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wafer. I'd actually found the following information from EPFL on reworking
HMDS-treated wafers a little while ago when testing out our lab's HMDS
quality (don't know who over there figured this out, but thanks to whoever
did!)
https://www.epfl.ch/research/facilities/cmi/process/photolithography/hmds-ap
plication/
Either way, the O2 plasma during the cleaning process should be worth a
shot!
--
Ana N. Cohen [she/her/hers]
Photolithography Cleanroom Technician
Contractor | General Technical Services, LLC
US Army Research Laboratory
2800 Powder Mill Road, Adelphi, MD 20783
Tel: 301-394-1527
Email: ana.n.cohen.ctr at army.mil
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From michael.martin at louisville.edu Wed Mar 29 10:35:25 2023
From: michael.martin at louisville.edu (Martin, Michael)
Date: Wed, 29 Mar 2023 14:35:25 +0000
Subject: [labnetwork] Strange "sample memory" with LOR 5B
In-Reply-To: <BN8P111MB1447A051B118966F6CEA4ED99F889@BN8P111MB1447.NAMP111.PROD.OUTLOOK.COM>
References: <BN8P111MB1447A051B118966F6CEA4ED99F889@BN8P111MB1447.NAMP111.PROD.OUTLOOK.COM>
Message-ID: <BN9PR03MB61700AA90E0720FC2FDDACC0F2899@BN9PR03MB6170.namprd03.prod.outlook.com>
We actually made a TikTok about this subject recently that went somewhat viral. Despite the off-color humor it seems relevant to the discussion https://www.tiktok.com/@micronanolouisville/video/7214338192995061034 These wafers were cleaned in a 60C NMP bath and it was clear that the HMDS was still on the surface.
________________________________
From: labnetwork <labnetwork-bounces at mtl.mit.edu> on behalf of Cohen, Ana N CTR USARMY DEVCOM ARL (USA) <ana.n.cohen.ctr at army.mil>
Sent: Tuesday, March 28, 2023 6:40 PM
To: labnetwork at mtl.mit.edu <labnetwork at mtl.mit.edu>; Gustavo de Oliveira Luiz <deolivei at ualberta.ca>
Subject: Re: [labnetwork] Strange "sample memory" with LOR 5B
CAUTION: This email originated from outside of our organization. Do not click links, open attachments, or respond unless you recognize the sender's email address and know the contents are safe.
Michael got me thinking... Gustavo, could you confirm the DI water rinse
after the piranha looks as you'd expect? I'm not 100% certain the chemistry,
but since HMDS is more a surface treatment than a residue remaining on the
wafer I'm curious if it actually could be unaffected.
I have definitely seen this 'ghosting' after I solvent strip a patterned
wafer and then need to rinse with DI water. Any water collected on the wafer
surface would match wherever resist had previously been, presumably due to
remaining HMDS. I've not seen it impact further patterning before, but I've
also not used the LOR in my tests and may also have run less tests per
wafer. I'd actually found the following information from EPFL on reworking
HMDS-treated wafers a little while ago when testing out our lab's HMDS
quality (don't know who over there figured this out, but thanks to whoever
did!)
https://nam11.safelinks.protection.outlook.com/?url=https%3A%2F%2Fwww.epfl.ch%2Fresearch%2Ffacilities%2Fcmi%2Fprocess%2Fphotolithography%2Fhmds-ap&data=05%7C01%7Cmichael.martin%40louisville.EDU%7C1eb5be3d74d4448b451008db301b632d%7Cdd246e4a54344e158ae391ad9797b209%7C0%7C0%7C638156666427001449%7CUnknown%7CTWFpbGZsb3d8eyJWIjoiMC4wLjAwMDAiLCJQIjoiV2luMzIiLCJBTiI6Ik1haWwiLCJXVCI6Mn0%3D%7C3000%7C%7C%7C&sdata=eTd2IROmftQa49qtYImK3w7CZVOBRwfw2tr9ncJOn%2BI%3D&reserved=0
plication/
Either way, the O2 plasma during the cleaning process should be worth a
shot!
--
Ana N. Cohen [she/her/hers]
Photolithography Cleanroom Technician
Contractor | General Technical Services, LLC
US Army Research Laboratory
2800 Powder Mill Road, Adelphi, MD 20783
Tel: 301-394-1527
Email: ana.n.cohen.ctr at army.mil
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From edward.gonzales at armonicatech.com Thu Mar 30 16:38:34 2023
From: edward.gonzales at armonicatech.com (edward.gonzales)
Date: Thu, 30 Mar 2023 14:38:34 -0600 (MDT)
Subject: [labnetwork] Anodic Bonding
Message-ID: <627376754.216534.1680208714984@webmail2b.networksolutionsemail.com>
Does anyone have experience with anodic bonding? I have successful bonds with various thickness of SiO2 on Si, 300nm to 1um. The problem is the fluorescence seen duing Raman Spectroscopy. Would anyone know what may cause this?
Thanks,
Edward
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From swagone at gmu.edu Wed Feb 1 07:22:52 2023
From: swagone at gmu.edu (Shawn Wagoner)
Date: Wed, 1 Feb 2023 12:22:52 +0000
Subject: [labnetwork] Question about DC sputtering of zinc
In-Reply-To: <SA2PR11MB4873AB280451150B96DCC1FA88D39@SA2PR11MB4873.namprd11.prod.outlook.com>
References: <SA2PR11MB4873AB280451150B96DCC1FA88D39@SA2PR11MB4873.namprd11.prod.outlook.com>
Message-ID: <BYAPR05MB4647FB0B4EAA7BD09940AFB1B9D19@BYAPR05MB4647.namprd05.prod.outlook.com>
I would not allow Zinc in any system I ran at Binghamton University. I would not even allow it in the cleanroom. It represents a significant contamination risk for shared use facilities. If I were fortunate enough to have two systems, one clean and one "dirty", I might consider it in the dirty system. Its vapor pressure is so high I am not sure there is much you can do to cover it up with Ti.
Shawn
From: labnetwork <labnetwork-bounces at mtl.mit.edu> On Behalf Of Malhotra, Sandra Guy
Sent: Monday, January 30, 2023 4:40 PM
To: Fab Network <labnetwork at mtl.mit.edu>
Subject: [labnetwork] Question about DC sputtering of zinc
Howdy All from AggieFab,
We have a user who requested permission to sputter zinc in our shared Lesker PVD75 DC sputtering tool. On the Lesker website, there is the following note:
"This material has a relatively high vapor pressure at low temperatures which can cause ppm level contamination in the chamber and subsequent films. Careful consideration should be taken before this material is used in any deposition system. For this reason, some users prefer to use only dedicated vacuum chambers for deposition."
I'd like to ask the group if they allow zinc depositions in their shared tools if they follow it by a thorough paste with another material, like Ti? Or if this material is prohibited because it is problematic.
Thanks in advance for any inputs you may have.
Best,
Sandra G. Malhotra, Ph.D. | Technical Lab Manager
AggieFab Nanofabrication Facility
https://aggiefab.tamu.edu/<https://nam11.safelinks.protection.outlook.com/?url=https%3A%2F%2Faggiefab.tamu.edu%2F&data=05%7C01%7Cswagone%40gmu.edu%7C701883f7c7244957be4108db03237a96%7C9e857255df574c47a0c00546460380cb%7C0%7C0%7C638107223189605602%7CUnknown%7CTWFpbGZsb3d8eyJWIjoiMC4wLjAwMDAiLCJQIjoiV2luMzIiLCJBTiI6Ik1haWwiLCJXVCI6Mn0%3D%7C2000%7C%7C%7C&sdata=Qvwl9IyHCzbpDHi%2BTs1FZrY65j79ftUQV83kJBELqLg%3D&reserved=0>
Department of Electrical & Computer Engineering, College of Engineering | Texas A&M University