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> cell 479-236-6049
> Fax 479-575-5500
> www.hidec.uark.edu/?section=people&content=person&person=scoggin
>
>
>
> Greetings,
>
> Available for sale is the attached and below described Quintel 7000
> mask aligner. The system is currently tooled for 100mm and 75mm round
> wafers, can be tooled up to 200mm wafers. The system is complete and
> in working condition. Also available is a SVG 8800 dual track
> coater/developer also complete working condition. Tools are located
> here in Fayetteville, Arkansas and available for inspection with notice.
>
> Regards,
>
>
> Steve W. Scoggin
> Phone-479-236-6049
>
>
>
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>
>
>
>
>
> QUINTEL 7000 AL Autoloader Mask Aligner, complete, operational>
> Wafer sizes from pieces 8" diameter or substrates up to 6'x6'>
> Currently tooled for 4' with 5x5 Mask Holder (Optional 3' with 4x4
> Mask> Plate)> Fully motorized X-Y-Theta alignment stage> Manual Tray
> load for substrateloading/unloading> CCTV Splitfield microscope with
> zoom> Has Optional Magna View (optical) splitfield / singlefield
> microscope with> Magna View CCTV for Microscope> Simple Topside Mask
> loading> UltraSense constant intensity UV power Supply> System set @
> 200Watt can be set to 350 Watt> UV Collimation lens for
> improvedprinting resolution> Shock Isolation Table included as
> Standard> > Options:> Robotic auto load handling> Pulsed exposure
> timer sequencing> > Performance:> Print Modes: Soft, Pressure, Vacuum
> contact> Print Resolution: =<1.0microns> Alignment Stage:> Alignment
> Travel X-Y: Motorized with automatic re-centering> Alignment Travel
> Theta: Motorized with automatic re-centering> StageScan: +/- 19mm> X-Y
> Movement: +/-4mm> Theta RotationRange: +/-7 degrees> Mask / Wafer
> Separation: 0 - 300 microns> MaskSize: 2.5X2.5'up to 9x9 (optional
> mask plates required)> Topside Alignment Overlay: <0.5 microns>
> Bottomside Alignment Overlay: >2microns> Operator/process dependant> >
> UV LampHouse / UV Optics:> Lamphouse: 200/350 W (setup for 200)>
> ExposureOptics: UV (350-450 nm) standard> UV Uniformity: +/- 4% 150mm
> dia. / +/- 5% 200 mm dia.> > System Requirements:> Voltage: 240VAC
> 50Hz> Compressed Air: 6.2-7.6 bar (90-110PSI)> Vacuum: -0.7 bar (21'
> Hg)> Nitrogen or CDA: 4.2 bar (60 PSI)> > System WxDxH:
> 1194x838x1194mm (47'x33'x47')> Weight: 340kg (750lb)> Operational when
> de-installed> 1999 vintage.
>
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> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork
From codreanu at seas.upenn.edu Wed Sep 15 08:52:35 2010
From: codreanu at seas.upenn.edu (Iulian Codreanu)
Date: Wed, 15 Sep 2010 08:52:35 -0400
Subject: [labnetwork] foreline and exhaust line maintenance
Message-ID: <4C90C193.40609@seas.upenn.edu>
Good Morning.
I understand that the foreline and pump exhaust line on tools using
particular precursors (e.g. silane) need to be made of short (4-5 ft)
sections so that they can be immersed in a liquid bath to neutralize the
exhaust byproducts that accumulate over time.
If you do something similar in your fab could you please share your
experience with us?
Thank you very much.
Iulian
--
iulian Codreanu, Ph.D.
Director, Penn NanoFab
200 South 33rd Street
Room 305 Moore Bldg
Philadelphia, PA 19104-6314
P: 215-898-9308
F: 215-573-2068
www.seas.upenn.edu/~nanofab
From bob at eecs.berkeley.edu Wed Sep 15 12:19:42 2010
From: bob at eecs.berkeley.edu (Bob Hamilton)
Date: Wed, 15 Sep 2010 09:19:42 -0700
Subject: [labnetwork] foreline and exhaust line maintenance
In-Reply-To: <4C90C193.40609@seas.upenn.edu>