the front interior space and the back interior space. 17. The electrical connector assembly according to claim 16,
wherein the back interior space defined by the housing of the first wall grommet is configured to accommodate the first electrical connector at the first end of the power cord, such that the first electrical connector at the first end of the power cord is accessible from the front opening and front interior space of the housing through the electrical-connector opening; and wherein the back interior space defined by the housing of the second wall grommet is configured to accommodate the second electrical connector at the second end of the power cord, such that the second electrical connector at the second end of the power cord is accessible from the front opening and front interior space of the housing through the electrical-connector opening. 18. The electrical connector assembly according to claim 17, wherein the housing of each of the first wall grommet and the second wall grommet defines a power cord opening to the back interior space configured to allow the power cord to extend out of the housing transversely to a longitudinal axis of the housing. 19. The electrical connector assembly according to claim 16,
wherein the housing of each of the first wall grommet and the second wall grommet further comprises an egress opening providing access to the front interior space of the housing; wherein a portion of the interior wall of each of the first wall grommet and the second wall grommet curves from a back edge of the wire egress opening toward the front interior space and the front opening; and wherein the curved portion of the interior wall and the egress opening of each of the first wall grommet and the second wall grommet are configured such that a cable can be routed from the front opening of the housing of either the first wall grommet or the second wall grommet, through the front interior space of the housing of that wall grommet, out through the egress opening of that wall grommet, and into the interior space of the wall when that housing is mounted in the wall. 20. The electrical connector assembly according to claim 16,
wherein each of the first and second electrical connectors comprises a flange configured to engage the interior wall of the housing around the electrical-connector opening; wherein each of the first and second electrical connectors comprises a front face protruding from the flange such that the front face of the electrical connector extends through the electrical-connector opening when the flange engages the interior wall of the housing around the electrical-connector opening. | 2,800 |
12,208 | 12,208 | 16,012,192 | 2,837 | An exemplary contactor assembly includes, among other things, a movable contact that transitions relative to a plurality of stationary contacts back and forth between a closed position and an open position. The movable contact contacts at least one of the stationary contacts with an initial contact surface and then a final contact surface when the movable contact is in the closed position. An exemplary contactor transitioning method includes, among other things, changing areas of contact between a movable contact and a plurality of stationary contacts when the movable contact is in a closed position with the plurality of stationary contacts. | 1. A contactor assembly, comprising:
a movable contact that transitions relative to a plurality of stationary contacts back and forth between a closed position and an open position, the movable contact contacting at least one of the stationary contacts with an initial contact surface and then a final contact surface when the movable contact is in the closed position. 2. The contactor assembly of claim 1, wherein the initial contact surface resides in a first plane, and the final contact surface resides in a second plane that is transverse to the first plane. 3. The contactor assembly of claim 1, wherein the movable contact includes an attachment section disposed between a first tab and a second tab relative to a longitudinal axis of the movable contact. 4. The contactor assembly of claim 3, wherein the first and second tabs are tilted about the longitudinal axis of the movable contact relative to the attachment section. 5. The contactor assembly of claim 3, wherein the first tab contacts a first one of the stationary contacts and the second tab contacts a second one of the stationary contacts when the movable contact is in the closed position. 6. The contactor assembly of claim 1, further comprising a first and second tab of the movable contact, the initial contact surface a first initial contact surface of the first tab, the final contact surface a first final contact surface of the first tab, wherein the movable contact includes a second initial contact surface and a second final contact surface of the second tab. 7. The contactor assembly of claim 1, further comprising an actuator assembly that engages the movable contact, the actuator assembly transitioning the movable contact back and forth between the closed position and the open position. 8. The contactor assembly of claim 7, wherein the actuator assembly extends through an aperture in the movable contact. 9. The contactor assembly of claim 8, wherein the aperture is an ellipse having a first diameter and a second diameter that is less than the first diameter, the second diameter aligned with the longitudinal axis. 10. The contactor assembly of claim 7, wherein the movable contact is configured to rotate relative to the actuator assembly about a longitudinal axis of the movable contact when the movable contact is in the closed position. 11. The contactor assembly of claim 1, wherein the movable contact in the closed position electrically couples a battery pack of an electrified vehicle to another portion of the electrified vehicle, and the movable contact in the open position electrically decouples the battery pack from the other portion of the electrified vehicle. 12. A contactor transitioning method, comprising:
changing areas of contact between a movable contact and a plurality of stationary contacts when the movable contact is in a closed position with the plurality of stationary contacts. 13. The contactor transitioning method of claim 12, further comprising transitioning the movable contact from the closed position to an open position with a plurality of stationary contacts. 14. The contactor transitioning method of claim 12, further comprising, when the movable contact is in the closed position, contacting the plurality of stationary contacts with initial contact surfaces of the movable contact, and then contacting the plurality of stationary contacts with final contact surfaces. 15. The contactor transitioning method of claim 14, wherein the initial contact surfaces reside in respective first planes, and the final contact surfaces reside in respective second planes that are transverse to the first planes. 16. The contactor transitioning method of claim 12, further comprising rotating the movable contact relative to the stationary contacts during the changing. 17. The contactor transitioning method of claim 16, wherein the rotating is about a longitudinal axis of the movable contact. 18. The contactor transitioning method of claim 12, further comprising using an actuator assembly to transition the movable contact back and forth between the closed position and an open position, and rotating the movable contact relative to the actuator assembly during the changing. 19. The contactor transitioning method of claim 12, further comprising transitioning the contact bar from the closed position to an open position to electrically decouple a battery pack of an electrified vehicle from another portion of the electrified vehicle. | An exemplary contactor assembly includes, among other things, a movable contact that transitions relative to a plurality of stationary contacts back and forth between a closed position and an open position. The movable contact contacts at least one of the stationary contacts with an initial contact surface and then a final contact surface when the movable contact is in the closed position. An exemplary contactor transitioning method includes, among other things, changing areas of contact between a movable contact and a plurality of stationary contacts when the movable contact is in a closed position with the plurality of stationary contacts.1. A contactor assembly, comprising:
a movable contact that transitions relative to a plurality of stationary contacts back and forth between a closed position and an open position, the movable contact contacting at least one of the stationary contacts with an initial contact surface and then a final contact surface when the movable contact is in the closed position. 2. The contactor assembly of claim 1, wherein the initial contact surface resides in a first plane, and the final contact surface resides in a second plane that is transverse to the first plane. 3. The contactor assembly of claim 1, wherein the movable contact includes an attachment section disposed between a first tab and a second tab relative to a longitudinal axis of the movable contact. 4. The contactor assembly of claim 3, wherein the first and second tabs are tilted about the longitudinal axis of the movable contact relative to the attachment section. 5. The contactor assembly of claim 3, wherein the first tab contacts a first one of the stationary contacts and the second tab contacts a second one of the stationary contacts when the movable contact is in the closed position. 6. The contactor assembly of claim 1, further comprising a first and second tab of the movable contact, the initial contact surface a first initial contact surface of the first tab, the final contact surface a first final contact surface of the first tab, wherein the movable contact includes a second initial contact surface and a second final contact surface of the second tab. 7. The contactor assembly of claim 1, further comprising an actuator assembly that engages the movable contact, the actuator assembly transitioning the movable contact back and forth between the closed position and the open position. 8. The contactor assembly of claim 7, wherein the actuator assembly extends through an aperture in the movable contact. 9. The contactor assembly of claim 8, wherein the aperture is an ellipse having a first diameter and a second diameter that is less than the first diameter, the second diameter aligned with the longitudinal axis. 10. The contactor assembly of claim 7, wherein the movable contact is configured to rotate relative to the actuator assembly about a longitudinal axis of the movable contact when the movable contact is in the closed position. 11. The contactor assembly of claim 1, wherein the movable contact in the closed position electrically couples a battery pack of an electrified vehicle to another portion of the electrified vehicle, and the movable contact in the open position electrically decouples the battery pack from the other portion of the electrified vehicle. 12. A contactor transitioning method, comprising:
changing areas of contact between a movable contact and a plurality of stationary contacts when the movable contact is in a closed position with the plurality of stationary contacts. 13. The contactor transitioning method of claim 12, further comprising transitioning the movable contact from the closed position to an open position with a plurality of stationary contacts. 14. The contactor transitioning method of claim 12, further comprising, when the movable contact is in the closed position, contacting the plurality of stationary contacts with initial contact surfaces of the movable contact, and then contacting the plurality of stationary contacts with final contact surfaces. 15. The contactor transitioning method of claim 14, wherein the initial contact surfaces reside in respective first planes, and the final contact surfaces reside in respective second planes that are transverse to the first planes. 16. The contactor transitioning method of claim 12, further comprising rotating the movable contact relative to the stationary contacts during the changing. 17. The contactor transitioning method of claim 16, wherein the rotating is about a longitudinal axis of the movable contact. 18. The contactor transitioning method of claim 12, further comprising using an actuator assembly to transition the movable contact back and forth between the closed position and an open position, and rotating the movable contact relative to the actuator assembly during the changing. 19. The contactor transitioning method of claim 12, further comprising transitioning the contact bar from the closed position to an open position to electrically decouple a battery pack of an electrified vehicle from another portion of the electrified vehicle. | 2,800 |
12,209 | 12,209 | 15,691,317 | 2,856 | A vehicle computer is described that includes a processor and memory storing instructions executable by the processor. The instructions may include, to: determine a vehicle speed; determine, for a first wheel, a first vibration profile; determine, for a second wheel, a second vibration profile that includes a roadway disturbance input; and using the speed and the two profiles, determine a wheel imbalance at the first wheel. | 1. A method, comprising:
at a vehicle computer:
determining a vehicle speed;
determining, for a first wheel, a first vibration profile;
determining, for a second wheel, a second vibration profile that includes a roadway disturbance input; and
using the speed and the two profiles, determining a wheel imbalance at the first wheel. 2. The method of claim 1, further comprising, at the computer: using a wheelbase distance to determine the imbalance. 3. The method of claim 2, wherein the first and second wheels are on a common side of a vehicle. 4. The method of claim 1, wherein determining the imbalance comprises determining an absence of correlation between a vibration magnitude in the first vibration profile and the input of the second vibration profile. 5. The method of claim 1, wherein determining the imbalance further comprises: determining a vibration profile for each of a plurality of wheels in the vehicle; and determining that the vibration magnitude of one profile is a threshold larger than vibration magnitudes associated with a remainder of the plurality. 6. The method of claim 1, wherein the first and second vibration profiles comprise acceleration data. 7. The method of claim 6, wherein the acceleration data is provided to the computer via one or more accelerometers located at each of the first and second wheels. 8. The method of claim 6, wherein the first and second vibration profiles further comprise rotational-rate data. 9. The method of claim 8, wherein the rotational-rate data is provided to the computer via one or more rotational-rate sensors which comprise one of an antilock brake system, an electronic stability control system, or a roll stability control system. 10. The method of claim 1, further comprising distinguishing debris captured within a tire tread from wheel imbalance. 11. A method, comprising:
for a vehicle:
determining, for a first wheel, a first vibration profile;
determining, for a second wheel, a second vibration profile that includes a roadway disturbance input;
attempting to correlate the first and second profiles; and
based on an absence of correlation, determining a wheel imbalance at the first wheel. 12. The method of claim 11, further comprising performing at least a portion of the wheel imbalance determination at a remote server. 13. A computer, comprising:
a processor and memory storing instructions executable by the processor, the instructions comprising, to:
determine a vehicle speed;
determine, for a first wheel, a first vibration profile;
determine, for a second wheel, a second vibration profile that includes a roadway disturbance input; and
using the speed and the two profiles, determine a wheel imbalance at the first wheel. 14. The computer of claim 13, wherein the instructions further comprise, to: use a wheelbase distance to determine the imbalance. 15. The computer of claim 13, wherein the first and second wheels are on a common side of a vehicle. 16. The computer of claim 13, wherein the instructions to determine the imbalance further comprise, to: determine an absence of correlation between a vibration magnitude in the first vibration profile and the input of the second vibration profile. 17. The computer of claim 13, wherein the instructions to determine the imbalance further comprise, to: determine a vibration profile for each of a plurality of wheels in the vehicle; and determine that the vibration magnitude of one profile is a threshold larger than vibration magnitudes associated with a remainder of the plurality. 18. The computer of claim 13, wherein the first and second vibration profiles comprise acceleration data. 19. The computer of claim 18, wherein the acceleration data is provided to the computer via one or more accelerometers located at each of the first and second wheels. 20. The computer of claim 19, wherein the first and second vibration profiles further comprise rotational-rate data. | A vehicle computer is described that includes a processor and memory storing instructions executable by the processor. The instructions may include, to: determine a vehicle speed; determine, for a first wheel, a first vibration profile; determine, for a second wheel, a second vibration profile that includes a roadway disturbance input; and using the speed and the two profiles, determine a wheel imbalance at the first wheel.1. A method, comprising:
at a vehicle computer:
determining a vehicle speed;
determining, for a first wheel, a first vibration profile;
determining, for a second wheel, a second vibration profile that includes a roadway disturbance input; and
using the speed and the two profiles, determining a wheel imbalance at the first wheel. 2. The method of claim 1, further comprising, at the computer: using a wheelbase distance to determine the imbalance. 3. The method of claim 2, wherein the first and second wheels are on a common side of a vehicle. 4. The method of claim 1, wherein determining the imbalance comprises determining an absence of correlation between a vibration magnitude in the first vibration profile and the input of the second vibration profile. 5. The method of claim 1, wherein determining the imbalance further comprises: determining a vibration profile for each of a plurality of wheels in the vehicle; and determining that the vibration magnitude of one profile is a threshold larger than vibration magnitudes associated with a remainder of the plurality. 6. The method of claim 1, wherein the first and second vibration profiles comprise acceleration data. 7. The method of claim 6, wherein the acceleration data is provided to the computer via one or more accelerometers located at each of the first and second wheels. 8. The method of claim 6, wherein the first and second vibration profiles further comprise rotational-rate data. 9. The method of claim 8, wherein the rotational-rate data is provided to the computer via one or more rotational-rate sensors which comprise one of an antilock brake system, an electronic stability control system, or a roll stability control system. 10. The method of claim 1, further comprising distinguishing debris captured within a tire tread from wheel imbalance. 11. A method, comprising:
for a vehicle:
determining, for a first wheel, a first vibration profile;
determining, for a second wheel, a second vibration profile that includes a roadway disturbance input;
attempting to correlate the first and second profiles; and
based on an absence of correlation, determining a wheel imbalance at the first wheel. 12. The method of claim 11, further comprising performing at least a portion of the wheel imbalance determination at a remote server. 13. A computer, comprising:
a processor and memory storing instructions executable by the processor, the instructions comprising, to:
determine a vehicle speed;
determine, for a first wheel, a first vibration profile;
determine, for a second wheel, a second vibration profile that includes a roadway disturbance input; and
using the speed and the two profiles, determine a wheel imbalance at the first wheel. 14. The computer of claim 13, wherein the instructions further comprise, to: use a wheelbase distance to determine the imbalance. 15. The computer of claim 13, wherein the first and second wheels are on a common side of a vehicle. 16. The computer of claim 13, wherein the instructions to determine the imbalance further comprise, to: determine an absence of correlation between a vibration magnitude in the first vibration profile and the input of the second vibration profile. 17. The computer of claim 13, wherein the instructions to determine the imbalance further comprise, to: determine a vibration profile for each of a plurality of wheels in the vehicle; and determine that the vibration magnitude of one profile is a threshold larger than vibration magnitudes associated with a remainder of the plurality. 18. The computer of claim 13, wherein the first and second vibration profiles comprise acceleration data. 19. The computer of claim 18, wherein the acceleration data is provided to the computer via one or more accelerometers located at each of the first and second wheels. 20. The computer of claim 19, wherein the first and second vibration profiles further comprise rotational-rate data. | 2,800 |
12,210 | 12,210 | 16,310,064 | 2,853 | The present disclosure is drawn to aqueous ink compositions, methods of printing on offset coated print media, and printing systems. In one example, the aqueous ink compositions can include from 2 wt % to 5 wt % pigment, from 70 wt % to 95 wt % water, from 1 wt % to 10 wt % binder, from 0.1 wt % to 3 wt % non-ionic surfactant, from 1 wt % to 15 wt % humectant solvent including a hydrophilic group, and from 0.3 wt % to 4.5 wt % non-volatile glycol ether co-solvent having a boiling point of 220 C or greater. | 1. An aqueous ink composition, comprising:
from 2 wt % to 5 wt % pigment, from 70 wt % to 95 wt % water, from 1 wt % to 10 wt % binder, from 0.1 wt % to 3 wt % non-ionic surfactant, from 1 wt % to 15 wt % humectant solvent including a hydrophilic group, and from 0.3 wt % to 4.5 wt % non-volatile glycol ether co-solvent having a boiling point of 220° C. or greater. 2. The aqueous ink composition of claim 1, wherein the binder comprises polyurethane, polyurea, polyurethane with a curable double bond, polyurethane-graph polyol, or a combination thereof. 3. The aqueous ink composition of claim 1, wherein the binder comprises polyurethane-graph polyol. 4. The aqueous ink composition of claim 1, wherein the humectant solvent comprises glycerol, di-(2-hydroxyethyl)-5, 5 dimethylhydantoin, tetraethylene glycol, tripropylene glycol, 2-hydroxyethyl pyrrolidone (2HE2P), or combinations thereof. 5. The aqueous ink composition of claim 1, wherein the boiling point of the non-volatile glycol ether co-solvent is 240° C. or greater. 6. The aqueous ink composition of claim 1, wherein the non-volatile glycol ether co-solvent comprises tripropyleneglycol methyl ether, dipropylene glycol butyl ether, diethylene glycol ethyl ether, propylene glycol phenyl ether, or a combination thereof. 7. The aqueous ink composition of claim 1, wherein the non-volatile glycol ether co-solvent is present at from 1 wt % to 3 wt %. 8. The aqueous ink composition of claim 1, having a viscosity from 1 cps to 4 cps. 9. The aqueous ink composition of claim 1, wherein the aqueous ink composition dries within 1 to 15 seconds when printed at 1 to 5 dpp coverage on an offset coated print medium. 10. A method of printing on offset coated print media, comprising:
applying an aqueous ink composition to an offset coated print medium, wherein the aqueous ink composition comprises pigment and a liquid vehicle including water, binder, non-ionic surfactant, humectant solvent, and from 0.3 wt % to 4.5 wt % of a non-volatile glycol ether co-solvent based on the aqueous ink composition content as a whole, wherein the non-volatile glycol co-solvent has a boiling point of 220° C. or greater; penetrating the non-volatile glycol ether co-solvent into the offset coated print medium to assist with drawing other liquid vehicle components into the offset coated print medium; and passing the offset coated print medium printed with the aqueous ink composition along and in contact with a heated roller. 11. The method of claim 10, wherein the method is carried out at a printing speed from 100 fpm to 800 fpm. 12. The method of claim 10, wherein the heated roller is at a temperature from 70° C. to 140° C. 13. A printing system, comprising:
an aqueous ink composition, including pigment, water, binder, non-ionic surfactant, humectant solvent including a hydrophilic group, and from 0.3 wt % to 4.5 wt % non-volatile glycol ether co-solvent having a boiling point of 220° C. or greater; and an offset coated print medium. 14. The printing system of claim 13, wherein the non-volatile glycol ether co-solvent comprises tripropyleneglycol methyl ether, dipropylene glycol butyl ether, diethylene glycol ethyl ether, propylene glycol phenyl ether, or a combination thereof, and is present at from 1 wt % to 3 wt %. 15. The printing system of claim 13, wherein the pigment is present from 2 wt % to 5 wt %, the water is present at from 70 wt % to 95 wt %, the binder is present at from 1 wt % to 10 wt %, the non-ionic surfactant is present at from 0.1 wt % to 3 wt %, and the humectants is present at from 1 wt % to 15 wt %. | The present disclosure is drawn to aqueous ink compositions, methods of printing on offset coated print media, and printing systems. In one example, the aqueous ink compositions can include from 2 wt % to 5 wt % pigment, from 70 wt % to 95 wt % water, from 1 wt % to 10 wt % binder, from 0.1 wt % to 3 wt % non-ionic surfactant, from 1 wt % to 15 wt % humectant solvent including a hydrophilic group, and from 0.3 wt % to 4.5 wt % non-volatile glycol ether co-solvent having a boiling point of 220 C or greater.1. An aqueous ink composition, comprising:
from 2 wt % to 5 wt % pigment, from 70 wt % to 95 wt % water, from 1 wt % to 10 wt % binder, from 0.1 wt % to 3 wt % non-ionic surfactant, from 1 wt % to 15 wt % humectant solvent including a hydrophilic group, and from 0.3 wt % to 4.5 wt % non-volatile glycol ether co-solvent having a boiling point of 220° C. or greater. 2. The aqueous ink composition of claim 1, wherein the binder comprises polyurethane, polyurea, polyurethane with a curable double bond, polyurethane-graph polyol, or a combination thereof. 3. The aqueous ink composition of claim 1, wherein the binder comprises polyurethane-graph polyol. 4. The aqueous ink composition of claim 1, wherein the humectant solvent comprises glycerol, di-(2-hydroxyethyl)-5, 5 dimethylhydantoin, tetraethylene glycol, tripropylene glycol, 2-hydroxyethyl pyrrolidone (2HE2P), or combinations thereof. 5. The aqueous ink composition of claim 1, wherein the boiling point of the non-volatile glycol ether co-solvent is 240° C. or greater. 6. The aqueous ink composition of claim 1, wherein the non-volatile glycol ether co-solvent comprises tripropyleneglycol methyl ether, dipropylene glycol butyl ether, diethylene glycol ethyl ether, propylene glycol phenyl ether, or a combination thereof. 7. The aqueous ink composition of claim 1, wherein the non-volatile glycol ether co-solvent is present at from 1 wt % to 3 wt %. 8. The aqueous ink composition of claim 1, having a viscosity from 1 cps to 4 cps. 9. The aqueous ink composition of claim 1, wherein the aqueous ink composition dries within 1 to 15 seconds when printed at 1 to 5 dpp coverage on an offset coated print medium. 10. A method of printing on offset coated print media, comprising:
applying an aqueous ink composition to an offset coated print medium, wherein the aqueous ink composition comprises pigment and a liquid vehicle including water, binder, non-ionic surfactant, humectant solvent, and from 0.3 wt % to 4.5 wt % of a non-volatile glycol ether co-solvent based on the aqueous ink composition content as a whole, wherein the non-volatile glycol co-solvent has a boiling point of 220° C. or greater; penetrating the non-volatile glycol ether co-solvent into the offset coated print medium to assist with drawing other liquid vehicle components into the offset coated print medium; and passing the offset coated print medium printed with the aqueous ink composition along and in contact with a heated roller. 11. The method of claim 10, wherein the method is carried out at a printing speed from 100 fpm to 800 fpm. 12. The method of claim 10, wherein the heated roller is at a temperature from 70° C. to 140° C. 13. A printing system, comprising:
an aqueous ink composition, including pigment, water, binder, non-ionic surfactant, humectant solvent including a hydrophilic group, and from 0.3 wt % to 4.5 wt % non-volatile glycol ether co-solvent having a boiling point of 220° C. or greater; and an offset coated print medium. 14. The printing system of claim 13, wherein the non-volatile glycol ether co-solvent comprises tripropyleneglycol methyl ether, dipropylene glycol butyl ether, diethylene glycol ethyl ether, propylene glycol phenyl ether, or a combination thereof, and is present at from 1 wt % to 3 wt %. 15. The printing system of claim 13, wherein the pigment is present from 2 wt % to 5 wt %, the water is present at from 70 wt % to 95 wt %, the binder is present at from 1 wt % to 10 wt %, the non-ionic surfactant is present at from 0.1 wt % to 3 wt %, and the humectants is present at from 1 wt % to 15 wt %. | 2,800 |
12,211 | 12,211 | 15,525,613 | 2,861 | Method for determining the influence of least a first and a second experimental parameter on a liquid chromatography protocol for purifying one or more target molecules from a sample, comprising the steps: —performing chromatography purifications of the sample at a plurality of different experimental conditions where at least the first and the second experimental parameter each are varied over a predetermined range, each purification being registered as a chromatogram by monitoring an output parameter indicative of the purification result during the purification; and —displaying in a graphical user interface at least a subset of the registered chromatograms as chromatogram-miniatures in an evaluation diagram wherein the position of each displayed chromatogram-miniature is determined by the experimental parameters for the corresponding purification, thereby allowing a user to visually determine trends and the influence of the experimental parameters on the liquid chromatography protocol. | 1. Method for determining the influence of least a first and a second experimental parameter on a liquid chromatography protocol for purifying one or more target molecules from a sample, comprising the steps:
performing chromatography purifications of the sample at a plurality of different experimental conditions where at least the first and the second experimental parameter each are varied over a predetermined range, each purification being registered as a chromatogram by monitoring an output parameter indicative of the purification result during the purification; and displaying in a graphical user interface at least a subset of the registered chromatograms as chromatogram-miniatures in an evaluation diagram wherein the position of each displayed chromatogram-miniature is determined by the experimental parameters for the corresponding purification, thereby allowing a user to visually determine trends and the influence of the experimental parameters on the liquid chromatography protocol. 2. Method according to claim 1 wherein each chromatography purification involves one or more of: affinity chromatography, flow-through chromatography, ion exchange chromatography, size-exclusion chromatography, reversed-phase chromatography, simulated moving-bed chromatography, hydrophobic interaction chromatography, chromatofocusing. 3. Method according to claim 1 wherein the experimental parameters are selected from: eluent ionic strength, eluent pH, eluent flow rate, eluent type, column characteristics, chromatography media characteristics, load pH, load conductivity, load concentration, load mass, load HCP, load additive, wash volume, wash pH, wash conductivity, wash additive, step elution level, Step elution volume, gradient target level, gradient volume, cut OD, buffer system, media type, bed height, flow velocity, residence time, type of salt, solvent, buffer additive. 4. Method according to claim 1 wherein each purification being registered as two or more chromatograms by monitoring two or more output parameters during the purification. 5. Method according to claim 1 wherein the output parameter(s) is selected from the group of: UV absorbance at one or more wavelengths, conductivity, light scattering detection, fluorescence emission, mass-spectroscopy, registered flow, registered pH, registered pressure. 6. Method according to claim 1 comprising repeating the steps of performing chromatography purification and displaying registered chromatograms, wherein at least one of the first and the second experimental parameter is varied over a narrower range, as determined from the step of displaying registered chromatograms. 7. Method according to claim 1 wherein the diagram comprises a matrix representation where chromatogram-miniatures are positioned based on the relative order of the experimental parameters for the corresponding experiment. 8. Method according to claim 7 comprising the step of predicting the chromatogram for experimental parameters in the diagram and displaying predicted chromatogram miniatures in matrix positions where experimental chromatogram miniatures are not available. 9. Method according to claim 8 wherein predicted chromatogram-miniatures are graphically distinguishable from experimental chromatogram-miniatures. 10. Method according to claim 1 wherein the diagram comprises a coordinate system having a first dimension representing the value of the first experimental parameter and having a second dimension representing the value of the second experimental parameter and wherein the chromatogram-miniatures are positioned at the coordinates defined by the experimental parameters for the corresponding experiment. 11. Method according to claim 10 comprising the step of defining chromatography protocol parameters for a subsequent chromatography purification experiment by selecting one or more experimental parameter coordinates in the diagram. 12. Method according to claim 10 comprising the step of, in response to a user selection in the diagram, predicting the chromatogram for experimental parameter coordinates in the diagram and displaying an predicted chromatogram. 13. Method according to claim 1 wherein the different experimental conditions involve varying one or more additional experimental parameter. 14. Method according to claim 13 wherein at least one of the additional experimental parameters is displayed as an overlay diagram wherein the parameter value can be scrolled. 15. Method according to claim 13 wherein one of the additional experimental parameters is displayed in the chromatogram miniatures as third dimension. 16. Method according to claim 1 wherein the plurality of different experimental conditions are determined using a statistical design of experiments (DoE) module. 17. Method according to claim 1 wherein two or more chromatograms are registered for the same experimental parameters, and wherein the two or more chromatograms are displayed in the same chromatogram miniature or as individual chromatogram miniatures grouped around the experimental parameter position. 18. Method according to claim 1 wherein all chromatogram miniatures are displayed using a normalized scale. 19. Method according to claim 1 further comprising the step of evaluating one or more chromatogram to determine one or more quality metrics associated with the chromatogram, and wherein the quality metric(s) is displayed in the diagram in combination with the chromatogram miniatures. 20. Method according to claim 18 wherein one quality metric is derived from one or more of the output parameters and is selected from the group of: resolution, efficiency, selectivity, peak area, asymmetry, and peak-broadening of the chromatogram. 21. Method according to claim 18 wherein one quality metric is derived from a purification result parameter selected from the group of: purity, purification time, yield, biological activity, results from external analysis of the purified sample, an output parameter different than the displayed parameter and purification cost. 22. Method according to claim 1 wherein two or more chromatograms are presented in an overlay plots following a drag and drop operation on the chromatogram miniatures performed by a user. 23. Liquid chromatography system arranged to perform the method according to claim 1. 24. Liquid chromatography system according to claim 23 comprising:
an experiment design module configured to allow a user to define an experimental sequence of liquid chromatography purification protocols for determining the influence of at least a first and a second experimental parameter on a liquid chromatography protocol for purifying one or more target molecules from a sample, the experimental sequence comprising a plurality of different experimental conditions where at least a first and a second experimental parameter each are varied over a predetermined range;
an purification control module for controlling the operation of the chromatography system in accordance with the experimental sequence,
and purification registration module for registering the result of each purification as a chromatogram by monitoring an output parameter during the purification,
an purification evaluation module arranged to present on a display at least a subset of the registered chromatograms as chromatogram-miniatures in a diagram wherein the position of each displayed chromatogram-miniature is determined by the experimental parameters for the corresponding purification, thereby allowing a user to visually determine trends and the influence of the experimental parameters on the liquid chromatography protocol. 25. Computer program arranged to perform the method of claim 1 when executed on a computer comprising processor and a display unit. | Method for determining the influence of least a first and a second experimental parameter on a liquid chromatography protocol for purifying one or more target molecules from a sample, comprising the steps: —performing chromatography purifications of the sample at a plurality of different experimental conditions where at least the first and the second experimental parameter each are varied over a predetermined range, each purification being registered as a chromatogram by monitoring an output parameter indicative of the purification result during the purification; and —displaying in a graphical user interface at least a subset of the registered chromatograms as chromatogram-miniatures in an evaluation diagram wherein the position of each displayed chromatogram-miniature is determined by the experimental parameters for the corresponding purification, thereby allowing a user to visually determine trends and the influence of the experimental parameters on the liquid chromatography protocol.1. Method for determining the influence of least a first and a second experimental parameter on a liquid chromatography protocol for purifying one or more target molecules from a sample, comprising the steps:
performing chromatography purifications of the sample at a plurality of different experimental conditions where at least the first and the second experimental parameter each are varied over a predetermined range, each purification being registered as a chromatogram by monitoring an output parameter indicative of the purification result during the purification; and displaying in a graphical user interface at least a subset of the registered chromatograms as chromatogram-miniatures in an evaluation diagram wherein the position of each displayed chromatogram-miniature is determined by the experimental parameters for the corresponding purification, thereby allowing a user to visually determine trends and the influence of the experimental parameters on the liquid chromatography protocol. 2. Method according to claim 1 wherein each chromatography purification involves one or more of: affinity chromatography, flow-through chromatography, ion exchange chromatography, size-exclusion chromatography, reversed-phase chromatography, simulated moving-bed chromatography, hydrophobic interaction chromatography, chromatofocusing. 3. Method according to claim 1 wherein the experimental parameters are selected from: eluent ionic strength, eluent pH, eluent flow rate, eluent type, column characteristics, chromatography media characteristics, load pH, load conductivity, load concentration, load mass, load HCP, load additive, wash volume, wash pH, wash conductivity, wash additive, step elution level, Step elution volume, gradient target level, gradient volume, cut OD, buffer system, media type, bed height, flow velocity, residence time, type of salt, solvent, buffer additive. 4. Method according to claim 1 wherein each purification being registered as two or more chromatograms by monitoring two or more output parameters during the purification. 5. Method according to claim 1 wherein the output parameter(s) is selected from the group of: UV absorbance at one or more wavelengths, conductivity, light scattering detection, fluorescence emission, mass-spectroscopy, registered flow, registered pH, registered pressure. 6. Method according to claim 1 comprising repeating the steps of performing chromatography purification and displaying registered chromatograms, wherein at least one of the first and the second experimental parameter is varied over a narrower range, as determined from the step of displaying registered chromatograms. 7. Method according to claim 1 wherein the diagram comprises a matrix representation where chromatogram-miniatures are positioned based on the relative order of the experimental parameters for the corresponding experiment. 8. Method according to claim 7 comprising the step of predicting the chromatogram for experimental parameters in the diagram and displaying predicted chromatogram miniatures in matrix positions where experimental chromatogram miniatures are not available. 9. Method according to claim 8 wherein predicted chromatogram-miniatures are graphically distinguishable from experimental chromatogram-miniatures. 10. Method according to claim 1 wherein the diagram comprises a coordinate system having a first dimension representing the value of the first experimental parameter and having a second dimension representing the value of the second experimental parameter and wherein the chromatogram-miniatures are positioned at the coordinates defined by the experimental parameters for the corresponding experiment. 11. Method according to claim 10 comprising the step of defining chromatography protocol parameters for a subsequent chromatography purification experiment by selecting one or more experimental parameter coordinates in the diagram. 12. Method according to claim 10 comprising the step of, in response to a user selection in the diagram, predicting the chromatogram for experimental parameter coordinates in the diagram and displaying an predicted chromatogram. 13. Method according to claim 1 wherein the different experimental conditions involve varying one or more additional experimental parameter. 14. Method according to claim 13 wherein at least one of the additional experimental parameters is displayed as an overlay diagram wherein the parameter value can be scrolled. 15. Method according to claim 13 wherein one of the additional experimental parameters is displayed in the chromatogram miniatures as third dimension. 16. Method according to claim 1 wherein the plurality of different experimental conditions are determined using a statistical design of experiments (DoE) module. 17. Method according to claim 1 wherein two or more chromatograms are registered for the same experimental parameters, and wherein the two or more chromatograms are displayed in the same chromatogram miniature or as individual chromatogram miniatures grouped around the experimental parameter position. 18. Method according to claim 1 wherein all chromatogram miniatures are displayed using a normalized scale. 19. Method according to claim 1 further comprising the step of evaluating one or more chromatogram to determine one or more quality metrics associated with the chromatogram, and wherein the quality metric(s) is displayed in the diagram in combination with the chromatogram miniatures. 20. Method according to claim 18 wherein one quality metric is derived from one or more of the output parameters and is selected from the group of: resolution, efficiency, selectivity, peak area, asymmetry, and peak-broadening of the chromatogram. 21. Method according to claim 18 wherein one quality metric is derived from a purification result parameter selected from the group of: purity, purification time, yield, biological activity, results from external analysis of the purified sample, an output parameter different than the displayed parameter and purification cost. 22. Method according to claim 1 wherein two or more chromatograms are presented in an overlay plots following a drag and drop operation on the chromatogram miniatures performed by a user. 23. Liquid chromatography system arranged to perform the method according to claim 1. 24. Liquid chromatography system according to claim 23 comprising:
an experiment design module configured to allow a user to define an experimental sequence of liquid chromatography purification protocols for determining the influence of at least a first and a second experimental parameter on a liquid chromatography protocol for purifying one or more target molecules from a sample, the experimental sequence comprising a plurality of different experimental conditions where at least a first and a second experimental parameter each are varied over a predetermined range;
an purification control module for controlling the operation of the chromatography system in accordance with the experimental sequence,
and purification registration module for registering the result of each purification as a chromatogram by monitoring an output parameter during the purification,
an purification evaluation module arranged to present on a display at least a subset of the registered chromatograms as chromatogram-miniatures in a diagram wherein the position of each displayed chromatogram-miniature is determined by the experimental parameters for the corresponding purification, thereby allowing a user to visually determine trends and the influence of the experimental parameters on the liquid chromatography protocol. 25. Computer program arranged to perform the method of claim 1 when executed on a computer comprising processor and a display unit. | 2,800 |
12,212 | 12,212 | 15,149,054 | 2,829 | Provided are a capacitor of a semiconductor integrated circuit and a method for manufacturing the same, for example a metal-insulator-metal (MIM) type capacitor of a semiconductor integrated circuit, which is capable of improving adhesive force between an electrode layer and a dielectric layer of a capacitor, and a method for manufacturing the same. For example, the present disclosure provides a capacitor for a semiconductor integrated circuit having a new structure, which is capable of preventing a delamination phenomenon on an interface between a lower electrode layer and a dielectric layer by further forming a buffer layer, which is capable of decreasing or compensating for a difference in a coefficient of thermal expansion, between a metal electrode layer and a dielectric layer, particularly, between the lower electrode layer and the dielectric layer, and a method for manufacturing the same. | 1. A semiconductor integrated circuit, comprising:
a substrate comprising a substrate coefficient of thermal expansion (CTE); and a capacitor on the substrate and comprising:
a lower seed layer on a topmost substrate surface of the substrate and comprising a lower seed CTE;
a lower electrode layer on the lower seed layer and comprising a lower electrode CTE;
a buffer layer on the lower electrode layer and comprising a buffer CTE;
a dielectric layer on the buffer layer and comprising a dielectric CTE;
an upper seed layer on the dielectric layer and comprising an upper seed CTE; and
an upper electrode layer on the upper seed layer and comprising an upper electrode CTE;
wherein:
the lower electrode CTE is greater than the buffer CTE;
the buffer CTE is greater than the dielectric CTE;
the lower electrode CTE is greater than the lower seed CTE;
the lower seed CTE is greater than the substrate CTE;
the upper electrode CTE is greater than the upper seed CTE;
the upper seed CTE is greater than the dielectric CTE; and
a difference between the lower electrode CTE and the buffer CTE is greater than a difference between the buffer CTE and the dielectric CTE. 2. The semiconductor integrated circuit of claim 1, wherein:
the substrate comprises one or both of a semiconductor material and/or a glass material; each layer of the capacitor is formed on the substrate; materials of the lower seed layer, of the buffer layer, and of the upper seed layer are the same as each other; the lower seed layer comprises a plated layer onto the topmost substrate surface; the lower electrode layer comprises a plated layer plated onto the lower seed layer; the buffer layer comprises a sputtered layer sputtered onto the lower electrode layer; the dielectric layer comprises a chemical vapor deposition layer deposited onto the buffer layer; the upper seed layer comprises a plated layer plated onto the dielectric layer; and the upper electrode layer comprises a plated layer plated onto the upper seed layer. 3. A semiconductor integrated circuit, comprising:
a substrate; and a capacitor on the substrate and comprising:
a lower electrode layer coupled to the substrate and comprising a lower electrode coefficient of thermal expansion (CTE);
a buffer layer on the lower electrode layer and comprising a buffer CTE;
a dielectric layer on the buffer layer and comprising a dielectric CTE; and
an upper electrode layer on the dielectric layer;
wherein:
the lower electrode CTE is greater than the buffer CTE; and
the buffer CTE is greater than the dielectric CTE. 4. The semiconductor integrated circuit of claim 3, wherein:
the buffer layer comprises one or more of:
titanium-tungsten (TiW), titanium (Ti), chrome (Cr), and/or tungsten (W). 5. The semiconductor integrated circuit of claim 3, wherein:
the dielectric layer comprises one or more of:
silicon nitride (SiN), aluminum oxide (Al2O3), and/or hafnium oxide (HfO3). 6. The semiconductor integrated circuit of claim 3, wherein:
each layer of the capacitor is formed on the substrate. 7. The semiconductor integrated circuit of claim 3, wherein:
the substrate comprises one or both of a semiconductor material and/or a glass material. 8. The semiconductor integrated circuit of claim 3, wherein:
a difference between the lower electrode CTE and the buffer CTE is greater than a difference between the buffer CTE and the dielectric CTE. 9. The semiconductor integrated circuit of claim 3, comprising:
a lower seed layer between the substrate and the lower electrode layer and comprising a lower seed CTE; wherein:
the lower electrode CTE is greater than the lower seed CTE; and
the lower seed CTE is greater than a CTE of the substrate. 10. The semiconductor integrated circuit of claim 9, wherein:
materials of the lower seed layer and of the buffer layer are the same as each other. 11. The semiconductor integrated circuit of claim 9, comprising:
an upper seed layer between the dielectric layer and the upper electrode layer and comprising an upper seed CTE; wherein:
the upper electrode CTE is greater than the upper seed CTE; and
the upper seed CTE is greater than the dielectric CTE. 12. The semiconductor integrated circuit of claim 11, wherein:
materials of the lower seed layer, of the buffer layer, and of the upper seed layer are the same as each other. 13. The semiconductor integrated circuit of claim 3, wherein:
the buffer layer comprises a sputtered layer sputtered onto the lower electrode layer. 14. A method of manufacturing a capacitor for a semiconductor integrated circuit, the method comprising:
providing a substrate; and forming a capacitor on the substrate, said forming comprising:
forming a lower electrode layer on the substrate;
forming a buffer layer on the lower electrode layer;
forming a dielectric layer on the buffer layer; and
forming an upper electrode layer on the second seed layer;
wherein:
the lower electrode CTE of the lower electrode layer is greater than a buffer CTE of the buffer layer; and
the buffer CTE is greater than a dielectric CTE of the dielectric layer. 15. The method of claim 14, wherein:
the buffer layer is sputtered onto the lower electrode layer and comprises one or more of titanium-tungsten (TiW), titanium (Ti), chrome (Cr), and/or tungsten (W). 16. The method of claim 14, wherein:
the dielectric layer is formed by chemical vapor deposition onto the buffer layer and comprises one or more of silicon nitride (SiN), aluminum oxide (Al2O3), and/or hafnium oxide (HfO3). 17. The method of claim 14, wherein:
forming the capacitor comprises plating a lower seed layer on the substrate; and forming the lower electrode layer comprises plating the lower electrode layer on the lower seed layer. 18. The method of claim 17, wherein:
forming the capacitor comprises plating an upper seed layer on the dielectric layer; and forming the upper electrode layer comprises plating the upper electrode layer on the upper seed layer. 19. The method of claim 18, wherein:
a material of the buffer layer is same as at least one of:
a material the upper seed layer; or
a material of the lower seed layer. 20. The method of claim 1, wherein:
forming the lower electrode layer comprises:
forming the lower electrode layer above a topmost surface of the substrate. | Provided are a capacitor of a semiconductor integrated circuit and a method for manufacturing the same, for example a metal-insulator-metal (MIM) type capacitor of a semiconductor integrated circuit, which is capable of improving adhesive force between an electrode layer and a dielectric layer of a capacitor, and a method for manufacturing the same. For example, the present disclosure provides a capacitor for a semiconductor integrated circuit having a new structure, which is capable of preventing a delamination phenomenon on an interface between a lower electrode layer and a dielectric layer by further forming a buffer layer, which is capable of decreasing or compensating for a difference in a coefficient of thermal expansion, between a metal electrode layer and a dielectric layer, particularly, between the lower electrode layer and the dielectric layer, and a method for manufacturing the same.1. A semiconductor integrated circuit, comprising:
a substrate comprising a substrate coefficient of thermal expansion (CTE); and a capacitor on the substrate and comprising:
a lower seed layer on a topmost substrate surface of the substrate and comprising a lower seed CTE;
a lower electrode layer on the lower seed layer and comprising a lower electrode CTE;
a buffer layer on the lower electrode layer and comprising a buffer CTE;
a dielectric layer on the buffer layer and comprising a dielectric CTE;
an upper seed layer on the dielectric layer and comprising an upper seed CTE; and
an upper electrode layer on the upper seed layer and comprising an upper electrode CTE;
wherein:
the lower electrode CTE is greater than the buffer CTE;
the buffer CTE is greater than the dielectric CTE;
the lower electrode CTE is greater than the lower seed CTE;
the lower seed CTE is greater than the substrate CTE;
the upper electrode CTE is greater than the upper seed CTE;
the upper seed CTE is greater than the dielectric CTE; and
a difference between the lower electrode CTE and the buffer CTE is greater than a difference between the buffer CTE and the dielectric CTE. 2. The semiconductor integrated circuit of claim 1, wherein:
the substrate comprises one or both of a semiconductor material and/or a glass material; each layer of the capacitor is formed on the substrate; materials of the lower seed layer, of the buffer layer, and of the upper seed layer are the same as each other; the lower seed layer comprises a plated layer onto the topmost substrate surface; the lower electrode layer comprises a plated layer plated onto the lower seed layer; the buffer layer comprises a sputtered layer sputtered onto the lower electrode layer; the dielectric layer comprises a chemical vapor deposition layer deposited onto the buffer layer; the upper seed layer comprises a plated layer plated onto the dielectric layer; and the upper electrode layer comprises a plated layer plated onto the upper seed layer. 3. A semiconductor integrated circuit, comprising:
a substrate; and a capacitor on the substrate and comprising:
a lower electrode layer coupled to the substrate and comprising a lower electrode coefficient of thermal expansion (CTE);
a buffer layer on the lower electrode layer and comprising a buffer CTE;
a dielectric layer on the buffer layer and comprising a dielectric CTE; and
an upper electrode layer on the dielectric layer;
wherein:
the lower electrode CTE is greater than the buffer CTE; and
the buffer CTE is greater than the dielectric CTE. 4. The semiconductor integrated circuit of claim 3, wherein:
the buffer layer comprises one or more of:
titanium-tungsten (TiW), titanium (Ti), chrome (Cr), and/or tungsten (W). 5. The semiconductor integrated circuit of claim 3, wherein:
the dielectric layer comprises one or more of:
silicon nitride (SiN), aluminum oxide (Al2O3), and/or hafnium oxide (HfO3). 6. The semiconductor integrated circuit of claim 3, wherein:
each layer of the capacitor is formed on the substrate. 7. The semiconductor integrated circuit of claim 3, wherein:
the substrate comprises one or both of a semiconductor material and/or a glass material. 8. The semiconductor integrated circuit of claim 3, wherein:
a difference between the lower electrode CTE and the buffer CTE is greater than a difference between the buffer CTE and the dielectric CTE. 9. The semiconductor integrated circuit of claim 3, comprising:
a lower seed layer between the substrate and the lower electrode layer and comprising a lower seed CTE; wherein:
the lower electrode CTE is greater than the lower seed CTE; and
the lower seed CTE is greater than a CTE of the substrate. 10. The semiconductor integrated circuit of claim 9, wherein:
materials of the lower seed layer and of the buffer layer are the same as each other. 11. The semiconductor integrated circuit of claim 9, comprising:
an upper seed layer between the dielectric layer and the upper electrode layer and comprising an upper seed CTE; wherein:
the upper electrode CTE is greater than the upper seed CTE; and
the upper seed CTE is greater than the dielectric CTE. 12. The semiconductor integrated circuit of claim 11, wherein:
materials of the lower seed layer, of the buffer layer, and of the upper seed layer are the same as each other. 13. The semiconductor integrated circuit of claim 3, wherein:
the buffer layer comprises a sputtered layer sputtered onto the lower electrode layer. 14. A method of manufacturing a capacitor for a semiconductor integrated circuit, the method comprising:
providing a substrate; and forming a capacitor on the substrate, said forming comprising:
forming a lower electrode layer on the substrate;
forming a buffer layer on the lower electrode layer;
forming a dielectric layer on the buffer layer; and
forming an upper electrode layer on the second seed layer;
wherein:
the lower electrode CTE of the lower electrode layer is greater than a buffer CTE of the buffer layer; and
the buffer CTE is greater than a dielectric CTE of the dielectric layer. 15. The method of claim 14, wherein:
the buffer layer is sputtered onto the lower electrode layer and comprises one or more of titanium-tungsten (TiW), titanium (Ti), chrome (Cr), and/or tungsten (W). 16. The method of claim 14, wherein:
the dielectric layer is formed by chemical vapor deposition onto the buffer layer and comprises one or more of silicon nitride (SiN), aluminum oxide (Al2O3), and/or hafnium oxide (HfO3). 17. The method of claim 14, wherein:
forming the capacitor comprises plating a lower seed layer on the substrate; and forming the lower electrode layer comprises plating the lower electrode layer on the lower seed layer. 18. The method of claim 17, wherein:
forming the capacitor comprises plating an upper seed layer on the dielectric layer; and forming the upper electrode layer comprises plating the upper electrode layer on the upper seed layer. 19. The method of claim 18, wherein:
a material of the buffer layer is same as at least one of:
a material the upper seed layer; or
a material of the lower seed layer. 20. The method of claim 1, wherein:
forming the lower electrode layer comprises:
forming the lower electrode layer above a topmost surface of the substrate. | 2,800 |
12,213 | 12,213 | 15,850,132 | 2,822 | A method of forming an array of memory cells comprises forming an elevationally inner tier of memory cells comprising spaced inner tier lower first conductive lines, spaced inner tier upper second conductive lines, and programmable material of individual inner tier memory cells elevationally between the inner tier first lines and the inner tier second lines where such cross. First insulative material is formed laterally between the inner tier second lines to have respective elevationally outermost surfaces that are lower than elevationally outermost surfaces of immediately laterally-adjacent of the inner tier second lines. Second insulative material is formed elevationally over the first insulative material and laterally between the inner tier second lines. The second insulative material is of different composition from that of the first insulative material. An elevationally outer tier of memory cells is formed to comprise spaced outer tier lower first conductive lines, spaced outer tier upper second conductive lines, and programmable material of individual outer tier memory cells elevationally between the outer tier first lines and the outer tier second lines where such cross. Arrays of memory cells independent of method of manufacture are disclosed. | 1-21. (canceled) 22. An array of memory cells, comprising:
an elevationally inner tier of memory cells comprising spaced inner tier lower first conductive lines, spaced inner tier upper second conductive lines crossing the inner tier lower first conductive lines, and programmable material of individual inner tier memory cells elevationally between the inner tier lower first conductive lines and the inner tier upper second conductive lines at respective locations where such cross; first insulative material laterally between the inner tier upper second conductive lines having respective elevationally outermost surfaces that are lower than elevationally outermost surfaces of immediately laterally-adjacent of the inner tier upper second conductive lines; second insulative material elevationally over the first insulative material and laterally between the inner tier upper second conductive lines, the second insulative material being of different composition from that of the first insulative material; and an elevationally outer tier of memory cells comprising spaced outer tier lower first conductive lines, spaced outer tier upper second conductive lines crossing the outer tier lower first conductive lines, and programmable material of individual outer tier memory cells elevationally between the outer tier lower first conductive lines and the outer tier upper second conductive lines at respective locations where such cross. 23. The array of claim 22 comprising a third insulative material above and directly against the second insulative material laterally between the spaced outer tier first conductive lines, the third insulative material being of the same composition as the first insulative material. 24. The array of claim 22 wherein the respective elevationally outermost surfaces of the first insulative material are elevationally outward of elevationally innermost surfaces of the inner tier second conductive lines. 25. The array of claim 22 wherein the first insulative material comprises at least 10% atomic carbon and the second insulative material comprises less than 1% atomic, if any, carbon. 26. The array of claim 22 wherein the second insulative material laterally between the inner tier second lines has respective elevationally outermost surfaces that are elevationally coincident with respective elevationally outermost surfaces of the inner tier second conductive lines. 27. The array of claim 26 wherein the respective elevationally outermost surfaces of the second insulative material and the respective elevationally outermost surfaces of the inner tier second conductive lines are everywhere planar and thereby coplanar. 28. The array of claim 22 wherein individual of the inner tier upper second conductive lines and individual of the outer tier lower first conductive lines are electrically shared by the elevationally inner and outer tiers. | A method of forming an array of memory cells comprises forming an elevationally inner tier of memory cells comprising spaced inner tier lower first conductive lines, spaced inner tier upper second conductive lines, and programmable material of individual inner tier memory cells elevationally between the inner tier first lines and the inner tier second lines where such cross. First insulative material is formed laterally between the inner tier second lines to have respective elevationally outermost surfaces that are lower than elevationally outermost surfaces of immediately laterally-adjacent of the inner tier second lines. Second insulative material is formed elevationally over the first insulative material and laterally between the inner tier second lines. The second insulative material is of different composition from that of the first insulative material. An elevationally outer tier of memory cells is formed to comprise spaced outer tier lower first conductive lines, spaced outer tier upper second conductive lines, and programmable material of individual outer tier memory cells elevationally between the outer tier first lines and the outer tier second lines where such cross. Arrays of memory cells independent of method of manufacture are disclosed.1-21. (canceled) 22. An array of memory cells, comprising:
an elevationally inner tier of memory cells comprising spaced inner tier lower first conductive lines, spaced inner tier upper second conductive lines crossing the inner tier lower first conductive lines, and programmable material of individual inner tier memory cells elevationally between the inner tier lower first conductive lines and the inner tier upper second conductive lines at respective locations where such cross; first insulative material laterally between the inner tier upper second conductive lines having respective elevationally outermost surfaces that are lower than elevationally outermost surfaces of immediately laterally-adjacent of the inner tier upper second conductive lines; second insulative material elevationally over the first insulative material and laterally between the inner tier upper second conductive lines, the second insulative material being of different composition from that of the first insulative material; and an elevationally outer tier of memory cells comprising spaced outer tier lower first conductive lines, spaced outer tier upper second conductive lines crossing the outer tier lower first conductive lines, and programmable material of individual outer tier memory cells elevationally between the outer tier lower first conductive lines and the outer tier upper second conductive lines at respective locations where such cross. 23. The array of claim 22 comprising a third insulative material above and directly against the second insulative material laterally between the spaced outer tier first conductive lines, the third insulative material being of the same composition as the first insulative material. 24. The array of claim 22 wherein the respective elevationally outermost surfaces of the first insulative material are elevationally outward of elevationally innermost surfaces of the inner tier second conductive lines. 25. The array of claim 22 wherein the first insulative material comprises at least 10% atomic carbon and the second insulative material comprises less than 1% atomic, if any, carbon. 26. The array of claim 22 wherein the second insulative material laterally between the inner tier second lines has respective elevationally outermost surfaces that are elevationally coincident with respective elevationally outermost surfaces of the inner tier second conductive lines. 27. The array of claim 26 wherein the respective elevationally outermost surfaces of the second insulative material and the respective elevationally outermost surfaces of the inner tier second conductive lines are everywhere planar and thereby coplanar. 28. The array of claim 22 wherein individual of the inner tier upper second conductive lines and individual of the outer tier lower first conductive lines are electrically shared by the elevationally inner and outer tiers. | 2,800 |
12,214 | 12,214 | 15,491,288 | 2,837 | An elevator calling operation based on a wrist-wearable smart device. An elevator calling operation system of the present invention comprises: an elevator control apparatus, and a wrist-wearable smart device wirelessly connected to the elevator control apparatus, wherein the wrist-wearable smart device comprises an identity identification module which stores identity identification information about a passenger, and a motion sensor which is used for acquiring elevator calling motion information about the passenger performing an elevator calling operation, and the wrist-wearable smart device transmits the elevator calling motion information, in association with the identity identification information, to the elevator control apparatus; and the elevator control apparatus comprises: a passenger identity recognition module and an elevator calling operation recognition module, the elevator calling operation recognition module used for recognizing the elevator calling operation of the passenger according to the elevator calling motion information from the motion sensor. | 1. An elevator calling operation system, characterized by comprising: an elevator control apparatus, and a wrist-wearable smart device wirelessly connected to the elevator control apparatus;
the wrist-wearable smart device comprising: an identity identification module which stores identity identification information about a passenger; and a motion sensor which is used for acquiring elevator calling motion information about the passenger performing an elevator calling operation; wherein the wrist-wearable smart device is configured to transmit the elevator calling motion information, in association with the identity identification information, to the elevator control apparatus; and the elevator control apparatus comprising: a passenger identity recognition module which is used for recognizing passenger identity information at least according to the identity identification information; and an elevator calling operation recognition module which is used for recognizing an elevator calling operation of the passenger according to the elevator calling motion information from the motion sensor, so as to make an elevator calling request for the elevator calling operation correspond to the recognized passenger identity information. 2. The elevator calling operation system according to claim 1, characterized in that the elevator calling operation recognition module is further configured to determine, according to the elevator calling motion information from the motion sensor, the number of times of an elevator calling operation by the same passenger, and ignore, according to the number of times of the elevator calling operation, unnecessary elevator calling requests of the passenger. 3. The elevator calling operation system according to claim 1, characterized in that the elevator calling operation recognition module is further configured to determine, according to the elevator calling motion information from the motion sensor, the number of times of an elevator calling operation by the same passenger, and judge, according to the number of times of the elevator calling operation, whether to provide a special dispatch service. 4. The elevator calling operation system according to claim 3, characterized in that the elevator calling operation recognition module is further configured to provide the passenger with the special dispatch service of priority dispatching when the number of times of the elevator calling operation by the same passenger is greater than or equal to a certain pre-set value. 5. The elevator calling operation system according to claim 1, characterized in that the passenger identity recognition module is further configured to judge, based on the identity identification information or passenger identity information, whether to authorize the passenger to make an elevator calling request. 6. The elevator calling operation system according to claim 1, characterized in that the elevator control apparatus is further configured to judge, based on the recognized passenger identity information, whether to provide the passenger with a customized service. 7. The elevator calling operation system according to claim 6, characterized in that the customized service comprises assigning a dedicated elevator to the passenger, wherein the dedicated elevator at least does not accept, on an elevator riding path from an initial floor to a destination floor of the passenger, an elevator calling request with the same elevator riding direction from other passengers going from the initial floor to the destination floor. 8. The elevator calling operation system according to claim 1, characterized in that the elevator control apparatus and the wrist-wearable smart device are wirelessly connected by Bluetooth or near field communication or radio-frequency wireless communication, wherein when the passenger performs an elevator calling operation, a wireless connection is automatically established between the elevator control apparatus and the wrist-wearable smart device. 9. The elevator calling operation system according to claim 1, characterized in that,
the wrist-wearable smart device further comprises a biological characteristic information collection module which is used for collecting biological characteristic information about the passenger; and the elevator control apparatus further comprises a passenger physical status detection module which acquires, at least according to the biological characteristic information from the biological characteristic information collection module, physical status information about the corresponding passenger, so as to judge whether to initiate the corresponding special service. 10. The elevator calling operation system according to claim 9, characterized in that the passenger physical status detection module is further configured to judge, at least according to the physical status information about the passenger, whether the passenger has diseases that need rescue, and automatically initiate the special service triggering a rescue service request when it is judged to be “yes”. 11. The elevator calling operation system according to claim 10, characterized in that the passenger physical status detection module is further configured to acquire or receive other motion information collected by the motion sensor apart from the elevator calling motion information, and judge, based on the other motion information, whether the corresponding passenger has the diseases that need rescue. 12. The elevator calling operation system according to claim 9, characterized in that the passenger identity recognition module is further configured to acquire or receive the biological characteristic information collected by the biological characteristic information collection module and perform, based on the biological characteristic information, identity authentication on the recognized passenger identity information. 13. The elevator calling operation system according to claim 9, characterized in that the biological characteristic information comprises heart rate, blood pressure, body temperature, oxygen content of blood and/or vein distribution characteristic information. 14. The elevator calling operation system according to claim 1, characterized in that the wrist-wearable smart device is a smart band. 15. The elevator calling operation system according to claim 1, characterized in that the motion sensor comprises an acceleration sensor and/or a gyroscope. 16. An elevator control apparatus, characterized by being configured to be capable of establishing a wireless connection with a wrist-wearable smart device worn by a passenger, and acquiring or receiving identity identification information about the passenger, in association with elevator calling motion information when the passenger performs an elevator calling operation, from the wrist-wearable smart device;
wherein the elevator control apparatus comprises: a passenger identity recognition module which is used for recognizing passenger identity information at least according to the identity identification information; and an elevator calling operation recognition module which is used for recognizing an elevator calling operation of the passenger according to the elevator calling motion information, so as to make an elevator calling request for the elevator calling operation correspond to the recognized passenger identity information. 17. The elevator control apparatus according to claim 16, characterized in that the elevator calling operation recognition module is further configured to determine, according to the elevator calling motion information, the number of times of an elevator calling operation by the same passenger, and ignore, according to the number of times of the elevator calling operation, unnecessary elevator calling requests of the passenger. 18. The elevator control apparatus according to claim 17 or 16, characterized in that the elevator calling operation recognition module is further configured to determine, according to the elevator calling motion information, the number of times of an elevator calling operation by the same passenger, and judge, according to the number of times of the elevator calling operation, whether to provide a special dispatch service. 19. The elevator control apparatus according to claim 18, characterized in that the elevator calling operation recognition module is further configured to provide the passenger with the special dispatch service of priority dispatching when the number of times of the elevator calling operation by the same passenger is greater than or equal to a certain pre-set value. 20. The elevator control apparatus according to claim 16, characterized in that the passenger identity recognition module is further configured to judge, based on the identity identification information or passenger identity information, whether to authorize the passenger to make an elevator calling request. 21. The elevator control apparatus according to claim 16, characterized in that the elevator control apparatus is further configured to judge, based on passenger information in an elevator calling request corresponding to the recognized passenger, whether to provide the passenger with a customized service. 22. The elevator control apparatus according to claim 21, characterized in that the customized service comprises assigning a dedicated elevator to the passenger, wherein the dedicated elevator at least does not accept, on an elevator riding path from an initial floor to a destination floor of the passenger, an elevator calling request with the same elevator riding direction from other passengers going from the initial floor to the destination floor. 23. The elevator control apparatus according to claim 16, characterized in that the elevator control apparatus and the wrist-wearable smart device are wirelessly connected by Bluetooth or near field communication or radio-frequency wireless communication, wherein when the passenger performs an elevator calling operation, a wireless connection is automatically established between the elevator control apparatus and the wrist-wearable smart device. 24. The elevator control apparatus according to claim 16, characterized in that the elevator control apparatus further comprises a passenger physical status detection module which acquires, at least according to biological characteristic information from a biological characteristic information collection module of the wrist-wearable smart device, physical status information about the corresponding passenger, so as to judge whether to initiate the corresponding special service. 25. The elevator control apparatus according to claim 24, characterized in that the passenger physical status detection module is further configured to judge, according to the physical status information about the passenger, whether the passenger has diseases that need rescue, and automatically initiate the special service triggering a rescue service request when it is judged to be “yes”. 26. The elevator control apparatus according to claim 25, characterized in that the passenger physical status detection module is further configured to acquire or receive other motion information collected by the wrist-wearable smart device apart from the elevator calling motion information, and judge, based on the other motion information, whether the corresponding passenger has the diseases that need rescue. 27. The elevator control apparatus according to claim 24, characterized in that the passenger identity recognition module is further configured to acquire or receive the biological characteristic information collected by the wrist-wearable smart device and perform, based on the biological characteristic information, identity authentication on the recognized passenger identity information. 28. A wrist-wearable smart device, characterized by being configured to be capable of establishing a wireless connection with an elevator control apparatus;
the wrist-wearable smart device comprising: an identity identification module which stores identity identification information about a passenger; and a motion sensor which is used for acquiring elevator calling motion information about the passenger performing an elevator calling operation; wherein the wrist-wearable smart device is configured to transmit the elevator calling motion information, in association with the identity identification information, to the elevator control apparatus. 29. The wrist-wearable smart device according to claim 28, characterized in that the wrist-wearable smart device further comprises a biological characteristic information collection module which is used for collecting biological characteristic information about the passenger. 30. The wrist-wearable smart device according to claim 29, characterized in that the biological characteristic information comprises heart rate, blood pressure, body temperature, oxygen content of blood and/or vein distribution characteristic information. 31. The wrist-wearable smart device according to claim 28, characterized in that the wrist-wearable smart device is a smart band. 32. The wrist-wearable smart device according to claim 28, characterized in that the motion sensor comprises an acceleration sensor and/or a gyroscope. 33. An elevator calling operation method, characterized by comprising the steps of:
acquiring, by a wrist-wearable smart device carried by a passenger, identity identification information about the passenger and elevator calling motion information about the passenger performing an elevator calling operation; transmitting the elevator calling motion information, in association with the identity identification information, to an elevator control apparatus; recognizing passenger identity information at least according to the identity identification information; and recognizing the elevator calling operation of the passenger based on the elevator calling motion information, and making an elevator calling request for the elevator calling operation correspond to the recognized passenger identity information. 34. The method according to claim 33, characterized by further comprising the steps of:
determining, according to the elevator calling motion information from the motion sensor, the number of times of an elevator calling operation by the same passenger; and ignoring, according to the number of times of the elevator calling operation, unnecessary elevator calling requests of the passenger. 35. The method according to claim 33 or 3′1, characterized by further comprising the step of:
determining, according to the elevator calling motion information from the motion sensor, the number of times of an elevator calling operation by the same passenger, and judging, according to the number of times of the elevator calling operation, whether to provide a special dispatch service. 36. The method according to claim 33, characterized in that when the passenger performs an elevator calling operation, a wireless connection is automatically established between the wrist-wearable smart device and the elevator control apparatus. 37. The method according to claim 33, characterized by further comprising the step of: judging, based on the identity identification information or passenger identity information, whether to authorize the passenger to make an elevator calling request. 38. The method according to claim 33, characterized by further comprising the step of: judging, based on passenger identity information in an elevator calling request corresponding to the recognized passenger, whether to provide the passenger with a customized dispatch service. 39. The method according to claim 33, characterized by further comprising the step of: collecting biological characteristic information about the passenger by the wrist-wearable smart device carried by the passenger. 40. The method according to claim 39, characterized by further comprising the step of: acquiring, at least according to the biological characteristic information from a biological characteristic information collection module, physical status information about the corresponding passenger, so as to judge whether to initiate the corresponding special service. 41. The method according to claim 40, characterized by, in the step of acquiring physical status information about the corresponding passenger, judging, at least according to the physical status information about the passenger, whether the passenger has diseases that need rescue, and automatically initiating the special service triggering a rescue service request when it is judged to be “yes”. 42. The method according to claim 41, characterized by acquiring or receiving other motion information from the wrist-wearable smart device apart from the elevator calling motion information, and judging, based on the other motion information, whether the corresponding passenger has the diseases that need rescue. 43. The method according to claim 39, characterized by further comprising the step of: performing, based on the biological characteristic information, identity authentication on the recognized passenger. | An elevator calling operation based on a wrist-wearable smart device. An elevator calling operation system of the present invention comprises: an elevator control apparatus, and a wrist-wearable smart device wirelessly connected to the elevator control apparatus, wherein the wrist-wearable smart device comprises an identity identification module which stores identity identification information about a passenger, and a motion sensor which is used for acquiring elevator calling motion information about the passenger performing an elevator calling operation, and the wrist-wearable smart device transmits the elevator calling motion information, in association with the identity identification information, to the elevator control apparatus; and the elevator control apparatus comprises: a passenger identity recognition module and an elevator calling operation recognition module, the elevator calling operation recognition module used for recognizing the elevator calling operation of the passenger according to the elevator calling motion information from the motion sensor.1. An elevator calling operation system, characterized by comprising: an elevator control apparatus, and a wrist-wearable smart device wirelessly connected to the elevator control apparatus;
the wrist-wearable smart device comprising: an identity identification module which stores identity identification information about a passenger; and a motion sensor which is used for acquiring elevator calling motion information about the passenger performing an elevator calling operation; wherein the wrist-wearable smart device is configured to transmit the elevator calling motion information, in association with the identity identification information, to the elevator control apparatus; and the elevator control apparatus comprising: a passenger identity recognition module which is used for recognizing passenger identity information at least according to the identity identification information; and an elevator calling operation recognition module which is used for recognizing an elevator calling operation of the passenger according to the elevator calling motion information from the motion sensor, so as to make an elevator calling request for the elevator calling operation correspond to the recognized passenger identity information. 2. The elevator calling operation system according to claim 1, characterized in that the elevator calling operation recognition module is further configured to determine, according to the elevator calling motion information from the motion sensor, the number of times of an elevator calling operation by the same passenger, and ignore, according to the number of times of the elevator calling operation, unnecessary elevator calling requests of the passenger. 3. The elevator calling operation system according to claim 1, characterized in that the elevator calling operation recognition module is further configured to determine, according to the elevator calling motion information from the motion sensor, the number of times of an elevator calling operation by the same passenger, and judge, according to the number of times of the elevator calling operation, whether to provide a special dispatch service. 4. The elevator calling operation system according to claim 3, characterized in that the elevator calling operation recognition module is further configured to provide the passenger with the special dispatch service of priority dispatching when the number of times of the elevator calling operation by the same passenger is greater than or equal to a certain pre-set value. 5. The elevator calling operation system according to claim 1, characterized in that the passenger identity recognition module is further configured to judge, based on the identity identification information or passenger identity information, whether to authorize the passenger to make an elevator calling request. 6. The elevator calling operation system according to claim 1, characterized in that the elevator control apparatus is further configured to judge, based on the recognized passenger identity information, whether to provide the passenger with a customized service. 7. The elevator calling operation system according to claim 6, characterized in that the customized service comprises assigning a dedicated elevator to the passenger, wherein the dedicated elevator at least does not accept, on an elevator riding path from an initial floor to a destination floor of the passenger, an elevator calling request with the same elevator riding direction from other passengers going from the initial floor to the destination floor. 8. The elevator calling operation system according to claim 1, characterized in that the elevator control apparatus and the wrist-wearable smart device are wirelessly connected by Bluetooth or near field communication or radio-frequency wireless communication, wherein when the passenger performs an elevator calling operation, a wireless connection is automatically established between the elevator control apparatus and the wrist-wearable smart device. 9. The elevator calling operation system according to claim 1, characterized in that,
the wrist-wearable smart device further comprises a biological characteristic information collection module which is used for collecting biological characteristic information about the passenger; and the elevator control apparatus further comprises a passenger physical status detection module which acquires, at least according to the biological characteristic information from the biological characteristic information collection module, physical status information about the corresponding passenger, so as to judge whether to initiate the corresponding special service. 10. The elevator calling operation system according to claim 9, characterized in that the passenger physical status detection module is further configured to judge, at least according to the physical status information about the passenger, whether the passenger has diseases that need rescue, and automatically initiate the special service triggering a rescue service request when it is judged to be “yes”. 11. The elevator calling operation system according to claim 10, characterized in that the passenger physical status detection module is further configured to acquire or receive other motion information collected by the motion sensor apart from the elevator calling motion information, and judge, based on the other motion information, whether the corresponding passenger has the diseases that need rescue. 12. The elevator calling operation system according to claim 9, characterized in that the passenger identity recognition module is further configured to acquire or receive the biological characteristic information collected by the biological characteristic information collection module and perform, based on the biological characteristic information, identity authentication on the recognized passenger identity information. 13. The elevator calling operation system according to claim 9, characterized in that the biological characteristic information comprises heart rate, blood pressure, body temperature, oxygen content of blood and/or vein distribution characteristic information. 14. The elevator calling operation system according to claim 1, characterized in that the wrist-wearable smart device is a smart band. 15. The elevator calling operation system according to claim 1, characterized in that the motion sensor comprises an acceleration sensor and/or a gyroscope. 16. An elevator control apparatus, characterized by being configured to be capable of establishing a wireless connection with a wrist-wearable smart device worn by a passenger, and acquiring or receiving identity identification information about the passenger, in association with elevator calling motion information when the passenger performs an elevator calling operation, from the wrist-wearable smart device;
wherein the elevator control apparatus comprises: a passenger identity recognition module which is used for recognizing passenger identity information at least according to the identity identification information; and an elevator calling operation recognition module which is used for recognizing an elevator calling operation of the passenger according to the elevator calling motion information, so as to make an elevator calling request for the elevator calling operation correspond to the recognized passenger identity information. 17. The elevator control apparatus according to claim 16, characterized in that the elevator calling operation recognition module is further configured to determine, according to the elevator calling motion information, the number of times of an elevator calling operation by the same passenger, and ignore, according to the number of times of the elevator calling operation, unnecessary elevator calling requests of the passenger. 18. The elevator control apparatus according to claim 17 or 16, characterized in that the elevator calling operation recognition module is further configured to determine, according to the elevator calling motion information, the number of times of an elevator calling operation by the same passenger, and judge, according to the number of times of the elevator calling operation, whether to provide a special dispatch service. 19. The elevator control apparatus according to claim 18, characterized in that the elevator calling operation recognition module is further configured to provide the passenger with the special dispatch service of priority dispatching when the number of times of the elevator calling operation by the same passenger is greater than or equal to a certain pre-set value. 20. The elevator control apparatus according to claim 16, characterized in that the passenger identity recognition module is further configured to judge, based on the identity identification information or passenger identity information, whether to authorize the passenger to make an elevator calling request. 21. The elevator control apparatus according to claim 16, characterized in that the elevator control apparatus is further configured to judge, based on passenger information in an elevator calling request corresponding to the recognized passenger, whether to provide the passenger with a customized service. 22. The elevator control apparatus according to claim 21, characterized in that the customized service comprises assigning a dedicated elevator to the passenger, wherein the dedicated elevator at least does not accept, on an elevator riding path from an initial floor to a destination floor of the passenger, an elevator calling request with the same elevator riding direction from other passengers going from the initial floor to the destination floor. 23. The elevator control apparatus according to claim 16, characterized in that the elevator control apparatus and the wrist-wearable smart device are wirelessly connected by Bluetooth or near field communication or radio-frequency wireless communication, wherein when the passenger performs an elevator calling operation, a wireless connection is automatically established between the elevator control apparatus and the wrist-wearable smart device. 24. The elevator control apparatus according to claim 16, characterized in that the elevator control apparatus further comprises a passenger physical status detection module which acquires, at least according to biological characteristic information from a biological characteristic information collection module of the wrist-wearable smart device, physical status information about the corresponding passenger, so as to judge whether to initiate the corresponding special service. 25. The elevator control apparatus according to claim 24, characterized in that the passenger physical status detection module is further configured to judge, according to the physical status information about the passenger, whether the passenger has diseases that need rescue, and automatically initiate the special service triggering a rescue service request when it is judged to be “yes”. 26. The elevator control apparatus according to claim 25, characterized in that the passenger physical status detection module is further configured to acquire or receive other motion information collected by the wrist-wearable smart device apart from the elevator calling motion information, and judge, based on the other motion information, whether the corresponding passenger has the diseases that need rescue. 27. The elevator control apparatus according to claim 24, characterized in that the passenger identity recognition module is further configured to acquire or receive the biological characteristic information collected by the wrist-wearable smart device and perform, based on the biological characteristic information, identity authentication on the recognized passenger identity information. 28. A wrist-wearable smart device, characterized by being configured to be capable of establishing a wireless connection with an elevator control apparatus;
the wrist-wearable smart device comprising: an identity identification module which stores identity identification information about a passenger; and a motion sensor which is used for acquiring elevator calling motion information about the passenger performing an elevator calling operation; wherein the wrist-wearable smart device is configured to transmit the elevator calling motion information, in association with the identity identification information, to the elevator control apparatus. 29. The wrist-wearable smart device according to claim 28, characterized in that the wrist-wearable smart device further comprises a biological characteristic information collection module which is used for collecting biological characteristic information about the passenger. 30. The wrist-wearable smart device according to claim 29, characterized in that the biological characteristic information comprises heart rate, blood pressure, body temperature, oxygen content of blood and/or vein distribution characteristic information. 31. The wrist-wearable smart device according to claim 28, characterized in that the wrist-wearable smart device is a smart band. 32. The wrist-wearable smart device according to claim 28, characterized in that the motion sensor comprises an acceleration sensor and/or a gyroscope. 33. An elevator calling operation method, characterized by comprising the steps of:
acquiring, by a wrist-wearable smart device carried by a passenger, identity identification information about the passenger and elevator calling motion information about the passenger performing an elevator calling operation; transmitting the elevator calling motion information, in association with the identity identification information, to an elevator control apparatus; recognizing passenger identity information at least according to the identity identification information; and recognizing the elevator calling operation of the passenger based on the elevator calling motion information, and making an elevator calling request for the elevator calling operation correspond to the recognized passenger identity information. 34. The method according to claim 33, characterized by further comprising the steps of:
determining, according to the elevator calling motion information from the motion sensor, the number of times of an elevator calling operation by the same passenger; and ignoring, according to the number of times of the elevator calling operation, unnecessary elevator calling requests of the passenger. 35. The method according to claim 33 or 3′1, characterized by further comprising the step of:
determining, according to the elevator calling motion information from the motion sensor, the number of times of an elevator calling operation by the same passenger, and judging, according to the number of times of the elevator calling operation, whether to provide a special dispatch service. 36. The method according to claim 33, characterized in that when the passenger performs an elevator calling operation, a wireless connection is automatically established between the wrist-wearable smart device and the elevator control apparatus. 37. The method according to claim 33, characterized by further comprising the step of: judging, based on the identity identification information or passenger identity information, whether to authorize the passenger to make an elevator calling request. 38. The method according to claim 33, characterized by further comprising the step of: judging, based on passenger identity information in an elevator calling request corresponding to the recognized passenger, whether to provide the passenger with a customized dispatch service. 39. The method according to claim 33, characterized by further comprising the step of: collecting biological characteristic information about the passenger by the wrist-wearable smart device carried by the passenger. 40. The method according to claim 39, characterized by further comprising the step of: acquiring, at least according to the biological characteristic information from a biological characteristic information collection module, physical status information about the corresponding passenger, so as to judge whether to initiate the corresponding special service. 41. The method according to claim 40, characterized by, in the step of acquiring physical status information about the corresponding passenger, judging, at least according to the physical status information about the passenger, whether the passenger has diseases that need rescue, and automatically initiating the special service triggering a rescue service request when it is judged to be “yes”. 42. The method according to claim 41, characterized by acquiring or receiving other motion information from the wrist-wearable smart device apart from the elevator calling motion information, and judging, based on the other motion information, whether the corresponding passenger has the diseases that need rescue. 43. The method according to claim 39, characterized by further comprising the step of: performing, based on the biological characteristic information, identity authentication on the recognized passenger. | 2,800 |
12,215 | 12,215 | 14,663,251 | 2,871 | A directional display may include a waveguide. The waveguide may include light extraction features arranged to direct light from an array of light sources by total internal reflection to an array of viewing windows and a reflector arranged to direct light from the waveguide by transmission through extraction features of the waveguide to the same array of viewing windows. A further spatially multiplexed display device comprising a spatial light modulator and parallax element is arranged to cooperate with the illumination from the waveguide. An efficient and bright autostereoscopic display system with low cross talk and high resolution can be achieved. | 1. A directional display device comprising:
a directional backlight comprising: waveguide comprising:
first and second, opposed guide surfaces for guiding input light along the waveguide, and
an array of light sources arranged to generate the input light at different input positions in a lateral direction across the waveguide, wherein the second guide surface is arranged to deflect light guided through the waveguide out of the waveguide through the first guide surface as output light, and the waveguide is arranged to direct the output light into optical windows in output directions that are distributed in a lateral direction in dependence on the input position of the input light; a transmissive spatial light modulator comprising an array of pixels arranged to receive the output light from the waveguide and to modulate it to display an image; and in series with the spatial light modulator, a parallax element arranged to direct light from pixels of the spatial light modulator into viewing windows. 2. A directional display device according to claim 1, wherein the parallax element is a parallax barrier. 3. A directional display device according to claim 1, wherein the parallax element is a lenticular array. 4. A directional display device according to claim 3, wherein the parallax element is a liquid crystal lenticular array. 5. A directional display device according to claim 1, wherein the parallax element is controllable to select the position of the viewing windows. 6. A directional display device according to claim 2, wherein the parallax element is a liquid crystal barrier element array. 7. A directional display device according to claim 5 wherein the parallax element is a parallax barrier comprising an array of barrier elements that are controllable to block or transmit light, and thereby to select the position of the viewing windows. 8. A directional display device according to claim 6, wherein the parallax element is a graded index liquid crystal lenticular array. 9. A directional display device according to claim 4, further comprising a polarization switching element arranged to switch at least part of the liquid crystal lenticular array between transmitting and lensing modes of operation. 10. A directional display device according to claim 1, wherein the optical windows provided by the directional backlight and the viewing windows provided by the parallax element extend at an acute non-zero angle relative to each other. 11. A directional display device according to claim 10, wherein said acute non-zero angle is an angle in a range from 25 to 65 degrees, from 30 to 60 degrees, from 35 to 55 degrees, or from 40 to 50 degrees. 12. A directional display device according to claim 1, wherein the parallax element and the spatial light modulator cooperate to produce viewing windows having a lateral window luminance distribution that is non-uniform, and the directional backlight is arranged to produce optical windows having a lateral window luminance distribution that is non-uniform and compensates for the non-uniformity of the lateral window luminance distribution of the viewing windows. 13. A directional display device according to claim 12, wherein the directional backlight further comprises a transmission element disposed over the light sources and having a transmittance that varies in a lateral direction to provide the non-uniform lateral window luminance distribution of the optical windows produced by the directional backlight. 14. A directional display device according to claim 1, wherein the first guide surface is arranged to guide light by total internal reflection and the second guide surface comprises a plurality of light extraction features oriented to direct light guided through the waveguide in directions allowing exit through the first guide surface as the output light and intermediate regions between the light extraction features that are arranged to guide light through the waveguide. 15. A directional display device according to claim 14, wherein the second guide surface has a stepped shape comprising facets, that are said light extraction features, and the intermediate regions. 16. A directional display device according to claim 15, wherein the directional backlight further comprises a rear reflector comprising a linear array of reflective facets arranged to reflect light from the light sources, that is transmitted through the plurality of facets of the waveguide, back through the waveguide to exit through the first guide surface into said optical windows. 17. A directional display device according to claim 14, wherein the light extraction features have positive optical power in the lateral direction. 18. A directional display device according to claim 1, wherein
the first guide surface is arranged to guide light by total internal reflection and the second guide surface is substantially planar and inclined at an angle to direct light in directions that break that total internal reflection for outputting light through the first guide surface, and the display device further comprises a deflection element extending across the first guide surface of the waveguide for deflecting light towards the normal to the first guide surface. 19. A directional display device according to claim 1, wherein the waveguide further comprises a reflective end for reflecting input light back through the waveguide, the second guide surface being arranged to deflect light as output light through the first guide surface after reflection from the reflective end. 20. A directional display device according to claim 19, wherein the reflective end has positive optical power in the lateral direction. 21. A directional display apparatus comprising:
a directional display device according to any one of the preceding claims; and a control system arranged to control the light sources to direct light into optical windows for viewing by an observer. 22. A directional display apparatus according to claim 21, wherein the control system is further arranged to control the spatial light modulator. 23. A directional display apparatus according to claim 22, being an autostereoscopic directional display apparatus wherein:
the parallax element is arranged to direct light from first and second sets of spatially multiplexed pixels into left and right eye viewing windows for viewing by left and right eyes of the observer; the control system is arranged to control the spatial light modulator to display left and right eye images on the first and second sets of spatially multiplexed pixels; and the control system is arranged to control the light sources to direct light into an optical window for viewing by both the left and right eyes of the observer. 24. A directional display apparatus according to claim 23, wherein
the parallax element is controllable to select the position of the viewing windows, and the control system is further arranged to control the parallax element to direct light into the left and right viewing windows. 25. A directional display apparatus according to claim 22, being an autostereoscopic directional display apparatus wherein:
the parallax element is controllable to select the position of the viewing windows; the control system is arranged to control the parallax element to direct light, in a temporally multiplexed manner, (a) from first and second sets of spatially multiplexed pixels into left and right eye viewing windows for viewing by left and right eyes of the observer, and (b) from the first and second sets of pixels into reversed right and left eye viewing windows for viewing by right and left eyes of the observer, the control system is arranged to control the spatial light modulator to display, in a temporally multiplexed manner in synchronization with the control of the parallax element, (a) left and right eye images on the first and second sets of spatially multiplexed pixels, respectively, when light therefrom is directed into the left and right eye viewing windows, and (b) right and left eye images on the first and second sets of spatially multiplexed pixels, respectively, when light therefrom is directed into the reversed right and left eye viewing windows; and the control system is arranged to control the light sources to direct light into an optical window for viewing by both eyes of the observer. 26. A directional display apparatus according to claim 22, being an autostereoscopic directional display apparatus wherein:
the parallax element is arranged to direct light from first and second sets of spatially multiplexed pixels into left and right eye viewing windows for viewing by left and right eyes of the observer; the control system is arranged to control the light sources to direct light, in a temporally multiplexed manner, into left and right eye optical windows for viewing by the left and right eyes of the observer; and the control system is arranged to control the spatial light modulator to display, in a temporally multiplexed manner in synchronization with the control of the light sources, (a) a left eye image and a blank image on the first and second sets of pixels, respectively, when the light sources direct light into the left eye optical window, and (b) a blank image and a right eye image on the first and second sets of pixels, respectively, when the light sources direct light into the right eye optical window. 27. A directional display apparatus according to claim 26, wherein
the parallax element is controllable to select the position of the viewing windows, and the control system is further arranged to control the parallax element to direct light into the left and right viewing windows. 28. A directional display apparatus according to claim 22, being an autostereoscopic directional display apparatus wherein:
the parallax element is controllable to select the position of the viewing windows; the control system is arranged to control the parallax element to direct light, in a temporally multiplexed manner, (i) from first and second sets of spatially multiplexed pixels into left and right eye viewing windows, respectively, for viewing by left and right eyes of the observer, and (ii) from the first and second sets of spatially multiplexed pixels into right and left eye viewing windows, respectively, for viewing by right and left eyes of the observer; the control system is arranged to control the light sources (i) while the parallax element directs light from the first set of pixels into the left eye viewing window and from the second set of pixels into the right eye viewing window, to direct light, in a temporally multiplexed manner, into left and right eye optical windows for viewing by the left and right eyes of the observer, and (ii) also while the parallax element directs light from the first set of pixels into the right eye viewing window and from the second set of pixels into the left eye viewing window, to direct light, in a temporally multiplexed manner, into left and right eye optical windows for viewing by the left and right eyes of the observer; and the control system is arranged to control the spatial light modulator (i) while the parallax element directs light from the first set of pixels into the left eye viewing window and from the second set of pixels into the right eye viewing window, to display, in a temporally multiplexed manner in synchronization with the control of the light sources, (a) a left eye image and a blank image on the first and second sets of pixels, respectively, when the light sources direct light into the left eye optical window, and (b) a blank image and a right eye image on the first and second sets of pixels, respectively, when the light sources direct light into the right eye optical window, and (ii) while the parallax element directs light from the first set of pixels into the right eye viewing window and from the second set of pixels into the left eye viewing window, to display, in a temporally multiplexed manner in synchronization with the control of the light sources, (a) a blank eye image and a left image on the first and second sets of pixels, respectively, when the light sources direct light into the left eye optical window, and (b) a right image and a blank eye image on the first and second sets of pixels, respectively, when the light sources direct light into the right eye optical window. 29. A directional display apparatus according to claim 22, being an autostereoscopic directional display apparatus wherein:
the parallax element is controllable to select the position of the viewing windows; the control system is arranged to control the parallax element to direct light, in a temporally multiplexed manner, (i) from a first set of pixels, that is spatially multiplexed with a second set of pixels, into a left eye viewing window for viewing by a left eye of an observer, and (ii) from the first set of pixels into a right eye viewing window for viewing by a right eye of the observer; the control system is arranged to control the light sources, in a temporally multiplexed manner in synchronization with the control of the parallax element, (i) into a left eye optical window for viewing by the left eye of the observer when the parallax element directs light from the first set of pixels into the left eye viewing window, and (ii) into a right eye optical window for viewing by the right eye of the observer when the parallax element directs light from the first set of pixels into the right eye viewing window; and the control system is arranged to control the spatial light modulator to display, in a temporally multiplexed manner in synchronization with the control of the parallax element, (i) a left eye image and a blank image on the first and second sets of pixels, respectively, when the parallax element directs light from the first set of pixels into the left eye viewing window, and (ii) a right eye image and a blank image on the first and second sets of pixels, respectively, when the parallax element directs light from the first set of pixels into the right eye viewing window. 30. A directional display apparatus according to claim 22, being an autostereoscopic directional display apparatus wherein:
the parallax element is controllable to select the position of the viewing windows, the control system is arranged to control the parallax element to direct light, in a temporally multiplexed manner, (a) from all the pixels into a left eye viewing window for viewing by the left eye of the observer, and (b) from all the pixels into a right eye viewing window for viewing by the right eye of the observer; the control system is arranged to control the light sources to direct light, in a temporally multiplexed manner in synchronization with the control of the parallax element, into left and right eye optical windows for viewing by the left and right eyes of the observer; and the control system is arranged to control the spatial light modulator to display, in a temporally multiplexed manner in synchronization with the control of the parallax element and the light sources, (a) a left eye image on all the pixels when the parallax element directs light into the left eye viewing window, and (b) a right eye image on all the pixels when the parallax element directs light into the right eye optical window. 31. A directional display apparatus according to claim 23, further comprising a sensor system arranged to detect the position of the head of the observer, the control system being arranged to control the light sources in accordance with the detected position of the head of the observer. 32. A directional display apparatus according to any one of claim 24, further comprising a sensor system arranged to detect the position of the head of the observer, the control system being arranged to control the light sources and the parallax element in accordance with the detected position of the head of the observer. | A directional display may include a waveguide. The waveguide may include light extraction features arranged to direct light from an array of light sources by total internal reflection to an array of viewing windows and a reflector arranged to direct light from the waveguide by transmission through extraction features of the waveguide to the same array of viewing windows. A further spatially multiplexed display device comprising a spatial light modulator and parallax element is arranged to cooperate with the illumination from the waveguide. An efficient and bright autostereoscopic display system with low cross talk and high resolution can be achieved.1. A directional display device comprising:
a directional backlight comprising: waveguide comprising:
first and second, opposed guide surfaces for guiding input light along the waveguide, and
an array of light sources arranged to generate the input light at different input positions in a lateral direction across the waveguide, wherein the second guide surface is arranged to deflect light guided through the waveguide out of the waveguide through the first guide surface as output light, and the waveguide is arranged to direct the output light into optical windows in output directions that are distributed in a lateral direction in dependence on the input position of the input light; a transmissive spatial light modulator comprising an array of pixels arranged to receive the output light from the waveguide and to modulate it to display an image; and in series with the spatial light modulator, a parallax element arranged to direct light from pixels of the spatial light modulator into viewing windows. 2. A directional display device according to claim 1, wherein the parallax element is a parallax barrier. 3. A directional display device according to claim 1, wherein the parallax element is a lenticular array. 4. A directional display device according to claim 3, wherein the parallax element is a liquid crystal lenticular array. 5. A directional display device according to claim 1, wherein the parallax element is controllable to select the position of the viewing windows. 6. A directional display device according to claim 2, wherein the parallax element is a liquid crystal barrier element array. 7. A directional display device according to claim 5 wherein the parallax element is a parallax barrier comprising an array of barrier elements that are controllable to block or transmit light, and thereby to select the position of the viewing windows. 8. A directional display device according to claim 6, wherein the parallax element is a graded index liquid crystal lenticular array. 9. A directional display device according to claim 4, further comprising a polarization switching element arranged to switch at least part of the liquid crystal lenticular array between transmitting and lensing modes of operation. 10. A directional display device according to claim 1, wherein the optical windows provided by the directional backlight and the viewing windows provided by the parallax element extend at an acute non-zero angle relative to each other. 11. A directional display device according to claim 10, wherein said acute non-zero angle is an angle in a range from 25 to 65 degrees, from 30 to 60 degrees, from 35 to 55 degrees, or from 40 to 50 degrees. 12. A directional display device according to claim 1, wherein the parallax element and the spatial light modulator cooperate to produce viewing windows having a lateral window luminance distribution that is non-uniform, and the directional backlight is arranged to produce optical windows having a lateral window luminance distribution that is non-uniform and compensates for the non-uniformity of the lateral window luminance distribution of the viewing windows. 13. A directional display device according to claim 12, wherein the directional backlight further comprises a transmission element disposed over the light sources and having a transmittance that varies in a lateral direction to provide the non-uniform lateral window luminance distribution of the optical windows produced by the directional backlight. 14. A directional display device according to claim 1, wherein the first guide surface is arranged to guide light by total internal reflection and the second guide surface comprises a plurality of light extraction features oriented to direct light guided through the waveguide in directions allowing exit through the first guide surface as the output light and intermediate regions between the light extraction features that are arranged to guide light through the waveguide. 15. A directional display device according to claim 14, wherein the second guide surface has a stepped shape comprising facets, that are said light extraction features, and the intermediate regions. 16. A directional display device according to claim 15, wherein the directional backlight further comprises a rear reflector comprising a linear array of reflective facets arranged to reflect light from the light sources, that is transmitted through the plurality of facets of the waveguide, back through the waveguide to exit through the first guide surface into said optical windows. 17. A directional display device according to claim 14, wherein the light extraction features have positive optical power in the lateral direction. 18. A directional display device according to claim 1, wherein
the first guide surface is arranged to guide light by total internal reflection and the second guide surface is substantially planar and inclined at an angle to direct light in directions that break that total internal reflection for outputting light through the first guide surface, and the display device further comprises a deflection element extending across the first guide surface of the waveguide for deflecting light towards the normal to the first guide surface. 19. A directional display device according to claim 1, wherein the waveguide further comprises a reflective end for reflecting input light back through the waveguide, the second guide surface being arranged to deflect light as output light through the first guide surface after reflection from the reflective end. 20. A directional display device according to claim 19, wherein the reflective end has positive optical power in the lateral direction. 21. A directional display apparatus comprising:
a directional display device according to any one of the preceding claims; and a control system arranged to control the light sources to direct light into optical windows for viewing by an observer. 22. A directional display apparatus according to claim 21, wherein the control system is further arranged to control the spatial light modulator. 23. A directional display apparatus according to claim 22, being an autostereoscopic directional display apparatus wherein:
the parallax element is arranged to direct light from first and second sets of spatially multiplexed pixels into left and right eye viewing windows for viewing by left and right eyes of the observer; the control system is arranged to control the spatial light modulator to display left and right eye images on the first and second sets of spatially multiplexed pixels; and the control system is arranged to control the light sources to direct light into an optical window for viewing by both the left and right eyes of the observer. 24. A directional display apparatus according to claim 23, wherein
the parallax element is controllable to select the position of the viewing windows, and the control system is further arranged to control the parallax element to direct light into the left and right viewing windows. 25. A directional display apparatus according to claim 22, being an autostereoscopic directional display apparatus wherein:
the parallax element is controllable to select the position of the viewing windows; the control system is arranged to control the parallax element to direct light, in a temporally multiplexed manner, (a) from first and second sets of spatially multiplexed pixels into left and right eye viewing windows for viewing by left and right eyes of the observer, and (b) from the first and second sets of pixels into reversed right and left eye viewing windows for viewing by right and left eyes of the observer, the control system is arranged to control the spatial light modulator to display, in a temporally multiplexed manner in synchronization with the control of the parallax element, (a) left and right eye images on the first and second sets of spatially multiplexed pixels, respectively, when light therefrom is directed into the left and right eye viewing windows, and (b) right and left eye images on the first and second sets of spatially multiplexed pixels, respectively, when light therefrom is directed into the reversed right and left eye viewing windows; and the control system is arranged to control the light sources to direct light into an optical window for viewing by both eyes of the observer. 26. A directional display apparatus according to claim 22, being an autostereoscopic directional display apparatus wherein:
the parallax element is arranged to direct light from first and second sets of spatially multiplexed pixels into left and right eye viewing windows for viewing by left and right eyes of the observer; the control system is arranged to control the light sources to direct light, in a temporally multiplexed manner, into left and right eye optical windows for viewing by the left and right eyes of the observer; and the control system is arranged to control the spatial light modulator to display, in a temporally multiplexed manner in synchronization with the control of the light sources, (a) a left eye image and a blank image on the first and second sets of pixels, respectively, when the light sources direct light into the left eye optical window, and (b) a blank image and a right eye image on the first and second sets of pixels, respectively, when the light sources direct light into the right eye optical window. 27. A directional display apparatus according to claim 26, wherein
the parallax element is controllable to select the position of the viewing windows, and the control system is further arranged to control the parallax element to direct light into the left and right viewing windows. 28. A directional display apparatus according to claim 22, being an autostereoscopic directional display apparatus wherein:
the parallax element is controllable to select the position of the viewing windows; the control system is arranged to control the parallax element to direct light, in a temporally multiplexed manner, (i) from first and second sets of spatially multiplexed pixels into left and right eye viewing windows, respectively, for viewing by left and right eyes of the observer, and (ii) from the first and second sets of spatially multiplexed pixels into right and left eye viewing windows, respectively, for viewing by right and left eyes of the observer; the control system is arranged to control the light sources (i) while the parallax element directs light from the first set of pixels into the left eye viewing window and from the second set of pixels into the right eye viewing window, to direct light, in a temporally multiplexed manner, into left and right eye optical windows for viewing by the left and right eyes of the observer, and (ii) also while the parallax element directs light from the first set of pixels into the right eye viewing window and from the second set of pixels into the left eye viewing window, to direct light, in a temporally multiplexed manner, into left and right eye optical windows for viewing by the left and right eyes of the observer; and the control system is arranged to control the spatial light modulator (i) while the parallax element directs light from the first set of pixels into the left eye viewing window and from the second set of pixels into the right eye viewing window, to display, in a temporally multiplexed manner in synchronization with the control of the light sources, (a) a left eye image and a blank image on the first and second sets of pixels, respectively, when the light sources direct light into the left eye optical window, and (b) a blank image and a right eye image on the first and second sets of pixels, respectively, when the light sources direct light into the right eye optical window, and (ii) while the parallax element directs light from the first set of pixels into the right eye viewing window and from the second set of pixels into the left eye viewing window, to display, in a temporally multiplexed manner in synchronization with the control of the light sources, (a) a blank eye image and a left image on the first and second sets of pixels, respectively, when the light sources direct light into the left eye optical window, and (b) a right image and a blank eye image on the first and second sets of pixels, respectively, when the light sources direct light into the right eye optical window. 29. A directional display apparatus according to claim 22, being an autostereoscopic directional display apparatus wherein:
the parallax element is controllable to select the position of the viewing windows; the control system is arranged to control the parallax element to direct light, in a temporally multiplexed manner, (i) from a first set of pixels, that is spatially multiplexed with a second set of pixels, into a left eye viewing window for viewing by a left eye of an observer, and (ii) from the first set of pixels into a right eye viewing window for viewing by a right eye of the observer; the control system is arranged to control the light sources, in a temporally multiplexed manner in synchronization with the control of the parallax element, (i) into a left eye optical window for viewing by the left eye of the observer when the parallax element directs light from the first set of pixels into the left eye viewing window, and (ii) into a right eye optical window for viewing by the right eye of the observer when the parallax element directs light from the first set of pixels into the right eye viewing window; and the control system is arranged to control the spatial light modulator to display, in a temporally multiplexed manner in synchronization with the control of the parallax element, (i) a left eye image and a blank image on the first and second sets of pixels, respectively, when the parallax element directs light from the first set of pixels into the left eye viewing window, and (ii) a right eye image and a blank image on the first and second sets of pixels, respectively, when the parallax element directs light from the first set of pixels into the right eye viewing window. 30. A directional display apparatus according to claim 22, being an autostereoscopic directional display apparatus wherein:
the parallax element is controllable to select the position of the viewing windows, the control system is arranged to control the parallax element to direct light, in a temporally multiplexed manner, (a) from all the pixels into a left eye viewing window for viewing by the left eye of the observer, and (b) from all the pixels into a right eye viewing window for viewing by the right eye of the observer; the control system is arranged to control the light sources to direct light, in a temporally multiplexed manner in synchronization with the control of the parallax element, into left and right eye optical windows for viewing by the left and right eyes of the observer; and the control system is arranged to control the spatial light modulator to display, in a temporally multiplexed manner in synchronization with the control of the parallax element and the light sources, (a) a left eye image on all the pixels when the parallax element directs light into the left eye viewing window, and (b) a right eye image on all the pixels when the parallax element directs light into the right eye optical window. 31. A directional display apparatus according to claim 23, further comprising a sensor system arranged to detect the position of the head of the observer, the control system being arranged to control the light sources in accordance with the detected position of the head of the observer. 32. A directional display apparatus according to any one of claim 24, further comprising a sensor system arranged to detect the position of the head of the observer, the control system being arranged to control the light sources and the parallax element in accordance with the detected position of the head of the observer. | 2,800 |
12,216 | 12,216 | 16,455,583 | 2,826 | A semiconductor device that has at least one semiconductor chip attached to a leadframe made of sheet metal of unencumbered full thickness. The leadframe has leads of a first subset that alternate with leads of a second subset. The leads of the first and second subsets have elongated straight lead portions that are parallel to each other in a planar array. A cover layer of insulating material is located over portions of un-encapsulated lead surfaces. The portions of the leads of the first and second subsets that don't have the cover layer have a metallurgical configuration that creates an affinity for solder wetting. | 1. A semiconductor device comprising:
at least one semiconductor chip attached to a leadframe, the leadframe made of sheet metal of unencumbered full thickness and including leads of a first subset alternating with leads of an adjacent second subset, the subsets having elongated straight lead portions that are parallel to each other in a planar array; a package of polymeric compound encapsulating the leadframe, the planar array of the straight lead portions of the first and the second subsets are located at a surface of the package, and un-encapsulated surfaces of the leads are coplanar with the surface of the package; and a cover layer of insulating material located over portions of the un-encapsulated surfaces of the leads, the covered portions of the leads of the first subset alternating with adjacent un-covered portions of the leads of the second subset, and covered portions of the leads of the second subset alternating with adjacent un-covered portions of the leads of the first subset, the un-covered portions of the leads of the first and second subsets having a metallurgical configuration for solder wetting. 2. The semiconductor device of claim 1 wherein the cover layer of insulating material is selected from a group including polymeric-based compounds, polyimide, solder mask, silicon nitride, silicon dioxide, and silicon carbide. 3. The semiconductor device of claim 2 wherein the polymeric-based compounds and polyimides are printed by inkjet or screen technologies. 4. The semiconductor device of claim 3 wherein the polymeric-based compounds and polyimides are cured compounds that act as solder masks. 5. The semiconductor device of claim 1 wherein the at least one semiconductor chip is a first and a second power MOS field effect transistor having input and ground connections, the semiconductor chips are assembled on the leadframe and they are encapsulated by the polymeric compound. 6. The semiconductor device of claim 1 wherein the polymeric compound of the package is an epoxy-based molding compound. 7. The semiconductor device of claim 4 wherein the semiconductor device is a Power Block, the leads of the first subset belonging to the input and ground connections of the first and second power MOS field effect transistors, and the leads of the second subset belong to a switch line connection coupled between the first and second power MOS field effect transistors. 8. The semiconductor device of claim 7 wherein boundaries of the elongated straight lead portions of the first subset and the elongated straight lead portions of the adjacent second subset are selected so that a shortest distance from a border of the un-encapsulated surface of a lead of the first subset to a nearest border of the un-encapsulated surface of a lead of the adjacent second subset is the smallest pin spacing allowed by applicable design rules of the semiconductor device. 9. A semiconductor device comprising:
at least one semiconductor chip attached to a leadframe, the leadframe made of sheet metal of unencumbered full thickness and including leads of a first subset alternating with leads of a second subset, the subsets having elongated straight lead portions that are parallel to each other in a planar array; a package of polymeric compound encapsulating the leadframe, the planar array of the straight lead portions of the first and the second subsets are located at a surface of the package, and un-encapsulated surfaces of the leads are coplanar with the surface of the package; and a surface layer having a metallurgical configuration for low surface energy for portions of the un-encapsulated lead surfaces, the low surface energy layer of the leads of the first subset alternate with the low surface energy layer of the leads of the adjacent second subset, the low energy surface layer inhibiting wetting by solder material. 10. The semiconductor device of claim 9 wherein the surface layer is selected from a group of surface metal compounds Including compounds with oxygen, nitrogen, carbon, sulfur. 11. The semiconductor device of claim 9 wherein the at least one semiconductor chip is a first and a second power MOS field effect transistor having input and ground connections, the semiconductor chips are assembled on the leadframe and they are encapsulated by the polymeric compound. 12. The semiconductor device of claim 9 wherein the polymeric compound of the package is an epoxy-based molding compound. 13. The semiconductor device of claim 11 wherein the semiconductor device is a Power Block, the leads of the first subset belonging to the input and ground connections of the first and second power MOS field effect transistors, and the leads of the second subset belong to a switch line connection coupled between the first and second power MOS field effect transistors. 14. The semiconductor device of claim 13 wherein boundaries of the elongated straight lead portions of the first subset and the elongated straight lead portions of the adjacent second subset are selected so that a shortest distance from a border of the un-encapsulated surface of a lead of the first subset to a nearest border of the un-encapsulated surface of a lead of the adjacent second subset is the smallest pin spacing allowed by applicable design rules of the semiconductor device. | A semiconductor device that has at least one semiconductor chip attached to a leadframe made of sheet metal of unencumbered full thickness. The leadframe has leads of a first subset that alternate with leads of a second subset. The leads of the first and second subsets have elongated straight lead portions that are parallel to each other in a planar array. A cover layer of insulating material is located over portions of un-encapsulated lead surfaces. The portions of the leads of the first and second subsets that don't have the cover layer have a metallurgical configuration that creates an affinity for solder wetting.1. A semiconductor device comprising:
at least one semiconductor chip attached to a leadframe, the leadframe made of sheet metal of unencumbered full thickness and including leads of a first subset alternating with leads of an adjacent second subset, the subsets having elongated straight lead portions that are parallel to each other in a planar array; a package of polymeric compound encapsulating the leadframe, the planar array of the straight lead portions of the first and the second subsets are located at a surface of the package, and un-encapsulated surfaces of the leads are coplanar with the surface of the package; and a cover layer of insulating material located over portions of the un-encapsulated surfaces of the leads, the covered portions of the leads of the first subset alternating with adjacent un-covered portions of the leads of the second subset, and covered portions of the leads of the second subset alternating with adjacent un-covered portions of the leads of the first subset, the un-covered portions of the leads of the first and second subsets having a metallurgical configuration for solder wetting. 2. The semiconductor device of claim 1 wherein the cover layer of insulating material is selected from a group including polymeric-based compounds, polyimide, solder mask, silicon nitride, silicon dioxide, and silicon carbide. 3. The semiconductor device of claim 2 wherein the polymeric-based compounds and polyimides are printed by inkjet or screen technologies. 4. The semiconductor device of claim 3 wherein the polymeric-based compounds and polyimides are cured compounds that act as solder masks. 5. The semiconductor device of claim 1 wherein the at least one semiconductor chip is a first and a second power MOS field effect transistor having input and ground connections, the semiconductor chips are assembled on the leadframe and they are encapsulated by the polymeric compound. 6. The semiconductor device of claim 1 wherein the polymeric compound of the package is an epoxy-based molding compound. 7. The semiconductor device of claim 4 wherein the semiconductor device is a Power Block, the leads of the first subset belonging to the input and ground connections of the first and second power MOS field effect transistors, and the leads of the second subset belong to a switch line connection coupled between the first and second power MOS field effect transistors. 8. The semiconductor device of claim 7 wherein boundaries of the elongated straight lead portions of the first subset and the elongated straight lead portions of the adjacent second subset are selected so that a shortest distance from a border of the un-encapsulated surface of a lead of the first subset to a nearest border of the un-encapsulated surface of a lead of the adjacent second subset is the smallest pin spacing allowed by applicable design rules of the semiconductor device. 9. A semiconductor device comprising:
at least one semiconductor chip attached to a leadframe, the leadframe made of sheet metal of unencumbered full thickness and including leads of a first subset alternating with leads of a second subset, the subsets having elongated straight lead portions that are parallel to each other in a planar array; a package of polymeric compound encapsulating the leadframe, the planar array of the straight lead portions of the first and the second subsets are located at a surface of the package, and un-encapsulated surfaces of the leads are coplanar with the surface of the package; and a surface layer having a metallurgical configuration for low surface energy for portions of the un-encapsulated lead surfaces, the low surface energy layer of the leads of the first subset alternate with the low surface energy layer of the leads of the adjacent second subset, the low energy surface layer inhibiting wetting by solder material. 10. The semiconductor device of claim 9 wherein the surface layer is selected from a group of surface metal compounds Including compounds with oxygen, nitrogen, carbon, sulfur. 11. The semiconductor device of claim 9 wherein the at least one semiconductor chip is a first and a second power MOS field effect transistor having input and ground connections, the semiconductor chips are assembled on the leadframe and they are encapsulated by the polymeric compound. 12. The semiconductor device of claim 9 wherein the polymeric compound of the package is an epoxy-based molding compound. 13. The semiconductor device of claim 11 wherein the semiconductor device is a Power Block, the leads of the first subset belonging to the input and ground connections of the first and second power MOS field effect transistors, and the leads of the second subset belong to a switch line connection coupled between the first and second power MOS field effect transistors. 14. The semiconductor device of claim 13 wherein boundaries of the elongated straight lead portions of the first subset and the elongated straight lead portions of the adjacent second subset are selected so that a shortest distance from a border of the un-encapsulated surface of a lead of the first subset to a nearest border of the un-encapsulated surface of a lead of the adjacent second subset is the smallest pin spacing allowed by applicable design rules of the semiconductor device. | 2,800 |
12,217 | 12,217 | 16,393,898 | 2,812 | A semiconductor package includes a mold compound, a plurality of electrically conductive leads at least some of which transition from a first level within the mold compound to a second (different) level outside the mold compound, and a semiconductor die embedded in the mold compound and attached to the plurality of electrically conductive leads in a flip-chip configuration. One or more leads of the plurality of electrically conductive leads includes a first section terminating at a side face of the mold compound or protruding from the side face with a first end positioned outside a footprint of the mold compound and which terminates at the second level, and a second section embedded in the mold compound and having a second end which is positioned under the semiconductor die and exposed at a bottom side of the semiconductor package. Corresponding methods of manufacture are also described. | 1. A semiconductor package, comprising:
a mold compound; a plurality of electrically conductive leads at least some of which transition from a first level within the mold compound to a second level outside the mold compound, the second level being different than the first level; and a semiconductor die embedded in the mold compound and attached to the plurality of electrically conductive leads in a flip-chip configuration, wherein one or more leads of the plurality of electrically conductive leads comprises:
a first section terminating at a side face of the mold compound, or protruding from the side face with a first end positioned outside a footprint of the mold compound and which terminates at the second level; and
a second section embedded in the mold compound and having a second end which is positioned under the semiconductor die and exposed at a bottom side of the semiconductor package. 2. The semiconductor package of claim 1, wherein the semiconductor die is attached to a horizontal third section of the one or more leads having the first section and the second section, the third section being interposed between the first section and the second section. 3. The semiconductor package of claim 1, wherein at least two leads of the plurality of electrically conductive leads each comprise the first section and the second section so that at least two second lead ends are positioned under the semiconductor die and exposed at the bottom side of the semiconductor package, and wherein the at least two second lead ends positioned under the semiconductor die and exposed at the bottom side of the semiconductor package are electrically coupled to the same electric potential or to ground. 4. The semiconductor package of claim 3, wherein the mold compound is a laser-activatable mold compound having a laser-activated region at the bottom side of the semiconductor package, and wherein the laser-activated region is plated with an electrically conductive material which connects the at least two second lead ends positioned under the semiconductor die and exposed at the bottom side of the semiconductor package. 5. The semiconductor package of claim 4, wherein the laser-activated region is formed in a recessed part of the mold compound at the bottom side of the semiconductor package, and wherein the recessed part is surrounded by a thicker border of the mold compound. 6. The semiconductor package of claim 1, wherein the second end of the one or more leads of the plurality of electrically conductive leads is exposed in a recessed part of the bottom side of the semiconductor package, and wherein the recessed part is surrounded by a thicker border of the mold compound. 7. The semiconductor package of claim 1, wherein at least two leads of the plurality of electrically conductive leads each comprise the first section and the second section so that at least two second lead ends are positioned under the semiconductor die and exposed at the bottom side of the semiconductor package, and wherein the first section of a first one of the at least two leads and the first section of a second one of the at least two leads protrude from opposite side faces of the mold compound. 8. The semiconductor package of claim 1, wherein the plurality of electrically conductive leads protrude from the mold compound below a horizontal centerline of the mold compound. 9. The semiconductor package of claim 1, wherein a side of the semiconductor die facing away from the plurality of electrically conductive leads is exposed at a top side of the semiconductor package. 10. The semiconductor package of claim 1, further comprising a metal block contacting the side of the semiconductor die to which the plurality of electrically conductive leads is attached, wherein the metal block is exposed at the bottom side of the semiconductor package. 11. A method of manufacturing a semiconductor package, the method comprising:
forming a plurality of electrically conductive leads from a leadframe, one or more leads of the plurality of electrically conductive leads comprising a first section and a second section; attaching a semiconductor die to the plurality of electrically conductive leads in a flip-chip configuration; and embedding the semiconductor die and the plurality of electrically conductive leads in a mold compound so that:
at least some of the electrically conductive leads transition from a first level within the mold compound to a second level outside the mold compound, the second level being different than the first level;
the first section of the one or more leads terminates at a side face of the mold compound, or protrudes from the side face with a first end positioned outside a footprint of the mold compound and which terminates at the second level; and
the second section of the one or more leads is embedded in the mold compound and has a second end positioned under the semiconductor die and exposed at a bottom side of the semiconductor package. 12. The method of claim 11, wherein the mold compound is a laser-activatable mold compound and at least two leads of the plurality of leads have the first section and the second section so that at least two second lead ends are positioned under the semiconductor die and exposed at the bottom side of the semiconductor package, the method further comprising:
laser activating a region of the mold compound at the bottom side of the mold compound to form a laser-activated region; and plating the laser-activated region with an electrically conductive material which connects the at least two second lead ends positioned under the semiconductor die and exposed at the bottom side of the semiconductor package. 13. The method of claim 12, further comprising:
forming a recess in the mold compound at the bottom side of the semiconductor package, the recess being surrounded by a thicker border of the mold compound, wherein the laser activating is performed on the recess in the mold compound to form the laser-activated region. 14. An electronic assembly, comprising:
a board; and a semiconductor package attached to the board and comprising:
a mold compound;
a plurality of electrically conductive leads at least some of which transition from a first level within the mold compound to a second level outside the mold compound and connected to the board, the second level being different than the first level; and
a semiconductor die embedded in the mold compound and attached to the plurality of electrically conductive leads in a flip-chip configuration,
wherein one or more leads of the plurality of electrically conductive leads comprises:
a first section terminating at a side face of the mold compound, or protruding from the side face with a first end positioned outside a footprint of the mold compound and which terminates at the second level and is connected to the board; and
a second section embedded in the mold compound and having a second end which is positioned under the semiconductor die, exposed at a bottom side of the semiconductor package and connected to the board. 15. The electronic assembly of claim 14, wherein at least two leads of the plurality of electrically conductive leads each comprise the first section and the second section so that at least two second lead ends are positioned under the semiconductor die and exposed at the bottom side of the semiconductor package and connected to the board, and wherein the at least two second lead ends positioned under the semiconductor die and exposed at the bottom side of the semiconductor package are electrically coupled to the same electric potential or to ground. 16. The electronic assembly of claim 15, wherein the mold compound is a laser-activatable mold compound having a laser-activated region at the bottom side of the semiconductor package, and wherein the laser-activated region is plated with an electrically conductive material which connects the at least two second lead ends positioned under the semiconductor die and exposed at the bottom side of the semiconductor package. 17. The electronic assembly of claim 16, wherein the laser-activated region is formed in a recessed part of the mold compound at the bottom side of the semiconductor package, and wherein the recessed part is surrounded by a thicker border of the mold compound so that the distance between the recessed part of the mold compound and the board is greater than the distance between the thicker border of the mold compound and the board. 18. The electronic assembly of claim 14, wherein the second end of the one or more leads of the plurality of electrically conductive leads is exposed in a recessed part of the bottom side of the semiconductor package, and wherein the recessed part is surrounded by a thicker border of the mold compound so that the distance between the recessed part of the mold compound and the board is greater than the distance between the thicker border of the mold compound and the board. 19. The electronic assembly of claim 14, wherein the plurality of electrically conductive leads protrude from the mold compound below a horizontal centerline of the mold compound. 20. The electronic assembly of claim 14, further comprising a metal block contacting the side of the semiconductor die to which the plurality of electrically conductive leads is attached, wherein the metal block is exposed at the bottom side of the semiconductor package. | A semiconductor package includes a mold compound, a plurality of electrically conductive leads at least some of which transition from a first level within the mold compound to a second (different) level outside the mold compound, and a semiconductor die embedded in the mold compound and attached to the plurality of electrically conductive leads in a flip-chip configuration. One or more leads of the plurality of electrically conductive leads includes a first section terminating at a side face of the mold compound or protruding from the side face with a first end positioned outside a footprint of the mold compound and which terminates at the second level, and a second section embedded in the mold compound and having a second end which is positioned under the semiconductor die and exposed at a bottom side of the semiconductor package. Corresponding methods of manufacture are also described.1. A semiconductor package, comprising:
a mold compound; a plurality of electrically conductive leads at least some of which transition from a first level within the mold compound to a second level outside the mold compound, the second level being different than the first level; and a semiconductor die embedded in the mold compound and attached to the plurality of electrically conductive leads in a flip-chip configuration, wherein one or more leads of the plurality of electrically conductive leads comprises:
a first section terminating at a side face of the mold compound, or protruding from the side face with a first end positioned outside a footprint of the mold compound and which terminates at the second level; and
a second section embedded in the mold compound and having a second end which is positioned under the semiconductor die and exposed at a bottom side of the semiconductor package. 2. The semiconductor package of claim 1, wherein the semiconductor die is attached to a horizontal third section of the one or more leads having the first section and the second section, the third section being interposed between the first section and the second section. 3. The semiconductor package of claim 1, wherein at least two leads of the plurality of electrically conductive leads each comprise the first section and the second section so that at least two second lead ends are positioned under the semiconductor die and exposed at the bottom side of the semiconductor package, and wherein the at least two second lead ends positioned under the semiconductor die and exposed at the bottom side of the semiconductor package are electrically coupled to the same electric potential or to ground. 4. The semiconductor package of claim 3, wherein the mold compound is a laser-activatable mold compound having a laser-activated region at the bottom side of the semiconductor package, and wherein the laser-activated region is plated with an electrically conductive material which connects the at least two second lead ends positioned under the semiconductor die and exposed at the bottom side of the semiconductor package. 5. The semiconductor package of claim 4, wherein the laser-activated region is formed in a recessed part of the mold compound at the bottom side of the semiconductor package, and wherein the recessed part is surrounded by a thicker border of the mold compound. 6. The semiconductor package of claim 1, wherein the second end of the one or more leads of the plurality of electrically conductive leads is exposed in a recessed part of the bottom side of the semiconductor package, and wherein the recessed part is surrounded by a thicker border of the mold compound. 7. The semiconductor package of claim 1, wherein at least two leads of the plurality of electrically conductive leads each comprise the first section and the second section so that at least two second lead ends are positioned under the semiconductor die and exposed at the bottom side of the semiconductor package, and wherein the first section of a first one of the at least two leads and the first section of a second one of the at least two leads protrude from opposite side faces of the mold compound. 8. The semiconductor package of claim 1, wherein the plurality of electrically conductive leads protrude from the mold compound below a horizontal centerline of the mold compound. 9. The semiconductor package of claim 1, wherein a side of the semiconductor die facing away from the plurality of electrically conductive leads is exposed at a top side of the semiconductor package. 10. The semiconductor package of claim 1, further comprising a metal block contacting the side of the semiconductor die to which the plurality of electrically conductive leads is attached, wherein the metal block is exposed at the bottom side of the semiconductor package. 11. A method of manufacturing a semiconductor package, the method comprising:
forming a plurality of electrically conductive leads from a leadframe, one or more leads of the plurality of electrically conductive leads comprising a first section and a second section; attaching a semiconductor die to the plurality of electrically conductive leads in a flip-chip configuration; and embedding the semiconductor die and the plurality of electrically conductive leads in a mold compound so that:
at least some of the electrically conductive leads transition from a first level within the mold compound to a second level outside the mold compound, the second level being different than the first level;
the first section of the one or more leads terminates at a side face of the mold compound, or protrudes from the side face with a first end positioned outside a footprint of the mold compound and which terminates at the second level; and
the second section of the one or more leads is embedded in the mold compound and has a second end positioned under the semiconductor die and exposed at a bottom side of the semiconductor package. 12. The method of claim 11, wherein the mold compound is a laser-activatable mold compound and at least two leads of the plurality of leads have the first section and the second section so that at least two second lead ends are positioned under the semiconductor die and exposed at the bottom side of the semiconductor package, the method further comprising:
laser activating a region of the mold compound at the bottom side of the mold compound to form a laser-activated region; and plating the laser-activated region with an electrically conductive material which connects the at least two second lead ends positioned under the semiconductor die and exposed at the bottom side of the semiconductor package. 13. The method of claim 12, further comprising:
forming a recess in the mold compound at the bottom side of the semiconductor package, the recess being surrounded by a thicker border of the mold compound, wherein the laser activating is performed on the recess in the mold compound to form the laser-activated region. 14. An electronic assembly, comprising:
a board; and a semiconductor package attached to the board and comprising:
a mold compound;
a plurality of electrically conductive leads at least some of which transition from a first level within the mold compound to a second level outside the mold compound and connected to the board, the second level being different than the first level; and
a semiconductor die embedded in the mold compound and attached to the plurality of electrically conductive leads in a flip-chip configuration,
wherein one or more leads of the plurality of electrically conductive leads comprises:
a first section terminating at a side face of the mold compound, or protruding from the side face with a first end positioned outside a footprint of the mold compound and which terminates at the second level and is connected to the board; and
a second section embedded in the mold compound and having a second end which is positioned under the semiconductor die, exposed at a bottom side of the semiconductor package and connected to the board. 15. The electronic assembly of claim 14, wherein at least two leads of the plurality of electrically conductive leads each comprise the first section and the second section so that at least two second lead ends are positioned under the semiconductor die and exposed at the bottom side of the semiconductor package and connected to the board, and wherein the at least two second lead ends positioned under the semiconductor die and exposed at the bottom side of the semiconductor package are electrically coupled to the same electric potential or to ground. 16. The electronic assembly of claim 15, wherein the mold compound is a laser-activatable mold compound having a laser-activated region at the bottom side of the semiconductor package, and wherein the laser-activated region is plated with an electrically conductive material which connects the at least two second lead ends positioned under the semiconductor die and exposed at the bottom side of the semiconductor package. 17. The electronic assembly of claim 16, wherein the laser-activated region is formed in a recessed part of the mold compound at the bottom side of the semiconductor package, and wherein the recessed part is surrounded by a thicker border of the mold compound so that the distance between the recessed part of the mold compound and the board is greater than the distance between the thicker border of the mold compound and the board. 18. The electronic assembly of claim 14, wherein the second end of the one or more leads of the plurality of electrically conductive leads is exposed in a recessed part of the bottom side of the semiconductor package, and wherein the recessed part is surrounded by a thicker border of the mold compound so that the distance between the recessed part of the mold compound and the board is greater than the distance between the thicker border of the mold compound and the board. 19. The electronic assembly of claim 14, wherein the plurality of electrically conductive leads protrude from the mold compound below a horizontal centerline of the mold compound. 20. The electronic assembly of claim 14, further comprising a metal block contacting the side of the semiconductor die to which the plurality of electrically conductive leads is attached, wherein the metal block is exposed at the bottom side of the semiconductor package. | 2,800 |
12,218 | 12,218 | 16,419,265 | 2,844 | A light fixture includes a first phosphor-converted light-emitting diode (“PCLED”) emitting light in a first PCLED wavelength range having first PCLED upper and lower bounds, a first direct light-emitting diode (“DLED”) emitting light in a first DLED wavelength range having first DLED upper and lower bounds, a second PCLED emitting light in a second PCLED wavelength range having second PCLED upper and lower bounds, and a second DLED emitting light in a second DLED wavelength range having second DLED upper and lower bounds. The first PCLED upper bound has a higher wavelength value than the first DLED upper bound. The first PCLED lower bound has a lower wavelength value than the first DLED lower bound. The second PCLED upper bound has a higher wavelength value than the second DLED upper bound. The second PCLED lower bound has a lower wavelength value than the second DLED lower bound. | 1. A light fixture comprising:
a housing; a first light-emitting diode disposed in the housing; a first phosphor layer associated with the first light-emitting diode (“LED”), forming a first phosphor-converted light-emitting diode (“PCLED”), the first PCLED configured to emit light in a first PCLED wavelength range including a first PCLED upper bound and a first PCLED lower bound; a second LED disposed in the housing; a second phosphor layer associated with the second LED, forming a second PCLED, the second PCLED configured to emit light in a second PCLED wavelength range including a second PCLED upper bound and a second PCLED lower bound; a third LED disposed in the housing, the third LED configured to emit light in a third LED wavelength range including a third LED upper bound and a third LED lower bound; a fourth LED disposed in the housing, the fourth LED configured to emit light in a fourth LED wavelength range including a fourth LED upper bound and a fourth LED lower bound; wherein the first PCLED upper bound of the first PCLED wavelength range has a higher wavelength value than the third LED upper bound of the third LED wavelength range; wherein the first PCLED lower bound of the first PCLED wavelength range has a lower wavelength value than the third LED lower bound of the third LED wavelength range; wherein the second PCLED upper bound of the second PCLED wavelength range has a higher wavelength value than the fourth LED upper bound of the fourth LED wavelength range; and wherein the second PCLED lower bound of the second PCLED wavelength range has a lower wavelength value than the fourth LED lower bound of the fourth LED wavelength range. 2. The light fixture of claim 1, further comprising
a third phosphor layer associated with the third LED, forming a third PCLED, the third PCLED configured to emit light in the third LED wavelength range; a fourth phosphor layer associated with the fourth LED, forming a fourth PCLED, the fourth PCLED configured to emit light in the fourth LED wavelength range; and wherein
the first PCLED and the second PCLED are broadband PCLEDs; and
the third LED and the fourth LED are narrow band PCLEDs 3. The light fixture of claim 1, wherein
the third LED is a first direct light-emitting diode (“DLED”); the third LED wavelength range is a first DLED wavelength range; the third LED upper bound is a first DLED upper bound; the third LED lower bound is a first DLED lower bound; the fourth LED is a second DLED; the fourth LED wavelength range is a second DLED wavelength range; the fourth LED upper bound is a second DLED upper bound; and the fourth LED lower bound is a second DLED lower bound. 4. The light fixture of claim 3, wherein
the first phosphor layer absorbs light from the first light-emitting diode, and the first phosphor layer emits the absorbed light within the first PCLED wavelength range; and the second phosphor layer absorbs light from the second light-emitting diode, and the second phosphor layer emits the absorbed light within the second PCLED wavelength range. 5. The light fixture of claim 3, wherein
the light emitted in the first PCLED wavelength range includes a median first PCLED wavelength; the light emitted in the first DLED wavelength range includes a median first DLED wavelength; the median first PCLED wavelength and the median first DLED wavelength are within 25 nanometers of each other; the light emitted in the second PCLED wavelength range includes a median second PCLED wavelength; the light emitted in the second DLED wavelength range includes a median second DLED wavelength; and the median second PCLED wavelength and the median second DLED wavelength are within 25 nanometers of each other. 6. The light fixture of claim 3, further comprising
a fifth LED disposed in the housing; a third phosphor layer associated with the fifth LED, forming a third PCLED, the third PCLED configured to emit light in a third PCLED wavelength range including a third PCLED upper bound and a third PCLED lower bound; a sixth LED disposed in the housing, the sixth LED being a third DLED, the third DLED configured to emit light in a third DLED wavelength range including a third DLED upper bound and a third DLED lower bound; wherein the third PCLED upper bound of the third PCLED wavelength range has a higher wavelength value than the third DLED upper bound of the third DLED wavelength range; and wherein the third PCLED lower bound of the third PCLED wavelength range has a lower wavelength value than the third DLED lower bound of the third DLED wavelength range. 7. A lighting system comprising:
a light fixture including
a first phosphor-converted light-emitting diode (“PCLED”) configured to emit light in a first PCLED wavelength range,
a first direct light-emitting diode (“DLED”) configured to emit light in a first DLED wavelength range, the first DLED wavelength range falling completely within the first PCLED wavelength range,
a second PCLED configured to emit light in a second PCLED wavelength range, and
a second DLED configured to emit light in a second DLED wavelength range, the second DLED wavelength range falling completely within the second PCLED wavelength range; and
a controller configured to
receive a control signal corresponding to a target characteristic of light to be projected by the light fixture,
determine a first PCLED output value for the first PCLED based on the control signal,
determine a first DLED output value for the first DLED based on the control signal,
determine a second PCLED output value for the second PCLED based on the control signal,
determine a second DLED output value for the second DLED based on the control signal,
drive the first PCLED at the first PCLED output value,
drive the first DLED at the first DLED output value,
drive the second PCLED at the second PCLED output value, and
drive the second DLED at the second DLED output value. 8. The lighting system of claim 7, wherein
the target characteristic of the light to be projected by the light fixture includes a first DLED wavelength range intensity and a first PCLED wavelength range intensity combining at a target ratio; and the color ratio includes the first DLED wavelength range intensity being at least two times greater than the first PCLED wavelength range intensity. 9. The lighting system of claim 7, wherein
the target characteristic of the light to be projected by the light fixture includes a target wavelength range; and the light to be projected by the light fixture is limited to the target wavelength range. 10. The lighting system of claim 7, wherein the first DLED output value does not illuminate the first DLED and the first PCLED output value does illuminate the first PCLED to produce the target characteristic of the light to be projected by the light fixture. 11. The lighting system of claim 7, wherein the first PCLED output value does not illuminate the first PCLED and the first DLED output value does illuminate the first DLED to produce the target characteristic of the light to be projected by the light fixture. 12. The lighting system of claim 7, wherein
the light emitted in the first PCLED wavelength range includes a median first PCLED wavelength; the light emitted in the first DLED wavelength range includes a median first DLED wavelength; and the median first PCLED wavelength and the median first DLED wavelength are within 25 nanometers of each other. 13. The lighting system of claim 7, wherein
the light fixture further includes
a third PCLED configured to emit light in a third PCLED wavelength range, and
a third DLED configured to emit light in a third DLED wavelength range, the third DLED wavelength range falling completely within the third PCLED wavelength range; and
the controller is further configured to
determine a third PCLED output value for the third PCLED based on the control signal,
determine a third DLED output value for the third DLED based on the control signal,
drive the third PCLED at the third PCLED output value, and
drive the third DLED at the third DLED output value. 14. A method for driving light-emitting diodes in a light fixture, the light fixture including at least a first phosphor-converted light-emitting diode (“PCLED”) that emits light in a first PCLED wavelength range, a second PCLED that emits light in a second PCLED wavelength range, a first direct light-emitting diode (“DLED”) that emits light in a first DLED wavelength range, and a second DLED that emits light in a second DLED wavelength range, the first DLED wavelength range being within the first PCLED wavelength range and the second DLED wavelength range being within the second PCLED wavelength range, the method comprising:
determining a first PCLED output value for the first PCLED based on a target characteristic of light to be projected by the light fixture;
determining a first DLED output value for the first DLED based on the target characteristic of light to be projected by the light fixture;
determining a second PCLED output value for the second PCLED based on the target characteristic of light to be projected by the light fixture;
determining a second DLED output value for the second DLED based on the target characteristic of the light to be projected by the light fixture;
driving the first PCLED at the PCLED output value;
driving the first DLED at the first DLED output value;
driving the second PCLED at the second PCLED output value; and
driving the second DLED at the second DLED output value. 15. The method of claim 14, wherein
the target characteristic of the light to be projected by the light fixture includes a first DLED wavelength range intensity and a first PCLED wavelength range intensity combining at a target ratio; and the target ratio includes the first DLED wavelength range intensity being at least two times greater than the first PCLED wavelength range intensity. 16. The method of claim 14, wherein
the target characteristic of the light to be projected by the light fixture includes a target wavelength range. 17. The method of claim 14, wherein
the first DLED output value does not illuminate the first DLED; and the first PCLED output value does illuminate the first PCLED to produce the target characteristic of the light to be projected by the light fixture. 18. The method of claim 14, wherein
the first PCLED output value does not illuminate the first PCLED; and the first DLED output value does illuminate the first DLED to produce the target characteristic of the light to be projected by the light fixture. 19. The method of claim 14, wherein
the light emitted in the first PCLED wavelength range includes a corresponding median first PCLED wavelength; the light emitted in the first DLED wavelength range includes a corresponding median first DLED wavelength; the light emitted in the second PCLED wavelength range includes a corresponding median second PCLED wavelength; the light emitted in the second DLED wavelength range includes a corresponding median second DLED wavelength; the median first PCLED wavelength and the median first DLED wavelength are within 25 nanometers of each other; and the median second PCLED wavelength and the median second DLED wavelength are within 25 nanometers of each other. 20. The method of claim 14, wherein the light fixture further includes a third PCLED that emits light in a third PCLED wavelength range and a third DLED that emits light in a third DLED wavelength range, the third DLED wavelength range being within the third PCLED wavelength range, the method further comprising
determining a third PCLED output value for the third PCLED based on the target characteristic of light to be projected by the light fixture; determining a third DLED output value for the third DLED based on the target characteristic of the light to be projected by the light fixture; driving the third PCLED at the third PCLED output value; and driving the third DLED at the third DLED output value. | A light fixture includes a first phosphor-converted light-emitting diode (“PCLED”) emitting light in a first PCLED wavelength range having first PCLED upper and lower bounds, a first direct light-emitting diode (“DLED”) emitting light in a first DLED wavelength range having first DLED upper and lower bounds, a second PCLED emitting light in a second PCLED wavelength range having second PCLED upper and lower bounds, and a second DLED emitting light in a second DLED wavelength range having second DLED upper and lower bounds. The first PCLED upper bound has a higher wavelength value than the first DLED upper bound. The first PCLED lower bound has a lower wavelength value than the first DLED lower bound. The second PCLED upper bound has a higher wavelength value than the second DLED upper bound. The second PCLED lower bound has a lower wavelength value than the second DLED lower bound.1. A light fixture comprising:
a housing; a first light-emitting diode disposed in the housing; a first phosphor layer associated with the first light-emitting diode (“LED”), forming a first phosphor-converted light-emitting diode (“PCLED”), the first PCLED configured to emit light in a first PCLED wavelength range including a first PCLED upper bound and a first PCLED lower bound; a second LED disposed in the housing; a second phosphor layer associated with the second LED, forming a second PCLED, the second PCLED configured to emit light in a second PCLED wavelength range including a second PCLED upper bound and a second PCLED lower bound; a third LED disposed in the housing, the third LED configured to emit light in a third LED wavelength range including a third LED upper bound and a third LED lower bound; a fourth LED disposed in the housing, the fourth LED configured to emit light in a fourth LED wavelength range including a fourth LED upper bound and a fourth LED lower bound; wherein the first PCLED upper bound of the first PCLED wavelength range has a higher wavelength value than the third LED upper bound of the third LED wavelength range; wherein the first PCLED lower bound of the first PCLED wavelength range has a lower wavelength value than the third LED lower bound of the third LED wavelength range; wherein the second PCLED upper bound of the second PCLED wavelength range has a higher wavelength value than the fourth LED upper bound of the fourth LED wavelength range; and wherein the second PCLED lower bound of the second PCLED wavelength range has a lower wavelength value than the fourth LED lower bound of the fourth LED wavelength range. 2. The light fixture of claim 1, further comprising
a third phosphor layer associated with the third LED, forming a third PCLED, the third PCLED configured to emit light in the third LED wavelength range; a fourth phosphor layer associated with the fourth LED, forming a fourth PCLED, the fourth PCLED configured to emit light in the fourth LED wavelength range; and wherein
the first PCLED and the second PCLED are broadband PCLEDs; and
the third LED and the fourth LED are narrow band PCLEDs 3. The light fixture of claim 1, wherein
the third LED is a first direct light-emitting diode (“DLED”); the third LED wavelength range is a first DLED wavelength range; the third LED upper bound is a first DLED upper bound; the third LED lower bound is a first DLED lower bound; the fourth LED is a second DLED; the fourth LED wavelength range is a second DLED wavelength range; the fourth LED upper bound is a second DLED upper bound; and the fourth LED lower bound is a second DLED lower bound. 4. The light fixture of claim 3, wherein
the first phosphor layer absorbs light from the first light-emitting diode, and the first phosphor layer emits the absorbed light within the first PCLED wavelength range; and the second phosphor layer absorbs light from the second light-emitting diode, and the second phosphor layer emits the absorbed light within the second PCLED wavelength range. 5. The light fixture of claim 3, wherein
the light emitted in the first PCLED wavelength range includes a median first PCLED wavelength; the light emitted in the first DLED wavelength range includes a median first DLED wavelength; the median first PCLED wavelength and the median first DLED wavelength are within 25 nanometers of each other; the light emitted in the second PCLED wavelength range includes a median second PCLED wavelength; the light emitted in the second DLED wavelength range includes a median second DLED wavelength; and the median second PCLED wavelength and the median second DLED wavelength are within 25 nanometers of each other. 6. The light fixture of claim 3, further comprising
a fifth LED disposed in the housing; a third phosphor layer associated with the fifth LED, forming a third PCLED, the third PCLED configured to emit light in a third PCLED wavelength range including a third PCLED upper bound and a third PCLED lower bound; a sixth LED disposed in the housing, the sixth LED being a third DLED, the third DLED configured to emit light in a third DLED wavelength range including a third DLED upper bound and a third DLED lower bound; wherein the third PCLED upper bound of the third PCLED wavelength range has a higher wavelength value than the third DLED upper bound of the third DLED wavelength range; and wherein the third PCLED lower bound of the third PCLED wavelength range has a lower wavelength value than the third DLED lower bound of the third DLED wavelength range. 7. A lighting system comprising:
a light fixture including
a first phosphor-converted light-emitting diode (“PCLED”) configured to emit light in a first PCLED wavelength range,
a first direct light-emitting diode (“DLED”) configured to emit light in a first DLED wavelength range, the first DLED wavelength range falling completely within the first PCLED wavelength range,
a second PCLED configured to emit light in a second PCLED wavelength range, and
a second DLED configured to emit light in a second DLED wavelength range, the second DLED wavelength range falling completely within the second PCLED wavelength range; and
a controller configured to
receive a control signal corresponding to a target characteristic of light to be projected by the light fixture,
determine a first PCLED output value for the first PCLED based on the control signal,
determine a first DLED output value for the first DLED based on the control signal,
determine a second PCLED output value for the second PCLED based on the control signal,
determine a second DLED output value for the second DLED based on the control signal,
drive the first PCLED at the first PCLED output value,
drive the first DLED at the first DLED output value,
drive the second PCLED at the second PCLED output value, and
drive the second DLED at the second DLED output value. 8. The lighting system of claim 7, wherein
the target characteristic of the light to be projected by the light fixture includes a first DLED wavelength range intensity and a first PCLED wavelength range intensity combining at a target ratio; and the color ratio includes the first DLED wavelength range intensity being at least two times greater than the first PCLED wavelength range intensity. 9. The lighting system of claim 7, wherein
the target characteristic of the light to be projected by the light fixture includes a target wavelength range; and the light to be projected by the light fixture is limited to the target wavelength range. 10. The lighting system of claim 7, wherein the first DLED output value does not illuminate the first DLED and the first PCLED output value does illuminate the first PCLED to produce the target characteristic of the light to be projected by the light fixture. 11. The lighting system of claim 7, wherein the first PCLED output value does not illuminate the first PCLED and the first DLED output value does illuminate the first DLED to produce the target characteristic of the light to be projected by the light fixture. 12. The lighting system of claim 7, wherein
the light emitted in the first PCLED wavelength range includes a median first PCLED wavelength; the light emitted in the first DLED wavelength range includes a median first DLED wavelength; and the median first PCLED wavelength and the median first DLED wavelength are within 25 nanometers of each other. 13. The lighting system of claim 7, wherein
the light fixture further includes
a third PCLED configured to emit light in a third PCLED wavelength range, and
a third DLED configured to emit light in a third DLED wavelength range, the third DLED wavelength range falling completely within the third PCLED wavelength range; and
the controller is further configured to
determine a third PCLED output value for the third PCLED based on the control signal,
determine a third DLED output value for the third DLED based on the control signal,
drive the third PCLED at the third PCLED output value, and
drive the third DLED at the third DLED output value. 14. A method for driving light-emitting diodes in a light fixture, the light fixture including at least a first phosphor-converted light-emitting diode (“PCLED”) that emits light in a first PCLED wavelength range, a second PCLED that emits light in a second PCLED wavelength range, a first direct light-emitting diode (“DLED”) that emits light in a first DLED wavelength range, and a second DLED that emits light in a second DLED wavelength range, the first DLED wavelength range being within the first PCLED wavelength range and the second DLED wavelength range being within the second PCLED wavelength range, the method comprising:
determining a first PCLED output value for the first PCLED based on a target characteristic of light to be projected by the light fixture;
determining a first DLED output value for the first DLED based on the target characteristic of light to be projected by the light fixture;
determining a second PCLED output value for the second PCLED based on the target characteristic of light to be projected by the light fixture;
determining a second DLED output value for the second DLED based on the target characteristic of the light to be projected by the light fixture;
driving the first PCLED at the PCLED output value;
driving the first DLED at the first DLED output value;
driving the second PCLED at the second PCLED output value; and
driving the second DLED at the second DLED output value. 15. The method of claim 14, wherein
the target characteristic of the light to be projected by the light fixture includes a first DLED wavelength range intensity and a first PCLED wavelength range intensity combining at a target ratio; and the target ratio includes the first DLED wavelength range intensity being at least two times greater than the first PCLED wavelength range intensity. 16. The method of claim 14, wherein
the target characteristic of the light to be projected by the light fixture includes a target wavelength range. 17. The method of claim 14, wherein
the first DLED output value does not illuminate the first DLED; and the first PCLED output value does illuminate the first PCLED to produce the target characteristic of the light to be projected by the light fixture. 18. The method of claim 14, wherein
the first PCLED output value does not illuminate the first PCLED; and the first DLED output value does illuminate the first DLED to produce the target characteristic of the light to be projected by the light fixture. 19. The method of claim 14, wherein
the light emitted in the first PCLED wavelength range includes a corresponding median first PCLED wavelength; the light emitted in the first DLED wavelength range includes a corresponding median first DLED wavelength; the light emitted in the second PCLED wavelength range includes a corresponding median second PCLED wavelength; the light emitted in the second DLED wavelength range includes a corresponding median second DLED wavelength; the median first PCLED wavelength and the median first DLED wavelength are within 25 nanometers of each other; and the median second PCLED wavelength and the median second DLED wavelength are within 25 nanometers of each other. 20. The method of claim 14, wherein the light fixture further includes a third PCLED that emits light in a third PCLED wavelength range and a third DLED that emits light in a third DLED wavelength range, the third DLED wavelength range being within the third PCLED wavelength range, the method further comprising
determining a third PCLED output value for the third PCLED based on the target characteristic of light to be projected by the light fixture; determining a third DLED output value for the third DLED based on the target characteristic of the light to be projected by the light fixture; driving the third PCLED at the third PCLED output value; and driving the third DLED at the third DLED output value. | 2,800 |
12,219 | 12,219 | 15,816,114 | 2,837 | An inductive device includes a toroidal core and at least one electric conductor wound around the toroidal core and constituting at least one winding. The inductive device includes a cooling element constituting a cylindrical cavity that contains the toroidal core and the electric conductor so that the axial direction of the toroidal core is parallel with the axial direction of the cylindrical cavity. The shape of the cylindrical cavity and the cross-section of the electric conductor are adapted to match each other so as to improve heat transfer from the electric conductor to the wall of the cylindrical cavity. The cylindrical cavity can have for example a circular base and the electric conductor can have for example a rectangular cross-section that matches the shape of the wall of the cylindrical cavity better than a round electric conductor. | 1. An inductive device comprising:
a toroidal core, at least one electric conductor wound around the toroidal core and constituting at least one winding, portions of the electric conductor on an outer perimeter of the winding being straight and parallel with an axial direction of the toroidal core, and a cooling element constituting a cylindrical cavity containing the toroidal core and the electric conductor so that the axial direction of the toroidal core is parallel with an axial direction of the cylindrical cavity and distances from a wall of the cylindrical cavity to different ones of the portions of the electric conductor are substantially equal,
wherein a shape of the wall of the cylindrical cavity and a cross-sectional shape of the electric conductor are adapted to match each other so that at least one of the following deviates from a circular shape so as to improve heat transfer from the electric conductor to the wall of the cylindrical cavity: i) the cross-sectional shape of the electric conductor and ii) a cross-sectional shape of the cylindrical cavity in a geometric plane perpendicular to the axial direction of the cylindrical cavity. 2. An inductive device according to claim 1, wherein the cross-sectional shape of the electric conductor is substantially rectangular and the cross-sectional shape of the cylindrical cavity is circular. 3. An inductive device according to claim 1, wherein gaps between the wall of the cylindrical cavity and the portions of the electric conductors are filled with electrically insulating solid material. 4. An inductive device according to claim 3, wherein an electrically insulating outer lining of the electric conductor constitutes at least a part of the electrically insulating solid material. 5. An inductive device according to claim 3, wherein an electrically insulating inner lining of the cylindrical cavity constitutes at least a part of the electrically insulating solid material. 6. An inductive device according to claim 4, wherein an electrically insulating inner lining of the cylindrical cavity constitutes at least a part of the electrically insulating solid material. 7. An inductive device according to claim 1, wherein the cooling element comprises cooling fins. 8. An inductive device according to claim 1, wherein the cooling element comprises one or more cooling ducts for conducting cooling fluid. 9. An inductive device according to claim 1, wherein the cooling element comprises a bottom section constituting a bottom of the cylindrical cavity and being in a heat conductive relation with the electric conductor. 10. An inductive device according to claim 9, wherein gaps between the bottom section and the electric conductor are filled with electrically insulating solid material. 11. An inductive device according to claim 9, wherein the bottom section comprises cooling fins. 12. An inductive device according to claim 9, wherein the bottom section comprises one or more cooling ducts for conducting cooling fluid. 13. An inductive device according to claim 1, wherein the toroidal core comprises ferromagnetic material. 14. An inductive device according to claim 13, wherein the toroidal core comprises an elongated band of steel coated with electrically insulating material and reeled to constitute the toroidal core. 15. An inductive device according to claim 13, wherein the toroidal core comprises ring-shaped and planar sheets of steel coated with electrically insulating material and stacked in the axial direction of the toroidal core. | An inductive device includes a toroidal core and at least one electric conductor wound around the toroidal core and constituting at least one winding. The inductive device includes a cooling element constituting a cylindrical cavity that contains the toroidal core and the electric conductor so that the axial direction of the toroidal core is parallel with the axial direction of the cylindrical cavity. The shape of the cylindrical cavity and the cross-section of the electric conductor are adapted to match each other so as to improve heat transfer from the electric conductor to the wall of the cylindrical cavity. The cylindrical cavity can have for example a circular base and the electric conductor can have for example a rectangular cross-section that matches the shape of the wall of the cylindrical cavity better than a round electric conductor.1. An inductive device comprising:
a toroidal core, at least one electric conductor wound around the toroidal core and constituting at least one winding, portions of the electric conductor on an outer perimeter of the winding being straight and parallel with an axial direction of the toroidal core, and a cooling element constituting a cylindrical cavity containing the toroidal core and the electric conductor so that the axial direction of the toroidal core is parallel with an axial direction of the cylindrical cavity and distances from a wall of the cylindrical cavity to different ones of the portions of the electric conductor are substantially equal,
wherein a shape of the wall of the cylindrical cavity and a cross-sectional shape of the electric conductor are adapted to match each other so that at least one of the following deviates from a circular shape so as to improve heat transfer from the electric conductor to the wall of the cylindrical cavity: i) the cross-sectional shape of the electric conductor and ii) a cross-sectional shape of the cylindrical cavity in a geometric plane perpendicular to the axial direction of the cylindrical cavity. 2. An inductive device according to claim 1, wherein the cross-sectional shape of the electric conductor is substantially rectangular and the cross-sectional shape of the cylindrical cavity is circular. 3. An inductive device according to claim 1, wherein gaps between the wall of the cylindrical cavity and the portions of the electric conductors are filled with electrically insulating solid material. 4. An inductive device according to claim 3, wherein an electrically insulating outer lining of the electric conductor constitutes at least a part of the electrically insulating solid material. 5. An inductive device according to claim 3, wherein an electrically insulating inner lining of the cylindrical cavity constitutes at least a part of the electrically insulating solid material. 6. An inductive device according to claim 4, wherein an electrically insulating inner lining of the cylindrical cavity constitutes at least a part of the electrically insulating solid material. 7. An inductive device according to claim 1, wherein the cooling element comprises cooling fins. 8. An inductive device according to claim 1, wherein the cooling element comprises one or more cooling ducts for conducting cooling fluid. 9. An inductive device according to claim 1, wherein the cooling element comprises a bottom section constituting a bottom of the cylindrical cavity and being in a heat conductive relation with the electric conductor. 10. An inductive device according to claim 9, wherein gaps between the bottom section and the electric conductor are filled with electrically insulating solid material. 11. An inductive device according to claim 9, wherein the bottom section comprises cooling fins. 12. An inductive device according to claim 9, wherein the bottom section comprises one or more cooling ducts for conducting cooling fluid. 13. An inductive device according to claim 1, wherein the toroidal core comprises ferromagnetic material. 14. An inductive device according to claim 13, wherein the toroidal core comprises an elongated band of steel coated with electrically insulating material and reeled to constitute the toroidal core. 15. An inductive device according to claim 13, wherein the toroidal core comprises ring-shaped and planar sheets of steel coated with electrically insulating material and stacked in the axial direction of the toroidal core. | 2,800 |
12,220 | 12,220 | 16,132,003 | 2,824 | A write driver includes a first write data driver, a second write driver, and a control circuit. The first (second) write data driver provides a true (complement) write data signal to an output thereof at a high voltage when a true (complement) data signal is in a first logic state, at a ground voltage when the true (complement) data signal is in a second logic state and a negative bit line enable signal is inactive, and at a voltage below the ground voltage when the true (complement) data signal is in the second logic state and the negative bit line enable signal is active. The control circuit provides the negative bit line enable signal in an active state when a power supply voltage is below a first threshold, and in an inactive state when the power supply voltage is above a second threshold higher than the first threshold. | 1. A write driver, comprising:
a first write data driver for providing a true write data signal to an output thereof at a high voltage when a true data signal is in a first logic state, at a ground voltage when the true data signal is in a second logic state and a negative bit line enable signal is inactive, and at a voltage below the ground voltage when the true data signal is in the second logic state and the negative bit line enable signal is active; a second write data driver for providing a complement write data signal to an output thereof at the high voltage when a complement data signal is in the first logic state, at the ground voltage when the complement data signal is in the second logic state and the negative bit line enable signal is inactive, and at the voltage below the ground voltage when the complement data signal is in the second logic state and the negative bit line enable signal is active; and a control circuit for providing the negative bit line enable signal in an active state when a power supply voltage is below a first threshold, and in an inactive state when the power supply voltage is above a second threshold higher than the first threshold. 2. The write driver of claim 1, wherein each of the first and second write data drivers comprises:
a NOR gate having a first input for receiving a respective one of the true data signal and compliment data signal, a second input for receiving the negative bit line enable signal, and an output; an inverter having in input for receiving the respective one of the true data signal and compliment data signals, and an output; a pulldown transistor having a source for receiving the power supply voltage, a gate coupled to the output of a respective one of the NOR gate, and a drain forming the output of a respective one of the first write data driver and the second write data driver; and a pullup transistor having a source coupled to a respective one of the drain of the pulldown transistor, a gate coupled to the respective one of the output of the inverter, and a drain for receiving the ground voltage. 3. The write driver, of claim 1, further comprising a negative charge pump. 4. The write driver, of claim 3, wherein the negative charge pump comprises:
a delay driver having an input for receiving the negative bit line enable signal, and an output; a capacitor having a first terminal coupled to the output of the delay driver, and a second terminal; and a multiplexer for selectively coupling the power supply voltage at the second terminal of the capacitor to a respective one of the output of the first write data driver and the second write data driver in response to values of the true and complement data signals. 5. The write driver, of claim 3, wherein the negative charge pump is a programmable negative charge pump circuit having a plurality of negative charge pump stages for selectively providing the negative bit line enable signal based on the power supply voltage. 6. The write driver, of claim 1, wherein the high voltage is a predetermined high voltage. 7. The write driver of claim 1, further wherein:
in response to a transition from the high voltage to a low voltage, the write driver further providing the negative bit line enable signal in the active state when the power supply voltage is between the first threshold and the second threshold, wherein the low voltage is a predetermined low voltage; and in response to a transition from the low voltage to the high voltage, the write driver further providing the negative bit line in an inactive state. 8. A method for selectively boosting a differential bit line voltage on a bit line pair in a memory device, comprising:
receiving access requests at the memory device operating according to an initial power supply voltage; in response to detection of a change of a power supply voltage, selecting between enabling and disabling a negative bit line enable signal to the memory device based at least in part on the power supply voltage; generating the negative bit line enable signal in response to detecting an active operating power state, when the initial power supply voltage is below a first threshold, and in response to detecting an inactive operating power state, when the initial power supply voltage is above a second threshold higher than the first threshold; and driving a selected bit line of a bit line pair to a negative voltage in response to the negative bit line enable signal. 9. The method of claim 8, wherein providing the negative bit line enable signal further comprises selectively providing a negative bit line voltage signal to a first bit line of the bit line pair and leaving a second bit line of the bit line pair in a precharged state. 10. The method of claim 8, further comprises generating the negative bit line enable signal to a charge pump, wherein the charge pump selectively provides the negative bit line enable signal to the memory device. 11. The method of claim 8, further comprising: selectively enabling a number of stages of a plurality of parallel connected charge pump stages in response to the power supply voltage. 12. The method of claim 11, further comprising determining the number of stages to selectively enable based on an operating power state. 13. The method of claim 12, further comprising determining a change in the operating power state based on a power state table. 14. The method of claim 8, wherein generating the negative bit line enable signal comprises generating the negative bit line enable signal for a plurality of pairs of bit lines. 15. The method of claim 8, wherein the memory device comprises at least one of a level one cache, a level two cache, and a level three cache of a static random-access memory device. 16. A memory comprising:
true and complement bit lines forming a bit line pair; a plurality of memory cells coupled to the true and complement bit lines, each memory cell for storing a memory bit according to a differential voltage between the true and complement bit lines when selected during a write cycle; and a write driver coupled to the true and complement bit lines comprising:
a first write data driver for providing a true write data signal to the true bit line at a high voltage when a true data signal is in a first logic state, at a ground voltage when the true data signal is in a second logic state and a negative bit line enable signal is inactive, and at a voltage below the ground voltage when the true data signal is in the second logic state and the negative bit line enable signal is active;
a second write data driver for providing a complement write data signal to the complement bit line at the high voltage when a complement data signal is in the first logic state, at the ground voltage when the complement data signal is in the second logic state and the negative bit line enable signal is inactive, and at the voltage below the ground voltage when the complement data signal is in the second logic state and the negative bit line enable signal is active; and
a control circuit for providing the negative bit line enable signal in an active state when a power supply voltage is below a first threshold, and in an inactive state when the power supply voltage is above a second threshold higher than the first threshold. 17. The memory, of claim 16, wherein the write driver further comprising a negative charge pump for providing the voltage below the ground voltage to a respective one of the bit line pairs. 18. The memory, of claim 17, wherein the negative charge pump is a programmable negative charge pump circuit having a plurality of negative charge pump stages. 19. The memory, of claim 18, wherein the programmable negative charge pump circuit provides the negative bit line enable signal to a selected bit line of the bit line pair based on the power supply voltage. 20. The memory, of claim 16, wherein the high voltage is a predetermined high voltage, and the first and second threshold are predetermined thresholds between the high voltage and a predetermined low voltage. | A write driver includes a first write data driver, a second write driver, and a control circuit. The first (second) write data driver provides a true (complement) write data signal to an output thereof at a high voltage when a true (complement) data signal is in a first logic state, at a ground voltage when the true (complement) data signal is in a second logic state and a negative bit line enable signal is inactive, and at a voltage below the ground voltage when the true (complement) data signal is in the second logic state and the negative bit line enable signal is active. The control circuit provides the negative bit line enable signal in an active state when a power supply voltage is below a first threshold, and in an inactive state when the power supply voltage is above a second threshold higher than the first threshold.1. A write driver, comprising:
a first write data driver for providing a true write data signal to an output thereof at a high voltage when a true data signal is in a first logic state, at a ground voltage when the true data signal is in a second logic state and a negative bit line enable signal is inactive, and at a voltage below the ground voltage when the true data signal is in the second logic state and the negative bit line enable signal is active; a second write data driver for providing a complement write data signal to an output thereof at the high voltage when a complement data signal is in the first logic state, at the ground voltage when the complement data signal is in the second logic state and the negative bit line enable signal is inactive, and at the voltage below the ground voltage when the complement data signal is in the second logic state and the negative bit line enable signal is active; and a control circuit for providing the negative bit line enable signal in an active state when a power supply voltage is below a first threshold, and in an inactive state when the power supply voltage is above a second threshold higher than the first threshold. 2. The write driver of claim 1, wherein each of the first and second write data drivers comprises:
a NOR gate having a first input for receiving a respective one of the true data signal and compliment data signal, a second input for receiving the negative bit line enable signal, and an output; an inverter having in input for receiving the respective one of the true data signal and compliment data signals, and an output; a pulldown transistor having a source for receiving the power supply voltage, a gate coupled to the output of a respective one of the NOR gate, and a drain forming the output of a respective one of the first write data driver and the second write data driver; and a pullup transistor having a source coupled to a respective one of the drain of the pulldown transistor, a gate coupled to the respective one of the output of the inverter, and a drain for receiving the ground voltage. 3. The write driver, of claim 1, further comprising a negative charge pump. 4. The write driver, of claim 3, wherein the negative charge pump comprises:
a delay driver having an input for receiving the negative bit line enable signal, and an output; a capacitor having a first terminal coupled to the output of the delay driver, and a second terminal; and a multiplexer for selectively coupling the power supply voltage at the second terminal of the capacitor to a respective one of the output of the first write data driver and the second write data driver in response to values of the true and complement data signals. 5. The write driver, of claim 3, wherein the negative charge pump is a programmable negative charge pump circuit having a plurality of negative charge pump stages for selectively providing the negative bit line enable signal based on the power supply voltage. 6. The write driver, of claim 1, wherein the high voltage is a predetermined high voltage. 7. The write driver of claim 1, further wherein:
in response to a transition from the high voltage to a low voltage, the write driver further providing the negative bit line enable signal in the active state when the power supply voltage is between the first threshold and the second threshold, wherein the low voltage is a predetermined low voltage; and in response to a transition from the low voltage to the high voltage, the write driver further providing the negative bit line in an inactive state. 8. A method for selectively boosting a differential bit line voltage on a bit line pair in a memory device, comprising:
receiving access requests at the memory device operating according to an initial power supply voltage; in response to detection of a change of a power supply voltage, selecting between enabling and disabling a negative bit line enable signal to the memory device based at least in part on the power supply voltage; generating the negative bit line enable signal in response to detecting an active operating power state, when the initial power supply voltage is below a first threshold, and in response to detecting an inactive operating power state, when the initial power supply voltage is above a second threshold higher than the first threshold; and driving a selected bit line of a bit line pair to a negative voltage in response to the negative bit line enable signal. 9. The method of claim 8, wherein providing the negative bit line enable signal further comprises selectively providing a negative bit line voltage signal to a first bit line of the bit line pair and leaving a second bit line of the bit line pair in a precharged state. 10. The method of claim 8, further comprises generating the negative bit line enable signal to a charge pump, wherein the charge pump selectively provides the negative bit line enable signal to the memory device. 11. The method of claim 8, further comprising: selectively enabling a number of stages of a plurality of parallel connected charge pump stages in response to the power supply voltage. 12. The method of claim 11, further comprising determining the number of stages to selectively enable based on an operating power state. 13. The method of claim 12, further comprising determining a change in the operating power state based on a power state table. 14. The method of claim 8, wherein generating the negative bit line enable signal comprises generating the negative bit line enable signal for a plurality of pairs of bit lines. 15. The method of claim 8, wherein the memory device comprises at least one of a level one cache, a level two cache, and a level three cache of a static random-access memory device. 16. A memory comprising:
true and complement bit lines forming a bit line pair; a plurality of memory cells coupled to the true and complement bit lines, each memory cell for storing a memory bit according to a differential voltage between the true and complement bit lines when selected during a write cycle; and a write driver coupled to the true and complement bit lines comprising:
a first write data driver for providing a true write data signal to the true bit line at a high voltage when a true data signal is in a first logic state, at a ground voltage when the true data signal is in a second logic state and a negative bit line enable signal is inactive, and at a voltage below the ground voltage when the true data signal is in the second logic state and the negative bit line enable signal is active;
a second write data driver for providing a complement write data signal to the complement bit line at the high voltage when a complement data signal is in the first logic state, at the ground voltage when the complement data signal is in the second logic state and the negative bit line enable signal is inactive, and at the voltage below the ground voltage when the complement data signal is in the second logic state and the negative bit line enable signal is active; and
a control circuit for providing the negative bit line enable signal in an active state when a power supply voltage is below a first threshold, and in an inactive state when the power supply voltage is above a second threshold higher than the first threshold. 17. The memory, of claim 16, wherein the write driver further comprising a negative charge pump for providing the voltage below the ground voltage to a respective one of the bit line pairs. 18. The memory, of claim 17, wherein the negative charge pump is a programmable negative charge pump circuit having a plurality of negative charge pump stages. 19. The memory, of claim 18, wherein the programmable negative charge pump circuit provides the negative bit line enable signal to a selected bit line of the bit line pair based on the power supply voltage. 20. The memory, of claim 16, wherein the high voltage is a predetermined high voltage, and the first and second threshold are predetermined thresholds between the high voltage and a predetermined low voltage. | 2,800 |
12,221 | 12,221 | 15,316,739 | 2,853 | An energy curable printing ink or coating composition comprising methyl phenyl glycoxylate providing excellent adhesion to a wide range of substrates, fast curing, and exhibits good impact resistance, flexibility, water resistance, and thermal and storage stability with respect to yellowing and odour. | 1. An energy curable printing ink or coating composition comprising:
a) between 0.5 to 10 wt % of methyl phenyl glycoxylate photoinitiator, b) between 10 to 60 wt % of at least one monofunctional acrylate or methacrylate monomer and c) between 5 to 25 wt % of at least one difunctional acrylate or methacrylate monomer. 2. A printing ink or coating composition according to claim 1 further comprising one or more of between 0.1 to 10 wt % of at least one trifunctional or higher acrylate or methacrylate monomer, between 0.1 to 60 wt % of at least one mono or multifunctional acrylate or methacrylate oligomer, between 0.1 to 25 wt % of a resin, between 0.1 to 15 wt % of at least one further additional photoinitiator, no greater than 5 wt % of high solvency monofunctional monomers, no greater than 5 wt % of non reactive organic solvents, no greater than 5 wt % of water, a colorant or filler and/or one or more additives. 3. (canceled) 4. (canceled) 5. (canceled) 6. (canceled) 7. (canceled) 8. (canceled) 9. (canceled) 10. (canceled) 11. (canceled) 12. (canceled) 13. (canceled) 14. (canceled) 15. (canceled) 16. A printing ink or coating composition according to claim 1, wherein the monofunctional acrylate or methacrylate monomer is an ethylenically unsaturated monomer and/or wherein the monofunctional acrylate or methacrylate monomer has a cyclic structure. 17. A printing ink or coating composition according to claim 1, wherein the monofunctional acrylate or methacrylate monomer is selected from C12 to C14 alkyl methacrylate, C16 to C18 alkyl acrylate, C16 to C18 alkyl methacrylate, isodecyl acrylate, lauryl acrylate, methoxy polyethylene glycol (350) monomethacrylate, octyldecyl acrylate, polypropylene glycol monomethacrylate, stearyl acrylate and tridecyl acrylate and mixtures thereof. 18. (canceled) 19. A printing ink or coating composition according to claim 16 wherein the monofunctional acrylate or methacrylate monomer is selected from phenoxyethyl acrylate (PEA), cyclic trimethyl propane formal acrylate (CTFA), isobornyl (meth) acrylate (IBOA), t-butyl cyclohexyl acrylate, 3,3,5,-trimethyl cyclohexyl acrylate and ethoxylated (4) nonyl phenol acrylate and mixtures thereof. 20. (canceled) 21. A printing ink or coating composition according to claim 1, wherein the difunctional acrylate or methacrylate monomer is selected from 3-butylene glycol dimethacrylate, 1,4-butanediol dimethacrylate, 1,6 hexanediol diacrylate, 1,6 hexanediol dimethacrylate, 1,5 pentadiol diacylate, alkoxylated diacrylate, diethylene glycol dimethacrylate, dipropylene glycol diacrylate, ethoxylated (10) bisphenol A diacrylate, ethoxylated (2) bisphenol A dimethacrylate, ethoxylated (3) bisphenol A diacrylate, ethoxylated (3) bisphenol A dimethacrylate, ethoxylated (4) bisphenol A diacrylate, ethoxylated (4) bisphenol A dimethacrylate, ethoxylated bisphenol A dimethacrylate, ethoxylated (10) bisphenol dimethacrylate, ethylene glycol dimethacrylate, polyethylene glycol (200) diacrylate, polyethylene glycol (400) diacrylate, polyethylene glycol (400) dimethacrylate, polyethylene glycol (400) dimethacrylate, polyethylene glycol (600) diacrylate, polyethylene glycol (600) dimethacrylate, polyethylene glycol 400 diacrylate, propoxylated (2) neopentyl glycol diacrylate, tetraethylene glycol diacrylate, tetraethylene glycol dimethacrylate, tricyclodecane dimethanol diacrylate, tricyclodecanedimethanol dimethacrylate, triethylene glycol diacrylate, triethylene glycol dimethacrylate and tripropylene glycol diacrylate and mixtures thereof. 22. (canceled) 23. (canceled) 24. (canceled) 25. A printing ink or coating composition according to claim 2, wherein the one or more additives is selected from the group consisting of stabilisers, surfactants, defoamers, slip additives, waxes, wetting agents and acidic adhesion promoters. 26. A printing ink or coating composition according to claim 1, wherein the ink or coating composition is substantially free of cationic photoinitiators and/or contains only free radical photoinitiators. 27. (canceled) 28. A printing ink or coating composition according to claim 1, wherein the ink or coating composition is substantially free of vinyl amides, is substantially free of N-vinyl heterocyclic nitrogen compounds, is substantially free of N-vinyl compounds, and/or is substantially free of acrylamide or substituted acrylamide. 29. A printing ink or coating composition according to claim 28, wherein of vinyl amides are selected from the group consisting of N-vinyl caprolactam, N-vinyl pyrrolidone and/or N-vinyl formamide and wherein the substituted acrylamide is acryloyl morpholine. 30. (canceled) 31. (canceled) 32. (canceled) 33. A printing ink or coating composition according to claim 1, wherein the ink or coating composition is a screen printing ink having a viscosity in the range 0.2 to 5.0 Pa·s, measured on a cone and plate viscometer at 25° C. 34. A printing ink or coating composition according to claim 1, wherein the ink or coating composition is a flexographic printing ink having a viscosity in the range 0.1 to 1.0 Pa·s, measured on a cone and plate viscometer at 25° C. 35. A printing ink or coating composition according to claim 1, wherein the ink or coating composition is a gravure printing ink having a viscosity in the range 0.01 to 0.2 Pa·s, measured on a cone and plate viscometer at 25° C. 36. A substrate comprising a printing ink or coating composition according to claim 1, on a surface of the substrate. 37. A method of providing a substrate with a printed ink or coating composition on a surface thereof comprising:
a) applying a printing ink or coating composition according to claim 1 onto a surface of the substrate and b) drying the composition. 38. A method according to claim 37 wherein the printing ink or coating composition is applied to the surface of the substrate via screen, flexographic or gravure printing. | An energy curable printing ink or coating composition comprising methyl phenyl glycoxylate providing excellent adhesion to a wide range of substrates, fast curing, and exhibits good impact resistance, flexibility, water resistance, and thermal and storage stability with respect to yellowing and odour.1. An energy curable printing ink or coating composition comprising:
a) between 0.5 to 10 wt % of methyl phenyl glycoxylate photoinitiator, b) between 10 to 60 wt % of at least one monofunctional acrylate or methacrylate monomer and c) between 5 to 25 wt % of at least one difunctional acrylate or methacrylate monomer. 2. A printing ink or coating composition according to claim 1 further comprising one or more of between 0.1 to 10 wt % of at least one trifunctional or higher acrylate or methacrylate monomer, between 0.1 to 60 wt % of at least one mono or multifunctional acrylate or methacrylate oligomer, between 0.1 to 25 wt % of a resin, between 0.1 to 15 wt % of at least one further additional photoinitiator, no greater than 5 wt % of high solvency monofunctional monomers, no greater than 5 wt % of non reactive organic solvents, no greater than 5 wt % of water, a colorant or filler and/or one or more additives. 3. (canceled) 4. (canceled) 5. (canceled) 6. (canceled) 7. (canceled) 8. (canceled) 9. (canceled) 10. (canceled) 11. (canceled) 12. (canceled) 13. (canceled) 14. (canceled) 15. (canceled) 16. A printing ink or coating composition according to claim 1, wherein the monofunctional acrylate or methacrylate monomer is an ethylenically unsaturated monomer and/or wherein the monofunctional acrylate or methacrylate monomer has a cyclic structure. 17. A printing ink or coating composition according to claim 1, wherein the monofunctional acrylate or methacrylate monomer is selected from C12 to C14 alkyl methacrylate, C16 to C18 alkyl acrylate, C16 to C18 alkyl methacrylate, isodecyl acrylate, lauryl acrylate, methoxy polyethylene glycol (350) monomethacrylate, octyldecyl acrylate, polypropylene glycol monomethacrylate, stearyl acrylate and tridecyl acrylate and mixtures thereof. 18. (canceled) 19. A printing ink or coating composition according to claim 16 wherein the monofunctional acrylate or methacrylate monomer is selected from phenoxyethyl acrylate (PEA), cyclic trimethyl propane formal acrylate (CTFA), isobornyl (meth) acrylate (IBOA), t-butyl cyclohexyl acrylate, 3,3,5,-trimethyl cyclohexyl acrylate and ethoxylated (4) nonyl phenol acrylate and mixtures thereof. 20. (canceled) 21. A printing ink or coating composition according to claim 1, wherein the difunctional acrylate or methacrylate monomer is selected from 3-butylene glycol dimethacrylate, 1,4-butanediol dimethacrylate, 1,6 hexanediol diacrylate, 1,6 hexanediol dimethacrylate, 1,5 pentadiol diacylate, alkoxylated diacrylate, diethylene glycol dimethacrylate, dipropylene glycol diacrylate, ethoxylated (10) bisphenol A diacrylate, ethoxylated (2) bisphenol A dimethacrylate, ethoxylated (3) bisphenol A diacrylate, ethoxylated (3) bisphenol A dimethacrylate, ethoxylated (4) bisphenol A diacrylate, ethoxylated (4) bisphenol A dimethacrylate, ethoxylated bisphenol A dimethacrylate, ethoxylated (10) bisphenol dimethacrylate, ethylene glycol dimethacrylate, polyethylene glycol (200) diacrylate, polyethylene glycol (400) diacrylate, polyethylene glycol (400) dimethacrylate, polyethylene glycol (400) dimethacrylate, polyethylene glycol (600) diacrylate, polyethylene glycol (600) dimethacrylate, polyethylene glycol 400 diacrylate, propoxylated (2) neopentyl glycol diacrylate, tetraethylene glycol diacrylate, tetraethylene glycol dimethacrylate, tricyclodecane dimethanol diacrylate, tricyclodecanedimethanol dimethacrylate, triethylene glycol diacrylate, triethylene glycol dimethacrylate and tripropylene glycol diacrylate and mixtures thereof. 22. (canceled) 23. (canceled) 24. (canceled) 25. A printing ink or coating composition according to claim 2, wherein the one or more additives is selected from the group consisting of stabilisers, surfactants, defoamers, slip additives, waxes, wetting agents and acidic adhesion promoters. 26. A printing ink or coating composition according to claim 1, wherein the ink or coating composition is substantially free of cationic photoinitiators and/or contains only free radical photoinitiators. 27. (canceled) 28. A printing ink or coating composition according to claim 1, wherein the ink or coating composition is substantially free of vinyl amides, is substantially free of N-vinyl heterocyclic nitrogen compounds, is substantially free of N-vinyl compounds, and/or is substantially free of acrylamide or substituted acrylamide. 29. A printing ink or coating composition according to claim 28, wherein of vinyl amides are selected from the group consisting of N-vinyl caprolactam, N-vinyl pyrrolidone and/or N-vinyl formamide and wherein the substituted acrylamide is acryloyl morpholine. 30. (canceled) 31. (canceled) 32. (canceled) 33. A printing ink or coating composition according to claim 1, wherein the ink or coating composition is a screen printing ink having a viscosity in the range 0.2 to 5.0 Pa·s, measured on a cone and plate viscometer at 25° C. 34. A printing ink or coating composition according to claim 1, wherein the ink or coating composition is a flexographic printing ink having a viscosity in the range 0.1 to 1.0 Pa·s, measured on a cone and plate viscometer at 25° C. 35. A printing ink or coating composition according to claim 1, wherein the ink or coating composition is a gravure printing ink having a viscosity in the range 0.01 to 0.2 Pa·s, measured on a cone and plate viscometer at 25° C. 36. A substrate comprising a printing ink or coating composition according to claim 1, on a surface of the substrate. 37. A method of providing a substrate with a printed ink or coating composition on a surface thereof comprising:
a) applying a printing ink or coating composition according to claim 1 onto a surface of the substrate and b) drying the composition. 38. A method according to claim 37 wherein the printing ink or coating composition is applied to the surface of the substrate via screen, flexographic or gravure printing. | 2,800 |
12,222 | 12,222 | 15,848,282 | 2,846 | The invention relates to a method for checking an electrical value of an electric machine, in particular an electric machine of a coordinate measuring device. The electric machine has an electric drive comprising a stator and a rotor. The method includes the steps of: detecting a value of a drive current delivered to the electric drive for driving the rotor, detecting a measured value of an electrical input variable of the electric machine, determining a calculated value of the electrical input variable on the basis of the detected value of the drive current and on the basis of a performance model of the electric machine, and determining a comparison value on the basis of the detected measured value and the calculated value of the electrical input variable, in order to check the detected value of the drive current. | 1. A method for checking a drive current of an electric machine of a coordinate measurement device, wherein the electric machine comprises an electric drive having a stator and a rotor, the method comprising the steps of:
detecting a value of the drive current, which is fed to the electric drive for the purpose of driving the rotor, detecting a measurement value of an electrical input variable of the electric machine, wherein the electrical input variable is a total current consumed by the electric machine or an electrical variable corresponding to the total current consumed by the electric machine, determining a calculation value on the basis of the detected value of the drive current and of on the basis a performance model of the electric machine, and determining a comparison value on the basis of the detected measurement value and of the determined calculation value of the electrical input variable, in order to check the detected value of the drive current, wherein the calculation value is a calculated value of the electrical input variable, wherein the comparison value is determined on the basis of a difference value between the measurement value and the calculation value of the electrical input variable. 2. The method of claim 1, wherein the calculation value of the electrical input variable is calculated on the basis of a total voltage supplied to the electric machine. 3. The method of claim 1, wherein the performance model takes an electromagnetic force of the electric drive into account. 4. The method of claim 3, wherein a movement variable of the rotor is detected and wherein the electromagnetic force is determined on the basis of a characteristic variable of the electric drive and of the detected movement variable. 5. The method of claim 1, wherein the electric machine comprises a control unit, and wherein the performance model takes into account an electrical power loss of the control unit. 6. The method of claim 5, wherein the electrical power loss of the control unit is determined when the rotor is stationary. 7. The method of claim 1, wherein the performance model takes into account a mechanical drive power of the electric drive. 8. The method of claim 1, wherein the comparison value is determined on the basis of a sum of a plurality of the difference values. 9. The method of claim 1, wherein the comparison value is determined on the basis of an integral of the difference value. 10. The method of claim 8, wherein a predefined value is subtracted from a value of the integral or a value of the sum. 11. The method of claim 1, wherein the drive current to the electric drive is interrupted, if the comparison value exceeds a predefined threshold value. 12. A method for checking a drive current supplied to an electric machine of a coordinate measurement device, wherein the electric machine comprises an electric drive having a stator and a rotor and wherein the electric machine obeys a fundamental principle of conservation of energy, the method comprising the steps of:
detecting a first measurement value, said first measurement value representing an instantaneous value of the drive current, while the drive current is fed to the electric drive for the purpose of driving the rotor, detecting a second measurement value, said second measurement value representing a total current consumed by the electric machine, determining a calculation value on the basis of the first measurement value and on the basis of a performance model of the electric machine, said performance model modeling consumed power and output power of the electric machine taking into account the fundamental principle of conservation of energy, and comparing the second measurement value and the calculation value in order to check the instantaneous value of the drive current, wherein the calculation value is a calculated value of the total current consumed by the electric drive. 13. An apparatus for checking a drive current of an electric machine of a coordinate measurement device, wherein the electric machine comprises an electric drive having a stator and a rotor, the apparatus comprising:
a first detection unit, which is associated with the electric drive and is configured to detect a value of the drive current, which is fed to the electric drive for the purpose of driving the rotor, a second detection unit, which is configured to detect a measurement value of an electrical input variable of the electric machine, wherein the electrical input variable is a total current consumed by the electric machine or an electrical variable corresponding to the total current consumed by the electric machine, a determination unit, which is configured to determine a calculation value on the basis of the detected drive current and on the basis of a performance model of the electric machine, and a checking unit, which is configured to determine a comparison value on the basis of the detected measurement value and of the determined calculation value of the electrical input variable, in order to check the detected value of the drive current, wherein the calculation value is a calculated value of the electrical input variable, wherein the checking unit determines the comparison value on the basis of a difference value between the measurement value and the calculation value of the electrical input variable. 14. The apparatus of claim 13, further comprising at least two separate checking units, wherein the second detection unit and the determination unit each are connected to the at least two separate checking units, wherein the at least two separate checking units each are configured to independently determine the comparison value in order to independently check the detected value of the drive current. 15. The apparatus of claim 14, further comprising a switching unit configured to interrupt an electrical power supply path to the electric drive, wherein the at least two separate checking units each are connected to the switching unit in order to interrupt the drive current to the electric drive. | The invention relates to a method for checking an electrical value of an electric machine, in particular an electric machine of a coordinate measuring device. The electric machine has an electric drive comprising a stator and a rotor. The method includes the steps of: detecting a value of a drive current delivered to the electric drive for driving the rotor, detecting a measured value of an electrical input variable of the electric machine, determining a calculated value of the electrical input variable on the basis of the detected value of the drive current and on the basis of a performance model of the electric machine, and determining a comparison value on the basis of the detected measured value and the calculated value of the electrical input variable, in order to check the detected value of the drive current.1. A method for checking a drive current of an electric machine of a coordinate measurement device, wherein the electric machine comprises an electric drive having a stator and a rotor, the method comprising the steps of:
detecting a value of the drive current, which is fed to the electric drive for the purpose of driving the rotor, detecting a measurement value of an electrical input variable of the electric machine, wherein the electrical input variable is a total current consumed by the electric machine or an electrical variable corresponding to the total current consumed by the electric machine, determining a calculation value on the basis of the detected value of the drive current and of on the basis a performance model of the electric machine, and determining a comparison value on the basis of the detected measurement value and of the determined calculation value of the electrical input variable, in order to check the detected value of the drive current, wherein the calculation value is a calculated value of the electrical input variable, wherein the comparison value is determined on the basis of a difference value between the measurement value and the calculation value of the electrical input variable. 2. The method of claim 1, wherein the calculation value of the electrical input variable is calculated on the basis of a total voltage supplied to the electric machine. 3. The method of claim 1, wherein the performance model takes an electromagnetic force of the electric drive into account. 4. The method of claim 3, wherein a movement variable of the rotor is detected and wherein the electromagnetic force is determined on the basis of a characteristic variable of the electric drive and of the detected movement variable. 5. The method of claim 1, wherein the electric machine comprises a control unit, and wherein the performance model takes into account an electrical power loss of the control unit. 6. The method of claim 5, wherein the electrical power loss of the control unit is determined when the rotor is stationary. 7. The method of claim 1, wherein the performance model takes into account a mechanical drive power of the electric drive. 8. The method of claim 1, wherein the comparison value is determined on the basis of a sum of a plurality of the difference values. 9. The method of claim 1, wherein the comparison value is determined on the basis of an integral of the difference value. 10. The method of claim 8, wherein a predefined value is subtracted from a value of the integral or a value of the sum. 11. The method of claim 1, wherein the drive current to the electric drive is interrupted, if the comparison value exceeds a predefined threshold value. 12. A method for checking a drive current supplied to an electric machine of a coordinate measurement device, wherein the electric machine comprises an electric drive having a stator and a rotor and wherein the electric machine obeys a fundamental principle of conservation of energy, the method comprising the steps of:
detecting a first measurement value, said first measurement value representing an instantaneous value of the drive current, while the drive current is fed to the electric drive for the purpose of driving the rotor, detecting a second measurement value, said second measurement value representing a total current consumed by the electric machine, determining a calculation value on the basis of the first measurement value and on the basis of a performance model of the electric machine, said performance model modeling consumed power and output power of the electric machine taking into account the fundamental principle of conservation of energy, and comparing the second measurement value and the calculation value in order to check the instantaneous value of the drive current, wherein the calculation value is a calculated value of the total current consumed by the electric drive. 13. An apparatus for checking a drive current of an electric machine of a coordinate measurement device, wherein the electric machine comprises an electric drive having a stator and a rotor, the apparatus comprising:
a first detection unit, which is associated with the electric drive and is configured to detect a value of the drive current, which is fed to the electric drive for the purpose of driving the rotor, a second detection unit, which is configured to detect a measurement value of an electrical input variable of the electric machine, wherein the electrical input variable is a total current consumed by the electric machine or an electrical variable corresponding to the total current consumed by the electric machine, a determination unit, which is configured to determine a calculation value on the basis of the detected drive current and on the basis of a performance model of the electric machine, and a checking unit, which is configured to determine a comparison value on the basis of the detected measurement value and of the determined calculation value of the electrical input variable, in order to check the detected value of the drive current, wherein the calculation value is a calculated value of the electrical input variable, wherein the checking unit determines the comparison value on the basis of a difference value between the measurement value and the calculation value of the electrical input variable. 14. The apparatus of claim 13, further comprising at least two separate checking units, wherein the second detection unit and the determination unit each are connected to the at least two separate checking units, wherein the at least two separate checking units each are configured to independently determine the comparison value in order to independently check the detected value of the drive current. 15. The apparatus of claim 14, further comprising a switching unit configured to interrupt an electrical power supply path to the electric drive, wherein the at least two separate checking units each are connected to the switching unit in order to interrupt the drive current to the electric drive. | 2,800 |
12,223 | 12,223 | 16,435,380 | 2,838 | Embodiments of a method and a device are disclosed. In an embodiment, a method for discharging an output capacitor of a power supply is disclosed. The power supply includes a primary side for receiving a signal to be converted and a secondary side for outputting a converted signal. The method involves detecting whether synchronous rectification (SR) circuitry at the secondary side is inactive, determining that the primary side is disconnected from a mains voltage when the SR circuitry is detected to be inactive, and discharging an output capacitor at the secondary side based on the determination that the primary side is disconnected from the mains voltage. | 1. A method for discharging an output capacitor of a power supply, the power supply having a primary side configured to receive a signal to be converted and a secondary side configured to output a converted signal, the method comprising:
detecting that the synchronous rectification (SR) circuitry at the secondary side is inactive after no switching activity is sensed for a predetermined time at drains of the SR circuitry; determining that the primary side is disconnected from a mains voltage after the SR circuitry is detected to be inactive; and discharging an output capacitor at the secondary side based on the determination that the primary side is disconnected from the mains voltage. 2. The method of claim 1, wherein the primary side is determined to be disconnected from the mains voltage when the SR circuitry performs no switching activity for a predetermined duration. 3. The method of claim 2, wherein discharging the output capacitor comprises:
detecting an amount of time that the SR circuitry performs no switching activity; and discharging the output capacitor when the amount of time exceeds a threshold. 4. The method of claim 1, wherein the output capacitor is discharged by a constant power load. 5. The method of claim 1, wherein the output capacitor is discharged by a constant current load. 6. The method of claim 1, wherein the output capacitor is discharged by a resistor load. 7. The method of claim 1, wherein the output capacitor is discharged by at least one of a power load, a current load, a resistor load, or any combination thereof. 8. The method of claim 1, wherein a current for discharging the output capacitor decreases at a high junction temperature. 9. A power supply, comprising:
a primary side configured to connect to a mains voltage and receive a voltage signal to be converted; a secondary side configured to output a converted voltage signal; and a transformer connected between the primary side and the secondary side and configured to convert the voltage signal, wherein the secondary side comprises:
an output capacitor,
synchronous rectification (SR) circuitry configured to rectify the converted voltage signal from the transformer,
detection circuitry configured to detect that the SR circuitry is inactive after no switching activity is sensed for a predetermined time at drains of the SR circuitry,
determining circuitry configured to determine that the primary side is disconnected from the mains voltage after the SR circuitry is detected to be inactive, and
discharging circuitry configured to discharge the output capacitor based on the determination that the primary side is disconnected from the mains voltage. 10. The power supply of claim 9, wherein the determining circuitry is configured to determine that the primary side is disconnected from the mains voltage when the SR circuitry performs no switching activity for a predetermined duration. 11. The power supply of claim 10, wherein the discharging circuitry is configured to:
detect an amount of time that the SR circuitry performs no switching activity; and discharge the output capacitor when the amount of time exceeds a threshold. 12. The power supply of claim 9, wherein the output capacitor is discharged by a constant power load. 13. The power supply of claim 9, wherein the output capacitor is discharged by a constant current load. 14. The power supply of claim 9, wherein the output capacitor is discharged by a resistor load. 15. The power supply of claim 9, wherein the output capacitor is discharged by at least one of a power load, a current load, a resistor load, or any combination thereof. 16. The power supply of claim 9, wherein a current for discharging the output capacitor decreases at a high junction temperature. 17. A power supply, comprising:
a primary side configured to connect to an input voltage and receive a voltage signal to be converted; and a secondary side configured to output a converted voltage signal, the secondary side comprising a controller configured to:
detect that synchronous rectification (SR) circuitry at the secondary side is inactive after no switching activity is sensed for a predetermined time at drains of the SR circuitry,
determine that the primary side is disconnected from the input voltage after the SR circuitry is detected to be inactive, and
discharge an output capacitor at the secondary side based on the determination that the primary side is disconnected from the input voltage. 18. The power supply of claim 17, wherein the controller is configured to determine that the primary side is disconnected from the input voltage when the SR circuitry performs no switching activity for a predetermined duration. 19. The power supply of claim 18, wherein the controller configured to discharge the output capacitor is further configured to:
detect an amount of time that the SR circuitry performs no switching activity; and discharge the output capacitor when the amount of time exceeds a threshold. 20. The power supply of claim 17, wherein the controller is configured to discharge the output capacitor by at least one of a power load, a current load, a resistor load, or any combination thereof. 21. The power supply of claim 9: wherein the discharging circuitry sets a delay time that is longer than a maximum time of a non-switching portion of a burst mode or of a low frequency mode whereby discharge is not triggered during no-load operation. 22. The power supply of claim 9: wherein the detection circuitry is configured to detect the mains voltage disconnect at the secondary side without a communication signal from the primary side. | Embodiments of a method and a device are disclosed. In an embodiment, a method for discharging an output capacitor of a power supply is disclosed. The power supply includes a primary side for receiving a signal to be converted and a secondary side for outputting a converted signal. The method involves detecting whether synchronous rectification (SR) circuitry at the secondary side is inactive, determining that the primary side is disconnected from a mains voltage when the SR circuitry is detected to be inactive, and discharging an output capacitor at the secondary side based on the determination that the primary side is disconnected from the mains voltage.1. A method for discharging an output capacitor of a power supply, the power supply having a primary side configured to receive a signal to be converted and a secondary side configured to output a converted signal, the method comprising:
detecting that the synchronous rectification (SR) circuitry at the secondary side is inactive after no switching activity is sensed for a predetermined time at drains of the SR circuitry; determining that the primary side is disconnected from a mains voltage after the SR circuitry is detected to be inactive; and discharging an output capacitor at the secondary side based on the determination that the primary side is disconnected from the mains voltage. 2. The method of claim 1, wherein the primary side is determined to be disconnected from the mains voltage when the SR circuitry performs no switching activity for a predetermined duration. 3. The method of claim 2, wherein discharging the output capacitor comprises:
detecting an amount of time that the SR circuitry performs no switching activity; and discharging the output capacitor when the amount of time exceeds a threshold. 4. The method of claim 1, wherein the output capacitor is discharged by a constant power load. 5. The method of claim 1, wherein the output capacitor is discharged by a constant current load. 6. The method of claim 1, wherein the output capacitor is discharged by a resistor load. 7. The method of claim 1, wherein the output capacitor is discharged by at least one of a power load, a current load, a resistor load, or any combination thereof. 8. The method of claim 1, wherein a current for discharging the output capacitor decreases at a high junction temperature. 9. A power supply, comprising:
a primary side configured to connect to a mains voltage and receive a voltage signal to be converted; a secondary side configured to output a converted voltage signal; and a transformer connected between the primary side and the secondary side and configured to convert the voltage signal, wherein the secondary side comprises:
an output capacitor,
synchronous rectification (SR) circuitry configured to rectify the converted voltage signal from the transformer,
detection circuitry configured to detect that the SR circuitry is inactive after no switching activity is sensed for a predetermined time at drains of the SR circuitry,
determining circuitry configured to determine that the primary side is disconnected from the mains voltage after the SR circuitry is detected to be inactive, and
discharging circuitry configured to discharge the output capacitor based on the determination that the primary side is disconnected from the mains voltage. 10. The power supply of claim 9, wherein the determining circuitry is configured to determine that the primary side is disconnected from the mains voltage when the SR circuitry performs no switching activity for a predetermined duration. 11. The power supply of claim 10, wherein the discharging circuitry is configured to:
detect an amount of time that the SR circuitry performs no switching activity; and discharge the output capacitor when the amount of time exceeds a threshold. 12. The power supply of claim 9, wherein the output capacitor is discharged by a constant power load. 13. The power supply of claim 9, wherein the output capacitor is discharged by a constant current load. 14. The power supply of claim 9, wherein the output capacitor is discharged by a resistor load. 15. The power supply of claim 9, wherein the output capacitor is discharged by at least one of a power load, a current load, a resistor load, or any combination thereof. 16. The power supply of claim 9, wherein a current for discharging the output capacitor decreases at a high junction temperature. 17. A power supply, comprising:
a primary side configured to connect to an input voltage and receive a voltage signal to be converted; and a secondary side configured to output a converted voltage signal, the secondary side comprising a controller configured to:
detect that synchronous rectification (SR) circuitry at the secondary side is inactive after no switching activity is sensed for a predetermined time at drains of the SR circuitry,
determine that the primary side is disconnected from the input voltage after the SR circuitry is detected to be inactive, and
discharge an output capacitor at the secondary side based on the determination that the primary side is disconnected from the input voltage. 18. The power supply of claim 17, wherein the controller is configured to determine that the primary side is disconnected from the input voltage when the SR circuitry performs no switching activity for a predetermined duration. 19. The power supply of claim 18, wherein the controller configured to discharge the output capacitor is further configured to:
detect an amount of time that the SR circuitry performs no switching activity; and discharge the output capacitor when the amount of time exceeds a threshold. 20. The power supply of claim 17, wherein the controller is configured to discharge the output capacitor by at least one of a power load, a current load, a resistor load, or any combination thereof. 21. The power supply of claim 9: wherein the discharging circuitry sets a delay time that is longer than a maximum time of a non-switching portion of a burst mode or of a low frequency mode whereby discharge is not triggered during no-load operation. 22. The power supply of claim 9: wherein the detection circuitry is configured to detect the mains voltage disconnect at the secondary side without a communication signal from the primary side. | 2,800 |
12,224 | 12,224 | 15,143,500 | 2,827 | According to one general aspect, an apparatus may include a memory module. The memory module may include a plurality of memory banks configured to store data. The memory module may include a plurality of memory bank power down controllers, each configured to place one or more respective memory bank(s) in a power down mode. The memory module may include a memory module command interface configured to receive a handshake command from a memory controller, wherein the handshake command comprises a command to remove an indicated memory bank from power down mode. | 1. An apparatus comprising:
a memory module comprising: a plurality of memory banks configured to store data; a plurality of memory bank power down controllers, each configured to place one or more respective memory bank(s) in a power down mode; and a memory module command interface configured to receive a handshake command from a memory controller, wherein the handshake command comprises a command to remove an indicated memory bank from power down mode. 2. The apparatus of claim 1, wherein the memory module further comprises:
a plurality of memory bank power down triggers each comprising:
a sleep counter configured to store a value associated with a power mode of a respective memory bank; and
a sleep threshold that indicates a value of the sleep counter after which the respective memory bank will be placed in the power down mode. 3. The apparatus of claim 2, wherein at least one sleep threshold is re-programmable. 4. The apparatus of claim 2, wherein each sleep counter is configured to count a number of memory bank accesses that have occurred since a last time a respective memory bank was accessed. 5. The apparatus of claim 1, wherein each of the memory bank power down controllers are configured to:
receive a memory bank command for a respective memory bank; and if the memory bank command includes the handshake command, remove the respective memory bank from power down mode. 6. The apparatus of claim 1, wherein the handshake command includes a precharge command. 7. The apparatus of claim 1, wherein each memory bank is configured to enter a power down mode independently of any other memory bank. 8. An apparatus comprising:
a memory controller circuit configured to manage a flow of data going to and from a memory module; a plurality of power down trigger predictors, each associated with a memory bank of the memory module, and wherein, each power down trigger predictor is configured to predict if a respective memory bank is in a power down mode; and a command interface configured to transmit a handshake command to the memory module, wherein the handshake command is configured to remove an indicated memory bank from power down mode. 9. The apparatus of claim 8, further comprising
a table configured to indicate which, if any memory banks of the memory module are in a power down mode; and wherein the memory controller is configured to, when an access request for a target memory bank is received, check the table to determine a state of the target memory bank and, based upon the state perform an action. 10. The apparatus of claim 9, wherein the memory controller is configured to, if the table indicates the target memory bank is in the power down mode:
transmit a bank miss response to a requesting device; and transmit the handshake command to the memory module that includes the target memory bank. 11. The apparatus of claim 8, wherein each power down trigger predictors comprises:
a sleep counter configured to store a value associated with a power mode of a respective memory bank; and a sleep threshold that indicates a value of the sleep counter after which the respective memory bank will be placed in the power down mode. 12. The apparatus of claim 11, wherein each sleep threshold is re-programmable. 13. The apparatus of claim 11, wherein each sleep counter is configured to count a number of memory bank accesses that have occurred since a last time a respective memory bank was targeted. 14. The apparatus of claim 8, wherein the handshake command includes a precharge command. 15. A system comprising:
a memory controller comprising:
a command interface configured to transmit a handshake command to a memory module, wherein the handshake command is configured to remove an indicated memory bank from power down mode.
the memory module comprising:
a plurality of memory banks configured to store data;
a plurality of memory bank power down controllers, each configured to place a respective memory bank in a power down mode; and
a memory module command interface configured to receive the handshake command. 16. The system of claim 15, wherein the memory module comprises:
a plurality of memory bank power down triggers, each comprising:
a sleep counter configured to store a value associated with a power mode of a respective memory bank; and
a sleep threshold that indicates a value of the sleep counter after which the respective memory bank will be placed in the power down mode. 17. The system of claim 16, wherein each sleep counter is configured to count a number of clock cycles that have occurred since a last time a respective memory bank was targeted. 18. The system of claim 15, wherein the memory controller comprises:
a plurality of power down trigger predictors, each associated with one or more memory bank(s) of the memory module, and wherein, each power down trigger predictor is configured to predict is a respective memory bank is in a power down mode; a table configured to indicate which, if any memory banks of the memory module are in a power down mode; and wherein the memory controller is configured to, when an access request for a target memory bank is received, check the table to determine a state of the target memory bank and, based upon the state perform an action. 19. The system of claim 17, wherein the memory controller is configured to, if the table indicates the target memory bank is in the power down mode:
transmit a bank miss response to a requesting device; and transmit the handshake command to the memory module. 20. The system of claim 15, wherein the memory modules comprising a first plurality of power down triggers, each associated with a memory bank of the memory module, and wherein, each power down trigger is configured to dictate when a respective memory bank is in a power down mode; and
wherein the memory module includes a second plurality of power down triggers, wherein each of the second power down triggers is associated with a respective first power down trigger and configured to predict an action of the respective first power down trigger. 21-25. (canceled) 26. A method comprising:
determining if a memory access is to a target memory bank of a memory module, wherein the memory module comprises a plurality of memory banks; if not, incrementing a counter associated with the target memory bank; determining if the counter has exceeded a threshold value; and if the counter has exceeded the threshold value, placing only the target memory bank in a power down mode, wherein at least one other memory bank of the memory module is not in the power down mode. 27. The method of claim 26, further comprising, if the target memory bank is in a power down mode and the memory access is to the target memory bank:
determining if the memory access includes a handshake command from a memory controller; and if so, removing the target memory bank from power down mode. 28. The method of claim 26, further comprising, if the target memory bank is in a power down mode and the memory access is to the target memory bank:
responding to the memory access with a page miss; and transmitting a handshake command to the memory module, wherein the handshake command comprises a command to remove an indicated memory bank from power down mode. 29. The method of claim 28, further comprising, if the target memory bank is in a power down mode and the memory access is to the target emery bank, marking the target memory bank as not being in the power down mode. 30. The method of claim 26, wherein each of the plurality of memory banks is configured to enter a power down mode independently of any other memory bank. | According to one general aspect, an apparatus may include a memory module. The memory module may include a plurality of memory banks configured to store data. The memory module may include a plurality of memory bank power down controllers, each configured to place one or more respective memory bank(s) in a power down mode. The memory module may include a memory module command interface configured to receive a handshake command from a memory controller, wherein the handshake command comprises a command to remove an indicated memory bank from power down mode.1. An apparatus comprising:
a memory module comprising: a plurality of memory banks configured to store data; a plurality of memory bank power down controllers, each configured to place one or more respective memory bank(s) in a power down mode; and a memory module command interface configured to receive a handshake command from a memory controller, wherein the handshake command comprises a command to remove an indicated memory bank from power down mode. 2. The apparatus of claim 1, wherein the memory module further comprises:
a plurality of memory bank power down triggers each comprising:
a sleep counter configured to store a value associated with a power mode of a respective memory bank; and
a sleep threshold that indicates a value of the sleep counter after which the respective memory bank will be placed in the power down mode. 3. The apparatus of claim 2, wherein at least one sleep threshold is re-programmable. 4. The apparatus of claim 2, wherein each sleep counter is configured to count a number of memory bank accesses that have occurred since a last time a respective memory bank was accessed. 5. The apparatus of claim 1, wherein each of the memory bank power down controllers are configured to:
receive a memory bank command for a respective memory bank; and if the memory bank command includes the handshake command, remove the respective memory bank from power down mode. 6. The apparatus of claim 1, wherein the handshake command includes a precharge command. 7. The apparatus of claim 1, wherein each memory bank is configured to enter a power down mode independently of any other memory bank. 8. An apparatus comprising:
a memory controller circuit configured to manage a flow of data going to and from a memory module; a plurality of power down trigger predictors, each associated with a memory bank of the memory module, and wherein, each power down trigger predictor is configured to predict if a respective memory bank is in a power down mode; and a command interface configured to transmit a handshake command to the memory module, wherein the handshake command is configured to remove an indicated memory bank from power down mode. 9. The apparatus of claim 8, further comprising
a table configured to indicate which, if any memory banks of the memory module are in a power down mode; and wherein the memory controller is configured to, when an access request for a target memory bank is received, check the table to determine a state of the target memory bank and, based upon the state perform an action. 10. The apparatus of claim 9, wherein the memory controller is configured to, if the table indicates the target memory bank is in the power down mode:
transmit a bank miss response to a requesting device; and transmit the handshake command to the memory module that includes the target memory bank. 11. The apparatus of claim 8, wherein each power down trigger predictors comprises:
a sleep counter configured to store a value associated with a power mode of a respective memory bank; and a sleep threshold that indicates a value of the sleep counter after which the respective memory bank will be placed in the power down mode. 12. The apparatus of claim 11, wherein each sleep threshold is re-programmable. 13. The apparatus of claim 11, wherein each sleep counter is configured to count a number of memory bank accesses that have occurred since a last time a respective memory bank was targeted. 14. The apparatus of claim 8, wherein the handshake command includes a precharge command. 15. A system comprising:
a memory controller comprising:
a command interface configured to transmit a handshake command to a memory module, wherein the handshake command is configured to remove an indicated memory bank from power down mode.
the memory module comprising:
a plurality of memory banks configured to store data;
a plurality of memory bank power down controllers, each configured to place a respective memory bank in a power down mode; and
a memory module command interface configured to receive the handshake command. 16. The system of claim 15, wherein the memory module comprises:
a plurality of memory bank power down triggers, each comprising:
a sleep counter configured to store a value associated with a power mode of a respective memory bank; and
a sleep threshold that indicates a value of the sleep counter after which the respective memory bank will be placed in the power down mode. 17. The system of claim 16, wherein each sleep counter is configured to count a number of clock cycles that have occurred since a last time a respective memory bank was targeted. 18. The system of claim 15, wherein the memory controller comprises:
a plurality of power down trigger predictors, each associated with one or more memory bank(s) of the memory module, and wherein, each power down trigger predictor is configured to predict is a respective memory bank is in a power down mode; a table configured to indicate which, if any memory banks of the memory module are in a power down mode; and wherein the memory controller is configured to, when an access request for a target memory bank is received, check the table to determine a state of the target memory bank and, based upon the state perform an action. 19. The system of claim 17, wherein the memory controller is configured to, if the table indicates the target memory bank is in the power down mode:
transmit a bank miss response to a requesting device; and transmit the handshake command to the memory module. 20. The system of claim 15, wherein the memory modules comprising a first plurality of power down triggers, each associated with a memory bank of the memory module, and wherein, each power down trigger is configured to dictate when a respective memory bank is in a power down mode; and
wherein the memory module includes a second plurality of power down triggers, wherein each of the second power down triggers is associated with a respective first power down trigger and configured to predict an action of the respective first power down trigger. 21-25. (canceled) 26. A method comprising:
determining if a memory access is to a target memory bank of a memory module, wherein the memory module comprises a plurality of memory banks; if not, incrementing a counter associated with the target memory bank; determining if the counter has exceeded a threshold value; and if the counter has exceeded the threshold value, placing only the target memory bank in a power down mode, wherein at least one other memory bank of the memory module is not in the power down mode. 27. The method of claim 26, further comprising, if the target memory bank is in a power down mode and the memory access is to the target memory bank:
determining if the memory access includes a handshake command from a memory controller; and if so, removing the target memory bank from power down mode. 28. The method of claim 26, further comprising, if the target memory bank is in a power down mode and the memory access is to the target memory bank:
responding to the memory access with a page miss; and transmitting a handshake command to the memory module, wherein the handshake command comprises a command to remove an indicated memory bank from power down mode. 29. The method of claim 28, further comprising, if the target memory bank is in a power down mode and the memory access is to the target emery bank, marking the target memory bank as not being in the power down mode. 30. The method of claim 26, wherein each of the plurality of memory banks is configured to enter a power down mode independently of any other memory bank. | 2,800 |
12,225 | 12,225 | 16,260,399 | 2,844 | An antenna is provided for a wearable personal computing device, such as a smartwatch. The antenna integrates with other components of the wearable device, such as a second antenna. For example, the first antenna may be a coupled loop antenna in proximity to a second antenna that may be a monopole antenna, without causing interference between the two antennas. In one example, the first antenna shares a common ground with the second antenna. | 1. An antenna, comprising:
an inner trace, the inner trace having a first and second end, the first end configured to serve as a feed for the antenna; an outer trace, the outer trace having a first and second end, the first end of the outer trace positioned adjacent to the second end of the inner trace; wherein the inner and outer trace are positioned along a periphery of a wearable device and coupled to a ground; and wherein the antenna is a coupled loop antenna. 2. The antenna of claim 1, wherein the antenna is positioned in proximity to a second antenna of a different type without causing interference between the antenna and the second antenna. 3. The antenna of claim 2, wherein the antenna has a length between one-half and one-fourth of the periphery of the wearable device. 4. The antenna of claim 1, wherein the wearable device is a smartwatch. 5. The antenna of claim 1, wherein the antenna is configured to be coupled to a carrier within the wearable device, the carrier having an inner leg and an outer leg, the outer leg is angled towards the inner leg, the inner and outer legs are connected at an apex by an arcuate surface. 6. A wearable device, comprising:
a housing shaped to be worn on a human body, the housing having at least one outer surface and an internal cavity, wherein the at least one outer surface of the housing is shaped to come in contact with the human body; a cover configured to enclose the internal cavity of the housing; a carrier, the carrier positioned within the internal cavity of the housing along a periphery of the internal cavity;
a first antenna for a first frequency band, the first antenna being a coupled loop antenna attached to the carrier at a first location, the first antenna comprising:
an outer trace, the outer trace having a first end and a second end, wherein the first end is configured to serve as a feed for the first antenna; and an inner trace, the inner trace having a first end positioned adjacent to the second end of the outer trace. 7. The wearable device of claim 6, wherein the carrier has an inner leg and an outer leg, the outer leg is angled towards the inner leg, the inner and outer legs are connected at an apex by an arcuate surface. 8. The wearable device of claim 6, wherein the first antenna has a length between one-half and one-fourth of the periphery of the wearable device. 9. The wearable device of claim 6, further comprising a second antenna, the second antenna being a monopole antenna and attached to the carrier at a location in proximity to the first antenna. 10. The wearable device of claim 9, wherein the first antenna and second antenna share a common ground. 11. The wearable device of claim 10, wherein the common ground is the housing. 12. A system, comprising:
a first antenna for a first frequency band, the first antenna being a coupled loop antenna having an inner and outer trace, the outer trace having a first end configured to serve as a feed for the first antenna; a second antenna for a second frequency band, the second antenna being a monopole antenna having a first end configured to serve as a feed for the first antenna; and wherein the first and second antennas are positioned along a periphery of a wearable device and coupled to a common ground. 13. The system of claim 12, wherein the first antenna has a length between one-half and one-fourth of the periphery of the wearable device. 14. The system of claim 12, wherein the first antenna is a GPS antenna. 15. The system of claim 12, wherein the wearable device is a smartwatch. 16. The system of claim 15, wherein the smartwatch includes a housing, the housing being insertable into a variety of different watchbands, the variety of different watchbands comprised of a variety of different materials. 17. The system of claim 12, wherein the first antenna is positioned in proximity to the second antenna without causing interference between the first and second antennas. 18. The system of claim 12, wherein the outer trace has a second end and the inner trace has a first end, the second end of the outer trace is positioned adjacent to the first end of the inner trace. 19. The system of claim 12, wherein the first and second antennas are configured to be coupled to a carrier within the wearable device, the carrier having an inner leg and an outer leg, the outer leg is angled towards the inner leg, the inner and outer legs are connected at an apex by an arcuate surface. | An antenna is provided for a wearable personal computing device, such as a smartwatch. The antenna integrates with other components of the wearable device, such as a second antenna. For example, the first antenna may be a coupled loop antenna in proximity to a second antenna that may be a monopole antenna, without causing interference between the two antennas. In one example, the first antenna shares a common ground with the second antenna.1. An antenna, comprising:
an inner trace, the inner trace having a first and second end, the first end configured to serve as a feed for the antenna; an outer trace, the outer trace having a first and second end, the first end of the outer trace positioned adjacent to the second end of the inner trace; wherein the inner and outer trace are positioned along a periphery of a wearable device and coupled to a ground; and wherein the antenna is a coupled loop antenna. 2. The antenna of claim 1, wherein the antenna is positioned in proximity to a second antenna of a different type without causing interference between the antenna and the second antenna. 3. The antenna of claim 2, wherein the antenna has a length between one-half and one-fourth of the periphery of the wearable device. 4. The antenna of claim 1, wherein the wearable device is a smartwatch. 5. The antenna of claim 1, wherein the antenna is configured to be coupled to a carrier within the wearable device, the carrier having an inner leg and an outer leg, the outer leg is angled towards the inner leg, the inner and outer legs are connected at an apex by an arcuate surface. 6. A wearable device, comprising:
a housing shaped to be worn on a human body, the housing having at least one outer surface and an internal cavity, wherein the at least one outer surface of the housing is shaped to come in contact with the human body; a cover configured to enclose the internal cavity of the housing; a carrier, the carrier positioned within the internal cavity of the housing along a periphery of the internal cavity;
a first antenna for a first frequency band, the first antenna being a coupled loop antenna attached to the carrier at a first location, the first antenna comprising:
an outer trace, the outer trace having a first end and a second end, wherein the first end is configured to serve as a feed for the first antenna; and an inner trace, the inner trace having a first end positioned adjacent to the second end of the outer trace. 7. The wearable device of claim 6, wherein the carrier has an inner leg and an outer leg, the outer leg is angled towards the inner leg, the inner and outer legs are connected at an apex by an arcuate surface. 8. The wearable device of claim 6, wherein the first antenna has a length between one-half and one-fourth of the periphery of the wearable device. 9. The wearable device of claim 6, further comprising a second antenna, the second antenna being a monopole antenna and attached to the carrier at a location in proximity to the first antenna. 10. The wearable device of claim 9, wherein the first antenna and second antenna share a common ground. 11. The wearable device of claim 10, wherein the common ground is the housing. 12. A system, comprising:
a first antenna for a first frequency band, the first antenna being a coupled loop antenna having an inner and outer trace, the outer trace having a first end configured to serve as a feed for the first antenna; a second antenna for a second frequency band, the second antenna being a monopole antenna having a first end configured to serve as a feed for the first antenna; and wherein the first and second antennas are positioned along a periphery of a wearable device and coupled to a common ground. 13. The system of claim 12, wherein the first antenna has a length between one-half and one-fourth of the periphery of the wearable device. 14. The system of claim 12, wherein the first antenna is a GPS antenna. 15. The system of claim 12, wherein the wearable device is a smartwatch. 16. The system of claim 15, wherein the smartwatch includes a housing, the housing being insertable into a variety of different watchbands, the variety of different watchbands comprised of a variety of different materials. 17. The system of claim 12, wherein the first antenna is positioned in proximity to the second antenna without causing interference between the first and second antennas. 18. The system of claim 12, wherein the outer trace has a second end and the inner trace has a first end, the second end of the outer trace is positioned adjacent to the first end of the inner trace. 19. The system of claim 12, wherein the first and second antennas are configured to be coupled to a carrier within the wearable device, the carrier having an inner leg and an outer leg, the outer leg is angled towards the inner leg, the inner and outer legs are connected at an apex by an arcuate surface. | 2,800 |
12,226 | 12,226 | 15,344,369 | 2,865 | An HVAC thermal energy flow measurement system includes a computerized virtual fluid flow measurement system configured to estimate a fluid flow within at least a portion of the HVAC system based on at least one HVAC system condition, and at least one HVAC system sensor for sensing the at least one HVAC system condition, wherein the HVAC system sensor is operatively connected to the virtual flow measurement system to provide the virtual flow measurement system with the at least one HVAC system condition. | 1. An HVAC thermal energy flow measurement system, comprising:
a computerized virtual fluid flow measurement system configured to estimate a fluid flow within at least a portion of the HVAC system based on at least one HVAC system condition; and at least one HVAC system sensor for sensing the at least one HVAC system condition, wherein the HVAC system sensor is operatively connected to the virtual flow measurement system to provide the virtual flow measurement system with the at least one HVAC system condition. 2. The thermal energy flow measurement system of claim 1, further including a physical or mathematical model, stored in a non-transitory computer readable medium therein, that represents the fluid flow for determining the fluid flow based on the at least one HVAC system condition. 3. The thermal energy flow measurement system of claim 1, further including an empirical or statistical model, stored in a non-transitory computer readable medium therein, for determining the fluid flow based on the at least one HVAC system condition, wherein the fluid flow is determined by comparing the at least one HVAC system condition to known flow data. 4. The thermal energy flow measurement system of claim 1, further including:
at least a portion of a physical or mathematical model, stored in a non-transitory computer readable medium therein, that at least partially represents the fluid flow; and at least a portion of an empirical or statistical model, stored in a non-transitory computer readable medium therein, for determining the fluid flow based on the at least one HVAC system condition, wherein the fluid flow is determined by inputting the physical condition into the physical model and comparing the at least one HVAC system condition to known flow data. 5. The thermal energy flow measurement system of claim 1, wherein the HVAC system sensor includes at least one temperature sensor in thermal communication with at least a portion of the fluid flow. 6. The thermal energy flow measurement system of claim 5, wherein the at least one temperature sensor includes at least two temperature sensors. 7. The thermal energy flow measurement system of claim 6, wherein the at least two temperature sensors include an inlet temperature sensor disposed in thermal communication with a first portion of the HVAC and an outlet temperature sensor disposed in thermal communication with a second portion of the HVAC. 8. The thermal energy flow measurement system of claim 7, wherein the thermal energy flow measurement system is configured to determine thermal energy flow using the fluid flow and a signal from each of the inlet and outlet temperature sensors. 9. A non-transitory computer readable medium comprising computer executable instructions comprising the steps of:
receiving at least one HVAC system condition from an HVAC system sensor; inputting the at least one HVAC system condition from the HVAC system sensor into a virtual fluid flow system to determine a fluid flow of at least a portion of the HVAC system; outputting a fluid flow value; and determining thermal energy flow using at least the fluid flow. 10. The non-transitory computer readable medium of claim 9, wherein inputting further includes inputting the at least one HVAC system condition into a physical or mathematical model that represents the fluid flow for determining the fluid flow based on the at least one HVAC system condition. 11. The non-transitory computer readable medium of claim 9, wherein inputting further includes inputting the at least one HVAC system condition into a statistical model for determining the fluid flow based on the at least one HVAC system condition. 12. The non-transitory computer readable medium of claim 9, further including the computer executable instructions further include performing a system functional test that includes at least one of bypass valve sweeping or branch sweeping for one or more branches of the HVAC system. 13. A method for measuring thermal energy flow in an HVAC system, comprising:
receiving at least one parameter or variable from the HVAC system; inputting the at least one parameter or variable from the HVAC system into a virtual fluid flow system to determine a fluid flow of at least a portion of the HVAC; outputting a fluid flow value; and determining thermal energy flow using at least the fluid flow and a sensed temperature. 14. The method of claim 13, wherein the sensed temperature includes a first sensed temperature and a second sensed temperature from two different locations along a flow path of the fluid flow. 15. The method of claim 13, further including performing a system functional test that includes at least one of bypass valve sweeping or branch sweeping for one or more branches of the HVAC system. 16. (canceled) 17. (canceled) | An HVAC thermal energy flow measurement system includes a computerized virtual fluid flow measurement system configured to estimate a fluid flow within at least a portion of the HVAC system based on at least one HVAC system condition, and at least one HVAC system sensor for sensing the at least one HVAC system condition, wherein the HVAC system sensor is operatively connected to the virtual flow measurement system to provide the virtual flow measurement system with the at least one HVAC system condition.1. An HVAC thermal energy flow measurement system, comprising:
a computerized virtual fluid flow measurement system configured to estimate a fluid flow within at least a portion of the HVAC system based on at least one HVAC system condition; and at least one HVAC system sensor for sensing the at least one HVAC system condition, wherein the HVAC system sensor is operatively connected to the virtual flow measurement system to provide the virtual flow measurement system with the at least one HVAC system condition. 2. The thermal energy flow measurement system of claim 1, further including a physical or mathematical model, stored in a non-transitory computer readable medium therein, that represents the fluid flow for determining the fluid flow based on the at least one HVAC system condition. 3. The thermal energy flow measurement system of claim 1, further including an empirical or statistical model, stored in a non-transitory computer readable medium therein, for determining the fluid flow based on the at least one HVAC system condition, wherein the fluid flow is determined by comparing the at least one HVAC system condition to known flow data. 4. The thermal energy flow measurement system of claim 1, further including:
at least a portion of a physical or mathematical model, stored in a non-transitory computer readable medium therein, that at least partially represents the fluid flow; and at least a portion of an empirical or statistical model, stored in a non-transitory computer readable medium therein, for determining the fluid flow based on the at least one HVAC system condition, wherein the fluid flow is determined by inputting the physical condition into the physical model and comparing the at least one HVAC system condition to known flow data. 5. The thermal energy flow measurement system of claim 1, wherein the HVAC system sensor includes at least one temperature sensor in thermal communication with at least a portion of the fluid flow. 6. The thermal energy flow measurement system of claim 5, wherein the at least one temperature sensor includes at least two temperature sensors. 7. The thermal energy flow measurement system of claim 6, wherein the at least two temperature sensors include an inlet temperature sensor disposed in thermal communication with a first portion of the HVAC and an outlet temperature sensor disposed in thermal communication with a second portion of the HVAC. 8. The thermal energy flow measurement system of claim 7, wherein the thermal energy flow measurement system is configured to determine thermal energy flow using the fluid flow and a signal from each of the inlet and outlet temperature sensors. 9. A non-transitory computer readable medium comprising computer executable instructions comprising the steps of:
receiving at least one HVAC system condition from an HVAC system sensor; inputting the at least one HVAC system condition from the HVAC system sensor into a virtual fluid flow system to determine a fluid flow of at least a portion of the HVAC system; outputting a fluid flow value; and determining thermal energy flow using at least the fluid flow. 10. The non-transitory computer readable medium of claim 9, wherein inputting further includes inputting the at least one HVAC system condition into a physical or mathematical model that represents the fluid flow for determining the fluid flow based on the at least one HVAC system condition. 11. The non-transitory computer readable medium of claim 9, wherein inputting further includes inputting the at least one HVAC system condition into a statistical model for determining the fluid flow based on the at least one HVAC system condition. 12. The non-transitory computer readable medium of claim 9, further including the computer executable instructions further include performing a system functional test that includes at least one of bypass valve sweeping or branch sweeping for one or more branches of the HVAC system. 13. A method for measuring thermal energy flow in an HVAC system, comprising:
receiving at least one parameter or variable from the HVAC system; inputting the at least one parameter or variable from the HVAC system into a virtual fluid flow system to determine a fluid flow of at least a portion of the HVAC; outputting a fluid flow value; and determining thermal energy flow using at least the fluid flow and a sensed temperature. 14. The method of claim 13, wherein the sensed temperature includes a first sensed temperature and a second sensed temperature from two different locations along a flow path of the fluid flow. 15. The method of claim 13, further including performing a system functional test that includes at least one of bypass valve sweeping or branch sweeping for one or more branches of the HVAC system. 16. (canceled) 17. (canceled) | 2,800 |
12,227 | 12,227 | 15,846,000 | 2,846 | A sensor assembly includes a cylindrical sensor window defining an axis, and an annular member coupled to the sensor window and rotatable about the axis. The annular member includes a nozzle aimed at the sensor window and oriented at an acute angle from a radial direction toward the axis in a plane orthogonal to the axis. | 1. A sensor assembly comprising:
a cylindrical sensor window defining an axis; and an annular member coupled to the sensor window and rotatable about the axis, the annular member including a nozzle aimed at the sensor window and oriented at an acute angle from a radial direction toward the axis in a plane orthogonal to the axis. 2. The sensor assembly of claim 1, wherein the nozzle is a first nozzle, the acute angle is a first acute angle, and the annular member includes a second nozzle aimed at the sensor window and oriented at a second acute angle from a radial direction toward the axis in a plane orthogonal to the axis. 3. The sensor assembly of claim 1, further comprising a base member fixed relative to the sensor window and about which the annular member extends, wherein the annular member includes an annular-member passage fluidly connected to the nozzle, and the base member includes a base-member passage fluidly connected to the annular-member passage. 4. The sensor assembly of claim 3, wherein the base-member passage is fluidly connected to the annular-member passage for rotational positions continuously for 360° of the annular member relative to the base member. 5. The sensor assembly of claim 3, wherein the annular-member passage extends about and is partially defined by the base member. 6. The sensor assembly of claim 5, wherein the base-member passage is elongated to an opening connected to the annular-member passage. 7. The sensor assembly of claim 3, wherein the nozzle is a liquid nozzle, the base-member passage is a liquid base-member passage, and the base member includes an air nozzle aimed at the sensor window and an air base-member passage separate from the liquid base-member passage. 8. The sensor assembly of claim 7, further comprising a pump and a compressor, wherein the liquid base-member passage is fluidly connected to the pump, and the air base-member passage is fluidly connected to the compressor. 9. The sensor assembly of claim 1, further comprising a pump fluidly connected to the nozzle, wherein the pump is sized to produce sufficient pressure for fluid exiting the nozzle to cause the annular member to rotate. 10. The sensor assembly of claim 1, wherein the nozzle is a liquid nozzle, the sensor assembly further comprising a base member fixed relative to the sensor window, wherein the base member includes an air nozzle aimed at the sensor window. 11. The sensor assembly of claim 10, wherein the base member includes a plurality of air nozzles including the air nozzle, the air nozzles circumferentially arranged about the sensor window. 12. The sensor assembly of claim 1, further comprising a mounting bracket connectable to a vehicle, wherein the sensor window is fixed relative to the mounting bracket. 13. The sensor assembly of claim 1, wherein the sensor window is a first sensor window, and the first sensor window is disposed above the annular member, the sensor assembly further comprising a second cylindrical sensor window fixed relative to the first sensor window and disposed below the annular member. 14. The sensor assembly of claim 13, wherein the nozzle is a first nozzle, the acute angle is a first acute angle, and the annular member includes a second nozzle aimed at the second sensor window and oriented at a second acute angle from a radial direction toward the axis in a plane orthogonal to the axis. 15. The sensor assembly of claim 14, wherein the first acute angle is equal to the second acute angle. 16. The sensor assembly of claim 14, wherein the first nozzle is a first liquid nozzle, the second nozzle is a second liquid nozzle, the sensor assembly further comprising a base member fixed relative to the first sensor window, wherein the base member includes a first air nozzle aimed at the first sensor window and a second air nozzle aimed at the second sensor window. 17. The sensor assembly of claim 1, wherein the acute angle is between 15° and 45°. 18. The sensor assembly of claim 1, wherein the annular member is rotatingly drivable only by fluid exiting the nozzle. 19. A sensor assembly comprising:
a cylindrical sensor window defining an axis; an annular member coupled to the sensor window and rotatable about the axis; means for washing the sensor window; and means for rotating the annular member about the axis, wherein the means for rotating the annular member about the axis are the same as the means for washing the sensor window. 20. The sensor assembly of claim 19, further comprising means for drying the sensor window. | A sensor assembly includes a cylindrical sensor window defining an axis, and an annular member coupled to the sensor window and rotatable about the axis. The annular member includes a nozzle aimed at the sensor window and oriented at an acute angle from a radial direction toward the axis in a plane orthogonal to the axis.1. A sensor assembly comprising:
a cylindrical sensor window defining an axis; and an annular member coupled to the sensor window and rotatable about the axis, the annular member including a nozzle aimed at the sensor window and oriented at an acute angle from a radial direction toward the axis in a plane orthogonal to the axis. 2. The sensor assembly of claim 1, wherein the nozzle is a first nozzle, the acute angle is a first acute angle, and the annular member includes a second nozzle aimed at the sensor window and oriented at a second acute angle from a radial direction toward the axis in a plane orthogonal to the axis. 3. The sensor assembly of claim 1, further comprising a base member fixed relative to the sensor window and about which the annular member extends, wherein the annular member includes an annular-member passage fluidly connected to the nozzle, and the base member includes a base-member passage fluidly connected to the annular-member passage. 4. The sensor assembly of claim 3, wherein the base-member passage is fluidly connected to the annular-member passage for rotational positions continuously for 360° of the annular member relative to the base member. 5. The sensor assembly of claim 3, wherein the annular-member passage extends about and is partially defined by the base member. 6. The sensor assembly of claim 5, wherein the base-member passage is elongated to an opening connected to the annular-member passage. 7. The sensor assembly of claim 3, wherein the nozzle is a liquid nozzle, the base-member passage is a liquid base-member passage, and the base member includes an air nozzle aimed at the sensor window and an air base-member passage separate from the liquid base-member passage. 8. The sensor assembly of claim 7, further comprising a pump and a compressor, wherein the liquid base-member passage is fluidly connected to the pump, and the air base-member passage is fluidly connected to the compressor. 9. The sensor assembly of claim 1, further comprising a pump fluidly connected to the nozzle, wherein the pump is sized to produce sufficient pressure for fluid exiting the nozzle to cause the annular member to rotate. 10. The sensor assembly of claim 1, wherein the nozzle is a liquid nozzle, the sensor assembly further comprising a base member fixed relative to the sensor window, wherein the base member includes an air nozzle aimed at the sensor window. 11. The sensor assembly of claim 10, wherein the base member includes a plurality of air nozzles including the air nozzle, the air nozzles circumferentially arranged about the sensor window. 12. The sensor assembly of claim 1, further comprising a mounting bracket connectable to a vehicle, wherein the sensor window is fixed relative to the mounting bracket. 13. The sensor assembly of claim 1, wherein the sensor window is a first sensor window, and the first sensor window is disposed above the annular member, the sensor assembly further comprising a second cylindrical sensor window fixed relative to the first sensor window and disposed below the annular member. 14. The sensor assembly of claim 13, wherein the nozzle is a first nozzle, the acute angle is a first acute angle, and the annular member includes a second nozzle aimed at the second sensor window and oriented at a second acute angle from a radial direction toward the axis in a plane orthogonal to the axis. 15. The sensor assembly of claim 14, wherein the first acute angle is equal to the second acute angle. 16. The sensor assembly of claim 14, wherein the first nozzle is a first liquid nozzle, the second nozzle is a second liquid nozzle, the sensor assembly further comprising a base member fixed relative to the first sensor window, wherein the base member includes a first air nozzle aimed at the first sensor window and a second air nozzle aimed at the second sensor window. 17. The sensor assembly of claim 1, wherein the acute angle is between 15° and 45°. 18. The sensor assembly of claim 1, wherein the annular member is rotatingly drivable only by fluid exiting the nozzle. 19. A sensor assembly comprising:
a cylindrical sensor window defining an axis; an annular member coupled to the sensor window and rotatable about the axis; means for washing the sensor window; and means for rotating the annular member about the axis, wherein the means for rotating the annular member about the axis are the same as the means for washing the sensor window. 20. The sensor assembly of claim 19, further comprising means for drying the sensor window. | 2,800 |
12,228 | 12,228 | 15,287,825 | 2,883 | Optical telecommunication receivers and transmitters are described comprising dispersive elements and adjustable beam steering elements that are combined to provide optical grid tracking to adjust with very low power consumption to variations in the optical grid due to various changes, such as temperature fluctuations, age or other environmental or design changes. Thus, high bandwidth transmitters or receivers can be provides with low power consumption and/or low cost designs. | 1. An adjustable optical telecommunication transmitter comprising:
a plurality of light emitting elements that emit optical signals chromatically spaced from each other; a dispersive element comprising a dispersive structure, a first interface providing a plurality of optical channel paths being optically coupled to the plurality of light emitting elements and to the grating, and a conjugate spatially-extended second interface to receive chromatically combined signals from the dispersive structure; and an adjustable beam steering element optically connected to the first interface or to the conjugate spatially-extended second interface. 2. The adjustable optical telecommunication transmitter of claim 1 wherein the adjustable beam steering element is optically connected to the spatially-extended second interface and comprises an actuator and a controller programmed to adjust the beam steering element to adjust the direction to guide the chromatically combined optical signal to a transmission waveguide. 3. The adjustable optical telecommunication transmitter of claim 1 wherein the dispersive element is planar and the dispersive structure comprises an arrayed waveguide grating. 4. The adjustable optical telecommunication transmitter of claim 1 wherein the dispersive structure comprises an echelle grating. 5. The adjustable optical telecommunication transmitter of claim 1 wherein the plurality of light emitting elements comprise an array of lasers. 6. The adjustable optical telecommunication transmitter of claim 1 wherein the plurality of light emitting elements comprises a series of individual lasers selected for wavelength and directly attached to the first interface of the dispersive element. 7. The adjustable optical telecommunication transmitter of claim 1 wherein the beam steering element comprises a mirror and a MEMS device configured to adjust the angle of the mirror relative to the dispersive element. 8. The adjustable optical telecommunication transmitter of claim 1 wherein the dispersive structure is planar and wherein the beam steering device comprises a planar cantilever structure integrated into a planar structure comprising the dispersive element. 9. The optical telecommunication transmitter of claim 8 wherein the planar cantilever structure includes a waveguide to guide an optical signal. 10. The optical telecommunication transmitter of claim 8 wherein the planar cantilever structure is moved through electrostatic actuation. 11. The adjustable optical telecommunication transmitter of claim 1 wherein the plurality of light emitting elements comprises an array of lasers and the beam steering element comprises a MEMS device, and further comprising a focusing element to focus light from the dispersive element to a transmission waveguide by way of the MEMS device wherein the angular adjustment of the MEMS device provides for chromatic grid selection. 12. The adjustable optical telecommunication transmitter of claim 1 wherein the dispersive element is a planar optical element and the spatially-extended interface comprises a slab waveguide section. 13. The adjustable optical telecommunications transmitter of claim 1 wherein the adjustable beam steering element is optically connected to the first interface. 14. The adjustable optical telecommunication transmitter of claim 1 wherein the dispersive element is planar can comprises a grating, and wherein the beam steering element comprises a first lens and an adjustable reflector with the first lens positioned between the adjustable reflector and the first interface of the planar dispersive element, wherein the angle between the optical reflector and the second interface can be adjusted to redirect the dispersed optical signal. 15. The adjustable optical telecommunication transmitter of claim 14 wherein the lens is about a focal length from the second interface. 16. The adjustable optical telecommunication transmitter of claim 14 wherein the grating comprises an arrayed waveguide grating and the first interface and the second interface are slab waveguides. 17. The adjustable optical telecommunication transmitter of claim 14 wherein the beam steering element is configured to guide dispersed optical signals from the plurality of light emitting elements and the first interface. 18. The adjustable optical telecommunication transmitter of claim 1 wherein the beam steering element comprises a cantilever structure with electrodes to effectuate adjustment of the position of the steerable waveguide in response to an optical signal. 19. A method for providing grid tracking with the adjustable optical telecommunication transmitter of claim 1, the method comprising adjusting the beam steering element configured to receive chromatically combined signal from the optical transmitter to direct the signal to select a chromatic grid with a particular center band. 20. A method for conveying multiple distinct data signals through an optical fiber, said method comprising:
i) transmitting output from a plurality of lasers through an adjustable optical telecommunications transmitter of claim 1 to form a spectrally combined optical signal, wherein the output of each laser corresponds to an independent data signal; and wherein the beam steering element is automatically adjusted by a controller to maintain a signal intensity at the plurality of light receiving elements representative of the independent data signals. 21. The method of claim 20 wherein the lasers comprise vertical cavity surface emitting lasers or distributed feedback lasers and wherein the adjustable optical telecommunications transmitter comprises an AWG. 22. The method of claim 21 wherein another beam steering element is located between the AWG and the optical fiber. 23. The method of claim 20 wherein the optical fiber connects remote locations. 24. The method of claim 20 wherein the beam steering element comprises a MEMS device and a pivoting mirror operably connected to the MEMS device to provide for adjustment of the mirror orientation. | Optical telecommunication receivers and transmitters are described comprising dispersive elements and adjustable beam steering elements that are combined to provide optical grid tracking to adjust with very low power consumption to variations in the optical grid due to various changes, such as temperature fluctuations, age or other environmental or design changes. Thus, high bandwidth transmitters or receivers can be provides with low power consumption and/or low cost designs.1. An adjustable optical telecommunication transmitter comprising:
a plurality of light emitting elements that emit optical signals chromatically spaced from each other; a dispersive element comprising a dispersive structure, a first interface providing a plurality of optical channel paths being optically coupled to the plurality of light emitting elements and to the grating, and a conjugate spatially-extended second interface to receive chromatically combined signals from the dispersive structure; and an adjustable beam steering element optically connected to the first interface or to the conjugate spatially-extended second interface. 2. The adjustable optical telecommunication transmitter of claim 1 wherein the adjustable beam steering element is optically connected to the spatially-extended second interface and comprises an actuator and a controller programmed to adjust the beam steering element to adjust the direction to guide the chromatically combined optical signal to a transmission waveguide. 3. The adjustable optical telecommunication transmitter of claim 1 wherein the dispersive element is planar and the dispersive structure comprises an arrayed waveguide grating. 4. The adjustable optical telecommunication transmitter of claim 1 wherein the dispersive structure comprises an echelle grating. 5. The adjustable optical telecommunication transmitter of claim 1 wherein the plurality of light emitting elements comprise an array of lasers. 6. The adjustable optical telecommunication transmitter of claim 1 wherein the plurality of light emitting elements comprises a series of individual lasers selected for wavelength and directly attached to the first interface of the dispersive element. 7. The adjustable optical telecommunication transmitter of claim 1 wherein the beam steering element comprises a mirror and a MEMS device configured to adjust the angle of the mirror relative to the dispersive element. 8. The adjustable optical telecommunication transmitter of claim 1 wherein the dispersive structure is planar and wherein the beam steering device comprises a planar cantilever structure integrated into a planar structure comprising the dispersive element. 9. The optical telecommunication transmitter of claim 8 wherein the planar cantilever structure includes a waveguide to guide an optical signal. 10. The optical telecommunication transmitter of claim 8 wherein the planar cantilever structure is moved through electrostatic actuation. 11. The adjustable optical telecommunication transmitter of claim 1 wherein the plurality of light emitting elements comprises an array of lasers and the beam steering element comprises a MEMS device, and further comprising a focusing element to focus light from the dispersive element to a transmission waveguide by way of the MEMS device wherein the angular adjustment of the MEMS device provides for chromatic grid selection. 12. The adjustable optical telecommunication transmitter of claim 1 wherein the dispersive element is a planar optical element and the spatially-extended interface comprises a slab waveguide section. 13. The adjustable optical telecommunications transmitter of claim 1 wherein the adjustable beam steering element is optically connected to the first interface. 14. The adjustable optical telecommunication transmitter of claim 1 wherein the dispersive element is planar can comprises a grating, and wherein the beam steering element comprises a first lens and an adjustable reflector with the first lens positioned between the adjustable reflector and the first interface of the planar dispersive element, wherein the angle between the optical reflector and the second interface can be adjusted to redirect the dispersed optical signal. 15. The adjustable optical telecommunication transmitter of claim 14 wherein the lens is about a focal length from the second interface. 16. The adjustable optical telecommunication transmitter of claim 14 wherein the grating comprises an arrayed waveguide grating and the first interface and the second interface are slab waveguides. 17. The adjustable optical telecommunication transmitter of claim 14 wherein the beam steering element is configured to guide dispersed optical signals from the plurality of light emitting elements and the first interface. 18. The adjustable optical telecommunication transmitter of claim 1 wherein the beam steering element comprises a cantilever structure with electrodes to effectuate adjustment of the position of the steerable waveguide in response to an optical signal. 19. A method for providing grid tracking with the adjustable optical telecommunication transmitter of claim 1, the method comprising adjusting the beam steering element configured to receive chromatically combined signal from the optical transmitter to direct the signal to select a chromatic grid with a particular center band. 20. A method for conveying multiple distinct data signals through an optical fiber, said method comprising:
i) transmitting output from a plurality of lasers through an adjustable optical telecommunications transmitter of claim 1 to form a spectrally combined optical signal, wherein the output of each laser corresponds to an independent data signal; and wherein the beam steering element is automatically adjusted by a controller to maintain a signal intensity at the plurality of light receiving elements representative of the independent data signals. 21. The method of claim 20 wherein the lasers comprise vertical cavity surface emitting lasers or distributed feedback lasers and wherein the adjustable optical telecommunications transmitter comprises an AWG. 22. The method of claim 21 wherein another beam steering element is located between the AWG and the optical fiber. 23. The method of claim 20 wherein the optical fiber connects remote locations. 24. The method of claim 20 wherein the beam steering element comprises a MEMS device and a pivoting mirror operably connected to the MEMS device to provide for adjustment of the mirror orientation. | 2,800 |
12,229 | 12,229 | 15,716,304 | 2,884 | A radiography aid and method of using the same comprising: attaching a radiographic reference device to the external fixation device, the radiographic reference device comprises at least two surfaces; positioning the first surface of the radiographic reference device on an imager surface to capture a first radiographic image of the external fixation device and the one or more objects; repositioning the external fixation device to position the second surface of the radiographic reference device on the imager surface to capture a second radiographic image of the external fixation device and the one or more objects that differs in position from the first radiographic image by the first angle; and calculating the position of the one or more objects in three dimensions. | 1. A method of determining the position of one or more objects affixed to an external fixation device in three dimensions comprising:
attaching a radiographic reference device to the external fixation device, wherein the radiographic reference device comprises at least two surfaces separated by a first angle, wherein the at least two surfaces of the radiographic reference device are positioned at a second angle relative to a longitudinal axis of the external fixation device; positioning the first surface of the radiographic reference device on a surface to capture a first radiographic image of the external fixation device and the one or more objects; repositioning the external fixation device to position the second surface of the radiographic reference device on the surface to capture a second radiographic image of the external fixation device and the one or more objects that differs in position from the first radiographic image by the first angle; and calculating the position of the one or more objects in three dimensions based on distances measured from the first and second radiographic images with the first and second angles. 2. The method of claim 1, wherein the radiographic reference device is attached to the external fixation device with one or more rods or struts. 3. The method of claim 1, wherein the first and second angles are selected from the group consisting of 30°, 45°, 60°, 75°, 90°, 105°, 120°, and 150° degrees. 4. The method of claim 1, further comprising positioning a size marker attached to at least one of the external fixation device, the strut, or the radiographic reference device, wherein the size marker provides a known size to calibrate the distances measured in the first and second radiographic images. 5. The method of claim 1, wherein the one or more struts are adjustable-length struts. 6. The method of claim 1, wherein the radiographic reference device is at least partially radiotranslucent. 7. The method of claim 1, wherein the radiographic reference device is plastic, polymer, metal, ceramic, wood, or a composite. 8. The method of claim 1, wherein the radiographic reference device further comprises a slot adapted to receive the one or more struts. 9. The method of claim 1, wherein the radiographic reference device is substantially flat. 10. The method of claim 1, wherein the radiographic reference device further comprises one or more storage compartments for storing one or more radiographic markers and the one or more struts. 11. The method of claim 1, wherein the one or more objects comprise at least one bone. 12. The method of claim 1, wherein the first and second surfaces of the radiographic reference device further comprise a first and second arm, respectively. 13. The method of claim 12, wherein each of the first and second arms comprise longitudinal slots that extend longitudinally along the respective arm and are substantially perpendicular to each other. 14. The method of claim 12, wherein the radiographic reference device has a right-angled shape with the first and second arms having substantially the same length. 15. The method of claim 1, further comprising attaching a radiographic marker to at least one of the radiographic reference device or the external fixation device. 16. A system for determining the position of one or more objects affixed to an external fixation device in three dimensions comprising:
a radiographic reference device attachable to the external fixation device, wherein the radiographic reference device comprises at least two surfaces separated by a first angle, wherein the at least two surfaces of the radiographic reference device are positioned at a second angle relative to a longitudinal axis of the external fixation device; a first and a second radiographic image taken with a radiography device, wherein the first radiographic image is acquired when the first surface of the radiographic reference device is on a surface, and the second radiographic image is taken when the second arm of the radiographic reference device is on the surface; and a processor that calculates the position of the one or more objects in three dimensions based on distances measured from the first and second radiographic images with the first and second angles. 17. The system of claim 16, further comprising one or more struts, wherein the radiographic reference device is attached to the external fixation device with the one or more rods or struts. 18. The system of claim 16, wherein the first and second angles are selected from the group consisting of 30°, 45°, 60°, 75°, 90°, 105°, 120°, and 150° degrees. 19. The system of claim 16, further comprising a size marker attached to at least one of the external fixation device, the strut or the radiographic reference device, wherein the size marker provides a known length to calibrate the distances measured of the first and second radiographic images. 20. The system of claim 16, wherein the one or more struts are adjustable struts. 21. The system of claim 16, wherein the radiographic reference device is at least partially radiotranslucent. 22. The system of claim 16, wherein the radiographic reference device is plastic, polymer, metal, ceramic, wood, or a composite. 23. The system of claim 16, wherein the radiographic reference device is defined further as comprising a slot adapted to receive the one or more struts. 24. The system of claim 16, wherein the radiographic reference device is substantially flat. 25. The system of claim 16, wherein the radiographic reference device further comprises one or more storage compartments for storing one or more radiographic markers and the one or more struts. 26. The system of claim 16, wherein the one or more objects comprise at least one bone. 27. The system of claim 16, first and second surfaces of the radiographic reference device are defined further as comprising a first and second arm, respectively. 28. The system of claim 16, wherein each of the first and second arms comprise longitudinal slits extend longitudinally along the respective arm and are substantially perpendicular to each other. 29. The system of claim 16, wherein the radiographic reference device has a right-angled shape with the first and second arms having substantially the same length. 30. The system of claim 16, further comprising a radiographic marker adapted to be attached to at least one of the radiographic reference device or the external fixation device. 31. A method of taking substantially orthogonal radiographs comprising:
attaching a radiographic reference device to an external fixation device, which external fixation device is adapted for attachment to one or more bones, wherein the radiographic reference device comprises at least a first arm and a second arm separated by a 90 degree angle, wherein the first arm and the second arm of the radiographic reference device are positioned perpendicular to a longitudinal axis of the external fixation device; positioning the first arm of the orthogonal radiographic reference device on a surface to capture a first radiographic image of the external fixation device; and repositioning the external fixation device and the radiographic reference device to position the second arm of the radiographic reference device to capture a second radiographic image of the external fixation device that is orthogonal to the first radiographic image. 32. A radiography aid for an external fixator comprising:
a first and a second arm along a plane, wherein the first and a second arms are separated by a 90 degree angle; at least one opening for attachment to an external fixator when the external fixator is adapted to be mounted and fixed onto a bone; and at least one size marker attached to the radiography aid, the external fixator, or the strut. | A radiography aid and method of using the same comprising: attaching a radiographic reference device to the external fixation device, the radiographic reference device comprises at least two surfaces; positioning the first surface of the radiographic reference device on an imager surface to capture a first radiographic image of the external fixation device and the one or more objects; repositioning the external fixation device to position the second surface of the radiographic reference device on the imager surface to capture a second radiographic image of the external fixation device and the one or more objects that differs in position from the first radiographic image by the first angle; and calculating the position of the one or more objects in three dimensions.1. A method of determining the position of one or more objects affixed to an external fixation device in three dimensions comprising:
attaching a radiographic reference device to the external fixation device, wherein the radiographic reference device comprises at least two surfaces separated by a first angle, wherein the at least two surfaces of the radiographic reference device are positioned at a second angle relative to a longitudinal axis of the external fixation device; positioning the first surface of the radiographic reference device on a surface to capture a first radiographic image of the external fixation device and the one or more objects; repositioning the external fixation device to position the second surface of the radiographic reference device on the surface to capture a second radiographic image of the external fixation device and the one or more objects that differs in position from the first radiographic image by the first angle; and calculating the position of the one or more objects in three dimensions based on distances measured from the first and second radiographic images with the first and second angles. 2. The method of claim 1, wherein the radiographic reference device is attached to the external fixation device with one or more rods or struts. 3. The method of claim 1, wherein the first and second angles are selected from the group consisting of 30°, 45°, 60°, 75°, 90°, 105°, 120°, and 150° degrees. 4. The method of claim 1, further comprising positioning a size marker attached to at least one of the external fixation device, the strut, or the radiographic reference device, wherein the size marker provides a known size to calibrate the distances measured in the first and second radiographic images. 5. The method of claim 1, wherein the one or more struts are adjustable-length struts. 6. The method of claim 1, wherein the radiographic reference device is at least partially radiotranslucent. 7. The method of claim 1, wherein the radiographic reference device is plastic, polymer, metal, ceramic, wood, or a composite. 8. The method of claim 1, wherein the radiographic reference device further comprises a slot adapted to receive the one or more struts. 9. The method of claim 1, wherein the radiographic reference device is substantially flat. 10. The method of claim 1, wherein the radiographic reference device further comprises one or more storage compartments for storing one or more radiographic markers and the one or more struts. 11. The method of claim 1, wherein the one or more objects comprise at least one bone. 12. The method of claim 1, wherein the first and second surfaces of the radiographic reference device further comprise a first and second arm, respectively. 13. The method of claim 12, wherein each of the first and second arms comprise longitudinal slots that extend longitudinally along the respective arm and are substantially perpendicular to each other. 14. The method of claim 12, wherein the radiographic reference device has a right-angled shape with the first and second arms having substantially the same length. 15. The method of claim 1, further comprising attaching a radiographic marker to at least one of the radiographic reference device or the external fixation device. 16. A system for determining the position of one or more objects affixed to an external fixation device in three dimensions comprising:
a radiographic reference device attachable to the external fixation device, wherein the radiographic reference device comprises at least two surfaces separated by a first angle, wherein the at least two surfaces of the radiographic reference device are positioned at a second angle relative to a longitudinal axis of the external fixation device; a first and a second radiographic image taken with a radiography device, wherein the first radiographic image is acquired when the first surface of the radiographic reference device is on a surface, and the second radiographic image is taken when the second arm of the radiographic reference device is on the surface; and a processor that calculates the position of the one or more objects in three dimensions based on distances measured from the first and second radiographic images with the first and second angles. 17. The system of claim 16, further comprising one or more struts, wherein the radiographic reference device is attached to the external fixation device with the one or more rods or struts. 18. The system of claim 16, wherein the first and second angles are selected from the group consisting of 30°, 45°, 60°, 75°, 90°, 105°, 120°, and 150° degrees. 19. The system of claim 16, further comprising a size marker attached to at least one of the external fixation device, the strut or the radiographic reference device, wherein the size marker provides a known length to calibrate the distances measured of the first and second radiographic images. 20. The system of claim 16, wherein the one or more struts are adjustable struts. 21. The system of claim 16, wherein the radiographic reference device is at least partially radiotranslucent. 22. The system of claim 16, wherein the radiographic reference device is plastic, polymer, metal, ceramic, wood, or a composite. 23. The system of claim 16, wherein the radiographic reference device is defined further as comprising a slot adapted to receive the one or more struts. 24. The system of claim 16, wherein the radiographic reference device is substantially flat. 25. The system of claim 16, wherein the radiographic reference device further comprises one or more storage compartments for storing one or more radiographic markers and the one or more struts. 26. The system of claim 16, wherein the one or more objects comprise at least one bone. 27. The system of claim 16, first and second surfaces of the radiographic reference device are defined further as comprising a first and second arm, respectively. 28. The system of claim 16, wherein each of the first and second arms comprise longitudinal slits extend longitudinally along the respective arm and are substantially perpendicular to each other. 29. The system of claim 16, wherein the radiographic reference device has a right-angled shape with the first and second arms having substantially the same length. 30. The system of claim 16, further comprising a radiographic marker adapted to be attached to at least one of the radiographic reference device or the external fixation device. 31. A method of taking substantially orthogonal radiographs comprising:
attaching a radiographic reference device to an external fixation device, which external fixation device is adapted for attachment to one or more bones, wherein the radiographic reference device comprises at least a first arm and a second arm separated by a 90 degree angle, wherein the first arm and the second arm of the radiographic reference device are positioned perpendicular to a longitudinal axis of the external fixation device; positioning the first arm of the orthogonal radiographic reference device on a surface to capture a first radiographic image of the external fixation device; and repositioning the external fixation device and the radiographic reference device to position the second arm of the radiographic reference device to capture a second radiographic image of the external fixation device that is orthogonal to the first radiographic image. 32. A radiography aid for an external fixator comprising:
a first and a second arm along a plane, wherein the first and a second arms are separated by a 90 degree angle; at least one opening for attachment to an external fixator when the external fixator is adapted to be mounted and fixed onto a bone; and at least one size marker attached to the radiography aid, the external fixator, or the strut. | 2,800 |
12,230 | 12,230 | 16,319,550 | 2,848 | A problem to be solved by the present invention is to prevent smoke emission and ignition of a power semiconductor element that is installed inside a power conversion device connected to a battery in the field of power electronics, for example. A semiconductor holding device according to the present invention includes: a package which houses a power semiconductor element therein and dissipates heat to a cooler from a first surface of the package; a plate covering a second surface opposing the first surface of the package; and a pressing member pressing the plate against the package. | 1.-10. (canceled) 11. A semiconductor element holding device comprising:
a package which houses a power semiconductor element therein and dissipates heat to a cooler from a first surface of the package; a plate covering a second surface opposing the first surface of the package; and a pressing member pressing the plate against the package. 12. The semiconductor element holding device according to claim 11, wherein
the package is fixed to the cooler by the pressing member. 13. The semiconductor element holding device according to claim 11, wherein
the plate has an area larger than an area of the second surface. 14. The semiconductor element holding device according to claim 12, wherein
the plate has an area larger than an area of the second surface. 15. The semiconductor element holding device according to claim 13, wherein
a surface standing perpendicularly from the plate along an outer peripheral portion of the plate is engaged with a side surface of the package. 16. The semiconductor element holding device according to claim 14, wherein
a surface standing perpendicularly from the plate along an outer peripheral portion of the plate is engaged with a side surface of the package. 17. The semiconductor element holding device according to claim 13, wherein
the second surfaces of a plurality of the packages are covered by the plate. 18. The semiconductor element holding device according to claim 14, wherein
the second surfaces of a plurality of the packages are covered by the plate. 19. The semiconductor element holding device according to claim 15, wherein
the second surfaces of a plurality of the packages are covered by the plate. 20. The semiconductor element holding device according to claim 16, wherein
the second surfaces of a plurality of the packages are covered by the plate. 21. The semiconductor element holding device according to claim 11, wherein,
a protrusion formed at an outer peripheral portion of the plate toward the second surface is engaged with a recess formed on the second surface. 22. The semiconductor element holding device according to claim 12, wherein,
a protrusion formed at an outer peripheral portion of the plate toward the second surface is engaged with a recess formed on the second surface. 23. The semiconductor element holding device according to claim 11, wherein
the pressing member is a spring member, and has one end fixed to the cooler and another end pressing the plate. 24. The semiconductor element holding device according to claim 11, wherein
the pressing member is formed from a screw, one end of the screw is engaged with the plate, and another end of the screw passes through the plate and the package so as to be screwed to the cooler. 25. The semiconductor element holding device according to claim 11, wherein
the power semiconductor element is a wide bandgap semiconductor. 26. A power conversion device using the semiconductor element holding device according to claim 11. | A problem to be solved by the present invention is to prevent smoke emission and ignition of a power semiconductor element that is installed inside a power conversion device connected to a battery in the field of power electronics, for example. A semiconductor holding device according to the present invention includes: a package which houses a power semiconductor element therein and dissipates heat to a cooler from a first surface of the package; a plate covering a second surface opposing the first surface of the package; and a pressing member pressing the plate against the package.1.-10. (canceled) 11. A semiconductor element holding device comprising:
a package which houses a power semiconductor element therein and dissipates heat to a cooler from a first surface of the package; a plate covering a second surface opposing the first surface of the package; and a pressing member pressing the plate against the package. 12. The semiconductor element holding device according to claim 11, wherein
the package is fixed to the cooler by the pressing member. 13. The semiconductor element holding device according to claim 11, wherein
the plate has an area larger than an area of the second surface. 14. The semiconductor element holding device according to claim 12, wherein
the plate has an area larger than an area of the second surface. 15. The semiconductor element holding device according to claim 13, wherein
a surface standing perpendicularly from the plate along an outer peripheral portion of the plate is engaged with a side surface of the package. 16. The semiconductor element holding device according to claim 14, wherein
a surface standing perpendicularly from the plate along an outer peripheral portion of the plate is engaged with a side surface of the package. 17. The semiconductor element holding device according to claim 13, wherein
the second surfaces of a plurality of the packages are covered by the plate. 18. The semiconductor element holding device according to claim 14, wherein
the second surfaces of a plurality of the packages are covered by the plate. 19. The semiconductor element holding device according to claim 15, wherein
the second surfaces of a plurality of the packages are covered by the plate. 20. The semiconductor element holding device according to claim 16, wherein
the second surfaces of a plurality of the packages are covered by the plate. 21. The semiconductor element holding device according to claim 11, wherein,
a protrusion formed at an outer peripheral portion of the plate toward the second surface is engaged with a recess formed on the second surface. 22. The semiconductor element holding device according to claim 12, wherein,
a protrusion formed at an outer peripheral portion of the plate toward the second surface is engaged with a recess formed on the second surface. 23. The semiconductor element holding device according to claim 11, wherein
the pressing member is a spring member, and has one end fixed to the cooler and another end pressing the plate. 24. The semiconductor element holding device according to claim 11, wherein
the pressing member is formed from a screw, one end of the screw is engaged with the plate, and another end of the screw passes through the plate and the package so as to be screwed to the cooler. 25. The semiconductor element holding device according to claim 11, wherein
the power semiconductor element is a wide bandgap semiconductor. 26. A power conversion device using the semiconductor element holding device according to claim 11. | 2,800 |
12,231 | 12,231 | 15,569,252 | 2,877 | Processing circuitry includes circuitry to receive data, where the data is indicative of a measurement of a region of a substrate, the region having a first layer, and a second layer, and the first and second layers are provided one above the other with respect to the substrate. The measurement being indicative of an optical parameter associated with the first layer. The processing circuitry further includes circuitry to calculate a thickness of the second layer based on the received data. | 1. Processing circuitry comprising:
circuitry to receive data, the data indicative of a measurement of a region of a substrate, the region having a first layer, and a second layer, the first and second layers provided one above the other with respect to the substrate, the measurement indicative of an optical parameter associated with the first layer; circuitry to calculate a thickness of the second layer based on the received data. 2. The processor of claim 1, wherein the circuitry to receive data is further to receive data indicative of a reference measurement indicative of an optical parameter of the first layer in the absence of the second layer. 3. The processor of claim 2, wherein the circuitry to calculate is arranged to determine a difference (≢) between the optical parameter associated with the first layer and the optical parameter of the first layer in the absence of the second layer, and the calculation of the thickness of the second layer is based on Δ. 4. The processor of claim 3, wherein the calculation of the thickness of the second layer is based on a comparison between the determined Δ and a predetermined relationship. 5. The processor of claim 1, wherein the second layer is transparent. 6. A printer comprising the processing circuitry of claim 1, wherein the measurement and calculation are made in-line with the printer. 7. An imaging system comprising:
A measurement device including a light source and a sensor, the sensor arranged to perform a measurement based on detection of light from the light source that has been reflected from a measurement region of a substrate, the measurement region having a first layer and a second layer one above the other with respect to the substrate; and processing circuitry to calculate a thickness of the second layer based on the measurement, wherein the measurement is indicative of an optical parameter associated with the first layer. 8. The system of claim 7, wherein the measurement device is further arranged to perform a reference measurement of a reference region, the reference measurement representative of the optical parameter of the first layer independent of the second layer, and
the processing circuitry is to calculate the thickness of the second layer based on both of the measurement of measurement region and the measurement of the reference region. 9. The method of claim 8, wherein the optical parameter is selected from a list consisting of: optical density, spectrum, a colour difference or distance, dE, dot area and gloss.. 10. The method of claim 7, wherein the second layer is transparent. 11. A method comprising:
determining a change in an optical parameter of a first layer due to a second layer applied over or below the first layer with respect to the substrate; calculating the thickness of the second layer based on the change in the parameter. 12. The method of claim 11, wherein the optical parameter is selected from a list consisting of: optical density, spectrum, a colour difference or distance, dE, dot area and gloss. 13. The method of claim 11, wherein the thickness of the second layer is calculated using a predetermined relationship. 14. The method of claim 13, wherein the relationship is a substrate dependent calibration. 15. The method of claim 11, wherein the second layer is transparent. | Processing circuitry includes circuitry to receive data, where the data is indicative of a measurement of a region of a substrate, the region having a first layer, and a second layer, and the first and second layers are provided one above the other with respect to the substrate. The measurement being indicative of an optical parameter associated with the first layer. The processing circuitry further includes circuitry to calculate a thickness of the second layer based on the received data.1. Processing circuitry comprising:
circuitry to receive data, the data indicative of a measurement of a region of a substrate, the region having a first layer, and a second layer, the first and second layers provided one above the other with respect to the substrate, the measurement indicative of an optical parameter associated with the first layer; circuitry to calculate a thickness of the second layer based on the received data. 2. The processor of claim 1, wherein the circuitry to receive data is further to receive data indicative of a reference measurement indicative of an optical parameter of the first layer in the absence of the second layer. 3. The processor of claim 2, wherein the circuitry to calculate is arranged to determine a difference (≢) between the optical parameter associated with the first layer and the optical parameter of the first layer in the absence of the second layer, and the calculation of the thickness of the second layer is based on Δ. 4. The processor of claim 3, wherein the calculation of the thickness of the second layer is based on a comparison between the determined Δ and a predetermined relationship. 5. The processor of claim 1, wherein the second layer is transparent. 6. A printer comprising the processing circuitry of claim 1, wherein the measurement and calculation are made in-line with the printer. 7. An imaging system comprising:
A measurement device including a light source and a sensor, the sensor arranged to perform a measurement based on detection of light from the light source that has been reflected from a measurement region of a substrate, the measurement region having a first layer and a second layer one above the other with respect to the substrate; and processing circuitry to calculate a thickness of the second layer based on the measurement, wherein the measurement is indicative of an optical parameter associated with the first layer. 8. The system of claim 7, wherein the measurement device is further arranged to perform a reference measurement of a reference region, the reference measurement representative of the optical parameter of the first layer independent of the second layer, and
the processing circuitry is to calculate the thickness of the second layer based on both of the measurement of measurement region and the measurement of the reference region. 9. The method of claim 8, wherein the optical parameter is selected from a list consisting of: optical density, spectrum, a colour difference or distance, dE, dot area and gloss.. 10. The method of claim 7, wherein the second layer is transparent. 11. A method comprising:
determining a change in an optical parameter of a first layer due to a second layer applied over or below the first layer with respect to the substrate; calculating the thickness of the second layer based on the change in the parameter. 12. The method of claim 11, wherein the optical parameter is selected from a list consisting of: optical density, spectrum, a colour difference or distance, dE, dot area and gloss. 13. The method of claim 11, wherein the thickness of the second layer is calculated using a predetermined relationship. 14. The method of claim 13, wherein the relationship is a substrate dependent calibration. 15. The method of claim 11, wherein the second layer is transparent. | 2,800 |
12,232 | 12,232 | 12,998,031 | 2,836 | An Inductive Power Transfer System pickup provides a controlled AC power supply by controlled variation of the phase angle between the pickup coil induced voltage (jwMI) and the tuning capacitor C voltage. The phase angle can be varied by maintaining the tuning capacitor C voltage substantially constant for a selected time period. Switches S 1 and S 2 may be used to clamp the tuning capacitor C voltage at substantially zero volts during the selected time period. Switch S 1 can be operated to prevent a rise in positive voltage across the tuning capacitor, and switch S 2 can be used to prevent the voltage across the tuning capacitor from going negative. | 1. A method of providing an AC supply from an IPT pickup having a pickup coil and tuning capacitor comprising a resonant circuit, the method comprising varying a phase angle between the pickup coil induced voltage and the tuning capacitor voltage to provide a controlled AC supply to an output of the pickup. 2. A method as claimed in claim 1 wherein the phase angle between the pickup coil induced voltage and the tuning capacitor voltage is varied by maintaining the tuning capacitor voltage substantially constant for a selected time period. 3. A method as claimed in claim 2 wherein the selected time period is varied to vary the phase angle. 4. A method as claimed in claim 2 wherein the step of maintaining the tuning capacitor voltage substantially constant comprises clamping the tuning capacitor voltage at substantially zero volts. 5. A method as claimed in claim 4 wherein the step of clamping the tuning capacitor voltage comprises operating a first switch to prevent a rise in positive voltage across the tuning capacitor. 6. A method as claimed in claim 5 wherein the step of clamping the tuning capacitor voltage comprises operating a second switch to prevent the voltage across the tuning capacitor from going negative. 7. A method as claimed in claim 6, further comprising sensing a change in sign of the voltage across the tuning capacitor as a reference for controlling the selected time period. 8. A method as claimed in claim 7, further comprising comparing the output of the pickup with a set point, and increasing or decreasing the selected time period to change the output of the pickup toward the set point. 9. A controller for an IPT pickup having a pickup coil and a tuning capacitor comprising a resonant circuit, the controller including one or more switches to control a tuning capacitor voltage to thereby vary a phase angle between a pickup coil induced voltage and the tuning capacitor voltage whereby the pickup provides a controlled AC supply to an output of the pickup. 10. An IPT pickup comprising a pickup coil and a tuning capacitor comprising a resonant circuit, and a controller to vary a phase angle between a pickup coil induced voltage and a tuning capacitor voltage to thereby provide a controlled AC supply to an output of the pickup. 11. An IPT pickup as claimed in claim 10 and further comprising a rectifier connected to the output of the pickup for providing a DC output. 12. An IPT system including an IPT pickup as claimed in claim 10. 13. (canceled) 14. (canceled) 15. (canceled) 16. A method as claimed in claim 3 wherein the step of maintaining the tuning capacitor voltage substantially constant comprises clamping the tuning capacitor voltage at substantially zero volts. 17. A method as claimed in claim 16 wherein the step of clamping the tuning capacitor voltage comprises operating a first switch to prevent a rise in positive voltage across the tuning capacitor. 18. A method as claimed in claim 17 wherein the step of clamping the tuning capacitor voltage comprises operating a second switch to prevent the voltage across the tuning capacitor from going negative. 19. A method as claimed in claim 16 wherein the step of clamping the tuning capacitor voltage comprises operating a second switch to prevent the voltage across the tuning capacitor from going negative. 20. A method as claimed in claim 4 wherein the step of clamping the tuning capacitor voltage comprises operating a second switch to prevent the voltage across the tuning capacitor from going negative. 21. A method as claimed in claim 2, further comprising sensing a change in sign of the voltage across the tuning capacitor as a reference for controlling the selected time period. 22. A method as claimed in claim 21, further comprising comparing the output of the pickup with a set point, and increasing or decreasing the selected time period to change the output of the pickup toward the set point. 23. An IPT system including an IPT pickup as claimed in claim 11. | An Inductive Power Transfer System pickup provides a controlled AC power supply by controlled variation of the phase angle between the pickup coil induced voltage (jwMI) and the tuning capacitor C voltage. The phase angle can be varied by maintaining the tuning capacitor C voltage substantially constant for a selected time period. Switches S 1 and S 2 may be used to clamp the tuning capacitor C voltage at substantially zero volts during the selected time period. Switch S 1 can be operated to prevent a rise in positive voltage across the tuning capacitor, and switch S 2 can be used to prevent the voltage across the tuning capacitor from going negative.1. A method of providing an AC supply from an IPT pickup having a pickup coil and tuning capacitor comprising a resonant circuit, the method comprising varying a phase angle between the pickup coil induced voltage and the tuning capacitor voltage to provide a controlled AC supply to an output of the pickup. 2. A method as claimed in claim 1 wherein the phase angle between the pickup coil induced voltage and the tuning capacitor voltage is varied by maintaining the tuning capacitor voltage substantially constant for a selected time period. 3. A method as claimed in claim 2 wherein the selected time period is varied to vary the phase angle. 4. A method as claimed in claim 2 wherein the step of maintaining the tuning capacitor voltage substantially constant comprises clamping the tuning capacitor voltage at substantially zero volts. 5. A method as claimed in claim 4 wherein the step of clamping the tuning capacitor voltage comprises operating a first switch to prevent a rise in positive voltage across the tuning capacitor. 6. A method as claimed in claim 5 wherein the step of clamping the tuning capacitor voltage comprises operating a second switch to prevent the voltage across the tuning capacitor from going negative. 7. A method as claimed in claim 6, further comprising sensing a change in sign of the voltage across the tuning capacitor as a reference for controlling the selected time period. 8. A method as claimed in claim 7, further comprising comparing the output of the pickup with a set point, and increasing or decreasing the selected time period to change the output of the pickup toward the set point. 9. A controller for an IPT pickup having a pickup coil and a tuning capacitor comprising a resonant circuit, the controller including one or more switches to control a tuning capacitor voltage to thereby vary a phase angle between a pickup coil induced voltage and the tuning capacitor voltage whereby the pickup provides a controlled AC supply to an output of the pickup. 10. An IPT pickup comprising a pickup coil and a tuning capacitor comprising a resonant circuit, and a controller to vary a phase angle between a pickup coil induced voltage and a tuning capacitor voltage to thereby provide a controlled AC supply to an output of the pickup. 11. An IPT pickup as claimed in claim 10 and further comprising a rectifier connected to the output of the pickup for providing a DC output. 12. An IPT system including an IPT pickup as claimed in claim 10. 13. (canceled) 14. (canceled) 15. (canceled) 16. A method as claimed in claim 3 wherein the step of maintaining the tuning capacitor voltage substantially constant comprises clamping the tuning capacitor voltage at substantially zero volts. 17. A method as claimed in claim 16 wherein the step of clamping the tuning capacitor voltage comprises operating a first switch to prevent a rise in positive voltage across the tuning capacitor. 18. A method as claimed in claim 17 wherein the step of clamping the tuning capacitor voltage comprises operating a second switch to prevent the voltage across the tuning capacitor from going negative. 19. A method as claimed in claim 16 wherein the step of clamping the tuning capacitor voltage comprises operating a second switch to prevent the voltage across the tuning capacitor from going negative. 20. A method as claimed in claim 4 wherein the step of clamping the tuning capacitor voltage comprises operating a second switch to prevent the voltage across the tuning capacitor from going negative. 21. A method as claimed in claim 2, further comprising sensing a change in sign of the voltage across the tuning capacitor as a reference for controlling the selected time period. 22. A method as claimed in claim 21, further comprising comparing the output of the pickup with a set point, and increasing or decreasing the selected time period to change the output of the pickup toward the set point. 23. An IPT system including an IPT pickup as claimed in claim 11. | 2,800 |
12,233 | 12,233 | 14,396,161 | 2,853 | The present disclosure describes a printhead circuit, devices, and methods of forming the printhead circuit. An example of a printhead circuit includes a substrate including a slot having a first, a second, and a third dimension in the substrate, circuitry on a first side and a second side of the slot, and a number of conductor traces routed across the slot along substantially a same geometrical plane as the circuitry on the first side and the second side of the slot. | 1. A printhead circuit comprising:
a substrate including a slot having a first, a second, and a third dimension in the substrate; circuitry on a first side and a second side of the slot; and a number of conductor traces routed across the slot along substantially a same geometrical plane as the circuitry on the first side and the second side of the slot. 2. The printhead of claim 1, comprising a path of at least one of the number of conductor traces routed across the slot having a first dimension greater than the first dimension of the slot. 3. The printhead of claim 2, wherein the path of at least one of the number of conductor traces comprises a direction change in the path passing across the slot. 4. The printhead of claim 1, wherein the number of conductor traces each have a width in a range of from 0.5 micrometers (μm) to 25 μm. 5. The printhead of claim 1, wherein the number of conductor traces comprises a first conductor trace and a second conductor trace, wherein a thinfilm is formed on a first surface of the first conductor trace and the second conductor trace is formed on a first surface of the thinfilm. 6. The printhead of claim 5, wherein the first conductor trace and the second conductor trace are formed from different metals. 7. The printhead of claim 1, wherein the number of conductor traces are in a thinfilm bridge connected to the circuitry on the first side and the second side of the slot. 8. The printhead of claim 7, wherein the thinfilm bridge includes a number of openings comprising a combined area of the number of openings in a range of from 10% to 80% of an overall area above the slot. 9. An fluid ejection device, comprising:
a housing including a reservoir for holding fluid; a printhead circuit affixed to the housing, wherein the printhead circuit comprises:
a number of fluid ejection elements including a number of nozzles operatively connected to the reservoir for ejecting fluid from the printhead circuit;
a substrate including a slot having a first, a second, and a third dimension in the substrate;
circuitry on a first side and a second side of the slot; and
a number of conductor traces routed across the slot along substantially a same geometrical plane as the circuitry on the first side and the second side of the slot. 10. The device of claim 9, wherein the number of conductor traces have a direction change in a path passing across the slot. 11. A method of forming a printhead circuit with a number of conductor traces across a slot, comprising:
forming a thinfilm bridge on a first surface of a substrate, wherein forming the thinfilm bridge comprises:
depositing a number of thinfilm layers;
positioning the number of conductor traces in the number of thinfilm layers along substantially a same geometrical plane as circuitry on a first side and a second side of the slot, wherein the number of conductor traces have a first dimension greater than a predetermined first dimension of the slot;
patterning the number of thinfilm layers;
forming a fluidic layer on a first surface of the thinfilm bridge; and
forming the slot of the predetermined first dimension in the substrate. 12. The method of claim 11, wherein at least one of the number of conductor traces provides electrical connections from the first side of the slot to a number of fluid ejection devices on the second side of the slot. 13. The method of claim 11, wherein at least one of the number of conductor traces conducts control signals from the first side of the slot to a component responsive to the control signal on the second side of the slot 14. The method of claim 11, wherein forming the slot comprises forming the slot using a laser and wet process etch. 15. The method of claim 11, wherein the method includes depositing a protective layer on a number of surfaces of the thinfilm layers. | The present disclosure describes a printhead circuit, devices, and methods of forming the printhead circuit. An example of a printhead circuit includes a substrate including a slot having a first, a second, and a third dimension in the substrate, circuitry on a first side and a second side of the slot, and a number of conductor traces routed across the slot along substantially a same geometrical plane as the circuitry on the first side and the second side of the slot.1. A printhead circuit comprising:
a substrate including a slot having a first, a second, and a third dimension in the substrate; circuitry on a first side and a second side of the slot; and a number of conductor traces routed across the slot along substantially a same geometrical plane as the circuitry on the first side and the second side of the slot. 2. The printhead of claim 1, comprising a path of at least one of the number of conductor traces routed across the slot having a first dimension greater than the first dimension of the slot. 3. The printhead of claim 2, wherein the path of at least one of the number of conductor traces comprises a direction change in the path passing across the slot. 4. The printhead of claim 1, wherein the number of conductor traces each have a width in a range of from 0.5 micrometers (μm) to 25 μm. 5. The printhead of claim 1, wherein the number of conductor traces comprises a first conductor trace and a second conductor trace, wherein a thinfilm is formed on a first surface of the first conductor trace and the second conductor trace is formed on a first surface of the thinfilm. 6. The printhead of claim 5, wherein the first conductor trace and the second conductor trace are formed from different metals. 7. The printhead of claim 1, wherein the number of conductor traces are in a thinfilm bridge connected to the circuitry on the first side and the second side of the slot. 8. The printhead of claim 7, wherein the thinfilm bridge includes a number of openings comprising a combined area of the number of openings in a range of from 10% to 80% of an overall area above the slot. 9. An fluid ejection device, comprising:
a housing including a reservoir for holding fluid; a printhead circuit affixed to the housing, wherein the printhead circuit comprises:
a number of fluid ejection elements including a number of nozzles operatively connected to the reservoir for ejecting fluid from the printhead circuit;
a substrate including a slot having a first, a second, and a third dimension in the substrate;
circuitry on a first side and a second side of the slot; and
a number of conductor traces routed across the slot along substantially a same geometrical plane as the circuitry on the first side and the second side of the slot. 10. The device of claim 9, wherein the number of conductor traces have a direction change in a path passing across the slot. 11. A method of forming a printhead circuit with a number of conductor traces across a slot, comprising:
forming a thinfilm bridge on a first surface of a substrate, wherein forming the thinfilm bridge comprises:
depositing a number of thinfilm layers;
positioning the number of conductor traces in the number of thinfilm layers along substantially a same geometrical plane as circuitry on a first side and a second side of the slot, wherein the number of conductor traces have a first dimension greater than a predetermined first dimension of the slot;
patterning the number of thinfilm layers;
forming a fluidic layer on a first surface of the thinfilm bridge; and
forming the slot of the predetermined first dimension in the substrate. 12. The method of claim 11, wherein at least one of the number of conductor traces provides electrical connections from the first side of the slot to a number of fluid ejection devices on the second side of the slot. 13. The method of claim 11, wherein at least one of the number of conductor traces conducts control signals from the first side of the slot to a component responsive to the control signal on the second side of the slot 14. The method of claim 11, wherein forming the slot comprises forming the slot using a laser and wet process etch. 15. The method of claim 11, wherein the method includes depositing a protective layer on a number of surfaces of the thinfilm layers. | 2,800 |
12,234 | 12,234 | 16,310,826 | 2,883 | A parallel optical fiber angled coupling component, which is used for parallel coupling of optical signal between the optical fiber array and the laser array, comprises an optical fiber positioning substrate, a cover plate and a plurality of optical fibers. The end face of the optical fiber is polished into a bevel with an inclination of 42.5° or 47.5°, and the bevel of the optical fiber is coated with a metal reflective film. This invention has the following beneficial effects: The end face of the optical fiber is polished into a bevel with an inclination of 42.5° or 47.5° to reduce inter-modal dispersion and increase the transmission distance of the optical signal in the subsequent optical fiber; the bevel of the optical fiber is coated with a metal reflective film, so as to ensure high reflectivity even if the bevel of the optical fiber is covered with glue. | 1. A parallel optical fiber angled coupling component for parallel coupling of optical signal between an optical fiber array and a laser array, comprising an optical fiber positioning substrate, a cover plate and a plurality of optical fibers;
characterized in that the optical fibers are pressed into a micro-groove array on the optical fiber positioning substrate with the cover plate and fixed with glue; the optical fibers protrude a certain length out of the optical fiber positioning substrate and cover plate. 2. A parallel optical fiber angled coupling component according to claim 1, characterized in that an end face of each of the optical fibers is polished into a bevel with an inclination angle of 42.5° approximately. 3. A parallel optical fiber angled coupling component according to claim 1, characterized in that an end face of each of the optical fibers is polished into a bevel with an inclination angle of 47.5° approximately. 4. A parallel optical fiber angled coupling component according to claim 1, characterized in that the bevel of each of the optical fibers is coated with a metal reflective film. 5. A method of parallel coupling optical signal between an optical fiber array and a laser array, providing an optical fiber positioning substrate, a cover plate and a plurality of optical fibers;
characterized in that the optical fibers are pressed into a micro-groove array on the optical fiber positioning substrate with the cover plate and fixed with glue; the optical fibers protrude a certain length out of the optical fiber positioning substrate and cover plate. 6. A method of parallel coupling optical signal between an optical fiber array and a laser array according to claim 5, characterized in that an end face of each of the optical fibers is polished into a bevel with an inclination angle of 42.5° approximately. 7. A method of parallel coupling optical signal between an optical fiber array and a laser array according to claim 5, characterized in that an end face of each of the optical fibers is polished into a bevel with an inclination angle of 47.5° approximately. 8. A method of parallel coupling optical signal between an optical fiber array and a laser array according to claim 5, characterized in that the bevel of each of the optical fibers is coated with a metal reflective film. | A parallel optical fiber angled coupling component, which is used for parallel coupling of optical signal between the optical fiber array and the laser array, comprises an optical fiber positioning substrate, a cover plate and a plurality of optical fibers. The end face of the optical fiber is polished into a bevel with an inclination of 42.5° or 47.5°, and the bevel of the optical fiber is coated with a metal reflective film. This invention has the following beneficial effects: The end face of the optical fiber is polished into a bevel with an inclination of 42.5° or 47.5° to reduce inter-modal dispersion and increase the transmission distance of the optical signal in the subsequent optical fiber; the bevel of the optical fiber is coated with a metal reflective film, so as to ensure high reflectivity even if the bevel of the optical fiber is covered with glue.1. A parallel optical fiber angled coupling component for parallel coupling of optical signal between an optical fiber array and a laser array, comprising an optical fiber positioning substrate, a cover plate and a plurality of optical fibers;
characterized in that the optical fibers are pressed into a micro-groove array on the optical fiber positioning substrate with the cover plate and fixed with glue; the optical fibers protrude a certain length out of the optical fiber positioning substrate and cover plate. 2. A parallel optical fiber angled coupling component according to claim 1, characterized in that an end face of each of the optical fibers is polished into a bevel with an inclination angle of 42.5° approximately. 3. A parallel optical fiber angled coupling component according to claim 1, characterized in that an end face of each of the optical fibers is polished into a bevel with an inclination angle of 47.5° approximately. 4. A parallel optical fiber angled coupling component according to claim 1, characterized in that the bevel of each of the optical fibers is coated with a metal reflective film. 5. A method of parallel coupling optical signal between an optical fiber array and a laser array, providing an optical fiber positioning substrate, a cover plate and a plurality of optical fibers;
characterized in that the optical fibers are pressed into a micro-groove array on the optical fiber positioning substrate with the cover plate and fixed with glue; the optical fibers protrude a certain length out of the optical fiber positioning substrate and cover plate. 6. A method of parallel coupling optical signal between an optical fiber array and a laser array according to claim 5, characterized in that an end face of each of the optical fibers is polished into a bevel with an inclination angle of 42.5° approximately. 7. A method of parallel coupling optical signal between an optical fiber array and a laser array according to claim 5, characterized in that an end face of each of the optical fibers is polished into a bevel with an inclination angle of 47.5° approximately. 8. A method of parallel coupling optical signal between an optical fiber array and a laser array according to claim 5, characterized in that the bevel of each of the optical fibers is coated with a metal reflective film. | 2,800 |
12,235 | 12,235 | 15,678,750 | 2,859 | A charge and discharge device for an electric vehicle includes a cable, a holder, and a cable suspending portion. The cable has a distal end at which a charge connector is provided. The charge connector is coupled to an electric vehicle to charge and discharge. The holder holds the charge connector. The cable suspending portion suspends and holds the cable. The holder and the cable suspending portion are disposed at a housing installed on a wall surface. The cable is extracted from the housing. The housing has a side portion at which a tapered surface as a surface facing obliquely ahead is disposed. The holder is mounted on the tapered surface. | 1. A charge and discharge device for an electric vehicle comprising:
a cable that has a distal end at which a charge connector is provided, the charge connector being coupled to an electric vehicle to charge and discharge; a holder that holds the charge connector; and a cable suspending portion that suspends acid holds the cable, wherein the holder and the cable suspending portion ate disposed at a housing installed on a wall surface, the cable being extracted from the housing, and the housing has a side portion at which a tapered surface as a surface facing obliquely ahead is disposed, and the holder being mourned on the tapered surface. 2. The charge and discharge device for the electric vehicle according to claim 1, wherein
the tapered surfaces are vertically formed at right and left side portions of the housing and formed from right and left end portions of a front surface of the housing, and the holder is mounted on any one of the tapered surfaces. 3. The charge and discharge device for the electric vehicle according to claim 2, wherein
the holder is mounted on a lower portion of the tapered surface, and while a part on which at least the holder of the tapered surface is mounted has a width equal to or larger than a width of the holder, an inclined surface facing obliquely upward is disposed at a front surface upper portion of the housing, and the housing has a forward projection that decreases toward an upper portion. | A charge and discharge device for an electric vehicle includes a cable, a holder, and a cable suspending portion. The cable has a distal end at which a charge connector is provided. The charge connector is coupled to an electric vehicle to charge and discharge. The holder holds the charge connector. The cable suspending portion suspends and holds the cable. The holder and the cable suspending portion are disposed at a housing installed on a wall surface. The cable is extracted from the housing. The housing has a side portion at which a tapered surface as a surface facing obliquely ahead is disposed. The holder is mounted on the tapered surface.1. A charge and discharge device for an electric vehicle comprising:
a cable that has a distal end at which a charge connector is provided, the charge connector being coupled to an electric vehicle to charge and discharge; a holder that holds the charge connector; and a cable suspending portion that suspends acid holds the cable, wherein the holder and the cable suspending portion ate disposed at a housing installed on a wall surface, the cable being extracted from the housing, and the housing has a side portion at which a tapered surface as a surface facing obliquely ahead is disposed, and the holder being mourned on the tapered surface. 2. The charge and discharge device for the electric vehicle according to claim 1, wherein
the tapered surfaces are vertically formed at right and left side portions of the housing and formed from right and left end portions of a front surface of the housing, and the holder is mounted on any one of the tapered surfaces. 3. The charge and discharge device for the electric vehicle according to claim 2, wherein
the holder is mounted on a lower portion of the tapered surface, and while a part on which at least the holder of the tapered surface is mounted has a width equal to or larger than a width of the holder, an inclined surface facing obliquely upward is disposed at a front surface upper portion of the housing, and the housing has a forward projection that decreases toward an upper portion. | 2,800 |
12,236 | 12,236 | 16,374,052 | 2,859 | A battery pack charger system includes a charger having one or more receptacles for charging one or more removable battery packs, where the charger is capable of being mounted to a rotating component of an engine. The battery pack charger system includes an alternator that is electrically coupled to the charger and that is mechanically coupled to the rotating component of the engine to generate and provide electrical power to the charger. An adapter bracket is mechanically coupled to the charger and the adapter bracket is configured to receive the alternator and to mechanically couple the alternator to the rotating component of the engine. | 1. A battery pack charger system comprising:
a charger having one or more receptacles for charging one or more removable battery packs, a mount for mounting the system to a rotating component of an engine. 2. The battery pack charger system, as recited in claim 1, further comprising:
an alternator that is electrically coupled to the charger and that is mechanically coupled to the rotating component of the engine to generate and provide electrical power to the charger. 3. The battery pack charger system, as recited in claim 2, further comprising:
an adapter bracket that is mechanically coupled to the charger, the adapter bracket is configured to receive the alternator and to mechanically couple the alternator to the rotating component of the engine. 4. The battery pack charger system, as recited in claim 3, wherein the adapter bracket is received in a flywheel of the engine. 5. The battery pack charger system, as recited in claim 1, wherein the rotating component of the engine includes a flywheel of a mower engine and the charger is mounted to the flywheel. 6. The battery pack charger system, as recited in claim 2, wherein the alternator is a brushless alternator. 7. A battery pack charger system comprising:
a charger having one or more receptacles for charging one or more removable battery packs; and a charger mounting bracket coupled to the charger, the charger mounting bracket mounting the charger to one or more engine shroud holes of an engine. 8. The battery pack charger system, as recited in claim 7, further including an alternator that is electrically connected to the charger and that is coupled to the charger mounting bracket, the alternator generating electrical power for delivery to the charger. 9. The battery pack charger system, as recited in claim 8, further including an adaptor bracket for receiving the alternator, where the adaptor bracket is received in a flywheel of an engine and imparts rotational motion from the flywheel to the alternator. 10. The battery pack charger system, as recited in claim 7, wherein the removable battery packs are lithium-ion battery packs for providing power to cordless devices. 11. The battery pack charger system, as recited in claim 7, wherein the charger mounting bracket includes one or more slots. 12. The battery pack charger system, as recited in claim 7, wherein the alternator includes a stator component and a rotor component, where the stator component is held stationary by the charger mounting bracket and the rotor component rotates with the adaptor bracket and the flywheel relative to the stator component. 13. The battery pack charger system, as recited in claim 7, further comprising a bracket and a charger seating bracket, where the bracket secures the charger to the charger seating bracket and the charger seating bracket secures the charger to the charger mounting bracket. 14. The battery pack charger system, as recited in claim 13, wherein the bracket includes one or more covers that are hingedly attached to the bracket to cover and protect the charger. 15. A battery pack charger system comprising:
a charger having one or more receptacles for charging one or more removable battery packs, a mount for mounting the system to a primary rotating element of a primary mover. 16. The battery pack charger system, as recited in claim 15, further comprising:
an alternator that is electrically coupled to the charger and that is mechanically coupled to the primary rotating element of the primary mover to generate and provide electrical power to the charger. 17. The battery pack charger system, as recited in claim 16, further comprising:
an adapter bracket that is mechanically coupled to the charger, the adapter bracket is configured to receive the alternator and to mechanically couple the alternator to the primary rotating element of the primary mover. 18. The battery pack charger system, as recited in claim 16, further comprising a bracket and a charger seating bracket, where the bracket secures the charger to the charger seating bracket and the charger seating bracket secures the charger to the mount. 19. The battery pack charger system, as recited in claim 18, wherein the bracket includes one or more covers that are hingedly attached to the bracket to cover and protect the charger. | A battery pack charger system includes a charger having one or more receptacles for charging one or more removable battery packs, where the charger is capable of being mounted to a rotating component of an engine. The battery pack charger system includes an alternator that is electrically coupled to the charger and that is mechanically coupled to the rotating component of the engine to generate and provide electrical power to the charger. An adapter bracket is mechanically coupled to the charger and the adapter bracket is configured to receive the alternator and to mechanically couple the alternator to the rotating component of the engine.1. A battery pack charger system comprising:
a charger having one or more receptacles for charging one or more removable battery packs, a mount for mounting the system to a rotating component of an engine. 2. The battery pack charger system, as recited in claim 1, further comprising:
an alternator that is electrically coupled to the charger and that is mechanically coupled to the rotating component of the engine to generate and provide electrical power to the charger. 3. The battery pack charger system, as recited in claim 2, further comprising:
an adapter bracket that is mechanically coupled to the charger, the adapter bracket is configured to receive the alternator and to mechanically couple the alternator to the rotating component of the engine. 4. The battery pack charger system, as recited in claim 3, wherein the adapter bracket is received in a flywheel of the engine. 5. The battery pack charger system, as recited in claim 1, wherein the rotating component of the engine includes a flywheel of a mower engine and the charger is mounted to the flywheel. 6. The battery pack charger system, as recited in claim 2, wherein the alternator is a brushless alternator. 7. A battery pack charger system comprising:
a charger having one or more receptacles for charging one or more removable battery packs; and a charger mounting bracket coupled to the charger, the charger mounting bracket mounting the charger to one or more engine shroud holes of an engine. 8. The battery pack charger system, as recited in claim 7, further including an alternator that is electrically connected to the charger and that is coupled to the charger mounting bracket, the alternator generating electrical power for delivery to the charger. 9. The battery pack charger system, as recited in claim 8, further including an adaptor bracket for receiving the alternator, where the adaptor bracket is received in a flywheel of an engine and imparts rotational motion from the flywheel to the alternator. 10. The battery pack charger system, as recited in claim 7, wherein the removable battery packs are lithium-ion battery packs for providing power to cordless devices. 11. The battery pack charger system, as recited in claim 7, wherein the charger mounting bracket includes one or more slots. 12. The battery pack charger system, as recited in claim 7, wherein the alternator includes a stator component and a rotor component, where the stator component is held stationary by the charger mounting bracket and the rotor component rotates with the adaptor bracket and the flywheel relative to the stator component. 13. The battery pack charger system, as recited in claim 7, further comprising a bracket and a charger seating bracket, where the bracket secures the charger to the charger seating bracket and the charger seating bracket secures the charger to the charger mounting bracket. 14. The battery pack charger system, as recited in claim 13, wherein the bracket includes one or more covers that are hingedly attached to the bracket to cover and protect the charger. 15. A battery pack charger system comprising:
a charger having one or more receptacles for charging one or more removable battery packs, a mount for mounting the system to a primary rotating element of a primary mover. 16. The battery pack charger system, as recited in claim 15, further comprising:
an alternator that is electrically coupled to the charger and that is mechanically coupled to the primary rotating element of the primary mover to generate and provide electrical power to the charger. 17. The battery pack charger system, as recited in claim 16, further comprising:
an adapter bracket that is mechanically coupled to the charger, the adapter bracket is configured to receive the alternator and to mechanically couple the alternator to the primary rotating element of the primary mover. 18. The battery pack charger system, as recited in claim 16, further comprising a bracket and a charger seating bracket, where the bracket secures the charger to the charger seating bracket and the charger seating bracket secures the charger to the mount. 19. The battery pack charger system, as recited in claim 18, wherein the bracket includes one or more covers that are hingedly attached to the bracket to cover and protect the charger. | 2,800 |
12,237 | 12,237 | 14,074,069 | 2,865 | One embodiment of the invention is directed to a method comprising receiving instruction data relating to a sample in a sample container. The method includes generating, by at least one processor using a workflow management layer, a process plan for the sample, and providing the process plan to a process control layer. The process plan comprises a plurality of possible routes. The method also comprises selecting, by the at least one processor using the process control layer, an optimized route within the plurality of possible routes in the process plan, and providing the optimized route to a middleware control layer. The at least one processor and middleware control layer are operable to cause a transport system to proceed along the selected route. | 1. A method comprising:
generating, by at least one processor using a workflow management layer, a process plan for a sample in a sample container; providing the process plan to a process control layer; determining, by the at least one processor using the process control layer, an optimized route consistent with the process plan; and processing the sample using the optimized route. 2. The method of claim 1 wherein the optimized route contains a plurality of different sample processing subsystems. 3. The method of claim 1 further comprising receiving instruction data through a laboratory information system and providing the instruction data to the workflow management layer, wherein the workflow management layer comprises at least two sublayers. 4. The method of claim 1 wherein the optimized route contains a plurality of different sample processing subsystems, the different sample processing subsystems selected from the group consisting of an analyzer, an aliquotter, a robot, an input station, an output station, a decapper, a recapper, a gripper unit, a tube inspection unit (TIU), an LLD, and a centrifuge. 5. The method of claim 1, further comprising:
providing, by the process control layer, at least a portion of the optimized route to a middle control layer, wherein the at least one processor and middle control layer are operable to cause the sample to be processed by subsystems specified in the optimized route; and providing, by the processor and the middle control layer, device commands to a device control layer. 6. The method of claim 1 further comprising:
receiving, by the workflow management layer, information from one or more analyzers, which is used to generate the process plan. 7. A computer apparatus comprising:
at least one processor; and a memory device storing a plurality of software components, executable by the at least one processor, the plurality of software components comprising: a workflow management layer operable to generate a process plan comprising a plurality of routes; and a processor control layer operable to select an optimized route in the plurality of routes. 8. The computer apparatus of claim 7 further comprising
a device control layer; and
a middle control layer operable to receive the optimized route from the process control layer and provide commands to the device control layer. 9. The computer apparatus of claim 7 wherein the process control layer is operable to receive sample container data from the middle control layer. 10. A system comprising:
a plurality of sample processing subsystems; and a computer apparatus comprising at least one processor, and a memory device storing a plurality of software components, executable by the at least one processor, the plurality of software components comprising a workflow management layer operable to generate a process plan, and a processor control layer operable to select an optimized route using the process plan. 11. The system according to claim 10 further comprising:
a middle control layer operable to receive at least a portion of the optimized route from the process control layer and provide commands to a device control layer. 12. An automated sample processing system comprising:
a workflow management controller comprising a first processor, and a first computer readable medium comprising a workflow management layer; and an LAS controller coupled to the workflow management controller and being part of a laboratory automation system, the LAS controller comprising a second processor, and a second computer readable medium comprising a process control layer and a middle control layer. 13. The automated sample processing system of claim 12 wherein the LAS controller is a first LAS controller and the laboratory automation system is a first laboratory automation system, and wherein the automated sample processing system comprises a second LAS controller associated with a second laboratory automation system coupled to the workflow management controller. 14. The automated sample processing system of claim 12 wherein the LAS controller and the workflow management controller are configured to operate independently of each other. 15. A method comprising:
providing, by a workflow management controller comprising a first processor, and a first computer readable medium comprising a workflow management layer, instruction data for a sample to be processed to an LAS controller coupled to the workflow management controller, the LAS controller and being part of a laboratory automation system, and comprising a second processor, and a second computer readable medium comprising a process control layer and a middle control layer; and executing, by the LAS controller, the instruction data. 16. The method of claim 15 wherein the instruction data comprises a process plan for the sample to be processed. 17. The method of claim 16 wherein the process plan specifies one or more tests to be run on the sample. 18. The method of claim 16 wherein the LAS controller is a first LAS controller, the laboratory automation system is a first laboratory automation system, the instruction data is first instruction data, and wherein the method further comprises:
providing, by the workflow management controller second instruction data for a sample to be processed to a second LAS controller coupled to the workflow management controller, the second LAS controller and being part of a second laboratory automation system, and comprising a third processor, and a third computer readable medium comprising a third process control layer and a third middle control layer; and
executing, by the second LAS controller, the second instruction data. 19. The method of claim 18 wherein the first and second LAS controllers operate independently of each other. 20. A method comprising:
providing by at least one processor using a process control layer, a route leg to a middle control layer; generating, by the at least one processor and the middle control layer, instructions to control the operation of a subsystem of the route leg or a subassembly container of the route leg, wherein the subassembly container controls multiple subassemblies associated with the subassembly container; and executing the instructions by a device control layer. 21. The method of claim 20 wherein the route leg is part of an optimized route, generated by the process control layer. 22. The method of claim 20 wherein the subassembly container operates independently of the process control layer to control the multiple subassemblies. 23. The method of claim 20 wherein the multiple subassemblies comprise parts of two or more different subsystems. 24. A system comprising:
a computer apparatus comprising at least one processor, and a memory device storing a plurality of software components, executable by the at least one processor, the plurality of software components comprising a process control layer configured to provide using the at least one processor a route leg to a middle control layer, a middle control layer configured to generate using the at least one processor, instructions to control the operation of a subsystem of the route leg or a subassembly container of the route leg, wherein the subassembly container controls multiple subassemblies associated with the subassembly container, and a device control layer configured to execute the instructions using the at least one processor. 25. The system of claim 24 further comprising:
the multiple subassemblies. 26. The system of claim 24 wherein the system is a laboratory automation system. 27. The system of claim 24 wherein the memory device stores the process control layer. 28. The system of claim 24 wherein the subassembly container operates independently of other subassembly containers. 29. The system of claim 24 wherein the multiple subassemblies comprise parts of two or more different subsystems. 30. A method comprising:
generating, by at least one processor using a workflow manager, a process plan for a sample in a sample container; providing the process plan to an instrument manager; determining, by the at least one processor using the instrument manager, an optimized route consistent with the process plan using the process control layer; and
processing the sample using the optimized route. 31. A computer apparatus comprising:
at least one processor; and a memory device storing a plurality of software components, executable by the at least one processor, the plurality of software components comprising: a workflow manager operable to generate a process plan comprising a plurality of routes; and an instrument manager operable to select an optimized route in the plurality of routes. | One embodiment of the invention is directed to a method comprising receiving instruction data relating to a sample in a sample container. The method includes generating, by at least one processor using a workflow management layer, a process plan for the sample, and providing the process plan to a process control layer. The process plan comprises a plurality of possible routes. The method also comprises selecting, by the at least one processor using the process control layer, an optimized route within the plurality of possible routes in the process plan, and providing the optimized route to a middleware control layer. The at least one processor and middleware control layer are operable to cause a transport system to proceed along the selected route.1. A method comprising:
generating, by at least one processor using a workflow management layer, a process plan for a sample in a sample container; providing the process plan to a process control layer; determining, by the at least one processor using the process control layer, an optimized route consistent with the process plan; and processing the sample using the optimized route. 2. The method of claim 1 wherein the optimized route contains a plurality of different sample processing subsystems. 3. The method of claim 1 further comprising receiving instruction data through a laboratory information system and providing the instruction data to the workflow management layer, wherein the workflow management layer comprises at least two sublayers. 4. The method of claim 1 wherein the optimized route contains a plurality of different sample processing subsystems, the different sample processing subsystems selected from the group consisting of an analyzer, an aliquotter, a robot, an input station, an output station, a decapper, a recapper, a gripper unit, a tube inspection unit (TIU), an LLD, and a centrifuge. 5. The method of claim 1, further comprising:
providing, by the process control layer, at least a portion of the optimized route to a middle control layer, wherein the at least one processor and middle control layer are operable to cause the sample to be processed by subsystems specified in the optimized route; and providing, by the processor and the middle control layer, device commands to a device control layer. 6. The method of claim 1 further comprising:
receiving, by the workflow management layer, information from one or more analyzers, which is used to generate the process plan. 7. A computer apparatus comprising:
at least one processor; and a memory device storing a plurality of software components, executable by the at least one processor, the plurality of software components comprising: a workflow management layer operable to generate a process plan comprising a plurality of routes; and a processor control layer operable to select an optimized route in the plurality of routes. 8. The computer apparatus of claim 7 further comprising
a device control layer; and
a middle control layer operable to receive the optimized route from the process control layer and provide commands to the device control layer. 9. The computer apparatus of claim 7 wherein the process control layer is operable to receive sample container data from the middle control layer. 10. A system comprising:
a plurality of sample processing subsystems; and a computer apparatus comprising at least one processor, and a memory device storing a plurality of software components, executable by the at least one processor, the plurality of software components comprising a workflow management layer operable to generate a process plan, and a processor control layer operable to select an optimized route using the process plan. 11. The system according to claim 10 further comprising:
a middle control layer operable to receive at least a portion of the optimized route from the process control layer and provide commands to a device control layer. 12. An automated sample processing system comprising:
a workflow management controller comprising a first processor, and a first computer readable medium comprising a workflow management layer; and an LAS controller coupled to the workflow management controller and being part of a laboratory automation system, the LAS controller comprising a second processor, and a second computer readable medium comprising a process control layer and a middle control layer. 13. The automated sample processing system of claim 12 wherein the LAS controller is a first LAS controller and the laboratory automation system is a first laboratory automation system, and wherein the automated sample processing system comprises a second LAS controller associated with a second laboratory automation system coupled to the workflow management controller. 14. The automated sample processing system of claim 12 wherein the LAS controller and the workflow management controller are configured to operate independently of each other. 15. A method comprising:
providing, by a workflow management controller comprising a first processor, and a first computer readable medium comprising a workflow management layer, instruction data for a sample to be processed to an LAS controller coupled to the workflow management controller, the LAS controller and being part of a laboratory automation system, and comprising a second processor, and a second computer readable medium comprising a process control layer and a middle control layer; and executing, by the LAS controller, the instruction data. 16. The method of claim 15 wherein the instruction data comprises a process plan for the sample to be processed. 17. The method of claim 16 wherein the process plan specifies one or more tests to be run on the sample. 18. The method of claim 16 wherein the LAS controller is a first LAS controller, the laboratory automation system is a first laboratory automation system, the instruction data is first instruction data, and wherein the method further comprises:
providing, by the workflow management controller second instruction data for a sample to be processed to a second LAS controller coupled to the workflow management controller, the second LAS controller and being part of a second laboratory automation system, and comprising a third processor, and a third computer readable medium comprising a third process control layer and a third middle control layer; and
executing, by the second LAS controller, the second instruction data. 19. The method of claim 18 wherein the first and second LAS controllers operate independently of each other. 20. A method comprising:
providing by at least one processor using a process control layer, a route leg to a middle control layer; generating, by the at least one processor and the middle control layer, instructions to control the operation of a subsystem of the route leg or a subassembly container of the route leg, wherein the subassembly container controls multiple subassemblies associated with the subassembly container; and executing the instructions by a device control layer. 21. The method of claim 20 wherein the route leg is part of an optimized route, generated by the process control layer. 22. The method of claim 20 wherein the subassembly container operates independently of the process control layer to control the multiple subassemblies. 23. The method of claim 20 wherein the multiple subassemblies comprise parts of two or more different subsystems. 24. A system comprising:
a computer apparatus comprising at least one processor, and a memory device storing a plurality of software components, executable by the at least one processor, the plurality of software components comprising a process control layer configured to provide using the at least one processor a route leg to a middle control layer, a middle control layer configured to generate using the at least one processor, instructions to control the operation of a subsystem of the route leg or a subassembly container of the route leg, wherein the subassembly container controls multiple subassemblies associated with the subassembly container, and a device control layer configured to execute the instructions using the at least one processor. 25. The system of claim 24 further comprising:
the multiple subassemblies. 26. The system of claim 24 wherein the system is a laboratory automation system. 27. The system of claim 24 wherein the memory device stores the process control layer. 28. The system of claim 24 wherein the subassembly container operates independently of other subassembly containers. 29. The system of claim 24 wherein the multiple subassemblies comprise parts of two or more different subsystems. 30. A method comprising:
generating, by at least one processor using a workflow manager, a process plan for a sample in a sample container; providing the process plan to an instrument manager; determining, by the at least one processor using the instrument manager, an optimized route consistent with the process plan using the process control layer; and
processing the sample using the optimized route. 31. A computer apparatus comprising:
at least one processor; and a memory device storing a plurality of software components, executable by the at least one processor, the plurality of software components comprising: a workflow manager operable to generate a process plan comprising a plurality of routes; and an instrument manager operable to select an optimized route in the plurality of routes. | 2,800 |
12,238 | 12,238 | 15,711,151 | 2,846 | A power supply apparatus for an aerospace actuator includes motor drive electronics for actuation of a motor for control of the aerospace actuator, and an energy storage device. The motor drive electronics are configured to receive input electrical energy from an aircraft power grid, receive electrical energy from the energy storage device and provide electrical energy from the grid and/or from the energy storage device to the motor. The energy storage device is configured to store at least one of: excess electrical energy supplied to the motor drive electronics from the grid and regenerated electrical energy from the motor drive electronics. The energy storage device is configured to discharge the stored energy as electrical energy to the motor drive electronics when required. | 1. A power supply apparatus for an aerospace actuator, comprising:
motor drive electronics for actuation of a motor for control of the aerospace actuator; and an energy storage device; wherein the motor drive electronics are configured to:
receive input electrical energy from an aircraft power grid;
receive electrical energy from the energy storage device; and
provide electrical energy from the grid and/or from the energy storage device to the motor; and
wherein the energy storage device is configured to store at least one of:
excess electrical energy supplied to the motor drive electronics from the grid; and
regenerated electrical energy from the motor drive electronics; and
wherein the energy storage device is configured to discharge the stored energy as electrical energy to the motor drive electronics when required. 2. A power supply apparatus as claimed in claim 1, wherein the energy storage device comprises a battery. 3. A power supply apparatus as claimed in claim 2, wherein the battery comprises a lithium ion battery. 4. A power supply apparatus as claimed in claim 1, wherein the energy storage device comprises a supercapacitor. 5. A power supply apparatus as claimed in claim 1, comprising a bi-directional power converter for controlling the flow of power between the motor drive electronics and the energy storage device. 6. A power supply apparatus as claimed in claim 1, configured such that motor drive electronics can: (i) receive input electrical energy from the aircraft power grid at the same time as receiving electrical energy from the energy storage device, (ii) receive input electrical energy only from the aircraft power grid, or (iii) receive input electrical energy only from the energy storage device. 7. An aircraft comprising:
at least one actuator; and a power supply apparatus as claimed in claim 1, for supplying power to the actuator. 8. An aircraft as claimed in claim 7, comprising multiple actuators with each actuator having associated motor drive electronics and an energy storage device being connected with each of the motor drive electronics. 9. A method for supplying power to an aerospace actuator of an aircraft using a power supply apparatus comprising motor drive electronics and an energy storage device; the method comprising:
receiving input electrical energy from a grid at the motor drive electronics; storing in the energy storage device at least one of:
excess electrical energy supplied to the motor drive electronics from the grid; and
regenerated electrical energy from the motor drive electronics;
discharging electrical energy from the energy storage device to the motor drive electronics when required; and
using the motor drive electronics to provide electrical energy from the grid and/or from the energy storage device to a motor for control of the aerospace actuator. 10. A method as claimed in claim 9, further comprising:
using a power supply that includes:
motor drive electronics for actuation of a motor for control of the aerospace actuator; and
an energy storage device;
wherein the motor drive electronics are configured to:
receive input electrical energy from an aircraft power grid;
receive electrical energy from the energy storage device; and
provide electrical energy from the grid and/or from the energy storage device to the motor; and
wherein the energy storage device is configured to store at least one of:
excess electrical energy supplied to the motor drive electronics from the grid; and
regenerated electrical energy from the motor drive electronics; and
wherein the energy storage device is configured to discharge the stored energy as electrical energy to the motor drive electronics when required. 11. A method as claimed in claim 9, further comprising preventing discharged energy from the energy storage device from leaking into the grid. 12. A method as claimed in claim 9, wherein the energy supplied by the energy storage device to the motor for control of the aerospace actuator is in addition to or in excess of energy already supplied by the grid. 13. A method as claimed in claim 12, wherein the energy supplied by the energy storage device to the motor for control of the aerospace actuator is in addition to energy regenerated in the motor drive electronics. 14. A method as claimed in claim 12, comprising using the energy storage device to provide higher peak power levels to the aircraft actuator than the power levels that are possible without the energy storage device. | A power supply apparatus for an aerospace actuator includes motor drive electronics for actuation of a motor for control of the aerospace actuator, and an energy storage device. The motor drive electronics are configured to receive input electrical energy from an aircraft power grid, receive electrical energy from the energy storage device and provide electrical energy from the grid and/or from the energy storage device to the motor. The energy storage device is configured to store at least one of: excess electrical energy supplied to the motor drive electronics from the grid and regenerated electrical energy from the motor drive electronics. The energy storage device is configured to discharge the stored energy as electrical energy to the motor drive electronics when required.1. A power supply apparatus for an aerospace actuator, comprising:
motor drive electronics for actuation of a motor for control of the aerospace actuator; and an energy storage device; wherein the motor drive electronics are configured to:
receive input electrical energy from an aircraft power grid;
receive electrical energy from the energy storage device; and
provide electrical energy from the grid and/or from the energy storage device to the motor; and
wherein the energy storage device is configured to store at least one of:
excess electrical energy supplied to the motor drive electronics from the grid; and
regenerated electrical energy from the motor drive electronics; and
wherein the energy storage device is configured to discharge the stored energy as electrical energy to the motor drive electronics when required. 2. A power supply apparatus as claimed in claim 1, wherein the energy storage device comprises a battery. 3. A power supply apparatus as claimed in claim 2, wherein the battery comprises a lithium ion battery. 4. A power supply apparatus as claimed in claim 1, wherein the energy storage device comprises a supercapacitor. 5. A power supply apparatus as claimed in claim 1, comprising a bi-directional power converter for controlling the flow of power between the motor drive electronics and the energy storage device. 6. A power supply apparatus as claimed in claim 1, configured such that motor drive electronics can: (i) receive input electrical energy from the aircraft power grid at the same time as receiving electrical energy from the energy storage device, (ii) receive input electrical energy only from the aircraft power grid, or (iii) receive input electrical energy only from the energy storage device. 7. An aircraft comprising:
at least one actuator; and a power supply apparatus as claimed in claim 1, for supplying power to the actuator. 8. An aircraft as claimed in claim 7, comprising multiple actuators with each actuator having associated motor drive electronics and an energy storage device being connected with each of the motor drive electronics. 9. A method for supplying power to an aerospace actuator of an aircraft using a power supply apparatus comprising motor drive electronics and an energy storage device; the method comprising:
receiving input electrical energy from a grid at the motor drive electronics; storing in the energy storage device at least one of:
excess electrical energy supplied to the motor drive electronics from the grid; and
regenerated electrical energy from the motor drive electronics;
discharging electrical energy from the energy storage device to the motor drive electronics when required; and
using the motor drive electronics to provide electrical energy from the grid and/or from the energy storage device to a motor for control of the aerospace actuator. 10. A method as claimed in claim 9, further comprising:
using a power supply that includes:
motor drive electronics for actuation of a motor for control of the aerospace actuator; and
an energy storage device;
wherein the motor drive electronics are configured to:
receive input electrical energy from an aircraft power grid;
receive electrical energy from the energy storage device; and
provide electrical energy from the grid and/or from the energy storage device to the motor; and
wherein the energy storage device is configured to store at least one of:
excess electrical energy supplied to the motor drive electronics from the grid; and
regenerated electrical energy from the motor drive electronics; and
wherein the energy storage device is configured to discharge the stored energy as electrical energy to the motor drive electronics when required. 11. A method as claimed in claim 9, further comprising preventing discharged energy from the energy storage device from leaking into the grid. 12. A method as claimed in claim 9, wherein the energy supplied by the energy storage device to the motor for control of the aerospace actuator is in addition to or in excess of energy already supplied by the grid. 13. A method as claimed in claim 12, wherein the energy supplied by the energy storage device to the motor for control of the aerospace actuator is in addition to energy regenerated in the motor drive electronics. 14. A method as claimed in claim 12, comprising using the energy storage device to provide higher peak power levels to the aircraft actuator than the power levels that are possible without the energy storage device. | 2,800 |
12,239 | 12,239 | 15,859,325 | 2,894 | Embodiments of the disclosure are in the field of advanced integrated circuit structure fabrication and, in particular, 10 nanometer node and smaller integrated circuit structure fabrication and the resulting structures. In an example, an integrated circuit structure includes a fin comprising silicon, the fin having a lower fin portion and an upper fin portion. A gate electrode is over the upper fin portion of the fin, the gate electrode having a first side opposite a second side. A first epitaxial source or drain structure is embedded in the fin at the first side of the gate electrode. A second epitaxial source or drain structure is embedded in the fin at the second side of the gate electrode, the first and second epitaxial source or drain structures comprising silicon and germanium and having a match-stick profile. | 1. An integrated circuit structure, comprising:
a fin comprising silicon, the fin having a lower fin portion and an upper fin portion; a gate electrode over the upper fin portion of the fin, the gate electrode having a first side opposite a second side; a first epitaxial source or drain structure embedded in the fin at the first side of the gate electrode; and a second epitaxial source or drain structure embedded in the fin at the second side of the gate electrode, the first and second epitaxial source or drain structures comprising silicon and germanium and having a match-stick profile. 2. The integrated circuit structure of claim 1, wherein the first and second epitaxial source or drain structures are weakly faceted. 3. The integrated circuit structure of claim 1, wherein the first and second epitaxial source or drain structures each have a height of approximately 50 nanometers and each have a width in the range of 30-35 nanometers. 4. The integrated circuit structure of claim 1, wherein the first and second epitaxial source or drain structures are graded with an approximately 20% germanium concentration at a bottom of the first and second epitaxial source or drain structures to an approximately 45% germanium concentration at a top of the first and second epitaxial source or drain structures. 5. The integrated circuit structure of claim 1, wherein the first and second epitaxial source or drain structures are doped with boron atoms. 6. The integrated circuit structure of claim 1, further comprising:
a first dielectric spacer along sidewalls of a portion of the fin at the first side of the gate structure; and a second dielectric spacer along sidewalls of a portion of the fin at the second side of the gate structure. 7. The integrated circuit structure of claim 6, wherein the first dielectric spacer is further along a lower portion of sidewalls of the first epitaxial source or drain structure, and wherein the second dielectric spacer is further along a lower portion of sidewalls of the second epitaxial source or drain structure. 8. The integrated circuit structure of claim 1, further comprising:
a first conductive electrode on the first epitaxial source or drain structure; and a second conductive electrode on the second epitaxial source or drain structure. 9. A method of fabricating an integrated circuit structure, the method comprising:
forming a fin comprising silicon, the fin having a lower fin portion and an upper fin portion; forming a gate electrode over the upper fin portion of the fin, the gate electrode having a first side opposite a second side; recessing the fin at the first side of the gate electrode and at the second side of the gate electrode; forming a first epitaxial source or drain structure on a first portion of the recessed fin at the first side of the gate electrode; and forming a second epitaxial source or drain structure on a second portion of the recessed fin at the second side of the gate electrode, the first and second epitaxial source or drain structures comprising silicon and germanium and having a match-stick profile. 10. The method of claim 9, further comprising:
forming a first dielectric spacer along sidewalls of a portion of the fin at the first side of the gate structure; and forming a second dielectric spacer along sidewalls of a portion of the fin at the second side of the gate structure. 11. The method of claim 10, wherein recessing the fin at the first side of the gate electrode and at the second side of the gate electrode comprises recessing the fin below a top surface of the first and second dielectric spacers, wherein the first dielectric spacer is further along a lower portion of sidewalls of the first epitaxial source or drain structure, and wherein the second dielectric spacer is further along a lower portion of sidewalls of the second epitaxial source or drain structure. 12. The method of claim 9, further comprising:
forming a first conductive electrode on the first epitaxial source or drain structure; and forming a second conductive electrode on the second epitaxial source or drain structure. 13. An integrated circuit structure, comprising:
a P-type semiconductor device, comprising: a first fin comprising silicon, the first fin having a lower fin portion and an upper fin portion; a first gate electrode over the upper fin portion of the first fin, the first gate electrode having a first side opposite a second side; a first epitaxial source or drain structure embedded in the first fin at the first side of the first gate electrode; and a second epitaxial source or drain structure embedded in the first fin at the second side of the first gate electrode, the first and second epitaxial source or drain structures comprising silicon and germanium and having a profile; and
an N-type semiconductor device, comprising:
a second fin comprising silicon, the second fin having a lower fin portion and an upper fin portion;
a second gate electrode over the upper fin portion of the second fin, the second gate electrode having a first side opposite a second side;
a third epitaxial source or drain structure embedded in the second fin at the first side of the second gate electrode; and
a fourth epitaxial source or drain structure embedded in the second fin at the second side of the second gate electrode, the third and fourth epitaxial source or drain structures comprising silicon and having substantially the same profile as the profile of the first and second epitaxial source or drain structures. 14. The integrated circuit structure of claim 13, wherein the first and second epitaxial source or drain structures are weakly faceted. 15. The integrated circuit structure of claim 13, wherein the first and second epitaxial source or drain structures each have a height of approximately 50 nanometers and each have a width in the range of 30-35 nanometers, and wherein the third and fourth epitaxial source or drain structures each have a height of approximately 50 nanometers and each have a width in the range of 30-35 nanometers. 16. The integrated circuit structure of claim 13, wherein the first and second epitaxial source or drain structures are graded with an approximately 20% germanium concentration at a bottom of the first and second epitaxial source or drain structures to an approximately 45% germanium concentration at a top of the first and second epitaxial source or drain structures. 17. The integrated circuit structure of claim 13, wherein the first and second epitaxial source or drain structures are doped with boron atoms, and wherein the third and fourth epitaxial source or drain structures are doped with phosphorous atoms or arsenic atoms. 18. The integrated circuit structure of claim 13, further comprising:
a first dielectric spacer along sidewalls of a portion of the first fin at the first side of the first gate structure; a second dielectric spacer along sidewalls of a portion of the first fin at the second side of the first gate structure; a third dielectric spacer along sidewalls of a portion of the second fin at the first side of the second gate structure; and a fourth dielectric spacer along sidewalls of a portion of the second fin at the second side of the second gate structure. 19. The integrated circuit structure of claim 18, wherein the first dielectric spacer is further along a lower portion of sidewalls of the first epitaxial source or drain structure, wherein the second dielectric spacer is further along a lower portion of sidewalls of the second epitaxial source or drain structure, wherein the third dielectric spacer is further along a lower portion of sidewalls of the third epitaxial source or drain structure, and wherein the fourth dielectric spacer is further along a lower portion of sidewalls of the fourth epitaxial source or drain structure. 20. The integrated circuit structure of claim 13, further comprising:
a first conductive electrode on the first epitaxial source or drain structure; a second conductive electrode on the second epitaxial source or drain structure; a third conductive electrode on the third epitaxial source or drain structure; and a fourth conductive electrode on the fourth epitaxial source or drain structure. | Embodiments of the disclosure are in the field of advanced integrated circuit structure fabrication and, in particular, 10 nanometer node and smaller integrated circuit structure fabrication and the resulting structures. In an example, an integrated circuit structure includes a fin comprising silicon, the fin having a lower fin portion and an upper fin portion. A gate electrode is over the upper fin portion of the fin, the gate electrode having a first side opposite a second side. A first epitaxial source or drain structure is embedded in the fin at the first side of the gate electrode. A second epitaxial source or drain structure is embedded in the fin at the second side of the gate electrode, the first and second epitaxial source or drain structures comprising silicon and germanium and having a match-stick profile.1. An integrated circuit structure, comprising:
a fin comprising silicon, the fin having a lower fin portion and an upper fin portion; a gate electrode over the upper fin portion of the fin, the gate electrode having a first side opposite a second side; a first epitaxial source or drain structure embedded in the fin at the first side of the gate electrode; and a second epitaxial source or drain structure embedded in the fin at the second side of the gate electrode, the first and second epitaxial source or drain structures comprising silicon and germanium and having a match-stick profile. 2. The integrated circuit structure of claim 1, wherein the first and second epitaxial source or drain structures are weakly faceted. 3. The integrated circuit structure of claim 1, wherein the first and second epitaxial source or drain structures each have a height of approximately 50 nanometers and each have a width in the range of 30-35 nanometers. 4. The integrated circuit structure of claim 1, wherein the first and second epitaxial source or drain structures are graded with an approximately 20% germanium concentration at a bottom of the first and second epitaxial source or drain structures to an approximately 45% germanium concentration at a top of the first and second epitaxial source or drain structures. 5. The integrated circuit structure of claim 1, wherein the first and second epitaxial source or drain structures are doped with boron atoms. 6. The integrated circuit structure of claim 1, further comprising:
a first dielectric spacer along sidewalls of a portion of the fin at the first side of the gate structure; and a second dielectric spacer along sidewalls of a portion of the fin at the second side of the gate structure. 7. The integrated circuit structure of claim 6, wherein the first dielectric spacer is further along a lower portion of sidewalls of the first epitaxial source or drain structure, and wherein the second dielectric spacer is further along a lower portion of sidewalls of the second epitaxial source or drain structure. 8. The integrated circuit structure of claim 1, further comprising:
a first conductive electrode on the first epitaxial source or drain structure; and a second conductive electrode on the second epitaxial source or drain structure. 9. A method of fabricating an integrated circuit structure, the method comprising:
forming a fin comprising silicon, the fin having a lower fin portion and an upper fin portion; forming a gate electrode over the upper fin portion of the fin, the gate electrode having a first side opposite a second side; recessing the fin at the first side of the gate electrode and at the second side of the gate electrode; forming a first epitaxial source or drain structure on a first portion of the recessed fin at the first side of the gate electrode; and forming a second epitaxial source or drain structure on a second portion of the recessed fin at the second side of the gate electrode, the first and second epitaxial source or drain structures comprising silicon and germanium and having a match-stick profile. 10. The method of claim 9, further comprising:
forming a first dielectric spacer along sidewalls of a portion of the fin at the first side of the gate structure; and forming a second dielectric spacer along sidewalls of a portion of the fin at the second side of the gate structure. 11. The method of claim 10, wherein recessing the fin at the first side of the gate electrode and at the second side of the gate electrode comprises recessing the fin below a top surface of the first and second dielectric spacers, wherein the first dielectric spacer is further along a lower portion of sidewalls of the first epitaxial source or drain structure, and wherein the second dielectric spacer is further along a lower portion of sidewalls of the second epitaxial source or drain structure. 12. The method of claim 9, further comprising:
forming a first conductive electrode on the first epitaxial source or drain structure; and forming a second conductive electrode on the second epitaxial source or drain structure. 13. An integrated circuit structure, comprising:
a P-type semiconductor device, comprising: a first fin comprising silicon, the first fin having a lower fin portion and an upper fin portion; a first gate electrode over the upper fin portion of the first fin, the first gate electrode having a first side opposite a second side; a first epitaxial source or drain structure embedded in the first fin at the first side of the first gate electrode; and a second epitaxial source or drain structure embedded in the first fin at the second side of the first gate electrode, the first and second epitaxial source or drain structures comprising silicon and germanium and having a profile; and
an N-type semiconductor device, comprising:
a second fin comprising silicon, the second fin having a lower fin portion and an upper fin portion;
a second gate electrode over the upper fin portion of the second fin, the second gate electrode having a first side opposite a second side;
a third epitaxial source or drain structure embedded in the second fin at the first side of the second gate electrode; and
a fourth epitaxial source or drain structure embedded in the second fin at the second side of the second gate electrode, the third and fourth epitaxial source or drain structures comprising silicon and having substantially the same profile as the profile of the first and second epitaxial source or drain structures. 14. The integrated circuit structure of claim 13, wherein the first and second epitaxial source or drain structures are weakly faceted. 15. The integrated circuit structure of claim 13, wherein the first and second epitaxial source or drain structures each have a height of approximately 50 nanometers and each have a width in the range of 30-35 nanometers, and wherein the third and fourth epitaxial source or drain structures each have a height of approximately 50 nanometers and each have a width in the range of 30-35 nanometers. 16. The integrated circuit structure of claim 13, wherein the first and second epitaxial source or drain structures are graded with an approximately 20% germanium concentration at a bottom of the first and second epitaxial source or drain structures to an approximately 45% germanium concentration at a top of the first and second epitaxial source or drain structures. 17. The integrated circuit structure of claim 13, wherein the first and second epitaxial source or drain structures are doped with boron atoms, and wherein the third and fourth epitaxial source or drain structures are doped with phosphorous atoms or arsenic atoms. 18. The integrated circuit structure of claim 13, further comprising:
a first dielectric spacer along sidewalls of a portion of the first fin at the first side of the first gate structure; a second dielectric spacer along sidewalls of a portion of the first fin at the second side of the first gate structure; a third dielectric spacer along sidewalls of a portion of the second fin at the first side of the second gate structure; and a fourth dielectric spacer along sidewalls of a portion of the second fin at the second side of the second gate structure. 19. The integrated circuit structure of claim 18, wherein the first dielectric spacer is further along a lower portion of sidewalls of the first epitaxial source or drain structure, wherein the second dielectric spacer is further along a lower portion of sidewalls of the second epitaxial source or drain structure, wherein the third dielectric spacer is further along a lower portion of sidewalls of the third epitaxial source or drain structure, and wherein the fourth dielectric spacer is further along a lower portion of sidewalls of the fourth epitaxial source or drain structure. 20. The integrated circuit structure of claim 13, further comprising:
a first conductive electrode on the first epitaxial source or drain structure; a second conductive electrode on the second epitaxial source or drain structure; a third conductive electrode on the third epitaxial source or drain structure; and a fourth conductive electrode on the fourth epitaxial source or drain structure. | 2,800 |
12,240 | 12,240 | 15,594,948 | 2,862 | An apparatus and method for receiving and processing weather data and flight plan data is disclosed. The apparatus includes a first display, an input unit, and a processor. The processor is configured to receive flight plan data and weather data, and to determine, based on the weather data, which weather characteristics is located within a predetermined range of a predetermined flight altitude value. The processor is further configured to instruct the first display to display those weather data which are located within the predetermined range above and below the input flight altitude value together with the flight plan data, and to instruct the first display to additionally display at least one element of the group consisting of the elements: strategic information weather, uplink weather, weather information from external weather data provider, onboard weather radar information, notice to airmen, aeronautical information service data, terminal area forecast, air-traffic related information. | 1. A display device for receiving and processing weather data and flight plan data, comprising:
a first display, configured to display weather data and flight plan data; an input unit, configured to receive an input value from an operator, wherein the input value is a flight altitude value; a processor, configured to: receive flight plan data containing at least a moving path of an aircraft; receive weather data containing at least positional information and weather characteristics belonging to said positional information; determine, based on the positional information of the weather data, which weather characteristics is located within a predetermined range of the input flight altitude value; instruct the first display to display those weather data which are located within the predetermined range above and below the input flight altitude value together with the flight plan data; instruct the first display to additionally display at least one element of the group consisting of the elements: strategic information weather, uplink weather, weather information from external weather data provider, onboard weather radar information, notice to airmen, aeronautical information service data, terminal area forecast, air-traffic related information. 2. The display device of claim 1,
wherein the processor is configured to instruct the first display to display a combination of at least two elements of the group consisting of the elements: strategic information weather, uplink weather, weather information from external weather data provider, onboard weather radar information, notice to airmen, aeronautical information service data, terminal area forecast, air-traffic related information. 3. The display device of claim 1,
wherein the processor is configured to determine continuous areas and to instruct the first display to display the information based on these continuous areas. 4. The display device of claim 3,
wherein the processor is configured to define the continuous areas by at least one of vector shape, raster data, lines, symbols, text. 5. The display device of claim 4,
wherein the processor is configured to define the continuous areas by a combination of at least two of vector shape, raster data, lines, symbols, text. 6. The display device of claim 1,
wherein the weather data contain positional information of weather characteristics, wherein the positional information contains at least one of a position, expansion, moving direction of a region having a specific and/or substantially homogeneous weather condition. 7. The display device of claim 1,
wherein the weather characteristics relate to at least one or a combination of temperature, wind, wind direction, wind speed. 8. The display device of claim 1,
wherein the predetermined range of the input flight altitude value is a vertical range. 9. The display device of claim 8,
wherein the vertical range is smaller than a maximum vertical range between take-off and maximum flight altitude of an aircraft. 10. An aircraft, comprising a display device for receiving and processing weather data and flight plan data, the display device comprising:
a first display, configured to display weather data and flight plan data; an input unit, configured to receive an input value from an operator, wherein the input value is a flight altitude value; a processor, configured to: receive flight plan data containing at least a moving path of an aircraft; receive weather data containing at least positional information and weather characteristics belonging to said positional information; determine, based on the positional information of the weather data, which weather characteristics is located within a predetermined range of the input flight altitude value; instruct the first display to display those weather data which are located within the predetermined range above and below the input flight altitude value together with the flight plan data; instruct the first display to additionally display at least one element of the group consisting of the elements: strategic information weather, uplink weather, weather information from external weather data provider, onboard weather radar information, notice to airmen, aeronautical information service data, terminal area forecast, air-traffic related information. 11. The aircraft of claim 10,
wherein the processor is configured to instruct the first display to display a combination of at least two elements of the group consisting of the elements: strategic information weather, uplink weather, weather information from external weather data provider, onboard weather radar information, notice to airmen, aeronautical information service data, terminal area forecast, air-traffic related information. 12. The aircraft of claim 10,
wherein the processor is configured to determine continuous areas and to instruct the first display to display the information based on these continuous areas. 13. The aircraft of claim 12,
wherein the processor is configured to define the continuous areas by at least one of vector shape, raster data, lines, symbols, text. 14. The aircraft of claim 13,
wherein the processor is configured to define the continuous areas by a combination of at least two of vector shape, raster data, lines, symbols, text. 15. The aircraft of claim 10,
wherein the weather data contain positional information of weather characteristics, wherein the positional information contains at least one of a position, expansion, moving direction of a region having a specific and/or substantially homogeneous weather condition. 16. The aircraft of claim 10,
wherein the weather characteristics relate to at least one or a combination of temperature, wind, wind direction, wind speed. 17. The aircraft of claim 10,
wherein the predetermined range of the input flight altitude value is a vertical range. 18. The aircraft of claim 17,
wherein the vertical range is smaller than a maximum vertical range between take-off and maximum flight altitude of an aircraft. 19. A method for processing and displaying weather data and flight plan data in an aircraft, the method comprising:
receiving an input value that is a flight altitude value; receiving flight plan data containing at least a moving path of an aircraft; receiving weather data containing at least positional information and weather characteristics belonging to said positional information; determining, based on the positional information of the weather data, which weather characteristics is located within a predetermined range of the input flight altitude value; instructing a display to display those weather data which are located within the predetermined range above and below the input flight altitude value together with the flight plan data; instructing the display to additionally display at least one element of the group consisting of the elements: strategic information weather, uplink weather, weather information from external weather data provider, onboard weather radar information, notice to airmen, aeronautical information service data, terminal area forecast, air-traffic related information. 20. The method of claim 19, further comprising:
instructing the display to display a combination of at least two elements of the group consisting of the elements: strategic information weather, uplink weather, weather information from external weather data provider, onboard weather radar information, notice to airmen, aeronautical information service data, terminal area forecast, air-traffic related information; determining continuous areas and instructing the display to display the information based on these continuous areas; and defining the continuous areas by at least one of vector shape, raster data, lines, symbols, and text. | An apparatus and method for receiving and processing weather data and flight plan data is disclosed. The apparatus includes a first display, an input unit, and a processor. The processor is configured to receive flight plan data and weather data, and to determine, based on the weather data, which weather characteristics is located within a predetermined range of a predetermined flight altitude value. The processor is further configured to instruct the first display to display those weather data which are located within the predetermined range above and below the input flight altitude value together with the flight plan data, and to instruct the first display to additionally display at least one element of the group consisting of the elements: strategic information weather, uplink weather, weather information from external weather data provider, onboard weather radar information, notice to airmen, aeronautical information service data, terminal area forecast, air-traffic related information.1. A display device for receiving and processing weather data and flight plan data, comprising:
a first display, configured to display weather data and flight plan data; an input unit, configured to receive an input value from an operator, wherein the input value is a flight altitude value; a processor, configured to: receive flight plan data containing at least a moving path of an aircraft; receive weather data containing at least positional information and weather characteristics belonging to said positional information; determine, based on the positional information of the weather data, which weather characteristics is located within a predetermined range of the input flight altitude value; instruct the first display to display those weather data which are located within the predetermined range above and below the input flight altitude value together with the flight plan data; instruct the first display to additionally display at least one element of the group consisting of the elements: strategic information weather, uplink weather, weather information from external weather data provider, onboard weather radar information, notice to airmen, aeronautical information service data, terminal area forecast, air-traffic related information. 2. The display device of claim 1,
wherein the processor is configured to instruct the first display to display a combination of at least two elements of the group consisting of the elements: strategic information weather, uplink weather, weather information from external weather data provider, onboard weather radar information, notice to airmen, aeronautical information service data, terminal area forecast, air-traffic related information. 3. The display device of claim 1,
wherein the processor is configured to determine continuous areas and to instruct the first display to display the information based on these continuous areas. 4. The display device of claim 3,
wherein the processor is configured to define the continuous areas by at least one of vector shape, raster data, lines, symbols, text. 5. The display device of claim 4,
wherein the processor is configured to define the continuous areas by a combination of at least two of vector shape, raster data, lines, symbols, text. 6. The display device of claim 1,
wherein the weather data contain positional information of weather characteristics, wherein the positional information contains at least one of a position, expansion, moving direction of a region having a specific and/or substantially homogeneous weather condition. 7. The display device of claim 1,
wherein the weather characteristics relate to at least one or a combination of temperature, wind, wind direction, wind speed. 8. The display device of claim 1,
wherein the predetermined range of the input flight altitude value is a vertical range. 9. The display device of claim 8,
wherein the vertical range is smaller than a maximum vertical range between take-off and maximum flight altitude of an aircraft. 10. An aircraft, comprising a display device for receiving and processing weather data and flight plan data, the display device comprising:
a first display, configured to display weather data and flight plan data; an input unit, configured to receive an input value from an operator, wherein the input value is a flight altitude value; a processor, configured to: receive flight plan data containing at least a moving path of an aircraft; receive weather data containing at least positional information and weather characteristics belonging to said positional information; determine, based on the positional information of the weather data, which weather characteristics is located within a predetermined range of the input flight altitude value; instruct the first display to display those weather data which are located within the predetermined range above and below the input flight altitude value together with the flight plan data; instruct the first display to additionally display at least one element of the group consisting of the elements: strategic information weather, uplink weather, weather information from external weather data provider, onboard weather radar information, notice to airmen, aeronautical information service data, terminal area forecast, air-traffic related information. 11. The aircraft of claim 10,
wherein the processor is configured to instruct the first display to display a combination of at least two elements of the group consisting of the elements: strategic information weather, uplink weather, weather information from external weather data provider, onboard weather radar information, notice to airmen, aeronautical information service data, terminal area forecast, air-traffic related information. 12. The aircraft of claim 10,
wherein the processor is configured to determine continuous areas and to instruct the first display to display the information based on these continuous areas. 13. The aircraft of claim 12,
wherein the processor is configured to define the continuous areas by at least one of vector shape, raster data, lines, symbols, text. 14. The aircraft of claim 13,
wherein the processor is configured to define the continuous areas by a combination of at least two of vector shape, raster data, lines, symbols, text. 15. The aircraft of claim 10,
wherein the weather data contain positional information of weather characteristics, wherein the positional information contains at least one of a position, expansion, moving direction of a region having a specific and/or substantially homogeneous weather condition. 16. The aircraft of claim 10,
wherein the weather characteristics relate to at least one or a combination of temperature, wind, wind direction, wind speed. 17. The aircraft of claim 10,
wherein the predetermined range of the input flight altitude value is a vertical range. 18. The aircraft of claim 17,
wherein the vertical range is smaller than a maximum vertical range between take-off and maximum flight altitude of an aircraft. 19. A method for processing and displaying weather data and flight plan data in an aircraft, the method comprising:
receiving an input value that is a flight altitude value; receiving flight plan data containing at least a moving path of an aircraft; receiving weather data containing at least positional information and weather characteristics belonging to said positional information; determining, based on the positional information of the weather data, which weather characteristics is located within a predetermined range of the input flight altitude value; instructing a display to display those weather data which are located within the predetermined range above and below the input flight altitude value together with the flight plan data; instructing the display to additionally display at least one element of the group consisting of the elements: strategic information weather, uplink weather, weather information from external weather data provider, onboard weather radar information, notice to airmen, aeronautical information service data, terminal area forecast, air-traffic related information. 20. The method of claim 19, further comprising:
instructing the display to display a combination of at least two elements of the group consisting of the elements: strategic information weather, uplink weather, weather information from external weather data provider, onboard weather radar information, notice to airmen, aeronautical information service data, terminal area forecast, air-traffic related information; determining continuous areas and instructing the display to display the information based on these continuous areas; and defining the continuous areas by at least one of vector shape, raster data, lines, symbols, and text. | 2,800 |
12,241 | 12,241 | 15,118,943 | 2,837 | The present invention provides an inductance coil comprising a magnetic core and a coil, wherein the coil is formed by winding a flat wire, and the flat surface of the wire is perpendicular to the axis around which the coil is wound. The coil is wrapped with an insulating adhesive tape and the tape is wound on the wire around an axis which is substantially in line with the direction along which the wire forming the coil extends, so as to form an isolation layer on the surface of the coil. Additionally, the present invention provides an electromagnetic device including the above inductance coil. | 1. An inductance coil comprising a magnetic core and a coil which is wound around the magnetic core, wherein the coil is formed by winding a flat wire, and the flat surface of the wire is perpendicular to the axis around which the coil is wound, and wherein the coil is wrapped with an insulating adhesive tape, and the insulating adhesive tape is wound on the wire around an axis which is substantially in line with the direction along which the wire forming the coil extends, so as to form an isolation layer on the surface of the coil. 2. The inductance coil according to claim 1, wherein the winding direction of the insulating adhesive tape is perpendicular to the winding direction of the coil. 3. The inductance coil according to claim 1, wherein a gap between the magnetic core and the coil is filled with an insulating material. 4. The inductance coil according to claim 1, wherein the surface of the inductance coil is coated with a waterproof paint. 5. The inductance coil according to claim 1, wherein a leading out terminal of the coil is sleeved with a heat-shrinkable tube. 6. The inductance coil according to claim 1, wherein a leading out terminal of the coil is coated with a sealing gum. 7. The inductance coil according to claim 1, wherein the magnetic core is an E-I shaped magnetic core, and the coil is located to surround a central column of the E-I shaped magnetic core. 8. The inductance coil according to claim 1, wherein the magnetic core has an air gap, within which an insulating gasket is provided. 9. The inductance coil according to claim 1, wherein the inductance coil is a reactor, an inductor, a choke coil or a transformer coil. 10. An electromagnetic device, characterized in that it comprises:
an inductance coil comprising a magnetic core and a coil which is wound around the magnetic core, wherein the coil is formed by winding a flat wire, and the flat surface of the wire is perpendicular to the axis around which the coil is wound, and wherein the coil is wrapped with an insulating adhesive tape, and the insulating adhesive tape is wound on the wire around an axis which is substantially in line with the direction along which the wire forming the coil extends, so as to form an isolation layer on the surface of the coil. 11. The electromagnetic device according to claim 10, wherein the winding direction of the insulating adhesive tape is perpendicular to the winding direction of the coil. 12. The electromagnetic device according to claim 10, wherein a gap between the magnetic core and the coil is filled with an insulating material. 13. The electromagnetic device according to claim 10, wherein the surface of the inductance coil is coated with a waterproof paint. 14. The electromagnetic device according to claim 10, wherein a leading out terminal of the coil is sleeved with a heat-shrinkable tube. 15. The electromagnetic device according to claim 10, wherein a leading out terminal of the coil is coated with a sealing gum. 16. The electromagnetic device according to claim 10, wherein the magnetic core is an E-I shaped magnetic core, and the coil is located to surround a central column of the E-I shaped magnetic core. 17. The electromagnetic device according to claim 10, wherein the magnetic core has an air gap, within which an insulating gasket is provided. 18. The electromagnetic device according to claim 10, wherein the inductance coil is a reactor, an inductor, a choke coil or a transformer coil. | The present invention provides an inductance coil comprising a magnetic core and a coil, wherein the coil is formed by winding a flat wire, and the flat surface of the wire is perpendicular to the axis around which the coil is wound. The coil is wrapped with an insulating adhesive tape and the tape is wound on the wire around an axis which is substantially in line with the direction along which the wire forming the coil extends, so as to form an isolation layer on the surface of the coil. Additionally, the present invention provides an electromagnetic device including the above inductance coil.1. An inductance coil comprising a magnetic core and a coil which is wound around the magnetic core, wherein the coil is formed by winding a flat wire, and the flat surface of the wire is perpendicular to the axis around which the coil is wound, and wherein the coil is wrapped with an insulating adhesive tape, and the insulating adhesive tape is wound on the wire around an axis which is substantially in line with the direction along which the wire forming the coil extends, so as to form an isolation layer on the surface of the coil. 2. The inductance coil according to claim 1, wherein the winding direction of the insulating adhesive tape is perpendicular to the winding direction of the coil. 3. The inductance coil according to claim 1, wherein a gap between the magnetic core and the coil is filled with an insulating material. 4. The inductance coil according to claim 1, wherein the surface of the inductance coil is coated with a waterproof paint. 5. The inductance coil according to claim 1, wherein a leading out terminal of the coil is sleeved with a heat-shrinkable tube. 6. The inductance coil according to claim 1, wherein a leading out terminal of the coil is coated with a sealing gum. 7. The inductance coil according to claim 1, wherein the magnetic core is an E-I shaped magnetic core, and the coil is located to surround a central column of the E-I shaped magnetic core. 8. The inductance coil according to claim 1, wherein the magnetic core has an air gap, within which an insulating gasket is provided. 9. The inductance coil according to claim 1, wherein the inductance coil is a reactor, an inductor, a choke coil or a transformer coil. 10. An electromagnetic device, characterized in that it comprises:
an inductance coil comprising a magnetic core and a coil which is wound around the magnetic core, wherein the coil is formed by winding a flat wire, and the flat surface of the wire is perpendicular to the axis around which the coil is wound, and wherein the coil is wrapped with an insulating adhesive tape, and the insulating adhesive tape is wound on the wire around an axis which is substantially in line with the direction along which the wire forming the coil extends, so as to form an isolation layer on the surface of the coil. 11. The electromagnetic device according to claim 10, wherein the winding direction of the insulating adhesive tape is perpendicular to the winding direction of the coil. 12. The electromagnetic device according to claim 10, wherein a gap between the magnetic core and the coil is filled with an insulating material. 13. The electromagnetic device according to claim 10, wherein the surface of the inductance coil is coated with a waterproof paint. 14. The electromagnetic device according to claim 10, wherein a leading out terminal of the coil is sleeved with a heat-shrinkable tube. 15. The electromagnetic device according to claim 10, wherein a leading out terminal of the coil is coated with a sealing gum. 16. The electromagnetic device according to claim 10, wherein the magnetic core is an E-I shaped magnetic core, and the coil is located to surround a central column of the E-I shaped magnetic core. 17. The electromagnetic device according to claim 10, wherein the magnetic core has an air gap, within which an insulating gasket is provided. 18. The electromagnetic device according to claim 10, wherein the inductance coil is a reactor, an inductor, a choke coil or a transformer coil. | 2,800 |
12,242 | 12,242 | 16,600,689 | 2,874 | A fiber optic adapter assembly is provided with a floating adapter module. The adapter assembly includes a housing, an adapter module, and a single biasing member disposed in the housing and concentrically aligned with the adapter module. The single biasing member can bias the adapter module in a direction toward an end of the housing and be compressible in the opposite direction toward the other end of the housing. | 1.-20 (canceled) 21. A fiber optic adapter assembly comprising:
an adapter housing; an adapter module floating inside the adapter housing and configured to align ferrules of first and second fiber optic cable connectors; and a single biasing member surrounding a portion of the adapter module inside the adapter housing, the single biasing member biasing the adapter module in a direction toward an exterior end and being compressible in a direction toward an interior end. 22. The fiber optic adapter assembly of claim 21, wherein the adapter module includes an adapter body and a flange extending radially outwardly from the adapter body, and wherein the single biasing member surrounds the adapter body inside the adapter housing. 23. The fiber optic adapter assembly of claim 22, wherein the single biasing member is captured between an inner shoulder defined around an opening at the interior end of the adapter housing and the flange of the adapter module. 24. The fiber optic adapter assembly of claim 22, further comprising a ferrule holder that is at least partially received by the adapter body, and wherein the single biasing member partially surrounds the ferrule holder inside the adapter housing. 25. The fiber optic adapter assembly of claim 24, further comprising a barrel portion on the ferrule holder, the barrel portion being configured to receive the ferrules of the first and second fiber optic cable connectors, and wherein the single biasing member partially surrounds the barrel portion inside the adapter housing. 26. The fiber optic adapter assembly of claim 25, further comprising a ferrule alignment sleeve mounted in the barrel portion of the ferrule holder, and wherein the single biasing member partially surrounds the ferrule alignment sleeve inside the adapter housing. 27. The fiber optic adapter assembly of claim 24, further comprising latching arms on the ferrule holder, wherein the latching arms are configured to selectively engage at least one of the first and second fiber optic cable connectors when inserted in the adapter module, and wherein the single biasing member partially surrounds the latching arms inside the adapter housing. 28. The fiber optic adapter assembly of claim 21, wherein the housing includes an axial stopper configured to limit an axial movement of the adapter module within the adapter housing, and the single biasing member surrounds the axial stopper inside the adapter housing. 29. The fiber optic adapter assembly of claim 21, wherein the adapter module includes a ferrule alignment sleeve, and the single biasing member at least partially surrounds ferrule alignment sleeve inside the adapter housing. 30. The fiber optic adapter assembly of claim 21, wherein the adapter housing includes first and second housing components, wherein the single biasing member is concentrically aligned with the adapter module in the first housing component, and wherein the first and second housing components interlock to secure the adapter housing to a bulkhead. 31. The fiber optic adapter assembly of claim 30, wherein the first housing component is configured to be positioned on a first side of the bulkhead, the second housing component is configured to be positioned on an opposite second side of the bulkhead, and wherein the first housing component defines an exterior, ruggedized port for receiving at least one of the first and second fiber optic cable connectors, and the second housing component defines an interior, non-ruggedized port for receiving another one of the first and second fiber optic cable connectors. 32. The fiber optic adapter assembly of claim 30, wherein the single biasing member biases the adapter module in a direction toward the second housing component, and is compressible in an opposite direction within the first housing component. 33. The fiber optic adapter assembly of claim 32, wherein the single biasing member provides an even biasing of the adapter module within the first housing component. 34. The fiber optic adapter assembly of claim 30, wherein the second housing component includes a sealing flange portion, the sealing flange portion holding a sealing member to provide a radial sealing of the fiber optic adapter assembly against the bulkhead. 35. The fiber optic adapter assembly of claim 30, wherein the second housing component includes a plurality of retaining clips to removably engage corresponding slots on the first housing component. 36. The fiber optic adapter assembly of claim 21, wherein the single biasing member is concentrically aligned with the adapter module in an internal cavity of the first housing component. 37. The fiber optic adapter assembly of claim 21, wherein the single biasing member is a compression coil spring. 38. The fiber optic adapter assembly of claim 21, wherein the interior end includes a first opening configured to receive a Subscription Channel (SC) connector, and the exterior end includes a second opening configured to receive a ruggedized fiber optic connector. 39. A fiber optic connection system comprising:
a first fiber optic connector terminating a first fiber optic cable; a second fiber optic connector terminating a second fiber optic cable; and a fiber optic adapter assembly that receives the first fiber optic connector at a first adapter end and the second fiber optic connector at a second adapter end, the fiber optic adapter assembly comprising:
an adapter housing
an adapter module floating inside the adapter housing and configured to align ferrules of the first and second fiber optic cable connectors; and
a single biasing member surrounding a portion of the adapter module inside the adapter housing, the single biasing member biasing the adapter module in a direction toward the first adapter end and being compressible in a direction toward the second adapter end;
wherein the fiber optic adapter assembly is configured to align an optical fiber of the first fiber optic cable with an optical fiber of the second fiber optic cable when the first and second fiber optic connectors are inserted into the first and second adapter ends. 40. A fiber optic adapter assembly comprising:
a housing defining an internal cavity being open through a first opening at a first exterior end and through a second opening at a first interior end opposite to the first exterior end; an adapter module disposed in the internal cavity and configured to align ferrules of fiber optic cable connectors inserted into the adapter module in opposite directions; and a single biasing member disposed in the internal cavity and concentrically aligned with the adapter module, the single biasing member biasing the adapter module in a direction toward the first exterior end and being compressible in a direction toward the first interior end. | A fiber optic adapter assembly is provided with a floating adapter module. The adapter assembly includes a housing, an adapter module, and a single biasing member disposed in the housing and concentrically aligned with the adapter module. The single biasing member can bias the adapter module in a direction toward an end of the housing and be compressible in the opposite direction toward the other end of the housing.1.-20 (canceled) 21. A fiber optic adapter assembly comprising:
an adapter housing; an adapter module floating inside the adapter housing and configured to align ferrules of first and second fiber optic cable connectors; and a single biasing member surrounding a portion of the adapter module inside the adapter housing, the single biasing member biasing the adapter module in a direction toward an exterior end and being compressible in a direction toward an interior end. 22. The fiber optic adapter assembly of claim 21, wherein the adapter module includes an adapter body and a flange extending radially outwardly from the adapter body, and wherein the single biasing member surrounds the adapter body inside the adapter housing. 23. The fiber optic adapter assembly of claim 22, wherein the single biasing member is captured between an inner shoulder defined around an opening at the interior end of the adapter housing and the flange of the adapter module. 24. The fiber optic adapter assembly of claim 22, further comprising a ferrule holder that is at least partially received by the adapter body, and wherein the single biasing member partially surrounds the ferrule holder inside the adapter housing. 25. The fiber optic adapter assembly of claim 24, further comprising a barrel portion on the ferrule holder, the barrel portion being configured to receive the ferrules of the first and second fiber optic cable connectors, and wherein the single biasing member partially surrounds the barrel portion inside the adapter housing. 26. The fiber optic adapter assembly of claim 25, further comprising a ferrule alignment sleeve mounted in the barrel portion of the ferrule holder, and wherein the single biasing member partially surrounds the ferrule alignment sleeve inside the adapter housing. 27. The fiber optic adapter assembly of claim 24, further comprising latching arms on the ferrule holder, wherein the latching arms are configured to selectively engage at least one of the first and second fiber optic cable connectors when inserted in the adapter module, and wherein the single biasing member partially surrounds the latching arms inside the adapter housing. 28. The fiber optic adapter assembly of claim 21, wherein the housing includes an axial stopper configured to limit an axial movement of the adapter module within the adapter housing, and the single biasing member surrounds the axial stopper inside the adapter housing. 29. The fiber optic adapter assembly of claim 21, wherein the adapter module includes a ferrule alignment sleeve, and the single biasing member at least partially surrounds ferrule alignment sleeve inside the adapter housing. 30. The fiber optic adapter assembly of claim 21, wherein the adapter housing includes first and second housing components, wherein the single biasing member is concentrically aligned with the adapter module in the first housing component, and wherein the first and second housing components interlock to secure the adapter housing to a bulkhead. 31. The fiber optic adapter assembly of claim 30, wherein the first housing component is configured to be positioned on a first side of the bulkhead, the second housing component is configured to be positioned on an opposite second side of the bulkhead, and wherein the first housing component defines an exterior, ruggedized port for receiving at least one of the first and second fiber optic cable connectors, and the second housing component defines an interior, non-ruggedized port for receiving another one of the first and second fiber optic cable connectors. 32. The fiber optic adapter assembly of claim 30, wherein the single biasing member biases the adapter module in a direction toward the second housing component, and is compressible in an opposite direction within the first housing component. 33. The fiber optic adapter assembly of claim 32, wherein the single biasing member provides an even biasing of the adapter module within the first housing component. 34. The fiber optic adapter assembly of claim 30, wherein the second housing component includes a sealing flange portion, the sealing flange portion holding a sealing member to provide a radial sealing of the fiber optic adapter assembly against the bulkhead. 35. The fiber optic adapter assembly of claim 30, wherein the second housing component includes a plurality of retaining clips to removably engage corresponding slots on the first housing component. 36. The fiber optic adapter assembly of claim 21, wherein the single biasing member is concentrically aligned with the adapter module in an internal cavity of the first housing component. 37. The fiber optic adapter assembly of claim 21, wherein the single biasing member is a compression coil spring. 38. The fiber optic adapter assembly of claim 21, wherein the interior end includes a first opening configured to receive a Subscription Channel (SC) connector, and the exterior end includes a second opening configured to receive a ruggedized fiber optic connector. 39. A fiber optic connection system comprising:
a first fiber optic connector terminating a first fiber optic cable; a second fiber optic connector terminating a second fiber optic cable; and a fiber optic adapter assembly that receives the first fiber optic connector at a first adapter end and the second fiber optic connector at a second adapter end, the fiber optic adapter assembly comprising:
an adapter housing
an adapter module floating inside the adapter housing and configured to align ferrules of the first and second fiber optic cable connectors; and
a single biasing member surrounding a portion of the adapter module inside the adapter housing, the single biasing member biasing the adapter module in a direction toward the first adapter end and being compressible in a direction toward the second adapter end;
wherein the fiber optic adapter assembly is configured to align an optical fiber of the first fiber optic cable with an optical fiber of the second fiber optic cable when the first and second fiber optic connectors are inserted into the first and second adapter ends. 40. A fiber optic adapter assembly comprising:
a housing defining an internal cavity being open through a first opening at a first exterior end and through a second opening at a first interior end opposite to the first exterior end; an adapter module disposed in the internal cavity and configured to align ferrules of fiber optic cable connectors inserted into the adapter module in opposite directions; and a single biasing member disposed in the internal cavity and concentrically aligned with the adapter module, the single biasing member biasing the adapter module in a direction toward the first exterior end and being compressible in a direction toward the first interior end. | 2,800 |
12,243 | 12,243 | 16,347,128 | 2,853 | A primer apparatus for a print head structure of an inkjet printer, in which the primer apparatus comprises a pump to supply a flow of air to the print head structure, an outlet valve and a control valve in fluid communication with and disposed between the pump and the outlet valve, the outlet valve comprising a venting structure to reduce the pressure of a flow of air supplied to the print head structure when the control valve is open. | 1. A primer apparatus for a print head structure of an inkjet printer, the primer apparatus comprising:
a pump to supply a flow of air to the print head structure; an outlet valve; and a control valve in fluid communication with and disposed between the pump and the outlet valve, the outlet valve comprising a venting structure to reduce the pressure of a flow of air supplied to the print head structure when the control valve is open. 2. A primer apparatus as claimed in claim 1, wherein the venting structure comprises an obstruction in the outlet valve, the obstruction comprising a channel in fluid communication with the atmosphere and the control valve. 3. A primer apparatus as claimed in claim 2, wherein the channel is an elongate winding or sinuous conduit defined at an interface between an inside surface of the outlet valve and an outside surface of the obstruction. 4. A primer apparatus as claimed in claim 2, wherein the obstruction is a plug that is maintained in the outlet valve by interference fit or by being adhered in the outlet valve or that is integrally moulded with the outlet valve. 5. A primer apparatus as claimed in claim 1, further comprising a pressure relief valve in fluid communication with and disposed downstream of the control valve. 6. A primer apparatus as claimed in claim 5, wherein the pressure relief valve has a release pressure greater than the pressure of the flow of air when the control valve is open. 7. A primer apparatus as claimed in claim 2, wherein the obstruction is formed from a porous material. 8. A method for delivering at least two distinct pressurised air flows in a primer apparatus for a print head structure of an inkjet printer, the method comprising:
generating an air flow using a pump; providing a control valve in fluid communication with and disposed between the pump and an outlet valve of the primer apparatus, the outlet valve comprising a venting structure to reduce the pressure of a flow of air supplied to the print head structure. 9. A method as claimed in claim 8, further comprising:
opening the control valve, whereby to enable a proportion of the air flow to pass or bleed through the venting structure of the outlet valve. 10. A method as claimed in claim 9, further comprising;
pressurising a regulator; and supplying a pressurised air flow from the regulator to the print head structure, whereby to enable print fluid recirculation. 11. A method as claimed in claim 8, further comprising:
bypassing the outlet valve by activating the control valve. 12. A method as claimed in claim 11, further comprising;
pressurising a regulator; and supplying the pressurised air flow from the regulator to the print head structure, whereby to enable print head maintenance or servicing. 13. A method as claimed in claim 8, further comprising:
providing a pressure relief valve in fluid communication with and disposed downstream of the control valve and the air pump. 14. A print head structure for an inkjet printer, the print head structure including a primer apparatus comprising:
a pump to supply a flow of air to the print head structure; an outlet valve; and a control valve in fluid communication with and disposed between the pump and the outlet valve, the outlet valve comprising a venting structure to reduce the pressure of a flow of air supplied to the print head structure when the control valve is open. 15. An ink jet printing apparatus including a print head structure as claimed in claim 14. | A primer apparatus for a print head structure of an inkjet printer, in which the primer apparatus comprises a pump to supply a flow of air to the print head structure, an outlet valve and a control valve in fluid communication with and disposed between the pump and the outlet valve, the outlet valve comprising a venting structure to reduce the pressure of a flow of air supplied to the print head structure when the control valve is open.1. A primer apparatus for a print head structure of an inkjet printer, the primer apparatus comprising:
a pump to supply a flow of air to the print head structure; an outlet valve; and a control valve in fluid communication with and disposed between the pump and the outlet valve, the outlet valve comprising a venting structure to reduce the pressure of a flow of air supplied to the print head structure when the control valve is open. 2. A primer apparatus as claimed in claim 1, wherein the venting structure comprises an obstruction in the outlet valve, the obstruction comprising a channel in fluid communication with the atmosphere and the control valve. 3. A primer apparatus as claimed in claim 2, wherein the channel is an elongate winding or sinuous conduit defined at an interface between an inside surface of the outlet valve and an outside surface of the obstruction. 4. A primer apparatus as claimed in claim 2, wherein the obstruction is a plug that is maintained in the outlet valve by interference fit or by being adhered in the outlet valve or that is integrally moulded with the outlet valve. 5. A primer apparatus as claimed in claim 1, further comprising a pressure relief valve in fluid communication with and disposed downstream of the control valve. 6. A primer apparatus as claimed in claim 5, wherein the pressure relief valve has a release pressure greater than the pressure of the flow of air when the control valve is open. 7. A primer apparatus as claimed in claim 2, wherein the obstruction is formed from a porous material. 8. A method for delivering at least two distinct pressurised air flows in a primer apparatus for a print head structure of an inkjet printer, the method comprising:
generating an air flow using a pump; providing a control valve in fluid communication with and disposed between the pump and an outlet valve of the primer apparatus, the outlet valve comprising a venting structure to reduce the pressure of a flow of air supplied to the print head structure. 9. A method as claimed in claim 8, further comprising:
opening the control valve, whereby to enable a proportion of the air flow to pass or bleed through the venting structure of the outlet valve. 10. A method as claimed in claim 9, further comprising;
pressurising a regulator; and supplying a pressurised air flow from the regulator to the print head structure, whereby to enable print fluid recirculation. 11. A method as claimed in claim 8, further comprising:
bypassing the outlet valve by activating the control valve. 12. A method as claimed in claim 11, further comprising;
pressurising a regulator; and supplying the pressurised air flow from the regulator to the print head structure, whereby to enable print head maintenance or servicing. 13. A method as claimed in claim 8, further comprising:
providing a pressure relief valve in fluid communication with and disposed downstream of the control valve and the air pump. 14. A print head structure for an inkjet printer, the print head structure including a primer apparatus comprising:
a pump to supply a flow of air to the print head structure; an outlet valve; and a control valve in fluid communication with and disposed between the pump and the outlet valve, the outlet valve comprising a venting structure to reduce the pressure of a flow of air supplied to the print head structure when the control valve is open. 15. An ink jet printing apparatus including a print head structure as claimed in claim 14. | 2,800 |
12,244 | 12,244 | 15,991,317 | 2,829 | A crystal substrate 1 includes an underlying layer 2 and a thick film 3. The underlying layer 2 is composed of a crystal of a nitride of a group 13 element and includes a first main face 2a and a second main face 2b. The thick film 3 is composed of a crystal of a nitride of a group 13 element and provided over the first main face of the underlying layer. The underlying layer 2 includes a low carrier concentration region 5 and a high carrier concentration region 4 both extending between the first main face 2a and the second main face 2b. The low carrier concentration region 5 has a carrier concentration of 1017/cm3 or lower and a defect density of 107/cm2 or lower. The high carrier concentration region 4 has a carrier concentration of 1019/cm3 or higher and a defect density of 108/cm2 or higher. The thick film 3 has a carrier concentration of 1018/cm3 or higher and 1019/cm3 or lower and a defect density of 107/cm2 or lower. | 1. A group 13 nitride crystal substrate comprising an underlying layer and a thick layer:
said underlying layer comprising a crystal of a nitride of a group 13 element and having a first main face and a second main face; said thick film comprising a crystal of a nitride of a group 13 element and provided over said first main face of said underlying layer; wherein said underlying layer comprises a low carrier concentration region and a high carrier concentration region both extending between said first main face and said second main face; wherein said low carrier concentration region has a carrier concentration of 1×1018/cm3 or higher and 1017/cm3 or lower; wherein said low carrier concentration region has a defect density of 2×106/cm2 or higher and 107/cm2 or lower; wherein said high carrier concentration region has a carrier concentration of 1019/cm3 or higher and 5×1019/cm3 or lower; wherein said high carrier concentration region has a defect density of 108/cm2 or higher and 5×108/cm2 or lower; wherein said thick film has a carrier concentration of 1018/cm3 or higher and 1019/cm3 or lower; and wherein said thick film has a defect density of 107/cm2 or lower. 2. The crystal substrate of claim 1, wherein a defect density at a surface of said thick film is 107/cm2 or lower. 3. The crystal substrate of claim 1, wherein said thick film has a thickness of 1 μm or larger and wherein said underlying layer has a thickness of 50 μm or larger and 200 μm or smaller. 4. The crystal substrate of claim 1, wherein said thick film is formed by a flux method or a vapor phase method. 5. The crystal substrate of claim 1, wherein a surface of said thick film comprises a polished surface. 6. The crystal substrate of claim 1, wherein said crystal of said nitride of said group 13 element forming said underlying layer and said crystal of said nitride of said group 13 element forming said thick film comprises gallium nitride. 7. A functional device comprising said crystal substrate of claim 1 and a functional layer formed over said thick film of said crystal substrate and comprising a nitride of a group 13 element. 8. The functional device of claim 7, wherein said functional layer has a function of emitting a light. 9. The functional device of claim 7, further comprising a seed crystal comprising a nitride of a group 13 element, wherein said crystal substrate is provided over said seed crystal. | A crystal substrate 1 includes an underlying layer 2 and a thick film 3. The underlying layer 2 is composed of a crystal of a nitride of a group 13 element and includes a first main face 2a and a second main face 2b. The thick film 3 is composed of a crystal of a nitride of a group 13 element and provided over the first main face of the underlying layer. The underlying layer 2 includes a low carrier concentration region 5 and a high carrier concentration region 4 both extending between the first main face 2a and the second main face 2b. The low carrier concentration region 5 has a carrier concentration of 1017/cm3 or lower and a defect density of 107/cm2 or lower. The high carrier concentration region 4 has a carrier concentration of 1019/cm3 or higher and a defect density of 108/cm2 or higher. The thick film 3 has a carrier concentration of 1018/cm3 or higher and 1019/cm3 or lower and a defect density of 107/cm2 or lower.1. A group 13 nitride crystal substrate comprising an underlying layer and a thick layer:
said underlying layer comprising a crystal of a nitride of a group 13 element and having a first main face and a second main face; said thick film comprising a crystal of a nitride of a group 13 element and provided over said first main face of said underlying layer; wherein said underlying layer comprises a low carrier concentration region and a high carrier concentration region both extending between said first main face and said second main face; wherein said low carrier concentration region has a carrier concentration of 1×1018/cm3 or higher and 1017/cm3 or lower; wherein said low carrier concentration region has a defect density of 2×106/cm2 or higher and 107/cm2 or lower; wherein said high carrier concentration region has a carrier concentration of 1019/cm3 or higher and 5×1019/cm3 or lower; wherein said high carrier concentration region has a defect density of 108/cm2 or higher and 5×108/cm2 or lower; wherein said thick film has a carrier concentration of 1018/cm3 or higher and 1019/cm3 or lower; and wherein said thick film has a defect density of 107/cm2 or lower. 2. The crystal substrate of claim 1, wherein a defect density at a surface of said thick film is 107/cm2 or lower. 3. The crystal substrate of claim 1, wherein said thick film has a thickness of 1 μm or larger and wherein said underlying layer has a thickness of 50 μm or larger and 200 μm or smaller. 4. The crystal substrate of claim 1, wherein said thick film is formed by a flux method or a vapor phase method. 5. The crystal substrate of claim 1, wherein a surface of said thick film comprises a polished surface. 6. The crystal substrate of claim 1, wherein said crystal of said nitride of said group 13 element forming said underlying layer and said crystal of said nitride of said group 13 element forming said thick film comprises gallium nitride. 7. A functional device comprising said crystal substrate of claim 1 and a functional layer formed over said thick film of said crystal substrate and comprising a nitride of a group 13 element. 8. The functional device of claim 7, wherein said functional layer has a function of emitting a light. 9. The functional device of claim 7, further comprising a seed crystal comprising a nitride of a group 13 element, wherein said crystal substrate is provided over said seed crystal. | 2,800 |
12,245 | 12,245 | 14,945,471 | 2,822 | A method, system, and/or computer program product configure a manufacturing device. One or more processors generate a first inflation expectation value (IEV), which incorporates a price of the first good, and a second IEV that incorporates a price of the second good. The processor(s) compare an accuracy of the first IEV to an accuracy of the second IEV in predicting a future inflation index. In response to the first IEV more accurately predicting the future inflation index than the second IEV, one or more component positioning devices configure future configurations of the manufacturing device based on an inflation expectation described in the first IEV. | 1. A method for configuring a manufacturing device, the method comprising:
generating, by one or more processors, a first inflation expectation value (IEV), wherein the first IEV incorporates a price of a first good; generating, by one or more processors, a second IEV that incorporates a price of a second good; comparing, by one or more processors, an accuracy of the first IEV to an accuracy of the second IEV in predicting a future inflation index; and in response to the first IEV more accurately predicting the future inflation index than the second IEV, configuring, by one or more component positioning devices, future configurations of a manufacturing device based on an inflation expectation described by the first IEV. 2. The method of claim 1, further comprising:
in response to the first IEV predicting an increase in inflation, configuring, by the one or more component positioning devices, the manufacturing device to produce an increased quantity of goods. 3. The method of claim 1, further comprising:
in response to the first IEV predicting a decrease in inflation, configuring, by the one or more component positioning devices, the manufacturing device to produce a decreased quantity of goods. 4. The method of claim 1, further comprising:
in response to the first IEV predicting an increase in inflation, adjusting, by the one or more component positioning devices, a feedstock supply mechanism to provide additional feedstock required to manufacture an increased quantity of goods by the manufacturing device. 5. The method of claim 1, wherein the manufacturing device is a robotic manufacturing device, and wherein the method further comprises:
in response to the first IEV predicting an increase in inflation, adjusting, by the one or more component positioning devices, a robotic arm mechanism on the robotic manufacturing device to manufacture an increased quantity of goods. 6. The method of claim 1, wherein the manufacturing device is a robotic manufacturing device, and wherein the method further comprises:
in response to the first IEV predicting an increase in inflation, configuring, by one or more processors, a testing device associated with the robotic manufacturing device to test an increased quantity goods produced by the robotic manufacturing device. 7. The method of claim 1, wherein the manufacturing device is a robotic manufacturing device that utilizes a molding device, and wherein the method further comprises:
in response to the first IEV predicting an increase in inflation, configuring, by the one or more component positioning devices, the molding device to produce an increased quantity of goods. 8. A computer program product for configuring a manufacturing device, the computer program product comprising a non-transitory computer readable storage medium having program code embodied therewith, the program code readable and executable by one or more processors to perform a method comprising:
generating a first inflation expectation value (IEV), wherein the first IEV incorporates a price of a first good; generating a second IEV that incorporates a price of a second good; comparing an accuracy of the first IEV to an accuracy of the second IEV in predicting a future inflation index; and in response to the first IEV more accurately predicting the future inflation index than the second IEV, configuring, by one or more component positioning devices, future configurations of a manufacturing device based on an inflation expectation described by the first IEV. 9. The computer program product of claim 8, wherein the method further comprises:
in response to the first IEV predicting an increase in inflation, configuring, by the one or more component positioning devices, the manufacturing device to produce an increased quantity of goods. 10. The computer program product of claim 8, wherein the method further comprises:
in response to the first IEV predicting a decrease in inflation, configuring, by the one or more component positioning devices, the manufacturing device to produce a decreased quantity of goods. 11. The computer program product of claim 8, wherein the method further comprises:
in response to the first IEV predicting an increase in inflation, adjusting, by the one or more component positioning devices, a feedstock supply mechanism to provide additional feedstock required to manufacture an increased quantity of goods by the manufacturing device. 12. The computer program product of claim 8, wherein the manufacturing device is a robotic manufacturing device, and wherein the method further comprises:
in response to the first IEV predicting an increase in inflation, adjusting, by the one or more component positioning devices, a robotic arm mechanism on the robotic manufacturing device to manufacture an increased quantity of goods. 13. The computer program product of claim 8, wherein the manufacturing device is a robotic manufacturing device, and wherein the method further comprises:
in response to the first IEV predicting an increase in inflation, configuring, by one or more processors, a testing device associated with the robotic manufacturing device to test an increased quantity goods produced by the robotic manufacturing device. 14. The computer program product of claim 8, wherein the manufacturing device is a robotic manufacturing device that utilizes a molding device, and wherein the method further comprises:
in response to the first IEV predicting an increase in inflation, configuring, by the one or more component positioning devices, the molding device to produce an increased quantity of goods. 15. A computer system comprising:
a processor, a computer readable memory, and a non-transitory computer readable storage medium; first program instructions to generate a first inflation expectation value (IEV), wherein the first IEV incorporates a price of a first good; second program instructions to generate a second IEV that incorporates a price of the second good; third program instructions to compare an accuracy of the first IEV to an accuracy of the second IEV in predicting a future inflation index; and fourth program instructions to, in response to the first IEV more accurately predicting the future inflation index than the second IEV, configure, by one or more component positioning devices, future configurations of a manufacturing device based on an inflation expectation described by the first IEV; and wherein
the first, second, third, and fourth program instructions are stored on the computer readable storage medium and executed by the processor via the computer readable memory. 16. The computer system of claim 15, further comprising:
fifth program instructions to, in response to the first IEV predicting an increase in inflation, configure, by the one or more component positioning devices, the manufacturing device to produce an increased quantity of goods; and wherein
the fifth program instructions are stored on the computer readable storage medium and executed by the processor via the computer readable memory. 17. The computer system of claim 15, further comprising:
fifth program instructions to, in response to the first IEV predicting a decrease in inflation, configure, by the one or more component positioning devices, the manufacturing device to produce a decreased quantity of goods; and wherein
the fifth program instructions are stored on the computer readable storage medium and executed by the processor via the computer readable memory. 18. The computer system of claim 15, further comprising:
fifth program instructions to, in response to the first IEV predicting an increase in inflation, adjust, by the one or more component positioning devices, a feedstock supply mechanism to provide additional feedstock required to manufacture an increased quantity of goods by the manufacturing device; and wherein
the fifth program instructions are stored on the computer readable storage medium and executed by the processor via the computer readable memory. 19. The computer system of claim 15, further comprising:
fifth program instructions to, in response to the first IEV predicting an increase in inflation, adjust, by the one or more component positioning devices, a robotic arm mechanism on the robotic manufacturing device to manufacture an increased quantity of goods; and wherein the fifth program instructions are stored on the computer readable storage medium and executed by the processor via the computer readable memory. 20. The computer system of claim 15, further comprising:
fifth program instructions to, in response to the first IEV predicting an increase in inflation, configure a testing device associated with the robotic manufacturing device to test an increased quantity goods produced by the robotic manufacturing device; and wherein the fifth program instructions are stored on the computer readable storage medium and executed by the processor via the computer readable memory. | A method, system, and/or computer program product configure a manufacturing device. One or more processors generate a first inflation expectation value (IEV), which incorporates a price of the first good, and a second IEV that incorporates a price of the second good. The processor(s) compare an accuracy of the first IEV to an accuracy of the second IEV in predicting a future inflation index. In response to the first IEV more accurately predicting the future inflation index than the second IEV, one or more component positioning devices configure future configurations of the manufacturing device based on an inflation expectation described in the first IEV.1. A method for configuring a manufacturing device, the method comprising:
generating, by one or more processors, a first inflation expectation value (IEV), wherein the first IEV incorporates a price of a first good; generating, by one or more processors, a second IEV that incorporates a price of a second good; comparing, by one or more processors, an accuracy of the first IEV to an accuracy of the second IEV in predicting a future inflation index; and in response to the first IEV more accurately predicting the future inflation index than the second IEV, configuring, by one or more component positioning devices, future configurations of a manufacturing device based on an inflation expectation described by the first IEV. 2. The method of claim 1, further comprising:
in response to the first IEV predicting an increase in inflation, configuring, by the one or more component positioning devices, the manufacturing device to produce an increased quantity of goods. 3. The method of claim 1, further comprising:
in response to the first IEV predicting a decrease in inflation, configuring, by the one or more component positioning devices, the manufacturing device to produce a decreased quantity of goods. 4. The method of claim 1, further comprising:
in response to the first IEV predicting an increase in inflation, adjusting, by the one or more component positioning devices, a feedstock supply mechanism to provide additional feedstock required to manufacture an increased quantity of goods by the manufacturing device. 5. The method of claim 1, wherein the manufacturing device is a robotic manufacturing device, and wherein the method further comprises:
in response to the first IEV predicting an increase in inflation, adjusting, by the one or more component positioning devices, a robotic arm mechanism on the robotic manufacturing device to manufacture an increased quantity of goods. 6. The method of claim 1, wherein the manufacturing device is a robotic manufacturing device, and wherein the method further comprises:
in response to the first IEV predicting an increase in inflation, configuring, by one or more processors, a testing device associated with the robotic manufacturing device to test an increased quantity goods produced by the robotic manufacturing device. 7. The method of claim 1, wherein the manufacturing device is a robotic manufacturing device that utilizes a molding device, and wherein the method further comprises:
in response to the first IEV predicting an increase in inflation, configuring, by the one or more component positioning devices, the molding device to produce an increased quantity of goods. 8. A computer program product for configuring a manufacturing device, the computer program product comprising a non-transitory computer readable storage medium having program code embodied therewith, the program code readable and executable by one or more processors to perform a method comprising:
generating a first inflation expectation value (IEV), wherein the first IEV incorporates a price of a first good; generating a second IEV that incorporates a price of a second good; comparing an accuracy of the first IEV to an accuracy of the second IEV in predicting a future inflation index; and in response to the first IEV more accurately predicting the future inflation index than the second IEV, configuring, by one or more component positioning devices, future configurations of a manufacturing device based on an inflation expectation described by the first IEV. 9. The computer program product of claim 8, wherein the method further comprises:
in response to the first IEV predicting an increase in inflation, configuring, by the one or more component positioning devices, the manufacturing device to produce an increased quantity of goods. 10. The computer program product of claim 8, wherein the method further comprises:
in response to the first IEV predicting a decrease in inflation, configuring, by the one or more component positioning devices, the manufacturing device to produce a decreased quantity of goods. 11. The computer program product of claim 8, wherein the method further comprises:
in response to the first IEV predicting an increase in inflation, adjusting, by the one or more component positioning devices, a feedstock supply mechanism to provide additional feedstock required to manufacture an increased quantity of goods by the manufacturing device. 12. The computer program product of claim 8, wherein the manufacturing device is a robotic manufacturing device, and wherein the method further comprises:
in response to the first IEV predicting an increase in inflation, adjusting, by the one or more component positioning devices, a robotic arm mechanism on the robotic manufacturing device to manufacture an increased quantity of goods. 13. The computer program product of claim 8, wherein the manufacturing device is a robotic manufacturing device, and wherein the method further comprises:
in response to the first IEV predicting an increase in inflation, configuring, by one or more processors, a testing device associated with the robotic manufacturing device to test an increased quantity goods produced by the robotic manufacturing device. 14. The computer program product of claim 8, wherein the manufacturing device is a robotic manufacturing device that utilizes a molding device, and wherein the method further comprises:
in response to the first IEV predicting an increase in inflation, configuring, by the one or more component positioning devices, the molding device to produce an increased quantity of goods. 15. A computer system comprising:
a processor, a computer readable memory, and a non-transitory computer readable storage medium; first program instructions to generate a first inflation expectation value (IEV), wherein the first IEV incorporates a price of a first good; second program instructions to generate a second IEV that incorporates a price of the second good; third program instructions to compare an accuracy of the first IEV to an accuracy of the second IEV in predicting a future inflation index; and fourth program instructions to, in response to the first IEV more accurately predicting the future inflation index than the second IEV, configure, by one or more component positioning devices, future configurations of a manufacturing device based on an inflation expectation described by the first IEV; and wherein
the first, second, third, and fourth program instructions are stored on the computer readable storage medium and executed by the processor via the computer readable memory. 16. The computer system of claim 15, further comprising:
fifth program instructions to, in response to the first IEV predicting an increase in inflation, configure, by the one or more component positioning devices, the manufacturing device to produce an increased quantity of goods; and wherein
the fifth program instructions are stored on the computer readable storage medium and executed by the processor via the computer readable memory. 17. The computer system of claim 15, further comprising:
fifth program instructions to, in response to the first IEV predicting a decrease in inflation, configure, by the one or more component positioning devices, the manufacturing device to produce a decreased quantity of goods; and wherein
the fifth program instructions are stored on the computer readable storage medium and executed by the processor via the computer readable memory. 18. The computer system of claim 15, further comprising:
fifth program instructions to, in response to the first IEV predicting an increase in inflation, adjust, by the one or more component positioning devices, a feedstock supply mechanism to provide additional feedstock required to manufacture an increased quantity of goods by the manufacturing device; and wherein
the fifth program instructions are stored on the computer readable storage medium and executed by the processor via the computer readable memory. 19. The computer system of claim 15, further comprising:
fifth program instructions to, in response to the first IEV predicting an increase in inflation, adjust, by the one or more component positioning devices, a robotic arm mechanism on the robotic manufacturing device to manufacture an increased quantity of goods; and wherein the fifth program instructions are stored on the computer readable storage medium and executed by the processor via the computer readable memory. 20. The computer system of claim 15, further comprising:
fifth program instructions to, in response to the first IEV predicting an increase in inflation, configure a testing device associated with the robotic manufacturing device to test an increased quantity goods produced by the robotic manufacturing device; and wherein the fifth program instructions are stored on the computer readable storage medium and executed by the processor via the computer readable memory. | 2,800 |
12,246 | 12,246 | 16,217,009 | 2,846 | Medical systems and methods for making and using medical systems are disclosed. Example medical systems may include an atherectomy system configured to engage and remove plaque from walls in vessels of a vascular system. The atherectomy system may include a drive shaft, a rotational member coupled to an end of the drive shaft, a motor coupled to the drive shaft to rotate the rotational tip, and a control unit configured to control a motor state of the motor. The motor may be an electric motor. The control unit may adjust the motor state to decelerate the motor in response to detecting a jam or a stall condition. The jam or stall condition may be detected when a speed of the motor or other motor state reaches or goes beyond a threshold value as prescribed by a reference schedule. | 1. A medical device comprising:
a drive shaft; a rotational member coupled to a first end of the drive shaft; a motor coupled to a second end of the drive shaft to rotate the rotational tip; and a control unit configured to control a motor state of the motor, the control unit is further configured to adjust the motor state to decelerate the motor in response to a detected stall condition. 2. The medical device of claim 1, wherein:
the motor state is a torque on the motor; and the stall condition is detected when a speed of the motor reaches or goes beyond a threshold level. 3. The medical device of claim 2, wherein adjusting the torque on the motor includes reversing a direction of torque on the motor. 4. The medical device of claim 1, wherein the control unit is configured to adjust the motor state of the motor by reversing a direction of current provided to the motor to decelerate the motor in response to the detected stall condition. 5. The medical device of claim 1, wherein the control unit is configured to adjust the motor state of the motor by reducing an amount of voltage provided to the motor to decelerate the motor in response to the detected stall condition. 6. The medical device of claim 1, wherein the control unit is configured to adjust the motor state of the motor based on a predetermined motor speed reference schedule and motor parameters received by the control unit during operation of the motor. 7. The medical device of claim 6, wherein the motor parameters include a measurement of current provided to the motor and a measurement of a rotational position of the motor. 8. The medical device of claim 1, further comprising:
a first sensor sensing a current provided to the motor; and a second sensor sensing a position of the motor; and wherein the first sensor provides a signal indicative of a sensed current to the control unit and the second sensor provides a signal indicative of a sensed position to the control unit. 9. The medical device of claim 8, wherein:
the control unit is configured to determine a speed of the motor based on the signal indicative of a sensed position of the motor; and the control unit is configured to determine the motor state of the motor based on the signal indicative of a sensed current and the signal indicative of a sensed position, the determined motor state is a motor state other than the determined speed of the motor. 10. The medical device of claim 9, wherein the control unit is configured to:
determine a reference motor state based on the speed of the motor and compare the determined reference motor state to the determined motor state; and issue a command signal for the motor based on the comparison between the reference motor state to the determined motor state. 11. A control unit for a medical device, the control unit comprising:
a controller; a motor state estimator in communication with the controller; and a reference schedule component in communication with the controller and the motor state estimator, the reference schedule component is configured to provide an output to the controller based on an input from the motor state estimator; wherein the controller is configured to output a control signal for decelerating a motor based on the output received from the reference schedule component when the input to the reference schedule component from the motor state estimator reaches or goes beyond a threshold level. 12. The control unit of claim 11, wherein the input to the reference schedule component from the motor state estimator is a motor speed and the reference schedule component is configured to provide a reference motor state based on the motor speed. 13. The control unit of claim 11, wherein:
the motor state estimator is configured to receive signals indicative of sensed motor parameters and provide an output to the controller based on the received signals indicative of sensed motor parameters; and the outputted control signal is based on the output from the motor state estimator to the controller. 14. The control unit of claim 13, wherein:
the output from the reference schedule component to the controller is a reference motor state and the output from the motor state estimator to the controller is a real time motor state; and the controller is configured to determine the control signal based on a difference between the reference motor state and a real time motor state. 15. The control unit of claim 14, wherein the reference motor state is a reference torque for the motor and the real time motor state is a real time torque of the motor. 16. The control unit of claim 11, further comprising:
a processor; memory in communication with the processor; and an input/output port in communication with the processor; and wherein the processor and the memory are configured to effect operation of the controller and the reference schedule component to output the control signal via the input/output port. 17. A method of controlling a medical device, the method comprising:
receiving signals indicative of a sensed position of a motor; determining a speed of the motor based on the signals indicative of a sensed position of the motor; identifying a reference motor state based on the determined speed of the motor and a predetermined reference schedule; and outputting a control signal to the motor to decelerate the motor, the outputted control signal is based on the reference motor state. 18. The method of claim 17, further comprising:
receiving signals indicative of a sensed current provided to the motor; determining a real time motor state based on the received signals indicative of a sensed motor parameter and the received signals indicative of a sensed current; wherein the outputted control signal is based on the real time motor state. 19. The method of claim 18, wherein the reference motor state is a reference motor torque and the real time motor state is a real time motor torque. 20. The method of claim 17, wherein the control signal to decelerate the motor is outputted to the motor when the determined speed of the motor reaches or goes beyond a threshold level. | Medical systems and methods for making and using medical systems are disclosed. Example medical systems may include an atherectomy system configured to engage and remove plaque from walls in vessels of a vascular system. The atherectomy system may include a drive shaft, a rotational member coupled to an end of the drive shaft, a motor coupled to the drive shaft to rotate the rotational tip, and a control unit configured to control a motor state of the motor. The motor may be an electric motor. The control unit may adjust the motor state to decelerate the motor in response to detecting a jam or a stall condition. The jam or stall condition may be detected when a speed of the motor or other motor state reaches or goes beyond a threshold value as prescribed by a reference schedule.1. A medical device comprising:
a drive shaft; a rotational member coupled to a first end of the drive shaft; a motor coupled to a second end of the drive shaft to rotate the rotational tip; and a control unit configured to control a motor state of the motor, the control unit is further configured to adjust the motor state to decelerate the motor in response to a detected stall condition. 2. The medical device of claim 1, wherein:
the motor state is a torque on the motor; and the stall condition is detected when a speed of the motor reaches or goes beyond a threshold level. 3. The medical device of claim 2, wherein adjusting the torque on the motor includes reversing a direction of torque on the motor. 4. The medical device of claim 1, wherein the control unit is configured to adjust the motor state of the motor by reversing a direction of current provided to the motor to decelerate the motor in response to the detected stall condition. 5. The medical device of claim 1, wherein the control unit is configured to adjust the motor state of the motor by reducing an amount of voltage provided to the motor to decelerate the motor in response to the detected stall condition. 6. The medical device of claim 1, wherein the control unit is configured to adjust the motor state of the motor based on a predetermined motor speed reference schedule and motor parameters received by the control unit during operation of the motor. 7. The medical device of claim 6, wherein the motor parameters include a measurement of current provided to the motor and a measurement of a rotational position of the motor. 8. The medical device of claim 1, further comprising:
a first sensor sensing a current provided to the motor; and a second sensor sensing a position of the motor; and wherein the first sensor provides a signal indicative of a sensed current to the control unit and the second sensor provides a signal indicative of a sensed position to the control unit. 9. The medical device of claim 8, wherein:
the control unit is configured to determine a speed of the motor based on the signal indicative of a sensed position of the motor; and the control unit is configured to determine the motor state of the motor based on the signal indicative of a sensed current and the signal indicative of a sensed position, the determined motor state is a motor state other than the determined speed of the motor. 10. The medical device of claim 9, wherein the control unit is configured to:
determine a reference motor state based on the speed of the motor and compare the determined reference motor state to the determined motor state; and issue a command signal for the motor based on the comparison between the reference motor state to the determined motor state. 11. A control unit for a medical device, the control unit comprising:
a controller; a motor state estimator in communication with the controller; and a reference schedule component in communication with the controller and the motor state estimator, the reference schedule component is configured to provide an output to the controller based on an input from the motor state estimator; wherein the controller is configured to output a control signal for decelerating a motor based on the output received from the reference schedule component when the input to the reference schedule component from the motor state estimator reaches or goes beyond a threshold level. 12. The control unit of claim 11, wherein the input to the reference schedule component from the motor state estimator is a motor speed and the reference schedule component is configured to provide a reference motor state based on the motor speed. 13. The control unit of claim 11, wherein:
the motor state estimator is configured to receive signals indicative of sensed motor parameters and provide an output to the controller based on the received signals indicative of sensed motor parameters; and the outputted control signal is based on the output from the motor state estimator to the controller. 14. The control unit of claim 13, wherein:
the output from the reference schedule component to the controller is a reference motor state and the output from the motor state estimator to the controller is a real time motor state; and the controller is configured to determine the control signal based on a difference between the reference motor state and a real time motor state. 15. The control unit of claim 14, wherein the reference motor state is a reference torque for the motor and the real time motor state is a real time torque of the motor. 16. The control unit of claim 11, further comprising:
a processor; memory in communication with the processor; and an input/output port in communication with the processor; and wherein the processor and the memory are configured to effect operation of the controller and the reference schedule component to output the control signal via the input/output port. 17. A method of controlling a medical device, the method comprising:
receiving signals indicative of a sensed position of a motor; determining a speed of the motor based on the signals indicative of a sensed position of the motor; identifying a reference motor state based on the determined speed of the motor and a predetermined reference schedule; and outputting a control signal to the motor to decelerate the motor, the outputted control signal is based on the reference motor state. 18. The method of claim 17, further comprising:
receiving signals indicative of a sensed current provided to the motor; determining a real time motor state based on the received signals indicative of a sensed motor parameter and the received signals indicative of a sensed current; wherein the outputted control signal is based on the real time motor state. 19. The method of claim 18, wherein the reference motor state is a reference motor torque and the real time motor state is a real time motor torque. 20. The method of claim 17, wherein the control signal to decelerate the motor is outputted to the motor when the determined speed of the motor reaches or goes beyond a threshold level. | 2,800 |
12,247 | 12,247 | 16,147,424 | 2,815 | A sputtering target including an oxide that includes an indium element (In), a tin element (Sn), a zinc element (Zn) and an aluminum element (Al), and including a homologous structure compound represented by InAlO 3 (ZnO) m (m is 0.1 to 10), wherein the atomic ratio of the indium element, the tin element, the zinc element and the aluminum element satisfies specific requirements. | 1. A thin film transistor comprising, as a channel layer, the oxide semiconductor thin film that comprises indium, tin, zinc and aluminum, in an atomic ratio that satisfies the following formulas (1) to (4):
0.10≤In/(In+Sn+Zn+Al)≤0.60 (1)
0.01≤Sn/(In+Sn+Zn+Al)≤0.30 (2)
0.10≤Zn/(In+Sn+Zn+Al)≤0.65 (3)
0.01≤Al/(In+Sn+Zn+Al)≤0.30 (4). 2. A thin film transistor according to claim 1, wherein the oxide semiconductor thin film comprises indium in an atomic ratio that satisfies the following formulas:
0.20≤In/(In+Sn+Zn+Al)≤0.60. 3. The thin film transistor according to claim 1 that has a field effect mobility of 15 cm2/Vs or more. 4. A display comprising the thin film transistor according to claim 1. | A sputtering target including an oxide that includes an indium element (In), a tin element (Sn), a zinc element (Zn) and an aluminum element (Al), and including a homologous structure compound represented by InAlO 3 (ZnO) m (m is 0.1 to 10), wherein the atomic ratio of the indium element, the tin element, the zinc element and the aluminum element satisfies specific requirements.1. A thin film transistor comprising, as a channel layer, the oxide semiconductor thin film that comprises indium, tin, zinc and aluminum, in an atomic ratio that satisfies the following formulas (1) to (4):
0.10≤In/(In+Sn+Zn+Al)≤0.60 (1)
0.01≤Sn/(In+Sn+Zn+Al)≤0.30 (2)
0.10≤Zn/(In+Sn+Zn+Al)≤0.65 (3)
0.01≤Al/(In+Sn+Zn+Al)≤0.30 (4). 2. A thin film transistor according to claim 1, wherein the oxide semiconductor thin film comprises indium in an atomic ratio that satisfies the following formulas:
0.20≤In/(In+Sn+Zn+Al)≤0.60. 3. The thin film transistor according to claim 1 that has a field effect mobility of 15 cm2/Vs or more. 4. A display comprising the thin film transistor according to claim 1. | 2,800 |
12,248 | 12,248 | 15,111,011 | 2,865 | Methods and systems for processing seismic data are presented. Primary wave (P) seismic data (PP data) and shear wave (P) seismic data (PS data) are jointly inverted as part of a nonlinear tomography process which adheres to one or more co-depthing constraints. | 1. A method for processing seismic data comprising:
jointly inverting primary wave (P) seismic data (PP data) and shear wave (S) seismic data (PS data) as part of a nonlinear tomography process which adheres to one or more co-depthing constraints. 2. The method of claim 1, wherein the one or more co-depthing constraints includes a volumetric constraint. 3. The method of claim 2, wherein the volumetric constraint is based on a Vp/Vs ratio. 4. The method of claim 3, wherein the Vp/Vs ratio is determined by:
Iteratively filtering PS and PP images associated with the seismic data until a misalignment criterion is satisfied. 5. The method of claim 1, wherein the one or more co-depthing constraints includes a reflector constraint which minimizes discrepancies between kinematically re-migrated seismic reflectors in PP and PS domains. 6. The method of claim 1, wherein the step of jointly inverting primary wave (PP) and shear wave (PS) seismic data as part of the nonlinear tomography process which adheres to one or more co-depthing constraints further comprises:
kinematically re-migrating the seismic data using PP and PS residual moveout (RMO) invariants and at least one of P or S horizon invariants; evaluating a cost function which includes at least one term associated with the one or more co-depthing constraints; performing a linear update of multi-layer velocity attributes using an output of the evaluating step which is constrained by co-depthing; and repositioning the at least one of the P or S horizons. 7. The method of claim 6, wherein the four steps are iterated as part of an update loop until an exit criterion is satisfied. 8. The method of claim 7, further comprising:
outputting final pre-stack depth migrated seismic data when the exit criterion is satisfied; and generating an image of a subsurface using the final pre-stack depth migrated seismic data. 9. A computer system for processing seismic data comprising:
an interface configured to receive seismic data; and at least one processor configured to jointly invert primary wave (P) seismic data (PP data) and shear wave (S) seismic data (PS data) as part of a nonlinear tomography process which adheres to one or more co-depthing constraints. 10. The system of claim 9, wherein the one or more co-depthing constraints includes a volumetric constraint. 11. The system of claim 10, wherein the volumetric constraint is based on a Vp/Vs ratio. 12. The system of claim 11, wherein the Vp/Vs ratio is determined by the at least one processor being configured to iteratively filtering PS and PP images associated with the seismic data until a misalignment criterion is satisfied. 13. The system of claim 9, wherein the one or more co-depthing constraints includes a reflector constraint which minimizes discrepancies between kinematically re-migrated seismic reflectors in PP and PS domains. 14. The system of claim 9, wherein the at least one processor is configured to jointly invert primary wave (PP) and shear wave (PS) seismic data as part of the nonlinear tomography process which adheres to one or more co-depthing constraints by:
kinematically re-migrating the seismic data using PP and PS residual moveout (RMO) invariants and at least one of P or S horizon invariants; evaluating a cost function which includes at least one term associated with the one or more co-depthing constraints; performing a linear update of multi-layer velocity attributes using an output of the evaluating step which is constrained by co-depthing; and repositioning the at least one of the P or S horizons. 15. The system of claim 14, wherein the at last one processor is configured to iterate the steps of kinematically re-migrating, evaluating, performing and repositioning as part of an update loop until an exit criterion is satisfied. 16. The system of claim 15, wherein the at least one processor is further configured to output final pre-stack depth migrated seismic data when the exit criterion is satisfied; and wherein the at least one processor and the interface are configured to generate an image of a subsurface using the final pre-stack depth migrated seismic data. 17. A method for updating parameters associated with seismic data which includes pressure wave (PP) data and shear wave (PS) data, the method comprising:
computing matching filters between a PP image and a PS image at a plurality of lateral positions of the seismic data; and minimizing an objective function of non-zero lag coefficients of the matching filters. 18. The method of claim 17, further comprising:
updating at least one of a P-velocity model (Vp) and an S-velocity model (Vs) based on the steps of computing and minimizing. 19. The method of claim 17, further comprising:
preconditioning at least one of the PP image and the PS image to increase an initial similarity between the PP image and the PS image in terms of frequency content. 20. The method of claim 17, further comprising:
computing a gradient of the objective function; and performing a local gradient-based optimization using the gradient to iteratively update an S-wave velocity model associated with the seismic data. | Methods and systems for processing seismic data are presented. Primary wave (P) seismic data (PP data) and shear wave (P) seismic data (PS data) are jointly inverted as part of a nonlinear tomography process which adheres to one or more co-depthing constraints.1. A method for processing seismic data comprising:
jointly inverting primary wave (P) seismic data (PP data) and shear wave (S) seismic data (PS data) as part of a nonlinear tomography process which adheres to one or more co-depthing constraints. 2. The method of claim 1, wherein the one or more co-depthing constraints includes a volumetric constraint. 3. The method of claim 2, wherein the volumetric constraint is based on a Vp/Vs ratio. 4. The method of claim 3, wherein the Vp/Vs ratio is determined by:
Iteratively filtering PS and PP images associated with the seismic data until a misalignment criterion is satisfied. 5. The method of claim 1, wherein the one or more co-depthing constraints includes a reflector constraint which minimizes discrepancies between kinematically re-migrated seismic reflectors in PP and PS domains. 6. The method of claim 1, wherein the step of jointly inverting primary wave (PP) and shear wave (PS) seismic data as part of the nonlinear tomography process which adheres to one or more co-depthing constraints further comprises:
kinematically re-migrating the seismic data using PP and PS residual moveout (RMO) invariants and at least one of P or S horizon invariants; evaluating a cost function which includes at least one term associated with the one or more co-depthing constraints; performing a linear update of multi-layer velocity attributes using an output of the evaluating step which is constrained by co-depthing; and repositioning the at least one of the P or S horizons. 7. The method of claim 6, wherein the four steps are iterated as part of an update loop until an exit criterion is satisfied. 8. The method of claim 7, further comprising:
outputting final pre-stack depth migrated seismic data when the exit criterion is satisfied; and generating an image of a subsurface using the final pre-stack depth migrated seismic data. 9. A computer system for processing seismic data comprising:
an interface configured to receive seismic data; and at least one processor configured to jointly invert primary wave (P) seismic data (PP data) and shear wave (S) seismic data (PS data) as part of a nonlinear tomography process which adheres to one or more co-depthing constraints. 10. The system of claim 9, wherein the one or more co-depthing constraints includes a volumetric constraint. 11. The system of claim 10, wherein the volumetric constraint is based on a Vp/Vs ratio. 12. The system of claim 11, wherein the Vp/Vs ratio is determined by the at least one processor being configured to iteratively filtering PS and PP images associated with the seismic data until a misalignment criterion is satisfied. 13. The system of claim 9, wherein the one or more co-depthing constraints includes a reflector constraint which minimizes discrepancies between kinematically re-migrated seismic reflectors in PP and PS domains. 14. The system of claim 9, wherein the at least one processor is configured to jointly invert primary wave (PP) and shear wave (PS) seismic data as part of the nonlinear tomography process which adheres to one or more co-depthing constraints by:
kinematically re-migrating the seismic data using PP and PS residual moveout (RMO) invariants and at least one of P or S horizon invariants; evaluating a cost function which includes at least one term associated with the one or more co-depthing constraints; performing a linear update of multi-layer velocity attributes using an output of the evaluating step which is constrained by co-depthing; and repositioning the at least one of the P or S horizons. 15. The system of claim 14, wherein the at last one processor is configured to iterate the steps of kinematically re-migrating, evaluating, performing and repositioning as part of an update loop until an exit criterion is satisfied. 16. The system of claim 15, wherein the at least one processor is further configured to output final pre-stack depth migrated seismic data when the exit criterion is satisfied; and wherein the at least one processor and the interface are configured to generate an image of a subsurface using the final pre-stack depth migrated seismic data. 17. A method for updating parameters associated with seismic data which includes pressure wave (PP) data and shear wave (PS) data, the method comprising:
computing matching filters between a PP image and a PS image at a plurality of lateral positions of the seismic data; and minimizing an objective function of non-zero lag coefficients of the matching filters. 18. The method of claim 17, further comprising:
updating at least one of a P-velocity model (Vp) and an S-velocity model (Vs) based on the steps of computing and minimizing. 19. The method of claim 17, further comprising:
preconditioning at least one of the PP image and the PS image to increase an initial similarity between the PP image and the PS image in terms of frequency content. 20. The method of claim 17, further comprising:
computing a gradient of the objective function; and performing a local gradient-based optimization using the gradient to iteratively update an S-wave velocity model associated with the seismic data. | 2,800 |
12,249 | 12,249 | 16,235,550 | 2,892 | A semiconductor device includes a semiconductor body includes a first side and a second side opposite to the first side, a first dielectric disposed on the first side, a second dielectric disposed on the second side, one or more FET devices disposed at the first side, a first contact trench extending through the first dielectric at the first side, a first conductive material disposed in the first contact trench and electrically connected to the semiconductor body, a second contact trench extending through the second dielectric and into the semiconductor body at the second side, and a second conductive material disposed in the second contact trench and electrically connected to the semiconductor body at sidewalls of the second contact trench. | 1. A semiconductor device, comprising:
a semiconductor body including a first side and a second side opposite to the first side; a first dielectric disposed on the first side; a second dielectric disposed on the second side; one or more FET devices disposed at the first side; a first contact trench extending through the first dielectric at the first side; a first conductive material disposed in the first contact trench and electrically connected to the semiconductor body; a second contact trench extending through the second dielectric and into the semiconductor body at the second side; a second conductive material disposed in the second contact trench and electrically connected to the semiconductor body at sidewalls of the second contact trench. 2. The semiconductor device of claim 1, wherein the one or more FET devices comprise a planar FET, the planar FET comprising a first conductivity type source region that extends to the first side, and wherein the first conductive material directly adjoins and is electrically connected to first conductivity type source region. 3. The semiconductor device of claim 2, wherein the semiconductor body further comprises a second conductivity type body region disposed at the second side, and wherein the second conductive material directly adjoins and is electrically connected to the body region at the sidewalls of the second contact trench. 4. The semiconductor device of claim 3, wherein the one or more FET devices further comprise:
a vertical FET, the vertical FET comprising a first conductivity type source region that extends to the first side and a second conductivity type body region disposed beneath the source region of the vertical FET; a third contact trench extending through the first dielectric at the first side; a third conductive material disposed in the third contact trench and electrically connected to the semiconductor body, wherein the third conductive material directly adjoins and is electrically connected to the source and body regions of the vertical FET at sidewalls of the third contact trench. 5. The semiconductor device of claim 4, further comprising:
a fourth contact trench extending through the second dielectric at the second side; a fourth conductive material disposed in the fourth contact trench and electrically connected to the semiconductor body, wherein the semiconductor body further comprises a further second conductivity type region disposed at the second side, and wherein the third conductive material directly adjoins and is electrically connected to the further second conductivity type region. 6. The semiconductor device of claim 5, wherein the second contact trench is directly below the planar FET, and wherein the fourth contact trench is directly below the vertical FET. 7. The semiconductor device of claim 5, further comprising:
a fifth contact trench extending through the second dielectric at the second side; and a fifth conductive material disposed in the fifth contact trench and electrically connected to the semiconductor body, wherein the semiconductor body further comprises a first conductivity type region disposed at the second side, the first conductivity type having a higher dopant concentration than immediately adjacent semiconductor material of the semiconductor body, and wherein the fifth conductive material directly adjoins and is electrically connected to the first conductivity type region. 8. The semiconductor device of claim 1, further comprising a first contact pattern surrounded by the first dielectric at the first side, and a second contact pattern surrounded by the second dielectric at the second side. 9. The semiconductor device of claim 8, wherein the second contact pattern and the second conductive material are formed of a continuous and same material. 10. The semiconductor device of claim 8, wherein a part of the second contact pattern is in contact with a surface of the semiconductor body at the second side. 11. The semiconductor device of claim 8, wherein a part of the second contact pattern is in contact with the second conductive material. 12. The semiconductor device of claim 8, wherein the second dielectric is sandwiched between the semiconductor body and a part of a third wiring pattern. 13. The semiconductor device of claim 1, wherein the first and second conductive materials include one or a combination of Ti, TiN, W, TiW, Ta, Cu, Al, AlSiCu, and AlCu. 14. The semiconductor device of claim 1, wherein at least one of the first and second contact trenches is at least partly filled with a metal or metal alloy configured to induce a compressive strain in the semiconductor body surrounding the second contact trench. 15. The semiconductor device of claim 1, wherein a width of the second contact trench ranges between 0.1 μm and 10 μm, and wherein a depth of the second contact trench ranges between 0.1 μm and 50 μm. 16. The semiconductor device of claim 1, wherein an angle between a sidewall of the second contact trench and a direction perpendicular to the second side ranges between 0° and 44°. 17. The semiconductor device of claim 1, wherein the semiconductor device comprises a plurality of the second contact trenches, wherein the plurality of second contact trenches differ by at least one of shape, layout, and depth. 18. The semiconductor device of claim 1, wherein the semiconductor device comprises a plurality of the second contact trenches, wherein the plurality of the second contact trenches includes a first number of the second contact trenches in a cell array and a second number of the second trenches in an edge area surrounding the cell array, and wherein a percentage of area of the second number of the second contact trenches in the edge area is higher than a percentage of area of the first number of the second contact trenches in the cell array. 19. A semiconductor device, comprising:
a semiconductor body including a first side and a second side opposite to the first side, the semiconductor body comprising a semiconductor material of a first conductivity type; a gate formed at the first side; a first contact trench extending through a first dielectric and into the semiconductor body at the first side, wherein the first contact trench includes a first conductive material electrically connected to the semiconductor body adjoining the first contact trench via sidewalls of the first contact trench; a second contact trench extending through a second dielectric and into the semiconductor body at the second side, wherein the second contact trench includes a second conductive material; a first contact pattern laterally completely surrounded by the first dielectric at the first side; and a second contact pattern laterally completely surrounded by the second dielectric at the second side, wherein lower sidewall portions of the second contact trench that extend between the second side and a bottom side of the contact trench directly interface with the semiconductor body, wherein the second conductive material is electrically connected to the semiconductor body via the lower sidewall portions of the second contact trench, wherein the second conductive material is electrically connected to a first semiconductor region of the first conductivity type via the lower sidewall portions of the second contact trench; and wherein the second conductive material is electrically connected to a second semiconductor region of a second conductivity type via the bottom side of the second contact trench. 20. A semiconductor device, comprising:
a semiconductor body including a first side and a second side opposite to the first side, the semiconductor body comprising a semiconductor material of a first conductivity type; a gate formed at the first side; a first contact trench extending through a first dielectric and into the semiconductor body at the first side, wherein the first contact trench includes a first conductive material electrically connected to the semiconductor body adjoining the first contact trench via sidewalls of the first contact trench; a second contact trench extending through a second dielectric and into the semiconductor body at the second side, wherein the second contact trench includes a second conductive material; a first contact pattern laterally completely surrounded by the first dielectric at the first side; and a second contact pattern laterally completely surrounded by the second dielectric at the second side, wherein lower sidewall portions of the second contact trench that extend between the second side and a bottom side of the contact trench directly interface with the semiconductor body, wherein the second conductive material is electrically connected to the semiconductor body via the lower sidewall portions of the second contact trench, wherein the second conductive material is electrically connected to a first semiconductor region of a second conductivity type via the lower sidewall portions of the second contact trench; and the second conductive material is electrically coupled to a second semiconductor region of the first conductivity type via the bottom side of the second contact trench. | A semiconductor device includes a semiconductor body includes a first side and a second side opposite to the first side, a first dielectric disposed on the first side, a second dielectric disposed on the second side, one or more FET devices disposed at the first side, a first contact trench extending through the first dielectric at the first side, a first conductive material disposed in the first contact trench and electrically connected to the semiconductor body, a second contact trench extending through the second dielectric and into the semiconductor body at the second side, and a second conductive material disposed in the second contact trench and electrically connected to the semiconductor body at sidewalls of the second contact trench.1. A semiconductor device, comprising:
a semiconductor body including a first side and a second side opposite to the first side; a first dielectric disposed on the first side; a second dielectric disposed on the second side; one or more FET devices disposed at the first side; a first contact trench extending through the first dielectric at the first side; a first conductive material disposed in the first contact trench and electrically connected to the semiconductor body; a second contact trench extending through the second dielectric and into the semiconductor body at the second side; a second conductive material disposed in the second contact trench and electrically connected to the semiconductor body at sidewalls of the second contact trench. 2. The semiconductor device of claim 1, wherein the one or more FET devices comprise a planar FET, the planar FET comprising a first conductivity type source region that extends to the first side, and wherein the first conductive material directly adjoins and is electrically connected to first conductivity type source region. 3. The semiconductor device of claim 2, wherein the semiconductor body further comprises a second conductivity type body region disposed at the second side, and wherein the second conductive material directly adjoins and is electrically connected to the body region at the sidewalls of the second contact trench. 4. The semiconductor device of claim 3, wherein the one or more FET devices further comprise:
a vertical FET, the vertical FET comprising a first conductivity type source region that extends to the first side and a second conductivity type body region disposed beneath the source region of the vertical FET; a third contact trench extending through the first dielectric at the first side; a third conductive material disposed in the third contact trench and electrically connected to the semiconductor body, wherein the third conductive material directly adjoins and is electrically connected to the source and body regions of the vertical FET at sidewalls of the third contact trench. 5. The semiconductor device of claim 4, further comprising:
a fourth contact trench extending through the second dielectric at the second side; a fourth conductive material disposed in the fourth contact trench and electrically connected to the semiconductor body, wherein the semiconductor body further comprises a further second conductivity type region disposed at the second side, and wherein the third conductive material directly adjoins and is electrically connected to the further second conductivity type region. 6. The semiconductor device of claim 5, wherein the second contact trench is directly below the planar FET, and wherein the fourth contact trench is directly below the vertical FET. 7. The semiconductor device of claim 5, further comprising:
a fifth contact trench extending through the second dielectric at the second side; and a fifth conductive material disposed in the fifth contact trench and electrically connected to the semiconductor body, wherein the semiconductor body further comprises a first conductivity type region disposed at the second side, the first conductivity type having a higher dopant concentration than immediately adjacent semiconductor material of the semiconductor body, and wherein the fifth conductive material directly adjoins and is electrically connected to the first conductivity type region. 8. The semiconductor device of claim 1, further comprising a first contact pattern surrounded by the first dielectric at the first side, and a second contact pattern surrounded by the second dielectric at the second side. 9. The semiconductor device of claim 8, wherein the second contact pattern and the second conductive material are formed of a continuous and same material. 10. The semiconductor device of claim 8, wherein a part of the second contact pattern is in contact with a surface of the semiconductor body at the second side. 11. The semiconductor device of claim 8, wherein a part of the second contact pattern is in contact with the second conductive material. 12. The semiconductor device of claim 8, wherein the second dielectric is sandwiched between the semiconductor body and a part of a third wiring pattern. 13. The semiconductor device of claim 1, wherein the first and second conductive materials include one or a combination of Ti, TiN, W, TiW, Ta, Cu, Al, AlSiCu, and AlCu. 14. The semiconductor device of claim 1, wherein at least one of the first and second contact trenches is at least partly filled with a metal or metal alloy configured to induce a compressive strain in the semiconductor body surrounding the second contact trench. 15. The semiconductor device of claim 1, wherein a width of the second contact trench ranges between 0.1 μm and 10 μm, and wherein a depth of the second contact trench ranges between 0.1 μm and 50 μm. 16. The semiconductor device of claim 1, wherein an angle between a sidewall of the second contact trench and a direction perpendicular to the second side ranges between 0° and 44°. 17. The semiconductor device of claim 1, wherein the semiconductor device comprises a plurality of the second contact trenches, wherein the plurality of second contact trenches differ by at least one of shape, layout, and depth. 18. The semiconductor device of claim 1, wherein the semiconductor device comprises a plurality of the second contact trenches, wherein the plurality of the second contact trenches includes a first number of the second contact trenches in a cell array and a second number of the second trenches in an edge area surrounding the cell array, and wherein a percentage of area of the second number of the second contact trenches in the edge area is higher than a percentage of area of the first number of the second contact trenches in the cell array. 19. A semiconductor device, comprising:
a semiconductor body including a first side and a second side opposite to the first side, the semiconductor body comprising a semiconductor material of a first conductivity type; a gate formed at the first side; a first contact trench extending through a first dielectric and into the semiconductor body at the first side, wherein the first contact trench includes a first conductive material electrically connected to the semiconductor body adjoining the first contact trench via sidewalls of the first contact trench; a second contact trench extending through a second dielectric and into the semiconductor body at the second side, wherein the second contact trench includes a second conductive material; a first contact pattern laterally completely surrounded by the first dielectric at the first side; and a second contact pattern laterally completely surrounded by the second dielectric at the second side, wherein lower sidewall portions of the second contact trench that extend between the second side and a bottom side of the contact trench directly interface with the semiconductor body, wherein the second conductive material is electrically connected to the semiconductor body via the lower sidewall portions of the second contact trench, wherein the second conductive material is electrically connected to a first semiconductor region of the first conductivity type via the lower sidewall portions of the second contact trench; and wherein the second conductive material is electrically connected to a second semiconductor region of a second conductivity type via the bottom side of the second contact trench. 20. A semiconductor device, comprising:
a semiconductor body including a first side and a second side opposite to the first side, the semiconductor body comprising a semiconductor material of a first conductivity type; a gate formed at the first side; a first contact trench extending through a first dielectric and into the semiconductor body at the first side, wherein the first contact trench includes a first conductive material electrically connected to the semiconductor body adjoining the first contact trench via sidewalls of the first contact trench; a second contact trench extending through a second dielectric and into the semiconductor body at the second side, wherein the second contact trench includes a second conductive material; a first contact pattern laterally completely surrounded by the first dielectric at the first side; and a second contact pattern laterally completely surrounded by the second dielectric at the second side, wherein lower sidewall portions of the second contact trench that extend between the second side and a bottom side of the contact trench directly interface with the semiconductor body, wherein the second conductive material is electrically connected to the semiconductor body via the lower sidewall portions of the second contact trench, wherein the second conductive material is electrically connected to a first semiconductor region of a second conductivity type via the lower sidewall portions of the second contact trench; and the second conductive material is electrically coupled to a second semiconductor region of the first conductivity type via the bottom side of the second contact trench. | 2,800 |
12,250 | 12,250 | 15,951,003 | 2,814 | A semiconductor package includes a leadframe, a semiconductor die attached to the leadframe, and a passive component electrically connected to the semiconductor die through the leadframe. The leadframe includes a cavity in a side of the leadframe opposite the semiconductor die, and at least a portion of the passive component resides within the cavity in a stacked arrangement. | 1. A semiconductor package, comprising:
a leadframe; a semiconductor die attached to the leadframe; and a passive component electrically connected to the semiconductor die through the leadframe; the leadframe including a cavity in a side of the leadframe opposite the semiconductor die, and at least a portion of the passive component residing within the cavity. 2. The semiconductor package of claim 1, wherein the leadframe has a portion etched from a side opposite the semiconductor die and directly beneath the cavity, and the etched portion is filled with a pre-mold compound. 3. The semiconductor package of claim 1, wherein a recess is formed in the cavity of the leadframe to electrically isolate electrical terminals of the passive component. 4. The semiconductor package of claim 1, wherein the leadframe has a thickness T, and the cavity has a depth of approximately 75% of T. 5. The semiconductor package of claim 1, wherein no portion of the passive component protrudes out of the cavity. 6. The semiconductor package of claim 1, wherein the passive component is a capacitor. 7. The semiconductor package of claim 1, further comprising a plurality of metal posts for attachment of the semiconductor die to the leadframe. 8. The semiconductor package of claim 1, further comprising a mold compound encapsulating at least the semiconductor die and passive component. 9. A method, comprising:
etching a conductive member to form a leadframe for a semiconductor die; etching the leadframe to form a cavity; attaching a passive component to the leadframe inside the cavity; and attaching the semiconductor die to the leadframe on a side of the leadframe opposite the cavity. 10. The method of claim 9, wherein a height of the passive component is less than a depth of the cavity. 11. The method of claim 9, wherein the leadframe has a thickness of T, and etching the leadframe to form the cavity includes etching the leadframe to a depth of approximately 75% of T. 12. The method of claim 9, further comprising etching a recess in the cavity to electrically isolate terminals of the passive component. 13. The method of claim 12, further comprising filling the recess with a pre-mold compound. 14. The method of claim 9, wherein the passive component is a capacitor. 15. A semiconductor package, comprising:
a leadframe; a semiconductor die attached to the leadframe; and a capacitor electrically connected to the semiconductor die through the leadframe; the leadframe including a cavity in which the capacitor resides on a side of the leadframe opposite the semiconductor die. 16. The semiconductor package of claim 15, wherein no portion of the capacitor protrudes out of the cavity. 17. The semiconductor package of claim 15, wherein the leadframe has a portion etched from a side facing the semiconductor die and directly adjacent the cavity. 18. The semiconductor package of claim 15, wherein the etched portion is filled with a pre-mold compound. 19. The semiconductor package of claim 15, wherein the leadframe has a thickness T, and the cavity has a depth of approximately 75% of T. 20. The semiconductor package of claim 15, further comprising a plurality of metal posts on a surface of the leadframe opposite the cavity for attachment of the semiconductor die to the leadframe. | A semiconductor package includes a leadframe, a semiconductor die attached to the leadframe, and a passive component electrically connected to the semiconductor die through the leadframe. The leadframe includes a cavity in a side of the leadframe opposite the semiconductor die, and at least a portion of the passive component resides within the cavity in a stacked arrangement.1. A semiconductor package, comprising:
a leadframe; a semiconductor die attached to the leadframe; and a passive component electrically connected to the semiconductor die through the leadframe; the leadframe including a cavity in a side of the leadframe opposite the semiconductor die, and at least a portion of the passive component residing within the cavity. 2. The semiconductor package of claim 1, wherein the leadframe has a portion etched from a side opposite the semiconductor die and directly beneath the cavity, and the etched portion is filled with a pre-mold compound. 3. The semiconductor package of claim 1, wherein a recess is formed in the cavity of the leadframe to electrically isolate electrical terminals of the passive component. 4. The semiconductor package of claim 1, wherein the leadframe has a thickness T, and the cavity has a depth of approximately 75% of T. 5. The semiconductor package of claim 1, wherein no portion of the passive component protrudes out of the cavity. 6. The semiconductor package of claim 1, wherein the passive component is a capacitor. 7. The semiconductor package of claim 1, further comprising a plurality of metal posts for attachment of the semiconductor die to the leadframe. 8. The semiconductor package of claim 1, further comprising a mold compound encapsulating at least the semiconductor die and passive component. 9. A method, comprising:
etching a conductive member to form a leadframe for a semiconductor die; etching the leadframe to form a cavity; attaching a passive component to the leadframe inside the cavity; and attaching the semiconductor die to the leadframe on a side of the leadframe opposite the cavity. 10. The method of claim 9, wherein a height of the passive component is less than a depth of the cavity. 11. The method of claim 9, wherein the leadframe has a thickness of T, and etching the leadframe to form the cavity includes etching the leadframe to a depth of approximately 75% of T. 12. The method of claim 9, further comprising etching a recess in the cavity to electrically isolate terminals of the passive component. 13. The method of claim 12, further comprising filling the recess with a pre-mold compound. 14. The method of claim 9, wherein the passive component is a capacitor. 15. A semiconductor package, comprising:
a leadframe; a semiconductor die attached to the leadframe; and a capacitor electrically connected to the semiconductor die through the leadframe; the leadframe including a cavity in which the capacitor resides on a side of the leadframe opposite the semiconductor die. 16. The semiconductor package of claim 15, wherein no portion of the capacitor protrudes out of the cavity. 17. The semiconductor package of claim 15, wherein the leadframe has a portion etched from a side facing the semiconductor die and directly adjacent the cavity. 18. The semiconductor package of claim 15, wherein the etched portion is filled with a pre-mold compound. 19. The semiconductor package of claim 15, wherein the leadframe has a thickness T, and the cavity has a depth of approximately 75% of T. 20. The semiconductor package of claim 15, further comprising a plurality of metal posts on a surface of the leadframe opposite the cavity for attachment of the semiconductor die to the leadframe. | 2,800 |
12,251 | 12,251 | 16,541,365 | 2,835 | An electronic device includes a housing defining an exterior shape of the electronic device, a processor, a power supply structured to receive line power and to convert the line power for use by the electronic device, a storage unit structured to store data, and a number of data interfaces structured to receive a data connection. The electronic device has a particular form factor that is compatible with positions in a circuit breaker receiving area of a load center. The electronic device is structured to provide the functionality of at least one of a set-top box, a network data interface, a telephone base station, a security system hub and a home controller. | 1. An electronic device comprising:
a housing defining an exterior shape of the electronic device; and a processor structured to control operations of the electronic device, wherein the electronic device has a particular form factor that is compatible with positions in a circuit breaker receiving area of a load center, and wherein the electronic device is structured to provide the functionality of a security system hub. 2. The electronic device of claim 1, further comprising:
a wireless communication unit structured to wirelessly communicate with one or more external devices. 3. The electronic device of claim 2, wherein the one or more external devices include at least one of a computer, a tablet and a mobile phone. 4. The electronic device of claim 2, wherein the wireless communication unit is structured to communicate using at least one of cellular, wi-fi, Bluetooth, Zigbee or Z-wave protocols. 5. The electronic device of claim 1, further comprising:
a number of data interfaces structured to receive a data connection. 6. The electronic device of claim 5, wherein the number of data interfaces are security system interfaces structured to connect to components of a security system. 7. The electronic device of claim 1, further comprising:
a power supply structured to receive line power and to convert the line power for use by the electronic device, wherein the power supply is structured to convert alternating current power to direct current power. 8. The electronic device of claim 1, wherein the electronic device is structured to communicate with one or more security system elements. 9. The electronic device of claim 1, wherein the electronic device is structured initiate one or more alarms or notify one or more external parties of one or more security events. 10. A load center comprising:
a circuit breaker receiving area including a number of positions; and a number of electronic devices installed in at least one of the number of positions, wherein at least one of the electronic devices provides functionality of a security system hub. 11. The load center of claim 10, further comprising:
a number of circuit breakers installed in at least one of the number of positions. 12. The load center of claim 10, wherein at least one of the number of electronic devices includes:
a housing defining an exterior shape of the at least one electronic device; a processor; a power supply structured to receive line power and to convert the line power for use by the at least one electronic device; a storage unit structured to store data; and a number of data interfaces structured to receive a data connection. 13. The load center of claim 12, wherein the number of data interfaces are security system interfaces structured to connect to components of a security system. 14. The load center of claim 12, wherein the at least one electronic device further includes:
a wireless communication unit structured to wirelessly communicate with one or more external devices. 15. The load center of claim 14, wherein the one or more external devices include at least one of a computer, a tablet and a mobile phone. 16. The load center device of claim 14, wherein the wireless communication unit is structured to communicate using at least one of cellular, wi-fi, Bluetooth, Zigbee or Z-wave protocols. 17. The load center of claim 12, wherein the power supply is structured to convert alternating current power to direct current power. 18. The load center of claim 10, wherein the at least one electronic device further includes:
an interface area including one or more of indicator lights and a display and being structured to provide indication of a status of the electronic device. 19. The load center of claim 10, wherein the at least one electronic device is structured initiate one or more alarms or notify one or more external parties of one or more security events. 20. A system comprising:
a load center comprising:
a circuit breaker receiving area including a number of positions; and
a number of electronic devices installed in at least one of the number of positions, wherein at least one of the electronic devices provides functionality of a security system hub; and
at least one security element, wherein the at least one electronic device is structured to communicate with the at least one security element and to initiate one or more alarms or notify one or more external parties of one or more security events. | An electronic device includes a housing defining an exterior shape of the electronic device, a processor, a power supply structured to receive line power and to convert the line power for use by the electronic device, a storage unit structured to store data, and a number of data interfaces structured to receive a data connection. The electronic device has a particular form factor that is compatible with positions in a circuit breaker receiving area of a load center. The electronic device is structured to provide the functionality of at least one of a set-top box, a network data interface, a telephone base station, a security system hub and a home controller.1. An electronic device comprising:
a housing defining an exterior shape of the electronic device; and a processor structured to control operations of the electronic device, wherein the electronic device has a particular form factor that is compatible with positions in a circuit breaker receiving area of a load center, and wherein the electronic device is structured to provide the functionality of a security system hub. 2. The electronic device of claim 1, further comprising:
a wireless communication unit structured to wirelessly communicate with one or more external devices. 3. The electronic device of claim 2, wherein the one or more external devices include at least one of a computer, a tablet and a mobile phone. 4. The electronic device of claim 2, wherein the wireless communication unit is structured to communicate using at least one of cellular, wi-fi, Bluetooth, Zigbee or Z-wave protocols. 5. The electronic device of claim 1, further comprising:
a number of data interfaces structured to receive a data connection. 6. The electronic device of claim 5, wherein the number of data interfaces are security system interfaces structured to connect to components of a security system. 7. The electronic device of claim 1, further comprising:
a power supply structured to receive line power and to convert the line power for use by the electronic device, wherein the power supply is structured to convert alternating current power to direct current power. 8. The electronic device of claim 1, wherein the electronic device is structured to communicate with one or more security system elements. 9. The electronic device of claim 1, wherein the electronic device is structured initiate one or more alarms or notify one or more external parties of one or more security events. 10. A load center comprising:
a circuit breaker receiving area including a number of positions; and a number of electronic devices installed in at least one of the number of positions, wherein at least one of the electronic devices provides functionality of a security system hub. 11. The load center of claim 10, further comprising:
a number of circuit breakers installed in at least one of the number of positions. 12. The load center of claim 10, wherein at least one of the number of electronic devices includes:
a housing defining an exterior shape of the at least one electronic device; a processor; a power supply structured to receive line power and to convert the line power for use by the at least one electronic device; a storage unit structured to store data; and a number of data interfaces structured to receive a data connection. 13. The load center of claim 12, wherein the number of data interfaces are security system interfaces structured to connect to components of a security system. 14. The load center of claim 12, wherein the at least one electronic device further includes:
a wireless communication unit structured to wirelessly communicate with one or more external devices. 15. The load center of claim 14, wherein the one or more external devices include at least one of a computer, a tablet and a mobile phone. 16. The load center device of claim 14, wherein the wireless communication unit is structured to communicate using at least one of cellular, wi-fi, Bluetooth, Zigbee or Z-wave protocols. 17. The load center of claim 12, wherein the power supply is structured to convert alternating current power to direct current power. 18. The load center of claim 10, wherein the at least one electronic device further includes:
an interface area including one or more of indicator lights and a display and being structured to provide indication of a status of the electronic device. 19. The load center of claim 10, wherein the at least one electronic device is structured initiate one or more alarms or notify one or more external parties of one or more security events. 20. A system comprising:
a load center comprising:
a circuit breaker receiving area including a number of positions; and
a number of electronic devices installed in at least one of the number of positions, wherein at least one of the electronic devices provides functionality of a security system hub; and
at least one security element, wherein the at least one electronic device is structured to communicate with the at least one security element and to initiate one or more alarms or notify one or more external parties of one or more security events. | 2,800 |
12,252 | 12,252 | 16,237,210 | 2,818 | An integrated circuit includes a trench gate MOSFET including MOSFET cells. Each MOSFET cell includes an active trench gate in an n-epitaxial layer oriented in a first direction with a polysilicon gate over a lower polysilicon portion. P-type body regions are between trench gates and are separated by an n-epitaxial region. N-type source regions are located over the p-type regions. A gate dielectric layer is between the polysilicon gates and the body regions. A metal-containing layer contacts the n-epitaxial region to provide an anode of an embedded Schottky diode. A dielectric layer over the n-epitaxial layer has metal contacts therethrough connecting to the n-type source regions, to the p-type body regions, and to the anode of the Schottky diode. | 1. A method of fabricating an integrated circuit, comprising;
forming a first vertical trench gate transistor within an n-type semiconductor substrate having a top surface, the first trench gate transistor comprising:
a first n-type region located at the top surface and between a first trench gate and a metal contact; and
a first p-type region located between the first n-type region and the n-type substrate;
forming a second vertical trench gate transistor within the n-type semiconductor substrate, the second trench gate transistor comprising:
a second n-type region located at the top surface and between the first trench gate and the metal contact; and
a second p-type region located between the second n-type region and the n-type substrate, and
forming a Schottky contact to the n-type substrate, thereby forming a Schottky diode between the first and second trench gate transistors, the Schottky contact comprising a metal-containing layer located directly on the n-type substrate, and electrically connecting to the first trench gate transistor, to the second trench gate transistor, and to the Schottky diode. 2. The method of claim 1, wherein the metal-containing layer comprises TiN or TaN. 3. The method of claim 1, wherein the first and second n-type regions are configured to operate as first and second source regions, respectively, of the first and second vertical trench gate transistors. 4. The method of claim 1, wherein the first and second vertical trench gate transistors include respective first and second polysilicon gates, and further comprising forming a recess in each of the first and second polysilicon gates. 5. The method of claim 1, wherein the metal-containing layer connects the first n-type region to the first p-type region, and connects the second n-type region to the second p-type region. 6. The method of claim 1, wherein the forming the Schottky contact includes etching through the first and second n-type regions and into the first and second p-type regions. 7. The method of claim 1, wherein a thickness of the metal-containing layer is within a range between about 10 nm and about 50 nm. 8. The method of claim 1, wherein the Schottky contact is located on the top surface of the semiconductor substrate. 9-20: (canceled) 21. A method of fabricating an integrated circuit, comprising;
forming first and second trenches within a lightly doped n-type epitaxial layer over a semiconductor substrate; forming first and second p-type body regions between the first and second trenches, and respective first and second n+ source regions over the first and second body regions; forming a metal or metallic compound layer that touches the first and second body regions and the first and second source regions, and touches the epitaxial layer between the first and second body regions. 22. The method of claim 21, wherein the metal or metallic compound layer comprises TiN or TaN. 23. The method of claim 21, wherein the metal or metallic compound layer comprises a refractory metal. 24. The method of claim 21, further comprising forming respective first and second polysilicon field plates within the first and second trenches, and forming respective first and second polysilicon gates over the first and second field plates. 26. The method of claim 1, wherein the metal or metallic compound layer forms a Schottky contact with the lightly doped n-type epitaxial layer. 27. The method of claim 1, wherein a thickness of the metal or metallic compound layer is within a range between about 10 nm and about 50 nm. 28. The method of claim 1, wherein the Schottky contact is located on the top surface of the semiconductor substrate. 29. The method of claim 1, wherein the first and second source regions are respective portions of first and second vertical trench gate MOSFETs, the first and second vertical trench gate MOSFETs being part of a two-dimensional array of vertical trench gate MOSFETs, each neighboring pair of vertical trench gate MOSFETs being separated by a corresponding Schottky contact where the metal or metallic compound layer contacts the n-epitaxial layer. | An integrated circuit includes a trench gate MOSFET including MOSFET cells. Each MOSFET cell includes an active trench gate in an n-epitaxial layer oriented in a first direction with a polysilicon gate over a lower polysilicon portion. P-type body regions are between trench gates and are separated by an n-epitaxial region. N-type source regions are located over the p-type regions. A gate dielectric layer is between the polysilicon gates and the body regions. A metal-containing layer contacts the n-epitaxial region to provide an anode of an embedded Schottky diode. A dielectric layer over the n-epitaxial layer has metal contacts therethrough connecting to the n-type source regions, to the p-type body regions, and to the anode of the Schottky diode.1. A method of fabricating an integrated circuit, comprising;
forming a first vertical trench gate transistor within an n-type semiconductor substrate having a top surface, the first trench gate transistor comprising:
a first n-type region located at the top surface and between a first trench gate and a metal contact; and
a first p-type region located between the first n-type region and the n-type substrate;
forming a second vertical trench gate transistor within the n-type semiconductor substrate, the second trench gate transistor comprising:
a second n-type region located at the top surface and between the first trench gate and the metal contact; and
a second p-type region located between the second n-type region and the n-type substrate, and
forming a Schottky contact to the n-type substrate, thereby forming a Schottky diode between the first and second trench gate transistors, the Schottky contact comprising a metal-containing layer located directly on the n-type substrate, and electrically connecting to the first trench gate transistor, to the second trench gate transistor, and to the Schottky diode. 2. The method of claim 1, wherein the metal-containing layer comprises TiN or TaN. 3. The method of claim 1, wherein the first and second n-type regions are configured to operate as first and second source regions, respectively, of the first and second vertical trench gate transistors. 4. The method of claim 1, wherein the first and second vertical trench gate transistors include respective first and second polysilicon gates, and further comprising forming a recess in each of the first and second polysilicon gates. 5. The method of claim 1, wherein the metal-containing layer connects the first n-type region to the first p-type region, and connects the second n-type region to the second p-type region. 6. The method of claim 1, wherein the forming the Schottky contact includes etching through the first and second n-type regions and into the first and second p-type regions. 7. The method of claim 1, wherein a thickness of the metal-containing layer is within a range between about 10 nm and about 50 nm. 8. The method of claim 1, wherein the Schottky contact is located on the top surface of the semiconductor substrate. 9-20: (canceled) 21. A method of fabricating an integrated circuit, comprising;
forming first and second trenches within a lightly doped n-type epitaxial layer over a semiconductor substrate; forming first and second p-type body regions between the first and second trenches, and respective first and second n+ source regions over the first and second body regions; forming a metal or metallic compound layer that touches the first and second body regions and the first and second source regions, and touches the epitaxial layer between the first and second body regions. 22. The method of claim 21, wherein the metal or metallic compound layer comprises TiN or TaN. 23. The method of claim 21, wherein the metal or metallic compound layer comprises a refractory metal. 24. The method of claim 21, further comprising forming respective first and second polysilicon field plates within the first and second trenches, and forming respective first and second polysilicon gates over the first and second field plates. 26. The method of claim 1, wherein the metal or metallic compound layer forms a Schottky contact with the lightly doped n-type epitaxial layer. 27. The method of claim 1, wherein a thickness of the metal or metallic compound layer is within a range between about 10 nm and about 50 nm. 28. The method of claim 1, wherein the Schottky contact is located on the top surface of the semiconductor substrate. 29. The method of claim 1, wherein the first and second source regions are respective portions of first and second vertical trench gate MOSFETs, the first and second vertical trench gate MOSFETs being part of a two-dimensional array of vertical trench gate MOSFETs, each neighboring pair of vertical trench gate MOSFETs being separated by a corresponding Schottky contact where the metal or metallic compound layer contacts the n-epitaxial layer. | 2,800 |
12,253 | 12,253 | 15,777,790 | 2,846 | The present invention is a power module for a system for converting a direct electrical power into a three-phase electrical power. The power module according to the invention comprises two inputs (E 1, E 2 ), an output (S), two switches ( 1 ), two diodes (D), and two capacitors (Cs, Cov) and
to a conversion system comprising such a power module. | 1.-14. (canceled) 15. A power module for a conversion system for converting direct electrical power into a three-phase electrical power, comprising two inputs configured for connection to direct inputs of the conversion system, two switches placed in series between the direct inputs, and a first output disposed between the two switches, the first output being connectable to an alternating output phase of the conversion system, two diodes and two capacitors. 16. A power module according to claim 15, wherein the two diodes are mounted in series, are connected to a first input of the module and to a second output of the module, the second output being connectable to an energy recovery module of the conversion system. 17. A module according to claim 16, comprising:
a first voltage modulation capacitor is connected between the diodes and the first output. 18. A module according to claim 16, comprising a second capacitor connected the second output of the module and a second input of the module. 19. A module according to claim 17, comprising a second capacitor connected the second output of the module and a second input of the module. 20. A module according to claim 15, in which the switches are of either a MOSFET or IGBT. 21. A module according to claim 15, wherein one of the two capacitors is a voltage modulation capacitor having a capacitance of between 4 and 15 nF. 22. A module according to claim 21, wherein another of the two capacitors has a capacitance of between 500 and 5000 nF. 23. A module according to claim 15, in wherein the module is a block suitable for configured to be mounted on a board of a conversion system. 24. A module according to claim 23, wherein the block comprises means for fixing the block to the module. 25. A module according to claim 24, wherein means for fixing comprises at least one notch for the passage of a screw. 26. A system for converting a direct electrical power into three-phase electrical power comprising three switching arms, in which each switching arm comprises at least one power module according to claim 15. 27. A system according to claim 26, wherein each switching arm comprises two or three power modules. 28. A system according to claim 26, wherein the system comprises an energy recovery module and at least one current modulation coil. 29. A motor system comprising at least one electrical energy storage and one three phase electric machine, wherein the motor system comprises a system according to claim 26, for converting direct electrical energy from the electrical energy storage into three phase alternating electrical energy for the electrical machine. | The present invention is a power module for a system for converting a direct electrical power into a three-phase electrical power. The power module according to the invention comprises two inputs (E 1, E 2 ), an output (S), two switches ( 1 ), two diodes (D), and two capacitors (Cs, Cov) and
to a conversion system comprising such a power module.1.-14. (canceled) 15. A power module for a conversion system for converting direct electrical power into a three-phase electrical power, comprising two inputs configured for connection to direct inputs of the conversion system, two switches placed in series between the direct inputs, and a first output disposed between the two switches, the first output being connectable to an alternating output phase of the conversion system, two diodes and two capacitors. 16. A power module according to claim 15, wherein the two diodes are mounted in series, are connected to a first input of the module and to a second output of the module, the second output being connectable to an energy recovery module of the conversion system. 17. A module according to claim 16, comprising:
a first voltage modulation capacitor is connected between the diodes and the first output. 18. A module according to claim 16, comprising a second capacitor connected the second output of the module and a second input of the module. 19. A module according to claim 17, comprising a second capacitor connected the second output of the module and a second input of the module. 20. A module according to claim 15, in which the switches are of either a MOSFET or IGBT. 21. A module according to claim 15, wherein one of the two capacitors is a voltage modulation capacitor having a capacitance of between 4 and 15 nF. 22. A module according to claim 21, wherein another of the two capacitors has a capacitance of between 500 and 5000 nF. 23. A module according to claim 15, in wherein the module is a block suitable for configured to be mounted on a board of a conversion system. 24. A module according to claim 23, wherein the block comprises means for fixing the block to the module. 25. A module according to claim 24, wherein means for fixing comprises at least one notch for the passage of a screw. 26. A system for converting a direct electrical power into three-phase electrical power comprising three switching arms, in which each switching arm comprises at least one power module according to claim 15. 27. A system according to claim 26, wherein each switching arm comprises two or three power modules. 28. A system according to claim 26, wherein the system comprises an energy recovery module and at least one current modulation coil. 29. A motor system comprising at least one electrical energy storage and one three phase electric machine, wherein the motor system comprises a system according to claim 26, for converting direct electrical energy from the electrical energy storage into three phase alternating electrical energy for the electrical machine. | 2,800 |
12,254 | 12,254 | 15,717,145 | 2,891 | In a first aspect of a present inventive subject matter, a semiconductor device includes a semiconductor layer including a crystalline oxide semiconductor that comprises gallium; and a Schottky electrode that is positioned on the semiconductor layer. The semiconductor layer includes a surface area that is 3 mm 2 or less. | 1. A semiconductor device comprising:
a semiconductor layer comprising a crystalline oxide semiconductor that comprises gallium; and a Schottky electrode that is positioned on the semiconductor layer; wherein the semiconductor layer comprises a surface area that is 3 mm2 or less. 2. The semiconductor device according to claim 1,
wherein the Schottky electrode comprises at least one metal selected from the fourth group, the fifth group, the sixth group, the seventh group, the eighth group and the ninth group in the periodic table. 3. The semiconductor device according to claim 1,
wherein the crystalline oxide semiconductor of the semiconductor layer comprises a corundum structure. 4. The semiconductor device according to claim 1,
wherein the crystalline oxide semiconductor of the semiconductor layer comprises α-Ga2O3 or a mixed crystal of α-Ga2O3. 5. The semiconductor device according to claim 1 further comprising:
an ohmic electrode that comprises at least one metal selected from the fourth group or the eleventh group in the periodic table. 6. The semiconductor device according to claim 1, wherein
a capacitance of the semiconductor device with a zero-bias voltage is 500 pF or less when measured at 1 MHz. 7. The semiconductor device according to claim 1, wherein
the semiconductor device is configured to be activated by an electric current that is 1A or more. 8. The semiconductor device according to claim 1,
wherein the semiconductor device is a power semiconductor device. 9. The semiconductor device according to claim 1,
the semiconductor layer with a dielectric breakdown field that is 6 MV/cm or more. 10. The semiconductor device according to claim 1, wherein
the semiconductor layer comprises a first semiconductor layer and a second semiconductor layer, and the Schottky electrode is positioned on the first semiconductor layer. 11. The semiconductor device according to claim 10, wherein
the first semiconductor layer with a first thickness and the second semiconductor layer with a second thickness are 40 μm or less as a total thickness of the first thickness of the first semiconductor layer and the second thickness of the second semiconductor layer, 12. A semiconductor system comprising;
a motherboard; and a semiconductor device according to claim 1 electrically connected to the motherboard. 13. A semiconductor device comprising;
a semiconductor layer comprising a crystalline oxide semiconductor that comprises gallium; and a Schottky electrode is positioned on the semiconductor layer, wherein the semiconductor layer comprises a surface area that is 1 mm2 or less. 14. The semiconductor device according to claim 13, wherein
the Schottky electrode comprises at least one metal selected from the fourth group, the fifth group, the sixth group, the seventh group, the eighth group and the ninth group in the periodic table. 15. The semiconductor device according to claim 13, wherein
the crystalline oxide semiconductor of the semiconductor layer comprises α-Ga2O3 or a mixed crystal of α-Ga2O3. 16. The semiconductor device according to claim 13,
the semiconductor layer with a dielectric breakdown field that is 6 MV/cm or more. 17. A semiconductor device comprising:
a semiconductor layer comprising a first semiconductor layer and a second semiconductor layer; and a Schottky electrode being positioned on the first semiconductor layer, and the Schottky electrode comprising at least one metal selected from the fourth group, the fifth group, the sixth group, the seventh group, the eighth group and the ninth group in the periodic table, wherein the first semiconductor layer comprises a crystalline oxide semiconductor comprising gallium, the second semiconductor layer comprises a crystalline oxide semiconductor comprising gallium, and at least one of the first semiconductor layer and the second semiconductor layer comprises a surface area that is 3 mm2 or less. 18. The semiconductor device according to claim 17,
wherein the first semiconductor layer with a first thickness and the second semiconductor layer with a second thickness are 40 μm or less as a total thickness of the first thickness of the first semiconductor layer and the second thickness of the second semiconductor layer. 19. The semiconductor device according to claim 18, wherein
the first semiconductor layer comprises a first carrier concentration, and the second semiconductor layer comprises a second carrier concentration, and the first carrier concentration is smaller than the second carrier concentration. 20. The semiconductor device according to claim 17,
the semiconductor layer with a dielectric breakdown field that is 6 MV/cm or more. | In a first aspect of a present inventive subject matter, a semiconductor device includes a semiconductor layer including a crystalline oxide semiconductor that comprises gallium; and a Schottky electrode that is positioned on the semiconductor layer. The semiconductor layer includes a surface area that is 3 mm 2 or less.1. A semiconductor device comprising:
a semiconductor layer comprising a crystalline oxide semiconductor that comprises gallium; and a Schottky electrode that is positioned on the semiconductor layer; wherein the semiconductor layer comprises a surface area that is 3 mm2 or less. 2. The semiconductor device according to claim 1,
wherein the Schottky electrode comprises at least one metal selected from the fourth group, the fifth group, the sixth group, the seventh group, the eighth group and the ninth group in the periodic table. 3. The semiconductor device according to claim 1,
wherein the crystalline oxide semiconductor of the semiconductor layer comprises a corundum structure. 4. The semiconductor device according to claim 1,
wherein the crystalline oxide semiconductor of the semiconductor layer comprises α-Ga2O3 or a mixed crystal of α-Ga2O3. 5. The semiconductor device according to claim 1 further comprising:
an ohmic electrode that comprises at least one metal selected from the fourth group or the eleventh group in the periodic table. 6. The semiconductor device according to claim 1, wherein
a capacitance of the semiconductor device with a zero-bias voltage is 500 pF or less when measured at 1 MHz. 7. The semiconductor device according to claim 1, wherein
the semiconductor device is configured to be activated by an electric current that is 1A or more. 8. The semiconductor device according to claim 1,
wherein the semiconductor device is a power semiconductor device. 9. The semiconductor device according to claim 1,
the semiconductor layer with a dielectric breakdown field that is 6 MV/cm or more. 10. The semiconductor device according to claim 1, wherein
the semiconductor layer comprises a first semiconductor layer and a second semiconductor layer, and the Schottky electrode is positioned on the first semiconductor layer. 11. The semiconductor device according to claim 10, wherein
the first semiconductor layer with a first thickness and the second semiconductor layer with a second thickness are 40 μm or less as a total thickness of the first thickness of the first semiconductor layer and the second thickness of the second semiconductor layer, 12. A semiconductor system comprising;
a motherboard; and a semiconductor device according to claim 1 electrically connected to the motherboard. 13. A semiconductor device comprising;
a semiconductor layer comprising a crystalline oxide semiconductor that comprises gallium; and a Schottky electrode is positioned on the semiconductor layer, wherein the semiconductor layer comprises a surface area that is 1 mm2 or less. 14. The semiconductor device according to claim 13, wherein
the Schottky electrode comprises at least one metal selected from the fourth group, the fifth group, the sixth group, the seventh group, the eighth group and the ninth group in the periodic table. 15. The semiconductor device according to claim 13, wherein
the crystalline oxide semiconductor of the semiconductor layer comprises α-Ga2O3 or a mixed crystal of α-Ga2O3. 16. The semiconductor device according to claim 13,
the semiconductor layer with a dielectric breakdown field that is 6 MV/cm or more. 17. A semiconductor device comprising:
a semiconductor layer comprising a first semiconductor layer and a second semiconductor layer; and a Schottky electrode being positioned on the first semiconductor layer, and the Schottky electrode comprising at least one metal selected from the fourth group, the fifth group, the sixth group, the seventh group, the eighth group and the ninth group in the periodic table, wherein the first semiconductor layer comprises a crystalline oxide semiconductor comprising gallium, the second semiconductor layer comprises a crystalline oxide semiconductor comprising gallium, and at least one of the first semiconductor layer and the second semiconductor layer comprises a surface area that is 3 mm2 or less. 18. The semiconductor device according to claim 17,
wherein the first semiconductor layer with a first thickness and the second semiconductor layer with a second thickness are 40 μm or less as a total thickness of the first thickness of the first semiconductor layer and the second thickness of the second semiconductor layer. 19. The semiconductor device according to claim 18, wherein
the first semiconductor layer comprises a first carrier concentration, and the second semiconductor layer comprises a second carrier concentration, and the first carrier concentration is smaller than the second carrier concentration. 20. The semiconductor device according to claim 17,
the semiconductor layer with a dielectric breakdown field that is 6 MV/cm or more. | 2,800 |
12,255 | 12,255 | 14,210,955 | 2,887 | A system, method and interface for compiling literary works from specialized databases and/or from unique interfaces is provided, including a custom database compiled from plural existing literary indexes, wherein a master index is harmonized from said existing indexes according to common terms (e.g., book, chapter and verse for biblical indexes) with deleted duplicates. In exemplary embodiments, the master index is also augmented by ingestion of additional literary works in digital form that are chopped up based on said common terms (e.g., book, chapter, verse) extracted from the literary work. | 1. A system for compiling literary works from a specialized database, comprising:
a custom database compiled from plural existing literary indexes, wherein a master index is harmonized from said existing indexes according to common terms with deleted duplicates; and a user interface, the user interface configured to provide possible compilation results via search. 2. A system in accordance with claim 1, wherein the master index is also augmented by ingestion of additional literary works in digital form that are chopped up based on said common terms extracted from the literary work. 3. A system in accordance with claim 1, wherein said search results provide actual keyword results, synonyms or related terms, either generated by the master index or imported from said existing indexes into said master index. 4. A system in accordance with claim 3, wherein said search results provide a relevancy score. 5. A system in accordance with claim 3, wherein said searching is provided according to title, author or topic. 6. A system in accordance with claim 1, further comprising a user interface with editing tools configured to permit arrangement and publishing of search results. 7. A system in accordance with claim 6, further comprising a mechanism for calculation of compensation to individual authors during compilation, as well as calculation of total royalties due for a particular compiled work. 8. A system in accordance with claim 3, wherein a results list provides an abbreviated results list with clickable portions activating expanded information. 9. A system in accordance with claim 3, wherein results from the master index are provided as chunks of a predetermined level. 10. A system in accordance with claim 1, further comprising an administrative interface configured to add a reference to a result. 11. A system in accordance with claim 3, wherein said search results provide indication of classes of rights to use a piece. 12. A system in accordance with claim 3, wherein said search results provide word counts of individual results. 13. A system in accordance with claim 3, wherein said search results provide a clickable source button or link that further describes the source of a particular result. 14. A system in accordance with claim 1, further comprising an administrative interface configured to ingest literary works, wherein said administrative interface provides an indication of ingestion status, allows association of metadata with definable chunks, and allows classification of a literary portion. 15. A method for compiling literary works from a specialized database, comprising:
providing a custom database compiled from plural existing literary indexes, wherein a master index is harmonized from said existing indexes according to common terms with deleted duplicates; and providing a user interface, the user interface configured to provide possible compilation results via search. 16. A user interface for compiling literary works from a specialized database, comprising:
a user interface, the user interface configured to provide possible compilation results via search, wherein the user interface draws results from a custom database compiled from plural existing literary indexes, wherein a master index is harmonized from said existing indexes according to common terms with deleted duplicates. | A system, method and interface for compiling literary works from specialized databases and/or from unique interfaces is provided, including a custom database compiled from plural existing literary indexes, wherein a master index is harmonized from said existing indexes according to common terms (e.g., book, chapter and verse for biblical indexes) with deleted duplicates. In exemplary embodiments, the master index is also augmented by ingestion of additional literary works in digital form that are chopped up based on said common terms (e.g., book, chapter, verse) extracted from the literary work.1. A system for compiling literary works from a specialized database, comprising:
a custom database compiled from plural existing literary indexes, wherein a master index is harmonized from said existing indexes according to common terms with deleted duplicates; and a user interface, the user interface configured to provide possible compilation results via search. 2. A system in accordance with claim 1, wherein the master index is also augmented by ingestion of additional literary works in digital form that are chopped up based on said common terms extracted from the literary work. 3. A system in accordance with claim 1, wherein said search results provide actual keyword results, synonyms or related terms, either generated by the master index or imported from said existing indexes into said master index. 4. A system in accordance with claim 3, wherein said search results provide a relevancy score. 5. A system in accordance with claim 3, wherein said searching is provided according to title, author or topic. 6. A system in accordance with claim 1, further comprising a user interface with editing tools configured to permit arrangement and publishing of search results. 7. A system in accordance with claim 6, further comprising a mechanism for calculation of compensation to individual authors during compilation, as well as calculation of total royalties due for a particular compiled work. 8. A system in accordance with claim 3, wherein a results list provides an abbreviated results list with clickable portions activating expanded information. 9. A system in accordance with claim 3, wherein results from the master index are provided as chunks of a predetermined level. 10. A system in accordance with claim 1, further comprising an administrative interface configured to add a reference to a result. 11. A system in accordance with claim 3, wherein said search results provide indication of classes of rights to use a piece. 12. A system in accordance with claim 3, wherein said search results provide word counts of individual results. 13. A system in accordance with claim 3, wherein said search results provide a clickable source button or link that further describes the source of a particular result. 14. A system in accordance with claim 1, further comprising an administrative interface configured to ingest literary works, wherein said administrative interface provides an indication of ingestion status, allows association of metadata with definable chunks, and allows classification of a literary portion. 15. A method for compiling literary works from a specialized database, comprising:
providing a custom database compiled from plural existing literary indexes, wherein a master index is harmonized from said existing indexes according to common terms with deleted duplicates; and providing a user interface, the user interface configured to provide possible compilation results via search. 16. A user interface for compiling literary works from a specialized database, comprising:
a user interface, the user interface configured to provide possible compilation results via search, wherein the user interface draws results from a custom database compiled from plural existing literary indexes, wherein a master index is harmonized from said existing indexes according to common terms with deleted duplicates. | 2,800 |
12,256 | 12,256 | 14,491,882 | 2,887 | A method, apparatus, and system for placing and operating an automated donation station is disclosed. An automated donation station can be placed at a location upon receiving a request for an automated donation station from a charitable organization or event organizer. The automated donation station can be customized according to a particular requestor's needs. One or more donations may be collected using the donation station by displaying information to a donor, receiving a donation offer from the donor, and collecting donation details (e.g., payment information) from the donor. A donation receipt can be dispensed to the donor at the automated donation station. Further, donation gifts may be selected by the donor at the automated donation station and dispensed at the automated donation station. | 1. A method for configuring an automated donation station, wherein said method comprises:
receiving a request to customize an automated donation station; customizing the automated donation station; and placing the automated donation station. 2. A method as recited in claim 1, wherein the request is received via a customization application. 3. A method as recited in claim 2, wherein the customization application operates over the Internet. 4. A method as recited in claim 1, wherein the automated donation station is portable. 5. A method as recited in claim 1,
wherein the receiving of the request comprises receiving, at a web site accessible via a computer network, an electronic request for customization of the automated donation station, wherein the electronic request includes customization data for the automated donation station, wherein the customizing of the automated donation station is based at least in part on the customization data included in the electronic request, and wherein the placing the automated donation station places the automated donation station at a particular location for collection of donations from donors interacting with the automated donation station. 6. A method as recited in claim 5, wherein the customizing of the automated donation station customizes at least one graphical user interface thereof to a particular donation seeking organization or a particular donation seeking event. | A method, apparatus, and system for placing and operating an automated donation station is disclosed. An automated donation station can be placed at a location upon receiving a request for an automated donation station from a charitable organization or event organizer. The automated donation station can be customized according to a particular requestor's needs. One or more donations may be collected using the donation station by displaying information to a donor, receiving a donation offer from the donor, and collecting donation details (e.g., payment information) from the donor. A donation receipt can be dispensed to the donor at the automated donation station. Further, donation gifts may be selected by the donor at the automated donation station and dispensed at the automated donation station.1. A method for configuring an automated donation station, wherein said method comprises:
receiving a request to customize an automated donation station; customizing the automated donation station; and placing the automated donation station. 2. A method as recited in claim 1, wherein the request is received via a customization application. 3. A method as recited in claim 2, wherein the customization application operates over the Internet. 4. A method as recited in claim 1, wherein the automated donation station is portable. 5. A method as recited in claim 1,
wherein the receiving of the request comprises receiving, at a web site accessible via a computer network, an electronic request for customization of the automated donation station, wherein the electronic request includes customization data for the automated donation station, wherein the customizing of the automated donation station is based at least in part on the customization data included in the electronic request, and wherein the placing the automated donation station places the automated donation station at a particular location for collection of donations from donors interacting with the automated donation station. 6. A method as recited in claim 5, wherein the customizing of the automated donation station customizes at least one graphical user interface thereof to a particular donation seeking organization or a particular donation seeking event. | 2,800 |
12,257 | 12,257 | 16,566,062 | 2,832 | An assembly according to an embodiment of the present disclosure includes, among other things, a synchronous machine including a rotating portion and a stationary portion, the rotating portion including at least one rotating diode coupled to a field winding, and the stationary portion including a stator winding and an exciter winding. A control unit includes a first gate and a second gate. The exciter winding is connected in series to the first gate and the second gate during a first operating mode to energize the exciter winding. The exciter winding is electrically connected in series to a first gate but is electrically disconnected from the second gate in a second, different operating mode to electrically disconnect the exciter winding from an exciter energy source. A method of operating a synchronous machine is also disclosed. | 1. An assembly comprising:
a synchronous machine including a rotating portion and a stationary portion, the rotating portion including at least one rotating diode coupled to a field winding, and the stationary portion including a stator winding and an exciter winding; a control unit including a first gate and a second gate; wherein the exciter winding is connected in series to the first gate and the second gate during a first operating mode to energize the exciter winding; and wherein the exciter winding is electrically connected in series to the first gate but is electrically disconnected from the second gate in a second, different operating mode to electrically disconnect the exciter winding from an exciter energy source. 2. The assembly as recited in claim 1, wherein the exciter energy source is electrically disconnected from the exciter winding in response to closing the first gate and opening the second gate. 3. The assembly as recited in claim 1, wherein the stationary portion includes a rectifier that electrically connects the exciter winding to the exciter energy source during the first operating mode. 4. The assembly as recited in claim 3, wherein the exciter winding is electrically in parallel with the rectifier and with a capacitor during the first operating mode. 5. The assembly as recited in claim 3, wherein the exciter energy source is a three-phase generator including phase lines each electrically coupled to a respective pair of diodes of the rectifier. 6. The assembly as recited in claim 1, wherein the first gate and the second gate are transistors. 7. The assembly as recited in claim 1, wherein circuitry between the exciter energy source and the exciter winding is free of any transient voltage suppression diodes. 8. The assembly as recited in claim 1, wherein the control unit is operable to simultaneously communicate a first gate signal to the first gate and a second, different gate signal to the second gate. 9. The assembly as recited in claim 8, wherein the control unit is operable to hold closed the first gate during the second operating mode, and is operable to hold open the second gate during the second operating mode. 10. The assembly as recited in claim 9, wherein the second operating mode relates to a shorted rotating diode event caused by the at least one rotating diode. 11. The assembly as recited in claim 1, wherein:
the stationary portion includes a first diode and a second diode; the first diode and the second diode are electrically disconnected from the exciter winding during the first operating mode; the second diode is electrically connected to the exciter winding, and the first diode is electrically disconnected from the exciter winding during the second operating mode; and the first diode and the second diode are electrically connected in series to the exciter winding during a third, different operating mode. 12. The assembly as recited in claim 11, wherein the exciter energy source is electrically disconnected from the exciter winding in the third operating mode. 13. The assembly as recited in claim 12, wherein:
the exciter energy source is electrically disconnected from the exciter winding in response to opening the first gate and opening the second gate during the third operating mode; the control unit includes a bridge rectifier that electrically connects the exciter winding to the exciter energy source during the first operating mode; the exciter winding is electrically in parallel with the bridge rectifier and with a capacitor during the first operating mode; the capacitor and the bridge rectifier are electrically disconnected from the exciter winding during the second operating mode; the exciter energy source is a three-phase generator including phase lines each electrically coupled to a respective pair of diodes of the bridge rectifier; and the first gate and the second gate are transistors. 14. The assembly as recited in claim 13, wherein the second operating mode relates to a shorted rotating diode event caused by the at least one rotating diode. 15. A synchronous machine comprising:
a rotating portion including at least one rotating diode coupled to a field winding; a stationary portion including a stator winding, an exciter winding, a bridge rectifier coupled to a permanent magnet generator, a capacitor, and a plurality of nodes, the plurality of nodes including a first node, a second node, a third node and a fourth node; a control unit including a first gate, a second gate, a first diode, and a second diode; wherein components of the first node consist of the bridge rectifier, the capacitor, a drain terminal of the first gate, and a cathode of the second diode; and wherein components of the second node comprise a first terminal of the exciter winding, a cathode of the first diode, and a source terminal of the first gate; wherein components of the third node comprise a second terminal of the exciter winding, an anode of the second diode, and a drain terminal of the second gate; wherein components of the fourth node comprise the bridge rectifier, the capacitor, a source terminal of the second gate, and an anode of the first diode; wherein the exciter winding is electrically connected in series to the first gate and the second gate during a first operating mode to energize the exciter winding; and wherein the exciter winding is electrically connected in series to the first gate, but is electrically disconnected from the second gate during a second, different operating mode to electrically disconnect the exciter winding from the permanent magnet generator. 16. A method of operating a synchronous machine, comprising:
closing first and second gates to energize an exciter winding in series between the first and second gates; and opening the second gate, but closing the first gate to electrically disconnect to the exciter winding from a rectifier in response to a shorted rotating diode event. 17. The method as recited in claim 16, wherein the rectifier is coupled to an exciter energy source, and the first gate and the second gate are transistors. 18. The method as recited in claim 17, wherein circuitry between the exciter energy source and the exciter winding is free of any transient voltage suppression diodes. 19. The method as recited in claim 17, comprising opening the first and second gates to electrically disconnect the exciter winding from the exciter energy source. 20. The method as recited in claim 17, wherein phase lines of the exciter energy source are each coupled to a respective pair of diodes of the rectifier. 21. The method as recited in claim 16, wherein the step of closing the first and second gates includes electrically connecting in parallel a capacitor with the exciter winding and the rectifier. 22. The method as recited in claim 21, wherein the step of opening the second gate includes electrically connecting a first diode in series with the first gate and the exciter winding. | An assembly according to an embodiment of the present disclosure includes, among other things, a synchronous machine including a rotating portion and a stationary portion, the rotating portion including at least one rotating diode coupled to a field winding, and the stationary portion including a stator winding and an exciter winding. A control unit includes a first gate and a second gate. The exciter winding is connected in series to the first gate and the second gate during a first operating mode to energize the exciter winding. The exciter winding is electrically connected in series to a first gate but is electrically disconnected from the second gate in a second, different operating mode to electrically disconnect the exciter winding from an exciter energy source. A method of operating a synchronous machine is also disclosed.1. An assembly comprising:
a synchronous machine including a rotating portion and a stationary portion, the rotating portion including at least one rotating diode coupled to a field winding, and the stationary portion including a stator winding and an exciter winding; a control unit including a first gate and a second gate; wherein the exciter winding is connected in series to the first gate and the second gate during a first operating mode to energize the exciter winding; and wherein the exciter winding is electrically connected in series to the first gate but is electrically disconnected from the second gate in a second, different operating mode to electrically disconnect the exciter winding from an exciter energy source. 2. The assembly as recited in claim 1, wherein the exciter energy source is electrically disconnected from the exciter winding in response to closing the first gate and opening the second gate. 3. The assembly as recited in claim 1, wherein the stationary portion includes a rectifier that electrically connects the exciter winding to the exciter energy source during the first operating mode. 4. The assembly as recited in claim 3, wherein the exciter winding is electrically in parallel with the rectifier and with a capacitor during the first operating mode. 5. The assembly as recited in claim 3, wherein the exciter energy source is a three-phase generator including phase lines each electrically coupled to a respective pair of diodes of the rectifier. 6. The assembly as recited in claim 1, wherein the first gate and the second gate are transistors. 7. The assembly as recited in claim 1, wherein circuitry between the exciter energy source and the exciter winding is free of any transient voltage suppression diodes. 8. The assembly as recited in claim 1, wherein the control unit is operable to simultaneously communicate a first gate signal to the first gate and a second, different gate signal to the second gate. 9. The assembly as recited in claim 8, wherein the control unit is operable to hold closed the first gate during the second operating mode, and is operable to hold open the second gate during the second operating mode. 10. The assembly as recited in claim 9, wherein the second operating mode relates to a shorted rotating diode event caused by the at least one rotating diode. 11. The assembly as recited in claim 1, wherein:
the stationary portion includes a first diode and a second diode; the first diode and the second diode are electrically disconnected from the exciter winding during the first operating mode; the second diode is electrically connected to the exciter winding, and the first diode is electrically disconnected from the exciter winding during the second operating mode; and the first diode and the second diode are electrically connected in series to the exciter winding during a third, different operating mode. 12. The assembly as recited in claim 11, wherein the exciter energy source is electrically disconnected from the exciter winding in the third operating mode. 13. The assembly as recited in claim 12, wherein:
the exciter energy source is electrically disconnected from the exciter winding in response to opening the first gate and opening the second gate during the third operating mode; the control unit includes a bridge rectifier that electrically connects the exciter winding to the exciter energy source during the first operating mode; the exciter winding is electrically in parallel with the bridge rectifier and with a capacitor during the first operating mode; the capacitor and the bridge rectifier are electrically disconnected from the exciter winding during the second operating mode; the exciter energy source is a three-phase generator including phase lines each electrically coupled to a respective pair of diodes of the bridge rectifier; and the first gate and the second gate are transistors. 14. The assembly as recited in claim 13, wherein the second operating mode relates to a shorted rotating diode event caused by the at least one rotating diode. 15. A synchronous machine comprising:
a rotating portion including at least one rotating diode coupled to a field winding; a stationary portion including a stator winding, an exciter winding, a bridge rectifier coupled to a permanent magnet generator, a capacitor, and a plurality of nodes, the plurality of nodes including a first node, a second node, a third node and a fourth node; a control unit including a first gate, a second gate, a first diode, and a second diode; wherein components of the first node consist of the bridge rectifier, the capacitor, a drain terminal of the first gate, and a cathode of the second diode; and wherein components of the second node comprise a first terminal of the exciter winding, a cathode of the first diode, and a source terminal of the first gate; wherein components of the third node comprise a second terminal of the exciter winding, an anode of the second diode, and a drain terminal of the second gate; wherein components of the fourth node comprise the bridge rectifier, the capacitor, a source terminal of the second gate, and an anode of the first diode; wherein the exciter winding is electrically connected in series to the first gate and the second gate during a first operating mode to energize the exciter winding; and wherein the exciter winding is electrically connected in series to the first gate, but is electrically disconnected from the second gate during a second, different operating mode to electrically disconnect the exciter winding from the permanent magnet generator. 16. A method of operating a synchronous machine, comprising:
closing first and second gates to energize an exciter winding in series between the first and second gates; and opening the second gate, but closing the first gate to electrically disconnect to the exciter winding from a rectifier in response to a shorted rotating diode event. 17. The method as recited in claim 16, wherein the rectifier is coupled to an exciter energy source, and the first gate and the second gate are transistors. 18. The method as recited in claim 17, wherein circuitry between the exciter energy source and the exciter winding is free of any transient voltage suppression diodes. 19. The method as recited in claim 17, comprising opening the first and second gates to electrically disconnect the exciter winding from the exciter energy source. 20. The method as recited in claim 17, wherein phase lines of the exciter energy source are each coupled to a respective pair of diodes of the rectifier. 21. The method as recited in claim 16, wherein the step of closing the first and second gates includes electrically connecting in parallel a capacitor with the exciter winding and the rectifier. 22. The method as recited in claim 21, wherein the step of opening the second gate includes electrically connecting a first diode in series with the first gate and the exciter winding. | 2,800 |
12,258 | 12,258 | 16,123,364 | 2,838 | An isolated switched-mode power converter converts power from an input source into power for an output load. Power switches within a primary-side power stage control the amount of power input to the power converter and, ultimately, provided to the output load. A digital controller on the secondary side of the power converter generates signals to control the power switches. This controller also senses a rectified voltage on the secondary side of the power converter and uses this sensed voltage to detect fault conditions of the primary side. For example, the sensed rectified voltage is used to detect undervoltage or overvoltage conditions of the input power source of the power converter, or faulty power switches within the primary-side power stage. | 1. A switched-mode power converter using an isolated topology for converting power from an input source into power for an output load, the switched-mode power converter comprising:
a primary side including a power stage coupled to the input source and comprising one or more power switches; a transformer comprising a primary winding coupled to the power stage, and a secondary winding; and a secondary side including:
a rectifier circuit coupled to the secondary winding and configured to provide a first rectified voltage at a first rectified voltage node,
a filter circuit interposed between the first rectified voltage node and an output of the switched-mode power converter, the filter circuit configured to filter the first rectified voltage, thereby providing a filtered voltage at the output, and
a secondary-side controller configured to:
sense the first rectified voltage;
detect, based upon the first rectified voltage sensed on the secondary side, a fault condition of the primary side; and
generate a fault indication and/or modify operation of the switched-mode power converter responsive to said detection. 2. The switched-mode power converter of claim 1, wherein the secondary-side controller is configured to estimate an input voltage of the input source based upon the sensed first rectified voltage. 3. The switched-mode power converter of claim 2, wherein the fault condition is an undervoltage fault condition and wherein estimating the input voltage comprises:
detecting a rectified voltage pulse based upon voltage measurements of the sensed first rectified voltage; determining a representative voltage amplitude for the rectified voltage pulse based on the voltage measurements; and estimating the input voltage based upon the representative voltage amplitude,
and wherein the secondary-side controller is further configured to:
detect, responsive to determining that the estimated input voltage is lower than an undervoltage threshold, the undervoltage fault condition. 4. The switched-mode power converter of claim 2, wherein the fault condition is an overvoltage fault condition and wherein estimating the input voltage comprises:
detecting a rectified voltage pulse based upon voltage measurements of the sensed first rectified voltage; determining a representative voltage amplitude for the rectified voltage pulse based on the voltage measurements; and estimating the input voltage based upon the representative voltage amplitude,
and wherein the secondary-side controller is further configured to:
detect, responsive to determining that the estimated input voltage is higher than an overvoltage threshold, the overvoltage fault condition. 5. The switched-mode power converter of claim 1, wherein the fault condition is a missing-pulse fault condition and wherein the secondary-side controller is configured to:
generate control signals directing the one or more power switches to apply a primary-side voltage pulse across the primary winding of the transformer; determine, based upon the sensed first rectified voltage, whether the generated control signals and the associated primary-side voltage pulse produced a corresponding rectified voltage pulse at the first rectified voltage node; and detect, responsive to determining that no corresponding rectified voltage pulse was produced, the missing-pulse fault condition. 6. The switched-mode power converter of claim 1, wherein the fault condition is a voltage-asymmetry fault condition and wherein the secondary-side controller is configured to:
generate control signals directing the one or more power switches to apply a first primary-side voltage pulse across the primary winding of the transformer, wherein the first primary-side voltage pulse has a first polarity; detect, based on the sensed rectified voltage, a first rectified voltage pulse corresponding to the first primary-side voltage pulse, the first rectified pulse having a first voltage amplitude; generate control signals directing the one or more power switches to apply a second primary-side voltage pulse across the primary winding of the transformer, wherein the second primary-side voltage pulse has a second polarity that is opposite to the first polarity; detect, based on the sensed rectified voltage, a second rectified voltage pulse corresponding to the second primary-side voltage pulse, the second rectified voltage pulse having a second voltage amplitude; determine that a difference between the first and second voltage amplitudes exceeds a voltage difference threshold; and detect, responsive to said determination, the voltage-asymmetry fault indication. 7. The switched-mode power converter of claim 1, wherein the fault indication is a pulse-interval fault indication and wherein the secondary-side controller is configured to:
generate control signals directing the one or more power switches to apply a first primary-side voltage pulse, having a first pulse interval, across the primary winding of the transformer; determine, based on the sensed rectified voltage, a first rectified voltage pulse interval corresponding to the first pulse interval; detect that the first rectified voltage pulse interval is outside of an acceptable interval range, wherein the acceptable interval range is based upon the first pulse interval; and detect, responsive to said determination, the pulse-interval fault indication. 8. The switched-mode power converter of claim 1, wherein the secondary-side controller is configured to:
generate, during a start-up interval in which the switched-mode power converter operates in a start-up operational mode, control signals directing the one or more power switches to apply primary-side voltage pulses to the primary winding of the transformer; detect, based on the sensed first rectified voltage, rectified voltage pulses; suppress fault indications based on the first rectified voltage pulses during the start-up interval; convert from the start-up operational mode to a normal operational mode, responsive to detecting that a first of the rectified voltage pulses comprises a voltage amplitude, a rectified pulse interval, or both a voltage amplitude and a rectified pulse interval that indicate the normal operational mode may commence; and subsequent to converting to the normal operational mode, ceasing the suppression of the fault indications. 9. The switched-mode power converter of claim 1,
wherein the detected fault condition indicates an unsafe operating condition of the switched-mode power converter; and wherein the secondary-side controller is configured to, responsive to detection of the fault condition, disable generation of switch control signals for controlling the one or more power switches. 10. The switched-mode power converter of claim 1,
wherein the detected fault condition indicates that operation of the switched-mode power converter may proceed with an altered operation; and wherein the secondary-side controller is configured to, responsive to detection of the fault condition, alter an operational mode for generating switch control signals for controlling the one or more power switches. 11. The switched-mode power converter of claim 1, wherein the secondary-side controller is configured to:
provide the generated fault indication to an output of the secondary-side controller. 12. An electronic system comprising:
an input power source; an output load; a switched-mode power converter using an isolated topology for converting power from the input power source into power for the output load, the switched-mode power converter comprising:
a power stage coupled to the input source and comprising one or more power switches;
a transformer comprising a primary winding coupled to the power stage, and a secondary winding;
a rectifier circuit coupled to the secondary winding and configured to provide a first rectified voltage at a first rectified voltage node;
a filter circuit interposed between the first rectified voltage node and an output of the switched-mode power converter, and configured to filter the first rectified voltage, thereby providing a filtered voltage at the output; and
a secondary-side controller configured to:
sense the first rectified voltage;
detect a fault condition within the switched-mode power converter based upon the sensed first rectified voltage; and
generate a fault indication responsive to said detection;
a system manager configured to:
input the fault indication; and
responsive to determining that the fault indication indicates an unsafe operating condition or a condition likely to damage the electronic system, shut down the switched-mode power converter. 13. The electronic system of claim 12, wherein the system manager is configured to:
responsive to determining that the fault indication is a warning signal, alter an operational mode for generating switch control signals for controlling the one or more power switches. 14. A method within an isolated switched-mode power converter for converting power from an input source into power for an output load, wherein the power converter comprises a primary side including a power stage coupled to the input source and comprising one or more power switches, a transformer comprising a primary winding coupled to the power stage and a secondary winding, and a secondary side including a rectifier circuit coupled to the secondary winding and configured to provide a first rectified voltage at a first rectified voltage node, a filter circuit interposed between the first rectified voltage node and an output of the switched-mode power converter, the method comprising:
sensing the first rectified voltage; detecting, based upon the first rectified voltage sensed on the secondary side, a fault condition of the primary side; and generating a fault indication and/or modifying operation of the switched-mode power converter responsive to said detecting. 15. The method of claim 14, further comprising:
estimating an input voltage of the input source based upon the sensed first rectified voltage. 16. The method of claim 15, wherein the fault condition is an undervoltage fault indication, and wherein estimating the input voltage comprises:
detecting a rectified voltage pulse based upon voltage measurements of the sensed first rectified voltage; determining a representative voltage amplitude for the rectified voltage pulse based on the voltage measurements; and estimating the input voltage based upon the representative voltage amplitude,
wherein the method further comprises:
detecting, responsive to determining that the estimated input voltage is lower than an undervoltage threshold, the undervoltage fault condition. 17. The method of claim 15, wherein the fault condition is an overvoltage fault condition, and wherein estimating the input voltage comprises:
detecting a rectified voltage pulse based upon voltage measurements of the sensed first rectified voltage; determining a representative voltage amplitude for the rectified voltage pulse based on the voltage measurements; and estimating the input voltage based upon the representative voltage amplitude,
wherein the method further comprises:
detecting, responsive to determining that the estimated input voltage is higher than an overvoltage threshold, the overvoltage fault condition. 18. The method of claim 14, wherein the fault condition is a voltage-asymmetry fault condition, the method further comprising:
generating control signals directing the one or more power switches to apply a first primary-side voltage pulse across the primary winding of the transformer, wherein the first primary-side voltage pulse has a first polarity; detecting, based on the sensed rectified voltage, a first rectified voltage pulse corresponding to the first primary-side voltage pulse, the first rectified pulse having a first voltage amplitude; generating control signals directing the one or more power switches to apply a second primary-side voltage pulse across the primary winding of the transformer, wherein the second primary-side voltage pulse has a second polarity that is opposite to the first polarity; detecting, based on the sensed rectified voltage, a second rectified voltage pulse corresponding to the second primary-side voltage pulse, the second rectified voltage pulse having a second voltage amplitude; determining that a difference between the first and second voltage amplitudes exceeds a voltage difference threshold; and detecting, responsive to said determination, the voltage-asymmetry fault condition. 19. The method of claim 14, wherein the fault condition is a pulse-interval fault indication, the method further comprising:
generating control signals directing the one or more power switches to apply a first primary-side voltage pulse, having a first pulse interval, across the primary winding of the transformer; determining, based on the sensed rectified voltage, a first rectified voltage pulse interval corresponding to the first pulse interval; detecting that the first rectified voltage pulse interval is outside of an acceptable interval range, wherein the acceptable interval range is based upon the first pulse interval; and detecting, responsive to said determination, the pulse-interval fault condition. 20. The method of claim 14, further comprising:
generating, during a start-up interval in which the switched-mode power converter operates in a start-up operational mode, control signals directing the one or more power switches to apply primary-side voltage pulses to the primary winding of the transformer; detecting, based on the sensed first rectified voltage, rectified voltage pulses; suppressing fault indications based on the first rectified voltage pulses during the start-up interval; converting from the start-up operational mode to a normal operational mode, responsive to detecting that a first of the rectified voltage pulses comprises a voltage amplitude, a rectified pulse interval, or both a voltage amplitude and a rectified pulse interval that indicate the normal operational mode may commence; and subsequent to converting to the normal operational mode, ceasing the suppression of the fault indications. | An isolated switched-mode power converter converts power from an input source into power for an output load. Power switches within a primary-side power stage control the amount of power input to the power converter and, ultimately, provided to the output load. A digital controller on the secondary side of the power converter generates signals to control the power switches. This controller also senses a rectified voltage on the secondary side of the power converter and uses this sensed voltage to detect fault conditions of the primary side. For example, the sensed rectified voltage is used to detect undervoltage or overvoltage conditions of the input power source of the power converter, or faulty power switches within the primary-side power stage.1. A switched-mode power converter using an isolated topology for converting power from an input source into power for an output load, the switched-mode power converter comprising:
a primary side including a power stage coupled to the input source and comprising one or more power switches; a transformer comprising a primary winding coupled to the power stage, and a secondary winding; and a secondary side including:
a rectifier circuit coupled to the secondary winding and configured to provide a first rectified voltage at a first rectified voltage node,
a filter circuit interposed between the first rectified voltage node and an output of the switched-mode power converter, the filter circuit configured to filter the first rectified voltage, thereby providing a filtered voltage at the output, and
a secondary-side controller configured to:
sense the first rectified voltage;
detect, based upon the first rectified voltage sensed on the secondary side, a fault condition of the primary side; and
generate a fault indication and/or modify operation of the switched-mode power converter responsive to said detection. 2. The switched-mode power converter of claim 1, wherein the secondary-side controller is configured to estimate an input voltage of the input source based upon the sensed first rectified voltage. 3. The switched-mode power converter of claim 2, wherein the fault condition is an undervoltage fault condition and wherein estimating the input voltage comprises:
detecting a rectified voltage pulse based upon voltage measurements of the sensed first rectified voltage; determining a representative voltage amplitude for the rectified voltage pulse based on the voltage measurements; and estimating the input voltage based upon the representative voltage amplitude,
and wherein the secondary-side controller is further configured to:
detect, responsive to determining that the estimated input voltage is lower than an undervoltage threshold, the undervoltage fault condition. 4. The switched-mode power converter of claim 2, wherein the fault condition is an overvoltage fault condition and wherein estimating the input voltage comprises:
detecting a rectified voltage pulse based upon voltage measurements of the sensed first rectified voltage; determining a representative voltage amplitude for the rectified voltage pulse based on the voltage measurements; and estimating the input voltage based upon the representative voltage amplitude,
and wherein the secondary-side controller is further configured to:
detect, responsive to determining that the estimated input voltage is higher than an overvoltage threshold, the overvoltage fault condition. 5. The switched-mode power converter of claim 1, wherein the fault condition is a missing-pulse fault condition and wherein the secondary-side controller is configured to:
generate control signals directing the one or more power switches to apply a primary-side voltage pulse across the primary winding of the transformer; determine, based upon the sensed first rectified voltage, whether the generated control signals and the associated primary-side voltage pulse produced a corresponding rectified voltage pulse at the first rectified voltage node; and detect, responsive to determining that no corresponding rectified voltage pulse was produced, the missing-pulse fault condition. 6. The switched-mode power converter of claim 1, wherein the fault condition is a voltage-asymmetry fault condition and wherein the secondary-side controller is configured to:
generate control signals directing the one or more power switches to apply a first primary-side voltage pulse across the primary winding of the transformer, wherein the first primary-side voltage pulse has a first polarity; detect, based on the sensed rectified voltage, a first rectified voltage pulse corresponding to the first primary-side voltage pulse, the first rectified pulse having a first voltage amplitude; generate control signals directing the one or more power switches to apply a second primary-side voltage pulse across the primary winding of the transformer, wherein the second primary-side voltage pulse has a second polarity that is opposite to the first polarity; detect, based on the sensed rectified voltage, a second rectified voltage pulse corresponding to the second primary-side voltage pulse, the second rectified voltage pulse having a second voltage amplitude; determine that a difference between the first and second voltage amplitudes exceeds a voltage difference threshold; and detect, responsive to said determination, the voltage-asymmetry fault indication. 7. The switched-mode power converter of claim 1, wherein the fault indication is a pulse-interval fault indication and wherein the secondary-side controller is configured to:
generate control signals directing the one or more power switches to apply a first primary-side voltage pulse, having a first pulse interval, across the primary winding of the transformer; determine, based on the sensed rectified voltage, a first rectified voltage pulse interval corresponding to the first pulse interval; detect that the first rectified voltage pulse interval is outside of an acceptable interval range, wherein the acceptable interval range is based upon the first pulse interval; and detect, responsive to said determination, the pulse-interval fault indication. 8. The switched-mode power converter of claim 1, wherein the secondary-side controller is configured to:
generate, during a start-up interval in which the switched-mode power converter operates in a start-up operational mode, control signals directing the one or more power switches to apply primary-side voltage pulses to the primary winding of the transformer; detect, based on the sensed first rectified voltage, rectified voltage pulses; suppress fault indications based on the first rectified voltage pulses during the start-up interval; convert from the start-up operational mode to a normal operational mode, responsive to detecting that a first of the rectified voltage pulses comprises a voltage amplitude, a rectified pulse interval, or both a voltage amplitude and a rectified pulse interval that indicate the normal operational mode may commence; and subsequent to converting to the normal operational mode, ceasing the suppression of the fault indications. 9. The switched-mode power converter of claim 1,
wherein the detected fault condition indicates an unsafe operating condition of the switched-mode power converter; and wherein the secondary-side controller is configured to, responsive to detection of the fault condition, disable generation of switch control signals for controlling the one or more power switches. 10. The switched-mode power converter of claim 1,
wherein the detected fault condition indicates that operation of the switched-mode power converter may proceed with an altered operation; and wherein the secondary-side controller is configured to, responsive to detection of the fault condition, alter an operational mode for generating switch control signals for controlling the one or more power switches. 11. The switched-mode power converter of claim 1, wherein the secondary-side controller is configured to:
provide the generated fault indication to an output of the secondary-side controller. 12. An electronic system comprising:
an input power source; an output load; a switched-mode power converter using an isolated topology for converting power from the input power source into power for the output load, the switched-mode power converter comprising:
a power stage coupled to the input source and comprising one or more power switches;
a transformer comprising a primary winding coupled to the power stage, and a secondary winding;
a rectifier circuit coupled to the secondary winding and configured to provide a first rectified voltage at a first rectified voltage node;
a filter circuit interposed between the first rectified voltage node and an output of the switched-mode power converter, and configured to filter the first rectified voltage, thereby providing a filtered voltage at the output; and
a secondary-side controller configured to:
sense the first rectified voltage;
detect a fault condition within the switched-mode power converter based upon the sensed first rectified voltage; and
generate a fault indication responsive to said detection;
a system manager configured to:
input the fault indication; and
responsive to determining that the fault indication indicates an unsafe operating condition or a condition likely to damage the electronic system, shut down the switched-mode power converter. 13. The electronic system of claim 12, wherein the system manager is configured to:
responsive to determining that the fault indication is a warning signal, alter an operational mode for generating switch control signals for controlling the one or more power switches. 14. A method within an isolated switched-mode power converter for converting power from an input source into power for an output load, wherein the power converter comprises a primary side including a power stage coupled to the input source and comprising one or more power switches, a transformer comprising a primary winding coupled to the power stage and a secondary winding, and a secondary side including a rectifier circuit coupled to the secondary winding and configured to provide a first rectified voltage at a first rectified voltage node, a filter circuit interposed between the first rectified voltage node and an output of the switched-mode power converter, the method comprising:
sensing the first rectified voltage; detecting, based upon the first rectified voltage sensed on the secondary side, a fault condition of the primary side; and generating a fault indication and/or modifying operation of the switched-mode power converter responsive to said detecting. 15. The method of claim 14, further comprising:
estimating an input voltage of the input source based upon the sensed first rectified voltage. 16. The method of claim 15, wherein the fault condition is an undervoltage fault indication, and wherein estimating the input voltage comprises:
detecting a rectified voltage pulse based upon voltage measurements of the sensed first rectified voltage; determining a representative voltage amplitude for the rectified voltage pulse based on the voltage measurements; and estimating the input voltage based upon the representative voltage amplitude,
wherein the method further comprises:
detecting, responsive to determining that the estimated input voltage is lower than an undervoltage threshold, the undervoltage fault condition. 17. The method of claim 15, wherein the fault condition is an overvoltage fault condition, and wherein estimating the input voltage comprises:
detecting a rectified voltage pulse based upon voltage measurements of the sensed first rectified voltage; determining a representative voltage amplitude for the rectified voltage pulse based on the voltage measurements; and estimating the input voltage based upon the representative voltage amplitude,
wherein the method further comprises:
detecting, responsive to determining that the estimated input voltage is higher than an overvoltage threshold, the overvoltage fault condition. 18. The method of claim 14, wherein the fault condition is a voltage-asymmetry fault condition, the method further comprising:
generating control signals directing the one or more power switches to apply a first primary-side voltage pulse across the primary winding of the transformer, wherein the first primary-side voltage pulse has a first polarity; detecting, based on the sensed rectified voltage, a first rectified voltage pulse corresponding to the first primary-side voltage pulse, the first rectified pulse having a first voltage amplitude; generating control signals directing the one or more power switches to apply a second primary-side voltage pulse across the primary winding of the transformer, wherein the second primary-side voltage pulse has a second polarity that is opposite to the first polarity; detecting, based on the sensed rectified voltage, a second rectified voltage pulse corresponding to the second primary-side voltage pulse, the second rectified voltage pulse having a second voltage amplitude; determining that a difference between the first and second voltage amplitudes exceeds a voltage difference threshold; and detecting, responsive to said determination, the voltage-asymmetry fault condition. 19. The method of claim 14, wherein the fault condition is a pulse-interval fault indication, the method further comprising:
generating control signals directing the one or more power switches to apply a first primary-side voltage pulse, having a first pulse interval, across the primary winding of the transformer; determining, based on the sensed rectified voltage, a first rectified voltage pulse interval corresponding to the first pulse interval; detecting that the first rectified voltage pulse interval is outside of an acceptable interval range, wherein the acceptable interval range is based upon the first pulse interval; and detecting, responsive to said determination, the pulse-interval fault condition. 20. The method of claim 14, further comprising:
generating, during a start-up interval in which the switched-mode power converter operates in a start-up operational mode, control signals directing the one or more power switches to apply primary-side voltage pulses to the primary winding of the transformer; detecting, based on the sensed first rectified voltage, rectified voltage pulses; suppressing fault indications based on the first rectified voltage pulses during the start-up interval; converting from the start-up operational mode to a normal operational mode, responsive to detecting that a first of the rectified voltage pulses comprises a voltage amplitude, a rectified pulse interval, or both a voltage amplitude and a rectified pulse interval that indicate the normal operational mode may commence; and subsequent to converting to the normal operational mode, ceasing the suppression of the fault indications. | 2,800 |
12,259 | 12,259 | 15,248,775 | 2,837 | The disclosure relates to the manufacture of inductive components, in particular transformers, using a combination of microfabrication techniques and discrete component placement. By using a prefabricated core, the core may be made much thicker than one that is deposited using microfabrication techniques. As such, saturation occurs later and the efficiency of the transformer is improved. This is done at a much lower cost than the cost of producing a thicker core by depositing multiple layers using microfabrication techniques. | 1. A method of manufacturing an inductive component, comprising:
providing a substrate; forming at least a portion of one or more windings on the substrate using microfabrication techniques to form a winding structure; and placing at least a first part of a discrete ferromagnetic core on or adjacent a first side of the at least a portion of one or more windings, wherein the first part of the discrete ferromagnetic core is prefabricated. 2. A method according to claim 1, wherein the first part of the ferromagnetic core includes a first planar section formed in a first plane, and the winding structure is completed by the microfabrication techniques prior to the placing. 3. A method according to claim 2, wherein the one or more windings are formed as planar structures substantially parallel to the first plane. 4. A method according to claim 3, wherein the first part of the ferromagnetic core further includes one or more protrusions and the first part of the ferromagnetic core is placed such that the one or more protrusions extend into or around the two or more windings. 5. A method according to claim 3, further comprising placing the winding structure on or adjacent a second part of the ferromagnetic core. 6. A method according to claim 5, wherein the second part of the ferromagnetic core includes a second planar section and the winding structure is placed such that the second planar section is substantially parallel to the first plane. 7. A method according to claim 6, further comprising connecting the one or more protrusions to the second planar structure such that that first and second parts of the ferromagnetic core form a complete ferromagnetic core. 8. A method according to claim 6, wherein the first planar section extends beyond the edges of the one or more windings, the one or more protrusions includes a first and a second protrusion, and the first planar structure is placed such that the first and second protrusions extend around the one or more windings. 9. A method according to claim 8 wherein the one or more windings are formed as planar spiral windings to form a first opening, the one or more protrusions includes a third protrusion, and the first planar section is placed such that the third protrusion extends through the first opening. 10. A method according to claim 9, wherein the third protrusion partially extends into the opening and forms a gap with the second planar section. 11. A method according to claim 1, wherein the substrate includes a layer of ferromagnetic material formed on a side opposing the side on which the one or more windings are formed, the layer of ferromagnetic material forming a second part of the ferromagnetic core. 12. A method according to claim 11, further comprising forming one or more holes in the substrate. 13. A method according to claim 1, further comprising depositing an insulating layer on the substrate, wherein the one or more windings are formed on the insulating layer. 14. A method according to claim 1, wherein the at least a first part of a ferromagnetic core is placed using a pick and place machine. 15. A method according to claim 1, wherein the one or more windings are formed using deposition. 16. A method according to claim 1, wherein the inductive component is a transformer, and the one or more windings is two or more windings. 17. A method of manufacturing an inductive component in which a winding structure is provided using microfabrication techniques and a discrete core is positioned on or around the winding structure. 18. An inductive component, comprising:
one or more windings, at least portions of which are formed using microfabrication techniques; and a discrete ferromagnetic core positioned on or around the one or more windings. 19. An inductive component according to claim 18, wherein the discrete ferromagnetic core is made of Cobalt-Zirconium-Tantalum-Boron. 20. An inductive component according to claim 18, wherein the discrete ferromagnetic core is made of sintered ferrite. | The disclosure relates to the manufacture of inductive components, in particular transformers, using a combination of microfabrication techniques and discrete component placement. By using a prefabricated core, the core may be made much thicker than one that is deposited using microfabrication techniques. As such, saturation occurs later and the efficiency of the transformer is improved. This is done at a much lower cost than the cost of producing a thicker core by depositing multiple layers using microfabrication techniques.1. A method of manufacturing an inductive component, comprising:
providing a substrate; forming at least a portion of one or more windings on the substrate using microfabrication techniques to form a winding structure; and placing at least a first part of a discrete ferromagnetic core on or adjacent a first side of the at least a portion of one or more windings, wherein the first part of the discrete ferromagnetic core is prefabricated. 2. A method according to claim 1, wherein the first part of the ferromagnetic core includes a first planar section formed in a first plane, and the winding structure is completed by the microfabrication techniques prior to the placing. 3. A method according to claim 2, wherein the one or more windings are formed as planar structures substantially parallel to the first plane. 4. A method according to claim 3, wherein the first part of the ferromagnetic core further includes one or more protrusions and the first part of the ferromagnetic core is placed such that the one or more protrusions extend into or around the two or more windings. 5. A method according to claim 3, further comprising placing the winding structure on or adjacent a second part of the ferromagnetic core. 6. A method according to claim 5, wherein the second part of the ferromagnetic core includes a second planar section and the winding structure is placed such that the second planar section is substantially parallel to the first plane. 7. A method according to claim 6, further comprising connecting the one or more protrusions to the second planar structure such that that first and second parts of the ferromagnetic core form a complete ferromagnetic core. 8. A method according to claim 6, wherein the first planar section extends beyond the edges of the one or more windings, the one or more protrusions includes a first and a second protrusion, and the first planar structure is placed such that the first and second protrusions extend around the one or more windings. 9. A method according to claim 8 wherein the one or more windings are formed as planar spiral windings to form a first opening, the one or more protrusions includes a third protrusion, and the first planar section is placed such that the third protrusion extends through the first opening. 10. A method according to claim 9, wherein the third protrusion partially extends into the opening and forms a gap with the second planar section. 11. A method according to claim 1, wherein the substrate includes a layer of ferromagnetic material formed on a side opposing the side on which the one or more windings are formed, the layer of ferromagnetic material forming a second part of the ferromagnetic core. 12. A method according to claim 11, further comprising forming one or more holes in the substrate. 13. A method according to claim 1, further comprising depositing an insulating layer on the substrate, wherein the one or more windings are formed on the insulating layer. 14. A method according to claim 1, wherein the at least a first part of a ferromagnetic core is placed using a pick and place machine. 15. A method according to claim 1, wherein the one or more windings are formed using deposition. 16. A method according to claim 1, wherein the inductive component is a transformer, and the one or more windings is two or more windings. 17. A method of manufacturing an inductive component in which a winding structure is provided using microfabrication techniques and a discrete core is positioned on or around the winding structure. 18. An inductive component, comprising:
one or more windings, at least portions of which are formed using microfabrication techniques; and a discrete ferromagnetic core positioned on or around the one or more windings. 19. An inductive component according to claim 18, wherein the discrete ferromagnetic core is made of Cobalt-Zirconium-Tantalum-Boron. 20. An inductive component according to claim 18, wherein the discrete ferromagnetic core is made of sintered ferrite. | 2,800 |
12,260 | 12,260 | 16,853,186 | 2,816 | A quad flat no lead (“QFN”) package that includes a die having an active side positioned substantially in a first plane and a backside positioned substantially in a second plane parallel to the first plane; a plurality of separate conductive pads each having a first side positioned substantially in the first plane and a second side positioned substantially in the second plane; and mold compound positioned between the first and second planes in voids between the conductive pads and the dies. Also a method of producing a plurality of QFN packages includes forming a strip of plastic material having embedded therein a plurality of dies and a plurality of conductive pads that are wire bonded to the dies and singulating the strip into a plurality of QFN packages by cutting through only the plastic material. | 1. A method of producing a plurality of QFN packages comprising:
forming a strip of plastic material having embedded therein a plurality of dies and a plurality of conductive pads that are wire bonded to the dies; and singulating the strip into a plurality of QFN packages by cutting through only the plastic material. 2. The method of claim 1 wherein said forming a strip of plastic material having embedded therein a plurality of dies and a plurality of conductive pads that are wire bonded to the dies comprises:
providing a plurality of dies and a plurality of conductive pads that have substantially the same thickness and providing a support film sheet; and
attaching a first side of the plurality of dies and a first side of the plurality of conductive pads to one side of the support film sheet. 3. The method of claim 2, said forming a strip of plastic material further comprising filling voids between the plurality of dies and the plurality of conductive pads with mold compound while leaving a side of each of the plurality of dies and each of the plurality of conductive pads positioned remotely from the support sheet exposed. 4. The method of claim 3, said forming a strip of plastic material further comprising removing the support film sheet to provide a strip of mold compound having a first side on which the first side of each die and the first side of each conductive pad are exposed and a second side on which the second side of each die and the second side of each conductive pad are exposed. 5. The method of claim 4, said forming a strip of plastic material further comprising wire bonding an active side of each die to one side of each of the plurality of conductive pads. 6. The method of claim 5, said forming a strip of plastic material further comprising covering the side of the strip of mold compound having the wire bonds with a second layer of mold compound to form a twice molded assembly. | A quad flat no lead (“QFN”) package that includes a die having an active side positioned substantially in a first plane and a backside positioned substantially in a second plane parallel to the first plane; a plurality of separate conductive pads each having a first side positioned substantially in the first plane and a second side positioned substantially in the second plane; and mold compound positioned between the first and second planes in voids between the conductive pads and the dies. Also a method of producing a plurality of QFN packages includes forming a strip of plastic material having embedded therein a plurality of dies and a plurality of conductive pads that are wire bonded to the dies and singulating the strip into a plurality of QFN packages by cutting through only the plastic material.1. A method of producing a plurality of QFN packages comprising:
forming a strip of plastic material having embedded therein a plurality of dies and a plurality of conductive pads that are wire bonded to the dies; and singulating the strip into a plurality of QFN packages by cutting through only the plastic material. 2. The method of claim 1 wherein said forming a strip of plastic material having embedded therein a plurality of dies and a plurality of conductive pads that are wire bonded to the dies comprises:
providing a plurality of dies and a plurality of conductive pads that have substantially the same thickness and providing a support film sheet; and
attaching a first side of the plurality of dies and a first side of the plurality of conductive pads to one side of the support film sheet. 3. The method of claim 2, said forming a strip of plastic material further comprising filling voids between the plurality of dies and the plurality of conductive pads with mold compound while leaving a side of each of the plurality of dies and each of the plurality of conductive pads positioned remotely from the support sheet exposed. 4. The method of claim 3, said forming a strip of plastic material further comprising removing the support film sheet to provide a strip of mold compound having a first side on which the first side of each die and the first side of each conductive pad are exposed and a second side on which the second side of each die and the second side of each conductive pad are exposed. 5. The method of claim 4, said forming a strip of plastic material further comprising wire bonding an active side of each die to one side of each of the plurality of conductive pads. 6. The method of claim 5, said forming a strip of plastic material further comprising covering the side of the strip of mold compound having the wire bonds with a second layer of mold compound to form a twice molded assembly. | 2,800 |
12,261 | 12,261 | 15,610,566 | 2,893 | A display device including a base layer, a circuit layer, a light emitting device layer, an organic layer, and a touch sensing unit. The base layer includes a display area and a non-display area. A plurality of insulation patterns overlaps the non-display area. The organic layer is disposed on the light emitting device and overlaps the plurality of insulation patterns and the organic light emitting diode. At least a portion of the plurality of touch signal lines overlaps the plurality of insulation patterns. | 1. A display device comprising:
a base layer comprising a display area and a non-display area; a circuit layer comprising at least one intermediate insulation layer and a power supply electrode overlapping the non-display area, the circuit layer disposed on the base layer; a light emitting device layer comprising:
an organic light emitting diode comprising a first electrode disposed on the circuit layer, a light emitting layer, and a second electrode;
a pixel definition layer comprising an opening for exposing the first electrode;
a connection electrode connecting the second electrode and the power supply electrode, the connection electrode comprising a plurality of holes; and
a plurality of insulation patterns overlapping the holes;
a thin film encapsulation layer comprising an organic layer overlapping the plurality of insulation patterns and the organic light emitting diode, the thin film encapsulation layer disposed on the light emitting device layer; and is a touch sensing unit comprising at least one touch insulation layer, a plurality of touch electrodes, and a plurality of touch signal lines connected to the plurality of touch electrodes, the touch sensing unit disposed on the thin film encapsulation layer, wherein at least a portion of the plurality of touch signal lines overlaps the plurality of insulation patterns. 2. The display device of claim 1, wherein each of the plurality of holes is covered by a corresponding insulation pattern among the plurality of insulation patterns. 3. The display device of claim 1, wherein the connection electrode comprises a first transparent conductive layer, a metal layer disposed on the first transparent conductive layer, and a second transparent conductive layer disposed on the metal layer. 4. The display device of claim 1, wherein:
the plurality of holes define a plurality of rows and the plurality of rows are arranged in a first direction; a first row among the plurality of rows comprises first holes arranged in a second direction intersecting the first direction; a second row among the plurality of rows comprises second holes arranged in the second direction and disposed between the first holes; and a third row among the plurality of rows is arranged in the second direction and comprises second holes corresponding to the first holes. 5. The display device of claim 1, wherein the plurality of holes are arranged in an n×m matrix. 6. The display device of claim 5, wherein the plurality of insulation patterns comprise:
first insulation patterns arranged in an nxm matrix in a one-to-one correspondence with the holes in the n×m matrix; and second insulation patterns spaced apart from the first insulation patterns in the n×m matrix, wherein the second insulation patterns define n-1 rows between n rows of the first insulation patterns and m-1 columns between m columns of the first insulation patterns. 7. The display device of claim 5, wherein the plurality of insulation patterns comprise:
first insulation patterns arranged in an nxm matrix in a one-to-one correspondence with the holes in the n×m matrix; and second insulation patterns disposed at centers of four first insulation patterns for defining the smallest rectangle among the first insulation patterns. 8. The display device of claim 5, wherein:
the plurality of insulation patterns comprise a first insulation pattern comprising a column portion and a row portion connected to the column portion; and the row portion overlaps holes arranged in a column direction among the holes in the n×m matrix, and the row portion overlaps a hole disposed in a row direction of the holes arranged in the column direction. 9. The display device of claim 8, wherein the plurality of insulation patterns further comprise:
a second insulation pattern; a plurality of the first insulation patterns; and the second insulation pattern disposed between two first insulation patterns spaced in the row direction. 10. The display device of claim 5, wherein:
the plurality of insulation patterns comprise column insulation patterns, each of the column insulation patterns overlapping holes arranged in a column direction among the holes in the n×m matrix; and at least one among the column insulation patterns is disposed between every n rows of the holes in the n×m matrix. 11. The display device of claim 1, wherein the plurality of insulation patterns have the same thickness and the same material as the pixel definition layer. 12. The display device of claim 1, wherein the non-display area comprises:
a first non-display area and a second non-display area facing each other in a first direction with the display area arranged therebetween; and a third non-display area and a fourth non-display area facing each other in a second direction intersecting the first direction with the display area arranged therebetween, wherein: the power supply electrode is disposed at least in the first non-display area, the third non-display area, and the fourth non-display area; and the connection electrode is disposed at least in the third non-display area and the fourth non-display area. 13. The display device of claim 12, further comprising a dam disposed at least in the first non-display area, the third non-display area, and the fourth non-display area, and
wherein the dam overlaps the power supply electrode. 14. The display device of claim 13, wherein the at least one touch insulation layer overlaps the dam. 15. The display device of claim 13, wherein the dam has the same thickness and the same material as the pixel definition layer or the at least one intermediate insulation layer. 16. The display device of claim 1, wherein the second electrode overlaps a least a portion of the plurality of insulation patterns. 17. The display device of claim 1, wherein the connection electrode comprises the same layer structure and the same material as the first electrode. 18. A display device comprising:
a base layer comprising a display area and a non-display area; a circuit layer disposed on the base layer; a light emitting device layer comprising a light emitting diode disposed on the circuit layer, a pixel definition layer comprising an opening for exposing a first electrode of the light emitting diode, and a plurality of insulation patterns overlapping the non-display area; an organic layer disposed on the light emitting device layer and overlapping the plurality of insulation patterns and the light emitting diode; and a touch sensing unit comprising a plurality of touch electrodes and a plurality of touch signal lines connected to the plurality of touch electrodes, the touch sensing unit disposed on the organic layer, wherein at least a portion of the plurality of touch signal lines overlaps the plurality of insulation patterns. 19. The display device of claim 18, wherein:
the plurality of insulation patterns define a plurality of rows and the plurality of rows are arranged in a first direction; a first row among the plurality of rows comprises first insulation patterns arranged in a second direction intersecting the first direction; a second row among the plurality of rows comprises second insulation patterns arranged in the second direction and disposed between the first insulation patterns; and a third row among the plurality of rows comprises third insulation patterns arranged in the second direction and corresponding to the first insulation patterns. 20. The display device of claim 18, wherein the plurality of insulation patterns comprise first insulation patterns comprising a column portion extending along an edge of the base layer and a row portion connected to the column portion. 21. The display device of claim 20, wherein the plurality of insulation patterns further comprise second insulation patterns disposed between two first insulation patterns spaced apart from each other. 22. The display device of claim 18, wherein:
the plurality of insulation patterns comprise column insulation patterns extending along an edge of the base layer; and the column insulation patterns comprise first column insulation patterns and second column insulation patterns, the first column insulation patterns and the second insulation patterns are disposed alternately, and ends of the second column insulation patterns overlaps center areas of the first column insulation patterns. | A display device including a base layer, a circuit layer, a light emitting device layer, an organic layer, and a touch sensing unit. The base layer includes a display area and a non-display area. A plurality of insulation patterns overlaps the non-display area. The organic layer is disposed on the light emitting device and overlaps the plurality of insulation patterns and the organic light emitting diode. At least a portion of the plurality of touch signal lines overlaps the plurality of insulation patterns.1. A display device comprising:
a base layer comprising a display area and a non-display area; a circuit layer comprising at least one intermediate insulation layer and a power supply electrode overlapping the non-display area, the circuit layer disposed on the base layer; a light emitting device layer comprising:
an organic light emitting diode comprising a first electrode disposed on the circuit layer, a light emitting layer, and a second electrode;
a pixel definition layer comprising an opening for exposing the first electrode;
a connection electrode connecting the second electrode and the power supply electrode, the connection electrode comprising a plurality of holes; and
a plurality of insulation patterns overlapping the holes;
a thin film encapsulation layer comprising an organic layer overlapping the plurality of insulation patterns and the organic light emitting diode, the thin film encapsulation layer disposed on the light emitting device layer; and is a touch sensing unit comprising at least one touch insulation layer, a plurality of touch electrodes, and a plurality of touch signal lines connected to the plurality of touch electrodes, the touch sensing unit disposed on the thin film encapsulation layer, wherein at least a portion of the plurality of touch signal lines overlaps the plurality of insulation patterns. 2. The display device of claim 1, wherein each of the plurality of holes is covered by a corresponding insulation pattern among the plurality of insulation patterns. 3. The display device of claim 1, wherein the connection electrode comprises a first transparent conductive layer, a metal layer disposed on the first transparent conductive layer, and a second transparent conductive layer disposed on the metal layer. 4. The display device of claim 1, wherein:
the plurality of holes define a plurality of rows and the plurality of rows are arranged in a first direction; a first row among the plurality of rows comprises first holes arranged in a second direction intersecting the first direction; a second row among the plurality of rows comprises second holes arranged in the second direction and disposed between the first holes; and a third row among the plurality of rows is arranged in the second direction and comprises second holes corresponding to the first holes. 5. The display device of claim 1, wherein the plurality of holes are arranged in an n×m matrix. 6. The display device of claim 5, wherein the plurality of insulation patterns comprise:
first insulation patterns arranged in an nxm matrix in a one-to-one correspondence with the holes in the n×m matrix; and second insulation patterns spaced apart from the first insulation patterns in the n×m matrix, wherein the second insulation patterns define n-1 rows between n rows of the first insulation patterns and m-1 columns between m columns of the first insulation patterns. 7. The display device of claim 5, wherein the plurality of insulation patterns comprise:
first insulation patterns arranged in an nxm matrix in a one-to-one correspondence with the holes in the n×m matrix; and second insulation patterns disposed at centers of four first insulation patterns for defining the smallest rectangle among the first insulation patterns. 8. The display device of claim 5, wherein:
the plurality of insulation patterns comprise a first insulation pattern comprising a column portion and a row portion connected to the column portion; and the row portion overlaps holes arranged in a column direction among the holes in the n×m matrix, and the row portion overlaps a hole disposed in a row direction of the holes arranged in the column direction. 9. The display device of claim 8, wherein the plurality of insulation patterns further comprise:
a second insulation pattern; a plurality of the first insulation patterns; and the second insulation pattern disposed between two first insulation patterns spaced in the row direction. 10. The display device of claim 5, wherein:
the plurality of insulation patterns comprise column insulation patterns, each of the column insulation patterns overlapping holes arranged in a column direction among the holes in the n×m matrix; and at least one among the column insulation patterns is disposed between every n rows of the holes in the n×m matrix. 11. The display device of claim 1, wherein the plurality of insulation patterns have the same thickness and the same material as the pixel definition layer. 12. The display device of claim 1, wherein the non-display area comprises:
a first non-display area and a second non-display area facing each other in a first direction with the display area arranged therebetween; and a third non-display area and a fourth non-display area facing each other in a second direction intersecting the first direction with the display area arranged therebetween, wherein: the power supply electrode is disposed at least in the first non-display area, the third non-display area, and the fourth non-display area; and the connection electrode is disposed at least in the third non-display area and the fourth non-display area. 13. The display device of claim 12, further comprising a dam disposed at least in the first non-display area, the third non-display area, and the fourth non-display area, and
wherein the dam overlaps the power supply electrode. 14. The display device of claim 13, wherein the at least one touch insulation layer overlaps the dam. 15. The display device of claim 13, wherein the dam has the same thickness and the same material as the pixel definition layer or the at least one intermediate insulation layer. 16. The display device of claim 1, wherein the second electrode overlaps a least a portion of the plurality of insulation patterns. 17. The display device of claim 1, wherein the connection electrode comprises the same layer structure and the same material as the first electrode. 18. A display device comprising:
a base layer comprising a display area and a non-display area; a circuit layer disposed on the base layer; a light emitting device layer comprising a light emitting diode disposed on the circuit layer, a pixel definition layer comprising an opening for exposing a first electrode of the light emitting diode, and a plurality of insulation patterns overlapping the non-display area; an organic layer disposed on the light emitting device layer and overlapping the plurality of insulation patterns and the light emitting diode; and a touch sensing unit comprising a plurality of touch electrodes and a plurality of touch signal lines connected to the plurality of touch electrodes, the touch sensing unit disposed on the organic layer, wherein at least a portion of the plurality of touch signal lines overlaps the plurality of insulation patterns. 19. The display device of claim 18, wherein:
the plurality of insulation patterns define a plurality of rows and the plurality of rows are arranged in a first direction; a first row among the plurality of rows comprises first insulation patterns arranged in a second direction intersecting the first direction; a second row among the plurality of rows comprises second insulation patterns arranged in the second direction and disposed between the first insulation patterns; and a third row among the plurality of rows comprises third insulation patterns arranged in the second direction and corresponding to the first insulation patterns. 20. The display device of claim 18, wherein the plurality of insulation patterns comprise first insulation patterns comprising a column portion extending along an edge of the base layer and a row portion connected to the column portion. 21. The display device of claim 20, wherein the plurality of insulation patterns further comprise second insulation patterns disposed between two first insulation patterns spaced apart from each other. 22. The display device of claim 18, wherein:
the plurality of insulation patterns comprise column insulation patterns extending along an edge of the base layer; and the column insulation patterns comprise first column insulation patterns and second column insulation patterns, the first column insulation patterns and the second insulation patterns are disposed alternately, and ends of the second column insulation patterns overlaps center areas of the first column insulation patterns. | 2,800 |
12,262 | 12,262 | 15,313,704 | 2,864 | A vehicle test device is to test performance of a vehicle or a part of the vehicle by rotating a wheel placed on a rotating body in order to reproduce an actually running state of the vehicle by controlling rotational speed of the wheel so as to make the rotational speed equal to a target value accurately, and a rotation related value that indicates rotational speed of the wheel or torque applied to the wheel is obtained, and the rotational speed of the rotating body or the torque applied to the rotating body is controlled so as to make the rotation related value equal to a predetermined target value. | 1. A vehicle test device that tests performance of a vehicle or a part of a vehicle by rotating a wheel placed on a rotating body, wherein
the vehicle test device obtains a rotation related value that indicates rotational speed of the wheel or torque applied to the wheel, and controls rotational speed of the rotating body or torque applied to the rotating body so as to make the rotation related value equal to a predetermined target value. 2. The vehicle test device described in claim 1, wherein
the predetermined target value is the rotational speed of the wheel or the torque applied to the wheel obtained at an actual running time, or the rotational speed of the wheel or the torque applied to the wheel calculated by the use of a running data obtained at the actual running time. 3. The vehicle test device described in claim 1, and is characterized by having
a rotational speed detecting part that detects the rotational speed of the wheel in a state of being contact or contactless with the wheel. 4. The vehicle test device described in claim 1, and is characterized by having
a control device that calculates the rotational speed of the wheel based on a signal obtained through a network loaded on the vehicle and controls the rotational speed of the rotating body or the torque applied to the rotating body so as to make the rotational speed of the wheel equal to the predetermined target value. 5. The vehicle test device described in claim 1, wherein
a chassis dynamometer is used, and the rotating body is a chassis roller. 6. A vehicle test method that tests performance of a vehicle or a part of a vehicle by rotating a wheel placed on a rotating body, wherein
a rotation related value that indicates rotational speed of the wheel or torque applied to the wheel is obtained, and the rotational speed of the rotating body or the torque applied to the rotating body is controlled so as to make the rotation related value equal to a predetermined target value. 7. A recording medium recorded with a program used for a vehicle test device that tests performance of a vehicle or a part of a vehicle by rotating a wheel placed on a rotating body, wherein
a rotation related value that indicates rotational speed of the wheel or torque applied to the wheel is obtained, and the rotational speed of the rotating body or the torque applied to the rotating body is controlled so as to make the rotation related value equal to a predetermined target value. | A vehicle test device is to test performance of a vehicle or a part of the vehicle by rotating a wheel placed on a rotating body in order to reproduce an actually running state of the vehicle by controlling rotational speed of the wheel so as to make the rotational speed equal to a target value accurately, and a rotation related value that indicates rotational speed of the wheel or torque applied to the wheel is obtained, and the rotational speed of the rotating body or the torque applied to the rotating body is controlled so as to make the rotation related value equal to a predetermined target value.1. A vehicle test device that tests performance of a vehicle or a part of a vehicle by rotating a wheel placed on a rotating body, wherein
the vehicle test device obtains a rotation related value that indicates rotational speed of the wheel or torque applied to the wheel, and controls rotational speed of the rotating body or torque applied to the rotating body so as to make the rotation related value equal to a predetermined target value. 2. The vehicle test device described in claim 1, wherein
the predetermined target value is the rotational speed of the wheel or the torque applied to the wheel obtained at an actual running time, or the rotational speed of the wheel or the torque applied to the wheel calculated by the use of a running data obtained at the actual running time. 3. The vehicle test device described in claim 1, and is characterized by having
a rotational speed detecting part that detects the rotational speed of the wheel in a state of being contact or contactless with the wheel. 4. The vehicle test device described in claim 1, and is characterized by having
a control device that calculates the rotational speed of the wheel based on a signal obtained through a network loaded on the vehicle and controls the rotational speed of the rotating body or the torque applied to the rotating body so as to make the rotational speed of the wheel equal to the predetermined target value. 5. The vehicle test device described in claim 1, wherein
a chassis dynamometer is used, and the rotating body is a chassis roller. 6. A vehicle test method that tests performance of a vehicle or a part of a vehicle by rotating a wheel placed on a rotating body, wherein
a rotation related value that indicates rotational speed of the wheel or torque applied to the wheel is obtained, and the rotational speed of the rotating body or the torque applied to the rotating body is controlled so as to make the rotation related value equal to a predetermined target value. 7. A recording medium recorded with a program used for a vehicle test device that tests performance of a vehicle or a part of a vehicle by rotating a wheel placed on a rotating body, wherein
a rotation related value that indicates rotational speed of the wheel or torque applied to the wheel is obtained, and the rotational speed of the rotating body or the torque applied to the rotating body is controlled so as to make the rotation related value equal to a predetermined target value. | 2,800 |
12,263 | 12,263 | 15,874,048 | 2,896 | A zoom lens including in order from an object side: a positive first unit configured not to move for zooming; a negative second unit configured to move to the image side for zooming to a telephoto end; and a relay lens unit configured not to move for zooming, wherein the first unit consists of five lenses including, in order from the object side, a negative lens, a positive lens, a positive lens, a positive lens and a positive lens, or six lenses including, in order from the object side, a positive lens, a negative lens, a positive lens, a positive lens, a positive lens and a positive lens, and a refractive index of the negative lens in the first unit, an Abbe number of the negative lens, a focal length of the negative lens, and a focal length of the first lens unit are appropriately set. | 1. A zoom lens comprising in order from an object side to an image side:
a first lens unit having a positive refractive power and configured not to move for zooming; a second lens unit having a negative refractive power and configured to move to the image side for zooming from a wide angle end to a telephoto end; and a relay lens unit configured not to move for zooming, wherein the first lens unit consists of five lenses including, in order from the object side to the image side, a negative lens, a positive lens, a positive lens, a positive lens and a positive lens, or six lenses including, in order from the object side to the image side, a positive lens, a negative lens, a positive lens, a positive lens, a positive lens and a positive lens, and conditional expressions
39<νn<48,
2.24<Nn+0.01×νn<2.32,
1.79<Nn<1.91, and
1.5<|fn/f1|<2.0
are satisfied, where Nn represents a refractive index of the negative lens in the first lens unit, νn represents an Abbe number of the negative lens, fn represents a focal length of the negative lens, and f1 represents a focal length of the first lens unit, the Abbe number ν being expressed by an expression
ν=(Nd−1)/(NF−NC)
where NF, Nd and NC represent refractive indices with respect to an F-line, a d-line and a C-line of Fraunhofer lines, respectively. 2. The zoom lens according to claim 1, wherein a conditional expression
77<νpa<100
is satisfied, where νpa represents an average of values of the Abbe number of the positive lenses in the first lens unit. 3. The zoom lens according to claim 1, wherein the zoom lens consists of, in order from the object side to the image side, the first lens unit, the second lens unit, a third lens unit configured to move for zooming, and the relay lens unit. 4. The zoom lens according to claim 1, wherein the zoom lens consists of, in order from the object side to the image side, the first lens unit, the second lens unit, a third lens unit configured to move for zooming, a fourth lens unit configured to move for zooming, and the relay lens unit. 5. The zoom lens according to claim 1, wherein the zoom lens consists of, in order from the object side to the image side, the first lens unit, the second lens unit, a third lens unit configured to move for zooming, a fourth lens unit configured to move for zooming, a fifth lens unit configured to move for zooming, and the relay lens unit. 6. The zoom lens according to claim 1, wherein a conditional expression
3.1×10−3<(θp2−θn2)/(νn2−νp2)<6.0×10−3,
is satisfied, where νp2 and θp2 respectively represent the Abbe number and a partial dispersion ratio of a positive lens having the Abbe number smallest of ones of the Abbe number of positive lenses included in the second lens unit, and νn2 and θn2 respectively represent the Abbe number and a partial dispersion ratio of a negative lens having the Abbe number smallest of ones of the Abbe number of negative lenses included in the second lens unit, the partial dispersion ratio θ being expressed by an expression
θ=(Ng−NF)/(NF−NC),
where Ng represents a refractive index with respect to a g-line of Fraunhofer lines. 7. The zoom lens according to claim 1, wherein a conditional expression
3<|f1/f2|<9
is satisfied, where f1 represents a focal length of the first lens unit, and f2 represents a focal length of the second lens unit. 8. An image pickup apparatus comprising:
a zoom lens comprising in order from an object side to an image side:
a first lens unit having a positive refractive power and configured not to move for zooming; a second lens unit having a negative refractive power and configured to move to the image side for zooming from a wide angle end to a telephoto end; and a relay lens unit configured not to move for zooming,
wherein the first lens unit consists of five lenses including, in order from the object side to the image side, a negative lens, a positive lens, a positive lens, a positive lens and a positive lens, or six lenses including, in order from the object side to the image side, a positive lens, a negative lens, a positive lens, a positive lens, a positive lens and a positive lens, and
conditional expressions
39<νn<48,
2.24<Nn+0.01×νn<2.32,
1.79<Nn<1.91, and
1.5<|fn/f1|<2.0
are satisfied, where Nn represents a refractive index of the negative lens in the first lens unit, νn represents an Abbe number of the negative lens, fn represents a focal length of the negative lens, and f1 represents a focal length of the first lens unit, the Abbe number ν being expressed by an expression
ν=(Nd−1)/(NF−NC)
where NF, Nd and NC represent refractive indices with respect to an F-line, a d-line and a C-line of Fraunhofer lines, respectively, and an image pickup element configured to receive an image formed by the zoom lens. | A zoom lens including in order from an object side: a positive first unit configured not to move for zooming; a negative second unit configured to move to the image side for zooming to a telephoto end; and a relay lens unit configured not to move for zooming, wherein the first unit consists of five lenses including, in order from the object side, a negative lens, a positive lens, a positive lens, a positive lens and a positive lens, or six lenses including, in order from the object side, a positive lens, a negative lens, a positive lens, a positive lens, a positive lens and a positive lens, and a refractive index of the negative lens in the first unit, an Abbe number of the negative lens, a focal length of the negative lens, and a focal length of the first lens unit are appropriately set.1. A zoom lens comprising in order from an object side to an image side:
a first lens unit having a positive refractive power and configured not to move for zooming; a second lens unit having a negative refractive power and configured to move to the image side for zooming from a wide angle end to a telephoto end; and a relay lens unit configured not to move for zooming, wherein the first lens unit consists of five lenses including, in order from the object side to the image side, a negative lens, a positive lens, a positive lens, a positive lens and a positive lens, or six lenses including, in order from the object side to the image side, a positive lens, a negative lens, a positive lens, a positive lens, a positive lens and a positive lens, and conditional expressions
39<νn<48,
2.24<Nn+0.01×νn<2.32,
1.79<Nn<1.91, and
1.5<|fn/f1|<2.0
are satisfied, where Nn represents a refractive index of the negative lens in the first lens unit, νn represents an Abbe number of the negative lens, fn represents a focal length of the negative lens, and f1 represents a focal length of the first lens unit, the Abbe number ν being expressed by an expression
ν=(Nd−1)/(NF−NC)
where NF, Nd and NC represent refractive indices with respect to an F-line, a d-line and a C-line of Fraunhofer lines, respectively. 2. The zoom lens according to claim 1, wherein a conditional expression
77<νpa<100
is satisfied, where νpa represents an average of values of the Abbe number of the positive lenses in the first lens unit. 3. The zoom lens according to claim 1, wherein the zoom lens consists of, in order from the object side to the image side, the first lens unit, the second lens unit, a third lens unit configured to move for zooming, and the relay lens unit. 4. The zoom lens according to claim 1, wherein the zoom lens consists of, in order from the object side to the image side, the first lens unit, the second lens unit, a third lens unit configured to move for zooming, a fourth lens unit configured to move for zooming, and the relay lens unit. 5. The zoom lens according to claim 1, wherein the zoom lens consists of, in order from the object side to the image side, the first lens unit, the second lens unit, a third lens unit configured to move for zooming, a fourth lens unit configured to move for zooming, a fifth lens unit configured to move for zooming, and the relay lens unit. 6. The zoom lens according to claim 1, wherein a conditional expression
3.1×10−3<(θp2−θn2)/(νn2−νp2)<6.0×10−3,
is satisfied, where νp2 and θp2 respectively represent the Abbe number and a partial dispersion ratio of a positive lens having the Abbe number smallest of ones of the Abbe number of positive lenses included in the second lens unit, and νn2 and θn2 respectively represent the Abbe number and a partial dispersion ratio of a negative lens having the Abbe number smallest of ones of the Abbe number of negative lenses included in the second lens unit, the partial dispersion ratio θ being expressed by an expression
θ=(Ng−NF)/(NF−NC),
where Ng represents a refractive index with respect to a g-line of Fraunhofer lines. 7. The zoom lens according to claim 1, wherein a conditional expression
3<|f1/f2|<9
is satisfied, where f1 represents a focal length of the first lens unit, and f2 represents a focal length of the second lens unit. 8. An image pickup apparatus comprising:
a zoom lens comprising in order from an object side to an image side:
a first lens unit having a positive refractive power and configured not to move for zooming; a second lens unit having a negative refractive power and configured to move to the image side for zooming from a wide angle end to a telephoto end; and a relay lens unit configured not to move for zooming,
wherein the first lens unit consists of five lenses including, in order from the object side to the image side, a negative lens, a positive lens, a positive lens, a positive lens and a positive lens, or six lenses including, in order from the object side to the image side, a positive lens, a negative lens, a positive lens, a positive lens, a positive lens and a positive lens, and
conditional expressions
39<νn<48,
2.24<Nn+0.01×νn<2.32,
1.79<Nn<1.91, and
1.5<|fn/f1|<2.0
are satisfied, where Nn represents a refractive index of the negative lens in the first lens unit, νn represents an Abbe number of the negative lens, fn represents a focal length of the negative lens, and f1 represents a focal length of the first lens unit, the Abbe number ν being expressed by an expression
ν=(Nd−1)/(NF−NC)
where NF, Nd and NC represent refractive indices with respect to an F-line, a d-line and a C-line of Fraunhofer lines, respectively, and an image pickup element configured to receive an image formed by the zoom lens. | 2,800 |
12,264 | 12,264 | 15,920,652 | 2,853 | An ink composition for use in digital offset printing including at least one component selected from the group consisting of a curable monomer and a curable oligomer; an optional dispersant; an optional photoinitiator; and at least one non-radiation curable additive, wherein the non-radiation curable additive is a detergent or an emulsifying agent, or wherein the non-radiation curable additive functions as a detergent or emulsifying agent when in the presence of a cleaning fluid, and wherein the non-radiation curable additive is a solid at a temperature of from about 20° C. to about 40° C. | 1. An ink composition for use in digital offset printing, comprising:
at least one component selected from the group consisting of a curable monomer and a curable oligomer; an optional dispersant; an optional photoinitiator; and at least one non-radiation curable additive, wherein the non-radiation curable additive is a detergent or an emulsifying agent, or wherein the non-radiation curable additive functions as a detergent or emulsifying agent when in the presence of a cleaning fluid, and wherein the non-radiation curable additive is a solid at a temperature of from about 20° C. to about 40° C. 2. The ink composition of claim 1, wherein the at least one non-radiation curable additive is a solid at a temperature of from about 20° C. to about 30° C. 3. The ink composition of claim 1, wherein the at least one non-radiation curable additive is selected from the group consisting of polyether alcohol, diol, poly(oxyethylene) alkyl ether, polyol copolymer, emulsifying wax, polyester glycol, ester wax, sorbitan ester, ethoxylated sorbitan ester, polyester, and combinations thereof. 4. The ink composition of claim 1, wherein the at least one non-radiation curable additive is selected from the group consisting of polyethylene glycol, poly(ethylene-co-vinyl acetate), poly(vinyl alcohol), polyvinylpyrrolidone, behenyl acrylate, poly(ethylene terephthalate), poly(vinyl acetate), 1,6-hexanediol, an emulsifying wax comprising cetearyl alcohol and polysorbate 60, stearyl stearate, 1,8-octanediol, 1,2-tetradecanediol, 1,10-decanediol, polyoxyethylene (23) lauryl ether), polyoxyethylene (100) stearyl ether), polycaprolactone diol, polycaprolactone, poloxamer 188, behenyl behenate, stearyl behenate, cetyl stearate, stearyl stearate, polycaprolactone-block-polytetrahydrofuran-block-polycaprolactone, castor wax, sorbitan monostearate, sorbitan monopalmitate, cetyl alcohol, stearyl alcohol, cetostearyl alcohol, and combinations thereof. 5. The ink composition of claim 1, wherein the at least one non-radiation curable additive is selected from the group consisting of polyethylene glycol, diol, emulsifying wax, alkyl alkenate, polyoxyethylene alkyl ether, polyol, polycaprolactone, polycaprolactone-block-polytetrahydrofuran-block-polycaprolactone, castor wax, and combinations thereof. 6. The ink composition of claim 1, wherein the at least one non-radiation curable additive is present in the ink composition in an amount of from about 1 to about 6 percent by weight based upon the total weight of the ink composition. 7. The ink composition of claim 1, wherein the non-radiation curable additive functions as a detergent or emulsifying agent when in the presence of a cleaning fluid, and wherein the cleaning fluid comprises a cleaning fluid of a cleaning subsystem in a digital offset printing device. 8. The ink composition of claim 1, wherein the cleaning fluid comprises water or a combination of water and surfactant. 9. The ink composition of claim 1, wherein the at least one component selected from the group consisting of a curable monomer and a curable oligomer is a component selected from the group consisting of acrylated polyesters, acrylated polyethers, acrylated epoxies, urethane acrylates, and pentaerythritol tetraacrylate, and combinations thereof. 10. The ink composition of claim 1, wherein the at least one component selected from the group consisting of a curable monomer and a curable oligomer is a component selected from the group consisting of a tetrafunctional polyester acrylate oligomer, a propoxylated trimethylolpropane triacrylate monomer, and combinations thereof. 11. A process of digital offset printing with a digital offset printing device, the process comprising:
applying an ink composition onto a re-imageable imaging member surface at an ink take up temperature, the re-imageable imaging member having dampening fluid disposed thereon; forming an ink image; transferring the ink image from the re-imageable surface of the imaging member to a printable substrate at an ink transfer temperature; wherein the ink composition comprises: at least one component selected from the group consisting of a curable monomer and a curable oligomer; an optional dispersant; an optional photoinitiator; and at least one non-radiation curable additive, wherein the non-radiation curable additive is a detergent or an emulsifying agent, or wherein the non-radiation curable additive functions as a detergent or emulsifying agent when in the presence of a cleaning fluid, and wherein the non-radiation curable additive is a solid at a temperature of from about 20° C. to about 40° C. 12. The process of claim 11, wherein the at least one non-radiation curable additive is a solid at a temperature of from about 20° C. to about 30° C. 13. The process of claim 11, wherein the at least one non-radiation curable additive is selected from the group consisting of polyether alcohol, diol, poly(oxyethylene) alkyl ether, polyol copolymer, emulsifying wax, polyester glycol, ester wax, sorbitan ester, ethoxylated sorbitan ester, polyester, and combinations thereof. 14. The process of claim 11, wherein the at least one non-radiation curable additive is selected from the group consisting of polyethylene glycol, poly(ethylene-co-vinyl acetate), poly(vinyl alcohol), polyvinylpyrrolidone, behenyl acrylate, poly(ethylene terephthalate), poly(vinyl acetate), 1,6-hexanediol, an emulsifying wax comprising cetearyl alcohol and polysorbate 60, stearyl stearate, 1,8-octanediol, 1,2-tetradecanediol, 1,10-decanediol, polyoxyethylene (23) lauryl ether), polyoxyethylene (100) stearyl ether), polycaprolactone diol, polycaprolactone, poloxamer 188, behenyl behenate, stearyl behenate, cetyl stearate, stearyl stearate, polycaprolactone-block-polytetrahydrofuran-block-polycaprolactone, castor wax, sorbitan monostearate, sorbitan monopalmitate, cetyl alcohol, stearyl alcohol, cetostearyl alcohol, and combinations thereof. 15. The process of claim 11, wherein the at least one non-radiation curable additive is selected from the group consisting of polyethylene glycol, diol, emulsifying wax, alkyl alkenate, polyoxyethylene alkyl ether, polyol, polycaprolactone, polycaprolactone-block-polytetrahydrofuran-block-polycaprolactone, castor wax, and combinations thereof. 16. The process of claim 11, wherein the non-radiation curable additive functions as a detergent or emulsifying agent when in the presence of a cleaning fluid, and wherein the cleaning fluid comprises a cleaning fluid of a cleaning subsystem in the digital offset printing device. 17. The process of claim 11, wherein the cleaning fluid comprises water or a combination of water and surfactant. 18. The process of claim 11, wherein applying the ink composition comprises applying the ink composition using an anilox delivery system. 19. A process comprising:
combining at least one component selected from the group consisting of a curable monomer and a curable oligomer; an optional dispersant; an optional photoinitiator; and at least one non-radiation curable additive wherein the non-radiation curable additive is a detergent or an emulsifying agent, or wherein the non-radiation curable additive functions as a detergent or emulsifying agent when in the presence of a cleaning fluid, and wherein the non-radiation curable additive is a solid at a temperature of from about 20° C. to about 40° C.; optionally, heating; and optionally, filtering; to provide an ink composition. 20. The process of claim 19, wherein the at least one non-radiation curable additive is selected from the group consisting of polyether alcohol, diol, poly(oxyethylene) alkyl ether, polyol copolymer, emulsifying wax, polyester glycol, ester wax, sorbitan ester, ethoxylated sorbitan ester, polyester, and combinations thereof. | An ink composition for use in digital offset printing including at least one component selected from the group consisting of a curable monomer and a curable oligomer; an optional dispersant; an optional photoinitiator; and at least one non-radiation curable additive, wherein the non-radiation curable additive is a detergent or an emulsifying agent, or wherein the non-radiation curable additive functions as a detergent or emulsifying agent when in the presence of a cleaning fluid, and wherein the non-radiation curable additive is a solid at a temperature of from about 20° C. to about 40° C.1. An ink composition for use in digital offset printing, comprising:
at least one component selected from the group consisting of a curable monomer and a curable oligomer; an optional dispersant; an optional photoinitiator; and at least one non-radiation curable additive, wherein the non-radiation curable additive is a detergent or an emulsifying agent, or wherein the non-radiation curable additive functions as a detergent or emulsifying agent when in the presence of a cleaning fluid, and wherein the non-radiation curable additive is a solid at a temperature of from about 20° C. to about 40° C. 2. The ink composition of claim 1, wherein the at least one non-radiation curable additive is a solid at a temperature of from about 20° C. to about 30° C. 3. The ink composition of claim 1, wherein the at least one non-radiation curable additive is selected from the group consisting of polyether alcohol, diol, poly(oxyethylene) alkyl ether, polyol copolymer, emulsifying wax, polyester glycol, ester wax, sorbitan ester, ethoxylated sorbitan ester, polyester, and combinations thereof. 4. The ink composition of claim 1, wherein the at least one non-radiation curable additive is selected from the group consisting of polyethylene glycol, poly(ethylene-co-vinyl acetate), poly(vinyl alcohol), polyvinylpyrrolidone, behenyl acrylate, poly(ethylene terephthalate), poly(vinyl acetate), 1,6-hexanediol, an emulsifying wax comprising cetearyl alcohol and polysorbate 60, stearyl stearate, 1,8-octanediol, 1,2-tetradecanediol, 1,10-decanediol, polyoxyethylene (23) lauryl ether), polyoxyethylene (100) stearyl ether), polycaprolactone diol, polycaprolactone, poloxamer 188, behenyl behenate, stearyl behenate, cetyl stearate, stearyl stearate, polycaprolactone-block-polytetrahydrofuran-block-polycaprolactone, castor wax, sorbitan monostearate, sorbitan monopalmitate, cetyl alcohol, stearyl alcohol, cetostearyl alcohol, and combinations thereof. 5. The ink composition of claim 1, wherein the at least one non-radiation curable additive is selected from the group consisting of polyethylene glycol, diol, emulsifying wax, alkyl alkenate, polyoxyethylene alkyl ether, polyol, polycaprolactone, polycaprolactone-block-polytetrahydrofuran-block-polycaprolactone, castor wax, and combinations thereof. 6. The ink composition of claim 1, wherein the at least one non-radiation curable additive is present in the ink composition in an amount of from about 1 to about 6 percent by weight based upon the total weight of the ink composition. 7. The ink composition of claim 1, wherein the non-radiation curable additive functions as a detergent or emulsifying agent when in the presence of a cleaning fluid, and wherein the cleaning fluid comprises a cleaning fluid of a cleaning subsystem in a digital offset printing device. 8. The ink composition of claim 1, wherein the cleaning fluid comprises water or a combination of water and surfactant. 9. The ink composition of claim 1, wherein the at least one component selected from the group consisting of a curable monomer and a curable oligomer is a component selected from the group consisting of acrylated polyesters, acrylated polyethers, acrylated epoxies, urethane acrylates, and pentaerythritol tetraacrylate, and combinations thereof. 10. The ink composition of claim 1, wherein the at least one component selected from the group consisting of a curable monomer and a curable oligomer is a component selected from the group consisting of a tetrafunctional polyester acrylate oligomer, a propoxylated trimethylolpropane triacrylate monomer, and combinations thereof. 11. A process of digital offset printing with a digital offset printing device, the process comprising:
applying an ink composition onto a re-imageable imaging member surface at an ink take up temperature, the re-imageable imaging member having dampening fluid disposed thereon; forming an ink image; transferring the ink image from the re-imageable surface of the imaging member to a printable substrate at an ink transfer temperature; wherein the ink composition comprises: at least one component selected from the group consisting of a curable monomer and a curable oligomer; an optional dispersant; an optional photoinitiator; and at least one non-radiation curable additive, wherein the non-radiation curable additive is a detergent or an emulsifying agent, or wherein the non-radiation curable additive functions as a detergent or emulsifying agent when in the presence of a cleaning fluid, and wherein the non-radiation curable additive is a solid at a temperature of from about 20° C. to about 40° C. 12. The process of claim 11, wherein the at least one non-radiation curable additive is a solid at a temperature of from about 20° C. to about 30° C. 13. The process of claim 11, wherein the at least one non-radiation curable additive is selected from the group consisting of polyether alcohol, diol, poly(oxyethylene) alkyl ether, polyol copolymer, emulsifying wax, polyester glycol, ester wax, sorbitan ester, ethoxylated sorbitan ester, polyester, and combinations thereof. 14. The process of claim 11, wherein the at least one non-radiation curable additive is selected from the group consisting of polyethylene glycol, poly(ethylene-co-vinyl acetate), poly(vinyl alcohol), polyvinylpyrrolidone, behenyl acrylate, poly(ethylene terephthalate), poly(vinyl acetate), 1,6-hexanediol, an emulsifying wax comprising cetearyl alcohol and polysorbate 60, stearyl stearate, 1,8-octanediol, 1,2-tetradecanediol, 1,10-decanediol, polyoxyethylene (23) lauryl ether), polyoxyethylene (100) stearyl ether), polycaprolactone diol, polycaprolactone, poloxamer 188, behenyl behenate, stearyl behenate, cetyl stearate, stearyl stearate, polycaprolactone-block-polytetrahydrofuran-block-polycaprolactone, castor wax, sorbitan monostearate, sorbitan monopalmitate, cetyl alcohol, stearyl alcohol, cetostearyl alcohol, and combinations thereof. 15. The process of claim 11, wherein the at least one non-radiation curable additive is selected from the group consisting of polyethylene glycol, diol, emulsifying wax, alkyl alkenate, polyoxyethylene alkyl ether, polyol, polycaprolactone, polycaprolactone-block-polytetrahydrofuran-block-polycaprolactone, castor wax, and combinations thereof. 16. The process of claim 11, wherein the non-radiation curable additive functions as a detergent or emulsifying agent when in the presence of a cleaning fluid, and wherein the cleaning fluid comprises a cleaning fluid of a cleaning subsystem in the digital offset printing device. 17. The process of claim 11, wherein the cleaning fluid comprises water or a combination of water and surfactant. 18. The process of claim 11, wherein applying the ink composition comprises applying the ink composition using an anilox delivery system. 19. A process comprising:
combining at least one component selected from the group consisting of a curable monomer and a curable oligomer; an optional dispersant; an optional photoinitiator; and at least one non-radiation curable additive wherein the non-radiation curable additive is a detergent or an emulsifying agent, or wherein the non-radiation curable additive functions as a detergent or emulsifying agent when in the presence of a cleaning fluid, and wherein the non-radiation curable additive is a solid at a temperature of from about 20° C. to about 40° C.; optionally, heating; and optionally, filtering; to provide an ink composition. 20. The process of claim 19, wherein the at least one non-radiation curable additive is selected from the group consisting of polyether alcohol, diol, poly(oxyethylene) alkyl ether, polyol copolymer, emulsifying wax, polyester glycol, ester wax, sorbitan ester, ethoxylated sorbitan ester, polyester, and combinations thereof. | 2,800 |
12,265 | 12,265 | 16,119,855 | 2,836 | A transmitter is powered by a regulated battery voltage and is installable in one of a plurality of different housings, each housing is characterized by a different design and each can form part of an inground tool for performing an inground operation in which a drill string extends from a drill rig to the inground tool. An antenna driver drives an antenna based on the regulated voltage to emanate an electromagnetic signal for remote reception. A controller limits power consumption from the regulated voltage so as not to exceed a power consumption threshold, irrespective of installation of the transmitter in any one of the housings when the transmitter would otherwise exhibit a different power consumption for each housing design. A corresponding method is described. Features relating to power consumption threshold modification based on temperature as well as mechanical shock and vibration are described. | 1. A transmitter that is powered by a battery and the transmitter is receivable in a housing to form part of an inground tool for performing an inground operation in which a drill string extends from a drill rig to the inground tool, said transmitter comprising:
a regulator for generating a regulated voltage from said battery; an antenna driver powered from the regulated voltage for electrically driving an antenna to emanate an electromagnetic signal for remote reception based on power consumption from the regulator; an accelerometer for generating accelerometer readings responsive to mechanical shock and vibration of the inground tool during the inground operation; and a controller that monitors the power consumption and selectively limits the power consumption based on at least one power consumption threshold while continuing to drive the antenna to emanate the electromagnetic signal and that changes the power consumption threshold based on the accelerometer readings. 2. The transmitter of claim 1 wherein the controller is configured to lower the power consumption threshold based on the accelerometer readings being indicative of adverse mechanical shock and vibration conditions. 3. The transmitter of claim 2 wherein the battery is a general purpose battery and the adverse mechanical shock and vibration conditions at least affect performance of said battery. 4. The transmitter of claim 1 wherein the controller responds to a manually entered setting to specify the power consumption threshold for limiting the power consumption. 5. The transmitter of claim 1 wherein the controller automatically limits the power consumption. 6. The transmitter of claim 1 wherein said controller automatically measures the power consumption of the transmitter after stabilization following power-up. 7. The transmitter of claim 6 wherein said controller adjusts the power consumption of the transmitter in response to the measurement thereof so as not to exceed the power consumption threshold. 8. The transmitter of claim 1 forming part of an inground electronics package which further comprises a receiver that initiates transmission of said electromagnetic signal responsive to receiving an instruction. 9. The transmitter of claim 1 wherein said controller is configured for measuring the power consumption of the transmitter and initiating a calibration procedure responsive to detecting that the power consumption is less than the power consumption threshold. 10. The transmitter of claim 1 wherein said controller is configured for measuring the power consumption of the transmitter and decreasing the power consumption responsive to detecting that the power consumption is greater than the power consumption threshold. 11. The transmitter of claim 10 wherein said controller is configured for iteratively measuring the power consumption of the transmitter and adjusting the power consumption until the power consumption converges on the power consumption threshold. 12. The transmitter of claim 11 wherein said controller is configured to transmit a data packet that indicates a new power level after adjusting the power consumption. 13. The transmitter of claim 11 wherein said controller is configured for adjusting the power consumption by adjusting a duty cycle of the electromagnetic signal. 14. The transmitter of claim 11 wherein said controller is configured for adjusting the power consumption by adjusting a gain of the antenna driver. 15. The transmitter of claim 1 further comprising:
a temperature sensor for measuring a temperature of the transmitter and wherein said controller is further configured for adjusting the power consumption threshold based on the temperature. 16. The transmitter of claim 15 wherein said controller is configured for reducing the power consumption threshold responsive to detecting that the temperature is at or below a temperature threshold. 17. The transmitter of claim 16 wherein said temperature threshold is 0° C. 18. The transmitter of claim 16 wherein the temperature threshold is represented by a function that varies with temperature. | A transmitter is powered by a regulated battery voltage and is installable in one of a plurality of different housings, each housing is characterized by a different design and each can form part of an inground tool for performing an inground operation in which a drill string extends from a drill rig to the inground tool. An antenna driver drives an antenna based on the regulated voltage to emanate an electromagnetic signal for remote reception. A controller limits power consumption from the regulated voltage so as not to exceed a power consumption threshold, irrespective of installation of the transmitter in any one of the housings when the transmitter would otherwise exhibit a different power consumption for each housing design. A corresponding method is described. Features relating to power consumption threshold modification based on temperature as well as mechanical shock and vibration are described.1. A transmitter that is powered by a battery and the transmitter is receivable in a housing to form part of an inground tool for performing an inground operation in which a drill string extends from a drill rig to the inground tool, said transmitter comprising:
a regulator for generating a regulated voltage from said battery; an antenna driver powered from the regulated voltage for electrically driving an antenna to emanate an electromagnetic signal for remote reception based on power consumption from the regulator; an accelerometer for generating accelerometer readings responsive to mechanical shock and vibration of the inground tool during the inground operation; and a controller that monitors the power consumption and selectively limits the power consumption based on at least one power consumption threshold while continuing to drive the antenna to emanate the electromagnetic signal and that changes the power consumption threshold based on the accelerometer readings. 2. The transmitter of claim 1 wherein the controller is configured to lower the power consumption threshold based on the accelerometer readings being indicative of adverse mechanical shock and vibration conditions. 3. The transmitter of claim 2 wherein the battery is a general purpose battery and the adverse mechanical shock and vibration conditions at least affect performance of said battery. 4. The transmitter of claim 1 wherein the controller responds to a manually entered setting to specify the power consumption threshold for limiting the power consumption. 5. The transmitter of claim 1 wherein the controller automatically limits the power consumption. 6. The transmitter of claim 1 wherein said controller automatically measures the power consumption of the transmitter after stabilization following power-up. 7. The transmitter of claim 6 wherein said controller adjusts the power consumption of the transmitter in response to the measurement thereof so as not to exceed the power consumption threshold. 8. The transmitter of claim 1 forming part of an inground electronics package which further comprises a receiver that initiates transmission of said electromagnetic signal responsive to receiving an instruction. 9. The transmitter of claim 1 wherein said controller is configured for measuring the power consumption of the transmitter and initiating a calibration procedure responsive to detecting that the power consumption is less than the power consumption threshold. 10. The transmitter of claim 1 wherein said controller is configured for measuring the power consumption of the transmitter and decreasing the power consumption responsive to detecting that the power consumption is greater than the power consumption threshold. 11. The transmitter of claim 10 wherein said controller is configured for iteratively measuring the power consumption of the transmitter and adjusting the power consumption until the power consumption converges on the power consumption threshold. 12. The transmitter of claim 11 wherein said controller is configured to transmit a data packet that indicates a new power level after adjusting the power consumption. 13. The transmitter of claim 11 wherein said controller is configured for adjusting the power consumption by adjusting a duty cycle of the electromagnetic signal. 14. The transmitter of claim 11 wherein said controller is configured for adjusting the power consumption by adjusting a gain of the antenna driver. 15. The transmitter of claim 1 further comprising:
a temperature sensor for measuring a temperature of the transmitter and wherein said controller is further configured for adjusting the power consumption threshold based on the temperature. 16. The transmitter of claim 15 wherein said controller is configured for reducing the power consumption threshold responsive to detecting that the temperature is at or below a temperature threshold. 17. The transmitter of claim 16 wherein said temperature threshold is 0° C. 18. The transmitter of claim 16 wherein the temperature threshold is represented by a function that varies with temperature. | 2,800 |
12,266 | 12,266 | 16,439,200 | 2,847 | A superconducting power cable system includes a superconducting power cable in a first temperature environment separated from a second temperature environment by a thermal barrier. The first temperature environment is an interior of a cryostat and is at a lower temperature than the second temperature environment located outside of the cryostat. At least one superconducting feeder cable has a first end electrically coupled to the superconducting power cable in the first temperature environment, and a second end electrically coupled to a normal conducting current lead in the second temperature environment. Each superconducting feeder cable is a flexible superconducting cable or wire formed of multiple superconducting tapes that are wound in a helical fashion and in multiple layers around a round former. | 1. A superconducting power cable system comprising:
a superconducting power cable in a first temperature environment; a thermal barrier separating the first temperature environment from a second temperature environment, the second temperature environment being at a higher temperature than the first temperature environment, the second temperature being low enough to sustain superconductivity; at least one superconducting feeder cable having a first end electrically coupled to the superconducting power cable in the first temperature environment, each superconducting feeder cable having a second end electrically coupled to a normal conducting current lead in the second temperature environment, to receive current injected into the superconducting feeder cable in the second temperature environment such that at least a majority of the current enters the first temperature environment in the superconducting state. 2. A system as recited in claim 1, wherein the first temperature environment comprises an interior of a cryostat, and wherein the thermal barrier comprises a wall of the cryostat. 3. A system as recited in claim 1, wherein the second temperature environment comprises an interior of a cryostat, and wherein a thermal barrier comprises a wall of the cryostat that separates the second temperature environment from a third temperature environment. 4. A system as recited in claim 1, wherein each superconducting feeder cable extends through the thermal barrier. 5. A system as recited in claim 1, wherein each superconducting feeder cable comprises a flexible superconducting cable or wire formed of multiple superconducting tapes that are wound in a helical fashion and in multiple layers around a round former. 6. A system as recited in claim 1, further comprising a feeder cable terminal assembly having a terminal electrically connected to the second end of each superconducting feeder cable and to the normal conducting current lead, to electrically couple the second end of each feeder cable to the normal conducting current lead. 7. A system as recited in claim 6, further comprising a heat exchanger or a cyrocooler coupled to the feeder cable terminal. 8. A system as recited in claim 6, wherein the feeder cable terminal comprises a tubular structure extending through the thermal barrier and having an open end opening into the first temperature environment, the open end for receiving a cooling fluid from the first temperature environment. 9. A system as recited in claim 6, wherein the feeder cable terminal comprises a tubular structure extending through the thermal barrier and having an open end opening into the first temperature environment, and a closed end in the second temperature environment, the tubular structure having a passage extending from the open end toward the closed end, wherein the at least one superconducting feeder cable extends through the open end of the tubular structure and at least partially into the passage of the tubular structure. 10. A system as recited in claim 9, wherein the tubular structure is electrically conductive and is electrically connected to the second end of the feeder cable and to the normal conducting current lead, to electrically couple the second end of the feeder cable to the normal conducting current lead. 11. A system as recited in claim 9, wherein the tubular structure is electrically insulating and is structurally connected to the second end of the feeder cable terminal, which is electrically connected to the normal conducting current lead. 12. A system as recited in claim 10, wherein the feeder cable terminal further comprises a ceramic thermal insulator disposed between the tubular structure and the thermal barrier. 13. A system as recited in claim 1, further comprising a connector terminal in the first temperature environment and electrically connected to the first end of each superconducting feeder cable and a terminal end of the superconducting power cable, to electrically couple each superconducting feeder cable to the superconducting power cable. 14. A system as recited in claim 1, further comprising a plurality of feeder cable terminals, each feeder cable terminal extending through the thermal barrier and being electrically connected to the second end of a respective one of the superconducting feeder cables and to the normal conducting current lead, to electrically couple the second end of the respective one of the feeder cables to the normal conducting current lead. 15. A system as recited in claim 1, wherein each feeder cable has at least one of a bend, loop or spiral, to provide slack between the first end and the second end of the feeder cable. 16. A system as recited in claim 1, further comprising at least one normal conducting electrical conductor coupled in parallel with the superconducting power cable and located outside of the first temperature environment. 17. A system as recited in claim 1, wherein the first temperature environment comprises an interior of a cryostat, the system further comprising at least one normal conducting electrical conductor coupled in parallel with the superconducting power cable and located outside of the cryostat. 18. A system as recited in claim 1, wherein:
the first temperature environment comprises an interior of a cryostat; the superconducting power cable has a first terminal end and a second terminal end within the cryostat; the at least one feeder cable comprises a first superconducting feeder cable electrically coupled to the first terminal end of the superconducting power cable, and a second superconducting feeder cable electrically coupled to the second terminal end of the superconducting power transmission cable, a power source or a power load; the system further comprising:
a first feeder cable terminal assembly extending through a wall of the cryostat and being electrically connected to the first superconducting feeder cable and to a first normal conducting current lead; and
a second feeder cable terminal assembly extending through a further wall of the cryostat and being electrically connected to the second superconducting feeder cable and to a second normal conducting current lead. 19. A system as recited in claim 18, wherein at least one of the first and second normal conducting lead comprises a variable load current lead. 20. A superconducting power system comprising:
a superconducting power cable in a closed first temperature environment that is cooled with a cryogenic media to a first cryogenic temperature sufficiently low to sustain superconductivity in the superconducting power cable; a thermal barrier separating the closed first temperature environment from a at least one of a first volume adjacent a first end of the superconducting power cable and a second volume adjacent a second end of the superconducting power cable, each of the first and second volumes being at a second cryogenic temperature that is higher than the first cryogenic temperature, wherein the second cryogenic temperature is sufficiently low to sustain superconductivity in the first and second feeder cables; and wherein: at least one first superconducting feeder cable has a cold terminal end coupled to the first end of the superconducting power cable in the closed first temperature environment, the at least one first superconducting feeder cable extending from the first end of the superconducting power cable, through the thermal barrier, to the first volume, the at least one first superconducting feeder cable having a warm terminal end coupled to a normal conducting current lead in the second volume; or at least one second superconducting feeder cable has a cold terminal end coupled to the second end of the superconducting power cable in the closed first temperature environment, the at least one second superconducting feeder cable extending from the second end of the superconducting power cable, through the thermal barrier, to the second volume, the at least one second superconducting feeder cable having a warm terminal end coupled to a further normal conducting current lead in the second volume. 21. A system as recited in claim 20, wherein each of the first and second superconducting feeder cables comprises a flexible superconducting cable or wire formed of multiple superconducting tapes that are wound in a helical fashion and in multiple layers around a round former. 22. A system as recited in claim 20, wherein the warm terminal end of each of the first and second feeder cables is an integral part of the thermal barrier. 23. A system as recited in claim 20, wherein the warm terminal end of each of the first and second feeder cables extends into the first or the second volume, beyond the thermal barrier. 24. A system as recited in claim 20, wherein the closed first temperature environment is at a higher pressure than the first and second volumes. 25. A system as recited in claim 20, wherein the closed first temperature environment is cooled with a first cryogenic medium, and the first and second volumes are cooled with a second cryogenic medium, the second cryogenic medium having a higher cooling power than the first cryogenic medium. 26. A system as recited in claim 20, wherein at least one of the superconducting power cable, or the first or second feeder cables contain a normal-conducting material, and a relatively high level of current sharing between tapes, sufficient to act as fault current limiting device in case of a fault. 27. A system as recited in claim 20, wherein the warm terminal end of the first and second superconducting feeder cables or wires are cooled with a first stage of a two-stage cryocooler, while the closed first temperature environment is cooled with a colder second stage of the same cryocooler through conduction or contact with cryogenic fluid or gas. 28. A system as recited in claim 20, wherein the thermal conductivity along the length of the feeder cables is minimized. | A superconducting power cable system includes a superconducting power cable in a first temperature environment separated from a second temperature environment by a thermal barrier. The first temperature environment is an interior of a cryostat and is at a lower temperature than the second temperature environment located outside of the cryostat. At least one superconducting feeder cable has a first end electrically coupled to the superconducting power cable in the first temperature environment, and a second end electrically coupled to a normal conducting current lead in the second temperature environment. Each superconducting feeder cable is a flexible superconducting cable or wire formed of multiple superconducting tapes that are wound in a helical fashion and in multiple layers around a round former.1. A superconducting power cable system comprising:
a superconducting power cable in a first temperature environment; a thermal barrier separating the first temperature environment from a second temperature environment, the second temperature environment being at a higher temperature than the first temperature environment, the second temperature being low enough to sustain superconductivity; at least one superconducting feeder cable having a first end electrically coupled to the superconducting power cable in the first temperature environment, each superconducting feeder cable having a second end electrically coupled to a normal conducting current lead in the second temperature environment, to receive current injected into the superconducting feeder cable in the second temperature environment such that at least a majority of the current enters the first temperature environment in the superconducting state. 2. A system as recited in claim 1, wherein the first temperature environment comprises an interior of a cryostat, and wherein the thermal barrier comprises a wall of the cryostat. 3. A system as recited in claim 1, wherein the second temperature environment comprises an interior of a cryostat, and wherein a thermal barrier comprises a wall of the cryostat that separates the second temperature environment from a third temperature environment. 4. A system as recited in claim 1, wherein each superconducting feeder cable extends through the thermal barrier. 5. A system as recited in claim 1, wherein each superconducting feeder cable comprises a flexible superconducting cable or wire formed of multiple superconducting tapes that are wound in a helical fashion and in multiple layers around a round former. 6. A system as recited in claim 1, further comprising a feeder cable terminal assembly having a terminal electrically connected to the second end of each superconducting feeder cable and to the normal conducting current lead, to electrically couple the second end of each feeder cable to the normal conducting current lead. 7. A system as recited in claim 6, further comprising a heat exchanger or a cyrocooler coupled to the feeder cable terminal. 8. A system as recited in claim 6, wherein the feeder cable terminal comprises a tubular structure extending through the thermal barrier and having an open end opening into the first temperature environment, the open end for receiving a cooling fluid from the first temperature environment. 9. A system as recited in claim 6, wherein the feeder cable terminal comprises a tubular structure extending through the thermal barrier and having an open end opening into the first temperature environment, and a closed end in the second temperature environment, the tubular structure having a passage extending from the open end toward the closed end, wherein the at least one superconducting feeder cable extends through the open end of the tubular structure and at least partially into the passage of the tubular structure. 10. A system as recited in claim 9, wherein the tubular structure is electrically conductive and is electrically connected to the second end of the feeder cable and to the normal conducting current lead, to electrically couple the second end of the feeder cable to the normal conducting current lead. 11. A system as recited in claim 9, wherein the tubular structure is electrically insulating and is structurally connected to the second end of the feeder cable terminal, which is electrically connected to the normal conducting current lead. 12. A system as recited in claim 10, wherein the feeder cable terminal further comprises a ceramic thermal insulator disposed between the tubular structure and the thermal barrier. 13. A system as recited in claim 1, further comprising a connector terminal in the first temperature environment and electrically connected to the first end of each superconducting feeder cable and a terminal end of the superconducting power cable, to electrically couple each superconducting feeder cable to the superconducting power cable. 14. A system as recited in claim 1, further comprising a plurality of feeder cable terminals, each feeder cable terminal extending through the thermal barrier and being electrically connected to the second end of a respective one of the superconducting feeder cables and to the normal conducting current lead, to electrically couple the second end of the respective one of the feeder cables to the normal conducting current lead. 15. A system as recited in claim 1, wherein each feeder cable has at least one of a bend, loop or spiral, to provide slack between the first end and the second end of the feeder cable. 16. A system as recited in claim 1, further comprising at least one normal conducting electrical conductor coupled in parallel with the superconducting power cable and located outside of the first temperature environment. 17. A system as recited in claim 1, wherein the first temperature environment comprises an interior of a cryostat, the system further comprising at least one normal conducting electrical conductor coupled in parallel with the superconducting power cable and located outside of the cryostat. 18. A system as recited in claim 1, wherein:
the first temperature environment comprises an interior of a cryostat; the superconducting power cable has a first terminal end and a second terminal end within the cryostat; the at least one feeder cable comprises a first superconducting feeder cable electrically coupled to the first terminal end of the superconducting power cable, and a second superconducting feeder cable electrically coupled to the second terminal end of the superconducting power transmission cable, a power source or a power load; the system further comprising:
a first feeder cable terminal assembly extending through a wall of the cryostat and being electrically connected to the first superconducting feeder cable and to a first normal conducting current lead; and
a second feeder cable terminal assembly extending through a further wall of the cryostat and being electrically connected to the second superconducting feeder cable and to a second normal conducting current lead. 19. A system as recited in claim 18, wherein at least one of the first and second normal conducting lead comprises a variable load current lead. 20. A superconducting power system comprising:
a superconducting power cable in a closed first temperature environment that is cooled with a cryogenic media to a first cryogenic temperature sufficiently low to sustain superconductivity in the superconducting power cable; a thermal barrier separating the closed first temperature environment from a at least one of a first volume adjacent a first end of the superconducting power cable and a second volume adjacent a second end of the superconducting power cable, each of the first and second volumes being at a second cryogenic temperature that is higher than the first cryogenic temperature, wherein the second cryogenic temperature is sufficiently low to sustain superconductivity in the first and second feeder cables; and wherein: at least one first superconducting feeder cable has a cold terminal end coupled to the first end of the superconducting power cable in the closed first temperature environment, the at least one first superconducting feeder cable extending from the first end of the superconducting power cable, through the thermal barrier, to the first volume, the at least one first superconducting feeder cable having a warm terminal end coupled to a normal conducting current lead in the second volume; or at least one second superconducting feeder cable has a cold terminal end coupled to the second end of the superconducting power cable in the closed first temperature environment, the at least one second superconducting feeder cable extending from the second end of the superconducting power cable, through the thermal barrier, to the second volume, the at least one second superconducting feeder cable having a warm terminal end coupled to a further normal conducting current lead in the second volume. 21. A system as recited in claim 20, wherein each of the first and second superconducting feeder cables comprises a flexible superconducting cable or wire formed of multiple superconducting tapes that are wound in a helical fashion and in multiple layers around a round former. 22. A system as recited in claim 20, wherein the warm terminal end of each of the first and second feeder cables is an integral part of the thermal barrier. 23. A system as recited in claim 20, wherein the warm terminal end of each of the first and second feeder cables extends into the first or the second volume, beyond the thermal barrier. 24. A system as recited in claim 20, wherein the closed first temperature environment is at a higher pressure than the first and second volumes. 25. A system as recited in claim 20, wherein the closed first temperature environment is cooled with a first cryogenic medium, and the first and second volumes are cooled with a second cryogenic medium, the second cryogenic medium having a higher cooling power than the first cryogenic medium. 26. A system as recited in claim 20, wherein at least one of the superconducting power cable, or the first or second feeder cables contain a normal-conducting material, and a relatively high level of current sharing between tapes, sufficient to act as fault current limiting device in case of a fault. 27. A system as recited in claim 20, wherein the warm terminal end of the first and second superconducting feeder cables or wires are cooled with a first stage of a two-stage cryocooler, while the closed first temperature environment is cooled with a colder second stage of the same cryocooler through conduction or contact with cryogenic fluid or gas. 28. A system as recited in claim 20, wherein the thermal conductivity along the length of the feeder cables is minimized. | 2,800 |
12,267 | 12,267 | 15,420,853 | 2,835 | A system and apparatus for power conversion without a connection to ground. In one embodiment, the apparatus comprises an inverter having an enclosure formed from an insulating material, wherein the inverter receives a DC input and generates, from the DC input and without any ground connection, a first AC line voltage carrying output and a second AC line voltage carrying output. | 1. An apparatus for power conversion without a connection to ground, comprising:
an inverter having an enclosure formed from an insulating material, wherein the inverter receives a DC input and generates, from the DC input and without any ground connection, a first AC line voltage carrying output and a second AC line voltage carrying output. 2. The apparatus of claim 1, wherein the inverter comprises a DC port that receives the DC input and an AC port that couples the first and the second AC line voltage carrying outputs to an AC line. 3. The apparatus of claim 2, wherein the inverter comprises (i) a pair of DC bus bars that electrically couple the DC port to at least one printed circuit board (PCB) of the inverter, and (ii) a pair of AC bus bars that electrically couple the AC port to the at least one PCB. 4. The apparatus of claim 3, wherein the pair of DC bus bars have press-pin tips that press-fit to the at least one PCB to electrically couple the DC port to the at least one PCB, and wherein the pair of AC bus bars have press-pin tips that press-fit to the at least one PCB to electrically couple the AC port to the at least one PCB. 5. The apparatus of claim 3, wherein the pair of DC bus bars and the pair of AC bus bars terminate in through-hole solder pins that are through-hole soldered to the one or more PCBs to electrically couple the pair of DC bus bars and the pair of AC bus bars to the one or more PCBs. 6. The apparatus of claim 3, wherein the pair of DC bus bars and the pair of AC bus bars are insert-molded to a bulkhead connector interface. 7. The apparatus of claim 2, wherein both the DC and the AC ports are two-terminal ports, and wherein the DC and the AC ports comprise at least one keying feature to prevent a DC plug, adapted for being plugged into the DC port, from being plugged into the AC port and to prevent an AC plug, adapted for being plugged into the AC port, from being plugged into the DC port. 8. The apparatus of claim 7, wherein the at least one keying feature further prevents the DC plug from being plugged into the DC port with the wrong polarity. 9. The apparatus of claim 7, wherein the at least one keying feature additionally mechanically locks the DC plug to the DC port and the AC plug to the AC port. 10. A system for power conversion without a connection to ground, comprising:
a plurality of inverters, wherein each inverters of the plurality of inverters (i) has an enclosure formed from an insulating material, and (ii) receives a DC input and generates, from the DC input and without any ground connection, a first AC line voltage carrying output and a second AC line voltage carrying output; and an AC trunk cable assembly comprising an AC trunk cable and a plurality of AC trunk splice connectors spaced along the AC trunk cable, wherein (a) the AC trunk cable comprises first and second conductors extending through the AC trunk cable, and (b) each AC trunk splice connector of the plurality of AC trunk splice connectors is coupled the first and second conductors and to a different inverter of the plurality of inverters such that the first AC line voltage carrying output is electrically coupled to the first conductor and the second AC line voltage carrying output is electrically coupled to the second conductor. 11. The system of claim 10, wherein the first and the second conductors are each continuous within the AC trunk cable. 12. The system of claim 11, wherein each AC trunk splice connector of the plurality of AC trunk splice connectors comprises first and second AC pins electrically coupled to the first and the second AC line voltage carrying outputs of the corresponding inverter via an AC port of the corresponding inverter, and wherein the first AC pin is electrically coupled to the first conductor by a Y-splice, and wherein the second AC pin is electrically coupled to the second conductor by a Y-splice. 13. The system of claim 12, wherein each AC trunk splice connector of the plurality of AC trunk splice connectors is overmolded to the AC trunk cable. 14. The system of claim 10, wherein each inverter of the plurality of inverters comprises a DC port that receives the DC input and an AC port that couples the first and the second AC line voltage carrying outputs to an AC line. 15. The system of claim 14, wherein each inverter of the plurality of inverters comprises (i) a pair of DC bus bars that electrically couple the DC port to at least one printed circuit board (PCB) of the inverter, and (ii) a pair of AC bus bars that electrically couple the AC port to the at least one PCB. 16. The system of claim 15, wherein the pair of DC bus bars have press-pin tips that press-fit to the at least one PCB to electrically couple the DC port to the at least one PCB, and wherein the pair of AC bus bars have press-pin tips that press-fit to the at least one PCB to electrically couple the AC port to the at least one PCB. 17. The system of claim 15, wherein the pair of DC bus bars and the pair of AC bus bars terminate in through-hole solder pins that are through-hole soldered to the one or more PCBs to electrically couple the pair of DC bus bars and the pair of AC bus bars to the one or more PCBs. 18. The system of claim 15, wherein the pair of DC bus bars and the pair of AC bus bars are insert-molded to a bulkhead connector interface. 19. The system of claim 14, wherein both the DC and the AC ports are two-terminal ports, and wherein the DC and the AC ports comprise at least one keying feature to prevent a DC plug, adapted for being plugged into the DC port, from being plugged into the AC port and to prevent an AC plug, adapted for being plugged into the AC port, from being plugged into the DC port. 20. The system of claim 19, wherein the at least one keying feature further prevents the DC plug from being plugged into the DC port with the wrong polarity. | A system and apparatus for power conversion without a connection to ground. In one embodiment, the apparatus comprises an inverter having an enclosure formed from an insulating material, wherein the inverter receives a DC input and generates, from the DC input and without any ground connection, a first AC line voltage carrying output and a second AC line voltage carrying output.1. An apparatus for power conversion without a connection to ground, comprising:
an inverter having an enclosure formed from an insulating material, wherein the inverter receives a DC input and generates, from the DC input and without any ground connection, a first AC line voltage carrying output and a second AC line voltage carrying output. 2. The apparatus of claim 1, wherein the inverter comprises a DC port that receives the DC input and an AC port that couples the first and the second AC line voltage carrying outputs to an AC line. 3. The apparatus of claim 2, wherein the inverter comprises (i) a pair of DC bus bars that electrically couple the DC port to at least one printed circuit board (PCB) of the inverter, and (ii) a pair of AC bus bars that electrically couple the AC port to the at least one PCB. 4. The apparatus of claim 3, wherein the pair of DC bus bars have press-pin tips that press-fit to the at least one PCB to electrically couple the DC port to the at least one PCB, and wherein the pair of AC bus bars have press-pin tips that press-fit to the at least one PCB to electrically couple the AC port to the at least one PCB. 5. The apparatus of claim 3, wherein the pair of DC bus bars and the pair of AC bus bars terminate in through-hole solder pins that are through-hole soldered to the one or more PCBs to electrically couple the pair of DC bus bars and the pair of AC bus bars to the one or more PCBs. 6. The apparatus of claim 3, wherein the pair of DC bus bars and the pair of AC bus bars are insert-molded to a bulkhead connector interface. 7. The apparatus of claim 2, wherein both the DC and the AC ports are two-terminal ports, and wherein the DC and the AC ports comprise at least one keying feature to prevent a DC plug, adapted for being plugged into the DC port, from being plugged into the AC port and to prevent an AC plug, adapted for being plugged into the AC port, from being plugged into the DC port. 8. The apparatus of claim 7, wherein the at least one keying feature further prevents the DC plug from being plugged into the DC port with the wrong polarity. 9. The apparatus of claim 7, wherein the at least one keying feature additionally mechanically locks the DC plug to the DC port and the AC plug to the AC port. 10. A system for power conversion without a connection to ground, comprising:
a plurality of inverters, wherein each inverters of the plurality of inverters (i) has an enclosure formed from an insulating material, and (ii) receives a DC input and generates, from the DC input and without any ground connection, a first AC line voltage carrying output and a second AC line voltage carrying output; and an AC trunk cable assembly comprising an AC trunk cable and a plurality of AC trunk splice connectors spaced along the AC trunk cable, wherein (a) the AC trunk cable comprises first and second conductors extending through the AC trunk cable, and (b) each AC trunk splice connector of the plurality of AC trunk splice connectors is coupled the first and second conductors and to a different inverter of the plurality of inverters such that the first AC line voltage carrying output is electrically coupled to the first conductor and the second AC line voltage carrying output is electrically coupled to the second conductor. 11. The system of claim 10, wherein the first and the second conductors are each continuous within the AC trunk cable. 12. The system of claim 11, wherein each AC trunk splice connector of the plurality of AC trunk splice connectors comprises first and second AC pins electrically coupled to the first and the second AC line voltage carrying outputs of the corresponding inverter via an AC port of the corresponding inverter, and wherein the first AC pin is electrically coupled to the first conductor by a Y-splice, and wherein the second AC pin is electrically coupled to the second conductor by a Y-splice. 13. The system of claim 12, wherein each AC trunk splice connector of the plurality of AC trunk splice connectors is overmolded to the AC trunk cable. 14. The system of claim 10, wherein each inverter of the plurality of inverters comprises a DC port that receives the DC input and an AC port that couples the first and the second AC line voltage carrying outputs to an AC line. 15. The system of claim 14, wherein each inverter of the plurality of inverters comprises (i) a pair of DC bus bars that electrically couple the DC port to at least one printed circuit board (PCB) of the inverter, and (ii) a pair of AC bus bars that electrically couple the AC port to the at least one PCB. 16. The system of claim 15, wherein the pair of DC bus bars have press-pin tips that press-fit to the at least one PCB to electrically couple the DC port to the at least one PCB, and wherein the pair of AC bus bars have press-pin tips that press-fit to the at least one PCB to electrically couple the AC port to the at least one PCB. 17. The system of claim 15, wherein the pair of DC bus bars and the pair of AC bus bars terminate in through-hole solder pins that are through-hole soldered to the one or more PCBs to electrically couple the pair of DC bus bars and the pair of AC bus bars to the one or more PCBs. 18. The system of claim 15, wherein the pair of DC bus bars and the pair of AC bus bars are insert-molded to a bulkhead connector interface. 19. The system of claim 14, wherein both the DC and the AC ports are two-terminal ports, and wherein the DC and the AC ports comprise at least one keying feature to prevent a DC plug, adapted for being plugged into the DC port, from being plugged into the AC port and to prevent an AC plug, adapted for being plugged into the AC port, from being plugged into the DC port. 20. The system of claim 19, wherein the at least one keying feature further prevents the DC plug from being plugged into the DC port with the wrong polarity. | 2,800 |
12,268 | 12,268 | 16,126,960 | 2,871 | Optical film stacks are described. More particularly, optical film stacks including a half-wave retardation layer are described. Achromatic half-wave retardation layers, including achromatic half-wave layers formed from a quarter-wave and a three-quarters-wave retardation layer, are described. Film stacks including reflective polarizers tuned to reduce wavelength dispersion of the half-wave retardation layer are also described. | 1. An optical film stack, comprising:
a tuned reflective polarizer having a top surface, a bottom surface, a transmission axis, and a reflection axis; a half-wave retardation layer having a top surface, a bottom surface disposed on the top surface of the reflective polarizer, and a slow axis oriented substantially 45° with respect to the transmission axis of the reflective polarizer; and an absorbing polarizer having a bottom surface disposed on the top surface of the achromatic half-wave retardation layer and a transmission axis oriented substantially 90° with respect to the transmission axis of the reflective polarizer; wherein the tuned reflective polarizer is tuned to reduce wavelength dispersion of the half-wave retardation layer. | Optical film stacks are described. More particularly, optical film stacks including a half-wave retardation layer are described. Achromatic half-wave retardation layers, including achromatic half-wave layers formed from a quarter-wave and a three-quarters-wave retardation layer, are described. Film stacks including reflective polarizers tuned to reduce wavelength dispersion of the half-wave retardation layer are also described.1. An optical film stack, comprising:
a tuned reflective polarizer having a top surface, a bottom surface, a transmission axis, and a reflection axis; a half-wave retardation layer having a top surface, a bottom surface disposed on the top surface of the reflective polarizer, and a slow axis oriented substantially 45° with respect to the transmission axis of the reflective polarizer; and an absorbing polarizer having a bottom surface disposed on the top surface of the achromatic half-wave retardation layer and a transmission axis oriented substantially 90° with respect to the transmission axis of the reflective polarizer; wherein the tuned reflective polarizer is tuned to reduce wavelength dispersion of the half-wave retardation layer. | 2,800 |
12,269 | 12,269 | 16,215,148 | 2,829 | A leadframe assembly includes a leadframe having a die attach pad and a first plurality of leads. A first generally sine wave-shaped wire having a first end and a second end has a first end of thereof attached to a first one of the first plurality of leads and the second end thereof attached to a second one of the first plurality of leads. A method of making a leadframe assembly includes forming an inductor on a leadframe by bending a first wire into a generally sine wave-shaped configuration and attaching the first wire to a first set of leads of the leadframe. | 1. An integrated circuit (IC) package comprising:
a first plurality of leads and a second plurality of leads, a first die attach pad and a second die attach pad; a first bond wire attached to two leads of the first plurality of leads; and a second bond wire attached to two leads of the second plurality of leads, wherein a plane of the first bond wire is parallel to a plane of the second bond wire, and portions of the first bond wire and the second bond wire overlap with each other. 2. The IC package of claim 1 further comprising a first IC die attached to the first die attach pad and a second IC die attached to the second die attach pad, each of the first IC die and the second IC die electrically connected to at least one of the plurality of first leads or the plurality of second leads. 3. The IC package of claim 1, wherein the first bond wire does not contact with the second bond wire. 4. The IC package of claim 1, wherein the first bond wire and the second bond wire are generally sine wave shaped. 5. The IC package of claim 1, wherein the first bond wire and the second bond wire are generally M shaped. 6. The IC package of claim 1, wherein the first bond wire includes two foot portions attached to the two leads of the first plurality of leads, and the second bond wire includes two foot portions attached to the two leads of the second plurality of leads. 7. The IC package of claim 6, wherein the two foot portions of each of the first bond wire and the second bond wire are wedge bonded to the two leads of the first plurality of leads and the two leads of the second plurality of leads respectively. 8. The IC package of claim 1, wherein each of the first bond wire and the second bond wire includes copper. 9. The IC package of claim 1, wherein the second plurality of leads is positioned laterally opposite the first plurality of leads. 10. The IC package of claim 1, wherein the first bond wire is wire bonded to the two leads of the first plurality of leads and the second bond wire is wire bonded to the two leads of the second plurality of leads. 11. An integrated circuit (IC) package comprising:
a lead frame including a first plurality of leads and a second plurality of leads, a first die attach pad and a second die attach pad; a first bond wire attached to two leads of the first plurality of leads; a second bond wire attached to two leads of the second plurality of leads, portions of the first bond wire and the second bond wire parallel to and overlapping with each other; a first IC die attached to the first die attach pad and electrically connected to at least one of the plurality of first leads or at least one of the plurality of second leads; and mold compound covering portions of the lead frame, the first bond wire, the second bond wire, and the first IC die. 12. The IC package of claim 11 further comprising a second IC die attached to the second die attach pad and electrically connected to at least one of the plurality of first leads or at least one of the plurality of second leads, and wherein the mold compound covers portions of the second IC die. 13. The IC package of claim 11, wherein the first bond wire and the second bond wire together form an inductor. 14. The IC package of claim 11, wherein the first bond wire includes two foot portions attached to the two leads of the first plurality of leads, and the second bond wire includes two foot portions attached to the two leads of the second plurality of leads. 15. The IC package of claim 14, wherein a distance between the two foot portions of the first bond wire or the second bond wire is 750 micrometers. 16. The IC package of claim 12, wherein the first IC die or the second IC die is electrically connected to the first bond wire and the second bond wire. 17. The IC package of claim 11, wherein planes of the first bond wire and the second bond wire are parallel to a plane of the first die attach pad and a plane of the second die attach pad. 18. The IC package of claim 11, wherein portions of the first plurality of leads and the second plurality of leads extend through the mold compound. | A leadframe assembly includes a leadframe having a die attach pad and a first plurality of leads. A first generally sine wave-shaped wire having a first end and a second end has a first end of thereof attached to a first one of the first plurality of leads and the second end thereof attached to a second one of the first plurality of leads. A method of making a leadframe assembly includes forming an inductor on a leadframe by bending a first wire into a generally sine wave-shaped configuration and attaching the first wire to a first set of leads of the leadframe.1. An integrated circuit (IC) package comprising:
a first plurality of leads and a second plurality of leads, a first die attach pad and a second die attach pad; a first bond wire attached to two leads of the first plurality of leads; and a second bond wire attached to two leads of the second plurality of leads, wherein a plane of the first bond wire is parallel to a plane of the second bond wire, and portions of the first bond wire and the second bond wire overlap with each other. 2. The IC package of claim 1 further comprising a first IC die attached to the first die attach pad and a second IC die attached to the second die attach pad, each of the first IC die and the second IC die electrically connected to at least one of the plurality of first leads or the plurality of second leads. 3. The IC package of claim 1, wherein the first bond wire does not contact with the second bond wire. 4. The IC package of claim 1, wherein the first bond wire and the second bond wire are generally sine wave shaped. 5. The IC package of claim 1, wherein the first bond wire and the second bond wire are generally M shaped. 6. The IC package of claim 1, wherein the first bond wire includes two foot portions attached to the two leads of the first plurality of leads, and the second bond wire includes two foot portions attached to the two leads of the second plurality of leads. 7. The IC package of claim 6, wherein the two foot portions of each of the first bond wire and the second bond wire are wedge bonded to the two leads of the first plurality of leads and the two leads of the second plurality of leads respectively. 8. The IC package of claim 1, wherein each of the first bond wire and the second bond wire includes copper. 9. The IC package of claim 1, wherein the second plurality of leads is positioned laterally opposite the first plurality of leads. 10. The IC package of claim 1, wherein the first bond wire is wire bonded to the two leads of the first plurality of leads and the second bond wire is wire bonded to the two leads of the second plurality of leads. 11. An integrated circuit (IC) package comprising:
a lead frame including a first plurality of leads and a second plurality of leads, a first die attach pad and a second die attach pad; a first bond wire attached to two leads of the first plurality of leads; a second bond wire attached to two leads of the second plurality of leads, portions of the first bond wire and the second bond wire parallel to and overlapping with each other; a first IC die attached to the first die attach pad and electrically connected to at least one of the plurality of first leads or at least one of the plurality of second leads; and mold compound covering portions of the lead frame, the first bond wire, the second bond wire, and the first IC die. 12. The IC package of claim 11 further comprising a second IC die attached to the second die attach pad and electrically connected to at least one of the plurality of first leads or at least one of the plurality of second leads, and wherein the mold compound covers portions of the second IC die. 13. The IC package of claim 11, wherein the first bond wire and the second bond wire together form an inductor. 14. The IC package of claim 11, wherein the first bond wire includes two foot portions attached to the two leads of the first plurality of leads, and the second bond wire includes two foot portions attached to the two leads of the second plurality of leads. 15. The IC package of claim 14, wherein a distance between the two foot portions of the first bond wire or the second bond wire is 750 micrometers. 16. The IC package of claim 12, wherein the first IC die or the second IC die is electrically connected to the first bond wire and the second bond wire. 17. The IC package of claim 11, wherein planes of the first bond wire and the second bond wire are parallel to a plane of the first die attach pad and a plane of the second die attach pad. 18. The IC package of claim 11, wherein portions of the first plurality of leads and the second plurality of leads extend through the mold compound. | 2,800 |
12,270 | 12,270 | 15,216,142 | 2,859 | A system for generator-based charging of a battery module may include the battery module, a sensor located adjacent the battery module, a generator controller comprising a processor and a non-transitory memory device storing instructions. The instructions, when executed by the processor, cause the generator controller to analyze one or more sensor signals received from the sensor. The sensor signals may correspond to a condition of the battery module. The generator controller may then calculate, based on the one or more sensor signals, a generator current value for use in charging the battery module. Next, the generator controller may generate a control signal comprising a command that may cause the generator to provide a charging current having the current value. | 1. A system for generator-based charging of a battery module, the system comprising:
the battery module a sensor located adjacent the battery module a generator controller comprising a processor and a non-transitory memory device storing instructions that, when executed by the processor, cause the generator controller to:
analyze one or more sensor signals received from the sensor, the sensor signals corresponding to a condition of the battery module;
calculate, based on the one or more sensor signals, a generator current value for use in charging the battery module; and
generate a control signal comprising a command to control a generator to provide the current value. 2. The system of claim 1, wherein the sensor comprises a number of sensors for sensing a plurality of battery conditions and a processor capable of determining a state of charge of the battery module based on the plurality of battery conditions. 3. The system of claim 1, further comprising a non-transitory memory device storing a plurality of charging profiles associated with one or more different battery module configurations. 4. The system of claim 1, wherein the battery module comprises a Li-ion battery. 5. The system of claim 1, wherein the generator current value is determined based on a charging profile and at least one sensed parameter. 6. The system of claim 5, wherein the charging profile is stored in tabular format in the non-transitory memory device associated with the generator controller. 7. The system of claim 1, wherein the current value is associated with a battery voltage sensed in near real time based on a charging profile. 8. A method for generator-based charging of a battery module, the method comprising:
analyzing one or more sensor signals received from a sensor, the sensor signals corresponding to a condition of the battery module; calculating, by a controller based on the one or more sensor signals and a charging profile, a generator output for use in charging the battery module; and communicating a command signal to a generator, the command causing the generator to provide the generator output. 9. The method of claim 8, comprising:
identifying, by the controller, a configuration of the battery module; and identifying, by the controller, a charging profile for use in charging the battery module based on the configuration of the battery module and the sensor signals received from the sensor. 10. The method of claim 9, wherein the configuration of the battery module comprises a single battery type and the command signal corresponds to a current command to provide a specified output current based on a sensed voltage. 11. The method of claim 9, wherein the configuration of the battery module comprises a single battery type and the command signal corresponds to a command to output a specified output current based on a sensed voltage and a sensed temperature. 12. The method of claim 9, wherein the configuration of the battery module comprises multiple battery types and the command signal corresponds to a command to output a specified output voltage based on a sensed temperature. 13. The method of claim 9, wherein the configuration of the battery module comprises multiple battery types and the command signal corresponds to a voltage command to provide a specified output voltage based on a sensed temperature and a sensed current. 14. The method of claim 8, wherein the charging profile is stored in tabular format in a memory associated with the controller. 15. A controller for a generator to charge a battery module, the apparatus comprising:
a processor; and a non-transitory memory device storing instructions that, when executed by the processor, cause the apparatus to:
receive a plurality of sensed signals associated with the battery module, the sensed signals comprising a voltage signal, a current signal, and a temperature signal;
identify, based on the plurality of sensed signals and a configuration of the battery module, a first charging profile from a plurality of charging profiles stored in the non-transitory memory device;
identify, based on the plurality of sensed signals, a generator output using on the first charging profile in near real-time; and
communicate, to the generator, a command for the generator to output the identified generator output. 16. The controller of claim 15, wherein the instructions, when executed by the processor, cause the apparatus to:
sense, in near real time, a plurality of battery module parameters including battery module current, battery module voltage, and battery module temperature; and identify, based on the sensed plurality of battery module parameters whether a threshold condition has been reached; and if so, select, based on the sensed plurality of battery module parameters, a second charging profile; and identify, based on the sensed plurality of battery module parameters, a second generator output using on the second charging profile in near real-time, and communicate, to the generator, a second command for the generator to output the identified second generator output. 17. The controller of claim 16, wherein the threshold condition corresponds to a temperature threshold. 18. The controller of claim 16, wherein the threshold condition corresponds to a current threshold. 19. The controller of claim 16, wherein the first charging profile and the second charging profile are stored in tabular format in a non-transitory memory associated with the controller. 20. The controller of claim 19, wherein the plurality of sensed signals are sensed using a smart sensor installed adjacent to the battery module, and wherein the smart sensor communicates a message to the apparatus including a state of charge of the battery module calculated using the plurality of sensed signals. | A system for generator-based charging of a battery module may include the battery module, a sensor located adjacent the battery module, a generator controller comprising a processor and a non-transitory memory device storing instructions. The instructions, when executed by the processor, cause the generator controller to analyze one or more sensor signals received from the sensor. The sensor signals may correspond to a condition of the battery module. The generator controller may then calculate, based on the one or more sensor signals, a generator current value for use in charging the battery module. Next, the generator controller may generate a control signal comprising a command that may cause the generator to provide a charging current having the current value.1. A system for generator-based charging of a battery module, the system comprising:
the battery module a sensor located adjacent the battery module a generator controller comprising a processor and a non-transitory memory device storing instructions that, when executed by the processor, cause the generator controller to:
analyze one or more sensor signals received from the sensor, the sensor signals corresponding to a condition of the battery module;
calculate, based on the one or more sensor signals, a generator current value for use in charging the battery module; and
generate a control signal comprising a command to control a generator to provide the current value. 2. The system of claim 1, wherein the sensor comprises a number of sensors for sensing a plurality of battery conditions and a processor capable of determining a state of charge of the battery module based on the plurality of battery conditions. 3. The system of claim 1, further comprising a non-transitory memory device storing a plurality of charging profiles associated with one or more different battery module configurations. 4. The system of claim 1, wherein the battery module comprises a Li-ion battery. 5. The system of claim 1, wherein the generator current value is determined based on a charging profile and at least one sensed parameter. 6. The system of claim 5, wherein the charging profile is stored in tabular format in the non-transitory memory device associated with the generator controller. 7. The system of claim 1, wherein the current value is associated with a battery voltage sensed in near real time based on a charging profile. 8. A method for generator-based charging of a battery module, the method comprising:
analyzing one or more sensor signals received from a sensor, the sensor signals corresponding to a condition of the battery module; calculating, by a controller based on the one or more sensor signals and a charging profile, a generator output for use in charging the battery module; and communicating a command signal to a generator, the command causing the generator to provide the generator output. 9. The method of claim 8, comprising:
identifying, by the controller, a configuration of the battery module; and identifying, by the controller, a charging profile for use in charging the battery module based on the configuration of the battery module and the sensor signals received from the sensor. 10. The method of claim 9, wherein the configuration of the battery module comprises a single battery type and the command signal corresponds to a current command to provide a specified output current based on a sensed voltage. 11. The method of claim 9, wherein the configuration of the battery module comprises a single battery type and the command signal corresponds to a command to output a specified output current based on a sensed voltage and a sensed temperature. 12. The method of claim 9, wherein the configuration of the battery module comprises multiple battery types and the command signal corresponds to a command to output a specified output voltage based on a sensed temperature. 13. The method of claim 9, wherein the configuration of the battery module comprises multiple battery types and the command signal corresponds to a voltage command to provide a specified output voltage based on a sensed temperature and a sensed current. 14. The method of claim 8, wherein the charging profile is stored in tabular format in a memory associated with the controller. 15. A controller for a generator to charge a battery module, the apparatus comprising:
a processor; and a non-transitory memory device storing instructions that, when executed by the processor, cause the apparatus to:
receive a plurality of sensed signals associated with the battery module, the sensed signals comprising a voltage signal, a current signal, and a temperature signal;
identify, based on the plurality of sensed signals and a configuration of the battery module, a first charging profile from a plurality of charging profiles stored in the non-transitory memory device;
identify, based on the plurality of sensed signals, a generator output using on the first charging profile in near real-time; and
communicate, to the generator, a command for the generator to output the identified generator output. 16. The controller of claim 15, wherein the instructions, when executed by the processor, cause the apparatus to:
sense, in near real time, a plurality of battery module parameters including battery module current, battery module voltage, and battery module temperature; and identify, based on the sensed plurality of battery module parameters whether a threshold condition has been reached; and if so, select, based on the sensed plurality of battery module parameters, a second charging profile; and identify, based on the sensed plurality of battery module parameters, a second generator output using on the second charging profile in near real-time, and communicate, to the generator, a second command for the generator to output the identified second generator output. 17. The controller of claim 16, wherein the threshold condition corresponds to a temperature threshold. 18. The controller of claim 16, wherein the threshold condition corresponds to a current threshold. 19. The controller of claim 16, wherein the first charging profile and the second charging profile are stored in tabular format in a non-transitory memory associated with the controller. 20. The controller of claim 19, wherein the plurality of sensed signals are sensed using a smart sensor installed adjacent to the battery module, and wherein the smart sensor communicates a message to the apparatus including a state of charge of the battery module calculated using the plurality of sensed signals. | 2,800 |
12,271 | 12,271 | 16,227,193 | 2,848 | A thin-film device that includes a wiring electrode which contains copper. A terminal electrode is formed on a first region of the first main surface of the wiring electrode. A first close-contact layer made of a material different from copper and that has a shape covering, in a continuous manner, a second region of the first main surface of the wiring electrode, the second region being adjacent to the first region, and the side surface of the wiring electrode that is continuous with the second region. | 1. A device comprising:
a substrate; a functional element in or on the substrate; a wiring electrode electrically connected to the functional element, the wiring electrode having a flat film shape, a first main surface, a second main surface opposite to the first main surface, and made of a material containing copper; a terminal electrode directly or indirectly connected to a first region of the first main surface of the wiring electrode; and a first close-contact layer made of a material that becomes passivated and is in direct contact with and continuously covers a second region of the first main surface of the wiring electrode and an end portion of the wiring electrode that is continuous with the second region, the second region being adjacent to the first region. 2. The device according to claim 1, further comprising an insulating resin layer that covers the first close-contact layer and a side surface of the terminal electrode. 3. The device according to claim 2, wherein the insulating resin layer covers an outer edge portion of a surface of the terminal electrode. 4. The device according to claim 1, further comprising:
a second close-contact layer on the second main surface of the wiring electrode and made of a material that becomes passivated, wherein the second close-contact layer is continuous with the first close-contact layer. 5. The device according to claim 4, wherein the first close-contact layer and the second close-contact layer are each made of at least one type of material selected from titanium, chrome, nickel, and aluminum or at least one type of material selected from compounds containing any of titanium, chrome, nickel, and aluminum. 6. The device according to claim 1,
wherein the functional element is a capacitor that includes a dielectric layer and capacitor electrodes, and wherein the wiring electrode is electrically connected to one of the capacitor electrodes that is a positive electrode. 7. The device according to claim 6, wherein the wiring electrode is a first wiring electrode, and the thin-film device further comprises a second wiring electrode that is electrically connected to one of the capacitor electrodes that is a negative electrode, and the end portion of the first wiring electrode faces the second wiring electrode. 8. The device according to claim 6, wherein the dielectric layer is a sintered compact. 9. The device according to claim 6, wherein the wiring electrode is made of a material that has a conductivity higher than a conductivity of each of the capacitor electrodes. 10. The device according to claim 6, wherein a thickness of the wiring electrode is larger than a thickness of each of the capacitor electrodes. 11. A method of manufacturing a device, the method comprising:
forming a wiring electrode on a top surface side of a substrate that includes a functional element, the wiring electrode being made of a material containing copper; forming a terminal electrode onto a first region of a surface of the wiring electrode; forming a first close-contact layer made of a material that becomes passivated such that the first close-contact layer is continuous with a second region of the wiring electrode which is adjacent to the first region, and an end portion of the wiring electrode; and removing a portion of the first close-contact layer that is not in contact with the wiring electrode. 12. The method of manufacturing a device according to claim 11, the method further comprising:
before forming the wiring electrode, forming a second close-contact layer made of a material that becomes passivated on the top surface side of the substrate that includes the functional element; after forming the second close-contact layer, forming the wiring electrode onto a surface of the second close-contact layer so as to form a wiring-electrode-formation region in which the wiring electrode is formed on the surface of the second close-contact layer and an exposed region in which the wiring electrode is not formed on the surface of the second close-contact layer; forming the first close-contact layer such that the first close-contact layer is continuous with the second region of the wiring electrode, the end portion of the wiring electrode, and the exposed region of the second close-contact layer; and removing the portion of the first close-contact layer and a portion of the second close-contact layer that are not in contact with the wiring electrode. 13. The method of manufacturing a device according to claim 11, wherein the first close-contact layer and the second close-contact layer are each made of at least one type of material selected from titanium, chrome, nickel, and aluminum or at least one type of material selected from compounds containing any of titanium, chrome, nickel, and aluminum. 14. The method of manufacturing a device according to claim 11,
wherein the functional element is a capacitor that includes a dielectric layer and capacitor electrodes, and wherein the wiring electrode is electrically connected to one of the capacitor electrodes that is a positive electrode. 15. The method of manufacturing a device according to claim 14, wherein the wiring electrode is a first wiring electrode, and the method further comprises forming a second wiring electrode that is electrically connected to one of the capacitor electrodes that is a negative electrode such that the end portion of the first wiring electrode faces the second wiring electrode. 16. The method of manufacturing a device according to claim 14, wherein the dielectric layer is a sintered compact. 17. The method of manufacturing a device according to claim 14, wherein the wiring electrode is made of a material that has a conductivity higher than a conductivity of each of the capacitor electrodes. 18. The method of manufacturing a device according to claim 14, wherein a thickness of the wiring electrode is larger than a thickness of each of the capacitor electrodes. | A thin-film device that includes a wiring electrode which contains copper. A terminal electrode is formed on a first region of the first main surface of the wiring electrode. A first close-contact layer made of a material different from copper and that has a shape covering, in a continuous manner, a second region of the first main surface of the wiring electrode, the second region being adjacent to the first region, and the side surface of the wiring electrode that is continuous with the second region.1. A device comprising:
a substrate; a functional element in or on the substrate; a wiring electrode electrically connected to the functional element, the wiring electrode having a flat film shape, a first main surface, a second main surface opposite to the first main surface, and made of a material containing copper; a terminal electrode directly or indirectly connected to a first region of the first main surface of the wiring electrode; and a first close-contact layer made of a material that becomes passivated and is in direct contact with and continuously covers a second region of the first main surface of the wiring electrode and an end portion of the wiring electrode that is continuous with the second region, the second region being adjacent to the first region. 2. The device according to claim 1, further comprising an insulating resin layer that covers the first close-contact layer and a side surface of the terminal electrode. 3. The device according to claim 2, wherein the insulating resin layer covers an outer edge portion of a surface of the terminal electrode. 4. The device according to claim 1, further comprising:
a second close-contact layer on the second main surface of the wiring electrode and made of a material that becomes passivated, wherein the second close-contact layer is continuous with the first close-contact layer. 5. The device according to claim 4, wherein the first close-contact layer and the second close-contact layer are each made of at least one type of material selected from titanium, chrome, nickel, and aluminum or at least one type of material selected from compounds containing any of titanium, chrome, nickel, and aluminum. 6. The device according to claim 1,
wherein the functional element is a capacitor that includes a dielectric layer and capacitor electrodes, and wherein the wiring electrode is electrically connected to one of the capacitor electrodes that is a positive electrode. 7. The device according to claim 6, wherein the wiring electrode is a first wiring electrode, and the thin-film device further comprises a second wiring electrode that is electrically connected to one of the capacitor electrodes that is a negative electrode, and the end portion of the first wiring electrode faces the second wiring electrode. 8. The device according to claim 6, wherein the dielectric layer is a sintered compact. 9. The device according to claim 6, wherein the wiring electrode is made of a material that has a conductivity higher than a conductivity of each of the capacitor electrodes. 10. The device according to claim 6, wherein a thickness of the wiring electrode is larger than a thickness of each of the capacitor electrodes. 11. A method of manufacturing a device, the method comprising:
forming a wiring electrode on a top surface side of a substrate that includes a functional element, the wiring electrode being made of a material containing copper; forming a terminal electrode onto a first region of a surface of the wiring electrode; forming a first close-contact layer made of a material that becomes passivated such that the first close-contact layer is continuous with a second region of the wiring electrode which is adjacent to the first region, and an end portion of the wiring electrode; and removing a portion of the first close-contact layer that is not in contact with the wiring electrode. 12. The method of manufacturing a device according to claim 11, the method further comprising:
before forming the wiring electrode, forming a second close-contact layer made of a material that becomes passivated on the top surface side of the substrate that includes the functional element; after forming the second close-contact layer, forming the wiring electrode onto a surface of the second close-contact layer so as to form a wiring-electrode-formation region in which the wiring electrode is formed on the surface of the second close-contact layer and an exposed region in which the wiring electrode is not formed on the surface of the second close-contact layer; forming the first close-contact layer such that the first close-contact layer is continuous with the second region of the wiring electrode, the end portion of the wiring electrode, and the exposed region of the second close-contact layer; and removing the portion of the first close-contact layer and a portion of the second close-contact layer that are not in contact with the wiring electrode. 13. The method of manufacturing a device according to claim 11, wherein the first close-contact layer and the second close-contact layer are each made of at least one type of material selected from titanium, chrome, nickel, and aluminum or at least one type of material selected from compounds containing any of titanium, chrome, nickel, and aluminum. 14. The method of manufacturing a device according to claim 11,
wherein the functional element is a capacitor that includes a dielectric layer and capacitor electrodes, and wherein the wiring electrode is electrically connected to one of the capacitor electrodes that is a positive electrode. 15. The method of manufacturing a device according to claim 14, wherein the wiring electrode is a first wiring electrode, and the method further comprises forming a second wiring electrode that is electrically connected to one of the capacitor electrodes that is a negative electrode such that the end portion of the first wiring electrode faces the second wiring electrode. 16. The method of manufacturing a device according to claim 14, wherein the dielectric layer is a sintered compact. 17. The method of manufacturing a device according to claim 14, wherein the wiring electrode is made of a material that has a conductivity higher than a conductivity of each of the capacitor electrodes. 18. The method of manufacturing a device according to claim 14, wherein a thickness of the wiring electrode is larger than a thickness of each of the capacitor electrodes. | 2,800 |
12,272 | 12,272 | 14,432,721 | 2,815 | Methods for manufacturing semiconductor wafer structures are described which exhibit improved lifetime and reliability. The methods comprise transferring an active semiconductor layer structure from a native non-lattice-matched semiconductor growth substrate to a working substrate, wherein strain-matching layers, and optionally a portion of the active semiconductor layer structure, are removed. In certain embodiment, the process of attaching the active semiconductor layer structure to the working substrate includes annealing at an elevated temperature for a specified time. The methods as described herein can be used to fabricate working semiconductor wafer structures which have a low concentration of dislocation defects throughout the active semiconductor layer structure and which do not comprise highly dislocated strain-matching layers which are present in the native semiconductor growth substrate | 1. A method of manufacturing a working semiconductor wafer structure for semiconductor device fabrication thereon, the method comprising:
starting with a native semiconductor growth wafer comprising:
a native growth substrate having a first lattice constant x1;
an active semiconductor layer structure having a second lattice constant x2 different from said first lattice constant x1 by at least 1%; and
one or more single crystal strain-matching layers disposed between the native growth substrate and the active semiconductor layer structure;
transferring at least a portion of the active semiconductor layer structure to a working substrate; and removing at least a portion of the one or more single crystal strain-matching layers of the native semiconductor, whereby the working semiconductor wafer structure is formed and comprises the working substrate, at least a portion of the active semiconductor layer structure of the native semiconductor growth wafer, but does not include at least a portion of the one or more single crystal strain-matching layers of the native semiconductor growth wafer wherein the transferring and removing steps comprise: attaching a transfer substrate to the active semiconductor layer structure of the native semiconductor growth wafer; removing the native growth substrate; removing the one or more single crystal strain-matching layers of the native semiconductor; attaching the working substrate to the active semiconductor layer structure; and removing the transfer substrate to form a working surface of the active semiconductor layer structure in the working semiconductor wafer structure, and wherein the working substrate comprises polycrystalline diamond and the step of attaching the working substrate to the active semiconductor layer structure comprises depositing polycrystalline diamond over the active semiconductor layer structure using a chemical vapour deposition technique after removing the one or more single crystal strain-matching layers of the native semiconductor. 2. (canceled) 3. A method according to claim 1,
wherein one or more of the single crystal strain-matching layers have a concentration of dislocation defects of at least 1×106 defects/cm2, 1×107 defects/cm2, 1×108 defects/cm2, 1×109 defects/cm2, or 1×1010 defects/cm2. 4. A method according to claim 1,
further comprising removing a portion of the active semiconductor layer structure proximate to the strain-matching layer of the native semiconductor growth wafer after removing the one or more single crystal strain-matching layers, whereby the working semiconductor wafer structure only comprises a portion of the active semiconductor layer structure which was distal to the native growth substrate in the native semiconductor growth wafer. 5-9. (canceled) 10. A method according to claim 1,
wherein the transfer substrate is attached to the active semiconductor layer structure of the native semiconductor growth wafer via a protective layer disposed between the transfer substrate and the active semiconductor layer structure; and after removing the transfer substrate the protective layer is also removed to reveal the working surface of the active semiconductor layer structure in the working semiconductor wafer structure. 11. A method according to claim 10,
wherein the protective layer is formed of at least one amorphous or polycrystalline material. 12. A method according to claim 10,
wherein the working substrate is attached to the active semiconductor layer structure via a functional layer disposed between the working substrate and the active semiconductor layer structure. 13-15. (canceled) 16. A method according to claim 1,
further comprising fabricating at least one electronic or optoelectronic device on the active semiconductor layer structure in the working semiconductor wafer structure. 17. A working semiconductor wafer structure comprising:
a working substrate comprising polycrystalline CVD diamond; and an active semiconductor layer structure bonded to the working substrate, wherein the working semiconductor wafer structure does not include a single crystal strain-matching layer structure disposed between the working substrate and the active semiconductor layer structure which has a concentration of dislocation defects of at least 1×1010 defects/cm2. 18. A working semiconductor wafer structure according to claim 17,
wherein the working semiconductor wafer structure does not include a single crystal strain-matching layer structure disposed between the working substrate and the active semiconductor layer structure which has a concentration of dislocation defects of at least 1×109 defects/cm2, 1×108 defects/cm2, 1×107 defects/cm2, or 1×106 defects/cm2. 19. A working semiconductor wafer structure according to claim 17,
wherein the working semiconductor wafer structure does not include a single crystal strain-matching layer structure disposed between the working substrate and the active semiconductor layer structure which has a thickness of at least 1 micrometer, 500 nm, 200 nm, 100 nm, 50 nm, 10 nm, or 1 nm. 20. A working semiconductor wafer structure according to claim 17,
wherein the working semiconductor wafer structure does not include any single crystal strain-matching layers disposed between the working substrate and the active semiconductor layer structure. 21. A working semiconductor wafer structure according to claim 17,
wherein the active semiconductor layer structure comprises a concentration of dislocation defects in a layer distal to the working substrate and/or in a layer proximal to the working substrate which is less than 1×108 defects/cm2, 5×107 defects/cm2, 1×107 defects/cm2, 5×106 defects/cm2, or 1×106 defects/cm2. 22. A working semiconductor wafer structure according to claim 17,
further comprising a functional layer disposed between the active semiconductor layer structure and the working substrate. 23-24. (canceled) 25. A working semiconductor wafer structure according to claim 22,
wherein the functional layer is selected from a group consisting of silicon nitride, aluminum nitride, and silicon carbide. 26. (canceled) 27. A working semiconductor wafer structure according to claim 17,
wherein the active semiconductor layer structure comprises a semiconductive buffer layer proximate to the working substrate and a semiconductive barrier layer distal to the working substrate and wherein the active semiconductor layer structure comprises at least one layer made out of gallium nitride. 28-36. (canceled) | Methods for manufacturing semiconductor wafer structures are described which exhibit improved lifetime and reliability. The methods comprise transferring an active semiconductor layer structure from a native non-lattice-matched semiconductor growth substrate to a working substrate, wherein strain-matching layers, and optionally a portion of the active semiconductor layer structure, are removed. In certain embodiment, the process of attaching the active semiconductor layer structure to the working substrate includes annealing at an elevated temperature for a specified time. The methods as described herein can be used to fabricate working semiconductor wafer structures which have a low concentration of dislocation defects throughout the active semiconductor layer structure and which do not comprise highly dislocated strain-matching layers which are present in the native semiconductor growth substrate1. A method of manufacturing a working semiconductor wafer structure for semiconductor device fabrication thereon, the method comprising:
starting with a native semiconductor growth wafer comprising:
a native growth substrate having a first lattice constant x1;
an active semiconductor layer structure having a second lattice constant x2 different from said first lattice constant x1 by at least 1%; and
one or more single crystal strain-matching layers disposed between the native growth substrate and the active semiconductor layer structure;
transferring at least a portion of the active semiconductor layer structure to a working substrate; and removing at least a portion of the one or more single crystal strain-matching layers of the native semiconductor, whereby the working semiconductor wafer structure is formed and comprises the working substrate, at least a portion of the active semiconductor layer structure of the native semiconductor growth wafer, but does not include at least a portion of the one or more single crystal strain-matching layers of the native semiconductor growth wafer wherein the transferring and removing steps comprise: attaching a transfer substrate to the active semiconductor layer structure of the native semiconductor growth wafer; removing the native growth substrate; removing the one or more single crystal strain-matching layers of the native semiconductor; attaching the working substrate to the active semiconductor layer structure; and removing the transfer substrate to form a working surface of the active semiconductor layer structure in the working semiconductor wafer structure, and wherein the working substrate comprises polycrystalline diamond and the step of attaching the working substrate to the active semiconductor layer structure comprises depositing polycrystalline diamond over the active semiconductor layer structure using a chemical vapour deposition technique after removing the one or more single crystal strain-matching layers of the native semiconductor. 2. (canceled) 3. A method according to claim 1,
wherein one or more of the single crystal strain-matching layers have a concentration of dislocation defects of at least 1×106 defects/cm2, 1×107 defects/cm2, 1×108 defects/cm2, 1×109 defects/cm2, or 1×1010 defects/cm2. 4. A method according to claim 1,
further comprising removing a portion of the active semiconductor layer structure proximate to the strain-matching layer of the native semiconductor growth wafer after removing the one or more single crystal strain-matching layers, whereby the working semiconductor wafer structure only comprises a portion of the active semiconductor layer structure which was distal to the native growth substrate in the native semiconductor growth wafer. 5-9. (canceled) 10. A method according to claim 1,
wherein the transfer substrate is attached to the active semiconductor layer structure of the native semiconductor growth wafer via a protective layer disposed between the transfer substrate and the active semiconductor layer structure; and after removing the transfer substrate the protective layer is also removed to reveal the working surface of the active semiconductor layer structure in the working semiconductor wafer structure. 11. A method according to claim 10,
wherein the protective layer is formed of at least one amorphous or polycrystalline material. 12. A method according to claim 10,
wherein the working substrate is attached to the active semiconductor layer structure via a functional layer disposed between the working substrate and the active semiconductor layer structure. 13-15. (canceled) 16. A method according to claim 1,
further comprising fabricating at least one electronic or optoelectronic device on the active semiconductor layer structure in the working semiconductor wafer structure. 17. A working semiconductor wafer structure comprising:
a working substrate comprising polycrystalline CVD diamond; and an active semiconductor layer structure bonded to the working substrate, wherein the working semiconductor wafer structure does not include a single crystal strain-matching layer structure disposed between the working substrate and the active semiconductor layer structure which has a concentration of dislocation defects of at least 1×1010 defects/cm2. 18. A working semiconductor wafer structure according to claim 17,
wherein the working semiconductor wafer structure does not include a single crystal strain-matching layer structure disposed between the working substrate and the active semiconductor layer structure which has a concentration of dislocation defects of at least 1×109 defects/cm2, 1×108 defects/cm2, 1×107 defects/cm2, or 1×106 defects/cm2. 19. A working semiconductor wafer structure according to claim 17,
wherein the working semiconductor wafer structure does not include a single crystal strain-matching layer structure disposed between the working substrate and the active semiconductor layer structure which has a thickness of at least 1 micrometer, 500 nm, 200 nm, 100 nm, 50 nm, 10 nm, or 1 nm. 20. A working semiconductor wafer structure according to claim 17,
wherein the working semiconductor wafer structure does not include any single crystal strain-matching layers disposed between the working substrate and the active semiconductor layer structure. 21. A working semiconductor wafer structure according to claim 17,
wherein the active semiconductor layer structure comprises a concentration of dislocation defects in a layer distal to the working substrate and/or in a layer proximal to the working substrate which is less than 1×108 defects/cm2, 5×107 defects/cm2, 1×107 defects/cm2, 5×106 defects/cm2, or 1×106 defects/cm2. 22. A working semiconductor wafer structure according to claim 17,
further comprising a functional layer disposed between the active semiconductor layer structure and the working substrate. 23-24. (canceled) 25. A working semiconductor wafer structure according to claim 22,
wherein the functional layer is selected from a group consisting of silicon nitride, aluminum nitride, and silicon carbide. 26. (canceled) 27. A working semiconductor wafer structure according to claim 17,
wherein the active semiconductor layer structure comprises a semiconductive buffer layer proximate to the working substrate and a semiconductive barrier layer distal to the working substrate and wherein the active semiconductor layer structure comprises at least one layer made out of gallium nitride. 28-36. (canceled) | 2,800 |
12,273 | 12,273 | 16,078,681 | 2,886 | A measuring device for measuring the absorbance of a substance in at least one solution provided in at least two flow cells of the measuring device, wherein said measuring device comprises: —a light source transmitting a first light ray; —said at least two flow cells; —an optical arrangement comprising at least two semi-transparent mirrors with different transmission properties, said optical arrangement being arranged for dividing the first light ray coming from the light source into separate light parts, one for passing each flow cell and one for entering directly after the optical arrangement a reference detector; and —one detector provided after each flow cell for detecting light having passed through the flow cells. | 1. A method for measuring the absorbance of light of a substance in at least one solution provided in at least two flow cells provided in a measuring device, said method comprising the steps of:
transmitting a first light ray from a light source provided in the measuring device towards an optical arrangement provided in the measuring device; providing at least two beam splitters in the optical arrangement, said optical arrangement being arranged for dividing the first light ray coming into the optical arrangement from the light source into separate light parts, one for propagating through each flow cell and one for entering a reference detector after the optical arrangement; detecting light having passed each flow cell; comparing the detected light having passed each flow cell and light detected by the reference detector for determining the absorbance of the substance in the solution at each flow cell. 2. A method according to claim 1, further comprising:
providing the at least two beam splitters in the path of the first light ray from the light source such that a reflected part of light from each beam splitter will pass a respective one of the flow cells; and adapting the transmission properties of each beam splitter for providing light of about equal intensity to pass through each flow cell and for providing a further light part at the reference detector, said reference detector being provided after the beam splitters in the path of the first light ray from the light source. 3. A method according to claim 1, wherein said beam splitters each comprise a semi-transparent mirror or beam splitting prism, the mirrors prisms or light guides each having a semi reflective surface, the method comprising the steps of:
transmitting a first light ray from a light source provided in the measuring device towards a first of said mirror's or prism's semi reflective surfaces provided in the optical arrangement, said first surface being angled in relation to the light direction of the first light ray; reflecting ⅓ of the incoming light from the first surface and passing through ⅔ of the light; providing the light passed through the first surface to a second surface provided in the optical arrangement, said second surface being angled in relation to the incoming light direction; reflecting half of the incoming light from the second surface semi-transparent mirror and passing through half of the incoming light; providing the light reflected from the first surface through a first flow cell comprising a first solution; providing the light reflected from the second surface through a second flow cell comprising a second solution; detecting light having passed through the first flow cell by a first detector provided in the measuring device; detecting light having passed through the second flow cell by a second detector provided in the measuring device; and detecting light having passed through the second semi-transparent mirror by the reference detector. 4. A measuring device for measuring the absorbance of a substance in at least one solution provided in at least two flow cells of the measuring device, wherein said measuring device comprises:
a light source transmitting a first light ray; said at least two flow cells; an optical arrangement comprising at least two beam splitters with different light transmission properties, said optical arrangement being arranged for dividing the first light ray coming from the light source into separate light parts, one for passing each flow cell and one for entering directly after the optical arrangement a reference detector; and one detector provided after each flow cell for detecting light having passed through the flow cells. 5. A measuring device according to claim 4, wherein the at least two beam splitters are semi-transparent mirrors and are provided in the line of the first light ray from the light source such that a reflected part of light from each semi-transparent mirror will pass a respective one of the flow cells and the transmission properties of each semi-transparent mirror being adapted for providing equally big light parts to pass through each flow cell and for providing a further light part to a reference detector comprised in the measuring device, said reference detector being provided after the semi-transparent mirrors in the line of the first light ray from the light source. 6. A measuring device according to claim 4, wherein the optical arrangement comprises:
a first semi-transparent mirror which is reflecting ⅓ and passing through ⅔ of light coming in to the semi-transparent mirror surface, said first semi-transparent mirror being arranged in the measuring device with an angle towards the first light ray from the light source; and a second semi-transparent mirror which is reflecting ½ and passing through ½ of light coming in to the semi-transparent mirror surface, said second semi-transparent mirror being arranged in the measuring device with an angle towards light having passed through the first semi-transparent mirror;
and wherein the measuring device further comprises
a first flow cell comprising a first solution, said first flow cell being arranged in a path of light being reflected from the first semi-transparent mirror;
a second flow cell comprising a second solution, said second flow cell being arranged in a path of light being reflected from the second semi-transparent mirror;
a first detector positioned for detecting light having passed through the first flow cell;
a second detector positioned for detecting light having passed through the second flow cell; and
a reference detector positioned for detecting light having passed through the second semi-transparent mirror. 7. A measuring device according to claim 5, wherein the optical arrangement comprises:
a first semi-transparent mirror which is reflecting ¼ and passing through ¾ of light coming in to the semi-transparent mirror surface, said first semi-transparent mirror being arranged in the measuring device with an angle towards the first light ray from the light source; a second semi-transparent mirror which is reflecting ⅓ and passing through ⅔ of light coming in to the semi-transparent mirror surface, said second semi-transparent mirror being arranged in the measuring device with an angle towards light having passed through the first semi-transparent mirror; and a third semi-transparent mirror which is reflecting ½ and passing through ½ of light coming in to the semi-transparent mirror surface, said second semi-transparent mirror being arranged in the measuring device with an angle towards light having passed through the second semi-transparent mirror;
and wherein the measuring device comprises
a first flow cell comprising a first solution, said first flow cell being arranged in a path of light being reflected from the first semi-transparent mirror;
a second flow cell comprising a second solution, said second flow cell being arranged in a path of light being reflected from the second semi-transparent mirror;
a third flow cell comprising a third solution, said third flow cell being arranged in a path of light being reflected from the third semi-transparent mirror;
a first detector positioned for detecting light having passed through the first flow cell;
a second detector positioned for detecting light having passed through the second flow cell;
a third detector positioned for detecting light having passed through the third flow cell; and
a reference detector positioned for detecting light having passed through the third semi-transparent mirror. 8. A measuring device according to claim 5, wherein the flow cells comprises different path lengths. 9. A measuring device for measuring the absorbance of a substance in at least one solution provided in at least two flow cells of the measuring device, wherein said measuring device comprises:
a source for emitting light, a path 25 for propagating the light emitted by the source at a light intensity; an optical element including: a first beam splitter arranged to split the light into first and second fractions; and a second beam splitter arranged to split the second fraction into a third and fourth fraction; wherein the first beam splitter is arranged to propagate the first fraction toward a first of the two flow cells, and is arranged to propagate the second fraction toward the second beam splitter; and wherein the second beam splitter is arranged to propagate the third fraction toward a second of the flow cells. 10. A measuring device as claimed in claim 9 wherein said at least two flow cells comprises two flow cells, and wherein the first and third fractions have around 33.3% of the light intensity, the optical element being further arranged to propagate the fourth fraction also having around 33.3% of the light intensity toward a reference detector. 11. A measuring device as claimed in claim 9 wherein said at least two flow cells comprises three flow cells and wherein the optical element further includes a third beam splitter arranged to split the fourth fraction of light into a fifth fraction for propagating toward the third flow cell and a sixth fraction, and wherein the first, third and fifth fractions each have around 25% of the light intensity, and wherein the optical element is further arranged to propagate the sixth fraction also having around 25% of the light intensity toward a reference detector. 12. A measurement device as claimed in claim 9, wherein the beam splitters each comprise; a semi transparent mirror; a beam splitting prism; or a beam splitting optical light guide. | A measuring device for measuring the absorbance of a substance in at least one solution provided in at least two flow cells of the measuring device, wherein said measuring device comprises: —a light source transmitting a first light ray; —said at least two flow cells; —an optical arrangement comprising at least two semi-transparent mirrors with different transmission properties, said optical arrangement being arranged for dividing the first light ray coming from the light source into separate light parts, one for passing each flow cell and one for entering directly after the optical arrangement a reference detector; and —one detector provided after each flow cell for detecting light having passed through the flow cells.1. A method for measuring the absorbance of light of a substance in at least one solution provided in at least two flow cells provided in a measuring device, said method comprising the steps of:
transmitting a first light ray from a light source provided in the measuring device towards an optical arrangement provided in the measuring device; providing at least two beam splitters in the optical arrangement, said optical arrangement being arranged for dividing the first light ray coming into the optical arrangement from the light source into separate light parts, one for propagating through each flow cell and one for entering a reference detector after the optical arrangement; detecting light having passed each flow cell; comparing the detected light having passed each flow cell and light detected by the reference detector for determining the absorbance of the substance in the solution at each flow cell. 2. A method according to claim 1, further comprising:
providing the at least two beam splitters in the path of the first light ray from the light source such that a reflected part of light from each beam splitter will pass a respective one of the flow cells; and adapting the transmission properties of each beam splitter for providing light of about equal intensity to pass through each flow cell and for providing a further light part at the reference detector, said reference detector being provided after the beam splitters in the path of the first light ray from the light source. 3. A method according to claim 1, wherein said beam splitters each comprise a semi-transparent mirror or beam splitting prism, the mirrors prisms or light guides each having a semi reflective surface, the method comprising the steps of:
transmitting a first light ray from a light source provided in the measuring device towards a first of said mirror's or prism's semi reflective surfaces provided in the optical arrangement, said first surface being angled in relation to the light direction of the first light ray; reflecting ⅓ of the incoming light from the first surface and passing through ⅔ of the light; providing the light passed through the first surface to a second surface provided in the optical arrangement, said second surface being angled in relation to the incoming light direction; reflecting half of the incoming light from the second surface semi-transparent mirror and passing through half of the incoming light; providing the light reflected from the first surface through a first flow cell comprising a first solution; providing the light reflected from the second surface through a second flow cell comprising a second solution; detecting light having passed through the first flow cell by a first detector provided in the measuring device; detecting light having passed through the second flow cell by a second detector provided in the measuring device; and detecting light having passed through the second semi-transparent mirror by the reference detector. 4. A measuring device for measuring the absorbance of a substance in at least one solution provided in at least two flow cells of the measuring device, wherein said measuring device comprises:
a light source transmitting a first light ray; said at least two flow cells; an optical arrangement comprising at least two beam splitters with different light transmission properties, said optical arrangement being arranged for dividing the first light ray coming from the light source into separate light parts, one for passing each flow cell and one for entering directly after the optical arrangement a reference detector; and one detector provided after each flow cell for detecting light having passed through the flow cells. 5. A measuring device according to claim 4, wherein the at least two beam splitters are semi-transparent mirrors and are provided in the line of the first light ray from the light source such that a reflected part of light from each semi-transparent mirror will pass a respective one of the flow cells and the transmission properties of each semi-transparent mirror being adapted for providing equally big light parts to pass through each flow cell and for providing a further light part to a reference detector comprised in the measuring device, said reference detector being provided after the semi-transparent mirrors in the line of the first light ray from the light source. 6. A measuring device according to claim 4, wherein the optical arrangement comprises:
a first semi-transparent mirror which is reflecting ⅓ and passing through ⅔ of light coming in to the semi-transparent mirror surface, said first semi-transparent mirror being arranged in the measuring device with an angle towards the first light ray from the light source; and a second semi-transparent mirror which is reflecting ½ and passing through ½ of light coming in to the semi-transparent mirror surface, said second semi-transparent mirror being arranged in the measuring device with an angle towards light having passed through the first semi-transparent mirror;
and wherein the measuring device further comprises
a first flow cell comprising a first solution, said first flow cell being arranged in a path of light being reflected from the first semi-transparent mirror;
a second flow cell comprising a second solution, said second flow cell being arranged in a path of light being reflected from the second semi-transparent mirror;
a first detector positioned for detecting light having passed through the first flow cell;
a second detector positioned for detecting light having passed through the second flow cell; and
a reference detector positioned for detecting light having passed through the second semi-transparent mirror. 7. A measuring device according to claim 5, wherein the optical arrangement comprises:
a first semi-transparent mirror which is reflecting ¼ and passing through ¾ of light coming in to the semi-transparent mirror surface, said first semi-transparent mirror being arranged in the measuring device with an angle towards the first light ray from the light source; a second semi-transparent mirror which is reflecting ⅓ and passing through ⅔ of light coming in to the semi-transparent mirror surface, said second semi-transparent mirror being arranged in the measuring device with an angle towards light having passed through the first semi-transparent mirror; and a third semi-transparent mirror which is reflecting ½ and passing through ½ of light coming in to the semi-transparent mirror surface, said second semi-transparent mirror being arranged in the measuring device with an angle towards light having passed through the second semi-transparent mirror;
and wherein the measuring device comprises
a first flow cell comprising a first solution, said first flow cell being arranged in a path of light being reflected from the first semi-transparent mirror;
a second flow cell comprising a second solution, said second flow cell being arranged in a path of light being reflected from the second semi-transparent mirror;
a third flow cell comprising a third solution, said third flow cell being arranged in a path of light being reflected from the third semi-transparent mirror;
a first detector positioned for detecting light having passed through the first flow cell;
a second detector positioned for detecting light having passed through the second flow cell;
a third detector positioned for detecting light having passed through the third flow cell; and
a reference detector positioned for detecting light having passed through the third semi-transparent mirror. 8. A measuring device according to claim 5, wherein the flow cells comprises different path lengths. 9. A measuring device for measuring the absorbance of a substance in at least one solution provided in at least two flow cells of the measuring device, wherein said measuring device comprises:
a source for emitting light, a path 25 for propagating the light emitted by the source at a light intensity; an optical element including: a first beam splitter arranged to split the light into first and second fractions; and a second beam splitter arranged to split the second fraction into a third and fourth fraction; wherein the first beam splitter is arranged to propagate the first fraction toward a first of the two flow cells, and is arranged to propagate the second fraction toward the second beam splitter; and wherein the second beam splitter is arranged to propagate the third fraction toward a second of the flow cells. 10. A measuring device as claimed in claim 9 wherein said at least two flow cells comprises two flow cells, and wherein the first and third fractions have around 33.3% of the light intensity, the optical element being further arranged to propagate the fourth fraction also having around 33.3% of the light intensity toward a reference detector. 11. A measuring device as claimed in claim 9 wherein said at least two flow cells comprises three flow cells and wherein the optical element further includes a third beam splitter arranged to split the fourth fraction of light into a fifth fraction for propagating toward the third flow cell and a sixth fraction, and wherein the first, third and fifth fractions each have around 25% of the light intensity, and wherein the optical element is further arranged to propagate the sixth fraction also having around 25% of the light intensity toward a reference detector. 12. A measurement device as claimed in claim 9, wherein the beam splitters each comprise; a semi transparent mirror; a beam splitting prism; or a beam splitting optical light guide. | 2,800 |
12,274 | 12,274 | 15,982,250 | 2,859 | Various embodiments are described that relate to charging a battery set. The battery set can comprise a first battery and a second battery. The batteries can be alternately charged so they are balanced. In one example, when the first battery is charged, then the second battery is not charged and vice versa. The alternation of charging can be managed based on different criteria, such as timing or charge level. | 1. A battery charge management system, comprising:
a selection component to make a selection of a first battery to charge from a battery bank and a second battery not to charge from the battery bank; and a charge component to cause the first battery to be charged while the second battery is not charged as a result of the selection. 2. The system of claim 1,
where the selection is made, at least in part, on a charge level of the first battery and a charge level of the second battery. 3. The system of claim 1,
where the selection is made, at least in part, on a charge length of time for the second battery preceding the selection being made. 4. The system of claim 1,
where the selection is made, at least in part, to achieve balance between the first battery and the second battery within a tolerance. 5. The system of claim 1, comprising:
a receiver component configured to receive power at a first voltage level from a source outside battery charge management system; and a conversion component configured to convert the power at the first voltage level to a power at a second voltage level different from the first voltage level, where the charge component is to cause the first battery to be charged with the power at the second voltage level. 6. The system of claim 1,
where the battery bank is a battery bank for a vehicle and where the first battery is charged from power supplied by a solar panel coupled to the vehicle. 7. A controller configured to be connected to a first battery and a second battery, the controller comprising:
a first control component configured to control the first battery to be charged while the second battery is not charged; and a second control component configured to control the second battery to be charged while the first battery is not charged. 8. The controller of claim 7, comprising:
a first decision component configured to make a first decision on when to control the first battery to be charged while the second battery is not charged; a second decision component configured to make a second decision on when to control the second battery to be charged while the first battery is not charged, where when the first decision component makes the first decision, the first control component operates and where when the second decision component makes the second decision, the second control component operates. 9. The controller of claim 8, comprising:
a reception component configured to receive an energy from a solar panel, a third decision component configured to make a third decision on when to control the first battery to not be charged and the second battery to not be charged, where the energy from the solar panel charges the first battery when the first decision is made and where when the third decision component makes the third decision, the solar panel is shut off so it no longer receives the energy. 10. The controller of claim 9,
a monitor component configured to monitor a charge level of the first battery and to monitor a charge level of the second battery; a first comparison component configured to compare the charge level of the first battery against a first threshold to produce a first comparison result; a second comparison component configured to compare the charge level of the second battery against a second threshold to produce a second comparison result; where the first decision component bases the first decision, at least in part, on the first comparison result and where the second decision component bases the second decision, at least in part, on the second comparison result. 11. The controller of claim 9, comprising:
a reception component configured to receive an energy from a solar panel; a third decision component configured to make a third decision on when to control the first battery to not be charged and the second battery to not be charged; and a diversion component configured to divert the energy from the solar panel to a non-battery location when the third decision is made, where the energy from the solar panel charges the first battery when the first decision is made. 12. The controller of claim 7,
where the first control component is isolated from the second control component and where the second control component is isolated from the first control component. 13. The controller of claim 7, comprising:
a timer component configured to track a time on how long a selected battery is charged, where the first decision component makes the first decision based, at least in part, on the time and where the second decision component makes the second decision based, at least in part, on the time. 14. The controller of claim 7, comprising:
a first monitor component configured to monitor a charge level of the first battery; and a second monitor component configured to monitor a charge level of the second battery, where the first decision component is configured to make the first decision based, at least in part, on the charge level of the first battery and where the second decision component is configured to make the second decision based, at least in part, on the charge level of the second battery. 15. A method, performed at least in part by a battery management apparatus, the method comprising:
identifying a condition to stop charging a first battery; stopping the charge of the first battery in response to identifying the condition to stop charging the first battery; making a determination on if a second battery should be charged when the first battery is no longer charging; and causing the second battery to be charged if the determination is that the second battery should be charged when the first battery is no longer charging. 16. The method of claim 15, comprising:
identifying, after causing the second battery to be charged, a condition to stop charging the second battery; and stopping the charge of the second battery in response to identifying the condition to stop charging the second battery. 17. The method of claim 16, where the determination is a first determination, comprising:
making a second determination on if the first battery should be charged when the second battery is no longer charged; and causing the second battery to be charged if the determination is that the second battery should be charged when the first battery is no longer charged. 18. The method of claim 17,
where the condition to stop charging the first battery is time-based and where the condition to stop charging the second battery is time-based. 19. The method of claim 17,
where the condition to stop charging the first battery is first battery charge level-based and where the condition to stop charging the second battery is second battery charge level-based. 20. The method of claim 15, comprising:
causing a non-battery to be powered if the determination is that the second battery should not be charged. | Various embodiments are described that relate to charging a battery set. The battery set can comprise a first battery and a second battery. The batteries can be alternately charged so they are balanced. In one example, when the first battery is charged, then the second battery is not charged and vice versa. The alternation of charging can be managed based on different criteria, such as timing or charge level.1. A battery charge management system, comprising:
a selection component to make a selection of a first battery to charge from a battery bank and a second battery not to charge from the battery bank; and a charge component to cause the first battery to be charged while the second battery is not charged as a result of the selection. 2. The system of claim 1,
where the selection is made, at least in part, on a charge level of the first battery and a charge level of the second battery. 3. The system of claim 1,
where the selection is made, at least in part, on a charge length of time for the second battery preceding the selection being made. 4. The system of claim 1,
where the selection is made, at least in part, to achieve balance between the first battery and the second battery within a tolerance. 5. The system of claim 1, comprising:
a receiver component configured to receive power at a first voltage level from a source outside battery charge management system; and a conversion component configured to convert the power at the first voltage level to a power at a second voltage level different from the first voltage level, where the charge component is to cause the first battery to be charged with the power at the second voltage level. 6. The system of claim 1,
where the battery bank is a battery bank for a vehicle and where the first battery is charged from power supplied by a solar panel coupled to the vehicle. 7. A controller configured to be connected to a first battery and a second battery, the controller comprising:
a first control component configured to control the first battery to be charged while the second battery is not charged; and a second control component configured to control the second battery to be charged while the first battery is not charged. 8. The controller of claim 7, comprising:
a first decision component configured to make a first decision on when to control the first battery to be charged while the second battery is not charged; a second decision component configured to make a second decision on when to control the second battery to be charged while the first battery is not charged, where when the first decision component makes the first decision, the first control component operates and where when the second decision component makes the second decision, the second control component operates. 9. The controller of claim 8, comprising:
a reception component configured to receive an energy from a solar panel, a third decision component configured to make a third decision on when to control the first battery to not be charged and the second battery to not be charged, where the energy from the solar panel charges the first battery when the first decision is made and where when the third decision component makes the third decision, the solar panel is shut off so it no longer receives the energy. 10. The controller of claim 9,
a monitor component configured to monitor a charge level of the first battery and to monitor a charge level of the second battery; a first comparison component configured to compare the charge level of the first battery against a first threshold to produce a first comparison result; a second comparison component configured to compare the charge level of the second battery against a second threshold to produce a second comparison result; where the first decision component bases the first decision, at least in part, on the first comparison result and where the second decision component bases the second decision, at least in part, on the second comparison result. 11. The controller of claim 9, comprising:
a reception component configured to receive an energy from a solar panel; a third decision component configured to make a third decision on when to control the first battery to not be charged and the second battery to not be charged; and a diversion component configured to divert the energy from the solar panel to a non-battery location when the third decision is made, where the energy from the solar panel charges the first battery when the first decision is made. 12. The controller of claim 7,
where the first control component is isolated from the second control component and where the second control component is isolated from the first control component. 13. The controller of claim 7, comprising:
a timer component configured to track a time on how long a selected battery is charged, where the first decision component makes the first decision based, at least in part, on the time and where the second decision component makes the second decision based, at least in part, on the time. 14. The controller of claim 7, comprising:
a first monitor component configured to monitor a charge level of the first battery; and a second monitor component configured to monitor a charge level of the second battery, where the first decision component is configured to make the first decision based, at least in part, on the charge level of the first battery and where the second decision component is configured to make the second decision based, at least in part, on the charge level of the second battery. 15. A method, performed at least in part by a battery management apparatus, the method comprising:
identifying a condition to stop charging a first battery; stopping the charge of the first battery in response to identifying the condition to stop charging the first battery; making a determination on if a second battery should be charged when the first battery is no longer charging; and causing the second battery to be charged if the determination is that the second battery should be charged when the first battery is no longer charging. 16. The method of claim 15, comprising:
identifying, after causing the second battery to be charged, a condition to stop charging the second battery; and stopping the charge of the second battery in response to identifying the condition to stop charging the second battery. 17. The method of claim 16, where the determination is a first determination, comprising:
making a second determination on if the first battery should be charged when the second battery is no longer charged; and causing the second battery to be charged if the determination is that the second battery should be charged when the first battery is no longer charged. 18. The method of claim 17,
where the condition to stop charging the first battery is time-based and where the condition to stop charging the second battery is time-based. 19. The method of claim 17,
where the condition to stop charging the first battery is first battery charge level-based and where the condition to stop charging the second battery is second battery charge level-based. 20. The method of claim 15, comprising:
causing a non-battery to be powered if the determination is that the second battery should not be charged. | 2,800 |
12,275 | 12,275 | 15,760,319 | 2,853 | In one example, a printing system includes a print engine and a print engine controller operatively connected to the print engine to print, on a single substrate web, graphics for multiple different layouts of corrugated boxes to be lined with the web and machine readable images representing corrugator control information for making the multiple different layouts. | 1. A printing system, comprising:
a print engine; and a print engine controller operatively connected to the print engine to print, on a single substrate web:
graphics for multiple different layouts of corrugated boxes to be lined with the web; and
machine readable images representing corrugator control information for making the multiple different layouts of boxes. 2. The printing system of claim 1, where each machine readable image representing corrugator control information includes at least one of:
an identification that uniquely identifies a single box or single group of boxes to a corrugator; an identification that associates a single box or single group of boxes with a corrugator plan; an indication of a location of a single box or single group of boxes on the printed web; and an instruction to cut and/or crease a single box or single group of boxes on the printed web. 3. The printing system of claim 1, where the multiple different layouts of boxes include multiple different size and/or shape boxes. 4. The printing system of claim 1, where the print engine controller is to:
receive graphics image data for each box; convert the graphics image data to graphics print data; and transmit the graphics print data to the print engine to print the graphics on the single web of box liner material, based on the graphics print data, together with the machine readable images. 5. The printing system of claim 4, where the print engine controller is to:
receive corrugator control image data for the machine readable images with corrugator control information for making the different layouts of boxes; convert the control information image data to control print data; and transmit the control print data to the print engine to print the machine readable images on the single web of box liner material, based on the control print data, together with the graphics. 6. The printing system of claim 5, where the print engine controller is to:
receive the control information image data and the graphics image data together as integrated image data; convert the integrated image data to integrated print data; and transmit the integrated print data to the print engine to print the graphics and the machine readable images on the single web of box liner material based on the integrated image data. 7. A non-transitory processor readable medium having image data thereon representing machine readable images with corrugator control information for making boxes with multiple different layouts from a single web of box liner material. 8. The medium of claim 7 having image data thereon representing graphics for each box to be printed on the single web of box liner material. 9. The medium of claim 7, where each machine readable image includes at least one of:
an identification that uniquely identifies a single box or single group of boxes to a corrugator; an identification that associates a single box or single group of boxes with a corrugator plan; an indication of a location of the a single box or single group of boxes on the printed web; and an instruction to cut and/or crease a single box or single group of boxes on the printed web. 10. The medium of claim 9, where:
the graphics includes multiple different graphics each for a single box or a single group of boxes different from any other box or group of boxes on the web; and the corrugator control information includes multiple single sets of corrugator control information each corresponding to the graphic for a single box different from any other box on the web. 11. A liner for making corrugated boxes, comprising a single substrate web printed with graphics for multiple different layouts of corrugated boxes to be lined with the web and with multiple different machine readable images representing corrugator control information for making the multiple different layouts of boxes. 12. The liner of claim 11, where each machine readable image includes an identification that uniquely identifies a single box or a single group of boxes to a corrugator. 13. The liner of claim 11, where each machine readable image includes an identification that associates a single box or a single group of boxes with a corrugation plan. 14. The liner of claim 11, where each machine readable image includes instructions to cut and crease a single box or single group of boxes on the printed web. 15. The liner of claim 11, where the multiple different layouts include different size and/or shape boxes with the same or different graphics. | In one example, a printing system includes a print engine and a print engine controller operatively connected to the print engine to print, on a single substrate web, graphics for multiple different layouts of corrugated boxes to be lined with the web and machine readable images representing corrugator control information for making the multiple different layouts.1. A printing system, comprising:
a print engine; and a print engine controller operatively connected to the print engine to print, on a single substrate web:
graphics for multiple different layouts of corrugated boxes to be lined with the web; and
machine readable images representing corrugator control information for making the multiple different layouts of boxes. 2. The printing system of claim 1, where each machine readable image representing corrugator control information includes at least one of:
an identification that uniquely identifies a single box or single group of boxes to a corrugator; an identification that associates a single box or single group of boxes with a corrugator plan; an indication of a location of a single box or single group of boxes on the printed web; and an instruction to cut and/or crease a single box or single group of boxes on the printed web. 3. The printing system of claim 1, where the multiple different layouts of boxes include multiple different size and/or shape boxes. 4. The printing system of claim 1, where the print engine controller is to:
receive graphics image data for each box; convert the graphics image data to graphics print data; and transmit the graphics print data to the print engine to print the graphics on the single web of box liner material, based on the graphics print data, together with the machine readable images. 5. The printing system of claim 4, where the print engine controller is to:
receive corrugator control image data for the machine readable images with corrugator control information for making the different layouts of boxes; convert the control information image data to control print data; and transmit the control print data to the print engine to print the machine readable images on the single web of box liner material, based on the control print data, together with the graphics. 6. The printing system of claim 5, where the print engine controller is to:
receive the control information image data and the graphics image data together as integrated image data; convert the integrated image data to integrated print data; and transmit the integrated print data to the print engine to print the graphics and the machine readable images on the single web of box liner material based on the integrated image data. 7. A non-transitory processor readable medium having image data thereon representing machine readable images with corrugator control information for making boxes with multiple different layouts from a single web of box liner material. 8. The medium of claim 7 having image data thereon representing graphics for each box to be printed on the single web of box liner material. 9. The medium of claim 7, where each machine readable image includes at least one of:
an identification that uniquely identifies a single box or single group of boxes to a corrugator; an identification that associates a single box or single group of boxes with a corrugator plan; an indication of a location of the a single box or single group of boxes on the printed web; and an instruction to cut and/or crease a single box or single group of boxes on the printed web. 10. The medium of claim 9, where:
the graphics includes multiple different graphics each for a single box or a single group of boxes different from any other box or group of boxes on the web; and the corrugator control information includes multiple single sets of corrugator control information each corresponding to the graphic for a single box different from any other box on the web. 11. A liner for making corrugated boxes, comprising a single substrate web printed with graphics for multiple different layouts of corrugated boxes to be lined with the web and with multiple different machine readable images representing corrugator control information for making the multiple different layouts of boxes. 12. The liner of claim 11, where each machine readable image includes an identification that uniquely identifies a single box or a single group of boxes to a corrugator. 13. The liner of claim 11, where each machine readable image includes an identification that associates a single box or a single group of boxes with a corrugation plan. 14. The liner of claim 11, where each machine readable image includes instructions to cut and crease a single box or single group of boxes on the printed web. 15. The liner of claim 11, where the multiple different layouts include different size and/or shape boxes with the same or different graphics. | 2,800 |
12,276 | 12,276 | 16,459,827 | 2,845 | The present disclosure relates to an antenna housing, comprising: a front housing having a front housing edge; and a back housing having a back housing edge, the front housing edge and the back housing edge engaging each other to assemble the front housing and the back housing together to form the antenna housing. The front housing edge and the back housing edge cooperate with each other to form a sealing interface, including: a first sealing member provided with a first sealing portion; and a second sealing member provided with a second sealing portion, the first sealing portion abutting against the second sealing portion when the front housing and the back housing are assembled so that a clearance fit is formed between the front housing edge and the back housing edge, wherein the second sealing member is further provided with a channel positioned inside the second sealing portion and extending parallel to the second sealing portion. | 1. An antenna housing, comprising:
a front housing having a front housing edge; and a back housing having a back housing edge, the front housing edge and the back housing edge engaged with each other to assemble the front housing and the back housing together to form the antenna housing, wherein the front housing edge and the back housing edge cooperate with each other to form a sealing interface including:
a first sealing member provided with a first sealing portion; and
a second sealing member provided with a second sealing portion, the first sealing portion abutting against the second sealing portion when the front housing and the back housing are assembled so that a clearance fit is formed between the front housing edge and the back housing edge,
wherein the second sealing member is further provided with a channel positioned inside the second sealing portion and extending parallel to the second sealing portion. 2. The antenna housing according to claim 1, wherein the front housing edge and the back housing edge are slidably engaged with each other. 3. The antenna housing according to claim 1, wherein the antenna housing defines a longitudinal direction, and the front housing edge and the back housing edge extend substantially parallel to the longitudinal direction. 4. The antenna housing according to claim 1, wherein the first sealing member is integrally formed with the front housing, and the second sealing member is integrally formed with the back housing. 5. The antenna housing according to any claim, 1 wherein the first sealing member and the front housing are made by pultrusion molding, and the second sealing member and the back housing are made by extrusion molding. 6. The antenna housing according to claim 1, wherein the first sealing portion is formed with a first abutment surface, the second sealing portion is formed with a second abutment surface, and when the front housing and the back housing are assembled, the first abutment surface and the second abutment surface contact each other. 7. The antenna housing according to claim 1, wherein when the front housing and the back housing are assembled, the front housing and the back housing contact each other merely through the first sealing portion and the second sealing portion. 8. The antenna housing according to claim 1, wherein the first sealing member is formed with an outer wall that extends from the first sealing portion, and when the front housing and the back housing are assembled, the outer wall is located outside the first sealing portion. 9. The antenna housing according to claim 1, wherein the second sealing member is formed with an inner wall, the channel being defined between said inner wall and the second sealing portion, and when the front housing and the back housing are assembled, a portion of the inner wall for defining said channel is located inside the second sealing portion and the channel. 10-11. (canceled) 12. The antenna housing according to claim 9, wherein the inner wall includes a first inner wall section, the channel being defined between said first inner wall section and the second sealing portion. 13. The antenna housing according to claim 12, wherein the inner wall further includes a second inner wall section serving as a stop element and configured to prevent, after the front housing and the back housing are assembled, the front housing and the back housing from being separated in a direction different from the direction in which the front housing and the back housing are assembled. 14. The antenna housing according to claim 13, wherein the second inner wall section extends at an angle relative to the first inner wall section so as to at least partially cover the first sealing member. 15. The antenna housing according to claim 14, wherein the first sealing member is provided with a portion corresponding to the second inner wall section, said portion being close to the second inner wall section. 16. The antenna housing according to claim 13, wherein the inner wall further includes a third inner wall section serving as a reinforcing element and configured to cooperate with the front housing to enhance the deformation resistance of the antenna housing. 17. (canceled) 18. The antenna housing according to claim 1, wherein the first sealing member is formed with an insertion portion which extends from the first sealing portion, and extends into the channel when the front housing and the back housing are assembled. 19. The antenna housing according to claim 18, wherein the insertion portion has a cross-sectional shape substantially corresponding to a cross-sectional shape of the channel, and has a cross-sectional area smaller than a cross-sectional area of the channel such that a gap is formed between the insertion portion and the channel. 20. The antenna housing according to claim 1, wherein the antenna housing further includes an end cap, which is engaged to end portions of the front housing and the back housing after the front housing and the back housing are assembled. 21. The antenna housing according to claim 20, wherein the end cap is provided with an orifice which is in fluid communication with the channel of the second sealing member. 22. The antenna housing according to claim 1, wherein the front housing is made of fiberglass, and the back housing is made of aluminum. 23. An antenna housing, comprising:
a front housing having a front housing edge; and a back housing having a back housing edge, the front housing edge and the back housing edge engaged with each other to assemble the front housing and the back housing together to form the antenna housing, wherein the front housing edge includes a longitudinally-extending U-shaped member and the back housing edge includes a longitudinally-extending rail that is received within the longitudinally-extending U-shaped member of the front housing edge, wherein a rearwardly facing surface of the longitudinally-extending U-shaped member of the front housing and a front surface of the longitudinally-extending rail cooperate with each other to form a sealing interface, wherein an open channel is positioned inside the longitudinally-extending rail. | The present disclosure relates to an antenna housing, comprising: a front housing having a front housing edge; and a back housing having a back housing edge, the front housing edge and the back housing edge engaging each other to assemble the front housing and the back housing together to form the antenna housing. The front housing edge and the back housing edge cooperate with each other to form a sealing interface, including: a first sealing member provided with a first sealing portion; and a second sealing member provided with a second sealing portion, the first sealing portion abutting against the second sealing portion when the front housing and the back housing are assembled so that a clearance fit is formed between the front housing edge and the back housing edge, wherein the second sealing member is further provided with a channel positioned inside the second sealing portion and extending parallel to the second sealing portion.1. An antenna housing, comprising:
a front housing having a front housing edge; and a back housing having a back housing edge, the front housing edge and the back housing edge engaged with each other to assemble the front housing and the back housing together to form the antenna housing, wherein the front housing edge and the back housing edge cooperate with each other to form a sealing interface including:
a first sealing member provided with a first sealing portion; and
a second sealing member provided with a second sealing portion, the first sealing portion abutting against the second sealing portion when the front housing and the back housing are assembled so that a clearance fit is formed between the front housing edge and the back housing edge,
wherein the second sealing member is further provided with a channel positioned inside the second sealing portion and extending parallel to the second sealing portion. 2. The antenna housing according to claim 1, wherein the front housing edge and the back housing edge are slidably engaged with each other. 3. The antenna housing according to claim 1, wherein the antenna housing defines a longitudinal direction, and the front housing edge and the back housing edge extend substantially parallel to the longitudinal direction. 4. The antenna housing according to claim 1, wherein the first sealing member is integrally formed with the front housing, and the second sealing member is integrally formed with the back housing. 5. The antenna housing according to any claim, 1 wherein the first sealing member and the front housing are made by pultrusion molding, and the second sealing member and the back housing are made by extrusion molding. 6. The antenna housing according to claim 1, wherein the first sealing portion is formed with a first abutment surface, the second sealing portion is formed with a second abutment surface, and when the front housing and the back housing are assembled, the first abutment surface and the second abutment surface contact each other. 7. The antenna housing according to claim 1, wherein when the front housing and the back housing are assembled, the front housing and the back housing contact each other merely through the first sealing portion and the second sealing portion. 8. The antenna housing according to claim 1, wherein the first sealing member is formed with an outer wall that extends from the first sealing portion, and when the front housing and the back housing are assembled, the outer wall is located outside the first sealing portion. 9. The antenna housing according to claim 1, wherein the second sealing member is formed with an inner wall, the channel being defined between said inner wall and the second sealing portion, and when the front housing and the back housing are assembled, a portion of the inner wall for defining said channel is located inside the second sealing portion and the channel. 10-11. (canceled) 12. The antenna housing according to claim 9, wherein the inner wall includes a first inner wall section, the channel being defined between said first inner wall section and the second sealing portion. 13. The antenna housing according to claim 12, wherein the inner wall further includes a second inner wall section serving as a stop element and configured to prevent, after the front housing and the back housing are assembled, the front housing and the back housing from being separated in a direction different from the direction in which the front housing and the back housing are assembled. 14. The antenna housing according to claim 13, wherein the second inner wall section extends at an angle relative to the first inner wall section so as to at least partially cover the first sealing member. 15. The antenna housing according to claim 14, wherein the first sealing member is provided with a portion corresponding to the second inner wall section, said portion being close to the second inner wall section. 16. The antenna housing according to claim 13, wherein the inner wall further includes a third inner wall section serving as a reinforcing element and configured to cooperate with the front housing to enhance the deformation resistance of the antenna housing. 17. (canceled) 18. The antenna housing according to claim 1, wherein the first sealing member is formed with an insertion portion which extends from the first sealing portion, and extends into the channel when the front housing and the back housing are assembled. 19. The antenna housing according to claim 18, wherein the insertion portion has a cross-sectional shape substantially corresponding to a cross-sectional shape of the channel, and has a cross-sectional area smaller than a cross-sectional area of the channel such that a gap is formed between the insertion portion and the channel. 20. The antenna housing according to claim 1, wherein the antenna housing further includes an end cap, which is engaged to end portions of the front housing and the back housing after the front housing and the back housing are assembled. 21. The antenna housing according to claim 20, wherein the end cap is provided with an orifice which is in fluid communication with the channel of the second sealing member. 22. The antenna housing according to claim 1, wherein the front housing is made of fiberglass, and the back housing is made of aluminum. 23. An antenna housing, comprising:
a front housing having a front housing edge; and a back housing having a back housing edge, the front housing edge and the back housing edge engaged with each other to assemble the front housing and the back housing together to form the antenna housing, wherein the front housing edge includes a longitudinally-extending U-shaped member and the back housing edge includes a longitudinally-extending rail that is received within the longitudinally-extending U-shaped member of the front housing edge, wherein a rearwardly facing surface of the longitudinally-extending U-shaped member of the front housing and a front surface of the longitudinally-extending rail cooperate with each other to form a sealing interface, wherein an open channel is positioned inside the longitudinally-extending rail. | 2,800 |
12,277 | 12,277 | 14,704,044 | 2,828 | Various semiconductor chip and interposer devices are disclosed. In one aspect, an apparatus is provided that includes an interposer, a first semiconductor chip mounted on the interposer and a second semiconductor chip mounted on and electrically connected to the first semiconductor chip by the interposer. The second semiconductor chip includes offloaded logic of the first semiconductor chip. | 1. An apparatus, comprising:
an interposer; a first semiconductor chip mounted on the interposer; and a second semiconductor chip mounted on, and electrically connected to the first semiconductor chip by the interposer, the second semiconductor chip including offloaded logic of the first semiconductor chip. 2. The apparatus of claim 1, wherein the offloaded logic comprises a part of a data path of the first semiconductor chip. 3. The apparatus of claim 1, wherein the offloaded logic comprises a DFT circuit operable to test an aspect of the first semiconductor chip. 4. The apparatus of claim 1, comprising a third semiconductor chip mounted on the interposer. 5. The apparatus of claim 1, comprising an ATE connected to the interposer. 6. The apparatus of claim 1, comprising an electronic device, the interposer being mounted on or in the electronic device. 7. The apparatus of claim 1, wherein the first semiconductor chip comprises circuits of a first process node and the offloaded logic comprises circuits of a second process node of larger geometry than the first process node. 8. A method of manufacturing, comprising:
providing a first semiconductor chip; providing a second semiconductor chip, the second semiconductor chip including offloaded logic of the first semiconductor chip; and electrically connecting the first semiconductor chip to the second semiconductor chip. 9. The method of claim 8, comprising mounting the first semiconductor chip and the second semiconductor chip to an interposer, the interposer electrically connecting the first semiconductor chip to the second semiconductor chip. 10. The method of claim 9, comprising a third semiconductor chip mounted on the interposer. 11. The method of claim 8, wherein the offloaded logic comprises a part of a data path of the first semiconductor chip. 12. The method of claim 8, wherein the offloaded logic comprises a DFT circuit operable to test an aspect of the first semiconductor chip. 13. The method of claim 8, comprising connecting the first semiconductor chip to an ATE. 14. The method of claim 8, comprising mounting the first semiconductor chip and the second semiconductor chip on or in an electronic device. 15. A method of manufacturing, comprising:
fabricating a first semiconductor chip; and fabricating a second semiconductor chip, the second semiconductor chip including offloaded logic of the first semiconductor chip. 16. The method of claim 15, comprising electrically connecting the first semiconductor chip and the second semiconductor chip. 17. The method of claim 16, comprising mounting the first semiconductor chip and the second semiconductor chip on an interposer, the interposer electrically connecting the first semiconductor chip to the second semiconductor chip. 18. The method of claim 15, wherein the offloaded logic comprises a part of a data path of the first semiconductor chip. 19. The method of claim 15, wherein the offloaded logic comprises a DFT circuit operable to test an aspect of the first semiconductor chip. 20. The method of claim 15, comprising connecting the first semiconductor chip to an ATE. 21. The method of claim 15, comprising mounting the first semiconductor chip and the second semiconductor chip on or in an electronic device. | Various semiconductor chip and interposer devices are disclosed. In one aspect, an apparatus is provided that includes an interposer, a first semiconductor chip mounted on the interposer and a second semiconductor chip mounted on and electrically connected to the first semiconductor chip by the interposer. The second semiconductor chip includes offloaded logic of the first semiconductor chip.1. An apparatus, comprising:
an interposer; a first semiconductor chip mounted on the interposer; and a second semiconductor chip mounted on, and electrically connected to the first semiconductor chip by the interposer, the second semiconductor chip including offloaded logic of the first semiconductor chip. 2. The apparatus of claim 1, wherein the offloaded logic comprises a part of a data path of the first semiconductor chip. 3. The apparatus of claim 1, wherein the offloaded logic comprises a DFT circuit operable to test an aspect of the first semiconductor chip. 4. The apparatus of claim 1, comprising a third semiconductor chip mounted on the interposer. 5. The apparatus of claim 1, comprising an ATE connected to the interposer. 6. The apparatus of claim 1, comprising an electronic device, the interposer being mounted on or in the electronic device. 7. The apparatus of claim 1, wherein the first semiconductor chip comprises circuits of a first process node and the offloaded logic comprises circuits of a second process node of larger geometry than the first process node. 8. A method of manufacturing, comprising:
providing a first semiconductor chip; providing a second semiconductor chip, the second semiconductor chip including offloaded logic of the first semiconductor chip; and electrically connecting the first semiconductor chip to the second semiconductor chip. 9. The method of claim 8, comprising mounting the first semiconductor chip and the second semiconductor chip to an interposer, the interposer electrically connecting the first semiconductor chip to the second semiconductor chip. 10. The method of claim 9, comprising a third semiconductor chip mounted on the interposer. 11. The method of claim 8, wherein the offloaded logic comprises a part of a data path of the first semiconductor chip. 12. The method of claim 8, wherein the offloaded logic comprises a DFT circuit operable to test an aspect of the first semiconductor chip. 13. The method of claim 8, comprising connecting the first semiconductor chip to an ATE. 14. The method of claim 8, comprising mounting the first semiconductor chip and the second semiconductor chip on or in an electronic device. 15. A method of manufacturing, comprising:
fabricating a first semiconductor chip; and fabricating a second semiconductor chip, the second semiconductor chip including offloaded logic of the first semiconductor chip. 16. The method of claim 15, comprising electrically connecting the first semiconductor chip and the second semiconductor chip. 17. The method of claim 16, comprising mounting the first semiconductor chip and the second semiconductor chip on an interposer, the interposer electrically connecting the first semiconductor chip to the second semiconductor chip. 18. The method of claim 15, wherein the offloaded logic comprises a part of a data path of the first semiconductor chip. 19. The method of claim 15, wherein the offloaded logic comprises a DFT circuit operable to test an aspect of the first semiconductor chip. 20. The method of claim 15, comprising connecting the first semiconductor chip to an ATE. 21. The method of claim 15, comprising mounting the first semiconductor chip and the second semiconductor chip on or in an electronic device. | 2,800 |
12,278 | 12,278 | 15,532,482 | 2,857 | The invention relates to a process for manufacturing parts that is based on the simultaneous analysis of a plurality of different statistical indicators representative of a characteristic size of the parts, in which: an overall validation set corresponding to a set-theoretic combination of the various validation sets of each statistical indicator is defined; an overall sanction set corresponding to a set-theoretic combination of the various sanction sets of each statistical indicator is defined; and an overall control set comprising the pairs (μ;σ) not contained in the overall validation set and in the overall sanction set is defined; and it is determined to which overall set, from the overall validation set, the overall sanction set and the overall control set, the pair comprising the mean μm and the standard deviation σm of the measured characteristic size belongs, and the manufacture is controlled depending on the overall set thus determined. | 1. A method for manufacturing parts produced with a manufacturing device, based on simultaneous analysis of several different statistical indicators representative of a characteristic dimension of the parts, where:
Each statistical indicator is calculated from an average μ and a standard deviation σ of the measured characteristic dimension over several parts, each statistical indicator being associated with a first reference value and a second reference value greater than the first reference value, defining:
a validation set comprising the couples (μ;σ) where the statistical indicator is greater than or equal to the second reference value;
a sanction set comprising the couples (μ;σ) where the statistical indicator is less than or equal to the first reference value; and
a control set comprising the couples (μ;σ) where the statistical indicator is between the first reference value and the second reference value;
The following are defined:
an overall validation set corresponding to a setrelated combination of the different validation sets of each statistical indicator;
an overall sanction set corresponding to a setrelated combination of the different sanction sets of each statistical indicator;
an overall control set comprising the couples (μ;σ) not included in the overall validation set and in the overall sanction set;
a sample comprising several parts is taken from the parts produced by the manufacturing device, the characteristic dimension of each part of the sample is measured, and an average μm and a standard deviation σm of the measured characteristic dimension are calculated for the sample taken; which overall set among the overall validation set, the overall sanction set and the overall control set the couple comprising the average μm and the standard deviation σm of the measured characteristic dimension belongs to is determined, and the manufacturing is operated as a function of the overall set determined in this way. 2. The method as claimed in claim 1, in which determination of the overall set to which the couple comprising the average μm and the standard deviation σm of the measured characteristic dimension belongs is done visually, where:
the couple comprising the average μm and the standard deviation σm of the measured characteristic dimension is represented on a regulating graphic (μ;σ) having as abscissa the average μ and as ordinate the standard deviation σ of the representative dimension, on which is displayed:
a graphic validation zone comprising the couples (μ;σ) of the overall validation set;
a graphic sanction zone comprising the couples (μ;σ) of the overall sanction set;
a graphic control zone comprising the couples (μ;σ) of the overall control set;
The overall associated set is determined as a function of the graphic zone inside, which is said couple. 3. The method as claimed in claim 2, in which several samples are taken at different moments, the different couples comprising the average μm and the standard deviation σm of the characteristic dimensions measured for the samples having a representation on the regulating graphic (μ;σ) varying as a function of the moment when the sample has been taken. 4. The method as claimed in claim 2, in which the regulating graphic (μ;σ) is displayed on a monitor. 5. The method as claimed in claim 1, in which the overall validation set corresponds to an intersection of the different validation sets of each statistical indicator, and the overall sanction set corresponds to grouping of the different sanction sets of each statistical indicator. 6. The method as claimed in claim 1, in which the overall validation set corresponds to grouping of the different validation sets of each statistical indicator, and the overall sanction set corresponds to an intersection of the different sanction sets of each statistical indicator. 7. The method as claimed in claim 1, in which three different statistical indicators are analysed, respectively called first statistical indicator, second statistical indicator, and third statistical indicator, where:
the overall validation set corresponds to the grouping of the validation set of the first statistical indicator with the intersection between the validation set of the second statistical indicator and the validation set of the third statistical indicator; and the overall sanction set corresponds to the intersection between the validation set of the first statistical indicator and the grouping of the validation set of the second statistical indicator with the validation set of the third statistical indicator. 8. The method as claimed in claim 7, in which:
the first statistical indicator is a first capability index Cpk defined by the formula:
Cpk
=
Min
(
TS
-
µ
;
µ
-
TI
)
3
σ
the second statistical indicator is a second capability index Cp defined by the formula:
Cp
=
(
TS
-
TI
)
/
2
3
σ
the third statistical indicator is a centring coefficient Cc defined by the formula:
Cc
=
µ
(
TS
-
TI
)
/
2
where:
TS is a greater tolerance of the measured characteristic dimension;
TI is a lesser tolerance of the measured characteristic dimension. 9. A method for manufacturing parts produced with a manufacturing device, based on simultaneous analysis of several different statistical indicators representative of a characteristic dimension of the parts, where:
Each statistical indicator is calculated from an average μ and a standard deviation σ of the measured characteristic dimension over several parts, each statistical indicator being associated with a first reference value and a second reference value greater than the first reference value, defining:
a validation set comprising the couples (μ;σ) where the statistical indicator is greater than or equal to the second reference value;
a sanction set comprising the couples (μ;σ) where the statistical indicator is less than or equal to the first reference value; and
a control set comprising the couples (μ;σ) where the statistical indicator is between the first reference value and the second reference value;
The following are defined:
an overall validation set corresponding to a setrelated combination of the different validation sets of each statistical indicator;
an overall sanction set corresponding to a setrelated combination of the different sanction sets of each statistical indicator;
an overall control set comprising the couples (μ;σ) not included in the overall validation set and in the overall sanction set;
a sample comprising several parts is taken from the parts produced by the manufacturing device, the characteristic dimension of each part of the sample is measured, and an average μm and a standard deviation σm of the measured characteristic dimension are calculated for the sample taken; which overall set among the overall validation set, the overall sanction set and the overall control set the couple comprising the average μm and the standard deviation σm of the measured characteristic dimension belongs to is determined, and the manufacturing is operated as a function of the overall set determined in this way, such that:
if it is determined that the couple comprising the average μm and the standard deviation σm of the measured characteristic dimension belongs to the overall validation set, the manufacturing conditions of the parts are not modified;
if it is determined that the couple comprising the average μm and the standard deviation σm of the measured characteristic dimension belongs to the overall sanction set, the manufacturing of the parts is discontinued; and
if it is determined that the couple comprising the average μm and the standard deviation σm of the measured characteristic dimension belongs to the overall control set, the manufacturing conditions of the parts are adjusted by adjusting the regulating parameters of the manufacturing device. | The invention relates to a process for manufacturing parts that is based on the simultaneous analysis of a plurality of different statistical indicators representative of a characteristic size of the parts, in which: an overall validation set corresponding to a set-theoretic combination of the various validation sets of each statistical indicator is defined; an overall sanction set corresponding to a set-theoretic combination of the various sanction sets of each statistical indicator is defined; and an overall control set comprising the pairs (μ;σ) not contained in the overall validation set and in the overall sanction set is defined; and it is determined to which overall set, from the overall validation set, the overall sanction set and the overall control set, the pair comprising the mean μm and the standard deviation σm of the measured characteristic size belongs, and the manufacture is controlled depending on the overall set thus determined.1. A method for manufacturing parts produced with a manufacturing device, based on simultaneous analysis of several different statistical indicators representative of a characteristic dimension of the parts, where:
Each statistical indicator is calculated from an average μ and a standard deviation σ of the measured characteristic dimension over several parts, each statistical indicator being associated with a first reference value and a second reference value greater than the first reference value, defining:
a validation set comprising the couples (μ;σ) where the statistical indicator is greater than or equal to the second reference value;
a sanction set comprising the couples (μ;σ) where the statistical indicator is less than or equal to the first reference value; and
a control set comprising the couples (μ;σ) where the statistical indicator is between the first reference value and the second reference value;
The following are defined:
an overall validation set corresponding to a setrelated combination of the different validation sets of each statistical indicator;
an overall sanction set corresponding to a setrelated combination of the different sanction sets of each statistical indicator;
an overall control set comprising the couples (μ;σ) not included in the overall validation set and in the overall sanction set;
a sample comprising several parts is taken from the parts produced by the manufacturing device, the characteristic dimension of each part of the sample is measured, and an average μm and a standard deviation σm of the measured characteristic dimension are calculated for the sample taken; which overall set among the overall validation set, the overall sanction set and the overall control set the couple comprising the average μm and the standard deviation σm of the measured characteristic dimension belongs to is determined, and the manufacturing is operated as a function of the overall set determined in this way. 2. The method as claimed in claim 1, in which determination of the overall set to which the couple comprising the average μm and the standard deviation σm of the measured characteristic dimension belongs is done visually, where:
the couple comprising the average μm and the standard deviation σm of the measured characteristic dimension is represented on a regulating graphic (μ;σ) having as abscissa the average μ and as ordinate the standard deviation σ of the representative dimension, on which is displayed:
a graphic validation zone comprising the couples (μ;σ) of the overall validation set;
a graphic sanction zone comprising the couples (μ;σ) of the overall sanction set;
a graphic control zone comprising the couples (μ;σ) of the overall control set;
The overall associated set is determined as a function of the graphic zone inside, which is said couple. 3. The method as claimed in claim 2, in which several samples are taken at different moments, the different couples comprising the average μm and the standard deviation σm of the characteristic dimensions measured for the samples having a representation on the regulating graphic (μ;σ) varying as a function of the moment when the sample has been taken. 4. The method as claimed in claim 2, in which the regulating graphic (μ;σ) is displayed on a monitor. 5. The method as claimed in claim 1, in which the overall validation set corresponds to an intersection of the different validation sets of each statistical indicator, and the overall sanction set corresponds to grouping of the different sanction sets of each statistical indicator. 6. The method as claimed in claim 1, in which the overall validation set corresponds to grouping of the different validation sets of each statistical indicator, and the overall sanction set corresponds to an intersection of the different sanction sets of each statistical indicator. 7. The method as claimed in claim 1, in which three different statistical indicators are analysed, respectively called first statistical indicator, second statistical indicator, and third statistical indicator, where:
the overall validation set corresponds to the grouping of the validation set of the first statistical indicator with the intersection between the validation set of the second statistical indicator and the validation set of the third statistical indicator; and the overall sanction set corresponds to the intersection between the validation set of the first statistical indicator and the grouping of the validation set of the second statistical indicator with the validation set of the third statistical indicator. 8. The method as claimed in claim 7, in which:
the first statistical indicator is a first capability index Cpk defined by the formula:
Cpk
=
Min
(
TS
-
µ
;
µ
-
TI
)
3
σ
the second statistical indicator is a second capability index Cp defined by the formula:
Cp
=
(
TS
-
TI
)
/
2
3
σ
the third statistical indicator is a centring coefficient Cc defined by the formula:
Cc
=
µ
(
TS
-
TI
)
/
2
where:
TS is a greater tolerance of the measured characteristic dimension;
TI is a lesser tolerance of the measured characteristic dimension. 9. A method for manufacturing parts produced with a manufacturing device, based on simultaneous analysis of several different statistical indicators representative of a characteristic dimension of the parts, where:
Each statistical indicator is calculated from an average μ and a standard deviation σ of the measured characteristic dimension over several parts, each statistical indicator being associated with a first reference value and a second reference value greater than the first reference value, defining:
a validation set comprising the couples (μ;σ) where the statistical indicator is greater than or equal to the second reference value;
a sanction set comprising the couples (μ;σ) where the statistical indicator is less than or equal to the first reference value; and
a control set comprising the couples (μ;σ) where the statistical indicator is between the first reference value and the second reference value;
The following are defined:
an overall validation set corresponding to a setrelated combination of the different validation sets of each statistical indicator;
an overall sanction set corresponding to a setrelated combination of the different sanction sets of each statistical indicator;
an overall control set comprising the couples (μ;σ) not included in the overall validation set and in the overall sanction set;
a sample comprising several parts is taken from the parts produced by the manufacturing device, the characteristic dimension of each part of the sample is measured, and an average μm and a standard deviation σm of the measured characteristic dimension are calculated for the sample taken; which overall set among the overall validation set, the overall sanction set and the overall control set the couple comprising the average μm and the standard deviation σm of the measured characteristic dimension belongs to is determined, and the manufacturing is operated as a function of the overall set determined in this way, such that:
if it is determined that the couple comprising the average μm and the standard deviation σm of the measured characteristic dimension belongs to the overall validation set, the manufacturing conditions of the parts are not modified;
if it is determined that the couple comprising the average μm and the standard deviation σm of the measured characteristic dimension belongs to the overall sanction set, the manufacturing of the parts is discontinued; and
if it is determined that the couple comprising the average μm and the standard deviation σm of the measured characteristic dimension belongs to the overall control set, the manufacturing conditions of the parts are adjusted by adjusting the regulating parameters of the manufacturing device. | 2,800 |
12,279 | 12,279 | 16,312,496 | 2,894 | There is provided a nitride semiconductor laminate, including: a substrate; an electron transit layer provided on the substrate and containing a group III nitride semiconductor; and an electron supply layer provided on the electron transit layer and containing a group III nitride semiconductor, wherein a surface force A of the electron supply layer acting as an attractive force for attracting a probe and a surface of the electron supply layer when measured using the probe consisting of a glass sphere with a diameter of 1 mm covered with Cr, is stronger than a surface force B of Pt when measured under the same condition, and an absolute value |A−B| of a difference between them is 30 μN or more. | 1. A nitride semiconductor laminate, comprising:
a substrate; an electron transit layer provided on the substrate and containing a group III nitride semiconductor; and an electron supply layer provided on the electron transit layer and containing a group III nitride semiconductor, wherein a surface force A of the electron supply layer acting as an attractive force for attracting a probe and a surface of the electron supply layer when measured using the probe consisting of a glass sphere with a diameter of 1 mm covered with Cr, is stronger than a surface force B of Pt when measured under the same condition, and an absolute value |A−B| of a difference between them is 30 μN or more. 2. The nitride semiconductor laminate according to claim 1, wherein an absolute value |A−B| of the difference between the surface force of the electron supply layer and the surface force of Pt is 45 μN or more. 3. A method for manufacturing a nitride semiconductor laminate, comprising:
forming an electron transit layer containing a group III nitride semiconductor on a substrate; and forming an electron supply layer containing a group III nitride semiconductor on the electron transit layer, wherein in forming the electron supply layer, the electron supply layer is formed so that a surface force A of the electron supply layer acting as an attractive force for attracting a probe and a surface of the electron supply layer when measured using the probe consisting of a glass sphere with a diameter of 1 mm covered with Cr, is stronger than a surface force B of Pt when measured under the same condition, and an absolute value |A−B| of a difference between them is 30 μN or more. 4. The method for manufacturing a nitride semiconductor laminate according to claim 3, wherein in forming the electron supply layer, a cooling rate at the time of lowering a temperature of the substrate from a growth temperature of the electron supply layer is 1.0° C./s or more. 5. The method for manufacturing a nitride semiconductor laminate according to claim 4, wherein in forming the electron supply layer, the cooling rate is 1.5° C./s or more. 6. The method for manufacturing a nitride semiconductor laminate according to claim 3, wherein in forming the electron supply layer, hydrogen gas or helium gas is supplied to a surface of the electron supply layer, when the temperature of the substrate is lowered from the growth temperature of the electron supply layer. 7. A method for manufacturing a nitride semiconductor laminate, comprising:
forming an electron transit layer containing a group III nitride semiconductor on a substrate; forming the electron supply layer containing a group III nitride semiconductor on the electron transit layer; and modifying a surface of the electron supply layer, wherein in modifying the surface of the electron supply layer, the surface of the electron supply layer is modified so that a surface force A of the electron supply layer acting as an attractive force for attracting a probe and a surface of the electron supply layer when measured using the probe consisting of a glass sphere with a diameter of 1 mm covered with Cr, is stronger than a surface force B of Pt when measured under the same condition, and an absolute value |A−B| of a difference between them is 30 μN or more. 8. The method for manufacturing a nitride semiconductor laminate according to claim 7, wherein in modifying the surface of the electron supply layer, predetermined plasma treatment, UV ozone treatment, or ion implantation of hydrogen ions is applied to the surface of the electron supply layer. 9. A method for manufacturing a semiconductor laminate, comprising:
sequentially forming an electron transit layer and an electron supply layer on a substrate, thereby forming a semiconductor laminate having the electron transit layer and the electron supply layer; measuring a surface force of the electron supply layer acting between a probe and a surface of the electron supply layer by using a predetermined probe; and selecting the semiconductor laminate based on the surface force of the electron supply layer. 10. The method for manufacturing a semiconductor laminate according to claim 9,
wherein in forming the semiconductor laminate, the electron transit layer and the electron supply layer each contains a group III nitride semiconductor, and in measuring the surface force of the electron supply layer, measuring a surface force A of the electron supply layer acting as an attractive force for attracting the probe and a surface of the electron supply layer by using the probe consisting of a glass sphere with a diameter of 1 mm covered with Cr; and in selecting the semiconductor laminate, the semiconductor laminate is selected, in which the surface force A of the electron supply layer is stronger than a surface force B of Pt when measured under the same condition, and an absolute value |A−B| of a difference between them is 30 μN or more. 11. A method for inspecting a semiconductor laminate, for inspecting a semiconductor laminate in which an electron transit layer and an electron supply layer are sequentially provided on a substrate, the method comprising:
measuring a surface force of the electron supply layer acting between a probe and a surface of the electron supply layer by using a predetermined probe; and selecting the semiconductor laminate based on the surface force of the electron supply layer. | There is provided a nitride semiconductor laminate, including: a substrate; an electron transit layer provided on the substrate and containing a group III nitride semiconductor; and an electron supply layer provided on the electron transit layer and containing a group III nitride semiconductor, wherein a surface force A of the electron supply layer acting as an attractive force for attracting a probe and a surface of the electron supply layer when measured using the probe consisting of a glass sphere with a diameter of 1 mm covered with Cr, is stronger than a surface force B of Pt when measured under the same condition, and an absolute value |A−B| of a difference between them is 30 μN or more.1. A nitride semiconductor laminate, comprising:
a substrate; an electron transit layer provided on the substrate and containing a group III nitride semiconductor; and an electron supply layer provided on the electron transit layer and containing a group III nitride semiconductor, wherein a surface force A of the electron supply layer acting as an attractive force for attracting a probe and a surface of the electron supply layer when measured using the probe consisting of a glass sphere with a diameter of 1 mm covered with Cr, is stronger than a surface force B of Pt when measured under the same condition, and an absolute value |A−B| of a difference between them is 30 μN or more. 2. The nitride semiconductor laminate according to claim 1, wherein an absolute value |A−B| of the difference between the surface force of the electron supply layer and the surface force of Pt is 45 μN or more. 3. A method for manufacturing a nitride semiconductor laminate, comprising:
forming an electron transit layer containing a group III nitride semiconductor on a substrate; and forming an electron supply layer containing a group III nitride semiconductor on the electron transit layer, wherein in forming the electron supply layer, the electron supply layer is formed so that a surface force A of the electron supply layer acting as an attractive force for attracting a probe and a surface of the electron supply layer when measured using the probe consisting of a glass sphere with a diameter of 1 mm covered with Cr, is stronger than a surface force B of Pt when measured under the same condition, and an absolute value |A−B| of a difference between them is 30 μN or more. 4. The method for manufacturing a nitride semiconductor laminate according to claim 3, wherein in forming the electron supply layer, a cooling rate at the time of lowering a temperature of the substrate from a growth temperature of the electron supply layer is 1.0° C./s or more. 5. The method for manufacturing a nitride semiconductor laminate according to claim 4, wherein in forming the electron supply layer, the cooling rate is 1.5° C./s or more. 6. The method for manufacturing a nitride semiconductor laminate according to claim 3, wherein in forming the electron supply layer, hydrogen gas or helium gas is supplied to a surface of the electron supply layer, when the temperature of the substrate is lowered from the growth temperature of the electron supply layer. 7. A method for manufacturing a nitride semiconductor laminate, comprising:
forming an electron transit layer containing a group III nitride semiconductor on a substrate; forming the electron supply layer containing a group III nitride semiconductor on the electron transit layer; and modifying a surface of the electron supply layer, wherein in modifying the surface of the electron supply layer, the surface of the electron supply layer is modified so that a surface force A of the electron supply layer acting as an attractive force for attracting a probe and a surface of the electron supply layer when measured using the probe consisting of a glass sphere with a diameter of 1 mm covered with Cr, is stronger than a surface force B of Pt when measured under the same condition, and an absolute value |A−B| of a difference between them is 30 μN or more. 8. The method for manufacturing a nitride semiconductor laminate according to claim 7, wherein in modifying the surface of the electron supply layer, predetermined plasma treatment, UV ozone treatment, or ion implantation of hydrogen ions is applied to the surface of the electron supply layer. 9. A method for manufacturing a semiconductor laminate, comprising:
sequentially forming an electron transit layer and an electron supply layer on a substrate, thereby forming a semiconductor laminate having the electron transit layer and the electron supply layer; measuring a surface force of the electron supply layer acting between a probe and a surface of the electron supply layer by using a predetermined probe; and selecting the semiconductor laminate based on the surface force of the electron supply layer. 10. The method for manufacturing a semiconductor laminate according to claim 9,
wherein in forming the semiconductor laminate, the electron transit layer and the electron supply layer each contains a group III nitride semiconductor, and in measuring the surface force of the electron supply layer, measuring a surface force A of the electron supply layer acting as an attractive force for attracting the probe and a surface of the electron supply layer by using the probe consisting of a glass sphere with a diameter of 1 mm covered with Cr; and in selecting the semiconductor laminate, the semiconductor laminate is selected, in which the surface force A of the electron supply layer is stronger than a surface force B of Pt when measured under the same condition, and an absolute value |A−B| of a difference between them is 30 μN or more. 11. A method for inspecting a semiconductor laminate, for inspecting a semiconductor laminate in which an electron transit layer and an electron supply layer are sequentially provided on a substrate, the method comprising:
measuring a surface force of the electron supply layer acting between a probe and a surface of the electron supply layer by using a predetermined probe; and selecting the semiconductor laminate based on the surface force of the electron supply layer. | 2,800 |
12,280 | 12,280 | 16,271,330 | 2,838 | A generator system can include a generator configured to produce an output of alternating current (AC), a rectifier connected to the generator to rectify the AC into direct current (DC) rectifier output, an inverter connected to the rectifier to receive the DC rectifier output and configured to output three phase AC inverter output, and a plurality of output lines connected to the inverter to receive the three phase AC inverter output. The system can include a control module configured to control the output of the inverter. The control module can be operatively connected to one or more of the output lines via one or more local sense leads to receive a local feedback. The control module can be configured to control the inverter as a function of the local feedback to provide one or more of protection, voltage regulation, or harmonic correction. | 1. A generator system, comprising:
a generator configured to produce an output of alternating current (AC); a rectifier connected to the generator to rectify the AC into direct current (DC) rectifier output; an inverter connected to the rectifier to receive the DC rectifier output and configured to output three phase AC inverter output; a plurality of output lines connected to the inverter to receive the three phase AC inverter output; and a control module configured to control the output of the inverter, wherein the control module is operatively connected to one or more of the output lines via one or more local sense leads to receive a local feedback, wherein the control module is configured to control the inverter as a function of the local feedback to provide one or more of protection, voltage regulation, or harmonic correction, wherein the control module is also connected to one or more point of reference (POR) leads configured to be connected to a POR on a plurality of load input lines of a load to provide POR feedback to the control module, wherein the control module is configured to adjust the inverter output to account for voltage drops between the one or more output lines and the one or more input lines or due to a contactor between the one or more input and output lines as a function of the POR feedback, wherein the control module includes an RMS creation module configured to receive a POR feedback voltage in a wave form and to convert the POR feedback into an RMS value. 2-4. (canceled) 5. The system of claim 41, wherein the control module includes an RMS reference module configured to output an RMS reference. 6. The system of claim 5, wherein the control module includes a voltage reference generation module operatively connected to the RMS creation module and the RMS reference module to compare the RMS value to the RMS reference to determine a voltage drop at the POR. 7. The system of claim 6, wherein the control module includes a protection control module configured to receive the POR feedback current and local feedback voltage and current to protect the inverter and/or the load from overvoltage or overcurrent. 8. The system of claim 1, wherein the control module includes an inverter control module having an output voltage harmonic regulator module configured to receive the local feedback and remove harmonics from the inverter output. 9. A controller for a generator system, comprising:
a control module configured to control output of an inverter, wherein the control module is configured to be operatively connected to one or more output lines of the generator system via one or more local sense leads to receive a local feedback, wherein the control module is configured to control the inverter as a function of the local feedback to provide one or more of protection, voltage regulation, or harmonic correction, wherein the control module is configured to be connected to one or more point of reference (POR) leads configured to be connected to a POR on a plurality of load input lines of a load to provide POR feedback to the control module, wherein the control module is configured to adjust the inverter output to account for voltage drops between the one or more output lines and the one or more input lines or due to a contactor between the one or more input and output lines as a function of the POR feedback, wherein the control module includes an RMS creation module configured to receive a POR feedback voltage in a wave form and to convert the POR feedback into an RMS value. 10-12. (canceled) 13. The controller of claim 9, wherein the control module includes an RMS reference module configured to output an RMS reference. 14. The controller of claim 13, wherein the control module includes a voltage reference generation module operatively connected to the RMS creation module and the RMS reference module to compare the RMS value to the RMS reference to determine a voltage drop at the POR. 15. The controller of claim 14, wherein the control module includes a protection control module configured to receive the POR feedback current and local feedback voltage and current to protect the inverter and/or the load from overvoltage or overcurrent. 16. The controller of claim 9, wherein the control module includes an inverter control module having an output voltage harmonic regulator module configured to receive the local feedback and remove harmonics from the inverter output. 17-19. (canceled) | A generator system can include a generator configured to produce an output of alternating current (AC), a rectifier connected to the generator to rectify the AC into direct current (DC) rectifier output, an inverter connected to the rectifier to receive the DC rectifier output and configured to output three phase AC inverter output, and a plurality of output lines connected to the inverter to receive the three phase AC inverter output. The system can include a control module configured to control the output of the inverter. The control module can be operatively connected to one or more of the output lines via one or more local sense leads to receive a local feedback. The control module can be configured to control the inverter as a function of the local feedback to provide one or more of protection, voltage regulation, or harmonic correction.1. A generator system, comprising:
a generator configured to produce an output of alternating current (AC); a rectifier connected to the generator to rectify the AC into direct current (DC) rectifier output; an inverter connected to the rectifier to receive the DC rectifier output and configured to output three phase AC inverter output; a plurality of output lines connected to the inverter to receive the three phase AC inverter output; and a control module configured to control the output of the inverter, wherein the control module is operatively connected to one or more of the output lines via one or more local sense leads to receive a local feedback, wherein the control module is configured to control the inverter as a function of the local feedback to provide one or more of protection, voltage regulation, or harmonic correction, wherein the control module is also connected to one or more point of reference (POR) leads configured to be connected to a POR on a plurality of load input lines of a load to provide POR feedback to the control module, wherein the control module is configured to adjust the inverter output to account for voltage drops between the one or more output lines and the one or more input lines or due to a contactor between the one or more input and output lines as a function of the POR feedback, wherein the control module includes an RMS creation module configured to receive a POR feedback voltage in a wave form and to convert the POR feedback into an RMS value. 2-4. (canceled) 5. The system of claim 41, wherein the control module includes an RMS reference module configured to output an RMS reference. 6. The system of claim 5, wherein the control module includes a voltage reference generation module operatively connected to the RMS creation module and the RMS reference module to compare the RMS value to the RMS reference to determine a voltage drop at the POR. 7. The system of claim 6, wherein the control module includes a protection control module configured to receive the POR feedback current and local feedback voltage and current to protect the inverter and/or the load from overvoltage or overcurrent. 8. The system of claim 1, wherein the control module includes an inverter control module having an output voltage harmonic regulator module configured to receive the local feedback and remove harmonics from the inverter output. 9. A controller for a generator system, comprising:
a control module configured to control output of an inverter, wherein the control module is configured to be operatively connected to one or more output lines of the generator system via one or more local sense leads to receive a local feedback, wherein the control module is configured to control the inverter as a function of the local feedback to provide one or more of protection, voltage regulation, or harmonic correction, wherein the control module is configured to be connected to one or more point of reference (POR) leads configured to be connected to a POR on a plurality of load input lines of a load to provide POR feedback to the control module, wherein the control module is configured to adjust the inverter output to account for voltage drops between the one or more output lines and the one or more input lines or due to a contactor between the one or more input and output lines as a function of the POR feedback, wherein the control module includes an RMS creation module configured to receive a POR feedback voltage in a wave form and to convert the POR feedback into an RMS value. 10-12. (canceled) 13. The controller of claim 9, wherein the control module includes an RMS reference module configured to output an RMS reference. 14. The controller of claim 13, wherein the control module includes a voltage reference generation module operatively connected to the RMS creation module and the RMS reference module to compare the RMS value to the RMS reference to determine a voltage drop at the POR. 15. The controller of claim 14, wherein the control module includes a protection control module configured to receive the POR feedback current and local feedback voltage and current to protect the inverter and/or the load from overvoltage or overcurrent. 16. The controller of claim 9, wherein the control module includes an inverter control module having an output voltage harmonic regulator module configured to receive the local feedback and remove harmonics from the inverter output. 17-19. (canceled) | 2,800 |
12,281 | 12,281 | 15,739,531 | 2,872 | Provided is a polarizer having a non-polarization portion with reduced shape unevenness. The polarizer of the present invention is a polarizer having a non-polarization portion, in which the non-polarization portion has a shape matching degree of 0.05 or less. In such polarizer, the number of portions where the shape of the non-polarization portion is distorted is small. Accordingly, when the non-polarization portion of the polarizer is used as, for example, a portion corresponding to a camera portion of an image display apparatus, alignment processability is improved and hence the alignment of the camera can be satisfactorily performed. | 1. A polarizer, comprising a non-polarization portion, wherein the non-polarization portion has a shape matching degree of 0.05 or less. 2. The polarizer according to claim 1, wherein the non-polarization portion has a dichromatic substance content of 1.0 wt % or less. 3. The polarizer according to claim 1, wherein the non-polarization portion has a content of an alkali metal and/or an alkaline earth metal of 3.6 wt % or less. 4. The polarizer according to claim 1, wherein the non-polarization portion corresponds to a camera portion of an image display apparatus on which the polarizer is mounted. 5. A polarizing plate, comprising the polarizer of claim 1. 6. An image display apparatus, comprising the polarizing plate of claim 5. 7. The polarizer according to claim 2, wherein the non-polarization portion has a content of an alkali metal and/or an alkaline earth metal of 3.6 wt % or less. 8. The polarizer according to claim 2, wherein the non-polarization portion corresponds to a camera portion of an image display apparatus on which the polarizer is mounted. 9. The polarizer according to claim 3, wherein the non-polarization portion corresponds to a camera portion of an image display apparatus on which the polarizer is mounted. 10. A polarizing plate, comprising the polarizer of claim 2. 11. A polarizing plate, comprising the polarizer of claim 3. 12. A polarizing plate, comprising the polarizer of claim 4. | Provided is a polarizer having a non-polarization portion with reduced shape unevenness. The polarizer of the present invention is a polarizer having a non-polarization portion, in which the non-polarization portion has a shape matching degree of 0.05 or less. In such polarizer, the number of portions where the shape of the non-polarization portion is distorted is small. Accordingly, when the non-polarization portion of the polarizer is used as, for example, a portion corresponding to a camera portion of an image display apparatus, alignment processability is improved and hence the alignment of the camera can be satisfactorily performed.1. A polarizer, comprising a non-polarization portion, wherein the non-polarization portion has a shape matching degree of 0.05 or less. 2. The polarizer according to claim 1, wherein the non-polarization portion has a dichromatic substance content of 1.0 wt % or less. 3. The polarizer according to claim 1, wherein the non-polarization portion has a content of an alkali metal and/or an alkaline earth metal of 3.6 wt % or less. 4. The polarizer according to claim 1, wherein the non-polarization portion corresponds to a camera portion of an image display apparatus on which the polarizer is mounted. 5. A polarizing plate, comprising the polarizer of claim 1. 6. An image display apparatus, comprising the polarizing plate of claim 5. 7. The polarizer according to claim 2, wherein the non-polarization portion has a content of an alkali metal and/or an alkaline earth metal of 3.6 wt % or less. 8. The polarizer according to claim 2, wherein the non-polarization portion corresponds to a camera portion of an image display apparatus on which the polarizer is mounted. 9. The polarizer according to claim 3, wherein the non-polarization portion corresponds to a camera portion of an image display apparatus on which the polarizer is mounted. 10. A polarizing plate, comprising the polarizer of claim 2. 11. A polarizing plate, comprising the polarizer of claim 3. 12. A polarizing plate, comprising the polarizer of claim 4. | 2,800 |
12,282 | 12,282 | 15,602,908 | 2,842 | In the described examples, a driver includes a signal controller that provides a gate control signal to a gate buffer coupled to a gate of a transistor and a field plate control signal to a field plate buffer coupled to a field plate of the transistor. The signal controller provides a rising edge on the field plate control signal causing the field plate buffer to provide a bias voltage on the field plate of the transistor a predetermined amount of time after providing a rising edge on the gate control signal that causes the gate buffer to provide a turn-on voltage on the gate of the transistor that causes the transistor to transition from a cutoff region to a saturation region and to a linear region. | 1. A driver comprising:
a signal controller that provides a gate control signal to a gate buffer coupled to a gate of a transistor and a field plate control signal to a field plate buffer coupled to a field plate of the transistor; wherein the signal controller provides a rising edge on the field plate control signal causing the field plate buffer to provide a bias voltage on the field plate of the transistor a predetermined amount of time after providing a rising edge on the gate control signal that causes the gate buffer to provide a turn-on voltage on the gate of the transistor that causes the transistor to transition from a cutoff region to a saturation region and to a linear region. 2. The driver of claim 1, wherein the signal controller provides a falling edge on the field plate control signal the predetermined amount of time prior to providing a falling edge on the gate control signal to provide a turn-off voltage on the gate of the transistor that causes the transistor to transition from the linear region to the cutoff region. 3. The driver of claim 1, wherein the transistor is a laterally diffused metal-oxide semiconductor (LDMOS) transistor, and the LDMOS transistor comprises a drift region underlying an oxide layer, wherein application of the bias voltage on the field plate reduces a resistance in the drift region. 4. The driver of claim 3, wherein the LDMOS transistor is formed with Shallow Trench Isolation (STI) techniques. 5. The driver of claim 3, wherein the LDMOS transistor is formed with LOCal Oxidation of Silicon (LOCOS) techniques. 6. The driver of claim 3, wherein the LDMOS transistor is an N-channel LDMOS transistor. 7. The driver of claim 1, wherein the bias voltage on the field plate of the transistor is greater than a voltage of the gate control signal. 8. A driver comprising:
a high side laterally diffused metal-oxide semiconductor (LDMOS) transistor; a low side LDMOS transistor, wherein a source of the high side LDMOS transistor and a drain of the low side LDMOS transistor are coupled to a phase node; and a signal controller comprising:
a high side level shifter that provides a high side gate control signal to a high side gate buffer and a high side field plate control signal to a high side field plate buffer; and
a low side level shifter that provides a low side gate control signal to a low side gate buffer and a low side field plate control signal to a low side field plate buffer;
wherein the high side gate buffer is coupled to a gate of the high side LDMOS transistor and the high side field plate buffer is coupled to a field plate of the high side LDMOS transistor; wherein the low side gate buffer is coupled to a gate of a low side LDMOS transistor and the low side field plate buffer is coupled to a field plate of the low side LDMOS transistor. 9. The driver of claim 8, wherein the high side level shifter outputs a rising edge on the high side gate control signal in response to a rising edge of a high side control signal and the high side level shifter outputs a rising edge on the high side field plate control signal at a first predetermined amount of time after the rising edge of the high side gate buffer. 10. The driver of claim 9, wherein the high side level shifter outputs a falling edge on the high side field plate control signal in response to a falling edge of the high side control signal and the high side level shifter outputs a falling edge on the high side gate control signal at a second predetermined amount of time after the falling edge on the high side field plate control signal. 11. The driver of claim 10, wherein the low side level shifter outputs a rising edge on the low side gate control signal in response to a rising edge of a low side control signal and the low side level shifter outputs a rising edge on the low side field plate control signal at a third predetermined amount of time after the rising edge of the low side gate buffer. 12. The driver of claim 11, wherein the low side level shifter outputs a falling edge on the low side field plate control signal in response to a falling edge of the low side control signal and the low side level shifter outputs a falling edge on the low side gate control signal at a fourth predetermined amount of time after the falling edge on the low side field plate control signal. 13. The driver of claim 12, wherein the high side control signal and the low side control signal are complementary signals. 14. The driver of claim 8, wherein a capacitor is coupled to the phase node. 15. The driver of claim 8, wherein a drain of the high side LDMOS transistor is coupled to an input voltage and a source of the low side LDMOS transistor is coupled to an electrically neutral node. 16. The driver of claim 15, wherein the phase node is coupled to an input node of a filter on a switching converter. 17. The driver of claim 16, wherein the switching power converter is a step-down power converter that provides an output signal with voltage level less than the voltage level of the input voltage. 18. A method comprising:
outputting a rising edge to a gate buffer coupled to a gate of a laterally diffused metal-oxide semiconductor (LDMOS) transistor; and outputting a rising edge to a field plate buffer coupled to a field plate of the LDMOS transistor a predetermined amount of time after the rising edge is output to the gate buffer. 19. The method of claim 18, further comprising:
outputting a falling edge to the field plate buffer; and outputting a falling edge to the gate buffer a predetermined amount of time after the falling edge is output to the field plate buffer. 20. The method of claim 18, wherein the field plate buffer outputs a bias voltage on the field plate of the LDMOS transistor in response to the rising edge, and the a specific resistance of the LDMOS transistor is reduced in response to the bias voltage. | In the described examples, a driver includes a signal controller that provides a gate control signal to a gate buffer coupled to a gate of a transistor and a field plate control signal to a field plate buffer coupled to a field plate of the transistor. The signal controller provides a rising edge on the field plate control signal causing the field plate buffer to provide a bias voltage on the field plate of the transistor a predetermined amount of time after providing a rising edge on the gate control signal that causes the gate buffer to provide a turn-on voltage on the gate of the transistor that causes the transistor to transition from a cutoff region to a saturation region and to a linear region.1. A driver comprising:
a signal controller that provides a gate control signal to a gate buffer coupled to a gate of a transistor and a field plate control signal to a field plate buffer coupled to a field plate of the transistor; wherein the signal controller provides a rising edge on the field plate control signal causing the field plate buffer to provide a bias voltage on the field plate of the transistor a predetermined amount of time after providing a rising edge on the gate control signal that causes the gate buffer to provide a turn-on voltage on the gate of the transistor that causes the transistor to transition from a cutoff region to a saturation region and to a linear region. 2. The driver of claim 1, wherein the signal controller provides a falling edge on the field plate control signal the predetermined amount of time prior to providing a falling edge on the gate control signal to provide a turn-off voltage on the gate of the transistor that causes the transistor to transition from the linear region to the cutoff region. 3. The driver of claim 1, wherein the transistor is a laterally diffused metal-oxide semiconductor (LDMOS) transistor, and the LDMOS transistor comprises a drift region underlying an oxide layer, wherein application of the bias voltage on the field plate reduces a resistance in the drift region. 4. The driver of claim 3, wherein the LDMOS transistor is formed with Shallow Trench Isolation (STI) techniques. 5. The driver of claim 3, wherein the LDMOS transistor is formed with LOCal Oxidation of Silicon (LOCOS) techniques. 6. The driver of claim 3, wherein the LDMOS transistor is an N-channel LDMOS transistor. 7. The driver of claim 1, wherein the bias voltage on the field plate of the transistor is greater than a voltage of the gate control signal. 8. A driver comprising:
a high side laterally diffused metal-oxide semiconductor (LDMOS) transistor; a low side LDMOS transistor, wherein a source of the high side LDMOS transistor and a drain of the low side LDMOS transistor are coupled to a phase node; and a signal controller comprising:
a high side level shifter that provides a high side gate control signal to a high side gate buffer and a high side field plate control signal to a high side field plate buffer; and
a low side level shifter that provides a low side gate control signal to a low side gate buffer and a low side field plate control signal to a low side field plate buffer;
wherein the high side gate buffer is coupled to a gate of the high side LDMOS transistor and the high side field plate buffer is coupled to a field plate of the high side LDMOS transistor; wherein the low side gate buffer is coupled to a gate of a low side LDMOS transistor and the low side field plate buffer is coupled to a field plate of the low side LDMOS transistor. 9. The driver of claim 8, wherein the high side level shifter outputs a rising edge on the high side gate control signal in response to a rising edge of a high side control signal and the high side level shifter outputs a rising edge on the high side field plate control signal at a first predetermined amount of time after the rising edge of the high side gate buffer. 10. The driver of claim 9, wherein the high side level shifter outputs a falling edge on the high side field plate control signal in response to a falling edge of the high side control signal and the high side level shifter outputs a falling edge on the high side gate control signal at a second predetermined amount of time after the falling edge on the high side field plate control signal. 11. The driver of claim 10, wherein the low side level shifter outputs a rising edge on the low side gate control signal in response to a rising edge of a low side control signal and the low side level shifter outputs a rising edge on the low side field plate control signal at a third predetermined amount of time after the rising edge of the low side gate buffer. 12. The driver of claim 11, wherein the low side level shifter outputs a falling edge on the low side field plate control signal in response to a falling edge of the low side control signal and the low side level shifter outputs a falling edge on the low side gate control signal at a fourth predetermined amount of time after the falling edge on the low side field plate control signal. 13. The driver of claim 12, wherein the high side control signal and the low side control signal are complementary signals. 14. The driver of claim 8, wherein a capacitor is coupled to the phase node. 15. The driver of claim 8, wherein a drain of the high side LDMOS transistor is coupled to an input voltage and a source of the low side LDMOS transistor is coupled to an electrically neutral node. 16. The driver of claim 15, wherein the phase node is coupled to an input node of a filter on a switching converter. 17. The driver of claim 16, wherein the switching power converter is a step-down power converter that provides an output signal with voltage level less than the voltage level of the input voltage. 18. A method comprising:
outputting a rising edge to a gate buffer coupled to a gate of a laterally diffused metal-oxide semiconductor (LDMOS) transistor; and outputting a rising edge to a field plate buffer coupled to a field plate of the LDMOS transistor a predetermined amount of time after the rising edge is output to the gate buffer. 19. The method of claim 18, further comprising:
outputting a falling edge to the field plate buffer; and outputting a falling edge to the gate buffer a predetermined amount of time after the falling edge is output to the field plate buffer. 20. The method of claim 18, wherein the field plate buffer outputs a bias voltage on the field plate of the LDMOS transistor in response to the rising edge, and the a specific resistance of the LDMOS transistor is reduced in response to the bias voltage. | 2,800 |
12,283 | 12,283 | 14,641,540 | 2,836 | An exemplary electrified vehicle assembly includes a cable connected to an electrified vehicle battery. The cable has a coiled portion providing an inductor. | 1. An electrified vehicle assembly, comprising:
a cable connected to an electrified vehicle battery, the cable having a coiled portion providing an inductor. 2. The assembly of claim 1, further comprising an inner sheath, the coiled portion wound about the inner sheath. 3. The assembly of claim 2, further comprising an outer sheath, the inner sheath and coiled portion received within the outer sheath. 4. The assembly of claim 1, further comprising a power control system of an electrified vehicle powertrain, the cable electrically coupling the battery to the power control system. 5. The assembly of claim 4, wherein the power control system includes a variable voltage controller. 6. The assembly of claim 5, wherein the variable voltage controller includes at least one silicon-carbide based switch. 7. The assembly of claim 6, wherein the at least one silicon-carbide based switch comprises at least one metal-oxide-semiconductor field-effect transistor. 8. The assembly of claim 6, wherein the at least one silicon-carbide based switch comprises at least one insulated-gate bipolar transistor. 9. The assembly of claim 1, wherein the coiled portion is received within a rocker of an electrified vehicle. 10. The assembly of claim 1, wherein the coiled portion includes from 40 to 240 individual coils. 11. The assembly of claim 1, wherein the coiled portion includes a plurality of individual coils that are spaced from 15 to 55 millimeters from each other. 12. A method of electrified vehicle power conversion, comprising:
communicating electric current between an electrified vehicle battery and a power control system with a cable; and resisting changes in the electric current using an inductor portion of the cable. 13. The method of claim 12, further comprising coiling the inductor portion about an inner sheath. 14. The method of claim 13, further comprising positioning at least a portion of the inductor portion and at least a portion of the inner sheath within an outer sheath. 15. The method of claim 12, further comprising positioning the inductor portion within a rocker. 16. The method of claim 12, further comprising air-cooling the inductor portion. 17. The method of claim 12, communicating power from the cable through at least one silicon carbide switching device within the power control system. 18. The method of claim 12, wherein the power control system comprises a variable voltage converter. 19. The method of claim 12, wherein the power control system comprises an inverter. 20. The method of claim 12, wherein the electrified vehicle battery is positioned in a rear of an electrified vehicle, and the power conversion device is positioned in a forward portion of the electrified vehicle. | An exemplary electrified vehicle assembly includes a cable connected to an electrified vehicle battery. The cable has a coiled portion providing an inductor.1. An electrified vehicle assembly, comprising:
a cable connected to an electrified vehicle battery, the cable having a coiled portion providing an inductor. 2. The assembly of claim 1, further comprising an inner sheath, the coiled portion wound about the inner sheath. 3. The assembly of claim 2, further comprising an outer sheath, the inner sheath and coiled portion received within the outer sheath. 4. The assembly of claim 1, further comprising a power control system of an electrified vehicle powertrain, the cable electrically coupling the battery to the power control system. 5. The assembly of claim 4, wherein the power control system includes a variable voltage controller. 6. The assembly of claim 5, wherein the variable voltage controller includes at least one silicon-carbide based switch. 7. The assembly of claim 6, wherein the at least one silicon-carbide based switch comprises at least one metal-oxide-semiconductor field-effect transistor. 8. The assembly of claim 6, wherein the at least one silicon-carbide based switch comprises at least one insulated-gate bipolar transistor. 9. The assembly of claim 1, wherein the coiled portion is received within a rocker of an electrified vehicle. 10. The assembly of claim 1, wherein the coiled portion includes from 40 to 240 individual coils. 11. The assembly of claim 1, wherein the coiled portion includes a plurality of individual coils that are spaced from 15 to 55 millimeters from each other. 12. A method of electrified vehicle power conversion, comprising:
communicating electric current between an electrified vehicle battery and a power control system with a cable; and resisting changes in the electric current using an inductor portion of the cable. 13. The method of claim 12, further comprising coiling the inductor portion about an inner sheath. 14. The method of claim 13, further comprising positioning at least a portion of the inductor portion and at least a portion of the inner sheath within an outer sheath. 15. The method of claim 12, further comprising positioning the inductor portion within a rocker. 16. The method of claim 12, further comprising air-cooling the inductor portion. 17. The method of claim 12, communicating power from the cable through at least one silicon carbide switching device within the power control system. 18. The method of claim 12, wherein the power control system comprises a variable voltage converter. 19. The method of claim 12, wherein the power control system comprises an inverter. 20. The method of claim 12, wherein the electrified vehicle battery is positioned in a rear of an electrified vehicle, and the power conversion device is positioned in a forward portion of the electrified vehicle. | 2,800 |
12,284 | 12,284 | 15,364,454 | 2,849 | A device for controlling a first voltage with a second voltage includes a first terminal of application of the second voltage and a second terminal for supplying the first voltage. A comparator has a first input terminal connected to the first terminal and has a second input terminal receiving information representative of the first voltage. At least one first current source of programmable intensity is connected to the second input terminal of the comparator. | 1. A device for controlling a first voltage with a second voltage, the device comprising:
a first terminal configured to receive the second voltage; a second terminal configured to supply the first voltage; a comparator having a first input terminal connected to the first terminal and a second input terminal configured to receive information representative of the first voltage; and a current source of programmable intensity connected to the second input terminal of the comparator. 2. The device of claim 1, wherein the current source is configured to generate a current that is proportional to the ratio of the second voltage to a resistance. 3. The device of claim 1, wherein the current source is coupled between a terminal configured to receive a first voltage and the second input terminal. 4. The device of claim 3, wherein the first voltage is a power supply voltage. 5. The device of claim 4, wherein the power supply voltage is ground. 6. The device of claim 1, wherein the current source comprises:
a first branch comprising a reference current source and a first transistor coupled in series between the first terminal and a terminal configured to carry a second voltage; and a second branch comprising a programmable switch and a second transistor coupled in series between the first terminal and the second input terminal of the comparator, a gate of the second transistor having a gate coupled to a gate of the first transistor. 7. The device of claim 1, further comprising a second programmable current source coupled between a reference voltage terminal and the second input terminal. 8. The device of claim 7, wherein the second programmable current source comprises:
a first branch comprising a reference current source and a first transistor coupled in series between the reference voltage terminal and second input terminal of the comparator; and a second branch comprising a programmable switch and a second transistor coupled in series between a terminal configured to receive a second voltage and the second input terminal of the comparator, the second transistor having a gate coupled to a gate of the first transistor. 9. The device of claim 1, wherein the current source comprises a resistor of programmable resistance having a first terminal connected to a power supply voltage terminal and a second terminal connected to the second terminal of the comparator. 10. The device of claim 1, wherein the current source comprises a programmable voltage source and a resistor coupled in series between a ground terminal and the second terminal of the comparator. 11. A circuit comprising:
a comparator having a first input, a second input, and an output; a resistor coupled between the output of the comparator and the second input of the comparator; a reference voltage generator coupled to the first input of the comparator; and a programmable current source coupled between a first reference voltage terminal and the second input of the comparator. 12. The circuit of claim 11, further comprising a variable resistor coupled between the second input of the comparator and a second reference voltage terminal. 13. The circuit of claim 11, further comprising a second programmable current source coupled between a second reference voltage terminal and the second input of the comparator. 14. The circuit of claim 11, wherein the programmable current source comprises:
a first branch comprising a diode-coupled transistor in series with a reference current source, the first branch coupled between the first reference voltage terminal and a second reference voltage terminal; and a second branch comprising a programmable switch in series with a second transistor, the second branch coupled between the first reference voltage terminal and the second input of the comparator. 15. The circuit of claim 14, wherein the programmable current source further comprises a third branch comprising a second programmable switch in series with a third transistor, the second branch coupled between the first reference voltage terminal and the second input of the comparator. 16. A circuit comprising:
a comparator having a first input, a second input, and an output; a resistor coupled between the output of the comparator and the second input of the comparator; a reference voltage generator coupled to the first input of the comparator; a first programmable current source coupled between a first reference voltage terminal and the second input of the comparator; a second programmable current source coupled between a second reference voltage terminal and the second input of the comparator; and a variable resistor coupled between the second input of the comparator and the second reference voltage terminal. 17. The circuit of claim 16, wherein the first programmable current source comprises:
a first branch comprising a diode-coupled transistor in series with a reference current source, the first branch coupled between the first reference voltage terminal and the second reference voltage terminal; and a second branch comprising a programmable switch in series with a second transistor, the second branch coupled between the first reference voltage terminal and the second input of the comparator, the second transistor having a gate coupled to a gate of the diode-coupled transistor. 18. The circuit of claim 17, wherein the first programmable current source further comprises a third branch comprising a second programmable switch in series with a third transistor, the second branch coupled between the first reference voltage terminal and the second input of the comparator, the third transistor having a gate coupled to the gate of the second transistor. 19. The circuit of claim 17, wherein the second programmable current source comprises:
a first branch comprising a second diode-coupled transistor in series with a second reference current source, the first branch coupled between the first reference voltage terminal and the second reference voltage terminal; and a second branch comprising a second programmable switch in series with a third transistor, the second branch coupled between the second reference voltage terminal and the second input of the comparator, the third transistor having a gate coupled to a gate of the second diode-coupled transistor. 20. The circuit of claim 16, wherein the first reference voltage terminal is a VDD terminal and the second reference voltage terminal is a ground terminal. | A device for controlling a first voltage with a second voltage includes a first terminal of application of the second voltage and a second terminal for supplying the first voltage. A comparator has a first input terminal connected to the first terminal and has a second input terminal receiving information representative of the first voltage. At least one first current source of programmable intensity is connected to the second input terminal of the comparator.1. A device for controlling a first voltage with a second voltage, the device comprising:
a first terminal configured to receive the second voltage; a second terminal configured to supply the first voltage; a comparator having a first input terminal connected to the first terminal and a second input terminal configured to receive information representative of the first voltage; and a current source of programmable intensity connected to the second input terminal of the comparator. 2. The device of claim 1, wherein the current source is configured to generate a current that is proportional to the ratio of the second voltage to a resistance. 3. The device of claim 1, wherein the current source is coupled between a terminal configured to receive a first voltage and the second input terminal. 4. The device of claim 3, wherein the first voltage is a power supply voltage. 5. The device of claim 4, wherein the power supply voltage is ground. 6. The device of claim 1, wherein the current source comprises:
a first branch comprising a reference current source and a first transistor coupled in series between the first terminal and a terminal configured to carry a second voltage; and a second branch comprising a programmable switch and a second transistor coupled in series between the first terminal and the second input terminal of the comparator, a gate of the second transistor having a gate coupled to a gate of the first transistor. 7. The device of claim 1, further comprising a second programmable current source coupled between a reference voltage terminal and the second input terminal. 8. The device of claim 7, wherein the second programmable current source comprises:
a first branch comprising a reference current source and a first transistor coupled in series between the reference voltage terminal and second input terminal of the comparator; and a second branch comprising a programmable switch and a second transistor coupled in series between a terminal configured to receive a second voltage and the second input terminal of the comparator, the second transistor having a gate coupled to a gate of the first transistor. 9. The device of claim 1, wherein the current source comprises a resistor of programmable resistance having a first terminal connected to a power supply voltage terminal and a second terminal connected to the second terminal of the comparator. 10. The device of claim 1, wherein the current source comprises a programmable voltage source and a resistor coupled in series between a ground terminal and the second terminal of the comparator. 11. A circuit comprising:
a comparator having a first input, a second input, and an output; a resistor coupled between the output of the comparator and the second input of the comparator; a reference voltage generator coupled to the first input of the comparator; and a programmable current source coupled between a first reference voltage terminal and the second input of the comparator. 12. The circuit of claim 11, further comprising a variable resistor coupled between the second input of the comparator and a second reference voltage terminal. 13. The circuit of claim 11, further comprising a second programmable current source coupled between a second reference voltage terminal and the second input of the comparator. 14. The circuit of claim 11, wherein the programmable current source comprises:
a first branch comprising a diode-coupled transistor in series with a reference current source, the first branch coupled between the first reference voltage terminal and a second reference voltage terminal; and a second branch comprising a programmable switch in series with a second transistor, the second branch coupled between the first reference voltage terminal and the second input of the comparator. 15. The circuit of claim 14, wherein the programmable current source further comprises a third branch comprising a second programmable switch in series with a third transistor, the second branch coupled between the first reference voltage terminal and the second input of the comparator. 16. A circuit comprising:
a comparator having a first input, a second input, and an output; a resistor coupled between the output of the comparator and the second input of the comparator; a reference voltage generator coupled to the first input of the comparator; a first programmable current source coupled between a first reference voltage terminal and the second input of the comparator; a second programmable current source coupled between a second reference voltage terminal and the second input of the comparator; and a variable resistor coupled between the second input of the comparator and the second reference voltage terminal. 17. The circuit of claim 16, wherein the first programmable current source comprises:
a first branch comprising a diode-coupled transistor in series with a reference current source, the first branch coupled between the first reference voltage terminal and the second reference voltage terminal; and a second branch comprising a programmable switch in series with a second transistor, the second branch coupled between the first reference voltage terminal and the second input of the comparator, the second transistor having a gate coupled to a gate of the diode-coupled transistor. 18. The circuit of claim 17, wherein the first programmable current source further comprises a third branch comprising a second programmable switch in series with a third transistor, the second branch coupled between the first reference voltage terminal and the second input of the comparator, the third transistor having a gate coupled to the gate of the second transistor. 19. The circuit of claim 17, wherein the second programmable current source comprises:
a first branch comprising a second diode-coupled transistor in series with a second reference current source, the first branch coupled between the first reference voltage terminal and the second reference voltage terminal; and a second branch comprising a second programmable switch in series with a third transistor, the second branch coupled between the second reference voltage terminal and the second input of the comparator, the third transistor having a gate coupled to a gate of the second diode-coupled transistor. 20. The circuit of claim 16, wherein the first reference voltage terminal is a VDD terminal and the second reference voltage terminal is a ground terminal. | 2,800 |
12,285 | 12,285 | 14,868,548 | 2,824 | Method for constructing a continuous design space for generating a physical property model in a faulted subsurface medium. The matching relationship of the fault traces on the two sides of each fault is used in a systematic way to determine the location of the fault traces in the design space. The location of any other point in the design space may then be determined by interpolation of the locations of fault traces. The fault traces are thus used as control points for the mapping. The method involves: (a) identifying the control points and determining their location in both physical and design space and (b) using selected control points, mapping any point from physical space to design space, preferably using the moving least squares method. | 1. A method for generating a model of a material property of a faulted subsurface region for hydrocarbon prospecting or reservoir development, said method comprising:
mapping, using a computer, a model of the faulted subsurface region to a continuous design space in which all faults are removed, using a transformation Tx that minimizes distance between Tx(pi) and qi for i=at least 1 control point, where pi is position of the control point in the faulted subsurface region and q, is position of the control point in the design space; assigning values of the material property in the design space to generate a model of the material property in the design space, and using the transformation Tx to generate a model of the material property in the faulted subsurface region; and using the model of the material property in the faulted subsurface region for hydrocarbon prospecting or reservoir development. 2. The method of claim 1, wherein the transformation Tx is determined by moving least squares. 3. The method of claim 2, wherein the transformation Tx is determined as a transformation that minimizes
E
(
x
)
=
∑
i
w
i
(
x
)
T
x
(
p
i
)
-
q
i
2
where weights wi(x) are defined by
w i(x)=d(p i ,x)−2α
where d(pi, x) is distance between point x and pi, and α is a parameter controlling how strongly deformation produced by a fault is influenced by distant control points. 4. The method of claim 1, wherein the control points are selected in pairs, pi and qi, being points at a fault plane that were co-located before the fault but now are dislocated because of the fault. 5. The method of claim 1, wherein the faulted subsurface region has a geologic structural framework that can be decomposed into simple fault blocks, meaning that a fault can terminate only at a boundary of the model or at another fault, and the mapping proceeds by a sequential unfaulting approach that comprises:
determining a fault block sequence for unfaulting based on relationships between neighboring blocks, after arbitrarily selecting a control block; identifying the control points, located on fault traces of seismic data records from the subsurface region, said fault traces being data traces on either side of a fault; determining the position of control points in the design space, block-by-block, according to the fault block sequence, in a recursive process; and mapping a point in the model to the design space, using control points from the fault block to which the point belongs, and repeating for a plurality of points until the model has been mapped to the design space. 6. The method of claim 5, wherein moving least squares is used for the mapping a point in the model to the design space. 7. The method of claim 5, wherein the recursive process comprises:
starting from the control block, determining position of control points in design space for a neighboring block, being the next block in the fault block sequence, wherein control points across a common fault boundary in the control block are used for the common fault boundary, and the position in design space for control points along a common fault boundary with a third block in the sequence is determined by the moving least squares method using the control points across a common fault boundary in the control block; extending the recursive process to the third block in the sequence, and subsequently, one by one, to all blocks in the sequence, using previously established control point locations in the design space for at least one fault boundary, and using the moving least squares method to locate control points along a yet unprocessed fault boundary. 8. The method of claim 1, wherein the mapping uses moving least squares with a discontinuous weight function for a faulted subsurface region that has a geologic structural framework that cannot be decomposed into simple fault blocks, said term simple fault blocks meaning that a fault can terminate only at a boundary of the model or at another fault. 9. The method of claim 8, wherein transformation Tx is determined as a transformation that minimizes
E
(
x
)
=
∑
i
w
i
(
x
)
T
x
(
p
i
)
-
q
i
2
where weights wi(x) are discontinuous functions that control how strongly deformation produced by a fault is influenced by far away control points. 10. The method of claim 9, wherein the discontinuous weight functions wi(x) are defined such that if point x and pi appear on two sides of any fault, wi(x)=0. 11. The method of claim 9, wherein the discontinuous weight functions wi(x) are implemented by inducing a jump across faults by introducing dipoles on fault surfaces. 12. The method of claim 9, wherein the mapping proceeds by a sequential unfaulting approach that comprises:
determining a fault sequence for unfaulting, selecting a control fault that is the first fault in the sequence; identifying the control points, located on fault traces of seismic data records from the subsurface region, said fault traces being data traces on either side of a fault; determining the position of control points in the design space fault-by-fault, according to the fault sequence, in a recursive process; determining a discontinuous weight function; and mapping a point in the model to the design space, using all the control points in the model, subject to operation of the discontinuous weight function, to carry out the moving least squares calculation, and repeating for a plurality of points until the model has been mapped to the design space. 13. A method for generating a geologic model having one or more material properties for a faulted subsurface region, the method comprising:
mapping, using a computer, a geologic model in the physical domain representing a faulted subsurface region to a design model in the design space based on a transformation Tx that lessens distance between Tx(pi) and qi for i=at least 1 control point, where pi is position of the control point in the physical domain and qi is position of the control point in the design space, wherein the design model is continuous and unfaulted; assigning values of one or more material properties to populate the design model in the design space; mapping the assigned values of the one or more material properties in the design model to the geologic model based on the transformation Tx; and using the geologic model with the one or more material properties for hydrocarbon operations. 14. The method of claim 13, wherein the transformation Tx is determined as a transformation that minimizes
E
(
x
)
=
∑
i
w
i
(
x
)
T
x
(
p
i
)
-
q
i
2
where weights wi(x) are defined by
w i(x)=d(p i ,x)−2α
where d(pi, x) is distance between point x and pi, and α is a parameter controlling how strongly deformation produced by a fault is influenced by distant control points. | Method for constructing a continuous design space for generating a physical property model in a faulted subsurface medium. The matching relationship of the fault traces on the two sides of each fault is used in a systematic way to determine the location of the fault traces in the design space. The location of any other point in the design space may then be determined by interpolation of the locations of fault traces. The fault traces are thus used as control points for the mapping. The method involves: (a) identifying the control points and determining their location in both physical and design space and (b) using selected control points, mapping any point from physical space to design space, preferably using the moving least squares method.1. A method for generating a model of a material property of a faulted subsurface region for hydrocarbon prospecting or reservoir development, said method comprising:
mapping, using a computer, a model of the faulted subsurface region to a continuous design space in which all faults are removed, using a transformation Tx that minimizes distance between Tx(pi) and qi for i=at least 1 control point, where pi is position of the control point in the faulted subsurface region and q, is position of the control point in the design space; assigning values of the material property in the design space to generate a model of the material property in the design space, and using the transformation Tx to generate a model of the material property in the faulted subsurface region; and using the model of the material property in the faulted subsurface region for hydrocarbon prospecting or reservoir development. 2. The method of claim 1, wherein the transformation Tx is determined by moving least squares. 3. The method of claim 2, wherein the transformation Tx is determined as a transformation that minimizes
E
(
x
)
=
∑
i
w
i
(
x
)
T
x
(
p
i
)
-
q
i
2
where weights wi(x) are defined by
w i(x)=d(p i ,x)−2α
where d(pi, x) is distance between point x and pi, and α is a parameter controlling how strongly deformation produced by a fault is influenced by distant control points. 4. The method of claim 1, wherein the control points are selected in pairs, pi and qi, being points at a fault plane that were co-located before the fault but now are dislocated because of the fault. 5. The method of claim 1, wherein the faulted subsurface region has a geologic structural framework that can be decomposed into simple fault blocks, meaning that a fault can terminate only at a boundary of the model or at another fault, and the mapping proceeds by a sequential unfaulting approach that comprises:
determining a fault block sequence for unfaulting based on relationships between neighboring blocks, after arbitrarily selecting a control block; identifying the control points, located on fault traces of seismic data records from the subsurface region, said fault traces being data traces on either side of a fault; determining the position of control points in the design space, block-by-block, according to the fault block sequence, in a recursive process; and mapping a point in the model to the design space, using control points from the fault block to which the point belongs, and repeating for a plurality of points until the model has been mapped to the design space. 6. The method of claim 5, wherein moving least squares is used for the mapping a point in the model to the design space. 7. The method of claim 5, wherein the recursive process comprises:
starting from the control block, determining position of control points in design space for a neighboring block, being the next block in the fault block sequence, wherein control points across a common fault boundary in the control block are used for the common fault boundary, and the position in design space for control points along a common fault boundary with a third block in the sequence is determined by the moving least squares method using the control points across a common fault boundary in the control block; extending the recursive process to the third block in the sequence, and subsequently, one by one, to all blocks in the sequence, using previously established control point locations in the design space for at least one fault boundary, and using the moving least squares method to locate control points along a yet unprocessed fault boundary. 8. The method of claim 1, wherein the mapping uses moving least squares with a discontinuous weight function for a faulted subsurface region that has a geologic structural framework that cannot be decomposed into simple fault blocks, said term simple fault blocks meaning that a fault can terminate only at a boundary of the model or at another fault. 9. The method of claim 8, wherein transformation Tx is determined as a transformation that minimizes
E
(
x
)
=
∑
i
w
i
(
x
)
T
x
(
p
i
)
-
q
i
2
where weights wi(x) are discontinuous functions that control how strongly deformation produced by a fault is influenced by far away control points. 10. The method of claim 9, wherein the discontinuous weight functions wi(x) are defined such that if point x and pi appear on two sides of any fault, wi(x)=0. 11. The method of claim 9, wherein the discontinuous weight functions wi(x) are implemented by inducing a jump across faults by introducing dipoles on fault surfaces. 12. The method of claim 9, wherein the mapping proceeds by a sequential unfaulting approach that comprises:
determining a fault sequence for unfaulting, selecting a control fault that is the first fault in the sequence; identifying the control points, located on fault traces of seismic data records from the subsurface region, said fault traces being data traces on either side of a fault; determining the position of control points in the design space fault-by-fault, according to the fault sequence, in a recursive process; determining a discontinuous weight function; and mapping a point in the model to the design space, using all the control points in the model, subject to operation of the discontinuous weight function, to carry out the moving least squares calculation, and repeating for a plurality of points until the model has been mapped to the design space. 13. A method for generating a geologic model having one or more material properties for a faulted subsurface region, the method comprising:
mapping, using a computer, a geologic model in the physical domain representing a faulted subsurface region to a design model in the design space based on a transformation Tx that lessens distance between Tx(pi) and qi for i=at least 1 control point, where pi is position of the control point in the physical domain and qi is position of the control point in the design space, wherein the design model is continuous and unfaulted; assigning values of one or more material properties to populate the design model in the design space; mapping the assigned values of the one or more material properties in the design model to the geologic model based on the transformation Tx; and using the geologic model with the one or more material properties for hydrocarbon operations. 14. The method of claim 13, wherein the transformation Tx is determined as a transformation that minimizes
E
(
x
)
=
∑
i
w
i
(
x
)
T
x
(
p
i
)
-
q
i
2
where weights wi(x) are defined by
w i(x)=d(p i ,x)−2α
where d(pi, x) is distance between point x and pi, and α is a parameter controlling how strongly deformation produced by a fault is influenced by distant control points. | 2,800 |
12,286 | 12,286 | 15,678,194 | 2,853 | A method of operating a particulate matter sensor having a pair of spaced apart electrodes and a heater includes accumulating particulate matter on the sensor, thereby changing resistance between the pair of spaced apart electrodes. The particulate matter sensor includes a sensing cycle that includes a deadband zone, followed by an active zone, which is followed by a regeneration zone in which the heater is operated to elevate the temperature of the particulate matter sensor to a first predetermined temperature for a first predetermined time in order to oxidize the particulate matter accumulated on the particulate matter sensor. The method also includes interrupting the sensing cycle with a modified regeneration zone which is either higher in temperature or length than the regeneration zone. | 1. A method of operating a particulate matter sensor having a pair of spaced apart electrodes and a heater, said method comprising the steps of:
accumulating particulate matter on said particulate matter sensor, thereby changing resistance and conductance between said pair of spaced apart electrodes, wherein said particulate matter sensor provides a signal that varies based upon an amount of the particulate matter on said particulate matter sensor, wherein said particulate matter sensor includes a sensing cycle that includes a deadband zone in which said resistance is greater than a first predetermined value, followed by an active zone in which said resistance is less than or equal to said first predetermined value, which is followed by a regeneration zone in which said heater is operated to elevate the temperature of said particulate matter sensor to a first predetermined temperature for a first predetermined time in order to oxidize the particulate matter accumulated on said particulate matter sensor, thereby returning said sensing cycle to said deadband zone; interrupting said sensing cycle with a modified regeneration zone in which said heater is operated to elevate the temperature of said particulate matter sensor in order to oxidize the particulate matter accumulated on said particulate matter sensor, thereby returning said sensing cycle to said deadband zone, wherein said modified regeneration zone includes at least one of 1) elevating the temperature of said particulate matter sensor to a second predetermined temperature which is greater than said first predetermined temperature and 2) elevating the temperature of said particulate matter sensor for a second predetermined time which is longer than said first predetermined time. 2. A method in accordance with claim 1, wherein said modified regeneration zone includes elevating the temperature of said particulate matter sensor to said second predetermined temperature and said second predetermined temperature is at least 15° C. greater than said first predetermined temperature. 3. A method in accordance with claim 1, wherein said modified regeneration zone includes elevating the temperature of said particulate matter sensor for said second predetermined time and said second predetermined time is at least 50% greater than said first predetermined time. 4. A method in accordance with claim 1, wherein said modified regeneration zone is triggered by an anomaly relating to accumulation of the particulate matter. 5. A method in accordance with claim 4, wherein said anomaly includes at least one of an occurrence of sudden increase in conductance between said pair of spaced apart electrodes on the particulate matter sensor and an occurrence of sudden decrease in conductance between said pair of spaced apart electrodes on the particulate matter sensor. 6. A method in accordance with claim 5, wherein said modified regeneration zone is triggered at least in part at by at least one of 1) said occurrence of sudden increase in conductance between said pair of spaced apart electrodes being caused by the particulate matter having an equivalent mass that is greater than or equal to a first equivalent mass threshold, 2) said occurrence of sudden increase in conductance between said pair of spaced apart electrodes occurring a predetermined number of times during said sensing cycle, and 3) said occurrence of sudden increase in conductance between said pair of spaced apart electrodes occurring one or more times during said sensing cycle such that said occurrence of sudden increase in conductance between said pair of spaced apart electrodes occurring one or more times during said sensing cycle causes apparent accumulation of the particulate matter having an equivalent mass that is greater than or equal to a second equivalent mass threshold. 7. A method in accordance with claim 6, wherein said modified regeneration zone is triggered at least in part by at least one of 1) said occurrence of sudden decrease in conductance between said pair of spaced apart electrodes being caused by a particulate matter loss having an equivalent mass that is greater than or equal to a third equivalent mass threshold, 2) said occurrence of sudden decrease in conductance between said pair of spaced apart electrodes occurring a predetermined number of times during said sensing cycle, and 3) said occurrence of sudden decrease in conductance between said pair of spaced apart electrodes occurring one or more times during said sensing cycle such that said occurrence of sudden decrease in conductance between said pair of spaced apart electrodes occurring one or more times during said sensing cycle causes loss of the particulate matter from said particulate matter sensor having an equivalent mass that is greater than or equal to a fourth equivalent mass threshold. 8. A method in accordance with claim 5, wherein said modified regeneration zone is triggered at least in part by at least one of 1) said occurrence of sudden decrease in conductance between said pair of spaced apart electrodes being caused by a particulate matter loss having an equivalent mass that is greater than or equal to a first equivalent mass threshold, 2) said occurrence of sudden decrease in conductance between said pair of spaced apart electrodes occurring a predetermined number of times during said sensing cycle, and 3) said occurrence of sudden decrease in conductance between said pair of spaced apart electrodes occurring one or more times during said sensing cycle such that said occurrence of sudden decrease in conductance between said pair of spaced apart electrodes occurring one or more times during said sensing cycle causes loss of the particulate matter from said particulate matter sensor having an equivalent mass that is greater than or equal to a second equivalent mass threshold. 9. A method in accordance with claim 1, wherein said modified regeneration zone is triggered by a request from a controller such that said request is not associated with an operating condition of said particulate matter sensor. 10. A method in accordance with claim 9, wherein said request is based on a perceived operating condition of a diesel particulate filter. 11. A method in accordance with claim 1, wherein interrupting said sensing cycle with said modified regeneration zone comprises interrupting said active zone. 12. A method in accordance with claim 10, wherein said method further comprises a step of determining a total accumulated particulate matter which has accumulated prior to interrupting said sensing cycle with said modified regeneration zone and outputting said total accumulated particulate matter. 13. A method in accordance with claim 1, wherein interrupting said sensing cycle with said modified regeneration zone comprises interrupting said deadband zone. 14. A controller for controlling a particulate matter sensor having a pair of spaced apart electrodes and a heater, wherein accumulating particulate matter on said particulate matter sensor changes resistance and conductance between said pair of spaced apart electrodes, wherein said particulate matter sensor provides a signal that varies based upon an amount of the particulate matter on said particulate matter sensor, wherein said particulate matter sensor includes a sensing cycle that includes a deadband zone in which said resistance is greater than a first predetermined value, followed by an active zone in which said resistance is less than or equal to said first predetermined value, which is followed by a regeneration zone in which said heater is operated to elevate the temperature of said particulate matter sensor to a first predetermined temperature for a first predetermined time in order to oxidize the particulate matter accumulated on said particulate matter sensor, thereby returning said sensing cycle to said deadband zone said controller comprising:
a processor and memory storing instructions that, when carried out, causes interrupting said sensing cycle with a modified regeneration zone in which said heater is operated to elevate the temperature of said particulate matter sensor in order to oxidize the particulate matter accumulated on said particulate matter sensor, thereby returning said sensing cycle to said deadband zone, wherein said modified regeneration zone includes at least one of 1) elevating the temperature of said particulate matter sensor to a second predetermined temperature which is greater than said first predetermined temperature and 2) elevating the temperature of said particulate matter sensor for a second predetermined time which is longer than said first predetermined time. | A method of operating a particulate matter sensor having a pair of spaced apart electrodes and a heater includes accumulating particulate matter on the sensor, thereby changing resistance between the pair of spaced apart electrodes. The particulate matter sensor includes a sensing cycle that includes a deadband zone, followed by an active zone, which is followed by a regeneration zone in which the heater is operated to elevate the temperature of the particulate matter sensor to a first predetermined temperature for a first predetermined time in order to oxidize the particulate matter accumulated on the particulate matter sensor. The method also includes interrupting the sensing cycle with a modified regeneration zone which is either higher in temperature or length than the regeneration zone.1. A method of operating a particulate matter sensor having a pair of spaced apart electrodes and a heater, said method comprising the steps of:
accumulating particulate matter on said particulate matter sensor, thereby changing resistance and conductance between said pair of spaced apart electrodes, wherein said particulate matter sensor provides a signal that varies based upon an amount of the particulate matter on said particulate matter sensor, wherein said particulate matter sensor includes a sensing cycle that includes a deadband zone in which said resistance is greater than a first predetermined value, followed by an active zone in which said resistance is less than or equal to said first predetermined value, which is followed by a regeneration zone in which said heater is operated to elevate the temperature of said particulate matter sensor to a first predetermined temperature for a first predetermined time in order to oxidize the particulate matter accumulated on said particulate matter sensor, thereby returning said sensing cycle to said deadband zone; interrupting said sensing cycle with a modified regeneration zone in which said heater is operated to elevate the temperature of said particulate matter sensor in order to oxidize the particulate matter accumulated on said particulate matter sensor, thereby returning said sensing cycle to said deadband zone, wherein said modified regeneration zone includes at least one of 1) elevating the temperature of said particulate matter sensor to a second predetermined temperature which is greater than said first predetermined temperature and 2) elevating the temperature of said particulate matter sensor for a second predetermined time which is longer than said first predetermined time. 2. A method in accordance with claim 1, wherein said modified regeneration zone includes elevating the temperature of said particulate matter sensor to said second predetermined temperature and said second predetermined temperature is at least 15° C. greater than said first predetermined temperature. 3. A method in accordance with claim 1, wherein said modified regeneration zone includes elevating the temperature of said particulate matter sensor for said second predetermined time and said second predetermined time is at least 50% greater than said first predetermined time. 4. A method in accordance with claim 1, wherein said modified regeneration zone is triggered by an anomaly relating to accumulation of the particulate matter. 5. A method in accordance with claim 4, wherein said anomaly includes at least one of an occurrence of sudden increase in conductance between said pair of spaced apart electrodes on the particulate matter sensor and an occurrence of sudden decrease in conductance between said pair of spaced apart electrodes on the particulate matter sensor. 6. A method in accordance with claim 5, wherein said modified regeneration zone is triggered at least in part at by at least one of 1) said occurrence of sudden increase in conductance between said pair of spaced apart electrodes being caused by the particulate matter having an equivalent mass that is greater than or equal to a first equivalent mass threshold, 2) said occurrence of sudden increase in conductance between said pair of spaced apart electrodes occurring a predetermined number of times during said sensing cycle, and 3) said occurrence of sudden increase in conductance between said pair of spaced apart electrodes occurring one or more times during said sensing cycle such that said occurrence of sudden increase in conductance between said pair of spaced apart electrodes occurring one or more times during said sensing cycle causes apparent accumulation of the particulate matter having an equivalent mass that is greater than or equal to a second equivalent mass threshold. 7. A method in accordance with claim 6, wherein said modified regeneration zone is triggered at least in part by at least one of 1) said occurrence of sudden decrease in conductance between said pair of spaced apart electrodes being caused by a particulate matter loss having an equivalent mass that is greater than or equal to a third equivalent mass threshold, 2) said occurrence of sudden decrease in conductance between said pair of spaced apart electrodes occurring a predetermined number of times during said sensing cycle, and 3) said occurrence of sudden decrease in conductance between said pair of spaced apart electrodes occurring one or more times during said sensing cycle such that said occurrence of sudden decrease in conductance between said pair of spaced apart electrodes occurring one or more times during said sensing cycle causes loss of the particulate matter from said particulate matter sensor having an equivalent mass that is greater than or equal to a fourth equivalent mass threshold. 8. A method in accordance with claim 5, wherein said modified regeneration zone is triggered at least in part by at least one of 1) said occurrence of sudden decrease in conductance between said pair of spaced apart electrodes being caused by a particulate matter loss having an equivalent mass that is greater than or equal to a first equivalent mass threshold, 2) said occurrence of sudden decrease in conductance between said pair of spaced apart electrodes occurring a predetermined number of times during said sensing cycle, and 3) said occurrence of sudden decrease in conductance between said pair of spaced apart electrodes occurring one or more times during said sensing cycle such that said occurrence of sudden decrease in conductance between said pair of spaced apart electrodes occurring one or more times during said sensing cycle causes loss of the particulate matter from said particulate matter sensor having an equivalent mass that is greater than or equal to a second equivalent mass threshold. 9. A method in accordance with claim 1, wherein said modified regeneration zone is triggered by a request from a controller such that said request is not associated with an operating condition of said particulate matter sensor. 10. A method in accordance with claim 9, wherein said request is based on a perceived operating condition of a diesel particulate filter. 11. A method in accordance with claim 1, wherein interrupting said sensing cycle with said modified regeneration zone comprises interrupting said active zone. 12. A method in accordance with claim 10, wherein said method further comprises a step of determining a total accumulated particulate matter which has accumulated prior to interrupting said sensing cycle with said modified regeneration zone and outputting said total accumulated particulate matter. 13. A method in accordance with claim 1, wherein interrupting said sensing cycle with said modified regeneration zone comprises interrupting said deadband zone. 14. A controller for controlling a particulate matter sensor having a pair of spaced apart electrodes and a heater, wherein accumulating particulate matter on said particulate matter sensor changes resistance and conductance between said pair of spaced apart electrodes, wherein said particulate matter sensor provides a signal that varies based upon an amount of the particulate matter on said particulate matter sensor, wherein said particulate matter sensor includes a sensing cycle that includes a deadband zone in which said resistance is greater than a first predetermined value, followed by an active zone in which said resistance is less than or equal to said first predetermined value, which is followed by a regeneration zone in which said heater is operated to elevate the temperature of said particulate matter sensor to a first predetermined temperature for a first predetermined time in order to oxidize the particulate matter accumulated on said particulate matter sensor, thereby returning said sensing cycle to said deadband zone said controller comprising:
a processor and memory storing instructions that, when carried out, causes interrupting said sensing cycle with a modified regeneration zone in which said heater is operated to elevate the temperature of said particulate matter sensor in order to oxidize the particulate matter accumulated on said particulate matter sensor, thereby returning said sensing cycle to said deadband zone, wherein said modified regeneration zone includes at least one of 1) elevating the temperature of said particulate matter sensor to a second predetermined temperature which is greater than said first predetermined temperature and 2) elevating the temperature of said particulate matter sensor for a second predetermined time which is longer than said first predetermined time. | 2,800 |
12,287 | 12,287 | 15,806,086 | 2,841 | Vibration shock mitigation for components in a server rack includes a server rack comprising: a first server component chassis and a second server component chassis installed in adjacent locations within the server rack; and a chassis gap filler comprising: an elastic dampening sheet configured for placement between the first server component chassis and the second server component chassis, wherein the elastic dampening sheet is further configured to cover a portion of one side of the first server component chassis; and at least two attachment points configured to secure the elastic dampening sheet to the server rack. | 1. A server rack comprising:
a first server component chassis and a second server component chassis installed in adjacent locations within the server rack; and a chassis gap filler comprising:
an elastic dampening sheet configured for placement between the first server component chassis and the second server component chassis, wherein the elastic dampening sheet is further configured to cover a portion of one side of the first server component chassis; and
at least two attachment points configured to secure the elastic dampening sheet to the server rack. 2. The server rack of claim 1, wherein the elastic dampening sheet is perforated. 3. The server rack of claim 1, wherein at least one of the at least two attachment points is configured to secure the elastic dampening sheet to the first server component chassis. 4. The server rack of claim 1, wherein at least one of the at least two attachment points is configured to secure the elastic dampening sheet to a mounting rail of the server rack. 5. The server rack of claim 1, wherein the elastic dampening sheet has an irregular thickness. 6. The server rack of claim 1, wherein the at least two attachment points each comprise clips configured to secure the elastic dampening sheet to one selected from a group consisting of the first server component chassis and a mounting rail of the server rack. 7. The server rack of claim 1, wherein the at least two attachment points each comprise an adhesive configured to secure the elastic dampening sheet to one selected from a group consisting of the first server component chassis and a mounting rail of the server rack. 8. A server rack comprising:
a server component chassis; and a stabilizing bar attached to a top portion of the server rack and a bottom portion of the server rack comprising a flange attached to a center portion of the server component chassis. 9. The server rack of claim 8, wherein the flange is adjustable relative to the stabilizing bar. 10. The server rack of claim 8, wherein the flange comprises a friction absorbing element to absorb friction between the stabilizing bar and the server component chassis. 11. The server rack of claim 8, wherein the flange is attached to the center portion of the server component chassis using an adhesive. 12. A server rack comprising:
a server component chassis; and a shipping bracket tip plate comprising:
a first face comprising a first attachment point configured to secure the shipping bracket tip plate to the server rack; and
a second face comprising a second attachment point configured to secure the shipping bracket tip plate to a surface external to the server rack. 13. The server rack of claim 12, wherein the first attachment point and the second attachment point are perforations configured to receive fasteners. 14. The server rack of claim 12, wherein the second attachment point is further configured to secure the shipping bracket tip plate to the server component chassis. 15. The server rack of claim 12, wherein the shipping bracket tip plate further comprises a third attachment point configured to secure the shipping bracket tip plate to the server component chassis. 16. The server rack of claim 12, wherein the surface external to the server rack is a floor of a data center. | Vibration shock mitigation for components in a server rack includes a server rack comprising: a first server component chassis and a second server component chassis installed in adjacent locations within the server rack; and a chassis gap filler comprising: an elastic dampening sheet configured for placement between the first server component chassis and the second server component chassis, wherein the elastic dampening sheet is further configured to cover a portion of one side of the first server component chassis; and at least two attachment points configured to secure the elastic dampening sheet to the server rack.1. A server rack comprising:
a first server component chassis and a second server component chassis installed in adjacent locations within the server rack; and a chassis gap filler comprising:
an elastic dampening sheet configured for placement between the first server component chassis and the second server component chassis, wherein the elastic dampening sheet is further configured to cover a portion of one side of the first server component chassis; and
at least two attachment points configured to secure the elastic dampening sheet to the server rack. 2. The server rack of claim 1, wherein the elastic dampening sheet is perforated. 3. The server rack of claim 1, wherein at least one of the at least two attachment points is configured to secure the elastic dampening sheet to the first server component chassis. 4. The server rack of claim 1, wherein at least one of the at least two attachment points is configured to secure the elastic dampening sheet to a mounting rail of the server rack. 5. The server rack of claim 1, wherein the elastic dampening sheet has an irregular thickness. 6. The server rack of claim 1, wherein the at least two attachment points each comprise clips configured to secure the elastic dampening sheet to one selected from a group consisting of the first server component chassis and a mounting rail of the server rack. 7. The server rack of claim 1, wherein the at least two attachment points each comprise an adhesive configured to secure the elastic dampening sheet to one selected from a group consisting of the first server component chassis and a mounting rail of the server rack. 8. A server rack comprising:
a server component chassis; and a stabilizing bar attached to a top portion of the server rack and a bottom portion of the server rack comprising a flange attached to a center portion of the server component chassis. 9. The server rack of claim 8, wherein the flange is adjustable relative to the stabilizing bar. 10. The server rack of claim 8, wherein the flange comprises a friction absorbing element to absorb friction between the stabilizing bar and the server component chassis. 11. The server rack of claim 8, wherein the flange is attached to the center portion of the server component chassis using an adhesive. 12. A server rack comprising:
a server component chassis; and a shipping bracket tip plate comprising:
a first face comprising a first attachment point configured to secure the shipping bracket tip plate to the server rack; and
a second face comprising a second attachment point configured to secure the shipping bracket tip plate to a surface external to the server rack. 13. The server rack of claim 12, wherein the first attachment point and the second attachment point are perforations configured to receive fasteners. 14. The server rack of claim 12, wherein the second attachment point is further configured to secure the shipping bracket tip plate to the server component chassis. 15. The server rack of claim 12, wherein the shipping bracket tip plate further comprises a third attachment point configured to secure the shipping bracket tip plate to the server component chassis. 16. The server rack of claim 12, wherein the surface external to the server rack is a floor of a data center. | 2,800 |
12,288 | 12,288 | 15,581,234 | 2,864 | A method includes sensing, using a current sensing circuit of a voltage regulator, an apparent amount of current output from the voltage regulator and identifying a present value of at least one operating parameter for the voltage regulator. The method further includes determining at least one current sense correction factor as a function of the identified present value of the at least one operating parameter, and calculating a corrected amount of current output from the voltage regulator as a function of the apparent amount of the current output and the at least one current sense correction factor. Still further, the method includes reporting the corrected amount of current to an integrated circuit that receives current output from the voltage regulator. The method may be performed in an apparatus, such as a server, that includes the voltage regulator, a baseboard management controller, and the integrated circuit. | 1. A method, comprising:
sensing, using a current sensing circuit of a voltage regulator, an apparent amount of current output from a voltage regulator; identifying a present value of at least one operating parameter for the voltage regulator; determining at least one current sense correction factor as a function of the identified present value of the at least one operating parameter; calculating a corrected amount of current output from the voltage regulator as a function of the apparent amount of the current output and the at least one current sense correction factor; and reporting the corrected amount of current to an integrated circuit that receives current output from the voltage regulator. 2. The method of claim 1, wherein the at least one operating parameter is selected from cumulative power-on time, cumulative time in operation above a temperature threshold, cumulative time in operation above a current threshold, present age of the voltage regulator, and combinations thereof. 3. The method of claim 1, wherein the at least one operating parameter includes an operating parameter that is cumulative over the lifetime of the voltage regulator. 4. The method of claim 1, further comprising:
dynamically updating the at least one current sense correction factor in response to changes in the present value of the operating parameter. 5. The method of claim 1, wherein the at least one current sense correction factor in each record has been predetermined to correct for an amount of current sensing accuracy drift measured in a nominally similar voltage regulator having similar values of the one or more operating parameter. 6. The method of claim 1, wherein the at least one current sense correction factor is selected from an offset value, a gain value, and combinations thereof. 7. The method of claim 1, wherein the at least one current sense correction factor includes an offset value and a gain value. 8. The method of claim 1, wherein the integrated circuit is a central processing unit. 9. The method of claim 1, wherein the at least one operating parameter includes a plurality of operating parameters. 10. The method of claim 1, wherein determining at least one current sense correction factor as a function of the identified present value of the at least one operating parameter, includes using a lookup table to find the at least one current sense correction factor that is associated with the identified present value of the at least one operating parameter. 11. The method of claim 10, wherein the lookup table includes multiple records based on actual current sense accuracy drift data collected during operation of another voltage regulator that is nominally similar to the voltage regulator, and wherein each record includes a value for the at least one operating parameter and a value for the at least one current sense correction factor. 12. The method of claim 11, wherein the at least one current sense correction factor includes an offset value and a gain value. 13. The method of claim 12, wherein the at least one operating parameter includes accumulated power-on time. 14. An apparatus, comprising:
a voltage regulator having an electrical current output, a current sensing circuit and a current sense reporting circuit, wherein the current sensing circuit senses an apparent amount of current through the electrical current output, and wherein the current sense reporting circuit stores a current sense correction factor and calculates a corrected amount of current output from the voltage regulator as a function of the apparent amount of the current and the stored current sense correction factor; and a baseboard management controller in communication with the voltage regulator for identifying a present value of at least one operating parameter for the voltage regulator, determining a new current sense correction factor as a function of the identified present value of the at least one operating parameter, and replacing the current sense correction factor stored by the current sense reporting circuit with the new current sense correction factor; and an integrated circuit in communication with the current sense reporting circuit for receiving the corrected amount of the current output and controlling an amount of workload performed by the integrated circuit as a function of the corrected amount of the current output. 15. The apparatus of claim 14, wherein the integrated circuit is a central processing unit, and wherein the central processing unit and the baseboard management controller are installed on the motherboard of a server. 16. The apparatus of claim 14, wherein each current sense correction factor is empirically predetermined to correct for an amount of current sensing accuracy drift measured by a current sensing circuit of a nominally similar voltage regulator having similar values of the at least one operating parameter. 17. The apparatus of claim 14, wherein the at least one operating parameter is selected from cumulative power-on time, cumulative time in operation above a temperature threshold, cumulative time in operation above a current threshold, present age of the voltage regulator, and combinations thereof. 18. The apparatus of claim 14, wherein the baseboard management controller determines the new current sense correction factor using a lookup table to find a current sense correction factor that is associated with the identified present value of the at least one operating parameter. 19. The apparatus of claim 14, wherein the at least one current sense correction factor is selected from an offset value, a gain value, and combinations thereof. 20. The apparatus of claim 14, wherein the at least one current sense correction factor includes an offset value and a gain value. | A method includes sensing, using a current sensing circuit of a voltage regulator, an apparent amount of current output from the voltage regulator and identifying a present value of at least one operating parameter for the voltage regulator. The method further includes determining at least one current sense correction factor as a function of the identified present value of the at least one operating parameter, and calculating a corrected amount of current output from the voltage regulator as a function of the apparent amount of the current output and the at least one current sense correction factor. Still further, the method includes reporting the corrected amount of current to an integrated circuit that receives current output from the voltage regulator. The method may be performed in an apparatus, such as a server, that includes the voltage regulator, a baseboard management controller, and the integrated circuit.1. A method, comprising:
sensing, using a current sensing circuit of a voltage regulator, an apparent amount of current output from a voltage regulator; identifying a present value of at least one operating parameter for the voltage regulator; determining at least one current sense correction factor as a function of the identified present value of the at least one operating parameter; calculating a corrected amount of current output from the voltage regulator as a function of the apparent amount of the current output and the at least one current sense correction factor; and reporting the corrected amount of current to an integrated circuit that receives current output from the voltage regulator. 2. The method of claim 1, wherein the at least one operating parameter is selected from cumulative power-on time, cumulative time in operation above a temperature threshold, cumulative time in operation above a current threshold, present age of the voltage regulator, and combinations thereof. 3. The method of claim 1, wherein the at least one operating parameter includes an operating parameter that is cumulative over the lifetime of the voltage regulator. 4. The method of claim 1, further comprising:
dynamically updating the at least one current sense correction factor in response to changes in the present value of the operating parameter. 5. The method of claim 1, wherein the at least one current sense correction factor in each record has been predetermined to correct for an amount of current sensing accuracy drift measured in a nominally similar voltage regulator having similar values of the one or more operating parameter. 6. The method of claim 1, wherein the at least one current sense correction factor is selected from an offset value, a gain value, and combinations thereof. 7. The method of claim 1, wherein the at least one current sense correction factor includes an offset value and a gain value. 8. The method of claim 1, wherein the integrated circuit is a central processing unit. 9. The method of claim 1, wherein the at least one operating parameter includes a plurality of operating parameters. 10. The method of claim 1, wherein determining at least one current sense correction factor as a function of the identified present value of the at least one operating parameter, includes using a lookup table to find the at least one current sense correction factor that is associated with the identified present value of the at least one operating parameter. 11. The method of claim 10, wherein the lookup table includes multiple records based on actual current sense accuracy drift data collected during operation of another voltage regulator that is nominally similar to the voltage regulator, and wherein each record includes a value for the at least one operating parameter and a value for the at least one current sense correction factor. 12. The method of claim 11, wherein the at least one current sense correction factor includes an offset value and a gain value. 13. The method of claim 12, wherein the at least one operating parameter includes accumulated power-on time. 14. An apparatus, comprising:
a voltage regulator having an electrical current output, a current sensing circuit and a current sense reporting circuit, wherein the current sensing circuit senses an apparent amount of current through the electrical current output, and wherein the current sense reporting circuit stores a current sense correction factor and calculates a corrected amount of current output from the voltage regulator as a function of the apparent amount of the current and the stored current sense correction factor; and a baseboard management controller in communication with the voltage regulator for identifying a present value of at least one operating parameter for the voltage regulator, determining a new current sense correction factor as a function of the identified present value of the at least one operating parameter, and replacing the current sense correction factor stored by the current sense reporting circuit with the new current sense correction factor; and an integrated circuit in communication with the current sense reporting circuit for receiving the corrected amount of the current output and controlling an amount of workload performed by the integrated circuit as a function of the corrected amount of the current output. 15. The apparatus of claim 14, wherein the integrated circuit is a central processing unit, and wherein the central processing unit and the baseboard management controller are installed on the motherboard of a server. 16. The apparatus of claim 14, wherein each current sense correction factor is empirically predetermined to correct for an amount of current sensing accuracy drift measured by a current sensing circuit of a nominally similar voltage regulator having similar values of the at least one operating parameter. 17. The apparatus of claim 14, wherein the at least one operating parameter is selected from cumulative power-on time, cumulative time in operation above a temperature threshold, cumulative time in operation above a current threshold, present age of the voltage regulator, and combinations thereof. 18. The apparatus of claim 14, wherein the baseboard management controller determines the new current sense correction factor using a lookup table to find a current sense correction factor that is associated with the identified present value of the at least one operating parameter. 19. The apparatus of claim 14, wherein the at least one current sense correction factor is selected from an offset value, a gain value, and combinations thereof. 20. The apparatus of claim 14, wherein the at least one current sense correction factor includes an offset value and a gain value. | 2,800 |
12,289 | 12,289 | 16,059,621 | 2,847 | Articles comprising a substrate having a first major surface; an electrical conductor pattern on the first major surface of the substrate, the electrical conductor pattern comprising a plurality of separated pairs of separated first and second electrically conductive metallic traces. Optionally the articles further comprise a first electrically conductive layer. Embodiments of articles described herein are useful in, for example, displays, touch sensors, lighting elements, photovoltaic cells, electrochromic windows and displays, and electroluminescent lamps and displays. | 1. An article comprising:
a substrate having a first major surface; an electrical conductor pattern on the first major surface of the substrate, the electrical conductor pattern comprising:
a plurality of separated pairs of separated first and second electrically conductive metallic traces, the first and second electrically conductive metallic traces of each pair of the plurality of pairs having a length of overlap relative to each other of at least 5 times their separation distance, having a thickness in a range from 10 nanometers to 20 micrometers, and being separated from each other by up to 25 micrometers; and
an electrically conductive layer having first and second generally opposed major surfaces, wherein a major surface of the electrically conductive layer is in contact with at least a portion of the plurality of pairs of first and second electrically conductive metallic traces. 2. The article of claim 1, wherein adjacent electrically conductive metallic traces of adjacent pairs within the plurality of pairs have a length of overlap relative to each other of at least 5 times their separation distance. 3. The article of claim 1, wherein the electrical conductor pattern has an open area fraction greater than 80%. 4. The article of claim 1, wherein each electrically conductive metallic trace of a pair is separated from each other by up to 10 micrometers; the electrically conductive metallic traces have widths not greater than 15 micrometers; and the electrically conductive metallic traces have lengths of at least 50 micrometers. 5. The article of claim 1, wherein the first and second electrically conductive metallic traces of each pair of the plurality of pairs have a length of overlap relative to each other of at least 10 times their separation distance. 6. The article of claim 1, wherein the substrate is transparent. 7. The article of claim 1, wherein the first and second electrically conductive metallic traces are branched. 8. (canceled) 9. The article of claim 1, wherein the electrically conductive layer is transparent and comprises at least one of metal oxide, metal nanowires, electrically conducting polymer, carbon nanotubes, or graphene. 10. The article of claim 1, wherein the electrically conductive layer is patterned and comprises first and second, separated regions. 11. The article of claim 1, wherein the plurality of pairs of first and second electrically conductive metallic traces generally form a pseudo-random two-dimensional network. 12. The article of claim 1, wherein for at least a portion of the pairs of first and second electrically conductive metallic traces the traces are complementarily tapered relative to each other. 13. The article of claim 1, wherein the electrically conductive layer is disposed between the substrate and the plurality of pairs of first and second electrically conductive metallic traces. 14. The article of claim 1, wherein the plurality of pairs of first and second electrically conductive metallic traces generally form a repeating series of lines or a two-dimensional network. 15. The article of claim 1, wherein the plurality of pairs of first and second electrically conductive metallic traces is disposed between the substrate and the electrically conductive layer. 16. The article of claim 1, wherein the electrically conductive layer has an electrical sheet resistance of not greater than 5000 ohm/square. 17. The article of claim 10, further comprising a first address trace electrically connected to the first region and a second address trace electrically connected to the second region. 18. The article of claim 1, wherein the electrically conductive metal traces have an electrical sheet resistance of not greater than 5 ohm/square. 19. A method of making an article, the method comprising:
(a) providing a substrate having a first major surface; (b) providing electrically conductive metallic traces by at least one of:
depositing a plurality of separated pairs of separated first and second electrically conductive metallic traces onto the first major surface of the substrate; or
providing a metal layer onto the first major surface of the substrate; and etching the metal layer to provide a plurality of separated pairs of separated first and second electrically conductive metallic traces onto the first major surface of the substrate; and
(c) depositing an electrically conductive layer on the plurality of first and second electrically conductive metallic traces,
wherein the first and second electrically conductive metallic traces of each pair of the plurality of pairs having a length of overlap relative to each other of at least 5 times their separation distance, having a thickness in a range from 10 nanometers to 20 micrometers, and being separated from each other by up to 25 micrometers. | Articles comprising a substrate having a first major surface; an electrical conductor pattern on the first major surface of the substrate, the electrical conductor pattern comprising a plurality of separated pairs of separated first and second electrically conductive metallic traces. Optionally the articles further comprise a first electrically conductive layer. Embodiments of articles described herein are useful in, for example, displays, touch sensors, lighting elements, photovoltaic cells, electrochromic windows and displays, and electroluminescent lamps and displays.1. An article comprising:
a substrate having a first major surface; an electrical conductor pattern on the first major surface of the substrate, the electrical conductor pattern comprising:
a plurality of separated pairs of separated first and second electrically conductive metallic traces, the first and second electrically conductive metallic traces of each pair of the plurality of pairs having a length of overlap relative to each other of at least 5 times their separation distance, having a thickness in a range from 10 nanometers to 20 micrometers, and being separated from each other by up to 25 micrometers; and
an electrically conductive layer having first and second generally opposed major surfaces, wherein a major surface of the electrically conductive layer is in contact with at least a portion of the plurality of pairs of first and second electrically conductive metallic traces. 2. The article of claim 1, wherein adjacent electrically conductive metallic traces of adjacent pairs within the plurality of pairs have a length of overlap relative to each other of at least 5 times their separation distance. 3. The article of claim 1, wherein the electrical conductor pattern has an open area fraction greater than 80%. 4. The article of claim 1, wherein each electrically conductive metallic trace of a pair is separated from each other by up to 10 micrometers; the electrically conductive metallic traces have widths not greater than 15 micrometers; and the electrically conductive metallic traces have lengths of at least 50 micrometers. 5. The article of claim 1, wherein the first and second electrically conductive metallic traces of each pair of the plurality of pairs have a length of overlap relative to each other of at least 10 times their separation distance. 6. The article of claim 1, wherein the substrate is transparent. 7. The article of claim 1, wherein the first and second electrically conductive metallic traces are branched. 8. (canceled) 9. The article of claim 1, wherein the electrically conductive layer is transparent and comprises at least one of metal oxide, metal nanowires, electrically conducting polymer, carbon nanotubes, or graphene. 10. The article of claim 1, wherein the electrically conductive layer is patterned and comprises first and second, separated regions. 11. The article of claim 1, wherein the plurality of pairs of first and second electrically conductive metallic traces generally form a pseudo-random two-dimensional network. 12. The article of claim 1, wherein for at least a portion of the pairs of first and second electrically conductive metallic traces the traces are complementarily tapered relative to each other. 13. The article of claim 1, wherein the electrically conductive layer is disposed between the substrate and the plurality of pairs of first and second electrically conductive metallic traces. 14. The article of claim 1, wherein the plurality of pairs of first and second electrically conductive metallic traces generally form a repeating series of lines or a two-dimensional network. 15. The article of claim 1, wherein the plurality of pairs of first and second electrically conductive metallic traces is disposed between the substrate and the electrically conductive layer. 16. The article of claim 1, wherein the electrically conductive layer has an electrical sheet resistance of not greater than 5000 ohm/square. 17. The article of claim 10, further comprising a first address trace electrically connected to the first region and a second address trace electrically connected to the second region. 18. The article of claim 1, wherein the electrically conductive metal traces have an electrical sheet resistance of not greater than 5 ohm/square. 19. A method of making an article, the method comprising:
(a) providing a substrate having a first major surface; (b) providing electrically conductive metallic traces by at least one of:
depositing a plurality of separated pairs of separated first and second electrically conductive metallic traces onto the first major surface of the substrate; or
providing a metal layer onto the first major surface of the substrate; and etching the metal layer to provide a plurality of separated pairs of separated first and second electrically conductive metallic traces onto the first major surface of the substrate; and
(c) depositing an electrically conductive layer on the plurality of first and second electrically conductive metallic traces,
wherein the first and second electrically conductive metallic traces of each pair of the plurality of pairs having a length of overlap relative to each other of at least 5 times their separation distance, having a thickness in a range from 10 nanometers to 20 micrometers, and being separated from each other by up to 25 micrometers. | 2,800 |
12,290 | 12,290 | 14,713,638 | 2,857 | A system includes a processor configured to receive recorded weather-related observation data from a plurality of vehicles in a building locality. The processor is also configured to combine the received weather-related observation data with remote weather data received from a remote source. Further, the processor is configured to determine a weather pattern developing in the building locality based on the combined weather-related observation data and remote weather data. | 1. A system comprising:
a processor configured to: receive recorded weather-related observation data from a plurality of vehicles in a building locality; combine the received weather-related observation data with remote weather data received from a remote source; and determine a weather pattern developing in the building locality based on the combined weather-related observation data and the remote weather data. 2. The system of claim 1, wherein the building locality is a building parking lot. 3. The system of claim 1, wherein the observation data includes wind direction and speed data represented by readings from vehicle accelerometers. 4. The system of claim 1, wherein the observation data includes visibility data represented by readings from vehicle pyrometers. 5. The system of claim 1, wherein the observation data includes precipitation data represented by readings from vehicle rain sensors. 6. The system of claim 1, wherein the observation data includes data gathered by vehicle barometers, humidity measuring devices, microphones, infrared sensors or ultrasonic sensors. 7. The system of claim 1, wherein the processor is further configured to:
determine a data type needed to enhance weather pattern determination for a present weather pattern; and request data corresponding to the determined data type from the plurality of vehicles. 8. The system of claim 7, wherein the request is made to all of the plurality of vehicles. 9. The system of claim 7, wherein the processor is further configured to determine a non-zero subset of less than all of the plurality of vehicles, wherein location characteristics of vehicles in the subset correlate to weather pattern determination, and wherein the request is made to the non-zero subset of vehicles. 10. The system of claim 7, wherein the processor is further configured to determine a non-zero subset of less than all of the plurality of vehicles, wherein sensing capabilities of vehicles in the subset correspond to a particular weather pattern determination, and wherein the request is made to the non-zero subset of vehicles. 11. A system comprising:
a processor configured to: receive data, indicating a light source presence, from a first vehicle providing the light source; receive data, indicating a light source strength, from a second vehicle having a sensor capable of detecting the light source; compare the received strength data from the second vehicle to stored strength data previously received from the second vehicle; and determine a change in visibility based on the compared data. 12. The system of claim 11, wherein the processor is configured to identify one or more candidate vehicles as suitable second vehicles based on a location and heading of the candidate vehicles received from the candidate vehicles. 13. The system of claim 12, wherein the processor is further configured to identify the one or more candidate vehicles as suitable second vehicles based on a location and heading of the first vehicle received from the first vehicle. 14. The system of claim 11, wherein the processor is configured to notify the second vehicle when the first vehicle is providing the light source. 15. The system of claim 11, wherein the processor is located in a building and the first and second vehicles are located within a predefined distance from the building. 16. The system of claim 15, wherein the predefined distance is defined by geographic boundaries assigned to a building parking lot associated with the building. 17. A system comprising:
a processor configured to: receive wind data from a plurality of vehicles located within a predefined distance of each other and more than a predefined distance apart from each other; compare directional wind data included with the wind data; and determine a shape of a local wind pattern based on the comparison. 18. The system of claim 17, wherein the wind data also includes wind force data. 19. The system of claim 17, wherein the processor is further configured to issue an based on the shape of the local wind pattern. 20. The system of claim 17, wherein the processor is further configured to request and receive repeated updated wind data from the plurality of vehicles if the shape of the local wind pattern corresponds to a shape associated with a dangerous condition forming, persisting until at least the shape of the local wind pattern no longer indicates the dangerous condition. | A system includes a processor configured to receive recorded weather-related observation data from a plurality of vehicles in a building locality. The processor is also configured to combine the received weather-related observation data with remote weather data received from a remote source. Further, the processor is configured to determine a weather pattern developing in the building locality based on the combined weather-related observation data and remote weather data.1. A system comprising:
a processor configured to: receive recorded weather-related observation data from a plurality of vehicles in a building locality; combine the received weather-related observation data with remote weather data received from a remote source; and determine a weather pattern developing in the building locality based on the combined weather-related observation data and the remote weather data. 2. The system of claim 1, wherein the building locality is a building parking lot. 3. The system of claim 1, wherein the observation data includes wind direction and speed data represented by readings from vehicle accelerometers. 4. The system of claim 1, wherein the observation data includes visibility data represented by readings from vehicle pyrometers. 5. The system of claim 1, wherein the observation data includes precipitation data represented by readings from vehicle rain sensors. 6. The system of claim 1, wherein the observation data includes data gathered by vehicle barometers, humidity measuring devices, microphones, infrared sensors or ultrasonic sensors. 7. The system of claim 1, wherein the processor is further configured to:
determine a data type needed to enhance weather pattern determination for a present weather pattern; and request data corresponding to the determined data type from the plurality of vehicles. 8. The system of claim 7, wherein the request is made to all of the plurality of vehicles. 9. The system of claim 7, wherein the processor is further configured to determine a non-zero subset of less than all of the plurality of vehicles, wherein location characteristics of vehicles in the subset correlate to weather pattern determination, and wherein the request is made to the non-zero subset of vehicles. 10. The system of claim 7, wherein the processor is further configured to determine a non-zero subset of less than all of the plurality of vehicles, wherein sensing capabilities of vehicles in the subset correspond to a particular weather pattern determination, and wherein the request is made to the non-zero subset of vehicles. 11. A system comprising:
a processor configured to: receive data, indicating a light source presence, from a first vehicle providing the light source; receive data, indicating a light source strength, from a second vehicle having a sensor capable of detecting the light source; compare the received strength data from the second vehicle to stored strength data previously received from the second vehicle; and determine a change in visibility based on the compared data. 12. The system of claim 11, wherein the processor is configured to identify one or more candidate vehicles as suitable second vehicles based on a location and heading of the candidate vehicles received from the candidate vehicles. 13. The system of claim 12, wherein the processor is further configured to identify the one or more candidate vehicles as suitable second vehicles based on a location and heading of the first vehicle received from the first vehicle. 14. The system of claim 11, wherein the processor is configured to notify the second vehicle when the first vehicle is providing the light source. 15. The system of claim 11, wherein the processor is located in a building and the first and second vehicles are located within a predefined distance from the building. 16. The system of claim 15, wherein the predefined distance is defined by geographic boundaries assigned to a building parking lot associated with the building. 17. A system comprising:
a processor configured to: receive wind data from a plurality of vehicles located within a predefined distance of each other and more than a predefined distance apart from each other; compare directional wind data included with the wind data; and determine a shape of a local wind pattern based on the comparison. 18. The system of claim 17, wherein the wind data also includes wind force data. 19. The system of claim 17, wherein the processor is further configured to issue an based on the shape of the local wind pattern. 20. The system of claim 17, wherein the processor is further configured to request and receive repeated updated wind data from the plurality of vehicles if the shape of the local wind pattern corresponds to a shape associated with a dangerous condition forming, persisting until at least the shape of the local wind pattern no longer indicates the dangerous condition. | 2,800 |
12,291 | 12,291 | 15,751,408 | 2,856 | A method for detecting a fault during operation of an internal combustion engine having manifold injection and direct injection; the internal combustion engine being controlled in two different combustion cycles, in each instance, for introducing a fuel quantity and a corresponding air quantity into a combustion chamber of the internal combustion engine, with different distributions of the fuel quantity to the manifold injection and the direct injection in the two combustion cycles; for each of the two combustion cycles, a value of a ratio of the air quantity introduced into the combustion chamber to the fuel quantity introduced into the combustion chamber being ascertained; and if at least one of the two values differs from a corresponding comparison value by more than a first threshold value, a type of fault during operation of the internal combustion engine being deduced in light of the difference. | 1-14. (canceled) 15. A method for detecting a fault during operation of an internal combustion engine having manifold injection and direct injection. the method comprising:
controlling the internal combustion engine in two different combustion cycles, in each instance, for introducing a fuel quantity and a corresponding air quantity into a combustion chamber of the internal combustion engine, with different distribution of the fuel quantity to the manifold injection and the direct injection in each of the two combustion cycles; for each of the two combustion cycles, ascertaining a value of a ratio of the air quantity introduced into the combustion chamber to the fuel quantity introduced into the combustion chamber; and if at least one of the two values differs from a corresponding comparison value by more than a first threshold value, deducing a type of the fault during operation of the internal combustion engine in light of the difference. 16. The method as recited in claim 15, wherein the distribution of the fuel quantity includes a pure manifold injection and a pure direct injection. 17. The method as recited in claim 15, wherein if only one of the two values differs from the corresponding comparison value by more than the first threshold value, a functional limitation of a fuel injector of the injection type belonging to the differing value is deduced. 18. The method as recited in claim 17, wherein a functional limitation of the fuel injector is only deduced, if, in addition, the two values also differ from one another by more than a second threshold value. 19. The method as recited in claim 17, wherein the functional limitation of the fuel injector includes one of a defect, a partial defect, or contamination, as different types of the functional limitation, and in light of a magnitude of the difference of the respective value from the corresponding comparison value, the type of difference is deduced. 20. The method as recited in claim 15, wherein if the two values differ from the respective, corresponding comparison value by more than the first threshold value, a functional limitation in an air supply in an air-mass metering for the combustion chamber is deduced. 21. The method as recited in claim 20, wherein a functional limitation in an air supply is only deduced, if, in addition, the two values also differ from one another by less than a third threshold value. 22. The method as recited in claim 15, wherein the ratio of the air quantity introduced into the combustion chamber to the fuel quantity introduced into the combustion chamber is ascertained with the aid of at least one of: (i) an oxygen sensor, (ii) an engine speed fluctuation in the respective combustion cycle, and (iii) a pressure sensor in the combustion chamber. 23. The method as recited in claim 15, wherein the type of fault is ascertained for each combustion chamber of the internal combustion engine. 24. The method as recited in claim 23, wherein if the ratios of the air quantities introduced into the combustion chambers to the respective fuel quantities introduced into the combustion chambers are ascertained for a plurality of combustion chambers with the aid of an oxygen sensor, the corresponding ratios of the individual combustion chambers are ascertained in view of at least one of valve control times, gas transit times, and reaction times of the oxygen sensor. 25. The method as recited in claim 1, wherein differences at least one of: of the values from the comparison values, and from each other are ascertained one of relatively or absolutely, if, in the two combustion cycles, at least substantially the same fuel quantity and air quantity are specified. 26. An arithmetic unit, which is configured to detect a fault during operation of an internal combustion engine having manifold injection and direct injection. the arithmetic unit configured to:
control the internal combustion engine in two different combustion cycles, in each instance, for introducing a fuel quantity and a corresponding air quantity into a combustion chamber of the internal combustion engine, with different distribution of the fuel quantity to the manifold injection and the direct injection in each of the two combustion cycles; for each of the two combustion cycles, ascertain a value of a ratio of the air quantity introduced into the combustion chamber to the fuel quantity introduced into the combustion chamber; and if at least one of the two values differs from a corresponding comparison value by more than a first threshold value, deduce a type of the fault during operation of the internal combustion engine in light of the difference. 27. A non-transitory machine-readable storage medium on which is stored a computer program for detecting a fault during operation of an internal combustion engine having manifold injection and direct injection. the computer program, when executed by a processor, causing the processor to perform:
controlling the internal combustion engine in two different combustion cycles, in each instance, for introducing a fuel quantity and a corresponding air quantity into a combustion chamber of the internal combustion engine, with different distribution of the fuel quantity to the manifold injection and the direct injection in each of the two combustion cycles; for each of the two combustion cycles, ascertaining a value of a ratio of the air quantity introduced into the combustion chamber to the fuel quantity introduced into the combustion chamber; and if at least one of the two values differs from a corresponding comparison value by more than a first threshold value, deducing a type of the fault during operation of the internal combustion engine in light of the difference. | A method for detecting a fault during operation of an internal combustion engine having manifold injection and direct injection; the internal combustion engine being controlled in two different combustion cycles, in each instance, for introducing a fuel quantity and a corresponding air quantity into a combustion chamber of the internal combustion engine, with different distributions of the fuel quantity to the manifold injection and the direct injection in the two combustion cycles; for each of the two combustion cycles, a value of a ratio of the air quantity introduced into the combustion chamber to the fuel quantity introduced into the combustion chamber being ascertained; and if at least one of the two values differs from a corresponding comparison value by more than a first threshold value, a type of fault during operation of the internal combustion engine being deduced in light of the difference.1-14. (canceled) 15. A method for detecting a fault during operation of an internal combustion engine having manifold injection and direct injection. the method comprising:
controlling the internal combustion engine in two different combustion cycles, in each instance, for introducing a fuel quantity and a corresponding air quantity into a combustion chamber of the internal combustion engine, with different distribution of the fuel quantity to the manifold injection and the direct injection in each of the two combustion cycles; for each of the two combustion cycles, ascertaining a value of a ratio of the air quantity introduced into the combustion chamber to the fuel quantity introduced into the combustion chamber; and if at least one of the two values differs from a corresponding comparison value by more than a first threshold value, deducing a type of the fault during operation of the internal combustion engine in light of the difference. 16. The method as recited in claim 15, wherein the distribution of the fuel quantity includes a pure manifold injection and a pure direct injection. 17. The method as recited in claim 15, wherein if only one of the two values differs from the corresponding comparison value by more than the first threshold value, a functional limitation of a fuel injector of the injection type belonging to the differing value is deduced. 18. The method as recited in claim 17, wherein a functional limitation of the fuel injector is only deduced, if, in addition, the two values also differ from one another by more than a second threshold value. 19. The method as recited in claim 17, wherein the functional limitation of the fuel injector includes one of a defect, a partial defect, or contamination, as different types of the functional limitation, and in light of a magnitude of the difference of the respective value from the corresponding comparison value, the type of difference is deduced. 20. The method as recited in claim 15, wherein if the two values differ from the respective, corresponding comparison value by more than the first threshold value, a functional limitation in an air supply in an air-mass metering for the combustion chamber is deduced. 21. The method as recited in claim 20, wherein a functional limitation in an air supply is only deduced, if, in addition, the two values also differ from one another by less than a third threshold value. 22. The method as recited in claim 15, wherein the ratio of the air quantity introduced into the combustion chamber to the fuel quantity introduced into the combustion chamber is ascertained with the aid of at least one of: (i) an oxygen sensor, (ii) an engine speed fluctuation in the respective combustion cycle, and (iii) a pressure sensor in the combustion chamber. 23. The method as recited in claim 15, wherein the type of fault is ascertained for each combustion chamber of the internal combustion engine. 24. The method as recited in claim 23, wherein if the ratios of the air quantities introduced into the combustion chambers to the respective fuel quantities introduced into the combustion chambers are ascertained for a plurality of combustion chambers with the aid of an oxygen sensor, the corresponding ratios of the individual combustion chambers are ascertained in view of at least one of valve control times, gas transit times, and reaction times of the oxygen sensor. 25. The method as recited in claim 1, wherein differences at least one of: of the values from the comparison values, and from each other are ascertained one of relatively or absolutely, if, in the two combustion cycles, at least substantially the same fuel quantity and air quantity are specified. 26. An arithmetic unit, which is configured to detect a fault during operation of an internal combustion engine having manifold injection and direct injection. the arithmetic unit configured to:
control the internal combustion engine in two different combustion cycles, in each instance, for introducing a fuel quantity and a corresponding air quantity into a combustion chamber of the internal combustion engine, with different distribution of the fuel quantity to the manifold injection and the direct injection in each of the two combustion cycles; for each of the two combustion cycles, ascertain a value of a ratio of the air quantity introduced into the combustion chamber to the fuel quantity introduced into the combustion chamber; and if at least one of the two values differs from a corresponding comparison value by more than a first threshold value, deduce a type of the fault during operation of the internal combustion engine in light of the difference. 27. A non-transitory machine-readable storage medium on which is stored a computer program for detecting a fault during operation of an internal combustion engine having manifold injection and direct injection. the computer program, when executed by a processor, causing the processor to perform:
controlling the internal combustion engine in two different combustion cycles, in each instance, for introducing a fuel quantity and a corresponding air quantity into a combustion chamber of the internal combustion engine, with different distribution of the fuel quantity to the manifold injection and the direct injection in each of the two combustion cycles; for each of the two combustion cycles, ascertaining a value of a ratio of the air quantity introduced into the combustion chamber to the fuel quantity introduced into the combustion chamber; and if at least one of the two values differs from a corresponding comparison value by more than a first threshold value, deducing a type of the fault during operation of the internal combustion engine in light of the difference. | 2,800 |
12,292 | 12,292 | 16,033,114 | 2,847 | A plurality of different sized and shaped lightweight, shielded enclosures can be configured from a plurality of lightweight, shielded walls that attenuate one or more electromagnetic frequencies. | 1. A lightweight, shielded accredited enclosure comprising:
a plurality of lightweight, shielded components that form one or more walls of the enclosure, where each component is configured to attenuate one or more electromagnetic frequencies. 2. The enclosure in claim 1 wherein the plurality of lightweight shielded components comprise overlappingly configured panels. 3. The enclosure as in claim 1 wherein the enclosure comprises a pressurized enclosure to provide protection from chemical, biological and radioactive material. 4. The enclosure as in claim 3 further comprising one or more air pressure monitors for monitoring the pressure inside the enclosure. 5. The enclosure as in claim 1 wherein the enclosure comprises a single chamber, the chamber comprising a single layer of the lightweight shielded components. 6. The enclosure as in claim 1 wherein the enclosure comprises a single chamber, the chamber comprising a plurality of layers of the lightweight shielded components. 7. The enclosure as in claim 1 wherein each component is configured to attenuate one or more different or the same range of electromagnetic frequencies. 8. The enclosure as in claim 1 further comprising a second enclosure within the enclosure or surrounding the enclosure, the second enclosure comprises one or more layers of a plurality of overlapping, shielded components. 9. The enclosure as in claim 1 further comprising a second enclosure that includes one or more layers of a plurality of overlapping, shielded components that form walls that are substantially concentric with walls of the enclosure. 10. The enclosure as in claim 1 wherein each lightweight shielded component comprises one or more integral layers of a conductive membrane, dielectric or a non-conductive core. 11. The enclosure as in claim 1 wherein one or more of the lightweight shielded components comprise one or more of the layers of a ballistic material. 12. The enclosure a in claim 1 further comprising one or more surveillance cameras. 13. A method for forming a lightweight, shielded accredited enclosure comprising:
connecting a plurality of lightweight, shielded components to form one or more walls of the accredited enclosure to support the enclosure, wherein each component of the plurality of lightweight shielded components attenuates one or more electromagnetic frequencies. 14. The method as in claim 13 further comprising pressurizing the enclosure to provide protection from chemical, biological and radioactive material. 15. The method as in claim 13 further comprising monitoring the pressure inside the enclosure. 16. The method as in claim 13 further comprising forming the enclosure as a single chamber, the chamber comprising a single layer of the lightweight shielded components. 17. The method as in claim 13 further comprising forming the enclosure as a single chamber, the chamber comprising a plurality of layers of the lightweight shielded components. 18. The method as in claim 17 further comprising attenuating a range of one or more frequencies for each component or layer of components. 19. The method as in claim 13 further comprising forming a second enclosure within the enclosure or surrounding the enclosure, the second enclosure comprises one or more layers of a plurality of overlapping, shielded components that form walls. 20. The method as in claim 13 wherein each lightweight shielded component comprises one or more integral layers of a conductive membrane, dielectric, non-conductive core or ballistic material. | A plurality of different sized and shaped lightweight, shielded enclosures can be configured from a plurality of lightweight, shielded walls that attenuate one or more electromagnetic frequencies.1. A lightweight, shielded accredited enclosure comprising:
a plurality of lightweight, shielded components that form one or more walls of the enclosure, where each component is configured to attenuate one or more electromagnetic frequencies. 2. The enclosure in claim 1 wherein the plurality of lightweight shielded components comprise overlappingly configured panels. 3. The enclosure as in claim 1 wherein the enclosure comprises a pressurized enclosure to provide protection from chemical, biological and radioactive material. 4. The enclosure as in claim 3 further comprising one or more air pressure monitors for monitoring the pressure inside the enclosure. 5. The enclosure as in claim 1 wherein the enclosure comprises a single chamber, the chamber comprising a single layer of the lightweight shielded components. 6. The enclosure as in claim 1 wherein the enclosure comprises a single chamber, the chamber comprising a plurality of layers of the lightweight shielded components. 7. The enclosure as in claim 1 wherein each component is configured to attenuate one or more different or the same range of electromagnetic frequencies. 8. The enclosure as in claim 1 further comprising a second enclosure within the enclosure or surrounding the enclosure, the second enclosure comprises one or more layers of a plurality of overlapping, shielded components. 9. The enclosure as in claim 1 further comprising a second enclosure that includes one or more layers of a plurality of overlapping, shielded components that form walls that are substantially concentric with walls of the enclosure. 10. The enclosure as in claim 1 wherein each lightweight shielded component comprises one or more integral layers of a conductive membrane, dielectric or a non-conductive core. 11. The enclosure as in claim 1 wherein one or more of the lightweight shielded components comprise one or more of the layers of a ballistic material. 12. The enclosure a in claim 1 further comprising one or more surveillance cameras. 13. A method for forming a lightweight, shielded accredited enclosure comprising:
connecting a plurality of lightweight, shielded components to form one or more walls of the accredited enclosure to support the enclosure, wherein each component of the plurality of lightweight shielded components attenuates one or more electromagnetic frequencies. 14. The method as in claim 13 further comprising pressurizing the enclosure to provide protection from chemical, biological and radioactive material. 15. The method as in claim 13 further comprising monitoring the pressure inside the enclosure. 16. The method as in claim 13 further comprising forming the enclosure as a single chamber, the chamber comprising a single layer of the lightweight shielded components. 17. The method as in claim 13 further comprising forming the enclosure as a single chamber, the chamber comprising a plurality of layers of the lightweight shielded components. 18. The method as in claim 17 further comprising attenuating a range of one or more frequencies for each component or layer of components. 19. The method as in claim 13 further comprising forming a second enclosure within the enclosure or surrounding the enclosure, the second enclosure comprises one or more layers of a plurality of overlapping, shielded components that form walls. 20. The method as in claim 13 wherein each lightweight shielded component comprises one or more integral layers of a conductive membrane, dielectric, non-conductive core or ballistic material. | 2,800 |
12,293 | 12,293 | 14,272,622 | 2,853 | A micro-valve includes an orifice plate including an orifice and a cantilevered beam coupled in spaced relation to the orifice plate and moveable between positions where the orifice is closed and opened by the cantilevered beam. The cantilevered beam includes one or more piezoelectric layers that facilitate bending of the cantilevered beam in response to the application of one or more electrical signals to the one or more piezoelectric layers. In response to respective application and termination of the one or more electrical signals to the one or more piezoelectric layers the cantilevered beam either: moves from a starting position spaced from the orifice plate toward the orifice plate and returns back to the starting position spaced from the orifice plate; or moves from a starting position adjacent the orifice plate away from the orifice plate and returns back to the starting position adjacent the orifice plate. | 1. A micro-valve system comprising:
an orifice plate including an orifice; and a cantilevered beam coupled in spaced relation to the orifice plate and moveable between positions where the orifice is closed and opened by the cantilevered beam, wherein: the cantilevered beam is comprised of one or more piezoelectric layers that facilitate bending of the cantilevered beam in response to the application of one or more electrical signals to the one or more piezoelectric layers; and in response to respective application and termination of the one or more electrical signals to the one or more piezoelectric layers, the cantilevered beam either:
moves from a starting position spaced from the orifice plate toward the orifice plate and returns back to the starting position spaced from the orifice plate; or
moves from a starting position adjacent the orifice plate away from the orifice plate and returns back to the starting position adjacent the orifice plate. 2. The micro-valve system of claim 1, wherein the cantilevered beam includes a pair of piezoelectric layers that are spaced from each other and spaced from the orifice plate, wherein the cantilevered beam is responsive to either:
application of a first electrical signal to one of the pair of piezoelectric layers to bend from the starting position spaced from the orifice plate toward the orifice plate and termination of the first electrical signal and application of a second electrical signal to the other of the pair of piezoelectric layers to return back to the starting position spaced from the orifice plate; or application of a first electrical signal to one of the pair of piezoelectric layers to bend from the starting position adjacent the orifice plate away from the orifice plate and termination of the first electrical signal and application of a second electrical signal to the other of the pair of piezoelectric layers to return back to the starting position adjacent the orifice plate. 3. The micro-valve system of claim 1, wherein the cantilevered beam at its proximal end is coupled to the orifice plate and the cantilevered beam at its distal end is moveable between positions where the orifice is closed and opened. 4. The micro-valve system of claim 1, wherein the cantilevered beam bending toward the orifice plate closes the orifice. 5. The micro-valve system of claim 1, wherein the cantilevered beam further includes a layer of material that causes the cantilevered beam to have a bend in the absence of the one or more electrical signals being applied to the one or more piezoelectric layers 6. The micro-valve system of claim 5, wherein thicker and thinner thicknesses of the layer of material cause the cantilevered beam to have more and less bend, respectively, in the absence of the one or more electrical signals being applied to the one or more piezoelectric layers. 7. The micro-valve system of claim 1, wherein:
The cantilevered beam includes a plurality of layers; and in plan view, at least one of the layers of the cantilevered beam has one or a combination of the following shapes: rectangular, trapezoidal, polygon and curvilinear. 8. The micro-valve system of claim 1, further including means for sealing the orifice when the cantilevered beam bends towards the orifice plate. 9. The micro-valve system of claim 8, wherein the means for sealing the orifice includes at least one of the following:
a raised surface on the distal end of the cantilevered beam; and/or a raised surface on the orifice plate surrounding the orifice. 10. The micro-valve system of claim 1, further including:
a plurality of orifices in the orifice plate; and a plurality of the cantilevered beams disposed in spaced relation to the orifice plate, wherein each cantilevered beam is moveable between positions where one of the plurality of orifices is closed and opened by said cantilevered beam. 11. The micro-valve system of claim 10, wherein the plurality of cantilevered beams is arranged side-by-side, interdigitated, or in an x, y array. 12. The micro-valve system of claim 1, further including an output manifold coupled to a side of the orifice plate opposite the cantilevered beam. 13. The micro-valve system of claim 12, wherein the output manifold includes one or more paths each of which is configured to direct fluid output through each orifice in communication with said path in a predetermined direction. 14. A micro-valve system of claim 1, wherein at least one of the piezoelectric layers does not extend to a distal end of the cantilever beam. 15. A printhead comprising:
an input manifold; and a plurality of micro-valves coupled to the input manifold, wherein the plurality of micro-valves includes an orifice plate including a plurality of orifices and a plurality of cantilevered beams disposed in spaced relation to the orifice plate, wherein each cantilevered beam is moveable between positions where one of the plurality of orifices is closed and opened by the cantilevered beam, wherein: each cantilevered beam is comprised of one or more piezoelectric layers that facilitate bending of the cantilevered beam in response to the application of one or more electrical signals to the one or more piezoelectric layers; and in response to respective application and termination of the one or more electrical signals to the one or more piezoelectric layers, the cantilevered beam either:
moves from a starting position spaced from the orifice plate toward the orifice plate and to return back to the starting position spaced from the orifice plate; or
moves from a starting position adjacent the orifice plate away from the orifice plate and to return back to the starting position adjacent the orifice plate. 16. The printhead of claim 15, wherein at least one cantilevered beam includes a pair of piezoelectric layers that are spaced from each other and spaced from the orifice plate, wherein the cantilevered beam is responsive to either:
application of a first electrical signal to one of the pair of piezoelectric layers to bend from the starting position spaced from the orifice plate toward the orifice plate and termination of the first electrical signal and application of a second electrical signal to the other of the pair of piezoelectric layers to return back to the starting position spaced from the orifice plate; or application of a first electrical signal to one of the pair of piezoelectric layers to bend from the starting position adjacent the orifice plate away from the orifice plate and termination of the first electrical signal and application of a second electrical signal to the other of the pair of piezoelectric layers to return back to the starting position adjacent the orifice plate. 17. The printhead of claim 15, wherein each cantilevered beam at its proximal end is coupled between the orifice plate and the input manifold and at its distal end is moveable between positions where one of the orifices is closed and opened. 18. The printhead of claim 15 wherein each cantilevered beam bending toward the orifice plate closes one of the orifices. 19. The printhead of claim 15, wherein each cantilevered beam further includes a first layer of silicon or inert material, said first layer including thereon a second layer of material that causes the cantilevered beam to bend in the absence of the electrical signal being applied to the cantilevered beam. 20. The printhead of claim 19, wherein:
the inert material is nickel or a piezo-electrically inert material; and the second layer of material is an oxide layer, a layer of SiNx, or layer of SiCx. 21. The printhead of claim 19, wherein:
the second layer of material is an oxide layer; and thicker and thinner thicknesses of the oxide layer cause the cantilevered beam to bend more and less, respectively, in the absence of the one or more electrical signals being applied to the cantilevered beam. 22. The printhead of claim 19, wherein, in plan view, the first layer has one or a combination of the following shapes: rectangular, trapezoidal, polygon and curvilinear. 23. The printhead of claim 16, further including means for sealing each orifice when one of the cantilevered beams bends towards the orifice plate. 24. The printhead of claim 23, wherein the means for sealing each orifice includes at least one of the following:
a raised surface or bump on the one cantilevered beam; or a raised surface or bump on the orifice plate surrounding the orifice. 25. The printhead of claim 16, wherein the input manifold and the plurality of micro-valves form a plenum. 26. The printhead of claim 17, wherein the plurality of cantilevered beams is arranged side-by-side, interdigitated, or in an x, y array. 27. A printhead of claim 16, wherein at least one of the piezoelectric layers does not extend to a distal end of the cantilever beam. | A micro-valve includes an orifice plate including an orifice and a cantilevered beam coupled in spaced relation to the orifice plate and moveable between positions where the orifice is closed and opened by the cantilevered beam. The cantilevered beam includes one or more piezoelectric layers that facilitate bending of the cantilevered beam in response to the application of one or more electrical signals to the one or more piezoelectric layers. In response to respective application and termination of the one or more electrical signals to the one or more piezoelectric layers the cantilevered beam either: moves from a starting position spaced from the orifice plate toward the orifice plate and returns back to the starting position spaced from the orifice plate; or moves from a starting position adjacent the orifice plate away from the orifice plate and returns back to the starting position adjacent the orifice plate.1. A micro-valve system comprising:
an orifice plate including an orifice; and a cantilevered beam coupled in spaced relation to the orifice plate and moveable between positions where the orifice is closed and opened by the cantilevered beam, wherein: the cantilevered beam is comprised of one or more piezoelectric layers that facilitate bending of the cantilevered beam in response to the application of one or more electrical signals to the one or more piezoelectric layers; and in response to respective application and termination of the one or more electrical signals to the one or more piezoelectric layers, the cantilevered beam either:
moves from a starting position spaced from the orifice plate toward the orifice plate and returns back to the starting position spaced from the orifice plate; or
moves from a starting position adjacent the orifice plate away from the orifice plate and returns back to the starting position adjacent the orifice plate. 2. The micro-valve system of claim 1, wherein the cantilevered beam includes a pair of piezoelectric layers that are spaced from each other and spaced from the orifice plate, wherein the cantilevered beam is responsive to either:
application of a first electrical signal to one of the pair of piezoelectric layers to bend from the starting position spaced from the orifice plate toward the orifice plate and termination of the first electrical signal and application of a second electrical signal to the other of the pair of piezoelectric layers to return back to the starting position spaced from the orifice plate; or application of a first electrical signal to one of the pair of piezoelectric layers to bend from the starting position adjacent the orifice plate away from the orifice plate and termination of the first electrical signal and application of a second electrical signal to the other of the pair of piezoelectric layers to return back to the starting position adjacent the orifice plate. 3. The micro-valve system of claim 1, wherein the cantilevered beam at its proximal end is coupled to the orifice plate and the cantilevered beam at its distal end is moveable between positions where the orifice is closed and opened. 4. The micro-valve system of claim 1, wherein the cantilevered beam bending toward the orifice plate closes the orifice. 5. The micro-valve system of claim 1, wherein the cantilevered beam further includes a layer of material that causes the cantilevered beam to have a bend in the absence of the one or more electrical signals being applied to the one or more piezoelectric layers 6. The micro-valve system of claim 5, wherein thicker and thinner thicknesses of the layer of material cause the cantilevered beam to have more and less bend, respectively, in the absence of the one or more electrical signals being applied to the one or more piezoelectric layers. 7. The micro-valve system of claim 1, wherein:
The cantilevered beam includes a plurality of layers; and in plan view, at least one of the layers of the cantilevered beam has one or a combination of the following shapes: rectangular, trapezoidal, polygon and curvilinear. 8. The micro-valve system of claim 1, further including means for sealing the orifice when the cantilevered beam bends towards the orifice plate. 9. The micro-valve system of claim 8, wherein the means for sealing the orifice includes at least one of the following:
a raised surface on the distal end of the cantilevered beam; and/or a raised surface on the orifice plate surrounding the orifice. 10. The micro-valve system of claim 1, further including:
a plurality of orifices in the orifice plate; and a plurality of the cantilevered beams disposed in spaced relation to the orifice plate, wherein each cantilevered beam is moveable between positions where one of the plurality of orifices is closed and opened by said cantilevered beam. 11. The micro-valve system of claim 10, wherein the plurality of cantilevered beams is arranged side-by-side, interdigitated, or in an x, y array. 12. The micro-valve system of claim 1, further including an output manifold coupled to a side of the orifice plate opposite the cantilevered beam. 13. The micro-valve system of claim 12, wherein the output manifold includes one or more paths each of which is configured to direct fluid output through each orifice in communication with said path in a predetermined direction. 14. A micro-valve system of claim 1, wherein at least one of the piezoelectric layers does not extend to a distal end of the cantilever beam. 15. A printhead comprising:
an input manifold; and a plurality of micro-valves coupled to the input manifold, wherein the plurality of micro-valves includes an orifice plate including a plurality of orifices and a plurality of cantilevered beams disposed in spaced relation to the orifice plate, wherein each cantilevered beam is moveable between positions where one of the plurality of orifices is closed and opened by the cantilevered beam, wherein: each cantilevered beam is comprised of one or more piezoelectric layers that facilitate bending of the cantilevered beam in response to the application of one or more electrical signals to the one or more piezoelectric layers; and in response to respective application and termination of the one or more electrical signals to the one or more piezoelectric layers, the cantilevered beam either:
moves from a starting position spaced from the orifice plate toward the orifice plate and to return back to the starting position spaced from the orifice plate; or
moves from a starting position adjacent the orifice plate away from the orifice plate and to return back to the starting position adjacent the orifice plate. 16. The printhead of claim 15, wherein at least one cantilevered beam includes a pair of piezoelectric layers that are spaced from each other and spaced from the orifice plate, wherein the cantilevered beam is responsive to either:
application of a first electrical signal to one of the pair of piezoelectric layers to bend from the starting position spaced from the orifice plate toward the orifice plate and termination of the first electrical signal and application of a second electrical signal to the other of the pair of piezoelectric layers to return back to the starting position spaced from the orifice plate; or application of a first electrical signal to one of the pair of piezoelectric layers to bend from the starting position adjacent the orifice plate away from the orifice plate and termination of the first electrical signal and application of a second electrical signal to the other of the pair of piezoelectric layers to return back to the starting position adjacent the orifice plate. 17. The printhead of claim 15, wherein each cantilevered beam at its proximal end is coupled between the orifice plate and the input manifold and at its distal end is moveable between positions where one of the orifices is closed and opened. 18. The printhead of claim 15 wherein each cantilevered beam bending toward the orifice plate closes one of the orifices. 19. The printhead of claim 15, wherein each cantilevered beam further includes a first layer of silicon or inert material, said first layer including thereon a second layer of material that causes the cantilevered beam to bend in the absence of the electrical signal being applied to the cantilevered beam. 20. The printhead of claim 19, wherein:
the inert material is nickel or a piezo-electrically inert material; and the second layer of material is an oxide layer, a layer of SiNx, or layer of SiCx. 21. The printhead of claim 19, wherein:
the second layer of material is an oxide layer; and thicker and thinner thicknesses of the oxide layer cause the cantilevered beam to bend more and less, respectively, in the absence of the one or more electrical signals being applied to the cantilevered beam. 22. The printhead of claim 19, wherein, in plan view, the first layer has one or a combination of the following shapes: rectangular, trapezoidal, polygon and curvilinear. 23. The printhead of claim 16, further including means for sealing each orifice when one of the cantilevered beams bends towards the orifice plate. 24. The printhead of claim 23, wherein the means for sealing each orifice includes at least one of the following:
a raised surface or bump on the one cantilevered beam; or a raised surface or bump on the orifice plate surrounding the orifice. 25. The printhead of claim 16, wherein the input manifold and the plurality of micro-valves form a plenum. 26. The printhead of claim 17, wherein the plurality of cantilevered beams is arranged side-by-side, interdigitated, or in an x, y array. 27. A printhead of claim 16, wherein at least one of the piezoelectric layers does not extend to a distal end of the cantilever beam. | 2,800 |
12,294 | 12,294 | 16,660,892 | 2,831 | A releasable power assembly prevents damage to plugs and receptacles connected to refrigerated shipping containers (reefers). Reefers are temporarily stored in shipping port reefer scaffolds and then loaded onto or unloaded off of ground transportation or freighters. However, errors in port command and control systems may result in the failure to unplug reefers prior to loading or unloading. Conventional reefer power plugs and receptacles are twist-locked together and damaged or destroyed if not manually disconnected prior to reefer movement. An advantageous releasable power assembly automatically unlatches before reaching a breaking point for failure to disconnect plug and receptacle. | 1. A releasable power assembly comprising:
a power plug having a plurality of conductive plug terminals; a power receptacle having a plurality of conductive receptacle terminals; the conductive plug terminals removably insert into the conductive receptacle terminals; a plug power cord extends from the plug; a receptacle power cord extends from the receptacle; a pair of ring latches are disposed on the receptacle; the ring latches having a locked position that secures the plug to the receptacle; and the ring latches having an unlocked position that releases the power plug from the power receptacle. 2. The releasable power assembly according to claim 1 wherein a loop trigger is fixedly attached to a first one of the ring latches and is removably attached to second one of the ring latches. 3. The releasable power assembly according to claim 2 wherein the loop trigger unlocks the ring latches from the receptacle when the loop trigger is removed from the second one of the ring latches. 4. The releasable power assembly according to claim 3 wherein the plug power cord is looped around the loop trigger so as to remove the loop trigger from the second one of the ring latches when a pulling force is applied to the plug power cord. 5. The releasable power assembly according to claim 4 wherein the ring latches further comprise a pair of footings that extend from the ring latches and are disposed against plug collar in the locked position. 6. The releasable power assembly according to claim 5 wherein each of the ring latches comprise:
a handle;
a tension frame rotatably attached to the handle; and
a threaded T-bolt partially disposed within, and protruding from the tension frame. 7. The releasable power assembly according to claim 6 further comprising:
a strap T-clamp and a cap T-clamp fixedly disposed on opposite sides of the receptacle; and
the ring latches rotatably disposed through the strap T-clamp and the cap T-clamp on opposite ends of the strap T-clamp and the cap T-clamp. 8. The releasable power assembly according to claim 7 further comprising:
a safety cap assembly having a safety cap, a lever and a hinge;
the hinge is fixedly attached to the cap T-clamp; and
the lever has a first end rotatably disposed within the hinge and a second end fixedly attached to the safety cap. 9. The releasable power assembly according to claim 8 further comprising:
the safety cap has an open position disposed adjacent the plug when the plug is disposed within the receptacle; and
the safety cap has a closed position disposed over the receptacle when the plug is removed from the receptacle. 10. The releasable power assembly according to claim 9 further comprising a safety strap attached to the strap T-clamp so as to removably secure the power receptacle to a reefer rail. 11. A releasable power method comprising:
clamping a power plug to a power receptacle; exerting a pulling force on a plug power cord in electrical communications with the power plug; and releasing the power plug from the power receptacle in response to the pulling force so as to avoid damage to the conductive power cord. 12. The releasable power method according to claim 11 wherein clamping comprises locking a pair of ring latches that extend from the power receptacle against a power plug collar. 13. The releasable power method according to claim 12 wherein releasing the power plug from the power receptacle comprises:
looping the plug power cord around a loop trigger; and
removing the loop trigger from one of the ring latches in response to the pulling force. 14. The releasable power method according to claim 13 wherein removing the loop trigger comprises rotating the ring latches away from the power plug. 15. The releasable power method according to claim 14 wherein rotating the ring latches away from the power plug comprises spring-loading the ring latches. 16. The releasable power method according to claim 15 further comprising disconnecting the power plug from the power receptacle. 17. The releasable power method according to claim 16 further comprising clamping a strap T-clamp and a cap T-clamp on opposite sides of the power receptacle. 18. The releasable power method according to claim 11 further comprising securing a cap assembly to the cap T-clamp. 19. The releasable power method according to claim 18 further comprising rotating the cap assembly from a first position distal power receptacle terminals to a second position proximate power receptacle terminals. 20. The releasable power method according to claim 19 further comprising
securing a first end of a strap on the strap T-clamp; and
securing a second end of the strap on a reefer scaffolding rail. | A releasable power assembly prevents damage to plugs and receptacles connected to refrigerated shipping containers (reefers). Reefers are temporarily stored in shipping port reefer scaffolds and then loaded onto or unloaded off of ground transportation or freighters. However, errors in port command and control systems may result in the failure to unplug reefers prior to loading or unloading. Conventional reefer power plugs and receptacles are twist-locked together and damaged or destroyed if not manually disconnected prior to reefer movement. An advantageous releasable power assembly automatically unlatches before reaching a breaking point for failure to disconnect plug and receptacle.1. A releasable power assembly comprising:
a power plug having a plurality of conductive plug terminals; a power receptacle having a plurality of conductive receptacle terminals; the conductive plug terminals removably insert into the conductive receptacle terminals; a plug power cord extends from the plug; a receptacle power cord extends from the receptacle; a pair of ring latches are disposed on the receptacle; the ring latches having a locked position that secures the plug to the receptacle; and the ring latches having an unlocked position that releases the power plug from the power receptacle. 2. The releasable power assembly according to claim 1 wherein a loop trigger is fixedly attached to a first one of the ring latches and is removably attached to second one of the ring latches. 3. The releasable power assembly according to claim 2 wherein the loop trigger unlocks the ring latches from the receptacle when the loop trigger is removed from the second one of the ring latches. 4. The releasable power assembly according to claim 3 wherein the plug power cord is looped around the loop trigger so as to remove the loop trigger from the second one of the ring latches when a pulling force is applied to the plug power cord. 5. The releasable power assembly according to claim 4 wherein the ring latches further comprise a pair of footings that extend from the ring latches and are disposed against plug collar in the locked position. 6. The releasable power assembly according to claim 5 wherein each of the ring latches comprise:
a handle;
a tension frame rotatably attached to the handle; and
a threaded T-bolt partially disposed within, and protruding from the tension frame. 7. The releasable power assembly according to claim 6 further comprising:
a strap T-clamp and a cap T-clamp fixedly disposed on opposite sides of the receptacle; and
the ring latches rotatably disposed through the strap T-clamp and the cap T-clamp on opposite ends of the strap T-clamp and the cap T-clamp. 8. The releasable power assembly according to claim 7 further comprising:
a safety cap assembly having a safety cap, a lever and a hinge;
the hinge is fixedly attached to the cap T-clamp; and
the lever has a first end rotatably disposed within the hinge and a second end fixedly attached to the safety cap. 9. The releasable power assembly according to claim 8 further comprising:
the safety cap has an open position disposed adjacent the plug when the plug is disposed within the receptacle; and
the safety cap has a closed position disposed over the receptacle when the plug is removed from the receptacle. 10. The releasable power assembly according to claim 9 further comprising a safety strap attached to the strap T-clamp so as to removably secure the power receptacle to a reefer rail. 11. A releasable power method comprising:
clamping a power plug to a power receptacle; exerting a pulling force on a plug power cord in electrical communications with the power plug; and releasing the power plug from the power receptacle in response to the pulling force so as to avoid damage to the conductive power cord. 12. The releasable power method according to claim 11 wherein clamping comprises locking a pair of ring latches that extend from the power receptacle against a power plug collar. 13. The releasable power method according to claim 12 wherein releasing the power plug from the power receptacle comprises:
looping the plug power cord around a loop trigger; and
removing the loop trigger from one of the ring latches in response to the pulling force. 14. The releasable power method according to claim 13 wherein removing the loop trigger comprises rotating the ring latches away from the power plug. 15. The releasable power method according to claim 14 wherein rotating the ring latches away from the power plug comprises spring-loading the ring latches. 16. The releasable power method according to claim 15 further comprising disconnecting the power plug from the power receptacle. 17. The releasable power method according to claim 16 further comprising clamping a strap T-clamp and a cap T-clamp on opposite sides of the power receptacle. 18. The releasable power method according to claim 11 further comprising securing a cap assembly to the cap T-clamp. 19. The releasable power method according to claim 18 further comprising rotating the cap assembly from a first position distal power receptacle terminals to a second position proximate power receptacle terminals. 20. The releasable power method according to claim 19 further comprising
securing a first end of a strap on the strap T-clamp; and
securing a second end of the strap on a reefer scaffolding rail. | 2,800 |
12,295 | 12,295 | 16,001,323 | 2,811 | The invention relates to a housing for an optoelectronic device and to a method for producing such a housing. For producing a lid for the housing, an infrared-transparent material is used, into which at least one glass window is integrated. | 1. A housing for at least one electronic device, the housing including a base part, wherein the base part includes a mounting area for the at least one electronic device, the housing further including a lid made of a material that is transparent to infrared radiation, wherein the lid made of material that is transparent to infrared radiation has at least one glass window integrated therein. 2. The housing as claimed in claim 1, wherein the at least one glass window is transparent to at least one of UV radiation and visible light. 3. The housing as claimed in claim 1, wherein the lid made of an infrared radiation transparent material is made of silicon, aluminum oxide, in particular sapphire, or germanium. 4. The housing as claimed in claim 1, wherein the at least one glass window is made of a glass having a coefficient of mean linear thermal expansion (α) at 20 to 300° C. of 2 to 5 ppm/K. 5. The housing as claimed in claim 1, wherein the at least one glass window, at 20° C., is under a stress ranging between −100 MPa of compressive stress and +30 MPa of tensile stress. 6. The housing as claimed in claim 1, wherein the at least one glass window is made of a glass having a coefficient of mean linear thermal expansion (α) at 20 to 300° C. of 3 to 5 ppm/K and a glass transition temperature (Tg) between 300 and 600° C. 7. The housing as claimed in claim 1, wherein the at least one glass window has been integrated into the lid by fusing. 8. The housing as claimed in claim 1, wherein the housing has a first mounting area which is arranged under a portion of the lid made of material that is transparent to infrared radiation and a second mounting area arranged under the at least one glass window. 9. The housing as claimed in claim 1, wherein the at least one glass window is made of borosilicate glass. 10. A housing for at least one electronic device, the housing including a base part, wherein the base part includes a mounting area for the at least one electronic device, the housing further including a lid made of glass, wherein the lid made of glass has at least one window integrated therein that is made of a material transparent to infrared radiation. 11. The housing as claimed in claim 10, wherein the at least one glass window is transparent to at least one of UV radiation and visible light. 12. The housing as claimed in claim 10, wherein the lid made of an infrared radiation transparent material is made of silicon, aluminum oxide, in particular sapphire, or germanium. 13. The housing as claimed in claim 10, wherein the at least one glass window is made of a glass having a coefficient of mean linear thermal expansion (a) at 20 to 300° C. of 2 to 5 ppm/K. 14. The housing as claimed in claim 10, wherein the at least one glass window, at 20° C., is under a stress ranging between −100 MPa of compressive stress and +30 MPa of tensile stress. 15. The housing as claimed in claim 10, wherein the at least one glass window is made of a glass having a coefficient of mean linear thermal expansion (a) at 20 to 300° C. of 3 to 5 ppm/K and a glass transition temperature (Tg) between 300 and 600° C. 16. The housing as claimed in claim 10, wherein the at least one glass window has been integrated into the lid by fusing. 17. The housing as claimed in claim 10, wherein the housing has a first mounting area which is arranged under a portion of the lid made of material that is transparent to infrared radiation and a second mounting area arranged under the at least one glass window. 18. The housing as claimed in claim 10, wherein the at least one glass window is made of borosilicate glass. 19. A lid for a housing, wherein the lid is made of a material transparent to infrared radiation and has a glass window, or the lid is made of glass and has a window made from a material that is transparent to infrared radiation. 20. A method for producing a housing for an electronic device, including the steps of:
providing a housing base part; providing a lid including a window, the lid being comprised of a material transparent to infrared radiation or a glass, and the window being comprised of a material transparent to infrared radiation or a glass; connecting the lid to the base part. 21. The method as claimed in claim 20, including the step, using a wafer as the base part, and, once the lid has been connected to the base part, the method furthermore including dicing the wafer along a separation line for dicing, which divides the housing into a first housing being comprised of a window that is transparent to infrared radiation or a glass lid and a second housing being comprised of a glass lid having a window transparent to infrared radiation. 22. The method as claimed in claim 20, wherein the glass window is integrated into the lid using one of fusing, soldering using a solder glass, anodically bonding, and welding. 23. The method according to claim 20, wherein a lid made of glass is connected to the housing base part and/or to a window that is transparent to infrared radiation by anionic bonding. | The invention relates to a housing for an optoelectronic device and to a method for producing such a housing. For producing a lid for the housing, an infrared-transparent material is used, into which at least one glass window is integrated.1. A housing for at least one electronic device, the housing including a base part, wherein the base part includes a mounting area for the at least one electronic device, the housing further including a lid made of a material that is transparent to infrared radiation, wherein the lid made of material that is transparent to infrared radiation has at least one glass window integrated therein. 2. The housing as claimed in claim 1, wherein the at least one glass window is transparent to at least one of UV radiation and visible light. 3. The housing as claimed in claim 1, wherein the lid made of an infrared radiation transparent material is made of silicon, aluminum oxide, in particular sapphire, or germanium. 4. The housing as claimed in claim 1, wherein the at least one glass window is made of a glass having a coefficient of mean linear thermal expansion (α) at 20 to 300° C. of 2 to 5 ppm/K. 5. The housing as claimed in claim 1, wherein the at least one glass window, at 20° C., is under a stress ranging between −100 MPa of compressive stress and +30 MPa of tensile stress. 6. The housing as claimed in claim 1, wherein the at least one glass window is made of a glass having a coefficient of mean linear thermal expansion (α) at 20 to 300° C. of 3 to 5 ppm/K and a glass transition temperature (Tg) between 300 and 600° C. 7. The housing as claimed in claim 1, wherein the at least one glass window has been integrated into the lid by fusing. 8. The housing as claimed in claim 1, wherein the housing has a first mounting area which is arranged under a portion of the lid made of material that is transparent to infrared radiation and a second mounting area arranged under the at least one glass window. 9. The housing as claimed in claim 1, wherein the at least one glass window is made of borosilicate glass. 10. A housing for at least one electronic device, the housing including a base part, wherein the base part includes a mounting area for the at least one electronic device, the housing further including a lid made of glass, wherein the lid made of glass has at least one window integrated therein that is made of a material transparent to infrared radiation. 11. The housing as claimed in claim 10, wherein the at least one glass window is transparent to at least one of UV radiation and visible light. 12. The housing as claimed in claim 10, wherein the lid made of an infrared radiation transparent material is made of silicon, aluminum oxide, in particular sapphire, or germanium. 13. The housing as claimed in claim 10, wherein the at least one glass window is made of a glass having a coefficient of mean linear thermal expansion (a) at 20 to 300° C. of 2 to 5 ppm/K. 14. The housing as claimed in claim 10, wherein the at least one glass window, at 20° C., is under a stress ranging between −100 MPa of compressive stress and +30 MPa of tensile stress. 15. The housing as claimed in claim 10, wherein the at least one glass window is made of a glass having a coefficient of mean linear thermal expansion (a) at 20 to 300° C. of 3 to 5 ppm/K and a glass transition temperature (Tg) between 300 and 600° C. 16. The housing as claimed in claim 10, wherein the at least one glass window has been integrated into the lid by fusing. 17. The housing as claimed in claim 10, wherein the housing has a first mounting area which is arranged under a portion of the lid made of material that is transparent to infrared radiation and a second mounting area arranged under the at least one glass window. 18. The housing as claimed in claim 10, wherein the at least one glass window is made of borosilicate glass. 19. A lid for a housing, wherein the lid is made of a material transparent to infrared radiation and has a glass window, or the lid is made of glass and has a window made from a material that is transparent to infrared radiation. 20. A method for producing a housing for an electronic device, including the steps of:
providing a housing base part; providing a lid including a window, the lid being comprised of a material transparent to infrared radiation or a glass, and the window being comprised of a material transparent to infrared radiation or a glass; connecting the lid to the base part. 21. The method as claimed in claim 20, including the step, using a wafer as the base part, and, once the lid has been connected to the base part, the method furthermore including dicing the wafer along a separation line for dicing, which divides the housing into a first housing being comprised of a window that is transparent to infrared radiation or a glass lid and a second housing being comprised of a glass lid having a window transparent to infrared radiation. 22. The method as claimed in claim 20, wherein the glass window is integrated into the lid using one of fusing, soldering using a solder glass, anodically bonding, and welding. 23. The method according to claim 20, wherein a lid made of glass is connected to the housing base part and/or to a window that is transparent to infrared radiation by anionic bonding. | 2,800 |
12,296 | 12,296 | 16,477,983 | 2,844 | An electrical circuit that drives a light-emitting component including a parallel circuit including a capacitor; and a switching element, wherein a first terminal for a voltage supply connects to a first contact of the capacitor and a second terminal for a voltage supply connects to a second contact of the capacitor, the switching element includes a first electrical switch including a first input for a first switching signal, a second electrical switch including a second input for a second switching signal, and third and fourth terminals, the third terminal and the fourth terminal form a component terminal for the light-emitting component, a first current path may be switched to be conducting by the first switch, the first current path includes the component terminal, a second current path may be switched to be conducting by the second switch, and the second current path is in parallel with the component terminal. | 1-16. (canceled) 17. An electrical circuit that drives a light-emitting component, the circuit comprising:
a parallel circuit comprising a capacitor; and a switching element, wherein a first terminal for a voltage supply connects to a first contact of the capacitor and a second terminal for a voltage supply connects to a second contact of the capacitor, the switching element comprises a first electrical switch comprising a first input for a first switching signal, a second electrical switch comprising a second input for a second switching signal, and a third terminal and a fourth terminal, the third terminal and the fourth terminal form a component terminal for the light-emitting component, a first current path may be switched to be conducting by the first switch, the first current path comprises the component terminal, a second current path may be switched to be conducting by the second switch, and the second current path is in parallel with the component terminal. 18. The electrical circuit according to claim 17, wherein the component terminal connects in parallel with the second electrical switch, and the first electrical switch connects in series with the parallel circuit comprising component terminal and second electrical switch. 19. The electrical circuit according to claim 17, wherein the component terminal connects in series with the first electrical switch, and the second electrical switch connects in parallel with the series circuit comprising component terminal and first electrical switch. 20. The electrical circuit according to claim 17, wherein the first electrical switch and/or the second electrical switch are/is a transistor or a field effect transistor. 21. The electrical circuit according to claim 17, wherein a light-emitting component connects to the component terminal. 22. The electrical circuit according to claim 21, wherein the light-emitting component comprises a diode laser. 23. The electrical circuit according to claim 22, wherein the diode laser comprises at least two pn junctions connected in series. 24. The electrical circuit according to claim 21, wherein the circuit comprises conductor tracks on a printed circuit board,
a first conductor track and a second conductor track are arranged on the printed circuit board, the first contact of the capacitor is a first bottom side contact and arranged on the first conductor track, the second contact of the capacitor is a second bottom side contact and arranged on the second conductor track, the light-emitting component comprises a third bottom side contact and a first top side contact, the third bottom side contact is arranged on the first conductor track, the first electrical switch comprises a fourth bottom side contact and a second top side contact, the fourth bottom side contact is arranged on the second conductor track, the second electrical switch comprises a fifth bottom side contact and a third top side contact, the fifth bottom side contact is arranged on the first conductor track, and the first top side contact connects to the second top side contact by a bond wire. 25. The electrical circuit according to claim 24, wherein the first top side contact connects to the third top side contact by a bond wire. 26. The electrical circuit according to claim 24, wherein the second top side contact connects to the third top side contact by a bond wire. 27. The electrical circuit according to claim 17, furthermore comprising a resistor, wherein the resistor connects in series with the switching element,
the electrical circuit comprises a fifth terminal and a sixth terminal, and the fifth terminal and the sixth terminal are configured to tap off a voltage dropped across the resistor. 28. The electrical circuit according to claim 21, further comprising a resistor, wherein the resistor connects in series with the switching element,
the electrical circuit comprises a fifth terminal and a sixth terminal, the fifth terminal and the sixth terminal are configured to tap off a voltage dropped across the resistor, the circuit comprises conductor tracks on a printed circuit board, a first conductor track, a second conductor track and a third conductor track are arranged on the printed circuit board, the first contact of the capacitor is a first bottom side contact and arranged on the first conductor track, the second contact of the capacitor is a second bottom side contact and arranged on the second conductor track, the light-emitting component comprises a third bottom side contact and a first top side contact, the third bottom side contact is arranged on the third conductor track, the first electrical switch comprises a fourth bottom side contact and a second top side contact, the fourth bottom side contact is arranged on the second conductor track, the second electrical switch comprises a fifth bottom side contact and a third top side contact, the fifth bottom side contact is arranged on the third conductor track, the first top side contact connects to the second top side contact by a bond wire, the resistor comprises a sixth bottom side contact and a seventh bottom side contact, the sixth bottom side contact is arranged on the first conductor track and the seventh bottom side contact is arranged on the third conductor track, and the fifth terminal is arranged on the first conductor track and the sixth terminal is arranged on the third conductor track. 29. The electrical circuit according to claim 27, wherein the resistor is a taper of a conductor track. 30. A method of operating the electrical circuit according to claim 17, comprising:
switching the second electrical switch to have continuity for electric current based on a second switching signal at the second input, switching the first switch to have continuity for electric current based on a first switching signal at the first input, switching the second electrical switch to be blocking for electric current based on a second switching signal at the second input, and switching the first switch to be blocking for electric current based on a first switching signal at the first input. 31. The method according to claim 30, wherein a time period between switching the second switch to be blocking and switching the first switch to be blocking is less than 10 nanoseconds. 32. The method according to claim 30, wherein the voltage dropped across the resistor is measured by the fifth terminal and the sixth terminal. 33. An electrical circuit that drives a light-emitting component, comprising:
a parallel circuit comprising a capacitor; and a switching element, wherein a first terminal for a voltage supply connects to a first contact of the capacitor and a second terminal for a voltage supply connects to a second contact of the capacitor, the switching element comprises a first electrical switch comprising a first input for a first switching signal, a second electrical switch comprising a second input for a second switching signal, and a third terminal and a fourth terminal, the third terminal and the fourth terminal form a component terminal for the light-emitting component, a first current path may be switched to be conducting by the first switch. the first current path comprises the component terminal, a second current path may be switched to be conducting by the second switch, the second current path is in parallel with the component terminal, the component terminal connects in parallel with the second electrical switch, and the first electrical switch connects in series with the parallel circuit comprising component terminal and second electrical switch. 34. The electrical circuit according to claim 33, wherein a light-emitting component connects to the component terminal. 35. The electrical circuit according to claim 34, wherein the circuit comprises conductor tracks on a printed circuit board,
a first conductor track and a second conductor track are arranged on the printed circuit hoard, the first contact of the capacitor is a first bottom side contact and arranged on the first conductor track, the second contact of the capacitor is a second bottom side contact and arranged on the second conductor track, the light-emitting component comprises a third bottom side contact and a first top side contact, the third bottom side contact is arranged on the first conductor track, the first electrical s itch comprises a fourth bottom side contact and a second top side contact, the fourth bottom side contact is arranged on the second conductor track, the second electrical switch comprises a fifth bottom side contact and a third top side contact, the fifth bottom side contact is arranged on the first conductor track, the first top side contact connects to the second top side contact by a bond wire, and the first top side contact connects to the third top side contact by a bond wire. | An electrical circuit that drives a light-emitting component including a parallel circuit including a capacitor; and a switching element, wherein a first terminal for a voltage supply connects to a first contact of the capacitor and a second terminal for a voltage supply connects to a second contact of the capacitor, the switching element includes a first electrical switch including a first input for a first switching signal, a second electrical switch including a second input for a second switching signal, and third and fourth terminals, the third terminal and the fourth terminal form a component terminal for the light-emitting component, a first current path may be switched to be conducting by the first switch, the first current path includes the component terminal, a second current path may be switched to be conducting by the second switch, and the second current path is in parallel with the component terminal.1-16. (canceled) 17. An electrical circuit that drives a light-emitting component, the circuit comprising:
a parallel circuit comprising a capacitor; and a switching element, wherein a first terminal for a voltage supply connects to a first contact of the capacitor and a second terminal for a voltage supply connects to a second contact of the capacitor, the switching element comprises a first electrical switch comprising a first input for a first switching signal, a second electrical switch comprising a second input for a second switching signal, and a third terminal and a fourth terminal, the third terminal and the fourth terminal form a component terminal for the light-emitting component, a first current path may be switched to be conducting by the first switch, the first current path comprises the component terminal, a second current path may be switched to be conducting by the second switch, and the second current path is in parallel with the component terminal. 18. The electrical circuit according to claim 17, wherein the component terminal connects in parallel with the second electrical switch, and the first electrical switch connects in series with the parallel circuit comprising component terminal and second electrical switch. 19. The electrical circuit according to claim 17, wherein the component terminal connects in series with the first electrical switch, and the second electrical switch connects in parallel with the series circuit comprising component terminal and first electrical switch. 20. The electrical circuit according to claim 17, wherein the first electrical switch and/or the second electrical switch are/is a transistor or a field effect transistor. 21. The electrical circuit according to claim 17, wherein a light-emitting component connects to the component terminal. 22. The electrical circuit according to claim 21, wherein the light-emitting component comprises a diode laser. 23. The electrical circuit according to claim 22, wherein the diode laser comprises at least two pn junctions connected in series. 24. The electrical circuit according to claim 21, wherein the circuit comprises conductor tracks on a printed circuit board,
a first conductor track and a second conductor track are arranged on the printed circuit board, the first contact of the capacitor is a first bottom side contact and arranged on the first conductor track, the second contact of the capacitor is a second bottom side contact and arranged on the second conductor track, the light-emitting component comprises a third bottom side contact and a first top side contact, the third bottom side contact is arranged on the first conductor track, the first electrical switch comprises a fourth bottom side contact and a second top side contact, the fourth bottom side contact is arranged on the second conductor track, the second electrical switch comprises a fifth bottom side contact and a third top side contact, the fifth bottom side contact is arranged on the first conductor track, and the first top side contact connects to the second top side contact by a bond wire. 25. The electrical circuit according to claim 24, wherein the first top side contact connects to the third top side contact by a bond wire. 26. The electrical circuit according to claim 24, wherein the second top side contact connects to the third top side contact by a bond wire. 27. The electrical circuit according to claim 17, furthermore comprising a resistor, wherein the resistor connects in series with the switching element,
the electrical circuit comprises a fifth terminal and a sixth terminal, and the fifth terminal and the sixth terminal are configured to tap off a voltage dropped across the resistor. 28. The electrical circuit according to claim 21, further comprising a resistor, wherein the resistor connects in series with the switching element,
the electrical circuit comprises a fifth terminal and a sixth terminal, the fifth terminal and the sixth terminal are configured to tap off a voltage dropped across the resistor, the circuit comprises conductor tracks on a printed circuit board, a first conductor track, a second conductor track and a third conductor track are arranged on the printed circuit board, the first contact of the capacitor is a first bottom side contact and arranged on the first conductor track, the second contact of the capacitor is a second bottom side contact and arranged on the second conductor track, the light-emitting component comprises a third bottom side contact and a first top side contact, the third bottom side contact is arranged on the third conductor track, the first electrical switch comprises a fourth bottom side contact and a second top side contact, the fourth bottom side contact is arranged on the second conductor track, the second electrical switch comprises a fifth bottom side contact and a third top side contact, the fifth bottom side contact is arranged on the third conductor track, the first top side contact connects to the second top side contact by a bond wire, the resistor comprises a sixth bottom side contact and a seventh bottom side contact, the sixth bottom side contact is arranged on the first conductor track and the seventh bottom side contact is arranged on the third conductor track, and the fifth terminal is arranged on the first conductor track and the sixth terminal is arranged on the third conductor track. 29. The electrical circuit according to claim 27, wherein the resistor is a taper of a conductor track. 30. A method of operating the electrical circuit according to claim 17, comprising:
switching the second electrical switch to have continuity for electric current based on a second switching signal at the second input, switching the first switch to have continuity for electric current based on a first switching signal at the first input, switching the second electrical switch to be blocking for electric current based on a second switching signal at the second input, and switching the first switch to be blocking for electric current based on a first switching signal at the first input. 31. The method according to claim 30, wherein a time period between switching the second switch to be blocking and switching the first switch to be blocking is less than 10 nanoseconds. 32. The method according to claim 30, wherein the voltage dropped across the resistor is measured by the fifth terminal and the sixth terminal. 33. An electrical circuit that drives a light-emitting component, comprising:
a parallel circuit comprising a capacitor; and a switching element, wherein a first terminal for a voltage supply connects to a first contact of the capacitor and a second terminal for a voltage supply connects to a second contact of the capacitor, the switching element comprises a first electrical switch comprising a first input for a first switching signal, a second electrical switch comprising a second input for a second switching signal, and a third terminal and a fourth terminal, the third terminal and the fourth terminal form a component terminal for the light-emitting component, a first current path may be switched to be conducting by the first switch. the first current path comprises the component terminal, a second current path may be switched to be conducting by the second switch, the second current path is in parallel with the component terminal, the component terminal connects in parallel with the second electrical switch, and the first electrical switch connects in series with the parallel circuit comprising component terminal and second electrical switch. 34. The electrical circuit according to claim 33, wherein a light-emitting component connects to the component terminal. 35. The electrical circuit according to claim 34, wherein the circuit comprises conductor tracks on a printed circuit board,
a first conductor track and a second conductor track are arranged on the printed circuit hoard, the first contact of the capacitor is a first bottom side contact and arranged on the first conductor track, the second contact of the capacitor is a second bottom side contact and arranged on the second conductor track, the light-emitting component comprises a third bottom side contact and a first top side contact, the third bottom side contact is arranged on the first conductor track, the first electrical s itch comprises a fourth bottom side contact and a second top side contact, the fourth bottom side contact is arranged on the second conductor track, the second electrical switch comprises a fifth bottom side contact and a third top side contact, the fifth bottom side contact is arranged on the first conductor track, the first top side contact connects to the second top side contact by a bond wire, and the first top side contact connects to the third top side contact by a bond wire. | 2,800 |
12,297 | 12,297 | 15,716,585 | 2,875 | An illumination device includes a fiber composite material component, at least one light source, and at least one light-guiding body. The fiber composite material component is composed of a plastic matrix and a plurality of reinforcing fibers that are embedded in the plastic matrix. The light-guiding body has at least one light-inlet surface for coupling in light that is emitted from the light source, and at least one light-outlet surface for coupling light out. The light-guiding body is embedded in the plastic matrix of the fiber composite material component. The fiber composite material component is at least partially translucent to light coupled out of the light-outlet surface. | 1. An illumination device, comprising:
a fiber-composite material component which has a plastics matrix and a multiplicity of reinforcement fibers which are embedded in the plastics matrix; at least one light source; and at least one light-conducting body which has at least one light-introduction face for coupling in light that is emitted from the light source, and at least one light-exit face for de-coupling light, wherein the light-conducting body is embedded in the plastics matrix of the fiber-composite material component, and the fiber-composite material component is at least partially translucent to light which is de-coupled from the light-exit face. 2. The illumination device as claimed in claim 1, wherein the light-exit face is at least partially covered by a material of the plastics matrix. 3. The illumination device as claimed in claim 1, wherein the light-exit face extends along a main direction of extent of the light-conducting body. 4. The illumination device as claimed in claim 1, wherein a light-exit face to light-introduction face ratio is at least 10 to 1. 5. The illumination device as claimed in claim 1, wherein
at least one light-exit face of the light-conducting body is perpendicular to the light-introduction face of the light-conducting body. 6. The illumination device as claimed in claim 1, wherein
the light-conducting body is configured as an optical fiber or as an optical fiber bundle. 7. The illumination device as claimed in claim 1, wherein
the light-conducting body is composed of a plastics material, a polymethyl acrylate, or a glass. 8. The illumination device as claimed in claim 7, wherein
the plastics material is a polycarbonate, or the glass is one of more glass fibers. 9. The illumination device as claimed in claim 1, wherein the light source is embedded in the fiber-composite material component. 10. The illumination device as claimed in claim 1, wherein the light source is disposed outside the fiber-composite material component. 11. The illumination device as claimed in claim 1, wherein
the light-conducting body, at least in regions, is in physical contact with at least one of the reinforcement fibers. 12. The illumination device as claimed in claim 1, further comprising:
a multiplicity of light-conducting bodies which are embedded in the plastics matrix of the fiber-composite material component. 13. The illumination device as claimed in claim 1, wherein
the reinforcement fibers are present in the form of one fiber bundle or of a plurality of fiber bundles. 14. The illumination device as claimed in claim 1, wherein
the reinforcement fibers are embodied as a fibrous scrim, a fibrous woven fabric, a fibrous braiding and/or a fibrous embroidery. 15. The illumination device as claimed in claim 1, further comprising:
at least one sensor element that switches the light-conducting body, said sensor element being embedded in the fiber-composite material component. 16. The illumination device as claimed in claim 1, wherein
the light-conducting body bundles a plurality of reinforcement fibers, and/or is configured as an embroidery thread or a textile thread. 17. The illumination device as claimed in claim 1, wherein the reinforcement fibers are pre-impregnated fibers. | An illumination device includes a fiber composite material component, at least one light source, and at least one light-guiding body. The fiber composite material component is composed of a plastic matrix and a plurality of reinforcing fibers that are embedded in the plastic matrix. The light-guiding body has at least one light-inlet surface for coupling in light that is emitted from the light source, and at least one light-outlet surface for coupling light out. The light-guiding body is embedded in the plastic matrix of the fiber composite material component. The fiber composite material component is at least partially translucent to light coupled out of the light-outlet surface.1. An illumination device, comprising:
a fiber-composite material component which has a plastics matrix and a multiplicity of reinforcement fibers which are embedded in the plastics matrix; at least one light source; and at least one light-conducting body which has at least one light-introduction face for coupling in light that is emitted from the light source, and at least one light-exit face for de-coupling light, wherein the light-conducting body is embedded in the plastics matrix of the fiber-composite material component, and the fiber-composite material component is at least partially translucent to light which is de-coupled from the light-exit face. 2. The illumination device as claimed in claim 1, wherein the light-exit face is at least partially covered by a material of the plastics matrix. 3. The illumination device as claimed in claim 1, wherein the light-exit face extends along a main direction of extent of the light-conducting body. 4. The illumination device as claimed in claim 1, wherein a light-exit face to light-introduction face ratio is at least 10 to 1. 5. The illumination device as claimed in claim 1, wherein
at least one light-exit face of the light-conducting body is perpendicular to the light-introduction face of the light-conducting body. 6. The illumination device as claimed in claim 1, wherein
the light-conducting body is configured as an optical fiber or as an optical fiber bundle. 7. The illumination device as claimed in claim 1, wherein
the light-conducting body is composed of a plastics material, a polymethyl acrylate, or a glass. 8. The illumination device as claimed in claim 7, wherein
the plastics material is a polycarbonate, or the glass is one of more glass fibers. 9. The illumination device as claimed in claim 1, wherein the light source is embedded in the fiber-composite material component. 10. The illumination device as claimed in claim 1, wherein the light source is disposed outside the fiber-composite material component. 11. The illumination device as claimed in claim 1, wherein
the light-conducting body, at least in regions, is in physical contact with at least one of the reinforcement fibers. 12. The illumination device as claimed in claim 1, further comprising:
a multiplicity of light-conducting bodies which are embedded in the plastics matrix of the fiber-composite material component. 13. The illumination device as claimed in claim 1, wherein
the reinforcement fibers are present in the form of one fiber bundle or of a plurality of fiber bundles. 14. The illumination device as claimed in claim 1, wherein
the reinforcement fibers are embodied as a fibrous scrim, a fibrous woven fabric, a fibrous braiding and/or a fibrous embroidery. 15. The illumination device as claimed in claim 1, further comprising:
at least one sensor element that switches the light-conducting body, said sensor element being embedded in the fiber-composite material component. 16. The illumination device as claimed in claim 1, wherein
the light-conducting body bundles a plurality of reinforcement fibers, and/or is configured as an embroidery thread or a textile thread. 17. The illumination device as claimed in claim 1, wherein the reinforcement fibers are pre-impregnated fibers. | 2,800 |
12,298 | 12,298 | 16,254,853 | 2,813 | An electronic device, a lead frame, and a method, including providing a lead frame with a Y-shaped feature having branch portions connected to a dam bar in a prospective gap in an equally spaced repeating lead pitch pattern, and a set of first leads extending parallel to one another along a first direction and spaced apart from one another along a second direction in lead locations of the repeating lead pitch pattern, attaching a semiconductor die to a die attach pad of the lead frame, attaching bond wires between bond pads of the semiconductor die, and the first leads, enclosing first portions of the first leads, the die attach pad, and a portion of the semiconductor die in a package structure, and performing a dam bar cut process that cuts through portions of the dam bar between the lead locations of the repeating lead pitch pattern. | 1. An electronic device, comprising:
a set of first leads, each of the first leads including a first portion, and a second portion, the second portions of the first leads extending parallel to one another along a first direction, the second portions of the first leads positioned in a repeating lead pitch pattern at lead locations equally spaced apart from one another along a second direction, the second direction perpendicular to the first direction, and the second portions of the first leads having a formed non-planar shape; a second lead, including a first portion, and a second portion, the second portion of the second lead spaced apart from the second portions of the first leads in a gap in the repeating lead pitch pattern along the second direction, and the second portion of the second lead spaced apart from the lead locations of the repeating lead pitch pattern along the second direction; a semiconductor die, including an electronic component, and a bond pad electrically connected to a terminal of the electronic component; a bond wire with a first end connected to the bond pad, and a second end connected to the first portion of one of the first leads; and a package structure that encloses the first portions of the first leads, the first portion of the second lead, and a portion of the semiconductor die, the second portions of the first leads extending outward from the package structure, and the second portion of the second lead having an end that is exposed to an exterior of the package structure. 2. The electronic device of claim 1, wherein the second portion of the second lead is equally spaced apart from two adjacent lead locations of the repeating lead pitch pattern along the second direction. 3. The electronic device of claim 1,
wherein a first subset of the first leads is positioned along a first side of the package structure in a first repeating lead pitch pattern at lead locations equally spaced apart from one another along the second direction; wherein a second subset of the first leads is positioned along a second side of the package structure in a second repeating lead pitch pattern at lead locations equally spaced apart from one another along the second direction; wherein the second portion of the second lead is exposed to the exterior of the package structure along the first side, the second portion of the second lead is spaced apart from the second portions of the first subset of the first leads along the second direction, and the second portion of the second lead is spaced apart from the lead locations of the first repeating lead pitch pattern along the second direction; and wherein the electronic device further includes a third lead, the third lead including a first portion, and a second portion, the second portion of the third lead exposed to the exterior of the package structure along the second side, the second portion of the third lead spaced apart from the second portions of the second subset of the first leads along the second direction, and the second portion of the third lead spaced apart from the lead locations of the second repeating lead pitch pattern along the second direction. 4. The electronic device of claim 3,
wherein the second portion of the second lead is equally spaced apart from two adjacent lead locations of the first repeating lead pitch pattern along the second direction; and wherein the second portion of the third lead is equally spaced apart from two adjacent lead locations of the second repeating lead pitch pattern along the second direction. 5. The electronic device of claim 4, wherein the second portions of the first leads have a non-planar gull wing shape. 6. The electronic device of claim 3, wherein the second portions of the first leads have a non-planar gull wing shape. 7. The electronic device of claim 3, wherein the first and second sides are opposite sides of the package structure. 8. The electronic device of claim 1, wherein the second portions of the first leads have a non-planar gull wing shape. 9. The electronic device of claim 1, wherein the gap in the repeating lead pitch pattern includes two lead locations. 10. The electronic device of claim 1, wherein the gap in the repeating lead pitch pattern includes more than two lead locations. 11. A method, comprising:
providing a lead frame with a Y-shaped feature having branch portions connected to a dam bar in a prospective gap in an equally spaced repeating lead pitch pattern, and a set of first leads extending parallel to one another along a first direction and spaced apart from one another along a second direction in lead locations of the repeating lead pitch pattern; attaching a semiconductor die to a die attach pad of the lead frame; attaching bond wires between bond pads of the semiconductor die, and at least some of the first leads of the lead frame; enclosing first portions of the first leads, the die attach pad, and a portion of the semiconductor die in a package structure; performing a dam bar cut process that cuts through portions of the dam bar between the lead locations of the repeating lead pitch pattern; and performing a lead cut process that cuts ends of second portions of the first leads. 12. The method of claim 11, further comprising removing tie bars from the lead frame after performing the lead cut process. 13. The method of claim 12, further comprising forming the second portions of the first leads into non-planar shapes after removing the tie bars from the lead frame. 14. The method of claim 12, wherein the dam bar cut process is a punch process using a punch that removes the portions of the dam bar between the lead locations of the repeating lead pitch pattern. 15. The method of claim 11, further comprising forming the second portions of the first leads into non-planar shapes after performing the lead cut process. 16. The method of claim 15, wherein forming the second portions of the first leads into non-planar shapes includes forming the second portions of the first leads into non-planar gull wing shapes. 17. The method of claim 11, wherein the dam bar cut process is a punch process using a punch that removes the portions of the dam bar between the lead locations of the repeating lead pitch pattern. 18. A lead frame, comprising:
a die attach pad; a set of first leads, each of the first leads including a first portion, and a second portion, the second portions of the first leads extending parallel to one another along a first direction, the second portions of the first leads positioned in a repeating lead pitch pattern at lead locations equally spaced apart from one another along a second direction, the second direction perpendicular to the first direction, and the second portions of the first leads having a formed non-planar shape; a dam bar extending along the second direction, and intersecting the first and second portions of the first leads; and a second lead, including a first portion, a second portion and a Y-shaped third portion, the second portion of the second lead spaced apart from the second portions of the first leads in a gap in the repeating lead pitch pattern along the second direction, the second portion of the second lead spaced apart from the lead locations of the repeating lead pitch pattern along the second direction, and the Y-shaped third portion including:
a base section extending parallel to the second portions of the first leads along the first direction, the base section spaced apart from the lead locations of the repeating lead pitch pattern along the second direction,
a crossbar section extending parallel to the second direction between a first end and a second end,
first and second end sections extending parallel to the second portions of the first leads along the first direction between a respective one of the first and second ends of the crossbar section and the dam bar, the end sections positioned at lead locations of the repeating lead pitch pattern. 19. The lead frame of claim 18, wherein the second portion of the second lead is equally spaced apart from two adjacent lead locations of the repeating lead pitch pattern along the second direction. 20. The lead frame of claim 18, wherein the gap in the repeating lead pitch pattern includes two lead locations. 21. The electronic device of claim 1, wherein the second lead is not electrically connected to the semiconductor die. 22. The electronic device of claim 1, wherein at least two formed leads are omitted from each side of a two sided lead structure of the electronic device. 23. The method of claim 11, wherein the Y-shaped branch portions face toward the die attach pad. 24. The method of claim 11, wherein a base portion of the Y-shaped feature is connected to a tie bar and the branch portions of the Y-shaped feature are connected to a dam bar. 25. The method of claim 11, wherein the Y-shaped feature is not purposed as a lead. 26. The lead frame of claim 18, wherein the Y-shaped branch portions face toward the die attach pad. 27. The lead frame of claim 18, wherein a base portion of the Y-shaped feature is connected to a tie bar and the branch portions of the Y-shaped feature are connected to a dam bar. 28. The lead frame of claim 18, wherein the Y-shaped feature is not purposed as a lead. | An electronic device, a lead frame, and a method, including providing a lead frame with a Y-shaped feature having branch portions connected to a dam bar in a prospective gap in an equally spaced repeating lead pitch pattern, and a set of first leads extending parallel to one another along a first direction and spaced apart from one another along a second direction in lead locations of the repeating lead pitch pattern, attaching a semiconductor die to a die attach pad of the lead frame, attaching bond wires between bond pads of the semiconductor die, and the first leads, enclosing first portions of the first leads, the die attach pad, and a portion of the semiconductor die in a package structure, and performing a dam bar cut process that cuts through portions of the dam bar between the lead locations of the repeating lead pitch pattern.1. An electronic device, comprising:
a set of first leads, each of the first leads including a first portion, and a second portion, the second portions of the first leads extending parallel to one another along a first direction, the second portions of the first leads positioned in a repeating lead pitch pattern at lead locations equally spaced apart from one another along a second direction, the second direction perpendicular to the first direction, and the second portions of the first leads having a formed non-planar shape; a second lead, including a first portion, and a second portion, the second portion of the second lead spaced apart from the second portions of the first leads in a gap in the repeating lead pitch pattern along the second direction, and the second portion of the second lead spaced apart from the lead locations of the repeating lead pitch pattern along the second direction; a semiconductor die, including an electronic component, and a bond pad electrically connected to a terminal of the electronic component; a bond wire with a first end connected to the bond pad, and a second end connected to the first portion of one of the first leads; and a package structure that encloses the first portions of the first leads, the first portion of the second lead, and a portion of the semiconductor die, the second portions of the first leads extending outward from the package structure, and the second portion of the second lead having an end that is exposed to an exterior of the package structure. 2. The electronic device of claim 1, wherein the second portion of the second lead is equally spaced apart from two adjacent lead locations of the repeating lead pitch pattern along the second direction. 3. The electronic device of claim 1,
wherein a first subset of the first leads is positioned along a first side of the package structure in a first repeating lead pitch pattern at lead locations equally spaced apart from one another along the second direction; wherein a second subset of the first leads is positioned along a second side of the package structure in a second repeating lead pitch pattern at lead locations equally spaced apart from one another along the second direction; wherein the second portion of the second lead is exposed to the exterior of the package structure along the first side, the second portion of the second lead is spaced apart from the second portions of the first subset of the first leads along the second direction, and the second portion of the second lead is spaced apart from the lead locations of the first repeating lead pitch pattern along the second direction; and wherein the electronic device further includes a third lead, the third lead including a first portion, and a second portion, the second portion of the third lead exposed to the exterior of the package structure along the second side, the second portion of the third lead spaced apart from the second portions of the second subset of the first leads along the second direction, and the second portion of the third lead spaced apart from the lead locations of the second repeating lead pitch pattern along the second direction. 4. The electronic device of claim 3,
wherein the second portion of the second lead is equally spaced apart from two adjacent lead locations of the first repeating lead pitch pattern along the second direction; and wherein the second portion of the third lead is equally spaced apart from two adjacent lead locations of the second repeating lead pitch pattern along the second direction. 5. The electronic device of claim 4, wherein the second portions of the first leads have a non-planar gull wing shape. 6. The electronic device of claim 3, wherein the second portions of the first leads have a non-planar gull wing shape. 7. The electronic device of claim 3, wherein the first and second sides are opposite sides of the package structure. 8. The electronic device of claim 1, wherein the second portions of the first leads have a non-planar gull wing shape. 9. The electronic device of claim 1, wherein the gap in the repeating lead pitch pattern includes two lead locations. 10. The electronic device of claim 1, wherein the gap in the repeating lead pitch pattern includes more than two lead locations. 11. A method, comprising:
providing a lead frame with a Y-shaped feature having branch portions connected to a dam bar in a prospective gap in an equally spaced repeating lead pitch pattern, and a set of first leads extending parallel to one another along a first direction and spaced apart from one another along a second direction in lead locations of the repeating lead pitch pattern; attaching a semiconductor die to a die attach pad of the lead frame; attaching bond wires between bond pads of the semiconductor die, and at least some of the first leads of the lead frame; enclosing first portions of the first leads, the die attach pad, and a portion of the semiconductor die in a package structure; performing a dam bar cut process that cuts through portions of the dam bar between the lead locations of the repeating lead pitch pattern; and performing a lead cut process that cuts ends of second portions of the first leads. 12. The method of claim 11, further comprising removing tie bars from the lead frame after performing the lead cut process. 13. The method of claim 12, further comprising forming the second portions of the first leads into non-planar shapes after removing the tie bars from the lead frame. 14. The method of claim 12, wherein the dam bar cut process is a punch process using a punch that removes the portions of the dam bar between the lead locations of the repeating lead pitch pattern. 15. The method of claim 11, further comprising forming the second portions of the first leads into non-planar shapes after performing the lead cut process. 16. The method of claim 15, wherein forming the second portions of the first leads into non-planar shapes includes forming the second portions of the first leads into non-planar gull wing shapes. 17. The method of claim 11, wherein the dam bar cut process is a punch process using a punch that removes the portions of the dam bar between the lead locations of the repeating lead pitch pattern. 18. A lead frame, comprising:
a die attach pad; a set of first leads, each of the first leads including a first portion, and a second portion, the second portions of the first leads extending parallel to one another along a first direction, the second portions of the first leads positioned in a repeating lead pitch pattern at lead locations equally spaced apart from one another along a second direction, the second direction perpendicular to the first direction, and the second portions of the first leads having a formed non-planar shape; a dam bar extending along the second direction, and intersecting the first and second portions of the first leads; and a second lead, including a first portion, a second portion and a Y-shaped third portion, the second portion of the second lead spaced apart from the second portions of the first leads in a gap in the repeating lead pitch pattern along the second direction, the second portion of the second lead spaced apart from the lead locations of the repeating lead pitch pattern along the second direction, and the Y-shaped third portion including:
a base section extending parallel to the second portions of the first leads along the first direction, the base section spaced apart from the lead locations of the repeating lead pitch pattern along the second direction,
a crossbar section extending parallel to the second direction between a first end and a second end,
first and second end sections extending parallel to the second portions of the first leads along the first direction between a respective one of the first and second ends of the crossbar section and the dam bar, the end sections positioned at lead locations of the repeating lead pitch pattern. 19. The lead frame of claim 18, wherein the second portion of the second lead is equally spaced apart from two adjacent lead locations of the repeating lead pitch pattern along the second direction. 20. The lead frame of claim 18, wherein the gap in the repeating lead pitch pattern includes two lead locations. 21. The electronic device of claim 1, wherein the second lead is not electrically connected to the semiconductor die. 22. The electronic device of claim 1, wherein at least two formed leads are omitted from each side of a two sided lead structure of the electronic device. 23. The method of claim 11, wherein the Y-shaped branch portions face toward the die attach pad. 24. The method of claim 11, wherein a base portion of the Y-shaped feature is connected to a tie bar and the branch portions of the Y-shaped feature are connected to a dam bar. 25. The method of claim 11, wherein the Y-shaped feature is not purposed as a lead. 26. The lead frame of claim 18, wherein the Y-shaped branch portions face toward the die attach pad. 27. The lead frame of claim 18, wherein a base portion of the Y-shaped feature is connected to a tie bar and the branch portions of the Y-shaped feature are connected to a dam bar. 28. The lead frame of claim 18, wherein the Y-shaped feature is not purposed as a lead. | 2,800 |
12,299 | 12,299 | 16,117,312 | 2,874 | A ferrule-based fiber optic connectors having a connector assembly with a ferrule insertion stop for limiting the insertion of a ferrule into a ferrule sleeve are disclosed. In one embodiment, the fiber optic connector comprising a connector assembly, ferrule insertion stop, a connector sleeve assembly and a female coupling housing. The connector assembly comprises a ferrule and a resilient member for biasing the ferrule forward and the connector sleeve assembly comprises a housing and a ferrule sleeve, where the ferrule of the connector assembly is at least partially disposed in the ferrule sleeve when assembled. The ferrule insertion stop limits the depth that the ferrule may be inserted into the ferrule sleeve. | 1. A fiber optic connector, comprising:
a connector assembly comprising a housing, a ferrule and a resilient member for biasing the ferrule forward; a ferrule insertion stop disposed about a portion of the ferrule; a first shell and a second shell for securing the connector assembly at a front end of the shells; a connector sleeve assembly comprising a housing comprising one or more features configured for attaching to the connector assembly and a passageway between a first end and a second end, and a ferrule sleeve, wherein the ferrule of the connector assembly is at least partially disposed in the ferrule sleeve when assembled; and a female coupling housing comprising an opening for receiving a complimentary connector. 2. The fiber optic connector of claim 1, the ferrule insertion stop being a collar disposed about a portion of the ferrule. 3. The fiber optic connector of claim 1, the connector assembly further comprising a ferrule holder, and the ferrule insertion stop being one or more extensions formed as a portion of the ferrule holder. 4. The fiber optic connector of claim 1, the housing of the connector sleeve assembly further comprising one or more connector sleeve orientation features that cooperate with one or more female coupling housing orientation features. 5. The fiber optic connector of claim 1, wherein the housing of the connector sleeve assembly comprises one or more latch arms for attaching to a portion of the housing of the connector assembly. 6. The fiber optic connector of claim 1, further comprising a crimp band. 7. The fiber optic connector of claim 1, the connector assembly being an SC connector assembly. 8. The fiber optic connector of claim 1 being a portion of a cable assembly further comprising a fiber optic cable attached to the fiber optic connector. 9. A fiber optic connector, comprising:
a connector assembly comprising a housing, a ferrule and a resilient member for biasing the ferrule forward; a ferrule insertion stop disposed about a portion of the ferrule, wherein the ferrule insertion stop is a collar disposed about a portion of the ferrule; a first shell and a second shell for securing the connector assembly at a front end of the shells; a connector sleeve assembly comprising a housing comprising one or more features configured for attaching to the connector assembly and a passageway between a first end and a second end, and a ferrule sleeve, wherein the ferrule of the connector assembly is at least partially disposed in the ferrule sleeve when assembled; and a female coupling housing comprising an opening for receiving a complimentary connector. 10. The fiber optic connector of claim 9, the housing of the connector sleeve assembly further comprising one or more connector sleeve orientation features that cooperate with one or more female coupling housing orientation features. 11. The fiber optic connector of claim 9, wherein the housing of the connector sleeve assembly comprises one or more latch arms for attaching to a portion of the housing of the connector assembly. 12. The fiber optic connector of claim 9, further comprising a crimp band. 13. The fiber optic connector of claim 9, the connector assembly being an SC connector assembly. 14. The fiber optic connector of claim 9 being a portion of a cable assembly further comprising a fiber optic cable attached to the fiber optic connector. 15. A fiber optic connector, comprising:
a connector assembly comprising a housing, a ferrule, a ferrule holder, and a resilient member for biasing the ferrule holder forward, wherein the connector assembly has a ferrule insertion stop being defined by one or more extensions formed as a portion of the ferrule holder; a first shell and a second shell for securing the connector assembly at a front end of the shells; a connector sleeve assembly comprising a housing comprising one or more features configured for attaching to the connector assembly and a passageway between a first end and a second end, and a ferrule sleeve, wherein the ferrule of the connector assembly is at least partially disposed in the ferrule sleeve when assembled; and a female coupling housing comprising an opening for receiving a complimentary connector. 16. The fiber optic connector of claim 15, the connector assembly further comprising a ferrule holder, and the ferrule insertion stop being one or more extensions formed as a portion of the ferrule holder. 17. The fiber optic connector of claim 15, the housing of the connector sleeve assembly further comprising one or more connector sleeve orientation features that cooperate with one or more female coupling housing orientation features. 18. The fiber optic connector of claim 15, wherein the housing of the connector sleeve assembly comprises one or more latch arms for attaching to a portion of the housing of the connector assembly. 19. The fiber optic connector of claim 15, further comprising a crimp band. 20. The fiber optic connector of claim 15, the connector assembly being an SC connector assembly. 21. The fiber optic connector of claim 15 being a portion of a cable assembly further comprising a fiber optic cable attached to the fiber optic connector. 22. A fiber optic connector, comprising:
a ferrule assembly comprising a ferrule and a ferrule holder, wherein the ferrule holder has a front end; a body comprising a first portion for receiving the ferrule assembly and a second portion for strain-relieving one or more tensile members of a cable; a connector sleeve assembly comprising a housing comprising one or more features configured for attaching to the body and a passageway between a first end and a second end, and an extended length ferrule sleeve, wherein the ferrule of the connector assembly is at least partially disposed in the extended length ferrule sleeve when assembled, and the extended length ferrule sleeve is inhibited from longitudinal displacement between the housing of the connector sleeve assembly and the front end of the ferrule holder; and a resilient member disposed between the body and the ferrule holder for biasing the ferrule assembly forward. 23. The fiber optic connector of claim 22, further comprising a female coupling housing comprising an opening for receiving a complimentary connector. | A ferrule-based fiber optic connectors having a connector assembly with a ferrule insertion stop for limiting the insertion of a ferrule into a ferrule sleeve are disclosed. In one embodiment, the fiber optic connector comprising a connector assembly, ferrule insertion stop, a connector sleeve assembly and a female coupling housing. The connector assembly comprises a ferrule and a resilient member for biasing the ferrule forward and the connector sleeve assembly comprises a housing and a ferrule sleeve, where the ferrule of the connector assembly is at least partially disposed in the ferrule sleeve when assembled. The ferrule insertion stop limits the depth that the ferrule may be inserted into the ferrule sleeve.1. A fiber optic connector, comprising:
a connector assembly comprising a housing, a ferrule and a resilient member for biasing the ferrule forward; a ferrule insertion stop disposed about a portion of the ferrule; a first shell and a second shell for securing the connector assembly at a front end of the shells; a connector sleeve assembly comprising a housing comprising one or more features configured for attaching to the connector assembly and a passageway between a first end and a second end, and a ferrule sleeve, wherein the ferrule of the connector assembly is at least partially disposed in the ferrule sleeve when assembled; and a female coupling housing comprising an opening for receiving a complimentary connector. 2. The fiber optic connector of claim 1, the ferrule insertion stop being a collar disposed about a portion of the ferrule. 3. The fiber optic connector of claim 1, the connector assembly further comprising a ferrule holder, and the ferrule insertion stop being one or more extensions formed as a portion of the ferrule holder. 4. The fiber optic connector of claim 1, the housing of the connector sleeve assembly further comprising one or more connector sleeve orientation features that cooperate with one or more female coupling housing orientation features. 5. The fiber optic connector of claim 1, wherein the housing of the connector sleeve assembly comprises one or more latch arms for attaching to a portion of the housing of the connector assembly. 6. The fiber optic connector of claim 1, further comprising a crimp band. 7. The fiber optic connector of claim 1, the connector assembly being an SC connector assembly. 8. The fiber optic connector of claim 1 being a portion of a cable assembly further comprising a fiber optic cable attached to the fiber optic connector. 9. A fiber optic connector, comprising:
a connector assembly comprising a housing, a ferrule and a resilient member for biasing the ferrule forward; a ferrule insertion stop disposed about a portion of the ferrule, wherein the ferrule insertion stop is a collar disposed about a portion of the ferrule; a first shell and a second shell for securing the connector assembly at a front end of the shells; a connector sleeve assembly comprising a housing comprising one or more features configured for attaching to the connector assembly and a passageway between a first end and a second end, and a ferrule sleeve, wherein the ferrule of the connector assembly is at least partially disposed in the ferrule sleeve when assembled; and a female coupling housing comprising an opening for receiving a complimentary connector. 10. The fiber optic connector of claim 9, the housing of the connector sleeve assembly further comprising one or more connector sleeve orientation features that cooperate with one or more female coupling housing orientation features. 11. The fiber optic connector of claim 9, wherein the housing of the connector sleeve assembly comprises one or more latch arms for attaching to a portion of the housing of the connector assembly. 12. The fiber optic connector of claim 9, further comprising a crimp band. 13. The fiber optic connector of claim 9, the connector assembly being an SC connector assembly. 14. The fiber optic connector of claim 9 being a portion of a cable assembly further comprising a fiber optic cable attached to the fiber optic connector. 15. A fiber optic connector, comprising:
a connector assembly comprising a housing, a ferrule, a ferrule holder, and a resilient member for biasing the ferrule holder forward, wherein the connector assembly has a ferrule insertion stop being defined by one or more extensions formed as a portion of the ferrule holder; a first shell and a second shell for securing the connector assembly at a front end of the shells; a connector sleeve assembly comprising a housing comprising one or more features configured for attaching to the connector assembly and a passageway between a first end and a second end, and a ferrule sleeve, wherein the ferrule of the connector assembly is at least partially disposed in the ferrule sleeve when assembled; and a female coupling housing comprising an opening for receiving a complimentary connector. 16. The fiber optic connector of claim 15, the connector assembly further comprising a ferrule holder, and the ferrule insertion stop being one or more extensions formed as a portion of the ferrule holder. 17. The fiber optic connector of claim 15, the housing of the connector sleeve assembly further comprising one or more connector sleeve orientation features that cooperate with one or more female coupling housing orientation features. 18. The fiber optic connector of claim 15, wherein the housing of the connector sleeve assembly comprises one or more latch arms for attaching to a portion of the housing of the connector assembly. 19. The fiber optic connector of claim 15, further comprising a crimp band. 20. The fiber optic connector of claim 15, the connector assembly being an SC connector assembly. 21. The fiber optic connector of claim 15 being a portion of a cable assembly further comprising a fiber optic cable attached to the fiber optic connector. 22. A fiber optic connector, comprising:
a ferrule assembly comprising a ferrule and a ferrule holder, wherein the ferrule holder has a front end; a body comprising a first portion for receiving the ferrule assembly and a second portion for strain-relieving one or more tensile members of a cable; a connector sleeve assembly comprising a housing comprising one or more features configured for attaching to the body and a passageway between a first end and a second end, and an extended length ferrule sleeve, wherein the ferrule of the connector assembly is at least partially disposed in the extended length ferrule sleeve when assembled, and the extended length ferrule sleeve is inhibited from longitudinal displacement between the housing of the connector sleeve assembly and the front end of the ferrule holder; and a resilient member disposed between the body and the ferrule holder for biasing the ferrule assembly forward. 23. The fiber optic connector of claim 22, further comprising a female coupling housing comprising an opening for receiving a complimentary connector. | 2,800 |
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