srobertsphd/mit-labnetwork · Datasets at Hugging Face

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of the facilities and workforce training programs
- Work closely with faculty, students, and staff at partner universities to
meet the needs and goals set by the VAST leadership team
Potential candidates need to pay particular attention to the primary
location of the opportunity when applying for this position.
Primary Location:
Virginia Tech Node in Blacksburg, VA (Job No: 526285)
Virginia Commonwealth University in Richmond, VA (Job No: 562286)
Norfolk State University Node in Norfolk, VA (Job No: 562287)
University of Virginia Node in Charlottesville (Job No: 526288)
Careers at Virginia Tech
<https://careers.pageuppeople.com/968/cw/en-us/listing/>
careers.pageuppeople.com ? 2 min read
<https://careers.pageuppeople.com/968/cw/en-us/listing/>
Masoud Agah
Founding Director, Virginia Alliance for Semiconductor Technology (VAST)
Virginia Microelectronics Consortium (VMEC) Professor of Engineering
> The Bradley Dept. of Electrical and Computer Engineering
> Mechanical Engineering Department (Affiliate)
> Faculty Senate and University Council Member
Virginia Tech
Voice: (540) 231-2653
VT MEMS Lab <http://www.agah-lab.org>
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From nzxie at uw.edu Fri Jul 14 19:08:20 2023
From: nzxie at uw.edu (Ningzhi Xie)
Date: Fri, 14 Jul 2023 16:08:20 -0700
Subject: [labnetwork] Dicing sapphire wafer
Message-ID: <CACHUCwJfbFp2ZJyZY8THMkeNuUff-FY-4fxgLNHzcYjm5S3+BQ@mail.gmail.com>
Dear College,
I am using the DISCO DAD 321 Wafer Dicing Saw and VT07 SD400 blade to dice
a 460?m sapphire (Al2O3) wafer. It seems the wafer is too hard that I get
into trouble of frequently breaking the dicing blade. I have tried lowing
the spin speed to 12000rpm, the cutting speed to 1mm/s, and only cut into
half of the wafer (230?m) but still got the blade broken. I am wondering if
you have any good suggestions on sapphire wafer dicing.
Thank you very much.
Best regards,
Ningzhi Xie
Department of Electrical and Computer Engineering
University of Washington
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From jdeng at cns.fas.harvard.edu Fri Jul 14 21:05:58 2023
From: jdeng at cns.fas.harvard.edu (Deng, Jiangdong)
Date: Sat, 15 Jul 2023 01:05:58 +0000
Subject: [labnetwork] Dicing sapphire wafer
In-Reply-To: <CACHUCwJfbFp2ZJyZY8THMkeNuUff-FY-4fxgLNHzcYjm5S3+BQ@mail.gmail.com>
References: <CACHUCwJfbFp2ZJyZY8THMkeNuUff-FY-4fxgLNHzcYjm5S3+BQ@mail.gmail.com>
Message-ID: <2EF2CE86-A2E7-4D73-9EFB-87B8B2DE66E2@cns.fas.harvard.edu>
1mm/s is too fast for sapphire. Typically we use 0.1 or 0.2 mm/s and 20k RPM. Blade thickness should be 0.3 mm ( no thinner than 0.2 mm). Please also check the disco service, and they usually will give you very good suggestions.
-JD @ CNS of Harvard
Sent from my iPhone
> On Jul 14, 2023, at 7:55 PM, Ningzhi Xie <nzxie at uw.edu> wrote:
>
> ?
> Dear College,
>
> I am using the DISCO DAD 321 Wafer Dicing Saw and VT07 SD400 blade to dice a 460?m sapphire (Al2O3) wafer. It seems the wafer is too hard that I get into trouble of frequently breaking the dicing blade. I have tried lowing the spin speed to 12000rpm, the cutting speed to 1mm/s, and only cut into half of the wafer (230?m) but still got the blade broken. I am wondering if you have any good suggestions on sapphire wafer dicing.
>
> Thank you very much.
>
> Best regards,
> Ningzhi Xie
> Department of Electrical and Computer Engineering
> University of Washington
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork
From demis at ucsb.edu Fri Jul 14 21:50:45 2023
From: demis at ucsb.edu (Demis D. John)
Date: Fri, 14 Jul 2023 18:50:45 -0700
Subject: [labnetwork] Dicing sapphire wafer
In-Reply-To: <CACHUCwJfbFp2ZJyZY8THMkeNuUff-FY-4fxgLNHzcYjm5S3+BQ@mail.gmail.com>
References: <CACHUCwJfbFp2ZJyZY8THMkeNuUff-FY-4fxgLNHzcYjm5S3+BQ@mail.gmail.com>
Message-ID: <CAKrtPjoSPCGnJ+nb1x4sWWPHVTZ0X-csp1jgpp=mO-KqUO0MZQ@mail.gmail.com>
We commonly have that issue with thick (?400?m) sapphire.
Even with good water jet cooling (critical to check that alignment), large
grit blades (or the vitreous blades you're using), and slow cut speeds -
the blades still break every ~8-15 cuts (we got this many cuts per blade
with various experimentation).
Disco did say those vitreous blades are supposed to last longer than
resnoid, but we didn't have enough demo blades to really test it out
efficiently, and didn't yet find parameters where they are outlasting our
resnoid blades.
A common solution include half-cutting the wafer (going only halfway into
the wafer), then full-cutting the wafer on a separate pass. We still have
to set the program to check the blade every 1-2 cuts, as it wears and
breaks eventually, and it takes a very long time to complete the wafer in
this way, so we just do full-cutting and change blades when it wears down
too much (via automatic checking on our ADT) - it was actually faster this
way for us, but I guess it potentially consumes the resnoid blades faster.
-- Demis (contact info <https://wiki.nanotech.ucsb.edu/wiki/Demis_D._John>)
Reminder: The NanoFab has a publications policy
<https://wiki.nanotech.ucsb.edu/wiki/Frequently_Asked_Questions#Publications_acknowledging_the_Nanofab>
On Fri, Jul 14, 2023 at 4:57?PM Ningzhi Xie <nzxie at uw.edu> wrote:

of the facilities and workforce training programs

- Work closely with faculty, students, and staff at partner universities to

meet the needs and goals set by the VAST leadership team

Potential candidates need to pay particular attention to the primary

location of the opportunity when applying for this position.

Primary Location:

Virginia Tech Node in Blacksburg, VA (Job No: 526285)

Virginia Commonwealth University in Richmond, VA (Job No: 562286)

Norfolk State University Node in Norfolk, VA (Job No: 562287)

University of Virginia Node in Charlottesville (Job No: 526288)

Careers at Virginia Tech

<https://careers.pageuppeople.com/968/cw/en-us/listing/>

careers.pageuppeople.com ? 2 min read

<https://careers.pageuppeople.com/968/cw/en-us/listing/>

Masoud Agah

Founding Director, Virginia Alliance for Semiconductor Technology (VAST)

Virginia Microelectronics Consortium (VMEC) Professor of Engineering

> The Bradley Dept. of Electrical and Computer Engineering

> Mechanical Engineering Department (Affiliate)

> Faculty Senate and University Council Member

Virginia Tech

Voice: (540) 231-2653

VT MEMS Lab <http://www.agah-lab.org>

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From nzxie at uw.edu Fri Jul 14 19:08:20 2023

From: nzxie at uw.edu (Ningzhi Xie)

Date: Fri, 14 Jul 2023 16:08:20 -0700

Subject: [labnetwork] Dicing sapphire wafer

Message-ID: <CACHUCwJfbFp2ZJyZY8THMkeNuUff-FY-4fxgLNHzcYjm5S3+BQ@mail.gmail.com>

Dear College,

I am using the DISCO DAD 321 Wafer Dicing Saw and VT07 SD400 blade to dice

a 460?m sapphire (Al2O3) wafer. It seems the wafer is too hard that I get

into trouble of frequently breaking the dicing blade. I have tried lowing

the spin speed to 12000rpm, the cutting speed to 1mm/s, and only cut into

half of the wafer (230?m) but still got the blade broken. I am wondering if

you have any good suggestions on sapphire wafer dicing.

Thank you very much.

Best regards,

Ningzhi Xie

Department of Electrical and Computer Engineering

University of Washington

-------------- next part --------------

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From jdeng at cns.fas.harvard.edu Fri Jul 14 21:05:58 2023

From: jdeng at cns.fas.harvard.edu (Deng, Jiangdong)

Date: Sat, 15 Jul 2023 01:05:58 +0000

Subject: [labnetwork] Dicing sapphire wafer

In-Reply-To: <CACHUCwJfbFp2ZJyZY8THMkeNuUff-FY-4fxgLNHzcYjm5S3+BQ@mail.gmail.com>

References: <CACHUCwJfbFp2ZJyZY8THMkeNuUff-FY-4fxgLNHzcYjm5S3+BQ@mail.gmail.com>

Message-ID: <2EF2CE86-A2E7-4D73-9EFB-87B8B2DE66E2@cns.fas.harvard.edu>

1mm/s is too fast for sapphire. Typically we use 0.1 or 0.2 mm/s and 20k RPM. Blade thickness should be 0.3 mm ( no thinner than 0.2 mm). Please also check the disco service, and they usually will give you very good suggestions.

-JD @ CNS of Harvard

Sent from my iPhone

> On Jul 14, 2023, at 7:55 PM, Ningzhi Xie <nzxie at uw.edu> wrote:

>

> ?

> Dear College,

>

> I am using the DISCO DAD 321 Wafer Dicing Saw and VT07 SD400 blade to dice a 460?m sapphire (Al2O3) wafer. It seems the wafer is too hard that I get into trouble of frequently breaking the dicing blade. I have tried lowing the spin speed to 12000rpm, the cutting speed to 1mm/s, and only cut into half of the wafer (230?m) but still got the blade broken. I am wondering if you have any good suggestions on sapphire wafer dicing.

>

> Thank you very much.

>

> Best regards,

> Ningzhi Xie

> Department of Electrical and Computer Engineering

> University of Washington

> _______________________________________________

> labnetwork mailing list

> labnetwork at mtl.mit.edu

> https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork

From demis at ucsb.edu Fri Jul 14 21:50:45 2023

From: demis at ucsb.edu (Demis D. John)

Date: Fri, 14 Jul 2023 18:50:45 -0700

Subject: [labnetwork] Dicing sapphire wafer

In-Reply-To: <CACHUCwJfbFp2ZJyZY8THMkeNuUff-FY-4fxgLNHzcYjm5S3+BQ@mail.gmail.com>

References: <CACHUCwJfbFp2ZJyZY8THMkeNuUff-FY-4fxgLNHzcYjm5S3+BQ@mail.gmail.com>

Message-ID: <CAKrtPjoSPCGnJ+nb1x4sWWPHVTZ0X-csp1jgpp=mO-KqUO0MZQ@mail.gmail.com>

We commonly have that issue with thick (?400?m) sapphire.

Even with good water jet cooling (critical to check that alignment), large

grit blades (or the vitreous blades you're using), and slow cut speeds -

the blades still break every ~8-15 cuts (we got this many cuts per blade

with various experimentation).

Disco did say those vitreous blades are supposed to last longer than

resnoid, but we didn't have enough demo blades to really test it out

efficiently, and didn't yet find parameters where they are outlasting our

resnoid blades.

A common solution include half-cutting the wafer (going only halfway into

the wafer), then full-cutting the wafer on a separate pass. We still have

to set the program to check the blade every 1-2 cuts, as it wears and

breaks eventually, and it takes a *very* long time to complete the wafer in

this way, so we just do full-cutting and change blades when it wears down

too much (via automatic checking on our ADT) - it was actually faster this

way for us, but I guess it potentially consumes the resnoid blades faster.

-- Demis (contact info <https://wiki.nanotech.ucsb.edu/wiki/Demis_D._John>)

*Reminder*: The NanoFab has a publications policy

<https://wiki.nanotech.ucsb.edu/wiki/Frequently_Asked_Questions#Publications_acknowledging_the_Nanofab>

On Fri, Jul 14, 2023 at 4:57?PM Ningzhi Xie <nzxie at uw.edu> wrote: