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> cell 479-236-6049 |
> Fax 479-575-5500 |
> www.hidec.uark.edu/?section=people&content=person&person=scoggin |
> |
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> |
> Greetings, |
> |
> Available for sale is the attached and below described Quintel 7000 |
> mask aligner. The system is currently tooled for 100mm and 75mm round |
> wafers, can be tooled up to 200mm wafers. The system is complete and |
> in working condition. Also available is a SVG 8800 dual track |
> coater/developer also complete working condition. Tools are located |
> here in Fayetteville, Arkansas and available for inspection with notice. |
> |
> Regards, |
> |
> |
> Steve W. Scoggin |
> Phone-479-236-6049 |
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> QUINTEL 7000 AL Autoloader Mask Aligner, complete, operational> |
> Wafer sizes from pieces 8" diameter or substrates up to 6'x6'> |
> Currently tooled for 4' with 5x5 Mask Holder (Optional 3' with 4x4 |
> Mask> Plate)> Fully motorized X-Y-Theta alignment stage> Manual Tray |
> load for substrateloading/unloading> CCTV Splitfield microscope with |
> zoom> Has Optional Magna View (optical) splitfield / singlefield |
> microscope with> Magna View CCTV for Microscope> Simple Topside Mask |
> loading> UltraSense constant intensity UV power Supply> System set @ |
> 200Watt can be set to 350 Watt> UV Collimation lens for |
> improvedprinting resolution> Shock Isolation Table included as |
> Standard> > Options:> Robotic auto load handling> Pulsed exposure |
> timer sequencing> > Performance:> Print Modes: Soft, Pressure, Vacuum |
> contact> Print Resolution: =<1.0microns> Alignment Stage:> Alignment |
> Travel X-Y: Motorized with automatic re-centering> Alignment Travel |
> Theta: Motorized with automatic re-centering> StageScan: +/- 19mm> X-Y |
> Movement: +/-4mm> Theta RotationRange: +/-7 degrees> Mask / Wafer |
> Separation: 0 - 300 microns> MaskSize: 2.5X2.5'up to 9x9 (optional |
> mask plates required)> Topside Alignment Overlay: <0.5 microns> |
> Bottomside Alignment Overlay: >2microns> Operator/process dependant> > |
> UV LampHouse / UV Optics:> Lamphouse: 200/350 W (setup for 200)> |
> ExposureOptics: UV (350-450 nm) standard> UV Uniformity: +/- 4% 150mm |
> dia. / +/- 5% 200 mm dia.> > System Requirements:> Voltage: 240VAC |
> 50Hz> Compressed Air: 6.2-7.6 bar (90-110PSI)> Vacuum: -0.7 bar (21' |
> Hg)> Nitrogen or CDA: 4.2 bar (60 PSI)> > System WxDxH: |
> 1194x838x1194mm (47'x33'x47')> Weight: 340kg (750lb)> Operational when |
> de-installed> 1999 vintage. |
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> _______________________________________________ |
> labnetwork mailing list |
> labnetwork at mtl.mit.edu |
> https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork |
From codreanu at seas.upenn.edu Wed Sep 15 08:52:35 2010 |
From: codreanu at seas.upenn.edu (Iulian Codreanu) |
Date: Wed, 15 Sep 2010 08:52:35 -0400 |
Subject: [labnetwork] foreline and exhaust line maintenance |
Message-ID: <4C90C193.40609@seas.upenn.edu> |
Good Morning. |
I understand that the foreline and pump exhaust line on tools using |
particular precursors (e.g. silane) need to be made of short (4-5 ft) |
sections so that they can be immersed in a liquid bath to neutralize the |
exhaust byproducts that accumulate over time. |
If you do something similar in your fab could you please share your |
experience with us? |
Thank you very much. |
Iulian |
-- |
iulian Codreanu, Ph.D. |
Director, Penn NanoFab |
200 South 33rd Street |
Room 305 Moore Bldg |
Philadelphia, PA 19104-6314 |
P: 215-898-9308 |
F: 215-573-2068 |
www.seas.upenn.edu/~nanofab |
From bob at eecs.berkeley.edu Wed Sep 15 12:19:42 2010 |
From: bob at eecs.berkeley.edu (Bob Hamilton) |
Date: Wed, 15 Sep 2010 09:19:42 -0700 |
Subject: [labnetwork] foreline and exhaust line maintenance |
In-Reply-To: <4C90C193.40609@seas.upenn.edu> |
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