Unnamed: 0 int64 0 350k | level_0 int64 0 351k | ApplicationNumber int64 9.75M 96.1M | ArtUnit int64 1.6k 3.99k | Abstract stringlengths 1 8.37k | Claims stringlengths 3 292k | abstract-claims stringlengths 68 293k | TechCenter int64 1.6k 3.9k |
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12,300 | 12,300 | 16,163,309 | 2,872 | An oscillatory system comprises: a target member; a transducer coupled to the target member; and circuitry for applying a voltage to the transducer for imparting a vibrational force to the target member. | 1. A lens structure system, comprising:
a housing; a plurality of lenses supported by an interior of the housing; a terminal lens coupled to an opening of the housing; a single-segment transducer coupled to the housing and to the terminal lens; a photodetector, positioned to receive light through the plurality of lenses and the terminal lens, for generating image signaling in response to the received light; and circuitry to apply a voltage to the transducer for imparting a vibrational force to the terminal lens. 2. The system of claim 1, wherein imparting the vibrational force comprises imparting standing wave patterns. 3. The system of claim 1, wherein the terminal lens has a resonant frequency within 10 percent of a predetermined frequency, and frequency of the vibrational force is the predetermined frequency. 4. The system of claim 1, wherein the transducer has a resonant frequency within 10 percent of a predetermined frequency, and frequency of the vibrational force is the predetermined frequency. 5. The system of claim 1, wherein the terminal lens comprises a fisheye lens. 6. The system of claim 5, wherein the terminal lens and the plurality of lenses comprise a focusing lens stack through which the light passes. 7. The system of claim 1, wherein the terminal lens comprises a flat lens. 8. The system of claim 1, wherein the terminal lens has a resonant frequency within 10 percent of a predetermined frequency, and the transducer has a resonant frequency within 10 percent of the predetermined frequency. 9. The system of claim 8, wherein frequency of the vibrational force is the predetermined frequency. 10. The system of claim 1, further comprising an adhesive coupling the transducer to the terminal lens. 11. The system of claim 1, wherein the transducer physically abuts at least a portion of the terminal lens. 12. The system of claim 1, wherein in response to the vibrational force, a mode shape of the transducer is directionally aligned with a mode shape of the terminal lens. 13. A lens structure system, comprising:
a housing; a plurality of lenses supported within an interior of the housing; a terminal fisheye lens coupled to an opening of the housing, and having a light receiving portion extending beyond the opening; a transducer coupled to the housing and to the terminal fisheye lens; a photodetector, positioned to receive light through the plurality of lenses and the terminal fisheye lens, for generating image signaling in response to the received light; and circuitry to apply a voltage to the transducer for imparting a vibrational force to the terminal fisheye lens. 14. The system of claim 13, wherein the transducer comprises a plurality of segments, and the circuitry comprises circuitry to apply the voltage to selected ones of the segments. 15. The system of claim 14, wherein imparting the vibrational force comprises imparting standing wave patterns. 16. The system of claim 14, wherein imparting the vibrational force comprises imparting traveling wave patterns. 17. The system of claim 13, wherein the transducer is a single-segment transducer. 18. The system of claim 17, wherein imparting the vibrational force comprises imparting standing wave patterns. 19. The system of claim 13, wherein the terminal fisheye lens has a natural resonant frequency within 10 percent of a predetermined frequency, and frequency of the vibrational force is the predetermined frequency. 20. The system of claim 13, wherein the transducer has a natural resonant frequency within 10 percent of the predetermined frequency, and frequency of the vibrational force is the predetermined frequency. 21. The system of claim 13, wherein the terminal fisheye lens has a natural resonant frequency within 10 percent of a predetermined frequency, and the transducer has a natural resonant frequency within 10 percent of the predetermined frequency. 22. The system of claim 21, wherein frequency of the vibrational force is the predetermined frequency. 23. The system of claim 13, further comprising an adhesive coupling the transducer to the terminal fisheye lens. 24. The system of claim 13, wherein the transducer physically abuts at least a portion of the terminal fisheye lens. 25. The system of claim 13, wherein in response to the vibrational force, a mode shape of the transducer is directionally aligned with a mode shape of the terminal fisheye lens. 26. An oscillatory system, comprising:
a target member having a resonant frequency within 10 percent of a predetermined frequency; a transducer, coupled to the target member, and having a resonant frequency within 10 percent of the predetermined frequency; and circuitry to apply a voltage to the transducer for imparting a vibrational force to the target member. 27. The system of claim 26, further comprising a housing coupled to the transducer. 28. The system of claim 27, wherein the target member is coupled to the housing. 29. The system of claim 26, wherein the target member comprises a lens. 30. The system of claim 26, wherein the target member comprises an underwater communication apparatus. 31. The system of claim 26, wherein the target member comprises a flow meter apparatus. 32. The system of claim 26, wherein the target member comprises an imaging apparatus. 33. The system of claim 26, wherein the target member comprises an ultrasonic imaging apparatus. 34. The system of claim 26, wherein the target member comprises a megasonic imaging apparatus. 35. The system of claim 26, wherein the target member comprises a supersonic imaging apparatus. 36. The system of claim 26, wherein in response to the vibrational force, a mode shape of the transducer is directionally aligned with a mode shape of the target member. 37. The system of claim 26, wherein at least one of a material, a dimension or a shape of the target member corresponds to the resonant frequency of the target member. 38. The system of claim 37, wherein at least one of a material, a dimension or a shape of the transducer corresponds to the resonant frequency of the transducer. | An oscillatory system comprises: a target member; a transducer coupled to the target member; and circuitry for applying a voltage to the transducer for imparting a vibrational force to the target member.1. A lens structure system, comprising:
a housing; a plurality of lenses supported by an interior of the housing; a terminal lens coupled to an opening of the housing; a single-segment transducer coupled to the housing and to the terminal lens; a photodetector, positioned to receive light through the plurality of lenses and the terminal lens, for generating image signaling in response to the received light; and circuitry to apply a voltage to the transducer for imparting a vibrational force to the terminal lens. 2. The system of claim 1, wherein imparting the vibrational force comprises imparting standing wave patterns. 3. The system of claim 1, wherein the terminal lens has a resonant frequency within 10 percent of a predetermined frequency, and frequency of the vibrational force is the predetermined frequency. 4. The system of claim 1, wherein the transducer has a resonant frequency within 10 percent of a predetermined frequency, and frequency of the vibrational force is the predetermined frequency. 5. The system of claim 1, wherein the terminal lens comprises a fisheye lens. 6. The system of claim 5, wherein the terminal lens and the plurality of lenses comprise a focusing lens stack through which the light passes. 7. The system of claim 1, wherein the terminal lens comprises a flat lens. 8. The system of claim 1, wherein the terminal lens has a resonant frequency within 10 percent of a predetermined frequency, and the transducer has a resonant frequency within 10 percent of the predetermined frequency. 9. The system of claim 8, wherein frequency of the vibrational force is the predetermined frequency. 10. The system of claim 1, further comprising an adhesive coupling the transducer to the terminal lens. 11. The system of claim 1, wherein the transducer physically abuts at least a portion of the terminal lens. 12. The system of claim 1, wherein in response to the vibrational force, a mode shape of the transducer is directionally aligned with a mode shape of the terminal lens. 13. A lens structure system, comprising:
a housing; a plurality of lenses supported within an interior of the housing; a terminal fisheye lens coupled to an opening of the housing, and having a light receiving portion extending beyond the opening; a transducer coupled to the housing and to the terminal fisheye lens; a photodetector, positioned to receive light through the plurality of lenses and the terminal fisheye lens, for generating image signaling in response to the received light; and circuitry to apply a voltage to the transducer for imparting a vibrational force to the terminal fisheye lens. 14. The system of claim 13, wherein the transducer comprises a plurality of segments, and the circuitry comprises circuitry to apply the voltage to selected ones of the segments. 15. The system of claim 14, wherein imparting the vibrational force comprises imparting standing wave patterns. 16. The system of claim 14, wherein imparting the vibrational force comprises imparting traveling wave patterns. 17. The system of claim 13, wherein the transducer is a single-segment transducer. 18. The system of claim 17, wherein imparting the vibrational force comprises imparting standing wave patterns. 19. The system of claim 13, wherein the terminal fisheye lens has a natural resonant frequency within 10 percent of a predetermined frequency, and frequency of the vibrational force is the predetermined frequency. 20. The system of claim 13, wherein the transducer has a natural resonant frequency within 10 percent of the predetermined frequency, and frequency of the vibrational force is the predetermined frequency. 21. The system of claim 13, wherein the terminal fisheye lens has a natural resonant frequency within 10 percent of a predetermined frequency, and the transducer has a natural resonant frequency within 10 percent of the predetermined frequency. 22. The system of claim 21, wherein frequency of the vibrational force is the predetermined frequency. 23. The system of claim 13, further comprising an adhesive coupling the transducer to the terminal fisheye lens. 24. The system of claim 13, wherein the transducer physically abuts at least a portion of the terminal fisheye lens. 25. The system of claim 13, wherein in response to the vibrational force, a mode shape of the transducer is directionally aligned with a mode shape of the terminal fisheye lens. 26. An oscillatory system, comprising:
a target member having a resonant frequency within 10 percent of a predetermined frequency; a transducer, coupled to the target member, and having a resonant frequency within 10 percent of the predetermined frequency; and circuitry to apply a voltage to the transducer for imparting a vibrational force to the target member. 27. The system of claim 26, further comprising a housing coupled to the transducer. 28. The system of claim 27, wherein the target member is coupled to the housing. 29. The system of claim 26, wherein the target member comprises a lens. 30. The system of claim 26, wherein the target member comprises an underwater communication apparatus. 31. The system of claim 26, wherein the target member comprises a flow meter apparatus. 32. The system of claim 26, wherein the target member comprises an imaging apparatus. 33. The system of claim 26, wherein the target member comprises an ultrasonic imaging apparatus. 34. The system of claim 26, wherein the target member comprises a megasonic imaging apparatus. 35. The system of claim 26, wherein the target member comprises a supersonic imaging apparatus. 36. The system of claim 26, wherein in response to the vibrational force, a mode shape of the transducer is directionally aligned with a mode shape of the target member. 37. The system of claim 26, wherein at least one of a material, a dimension or a shape of the target member corresponds to the resonant frequency of the target member. 38. The system of claim 37, wherein at least one of a material, a dimension or a shape of the transducer corresponds to the resonant frequency of the transducer. | 2,800 |
12,301 | 12,301 | 16,097,384 | 2,894 | An integrated circuit device is disclosed, the device comprising a protective layer and a protected circuit on a substrate, the protective layer being configured to protect the protected circuit by absorbing laser radiation targeted at the protected circuit through the substrate. The device may be configured such that removal of the protective layer causes physical damage that disables the protected circuit. The device may comprise intermediate circuitry protruding into the substrate between the protective layer and the protected circuit, wherein the physical damage that disables the protected circuit is physical damage to the intermediate circuitry. The device may comprise detection circuitry configured to detect a change in an electrical property of the device indicative of removal of the protective layer, and, in response to detecting the change in the electrical property, cause the protected circuit to be disabled. | 1. An integrated circuit device comprising:
a protective layer; and a protected circuit on a substrate, the protective layer being configured to protect the protected circuit by absorbing laser radiation targeted at the protected circuit through the substrate. 2. An integrated circuit device as claimed in claim 1, the device being configured such that removal of the protective layer causes physical damage that disables the protected circuit. 3. An integrated circuit device as claimed in claim 2, the device comprising intermediate circuitry protruding into the substrate between the protective layer and the protected circuit, wherein the physical damage that disables the protected circuit is physical damage to the intermediate circuitry. 4. An integrated circuit device as claimed in claim 1, the device comprising detection circuitry configured to detect a change in an electrical property of the device indicative of removal of the protective layer, and, in response to detecting the change in the electrical property, cause the protected circuit to be disabled. 5. An integrated circuit device as claimed in claim 4, wherein the electrical property is capacitance. 6. An integrated circuit device as claimed in claim 4, wherein the detection circuitry comprises a DRAM cell or a bipolar transistor. 7. An integrated circuit device as claimed in claim 4, the detection circuitry comprising intermediate detection circuitry protruding into the substrate between the protective layer and the protected circuit. 8. An integrated circuit device as claimed in claim 1, wherein the protective layer comprises a doped semiconductor. 9. An integrated circuit device as claimed in claim 8, wherein the doped semiconductor has a dopant concentration of at least 1019 cm−3, 1020 cm−3, 5×1020 cm−3 or 1021 cm−3. 10. An integrated circuit device as claimed in claim 1, wherein the protective layer has a transmittance of the laser radiation that is less than or equal to 40%, 20%, 15%, 10%, 5%, or 2%. 11. An integrated circuit device as claimed in claim 1, wherein the laser radiation is infra-red radiation. 12. An integrated circuit device as claimed in claim 1, wherein the protective layer is within the substrate. 13. An integrated circuit device as claimed in claim 1, wherein the protective layer has a transmittance of the laser radiation that is less than a transmittance of the laser radiation of the substrate. 14. An integrated circuit device comprising:
a protected circuit on a substrate; and detection circuitry configured to detect a change in an electrical property of the device indicative of removal of material from the substrate, and, in response to detecting the change in the electrical property, cause the protected circuit to be disabled. 15. An integrated circuit device comprising:
a protected circuit on a substrate; and intermediate circuitry protruding into the substrate, the device being configured such that removal of material from the substrate causes physical damage that disables the protected circuit, wherein the physical damage that disables the protected circuit is physical damage to the intermediate circuitry. | An integrated circuit device is disclosed, the device comprising a protective layer and a protected circuit on a substrate, the protective layer being configured to protect the protected circuit by absorbing laser radiation targeted at the protected circuit through the substrate. The device may be configured such that removal of the protective layer causes physical damage that disables the protected circuit. The device may comprise intermediate circuitry protruding into the substrate between the protective layer and the protected circuit, wherein the physical damage that disables the protected circuit is physical damage to the intermediate circuitry. The device may comprise detection circuitry configured to detect a change in an electrical property of the device indicative of removal of the protective layer, and, in response to detecting the change in the electrical property, cause the protected circuit to be disabled.1. An integrated circuit device comprising:
a protective layer; and a protected circuit on a substrate, the protective layer being configured to protect the protected circuit by absorbing laser radiation targeted at the protected circuit through the substrate. 2. An integrated circuit device as claimed in claim 1, the device being configured such that removal of the protective layer causes physical damage that disables the protected circuit. 3. An integrated circuit device as claimed in claim 2, the device comprising intermediate circuitry protruding into the substrate between the protective layer and the protected circuit, wherein the physical damage that disables the protected circuit is physical damage to the intermediate circuitry. 4. An integrated circuit device as claimed in claim 1, the device comprising detection circuitry configured to detect a change in an electrical property of the device indicative of removal of the protective layer, and, in response to detecting the change in the electrical property, cause the protected circuit to be disabled. 5. An integrated circuit device as claimed in claim 4, wherein the electrical property is capacitance. 6. An integrated circuit device as claimed in claim 4, wherein the detection circuitry comprises a DRAM cell or a bipolar transistor. 7. An integrated circuit device as claimed in claim 4, the detection circuitry comprising intermediate detection circuitry protruding into the substrate between the protective layer and the protected circuit. 8. An integrated circuit device as claimed in claim 1, wherein the protective layer comprises a doped semiconductor. 9. An integrated circuit device as claimed in claim 8, wherein the doped semiconductor has a dopant concentration of at least 1019 cm−3, 1020 cm−3, 5×1020 cm−3 or 1021 cm−3. 10. An integrated circuit device as claimed in claim 1, wherein the protective layer has a transmittance of the laser radiation that is less than or equal to 40%, 20%, 15%, 10%, 5%, or 2%. 11. An integrated circuit device as claimed in claim 1, wherein the laser radiation is infra-red radiation. 12. An integrated circuit device as claimed in claim 1, wherein the protective layer is within the substrate. 13. An integrated circuit device as claimed in claim 1, wherein the protective layer has a transmittance of the laser radiation that is less than a transmittance of the laser radiation of the substrate. 14. An integrated circuit device comprising:
a protected circuit on a substrate; and detection circuitry configured to detect a change in an electrical property of the device indicative of removal of material from the substrate, and, in response to detecting the change in the electrical property, cause the protected circuit to be disabled. 15. An integrated circuit device comprising:
a protected circuit on a substrate; and intermediate circuitry protruding into the substrate, the device being configured such that removal of material from the substrate causes physical damage that disables the protected circuit, wherein the physical damage that disables the protected circuit is physical damage to the intermediate circuitry. | 2,800 |
12,302 | 12,302 | 15,665,575 | 2,800 | A first silicon controlled rectifier has a breakdown voltage in a first direction and a breakdown voltage in a second direction. A second silicon controlled rectifier has a breakdown voltage with a higher magnitude than the first silicon controlled rectifier in the first direction, and a breakdown voltage with a lower magnitude than the first silicon controlled rectifier in the second direction. A bidirectional electrostatic discharge (ESD) structure utilizes both the first silicon controlled rectifier and the second silicon controlled rectifier to provide bidirectional protection. | 1. An electrostatic discharge (ESD) device, comprising:
a semiconductor substrate having a surface; first and second wells each extending from the surface, and each having a first conductivity type; first and second source regions in the first and second wells respectively, the first and second source regions each having a second conductivity type opposite of the first conductivity type; a first contact region in the first well and having first conductivity type, the first contact region immediately interposed by the first source region; and a second contact region in the second well and having the first conductivity type, the second contact region immediately interposing into the first source region. 2. The ESD device of claim 1, further comprising:
a drain region extending from the surface and separating the first well from the second well, the drain region having the second conductivity type. 3. The ESD device of claim 2, further comprising:
a first gate structure above the surface and overlapping the first well and the drain region; and a second gate structure above the surface and overlapping the second well and the drain region. 4. The ESD device of claim 3, further comprising:
an isolation structure along the surface and overlapping between the first and second gate structures; and a drain well under the isolation structure and between the first and second wells, the drain well having a higher dopant concentration than the drain region. 5. The ESD device of claim 4, wherein the drain well is closer to the first well than the second well. 6. The ESD device of claim 4, wherein the drain well is closer to the second well than the first well. 7. The ESD device of claim 1, wherein the first well includes:
a first shallow well region directly under the first contact region, and having a first dopant concentration; and a second shallow well region directly under the first source region, and having a second dopant concentration lower than the first dopant concentration. 8. The ESD device of claim 7, wherein the first well includes a native region under the first shallow well region and the second shallow well region, the native region having a third dopant concentration lower than the second dopant concentration. 9. The ESD device of claim 1, wherein the second well includes:
a first shallow well region directly under the second source region, and having a first dopant concentration; and a second shallow well region directly under the second contact region, and having a second dopant concentration lower than the first dopant concentration. 10. The ESD device of claim 9, wherein the second well includes a native region under the first shallow well region and the second shallow well region, the native region having a third dopant concentration lower than the second dopant concentration. 11. An electrostatic discharge (ESD) device, comprising:
a semiconductor substrate having a surface; an n-doped buried region under the surface; first and second p-doped regions extending from the surface to the n-doped buried region; a lateral NPN structure in the first p-doped region along the surface; and a lateral PNP structure in the second p-doped region along the surface. 12. The ESD device of claim 11, further comprising:
an n-doped region extending from the surface to the n-doped buried region, and separating the first p-doped region from the second p-doped region. 13. The ESD device of claim 11, wherein the lateral PNP structure includes:
first and second p+ doped regions each having a having dopant concentration than the first p-doped region; and an n+ doped region interfacing and interposing between the first and second p+ doped regions. 14. The ESD device of claim 13, wherein the first p-doped region includes:
a first shallow p-doped region directly under the first and second p+ doped regions, and having a first dopant concentration; and a second shallow p-doped region directly under the n+ doped region, and having a second dopant concentration lower than the first dopant concentration. 15. The ESD device of claim 14, wherein the first p-doped region includes a native region under the first and second shallow p-doped well regions, the native region having a third dopant concentration lower than the second dopant concentration. 16. The ESD device of claim 11, wherein the lateral NPN structure includes:
first and second n+ doped regions each having a having dopant concentration than the first p-doped region; and an p+ doped region interfacing and interposing between the first and second p+ doped regions. 17. The ESD device of claim 16, wherein the second p-doped region includes:
a first shallow p-doped region directly under the first and second n+ doped regions, and having a first dopant concentration; and a second shallow p-doped region directly under the p+ doped region, and having a second dopant concentration lower than the first dopant concentration. 18. The ESD device of claim 17, wherein the second p-doped region includes a native region under the first and second shallow p-doped well regions, the native region having a third dopant concentration lower than the second dopant concentration. 19. The ESD device of claim 11, further comprising:
an isolation structure along the surface and between the first and second p-doped regions; a gate structure above the surface and overlapping the first p-doped region and the isolation structure. 20. The ESD device of claim 11, further comprising:
an isolation structure along the surface and between the first and second p-doped regions; a gate structure above the surface and overlapping the second p-doped region and the isolation structure. | A first silicon controlled rectifier has a breakdown voltage in a first direction and a breakdown voltage in a second direction. A second silicon controlled rectifier has a breakdown voltage with a higher magnitude than the first silicon controlled rectifier in the first direction, and a breakdown voltage with a lower magnitude than the first silicon controlled rectifier in the second direction. A bidirectional electrostatic discharge (ESD) structure utilizes both the first silicon controlled rectifier and the second silicon controlled rectifier to provide bidirectional protection.1. An electrostatic discharge (ESD) device, comprising:
a semiconductor substrate having a surface; first and second wells each extending from the surface, and each having a first conductivity type; first and second source regions in the first and second wells respectively, the first and second source regions each having a second conductivity type opposite of the first conductivity type; a first contact region in the first well and having first conductivity type, the first contact region immediately interposed by the first source region; and a second contact region in the second well and having the first conductivity type, the second contact region immediately interposing into the first source region. 2. The ESD device of claim 1, further comprising:
a drain region extending from the surface and separating the first well from the second well, the drain region having the second conductivity type. 3. The ESD device of claim 2, further comprising:
a first gate structure above the surface and overlapping the first well and the drain region; and a second gate structure above the surface and overlapping the second well and the drain region. 4. The ESD device of claim 3, further comprising:
an isolation structure along the surface and overlapping between the first and second gate structures; and a drain well under the isolation structure and between the first and second wells, the drain well having a higher dopant concentration than the drain region. 5. The ESD device of claim 4, wherein the drain well is closer to the first well than the second well. 6. The ESD device of claim 4, wherein the drain well is closer to the second well than the first well. 7. The ESD device of claim 1, wherein the first well includes:
a first shallow well region directly under the first contact region, and having a first dopant concentration; and a second shallow well region directly under the first source region, and having a second dopant concentration lower than the first dopant concentration. 8. The ESD device of claim 7, wherein the first well includes a native region under the first shallow well region and the second shallow well region, the native region having a third dopant concentration lower than the second dopant concentration. 9. The ESD device of claim 1, wherein the second well includes:
a first shallow well region directly under the second source region, and having a first dopant concentration; and a second shallow well region directly under the second contact region, and having a second dopant concentration lower than the first dopant concentration. 10. The ESD device of claim 9, wherein the second well includes a native region under the first shallow well region and the second shallow well region, the native region having a third dopant concentration lower than the second dopant concentration. 11. An electrostatic discharge (ESD) device, comprising:
a semiconductor substrate having a surface; an n-doped buried region under the surface; first and second p-doped regions extending from the surface to the n-doped buried region; a lateral NPN structure in the first p-doped region along the surface; and a lateral PNP structure in the second p-doped region along the surface. 12. The ESD device of claim 11, further comprising:
an n-doped region extending from the surface to the n-doped buried region, and separating the first p-doped region from the second p-doped region. 13. The ESD device of claim 11, wherein the lateral PNP structure includes:
first and second p+ doped regions each having a having dopant concentration than the first p-doped region; and an n+ doped region interfacing and interposing between the first and second p+ doped regions. 14. The ESD device of claim 13, wherein the first p-doped region includes:
a first shallow p-doped region directly under the first and second p+ doped regions, and having a first dopant concentration; and a second shallow p-doped region directly under the n+ doped region, and having a second dopant concentration lower than the first dopant concentration. 15. The ESD device of claim 14, wherein the first p-doped region includes a native region under the first and second shallow p-doped well regions, the native region having a third dopant concentration lower than the second dopant concentration. 16. The ESD device of claim 11, wherein the lateral NPN structure includes:
first and second n+ doped regions each having a having dopant concentration than the first p-doped region; and an p+ doped region interfacing and interposing between the first and second p+ doped regions. 17. The ESD device of claim 16, wherein the second p-doped region includes:
a first shallow p-doped region directly under the first and second n+ doped regions, and having a first dopant concentration; and a second shallow p-doped region directly under the p+ doped region, and having a second dopant concentration lower than the first dopant concentration. 18. The ESD device of claim 17, wherein the second p-doped region includes a native region under the first and second shallow p-doped well regions, the native region having a third dopant concentration lower than the second dopant concentration. 19. The ESD device of claim 11, further comprising:
an isolation structure along the surface and between the first and second p-doped regions; a gate structure above the surface and overlapping the first p-doped region and the isolation structure. 20. The ESD device of claim 11, further comprising:
an isolation structure along the surface and between the first and second p-doped regions; a gate structure above the surface and overlapping the second p-doped region and the isolation structure. | 2,800 |
12,303 | 12,303 | 15,164,283 | 2,842 | A comparator includes an input stage having a differential input and an output, wherein the voltage at the output is in response to the voltage at the input. The comparator further includes a current limiter for limiting the current flow through the input stage, wherein the current flow through the input stage is in response to the voltage at the input. | 1. A comparator comprising:
an input stage having a differential input and an output, wherein the voltage at the output is in response to the voltage at the input; and a current limiter for limiting the current flow through the input stage, wherein the current flow through the input stage is in response to the voltage at the input. 2. The comparator of claim 1, wherein the current limiter comprises at least one transistor coupled in series with the input stage, the voltage on the gate of the at least one transistor being responsive to the voltage at the input. 3. The comparator of claim 1, further comprising a power node and a ground node, wherein the input stage and the current limiter are coupled between the power node and the ground node. 4. The comparator of claim 1, further comprising a power node and a ground node, wherein the current limiter includes a first current limiter coupled between the power node and the input stage and a second current limiter coupled between the input stage and the ground node. 5. The comparator of claim 1, wherein the input stage includes:
a first transistor and a second transistor having different channel types and coupled in series, wherein a first input of the differential input is coupled to the gates of the first transistor and the second transistor; and a third transistor and a forth transistor having different channel types and coupled in series, wherein a second input of the differential input is coupled to the gates of the third transistor and the fourth transistor. 6. The comparator of claim 5, wherein the output is a differential output having a first output node and a second output node, the first output node being coupled to one of the drains or sources of the first transistor and the second transistor and wherein the second output node is coupled to one of the drains or sources of the third transistor and the fourth transistor. 7. The comparator of claim 1, further comprising a bias stage, wherein the bias stage sets the current limit of the current limiter. 8. The comparator of claim 7, wherein the bias stage has a common mode voltage input for receiving a common mode voltage and an output to the current limiter wherein the current limit set by the current limiter is in response to the common mode voltage. 9. The comparator of claim 8, wherein the common mode voltage is the arithmetic mean of the voltages of the differential input. 10. The comparator of claim 7, wherein the bias stage includes a first transistor and a second transistor having different channel types coupled in series, and wherein the common mode voltage input is coupled to the gates of the first transistor and the second transistor. 11. The comparator of claim 10, wherein the bias stage further includes a third transistor coupled between the first transistor and a power node and a fourth transistor coupled between the second transistor and a ground node, the gates of the third transistor and the fourth transistor being coupled the current limiter. 12. The comparator of claim 11, wherein the current limiter includes a first current limiter and a second current limiter, wherein the gate of the third transistor is coupled to the first current limiter and the gate of the fourth transistor is coupled to the second current limiter. 13. The comparator of claim 12, wherein:
the first current limiter is a field-effect transistor (FET) wherein the gate of the FET is coupled to the gate of the third transistor; and the second current limiter is a FET wherein the gate of the FET is coupled to the gate of the fourth transistor. 14. The comparator of claim 1, further comprising auto biasing circuitry, the auto biasing circuitry comprising:
a first capacitor having a first node coupled to a first input of the input stage; a second capacitor having a second node coupled to a second input of the input stage; a first switch coupled between a common mode voltage and a second node of the first capacitor; a second switch coupled between the common mode voltage and a second node of the second capacitor; a third switch coupled between a first input of the differential input and the second node of the first capacitor; and a fourth switch coupled between a second input of the differential input and the second node of the second capacitor; wherein the first and second switches open and close together; and wherein the third and fourth switches open and close together. 15. The comparator of claim 14, wherein the output is a differential output and further comprising:
a fifth switch coupled between the first node of the first capacitor and a first node of the differential output; and a sixth switch coupled between the first node of the second capacitor and the second node of the differential output; wherein the fifth and sixth switches open and close with the first switch and the second switch. 16. A comparator comprising:
an input stage comprising:
a first pair of transistors coupled in series between a first node and a second node, a first input coupled to the gates of the first pair of transistors;
a second pair of transistors coupled in series between the first node and the second node, a second input coupled to the gates of the second pair of transistors;
a first output coupled between the first pair of transistors;
a second output coupled between the second pair of transistors;
a first current limiting transistor coupled between the first node and a first voltage potential; and
a second current limiting transistor coupled between the second node and a second voltage potential; and
biasing circuitry coupled to the gates of the first current limiting transistor and the second current limiting transistor, the biasing circuitry for setting the current flow through the first biasing transistor and the second biasing transistor. 17. The comparator of claim 16, wherein the biasing circuitry comprises:
first, second, third, and fourth transistors coupled in series between the first voltage potential and the second voltage potential; and an input node connectable to a common mode voltage; wherein the gate of the first transistor is coupled to the gate of the first current limiting transistor; wherein the input node is coupled to the gates of the second and third transistors; and wherein the gate of the fourth transistor is coupled to the gate of the second current limiting transistor. 18. A comparator comprising:
a first pair of transistors coupled in series between a first node and a second node; a second pair of transistors coupled in series between the first node and the second node; a first output coupled between the first pair of transistors; a second output coupled between the second pair of transistors; a first capacitor having a first node coupled to the gates of the first pair of transistors; a second capacitor having a second node coupled to the gates of the second pair of transistors; a first switch coupled between a common mode voltage and a second node of the first capacitor; a second switch coupled between the common mode voltage and a second node of the second capacitor; a third switch coupled between a first input and the second node of the first capacitor; and a fourth switch coupled between a second input and the second node of the second capacitor; a first current limiting transistor coupled between the first node and a first voltage potential; and a second current limiting transistor coupled between the second node and a second voltage potential; wherein the first and second switches open and close together; and wherein the third and fourth switches open and close together. 19. The comparator of claim 18, further comprising biasing circuitry coupled to the gates of the first current limiting transistor and the second current limiting transistor, the biasing circuitry for setting the current flow through the first current limiting transistor and the second current limiting transistor. 20. The comparator of claim 18, further comprising:
first through fourth transistors coupled in series between the first voltage potential and the second voltage potential; and an input node connectable to a common mode voltage; wherein the gate of the first transistor is coupled to the gate of the first current limiting transistor; wherein the input node is coupled to the gates of the second and third transistors; and wherein the gate of the fourth transistor is coupled to the gate of the second current limiting transistor. | A comparator includes an input stage having a differential input and an output, wherein the voltage at the output is in response to the voltage at the input. The comparator further includes a current limiter for limiting the current flow through the input stage, wherein the current flow through the input stage is in response to the voltage at the input.1. A comparator comprising:
an input stage having a differential input and an output, wherein the voltage at the output is in response to the voltage at the input; and a current limiter for limiting the current flow through the input stage, wherein the current flow through the input stage is in response to the voltage at the input. 2. The comparator of claim 1, wherein the current limiter comprises at least one transistor coupled in series with the input stage, the voltage on the gate of the at least one transistor being responsive to the voltage at the input. 3. The comparator of claim 1, further comprising a power node and a ground node, wherein the input stage and the current limiter are coupled between the power node and the ground node. 4. The comparator of claim 1, further comprising a power node and a ground node, wherein the current limiter includes a first current limiter coupled between the power node and the input stage and a second current limiter coupled between the input stage and the ground node. 5. The comparator of claim 1, wherein the input stage includes:
a first transistor and a second transistor having different channel types and coupled in series, wherein a first input of the differential input is coupled to the gates of the first transistor and the second transistor; and a third transistor and a forth transistor having different channel types and coupled in series, wherein a second input of the differential input is coupled to the gates of the third transistor and the fourth transistor. 6. The comparator of claim 5, wherein the output is a differential output having a first output node and a second output node, the first output node being coupled to one of the drains or sources of the first transistor and the second transistor and wherein the second output node is coupled to one of the drains or sources of the third transistor and the fourth transistor. 7. The comparator of claim 1, further comprising a bias stage, wherein the bias stage sets the current limit of the current limiter. 8. The comparator of claim 7, wherein the bias stage has a common mode voltage input for receiving a common mode voltage and an output to the current limiter wherein the current limit set by the current limiter is in response to the common mode voltage. 9. The comparator of claim 8, wherein the common mode voltage is the arithmetic mean of the voltages of the differential input. 10. The comparator of claim 7, wherein the bias stage includes a first transistor and a second transistor having different channel types coupled in series, and wherein the common mode voltage input is coupled to the gates of the first transistor and the second transistor. 11. The comparator of claim 10, wherein the bias stage further includes a third transistor coupled between the first transistor and a power node and a fourth transistor coupled between the second transistor and a ground node, the gates of the third transistor and the fourth transistor being coupled the current limiter. 12. The comparator of claim 11, wherein the current limiter includes a first current limiter and a second current limiter, wherein the gate of the third transistor is coupled to the first current limiter and the gate of the fourth transistor is coupled to the second current limiter. 13. The comparator of claim 12, wherein:
the first current limiter is a field-effect transistor (FET) wherein the gate of the FET is coupled to the gate of the third transistor; and the second current limiter is a FET wherein the gate of the FET is coupled to the gate of the fourth transistor. 14. The comparator of claim 1, further comprising auto biasing circuitry, the auto biasing circuitry comprising:
a first capacitor having a first node coupled to a first input of the input stage; a second capacitor having a second node coupled to a second input of the input stage; a first switch coupled between a common mode voltage and a second node of the first capacitor; a second switch coupled between the common mode voltage and a second node of the second capacitor; a third switch coupled between a first input of the differential input and the second node of the first capacitor; and a fourth switch coupled between a second input of the differential input and the second node of the second capacitor; wherein the first and second switches open and close together; and wherein the third and fourth switches open and close together. 15. The comparator of claim 14, wherein the output is a differential output and further comprising:
a fifth switch coupled between the first node of the first capacitor and a first node of the differential output; and a sixth switch coupled between the first node of the second capacitor and the second node of the differential output; wherein the fifth and sixth switches open and close with the first switch and the second switch. 16. A comparator comprising:
an input stage comprising:
a first pair of transistors coupled in series between a first node and a second node, a first input coupled to the gates of the first pair of transistors;
a second pair of transistors coupled in series between the first node and the second node, a second input coupled to the gates of the second pair of transistors;
a first output coupled between the first pair of transistors;
a second output coupled between the second pair of transistors;
a first current limiting transistor coupled between the first node and a first voltage potential; and
a second current limiting transistor coupled between the second node and a second voltage potential; and
biasing circuitry coupled to the gates of the first current limiting transistor and the second current limiting transistor, the biasing circuitry for setting the current flow through the first biasing transistor and the second biasing transistor. 17. The comparator of claim 16, wherein the biasing circuitry comprises:
first, second, third, and fourth transistors coupled in series between the first voltage potential and the second voltage potential; and an input node connectable to a common mode voltage; wherein the gate of the first transistor is coupled to the gate of the first current limiting transistor; wherein the input node is coupled to the gates of the second and third transistors; and wherein the gate of the fourth transistor is coupled to the gate of the second current limiting transistor. 18. A comparator comprising:
a first pair of transistors coupled in series between a first node and a second node; a second pair of transistors coupled in series between the first node and the second node; a first output coupled between the first pair of transistors; a second output coupled between the second pair of transistors; a first capacitor having a first node coupled to the gates of the first pair of transistors; a second capacitor having a second node coupled to the gates of the second pair of transistors; a first switch coupled between a common mode voltage and a second node of the first capacitor; a second switch coupled between the common mode voltage and a second node of the second capacitor; a third switch coupled between a first input and the second node of the first capacitor; and a fourth switch coupled between a second input and the second node of the second capacitor; a first current limiting transistor coupled between the first node and a first voltage potential; and a second current limiting transistor coupled between the second node and a second voltage potential; wherein the first and second switches open and close together; and wherein the third and fourth switches open and close together. 19. The comparator of claim 18, further comprising biasing circuitry coupled to the gates of the first current limiting transistor and the second current limiting transistor, the biasing circuitry for setting the current flow through the first current limiting transistor and the second current limiting transistor. 20. The comparator of claim 18, further comprising:
first through fourth transistors coupled in series between the first voltage potential and the second voltage potential; and an input node connectable to a common mode voltage; wherein the gate of the first transistor is coupled to the gate of the first current limiting transistor; wherein the input node is coupled to the gates of the second and third transistors; and wherein the gate of the fourth transistor is coupled to the gate of the second current limiting transistor. | 2,800 |
12,304 | 12,304 | 16,374,720 | 2,829 | An image sensor semiconductor package (package) includes a printed circuit board (PCB) having a first surface and a second surface opposite the first surface. A complementary metal-oxide semiconductor (CMOS) image sensor (CIS) die has a first surface with a photosensitive region and a second surface opposite the first surface of the CIS die. The second surface of the CIS die is coupled with the first surface of the PCB. A transparent cover is coupled over the photosensitive region of the CIS die. An image signal processor (ISP) is embedded within the PCB. One or more electrical couplers electrically couple the CIS die with the PCB. A plurality of electrical contacts on the second surface of the PCB are electrically coupled with the CIS die and with the ISP. The ISP is located between the plurality of electrical contacts of the second surface of the PCB and the CIS die. | 1. An image sensor semiconductor package, comprising:
a printed circuit board (PCB) comprising a first surface and a second surface opposite the first surface; an interposer comprising a first surface and a second surface opposite the first surface of the interposer, the interposer comprising a recess in its second surface; a complementary metal-oxide semiconductor (CMOS) image sensor (CIS) die comprising a first surface comprising a photosensitive region and a second surface opposite the first surface of the CIS die, the second surface of the CIS die coupled with the first surface of the interposer; and an image signal processor (ISP) coupled within the recess of the interposer. 2. The package of claim 1, wherein the interposer further comprises one or more electrical vias passing through the interposer from the first surface of the interposer to the second surface of the interposer. 3. The package of claim 1, further comprising one or more electrical couplers electrically coupling the CIS die with the PCB through the one or more electrical vias of the interposer. 4. The package of claim 1, further comprising a plurality of electrical contacts comprised at the second surface of the PCB and electrically coupled with the CIS die and with the ISP. 5. The package of claim 4, wherein the plurality of electrical contacts comprised at the second surface of the PCB comprise solder bumps. 6. The package of claim 4, wherein the plurality of electrical contacts comprise one of aluminum, gold plating, copper plating, a copper pillar bump, and a gold stud. 7. The package of claim 1, further comprising one or more redistribution layers (RDLs) fanning out one or more electrical contacts of the ISP by electrically coupling the one or more electrical contacts of the ISP with one or more of the plurality of electrical contacts comprised at the second surface of the PCB. 8. The package of claim 1, wherein the ISP is mechanically coupled with the recess through one of an adhesive or a tape. 9. An image sensor semiconductor package, comprising:
a printed circuit board (PCB) comprising a first surface and a second surface opposite the first surface; an interposer comprising a first surface and a second surface opposite the first surface of the interposer, the interposer comprising a recess in its second surface and comprising one or more electrical vias passing through the interposer from the first surface of the interposer to the second surface of the interposer; a complementary metal-oxide semiconductor (CMOS) image sensor (CIS) die comprising a first surface comprising a photosensitive region and a second surface opposite the first surface of the CIS die, the second surface of the CIS die coupled with the first surface of the interposer; an image signal processor (ISP) coupled within the recess of the interposer; and one or more electrical couplers electrically coupling the CIS die with the PCB through the one or more electrical vias of the interposer. 10. The package of claim 9, further comprising a plurality of electrical contacts comprised at the second surface of the PCB and electrically coupled with the CIS die and with the ISP. 11. The package of claim 10, wherein the plurality of electrical contacts comprised at the second surface of the PCB comprise solder bumps. 12. The package of claim 10, wherein the plurality of electrical contacts comprise one of aluminum, gold plating, copper plating, a copper pillar bump, and a gold stud. 13. The package of claim 9, further comprising one or more redistribution layers (RDLs) fanning out one or more electrical contacts of the ISP by electrically coupling the one or more electrical contacts of the ISP with one or more of the plurality of electrical contacts comprised at the second surface of the PCB. 14. The package of claim 9, wherein the ISP is mechanically coupled with the recess through one of an adhesive or a tape. 15. The package of claim 9, wherein the package does not comprise an image signal processor at the second surface of the PCB. 16. A method of forming an image sensor semiconductor package, comprising:
providing an interposer comprising a first surface and a second surface opposite the first surface of the interposer, the second surface of the interposer comprising a recess therein; forming one or more electrical vias through the interposer from the first surface of the interposer to the second surface of the interposer; coupling an image signal processor (ISP) within the recess of the interposer and electrically coupling the ISP with the one or more electrical vias; coupling the interposer with a first surface of a printed circuit board (PCB), the PCB also having a second surface opposite the first surface of the PCB; coupling a complementary metal-oxide semiconductor (CMOS) image sensor (CIS) die with the interposer, the CIS die comprising a first surface comprising a photosensitive region and a second surface opposite the first surface of the CIS die, the second surface of the CIS die coupled with the first surface of the interposer; electrically coupling the CIS die with one or more electrical contacts located at the second surface of the PCB through the one or more electrical vias of the interposer; and electrically coupling the ISP with the CIS die through the one or more electrical vias of the interposer. 17. The method of claim 16, wherein the recess in the interposer is formed through a wet-etching wafer level process. 18. The method of claim 16, wherein the vias are formed through one of drilling and etching. 19. The method of claim 16, further comprising at least partially encapsulating the CIS die in an encapsulant. 20. The method of claim 16, further comprising forming one or more redistribution layers (RDLs) electrically coupling one or more electrical contacts of the ISP with one or more of the plurality of electrical contacts comprised at the second surface of the PCB. | An image sensor semiconductor package (package) includes a printed circuit board (PCB) having a first surface and a second surface opposite the first surface. A complementary metal-oxide semiconductor (CMOS) image sensor (CIS) die has a first surface with a photosensitive region and a second surface opposite the first surface of the CIS die. The second surface of the CIS die is coupled with the first surface of the PCB. A transparent cover is coupled over the photosensitive region of the CIS die. An image signal processor (ISP) is embedded within the PCB. One or more electrical couplers electrically couple the CIS die with the PCB. A plurality of electrical contacts on the second surface of the PCB are electrically coupled with the CIS die and with the ISP. The ISP is located between the plurality of electrical contacts of the second surface of the PCB and the CIS die.1. An image sensor semiconductor package, comprising:
a printed circuit board (PCB) comprising a first surface and a second surface opposite the first surface; an interposer comprising a first surface and a second surface opposite the first surface of the interposer, the interposer comprising a recess in its second surface; a complementary metal-oxide semiconductor (CMOS) image sensor (CIS) die comprising a first surface comprising a photosensitive region and a second surface opposite the first surface of the CIS die, the second surface of the CIS die coupled with the first surface of the interposer; and an image signal processor (ISP) coupled within the recess of the interposer. 2. The package of claim 1, wherein the interposer further comprises one or more electrical vias passing through the interposer from the first surface of the interposer to the second surface of the interposer. 3. The package of claim 1, further comprising one or more electrical couplers electrically coupling the CIS die with the PCB through the one or more electrical vias of the interposer. 4. The package of claim 1, further comprising a plurality of electrical contacts comprised at the second surface of the PCB and electrically coupled with the CIS die and with the ISP. 5. The package of claim 4, wherein the plurality of electrical contacts comprised at the second surface of the PCB comprise solder bumps. 6. The package of claim 4, wherein the plurality of electrical contacts comprise one of aluminum, gold plating, copper plating, a copper pillar bump, and a gold stud. 7. The package of claim 1, further comprising one or more redistribution layers (RDLs) fanning out one or more electrical contacts of the ISP by electrically coupling the one or more electrical contacts of the ISP with one or more of the plurality of electrical contacts comprised at the second surface of the PCB. 8. The package of claim 1, wherein the ISP is mechanically coupled with the recess through one of an adhesive or a tape. 9. An image sensor semiconductor package, comprising:
a printed circuit board (PCB) comprising a first surface and a second surface opposite the first surface; an interposer comprising a first surface and a second surface opposite the first surface of the interposer, the interposer comprising a recess in its second surface and comprising one or more electrical vias passing through the interposer from the first surface of the interposer to the second surface of the interposer; a complementary metal-oxide semiconductor (CMOS) image sensor (CIS) die comprising a first surface comprising a photosensitive region and a second surface opposite the first surface of the CIS die, the second surface of the CIS die coupled with the first surface of the interposer; an image signal processor (ISP) coupled within the recess of the interposer; and one or more electrical couplers electrically coupling the CIS die with the PCB through the one or more electrical vias of the interposer. 10. The package of claim 9, further comprising a plurality of electrical contacts comprised at the second surface of the PCB and electrically coupled with the CIS die and with the ISP. 11. The package of claim 10, wherein the plurality of electrical contacts comprised at the second surface of the PCB comprise solder bumps. 12. The package of claim 10, wherein the plurality of electrical contacts comprise one of aluminum, gold plating, copper plating, a copper pillar bump, and a gold stud. 13. The package of claim 9, further comprising one or more redistribution layers (RDLs) fanning out one or more electrical contacts of the ISP by electrically coupling the one or more electrical contacts of the ISP with one or more of the plurality of electrical contacts comprised at the second surface of the PCB. 14. The package of claim 9, wherein the ISP is mechanically coupled with the recess through one of an adhesive or a tape. 15. The package of claim 9, wherein the package does not comprise an image signal processor at the second surface of the PCB. 16. A method of forming an image sensor semiconductor package, comprising:
providing an interposer comprising a first surface and a second surface opposite the first surface of the interposer, the second surface of the interposer comprising a recess therein; forming one or more electrical vias through the interposer from the first surface of the interposer to the second surface of the interposer; coupling an image signal processor (ISP) within the recess of the interposer and electrically coupling the ISP with the one or more electrical vias; coupling the interposer with a first surface of a printed circuit board (PCB), the PCB also having a second surface opposite the first surface of the PCB; coupling a complementary metal-oxide semiconductor (CMOS) image sensor (CIS) die with the interposer, the CIS die comprising a first surface comprising a photosensitive region and a second surface opposite the first surface of the CIS die, the second surface of the CIS die coupled with the first surface of the interposer; electrically coupling the CIS die with one or more electrical contacts located at the second surface of the PCB through the one or more electrical vias of the interposer; and electrically coupling the ISP with the CIS die through the one or more electrical vias of the interposer. 17. The method of claim 16, wherein the recess in the interposer is formed through a wet-etching wafer level process. 18. The method of claim 16, wherein the vias are formed through one of drilling and etching. 19. The method of claim 16, further comprising at least partially encapsulating the CIS die in an encapsulant. 20. The method of claim 16, further comprising forming one or more redistribution layers (RDLs) electrically coupling one or more electrical contacts of the ISP with one or more of the plurality of electrical contacts comprised at the second surface of the PCB. | 2,800 |
12,305 | 12,305 | 15,803,703 | 2,856 | Disclosed are various embodiments of a monitoring apparatus and a method for obtaining solution sample measurements. The monitoring apparatus may include a hollow body and a top cover to seal the hollow body to provide a waterproof monitoring apparatus. Other embodiments may also include a weighted bottom portion beneath the hollow body and a sensor exposed to the environment to monitor and acquire data from a solution sample. | 1. A monitoring apparatus comprising:
a hollow body; a top cover to seal the hollow body to provide a waterproof monitoring apparatus; a weighted bottom portion beneath the hollow body; and a sensor exposed to an environment to monitor and acquire data from a solution sample. 2. The monitoring apparatus of claim 1, wherein the top cover comprises a solar panel to charge an internal battery placed in the hollow body. 3. The monitoring apparatus of claim 1, further comprising an antenna to transmit data collected from the sensor to a database. 4. The monitoring apparatus of claim 1, further comprising a status indicator on the top cover to provide visual indication of the condition of the environment based on data acquired from the sensor. 5. The monitoring apparatus of claim 4, wherein the sensor detects at least any one of oxygen concentration, pH and temperature of the environment. 6. The monitoring apparatus of claim 5, wherein the sensor collects data at select pre-determined time intervals. 7. The monitoring apparatus of claim 5, wherein the sensor collects data in real-time. 8. The monitoring apparatus of claim 1, wherein the monitoring apparatus further comprises a sensor cleaner located beneath the sensor to wipe a surface of the sensor. 9. The monitoring apparatus of claim 7, wherein the sensor cleaner wipes a surface of the sensor at select pre-determined time intervals. 10. A system for monitoring solution samples, comprising:
a monitoring apparatus comprising:
a hollow body;
a top cover to seal the hollow body to provide a waterproof monitoring apparatus;
a weighted bottom portion beneath the hollow body; and
a sensor exposed to an environment to monitor and acquire data from a solution sample;
a server in wireless communication with the monitoring apparatus to store data transmitted from the sensor;
wherein the server sends an alert to a user when the server detects data collected from the monitoring apparatus is not within a range of pre-determined parameters;
an electronic device connected to a network to access data stored in the server; and one or more device regulating the environment in communication with the monitoring apparatus or the server, such that the device is controlled by the server in response to the data collected from the monitoring apparatus. 11. The system of claim 10, wherein the monitoring apparatus further comprises a status indicator on the top cover to provide visual indication of the condition of the environment based on data acquired from the sensor. 12. The system of claim 10, wherein the monitoring apparatus further comprises a solar panel to charge an internal battery placed in the hollow body. 13. The system of claim 10, wherein the sensor detects at least any one of oxygen concentration, pH and temperature of the environment. 14. The system of claim 13, wherein the sensor collects data at select pre-determined time intervals. 15. The system of claim 10, wherein the sensor collects data in real-time. 16. The system of claim 10, wherein the monitoring apparatus further comprises a sensor cleaner located beneath the sensor to wipe a surface of the sensor at predetermined time intervals. 17. A method of obtaining solution sample measurements comprising:
creating an alert associated with pre-determined parameters for maintaining target environment conditions; collecting data in real time with a monitoring apparatus placed in an environment, wherein the monitoring apparatus comprises:
a hollow body;
a top cover to seal the hollow body to provide a waterproof monitoring apparatus;
a weighted bottom portion beneath the hollow body; and
a sensor exposed to an environment to monitor and acquire data from a solution sample;
storing data obtained from the monitoring apparatus; and sending alert to a user when obtained data from the monitoring apparatus exceeds the pre-determined parameters. 18. The method of claim 17, wherein the sensor detects at least any one of oxygen concentration, pH and temperature of the environment. 19. The method of claim 17, wherein the sensor collects data at select pre-determined time intervals. 20. The method of claim 17, further comprising rotating a sensor wiper around a surface of a sensor at select pre-determined time intervals. | Disclosed are various embodiments of a monitoring apparatus and a method for obtaining solution sample measurements. The monitoring apparatus may include a hollow body and a top cover to seal the hollow body to provide a waterproof monitoring apparatus. Other embodiments may also include a weighted bottom portion beneath the hollow body and a sensor exposed to the environment to monitor and acquire data from a solution sample.1. A monitoring apparatus comprising:
a hollow body; a top cover to seal the hollow body to provide a waterproof monitoring apparatus; a weighted bottom portion beneath the hollow body; and a sensor exposed to an environment to monitor and acquire data from a solution sample. 2. The monitoring apparatus of claim 1, wherein the top cover comprises a solar panel to charge an internal battery placed in the hollow body. 3. The monitoring apparatus of claim 1, further comprising an antenna to transmit data collected from the sensor to a database. 4. The monitoring apparatus of claim 1, further comprising a status indicator on the top cover to provide visual indication of the condition of the environment based on data acquired from the sensor. 5. The monitoring apparatus of claim 4, wherein the sensor detects at least any one of oxygen concentration, pH and temperature of the environment. 6. The monitoring apparatus of claim 5, wherein the sensor collects data at select pre-determined time intervals. 7. The monitoring apparatus of claim 5, wherein the sensor collects data in real-time. 8. The monitoring apparatus of claim 1, wherein the monitoring apparatus further comprises a sensor cleaner located beneath the sensor to wipe a surface of the sensor. 9. The monitoring apparatus of claim 7, wherein the sensor cleaner wipes a surface of the sensor at select pre-determined time intervals. 10. A system for monitoring solution samples, comprising:
a monitoring apparatus comprising:
a hollow body;
a top cover to seal the hollow body to provide a waterproof monitoring apparatus;
a weighted bottom portion beneath the hollow body; and
a sensor exposed to an environment to monitor and acquire data from a solution sample;
a server in wireless communication with the monitoring apparatus to store data transmitted from the sensor;
wherein the server sends an alert to a user when the server detects data collected from the monitoring apparatus is not within a range of pre-determined parameters;
an electronic device connected to a network to access data stored in the server; and one or more device regulating the environment in communication with the monitoring apparatus or the server, such that the device is controlled by the server in response to the data collected from the monitoring apparatus. 11. The system of claim 10, wherein the monitoring apparatus further comprises a status indicator on the top cover to provide visual indication of the condition of the environment based on data acquired from the sensor. 12. The system of claim 10, wherein the monitoring apparatus further comprises a solar panel to charge an internal battery placed in the hollow body. 13. The system of claim 10, wherein the sensor detects at least any one of oxygen concentration, pH and temperature of the environment. 14. The system of claim 13, wherein the sensor collects data at select pre-determined time intervals. 15. The system of claim 10, wherein the sensor collects data in real-time. 16. The system of claim 10, wherein the monitoring apparatus further comprises a sensor cleaner located beneath the sensor to wipe a surface of the sensor at predetermined time intervals. 17. A method of obtaining solution sample measurements comprising:
creating an alert associated with pre-determined parameters for maintaining target environment conditions; collecting data in real time with a monitoring apparatus placed in an environment, wherein the monitoring apparatus comprises:
a hollow body;
a top cover to seal the hollow body to provide a waterproof monitoring apparatus;
a weighted bottom portion beneath the hollow body; and
a sensor exposed to an environment to monitor and acquire data from a solution sample;
storing data obtained from the monitoring apparatus; and sending alert to a user when obtained data from the monitoring apparatus exceeds the pre-determined parameters. 18. The method of claim 17, wherein the sensor detects at least any one of oxygen concentration, pH and temperature of the environment. 19. The method of claim 17, wherein the sensor collects data at select pre-determined time intervals. 20. The method of claim 17, further comprising rotating a sensor wiper around a surface of a sensor at select pre-determined time intervals. | 2,800 |
12,306 | 12,306 | 15,050,459 | 2,894 | An event detection methodology is suitable for detecting an event in a continuous digital data stream, such as a ToM (touch on metal) button press. The methodology includes acquiring successive derivative data samples, and, for each derivative data sample, evaluating if the derivative data sample meets a derivative event rejection condition: if no, evaluating the next derivative data sample; or if yes, performing derivative integration accumulation, and evaluating if the derivative integration accumulation meets an integration event condition. If yes, signal event detection, or if no, evaluate the next derivative data sample and the next derivative integration accumulation. The methodology can further include dissipating the derivative integration accumulation by a leakage factor. The derivative event rejection condition can be a derivative interval, such as ABS D[i]>T_D, where T_D is a derivative event rejection threshold, or TD_L≦ABS D[i]<TD_H, where TD_L and TD_H correspond to a derivative interval. The integration event condition can be ABS I[i]>ABS [T_I], where T_I is an integration event threshold. | 1. An event detection method suitable for detecting an event in a continuous digital data stream, comprising:
acquiring successive derivative data samples; for each derivative data sample, evaluating if the derivative data sample meets a derivative event rejection condition; if no, evaluating the next derivative data sample if yes,
performing derivative integration accumulation; and
evaluating if the derivative integration accumulation meets an integration event condition
if yes, signal event detection
if no, evaluate the next derivative data sample and the next derivative integration accumulation. 2. The method of claim 1, wherein the event detection method is adapted for touch-on-metal (ToM) event detection. 3. The method of claim 1, wherein the derivative event rejection condition corresponds to a derivative interval. 4. The method of claim 1, further comprising, at least after evaluating that the integration event condition is not met, dissipating the derivative integration accumulation by a leakage factor. 5. The method of claim 1, wherein the derivative event rejection condition is: ABS D[i]>T_D, where T_D is a derivative event rejection threshold. 6. The method of claim 1, wherein the derivative event rejection condition is: TD_L≦ABS D[i]<TD_H, where TD_L and TD_H correspond to a derivative interval. 7. The method of claim 1, wherein the integration event condition is: ABS I[i]>ABS [T_I], where T_I is an integration event threshold. | An event detection methodology is suitable for detecting an event in a continuous digital data stream, such as a ToM (touch on metal) button press. The methodology includes acquiring successive derivative data samples, and, for each derivative data sample, evaluating if the derivative data sample meets a derivative event rejection condition: if no, evaluating the next derivative data sample; or if yes, performing derivative integration accumulation, and evaluating if the derivative integration accumulation meets an integration event condition. If yes, signal event detection, or if no, evaluate the next derivative data sample and the next derivative integration accumulation. The methodology can further include dissipating the derivative integration accumulation by a leakage factor. The derivative event rejection condition can be a derivative interval, such as ABS D[i]>T_D, where T_D is a derivative event rejection threshold, or TD_L≦ABS D[i]<TD_H, where TD_L and TD_H correspond to a derivative interval. The integration event condition can be ABS I[i]>ABS [T_I], where T_I is an integration event threshold.1. An event detection method suitable for detecting an event in a continuous digital data stream, comprising:
acquiring successive derivative data samples; for each derivative data sample, evaluating if the derivative data sample meets a derivative event rejection condition; if no, evaluating the next derivative data sample if yes,
performing derivative integration accumulation; and
evaluating if the derivative integration accumulation meets an integration event condition
if yes, signal event detection
if no, evaluate the next derivative data sample and the next derivative integration accumulation. 2. The method of claim 1, wherein the event detection method is adapted for touch-on-metal (ToM) event detection. 3. The method of claim 1, wherein the derivative event rejection condition corresponds to a derivative interval. 4. The method of claim 1, further comprising, at least after evaluating that the integration event condition is not met, dissipating the derivative integration accumulation by a leakage factor. 5. The method of claim 1, wherein the derivative event rejection condition is: ABS D[i]>T_D, where T_D is a derivative event rejection threshold. 6. The method of claim 1, wherein the derivative event rejection condition is: TD_L≦ABS D[i]<TD_H, where TD_L and TD_H correspond to a derivative interval. 7. The method of claim 1, wherein the integration event condition is: ABS I[i]>ABS [T_I], where T_I is an integration event threshold. | 2,800 |
12,307 | 12,307 | 16,318,254 | 2,884 | Methods and devices for detecting incident radiation, such as incident X-rays, gamma-rays, and/or alpha particle radiation are provided. The methods and devices use high purity, high quality single-crystals of inorganic semiconductor compounds, including solid solutions, having the formula AB 2 X 5 , where A represents Tl or In, B represents Sn or Pb, and X represents Br or I, as photoelectric materials. | 1. A method for detecting incident radiation, the method comprising:
exposing a material comprising an inorganic semiconductor having the formula AB2X5, where A represents Tl, In, or a combination thereof, B represents Sn, Pb, or a combination thereof, and X represents Br, I, or a combination thereof, to incident gamma radiation, x-ray radiation, alpha particle radiation, or a combination thereof, wherein the material absorbs the incident radiation and electron-hole pairs are generated in the material; and measuring at least one of the energy or intensity of the absorbed incident radiation by detecting the generated electrons, holes, or both. 2. The method of claim 1, wherein the incident radiation is gamma radiation, x-ray radiation, or a combination thereof. 3. The method of claim 1, wherein A represents Tl. 4. The method of claim 1, wherein A represents In. 5. The method of claim 1, wherein B represents Sn. 6. The method of claim 1, wherein B represents Pb. 7. The method of claim 1, wherein X represents Br. 8. The method of claim 1, wherein X represents I. 9. The method of claim 1, wherein the inorganic semiconductor has the formula TlSn2I5. 10. The method of claim 1, wherein the inorganic semiconductor has a bandgap of at least 2 eV and an electrical resistivity of at least 1011 Ω·cm at 23° C. 11. The method of claim 1, wherein the method is carried out at temperatures in the range from about 20° C. to about 26° C. 12. A device for the detection of incident radiation comprising:
a material comprising an inorganic semiconductor having the formula AB2X5 or solid solution having the formula AB2X5, where A represents Tl, In, or a combination thereof, B represents Sn, Pb, or a combination thereof, and X represents Br, I, or a combination thereof; a first electrode in electrical communication with the material; a second electrode in electrical communication with the material, wherein the first and second electrodes are configured to apply an electric field across the material; and a detector configured to measure a signal generated by electron-hole pairs that are formed when the material is exposed to incident gamma radiation, x-ray radiation, alpha particle radiation, or a combination thereof. 13. The device of claim 12, wherein the incident radiation is gamma radiation, x-ray radiation, or a combination thereof. 14. The device of claim 12, wherein A represents Tl. 15. The device of claim 12, wherein A represents In. 16. The device of claim 12, wherein B represents Sn. 17. The device of claim 12, wherein B represents Pb. 18. The device of claim 12, wherein X represents Br. 19. The device of claim 12, wherein X represents I. 20. The device of claim 12, wherein the inorganic semiconductor is TlSn2I5. | Methods and devices for detecting incident radiation, such as incident X-rays, gamma-rays, and/or alpha particle radiation are provided. The methods and devices use high purity, high quality single-crystals of inorganic semiconductor compounds, including solid solutions, having the formula AB 2 X 5 , where A represents Tl or In, B represents Sn or Pb, and X represents Br or I, as photoelectric materials.1. A method for detecting incident radiation, the method comprising:
exposing a material comprising an inorganic semiconductor having the formula AB2X5, where A represents Tl, In, or a combination thereof, B represents Sn, Pb, or a combination thereof, and X represents Br, I, or a combination thereof, to incident gamma radiation, x-ray radiation, alpha particle radiation, or a combination thereof, wherein the material absorbs the incident radiation and electron-hole pairs are generated in the material; and measuring at least one of the energy or intensity of the absorbed incident radiation by detecting the generated electrons, holes, or both. 2. The method of claim 1, wherein the incident radiation is gamma radiation, x-ray radiation, or a combination thereof. 3. The method of claim 1, wherein A represents Tl. 4. The method of claim 1, wherein A represents In. 5. The method of claim 1, wherein B represents Sn. 6. The method of claim 1, wherein B represents Pb. 7. The method of claim 1, wherein X represents Br. 8. The method of claim 1, wherein X represents I. 9. The method of claim 1, wherein the inorganic semiconductor has the formula TlSn2I5. 10. The method of claim 1, wherein the inorganic semiconductor has a bandgap of at least 2 eV and an electrical resistivity of at least 1011 Ω·cm at 23° C. 11. The method of claim 1, wherein the method is carried out at temperatures in the range from about 20° C. to about 26° C. 12. A device for the detection of incident radiation comprising:
a material comprising an inorganic semiconductor having the formula AB2X5 or solid solution having the formula AB2X5, where A represents Tl, In, or a combination thereof, B represents Sn, Pb, or a combination thereof, and X represents Br, I, or a combination thereof; a first electrode in electrical communication with the material; a second electrode in electrical communication with the material, wherein the first and second electrodes are configured to apply an electric field across the material; and a detector configured to measure a signal generated by electron-hole pairs that are formed when the material is exposed to incident gamma radiation, x-ray radiation, alpha particle radiation, or a combination thereof. 13. The device of claim 12, wherein the incident radiation is gamma radiation, x-ray radiation, or a combination thereof. 14. The device of claim 12, wherein A represents Tl. 15. The device of claim 12, wherein A represents In. 16. The device of claim 12, wherein B represents Sn. 17. The device of claim 12, wherein B represents Pb. 18. The device of claim 12, wherein X represents Br. 19. The device of claim 12, wherein X represents I. 20. The device of claim 12, wherein the inorganic semiconductor is TlSn2I5. | 2,800 |
12,308 | 12,308 | 15,150,950 | 2,853 | An apparatus, system and method for estimating power spectral density (PSD). A processing apparatus and a test system are operatively coupled where a random signal generator produces a source signal comprising known statistical properties, and a first converter converts the source signal to a power spectral density (PSD) representation. The test system receives the source signal and produce an output signal, where a second converter converts the output signal to a second PSD representation, and an estimator estimates a magnitude-squared frequency response function (MSFRF) of the output signal and source signal. A weighting module may weight an estimation error factor based on at least one of a quality of the estimate and a user preference, and a removal module, removes a portion of the estimation error from the output signal PSD. | 1. A system for estimating power spectral density (PSD), comprising:
a processing apparatus, comprising a random signal generator for producing a source signal comprising known statistical properties, and a first converter configured to convert the source signal to a power spectral density (PSD) representation; and a test system, operatively coupled to the processing apparatus, the test system configured to receive the source signal and produce an output signal, wherein the processing apparatus further comprises
a second converter configured to convert the output signal to a second PSD representation,
an estimator configured to estimate a magnitude-squared frequency response function (MSFRF) of output signal and source signal,
a weighting module, configured to weight an estimation error factor based on at least one of a quality of the estimate and a user preference, and
a removal module, to remove a portion of the estimation error from the output signal PSD. 2. The system for estimating PSD as in claim 1, wherein the estimator comprises a magnitude-square of a transmissibility calculation. 3. The system for estimating PSD as in claim 1, wherein the estimator consists of a magnitude-square of an H1 transfer function calculation. 4. The system for estimating PSD as in claim 1, wherein the estimator consists of a magnitude-square of an H2 transfer function calculation. 5. The system for estimating PSD as in claim 1, wherein the estimator consists of a magnitude-square of an Hs transfer function calculation. 6. The system for estimating PSD as in claim 1, wherein the estimator consists of a magnitude-square of an Hv transfer function calculation. 7. A processor-based method for estimating the magnitude-square frequency response function, comprising:
estimating, via a first estimator, a magnitude-squared coherence estimate; compensating, via a first bias correction, the magnitude-squared coherence estimate for bias; limiting, via a limiter, the bias-corrected magnitude-squared coherence (MSC) estimate to values, between 0 and 1; estimating, via a second estimator, a magnitude-squared transmissibility function; compensating, via a second bias correction, the magnitude-squared transmissibility function for bias; and multiplying, via a multiplication operator, the bias-corrected MSC estimate with the bias-corrected magnitude-squared transmissibility calculation, for providing an improved H1 MSFRF. | An apparatus, system and method for estimating power spectral density (PSD). A processing apparatus and a test system are operatively coupled where a random signal generator produces a source signal comprising known statistical properties, and a first converter converts the source signal to a power spectral density (PSD) representation. The test system receives the source signal and produce an output signal, where a second converter converts the output signal to a second PSD representation, and an estimator estimates a magnitude-squared frequency response function (MSFRF) of the output signal and source signal. A weighting module may weight an estimation error factor based on at least one of a quality of the estimate and a user preference, and a removal module, removes a portion of the estimation error from the output signal PSD.1. A system for estimating power spectral density (PSD), comprising:
a processing apparatus, comprising a random signal generator for producing a source signal comprising known statistical properties, and a first converter configured to convert the source signal to a power spectral density (PSD) representation; and a test system, operatively coupled to the processing apparatus, the test system configured to receive the source signal and produce an output signal, wherein the processing apparatus further comprises
a second converter configured to convert the output signal to a second PSD representation,
an estimator configured to estimate a magnitude-squared frequency response function (MSFRF) of output signal and source signal,
a weighting module, configured to weight an estimation error factor based on at least one of a quality of the estimate and a user preference, and
a removal module, to remove a portion of the estimation error from the output signal PSD. 2. The system for estimating PSD as in claim 1, wherein the estimator comprises a magnitude-square of a transmissibility calculation. 3. The system for estimating PSD as in claim 1, wherein the estimator consists of a magnitude-square of an H1 transfer function calculation. 4. The system for estimating PSD as in claim 1, wherein the estimator consists of a magnitude-square of an H2 transfer function calculation. 5. The system for estimating PSD as in claim 1, wherein the estimator consists of a magnitude-square of an Hs transfer function calculation. 6. The system for estimating PSD as in claim 1, wherein the estimator consists of a magnitude-square of an Hv transfer function calculation. 7. A processor-based method for estimating the magnitude-square frequency response function, comprising:
estimating, via a first estimator, a magnitude-squared coherence estimate; compensating, via a first bias correction, the magnitude-squared coherence estimate for bias; limiting, via a limiter, the bias-corrected magnitude-squared coherence (MSC) estimate to values, between 0 and 1; estimating, via a second estimator, a magnitude-squared transmissibility function; compensating, via a second bias correction, the magnitude-squared transmissibility function for bias; and multiplying, via a multiplication operator, the bias-corrected MSC estimate with the bias-corrected magnitude-squared transmissibility calculation, for providing an improved H1 MSFRF. | 2,800 |
12,309 | 12,309 | 15,941,293 | 2,884 | A prescribing user can designate and prioritize clinical goals that can, in turn, serve as the basis for optimization objectives to guide the development of a radiation treatment plan. The prescribing user can then alter that prioritization of one or more clinical goals and view information regarding changes to fluence-based dose distributions that occur in response to those changes to relative prioritization amongst the clinical goals to thereby understand dosing tradeoffs that correspond to prioritization amongst the clinical goals. | 1. A method for formulating patient treatment prescription instructions for radiation therapy, which prescribed treatment instructions are configured for use to determine corresponding radiation treatment plan optimization objectives for creation of an optimized radiation treatment plan, the method comprising:
providing a user interface; presenting on the user interface a plurality of radiation-treatment clinical goals having an initial-state relative priority amongst themselves; determining a first fluence-based radiation dose distribution for a patient as a function of the plurality of radiation-treatment clinical goals and the initial-state relative priority amongst the plurality of radiation-treatment clinical goals and presenting information regarding the first fluence-based radiation dose distribution for the patient; automatically saving, as a corresponding first state, information regarding the relative priority amongst the plurality of radiation-treatment clinical goals and the corresponding first fluence-based radiation dose distribution for the patient; in response to changing, via the user interface, the relative priority amongst the plurality of radiation-treatment clinical goals, dynamically determining a second fluence-based radiation dose distribution for the patient as a function of the plurality of radiation-treatment clinical goals and the changed relative priority amongst the plurality of radiation-treatment clinical goals and presenting information regarding the second fluence-based radiation dose distribution for the patient; automatically saving, as a corresponding second state, information regarding the changed relative priority amongst the plurality of radiation-treatment clinical goals and the corresponding second fluence-based radiation dose distribution for the particular patient; displaying, on the user interface, visual information regarding changes to fluence-based dose distribution information that occur in response to changes to relative prioritization amongst the plurality of radiation-treatment clinical goals to thereby illustrate dosing tradeoffs that correspond to prioritization amongst the radiation-treatment clinical goals. 2. The method of claim 1 wherein presenting on the user interface the plurality of radiation-treatment clinical goals having a relative priority amongst themselves comprises presenting the radiation-treatment clinical goals in an order of presentation, wherein a relative position of a particular one of the radiation-treatment clinical goals establishes the relative priority for that particular one of the radiation-treatment clinical goals. 3. The method of claim 2 further comprising:
selectively changing, via the user interface, the relative priority amongst the plurality of radiation-treatment clinical goals. 4. The method of claim 3 wherein the selectively changing the relative priority amongst the plurality of radiation-treatment clinical goals comprises selecting and moving, on the user interface, the relative position of at least one of the radiation-treatment clinical goals. 5. The method of claim 4 wherein the selecting and moving comprises clicking-and-dragging one of the plurality of radiation-treatment clinical goals. 6. The method of claim 1 further comprising:
switching back and forth between a display of information corresponding to the first state and the second state on the user interface. 7. The method of claim 1 further comprising:
canceling, via the user interface, all changes to the relative priority and, in response thereto, presenting the plurality of radiation-treatment clinical goals using the initial-state relative priority amongst themselves along with the information regarding the first fluence-based radiation dose distribution for the patient. 8. The method of claim 1 wherein automatically saving, as a corresponding state, information regarding the corresponding fluence-based radiation dose distribution for the patient comprises storing fluence information but not corresponding calculated dose distribution results. 9. The method of claim 1 wherein at least one of the plurality of radiation-treatment clinical goals constitutes a goal for a treatment volume and at least one of the plurality of radiation-treatment clinical goals constitutes a goal for an organ-at-risk. 10. The method of claim 1 further comprising:
protecting, via the user interface, an achieved fluence-based radiation dose distribution that corresponds to one of the plurality of radiation-treatment clinical goals notwithstanding subsequent changes to the relative priority amongst the plurality of radiation-treatment clinical goals. 11. A method for formulating patient treatment instructions for radiation therapy, which prescribed treatment instructions are configured for use to determine corresponding radiation treatment plan optimization objectives for creation of an optimized radiation treatment plan using automatically-iterated radiation treatment plan optimization, the method comprising:
providing a user interface; presenting on the user interface a plurality of radiation-treatment clinical goals having an initial-state relative priority amongst themselves; obtaining a first set of rules that define a fluence-based radiation dose distribution as a function of the plurality of radiation-treatment clinical goals and the relative priority amongst the plurality of radiation-treatment clinical goals; obtaining a second set of rules that specify automatically saving, as corresponding states, information regarding relative priorities amongst the plurality of radiation-treatment clinical goals and corresponding fluence-based radiation dose distributions as a function of detecting changes to the relative priorities amongst the plurality of radiation-treatment clinical goals; generating a first fluence-based radiation dose distribution for the patient by evaluating the plurality of radiation-treatment clinical goals and the relative priority amongst the plurality of radiation-treatment clinical goals against the first set of rules; presenting information regarding the first fluence-based radiation dose distribution for the patient; automatically saving, as a corresponding first state, information regarding the relative priority amongst the plurality of radiation-treatment clinical goals and the corresponding first fluence-based radiation dose distribution for the patient; in response to changing, via the user interface, the relative priority amongst the plurality of radiation-treatment clinical goals, generating a second fluence-based radiation dose distribution for the patient by evaluating the plurality of radiation-treatment clinical goals and the changed relative priority amongst the plurality of radiation-treatment clinical goals against the first set of rules; presenting information regarding the second fluence-based radiation dose distribution for the patient; using the second set of rules to automatically save, as a corresponding second state, information regarding the changed relative priority amongst the plurality of radiation-treatment clinical goals and the corresponding second fluence-based radiation dose distribution for the patient; displaying visual information regarding changes to fluence-based dose distribution information that occur in response to changes to relative prioritization amongst the plurality of radiation-treatment clinical goals to thereby illustrate dosing tradeoffs that correspond to prioritization amongst the radiation-treatment clinical goals. 12. The method of claim 11 wherein presenting on the user interface the plurality of radiation-treatment clinical goals having a relative priority amongst themselves comprises presenting the radiation-treatment clinical goals in an order of presentation, wherein a relative position of a particular one of the radiation-treatment clinical goals establishes the relative priority for that particular one of the radiation-treatment clinical goals. 13. The method of claim 12 further comprising:
selectively changing the relative priority amongst the plurality of radiation-treatment clinical goals. 14. The method of claim 13 selectively changing the relative priority amongst the plurality of radiation-treatment clinical goals comprises selecting and moving, on the user interface, the relative position of at least one of the radiation-treatment clinical goals. 15. The method of claim 14 wherein selecting and moving comprises clicking-and-dragging a particular one of the radiation-treatment clinical goals. 16. The method of claim 11 further comprising:
switching back and forth between a display of information corresponding to the first state and a display of the second state. 17. The method of claim 11 further comprising:
cancelling all changes to the relative priority and, in response thereto, presenting the plurality of radiation-treatment clinical goals using the initial-state relative priority amongst themselves along with the information regarding the first fluence-based radiation dose distribution for the patient. 18. The method of claim 11 wherein automatically saving, as a corresponding state, information regarding the corresponding fluence-based radiation dose distribution for the patient comprises storing fluence information but not corresponding calculated dose distribution results. 19. The method of claim 11 wherein at least one of the plurality of radiation-treatment clinical goals constitutes a goal for a treatment volume and at least one of the plurality of radiation-treatment clinical goals constitutes a goal for an organ-at-risk. 20. An apparatus for formulating patient treatment prescription instructions for radiation therapy, which treatment prescription instructions are configured for use to determine corresponding radiation treatment plan optimization objectives for creation of an optimized radiation treatment plan, the apparatus comprising:
a user interface; a control unit operably coupled to the user interface and configured to:
present on the user interface a plurality of radiation-treatment clinical goals having an initial-state relative priority amongst themselves;
determine a first fluence-based radiation dose distribution for the patient as a function of the plurality of radiation-treatment clinical goals and the relative priority amongst the plurality of radiation-treatment clinical goals and present information regarding the first fluence-based radiation dose distribution for the patient;
automatically save, as a corresponding first state, information regarding the relative priority amongst the plurality of radiation-treatment clinical goals and the corresponding first fluence-based radiation dose distribution for the patient;
dynamically determine a second fluence-based radiation dose distribution for the patient as a function of the plurality of radiation-treatment clinical goals and a changed relative priority amongst the plurality of radiation-treatment clinical goals and present information regarding the second fluence-based radiation dose distribution for the patient;
automatically save, as a corresponding second state, information regarding the changed relative priority amongst the plurality of radiation-treatment clinical goals and the corresponding second fluence-based radiation dose distribution for the patient;
display visual information regarding a change to fluence-based dose distribution information that occur in response to the changes to relative prioritization amongst the plurality of radiation-treatment clinical goals to thereby illustrate dosing tradeoffs that correspond to prioritization amongst the radiation-treatment clinical goals. | A prescribing user can designate and prioritize clinical goals that can, in turn, serve as the basis for optimization objectives to guide the development of a radiation treatment plan. The prescribing user can then alter that prioritization of one or more clinical goals and view information regarding changes to fluence-based dose distributions that occur in response to those changes to relative prioritization amongst the clinical goals to thereby understand dosing tradeoffs that correspond to prioritization amongst the clinical goals.1. A method for formulating patient treatment prescription instructions for radiation therapy, which prescribed treatment instructions are configured for use to determine corresponding radiation treatment plan optimization objectives for creation of an optimized radiation treatment plan, the method comprising:
providing a user interface; presenting on the user interface a plurality of radiation-treatment clinical goals having an initial-state relative priority amongst themselves; determining a first fluence-based radiation dose distribution for a patient as a function of the plurality of radiation-treatment clinical goals and the initial-state relative priority amongst the plurality of radiation-treatment clinical goals and presenting information regarding the first fluence-based radiation dose distribution for the patient; automatically saving, as a corresponding first state, information regarding the relative priority amongst the plurality of radiation-treatment clinical goals and the corresponding first fluence-based radiation dose distribution for the patient; in response to changing, via the user interface, the relative priority amongst the plurality of radiation-treatment clinical goals, dynamically determining a second fluence-based radiation dose distribution for the patient as a function of the plurality of radiation-treatment clinical goals and the changed relative priority amongst the plurality of radiation-treatment clinical goals and presenting information regarding the second fluence-based radiation dose distribution for the patient; automatically saving, as a corresponding second state, information regarding the changed relative priority amongst the plurality of radiation-treatment clinical goals and the corresponding second fluence-based radiation dose distribution for the particular patient; displaying, on the user interface, visual information regarding changes to fluence-based dose distribution information that occur in response to changes to relative prioritization amongst the plurality of radiation-treatment clinical goals to thereby illustrate dosing tradeoffs that correspond to prioritization amongst the radiation-treatment clinical goals. 2. The method of claim 1 wherein presenting on the user interface the plurality of radiation-treatment clinical goals having a relative priority amongst themselves comprises presenting the radiation-treatment clinical goals in an order of presentation, wherein a relative position of a particular one of the radiation-treatment clinical goals establishes the relative priority for that particular one of the radiation-treatment clinical goals. 3. The method of claim 2 further comprising:
selectively changing, via the user interface, the relative priority amongst the plurality of radiation-treatment clinical goals. 4. The method of claim 3 wherein the selectively changing the relative priority amongst the plurality of radiation-treatment clinical goals comprises selecting and moving, on the user interface, the relative position of at least one of the radiation-treatment clinical goals. 5. The method of claim 4 wherein the selecting and moving comprises clicking-and-dragging one of the plurality of radiation-treatment clinical goals. 6. The method of claim 1 further comprising:
switching back and forth between a display of information corresponding to the first state and the second state on the user interface. 7. The method of claim 1 further comprising:
canceling, via the user interface, all changes to the relative priority and, in response thereto, presenting the plurality of radiation-treatment clinical goals using the initial-state relative priority amongst themselves along with the information regarding the first fluence-based radiation dose distribution for the patient. 8. The method of claim 1 wherein automatically saving, as a corresponding state, information regarding the corresponding fluence-based radiation dose distribution for the patient comprises storing fluence information but not corresponding calculated dose distribution results. 9. The method of claim 1 wherein at least one of the plurality of radiation-treatment clinical goals constitutes a goal for a treatment volume and at least one of the plurality of radiation-treatment clinical goals constitutes a goal for an organ-at-risk. 10. The method of claim 1 further comprising:
protecting, via the user interface, an achieved fluence-based radiation dose distribution that corresponds to one of the plurality of radiation-treatment clinical goals notwithstanding subsequent changes to the relative priority amongst the plurality of radiation-treatment clinical goals. 11. A method for formulating patient treatment instructions for radiation therapy, which prescribed treatment instructions are configured for use to determine corresponding radiation treatment plan optimization objectives for creation of an optimized radiation treatment plan using automatically-iterated radiation treatment plan optimization, the method comprising:
providing a user interface; presenting on the user interface a plurality of radiation-treatment clinical goals having an initial-state relative priority amongst themselves; obtaining a first set of rules that define a fluence-based radiation dose distribution as a function of the plurality of radiation-treatment clinical goals and the relative priority amongst the plurality of radiation-treatment clinical goals; obtaining a second set of rules that specify automatically saving, as corresponding states, information regarding relative priorities amongst the plurality of radiation-treatment clinical goals and corresponding fluence-based radiation dose distributions as a function of detecting changes to the relative priorities amongst the plurality of radiation-treatment clinical goals; generating a first fluence-based radiation dose distribution for the patient by evaluating the plurality of radiation-treatment clinical goals and the relative priority amongst the plurality of radiation-treatment clinical goals against the first set of rules; presenting information regarding the first fluence-based radiation dose distribution for the patient; automatically saving, as a corresponding first state, information regarding the relative priority amongst the plurality of radiation-treatment clinical goals and the corresponding first fluence-based radiation dose distribution for the patient; in response to changing, via the user interface, the relative priority amongst the plurality of radiation-treatment clinical goals, generating a second fluence-based radiation dose distribution for the patient by evaluating the plurality of radiation-treatment clinical goals and the changed relative priority amongst the plurality of radiation-treatment clinical goals against the first set of rules; presenting information regarding the second fluence-based radiation dose distribution for the patient; using the second set of rules to automatically save, as a corresponding second state, information regarding the changed relative priority amongst the plurality of radiation-treatment clinical goals and the corresponding second fluence-based radiation dose distribution for the patient; displaying visual information regarding changes to fluence-based dose distribution information that occur in response to changes to relative prioritization amongst the plurality of radiation-treatment clinical goals to thereby illustrate dosing tradeoffs that correspond to prioritization amongst the radiation-treatment clinical goals. 12. The method of claim 11 wherein presenting on the user interface the plurality of radiation-treatment clinical goals having a relative priority amongst themselves comprises presenting the radiation-treatment clinical goals in an order of presentation, wherein a relative position of a particular one of the radiation-treatment clinical goals establishes the relative priority for that particular one of the radiation-treatment clinical goals. 13. The method of claim 12 further comprising:
selectively changing the relative priority amongst the plurality of radiation-treatment clinical goals. 14. The method of claim 13 selectively changing the relative priority amongst the plurality of radiation-treatment clinical goals comprises selecting and moving, on the user interface, the relative position of at least one of the radiation-treatment clinical goals. 15. The method of claim 14 wherein selecting and moving comprises clicking-and-dragging a particular one of the radiation-treatment clinical goals. 16. The method of claim 11 further comprising:
switching back and forth between a display of information corresponding to the first state and a display of the second state. 17. The method of claim 11 further comprising:
cancelling all changes to the relative priority and, in response thereto, presenting the plurality of radiation-treatment clinical goals using the initial-state relative priority amongst themselves along with the information regarding the first fluence-based radiation dose distribution for the patient. 18. The method of claim 11 wherein automatically saving, as a corresponding state, information regarding the corresponding fluence-based radiation dose distribution for the patient comprises storing fluence information but not corresponding calculated dose distribution results. 19. The method of claim 11 wherein at least one of the plurality of radiation-treatment clinical goals constitutes a goal for a treatment volume and at least one of the plurality of radiation-treatment clinical goals constitutes a goal for an organ-at-risk. 20. An apparatus for formulating patient treatment prescription instructions for radiation therapy, which treatment prescription instructions are configured for use to determine corresponding radiation treatment plan optimization objectives for creation of an optimized radiation treatment plan, the apparatus comprising:
a user interface; a control unit operably coupled to the user interface and configured to:
present on the user interface a plurality of radiation-treatment clinical goals having an initial-state relative priority amongst themselves;
determine a first fluence-based radiation dose distribution for the patient as a function of the plurality of radiation-treatment clinical goals and the relative priority amongst the plurality of radiation-treatment clinical goals and present information regarding the first fluence-based radiation dose distribution for the patient;
automatically save, as a corresponding first state, information regarding the relative priority amongst the plurality of radiation-treatment clinical goals and the corresponding first fluence-based radiation dose distribution for the patient;
dynamically determine a second fluence-based radiation dose distribution for the patient as a function of the plurality of radiation-treatment clinical goals and a changed relative priority amongst the plurality of radiation-treatment clinical goals and present information regarding the second fluence-based radiation dose distribution for the patient;
automatically save, as a corresponding second state, information regarding the changed relative priority amongst the plurality of radiation-treatment clinical goals and the corresponding second fluence-based radiation dose distribution for the patient;
display visual information regarding a change to fluence-based dose distribution information that occur in response to the changes to relative prioritization amongst the plurality of radiation-treatment clinical goals to thereby illustrate dosing tradeoffs that correspond to prioritization amongst the radiation-treatment clinical goals. | 2,800 |
12,310 | 12,310 | 16,633,222 | 2,875 | A luminaire (10) is disclosed comprising a housing (20) delimiting a light exit window (25) and comprising a reflective inner surface (23) facing the light exit window, an elongate light guide (30) mounted in the housing and partially covering the light exit window by extending in an elongation direction across a central region (26) of the light exit window, the elongate light guide comprising a first major surface (31) facing the reflective inner surface, a second major surface (33) opposite the first major surface, plurality of light outcoupling structures (37) proximal to the second major surface arranged to redirect light onto the reflective inner surface through the first major surface; and a pair of opposing side surfaces (35) in said elongation direction extending between the first major surface and the second major surface. The luminaire further comprises at least one light source (41) arranged to couple light into the light guide via one of said opposing side surfaces (35). | 1. A luminaire comprising:
a housing delimiting a light exit window and comprising a reflective inner surface facing the light exit window; an elongate light guide mounted in the housing and partially covering the light exit window by extending in an elongation direction across a central region of the light exit window, the elongate light guide comprising: a first major surface facing the reflective inner surface; a second major surface opposite the first major surface; a plurality of light outcoupling structures proximal to the second major surface arranged to redirect light onto the reflective inner surface through the first major surface; and a pair of opposing side surfaces being arranged at opposite ends of the elongate light guide in said elongation direction, and extending between the first major surface and the second major surface; and at least one light source arranged to couple light into the light guide via one of said opposing side surfaces; wherein the elongate light guide leaves exposed a pair of further regions of the light exit window adjacent to the central region, and the light exit window has a circular outline. 2. The luminaire of claim 1, wherein the light outcoupling structures are located on the second major surface. 3. The luminaire of claim 1, wherein the at least one light source comprises:
a first light source arrangement arranged to couple light into the light guide via a first side surface of said pair of opposing side surfaces; and a second light source arrangement arranged to couple light into the light guide via the side surface of said pair of opposing side surfaces opposing the first side surface. 4. The luminaire of claim 1, wherein the at least one light source is arranged on a planar or curved carrier in between said side surface and the housing. 5. The luminaire of claim 1, wherein the at least one light source is a solid state light source. 6. The luminaire of claim 1, further comprising at least one cover plate engaged with the housing, each cover plate covering a side surface of the pair of opposing side surfaces of the elongate light guide such that a light source arranged at said side surface is covered. 7. The luminaire of claim 1, wherein the housing comprises a lip delimiting at least part of the light exit window, and wherein the light guide is supported by said lip. 8. The luminaire of claim 1, wherein the reflective inner surface comprises a concave surface portion. 9. The luminaire of claim 1, wherein a maximum clearance (D) between the first major surface of the light guide and the reflective inner surface of the housing is in a range of 4-15 mm. 10. The luminaire of claim 1, wherein a maximum height (H) of the luminaire does not exceed 20 mm. 11. The luminaire of claim 1, wherein the reflective inner surface of the housing carries a reflective coating. 12. The luminaire of claim 1, wherein the housing is a sheet metal housing. 13. The luminaire of claim 1, wherein the luminaire is a troffer. | A luminaire (10) is disclosed comprising a housing (20) delimiting a light exit window (25) and comprising a reflective inner surface (23) facing the light exit window, an elongate light guide (30) mounted in the housing and partially covering the light exit window by extending in an elongation direction across a central region (26) of the light exit window, the elongate light guide comprising a first major surface (31) facing the reflective inner surface, a second major surface (33) opposite the first major surface, plurality of light outcoupling structures (37) proximal to the second major surface arranged to redirect light onto the reflective inner surface through the first major surface; and a pair of opposing side surfaces (35) in said elongation direction extending between the first major surface and the second major surface. The luminaire further comprises at least one light source (41) arranged to couple light into the light guide via one of said opposing side surfaces (35).1. A luminaire comprising:
a housing delimiting a light exit window and comprising a reflective inner surface facing the light exit window; an elongate light guide mounted in the housing and partially covering the light exit window by extending in an elongation direction across a central region of the light exit window, the elongate light guide comprising: a first major surface facing the reflective inner surface; a second major surface opposite the first major surface; a plurality of light outcoupling structures proximal to the second major surface arranged to redirect light onto the reflective inner surface through the first major surface; and a pair of opposing side surfaces being arranged at opposite ends of the elongate light guide in said elongation direction, and extending between the first major surface and the second major surface; and at least one light source arranged to couple light into the light guide via one of said opposing side surfaces; wherein the elongate light guide leaves exposed a pair of further regions of the light exit window adjacent to the central region, and the light exit window has a circular outline. 2. The luminaire of claim 1, wherein the light outcoupling structures are located on the second major surface. 3. The luminaire of claim 1, wherein the at least one light source comprises:
a first light source arrangement arranged to couple light into the light guide via a first side surface of said pair of opposing side surfaces; and a second light source arrangement arranged to couple light into the light guide via the side surface of said pair of opposing side surfaces opposing the first side surface. 4. The luminaire of claim 1, wherein the at least one light source is arranged on a planar or curved carrier in between said side surface and the housing. 5. The luminaire of claim 1, wherein the at least one light source is a solid state light source. 6. The luminaire of claim 1, further comprising at least one cover plate engaged with the housing, each cover plate covering a side surface of the pair of opposing side surfaces of the elongate light guide such that a light source arranged at said side surface is covered. 7. The luminaire of claim 1, wherein the housing comprises a lip delimiting at least part of the light exit window, and wherein the light guide is supported by said lip. 8. The luminaire of claim 1, wherein the reflective inner surface comprises a concave surface portion. 9. The luminaire of claim 1, wherein a maximum clearance (D) between the first major surface of the light guide and the reflective inner surface of the housing is in a range of 4-15 mm. 10. The luminaire of claim 1, wherein a maximum height (H) of the luminaire does not exceed 20 mm. 11. The luminaire of claim 1, wherein the reflective inner surface of the housing carries a reflective coating. 12. The luminaire of claim 1, wherein the housing is a sheet metal housing. 13. The luminaire of claim 1, wherein the luminaire is a troffer. | 2,800 |
12,311 | 12,311 | 15,882,277 | 2,887 | A method for on-behalf ATM processing via blockchain includes: receiving, by a receiver of an automated teller machine (ATM), a transaction identifier; receiving, by an input device interfaced with the ATM, a withdrawal amount; identifying, by the ATM, a blockchain transaction in one of a plurality of blocks comprising a blockchain, wherein the blockchain transaction includes at least the transaction identifier and a current balance; and processing, by the ATM, withdrawal of the withdrawal amount based on the current balance, where processing includes dispensing, by a dispenser interfaced with the ATM, currency equivalent to the withdrawal amount if the withdrawal amount is less than or equal to the current balance or displaying, by a display device interfaced with the ATM, a message indicating an insufficient balance if the withdrawal amount is greater than the current balance. | 1. A method for on-behalf ATM processing via blockchain, comprising:
receiving, by a receiver of an automated teller machine (ATM), a transaction identifier; receiving, by an input device interfaced with the ATM, a withdrawal amount; identifying, by the ATM, a blockchain transaction in one of a plurality of blocks comprising a blockchain, wherein the blockchain transaction includes at least the transaction identifier and a current balance; and processing, by the ATM, withdrawal of the withdrawal amount based on the current balance, where processing includes dispensing, by a dispenser interfaced with the ATM, currency equivalent to the withdrawal amount if the withdrawal amount is less than or equal to the current balance or displaying, by a display device interfaced with the ATM, a message indicating an insufficient balance if the withdrawal amount is greater than the current balance. 2. The method of claim 1, further comprising:
storing, in a memory of the ATM, the plurality of blocks comprising the blockchain, wherein identifying a blockchain transaction includes executing a query on the memory of the ATM to identify, in the plurality of blocks stored in the memory, the blockchain transaction based on the transaction identifier. 3. The method of claim 1, wherein identifying the blockchain transaction includes electronically transmitting, by a transmitter of the ATM, a request to a node in a blockchain network, the request including at least the transaction identifier, and receiving, by the receiver of the ATM, the blockchain transaction. 4. The method of claim 1, further comprising:
receiving, by the receiver of the ATM, a digital signature; and electronically transmitting, by a transmitter of the ATM, a new transaction to a node in a blockchain network, wherein the new transaction includes at least the transaction identifier, digital signature, and withdrawal amount. 5. The method of claim 1, further comprising:
receiving, by the receiver of the ATM, a private key of a cryptographic key pair; generating, by the ATM, a digital signature using the private key; and electronically transmitting, by a transmitter of the ATM, a new transaction to a node in a blockchain network, wherein the new transaction includes at least the transaction identifier, digital signature, and withdrawal amount. 6. The method of claim 1, further comprising:
electronically transmitting, by a transmitter of the ATM, at least the transaction identifier and withdrawal amount to an issuing institution associated with the transaction identifier. 7. The method of claim 1, further comprising:
receiving, by the receiver of the ATM, historical transaction data from a payment instrument; and modifying, by the ATM, the current balance based on the historical transaction data before processing withdrawal of the withdrawal amount. 8. The method of claim 7, wherein the transaction identifier is received from the payment instrument. 9. The method of claim 7, further comprising:
electronically transmitting, by a transmitter of the ATM, the withdrawal amount to the payment instrument if the withdrawal amount is less than or equal to the current balance. 10. The method of claim 1, wherein the transaction identifier is received from a payment instrument. 11. A system for on-behalf ATM processing via blockchain, comprising:
a receiver of an automated teller machine (ATM) configured to receive a transaction identifier; and an input device interfaced with the ATM configured to receive a withdrawal amount, wherein the ATM is configured to
identify a blockchain transaction in one of a plurality of blocks comprising a blockchain, wherein the blockchain transaction includes at least the transaction identifier and a current balance, and
process withdrawal of the withdrawal amount based on the current balance, where processing includes dispensing, by a dispenser interfaced with the ATM, currency equivalent to the withdrawal amount if the withdrawal amount is less than or equal to the current balance or displaying, by a display device interfaced with the ATM, a message indicating an insufficient balance if the withdrawal amount is greater than the current balance. 12. The system of claim 11, further comprising:
a memory of the ATM configured to store the plurality of blocks comprising the blockchain, wherein identifying a blockchain transaction includes executing a query on the memory of the ATM to identify, in the plurality of blocks stored in the memory, the blockchain transaction based on the transaction identifier. 13. The system of claim 11, wherein identifying the blockchain transaction includes electronically transmitting, by a transmitter of the ATM, a request to a node in a blockchain network, the request including at least the transaction identifier, and receiving, by the receiver of the ATM, the blockchain transaction. 14. The system of claim 11, further comprising:
a transmitter of the ATM, wherein the receiver of the ATM is further configured to receive a digital signature, and the transmitter of the ATM is configured to electronically transmit a new transaction to a node in a blockchain network, wherein the new transaction includes at least the transaction identifier, digital signature, and withdrawal amount. 15. The system of claim 11, further comprising:
a transmitter of the ATM, wherein the receiver of the ATM is further configured to receive a private key of a cryptographic key pair, the ATM is further configured to generate a digital signature using the private key, and the transmitter of the ATM is configured to electronically transmit a new transaction to a node in a blockchain network, wherein the new transaction includes at least the transaction identifier, digital signature, and withdrawal amount. 16. The system of claim 11, further comprising:
a transmitter of the ATM configured to electronically transmit at least the transaction identifier and withdrawal amount to an issuing institution associated with the transaction identifier. 17. The system of claim 11, wherein
the receiver of the ATM is further configured to receive historical transaction data from a payment instrument, and the ATM is further configured to modify the current balance based on the historical transaction data before processing withdrawal of the withdrawal amount. 18. The system of claim 17, wherein the transaction identifier is received from the payment instrument. 19. The system of claim 17, further comprising:
a transmitter of the ATM configured to electronically transmit the withdrawal amount to the payment instrument if the withdrawal amount is less than or equal to the current balance. 20. The system of claim 11, wherein the transaction identifier is received from a payment instrument. | A method for on-behalf ATM processing via blockchain includes: receiving, by a receiver of an automated teller machine (ATM), a transaction identifier; receiving, by an input device interfaced with the ATM, a withdrawal amount; identifying, by the ATM, a blockchain transaction in one of a plurality of blocks comprising a blockchain, wherein the blockchain transaction includes at least the transaction identifier and a current balance; and processing, by the ATM, withdrawal of the withdrawal amount based on the current balance, where processing includes dispensing, by a dispenser interfaced with the ATM, currency equivalent to the withdrawal amount if the withdrawal amount is less than or equal to the current balance or displaying, by a display device interfaced with the ATM, a message indicating an insufficient balance if the withdrawal amount is greater than the current balance.1. A method for on-behalf ATM processing via blockchain, comprising:
receiving, by a receiver of an automated teller machine (ATM), a transaction identifier; receiving, by an input device interfaced with the ATM, a withdrawal amount; identifying, by the ATM, a blockchain transaction in one of a plurality of blocks comprising a blockchain, wherein the blockchain transaction includes at least the transaction identifier and a current balance; and processing, by the ATM, withdrawal of the withdrawal amount based on the current balance, where processing includes dispensing, by a dispenser interfaced with the ATM, currency equivalent to the withdrawal amount if the withdrawal amount is less than or equal to the current balance or displaying, by a display device interfaced with the ATM, a message indicating an insufficient balance if the withdrawal amount is greater than the current balance. 2. The method of claim 1, further comprising:
storing, in a memory of the ATM, the plurality of blocks comprising the blockchain, wherein identifying a blockchain transaction includes executing a query on the memory of the ATM to identify, in the plurality of blocks stored in the memory, the blockchain transaction based on the transaction identifier. 3. The method of claim 1, wherein identifying the blockchain transaction includes electronically transmitting, by a transmitter of the ATM, a request to a node in a blockchain network, the request including at least the transaction identifier, and receiving, by the receiver of the ATM, the blockchain transaction. 4. The method of claim 1, further comprising:
receiving, by the receiver of the ATM, a digital signature; and electronically transmitting, by a transmitter of the ATM, a new transaction to a node in a blockchain network, wherein the new transaction includes at least the transaction identifier, digital signature, and withdrawal amount. 5. The method of claim 1, further comprising:
receiving, by the receiver of the ATM, a private key of a cryptographic key pair; generating, by the ATM, a digital signature using the private key; and electronically transmitting, by a transmitter of the ATM, a new transaction to a node in a blockchain network, wherein the new transaction includes at least the transaction identifier, digital signature, and withdrawal amount. 6. The method of claim 1, further comprising:
electronically transmitting, by a transmitter of the ATM, at least the transaction identifier and withdrawal amount to an issuing institution associated with the transaction identifier. 7. The method of claim 1, further comprising:
receiving, by the receiver of the ATM, historical transaction data from a payment instrument; and modifying, by the ATM, the current balance based on the historical transaction data before processing withdrawal of the withdrawal amount. 8. The method of claim 7, wherein the transaction identifier is received from the payment instrument. 9. The method of claim 7, further comprising:
electronically transmitting, by a transmitter of the ATM, the withdrawal amount to the payment instrument if the withdrawal amount is less than or equal to the current balance. 10. The method of claim 1, wherein the transaction identifier is received from a payment instrument. 11. A system for on-behalf ATM processing via blockchain, comprising:
a receiver of an automated teller machine (ATM) configured to receive a transaction identifier; and an input device interfaced with the ATM configured to receive a withdrawal amount, wherein the ATM is configured to
identify a blockchain transaction in one of a plurality of blocks comprising a blockchain, wherein the blockchain transaction includes at least the transaction identifier and a current balance, and
process withdrawal of the withdrawal amount based on the current balance, where processing includes dispensing, by a dispenser interfaced with the ATM, currency equivalent to the withdrawal amount if the withdrawal amount is less than or equal to the current balance or displaying, by a display device interfaced with the ATM, a message indicating an insufficient balance if the withdrawal amount is greater than the current balance. 12. The system of claim 11, further comprising:
a memory of the ATM configured to store the plurality of blocks comprising the blockchain, wherein identifying a blockchain transaction includes executing a query on the memory of the ATM to identify, in the plurality of blocks stored in the memory, the blockchain transaction based on the transaction identifier. 13. The system of claim 11, wherein identifying the blockchain transaction includes electronically transmitting, by a transmitter of the ATM, a request to a node in a blockchain network, the request including at least the transaction identifier, and receiving, by the receiver of the ATM, the blockchain transaction. 14. The system of claim 11, further comprising:
a transmitter of the ATM, wherein the receiver of the ATM is further configured to receive a digital signature, and the transmitter of the ATM is configured to electronically transmit a new transaction to a node in a blockchain network, wherein the new transaction includes at least the transaction identifier, digital signature, and withdrawal amount. 15. The system of claim 11, further comprising:
a transmitter of the ATM, wherein the receiver of the ATM is further configured to receive a private key of a cryptographic key pair, the ATM is further configured to generate a digital signature using the private key, and the transmitter of the ATM is configured to electronically transmit a new transaction to a node in a blockchain network, wherein the new transaction includes at least the transaction identifier, digital signature, and withdrawal amount. 16. The system of claim 11, further comprising:
a transmitter of the ATM configured to electronically transmit at least the transaction identifier and withdrawal amount to an issuing institution associated with the transaction identifier. 17. The system of claim 11, wherein
the receiver of the ATM is further configured to receive historical transaction data from a payment instrument, and the ATM is further configured to modify the current balance based on the historical transaction data before processing withdrawal of the withdrawal amount. 18. The system of claim 17, wherein the transaction identifier is received from the payment instrument. 19. The system of claim 17, further comprising:
a transmitter of the ATM configured to electronically transmit the withdrawal amount to the payment instrument if the withdrawal amount is less than or equal to the current balance. 20. The system of claim 11, wherein the transaction identifier is received from a payment instrument. | 2,800 |
12,312 | 12,312 | 15,887,514 | 2,857 | A coordinate measuring machine measures surface finish of a workpiece, without requiring special sensors or a high-precision physical reference datum. To that end, the coordinate measuring machine measures a plurality of points on the surface of the workpiece, and processes the measurements to produce a surface finish spectrum, which is a subset of frequencies that define the spatial spectrum of the surface. | 1. A coordinate measuring machine system for assessing a surface finish of a workpiece having a surface and an expected geometry, the system comprising:
a coordinate measuring machine configured to control a probe to measure a plurality of points on the surface of the workpiece, thereby producing a plurality of measurements; and a computer configured to:
receive the plurality of measurements obtained by the probe;
receive a cutoff frequency; and
process the plurality of measurements to produce a surface finish spectrum, the surface finish spectrum limited to frequencies above the cutoff frequency. 2. The system of claim 1, wherein the plurality of points are evenly-spaced points. 3. The system of claim 1, wherein the expected geometry has a maximum spatial frequency, and the cutoff frequency is equal to or greater than the maximum spatial frequency. 4. The system of claim 1, wherein the probe comprises a tactile stylus. 5. The system of claim 1, wherein the probe comprises an optical probe. 6. The system of claim 1, wherein the computer is further configured to compare the surface finish spectrum to a specification for the workpiece, to determine whether the surface finish is within a tolerance set forth in the specification. 7. The system of claim 1, wherein the computer is further configured to measure dimensions of the workpiece with the probe. 8. The system of claim 1, wherein:
the expected geometry is characterized by a maximum expected geometry spatial frequency; the workpiece also has a surface waviness characterized by a maximum waviness frequency; and
the cutoff frequency is above the greater of the maximum expected geometry spatial frequency and the maximum waviness frequency. 9. A method of assessing, with a coordinate measuring machine, a surface finish of a workpiece, the method comprising:
measuring, with a probe of a coordinate measuring machine, a plurality of points on a surface of the workpiece, the plurality of points characterized by a spatial spectrum; retrieving, from a computer memory, a cutoff frequency; and characterizing the surface finish of the workpiece by removing, from the spatial spectrum, all frequencies below the cutoff frequency to produce a surface finish spectrum. 10. The method of claim 9, wherein the plurality of points are evenly-spaced points. 11. The method of claim 9, wherein the workpiece has an expected geometry, and the expected geometry has a maximum spatial frequency, and the cutoff frequency is the maximum spatial frequency. 12. The method of claim 11, wherein:
the expected geometry is characterized by a maximum expected geometry spatial frequency; the workpiece also has a surface waviness characterized by a maximum waviness frequency; and the cutoff frequency is above the greater of the maximum expected geometry spatial frequency and the maximum waviness frequency. 13. The method of claim 9, wherein the probe comprises a tactile stylus, and wherein the coordinate measuring machine assesses the surface finish of the workpiece without a physical reference datum. 14. The method of claim 9, wherein the probe comprises an optical probe. 15. The method of claim 9, wherein characterizing the surface finish of the workpiece further includes comparing the surface finish spectrum to a specification for the workpiece, to determine whether the surface finish is within a tolerance set forth in the specification. 16. The method of claim 9, further comprising measuring dimensions of the workpiece with the probe. 17. A non-transient computer programmed product bearing non-transient executable computer code, the executable computer code comprising:
code for controlling a probe of a coordinate measuring machine to measure a plurality of points on a surface of a workpiece, the plurality of points characterized by a spatial spectrum; code for receiving, from a computer memory, a cutoff frequency; and code for characterizing the surface finish of the workpiece by removing, from the spatial spectrum, all frequencies below the cutoff frequency to produce a surface finish spectrum. 18. The non-transient computer programmed product of claim 17, wherein the plurality of points are evenly-spaced points. 19. The non-transient computer programmed product of claim 17, wherein the workpiece has an expected geometry, and the expected geometry has a maximum spatial frequency, and the cutoff frequency is equal to or greater than the maximum spatial frequency. 20. The non-transient computer programmed product of claim 17, wherein:
the workpiece has an expected geometry characterized by maximum expected geometry spatial frequency; the workpiece also has a surface waviness characterized by a maximum waviness frequency; and the cutoff frequency is above the greater of the maximum expected geometry spatial frequency and the maximum waviness frequency. | A coordinate measuring machine measures surface finish of a workpiece, without requiring special sensors or a high-precision physical reference datum. To that end, the coordinate measuring machine measures a plurality of points on the surface of the workpiece, and processes the measurements to produce a surface finish spectrum, which is a subset of frequencies that define the spatial spectrum of the surface.1. A coordinate measuring machine system for assessing a surface finish of a workpiece having a surface and an expected geometry, the system comprising:
a coordinate measuring machine configured to control a probe to measure a plurality of points on the surface of the workpiece, thereby producing a plurality of measurements; and a computer configured to:
receive the plurality of measurements obtained by the probe;
receive a cutoff frequency; and
process the plurality of measurements to produce a surface finish spectrum, the surface finish spectrum limited to frequencies above the cutoff frequency. 2. The system of claim 1, wherein the plurality of points are evenly-spaced points. 3. The system of claim 1, wherein the expected geometry has a maximum spatial frequency, and the cutoff frequency is equal to or greater than the maximum spatial frequency. 4. The system of claim 1, wherein the probe comprises a tactile stylus. 5. The system of claim 1, wherein the probe comprises an optical probe. 6. The system of claim 1, wherein the computer is further configured to compare the surface finish spectrum to a specification for the workpiece, to determine whether the surface finish is within a tolerance set forth in the specification. 7. The system of claim 1, wherein the computer is further configured to measure dimensions of the workpiece with the probe. 8. The system of claim 1, wherein:
the expected geometry is characterized by a maximum expected geometry spatial frequency; the workpiece also has a surface waviness characterized by a maximum waviness frequency; and
the cutoff frequency is above the greater of the maximum expected geometry spatial frequency and the maximum waviness frequency. 9. A method of assessing, with a coordinate measuring machine, a surface finish of a workpiece, the method comprising:
measuring, with a probe of a coordinate measuring machine, a plurality of points on a surface of the workpiece, the plurality of points characterized by a spatial spectrum; retrieving, from a computer memory, a cutoff frequency; and characterizing the surface finish of the workpiece by removing, from the spatial spectrum, all frequencies below the cutoff frequency to produce a surface finish spectrum. 10. The method of claim 9, wherein the plurality of points are evenly-spaced points. 11. The method of claim 9, wherein the workpiece has an expected geometry, and the expected geometry has a maximum spatial frequency, and the cutoff frequency is the maximum spatial frequency. 12. The method of claim 11, wherein:
the expected geometry is characterized by a maximum expected geometry spatial frequency; the workpiece also has a surface waviness characterized by a maximum waviness frequency; and the cutoff frequency is above the greater of the maximum expected geometry spatial frequency and the maximum waviness frequency. 13. The method of claim 9, wherein the probe comprises a tactile stylus, and wherein the coordinate measuring machine assesses the surface finish of the workpiece without a physical reference datum. 14. The method of claim 9, wherein the probe comprises an optical probe. 15. The method of claim 9, wherein characterizing the surface finish of the workpiece further includes comparing the surface finish spectrum to a specification for the workpiece, to determine whether the surface finish is within a tolerance set forth in the specification. 16. The method of claim 9, further comprising measuring dimensions of the workpiece with the probe. 17. A non-transient computer programmed product bearing non-transient executable computer code, the executable computer code comprising:
code for controlling a probe of a coordinate measuring machine to measure a plurality of points on a surface of a workpiece, the plurality of points characterized by a spatial spectrum; code for receiving, from a computer memory, a cutoff frequency; and code for characterizing the surface finish of the workpiece by removing, from the spatial spectrum, all frequencies below the cutoff frequency to produce a surface finish spectrum. 18. The non-transient computer programmed product of claim 17, wherein the plurality of points are evenly-spaced points. 19. The non-transient computer programmed product of claim 17, wherein the workpiece has an expected geometry, and the expected geometry has a maximum spatial frequency, and the cutoff frequency is equal to or greater than the maximum spatial frequency. 20. The non-transient computer programmed product of claim 17, wherein:
the workpiece has an expected geometry characterized by maximum expected geometry spatial frequency; the workpiece also has a surface waviness characterized by a maximum waviness frequency; and the cutoff frequency is above the greater of the maximum expected geometry spatial frequency and the maximum waviness frequency. | 2,800 |
12,313 | 12,313 | 15,683,078 | 2,863 | A method and apparatus for processing data from at least one of a sensor or an actuator on a server is provided. The method comprises receiving, on a server, raw data from at least one of a sensor or an actuator, and processing the raw data on the server according to a predefined algorithm, wherein the server is remote to the at least of the sensor or the actuator. The processed data may be stored on the server, and may be forwarded to a service on a local network, or a service on the Internet for further processing. | 1. A computer-implemented method for processing data from at least one of a sensor or an actuator on a server, comprising:
receiving, on a server, raw data from at least one of a sensor or an actuator; and processing the raw data on the server according to a predefined algorithm, wherein the server is remote to the at least of the sensor or the actuator. 2. The method of claim 1, wherein the server is located on at least one of premises comprising the at least one of the sensor or the actuator, in the cloud, in the fog, or on a gateway coupled to the at least one of the sensor or the actuator. 3. The method of claim 1, wherein the processed data is archived, displayed, or communicated for consumption by a user. 4. The method of claim 1 further comprising conducting on the processed data, at least one of analytics, database storage, or presentation via a visual interface. 5. The method of claim 1 further comprising receiving the algorithm at the server, wherein the algorithm is defined via a graphical user interface (GUI) on a user device remote to the at least one of the sensor or the actuator and the server, or wherein the algorithm is defined via a file definition. 6. The method of claim 1 further comprising defining, at a user device, connection parameters for communicably coupling the at least one of the sensor or the actuator to the server, the connections are defined via at least one of a graphical user interface (GUI) or a file definition, wherein the user device is remote to the server. 7. The method of claim 1, further comprising converting the raw data according to a pre-defined conversion formula comprised in the algorithm, wherein the pre-defined conversion formula is defined using at least one of a graphical user interface (GUI) or a file definition. 8. The method of claim 1 further comprising:
storing the processed data on the server;
forwarding the stored data to a service on a local network, or a service on the Internet. 9. The method of claim 1, wherein the algorithm comprises at least one of conversion algorithms including conversion formulae, data quality check algorithms, or data cleaning algorithms. 10. A system for processing data from at least one of a sensor or an actuator on a server, comprising:
at least one of a sensor or an actuator; a server coupled to the at least one sensor or the actuator, the server comprising at least one processor and a memory comprising executable instructions, which when executed using the at least one processor implements a method comprising:
receiving, on the server, raw data from the at least one of a sensor or an actuator, and
processing the raw data on the server according to a predefined algorithm, wherein the server is remote to the at least one of the sensor or the actuator; and
a user device for defining the algorithm via a graphical user interface (GUI) on the user device, the user device remote to the at least one of the sensor or the actuator and the server. 11. An apparatus for processing data from at least one of a sensor or an actuator on a server, comprising:
a server comprising at least one processor and a memory comprising executable instructions, which when executed using the at least one processor implements a method comprising:
receiving, on the server, raw data from at least one of a sensor or an actuator; and
processing the raw data on the server according to a predefined algorithm, wherein the server is remote to the at least one of the sensor or the actuator. 12. The apparatus of claim 11, wherein the server is located on at least one of premises comprising the at least one of the sensor or the actuator, in the cloud, in the fog, or on a gateway coupled to the at least one of the sensor or the actuator. 13. The apparatus of claim 11, wherein the processed data is archived, displayed, or communicated for consumption by a user. 14. The apparatus of claim 11, wherein the method further comprises conducting on the processed data, at least one of analytics, database storage, or presentation via a visual interface. 15. The apparatus of claim 11, wherein the algorithm is defined via a graphical user interface (GUI) on a user device remote to the at least one of the sensor or the actuator and the server, or wherein the algorithm is defined via a file definition. 16. The apparatus of claim 11, wherein connection parameters for connecting the at least one of the sensor or the actuator to the server are defined, at a user device, using at least one of a graphical user interface (GUI) or a file definition, wherein the user device is remote to the server. 17. The apparatus of claim 11, wherein the nature of data received from the at least one of the sensor or the actuator, at the server, is specified using at least one of a graphical user interface (GUI) or a file definition. 18. The apparatus of claim 11, wherein the method further comprises converting the raw data according to a pre-defined conversion formula comprised in the algorithm, wherein the pre-defined conversion formula is defined using at least one of a graphical user interface (GUI) or a file definition. 19. The apparatus of claim 11, wherein the method further comprises:
storing the processed data on the server; forwarding the stored data to a service on a local network, or a service on the Internet. 20. The apparatus of claim 11, wherein the algorithm comprises at least one of conversion algorithms including conversion formulae, data quality check algorithms, or data cleaning algorithms. | A method and apparatus for processing data from at least one of a sensor or an actuator on a server is provided. The method comprises receiving, on a server, raw data from at least one of a sensor or an actuator, and processing the raw data on the server according to a predefined algorithm, wherein the server is remote to the at least of the sensor or the actuator. The processed data may be stored on the server, and may be forwarded to a service on a local network, or a service on the Internet for further processing.1. A computer-implemented method for processing data from at least one of a sensor or an actuator on a server, comprising:
receiving, on a server, raw data from at least one of a sensor or an actuator; and processing the raw data on the server according to a predefined algorithm, wherein the server is remote to the at least of the sensor or the actuator. 2. The method of claim 1, wherein the server is located on at least one of premises comprising the at least one of the sensor or the actuator, in the cloud, in the fog, or on a gateway coupled to the at least one of the sensor or the actuator. 3. The method of claim 1, wherein the processed data is archived, displayed, or communicated for consumption by a user. 4. The method of claim 1 further comprising conducting on the processed data, at least one of analytics, database storage, or presentation via a visual interface. 5. The method of claim 1 further comprising receiving the algorithm at the server, wherein the algorithm is defined via a graphical user interface (GUI) on a user device remote to the at least one of the sensor or the actuator and the server, or wherein the algorithm is defined via a file definition. 6. The method of claim 1 further comprising defining, at a user device, connection parameters for communicably coupling the at least one of the sensor or the actuator to the server, the connections are defined via at least one of a graphical user interface (GUI) or a file definition, wherein the user device is remote to the server. 7. The method of claim 1, further comprising converting the raw data according to a pre-defined conversion formula comprised in the algorithm, wherein the pre-defined conversion formula is defined using at least one of a graphical user interface (GUI) or a file definition. 8. The method of claim 1 further comprising:
storing the processed data on the server;
forwarding the stored data to a service on a local network, or a service on the Internet. 9. The method of claim 1, wherein the algorithm comprises at least one of conversion algorithms including conversion formulae, data quality check algorithms, or data cleaning algorithms. 10. A system for processing data from at least one of a sensor or an actuator on a server, comprising:
at least one of a sensor or an actuator; a server coupled to the at least one sensor or the actuator, the server comprising at least one processor and a memory comprising executable instructions, which when executed using the at least one processor implements a method comprising:
receiving, on the server, raw data from the at least one of a sensor or an actuator, and
processing the raw data on the server according to a predefined algorithm, wherein the server is remote to the at least one of the sensor or the actuator; and
a user device for defining the algorithm via a graphical user interface (GUI) on the user device, the user device remote to the at least one of the sensor or the actuator and the server. 11. An apparatus for processing data from at least one of a sensor or an actuator on a server, comprising:
a server comprising at least one processor and a memory comprising executable instructions, which when executed using the at least one processor implements a method comprising:
receiving, on the server, raw data from at least one of a sensor or an actuator; and
processing the raw data on the server according to a predefined algorithm, wherein the server is remote to the at least one of the sensor or the actuator. 12. The apparatus of claim 11, wherein the server is located on at least one of premises comprising the at least one of the sensor or the actuator, in the cloud, in the fog, or on a gateway coupled to the at least one of the sensor or the actuator. 13. The apparatus of claim 11, wherein the processed data is archived, displayed, or communicated for consumption by a user. 14. The apparatus of claim 11, wherein the method further comprises conducting on the processed data, at least one of analytics, database storage, or presentation via a visual interface. 15. The apparatus of claim 11, wherein the algorithm is defined via a graphical user interface (GUI) on a user device remote to the at least one of the sensor or the actuator and the server, or wherein the algorithm is defined via a file definition. 16. The apparatus of claim 11, wherein connection parameters for connecting the at least one of the sensor or the actuator to the server are defined, at a user device, using at least one of a graphical user interface (GUI) or a file definition, wherein the user device is remote to the server. 17. The apparatus of claim 11, wherein the nature of data received from the at least one of the sensor or the actuator, at the server, is specified using at least one of a graphical user interface (GUI) or a file definition. 18. The apparatus of claim 11, wherein the method further comprises converting the raw data according to a pre-defined conversion formula comprised in the algorithm, wherein the pre-defined conversion formula is defined using at least one of a graphical user interface (GUI) or a file definition. 19. The apparatus of claim 11, wherein the method further comprises:
storing the processed data on the server; forwarding the stored data to a service on a local network, or a service on the Internet. 20. The apparatus of claim 11, wherein the algorithm comprises at least one of conversion algorithms including conversion formulae, data quality check algorithms, or data cleaning algorithms. | 2,800 |
12,314 | 12,314 | 16,023,306 | 2,866 | A method for determining an emission coefficient of a device under test (DUT) using a test circuit is disclosed. The method comprises coupling a parameter measurement circuit associated with the test circuit to an input pin associated with the DUT, wherein the input pin is coupled to a diode element within the DUT and performing voltage and current measurements associated with the input pin using the parameter measurement circuit. In some embodiments, the method further comprises determining a plurality of contact resistance values respectively based on the voltage and current measurements and an emission coefficient estimate using a contact resistance estimation circuit; and determining an emission coefficient associated with the DUT based on the determined plurality of contact resistance values using an emission coefficient determination circuit. | 1. A method for determining an emission coefficient comprising:
(a) performing voltage and current measurements; (b) calculating a plurality of contact resistance values based on an estimate of the emission coefficient using the voltage and current measurements, (c) determining a resistance difference, wherein the resistance difference is a difference between a greatest and a smallest value within the plurality of calculated contact resistance values, (d) if the resistance difference does not fulfill a stop condition, adjusting the emission coefficient estimate and repeating acts (b) and (c), and (e) if the resistance difference fulfills the stop condition, determining the emission coefficient based on the current emission coefficient estimate or based on a previous emission coefficient estima 2. The method of claim 1, wherein the stop condition is based on a predefined threshold. 3. The method of claim 1, wherein the stop condition is based on the resistance difference and a previously determined resistance difference associated with the previous emission coefficient estimate. 4. The method of claim 1, wherein adjusting the emission coefficient estimate comprises changing the emission coefficient estimate according to a search algorithm dependent on previously determined resistance differences. 5. The method of claim 1, further comprising calculating a contact resistance value based on the determined emission coefficient and at least some of the voltage and current measurements, or further voltage and current measurements. 6. The method of claim 5, further comprising testing a device, wherein a resistance of a physical connection between the device and a test circuit is the basis for the calculated contact resistance. 7. The method of claim 1, wherein adjusting the emission coefficient estimate and the repeating of acts (b) and (c) is repeated until the resistance difference fulfills the stop condition or until a number of repetitions exceeds a loop limit value. 8. A method for determining an emission coefficient of a device under test (DUT) using a test circuit, comprising:
coupling a parameter measurement circuit associated with the test circuit to an input pin associated with the DUT, wherein the input pin is coupled to a diode element within the DUT; performing voltage and current measurements associated with the input pin using the parameter measurement circuit; determining a plurality of contact resistance values respectively based on the voltage and current measurements and an emission coefficient estimate using a contact resistance estimation circuit; and determining an emission coefficient associated with the DUT based on the determined plurality of contact resistance values using an emission coefficient determination circuit. 9. The method of claim 8, wherein determining an emission coefficient based on the determined plurality of contact resistance values comprises:
(a) initiating with the emission coefficient estimate; (b) determining a resistance difference that comprises a difference between a greatest value and a smallest value of the determined plurality of contact resistance values; and (c) selectively adjusting the emission coefficient estimate based on the resistance difference and a stop condition. 10. The method of claim 9, wherein selectively adjusting the emission coefficient estimate comprises:
(d) adjusting the emission coefficient estimate if the resistance difference does not fulfill the stop condition; (e) calculating contact resistance values associated with the adjusted emission coefficient estimate; and (f) determining the emission coefficient based on the emission coefficient estimate or a previous emission coefficient estimate when the resistance difference associated with the emission coefficient estimate fulfills the stop condition. 11. The method of claim 10, further comprising repeating acts (d) and (e) if the condition at act (f) is not satisfied until a loop limit value, that iterates each time acts (d) and (e) are repeated, is reached. 12. The method of claim 10, wherein the stop condition comprises determining whether the calculated resistance difference is less than or equal to a predefined absolute threshold value. 13. The method of claim 10, wherein the stop condition comprises determining whether the calculated resistance difference is less than a previous resistance difference at least by a predefined relative threshold value. 14. The method of claim 10, wherein the stop condition comprises determining whether a previous resistance difference is less than the calculated resistance difference at least by a predefined threshold value. 15. The method of claim 9, wherein performing voltage and current measurements comprises determining a plurality of emission coefficient parameter sets, each emission coefficient parameter set comprising two different voltages and corresponding two different currents associated with the input pin using the parameter measurement circuit. 16. The method of claim 15, wherein determining the plurality of contact resistance values comprises determining the plurality of contact resistance values respectively based on the plurality of emission coefficient parameter sets and the emission coefficient estimate, in accordance with a predefined contact resistance relation using the contact resistance estimation circuit. 17. A test circuit configured to determine an emission coefficient of a device under test (DUT), comprising:
a parameter measurement circuit configured to perform voltage and current measurements associated with an input pin of the DUT; a contact resistance estimation circuit configured to determine a plurality of contact resistance values respectively based on the voltage and current measurements and an emission coefficient estimate; and an emission coefficient determination circuit configured to determine an emission coefficient associated with the DUT based on the determined plurality of contact resistance values. 18. The test circuit of claim 17, wherein, in order to determine the emission coefficient, the emission coefficient determination circuit is configured to:
(a) initiate with the emission coefficient estimate; (b) calculate a resistance difference comprising a difference between a greatest value and a smallest value of the plurality of contact resistance values; and (c) selectively adjust the emission coefficient estimate based on the resistance difference and a stop condition. 19. The test circuit of claim 18, wherein the stop condition comprises whether the calculated resistance difference is less than or equal to a predefined absolute threshold value. 20. The test circuit of claim 18, wherein the stop condition comprises determining whether the calculated resistance difference is less than a previous resistance difference at least by a predefined relative threshold value. 21. The test circuit of claim 18, wherein the stop condition comprises determining whether a previous resistance difference is less than the calculated resistance difference at least by a predefined threshold value. 22. The test circuit of claim 18, wherein, in order to selectively adjust the emission coefficient estimate, the emission coefficient determination circuit is configured to:
(d) adjust the emission coefficient estimate when the calculated resistance difference does not fulfill the stop condition; (e) calculate a modified contact resistance difference comprising a difference between a greatest value and a smallest value of a plurality of modified contact resistance values, wherein the plurality of modified contact resistance values is determined at the contact resistance estimation circuit based on the adjusted emission coefficient estimate; and (f) determine the emission coefficient based on the emission coefficient estimate or a previous emission coefficient estimate when the resistance difference associated with the emission coefficient estimate fulfills the stop condition. 23. The test circuit of claim 22, wherein the emission coefficient determination circuit is configured to repeat acts (d) and (e) if the condition at act (f) is not satisfied until a loop limit value, that iterates each time acts (d) and (e) are repeated, is reached. | A method for determining an emission coefficient of a device under test (DUT) using a test circuit is disclosed. The method comprises coupling a parameter measurement circuit associated with the test circuit to an input pin associated with the DUT, wherein the input pin is coupled to a diode element within the DUT and performing voltage and current measurements associated with the input pin using the parameter measurement circuit. In some embodiments, the method further comprises determining a plurality of contact resistance values respectively based on the voltage and current measurements and an emission coefficient estimate using a contact resistance estimation circuit; and determining an emission coefficient associated with the DUT based on the determined plurality of contact resistance values using an emission coefficient determination circuit.1. A method for determining an emission coefficient comprising:
(a) performing voltage and current measurements; (b) calculating a plurality of contact resistance values based on an estimate of the emission coefficient using the voltage and current measurements, (c) determining a resistance difference, wherein the resistance difference is a difference between a greatest and a smallest value within the plurality of calculated contact resistance values, (d) if the resistance difference does not fulfill a stop condition, adjusting the emission coefficient estimate and repeating acts (b) and (c), and (e) if the resistance difference fulfills the stop condition, determining the emission coefficient based on the current emission coefficient estimate or based on a previous emission coefficient estima 2. The method of claim 1, wherein the stop condition is based on a predefined threshold. 3. The method of claim 1, wherein the stop condition is based on the resistance difference and a previously determined resistance difference associated with the previous emission coefficient estimate. 4. The method of claim 1, wherein adjusting the emission coefficient estimate comprises changing the emission coefficient estimate according to a search algorithm dependent on previously determined resistance differences. 5. The method of claim 1, further comprising calculating a contact resistance value based on the determined emission coefficient and at least some of the voltage and current measurements, or further voltage and current measurements. 6. The method of claim 5, further comprising testing a device, wherein a resistance of a physical connection between the device and a test circuit is the basis for the calculated contact resistance. 7. The method of claim 1, wherein adjusting the emission coefficient estimate and the repeating of acts (b) and (c) is repeated until the resistance difference fulfills the stop condition or until a number of repetitions exceeds a loop limit value. 8. A method for determining an emission coefficient of a device under test (DUT) using a test circuit, comprising:
coupling a parameter measurement circuit associated with the test circuit to an input pin associated with the DUT, wherein the input pin is coupled to a diode element within the DUT; performing voltage and current measurements associated with the input pin using the parameter measurement circuit; determining a plurality of contact resistance values respectively based on the voltage and current measurements and an emission coefficient estimate using a contact resistance estimation circuit; and determining an emission coefficient associated with the DUT based on the determined plurality of contact resistance values using an emission coefficient determination circuit. 9. The method of claim 8, wherein determining an emission coefficient based on the determined plurality of contact resistance values comprises:
(a) initiating with the emission coefficient estimate; (b) determining a resistance difference that comprises a difference between a greatest value and a smallest value of the determined plurality of contact resistance values; and (c) selectively adjusting the emission coefficient estimate based on the resistance difference and a stop condition. 10. The method of claim 9, wherein selectively adjusting the emission coefficient estimate comprises:
(d) adjusting the emission coefficient estimate if the resistance difference does not fulfill the stop condition; (e) calculating contact resistance values associated with the adjusted emission coefficient estimate; and (f) determining the emission coefficient based on the emission coefficient estimate or a previous emission coefficient estimate when the resistance difference associated with the emission coefficient estimate fulfills the stop condition. 11. The method of claim 10, further comprising repeating acts (d) and (e) if the condition at act (f) is not satisfied until a loop limit value, that iterates each time acts (d) and (e) are repeated, is reached. 12. The method of claim 10, wherein the stop condition comprises determining whether the calculated resistance difference is less than or equal to a predefined absolute threshold value. 13. The method of claim 10, wherein the stop condition comprises determining whether the calculated resistance difference is less than a previous resistance difference at least by a predefined relative threshold value. 14. The method of claim 10, wherein the stop condition comprises determining whether a previous resistance difference is less than the calculated resistance difference at least by a predefined threshold value. 15. The method of claim 9, wherein performing voltage and current measurements comprises determining a plurality of emission coefficient parameter sets, each emission coefficient parameter set comprising two different voltages and corresponding two different currents associated with the input pin using the parameter measurement circuit. 16. The method of claim 15, wherein determining the plurality of contact resistance values comprises determining the plurality of contact resistance values respectively based on the plurality of emission coefficient parameter sets and the emission coefficient estimate, in accordance with a predefined contact resistance relation using the contact resistance estimation circuit. 17. A test circuit configured to determine an emission coefficient of a device under test (DUT), comprising:
a parameter measurement circuit configured to perform voltage and current measurements associated with an input pin of the DUT; a contact resistance estimation circuit configured to determine a plurality of contact resistance values respectively based on the voltage and current measurements and an emission coefficient estimate; and an emission coefficient determination circuit configured to determine an emission coefficient associated with the DUT based on the determined plurality of contact resistance values. 18. The test circuit of claim 17, wherein, in order to determine the emission coefficient, the emission coefficient determination circuit is configured to:
(a) initiate with the emission coefficient estimate; (b) calculate a resistance difference comprising a difference between a greatest value and a smallest value of the plurality of contact resistance values; and (c) selectively adjust the emission coefficient estimate based on the resistance difference and a stop condition. 19. The test circuit of claim 18, wherein the stop condition comprises whether the calculated resistance difference is less than or equal to a predefined absolute threshold value. 20. The test circuit of claim 18, wherein the stop condition comprises determining whether the calculated resistance difference is less than a previous resistance difference at least by a predefined relative threshold value. 21. The test circuit of claim 18, wherein the stop condition comprises determining whether a previous resistance difference is less than the calculated resistance difference at least by a predefined threshold value. 22. The test circuit of claim 18, wherein, in order to selectively adjust the emission coefficient estimate, the emission coefficient determination circuit is configured to:
(d) adjust the emission coefficient estimate when the calculated resistance difference does not fulfill the stop condition; (e) calculate a modified contact resistance difference comprising a difference between a greatest value and a smallest value of a plurality of modified contact resistance values, wherein the plurality of modified contact resistance values is determined at the contact resistance estimation circuit based on the adjusted emission coefficient estimate; and (f) determine the emission coefficient based on the emission coefficient estimate or a previous emission coefficient estimate when the resistance difference associated with the emission coefficient estimate fulfills the stop condition. 23. The test circuit of claim 22, wherein the emission coefficient determination circuit is configured to repeat acts (d) and (e) if the condition at act (f) is not satisfied until a loop limit value, that iterates each time acts (d) and (e) are repeated, is reached. | 2,800 |
12,315 | 12,315 | 16,316,276 | 2,884 | Disclosed is a method for measuring the absorbance of light of a substance in a solution in a measuring cell (23; 223′), said method comprising the steps of: transmitting (S1) a first light beam (27; 27′) from a light source (25; 25′) towards a beam splitter (29; 29′); dividing (S3) the first light beam (27; 27′) into a signal light ray (31; 31′) and a reference light ray (33; 33′) by the beam splitter (29; 29′); modulating (S5) the signal light ray (31; 31′); modulating the reference light ray (33; 33′); providing (S9) the measuring cell (23; 23′) such that the signal light ray (31; 31′) passes through the measuring cell; detecting (S11) a signal in a detectoR (39; 39′), which signal is the combined signal intensity of the signal light ray (31; 31′) and the reference light ray (33; 33′) detected by the detector (39; 39′); performing synchronous detection (S15) of the detected signal in order to reconstruct the intensities of the signal light ray (31; 31′) and the reference light ray (33; 33′) from the combined signal detected by the detector (39; 39′), said synchronous detection being based on the modulation performed to the signal light ray and the reference light ray. Disclosed also is a measuring device for carrying out said method | 1. A method for measuring the absorbance of light of a substance in a solution in a measuring cell, said method comprising the steps of:
transmitting a first light beam from a light source towards a beam splitter; dividing the first light beam into a signal light ray and a reference light ray by the beam splitter; modulating the signal light ray; modulating the reference light ray; providing the measuring cell such that the signal light ray passes through the measuring cell; detecting a signal in a detector, which signal is the combined signal intensity of the signal light ray and the reference light ray detected by the detector; performing synchronous detection of the detected signal in order to reconstruct the intensities of the signal light ray and the reference light ray from the combined signal detected by the detector, said synchronous detection being based on the modulation performed to the signal light ray and the reference light ray. 2. Method according to claim 1, wherein the signal light ray and the reference light ray are detected in the same detector simultaneously. 3. Method according to claim 1, wherein the step of modulating the signal light ray comprises modulating the signal light ray at a first frequency and the step of modulating the reference light ray comprises modulating the reference light ray at a second frequency which is different from the first frequency. 4. Method according to claim 1, wherein the steps of modulating the signal light ray and the reference light ray comprise creating a sine modulation or a square wave modulation to both the signal light ray and the reference light ray. 5. Method according to claim 1, wherein the measuring cell is a flow cell. 6. Method according to claim 1, further comprising the step of changing direction of one or both of the signal light ray and the reference light ray with at least one light direction changing device such that both the signal light ray and the reference light ray can be detected by the same detector. 7. Method according to claim 1, wherein the step of modulating one of the signal light ray or the reference light ray comprises controlling the light source. 8. A measuring device for measuring the absorbance of a substance in a solution in a measuring cell of the measuring device, wherein said measuring device comprises:
a light source transmitting a first light beam; a beam splitter provided such that the first light beam is divided by the beam splitter into a signal light ray and a reference light ray; the measuring cell positioned such that the signal light ray will pass through the measuring cell; a first signal modulation device arranged to modulate the signal light ray; and a second signal modulation device arranged to modulate the reference light ray; and a detector arranged to detect the signal light ray when it has been modulated and passed the measuring cell and also detect the reference light ray when it has been modulated, wherein the detector comprises or is connected to a processing device which is configured for performing synchronous detection of the detected signal in order to reconstruct the intensities of the signal light ray and the reference light ray from the combined signal detected by the detector, said synchronous detection being based on the modulation performed to the signal light ray and the reference light ray. 9. A measuring device according to claim 8, further comprising at least one light direction changing device arranged to change the direction of the reference light ray or the signal light ray such that they can be detected by the same detector. 10. Measuring device according to claim 8, wherein the measuring cell is a flow cell. 11. Measuring device according to claim 8, wherein the first signal modulation device and the second signal modulation device are arranged to modulate the signals at different frequencies. 12. Measuring device according to claim 8, wherein the first signal modulation device is a chopper, a shutter, a movable mirror, a tuning fork or an adjustable gray filter provided somewhere in the light path of the signal light ray. 13. Measuring device according to claim 8, wherein the second signal modulation device is a chopper, a shutter, a movable mirror, a tuning fork or an adjustable gray filter provided somewhere in the light path of the reference light ray. 14. Measuring device according to claim 8, wherein one of the first or second signal modulation device is a device controlling the light source. 15. Measuring device according to claim 8, wherein the beam splitter is an asymmetrical beam splitter dividing the first light beam into a signal light ray and a reference light ray where a larger portion of the first light beam is directed to the signal light ray than to the reference light ray. | Disclosed is a method for measuring the absorbance of light of a substance in a solution in a measuring cell (23; 223′), said method comprising the steps of: transmitting (S1) a first light beam (27; 27′) from a light source (25; 25′) towards a beam splitter (29; 29′); dividing (S3) the first light beam (27; 27′) into a signal light ray (31; 31′) and a reference light ray (33; 33′) by the beam splitter (29; 29′); modulating (S5) the signal light ray (31; 31′); modulating the reference light ray (33; 33′); providing (S9) the measuring cell (23; 23′) such that the signal light ray (31; 31′) passes through the measuring cell; detecting (S11) a signal in a detectoR (39; 39′), which signal is the combined signal intensity of the signal light ray (31; 31′) and the reference light ray (33; 33′) detected by the detector (39; 39′); performing synchronous detection (S15) of the detected signal in order to reconstruct the intensities of the signal light ray (31; 31′) and the reference light ray (33; 33′) from the combined signal detected by the detector (39; 39′), said synchronous detection being based on the modulation performed to the signal light ray and the reference light ray. Disclosed also is a measuring device for carrying out said method1. A method for measuring the absorbance of light of a substance in a solution in a measuring cell, said method comprising the steps of:
transmitting a first light beam from a light source towards a beam splitter; dividing the first light beam into a signal light ray and a reference light ray by the beam splitter; modulating the signal light ray; modulating the reference light ray; providing the measuring cell such that the signal light ray passes through the measuring cell; detecting a signal in a detector, which signal is the combined signal intensity of the signal light ray and the reference light ray detected by the detector; performing synchronous detection of the detected signal in order to reconstruct the intensities of the signal light ray and the reference light ray from the combined signal detected by the detector, said synchronous detection being based on the modulation performed to the signal light ray and the reference light ray. 2. Method according to claim 1, wherein the signal light ray and the reference light ray are detected in the same detector simultaneously. 3. Method according to claim 1, wherein the step of modulating the signal light ray comprises modulating the signal light ray at a first frequency and the step of modulating the reference light ray comprises modulating the reference light ray at a second frequency which is different from the first frequency. 4. Method according to claim 1, wherein the steps of modulating the signal light ray and the reference light ray comprise creating a sine modulation or a square wave modulation to both the signal light ray and the reference light ray. 5. Method according to claim 1, wherein the measuring cell is a flow cell. 6. Method according to claim 1, further comprising the step of changing direction of one or both of the signal light ray and the reference light ray with at least one light direction changing device such that both the signal light ray and the reference light ray can be detected by the same detector. 7. Method according to claim 1, wherein the step of modulating one of the signal light ray or the reference light ray comprises controlling the light source. 8. A measuring device for measuring the absorbance of a substance in a solution in a measuring cell of the measuring device, wherein said measuring device comprises:
a light source transmitting a first light beam; a beam splitter provided such that the first light beam is divided by the beam splitter into a signal light ray and a reference light ray; the measuring cell positioned such that the signal light ray will pass through the measuring cell; a first signal modulation device arranged to modulate the signal light ray; and a second signal modulation device arranged to modulate the reference light ray; and a detector arranged to detect the signal light ray when it has been modulated and passed the measuring cell and also detect the reference light ray when it has been modulated, wherein the detector comprises or is connected to a processing device which is configured for performing synchronous detection of the detected signal in order to reconstruct the intensities of the signal light ray and the reference light ray from the combined signal detected by the detector, said synchronous detection being based on the modulation performed to the signal light ray and the reference light ray. 9. A measuring device according to claim 8, further comprising at least one light direction changing device arranged to change the direction of the reference light ray or the signal light ray such that they can be detected by the same detector. 10. Measuring device according to claim 8, wherein the measuring cell is a flow cell. 11. Measuring device according to claim 8, wherein the first signal modulation device and the second signal modulation device are arranged to modulate the signals at different frequencies. 12. Measuring device according to claim 8, wherein the first signal modulation device is a chopper, a shutter, a movable mirror, a tuning fork or an adjustable gray filter provided somewhere in the light path of the signal light ray. 13. Measuring device according to claim 8, wherein the second signal modulation device is a chopper, a shutter, a movable mirror, a tuning fork or an adjustable gray filter provided somewhere in the light path of the reference light ray. 14. Measuring device according to claim 8, wherein one of the first or second signal modulation device is a device controlling the light source. 15. Measuring device according to claim 8, wherein the beam splitter is an asymmetrical beam splitter dividing the first light beam into a signal light ray and a reference light ray where a larger portion of the first light beam is directed to the signal light ray than to the reference light ray. | 2,800 |
12,316 | 12,316 | 15,648,138 | 2,846 | The invention relates to an electric compressor control device comprising a low-voltage domain. The low-voltage domain comprises a first control unit set up to process control commands for the control of the electric compressor, and a first voltage supply set up to supply the first control unit and connected to a low-voltage source. The low-voltage domain comprises furthermore a high-voltage domain. The high-voltage domain comprises a second control unit set up to control a power output stage, wherein the power output state inverts a dc voltage from a high-voltage source into an ac voltage in order to supply a motor of the electric compressor with the ac voltage. The high-voltage domain comprises furthermore a second voltage supply set up to supply the second control unit and connected to the high-voltage source. | 1. A control device for an electric compressor, wherein the control device comprises:
a low-voltage domain that comprises:
a first control unit set up to process control commands for controlling the electric compressor and
a first voltage supply set up to supply the first control unit and connected to a low-voltage source; and
a high-voltage domain that comprises:
a second control unit set up to control a power output stage, wherein the power output stage inverts a dc voltage from a high-voltage source into an ac voltage in order to supply a motor of the electric compressor with the ac voltage, and
a second voltage supply set up to supply the second control unit and connected to the high-voltage source. 2. A control device as in claim 1, wherein the high-voltage domain comprises furthermore a start-up unit set up to start up the second voltage supply during a switch-on process of the control device. 3. A control device as in claim 2, wherein the second voltage supply comprises a switching regulator and the start-up unit limits a voltage rise at the switching regulator during the switch-on process. 4. A control device according to claim 1, wherein the high-voltage domain comprises furthermore a discharge unit set up to discharge the high-voltage domain during a switch-off process of the control device. 5. A control device according to claim 1, wherein the high-voltage domain comprises furthermore an overvoltage unit set up to switch off the second voltage supply should the voltage of the high-voltage source exceed a threshold value. 6. A control device as in claim 5, wherein the second voltage supply comprises a switching regulator with a PWM control and the overvoltage unit switches off the PWM control should the voltage of the high-voltage source exceed a threshold value. 7. A control device according to claim 1, wherein the high-voltage domain and the low-voltage domain are galvanically isolated and the first control unit and the second control unit are communicating with one another by means of an isolating communication interface. 8. A control device according to claim 1, wherein the first voltage supply and/or the second voltage supply comprise or comprises a switching regulator. 9. A control device according to claim 1, wherein the second voltage supply comprises several storage inductors, all of which are driven by a PWM control. 10. An electric compressor with a control device according to claim 1. 11. A control device according to claim 2, wherein the high-voltage domain comprises furthermore a discharge unit set up to discharge the high-voltage domain during a switch-off process of the control device. 12. A control device according to claim 3, wherein the high-voltage domain comprises furthermore a discharge unit set up to discharge the high-voltage domain during a switch-off process of the control device. 13. A control device according to claim 2, wherein the high-voltage domain comprises furthermore an overvoltage unit set up to switch off the second voltage supply should the voltage of the high-voltage source exceed a threshold value. 14. A control device according to claim 3, wherein the high-voltage domain comprises furthermore an overvoltage unit set up to switch off the second voltage supply should the voltage of the high-voltage source exceed a threshold value. 15. A control device according to claim 4, wherein the high-voltage domain comprises furthermore an overvoltage unit set up to switch off the second voltage supply should the voltage of the high-voltage source exceed a threshold value. 16. A control device as in claim 13, wherein the second voltage supply comprises a switching regulator with a PWM control and the overvoltage unit switches off the PWM control should the voltage of the high-voltage source exceed a threshold value. 17. A control device as in claim 14, wherein the second voltage supply comprises a switching regulator with a PWM control and the overvoltage unit switches off the PWM control should the voltage of the high-voltage source exceed a threshold value. 18. A control device as in claim 15, wherein the second voltage supply comprises a switching regulator with a PWM control and the overvoltage unit switches off the PWM control should the voltage of the high-voltage source exceed a threshold value. 19. A control device according to claim 2, wherein the high-voltage domain and the low-voltage domain are galvanically isolated and the first control unit and the second control unit are communicating with one another by means of an isolating communication interface. 20. A control device according to claim 3, wherein the high-voltage domain and the low-voltage domain are galvanically isolated and the first control unit and the second control unit are communicating with one another by means of an isolating communication interface. | The invention relates to an electric compressor control device comprising a low-voltage domain. The low-voltage domain comprises a first control unit set up to process control commands for the control of the electric compressor, and a first voltage supply set up to supply the first control unit and connected to a low-voltage source. The low-voltage domain comprises furthermore a high-voltage domain. The high-voltage domain comprises a second control unit set up to control a power output stage, wherein the power output state inverts a dc voltage from a high-voltage source into an ac voltage in order to supply a motor of the electric compressor with the ac voltage. The high-voltage domain comprises furthermore a second voltage supply set up to supply the second control unit and connected to the high-voltage source.1. A control device for an electric compressor, wherein the control device comprises:
a low-voltage domain that comprises:
a first control unit set up to process control commands for controlling the electric compressor and
a first voltage supply set up to supply the first control unit and connected to a low-voltage source; and
a high-voltage domain that comprises:
a second control unit set up to control a power output stage, wherein the power output stage inverts a dc voltage from a high-voltage source into an ac voltage in order to supply a motor of the electric compressor with the ac voltage, and
a second voltage supply set up to supply the second control unit and connected to the high-voltage source. 2. A control device as in claim 1, wherein the high-voltage domain comprises furthermore a start-up unit set up to start up the second voltage supply during a switch-on process of the control device. 3. A control device as in claim 2, wherein the second voltage supply comprises a switching regulator and the start-up unit limits a voltage rise at the switching regulator during the switch-on process. 4. A control device according to claim 1, wherein the high-voltage domain comprises furthermore a discharge unit set up to discharge the high-voltage domain during a switch-off process of the control device. 5. A control device according to claim 1, wherein the high-voltage domain comprises furthermore an overvoltage unit set up to switch off the second voltage supply should the voltage of the high-voltage source exceed a threshold value. 6. A control device as in claim 5, wherein the second voltage supply comprises a switching regulator with a PWM control and the overvoltage unit switches off the PWM control should the voltage of the high-voltage source exceed a threshold value. 7. A control device according to claim 1, wherein the high-voltage domain and the low-voltage domain are galvanically isolated and the first control unit and the second control unit are communicating with one another by means of an isolating communication interface. 8. A control device according to claim 1, wherein the first voltage supply and/or the second voltage supply comprise or comprises a switching regulator. 9. A control device according to claim 1, wherein the second voltage supply comprises several storage inductors, all of which are driven by a PWM control. 10. An electric compressor with a control device according to claim 1. 11. A control device according to claim 2, wherein the high-voltage domain comprises furthermore a discharge unit set up to discharge the high-voltage domain during a switch-off process of the control device. 12. A control device according to claim 3, wherein the high-voltage domain comprises furthermore a discharge unit set up to discharge the high-voltage domain during a switch-off process of the control device. 13. A control device according to claim 2, wherein the high-voltage domain comprises furthermore an overvoltage unit set up to switch off the second voltage supply should the voltage of the high-voltage source exceed a threshold value. 14. A control device according to claim 3, wherein the high-voltage domain comprises furthermore an overvoltage unit set up to switch off the second voltage supply should the voltage of the high-voltage source exceed a threshold value. 15. A control device according to claim 4, wherein the high-voltage domain comprises furthermore an overvoltage unit set up to switch off the second voltage supply should the voltage of the high-voltage source exceed a threshold value. 16. A control device as in claim 13, wherein the second voltage supply comprises a switching regulator with a PWM control and the overvoltage unit switches off the PWM control should the voltage of the high-voltage source exceed a threshold value. 17. A control device as in claim 14, wherein the second voltage supply comprises a switching regulator with a PWM control and the overvoltage unit switches off the PWM control should the voltage of the high-voltage source exceed a threshold value. 18. A control device as in claim 15, wherein the second voltage supply comprises a switching regulator with a PWM control and the overvoltage unit switches off the PWM control should the voltage of the high-voltage source exceed a threshold value. 19. A control device according to claim 2, wherein the high-voltage domain and the low-voltage domain are galvanically isolated and the first control unit and the second control unit are communicating with one another by means of an isolating communication interface. 20. A control device according to claim 3, wherein the high-voltage domain and the low-voltage domain are galvanically isolated and the first control unit and the second control unit are communicating with one another by means of an isolating communication interface. | 2,800 |
12,317 | 12,317 | 16,094,048 | 2,813 | An organic light emitting diode (OLED) cushioning film including a foamed layer is described. The foamed layer includes an olefin-styrene block copolymer at 30 to 80 weight percent and a tackifier at 15 to 60 weight percent. The tackifier has a softening point of at least 130° C. A light emitting article including an OLED layer laminated to the OLED cushioning film is described. | 1. An organic light emitting diode (OLED) cushioning film comprising a foamed layer, the foamed layer comprising an olefin-styrene block copolymer at 30 to 80 weight percent and a tackifier at 15 to 60 weight percent, wherein the tackifier has a softening point of at least 130° C. 2. The OLED cushioning film of claim 1, further comprising a first layer attached to a first major surface of the foamed layer. 3. The OLED cushioning film of claim 2, wherein the first layer is an adhesive layer. 4. The OLED cushioning film of claim 3, further comprising a release liner disposed on the adhesive layer. 5. The OLED cushioning film of claim 4, wherein the release liner has a structured release surface facing the adhesive layer. 6. The OLED cushioning film of claim 2, further comprising a second layer attached to a second major surface of the foamed layer opposite the first major surface. 7. The OLED cushioning film of claim 6, wherein one or both of the first and second layers are foamed. 8. The OLED cushioning film of claim 6, wherein each of the first and second layers has a thickness in a range of 0.1 to 0.5 times a thickness of the foamed layer. 9. The OLED cushioning film of claim 1, wherein the olefin-styrene block copolymer comprises styrene blocks at 5 to 50 weight percent. 10. The OLED cushioning film of claim 1, wherein the olefin-styrene block copolymer comprises olefin blocks selected from the group consisting of ethylene, propylene, isoprene, octane, butylene, and copolymers thereof. 11. The OLED cushioning film of claim 1, wherein the tackifer is selected from the group consisting of C5 hydrocarbons, C9 hydrocarbons, aliphatic resins, aromatic resins, terpenes, terpenoids, terpene phenolic resins, rosins, rosin esters, and combinations thereof. 12. The OLED cushioning film of claim 1, wherein the foamed layer has a density in a range of 0.5 to 0.9 g/cc. 13. The OLED cushioning film of claim 1, wherein the foamed layer comprises a plurality of cells, the plurality of cells having an average cell size between 5 micrometers and 100 micrometers. 14. The OLED cushioning film of claim 1, wherein the foamed layer has a porosity in a range of 5 to 50 percent. 15. The OLED cushioning film of claim 1, wherein the foamed layer comprises a plurality of cells, at least a majority of the cells being closed cells. 16. A light emitting article comprising an organic light emitting diode (OLED) layer disposed on an OLED cushioning film according to claim 1. 17. A light emitting article comprising an organic light emitting diode (OLED) layer laminated to an OLED cushioning film with an adhesive layer, the OLED cushioning film comprising a foamed layer, the foamed layer comprising an olefin-styrene block copolymer at 30 to 80 weight percent and a tackifier at 15 to 60 weight percent, wherein the tackifier has a softening point of at least 130° C., the adhesive layer having air-bleed channels adjacent the OLED layer. 18. The light emitting article of claim 17 further comprising a heat spreading layer laminated to the OLED cushioning film opposite the OLED layer. 19. The light emitting article of claim 18, further comprising one or more additional layers disposed between the heat spreading layer and the OLED cushioning film. 20. The light emitting article of claim 18, further comprising an electromagnetic interference shield laminated to the heat spreading layer opposite the OLED cushioning film. | An organic light emitting diode (OLED) cushioning film including a foamed layer is described. The foamed layer includes an olefin-styrene block copolymer at 30 to 80 weight percent and a tackifier at 15 to 60 weight percent. The tackifier has a softening point of at least 130° C. A light emitting article including an OLED layer laminated to the OLED cushioning film is described.1. An organic light emitting diode (OLED) cushioning film comprising a foamed layer, the foamed layer comprising an olefin-styrene block copolymer at 30 to 80 weight percent and a tackifier at 15 to 60 weight percent, wherein the tackifier has a softening point of at least 130° C. 2. The OLED cushioning film of claim 1, further comprising a first layer attached to a first major surface of the foamed layer. 3. The OLED cushioning film of claim 2, wherein the first layer is an adhesive layer. 4. The OLED cushioning film of claim 3, further comprising a release liner disposed on the adhesive layer. 5. The OLED cushioning film of claim 4, wherein the release liner has a structured release surface facing the adhesive layer. 6. The OLED cushioning film of claim 2, further comprising a second layer attached to a second major surface of the foamed layer opposite the first major surface. 7. The OLED cushioning film of claim 6, wherein one or both of the first and second layers are foamed. 8. The OLED cushioning film of claim 6, wherein each of the first and second layers has a thickness in a range of 0.1 to 0.5 times a thickness of the foamed layer. 9. The OLED cushioning film of claim 1, wherein the olefin-styrene block copolymer comprises styrene blocks at 5 to 50 weight percent. 10. The OLED cushioning film of claim 1, wherein the olefin-styrene block copolymer comprises olefin blocks selected from the group consisting of ethylene, propylene, isoprene, octane, butylene, and copolymers thereof. 11. The OLED cushioning film of claim 1, wherein the tackifer is selected from the group consisting of C5 hydrocarbons, C9 hydrocarbons, aliphatic resins, aromatic resins, terpenes, terpenoids, terpene phenolic resins, rosins, rosin esters, and combinations thereof. 12. The OLED cushioning film of claim 1, wherein the foamed layer has a density in a range of 0.5 to 0.9 g/cc. 13. The OLED cushioning film of claim 1, wherein the foamed layer comprises a plurality of cells, the plurality of cells having an average cell size between 5 micrometers and 100 micrometers. 14. The OLED cushioning film of claim 1, wherein the foamed layer has a porosity in a range of 5 to 50 percent. 15. The OLED cushioning film of claim 1, wherein the foamed layer comprises a plurality of cells, at least a majority of the cells being closed cells. 16. A light emitting article comprising an organic light emitting diode (OLED) layer disposed on an OLED cushioning film according to claim 1. 17. A light emitting article comprising an organic light emitting diode (OLED) layer laminated to an OLED cushioning film with an adhesive layer, the OLED cushioning film comprising a foamed layer, the foamed layer comprising an olefin-styrene block copolymer at 30 to 80 weight percent and a tackifier at 15 to 60 weight percent, wherein the tackifier has a softening point of at least 130° C., the adhesive layer having air-bleed channels adjacent the OLED layer. 18. The light emitting article of claim 17 further comprising a heat spreading layer laminated to the OLED cushioning film opposite the OLED layer. 19. The light emitting article of claim 18, further comprising one or more additional layers disposed between the heat spreading layer and the OLED cushioning film. 20. The light emitting article of claim 18, further comprising an electromagnetic interference shield laminated to the heat spreading layer opposite the OLED cushioning film. | 2,800 |
12,318 | 12,318 | 15,937,829 | 2,833 | Intravascular devices, systems, and methods are disclosed. In some embodiments, side-loading electrical connectors for use with intravascular devices are provided. The side-loading electrical connector has at least one electrical contact configured to interface with an electrical connector of the intravascular device. A first connection piece of the side-loading electrical connector is movable relative to a second connection piece between an open position and a closed position, wherein in the open position an elongated opening is formed between the first and second connection pieces to facilitate insertion of the electrical connector between the first and second connection pieces in a direction transverse to a longitudinal axis of the intravascular device and wherein in the closed position the at least one electrical contact is electrically coupled to the at least one electrical connector received between the first and second connection pieces. | 1. An intravascular system, comprising:
an intravascular device, comprising:
a flexible elongate member configured to be positioned within a vessel of a patient and comprising a proximal portion and a distal portion;
an electronic component disposed at the distal portion of the flexible elongate member; and
a connection portion at the proximal portion of the flexible elongate member, the connection portion comprising at least one electrical contact in communication with the electronic component, wherein the connection portion further comprises a first section comprising a first diameter and a second section comprising a second diameter smaller than the first diameter, wherein the second section comprises a core wire extending through the connection portion, wherein the connection portion is configured to interface with a connector. 2. The system of claim 1, further comprising:
the connector, wherein the connector comprises a first connection piece and a second connection piece movable relative to one another such that the connector is movable between an open position and a closed position, wherein in the open position, the connector is configured to receive the connection portion of the intravascular device in a direction transverse to a longitudinal axis of the intravascular device. 3. The system of claim 2, wherein the connector comprises an alignment feature configured to engage at least one of the first or second sections of the connection portion to align the at least one electrical contact of the intravascular device with at least one electrical contact of the connector. 4. The system of claim 3, wherein the alignment feature comprises an opening sized and shaped to receive the second section of the connection portion of the intravascular device. 5. The system of claim 4, wherein a width of the opening is greater than the second diameter but is less than the first diameter. 6. The system of claim 4, wherein the width of the opening is between about 0.0254 mm and about 0.254 mm greater than the second diameter. 7. The system of claim 4, wherein the opening comprises a concave bottom surface. 8. The system of claim 4, wherein the connector comprises an outer surface, and wherein the alignment features further comprises a recessed surface and a cutout surface extending between the outer surface and the recessed surface. 9. The system of claim 8, wherein the intravascular device further comprises a third section proximal to the second section, and wherein when the alignment feature of engages the second section of the connection portion of the intravascular device, the recessed surface is configured to engage the third section. 10. The system of claim 9, wherein the third section has a third diameter equal to or greater than the first diameter. 11. The system of claim 3, wherein in the closed position the at least one electrical contact of the intravascular device is electrically coupled to the at least one electrical contact of the connector. 13. The system of claim 3, wherein at least one electrical contact of the connector comprises a split open comb electrical contact. 14. The system of claim 2, wherein the connector further includes a bias element that urges the first and second connection pieces towards the closed position. 15. The system of claim 1, wherein the at least one electrical contact of the intravascular device consists of a plurality of electrical connectors. 16. The system of claim 1, wherein the at least one electronic component of the intravascular device is a pressure sensing component. 17. The system of claim 1, wherein the at least one electronic component of the intravascular device is an intravascular imaging component. 18. The system of claim 17, wherein the intravascular imaging component includes at least one of an ultrasound transducer and an optical coherence tomography (OCT) imaging element. | Intravascular devices, systems, and methods are disclosed. In some embodiments, side-loading electrical connectors for use with intravascular devices are provided. The side-loading electrical connector has at least one electrical contact configured to interface with an electrical connector of the intravascular device. A first connection piece of the side-loading electrical connector is movable relative to a second connection piece between an open position and a closed position, wherein in the open position an elongated opening is formed between the first and second connection pieces to facilitate insertion of the electrical connector between the first and second connection pieces in a direction transverse to a longitudinal axis of the intravascular device and wherein in the closed position the at least one electrical contact is electrically coupled to the at least one electrical connector received between the first and second connection pieces.1. An intravascular system, comprising:
an intravascular device, comprising:
a flexible elongate member configured to be positioned within a vessel of a patient and comprising a proximal portion and a distal portion;
an electronic component disposed at the distal portion of the flexible elongate member; and
a connection portion at the proximal portion of the flexible elongate member, the connection portion comprising at least one electrical contact in communication with the electronic component, wherein the connection portion further comprises a first section comprising a first diameter and a second section comprising a second diameter smaller than the first diameter, wherein the second section comprises a core wire extending through the connection portion, wherein the connection portion is configured to interface with a connector. 2. The system of claim 1, further comprising:
the connector, wherein the connector comprises a first connection piece and a second connection piece movable relative to one another such that the connector is movable between an open position and a closed position, wherein in the open position, the connector is configured to receive the connection portion of the intravascular device in a direction transverse to a longitudinal axis of the intravascular device. 3. The system of claim 2, wherein the connector comprises an alignment feature configured to engage at least one of the first or second sections of the connection portion to align the at least one electrical contact of the intravascular device with at least one electrical contact of the connector. 4. The system of claim 3, wherein the alignment feature comprises an opening sized and shaped to receive the second section of the connection portion of the intravascular device. 5. The system of claim 4, wherein a width of the opening is greater than the second diameter but is less than the first diameter. 6. The system of claim 4, wherein the width of the opening is between about 0.0254 mm and about 0.254 mm greater than the second diameter. 7. The system of claim 4, wherein the opening comprises a concave bottom surface. 8. The system of claim 4, wherein the connector comprises an outer surface, and wherein the alignment features further comprises a recessed surface and a cutout surface extending between the outer surface and the recessed surface. 9. The system of claim 8, wherein the intravascular device further comprises a third section proximal to the second section, and wherein when the alignment feature of engages the second section of the connection portion of the intravascular device, the recessed surface is configured to engage the third section. 10. The system of claim 9, wherein the third section has a third diameter equal to or greater than the first diameter. 11. The system of claim 3, wherein in the closed position the at least one electrical contact of the intravascular device is electrically coupled to the at least one electrical contact of the connector. 13. The system of claim 3, wherein at least one electrical contact of the connector comprises a split open comb electrical contact. 14. The system of claim 2, wherein the connector further includes a bias element that urges the first and second connection pieces towards the closed position. 15. The system of claim 1, wherein the at least one electrical contact of the intravascular device consists of a plurality of electrical connectors. 16. The system of claim 1, wherein the at least one electronic component of the intravascular device is a pressure sensing component. 17. The system of claim 1, wherein the at least one electronic component of the intravascular device is an intravascular imaging component. 18. The system of claim 17, wherein the intravascular imaging component includes at least one of an ultrasound transducer and an optical coherence tomography (OCT) imaging element. | 2,800 |
12,319 | 12,319 | 15,302,877 | 2,855 | A sensor element with a thin-film structure is made of platinum or a platinum alloy. The structure being applied to a ceramic substrate, in particular an Al 2 O 3 substrate and being covered by a glass-ceramic coating. The glass-ceramic coating has an outer surface with surface profiling. A sensor module, a measuring assembly, and an exhaust-gas re-circulation system include the sensor element. | 1. A sensor element comprising:
a ceramic substrate comprising Al2O3; a thin-layer structure comprising platinum or a platinum alloy applied to the ceramic substrate; and a glass-ceramic coating applied to the respective platinum or the platinum alloy; wherein the glass-ceramic coating comprises an outer surface, the outer surface comprises a surface profiling. 2. The sensor element as claimed in claim 1, wherein the surface profiling has a dimple structure or a bump structure. 3. The sensor element as claimed in claim 2, wherein the dimple structure or the bump structure has regularly or irregularly arranged dimples or bumps. 4. The sensor element as claimed in claim 1, wherein the surface profiling comprises Al2O3 particles fused with the glass-ceramic coating. 5. The sensor element as claimed in claim 1, wherein the outer surface of the glass-ceramic coating is flocked with additional coating particles, the coating particles forming the surface profiling. 6. The sensor element as claimed in claim 1, wherein the surface profiling is formed by a screen-printed structure or a laser-structured fused structure. 7. The sensor element as claimed in claim 1; wherein the surface profiling extends over the glass-ceramic coating and the substrate. 8. A sensor module comprising:
a sensor structure having a plurality of sensor elements, at least one sensor element comprising
a ceramic substrate comprising Al2O3;
a thin-layer structure comprising platinum or a platinum alloy applied to the ceramic substrate; and
a glass-ceramic coating applied to the respective platinum or the platinum alloy;
wherein the glass-ceramic coating comprises an outer surface, the outer surface comprises a surface profiling. 9. The sensor module as claimed in claim 8, wherein the at least one sensor element comprises at least one temperature measuring element or at least one heat output measuring element. 10. The sensor module as claimed in claim 8, wherein the sensor module comprises an anemometric measuring device having a constant-temperature control loop. 11. A measuring assembly comprising:
a flow pipe; sensor module comprising
a sensor structure having a plurality of sensor elements, at least one sensor element comprising
a ceramic substrate comprising Al2O3;
a thin-layer structure comprising platinum or a platinum alloy applied to the ceramic substrate; and
a glass-ceramic coating applied to the respective platinum or the platinum alloy;
wherein the glass-ceramic coating comprises an outer surface, the outer surface comprises a surface profiling. wherein the at least one sensor element projects radially into the flow pipe, and wherein at least one outer surface of the at least one sensor elements that is arranged within the flow has the surface profiling. 12. The measuring assembly as claimed in claim 11, wherein the flow pipe is a pipe that re-circulates exhaust gas. 13.-17. (canceled) | A sensor element with a thin-film structure is made of platinum or a platinum alloy. The structure being applied to a ceramic substrate, in particular an Al 2 O 3 substrate and being covered by a glass-ceramic coating. The glass-ceramic coating has an outer surface with surface profiling. A sensor module, a measuring assembly, and an exhaust-gas re-circulation system include the sensor element.1. A sensor element comprising:
a ceramic substrate comprising Al2O3; a thin-layer structure comprising platinum or a platinum alloy applied to the ceramic substrate; and a glass-ceramic coating applied to the respective platinum or the platinum alloy; wherein the glass-ceramic coating comprises an outer surface, the outer surface comprises a surface profiling. 2. The sensor element as claimed in claim 1, wherein the surface profiling has a dimple structure or a bump structure. 3. The sensor element as claimed in claim 2, wherein the dimple structure or the bump structure has regularly or irregularly arranged dimples or bumps. 4. The sensor element as claimed in claim 1, wherein the surface profiling comprises Al2O3 particles fused with the glass-ceramic coating. 5. The sensor element as claimed in claim 1, wherein the outer surface of the glass-ceramic coating is flocked with additional coating particles, the coating particles forming the surface profiling. 6. The sensor element as claimed in claim 1, wherein the surface profiling is formed by a screen-printed structure or a laser-structured fused structure. 7. The sensor element as claimed in claim 1; wherein the surface profiling extends over the glass-ceramic coating and the substrate. 8. A sensor module comprising:
a sensor structure having a plurality of sensor elements, at least one sensor element comprising
a ceramic substrate comprising Al2O3;
a thin-layer structure comprising platinum or a platinum alloy applied to the ceramic substrate; and
a glass-ceramic coating applied to the respective platinum or the platinum alloy;
wherein the glass-ceramic coating comprises an outer surface, the outer surface comprises a surface profiling. 9. The sensor module as claimed in claim 8, wherein the at least one sensor element comprises at least one temperature measuring element or at least one heat output measuring element. 10. The sensor module as claimed in claim 8, wherein the sensor module comprises an anemometric measuring device having a constant-temperature control loop. 11. A measuring assembly comprising:
a flow pipe; sensor module comprising
a sensor structure having a plurality of sensor elements, at least one sensor element comprising
a ceramic substrate comprising Al2O3;
a thin-layer structure comprising platinum or a platinum alloy applied to the ceramic substrate; and
a glass-ceramic coating applied to the respective platinum or the platinum alloy;
wherein the glass-ceramic coating comprises an outer surface, the outer surface comprises a surface profiling. wherein the at least one sensor element projects radially into the flow pipe, and wherein at least one outer surface of the at least one sensor elements that is arranged within the flow has the surface profiling. 12. The measuring assembly as claimed in claim 11, wherein the flow pipe is a pipe that re-circulates exhaust gas. 13.-17. (canceled) | 2,800 |
12,320 | 12,320 | 16,270,474 | 2,868 | A subterranean zone fluid sample tool includes an elongated tubular tool body configured to be disposed within a wellbore formed in a subterranean zone including multiple formations. The tool body includes multiple axial portions. The tool body has a length sufficient for a respective axial portion of the multiple axial portions to reside in each formation of the multiple formations. The tool includes multiple fluid sample probes configured to sample fluids in the multiple formations. The multiple fluid sample probes are radially offset from each other on a circumferential surface of the tool body. Each fluid sample probe is attached to a respective axial portion of the tool body that is configured to reside in a respective formation. The multiple fluid sample probes are configured to simultaneously sample fluids in the respective formation. | 1. A well tool comprising:
an elongated tubular tool body configured to be disposed within a wellbore formed in a subterranean zone comprising a plurality of formations, the tool body comprising a plurality of axial portions, the tool body having a length sufficient for a respective axial portion of the plurality of axial portions to reside in each formation of the plurality of formations; and a plurality of fluid sample probes configured to sample fluids in the plurality of formations, the plurality of fluid sample probes radially offset from each other on a circumferential surface of the tool body, each fluid sample probe attached to a respective axial portion of the tool body that is configured to reside in a respective formation, the plurality of fluid sample probes configured to simultaneously sample respective fluids in the respective formation. 2. The well tool of claim 1, further comprising a plurality of packers attached to the tool body, the plurality of packers configured to isolate the plurality of axial portions from each other. 3. The well tool of claim 1, wherein each fluid sample probe comprises:
a sample drawing portion residing within the tool body and configured to extend radially outside the tool body and contact the respective formation, the sample drawing portion configured to draw the fluid from the respective formation; and a carrier residing within the tool body and carrying the sample drawing portion, the carrier configured to extend or retract the sample drawing portion. 4. The well tool of claim 3, wherein the sample drawing portion is configured to be extended or retract radially from the carrier in response to a control signal. 5. The well tool of claim 3, further comprising a plurality of flowlines fluidically coupled to the plurality of fluid sample probes, the plurality of flowlines residing within the tool body, each flowline configured to flow the sample sampled by the respective fluid sample probe. 6. The well tool of claim 5, further comprising a plurality pumps fluidically coupled to the plurality of flowlines, the plurality of pumps residing within the tool body, each pump configured to flow the sample through the respective flowline. 7. The well tool of claim 6, wherein each pump is configured to operate at a subsurface location in the subterranean zone. 8. The well tool of claim 6, wherein each pump comprises a bi-directional pump. 9. The well tool of claim 5, further comprising a plurality of fluid analyzer modules fluidically coupled to the plurality of fluid sample probes, the plurality of fluid analyzer modules residing within the tool body, each fluid analyzer module configured to analyze the sample sampled by the respective fluid sample probe. 10. The well tool of claim 9, wherein the plurality of fluid analyzer modules are configured to operate at a subsurface location in the subterranean zone. 11. The well tool of claim 9, wherein each fluid analyzer module comprises a fluorescence detector. 12. The well tool of claim 9, wherein each fluid analyzer is configured to determine a resistivity of the sample. 13. The well tool of claim 5, further comprising a plurality of sampling chambers fluidically coupled to the plurality of flowlines, the plurality of sampling chambers residing within the tool body, each sampling chamber configured to receive and collect the sample sampled by the respective fluid sample probe. 14. The well tool of claim 13, further comprising a plurality of pump out ports fluidically coupled to the plurality of flowlines between the plurality of fluid sample probes and the plurality of sampling chambers, the plurality of pump out ports residing within the tool body, each pump out port configured to divert a portion of the sample sampled by the respective fluid sample probe away from a respective fluid sampling chamber. 15. The well tool of claim 1, wherein the plurality of fluid sample probes comprises three fluid sample probes radially offset from each other by 120° on the circumferential surface of the tool body. 16. A method comprising:
positioning a well tool within a wellbore formed in a subterranean zone comprising a plurality of formations, the well tool carrying a plurality of fluid sample probes at a respective plurality of axial portions of the well tool, each portion positioned in a respective formation of the plurality of formations, each fluid sample probe configured to sample a fluid in the respective formation; and simultaneously operating the plurality of fluid sample probes to sample a plurality of fluids from the plurality of formations. 17. The method of claim 16, further comprising radially offsetting the plurality of fluid sample probes from each other on a circumferential surface of the tool body. 18. The method of claim 16, further comprising:
determining distances between the plurality of formations; assembling the well tool outside the wellbore based on the distances; lowering the well tool into the wellbore to operate the plurality of fluid sample probes to sample the plurality of fluids; and raising the well tool with the plurality of fluids to the surface of the wellbore to obtain the plurality of fluids. 19. The method of claim 16, wherein each fluid sample probe comprises:
a sample drawing portion residing within the tool body and configured to extend radially outside the tool body and contact the respective formation, the sample drawing portion configured to draw the fluid from the respective formation; and a carrier residing within the tool body and carrying the sample drawing portion, the carrier configured to carry the sample drawing portion, wherein simultaneously operating the plurality of fluid sample probes comprises:
radially extending each sample drawing portion away from and outside the tool body to contact the respective formation, and
after drawing the fluid from the respective formation, radially retracting each sample drawing portion into the tool body. 20. A well tool system comprising:
a well tool comprising:
an elongated tubular tool body configured to be disposed within a wellbore formed in a subterranean zone comprising a plurality of formations, the tool body comprising a plurality of axial portions, the tool body having a length sufficient for a respective axial portion of the plurality of axial portions to reside in each formation of the plurality of formations, and
a plurality of fluid sample probes configured to sample fluids in the plurality of formations, each fluid sample probe attached to a respective axial portion of the tool body that is configured to reside in a respective formation, each fluid sample probe configured to sample a fluid in the respective formation; and
a controller configured to reside at a surface of the wellbore, the controller coupled to the well tool, the controller configured to simultaneously operate the plurality of fluid sample probes to sample a plurality of fluids from the plurality of formations. | A subterranean zone fluid sample tool includes an elongated tubular tool body configured to be disposed within a wellbore formed in a subterranean zone including multiple formations. The tool body includes multiple axial portions. The tool body has a length sufficient for a respective axial portion of the multiple axial portions to reside in each formation of the multiple formations. The tool includes multiple fluid sample probes configured to sample fluids in the multiple formations. The multiple fluid sample probes are radially offset from each other on a circumferential surface of the tool body. Each fluid sample probe is attached to a respective axial portion of the tool body that is configured to reside in a respective formation. The multiple fluid sample probes are configured to simultaneously sample fluids in the respective formation.1. A well tool comprising:
an elongated tubular tool body configured to be disposed within a wellbore formed in a subterranean zone comprising a plurality of formations, the tool body comprising a plurality of axial portions, the tool body having a length sufficient for a respective axial portion of the plurality of axial portions to reside in each formation of the plurality of formations; and a plurality of fluid sample probes configured to sample fluids in the plurality of formations, the plurality of fluid sample probes radially offset from each other on a circumferential surface of the tool body, each fluid sample probe attached to a respective axial portion of the tool body that is configured to reside in a respective formation, the plurality of fluid sample probes configured to simultaneously sample respective fluids in the respective formation. 2. The well tool of claim 1, further comprising a plurality of packers attached to the tool body, the plurality of packers configured to isolate the plurality of axial portions from each other. 3. The well tool of claim 1, wherein each fluid sample probe comprises:
a sample drawing portion residing within the tool body and configured to extend radially outside the tool body and contact the respective formation, the sample drawing portion configured to draw the fluid from the respective formation; and a carrier residing within the tool body and carrying the sample drawing portion, the carrier configured to extend or retract the sample drawing portion. 4. The well tool of claim 3, wherein the sample drawing portion is configured to be extended or retract radially from the carrier in response to a control signal. 5. The well tool of claim 3, further comprising a plurality of flowlines fluidically coupled to the plurality of fluid sample probes, the plurality of flowlines residing within the tool body, each flowline configured to flow the sample sampled by the respective fluid sample probe. 6. The well tool of claim 5, further comprising a plurality pumps fluidically coupled to the plurality of flowlines, the plurality of pumps residing within the tool body, each pump configured to flow the sample through the respective flowline. 7. The well tool of claim 6, wherein each pump is configured to operate at a subsurface location in the subterranean zone. 8. The well tool of claim 6, wherein each pump comprises a bi-directional pump. 9. The well tool of claim 5, further comprising a plurality of fluid analyzer modules fluidically coupled to the plurality of fluid sample probes, the plurality of fluid analyzer modules residing within the tool body, each fluid analyzer module configured to analyze the sample sampled by the respective fluid sample probe. 10. The well tool of claim 9, wherein the plurality of fluid analyzer modules are configured to operate at a subsurface location in the subterranean zone. 11. The well tool of claim 9, wherein each fluid analyzer module comprises a fluorescence detector. 12. The well tool of claim 9, wherein each fluid analyzer is configured to determine a resistivity of the sample. 13. The well tool of claim 5, further comprising a plurality of sampling chambers fluidically coupled to the plurality of flowlines, the plurality of sampling chambers residing within the tool body, each sampling chamber configured to receive and collect the sample sampled by the respective fluid sample probe. 14. The well tool of claim 13, further comprising a plurality of pump out ports fluidically coupled to the plurality of flowlines between the plurality of fluid sample probes and the plurality of sampling chambers, the plurality of pump out ports residing within the tool body, each pump out port configured to divert a portion of the sample sampled by the respective fluid sample probe away from a respective fluid sampling chamber. 15. The well tool of claim 1, wherein the plurality of fluid sample probes comprises three fluid sample probes radially offset from each other by 120° on the circumferential surface of the tool body. 16. A method comprising:
positioning a well tool within a wellbore formed in a subterranean zone comprising a plurality of formations, the well tool carrying a plurality of fluid sample probes at a respective plurality of axial portions of the well tool, each portion positioned in a respective formation of the plurality of formations, each fluid sample probe configured to sample a fluid in the respective formation; and simultaneously operating the plurality of fluid sample probes to sample a plurality of fluids from the plurality of formations. 17. The method of claim 16, further comprising radially offsetting the plurality of fluid sample probes from each other on a circumferential surface of the tool body. 18. The method of claim 16, further comprising:
determining distances between the plurality of formations; assembling the well tool outside the wellbore based on the distances; lowering the well tool into the wellbore to operate the plurality of fluid sample probes to sample the plurality of fluids; and raising the well tool with the plurality of fluids to the surface of the wellbore to obtain the plurality of fluids. 19. The method of claim 16, wherein each fluid sample probe comprises:
a sample drawing portion residing within the tool body and configured to extend radially outside the tool body and contact the respective formation, the sample drawing portion configured to draw the fluid from the respective formation; and a carrier residing within the tool body and carrying the sample drawing portion, the carrier configured to carry the sample drawing portion, wherein simultaneously operating the plurality of fluid sample probes comprises:
radially extending each sample drawing portion away from and outside the tool body to contact the respective formation, and
after drawing the fluid from the respective formation, radially retracting each sample drawing portion into the tool body. 20. A well tool system comprising:
a well tool comprising:
an elongated tubular tool body configured to be disposed within a wellbore formed in a subterranean zone comprising a plurality of formations, the tool body comprising a plurality of axial portions, the tool body having a length sufficient for a respective axial portion of the plurality of axial portions to reside in each formation of the plurality of formations, and
a plurality of fluid sample probes configured to sample fluids in the plurality of formations, each fluid sample probe attached to a respective axial portion of the tool body that is configured to reside in a respective formation, each fluid sample probe configured to sample a fluid in the respective formation; and
a controller configured to reside at a surface of the wellbore, the controller coupled to the well tool, the controller configured to simultaneously operate the plurality of fluid sample probes to sample a plurality of fluids from the plurality of formations. | 2,800 |
12,321 | 12,321 | 16,096,019 | 2,853 | According to an example, a fluid ejection device may include a membrane including a first column of firing chambers, a second column of firing chambers, and a portioning wall, in which the portioning wall physically separates the first column of firing chambers from the second column of firing chambers. The fluid ejection device may also include a plurality of actuators and a substrate including a respective hole extending through the substrate from each of the firing chambers, in which an actuator of the plurality of actuators is provided in each of the firing chambers. | 1. A fluid ejection device comprising:
a membrane including a first column of firing chambers, a second column of firing chambers, and a portioning wall, wherein the portioning wall physically separates the first column of firing chambers from the second column of firing chambers; a plurality of actuators, wherein an actuator of the plurality of actuators is provided in each of the firing chambers; and a substrate including a respective hole extending through the substrate from each of the firing chambers. 2. The fluid ejection device according to claim 1, wherein the firing chambers in the first column of firing chambers are physically separated from adjacent firing chambers in the first column of firing chambers by side walls and wherein the firing chambers in the second column of firing chambers are physically separated from adjacent firing chambers in the second column of firing chambers by side walls. 3. The fluid ejection device according to claim 2, wherein the side walls have widths that are greater than a width of the portioning wall. 4. The fluid ejection device according to claim 2, wherein the firing chambers in the first column of firing chambers and the second column of firing chambers further comprise a respective back wall that connects to the side walls opposite to the portioning wall. 5. The fluid ejection device according to claim 1, further comprising:
a fluid feed slot to supply fluid to the firing chambers, wherein the holes extending through the substrate comprise fluid feed holes that are in fluid communication with the fluid feed slot. 6. The fluid ejection device according to claim 1, further comprising:
a nozzle layer provided on the membrane, said nozzle layer comprising a plurality of nozzles, wherein each of the plurality of nozzles is in fluid communication with a respective one of the firing chambers. 7. The fluid ejection device according to claim 1, wherein the substrate comprises a thickness that between about 50 microns and about 150 microns. 8. The fluid ejection device according to claim 1, wherein a closest distance between the actuators in the first column of firing chambers and the actuators in the second column of firing chambers is less than about 100 microns. 9. The fluid ejection device according to claim 1, further comprising:
a top layer provided on the membrane to physically separate the firing chambers in the first column of firing chambers from the firing chambers in the second column of firing chambers, wherein the holes in the substrate comprise nozzles through which fluid is to be ejected from the firing chambers. 10. A method for fabricating a fluid ejection device, said method comprising:
forming holes in a substrate; forming a first column of firing chambers and a second column of firing chambers in a membrane, wherein each of the firing chambers is in fluid communication with a hole in the substrate; forming a portioning wall in the membrane between the first column of firing chambers and the second column of firing chambers; and providing an actuator in each of the firing chambers, wherein each of the actuators is to eject fluid from a respective firing chamber when actuated. 11. The method according to claim 10, further comprising:
forming side walls in the membrane to physically separate the firing chambers in the first column of firing chambers from adjacent firing chambers in the first column of firing chambers; and forming side walls in the membrane to physically separate the firing chambers in the second column of firing chambers from adjacent firing chambers in the second column of firing chambers. 12. The method according to claim 10, further comprising:
forming a first back wall in the membrane that extends across the firing chambers in the first column of firing chambers opposite the portioning wall; and forming a second back wall in the membrane that extends across the firing chambers in the second column of firing chambers opposite the portioning wall. 13. The method according to claim 10, further comprising:
providing a nozzle layer on the membrane, said nozzle layer comprising a plurality of nozzles, wherein each of the plurality of nozzles is in fluid communication with a respective one of the firing chambers. 14. A printhead assembly comprising:
a plurality of fluid ejection devices, each of the plurality of fluid ejection devices comprising:
a membrane including:
a first column of firing chambers extending along a first direction;
a second column of firing chambers extending along the first direction; and
a portioning wall, wherein the portioning wall physically separates the first column of firing chambers from the second column of firing chambers along an extent of the first and second column of firing chambers in the first direction;
a plurality of actuators, wherein an actuator of the plurality of actuators is provided in each of the firing chambers adjacent to the portioning wall; and
a substrate having a respective hole extending from each of the firing chambers. 15. The printhead assembly according to claim 14, wherein the membranes in each of the plurality of fluid ejection devices further comprise side walls that physically separate adjacent firing chambers in the first column of firing chambers from each other and physically separate adjacent firing chambers in the second column of firing chambers from each other. | According to an example, a fluid ejection device may include a membrane including a first column of firing chambers, a second column of firing chambers, and a portioning wall, in which the portioning wall physically separates the first column of firing chambers from the second column of firing chambers. The fluid ejection device may also include a plurality of actuators and a substrate including a respective hole extending through the substrate from each of the firing chambers, in which an actuator of the plurality of actuators is provided in each of the firing chambers.1. A fluid ejection device comprising:
a membrane including a first column of firing chambers, a second column of firing chambers, and a portioning wall, wherein the portioning wall physically separates the first column of firing chambers from the second column of firing chambers; a plurality of actuators, wherein an actuator of the plurality of actuators is provided in each of the firing chambers; and a substrate including a respective hole extending through the substrate from each of the firing chambers. 2. The fluid ejection device according to claim 1, wherein the firing chambers in the first column of firing chambers are physically separated from adjacent firing chambers in the first column of firing chambers by side walls and wherein the firing chambers in the second column of firing chambers are physically separated from adjacent firing chambers in the second column of firing chambers by side walls. 3. The fluid ejection device according to claim 2, wherein the side walls have widths that are greater than a width of the portioning wall. 4. The fluid ejection device according to claim 2, wherein the firing chambers in the first column of firing chambers and the second column of firing chambers further comprise a respective back wall that connects to the side walls opposite to the portioning wall. 5. The fluid ejection device according to claim 1, further comprising:
a fluid feed slot to supply fluid to the firing chambers, wherein the holes extending through the substrate comprise fluid feed holes that are in fluid communication with the fluid feed slot. 6. The fluid ejection device according to claim 1, further comprising:
a nozzle layer provided on the membrane, said nozzle layer comprising a plurality of nozzles, wherein each of the plurality of nozzles is in fluid communication with a respective one of the firing chambers. 7. The fluid ejection device according to claim 1, wherein the substrate comprises a thickness that between about 50 microns and about 150 microns. 8. The fluid ejection device according to claim 1, wherein a closest distance between the actuators in the first column of firing chambers and the actuators in the second column of firing chambers is less than about 100 microns. 9. The fluid ejection device according to claim 1, further comprising:
a top layer provided on the membrane to physically separate the firing chambers in the first column of firing chambers from the firing chambers in the second column of firing chambers, wherein the holes in the substrate comprise nozzles through which fluid is to be ejected from the firing chambers. 10. A method for fabricating a fluid ejection device, said method comprising:
forming holes in a substrate; forming a first column of firing chambers and a second column of firing chambers in a membrane, wherein each of the firing chambers is in fluid communication with a hole in the substrate; forming a portioning wall in the membrane between the first column of firing chambers and the second column of firing chambers; and providing an actuator in each of the firing chambers, wherein each of the actuators is to eject fluid from a respective firing chamber when actuated. 11. The method according to claim 10, further comprising:
forming side walls in the membrane to physically separate the firing chambers in the first column of firing chambers from adjacent firing chambers in the first column of firing chambers; and forming side walls in the membrane to physically separate the firing chambers in the second column of firing chambers from adjacent firing chambers in the second column of firing chambers. 12. The method according to claim 10, further comprising:
forming a first back wall in the membrane that extends across the firing chambers in the first column of firing chambers opposite the portioning wall; and forming a second back wall in the membrane that extends across the firing chambers in the second column of firing chambers opposite the portioning wall. 13. The method according to claim 10, further comprising:
providing a nozzle layer on the membrane, said nozzle layer comprising a plurality of nozzles, wherein each of the plurality of nozzles is in fluid communication with a respective one of the firing chambers. 14. A printhead assembly comprising:
a plurality of fluid ejection devices, each of the plurality of fluid ejection devices comprising:
a membrane including:
a first column of firing chambers extending along a first direction;
a second column of firing chambers extending along the first direction; and
a portioning wall, wherein the portioning wall physically separates the first column of firing chambers from the second column of firing chambers along an extent of the first and second column of firing chambers in the first direction;
a plurality of actuators, wherein an actuator of the plurality of actuators is provided in each of the firing chambers adjacent to the portioning wall; and
a substrate having a respective hole extending from each of the firing chambers. 15. The printhead assembly according to claim 14, wherein the membranes in each of the plurality of fluid ejection devices further comprise side walls that physically separate adjacent firing chambers in the first column of firing chambers from each other and physically separate adjacent firing chambers in the second column of firing chambers from each other. | 2,800 |
12,322 | 12,322 | 16,328,314 | 2,896 | A LED-filament (11) is provided. The LED-filament comprises a substrate (12) having an elongated body with an extension along an elongation axis (A); a plurality of LEDs (13) mechanically coupled to the substrate; and a communication element (14) mechanically coupled to the LED-filament, the communication element is configured for wireless communication. Also a lighting device is provided. The lighting device comprises the LED-filament (11); and a controller (16) configured to control the plurality of LEDs with respect to characteristics of light emitted by the plurality of LEDs, wherein the communication element is communicatively coupled to the controller, and wherein the controller is configured to receive a control signal from the communication element for controlling operation of the plurality of LEDs. | 1. A LED-filament comprising:
a substrate having an elongated body with an extension along an elongation axis (A); a plurality of LEDs mechanically coupled to the substrate; wiring for powering the plurality of LEDs; and a communication element mechanically coupled to the LED-filament, the communication element is configured for wireless communication; and wherein the communication element is different from the wiring; wherein the LED-filament further comprises an encapsulation encapsulating the substrate and the plurality of LEDs, wherein the communication element is integrated within the encapsulation, partly integrated into the encapsulation, or arranged on the encapsulation; and wherein the encapsulant comprises a wavelength converting material. 2. The LED-filament according to claim 1, wherein the communication element is arranged on the substrate. 3. The LED-filament according to claim 1, wherein the substrate has first and second surfaces, wherein the plurality of LEDs are arranged on the first surface of the substrate and the communication element is arranged on the second surface of the substrate. 4. The LED-filament according to claim 3, wherein the first and second surfaces are opposite each other. 5. The LED-filament according to claim 1, wherein the plurality of LEDs and the communication element is arranged on a common surface of the substrate. 6. The LED-filament according to claim 1, wherein the substrate comprises a groove, a through hole, or a protrusion, wherein the communication element is arranged in the groove, in through hole, or on the protrusion. 7. (canceled) 8. The LED-filament according to claim 1, wherein the plurality of LEDs are arranged along a line having an extension parallel with the elongation axis (A). 9. The LED-filament according to claim 1, wherein the communication element is positioned other than directly opposite any one of the plurality of LEDs, or other than on top of any one of the plurality of LEDs. 10. The LED-filament according to claim 1, wherein the communication element is having an extension parallel with the elongation axis (A). 11. The LED-filament (11) according to claim 1, wherein the communication element at least partly surrounds the plurality of LEDs. 12. The LED-filament according to claim 1, wherein the communication element is having a meandering extension along the elongation axis (A). 13. The LED-filament according to claim 1, wherein the LED-filament further comprises an encapsulation encapsulating the substrate and the plurality of LEDs, wherein the communication element is wounded around the encapsulation. 14. A lighting device comprising:
a LED-filament according to claim 1; and a controller configured to control the LED-filament with respect to characteristics of light emitted by the LED-filament, wherein the communication element is communicatively coupled to the controller, and wherein the controller is configured to receive a control signal from the communication element for controlling operation of the LED-filament. 15. The lighting device according to claim 13 comprising a plurality of LED-filaments, wherein the communication elements of the plurality of LED-filaments are interconnected forming a common communication element. | A LED-filament (11) is provided. The LED-filament comprises a substrate (12) having an elongated body with an extension along an elongation axis (A); a plurality of LEDs (13) mechanically coupled to the substrate; and a communication element (14) mechanically coupled to the LED-filament, the communication element is configured for wireless communication. Also a lighting device is provided. The lighting device comprises the LED-filament (11); and a controller (16) configured to control the plurality of LEDs with respect to characteristics of light emitted by the plurality of LEDs, wherein the communication element is communicatively coupled to the controller, and wherein the controller is configured to receive a control signal from the communication element for controlling operation of the plurality of LEDs.1. A LED-filament comprising:
a substrate having an elongated body with an extension along an elongation axis (A); a plurality of LEDs mechanically coupled to the substrate; wiring for powering the plurality of LEDs; and a communication element mechanically coupled to the LED-filament, the communication element is configured for wireless communication; and wherein the communication element is different from the wiring; wherein the LED-filament further comprises an encapsulation encapsulating the substrate and the plurality of LEDs, wherein the communication element is integrated within the encapsulation, partly integrated into the encapsulation, or arranged on the encapsulation; and wherein the encapsulant comprises a wavelength converting material. 2. The LED-filament according to claim 1, wherein the communication element is arranged on the substrate. 3. The LED-filament according to claim 1, wherein the substrate has first and second surfaces, wherein the plurality of LEDs are arranged on the first surface of the substrate and the communication element is arranged on the second surface of the substrate. 4. The LED-filament according to claim 3, wherein the first and second surfaces are opposite each other. 5. The LED-filament according to claim 1, wherein the plurality of LEDs and the communication element is arranged on a common surface of the substrate. 6. The LED-filament according to claim 1, wherein the substrate comprises a groove, a through hole, or a protrusion, wherein the communication element is arranged in the groove, in through hole, or on the protrusion. 7. (canceled) 8. The LED-filament according to claim 1, wherein the plurality of LEDs are arranged along a line having an extension parallel with the elongation axis (A). 9. The LED-filament according to claim 1, wherein the communication element is positioned other than directly opposite any one of the plurality of LEDs, or other than on top of any one of the plurality of LEDs. 10. The LED-filament according to claim 1, wherein the communication element is having an extension parallel with the elongation axis (A). 11. The LED-filament (11) according to claim 1, wherein the communication element at least partly surrounds the plurality of LEDs. 12. The LED-filament according to claim 1, wherein the communication element is having a meandering extension along the elongation axis (A). 13. The LED-filament according to claim 1, wherein the LED-filament further comprises an encapsulation encapsulating the substrate and the plurality of LEDs, wherein the communication element is wounded around the encapsulation. 14. A lighting device comprising:
a LED-filament according to claim 1; and a controller configured to control the LED-filament with respect to characteristics of light emitted by the LED-filament, wherein the communication element is communicatively coupled to the controller, and wherein the controller is configured to receive a control signal from the communication element for controlling operation of the LED-filament. 15. The lighting device according to claim 13 comprising a plurality of LED-filaments, wherein the communication elements of the plurality of LED-filaments are interconnected forming a common communication element. | 2,800 |
12,323 | 12,323 | 16,145,043 | 2,855 | A force sensing compliant enclosure for an electronic device may include at least one deformable housing wall. At least one strain concentration portion may be located on the deformable housing wall where strain caused by application of a force that deforms the deformable housing wall is greater than at other portions of the deformable housing wall. The strain concentrating portion may have a second thickness that is thinner than other portions of the deformable housing wall. One or more sensors may be positioned in the strain concentration portion and may sense strain caused by the application of the force that deforms the deformable housing wall. | 1-20. (canceled) 21. An electronic device, comprising:
a housing defining a sidewall; an array of strain concentration features distributed along the sidewall, each strain concentration feature configured to concentrate strain at a respective strain concentration point in response to a deformation of the sidewall; and an array of strain sensors, each strain sensor coupled to a respective one strain concentration point. 22. The electronic device of claim 21, wherein the sidewall has a first thickness and each strain concentration feature of the array of strain concentration features has a second thickness. 23. The electronic device of claim 21, wherein at least one strain sensor is adhered to its respective strain concentration point. 24. The electronic device of claim 21, wherein at least one strain concentration feature comprises a rectangular profile. 25. The electronic device of claim 21, wherein at least one strain concentration feature of the array of strain concentration features comprises a curved profile. 26. The electronic device of claim 21, wherein the array of strain concentration features is aligned in a row along a length of the sidewall. 27. The electronic device of claim 21, wherein the sidewall is adjacent to a display. 28. The electronic device of claim 21, wherein each strain sensor of the array of strain sensors is communicably coupled to a processing unit disposed within the housing. 29. The electronic device of claim 21, wherein the housing is formed from metal. 30. An electronic device, comprising:
a housing defining an internal sidewall surface opposite an external sidewall surface; a strain concentration feature defined on the internal sidewall surface and operable to concentrate strain at a strain concentration point in response to a deformation of the housing caused by a force applied by a user to the external sidewall surface; a spring structure adjacent to the strain concentration point, the spring structure operable to restore the housing to an undeformed state after the force is removed; and a strain sensor coupled to the strain concentration point. 31. The electronic device of claim 30, wherein the strain concentration feature has a rectangular shape. 32. The electronic device of claim 30, wherein at least a portion of the spring structure is formed from metal. 33. The electronic device of claim 30, wherein:
the strain sensor is a first strain sensor; and the electronic device further comprises a second strain sensor coupled to the strain concentration feature adjacent to the first strain sensor. 34. The electronic device of claim 30, wherein the strain concentration feature extends along a length of the internal sidewall. 35. The electronic device of claim 30, wherein the strain concentration feature is defined, at least partially, into the internal sidewall. 36. The electronic device of claim 30, wherein:
the strain concentration feature comprises a groove; and the strain sensor is disposed between edges of the groove. 37. An electronic device comprising:
a display; a housing component surrounding at least a portion of a periphery of the display and comprising a sidewall defining:
an internal surface; and
an external surface opposite the internal surface;
a set of strain concentration features distributed in a linear pattern along a length of the internal surface of the sidewall, each respective strain concentration feature configured to deform relative to a respective strain concentration point adjacent to the respective strain concentration feature in response to a deformation of the housing component caused by a force applied by a user to the external surface of the sidewall; and a strain sensor coupled to at least one strain concentration point. 38. The electronic device of claim 37, further comprising a spring structure adjacent to the at least one strain concentration point, the spring structure operable to restore the housing component to an expanded state after the force is removed. 39. The electronic device of claim 37, further comprising a processor communicably coupled to the strain sensor and configured to determine a magnitude of the force applied by the user to the external surface of the sidewall. 40. The electronic device of claim 39, wherein the processor is configured to determine a location along the external surface of the sidewall at which the user applied the force. | A force sensing compliant enclosure for an electronic device may include at least one deformable housing wall. At least one strain concentration portion may be located on the deformable housing wall where strain caused by application of a force that deforms the deformable housing wall is greater than at other portions of the deformable housing wall. The strain concentrating portion may have a second thickness that is thinner than other portions of the deformable housing wall. One or more sensors may be positioned in the strain concentration portion and may sense strain caused by the application of the force that deforms the deformable housing wall.1-20. (canceled) 21. An electronic device, comprising:
a housing defining a sidewall; an array of strain concentration features distributed along the sidewall, each strain concentration feature configured to concentrate strain at a respective strain concentration point in response to a deformation of the sidewall; and an array of strain sensors, each strain sensor coupled to a respective one strain concentration point. 22. The electronic device of claim 21, wherein the sidewall has a first thickness and each strain concentration feature of the array of strain concentration features has a second thickness. 23. The electronic device of claim 21, wherein at least one strain sensor is adhered to its respective strain concentration point. 24. The electronic device of claim 21, wherein at least one strain concentration feature comprises a rectangular profile. 25. The electronic device of claim 21, wherein at least one strain concentration feature of the array of strain concentration features comprises a curved profile. 26. The electronic device of claim 21, wherein the array of strain concentration features is aligned in a row along a length of the sidewall. 27. The electronic device of claim 21, wherein the sidewall is adjacent to a display. 28. The electronic device of claim 21, wherein each strain sensor of the array of strain sensors is communicably coupled to a processing unit disposed within the housing. 29. The electronic device of claim 21, wherein the housing is formed from metal. 30. An electronic device, comprising:
a housing defining an internal sidewall surface opposite an external sidewall surface; a strain concentration feature defined on the internal sidewall surface and operable to concentrate strain at a strain concentration point in response to a deformation of the housing caused by a force applied by a user to the external sidewall surface; a spring structure adjacent to the strain concentration point, the spring structure operable to restore the housing to an undeformed state after the force is removed; and a strain sensor coupled to the strain concentration point. 31. The electronic device of claim 30, wherein the strain concentration feature has a rectangular shape. 32. The electronic device of claim 30, wherein at least a portion of the spring structure is formed from metal. 33. The electronic device of claim 30, wherein:
the strain sensor is a first strain sensor; and the electronic device further comprises a second strain sensor coupled to the strain concentration feature adjacent to the first strain sensor. 34. The electronic device of claim 30, wherein the strain concentration feature extends along a length of the internal sidewall. 35. The electronic device of claim 30, wherein the strain concentration feature is defined, at least partially, into the internal sidewall. 36. The electronic device of claim 30, wherein:
the strain concentration feature comprises a groove; and the strain sensor is disposed between edges of the groove. 37. An electronic device comprising:
a display; a housing component surrounding at least a portion of a periphery of the display and comprising a sidewall defining:
an internal surface; and
an external surface opposite the internal surface;
a set of strain concentration features distributed in a linear pattern along a length of the internal surface of the sidewall, each respective strain concentration feature configured to deform relative to a respective strain concentration point adjacent to the respective strain concentration feature in response to a deformation of the housing component caused by a force applied by a user to the external surface of the sidewall; and a strain sensor coupled to at least one strain concentration point. 38. The electronic device of claim 37, further comprising a spring structure adjacent to the at least one strain concentration point, the spring structure operable to restore the housing component to an expanded state after the force is removed. 39. The electronic device of claim 37, further comprising a processor communicably coupled to the strain sensor and configured to determine a magnitude of the force applied by the user to the external surface of the sidewall. 40. The electronic device of claim 39, wherein the processor is configured to determine a location along the external surface of the sidewall at which the user applied the force. | 2,800 |
12,324 | 12,324 | 16,131,931 | 2,812 | Methods of depositing films are described. Specifically, methods of depositing metal oxide films are described. A metal oxide film is selectively deposited on a metal layer relative to a dielectric layer by exposing a substrate to an organometallic precursor followed by exposure to an oxidant. | 1. A method of depositing a film, the method comprising:
positioning a substrate having a metal layer and a dielectric layer in a processing chamber; exposing the substrate, in the absense of trimethlyaluminum (TMA), to an organometallic precursor to selectively deposit a metal film on the metal layer relative to the dielectric layer, the metal film comprising aluminum; purging the processing chamber of the organometallic precursor, exposing the substrate to an oxidant to react with the metal film to form metal oxide film on the metal layer, the metal oxide film comprising aluminum oxide; and purging the processing chamber of the oxidant. 2. The method of claim 1, wherein the organometallic precursor comprises one or more of tri-tertbutylaluminum (TTBA), bis(2-methyl-2-propanyl)-(2-methyl-1-propanyl)aluminum), (2-methyl-2-propanyl)bis(2-methyl-1-propanyl)aluminum), tris(2-methyl-1-propanyl)aluminum), triethyl aluminum (TEA), tri(neopentyl) aluminum, or aluminum isopropoxide. 3. The method of claim 2, wherein the organometallic precursor comprises one or more of tri-tertbutylaluminum, bis(2-methyl-2-propanyl)-(2-methyl-1-propanyl)aluminum), (2-methyl-2-propanyl)bis(2-methyl-1-propanyl)aluminum), tris(2-methyl-1-propanyl)aluminum). 4. (canceled) 5. The method of claim 1, wherein the dielectric layer comprises one or more of oxides, carbon doped oxides, porous silicon dioxide (SiO2), silicon oxide (SiO), silicon nitride (SiN), carbides, oxycarbides, nitrides, oxynitrides, oxycarbonitrides, carbonitrides, polymers, phosphosilicate glass, fluorosilicate (SiOF) glass, or organosilicate glass (SiOCH). 6. The method of claim 1, wherein the dielectric layer is substantially free of the metal oxide film. 7. The method of claim 1, wherein the metal layer comprises one or more of cobalt (Co), tungsten (W), ruthenium (Ru), copper (Cu), nickel (Ni), manganese (Mn), silver (Ag), gold (Au), platinum (Pt), iron (Fe), molybdenum (Mo), or rhodium (Rh). 8. The method of claim 1, wherein the substrate is maintained at a temperature in a range of from 100° C. to 500° C. 9. The method of claim 1, wherein the pressure of the processing chamber is in a range of from 0.5 Torr to 10 Torr. 10. The method of claim 1, wherein the oxidant comprises one or more of water, oxygen, tert-butyl alcohol, 3-butene-2-ol, 2-methyl-3-butene-2-ol, 2-phenyl-2-propanol, or R—OH where R comprises CF3 or C1-20 alkyl, C1-20 aryl, C1-20 alkenyl, or C1-20 alkynyl. 11. The method of claim 1, further comprising repeating the method to provide a metal oxide film having a thickness of from 0.5 to 10 nm. 12. The method of claim 1, wherein purging the processing chamber comprises flowing a purge gas over the substrate. 13. The method of claim 12, wherein the purge gas is selected from one or more of Ar, N2, He, H2, or H2-containing gas. 14. A method of depositing a film, the method comprising
selectively forming a metal oxide film in a process cycle comprising sequential exposure of a substrate, in the absence of trimethylaluminum (TMA), having a metal layer and a dielectric layer thereon to an organometallic precursor, purge gas, an oxidant, and purge gas, the metal oxide film comprising aluminum; and repeating the process cycle to selectively form a metal oxide film on the metal layer, the metal oxide film having a thickness of from 0.5 nm to 10 nm, and the dielectric layer substantially free of the metal oxide film. 15. The method of claim 14, wherein the organometallic precursor comprises one or more of tri-tertbutylaluminum (TTBA), bis(2-methyl-2-propanyl)-(2-methyl-1-propanyl)aluminum), (2-methyl-2-propanyl)bis(2-methyl-1-propanyl)aluminum), tris(2-methyl-1-propanyl)aluminum), triethyl aluminum (TEA), tri(neopentyl) aluminum, or aluminum isopropoxide. 16. The method of claim 15, wherein the organometallic precursor comprises one or more of tri-tertbutylaluminum (TTBA), bis(2-methyl-2-propanyl)-(2-methyl-1-propanyl)aluminum), (2-methyl-2-propanyl)bis(2-methyl-1-propanyl)aluminum), tris(2-methyl-1-propanyl)aluminum). 17. (canceled) 18. The method of claim 14, wherein the metal layer comprises one or more of cobalt (Co), tungsten (W), ruthenium (Ru), copper (Cu), nickel (Ni), manganese (Mn), silver (Ag), gold (Au), platinum (Pt), iron (Fe), molybdenum (Mo), or rhodium (Rh). 19. The method of claim 14, wherein the oxidant comprises one or oxygen, tert-butyl alcohol, 3-butene-2-ol, 2-methyl-3-butene-2-ol, 2-phenyl-2-propanol, or R—OH where R comprises CF3 or C1-20 alkyl, C1-20 aryl, C1-20 alkenyl, or C1-20 alkynyl. 20. A method of depositing a thin film, the method comprising:
selectively forming an aluminum oxide film in a process cycle comprising sequential exposure of a substrate, in the absence of trimethylaluminum (TMA), having a metal layer adjacent to a dielectric layer to an aluminum precursor, purge gas, oxidant, and purge gas; and repeating the process cycle to selectively form the aluminum oxide film on the metal layer, the aluminum oxide film having a thickness of from 2 nm to 10 nm, and the dielectric layer substantially free of aluminum oxide. | Methods of depositing films are described. Specifically, methods of depositing metal oxide films are described. A metal oxide film is selectively deposited on a metal layer relative to a dielectric layer by exposing a substrate to an organometallic precursor followed by exposure to an oxidant.1. A method of depositing a film, the method comprising:
positioning a substrate having a metal layer and a dielectric layer in a processing chamber; exposing the substrate, in the absense of trimethlyaluminum (TMA), to an organometallic precursor to selectively deposit a metal film on the metal layer relative to the dielectric layer, the metal film comprising aluminum; purging the processing chamber of the organometallic precursor, exposing the substrate to an oxidant to react with the metal film to form metal oxide film on the metal layer, the metal oxide film comprising aluminum oxide; and purging the processing chamber of the oxidant. 2. The method of claim 1, wherein the organometallic precursor comprises one or more of tri-tertbutylaluminum (TTBA), bis(2-methyl-2-propanyl)-(2-methyl-1-propanyl)aluminum), (2-methyl-2-propanyl)bis(2-methyl-1-propanyl)aluminum), tris(2-methyl-1-propanyl)aluminum), triethyl aluminum (TEA), tri(neopentyl) aluminum, or aluminum isopropoxide. 3. The method of claim 2, wherein the organometallic precursor comprises one or more of tri-tertbutylaluminum, bis(2-methyl-2-propanyl)-(2-methyl-1-propanyl)aluminum), (2-methyl-2-propanyl)bis(2-methyl-1-propanyl)aluminum), tris(2-methyl-1-propanyl)aluminum). 4. (canceled) 5. The method of claim 1, wherein the dielectric layer comprises one or more of oxides, carbon doped oxides, porous silicon dioxide (SiO2), silicon oxide (SiO), silicon nitride (SiN), carbides, oxycarbides, nitrides, oxynitrides, oxycarbonitrides, carbonitrides, polymers, phosphosilicate glass, fluorosilicate (SiOF) glass, or organosilicate glass (SiOCH). 6. The method of claim 1, wherein the dielectric layer is substantially free of the metal oxide film. 7. The method of claim 1, wherein the metal layer comprises one or more of cobalt (Co), tungsten (W), ruthenium (Ru), copper (Cu), nickel (Ni), manganese (Mn), silver (Ag), gold (Au), platinum (Pt), iron (Fe), molybdenum (Mo), or rhodium (Rh). 8. The method of claim 1, wherein the substrate is maintained at a temperature in a range of from 100° C. to 500° C. 9. The method of claim 1, wherein the pressure of the processing chamber is in a range of from 0.5 Torr to 10 Torr. 10. The method of claim 1, wherein the oxidant comprises one or more of water, oxygen, tert-butyl alcohol, 3-butene-2-ol, 2-methyl-3-butene-2-ol, 2-phenyl-2-propanol, or R—OH where R comprises CF3 or C1-20 alkyl, C1-20 aryl, C1-20 alkenyl, or C1-20 alkynyl. 11. The method of claim 1, further comprising repeating the method to provide a metal oxide film having a thickness of from 0.5 to 10 nm. 12. The method of claim 1, wherein purging the processing chamber comprises flowing a purge gas over the substrate. 13. The method of claim 12, wherein the purge gas is selected from one or more of Ar, N2, He, H2, or H2-containing gas. 14. A method of depositing a film, the method comprising
selectively forming a metal oxide film in a process cycle comprising sequential exposure of a substrate, in the absence of trimethylaluminum (TMA), having a metal layer and a dielectric layer thereon to an organometallic precursor, purge gas, an oxidant, and purge gas, the metal oxide film comprising aluminum; and repeating the process cycle to selectively form a metal oxide film on the metal layer, the metal oxide film having a thickness of from 0.5 nm to 10 nm, and the dielectric layer substantially free of the metal oxide film. 15. The method of claim 14, wherein the organometallic precursor comprises one or more of tri-tertbutylaluminum (TTBA), bis(2-methyl-2-propanyl)-(2-methyl-1-propanyl)aluminum), (2-methyl-2-propanyl)bis(2-methyl-1-propanyl)aluminum), tris(2-methyl-1-propanyl)aluminum), triethyl aluminum (TEA), tri(neopentyl) aluminum, or aluminum isopropoxide. 16. The method of claim 15, wherein the organometallic precursor comprises one or more of tri-tertbutylaluminum (TTBA), bis(2-methyl-2-propanyl)-(2-methyl-1-propanyl)aluminum), (2-methyl-2-propanyl)bis(2-methyl-1-propanyl)aluminum), tris(2-methyl-1-propanyl)aluminum). 17. (canceled) 18. The method of claim 14, wherein the metal layer comprises one or more of cobalt (Co), tungsten (W), ruthenium (Ru), copper (Cu), nickel (Ni), manganese (Mn), silver (Ag), gold (Au), platinum (Pt), iron (Fe), molybdenum (Mo), or rhodium (Rh). 19. The method of claim 14, wherein the oxidant comprises one or oxygen, tert-butyl alcohol, 3-butene-2-ol, 2-methyl-3-butene-2-ol, 2-phenyl-2-propanol, or R—OH where R comprises CF3 or C1-20 alkyl, C1-20 aryl, C1-20 alkenyl, or C1-20 alkynyl. 20. A method of depositing a thin film, the method comprising:
selectively forming an aluminum oxide film in a process cycle comprising sequential exposure of a substrate, in the absence of trimethylaluminum (TMA), having a metal layer adjacent to a dielectric layer to an aluminum precursor, purge gas, oxidant, and purge gas; and repeating the process cycle to selectively form the aluminum oxide film on the metal layer, the aluminum oxide film having a thickness of from 2 nm to 10 nm, and the dielectric layer substantially free of aluminum oxide. | 2,800 |
12,325 | 12,325 | 13,909,133 | 2,894 | A method of manufacturing a power module comprising two substrates is provided, wherein the method comprises disposing a compensation layer of a first thickness above a first substrate; disposing a second substrate above the compensation layer; and reducing the thickness of the compensation layer from the first thickness to a second thickness after the second substrate is disposed on the compensation layer | 1. A method of manufacturing a power module comprising two substrates, the method comprising:
disposing a compensation layer of a first thickness above a first substrate; disposing a second substrate above the compensation layer; and reducing the thickness of the compensation layer from the first thickness to a second thickness after the second substrate is disposed on the compensation layer. 2. The method according to claim 1, wherein the reducing of the thickness of the compensation layer is performed by pressing a lid structure onto the second substrate. 3. The method according to claim 1, wherein at least one of the group consisting of the first substrate and the second substrate comprises a ceramic layer. 4. The method according to claim 3, wherein at least one of the group consisting of the first substrate and the second substrate comprises a conductive cover layer. 5. The method according to claim 1, further comprises mounting the first substrate on a bottom plate. 6. The method according to claim 5, further comprising arranging a height setting spacer on the bottom plate. 7. The method according to claim 1, wherein the compensation layer comprises a conductive material. 8. The method according to claim 1, wherein the compensation layer is formed by a material which has a melting point below a given threshold value. 9. The method according to claim 8, wherein the material is solder. 10. The method according to claim 1, wherein the compensation layer is formed by a compressible material. 11. The method according to claim 10, wherein the compressible material is a foam material. 12. The method according to claim 11, wherein the foam material is a conductive foam material. 13. The method according to claim 1, further comprising encapsulating the module. 14. A method of manufacturing a power module, the method comprising:
arranging a first substrate on a bottom plate; disposing a compensation layer of a first thickness above the first substrate; disposing a second substrate above the compensation layer; and reducing the first thickness to a second thickness by an abrasive-free process. 15. A power module of a predefined thickness and comprising:
a first substrate comprising at least one electronic circuit; a second substrate; and a compensation layer of a thickness which is reducible from a first thickness to a second thickness by pressure. 16. The power module according to claim 15, further comprising:
a bottom plate; and a lid, wherein the first substrate is arranged on the bottom plate and the lid is arranged on the second substrate. 17. The power module according to claim 16, further comprising a height setting spacer which is arranged on the bottom plate. 18. The power module according to claim 15, wherein the compensation layer comprising foam material between the first substrate and the second substrate. 19. The power module according to claim 18, wherein the foam material comprises a conductive material. | A method of manufacturing a power module comprising two substrates is provided, wherein the method comprises disposing a compensation layer of a first thickness above a first substrate; disposing a second substrate above the compensation layer; and reducing the thickness of the compensation layer from the first thickness to a second thickness after the second substrate is disposed on the compensation layer1. A method of manufacturing a power module comprising two substrates, the method comprising:
disposing a compensation layer of a first thickness above a first substrate; disposing a second substrate above the compensation layer; and reducing the thickness of the compensation layer from the first thickness to a second thickness after the second substrate is disposed on the compensation layer. 2. The method according to claim 1, wherein the reducing of the thickness of the compensation layer is performed by pressing a lid structure onto the second substrate. 3. The method according to claim 1, wherein at least one of the group consisting of the first substrate and the second substrate comprises a ceramic layer. 4. The method according to claim 3, wherein at least one of the group consisting of the first substrate and the second substrate comprises a conductive cover layer. 5. The method according to claim 1, further comprises mounting the first substrate on a bottom plate. 6. The method according to claim 5, further comprising arranging a height setting spacer on the bottom plate. 7. The method according to claim 1, wherein the compensation layer comprises a conductive material. 8. The method according to claim 1, wherein the compensation layer is formed by a material which has a melting point below a given threshold value. 9. The method according to claim 8, wherein the material is solder. 10. The method according to claim 1, wherein the compensation layer is formed by a compressible material. 11. The method according to claim 10, wherein the compressible material is a foam material. 12. The method according to claim 11, wherein the foam material is a conductive foam material. 13. The method according to claim 1, further comprising encapsulating the module. 14. A method of manufacturing a power module, the method comprising:
arranging a first substrate on a bottom plate; disposing a compensation layer of a first thickness above the first substrate; disposing a second substrate above the compensation layer; and reducing the first thickness to a second thickness by an abrasive-free process. 15. A power module of a predefined thickness and comprising:
a first substrate comprising at least one electronic circuit; a second substrate; and a compensation layer of a thickness which is reducible from a first thickness to a second thickness by pressure. 16. The power module according to claim 15, further comprising:
a bottom plate; and a lid, wherein the first substrate is arranged on the bottom plate and the lid is arranged on the second substrate. 17. The power module according to claim 16, further comprising a height setting spacer which is arranged on the bottom plate. 18. The power module according to claim 15, wherein the compensation layer comprising foam material between the first substrate and the second substrate. 19. The power module according to claim 18, wherein the foam material comprises a conductive material. | 2,800 |
12,326 | 12,326 | 15,995,071 | 2,845 | The generation of symbol-encoded data from digital data, as part of the compression of the digital data into a compressed digital data, can be performed with reference to multiple alternative alphabets. A selection of a specific alphabet is made based on the digital data being compressed, the compression parameters, or combinations thereof. Information indicative of the selected alphabet is encoded into one or more headers of the resulting compressed digital data. A single alphabet can be selected for all of a set of digital data being compressed, or multiple different alphabets can be selected, with different ones of the multiple different alphabets being utilized to compress different portions of the digital data. Additionally, rather than explicitly specifying a specific selected alphabet, the header information can comprise information from which a same alphabet can be independently selected heuristically by both the compressor and the corresponding decompressor. | 1. A method for improving a computing device's compression of digital data, the method comprising:
selecting, from among multiple alphabets, an alphabet with which to generate a symbol-encoded digital data from the digital data; generating the symbol-encoded digital data from the digital data by performing string matching on the digital data utilizing the selected alphabet; and generating a compressed version of the digital data by performing frequency matching on the symbol-encoded digital data; wherein the selecting the alphabet comprises: performing a first string matching on at least a portion of the digital data utilizing a first alphabet, from among the multiple alphabets, the first alphabet comprising a first set of symbols, each representing one of a first set of discrete pre-defined sequences of bits, the first alphabet also comprising a second set of symbols, each representing an offset-length pair from among a first set of offset-length pairs, the string matching comprising replacing a first instance of a first sequence of bits in the digital data with a corresponding symbol from the first set of symbols and replacing a subsequent instance of the first sequence of bits in the digital data with a first symbol from the second set of symbols that represents a first offset and a first length, the first offset being how far back in the digital data the first instance of the first sequence of bits occurred, the first length being a length of the first sequence of bits; performing, a second string matching on the at least the portion of the digital data utilizing a second alphabet, from among the multiple alphabets, the second alphabet comprising a third set of symbols, each representing one of a second set of discrete pre-defined sequences of bits that differs from the first set of discrete pre-defined sequences of bits, the second alphabet also comprising a fourth set of symbols, each representing an offset-length pair from among a second set of offset-length pairs that differs from the first set of offset-length pairs; and selecting, as the selected alphabet, one of the first alphabet or the second alphabet, the selecting being based on the first string matching and the second string matching. 2. The method of claim 1, wherein the selecting the one of the first alphabet or the second alphabet comprises:
determining a quantity of unused symbols of the first alphabet that were not utilized in performing the first string matching; determining a quantity of unused symbols of the second alphabet that were not utilized in performing the second string matching; and selecting, as the selected alphabet, whichever of the first alphabet or the second alphabet have a fewer quantity of unused symbols. 3. The method of claim 2, wherein the unused symbols of the first alphabet comprise symbols of the second set of symbols that represent offset-length pairs that cannot occur due to either a size of the digital data or a size of a search window utilized in performing the string matching on the digital data; and
wherein further the unused symbols of the second alphabet comprise symbols of the fourth set of symbols that represent offset-length pairs that cannot occur due to either the size of the digital data or the size of the search window utilized in performing the string matching on the digital data. 4. The method of claim 2, wherein the unused symbols of the first alphabet comprise symbols of the first set of symbols that represent discrete pre-defined sequences of bits that cannot occur due to a type of the digital data; and
wherein further the unused symbols of the second alphabet comprise symbols of the third set of symbols that represent discrete pre-defined sequences of bits that cannot occur due to the type of the digital data. 5. The method of claim 1, wherein the selecting the one of the first alphabet or the second alphabet comprises:
performing a first frequency matching on an output of the first string matching, the first frequency matching comprising generating a first set of shorthand codes for symbols of the first alphabet; determining a length of the shorthand codes of the first set of shorthand codes; performing a second frequency matching on an output of the second string matching, the second frequency matching comprising generating a second set of shorthand codes for symbols of the second alphabet; determining a length of the shorthand codes of the second set of shorthand codes; and selecting, as the selected alphabet, whichever of the first alphabet or the second alphabet results in shorthand codes of a shorter length. 6. The method of claim 5, wherein the shorthand codes of the first set of shorthand codes are smaller than the shorthand codes of the second set of shorthand codes because a quantity of symbols of the first alphabet that were utilized in performing the first string matching can be represented with a fewer quantity of bits than a quantity of symbols of the second alphabet that were utilized in performing the second string matching. 7. The method of claim 1, wherein the digital data is a single file; and wherein further the compressed version of the digital data comprises one or more headers identifying the selected alphabet. 8. The method of claim 1, wherein the digital data is a portion of a single file, the method further comprising:
generating a compressed version of the single file by repeating the selecting, the string matching and the frequency matching for other sets of digital data that are further portions of the single file; wherein each portion of the compressed version of the single file comprises one or more headers identifying an alphabet selected for compressing that portion. 9. The method of claim 1, wherein the second set of discrete pre-defined sequences of bits is a subset of the first set of discrete predefined sequences of bits. 10. The method of claim 1, wherein the second set of offset-length pairs is a subset of the first set of offset-length pairs. 11. A method for improving a computing device's compression of digital data, the method comprising:
generating, based on the digital data, an alphabet with which to generate a symbol-encoded digital data from the digital data, the generated alphabet comprising a first set of symbols, each representing one of a first set of discrete pre-defined sequences of bits, the generated alphabet also comprising a second set of symbols, each representing an offset-length pair from among a first set of offset-length pairs; generating the symbol-encoded digital data from the digital data by performing string matching on the digital data utilizing the generated alphabet, the string matching comprising replacing a first instance of a first sequence of bits in the digital data with a corresponding symbol from the first set of symbols and replacing a subsequent instance of the first sequence of bits in the digital data with a first symbol from the second set of symbols that represents a first offset and a first length, the first offset being how far back in the digital data the first instance of the first sequence of bits occurred, the first length being a length of the first sequence of bits; and generating a compressed version of the digital data by performing frequency matching on the symbol-encoded digital data. 12. The method of claim 11, wherein the generating comprises:
determining that the digital data does not comprise any of a second set of discrete pre-defined sequences of bits; and removing, from an original alphabet, a third set of symbols, each representing one of the second set of discrete pre-defined sequences of bits; wherein the generated alphabet is generated from the original alphabet by the removing. 13. The method of claim 11, wherein the generating comprises:
determining that the digital data does not comprise any of a second set of discrete pre-defined sequences of bits; and adding, to the generated alphabet, only those symbols that represent discrete pre-defined sequences of bits that are not in the second set of discrete pre-defined sequences of bits. 14. The method of claim 11, wherein the generating comprises:
determining either: (1) that the digital data is sufficiently small that offsets greater than a first offset cannot occur or (2) that the search window for detecting the subsequent instances of the first sequence of bits in the digital data is sufficiently small that the offsets greater than the first offset cannot occur; and removing, from an original alphabet, a third set of symbols, each representing one of a second set of offset-length pairs, each offset-length pair in the second set of offset-length pairs having an offset that is greater than the first offset; wherein the generated alphabet is generated from the original alphabet by the removing. 15. The method of claim 11, wherein the generating comprises:
determining either: (1) that the digital data is sufficiently small that offsets greater than a first offset cannot occur or (2) that the search window for detecting the subsequent instances of the first sequence of bits in the digital data is sufficiently small that the offsets greater than the first offset cannot occur; and adding, to the generated alphabet, only those symbols that offset-length pairs having an offset that is less than or equal to the first offset. 16. The method of claim 11, wherein the compressed version of the digital data comprises one or more headers comprising a bit vector identifying whether or not the digital data itself possesses attributes, each attribute being represented a single bit of the bit vector. 17. The method of claim 16, further comprising:
generating a new copy of the digital data from the compressed version of the digital data, the generating the new copy comprising independently generating the generated alphabet based on the aspects of the digital data identified by the bit vector. 18. One or more computer-readable storage media comprising computer-executable instructions, which, when executed, cause a computing device to:
generate, based on digital data to be compressed, a alphabet with which to generate a symbol-encoded digital data from the digital data, the generated alphabet comprising a first set of symbols, each representing one of a first set of discrete pre-defined sequences of bits, the generated alphabet also comprising a second set of symbols, each representing an offset-length pair from among a first set of offset-length pairs; generate the symbol-encoded digital data from the digital data by performing string matching on the digital data utilizing the generated alphabet, the string matching comprising replacing a first instance of a first sequence of bits in the digital data with a corresponding symbol from the first set of symbols and replacing a subsequent instance of the first sequence of bits in the digital data with a first symbol from the second set of symbols that represents a first offset and a first length, the first offset being how far back in the digital data the first instance of the first sequence of bits occurred, the first length being a length of the first sequence of bits; and generating a compressed version of the digital data by performing frequency matching on the symbol-encoded digital data. 19. The computer-readable storage media of claim 18, wherein the computer-executable instructions for generating the alphabet comprise computer-executable instructions, which, when executed, cause the computing device to: generate the alphabet by selecting one of multiple pre-existing alphabets. 20. The computer-readable storage media of claim 19, wherein the computer-executable instructions for selecting the alphabet comprise computer-executable instructions, which, when executed, cause the computing device to:
perform a first string matching on at least a portion of the digital data utilizing a first alphabet, from among the multiple pre-existing alphabets, the first alphabet comprising a first set of symbols, each representing one of a first set of discrete pre-defined sequences of bits, the first alphabet also comprising a second set of symbols, each representing an offset-length pair from among a first set of offset-length pairs, the string matching comprising replacing a first instance of a first sequence of bits in the digital data with a corresponding symbol from the first set of symbols and replacing a subsequent instance of the first sequence of bits in the digital data with a first symbol from the second set of symbols that represents a first offset and a first length, the first offset being how far back in the digital data the first instance of the first sequence of bits occurred, the first length being a length of the first sequence of bits; perform, a second string matching on the at least the portion of the digital data utilizing a second alphabet, from among the multiple pre-existing alphabets, the second alphabet comprising a third set of symbols, each representing one of a second set of discrete pre-defined sequences of bits that differs from the first set of discrete pre-defined sequences of bits, the second alphabet also comprising a fourth set of symbols, each representing an offset-length pair from among a second set of offset-length pairs that differs from the first set of offset-length pairs; and select, as the alphabet, one of the first alphabet or the second alphabet, the selecting being based on the first string matching and the second string matching. | The generation of symbol-encoded data from digital data, as part of the compression of the digital data into a compressed digital data, can be performed with reference to multiple alternative alphabets. A selection of a specific alphabet is made based on the digital data being compressed, the compression parameters, or combinations thereof. Information indicative of the selected alphabet is encoded into one or more headers of the resulting compressed digital data. A single alphabet can be selected for all of a set of digital data being compressed, or multiple different alphabets can be selected, with different ones of the multiple different alphabets being utilized to compress different portions of the digital data. Additionally, rather than explicitly specifying a specific selected alphabet, the header information can comprise information from which a same alphabet can be independently selected heuristically by both the compressor and the corresponding decompressor.1. A method for improving a computing device's compression of digital data, the method comprising:
selecting, from among multiple alphabets, an alphabet with which to generate a symbol-encoded digital data from the digital data; generating the symbol-encoded digital data from the digital data by performing string matching on the digital data utilizing the selected alphabet; and generating a compressed version of the digital data by performing frequency matching on the symbol-encoded digital data; wherein the selecting the alphabet comprises: performing a first string matching on at least a portion of the digital data utilizing a first alphabet, from among the multiple alphabets, the first alphabet comprising a first set of symbols, each representing one of a first set of discrete pre-defined sequences of bits, the first alphabet also comprising a second set of symbols, each representing an offset-length pair from among a first set of offset-length pairs, the string matching comprising replacing a first instance of a first sequence of bits in the digital data with a corresponding symbol from the first set of symbols and replacing a subsequent instance of the first sequence of bits in the digital data with a first symbol from the second set of symbols that represents a first offset and a first length, the first offset being how far back in the digital data the first instance of the first sequence of bits occurred, the first length being a length of the first sequence of bits; performing, a second string matching on the at least the portion of the digital data utilizing a second alphabet, from among the multiple alphabets, the second alphabet comprising a third set of symbols, each representing one of a second set of discrete pre-defined sequences of bits that differs from the first set of discrete pre-defined sequences of bits, the second alphabet also comprising a fourth set of symbols, each representing an offset-length pair from among a second set of offset-length pairs that differs from the first set of offset-length pairs; and selecting, as the selected alphabet, one of the first alphabet or the second alphabet, the selecting being based on the first string matching and the second string matching. 2. The method of claim 1, wherein the selecting the one of the first alphabet or the second alphabet comprises:
determining a quantity of unused symbols of the first alphabet that were not utilized in performing the first string matching; determining a quantity of unused symbols of the second alphabet that were not utilized in performing the second string matching; and selecting, as the selected alphabet, whichever of the first alphabet or the second alphabet have a fewer quantity of unused symbols. 3. The method of claim 2, wherein the unused symbols of the first alphabet comprise symbols of the second set of symbols that represent offset-length pairs that cannot occur due to either a size of the digital data or a size of a search window utilized in performing the string matching on the digital data; and
wherein further the unused symbols of the second alphabet comprise symbols of the fourth set of symbols that represent offset-length pairs that cannot occur due to either the size of the digital data or the size of the search window utilized in performing the string matching on the digital data. 4. The method of claim 2, wherein the unused symbols of the first alphabet comprise symbols of the first set of symbols that represent discrete pre-defined sequences of bits that cannot occur due to a type of the digital data; and
wherein further the unused symbols of the second alphabet comprise symbols of the third set of symbols that represent discrete pre-defined sequences of bits that cannot occur due to the type of the digital data. 5. The method of claim 1, wherein the selecting the one of the first alphabet or the second alphabet comprises:
performing a first frequency matching on an output of the first string matching, the first frequency matching comprising generating a first set of shorthand codes for symbols of the first alphabet; determining a length of the shorthand codes of the first set of shorthand codes; performing a second frequency matching on an output of the second string matching, the second frequency matching comprising generating a second set of shorthand codes for symbols of the second alphabet; determining a length of the shorthand codes of the second set of shorthand codes; and selecting, as the selected alphabet, whichever of the first alphabet or the second alphabet results in shorthand codes of a shorter length. 6. The method of claim 5, wherein the shorthand codes of the first set of shorthand codes are smaller than the shorthand codes of the second set of shorthand codes because a quantity of symbols of the first alphabet that were utilized in performing the first string matching can be represented with a fewer quantity of bits than a quantity of symbols of the second alphabet that were utilized in performing the second string matching. 7. The method of claim 1, wherein the digital data is a single file; and wherein further the compressed version of the digital data comprises one or more headers identifying the selected alphabet. 8. The method of claim 1, wherein the digital data is a portion of a single file, the method further comprising:
generating a compressed version of the single file by repeating the selecting, the string matching and the frequency matching for other sets of digital data that are further portions of the single file; wherein each portion of the compressed version of the single file comprises one or more headers identifying an alphabet selected for compressing that portion. 9. The method of claim 1, wherein the second set of discrete pre-defined sequences of bits is a subset of the first set of discrete predefined sequences of bits. 10. The method of claim 1, wherein the second set of offset-length pairs is a subset of the first set of offset-length pairs. 11. A method for improving a computing device's compression of digital data, the method comprising:
generating, based on the digital data, an alphabet with which to generate a symbol-encoded digital data from the digital data, the generated alphabet comprising a first set of symbols, each representing one of a first set of discrete pre-defined sequences of bits, the generated alphabet also comprising a second set of symbols, each representing an offset-length pair from among a first set of offset-length pairs; generating the symbol-encoded digital data from the digital data by performing string matching on the digital data utilizing the generated alphabet, the string matching comprising replacing a first instance of a first sequence of bits in the digital data with a corresponding symbol from the first set of symbols and replacing a subsequent instance of the first sequence of bits in the digital data with a first symbol from the second set of symbols that represents a first offset and a first length, the first offset being how far back in the digital data the first instance of the first sequence of bits occurred, the first length being a length of the first sequence of bits; and generating a compressed version of the digital data by performing frequency matching on the symbol-encoded digital data. 12. The method of claim 11, wherein the generating comprises:
determining that the digital data does not comprise any of a second set of discrete pre-defined sequences of bits; and removing, from an original alphabet, a third set of symbols, each representing one of the second set of discrete pre-defined sequences of bits; wherein the generated alphabet is generated from the original alphabet by the removing. 13. The method of claim 11, wherein the generating comprises:
determining that the digital data does not comprise any of a second set of discrete pre-defined sequences of bits; and adding, to the generated alphabet, only those symbols that represent discrete pre-defined sequences of bits that are not in the second set of discrete pre-defined sequences of bits. 14. The method of claim 11, wherein the generating comprises:
determining either: (1) that the digital data is sufficiently small that offsets greater than a first offset cannot occur or (2) that the search window for detecting the subsequent instances of the first sequence of bits in the digital data is sufficiently small that the offsets greater than the first offset cannot occur; and removing, from an original alphabet, a third set of symbols, each representing one of a second set of offset-length pairs, each offset-length pair in the second set of offset-length pairs having an offset that is greater than the first offset; wherein the generated alphabet is generated from the original alphabet by the removing. 15. The method of claim 11, wherein the generating comprises:
determining either: (1) that the digital data is sufficiently small that offsets greater than a first offset cannot occur or (2) that the search window for detecting the subsequent instances of the first sequence of bits in the digital data is sufficiently small that the offsets greater than the first offset cannot occur; and adding, to the generated alphabet, only those symbols that offset-length pairs having an offset that is less than or equal to the first offset. 16. The method of claim 11, wherein the compressed version of the digital data comprises one or more headers comprising a bit vector identifying whether or not the digital data itself possesses attributes, each attribute being represented a single bit of the bit vector. 17. The method of claim 16, further comprising:
generating a new copy of the digital data from the compressed version of the digital data, the generating the new copy comprising independently generating the generated alphabet based on the aspects of the digital data identified by the bit vector. 18. One or more computer-readable storage media comprising computer-executable instructions, which, when executed, cause a computing device to:
generate, based on digital data to be compressed, a alphabet with which to generate a symbol-encoded digital data from the digital data, the generated alphabet comprising a first set of symbols, each representing one of a first set of discrete pre-defined sequences of bits, the generated alphabet also comprising a second set of symbols, each representing an offset-length pair from among a first set of offset-length pairs; generate the symbol-encoded digital data from the digital data by performing string matching on the digital data utilizing the generated alphabet, the string matching comprising replacing a first instance of a first sequence of bits in the digital data with a corresponding symbol from the first set of symbols and replacing a subsequent instance of the first sequence of bits in the digital data with a first symbol from the second set of symbols that represents a first offset and a first length, the first offset being how far back in the digital data the first instance of the first sequence of bits occurred, the first length being a length of the first sequence of bits; and generating a compressed version of the digital data by performing frequency matching on the symbol-encoded digital data. 19. The computer-readable storage media of claim 18, wherein the computer-executable instructions for generating the alphabet comprise computer-executable instructions, which, when executed, cause the computing device to: generate the alphabet by selecting one of multiple pre-existing alphabets. 20. The computer-readable storage media of claim 19, wherein the computer-executable instructions for selecting the alphabet comprise computer-executable instructions, which, when executed, cause the computing device to:
perform a first string matching on at least a portion of the digital data utilizing a first alphabet, from among the multiple pre-existing alphabets, the first alphabet comprising a first set of symbols, each representing one of a first set of discrete pre-defined sequences of bits, the first alphabet also comprising a second set of symbols, each representing an offset-length pair from among a first set of offset-length pairs, the string matching comprising replacing a first instance of a first sequence of bits in the digital data with a corresponding symbol from the first set of symbols and replacing a subsequent instance of the first sequence of bits in the digital data with a first symbol from the second set of symbols that represents a first offset and a first length, the first offset being how far back in the digital data the first instance of the first sequence of bits occurred, the first length being a length of the first sequence of bits; perform, a second string matching on the at least the portion of the digital data utilizing a second alphabet, from among the multiple pre-existing alphabets, the second alphabet comprising a third set of symbols, each representing one of a second set of discrete pre-defined sequences of bits that differs from the first set of discrete pre-defined sequences of bits, the second alphabet also comprising a fourth set of symbols, each representing an offset-length pair from among a second set of offset-length pairs that differs from the first set of offset-length pairs; and select, as the alphabet, one of the first alphabet or the second alphabet, the selecting being based on the first string matching and the second string matching. | 2,800 |
12,327 | 12,327 | 15,298,828 | 2,817 | A method for semiconductor fabrication includes providing mask layers on opposite sides of a substrate, the substrate having one or more mandrels. Dummy spacers are formed along a periphery of the mask layers. A dummy gate structure is formed between the dummy spacers. The dummy spacers are removed to provide a recess. Low-k spacers are formed in the recess. | 1. A semiconductor device, comprising:
a substrate having one or more mandrels formed thereon; a replacement gate structure formed over the one or more mandrels; low-k spacers formed about a periphery of the replacement gate structure, the low-k spacers extending through the one or more mandrels to an underlying oxide layer; and raised source/drain regions. 2. The device as recited in claim 1, wherein source/drain regions for neighboring mandrels are epitaxially merged. 3. The device as recited in claim 1, wherein the low-k spacers are non-conformal. 4. The device as recited in claim 1, further comprising an oxide formed over the raised source/drain regions. 5. The device as recited in claim 1, wherein the replacement gate structure includes a replacement metal gate structure. 6. The device as recited in claim 1, wherein the one or more mandrels include one or more fins. 7. The device as recited in claim 1, wherein the low-k spacer is comprised of a material selected from the group consisting of hydrogen silsesquioxane polymer (HSQ), methyl silsesquioxane polymer (MSQ), polyphenylene oligomer, methyl doped silica, SiOx(CH3)y, SiCxOyHy, SiOCH, organosilicate glass (SiCOH), porous SiCOH, silicon oxide, boron nitride, silicon oxynitride and combinations thereof. 8. A semiconductor device, comprising:
a substrate having one or more mandrels formed thereon; a replacement gate structure formed over the one or more mandrels; low-k spacers formed about a periphery of the replacement gate structure, the low-k spacers extending through the one or more mandrels to an underlying oxide layer; and epitaxially merged raised source/drain regions. 9. The device as recited in claim 8, wherein the low-k spacers are non-conformal. 10. The device as recited in claim 8, further comprising an oxide formed over the raised source/drain regions. 11. The device as recited in claim 8, wherein the replacement gate structure includes a replacement metal gate structure. 12. The device as recited in claim 8, wherein the one or more mandrels include one or more fins. 13. The device as recited in claim 8, wherein the low-k spacer is comprised of a material selected from the group consisting of hydrogen silsesquioxane polymer (HSQ), methyl silsesquioxane polymer (MSQ), polyphenylene oligomer, methyl doped silica, SiOx(CH3)y, SiCxOyHy, SiOCH, organosilicate glass (SiCOH), porous SiCOH, silicon oxide, boron nitride, silicon oxynitride and combinations thereof. 14. A semiconductor device, comprising:
a substrate having one or more mandrels formed thereon; a replacement gate structure formed over the one or more mandrels; low-k spacers formed about a periphery of the replacement gate structure, the low-k spacers extending through the one or more mandrels to an underlying oxide layer, wherein the low-k spacers are non-conformal; and raised source/drain regions. 15. The device as recited in claim 14, wherein source/drain regions for neighboring mandrels are epitaxially merged. 16. The device as recited in claim 14, further comprising an oxide formed over the raised source/drain regions. 17. The device as recited in claim 14, wherein the replacement gate structure includes a replacement metal gate structure. 18. The device as recited in claim 14, wherein the one or more mandrels include one or more fins. 19. The device as recited in claim 14, wherein have a dielectric constant less than 5.0 20. The device as recited in claim 14, wherein the low-k spacer is comprised of a material selected from the group consisting of hydrogen silsesquioxane polymer (HSQ), methyl silsesquioxane polymer (MSQ), polyphenylene oligomer, methyl doped silica, SiOx(CH3)y, SiCxOyHy, SiOCH, organosilicate glass (SiCOH), porous SiCOH, silicon oxide, boron nitride, silicon oxynitride and combinations thereof. | A method for semiconductor fabrication includes providing mask layers on opposite sides of a substrate, the substrate having one or more mandrels. Dummy spacers are formed along a periphery of the mask layers. A dummy gate structure is formed between the dummy spacers. The dummy spacers are removed to provide a recess. Low-k spacers are formed in the recess.1. A semiconductor device, comprising:
a substrate having one or more mandrels formed thereon; a replacement gate structure formed over the one or more mandrels; low-k spacers formed about a periphery of the replacement gate structure, the low-k spacers extending through the one or more mandrels to an underlying oxide layer; and raised source/drain regions. 2. The device as recited in claim 1, wherein source/drain regions for neighboring mandrels are epitaxially merged. 3. The device as recited in claim 1, wherein the low-k spacers are non-conformal. 4. The device as recited in claim 1, further comprising an oxide formed over the raised source/drain regions. 5. The device as recited in claim 1, wherein the replacement gate structure includes a replacement metal gate structure. 6. The device as recited in claim 1, wherein the one or more mandrels include one or more fins. 7. The device as recited in claim 1, wherein the low-k spacer is comprised of a material selected from the group consisting of hydrogen silsesquioxane polymer (HSQ), methyl silsesquioxane polymer (MSQ), polyphenylene oligomer, methyl doped silica, SiOx(CH3)y, SiCxOyHy, SiOCH, organosilicate glass (SiCOH), porous SiCOH, silicon oxide, boron nitride, silicon oxynitride and combinations thereof. 8. A semiconductor device, comprising:
a substrate having one or more mandrels formed thereon; a replacement gate structure formed over the one or more mandrels; low-k spacers formed about a periphery of the replacement gate structure, the low-k spacers extending through the one or more mandrels to an underlying oxide layer; and epitaxially merged raised source/drain regions. 9. The device as recited in claim 8, wherein the low-k spacers are non-conformal. 10. The device as recited in claim 8, further comprising an oxide formed over the raised source/drain regions. 11. The device as recited in claim 8, wherein the replacement gate structure includes a replacement metal gate structure. 12. The device as recited in claim 8, wherein the one or more mandrels include one or more fins. 13. The device as recited in claim 8, wherein the low-k spacer is comprised of a material selected from the group consisting of hydrogen silsesquioxane polymer (HSQ), methyl silsesquioxane polymer (MSQ), polyphenylene oligomer, methyl doped silica, SiOx(CH3)y, SiCxOyHy, SiOCH, organosilicate glass (SiCOH), porous SiCOH, silicon oxide, boron nitride, silicon oxynitride and combinations thereof. 14. A semiconductor device, comprising:
a substrate having one or more mandrels formed thereon; a replacement gate structure formed over the one or more mandrels; low-k spacers formed about a periphery of the replacement gate structure, the low-k spacers extending through the one or more mandrels to an underlying oxide layer, wherein the low-k spacers are non-conformal; and raised source/drain regions. 15. The device as recited in claim 14, wherein source/drain regions for neighboring mandrels are epitaxially merged. 16. The device as recited in claim 14, further comprising an oxide formed over the raised source/drain regions. 17. The device as recited in claim 14, wherein the replacement gate structure includes a replacement metal gate structure. 18. The device as recited in claim 14, wherein the one or more mandrels include one or more fins. 19. The device as recited in claim 14, wherein have a dielectric constant less than 5.0 20. The device as recited in claim 14, wherein the low-k spacer is comprised of a material selected from the group consisting of hydrogen silsesquioxane polymer (HSQ), methyl silsesquioxane polymer (MSQ), polyphenylene oligomer, methyl doped silica, SiOx(CH3)y, SiCxOyHy, SiOCH, organosilicate glass (SiCOH), porous SiCOH, silicon oxide, boron nitride, silicon oxynitride and combinations thereof. | 2,800 |
12,328 | 12,328 | 16,209,130 | 2,881 | Certain configurations of systems comprising a cell analyzer and a mass spectrometer are described. In some embodiments, the system can be used to determine both a cell phenotype or cellular response and an amount of at least one elemental species in the cell. The phenotype or other cellular characteristic and elemental content of each cell in a cell population can be determined and correlated. | 1. A method comprising:
providing an individual cell in a cell population from a cell analyzer to a mass spectrometer to quantify an amount of at least a first element in the provided individual cell; and correlating the quantified amount of the first element in the provided individual cell with a measurement of the individual cell from the cell analyzer. 2. The method of claim 1, further comprising quantifying an amount of the first element in each cell of the cell population using the mass spectrometer and correlating the quantified amount of the first element in each of the cells with individual cell measurements from the cell analyzer. 3. The method of claim 2, further comprising using the quantified amount of the first element in each of the cells and the individual cell measurements from the cell analyzer to determine a number of the cells in the cell population that comprise the first element. 4. The method of claim 2, further comprising using the quantified amount of the first element in each of the cells and the individual cell measurements from the cell analyzer to determine a number of the cells in the cell population exhibiting a selected biological response. 5. The method of claim 2, further comprising using the quantified amount of the first element in each of the cells and the individual cell measurements from the cell analyzer to correlate cell size with the quantified amount of the first element. 6. The method of claim 2, further comprising quantifying at least a second element in each cell of the cell population. 7. The method of claim 1, further comprising configuring the cell population as a unicellular suspension prior to providing the unicellular suspension to the cell analyzer. 8. The method of claim 7, further comprising configuring the cell analyzer to provide unicellular eukaryotic cells to the mass spectrometer or unicellular prokaryotic cells to the mass spectrometer. 9. The method of claim 8, further comprising configuring the cell analyzer as a flow cytometer. 10. The method of claim 8, further comprising configuring the cell analyzer as a fluorescence activated cell sorter. 11. The method of claim 8, further comprising configuring the cell analyzer as a magnetic sorter. 12. The method of claim 9, further comprising configuring the mass spectrometer to comprise an inductively coupled plasma. 13. The method of claim 12, further comprising separating the cell population from other species using chromatography prior to providing the cell population to the cell analyzer. 14. The method of claim 12, further comprising determining cell size as the measurement of the individual cell from the cell analyzer. 15. The method of claim 12, further comprising determining cell viability as the measurement of the individual cell from the cell analyzer. 16. The method of claim 12, further comprising determining cell phenotype using a specific label as the measurement of the individual cell from the cell analyzer. 17. The method of claim 12, further comprising determining cell health using a specific label as the measurement of the individual cell from the cell analyzer. 18. The method of claim 1, further comprising configuring the cell population to comprise an average size between 0.2 microns and 100 microns, configuring the cell analyzer as a flow cytometer and configuring the mass spectrometer to comprise an inductively coupled plasma. 19. The method of claim 1, further comprising isolating organelles from the cell population, providing an individual organelle from the isolated organelles to a mass spectrometer from the cell analyzer to quantify an amount of the first element in the provided individual organelle, and correlating the quantified amount of the first element in the individual organelle with a measurement of the individual organelle from the cell analyzer. 20. The method of claim 1, further comprising using a processor to correlate the quantified amount of the at least first element in the provided individual cell with the measurement of the individual cell from the cell analyzer. 21-45. (canceled) | Certain configurations of systems comprising a cell analyzer and a mass spectrometer are described. In some embodiments, the system can be used to determine both a cell phenotype or cellular response and an amount of at least one elemental species in the cell. The phenotype or other cellular characteristic and elemental content of each cell in a cell population can be determined and correlated.1. A method comprising:
providing an individual cell in a cell population from a cell analyzer to a mass spectrometer to quantify an amount of at least a first element in the provided individual cell; and correlating the quantified amount of the first element in the provided individual cell with a measurement of the individual cell from the cell analyzer. 2. The method of claim 1, further comprising quantifying an amount of the first element in each cell of the cell population using the mass spectrometer and correlating the quantified amount of the first element in each of the cells with individual cell measurements from the cell analyzer. 3. The method of claim 2, further comprising using the quantified amount of the first element in each of the cells and the individual cell measurements from the cell analyzer to determine a number of the cells in the cell population that comprise the first element. 4. The method of claim 2, further comprising using the quantified amount of the first element in each of the cells and the individual cell measurements from the cell analyzer to determine a number of the cells in the cell population exhibiting a selected biological response. 5. The method of claim 2, further comprising using the quantified amount of the first element in each of the cells and the individual cell measurements from the cell analyzer to correlate cell size with the quantified amount of the first element. 6. The method of claim 2, further comprising quantifying at least a second element in each cell of the cell population. 7. The method of claim 1, further comprising configuring the cell population as a unicellular suspension prior to providing the unicellular suspension to the cell analyzer. 8. The method of claim 7, further comprising configuring the cell analyzer to provide unicellular eukaryotic cells to the mass spectrometer or unicellular prokaryotic cells to the mass spectrometer. 9. The method of claim 8, further comprising configuring the cell analyzer as a flow cytometer. 10. The method of claim 8, further comprising configuring the cell analyzer as a fluorescence activated cell sorter. 11. The method of claim 8, further comprising configuring the cell analyzer as a magnetic sorter. 12. The method of claim 9, further comprising configuring the mass spectrometer to comprise an inductively coupled plasma. 13. The method of claim 12, further comprising separating the cell population from other species using chromatography prior to providing the cell population to the cell analyzer. 14. The method of claim 12, further comprising determining cell size as the measurement of the individual cell from the cell analyzer. 15. The method of claim 12, further comprising determining cell viability as the measurement of the individual cell from the cell analyzer. 16. The method of claim 12, further comprising determining cell phenotype using a specific label as the measurement of the individual cell from the cell analyzer. 17. The method of claim 12, further comprising determining cell health using a specific label as the measurement of the individual cell from the cell analyzer. 18. The method of claim 1, further comprising configuring the cell population to comprise an average size between 0.2 microns and 100 microns, configuring the cell analyzer as a flow cytometer and configuring the mass spectrometer to comprise an inductively coupled plasma. 19. The method of claim 1, further comprising isolating organelles from the cell population, providing an individual organelle from the isolated organelles to a mass spectrometer from the cell analyzer to quantify an amount of the first element in the provided individual organelle, and correlating the quantified amount of the first element in the individual organelle with a measurement of the individual organelle from the cell analyzer. 20. The method of claim 1, further comprising using a processor to correlate the quantified amount of the at least first element in the provided individual cell with the measurement of the individual cell from the cell analyzer. 21-45. (canceled) | 2,800 |
12,329 | 12,329 | 15,144,169 | 2,894 | Seismic data of a subterranean region is accessed and an image orientation of each data sample of the seismic data is computed. The seismic data is divided, in a spatial domain, into a plurality of sections based on spatial attributes of the seismic data, each section including respective seismic data samples having the spatial attributes within the respective section. For each section of the plurality of sections, a dominant orientation of the section is determined and a noise component of the seismic data is predicted based on the dominant orientation of the section. | 1. A computer-implemented method of processing seismic data for reservoir analysis, the method comprising:
accessing, by operation of one or more computers, seismic data of a subterranean region; computing an image orientation of each data sample of the seismic data; dividing, in a spatial domain, the seismic data into a plurality of sections based on spatial attributes of the seismic data, each section comprising respective seismic data samples having the spatial attributes within the respective section; for each of the plurality of sections:
determining a dominant orientation of the section; and
predicting a noise component of the seismic data based on the dominant orientation of the section. 2. The computer-implemented method of claim 1, further comprising removing the noise component from the seismic data based on an image orientation of the predicted noise component. 3. The computer-implemented method of claim 1, further comprising applying dip decomposition to reduce interference prior to computing the image orientation of each data sample of the seismic data. 4. The computer-implemented method of claim 1, wherein computing an image orientation of each data sample of the seismic data comprises using a steerable filter, a slant-stacking filter, or a plane-wave destruction filter. 5. The computer-implemented method of claim 4, wherein the steerable filter comprises a linear combination of a set of basis filters at fixed orientations. 6. The computer-implemented method of claim 4, wherein computing an image orientation of each data sample comprises using a plurality of oriented filters with supplementary orientations to identify the image orientation of the data sample. 7. The computer-implemented method of claim 1, wherein determining a dominant orientation of the section comprises determining the dominant orientation of the section based on probability distributions of respective image orientations of data samples within the section. 8. The computer-implemented method of claim 1, wherein predicting a noise component comprises applying, to each section of the plurality of sections, a directional filter or a non-linear media filter aligned with the dominant orientation of the section. 9. The computer-implemented method of claim 8, wherein the directional filter comprises a local velocity, slope, or dip filter applicable in a time-space domain or in an f-k or tau-p domain. 10. The computer-implemented method of claim 1, wherein the spatial attributes of the seismic data comprises offset values of the seismic data, the offset values representing distance between a seismic source and a seismic receiver of the seismic data. 11. A non-transitory, computer-readable medium storing one or more instructions executable by a computer system to perform operations comprising:
accessing seismic data of a subterranean region; computing an image orientation of each data sample of the seismic data; dividing, in a spatial domain, the seismic data into a plurality of sections based on spatial attributes of the seismic data, each section comprising respective seismic data samples having the spatial attributes within the respective section; for each of the plurality of sections:
determining a dominant orientation of the section; and
predicting a noise component of the seismic data based on the dominant orientation of the section. 12. The non-transitory, computer-readable medium of claim 11, further comprising one or more instructions to remove the noise component from the seismic data based on an image orientation of the predicted noise component. 13. The non-transitory, computer-readable medium of claim 11, further comprising one or more instructions to apply dip decomposition to reduce interference prior to computing the image orientation of each data sample of the seismic data. 14. The non-transitory, computer-readable medium of claim 11, wherein computing an image orientation of each data sample of the seismic data comprises using a steerable filter, a slant-stacking filter, or a plane-wave destruction filter. 15. The non-transitory, computer-readable medium of claim 14, wherein the steerable filter comprises a linear combination of a set of basis filters at fixed orientations. 16. The non-transitory, computer-readable medium of claim 14, wherein computing an image orientation of each data sample comprises using a plurality of oriented filters with supplementary orientations to identify the image orientation of the data sample. 17. The non-transitory, computer-readable medium of claim 11, wherein determining a dominant orientation of the section comprises determining the dominant orientation of the section based on probability distributions of respective image orientations of data samples within the section. 18. The non-transitory, computer-readable medium of claim 11, wherein predicting a noise component comprises applying, to each section of the plurality of sections, a directional filter or a non-linear media filter aligned with the dominant orientation of the section. 19. The non-transitory, computer-readable medium of claim 18, wherein the directional filter comprises a local velocity, slope, or dip filter applicable in a time-space domain or in an f-k or tau-p domain. 20. The computer-implemented method of claim 11, wherein the spatial attributes of the seismic data comprises offset values of the seismic data, the offset values representing distance between a seismic source and a seismic receiver of the seismic data. 21. A computer-implemented system comprising one or more computers that include:
a computer memory operable to store seismic data of a subterranean region; and a data processing apparatus operable to:
access seismic data of a subterranean region;
compute an image orientation of each data sample of the seismic data;
divide, in a spatial domain, the seismic data into a plurality of sections based on spatial attributes of the seismic data, each section comprising respective seismic data samples having the spatial attributes within the respective section; and
for each of the plurality of sections:
determine a dominant orientation of the section; and
predict a noise component of the seismic data based on the dominant orientation of the section. 22. The computer-implemented system of claim 21, further operable to remove the noise component from the seismic data based on an image orientation of the predicted noise component. 23. The computer-implemented system of claim 21, further operable to apply dip decomposition to reduce interference prior to computing the image orientation of each data sample of the seismic data. 24. The computer-implemented system of claim 21, wherein computing an image orientation of each data sample of the seismic data comprises using a steerable filter, a slant-stacking filter, or a plane-wave destruction filter. 25. The computer-implemented system of claim 24, wherein the steerable filter comprises a linear combination of a set of basis filters at fixed orientations. 26. The computer-implemented system of claim 24, wherein computing an image orientation of each data sample comprises using a plurality of oriented filters with supplementary orientations to identify the image orientation of the data sample. 27. The computer-implemented system of claim 21, wherein determining a dominant orientation of the section comprises determining the dominant orientation of the section based on probability distributions of respective image orientations of data samples within the section. 28. The computer-implemented system of claim 21, wherein predicting a noise component comprises applying, to each section of the plurality of sections, a directional filter or a non-linear media filter aligned with the dominant orientation of the section. 29. The computer-implemented system of claim 28, wherein the directional filter comprises a local velocity, slope, or dip filter applicable in a time-space domain or in an f-k or tau-p domain. 30. The computer-implemented system of claim 21, wherein the spatial attributes of the seismic data comprises offset values of the seismic data, the offset values representing distance between a seismic source and a seismic receiver of the seismic data. | Seismic data of a subterranean region is accessed and an image orientation of each data sample of the seismic data is computed. The seismic data is divided, in a spatial domain, into a plurality of sections based on spatial attributes of the seismic data, each section including respective seismic data samples having the spatial attributes within the respective section. For each section of the plurality of sections, a dominant orientation of the section is determined and a noise component of the seismic data is predicted based on the dominant orientation of the section.1. A computer-implemented method of processing seismic data for reservoir analysis, the method comprising:
accessing, by operation of one or more computers, seismic data of a subterranean region; computing an image orientation of each data sample of the seismic data; dividing, in a spatial domain, the seismic data into a plurality of sections based on spatial attributes of the seismic data, each section comprising respective seismic data samples having the spatial attributes within the respective section; for each of the plurality of sections:
determining a dominant orientation of the section; and
predicting a noise component of the seismic data based on the dominant orientation of the section. 2. The computer-implemented method of claim 1, further comprising removing the noise component from the seismic data based on an image orientation of the predicted noise component. 3. The computer-implemented method of claim 1, further comprising applying dip decomposition to reduce interference prior to computing the image orientation of each data sample of the seismic data. 4. The computer-implemented method of claim 1, wherein computing an image orientation of each data sample of the seismic data comprises using a steerable filter, a slant-stacking filter, or a plane-wave destruction filter. 5. The computer-implemented method of claim 4, wherein the steerable filter comprises a linear combination of a set of basis filters at fixed orientations. 6. The computer-implemented method of claim 4, wherein computing an image orientation of each data sample comprises using a plurality of oriented filters with supplementary orientations to identify the image orientation of the data sample. 7. The computer-implemented method of claim 1, wherein determining a dominant orientation of the section comprises determining the dominant orientation of the section based on probability distributions of respective image orientations of data samples within the section. 8. The computer-implemented method of claim 1, wherein predicting a noise component comprises applying, to each section of the plurality of sections, a directional filter or a non-linear media filter aligned with the dominant orientation of the section. 9. The computer-implemented method of claim 8, wherein the directional filter comprises a local velocity, slope, or dip filter applicable in a time-space domain or in an f-k or tau-p domain. 10. The computer-implemented method of claim 1, wherein the spatial attributes of the seismic data comprises offset values of the seismic data, the offset values representing distance between a seismic source and a seismic receiver of the seismic data. 11. A non-transitory, computer-readable medium storing one or more instructions executable by a computer system to perform operations comprising:
accessing seismic data of a subterranean region; computing an image orientation of each data sample of the seismic data; dividing, in a spatial domain, the seismic data into a plurality of sections based on spatial attributes of the seismic data, each section comprising respective seismic data samples having the spatial attributes within the respective section; for each of the plurality of sections:
determining a dominant orientation of the section; and
predicting a noise component of the seismic data based on the dominant orientation of the section. 12. The non-transitory, computer-readable medium of claim 11, further comprising one or more instructions to remove the noise component from the seismic data based on an image orientation of the predicted noise component. 13. The non-transitory, computer-readable medium of claim 11, further comprising one or more instructions to apply dip decomposition to reduce interference prior to computing the image orientation of each data sample of the seismic data. 14. The non-transitory, computer-readable medium of claim 11, wherein computing an image orientation of each data sample of the seismic data comprises using a steerable filter, a slant-stacking filter, or a plane-wave destruction filter. 15. The non-transitory, computer-readable medium of claim 14, wherein the steerable filter comprises a linear combination of a set of basis filters at fixed orientations. 16. The non-transitory, computer-readable medium of claim 14, wherein computing an image orientation of each data sample comprises using a plurality of oriented filters with supplementary orientations to identify the image orientation of the data sample. 17. The non-transitory, computer-readable medium of claim 11, wherein determining a dominant orientation of the section comprises determining the dominant orientation of the section based on probability distributions of respective image orientations of data samples within the section. 18. The non-transitory, computer-readable medium of claim 11, wherein predicting a noise component comprises applying, to each section of the plurality of sections, a directional filter or a non-linear media filter aligned with the dominant orientation of the section. 19. The non-transitory, computer-readable medium of claim 18, wherein the directional filter comprises a local velocity, slope, or dip filter applicable in a time-space domain or in an f-k or tau-p domain. 20. The computer-implemented method of claim 11, wherein the spatial attributes of the seismic data comprises offset values of the seismic data, the offset values representing distance between a seismic source and a seismic receiver of the seismic data. 21. A computer-implemented system comprising one or more computers that include:
a computer memory operable to store seismic data of a subterranean region; and a data processing apparatus operable to:
access seismic data of a subterranean region;
compute an image orientation of each data sample of the seismic data;
divide, in a spatial domain, the seismic data into a plurality of sections based on spatial attributes of the seismic data, each section comprising respective seismic data samples having the spatial attributes within the respective section; and
for each of the plurality of sections:
determine a dominant orientation of the section; and
predict a noise component of the seismic data based on the dominant orientation of the section. 22. The computer-implemented system of claim 21, further operable to remove the noise component from the seismic data based on an image orientation of the predicted noise component. 23. The computer-implemented system of claim 21, further operable to apply dip decomposition to reduce interference prior to computing the image orientation of each data sample of the seismic data. 24. The computer-implemented system of claim 21, wherein computing an image orientation of each data sample of the seismic data comprises using a steerable filter, a slant-stacking filter, or a plane-wave destruction filter. 25. The computer-implemented system of claim 24, wherein the steerable filter comprises a linear combination of a set of basis filters at fixed orientations. 26. The computer-implemented system of claim 24, wherein computing an image orientation of each data sample comprises using a plurality of oriented filters with supplementary orientations to identify the image orientation of the data sample. 27. The computer-implemented system of claim 21, wherein determining a dominant orientation of the section comprises determining the dominant orientation of the section based on probability distributions of respective image orientations of data samples within the section. 28. The computer-implemented system of claim 21, wherein predicting a noise component comprises applying, to each section of the plurality of sections, a directional filter or a non-linear media filter aligned with the dominant orientation of the section. 29. The computer-implemented system of claim 28, wherein the directional filter comprises a local velocity, slope, or dip filter applicable in a time-space domain or in an f-k or tau-p domain. 30. The computer-implemented system of claim 21, wherein the spatial attributes of the seismic data comprises offset values of the seismic data, the offset values representing distance between a seismic source and a seismic receiver of the seismic data. | 2,800 |
12,330 | 12,330 | 15,069,084 | 2,852 | The present invention relates to a magnetic sensor which can improve the detection precision of a weak magnetic field and can be downsized. A magnetic sensor is provided with a magnetic body changing the direction of a magnetic field input to a magnetoresistance effect element in the vicinity of the magnetoresistance effect element in which the resistance value changes according to the direction of the input magnetic field, the magnetic body has a mean for changing the direction of a magnetic field on the surface at a side where the magnetoresistance effect element is formed. The chamfer part of the magnetic body may be chamfered with a shape having at least one flat surface. | 1. A magnetic sensor comprising a magnetoresistance effect element and a magnetic body which is provided in the vicinity of the magnetoresistance effect element, wherein the magnetic body changes the direction of a magnetic field input to the magnetoresistance effect element,
the resistance value of the magnetoresistance effect element changes according to the direction of the input magnetic field, and the magnetic body has at least one chamfer part in which the corner part is chamfered in the cross-section shape on the surface parallel to the placement surface of the magnetoresistance effect element. 2. The magnetic sensor according to claim 1, wherein, the chamfer part of the magnetic body is chamfered with a shape having at least one flat surface. 3. The magnetic sensor according to claim 1, wherein, the chamfer part of the magnetic body is chamfered with a shape having at least one curved part. 4. The magnetic sensor according to claim 1, wherein,
the magnetic body is a soft magnetic body. 5. The magnetic sensor according to claim 2, wherein, the magnetic body is a soft magnetic body. 6. The magnetic sensor according to claim 3, wherein, the magnetic body is a soft magnetic body. | The present invention relates to a magnetic sensor which can improve the detection precision of a weak magnetic field and can be downsized. A magnetic sensor is provided with a magnetic body changing the direction of a magnetic field input to a magnetoresistance effect element in the vicinity of the magnetoresistance effect element in which the resistance value changes according to the direction of the input magnetic field, the magnetic body has a mean for changing the direction of a magnetic field on the surface at a side where the magnetoresistance effect element is formed. The chamfer part of the magnetic body may be chamfered with a shape having at least one flat surface.1. A magnetic sensor comprising a magnetoresistance effect element and a magnetic body which is provided in the vicinity of the magnetoresistance effect element, wherein the magnetic body changes the direction of a magnetic field input to the magnetoresistance effect element,
the resistance value of the magnetoresistance effect element changes according to the direction of the input magnetic field, and the magnetic body has at least one chamfer part in which the corner part is chamfered in the cross-section shape on the surface parallel to the placement surface of the magnetoresistance effect element. 2. The magnetic sensor according to claim 1, wherein, the chamfer part of the magnetic body is chamfered with a shape having at least one flat surface. 3. The magnetic sensor according to claim 1, wherein, the chamfer part of the magnetic body is chamfered with a shape having at least one curved part. 4. The magnetic sensor according to claim 1, wherein,
the magnetic body is a soft magnetic body. 5. The magnetic sensor according to claim 2, wherein, the magnetic body is a soft magnetic body. 6. The magnetic sensor according to claim 3, wherein, the magnetic body is a soft magnetic body. | 2,800 |
12,331 | 12,331 | 15,695,842 | 2,883 | A splice element for splicing a first and a second optical fiber comprises an alignment mechanism having a base plate and a clamp plate. At least one of the base plate and clamp plate is formed from a silica material and at least one of the base plate and clamp plate includes an alignment groove configured to receive the first and second optical fibers in an end-to-end manner. The splice element also comprises an optical adhesive disposed in at least a portion of the alignment groove, wherein the optical adhesive is curable via actinic radiation. | 1. A splice element for splicing a first and a second optical fiber, comprising:
an alignment mechanism having a base plate and a clamp plate, at least one of the base plate and clamp plate being formed from a silica material, and at least one of the base plate and clamp plate having an alignment groove configured to receive the first and second optical fibers in an end-to-end manner; and an optical adhesive disposed in at least a portion of the alignment groove, wherein the optical adhesive is curable via actinic radiation. 2. The splice element of claim 1, wherein the optical adhesive is blue light curable. 3. The splice element of claim 1, wherein the optical adhesive comprises an adhesive composition containing non-aggregated, surface-modified silica nano-particles dispersed in an epoxy resin. 4. The splice element of claim 1, wherein the optical adhesive changes color from an uncured state to a cured state. 5. The splice element of claim 1, wherein the base plate includes the alignment groove formed on a major surface therein. 6. The splice element of claim 1, further comprising a clip configured to receive the base plate and clamp plate therein and impart a pressing force on the base plate and clamp plate. 7. The splice element of claim 1, wherein at least one of the base plate and clamp plate is substantially transparent. 8. The splice element of claim 1, wherein the base plate further comprises partial funnel shaped entrance openings at both ends of the alignment groove, the partial funnel shaped entrance openings being wider than the alignment groove. 9. The splice element of claim 1, wherein the clamp plate comprises an alignment groove formed in a major surface therein. 10. The splice element of claim 1, wherein the base plate further comprises a plurality of pad structures formed on a major surface thereof, the pads configured to space the base plate and clamp plate from each other to create clearance for the insertion of the first and second optical fibers. 11. The splice element of claim 1, wherein the alignment mechanism is substantially cylindrical in shape. 12. The splice element of claim 1, wherein the base plate includes a plurality of alignment grooves formed on a major surface therein. 13. The splice element of claim 1, wherein the clamp plate comprises a flexible material. 14. The splice element of claim 1, wherein the silica material comprises a sol-based cast net shaped sintered silica material. 15. A multifiber splice device for splicing a plurality of first and second optical fibers, comprising:
a multifiber splice element having a body, having a plurality of alignment channels configured to receive the plurality of first and second optical fibers in an end-to-end manner, wherein the plurality of alignment channel has an arched profile; a clamp plate; wherein at least one of the body and clamp plate being formed from a low coefficient of thermal expansion silica material; and an optical coupling material is disposed in at least a portion of the plurality alignment channels such that the optical coupling material is positioned between the plurality of first and second optical fibers. 16. The multifiber splice device of claim 15, wherein the optical material comprises a blue light curable optical adhesive. 17. The multifiber splice device of claim 15, wherein the arched profile includes a generally planar portion at entrance openings at either end of the alignment channel, the alignment channel gently rises between the entrance openings and an interconnection region centrally located on the body and where the alignment channel crests in a shallow dome within the interconnection region. 18. A multifiber splice device for splicing a plurality of first and second optical fibers, comprising:
a multifiber splice element having a body, having a plurality of alignment channels configured to receive the plurality of first and second optical fibers in an end-to-end manner; a clamp plate, wherein the clamp plate comprises a thin flexible glass clamp plate that is flexed to align and secure terminal ends of the plurality of first and second optical fibers in an interconnection region of the multifiber splice element; wherein at least one of the body and clamp plate being formed from a low coefficient of thermal expansion silica material; and an optical coupling material is disposed in at least a portion of the plurality alignment channels such that the optical coupling material is positioned between the plurality of first and second optical fibers. 19. The multifiber splice device of claim 18, further comprising a means of imparting a pressing force on the clamp plate which causes the clamp plate to flex aligning and securing terminal ends of the plurality of first and second optical fibers in the alignment channels in an interconnection region of the multifiber splice element. 20. The multifiber splice device of claim 19, wherein the silica material comprises a net shape cast and cure silica material. | A splice element for splicing a first and a second optical fiber comprises an alignment mechanism having a base plate and a clamp plate. At least one of the base plate and clamp plate is formed from a silica material and at least one of the base plate and clamp plate includes an alignment groove configured to receive the first and second optical fibers in an end-to-end manner. The splice element also comprises an optical adhesive disposed in at least a portion of the alignment groove, wherein the optical adhesive is curable via actinic radiation.1. A splice element for splicing a first and a second optical fiber, comprising:
an alignment mechanism having a base plate and a clamp plate, at least one of the base plate and clamp plate being formed from a silica material, and at least one of the base plate and clamp plate having an alignment groove configured to receive the first and second optical fibers in an end-to-end manner; and an optical adhesive disposed in at least a portion of the alignment groove, wherein the optical adhesive is curable via actinic radiation. 2. The splice element of claim 1, wherein the optical adhesive is blue light curable. 3. The splice element of claim 1, wherein the optical adhesive comprises an adhesive composition containing non-aggregated, surface-modified silica nano-particles dispersed in an epoxy resin. 4. The splice element of claim 1, wherein the optical adhesive changes color from an uncured state to a cured state. 5. The splice element of claim 1, wherein the base plate includes the alignment groove formed on a major surface therein. 6. The splice element of claim 1, further comprising a clip configured to receive the base plate and clamp plate therein and impart a pressing force on the base plate and clamp plate. 7. The splice element of claim 1, wherein at least one of the base plate and clamp plate is substantially transparent. 8. The splice element of claim 1, wherein the base plate further comprises partial funnel shaped entrance openings at both ends of the alignment groove, the partial funnel shaped entrance openings being wider than the alignment groove. 9. The splice element of claim 1, wherein the clamp plate comprises an alignment groove formed in a major surface therein. 10. The splice element of claim 1, wherein the base plate further comprises a plurality of pad structures formed on a major surface thereof, the pads configured to space the base plate and clamp plate from each other to create clearance for the insertion of the first and second optical fibers. 11. The splice element of claim 1, wherein the alignment mechanism is substantially cylindrical in shape. 12. The splice element of claim 1, wherein the base plate includes a plurality of alignment grooves formed on a major surface therein. 13. The splice element of claim 1, wherein the clamp plate comprises a flexible material. 14. The splice element of claim 1, wherein the silica material comprises a sol-based cast net shaped sintered silica material. 15. A multifiber splice device for splicing a plurality of first and second optical fibers, comprising:
a multifiber splice element having a body, having a plurality of alignment channels configured to receive the plurality of first and second optical fibers in an end-to-end manner, wherein the plurality of alignment channel has an arched profile; a clamp plate; wherein at least one of the body and clamp plate being formed from a low coefficient of thermal expansion silica material; and an optical coupling material is disposed in at least a portion of the plurality alignment channels such that the optical coupling material is positioned between the plurality of first and second optical fibers. 16. The multifiber splice device of claim 15, wherein the optical material comprises a blue light curable optical adhesive. 17. The multifiber splice device of claim 15, wherein the arched profile includes a generally planar portion at entrance openings at either end of the alignment channel, the alignment channel gently rises between the entrance openings and an interconnection region centrally located on the body and where the alignment channel crests in a shallow dome within the interconnection region. 18. A multifiber splice device for splicing a plurality of first and second optical fibers, comprising:
a multifiber splice element having a body, having a plurality of alignment channels configured to receive the plurality of first and second optical fibers in an end-to-end manner; a clamp plate, wherein the clamp plate comprises a thin flexible glass clamp plate that is flexed to align and secure terminal ends of the plurality of first and second optical fibers in an interconnection region of the multifiber splice element; wherein at least one of the body and clamp plate being formed from a low coefficient of thermal expansion silica material; and an optical coupling material is disposed in at least a portion of the plurality alignment channels such that the optical coupling material is positioned between the plurality of first and second optical fibers. 19. The multifiber splice device of claim 18, further comprising a means of imparting a pressing force on the clamp plate which causes the clamp plate to flex aligning and securing terminal ends of the plurality of first and second optical fibers in the alignment channels in an interconnection region of the multifiber splice element. 20. The multifiber splice device of claim 19, wherein the silica material comprises a net shape cast and cure silica material. | 2,800 |
12,332 | 12,332 | 16,015,982 | 2,853 | An ink composition including at least one component selected from the group consisting of a curable monomer and a curable oligomer; at least one non-radiation curable poly-alpha-olefin; at least one photoinitiator that absorbs at an ultraviolet light-emitting diode wavelength; and an optional colorant. A process of digital offset printing including applying an ink composition onto a re-imageable imaging member surface at an ink take up temperature, the re-imageable imaging member having dampening fluid disposed thereon; forming an ink image; transferring the ink image from the re-imageable surface of the imaging member to a printable substrate at an ink transfer temperature; wherein the ink composition comprises at least one component selected from the group consisting of a curable monomer and a curable oligomer; at least one non-radiation curable poly-alpha-olefin; at least one photoinitiator that absorbs at an ultraviolet light-emitting diode wavelength; and an optional colorant. | 1. An ink composition comprising:
at least one component selected from the group consisting of a curable monomer and a curable oligomer, wherein at least one of the curable oligomers is a polyester acrylate oligomer; at least one non-radiation curable poly-alpha-olefin; at least one photoinitiator that absorbs at an ultraviolet light-emitting diode wavelength; and an optional colorant. 2. The ink composition of claim 1, wherein the at least one component selected from the group consisting of a curable monomer and a curable oligomer is a component selected from the group consisting of acrylated polyesters, acrylated polyethers, acrylated epoxies, urethane acrylates, pentaerythritol tetraacrylate, and combinations thereof. 3. The ink composition of claim 1, wherein the at least one component selected from the group consisting of a curable monomer and a curable oligomer is a component selected from the group consisting of a tetrafunctional polyester acrylate oligomer, a propoxylated trimethylolpropane triacrylate monomer, and combinations thereof. 4. The ink composition of claim 1, wherein the at least one component selected from the group consisting of a curable monomer and a curable oligomer is a branched acrylate having from at least about 6 carbon atoms to about 20 carbon atoms. 5. The ink composition of claim 1, wherein the at least one poly-alpha-olefin is selected from the group consisting of branched synthetic-based poly-alpha-olefin, branched bio-based poly-alpha-olefin, and combinations thereof. 6. The ink composition of claim 1, wherein the at least one photoinitiator that absorbs at an ultraviolet light-emitting diode wavelength is a photoinitiator that absorbs at a wavelength of about 365 nanometers, about 385 nanometers, about 395 nanometers, or about 405 nanometers. 7. The ink composition of claim 1, wherein the at least one photoinitiator that absorbs at an ultraviolet light-emitting diode wavelength is a photoinitiator that absorbs at a selected wavelength of about 365 nanometers, about 385 nanometers, about 395 nanometers, or about 405 nanometers; and
wherein the ink composition further comprises at least one photoinitiator that does not absorb radiation at the selected light-emitting diode wavelength. 8. The ink composition of claim 1, wherein the at least one photoinitiator that absorbs at an ultraviolet light-emitting diode wavelength is 2,4,6-trimethylbenzoyl-diphenyl-phosphine oxide. 9. The ink composition of claim 1, wherein the at least one component selected from the group consisting of a curable monomer and a curable oligomer is present in the ink composition in an amount of from about 6 to about 80 percent by weight based upon the total weight of the ink composition. 10. The ink composition of claim 1, wherein the polyester acrylate oligomer is present in the ink composition in an amount of from at least about 6 to about 70 percent by weight based upon the total weight of the ink composition. 11. The ink composition of claim 1, wherein the at least one poly-alpha-olefin is present in the ink composition in an amount of from about 1 to about 10 percent by weight based upon the total weight of the ink composition. 12. The ink composition of claim 1, wherein the at least one photoinitiator that absorbs at an ultraviolet light-emitting diode wavelength is present in the ink composition in an amount of from at least about 7 to about 10 percent by weight based upon the total weight of the ink composition. 13. The ink composition of claim 1, further comprising:
a clay; or a clay in the form of a clay dispersion. 14. The ink composition of claim 1, wherein the colorant comprises a pigment. 15. The ink composition of claim 1, wherein the at least one component selected from the group consisting of a curable monomer and a curable oligomer is a polyester acrylate oligomer present in the ink composition in an amount of from at least about 6 to about 70 percent by weight based upon the total weight of the ink composition;
wherein the at least one poly-alpha-olefin is present in the ink composition in an amount of from about 1.5 to about 10 percent by weight based upon the total weight of the ink composition; wherein the at least one photoinitiator that absorbs at an ultraviolet light-emitting diode wavelength is present in the ink composition in an amount of from about 7 to about 10 percent by weight based upon the total weight of the ink composition. 16. The ink composition of claim 15, wherein the at least one photoinitiator that absorbs at an ultraviolet light-emitting diode wavelength is a photoinitiator that absorbs at a selected light-emitting diode wavelength of about 365 nanometers, about 385 nanometers, about 395 nanometers, or about 405 nanometers; and
wherein the ink composition further comprises at least one photoinitiator that does not absorb radiation at the selected light-emitting diode wavelength. 17. A process of digital offset printing, the process comprising:
applying an ink composition onto a re-imageable imaging member surface at an ink take up temperature, the re-imageable imaging member having dampening fluid disposed thereon; forming an ink image; transferring the ink image from the re-imageable surface of the imaging member to a printable substrate at an ink transfer temperature; wherein the ink composition comprises: at least one component selected from the group consisting of a curable monomer and a curable oligomer, wherein at least one of the curable oligomers is a polyester acrylate oligomer; at least one non-radiation curable poly-alpha-olefin; at least one photoinitiator that absorbs at an ultraviolet light-emitting diode wavelength; and an optional colorant. 18. A process comprising:
combining at least one component selected from the group consisting of a curable monomer and a curable oligomer, wherein at least one of the curable oligomers is a polyester acrylate oligomer; at least one non-radiation curable poly-alpha-olefin; at least one photoinitiator that absorbs at an ultraviolet light-emitting diode wavelength; and an optional colorant; optionally, heating; and optionally, filtering; to provide an ink composition. 19. The process of claim 18, wherein the at least one component selected from the group consisting of a curable monomer and a curable oligomer is present in the ink composition in an amount of from about 6 to about 80 percent by weight based upon the total weight of the ink composition;
wherein the at least one poly-alpha-olefin is present in the ink composition in an amount of from about 2 to about 10 percent by weight based upon the total weight of the ink composition; wherein the at least one photoinitiator that absorbs at an ultraviolet light-emitting diode wavelength, present in the ink composition in an amount of from about 7 to about 10 percent by weight based upon the total weight of the ink composition. 20. The process of claim 18, wherein the at least one photoinitiator that absorbs at an ultraviolet light-emitting diode wavelength is a photoinitiator that absorbs at a selected light-emitting diode wavelength of about 365 nanometers, about 385 nanometers, about 395 nanometers, or about 405 nanometers; and
wherein the ink composition further comprises at least one photoinitiator that does not absorb radiation at the selected light-emitting diode wavelength. | An ink composition including at least one component selected from the group consisting of a curable monomer and a curable oligomer; at least one non-radiation curable poly-alpha-olefin; at least one photoinitiator that absorbs at an ultraviolet light-emitting diode wavelength; and an optional colorant. A process of digital offset printing including applying an ink composition onto a re-imageable imaging member surface at an ink take up temperature, the re-imageable imaging member having dampening fluid disposed thereon; forming an ink image; transferring the ink image from the re-imageable surface of the imaging member to a printable substrate at an ink transfer temperature; wherein the ink composition comprises at least one component selected from the group consisting of a curable monomer and a curable oligomer; at least one non-radiation curable poly-alpha-olefin; at least one photoinitiator that absorbs at an ultraviolet light-emitting diode wavelength; and an optional colorant.1. An ink composition comprising:
at least one component selected from the group consisting of a curable monomer and a curable oligomer, wherein at least one of the curable oligomers is a polyester acrylate oligomer; at least one non-radiation curable poly-alpha-olefin; at least one photoinitiator that absorbs at an ultraviolet light-emitting diode wavelength; and an optional colorant. 2. The ink composition of claim 1, wherein the at least one component selected from the group consisting of a curable monomer and a curable oligomer is a component selected from the group consisting of acrylated polyesters, acrylated polyethers, acrylated epoxies, urethane acrylates, pentaerythritol tetraacrylate, and combinations thereof. 3. The ink composition of claim 1, wherein the at least one component selected from the group consisting of a curable monomer and a curable oligomer is a component selected from the group consisting of a tetrafunctional polyester acrylate oligomer, a propoxylated trimethylolpropane triacrylate monomer, and combinations thereof. 4. The ink composition of claim 1, wherein the at least one component selected from the group consisting of a curable monomer and a curable oligomer is a branched acrylate having from at least about 6 carbon atoms to about 20 carbon atoms. 5. The ink composition of claim 1, wherein the at least one poly-alpha-olefin is selected from the group consisting of branched synthetic-based poly-alpha-olefin, branched bio-based poly-alpha-olefin, and combinations thereof. 6. The ink composition of claim 1, wherein the at least one photoinitiator that absorbs at an ultraviolet light-emitting diode wavelength is a photoinitiator that absorbs at a wavelength of about 365 nanometers, about 385 nanometers, about 395 nanometers, or about 405 nanometers. 7. The ink composition of claim 1, wherein the at least one photoinitiator that absorbs at an ultraviolet light-emitting diode wavelength is a photoinitiator that absorbs at a selected wavelength of about 365 nanometers, about 385 nanometers, about 395 nanometers, or about 405 nanometers; and
wherein the ink composition further comprises at least one photoinitiator that does not absorb radiation at the selected light-emitting diode wavelength. 8. The ink composition of claim 1, wherein the at least one photoinitiator that absorbs at an ultraviolet light-emitting diode wavelength is 2,4,6-trimethylbenzoyl-diphenyl-phosphine oxide. 9. The ink composition of claim 1, wherein the at least one component selected from the group consisting of a curable monomer and a curable oligomer is present in the ink composition in an amount of from about 6 to about 80 percent by weight based upon the total weight of the ink composition. 10. The ink composition of claim 1, wherein the polyester acrylate oligomer is present in the ink composition in an amount of from at least about 6 to about 70 percent by weight based upon the total weight of the ink composition. 11. The ink composition of claim 1, wherein the at least one poly-alpha-olefin is present in the ink composition in an amount of from about 1 to about 10 percent by weight based upon the total weight of the ink composition. 12. The ink composition of claim 1, wherein the at least one photoinitiator that absorbs at an ultraviolet light-emitting diode wavelength is present in the ink composition in an amount of from at least about 7 to about 10 percent by weight based upon the total weight of the ink composition. 13. The ink composition of claim 1, further comprising:
a clay; or a clay in the form of a clay dispersion. 14. The ink composition of claim 1, wherein the colorant comprises a pigment. 15. The ink composition of claim 1, wherein the at least one component selected from the group consisting of a curable monomer and a curable oligomer is a polyester acrylate oligomer present in the ink composition in an amount of from at least about 6 to about 70 percent by weight based upon the total weight of the ink composition;
wherein the at least one poly-alpha-olefin is present in the ink composition in an amount of from about 1.5 to about 10 percent by weight based upon the total weight of the ink composition; wherein the at least one photoinitiator that absorbs at an ultraviolet light-emitting diode wavelength is present in the ink composition in an amount of from about 7 to about 10 percent by weight based upon the total weight of the ink composition. 16. The ink composition of claim 15, wherein the at least one photoinitiator that absorbs at an ultraviolet light-emitting diode wavelength is a photoinitiator that absorbs at a selected light-emitting diode wavelength of about 365 nanometers, about 385 nanometers, about 395 nanometers, or about 405 nanometers; and
wherein the ink composition further comprises at least one photoinitiator that does not absorb radiation at the selected light-emitting diode wavelength. 17. A process of digital offset printing, the process comprising:
applying an ink composition onto a re-imageable imaging member surface at an ink take up temperature, the re-imageable imaging member having dampening fluid disposed thereon; forming an ink image; transferring the ink image from the re-imageable surface of the imaging member to a printable substrate at an ink transfer temperature; wherein the ink composition comprises: at least one component selected from the group consisting of a curable monomer and a curable oligomer, wherein at least one of the curable oligomers is a polyester acrylate oligomer; at least one non-radiation curable poly-alpha-olefin; at least one photoinitiator that absorbs at an ultraviolet light-emitting diode wavelength; and an optional colorant. 18. A process comprising:
combining at least one component selected from the group consisting of a curable monomer and a curable oligomer, wherein at least one of the curable oligomers is a polyester acrylate oligomer; at least one non-radiation curable poly-alpha-olefin; at least one photoinitiator that absorbs at an ultraviolet light-emitting diode wavelength; and an optional colorant; optionally, heating; and optionally, filtering; to provide an ink composition. 19. The process of claim 18, wherein the at least one component selected from the group consisting of a curable monomer and a curable oligomer is present in the ink composition in an amount of from about 6 to about 80 percent by weight based upon the total weight of the ink composition;
wherein the at least one poly-alpha-olefin is present in the ink composition in an amount of from about 2 to about 10 percent by weight based upon the total weight of the ink composition; wherein the at least one photoinitiator that absorbs at an ultraviolet light-emitting diode wavelength, present in the ink composition in an amount of from about 7 to about 10 percent by weight based upon the total weight of the ink composition. 20. The process of claim 18, wherein the at least one photoinitiator that absorbs at an ultraviolet light-emitting diode wavelength is a photoinitiator that absorbs at a selected light-emitting diode wavelength of about 365 nanometers, about 385 nanometers, about 395 nanometers, or about 405 nanometers; and
wherein the ink composition further comprises at least one photoinitiator that does not absorb radiation at the selected light-emitting diode wavelength. | 2,800 |
12,333 | 12,333 | 16,016,035 | 2,853 | A composition including at least one component selected from the group consisting of a curable monomer and a curable oligomer; at least one photoinitiator that absorbs at an ultraviolet light-emitting diode wavelength; and at least one photoinitiator that does not absorb radiation at the ultraviolet light-emitting diode wavelength. A process of digital offset printing including applying a composition onto a re-imageable imaging member surface at an ink take up temperature, the re-imageable imaging member having dampening fluid disposed thereon; forming an ink image; transferring the ink image from the re-imageable surface of the imaging member to a printable substrate at an ink transfer temperature. A process including combining at least one component selected from the group consisting of a curable monomer and a curable oligomer; at least one photoinitiator that absorbs at an ultraviolet light-emitting diode wavelength; and at least one photoinitiator that does not absorb radiation at the ultraviolet light-emitting diode wavelength; optionally, heating; and optionally, filtering; to provide an LED curable composition. | 1. A composition comprising:
at least one component selected from the group consisting of a curable monomer and a curable oligomer; at least one photoinitiator that absorbs at an ultraviolet light-emitting diode wavelength; and at least one photoinitiator that does not absorb radiation at the ultraviolet light-emitting diode wavelength. 2. The composition of claim 1, wherein the at least one photoinitiator that absorbs at an ultraviolet light-emitting diode wavelength is a photoinitiator that absorbs at a wavelength of about 365 nanometers, about 385 nanometers, about 395 nanometers, or about 405 nanometers. 3. The composition of claim 1, wherein the at least one photoinitiator that absorbs at an ultraviolet light-emitting diode wavelength absorbs at a selected narrow spectral LED wavelength; and
wherein the at least one photoinitiator that does not absorb radiation at the ultraviolet light-emitting diode wavelength does not absorb at the selected narrow spectral LED wavelength. 4. The composition of claim 1, wherein the at least one photoinitiator that absorbs at an ultraviolet light-emitting diode wavelength absorbs at a selected narrow spectral LED wavelength; and
wherein the at least one photoinitiator that does not absorb radiation at the ultraviolet light-emitting diode wavelength absorbs over a range of ultra-violet wavelengths wherein the range is broader than the narrow spectral LED wavelength. 5. The composition of claim 1, wherein the at least one photoinitiator that absorbs at an ultraviolet light-emitting diode wavelength comprises a Type I photoinitiator, a Type II photoinitiator, or a combination thereof. 6. The composition of claim 5, further comprising a co-initiator. 7. The composition of claim 1, wherein the photoinitiator that absorbs at an ultraviolet light-emitting diode wavelength is selected from the group consisting of monoacylphosphine oxide, bisacylphosphine oxide, benzophenone, and combinations thereof. 8. The composition of claim 1, wherein the photoinitiator that absorbs at an ultraviolet light-emitting diode wavelength is selected from the group consisting of 2,4,6-trimethylbenzoyl-diphenyl-phosphine oxide, 4,4′-bis(diethylamino)benzophenone, bis(2,4,6-trimethylbenzoyl)-phenylphosphineoxide, 2-dimethyl amino-2-(4-methyl-benzyl)-1-(4-morpholin-4-yl-phenyl)-butan-1-one, (2-Methyl-4′-(methylthio)-2-morpholinopropiophenone), and combinations thereof. 9. The composition of claim 1, further comprising a co-initiator; wherein the co-initiator is selected from the group consisting of dihydroxyethyl-para-toluidine, ethyl-4-dimethylaminobenzoate, N-methyldiethanolaamine, 2-ethylhexyl-4-dimethylaminobenzoate diethylaminoethyl methacrylate, diethylaminoethyl methacrylate, and combinations thereof. 10. The composition of claim 1, wherein the at least one component selected from the group consisting of a curable monomer and a curable oligomer is a component selected from the group consisting of acrylated polyesters, acrylated polyethers, acrylated epoxies, urethane acrylates, and pentaerythritol tetraacrylate, and combinations thereof. 11. The composition of claim 1, wherein the at least one component selected from the group consisting of a curable monomer and a curable oligomer is a component selected from the group consisting of a tetrafunctional polyester acrylate oligomer, a propoxylated trimethylolpropane triacrylate monomer, and combinations thereof. 12. The composition of claim 1, further comprising:
at least one non-radiation curable poly-alpha-olefin; 13. The composition of claim 1, wherein the composition is substantially free of colorant. 14. The composition of claim 1, wherein the composition is substantially colorless or is a tinted clear ink upon printing. 15. A process of digital offset printing, the process comprising:
applying a composition onto a re-imageable imaging member surface at an ink take up temperature, the re-imageable imaging member having dampening fluid disposed thereon; forming an ink image; transferring the ink image from the re-imageable surface of the imaging member to a printable substrate at an ink transfer temperature; wherein the ink composition comprises: at least one component selected from the group consisting of a curable monomer and a curable oligomer; at least one photoinitiator that absorbs at an ultraviolet light-emitting diode wavelength; and at least one photoinitiator that does not absorb radiation at the ultraviolet light-emitting diode wavelength. 16. The process of claim 15, wherein the printable substrate comprises a pre-imaged substrate; and
wherein forming an ink image and transferring the ink image comprises forming and transferring over the pre-image on the substrate. 17. The process of claim 15, wherein the at least one photoinitiator that absorbs at an ultraviolet light-emitting diode wavelength is a photoinitiator that absorbs at a selected narrow spectral LED wavelength of about 365 nanometers, about 385 nanometers, about 395 nanometers, or about 405 nanometers; and
wherein the at least one photoinitiator that does not absorb radiation at the ultraviolet light-emitting diode wavelength does not absorb at the selected narrow spectral LED wavelength. 18. The process of claim 15, wherein the at least one photoinitiator that absorbs at an ultraviolet light-emitting diode wavelength comprises a Type I photoinitiator, a Type II photoinitiator, or a combination thereof; and wherein the composition further optionally comprises a co-initiator. 19. A composition comprising:
at least one component selected from the group consisting of a curable monomer and a curable oligomer; optionally, at least one non-radiation curable poly-alpha-olefin; at least one first photoinitiator that absorbs at an ultraviolet light-emitting diode wavelength, wherein the at least one first photoinitiator comprises a Type I photoinitiator; at least one second photoinitiator that absorbs at an ultraviolet light-emitting diode wavelength, wherein the at least one second photoinitiator comprises a Type II photoinitiator; and optionally, at least one co-initiator. 20. The composition of claim 19, wherein the composition is substantially free of colorant. | A composition including at least one component selected from the group consisting of a curable monomer and a curable oligomer; at least one photoinitiator that absorbs at an ultraviolet light-emitting diode wavelength; and at least one photoinitiator that does not absorb radiation at the ultraviolet light-emitting diode wavelength. A process of digital offset printing including applying a composition onto a re-imageable imaging member surface at an ink take up temperature, the re-imageable imaging member having dampening fluid disposed thereon; forming an ink image; transferring the ink image from the re-imageable surface of the imaging member to a printable substrate at an ink transfer temperature. A process including combining at least one component selected from the group consisting of a curable monomer and a curable oligomer; at least one photoinitiator that absorbs at an ultraviolet light-emitting diode wavelength; and at least one photoinitiator that does not absorb radiation at the ultraviolet light-emitting diode wavelength; optionally, heating; and optionally, filtering; to provide an LED curable composition.1. A composition comprising:
at least one component selected from the group consisting of a curable monomer and a curable oligomer; at least one photoinitiator that absorbs at an ultraviolet light-emitting diode wavelength; and at least one photoinitiator that does not absorb radiation at the ultraviolet light-emitting diode wavelength. 2. The composition of claim 1, wherein the at least one photoinitiator that absorbs at an ultraviolet light-emitting diode wavelength is a photoinitiator that absorbs at a wavelength of about 365 nanometers, about 385 nanometers, about 395 nanometers, or about 405 nanometers. 3. The composition of claim 1, wherein the at least one photoinitiator that absorbs at an ultraviolet light-emitting diode wavelength absorbs at a selected narrow spectral LED wavelength; and
wherein the at least one photoinitiator that does not absorb radiation at the ultraviolet light-emitting diode wavelength does not absorb at the selected narrow spectral LED wavelength. 4. The composition of claim 1, wherein the at least one photoinitiator that absorbs at an ultraviolet light-emitting diode wavelength absorbs at a selected narrow spectral LED wavelength; and
wherein the at least one photoinitiator that does not absorb radiation at the ultraviolet light-emitting diode wavelength absorbs over a range of ultra-violet wavelengths wherein the range is broader than the narrow spectral LED wavelength. 5. The composition of claim 1, wherein the at least one photoinitiator that absorbs at an ultraviolet light-emitting diode wavelength comprises a Type I photoinitiator, a Type II photoinitiator, or a combination thereof. 6. The composition of claim 5, further comprising a co-initiator. 7. The composition of claim 1, wherein the photoinitiator that absorbs at an ultraviolet light-emitting diode wavelength is selected from the group consisting of monoacylphosphine oxide, bisacylphosphine oxide, benzophenone, and combinations thereof. 8. The composition of claim 1, wherein the photoinitiator that absorbs at an ultraviolet light-emitting diode wavelength is selected from the group consisting of 2,4,6-trimethylbenzoyl-diphenyl-phosphine oxide, 4,4′-bis(diethylamino)benzophenone, bis(2,4,6-trimethylbenzoyl)-phenylphosphineoxide, 2-dimethyl amino-2-(4-methyl-benzyl)-1-(4-morpholin-4-yl-phenyl)-butan-1-one, (2-Methyl-4′-(methylthio)-2-morpholinopropiophenone), and combinations thereof. 9. The composition of claim 1, further comprising a co-initiator; wherein the co-initiator is selected from the group consisting of dihydroxyethyl-para-toluidine, ethyl-4-dimethylaminobenzoate, N-methyldiethanolaamine, 2-ethylhexyl-4-dimethylaminobenzoate diethylaminoethyl methacrylate, diethylaminoethyl methacrylate, and combinations thereof. 10. The composition of claim 1, wherein the at least one component selected from the group consisting of a curable monomer and a curable oligomer is a component selected from the group consisting of acrylated polyesters, acrylated polyethers, acrylated epoxies, urethane acrylates, and pentaerythritol tetraacrylate, and combinations thereof. 11. The composition of claim 1, wherein the at least one component selected from the group consisting of a curable monomer and a curable oligomer is a component selected from the group consisting of a tetrafunctional polyester acrylate oligomer, a propoxylated trimethylolpropane triacrylate monomer, and combinations thereof. 12. The composition of claim 1, further comprising:
at least one non-radiation curable poly-alpha-olefin; 13. The composition of claim 1, wherein the composition is substantially free of colorant. 14. The composition of claim 1, wherein the composition is substantially colorless or is a tinted clear ink upon printing. 15. A process of digital offset printing, the process comprising:
applying a composition onto a re-imageable imaging member surface at an ink take up temperature, the re-imageable imaging member having dampening fluid disposed thereon; forming an ink image; transferring the ink image from the re-imageable surface of the imaging member to a printable substrate at an ink transfer temperature; wherein the ink composition comprises: at least one component selected from the group consisting of a curable monomer and a curable oligomer; at least one photoinitiator that absorbs at an ultraviolet light-emitting diode wavelength; and at least one photoinitiator that does not absorb radiation at the ultraviolet light-emitting diode wavelength. 16. The process of claim 15, wherein the printable substrate comprises a pre-imaged substrate; and
wherein forming an ink image and transferring the ink image comprises forming and transferring over the pre-image on the substrate. 17. The process of claim 15, wherein the at least one photoinitiator that absorbs at an ultraviolet light-emitting diode wavelength is a photoinitiator that absorbs at a selected narrow spectral LED wavelength of about 365 nanometers, about 385 nanometers, about 395 nanometers, or about 405 nanometers; and
wherein the at least one photoinitiator that does not absorb radiation at the ultraviolet light-emitting diode wavelength does not absorb at the selected narrow spectral LED wavelength. 18. The process of claim 15, wherein the at least one photoinitiator that absorbs at an ultraviolet light-emitting diode wavelength comprises a Type I photoinitiator, a Type II photoinitiator, or a combination thereof; and wherein the composition further optionally comprises a co-initiator. 19. A composition comprising:
at least one component selected from the group consisting of a curable monomer and a curable oligomer; optionally, at least one non-radiation curable poly-alpha-olefin; at least one first photoinitiator that absorbs at an ultraviolet light-emitting diode wavelength, wherein the at least one first photoinitiator comprises a Type I photoinitiator; at least one second photoinitiator that absorbs at an ultraviolet light-emitting diode wavelength, wherein the at least one second photoinitiator comprises a Type II photoinitiator; and optionally, at least one co-initiator. 20. The composition of claim 19, wherein the composition is substantially free of colorant. | 2,800 |
12,334 | 12,334 | 15,455,290 | 2,859 | A computer-implemented method, system and computer program product for managing remaining battery charge capacity in a battery-powered device having a power saving mode are provided. The computer-implemented method, system and computer program product ingest history data, the history data includes user application usage history data, user location history data, and battery charging history data for the device; forecast, based on real-time usage data, location data, battery charge data, and the ingested history data, a risk of running out of battery power; and adjust, in response to the forecasted risk, the device from a normal operating mode to a power saving mode to reduce battery consumption. | 1. A computer-implemented method of managing remaining battery charge capacity of a battery in a battery-powered device having a power saving mode, the method comprising:
ingesting history data, the history data including user application usage history data, user location history data, and battery charging history data for the device; forecasting, based on real-time usage data, location data, battery charge data, and the ingested history data, a risk of running out of battery power; and adjusting, in response to the forecasted risk, the device from a normal operating mode to a power saving mode to reduce battery consumption. 2. The computer-implemented method of claim 1, wherein the power saving mode includes at least one application lockout mode based on user usage history. 3. The computer-implemented method of claim 1, wherein the power saving mode includes at least one application lockout mode based on stated user preferences. 4. The computer-implemented method of claim 1, wherein a recurrent neural network (RNN) is used to forecast the risk based on predicting usage of the device between a current time and a predicted time when the battery may be recharged. 5. The computer-implemented method of claim 4, wherein the predicted time is based on a predicted location of the device. 6. A computing system for managing remaining battery charge capacity of a battery in a battery-powered device having a power saving mode, the computing system comprising:
at least one storage system for storing code data; and at least one processor for processing the stored code data to: ingest history data, the history data including user application usage history data, user location history data, and battery charging history data for the device; forecast, based on real-time usage data, location data, battery charge data, and the ingested history data, a risk of running out of battery power; and adjust, in response to the forecasted risk, the device from a normal operating mode to a power saving mode to reduce battery consumption. 7. The computing system of claim 6, wherein the power saving mode includes at least one application lockout mode based on user usage history. 8. The computing system of claim 6, wherein the power saving mode includes at least one application lockout mode based on stated user preferences. 9. The computing system claim 6, wherein a recurrent neural network (RNN) is used to forecast the risk based on predicting usage of the device between a current time and a predicted time when the battery may be recharged. 10. The computing system claim 9, wherein the predicted time is based on a predicted location of the device. 11. A computer program product for managing remaining battery charge capacity of a battery in a battery-powered device having a power saving mode, the computer program product comprising a computer-readable storage medium having program instructions embodied therewith, the instructions executable by a processor to cause the processor to:
ingest history data, the history data including user application usage history data, user location history data, and battery charging history data for the device; forecast, based on real-time usage data, location data, battery charge data, and the ingested history data, a risk of running out of battery power; and adjust, in response to the forecasted risk, the device from a normal operating mode to a power saving mode to reduce battery consumption. 12. The computer program product of claim 11, wherein the power saving mode includes at least one application lockout mode based on user usage history. 13. The computer program product of claim 11, wherein the power saving mode includes at least one application lockout mode based on stated user preferences. 14. The computer program product claim 11, wherein a recurrent neural network (RNN) is used to forecast the risk based on predicting usage of the device between a current time and a predicted time when the battery may be recharged. 15. The computer program product of claim 14, wherein the predicted time is based on a predicted location of the device. 16. A computer-implemented method comprising:
ingesting history data, the history data including application usage history data, critical activity history data, location history data, and battery charging history data for a computing device; forecasting, based on real-time usage data, location data, battery charge data, and the ingested history data, a must-succeed moment of the computing device; and modifying, in response to the forecasted must-succeed moment, present activity of the computing device. 17. The computer-implemented method of claim 16, wherein modifying the present activity of the computing device includes blocking the device from performing potentially disruptive activities. 18. The computer-implemented method of claim 16, wherein modifying the present activity of the computing device includes blocking the device from performing non-critical activities. 19. The computer-implemented method of claim 16, wherein the potentially disruptive activities include software updates. 20. The computer-implemented method of claim 19, wherein the potentially disruptive activities are blocked to ensure that software bugs are not introduced into the computing device before the forecasted must-succeed moment. | A computer-implemented method, system and computer program product for managing remaining battery charge capacity in a battery-powered device having a power saving mode are provided. The computer-implemented method, system and computer program product ingest history data, the history data includes user application usage history data, user location history data, and battery charging history data for the device; forecast, based on real-time usage data, location data, battery charge data, and the ingested history data, a risk of running out of battery power; and adjust, in response to the forecasted risk, the device from a normal operating mode to a power saving mode to reduce battery consumption.1. A computer-implemented method of managing remaining battery charge capacity of a battery in a battery-powered device having a power saving mode, the method comprising:
ingesting history data, the history data including user application usage history data, user location history data, and battery charging history data for the device; forecasting, based on real-time usage data, location data, battery charge data, and the ingested history data, a risk of running out of battery power; and adjusting, in response to the forecasted risk, the device from a normal operating mode to a power saving mode to reduce battery consumption. 2. The computer-implemented method of claim 1, wherein the power saving mode includes at least one application lockout mode based on user usage history. 3. The computer-implemented method of claim 1, wherein the power saving mode includes at least one application lockout mode based on stated user preferences. 4. The computer-implemented method of claim 1, wherein a recurrent neural network (RNN) is used to forecast the risk based on predicting usage of the device between a current time and a predicted time when the battery may be recharged. 5. The computer-implemented method of claim 4, wherein the predicted time is based on a predicted location of the device. 6. A computing system for managing remaining battery charge capacity of a battery in a battery-powered device having a power saving mode, the computing system comprising:
at least one storage system for storing code data; and at least one processor for processing the stored code data to: ingest history data, the history data including user application usage history data, user location history data, and battery charging history data for the device; forecast, based on real-time usage data, location data, battery charge data, and the ingested history data, a risk of running out of battery power; and adjust, in response to the forecasted risk, the device from a normal operating mode to a power saving mode to reduce battery consumption. 7. The computing system of claim 6, wherein the power saving mode includes at least one application lockout mode based on user usage history. 8. The computing system of claim 6, wherein the power saving mode includes at least one application lockout mode based on stated user preferences. 9. The computing system claim 6, wherein a recurrent neural network (RNN) is used to forecast the risk based on predicting usage of the device between a current time and a predicted time when the battery may be recharged. 10. The computing system claim 9, wherein the predicted time is based on a predicted location of the device. 11. A computer program product for managing remaining battery charge capacity of a battery in a battery-powered device having a power saving mode, the computer program product comprising a computer-readable storage medium having program instructions embodied therewith, the instructions executable by a processor to cause the processor to:
ingest history data, the history data including user application usage history data, user location history data, and battery charging history data for the device; forecast, based on real-time usage data, location data, battery charge data, and the ingested history data, a risk of running out of battery power; and adjust, in response to the forecasted risk, the device from a normal operating mode to a power saving mode to reduce battery consumption. 12. The computer program product of claim 11, wherein the power saving mode includes at least one application lockout mode based on user usage history. 13. The computer program product of claim 11, wherein the power saving mode includes at least one application lockout mode based on stated user preferences. 14. The computer program product claim 11, wherein a recurrent neural network (RNN) is used to forecast the risk based on predicting usage of the device between a current time and a predicted time when the battery may be recharged. 15. The computer program product of claim 14, wherein the predicted time is based on a predicted location of the device. 16. A computer-implemented method comprising:
ingesting history data, the history data including application usage history data, critical activity history data, location history data, and battery charging history data for a computing device; forecasting, based on real-time usage data, location data, battery charge data, and the ingested history data, a must-succeed moment of the computing device; and modifying, in response to the forecasted must-succeed moment, present activity of the computing device. 17. The computer-implemented method of claim 16, wherein modifying the present activity of the computing device includes blocking the device from performing potentially disruptive activities. 18. The computer-implemented method of claim 16, wherein modifying the present activity of the computing device includes blocking the device from performing non-critical activities. 19. The computer-implemented method of claim 16, wherein the potentially disruptive activities include software updates. 20. The computer-implemented method of claim 19, wherein the potentially disruptive activities are blocked to ensure that software bugs are not introduced into the computing device before the forecasted must-succeed moment. | 2,800 |
12,335 | 12,335 | 16,217,661 | 2,814 | A semiconductor device may include a plurality of first active fins protruding from a substrate, each of the first active fins extending in a first direction; a second active fin protruding from the substrate; and a plurality of respective first fin-field effect transistors (finFETs) on the first active fins. Each of the first finFETs includes a first gate structure extending in a second direction perpendicular to the first direction, and the first gate structure includes a first gate insulation layer and a first gate electrode. The first finFETs are formed on a first region of the substrate and have a first metal oxide layer as the first gate insulation layer, and a second finFET is formed on the second active fin on a second region of the substrate, and the second finFET does not include a metal oxide layer, but includes a second gate insulation layer that has a bottom surface at the same plane as a bottom surface of the first metal oxide layer. | 1. A semiconductor device, comprising:
a plurality of first active fins protruding from a substrate, each of the first active fins extending in a first direction; a second active fin protruding from the substrate; and a plurality of respective first fin-field effect transistors (finFETs) on the first active fins, wherein each of the first finFETs includes a first gate structure extending in a second direction perpendicular to the first direction, and the first gate structure includes a first gate insulation layer and a first gate electrode, wherein the first finFETs are formed on a first region of the substrate and have a first metal oxide layer as the first gate insulation layer, and wherein a second finFET is formed on the second active fin on a second region of the substrate, and the second finFET does not include a metal oxide layer, but includes a second gate insulation layer that has a bottom surface at the same plane as a bottom surface of the first metal oxide layer. 2. The semiconductor device of claim 1, wherein the first region includes a logic cell region and the second region includes at least a portion of a peripheral region. 3. The semiconductor device of claim 2, wherein the first region includes a logic cell region and a portion of the peripheral region, and a third finFET having electrical characteristics different from the second finFET is further formed in the peripheral region of the first region. 4. The semiconductor device of claim 3, wherein the third finFET includes a third gate structure extending in the second direction, and the third gate structure includes a second silicon oxide layer, a metal oxide layer and a third gate electrode, wherein the metal oxide layer surrounds sidewalls and a bottom of the third gate electrode, and the second silicon oxide layer contacts the metal oxide layer under the third gate electrode. 5. The semiconductor device of claim 4, wherein the second silicon oxide layer has a thickness different from a thickness of a first silicon oxide layer that forms the second gate insulation layer. 6. The semiconductor device of claim 1, wherein the first gate insulation layer surrounds sidewalls and a bottom of the first gate electrode. 7. The semiconductor device of claim 1, wherein the second active fin extends in the first direction, and the second finFET serves as an I/O device. 8. The semiconductor device of claim 7, wherein:
each first gate insulation layer in each of the first finFETs has a first thickness, the second finFET includes a second gate structure extending in the second direction, and the second gate structure includes a first silicon oxide layer as the second gate insulation layer and a second gate electrode, wherein for the second finFET, the first silicon oxide layer is formed on only a bottom surface of the second gate electrode, and wherein the first silicon oxide layer has a second thickness different from the first thickness. 9. The semiconductor device of claim 8, wherein the first silicon oxide layer of the second finFET and the first gate insulation layer in each of the first finFETs each contact a top surface of a respective fin and have coplanar bottom surfaces with respect to each other where they contact each respective fin. 10. The semiconductor device of claim 7, wherein a third finFET having electrical characteristics different from the second finFET is further formed on the second region, wherein the third finFET includes a third gate structure including a second silicon oxide layer and a third gate electrode, wherein the second silicon oxide layer has a thickness different from a thickness of a first silicon oxide layer that forms the second gate insulation layer. 11. A semiconductor device, comprising:
a plurality of first active fins protruding from a logic cell region of a substrate, each of the first active fins extending in a first direction; a plurality of first fin-field effect transistors (finFETs) on the first active fins, wherein each of the first finFETs includes a first gate structure extending in a second direction perpendicular to the first direction, and the first gate structure includes a first gate insulation layer and a first gate electrode, the first gate insulation layer including a metal oxide layer; a plurality of second active fins protruding from a peripheral region of the substrate, each of the second active fins extending in the first direction; and a second finFET on a first fin of the second active fins, wherein the second finFET includes a second gate structure extending in the second direction, and the second gate structure includes a first silicon oxide layer and a second gate electrode, the first silicon oxide layer forming a second gate insulation layer and having a thickness different from a thickness of the first gate insulation layer, wherein the metal oxide layer for each first finFET is formed adjacent to each first active fin respectively and the first silicon oxide layer is formed adjacent to the first fin of the second active fins. 12. The semiconductor device of claim 11, wherein the first gate insulation layer surrounds sidewalls and a bottom of the first gate electrode. 13. The semiconductor device of claim 11, wherein the first silicon oxide layer is formed on only a bottom of the second gate electrode. 14. The semiconductor device of claim 11, wherein the first finFETs are in a logic region of the semiconductor device and the second finFET is in an I/O region of the semiconductor device. 15. The semiconductor device of claim 11, further comprising a third finFET formed in the peripheral region, the third finFET having electrical characteristics different from the second finFET formed in the peripheral region. 16. The semiconductor device of claim 15, wherein the third finFET includes a gate structure including a second silicon oxide layer, a metal oxide layer and a third gate electrode, wherein the metal oxide layer surrounds sidewalls and a bottom of the third gate electrode, and the second silicon oxide layer has a thickness different from the first silicon oxide layer. 17. A semiconductor device, comprising:
a plurality of first active fins protruding from a substrate, each of the first active fins extending in a first direction; a plurality of second active fins protruding from the substrate, each of the second active fins extending in the first direction; a plurality of first fin-field effect transistors (finFETs) on the first active fins; a plurality of second finFETs on the second active fins; and a first gate structure extending in a second direction perpendicular to the first direction and crossing over the plurality of first finFETs and the plurality of second finFETs, wherein the first gate structure includes a first gate insulation layer including a metal oxide layer, and a first gate electrode, wherein one first finFET of the first finFETs is directly adjacent to one second finFET of the second finFETs, and at a boundary region where the one first finFET is directly adjacent to the one second finFET, a gap in the metal oxide layer is formed. 18. The semiconductor device of claim 17, wherein the first gate electrode is a continuous conductive structure that connects the one first finFET to the one second finFET. 19. The semiconductor device of claim 18, wherein the one first finFET is an n-type finFET and the one second finFET is a p-type finFET, wherein the n-type finFET and the p-type finFET include the first gate electrode as a common first gate electrode extending in the second direction. 20. The semiconductor device of claim 17, wherein the one first finFET is an n-type finFET and one second finFET is a p-type finFET, wherein the n-type finFET and the p-type finFET include respective first and second gate electrodes physically separated from each other. 21. (canceled) | A semiconductor device may include a plurality of first active fins protruding from a substrate, each of the first active fins extending in a first direction; a second active fin protruding from the substrate; and a plurality of respective first fin-field effect transistors (finFETs) on the first active fins. Each of the first finFETs includes a first gate structure extending in a second direction perpendicular to the first direction, and the first gate structure includes a first gate insulation layer and a first gate electrode. The first finFETs are formed on a first region of the substrate and have a first metal oxide layer as the first gate insulation layer, and a second finFET is formed on the second active fin on a second region of the substrate, and the second finFET does not include a metal oxide layer, but includes a second gate insulation layer that has a bottom surface at the same plane as a bottom surface of the first metal oxide layer.1. A semiconductor device, comprising:
a plurality of first active fins protruding from a substrate, each of the first active fins extending in a first direction; a second active fin protruding from the substrate; and a plurality of respective first fin-field effect transistors (finFETs) on the first active fins, wherein each of the first finFETs includes a first gate structure extending in a second direction perpendicular to the first direction, and the first gate structure includes a first gate insulation layer and a first gate electrode, wherein the first finFETs are formed on a first region of the substrate and have a first metal oxide layer as the first gate insulation layer, and wherein a second finFET is formed on the second active fin on a second region of the substrate, and the second finFET does not include a metal oxide layer, but includes a second gate insulation layer that has a bottom surface at the same plane as a bottom surface of the first metal oxide layer. 2. The semiconductor device of claim 1, wherein the first region includes a logic cell region and the second region includes at least a portion of a peripheral region. 3. The semiconductor device of claim 2, wherein the first region includes a logic cell region and a portion of the peripheral region, and a third finFET having electrical characteristics different from the second finFET is further formed in the peripheral region of the first region. 4. The semiconductor device of claim 3, wherein the third finFET includes a third gate structure extending in the second direction, and the third gate structure includes a second silicon oxide layer, a metal oxide layer and a third gate electrode, wherein the metal oxide layer surrounds sidewalls and a bottom of the third gate electrode, and the second silicon oxide layer contacts the metal oxide layer under the third gate electrode. 5. The semiconductor device of claim 4, wherein the second silicon oxide layer has a thickness different from a thickness of a first silicon oxide layer that forms the second gate insulation layer. 6. The semiconductor device of claim 1, wherein the first gate insulation layer surrounds sidewalls and a bottom of the first gate electrode. 7. The semiconductor device of claim 1, wherein the second active fin extends in the first direction, and the second finFET serves as an I/O device. 8. The semiconductor device of claim 7, wherein:
each first gate insulation layer in each of the first finFETs has a first thickness, the second finFET includes a second gate structure extending in the second direction, and the second gate structure includes a first silicon oxide layer as the second gate insulation layer and a second gate electrode, wherein for the second finFET, the first silicon oxide layer is formed on only a bottom surface of the second gate electrode, and wherein the first silicon oxide layer has a second thickness different from the first thickness. 9. The semiconductor device of claim 8, wherein the first silicon oxide layer of the second finFET and the first gate insulation layer in each of the first finFETs each contact a top surface of a respective fin and have coplanar bottom surfaces with respect to each other where they contact each respective fin. 10. The semiconductor device of claim 7, wherein a third finFET having electrical characteristics different from the second finFET is further formed on the second region, wherein the third finFET includes a third gate structure including a second silicon oxide layer and a third gate electrode, wherein the second silicon oxide layer has a thickness different from a thickness of a first silicon oxide layer that forms the second gate insulation layer. 11. A semiconductor device, comprising:
a plurality of first active fins protruding from a logic cell region of a substrate, each of the first active fins extending in a first direction; a plurality of first fin-field effect transistors (finFETs) on the first active fins, wherein each of the first finFETs includes a first gate structure extending in a second direction perpendicular to the first direction, and the first gate structure includes a first gate insulation layer and a first gate electrode, the first gate insulation layer including a metal oxide layer; a plurality of second active fins protruding from a peripheral region of the substrate, each of the second active fins extending in the first direction; and a second finFET on a first fin of the second active fins, wherein the second finFET includes a second gate structure extending in the second direction, and the second gate structure includes a first silicon oxide layer and a second gate electrode, the first silicon oxide layer forming a second gate insulation layer and having a thickness different from a thickness of the first gate insulation layer, wherein the metal oxide layer for each first finFET is formed adjacent to each first active fin respectively and the first silicon oxide layer is formed adjacent to the first fin of the second active fins. 12. The semiconductor device of claim 11, wherein the first gate insulation layer surrounds sidewalls and a bottom of the first gate electrode. 13. The semiconductor device of claim 11, wherein the first silicon oxide layer is formed on only a bottom of the second gate electrode. 14. The semiconductor device of claim 11, wherein the first finFETs are in a logic region of the semiconductor device and the second finFET is in an I/O region of the semiconductor device. 15. The semiconductor device of claim 11, further comprising a third finFET formed in the peripheral region, the third finFET having electrical characteristics different from the second finFET formed in the peripheral region. 16. The semiconductor device of claim 15, wherein the third finFET includes a gate structure including a second silicon oxide layer, a metal oxide layer and a third gate electrode, wherein the metal oxide layer surrounds sidewalls and a bottom of the third gate electrode, and the second silicon oxide layer has a thickness different from the first silicon oxide layer. 17. A semiconductor device, comprising:
a plurality of first active fins protruding from a substrate, each of the first active fins extending in a first direction; a plurality of second active fins protruding from the substrate, each of the second active fins extending in the first direction; a plurality of first fin-field effect transistors (finFETs) on the first active fins; a plurality of second finFETs on the second active fins; and a first gate structure extending in a second direction perpendicular to the first direction and crossing over the plurality of first finFETs and the plurality of second finFETs, wherein the first gate structure includes a first gate insulation layer including a metal oxide layer, and a first gate electrode, wherein one first finFET of the first finFETs is directly adjacent to one second finFET of the second finFETs, and at a boundary region where the one first finFET is directly adjacent to the one second finFET, a gap in the metal oxide layer is formed. 18. The semiconductor device of claim 17, wherein the first gate electrode is a continuous conductive structure that connects the one first finFET to the one second finFET. 19. The semiconductor device of claim 18, wherein the one first finFET is an n-type finFET and the one second finFET is a p-type finFET, wherein the n-type finFET and the p-type finFET include the first gate electrode as a common first gate electrode extending in the second direction. 20. The semiconductor device of claim 17, wherein the one first finFET is an n-type finFET and one second finFET is a p-type finFET, wherein the n-type finFET and the p-type finFET include respective first and second gate electrodes physically separated from each other. 21. (canceled) | 2,800 |
12,336 | 12,336 | 16,591,444 | 2,844 | Lighting apparatuses include an enclosure around first and second light engines. The enclosure has a diffuser over first, second and third regions. The first and second regions are separated by the third region; a first light spectrum is emitted from the first region; a second light spectrum is emitted from the second region; and a mixture of the spectrums is emitted from the third region. In some embodiments, the first spectrum has a CCT≥7000K; the second spectrum has a CCT≤6500K. In some embodiments, the first spectrum has a first CCT≥3500K; the second spectrum has a second CCT≤6500K; the second CCT<first CCT and the difference between the CCTs is at least 1000K. In some embodiments, the first spectrum has a color bounded by a first set of chromaticity coordinates, and the second spectrum has a color bounded by a second set. | 1. A lighting apparatus comprising:
a first light engine that produces a first light spectrum having a first correlated color temperature (CCT) greater than or equal to 17,000 K; a second light engine that produces a second light spectrum having a second CCT less than or equal to 6500 K; and an enclosure around the first light engine and the second light engine, the enclosure having an optical diffuser, wherein the optical diffuser is positioned over a first region, a second region and a third region of the enclosure; wherein: the first region and the second region are separated by the third region; the first light spectrum is primarily emitted from the first region of the enclosure; the second light spectrum is primarily emitted from the second region of the enclosure; a mixture of the first light spectrum and the second light spectrum is emitted from the third region of the enclosures; a primary viewing area of a user is adjacent or below the third region in an installation orientation of the lighting apparatus; and a total melanopic to photopic ratio (M/P ratio) emitted by the lighting apparatus and received by the user is greater than 1.0. 2. The lighting apparatus of claim 1 wherein the first region is vertically above the second region, relative to ground, in the installation orientation of the lighting apparatus. 3. (canceled) 4. The lighting apparatus of claim 1 wherein in the installation orientation of the lighting apparatus, the first light spectrum is emitted upward relative to ground, the mixture is emitted in a horizontal direction, and the second light spectrum is emitted downward relative the ground. 5. The lighting apparatus of claim 1 wherein:
the first light engine emits a first blue emission peak in a first wavelength range of 450 nm to 480 nm; and
the second light engine emits a second blue emission peak in a second wavelength range of 480 nm to 500 nm. 6. (canceled) 7. The lighting apparatus of claim 1 wherein the second CCT is 4000 K to 5000 K. 8. The lighting apparatus of claim 1 wherein the first light spectrum has an M/P ratio greater than or equal to 1.7. 9. The lighting apparatus of claim 1 wherein the mixture emitted from the third region has a third CCT profile comprising a gradient from the first CCT to the second CCT. 10. The lighting apparatus of claim 1 wherein a first light emitting diode (LED) of the first light engine and a second LED of the second light engine face each other and are near opposite ends of the lighting apparatus. 11. The lighting apparatus of claim 1 wherein the optical diffuser is a continuous piece covering the first region, the second region and the third region. 12. The lighting apparatus of claim 1 wherein:
the optical diffuser comprises a translucent material; and
at least one of the first light spectrum and the second light spectrum partially reflects off an interior surface of the optical diffuser. 13. A lighting apparatus comprising:
a first light engine that produces a first light spectrum having a first correlated color temperature (CCT) greater than or equal to 3500 K; a second light engine that produces a second light spectrum having a second CCT less than or equal to 6500 K, wherein the second CCT is less than the first CCT and a difference between the first CCT and the second CCT is at least 10,000 K; and an enclosure around the first light engine and the second light engine, the enclosure having an optical diffuser, wherein the optical diffuser is positioned over a first region, a second region and a third region of the enclosure; wherein: the first region and the second region are separated by the third region; the first light spectrum is primarily emitted from the first region of the enclosure; the second light spectrum is primarily emitted from the second region of the enclosure; a mixture of the first light spectrum and the second light spectrum is emitted from the third region of the enclosures; a primary viewing area of a user is adjacent or below the third region in an installation orientation of the lighting apparatus; and a total melanopic to photopic ratio (M/P ratio) emitted by the lighting apparatus and received by the user is greater than 1.0. 14. (canceled) 15. The lighting apparatus of claim 13 further comprising a controller in communication with the first light engine and the second light engine, wherein the controller implements a dimming profile according to a time of day, wherein the dimming profile comprises a sunrise scene, a daytime scene, daytime cloudy scene, a sunset scene, and a nighttime scene. 16. The lighting apparatus of claim 13 wherein:
the lighting apparatus is further configured to produce a sunrise scene;
during the sunrise scene an overall light output from the lighting apparatus increases in intensity over time; and
an OPN5/OPN4 ratio of the overall light output, as received by the user at the user's location, is inversely proportional to the intensity of the overall light output, wherein the OPN5/OPN4 ratio is a ratio of 380 nm to 410 nm violet light that stimulates OPN5 in the user, to 480 nm to 500 nm melanopic light that stimulates OPN4 in the user. 17. The lighting apparatus of claim 13 wherein:
the lighting apparatus is further configured to produce a sunset scene;
during the sunset scene an overall light output from the lighting apparatus decreases in intensity over time; and
an OPN5/OPN4 ratio of the overall light output, as received by the user at the user's location, is inversely proportional to the intensity of the overall light output, wherein the OPN5/OPN4 ratio is a ratio of 380 nm to 410 nm violet light that stimulates OPN5 in the user, to 480 nm to 500 nm melanopic light that stimulates OPN4 in the user. 18. The lighting apparatus of claim 13 wherein:
the lighting apparatus is further configured to produce a nighttime scene; and
during the nighttime scene an integrated spectrum from the lighting apparatus, as received by the user at the user's location, has a nighttime CCT of 1800 K to 2500 K with a nighttime blue emission peak between 430 nm to 450 nm. 19. The lighting apparatus of claim 13 wherein:
the lighting apparatus is further configured to produce a daytime scene; and
during the daytime scene the first CCT of the first light engine is greater than 6500 K and has a first blue emission peak between 450 nm to 480 nm, and the second CCT of the second light engine is less than 6500 K. 20. The lighting apparatus of claim 19 wherein the total M/P ratio of an integrated spectrum from the lighting apparatus during the daytime scene has an M/P ratio is greater than 1, as received by the user at the user's location. 21. The lighting apparatus of claim 19 wherein an integrated spectrum from the lighting apparatus during the daytime scene, as received by the user at the user's location, has a daytime CCT of greater than 5000 K. 22. The lighting apparatus of claim 13 wherein:
the lighting apparatus is further configured to produce a daytime cloudy scene; and
during the daytime cloudy scene first CCT and the second CCT are both between 4000 K to 6500 K. 23. A lighting apparatus comprising:
a first light engine that produces a first light spectrum having a first color in a first area bounded by chromaticity coordinates (x,y) of (0.11, 0.1), (0.16, 0.004), (0.255, 0.33), (0.32, 0.325) in a CIE 1931 color space diagram using 10-degree color matching functions, the first color having a first correlated color temperature (CCT); a second light engine that produces a second light spectrum having a second color in a second area bounded by chromaticity coordinates of (0.55, 0.44), (0.691, 0.311), (0.417, 0.45), (0.35, 0.35) in the CIE 1931 color space diagram using 10-degree color matching functions, the second color having a second CCT, wherein a difference between the first CCT and the second CCT is at least 10,000 K; and an enclosure around the first light engine and the second light engine, the enclosure having an optical diffuser, wherein the optical diffuser is positioned over a first region, a second region and a third region of the enclosure; wherein: the first region and the second region are separated by the third region; the first light spectrum is primarily emitted from the first region of the enclosure; the second light spectrum is primarily emitted from the second region of the enclosure; a mixture of the first light spectrum and the second light spectrum is emitted from the third region of the enclosures; a primary viewing area of a user is adjacent or below the third region in an installation orientation of the lighting apparatus; and a total melanopic to photopic ratio (M/P ratio) emitted by the lighting apparatus and received by the user is greater than 1.0. 24. The lighting apparatus of claim 23 wherein the first region is vertically above the second region, relative to ground, in the installation orientation of the lighting apparatus. 25. The lighting apparatus of claim 23 wherein:
the first light engine emits a first blue emission peak in a first wavelength range of 450 nm to 480 nm; and
the second light engine emits a second blue emission peak in a second wavelength range of 480 nm to 500 nm. 26. (canceled) 27. The lighting apparatus of claim 23 wherein the mixture emitted from the third region has a third CCT profile comprising a gradient from the first CCT to the second CCT. 28. The lighting apparatus of claim 23 wherein the optical diffuser is a continuous piece covering the first region, the second region and the third region. | Lighting apparatuses include an enclosure around first and second light engines. The enclosure has a diffuser over first, second and third regions. The first and second regions are separated by the third region; a first light spectrum is emitted from the first region; a second light spectrum is emitted from the second region; and a mixture of the spectrums is emitted from the third region. In some embodiments, the first spectrum has a CCT≥7000K; the second spectrum has a CCT≤6500K. In some embodiments, the first spectrum has a first CCT≥3500K; the second spectrum has a second CCT≤6500K; the second CCT<first CCT and the difference between the CCTs is at least 1000K. In some embodiments, the first spectrum has a color bounded by a first set of chromaticity coordinates, and the second spectrum has a color bounded by a second set.1. A lighting apparatus comprising:
a first light engine that produces a first light spectrum having a first correlated color temperature (CCT) greater than or equal to 17,000 K; a second light engine that produces a second light spectrum having a second CCT less than or equal to 6500 K; and an enclosure around the first light engine and the second light engine, the enclosure having an optical diffuser, wherein the optical diffuser is positioned over a first region, a second region and a third region of the enclosure; wherein: the first region and the second region are separated by the third region; the first light spectrum is primarily emitted from the first region of the enclosure; the second light spectrum is primarily emitted from the second region of the enclosure; a mixture of the first light spectrum and the second light spectrum is emitted from the third region of the enclosures; a primary viewing area of a user is adjacent or below the third region in an installation orientation of the lighting apparatus; and a total melanopic to photopic ratio (M/P ratio) emitted by the lighting apparatus and received by the user is greater than 1.0. 2. The lighting apparatus of claim 1 wherein the first region is vertically above the second region, relative to ground, in the installation orientation of the lighting apparatus. 3. (canceled) 4. The lighting apparatus of claim 1 wherein in the installation orientation of the lighting apparatus, the first light spectrum is emitted upward relative to ground, the mixture is emitted in a horizontal direction, and the second light spectrum is emitted downward relative the ground. 5. The lighting apparatus of claim 1 wherein:
the first light engine emits a first blue emission peak in a first wavelength range of 450 nm to 480 nm; and
the second light engine emits a second blue emission peak in a second wavelength range of 480 nm to 500 nm. 6. (canceled) 7. The lighting apparatus of claim 1 wherein the second CCT is 4000 K to 5000 K. 8. The lighting apparatus of claim 1 wherein the first light spectrum has an M/P ratio greater than or equal to 1.7. 9. The lighting apparatus of claim 1 wherein the mixture emitted from the third region has a third CCT profile comprising a gradient from the first CCT to the second CCT. 10. The lighting apparatus of claim 1 wherein a first light emitting diode (LED) of the first light engine and a second LED of the second light engine face each other and are near opposite ends of the lighting apparatus. 11. The lighting apparatus of claim 1 wherein the optical diffuser is a continuous piece covering the first region, the second region and the third region. 12. The lighting apparatus of claim 1 wherein:
the optical diffuser comprises a translucent material; and
at least one of the first light spectrum and the second light spectrum partially reflects off an interior surface of the optical diffuser. 13. A lighting apparatus comprising:
a first light engine that produces a first light spectrum having a first correlated color temperature (CCT) greater than or equal to 3500 K; a second light engine that produces a second light spectrum having a second CCT less than or equal to 6500 K, wherein the second CCT is less than the first CCT and a difference between the first CCT and the second CCT is at least 10,000 K; and an enclosure around the first light engine and the second light engine, the enclosure having an optical diffuser, wherein the optical diffuser is positioned over a first region, a second region and a third region of the enclosure; wherein: the first region and the second region are separated by the third region; the first light spectrum is primarily emitted from the first region of the enclosure; the second light spectrum is primarily emitted from the second region of the enclosure; a mixture of the first light spectrum and the second light spectrum is emitted from the third region of the enclosures; a primary viewing area of a user is adjacent or below the third region in an installation orientation of the lighting apparatus; and a total melanopic to photopic ratio (M/P ratio) emitted by the lighting apparatus and received by the user is greater than 1.0. 14. (canceled) 15. The lighting apparatus of claim 13 further comprising a controller in communication with the first light engine and the second light engine, wherein the controller implements a dimming profile according to a time of day, wherein the dimming profile comprises a sunrise scene, a daytime scene, daytime cloudy scene, a sunset scene, and a nighttime scene. 16. The lighting apparatus of claim 13 wherein:
the lighting apparatus is further configured to produce a sunrise scene;
during the sunrise scene an overall light output from the lighting apparatus increases in intensity over time; and
an OPN5/OPN4 ratio of the overall light output, as received by the user at the user's location, is inversely proportional to the intensity of the overall light output, wherein the OPN5/OPN4 ratio is a ratio of 380 nm to 410 nm violet light that stimulates OPN5 in the user, to 480 nm to 500 nm melanopic light that stimulates OPN4 in the user. 17. The lighting apparatus of claim 13 wherein:
the lighting apparatus is further configured to produce a sunset scene;
during the sunset scene an overall light output from the lighting apparatus decreases in intensity over time; and
an OPN5/OPN4 ratio of the overall light output, as received by the user at the user's location, is inversely proportional to the intensity of the overall light output, wherein the OPN5/OPN4 ratio is a ratio of 380 nm to 410 nm violet light that stimulates OPN5 in the user, to 480 nm to 500 nm melanopic light that stimulates OPN4 in the user. 18. The lighting apparatus of claim 13 wherein:
the lighting apparatus is further configured to produce a nighttime scene; and
during the nighttime scene an integrated spectrum from the lighting apparatus, as received by the user at the user's location, has a nighttime CCT of 1800 K to 2500 K with a nighttime blue emission peak between 430 nm to 450 nm. 19. The lighting apparatus of claim 13 wherein:
the lighting apparatus is further configured to produce a daytime scene; and
during the daytime scene the first CCT of the first light engine is greater than 6500 K and has a first blue emission peak between 450 nm to 480 nm, and the second CCT of the second light engine is less than 6500 K. 20. The lighting apparatus of claim 19 wherein the total M/P ratio of an integrated spectrum from the lighting apparatus during the daytime scene has an M/P ratio is greater than 1, as received by the user at the user's location. 21. The lighting apparatus of claim 19 wherein an integrated spectrum from the lighting apparatus during the daytime scene, as received by the user at the user's location, has a daytime CCT of greater than 5000 K. 22. The lighting apparatus of claim 13 wherein:
the lighting apparatus is further configured to produce a daytime cloudy scene; and
during the daytime cloudy scene first CCT and the second CCT are both between 4000 K to 6500 K. 23. A lighting apparatus comprising:
a first light engine that produces a first light spectrum having a first color in a first area bounded by chromaticity coordinates (x,y) of (0.11, 0.1), (0.16, 0.004), (0.255, 0.33), (0.32, 0.325) in a CIE 1931 color space diagram using 10-degree color matching functions, the first color having a first correlated color temperature (CCT); a second light engine that produces a second light spectrum having a second color in a second area bounded by chromaticity coordinates of (0.55, 0.44), (0.691, 0.311), (0.417, 0.45), (0.35, 0.35) in the CIE 1931 color space diagram using 10-degree color matching functions, the second color having a second CCT, wherein a difference between the first CCT and the second CCT is at least 10,000 K; and an enclosure around the first light engine and the second light engine, the enclosure having an optical diffuser, wherein the optical diffuser is positioned over a first region, a second region and a third region of the enclosure; wherein: the first region and the second region are separated by the third region; the first light spectrum is primarily emitted from the first region of the enclosure; the second light spectrum is primarily emitted from the second region of the enclosure; a mixture of the first light spectrum and the second light spectrum is emitted from the third region of the enclosures; a primary viewing area of a user is adjacent or below the third region in an installation orientation of the lighting apparatus; and a total melanopic to photopic ratio (M/P ratio) emitted by the lighting apparatus and received by the user is greater than 1.0. 24. The lighting apparatus of claim 23 wherein the first region is vertically above the second region, relative to ground, in the installation orientation of the lighting apparatus. 25. The lighting apparatus of claim 23 wherein:
the first light engine emits a first blue emission peak in a first wavelength range of 450 nm to 480 nm; and
the second light engine emits a second blue emission peak in a second wavelength range of 480 nm to 500 nm. 26. (canceled) 27. The lighting apparatus of claim 23 wherein the mixture emitted from the third region has a third CCT profile comprising a gradient from the first CCT to the second CCT. 28. The lighting apparatus of claim 23 wherein the optical diffuser is a continuous piece covering the first region, the second region and the third region. | 2,800 |
12,337 | 12,337 | 14,865,894 | 2,857 | Systems, apparatuses, and/or methods may provide for cooperative assembly of a universal sensor with one or more other universal sensors into a general-purpose sensor cluster deployable in a dynamically configurable arrangement. The universal sensor may capture data corresponding to one or more characteristics in a deployment environment encountered by the universal sensor. The universal sensor may also provide the data corresponding to at least one of the characteristics in the deployment environment encountered by the universal sensor. A baseline detection pattern may be established for the general-purpose sensor cluster based on data provided by each universal sensor of the general-purpose sensor cluster. Also, a change may be detected in the baseline detection pattern to address an anomalous condition. A proxy may mediate pairing between two or more universal sensor and/or between a universal sensor and a repository. | 1. A computing system to establish a detection pattern comprising:
a universal sensor including:
a negotiator to cooperatively assemble the universal sensor with one or more other universal sensors into a general-purpose sensor cluster deployable in a dynamically configurable arrangement;
a detector to capture data corresponding to one or more characteristics in a deployment environment encountered by the universal sensor; and
a distributer to provide the data corresponding to at least one of the characteristics in the deployment environment encountered by the universal sensor; and
a repository including an analyzer to:
establish a baseline detection pattern for the general-purpose sensor cluster based on data provided by each universal sensor of the general-purpose sensor cluster; and
detect a change in the baseline detection pattern to address an anomalous condition. 2. The computing system of claim 1, further including a proxy comprising a coupler to one or more of:
pair two or more universal sensors to mediate cooperative assembly of the two or more universal sensors into the general-purpose sensor cluster; or pair the repository with the general-purpose sensor cluster to establish the baseline detection pattern and detect the change in the baseline detection pattern. 3. The computing system of claim 1, further including a probe to one or more of:
identify a universal sensor; or identify the general-purpose sensor cluster, wherein the probe is to include wireless communication functionality. 4. A universal sensor to generate data in a sensor cluster comprising:
a negotiator to cooperatively assemble the universal sensor with one or more other universal sensors into a general-purpose sensor cluster deployable in a dynamically configurable arrangement; a detector to capture data corresponding to one or more characteristics in a deployment environment encountered by the universal sensor; and a distributer to provide the data corresponding to at least one of the characteristics in the deployment environment encountered by the universal sensor. 5. The universal sensor of claim 4, further including one or more of:
a probe to identify at least one of the other universal sensors proximately located to the universal sensor; or a sensor interface to pair the universal sensor with at least one of the other universal sensors to allow cooperative assembly into the general-purpose sensor cluster. 6. The universal sensor of claim 4, further including a repository interface to pair the universal sensor with a repository that is to establish a baseline detection pattern for the general-purpose sensor cluster based on the data and to detect a change in the baseline detection pattern. 7. The universal sensor of claim 4, further including a proxy interface to pair the universal sensor with a proxy that is to one or more of:
mediate cooperative assembly of the universal sensor with at least one of the other universal sensors into the general-purpose sensor cluster; or mediate pairing of the general-purpose sensor cluster with a repository. 8. The universal sensor of claim 4, further including an identification determiner to one or more of:
determine one or more of a sensor identification corresponding to the universal sensor or a cluster identification corresponding to the general-purpose sensor cluster; or provide one or more of the sensor identification or the cluster identification to one or more of a repository, a proxy, or a universal sensor. 9. The universal sensor of claim 4, further including a security message determiner to one or more of:
determine a security key corresponding to one or more of the universal sensor or the general-purpose sensor cluster; or provide the security key to one or more of a repository, a proxy, or a universal sensor. 10. The universal sensor of claim 4, wherein the universal sensor is to include a multi-functional Internet of Things (IoT) sensor to capture data corresponding to two or more characteristics in the deployment environment including pressure, temperature, vibration, acceleration, velocity, rotation, flow, or analyte exposure, and wherein the distributer is to provide the data corresponding to the two of more characteristics. 11. A repository to process data from a sensor cluster comprising:
a collector to collect data provided by each universal sensor of a general-purpose sensor cluster deployable in a dynamically configurable arrangement; and an analyzer to:
establish a baseline detection pattern for the general-purpose sensor cluster based on the data; and
detect a change in the baseline detection pattern to address an anomalous condition. 12. The repository of claim 11, further including one or more of:
a probe to identify the general-purpose sensor cluster; a sensor interface to pair the repository with one or more universal sensors of the general-purpose sensor cluster; or a proxy interface to pair the repository with a proxy that is to mediate pairing of the repository with the general-purpose sensor cluster. 13. The repository of claim 11, further including an identification determiner to determine one or more of a sensor identification corresponding to a universal sensor or a cluster identification corresponding to the general-purpose sensor cluster. 14. The repository of claim 11, further including a security message determiner to determine a security key corresponding to one or more of a universal sensor or the general-purpose sensor cluster. 15. The repository of claim 11, further including one or more of:
a classification determiner to determine a label indicating a specific-purpose relationship for the general-purpose sensor cluster, wherein the general-purpose sensor cluster is to operate irrespective of knowledge of the specific-purpose relationship; or a tolerance determiner to determine one or more of a tolerance limit corresponding to the change in the baseline detection pattern or when the tolerance limit is met. 16. The repository of claim 15, further including a user interface to one or more of:
select the label based on user input; or select the tolerance limit based on the user input. 17. The repository of claim 15, further including a self-learner to one or more of:
select the label based on data corresponding to a characteristic in a deployment environment to be included in the baseline detection pattern; or select the tolerance limit based on the data corresponding to the characteristic in the deployment environment to be included in the baseline detection pattern. 18. The repository of claim 15, further including a responder to one or more of:
determine a response when the tolerance limit is met; or initiate the response to prevent a failure. 19. The repository of claim 11, wherein the baseline detection pattern is to be based on data from a first universal sensor corresponding to a first characteristic in a deployment environment encountered by the first universal sensor of the general-purpose sensor cluster and data from a second universal sensor corresponding to a second characteristic in the deployment environment encountered by the second universal sensor of the general-purpose sensor cluster. 20. The repository of claim 11, wherein the repository is to include one or more of an endpoint device, a gateway device, a cloud-computing device, or a server device. 21. A proxy to mediate pairing involving a sensor cluster comprising:
a probe to one or more of:
identify two or more universal sensors proximately located to the proxy;
or
identify a general-purpose sensor cluster deployable in a dynamically configurable arrangement proximately located to the proxy; and
a coupler to one or more of:
pair at least two of the universal sensors to mediate cooperative assembly of the at least two universal sensors into the general-purpose sensor cluster; or
pair a repository with the general-purpose sensor cluster to establish a baseline detection pattern for the general-purpose sensor cluster based on data provided by each universal sensor of the general-purpose sensor cluster and to detect a change in the baseline detection pattern to address an anomalous condition. 22. The proxy of claim 21, further including an identification determiner to one or more of:
determine one or more of a sensor identification corresponding to a universal sensor or a cluster identification corresponding to the general-purpose sensor cluster; or provide one or more of the sensor identification or the cluster identification to one or more of a universal sensor or the repository. 23. The proxy of claim 21, further including a security message determiner to one or more of:
determine a security key corresponding to one or more of a universal sensor or the general-purpose sensor cluster; or provide the security key to one or more of a universal sensor or the repository. 24. The proxy of claim 21, wherein the proxy is to include a mobile computing platform. | Systems, apparatuses, and/or methods may provide for cooperative assembly of a universal sensor with one or more other universal sensors into a general-purpose sensor cluster deployable in a dynamically configurable arrangement. The universal sensor may capture data corresponding to one or more characteristics in a deployment environment encountered by the universal sensor. The universal sensor may also provide the data corresponding to at least one of the characteristics in the deployment environment encountered by the universal sensor. A baseline detection pattern may be established for the general-purpose sensor cluster based on data provided by each universal sensor of the general-purpose sensor cluster. Also, a change may be detected in the baseline detection pattern to address an anomalous condition. A proxy may mediate pairing between two or more universal sensor and/or between a universal sensor and a repository.1. A computing system to establish a detection pattern comprising:
a universal sensor including:
a negotiator to cooperatively assemble the universal sensor with one or more other universal sensors into a general-purpose sensor cluster deployable in a dynamically configurable arrangement;
a detector to capture data corresponding to one or more characteristics in a deployment environment encountered by the universal sensor; and
a distributer to provide the data corresponding to at least one of the characteristics in the deployment environment encountered by the universal sensor; and
a repository including an analyzer to:
establish a baseline detection pattern for the general-purpose sensor cluster based on data provided by each universal sensor of the general-purpose sensor cluster; and
detect a change in the baseline detection pattern to address an anomalous condition. 2. The computing system of claim 1, further including a proxy comprising a coupler to one or more of:
pair two or more universal sensors to mediate cooperative assembly of the two or more universal sensors into the general-purpose sensor cluster; or pair the repository with the general-purpose sensor cluster to establish the baseline detection pattern and detect the change in the baseline detection pattern. 3. The computing system of claim 1, further including a probe to one or more of:
identify a universal sensor; or identify the general-purpose sensor cluster, wherein the probe is to include wireless communication functionality. 4. A universal sensor to generate data in a sensor cluster comprising:
a negotiator to cooperatively assemble the universal sensor with one or more other universal sensors into a general-purpose sensor cluster deployable in a dynamically configurable arrangement; a detector to capture data corresponding to one or more characteristics in a deployment environment encountered by the universal sensor; and a distributer to provide the data corresponding to at least one of the characteristics in the deployment environment encountered by the universal sensor. 5. The universal sensor of claim 4, further including one or more of:
a probe to identify at least one of the other universal sensors proximately located to the universal sensor; or a sensor interface to pair the universal sensor with at least one of the other universal sensors to allow cooperative assembly into the general-purpose sensor cluster. 6. The universal sensor of claim 4, further including a repository interface to pair the universal sensor with a repository that is to establish a baseline detection pattern for the general-purpose sensor cluster based on the data and to detect a change in the baseline detection pattern. 7. The universal sensor of claim 4, further including a proxy interface to pair the universal sensor with a proxy that is to one or more of:
mediate cooperative assembly of the universal sensor with at least one of the other universal sensors into the general-purpose sensor cluster; or mediate pairing of the general-purpose sensor cluster with a repository. 8. The universal sensor of claim 4, further including an identification determiner to one or more of:
determine one or more of a sensor identification corresponding to the universal sensor or a cluster identification corresponding to the general-purpose sensor cluster; or provide one or more of the sensor identification or the cluster identification to one or more of a repository, a proxy, or a universal sensor. 9. The universal sensor of claim 4, further including a security message determiner to one or more of:
determine a security key corresponding to one or more of the universal sensor or the general-purpose sensor cluster; or provide the security key to one or more of a repository, a proxy, or a universal sensor. 10. The universal sensor of claim 4, wherein the universal sensor is to include a multi-functional Internet of Things (IoT) sensor to capture data corresponding to two or more characteristics in the deployment environment including pressure, temperature, vibration, acceleration, velocity, rotation, flow, or analyte exposure, and wherein the distributer is to provide the data corresponding to the two of more characteristics. 11. A repository to process data from a sensor cluster comprising:
a collector to collect data provided by each universal sensor of a general-purpose sensor cluster deployable in a dynamically configurable arrangement; and an analyzer to:
establish a baseline detection pattern for the general-purpose sensor cluster based on the data; and
detect a change in the baseline detection pattern to address an anomalous condition. 12. The repository of claim 11, further including one or more of:
a probe to identify the general-purpose sensor cluster; a sensor interface to pair the repository with one or more universal sensors of the general-purpose sensor cluster; or a proxy interface to pair the repository with a proxy that is to mediate pairing of the repository with the general-purpose sensor cluster. 13. The repository of claim 11, further including an identification determiner to determine one or more of a sensor identification corresponding to a universal sensor or a cluster identification corresponding to the general-purpose sensor cluster. 14. The repository of claim 11, further including a security message determiner to determine a security key corresponding to one or more of a universal sensor or the general-purpose sensor cluster. 15. The repository of claim 11, further including one or more of:
a classification determiner to determine a label indicating a specific-purpose relationship for the general-purpose sensor cluster, wherein the general-purpose sensor cluster is to operate irrespective of knowledge of the specific-purpose relationship; or a tolerance determiner to determine one or more of a tolerance limit corresponding to the change in the baseline detection pattern or when the tolerance limit is met. 16. The repository of claim 15, further including a user interface to one or more of:
select the label based on user input; or select the tolerance limit based on the user input. 17. The repository of claim 15, further including a self-learner to one or more of:
select the label based on data corresponding to a characteristic in a deployment environment to be included in the baseline detection pattern; or select the tolerance limit based on the data corresponding to the characteristic in the deployment environment to be included in the baseline detection pattern. 18. The repository of claim 15, further including a responder to one or more of:
determine a response when the tolerance limit is met; or initiate the response to prevent a failure. 19. The repository of claim 11, wherein the baseline detection pattern is to be based on data from a first universal sensor corresponding to a first characteristic in a deployment environment encountered by the first universal sensor of the general-purpose sensor cluster and data from a second universal sensor corresponding to a second characteristic in the deployment environment encountered by the second universal sensor of the general-purpose sensor cluster. 20. The repository of claim 11, wherein the repository is to include one or more of an endpoint device, a gateway device, a cloud-computing device, or a server device. 21. A proxy to mediate pairing involving a sensor cluster comprising:
a probe to one or more of:
identify two or more universal sensors proximately located to the proxy;
or
identify a general-purpose sensor cluster deployable in a dynamically configurable arrangement proximately located to the proxy; and
a coupler to one or more of:
pair at least two of the universal sensors to mediate cooperative assembly of the at least two universal sensors into the general-purpose sensor cluster; or
pair a repository with the general-purpose sensor cluster to establish a baseline detection pattern for the general-purpose sensor cluster based on data provided by each universal sensor of the general-purpose sensor cluster and to detect a change in the baseline detection pattern to address an anomalous condition. 22. The proxy of claim 21, further including an identification determiner to one or more of:
determine one or more of a sensor identification corresponding to a universal sensor or a cluster identification corresponding to the general-purpose sensor cluster; or provide one or more of the sensor identification or the cluster identification to one or more of a universal sensor or the repository. 23. The proxy of claim 21, further including a security message determiner to one or more of:
determine a security key corresponding to one or more of a universal sensor or the general-purpose sensor cluster; or provide the security key to one or more of a universal sensor or the repository. 24. The proxy of claim 21, wherein the proxy is to include a mobile computing platform. | 2,800 |
12,338 | 12,338 | 15,263,928 | 2,856 | A liquid detection system for determining a presence of a liquid, including a piezoelectric element that outputs a first ultrasonic signal in response to an input electrical signal, and a housing with a first surface and a second surface disposed on opposite sides of a portion of the housing, a third surface disposed opposite the second surface across a gap in the housing, and a fourth surface and a fifth surface extending between the second surface and the third surface. The piezoelectric element is coupled to the first surface of the housing so that the piezoelectric element directs the first ultrasonic signal toward the second surface, and the gap in the housing is in fluid communication with a surrounding environment so that when fluid from the surrounding environment is present in the gap, the third surface of the housing reflects a second ultrasonic signal in response to the first ultrasonic signal when the liquid is present in the gap. | 1. A liquid detection system for determining a presence of a liquid, comprising:
a piezoelectric element that outputs a first ultrasonic signal in response to an input electrical signal; and a housing with a first surface and a second surface disposed on opposite sides of a portion of the housing, a third surface disposed opposite the second surface across a gap in the housing, and a fourth surface and a fifth surface extending between the second surface and the third surface; wherein the piezoelectric element is coupled to the first surface of the housing so that the piezoelectric element directs the first ultrasonic signal toward the second surface, and wherein the gap in the housing is in fluid communication with a surrounding environment so that when fluid from the surrounding environment is present in the gap, the third surface of the housing reflects a second ultrasonic signal in response to the first ultrasonic signal when the liquid is present in the gap. 2. The liquid detection system of claim 1, wherein the fourth surface and the fifth surface constitute supports connecting the second surface and the third surface of the housing. 3. The liquid detection system of claim 1, wherein the first surface and the second surface are parallel to each other. 4. The liquid detection system of claim 1, wherein the third surface is parallel to the second surface of the housing. 5. The liquid detection system of claim 1, wherein the fourth surface and the fifth surface are parallel to each other. 6. The liquid detection system of claim 1, wherein the piezoelectric element is disposed inside the housing. | A liquid detection system for determining a presence of a liquid, including a piezoelectric element that outputs a first ultrasonic signal in response to an input electrical signal, and a housing with a first surface and a second surface disposed on opposite sides of a portion of the housing, a third surface disposed opposite the second surface across a gap in the housing, and a fourth surface and a fifth surface extending between the second surface and the third surface. The piezoelectric element is coupled to the first surface of the housing so that the piezoelectric element directs the first ultrasonic signal toward the second surface, and the gap in the housing is in fluid communication with a surrounding environment so that when fluid from the surrounding environment is present in the gap, the third surface of the housing reflects a second ultrasonic signal in response to the first ultrasonic signal when the liquid is present in the gap.1. A liquid detection system for determining a presence of a liquid, comprising:
a piezoelectric element that outputs a first ultrasonic signal in response to an input electrical signal; and a housing with a first surface and a second surface disposed on opposite sides of a portion of the housing, a third surface disposed opposite the second surface across a gap in the housing, and a fourth surface and a fifth surface extending between the second surface and the third surface; wherein the piezoelectric element is coupled to the first surface of the housing so that the piezoelectric element directs the first ultrasonic signal toward the second surface, and wherein the gap in the housing is in fluid communication with a surrounding environment so that when fluid from the surrounding environment is present in the gap, the third surface of the housing reflects a second ultrasonic signal in response to the first ultrasonic signal when the liquid is present in the gap. 2. The liquid detection system of claim 1, wherein the fourth surface and the fifth surface constitute supports connecting the second surface and the third surface of the housing. 3. The liquid detection system of claim 1, wherein the first surface and the second surface are parallel to each other. 4. The liquid detection system of claim 1, wherein the third surface is parallel to the second surface of the housing. 5. The liquid detection system of claim 1, wherein the fourth surface and the fifth surface are parallel to each other. 6. The liquid detection system of claim 1, wherein the piezoelectric element is disposed inside the housing. | 2,800 |
12,339 | 12,339 | 14,531,177 | 2,818 | In an semiconductor process, a seamless tungsten plug is formed in an inter-layer dielectric by forming the inter-layer dielectric from multiple oxide layers having different wet etch rates, from lowest wet-etch rate for the lowest layer to highest wet-etch rate for the highest layer, forming a hole or trench in the inter-layer dielectric using a dry etch process, reconfiguring the hole or trench to have sloped side walls by performing a wet etch step, and filling the hole or trench with tungsten and etching back the tungsten to form a seamless tungsten plug. | 1. A method of fabricating a tungsten plug in an inter-layer dielectric of a semiconductor device comprising,
forming the inter-layer dielectric from multiple layers of dielectric material having increasing wet etch rates from the lowest to the highest dielectric material layer, etching a hole through the inter-layer dielectric, and performing a wet etch step to change the configuration of the hole to one that has substantially sloped or tapered side walls. 2. A method of claim 1, wherein the hole is initially etched using a dry etch process to form a hole with substantially vertical walls. 3. A method of claim 1, wherein the inter-layer dielectric comprises three oxide layers with ever increasing lateral wet etch rates. 4. A method of claim 3, wherein the first or lowest oxide layer of the inter-layer dielectric comprises a thermal oxide layer, the second oxide layer comprises a Tetraethylorthosilicate (TEOS) oxide layer, and the third oxide layer comprises a Borophosphosilicate Glass (BPSG) layer. 5. A method of claim 1, wherein after the hole with the sloped or tapered side walls has been formed, a contact barrier is deposited. 6. A method of claim 5, wherein the contact barrier comprises a Ti/TiN deposition. 7. A method of claim 6, wherein the contact barrier is deposited without an Argon pre-clean. 8. A method of claim 6, wherein the hole or trench is filled with wafer surface tungsten to define a tungsten plug. 9. A method of claim 8, wherein the wafer surface tungsten is etched back to leave behind a seamless tungsten plug in the hole. 10. A method of claim 9, wherein the etch back of the tungsten plug comprises chemical mechanical polishing (CMP) or a dry etch. 11. A tungsten plug in a semiconductor device, comprising
a vertically extending tungsten contact extending through a plurality of dielectric material layers, wherein the dielectric material layers each have a different wet etch rate. 12. A tungsten plug of claim 11, wherein the tungsten contact is configured to have substantially sloped or tapered side walls. 13. A tungsten plug of claim 12, wherein the tungsten contact is configured to fill a hole with tapered side walls. 14. A tungsten plug of claim 11, wherein the dielectric material layers comprise different oxide layers defining an inter-layer dielectric. 15. A tungsten plug of claim 14, wherein the first or lowest oxide layer of the inter-layer dielectric comprises a thermal oxide layer, the second oxide layer comprises a Tetraethylorthosilicate (TEOS) oxide layer, and the third oxide layer comprises a Borophosphosilicate Glass (BPSG) layer. 16. A tungsten plug in a semiconductor device, comprising
a vertically extending tungsten contact extending between a silicon device area and a metal line, wherein the tungsten contact is configured to have substantially sloped or tapered side walls. 17. A tungsten plug of claim 16, wherein the tungsten contact is configured to fill a hole with tapered side walls. 18. A tungsten plug of claim 17, wherein the hole is formed to extend vertically through a plurality of dielectric material layers. 19. A tungsten plug of claim 18, wherein the dielectric material layers each have a different wet etch rate. 20. A tungsten plug of claim 19, wherein the dielectric material layers comprise different oxide layers defining an inter-layer dielectric, the first or lowest oxide layer of the inter-layer dielectric comprising a thermal oxide layer, the second oxide layer comprising a Tetraethylorthosilicate (TEOS) oxide layer, and the third oxide layer comprising a Borophosphosilicate Glass (BPSG) layer. | In an semiconductor process, a seamless tungsten plug is formed in an inter-layer dielectric by forming the inter-layer dielectric from multiple oxide layers having different wet etch rates, from lowest wet-etch rate for the lowest layer to highest wet-etch rate for the highest layer, forming a hole or trench in the inter-layer dielectric using a dry etch process, reconfiguring the hole or trench to have sloped side walls by performing a wet etch step, and filling the hole or trench with tungsten and etching back the tungsten to form a seamless tungsten plug.1. A method of fabricating a tungsten plug in an inter-layer dielectric of a semiconductor device comprising,
forming the inter-layer dielectric from multiple layers of dielectric material having increasing wet etch rates from the lowest to the highest dielectric material layer, etching a hole through the inter-layer dielectric, and performing a wet etch step to change the configuration of the hole to one that has substantially sloped or tapered side walls. 2. A method of claim 1, wherein the hole is initially etched using a dry etch process to form a hole with substantially vertical walls. 3. A method of claim 1, wherein the inter-layer dielectric comprises three oxide layers with ever increasing lateral wet etch rates. 4. A method of claim 3, wherein the first or lowest oxide layer of the inter-layer dielectric comprises a thermal oxide layer, the second oxide layer comprises a Tetraethylorthosilicate (TEOS) oxide layer, and the third oxide layer comprises a Borophosphosilicate Glass (BPSG) layer. 5. A method of claim 1, wherein after the hole with the sloped or tapered side walls has been formed, a contact barrier is deposited. 6. A method of claim 5, wherein the contact barrier comprises a Ti/TiN deposition. 7. A method of claim 6, wherein the contact barrier is deposited without an Argon pre-clean. 8. A method of claim 6, wherein the hole or trench is filled with wafer surface tungsten to define a tungsten plug. 9. A method of claim 8, wherein the wafer surface tungsten is etched back to leave behind a seamless tungsten plug in the hole. 10. A method of claim 9, wherein the etch back of the tungsten plug comprises chemical mechanical polishing (CMP) or a dry etch. 11. A tungsten plug in a semiconductor device, comprising
a vertically extending tungsten contact extending through a plurality of dielectric material layers, wherein the dielectric material layers each have a different wet etch rate. 12. A tungsten plug of claim 11, wherein the tungsten contact is configured to have substantially sloped or tapered side walls. 13. A tungsten plug of claim 12, wherein the tungsten contact is configured to fill a hole with tapered side walls. 14. A tungsten plug of claim 11, wherein the dielectric material layers comprise different oxide layers defining an inter-layer dielectric. 15. A tungsten plug of claim 14, wherein the first or lowest oxide layer of the inter-layer dielectric comprises a thermal oxide layer, the second oxide layer comprises a Tetraethylorthosilicate (TEOS) oxide layer, and the third oxide layer comprises a Borophosphosilicate Glass (BPSG) layer. 16. A tungsten plug in a semiconductor device, comprising
a vertically extending tungsten contact extending between a silicon device area and a metal line, wherein the tungsten contact is configured to have substantially sloped or tapered side walls. 17. A tungsten plug of claim 16, wherein the tungsten contact is configured to fill a hole with tapered side walls. 18. A tungsten plug of claim 17, wherein the hole is formed to extend vertically through a plurality of dielectric material layers. 19. A tungsten plug of claim 18, wherein the dielectric material layers each have a different wet etch rate. 20. A tungsten plug of claim 19, wherein the dielectric material layers comprise different oxide layers defining an inter-layer dielectric, the first or lowest oxide layer of the inter-layer dielectric comprising a thermal oxide layer, the second oxide layer comprising a Tetraethylorthosilicate (TEOS) oxide layer, and the third oxide layer comprising a Borophosphosilicate Glass (BPSG) layer. | 2,800 |
12,340 | 12,340 | 15,973,964 | 2,855 | A thermistor-based thermal probe includes a thermistor die having a thermistor thereon with first and second bond pads coupled across the thermistor, and first and second die interconnects coupled to the respective bond pads. First and second wires W 1 , W 2 that extend beyond the thermistor die are attached to the first and to the second die interconnects, respectively. An encapsulant material encapsulates the thermistor die and a die end of the first and second wires. | 1. A method of fabricating a thermistor-based thermal probe, comprising:
providing a first die interconnect and a second die interconnect coupled to first and second bond pads that are coupled across a thermistor on a thermistor die; directly attaching first and second wires to the first interconnect and to the second die interconnect, wherein the first and second wires extend a distance beyond the thermistor die, and forming an encapsulating material over the thermistor die and a die end of the first and second wires. 2. The method of claim 1, wherein the thermistor die comprises a silicon substrate, and wherein the first and second bond pads are both on a same side of the silicon substrate. 3. The method of claim 1, wherein the first die interconnect and the second die interconnect comprise solder. 4. The method of claim 1, wherein the thermistor has a 25° C. minimum temperature coefficient of 3,000 parts per million per ° C. 5. A method of fabricating a thermistor-based thermal probe, comprising:
attaching a first interconnect and a second die interconnect coupled to first and second bond pads that are coupled across a thermistor on a thermistor die to a first trace and to a second trace on a mounting substrate; forming first and second wire interconnects on the mounting substrate and then attaching first and second wires to the first and second traces using the first and second wire interconnects, wherein the first and second wires extend beyond the mounting substrate, and forming an encapsulating material over the thermistor die, the mounting substrate, and a die end of the first and second wires. 6. The method of claim 5, wherein the thermistor die comprises a silicon substrate, and wherein the first and second bond pads are both on a same side of the silicon substrate. 7. The method of claim 5, wherein the providing further comprises providing another die including signal processing circuitry, wherein the method further comprises attaching bond pads of the another die to other traces on the mounting substrate that couple to other bond pads on the thermistor die to form a voltage divider including the thermistor and couple the signal processing circuitry to receive an output from the voltage divider. 8. The method of claim 5, wherein the mounting substrate comprise a flexible polymer comprising substrate. 9. The method of claim 5, wherein the thermistor has a 25° C. minimum temperature coefficient of at least 3,000 parts per million per ° C. 10. The method of claim 5, wherein the first and second wires are coupled to the first and second traces by solder balls. 11. A thermistor-based thermal probe, comprising
thermistor die having a thermistor thereon with first and second bond pads coupled across the thermistor, and with first die interconnect and a second die interconnect coupled to bond pads; first and second wires that extend beyond the thermistor die attached to the first interconnect and to the second die interconnect, and an encapsulating material over the thermistor die, and a die end of the first and second wires. 12. The thermistor-based thermal probe of claim 11, wherein the thermistor die comprises a silicon substrate, and wherein the first and second bond pads are on a same side of the silicon substrate. 13. The thermistor-based thermal probe of claim 11, wherein the first die interconnect and the second die interconnect comprise solder. 14. The thermistor-based thermal probe of claim 11, wherein the thermistor has a 25° C. minimum temperature coefficient of at least 3,000 parts per million per ° C. 15. A thermistor-based thermal probe, comprising
a mounting substrate and a thermistor die having a thermistor thereon with first and second bond pads coupled across the thermistor; first and second die interconnects coupled to the first and the second bond pads, wherein the first and second die interconnects are coupled to a first and a second trace on the mounting substrate; first and second wires that extend beyond the mounting substrate attached to the first and second traces by first and second wire interconnects on the mounting substrate, and an encapsulating material over the thermistor die, the mounting substrate, and a die end of the first and second wires. 16. The probe of claim 15, wherein the thermistor die comprises a silicon substrate, and wherein the first and second bond pads are on a same side of the silicon substrate. 17. The probe of claim 15, further comprising another die including signal processing circuitry, wherein bond pads on the another die are attached to other traces on the mounting substrate that couple to other bond pads on the thermistor die to form a voltage divider including the thermistor and couple the signal processing circuitry to receive an output from the voltage divider. 18. The probe of claim 15, wherein the mounting substrate comprise a flexible polymer comprising substrate. 19. The probe of claim 15, wherein the thermistor has a 25° C. minimum temperature coefficient of 3,000 parts per million per ° C. 20. The probe of claim 15, wherein the first and second wires are coupled to the first and second traces by solder balls. | A thermistor-based thermal probe includes a thermistor die having a thermistor thereon with first and second bond pads coupled across the thermistor, and first and second die interconnects coupled to the respective bond pads. First and second wires W 1 , W 2 that extend beyond the thermistor die are attached to the first and to the second die interconnects, respectively. An encapsulant material encapsulates the thermistor die and a die end of the first and second wires.1. A method of fabricating a thermistor-based thermal probe, comprising:
providing a first die interconnect and a second die interconnect coupled to first and second bond pads that are coupled across a thermistor on a thermistor die; directly attaching first and second wires to the first interconnect and to the second die interconnect, wherein the first and second wires extend a distance beyond the thermistor die, and forming an encapsulating material over the thermistor die and a die end of the first and second wires. 2. The method of claim 1, wherein the thermistor die comprises a silicon substrate, and wherein the first and second bond pads are both on a same side of the silicon substrate. 3. The method of claim 1, wherein the first die interconnect and the second die interconnect comprise solder. 4. The method of claim 1, wherein the thermistor has a 25° C. minimum temperature coefficient of 3,000 parts per million per ° C. 5. A method of fabricating a thermistor-based thermal probe, comprising:
attaching a first interconnect and a second die interconnect coupled to first and second bond pads that are coupled across a thermistor on a thermistor die to a first trace and to a second trace on a mounting substrate; forming first and second wire interconnects on the mounting substrate and then attaching first and second wires to the first and second traces using the first and second wire interconnects, wherein the first and second wires extend beyond the mounting substrate, and forming an encapsulating material over the thermistor die, the mounting substrate, and a die end of the first and second wires. 6. The method of claim 5, wherein the thermistor die comprises a silicon substrate, and wherein the first and second bond pads are both on a same side of the silicon substrate. 7. The method of claim 5, wherein the providing further comprises providing another die including signal processing circuitry, wherein the method further comprises attaching bond pads of the another die to other traces on the mounting substrate that couple to other bond pads on the thermistor die to form a voltage divider including the thermistor and couple the signal processing circuitry to receive an output from the voltage divider. 8. The method of claim 5, wherein the mounting substrate comprise a flexible polymer comprising substrate. 9. The method of claim 5, wherein the thermistor has a 25° C. minimum temperature coefficient of at least 3,000 parts per million per ° C. 10. The method of claim 5, wherein the first and second wires are coupled to the first and second traces by solder balls. 11. A thermistor-based thermal probe, comprising
thermistor die having a thermistor thereon with first and second bond pads coupled across the thermistor, and with first die interconnect and a second die interconnect coupled to bond pads; first and second wires that extend beyond the thermistor die attached to the first interconnect and to the second die interconnect, and an encapsulating material over the thermistor die, and a die end of the first and second wires. 12. The thermistor-based thermal probe of claim 11, wherein the thermistor die comprises a silicon substrate, and wherein the first and second bond pads are on a same side of the silicon substrate. 13. The thermistor-based thermal probe of claim 11, wherein the first die interconnect and the second die interconnect comprise solder. 14. The thermistor-based thermal probe of claim 11, wherein the thermistor has a 25° C. minimum temperature coefficient of at least 3,000 parts per million per ° C. 15. A thermistor-based thermal probe, comprising
a mounting substrate and a thermistor die having a thermistor thereon with first and second bond pads coupled across the thermistor; first and second die interconnects coupled to the first and the second bond pads, wherein the first and second die interconnects are coupled to a first and a second trace on the mounting substrate; first and second wires that extend beyond the mounting substrate attached to the first and second traces by first and second wire interconnects on the mounting substrate, and an encapsulating material over the thermistor die, the mounting substrate, and a die end of the first and second wires. 16. The probe of claim 15, wherein the thermistor die comprises a silicon substrate, and wherein the first and second bond pads are on a same side of the silicon substrate. 17. The probe of claim 15, further comprising another die including signal processing circuitry, wherein bond pads on the another die are attached to other traces on the mounting substrate that couple to other bond pads on the thermistor die to form a voltage divider including the thermistor and couple the signal processing circuitry to receive an output from the voltage divider. 18. The probe of claim 15, wherein the mounting substrate comprise a flexible polymer comprising substrate. 19. The probe of claim 15, wherein the thermistor has a 25° C. minimum temperature coefficient of 3,000 parts per million per ° C. 20. The probe of claim 15, wherein the first and second wires are coupled to the first and second traces by solder balls. | 2,800 |
12,341 | 12,341 | 15,997,770 | 2,853 | An aqueous ink composition including water; an optional co-solvent; an optional colorant; a polyester; and a polymer additive, wherein the polymer additive is selected from a member of the group consisting of styrene-butadiene, acrylonitrile-butadiene, acrylonitrile-butadiene-styrene, and combinations thereof. A process of digital offset printing including applying an ink composition onto a re-imageable imaging member surface at an ink take up temperature, the re-imageable imaging member having dampening fluid disposed thereon; forming an ink image; transferring the ink image from the re-imageable surface of the imaging member to a printable substrate at an ink transfer temperature. A process including combining water, an optional co-solvent, an optional colorant, a polyester, and a polymer additive, wherein the polymer additive is selected from a member of the group consisting of styrene-butadiene, acrylonitrile-butadiene, acrylonitrile-butadiene-styrene, and combinations thereof, to form an aqueous ink composition. | 1. An aqueous ink composition comprising:
water; an optional co-solvent; an optional colorant; a polyester; and a polymer additive, wherein the polymer additive is selected from a member of the group consisting of styrene-butadiene, acrylonitrile-butadiene, acrylonitrile-butadiene-styrene, and combinations thereof. 2. The ink composition of claim 1, wherein the polymer additive is provided in the form of a dispersion. 3. The ink composition of claim 1, wherein the polymer additive is selected from a member of the group consisting of carboxylated styrene-butadiene, carboxylated acrylonitrile-butadiene, carboxylated acrylonitrile-butadiene-styrene, noncarboxylated styrene-butadiene, noncarboxylated acrylonitrile-butadiene, noncarboxylated acrylonitrile-butadiene-styrene, and combinations thereof. 4. The ink composition of claim 1, wherein the polymer additive is an acrylonitrile-butadiene having a high acrylonitrile content of from about 50 percent or greater acrylonitrile. 5. The ink composition of claim 1, wherein the polymer additive is an acrylonitrile-butadiene-styrene having a high acrylonitrile content of from about 50 percent or greater acrylonitrile. 6. The ink composition of claim 1, wherein the polymer additive is an acrylonitrile-butadiene having a medium acrylonitrile content of about 32 percent acrylonitrile. 7. The ink composition of claim 1, wherein the polymer additive is an acrylonitrile-butadiene-styrene having a medium acrylonitrile content of about 32 percent acrylonitrile. 8. The ink composition of claim 1, wherein the polymer additive is an acrylonitrile-butadiene having a low acrylonitrile content of about 18 percent acrylonitrile. 9. The ink composition of claim 1, wherein the polymer additive is an acrylonitrile-butadiene-styrene having a low acrylonitrile content of about 18 percent acrylonitrile. 10. The ink composition of claim 1, wherein the polymer additive is present in the ink composition in an amount of from about 1 to about 10 percent by weight based upon the total weight of the ink composition. 11. The ink composition of claim 1, wherein the polyester is a sulfonated polyester. 12. The ink composition of claim 1, wherein the polyester is a sulfonated polyester having a degree of sulfonation of at least about 7.5 mol percent. 13. The ink composition of claim 1, wherein the polyester is a sodium sulfonated polyester. 14. The ink composition of claim 1, wherein the co-solvent is present and is selected from the group consisting of sulfolane, methyl ethyl ketone, isopropanol, 2-pyrrolidinone, polyethylene glycol, and mixtures thereof. 15. The ink composition of claim 1, wherein the colorant is present and comprises a pigment, a pigment dispersion, or a combination thereof. 16. The ink composition of claim 1, wherein the ink composition has the characteristic of providing substantially 100 percent transfer from a blanket to a substrate in an offset printing process. 17. A process of digital offset printing, the process comprising:
applying an ink composition onto a re-imageable imaging member surface at an ink take up temperature, the re-imageable imaging member having dampening fluid disposed thereon; forming an ink image; transferring the ink image from the re-imageable surface of the imaging member to a printable substrate at an ink transfer temperature; wherein the ink composition comprises water, an optional co-solvent, an optional colorant, a polyester, and a polymer additive, wherein the polymer additive is selected from a member of the group consisting of styrene-butadiene, acrylonitrile-butadiene, acrylonitrile-butadiene-styrene, and combinations thereof. 18. The process of claim 17, wherein the polymer additive is selected from a member of the group consisting of carboxylated styrene-butadiene, carboxylated acrylonitrile-butadiene, carboxylated acrylonitrile-butadiene-styrene, noncarboxylated styrene-butadiene, noncarboxylated acrylonitrile-butadiene, noncarboxylated acrylonitrile-butadiene-styrene, and combinations thereof. 19. The process of claim 17, wherein applying the ink composition comprises applying the ink composition using an anilox delivery system. 20. A process comprising:
combining water, an optional co-solvent, an optional colorant, a polyester, and a polymer additive, wherein the polymer additive is selected from a member of the group consisting of styrene-butadiene, acrylonitrile-butadiene, acrylonitrile-butadiene-styrene, and combinations thereof, to form an aqueous ink composition. | An aqueous ink composition including water; an optional co-solvent; an optional colorant; a polyester; and a polymer additive, wherein the polymer additive is selected from a member of the group consisting of styrene-butadiene, acrylonitrile-butadiene, acrylonitrile-butadiene-styrene, and combinations thereof. A process of digital offset printing including applying an ink composition onto a re-imageable imaging member surface at an ink take up temperature, the re-imageable imaging member having dampening fluid disposed thereon; forming an ink image; transferring the ink image from the re-imageable surface of the imaging member to a printable substrate at an ink transfer temperature. A process including combining water, an optional co-solvent, an optional colorant, a polyester, and a polymer additive, wherein the polymer additive is selected from a member of the group consisting of styrene-butadiene, acrylonitrile-butadiene, acrylonitrile-butadiene-styrene, and combinations thereof, to form an aqueous ink composition.1. An aqueous ink composition comprising:
water; an optional co-solvent; an optional colorant; a polyester; and a polymer additive, wherein the polymer additive is selected from a member of the group consisting of styrene-butadiene, acrylonitrile-butadiene, acrylonitrile-butadiene-styrene, and combinations thereof. 2. The ink composition of claim 1, wherein the polymer additive is provided in the form of a dispersion. 3. The ink composition of claim 1, wherein the polymer additive is selected from a member of the group consisting of carboxylated styrene-butadiene, carboxylated acrylonitrile-butadiene, carboxylated acrylonitrile-butadiene-styrene, noncarboxylated styrene-butadiene, noncarboxylated acrylonitrile-butadiene, noncarboxylated acrylonitrile-butadiene-styrene, and combinations thereof. 4. The ink composition of claim 1, wherein the polymer additive is an acrylonitrile-butadiene having a high acrylonitrile content of from about 50 percent or greater acrylonitrile. 5. The ink composition of claim 1, wherein the polymer additive is an acrylonitrile-butadiene-styrene having a high acrylonitrile content of from about 50 percent or greater acrylonitrile. 6. The ink composition of claim 1, wherein the polymer additive is an acrylonitrile-butadiene having a medium acrylonitrile content of about 32 percent acrylonitrile. 7. The ink composition of claim 1, wherein the polymer additive is an acrylonitrile-butadiene-styrene having a medium acrylonitrile content of about 32 percent acrylonitrile. 8. The ink composition of claim 1, wherein the polymer additive is an acrylonitrile-butadiene having a low acrylonitrile content of about 18 percent acrylonitrile. 9. The ink composition of claim 1, wherein the polymer additive is an acrylonitrile-butadiene-styrene having a low acrylonitrile content of about 18 percent acrylonitrile. 10. The ink composition of claim 1, wherein the polymer additive is present in the ink composition in an amount of from about 1 to about 10 percent by weight based upon the total weight of the ink composition. 11. The ink composition of claim 1, wherein the polyester is a sulfonated polyester. 12. The ink composition of claim 1, wherein the polyester is a sulfonated polyester having a degree of sulfonation of at least about 7.5 mol percent. 13. The ink composition of claim 1, wherein the polyester is a sodium sulfonated polyester. 14. The ink composition of claim 1, wherein the co-solvent is present and is selected from the group consisting of sulfolane, methyl ethyl ketone, isopropanol, 2-pyrrolidinone, polyethylene glycol, and mixtures thereof. 15. The ink composition of claim 1, wherein the colorant is present and comprises a pigment, a pigment dispersion, or a combination thereof. 16. The ink composition of claim 1, wherein the ink composition has the characteristic of providing substantially 100 percent transfer from a blanket to a substrate in an offset printing process. 17. A process of digital offset printing, the process comprising:
applying an ink composition onto a re-imageable imaging member surface at an ink take up temperature, the re-imageable imaging member having dampening fluid disposed thereon; forming an ink image; transferring the ink image from the re-imageable surface of the imaging member to a printable substrate at an ink transfer temperature; wherein the ink composition comprises water, an optional co-solvent, an optional colorant, a polyester, and a polymer additive, wherein the polymer additive is selected from a member of the group consisting of styrene-butadiene, acrylonitrile-butadiene, acrylonitrile-butadiene-styrene, and combinations thereof. 18. The process of claim 17, wherein the polymer additive is selected from a member of the group consisting of carboxylated styrene-butadiene, carboxylated acrylonitrile-butadiene, carboxylated acrylonitrile-butadiene-styrene, noncarboxylated styrene-butadiene, noncarboxylated acrylonitrile-butadiene, noncarboxylated acrylonitrile-butadiene-styrene, and combinations thereof. 19. The process of claim 17, wherein applying the ink composition comprises applying the ink composition using an anilox delivery system. 20. A process comprising:
combining water, an optional co-solvent, an optional colorant, a polyester, and a polymer additive, wherein the polymer additive is selected from a member of the group consisting of styrene-butadiene, acrylonitrile-butadiene, acrylonitrile-butadiene-styrene, and combinations thereof, to form an aqueous ink composition. | 2,800 |
12,342 | 12,342 | 16,469,584 | 2,853 | In one implementation, an example print apparatus includes a fluid ejection system operated by control instructions generated from a print engine and a compensation engine. The compensation engine determines an amount of the auxiliary colorant fluid to produce a combination of the base colorant fluid and the auxiliary colorant fluid based on input color image data, a reflective quality of a substrate to be printed on, and an opacity grade of the base colorant fluid. The print engine generates control instructions to instruct the fluid ejection system to print the combination of the base colorant fluid and the auxiliary colorant fluid on the substrate. | 1. A print apparatus comprising:
a fluid ejection system comprising:
a first print head to print a base colorant fluid; and
a second print head to print an auxiliary colorant fluid;
a compensation engine to determine an amount of the auxiliary colorant fluid to produce a combination of the base colorant fluid and the auxiliary colorant fluid based on input color image data, a reflective quality of a substrate to be printed on, and an opacity grade of the base colorant fluid; and a print engine to generate control instructions that, when executed, instruct the fluid ejection system to print the combination of the base colorant fluid and the auxiliary colorant fluid on the substrate. 2. The apparatus of claim 1, wherein:
the compensation engine maps an input color for a region of the input color image data to the amount of auxiliary colorant fluid using a color mapping resource based on the reflective quality of the substrate and the opacity grade of the base colorant fluid. 3. The apparatus of claim 1, wherein:
the compensation engine determines an output color represented by the amount of auxiliary colorant fluid and a complementary amount of base colorant fluid to compensate for the reflective quality of the substrate as perceived across a region of the substrate through the complementary amount of base colorant fluid. 4. The apparatus of claim 1, wherein the compensation engine:
determines an amount of the base colorant fluid at a region; and determines the amount of the auxiliary colorant fluid to print at the region based on the amount of the base colorant fluid at the region and the reflective quality of the substrate. 5. The apparatus of claim 1, wherein the compensation engine:
identifies a difference between an input color and the base colorant at a region of the substrate; and determines the amount of auxiliary colorant fluid to print at the region based on the difference and a layer characteristic of a layer of the base colorant fluid at the region. 6. The apparatus of claim 5, wherein:
the layer characteristic is an expected thickness of the base colorant fluid at the region; and the difference between the input color and the base colorant fluid includes a user-provided adjustment to an output color producible by the combination of base colorant fluid and the auxiliary colorant fluid. 7. The apparatus of claim 1, wherein:
the print engine identifies a subset of pixels of a region to print the auxiliary colorant, the number of pixels of the subset of pixels inversely changes across regions with respect to an amount of base colorant to be printed across the regions. 8. The apparatus of claim 1, wherein:
the compensation engine is to:
identify the opacity grade of the base colorant; and
identify the reflective quality of the substrate,
wherein the control instructions, when executed, instruct the fluid ejection system to print the combination of the base colorant fluid and the auxiliary colorant fluid on the substrate by printing the amount of auxiliary colorant fluid and a complementary amount of the base colorant fluid during the same pass of the fluid ejection system over the substrate. 9. The apparatus of claim 1, wherein:
the compensation engine determines the amount of auxiliary colorant fluid based on an expected viewing side of a resultant print on the substrate and an expected illuminated side of the resultant print on the substrate; and the print apparatus includes user interface with a slider for the user to make adjustments to an output color to be produced by the combination of base colorant fluid and auxiliary colorant fluid. 10. A non-transitory computer-readable storage medium comprising a set of instructions executable by a processor resource to:
determine amounts of auxiliary colorant to print across a plurality of regions of a substrate to produce a target color across the plurality of regions based on a reflective quality of the substrate across the plurality of regions and an opacity grade of a base colorant across the plurality of regions; and generate control instructions to operate a print apparatus to print a first amount of auxiliary colorant with the base colorant at a first region of the plurality of regions and print a second amount of auxiliary colorant with the base colorant at a second region of the plurality of regions to produce the target color across the plurality of regions, wherein the first amount of auxiliary colorant and the second amount of auxiliary colorant are different. 11. A medium of claim 10, wherein the set of instructions are executable by the processor resource to:
retrieve a surface classification of the substrate, an expected viewing side of the substrate, and an expected illumination side of the substrate from a data structure representing a media profile corresponding to the substrate; determine the reflective quality of the substrate based on the surface classification of the substrate, the expected viewing side of the substrate, and the expected illumination side of the substrate; and identify an auxiliary colorant color to compensate for an effect of the reflective quality of the substrate on the base colorant. 12. The medium of claim 11, wherein:
the control instructions instruct the print apparatus to print a first amount of base colorant at the first region and a second amount of base colorant at the second region; the first amount of base colorant and the second amount of base colorant are different; and wherein the amounts of auxiliary colorant to print at each of the plurality of regions are determined based on the reflective quality of the substrate, the opacity grade of the base colorant, the expected viewing side of the substrate, the expected illuminated side of the substrate, an expected amount of illumination from an illumination source, a color of light expected to be produced by the illumination source, and the amount of base colorant at each of the plurality of regions to generate a substantially uniform hue of the target color across the plurality of regions. 13. A method of color balancing, comprising:
identifying an amount of a base colorant to print at a plurality of regions of a substrate based on color image data corresponding to the plurality of regions; identifying an opacity grade of the base colorant at the plurality of regions to be printed based on the amount of the base colorant to be printed at the plurality of regions; identifying a substrate color based on a media profile corresponding with the substrate to be printed on; identifying a reflective quality based on the substrate color and the opacity grade of the base colorant at the plurality of regions; mapping an amount of an auxiliary colorant to print at each of the plurality of regions based on a target color at the plurality of regions, the reflective quality at the plurality of regions, and the opacity grade of the base colorant at the plurality of regions; and generating control instructions to instruct a print apparatus to print the auxiliary color with the base output color at the plurality of regions according to the mapped amounts. 14. The method of claim 13, comprising:
identifying an auxiliary colorant color based on the identified substrate color; and determining a percentage of auxiliary colorant per base colorant, the percentage of auxiliary colorant per base colorant to change across the plurality of regions based on the opacity grade of the base colorant, differences in the amount of base colorant across the plurality of regions, and the substrate color. 15. The method of claim 14, comprising:
printing, in response to execution of the generated control instructions, the amount of auxiliary colorant for a particular region during a same pass as the amount of base colorant for the particular region of the plurality of regions is printed. | In one implementation, an example print apparatus includes a fluid ejection system operated by control instructions generated from a print engine and a compensation engine. The compensation engine determines an amount of the auxiliary colorant fluid to produce a combination of the base colorant fluid and the auxiliary colorant fluid based on input color image data, a reflective quality of a substrate to be printed on, and an opacity grade of the base colorant fluid. The print engine generates control instructions to instruct the fluid ejection system to print the combination of the base colorant fluid and the auxiliary colorant fluid on the substrate.1. A print apparatus comprising:
a fluid ejection system comprising:
a first print head to print a base colorant fluid; and
a second print head to print an auxiliary colorant fluid;
a compensation engine to determine an amount of the auxiliary colorant fluid to produce a combination of the base colorant fluid and the auxiliary colorant fluid based on input color image data, a reflective quality of a substrate to be printed on, and an opacity grade of the base colorant fluid; and a print engine to generate control instructions that, when executed, instruct the fluid ejection system to print the combination of the base colorant fluid and the auxiliary colorant fluid on the substrate. 2. The apparatus of claim 1, wherein:
the compensation engine maps an input color for a region of the input color image data to the amount of auxiliary colorant fluid using a color mapping resource based on the reflective quality of the substrate and the opacity grade of the base colorant fluid. 3. The apparatus of claim 1, wherein:
the compensation engine determines an output color represented by the amount of auxiliary colorant fluid and a complementary amount of base colorant fluid to compensate for the reflective quality of the substrate as perceived across a region of the substrate through the complementary amount of base colorant fluid. 4. The apparatus of claim 1, wherein the compensation engine:
determines an amount of the base colorant fluid at a region; and determines the amount of the auxiliary colorant fluid to print at the region based on the amount of the base colorant fluid at the region and the reflective quality of the substrate. 5. The apparatus of claim 1, wherein the compensation engine:
identifies a difference between an input color and the base colorant at a region of the substrate; and determines the amount of auxiliary colorant fluid to print at the region based on the difference and a layer characteristic of a layer of the base colorant fluid at the region. 6. The apparatus of claim 5, wherein:
the layer characteristic is an expected thickness of the base colorant fluid at the region; and the difference between the input color and the base colorant fluid includes a user-provided adjustment to an output color producible by the combination of base colorant fluid and the auxiliary colorant fluid. 7. The apparatus of claim 1, wherein:
the print engine identifies a subset of pixels of a region to print the auxiliary colorant, the number of pixels of the subset of pixels inversely changes across regions with respect to an amount of base colorant to be printed across the regions. 8. The apparatus of claim 1, wherein:
the compensation engine is to:
identify the opacity grade of the base colorant; and
identify the reflective quality of the substrate,
wherein the control instructions, when executed, instruct the fluid ejection system to print the combination of the base colorant fluid and the auxiliary colorant fluid on the substrate by printing the amount of auxiliary colorant fluid and a complementary amount of the base colorant fluid during the same pass of the fluid ejection system over the substrate. 9. The apparatus of claim 1, wherein:
the compensation engine determines the amount of auxiliary colorant fluid based on an expected viewing side of a resultant print on the substrate and an expected illuminated side of the resultant print on the substrate; and the print apparatus includes user interface with a slider for the user to make adjustments to an output color to be produced by the combination of base colorant fluid and auxiliary colorant fluid. 10. A non-transitory computer-readable storage medium comprising a set of instructions executable by a processor resource to:
determine amounts of auxiliary colorant to print across a plurality of regions of a substrate to produce a target color across the plurality of regions based on a reflective quality of the substrate across the plurality of regions and an opacity grade of a base colorant across the plurality of regions; and generate control instructions to operate a print apparatus to print a first amount of auxiliary colorant with the base colorant at a first region of the plurality of regions and print a second amount of auxiliary colorant with the base colorant at a second region of the plurality of regions to produce the target color across the plurality of regions, wherein the first amount of auxiliary colorant and the second amount of auxiliary colorant are different. 11. A medium of claim 10, wherein the set of instructions are executable by the processor resource to:
retrieve a surface classification of the substrate, an expected viewing side of the substrate, and an expected illumination side of the substrate from a data structure representing a media profile corresponding to the substrate; determine the reflective quality of the substrate based on the surface classification of the substrate, the expected viewing side of the substrate, and the expected illumination side of the substrate; and identify an auxiliary colorant color to compensate for an effect of the reflective quality of the substrate on the base colorant. 12. The medium of claim 11, wherein:
the control instructions instruct the print apparatus to print a first amount of base colorant at the first region and a second amount of base colorant at the second region; the first amount of base colorant and the second amount of base colorant are different; and wherein the amounts of auxiliary colorant to print at each of the plurality of regions are determined based on the reflective quality of the substrate, the opacity grade of the base colorant, the expected viewing side of the substrate, the expected illuminated side of the substrate, an expected amount of illumination from an illumination source, a color of light expected to be produced by the illumination source, and the amount of base colorant at each of the plurality of regions to generate a substantially uniform hue of the target color across the plurality of regions. 13. A method of color balancing, comprising:
identifying an amount of a base colorant to print at a plurality of regions of a substrate based on color image data corresponding to the plurality of regions; identifying an opacity grade of the base colorant at the plurality of regions to be printed based on the amount of the base colorant to be printed at the plurality of regions; identifying a substrate color based on a media profile corresponding with the substrate to be printed on; identifying a reflective quality based on the substrate color and the opacity grade of the base colorant at the plurality of regions; mapping an amount of an auxiliary colorant to print at each of the plurality of regions based on a target color at the plurality of regions, the reflective quality at the plurality of regions, and the opacity grade of the base colorant at the plurality of regions; and generating control instructions to instruct a print apparatus to print the auxiliary color with the base output color at the plurality of regions according to the mapped amounts. 14. The method of claim 13, comprising:
identifying an auxiliary colorant color based on the identified substrate color; and determining a percentage of auxiliary colorant per base colorant, the percentage of auxiliary colorant per base colorant to change across the plurality of regions based on the opacity grade of the base colorant, differences in the amount of base colorant across the plurality of regions, and the substrate color. 15. The method of claim 14, comprising:
printing, in response to execution of the generated control instructions, the amount of auxiliary colorant for a particular region during a same pass as the amount of base colorant for the particular region of the plurality of regions is printed. | 2,800 |
12,343 | 12,343 | 14,138,567 | 2,857 | A method is provided for dynamically determining measurement uncertainty (MU) of a measurement device for measuring a signal output by a device under test (DUT). The method includes storing characterized test data in a nonvolatile memory in the measurement device, the characterized test data being specific to the measurement device for a plurality of sources of uncertainty; receiving a parameter value of the DUT; measuring the signal output by the DUT and received by the measurement device; and calculating the measurement uncertainty of the measurement device for measuring the received signal using the stored characterized test data and the received parameter value of the DUT. | 1. A method of dynamically determining measurement uncertainty (MU) of a measurement device for measuring a signal output by a device under test (DUT), the method comprising:
storing characterized test data in a nonvolatile memory in the measurement device, the characterized test data being specific to the measurement device for a plurality of sources of uncertainty; receiving at least one parameter value of the DUT; measuring the signal output by the DUT and received by the measurement device; and calculating the measurement uncertainty of the measurement device for measuring the received signal using the stored characterized test data and the received at least one parameter value of the DUT. 2. The method of claim 1, further comprising:
receiving a query requesting the measurement uncertainty; and indicating the measured signal, and upper and lower limits of the measured signal corresponding to the calculated measurement uncertainty, in response to the query. 3. The method of claim 2, wherein measuring the signal received by the measurement device comprises measuring power of the signal, and
wherein receiving the at least one parameter value of the DUT comprises receiving a standing wave ratio (SWR) value of the DUT. 4. The method of claim 2, wherein measuring the signal received by the measurement device comprises measuring noise characteristics of the signal, and
wherein receiving the at least one parameter value of the DUT comprises receiving a standing wave ratio (SWR) value and a noise figure of the DUT. 5. The method of claim 2, wherein measuring the signal received by the measurement device comprises measuring one of frequency response, voltage or distortion characteristics of the signal. 6. The method of claim 3, wherein the SWR value of the DUT and the query requesting the measurement uncertainty are provided using corresponding Standard Commands for Programmable Instruments (SCPI) commands. 7. The method of claim 1, wherein calculating the measurement uncertainty is performed in real time by an MU calculator engine in the measurement device. 8. The method of claim 7, wherein the MU calculator engine calculates the measurement uncertainty further using current settings of the measurement device and probability distributions in accordance with ISO Guide to the Expression of Uncertainty in Measurement (GUM). 9. The method of claim 7, wherein indicating the measured signal and the upper and lower limits of the measured signal comprises displaying the measured signal and the upper and lower limits of the measured signal in real time. 10. The method of claim 3, wherein, when the measured power is indicated in dBm, the upper limit is indicated in +dB and the lower limit is indicated in −dB relative to the measured power, and when the measured power is indicated in Watts, the upper limit is indicated in +percentage Watts and the lower limit is indicated in −percentage Watts relative to the measured power. 11. The method of claim 1, wherein the characterized test data for the sources of uncertainty include mismatch due to the measurement device, power measurement linearity of the measurement device, zero drift, calibration factor uncertainties of the measurement device, measurement noise, and zero set, and internal calibration of the measurement device. 12. A measurement device for measuring a signal output by a device under test (DUT), the measurement device comprising:
a nonvolatile memory configured to store characterized test data corresponding to the measurement device for a plurality of sources of uncertainty; a measurement module configured to receive the signal output by the DUT and to measure the received signal; a measurement uncertainty (MU) calculator engine configured to calculate measurement uncertainty of the measurement device for measuring the received signal using the stored characterized test data and a parameter value of the DUT; and an interface configured to receive the parameter value of the DUT. 13. The measurement device of claim 12, further comprising:
a temperature module configured to measure and monitor ambient temperature, wherein the MU calculator engine is further configured to calculate the MU of the measurement accounting for changes in ambient temperature indicated by the temperature module. 14. The measurement device of claim 12, wherein the interface is further configured to receive a query requesting the measured signal and the measurement uncertainty, the measurement device further comprising:
a display configured to enable display of the measured signal, and upper and lower limits of the measured signal based on the calculated measurement uncertainty, in response to the query. 15. The measurement device of claim 14, wherein the MU calculator engine is configured to calculate the measurement uncertainty of the measurement device in real time. 16. The measurement device of claim 12, wherein the received signal comprises an RF signal output by the DUT, and the measurement module is configured to measure power of the RF signal, and
wherein the parameter value of the DUT comprises a standing wave ratio (SWR) value of the DUT. 17. The measurement device of claim 16, wherein the SWR value of the DUT and the query requesting the measurement uncertainty are input using corresponding Standard Commands for Programmable Instruments (SCPI) commands. 18. The measurement device of claim 12, wherein the received signal comprises an RF signal output by the DUT, and the measurement module is configured to measure noise characteristics of the RF signal, and
wherein the parameter value of the DUT comprises a standing wave ratio (SWR) value of the DUT and a noise figure of the DUT. 19. A measurement device for measuring power of a radio frequency (RF) signal output by a device under test (DUT), the measurement device comprising:
a nonvolatile memory configured to store characterized test data corresponding to the measurement device for a plurality of sources of uncertainty; a measurement module configured to measure the power of the RF signal output by the DUT; a measurement uncertainty (MU) calculator engine configured to calculate measurement uncertainty of the measurement device for measuring the power using the stored characterized test data and at least one standing wave ratio (SWR) value of the DUT; and a display configured to display the measured power and the calculated measurement uncertainty, wherein the calculated measurement uncertainty is displayed as upper and lower limits of the measured power. 20. The measurement device of claim 19, wherein the power measured by the measurement module comprises at least one of average power, peak power and peak to average power ratio. | A method is provided for dynamically determining measurement uncertainty (MU) of a measurement device for measuring a signal output by a device under test (DUT). The method includes storing characterized test data in a nonvolatile memory in the measurement device, the characterized test data being specific to the measurement device for a plurality of sources of uncertainty; receiving a parameter value of the DUT; measuring the signal output by the DUT and received by the measurement device; and calculating the measurement uncertainty of the measurement device for measuring the received signal using the stored characterized test data and the received parameter value of the DUT.1. A method of dynamically determining measurement uncertainty (MU) of a measurement device for measuring a signal output by a device under test (DUT), the method comprising:
storing characterized test data in a nonvolatile memory in the measurement device, the characterized test data being specific to the measurement device for a plurality of sources of uncertainty; receiving at least one parameter value of the DUT; measuring the signal output by the DUT and received by the measurement device; and calculating the measurement uncertainty of the measurement device for measuring the received signal using the stored characterized test data and the received at least one parameter value of the DUT. 2. The method of claim 1, further comprising:
receiving a query requesting the measurement uncertainty; and indicating the measured signal, and upper and lower limits of the measured signal corresponding to the calculated measurement uncertainty, in response to the query. 3. The method of claim 2, wherein measuring the signal received by the measurement device comprises measuring power of the signal, and
wherein receiving the at least one parameter value of the DUT comprises receiving a standing wave ratio (SWR) value of the DUT. 4. The method of claim 2, wherein measuring the signal received by the measurement device comprises measuring noise characteristics of the signal, and
wherein receiving the at least one parameter value of the DUT comprises receiving a standing wave ratio (SWR) value and a noise figure of the DUT. 5. The method of claim 2, wherein measuring the signal received by the measurement device comprises measuring one of frequency response, voltage or distortion characteristics of the signal. 6. The method of claim 3, wherein the SWR value of the DUT and the query requesting the measurement uncertainty are provided using corresponding Standard Commands for Programmable Instruments (SCPI) commands. 7. The method of claim 1, wherein calculating the measurement uncertainty is performed in real time by an MU calculator engine in the measurement device. 8. The method of claim 7, wherein the MU calculator engine calculates the measurement uncertainty further using current settings of the measurement device and probability distributions in accordance with ISO Guide to the Expression of Uncertainty in Measurement (GUM). 9. The method of claim 7, wherein indicating the measured signal and the upper and lower limits of the measured signal comprises displaying the measured signal and the upper and lower limits of the measured signal in real time. 10. The method of claim 3, wherein, when the measured power is indicated in dBm, the upper limit is indicated in +dB and the lower limit is indicated in −dB relative to the measured power, and when the measured power is indicated in Watts, the upper limit is indicated in +percentage Watts and the lower limit is indicated in −percentage Watts relative to the measured power. 11. The method of claim 1, wherein the characterized test data for the sources of uncertainty include mismatch due to the measurement device, power measurement linearity of the measurement device, zero drift, calibration factor uncertainties of the measurement device, measurement noise, and zero set, and internal calibration of the measurement device. 12. A measurement device for measuring a signal output by a device under test (DUT), the measurement device comprising:
a nonvolatile memory configured to store characterized test data corresponding to the measurement device for a plurality of sources of uncertainty; a measurement module configured to receive the signal output by the DUT and to measure the received signal; a measurement uncertainty (MU) calculator engine configured to calculate measurement uncertainty of the measurement device for measuring the received signal using the stored characterized test data and a parameter value of the DUT; and an interface configured to receive the parameter value of the DUT. 13. The measurement device of claim 12, further comprising:
a temperature module configured to measure and monitor ambient temperature, wherein the MU calculator engine is further configured to calculate the MU of the measurement accounting for changes in ambient temperature indicated by the temperature module. 14. The measurement device of claim 12, wherein the interface is further configured to receive a query requesting the measured signal and the measurement uncertainty, the measurement device further comprising:
a display configured to enable display of the measured signal, and upper and lower limits of the measured signal based on the calculated measurement uncertainty, in response to the query. 15. The measurement device of claim 14, wherein the MU calculator engine is configured to calculate the measurement uncertainty of the measurement device in real time. 16. The measurement device of claim 12, wherein the received signal comprises an RF signal output by the DUT, and the measurement module is configured to measure power of the RF signal, and
wherein the parameter value of the DUT comprises a standing wave ratio (SWR) value of the DUT. 17. The measurement device of claim 16, wherein the SWR value of the DUT and the query requesting the measurement uncertainty are input using corresponding Standard Commands for Programmable Instruments (SCPI) commands. 18. The measurement device of claim 12, wherein the received signal comprises an RF signal output by the DUT, and the measurement module is configured to measure noise characteristics of the RF signal, and
wherein the parameter value of the DUT comprises a standing wave ratio (SWR) value of the DUT and a noise figure of the DUT. 19. A measurement device for measuring power of a radio frequency (RF) signal output by a device under test (DUT), the measurement device comprising:
a nonvolatile memory configured to store characterized test data corresponding to the measurement device for a plurality of sources of uncertainty; a measurement module configured to measure the power of the RF signal output by the DUT; a measurement uncertainty (MU) calculator engine configured to calculate measurement uncertainty of the measurement device for measuring the power using the stored characterized test data and at least one standing wave ratio (SWR) value of the DUT; and a display configured to display the measured power and the calculated measurement uncertainty, wherein the calculated measurement uncertainty is displayed as upper and lower limits of the measured power. 20. The measurement device of claim 19, wherein the power measured by the measurement module comprises at least one of average power, peak power and peak to average power ratio. | 2,800 |
12,344 | 12,344 | 16,713,311 | 2,811 | Methods for forming a doped metal oxide film on a substrate by cyclical deposition are provided. In some embodiments, methods may include contacting the substrate with a first reactant comprising a metal halide source, contacting the substrate with a second reactant comprising a hydrogenated source and contacting the substrate with a third reactant comprising an oxide source. In some embodiments, related semiconductor device structures may include a doped metal oxide film formed by cyclical deposition processes. | 1. A method for forming a doped metal oxide film on a substrate, comprising:
contacting a substrate with a first reactant comprising a metal halide source; contacting the substrate with a second reactant comprising a hydrogenated source, wherein the hydrogenated source is a dopant precursor for the doped metal oxide film; and contacting the substrate with a third reactant comprising an oxide source, wherein the doped metal oxide film comprises a structure depending on the order of the contacting the substrate with the first reactant, the contacting the substrate with the second reactant, and the contacting the substrate with the third reactant. 2. The method of claim 1, wherein the structure of the doped metal oxide film comprises a substantially crystalline structure in response to the contacting the substrate with the second reactant occurring after the contacting the substrate with the first reactant and before the contacting the substrate with the third reactant. 3. The method of claim 1, wherein the structure of the doped metal oxide film comprises a substantially amorphous structure in response to the contacting the substrate with the third reactant occurring after the contacting the substrate with the first reactant and before the contacting the substrate with the second reactant. 4. The method of claim 1, wherein the doped metal film comprises between 2 atomic percent and 15 atomic percent dopant. 5. The method of claim 1, wherein the metal halide source comprises at least one of titanium tetrachloride (TiCl4) and zirconium tetrachloride (ZrCl4) 6. The method of claim 1, wherein the hydrogenated source comprises at least one of a hydrogenated silicon source or a hydrogenated germanium source. 7. The method of claim 6, wherein the hydrogenated source comprises the hydrogenated silicon source, which comprises at least one of silane (SiH4), disilane (Si2H6), trisilane (Si3H8), or tetrasilane (Si4H10). 8. The method of claim 6, wherein the hydrogenated source comprises the hydrogenated germanium source, which comprises at least one of germane (GeH4), digermane (Ge2H6), trigermane (Ge3H8), or tetragermane (Ge4H10). 9. The method of claim 1, wherein the oxide source comprises at least one of ozone (O3), an oxygen (O) radical, atomic oxygen (O), molecular oxygen (O2), an oxygen plasma, water (H2O), or hydrogen peroxide (H2O2). 10. The method claim 1, wherein the method comprises a deposition cycle, the deposition cycle comprising the contacting the substrate with the first reactant, the contacting the substrate with the second reactant, and the contacting the substrate with the third reactant. 11. The method of claim 10, wherein the deposition cycle is repeated two or more times. 12. The method of claim 1, further comprising heating the substrate to a temperature of less than about 350° C. 13. The method of claim 1, wherein the doped metal oxide comprises at least one of silicon doped titanium oxide (Ti1-xSixO2), germanium doped titanium oxide (Ti1-xGexO2), silicon doped zirconium oxide (Zr1-xSixO2), germanium doped zirconium oxide (Zr1-xGexO2), silicon doped hafnium oxide (Hf1-xSixO2), or germanium doped hafnium oxide (Hf1-xGexO2). 14. A reaction system, comprising:
a reaction chamber; a first reactant source, comprising a metal halide source, in fluid communication with the reaction chamber; a second reactant source, comprising a hydrogenated source, in fluid communication with the reaction chamber, wherein the hydrogenated source is a dopant precursor for a doped metal oxide film to be disposed on a substrate in the reaction chamber; a third reactant source, comprising an oxide source, in fluid communication with the reaction chamber, wherein the reaction system is configured to form a doped metal oxide film on the substrate by contacting the substrate with the metal halide source from the first reactant source, contacting the substrate with the hydrogenated source from the second reactant source, and contacting the substrate with the oxide source from the third reactant source. 15. The reaction system of claim 14, wherein the doped metal oxide film comprises between 2 atomic percent and 15 atomic percent dopant. 16. The reaction system of claim 14, wherein the system is configured to perform the contacting the substrate with the metal halide source from the first reactant source, perform the contacting the substrate with the hydrogenated source from the second reactant source after the contacting the substrate with the metal halide source from the first reactant source, and perform the contacting the substrate with the oxide source from the third reactant source after the contacting the substrate with the hydrogenated source from the second reactant source, and in response, the doped metal oxide film comprises a substantially crystalline structure. 17. The reaction system of claim 14, wherein the system is configured to perform the contacting the substrate with the metal halide source from the first reactant source, perform the contacting the substrate with the oxide source from the third reactant source after the contacting the substrate with the metal halide source from the first reactant source, and perform the contacting the substrate with the hydrogenated source from the second reactant source after the contacting the substrate with the oxide source from the third reactant source, and in response, the doped metal oxide film comprises a substantially amorphous structure. 18. A semiconductor device, comprising:
a substrate; and a doped metal oxide film comprising at least one of silicon doped titanium oxide (Ti1-xSixO2), germanium doped titanium oxide (Ti1-xGexO2), silicon doped zirconium oxide (Zr1-xSixO2), germanium doped zirconium oxide (Zr1-xGexO2), silicon doped hafnium oxide (Hf1-xSixO2), or germanium doped hafnium oxide (Hf1-xGexO2), wherein the doped metal oxide film comprises between 2 atomic percent and 15 atomic percent of dopant. 19. The semiconductor device of claim 18, wherein the doped metal oxide film is formed by:
contacting the substrate with a first reactant comprising a metal halide source; contacting the substrate with a second reactant comprising a hydrogenated source, wherein the hydrogenated source is a dopant precursor for the doped metal oxide film; and contacting the substrate with a third reactant comprising an oxide source, wherein the doped metal oxide film comprises a substantially crystalline structure in response to the contacting the substrate with the second reactant occurring after the contacting the substrate with the first reactant and before the contacting the substrate with the third reactant. 20. The semiconductor device of claim 18, wherein the doped metal oxide film is formed by:
contacting the substrate with a first reactant comprising a metal halide source; contacting the substrate with a second reactant comprising a hydrogenated source, wherein the hydrogenated source is a dopant precursor for the doped metal oxide film; and contacting the substrate with a third reactant comprising an oxide source, wherein the doped metal oxide film comprises a substantially amorphous structure in response to the contacting the substrate with the third reactant occurring after the contacting the substrate with the first reactant and before the contacting the substrate with the second reactant. | Methods for forming a doped metal oxide film on a substrate by cyclical deposition are provided. In some embodiments, methods may include contacting the substrate with a first reactant comprising a metal halide source, contacting the substrate with a second reactant comprising a hydrogenated source and contacting the substrate with a third reactant comprising an oxide source. In some embodiments, related semiconductor device structures may include a doped metal oxide film formed by cyclical deposition processes.1. A method for forming a doped metal oxide film on a substrate, comprising:
contacting a substrate with a first reactant comprising a metal halide source; contacting the substrate with a second reactant comprising a hydrogenated source, wherein the hydrogenated source is a dopant precursor for the doped metal oxide film; and contacting the substrate with a third reactant comprising an oxide source, wherein the doped metal oxide film comprises a structure depending on the order of the contacting the substrate with the first reactant, the contacting the substrate with the second reactant, and the contacting the substrate with the third reactant. 2. The method of claim 1, wherein the structure of the doped metal oxide film comprises a substantially crystalline structure in response to the contacting the substrate with the second reactant occurring after the contacting the substrate with the first reactant and before the contacting the substrate with the third reactant. 3. The method of claim 1, wherein the structure of the doped metal oxide film comprises a substantially amorphous structure in response to the contacting the substrate with the third reactant occurring after the contacting the substrate with the first reactant and before the contacting the substrate with the second reactant. 4. The method of claim 1, wherein the doped metal film comprises between 2 atomic percent and 15 atomic percent dopant. 5. The method of claim 1, wherein the metal halide source comprises at least one of titanium tetrachloride (TiCl4) and zirconium tetrachloride (ZrCl4) 6. The method of claim 1, wherein the hydrogenated source comprises at least one of a hydrogenated silicon source or a hydrogenated germanium source. 7. The method of claim 6, wherein the hydrogenated source comprises the hydrogenated silicon source, which comprises at least one of silane (SiH4), disilane (Si2H6), trisilane (Si3H8), or tetrasilane (Si4H10). 8. The method of claim 6, wherein the hydrogenated source comprises the hydrogenated germanium source, which comprises at least one of germane (GeH4), digermane (Ge2H6), trigermane (Ge3H8), or tetragermane (Ge4H10). 9. The method of claim 1, wherein the oxide source comprises at least one of ozone (O3), an oxygen (O) radical, atomic oxygen (O), molecular oxygen (O2), an oxygen plasma, water (H2O), or hydrogen peroxide (H2O2). 10. The method claim 1, wherein the method comprises a deposition cycle, the deposition cycle comprising the contacting the substrate with the first reactant, the contacting the substrate with the second reactant, and the contacting the substrate with the third reactant. 11. The method of claim 10, wherein the deposition cycle is repeated two or more times. 12. The method of claim 1, further comprising heating the substrate to a temperature of less than about 350° C. 13. The method of claim 1, wherein the doped metal oxide comprises at least one of silicon doped titanium oxide (Ti1-xSixO2), germanium doped titanium oxide (Ti1-xGexO2), silicon doped zirconium oxide (Zr1-xSixO2), germanium doped zirconium oxide (Zr1-xGexO2), silicon doped hafnium oxide (Hf1-xSixO2), or germanium doped hafnium oxide (Hf1-xGexO2). 14. A reaction system, comprising:
a reaction chamber; a first reactant source, comprising a metal halide source, in fluid communication with the reaction chamber; a second reactant source, comprising a hydrogenated source, in fluid communication with the reaction chamber, wherein the hydrogenated source is a dopant precursor for a doped metal oxide film to be disposed on a substrate in the reaction chamber; a third reactant source, comprising an oxide source, in fluid communication with the reaction chamber, wherein the reaction system is configured to form a doped metal oxide film on the substrate by contacting the substrate with the metal halide source from the first reactant source, contacting the substrate with the hydrogenated source from the second reactant source, and contacting the substrate with the oxide source from the third reactant source. 15. The reaction system of claim 14, wherein the doped metal oxide film comprises between 2 atomic percent and 15 atomic percent dopant. 16. The reaction system of claim 14, wherein the system is configured to perform the contacting the substrate with the metal halide source from the first reactant source, perform the contacting the substrate with the hydrogenated source from the second reactant source after the contacting the substrate with the metal halide source from the first reactant source, and perform the contacting the substrate with the oxide source from the third reactant source after the contacting the substrate with the hydrogenated source from the second reactant source, and in response, the doped metal oxide film comprises a substantially crystalline structure. 17. The reaction system of claim 14, wherein the system is configured to perform the contacting the substrate with the metal halide source from the first reactant source, perform the contacting the substrate with the oxide source from the third reactant source after the contacting the substrate with the metal halide source from the first reactant source, and perform the contacting the substrate with the hydrogenated source from the second reactant source after the contacting the substrate with the oxide source from the third reactant source, and in response, the doped metal oxide film comprises a substantially amorphous structure. 18. A semiconductor device, comprising:
a substrate; and a doped metal oxide film comprising at least one of silicon doped titanium oxide (Ti1-xSixO2), germanium doped titanium oxide (Ti1-xGexO2), silicon doped zirconium oxide (Zr1-xSixO2), germanium doped zirconium oxide (Zr1-xGexO2), silicon doped hafnium oxide (Hf1-xSixO2), or germanium doped hafnium oxide (Hf1-xGexO2), wherein the doped metal oxide film comprises between 2 atomic percent and 15 atomic percent of dopant. 19. The semiconductor device of claim 18, wherein the doped metal oxide film is formed by:
contacting the substrate with a first reactant comprising a metal halide source; contacting the substrate with a second reactant comprising a hydrogenated source, wherein the hydrogenated source is a dopant precursor for the doped metal oxide film; and contacting the substrate with a third reactant comprising an oxide source, wherein the doped metal oxide film comprises a substantially crystalline structure in response to the contacting the substrate with the second reactant occurring after the contacting the substrate with the first reactant and before the contacting the substrate with the third reactant. 20. The semiconductor device of claim 18, wherein the doped metal oxide film is formed by:
contacting the substrate with a first reactant comprising a metal halide source; contacting the substrate with a second reactant comprising a hydrogenated source, wherein the hydrogenated source is a dopant precursor for the doped metal oxide film; and contacting the substrate with a third reactant comprising an oxide source, wherein the doped metal oxide film comprises a substantially amorphous structure in response to the contacting the substrate with the third reactant occurring after the contacting the substrate with the first reactant and before the contacting the substrate with the second reactant. | 2,800 |
12,345 | 12,345 | 16,543,756 | 2,845 | An apparatus for shifting a digital signal having a first sample rate by a shift time to provide a shifted signal having a second sample rate is provided. The apparatus includes a sample rate converter configured to provide a value of an interpolated signal at a compensated sample time as a sample of the shifted signal, the interpolated signal being based on the digital signal. The sample rate converter is configured to modify a time interval between a sample time of the digital signal and the compensated sample time based on the shift time. | 1. (canceled) 2. An apparatus for time-shifting a digital signal by a shift time while converting a sample rate of the digital signal, the apparatus comprising:
a sample rate converter configured to evaluate an interpolation function determined based on input samples of the digital signal at a compensated sample time to generate output samples, wherein the input samples have a first sample rate and the output samples have a second sample rate, and the compensated sample time is determined based on a shift time between the output samples and the input samples. 3. The apparatus of claim 2, wherein the sample rate converter comprises:
a nominal sample time calculation unit configured to determine a nominal sample time corresponding to the second sample rate; and an adder for adding or subtracting the shift time to or from the nominal sample time to obtain the compensated sample time. 4. The apparatus of claim 3, wherein the sample rate converter comprises a format conversion unit to match a format of the shift time and the nominal sample time. 5. The apparatus of claim 2, wherein the sample rate converter comprises an integrator to determine the compensated sample time, wherein the compensated sample time is determined by modifying a start value for the integrator by a value related to the shift time. 6. The apparatus of claim 2, wherein the sample rate converter comprises:
a first processing unit for processing the input samples at the first sample rate; a second processing unit for processing outputs of the first processing unit at the second sample rate; a First-In First-Out (FIFO) memory for interfacing between the first processing unit and the second processing unit and storing the outputs of the first processing unit; and a controller configured to control a fill level of the FIFO memory. 7. The apparatus of claim 6, wherein the controller comprises:
a fill level detector configured to detect a present fill level of the FIFO memory; a fill level target setting unit configured to adjust a fill level target value for the FIFO memory; a comparator configured to compare the present fill level of the FIFO memory with the fill level target value; and a sample time calculation unit configured to adjust the compensated sample time based on a comparison result of the comparator. 8. The apparatus of claim 2, wherein the shift time is static. 9. The apparatus of claim 2, wherein the shift time is variable over time. 10. The apparatus of claim 2, wherein the ratio of the first sample rate and the second sample rate is fractional. 11. A transmitter comprising:
a first circuitry configured to process a digital signal at a first clock rate; a digital modulator configured to time-shift an output of the first circuitry by a shift time while converting a sample rate of the digital signal; and a second circuitry configured to process an output of the digital modulator at a second clock rate. 12. The transmitter of claim 11, wherein the digital modulator comprises:
a sample rate converter configured to evaluate an interpolation function determined from input samples of the digital signal at a compensated sample time to generate output samples, wherein the input samples have a first sample rate and the output samples have a second sample rate, and the compensated sample time is determined based on a shift time between the output samples and the input samples. 13. The transmitter of claim 12, wherein each of the first circuitry and the second circuitry includes a plurality of processing paths and the digital modulator is configured to adjust shift times on the plurality of processing paths to timely align outputs on the plurality of processing paths. 14. The transmitter of claim 13 wherein the plurality of processing paths include a processing path for a radius component of a transmit signal, a processing path for a phase component of the transmit signal, and/or a processing path for an envelope component of the transmit signal. 15. The transmitter of claim 12 wherein the first circuitry is a digital signal processor running on a digital signal processor clock domain and the second circuitry is a radio frequency (RF) circuitry running on an RF clock domain. 16. The transmitter of claim 12, wherein the shift time is variable over time. 17. The transmitter of claim 12, wherein the ratio of the first sample rate and the second sample rate is fractional. 18. A method for time-shifting a digital signal by a shift time while converting a sample rate of the digital signal, the method comprising:
receiving input samples of the digital signal having a first sample rate; evaluating an interpolation function determined based on the input samples of the digital signal at a compensated sample time to generate output samples; and providing the output samples having a second sample rate, wherein the compensated sample time is determined based on a shift time between the output samples and the input samples. 19. The method of claim 18, wherein the compensated sample time is determined by:
determining a nominal sample time corresponding to the second sample rate; and adding or subtracting the shift time to or from the nominal sample time. 20. The method of claim 18, wherein the shift time is variable over time. 21. The method of claim 18, wherein the ratio of the first sample rate and the second sample rate is fractional. | An apparatus for shifting a digital signal having a first sample rate by a shift time to provide a shifted signal having a second sample rate is provided. The apparatus includes a sample rate converter configured to provide a value of an interpolated signal at a compensated sample time as a sample of the shifted signal, the interpolated signal being based on the digital signal. The sample rate converter is configured to modify a time interval between a sample time of the digital signal and the compensated sample time based on the shift time.1. (canceled) 2. An apparatus for time-shifting a digital signal by a shift time while converting a sample rate of the digital signal, the apparatus comprising:
a sample rate converter configured to evaluate an interpolation function determined based on input samples of the digital signal at a compensated sample time to generate output samples, wherein the input samples have a first sample rate and the output samples have a second sample rate, and the compensated sample time is determined based on a shift time between the output samples and the input samples. 3. The apparatus of claim 2, wherein the sample rate converter comprises:
a nominal sample time calculation unit configured to determine a nominal sample time corresponding to the second sample rate; and an adder for adding or subtracting the shift time to or from the nominal sample time to obtain the compensated sample time. 4. The apparatus of claim 3, wherein the sample rate converter comprises a format conversion unit to match a format of the shift time and the nominal sample time. 5. The apparatus of claim 2, wherein the sample rate converter comprises an integrator to determine the compensated sample time, wherein the compensated sample time is determined by modifying a start value for the integrator by a value related to the shift time. 6. The apparatus of claim 2, wherein the sample rate converter comprises:
a first processing unit for processing the input samples at the first sample rate; a second processing unit for processing outputs of the first processing unit at the second sample rate; a First-In First-Out (FIFO) memory for interfacing between the first processing unit and the second processing unit and storing the outputs of the first processing unit; and a controller configured to control a fill level of the FIFO memory. 7. The apparatus of claim 6, wherein the controller comprises:
a fill level detector configured to detect a present fill level of the FIFO memory; a fill level target setting unit configured to adjust a fill level target value for the FIFO memory; a comparator configured to compare the present fill level of the FIFO memory with the fill level target value; and a sample time calculation unit configured to adjust the compensated sample time based on a comparison result of the comparator. 8. The apparatus of claim 2, wherein the shift time is static. 9. The apparatus of claim 2, wherein the shift time is variable over time. 10. The apparatus of claim 2, wherein the ratio of the first sample rate and the second sample rate is fractional. 11. A transmitter comprising:
a first circuitry configured to process a digital signal at a first clock rate; a digital modulator configured to time-shift an output of the first circuitry by a shift time while converting a sample rate of the digital signal; and a second circuitry configured to process an output of the digital modulator at a second clock rate. 12. The transmitter of claim 11, wherein the digital modulator comprises:
a sample rate converter configured to evaluate an interpolation function determined from input samples of the digital signal at a compensated sample time to generate output samples, wherein the input samples have a first sample rate and the output samples have a second sample rate, and the compensated sample time is determined based on a shift time between the output samples and the input samples. 13. The transmitter of claim 12, wherein each of the first circuitry and the second circuitry includes a plurality of processing paths and the digital modulator is configured to adjust shift times on the plurality of processing paths to timely align outputs on the plurality of processing paths. 14. The transmitter of claim 13 wherein the plurality of processing paths include a processing path for a radius component of a transmit signal, a processing path for a phase component of the transmit signal, and/or a processing path for an envelope component of the transmit signal. 15. The transmitter of claim 12 wherein the first circuitry is a digital signal processor running on a digital signal processor clock domain and the second circuitry is a radio frequency (RF) circuitry running on an RF clock domain. 16. The transmitter of claim 12, wherein the shift time is variable over time. 17. The transmitter of claim 12, wherein the ratio of the first sample rate and the second sample rate is fractional. 18. A method for time-shifting a digital signal by a shift time while converting a sample rate of the digital signal, the method comprising:
receiving input samples of the digital signal having a first sample rate; evaluating an interpolation function determined based on the input samples of the digital signal at a compensated sample time to generate output samples; and providing the output samples having a second sample rate, wherein the compensated sample time is determined based on a shift time between the output samples and the input samples. 19. The method of claim 18, wherein the compensated sample time is determined by:
determining a nominal sample time corresponding to the second sample rate; and adding or subtracting the shift time to or from the nominal sample time. 20. The method of claim 18, wherein the shift time is variable over time. 21. The method of claim 18, wherein the ratio of the first sample rate and the second sample rate is fractional. | 2,800 |
12,346 | 12,346 | 16,406,996 | 2,816 | Embodiments for a packaged semiconductor device and methods of making are provided herein, where a packaged semiconductor device includes a package body having a recess in which a pressure sensor is exposed; a polymeric gel within the recess that vertically and laterally surrounds the pressure sensor; and a protection layer including a plurality of beads embedded within a top region of the polymeric gel. | 1. A packaged semiconductor device comprising:
a package body having a recess in which a pressure sensor is exposed; a polymeric gel within the recess that vertically and laterally surrounds the pressure sensor; and a protection layer comprising a plurality of beads embedded within a top region of the polymeric gel. 2. The packaged semiconductor device of claim 1, wherein
the recess has one or more recess sidewalls, and each recess sidewall is separated from an adjacent electronic component located within the recess by at least a minimum lateral spacing distance. 3. The packaged semiconductor device of claim 1, wherein
the protection layer is separated from an adjacent electronic component located within the recess by at least a minimum vertical spacing distance. 4. The packaged semiconductor device of claim 1, wherein
the plurality of beads are laterally distributed across an entirety of the top region of the polymeric gel. 5. The packaged semiconductor device of claim 1, wherein
the protection layer has a minimum bead concentration defined as at least 75% of a unit volume is filled with beads, and the unit volume is equal to a vertical thickness of the protection layer, cubed. 6. The packaged semiconductor device of claim 1, wherein
the protection layer has a minimum bead concentration defined as at least 75% of beads within a unit volume contact at least one other bead, and the unit volume is equal to a vertical thickness of the protection layer, cubed. 7. The packaged semiconductor device of claim 1, wherein
the protection layer has at least two strata of beads, each strata having a vertical height that corresponds to an average diameter of a bead plurality of beads, and beads in a lower strata are positioned within interstitial openings between beads in an upper strata. 8. The packaged semiconductor device of claim 1, wherein
the plurality of beads comprises beads formed from a material that has a slower rate of media diffusion than the polymeric gel. 9. The packaged semiconductor device of claim 1, wherein
the plurality of beads comprises beads formed from at least one of a polymer material and glass. 10. The packaged semiconductor device of claim 9, wherein
each bead of the plurality of beads further comprises a metal coating. 11. The packaged semiconductor device of claim 1, wherein
the plurality of beads comprises beads having one or more shapes of a group of shapes including spheres, hollow spheres, cylindrical shapes, hollow cylindrical shapes, rectangular box shapes, hollow rectangular box shapes, and toroidal shapes. 12. The packaged semiconductor device of claim 1, further comprising:
a substrate embedded in the package body; and a semiconductor die attached to the substrate and embedded in the package body, wherein
the substrate is one of a group including a laminate substrate and a lead frame. 13. The packaged semiconductor device of claim 1, further comprising:
a lid attached to a top surface of the package body, wherein the lid includes a vent hole. 14. A method for fabricating a packaged semiconductor device, the method comprising:
assembling a semiconductor die and a substrate as part of a device structure; encapsulating the device structure using film assisted molding to form a mold body having a recess; attaching a pressure sensor to an attachment surface exposed within the recess; injecting a low viscosity polymeric gel into the recess, wherein
the low viscosity polymeric gel comprises a plurality of beads distributed within the low viscosity polymeric gel; and
curing the low viscosity polymeric gel into a high viscosity polymeric gel, wherein
the plurality of beads float toward a top surface of the low viscosity polymeric gel as the low viscosity polymeric gel is cured into the high viscosity polymeric gel, and
the plurality of beads become embedded in a top region of the high viscosity polymeric gel. 15. The method of claim 14, wherein
a density of each bead of the plurality of beads is less than a density of the low viscosity polymeric gel. 16. The method of claim 14, wherein
before the curing, the low viscosity polymeric gel has an initial viscosity that reduces movement of the plurality of beads distributed within the low viscosity polymeric gel, and during an initial curing stage, the initial viscosity is reduced to release the plurality of beads distributed within the low viscosity polymeric gel. 17. The method of claim 14, further comprising:
during the curing, vibrating the device structure to encourage self-arrangement of the plurality of beads near the top surface of the low viscosity polymeric gel. 18. A method for fabricating a packaged semiconductor device, the method comprising:
assembling a semiconductor die and a substrate as part of a device structure; encapsulating the device structure using film assisted molding to form a mold body having a recess; attaching a pressure sensor to an attachment surface exposed within the recess; injecting a low viscosity polymeric gel into the recess; curing the low viscosity polymeric gel into an intermediate viscosity polymeric gel; dispensing a plurality of beads onto a top surface of the intermediate viscosity polymeric gel, wherein
the plurality of beads sink below a top surface of the intermediate viscosity polymeric gel; and
curing the intermediate viscosity polymeric gel into a high viscosity polymeric gel, wherein
the plurality of beads become embedded in a top region of the high viscosity polymeric gel. 19. The method of claim 18, wherein
a density of each bead of the plurality of beads is greater than a density of the intermediate viscosity polymeric gel. 20. The method of claim 18, further comprising:
vibrating the device structure to encourage self-arrangement of the plurality of beads near the top surface of the intermediate viscosity polymeric gel. | Embodiments for a packaged semiconductor device and methods of making are provided herein, where a packaged semiconductor device includes a package body having a recess in which a pressure sensor is exposed; a polymeric gel within the recess that vertically and laterally surrounds the pressure sensor; and a protection layer including a plurality of beads embedded within a top region of the polymeric gel.1. A packaged semiconductor device comprising:
a package body having a recess in which a pressure sensor is exposed; a polymeric gel within the recess that vertically and laterally surrounds the pressure sensor; and a protection layer comprising a plurality of beads embedded within a top region of the polymeric gel. 2. The packaged semiconductor device of claim 1, wherein
the recess has one or more recess sidewalls, and each recess sidewall is separated from an adjacent electronic component located within the recess by at least a minimum lateral spacing distance. 3. The packaged semiconductor device of claim 1, wherein
the protection layer is separated from an adjacent electronic component located within the recess by at least a minimum vertical spacing distance. 4. The packaged semiconductor device of claim 1, wherein
the plurality of beads are laterally distributed across an entirety of the top region of the polymeric gel. 5. The packaged semiconductor device of claim 1, wherein
the protection layer has a minimum bead concentration defined as at least 75% of a unit volume is filled with beads, and the unit volume is equal to a vertical thickness of the protection layer, cubed. 6. The packaged semiconductor device of claim 1, wherein
the protection layer has a minimum bead concentration defined as at least 75% of beads within a unit volume contact at least one other bead, and the unit volume is equal to a vertical thickness of the protection layer, cubed. 7. The packaged semiconductor device of claim 1, wherein
the protection layer has at least two strata of beads, each strata having a vertical height that corresponds to an average diameter of a bead plurality of beads, and beads in a lower strata are positioned within interstitial openings between beads in an upper strata. 8. The packaged semiconductor device of claim 1, wherein
the plurality of beads comprises beads formed from a material that has a slower rate of media diffusion than the polymeric gel. 9. The packaged semiconductor device of claim 1, wherein
the plurality of beads comprises beads formed from at least one of a polymer material and glass. 10. The packaged semiconductor device of claim 9, wherein
each bead of the plurality of beads further comprises a metal coating. 11. The packaged semiconductor device of claim 1, wherein
the plurality of beads comprises beads having one or more shapes of a group of shapes including spheres, hollow spheres, cylindrical shapes, hollow cylindrical shapes, rectangular box shapes, hollow rectangular box shapes, and toroidal shapes. 12. The packaged semiconductor device of claim 1, further comprising:
a substrate embedded in the package body; and a semiconductor die attached to the substrate and embedded in the package body, wherein
the substrate is one of a group including a laminate substrate and a lead frame. 13. The packaged semiconductor device of claim 1, further comprising:
a lid attached to a top surface of the package body, wherein the lid includes a vent hole. 14. A method for fabricating a packaged semiconductor device, the method comprising:
assembling a semiconductor die and a substrate as part of a device structure; encapsulating the device structure using film assisted molding to form a mold body having a recess; attaching a pressure sensor to an attachment surface exposed within the recess; injecting a low viscosity polymeric gel into the recess, wherein
the low viscosity polymeric gel comprises a plurality of beads distributed within the low viscosity polymeric gel; and
curing the low viscosity polymeric gel into a high viscosity polymeric gel, wherein
the plurality of beads float toward a top surface of the low viscosity polymeric gel as the low viscosity polymeric gel is cured into the high viscosity polymeric gel, and
the plurality of beads become embedded in a top region of the high viscosity polymeric gel. 15. The method of claim 14, wherein
a density of each bead of the plurality of beads is less than a density of the low viscosity polymeric gel. 16. The method of claim 14, wherein
before the curing, the low viscosity polymeric gel has an initial viscosity that reduces movement of the plurality of beads distributed within the low viscosity polymeric gel, and during an initial curing stage, the initial viscosity is reduced to release the plurality of beads distributed within the low viscosity polymeric gel. 17. The method of claim 14, further comprising:
during the curing, vibrating the device structure to encourage self-arrangement of the plurality of beads near the top surface of the low viscosity polymeric gel. 18. A method for fabricating a packaged semiconductor device, the method comprising:
assembling a semiconductor die and a substrate as part of a device structure; encapsulating the device structure using film assisted molding to form a mold body having a recess; attaching a pressure sensor to an attachment surface exposed within the recess; injecting a low viscosity polymeric gel into the recess; curing the low viscosity polymeric gel into an intermediate viscosity polymeric gel; dispensing a plurality of beads onto a top surface of the intermediate viscosity polymeric gel, wherein
the plurality of beads sink below a top surface of the intermediate viscosity polymeric gel; and
curing the intermediate viscosity polymeric gel into a high viscosity polymeric gel, wherein
the plurality of beads become embedded in a top region of the high viscosity polymeric gel. 19. The method of claim 18, wherein
a density of each bead of the plurality of beads is greater than a density of the intermediate viscosity polymeric gel. 20. The method of claim 18, further comprising:
vibrating the device structure to encourage self-arrangement of the plurality of beads near the top surface of the intermediate viscosity polymeric gel. | 2,800 |
12,347 | 12,347 | 16,029,908 | 2,846 | A system for controlling an electric machine of a vehicle includes, among other things, a controller module configured to attenuate noise from the electric machine by altering a corrective voltage in response to feedback about the noise. The corrective voltage and a fundamental voltage command are supplied to the electric machine as a combined voltage command. The corrective voltage is on a harmonic adjacent to a harmonic of the noise. A method of controlling noise associated with an electric machine of a vehicle includes, among other things, altering a corrective voltage to attenuate noise in response to feedback about the noise. The corrective voltage and a fundamental voltage command are supplied to the electric machine as a combined voltage command. The corrective voltage is on a harmonic adjacent to a harmonic of the noise. | 1. A system for controlling an electric machine of a vehicle, comprising:
a controller module configured to attenuate noise from the electric machine by altering a corrective voltage in response to feedback about the noise, the corrective voltage and a fundamental voltage command supplied to the electric machine as a combined voltage command, the corrective voltage on a harmonic adjacent to a harmonic of the noise. 2. The system of claim 1, wherein the noise is audible harmonic noise. 3. The system of claim 1, further comprising at least one microphone that collects the feedback. 4. The system of claim 1, further comprising at least one accelerometer that collects the feedback. 5. The system of claim 1, wherein the feedback comprises audible noise feedback, vibratory feedback, or both. 6. The system of claim 1, wherein the harmonic of the noise is an n*6th order harmonic, and the harmonic of the corrective voltage (n*6th)+1 order harmonic, an (n*6th)−1 order harmonic, or both. 7. The system of claim 1, wherein the harmonic of the corrective voltage is directly adjacent the harmonic of the noise. 8. The system of claim 1, further comprising an electrified vehicle incorporating the electric machine. 9. The system of claim 1, wherein the electric machine is three-phase electric motor. 10. The system of claim 1, further comprising a first current regulator that generates the fundamental voltage command, and a different, second current regulator that generates the corrective voltage. 11. A method of controlling noise associated with an electric machine of a vehicle, comprising:
altering a corrective voltage to attenuate noise in response to feedback about the noise, the corrective voltage and a fundamental voltage command supplied to the electric machine as a combined voltage command, the corrective voltage on a harmonic adjacent to a harmonic of the noise. 12. The method of claim 11, further comprising collecting the feedback as audible feedback using at least one microphone. 13. The method of claim 11, further comprising collecting the feedback as vibratory feedback using at least one accelerometer. 14. The method of claim 11, wherein the feedback comprises audible noise feedback, vibratory feedback, or both. 15. The method of claim 11, wherein the harmonic of the noise is an n*6th order harmonic, and the harmonic of the corrective voltage is an (n*6th)+1 order harmonic, an (n*6th)−1 order harmonic, or both. 16. The method of claim 11, wherein the harmonic of the corrective voltage is directly adjacent the harmonic of the noise. 17. The method of claim 11, further comprising driving an electrified vehicle with torque generated by the electric machine. 18. The method of claim 11, wherein the electric machine is three-phase electric motor. 19. The method of claim 11, further comprising providing the fundamental voltage command using a first current regulator, and providing the corrective voltage using a different, second current regulator. | A system for controlling an electric machine of a vehicle includes, among other things, a controller module configured to attenuate noise from the electric machine by altering a corrective voltage in response to feedback about the noise. The corrective voltage and a fundamental voltage command are supplied to the electric machine as a combined voltage command. The corrective voltage is on a harmonic adjacent to a harmonic of the noise. A method of controlling noise associated with an electric machine of a vehicle includes, among other things, altering a corrective voltage to attenuate noise in response to feedback about the noise. The corrective voltage and a fundamental voltage command are supplied to the electric machine as a combined voltage command. The corrective voltage is on a harmonic adjacent to a harmonic of the noise.1. A system for controlling an electric machine of a vehicle, comprising:
a controller module configured to attenuate noise from the electric machine by altering a corrective voltage in response to feedback about the noise, the corrective voltage and a fundamental voltage command supplied to the electric machine as a combined voltage command, the corrective voltage on a harmonic adjacent to a harmonic of the noise. 2. The system of claim 1, wherein the noise is audible harmonic noise. 3. The system of claim 1, further comprising at least one microphone that collects the feedback. 4. The system of claim 1, further comprising at least one accelerometer that collects the feedback. 5. The system of claim 1, wherein the feedback comprises audible noise feedback, vibratory feedback, or both. 6. The system of claim 1, wherein the harmonic of the noise is an n*6th order harmonic, and the harmonic of the corrective voltage (n*6th)+1 order harmonic, an (n*6th)−1 order harmonic, or both. 7. The system of claim 1, wherein the harmonic of the corrective voltage is directly adjacent the harmonic of the noise. 8. The system of claim 1, further comprising an electrified vehicle incorporating the electric machine. 9. The system of claim 1, wherein the electric machine is three-phase electric motor. 10. The system of claim 1, further comprising a first current regulator that generates the fundamental voltage command, and a different, second current regulator that generates the corrective voltage. 11. A method of controlling noise associated with an electric machine of a vehicle, comprising:
altering a corrective voltage to attenuate noise in response to feedback about the noise, the corrective voltage and a fundamental voltage command supplied to the electric machine as a combined voltage command, the corrective voltage on a harmonic adjacent to a harmonic of the noise. 12. The method of claim 11, further comprising collecting the feedback as audible feedback using at least one microphone. 13. The method of claim 11, further comprising collecting the feedback as vibratory feedback using at least one accelerometer. 14. The method of claim 11, wherein the feedback comprises audible noise feedback, vibratory feedback, or both. 15. The method of claim 11, wherein the harmonic of the noise is an n*6th order harmonic, and the harmonic of the corrective voltage is an (n*6th)+1 order harmonic, an (n*6th)−1 order harmonic, or both. 16. The method of claim 11, wherein the harmonic of the corrective voltage is directly adjacent the harmonic of the noise. 17. The method of claim 11, further comprising driving an electrified vehicle with torque generated by the electric machine. 18. The method of claim 11, wherein the electric machine is three-phase electric motor. 19. The method of claim 11, further comprising providing the fundamental voltage command using a first current regulator, and providing the corrective voltage using a different, second current regulator. | 2,800 |
12,348 | 12,348 | 13,579,403 | 2,833 | The length of a waterproof and dustproof connector can be reduced to decrease its occupation area so as to secure the occupied area of the circuit board for electronic equipment and so as to design the layout of the electronic equipment more freely and so as to downsize the electronic equipment. The connector for electronic equipment includes an approximately cylindrical housing 2 , a support 21 provided in the form of a wall in the housing 2 , a contact terminal 3 and a power terminal 4 supported by the support 21 , a shell 5 mounted inside the housing 2 , and a seal 6 provided along the outer circumference adjacent to the end on the connection terminal inserting side of the housing 2 . Preferably, the seal 6 is welded to the housing 2 and made of a resin softer than the resin of the housing 2. | 1-7. (canceled) 8. A connector for electronic equipment comprising: an approximately cylindrical housing; a support provided in the form of a wall in the housing; a contact terminal and a power terminal supported by the support; a shell mounted inside the housing; and a seal provided along the outer circumference adjacent to the end on the connection terminal inserting side of the housing. 9. The connector for electronic equipment according to claim 8, wherein the seal is welded to the housing and made of a resin softer than the resin of the housing. 10. The connector for electronic equipment according to claim 8 further comprising an additional seal provided in an innermost recess surrounded by the innermost peripheral wall of the housing and the support. 11. The connector for electronic equipment according to claim 9 further comprising an additional seal provided in an innermost recess surrounded by the innermost peripheral wall of the housing and the support. 12. The connector for electronic equipment according to claim 8, wherein the seal projects from the end on the connection terminal inserting side of the housing to the connection terminal inserting side and can then be brought into press contact with the surface of the connection terminal inserting side of the case in which the housing is placed. 13. The connector for electronic equipment according to claim 12 further comprising an elongated protrusion peripherally projecting adjacent to the end on the connection terminal inserting side of the housing and then contacting with the innermost end of the seal; a projection formed on the innermost surface of the elongated protrusion; and a wedge enabling the housing to be biased to the terminal insertion side by being pushed to the housing side and then contacted with the projection. 14. The connector for electronic equipment according to claim 9 comprising an elongated protrusion peripherally projecting adjacent to the end on the connection terminal inserting side of the housing and then contacting with the innermost end of the seal, wherein an engagement recess is formed on a part of the surface on the connection terminal inserting side of the elongated protrusion and welded to be engaged with the seal, and the seal projects from the end on the connection terminal inserting side of the housing to the connection terminal inserting side and can then be brought into press contact with the surface on the connection terminal inserting side of the case in which the housing is placed. 15. The connection device for electronic equipment, comprising the connector for electronic equipment according to claim 12; and one and the other cases that form the case, wherein the connector includes an elongated protrusion peripherally projecting adjacent to the end on the connection terminal inserting side of the housing and then contacting with the innermost end of the seal, and a projection formed on the innermost surface of the elongated protrusion, one case includes a guide guiding the elongated protrusion to a storage recess toward the connection terminal inserting side along an inclined surface, and the other case includes a wedge enabling the housing to be biased to the terminal insertion side by being pushed to the housing side and then contacted with the projection. | The length of a waterproof and dustproof connector can be reduced to decrease its occupation area so as to secure the occupied area of the circuit board for electronic equipment and so as to design the layout of the electronic equipment more freely and so as to downsize the electronic equipment. The connector for electronic equipment includes an approximately cylindrical housing 2 , a support 21 provided in the form of a wall in the housing 2 , a contact terminal 3 and a power terminal 4 supported by the support 21 , a shell 5 mounted inside the housing 2 , and a seal 6 provided along the outer circumference adjacent to the end on the connection terminal inserting side of the housing 2 . Preferably, the seal 6 is welded to the housing 2 and made of a resin softer than the resin of the housing 2.1-7. (canceled) 8. A connector for electronic equipment comprising: an approximately cylindrical housing; a support provided in the form of a wall in the housing; a contact terminal and a power terminal supported by the support; a shell mounted inside the housing; and a seal provided along the outer circumference adjacent to the end on the connection terminal inserting side of the housing. 9. The connector for electronic equipment according to claim 8, wherein the seal is welded to the housing and made of a resin softer than the resin of the housing. 10. The connector for electronic equipment according to claim 8 further comprising an additional seal provided in an innermost recess surrounded by the innermost peripheral wall of the housing and the support. 11. The connector for electronic equipment according to claim 9 further comprising an additional seal provided in an innermost recess surrounded by the innermost peripheral wall of the housing and the support. 12. The connector for electronic equipment according to claim 8, wherein the seal projects from the end on the connection terminal inserting side of the housing to the connection terminal inserting side and can then be brought into press contact with the surface of the connection terminal inserting side of the case in which the housing is placed. 13. The connector for electronic equipment according to claim 12 further comprising an elongated protrusion peripherally projecting adjacent to the end on the connection terminal inserting side of the housing and then contacting with the innermost end of the seal; a projection formed on the innermost surface of the elongated protrusion; and a wedge enabling the housing to be biased to the terminal insertion side by being pushed to the housing side and then contacted with the projection. 14. The connector for electronic equipment according to claim 9 comprising an elongated protrusion peripherally projecting adjacent to the end on the connection terminal inserting side of the housing and then contacting with the innermost end of the seal, wherein an engagement recess is formed on a part of the surface on the connection terminal inserting side of the elongated protrusion and welded to be engaged with the seal, and the seal projects from the end on the connection terminal inserting side of the housing to the connection terminal inserting side and can then be brought into press contact with the surface on the connection terminal inserting side of the case in which the housing is placed. 15. The connection device for electronic equipment, comprising the connector for electronic equipment according to claim 12; and one and the other cases that form the case, wherein the connector includes an elongated protrusion peripherally projecting adjacent to the end on the connection terminal inserting side of the housing and then contacting with the innermost end of the seal, and a projection formed on the innermost surface of the elongated protrusion, one case includes a guide guiding the elongated protrusion to a storage recess toward the connection terminal inserting side along an inclined surface, and the other case includes a wedge enabling the housing to be biased to the terminal insertion side by being pushed to the housing side and then contacted with the projection. | 2,800 |
12,349 | 12,349 | 15,988,296 | 2,841 | Electromagnetic circuit structures and methods are provided for a circuit board that includes a hole disposed through a substrate to provide access to an electrical component, such as a signal trace line (or stripline), that is at least partially encapsulated (e.g., sandwiched) between substrates. The electrical component includes a portion substantially aligned with the hole, and an electrical conductor is disposed within the hole. The electrical conductor is soldered to the portion of the electrical component. | 1. A circuit board, comprising:
a first substrate having a first surface; a second substrate having a second surface; the second surface facing the first surface; a hole disposed through the first substrate; an electrical component disposed adjacent each of the first surface and the second surface, the electrical component being at least partially encapsulated between the first substrate and the second substrate, the electrical component having a portion substantially aligned with the hole; and an electrical conductor disposed within the hole, the electrical conductor having a first terminal end and a second terminal end, the first terminal end soldered to the portion of the electrical component. 2. The circuit board of claim 1 wherein the electrical conductor is a solid wire. 3. The circuit board of claim 1 wherein the electrical component is a signal trace line formed of an electrically conductive material, and the portion substantially aligned with the hole forms a terminal covering to the hole. 4. The circuit board of claim 3 further comprising a second electrical component having a portion soldered to the second terminal end of the electrical conductor. 5. The circuit board of claim 4 wherein the second electrical component is one of a signal terminal, an electrical connector, a cable, and an electromagnetic radiator. 6. The circuit board of claim 5 wherein the second electrical component is surface mounted to a third surface. 7. The circuit board of claim 4 wherein the second electrical component is substantially encapsulated between two substrates. 8. The circuit board of claim 3 further comprising a ground plane disposed adjacent an opposing surface of the second substrate, the ground plane configured to provide an electromagnetic boundary condition to the signal trace line. 9. A method of manufacturing an electromagnetic circuit, the method comprising:
providing a circuit feature upon a surface of at least one of a first substrate or a second substrate; forming a hole in at least one of the first substrate or the second substrate, the hole positioned to substantially align with a portion of the circuit feature; applying solder to at least one of an electrical conductor and the portion of the circuit feature; bonding the first substrate, directly or indirectly, to the second substrate, a bonded orientation of the first substrate and the second substrate being configured to at least partially encapsulate the circuit feature between the first substrate and the second substrate and to substantially align the hole with the portion of the circuit feature, the hole being positioned to provide access to the portion of the circuit feature; inserting the electrical conductor in the hole; and reflowing the solder to form an electrical connection between the electrical conductor and the portion of the circuit feature. 10. The method of claim 9 wherein inserting the electrical conductor in the hole comprises inserting a segment of solid wire into the hole. 11. The method of claim 9 wherein providing the circuit feature upon a surface comprises milling an electrically conductive material from the surface to form the circuit feature. 12. The method of claim 11 wherein milling an electrically conductive material from the surface to form the circuit feature comprises milling the electrically conductive material to form a signal trace line. 13. The method of claim 9 wherein the circuit feature is a first circuit feature and further comprising providing a second circuit feature having a second portion positioned to substantially align with an opposing opening of the hole, and applying solder to form an electrical connection between the electrical conductor and the second portion. 14. The method of claim 13 wherein providing the second circuit feature comprises milling an electrically conductive material to form an electromagnetic radiator. 15. The method of claim 12 wherein providing the second circuit feature comprises milling an electrically conductive material to form a signal terminal pad configured to be coupled to at least one of an electrical connector or an electrical cable. 16. A circuit board, comprising:
a first dielectric substrate bonded directly or indirectly to a second dielectric substrate; a signal trace line formed of an electrically conductive material disposed adjacent an interior surface, the interior surface being between the first dielectric substrate and the second dielectric substrate; a hole disposed through the second dielectric substrate, the hole substantially aligned with a portion of the signal trace line; an electrical conductor disposed within the hole; and a solder joint formed between a first terminal end of the electrical conductor and the portion of the signal trace line. 17. The circuit board of claim 16 wherein the electrical conductor is a segment of solid wire having a loose fit relative to a wall of the hole. 18. The circuit board of claim 16 further comprising an electrical component having a portion soldered to a second terminal end of the electrical conductor, the electrical component being at least one of a signal terminal, an electrical connector, a cable, and an electromagnetic radiator. 19. The circuit board of claim 18 wherein the signal trace line is configured to convey a radio frequency signal to or from the electrical component via the electrical conductor. 20. The circuit board of claim 18 wherein the electrical component is surface mounted to an exterior surface of one of the second dielectric substrate or a further substrate bonded, directly or indirectly, to the second dielectric substrate. | Electromagnetic circuit structures and methods are provided for a circuit board that includes a hole disposed through a substrate to provide access to an electrical component, such as a signal trace line (or stripline), that is at least partially encapsulated (e.g., sandwiched) between substrates. The electrical component includes a portion substantially aligned with the hole, and an electrical conductor is disposed within the hole. The electrical conductor is soldered to the portion of the electrical component.1. A circuit board, comprising:
a first substrate having a first surface; a second substrate having a second surface; the second surface facing the first surface; a hole disposed through the first substrate; an electrical component disposed adjacent each of the first surface and the second surface, the electrical component being at least partially encapsulated between the first substrate and the second substrate, the electrical component having a portion substantially aligned with the hole; and an electrical conductor disposed within the hole, the electrical conductor having a first terminal end and a second terminal end, the first terminal end soldered to the portion of the electrical component. 2. The circuit board of claim 1 wherein the electrical conductor is a solid wire. 3. The circuit board of claim 1 wherein the electrical component is a signal trace line formed of an electrically conductive material, and the portion substantially aligned with the hole forms a terminal covering to the hole. 4. The circuit board of claim 3 further comprising a second electrical component having a portion soldered to the second terminal end of the electrical conductor. 5. The circuit board of claim 4 wherein the second electrical component is one of a signal terminal, an electrical connector, a cable, and an electromagnetic radiator. 6. The circuit board of claim 5 wherein the second electrical component is surface mounted to a third surface. 7. The circuit board of claim 4 wherein the second electrical component is substantially encapsulated between two substrates. 8. The circuit board of claim 3 further comprising a ground plane disposed adjacent an opposing surface of the second substrate, the ground plane configured to provide an electromagnetic boundary condition to the signal trace line. 9. A method of manufacturing an electromagnetic circuit, the method comprising:
providing a circuit feature upon a surface of at least one of a first substrate or a second substrate; forming a hole in at least one of the first substrate or the second substrate, the hole positioned to substantially align with a portion of the circuit feature; applying solder to at least one of an electrical conductor and the portion of the circuit feature; bonding the first substrate, directly or indirectly, to the second substrate, a bonded orientation of the first substrate and the second substrate being configured to at least partially encapsulate the circuit feature between the first substrate and the second substrate and to substantially align the hole with the portion of the circuit feature, the hole being positioned to provide access to the portion of the circuit feature; inserting the electrical conductor in the hole; and reflowing the solder to form an electrical connection between the electrical conductor and the portion of the circuit feature. 10. The method of claim 9 wherein inserting the electrical conductor in the hole comprises inserting a segment of solid wire into the hole. 11. The method of claim 9 wherein providing the circuit feature upon a surface comprises milling an electrically conductive material from the surface to form the circuit feature. 12. The method of claim 11 wherein milling an electrically conductive material from the surface to form the circuit feature comprises milling the electrically conductive material to form a signal trace line. 13. The method of claim 9 wherein the circuit feature is a first circuit feature and further comprising providing a second circuit feature having a second portion positioned to substantially align with an opposing opening of the hole, and applying solder to form an electrical connection between the electrical conductor and the second portion. 14. The method of claim 13 wherein providing the second circuit feature comprises milling an electrically conductive material to form an electromagnetic radiator. 15. The method of claim 12 wherein providing the second circuit feature comprises milling an electrically conductive material to form a signal terminal pad configured to be coupled to at least one of an electrical connector or an electrical cable. 16. A circuit board, comprising:
a first dielectric substrate bonded directly or indirectly to a second dielectric substrate; a signal trace line formed of an electrically conductive material disposed adjacent an interior surface, the interior surface being between the first dielectric substrate and the second dielectric substrate; a hole disposed through the second dielectric substrate, the hole substantially aligned with a portion of the signal trace line; an electrical conductor disposed within the hole; and a solder joint formed between a first terminal end of the electrical conductor and the portion of the signal trace line. 17. The circuit board of claim 16 wherein the electrical conductor is a segment of solid wire having a loose fit relative to a wall of the hole. 18. The circuit board of claim 16 further comprising an electrical component having a portion soldered to a second terminal end of the electrical conductor, the electrical component being at least one of a signal terminal, an electrical connector, a cable, and an electromagnetic radiator. 19. The circuit board of claim 18 wherein the signal trace line is configured to convey a radio frequency signal to or from the electrical component via the electrical conductor. 20. The circuit board of claim 18 wherein the electrical component is surface mounted to an exterior surface of one of the second dielectric substrate or a further substrate bonded, directly or indirectly, to the second dielectric substrate. | 2,800 |
12,350 | 12,350 | 15,039,803 | 2,899 | In a method for forming a tungsten film, a substrate to be processed is disposed in a processing chamber having a reduced pressure atmosphere. Then a reducing gas and a tungsten chloride gas as a tungsten source are supplied to the processing chamber simultaneously or alternately with a process of purging an inside of the processing chamber interposed therebetween. The substrate is heated and the tungsten chloride gas and the reducing gas react with each other on the heated substrate to form a tungsten film. | 1. A tungsten film forming method comprising:
disposing a substrate to be processed in a processing chamber having a reduced pressure atmosphere; supplying a tungsten chloride gas as a tungsten source and a reducing gas into the processing chamber simultaneously or alternately with a process of purging an inside of the processing chamber interposed therebetween; heating the substrate; and forming a tungsten film by causing the tungsten chloride gas and the reducing gas to react with each other on the heated substrate. 2. The tungsten film forming method of claim 1, wherein conditions of a temperature of the substrate and a pressure in the processing chamber are set such that an underlying layer of the tungsten film to be formed is not etched by the tungsten chloride. 3. The tungsten film forming method of claim 1, wherein the tungsten chloride is WCl6. 4. The tungsten film forming method of claim 1, wherein the substrate has a TiN film or a TiSiN film as the underlying layer of the tungsten film. 5. The tungsten film forming method of claim 1, wherein the temperature of the substrate is 400° C. or above, and the pressure in the processing chamber is 5 Torr or above. 6. The tungsten film forming method of claim 1, wherein the temperature of the substrate is 400° C. or above and the pressure in the processing chamber is 10 Torr or above. 7. The tungsten film forming method of claim 1, wherein the temperature of the substrate is 500° C. or above and the pressure in the processing chamber is 5 Torr or above. 8. The tungsten film forming method of claim 1, wherein the reducing gas is at least one of H2 gas, SiH4 gas, B2H6 gas, and NH3 gas. 9. The tungsten film forming method of claim 1, wherein initial film formation is performed by using SiH4 gas or B2H6 gas as the reducing gas and then main film formation is performed by using H2 gas as the reducing gas. 10. A storage medium storing a computer-executable program for controlling a film forming apparatus, wherein the program, when executed on a computer, controls the film forming apparatus to perform a tungsten film forming method comprising: disposing a substrate to be processed in a processing chamber having a reduced pressure atmosphere; supplying a tungsten chloride gas as a tungsten source and a reducing gas into the processing chamber simultaneously or alternately with a process of purging an inside of the processing chamber interposed therebetween; heating the substrate; and forming a tungsten film by causing the tungsten chloride gas and the reducing gas to react with each other on the heated substrate. | In a method for forming a tungsten film, a substrate to be processed is disposed in a processing chamber having a reduced pressure atmosphere. Then a reducing gas and a tungsten chloride gas as a tungsten source are supplied to the processing chamber simultaneously or alternately with a process of purging an inside of the processing chamber interposed therebetween. The substrate is heated and the tungsten chloride gas and the reducing gas react with each other on the heated substrate to form a tungsten film.1. A tungsten film forming method comprising:
disposing a substrate to be processed in a processing chamber having a reduced pressure atmosphere; supplying a tungsten chloride gas as a tungsten source and a reducing gas into the processing chamber simultaneously or alternately with a process of purging an inside of the processing chamber interposed therebetween; heating the substrate; and forming a tungsten film by causing the tungsten chloride gas and the reducing gas to react with each other on the heated substrate. 2. The tungsten film forming method of claim 1, wherein conditions of a temperature of the substrate and a pressure in the processing chamber are set such that an underlying layer of the tungsten film to be formed is not etched by the tungsten chloride. 3. The tungsten film forming method of claim 1, wherein the tungsten chloride is WCl6. 4. The tungsten film forming method of claim 1, wherein the substrate has a TiN film or a TiSiN film as the underlying layer of the tungsten film. 5. The tungsten film forming method of claim 1, wherein the temperature of the substrate is 400° C. or above, and the pressure in the processing chamber is 5 Torr or above. 6. The tungsten film forming method of claim 1, wherein the temperature of the substrate is 400° C. or above and the pressure in the processing chamber is 10 Torr or above. 7. The tungsten film forming method of claim 1, wherein the temperature of the substrate is 500° C. or above and the pressure in the processing chamber is 5 Torr or above. 8. The tungsten film forming method of claim 1, wherein the reducing gas is at least one of H2 gas, SiH4 gas, B2H6 gas, and NH3 gas. 9. The tungsten film forming method of claim 1, wherein initial film formation is performed by using SiH4 gas or B2H6 gas as the reducing gas and then main film formation is performed by using H2 gas as the reducing gas. 10. A storage medium storing a computer-executable program for controlling a film forming apparatus, wherein the program, when executed on a computer, controls the film forming apparatus to perform a tungsten film forming method comprising: disposing a substrate to be processed in a processing chamber having a reduced pressure atmosphere; supplying a tungsten chloride gas as a tungsten source and a reducing gas into the processing chamber simultaneously or alternately with a process of purging an inside of the processing chamber interposed therebetween; heating the substrate; and forming a tungsten film by causing the tungsten chloride gas and the reducing gas to react with each other on the heated substrate. | 2,800 |
12,351 | 12,351 | 16,512,989 | 2,853 | A printing machine includes an inkjet printing head having separately controllable nozzles for applying ink to a transported printing material, a radiation drier having radiation sources for generating electromagnetic radiation to at least partly dry and/or cure the applied ink on the transported printing material and at least one light trap disposed between the inkjet printing head and the radiation drier in such a way that the light trap forms a barrier for reflected and/or scattered radiation, thus protecting the inkjet printing head from radiation. The light trap includes at least one channel connected to an aspiration device for aspirating contaminated ambient air through the channel and reducing or preventing contamination of the radiation drier. | 1. A printing machine, comprising:
an inkjet printing head including separately controllable nozzles for applying ink to a transported printing material; a radiation drier including radiation sources for generating electromagnetic radiation to at least partly carry out at least one of drying or curing of the applied ink on the transported printing material; an aspiration device; and at least one light trap disposed between said inkjet printing head and said radiation drier, said at least one light trap forming a barrier for at least one of reflected or scattered radiation to protect said inkjet printing head from radiation, said at least one light trap having at least one channel connected to said aspiration device for aspirating contaminated ambient air through said at least one channel. 2. The printing machine according to claim 1, wherein said at least one channel is a through-hole. 3. The printing machine according to claim 1, which further comprises a frame disposed on said radiation drier, said at least one light trap being disposed on said frame. 4. The printing machine according to claim 1, wherein:
said at least one channel is a first channel; said at least one light trap includes a second channel; and said second channel is disposed between said first channel and said aspiration device for guiding the aspirated ambient air from said first channel into said second channel and from said second channel to said aspiration device. 5. The printing machine according to claim 3, wherein:
said at least one channel is a first channel; said frame includes a second channel or said at least one light trap and said frame form a second channel; and said second channel is disposed between said first channel and said aspiration device for guiding the aspirated ambient air from said first channel to said second channel and from said second channel to said aspiration device. 6. The printing machine according to claim 3, wherein:
said frame includes a coupling of said aspiration device; said coupling includes a first coupling element and a second coupling element; and said first coupling element being configured to be coupled to said second coupling element by a lowering motion of said radiation drier and said first coupling element being configured to be uncoupled from said second coupling element by a lifting motion of said radiation drier. 7. The printing machine according to claim 3, wherein said at least one light trap is configured to be disassembled from said radiation drier together with said frame. 8. The printing machine according to claim 3, which further comprises a plate being transparent to the radiation and being disposed on said frame. 9. The printing machine according to claim 8, wherein:
said at least one light trap is a first light trap disposed upstream of said plate in a transport direction of the printing material; and a second light trap is disposed downstream of said plate. 10. The printing machine according to claim 9, which further comprises one additional aspiration channel disposed upstream of said first light trap in the printing material transport direction, and another additional aspiration channel disposed downstream of said second light trap in the printing material transport direction. 11. The printing machine according to claim 1, wherein said radiation drier is an LED drier generating UV radiation. 12. The printing machine according to claim 11, wherein said radiation drier is an intermediate drier for pinning UV-curable ink. | A printing machine includes an inkjet printing head having separately controllable nozzles for applying ink to a transported printing material, a radiation drier having radiation sources for generating electromagnetic radiation to at least partly dry and/or cure the applied ink on the transported printing material and at least one light trap disposed between the inkjet printing head and the radiation drier in such a way that the light trap forms a barrier for reflected and/or scattered radiation, thus protecting the inkjet printing head from radiation. The light trap includes at least one channel connected to an aspiration device for aspirating contaminated ambient air through the channel and reducing or preventing contamination of the radiation drier.1. A printing machine, comprising:
an inkjet printing head including separately controllable nozzles for applying ink to a transported printing material; a radiation drier including radiation sources for generating electromagnetic radiation to at least partly carry out at least one of drying or curing of the applied ink on the transported printing material; an aspiration device; and at least one light trap disposed between said inkjet printing head and said radiation drier, said at least one light trap forming a barrier for at least one of reflected or scattered radiation to protect said inkjet printing head from radiation, said at least one light trap having at least one channel connected to said aspiration device for aspirating contaminated ambient air through said at least one channel. 2. The printing machine according to claim 1, wherein said at least one channel is a through-hole. 3. The printing machine according to claim 1, which further comprises a frame disposed on said radiation drier, said at least one light trap being disposed on said frame. 4. The printing machine according to claim 1, wherein:
said at least one channel is a first channel; said at least one light trap includes a second channel; and said second channel is disposed between said first channel and said aspiration device for guiding the aspirated ambient air from said first channel into said second channel and from said second channel to said aspiration device. 5. The printing machine according to claim 3, wherein:
said at least one channel is a first channel; said frame includes a second channel or said at least one light trap and said frame form a second channel; and said second channel is disposed between said first channel and said aspiration device for guiding the aspirated ambient air from said first channel to said second channel and from said second channel to said aspiration device. 6. The printing machine according to claim 3, wherein:
said frame includes a coupling of said aspiration device; said coupling includes a first coupling element and a second coupling element; and said first coupling element being configured to be coupled to said second coupling element by a lowering motion of said radiation drier and said first coupling element being configured to be uncoupled from said second coupling element by a lifting motion of said radiation drier. 7. The printing machine according to claim 3, wherein said at least one light trap is configured to be disassembled from said radiation drier together with said frame. 8. The printing machine according to claim 3, which further comprises a plate being transparent to the radiation and being disposed on said frame. 9. The printing machine according to claim 8, wherein:
said at least one light trap is a first light trap disposed upstream of said plate in a transport direction of the printing material; and a second light trap is disposed downstream of said plate. 10. The printing machine according to claim 9, which further comprises one additional aspiration channel disposed upstream of said first light trap in the printing material transport direction, and another additional aspiration channel disposed downstream of said second light trap in the printing material transport direction. 11. The printing machine according to claim 1, wherein said radiation drier is an LED drier generating UV radiation. 12. The printing machine according to claim 11, wherein said radiation drier is an intermediate drier for pinning UV-curable ink. | 2,800 |
12,352 | 12,352 | 16,117,193 | 2,875 | A method of forming and an apparatus that may include an amorphous metal shell having a visible surface and an opposed back surface, and a thermally conductive plastic member secured to the back surface. The apparatus may be a door handle for a vehicle. The apparatus may be formed by molding an amorphous metal shell having a visible surface and an opposed back surface, and molding a thermally conductive plastic member to the back surface. | 1. An apparatus comprising:
an amorphous metal shell having a visible surface and an opposed back surface; and a thermally conductive plastic member secured to the back surface. 2. The apparatus of claim 1 further including a heating element, connectable to an electric source, extending through the plastic member. 3. The apparatus of claim 2 wherein the amorphous metal shell and the plastic member form a pivotable door handle. 4. The apparatus of claim 1 further including a light emitting diode secured within the plastic member. 5. The apparatus of claim 4 further including a light optic mounted adjacent to the light emitting diode and configured to direct light emanating from the plastic member. 6. The apparatus of claim 4 wherein the amorphous metal shell and the plastic member form a pivotable door handle. 7. The apparatus of claim 6 further including a second light emitting diode secured within the plastic member, spaced from the light emitting diode, and oriented to project light in a different direction from the light emitting diode. 8. The apparatus of claim 6 wherein the pivotable door handle is part of an exterior door handle assembly on a vehicle. 9. The apparatus of claim 6 wherein the pivotable door handle is mounted to structure in a vehicle interior. 10. A method for forming an apparatus comprising:
molding an amorphous metal shell having a visible surface and an opposed back surface; and molding a thermally conductive plastic member to the back surface. 11. The method of claim 10 wherein the plastic member is second shot molded to the amorphous metal shell. 12. The method of claim 10 wherein the back surface is molded with a rough grain. 13. The method of claim 10 further comprising, molding the plastic member around a heating element. 14. The method of claim 10 further comprising, insert molding a light emitting diode into the plastic member. 15. The method of claim 14 further comprising, molding optics to the plastic member over the light emitting diode. | A method of forming and an apparatus that may include an amorphous metal shell having a visible surface and an opposed back surface, and a thermally conductive plastic member secured to the back surface. The apparatus may be a door handle for a vehicle. The apparatus may be formed by molding an amorphous metal shell having a visible surface and an opposed back surface, and molding a thermally conductive plastic member to the back surface.1. An apparatus comprising:
an amorphous metal shell having a visible surface and an opposed back surface; and a thermally conductive plastic member secured to the back surface. 2. The apparatus of claim 1 further including a heating element, connectable to an electric source, extending through the plastic member. 3. The apparatus of claim 2 wherein the amorphous metal shell and the plastic member form a pivotable door handle. 4. The apparatus of claim 1 further including a light emitting diode secured within the plastic member. 5. The apparatus of claim 4 further including a light optic mounted adjacent to the light emitting diode and configured to direct light emanating from the plastic member. 6. The apparatus of claim 4 wherein the amorphous metal shell and the plastic member form a pivotable door handle. 7. The apparatus of claim 6 further including a second light emitting diode secured within the plastic member, spaced from the light emitting diode, and oriented to project light in a different direction from the light emitting diode. 8. The apparatus of claim 6 wherein the pivotable door handle is part of an exterior door handle assembly on a vehicle. 9. The apparatus of claim 6 wherein the pivotable door handle is mounted to structure in a vehicle interior. 10. A method for forming an apparatus comprising:
molding an amorphous metal shell having a visible surface and an opposed back surface; and molding a thermally conductive plastic member to the back surface. 11. The method of claim 10 wherein the plastic member is second shot molded to the amorphous metal shell. 12. The method of claim 10 wherein the back surface is molded with a rough grain. 13. The method of claim 10 further comprising, molding the plastic member around a heating element. 14. The method of claim 10 further comprising, insert molding a light emitting diode into the plastic member. 15. The method of claim 14 further comprising, molding optics to the plastic member over the light emitting diode. | 2,800 |
12,353 | 12,353 | 15,649,228 | 2,837 | One object is to suppress thermal shrinkage of a cover resin layer at the time of thermal curing. A laminated coil according to one embodiment of the present invention is provided with a magnetic substrate formed of a sintered magnetic material, an insulation resin layer formed on the magnetic substrate, a cover resin layer formed on the insulation resin layer, and a coil conductor embedded in the insulation resin layer. In one embodiment of the present invention, said insulation resin layer includes a first resin and first filler particles, and said cover resin layer includes a second resin and second filler particles. A filling factor of the second filler particles in the cover resin layer is higher than a filling factor of the first filler particles in the insulation resin layer. | 1. A laminated coil, comprising:
a magnetic substrate formed of a sintered magnetic material; an insulation resin layer formed on the magnetic substrate and including a first resin and first filler particles; a cover resin layer formed on the insulation resin layer and including a second resin and second filler particles; and a coil conductor embedded in the insulation resin layer, wherein a filling factor of the second filler particles in the cover resin layer is higher than a filling factor of the first filler particles in the insulation resin layer. 2. The laminated coil according to claim 1, wherein the second filler particles in the cover resin layer are a magnetic material, and a filling factor of the second filler particles in the cover resin layer is not less than 70 vol %. 3. The laminated coil according to claim 1, wherein the first filler particles have a spherical shape. 4. The laminated coil according to claim 1, wherein the first filler particles are formed in a flattened shape. 5. The laminated coil according to claim 1, wherein the second filler particles have a spherical shape. 6. The laminated coil according to claim 1, wherein the second filler particles are formed in a flattened shape. 7. The laminated coil according to claim 1, wherein the second filler particles are metal magnetic particles. 8. A laminated coil, comprising:
a magnetic substrate formed of a sintered magnetic material; an insulation resin layer formed on the magnetic substrate and including a first resin; a cover resin layer formed on the insulation resin layer and including a second resin and filler particles; and a coil conductor embedded in the insulation resin layer, wherein the insulation resin layer includes no filler particles, and the filler particles included in the cover resin layer are metal magnetic particles. 9. The laminated coil according to claim 8, wherein a filling factor of the filler particles in the cover resin layer is not less than 80 vol %. 10. The laminated coil according to claim 8, wherein the filler particles have a spherical shape. 11. The laminated coil according to claim 8, wherein the filler particles are formed in a flattened shape. 12. The laminated coil according to claim 1, further comprising:
an external electrode; and an extraction conductor configured to connect the external electrode to the coil conductor. 13. The laminated coil according to claim 1, wherein the laminated coil is formed as a common mode coil. | One object is to suppress thermal shrinkage of a cover resin layer at the time of thermal curing. A laminated coil according to one embodiment of the present invention is provided with a magnetic substrate formed of a sintered magnetic material, an insulation resin layer formed on the magnetic substrate, a cover resin layer formed on the insulation resin layer, and a coil conductor embedded in the insulation resin layer. In one embodiment of the present invention, said insulation resin layer includes a first resin and first filler particles, and said cover resin layer includes a second resin and second filler particles. A filling factor of the second filler particles in the cover resin layer is higher than a filling factor of the first filler particles in the insulation resin layer.1. A laminated coil, comprising:
a magnetic substrate formed of a sintered magnetic material; an insulation resin layer formed on the magnetic substrate and including a first resin and first filler particles; a cover resin layer formed on the insulation resin layer and including a second resin and second filler particles; and a coil conductor embedded in the insulation resin layer, wherein a filling factor of the second filler particles in the cover resin layer is higher than a filling factor of the first filler particles in the insulation resin layer. 2. The laminated coil according to claim 1, wherein the second filler particles in the cover resin layer are a magnetic material, and a filling factor of the second filler particles in the cover resin layer is not less than 70 vol %. 3. The laminated coil according to claim 1, wherein the first filler particles have a spherical shape. 4. The laminated coil according to claim 1, wherein the first filler particles are formed in a flattened shape. 5. The laminated coil according to claim 1, wherein the second filler particles have a spherical shape. 6. The laminated coil according to claim 1, wherein the second filler particles are formed in a flattened shape. 7. The laminated coil according to claim 1, wherein the second filler particles are metal magnetic particles. 8. A laminated coil, comprising:
a magnetic substrate formed of a sintered magnetic material; an insulation resin layer formed on the magnetic substrate and including a first resin; a cover resin layer formed on the insulation resin layer and including a second resin and filler particles; and a coil conductor embedded in the insulation resin layer, wherein the insulation resin layer includes no filler particles, and the filler particles included in the cover resin layer are metal magnetic particles. 9. The laminated coil according to claim 8, wherein a filling factor of the filler particles in the cover resin layer is not less than 80 vol %. 10. The laminated coil according to claim 8, wherein the filler particles have a spherical shape. 11. The laminated coil according to claim 8, wherein the filler particles are formed in a flattened shape. 12. The laminated coil according to claim 1, further comprising:
an external electrode; and an extraction conductor configured to connect the external electrode to the coil conductor. 13. The laminated coil according to claim 1, wherein the laminated coil is formed as a common mode coil. | 2,800 |
12,354 | 12,354 | 16,256,454 | 2,833 | A lighting device contains a first circuit board and a second circuit board. The first circuit board has one or more connecting sections having overall at least two contact areas. The second circuit board has an opening through which the connecting section of the first circuit board can extend. At least two contact elements, which are electrically connected to conductive tracks of the second circuit board, are arranged on the second circuit board. Each contact element has a contact region by which the contact element butts against one of the contact areas of the first circuit board. As a result, an electrical connection is produced between the two circuit boards. | 1. A lighting device comprising:
a first circuit board; and a second circuit board, wherein the first circuit board has one or more connecting sections, the one or more connecting sections having overall a plurality of contact areas, wherein the second circuit board has a plurality of contact elements, the plurality of contact elements are electrically connected to conductive tracks of the second circuit board, wherein each contact element has a contact region by which the contact element butts against one of the contact areas of the first circuit board. 2. The lighting device according to claim 1, wherein the first circuit board has precisely one connecting section with the plurality of contact areas. 3. The lighting device according to claim 1, wherein the second circuit board has one or more openings, the first circuit board and the second circuit board are arranged so that the one or more connecting sections of the first circuit board extends through the opening of the second circuit board. 4. The lighting device according to claim 1, wherein the plurality of contact areas are arranged on opposite surfaces of the first circuit board. 5. The lighting device according to claim 3, wherein the plurality of contact elements are arranged on opposite sides of the opening. 6. The lighting device according to claim 3, wherein the first circuit board is located substantially on a first side of the second circuit board, wherein the contact elements are arranged on a second side of the second circuit board. 7. The lighting device according to claim 1, wherein the at least one of the plurality of contact elements are elastic. 8. The lighting device according to claim 1, wherein the at least one of the plurality of contact elements apply pressure against at least one of the plurality of contact areas. 9. The lighting device according to claim 1, wherein at least one of the plurality of contact elements has a strip of electrically conductive material. 10. The lighting device according to claim 9, wherein at least one of the plurality of contact elements has a fastening region, the fastening region is electrically conductively connected to the contact element and a conductive track of the second circuit board. 11. The lighting device according to claim 10, wherein the fastening region and the contact region are arranged at an angle greater than 0 degrees. 12. The lighting device according to claim 1, wherein the plurality of contact elements are electrically conductively connected by soldering to the conductive tracks of the second circuit board. | A lighting device contains a first circuit board and a second circuit board. The first circuit board has one or more connecting sections having overall at least two contact areas. The second circuit board has an opening through which the connecting section of the first circuit board can extend. At least two contact elements, which are electrically connected to conductive tracks of the second circuit board, are arranged on the second circuit board. Each contact element has a contact region by which the contact element butts against one of the contact areas of the first circuit board. As a result, an electrical connection is produced between the two circuit boards.1. A lighting device comprising:
a first circuit board; and a second circuit board, wherein the first circuit board has one or more connecting sections, the one or more connecting sections having overall a plurality of contact areas, wherein the second circuit board has a plurality of contact elements, the plurality of contact elements are electrically connected to conductive tracks of the second circuit board, wherein each contact element has a contact region by which the contact element butts against one of the contact areas of the first circuit board. 2. The lighting device according to claim 1, wherein the first circuit board has precisely one connecting section with the plurality of contact areas. 3. The lighting device according to claim 1, wherein the second circuit board has one or more openings, the first circuit board and the second circuit board are arranged so that the one or more connecting sections of the first circuit board extends through the opening of the second circuit board. 4. The lighting device according to claim 1, wherein the plurality of contact areas are arranged on opposite surfaces of the first circuit board. 5. The lighting device according to claim 3, wherein the plurality of contact elements are arranged on opposite sides of the opening. 6. The lighting device according to claim 3, wherein the first circuit board is located substantially on a first side of the second circuit board, wherein the contact elements are arranged on a second side of the second circuit board. 7. The lighting device according to claim 1, wherein the at least one of the plurality of contact elements are elastic. 8. The lighting device according to claim 1, wherein the at least one of the plurality of contact elements apply pressure against at least one of the plurality of contact areas. 9. The lighting device according to claim 1, wherein at least one of the plurality of contact elements has a strip of electrically conductive material. 10. The lighting device according to claim 9, wherein at least one of the plurality of contact elements has a fastening region, the fastening region is electrically conductively connected to the contact element and a conductive track of the second circuit board. 11. The lighting device according to claim 10, wherein the fastening region and the contact region are arranged at an angle greater than 0 degrees. 12. The lighting device according to claim 1, wherein the plurality of contact elements are electrically conductively connected by soldering to the conductive tracks of the second circuit board. | 2,800 |
12,355 | 12,355 | 15,597,259 | 2,877 | An electronic device is for identifying the plastic composition of an unknown plastic object. The electronic device may include a spectrometer configured to receive the unknown plastic object and generate a MIR reflectance spectra characteristic of the unknown plastic object, a memory configured to store a multi-spectral fingerprint library for plastic types, and a processor coupled to the spectrometer and the memory. The processor is configured to analyze in real-time the MIR reflectance spectra characteristic of the unknown plastic object, and identify the plastic composition based upon at least comparing the MIR reflectance spectra characteristic of the unknown plastic object to the multi-spectral fingerprint library. The processor may be configured to expand the fingerprint library upon initial baseline characterization. | 1. An electronic device for identifying the plastic composition of an unknown plastic object, the electronic device comprising:
a spectrometer configured to receive the unknown plastic object and generate at least one mid-infrared (MIR) reflectance spectra characteristic of the unknown plastic object; a memory configured to store a multi-spectral fingerprint library for a plurality of plastic types; and a processor coupled to said spectrometer and said memory and configured to
analyze in real-time the at least one MIR reflectance spectra characteristic of the unknown plastic object, and
identify the plastic composition based upon at least comparing the at least one MIR reflectance spectra characteristic of the unknown plastic object to the multi-spectral fingerprint library. 2. The electronic device of claim 1 wherein said processor is configured to identify the plastic composition when the at least one MIR reflectance spectra characteristic of the unknown plastic object matches a respective reflectance spectra characteristic in the multi-spectral fingerprint library. 3. The electronic device of claim 1 further comprising an infrared source configured to irradiate the unknown plastic object. 4. The electronic device of claim 3 wherein said infrared source comprises at least one of a tungsten filament source and a globar source. 5. The electronic device of claim 1 wherein each reflectance spectra characteristic in the multi-spectral fingerprint library comprises at least one spectral peak and at least one spectral valley. 6. The electronic device of claim 5 wherein each reflectance spectra characteristic in the multi-spectral fingerprint library comprises at least one standard deviation value for the at least one spectral peak and the at least one spectral valley. 7. The electronic device of claim 5 wherein said processor is configured to identify the plastic composition when the at least one MIR reflectance spectra characteristic of the unknown plastic object matches each spectral peak and spectral valley of a respective reflectance spectra characteristic in the multi-spectral fingerprint library. 8. The electronic device of claim 1 wherein the plurality of plastic types comprises Polyethylene Terephthalate (PET), High Density Polyethylene (HDPE), Polyvinyl Chloride (PVC), Low Density Polyethylene (LDPE), Polypropylene (PP), Polystyrene (PS), Polycarbonate (PC), Acrylic, Nylon, Polyoxymethylene (POM), Acrylonitrile Butadiene Styrene (ABS), and Polytetrafluoroethylene (PTFE). 9. An electronic device for identifying the plastic composition of an unknown plastic object, the electronic device comprising:
a spectrometer configured to receive the unknown plastic object and generate at least one mid-infrared (MIR) reflectance spectra characteristic of the unknown plastic object; an infrared source configured to irradiate the unknown plastic object; a memory configured to store a multi-spectral fingerprint library for a plurality of plastic types; and a processor coupled to said spectrometer, said infrared source, and said memory and configured to
analyze in real-time the at least one MIR reflectance spectra characteristic of the unknown plastic object, and
identify the plastic composition based upon at least when the at least one MIR reflectance spectra characteristic of the unknown plastic object matches a respective reflectance spectra characteristic in the multi-spectral fingerprint library, each reflectance spectra characteristic in the multi-spectral fingerprint library comprising at least one spectral peak and at least one spectral valley. 10. The electronic device of claim 9 wherein each reflectance spectra characteristic in the multi-spectral fingerprint library comprises at least one standard deviation value for the at least one spectral peak and the at least one spectral valley. 11. The electronic device of claim 9 wherein said processor is configured to identify the plastic composition when the at least one MIR reflectance spectra characteristic of the unknown plastic object matches each spectral peak and spectral valley of a respective reflectance spectra characteristic in the multi-spectral fingerprint library. 12. The electronic device of claim 9 wherein the plurality of plastic types comprises Polyethylene Terephthalate (PET), High Density Polyethylene (HDPE), Polyvinyl Chloride (PVC), Low Density Polyethylene (LDPE), Polypropylene (PP), Polystyrene (PS), Polycarbonate (PC), Acrylic, Nylon, Polyoxymethylene (POM), Acrylonitrile Butadiene Styrene (ABS), and Polytetrafluoroethylene (PTFE). 13. The electronic device of claim 9 wherein said infrared source comprises at least one of a tungsten filament source and a globar source. 14. A method for identifying the plastic composition of an unknown plastic object, the method comprising:
operating a spectrometer to receive the unknown plastic object and generate at least one mid-infrared (MIR) reflectance spectra characteristic of the unknown plastic object; operating a memory to store a multi-spectral fingerprint library for a plurality of plastic types; and operating a processor coupled to the spectrometer and the memory and to
analyze in real-time the at least one MIR reflectance spectra characteristic of the unknown plastic object, and
identify the plastic composition based upon at least comparing the at least one MIR reflectance spectra characteristic of the unknown plastic object to the multi-spectral fingerprint library. 15. The method of claim 14 further comprising operating the processor to identify the plastic composition when the at least one MIR reflectance spectra characteristic of the unknown plastic object matches a respective reflectance spectra characteristic in the multi-spectral fingerprint library. 16. The method of claim 14 further comprising operating an infrared source to irradiate the unknown plastic object. 17. The method of claim 14 wherein each reflectance spectra characteristic in the multi-spectral fingerprint library comprises at least one spectral peak and at least one spectral valley. 18. The method of claim 14 wherein each reflectance spectra characteristic in the multi-spectral fingerprint library comprises at least one standard deviation value for the at least one spectral peak and the at least one spectral valley. 19. The method of claim 14 further comprising operating the processor to identify the plastic composition when the at least one MIR reflectance spectra characteristic of the unknown plastic object matches each spectral peak and spectral valley of a respective reflectance spectra characteristic in the multi-spectral fingerprint library. 20. The method of claim 14 wherein the plurality of plastic types comprises Polyethylene Terephthalate (PET), High Density Polyethylene (HDPE), Polyvinyl Chloride (PVC), Low Density Polyethylene (LDPE), Polypropylene (PP), Polystyrene (PS), Polycarbonate (PC), Acrylic, Nylon, Polyoxymethylene (POM), Acrylonitrile Butadiene Styrene (ABS), and Polytetrafluoroethylene (PTFE). | An electronic device is for identifying the plastic composition of an unknown plastic object. The electronic device may include a spectrometer configured to receive the unknown plastic object and generate a MIR reflectance spectra characteristic of the unknown plastic object, a memory configured to store a multi-spectral fingerprint library for plastic types, and a processor coupled to the spectrometer and the memory. The processor is configured to analyze in real-time the MIR reflectance spectra characteristic of the unknown plastic object, and identify the plastic composition based upon at least comparing the MIR reflectance spectra characteristic of the unknown plastic object to the multi-spectral fingerprint library. The processor may be configured to expand the fingerprint library upon initial baseline characterization.1. An electronic device for identifying the plastic composition of an unknown plastic object, the electronic device comprising:
a spectrometer configured to receive the unknown plastic object and generate at least one mid-infrared (MIR) reflectance spectra characteristic of the unknown plastic object; a memory configured to store a multi-spectral fingerprint library for a plurality of plastic types; and a processor coupled to said spectrometer and said memory and configured to
analyze in real-time the at least one MIR reflectance spectra characteristic of the unknown plastic object, and
identify the plastic composition based upon at least comparing the at least one MIR reflectance spectra characteristic of the unknown plastic object to the multi-spectral fingerprint library. 2. The electronic device of claim 1 wherein said processor is configured to identify the plastic composition when the at least one MIR reflectance spectra characteristic of the unknown plastic object matches a respective reflectance spectra characteristic in the multi-spectral fingerprint library. 3. The electronic device of claim 1 further comprising an infrared source configured to irradiate the unknown plastic object. 4. The electronic device of claim 3 wherein said infrared source comprises at least one of a tungsten filament source and a globar source. 5. The electronic device of claim 1 wherein each reflectance spectra characteristic in the multi-spectral fingerprint library comprises at least one spectral peak and at least one spectral valley. 6. The electronic device of claim 5 wherein each reflectance spectra characteristic in the multi-spectral fingerprint library comprises at least one standard deviation value for the at least one spectral peak and the at least one spectral valley. 7. The electronic device of claim 5 wherein said processor is configured to identify the plastic composition when the at least one MIR reflectance spectra characteristic of the unknown plastic object matches each spectral peak and spectral valley of a respective reflectance spectra characteristic in the multi-spectral fingerprint library. 8. The electronic device of claim 1 wherein the plurality of plastic types comprises Polyethylene Terephthalate (PET), High Density Polyethylene (HDPE), Polyvinyl Chloride (PVC), Low Density Polyethylene (LDPE), Polypropylene (PP), Polystyrene (PS), Polycarbonate (PC), Acrylic, Nylon, Polyoxymethylene (POM), Acrylonitrile Butadiene Styrene (ABS), and Polytetrafluoroethylene (PTFE). 9. An electronic device for identifying the plastic composition of an unknown plastic object, the electronic device comprising:
a spectrometer configured to receive the unknown plastic object and generate at least one mid-infrared (MIR) reflectance spectra characteristic of the unknown plastic object; an infrared source configured to irradiate the unknown plastic object; a memory configured to store a multi-spectral fingerprint library for a plurality of plastic types; and a processor coupled to said spectrometer, said infrared source, and said memory and configured to
analyze in real-time the at least one MIR reflectance spectra characteristic of the unknown plastic object, and
identify the plastic composition based upon at least when the at least one MIR reflectance spectra characteristic of the unknown plastic object matches a respective reflectance spectra characteristic in the multi-spectral fingerprint library, each reflectance spectra characteristic in the multi-spectral fingerprint library comprising at least one spectral peak and at least one spectral valley. 10. The electronic device of claim 9 wherein each reflectance spectra characteristic in the multi-spectral fingerprint library comprises at least one standard deviation value for the at least one spectral peak and the at least one spectral valley. 11. The electronic device of claim 9 wherein said processor is configured to identify the plastic composition when the at least one MIR reflectance spectra characteristic of the unknown plastic object matches each spectral peak and spectral valley of a respective reflectance spectra characteristic in the multi-spectral fingerprint library. 12. The electronic device of claim 9 wherein the plurality of plastic types comprises Polyethylene Terephthalate (PET), High Density Polyethylene (HDPE), Polyvinyl Chloride (PVC), Low Density Polyethylene (LDPE), Polypropylene (PP), Polystyrene (PS), Polycarbonate (PC), Acrylic, Nylon, Polyoxymethylene (POM), Acrylonitrile Butadiene Styrene (ABS), and Polytetrafluoroethylene (PTFE). 13. The electronic device of claim 9 wherein said infrared source comprises at least one of a tungsten filament source and a globar source. 14. A method for identifying the plastic composition of an unknown plastic object, the method comprising:
operating a spectrometer to receive the unknown plastic object and generate at least one mid-infrared (MIR) reflectance spectra characteristic of the unknown plastic object; operating a memory to store a multi-spectral fingerprint library for a plurality of plastic types; and operating a processor coupled to the spectrometer and the memory and to
analyze in real-time the at least one MIR reflectance spectra characteristic of the unknown plastic object, and
identify the plastic composition based upon at least comparing the at least one MIR reflectance spectra characteristic of the unknown plastic object to the multi-spectral fingerprint library. 15. The method of claim 14 further comprising operating the processor to identify the plastic composition when the at least one MIR reflectance spectra characteristic of the unknown plastic object matches a respective reflectance spectra characteristic in the multi-spectral fingerprint library. 16. The method of claim 14 further comprising operating an infrared source to irradiate the unknown plastic object. 17. The method of claim 14 wherein each reflectance spectra characteristic in the multi-spectral fingerprint library comprises at least one spectral peak and at least one spectral valley. 18. The method of claim 14 wherein each reflectance spectra characteristic in the multi-spectral fingerprint library comprises at least one standard deviation value for the at least one spectral peak and the at least one spectral valley. 19. The method of claim 14 further comprising operating the processor to identify the plastic composition when the at least one MIR reflectance spectra characteristic of the unknown plastic object matches each spectral peak and spectral valley of a respective reflectance spectra characteristic in the multi-spectral fingerprint library. 20. The method of claim 14 wherein the plurality of plastic types comprises Polyethylene Terephthalate (PET), High Density Polyethylene (HDPE), Polyvinyl Chloride (PVC), Low Density Polyethylene (LDPE), Polypropylene (PP), Polystyrene (PS), Polycarbonate (PC), Acrylic, Nylon, Polyoxymethylene (POM), Acrylonitrile Butadiene Styrene (ABS), and Polytetrafluoroethylene (PTFE). | 2,800 |
12,356 | 12,356 | 16,237,211 | 2,861 | Embodiments include a method for performing downhole optical fluid analysis including positioning an optical analysis tool in a downhole environment. The method also includes regulating a flow of a fluid sample into a reaction chamber of the optical analysis tool. The method further includes providing a catalyst within the reaction chamber that reacts with an analyte in the fluid sample to emit light. The method includes detecting the emitted light. | 1. A method for performing downhole optical fluid analysis, comprising:
positioning an optical analysis tool in a downhole environment; regulating a flow of a fluid sample into a reaction chamber of the optical analysis tool; providing a catalyst within the reaction chamber that reacts with an analyte in the fluid sample to emit light; and detecting the emitted light. 2. The method of claim 1, further comprising:
electrically coupling a power supply to the catalyst; and heating the catalyst via the power supply. 3. The method of claim 1, further comprising:
intermittently heating the catalyst to raise a temperature of the catalyst for a period of time. 4. The method of claim 1, further comprising:
positioning a light detector within the reaction chamber. 5. The method of claim 1, further comprising:
positioning a light detector external to the reaction chamber. 6. The method of claim 1, further comprising:
coupling an oxygen tank to the reaction chamber; and releasing oxygen into the reaction chamber when an oxygen content within the reaction chamber falls below a threshold. 7. A method for performing downhole optical fluid analysis, comprising:
positioning an optical analysis tool in a downhole environment on a tool string, the optical analysis tool comprising a reaction chamber containing oxygen; injecting a predetermined amount of a fluid sample, withdrawn from a downhole formation, into the reaction chamber; detecting a first signal when the catalyst is at a first temperature; heating a catalyst within the reaction chamber; detecting a second signal when the catalyst is at a second temperature, the second temperature being greater than the first temperature; and determining an analyte within the fluid sample, based at least in part on a difference between the first signal and the second signal. 8. The method of claim 7, further comprising:
arranging a carrier within a housing; coating at least a portion the carrier with the catalyst; and thermally coupling the carrier to a power supply, the power supply transmitting energy to the carrier to heat the catalyst. 9. The method of claim 7, wherein the catalyst comprises a plurality of catalysts and each catalyst of the plurality of catalysts is particularly selected to react to a different analyte. 10. The method of claim 7, further comprising:
arranging a regulator at an inlet of the reaction chamber, the regulator controlling the predetermined amount of the fluid sample entering the reaction chamber. 11. The method of claim 7, wherein heating the catalyst comprises applying heat energy to the catalyst intermittently such that the catalyst is heated for a first period of time and not heated for a second period of time. 12. The method of claim 7, wherein the first signal and the second signal are both light, and further comprising:
installing a light detector within an interior of the reaction chamber for detecting the first signal and the second signal. 13. The method of claim 7, wherein the first signal and the second signal are both light, and further comprising:
installing a light detector exterior to the reaction chamber for detecting the first signal and the second signal. 14. The method of claim 7, further comprising:
adding oxygen to the reaction chamber at a predetermined time, the oxygen replacing oxygen that has been displaced by the fluid sample. 15. The method of claim 7, further comprising:
directing the fluid sample out of the reaction chamber, via an outlet, after a predetermined period of time. 16. A system for performing a downhole optical analysis, the system comprising:
a housing positioned in a wellbore extending into a formation; a carrier arranged within the housing, the carrier being coupled to a power supply; a catalyst coating at least a portion of the carrier; a regulated inlet providing a fluid pathway into a reaction chamber that includes at least a portion of the catalyst; and a detector arranged relative to the reaction chamber to detect a signal emitted via an interaction between the catalyst and a fluid sample introduced into the housing. 17. The system of claim 16, wherein the power supply intermittently provides an electrical signal to the carrier that heats the catalyst. 18. The system of claim 16, wherein the detector is arranged within the reaction chamber. 19. The system of claim 16, wherein the detector is arranged external to the reaction chamber, the system further comprising:
a view port arranged in a wall of the carrier, the detector being aligned with the view port, and the reaction chamber being at least partially defined by the carrier. 20. The system of claim 16, wherein the detector is a light detector and the signal is light emitted from a reaction between the catalyst, oxygen within the reaction chamber, and an analyte of the fluid sample. | Embodiments include a method for performing downhole optical fluid analysis including positioning an optical analysis tool in a downhole environment. The method also includes regulating a flow of a fluid sample into a reaction chamber of the optical analysis tool. The method further includes providing a catalyst within the reaction chamber that reacts with an analyte in the fluid sample to emit light. The method includes detecting the emitted light.1. A method for performing downhole optical fluid analysis, comprising:
positioning an optical analysis tool in a downhole environment; regulating a flow of a fluid sample into a reaction chamber of the optical analysis tool; providing a catalyst within the reaction chamber that reacts with an analyte in the fluid sample to emit light; and detecting the emitted light. 2. The method of claim 1, further comprising:
electrically coupling a power supply to the catalyst; and heating the catalyst via the power supply. 3. The method of claim 1, further comprising:
intermittently heating the catalyst to raise a temperature of the catalyst for a period of time. 4. The method of claim 1, further comprising:
positioning a light detector within the reaction chamber. 5. The method of claim 1, further comprising:
positioning a light detector external to the reaction chamber. 6. The method of claim 1, further comprising:
coupling an oxygen tank to the reaction chamber; and releasing oxygen into the reaction chamber when an oxygen content within the reaction chamber falls below a threshold. 7. A method for performing downhole optical fluid analysis, comprising:
positioning an optical analysis tool in a downhole environment on a tool string, the optical analysis tool comprising a reaction chamber containing oxygen; injecting a predetermined amount of a fluid sample, withdrawn from a downhole formation, into the reaction chamber; detecting a first signal when the catalyst is at a first temperature; heating a catalyst within the reaction chamber; detecting a second signal when the catalyst is at a second temperature, the second temperature being greater than the first temperature; and determining an analyte within the fluid sample, based at least in part on a difference between the first signal and the second signal. 8. The method of claim 7, further comprising:
arranging a carrier within a housing; coating at least a portion the carrier with the catalyst; and thermally coupling the carrier to a power supply, the power supply transmitting energy to the carrier to heat the catalyst. 9. The method of claim 7, wherein the catalyst comprises a plurality of catalysts and each catalyst of the plurality of catalysts is particularly selected to react to a different analyte. 10. The method of claim 7, further comprising:
arranging a regulator at an inlet of the reaction chamber, the regulator controlling the predetermined amount of the fluid sample entering the reaction chamber. 11. The method of claim 7, wherein heating the catalyst comprises applying heat energy to the catalyst intermittently such that the catalyst is heated for a first period of time and not heated for a second period of time. 12. The method of claim 7, wherein the first signal and the second signal are both light, and further comprising:
installing a light detector within an interior of the reaction chamber for detecting the first signal and the second signal. 13. The method of claim 7, wherein the first signal and the second signal are both light, and further comprising:
installing a light detector exterior to the reaction chamber for detecting the first signal and the second signal. 14. The method of claim 7, further comprising:
adding oxygen to the reaction chamber at a predetermined time, the oxygen replacing oxygen that has been displaced by the fluid sample. 15. The method of claim 7, further comprising:
directing the fluid sample out of the reaction chamber, via an outlet, after a predetermined period of time. 16. A system for performing a downhole optical analysis, the system comprising:
a housing positioned in a wellbore extending into a formation; a carrier arranged within the housing, the carrier being coupled to a power supply; a catalyst coating at least a portion of the carrier; a regulated inlet providing a fluid pathway into a reaction chamber that includes at least a portion of the catalyst; and a detector arranged relative to the reaction chamber to detect a signal emitted via an interaction between the catalyst and a fluid sample introduced into the housing. 17. The system of claim 16, wherein the power supply intermittently provides an electrical signal to the carrier that heats the catalyst. 18. The system of claim 16, wherein the detector is arranged within the reaction chamber. 19. The system of claim 16, wherein the detector is arranged external to the reaction chamber, the system further comprising:
a view port arranged in a wall of the carrier, the detector being aligned with the view port, and the reaction chamber being at least partially defined by the carrier. 20. The system of claim 16, wherein the detector is a light detector and the signal is light emitted from a reaction between the catalyst, oxygen within the reaction chamber, and an analyte of the fluid sample. | 2,800 |
12,357 | 12,357 | 16,034,468 | 2,853 | A method pretreats a printing material used for ink printing to influence the spreading of ink print dots on the printing material. The spreading behavior is influenced in such a way that the ink print dots spread in an anisotropic way. The anisotropic spreading advantageously allows undesired quality losses in the print that are caused by a failed ink nozzle to be reduced or avoided. The influencing of the spreading behavior may be achieved by an anisotropic application of a liquid, in particular a primer or varnish, to the printing material, or by an anisotropic embossment or print on the printing material or by an anisotropic treatment of the printing material with charged particles, in particular by a plasma or a corona, or with electromagnetic radiation, in particular laser radiation. | 1. A method for pretreating a printing material used in ink jet printing to influence a spreading of ink print dots on the printing material, which comprises the step of:
influencing a spreading behavior such that the ink print dots spread in an anisotropic way. 2. The method according to claim 1, which further comprises influencing the spreading behavior by an anisotropic application of a liquid to the printing material. 3. The method according to claim 1, which further comprises influencing the spreading behavior by an anisotropic embossment or print on the printing material. 4. The method according to claim 1, which further comprises influencing the spreading behavior by performing an anisotropic treatment of the printing material with charged particles or with electromagnetic radiation. 5. The method according to claim 1, which further comprises influencing the spreading behavior such that a transverse spreading behavior in a direction perpendicular to a side edge of the printing material is increased relative to a longitudinal spreading behavior in a direction parallel to the side edge. 6. The method according to claim 1, which further comprises influencing the spreading behavior such that a transverse spreading behavior in a direction perpendicular to a side edge of the printing material is reduced relative to a longitudinal spreading behavior in a direction parallel to the side edge. 7. The method according to claim 1, which further comprises influencing the spreading behavior such that a longitudinal spreading behavior in a direction parallel to a side edge of the printing material is increased relative to a transverse spreading behavior in a direction perpendicular to the side edge. 8. The method according to claim 1, which further comprises influencing the spreading behavior such that a longitudinal spreading behavior in a direction parallel to a side edge of the printing material is reduced relative to a transverse spreading behavior in a direction perpendicular to the side edge. 9. The method according to claim 5, which further comprises aligning the side edge to be parallel to a direction of transport of the printing material. 10. The method according to claim 2, which further comprises selecting the liquid from the group consisting of a primer and a varnish. 11. The method according to claim 1, which further comprises achieving an influencing of the spreading behavior by an anisotropic embossment or a flexographic print on the printing material. 12. The method according to claim 1, which further comprises achieving an influencing of the spreading behavior by performing an anisotropic treatment of the printing material with charged particles with a plasma or corona, or with laser radiation. | A method pretreats a printing material used for ink printing to influence the spreading of ink print dots on the printing material. The spreading behavior is influenced in such a way that the ink print dots spread in an anisotropic way. The anisotropic spreading advantageously allows undesired quality losses in the print that are caused by a failed ink nozzle to be reduced or avoided. The influencing of the spreading behavior may be achieved by an anisotropic application of a liquid, in particular a primer or varnish, to the printing material, or by an anisotropic embossment or print on the printing material or by an anisotropic treatment of the printing material with charged particles, in particular by a plasma or a corona, or with electromagnetic radiation, in particular laser radiation.1. A method for pretreating a printing material used in ink jet printing to influence a spreading of ink print dots on the printing material, which comprises the step of:
influencing a spreading behavior such that the ink print dots spread in an anisotropic way. 2. The method according to claim 1, which further comprises influencing the spreading behavior by an anisotropic application of a liquid to the printing material. 3. The method according to claim 1, which further comprises influencing the spreading behavior by an anisotropic embossment or print on the printing material. 4. The method according to claim 1, which further comprises influencing the spreading behavior by performing an anisotropic treatment of the printing material with charged particles or with electromagnetic radiation. 5. The method according to claim 1, which further comprises influencing the spreading behavior such that a transverse spreading behavior in a direction perpendicular to a side edge of the printing material is increased relative to a longitudinal spreading behavior in a direction parallel to the side edge. 6. The method according to claim 1, which further comprises influencing the spreading behavior such that a transverse spreading behavior in a direction perpendicular to a side edge of the printing material is reduced relative to a longitudinal spreading behavior in a direction parallel to the side edge. 7. The method according to claim 1, which further comprises influencing the spreading behavior such that a longitudinal spreading behavior in a direction parallel to a side edge of the printing material is increased relative to a transverse spreading behavior in a direction perpendicular to the side edge. 8. The method according to claim 1, which further comprises influencing the spreading behavior such that a longitudinal spreading behavior in a direction parallel to a side edge of the printing material is reduced relative to a transverse spreading behavior in a direction perpendicular to the side edge. 9. The method according to claim 5, which further comprises aligning the side edge to be parallel to a direction of transport of the printing material. 10. The method according to claim 2, which further comprises selecting the liquid from the group consisting of a primer and a varnish. 11. The method according to claim 1, which further comprises achieving an influencing of the spreading behavior by an anisotropic embossment or a flexographic print on the printing material. 12. The method according to claim 1, which further comprises achieving an influencing of the spreading behavior by performing an anisotropic treatment of the printing material with charged particles with a plasma or corona, or with laser radiation. | 2,800 |
12,358 | 12,358 | 12,847,582 | 2,846 | The invention relates to a method ( 19 ) for starting an electric single-phase induction motor ( 1 ), wherein during a start-up interval of the start-up cycle for starting said electric motor ( 1 ), the frequency (f ref ) of the electric current for driving said electric motor ( 1 ) is set to a first frequency (f start ), and later to the operating frequency (f run ) of the electric motor ( 1 ), wherein the first frequency (f start ) is higher than the operating frequency (f run ). | 1. A method for starting an electric motor, comprising two electric supply conductors for driving said electric motor at least in part and/or at least at times, wherein during a start-up interval of the start-up cycle for starting said electric motor, the frequency (fref) of the electric current for driving said electric motor is set to at least one frequency (fstart), and later to the operating frequency (frun) of said electric motor, wherein at least one of said frequencies (fstart) during the start-up interval and/or during the start-up cycle is at least in part and/or at least at times higher than said operating frequency (frun). 2. The method according to claim 1, wherein said electric motor is at least in part and/or at least at times operated as a single-phase induction motor, wherein said single-phase induction motor preferably comprises at least one main winding and/or at least one auxiliary winding and/or at least one capacitor device. 3. The method according to claim 1, wherein during said start-up interval and/or said start-up cycle the frequency (fref) is at least in part and/or at least at times changed quickly, preferably changed essentially instantaneously, in particular to a first frequency (fstart), being higher than said operating frequency (fref). 4. The method according to claim 3, wherein during said start-up interval and/or during said start-up cycle the frequency (fref) is at least in part and/or at least at times changed slowly, in particular changed linearly, s-shaped-like and/or spline-like, in particular from a first frequency (fstart), being higher than said operating frequency to the operating frequency (frun) and/or to a catch-up frequency (fcatch) of said electric motor. 5. The method according to claim 3, wherein at least said first frequency (fstart) is approximately twice the operating frequency (frun) of the electric motor and/or is chosen so that the electric motor essentially yields an increased, preferably a maximum output torque. 6. The method according to claim 5, wherein said electric motor is driven at least in part and/or at least at times in a current limiting mode, preferably in a maximum tolerable current limiting mode (Imax). 7. The method according to claim 6, wherein during the start-up interval and/or during the start-up cycle the frequency (fref) is at least in part and/or at least at times lowered to essentially the actual motor rotation speed (frotor) and/or to a frequency, being lower than the operating frequency (frun) of the electric motor. 8. The method according to claim 1, wherein the success of the start-up cycle and/or the start-up interval is checked, in particular by measuring the electric current (I), consumed by said electric motor. 9. The method according to claim 8, wherein another start-up interval and/or another start-up cycle is initiated, if the present start-up interval and/or the present start-up cycle was not successful. 10. The method according to claim 9, wherein the frequencies (f) used and/or the voltages (U) used and/or the time intervals used and/or the ramp times used during the start-up interval and/or during the start-up cycle are varied, in particular between different start-up intervals and/or between different start-up cycles. 11. The controller unit for an electric motor, preferably controller unit comprising at least one frequency converter, wherein said controller unit is designed and arranged in a way that it performs at least in part and/or at least at times a method according to claim 1. 12. The electric motor device, in particular single-phase induction motor device, comprising at least one controller unit according to claim 10 and/or be designed and arranged in a way that performance at least in part and/or at least at times a method according to claim 10. | The invention relates to a method ( 19 ) for starting an electric single-phase induction motor ( 1 ), wherein during a start-up interval of the start-up cycle for starting said electric motor ( 1 ), the frequency (f ref ) of the electric current for driving said electric motor ( 1 ) is set to a first frequency (f start ), and later to the operating frequency (f run ) of the electric motor ( 1 ), wherein the first frequency (f start ) is higher than the operating frequency (f run ).1. A method for starting an electric motor, comprising two electric supply conductors for driving said electric motor at least in part and/or at least at times, wherein during a start-up interval of the start-up cycle for starting said electric motor, the frequency (fref) of the electric current for driving said electric motor is set to at least one frequency (fstart), and later to the operating frequency (frun) of said electric motor, wherein at least one of said frequencies (fstart) during the start-up interval and/or during the start-up cycle is at least in part and/or at least at times higher than said operating frequency (frun). 2. The method according to claim 1, wherein said electric motor is at least in part and/or at least at times operated as a single-phase induction motor, wherein said single-phase induction motor preferably comprises at least one main winding and/or at least one auxiliary winding and/or at least one capacitor device. 3. The method according to claim 1, wherein during said start-up interval and/or said start-up cycle the frequency (fref) is at least in part and/or at least at times changed quickly, preferably changed essentially instantaneously, in particular to a first frequency (fstart), being higher than said operating frequency (fref). 4. The method according to claim 3, wherein during said start-up interval and/or during said start-up cycle the frequency (fref) is at least in part and/or at least at times changed slowly, in particular changed linearly, s-shaped-like and/or spline-like, in particular from a first frequency (fstart), being higher than said operating frequency to the operating frequency (frun) and/or to a catch-up frequency (fcatch) of said electric motor. 5. The method according to claim 3, wherein at least said first frequency (fstart) is approximately twice the operating frequency (frun) of the electric motor and/or is chosen so that the electric motor essentially yields an increased, preferably a maximum output torque. 6. The method according to claim 5, wherein said electric motor is driven at least in part and/or at least at times in a current limiting mode, preferably in a maximum tolerable current limiting mode (Imax). 7. The method according to claim 6, wherein during the start-up interval and/or during the start-up cycle the frequency (fref) is at least in part and/or at least at times lowered to essentially the actual motor rotation speed (frotor) and/or to a frequency, being lower than the operating frequency (frun) of the electric motor. 8. The method according to claim 1, wherein the success of the start-up cycle and/or the start-up interval is checked, in particular by measuring the electric current (I), consumed by said electric motor. 9. The method according to claim 8, wherein another start-up interval and/or another start-up cycle is initiated, if the present start-up interval and/or the present start-up cycle was not successful. 10. The method according to claim 9, wherein the frequencies (f) used and/or the voltages (U) used and/or the time intervals used and/or the ramp times used during the start-up interval and/or during the start-up cycle are varied, in particular between different start-up intervals and/or between different start-up cycles. 11. The controller unit for an electric motor, preferably controller unit comprising at least one frequency converter, wherein said controller unit is designed and arranged in a way that it performs at least in part and/or at least at times a method according to claim 1. 12. The electric motor device, in particular single-phase induction motor device, comprising at least one controller unit according to claim 10 and/or be designed and arranged in a way that performance at least in part and/or at least at times a method according to claim 10. | 2,800 |
12,359 | 12,359 | 16,524,444 | 2,817 | A module includes a substrate having a main surface, a first component mounted on the main surface, and two or more wires bonded to the main surface so as to straddle the first component. Each of the two or more wires has a first end and a second end. When attention is paid to two wires adjacent to each other out of the two or more wires, a distance between the first ends of the two wires is shorter than a distance between the second ends of the two wires. | 1. A module comprising:
a substrate having a main surface; a first component mounted on the main surface; and two or more wires, each having a first end and a second end bonded to the main surface so that each of the two or more wires straddles the first component, wherein a distance between first ends of two wires of the two or more wires that are adjacent to each other is shorter than a distance between second ends of the two wires when viewed in a direction perpendicular to the main surface. 2. The module according to claim 1,
wherein the first ends of the two or more wires are lined up on a same side of the first component when viewed in the direction perpendicular to the main surface. 3. The module according to claim 1 including a second component mounted on the main surface,
wherein the main surface has a first region in which the first ends of the two or more wires and the main surface are connected, and
at least a part of the first region is located between the first component and the second component. 4. The module according to claim 3,
wherein an integrating pad electrode to which two or more of the first ends are connected is arranged in the first region. 5. The module according to claim 1, including a sealing resin configured to cover the first component and the two or more wires. 6. The module according to claim 1, including a shield film spaced apart from the main surface and configured to cover the first component and the two or more wires. 7. The module according to claim 6,
wherein at least one of the two or more wires is in contact with the shield film. 8. The module according to claim 1,
wherein the first component is surrounded by at least a part of an aggregate of the first ends and the second ends of the two or more wires. 9. The module according to claim 3, including a sealing resin configured to cover the first component, the second component and the two or more wires. 10. The module according to claim 1,
wherein the first component is a low noise amplifier. 11. A module comprising:
a substrate having a main surface; and a plurality of components mounted on the main surface, wherein two or more wires are bonded to the main surface so as to straddle at least one of the plurality of the components, each of the two or more wires has a first end and a second end, the main surface has a common first region in which first ends of the two or more wires for the plurality of components are connected to the main surface, and a center-to-center distance between two of the first ends adjacent to each other in the first region is shorter than a center-to-center distance between the second ends adjacent to each other in a portion other than the first region. 12. The module according to claim 2, including a second component mounted on the main surface,
wherein the main surface has a first region in which the first ends of the two or more wires and the main surface are connected, and at least a part of the first region is located between the first component and the second component. 13. The module according to claim 2, including a sealing resin configured to cover the first component and the two or more wires. 14. The module according to claim 3, including a sealing resin configured to cover the first component and the two or more wires. 15. The module according to claim 4, including a sealing resin configured to cover the first component and the two or more wires. 16. The module according to claim 2, including a shield film spaced apart from the main surface and configured to cover the first component and the two or more wires. 17. The module according to claim 3, including a shield film spaced apart from the main surface and configured to cover the first component and the two or more wires. 18. The module according to claim 4, including a shield film spaced apart from the main surface and configured to cover the first component and the two or more wires. 19. The module according to claim 5, including a shield film spaced apart from the main surface and configured to cover the first component and the two or more wires. | A module includes a substrate having a main surface, a first component mounted on the main surface, and two or more wires bonded to the main surface so as to straddle the first component. Each of the two or more wires has a first end and a second end. When attention is paid to two wires adjacent to each other out of the two or more wires, a distance between the first ends of the two wires is shorter than a distance between the second ends of the two wires.1. A module comprising:
a substrate having a main surface; a first component mounted on the main surface; and two or more wires, each having a first end and a second end bonded to the main surface so that each of the two or more wires straddles the first component, wherein a distance between first ends of two wires of the two or more wires that are adjacent to each other is shorter than a distance between second ends of the two wires when viewed in a direction perpendicular to the main surface. 2. The module according to claim 1,
wherein the first ends of the two or more wires are lined up on a same side of the first component when viewed in the direction perpendicular to the main surface. 3. The module according to claim 1 including a second component mounted on the main surface,
wherein the main surface has a first region in which the first ends of the two or more wires and the main surface are connected, and
at least a part of the first region is located between the first component and the second component. 4. The module according to claim 3,
wherein an integrating pad electrode to which two or more of the first ends are connected is arranged in the first region. 5. The module according to claim 1, including a sealing resin configured to cover the first component and the two or more wires. 6. The module according to claim 1, including a shield film spaced apart from the main surface and configured to cover the first component and the two or more wires. 7. The module according to claim 6,
wherein at least one of the two or more wires is in contact with the shield film. 8. The module according to claim 1,
wherein the first component is surrounded by at least a part of an aggregate of the first ends and the second ends of the two or more wires. 9. The module according to claim 3, including a sealing resin configured to cover the first component, the second component and the two or more wires. 10. The module according to claim 1,
wherein the first component is a low noise amplifier. 11. A module comprising:
a substrate having a main surface; and a plurality of components mounted on the main surface, wherein two or more wires are bonded to the main surface so as to straddle at least one of the plurality of the components, each of the two or more wires has a first end and a second end, the main surface has a common first region in which first ends of the two or more wires for the plurality of components are connected to the main surface, and a center-to-center distance between two of the first ends adjacent to each other in the first region is shorter than a center-to-center distance between the second ends adjacent to each other in a portion other than the first region. 12. The module according to claim 2, including a second component mounted on the main surface,
wherein the main surface has a first region in which the first ends of the two or more wires and the main surface are connected, and at least a part of the first region is located between the first component and the second component. 13. The module according to claim 2, including a sealing resin configured to cover the first component and the two or more wires. 14. The module according to claim 3, including a sealing resin configured to cover the first component and the two or more wires. 15. The module according to claim 4, including a sealing resin configured to cover the first component and the two or more wires. 16. The module according to claim 2, including a shield film spaced apart from the main surface and configured to cover the first component and the two or more wires. 17. The module according to claim 3, including a shield film spaced apart from the main surface and configured to cover the first component and the two or more wires. 18. The module according to claim 4, including a shield film spaced apart from the main surface and configured to cover the first component and the two or more wires. 19. The module according to claim 5, including a shield film spaced apart from the main surface and configured to cover the first component and the two or more wires. | 2,800 |
12,360 | 12,360 | 16,046,581 | 2,849 | An apparatus includes a switched-capacitor filter. The switched-capacitor filter includes an integrator and a feedback loop between an output node of the integrator and an input node of the integrator, wherein the feedback loop includes a feedback capacitor, a first switch, and a second switch. The switched-capacitor filter also includes a pre-charge path between the output node of the integrator and the feedback capacitor, wherein the pre-charge path includes a pre-charge buffer and a third switch. | 1. An apparatus that comprises:
a switched-capacitor filter comprising:
an integrator;
a feedback loop between an output node of the integrator and an input node of the integrator, wherein the feedback loop includes a feedback capacitor, a first switch, and a second switch; and
a pre-charge path between the output node of the integrator and the feedback capacitor, wherein the pre-charge path includes a pre-charge buffer and a third switch. 2. The apparatus of claim 1, further comprising a controller configured to provide control signals to open the first and second switches and to close the third switch during a first portion of an integration phase, and to close the first and second switches and to open the third switch during a second portion of the integration phase. 3. The apparatus of claim 1, wherein the integrator is a differential integrator, wherein the input node and the output node correspond to a first input and output node pair, wherein the integrator comprises a second input and output node pair, wherein the feedback loop comprises a first feedback loop, wherein the feedback capacitor comprises a first feedback capacitor, wherein the pre-charge path comprises a first pre-charge path, wherein the pre-charge buffer is a first pre-charge buffer, wherein the apparatus comprises a second feedback loop between the second input and output node pair, and wherein the apparatus comprises a second pre-charge path with a second pre-charge buffer between the second output node of the integrator and a second feedback capacitor in the second feedback loop. 4. The apparatus of claim 3, wherein the second feedback loop includes a fourth switch to one side of the second feedback capacitor and a fifth switch to the other side of the second feedback capacitor, wherein the second pre-charge path includes a sixth switch,
wherein the apparatus further comprises a controller configured to provide controls signals to open the fourth and fifth switches and to close the sixth switch during a first portion of an integration phase, and to close the fourth and fifth switches and to open the sixth switch during a second portion of an integration phase. 5. The apparatus of claim 1, further comprising a digital-to-analog converter (DAC) coupled to the switched-capacitor filter and configured to provide an input signal to the switched-capacitor filter. 6. The apparatus of claim 5, further comprising a sampling circuit between the DAC and switched-capacitor filter, wherein a sampling phase and the integration phase do not overlap. 7. The apparatus of claim 1, wherein the first portion of the integration phase is smaller than the second portion of the integration phase. 8. The apparatus of claim 1, wherein the apparatus comprises an isolated amplifier that includes the switched-capacitor filter on its output side. 9. The apparatus of claim 8, wherein the isolated amplifier corresponds to a multi-die module with a die that includes the switched-capacitor filter and at least one die with isolation circuitry. 10. The apparatus of claim 1, wherein the switched-capacitor filter is part of an integrated circuit. 11. A switched-capacitor filter that comprises:
an integrator; a feedback loop between an output node of the integrator and an input node of the integrator; and a de-glitch circuit integrated with the feedback loop, wherein the de-glitch circuit comprises a pre-charge buffer configured to provide a charge to a feedback capacitor in the feedback loop during part of an integration phase of the integrator. 12. The switched-capacitor filter of claim 11, wherein the de-glitch circuit further comprises:
a switch in series with the pre-charge buffer; and a controller to close the switch during a first portion of the integration phase. 13. The switched-capacitor filter of claim 11, wherein the integrator is a differential integrator, wherein the input node and the output node correspond to a first input and output node pair, wherein the feedback loop corresponds to a first feedback loop, wherein the integrator comprises a second input and output node pair, wherein the switched-capacitor filter comprises a second feedback loop between the second input and output node pair, wherein the de-glitch circuit is integrated with the first and second feedback loops, wherein the pre-charge buffer is a first pre-charge buffer, wherein the feedback capacitor is a first feedback capacitor, and wherein the de-glitch circuit comprises a second pre-charge buffer configured to provide a charge to a second feedback capacitor in the second feedback loop during part of an integration phase of the integrator. 14. The switched-capacitor filter of claim 13, wherein the de-glitch circuit further comprises:
a switch in series with the second pre-charge buffer; and a controller to close the switch during a first portion of the integration phase. 15. The switched-capacitor filter of claim 11, wherein the switched-capacitor filter is part of an integrated circuit on a die. 16. The switched-capacitor filter of claim 15, wherein the die includes a digital-to-analog converter (DAC) configured to provide an input signal to the integrator. 17. The switched-capacitor filter of claim 15, wherein the die is includes isolation circuitry configured to isolate the die from another die. 18. A switched-capacitor filter method that comprises:
receiving an integration phase signal; in response to the integration phase signal, using a pre-charge buffer to charge a feedback capacitor during a first portion of an integration phase associated with the integration phase signal; and coupling the feedback capacitor between input and output nodes of an integrator during a second portion of the integration phase. 19. The method of claim 18, wherein using the pre-charge buffer to charge a feedback capacitor during the first portion of an integration phase comprises controlling a pre-charge switch based on a first control signal, and wherein coupling the feedback capacitor between input and output nodes of the integrator during the second portion of the integration phase comprises controlling feedback loop switches based on a second control signal. 20. The method of claim 19, wherein the first and second control signals do not overlap. 21. The method of claim 20, wherein the integration phase signal is separate from the first and second control signals, and wherein the integration phase signal does not overlap with a sampling phase for a digital-to-analog converter (DAC) configured to provide an input signal to the integrator. | An apparatus includes a switched-capacitor filter. The switched-capacitor filter includes an integrator and a feedback loop between an output node of the integrator and an input node of the integrator, wherein the feedback loop includes a feedback capacitor, a first switch, and a second switch. The switched-capacitor filter also includes a pre-charge path between the output node of the integrator and the feedback capacitor, wherein the pre-charge path includes a pre-charge buffer and a third switch.1. An apparatus that comprises:
a switched-capacitor filter comprising:
an integrator;
a feedback loop between an output node of the integrator and an input node of the integrator, wherein the feedback loop includes a feedback capacitor, a first switch, and a second switch; and
a pre-charge path between the output node of the integrator and the feedback capacitor, wherein the pre-charge path includes a pre-charge buffer and a third switch. 2. The apparatus of claim 1, further comprising a controller configured to provide control signals to open the first and second switches and to close the third switch during a first portion of an integration phase, and to close the first and second switches and to open the third switch during a second portion of the integration phase. 3. The apparatus of claim 1, wherein the integrator is a differential integrator, wherein the input node and the output node correspond to a first input and output node pair, wherein the integrator comprises a second input and output node pair, wherein the feedback loop comprises a first feedback loop, wherein the feedback capacitor comprises a first feedback capacitor, wherein the pre-charge path comprises a first pre-charge path, wherein the pre-charge buffer is a first pre-charge buffer, wherein the apparatus comprises a second feedback loop between the second input and output node pair, and wherein the apparatus comprises a second pre-charge path with a second pre-charge buffer between the second output node of the integrator and a second feedback capacitor in the second feedback loop. 4. The apparatus of claim 3, wherein the second feedback loop includes a fourth switch to one side of the second feedback capacitor and a fifth switch to the other side of the second feedback capacitor, wherein the second pre-charge path includes a sixth switch,
wherein the apparatus further comprises a controller configured to provide controls signals to open the fourth and fifth switches and to close the sixth switch during a first portion of an integration phase, and to close the fourth and fifth switches and to open the sixth switch during a second portion of an integration phase. 5. The apparatus of claim 1, further comprising a digital-to-analog converter (DAC) coupled to the switched-capacitor filter and configured to provide an input signal to the switched-capacitor filter. 6. The apparatus of claim 5, further comprising a sampling circuit between the DAC and switched-capacitor filter, wherein a sampling phase and the integration phase do not overlap. 7. The apparatus of claim 1, wherein the first portion of the integration phase is smaller than the second portion of the integration phase. 8. The apparatus of claim 1, wherein the apparatus comprises an isolated amplifier that includes the switched-capacitor filter on its output side. 9. The apparatus of claim 8, wherein the isolated amplifier corresponds to a multi-die module with a die that includes the switched-capacitor filter and at least one die with isolation circuitry. 10. The apparatus of claim 1, wherein the switched-capacitor filter is part of an integrated circuit. 11. A switched-capacitor filter that comprises:
an integrator; a feedback loop between an output node of the integrator and an input node of the integrator; and a de-glitch circuit integrated with the feedback loop, wherein the de-glitch circuit comprises a pre-charge buffer configured to provide a charge to a feedback capacitor in the feedback loop during part of an integration phase of the integrator. 12. The switched-capacitor filter of claim 11, wherein the de-glitch circuit further comprises:
a switch in series with the pre-charge buffer; and a controller to close the switch during a first portion of the integration phase. 13. The switched-capacitor filter of claim 11, wherein the integrator is a differential integrator, wherein the input node and the output node correspond to a first input and output node pair, wherein the feedback loop corresponds to a first feedback loop, wherein the integrator comprises a second input and output node pair, wherein the switched-capacitor filter comprises a second feedback loop between the second input and output node pair, wherein the de-glitch circuit is integrated with the first and second feedback loops, wherein the pre-charge buffer is a first pre-charge buffer, wherein the feedback capacitor is a first feedback capacitor, and wherein the de-glitch circuit comprises a second pre-charge buffer configured to provide a charge to a second feedback capacitor in the second feedback loop during part of an integration phase of the integrator. 14. The switched-capacitor filter of claim 13, wherein the de-glitch circuit further comprises:
a switch in series with the second pre-charge buffer; and a controller to close the switch during a first portion of the integration phase. 15. The switched-capacitor filter of claim 11, wherein the switched-capacitor filter is part of an integrated circuit on a die. 16. The switched-capacitor filter of claim 15, wherein the die includes a digital-to-analog converter (DAC) configured to provide an input signal to the integrator. 17. The switched-capacitor filter of claim 15, wherein the die is includes isolation circuitry configured to isolate the die from another die. 18. A switched-capacitor filter method that comprises:
receiving an integration phase signal; in response to the integration phase signal, using a pre-charge buffer to charge a feedback capacitor during a first portion of an integration phase associated with the integration phase signal; and coupling the feedback capacitor between input and output nodes of an integrator during a second portion of the integration phase. 19. The method of claim 18, wherein using the pre-charge buffer to charge a feedback capacitor during the first portion of an integration phase comprises controlling a pre-charge switch based on a first control signal, and wherein coupling the feedback capacitor between input and output nodes of the integrator during the second portion of the integration phase comprises controlling feedback loop switches based on a second control signal. 20. The method of claim 19, wherein the first and second control signals do not overlap. 21. The method of claim 20, wherein the integration phase signal is separate from the first and second control signals, and wherein the integration phase signal does not overlap with a sampling phase for a digital-to-analog converter (DAC) configured to provide an input signal to the integrator. | 2,800 |
12,361 | 12,361 | 15,408,995 | 2,853 | A method of evaluating railway ties for deterioration is mounted on a moving vehicle along the rails where the presence of the tie is detected and an impact energy source is used to create at least one wave in a surface of the tie which travels longitudinally along the tie. At positions spaced longitudinally from the source, the time of arrival of the wave is detected typically by a series of sensors responsive to air pressure changes to determine a speed of propagation of the wave in the tie and, in the event that the speed in said tie is below a predetermined speed, an output indication is provided regarding the deterioration of the tie, which can include a real time marking of the tie detected. | 1. A method of testing railroad ties comprising:
providing an impact energy source that impacts the tie so as to create waves that propagate through the tie; providing one or more sensing devices arranged to sit above the surface of the tie so as to avoid contact therewith, where the sensing devices detect movement of the surface caused by the waves propagating therein; and analyzing and/or recording the detected pressure waves to determine properties of the tie. 2. The method according to claim 1 wherein including moving a vehicle continually along rails mounted on the ties, detecting presence of one of the ties under the vehicle, at positions spaced longitudinally from the impact energy source providing a plurality of sensing devices to detect said at least one wave and detecting a time of arrival of said waves and analyzing the time of arrival from said sensing devices to determine a speed of said waves in the tie. 3. The method according to claim 2 including, in the event that the speed in said tie is below a predetermined speed, providing an output indication of a deterioration of the tie. 4. The method according to claim 1 wherein the impact energy source comprises a body carried on a support which provides an impact on the surface of the tie and is immediately retracted so as to prevent sliding movement across the surface. 5. The method according to claim 1 wherein the impact energy source is shaped, arranged and actuated to provide a frequency of waves in the tie which includes frequencies below 25 kHz and preferably below 10 kHz and more preferably below 5 kHz. 6. The method according to claim 1 wherein the impact energy source is shaped, arranged and actuated to provide an energy at impact of greater than 3 Joules. 7. The method according to claim 1 wherein the analysis includes detecting the speed of the waves at different locations across the tie and comparing the different speeds to determine a uniformity of the speed. 8. The method according to claim 1 wherein the analysis includes detecting the waves at different locations across the tie and generating for each impact a waveform over a period of time of the impact at the location and comparing the waveforms from different locations and/or from different ties. 9. The method according to claim 1 wherein the period of time includes times in advance of the impact obtained by recording a continual waveform and obtaining from the continual waveform recorded a window of time in advance of and after the impact. 10. The method according to claim 1 wherein the sensors detect waves at the surface which are changed by wave components that are reflected and diffracted between surfaces of the structure and are indicative of delamination of or cracks in the structure below the surface. 11. The method according to claim 1 wherein the impact energy source is provided by a ball carried on a tether and operated by a rotational drive device so as to engage a surface of the tie. 12. The method according to claim 1 wherein the presence of one of the ties is detected by a proximity sensor, a magnetic sensor, a contact sensor, or a video sensor for actuating the impact energy source. 13. The method according to claim 1 wherein the sensing devices are spaced away from a surface and detect air movement generated by the surface wave in the tie. 14. The method according to claim 13 wherein sensors comprise a microphone positioned inside a tube, an open end of which is directed toward the surface of the tie. 15. The method according to claim 1 wherein the non-contact sensor is a laser sensor for detecting movement of the surface. 16. The method according to claim 1 wherein an output indication of a deterioration of the tie is used to place the ties in categories of a degree of deterioration. 17. The method according to claim 16 wherein velocity ranges for deteriorated ties are determined and then used to classify the tie tested in the categories of deterioration. 18. The method according to claim 1 wherein including a marking system for marking the tie under test in the event that it is determined to be deteriorated. 19. The method according to claim 1 wherein there is provided a position recording function to record a position of each defective tie along the rails and the data is analyzed in a post-survey analysis of the data to produce a summary report of the number and location of defective ties. 20. The method according to claim 19 wherein data from a subsequent survey is compared to previously recorded data for each tie to determine deterioration vs time and rate of deterioration of ties. 21. The method according to claim 1 wherein the rail clips are used to position the sensors on each tie. 22. The method according to claim 1 wherein the analysis establishes a zero time when the wave from the impact first passes a first senor closest to the impact energy source, and the time for the signal to propagate to a second and third sensor is used to calculate wave velocity. 23. The method according to claim 1 wherein there is provided a vehicle with wheels for rolling on the rails where the wheels are formed of a resilient polymer, plastics or rubber material. 24. The method according to claim 1 wherein the analysis is repeated after a period of time and results from the separate analyses compared to determine a rate of deterioration. 25. The method according to claim 1 wherein there is provided a camera for generating a visual image of the tie under test which is recorded with data from the analyses. 26. The method according to claim 1 wherein there is provided a first impact energy source at a first end of the tie and a first array of sensors along the tie for a first analysis and a second impact energy source at a second end of the tie and a second array of sensors along the tie for carrying out a second analysis. 27. The method according to claim 26 wherein the first array comprises a first sensor between the first impact source at the first end of the tie and a first rail, a second sensor on the other side of the first rail and a third sensor adjacent the second rail and the second array comprises a first sensor between the second impact source at the second end of the tie and the second rail, a second sensor on the other side of the second rail and a third sensor adjacent the first rail. 28. The method according to claim 1 wherein each array includes a respective sensor for detecting the tie. | A method of evaluating railway ties for deterioration is mounted on a moving vehicle along the rails where the presence of the tie is detected and an impact energy source is used to create at least one wave in a surface of the tie which travels longitudinally along the tie. At positions spaced longitudinally from the source, the time of arrival of the wave is detected typically by a series of sensors responsive to air pressure changes to determine a speed of propagation of the wave in the tie and, in the event that the speed in said tie is below a predetermined speed, an output indication is provided regarding the deterioration of the tie, which can include a real time marking of the tie detected.1. A method of testing railroad ties comprising:
providing an impact energy source that impacts the tie so as to create waves that propagate through the tie; providing one or more sensing devices arranged to sit above the surface of the tie so as to avoid contact therewith, where the sensing devices detect movement of the surface caused by the waves propagating therein; and analyzing and/or recording the detected pressure waves to determine properties of the tie. 2. The method according to claim 1 wherein including moving a vehicle continually along rails mounted on the ties, detecting presence of one of the ties under the vehicle, at positions spaced longitudinally from the impact energy source providing a plurality of sensing devices to detect said at least one wave and detecting a time of arrival of said waves and analyzing the time of arrival from said sensing devices to determine a speed of said waves in the tie. 3. The method according to claim 2 including, in the event that the speed in said tie is below a predetermined speed, providing an output indication of a deterioration of the tie. 4. The method according to claim 1 wherein the impact energy source comprises a body carried on a support which provides an impact on the surface of the tie and is immediately retracted so as to prevent sliding movement across the surface. 5. The method according to claim 1 wherein the impact energy source is shaped, arranged and actuated to provide a frequency of waves in the tie which includes frequencies below 25 kHz and preferably below 10 kHz and more preferably below 5 kHz. 6. The method according to claim 1 wherein the impact energy source is shaped, arranged and actuated to provide an energy at impact of greater than 3 Joules. 7. The method according to claim 1 wherein the analysis includes detecting the speed of the waves at different locations across the tie and comparing the different speeds to determine a uniformity of the speed. 8. The method according to claim 1 wherein the analysis includes detecting the waves at different locations across the tie and generating for each impact a waveform over a period of time of the impact at the location and comparing the waveforms from different locations and/or from different ties. 9. The method according to claim 1 wherein the period of time includes times in advance of the impact obtained by recording a continual waveform and obtaining from the continual waveform recorded a window of time in advance of and after the impact. 10. The method according to claim 1 wherein the sensors detect waves at the surface which are changed by wave components that are reflected and diffracted between surfaces of the structure and are indicative of delamination of or cracks in the structure below the surface. 11. The method according to claim 1 wherein the impact energy source is provided by a ball carried on a tether and operated by a rotational drive device so as to engage a surface of the tie. 12. The method according to claim 1 wherein the presence of one of the ties is detected by a proximity sensor, a magnetic sensor, a contact sensor, or a video sensor for actuating the impact energy source. 13. The method according to claim 1 wherein the sensing devices are spaced away from a surface and detect air movement generated by the surface wave in the tie. 14. The method according to claim 13 wherein sensors comprise a microphone positioned inside a tube, an open end of which is directed toward the surface of the tie. 15. The method according to claim 1 wherein the non-contact sensor is a laser sensor for detecting movement of the surface. 16. The method according to claim 1 wherein an output indication of a deterioration of the tie is used to place the ties in categories of a degree of deterioration. 17. The method according to claim 16 wherein velocity ranges for deteriorated ties are determined and then used to classify the tie tested in the categories of deterioration. 18. The method according to claim 1 wherein including a marking system for marking the tie under test in the event that it is determined to be deteriorated. 19. The method according to claim 1 wherein there is provided a position recording function to record a position of each defective tie along the rails and the data is analyzed in a post-survey analysis of the data to produce a summary report of the number and location of defective ties. 20. The method according to claim 19 wherein data from a subsequent survey is compared to previously recorded data for each tie to determine deterioration vs time and rate of deterioration of ties. 21. The method according to claim 1 wherein the rail clips are used to position the sensors on each tie. 22. The method according to claim 1 wherein the analysis establishes a zero time when the wave from the impact first passes a first senor closest to the impact energy source, and the time for the signal to propagate to a second and third sensor is used to calculate wave velocity. 23. The method according to claim 1 wherein there is provided a vehicle with wheels for rolling on the rails where the wheels are formed of a resilient polymer, plastics or rubber material. 24. The method according to claim 1 wherein the analysis is repeated after a period of time and results from the separate analyses compared to determine a rate of deterioration. 25. The method according to claim 1 wherein there is provided a camera for generating a visual image of the tie under test which is recorded with data from the analyses. 26. The method according to claim 1 wherein there is provided a first impact energy source at a first end of the tie and a first array of sensors along the tie for a first analysis and a second impact energy source at a second end of the tie and a second array of sensors along the tie for carrying out a second analysis. 27. The method according to claim 26 wherein the first array comprises a first sensor between the first impact source at the first end of the tie and a first rail, a second sensor on the other side of the first rail and a third sensor adjacent the second rail and the second array comprises a first sensor between the second impact source at the second end of the tie and the second rail, a second sensor on the other side of the second rail and a third sensor adjacent the first rail. 28. The method according to claim 1 wherein each array includes a respective sensor for detecting the tie. | 2,800 |
12,362 | 12,362 | 16,160,471 | 2,875 | An embedded light source in a composite panel. A first electrode and a second electrode are associated with a first layer of material. A light source is positioned in electrical communication with the first electrode and the second electrode. An assembly comprising the first layer of material, the first electrode, the second electrode, and the light source is processed to form a multilayer panel with an embedded light source. | 1. A multilayer panel with an embedded light source comprising:
a first electrode associated with a first layer of material; a second electrode associated with the first layer of material; a light source in electrical communication with the first electrode and the second electrode; and a second layer of material overlying the first layer of material and the light source. 2. The multilayer panel of claim 1, wherein the second layer of material is a laminate layer. 3. The multilayer panel of claim 1, wherein the light source rests substantially within a depression in the first layer of material. 4. The multilayer panel of claim 1 further comprising:
a conductive adhesive positioned between at least one of the first electrode or the second electrode and the light source. 5. The multilayer panel of claim 1 further comprising:
a layer of core material. 6. The multilayer panel of claim 1, wherein the second layer is a pre-impregnated composite material. 7. The multilayer panel of claim 1, wherein the multilayer panel has a non-planar curvature. 8. The multilayer panel of claim 1, wherein the light source is a static image flexible organic light emitting diode. 9. The multilayer panel of claim 1, wherein the light source is a programmable flexible organic light emitting diode. 10. The multilayer panel of claim 1, wherein the multilayer panel comprises a display or lighting in an aircraft. 11. The multilayer panel of claim 10, wherein the multilayer panel comprises at least one of cabin lighting, décor, advertising, emergency signage, emergency lighting, entertainment display, seat placards, or safety signage. 12. An aircraft comprising:
a multilayer panel with an embedded light source comprising a first electrode associated with a first layer of material, a second electrode associated with the first layer of material, a light source in electrical communication with the first electrode and the second electrode, and a second layer of material overlying the first layer of material and the light source; and a controller in communication with the light source. 13. The aircraft of claim 12, wherein the multilayer panel comprises at least one of cabin lighting, décor, advertising, emergency signage, emergency lighting, entertainment display, seat placards, or safety signage. 14. The aircraft of claim 12, wherein the second layer of material is a laminate layer. 15. The aircraft of claim 12, wherein the light source rests substantially within a depression in the first layer of material. 16. A multilayer panel with an embedded light source comprising:
a first layer of composite material; a light source positioned relative to the first layer of composite material; and a second layer of composite material overlying the first layer of composite material and the light source. 17. The multilayer panel of claim 16, wherein the light source rests substantially within a depression in the first layer of composite material. 18. The multilayer panel of claim 16, wherein the second layer of composite material is a laminate layer. 19. The multilayer panel of claim 16, wherein the multilayer panel comprises a display or lighting in an aircraft. 20. The multilayer panel of claim 19, wherein the multilayer panel comprises at least one of cabin lighting, décor, advertising, emergency signage, emergency lighting, entertainment display, seat placards, or safety signage. | An embedded light source in a composite panel. A first electrode and a second electrode are associated with a first layer of material. A light source is positioned in electrical communication with the first electrode and the second electrode. An assembly comprising the first layer of material, the first electrode, the second electrode, and the light source is processed to form a multilayer panel with an embedded light source.1. A multilayer panel with an embedded light source comprising:
a first electrode associated with a first layer of material; a second electrode associated with the first layer of material; a light source in electrical communication with the first electrode and the second electrode; and a second layer of material overlying the first layer of material and the light source. 2. The multilayer panel of claim 1, wherein the second layer of material is a laminate layer. 3. The multilayer panel of claim 1, wherein the light source rests substantially within a depression in the first layer of material. 4. The multilayer panel of claim 1 further comprising:
a conductive adhesive positioned between at least one of the first electrode or the second electrode and the light source. 5. The multilayer panel of claim 1 further comprising:
a layer of core material. 6. The multilayer panel of claim 1, wherein the second layer is a pre-impregnated composite material. 7. The multilayer panel of claim 1, wherein the multilayer panel has a non-planar curvature. 8. The multilayer panel of claim 1, wherein the light source is a static image flexible organic light emitting diode. 9. The multilayer panel of claim 1, wherein the light source is a programmable flexible organic light emitting diode. 10. The multilayer panel of claim 1, wherein the multilayer panel comprises a display or lighting in an aircraft. 11. The multilayer panel of claim 10, wherein the multilayer panel comprises at least one of cabin lighting, décor, advertising, emergency signage, emergency lighting, entertainment display, seat placards, or safety signage. 12. An aircraft comprising:
a multilayer panel with an embedded light source comprising a first electrode associated with a first layer of material, a second electrode associated with the first layer of material, a light source in electrical communication with the first electrode and the second electrode, and a second layer of material overlying the first layer of material and the light source; and a controller in communication with the light source. 13. The aircraft of claim 12, wherein the multilayer panel comprises at least one of cabin lighting, décor, advertising, emergency signage, emergency lighting, entertainment display, seat placards, or safety signage. 14. The aircraft of claim 12, wherein the second layer of material is a laminate layer. 15. The aircraft of claim 12, wherein the light source rests substantially within a depression in the first layer of material. 16. A multilayer panel with an embedded light source comprising:
a first layer of composite material; a light source positioned relative to the first layer of composite material; and a second layer of composite material overlying the first layer of composite material and the light source. 17. The multilayer panel of claim 16, wherein the light source rests substantially within a depression in the first layer of composite material. 18. The multilayer panel of claim 16, wherein the second layer of composite material is a laminate layer. 19. The multilayer panel of claim 16, wherein the multilayer panel comprises a display or lighting in an aircraft. 20. The multilayer panel of claim 19, wherein the multilayer panel comprises at least one of cabin lighting, décor, advertising, emergency signage, emergency lighting, entertainment display, seat placards, or safety signage. | 2,800 |
12,363 | 12,363 | 15,842,193 | 2,842 | A high-voltage, high-speed driver circuit that includes a source amplifier having an amplifying FET device with a drain terminal, a gate terminal and a source terminal, where the amplifying FET device receiving a control signal at its gate terminal and outputs an amplified control signal at its drain terminal. The driver circuit also includes an active load having a self-biasing load FET device with a drain terminal, a gate terminal and a source terminal, where the drain terminal of the load FET device is coupled to a power supply, the source terminal of the load FET device is coupled to the drain terminal of the amplifying FET device, and the source and gate terminals of the load FET device are electrically coupled together by a self-biasing line. The active load includes a load resistor provided within the self-biasing line that provides high impedance and low capacitance. | 1. A driver circuit comprising:
a source amplifier including an amplifying field effect transistor (FET) device having a drain terminal, a gate terminal and a source terminal, said amplifying FET device receiving a control signal at its gate terminal and outputting an amplified control signal at its drain terminal; and an active load including a load FET device having a drain terminal, a gate terminal and a source terminal, said drain terminal of the load FET device being coupled to a power supply, said source terminal of the load FET device being coupled to the drain terminal of the amplifying FET device, and said source and gate terminals of the load FET device being electrically coupled by a self-biasing line, said active load including a load resistor provided in the self-biasing line. 2. The driver circuit according to claim 1 wherein the amplifying FET device and the load FET device are depletion mode devices. 3. The driver circuit according to claim 1 wherein the amplifying FET device and the load FET device are GaN devices. 4. The driver circuit according to claim 3 wherein the GaN devices are N-type devices. 5. The driver circuit according to claim 1 wherein the amplified control signal controls a switch. 6. The driver circuit according to claim 1 wherein the control signal is a square wave. 7. The driver circuit according to claim 1 wherein the active load has a low frequency response that provides high impedance. 8. The driver circuit according to claim 1 wherein the active load has a high frequency response that provides low capacitance. 9. A driver circuit comprising:
an amplifying sub-circuit including an input receiving a control signal and an output providing an amplified control signal; and an active load including a field effect transistor (FET) device having a drain terminal, a gate terminal and a source terminal, said drain terminal of the FET device being coupled to a power supply, said source terminal of the FET device being coupled to the output of the amplifying sub-circuit, and said source and gate terminals of the FET device being electrically coupled by a self-biasing line, said active load including a load resistor provided in the self-biasing line. 10. The driver circuit according to claim 9 wherein the FET device is a depletion mode device. 11. The driver circuit according to claim 9 wherein the FET device is a GaN device. 12. The driver circuit according to claim 11 wherein the GaN device is an N-type device. 13. The driver circuit according to claim 9 wherein the amplified control signal controls a switch. 14. The driver circuit according to claim 9 wherein the control signal is a square wave. 15. The driver circuit according to claim 9 wherein the active load has a low frequency response that provides high impedance. 16. The driver circuit according to claim 9 wherein the active load has a high frequency response that provides low capacitance. 17. A driver circuit for controlling a switch, said circuit comprising:
a source amplifier including an amplifying field effect transistor (FET) device having a drain terminal, a gate terminal and a source terminal, said amplifying FET device receiving a square wave control signal at its gate terminal and outputting an amplified square wave control signal at its drain terminal that is sent to the switch; and an active load including a load FET device having a drain terminal, a gate terminal and a source terminal, said drain terminal of the load FET device being coupled to a power supply, said source terminal of the load FET device being coupled to the drain terminal of the amplifying FET device, and said source and gate terminals of the load FET device being electrically coupled by a self-biasing line, said active load including a load resistor provided in the self-biasing line, wherein the active load has a low frequency response that provides high impedance and a high frequency response that provides low capacitance. 18. The driver circuit according to claim 17 wherein the amplifying FET device and the load FET device are depletion mode devices. 19. The driver circuit according to claim 17 wherein the amplifying FET device and the load FET device are GaN devices. 20. The driver circuit according to claim 19 wherein the GaN devices are N-type devices. | A high-voltage, high-speed driver circuit that includes a source amplifier having an amplifying FET device with a drain terminal, a gate terminal and a source terminal, where the amplifying FET device receiving a control signal at its gate terminal and outputs an amplified control signal at its drain terminal. The driver circuit also includes an active load having a self-biasing load FET device with a drain terminal, a gate terminal and a source terminal, where the drain terminal of the load FET device is coupled to a power supply, the source terminal of the load FET device is coupled to the drain terminal of the amplifying FET device, and the source and gate terminals of the load FET device are electrically coupled together by a self-biasing line. The active load includes a load resistor provided within the self-biasing line that provides high impedance and low capacitance.1. A driver circuit comprising:
a source amplifier including an amplifying field effect transistor (FET) device having a drain terminal, a gate terminal and a source terminal, said amplifying FET device receiving a control signal at its gate terminal and outputting an amplified control signal at its drain terminal; and an active load including a load FET device having a drain terminal, a gate terminal and a source terminal, said drain terminal of the load FET device being coupled to a power supply, said source terminal of the load FET device being coupled to the drain terminal of the amplifying FET device, and said source and gate terminals of the load FET device being electrically coupled by a self-biasing line, said active load including a load resistor provided in the self-biasing line. 2. The driver circuit according to claim 1 wherein the amplifying FET device and the load FET device are depletion mode devices. 3. The driver circuit according to claim 1 wherein the amplifying FET device and the load FET device are GaN devices. 4. The driver circuit according to claim 3 wherein the GaN devices are N-type devices. 5. The driver circuit according to claim 1 wherein the amplified control signal controls a switch. 6. The driver circuit according to claim 1 wherein the control signal is a square wave. 7. The driver circuit according to claim 1 wherein the active load has a low frequency response that provides high impedance. 8. The driver circuit according to claim 1 wherein the active load has a high frequency response that provides low capacitance. 9. A driver circuit comprising:
an amplifying sub-circuit including an input receiving a control signal and an output providing an amplified control signal; and an active load including a field effect transistor (FET) device having a drain terminal, a gate terminal and a source terminal, said drain terminal of the FET device being coupled to a power supply, said source terminal of the FET device being coupled to the output of the amplifying sub-circuit, and said source and gate terminals of the FET device being electrically coupled by a self-biasing line, said active load including a load resistor provided in the self-biasing line. 10. The driver circuit according to claim 9 wherein the FET device is a depletion mode device. 11. The driver circuit according to claim 9 wherein the FET device is a GaN device. 12. The driver circuit according to claim 11 wherein the GaN device is an N-type device. 13. The driver circuit according to claim 9 wherein the amplified control signal controls a switch. 14. The driver circuit according to claim 9 wherein the control signal is a square wave. 15. The driver circuit according to claim 9 wherein the active load has a low frequency response that provides high impedance. 16. The driver circuit according to claim 9 wherein the active load has a high frequency response that provides low capacitance. 17. A driver circuit for controlling a switch, said circuit comprising:
a source amplifier including an amplifying field effect transistor (FET) device having a drain terminal, a gate terminal and a source terminal, said amplifying FET device receiving a square wave control signal at its gate terminal and outputting an amplified square wave control signal at its drain terminal that is sent to the switch; and an active load including a load FET device having a drain terminal, a gate terminal and a source terminal, said drain terminal of the load FET device being coupled to a power supply, said source terminal of the load FET device being coupled to the drain terminal of the amplifying FET device, and said source and gate terminals of the load FET device being electrically coupled by a self-biasing line, said active load including a load resistor provided in the self-biasing line, wherein the active load has a low frequency response that provides high impedance and a high frequency response that provides low capacitance. 18. The driver circuit according to claim 17 wherein the amplifying FET device and the load FET device are depletion mode devices. 19. The driver circuit according to claim 17 wherein the amplifying FET device and the load FET device are GaN devices. 20. The driver circuit according to claim 19 wherein the GaN devices are N-type devices. | 2,800 |
12,364 | 12,364 | 16,575,488 | 2,836 | An electronic device for simulating load currents when testing a tow-vehicle brake controller is described. The electronic device utilizes current monitoring circuitry to measure a current of an input signal from the tow vehicle. The electronic device also includes a series of resistors that are arranged in parallel on the input signal as wells a series of switches (e.g., relays or transistors) that can activate and deactivate each one of the resistors. Microcontroller circuitry within the electronic device controls the series of switches based on the measured current of the input signal, and, by extension, controls the series of resistors applied to the input signal. In so doing, the electronic device is able to simulate a desired load current on the tow-vehicle brake controller being tested. | 1. An apparatus comprising:
current monitoring circuitry operative to measure a current of an input signal; a plurality of resistors arranged in parallel on the input signal; a plurality of switches, each of the plurality of switches operative to activate and deactivate a respective one of the plurality of resistors; and microcontroller circuitry operative to control the plurality of switches at least in part based on data from the current monitoring circuitry. 2. The apparatus of claim 1, wherein the plurality of switches comprise a relay. 3. The apparatus of claim 1, wherein the plurality of switches comprise a transistor. 4. The apparatus of claim 1, further comprising temperature sensor circuitry operative to measure a temperature in the apparatus. 5. The apparatus of claim 4, wherein the microcontroller circuitry is further operative to control the plurality of switches at least in part based on data from the temperature sensor circuitry. 6. The apparatus of claim 1, further comprising a low side driver, wherein the microcontroller circuitry is operative to control the plurality of switches at least in part through the low side driver. 7. The apparatus of claim 1, wherein the input signal is generated by a tow-vehicle brake controller. 8. The apparatus of claim 1, wherein the apparatus is adapted to receive the input signal from a tow vehicle. 9. The apparatus of claim 1, further comprising a user interface adapted to allow a user to input a desired number of trailer axles to be simulated. 10. The apparatus of claim 1, further comprising a user interface adapted to allow a user to input a desired load current. 11. The apparatus of claim 1, further comprising a shunt resistor, wherein the current monitoring circuitry is operative to measure the current of the input signal across the shunt resistor. 12. The apparatus of claim 1, wherein the plurality of resistors comprise five different resistors. 13. The apparatus of claim 1, further comprising a heat sink. 14. A method of simulating a load current, the method comprising the steps of:
measuring a current of an input signal; and controlling a plurality of switches via microcontroller circuitry at least in part based on the measured current, each of the plurality of switches operative to activate and deactivate a respective resistor of a plurality of resistors arranged in parallel on the input signal. 15. The method of claim 14, further comprising the steps of:
measuring a temperature; and controlling the plurality of switches at least in part based on the measured temperature. 16. The method of claim 14, wherein the plurality of switches comprise a relay. 17. The method of claim 14, wherein the plurality of switches comprise a transistor. 18. The method of claim 14, wherein the input signal is generated by a tow-vehicle brake controller. 19. The method of claim 14, further comprising the step of allowing a user to input a desired number of trailer axles to be simulated. 20. The method of claim 14, further comprising the step of allowing a user to input a desired load current. | An electronic device for simulating load currents when testing a tow-vehicle brake controller is described. The electronic device utilizes current monitoring circuitry to measure a current of an input signal from the tow vehicle. The electronic device also includes a series of resistors that are arranged in parallel on the input signal as wells a series of switches (e.g., relays or transistors) that can activate and deactivate each one of the resistors. Microcontroller circuitry within the electronic device controls the series of switches based on the measured current of the input signal, and, by extension, controls the series of resistors applied to the input signal. In so doing, the electronic device is able to simulate a desired load current on the tow-vehicle brake controller being tested.1. An apparatus comprising:
current monitoring circuitry operative to measure a current of an input signal; a plurality of resistors arranged in parallel on the input signal; a plurality of switches, each of the plurality of switches operative to activate and deactivate a respective one of the plurality of resistors; and microcontroller circuitry operative to control the plurality of switches at least in part based on data from the current monitoring circuitry. 2. The apparatus of claim 1, wherein the plurality of switches comprise a relay. 3. The apparatus of claim 1, wherein the plurality of switches comprise a transistor. 4. The apparatus of claim 1, further comprising temperature sensor circuitry operative to measure a temperature in the apparatus. 5. The apparatus of claim 4, wherein the microcontroller circuitry is further operative to control the plurality of switches at least in part based on data from the temperature sensor circuitry. 6. The apparatus of claim 1, further comprising a low side driver, wherein the microcontroller circuitry is operative to control the plurality of switches at least in part through the low side driver. 7. The apparatus of claim 1, wherein the input signal is generated by a tow-vehicle brake controller. 8. The apparatus of claim 1, wherein the apparatus is adapted to receive the input signal from a tow vehicle. 9. The apparatus of claim 1, further comprising a user interface adapted to allow a user to input a desired number of trailer axles to be simulated. 10. The apparatus of claim 1, further comprising a user interface adapted to allow a user to input a desired load current. 11. The apparatus of claim 1, further comprising a shunt resistor, wherein the current monitoring circuitry is operative to measure the current of the input signal across the shunt resistor. 12. The apparatus of claim 1, wherein the plurality of resistors comprise five different resistors. 13. The apparatus of claim 1, further comprising a heat sink. 14. A method of simulating a load current, the method comprising the steps of:
measuring a current of an input signal; and controlling a plurality of switches via microcontroller circuitry at least in part based on the measured current, each of the plurality of switches operative to activate and deactivate a respective resistor of a plurality of resistors arranged in parallel on the input signal. 15. The method of claim 14, further comprising the steps of:
measuring a temperature; and controlling the plurality of switches at least in part based on the measured temperature. 16. The method of claim 14, wherein the plurality of switches comprise a relay. 17. The method of claim 14, wherein the plurality of switches comprise a transistor. 18. The method of claim 14, wherein the input signal is generated by a tow-vehicle brake controller. 19. The method of claim 14, further comprising the step of allowing a user to input a desired number of trailer axles to be simulated. 20. The method of claim 14, further comprising the step of allowing a user to input a desired load current. | 2,800 |
12,365 | 12,365 | 16,259,622 | 2,846 | In a method and device for the cyclic digital transmission of a position value of a moving object with inertial mass, the value range of the transmitted position value is restricted such that no complete rotation or, in the case of a linear motion, other complete period caused by mechanical conditions may be mapped, and the actual position is formed by detecting value-range exceedances in an evaluation unit. | 1. A method for closed-loop control of a drive, comprising:
recurrently detecting a position value over time; transmitting to a control device information associated with the detection of the position value, the position value being characterized by at least two values, a first value being denotable with a whole number, and a position-value range being assigned to each number, each position range being characterized by a first value being assigned mutually separate sub-ranges of the position range, each of the sub-ranges being characterized by a second value denotable as a whole number; transmitting the second value prior in time to the first value; and repeatedly:
after transmitting a newly detected second value, determining a first value that corresponds to a newly detected first value from the newly detected and the previously transmitted second value; and
using the determined position value by the control device to determine an updated value of a manipulated variable of the control device. 2. The method according to claim 1, wherein the at least two values include a partial-angle value and a fine-angle value. 3. The method according to claim 2, wherein the partial-angle value and the fine-angle value include digital values. 4. A method for closed-loop control of a drive, comprising:
recurrently detecting a position value over time; transmitting to a control device information associated with the detection of the position value, the position value being characterized by at least two values, a first value being denotable with a whole number, and a position-value range being assigned to each number, each position range being characterized by a first value being assigned mutually separate sub-ranges of the position range, each of the sub-ranges being characterized by a second value denotable as a whole number; transmitting the second value prior in time to the first value; and repeatedly:
(i) after transmitting a newly detected second value, determining a first value that corresponds to a newly detected first value from the newly detected and the previously transmitted second value, additionally taking into account a last determined velocity, and using the determined position value by the control device to determine an updated value of a manipulated variable of the control device; and
(ii) after transmitting the newly detected second value, updating the velocity value based on the newly detected first value and the newly detected second value, taking into account the previously detected first value and the previously detected second value. 5. The method according to claim 4, wherein the at least two values include a partial-angle value and a fine-angle value. 6. The method according to claim 5, wherein the partial-angle value and the fine-angle value include digital values. 7. The method according to claim 5, further comprising, after transmitting the first value, comparing the first value to the first value determined in step (i), and in response to a deviation, triggering an action. 8. The method according to claim 7, wherein the action includes display and/or communication of warning information, switching off the drive, and/or initiating a safe state of the drive. 9. The method according to claim 5, wherein the position value is detected by a sensor connected to an evaluation unit via a digital interface, the evaluation unit having a memory and a device adapted to determine the position value from a transmitted position value restricted in value range. 10. The method according to claim 9, wherein the evaluation unit is connected to the control device. | In a method and device for the cyclic digital transmission of a position value of a moving object with inertial mass, the value range of the transmitted position value is restricted such that no complete rotation or, in the case of a linear motion, other complete period caused by mechanical conditions may be mapped, and the actual position is formed by detecting value-range exceedances in an evaluation unit.1. A method for closed-loop control of a drive, comprising:
recurrently detecting a position value over time; transmitting to a control device information associated with the detection of the position value, the position value being characterized by at least two values, a first value being denotable with a whole number, and a position-value range being assigned to each number, each position range being characterized by a first value being assigned mutually separate sub-ranges of the position range, each of the sub-ranges being characterized by a second value denotable as a whole number; transmitting the second value prior in time to the first value; and repeatedly:
after transmitting a newly detected second value, determining a first value that corresponds to a newly detected first value from the newly detected and the previously transmitted second value; and
using the determined position value by the control device to determine an updated value of a manipulated variable of the control device. 2. The method according to claim 1, wherein the at least two values include a partial-angle value and a fine-angle value. 3. The method according to claim 2, wherein the partial-angle value and the fine-angle value include digital values. 4. A method for closed-loop control of a drive, comprising:
recurrently detecting a position value over time; transmitting to a control device information associated with the detection of the position value, the position value being characterized by at least two values, a first value being denotable with a whole number, and a position-value range being assigned to each number, each position range being characterized by a first value being assigned mutually separate sub-ranges of the position range, each of the sub-ranges being characterized by a second value denotable as a whole number; transmitting the second value prior in time to the first value; and repeatedly:
(i) after transmitting a newly detected second value, determining a first value that corresponds to a newly detected first value from the newly detected and the previously transmitted second value, additionally taking into account a last determined velocity, and using the determined position value by the control device to determine an updated value of a manipulated variable of the control device; and
(ii) after transmitting the newly detected second value, updating the velocity value based on the newly detected first value and the newly detected second value, taking into account the previously detected first value and the previously detected second value. 5. The method according to claim 4, wherein the at least two values include a partial-angle value and a fine-angle value. 6. The method according to claim 5, wherein the partial-angle value and the fine-angle value include digital values. 7. The method according to claim 5, further comprising, after transmitting the first value, comparing the first value to the first value determined in step (i), and in response to a deviation, triggering an action. 8. The method according to claim 7, wherein the action includes display and/or communication of warning information, switching off the drive, and/or initiating a safe state of the drive. 9. The method according to claim 5, wherein the position value is detected by a sensor connected to an evaluation unit via a digital interface, the evaluation unit having a memory and a device adapted to determine the position value from a transmitted position value restricted in value range. 10. The method according to claim 9, wherein the evaluation unit is connected to the control device. | 2,800 |
12,366 | 12,366 | 16,286,358 | 2,883 | Described are various configurations of integrated wavelength lockers including asymmetric Mach-Zehnder interferometers (AMZIs) and associated detectors. Various embodiments provide improved wavelength-locking accuracy by using an active tuning element in the AMZI to achieve an operational position with high locking sensitivity, a coherent receiver to reduce the frequency-dependence of the locking sensitivity, and/or a temperature sensor and/or strain gauge to computationally correct for the effect of temperature or strain changes. | 1. A method for locking a frequency of a light source of a photonic integrated circuit using an integrated wavelength locker comprising an AMZI with an active tuning element in one interferometer arm, the method comprising:
coupling light emitted by the light source into the AMZI at an input of the AMZI; adjusting a setting of the active tuning element to match a target setting stored in memory, the target setting being associated with a specified locking frequency; measuring a balanced photocurrent at an output of the AMZI; and tuning a frequency of the light source until the measured balanced photocurrent is substantially zero. 2. The method of claim 1, wherein the active tuning element comprises a heater and the setting being adjusted comprises a heater power. 3. The method of claim 1, further comprising measuring at least one of a temperature of the AMZI or a strain in the AMZI, and adjusting the setting of the active tuning element, based on the measured temperature or strain, prior to tuning the frequency of the light source to bring the balanced photocurrent to substantially zero. 4. The method of claim 3, wherein the setting of the active tuning element is adjusted based on the measured temperature or strain by selecting the target setting based on the measured temperature strain from among a plurality of target settings stored for multiple temperatures or levels of strain. 5. The method of claim 3, wherein the setting of the active tuning element is computationally adjusted based on the measured temperature or strain. 6. The method of claim 1, further comprising calibrating the integrated wavelength locker prior to locking the frequency of the light source by:
tuning the frequency of the light source, based on an external reference signal having the specified locking frequency, until the frequency of the light source matches the specified locking frequency; and while the frequency of the light source matches the specified locking frequency, tuning the setting of the active tuning element until a balanced photocurrent measured at the output of the AMZI is substantially zero, and then storing that setting as the target setting in memory. 7. The method of claim 1, wherein the AMZI forms part of a first filter, the integrated wavelength locker comprising a second filter with a second AMZI, a filter period of the second AMZI being smaller than a filter period of the first AMZI, the frequency of the light source being tuned in the first filter up to a frequency error no greater than the filter period of the second AMZI, the method further comprising, following coarse-tuning the frequency of the light source with the first filter, fine-tuning the frequency of the light source with the second filter by:
coupling light emitted by the light source into the second AMZI at an input of the second AMZI; and while the setting of the active tuning element match the target setting stored in memory, measuring a second balanced photocurrent at an output of the second AMZI and tuning the frequency of the light source until the measured second balanced photocurrent is substantially zero. 8. The method of claim 1, further comprising applying a frequency dither to the light source. 9. A method of manufacturing an integrated wavelength locker module, the method comprising:
on a semiconductor substrate, creating a PIC comprising a tunable light source and a wavelength locker, the wavelength locker comprising an AMZI with two waveguide arms and a balanced receiver; and depositing a metal above one of the waveguide arms to form an active tuning element for adjusting an optical-path-length difference between the two waveguide arms. 10. The method of claim 9, further comprising:
creating an electronic control chip including memory storing a target setting of the active tuning element and processing circuitry configured to tune a frequency of the light source coupling light into the AMZI, based on a balanced photocurrent measured with the balanced receiver, to bring the balanced photocurrent to substantially zero; and bonding the PIC and the electronic control chip to a common substrate to form the integrated wavelength locker module. 11. The method of claim 10, further comprising calibrating the integrated wavelength locker module by:
providing a reference signal having a specified locking frequency to an input of the AMZI; and tuning a setting of the active tuning element until a balanced photocurrent measured with the balanced receiver is substantially zero, and then storing that setting as the target setting in the memory. 12. The method of claim 11, wherein the reference signal is provided by an external light source. 13. The method of claim 11, wherein the reference signal is provided by the light source of the PIC following tuning of the light source to the specified locking frequency using an external wavelength filter. 14. The method of claim 10, further comprising creating a strain gauge in the PIC adjacent the AMZI and, following bonding of the PIC and the electronic control chip to the common substrate, measuring a strain in the AMZI and storing the measured strain in the memory. 15. The method of claim 10, further comprising creating a temperature sensor in the PIC adjacent the AMZI, wherein calibrating the integrated wavelength locker module further comprises measuring the temperature of the AMZI and storing the measured temperature in the memory. 16. The method of claim 9, wherein the metal deposited above one of the waveguide arms forms one of a continuous patch or a winding trace. 17. A wavelength locker comprising:
an athermal asymmetric Mach-Zehnder interferometer (AMZI) comprising an input coupler, two waveguide arms coupled to the input coupler at a first end of the waveguide arms, an output coupler coupled to the two waveguide arms at a second end of the waveguide arms and providing at least two output ports, and an active tuning element disposed in one of the waveguide arms and configured to adjust an optical-path-length difference between the two waveguide arms; at least one of a temperature sensor for measuring a temperature of the AMZI or a strain gauge for measuring a level of strain in the AMZI; at least two photodetectors each placed at a respective one of the at least two output ports, the at least two photodetectors forming, together with the output coupler, a balanced receiver; and memory storing temperature-dependent or strain-dependent target settings of the active tuning element for multiple temperatures of the AMZI or multiple levels of strain in the AMZI, the target settings corresponding to balanced photocurrents measured with the balanced receiver being substantially zero at a specified locking frequency and at respective measured temperatures or levels of strain. 18. The wavelength locker of claim 17, wherein the active tuning element comprises a heater. 19. The wavelength locker of claim 17, wherein the AMZI and the photodetectors are integrated in a photonic integrated circuit. 20. The wavelength locker of claim 17, further comprising circuitry configured to set the active tuning element to a target setting selected among the temperature-dependent or strain-dependent target settings based on a measured temperature or level of strain, and to tune a frequency of a light source coupling light via the input coupler into both waveguide arms of the AMZI, based on a balanced photocurrent measured with the balanced receiver, to bring the balanced photocurrent to substantially zero. | Described are various configurations of integrated wavelength lockers including asymmetric Mach-Zehnder interferometers (AMZIs) and associated detectors. Various embodiments provide improved wavelength-locking accuracy by using an active tuning element in the AMZI to achieve an operational position with high locking sensitivity, a coherent receiver to reduce the frequency-dependence of the locking sensitivity, and/or a temperature sensor and/or strain gauge to computationally correct for the effect of temperature or strain changes.1. A method for locking a frequency of a light source of a photonic integrated circuit using an integrated wavelength locker comprising an AMZI with an active tuning element in one interferometer arm, the method comprising:
coupling light emitted by the light source into the AMZI at an input of the AMZI; adjusting a setting of the active tuning element to match a target setting stored in memory, the target setting being associated with a specified locking frequency; measuring a balanced photocurrent at an output of the AMZI; and tuning a frequency of the light source until the measured balanced photocurrent is substantially zero. 2. The method of claim 1, wherein the active tuning element comprises a heater and the setting being adjusted comprises a heater power. 3. The method of claim 1, further comprising measuring at least one of a temperature of the AMZI or a strain in the AMZI, and adjusting the setting of the active tuning element, based on the measured temperature or strain, prior to tuning the frequency of the light source to bring the balanced photocurrent to substantially zero. 4. The method of claim 3, wherein the setting of the active tuning element is adjusted based on the measured temperature or strain by selecting the target setting based on the measured temperature strain from among a plurality of target settings stored for multiple temperatures or levels of strain. 5. The method of claim 3, wherein the setting of the active tuning element is computationally adjusted based on the measured temperature or strain. 6. The method of claim 1, further comprising calibrating the integrated wavelength locker prior to locking the frequency of the light source by:
tuning the frequency of the light source, based on an external reference signal having the specified locking frequency, until the frequency of the light source matches the specified locking frequency; and while the frequency of the light source matches the specified locking frequency, tuning the setting of the active tuning element until a balanced photocurrent measured at the output of the AMZI is substantially zero, and then storing that setting as the target setting in memory. 7. The method of claim 1, wherein the AMZI forms part of a first filter, the integrated wavelength locker comprising a second filter with a second AMZI, a filter period of the second AMZI being smaller than a filter period of the first AMZI, the frequency of the light source being tuned in the first filter up to a frequency error no greater than the filter period of the second AMZI, the method further comprising, following coarse-tuning the frequency of the light source with the first filter, fine-tuning the frequency of the light source with the second filter by:
coupling light emitted by the light source into the second AMZI at an input of the second AMZI; and while the setting of the active tuning element match the target setting stored in memory, measuring a second balanced photocurrent at an output of the second AMZI and tuning the frequency of the light source until the measured second balanced photocurrent is substantially zero. 8. The method of claim 1, further comprising applying a frequency dither to the light source. 9. A method of manufacturing an integrated wavelength locker module, the method comprising:
on a semiconductor substrate, creating a PIC comprising a tunable light source and a wavelength locker, the wavelength locker comprising an AMZI with two waveguide arms and a balanced receiver; and depositing a metal above one of the waveguide arms to form an active tuning element for adjusting an optical-path-length difference between the two waveguide arms. 10. The method of claim 9, further comprising:
creating an electronic control chip including memory storing a target setting of the active tuning element and processing circuitry configured to tune a frequency of the light source coupling light into the AMZI, based on a balanced photocurrent measured with the balanced receiver, to bring the balanced photocurrent to substantially zero; and bonding the PIC and the electronic control chip to a common substrate to form the integrated wavelength locker module. 11. The method of claim 10, further comprising calibrating the integrated wavelength locker module by:
providing a reference signal having a specified locking frequency to an input of the AMZI; and tuning a setting of the active tuning element until a balanced photocurrent measured with the balanced receiver is substantially zero, and then storing that setting as the target setting in the memory. 12. The method of claim 11, wherein the reference signal is provided by an external light source. 13. The method of claim 11, wherein the reference signal is provided by the light source of the PIC following tuning of the light source to the specified locking frequency using an external wavelength filter. 14. The method of claim 10, further comprising creating a strain gauge in the PIC adjacent the AMZI and, following bonding of the PIC and the electronic control chip to the common substrate, measuring a strain in the AMZI and storing the measured strain in the memory. 15. The method of claim 10, further comprising creating a temperature sensor in the PIC adjacent the AMZI, wherein calibrating the integrated wavelength locker module further comprises measuring the temperature of the AMZI and storing the measured temperature in the memory. 16. The method of claim 9, wherein the metal deposited above one of the waveguide arms forms one of a continuous patch or a winding trace. 17. A wavelength locker comprising:
an athermal asymmetric Mach-Zehnder interferometer (AMZI) comprising an input coupler, two waveguide arms coupled to the input coupler at a first end of the waveguide arms, an output coupler coupled to the two waveguide arms at a second end of the waveguide arms and providing at least two output ports, and an active tuning element disposed in one of the waveguide arms and configured to adjust an optical-path-length difference between the two waveguide arms; at least one of a temperature sensor for measuring a temperature of the AMZI or a strain gauge for measuring a level of strain in the AMZI; at least two photodetectors each placed at a respective one of the at least two output ports, the at least two photodetectors forming, together with the output coupler, a balanced receiver; and memory storing temperature-dependent or strain-dependent target settings of the active tuning element for multiple temperatures of the AMZI or multiple levels of strain in the AMZI, the target settings corresponding to balanced photocurrents measured with the balanced receiver being substantially zero at a specified locking frequency and at respective measured temperatures or levels of strain. 18. The wavelength locker of claim 17, wherein the active tuning element comprises a heater. 19. The wavelength locker of claim 17, wherein the AMZI and the photodetectors are integrated in a photonic integrated circuit. 20. The wavelength locker of claim 17, further comprising circuitry configured to set the active tuning element to a target setting selected among the temperature-dependent or strain-dependent target settings based on a measured temperature or level of strain, and to tune a frequency of a light source coupling light via the input coupler into both waveguide arms of the AMZI, based on a balanced photocurrent measured with the balanced receiver, to bring the balanced photocurrent to substantially zero. | 2,800 |
12,367 | 12,367 | 16,592,054 | 2,846 | Systems, apparatus, and methods related to an automated footwear platform including motor control techniques. The motor control techniques can include operations such as segmenting a pre-defined travel distance, defining a plurality of moves, creating a plurality of motion profiles, and commanding movements. The plurality of moves can utilize the segmented travel distance for a drive mechanism associated with the footwear platform. Each motion profile of the plurality of motion profiles can include one or more moves from the plurality of moves. Commanding movement of the drive mechanism can be based on selection of one or more motion profiles from the plurality of motion profiles. | 1. (canceled) 2. A motor control method comprising:
receiving, using a processor circuit coupled to a drive system including a motor, a signal indicative of an incoming battery voltage being supplied to the motor; comparing, using the processor circuit, the incoming battery voltage to a threshold voltage to determine if the incoming battery voltage transgresses the threshold voltage; upon determining that the incoming battery voltage transgresses the threshold voltage, controlling, using the processor circuit, the motor within the drive system to produce a first operating characteristic corresponding to operation of the motor at a first operating voltage; and upon determining that the incoming battery voltage does not transgress the threshold voltage, controlling the motor to produce a second operating characteristic corresponding to operation of the motor at a second operating voltage. 3. The motor control method of claim 2, wherein the first operating characteristic and the second operating characteristic are selected from a group of operating characteristics including:
velocity; and torque. 4. The motor control method of claim 2, wherein the drive system is subject to a constant load. 5. The motor control method of claim 2, wherein the first operating voltage corresponds to a voltage above the threshold voltage. 6. The motor control method of claim 2, wherein the first operating voltage is equal to the threshold voltage. 7. The motor control method of claim 2, wherein the second operating voltage corresponds to a voltage below the threshold voltage. 8. The motor control method of claim 7, wherein the second operating voltage corresponds to a minimum effective operating voltage associated with the drive system. 9. The motor control method of claim 2, wherein if the incoming battery voltage is above the first operating voltage, operating the motor includes regulating a voltage supplied to the motor to cause the motor to operate with the first operating characteristic corresponding to operation of the motor with a constant load at the first operating voltage at a 100% duty cycle. 10. The motor control method of claim 2, further comprising:
calculating the threshold voltage by determining a voltage at which the motor can produce a selected velocity with a constant operating load while being operated at 100% duty cycle. 11. A motor control method comprising:
determining a first target velocity for operating a motor when a voltage being supplied to the motor is above a threshold voltage; determining a second target velocity for operating a motor when the voltage being supplied to the motor is below the threshold voltage; measuring a first voltage being supplied by a battery; operating a motor at the first target velocity based on determining that the first voltage is at or above the threshold voltage; and operating the motor at the second target velocity based on determining that the first voltage is below the threshold voltage. 12. The motor control method of claim 11, further comprising:
calculating the threshold voltage by determining a voltage at which the motor can produce a selected velocity with a constant operating load while being operated at 100% duty cycle. 13. A system comprising:
a battery with an operating voltage range; a motor with a drive system; and a processor circuit including a processor and a memory device, the memory device containing instruction that, when executed by the processor circuit, cause the system to perform operations including: receiving a signal indicative of an incoming battery voltage being supplied to the motor by the battery; comparing the incoming battery voltage to a threshold voltage to determine if the incoming battery voltage transgresses the threshold voltage; upon determining that the incoming battery voltage transgresses the threshold voltage, controlling the motor within the drive system to produce a first output speed corresponding to operation of the motor at a first operating voltage; and upon determining that the incoming battery voltage does not transgress the threshold voltage, controlling the motor to produce a second output speed corresponding to operation of the motor at a second operating voltage. 14. The system claim 13, wherein the drive system is subject to a constant load. 15. The motor control method of claim 13, wherein the first operating voltage corresponds to a voltage above the threshold voltage. 16. The system claim 13, wherein the first operating voltage is equal to the threshold voltage. 17. The system claim 13, wherein the second operating voltage corresponds to a voltage below the threshold voltage. 18. The system claim 17, wherein the second operating voltage corresponds to a minimum effective operating voltage associated with the drive system. 19. The system claim 13, wherein if the incoming battery voltage is above the first operating voltage, operating the motor includes regulating a voltage supplied to the motor to cause the motor to operate with the first output speed corresponding to operation of the motor with a constant load at the first operating voltage at a 100% duty cycle. 20. The system claim 13, wherein the operations further comprise:
calculating the threshold voltage by determining a voltage at which the motor can produce a selected velocity with a constant operating load while being operated at 100% duty cycle. 21. A non-transitory computer-readable medium comprising instructions that, when executed by a motor controller, cause the motor controller to perform operations comprising:
receiving a signal indicative of an incoming battery voltage being supplied to the motor by the battery; comparing the incoming battery voltage to a threshold voltage to determine if the incoming battery voltage transgresses the threshold voltage; upon determining that the incoming battery voltage transgresses the threshold voltage, controlling the motor within the drive system to produce an first output speed corresponding to operation of the motor at a first operating voltage; and upon determining that the incoming battery voltage does not transgress the threshold voltage, controlling the motor to produce a second output speed corresponding to operation of the motor at a second operating voltage. | Systems, apparatus, and methods related to an automated footwear platform including motor control techniques. The motor control techniques can include operations such as segmenting a pre-defined travel distance, defining a plurality of moves, creating a plurality of motion profiles, and commanding movements. The plurality of moves can utilize the segmented travel distance for a drive mechanism associated with the footwear platform. Each motion profile of the plurality of motion profiles can include one or more moves from the plurality of moves. Commanding movement of the drive mechanism can be based on selection of one or more motion profiles from the plurality of motion profiles.1. (canceled) 2. A motor control method comprising:
receiving, using a processor circuit coupled to a drive system including a motor, a signal indicative of an incoming battery voltage being supplied to the motor; comparing, using the processor circuit, the incoming battery voltage to a threshold voltage to determine if the incoming battery voltage transgresses the threshold voltage; upon determining that the incoming battery voltage transgresses the threshold voltage, controlling, using the processor circuit, the motor within the drive system to produce a first operating characteristic corresponding to operation of the motor at a first operating voltage; and upon determining that the incoming battery voltage does not transgress the threshold voltage, controlling the motor to produce a second operating characteristic corresponding to operation of the motor at a second operating voltage. 3. The motor control method of claim 2, wherein the first operating characteristic and the second operating characteristic are selected from a group of operating characteristics including:
velocity; and torque. 4. The motor control method of claim 2, wherein the drive system is subject to a constant load. 5. The motor control method of claim 2, wherein the first operating voltage corresponds to a voltage above the threshold voltage. 6. The motor control method of claim 2, wherein the first operating voltage is equal to the threshold voltage. 7. The motor control method of claim 2, wherein the second operating voltage corresponds to a voltage below the threshold voltage. 8. The motor control method of claim 7, wherein the second operating voltage corresponds to a minimum effective operating voltage associated with the drive system. 9. The motor control method of claim 2, wherein if the incoming battery voltage is above the first operating voltage, operating the motor includes regulating a voltage supplied to the motor to cause the motor to operate with the first operating characteristic corresponding to operation of the motor with a constant load at the first operating voltage at a 100% duty cycle. 10. The motor control method of claim 2, further comprising:
calculating the threshold voltage by determining a voltage at which the motor can produce a selected velocity with a constant operating load while being operated at 100% duty cycle. 11. A motor control method comprising:
determining a first target velocity for operating a motor when a voltage being supplied to the motor is above a threshold voltage; determining a second target velocity for operating a motor when the voltage being supplied to the motor is below the threshold voltage; measuring a first voltage being supplied by a battery; operating a motor at the first target velocity based on determining that the first voltage is at or above the threshold voltage; and operating the motor at the second target velocity based on determining that the first voltage is below the threshold voltage. 12. The motor control method of claim 11, further comprising:
calculating the threshold voltage by determining a voltage at which the motor can produce a selected velocity with a constant operating load while being operated at 100% duty cycle. 13. A system comprising:
a battery with an operating voltage range; a motor with a drive system; and a processor circuit including a processor and a memory device, the memory device containing instruction that, when executed by the processor circuit, cause the system to perform operations including: receiving a signal indicative of an incoming battery voltage being supplied to the motor by the battery; comparing the incoming battery voltage to a threshold voltage to determine if the incoming battery voltage transgresses the threshold voltage; upon determining that the incoming battery voltage transgresses the threshold voltage, controlling the motor within the drive system to produce a first output speed corresponding to operation of the motor at a first operating voltage; and upon determining that the incoming battery voltage does not transgress the threshold voltage, controlling the motor to produce a second output speed corresponding to operation of the motor at a second operating voltage. 14. The system claim 13, wherein the drive system is subject to a constant load. 15. The motor control method of claim 13, wherein the first operating voltage corresponds to a voltage above the threshold voltage. 16. The system claim 13, wherein the first operating voltage is equal to the threshold voltage. 17. The system claim 13, wherein the second operating voltage corresponds to a voltage below the threshold voltage. 18. The system claim 17, wherein the second operating voltage corresponds to a minimum effective operating voltage associated with the drive system. 19. The system claim 13, wherein if the incoming battery voltage is above the first operating voltage, operating the motor includes regulating a voltage supplied to the motor to cause the motor to operate with the first output speed corresponding to operation of the motor with a constant load at the first operating voltage at a 100% duty cycle. 20. The system claim 13, wherein the operations further comprise:
calculating the threshold voltage by determining a voltage at which the motor can produce a selected velocity with a constant operating load while being operated at 100% duty cycle. 21. A non-transitory computer-readable medium comprising instructions that, when executed by a motor controller, cause the motor controller to perform operations comprising:
receiving a signal indicative of an incoming battery voltage being supplied to the motor by the battery; comparing the incoming battery voltage to a threshold voltage to determine if the incoming battery voltage transgresses the threshold voltage; upon determining that the incoming battery voltage transgresses the threshold voltage, controlling the motor within the drive system to produce an first output speed corresponding to operation of the motor at a first operating voltage; and upon determining that the incoming battery voltage does not transgress the threshold voltage, controlling the motor to produce a second output speed corresponding to operation of the motor at a second operating voltage. | 2,800 |
12,368 | 12,368 | 16,575,533 | 2,861 | A multi-dimensional liquid analysis system includes a flow splitter for separating mobile phase outflow from a first dimension liquid analysis system into first and second liquid split outlet flows. Volumetric flow rate control of the split outlet flows is provided by a flow control pump which withdraws one of the split outlet flows from the flow splitter at a controlled withdrawal flow rate to define the other split outlet flow rate as the difference between the outflow rate from the first dimension system and the withdrawal flow rate. In this manner, accurate and consistent flow division can be accomplished, which is particularly useful for multi-dimensional liquid analysis. | 1. A multi-dimensional liquid analysis system, comprising:
a first separation system including a first separation column, the first separation column configured to chromatographically separate a sample within a liquid mobile phase and to provide a first dimension outflow having a first outflow rate; a flow splitter fluidly coupled to the first dimension outflow, the flow splitter configured to split the first dimension outflow into a first split outlet flow and a second split outlet flow; a second separation system including a sample loop and a second separation column, wherein the second separation system is configured such that the sample loop receives a sample volume from the second split outlet flow, and wherein the second separation column is configured to chromatographically separate the sample volume from the second split outlet flow; and a flow controller fluidly coupled to and located downstream of one of the first split outlet flow and the second split outlet flow, the flow controller configured to control the flow rate of the one of the first split outlet flow and the second split outlet flow from the flow splitter at a controlled flow rate to obtain, in the sample volume from the second split outlet flow, a representative sampling of compounds in the first dimension outflow for separation in the second separation system. 2. The multi-dimensional liquid analysis system of claim 1, further comprising:
a flow restrictor restricting the first split outlet flow to create a fluid pressure at the flow splitter of 1-1000 kilopascals. 3. The multi-dimensional liquid analysis system of claim 1,
wherein the flow controller is a positive displacement pump configured to withdraw the one of the first split outlet flow and the second split outlet flow from the flow splitter at the controlled flow rate while operating in a negative displacement mode. 4. The multi-dimensional liquid analysis system of claim 1, wherein the controlled flow rate is controlled according to:
F
c
≤
V
s
(
T
2
a
+
T
2
e
)
,
wherein:
Fc is the flow rate for the second split outlet flow,
Vs≥Vd,
Vd is a volume of the second split outlet flow to be analyzed by the second separation column,
T2a is an analysis time of the second separation column, and
T2e is an equilibration time of the second separation column. 5. The multi-dimensional liquid analysis system of claim 1, further comprising:
a multiple-port injection valve configured to inject the sample volume from the second split outlet flow into the second separation column. 6. The multi-dimensional liquid analysis system of claim 1, wherein to control the flow rate of the one of the first split outlet flow and the second split outlet flow from the flow splitter, the flow controller is configured to produce a flow rate for the second split outlet flow that is controlled according to:
F
c
≤
V
L
(
T
2
a
+
T
2
e
)
,
wherein:
Fc is the flow rate for the second split outlet flow,
VL is a volume of the sample loop,
T2a is an analysis time of the second separation column, and
T2e is an equilibration time of the second separation column. 7. A multi-dimensional liquid analysis system, comprising:
a first separation system including a first separation column, the first separation column configured to chromatographically separate a sample within a liquid mobile phase and to provide a liquid mobile phase into a first dimension outflow having a first outflow rate; a flow splitter fluidly coupled to the first dimension outflow, the flow splitter configured to split the first dimension outflow into a first split outlet flow and a second split outlet flow; a second separation system including a multiple-port injection valve comprising a sample loop, the second separation system also including a second separation column, wherein the multiple-port injection valve is configured to receive, at a port, the second split outlet flow such that the sample loop receives a sample volume from the second split outlet flow, and wherein the second separation column is configured to chromatographically separate the sample volume from the second split outlet flow; and a flow controller fluidly coupled to and located downstream of one of the first split outlet flow and the second split outlet flow, the flow controller configured to control the one of the first split outlet flow and the second split outlet flow from the flow splitter at a controlled flow rate to obtain, in the sample volume from the second split outlet flow, a representative sampling of compounds in the first dimension outflow for separation in the second separation system. 8. The multi-dimensional liquid analysis system of claim 7, further comprising:
a flow restrictor restricting the first split outlet low to create a fluid pressure at the flow splitter of 1-1000 kilopascals. 9. The multi-dimensional liquid analysis system of claim 7, wherein the flow controller comprises a positive displacement pump configured to withdraw the one of the first split outlet flow and the second split outlet flow from the flow splitter while operating in a negative displacement mode. 10. The multi-dimensional liquid analysis system of claim 7, wherein the controlled flow rate is controlled according to:
F
c
≤
V
s
(
T
2
a
+
T
2
e
)
,
wherein:
Fc is the flow rate for the second split outlet flow,
Vs≥Vd,
Vd is a volume of the second split outlet flow to be analyzed by the second separation column,
T2a is an analysis time of the second separation column, and
T2e is an equilibration time of the second separation column. 11. The multi-dimensional liquid analysis system of claim 7,
wherein the multiple-port injection valve is configured to inject the sample volume from the second split outlet flow into the second separation column. 12. The multi-dimensional liquid analysis system of claim 7, wherein the controlled flow rate is controlled according to:
F
c
≤
V
L
(
T
2
a
+
T
2
e
)
,
wherein:
Fc is the flow rate for the second split outlet flow,
VL is a volume of the sample loop,
T2a is an analysis time of the second separation column, and
T2e is an equilibration time of the second separation column. 13. A method of multi-dimensional liquid analysis, comprising:
chromatographically separating, using a first separation column, a sample within a liquid mobile phase and providing, from the first separation column, a first dimension outflow having a first outflow rate; splitting, with a flow splitter having an inlet fluidly coupled to the first dimension outflow, the first dimension outflow into a first split outlet flow and a second split outlet flow; controlling, with a flow controller fluidly coupled to and located downstream of one of the first split outlet flow and the second split outlet flow, the one of the first split outlet flow and the second split outlet flow from the flow splitter at a controlled flow rate to obtain, in a sample volume from the second split outlet flow, a representative sampling of compounds in the first dimension outflow for separation in a second separation system; receiving, with a sample loop, the sample volume from the second split outlet flow; and chromatographically separating, using a second separation column, the sample volume from the second split outlet flow. 14. The method of claim 13, further comprising:
modifying, without modifying the first outflow rate of the first dimension outflow, the flow rate of the one of the first split outlet flow and the second split outlet flow from the flow splitter by reconfiguring the flow controller. 15. The method of claim 13, further comprising:
restricting, with a flow restrictor, the first split outlet flow to create a fluid pressure at the flow splitter of 1-1000 kilopascals. 16. The method of claim 13, wherein the flow controller is a positive displacement pump, the method further comprising:
configuring the flow controller in a negative displacement mode to withdraw the one of the first split outlet flow and the second split outlet flow from the flow splitter at the controlled flow rate. 17. The method of claim 13, further comprising:
configuring a multiple-port injection valve to inject the sample volume from the second split outlet flow into the second separation column. 18. The method of claim 17, wherein the multiple-port injection valve includes a port configured to receive the second split outlet flow. 19. The method of claim 13, further comprising:
configuring the flow controller to produce a flow rate for the second split outlet flow according to:
F
c
≤
V
s
(
T
2
a
+
T
2
e
)
,
wherein:
Fc is the flow rate for the second split outlet flow,
Vs≥Vd,
Vd is a volume of the second split outlet flow to be analyzed by the second separation column,
T2a is an analysis time of the second separation column, and
T2e is an equilibration time of the second separation column. 20. The method of claim 13, further comprising:
configuring the flow controller to produce a flow rate for the second split outlet flow according to:
F
c
≤
V
L
(
T
2
a
+
T
2
e
)
,
wherein:
Fc is the flow rate for the second split outlet flow,
VL is a volume of the sample loop,
T2a is an analysis time of the second separation column, and
T2e is an equilibration time of the second separation column. | A multi-dimensional liquid analysis system includes a flow splitter for separating mobile phase outflow from a first dimension liquid analysis system into first and second liquid split outlet flows. Volumetric flow rate control of the split outlet flows is provided by a flow control pump which withdraws one of the split outlet flows from the flow splitter at a controlled withdrawal flow rate to define the other split outlet flow rate as the difference between the outflow rate from the first dimension system and the withdrawal flow rate. In this manner, accurate and consistent flow division can be accomplished, which is particularly useful for multi-dimensional liquid analysis.1. A multi-dimensional liquid analysis system, comprising:
a first separation system including a first separation column, the first separation column configured to chromatographically separate a sample within a liquid mobile phase and to provide a first dimension outflow having a first outflow rate; a flow splitter fluidly coupled to the first dimension outflow, the flow splitter configured to split the first dimension outflow into a first split outlet flow and a second split outlet flow; a second separation system including a sample loop and a second separation column, wherein the second separation system is configured such that the sample loop receives a sample volume from the second split outlet flow, and wherein the second separation column is configured to chromatographically separate the sample volume from the second split outlet flow; and a flow controller fluidly coupled to and located downstream of one of the first split outlet flow and the second split outlet flow, the flow controller configured to control the flow rate of the one of the first split outlet flow and the second split outlet flow from the flow splitter at a controlled flow rate to obtain, in the sample volume from the second split outlet flow, a representative sampling of compounds in the first dimension outflow for separation in the second separation system. 2. The multi-dimensional liquid analysis system of claim 1, further comprising:
a flow restrictor restricting the first split outlet flow to create a fluid pressure at the flow splitter of 1-1000 kilopascals. 3. The multi-dimensional liquid analysis system of claim 1,
wherein the flow controller is a positive displacement pump configured to withdraw the one of the first split outlet flow and the second split outlet flow from the flow splitter at the controlled flow rate while operating in a negative displacement mode. 4. The multi-dimensional liquid analysis system of claim 1, wherein the controlled flow rate is controlled according to:
F
c
≤
V
s
(
T
2
a
+
T
2
e
)
,
wherein:
Fc is the flow rate for the second split outlet flow,
Vs≥Vd,
Vd is a volume of the second split outlet flow to be analyzed by the second separation column,
T2a is an analysis time of the second separation column, and
T2e is an equilibration time of the second separation column. 5. The multi-dimensional liquid analysis system of claim 1, further comprising:
a multiple-port injection valve configured to inject the sample volume from the second split outlet flow into the second separation column. 6. The multi-dimensional liquid analysis system of claim 1, wherein to control the flow rate of the one of the first split outlet flow and the second split outlet flow from the flow splitter, the flow controller is configured to produce a flow rate for the second split outlet flow that is controlled according to:
F
c
≤
V
L
(
T
2
a
+
T
2
e
)
,
wherein:
Fc is the flow rate for the second split outlet flow,
VL is a volume of the sample loop,
T2a is an analysis time of the second separation column, and
T2e is an equilibration time of the second separation column. 7. A multi-dimensional liquid analysis system, comprising:
a first separation system including a first separation column, the first separation column configured to chromatographically separate a sample within a liquid mobile phase and to provide a liquid mobile phase into a first dimension outflow having a first outflow rate; a flow splitter fluidly coupled to the first dimension outflow, the flow splitter configured to split the first dimension outflow into a first split outlet flow and a second split outlet flow; a second separation system including a multiple-port injection valve comprising a sample loop, the second separation system also including a second separation column, wherein the multiple-port injection valve is configured to receive, at a port, the second split outlet flow such that the sample loop receives a sample volume from the second split outlet flow, and wherein the second separation column is configured to chromatographically separate the sample volume from the second split outlet flow; and a flow controller fluidly coupled to and located downstream of one of the first split outlet flow and the second split outlet flow, the flow controller configured to control the one of the first split outlet flow and the second split outlet flow from the flow splitter at a controlled flow rate to obtain, in the sample volume from the second split outlet flow, a representative sampling of compounds in the first dimension outflow for separation in the second separation system. 8. The multi-dimensional liquid analysis system of claim 7, further comprising:
a flow restrictor restricting the first split outlet low to create a fluid pressure at the flow splitter of 1-1000 kilopascals. 9. The multi-dimensional liquid analysis system of claim 7, wherein the flow controller comprises a positive displacement pump configured to withdraw the one of the first split outlet flow and the second split outlet flow from the flow splitter while operating in a negative displacement mode. 10. The multi-dimensional liquid analysis system of claim 7, wherein the controlled flow rate is controlled according to:
F
c
≤
V
s
(
T
2
a
+
T
2
e
)
,
wherein:
Fc is the flow rate for the second split outlet flow,
Vs≥Vd,
Vd is a volume of the second split outlet flow to be analyzed by the second separation column,
T2a is an analysis time of the second separation column, and
T2e is an equilibration time of the second separation column. 11. The multi-dimensional liquid analysis system of claim 7,
wherein the multiple-port injection valve is configured to inject the sample volume from the second split outlet flow into the second separation column. 12. The multi-dimensional liquid analysis system of claim 7, wherein the controlled flow rate is controlled according to:
F
c
≤
V
L
(
T
2
a
+
T
2
e
)
,
wherein:
Fc is the flow rate for the second split outlet flow,
VL is a volume of the sample loop,
T2a is an analysis time of the second separation column, and
T2e is an equilibration time of the second separation column. 13. A method of multi-dimensional liquid analysis, comprising:
chromatographically separating, using a first separation column, a sample within a liquid mobile phase and providing, from the first separation column, a first dimension outflow having a first outflow rate; splitting, with a flow splitter having an inlet fluidly coupled to the first dimension outflow, the first dimension outflow into a first split outlet flow and a second split outlet flow; controlling, with a flow controller fluidly coupled to and located downstream of one of the first split outlet flow and the second split outlet flow, the one of the first split outlet flow and the second split outlet flow from the flow splitter at a controlled flow rate to obtain, in a sample volume from the second split outlet flow, a representative sampling of compounds in the first dimension outflow for separation in a second separation system; receiving, with a sample loop, the sample volume from the second split outlet flow; and chromatographically separating, using a second separation column, the sample volume from the second split outlet flow. 14. The method of claim 13, further comprising:
modifying, without modifying the first outflow rate of the first dimension outflow, the flow rate of the one of the first split outlet flow and the second split outlet flow from the flow splitter by reconfiguring the flow controller. 15. The method of claim 13, further comprising:
restricting, with a flow restrictor, the first split outlet flow to create a fluid pressure at the flow splitter of 1-1000 kilopascals. 16. The method of claim 13, wherein the flow controller is a positive displacement pump, the method further comprising:
configuring the flow controller in a negative displacement mode to withdraw the one of the first split outlet flow and the second split outlet flow from the flow splitter at the controlled flow rate. 17. The method of claim 13, further comprising:
configuring a multiple-port injection valve to inject the sample volume from the second split outlet flow into the second separation column. 18. The method of claim 17, wherein the multiple-port injection valve includes a port configured to receive the second split outlet flow. 19. The method of claim 13, further comprising:
configuring the flow controller to produce a flow rate for the second split outlet flow according to:
F
c
≤
V
s
(
T
2
a
+
T
2
e
)
,
wherein:
Fc is the flow rate for the second split outlet flow,
Vs≥Vd,
Vd is a volume of the second split outlet flow to be analyzed by the second separation column,
T2a is an analysis time of the second separation column, and
T2e is an equilibration time of the second separation column. 20. The method of claim 13, further comprising:
configuring the flow controller to produce a flow rate for the second split outlet flow according to:
F
c
≤
V
L
(
T
2
a
+
T
2
e
)
,
wherein:
Fc is the flow rate for the second split outlet flow,
VL is a volume of the sample loop,
T2a is an analysis time of the second separation column, and
T2e is an equilibration time of the second separation column. | 2,800 |
12,369 | 12,369 | 16,168,689 | 2,878 | A compact motion-activated light with flexible arm that enables a user to illuminate remote areas that would otherwise be difficult or impossible to illuminate. The device contains its own power source so that it does not need to be connected to an electrical outlet, enabling the user to place the device in areas where there are not electrical outlets or even no wired electricity such as basements, attics or garages. | 1. A compact motion-activated utility light with adjustable arm, the compact motion-activated utility light with adjustable arm comprising:
a waterproof body member; a waterproof light; a power source, within the waterproof body member; at least one adjustable arm connecting the waterproof light to the waterproof body member, wherein the adjustable arm:
is flexible such that it can be shaped into any shape desired by a user; and
physically supports the waterproof light; and
a motion detector situated on the waterproof body member and directed away from the waterproof body member so as to detect motion a distance away from the waterproof body member and configured to activate the power source when motion is detected; wherein the power source is configured to energize the waterproof light when the motion detector senses motion. 2. The compact motion-activated utility light with adjustable arm of claim 1 further comprising:
a waterproof light detector situated on the waterproof body member and directed away from the waterproof body member so as to detect ambient waterproof light levels and configured to active the power source when ambient waterproof light falls below a predetermined threshold. 3. The compact motion-activated utility light with adjustable arm of claim 2 further comprising:
a timer, wherein the timer de-energizes the power source after a predetermined amount of time. 4. The compact motion-activated utility light with adjustable arm of claim 1 wherein the waterproof light is a light emitting diode. 5. The compact motion-activated utility light with adjustable arm of claim 1 further comprising:
a timer, wherein the timer de-energizes the power source after a predetermined amount of time. 6. The compact motion-activated utility light with adjustable arm of claim 5 further comprising:
a dispenser, wherein the dispenser disperses a substance to freshen the air when the power source de-energizes. 7. The compact motion-activated utility light with adjustable arm of claim 5, wherein the adjustable arm:
physically supports the waterproof body member when the adjustable arm is placed over a surface such that the waterproof body member and the waterproof light are not in direct contact with the surface. 8. A compact motion-activated utility light with adjustable arm, the compact motion-activated utility light with adjustable arm comprising:
a waterproof body member; a waterproof light; a power source within the waterproof body member; at least one adjustable arm connecting the waterproof light to the waterproof body member, wherein the adjustable arm:
is flexible such that it can be shaped into any shape desired by a user; and
physically supports the waterproof light;
a motion detector situated on the waterproof body member and directed away from the waterproof body member so as to detect motion a distance away from the waterproof body member and configured to activate the power source when motion is detected; wherein the power source is configured to energize the waterproof light when the motion detector senses motion; a timer that de-energizes the power source after a predetermined amount of time; and means for attachment, wherein the means for attachment secures the waterproof body member to a desired surface. 9. The compact motion-activated utility light with adjustable arm of claim 8, wherein the means for attachment includes a suction cup. 10. The compact motion-activated utility light with adjustable arm of claim 9, further comprising:
a second suction cup, wherein the second suction cup secures the waterproof light to a second desired surface. 11. The compact motion-activated utility light with adjustable arm of claim 8, wherein the means for attachment includes at least one of:
glue; tape; or stickers. 12. A toilet light system, the toilet light system comprising:
a toilet, the toilet including:
a bowl, wherein the bowl includes a rim around a circumference of the bowl; and
a compact motion-activated utility light with adjustable arm, including:
a waterproof body member on the outside of the toilet bowl;
a waterproof light on the inside of the toilet bowl;
a power source, wherein the power source includes at least one battery;
a battery compartment within the waterproof body member, the battery compartment providing a location for the battery within the waterproof body member;
a settings button, wherein the settings button changes the color of waterproof light from a first color to a second color;
at least one adjustable arm connecting the waterproof light to the waterproof body member, wherein the adjustable arm:
is flexible such that it can be shaped into any shape desired by a user;
rests on the rim;
physically supports the waterproof light within the toilet bowl; and
physically supports the waterproof body member on the outside of the toilet bowl;
a motion detector situated on the waterproof body member and directed away from the waterproof body member so as to detect motion a distance away from the waterproof body member and configured to activate the power source when motion is detected;
wherein the power source is configured to energize the waterproof light when the motion detector senses motion; and
a timer that de-energizes the power source after a predetermined amount of time. 13. The compact motion-activated utility light with adjustable arm of claim 12 wherein the setting button changes the light emitted from a visible wavelength to a short wavelength ultraviolet light. 14. The compact motion-activated utility light with adjustable arm of claim 12, wherein the adjustable arm includes at least one of:
fiber optics; or light pipe. 15. The compact motion-activated utility light with adjustable arm of claim 12 further comprising:
a dispenser that disperses a germicidal spray. 16. The compact motion-activated utility light with adjustable arm of claim 12 further comprising:
a light detector situated on the waterproof body member and directed away from the waterproof body member so as to detect ambient light levels and configured to active the power source when ambient light falls below a predetermined threshold. 17. The compact motion-activated utility light with adjustable arm of claim 16 wherein the settings button further allows a user to deactivate the light detector. 18. The compact motion-activated utility light with adjustable arm of claim 12 further comprising:
a dispenser that disperses a substance to freshen the air when the power source de-energizes. 19. The compact motion-activated utility light with adjustable arm of claim 12 further comprising:
a cavity within the waterproof body member, wherein the cavity receives at least a portion of the adjustable arm. 20. The compact motion-activated utility light with adjustable arm of claim 12 further comprising:
a solar cell, wherein the solar cell recharges the battery. | A compact motion-activated light with flexible arm that enables a user to illuminate remote areas that would otherwise be difficult or impossible to illuminate. The device contains its own power source so that it does not need to be connected to an electrical outlet, enabling the user to place the device in areas where there are not electrical outlets or even no wired electricity such as basements, attics or garages.1. A compact motion-activated utility light with adjustable arm, the compact motion-activated utility light with adjustable arm comprising:
a waterproof body member; a waterproof light; a power source, within the waterproof body member; at least one adjustable arm connecting the waterproof light to the waterproof body member, wherein the adjustable arm:
is flexible such that it can be shaped into any shape desired by a user; and
physically supports the waterproof light; and
a motion detector situated on the waterproof body member and directed away from the waterproof body member so as to detect motion a distance away from the waterproof body member and configured to activate the power source when motion is detected; wherein the power source is configured to energize the waterproof light when the motion detector senses motion. 2. The compact motion-activated utility light with adjustable arm of claim 1 further comprising:
a waterproof light detector situated on the waterproof body member and directed away from the waterproof body member so as to detect ambient waterproof light levels and configured to active the power source when ambient waterproof light falls below a predetermined threshold. 3. The compact motion-activated utility light with adjustable arm of claim 2 further comprising:
a timer, wherein the timer de-energizes the power source after a predetermined amount of time. 4. The compact motion-activated utility light with adjustable arm of claim 1 wherein the waterproof light is a light emitting diode. 5. The compact motion-activated utility light with adjustable arm of claim 1 further comprising:
a timer, wherein the timer de-energizes the power source after a predetermined amount of time. 6. The compact motion-activated utility light with adjustable arm of claim 5 further comprising:
a dispenser, wherein the dispenser disperses a substance to freshen the air when the power source de-energizes. 7. The compact motion-activated utility light with adjustable arm of claim 5, wherein the adjustable arm:
physically supports the waterproof body member when the adjustable arm is placed over a surface such that the waterproof body member and the waterproof light are not in direct contact with the surface. 8. A compact motion-activated utility light with adjustable arm, the compact motion-activated utility light with adjustable arm comprising:
a waterproof body member; a waterproof light; a power source within the waterproof body member; at least one adjustable arm connecting the waterproof light to the waterproof body member, wherein the adjustable arm:
is flexible such that it can be shaped into any shape desired by a user; and
physically supports the waterproof light;
a motion detector situated on the waterproof body member and directed away from the waterproof body member so as to detect motion a distance away from the waterproof body member and configured to activate the power source when motion is detected; wherein the power source is configured to energize the waterproof light when the motion detector senses motion; a timer that de-energizes the power source after a predetermined amount of time; and means for attachment, wherein the means for attachment secures the waterproof body member to a desired surface. 9. The compact motion-activated utility light with adjustable arm of claim 8, wherein the means for attachment includes a suction cup. 10. The compact motion-activated utility light with adjustable arm of claim 9, further comprising:
a second suction cup, wherein the second suction cup secures the waterproof light to a second desired surface. 11. The compact motion-activated utility light with adjustable arm of claim 8, wherein the means for attachment includes at least one of:
glue; tape; or stickers. 12. A toilet light system, the toilet light system comprising:
a toilet, the toilet including:
a bowl, wherein the bowl includes a rim around a circumference of the bowl; and
a compact motion-activated utility light with adjustable arm, including:
a waterproof body member on the outside of the toilet bowl;
a waterproof light on the inside of the toilet bowl;
a power source, wherein the power source includes at least one battery;
a battery compartment within the waterproof body member, the battery compartment providing a location for the battery within the waterproof body member;
a settings button, wherein the settings button changes the color of waterproof light from a first color to a second color;
at least one adjustable arm connecting the waterproof light to the waterproof body member, wherein the adjustable arm:
is flexible such that it can be shaped into any shape desired by a user;
rests on the rim;
physically supports the waterproof light within the toilet bowl; and
physically supports the waterproof body member on the outside of the toilet bowl;
a motion detector situated on the waterproof body member and directed away from the waterproof body member so as to detect motion a distance away from the waterproof body member and configured to activate the power source when motion is detected;
wherein the power source is configured to energize the waterproof light when the motion detector senses motion; and
a timer that de-energizes the power source after a predetermined amount of time. 13. The compact motion-activated utility light with adjustable arm of claim 12 wherein the setting button changes the light emitted from a visible wavelength to a short wavelength ultraviolet light. 14. The compact motion-activated utility light with adjustable arm of claim 12, wherein the adjustable arm includes at least one of:
fiber optics; or light pipe. 15. The compact motion-activated utility light with adjustable arm of claim 12 further comprising:
a dispenser that disperses a germicidal spray. 16. The compact motion-activated utility light with adjustable arm of claim 12 further comprising:
a light detector situated on the waterproof body member and directed away from the waterproof body member so as to detect ambient light levels and configured to active the power source when ambient light falls below a predetermined threshold. 17. The compact motion-activated utility light with adjustable arm of claim 16 wherein the settings button further allows a user to deactivate the light detector. 18. The compact motion-activated utility light with adjustable arm of claim 12 further comprising:
a dispenser that disperses a substance to freshen the air when the power source de-energizes. 19. The compact motion-activated utility light with adjustable arm of claim 12 further comprising:
a cavity within the waterproof body member, wherein the cavity receives at least a portion of the adjustable arm. 20. The compact motion-activated utility light with adjustable arm of claim 12 further comprising:
a solar cell, wherein the solar cell recharges the battery. | 2,800 |
12,370 | 12,370 | 15,843,477 | 2,887 | A method in a data capture device of dynamically capturing indicia includes: responsive to initiation of a capture session, receiving a quantity indicator defining an expected number of the indicia to be captured during the capture session; capturing an indicium from a set of indicia and storing a string decoded from the indicium in a capture session buffer; responsive to storing the string, determining whether a number of strings in the capture session buffer matches the expected number defined by the quantity indicator; when the number of strings in the capture session buffer does not match the expected number, repeating (i) the capturing and the storing for a further indicium from the set of indicia, and (ii) the determining; and when the number of strings in the capture session buffer matches the expected number, generating a session termination signal to terminate the capture session. | 1. A method in a data capture device of dynamically capturing indicia, comprising:
responsive to initiation of a capture session, receiving a quantity indicator defining an expected number of the indicia to be captured during the capture session; capturing an indicium from a set of indicia and storing a string decoded from the indicium in a capture session buffer; responsive to storing the string, determining whether a number of strings in the capture session buffer matches the expected number defined by the quantity indicator; when the number of strings in the capture session buffer does not match the expected number, repeating: (i) capturing the indicium and storing the string for a further indicium from the set of indicia, and (ii) determining whether the number of strings matches the expected number; and when the number of strings in the capture session buffer matches the expected number, generating a session termination signal to terminate the capture session. 2. The method of claim 1, wherein generating the session termination signal includes controlling a capture module of the data capture device to automatically terminate the capture session. 3. The method of claim 1, wherein generating the session termination signal includes generating operator feedback via an output device of the data capture device. 4. The method of claim 1, wherein receiving the quantity indicator comprises:
generating a prompt for the quantity indicator on a display of the data capture device; and receiving the quantity indicator via an input device of the data capture device. 5. The method of claim 1, wherein receiving the quantity indicator comprises:
capturing a quantity indicium from the set of indicia; and storing the quantity indicator decoded from the quantity indicium. 6. The method of claim 5, wherein capturing the quantity indicium comprises:
retrieving a quantity indicator format definition; capturing a candidate quantity indicium from the set of indicia; and when a candidate string decoded from the candidate quantity indicium complies with the quantity indicator format definition, storing the candidate string as the quantity indicator. 7. The method of claim 1, further comprising:
retrieving a string format definition; and responsive to capturing the indicium and prior to storing the string in the capture session buffer, verifying that the string complies with the string format definition. 8. The method of claim 1, further comprising:
presenting, on a display of the data capture device, a progress indicator including (i) the number of strings in the capture session buffer and (ii) the quantity indicator. 9. The method of claim 1, further comprising:
responsive to termination of the capture session prior to the number of strings in the capture session buffer matching the expected number, generating an error signal. 10. A data capture device for dynamically capturing indicia, comprising:
a data capture module; a memory containing a capture session buffer; and a processor interconnected with the data capture module and the memory, the processor configured to:
responsive to initiation of a capture session, receive a quantity indicator defining an expected number of the indicia to be captured during the capture session;
control the capture module to capture an indicium from a set of indicia, and store a string decoded from the indicium in the capture session buffer;
responsive to storing the string, determine whether a number of strings in the capture session buffer matches the expected number defined by the quantity indicator;
when the number of strings in the capture session buffer does not match the expected number, repeat: (i) capturing the indicium and storing the string for a further indicium from the set of indicia, and (ii) determining whether the number of strings matches the expected number; and
when the number of strings in the capture session buffer matches the expected number, generate a session termination signal to terminate the capture session. 11. The data capture device of claim 10, wherein the processor is further configured to generate the session termination signal by controlling the data capture module to automatically terminate the capture session. 12. The data capture device of claim 10, wherein the processor is further configured to generate the session termination signal by generating operator feedback via an output device of the data capture device. 13. The data capture device of claim 10, wherein the processor is further configured to receive the quantity indicator by:
generating a prompt for the quantity indicator on a display of the data capture device; and receiving the quantity indicator via an input device of the data capture device. 14. The data capture device of claim 10, wherein the processor is further configured to receive the quantity indicator by:
capturing a quantity indicium from the set of indicia; and storing the quantity indicator decoded from the quantity indicium in the memory. 15. The data capture device of claim 14, wherein the processor is configured to capture the quantity indicium by:
retrieving a quantity indicator format definition from the memory; controlling the data capture module to capture a candidate quantity indicium from the set of indicia; and when a candidate string decoded from the candidate quantity indicium complies with the quantity indicator format definition, storing the candidate string in the memory as the quantity indicator. 16. The data capture device of claim 10, wherein the processor is further configured to:
retrieve a string format definition from the memory; and responsive to capturing the indicium and prior to storing the string in the capture session buffer, verify that the string complies with the string format definition. 17. The data capture device of claim 10, wherein the processor is further configured to control a display of the data capture device to present a progress indicator including (i) the number of strings in the capture session buffer and (ii) the quantity indicator. 18. The data capture device of claim 10, wherein the processor is further configured to: responsive to termination of the capture session prior to the number of strings in the capture session buffer matching the expected number, generate an error signal. 19. A non-transitory computer-readable medium storing a plurality of computer-readable instructions executable by a processor of a data capture device to perform a method of dynamically capturing indicia, the method comprising:
responsive to initiation of a capture session, receiving a quantity indicator defining an expected number of the indicia to be captured during the capture session; capturing an indicium from a set of indicia and storing a string decoded from the indicium in a capture session buffer; responsive to storing the string, determining whether a number of strings in the capture session buffer matches the expected number defined by the quantity indicator; when the number of strings in the capture session buffer does not match the expected number, repeating: (i) capturing the indicium and storing the string for a further indicium from the set of indicia, and (ii) determining whether the number of strings matches the expected number; and when the number of strings in the capture session buffer matches the expected number, generating a session termination signal to terminate the capture session. | A method in a data capture device of dynamically capturing indicia includes: responsive to initiation of a capture session, receiving a quantity indicator defining an expected number of the indicia to be captured during the capture session; capturing an indicium from a set of indicia and storing a string decoded from the indicium in a capture session buffer; responsive to storing the string, determining whether a number of strings in the capture session buffer matches the expected number defined by the quantity indicator; when the number of strings in the capture session buffer does not match the expected number, repeating (i) the capturing and the storing for a further indicium from the set of indicia, and (ii) the determining; and when the number of strings in the capture session buffer matches the expected number, generating a session termination signal to terminate the capture session.1. A method in a data capture device of dynamically capturing indicia, comprising:
responsive to initiation of a capture session, receiving a quantity indicator defining an expected number of the indicia to be captured during the capture session; capturing an indicium from a set of indicia and storing a string decoded from the indicium in a capture session buffer; responsive to storing the string, determining whether a number of strings in the capture session buffer matches the expected number defined by the quantity indicator; when the number of strings in the capture session buffer does not match the expected number, repeating: (i) capturing the indicium and storing the string for a further indicium from the set of indicia, and (ii) determining whether the number of strings matches the expected number; and when the number of strings in the capture session buffer matches the expected number, generating a session termination signal to terminate the capture session. 2. The method of claim 1, wherein generating the session termination signal includes controlling a capture module of the data capture device to automatically terminate the capture session. 3. The method of claim 1, wherein generating the session termination signal includes generating operator feedback via an output device of the data capture device. 4. The method of claim 1, wherein receiving the quantity indicator comprises:
generating a prompt for the quantity indicator on a display of the data capture device; and receiving the quantity indicator via an input device of the data capture device. 5. The method of claim 1, wherein receiving the quantity indicator comprises:
capturing a quantity indicium from the set of indicia; and storing the quantity indicator decoded from the quantity indicium. 6. The method of claim 5, wherein capturing the quantity indicium comprises:
retrieving a quantity indicator format definition; capturing a candidate quantity indicium from the set of indicia; and when a candidate string decoded from the candidate quantity indicium complies with the quantity indicator format definition, storing the candidate string as the quantity indicator. 7. The method of claim 1, further comprising:
retrieving a string format definition; and responsive to capturing the indicium and prior to storing the string in the capture session buffer, verifying that the string complies with the string format definition. 8. The method of claim 1, further comprising:
presenting, on a display of the data capture device, a progress indicator including (i) the number of strings in the capture session buffer and (ii) the quantity indicator. 9. The method of claim 1, further comprising:
responsive to termination of the capture session prior to the number of strings in the capture session buffer matching the expected number, generating an error signal. 10. A data capture device for dynamically capturing indicia, comprising:
a data capture module; a memory containing a capture session buffer; and a processor interconnected with the data capture module and the memory, the processor configured to:
responsive to initiation of a capture session, receive a quantity indicator defining an expected number of the indicia to be captured during the capture session;
control the capture module to capture an indicium from a set of indicia, and store a string decoded from the indicium in the capture session buffer;
responsive to storing the string, determine whether a number of strings in the capture session buffer matches the expected number defined by the quantity indicator;
when the number of strings in the capture session buffer does not match the expected number, repeat: (i) capturing the indicium and storing the string for a further indicium from the set of indicia, and (ii) determining whether the number of strings matches the expected number; and
when the number of strings in the capture session buffer matches the expected number, generate a session termination signal to terminate the capture session. 11. The data capture device of claim 10, wherein the processor is further configured to generate the session termination signal by controlling the data capture module to automatically terminate the capture session. 12. The data capture device of claim 10, wherein the processor is further configured to generate the session termination signal by generating operator feedback via an output device of the data capture device. 13. The data capture device of claim 10, wherein the processor is further configured to receive the quantity indicator by:
generating a prompt for the quantity indicator on a display of the data capture device; and receiving the quantity indicator via an input device of the data capture device. 14. The data capture device of claim 10, wherein the processor is further configured to receive the quantity indicator by:
capturing a quantity indicium from the set of indicia; and storing the quantity indicator decoded from the quantity indicium in the memory. 15. The data capture device of claim 14, wherein the processor is configured to capture the quantity indicium by:
retrieving a quantity indicator format definition from the memory; controlling the data capture module to capture a candidate quantity indicium from the set of indicia; and when a candidate string decoded from the candidate quantity indicium complies with the quantity indicator format definition, storing the candidate string in the memory as the quantity indicator. 16. The data capture device of claim 10, wherein the processor is further configured to:
retrieve a string format definition from the memory; and responsive to capturing the indicium and prior to storing the string in the capture session buffer, verify that the string complies with the string format definition. 17. The data capture device of claim 10, wherein the processor is further configured to control a display of the data capture device to present a progress indicator including (i) the number of strings in the capture session buffer and (ii) the quantity indicator. 18. The data capture device of claim 10, wherein the processor is further configured to: responsive to termination of the capture session prior to the number of strings in the capture session buffer matching the expected number, generate an error signal. 19. A non-transitory computer-readable medium storing a plurality of computer-readable instructions executable by a processor of a data capture device to perform a method of dynamically capturing indicia, the method comprising:
responsive to initiation of a capture session, receiving a quantity indicator defining an expected number of the indicia to be captured during the capture session; capturing an indicium from a set of indicia and storing a string decoded from the indicium in a capture session buffer; responsive to storing the string, determining whether a number of strings in the capture session buffer matches the expected number defined by the quantity indicator; when the number of strings in the capture session buffer does not match the expected number, repeating: (i) capturing the indicium and storing the string for a further indicium from the set of indicia, and (ii) determining whether the number of strings matches the expected number; and when the number of strings in the capture session buffer matches the expected number, generating a session termination signal to terminate the capture session. | 2,800 |
12,371 | 12,371 | 15,313,331 | 2,822 | A die bonding/dicing sheet, which can solve the problems of the peeling and the dispersion of an adhesive layer from a pressure sensitive adhesive layer in expanding and further the adhesion thereof to a semiconductor chip, is provided. The die bonding/dicing sheet, which is attached to a support member for mounting a semiconductor element in use, comprising: a peerable first base material; an adhesive layer provided on one surface of the first base material; a pressure sensitive adhesive layer, which covers a whole upper surface of the adhesive layer and has a peripheral part which does not overlap the adhesive layer; and a second base material provided on an upper surface of the pressure sensitive adhesive layer, wherein a plane outer shape of the adhesive layer is larger than a plane outer shape of the support member for mounting the semiconductor element, and a distance between an edge of the adhesive layer and an edge of the support member is 1 mm or more and 12 mm or less. | 1. A die bonding/dicing sheet, which is attached to a support member for mounting a semiconductor element in use, comprising:
a first base material which is peelable; an adhesive layer provided on one surface of the first base material; a pressure sensitive adhesive layer, which covers a whole upper surface of the adhesive layer and has a peripheral part which does not overlap the adhesive layer; and a second base material provided on an upper surface of the pressure sensitive adhesive layer, wherein a plane outer shape of the adhesive layer is larger than a plane outer shape of the support member for mounting the semiconductor element, and a distance between an edge of the adhesive layer and an edge of the support member is 1 mm or more and 12 mm or less. 2. The die bonding/dicing sheet according to claim 1, wherein the support member for mounting the semiconductor element is a semiconductor wafer. 3. The die bonding/dicing sheet according to claim 1, wherein the first base material is long in shape, and a plurality of laminates comprising the adhesive layer, the pressure sensitive adhesive layer and the second base material is arranged in an island-like form on an upper surface of the long-shaped first base material, and a side of the upper surface of the long-shaped first material is wound inward in long direction into a roll-like form. 4. The die bonding/dicing sheet according to claim 1, wherein the second base material is a dicing sheet base material which is not broken when cut by expanding is performed in accordance with a stealth dicing method. 5. A method for producing a semiconductor device, comprising a cutting process by expanding performed in accordance with a stealth dicing method,
wherein the cutting process including the steps: (i) forming a modified part by irradiating a support member for mounting a semiconductor element with a laser; (ii) laminating the support member for mounting the semiconductor element, and a die bonding/dicing sheet having in turn a peelable first base material, an adhesive layer, a pressure sensitive adhesive layer and a second base material, wherein the adhesive layer is exposed by peeling off the first base material of the die bonding/dicing sheet, and subsequently the adhesive layer and the support member for mounting the semiconductor element are laminated; and then (iii) expanding the second base material and the pressure sensitive adhesive layer of the die bonding/dicing sheet to simultaneously cut the support member for mounting the semiconductor element and the adhesive layer, whereby obtaining individual pieces of the support member for mounting the semiconductor element with the adhesive layer, and wherein as the die bonding/dicing sheet in the cutting process, the die bonding/dicing sheet according to claim 1 is used. 6. The method for producing a semiconductor device according to claim 5, wherein the step (iii) is performed under a condition of the expanding that the second base material and the pressure sensitive adhesive layer are not cut. | A die bonding/dicing sheet, which can solve the problems of the peeling and the dispersion of an adhesive layer from a pressure sensitive adhesive layer in expanding and further the adhesion thereof to a semiconductor chip, is provided. The die bonding/dicing sheet, which is attached to a support member for mounting a semiconductor element in use, comprising: a peerable first base material; an adhesive layer provided on one surface of the first base material; a pressure sensitive adhesive layer, which covers a whole upper surface of the adhesive layer and has a peripheral part which does not overlap the adhesive layer; and a second base material provided on an upper surface of the pressure sensitive adhesive layer, wherein a plane outer shape of the adhesive layer is larger than a plane outer shape of the support member for mounting the semiconductor element, and a distance between an edge of the adhesive layer and an edge of the support member is 1 mm or more and 12 mm or less.1. A die bonding/dicing sheet, which is attached to a support member for mounting a semiconductor element in use, comprising:
a first base material which is peelable; an adhesive layer provided on one surface of the first base material; a pressure sensitive adhesive layer, which covers a whole upper surface of the adhesive layer and has a peripheral part which does not overlap the adhesive layer; and a second base material provided on an upper surface of the pressure sensitive adhesive layer, wherein a plane outer shape of the adhesive layer is larger than a plane outer shape of the support member for mounting the semiconductor element, and a distance between an edge of the adhesive layer and an edge of the support member is 1 mm or more and 12 mm or less. 2. The die bonding/dicing sheet according to claim 1, wherein the support member for mounting the semiconductor element is a semiconductor wafer. 3. The die bonding/dicing sheet according to claim 1, wherein the first base material is long in shape, and a plurality of laminates comprising the adhesive layer, the pressure sensitive adhesive layer and the second base material is arranged in an island-like form on an upper surface of the long-shaped first base material, and a side of the upper surface of the long-shaped first material is wound inward in long direction into a roll-like form. 4. The die bonding/dicing sheet according to claim 1, wherein the second base material is a dicing sheet base material which is not broken when cut by expanding is performed in accordance with a stealth dicing method. 5. A method for producing a semiconductor device, comprising a cutting process by expanding performed in accordance with a stealth dicing method,
wherein the cutting process including the steps: (i) forming a modified part by irradiating a support member for mounting a semiconductor element with a laser; (ii) laminating the support member for mounting the semiconductor element, and a die bonding/dicing sheet having in turn a peelable first base material, an adhesive layer, a pressure sensitive adhesive layer and a second base material, wherein the adhesive layer is exposed by peeling off the first base material of the die bonding/dicing sheet, and subsequently the adhesive layer and the support member for mounting the semiconductor element are laminated; and then (iii) expanding the second base material and the pressure sensitive adhesive layer of the die bonding/dicing sheet to simultaneously cut the support member for mounting the semiconductor element and the adhesive layer, whereby obtaining individual pieces of the support member for mounting the semiconductor element with the adhesive layer, and wherein as the die bonding/dicing sheet in the cutting process, the die bonding/dicing sheet according to claim 1 is used. 6. The method for producing a semiconductor device according to claim 5, wherein the step (iii) is performed under a condition of the expanding that the second base material and the pressure sensitive adhesive layer are not cut. | 2,800 |
12,372 | 12,372 | 15,766,475 | 2,853 | Method for the identification of poles (λ n ) and modal vectors (ψ n ) of a road or rail vehicle provided with at least two wheels and in working condition, by means of the analysis of the movements or speeds or accelerations (output of the system) acquired in assigned measuring points of said vehicle, wherein said poles and modal vectors are determined by means of the fitting of the data relating to said outputs of the system on the basis of a mathematical model which describes the interaction between road or railway and said vehicle, characterized by hypothesizing that said vehicle moves at constant speed on a rectilinear trajectory or bend with constant radius, hypothesizing that said vehicle moves on a homogeneous and ergodic surface, whose roughness has a Gaussian distribution and that said at least two wheels move on a profile or on a plurality of profiles parallel with respect to each other, hypo -thesizing that the inlets induced by the road or rail surface on said vehicle cannot be traced back to a sequence of white noises and are correlated with respect to each other in time and/or space. | 1. Method for the estimation of poles (λn), modal vectors (ψn) and operational vectors (αn m, βn ml, χn ml) of a road or rail vehicle provided with at least two wheels, by means of the analysis of the displacements and/or velocities and/or accelerations (outputs of the system) acquired in assigned measuring points of said vehicle,
wherein the inputs induced by the road or rail surface on said vehicle cannot be traced back to a sequence of white noises and wherein said inputs are correlated with respect to each other in time and/or space
the method comprising the steps of:
driving a vehicle at constant speed;
measuring displacements and/or velocities and/or accelerations in assigned measuring points of said vehicle (outputs);
calculating the matrix of the power spectral densities of said outputs (Sq(ω)) acquired at the previous step;
defining a model descriptive of the matrix of the power spectral densities of said outputs (Sq(ω)), said model being dependent on said operational vectors;
determining said poles, modal vectors and operational vectors so that said model fits said matrix of the power spectral densities of said outputs (Sq(ω)), for example by minimizing the squared error;
characterized in that said operational vectors comprise complex exponential terms which allow to explain the effects on said outputs of the time correlation existing between the inputs applied to wheels arranged on different axles. 2. Method according to claim 1 wherein said model descriptive of the matrix of the power spectral densities of said outputs (Sq(ω)) dependent on said operational vectors comprises a linear combination of the operational vectors (αn m, βn ml, χn ml) multiplied times the auto-PSD (Sd(ω)) associated to road or rail profiles parallel to each other which said wheels move on, and times the coherence functions (Γm(ω)) associated to said profiles. 3. Method according to claim 1 wherein said model is a polynomial model and wherein said poles (λn) and said modal vectors (ψn) are estimated by determining eigen-values and eigen-vectors of the companion matrix associated to the characteristic polynomial relative to said polynomial model. 4. Method according to claim 2 further comprising:
the description of the auto-PSD associated to profiles (Sd(ω)) by means of a suitably chosen parametric model and
the estimation of coefficients of said parametric model of the auto-PSD associated to said road or rail profiles (Sd(ω)) 5. Method according to claim 4 further comprising the description of said coherence functions (Γm(ω)), by means of a suitably chosen parametric model and the estimation of coefficients of said parametric model of the coherence functions (Γm(ω)). 6. Program for programmable devices containing instructions which, when carried out, realize the method for estimation of poles (λn), modal vectors (ψn) and operational vectors (αn m, βn ml, χn ml) of a road or rail vehicle, according to claim 1 7. Device for the estimation of poles (λn), modal vectors (ψn) and operational vectors (αn m, βn ml, χn ml) of a road or rail vehicle comprising:
a series of sensors positioned on said vehicle and configured to acquire and store, on an electronic support, data relative to said outputs; and
electronic devices comprising a program for programmable device, according to claim 6. | Method for the identification of poles (λ n ) and modal vectors (ψ n ) of a road or rail vehicle provided with at least two wheels and in working condition, by means of the analysis of the movements or speeds or accelerations (output of the system) acquired in assigned measuring points of said vehicle, wherein said poles and modal vectors are determined by means of the fitting of the data relating to said outputs of the system on the basis of a mathematical model which describes the interaction between road or railway and said vehicle, characterized by hypothesizing that said vehicle moves at constant speed on a rectilinear trajectory or bend with constant radius, hypothesizing that said vehicle moves on a homogeneous and ergodic surface, whose roughness has a Gaussian distribution and that said at least two wheels move on a profile or on a plurality of profiles parallel with respect to each other, hypo -thesizing that the inlets induced by the road or rail surface on said vehicle cannot be traced back to a sequence of white noises and are correlated with respect to each other in time and/or space.1. Method for the estimation of poles (λn), modal vectors (ψn) and operational vectors (αn m, βn ml, χn ml) of a road or rail vehicle provided with at least two wheels, by means of the analysis of the displacements and/or velocities and/or accelerations (outputs of the system) acquired in assigned measuring points of said vehicle,
wherein the inputs induced by the road or rail surface on said vehicle cannot be traced back to a sequence of white noises and wherein said inputs are correlated with respect to each other in time and/or space
the method comprising the steps of:
driving a vehicle at constant speed;
measuring displacements and/or velocities and/or accelerations in assigned measuring points of said vehicle (outputs);
calculating the matrix of the power spectral densities of said outputs (Sq(ω)) acquired at the previous step;
defining a model descriptive of the matrix of the power spectral densities of said outputs (Sq(ω)), said model being dependent on said operational vectors;
determining said poles, modal vectors and operational vectors so that said model fits said matrix of the power spectral densities of said outputs (Sq(ω)), for example by minimizing the squared error;
characterized in that said operational vectors comprise complex exponential terms which allow to explain the effects on said outputs of the time correlation existing between the inputs applied to wheels arranged on different axles. 2. Method according to claim 1 wherein said model descriptive of the matrix of the power spectral densities of said outputs (Sq(ω)) dependent on said operational vectors comprises a linear combination of the operational vectors (αn m, βn ml, χn ml) multiplied times the auto-PSD (Sd(ω)) associated to road or rail profiles parallel to each other which said wheels move on, and times the coherence functions (Γm(ω)) associated to said profiles. 3. Method according to claim 1 wherein said model is a polynomial model and wherein said poles (λn) and said modal vectors (ψn) are estimated by determining eigen-values and eigen-vectors of the companion matrix associated to the characteristic polynomial relative to said polynomial model. 4. Method according to claim 2 further comprising:
the description of the auto-PSD associated to profiles (Sd(ω)) by means of a suitably chosen parametric model and
the estimation of coefficients of said parametric model of the auto-PSD associated to said road or rail profiles (Sd(ω)) 5. Method according to claim 4 further comprising the description of said coherence functions (Γm(ω)), by means of a suitably chosen parametric model and the estimation of coefficients of said parametric model of the coherence functions (Γm(ω)). 6. Program for programmable devices containing instructions which, when carried out, realize the method for estimation of poles (λn), modal vectors (ψn) and operational vectors (αn m, βn ml, χn ml) of a road or rail vehicle, according to claim 1 7. Device for the estimation of poles (λn), modal vectors (ψn) and operational vectors (αn m, βn ml, χn ml) of a road or rail vehicle comprising:
a series of sensors positioned on said vehicle and configured to acquire and store, on an electronic support, data relative to said outputs; and
electronic devices comprising a program for programmable device, according to claim 6. | 2,800 |
12,373 | 12,373 | 15,488,417 | 2,837 | A laminate includes multiple paper layers, with at least one induction coil comprising first and second sets of windings. Two or more paper layers include the sets of windings comprising an electrically-conductive material. The sets of windings may be distributed throughout the laminate layers and provide good wireless induction charging performance in a compact space. | 1. A laminate for accomplishing wireless power transfer, comprising:
at least first and second paper layers, the second paper layer being disposed above the first paper layer in the laminate; an insulating layer disposed above the second paper layer; at least one induction coil comprising an electrically-conductive material, the induction coil further comprising a first set of windings arranged on the first paper layer and a second set of windings arranged on the second paper layer, the first set of windings and the second set of windings being electrically connected in series; wherein the first paper layer, the second paper layer, and the insulating layer encapsulate the induction coil within the laminate. 2. The laminate of claim 1, further comprising at least a second induction coil, the second induction coil comprising a third set of windings arranged on the first paper layer, the second induction coil further comprising a fourth set of windings arranged on the second paper layer, the third set of windings and the fourth set of windings being electrically connected in series, wherein the first paper layer, the second paper layer, and the insulating layer encapsulate the first and second induction coils within the laminate. 3. The laminate of claim 1, further comprising at least a second induction coil, the second induction coil comprising a third set of windings arranged on a third paper layer and a fourth set of windings arranged on a fourth paper layer, the third set of windings and the fourth set of windings being electrically connected in series, wherein the third paper layer, the fourth paper layer, and the insulating layer encapsulate the second induction coil within the laminate. 4. The laminate of claim 1, wherein the first set of windings and the second set of windings are electrically connected by a via, the via extending between the first paper layer and the second paper layer in the laminate. 5. The laminate of claim 4, wherein the via is disposed in a hole in at least one laminate layer. 6. The laminate of claim 1, wherein the electrically-conductive material comprises particulate electrically-conductive material and at least one of the laminate layers is a resin-impregnated paper. 7. (canceled) 8. (canceled) 9. (canceled) 10. The laminate of claim 1, wherein the laminate comprises a high-pressure laminate. 11. The laminate of claim 1 wherein the first set of windings is electrically connected to the second set of windings by a via connecting an innermost winding of the first set of windings to an innermost winding of the second set of windings. 12. The laminate of claim 1, further comprising a decorative layer disposed above the first paper layer and the second paper layer. 13. A laminated surfacing material for inductively charging electronic devices comprising:
at least first and second paper layers, the second paper layer being disposed above the first paper layer; an induction coil comprising an electrically-conductive material, the induction coil further comprising a first set of windings arranged on the first paper layer and a second set of windings arranged on the second paper layer, the first set of windings and the second set of windings being electrically connected in series and including at least two electrical contact pads exposed to the outside of the laminated surfacing material; and the laminated surface material including a decorative layer disposed above the first paper layer and the second paper layer, the decorative layer not including an induction coil or any winding thereof. 14. The surfacing material for inductively charging electronic devices of claim 13, further comprising at least a second induction coil, the second induction coil comprising a third set of windings arranged on the first paper layer, the second induction coil further comprising a fourth set of windings arranged on the second paper layer, the third set of windings and the fourth set of windings being electrically connected in series, wherein the first paper layer, the second paper layer, and the decorative layer encapsulate the first and second induction coils within the laminated surfacing material. 15. The surfacing material for inductively charging electronic devices of claim 13, further comprising at least a second induction coil, the second induction coil comprising a third set of windings arranged on a third paper layer and a fourth set of windings arranged on a fourth paper layer, the third set of windings and the fourth set of windings being electrically connected in series, wherein the third paper layer, the fourth paper layer, and the decorative layer encapsulate the second induction coil within the laminated surfacing material. 16. (canceled) 17. (canceled) 18. The surfacing material for inductively charging electronic devices of claim 13, wherein the induction coil is electrically connected to at least two electrical contact pads exposed to the outside of the laminate, and wherein the at least two electrical contact pads exposed to the outside of the laminate are located on the bottom of the laminate, the at least two electrical contact pads connected to the outside of the laminate through vias. 19. The surfacing material for inductively charging electronic devices of claim 13, wherein at least one of the first set of windings and the second set of windings is in the shape of a spirangle. 20. The surfacing material for inductively charging electronic devices of claim 1, wherein at least one of the first paper layer and the second paper layer is a resin-impregnated paper. 21. The surfacing material for inductively charging electronic devices of claim 13, further including one or more insulating paper layers, the insulating paper layers not including induction coils or any portions thereof, and the insulating paper layers being arranged between paper layers that do include induction coils. 22. A method of making a laminated surface material, the method comprising:
providing at least a first paper layer and a second paper layer; forming an induction coil comprising an electrically-conductive material, the induction coil further comprising a first set of windings arranged on the first paper layer and a second set of windings arranged on the second paper layer; compressing the first paper layer and the second paper layer according to a lamination process, thereby connecting the first set of windings to the second set of windings in series through a via, the via extending from the first paper layer to the second paper layer. 23. The method of claim 22, further comprising:
connecting a driver circuit to the induction coil. 24. (canceled) 25. (canceled) 26. The method of claim 21, further comprising:
charging an electronic device by driving a driver circuit to drive electricity through the plurality of induction coils. 27. (canceled) 28. (canceled) 29. (canceled) | A laminate includes multiple paper layers, with at least one induction coil comprising first and second sets of windings. Two or more paper layers include the sets of windings comprising an electrically-conductive material. The sets of windings may be distributed throughout the laminate layers and provide good wireless induction charging performance in a compact space.1. A laminate for accomplishing wireless power transfer, comprising:
at least first and second paper layers, the second paper layer being disposed above the first paper layer in the laminate; an insulating layer disposed above the second paper layer; at least one induction coil comprising an electrically-conductive material, the induction coil further comprising a first set of windings arranged on the first paper layer and a second set of windings arranged on the second paper layer, the first set of windings and the second set of windings being electrically connected in series; wherein the first paper layer, the second paper layer, and the insulating layer encapsulate the induction coil within the laminate. 2. The laminate of claim 1, further comprising at least a second induction coil, the second induction coil comprising a third set of windings arranged on the first paper layer, the second induction coil further comprising a fourth set of windings arranged on the second paper layer, the third set of windings and the fourth set of windings being electrically connected in series, wherein the first paper layer, the second paper layer, and the insulating layer encapsulate the first and second induction coils within the laminate. 3. The laminate of claim 1, further comprising at least a second induction coil, the second induction coil comprising a third set of windings arranged on a third paper layer and a fourth set of windings arranged on a fourth paper layer, the third set of windings and the fourth set of windings being electrically connected in series, wherein the third paper layer, the fourth paper layer, and the insulating layer encapsulate the second induction coil within the laminate. 4. The laminate of claim 1, wherein the first set of windings and the second set of windings are electrically connected by a via, the via extending between the first paper layer and the second paper layer in the laminate. 5. The laminate of claim 4, wherein the via is disposed in a hole in at least one laminate layer. 6. The laminate of claim 1, wherein the electrically-conductive material comprises particulate electrically-conductive material and at least one of the laminate layers is a resin-impregnated paper. 7. (canceled) 8. (canceled) 9. (canceled) 10. The laminate of claim 1, wherein the laminate comprises a high-pressure laminate. 11. The laminate of claim 1 wherein the first set of windings is electrically connected to the second set of windings by a via connecting an innermost winding of the first set of windings to an innermost winding of the second set of windings. 12. The laminate of claim 1, further comprising a decorative layer disposed above the first paper layer and the second paper layer. 13. A laminated surfacing material for inductively charging electronic devices comprising:
at least first and second paper layers, the second paper layer being disposed above the first paper layer; an induction coil comprising an electrically-conductive material, the induction coil further comprising a first set of windings arranged on the first paper layer and a second set of windings arranged on the second paper layer, the first set of windings and the second set of windings being electrically connected in series and including at least two electrical contact pads exposed to the outside of the laminated surfacing material; and the laminated surface material including a decorative layer disposed above the first paper layer and the second paper layer, the decorative layer not including an induction coil or any winding thereof. 14. The surfacing material for inductively charging electronic devices of claim 13, further comprising at least a second induction coil, the second induction coil comprising a third set of windings arranged on the first paper layer, the second induction coil further comprising a fourth set of windings arranged on the second paper layer, the third set of windings and the fourth set of windings being electrically connected in series, wherein the first paper layer, the second paper layer, and the decorative layer encapsulate the first and second induction coils within the laminated surfacing material. 15. The surfacing material for inductively charging electronic devices of claim 13, further comprising at least a second induction coil, the second induction coil comprising a third set of windings arranged on a third paper layer and a fourth set of windings arranged on a fourth paper layer, the third set of windings and the fourth set of windings being electrically connected in series, wherein the third paper layer, the fourth paper layer, and the decorative layer encapsulate the second induction coil within the laminated surfacing material. 16. (canceled) 17. (canceled) 18. The surfacing material for inductively charging electronic devices of claim 13, wherein the induction coil is electrically connected to at least two electrical contact pads exposed to the outside of the laminate, and wherein the at least two electrical contact pads exposed to the outside of the laminate are located on the bottom of the laminate, the at least two electrical contact pads connected to the outside of the laminate through vias. 19. The surfacing material for inductively charging electronic devices of claim 13, wherein at least one of the first set of windings and the second set of windings is in the shape of a spirangle. 20. The surfacing material for inductively charging electronic devices of claim 1, wherein at least one of the first paper layer and the second paper layer is a resin-impregnated paper. 21. The surfacing material for inductively charging electronic devices of claim 13, further including one or more insulating paper layers, the insulating paper layers not including induction coils or any portions thereof, and the insulating paper layers being arranged between paper layers that do include induction coils. 22. A method of making a laminated surface material, the method comprising:
providing at least a first paper layer and a second paper layer; forming an induction coil comprising an electrically-conductive material, the induction coil further comprising a first set of windings arranged on the first paper layer and a second set of windings arranged on the second paper layer; compressing the first paper layer and the second paper layer according to a lamination process, thereby connecting the first set of windings to the second set of windings in series through a via, the via extending from the first paper layer to the second paper layer. 23. The method of claim 22, further comprising:
connecting a driver circuit to the induction coil. 24. (canceled) 25. (canceled) 26. The method of claim 21, further comprising:
charging an electronic device by driving a driver circuit to drive electricity through the plurality of induction coils. 27. (canceled) 28. (canceled) 29. (canceled) | 2,800 |
12,374 | 12,374 | 15,488,418 | 2,837 | A laminate includes multiple paper layers, with at least one induction coil comprising first and second sets of windings. Two or more paper layers include the sets of windings comprising an electrically-conductive material. The sets of windings may be distributed throughout the laminate layers and provide good wireless induction charging performance in a compact space. | 1. A laminate for accomplishing wireless power transfer, comprising
at least first and second paper layers, the second paper layer being disposed over the first paper layer, the second paper layer including at least first and second vias, the first and second vias including a first conductive material therein; an induction coil comprising a second conductive material, the induction coil comprising a first set of windings arranged on the first paper layer and a second set of windings arranged on the second paper layer, the first and second sets of windings being electrically connected in series by the first via, the second via only being electrically connected to the first set of windings, the second via being electrically accessible on only a first side of the laminate. 2. The laminate of claim 1, further comprising at least a second induction coil, the second induction coil comprising a third set of windings arranged on the first paper layer, the second induction coil further comprising a fourth set of windings arranged on the second paper layer, the third set of windings and the fourth set of windings being electrically connected in series. 3. The laminate of claim 1, further comprising at least a second induction coil, the second induction coil comprising a third set of windings arranged on a third paper layer and a fourth set of windings arranged on a fourth paper layer, the third set of windings and the fourth set of windings being electrically connected in series. 4. The laminate of claim 1 wherein the conductive material comprises particulate conductive material. 5. The laminate of claim 1 wherein at least one of the first set of windings and the second set of windings is in the shape of a spirangle. 6. The laminate of claim 1, wherein the first set of windings is electrically connected to the second set of windings by a via connecting an innermost winding of the first set of windings to an innermost winding of the second set of windings 7. The laminate of claim 3, wherein at least one of the first and second vias is disposed in a hole provided in one or more layers of the laminate. 8. The laminate of claim 1, wherein the induction coil is electrically connected to at least two electrical contact pads exposed to the outside of the laminate, the at least two electrical contact pads being located on the bottom of the laminate, the at least two electrical contact pads connected to the outside of the laminate through the first and second vias. 9. The laminate of claim 1, wherein the first and second conductive materials are the same. 10. The laminate of claim 1, further comprising a third via, the third via only being electrically connected to the second set of windings, the third via being electrically accessible on at least the first side of the laminate, the first side of the laminate being disposed on below the first set of windings arranged on the first paper layer. 11. The laminate of claim 1, wherein the inductive coil comprises has a spiral-in, spiral-out current path, the first set of windings has a first terminus, and the second set of windings has a second terminus, the first and second terminuses sharing a common vertical axis, the first and second terminuses being electrically coupled to one another by a via comprising a conductive material, the first and second sets of windings having reflection symmetry. 12. A method of assembling a charging station device, comprising:
providing a laminate for accomplishing wireless power transfer, the laminate comprising at least first and second paper layers, the second paper layer being disposed over the first paper layer, the second paper layer including at least first and second vias, the first and second vias including a first conductive material therein, the laminate further comprising an induction coil comprising a second conductive material, the induction coil further comprising a first set of windings arranged on the first paper layer and a second set of windings arranged on the second paper layer, the first and second sets of windings being electrically connected in series, the laminate having at least two electrical contact pads accessible from outside of the laminate that are in electrical connection with first and second terminuses of the induction coil; providing an inductive charging station device, the inductive charging station device having an aperture and including a driver circuit configured to drive the induction coil to provide a wireless charge to an electronic device; installing the laminate into the aperture of the inductive charging station device such that the at least two electrical contact pads are in electrical contact with the driver circuit. 13. The method of claim 12, wherein the first set of windings is electrically connected to the second set of windings by a via, the via extending between the first paper layer and the second paper layer. 14. The method of claim 12, wherein providing an inductive charging station device comprises removing a portion of a laminate surface to form the aperture. 15. An inductive charging station comprising:
an aperture in a surface, the aperture configured to accept a laminate, the laminate comprising: at least first and second paper layers, the second paper layer being disposed over the first paper layer, the second paper layer including at least first and second vias, the first and second vias including a first conductive material therein; an induction coil comprising a second conductive material, the induction coil further comprising a first set of windings arranged on the first paper layer and a second set of windings arranged on the second paper layer, the first and second sets of windings being electrically connected in series, the laminate having at least two electrical contact pads accessible from outside of the laminate that are in electrical connection with first and second terminuses of the induction coil; a driver circuit connected to the laminate and configured to drive the induction coil and provide a wireless charge to an electronic device, the driver circuit including: a resonant frequency oscillator; a power transistor; a full wave rectifier; and a voltage regulator. 16. The inductive charging station of claim 15, wherein the laminate further comprises at least a second induction coil, the second induction coil comprising a third set of windings arranged on the first paper layer, the second induction coil further comprising a fourth set of windings arranged on the second paper layer, the third set of windings and the fourth set of windings being electrically connected in series. 17. The inductive charging station of claim 15, wherein the laminate further comprises at least a second induction coil, the second induction coil comprising a third set of windings arranged on a third paper layer and a fourth set of windings arranged on a fourth paper layer, the third set of windings and the fourth set of windings being electrically connected in series. 18. The inductive charging station of claim 15, wherein the first set of windings is electrically connected to the second set of windings by a via connecting an innermost winding of the first set of windings to an innermost winding of the second set of windings. 19. The inductive charging station of claim 18, wherein the via is disposed in a hole in one or more layers of the laminate. 20. The laminate of claim 15, wherein the induction coil is electrically connected to at least two electrical contact pads exposed to the outside of the laminate, the at least two electrical contact pads being located on a bottom surface of the laminate, the at least two electrical contact pads connected to the outside of the laminate through vias. | A laminate includes multiple paper layers, with at least one induction coil comprising first and second sets of windings. Two or more paper layers include the sets of windings comprising an electrically-conductive material. The sets of windings may be distributed throughout the laminate layers and provide good wireless induction charging performance in a compact space.1. A laminate for accomplishing wireless power transfer, comprising
at least first and second paper layers, the second paper layer being disposed over the first paper layer, the second paper layer including at least first and second vias, the first and second vias including a first conductive material therein; an induction coil comprising a second conductive material, the induction coil comprising a first set of windings arranged on the first paper layer and a second set of windings arranged on the second paper layer, the first and second sets of windings being electrically connected in series by the first via, the second via only being electrically connected to the first set of windings, the second via being electrically accessible on only a first side of the laminate. 2. The laminate of claim 1, further comprising at least a second induction coil, the second induction coil comprising a third set of windings arranged on the first paper layer, the second induction coil further comprising a fourth set of windings arranged on the second paper layer, the third set of windings and the fourth set of windings being electrically connected in series. 3. The laminate of claim 1, further comprising at least a second induction coil, the second induction coil comprising a third set of windings arranged on a third paper layer and a fourth set of windings arranged on a fourth paper layer, the third set of windings and the fourth set of windings being electrically connected in series. 4. The laminate of claim 1 wherein the conductive material comprises particulate conductive material. 5. The laminate of claim 1 wherein at least one of the first set of windings and the second set of windings is in the shape of a spirangle. 6. The laminate of claim 1, wherein the first set of windings is electrically connected to the second set of windings by a via connecting an innermost winding of the first set of windings to an innermost winding of the second set of windings 7. The laminate of claim 3, wherein at least one of the first and second vias is disposed in a hole provided in one or more layers of the laminate. 8. The laminate of claim 1, wherein the induction coil is electrically connected to at least two electrical contact pads exposed to the outside of the laminate, the at least two electrical contact pads being located on the bottom of the laminate, the at least two electrical contact pads connected to the outside of the laminate through the first and second vias. 9. The laminate of claim 1, wherein the first and second conductive materials are the same. 10. The laminate of claim 1, further comprising a third via, the third via only being electrically connected to the second set of windings, the third via being electrically accessible on at least the first side of the laminate, the first side of the laminate being disposed on below the first set of windings arranged on the first paper layer. 11. The laminate of claim 1, wherein the inductive coil comprises has a spiral-in, spiral-out current path, the first set of windings has a first terminus, and the second set of windings has a second terminus, the first and second terminuses sharing a common vertical axis, the first and second terminuses being electrically coupled to one another by a via comprising a conductive material, the first and second sets of windings having reflection symmetry. 12. A method of assembling a charging station device, comprising:
providing a laminate for accomplishing wireless power transfer, the laminate comprising at least first and second paper layers, the second paper layer being disposed over the first paper layer, the second paper layer including at least first and second vias, the first and second vias including a first conductive material therein, the laminate further comprising an induction coil comprising a second conductive material, the induction coil further comprising a first set of windings arranged on the first paper layer and a second set of windings arranged on the second paper layer, the first and second sets of windings being electrically connected in series, the laminate having at least two electrical contact pads accessible from outside of the laminate that are in electrical connection with first and second terminuses of the induction coil; providing an inductive charging station device, the inductive charging station device having an aperture and including a driver circuit configured to drive the induction coil to provide a wireless charge to an electronic device; installing the laminate into the aperture of the inductive charging station device such that the at least two electrical contact pads are in electrical contact with the driver circuit. 13. The method of claim 12, wherein the first set of windings is electrically connected to the second set of windings by a via, the via extending between the first paper layer and the second paper layer. 14. The method of claim 12, wherein providing an inductive charging station device comprises removing a portion of a laminate surface to form the aperture. 15. An inductive charging station comprising:
an aperture in a surface, the aperture configured to accept a laminate, the laminate comprising: at least first and second paper layers, the second paper layer being disposed over the first paper layer, the second paper layer including at least first and second vias, the first and second vias including a first conductive material therein; an induction coil comprising a second conductive material, the induction coil further comprising a first set of windings arranged on the first paper layer and a second set of windings arranged on the second paper layer, the first and second sets of windings being electrically connected in series, the laminate having at least two electrical contact pads accessible from outside of the laminate that are in electrical connection with first and second terminuses of the induction coil; a driver circuit connected to the laminate and configured to drive the induction coil and provide a wireless charge to an electronic device, the driver circuit including: a resonant frequency oscillator; a power transistor; a full wave rectifier; and a voltage regulator. 16. The inductive charging station of claim 15, wherein the laminate further comprises at least a second induction coil, the second induction coil comprising a third set of windings arranged on the first paper layer, the second induction coil further comprising a fourth set of windings arranged on the second paper layer, the third set of windings and the fourth set of windings being electrically connected in series. 17. The inductive charging station of claim 15, wherein the laminate further comprises at least a second induction coil, the second induction coil comprising a third set of windings arranged on a third paper layer and a fourth set of windings arranged on a fourth paper layer, the third set of windings and the fourth set of windings being electrically connected in series. 18. The inductive charging station of claim 15, wherein the first set of windings is electrically connected to the second set of windings by a via connecting an innermost winding of the first set of windings to an innermost winding of the second set of windings. 19. The inductive charging station of claim 18, wherein the via is disposed in a hole in one or more layers of the laminate. 20. The laminate of claim 15, wherein the induction coil is electrically connected to at least two electrical contact pads exposed to the outside of the laminate, the at least two electrical contact pads being located on a bottom surface of the laminate, the at least two electrical contact pads connected to the outside of the laminate through vias. | 2,800 |
12,375 | 12,375 | 16,720,572 | 2,833 | A connector includes an outer housing, an inner housing housed and held in the outer housing, a jacket fixing member attached to an outer periphery of the inner housing, a plurality of terminals housed in the inner housing, a plurality of cables with each end connected to each of the plurality of terminals and drawn from the inner housing, a jacket collectively covering an outer periphery of the plurality of cables drawn from the inner housing, a crimping section formed on the jacket fixing member and crimped to an outer periphery of the jacket, and at least one serration formed on the crimping section, protruding toward the jacket, and arranged inclined with respect to a longitudinal direction of the jacket. | 1. A connector comprising:
an outer housing; an inner housing housed and held in the outer housing; a jacket fixing member attached to an outer periphery of the inner housing; a plurality of terminals housed in the inner housing; a plurality of cables with each end connected to each of the plurality of terminals and drawn from the inner housing; a jacket collectively covering an outer periphery of the plurality of cables drawn from the inner housing; a crimping section formed on the jacket fixing member and crimped to an outer periphery of the jacket; and at least one serration formed on the crimping section, protruding toward the jacket, and arranged inclined with respect to a longitudinal direction of the jacket. 2. The connector according to claim 1, wherein a corner portion of the at least one serration protruded toward the jacket is rounded. 3. The connector according to claim 1, wherein the at least one serration comprises a plurality of serrations. | A connector includes an outer housing, an inner housing housed and held in the outer housing, a jacket fixing member attached to an outer periphery of the inner housing, a plurality of terminals housed in the inner housing, a plurality of cables with each end connected to each of the plurality of terminals and drawn from the inner housing, a jacket collectively covering an outer periphery of the plurality of cables drawn from the inner housing, a crimping section formed on the jacket fixing member and crimped to an outer periphery of the jacket, and at least one serration formed on the crimping section, protruding toward the jacket, and arranged inclined with respect to a longitudinal direction of the jacket.1. A connector comprising:
an outer housing; an inner housing housed and held in the outer housing; a jacket fixing member attached to an outer periphery of the inner housing; a plurality of terminals housed in the inner housing; a plurality of cables with each end connected to each of the plurality of terminals and drawn from the inner housing; a jacket collectively covering an outer periphery of the plurality of cables drawn from the inner housing; a crimping section formed on the jacket fixing member and crimped to an outer periphery of the jacket; and at least one serration formed on the crimping section, protruding toward the jacket, and arranged inclined with respect to a longitudinal direction of the jacket. 2. The connector according to claim 1, wherein a corner portion of the at least one serration protruded toward the jacket is rounded. 3. The connector according to claim 1, wherein the at least one serration comprises a plurality of serrations. | 2,800 |
12,376 | 12,376 | 16,194,980 | 2,828 | An array layout of VCSELs is intentionally mis-aligned with respect to the xy-plane of the device structure as defined by the crystallographic axes of the semiconductor material. The mis-alignment may take the form of skewing the emitter array with respect to the xy-plane, or rotating the emitter array. In either case, the layout pattern retains the desired, row/column structure (necessary for dicing the structure into one-dimensional arrays) while reducing the probability that an extended defect along a crystallographic plane will impact a large number of individual emitters. | 1. A VCSEL array comprising
a plurality of individual VCSELs formed within an epitaxially-grown structure of semiconductor material having a predefined crystalline orientation and crystallographic axes represented as an xy-plane across the surface of the structure of semiconductor, the plurality of individual VCSELs disposed in a two-dimensional array pattern that is not aligned with the xy-plane, thereby reducing the statistical probability of an individual VCSEL intersecting an extended defect formed along a crystallographic plane of the semiconductor material. 2. The VCSEL array as defined in claim 1 wherein the plurality of individual VCSELs is disposed in a two-dimensional array that is skewed with respect to the xy-plane of the crystallographic axes. 3. The VCSEL array as defined in claim 2 wherein a skew pattern is formed within an xsys-plane with an xx axis not parallel to the x-axis of the crystallographic plane, and a ys axis not parallel to the y-axis of the crystallographic plane, and having an angle α less than 90° between the xs axis and the ys axis. 4. The VCSEL array as defined in claim 2 wherein a skew pattern is formed within an xsys-plane with an xs axis not parallel to the x-axis of the crystallographic plane, and a ys axis not parallel to the y-axis of the crystallographic plane, and having an angle α greater than than 90° between the xs axis and the ys axis. 5. The VCSEL array as defined in claim 1 wherein the plurality of individual VCSELs is disposed in a two-dimensional grid array arranged along orthogonal axes xr and yr, wherein the xryr-plane is rotated with respect to the xy-plane of the crystallographic axes. 6. A VCSEL array as defined in claim 1 wherein the array is formed on a substrate of GaAs. 7. A VCSEL array as defined in claim 1 wherein the array is formed on a substrate of InP. 8. A VCSEL array comprising:
a plurality of individual VCSEL diodes disposed in a two-dimensional array pattern across a surface of a semiconductor material, wherein the two-dimensional array pattern is not coincident with the x-y crystallographic plane of the semiconductor material, minimizing a number of VCSEL diodes affected by extended crystallographic defects in the semiconductor material structure. 9. The VCSEL array as defined in claim 8 wherein the two-dimensional array pattern is skewed with respect to the x-y crystallographic plane. 10. The VCSEL array as defined in claim 8 wherein the two-dimensional array pattern is rotated with respect to the x-y crystallographic plane. | An array layout of VCSELs is intentionally mis-aligned with respect to the xy-plane of the device structure as defined by the crystallographic axes of the semiconductor material. The mis-alignment may take the form of skewing the emitter array with respect to the xy-plane, or rotating the emitter array. In either case, the layout pattern retains the desired, row/column structure (necessary for dicing the structure into one-dimensional arrays) while reducing the probability that an extended defect along a crystallographic plane will impact a large number of individual emitters.1. A VCSEL array comprising
a plurality of individual VCSELs formed within an epitaxially-grown structure of semiconductor material having a predefined crystalline orientation and crystallographic axes represented as an xy-plane across the surface of the structure of semiconductor, the plurality of individual VCSELs disposed in a two-dimensional array pattern that is not aligned with the xy-plane, thereby reducing the statistical probability of an individual VCSEL intersecting an extended defect formed along a crystallographic plane of the semiconductor material. 2. The VCSEL array as defined in claim 1 wherein the plurality of individual VCSELs is disposed in a two-dimensional array that is skewed with respect to the xy-plane of the crystallographic axes. 3. The VCSEL array as defined in claim 2 wherein a skew pattern is formed within an xsys-plane with an xx axis not parallel to the x-axis of the crystallographic plane, and a ys axis not parallel to the y-axis of the crystallographic plane, and having an angle α less than 90° between the xs axis and the ys axis. 4. The VCSEL array as defined in claim 2 wherein a skew pattern is formed within an xsys-plane with an xs axis not parallel to the x-axis of the crystallographic plane, and a ys axis not parallel to the y-axis of the crystallographic plane, and having an angle α greater than than 90° between the xs axis and the ys axis. 5. The VCSEL array as defined in claim 1 wherein the plurality of individual VCSELs is disposed in a two-dimensional grid array arranged along orthogonal axes xr and yr, wherein the xryr-plane is rotated with respect to the xy-plane of the crystallographic axes. 6. A VCSEL array as defined in claim 1 wherein the array is formed on a substrate of GaAs. 7. A VCSEL array as defined in claim 1 wherein the array is formed on a substrate of InP. 8. A VCSEL array comprising:
a plurality of individual VCSEL diodes disposed in a two-dimensional array pattern across a surface of a semiconductor material, wherein the two-dimensional array pattern is not coincident with the x-y crystallographic plane of the semiconductor material, minimizing a number of VCSEL diodes affected by extended crystallographic defects in the semiconductor material structure. 9. The VCSEL array as defined in claim 8 wherein the two-dimensional array pattern is skewed with respect to the x-y crystallographic plane. 10. The VCSEL array as defined in claim 8 wherein the two-dimensional array pattern is rotated with respect to the x-y crystallographic plane. | 2,800 |
12,377 | 12,377 | 16,599,181 | 2,871 | A beam shaping device (1; 31) comprising first (3; 33) and second (4; 37) optically transparent substrates, a liquid crystal layer (2; 36) sandwiched there between, and first (5; 34) and second (6; 35) electrodes arranged on a side of the liquid crystal layer (2; 36) facing the first substrate (3; 34). The beam shaping device (1; 31) is controllable between beam-shaping states, each permitting passage of light through the beam-shaping device in a direction perpendicular thereto. The beam shaping device (1; 31) is configured in such a way that application of a voltage (V) across the first (5; 34) and second (6; 35) electrodes results in an electric field having a portion essentially parallel to the liquid crystal layer (2; 36) in a segment thereof between neighboring portions of the electrodes (5, 6; 34; 35) and extending substantially from the first substrate (3; 34) to the second (4; 35) substrate. In this way a relatively high refractive index gradient can be obtained across short distances, which enables a very efficient beam shaping. The electric field can be achieved by utilizing electrodes provided on one side of the liquid crystal layer, in a so-called in-plane configuration. The device can be used in an autostereoscopic display device, for switching between 2D and 3D modes. | 1. A beam shaping device comprising:
top and bottom optically transparent substrates; a liquid crystal layer sandwiched between the top and bottom optically transparent substrates; a first electrode arranged on one side of the liquid crystal layer facing the top substrate configured as a first plurality of conductor lines connected together and extending in a plane parallel to the top substrate; a second electrode arranged on the one side of the liquid crystal layer facing the top substrate configured as a second plurality of conductor lines connected together and extending in the plane formed by the first plurality of conductor lines such that the second plurality of conductor lines are intertwined in the plane with the first plurality of conductor lines of the first electrode, wherein the beam shaping apparatus is controllable to change between a plurality of beam-shaping states; and a conductor plate extending across the first and second electrodes, coupled to a voltage source and positioned on an opposite side of the liquid crystal layer to the first and second electrodes, wherein each of the first and second electrodes permitting passage of a light beam through the beam shaping device in a direction perpendicular thereto, and is configured to respond to a voltage across the first and second electrodes together with interaction with the conductor plate resulting in an in-plane electric field extending from ones of the first plurality of conductor lines to a neighboring second plurality of conductor lines thereby providing the in-plane electric field that extends essentially parallel to the liquid crystal layer throughout between each of the first and second pluralities of conductor lines including a span directly in line and adjacent to the one side of the liquid crystal layer and extending substantially throughout the liquid crystal layer from the first and second plurality of conductor lines on the one side of the liquid crystal layer to the opposite side of the liquid crystal layer. 2. The beam shaping device according to claim 1, wherein the first and second electrodes are essentially parallel and successively arranged such that at least one conductor pair including neighboring electrode conductor lines from each electrode is formed. 3. The beam shaping device according to claim 2, wherein the first electrode further comprises a second plurality of essentially parallel first electrode conductor lines, and the second electrode comprises a second plurality of essentially parallel second electrode conductor lines, the first and second electrodes being arranged such that at least one conductor pair including neighboring first and second electrode conductor lines is formed. 4. The beam shaping device according to claim 3, wherein the second pluralities of conductor lines are arranged at an angle with respect to the first pluralities of conductor lines. 5. The beam shaping device according to claim 2, further comprising a third electrode configured as a third plurality of conductor lines connected together, and a fourth electrode configured as a fourth plurality of conductor lines connected together and extending in a second plane formed by the third plurality of conductor lines such that the fourth plurality of conductor lines are intertwined in the second plane with the third plurality of conductor lines, arranged on the opposite side of the liquid crystal layer with respect to the first and second electrodes. 6. The beam shaping device according to claim 5, wherein the third and fourth electrodes are arranged such that the third and fourth plurality of conductor lines of the third and fourth electrode are essentially perpendicular with a corresponding plurality of conductor lines of the first and second electrode. 7. The beam shaping device according to claim 1, wherein the liquid crystal layer is homeotropically aligned when not subjected to an electric field. 8. The beam shaping device according to claim 1, wherein the liquid crystal layer has a planar uniaxial alignment such that liquid crystal molecules comprised in the liquid crystal layer are perpendicular to an adjacent conductor line when not subjected to an electric field. 9. The beam shaping device according to claim 1, further comprising a light-source selected from any of a light-emitting diode and a semiconductor laser and configured to emit the light beam through the bottom optically transparent substrate. 10. The beam shaping device as claimed in claim 1, wherein the conductor plate is a first layer, the device further comprising a second layer between the first and second electrodes and the liquid crystal layer,
wherein the second layer is configured to change beam shaping characteristics of the beam shaping device. 11. The beam shaping device as claimed in claim 10, wherein a distance between the first and second pluralities of conductor lines is p, a thickness of the second layer is dsolid, a permittivity of a substrate in contact with the liquid crystal layer is εsub and a component of a permittivity of liquid crystal material parallel to an extraordinary axis is εLC, and wherein: 0.7<a1<12, in which a1=εLC×dsolid/p. 12. The beam shaping device as claimed in claim 11, wherein 0.9<a2<3.6, in which a2=εLC/εsub. 13. The beam shaping device as claimed in claim 1, wherein the voltage source coupled to the conductor plate is configured to provide a ground potential. 14. The beam shaping device as claimed in claim 13, wherein the conductor plate having a thickness of dsolid and further comprising a second insulator layer having a thickness dground, a distance between the first and second pluralities of conductor lines is p and a component of a permittivity of liquid crystal material of the liquid crystal layer parallel to an extraordinary axis is εLC, wherein:
0.9<b1<14.4 and 0.4<b2<6.4, in which b1=εLC×dsolid/p and b2=εLC×dground/p. 15. The beam shaping device as claimed in claim 1, wherein the voltage source coupled to the conductor plate is configured to provide a variable voltage to shape the in-plane electric field of the beam shaping device. 16. The beam shaping device as claimed in claim 15, wherein the first electrode is coupled to a first ac voltage and the second electrode is coupled to a second ac voltage. 17. The beam shaping device as claimed in claim 16, wherein the first and second ac voltages are configured to provide voltages in antiphase with the same frequency, and wherein the variable voltage has a different phase or higher frequency. 18. The beam shaping device as claimed in claim 1, wherein the voltage source coupled to the conductor plate is configured to provide a DC voltage, the first electrode is coupled to a first AC voltage, and the second electrode is coupled to a second AC voltage. 19. The beam shaping device as claimed in claim 18, wherein the first and second ac voltages each comprise first and second superposed components, the first superposed components of the first and second AC voltages being in antiphase with the same frequency, and the second superpose components being the same and having a different phase or higher frequency. 20. The beam shaping device as claimed in claim 1, further comprising an opaque layer in a region of the first and second electrodes and aligned with a region of lowest beam shaping effect, the opaque layer being opaque at least when the device is driven in a lensing mode. 21. The beam shaping device as claimed in claim 20, further comprising an analyzer on the opposite side of the liquid crystal layer to the first and second electrodes, the analyzer being configured such that in the lensing mode of the device, light traveling through the device and exiting the liquid crystal layer at the side of the analyzer at a position of electrodes is blocked at least partially by the analyzer. 22. A switchable autostereoscopic display device comprising:
a display panel having an array of display pixel elements for producing a display, the array display pixel elements being arranged in rows and columns; and an imaging arrangement which directs an output from different pixel elements to different spatial positions to enable a stereoscopic image to be viewed, arranged such that display pixel outputs for both eyes of a viewer are simultaneously directed, wherein the imaging arrangement is electrically switchable between a 2D mode and a 3D mode and comprises a beam shaping apparatus comprising: top and bottom optically transparent substrates, a liquid crystal layer sandwiched between the top and bottom optically transparent substrates, a first electrode arranged on one side of the liquid crystal layer facing the top substrate configured as a first plurality of conductor lines connected together and extending in a plane parallel to the top substrate, a second electrode arranged on the one side of the liquid crystal layer facing the top substrate configured as a second plurality of conductor lines connected together and extending in the plane formed by the first plurality of conductor lines such that the second plurality of conductor lines are intertwined in the plane with the first plurality of conductor lines of the first electrode, wherein the beam shaping apparatus is controllable to change between a plurality of beam-shaping states, each permitting passage of a light beam through the beam shaping apparatus in a direction perpendicular thereto, and a conductor plate extending across the first and second electrodes, coupled to a voltage source and positioned on an opposite side of the liquid crystal layer to the first and second electrodes, wherein each of the first and second electrodes permitting passage of the light beam through the switchable autostereoscopic device in a direction perpendicular thereto, and is configured to respond to a voltage across the first and second electrodes together with interaction with the conductor plate resulting in an in-plane electric field extending from ones of the first plurality of conductor lines to neighboring second plurality of conductor lines thereby providing the in-plane electric field that extends essentially parallel to the liquid crystal layer throughout between each of the first and second pluralities of conductor lines including a span directly in line with the first and second pluralities of conductor lines adjacent to the one side of the liquid crystal layer and extending substantially throughout the liquid crystal layer from the first and second plurality of conductor lines on the one side of said liquid crystal layer to the opposite side of the liquid crystal layer. 23. The beam shaping device according to claim 22, wherein the first and second electrodes are essentially parallel and successively arranged such that at least one conductor pair including neighboring electrode conductor lines from each electrode is formed. 24. The beam shaping device according to claim 22, further comprising a third electrode configured as a third plurality of conductor lines connected together, and a fourth electrode configured as a fourth plurality of conductor lines connected together and extending in a second plane formed by the third plurality of conductor lines such that the fourth plurality of conductor lines are intertwined in the second plane with the third plurality of conductor lines, arranged on the opposite side of the liquid crystal layer with respect to the first and second electrodes. 25. The beam shaping device according to claim 24, wherein the third and fourth electrodes are arranged such that the third and fourth plurality of conductor lines of the third and fourth electrode are essentially perpendicular with a corresponding plurality of conductor lines of the first and second electrode. 26. The beam shaping device according to claim 22, wherein the liquid crystal layer is homeotropically aligned when not subjected to an electric field. 27. The beam shaping device according to claim 22, wherein the liquid crystal layer has a planar uniaxial alignment such that liquid crystal molecules comprised in the liquid crystal layer are perpendicular to an adjacent conductor line when not subjected to an electric field. 28. The beam shaping device according to claim 22, further comprising a light-source selected from any of a light-emitting diode and a semiconductor laser and configured to emit the light beam through the bottom substrate. 29. The beam shaping device as claimed in claim 22, wherein the conductor plate is a first layer, the device further comprising a second layer between the first and second electrodes and the liquid crystal layer,
wherein the second layer is configured to change beam shaping characteristics of the beam shaping device. 30. A beam shaping device comprising:
top and bottom optically transparent substrates; a liquid crystal layer sandwiched between the top and bottom optically transparent substrates; and first and second electrodes arranged on one side of the liquid crystal layer facing the top substrate. wherein the beam shaping device is controllable to change between a plurality of beam-shaping states, each permitting passage of light through a beam-shaping device in a direction perpendicular thereto, and is configured to respond to a voltage across the first and second electrodes resulting in an electric field including a portion essentially parallel to the liquid crystal layer in a segment thereof between neighboring portions of the first and second electrodes and extending substantially from the top substrate to the bottom substrate, and wherein a distance between neighboring portions of the first and second electrodes is p, a thickness of the liquid crystal layer is dsolid, a permittivity of one of the top and bottom optically transparent substrates in contact with the liquid crystal layer is εsub and a component of a permittivity of liquid crystal material parallel to an extraordinary axis is εLC, and wherein: 0.7<a1<12, in which a1=εLC×dsolid/p. | A beam shaping device (1; 31) comprising first (3; 33) and second (4; 37) optically transparent substrates, a liquid crystal layer (2; 36) sandwiched there between, and first (5; 34) and second (6; 35) electrodes arranged on a side of the liquid crystal layer (2; 36) facing the first substrate (3; 34). The beam shaping device (1; 31) is controllable between beam-shaping states, each permitting passage of light through the beam-shaping device in a direction perpendicular thereto. The beam shaping device (1; 31) is configured in such a way that application of a voltage (V) across the first (5; 34) and second (6; 35) electrodes results in an electric field having a portion essentially parallel to the liquid crystal layer (2; 36) in a segment thereof between neighboring portions of the electrodes (5, 6; 34; 35) and extending substantially from the first substrate (3; 34) to the second (4; 35) substrate. In this way a relatively high refractive index gradient can be obtained across short distances, which enables a very efficient beam shaping. The electric field can be achieved by utilizing electrodes provided on one side of the liquid crystal layer, in a so-called in-plane configuration. The device can be used in an autostereoscopic display device, for switching between 2D and 3D modes.1. A beam shaping device comprising:
top and bottom optically transparent substrates; a liquid crystal layer sandwiched between the top and bottom optically transparent substrates; a first electrode arranged on one side of the liquid crystal layer facing the top substrate configured as a first plurality of conductor lines connected together and extending in a plane parallel to the top substrate; a second electrode arranged on the one side of the liquid crystal layer facing the top substrate configured as a second plurality of conductor lines connected together and extending in the plane formed by the first plurality of conductor lines such that the second plurality of conductor lines are intertwined in the plane with the first plurality of conductor lines of the first electrode, wherein the beam shaping apparatus is controllable to change between a plurality of beam-shaping states; and a conductor plate extending across the first and second electrodes, coupled to a voltage source and positioned on an opposite side of the liquid crystal layer to the first and second electrodes, wherein each of the first and second electrodes permitting passage of a light beam through the beam shaping device in a direction perpendicular thereto, and is configured to respond to a voltage across the first and second electrodes together with interaction with the conductor plate resulting in an in-plane electric field extending from ones of the first plurality of conductor lines to a neighboring second plurality of conductor lines thereby providing the in-plane electric field that extends essentially parallel to the liquid crystal layer throughout between each of the first and second pluralities of conductor lines including a span directly in line and adjacent to the one side of the liquid crystal layer and extending substantially throughout the liquid crystal layer from the first and second plurality of conductor lines on the one side of the liquid crystal layer to the opposite side of the liquid crystal layer. 2. The beam shaping device according to claim 1, wherein the first and second electrodes are essentially parallel and successively arranged such that at least one conductor pair including neighboring electrode conductor lines from each electrode is formed. 3. The beam shaping device according to claim 2, wherein the first electrode further comprises a second plurality of essentially parallel first electrode conductor lines, and the second electrode comprises a second plurality of essentially parallel second electrode conductor lines, the first and second electrodes being arranged such that at least one conductor pair including neighboring first and second electrode conductor lines is formed. 4. The beam shaping device according to claim 3, wherein the second pluralities of conductor lines are arranged at an angle with respect to the first pluralities of conductor lines. 5. The beam shaping device according to claim 2, further comprising a third electrode configured as a third plurality of conductor lines connected together, and a fourth electrode configured as a fourth plurality of conductor lines connected together and extending in a second plane formed by the third plurality of conductor lines such that the fourth plurality of conductor lines are intertwined in the second plane with the third plurality of conductor lines, arranged on the opposite side of the liquid crystal layer with respect to the first and second electrodes. 6. The beam shaping device according to claim 5, wherein the third and fourth electrodes are arranged such that the third and fourth plurality of conductor lines of the third and fourth electrode are essentially perpendicular with a corresponding plurality of conductor lines of the first and second electrode. 7. The beam shaping device according to claim 1, wherein the liquid crystal layer is homeotropically aligned when not subjected to an electric field. 8. The beam shaping device according to claim 1, wherein the liquid crystal layer has a planar uniaxial alignment such that liquid crystal molecules comprised in the liquid crystal layer are perpendicular to an adjacent conductor line when not subjected to an electric field. 9. The beam shaping device according to claim 1, further comprising a light-source selected from any of a light-emitting diode and a semiconductor laser and configured to emit the light beam through the bottom optically transparent substrate. 10. The beam shaping device as claimed in claim 1, wherein the conductor plate is a first layer, the device further comprising a second layer between the first and second electrodes and the liquid crystal layer,
wherein the second layer is configured to change beam shaping characteristics of the beam shaping device. 11. The beam shaping device as claimed in claim 10, wherein a distance between the first and second pluralities of conductor lines is p, a thickness of the second layer is dsolid, a permittivity of a substrate in contact with the liquid crystal layer is εsub and a component of a permittivity of liquid crystal material parallel to an extraordinary axis is εLC, and wherein: 0.7<a1<12, in which a1=εLC×dsolid/p. 12. The beam shaping device as claimed in claim 11, wherein 0.9<a2<3.6, in which a2=εLC/εsub. 13. The beam shaping device as claimed in claim 1, wherein the voltage source coupled to the conductor plate is configured to provide a ground potential. 14. The beam shaping device as claimed in claim 13, wherein the conductor plate having a thickness of dsolid and further comprising a second insulator layer having a thickness dground, a distance between the first and second pluralities of conductor lines is p and a component of a permittivity of liquid crystal material of the liquid crystal layer parallel to an extraordinary axis is εLC, wherein:
0.9<b1<14.4 and 0.4<b2<6.4, in which b1=εLC×dsolid/p and b2=εLC×dground/p. 15. The beam shaping device as claimed in claim 1, wherein the voltage source coupled to the conductor plate is configured to provide a variable voltage to shape the in-plane electric field of the beam shaping device. 16. The beam shaping device as claimed in claim 15, wherein the first electrode is coupled to a first ac voltage and the second electrode is coupled to a second ac voltage. 17. The beam shaping device as claimed in claim 16, wherein the first and second ac voltages are configured to provide voltages in antiphase with the same frequency, and wherein the variable voltage has a different phase or higher frequency. 18. The beam shaping device as claimed in claim 1, wherein the voltage source coupled to the conductor plate is configured to provide a DC voltage, the first electrode is coupled to a first AC voltage, and the second electrode is coupled to a second AC voltage. 19. The beam shaping device as claimed in claim 18, wherein the first and second ac voltages each comprise first and second superposed components, the first superposed components of the first and second AC voltages being in antiphase with the same frequency, and the second superpose components being the same and having a different phase or higher frequency. 20. The beam shaping device as claimed in claim 1, further comprising an opaque layer in a region of the first and second electrodes and aligned with a region of lowest beam shaping effect, the opaque layer being opaque at least when the device is driven in a lensing mode. 21. The beam shaping device as claimed in claim 20, further comprising an analyzer on the opposite side of the liquid crystal layer to the first and second electrodes, the analyzer being configured such that in the lensing mode of the device, light traveling through the device and exiting the liquid crystal layer at the side of the analyzer at a position of electrodes is blocked at least partially by the analyzer. 22. A switchable autostereoscopic display device comprising:
a display panel having an array of display pixel elements for producing a display, the array display pixel elements being arranged in rows and columns; and an imaging arrangement which directs an output from different pixel elements to different spatial positions to enable a stereoscopic image to be viewed, arranged such that display pixel outputs for both eyes of a viewer are simultaneously directed, wherein the imaging arrangement is electrically switchable between a 2D mode and a 3D mode and comprises a beam shaping apparatus comprising: top and bottom optically transparent substrates, a liquid crystal layer sandwiched between the top and bottom optically transparent substrates, a first electrode arranged on one side of the liquid crystal layer facing the top substrate configured as a first plurality of conductor lines connected together and extending in a plane parallel to the top substrate, a second electrode arranged on the one side of the liquid crystal layer facing the top substrate configured as a second plurality of conductor lines connected together and extending in the plane formed by the first plurality of conductor lines such that the second plurality of conductor lines are intertwined in the plane with the first plurality of conductor lines of the first electrode, wherein the beam shaping apparatus is controllable to change between a plurality of beam-shaping states, each permitting passage of a light beam through the beam shaping apparatus in a direction perpendicular thereto, and a conductor plate extending across the first and second electrodes, coupled to a voltage source and positioned on an opposite side of the liquid crystal layer to the first and second electrodes, wherein each of the first and second electrodes permitting passage of the light beam through the switchable autostereoscopic device in a direction perpendicular thereto, and is configured to respond to a voltage across the first and second electrodes together with interaction with the conductor plate resulting in an in-plane electric field extending from ones of the first plurality of conductor lines to neighboring second plurality of conductor lines thereby providing the in-plane electric field that extends essentially parallel to the liquid crystal layer throughout between each of the first and second pluralities of conductor lines including a span directly in line with the first and second pluralities of conductor lines adjacent to the one side of the liquid crystal layer and extending substantially throughout the liquid crystal layer from the first and second plurality of conductor lines on the one side of said liquid crystal layer to the opposite side of the liquid crystal layer. 23. The beam shaping device according to claim 22, wherein the first and second electrodes are essentially parallel and successively arranged such that at least one conductor pair including neighboring electrode conductor lines from each electrode is formed. 24. The beam shaping device according to claim 22, further comprising a third electrode configured as a third plurality of conductor lines connected together, and a fourth electrode configured as a fourth plurality of conductor lines connected together and extending in a second plane formed by the third plurality of conductor lines such that the fourth plurality of conductor lines are intertwined in the second plane with the third plurality of conductor lines, arranged on the opposite side of the liquid crystal layer with respect to the first and second electrodes. 25. The beam shaping device according to claim 24, wherein the third and fourth electrodes are arranged such that the third and fourth plurality of conductor lines of the third and fourth electrode are essentially perpendicular with a corresponding plurality of conductor lines of the first and second electrode. 26. The beam shaping device according to claim 22, wherein the liquid crystal layer is homeotropically aligned when not subjected to an electric field. 27. The beam shaping device according to claim 22, wherein the liquid crystal layer has a planar uniaxial alignment such that liquid crystal molecules comprised in the liquid crystal layer are perpendicular to an adjacent conductor line when not subjected to an electric field. 28. The beam shaping device according to claim 22, further comprising a light-source selected from any of a light-emitting diode and a semiconductor laser and configured to emit the light beam through the bottom substrate. 29. The beam shaping device as claimed in claim 22, wherein the conductor plate is a first layer, the device further comprising a second layer between the first and second electrodes and the liquid crystal layer,
wherein the second layer is configured to change beam shaping characteristics of the beam shaping device. 30. A beam shaping device comprising:
top and bottom optically transparent substrates; a liquid crystal layer sandwiched between the top and bottom optically transparent substrates; and first and second electrodes arranged on one side of the liquid crystal layer facing the top substrate. wherein the beam shaping device is controllable to change between a plurality of beam-shaping states, each permitting passage of light through a beam-shaping device in a direction perpendicular thereto, and is configured to respond to a voltage across the first and second electrodes resulting in an electric field including a portion essentially parallel to the liquid crystal layer in a segment thereof between neighboring portions of the first and second electrodes and extending substantially from the top substrate to the bottom substrate, and wherein a distance between neighboring portions of the first and second electrodes is p, a thickness of the liquid crystal layer is dsolid, a permittivity of one of the top and bottom optically transparent substrates in contact with the liquid crystal layer is εsub and a component of a permittivity of liquid crystal material parallel to an extraordinary axis is εLC, and wherein: 0.7<a1<12, in which a1=εLC×dsolid/p. | 2,800 |
12,378 | 12,378 | 16,572,761 | 2,831 | A terminal-wire bonding method includes: arranging a first core at a second end of a first terminal-wire having a first terminal connected with the first core exposed from an insulating sheath at a first end, onto a side of an anvil and a second core at a second end of a second terminal-wire having a second terminal connected with the second core exposed, at a first end, from an insulating sheath longer than the insulating sheath of the first terminal-wire, onto a side of a horn; and bonding the first core at the second end and the second core at the second end together by ultrasonic bonding between the horn and the anvil. | 1. A terminal-wire bonding method with a first terminal-wire and a second terminal-wire, the first terminal-wire having a first terminal connected with a first core exposed from an insulating sheath at a first end, the first core being exposed from the insulating sheath at a second end of the first terminal-wire, the second terminal-wire having a second terminal connected with a second core exposed, at a first end, from an insulating sheath longer than the insulating sheath of the first terminal-wire, the second core being exposed from the insulating sheath longer than the insulating sheath of the first terminal-wire, at a second end of the second terminal-wire, the terminal-wire bonding method comprising:
arranging the second core at the second end onto a side of a horn for ultrasonic bonding and the first core at the second end onto a side of an anvil for ultrasonic bonding; and bonding the first core at the second end and the second core at the second end together by ultrasonic bonding between the horn and the anvil. 2. The terminal-wire bonding method according to claim 1, wherein
the arranging includes arranging the second core exposed by intermediate peeling of the insulating sheath of the second terminal-wire longer than the insulating sheath of the first terminal-wire, onto the side of the horn and the first core exposed from the insulating sheath at the second end of the first terminal-wire, onto the side of the anvil, and the bonding includes bonding the second core exposed by the intermediate peeling of the insulating sheath of the second terminal-wire longer than the insulating sheath of the first terminal-wire and the first core exposed from the insulating sheath at the second end of the first terminal-wire together by ultrasonic bonding between the horn and the anvil. 3. The terminal-wire bonding method according to claim 1, wherein
the arranging includes arranging a core exposed from an insulating sheath of a dummy wire, onto the side of the horn with respect to the second core at the second end, and the bonding includes bonding the first core at the second end, the second core at the second end, and the core of the dummy wire together by ultrasonic bonding between the horn and the anvil. 4. The terminal-wire bonding method according to claim 1, wherein
the first core and the second core each include a plurality of strands identical in thickness, and the first core and the second core are identical in sectional area. 5. The terminal-wire bonding method according to claim 2, wherein
the first core and the second core each include a plurality of strands identical in thickness, and the first core and the second core are identical in sectional area. 6. The terminal-wire bonding method according to claim 3, wherein
the first core and the second core each include a plurality of strands identical in thickness, and the first core and the second core are identical in sectional area. 7. A bonded terminal-wire comprising:
a first terminal-wire having a first terminal connected with a first core including a plurality of strands exposed from an insulating sheath at a first end, the first core being exposed from the insulating sheath at a second end of the first terminal-wire; and a second terminal-wire having a second terminal connected with a second core including a plurality of strands exposed, at a first end, from an insulating sheath longer than the insulating sheath of the first terminal-wire, the plurality of strands each being identical in thickness to each strand of the first core, the second core being exposed from the insulating sheath longer than the insulating sheath of the first terminal-wire, at a second end of the second terminal-wire, wherein the first core at the second end and the second core at the second end are bonded together by ultrasonic bonding between a horn and an anvil for ultrasonic bonding with the second core at the second end arranged on a side of the horn and the first core at the second end arranged on a side of the anvil, and the plurality of strands of the second core at the second end on the side of the horn is bonded with collapse stronger than collapse of the plurality of strands of the first core at the second end on the side of the anvil. | A terminal-wire bonding method includes: arranging a first core at a second end of a first terminal-wire having a first terminal connected with the first core exposed from an insulating sheath at a first end, onto a side of an anvil and a second core at a second end of a second terminal-wire having a second terminal connected with the second core exposed, at a first end, from an insulating sheath longer than the insulating sheath of the first terminal-wire, onto a side of a horn; and bonding the first core at the second end and the second core at the second end together by ultrasonic bonding between the horn and the anvil.1. A terminal-wire bonding method with a first terminal-wire and a second terminal-wire, the first terminal-wire having a first terminal connected with a first core exposed from an insulating sheath at a first end, the first core being exposed from the insulating sheath at a second end of the first terminal-wire, the second terminal-wire having a second terminal connected with a second core exposed, at a first end, from an insulating sheath longer than the insulating sheath of the first terminal-wire, the second core being exposed from the insulating sheath longer than the insulating sheath of the first terminal-wire, at a second end of the second terminal-wire, the terminal-wire bonding method comprising:
arranging the second core at the second end onto a side of a horn for ultrasonic bonding and the first core at the second end onto a side of an anvil for ultrasonic bonding; and bonding the first core at the second end and the second core at the second end together by ultrasonic bonding between the horn and the anvil. 2. The terminal-wire bonding method according to claim 1, wherein
the arranging includes arranging the second core exposed by intermediate peeling of the insulating sheath of the second terminal-wire longer than the insulating sheath of the first terminal-wire, onto the side of the horn and the first core exposed from the insulating sheath at the second end of the first terminal-wire, onto the side of the anvil, and the bonding includes bonding the second core exposed by the intermediate peeling of the insulating sheath of the second terminal-wire longer than the insulating sheath of the first terminal-wire and the first core exposed from the insulating sheath at the second end of the first terminal-wire together by ultrasonic bonding between the horn and the anvil. 3. The terminal-wire bonding method according to claim 1, wherein
the arranging includes arranging a core exposed from an insulating sheath of a dummy wire, onto the side of the horn with respect to the second core at the second end, and the bonding includes bonding the first core at the second end, the second core at the second end, and the core of the dummy wire together by ultrasonic bonding between the horn and the anvil. 4. The terminal-wire bonding method according to claim 1, wherein
the first core and the second core each include a plurality of strands identical in thickness, and the first core and the second core are identical in sectional area. 5. The terminal-wire bonding method according to claim 2, wherein
the first core and the second core each include a plurality of strands identical in thickness, and the first core and the second core are identical in sectional area. 6. The terminal-wire bonding method according to claim 3, wherein
the first core and the second core each include a plurality of strands identical in thickness, and the first core and the second core are identical in sectional area. 7. A bonded terminal-wire comprising:
a first terminal-wire having a first terminal connected with a first core including a plurality of strands exposed from an insulating sheath at a first end, the first core being exposed from the insulating sheath at a second end of the first terminal-wire; and a second terminal-wire having a second terminal connected with a second core including a plurality of strands exposed, at a first end, from an insulating sheath longer than the insulating sheath of the first terminal-wire, the plurality of strands each being identical in thickness to each strand of the first core, the second core being exposed from the insulating sheath longer than the insulating sheath of the first terminal-wire, at a second end of the second terminal-wire, wherein the first core at the second end and the second core at the second end are bonded together by ultrasonic bonding between a horn and an anvil for ultrasonic bonding with the second core at the second end arranged on a side of the horn and the first core at the second end arranged on a side of the anvil, and the plurality of strands of the second core at the second end on the side of the horn is bonded with collapse stronger than collapse of the plurality of strands of the first core at the second end on the side of the anvil. | 2,800 |
12,379 | 12,379 | 15,649,164 | 2,835 | The described embodiments relate generally to computing devices including liquid crystal displays (LCDs) and more particularly to methods for attaching a cover glass layer to a structural housing while minimizing an amount of stress transferred through the cover glass layer to the LCD module. A continuous and compliant foam adhesive can be used to bond the cover glass layer to a structural. The compliant bond can absorb and distribute local stress concentrations caused by structural loads, mismatched surfaces and differing thermal expansion rates between various structures and cover glass layer. This can reduce stress concentrations in the cover glass layer that can lead to stress induced birefringence in the LCD cell. In other embodiments, the cover glass layer can be attached using magnets or a tongue and groove design. | 1. An electronic device comprising:
a housing having an opening; a cover glass that extends over the opening; a display module attached to a first portion of the cover glass; a support frame interposed between the display module and the housing; a mounting bracket attached to a second portion of the cover glass that surrounds the first portion, wherein the mounting bracket is attached to the support frame; and a backlight assembly that rests on the support frame and is surrounded by the mounting bracket. 2. The electronic device defined in claim 1 wherein the display module is adhered to the first portion of the cover glass with an optically clear adhesive. 3. The electronic device defined in claim 1 further comprising a support block attached to the cover glass and to the housing. 4. The electronic device defined in claim 3 wherein the support block is attached to a portion of the cover glass that surrounds the first and second portions of the cover glass. 5. The electronic device defined in claim 3 wherein the support block is attached to a periphery of the cover glass using a foam adhesive. 6. The electronic device defined in claim 3 further comprising metal plates attached to the cover glass, wherein the support block is magnetic, and wherein the support block is magnetically attached to the metal plates. 7. The electronic device defined in claim 3 wherein the support block maintains a gap between the housing and the cover glass. 8. The electronic device defined in claim 3 further comprising a tongue attached to the mounting bracket, wherein the support block comprises a groove, and wherein the tongue is positioned within the groove. 9. The electronic device defined in claim 8 wherein the tongue is integrally formed with the mounting bracket. 10. The electronic device defined in claim 1 wherein the support frame is fastened to the mounting bracket. 11. The electronic device defined in claim 1 wherein the mounting bracket is attached to the cover glass with a foam adhesive. 12. The electronic device defined in claim 11 wherein the foam adhesive is configured to distribute stresses transferred from the mounting bracket to the cover glass. 13. The electronic device defined in claim 11 wherein the mounting bracket is magnetic and wherein a magnetic field of an external magnet placed in proximity to the cover glass near the mounting bracket exerts a force on the mounting bracket that pulls the mounting bracket toward the cover glass and compresses the foam adhesive. 14. The electronic device defined in claim 1 wherein the mounting bracket comprises rigid plates that are adhered to the cover glass. 15. An electronic device having an exterior surface, the electronic device comprising:
a housing having an opening, wherein the housing forms the exterior surface of the electronic device; a cover glass that covers the opening, wherein the cover glass comprises a side surface that is aligned with the exterior surface of the housing; a display module attached to the cover glass; a support frame interposed between the housing and the display module; a backlight assembly interposed between the support frame and the display module; and a support block that surrounds the support frame, wherein the support block is attached to the cover glass and to the housing and wherein the support block maintains a gap between the cover glass and the housing. 16. The electronic device defined in claim 15 further comprising a mounting bracket fastened to the support frame. 17. The electronic device defined in claim 16 further comprising a spacer coupled to the cover glass, wherein the spacer is interposed between the cover glass and the mounting bracket. 18. The electronic device defined in claim 17 further comprising:
display circuitry coupled to the support frame, wherein a flexible circuit electrically couples the display module to the display circuitry and wherein a portion of the flexible circuit is interposed between the spacer and the mounting bracket. 19. The electronic device defined in claim 18 further comprising a gasket interposed between the mounting bracket and the flexible circuit. 20. An electronic device comprising:
a housing having an opening; a cover glass over the opening; a display module adhered to the cover glass; a mounting bracket adhered to the cover glass adjacent to the display module; a support frame fastened to the mounting bracket, wherein the support frame is interposed between the display module and the housing; a backlight assembly mounted on the support frame; and a support block adhered to the cover glass and attached to the housing, wherein the support block maintains a gap between the cover glass and the housing. | The described embodiments relate generally to computing devices including liquid crystal displays (LCDs) and more particularly to methods for attaching a cover glass layer to a structural housing while minimizing an amount of stress transferred through the cover glass layer to the LCD module. A continuous and compliant foam adhesive can be used to bond the cover glass layer to a structural. The compliant bond can absorb and distribute local stress concentrations caused by structural loads, mismatched surfaces and differing thermal expansion rates between various structures and cover glass layer. This can reduce stress concentrations in the cover glass layer that can lead to stress induced birefringence in the LCD cell. In other embodiments, the cover glass layer can be attached using magnets or a tongue and groove design.1. An electronic device comprising:
a housing having an opening; a cover glass that extends over the opening; a display module attached to a first portion of the cover glass; a support frame interposed between the display module and the housing; a mounting bracket attached to a second portion of the cover glass that surrounds the first portion, wherein the mounting bracket is attached to the support frame; and a backlight assembly that rests on the support frame and is surrounded by the mounting bracket. 2. The electronic device defined in claim 1 wherein the display module is adhered to the first portion of the cover glass with an optically clear adhesive. 3. The electronic device defined in claim 1 further comprising a support block attached to the cover glass and to the housing. 4. The electronic device defined in claim 3 wherein the support block is attached to a portion of the cover glass that surrounds the first and second portions of the cover glass. 5. The electronic device defined in claim 3 wherein the support block is attached to a periphery of the cover glass using a foam adhesive. 6. The electronic device defined in claim 3 further comprising metal plates attached to the cover glass, wherein the support block is magnetic, and wherein the support block is magnetically attached to the metal plates. 7. The electronic device defined in claim 3 wherein the support block maintains a gap between the housing and the cover glass. 8. The electronic device defined in claim 3 further comprising a tongue attached to the mounting bracket, wherein the support block comprises a groove, and wherein the tongue is positioned within the groove. 9. The electronic device defined in claim 8 wherein the tongue is integrally formed with the mounting bracket. 10. The electronic device defined in claim 1 wherein the support frame is fastened to the mounting bracket. 11. The electronic device defined in claim 1 wherein the mounting bracket is attached to the cover glass with a foam adhesive. 12. The electronic device defined in claim 11 wherein the foam adhesive is configured to distribute stresses transferred from the mounting bracket to the cover glass. 13. The electronic device defined in claim 11 wherein the mounting bracket is magnetic and wherein a magnetic field of an external magnet placed in proximity to the cover glass near the mounting bracket exerts a force on the mounting bracket that pulls the mounting bracket toward the cover glass and compresses the foam adhesive. 14. The electronic device defined in claim 1 wherein the mounting bracket comprises rigid plates that are adhered to the cover glass. 15. An electronic device having an exterior surface, the electronic device comprising:
a housing having an opening, wherein the housing forms the exterior surface of the electronic device; a cover glass that covers the opening, wherein the cover glass comprises a side surface that is aligned with the exterior surface of the housing; a display module attached to the cover glass; a support frame interposed between the housing and the display module; a backlight assembly interposed between the support frame and the display module; and a support block that surrounds the support frame, wherein the support block is attached to the cover glass and to the housing and wherein the support block maintains a gap between the cover glass and the housing. 16. The electronic device defined in claim 15 further comprising a mounting bracket fastened to the support frame. 17. The electronic device defined in claim 16 further comprising a spacer coupled to the cover glass, wherein the spacer is interposed between the cover glass and the mounting bracket. 18. The electronic device defined in claim 17 further comprising:
display circuitry coupled to the support frame, wherein a flexible circuit electrically couples the display module to the display circuitry and wherein a portion of the flexible circuit is interposed between the spacer and the mounting bracket. 19. The electronic device defined in claim 18 further comprising a gasket interposed between the mounting bracket and the flexible circuit. 20. An electronic device comprising:
a housing having an opening; a cover glass over the opening; a display module adhered to the cover glass; a mounting bracket adhered to the cover glass adjacent to the display module; a support frame fastened to the mounting bracket, wherein the support frame is interposed between the display module and the housing; a backlight assembly mounted on the support frame; and a support block adhered to the cover glass and attached to the housing, wherein the support block maintains a gap between the cover glass and the housing. | 2,800 |
12,380 | 12,380 | 16,704,462 | 2,815 | A display device includes a pixel portion in which a pixel electrode layer is arranged in a matrix, and an inverted staggered thin film transistor having a combination of at least two kinds of oxide semiconductor layers with different amounts of oxygen is provided corresponding to the pixel electrode layer. In the periphery of the pixel portion in this display device, a pad portion is provided to be electrically connected to a common electrode layer formed on a counter substrate through a conductive layer made of the same material as the pixel electrode layer. One objection of our invention to prevent a defect due to separation of a thin film in various kinds of display devices is realized, by providing a structure suitable for a pad portion provided in a display panel. | 1. (canceled) 2. A display device comprising:
a transistor; and a light emitting element including an electrode electrically connected to the transistor, wherein the transistor includes a source region, a drain region, and a channel formation region including an oxide semiconductor between the source region and the drain region, wherein the channel formation region includes In, Ga, and Zn, and wherein the source region includes a crystal having a diameter of 1 nm to 10 nm and the drain region includes a crystal having a diameter of 1 nm to 10 nm. 3. The display device according to claim 2, wherein the crystal of each of the source region and the drain region has a diameter of 1 nm to 2 nm. 4. A display device comprising:
a transistor; and a light emitting element including an electrode electrically connected to the transistor, wherein the transistor includes a gate electrode layer, a gate insulating layer, an oxide semiconductor layer, a source electrode layer, and a drain electrode layer, and wherein the oxide semiconductor layer includes a first nanocrystal region overlapping with the source electrode layer, and a second nanocrystal region overlapping with the drain electrode layer. 5. The display device according to claim 4, wherein the oxide semiconductor layer includes In, Ga, and Zn. 6. The display device according to claim 4, wherein the electrode is a cathode. 7. The display device according to claim 4, wherein the transistor is a driving transistor. 8. The display device according to claim 4, wherein the gate insulating layer includes silicon oxide. 9. The display device according to claim 4, wherein the gate electrode layer includes titanium, tantalum, tungsten, molybdenum, chromium, neodymium, or scandium. 10. The display device according to claim 4, wherein each of the source electrode layer and the drain electrode layer includes aluminum, chromium, tantalum, titanium, molybdenum or tungsten. 11. A display device comprising:
a transistor; and a light emitting element including an electrode electrically connected to the transistor, wherein the transistor includes a gate electrode layer, a gate insulating layer, an oxide semiconductor layer, a source electrode layer, and a drain electrode layer, wherein the oxide semiconductor layer includes a first region including a crystal having a diameter of 1 nm to 10 nm and a second region including a crystal having a diameter of 1 nm to 10 nm, and wherein the first region overlaps with the source electrode layer, and the second region overlaps with the drain electrode layer. 12. The display device according to claim 11, wherein the oxide semiconductor layer includes In, Ga, and Zn. 13. The display device according to claim 11, wherein the electrode is a cathode. 14. The display device according to claim 11, wherein the transistor is a driving transistor. 15. The display device according to claim 11, wherein the gate insulating layer includes silicon oxide. 16. The display device according to claim 11, wherein the gate electrode layer includes titanium, tantalum, tungsten, molybdenum, chromium, neodymium, or scandium. 17. The display device according to claim 11, wherein each of the source electrode layer and the drain electrode layer includes aluminum, chromium, tantalum, titanium, molybdenum or tungsten. 18. A display device comprising:
a transistor; and a light emitting element including an electrode electrically connected to the transistor, wherein the transistor includes a gate electrode layer, a gate insulating layer, an oxide semiconductor layer, a source electrode layer, and a drain electrode layer, wherein the oxide semiconductor layer includes In, Ga, and Zn, wherein the oxide semiconductor layer includes a first n+ region including nanocrystal and a second n+ region including nanocrystal, and wherein the first n+ region overlaps with the source electrode layer, and the second n+ region overlaps with the drain electrode layer. | A display device includes a pixel portion in which a pixel electrode layer is arranged in a matrix, and an inverted staggered thin film transistor having a combination of at least two kinds of oxide semiconductor layers with different amounts of oxygen is provided corresponding to the pixel electrode layer. In the periphery of the pixel portion in this display device, a pad portion is provided to be electrically connected to a common electrode layer formed on a counter substrate through a conductive layer made of the same material as the pixel electrode layer. One objection of our invention to prevent a defect due to separation of a thin film in various kinds of display devices is realized, by providing a structure suitable for a pad portion provided in a display panel.1. (canceled) 2. A display device comprising:
a transistor; and a light emitting element including an electrode electrically connected to the transistor, wherein the transistor includes a source region, a drain region, and a channel formation region including an oxide semiconductor between the source region and the drain region, wherein the channel formation region includes In, Ga, and Zn, and wherein the source region includes a crystal having a diameter of 1 nm to 10 nm and the drain region includes a crystal having a diameter of 1 nm to 10 nm. 3. The display device according to claim 2, wherein the crystal of each of the source region and the drain region has a diameter of 1 nm to 2 nm. 4. A display device comprising:
a transistor; and a light emitting element including an electrode electrically connected to the transistor, wherein the transistor includes a gate electrode layer, a gate insulating layer, an oxide semiconductor layer, a source electrode layer, and a drain electrode layer, and wherein the oxide semiconductor layer includes a first nanocrystal region overlapping with the source electrode layer, and a second nanocrystal region overlapping with the drain electrode layer. 5. The display device according to claim 4, wherein the oxide semiconductor layer includes In, Ga, and Zn. 6. The display device according to claim 4, wherein the electrode is a cathode. 7. The display device according to claim 4, wherein the transistor is a driving transistor. 8. The display device according to claim 4, wherein the gate insulating layer includes silicon oxide. 9. The display device according to claim 4, wherein the gate electrode layer includes titanium, tantalum, tungsten, molybdenum, chromium, neodymium, or scandium. 10. The display device according to claim 4, wherein each of the source electrode layer and the drain electrode layer includes aluminum, chromium, tantalum, titanium, molybdenum or tungsten. 11. A display device comprising:
a transistor; and a light emitting element including an electrode electrically connected to the transistor, wherein the transistor includes a gate electrode layer, a gate insulating layer, an oxide semiconductor layer, a source electrode layer, and a drain electrode layer, wherein the oxide semiconductor layer includes a first region including a crystal having a diameter of 1 nm to 10 nm and a second region including a crystal having a diameter of 1 nm to 10 nm, and wherein the first region overlaps with the source electrode layer, and the second region overlaps with the drain electrode layer. 12. The display device according to claim 11, wherein the oxide semiconductor layer includes In, Ga, and Zn. 13. The display device according to claim 11, wherein the electrode is a cathode. 14. The display device according to claim 11, wherein the transistor is a driving transistor. 15. The display device according to claim 11, wherein the gate insulating layer includes silicon oxide. 16. The display device according to claim 11, wherein the gate electrode layer includes titanium, tantalum, tungsten, molybdenum, chromium, neodymium, or scandium. 17. The display device according to claim 11, wherein each of the source electrode layer and the drain electrode layer includes aluminum, chromium, tantalum, titanium, molybdenum or tungsten. 18. A display device comprising:
a transistor; and a light emitting element including an electrode electrically connected to the transistor, wherein the transistor includes a gate electrode layer, a gate insulating layer, an oxide semiconductor layer, a source electrode layer, and a drain electrode layer, wherein the oxide semiconductor layer includes In, Ga, and Zn, wherein the oxide semiconductor layer includes a first n+ region including nanocrystal and a second n+ region including nanocrystal, and wherein the first n+ region overlaps with the source electrode layer, and the second n+ region overlaps with the drain electrode layer. | 2,800 |
12,381 | 12,381 | 15,529,135 | 2,856 | A system and method is provided for detecting fluid low-volume and occlusion in a device using force sensing resistor (FSR) sensor. One or more force sensing resistors are positioned in communication with a fluid channel at one or more of a pump intake and pump outlet to detect pressure in the fluid channel. The pressure is detected through communication with the force sensing resistor and indicates an irregular system condition including but not limited to, fluid low-volume level and occlusion. Also provided are a fluid flow sensor (e.g., FSR or MEMS sensor) disposed relative to an embedded fluid channel in the base of a wearable medicine delivery pump. | 1. A system for detecting a fluid characteristic in a medication fluid communication system comprising:
a fluid reservoir; a fluid path connected between the fluid reservoir and a patient; a fluid delivery mechanism that controls the flow of fluid from the fluid reservoir to the patient via the fluid path; and a pressure sensor configured to measure pressure of the fluid within the fluid path based on a force corresponding to pressure exerted by the fluid in the fluid path flowing directly or indirectly over a designated surface area of the pressure sensor. 2. The system of claim 1, wherein the fluid characteristic is at least one of an occlusion and fluid low-volume level in at least one of the fluid reservoir and the fluid delivery mechanism determined using sensed pressure output from the pressure sensor. 3. The system of claim 1, wherein the pressure sensor is located along the fluid path upstream between the fluid reservoir and the fluid delivery mechanism, and the sensed pressure output from the pressure sensor pre-biased to detect negative pressure. 4. The system of claim 1, wherein the pressure sensor is located along the fluid path downstream between the fluid delivery mechanism and the patient. 5. The system of claim 1, wherein the pressure sensor is a force sensing resistor (FSR) sensor comprising a FSR sensing element having an active sensing surface disposed in a fluid chamber through which the fluid from the fluid path flows, and a tail element. 6. The system of claim 5, wherein the fluid chamber is connected to the fluid path, and the fluid in the fluid chamber directly contacts the active sensing surface of the FSR sensing element. 7. The system of claim 5, wherein the fluid chamber is connected to the fluid path, and the fluid chamber has an intermediate contact element between the active sensing surface of the FSR sensing element and the fluid. 8. The system of claim 5, wherein the tail element is electrically connected to a processor in the system to provide sensed pressure output from the active sensing surface to the processor. 9. The system of claim 5, wherein the chambers connected to the fluid path via tubing. 10. The system of claim 5, wherein the fluid delivery mechanism is a pump and the chamber is located along the fluid path either upstream or downstream of the pump and connected to the fluid path via tubing. 11. The system of claim 1, wherein the system is a wearable medication delivery pump and the fluid delivery mechanism is a fluid pump, the wearable medication delivery pump comprising:
a planar base; the fluid pump; and a circuit board mounted on the base; wherein the fluid path comprises at least one channel embedded in the base, the base has a bottom surface that abuts the patient during use and a top surface facing the pump and the circuit board, and at least one channel embedded on the bottom surface and having a first end and a second end and an elongated section therebetween, the first end and the second end are connected to the fluid path via respective through holes extending between the bottom surface and the top surface, the elongated section has a first portion that is only accessible from the bottom surface and a second portion that is accessible from both the bottom surface and the top surface, the bottom surface of the base that comprises the elongated section is covered to contain the fluid therein during use by the patient, and the pressure sensor comprises a chamber on the top surface of the base that is in fluid contact with the second portion of the elongated section of the channel embedded in the base. 12. The system of claim 11, wherein pressure sensor has portion thereof that is electrically connected to a processor on the circuit board to provide sensed pressure output to the processor. 13. The system of claim 12, wherein the processor receives and processes sensed pressure output from the pressure sensor to determine at least one of whether a flow of the medication fluid to the patient is successful, reduced, or unsuccessful in delivering a designated amount of the medication fluid to the patient, and whether a level of the medication fluid in at least one of res and pump is below a designated amount. 14. A system for detecting a fluid characteristic in a medication fluid communication system comprising:
a fluid reservoir; a fluid path connected between the fluid reservoir and a patient; a pump that controls the flow of fluid from the fluid reservoir to the patient via the fluid path; a fluid flow sensor configured to measure a characteristic of fluid flow within the fluid path; a circuit board; and a planar base, the circuit board and pump being mounted on the base; wherein the fluid path comprises at least one channel embedded in the base, the base has a bottom surface that abuts the patient during use and a top surface facing the pump and the circuit board, and the at least one channel embedded on the bottom surface and having a first end and a second end and an elongated section therebetween, the first end and the second end are connected to the fluid path via respective through holes extending between the bottom surface and the top surface, the elongated section has a first portion that is only accessible from the bottom surface and a second portion that is accessible from both the bottom surface and the top surface, the bottom surface of the base that comprises the elongated section is covered to contain the fluid therein during use by the patient, and the fluid flow sensor comprises
a chamber on the top surface of the base that is in fluid contact with the second portion of the elongated section of the channel embedded in the base, and
a portion that is electrically connected to a processor on the circuit board to provide a sensor output to the processor, 15. The system of claim 14, wherein the processor is configured to process the sensor output to determine at least one of whether a flow of the medication fluid to the patient is successful, reduced, or unsuccessful in delivering a designated amount of the medication fluid to the patient, and whether a level of the medication fluid in at least one of res and pump is below a designated amount. 16. The system of claim 14, wherein the fluid flow sensor comprises a microelectromechanical systems (MEMS) flow sensor comprising a MEMS chip having a sensing component disposed in the chamber and in at least one of direct and indirect contact with the fluid in the chamber. 17. The system of claim 14, wherein the chamber is sealed to prevent leakage of the fluid. 18. The system of claim 14, wherein the sensor is a thermal of flight sensor. 19. The system of claim 14, wherein the second portion of the elongated section of the channel embedded in the base and the chamber are located along the fluid path either upstream or downstream of the pump. | A system and method is provided for detecting fluid low-volume and occlusion in a device using force sensing resistor (FSR) sensor. One or more force sensing resistors are positioned in communication with a fluid channel at one or more of a pump intake and pump outlet to detect pressure in the fluid channel. The pressure is detected through communication with the force sensing resistor and indicates an irregular system condition including but not limited to, fluid low-volume level and occlusion. Also provided are a fluid flow sensor (e.g., FSR or MEMS sensor) disposed relative to an embedded fluid channel in the base of a wearable medicine delivery pump.1. A system for detecting a fluid characteristic in a medication fluid communication system comprising:
a fluid reservoir; a fluid path connected between the fluid reservoir and a patient; a fluid delivery mechanism that controls the flow of fluid from the fluid reservoir to the patient via the fluid path; and a pressure sensor configured to measure pressure of the fluid within the fluid path based on a force corresponding to pressure exerted by the fluid in the fluid path flowing directly or indirectly over a designated surface area of the pressure sensor. 2. The system of claim 1, wherein the fluid characteristic is at least one of an occlusion and fluid low-volume level in at least one of the fluid reservoir and the fluid delivery mechanism determined using sensed pressure output from the pressure sensor. 3. The system of claim 1, wherein the pressure sensor is located along the fluid path upstream between the fluid reservoir and the fluid delivery mechanism, and the sensed pressure output from the pressure sensor pre-biased to detect negative pressure. 4. The system of claim 1, wherein the pressure sensor is located along the fluid path downstream between the fluid delivery mechanism and the patient. 5. The system of claim 1, wherein the pressure sensor is a force sensing resistor (FSR) sensor comprising a FSR sensing element having an active sensing surface disposed in a fluid chamber through which the fluid from the fluid path flows, and a tail element. 6. The system of claim 5, wherein the fluid chamber is connected to the fluid path, and the fluid in the fluid chamber directly contacts the active sensing surface of the FSR sensing element. 7. The system of claim 5, wherein the fluid chamber is connected to the fluid path, and the fluid chamber has an intermediate contact element between the active sensing surface of the FSR sensing element and the fluid. 8. The system of claim 5, wherein the tail element is electrically connected to a processor in the system to provide sensed pressure output from the active sensing surface to the processor. 9. The system of claim 5, wherein the chambers connected to the fluid path via tubing. 10. The system of claim 5, wherein the fluid delivery mechanism is a pump and the chamber is located along the fluid path either upstream or downstream of the pump and connected to the fluid path via tubing. 11. The system of claim 1, wherein the system is a wearable medication delivery pump and the fluid delivery mechanism is a fluid pump, the wearable medication delivery pump comprising:
a planar base; the fluid pump; and a circuit board mounted on the base; wherein the fluid path comprises at least one channel embedded in the base, the base has a bottom surface that abuts the patient during use and a top surface facing the pump and the circuit board, and at least one channel embedded on the bottom surface and having a first end and a second end and an elongated section therebetween, the first end and the second end are connected to the fluid path via respective through holes extending between the bottom surface and the top surface, the elongated section has a first portion that is only accessible from the bottom surface and a second portion that is accessible from both the bottom surface and the top surface, the bottom surface of the base that comprises the elongated section is covered to contain the fluid therein during use by the patient, and the pressure sensor comprises a chamber on the top surface of the base that is in fluid contact with the second portion of the elongated section of the channel embedded in the base. 12. The system of claim 11, wherein pressure sensor has portion thereof that is electrically connected to a processor on the circuit board to provide sensed pressure output to the processor. 13. The system of claim 12, wherein the processor receives and processes sensed pressure output from the pressure sensor to determine at least one of whether a flow of the medication fluid to the patient is successful, reduced, or unsuccessful in delivering a designated amount of the medication fluid to the patient, and whether a level of the medication fluid in at least one of res and pump is below a designated amount. 14. A system for detecting a fluid characteristic in a medication fluid communication system comprising:
a fluid reservoir; a fluid path connected between the fluid reservoir and a patient; a pump that controls the flow of fluid from the fluid reservoir to the patient via the fluid path; a fluid flow sensor configured to measure a characteristic of fluid flow within the fluid path; a circuit board; and a planar base, the circuit board and pump being mounted on the base; wherein the fluid path comprises at least one channel embedded in the base, the base has a bottom surface that abuts the patient during use and a top surface facing the pump and the circuit board, and the at least one channel embedded on the bottom surface and having a first end and a second end and an elongated section therebetween, the first end and the second end are connected to the fluid path via respective through holes extending between the bottom surface and the top surface, the elongated section has a first portion that is only accessible from the bottom surface and a second portion that is accessible from both the bottom surface and the top surface, the bottom surface of the base that comprises the elongated section is covered to contain the fluid therein during use by the patient, and the fluid flow sensor comprises
a chamber on the top surface of the base that is in fluid contact with the second portion of the elongated section of the channel embedded in the base, and
a portion that is electrically connected to a processor on the circuit board to provide a sensor output to the processor, 15. The system of claim 14, wherein the processor is configured to process the sensor output to determine at least one of whether a flow of the medication fluid to the patient is successful, reduced, or unsuccessful in delivering a designated amount of the medication fluid to the patient, and whether a level of the medication fluid in at least one of res and pump is below a designated amount. 16. The system of claim 14, wherein the fluid flow sensor comprises a microelectromechanical systems (MEMS) flow sensor comprising a MEMS chip having a sensing component disposed in the chamber and in at least one of direct and indirect contact with the fluid in the chamber. 17. The system of claim 14, wherein the chamber is sealed to prevent leakage of the fluid. 18. The system of claim 14, wherein the sensor is a thermal of flight sensor. 19. The system of claim 14, wherein the second portion of the elongated section of the channel embedded in the base and the chamber are located along the fluid path either upstream or downstream of the pump. | 2,800 |
12,382 | 12,382 | 16,667,600 | 2,864 | A method of calibrating a regulator includes: measuring at least one of a voltage and a current; comparing the measurement to a nominal value of the at least one of the voltage and the current; generating a correction parameter of the comparison of the measurement to the nominal value; and storing the correction parameter in a local memory of the regulator. | 1. A method of calibrating a regulator, the method comprising:
measuring at least one of a voltage and a current; comparing the measurement to a nominal value of the at least one of the voltage and the current; generating a correction parameter of the comparison of the measurement to the nominal value; and storing the correction parameter in a local memory of the regulator. 2. The method of claim 1, further comprising:
placing the regulator into a first mode; generating a first correction parameter of the first mode; placing the regulator into a second mode; and generating a second correction parameter of the second mode. 3. The method of claim 1, wherein generating a correction parameter of the comparison of the measurement to the nominal value comprises generating a voltage sense offset. 4. The method of claim 1, wherein generating a correction parameter of the comparison of the measurement to the nominal value comprises generating a current sense offset and a gain adjustment for each of multiple modes of operation. 5. The method of claim 1, wherein generating a correction parameter of the comparison of the measurement to the nominal value comprises generating an offset and a gain adjustment for a first power stage and a second power stage. 6. The method of claim 1, wherein generating a correction parameter of the comparison of the measurement to the nominal value comprises generating a look up table comprising a plurality of non-linear corrections of a current sense transfer function. 7. The method of claim 1, further comprising connecting a test system to the regulator, wherein the test system is adapted to:
control the regulator of a test procedure; receive the measurement from the regulator; calculate the correction parameter; and transfer the correction parameter to the regulator. 8. The method of claim 1, further comprising:
driving the regulator to generate a known output current, and wherein measuring the at least one of the voltage and the current comprises measuring the output current with a current sensor exhibiting an error; and comparing the measurement to the nominal value of the measurement comprises comparing the measurement to the known output current value. | A method of calibrating a regulator includes: measuring at least one of a voltage and a current; comparing the measurement to a nominal value of the at least one of the voltage and the current; generating a correction parameter of the comparison of the measurement to the nominal value; and storing the correction parameter in a local memory of the regulator.1. A method of calibrating a regulator, the method comprising:
measuring at least one of a voltage and a current; comparing the measurement to a nominal value of the at least one of the voltage and the current; generating a correction parameter of the comparison of the measurement to the nominal value; and storing the correction parameter in a local memory of the regulator. 2. The method of claim 1, further comprising:
placing the regulator into a first mode; generating a first correction parameter of the first mode; placing the regulator into a second mode; and generating a second correction parameter of the second mode. 3. The method of claim 1, wherein generating a correction parameter of the comparison of the measurement to the nominal value comprises generating a voltage sense offset. 4. The method of claim 1, wherein generating a correction parameter of the comparison of the measurement to the nominal value comprises generating a current sense offset and a gain adjustment for each of multiple modes of operation. 5. The method of claim 1, wherein generating a correction parameter of the comparison of the measurement to the nominal value comprises generating an offset and a gain adjustment for a first power stage and a second power stage. 6. The method of claim 1, wherein generating a correction parameter of the comparison of the measurement to the nominal value comprises generating a look up table comprising a plurality of non-linear corrections of a current sense transfer function. 7. The method of claim 1, further comprising connecting a test system to the regulator, wherein the test system is adapted to:
control the regulator of a test procedure; receive the measurement from the regulator; calculate the correction parameter; and transfer the correction parameter to the regulator. 8. The method of claim 1, further comprising:
driving the regulator to generate a known output current, and wherein measuring the at least one of the voltage and the current comprises measuring the output current with a current sensor exhibiting an error; and comparing the measurement to the nominal value of the measurement comprises comparing the measurement to the known output current value. | 2,800 |
12,383 | 12,383 | 15,727,721 | 2,833 | The present invention relates to a retractable electrical receptacle assembly which is installed into a standard electrical box and is substantially flush to a mounting surface into which the electrical box is mounted. The invention may be mounted into a wall, floor, countertop or work surface. The invention can be installed as part of new electrical service or can replace an existing outlet by wiring into an existing electrical box. The invention includes at least one operative socket in the closed position and at least one additional operative socket in the open position. | 1. A recessed retractable electrical receptacle assembly comprising:
a closed position and an open position; a rectangular housing adapted to fit inside a standard electrical box recessed into a mounting surface wherein said housing comprises a back side, four sides and one open side wherein a peripheral installation flange surrounds three sides of said open side and a housing hinge edge on one of said open side wherein said housing back side further comprises a wire connector comprising internal electrical contacts for connecting to electrical service wiring; a multi-socket connector adapted to fit inside said housing through said one open side and having a hinge edge for connecting to said housing hinged edge and wherein said multi-socket connector comprises a closed position socket surface and an open position socket surface adjacent to said closed position socket surface wherein the closed position socket surface and open position socket surface each comprise at least one electrical socket and wherein said at least one electrical socket is internally wired to said internal electrical contacts in said wire connector; an installation flange cover plate attachable to said peripheral installation flange said installation flange cover plate surrounding three sides of said closed position socket surface; and a hinge connecting said housing and said multi-socket connector for articulating said multi-socket connector outwardly away from said housing between said closed position and said open position wherein said open position socket surface is recessed in said housing in said closed position and said closed position socket surface and open position socket surface are exposed in said open position. 2. The recessed retractable electrical receptacle assembly of claim 1, wherein said hinge is a barrel and pin hinge. 3. The recessed retractable electrical receptacle assembly of claim 1, wherein said housing is no larger than 2 inches wide and 3 inches long and 3½ inches deep. 4. The recessed retractable electrical receptacle assembly of claim 1, wherein the protrusion of the closed socket surface from said installation cover plate in said open position is less than 2 inches. 5. The recessed retractable electrical receptacle assembly of claim 1, wherein the wire connector comprises wire bore holes for inserting electrical surface wires and intersecting screw bore holes for inserting screws for connecting the electrical service wiring to said internal electrical contacts. 6. The recessed retractable electrical receptacle assembly of claim 1, wherein said flange cover plate is removable. 7. The recessed retractable electrical receptacle assembly of claim 1, further comprising lock-release button. 8. The recessed retractable electrical receptacle assembly of claim 7, wherein said lock-release button is a slide release. | The present invention relates to a retractable electrical receptacle assembly which is installed into a standard electrical box and is substantially flush to a mounting surface into which the electrical box is mounted. The invention may be mounted into a wall, floor, countertop or work surface. The invention can be installed as part of new electrical service or can replace an existing outlet by wiring into an existing electrical box. The invention includes at least one operative socket in the closed position and at least one additional operative socket in the open position.1. A recessed retractable electrical receptacle assembly comprising:
a closed position and an open position; a rectangular housing adapted to fit inside a standard electrical box recessed into a mounting surface wherein said housing comprises a back side, four sides and one open side wherein a peripheral installation flange surrounds three sides of said open side and a housing hinge edge on one of said open side wherein said housing back side further comprises a wire connector comprising internal electrical contacts for connecting to electrical service wiring; a multi-socket connector adapted to fit inside said housing through said one open side and having a hinge edge for connecting to said housing hinged edge and wherein said multi-socket connector comprises a closed position socket surface and an open position socket surface adjacent to said closed position socket surface wherein the closed position socket surface and open position socket surface each comprise at least one electrical socket and wherein said at least one electrical socket is internally wired to said internal electrical contacts in said wire connector; an installation flange cover plate attachable to said peripheral installation flange said installation flange cover plate surrounding three sides of said closed position socket surface; and a hinge connecting said housing and said multi-socket connector for articulating said multi-socket connector outwardly away from said housing between said closed position and said open position wherein said open position socket surface is recessed in said housing in said closed position and said closed position socket surface and open position socket surface are exposed in said open position. 2. The recessed retractable electrical receptacle assembly of claim 1, wherein said hinge is a barrel and pin hinge. 3. The recessed retractable electrical receptacle assembly of claim 1, wherein said housing is no larger than 2 inches wide and 3 inches long and 3½ inches deep. 4. The recessed retractable electrical receptacle assembly of claim 1, wherein the protrusion of the closed socket surface from said installation cover plate in said open position is less than 2 inches. 5. The recessed retractable electrical receptacle assembly of claim 1, wherein the wire connector comprises wire bore holes for inserting electrical surface wires and intersecting screw bore holes for inserting screws for connecting the electrical service wiring to said internal electrical contacts. 6. The recessed retractable electrical receptacle assembly of claim 1, wherein said flange cover plate is removable. 7. The recessed retractable electrical receptacle assembly of claim 1, further comprising lock-release button. 8. The recessed retractable electrical receptacle assembly of claim 7, wherein said lock-release button is a slide release. | 2,800 |
12,384 | 12,384 | 16,133,578 | 2,881 | A method for irradiating a target with a beam of energetic electrically charged particles, wherein the target comprises an exposure region where an exposure by said beam is to be performed, and the exposure of a desired pattern is done employing a multitude of exposure positions on the target. Each exposure position represents the location of one of a multitude of exposure spots of uniform size and shape, with each exposure spot covering at least one pattern pixel of the desired pattern. The exposure positions are located within a number of mutually separate cluster areas which are defined at respective fixed locations on the target. In each cluster area the exposure position are within a given neighboring distance to a next neighboring exposure position, while the cluster areas are separated from each other by spaces free of exposure positions, which space has a width, which is at least the double of the neighboring distance. | 1. A method for irradiating a target with a beam of energetic radiation composed of electrically charged particles, wherein the target comprises an exposure region where an exposure by said beam is to be performed, the method comprising the steps of:
defining a multitude of pattern pixels located at fixed pixel locations within said exposure region, dividing said exposure region into a number of stripes of predefined width, defining, for each stripe, a multitude of exposure positions on the target, each exposure position representing the location of one of a multitude of exposure spots, the exposure spots having uniform size and shape and each exposure spot covering at least one pattern pixel, providing a pattern definition device having a plurality of apertures transparent to said radiation, illuminating said pattern definition device by means of an illuminating wide beam, which traverses the pattern definition device through said apertures thus forming a patterned beam consisting of a corresponding plurality of beamlets, forming said patterned beam into a pattern image on the location of the target, said pattern image comprising the images of at least part of the plurality of apertures, which images sequentially expose the exposure spots in accordance with a desired pattern, and generating a relative movement between said target and the pattern definition device producing a movement of said pattern image on the target according to a path corresponding to said stripes, wherein the width of the pattern image, taken across the direction of movement is at least the width of the respective stripes,
wherein defining a multitude of exposure positions is performed with regard to a number of mutually separate cluster areas defined at respective fixed locations on the target, and comprises:
defining locations of the exposure positions such that each exposure position is within one of the cluster areas, each of said cluster areas comprising a number of exposure positions arranged such that each exposure position is within a given neighboring distance to at least one exposure position of the same cluster area, wherein said neighboring distance is smaller than a size of the images of apertures generated on the target,
wherein the cluster areas are separated from each other by spaces free of exposure positions, said spaces having a width, which is at least the double of said neighboring distance along at least one direction within the exposure region. 2. The method of claim 1, wherein a number of stripes is written, each stripe being associated with a subset of grid locations of exposure positions for the cluster areas within the respective stripe, the subsets of different stripes being mutually different and, when taken together, combining to a complete cover of the exposure positions in the cluster areas. 3. The method of claim 2, wherein each of the cluster areas comprises at least two sets of exposure positions associated with a respective subset of grid locations, and each of said sets of exposure positions comprises a minimal number of exposure positions, said minimal number being valid for all cluster areas, said minimal number being four, five or more. 4. The method of claim 3, wherein for each of said sets of exposure positions, the spatial arrangement of exposure positions of different cluster areas, but associated with the same subset of grid locations, are the same when seen relative to a center position of the respective cluster area. 5. The method of claim 1, wherein each of the cluster areas comprises a number of exposure positions, said number of exposure positions being equal or greater than a minimal number common to all cluster areas, said minimal number being four, five or more. 6. The method of claim 1, wherein the size of each cluster area is larger by at least a factor of 3/2 than the size of the image of apertures as imaged onto the target, with regard to both a direction parallel to said direction of movement and a direction transversal thereto. 7. The method of claim 1, wherein the arrangements of positions within the cluster areas repeat from one cluster area to the next. 8. The method of claim 1, wherein those locations of exposure positions which are exposed simultaneously on the target are arranged according to a two-dimensional grid which directly corresponds to a projected image of a two-dimensional regular arrangement of the apertures in the pattern definition device. 9. The method of claim 8, wherein for each of the cluster areas, and when seen relative to a center position of the respective cluster area, the spatial arrangement of exposure positions is the same for the different cluster areas. 10. The method of claim 9, wherein the set of center positions of the cluster areas is a union of several placement grids as represented by positions of images of apertures on the target. 11. The method of claim 9, wherein the cluster areas are located at predefined positions, said predefined positions forming a regular arrangement on the target in said exposure region, which regular arrangement corresponds to a superset of said two-dimensional grid. 12. The method of claim 2, wherein each stripe contains at least two rows of cluster areas arranged along said main direction. 13. The method of claim 1, wherein within a cluster area the exposure positions are arranged along a regular grid. 14. The method of claim 1, wherein within a cluster area, the exposure positions are arranged to each other at an oblique angle with respect to said direction of movement. 15. The method of claim 1, wherein within a cluster area the set of exposure positions includes a group of exposure positions which are arranged in a defined spatial arrangement, said defined spatial arrangement being designed to produce a predetermined shape each of the group of exposure positions is exposed. 16. The method of claim 1, wherein the cluster areas are arranged along a number of lines, said lines being located at uniform offsets. 17. The method of claim 16, wherein the lines of said number of lines correspond to lines of a line pattern which is pre-formed on the target, and the cluster areas are arranged along said lines at regular intervals. 18. The method of claim 1, wherein said neighboring distance is not greater than the nominal size of images of apertures. 19. The method of claim 1, wherein the exposure positions are selectively exposed at respective exposure doses according to an actual pattern of pattern pixels to be exposed, wherein the position of the exposure positions is independent of the actual pattern. 20. The method of claim 1, wherein uniformly timed exposure steps are used for exposing respective pattern pixels in exposure positions on the target, and during said exposure steps the location of the pattern image is moved along with the target at least with respect to the relative movement along the main direction, and between exposure steps the location of the pattern image is changed with respect to the target, generally compensating the movement of the location of the pattern image with regard to the location of the pattern definition device, wherein the duration of said exposure steps corresponds to a uniform distance of advance along the main direction, said distance of advance being greater than the size of an aperture image within the same partial grid along the main direction. 21. The method of claim 1, wherein the cluster areas are separated from each other by spaces free of exposure positions, along both a direction parallel to said direction of movement and a direction transversal thereto. 22. The method of claim 6, wherein said factor is at least double the size of the image of apertures as imaged onto the target. | A method for irradiating a target with a beam of energetic electrically charged particles, wherein the target comprises an exposure region where an exposure by said beam is to be performed, and the exposure of a desired pattern is done employing a multitude of exposure positions on the target. Each exposure position represents the location of one of a multitude of exposure spots of uniform size and shape, with each exposure spot covering at least one pattern pixel of the desired pattern. The exposure positions are located within a number of mutually separate cluster areas which are defined at respective fixed locations on the target. In each cluster area the exposure position are within a given neighboring distance to a next neighboring exposure position, while the cluster areas are separated from each other by spaces free of exposure positions, which space has a width, which is at least the double of the neighboring distance.1. A method for irradiating a target with a beam of energetic radiation composed of electrically charged particles, wherein the target comprises an exposure region where an exposure by said beam is to be performed, the method comprising the steps of:
defining a multitude of pattern pixels located at fixed pixel locations within said exposure region, dividing said exposure region into a number of stripes of predefined width, defining, for each stripe, a multitude of exposure positions on the target, each exposure position representing the location of one of a multitude of exposure spots, the exposure spots having uniform size and shape and each exposure spot covering at least one pattern pixel, providing a pattern definition device having a plurality of apertures transparent to said radiation, illuminating said pattern definition device by means of an illuminating wide beam, which traverses the pattern definition device through said apertures thus forming a patterned beam consisting of a corresponding plurality of beamlets, forming said patterned beam into a pattern image on the location of the target, said pattern image comprising the images of at least part of the plurality of apertures, which images sequentially expose the exposure spots in accordance with a desired pattern, and generating a relative movement between said target and the pattern definition device producing a movement of said pattern image on the target according to a path corresponding to said stripes, wherein the width of the pattern image, taken across the direction of movement is at least the width of the respective stripes,
wherein defining a multitude of exposure positions is performed with regard to a number of mutually separate cluster areas defined at respective fixed locations on the target, and comprises:
defining locations of the exposure positions such that each exposure position is within one of the cluster areas, each of said cluster areas comprising a number of exposure positions arranged such that each exposure position is within a given neighboring distance to at least one exposure position of the same cluster area, wherein said neighboring distance is smaller than a size of the images of apertures generated on the target,
wherein the cluster areas are separated from each other by spaces free of exposure positions, said spaces having a width, which is at least the double of said neighboring distance along at least one direction within the exposure region. 2. The method of claim 1, wherein a number of stripes is written, each stripe being associated with a subset of grid locations of exposure positions for the cluster areas within the respective stripe, the subsets of different stripes being mutually different and, when taken together, combining to a complete cover of the exposure positions in the cluster areas. 3. The method of claim 2, wherein each of the cluster areas comprises at least two sets of exposure positions associated with a respective subset of grid locations, and each of said sets of exposure positions comprises a minimal number of exposure positions, said minimal number being valid for all cluster areas, said minimal number being four, five or more. 4. The method of claim 3, wherein for each of said sets of exposure positions, the spatial arrangement of exposure positions of different cluster areas, but associated with the same subset of grid locations, are the same when seen relative to a center position of the respective cluster area. 5. The method of claim 1, wherein each of the cluster areas comprises a number of exposure positions, said number of exposure positions being equal or greater than a minimal number common to all cluster areas, said minimal number being four, five or more. 6. The method of claim 1, wherein the size of each cluster area is larger by at least a factor of 3/2 than the size of the image of apertures as imaged onto the target, with regard to both a direction parallel to said direction of movement and a direction transversal thereto. 7. The method of claim 1, wherein the arrangements of positions within the cluster areas repeat from one cluster area to the next. 8. The method of claim 1, wherein those locations of exposure positions which are exposed simultaneously on the target are arranged according to a two-dimensional grid which directly corresponds to a projected image of a two-dimensional regular arrangement of the apertures in the pattern definition device. 9. The method of claim 8, wherein for each of the cluster areas, and when seen relative to a center position of the respective cluster area, the spatial arrangement of exposure positions is the same for the different cluster areas. 10. The method of claim 9, wherein the set of center positions of the cluster areas is a union of several placement grids as represented by positions of images of apertures on the target. 11. The method of claim 9, wherein the cluster areas are located at predefined positions, said predefined positions forming a regular arrangement on the target in said exposure region, which regular arrangement corresponds to a superset of said two-dimensional grid. 12. The method of claim 2, wherein each stripe contains at least two rows of cluster areas arranged along said main direction. 13. The method of claim 1, wherein within a cluster area the exposure positions are arranged along a regular grid. 14. The method of claim 1, wherein within a cluster area, the exposure positions are arranged to each other at an oblique angle with respect to said direction of movement. 15. The method of claim 1, wherein within a cluster area the set of exposure positions includes a group of exposure positions which are arranged in a defined spatial arrangement, said defined spatial arrangement being designed to produce a predetermined shape each of the group of exposure positions is exposed. 16. The method of claim 1, wherein the cluster areas are arranged along a number of lines, said lines being located at uniform offsets. 17. The method of claim 16, wherein the lines of said number of lines correspond to lines of a line pattern which is pre-formed on the target, and the cluster areas are arranged along said lines at regular intervals. 18. The method of claim 1, wherein said neighboring distance is not greater than the nominal size of images of apertures. 19. The method of claim 1, wherein the exposure positions are selectively exposed at respective exposure doses according to an actual pattern of pattern pixels to be exposed, wherein the position of the exposure positions is independent of the actual pattern. 20. The method of claim 1, wherein uniformly timed exposure steps are used for exposing respective pattern pixels in exposure positions on the target, and during said exposure steps the location of the pattern image is moved along with the target at least with respect to the relative movement along the main direction, and between exposure steps the location of the pattern image is changed with respect to the target, generally compensating the movement of the location of the pattern image with regard to the location of the pattern definition device, wherein the duration of said exposure steps corresponds to a uniform distance of advance along the main direction, said distance of advance being greater than the size of an aperture image within the same partial grid along the main direction. 21. The method of claim 1, wherein the cluster areas are separated from each other by spaces free of exposure positions, along both a direction parallel to said direction of movement and a direction transversal thereto. 22. The method of claim 6, wherein said factor is at least double the size of the image of apertures as imaged onto the target. | 2,800 |
12,385 | 12,385 | 13,944,407 | 2,862 | A method and apparatus for monitoring a structure using an optical fiber based distributed acoustic sensor (DAS) extending along the length of the structure. The DAS is able to resolve a separate acoustic signal with a spatial resolution of 1 m along the length of the fibre, and hence is able to operate with an acoustic positioning system to determine the position of the riser with the same spatial resolution. In addition, the fiber can at the same time also detect much lower frequency mechanical vibrations in the riser, for example such as resonant mode vibrations induced by movement in the surrounding medium. By using vibration detection in combination with acoustic positioning then overall structure shape monitoring can be undertaken, which is useful for vortex induced vibration (VIV) visualisation, fatigue analysis, and a variety of other advanced purposes. The structure may be a sub-sea riser. | 1. A method of monitoring the position of a structure using an optical fiber distributed acoustic sensor deployed in a known relationship with respect to the structure such that a known part of the optical fiber corresponds to a known part of the structure, the method comprising:
using the optical fiber as a distributed acoustic sensor to detect, at a plurality of acoustic sensor positions along the fibre, acoustic signals emitted by a plurality of acoustic sources deployed at known positions in an area in which the structure to be monitored is located; calculating relative positions of a plurality of the acoustic sensors in dependence on the detected acoustic signals from the acoustic sources; and from the calculated positions of the sensors along the fibre, determining a shape, or shape and position, of the structure in dependence on the known relationship between the fiber and the structure. 2. A method according to claim 1, wherein the relative position of one of the acoustic sensors on the fiber is determined in dependence upon the relative position determined for one or more others of the sensors. 3. A method according to claim 2, wherein the relative position found for one of the acoustic sensors on the fiber is checked to determine whether it is within an allowable distance of the position previously found for another of the acoustic sensors on the fibre, given the known length of fiber between the respective positions of the two acoustic sensors on the fiber. 4. A method according to claim 1, wherein the relative position of one of the sensors is determined in dependence on the time taken for respective signals from one or more of the acoustic sources of known position to reach the sensor. 5. A method according to claim 1, wherein the calculating further comprises:
forming a plurality of subsets of the acoustic sensors, a subset of sensors comprising a virtual line array of acoustic sensors, and determining direction from a subset of sensors to an acoustic source of known position in dependence on a phase delay of receipt of an acoustic signal from the acoustic source across the acoustic sensors of the array. 6. A method according to claim 5, wherein the subsets of sensors overlap, such that any one acoustic sensor is a member of more than one subset. 7. A method according to claim 5, wherein the position of a subset is determined by detecting direction to n acoustic sources, where there are n degrees of freedom of the sensors forming the subset. 8. A method according to claim 1, and further comprising:
detecting backscattered light on the fiber, the backscatter being dependent on strain induced in the fibre due to mechanical strain in the structure to which the fibre relates caused by vibrations in the structure; from the detected backscatter, processing a signal representative thereof to determine a frequency of oscillation of the vibrations in the structure. 9. A method according to claim 8, and further comprising frequency filtering the signal detected by the optical fibre distributed acoustic sensor into low frequencies and high frequencies, wherein the low frequencies (<100 Hz) are used for vibration detection, and the high frequencies (>1 kHz) are used for position monitoring. 10. A method according to claim 1, and further comprising undertaking passive acoustic monitoring. 11. A method according to claim 11, wherein the passive acoustic monitoring comprises detecting acoustic events having an energy greater than a predetermined energy threshold. 12. A method according to claim 1, wherein the structure is a subsea riser. 13. A method according to claim 1, and further comprising repeatedly determining the shape, or shape and position, of the structure so as to track changes in shape and/or movement of the structure with respect to time. 14. A method according to claim 13, and further comprising undertaking fatigue monitoring or analysis of the structure in dependence on the tracked changes in shape and/or movement of the structure. 15. A system for monitoring the position of a structure, comprising:
an optical fiber distributed acoustic sensor system deployed in a known relationship with respect to the structure such that a known part of the optical fiber corresponds to a known part of the structure, the sensor system further comprising a processor arranged to perform the following:
i) use the optical fiber as a distributed acoustic sensor to detect, at a plurality of acoustic sensor positions along the fibre, acoustic signals emitted by a plurality of acoustic sources deployed at known positions in an area in which the structure to be monitored is located;
ii) calculate relative positions of a plurality of the acoustic sensors in dependence on the detected acoustic signals from the acoustic sources; and
iii) from the calculated positions of the sensors along the fibre, determine a shape, or shape and position, of the structure in dependence on the known relationship between the fiber and the structure. 16. A system according to claim 15, wherein the relative position of one of the acoustic sensors on the fiber is determined in dependence upon the relative position determined for one or more others of the sensors. 17. A system according to claim 16, wherein the relative position found for one of the acoustic sensors on the fiber is checked to determine whether it is within an allowable distance of the position previously found for another of the acoustic sensors on the fibre, given the known length of fiber between the respective positions of the two acoustic sensors on the fiber. 18. A system according to claim 15, wherein the relative position of one of the sensors is determined in dependence on the time taken for respective signals from one or more of the acoustic sources of known position to reach the sensor. 19. A system according to claim 15, wherein the calculating further comprises:
forming a plurality of subsets of the acoustic sensors, a subset of sensors comprising a virtual line array of acoustic sensors, and determining direction from a subset of sensors to an acoustic source of known position in dependence on a phase delay of receipt of an acoustic signal from the acoustic source across the acoustic sensors of the array. 20. A system according to claim 15, and further comprising:
an interferometer arrangement arranged to detect backscattered light on the fiber, the backscatter being dependent on strain induced in the fibre due to mechanical strain in the structure to which the fibre relates caused by vibrations in the structure; and a processor arranged, from the detected backscatter, to process a signal representative thereof to determine a frequency of oscillation of the vibrations in the structure. | A method and apparatus for monitoring a structure using an optical fiber based distributed acoustic sensor (DAS) extending along the length of the structure. The DAS is able to resolve a separate acoustic signal with a spatial resolution of 1 m along the length of the fibre, and hence is able to operate with an acoustic positioning system to determine the position of the riser with the same spatial resolution. In addition, the fiber can at the same time also detect much lower frequency mechanical vibrations in the riser, for example such as resonant mode vibrations induced by movement in the surrounding medium. By using vibration detection in combination with acoustic positioning then overall structure shape monitoring can be undertaken, which is useful for vortex induced vibration (VIV) visualisation, fatigue analysis, and a variety of other advanced purposes. The structure may be a sub-sea riser.1. A method of monitoring the position of a structure using an optical fiber distributed acoustic sensor deployed in a known relationship with respect to the structure such that a known part of the optical fiber corresponds to a known part of the structure, the method comprising:
using the optical fiber as a distributed acoustic sensor to detect, at a plurality of acoustic sensor positions along the fibre, acoustic signals emitted by a plurality of acoustic sources deployed at known positions in an area in which the structure to be monitored is located; calculating relative positions of a plurality of the acoustic sensors in dependence on the detected acoustic signals from the acoustic sources; and from the calculated positions of the sensors along the fibre, determining a shape, or shape and position, of the structure in dependence on the known relationship between the fiber and the structure. 2. A method according to claim 1, wherein the relative position of one of the acoustic sensors on the fiber is determined in dependence upon the relative position determined for one or more others of the sensors. 3. A method according to claim 2, wherein the relative position found for one of the acoustic sensors on the fiber is checked to determine whether it is within an allowable distance of the position previously found for another of the acoustic sensors on the fibre, given the known length of fiber between the respective positions of the two acoustic sensors on the fiber. 4. A method according to claim 1, wherein the relative position of one of the sensors is determined in dependence on the time taken for respective signals from one or more of the acoustic sources of known position to reach the sensor. 5. A method according to claim 1, wherein the calculating further comprises:
forming a plurality of subsets of the acoustic sensors, a subset of sensors comprising a virtual line array of acoustic sensors, and determining direction from a subset of sensors to an acoustic source of known position in dependence on a phase delay of receipt of an acoustic signal from the acoustic source across the acoustic sensors of the array. 6. A method according to claim 5, wherein the subsets of sensors overlap, such that any one acoustic sensor is a member of more than one subset. 7. A method according to claim 5, wherein the position of a subset is determined by detecting direction to n acoustic sources, where there are n degrees of freedom of the sensors forming the subset. 8. A method according to claim 1, and further comprising:
detecting backscattered light on the fiber, the backscatter being dependent on strain induced in the fibre due to mechanical strain in the structure to which the fibre relates caused by vibrations in the structure; from the detected backscatter, processing a signal representative thereof to determine a frequency of oscillation of the vibrations in the structure. 9. A method according to claim 8, and further comprising frequency filtering the signal detected by the optical fibre distributed acoustic sensor into low frequencies and high frequencies, wherein the low frequencies (<100 Hz) are used for vibration detection, and the high frequencies (>1 kHz) are used for position monitoring. 10. A method according to claim 1, and further comprising undertaking passive acoustic monitoring. 11. A method according to claim 11, wherein the passive acoustic monitoring comprises detecting acoustic events having an energy greater than a predetermined energy threshold. 12. A method according to claim 1, wherein the structure is a subsea riser. 13. A method according to claim 1, and further comprising repeatedly determining the shape, or shape and position, of the structure so as to track changes in shape and/or movement of the structure with respect to time. 14. A method according to claim 13, and further comprising undertaking fatigue monitoring or analysis of the structure in dependence on the tracked changes in shape and/or movement of the structure. 15. A system for monitoring the position of a structure, comprising:
an optical fiber distributed acoustic sensor system deployed in a known relationship with respect to the structure such that a known part of the optical fiber corresponds to a known part of the structure, the sensor system further comprising a processor arranged to perform the following:
i) use the optical fiber as a distributed acoustic sensor to detect, at a plurality of acoustic sensor positions along the fibre, acoustic signals emitted by a plurality of acoustic sources deployed at known positions in an area in which the structure to be monitored is located;
ii) calculate relative positions of a plurality of the acoustic sensors in dependence on the detected acoustic signals from the acoustic sources; and
iii) from the calculated positions of the sensors along the fibre, determine a shape, or shape and position, of the structure in dependence on the known relationship between the fiber and the structure. 16. A system according to claim 15, wherein the relative position of one of the acoustic sensors on the fiber is determined in dependence upon the relative position determined for one or more others of the sensors. 17. A system according to claim 16, wherein the relative position found for one of the acoustic sensors on the fiber is checked to determine whether it is within an allowable distance of the position previously found for another of the acoustic sensors on the fibre, given the known length of fiber between the respective positions of the two acoustic sensors on the fiber. 18. A system according to claim 15, wherein the relative position of one of the sensors is determined in dependence on the time taken for respective signals from one or more of the acoustic sources of known position to reach the sensor. 19. A system according to claim 15, wherein the calculating further comprises:
forming a plurality of subsets of the acoustic sensors, a subset of sensors comprising a virtual line array of acoustic sensors, and determining direction from a subset of sensors to an acoustic source of known position in dependence on a phase delay of receipt of an acoustic signal from the acoustic source across the acoustic sensors of the array. 20. A system according to claim 15, and further comprising:
an interferometer arrangement arranged to detect backscattered light on the fiber, the backscatter being dependent on strain induced in the fibre due to mechanical strain in the structure to which the fibre relates caused by vibrations in the structure; and a processor arranged, from the detected backscatter, to process a signal representative thereof to determine a frequency of oscillation of the vibrations in the structure. | 2,800 |
12,386 | 12,386 | 15,814,442 | 2,856 | A tester that can be quickly and easily connected and/or disconnected to a device is described. The tester can check for leaks in the device. The tester can provide a conduit for fluid to flow to the device and a flow meter reading can demonstrate that the device has leakage or no leakage. | 1. A leak tester for a device, comprising:
a rod; a securer coupled to the rod; a gasket coupled to the securer; and a tip coupled to the gasket, where the securer is configured to be adjusted so as to pull the tip toward the securer, compressing the gasket against the device to create a seal, where the seal creates a fluid permeability between fluid in the device and outside of the device to be about zero. 2. The leak tester of claim 1, comprising:
a plate, where the rod protrudes through the plate, through the gasket, and at least into the tip, where the gasket is situated between the plate and the tip, and is used to create a seal between the plate and the tip, and where an area of a surface of the plate that comes into contact with the device, is greater than or equal to a cross sectional area of the device that comes into contact with the surface of the plate. 3. The leak tester of claim 2, comprising:
a material distributed on a surface of the plate that faces the device, where the rod protrudes through the plate and through the material, and where the material yields to some degree to create a seal between the material, the gasket, and the tip. 4. The leak tester of claim 1, comprising a fluid connection element,
where the fluid connection element is connected to the rod to allow fluid to flow through the fluid connection element and through the rod, where the rod is not solid, and where the fluid is a gas. 5. The leak tester of claim 4, where the fluid connection element comprises a barbed surface to grip a fluid connection. 6. The leak tester of claim 4, where the fluid connection element connects to a supply, the supply comprising:
a regulator configured to release a gas from a source that flows into the device, and a gas flow meter configured to output a rate of gas flow into the device. 7. The leak tester of claim 1, where a cross sectional area of the tip is less than an interior cross sectional area of the device at a point of connection between the tip and the device. 8. A method of pressure testing a device using a tester, the tester comprising a rod; a securer coupled to the rod; a gasket coupled to the securer; and a tip coupled to the gasket, the method comprising:
experiencing an adjustment to the securer; pulling the tip toward the securer in response to the adjustment; compressing the gasket against the device to create a seal; and experiencing a flow of a fluid from an external source, through the rod and into the device, where the seal creates a fluid permeability between fluid in the device and ambient fluid of about zero. 9. The method of claim 8, comprising registering a level of flow of the fluid into the device, where when the level of flow of fluid is approximately zero, there is no leak. 10. The method of claim 8,
where the tester comprises a plate that is situated between the securer and the gasket and where an area of a surface of the plate that comes into contact with the device, is greater than or equal to a cross sectional area of the device. 11. The method of claim 8,
where the tester comprises a fluid connection element that is configured to connect to an external source that supplies a fluid, where the fluid connection element is configured to be connected to the rod to allow the fluid to flow through the fluid connection element, through the rod, and into the device, where the rod is hollow, and where the fluid is a liquid. 12. The method of claim 11, where the fluid connection element comprises a barbed surface to grip a fluid connection. 13. The method of claim 8, where the tester comprises:
a material distributed on a surface of the plate that faces the device and where the material experiences a yielding to some degree to create a seal between the material, the gasket, and the tip. 14. The method of claim 10, where the fluid connection element connects to a supply, the supply comprising:
a regulator configured to cause a gas to flow from a source into the device, and a gas flow meter configured to output a rate of gas flow into the device. 15. The method of claim 8, where the tip is a hard material whose cross sectional area is approximately equal to an interior cross sectional area of the device at a point of connection between the tip and the device. 16. A system, comprising:
a tester for a device, the tester comprising:
a rod that is not solid;
a securer coupled to the rod;
a gasket coupled to the securer; and
a tip coupled to the gasket; and
a gas connection element; where the gas connection element is configured to be connected to a supply, the supply comprising:
a regulator configured to set a pressure of a gas that flows into the device, and
a flow meter configured to output a rate of gas flow into the device,
where the securer is configured to be adjusted to pull the tip toward the securer, compressing the gasket against the device to create a seal, where the seal creates a fluid permeability between fluid in the device and ambient fluid of about zero, where the gas connection element is configured to be connected to the rod to allow gas to flow through the gas connection element and through the rod, and where when the level of flow of the gas into the device is approximately zero, there is no leak. 17. The system of claim 16, comprising:
a plate, where the rod is configured to protrude through the plate, through the gasket, and at least into the tip, where the gasket is configured to be situated between the plate and the tip, and is configured to create a seal between the plate and the tip, and where an area of a surface of the plate that comes into contact with the device, is greater than or equal to a cross sectional area of the device. 18. The system of claim 17, comprising:
a material distributed on a surface of the plate that faces the device and where the material yields to some degree to create a seal between the material, the gasket, and the tip. 19. The system of claim 16, where the gas connection element comprises a barbed surface to grip a gas connection that connects to the supply. 20. The system of claim 16, where a cross sectional area of the tip is less than an interior cross sectional area of the device at a point of connection between the tip and the device. | A tester that can be quickly and easily connected and/or disconnected to a device is described. The tester can check for leaks in the device. The tester can provide a conduit for fluid to flow to the device and a flow meter reading can demonstrate that the device has leakage or no leakage.1. A leak tester for a device, comprising:
a rod; a securer coupled to the rod; a gasket coupled to the securer; and a tip coupled to the gasket, where the securer is configured to be adjusted so as to pull the tip toward the securer, compressing the gasket against the device to create a seal, where the seal creates a fluid permeability between fluid in the device and outside of the device to be about zero. 2. The leak tester of claim 1, comprising:
a plate, where the rod protrudes through the plate, through the gasket, and at least into the tip, where the gasket is situated between the plate and the tip, and is used to create a seal between the plate and the tip, and where an area of a surface of the plate that comes into contact with the device, is greater than or equal to a cross sectional area of the device that comes into contact with the surface of the plate. 3. The leak tester of claim 2, comprising:
a material distributed on a surface of the plate that faces the device, where the rod protrudes through the plate and through the material, and where the material yields to some degree to create a seal between the material, the gasket, and the tip. 4. The leak tester of claim 1, comprising a fluid connection element,
where the fluid connection element is connected to the rod to allow fluid to flow through the fluid connection element and through the rod, where the rod is not solid, and where the fluid is a gas. 5. The leak tester of claim 4, where the fluid connection element comprises a barbed surface to grip a fluid connection. 6. The leak tester of claim 4, where the fluid connection element connects to a supply, the supply comprising:
a regulator configured to release a gas from a source that flows into the device, and a gas flow meter configured to output a rate of gas flow into the device. 7. The leak tester of claim 1, where a cross sectional area of the tip is less than an interior cross sectional area of the device at a point of connection between the tip and the device. 8. A method of pressure testing a device using a tester, the tester comprising a rod; a securer coupled to the rod; a gasket coupled to the securer; and a tip coupled to the gasket, the method comprising:
experiencing an adjustment to the securer; pulling the tip toward the securer in response to the adjustment; compressing the gasket against the device to create a seal; and experiencing a flow of a fluid from an external source, through the rod and into the device, where the seal creates a fluid permeability between fluid in the device and ambient fluid of about zero. 9. The method of claim 8, comprising registering a level of flow of the fluid into the device, where when the level of flow of fluid is approximately zero, there is no leak. 10. The method of claim 8,
where the tester comprises a plate that is situated between the securer and the gasket and where an area of a surface of the plate that comes into contact with the device, is greater than or equal to a cross sectional area of the device. 11. The method of claim 8,
where the tester comprises a fluid connection element that is configured to connect to an external source that supplies a fluid, where the fluid connection element is configured to be connected to the rod to allow the fluid to flow through the fluid connection element, through the rod, and into the device, where the rod is hollow, and where the fluid is a liquid. 12. The method of claim 11, where the fluid connection element comprises a barbed surface to grip a fluid connection. 13. The method of claim 8, where the tester comprises:
a material distributed on a surface of the plate that faces the device and where the material experiences a yielding to some degree to create a seal between the material, the gasket, and the tip. 14. The method of claim 10, where the fluid connection element connects to a supply, the supply comprising:
a regulator configured to cause a gas to flow from a source into the device, and a gas flow meter configured to output a rate of gas flow into the device. 15. The method of claim 8, where the tip is a hard material whose cross sectional area is approximately equal to an interior cross sectional area of the device at a point of connection between the tip and the device. 16. A system, comprising:
a tester for a device, the tester comprising:
a rod that is not solid;
a securer coupled to the rod;
a gasket coupled to the securer; and
a tip coupled to the gasket; and
a gas connection element; where the gas connection element is configured to be connected to a supply, the supply comprising:
a regulator configured to set a pressure of a gas that flows into the device, and
a flow meter configured to output a rate of gas flow into the device,
where the securer is configured to be adjusted to pull the tip toward the securer, compressing the gasket against the device to create a seal, where the seal creates a fluid permeability between fluid in the device and ambient fluid of about zero, where the gas connection element is configured to be connected to the rod to allow gas to flow through the gas connection element and through the rod, and where when the level of flow of the gas into the device is approximately zero, there is no leak. 17. The system of claim 16, comprising:
a plate, where the rod is configured to protrude through the plate, through the gasket, and at least into the tip, where the gasket is configured to be situated between the plate and the tip, and is configured to create a seal between the plate and the tip, and where an area of a surface of the plate that comes into contact with the device, is greater than or equal to a cross sectional area of the device. 18. The system of claim 17, comprising:
a material distributed on a surface of the plate that faces the device and where the material yields to some degree to create a seal between the material, the gasket, and the tip. 19. The system of claim 16, where the gas connection element comprises a barbed surface to grip a gas connection that connects to the supply. 20. The system of claim 16, where a cross sectional area of the tip is less than an interior cross sectional area of the device at a point of connection between the tip and the device. | 2,800 |
12,387 | 12,387 | 16,710,190 | 2,896 | A fiber distribution system (10) includes a fiber distribution hub (20, 300); at least one fiber distribution terminal (30, 100); and a cable (40) wrapped around a spool (110) of the fiber distribution terminal (30, 100). The fiber distribution terminal (30, 100) includes a spool (110) and a management tray (120) that rotate together. A second connectorized end (40b) of the cable (40) is held at a fiber optic adapter (125) on the tray (120). After dispensing the first connectorized end (40a) to the hub (20), an optical splitter (70, 130, 140) can be mounted to the tray (120). The splitter (26, 70, 130, 140, 306) has output adapters at which patch cords (50) can be inserted to connect subscribers to the system. The fiber distribution hub can use the same format of splitters (26, 70, 130, 140, 306). Other distributed splitter systems are provided with splicing and/or adding of splitters as needed. | 1-28. (canceled) 29. A fiber distribution hub comprising:
an enclosure including a door for accessing an interior of enclosure; a plurality of pivotally mounted splitter trays; a plurality of splitters mounted to the plurality of pivotally mounted splitter trays splice trays. 30. The fiber distribution hub of claim 29, further comprising a splice tray, wherein the splice tray is mounted in a stack with the plurality of pivotally mounted splitter trays. 31-34. (canceled) 35. A fiber distribution hub comprising:
an enclosure; a plurality of fiber optic splitters mounted within the enclosure; a plurality of fanouts mounted to the enclosure, wherein each of the plurality of fanouts includes a splice region for splicing riser cables to connectorized pigtails that lead to outputs of the plurality of fiber optic splitters, wherein inputs of the plurality of fiber optic receive fibers spliced from a feeder cable entering the enclosure. 36. The fiber distribution hub of claim 35, wherein the plurality of fiber optic splitters are provided in a stacked arrangement extending from a front of the enclosure toward a rear of the enclosure. 37. The fiber distribution hub of claim 35, wherein the plurality of fanouts are mounted above the plurality of fiber optic splitters and provided in a stacked arrangement extending along a direction from a front of the enclosure toward a rear of the enclosure. 38. The fiber distribution hub of claim 35, wherein the plurality of fiber optic splitters each include one input and sixteen outputs. | A fiber distribution system (10) includes a fiber distribution hub (20, 300); at least one fiber distribution terminal (30, 100); and a cable (40) wrapped around a spool (110) of the fiber distribution terminal (30, 100). The fiber distribution terminal (30, 100) includes a spool (110) and a management tray (120) that rotate together. A second connectorized end (40b) of the cable (40) is held at a fiber optic adapter (125) on the tray (120). After dispensing the first connectorized end (40a) to the hub (20), an optical splitter (70, 130, 140) can be mounted to the tray (120). The splitter (26, 70, 130, 140, 306) has output adapters at which patch cords (50) can be inserted to connect subscribers to the system. The fiber distribution hub can use the same format of splitters (26, 70, 130, 140, 306). Other distributed splitter systems are provided with splicing and/or adding of splitters as needed.1-28. (canceled) 29. A fiber distribution hub comprising:
an enclosure including a door for accessing an interior of enclosure; a plurality of pivotally mounted splitter trays; a plurality of splitters mounted to the plurality of pivotally mounted splitter trays splice trays. 30. The fiber distribution hub of claim 29, further comprising a splice tray, wherein the splice tray is mounted in a stack with the plurality of pivotally mounted splitter trays. 31-34. (canceled) 35. A fiber distribution hub comprising:
an enclosure; a plurality of fiber optic splitters mounted within the enclosure; a plurality of fanouts mounted to the enclosure, wherein each of the plurality of fanouts includes a splice region for splicing riser cables to connectorized pigtails that lead to outputs of the plurality of fiber optic splitters, wherein inputs of the plurality of fiber optic receive fibers spliced from a feeder cable entering the enclosure. 36. The fiber distribution hub of claim 35, wherein the plurality of fiber optic splitters are provided in a stacked arrangement extending from a front of the enclosure toward a rear of the enclosure. 37. The fiber distribution hub of claim 35, wherein the plurality of fanouts are mounted above the plurality of fiber optic splitters and provided in a stacked arrangement extending along a direction from a front of the enclosure toward a rear of the enclosure. 38. The fiber distribution hub of claim 35, wherein the plurality of fiber optic splitters each include one input and sixteen outputs. | 2,800 |
12,388 | 12,388 | 16,859,444 | 2,863 | A universal, modular, temperature controlled MRI phantom for calibration and validation for anisotropic and isotropic imaging comprises an outer insulating shell configured to be received within an MRI chamber; an inner shell received within the outer insulating shell; a fluid conduits adjacent the inner shell for receiving temperature controlling fluid or gas cycling there-through; and a series of stacked layers of frames containing test points for the MRI phantom, each layer including at least one fiducial and including at least some anisotropic imaging test points in at least one frame and at least one isotropic imaging test point in at least one frame. The anisotropic imaging comprises hollow tubular textile fibers, wherein each hollow tubular fiber has an outer diameter of less than 50 microns and an inner diameter of less than 20 microns, wherein at least some hollow tubular fibers are filled with a fluid. | 1. An MRI phantom [10] for calibrated imaging comprising:
hollow tubular textile fibers [12], wherein each hollow tubular fiber [12] has an outer diameter of less than 30 microns and an inner diameter of less than 15 microns, and wherein at least 80 percent of the hollow tubular fibers [12] are filled with a fluid [14], fasciculi [16] formed by at least some of the hollow tubular fluid filled textile fibers [12]; tracks [18] formed by the combination of at least some fasciculi [16]; and fixed frames [20] supporting the tracks [18] within the phantom [10]. 2. The MRI phantom [10] for calibrated imaging according to claim 1 wherein at least one fixed frame [20] is formed as a fiber density frame which includes fiber [12] density variations across the fixed frame [20], whereby the fibers [12]/unit area in the fixed frame [20] are provided at distinct known distinct test points across the fixed frame [20]. 3. The MRI phantom [10] for calibrated imaging according to claim 2 wherein at least one fiber density frame [20] will vary the number of fibers [12] at least at three distinct test points to provide the fiber density variations. 4. The MRI phantom [10] for calibrated imaging according to claim 3 wherein at least one fiber density frame [20] which varies the number of fibers [12] at least at three distinct test points to provide the fiber density variations is configured to vary the number of fibers [12] by a fixed fiber amount in adjacent test points. 5. The MRI phantom [10] for calibrated imaging according to claim 3 wherein at least one fiber density frame [20] will vary the containment volume of fibers [12] at distinct test points to provide the fiber density variations and control of inter fiber fluid [14]. 6. The MRI phantom [10] for calibrated imaging according to claim 1 wherein at least one fixed frame [20] is formed as a fiber crossing frame which includes test points for at least three distinct angle fiber [12] crossings across the fiber crossing frame [20]. 7. The MRI phantom [10] for calibrated imaging according to claim 6 wherein at least one fiber crossing frame [20] includes a lower tract pathway [22] supporting a lower track [18] within the fixed frame, an upper tract pathway [22] supporting an upper track [18] within the fixed frame [20] which is substantially parallel with the lower track pathway [22] across the fixed frame [20] and an intermediate tract pathway [22] between the upper tract pathway [22] and the lower tract pathway [22] supporting an intermediate track [18] between the upper track [18] and the lower track [18], and wherein the intermediate track [18] crosses the upper and lower tracks [18] at least at three distinct angles, wherein the three distinct angles of the fiber [12] crossings of the fiber crossing frame [20] include 90 degrees, 45 degrees and 30 degrees. 8. The MRI phantom [10] for calibrated imaging according to claim 1 wherein at least one fixed frame [20] is formed as a physiologic simulation frame [20] and includes a shell simulating a human cranium, simulated eyes [32] and tracks [18] simulating known physiologic optical neural tracts from the simulated eyes [32]. 9. The MRI phantom [10] for calibrated imaging according to claim 8 wherein in the physiologic simulation frame [20] the tracks [18] simulating known physiologic optical neural tracts from the simulated eyes [32] includes at least one segment that spreads individual fasciculi [16]. 10. The MRI phantom [10] for calibrated imaging according to claim 1 wherein at least one fixed frame [20] is formed as a routing frame [20] which includes a plurality of distinct track starting locations at one end thereof and a plurality of aligned track ending locations at an opposed end thereof and tracks [18] extending from the starting locations to the ending locations, wherein some of the tracks [18] end in an ending location that is not aligned with the respective track's starting location. 11. The MRI phantom [10] for calibrated imaging according to claim 10 wherein at least one routing frame [20] includes tracks [18] of varying fiber densities, and wherein more than ½ of the tracks [18] end in an ending location that is not aligned with the respective track's starting location. 12. The MRI phantom [10] for calibrated imaging according to claim 11 wherein at least one routing frame [20] further includes areas of crossing fibers [12, 27] which are distinct from the tracks [18] extending to the opposed ends of the routing frame [20], and which are areas of distinct crossing fiber complexity. 13. The MRI phantom [10] for calibrated imaging according to claim 1 wherein the phantom [10] is configured to be worn by a patient in the MRI. 14. The MRI phantom [10] for calibrated imaging according to claim 1 wherein at least some fasciculi [16] include interstitial fluid, wherein hollow tubular fluid [14] and the interstitial fluid is formed of both water and deuterium oxide, and wherein in at least some fasciculi [16] the hollow tubular fluid [14] is one of water and deuterium oxide and the interstitial fluid is formed of the other of water and deuterium oxide. 15. An MRI phantom [10] for calibrated imaging comprising:
A plurality of fixed frames [20] within the phantom [10], each fixed frame [20] supporting tracks [18] which include a plurality of hollow tubular textile fibers [12], wherein each hollow tubular fiber [12] has an outer diameter of less than 25 microns and an inner diameter of less than 5 microns, and wherein at least 80 percent of the hollow tubular fibers [12] are filled with a fluid [14]. 16. The MRI phantom [10] for calibrated imaging according to claim 15 wherein at least one fixed frame [20] is formed as a fiber density frame which includes fiber [12] density variations across the fixed frame [20], whereby the fibers [12]/unit area in the fixed frame [20] are provided at distinct known distinct test points across the fixed frame [20]. 17. The MRI phantom [10] for calibrated imaging according to claim 6 wherein at least one fiber density frame [20] which varies the number of fibers [12] at least at three distinct test points to provide the fiber density variations is configured to vary the number of fibers [12] by a fixed fiber amount in adjacent test points. 18. The MRI phantom [10] for calibrated imaging according to claim 15 wherein at least one fixed frame [20] is formed as a fiber crossing frame which includes test points for at least three distinct angle fiber [12] crossings across the fiber crossing frame [20]. 19. The MRI phantom [10] for calibrated imaging according to claim 15 wherein at least one fiber crossing frame [20] includes a lower tract pathway [22] supporting a lower track [18] within the fixed frame, an upper tract pathway [22] supporting an upper track [18] within the fixed frame [20] which is substantially parallel with the lower track pathway [22] across the fixed frame [20] and an intermediate tract pathway [22] between the upper tract pathway [22] and the lower tract pathway [22] supporting an intermediate track [18] between the upper track [18] and the lower track [18], and wherein the intermediate track [18] crosses the upper and lower tracks [18] at least at three distinct angles, wherein the three distinct angles of the fiber [12] crossings of the fiber crossing frame [20] include 90 degrees, 45 degrees and 30 degrees. 20. The MRI phantom [10] for calibrated imaging according to claim 15 wherein at least one fixed frame [20] is formed as a physiologic simulation frame [20] and includes a shell simulating a human cranium, simulated eyes [32] and tracks [18] simulating known physiologic optical neural tracts from the simulated eyes [32]. | A universal, modular, temperature controlled MRI phantom for calibration and validation for anisotropic and isotropic imaging comprises an outer insulating shell configured to be received within an MRI chamber; an inner shell received within the outer insulating shell; a fluid conduits adjacent the inner shell for receiving temperature controlling fluid or gas cycling there-through; and a series of stacked layers of frames containing test points for the MRI phantom, each layer including at least one fiducial and including at least some anisotropic imaging test points in at least one frame and at least one isotropic imaging test point in at least one frame. The anisotropic imaging comprises hollow tubular textile fibers, wherein each hollow tubular fiber has an outer diameter of less than 50 microns and an inner diameter of less than 20 microns, wherein at least some hollow tubular fibers are filled with a fluid.1. An MRI phantom [10] for calibrated imaging comprising:
hollow tubular textile fibers [12], wherein each hollow tubular fiber [12] has an outer diameter of less than 30 microns and an inner diameter of less than 15 microns, and wherein at least 80 percent of the hollow tubular fibers [12] are filled with a fluid [14], fasciculi [16] formed by at least some of the hollow tubular fluid filled textile fibers [12]; tracks [18] formed by the combination of at least some fasciculi [16]; and fixed frames [20] supporting the tracks [18] within the phantom [10]. 2. The MRI phantom [10] for calibrated imaging according to claim 1 wherein at least one fixed frame [20] is formed as a fiber density frame which includes fiber [12] density variations across the fixed frame [20], whereby the fibers [12]/unit area in the fixed frame [20] are provided at distinct known distinct test points across the fixed frame [20]. 3. The MRI phantom [10] for calibrated imaging according to claim 2 wherein at least one fiber density frame [20] will vary the number of fibers [12] at least at three distinct test points to provide the fiber density variations. 4. The MRI phantom [10] for calibrated imaging according to claim 3 wherein at least one fiber density frame [20] which varies the number of fibers [12] at least at three distinct test points to provide the fiber density variations is configured to vary the number of fibers [12] by a fixed fiber amount in adjacent test points. 5. The MRI phantom [10] for calibrated imaging according to claim 3 wherein at least one fiber density frame [20] will vary the containment volume of fibers [12] at distinct test points to provide the fiber density variations and control of inter fiber fluid [14]. 6. The MRI phantom [10] for calibrated imaging according to claim 1 wherein at least one fixed frame [20] is formed as a fiber crossing frame which includes test points for at least three distinct angle fiber [12] crossings across the fiber crossing frame [20]. 7. The MRI phantom [10] for calibrated imaging according to claim 6 wherein at least one fiber crossing frame [20] includes a lower tract pathway [22] supporting a lower track [18] within the fixed frame, an upper tract pathway [22] supporting an upper track [18] within the fixed frame [20] which is substantially parallel with the lower track pathway [22] across the fixed frame [20] and an intermediate tract pathway [22] between the upper tract pathway [22] and the lower tract pathway [22] supporting an intermediate track [18] between the upper track [18] and the lower track [18], and wherein the intermediate track [18] crosses the upper and lower tracks [18] at least at three distinct angles, wherein the three distinct angles of the fiber [12] crossings of the fiber crossing frame [20] include 90 degrees, 45 degrees and 30 degrees. 8. The MRI phantom [10] for calibrated imaging according to claim 1 wherein at least one fixed frame [20] is formed as a physiologic simulation frame [20] and includes a shell simulating a human cranium, simulated eyes [32] and tracks [18] simulating known physiologic optical neural tracts from the simulated eyes [32]. 9. The MRI phantom [10] for calibrated imaging according to claim 8 wherein in the physiologic simulation frame [20] the tracks [18] simulating known physiologic optical neural tracts from the simulated eyes [32] includes at least one segment that spreads individual fasciculi [16]. 10. The MRI phantom [10] for calibrated imaging according to claim 1 wherein at least one fixed frame [20] is formed as a routing frame [20] which includes a plurality of distinct track starting locations at one end thereof and a plurality of aligned track ending locations at an opposed end thereof and tracks [18] extending from the starting locations to the ending locations, wherein some of the tracks [18] end in an ending location that is not aligned with the respective track's starting location. 11. The MRI phantom [10] for calibrated imaging according to claim 10 wherein at least one routing frame [20] includes tracks [18] of varying fiber densities, and wherein more than ½ of the tracks [18] end in an ending location that is not aligned with the respective track's starting location. 12. The MRI phantom [10] for calibrated imaging according to claim 11 wherein at least one routing frame [20] further includes areas of crossing fibers [12, 27] which are distinct from the tracks [18] extending to the opposed ends of the routing frame [20], and which are areas of distinct crossing fiber complexity. 13. The MRI phantom [10] for calibrated imaging according to claim 1 wherein the phantom [10] is configured to be worn by a patient in the MRI. 14. The MRI phantom [10] for calibrated imaging according to claim 1 wherein at least some fasciculi [16] include interstitial fluid, wherein hollow tubular fluid [14] and the interstitial fluid is formed of both water and deuterium oxide, and wherein in at least some fasciculi [16] the hollow tubular fluid [14] is one of water and deuterium oxide and the interstitial fluid is formed of the other of water and deuterium oxide. 15. An MRI phantom [10] for calibrated imaging comprising:
A plurality of fixed frames [20] within the phantom [10], each fixed frame [20] supporting tracks [18] which include a plurality of hollow tubular textile fibers [12], wherein each hollow tubular fiber [12] has an outer diameter of less than 25 microns and an inner diameter of less than 5 microns, and wherein at least 80 percent of the hollow tubular fibers [12] are filled with a fluid [14]. 16. The MRI phantom [10] for calibrated imaging according to claim 15 wherein at least one fixed frame [20] is formed as a fiber density frame which includes fiber [12] density variations across the fixed frame [20], whereby the fibers [12]/unit area in the fixed frame [20] are provided at distinct known distinct test points across the fixed frame [20]. 17. The MRI phantom [10] for calibrated imaging according to claim 6 wherein at least one fiber density frame [20] which varies the number of fibers [12] at least at three distinct test points to provide the fiber density variations is configured to vary the number of fibers [12] by a fixed fiber amount in adjacent test points. 18. The MRI phantom [10] for calibrated imaging according to claim 15 wherein at least one fixed frame [20] is formed as a fiber crossing frame which includes test points for at least three distinct angle fiber [12] crossings across the fiber crossing frame [20]. 19. The MRI phantom [10] for calibrated imaging according to claim 15 wherein at least one fiber crossing frame [20] includes a lower tract pathway [22] supporting a lower track [18] within the fixed frame, an upper tract pathway [22] supporting an upper track [18] within the fixed frame [20] which is substantially parallel with the lower track pathway [22] across the fixed frame [20] and an intermediate tract pathway [22] between the upper tract pathway [22] and the lower tract pathway [22] supporting an intermediate track [18] between the upper track [18] and the lower track [18], and wherein the intermediate track [18] crosses the upper and lower tracks [18] at least at three distinct angles, wherein the three distinct angles of the fiber [12] crossings of the fiber crossing frame [20] include 90 degrees, 45 degrees and 30 degrees. 20. The MRI phantom [10] for calibrated imaging according to claim 15 wherein at least one fixed frame [20] is formed as a physiologic simulation frame [20] and includes a shell simulating a human cranium, simulated eyes [32] and tracks [18] simulating known physiologic optical neural tracts from the simulated eyes [32]. | 2,800 |
12,389 | 12,389 | 15,296,558 | 2,832 | A generator includes an internal combustion engine operable on a gaseous fuel and an alternator driven by the engine to produce electrical power for distribution from the generator. The generator may also include a 24-volt starter motor to crank the engine, one or more batteries to provide electrical power to operate the starter motor, and a magneto driven by the engine to provide spark ignition of the gaseous fuel when starting the engine with the starter motor. | 1. A generator comprising:
an internal combustion engine operable on a gaseous fuel; an alternator driven by the engine to produce electrical power for distribution from the generator; a 24-volt starter motor to crank the engine; one or more batteries to provide electrical power to operate the starter motor; and a magneto driven by the engine to provide spark ignition of the gaseous fuel when starting the engine with the starter motor. 2. The generator of claim 1 wherein the starter motor is geared to crank the engine at least 500 rpm to start the engine with an ambient temperature of −30 degrees Celsius. 3. The generator of claim 1 wherein the one or more batteries are arranged to provide 24-volts to the starter motor. 4. The generator of claim 1 wherein the one or more batteries comprises two 12-volt batteries coupled in series to power the 24-volt starter motor. 5. The generator of claim 1 further comprising one or more battery chargers powered by the alternator to recharge the one or more batteries. 6. The generator of claim 1 further comprising an electronic control system operable on 24-volts to operate the generator. 7. The generator of claim 1 wherein the gaseous fuel is at least one of propane and natural gas. 8. The generator of claim 1 wherein the generator is configured to supply standby power to a home or building. 9. A standby generator comprising:
an alternator to provide electricity to an electrical system of a building; an internal combustion engine operable on propane or natural gas to drive the alternator; an automatic transfer switch to engage the providing of electricity to the electrical system upon interruption of utility power to the building; a 24-volt starter motor to crank the engine; a 24-volt battery system to run the starter motor upon the interruption of the utility power to the building; and a battery charger to recharge the 24-volt battery system. 10. The standby generator of claim 9 wherein the 24-volt starter motor is configured to crank the engine at least 500 rpm to start the engine in an ambient temperature of −30 degrees Celsius. 11. The standby generator of claim 9 wherein the 24-volt battery system comprises two 12-volt batteries coupled in series. 12. The standby generator of claim 9 further comprising a magneto driven by the engine to power one or more spark plugs in the engine. 13. The standby generator of claim 9 further comprising a battery and coil-operated ignition to run the engine. 14. The standby generator of claim 10, further comprising an electronic control system configured to operate on 24-volts to operate the generator. 15. A standby generator comprising:
an internal combustion engine; an alternator operatively coupled to the internal combustion engine to provide electricity for distribution from the generator; an ignition magneto driven by the engine; a starter motor to crank the engine driving the ignition magneto to start the engine; and at least two 12-volt batteries connected in series to power the starter motor. 16. The standby generator of claim 15 wherein the starter motor is a 24-volt starter motor. 17. The standby generator of claim 15 further comprising a 115V to 24V voltage converter powered by the alternator to recharge the at least two 12-volt batteries. 18. The standby generator of claim 15 wherein the at least two 12-volt batteries power the starter motor to crank the engine to at least 500 rpm at −30 degrees Celsius. 19. The standby generator of claim 15 wherein the engine is configured to operate on both propane and natural gas. 20. The generator of claim 1 further comprising an automatic engine controller to operate the engine. 21. The standby generator of claim 9 further comprising an automatic engine controller to operate the engine. 22. The standby generator of claim 9 further comprising an automatic transfer switch controller to control engagement of electricity provided to the electrical system of the building. 23. The standby generator of claim 15 further comprising an automatic controller operable on 24-volts to operate the engine. | A generator includes an internal combustion engine operable on a gaseous fuel and an alternator driven by the engine to produce electrical power for distribution from the generator. The generator may also include a 24-volt starter motor to crank the engine, one or more batteries to provide electrical power to operate the starter motor, and a magneto driven by the engine to provide spark ignition of the gaseous fuel when starting the engine with the starter motor.1. A generator comprising:
an internal combustion engine operable on a gaseous fuel; an alternator driven by the engine to produce electrical power for distribution from the generator; a 24-volt starter motor to crank the engine; one or more batteries to provide electrical power to operate the starter motor; and a magneto driven by the engine to provide spark ignition of the gaseous fuel when starting the engine with the starter motor. 2. The generator of claim 1 wherein the starter motor is geared to crank the engine at least 500 rpm to start the engine with an ambient temperature of −30 degrees Celsius. 3. The generator of claim 1 wherein the one or more batteries are arranged to provide 24-volts to the starter motor. 4. The generator of claim 1 wherein the one or more batteries comprises two 12-volt batteries coupled in series to power the 24-volt starter motor. 5. The generator of claim 1 further comprising one or more battery chargers powered by the alternator to recharge the one or more batteries. 6. The generator of claim 1 further comprising an electronic control system operable on 24-volts to operate the generator. 7. The generator of claim 1 wherein the gaseous fuel is at least one of propane and natural gas. 8. The generator of claim 1 wherein the generator is configured to supply standby power to a home or building. 9. A standby generator comprising:
an alternator to provide electricity to an electrical system of a building; an internal combustion engine operable on propane or natural gas to drive the alternator; an automatic transfer switch to engage the providing of electricity to the electrical system upon interruption of utility power to the building; a 24-volt starter motor to crank the engine; a 24-volt battery system to run the starter motor upon the interruption of the utility power to the building; and a battery charger to recharge the 24-volt battery system. 10. The standby generator of claim 9 wherein the 24-volt starter motor is configured to crank the engine at least 500 rpm to start the engine in an ambient temperature of −30 degrees Celsius. 11. The standby generator of claim 9 wherein the 24-volt battery system comprises two 12-volt batteries coupled in series. 12. The standby generator of claim 9 further comprising a magneto driven by the engine to power one or more spark plugs in the engine. 13. The standby generator of claim 9 further comprising a battery and coil-operated ignition to run the engine. 14. The standby generator of claim 10, further comprising an electronic control system configured to operate on 24-volts to operate the generator. 15. A standby generator comprising:
an internal combustion engine; an alternator operatively coupled to the internal combustion engine to provide electricity for distribution from the generator; an ignition magneto driven by the engine; a starter motor to crank the engine driving the ignition magneto to start the engine; and at least two 12-volt batteries connected in series to power the starter motor. 16. The standby generator of claim 15 wherein the starter motor is a 24-volt starter motor. 17. The standby generator of claim 15 further comprising a 115V to 24V voltage converter powered by the alternator to recharge the at least two 12-volt batteries. 18. The standby generator of claim 15 wherein the at least two 12-volt batteries power the starter motor to crank the engine to at least 500 rpm at −30 degrees Celsius. 19. The standby generator of claim 15 wherein the engine is configured to operate on both propane and natural gas. 20. The generator of claim 1 further comprising an automatic engine controller to operate the engine. 21. The standby generator of claim 9 further comprising an automatic engine controller to operate the engine. 22. The standby generator of claim 9 further comprising an automatic transfer switch controller to control engagement of electricity provided to the electrical system of the building. 23. The standby generator of claim 15 further comprising an automatic controller operable on 24-volts to operate the engine. | 2,800 |
12,390 | 12,390 | 16,353,514 | 2,846 | A mining haul truck driven by electrical wheel motors is operated with all electrical power sources; that is, without a diesel engine. While travelling on the loading site, the mining haul truck is powered by an on-board energy storage system, which may include a bank of ultracapacitors. The mining haul truck then moves to the bottom of a trolley ramp and is coupled to trolley lines. While travelling uphill, the mining haul truck is powered by the trolley lines, and the on-board energy storage system is charged by the trolley lines. When the mining haul truck reaches the top of the trolley ramp, the mining haul truck is uncoupled from the trolley lines. While travelling on the unloading site, the mining haul truck is powered by the on-board energy storage system. The on-board energy storage system may also be charged by retard energy generated by the wheel motors during braking. | 1. A method for supplying electrical power to an electrical motor on an all electrically powered mining haul truck, the method comprising the steps of:
charging an on-board energy storage system with electrical power from a trolley power system while the mining haul truck is coupled to trolley lines of the trolley power system; uncoupling the mining haul truck from the trolley lines; and supplying electrical power to the electrical motor from the on-board energy storage system while the mining haul truck is uncoupled from the trolley lines, wherein the mining haul truck is propelled by electrical power supplied by the trolley power system alone, or by the on-board energy storage system alone, or a combination of the trolley power system and the on-board energy storage system, without mechanical power supplied by a mechanical engine to propel the mining haul truck. 2. The method of claim 1, wherein:
the on-board energy storage system comprises at least one ultracapacitor. 3. The method of claim 1, wherein:
the on-board energy storage system comprises at least one battery. 4. The method of claim 1, further comprising:
supplying electrical power to the electrical motor from the trolley power system while the mining haul truck is travelling on an uphill grade; and charging the on-board energy storage system with electrical power from the trolley power system while the mining haul truck is travelling on the uphill grade. 5. The method of claim 1, further comprising:
supplying electrical power to the electrical motor from the trolley power system while the mining haul truck is travelling on a downhill grade; and charging the on-board energy storage system with electrical power from the trolley power system while the mining haul truck is travelling on the downhill grade. 6. The method of claim 1, further comprising:
charging the on-board energy storage system with electrical power generated by the electrical motor during braking of the mining haul truck. 7. The method of claim 4, further comprising:
charging the on-board energy storage system with electrical power generated by the electrical motor during braking of the mining haul truck. 8. The method of claim 5, further comprising:
charging the on-board energy storage system with electrical power generated by the electrical motor during braking of the mining haul truck. 9. An electrical power system for supplying electrical power to an electrical motor on an all electrically powered mining haul truck, the electrical power system comprising:
an on-board energy storage system; an inverter configured to:
receive electrical power from the on-board electrical energy storage system;
receive electrical power from a trolley power system; and
supply electrical power to the electrical motor; and
a controller configured to:
charge the on-board energy storage system with electrical power from the trolley power system while the mining haul truck is coupled to trolley lines of the trolley power system; and
supply electrical power to the electrical motor from the on-board energy storage system,
wherein the mining haul truck is configured to be propelled by electrical power supplied by at least one of the trolley power system alone, the on-board energy storage system alone, or a combination thereof without mechanical power supplied by a mechanical engine to propel the mining haul truck. 10. The electrical power system of claim 9, wherein:
the on-board energy storage system comprises at least one ultracapacitor. 11. The electrical power system of claim 9, wherein:
the on-board energy storage system comprises at least one battery. 12. The electrical power system of claim 9, wherein:
the on-board energy storage system is configured to be charged with electrical power generated by the electrical motor during braking of the mining haul truck. 13. The electrical power system of claim 9, wherein the controller is further configured to:
supply electrical power to the electrical motor from the trolley power system while the on-board energy storage system is being charged by the trolley power system. 14. A method for operating an all electrically powered mining haul truck comprising an electrical motor, the method comprising:
charging an on-board energy storage system with electrical power from a trolley power system while the mining haul truck is coupled to trolley lines of the trolley power system; uncoupling the mining haul truck from the trolley lines; supplying electrical power to the electrical motor from the on-board energy storage system; driving the mining haul truck to a loading site; and filling the mining haul truck with a payload, wherein the mining haul truck is propelled by electrical power supplied by the trolley power system alone, or by the on-board energy storage system alone, or a combination of the trolley power system and the on-board energy storage system, without mechanical power supplied by a mechanical engine to propel the mining haul truck. 15. The method of claim 14, further comprising:
charging the on-board energy storage system with electrical power generated by the electrical motor during braking of the mining haul truck. 16. The method of claim 14, further comprising:
driving the mining haul truck to a trolley ramp; coupling the mining haul truck to the trolley lines; supplying electrical power to the electrical motor from the trolley lines; driving the mining haul truck along the trolley ramp; and charging the on-board energy storage system with electrical power supplied from the trolley lines. 17. The method of claim 16, further comprising:
charging the on-board energy storage system with electrical power generated by the electrical motor during braking of the mining haul truck. 18. The method of claim 16, further comprising:
driving the mining haul truck to an unloading site; and unloading the payload from the mining haul truck. 19. The method of claim 18, further comprising:
charging the on-board energy storage system with electrical power generated by the electrical motor during braking of the mining haul truck. 20. The method of claim 14, wherein:
the on-board energy storage system comprises at least one ultracapacitor or at least one battery. | A mining haul truck driven by electrical wheel motors is operated with all electrical power sources; that is, without a diesel engine. While travelling on the loading site, the mining haul truck is powered by an on-board energy storage system, which may include a bank of ultracapacitors. The mining haul truck then moves to the bottom of a trolley ramp and is coupled to trolley lines. While travelling uphill, the mining haul truck is powered by the trolley lines, and the on-board energy storage system is charged by the trolley lines. When the mining haul truck reaches the top of the trolley ramp, the mining haul truck is uncoupled from the trolley lines. While travelling on the unloading site, the mining haul truck is powered by the on-board energy storage system. The on-board energy storage system may also be charged by retard energy generated by the wheel motors during braking.1. A method for supplying electrical power to an electrical motor on an all electrically powered mining haul truck, the method comprising the steps of:
charging an on-board energy storage system with electrical power from a trolley power system while the mining haul truck is coupled to trolley lines of the trolley power system; uncoupling the mining haul truck from the trolley lines; and supplying electrical power to the electrical motor from the on-board energy storage system while the mining haul truck is uncoupled from the trolley lines, wherein the mining haul truck is propelled by electrical power supplied by the trolley power system alone, or by the on-board energy storage system alone, or a combination of the trolley power system and the on-board energy storage system, without mechanical power supplied by a mechanical engine to propel the mining haul truck. 2. The method of claim 1, wherein:
the on-board energy storage system comprises at least one ultracapacitor. 3. The method of claim 1, wherein:
the on-board energy storage system comprises at least one battery. 4. The method of claim 1, further comprising:
supplying electrical power to the electrical motor from the trolley power system while the mining haul truck is travelling on an uphill grade; and charging the on-board energy storage system with electrical power from the trolley power system while the mining haul truck is travelling on the uphill grade. 5. The method of claim 1, further comprising:
supplying electrical power to the electrical motor from the trolley power system while the mining haul truck is travelling on a downhill grade; and charging the on-board energy storage system with electrical power from the trolley power system while the mining haul truck is travelling on the downhill grade. 6. The method of claim 1, further comprising:
charging the on-board energy storage system with electrical power generated by the electrical motor during braking of the mining haul truck. 7. The method of claim 4, further comprising:
charging the on-board energy storage system with electrical power generated by the electrical motor during braking of the mining haul truck. 8. The method of claim 5, further comprising:
charging the on-board energy storage system with electrical power generated by the electrical motor during braking of the mining haul truck. 9. An electrical power system for supplying electrical power to an electrical motor on an all electrically powered mining haul truck, the electrical power system comprising:
an on-board energy storage system; an inverter configured to:
receive electrical power from the on-board electrical energy storage system;
receive electrical power from a trolley power system; and
supply electrical power to the electrical motor; and
a controller configured to:
charge the on-board energy storage system with electrical power from the trolley power system while the mining haul truck is coupled to trolley lines of the trolley power system; and
supply electrical power to the electrical motor from the on-board energy storage system,
wherein the mining haul truck is configured to be propelled by electrical power supplied by at least one of the trolley power system alone, the on-board energy storage system alone, or a combination thereof without mechanical power supplied by a mechanical engine to propel the mining haul truck. 10. The electrical power system of claim 9, wherein:
the on-board energy storage system comprises at least one ultracapacitor. 11. The electrical power system of claim 9, wherein:
the on-board energy storage system comprises at least one battery. 12. The electrical power system of claim 9, wherein:
the on-board energy storage system is configured to be charged with electrical power generated by the electrical motor during braking of the mining haul truck. 13. The electrical power system of claim 9, wherein the controller is further configured to:
supply electrical power to the electrical motor from the trolley power system while the on-board energy storage system is being charged by the trolley power system. 14. A method for operating an all electrically powered mining haul truck comprising an electrical motor, the method comprising:
charging an on-board energy storage system with electrical power from a trolley power system while the mining haul truck is coupled to trolley lines of the trolley power system; uncoupling the mining haul truck from the trolley lines; supplying electrical power to the electrical motor from the on-board energy storage system; driving the mining haul truck to a loading site; and filling the mining haul truck with a payload, wherein the mining haul truck is propelled by electrical power supplied by the trolley power system alone, or by the on-board energy storage system alone, or a combination of the trolley power system and the on-board energy storage system, without mechanical power supplied by a mechanical engine to propel the mining haul truck. 15. The method of claim 14, further comprising:
charging the on-board energy storage system with electrical power generated by the electrical motor during braking of the mining haul truck. 16. The method of claim 14, further comprising:
driving the mining haul truck to a trolley ramp; coupling the mining haul truck to the trolley lines; supplying electrical power to the electrical motor from the trolley lines; driving the mining haul truck along the trolley ramp; and charging the on-board energy storage system with electrical power supplied from the trolley lines. 17. The method of claim 16, further comprising:
charging the on-board energy storage system with electrical power generated by the electrical motor during braking of the mining haul truck. 18. The method of claim 16, further comprising:
driving the mining haul truck to an unloading site; and unloading the payload from the mining haul truck. 19. The method of claim 18, further comprising:
charging the on-board energy storage system with electrical power generated by the electrical motor during braking of the mining haul truck. 20. The method of claim 14, wherein:
the on-board energy storage system comprises at least one ultracapacitor or at least one battery. | 2,800 |
12,391 | 12,391 | 15,290,406 | 2,852 | A magnetic field measuring device having a semiconductor body with a first surface running in an x-y plane, with a first and second magnetic field sensor disposed on the surface, and an axis of symmetry, which runs perpendicular to the first surface in the z-direction and to which the magnetic field sensors are positioned in a mirrored fashion, first and second magnets, which are spaced apart from one another and in each case have an axis and a polar surface running perpendicular to the axis and facing the semiconductor body. The magnetic polarity changes along the axes on a surface, whereby the axes run in the direction of the axis of symmetry, whereby the axis of symmetry runs between the axes of the magnets, whereby the surfaces of the magnets in each case are spaced apart in the z-direction to the first surface of the semiconductor body. | 1. A magnetic field measuring device comprising:
a semiconductor body with a first surface running in a first x-y plane and an axis of symmetry running perpendicular to the first surface in a z-direction, the semiconductor body having a first magnetic field sensor and a second magnetic field sensor on the first surface, the first magnetic field sensor being positioned mirrored to the second magnetic field sensor with respect to the axis of symmetry, the first and second magnetic field sensors each measuring a z-component of a magnetic field, and the x-direction and the y-direction and the z-direction each being formed orthogonal to one another; a first magnet with an axis and a first polar surface running perpendicular to the axis and facing the semiconductor body, a magnetic polarity changing along the axis on a surface, and the axis running in a direction of the axis of symmetry; and a second magnet spaced apart from the first magnet, the second magnet having an axis and a first polar surface running perpendicular to the axis and facing the semiconductor body, a magnetic polarity changing along the axis on a surface, and the axis running in the direction of the axis of symmetry, wherein the axis of symmetry runs between the axis of the first magnet and the axis of the second magnet, wherein the surface of the first magnet and the surface of the second magnet are each spaced apart in the z-direction to the first surface of the semiconductor body, wherein the magnetic field sensors are formed as Hall sensors, and wherein the first magnet and the second magnet are spaced apart from the first magnetic field sensor and from the second magnetic field sensor such that no or substantially no z-component of the magnetic field of the two magnets is formed in an area of the two magnetic field sensors for detecting a ferromagnetic encoder spaced apart in the z-direction. 2. The magnetic field measuring device according to claim 1, wherein the magnetic polarity of the first magnet and of the second magnet changes in a parallel fashion in the z-direction in each case on the surfaces. 3. The magnetic field measuring device according to claim 1, wherein the magnetic polarity of the first magnet and of the second magnet changes in an antiparallel fashion on the surfaces in the z-direction. 4. The magnetic field measuring device according to claim 1, wherein the axis of the first magnet and the axis of the second magnet in each case run substantially or exactly parallel to the axis of symmetry of the semiconductor body. 5. The magnetic field measuring device according to claim 1, wherein the axis of the first magnet and the axis of the second magnet each run at an angle between +45° and −45° to the axis of symmetry of the semiconductor body. 6. The magnetic field measuring device according to claim 1, wherein the axis of the first magnet and the axis of the second magnet run substantially or exactly mirrored to one another with respect to the axis of symmetry of the semiconductor body. 7. The magnetic field measuring device according to claim 1, wherein the first polar surface of the first magnet and the first polar surface of the second magnet in each case in the z-direction are substantially or exactly flush with the first surface of the semiconductor body. 8. The magnetic field measuring device according to claim 1, wherein the first polar surface of the first magnet and the first polar surface of the second magnet have a substantially or exactly the same distance to the first surface of the semiconductor body in the z-direction. 9. The magnetic field measuring device according to claim 8, wherein the distance of the first polar surface of the first magnet and the first polar surface of the second magnet in each case to the first surface is smaller than or equal to twice a thickness of the semiconductor body in the z-direction. 10. The magnetic field measuring device according to claim 1, wherein in a projection in the z-direction a projection surface of the first magnetic field sensor overlaps partially or totally with the projection surface of the first polar surface of the first magnet and the projection surface of the second magnetic field sensor with the projection surface of the first polar surface of the second magnet in the projection plane running in an x-y plane. 11. The magnetic field measuring device according to claim 1, wherein, in a projection in the z-direction the projection surface of the first magnetic field sensor is adjacent to the projection surface of the first polar surface of the first magnet and the projection surface of the second magnetic field sensor to the projection surface of the first polar surface of the second magnet in the projection plane running in a x-y plane. 12. The magnetic field measuring device according to claim 1, wherein the semiconductor body has an integrated circuit and the integrated circuit is operatively connected to the two magnetic field sensors. 13. The magnetic field measuring device according to claim 1, wherein the magnetic field sensors are made as Hall plates. 14. The magnetic field measuring device according to claim 1, wherein the distance of the axes of the first magnet and the second magnet to the axis of symmetry is selected such that in a projection along the axis of symmetry, the two polar surfaces have a greater distance to the axis of symmetry than the projection surface of the two magnetic field sensors. | A magnetic field measuring device having a semiconductor body with a first surface running in an x-y plane, with a first and second magnetic field sensor disposed on the surface, and an axis of symmetry, which runs perpendicular to the first surface in the z-direction and to which the magnetic field sensors are positioned in a mirrored fashion, first and second magnets, which are spaced apart from one another and in each case have an axis and a polar surface running perpendicular to the axis and facing the semiconductor body. The magnetic polarity changes along the axes on a surface, whereby the axes run in the direction of the axis of symmetry, whereby the axis of symmetry runs between the axes of the magnets, whereby the surfaces of the magnets in each case are spaced apart in the z-direction to the first surface of the semiconductor body.1. A magnetic field measuring device comprising:
a semiconductor body with a first surface running in a first x-y plane and an axis of symmetry running perpendicular to the first surface in a z-direction, the semiconductor body having a first magnetic field sensor and a second magnetic field sensor on the first surface, the first magnetic field sensor being positioned mirrored to the second magnetic field sensor with respect to the axis of symmetry, the first and second magnetic field sensors each measuring a z-component of a magnetic field, and the x-direction and the y-direction and the z-direction each being formed orthogonal to one another; a first magnet with an axis and a first polar surface running perpendicular to the axis and facing the semiconductor body, a magnetic polarity changing along the axis on a surface, and the axis running in a direction of the axis of symmetry; and a second magnet spaced apart from the first magnet, the second magnet having an axis and a first polar surface running perpendicular to the axis and facing the semiconductor body, a magnetic polarity changing along the axis on a surface, and the axis running in the direction of the axis of symmetry, wherein the axis of symmetry runs between the axis of the first magnet and the axis of the second magnet, wherein the surface of the first magnet and the surface of the second magnet are each spaced apart in the z-direction to the first surface of the semiconductor body, wherein the magnetic field sensors are formed as Hall sensors, and wherein the first magnet and the second magnet are spaced apart from the first magnetic field sensor and from the second magnetic field sensor such that no or substantially no z-component of the magnetic field of the two magnets is formed in an area of the two magnetic field sensors for detecting a ferromagnetic encoder spaced apart in the z-direction. 2. The magnetic field measuring device according to claim 1, wherein the magnetic polarity of the first magnet and of the second magnet changes in a parallel fashion in the z-direction in each case on the surfaces. 3. The magnetic field measuring device according to claim 1, wherein the magnetic polarity of the first magnet and of the second magnet changes in an antiparallel fashion on the surfaces in the z-direction. 4. The magnetic field measuring device according to claim 1, wherein the axis of the first magnet and the axis of the second magnet in each case run substantially or exactly parallel to the axis of symmetry of the semiconductor body. 5. The magnetic field measuring device according to claim 1, wherein the axis of the first magnet and the axis of the second magnet each run at an angle between +45° and −45° to the axis of symmetry of the semiconductor body. 6. The magnetic field measuring device according to claim 1, wherein the axis of the first magnet and the axis of the second magnet run substantially or exactly mirrored to one another with respect to the axis of symmetry of the semiconductor body. 7. The magnetic field measuring device according to claim 1, wherein the first polar surface of the first magnet and the first polar surface of the second magnet in each case in the z-direction are substantially or exactly flush with the first surface of the semiconductor body. 8. The magnetic field measuring device according to claim 1, wherein the first polar surface of the first magnet and the first polar surface of the second magnet have a substantially or exactly the same distance to the first surface of the semiconductor body in the z-direction. 9. The magnetic field measuring device according to claim 8, wherein the distance of the first polar surface of the first magnet and the first polar surface of the second magnet in each case to the first surface is smaller than or equal to twice a thickness of the semiconductor body in the z-direction. 10. The magnetic field measuring device according to claim 1, wherein in a projection in the z-direction a projection surface of the first magnetic field sensor overlaps partially or totally with the projection surface of the first polar surface of the first magnet and the projection surface of the second magnetic field sensor with the projection surface of the first polar surface of the second magnet in the projection plane running in an x-y plane. 11. The magnetic field measuring device according to claim 1, wherein, in a projection in the z-direction the projection surface of the first magnetic field sensor is adjacent to the projection surface of the first polar surface of the first magnet and the projection surface of the second magnetic field sensor to the projection surface of the first polar surface of the second magnet in the projection plane running in a x-y plane. 12. The magnetic field measuring device according to claim 1, wherein the semiconductor body has an integrated circuit and the integrated circuit is operatively connected to the two magnetic field sensors. 13. The magnetic field measuring device according to claim 1, wherein the magnetic field sensors are made as Hall plates. 14. The magnetic field measuring device according to claim 1, wherein the distance of the axes of the first magnet and the second magnet to the axis of symmetry is selected such that in a projection along the axis of symmetry, the two polar surfaces have a greater distance to the axis of symmetry than the projection surface of the two magnetic field sensors. | 2,800 |
12,392 | 12,392 | 16,129,288 | 2,847 | Halogen-free flexible cords are disclosed. The cables include one or more conductors, each surrounded by an insulation layer and a nylon layer. The flexible cords exhibit low smoke when burned. Methods of making and using the cables are also disclosed. | 1. A cable comprising:
one or more conductors, each of the one or more conductors comprising:
an insulation layer surrounding the conductor; and
a nylon layer surrounding the insulation layer; and
a jacket layer surrounding the one or more conductors; and wherein the cable is halogen-free and passes one or more of International Electrotechnical Commission (“IEC”) 612034-2 and IEC 60754-1-2. 2. The cable of claim 1 passes the Underwriter's Laboratory (“UL”) 1581 VW-1 flame test. 3. The cable of cable 1 passes Section 518 of NTC 2050 (Columbia). 4. The cable of claim 1 comprises between two to five conductors. 5. The cable of claim 1, wherein the insulation layers comprise one or more of a polyolefin polymer, a polyolefin copolymer, and a thermoplastic rubber. 6. The cable of claim 5, wherein the polyolefin polymer or polyolefin copolymer comprises an ethylene-based or propylene-based polyolefin polymer or polyolefin copolymer. 7. The cable of claim 1, wherein each of the insulation layers comprise a thickness of about 10 mm or less. 8. The cable of claim 1, wherein each of the nylon layers comprise one or more of nylon 6-6 and nylon 6. 9. The cable of claim 1, wherein each of the nylon layers comprise a thickness of about 1 mm or less. 10. The cable of claim 1, wherein the jacket layer comprise one or more of a polyolefin polymer, a polyolefin copolymer, and a thermoplastic rubber. 11. The cable of claim 10, wherein the polyolefin polymer or polyolefin copolymer comprises an ethylene-based or propylene-based polyolefin polymer or polyolefin copolymer. 12. The cable of claim 1 has a diameter is about 9 mm or less. 13. The cable of claim 1 has a minimum bending radius of about 4 times the overall diameter. 14. The cable of claim 1 has a maximum operating voltage of about 1000 volts or less. 15. The cable of claim 1 exhibits:
an ampacity of 20 amps at a temperature of about 60° C. and a maximum operating voltage of 600 volts when measured in accordance to UL 62 and 2556; and
a maximum pulling tension of 460 kg when measured in accordance to American Society for Testing and Materials (“ASTM”) B3 and UL 2556. 16. The cable of claim 1 has a weight of about 160 kg per kilometer. 17. A method of forming a cable comprising:
providing one or more conductors; extruding an insulation layer around each of the one or more conductors; extruding a nylon layer around each of the insulation layers; applying a jacket layer substantially around the one or more conductors; and wherein the cable is halogen-free and passes one or more of International Electrotechnical Commission (“IEC”) 612034-2 and IEC 60754-1-2. | Halogen-free flexible cords are disclosed. The cables include one or more conductors, each surrounded by an insulation layer and a nylon layer. The flexible cords exhibit low smoke when burned. Methods of making and using the cables are also disclosed.1. A cable comprising:
one or more conductors, each of the one or more conductors comprising:
an insulation layer surrounding the conductor; and
a nylon layer surrounding the insulation layer; and
a jacket layer surrounding the one or more conductors; and wherein the cable is halogen-free and passes one or more of International Electrotechnical Commission (“IEC”) 612034-2 and IEC 60754-1-2. 2. The cable of claim 1 passes the Underwriter's Laboratory (“UL”) 1581 VW-1 flame test. 3. The cable of cable 1 passes Section 518 of NTC 2050 (Columbia). 4. The cable of claim 1 comprises between two to five conductors. 5. The cable of claim 1, wherein the insulation layers comprise one or more of a polyolefin polymer, a polyolefin copolymer, and a thermoplastic rubber. 6. The cable of claim 5, wherein the polyolefin polymer or polyolefin copolymer comprises an ethylene-based or propylene-based polyolefin polymer or polyolefin copolymer. 7. The cable of claim 1, wherein each of the insulation layers comprise a thickness of about 10 mm or less. 8. The cable of claim 1, wherein each of the nylon layers comprise one or more of nylon 6-6 and nylon 6. 9. The cable of claim 1, wherein each of the nylon layers comprise a thickness of about 1 mm or less. 10. The cable of claim 1, wherein the jacket layer comprise one or more of a polyolefin polymer, a polyolefin copolymer, and a thermoplastic rubber. 11. The cable of claim 10, wherein the polyolefin polymer or polyolefin copolymer comprises an ethylene-based or propylene-based polyolefin polymer or polyolefin copolymer. 12. The cable of claim 1 has a diameter is about 9 mm or less. 13. The cable of claim 1 has a minimum bending radius of about 4 times the overall diameter. 14. The cable of claim 1 has a maximum operating voltage of about 1000 volts or less. 15. The cable of claim 1 exhibits:
an ampacity of 20 amps at a temperature of about 60° C. and a maximum operating voltage of 600 volts when measured in accordance to UL 62 and 2556; and
a maximum pulling tension of 460 kg when measured in accordance to American Society for Testing and Materials (“ASTM”) B3 and UL 2556. 16. The cable of claim 1 has a weight of about 160 kg per kilometer. 17. A method of forming a cable comprising:
providing one or more conductors; extruding an insulation layer around each of the one or more conductors; extruding a nylon layer around each of the insulation layers; applying a jacket layer substantially around the one or more conductors; and wherein the cable is halogen-free and passes one or more of International Electrotechnical Commission (“IEC”) 612034-2 and IEC 60754-1-2. | 2,800 |
12,393 | 12,393 | 15,553,370 | 2,828 | A method for the production of a diode laser having a laser bar, wherein a metal layer having raised areas is used which is located between the n-side of the laser bar and the cover. The metal layer can be plastically deformed during installation without volume compression in the solid physical state. As a result the laser module can be reliably installed and a slight deviation (smile value) of the emitters from a centre line is achieved. | 1. A method for producing a diode laser, comprising:
providing at least one laser bar having multiple emitters, which has on a first side a first contact area, which is formed as at least one p contact, and on a second side opposite from the first side a second contact area, which is formed as at least one n contact; providing a heat conducting body having a first terminal area; providing a cover having a second terminal area; providing a second metal layer, which has multiple raised locations (19) and multiple depressed locations in a sectional plane; arranging the laser bar between the heat conducting body and the cover, the first contact area facing the first terminal area of the heat conducting body and the second contact area facing the second terminal area of the cover, and the second metal layer being arranged at least in certain portions between the second terminal area and the second contact area; producing at least one force, which has a component that presses the cover in the direction of the heat conducting body, the first contact area being pressed flat against the first terminal area (12) under the effect of the force, the second metal layer undergoing a plastic deformation at least in certain portions in the region of the raised locations; establishing a mechanical connection of the cover with respect to the heat conducting body. 2. The method as claimed in claim 1, wherein the plastic deformation of the second metal layer takes place at room temperature and/or below the liquidus temperature and/or below the solidus temperature of the second metal layer. 3. The method as claimed in claim 1, wherein the plastic deformation takes place without volume compression and/or in that, during the deformation, the thickness of the second metal layer is reduced at least in certain portions at the raised locations. 4. The method as claimed in claim 1, wherein
providing a first metal layer, when arranging the laser bar, the first metal layer being arranged at least in certain portions between the first terminal area and the first contact area. 5. The method as claimed in claim 4, wherein with respect to the raised locations, the second metal layer is made thicker than the first metal layer. 6. The method as claimed in claim 1, wherein the second metal layer is applied to the second terminal area and/or in that the first metal layer is applied to the first terminal area and/or in that the second metal layer is applied at least in certain portions to the second contact area and/or in that the first metal layer is applied at least in certain portions to the first contact area. 7. The method as claimed in claim 1, wherein the second metal layer has a degree of volume filling that is between 2% and 95% and/or between 5% and 50%. 8. The method as claimed in claim 1, wherein the raised locations have a minimum structure size of between 10 nm and 1000 μm and/or in that the second metal layer has on a base area A a relief with an average contour line and the ratio L/A of the overall length L of the average contour line to the base area A is between 1000 m/m2 and 100 000 m/m2. 9. A diode laser, comprising at least one edge emitting laser bar, which comprises multiple emitters, with a first contact area, which is formed as a p contact, and a second contact area, which is formed as an n contact and has a normal n and an area content A, a heat conducting body having a first terminal area, a cover having a second terminal area and a second metal layer, the laser bar being arranged between the heat conducting body and the cover and the second metal layer being arranged at least in certain portions between the second terminal area and the second contact area, the cover being mechanically connected to the heat conducting body and the first contact area being thermally and electrically connected over the surface area to the first terminal area and the second contact area being electrically connected to the second terminal area by means of the second metal layer, the second metal layer having connected locations, at which the second contact area is continuously connected to the second terminal area in the direction of the normal n, and also having interrupted locations, at which, because of the voids, the second contact area is not continuously connected to the second terminal area in the direction of the normal n, the interrupted locations having an overall area that is at least 20% of the area content A. 10. The diode laser as claimed in claim 9, wherein the cover is provided as making a contribution to the heat dissipation from the second contact area and/or in that the cover is thermally and mechanically connected to the heat conducting body by means of an electrically insulating joining agent. 11. The use of a second metal layer that is produced with the involvement of a coating process and has a nubbed structure, the nubbed structure having a coverage density with at least one nub per square millimeter of area of the layer, for producing a clamped connection for a diode laser, the second metal layer being arranged between a second n-side contact area of a laser bar and a second terminal area of a cover and the second metal layer being provided on the second contact area or on the second terminal area. | A method for the production of a diode laser having a laser bar, wherein a metal layer having raised areas is used which is located between the n-side of the laser bar and the cover. The metal layer can be plastically deformed during installation without volume compression in the solid physical state. As a result the laser module can be reliably installed and a slight deviation (smile value) of the emitters from a centre line is achieved.1. A method for producing a diode laser, comprising:
providing at least one laser bar having multiple emitters, which has on a first side a first contact area, which is formed as at least one p contact, and on a second side opposite from the first side a second contact area, which is formed as at least one n contact; providing a heat conducting body having a first terminal area; providing a cover having a second terminal area; providing a second metal layer, which has multiple raised locations (19) and multiple depressed locations in a sectional plane; arranging the laser bar between the heat conducting body and the cover, the first contact area facing the first terminal area of the heat conducting body and the second contact area facing the second terminal area of the cover, and the second metal layer being arranged at least in certain portions between the second terminal area and the second contact area; producing at least one force, which has a component that presses the cover in the direction of the heat conducting body, the first contact area being pressed flat against the first terminal area (12) under the effect of the force, the second metal layer undergoing a plastic deformation at least in certain portions in the region of the raised locations; establishing a mechanical connection of the cover with respect to the heat conducting body. 2. The method as claimed in claim 1, wherein the plastic deformation of the second metal layer takes place at room temperature and/or below the liquidus temperature and/or below the solidus temperature of the second metal layer. 3. The method as claimed in claim 1, wherein the plastic deformation takes place without volume compression and/or in that, during the deformation, the thickness of the second metal layer is reduced at least in certain portions at the raised locations. 4. The method as claimed in claim 1, wherein
providing a first metal layer, when arranging the laser bar, the first metal layer being arranged at least in certain portions between the first terminal area and the first contact area. 5. The method as claimed in claim 4, wherein with respect to the raised locations, the second metal layer is made thicker than the first metal layer. 6. The method as claimed in claim 1, wherein the second metal layer is applied to the second terminal area and/or in that the first metal layer is applied to the first terminal area and/or in that the second metal layer is applied at least in certain portions to the second contact area and/or in that the first metal layer is applied at least in certain portions to the first contact area. 7. The method as claimed in claim 1, wherein the second metal layer has a degree of volume filling that is between 2% and 95% and/or between 5% and 50%. 8. The method as claimed in claim 1, wherein the raised locations have a minimum structure size of between 10 nm and 1000 μm and/or in that the second metal layer has on a base area A a relief with an average contour line and the ratio L/A of the overall length L of the average contour line to the base area A is between 1000 m/m2 and 100 000 m/m2. 9. A diode laser, comprising at least one edge emitting laser bar, which comprises multiple emitters, with a first contact area, which is formed as a p contact, and a second contact area, which is formed as an n contact and has a normal n and an area content A, a heat conducting body having a first terminal area, a cover having a second terminal area and a second metal layer, the laser bar being arranged between the heat conducting body and the cover and the second metal layer being arranged at least in certain portions between the second terminal area and the second contact area, the cover being mechanically connected to the heat conducting body and the first contact area being thermally and electrically connected over the surface area to the first terminal area and the second contact area being electrically connected to the second terminal area by means of the second metal layer, the second metal layer having connected locations, at which the second contact area is continuously connected to the second terminal area in the direction of the normal n, and also having interrupted locations, at which, because of the voids, the second contact area is not continuously connected to the second terminal area in the direction of the normal n, the interrupted locations having an overall area that is at least 20% of the area content A. 10. The diode laser as claimed in claim 9, wherein the cover is provided as making a contribution to the heat dissipation from the second contact area and/or in that the cover is thermally and mechanically connected to the heat conducting body by means of an electrically insulating joining agent. 11. The use of a second metal layer that is produced with the involvement of a coating process and has a nubbed structure, the nubbed structure having a coverage density with at least one nub per square millimeter of area of the layer, for producing a clamped connection for a diode laser, the second metal layer being arranged between a second n-side contact area of a laser bar and a second terminal area of a cover and the second metal layer being provided on the second contact area or on the second terminal area. | 2,800 |
12,394 | 12,394 | 15,446,493 | 2,883 | A ferrule-based fiber optic connectors having a ferrule retraction balancing characteristic for preserving optical performance are disclosed. The fiber optic connector comprises a connector assembly, a connector sleeve assembly and a balancing resilient member. The connector assembly comprises a ferrule and a resilient member for biasing the ferrule forward and the connector sleeve assembly comprises a housing and a ferrule sleeve, where the connector assembly is at least partially disposed in the passageway of the housing and the ferrule of the connector assembly is at least partially disposed in the ferrule sleeve. The balancing resilient member biases the housing to a forward position with a the biasing resilient member having a predetermined resilient force that is greater than the friction force required for displacement of the ferrule within the ferrule sleeve. | 1. A fiber optic connector, comprising:
a connector assembly comprising a ferrule and a resilient member for biasing the ferrule forward; a connector sleeve assembly comprising a housing with a passageway between a first end and a second end and a ferrule sleeve, wherein the connector assembly is at least partially disposed in the passageway of the housing and the ferrule of the connector assembly is at least partially disposed in the ferrule sleeve when assembled; and a balancing resilient member for biasing the housing to a forward position, the biasing resilient member comprising a predetermined resilient force that is greater than the friction force required for displacement of the ferrule within the ferrule sleeve. 2. The fiber optic connector of claim 1, wherein the predetermined resilient force is 2.5 Newton or greater. 3. The fiber optic connector of claim 1, wherein the ferrule has a diameter of about 2.5 millimeters and the predetermined resilient force is 5 Newton or greater. 4. The fiber optic connector of claim 1, wherein the ferrule has a diameter of about 1.25 millimeters and the predetermined resilient force is 2.5 Newton or greater. 5. The fiber optic connector of claim 1, wherein the connector sleeve assembly comprises a latch, and the balancing resilient member biases the connector sleeve assembly forward with the latch engaging the connector assembly when assembled. 6. The fiber optic connector of claim 1, wherein a portion of the balancing resilient member is disposed radially outward of the connector assembly. 7. The fiber optic connector of claim 1, further comprising a stop for the connector sleeve assembly. 8. The fiber optic connector of claim 1, the fiber optic connector comprising a portion of the balancing resilient member contacts the connector sleeve assembly. 9. The fiber optic connector of claim 1, further including a ferrule holder and the resilient member of the connector assembly biases the ferrule holder and the ferrule forward when assembled. 10. The fiber optic connector of claim 1, further comprising a female coupling housing comprising an opening for receiving a complimentary connector. 11. The fiber optic connector of claim 1, the connector assembly further comprising a housing and the connector assembly being an SC connector assembly. 12. The fiber optic connector of claim 1, further comprising a crimp band. 13. The fiber optic connector of claim 1 being a portion of a cable assembly further comprising a fiber optic cable attached to the fiber optic connector. 14. The fiber optic connector of claim 13, wherein the fiber optic cable further comprises strength members secured to a cable attachment region. 15. The fiber optic connector of claim 13, further comprising a tensile element of the fiber optic cable being a plurality of tensile yarns attached between an outer barrel of the body and a crimp band or one or more strength components disposed between a first shell and a second shell of the body. 16. The fiber optic connector of claim 13, further comprising a first shell and a second shell that are secured using a crimp band and/or an adhesive. 17. The fiber optic connector of claim 13, wherein the fiber optic cable has an optical fiber having a buffer layer that enters the body and enters the connector assembly. 18. The fiber optic connector of claim 13, the cable assembly further includes a boot. 19. A fiber optic connector, comprising:
a connector assembly comprising a ferrule and a resilient member for biasing the ferrule forward; a connector sleeve assembly comprising a housing with a passageway between a first end and a second end and a ferrule sleeve, wherein the connector assembly is at least partially disposed in the passageway of the connector sleeve assembly and the ferrule is at least partially disposed in the ferrule sleeve when assembled; and a balancing resilient member for biasing the connector sleeve assembly to a forward position, the biasing resilient member comprising a predetermined resilient force that is 5 Newton or greater. 20. The fiber optic connector of claim 19, wherein the ferrule has a diameter of about 2.5 millimeters. 21. The fiber optic connector of claim 19, wherein the ferrule has a diameter of about 1.25 millimeters. 22. The fiber optic connector of claim 19, wherein the connector sleeve assembly comprises a latch, and the balancing resilient member biases the connector sleeve assembly forward with the latch engaging the connector assembly when assembled. 23. The fiber optic connector of claim 19, wherein a portion of the balancing resilient member is disposed radially outward of the connector assembly. 24. The fiber optic connector of claim 19, further comprising a stop for the connector sleeve assembly. 25. The fiber optic connector of claim 19, wherein a portion of the balancing resilient member contacts the connector sleeve assembly. 26. The fiber optic connector of claim 19, the connector assembly further comprising a ferrule holder and the resilient member of the connector assembly biases the ferrule holder and the ferrule forward. 27. The fiber optic connector of claim 19, further comprising a female coupling housing comprising an opening for receiving a complimentary connector. 28. The fiber optic connector of claim 19, wherein the connector assembly is an SC connector assembly. 29. The fiber optic connector of claim 19, further comprising a crimp band. 30. The fiber optic connector of claim 19, being a portion of a cable assembly further comprising a fiber optic cable attached to the fiber optic connector. 31. The fiber optic connector of claim 30, wherein the fiber optic cable includes strength members secured to a cable attachment region. 32. The fiber optic connector of claim 30, further comprising a tensile element of the fiber optic cable being a plurality of tensile yarns attached between an outer barrel of the body and a crimp band or one or more strength components disposed between a first shell and a second shell of the body. 33. The fiber optic connector of claim 30, wherein the fiber optic connector further comprises a first shell and a second shell that are secured using a crimp band and/or an adhesive. 34. The fiber optic connector of claim 30, wherein the fiber optic cable has an optical fiber having a buffer layer that enters the body and enters the connector assembly. 35. The fiber optic connector of claim 30, the cable assembly further comprises a boot. 36. A fiber optic connector, comprising:
a connector assembly comprising a ferrule and a resilient member for biasing the ferrule forward; a connector sleeve assembly comprising a housing with a passageway between a first end and a second end, a ferrule sleeve and a latch, wherein the connector assembly is at least partially disposed in the passageway of the connector sleeve assembly and the ferrule is at least partially disposed in the ferrule sleeve when assembled; and a balancing resilient member for biasing the connector sleeve assembly to a forward position with the latch configured for engaging the connector assembly when assembled, and the biasing resilient member comprising a predetermined resilient force that is greater than the friction force required for displacing the ferrule within the ferrule sleeve. 37. A fiber optic connector, comprising:
a connector assembly comprising a housing, a ferrule and a resilient member for biasing the ferrule forward; a connector sleeve assembly comprising a housing with a passageway between a first end and a second end, a ferrule sleeve and a latch, wherein the connector assembly is at least partially disposed in the passageway of the connector sleeve assembly and the ferrule is at least partially disposed in the ferrule sleeve when assembled; a balancing resilient member for biasing the connector sleeve assembly to a forward position with the latch configured for engaging the connector assembly when assembled, and the biasing resilient member comprising a predetermined resilient force that is greater than the friction force required for displacing the ferrule within the ferrule sleeve; and a female coupling housing comprising an opening for receiving a complimentary connector. 38. The fiber optic connector of claim 36, wherein the predetermined resilient force is 2.5 Newton or greater. 39. The fiber optic connector of claim 36, wherein the ferrule has a diameter of about 2.5 millimeters and the predetermined resilient force is 5 Newton or greater. 40. The fiber optic connector of claim 36, wherein the ferrule has a diameter of about 1.25 millimeters and the predetermined resilient force is 2.5 Newton or greater. 41. A method of assembling a fiber optic connector assembly, comprising:
providing a connector assembly comprising a ferrule and a resilient member for biasing the ferrule forward; providing a connector sleeve assembly comprising a housing with a passageway between a first end and a second end, a ferrule sleeve and a latch; inserting the connector assembly at least partially into the passageway of the connector sleeve assembly and the ferrule at least partially into the ferrule sleeve; and installing a balancing resilient member for biasing the connector sleeve assembly to a forward position with the latch of the connector assembly engaging the connector assembly, wherein the biasing resilient member has a predetermined resilient force that is greater than the friction force required for displacing the ferrule within the ferrule sleeve. | A ferrule-based fiber optic connectors having a ferrule retraction balancing characteristic for preserving optical performance are disclosed. The fiber optic connector comprises a connector assembly, a connector sleeve assembly and a balancing resilient member. The connector assembly comprises a ferrule and a resilient member for biasing the ferrule forward and the connector sleeve assembly comprises a housing and a ferrule sleeve, where the connector assembly is at least partially disposed in the passageway of the housing and the ferrule of the connector assembly is at least partially disposed in the ferrule sleeve. The balancing resilient member biases the housing to a forward position with a the biasing resilient member having a predetermined resilient force that is greater than the friction force required for displacement of the ferrule within the ferrule sleeve.1. A fiber optic connector, comprising:
a connector assembly comprising a ferrule and a resilient member for biasing the ferrule forward; a connector sleeve assembly comprising a housing with a passageway between a first end and a second end and a ferrule sleeve, wherein the connector assembly is at least partially disposed in the passageway of the housing and the ferrule of the connector assembly is at least partially disposed in the ferrule sleeve when assembled; and a balancing resilient member for biasing the housing to a forward position, the biasing resilient member comprising a predetermined resilient force that is greater than the friction force required for displacement of the ferrule within the ferrule sleeve. 2. The fiber optic connector of claim 1, wherein the predetermined resilient force is 2.5 Newton or greater. 3. The fiber optic connector of claim 1, wherein the ferrule has a diameter of about 2.5 millimeters and the predetermined resilient force is 5 Newton or greater. 4. The fiber optic connector of claim 1, wherein the ferrule has a diameter of about 1.25 millimeters and the predetermined resilient force is 2.5 Newton or greater. 5. The fiber optic connector of claim 1, wherein the connector sleeve assembly comprises a latch, and the balancing resilient member biases the connector sleeve assembly forward with the latch engaging the connector assembly when assembled. 6. The fiber optic connector of claim 1, wherein a portion of the balancing resilient member is disposed radially outward of the connector assembly. 7. The fiber optic connector of claim 1, further comprising a stop for the connector sleeve assembly. 8. The fiber optic connector of claim 1, the fiber optic connector comprising a portion of the balancing resilient member contacts the connector sleeve assembly. 9. The fiber optic connector of claim 1, further including a ferrule holder and the resilient member of the connector assembly biases the ferrule holder and the ferrule forward when assembled. 10. The fiber optic connector of claim 1, further comprising a female coupling housing comprising an opening for receiving a complimentary connector. 11. The fiber optic connector of claim 1, the connector assembly further comprising a housing and the connector assembly being an SC connector assembly. 12. The fiber optic connector of claim 1, further comprising a crimp band. 13. The fiber optic connector of claim 1 being a portion of a cable assembly further comprising a fiber optic cable attached to the fiber optic connector. 14. The fiber optic connector of claim 13, wherein the fiber optic cable further comprises strength members secured to a cable attachment region. 15. The fiber optic connector of claim 13, further comprising a tensile element of the fiber optic cable being a plurality of tensile yarns attached between an outer barrel of the body and a crimp band or one or more strength components disposed between a first shell and a second shell of the body. 16. The fiber optic connector of claim 13, further comprising a first shell and a second shell that are secured using a crimp band and/or an adhesive. 17. The fiber optic connector of claim 13, wherein the fiber optic cable has an optical fiber having a buffer layer that enters the body and enters the connector assembly. 18. The fiber optic connector of claim 13, the cable assembly further includes a boot. 19. A fiber optic connector, comprising:
a connector assembly comprising a ferrule and a resilient member for biasing the ferrule forward; a connector sleeve assembly comprising a housing with a passageway between a first end and a second end and a ferrule sleeve, wherein the connector assembly is at least partially disposed in the passageway of the connector sleeve assembly and the ferrule is at least partially disposed in the ferrule sleeve when assembled; and a balancing resilient member for biasing the connector sleeve assembly to a forward position, the biasing resilient member comprising a predetermined resilient force that is 5 Newton or greater. 20. The fiber optic connector of claim 19, wherein the ferrule has a diameter of about 2.5 millimeters. 21. The fiber optic connector of claim 19, wherein the ferrule has a diameter of about 1.25 millimeters. 22. The fiber optic connector of claim 19, wherein the connector sleeve assembly comprises a latch, and the balancing resilient member biases the connector sleeve assembly forward with the latch engaging the connector assembly when assembled. 23. The fiber optic connector of claim 19, wherein a portion of the balancing resilient member is disposed radially outward of the connector assembly. 24. The fiber optic connector of claim 19, further comprising a stop for the connector sleeve assembly. 25. The fiber optic connector of claim 19, wherein a portion of the balancing resilient member contacts the connector sleeve assembly. 26. The fiber optic connector of claim 19, the connector assembly further comprising a ferrule holder and the resilient member of the connector assembly biases the ferrule holder and the ferrule forward. 27. The fiber optic connector of claim 19, further comprising a female coupling housing comprising an opening for receiving a complimentary connector. 28. The fiber optic connector of claim 19, wherein the connector assembly is an SC connector assembly. 29. The fiber optic connector of claim 19, further comprising a crimp band. 30. The fiber optic connector of claim 19, being a portion of a cable assembly further comprising a fiber optic cable attached to the fiber optic connector. 31. The fiber optic connector of claim 30, wherein the fiber optic cable includes strength members secured to a cable attachment region. 32. The fiber optic connector of claim 30, further comprising a tensile element of the fiber optic cable being a plurality of tensile yarns attached between an outer barrel of the body and a crimp band or one or more strength components disposed between a first shell and a second shell of the body. 33. The fiber optic connector of claim 30, wherein the fiber optic connector further comprises a first shell and a second shell that are secured using a crimp band and/or an adhesive. 34. The fiber optic connector of claim 30, wherein the fiber optic cable has an optical fiber having a buffer layer that enters the body and enters the connector assembly. 35. The fiber optic connector of claim 30, the cable assembly further comprises a boot. 36. A fiber optic connector, comprising:
a connector assembly comprising a ferrule and a resilient member for biasing the ferrule forward; a connector sleeve assembly comprising a housing with a passageway between a first end and a second end, a ferrule sleeve and a latch, wherein the connector assembly is at least partially disposed in the passageway of the connector sleeve assembly and the ferrule is at least partially disposed in the ferrule sleeve when assembled; and a balancing resilient member for biasing the connector sleeve assembly to a forward position with the latch configured for engaging the connector assembly when assembled, and the biasing resilient member comprising a predetermined resilient force that is greater than the friction force required for displacing the ferrule within the ferrule sleeve. 37. A fiber optic connector, comprising:
a connector assembly comprising a housing, a ferrule and a resilient member for biasing the ferrule forward; a connector sleeve assembly comprising a housing with a passageway between a first end and a second end, a ferrule sleeve and a latch, wherein the connector assembly is at least partially disposed in the passageway of the connector sleeve assembly and the ferrule is at least partially disposed in the ferrule sleeve when assembled; a balancing resilient member for biasing the connector sleeve assembly to a forward position with the latch configured for engaging the connector assembly when assembled, and the biasing resilient member comprising a predetermined resilient force that is greater than the friction force required for displacing the ferrule within the ferrule sleeve; and a female coupling housing comprising an opening for receiving a complimentary connector. 38. The fiber optic connector of claim 36, wherein the predetermined resilient force is 2.5 Newton or greater. 39. The fiber optic connector of claim 36, wherein the ferrule has a diameter of about 2.5 millimeters and the predetermined resilient force is 5 Newton or greater. 40. The fiber optic connector of claim 36, wherein the ferrule has a diameter of about 1.25 millimeters and the predetermined resilient force is 2.5 Newton or greater. 41. A method of assembling a fiber optic connector assembly, comprising:
providing a connector assembly comprising a ferrule and a resilient member for biasing the ferrule forward; providing a connector sleeve assembly comprising a housing with a passageway between a first end and a second end, a ferrule sleeve and a latch; inserting the connector assembly at least partially into the passageway of the connector sleeve assembly and the ferrule at least partially into the ferrule sleeve; and installing a balancing resilient member for biasing the connector sleeve assembly to a forward position with the latch of the connector assembly engaging the connector assembly, wherein the biasing resilient member has a predetermined resilient force that is greater than the friction force required for displacing the ferrule within the ferrule sleeve. | 2,800 |
12,395 | 12,395 | 16,100,559 | 2,837 | An electromechanical switch includes first and second stationary contacts and a movable contact. Each of the first and second stationary contacts has a respective protrusion at a mating end thereof. The movable contact defines a first depression and a second depression along a mating side thereof. The movable contact is reciprocally movable into and out of a closed position relative to the first and second stationary contacts. In the closed position, the mating side of the movable contact engages the mating ends of the first and second stationary contacts such that the protrusion of the first stationary contact projects into the first depression and the protrusion of the second stationary contact projects into the second depression. | 1. An electromechanical switch comprising:
first and second stationary contacts spaced apart from each other, each of the first and second stationary contacts having a respective protrusion at a mating end thereof; and a movable contact having a mating side and defining a first depression and a second depression along the mating side, the first and second depressions spaced apart from each other along a length of the movable contact, wherein the movable contact is reciprocally movable into and out of a closed position relative to the first and second stationary contacts, wherein, in the closed position, the mating side of the movable contact engages the mating ends of the first and second stationary contacts such that the protrusion of the first stationary contact projects into the first depression and the protrusion of the second stationary contact projects into the second depression. 2. The electromechanical switch of claim 1, wherein, in the closed position, the protrusion of the first stationary contact engages an edge of the first depression at multiple contact points and the protrusion of the second stationary contact engages an edge of the second depression at multiple contact points. 3. The electromechanical switch of claim 1, wherein the movable contact has a planar surface along the mating side, each of the first and second depressions inwardly extending from a respective edge at the planar surface to a respective nadir that is recessed relative to the planar surface, wherein, in the closed position, the protrusions of the first and second stationary contacts engage the edges of the corresponding first and second depressions without engaging the nadirs. 4. The electromechanical switch of claim 1, wherein each of the first depression and the second depression is an oblong groove including two elongated edge segments, wherein, in the closed position, the protrusion of the first stationary contact engages both of the elongated edge segments of the first depression and the protrusion of the second stationary contact engages both of the elongated edge segments of the second depression. 5. The electromechanical switch of claim 4, wherein the elongated edge segments of the first and second depressions have curved sloping surfaces. 6. The electromechanical switch of claim 1, wherein each of the first depression and the second depression is a rounded crater. 7. The electromechanical switch of claim 6, wherein the protrusion of the first stationary contact has a greater diameter than the rounded crater of the first depression, and the protrusion of the second stationary contact has a greater diameter than the rounded crater of the second depression. 8. The electromechanical switch of claim 1, wherein the length of the movable contact extends from a first end thereof to a second end thereof, wherein the first depression extends to the first end and the second depression extends to the second end. 9. The electromechanical switch of claim 1, wherein the protrusion of each of the first and second stationary contacts occupies an entire surface area of the respective mating end. 10. The electromechanical switch of claim 1, further comprising an armature assembly that includes a shaft and a ferromagnetic plunger coupled to the shaft, the shaft having a first end that is coupled to the movable contact, wherein the armature assembly reciprocally moves the movable contact relative to the first and second stationary contacts based on a magnetic field induced by current through a coil of wire surrounding the ferromagnetic plunger. 11. An electromechanical switch comprising:
first and second stationary contacts spaced apart from each other, each of the first and second stationary contacts having a respective protrusion at a mating end thereof; a movable contact having a mating side and defining a first depression and a second depression along the mating side, each of the first and second depressions inwardly extending from a respective edge at the mating side; and an armature assembly including a shaft coupled to the movable contact and a ferromagnetic plunger coupled to the shaft, wherein the armature assembly reciprocally moves the movable contact into and out of a closed position relative to the first and second stationary contacts based on a magnetic field induced by current through a coil of wire surrounding the ferromagnetic plunger, wherein, in the closed position, the protrusion of the first stationary contact projects into the first depression and engages the edge of the first depression at multiple contact points, and the protrusion of the second stationary contact projects into the second depression and engages the edge of the second depression at multiple contact points. 12. The electromechanical switch of claim 11, wherein the movable contact defines an opening that is disposed between the first and second depressions along a length of the movable contact, and the shaft is received in the opening. 13. The electromechanical switch of claim 11, wherein each of the first and second depressions inwardly extends from the respective edge thereof to a respective nadir that is recessed relative to the edge, wherein, in the closed position, the protrusions of the first and second stationary contacts engage the edges of the corresponding first and second depressions without engaging the nadirs. 14. The electromechanical switch of claim 11, wherein each of the first depression and the second depression is an oblong groove including two elongated edge segments, wherein, in the closed position, the protrusion of the first stationary contact engages both of the elongated edge segments of the first depression and the protrusion of the second stationary contact engages both of the elongated edge segments of the second depression. 15. The electromechanical switch of claim 11, wherein each of the first depression and the second depression is a rounded crater. 16. The electromechanical switch of claim 11, wherein a length of the movable contact extends from a first end thereof to a second end thereof, wherein the first depression extends to the first end and the second depression extends to the second end. 17. An electromechanical switch comprising:
first and second stationary contacts spaced apart from each other, each of the first and second stationary contacts having a respective depression along a mating end thereof, the mating ends of the first and second stationary contacts defining edges of the depressions; and a movable contact having a mating side that includes a planar surface and first and second protrusions that project beyond the planar surface towards the first and second stationary contacts, the first and second protrusions spaced apart from each other along a length of the movable contact, wherein the movable contact is reciprocally movable into and out of a closed position relative to the first and second stationary contacts, wherein, in the closed position, the first protrusion of the movable contact projects into the depression of the first stationary contact and engages the edge thereof at multiple contact points, and the second protrusion of the movable contact projects into the depression of the second stationary contact and engages the edge thereof at multiple contact points. 18. The electromechanical switch of claim 17, wherein the length of the movable contact extends from a first end thereof to a second end thereof, wherein the first protrusion extends to the first end and the second protrusion extends to the second end. 19. The electromechanical switch of claim 17, wherein the depression of each of the first and second stationary contacts is a rounded crater, wherein the first protrusion of the movable contact has a greater diameter than the depression of the first stationary contact and the second protrusion of the movable contact has a greater diameter than the depression of the second stationary contact. 20. The electromechanical switch of claim 17, wherein the depression of each of the first and second stationary contacts is an oblong groove having two elongated edge segments, and wherein, in the closed position, the first protrusion of the movable contact engages both of the elongated edge segments of the depression of the first stationary contact and the second protrusion of the movable contact engages both of the elongated edge segments of the depression of the second stationary contact. | An electromechanical switch includes first and second stationary contacts and a movable contact. Each of the first and second stationary contacts has a respective protrusion at a mating end thereof. The movable contact defines a first depression and a second depression along a mating side thereof. The movable contact is reciprocally movable into and out of a closed position relative to the first and second stationary contacts. In the closed position, the mating side of the movable contact engages the mating ends of the first and second stationary contacts such that the protrusion of the first stationary contact projects into the first depression and the protrusion of the second stationary contact projects into the second depression.1. An electromechanical switch comprising:
first and second stationary contacts spaced apart from each other, each of the first and second stationary contacts having a respective protrusion at a mating end thereof; and a movable contact having a mating side and defining a first depression and a second depression along the mating side, the first and second depressions spaced apart from each other along a length of the movable contact, wherein the movable contact is reciprocally movable into and out of a closed position relative to the first and second stationary contacts, wherein, in the closed position, the mating side of the movable contact engages the mating ends of the first and second stationary contacts such that the protrusion of the first stationary contact projects into the first depression and the protrusion of the second stationary contact projects into the second depression. 2. The electromechanical switch of claim 1, wherein, in the closed position, the protrusion of the first stationary contact engages an edge of the first depression at multiple contact points and the protrusion of the second stationary contact engages an edge of the second depression at multiple contact points. 3. The electromechanical switch of claim 1, wherein the movable contact has a planar surface along the mating side, each of the first and second depressions inwardly extending from a respective edge at the planar surface to a respective nadir that is recessed relative to the planar surface, wherein, in the closed position, the protrusions of the first and second stationary contacts engage the edges of the corresponding first and second depressions without engaging the nadirs. 4. The electromechanical switch of claim 1, wherein each of the first depression and the second depression is an oblong groove including two elongated edge segments, wherein, in the closed position, the protrusion of the first stationary contact engages both of the elongated edge segments of the first depression and the protrusion of the second stationary contact engages both of the elongated edge segments of the second depression. 5. The electromechanical switch of claim 4, wherein the elongated edge segments of the first and second depressions have curved sloping surfaces. 6. The electromechanical switch of claim 1, wherein each of the first depression and the second depression is a rounded crater. 7. The electromechanical switch of claim 6, wherein the protrusion of the first stationary contact has a greater diameter than the rounded crater of the first depression, and the protrusion of the second stationary contact has a greater diameter than the rounded crater of the second depression. 8. The electromechanical switch of claim 1, wherein the length of the movable contact extends from a first end thereof to a second end thereof, wherein the first depression extends to the first end and the second depression extends to the second end. 9. The electromechanical switch of claim 1, wherein the protrusion of each of the first and second stationary contacts occupies an entire surface area of the respective mating end. 10. The electromechanical switch of claim 1, further comprising an armature assembly that includes a shaft and a ferromagnetic plunger coupled to the shaft, the shaft having a first end that is coupled to the movable contact, wherein the armature assembly reciprocally moves the movable contact relative to the first and second stationary contacts based on a magnetic field induced by current through a coil of wire surrounding the ferromagnetic plunger. 11. An electromechanical switch comprising:
first and second stationary contacts spaced apart from each other, each of the first and second stationary contacts having a respective protrusion at a mating end thereof; a movable contact having a mating side and defining a first depression and a second depression along the mating side, each of the first and second depressions inwardly extending from a respective edge at the mating side; and an armature assembly including a shaft coupled to the movable contact and a ferromagnetic plunger coupled to the shaft, wherein the armature assembly reciprocally moves the movable contact into and out of a closed position relative to the first and second stationary contacts based on a magnetic field induced by current through a coil of wire surrounding the ferromagnetic plunger, wherein, in the closed position, the protrusion of the first stationary contact projects into the first depression and engages the edge of the first depression at multiple contact points, and the protrusion of the second stationary contact projects into the second depression and engages the edge of the second depression at multiple contact points. 12. The electromechanical switch of claim 11, wherein the movable contact defines an opening that is disposed between the first and second depressions along a length of the movable contact, and the shaft is received in the opening. 13. The electromechanical switch of claim 11, wherein each of the first and second depressions inwardly extends from the respective edge thereof to a respective nadir that is recessed relative to the edge, wherein, in the closed position, the protrusions of the first and second stationary contacts engage the edges of the corresponding first and second depressions without engaging the nadirs. 14. The electromechanical switch of claim 11, wherein each of the first depression and the second depression is an oblong groove including two elongated edge segments, wherein, in the closed position, the protrusion of the first stationary contact engages both of the elongated edge segments of the first depression and the protrusion of the second stationary contact engages both of the elongated edge segments of the second depression. 15. The electromechanical switch of claim 11, wherein each of the first depression and the second depression is a rounded crater. 16. The electromechanical switch of claim 11, wherein a length of the movable contact extends from a first end thereof to a second end thereof, wherein the first depression extends to the first end and the second depression extends to the second end. 17. An electromechanical switch comprising:
first and second stationary contacts spaced apart from each other, each of the first and second stationary contacts having a respective depression along a mating end thereof, the mating ends of the first and second stationary contacts defining edges of the depressions; and a movable contact having a mating side that includes a planar surface and first and second protrusions that project beyond the planar surface towards the first and second stationary contacts, the first and second protrusions spaced apart from each other along a length of the movable contact, wherein the movable contact is reciprocally movable into and out of a closed position relative to the first and second stationary contacts, wherein, in the closed position, the first protrusion of the movable contact projects into the depression of the first stationary contact and engages the edge thereof at multiple contact points, and the second protrusion of the movable contact projects into the depression of the second stationary contact and engages the edge thereof at multiple contact points. 18. The electromechanical switch of claim 17, wherein the length of the movable contact extends from a first end thereof to a second end thereof, wherein the first protrusion extends to the first end and the second protrusion extends to the second end. 19. The electromechanical switch of claim 17, wherein the depression of each of the first and second stationary contacts is a rounded crater, wherein the first protrusion of the movable contact has a greater diameter than the depression of the first stationary contact and the second protrusion of the movable contact has a greater diameter than the depression of the second stationary contact. 20. The electromechanical switch of claim 17, wherein the depression of each of the first and second stationary contacts is an oblong groove having two elongated edge segments, and wherein, in the closed position, the first protrusion of the movable contact engages both of the elongated edge segments of the depression of the first stationary contact and the second protrusion of the movable contact engages both of the elongated edge segments of the depression of the second stationary contact. | 2,800 |
12,396 | 12,396 | 16,078,442 | 2,837 | An embedded-core device including a substrate, a core embedded in the substrate, a winding arranged around the core, and a dummy pin in direct contact with the core and not in direct contact with the winding. A method of a manufacturing an embedded-core device includes providing winding pins and a dummy pin, inserting a core between the winding pins using the dummy pin such that the dummy pin is in direct contact with the core and not in direct contact with the winding pins, and sealing the core with resin. | 1. An embedded-core device comprising:
a substrate; a core embedded in the substrate; a winding arranged around the core; and a dummy pin in direct contact with the core and not in direct contact with the winding. 2. The embedded-core device of claim 1, further comprising at least one additional dummy pin in direct contact with the core and not in direct contact with the winding. 3. The embedded-core device of claim 1, wherein the dummy pin includes an inductor or an insulator. 4. The embedded-core device of claim 1, wherein the winding includes winding pins embedded in the substrate. 5. The embedded-core device of claim 4, wherein the dummy pin is shorter than the winding pins. 6. The embedded-core device of claim 4, wherein a cross-section of the dummy pin is smaller than a cross-section of each of the winding pins. 7. The embedded-core device of claim 4, wherein the dummy pin and the winding pins are made of a same material. 8. The embedded-core device of claim 4, wherein the winding further includes:
first conductors located on a top surface of the substrate and connected to corresponding winding pins; and second conductors located on a bottom surface of the substrate and connected to corresponding winding pins. 9. The embedded-core device of claim 1, further comprising an additional winding. 10. The embedded-core device of claim 9, wherein the winding and the additional winding define a transformer. 11. A method of a manufacturing an embedded-core device comprising:
providing winding pins and a dummy pin; inserting a core between the winding pins using the dummy pin such that the dummy pin is in direct contact with the core and not in direct contact with the winding pins; and sealing the core with resin. 12. The method of claim 11, wherein the step of providing winding pins and a dummy pin includes:
providing a release sheet with a supporting layer; and inserting the winding pins and the dummy pin into the supporting layer. 13. The method of claim 12, wherein the supporting layer and the release sheet are made of a same material. 14. The method of claim 12, further comprising removing the release sheet after the step of sealing the core. 15. The method of claim 11, further comprising forming a winding around the core using the winding pins. 16. The method of claim 15, wherein the step of forming a winding includes forming conductors that are located on either an upper surface or a lower surface of the embedded-core device and that connect corresponding winding pins. 17. The method of claim 15, wherein the step of forming a winding includes polishing upper and lower surfaces of the embedded-core device to expose ends of the winding pins. 18. The method of claim 15, further comprising forming an additional winding around the core using the winding pins. 19. The method of claim 18, wherein the winding and the additional winding define a transformer. 20. The method of claim 11, wherein the step of providing winding pins and a dummy pin includes providing at least one additional dummy pin. | An embedded-core device including a substrate, a core embedded in the substrate, a winding arranged around the core, and a dummy pin in direct contact with the core and not in direct contact with the winding. A method of a manufacturing an embedded-core device includes providing winding pins and a dummy pin, inserting a core between the winding pins using the dummy pin such that the dummy pin is in direct contact with the core and not in direct contact with the winding pins, and sealing the core with resin.1. An embedded-core device comprising:
a substrate; a core embedded in the substrate; a winding arranged around the core; and a dummy pin in direct contact with the core and not in direct contact with the winding. 2. The embedded-core device of claim 1, further comprising at least one additional dummy pin in direct contact with the core and not in direct contact with the winding. 3. The embedded-core device of claim 1, wherein the dummy pin includes an inductor or an insulator. 4. The embedded-core device of claim 1, wherein the winding includes winding pins embedded in the substrate. 5. The embedded-core device of claim 4, wherein the dummy pin is shorter than the winding pins. 6. The embedded-core device of claim 4, wherein a cross-section of the dummy pin is smaller than a cross-section of each of the winding pins. 7. The embedded-core device of claim 4, wherein the dummy pin and the winding pins are made of a same material. 8. The embedded-core device of claim 4, wherein the winding further includes:
first conductors located on a top surface of the substrate and connected to corresponding winding pins; and second conductors located on a bottom surface of the substrate and connected to corresponding winding pins. 9. The embedded-core device of claim 1, further comprising an additional winding. 10. The embedded-core device of claim 9, wherein the winding and the additional winding define a transformer. 11. A method of a manufacturing an embedded-core device comprising:
providing winding pins and a dummy pin; inserting a core between the winding pins using the dummy pin such that the dummy pin is in direct contact with the core and not in direct contact with the winding pins; and sealing the core with resin. 12. The method of claim 11, wherein the step of providing winding pins and a dummy pin includes:
providing a release sheet with a supporting layer; and inserting the winding pins and the dummy pin into the supporting layer. 13. The method of claim 12, wherein the supporting layer and the release sheet are made of a same material. 14. The method of claim 12, further comprising removing the release sheet after the step of sealing the core. 15. The method of claim 11, further comprising forming a winding around the core using the winding pins. 16. The method of claim 15, wherein the step of forming a winding includes forming conductors that are located on either an upper surface or a lower surface of the embedded-core device and that connect corresponding winding pins. 17. The method of claim 15, wherein the step of forming a winding includes polishing upper and lower surfaces of the embedded-core device to expose ends of the winding pins. 18. The method of claim 15, further comprising forming an additional winding around the core using the winding pins. 19. The method of claim 18, wherein the winding and the additional winding define a transformer. 20. The method of claim 11, wherein the step of providing winding pins and a dummy pin includes providing at least one additional dummy pin. | 2,800 |
12,397 | 12,397 | 16,018,008 | 2,881 | The device includes a beam source for generating an electron beam, a beam guiding tube passed through an objective lens, an objective lens for generating a magnetic field in the vicinity of the specimen to focus the particles of the particle beam on the specimen, a control electrode having a potential for providing a retarding field to the particle beam near the specimen to reduce the energy of the particle beam when the beam collides with the specimen, a deflection system including a plurality of deflection units situated along the optical axis for deflecting the particle beam to allow scanning on the specimen with large area, at least one of the deflection units located in the retarding field of the beam, the remainder of the deflection units located within the central bore of the objective lens, and a detection unit to capture secondary electron (SE) and backscattered electrons (BSE). | 1. An objective system for focusing a charged particle beam, comprising:
an objective lens for focusing the beam onto a specimen; a beam guiding tube through the objective for the beam; a deflection device arranged in the objective for deflecting the beam to a first distance; and a scanning deflection unit for deflecting the beam to a second distance less than the first distance. 2. The system according to claim 1, wherein the objective lens comprises a magnetic lens and an electrostatic lens, the beam guiding tube is an electrode for controlling the kinetic energy of the beam, and the deflection device comprises a first magnetic deflector for deflecting the beam and a second magnetic deflector for swinging the compound field of objective lens. 3. The system according to claim 2, wherein the electrostatic lens comprises a lower end of the beam guiding tube, a control electrode disposed below the beam guiding tube, and a stage. 4. The system according to claim 3, wherein the scanning deflection unit arranged in the objective lens comprises a third magnetic deflector and a forth magnetic deflector which are spaced apart from a yoke by a ferrite tube. 5. The system according to claim 3, wherein the scanning deflection unit arranged below the beam guiding tube comprises a fifth magnetic deflector. 6. The system according to claim 2, wherein the electrostatic lens comprises a lower end of the beam guiding tube, the scanning deflection unit disposed below the beam guiding tube, and a stage. 7. The system according to claim 6, wherein the scanning deflection unit adjusts a beam incidence angle from a tilt incidence angle to a normal incidence angle for the edge aberration. 8. A charged particle beam device, comprising:
a beam source for generating a primary beam; a beam guiding tubular electrode for accelerating the primary beam; a condenser lens for condensing the primary beam; an immersion magnetic objective lens to focus the primary beam onto a specimen; a first deflection unit disposed in the objective lens for large field of view scanning; a second deflection unit disposed in the objective lens for small field of view scanning; a retarding electrode disposed below the beam guiding tube for decelerating the beam; and at least one detection unit disposed above the lens to detect secondary and/or back-scattered particles emanated from the specimen. 9. The device according to claim 8, further comprising a plurality of apertures for limiting the primary beam. 10. The device according to claim 9, wherein the beam guiding tube extends from an anode of the beam source downward a lower pole piece of the objective lens. 11. The device according to claim 8, wherein the first deflection unit comprises a first magnetic deflector accommodated in an upper portion of the objective lens for pre-deflecting the primary beam and a second magnetic deflector accommodated in the objective lens for swinging the objective lens. 12. The device according to claim 11, wherein the second deflection unit has a third magnetic deflector and a fourth magnetic deflector which are arranged between the first magnetic deflector and the second magnetic deflector and spaced apart from the immersion magnetic objective lens by a ferrite tube. 13. The device according to claim 9, wherein the retarding electrode adjusts a beam incidence angle from a tilt incidence angle to a normal incidence angle for the edge aberration. 14. A method for directing a charged particle beam to a substrate, comprising the steps of:
generating a guiding field along a beam path to direct the beam to the substrate; generating a first deflection field within the guiding field to direct the beam in a predetermined direction; generating a second deflection field downstream of the first deflection field for deflecting the deflected beam for small field of view scanning; and generating a third deflection field within the guiding field to produce a swing objective lens for a large field of view scanning. 15. The method according to claim 14, wherein the swing objective lens comprises a magnetic lens and an electrostatic lens,
the guiding field is provided by a beam guiding tubular electrode, the first deflection field is provided by a first magnetic deflector unit, the second deflection field is provided by a second magnetic deflector unit, and the third deflection field is provided by a third magnetic deflector unit. 16. The method according to claim 15, wherein the electrostatic lens comprises the tubular electrode, a control electrode disposed below the tubular electrode, and a stage for supporting the substrate. 17. The method according to claim 15, wherein the second magnetic deflector unit is accommodated in a yoke of the objective lens, the second magnetic deflector unit being spaced apart from the magnetic objective lens by a ferrite tube. 18. The method according to claim 15, wherein the second magnetic deflector unit is arranged below the tubular electrode, and includes a ferrite tube near to the second magnetic deflector unit. 19. The method according to claim 15, wherein the electrostatic lens comprises the tubular electrode, the second magnetic deflector unit disposed below the tubular electrode, and a stage for supporting the substrate 20-27. (canceled) | The device includes a beam source for generating an electron beam, a beam guiding tube passed through an objective lens, an objective lens for generating a magnetic field in the vicinity of the specimen to focus the particles of the particle beam on the specimen, a control electrode having a potential for providing a retarding field to the particle beam near the specimen to reduce the energy of the particle beam when the beam collides with the specimen, a deflection system including a plurality of deflection units situated along the optical axis for deflecting the particle beam to allow scanning on the specimen with large area, at least one of the deflection units located in the retarding field of the beam, the remainder of the deflection units located within the central bore of the objective lens, and a detection unit to capture secondary electron (SE) and backscattered electrons (BSE).1. An objective system for focusing a charged particle beam, comprising:
an objective lens for focusing the beam onto a specimen; a beam guiding tube through the objective for the beam; a deflection device arranged in the objective for deflecting the beam to a first distance; and a scanning deflection unit for deflecting the beam to a second distance less than the first distance. 2. The system according to claim 1, wherein the objective lens comprises a magnetic lens and an electrostatic lens, the beam guiding tube is an electrode for controlling the kinetic energy of the beam, and the deflection device comprises a first magnetic deflector for deflecting the beam and a second magnetic deflector for swinging the compound field of objective lens. 3. The system according to claim 2, wherein the electrostatic lens comprises a lower end of the beam guiding tube, a control electrode disposed below the beam guiding tube, and a stage. 4. The system according to claim 3, wherein the scanning deflection unit arranged in the objective lens comprises a third magnetic deflector and a forth magnetic deflector which are spaced apart from a yoke by a ferrite tube. 5. The system according to claim 3, wherein the scanning deflection unit arranged below the beam guiding tube comprises a fifth magnetic deflector. 6. The system according to claim 2, wherein the electrostatic lens comprises a lower end of the beam guiding tube, the scanning deflection unit disposed below the beam guiding tube, and a stage. 7. The system according to claim 6, wherein the scanning deflection unit adjusts a beam incidence angle from a tilt incidence angle to a normal incidence angle for the edge aberration. 8. A charged particle beam device, comprising:
a beam source for generating a primary beam; a beam guiding tubular electrode for accelerating the primary beam; a condenser lens for condensing the primary beam; an immersion magnetic objective lens to focus the primary beam onto a specimen; a first deflection unit disposed in the objective lens for large field of view scanning; a second deflection unit disposed in the objective lens for small field of view scanning; a retarding electrode disposed below the beam guiding tube for decelerating the beam; and at least one detection unit disposed above the lens to detect secondary and/or back-scattered particles emanated from the specimen. 9. The device according to claim 8, further comprising a plurality of apertures for limiting the primary beam. 10. The device according to claim 9, wherein the beam guiding tube extends from an anode of the beam source downward a lower pole piece of the objective lens. 11. The device according to claim 8, wherein the first deflection unit comprises a first magnetic deflector accommodated in an upper portion of the objective lens for pre-deflecting the primary beam and a second magnetic deflector accommodated in the objective lens for swinging the objective lens. 12. The device according to claim 11, wherein the second deflection unit has a third magnetic deflector and a fourth magnetic deflector which are arranged between the first magnetic deflector and the second magnetic deflector and spaced apart from the immersion magnetic objective lens by a ferrite tube. 13. The device according to claim 9, wherein the retarding electrode adjusts a beam incidence angle from a tilt incidence angle to a normal incidence angle for the edge aberration. 14. A method for directing a charged particle beam to a substrate, comprising the steps of:
generating a guiding field along a beam path to direct the beam to the substrate; generating a first deflection field within the guiding field to direct the beam in a predetermined direction; generating a second deflection field downstream of the first deflection field for deflecting the deflected beam for small field of view scanning; and generating a third deflection field within the guiding field to produce a swing objective lens for a large field of view scanning. 15. The method according to claim 14, wherein the swing objective lens comprises a magnetic lens and an electrostatic lens,
the guiding field is provided by a beam guiding tubular electrode, the first deflection field is provided by a first magnetic deflector unit, the second deflection field is provided by a second magnetic deflector unit, and the third deflection field is provided by a third magnetic deflector unit. 16. The method according to claim 15, wherein the electrostatic lens comprises the tubular electrode, a control electrode disposed below the tubular electrode, and a stage for supporting the substrate. 17. The method according to claim 15, wherein the second magnetic deflector unit is accommodated in a yoke of the objective lens, the second magnetic deflector unit being spaced apart from the magnetic objective lens by a ferrite tube. 18. The method according to claim 15, wherein the second magnetic deflector unit is arranged below the tubular electrode, and includes a ferrite tube near to the second magnetic deflector unit. 19. The method according to claim 15, wherein the electrostatic lens comprises the tubular electrode, the second magnetic deflector unit disposed below the tubular electrode, and a stage for supporting the substrate 20-27. (canceled) | 2,800 |
12,398 | 12,398 | 15,452,728 | 2,824 | The present invention discloses a distributed pattern processor. The distributed pattern processor not only stores patterns permanently, but also processes them using massive parallelism. It comprises a plurality of storage-processing units (SPU), with each SPU comprising a pattern-processing circuit and at least a three-dimensional memory (3D-M) array storing at least a pattern. The 3D-M array is vertically stacked above the pattern-processing circuit. | 1. A distributed pattern processor, comprising:
an input bus for transferring a first pattern; a semiconductor substrate having transistors thereon; a plurality of storage-processing units (SPU) including a first SPU, said first SPU comprising at least a three-dimensional memory (3D-M) array and a pattern-processing circuit, wherein said 3D-M array is stacked above said substrate, said 3D-M array storing a second pattern; said pattern-processing circuit is formed on said substrate, said pattern-processing circuit performing pattern matching or pattern recognition for said first and second patterns; said 3D-M array and said pattern-processing circuit are communicatively coupled by an inter-level connection comprising a plurality of contact vias. 2. The distributed pattern processor array according to claim 1, further comprising a second SPU formed side-by-side with said first SPU, wherein said first and second SPUs are both communicatively coupled with said input bus. 3. The distributed pattern processor array according to claim 2, further comprising an output bus, wherein said first and second SPUs are both communicatively coupled with said output bus. 4. The distributed pattern processor array according to claim 1, wherein said 3D-M is three-dimensional writable memory (3D-W). 5. The distributed pattern processor array according to claim 4, wherein said 3D-W is three-dimensional one-time-programmable memory (3D-OTP). 6. The distributed pattern processor array according to claim 4, wherein said 3D-W is three-dimensional multiple-time-programmable memory (3D-MTP). 7. The distributed pattern processor array according to claim 6, wherein said 3D-MTP is 3D-XPoint. 8. The distributed pattern processor array according to claim 1, wherein said 3D-M is three-dimensional printed memory (3D-P). 9. The distributed pattern processor array according to claim 8, wherein said 3D-P is three-dimensional mask-programmed read-only memory (3D-MPROM). 10. The distributed pattern processor array according to claim 1, wherein said 3D-M array at least partially covers said pattern-processing circuit. 11. The distributed pattern processor array according to claim 1, wherein said pattern-processing circuit is covered by at least a first 3D-M array and a second 3D-M array. 12. The distributed pattern processor array according to claim 11, further comprising a gap between said first 3D-M array and said second 3D-M array. 13. The distributed pattern processor array according to claim 12, further comprising a routing channel in said gap. 14. The distributed pattern processor array according to claim 1 being a big-data processor, wherein
said first pattern is a search pattern;
said second pattern is a target pattern; and
said 3D-M array stores at least a portion of big data 15. The distributed pattern processor array according to claim 1 being a anti-malware processor, wherein
said first pattern is a target pattern;
said second pattern is a search pattern; and
said 3D-M array stores at least a virus signature and/or a network rule. 16. The distributed pattern processor array according to claim 1 being a anti-malware processor, wherein
said first pattern is a search pattern;
said second pattern is a target pattern; and
said 3D-M array stores at least a portion of user data. 17. The distributed pattern processor array according to claim 1 being a voice-recognition processor, wherein
said first pattern is a target pattern;
said second pattern is a search pattern;
said 3D-M array stores at least an acoustic model and/or a language model. 18. The distributed pattern processor array according to claim 1 being a voice-recognition processor, wherein
said first pattern is a search pattern;
said second pattern is a target pattern;
said 3D-M array stores at least a portion of voice data. 19. The distributed pattern processor array according to claim 1 being an image-recognition processor, wherein
said first pattern is a target pattern;
said second pattern is a search pattern;
said 3D-M array stores at least a language model. 20. The distributed pattern processor array according to claim 1 being an image-recognition processor, wherein
said first pattern is a search pattern;
said second pattern is a target pattern;
said 3D-M array stores at least a portion of image data. | The present invention discloses a distributed pattern processor. The distributed pattern processor not only stores patterns permanently, but also processes them using massive parallelism. It comprises a plurality of storage-processing units (SPU), with each SPU comprising a pattern-processing circuit and at least a three-dimensional memory (3D-M) array storing at least a pattern. The 3D-M array is vertically stacked above the pattern-processing circuit.1. A distributed pattern processor, comprising:
an input bus for transferring a first pattern; a semiconductor substrate having transistors thereon; a plurality of storage-processing units (SPU) including a first SPU, said first SPU comprising at least a three-dimensional memory (3D-M) array and a pattern-processing circuit, wherein said 3D-M array is stacked above said substrate, said 3D-M array storing a second pattern; said pattern-processing circuit is formed on said substrate, said pattern-processing circuit performing pattern matching or pattern recognition for said first and second patterns; said 3D-M array and said pattern-processing circuit are communicatively coupled by an inter-level connection comprising a plurality of contact vias. 2. The distributed pattern processor array according to claim 1, further comprising a second SPU formed side-by-side with said first SPU, wherein said first and second SPUs are both communicatively coupled with said input bus. 3. The distributed pattern processor array according to claim 2, further comprising an output bus, wherein said first and second SPUs are both communicatively coupled with said output bus. 4. The distributed pattern processor array according to claim 1, wherein said 3D-M is three-dimensional writable memory (3D-W). 5. The distributed pattern processor array according to claim 4, wherein said 3D-W is three-dimensional one-time-programmable memory (3D-OTP). 6. The distributed pattern processor array according to claim 4, wherein said 3D-W is three-dimensional multiple-time-programmable memory (3D-MTP). 7. The distributed pattern processor array according to claim 6, wherein said 3D-MTP is 3D-XPoint. 8. The distributed pattern processor array according to claim 1, wherein said 3D-M is three-dimensional printed memory (3D-P). 9. The distributed pattern processor array according to claim 8, wherein said 3D-P is three-dimensional mask-programmed read-only memory (3D-MPROM). 10. The distributed pattern processor array according to claim 1, wherein said 3D-M array at least partially covers said pattern-processing circuit. 11. The distributed pattern processor array according to claim 1, wherein said pattern-processing circuit is covered by at least a first 3D-M array and a second 3D-M array. 12. The distributed pattern processor array according to claim 11, further comprising a gap between said first 3D-M array and said second 3D-M array. 13. The distributed pattern processor array according to claim 12, further comprising a routing channel in said gap. 14. The distributed pattern processor array according to claim 1 being a big-data processor, wherein
said first pattern is a search pattern;
said second pattern is a target pattern; and
said 3D-M array stores at least a portion of big data 15. The distributed pattern processor array according to claim 1 being a anti-malware processor, wherein
said first pattern is a target pattern;
said second pattern is a search pattern; and
said 3D-M array stores at least a virus signature and/or a network rule. 16. The distributed pattern processor array according to claim 1 being a anti-malware processor, wherein
said first pattern is a search pattern;
said second pattern is a target pattern; and
said 3D-M array stores at least a portion of user data. 17. The distributed pattern processor array according to claim 1 being a voice-recognition processor, wherein
said first pattern is a target pattern;
said second pattern is a search pattern;
said 3D-M array stores at least an acoustic model and/or a language model. 18. The distributed pattern processor array according to claim 1 being a voice-recognition processor, wherein
said first pattern is a search pattern;
said second pattern is a target pattern;
said 3D-M array stores at least a portion of voice data. 19. The distributed pattern processor array according to claim 1 being an image-recognition processor, wherein
said first pattern is a target pattern;
said second pattern is a search pattern;
said 3D-M array stores at least a language model. 20. The distributed pattern processor array according to claim 1 being an image-recognition processor, wherein
said first pattern is a search pattern;
said second pattern is a target pattern;
said 3D-M array stores at least a portion of image data. | 2,800 |
12,399 | 12,399 | 15,977,515 | 2,876 | A lost-and-found label for a lost and found system can include an adherent surface for attaching the label to an item, a viewing surface on an opposite side of the label from the adherent surface, a bar code registerable with the lost and found system printed on the viewing surface of the label, and a text message number printed adjacent the bar code on the viewing surface of the label. The text message number can be linked to a server configured to receive and interpret an image of the bar code to determine if the bar code is registered to an item registered within the lost and found system such that the bar code and the text message number combination allow a finder to send an image of the bar code to the server via text message to report a found item and to receive a response from the lost and found system. | 1. A lost-and-found label for a lost and found system, comprising:
an adherent surface for attaching the label to an item; a viewing surface on an opposite side of the label from the adherent surface; a bar code registerable with the lost and found system printed on the viewing surface of the label; and a text message number printed adjacent the bar code on the viewing surface of the label, the phone number linked to a server configured to receive and interpret an image of the bar code to determine if the bar code is registered to an item registered within the lost and found system such that the bar code and the text message number combination allow a finder to send an image of the bar code to the server via text message to report a found item and to receive a response from the lost and found system. 2. The label of claim 1, wherein the bar code is a QR code. 3. The label of claim 2, wherein the text message number is a phone number. 4. The label of claim 3, further comprising print that indicates a reward will be given for return of the lost item, the print being printed on the viewing surface. 5. The label of claim 4, wherein the print includes the term “REWARD.” 6. A computer-implemented method, comprising:
receiving a text message from a mobile device of a finder comprising an image of a lost-and-found label; reading a bar code in the image of the label; comparing the bar code to a database of registered items to determine if the bar code is registered to an item; if the bar code is registered to an item, determining the item to be a found item; and sending one or more response text messages to the mobile device that sent the image to execute a return and reward procedure. 7. The computer-implemented method of claim 8, wherein the one or more response text messages includes an image of a return shipping label. 8. The computer-implemented method of claim 8, wherein the one or more response text messages includes a link to an app or website associated with the lost and found system for additional information to be input. 9. The computer-implemented method of claim 8, further comprising receiving a finder's shipping address from the finder and causing shipment of a return box of a predetermined size configured to fit the found item therein and a shipping label to the finder's shipping address. 10. A server, comprising:
a memory; a processor disposed in communication with said memory, and configured to issue a plurality of instructions stored in the memory, wherein the instructions cause the processor to perform a method comprising:
receiving a text message from a mobile device of a finder comprising an image of a lost-and-found label;
reading a bar code in the image of the label;
comparing the bar code to a database of registered items to determine if the bar code is registered to an item;
if the bar code is registered to an item, determining the item to be a found item; and
sending one or more response text messages to the mobile device that sent the image to execute a return and reward procedure. | A lost-and-found label for a lost and found system can include an adherent surface for attaching the label to an item, a viewing surface on an opposite side of the label from the adherent surface, a bar code registerable with the lost and found system printed on the viewing surface of the label, and a text message number printed adjacent the bar code on the viewing surface of the label. The text message number can be linked to a server configured to receive and interpret an image of the bar code to determine if the bar code is registered to an item registered within the lost and found system such that the bar code and the text message number combination allow a finder to send an image of the bar code to the server via text message to report a found item and to receive a response from the lost and found system.1. A lost-and-found label for a lost and found system, comprising:
an adherent surface for attaching the label to an item; a viewing surface on an opposite side of the label from the adherent surface; a bar code registerable with the lost and found system printed on the viewing surface of the label; and a text message number printed adjacent the bar code on the viewing surface of the label, the phone number linked to a server configured to receive and interpret an image of the bar code to determine if the bar code is registered to an item registered within the lost and found system such that the bar code and the text message number combination allow a finder to send an image of the bar code to the server via text message to report a found item and to receive a response from the lost and found system. 2. The label of claim 1, wherein the bar code is a QR code. 3. The label of claim 2, wherein the text message number is a phone number. 4. The label of claim 3, further comprising print that indicates a reward will be given for return of the lost item, the print being printed on the viewing surface. 5. The label of claim 4, wherein the print includes the term “REWARD.” 6. A computer-implemented method, comprising:
receiving a text message from a mobile device of a finder comprising an image of a lost-and-found label; reading a bar code in the image of the label; comparing the bar code to a database of registered items to determine if the bar code is registered to an item; if the bar code is registered to an item, determining the item to be a found item; and sending one or more response text messages to the mobile device that sent the image to execute a return and reward procedure. 7. The computer-implemented method of claim 8, wherein the one or more response text messages includes an image of a return shipping label. 8. The computer-implemented method of claim 8, wherein the one or more response text messages includes a link to an app or website associated with the lost and found system for additional information to be input. 9. The computer-implemented method of claim 8, further comprising receiving a finder's shipping address from the finder and causing shipment of a return box of a predetermined size configured to fit the found item therein and a shipping label to the finder's shipping address. 10. A server, comprising:
a memory; a processor disposed in communication with said memory, and configured to issue a plurality of instructions stored in the memory, wherein the instructions cause the processor to perform a method comprising:
receiving a text message from a mobile device of a finder comprising an image of a lost-and-found label;
reading a bar code in the image of the label;
comparing the bar code to a database of registered items to determine if the bar code is registered to an item;
if the bar code is registered to an item, determining the item to be a found item; and
sending one or more response text messages to the mobile device that sent the image to execute a return and reward procedure. | 2,800 |
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