Unnamed: 0 int64 0 350k | level_0 int64 0 351k | ApplicationNumber int64 9.75M 96.1M | ArtUnit int64 1.6k 3.99k | Abstract stringlengths 1 8.37k | Claims stringlengths 3 292k | abstract-claims stringlengths 68 293k | TechCenter int64 1.6k 3.9k |
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12,000 | 12,000 | 15,810,693 | 2,846 | A system and method for sensing rotor position of a three-phase permanent magnet synchronous motor (PMSM) includes a controller coupled with the PMSM and causing a plurality of voltage pulses to be applied thereto. A timer and/or an analog-to-digital converter is coupled with the PMSM and measures a plurality of values... | 1. A system for sensing rotor position of a motor, the system comprising:
a controller configured to couple with a star configuration three-phase permanent magnet synchronous motor (PMSM), the controller configured to cause a plurality of voltage pulses to be applied to the PMSM; an analog-to-digital converter (ADC) co... | A system and method for sensing rotor position of a three-phase permanent magnet synchronous motor (PMSM) includes a controller coupled with the PMSM and causing a plurality of voltage pulses to be applied thereto. A timer and/or an analog-to-digital converter is coupled with the PMSM and measures a plurality of values... | 2,800 |
12,001 | 12,001 | 15,817,810 | 2,822 | A power semiconductor device includes a semiconductor body configured to conduct a load current. A load terminal electrically connected with the semiconductor body is configured to couple the load current into and/or out of the semiconductor body. The load terminal includes a metallization having a frontside and a back... | 1. A power semiconductor device, comprising
a semiconductor body configured to conduct a load current; and a first load terminal electrically connected with the semiconductor body and configured to couple the load current into and/or out of the semiconductor body, wherein the first load terminal comprises a metallizati... | A power semiconductor device includes a semiconductor body configured to conduct a load current. A load terminal electrically connected with the semiconductor body is configured to couple the load current into and/or out of the semiconductor body. The load terminal includes a metallization having a frontside and a back... | 2,800 |
12,002 | 12,002 | 15,260,332 | 2,882 | An optical device includes a phosphor wheel and two light sources. The phosphor wheel has two phosphor regions. The phosphor regions are located at different radial positions of the phosphor wheel and are not overlapped. Each of the phosphor regions has a plurality of color sections. The light sources emit two light be... | 1. An optical device, comprising:
a phosphor wheel having two phosphor regions, the phosphor regions being located at different radial positions of the phosphor wheel and not overlapped, each of the phosphor regions having a plurality of color sections; and two light sources emitting two light beams so as to respective... | An optical device includes a phosphor wheel and two light sources. The phosphor wheel has two phosphor regions. The phosphor regions are located at different radial positions of the phosphor wheel and are not overlapped. Each of the phosphor regions has a plurality of color sections. The light sources emit two light be... | 2,800 |
12,003 | 12,003 | 15,676,614 | 2,853 | A conveyer mechanism ( 110 ) may include one or more composition inspection units provided along the intended product transport path. The product's composition, e.g., it's ink composition, is compared with a predetermined standard, to determine whether the product is acceptable. A bar code ( 48, 45.1, 47.1, 85 ) may be... | 1. A spin printer for providing bar codes on a surface of a plurality of capsules or a plurality of caplets, the spin printer comprising:
at least a first drum unit that spins about a drum axis with each of said capsules or each of said caplets carried by the first drum unit and having a product axis oriented substanti... | A conveyer mechanism ( 110 ) may include one or more composition inspection units provided along the intended product transport path. The product's composition, e.g., it's ink composition, is compared with a predetermined standard, to determine whether the product is acceptable. A bar code ( 48, 45.1, 47.1, 85 ) may be... | 2,800 |
12,004 | 12,004 | 15,897,338 | 2,837 | A musical instrument stand, including: a stand including a plurality of leg columns, a height of each of the plurality of leg columns being adjustable; a musical instrument mount which is installed on the stand and on which a musical instrument is to be mounted; and a connector including an elastic member and connectin... | 1. A musical instrument stand, comprising:
a stand including a plurality of leg columns, a height of each of the plurality of leg columns being adjustable; a musical instrument mount which is installed on the stand and on which a musical instrument is to be mounted; and a connector including an elastic member and conne... | A musical instrument stand, including: a stand including a plurality of leg columns, a height of each of the plurality of leg columns being adjustable; a musical instrument mount which is installed on the stand and on which a musical instrument is to be mounted; and a connector including an elastic member and connectin... | 2,800 |
12,005 | 12,005 | 15,625,867 | 2,864 | Energy usage of a plurality of appliances is measured using a single meter. A pattern of energy usage with respect to the plurality of appliances is determined dependent upon the measured energy usage, appliance details of the plurality of appliances, and usage hours of the plurality of appliances. The pattern is provi... | 1. An energy usage awareness system comprising:
an energy meter that measures energy usage of a building and stores measured energy usage as a measured power magnitude that is sampled at specified intervals and for a specified duration of time; a memory that stores appliance information about one or more energy using a... | Energy usage of a plurality of appliances is measured using a single meter. A pattern of energy usage with respect to the plurality of appliances is determined dependent upon the measured energy usage, appliance details of the plurality of appliances, and usage hours of the plurality of appliances. The pattern is provi... | 2,800 |
12,006 | 12,006 | 14,274,519 | 2,836 | A fault detection circuit for use with a power converter includes an initiate fault check circuit coupled to generate an enable signal in response to a first sense signal coupled to be received from an output socket. A threshold detection circuit is coupled to generate a threshold detection output signal in response to... | 1. A fault detection circuit for use with a power converter, comprising:
an initiate fault check circuit coupled to generate an enable signal in response to a first sense signal coupled to be received from an output socket; a threshold detection circuit coupled to generate a threshold detection output signal in respons... | A fault detection circuit for use with a power converter includes an initiate fault check circuit coupled to generate an enable signal in response to a first sense signal coupled to be received from an output socket. A threshold detection circuit is coupled to generate a threshold detection output signal in response to... | 2,800 |
12,007 | 12,007 | 15,796,890 | 2,892 | A silicon carbide semiconductor device includes plural p-type silicon carbide epitaxial layers provided on an n + -type silicon carbide substrate. In some of the p-type silicon carbide epitaxial layers, an n + source region is provided in at least a region of an upper portion. The n + source region contains arsenic. | 1. A silicon carbide semiconductor device comprising
an n-type semiconductor region in at least a region of an upper portion of a p-type silicon carbide region provided on an n-type silicon carbide substrate, the p-type silicon carbide region having an impurity concentration equal to or lower than 1.0×1018 cm−3, wherei... | A silicon carbide semiconductor device includes plural p-type silicon carbide epitaxial layers provided on an n + -type silicon carbide substrate. In some of the p-type silicon carbide epitaxial layers, an n + source region is provided in at least a region of an upper portion. The n + source region contains arsenic.1... | 2,800 |
12,008 | 12,008 | 15,681,503 | 2,883 | Keying may be used to indicate various features of cables, cable connectors, and/or equipment. The keying mechanisms of the connectors systems disclosed herein identifies whether each plug is a pinned plug or a pinless plug. The keying mechanisms disclosed herein identify the number of optical fibers terminated at each... | 1. A plug to be inserted into a receptacle having a first geometry, the plug comprising:
a ferule that holds at least one optical fiber; a body having an exterior with a second geometry that corresponds to the first geometry such that the first and second geometries are mating pairs, the second geometry including a key... | Keying may be used to indicate various features of cables, cable connectors, and/or equipment. The keying mechanisms of the connectors systems disclosed herein identifies whether each plug is a pinned plug or a pinless plug. The keying mechanisms disclosed herein identify the number of optical fibers terminated at each... | 2,800 |
12,009 | 12,009 | 15,306,528 | 2,859 | An electric toothbrush with a rechargeable battery includes a chassis having a rechargeable battery receiving section and a bobbin section, which are integrally formed to each other and are aligned along a common axis in said order. The rechargeable battery receiving section and the bobbin section are connected to each... | 1. An electric toothbrush with a rechargeable battery comprising:
a chassis having a motor receiving section, a rechargeable battery receiving section and a bobbin section, which are integrally formed to each other and are aligned along a common axis in said order; a DC motor accommodated in the motor receiving section... | An electric toothbrush with a rechargeable battery includes a chassis having a rechargeable battery receiving section and a bobbin section, which are integrally formed to each other and are aligned along a common axis in said order. The rechargeable battery receiving section and the bobbin section are connected to each... | 2,800 |
12,010 | 12,010 | 15,040,518 | 2,872 | Disclosed are lenses and methods for verifying a lens with an induced aperture. The lenses can have a geometry that, among other things, maintains a centered position about a wearer's eye to prevent more than a permissible amount of movement of the lens relative to the eye. Further disclosed is a method for verifying t... | 1. An ophthalmic lens comprising:
an apex area having distance vision correcting power and a power distribution creating a blurred region outside of the apex area so as to cause an induced aperture; a base curve between 7.9 mm and 8.5 mm; and a lens diameter between 14.0 and 14.5 mm. 2. The ophthalmic lens of claim 1, ... | Disclosed are lenses and methods for verifying a lens with an induced aperture. The lenses can have a geometry that, among other things, maintains a centered position about a wearer's eye to prevent more than a permissible amount of movement of the lens relative to the eye. Further disclosed is a method for verifying t... | 2,800 |
12,011 | 12,011 | 15,608,071 | 2,836 | An integrated circuit for demagnetizing an inductive load includes a first switch to control current supplied by a voltage supply to the inductive load. A Zener diode includes an anode connected to a control terminal of the first switch and a cathode connected to the voltage supply. A second switch includes a control t... | 1-20. (canceled) 21. A discharge circuit for an inductive load, comprising:
a clamp circuit connected between a first reference potential and an output node, wherein the inductive load is connected to the output node; a temperature sensing circuit to generate a sensed temperature signal based on a temperature of the cl... | An integrated circuit for demagnetizing an inductive load includes a first switch to control current supplied by a voltage supply to the inductive load. A Zener diode includes an anode connected to a control terminal of the first switch and a cathode connected to the voltage supply. A second switch includes a control t... | 2,800 |
12,012 | 12,012 | 16,115,828 | 2,851 | A method for design optimization of a quantum circuit includes analyzing a first quantum circuit design based on at least one of a set of design criteria, wherein the first quantum circuit design includes a set of quantum logic gates, and wherein a design criterion in the set of design criteria includes changing a size... | 1. A method for design optimization of a quantum circuit, comprising:
analyzing a first quantum circuit design based on at least one of a set of design criteria, wherein the first quantum circuit design comprises a set of quantum logic gates, and wherein a design criterion in the set of design criteria comprises changi... | A method for design optimization of a quantum circuit includes analyzing a first quantum circuit design based on at least one of a set of design criteria, wherein the first quantum circuit design includes a set of quantum logic gates, and wherein a design criterion in the set of design criteria includes changing a size... | 2,800 |
12,013 | 12,013 | 16,427,836 | 2,861 | A turbidity measurement device for measuring turbidity of a fluid flowing in a flow tube. A first transducer transmits ultrasonic signals through the fluid in the turbidity measurement section so as to provide a first ultrasonic standing wave between the first and second section ends. A receiver transducer receives the... | 1-22. (canceled) 23. A device arranged to measure turbidity of a fluid flowing in a flow tube, the device comprising:
a flow tube having a through-going opening for passage of a fluid between an inlet and an outlet and a turbidity measurement section between a first section end and a second section end, a first transdu... | A turbidity measurement device for measuring turbidity of a fluid flowing in a flow tube. A first transducer transmits ultrasonic signals through the fluid in the turbidity measurement section so as to provide a first ultrasonic standing wave between the first and second section ends. A receiver transducer receives the... | 2,800 |
12,014 | 12,014 | 15,292,191 | 2,837 | An electric machine may include a rotor. The electric machine may include a stator surrounding the rotor having teeth defining slots having at least two cross-sectional areas housing windings having uniform cross-sectional areas that fill each of the cross-sectional areas of the slots to substantially similar proportio... | 1. An electric machine comprising:
a rotor; and a stator surrounding the rotor and including teeth defining slots having at least two cross-sectional areas housing windings having uniform cross-sectional areas that fill each of the cross-sectional areas of the slots to substantially similar proportions relative to othe... | An electric machine may include a rotor. The electric machine may include a stator surrounding the rotor having teeth defining slots having at least two cross-sectional areas housing windings having uniform cross-sectional areas that fill each of the cross-sectional areas of the slots to substantially similar proportio... | 2,800 |
12,015 | 12,015 | 15,160,244 | 2,858 | Embodiments relate to xMR sensors, including giant magnetoresistive (GMR), tunneling magnetoresistive (TMR) or anisotropic magnetoresistive (AMR), and the configuration of xMR strips within xMR sensors. In an embodiment, an xMR strip includes a plurality of differently sized and/or differently oriented serially connect... | 1. A magnetoresistive sensor element sensitive to a magnetic field strength, the sensor element comprising:
a magnetoresistive strip comprising a plurality of serial segments, adjacent ones of the segments having different tilt angles that are associated with, in the presence of a rotating magnetic field, discontinuiti... | Embodiments relate to xMR sensors, including giant magnetoresistive (GMR), tunneling magnetoresistive (TMR) or anisotropic magnetoresistive (AMR), and the configuration of xMR strips within xMR sensors. In an embodiment, an xMR strip includes a plurality of differently sized and/or differently oriented serially connect... | 2,800 |
12,016 | 12,016 | 14,491,113 | 2,862 | Devices and processes provide for geophysical oil, gas, or mineral prospecting and subsurface fluid monitoring, using a controlled source electromagnetic system that transmits a designed probe wave to create images of sub-surface structures and fluids either statically or while in motion. | 1. A system for determination of subsurface geophysical data, comprising:
a plurality of controlled source electromagnetic receivers, operatively distributed across a surface of the earth and synchronized with each other; and a controlled source electromagnetic transmitter operatively positioned relative to the plurali... | Devices and processes provide for geophysical oil, gas, or mineral prospecting and subsurface fluid monitoring, using a controlled source electromagnetic system that transmits a designed probe wave to create images of sub-surface structures and fluids either statically or while in motion.1. A system for determination o... | 2,800 |
12,017 | 12,017 | 14,511,266 | 2,837 | Electromagnetic inductor components include a magnetic core and a conductor assembled with the core and defining a winding completing a number of turns. The conductor is fabricated from a composite material including carbon nanotubes having an improved conductivity. The conductor has a cross section defined by an effec... | 1. An electromagnetic inductor component comprising:
a magnetic core; and a conductor fabricated from a conductive material having a first electrical conductivity, the conductor shaped to form a coil defining a winding completing a number of turns; and the conductor further shaped with a first cross sectional area and ... | Electromagnetic inductor components include a magnetic core and a conductor assembled with the core and defining a winding completing a number of turns. The conductor is fabricated from a composite material including carbon nanotubes having an improved conductivity. The conductor has a cross section defined by an effec... | 2,800 |
12,018 | 12,018 | 15,849,271 | 2,851 | A technique capable of controlling a film thickness distribution formed on a surface of a substrate includes: forming a film on a substrate by performing a cycle a predetermined number of times, the cycle including: (a) supplying a source to the substrate accommodated in a process chamber; (b) exhausting the source fro... | 1. A method of manufacturing a semiconductor device, comprising:
forming a film on a substrate by performing a cycle a predetermined number of times, the cycle comprising:
(a) supplying a source to the substrate accommodated in a process chamber;
(b) exhausting the source from the process chamber;
(c) supplying a react... | A technique capable of controlling a film thickness distribution formed on a surface of a substrate includes: forming a film on a substrate by performing a cycle a predetermined number of times, the cycle including: (a) supplying a source to the substrate accommodated in a process chamber; (b) exhausting the source fro... | 2,800 |
12,019 | 12,019 | 15,354,178 | 2,892 | The present invention provides an organic emitting diode including a first electrode; a second electrode facing the first electrode; an emitting material layer between the first and second electrodes; and an intervening layer between the emitting material layer and the second electrode and including a base material and... | 1. An organic emitting diode, comprising:
a first electrode; a second electrode facing the first electrode; an emitting material layer between the first and second electrodes; and an intervening layer between the emitting material layer and the second electrode and including a base material and an electron injection ma... | The present invention provides an organic emitting diode including a first electrode; a second electrode facing the first electrode; an emitting material layer between the first and second electrodes; and an intervening layer between the emitting material layer and the second electrode and including a base material and... | 2,800 |
12,020 | 12,020 | 16,058,749 | 2,845 | In some examples, an integrated circuit device includes a sampling switch configured to sample an input signal. The integrated circuit device also includes a first evaluation unit configured to receive the sampled input signal from the sampling switch and evaluate the sampled input signal. The integrated circuit device... | 1. An integrated circuit device comprising:
a sampling switch configured to sample an input signal; a first evaluation unit configured to:
receive the sampled input signal from the sampling switch; and
evaluate the sampled input signal; and
a second evaluation unit configured to:
receive the sampled input signal from ... | In some examples, an integrated circuit device includes a sampling switch configured to sample an input signal. The integrated circuit device also includes a first evaluation unit configured to receive the sampled input signal from the sampling switch and evaluate the sampled input signal. The integrated circuit device... | 2,800 |
12,021 | 12,021 | 15,432,150 | 2,838 | A method may include operating a DC-DC switch converter in a forced continuous conduction mode in which for each switching cycle of the switch converter during the forced continuous conduction mode, the switch converter operates in a series of phases including: a first phase in which an inductor current flowing in an i... | 1. A method of operating a direct current-to-direct current (DC-DC) switch converter, comprising operating the DC-DC switch converter in a forced continuous conduction mode in which for each switching cycle of the DC-DC switch converter during the forced continuous conduction mode, the DC-DC switch converter operates i... | A method may include operating a DC-DC switch converter in a forced continuous conduction mode in which for each switching cycle of the switch converter during the forced continuous conduction mode, the switch converter operates in a series of phases including: a first phase in which an inductor current flowing in an i... | 2,800 |
12,022 | 12,022 | 16,011,985 | 2,886 | A hearing aid includes a speaker driver, an optical source secured directly to the speaker driver, an optical detector secured directly to the speaker driver, a first light guide extending outwardly from the optical source and in optical communication with the optical source, and a second light guide extending outwardl... | 1. A headset, comprising:
a speaker driver; a printed circuit board (PCB) directly mounted on a surface of the speaker driver; and a sensor module supported by the PCB and electrically connected to the speaker driver, wherein the sensor module comprises an optical source and an optical detector, and wherein the sensor ... | A hearing aid includes a speaker driver, an optical source secured directly to the speaker driver, an optical detector secured directly to the speaker driver, a first light guide extending outwardly from the optical source and in optical communication with the optical source, and a second light guide extending outwardl... | 2,800 |
12,023 | 12,023 | 15,301,772 | 2,816 | A method for mounting an electrical component on a substrate is disclosed. According to the method, joining is simplified using a cover, or hood, that includes a contact structure on an inner side of the hood, wherein when the hood is mounted, the contact structure is joined to the underlying structure at different joi... | 1. A method for mounting an electrical component on a substrate, wherein the component has a bottom side facing toward the substrate and a top side situated opposite said bottom side, the method comprising:
mounting the component onto the substrate, forming a cover including integrated conductor paths that define a con... | A method for mounting an electrical component on a substrate is disclosed. According to the method, joining is simplified using a cover, or hood, that includes a contact structure on an inner side of the hood, wherein when the hood is mounted, the contact structure is joined to the underlying structure at different joi... | 2,800 |
12,024 | 12,024 | 14,804,031 | 2,853 | In an aspect, a system and method for assembling a semiconductor device on a receiving surface of a destination substrate is disclosed. In another aspect, a system and method for assembling a semiconductor device on a destination substrate with topographic features is disclosed. In another aspect, a gravity-assisted se... | 1. A conformable transfer device with reduced crowning, the transfer device comprising:
a bulk volume having a first surface and a second surface, opposite the first surface, and a side between the first surface and the second surface, wherein the bulk area comprises a tapered surface connecting the side to the first s... | In an aspect, a system and method for assembling a semiconductor device on a receiving surface of a destination substrate is disclosed. In another aspect, a system and method for assembling a semiconductor device on a destination substrate with topographic features is disclosed. In another aspect, a gravity-assisted se... | 2,800 |
12,025 | 12,025 | 14,603,877 | 2,884 | Electro-optical sighting systems and methods are provided. One example includes a optical transmitter configured to emit an infrared beam along an optical path toward a target, a beam director positioned in the optical path and having a plurality of optical elements configured to direct the infrared beam and to collect... | 1. An electro-optical sighting system comprising:
a first optical transmitter configured to emit an infrared beam along an optical path toward a target; a beam director positioned in the optical path and having a plurality of optical elements configured to direct the infrared beam and to collect reflected infrared radi... | Electro-optical sighting systems and methods are provided. One example includes a optical transmitter configured to emit an infrared beam along an optical path toward a target, a beam director positioned in the optical path and having a plurality of optical elements configured to direct the infrared beam and to collect... | 2,800 |
12,026 | 12,026 | 15,250,172 | 2,846 | MCU ( 2001 ) determines whether at least one of double three-phase inverter ( 2030 ) or battery ( 2002 ) has a failure, or battery ( 2002 ) is fully charged, and switches control to be performed in inverter ( 2030 ) between all-phase shut off and three-phase short circuit based on a motor rotation speed of double three... | 1. A motor drive device to be mounted on a vehicle including an engine and a motor directly coupled to each other,
the vehicle comprising a DC power supply device that is configured to supply electric power to the motor, and is charged by output of the motor, the motor drive device comprising:
an inverter configured to... | MCU ( 2001 ) determines whether at least one of double three-phase inverter ( 2030 ) or battery ( 2002 ) has a failure, or battery ( 2002 ) is fully charged, and switches control to be performed in inverter ( 2030 ) between all-phase shut off and three-phase short circuit based on a motor rotation speed of double three... | 2,800 |
12,027 | 12,027 | 15,831,697 | 2,813 | Implementations of image sensor packages may include an image sensor chip, a first layer including an opening therethrough coupled to a first side of the image sensor chip, and a optically transmissive cover coupled to the first layer. The optically transmissive cover, the first layer, and the image sensor chip may for... | 1. An image sensor package comprising:
an image sensor chip; a first layer comprising an opening therethrough coupled to a first side of the image sensor chip; an optically transmissive cover coupled to the first layer, wherein the optically transmissive cover, the first layer, and the image sensor chip comprise a cavi... | Implementations of image sensor packages may include an image sensor chip, a first layer including an opening therethrough coupled to a first side of the image sensor chip, and a optically transmissive cover coupled to the first layer. The optically transmissive cover, the first layer, and the image sensor chip may for... | 2,800 |
12,028 | 12,028 | 15,235,547 | 2,861 | The present invention concerns a downhole logging tool adapted to be arranged in-line in a sucker rod string. The tool is adapted for monitoring and performing at least one of: logging tension/compression, torque, temperature, pressure, and position (acceleration), for the purpose of optimizing (oil)well production and... | 1. A downhole monitoring device arranged in-line with a sucker rod string, the monitoring device comprising:
a housing arranged in-line with the sucker rod string; a plurality of sensors arranged within the housing and configured for sensing at least one of: sucker rod string conditions and sucker rod string surroundin... | The present invention concerns a downhole logging tool adapted to be arranged in-line in a sucker rod string. The tool is adapted for monitoring and performing at least one of: logging tension/compression, torque, temperature, pressure, and position (acceleration), for the purpose of optimizing (oil)well production and... | 2,800 |
12,029 | 12,029 | 15,037,244 | 2,824 | An automation system which includes a first and a second controller for controlling an appliance or an installation, first and second input and/or output (I/O) units for receiving an electronic signal from the installation appliance or the installation and/or for outputting an electronic signal to the appliance or the ... | 1.-13. (canceled) 14. An automation system comprising:
a first controller and a second controller for controlling a device or an installation; a first input and/or output (I/O) unit and a second I/O unit for at least one of (i) receiving an electronic signal from the device or the installation and (ii) outputting an el... | An automation system which includes a first and a second controller for controlling an appliance or an installation, first and second input and/or output (I/O) units for receiving an electronic signal from the installation appliance or the installation and/or for outputting an electronic signal to the appliance or the ... | 2,800 |
12,030 | 12,030 | 14,212,991 | 2,815 | An IGBT device includes an IGBT stack, a collector contact, a gate contact, and an emitter contact. The IGBT stack includes an injector region, a drift region over the injector region, a spreading region over the drift region, and a pair of junction implants in the spreading region. The spreading region provides a firs... | 1. An insulated gate bipolar transistor (IGBT) device comprising:
an IGBT stack, wherein the IGBT stack includes:
an injector region;
a drift region over the injector region;
a spreading region over the drift region, the spreading region providing a first surface of the IGBT stack opposite the drift region; and
a pair ... | An IGBT device includes an IGBT stack, a collector contact, a gate contact, and an emitter contact. The IGBT stack includes an injector region, a drift region over the injector region, a spreading region over the drift region, and a pair of junction implants in the spreading region. The spreading region provides a firs... | 2,800 |
12,031 | 12,031 | 15,782,659 | 2,828 | A system and method for scanning the wavelength of an external cavity laser uses synchronized angular motions of two mirrors. By adjusting the angular motions in a selected ratio, it is possible to change the lasing wavelength of the cavity without mode-hops. The mode-hop free ratio of angular motions is determined by ... | 1. An apparatus, comprising:
a first reflector rotatable about a first axis and situated to receive an intracavity laser beam of an external cavity laser from a diffraction grating and to direct the intracavity laser beam along a first direction; and a second reflector rotatable about a second axis and situated to retr... | A system and method for scanning the wavelength of an external cavity laser uses synchronized angular motions of two mirrors. By adjusting the angular motions in a selected ratio, it is possible to change the lasing wavelength of the cavity without mode-hops. The mode-hop free ratio of angular motions is determined by ... | 2,800 |
12,032 | 12,032 | 14,503,366 | 2,859 | Methods and apparatuses for communicating across an inductive charging interface. Methods and apparatuses for improved efficiency of power transfer across an inductive charging interface. | 1.-49. (canceled) 50. An adaptive power control system for an electromagnetic induction power transfer apparatus comprising:
a signal receiver; a power supply with an active state and an inactive state, configured to switch between the active state and the inactive state at a selectable duty cycle; a power-transmitting... | Methods and apparatuses for communicating across an inductive charging interface. Methods and apparatuses for improved efficiency of power transfer across an inductive charging interface.1.-49. (canceled) 50. An adaptive power control system for an electromagnetic induction power transfer apparatus comprising:
a signal... | 2,800 |
12,033 | 12,033 | 15,164,665 | 2,824 | An apparatus is provided which comprises: a select line; a select transistor coupled to a resistive memory element and to the select line; a word-line coupled to a gate terminal of the select transistor; and a current mirror operable to be coupled to the select line during a first mode and to be de-coupled during a sec... | 1. An apparatus comprising:
a select line; a select transistor coupled to a resistive memory element and to the select line; a word-line coupled to a gate terminal of the select transistor; a bit-line coupled to the resistive memory element; a first write driver to couple to the bit-line, wherein the first write driver... | An apparatus is provided which comprises: a select line; a select transistor coupled to a resistive memory element and to the select line; a word-line coupled to a gate terminal of the select transistor; and a current mirror operable to be coupled to the select line during a first mode and to be de-coupled during a sec... | 2,800 |
12,034 | 12,034 | 15,093,563 | 2,877 | An immersion probe system is provided for simultaneously performing first analysis of a first portion of light originating from liquids and/or particles in a fluid and second analysis of a second portion of the light originating from the liquids and/or particles. The system defines an optical axis and includes a first ... | 1. A system for simultaneously performing first analysis of a first portion of light originating from liquids and/or particles in a fluid and second analysis of a second portion of the light originating from the liquids and/or particles, the system defining an optical axis and comprising:
a first component including a ... | An immersion probe system is provided for simultaneously performing first analysis of a first portion of light originating from liquids and/or particles in a fluid and second analysis of a second portion of the light originating from the liquids and/or particles. The system defines an optical axis and includes a first ... | 2,800 |
12,035 | 12,035 | 16,400,530 | 2,874 | A fiber optic cable assembly a termination assembly attached at the first and second ends of the ribbon. The ferrule has a polished contact surface that exposes ends of the optical fibers, and the contact surface forms an oblique angle relative to a plane normal to axes defined by the fibers. Each contact surface is sl... | 1. A fiber optic cable assembly, comprising:
a plurality of substantially parallel optical fibers formed into a ribbon, the ribbon extending in a longitudinal direction and having first and second ends; a termination assembly attached at each of the first and second ends of the ribbon, wherein each of the termination a... | A fiber optic cable assembly a termination assembly attached at the first and second ends of the ribbon. The ferrule has a polished contact surface that exposes ends of the optical fibers, and the contact surface forms an oblique angle relative to a plane normal to axes defined by the fibers. Each contact surface is sl... | 2,800 |
12,036 | 12,036 | 16,325,868 | 2,844 | A lighting device (10) for operating from a main power supply or from an auxiliary power supply (25), in co-operation with a switching device transmitting a wireless control signal indicative of a power condition of the main power supply. The lighting device (10) accommodates in a single housing (11) a light emitting m... | 1. A lighting device comprising terminals for connecting a main power supply, said lighting device comprising:
a light emitting module, a control circuit for monitoring a wireless control signal indicative of a power condition of said main power supply and for monitoring a power condition at said terminals, and an auxi... | A lighting device (10) for operating from a main power supply or from an auxiliary power supply (25), in co-operation with a switching device transmitting a wireless control signal indicative of a power condition of the main power supply. The lighting device (10) accommodates in a single housing (11) a light emitting m... | 2,800 |
12,037 | 12,037 | 14,905,959 | 2,815 | An LED die ( 40 ) includes an N-type layer ( 18 ), a P-type layer ( 22 ), and an active layer ( 20 ) epitaxially grown over a first surface of a transparent growth substrate ( 46 ). Light is emitted through a second surface of the substrate opposite the first surface and is wavelength converted by a phosphor layer ( 30... | 1. A light emitting diode (LED) die structure comprising:
LED semiconductor layers including an N-type layer, a P-type layer, and an active layer that emits light; a growth substrate having a first surface and a second surface opposing the first surface; the N-type layer, the P-type layer, and the active layer being gr... | An LED die ( 40 ) includes an N-type layer ( 18 ), a P-type layer ( 22 ), and an active layer ( 20 ) epitaxially grown over a first surface of a transparent growth substrate ( 46 ). Light is emitted through a second surface of the substrate opposite the first surface and is wavelength converted by a phosphor layer ( 30... | 2,800 |
12,038 | 12,038 | 16,007,087 | 2,842 | Provided is a power amplification module that includes: an amplification transistor that has a constant power supply voltage supplied to a collector thereof, a bias current supplied to a base thereof and that amplifies an input signal input to the base thereof and outputs an amplified signal from the collector thereof;... | 1. A power amplification module comprising:
an amplification transistor that has a constant power supply voltage supplied to a collector of the amplification transistor, that has a bias current supplied to a base of the amplification transistor and that amplifies an input signal input to the base of the amplification t... | Provided is a power amplification module that includes: an amplification transistor that has a constant power supply voltage supplied to a collector thereof, a bias current supplied to a base thereof and that amplifies an input signal input to the base thereof and outputs an amplified signal from the collector thereof;... | 2,800 |
12,039 | 12,039 | 15,586,497 | 2,853 | A MEMS sensor includes a proof mass that is suspended over a substrate. A sense electrode is located on a top surface of the substrate parallel to the proof mass, and forms a capacitor with the proof mass. The sense electrodes have a plurality of slots that provide improved performance for the MEMS sensor. A measured v... | 1. A system for providing for capacitive sensing of an external force on a microelectromechanical system (MEMS) device, the system comprising:
a substrate located in a first plane; a movable component of a MEMS device layer, the MEMS device layer coupled to the substrate, wherein the movable component moves along a fir... | A MEMS sensor includes a proof mass that is suspended over a substrate. A sense electrode is located on a top surface of the substrate parallel to the proof mass, and forms a capacitor with the proof mass. The sense electrodes have a plurality of slots that provide improved performance for the MEMS sensor. A measured v... | 2,800 |
12,040 | 12,040 | 15,964,916 | 2,846 | Conduction band control schemes are presented for reducing noise and/or lower harmonics in power tools. A controller in the tool is interfaced with a plurality of motor switches and, for each phase, operates to output a pulse-width modulated (PWM) signal to one or more of the motor switches to control power supplied to... | 1. A power tool, comprising:
a brushless direct current (BLDC) motor having a stator defining a plurality of phases; a switching arrangement having a plurality of motor switches connected electrically between a power source and the BLDC motor and operates to deliver power to the BLDC motor; and a controller interfaced ... | Conduction band control schemes are presented for reducing noise and/or lower harmonics in power tools. A controller in the tool is interfaced with a plurality of motor switches and, for each phase, operates to output a pulse-width modulated (PWM) signal to one or more of the motor switches to control power supplied to... | 2,800 |
12,041 | 12,041 | 16,001,314 | 2,875 | An indoor illumination lamp includes a housing to be attached to an interior ceiling of a vehicle and provided with an opening, an interior light lens arranged at the opening of the housing, a chamber provided in the housing and surrounding the opening where the interior light lens is arranged, a light emitting diode a... | 1. An indoor illumination lamp, comprising:
a housing to be attached to an interior ceiling of a vehicle and provided with an opening; a lens arranged at the opening of the housing; a chamber provided in the housing and surrounding the opening where the lens is arranged; a light emitting diode arranged at a corner of t... | An indoor illumination lamp includes a housing to be attached to an interior ceiling of a vehicle and provided with an opening, an interior light lens arranged at the opening of the housing, a chamber provided in the housing and surrounding the opening where the interior light lens is arranged, a light emitting diode a... | 2,800 |
12,042 | 12,042 | 13,338,644 | 2,872 | Certain example embodiments of this invention relate to sputtered aluminum second surface mirrors with permanent protective coatings optionally provided thereto, and/or methods of making the same. A mirror coating supported by a substrate may include, for example, first and second silicon-inclusive layers sandwiching a... | 1. A mirror, comprising:
a substrate; a multilayer thin film coating supported by the substrate, the multilayer thin film coating comprising, in order moving away from the substrate:
a first silicon-inclusive layer,
a metallic or substantially metallic layer comprising aluminum,
a 5-150 angstrom thick layer comprising ... | Certain example embodiments of this invention relate to sputtered aluminum second surface mirrors with permanent protective coatings optionally provided thereto, and/or methods of making the same. A mirror coating supported by a substrate may include, for example, first and second silicon-inclusive layers sandwiching a... | 2,800 |
12,043 | 12,043 | 15,457,736 | 2,822 | A semiconductor device has a plurality of semiconductor die. A first prefabricated insulating film is disposed over the semiconductor die. A conductive layer is formed over the first prefabricated insulating film. An interconnect structure is formed over the semiconductor die and first prefabricated insulating film. Th... | 1. A method of making a semiconductor device, comprising:
providing a first reinforced insulating film; disposing a conductive layer over the first reinforced insulating film; providing a semiconductor die; disposing the semiconductor die on a carrier; laminating the first reinforced insulating film over the semiconduc... | A semiconductor device has a plurality of semiconductor die. A first prefabricated insulating film is disposed over the semiconductor die. A conductive layer is formed over the first prefabricated insulating film. An interconnect structure is formed over the semiconductor die and first prefabricated insulating film. Th... | 2,800 |
12,044 | 12,044 | 15,120,198 | 2,844 | Various embodiments provide an apparatus and method to detect timing components of a timing system. A processor sends signals to timing components and compares the responses with each other and with stored characteristic responses to detect if a timing component is present, if its characteristics have changed, to ident... | 1. An apparatus configured to detect a timing component of a timing system, the apparatus comprising:
a connection mechanism configured to connect the timing component to the timing system, the connection mechanism comprising:
a communication component configured to send signals to and receive responses from the connec... | Various embodiments provide an apparatus and method to detect timing components of a timing system. A processor sends signals to timing components and compares the responses with each other and with stored characteristic responses to detect if a timing component is present, if its characteristics have changed, to ident... | 2,800 |
12,045 | 12,045 | 15,681,669 | 2,845 | An antenna apparatus having a substrate, an antenna on the substrate, and a power supply circuit element on the substrate and connected to the antenna. The antenna includes coil-shaped first and second coil antenna units respectively having coil axes that intersect with the substrate. The first coil antenna unit and th... | 1. An antenna apparatus comprising:
a substrate; a power supply circuit element disposed on the substrate; and an antenna disposed on the substrate and connected to the power supply circuit element, the antenna including a first coil antenna unit and a second coil antenna unit, each antenna unit having a coil axis that... | An antenna apparatus having a substrate, an antenna on the substrate, and a power supply circuit element on the substrate and connected to the antenna. The antenna includes coil-shaped first and second coil antenna units respectively having coil axes that intersect with the substrate. The first coil antenna unit and th... | 2,800 |
12,046 | 12,046 | 15,323,836 | 2,894 | Methods and systems for enhancing workflow performance in the oil and gas industry may estimate the properties of drilling muds (e.g., density and/or viscosity) located downhole with methods that utilize real-time data, estimated drilling mud properties, and mathematical models. Further, the methods described herein ma... | 1. A method comprising:
circulating a drilling mud through a mud circulation system; performing a plurality of measurements from various sensors in a mud circulation system; modeling in real-time drilling mud flow dynamics in the drilling mud using a mathematical dynamics model; predicting physical states of the drilli... | Methods and systems for enhancing workflow performance in the oil and gas industry may estimate the properties of drilling muds (e.g., density and/or viscosity) located downhole with methods that utilize real-time data, estimated drilling mud properties, and mathematical models. Further, the methods described herein ma... | 2,800 |
12,047 | 12,047 | 16,047,987 | 2,881 | Systems and methods are provided for compensating dispersion of a beam separator in a single-beam or multi-beam apparatus. Embodiments of the present disclosure provide a dispersion device comprising an electrostatic deflector and a magnetic deflector configured to induce a beam dispersion set to cancel the dispersion ... | 1. A charged particle beam apparatus comprising:
a source configured to provide a primary charged particle beam; a source conversion unit configured to form a plurality of parallel images of the source using a plurality of beamlets of the primary charged particle beam; a first projection system with an objective lens a... | Systems and methods are provided for compensating dispersion of a beam separator in a single-beam or multi-beam apparatus. Embodiments of the present disclosure provide a dispersion device comprising an electrostatic deflector and a magnetic deflector configured to induce a beam dispersion set to cancel the dispersion ... | 2,800 |
12,048 | 12,048 | 16,044,363 | 2,891 | An integrated circuit interconnects are described herein that are suitable for forming integrated circuit chip packages. In one example, an integrated circuit interconnect is embodied in a wafer that includes a substrate having a plurality of integrated circuit (IC) dice formed thereon. The plurality of IC dice include... | 1. A wafer comprising:
a substrate having a plurality of integrated circuit (IC) dice formed thereon, the plurality of IC dice including a first IC die having first solid state circuitry and a second IC die having second solid state circuitry; a first contact pad disposed on the substrate and coupled to the first solid... | An integrated circuit interconnects are described herein that are suitable for forming integrated circuit chip packages. In one example, an integrated circuit interconnect is embodied in a wafer that includes a substrate having a plurality of integrated circuit (IC) dice formed thereon. The plurality of IC dice include... | 2,800 |
12,049 | 12,049 | 15,440,967 | 2,816 | Implementations of semiconductor packages may include a metallic baseplate, a first insulative layer coupled to the metallic baseplate, a first plurality of metallic traces, each metallic trace of the first plurality of metallic traces coupled to the electrically insulative, one or more semiconductor devices coupled to... | 1. A semiconductor package, comprising:
a metallic baseplate comprising a first surface and a second surface opposing the first surface; a first insulative layer comprising a first surface coupled to the second surface of the metallic baseplate, the electrically insulative layer having a second surface opposing the fir... | Implementations of semiconductor packages may include a metallic baseplate, a first insulative layer coupled to the metallic baseplate, a first plurality of metallic traces, each metallic trace of the first plurality of metallic traces coupled to the electrically insulative, one or more semiconductor devices coupled to... | 2,800 |
12,050 | 12,050 | 16,233,358 | 2,813 | An embodiment is to include an inverted staggered (bottom gate structure) thin film transistor in which an oxide semiconductor film containing In, Ga, and Zn is used as a semiconductor layer and a buffer layer is provided between the semiconductor layer and a source and drain electrode layers. The buffer layer having h... | 1. (canceled) 2. A semiconductor device comprising:
a gate electrode layer; a gate insulating layer over the gate electrode layer; a semiconductor layer over the gate insulating layer; a first layer over the semiconductor layer; a second layer over the semiconductor layer; a source electrode layer electrically connecte... | An embodiment is to include an inverted staggered (bottom gate structure) thin film transistor in which an oxide semiconductor film containing In, Ga, and Zn is used as a semiconductor layer and a buffer layer is provided between the semiconductor layer and a source and drain electrode layers. The buffer layer having h... | 2,800 |
12,051 | 12,051 | 15,555,323 | 2,832 | An engine includes at least one piston, a rotatable crankshaft, a starter motor, a lithium-ion battery, and a charging system. The rotatable crankshaft is coupled to the at least one piston. The starter motor is configured to selectively initiate rotation of the crankshaft. The lithium-ion battery is in electrical comm... | 1. An engine comprising:
at least one piston; a rotatable crankshaft coupled to the at least one piston; a starter motor configured to selectively initiate rotation of the crankshaft; a lithium-ion battery in electrical communication with the starter motor, the lithium-ion battery having at least one cell; a charging s... | An engine includes at least one piston, a rotatable crankshaft, a starter motor, a lithium-ion battery, and a charging system. The rotatable crankshaft is coupled to the at least one piston. The starter motor is configured to selectively initiate rotation of the crankshaft. The lithium-ion battery is in electrical comm... | 2,800 |
12,052 | 12,052 | 15,240,421 | 2,857 | A method of monitoring the integrity of a fluid connection between first and second fluid containing systems based on at least one time-dependent measurement signal from a pressure sensor in the first fluid containing system. The pressure sensor detects first pulses originating from a first pulse generator in the first... | 1. A method for monitoring the integrity of a fluid connection between first and second fluid containing systems based on at least one time-dependent measurement signal from at least one pressure sensor in the first fluid containing system, wherein the first fluid containing system includes an extracorporeal blood flow... | A method of monitoring the integrity of a fluid connection between first and second fluid containing systems based on at least one time-dependent measurement signal from a pressure sensor in the first fluid containing system. The pressure sensor detects first pulses originating from a first pulse generator in the first... | 2,800 |
12,053 | 12,053 | 16,084,115 | 2,844 | A motor vehicle having at least one headlight for illuminating the surroundings of the motor vehicle and a control device for controlling the headlight, wherein the headlight comprises a plurality of lighting segments that are arranged in the manner of a matrix and that can be actuated separately by the control device ... | 1-9. (canceled) 10. A motor vehicle having at least one headlight for illuminating the surroundings of the motor vehicle and a control device for controlling the at least one headlight, wherein the at least one headlight comprises a plurality of lighting segments that are arranged in a manner of a matrix, and can be ac... | A motor vehicle having at least one headlight for illuminating the surroundings of the motor vehicle and a control device for controlling the headlight, wherein the headlight comprises a plurality of lighting segments that are arranged in the manner of a matrix and that can be actuated separately by the control device ... | 2,800 |
12,054 | 12,054 | 14,292,246 | 2,872 | According to embodiments of the present application, a carbon dioxide sensing color changeable dye can comprise a carbon dioxide status indicator, a solvent, a polymer wherein the carbon dioxide status indicator is dispersed, an optional plasticizer, and an optional agent to facilitate mixing. The color changeable dye ... | 1. A color changeable dye comprising:
a carbon dioxide status indicator, a solvent, and a polymer wherein the carbon dioxide status indicator is dispersed 2. The color changeable dye of claim 1 wherein said color changeable dye is a first color in the presence of a higher than atmospheric carbon dioxide environment, ca... | According to embodiments of the present application, a carbon dioxide sensing color changeable dye can comprise a carbon dioxide status indicator, a solvent, a polymer wherein the carbon dioxide status indicator is dispersed, an optional plasticizer, and an optional agent to facilitate mixing. The color changeable dye ... | 2,800 |
12,055 | 12,055 | 14,898,326 | 2,859 | A charging system including an accumulator, a use of an MPP tracking method for charging an accumulator, and a method for charging an accumulator with the aid of a charging system, the charging system including a voltage source, a converter, and a rectifier, the current supplied and/or driven by the voltage source bein... | 1-9. (canceled) 10. A charging system, comprising:
an accumulator; a voltage source; a converter including an inverter; and a rectifier, wherein:
a current at least one of supplied and driven by the voltage source is supplied to a DC-voltage-side terminal of the inverter,
the inverter includes semiconductor switches th... | A charging system including an accumulator, a use of an MPP tracking method for charging an accumulator, and a method for charging an accumulator with the aid of a charging system, the charging system including a voltage source, a converter, and a rectifier, the current supplied and/or driven by the voltage source bein... | 2,800 |
12,056 | 12,056 | 15,372,554 | 2,822 | An oxide semiconductor film contains In, M (M is Al, Ga, Y, or Sn), and Zn and includes a region with a film density higher than or equal to 6.3 g/cm 3 and lower than 6.5 g/cm 3 . Alternatively, the oxide semiconductor film contains In, M (M is Al, Ga, Y, or Sn), and Zn and includes a region with etching at an etching... | 1. An oxide semiconductor film comprising In, M (M is any one of Al, Ga, Y, and Sn), and Zn,
wherein the oxide semiconductor film includes a region with a film density higher than or equal to 6.3 g/cm3 and lower than 6.5 g/cm3. 2. The oxide semiconductor film according to claim 1,
wherein the oxide semiconductor film i... | An oxide semiconductor film contains In, M (M is Al, Ga, Y, or Sn), and Zn and includes a region with a film density higher than or equal to 6.3 g/cm 3 and lower than 6.5 g/cm 3 . Alternatively, the oxide semiconductor film contains In, M (M is Al, Ga, Y, or Sn), and Zn and includes a region with etching at an etching... | 2,800 |
12,057 | 12,057 | 15,850,031 | 2,813 | Implementations of semiconductor packages may include: a substrate including a first side and a second side and an image signal processor (ISP) including a first side and a second side where first side of the ISP is coupled to the first side of the substrate. A first mold compound may encapsulate the second side of the... | 1. An image sensor package comprising:
a substrate comprising a first side and a second side; an image signal processor (ISP) comprising a first side and a second side, wherein the first side of the ISP is coupled to the first side of the substrate; a first mold compound encapsulating the second side of the ISP; an ima... | Implementations of semiconductor packages may include: a substrate including a first side and a second side and an image signal processor (ISP) including a first side and a second side where first side of the ISP is coupled to the first side of the substrate. A first mold compound may encapsulate the second side of the... | 2,800 |
12,058 | 12,058 | 16,204,097 | 2,813 | Implementations of semiconductor packages may include: a substrate coupled to one or more die and to one or more connectors, a glass lid coupled over one or more die by an adhesive and a housing comprising one or more sides and a bottom opening and a top opening. The substrate may be coupled to the housing at the botto... | 1. A method of making a semiconductor package, the method comprising:
providing a substrate; coupling one or more die to the substrate; electrically coupling the one or more die to the substrate using one or more connectors; encapsulating one of the one or more connectors and at least a portion of one of the one or mor... | Implementations of semiconductor packages may include: a substrate coupled to one or more die and to one or more connectors, a glass lid coupled over one or more die by an adhesive and a housing comprising one or more sides and a bottom opening and a top opening. The substrate may be coupled to the housing at the botto... | 2,800 |
12,059 | 12,059 | 15,507,431 | 2,847 | A reinforcing member for a flexible printed wiring board allows a ground wiring pattern of the flexible printed wiring board to conduct with an external ground potential. The reinforcing member includes a metal base and a nickel layer formed on a surface of the metal base. The nickel layer includes phosphorus in a rang... | 1. A reinforcing member for a flexible printed wiring board, which allows a ground wiring pattern of the flexible printed wiring board to conduct with an external ground potential, the reinforcing member comprising:
a metal base; and a nickel layer formed on a surface of the metal base, the nickel layer including phosp... | A reinforcing member for a flexible printed wiring board allows a ground wiring pattern of the flexible printed wiring board to conduct with an external ground potential. The reinforcing member includes a metal base and a nickel layer formed on a surface of the metal base. The nickel layer includes phosphorus in a rang... | 2,800 |
12,060 | 12,060 | 16,262,675 | 2,875 | The invention describes a lighting assembly for use in a lighting arrangement of a vehicle. The lighting assembly includes a projection lens and a light source array, wherein a center of the light source array and an optical axis of the projection lens have a lateral offset, and light sources of the light source array ... | 1. A lighting assembly for use in a lighting arrangement of a vehicle, comprising a projection lens and a light source array, wherein:
a center of the light source array and an optical axis of the projection lens have a lateral offset; and light sources of the light source array are individually controllable to adjust ... | The invention describes a lighting assembly for use in a lighting arrangement of a vehicle. The lighting assembly includes a projection lens and a light source array, wherein a center of the light source array and an optical axis of the projection lens have a lateral offset, and light sources of the light source array ... | 2,800 |
12,061 | 12,061 | 15,543,859 | 2,832 | The invention relates to a power management system for one or more wind turbines where the one or more wind turbines are connected to a power supply with a limited capacity for providing power to a number of power consuming units, such as to an emergency power supply arranged for providing power in a grid loss situatio... | 1. A power management system for one or more wind turbines, the one or more wind turbines being connected to a power supply with a limited capacity, and the one or more wind turbines each comprising a number of power consuming units; wherein the power management system comprises:
a dispatcher connected to the power sup... | The invention relates to a power management system for one or more wind turbines where the one or more wind turbines are connected to a power supply with a limited capacity for providing power to a number of power consuming units, such as to an emergency power supply arranged for providing power in a grid loss situatio... | 2,800 |
12,062 | 12,062 | 15,903,184 | 2,883 | An optical communication cable includes a cable jacket formed from a first material, a plurality of core elements located within the cable jacket, and an armor layer surrounding the plurality of core elements within the cable jacket, wherein the armor layer is a multi-piece layer having a first armor segment extending ... | 1. An optical communication cable comprising:
a cable jacket formed from a first material; a plurality of core elements located within the cable jacket; and an armor layer surrounding the plurality of core elements within the cable jacket, wherein the armor layer is a multi-piece layer comprising:
a first armor segment... | An optical communication cable includes a cable jacket formed from a first material, a plurality of core elements located within the cable jacket, and an armor layer surrounding the plurality of core elements within the cable jacket, wherein the armor layer is a multi-piece layer having a first armor segment extending ... | 2,800 |
12,063 | 12,063 | 15,364,715 | 2,899 | A semiconductor device has a plurality of interconnected modular units to form a 3D semiconductor package. Each modular unit is implemented as a vertical component or a horizontal component. The modular units are interconnected through a vertical conduction path and lateral conduction path within the vertical component... | 1. A method of making a semiconductor device, comprising:
providing one or more vertical components; providing one or more horizontal components; and interconnecting the vertical components and horizontal components to form a 3D semiconductor package. 2. The method of claim 1, wherein the vertical components include an... | A semiconductor device has a plurality of interconnected modular units to form a 3D semiconductor package. Each modular unit is implemented as a vertical component or a horizontal component. The modular units are interconnected through a vertical conduction path and lateral conduction path within the vertical component... | 2,800 |
12,064 | 12,064 | 15,684,620 | 2,814 | A leadframe wherein the outer sidewalls of the leadframe that are exposed by sawing during singulation are comprised of greater than 50% solder. A leadframe strip wherein the saw streets and the outer surface of the lead frames are comprised of greater than 50% solder. A method of forming a leadframe strip wherein the ... | 1. An integrated circuit (IC) package comprising:
a lead frame including a chip pad and a plurality of wire bond pads; an IC chip on the chip pad and electrically connected via wire bond to a horizontal surface of at least one of the plurality of wire bond pads; and a vertical surface of the at least one of the plurali... | A leadframe wherein the outer sidewalls of the leadframe that are exposed by sawing during singulation are comprised of greater than 50% solder. A leadframe strip wherein the saw streets and the outer surface of the lead frames are comprised of greater than 50% solder. A method of forming a leadframe strip wherein the ... | 2,800 |
12,065 | 12,065 | 15,230,100 | 2,837 | A wearable pressure sensor coupled to a controller and transmitter/receiver that when activated sends a control signal. | 1. A wearable controller, comprising:
a power supply; a transmitter coupled to the power supply; a sensor; and a processor coupled to the power supply and the transmitter associated with a housing where the housing is adapted to be worn on a finger and a signal be generated in response to the senor. 2. The wearable con... | A wearable pressure sensor coupled to a controller and transmitter/receiver that when activated sends a control signal.1. A wearable controller, comprising:
a power supply; a transmitter coupled to the power supply; a sensor; and a processor coupled to the power supply and the transmitter associated with a housing wher... | 2,800 |
12,066 | 12,066 | 15,250,254 | 2,847 | A cable core for a cable, in particular for an induction cable, contains multiple such cable cores which have a conductor that is interrupted in the longitudinal direction at specified longitudinal positions at multiple separation points, thereby forming two conductor ends. An insulating intermediate piece is provided ... | 1. A cable core configuration for a cable, the cable core comprising:
a plurality of cable cores each having a conductor being interrupted at a plurality of separation points at predetermined longitudinal positions in a longitudinal direction, forming two conductor ends; an insulating intermediate piece connecting said... | A cable core for a cable, in particular for an induction cable, contains multiple such cable cores which have a conductor that is interrupted in the longitudinal direction at specified longitudinal positions at multiple separation points, thereby forming two conductor ends. An insulating intermediate piece is provided ... | 2,800 |
12,067 | 12,067 | 15,384,883 | 2,846 | The present invention relates to an inverter which is capable of adjusting an output frequency of a three-phase voltage output to a motor based on a result of comparison in magnitude between the minimum operating voltage of the motor and a DC link voltage applied to a DC link. The inverter includes: a measurement part ... | 1. An inverter for converting power and supplying the power to a motor, comprising:
a measurement part configured to measure a DC link voltage applied to a DC link; a conversion part configured to convert the DC link voltage into a three-phase voltage and output the three-phase voltage to the motor; and a control part ... | The present invention relates to an inverter which is capable of adjusting an output frequency of a three-phase voltage output to a motor based on a result of comparison in magnitude between the minimum operating voltage of the motor and a DC link voltage applied to a DC link. The inverter includes: a measurement part ... | 2,800 |
12,068 | 12,068 | 15,960,917 | 2,837 | A method of manufacturing a ceramic electronic component such that Voids of the ceramic element and voids at the interfaces between the ceramic element and the external electrodes are filled with a resin composition by applying, to the ceramic electronic component, a resin-containing solution that has the function of e... | 1. A method for manufacturing a ceramic electronic component, the method comprising:
providing, to a surface of a ceramic element, a resin-containing solution that etches the surface of the ceramic element so as to ionize constituent elements of the ceramic element to form a resin composition comprising a resin and a c... | A method of manufacturing a ceramic electronic component such that Voids of the ceramic element and voids at the interfaces between the ceramic element and the external electrodes are filled with a resin composition by applying, to the ceramic electronic component, a resin-containing solution that has the function of e... | 2,800 |
12,069 | 12,069 | 15,796,121 | 2,898 | An embodiment of the invention may include a method, and resulting structure, of forming a semiconductor structure. The method may include forming a component hole from a first surface to a second surface of a base layer. The method may include placing an electrical component in the component hole. The electrical compo... | 1. A semiconductor structure comprising:
a base layer with a first surface and a second surface; a capacitor located in the base layer, wherein the capacitor is substantially parallel to the first surface, and wherein the capacitor comprises an electrical connection on each end of the capacitor; a laminate layer locate... | An embodiment of the invention may include a method, and resulting structure, of forming a semiconductor structure. The method may include forming a component hole from a first surface to a second surface of a base layer. The method may include placing an electrical component in the component hole. The electrical compo... | 2,800 |
12,070 | 12,070 | 16,035,088 | 2,841 | As described herein, an electrical enclosure is sealed against environmental contamination. An enclosure cabinet has an interior space. The interior space is accessible through an opening. A door or cover selectively closes the opening. The enclosure cabinet is manufactured of numerous parts and has holes, joints, gaps... | 1. An electrical enclosure sealed against environmental contamination comprising:
an enclosure cabinet having an interior space, the interior space being accessible through an opening, and a door or cover selectively closing the opening, the cabinet being manufactured of numerous parts and having holes, joints, gaps, s... | As described herein, an electrical enclosure is sealed against environmental contamination. An enclosure cabinet has an interior space. The interior space is accessible through an opening. A door or cover selectively closes the opening. The enclosure cabinet is manufactured of numerous parts and has holes, joints, gaps... | 2,800 |
12,071 | 12,071 | 15,411,160 | 2,836 | An on-board electrical system for a vehicle includes a first rechargeable constant voltage source ( 12 ), a second rechargeable constant voltage source ( 14 ), and a circuit breaker device ( 16 ) therebetween, including a first circuit breaker ( 18 ) and a second circuit breaker ( 20 ). Each circuit breaker ( 18, 20 ) ... | 1. An on-board electrical system for a vehicle, the electrical system comprising:
a first rechargeable constant voltage source; a second rechargeable constant voltage source; a circuit breaker device between the first constant voltage source and the second constant voltage source, the circuit breaker device comprising ... | An on-board electrical system for a vehicle includes a first rechargeable constant voltage source ( 12 ), a second rechargeable constant voltage source ( 14 ), and a circuit breaker device ( 16 ) therebetween, including a first circuit breaker ( 18 ) and a second circuit breaker ( 20 ). Each circuit breaker ( 18, 20 ) ... | 2,800 |
12,072 | 12,072 | 16,154,416 | 2,894 | A solar cell is fabricated by etching one or more of its layers without substantially etching another layer of the solar cell. In one embodiment, a copper layer in the solar cell is etched without substantially etching a topmost metallic layer comprising tin. For example, an etchant comprising sulfuric acid and hydroge... | 1. A backside-contact solar cell comprising:
a substrate; a dielectric layer over the substrate; a first copper layer over the dielectric layer, the first copper layer being electrically coupled to a first doped region of the back-side contact solar cell; a first tin layer on the first copper layer; a second copper lay... | A solar cell is fabricated by etching one or more of its layers without substantially etching another layer of the solar cell. In one embodiment, a copper layer in the solar cell is etched without substantially etching a topmost metallic layer comprising tin. For example, an etchant comprising sulfuric acid and hydroge... | 2,800 |
12,073 | 12,073 | 15,362,741 | 2,865 | A system, method and computer program product are provided for selecting signals to be measured utilizing a metrology tool that optimizes the precision of the measurement. The technique includes the steps of simulating a set of signals for measuring one or more parameters of a metrology target. A normalized Jacobian ma... | 1. A method, comprising:
simulating, via a processor executing a simulator module, a set of signals for measuring one or more parameters of a metrology target, each signal in the set of signals having one or more configurations for measuring the one or more parameters of the metrology target; generating a normalized Ja... | A system, method and computer program product are provided for selecting signals to be measured utilizing a metrology tool that optimizes the precision of the measurement. The technique includes the steps of simulating a set of signals for measuring one or more parameters of a metrology target. A normalized Jacobian ma... | 2,800 |
12,074 | 12,074 | 16,130,362 | 2,819 | A semiconductor device includes a semiconductor substrate and a metal structure in electrical contact with the semiconductor substrate. The metal structure has copper as a main component. An encapsulation layer includes a matrix material and a releasable copper corrosion inhibitor dispersed in the matrix material. The ... | 1. A semiconductor device, comprising:
a semiconductor substrate; a metal structure comprising a surface, the metal structure being in electrical contact with the semiconductor substrate, the metal structure comprising copper as a main component; an encapsulation layer comprising a matrix material and a releasable copp... | A semiconductor device includes a semiconductor substrate and a metal structure in electrical contact with the semiconductor substrate. The metal structure has copper as a main component. An encapsulation layer includes a matrix material and a releasable copper corrosion inhibitor dispersed in the matrix material. The ... | 2,800 |
12,075 | 12,075 | 14,956,323 | 2,841 | A display device includes a flexible display and a support frame. The flexible display includes a first portion, a second portion, and a third portion there between. The support frame includes a first display support supporting the first portion, a second display support supporting the second portion, and a third displ... | 1. A display device comprising:
a flexible display comprising a first portion, a second portion, and a third portion between the first portion and the second portion; and a support frame comprising a first display support supporting the first portion of the flexible display, a second display support supporting the seco... | A display device includes a flexible display and a support frame. The flexible display includes a first portion, a second portion, and a third portion there between. The support frame includes a first display support supporting the first portion, a second display support supporting the second portion, and a third displ... | 2,800 |
12,076 | 12,076 | 15,603,126 | 2,886 | Apparatus and associated methods relate to determining the wavelength of a narrow-band light beam. The narrow-band light beam is passed through an optical filter. The optical filter has complementary and monotonically-varying transmission and reflection coefficients within a predetermined band of wavelengths. The prede... | 1. A system for determining a wavelength of a narrow-band light beam, the system consisting of:
an optical filter having complementary transmission and reflection coefficients within a predetermined band of wavelengths inclusive of the wavelength of the narrow-band light beam, each of the transmission and reflection co... | Apparatus and associated methods relate to determining the wavelength of a narrow-band light beam. The narrow-band light beam is passed through an optical filter. The optical filter has complementary and monotonically-varying transmission and reflection coefficients within a predetermined band of wavelengths. The prede... | 2,800 |
12,077 | 12,077 | 15,916,773 | 2,853 | A behavior estimation method includes a first step of calculating number of earthquake resistant joints required for absorbing a fault displacement amount in a pipe orthogonal direction, based on an allowable deflection angle and a pipe effective length, and calculating a deflection range in a pipe axis direction, a se... | 1. A behavior estimation method for a fault-crossing underground pipeline, the method comprising:
a first step of calculating a minimum number of earthquake resistant joints N, on one side of a fault surface, required for absorbing a fault displacement amount H in a pipe orthogonal direction, in fault displacement amou... | A behavior estimation method includes a first step of calculating number of earthquake resistant joints required for absorbing a fault displacement amount in a pipe orthogonal direction, based on an allowable deflection angle and a pipe effective length, and calculating a deflection range in a pipe axis direction, a se... | 2,800 |
12,078 | 12,078 | 13,166,073 | 2,814 | It is an object to provide a semiconductor device including an oxide semiconductor, which has stable electric characteristics and high reliability. A semiconductor device having a stacked-layer structure of a gate insulating layer; a first gate electrode in contact with one surface of the gate insulating layer; an oxid... | 1. A semiconductor device comprising:
a gate insulating layer; a first gate electrode in contact with one surface of the gate insulating layer; an oxide semiconductor layer in contact with the other surface of the gate insulating layer and overlapping with the first gate electrode; and a source electrode, a drain elect... | It is an object to provide a semiconductor device including an oxide semiconductor, which has stable electric characteristics and high reliability. A semiconductor device having a stacked-layer structure of a gate insulating layer; a first gate electrode in contact with one surface of the gate insulating layer; an oxid... | 2,800 |
12,079 | 12,079 | 15,247,259 | 2,811 | A semiconductor chip with conductive vias and a method of manufacturing the same are disclosed. The method includes forming a first plurality of conductive vias in a layer of a first semiconductor chip. The first plurality of conductive vias includes first ends and second ends. A first conductor pad is formed in ohmic ... | 1. An apparatus, comprising:
a first semiconductor chip including a layer; a first conductor pad coupled to the first semiconductor chip; a first plurality of conductive vias traversing the layer and having first ends and second ends; and a conductive via extension on each of the first ends of the first conductive vias... | A semiconductor chip with conductive vias and a method of manufacturing the same are disclosed. The method includes forming a first plurality of conductive vias in a layer of a first semiconductor chip. The first plurality of conductive vias includes first ends and second ends. A first conductor pad is formed in ohmic ... | 2,800 |
12,080 | 12,080 | 16,069,946 | 2,829 | Provided is a thermal conducting sheet, including: a binder resin; insulating-coated carbon fibers; and a thermal conducting filler other than the insulating-coated carbon fibers, wherein the insulating-coated carbon fibers include carbon fibers and a coating film over at least a part of a surface of the carbon fibers,... | 1. A thermal conducting sheet, comprising:
a binder resin; insulating-coated carbon: fibers; and a thermal conducting filler other than the insulating-coated carbon fibers, wherein the insulating-coated carbon fibers comprise carbon fibers and a coating film over at least a part of a surface of the carbon fibers, the c... | Provided is a thermal conducting sheet, including: a binder resin; insulating-coated carbon fibers; and a thermal conducting filler other than the insulating-coated carbon fibers, wherein the insulating-coated carbon fibers include carbon fibers and a coating film over at least a part of a surface of the carbon fibers,... | 2,800 |
12,081 | 12,081 | 14,218,131 | 2,872 | Presented is a method, apparatus and computer-readable medium for reducing error. The apparatus includes a rotatable element having a plurality of spaced light modifying ports located at set positions in the rotatable element, the rotatable element rotatable about an axis. The apparatus further includes a drive engaged... | 1. An apparatus comprising:
(a) a rotatable element having a plurality of spaced light modifying ports located at set positions in the rotatable element, the rotatable element rotatable about an axis; and (b) a drive engagedly coupled to the rotatable element to rotate the rotatable element, wherein one periodic cycle ... | Presented is a method, apparatus and computer-readable medium for reducing error. The apparatus includes a rotatable element having a plurality of spaced light modifying ports located at set positions in the rotatable element, the rotatable element rotatable about an axis. The apparatus further includes a drive engaged... | 2,800 |
12,082 | 12,082 | 15,643,427 | 2,852 | A monitoring system for a power grid includes one or more power transformer monitors. Each power transformer monitor includes a plurality of optical sensors disposed on one or more optical fibers that sense parameters of the power transformer. Each optical sensor is configured to sense a power transformer parameter tha... | 1. A monitoring system comprising:
one or more power transformer monitors of a power grid system, each power transformer monitor comprising a plurality of optical sensors disposed on one or more optical fibers, the optical sensors configured to sense internal parameters of a power transformer, each optical sensor dispo... | A monitoring system for a power grid includes one or more power transformer monitors. Each power transformer monitor includes a plurality of optical sensors disposed on one or more optical fibers that sense parameters of the power transformer. Each optical sensor is configured to sense a power transformer parameter tha... | 2,800 |
12,083 | 12,083 | 16,254,846 | 2,813 | Electronic chip comprising:
an electronic circuit; a resistive element arranged on a rear face of a substrate; two conductive vias passing through the substrate, each connected to the electronic circuit and to one of the ends of the resistive element, and masked by the resistive element; and comprising a... | 1. An electronic chip comprising at least:
an electronic circuit arranged on the side of a front face of a substrate; a resistive element arranged on the side of a rear face of the substrate and directly in line with at least one part of the electronic circuit; two electrically conductive vias passing through the subst... | Electronic chip comprising:
an electronic circuit; a resistive element arranged on a rear face of a substrate; two conductive vias passing through the substrate, each connected to the electronic circuit and to one of the ends of the resistive element, and masked by the resistive element; and comprising a... | 2,800 |
12,084 | 12,084 | 15,191,734 | 2,819 | It is an object of the present invention to improve light source efficiency of “a light-emitting device capable of realizing a natural, vivid, highly visible and comfortable appearance of colors or an appearance of objects” already arrived at by adopting a spectral power distribution having a shape completely different... | 1. A light-emitting device at least including, as light-emitting elements:
a blue semiconductor light-emitting element; a green phosphor; and a red phosphor, wherein light emitted from the light-emitting device in a main radiant direction satisfies all of Conditions 1 to 4 below Condition 1: when λ denotes wavelength, ... | It is an object of the present invention to improve light source efficiency of “a light-emitting device capable of realizing a natural, vivid, highly visible and comfortable appearance of colors or an appearance of objects” already arrived at by adopting a spectral power distribution having a shape completely different... | 2,800 |
12,085 | 12,085 | 15,637,884 | 2,886 | A method and a system for acquiring a hyperspectral image by using a kaleidoscope are provided. The method includes copying an input image to generate a specific number of images, generating coded-aperture passed images corresponding to the images by using at least one coded aperture, and acquiring a hyperspectral imag... | 1. A camera device comprising:
mirrors configured to generate a specific number of images corresponding to an input image; at least one coded aperture configured to generate coded-aperture passed images corresponding to the images, respectively; and a controller configured to acquire a hyperspectral image for the input... | A method and a system for acquiring a hyperspectral image by using a kaleidoscope are provided. The method includes copying an input image to generate a specific number of images, generating coded-aperture passed images corresponding to the images by using at least one coded aperture, and acquiring a hyperspectral imag... | 2,800 |
12,086 | 12,086 | 16,239,008 | 2,815 | It is an object to provide a semiconductor device which has a large size and operates at high speed. A top gate transistor which includes a semiconductor layer of single-crystal and a bottom gate transistor which includes a semiconductor layer of amorphous silicon (microcrystalline silicon) are formed over the same sub... | 1. A semiconductor device comprising:
a first semiconductor layer over an insulating substrate; a first insulating layer over the first semiconductor layer; a first conductive layer and a second conductive layer over the first insulating layer; a second insulating layer over the first conductive layer and the second co... | It is an object to provide a semiconductor device which has a large size and operates at high speed. A top gate transistor which includes a semiconductor layer of single-crystal and a bottom gate transistor which includes a semiconductor layer of amorphous silicon (microcrystalline silicon) are formed over the same sub... | 2,800 |
12,087 | 12,087 | 14,258,552 | 2,862 | Systems and methods for attenuating residual acoustic energy in marine seismic data are disclosed. In one aspect, a number of gathers are recorded for consecutive activations of a marine source. Each recorded gather contains a record of acoustic reflections from a subterranean formation after activation of the source a... | 1. A method for attenuating residual acoustic energy in seismic data comprising:
consecutively recording a number seismic data gathers with seismic receivers, each recorded gather is a record of acoustic reflections from a subterranean formation after activation of a source towed by a survey vessel and residual acousti... | Systems and methods for attenuating residual acoustic energy in marine seismic data are disclosed. In one aspect, a number of gathers are recorded for consecutive activations of a marine source. Each recorded gather contains a record of acoustic reflections from a subterranean formation after activation of the source a... | 2,800 |
12,088 | 12,088 | 13,246,971 | 2,863 | A pressure transmitter for use in measuring a pressure of a process fluid in an industrial process. The pressure transmitter includes a pressure sensor having a pressure output related to the pressure of the process fluid. Measurement circuitry is configured to calculate a process variable of the process fluid based up... | 1. A pressure transmitter for use in measuring a pressure of a process fluid in an industrial process, comprising:
a pressure sensor having a pressure output related to the pressure of the process fluid; measurement circuitry configured to calculate a process variable of the process fluid based upon the pressure output... | A pressure transmitter for use in measuring a pressure of a process fluid in an industrial process. The pressure transmitter includes a pressure sensor having a pressure output related to the pressure of the process fluid. Measurement circuitry is configured to calculate a process variable of the process fluid based up... | 2,800 |
12,089 | 12,089 | 16,682,261 | 2,844 | A method for providing assistance in aiming of one or more illumination devices in an area may include, by a processor, receiving photometric data for an area, and using the photometric data to determine an aiming vector for the illumination device. The area may include the illumination device. the method may further i... | 1. A method for providing assistance in aiming of one or more illumination devices in an area comprising, by a processor:
receiving photometric data for an area that comprises an illumination device, wherein the photometric data comprises a measure of at least one light characteristic corresponding to light received fr... | A method for providing assistance in aiming of one or more illumination devices in an area may include, by a processor, receiving photometric data for an area, and using the photometric data to determine an aiming vector for the illumination device. The area may include the illumination device. the method may further i... | 2,800 |
12,090 | 12,090 | 15,215,673 | 2,834 | Brushed electric motor ( 10 ), comprising an outer case ( 11 ), two brushes and further a rotor ( 30 ) having a first inner end ( 31 ) and a second outer end ( 32 ) which is inserted within the outer case ( 11 ).
The brushed electric motor ( 10 ) is in particular usable in environments with a risk of fire or expl... | 1. Brushed electric motor (10) comprising an outer case (11), two brushes and also a rotor (30) having a first inner end (31) and a second outer end (32) which is inserted within said outer case (11), said brushed electric motor (10) is in particular usable in environments with risk of fire or explosion or in presence ... | Brushed electric motor ( 10 ), comprising an outer case ( 11 ), two brushes and further a rotor ( 30 ) having a first inner end ( 31 ) and a second outer end ( 32 ) which is inserted within the outer case ( 11 ).
The brushed electric motor ( 10 ) is in particular usable in environments with a risk of fire or expl... | 2,800 |
12,091 | 12,091 | 15,636,899 | 2,851 | A Battery Management System (BMS) for an electronic device with bidirectional communication between The BMS and an Operating System (OS) of the electronic device for generating a charging pattern of charging the battery of the electronic device according to information received from the operating system. | 1. A method of managing a battery of an electronic device, the method comprising:
obtaining first information of functional parameters of the battery; obtaining second information of at least one of an operational status of the electronic device and user activity; and generating a charging pattern to charge the battery... | A Battery Management System (BMS) for an electronic device with bidirectional communication between The BMS and an Operating System (OS) of the electronic device for generating a charging pattern of charging the battery of the electronic device according to information received from the operating system.1. A method of ... | 2,800 |
12,092 | 12,092 | 15,968,209 | 2,838 | A system and method of controlling a power converter that includes at least one first switch of a first switch type and at least one second switch of a second switch type, includes converting, by the power converter, an input power at a converter input into output power at a converter output for a load. Converting the ... | 1. A method of controlling a power converter that includes at least one first switch of a first switch type, wherein the first switch type is a low gate charge field effect transistor, and at least one second switch of a second switch type, where in the second switch type is a low on-resistance field effect transistor,... | A system and method of controlling a power converter that includes at least one first switch of a first switch type and at least one second switch of a second switch type, includes converting, by the power converter, an input power at a converter input into output power at a converter output for a load. Converting the ... | 2,800 |
12,093 | 12,093 | 15,443,690 | 2,831 | A coaxial connector in combination with a coaxial cable is provided with an inner conductor supported coaxial within an outer conductor, a polymer jacket surrounding the outer conductor. A unitary connector body with a bore is provided with an overbody surrounding an outer diameter of the connector body. The outer cond... | 1. A coaxial connector-cable assembly, comprising:
a coaxial cable including an inner conductor, an outer conductor surrounding the inner conductor, and a dielectric material separating the inner conductor from the outer conductor, each of the inner and outer conductors having an end portion; a coaxial connector includ... | A coaxial connector in combination with a coaxial cable is provided with an inner conductor supported coaxial within an outer conductor, a polymer jacket surrounding the outer conductor. A unitary connector body with a bore is provided with an overbody surrounding an outer diameter of the connector body. The outer cond... | 2,800 |
12,094 | 12,094 | 15,415,306 | 2,855 | A method for testing a ceramic component for a fracture toughness includes changing the temperature of the component to a first temperature, for example, by heating the component, and changing the temperature of the component to a second temperature, for example, by cooling the component and testing the component for c... | 1. A method for testing a ceramic component for a fracture toughness, comprising:
changing the temperature of the component to a first temperature; and changing the temperature of the component to a second temperature; wherein a temperature difference between the first temperature and the second temperature is determin... | A method for testing a ceramic component for a fracture toughness includes changing the temperature of the component to a first temperature, for example, by heating the component, and changing the temperature of the component to a second temperature, for example, by cooling the component and testing the component for c... | 2,800 |
12,095 | 12,095 | 13,970,340 | 2,859 | A non-contact power charging, in which power transmission can be interrupted when foreign materials are deposited on a charge plate of the non-contact power charging system. A charging operation can be continuously maintained at a stable voltage even if a non-contact power receiving apparatus moves by touching or displ... | 1. A non-contact power transmitting apparatus comprising:
a primary charge core which generates a magnetic field to wirelessly transmit a power signal to a power receiving apparatus; a received signal processing module which processes a signal transmitted from the power receiving apparatus and sends the processed signa... | A non-contact power charging, in which power transmission can be interrupted when foreign materials are deposited on a charge plate of the non-contact power charging system. A charging operation can be continuously maintained at a stable voltage even if a non-contact power receiving apparatus moves by touching or displ... | 2,800 |
12,096 | 12,096 | 16,299,305 | 2,835 | An apparatus includes an enclosure with a first data storage section, a second data storage section, a first cooling section positioned therebetween, and a second cooling section. The apparatus also includes an air-to-liquid heat exchanger positioned in the first cooling section and configured to cool air directed from... | 1. An apparatus comprising:
an enclosure with a first data storage section, a second data storage section, a first cooling section positioned therebetween, and a second cooling section, the second cooling section including fan modules positioned therein; and an air-to-liquid heat exchanger including a tube and a plural... | An apparatus includes an enclosure with a first data storage section, a second data storage section, a first cooling section positioned therebetween, and a second cooling section. The apparatus also includes an air-to-liquid heat exchanger positioned in the first cooling section and configured to cool air directed from... | 2,800 |
12,097 | 12,097 | 16,253,740 | 2,835 | Systems and methods are involved with but are not limited to an apparatus including a first frame shaped and sized to receive a tablet-shaped computing device; and a second frame shaped and sized to receive the first frame. In addition, other aspects are described in the claims, drawings, and text forming a part of the... | 1. A case comprising:
a first frame shaped and sized to receive a tablet-shaped computing device; and a second frame shaped and sized to receive the first frame. 2. The case of claim 1 wherein the second frame includes an inner periphery and the first frame includes an outer lip shaped and sized to abut with the inner ... | Systems and methods are involved with but are not limited to an apparatus including a first frame shaped and sized to receive a tablet-shaped computing device; and a second frame shaped and sized to receive the first frame. In addition, other aspects are described in the claims, drawings, and text forming a part of the... | 2,800 |
12,098 | 12,098 | 16,866,836 | 2,864 | Physical-device anomalies and degradation can be mitigated by implementing some aspects described herein. For example, a system can determine a first data window and a second data window by applying a window function to streaming data. The system can determine a first principal eigenvector of the first data window and ... | 1. A system comprising:
a processor; and a memory device comprising instructions that are executable by the processor for causing the processor to:
receive streaming data from a plurality of sensors, the streaming data being multidimensional data that includes a plurality of data points spanning a period of time;
deter... | Physical-device anomalies and degradation can be mitigated by implementing some aspects described herein. For example, a system can determine a first data window and a second data window by applying a window function to streaming data. The system can determine a first principal eigenvector of the first data window and ... | 2,800 |
12,099 | 12,099 | 15,013,558 | 2,861 | A system for monitoring water quality in a water meter data collection system having a plurality ol metering end points (E) for measuring consumption includes a plurality of chemical biological and environmental sensors (S 1, S 2 ) disposed in a distribution system near or within the distribution end points (A, B), wi... | 1. Apparatus for sensing water quality at a water metering system end point, the apparatus comprising:
a fluid flow metering element positioned in a flow stream supplying at least one water utility customer that converts metering signals or movements of a flow metering element to electrical signals representing units o... | A system for monitoring water quality in a water meter data collection system having a plurality ol metering end points (E) for measuring consumption includes a plurality of chemical biological and environmental sensors (S 1, S 2 ) disposed in a distribution system near or within the distribution end points (A, B), wi... | 2,800 |
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