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I would not allow Zinc in any system I ran at Binghamton University. I would not even allow it in the cleanroom. It represents a significant contamination risk for shared use facilities. If I were fortunate enough to have two systems, one clean and one "dirty", I might consider it in the dirty system. Its vapor pressure is so high I am not sure there is much you can do to cover it up with Ti. |
Shawn |
From: labnetwork <labnetwork-bounces at mtl.mit.edu<mailto:labnetwork-bounces at mtl.mit.edu>> On Behalf Of Malhotra, Sandra Guy |
Sent: Monday, January 30, 2023 4:40 PM |
To: Fab Network <labnetwork at mtl.mit.edu<mailto:labnetwork at mtl.mit.edu>> |
Subject: [labnetwork] Question about DC sputtering of zinc |
Howdy All from AggieFab, |
We have a user who requested permission to sputter zinc in our shared Lesker PVD75 DC sputtering tool. On the Lesker website, there is the following note: |
"This material has a relatively high vapor pressure at low temperatures which can cause ppm level contamination in the chamber and subsequent films. Careful consideration should be taken before this material is used in any deposition system. For this reason, some users prefer to use only dedicated vacuum chambers for deposition." |
I'd like to ask the group if they allow zinc depositions in their shared tools if they follow it by a thorough paste with another material, like Ti? Or if this material is prohibited because it is problematic. |
Thanks in advance for any inputs you may have. |
Best, |
Sandra G. Malhotra, Ph.D. | Technical Lab Manager |
AggieFab Nanofabrication Facility |
https://aggiefab.tamu.edu/<https://eur03.safelinks.protection.outlook.com/?url=https%3A%2F%2Faggiefab.tamu.edu%2F&data=05%7C01%7Codc1n08%40soton.ac.uk%7Cf768842984b24838cb2d08db0450d4e6%7C4a5378f929f44d3ebe89669d03ada9d8%7C0%7C0%7C638108517696830366%7CUnknown%7CTWFpbGZsb3d8eyJWIjoiMC4wLjAwMDAiLCJQIjoiV2luMzIiLCJBTiI6Ik1haWwiLCJXVCI6Mn0%3D%7C2000%7C%7C%7C&sdata=F%2FIJW1EiWWibsTx7iwdmFJBSYGo4%2F%2BlSkC8u%2F6dtk6I%3D&reserved=0> |
Department of Electrical & Computer Engineering, College of Engineering | Texas A&M University |
3253 TAMU | College Station, TX 77843 |
ph: 979.845.3199 | sandra.malhotra at tamu.edu<mailto:sandra.malhotra at tamu.edu> |
- - - - - - - - - - - - - - - - - - - - - - - - |
TEXAS A&M UNIVERSITY | FEARLESS on Every Front |
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From price.798 at osu.edu Wed Feb 1 12:36:57 2023 |
From: price.798 at osu.edu (Price, Aimee) |
Date: Wed, 1 Feb 2023 17:36:57 +0000 |
Subject: [labnetwork] Signatures with affiliation |
Message-ID: <CH0PR01MB71390E29141F6970901B2671BCD19@CH0PR01MB7139.prod.exchangelabs.com> |
Hi Labnetwork administrators, |
Would it be possible to kindly ask those who post and who respond to include their affiliation in a signature block? It would be very helpful and instructive to know where and what type of institution was responding as that often matters, I.e. industry and academia are different, different regions have different needs, etc. You can't always tell the from tne email address or name alone. |
Thank you, |
Aimee |
Aimee Bross Price |
Manager, Nanofabrication |
Nanotech West Lab |
The Ohio State University |
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From C.Heidelberger at ll.mit.edu Wed Feb 1 12:59:57 2023 |
From: C.Heidelberger at ll.mit.edu (Heidelberger, Christopher - 0889 - MITLL) |
Date: Wed, 1 Feb 2023 17:59:57 +0000 |
Subject: [labnetwork] Contract SiO2 Deposition on 300 mm Wafers |
Message-ID: <SA1P110MB097371B798BEAF4E40433215BFD19@SA1P110MB0973.NAMP110.PROD.OUTLOOK.COM> |
Hello, |
Does anyone know of a business or other entity that does contract deposition |
of SiO2 films on 300 mm wafers? I would like to have 50 nm SiO2 deposited by |
PECVD on just two 300 mm Si wafers. It would need to be in a Au-free system. |
Best, |
Chris |
- |
Christopher Heidelberger, PhD |
Technical Staff, Quantum Information and Integrated Nanosystems Group |
MIT Lincoln Laboratory, 244 Wood Street, Lexington, MA 02421-6246 |
Phone: 781-981-9052 | Email: c.heidelberger at ll.mit.edu |
<mailto:c.heidelberger at ll.mit.edu> | he/him |
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From lvchang at Central.UH.EDU Wed Feb 1 14:02:00 2023 |
From: lvchang at Central.UH.EDU (Chang, Long) |
Date: Wed, 1 Feb 2023 19:02:00 +0000 |
Subject: [labnetwork] Question about DC sputtering of zinc |
In-Reply-To: <BY3PR05MB8260F11BE403C1BDEE451009CED19@BY3PR05MB8260.namprd05.prod.outlook.com> |
References: <SA2PR11MB4873AB280451150B96DCC1FA88D39@SA2PR11MB4873.namprd11.prod.outlook.com> |
<BYAPR05MB4647FB0B4EAA7BD09940AFB1B9D19@BYAPR05MB4647.namprd05.prod.outlook.com> |
<BY3PR05MB8260F11BE403C1BDEE451009CED19@BY3PR05MB8260.namprd05.prod.outlook.com> |
Message-ID: <8F0F4660-12C7-497E-AF80-8853B535CB87@central.uh.edu> |
Hi All, |
Does anyone have a list of banned materials for sputtering they can share? I made a list over the years through discussions on labnetwork whenever a new material gets requested, see attached photo. It?ll be nice to have a publicly searchable database, similar to this google sheet (https://docs.google.com/spreadsheets/d/1z0iyCsDUTpi6nkhtIxSp_rSMKGF4jeiqGbVRfnF5CRk). |
Thanks, |
Long |
[cid:DDECC2FB-B7D7-4A97-BBFD-B712E4A2427F] |
On Feb 1, 2023, at 9:20 AM, Michael Yakimov <yakimom at sunypoly.edu<mailto:yakimom at sunypoly.edu>> wrote: |
I would also ask if process goal can be achieved with zinc compound, like ZnO. |
Thanks |
Mike |
________________________________ |
From: labnetwork <labnetwork-bounces at mtl.mit.edu<mailto:labnetwork-bounces at mtl.mit.edu>> on behalf of Shawn Wagoner <swagone at gmu.edu<mailto:swagone at gmu.edu>> |
Sent: Wednesday, February 1, 2023 7:22 AM |
To: Malhotra, Sandra Guy <sandra.malhotra at tamu.edu<mailto:sandra.malhotra at tamu.edu>>; Fab Network <labnetwork at mtl.mit.edu<mailto:labnetwork at mtl.mit.edu>> |
Subject: Re: [labnetwork] Question about DC sputtering of zinc |
I would not allow Zinc in any system I ran at Binghamton University. I would not even allow it in the cleanroom. It represents a significant contamination risk for shared use facilities. If I were fortunate enough to have two systems, one clean and one ?dirty?, I might consider it in the dirty system. Its vapor pressure is so high I am not sure there is much you can do to cover it up with Ti. |
Shawn |
From: labnetwork <labnetwork-bounces at mtl.mit.edu<mailto:labnetwork-bounces at mtl.mit.edu>> On Behalf Of Malhotra, Sandra Guy |
Sent: Monday, January 30, 2023 4:40 PM |
To: Fab Network <labnetwork at mtl.mit.edu<mailto:labnetwork at mtl.mit.edu>> |
Subject: [labnetwork] Question about DC sputtering of zinc |
Howdy All from AggieFab, |
We have a user who requested permission to sputter zinc in our shared Lesker PVD75 DC sputtering tool. On the Lesker website, there is the following note: |
"This material has a relatively high vapor pressure at low temperatures which can cause ppm level contamination in the chamber and subsequent films. Careful consideration should be taken before this material is used in any deposition system. For this reason, some users prefer to use only dedicated vacuum chambers for deposition." |
I'd like to ask the group if they allow zinc depositions in their shared tools if they follow it by a thorough paste with another material, like Ti? Or if this material is prohibited because it is problematic. |
Thanks in advance for any inputs you may have. |
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