Unnamed: 0 int64 0 350k | level_0 int64 0 351k | ApplicationNumber int64 9.75M 96.1M | ArtUnit int64 1.6k 3.99k | Abstract stringlengths 1 8.37k | Claims stringlengths 3 292k | abstract-claims stringlengths 68 293k | TechCenter int64 1.6k 3.9k |
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12,100 | 12,100 | 15,660,038 | 2,853 | A system and method to determine a remaining useful life estimation of a material under evaluation. The equipment comprises at least one computer and a material features acquisition system operable to detect a plurality of material features. The features are then evaluated according to rules captured from of experts an... | 1. A method to evaluate material wherein said material under evaluation comprises a tubular, said method comprising:
providing a material features acquisition system operable to detect a plurality of material features in a material under evaluation, said material features acquisition system comprising a sensor with an ... | A system and method to determine a remaining useful life estimation of a material under evaluation. The equipment comprises at least one computer and a material features acquisition system operable to detect a plurality of material features. The features are then evaluated according to rules captured from of experts an... | 2,800 |
12,101 | 12,101 | 15,032,609 | 2,875 | An LED light module for illuminating a target plane is provided. The LED light module includes a first LED source, a second LED source disposed adjacent the first LED source, a first lens covering the first LED source, and a second lens covering the second LED source. The first lens is configured to direct first light ... | 1. An LED light module for illuminating a target plane, comprising:
a first LED source; a second LED source disposed adjacent the first LED source; a first lens covering the first LED source, the first lens configured to direct first light beams emitted from the first light source to the target plane; and a second lens... | An LED light module for illuminating a target plane is provided. The LED light module includes a first LED source, a second LED source disposed adjacent the first LED source, a first lens covering the first LED source, and a second lens covering the second LED source. The first lens is configured to direct first light ... | 2,800 |
12,102 | 12,102 | 15,985,380 | 2,813 | A lead frame includes a first side having a first die attach pad that is bondable to a die, and a second side that has a second die attach pad that is bondable to another die. The lead frame includes multiple leads on the edges of the lead frame to connect the die. As part of a no-leads device, such as a quad flat no l... | 1. A semiconductor package comprising:
a lead frame comprising:
a first side and a second side, wherein the first side includes a first die attach pad and the second side opposite to the first side includes a second die attach pad;
a die attached to the first die attach pad via a die attach material and electrically co... | A lead frame includes a first side having a first die attach pad that is bondable to a die, and a second side that has a second die attach pad that is bondable to another die. The lead frame includes multiple leads on the edges of the lead frame to connect the die. As part of a no-leads device, such as a quad flat no l... | 2,800 |
12,103 | 12,103 | 15,656,937 | 2,881 | A system for treating a patient during radiation therapy includes range compensators. Each of the range compensators shapes a distribution of a dose delivered to the patient by a beam emitted from a nozzle of a radiation treatment system. A positioning component holds the range compensator in place relative to the pati... | 1. A system for treating a patient during radiation therapy, the system comprising:
a plurality of range compensators, wherein each range compensator of the plurality of range compensators respectively shapes a distribution of a dose delivered to the patient by a respective beam of a plurality of beams emitted from a n... | A system for treating a patient during radiation therapy includes range compensators. Each of the range compensators shapes a distribution of a dose delivered to the patient by a beam emitted from a nozzle of a radiation treatment system. A positioning component holds the range compensator in place relative to the pati... | 2,800 |
12,104 | 12,104 | 15,583,569 | 2,822 | An image sensor is provided. The image sensor includes a substrate having a first region and a second region adjacent to each other; and a first photoelectric conversion component disposed on the first region of the substrate, and the first photoelectric conversion component includes: a first metal layer formed on the ... | 1. An image sensor, comprising:
a substrate having a first region and a second region adjacent to each other; and a first photoelectric conversion component disposed on the first region of the substrate, wherein the first photoelectric conversion component comprises: a first metal layer formed on the substrate; a first... | An image sensor is provided. The image sensor includes a substrate having a first region and a second region adjacent to each other; and a first photoelectric conversion component disposed on the first region of the substrate, and the first photoelectric conversion component includes: a first metal layer formed on the ... | 2,800 |
12,105 | 12,105 | 13,508,495 | 2,865 | The present invention may include acquiring a plurality of overlay metrology measurement signals from a plurality of metrology targets distributed across one or more fields of a wafer of a lot of wafers, determining a plurality of overlay estimates for each of the plurality of overlay metrology measurement signals usin... | 1. A computer-implemented method for providing a quality metric suitable for improving process control in a semiconductor wafer fabrication, comprising process:
acquiring a plurality of overlay metrology measurement signals from a plurality of metrology targets distributed across one or more fields of a wafer of a lot ... | The present invention may include acquiring a plurality of overlay metrology measurement signals from a plurality of metrology targets distributed across one or more fields of a wafer of a lot of wafers, determining a plurality of overlay estimates for each of the plurality of overlay metrology measurement signals usin... | 2,800 |
12,106 | 12,106 | 16,313,419 | 2,847 | A cable sealing device for an electrical junction box includes a centering frame mountable at a hole in a wall of the junction box, a first clamping plate having a plurality of cable passage holes, the first clamping plate being disposed on a first side of the centering frame within the first seat, a second clamping pl... | 1. A cable sealing device for an electrical junction box, comprising:
a centering frame mountable at a hole in a wall of the junction box, the centering frame including a first rim and a flange defining a first seat, an edge of the flange defining a central opening; a first clamping plate having a plurality of cable pa... | A cable sealing device for an electrical junction box includes a centering frame mountable at a hole in a wall of the junction box, a first clamping plate having a plurality of cable passage holes, the first clamping plate being disposed on a first side of the centering frame within the first seat, a second clamping pl... | 2,800 |
12,107 | 12,107 | 15,771,183 | 2,844 | This illumination device (4) is configured so as to display, outside a vehicle (1) capable of traveling in an automatic driving mode, information related to the automatic driving of the vehicle (1), and is provided with an illumination unit (42) which is configured so as to shine light outside the vehicle (1) and aroun... | 1. A vehicle illumination device configured to display information relating to automatic driving of a vehicle toward an outside of the vehicle capable of travelling in an automatic driving mode, the vehicle illumination device comprising:
an illumination unit configured to irradiate light toward the outside of the vehi... | This illumination device (4) is configured so as to display, outside a vehicle (1) capable of traveling in an automatic driving mode, information related to the automatic driving of the vehicle (1), and is provided with an illumination unit (42) which is configured so as to shine light outside the vehicle (1) and aroun... | 2,800 |
12,108 | 12,108 | 15,094,316 | 2,836 | An embodiment electronic circuit includes an electronic switch comprising a load path, and a control circuit configured to drive the electronic switch. The control circuit is configured to operate in one of at least two operation modes. The at least two operation modes comprise a first operation mode and a second opera... | 1. An electronic circuit, comprising:
an electronic switch comprising a load path; and a control circuit configured to drive the electronic switch, wherein the control circuit is configured to operate in one of at least two operation modes, wherein the at least two operation modes comprise a first operation mode and a ... | An embodiment electronic circuit includes an electronic switch comprising a load path, and a control circuit configured to drive the electronic switch. The control circuit is configured to operate in one of at least two operation modes. The at least two operation modes comprise a first operation mode and a second opera... | 2,800 |
12,109 | 12,109 | 15,360,498 | 2,811 | Provided is a method for manufacturing a thin SiC wafer by which a SiC wafer is thinned using a method without generating crack or the like, the method in which polishing after adjusting the thickness of the SiC wafer can be omitted. The method for manufacturing the thin SiC wafer 40 includes a thinning step. In the ... | 1. A method for manufacturing a thin SiC wafer by processing a SiC wafer after cutting out of an ingot comprising:
a thinning step for thinning a thickness of the SiC wafer after cutting out of the ingot; wherein in the thinning step, performing a Si vapor pressure etching in which a surface of the SiC wafer is etched ... | Provided is a method for manufacturing a thin SiC wafer by which a SiC wafer is thinned using a method without generating crack or the like, the method in which polishing after adjusting the thickness of the SiC wafer can be omitted. The method for manufacturing the thin SiC wafer 40 includes a thinning step. In the ... | 2,800 |
12,110 | 12,110 | 16,601,424 | 2,875 | A vehicle lighting system includes a light processing unit, a non-uniform projection unit, a sensing unit, a judgment unit, and an operation unit. The light processing unit is capable of changing an intensity profile of a light beam, and the judgment unit receives an image signal from the sensing unit to determine whet... | 1. A vehicle lighting system, comprising:
a light processing unit capable of changing an intensity profile of a light beam; a non-uniform projection unit capable of converting the light beam processed by the light processing unit into a light beam having a non-uniform intensity profile; a sensing unit for detecting sur... | A vehicle lighting system includes a light processing unit, a non-uniform projection unit, a sensing unit, a judgment unit, and an operation unit. The light processing unit is capable of changing an intensity profile of a light beam, and the judgment unit receives an image signal from the sensing unit to determine whet... | 2,800 |
12,111 | 12,111 | 15,444,731 | 2,872 | An emergency vision apparatus comprises an inflatable enclosure to enable a user to see through the enclosure when expanded and observe a source of information at a distal end of the enclosure while smoke or other particulate matter is in the environment. The enclosure includes an opening configured for insertion of a ... | 1. An emergency vision apparatus, comprising:
a) an inflatable enclosure being made of airtight material and having an expanded form when deployed and a deflated form when not in use; b) first and second clear members disposed at respective first and second ends of said first enclosure to enable a user to see through s... | An emergency vision apparatus comprises an inflatable enclosure to enable a user to see through the enclosure when expanded and observe a source of information at a distal end of the enclosure while smoke or other particulate matter is in the environment. The enclosure includes an opening configured for insertion of a ... | 2,800 |
12,112 | 12,112 | 15,856,350 | 2,837 | A device comprises: a first spiral coil laid out on a first metal layer of a multi-layer structure, the first spiral coil spiraling inward from a first end to a second end in a clockwise direction from a first perspective that is perpendicular to the first metal layer; a second spiral coil laid out on the first metal l... | 1. A device comprising:
a first spiral coil laid out on a first metal layer of a multi-layer structure, the first spiral coil spiraling inward from a first end to a second end in a clockwise direction from a first perspective that is perpendicular to the first metal layer; a second spiral coil laid out on the first met... | A device comprises: a first spiral coil laid out on a first metal layer of a multi-layer structure, the first spiral coil spiraling inward from a first end to a second end in a clockwise direction from a first perspective that is perpendicular to the first metal layer; a second spiral coil laid out on the first metal l... | 2,800 |
12,113 | 12,113 | 16,169,843 | 2,822 | In a described example, an apparatus includes a substrate with a first surface and an opposing second surface. The substrate includes a trench extending into the substrate from the first surface, a die mounting area adjacent to the trench, a first plurality of leads, and a second plurality of leads. The second pluralit... | 1. An apparatus comprising:
a substrate comprising:
a first surface and an opposing second surface;
a trench extending into the substrate from the first surface;
a die mounting area adjacent to the trench;
a first plurality of leads;
a second plurality of leads, wherein the second plurality of leads are spaced from the... | In a described example, an apparatus includes a substrate with a first surface and an opposing second surface. The substrate includes a trench extending into the substrate from the first surface, a die mounting area adjacent to the trench, a first plurality of leads, and a second plurality of leads. The second pluralit... | 2,800 |
12,114 | 12,114 | 15,316,575 | 2,881 | A method of mass spectrometry is disclosed comprising mass analysing an eluent from a chromatography device and obtaining parent ion data sets and corresponding product ion data sets, and determining whether, in a first product ion data set, one or more product ions are present that are related to one or more parent io... | 1. A method of mass spectrometry comprising:
mass analysing an eluent from a chromatography device and obtaining a plurality of parent ion data sets and a plurality of corresponding product ion data sets; and determining whether, in a first product ion data set of said plurality of product ions data sets, one or more p... | A method of mass spectrometry is disclosed comprising mass analysing an eluent from a chromatography device and obtaining parent ion data sets and corresponding product ion data sets, and determining whether, in a first product ion data set, one or more product ions are present that are related to one or more parent io... | 2,800 |
12,115 | 12,115 | 15,932,286 | 2,813 | The disclosure relates to chips scale packages and methods of forming such packages or an array of such packages. The semiconductor chip scale package comprises: a semiconductor die, comprising: a first major surface opposing a second major surface; a plurality side walls extending between the first major surface and t... | 1. A semiconductor chip scale package comprising:
a semiconductor die, the semiconductor die comprising: a first major surface opposing a second major surface; a plurality side walls extending between the first major surface and the second major surface; a plurality of electrical contacts arranged on the second major s... | The disclosure relates to chips scale packages and methods of forming such packages or an array of such packages. The semiconductor chip scale package comprises: a semiconductor die, comprising: a first major surface opposing a second major surface; a plurality side walls extending between the first major surface and t... | 2,800 |
12,116 | 12,116 | 15,708,553 | 2,865 | Disclosed examples include methods and systems to measure fluid flow, including a transmit circuit to provide a transducer transmit signal based on a transmit pulse signal, a receive circuit to receive a transducer receive signal, an ADC to sample a receive signal from the receive circuit and provide a sampled signal, ... | 1. A system to measure fluid flow, comprising:
first and second transducers spaced from one another to transmit and receive ultrasonic signals in a pipe, the first transducer including a first electrical terminal, and the second transducer including a second electrical terminal, the first transducer having a transducer... | Disclosed examples include methods and systems to measure fluid flow, including a transmit circuit to provide a transducer transmit signal based on a transmit pulse signal, a receive circuit to receive a transducer receive signal, an ADC to sample a receive signal from the receive circuit and provide a sampled signal, ... | 2,800 |
12,117 | 12,117 | 15,210,333 | 2,864 | Methods of combining mineral composition and laboratory test results for reservoir rock samples to predict future responses to secondary and tertiary oil recovery treatments are disclosed. Particular, SEM and EDS will be combined to produce a mineral map, including mineral distribution around the rock's pore space, for... | 1) A method of predicting fluid-rock interactions for reservoir rock, comprising:
a) obtaining a reservoir rock sample; b) obtaining scanning electron microscopy (SEM) image data in back-scattered electron (BSE) mode and energy dispersive spectral (EDS) data of said reservoir rock sample; c) assigning chemical mineralo... | Methods of combining mineral composition and laboratory test results for reservoir rock samples to predict future responses to secondary and tertiary oil recovery treatments are disclosed. Particular, SEM and EDS will be combined to produce a mineral map, including mineral distribution around the rock's pore space, for... | 2,800 |
12,118 | 12,118 | 15,178,869 | 2,875 | An illumination assembly includes a polymeric substrate, an electrical circuit including two conductors supported by the polymeric substrate, an LED electrically coupled to the two conductors, and a heat spreader thermally coupled to the LED. The two conductors can be printed on the polymeric substrate, embedded within... | 1. An illumination assembly comprising:
a polymeric substrate; an electrical circuit including two conductors supported by the polymeric substrate; a light source electrically coupled to the two conductors; a heat spreader thermally coupled to the LED light source; and a first polymeric layer comprising a thermoplastic... | An illumination assembly includes a polymeric substrate, an electrical circuit including two conductors supported by the polymeric substrate, an LED electrically coupled to the two conductors, and a heat spreader thermally coupled to the LED. The two conductors can be printed on the polymeric substrate, embedded within... | 2,800 |
12,119 | 12,119 | 15,309,125 | 2,864 | Some aspects of what is described here relate to seismic profiling techniques. A seismic excitation is generated in a first directional section of a first wellbore in a subterranean region. Seismic responses associated with the seismic excitation are detected in directional sections of a plurality of other wellbores in... | 1. A seismic profiling method comprising:
detecting seismic responses associated with a seismic excitation in a subterranean region, the seismic excitation generated in a first directional section of a first wellbore in the subterranean region, the seismic responses detected at directional sections of a plurality of ot... | Some aspects of what is described here relate to seismic profiling techniques. A seismic excitation is generated in a first directional section of a first wellbore in a subterranean region. Seismic responses associated with the seismic excitation are detected in directional sections of a plurality of other wellbores in... | 2,800 |
12,120 | 12,120 | 16,034,385 | 2,891 | An electronic module includes a substrate that includes a first main surface and a second main surface, at least one first electronic component that includes electrodes on a mounting surface thereof on the substrate and that includes a hollow portion, at least one second electronic component that includes electrodes on... | 1. An electronic module comprising:
a substrate that includes a first main surface and a second main surface; at least one first electronic component that includes electrodes provided on a mounting surface thereof on the substrate and that includes a hollow portion; at least one second electronic component that include... | An electronic module includes a substrate that includes a first main surface and a second main surface, at least one first electronic component that includes electrodes on a mounting surface thereof on the substrate and that includes a hollow portion, at least one second electronic component that includes electrodes on... | 2,800 |
12,121 | 12,121 | 15,507,986 | 2,865 | Computing device, computer instructions and method for processing energy at a free-surface reflection relating to an air-water interface. The method includes receiving input seismic data recorded with seismic sensors; receiving wave-height data that describes an actual shape of a top surface of a body of water; process... | 1. A method for processing energy at a free-surface reflection relating to an air-water interface, the method comprising:
receiving input seismic data recorded with seismic sensors; receiving wave-height data that describes an actual shape of a top surface of a body of water; processing up-going energy at a receiver an... | Computing device, computer instructions and method for processing energy at a free-surface reflection relating to an air-water interface. The method includes receiving input seismic data recorded with seismic sensors; receiving wave-height data that describes an actual shape of a top surface of a body of water; process... | 2,800 |
12,122 | 12,122 | 14,828,062 | 2,866 | Apparatus and methods for detecting stray voltage anomalies in electric fields are provided herein. In some embodiments, an apparatus for detecting an electrical field may comprise: at least one sensor probe for generating data corresponding to an electrical field detected by the at least one sensor probe, wherein the ... | 1. A mobile apparatus mounted to a motor vehicle for identifying a hazardously energized object, the apparatus comprising:
one or more sensor probes that detect electric field and provide an analog signal corresponding to the electric field; a signal converter for generating a digital signal from the analog signal; a p... | Apparatus and methods for detecting stray voltage anomalies in electric fields are provided herein. In some embodiments, an apparatus for detecting an electrical field may comprise: at least one sensor probe for generating data corresponding to an electrical field detected by the at least one sensor probe, wherein the ... | 2,800 |
12,123 | 12,123 | 14,062,319 | 2,822 | This invention discloses a semiconductor power device formed in a semiconductor substrate comprises a highly doped region near a top surface of the semiconductor substrate on top of a lightly doped region. The semiconductor power device further comprises a body region, a source region and a gate disposed near the top s... | 1. A method for manufacturing a semiconductor power device in a semiconductor substrate comprising:
doping the semiconductor substrate to form a lightly doped lower layer and a highly doped upper layer near a top surface on top of the lightly doped lower layer; opening a plurality of source connecting trenches into the... | This invention discloses a semiconductor power device formed in a semiconductor substrate comprises a highly doped region near a top surface of the semiconductor substrate on top of a lightly doped region. The semiconductor power device further comprises a body region, a source region and a gate disposed near the top s... | 2,800 |
12,124 | 12,124 | 15,023,104 | 2,863 | A method is disclosed for determining a mechanical-technological characteristic variable of ferromagnetic metals, preferably ferromagnetic steels, and in particular fine-grained steels, which are used in pipelines. A magnetization apparatus, which has at least one permanent magnet or solenoid, magnetizes the metal whic... | 1. A method for determining a mechanical-technological characteristic variable of ferromagnetic metals comprising the steps of:
magnetizing a metal that is to be determined with a magnetization apparatus which has at least one permanent magnet or solenoid; generating a magnetic field via a sensor apparatus comprising a... | A method is disclosed for determining a mechanical-technological characteristic variable of ferromagnetic metals, preferably ferromagnetic steels, and in particular fine-grained steels, which are used in pipelines. A magnetization apparatus, which has at least one permanent magnet or solenoid, magnetizes the metal whic... | 2,800 |
12,125 | 12,125 | 15,625,230 | 2,836 | A circuit interrupter is structured to protect a protected circuit. The circuit interrupter includes a ground fault current sensor structured to sense a ground fault current in the protected circuit and a processor including a routine structured to perform a ground fault output self-test. The ground fault output self-t... | 1. A circuit interrupter structured to protect a protected circuit, the circuit interrupter comprising:
a ground fault current sensor structured to sense a ground fault current in the protected circuit; a processor including a routine structured to perform a ground fault output self-test, the ground fault output self-t... | A circuit interrupter is structured to protect a protected circuit. The circuit interrupter includes a ground fault current sensor structured to sense a ground fault current in the protected circuit and a processor including a routine structured to perform a ground fault output self-test. The ground fault output self-t... | 2,800 |
12,126 | 12,126 | 15,179,322 | 2,837 | A magnetic actuator or liner actuator with improved plunger control and a simplified construction technique is provided. | 1. A linear actuator, comprising:
a housing that has an upper surface, a circumferential wall, and a cover that define an interior space, the upper surface and the cover have apertures on a common centerline, and the cover has a base that fits within and closes the aperture in the cover; the base has a floor, a first w... | A magnetic actuator or liner actuator with improved plunger control and a simplified construction technique is provided.1. A linear actuator, comprising:
a housing that has an upper surface, a circumferential wall, and a cover that define an interior space, the upper surface and the cover have apertures on a common cen... | 2,800 |
12,127 | 12,127 | 15,965,175 | 2,884 | A sensing probe may be formed of a diamond material comprising one or more spin defects that are configured to emit fluorescent light and are located no more than 50 nm from a sensing surface of the sensing probe. The sensing probe may include an optical outcoupling structure formed by the diamond material and configur... | 1. A sensing probe formed of a diamond material, the sensing probe comprising:
one or more spin defects configured to emit fluorescent light; and an optical outcoupling structure formed by the diamond material, the optical outcoupling structure configured to optically guide the fluorescent light emitted by the one or m... | A sensing probe may be formed of a diamond material comprising one or more spin defects that are configured to emit fluorescent light and are located no more than 50 nm from a sensing surface of the sensing probe. The sensing probe may include an optical outcoupling structure formed by the diamond material and configur... | 2,800 |
12,128 | 12,128 | 16,409,488 | 2,896 | In a method for monitoring a rotating electric machine (1) that is fed by a converter and for diagnosing faults of said rotating electric machine, a current signature (I1, I2, I3) of output signals of the converter is recorded, the current signature (I1, I2, I3) is transformed, and the transformed current signature (A)... | 1. A method for monitoring and fault diagnosis of a rotating electric machine, including:
receiving input from a converter; recording a current signature of output signals of the converter; performing a transformation of the current signature to yield a transformed current signature, including performing at least one f... | In a method for monitoring a rotating electric machine (1) that is fed by a converter and for diagnosing faults of said rotating electric machine, a current signature (I1, I2, I3) of output signals of the converter is recorded, the current signature (I1, I2, I3) is transformed, and the transformed current signature (A)... | 2,800 |
12,129 | 12,129 | 16,685,074 | 2,822 | Embodiments of the disclosure generally relate to a layer stack containing a dielectric layer having a high K value capable of improving semiconductor display device electrical performance. The layer stack includes a channel layer containing an amorphous silicon layer disposed on a substrate and a gate insulating layer... | 1. A layer stack, comprising:
a channel layer comprising an amorphous silicon layer and disposed on a substrate; and a gate insulating layer disposed on the channel layer, wherein the gate insulating layer comprises:
a silicon dioxide layer disposed on the channel layer;
a zirconium dioxide layer disposed on the silico... | Embodiments of the disclosure generally relate to a layer stack containing a dielectric layer having a high K value capable of improving semiconductor display device electrical performance. The layer stack includes a channel layer containing an amorphous silicon layer disposed on a substrate and a gate insulating layer... | 2,800 |
12,130 | 12,130 | 16,503,982 | 2,818 | The present disclosure relates to semiconductor structures and, more particularly, to stacked gate transistors and methods of manufacture. The structure includes a stacked gate structure having a plurality of transistors with at least one floating node and at least one node to either ground or a supply voltage, and a c... | 1. A structure comprising a stacked gate structure comprising a plurality of transistors with at least one floating node and at least one node to either ground or a supply voltage, and a contact to either of the ground or supply voltage and the at least one floating node being devoid of any contact. 2. The structure of... | The present disclosure relates to semiconductor structures and, more particularly, to stacked gate transistors and methods of manufacture. The structure includes a stacked gate structure having a plurality of transistors with at least one floating node and at least one node to either ground or a supply voltage, and a c... | 2,800 |
12,131 | 12,131 | 15,940,999 | 2,882 | A manufacturing method of a projection apparatus is provided. The manufacturing method of the projection apparatus includes: classifying a light valve by an optical jig; selecting an aperture stop with a size corresponding to classification of the light valve; and assembling the light valve and the aperture stop to for... | 1. A manufacturing method of a projection apparatus comprising:
classifying a plurality of digital micro-mirror devices (DMDs) into a first group and a second group according to off-state brightness of each of the DMDs, wherein each of micro-mirrors of the DMDs has two different tilting axes; and assembling one of foll... | A manufacturing method of a projection apparatus is provided. The manufacturing method of the projection apparatus includes: classifying a light valve by an optical jig; selecting an aperture stop with a size corresponding to classification of the light valve; and assembling the light valve and the aperture stop to for... | 2,800 |
12,132 | 12,132 | 15,749,550 | 2,846 | An actuator (1) comprises an electric motor (11) for moving an actuated part (2) to an actuated position. The actuator (1) further comprises a controller (10) connected to the electric motor (11) and configured to determine a motor current of the electric motor (11) and to detect motor rotations. The controller (10) is... | 1. An actuator (1) comprising an electric motor for moving an actuated part (2) to an actuated position, and a controller (10) connected to the electric motor (11) and configured to detect motor rotations,
wherein the controller (10) is further configured to determine the actuated position by counting the motor rotatio... | An actuator (1) comprises an electric motor (11) for moving an actuated part (2) to an actuated position. The actuator (1) further comprises a controller (10) connected to the electric motor (11) and configured to determine a motor current of the electric motor (11) and to detect motor rotations. The controller (10) is... | 2,800 |
12,133 | 12,133 | 15,349,779 | 2,865 | A system and methods for monitoring an impact of geomagnetic disturbances (GMDs) or an E3 component of electromagnetic pulses (EMP-E3), involving a transducer generating a transduced signal in response to a magnetic field of a current carrying element of a transmission line. The transduced signal reflects harmonic char... | 1. A monitoring device for monitoring an impact of Geomagnetic disturbances (GMDs) or an E3 component of electromagnetic pulses (EMP-E3), the monitoring device comprising:
a transducer to generate a transduced signal in response to a magnetic field of a current carrying element of a transmission line, wherein the trans... | A system and methods for monitoring an impact of geomagnetic disturbances (GMDs) or an E3 component of electromagnetic pulses (EMP-E3), involving a transducer generating a transduced signal in response to a magnetic field of a current carrying element of a transmission line. The transduced signal reflects harmonic char... | 2,800 |
12,134 | 12,134 | 16,327,058 | 2,877 | A measuring device is provided for measuring the absorption of gases. The measuring device (1) includes a radiation source (2), a first detector element (3), a second detector element (9) and a reflector array (4). The reflector array (4) defines a first optical path (5) between the radiation source (2) and the first d... | 1. A measuring device for measuring the absorption of gases, the measuring device comprising:
a radiation source; a first detector element; a second detector element; and a reflector array, the reflector array defining a first optical path between the radiation source and the first detector element and the reflector ar... | A measuring device is provided for measuring the absorption of gases. The measuring device (1) includes a radiation source (2), a first detector element (3), a second detector element (9) and a reflector array (4). The reflector array (4) defines a first optical path (5) between the radiation source (2) and the first d... | 2,800 |
12,135 | 12,135 | 15,762,459 | 2,846 | A method for preventing a frequency component of a voltage from occurring in an electrical machine including the steps of: obtaining, either by measuring a voltage signal or a current signal from the electrical machine in time domain and transforming the measured signal into frequency domain, by simulating or deducing ... | 1. A method for preventing at least one frequency component of a voltage from occurring in an electrical machine, the method comprising the steps of:
obtaining, either by measuring a voltage signal or a current signal from the electrical machine in time domain and transforming the measured signal into frequency domain,... | A method for preventing a frequency component of a voltage from occurring in an electrical machine including the steps of: obtaining, either by measuring a voltage signal or a current signal from the electrical machine in time domain and transforming the measured signal into frequency domain, by simulating or deducing ... | 2,800 |
12,136 | 12,136 | 15,517,748 | 2,836 | A system for providing wireless power transfer includes a primary antenna having a primary lens surrounding the primary antenna and a secondary antenna having a secondary lens surrounding the secondary antenna. The secondary antenna is operatively connected to power at least one sensor. A mains power source is operativ... | 1. A system for providing wireless power transfer for a security and access control system, comprising:
a primary antenna having a primary lens surrounding the primary antenna; a secondary antenna having a secondary lens surrounding the secondary antenna, wherein the secondary antenna is operatively connected to at lea... | A system for providing wireless power transfer includes a primary antenna having a primary lens surrounding the primary antenna and a secondary antenna having a secondary lens surrounding the secondary antenna. The secondary antenna is operatively connected to power at least one sensor. A mains power source is operativ... | 2,800 |
12,137 | 12,137 | 15,202,245 | 2,811 | A semiconductor package including a premold which is used to define support structure for a semiconductor die which is mounted to the premold by a layer of suitable adhesive. Embedded within the premold are lands which each include oppose upper and lower surfaces exposed in respective ones of upper and lower surfaces d... | 1-20. (canceled) 21. A method for forming a semiconductor package comprising:
providing a premold substrate comprising:
a first conductive portion having a side surface at least partially encapsulated with a molded insulating material;
a second conductive portion having a surface exposed to the outside of the molded in... | A semiconductor package including a premold which is used to define support structure for a semiconductor die which is mounted to the premold by a layer of suitable adhesive. Embedded within the premold are lands which each include oppose upper and lower surfaces exposed in respective ones of upper and lower surfaces d... | 2,800 |
12,138 | 12,138 | 13,842,707 | 2,846 | A mining machine including a motor, an adjustable speed drive providing a voltage to the motor, the voltage having an excitation component comprising a magnitude and a frequency for operating the motor at a desired speed and including an additional voltage component for use in detecting a ground fault condition, and a ... | 1. A mining machine comprising:
a motor; an adjustable speed drive providing a voltage to the motor, the voltage having an excitation component comprising a magnitude and a frequency for operating the motor at a desired speed and including an additional voltage component for use in detecting a ground fault condition; a... | A mining machine including a motor, an adjustable speed drive providing a voltage to the motor, the voltage having an excitation component comprising a magnitude and a frequency for operating the motor at a desired speed and including an additional voltage component for use in detecting a ground fault condition, and a ... | 2,800 |
12,139 | 12,139 | 16,721,649 | 2,884 | A processing device determines a plurality of angles from which tracking images can be generated by an imaging device. The processing device generates a plurality of projections of a treatment planning image of a patient, the treatment planning image comprising a delineated target, wherein each projection of the plural... | 1. A method comprising:
determining, by a processing device, a plurality of angles from which tracking images can be generated by an imaging device; generating, by the processing device, a plurality of projections of a treatment planning image, the treatment planning image comprising a delineated target, wherein each p... | A processing device determines a plurality of angles from which tracking images can be generated by an imaging device. The processing device generates a plurality of projections of a treatment planning image of a patient, the treatment planning image comprising a delineated target, wherein each projection of the plural... | 2,800 |
12,140 | 12,140 | 15,824,177 | 2,822 | An electronic device includes a plurality of pixel electrodes, an active layer on the plurality of pixel electrodes, an opposed electrode on the active layer and covering an entirety of an upper surface of the active layer, and a first encapsulation film on the opposed electrode wherein the opposed electrode and the fi... | 1. An electronic device, comprising:
a plurality of pixel electrodes; an active layer on the plurality of pixel electrodes; an opposed electrode on the active layer and covering an entirety of an upper surface of the active layer; and a first encapsulation film on the opposed electrode, wherein the opposed electrode an... | An electronic device includes a plurality of pixel electrodes, an active layer on the plurality of pixel electrodes, an opposed electrode on the active layer and covering an entirety of an upper surface of the active layer, and a first encapsulation film on the opposed electrode wherein the opposed electrode and the fi... | 2,800 |
12,141 | 12,141 | 13,702,169 | 2,865 | Described are techniques for processing data. Sample analysis is performed generating scans of data. Each scan comprises a set of data elements each associating an ion intensity count with a plurality of dimensions including a retention time dimension and a mass to charge ratio dimension. The scans are analyzed to iden... | 1. A method for processing data comprising:
performing sample analysis and generating scans of data, each of said scans comprising a set of data elements each associating an ion intensity count with a plurality of dimensions including a retention time dimension and a mass to charge ratio dimension; and analyzing said s... | Described are techniques for processing data. Sample analysis is performed generating scans of data. Each scan comprises a set of data elements each associating an ion intensity count with a plurality of dimensions including a retention time dimension and a mass to charge ratio dimension. The scans are analyzed to iden... | 2,800 |
12,142 | 12,142 | 14,768,077 | 2,884 | A danger detector, for example a flame detector, includes an alarm housing with an alarm cover. The housing part of the alarm cover is permeable to heat radiation in the central infrared range. A non-contact, optical heat radiation sensor which is sensitive to the incoming heat radiation and optically oriented to the h... | 1. A danger detector, comprising:
an alarm housing with an alarm cover, wherein a housing part of the alarm cover is transparent for heat radiation in the mid-infrared range, wherein a non-contact heat radiation sensor that is optically aligned to the housing part and sensitive for the incident heat radiation is dispos... | A danger detector, for example a flame detector, includes an alarm housing with an alarm cover. The housing part of the alarm cover is permeable to heat radiation in the central infrared range. A non-contact, optical heat radiation sensor which is sensitive to the incoming heat radiation and optically oriented to the h... | 2,800 |
12,143 | 12,143 | 14,865,795 | 2,853 | A system for identifying a corrosion risk during the design of a mechanical assembly, the system comprising: a design data unit for storing design data representing the mechanical assembly; a corrosion data unit for storing corrosion data; and a processor configured to: obtain design data from the design data unit; obt... | 1. A system for identifying a corrosion risk during the design of a mechanical assembly, the system comprising:
a design data unit for storing design data representing the mechanical assembly; a corrosion data unit for storing corrosion data; and a processor configured to: obtain design data from the design data unit; ... | A system for identifying a corrosion risk during the design of a mechanical assembly, the system comprising: a design data unit for storing design data representing the mechanical assembly; a corrosion data unit for storing corrosion data; and a processor configured to: obtain design data from the design data unit; obt... | 2,800 |
12,144 | 12,144 | 12,909,613 | 2,844 | A task light that includes a plurality of light emitting diodes (LED's) adapted for providing a variable intensity of emitted light; a light directing member for directing light from the LED's onto a work surface; a control logic, electrically connected to a light intensity selector, an ambient light sensor, and the pl... | 1. An LED task light comprising:
a plurality of light emitting diodes (LED's) mounted on at least one substrate, and adapted for providing a variable intensity of emitted light; a housing, adapted for receiving the at least one substrate; a light directing member retained in the housing, wherein said light directing me... | A task light that includes a plurality of light emitting diodes (LED's) adapted for providing a variable intensity of emitted light; a light directing member for directing light from the LED's onto a work surface; a control logic, electrically connected to a light intensity selector, an ambient light sensor, and the pl... | 2,800 |
12,145 | 12,145 | 15,301,226 | 2,855 | A membrane-based sensor in one embodiment includes a membrane layer including an upper surface and a lower surface, a backside trench defined on one side by the lower surface, a central cavity defined on a first side by the upper surface, a cap layer positioned above the central cavity, and a first spacer extending fro... | 1. A membrane-based sensor comprising:
a membrane layer including an upper surface and a lower surface; a backside trench defined on one side by the lower surface; a central cavity defined on a first side by the upper surface; a cap layer positioned above the central cavity; and a first spacer extending from the upper ... | A membrane-based sensor in one embodiment includes a membrane layer including an upper surface and a lower surface, a backside trench defined on one side by the lower surface, a central cavity defined on a first side by the upper surface, a cap layer positioned above the central cavity, and a first spacer extending fro... | 2,800 |
12,146 | 12,146 | 14,194,533 | 2,846 | An induction motor controller is provided. The induction motor controller includes a first module that derives a commanded stator voltage vector, in a rotor flux reference frame, via a rotor flux regulator loop and a torque regulator loop, which process at least partially in the rotor flux reference frame. The inductio... | 1. An induction motor controller, comprising:
a first module that derives a commanded stator voltage vector, in a rotor flux reference frame, via a rotor flux regulator loop and a torque regulator loop; and a second module that processes the commanded stator voltage vector to produce AC (alternating current) power for ... | An induction motor controller is provided. The induction motor controller includes a first module that derives a commanded stator voltage vector, in a rotor flux reference frame, via a rotor flux regulator loop and a torque regulator loop, which process at least partially in the rotor flux reference frame. The inductio... | 2,800 |
12,147 | 12,147 | 15,841,345 | 2,828 | An optoelectronic device includes a semiconductor substrate with a first set of epitaxial layers formed on an area of the substrate defining a lower distributed Bragg-reflector (DBR) stack. A second set of epitaxial layers formed over the first set defines a quantum well structure, and a third set of epitaxial layers, ... | 1. An optoelectronic device, comprising:
a semiconductor substrate; a first set of epitaxial layers formed on an area of the substrate defining a lower distributed Bragg-reflector (DBR) stack; a second set of epitaxial layers formed over the first set, defining a quantum well structure; a third set of epitaxial layers,... | An optoelectronic device includes a semiconductor substrate with a first set of epitaxial layers formed on an area of the substrate defining a lower distributed Bragg-reflector (DBR) stack. A second set of epitaxial layers formed over the first set defines a quantum well structure, and a third set of epitaxial layers, ... | 2,800 |
12,148 | 12,148 | 15,337,922 | 2,875 | An elliptical lens comprises a lens body having a proximal section and a distal section. The proximal section has at least one input surface for receiving light from a light source and the distal section has at least one output surface through which light exits the lens body. The proximal section further comprises a su... | 1. A lens, comprising:
a lens body disposed about an optical axis and comprising a proximal section having at least one input surface for receiving light from a light source and a distal section having at least a substantially flat output surface that is substantially orthogonal to said optical axis and through which l... | An elliptical lens comprises a lens body having a proximal section and a distal section. The proximal section has at least one input surface for receiving light from a light source and the distal section has at least one output surface through which light exits the lens body. The proximal section further comprises a su... | 2,800 |
12,149 | 12,149 | 15,692,741 | 2,853 | An electromagnetic flowmeter assembly is provided. The assembly includes a magnetic flowmeter configured to couple to a process pipe at a coupling point and measure a flowrate of a flow of process fluid. The assembly includes a conductive polymer reference connection configured to contact the process fluid and provide ... | 1. An electromagnetic flowmeter assembly comprising:
a magnetic flowmeter configured to couple to a process pipe at a coupling point and measure a flowrate of a flow of process fluid; and a conductive polymer reference connection configured to contact the process fluid and provide an electrical connection to magnetic f... | An electromagnetic flowmeter assembly is provided. The assembly includes a magnetic flowmeter configured to couple to a process pipe at a coupling point and measure a flowrate of a flow of process fluid. The assembly includes a conductive polymer reference connection configured to contact the process fluid and provide ... | 2,800 |
12,150 | 12,150 | 15,990,046 | 2,856 | A system includes an inspection robot comprising a plurality of sensor sleds; a plurality of ultra-sonic (UT) sensors; a couplant chamber mounted to each of the plurality of sleds, each couplant chamber comprising: a cone, the cone comprising a cone tip portion at an inspection surface end of the cone; a sensor mountin... | 1. A system, comprising:
an inspection robot comprising a plurality of sensor sleds; a plurality of ultra-sonic (UT) sensors; a couplant chamber mounted to each of the plurality of sleds, each couplant chamber comprising:
a cone, the cone comprising a cone tip portion at an inspection surface end of the cone;
a sensor ... | A system includes an inspection robot comprising a plurality of sensor sleds; a plurality of ultra-sonic (UT) sensors; a couplant chamber mounted to each of the plurality of sleds, each couplant chamber comprising: a cone, the cone comprising a cone tip portion at an inspection surface end of the cone; a sensor mountin... | 2,800 |
12,151 | 12,151 | 16,379,801 | 2,847 | An electromagnetic shielding material includes multiple strands of an electrically conductive yarn that are arranged as a braided, knitted, or woven mesh. Each strand of the electrically conductive yarn comprises one or more electrically conductive filaments; each electrically conductive filament comprises a core of a ... | 1. An electromagnetic shielding material comprising multiple strands of an electrically conductive yarn that are arranged as a braided, knitted, or woven mesh, wherein:
(a) each strand of the electrically conductive yarn comprises one or more electrically conductive filaments; (b) each electrically conductive filament ... | An electromagnetic shielding material includes multiple strands of an electrically conductive yarn that are arranged as a braided, knitted, or woven mesh. Each strand of the electrically conductive yarn comprises one or more electrically conductive filaments; each electrically conductive filament comprises a core of a ... | 2,800 |
12,152 | 12,152 | 15,410,116 | 2,847 | A ceramic wiring board that includes a ceramic insulator and a via-conductor. The ceramic insulator includes a crystalline constituent and an amorphous constituent. The via-conductor includes a metal and an oxide. The crystalline constituent and the oxide include at least one metal element in common. A tubular region h... | 1. A ceramic wiring board comprising:
a ceramic insulator including a crystalline constituent and an amorphous constituent; a via-conductor formed in the ceramic insulator, the via-conductor including a metal and an oxide the crystalline constituent and the oxide including a metal element in common; and a tubular regio... | A ceramic wiring board that includes a ceramic insulator and a via-conductor. The ceramic insulator includes a crystalline constituent and an amorphous constituent. The via-conductor includes a metal and an oxide. The crystalline constituent and the oxide include at least one metal element in common. A tubular region h... | 2,800 |
12,153 | 12,153 | 15,998,162 | 2,883 | A Diamond Nano Resonator Semiconductor, This is an Technology Light years Ahead of the 21st Century. Diamond Sensors for your mobile Devices, such as a Cell Phone, Tablet, your Car, Buses, Commercial Airplane, Jets, Rockets, Satellites, Trains, Televisions, Radio, Diamond™ Smart Watch, Power Plants, Cell Phone Tower, e... | 1. A Diamond Nano Resonator Semiconductor Comprising:
A Diamond Coated Synthetic Diamond, and Sensor for Cars, Trucks, Trains, Diamonds Coated Smart Watch. Power Plants, cell phones tower, mother board circuits, commercial air planes, Jet planes, And Rockets, Satellites, cell phones, Tablets, three way radio, Data Cent... | A Diamond Nano Resonator Semiconductor, This is an Technology Light years Ahead of the 21st Century. Diamond Sensors for your mobile Devices, such as a Cell Phone, Tablet, your Car, Buses, Commercial Airplane, Jets, Rockets, Satellites, Trains, Televisions, Radio, Diamond™ Smart Watch, Power Plants, Cell Phone Tower, e... | 2,800 |
12,154 | 12,154 | 16,116,408 | 2,838 | A system for a vehicle includes a converter configured to, responsive to a first signal from a first adaptor indicating a first plug type having a first electrical parameter configuration, output power to the adaptor according to the first electrical parameter configuration, and responsive to a second signal from a sec... | 1. A vehicle comprising:
an electric machine; a traction battery configured to power the electric machine; and a converter configured to
responsive to a first signal from a first adaptor indicating a first plug type having a first electrical parameter configuration, output power from the traction battery to the first a... | A system for a vehicle includes a converter configured to, responsive to a first signal from a first adaptor indicating a first plug type having a first electrical parameter configuration, output power to the adaptor according to the first electrical parameter configuration, and responsive to a second signal from a sec... | 2,800 |
12,155 | 12,155 | 15,347,492 | 2,859 | One embodiment provides an electronic device, including: two or more ports; two or more charging circuits, wherein the two or more ports have an associated charging circuit; a battery; a processor; and a memory device that stores instructions executable by the processor to: detect, at a first port, a physically connect... | 1. An electronic device, comprising:
two or more ports; two or more charging circuits, wherein said two or more ports have an associated charging circuit; a battery; a processor; and a memory device that stores instructions executable by the processor to: detect, at a first port, a physically connected plug; detect, at... | One embodiment provides an electronic device, including: two or more ports; two or more charging circuits, wherein the two or more ports have an associated charging circuit; a battery; a processor; and a memory device that stores instructions executable by the processor to: detect, at a first port, a physically connect... | 2,800 |
12,156 | 12,156 | 14,911,877 | 2,899 | A battery having a display indicating an amount of time the battery can be used before needing to be recharged and/or replaced. The amount of time can be displayed in minutes. An end of life indicator indicating whether the battery should be replaced can also be provided on the battery. The battery can determine the am... | 1. A battery, comprising:
a display indicating an amount of time the battery can be used before needing to be at least one of recharged or replaced. 2. The battery of claim 1, wherein the amount of time is displayed in minutes. 3. The battery of claim 1, wherein the display provides an end of life indicator including a... | A battery having a display indicating an amount of time the battery can be used before needing to be recharged and/or replaced. The amount of time can be displayed in minutes. An end of life indicator indicating whether the battery should be replaced can also be provided on the battery. The battery can determine the am... | 2,800 |
12,157 | 12,157 | 15,600,996 | 2,881 | Ions are injected into an orbital electrostatic trap. An ejection potential is applied to an ion storage device, to cause ions stored in the ion storage device to be ejected towards the orbital electrostatic trap. Synchronous injection potentials are applied to a central electrode of the orbital electrostatic trap and ... | 1. A method of injecting ions into an orbital electrostatic trap, comprising:
applying an ejection potential to an ion storage device, to cause ions stored in the ion storage device to be ejected towards the orbital electrostatic trap; and applying synchronous injection potentials to a central electrode of the orbital ... | Ions are injected into an orbital electrostatic trap. An ejection potential is applied to an ion storage device, to cause ions stored in the ion storage device to be ejected towards the orbital electrostatic trap. Synchronous injection potentials are applied to a central electrode of the orbital electrostatic trap and ... | 2,800 |
12,158 | 12,158 | 16,139,360 | 2,811 | Provided is an ultraviolet light receiving element capable of reducing visible light sensitivity. The ultraviolet light receiving element includes: a first photodiode sensitive to an ultraviolet light provided in a first region of a semiconductor substrate; and a second photodiode insensitive to the ultraviolet light p... | 1. An ultraviolet light receiving element, comprising:
a first photodiode sensitive to an ultraviolet light provided in a first region of a semiconductor substrate, and including a first well implantation layer of a first conductivity type, a first embedded implantation layer of a second conductivity type, and a first ... | Provided is an ultraviolet light receiving element capable of reducing visible light sensitivity. The ultraviolet light receiving element includes: a first photodiode sensitive to an ultraviolet light provided in a first region of a semiconductor substrate; and a second photodiode insensitive to the ultraviolet light p... | 2,800 |
12,159 | 12,159 | 16,205,429 | 2,853 | A printer is configured to apply marking material to print media to create a printed item, and a transport belt is positioned to receive the printed item from the printer and is configured to dry the marking material on the printed item. The transport belt has a middle layer attached between outer and inner layers, and... | 1. An apparatus comprising:
a printer configured to apply marking material to print media to create a printed item; and a transport belt positioned to receive the printed item from the printer and configured to dry the marking material on the printed item, wherein the transport belt comprises a second layer between a f... | A printer is configured to apply marking material to print media to create a printed item, and a transport belt is positioned to receive the printed item from the printer and is configured to dry the marking material on the printed item. The transport belt has a middle layer attached between outer and inner layers, and... | 2,800 |
12,160 | 12,160 | 14,927,016 | 2,883 | A photonic integrated circuit may be coupled to an optical fiber and packaged. The optical fiber may be supported by a fiber holder during a solder reflow process performed to mount the packaged photonic integrated circuit to a circuit board or other substrate. The optical fiber may be decoupled from the fiber holder, ... | 1. An apparatus, comprising:
a substrate having a first surface; a photonic integrated circuit (PIC) coupled to the substrate and having a first surface proximate the first surface of the substrate and a second surface opposite the first surface of the PIC and distal the first surface of the substrate; a lid, contactin... | A photonic integrated circuit may be coupled to an optical fiber and packaged. The optical fiber may be supported by a fiber holder during a solder reflow process performed to mount the packaged photonic integrated circuit to a circuit board or other substrate. The optical fiber may be decoupled from the fiber holder, ... | 2,800 |
12,161 | 12,161 | 15,557,591 | 2,899 | The invention relates to a chip arrangement ( 10 ) and to a method for forming a contact connection ( 11 ) between a chip ( 18 ), in particular a power transistor or the like, and a conductor material track ( 14 ), the conductor material track being formed on a non-conductive substrate ( 12 ), the chip being arranged o... | 1. A method for forming a contact connection between a chip and a conductor material track, the conductor material track being formed on a non-conductive substrate, the chip being arranged on the substrate or on another conductor material track,
comprising the steps of applying a silver paste or a copper paste to each ... | The invention relates to a chip arrangement ( 10 ) and to a method for forming a contact connection ( 11 ) between a chip ( 18 ), in particular a power transistor or the like, and a conductor material track ( 14 ), the conductor material track being formed on a non-conductive substrate ( 12 ), the chip being arranged o... | 2,800 |
12,162 | 12,162 | 15,253,418 | 2,812 | A method of manufacturing a semiconductor device includes: forming a porous area at a surface of a semiconductor body; forming a semiconductor layer on the porous area by epitaxial growth; forming semiconductor regions including source, drain, body, emitter, base and/or collector regions in a front surface of the semic... | 1. A method of manufacturing a semiconductor device, the method comprising:
forming a porous area at a surface of a semiconductor body; forming a semiconductor layer on the porous area by epitaxial growth; forming semiconductor regions including source, drain, body, emitter, base and/or collector regions in a front sur... | A method of manufacturing a semiconductor device includes: forming a porous area at a surface of a semiconductor body; forming a semiconductor layer on the porous area by epitaxial growth; forming semiconductor regions including source, drain, body, emitter, base and/or collector regions in a front surface of the semic... | 2,800 |
12,163 | 12,163 | 16,317,624 | 2,844 | Embodiments of the present disclosure provide a microstrip antenna and an antenna array. The microstrip antenna includes a ground plane disposed on a first surface of a substrate of the microstrip antenna; a metal patch disposed on a second surface of the substrate opposite to the first surface; a feeding point dispose... | 1. A microstrip antenna, comprising:
a ground plane disposed on a first surface of a substrate of the microstrip antenna; a metal patch disposed on a second surface of the substrate opposite to the first surface; a feeding point disposed on the metal patch such that the microstrip antenna has a first resonant frequency... | Embodiments of the present disclosure provide a microstrip antenna and an antenna array. The microstrip antenna includes a ground plane disposed on a first surface of a substrate of the microstrip antenna; a metal patch disposed on a second surface of the substrate opposite to the first surface; a feeding point dispose... | 2,800 |
12,164 | 12,164 | 14,066,477 | 2,845 | An omni-directional antenna module includes a plurality of vertically and horizontally polarized antenna elements arranged to provide 360° coverage around an antenna, and to eliminate nulls below the antenna. The antenna elements are arranged in parallel with respective orthogonal axes of a three-dimensional Cartesian ... | 1. An omni-directional antenna module, comprising:
a plurality of vertically polarized antenna elements and a plurality of horizontally polarized antenna elements arranged to provide 360° coverage, and to eliminate nulls below an antenna, wherein: the vertically polarized antenna elements and the horizontally polarized... | An omni-directional antenna module includes a plurality of vertically and horizontally polarized antenna elements arranged to provide 360° coverage around an antenna, and to eliminate nulls below the antenna. The antenna elements are arranged in parallel with respective orthogonal axes of a three-dimensional Cartesian ... | 2,800 |
12,165 | 12,165 | 16,522,170 | 2,848 | A printed circuit board (PCB) including a first side and a second side; a conductive layer within the PCB between the first side and the second side; one or more first side electrical components that are physically attached to the first side and electrically connected to the conductive layer; one or more second side el... | 1. A printed circuit board (PCB) comprising:
a first side and a second side; a conductive layer within the PCB between the first side and the second side; one or more first side electrical components that are physically attached to the first side and electrically connected to the conductive layer; one or more second si... | A printed circuit board (PCB) including a first side and a second side; a conductive layer within the PCB between the first side and the second side; one or more first side electrical components that are physically attached to the first side and electrically connected to the conductive layer; one or more second side el... | 2,800 |
12,166 | 12,166 | 16,764,938 | 2,853 | An interface structure connectable to a separate liquid reservoir, to connect that liquid reservoir to a receiving station, comprising a liquid interface to fluidically connect to at least one liquid needle of the receiving station, a liquid channel, to fluidically connect the liquid interface to the reservoir, a suppo... | 1. An interface structure connectable to a separate liquid reservoir, to connect that liquid reservoir to a receiving station, comprising
a first, second and third dimension at straight angles with each other, a liquid interface to fluidically connect to at least one liquid needle of the receiving station, including an... | An interface structure connectable to a separate liquid reservoir, to connect that liquid reservoir to a receiving station, comprising a liquid interface to fluidically connect to at least one liquid needle of the receiving station, a liquid channel, to fluidically connect the liquid interface to the reservoir, a suppo... | 2,800 |
12,167 | 12,167 | 16,317,023 | 2,896 | Disclosed herein are quantum dot devices, as well as related computing devices and methods. For example, in some embodiments, a quantum dot device may include: a quantum well stack including a quantum well layer; a plurality of gates disposed above the quantum well stack, wherein at least two of the gates are spaced ap... | 1. A quantum dot device, comprising:
a quantum well stack including a quantum well layer; a plurality of gates disposed above the quantum well stack, wherein at least two of the gates are spaced apart in a first dimension above the quantum well stack, at least two of the gates are spaced apart in a second dimension abo... | Disclosed herein are quantum dot devices, as well as related computing devices and methods. For example, in some embodiments, a quantum dot device may include: a quantum well stack including a quantum well layer; a plurality of gates disposed above the quantum well stack, wherein at least two of the gates are spaced ap... | 2,800 |
12,168 | 12,168 | 16,161,117 | 2,843 | A high-frequency module includes a plurality of filters, a switch that commonly connects a plurality of paths, and a low noise amplifier that amplifies a high-frequency signal input from the plurality of filters with the switch interposed therebetween, wherein paths in which first and second filters are respectively pr... | 1. A high-frequency module comprising:
a filter; a connection circuit that connects a path in which the filter is provided; and a low noise amplifier that is connected to the connection circuit; wherein the connection circuit is connected between the filter and the low noise amplifier; in the path in which the filter i... | A high-frequency module includes a plurality of filters, a switch that commonly connects a plurality of paths, and a low noise amplifier that amplifies a high-frequency signal input from the plurality of filters with the switch interposed therebetween, wherein paths in which first and second filters are respectively pr... | 2,800 |
12,169 | 12,169 | 15,570,634 | 2,853 | A fluid recirculation channel for dispensing a plurality of fluid drop weights includes a number of sub-channels. The sub-channels include at least one pump channel, and a plurality of drop generator channels fluidically coupled to the at least one pump channel. The fluid recirculation channel further includes a number... | 1. A fluid recirculation channel for dispensing a plurality of fluid drop weights comprising:
a number of sub-channels comprising:
at least one pump channel; and
a plurality of drop generator channels fluidically coupled to the at least one pump channel;
a number of pump generators incorporated into the at least one p... | A fluid recirculation channel for dispensing a plurality of fluid drop weights includes a number of sub-channels. The sub-channels include at least one pump channel, and a plurality of drop generator channels fluidically coupled to the at least one pump channel. The fluid recirculation channel further includes a number... | 2,800 |
12,170 | 12,170 | 16,462,111 | 2,865 | The present invention provides a computer-implemented method for detecting at least one natural contour of a geologic object in 3D seismic data, the method comprising the steps of: (a) receiving at least one first predetermined data set from said 3D seismic data comprising a plurality of phase events; (b) selecting at ... | 1. A computer-implemented method for detecting at least one natural contour of a geologic object in 3D seismic data, the method comprising the steps of:
(a) receiving at least one first predetermined data set from said 3D seismic data comprising a plurality of phase events; (b) selecting at least one first seed phase e... | The present invention provides a computer-implemented method for detecting at least one natural contour of a geologic object in 3D seismic data, the method comprising the steps of: (a) receiving at least one first predetermined data set from said 3D seismic data comprising a plurality of phase events; (b) selecting at ... | 2,800 |
12,171 | 12,171 | 15,755,207 | 2,848 | A system includes a curved circuit board with at least one electronic component mounted on the circuit board and electrically connected to a first electrically conductive trace of the circuit board. The system includes an electrically conductive curved fence conformably attached to the circuit board and surrounding the... | 1-10 (canceled) 11. A system comprising:
a curved circuit board; at least one electronic component mounted on the circuit board and electrically connected to a first electrically conductive trace of the circuit board; an electrically conductive curved fence conformably attached to the circuit board and surrounding the ... | A system includes a curved circuit board with at least one electronic component mounted on the circuit board and electrically connected to a first electrically conductive trace of the circuit board. The system includes an electrically conductive curved fence conformably attached to the circuit board and surrounding the... | 2,800 |
12,172 | 12,172 | 14,488,135 | 2,883 | An optical connector adapted to be attached to an electronics module having optical-electrical conversion electronics and a module optical window. The optical connector has a connector optical window and a port for an optical link that is optically couplable to the connector optical window. The connector optical window... | 1. An optical connector adapted to be attached to an electronics module having optical-electrical conversion electronics and having at least one module optical window, said optical connector comprising:
at least one connector optical window; and at least one port for an optical link that is optically couplable through ... | An optical connector adapted to be attached to an electronics module having optical-electrical conversion electronics and a module optical window. The optical connector has a connector optical window and a port for an optical link that is optically couplable to the connector optical window. The connector optical window... | 2,800 |
12,173 | 12,173 | 15,511,606 | 2,864 | Simultaneous inversion of multi-vintage seismic data obtains seismic data for vintages and generates an initial earth model for each vintage. A cost function includes a data norm term having for at least one pair of vintages of seismic data a difference norm between a difference in obtained seismic data for the at leas... | 1. A method for inversion of multi-vintage seismic data, the method comprising:
obtaining seismic data of a subsurface structure for a plurality of vintages; generating an initial earth model of the subsurface structure for each one of the plurality of vintages; defining a cost function comprising a data norm term comp... | Simultaneous inversion of multi-vintage seismic data obtains seismic data for vintages and generates an initial earth model for each vintage. A cost function includes a data norm term having for at least one pair of vintages of seismic data a difference norm between a difference in obtained seismic data for the at leas... | 2,800 |
12,174 | 12,174 | 15,545,360 | 2,871 | An optical system including a lighting component and a switchable diffuser in optical communication with the lighting component. The optical system may further include a low absorbing optical component. At least one outer surface of the switchable diffuser and/or the low absorbing optical component includes light redir... | 1. An optical system comprising:
a lighting component; a switchable diffuser in optical communication with the lighting component, the switchable diffuser having at least a first state and a second state, the first state characterized by a first haze and the second state characterized by a second haze different from th... | An optical system including a lighting component and a switchable diffuser in optical communication with the lighting component. The optical system may further include a low absorbing optical component. At least one outer surface of the switchable diffuser and/or the low absorbing optical component includes light redir... | 2,800 |
12,175 | 12,175 | 16,296,007 | 2,847 | Superconducting integrated circuit layouts are proofed against the detrimental effects of stray flux by designing and fabricating them to have one or more ground planes patterned in the x-y plane with a regular grid of low-aspect-ratio flux-trapping voids. The ground plane(s) can be globally patterned with such voids a... | 1. A superconducting digital integrated circuit (IC) comprising:
a ground plane fabricated at least in part as a blanket deposition of a superconducting metal, the ground plane being patterned with a regular grid of dielectric-filled flux-trapping voids, each void in the grid being generally radially symmetrical in sha... | Superconducting integrated circuit layouts are proofed against the detrimental effects of stray flux by designing and fabricating them to have one or more ground planes patterned in the x-y plane with a regular grid of low-aspect-ratio flux-trapping voids. The ground plane(s) can be globally patterned with such voids a... | 2,800 |
12,176 | 12,176 | 16,156,708 | 2,848 | A monolithic ceramic capacitor has a plurality of dielectric layers and a plurality of conductive layers sintered together to form a substantially monolithic ceramic body. The ceramic body defines at least one void between the dielectric and conductive layers. The void is at least partially enclosed within the ceramic ... | 1. A ceramic capacitor comprising:
a plurality of dielectric layers and a plurality of conductive layer sintered together to form a substantially monolithic ceramic body, the body defining at least one void between the dielectric and conductive layers, the void being at least partially enclosed within the ceramic body ... | A monolithic ceramic capacitor has a plurality of dielectric layers and a plurality of conductive layers sintered together to form a substantially monolithic ceramic body. The ceramic body defines at least one void between the dielectric and conductive layers. The void is at least partially enclosed within the ceramic ... | 2,800 |
12,177 | 12,177 | 15,420,344 | 2,884 | A mobile X-ray system includes a movable base, a robotic arm mounted on the movable base, an X-ray source attached to the robotic arm, a radiation detector, one or more user interfaces, and a controller configured to determine a position of the X-ray source and a position of the detector and to automatically move the b... | 1. A mobile X-ray system comprising:
a movable base; a robotic arm mounted on the movable base; an X-ray source attached to the robotic arm; a radiation detector; one or more user interfaces; and a controller configured to determine a position of the X-ray source and a position of the detector and to automatically move... | A mobile X-ray system includes a movable base, a robotic arm mounted on the movable base, an X-ray source attached to the robotic arm, a radiation detector, one or more user interfaces, and a controller configured to determine a position of the X-ray source and a position of the detector and to automatically move the b... | 2,800 |
12,178 | 12,178 | 14,735,469 | 2,862 | Methods and systems for automated monitoring of sensors associated with a tool used in a manufacturing process are described. Sensor health may be evaluated based on the sensor's actual responses to set point changes. Rather than interrupt operation of the tool to determine whether one or more sensors are behaving in a... | 1. A computer-implemented method for automated monitoring of behavior of at least one sensor having a predictable operating behavior expected over a range of operating conditions applicable to a manufacturing process, wherein the at least one sensor is associated with a tool operated during the manufacturing process an... | Methods and systems for automated monitoring of sensors associated with a tool used in a manufacturing process are described. Sensor health may be evaluated based on the sensor's actual responses to set point changes. Rather than interrupt operation of the tool to determine whether one or more sensors are behaving in a... | 2,800 |
12,179 | 12,179 | 16,158,599 | 2,861 | A sensor system for a sub-surface system is disclosed, comprising a pressure sensor positioned in a first orientation; a gravity sensor arranged proximate to the pressure sensor, the gravity sensor detecting gravitational force on the pressure sensor relative to the first orientation; and a data acquisition system oper... | 1. A sensor system for a sub-surface system comprising:
a pressure sensor positioned in a first orientation; a gravity sensor arranged proximate to the pressure sensor, the gravity sensor detecting gravitational force on the pressure sensor relative to the first orientation; and a data acquisition system operatively co... | A sensor system for a sub-surface system is disclosed, comprising a pressure sensor positioned in a first orientation; a gravity sensor arranged proximate to the pressure sensor, the gravity sensor detecting gravitational force on the pressure sensor relative to the first orientation; and a data acquisition system oper... | 2,800 |
12,180 | 12,180 | 15,887,209 | 2,834 | A hand-held tool that includes a housing. The housing includes a handle. A tool also includes a motor assembly, a battery assembly and a circuit board. The motor assembly includes a motor, the motor including a rotatable motor output shaft, a motor positive terminal and a motor negative terminal. The motor assembly als... | 1. A hand-held tool, comprising:
a housing, the housing including a handle; a motor assembly; a battery assembly; and a circuit board; wherein the motor assembly includes a motor, the motor including a rotatable motor output shaft, a motor positive terminal and a motor negative terminal; wherein the motor assembly furt... | A hand-held tool that includes a housing. The housing includes a handle. A tool also includes a motor assembly, a battery assembly and a circuit board. The motor assembly includes a motor, the motor including a rotatable motor output shaft, a motor positive terminal and a motor negative terminal. The motor assembly als... | 2,800 |
12,181 | 12,181 | 15,760,033 | 2,863 | A method for determining the rotational rate of a movable member using an array of inertial sensors is provided. The method includes defining a hidden Markov model (“HMM”). The HMM represents a discrete value measurement of the rotational rate of the movable member. A transition probability of the HMM accounts for a mo... | 1. A method for determining rotational rate of a movable member using an array of inertial sensors, the method comprising:
defining a hidden Markov model (“HMM”), wherein hidden states of the HMM represent a discrete value measurement of the rotational rate of the movable member, and transition probability of the HHM a... | A method for determining the rotational rate of a movable member using an array of inertial sensors is provided. The method includes defining a hidden Markov model (“HMM”). The HMM represents a discrete value measurement of the rotational rate of the movable member. A transition probability of the HMM accounts for a mo... | 2,800 |
12,182 | 12,182 | 15,657,104 | 2,855 | A system for capacitive liquid level measurement of liquid in a container, including a level sensor with level+ and level− electrodes, driven out-of-phase to project a sensing electric field into the container, and a reference sensor with ref+ and ref− electrodes, driven out-of-phase to project a sensing electric field... | 1. A system for capacitive liquid level measurement, comprising:
a container with liquid; a level sensor with level+ and level− electrodes, driven out-of-phase to project a sensing electric field into the container; a reference sensor with ref+ and ref− electrodes, driven out-of-phase to project a sensing electric fiel... | A system for capacitive liquid level measurement of liquid in a container, including a level sensor with level+ and level− electrodes, driven out-of-phase to project a sensing electric field into the container, and a reference sensor with ref+ and ref− electrodes, driven out-of-phase to project a sensing electric field... | 2,800 |
12,183 | 12,183 | 14,440,510 | 2,822 | An ultraviolet light detector has a pn-junction of wide-gap semiconductors layers, where a p-type semiconductor layer with a polycrystalline metal oxide contacts an n-type semiconductor layer of metal oxide nanoparticles, or the converse. The ultraviolet detector is prepared using solvent based deposition methods and w... | 1. An ultraviolet light detector, comprising a pn-j unction of wide-gap semiconductors layers, wherein a p-type semiconductor layer comprising a polycrystalline metal oxide contacts an n-type semiconductor layer comprising a multiplicity of metal oxide nanoparticles. 2. The ultraviolet light detector according to claim... | An ultraviolet light detector has a pn-junction of wide-gap semiconductors layers, where a p-type semiconductor layer with a polycrystalline metal oxide contacts an n-type semiconductor layer of metal oxide nanoparticles, or the converse. The ultraviolet detector is prepared using solvent based deposition methods and w... | 2,800 |
12,184 | 12,184 | 16,599,238 | 2,831 | According to one embodiment, a controller may include a user interface that is operable to receive input from a user to control an electronic system to which the controller may be coupled either directly or indirectly. The user interface may comprise an interface housing to which the user interface is coupled, the inte... | 1. A controller system, comprising:
an electrical junction box; a mounting receptacle inserted into and coupled to the junction box; a user interface operable to receive input from a user, wherein the user interface comprises an interface housing to which the user interface is coupled, the interface housing having a fr... | According to one embodiment, a controller may include a user interface that is operable to receive input from a user to control an electronic system to which the controller may be coupled either directly or indirectly. The user interface may comprise an interface housing to which the user interface is coupled, the inte... | 2,800 |
12,185 | 12,185 | 15,493,862 | 2,859 | A system of a vehicle includes a processor configured to control output current of a remote power distribution circuit (PDC) connected to the vehicle according to a temperature change of a power line or return line of the PDC. The temperature change is derived from a PDC output voltage or output current change. The PDC... | 1. A system of a vehicle comprising:
a processor configured to control output current of a remote power distribution circuit (PDC) connected to the vehicle according to a temperature change of a power line or return line of the PDC that is derived from a PDC output voltage or output current change, the PDC output volta... | A system of a vehicle includes a processor configured to control output current of a remote power distribution circuit (PDC) connected to the vehicle according to a temperature change of a power line or return line of the PDC. The temperature change is derived from a PDC output voltage or output current change. The PDC... | 2,800 |
12,186 | 12,186 | 15,431,528 | 2,811 | A semiconductor device has a first semiconductor die including a first protection circuit. A second semiconductor die including a second protection circuit is disposed over the first semiconductor die. A portion of the first semiconductor die and second semiconductor die is removed to reduce die thickness. An interconn... | 1. A method of making a semiconductor device, comprising:
providing a first semiconductor die including a first protection circuit; disposing a second semiconductor die including a second protection circuit over the first semiconductor die; and forming an interconnect structure to commonly connect the first protection ... | A semiconductor device has a first semiconductor die including a first protection circuit. A second semiconductor die including a second protection circuit is disposed over the first semiconductor die. A portion of the first semiconductor die and second semiconductor die is removed to reduce die thickness. An interconn... | 2,800 |
12,187 | 12,187 | 16,240,071 | 2,881 | A system, method, and apparatus for heating a workpiece in chamber provides one or more surfaces generally enclosing a chamber volume. Vacuum and purge gas ports are in in fluid communication with the chamber volume. A heater apparatus selectively heats the workpiece on a workpiece support to a predetermined temperatur... | 1. A workpiece processing system, comprising:
a process chamber; a chamber having one or more surfaces generally enclosing a chamber volume, and wherein the chamber comprises a vacuum port and a purge gas port in fluid communication with the chamber volume, wherein the chamber generally defines a load lock chamber oper... | A system, method, and apparatus for heating a workpiece in chamber provides one or more surfaces generally enclosing a chamber volume. Vacuum and purge gas ports are in in fluid communication with the chamber volume. A heater apparatus selectively heats the workpiece on a workpiece support to a predetermined temperatur... | 2,800 |
12,188 | 12,188 | 15,259,241 | 2,864 | The invention relates to a method of setting a plurality of part regions of a desired protected zone, in which
a) the positions of a plurality of monitoring units are detected, with each monitoring unit detecting a detection zone;
b) a maximum size of each detection zone is determined;
c) the desired protecte... | 1. A method of setting a plurality of part regions of a desired protected zone, in which
a) positions of a plurality of monitoring units are detected, wherein each of the plurality of monitoring units detects a detection zone; b) a maximum size of each detection zone is determined; c) the desired protected zone is fixe... | The invention relates to a method of setting a plurality of part regions of a desired protected zone, in which
a) the positions of a plurality of monitoring units are detected, with each monitoring unit detecting a detection zone;
b) a maximum size of each detection zone is determined;
c) the desired protecte... | 2,800 |
12,189 | 12,189 | 15,909,679 | 2,814 | A method for fabricating a copper pillar. The method includes forming a layer of titanium tungsten (TiW) over a semiconductor wafer, forming a layer of zinc (Zn) over the layer of TiW, and forming a copper pillar over the via. In addition, the method includes performing an anneal to diffuse the layer of Zn into the cop... | 1. A method for fabricating a copper pillar over a semiconductor wafer, comprising:
providing said semiconductor wafer including a via; forming a layer of titanium tungsten (TiW) over said semiconductor wafer; forming a layer of zinc (Zn) over said layer of TiW; forming a patterned photoresist over said layer of Zn, sa... | A method for fabricating a copper pillar. The method includes forming a layer of titanium tungsten (TiW) over a semiconductor wafer, forming a layer of zinc (Zn) over the layer of TiW, and forming a copper pillar over the via. In addition, the method includes performing an anneal to diffuse the layer of Zn into the cop... | 2,800 |
12,190 | 12,190 | 16,604,476 | 2,835 | A heat exchanging arrangement for a subsea electronic system, the heat exchanging arrangement including: at least one pipe having an external surface; and at least one heat exchanging element arranged inside the at least one pipe and defining at least one internal passage for conducting a dielectric fluid through the a... | 1. A exchanging arrangement for a subsea electronic system, the heat exchanging arrangement comprising:
at least one pipe having an external surface; and at least one heat exchanging element, arranged inside the at least one pipe and defining at least one internal passage for conducting a dielectric fluid through the a... | A heat exchanging arrangement for a subsea electronic system, the heat exchanging arrangement including: at least one pipe having an external surface; and at least one heat exchanging element arranged inside the at least one pipe and defining at least one internal passage for conducting a dielectric fluid through the a... | 2,800 |
12,191 | 12,191 | 15,223,099 | 2,829 | Provided are a composite substrate suitable for low-cost manufacture of light emitting devices having a three-dimensional shape such as a curved shape or a concave-convex shape, and a light emitting device having a three-dimensional shape manufactured with such a substrate. The composite substrate of the present invent... | 1. A composite substrate comprising:
a substrate having a surface with a three-dimensional shape, wherein the surface with a three-dimensional shape comprises a layer composed of oriented polycrystalline alumina, or wherein an entirety of the substrate is composed of oriented polycrystalline alumina; and a group 13 ele... | Provided are a composite substrate suitable for low-cost manufacture of light emitting devices having a three-dimensional shape such as a curved shape or a concave-convex shape, and a light emitting device having a three-dimensional shape manufactured with such a substrate. The composite substrate of the present invent... | 2,800 |
12,192 | 12,192 | 14,745,825 | 2,829 | An ungrounded power line sensor system includes a housing configured for coupling about a power line, at least a first voltage sensing plate supported by the housing and exposed to rain and snow, and at least a second voltage sensing plate supported by the housing and shielded from rain and snow. Voltages sensed by the... | 1. An ungrounded power line sensor system comprising:
a housing configured for coupling about a power line; at least a first voltage sensing plate supported by the housing and exposed to rain and snow; at least a second voltage sensing plate supported by the housing and shielded from rain and snow; and a processing sub... | An ungrounded power line sensor system includes a housing configured for coupling about a power line, at least a first voltage sensing plate supported by the housing and exposed to rain and snow, and at least a second voltage sensing plate supported by the housing and shielded from rain and snow. Voltages sensed by the... | 2,800 |
12,193 | 12,193 | 15,910,223 | 2,834 | An electric motor assembly includes a rotor assembly configured to rotate about a central axis and a stator assembly configured to extend about the rotor assembly. The rotor assembly includes at least one of the following: a plurality of spokes and at least one neodymium iron boron magnet. The stator assembly includes ... | 1. An electric motor assembly comprising:
a rotor assembly configured to rotate about a central axis, wherein said rotor assembly includes at least one of the following: a plurality of spokes and at least one neodymium iron boron magnet; and a stator assembly configured to extend about said rotor assembly, said stator ... | An electric motor assembly includes a rotor assembly configured to rotate about a central axis and a stator assembly configured to extend about the rotor assembly. The rotor assembly includes at least one of the following: a plurality of spokes and at least one neodymium iron boron magnet. The stator assembly includes ... | 2,800 |
12,194 | 12,194 | 16,060,545 | 2,845 | The present disclosure provides a low band dipole and a multi-band multi-port antenna arrangement, wherein the low band dipole has four dipole arms, and the four dipole arms are horizontally and mutually perpendicularly placed in a “+” shape and adjacent two mutually perpendicular dipole arms are fed therebetween. The ... | 1. A low band dipole, wherein the low band dipole has four dipole arms, and the four dipole arms are horizontally and mutually perpendicularly placed in a “+” shape, and adjacent two mutually perpendicular dipole arms are fed therebetween. 2. The low band dipole according to claim 1, wherein the feeding mode comprises ... | The present disclosure provides a low band dipole and a multi-band multi-port antenna arrangement, wherein the low band dipole has four dipole arms, and the four dipole arms are horizontally and mutually perpendicularly placed in a “+” shape and adjacent two mutually perpendicular dipole arms are fed therebetween. The ... | 2,800 |
12,195 | 12,195 | 16,142,410 | 2,871 | Provided is a display apparatus including a display panel for displaying an image, a heat source arranged at a side surface of at least one side of the display panel, a heat absorbing section for absorbing heat generated by the heat source, a back surface plate arranged at a back surface side of the display panel and m... | 1. (canceled) 2. A display apparatus comprising:
a display panel for displaying an image; a heat source arranged at a side surface of at least one side of the display panel; a heat absorbing section for absorbing heat generated by the heat source; a back surface plate comprising a metal arranged at a back surface side ... | Provided is a display apparatus including a display panel for displaying an image, a heat source arranged at a side surface of at least one side of the display panel, a heat absorbing section for absorbing heat generated by the heat source, a back surface plate arranged at a back surface side of the display panel and m... | 2,800 |
12,196 | 12,196 | 16,398,277 | 2,892 | In various embodiments a semiconductor device is provided, including a semiconductor body including a drift region and a gate electrode arranged adjacent to the drift region; and a contact structure provided over the drift region of the semiconductor body and having a first metal layer, an adhesion layer over the first... | 1. A semiconductor device, comprising:
a semiconductor body having a front side and a back side opposite to the front side, the semiconductor body comprising a semiconductor layer, a first drift region and a first gate electrode arranged laterally adjacent to the first drift region, wherein the first gate electrode ver... | In various embodiments a semiconductor device is provided, including a semiconductor body including a drift region and a gate electrode arranged adjacent to the drift region; and a contact structure provided over the drift region of the semiconductor body and having a first metal layer, an adhesion layer over the first... | 2,800 |
12,197 | 12,197 | 16,216,169 | 2,892 | A mechanism for preparing a wafer and/or substrate is disclosed. A plurality of mandrel lines are etched via a mandrel mask. The mandrel lines are separated by spaces. Spin-on glass (SOG) is deposited to backfill the spaces between the mandrel lines. A non-mandrel mask is employed to etch spaces from the SOG in between... | 1. A wafer prepared by a process comprising:
etching a plurality of mandrel lines via a mandrel mask, the mandrel lines separated by spaces; depositing spin-on glass (SOG) to backfill the spaces between the mandrel lines; etching, via a non-mandrel mask, the SOG from the spaces between the mandrel lines to create non-m... | A mechanism for preparing a wafer and/or substrate is disclosed. A plurality of mandrel lines are etched via a mandrel mask. The mandrel lines are separated by spaces. Spin-on glass (SOG) is deposited to backfill the spaces between the mandrel lines. A non-mandrel mask is employed to etch spaces from the SOG in between... | 2,800 |
12,198 | 12,198 | 16,056,827 | 2,894 | Curing of a passivation layer applied to the surface of a ferroelectric integrated circuit so as to enhance the polarization characteristics of the ferroelectric structures. A passivation layer, such as a polyimide, is applied to the surface of the ferroelectric integrated circuit after fabrication of the active device... | 1. An integrated circuit, comprising:
at least one circuit element comprising a layer of a ferroelectric material, and disposed near a semiconducting surface of a body; at least one layer of insulating material disposed over the surface and overlying the at least one circuit element; at least one level of conductors di... | Curing of a passivation layer applied to the surface of a ferroelectric integrated circuit so as to enhance the polarization characteristics of the ferroelectric structures. A passivation layer, such as a polyimide, is applied to the surface of the ferroelectric integrated circuit after fabrication of the active device... | 2,800 |
12,199 | 12,199 | 15,648,298 | 2,827 | A SRAM system having an address scheme and/or wire control layout. By preferentially accessing a defined address range mapped to SRAM array blocks located near a controller, significant power savings can be realized. In one embodiment, the address scheme determines a range physically closer to a central control locatio... | 1. A SRAM circuit comprising:
arrays of SRAM bit cells, each capable of storing a bit of information, that together define an address bitmap, each array of the arrays of SRAM bit cells including a sense amplifier and a write driver; peripheral circuitry able to generate selected control, data, and address signals, conn... | A SRAM system having an address scheme and/or wire control layout. By preferentially accessing a defined address range mapped to SRAM array blocks located near a controller, significant power savings can be realized. In one embodiment, the address scheme determines a range physically closer to a central control locatio... | 2,800 |
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