srobertsphd/mit-labnetwork · Datasets at Hugging Face

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> Dear College,
>
> I am using the DISCO DAD 321 Wafer Dicing Saw and VT07 SD400 blade to dice
> a 460?m sapphire (Al2O3) wafer. It seems the wafer is too hard that I get
> into trouble of frequently breaking the dicing blade. I have tried lowing
> the spin speed to 12000rpm, the cutting speed to 1mm/s, and only cut into
> half of the wafer (230?m) but still got the blade broken. I am wondering if
> you have any good suggestions on sapphire wafer dicing.
>
> Thank you very much.
>
> Best regards,
> Ningzhi Xie
> Department of Electrical and Computer Engineering
> University of Washington
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork
>
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From christophe.clement at polymtl.ca Sat Jul 15 06:43:54 2023
From: christophe.clement at polymtl.ca (Christophe =?utf-8?Q?Cl=C3=A9ment?=)
Date: Sat, 15 Jul 2023 06:43:54 -0400 (EDT)
Subject: [labnetwork] Dicing sapphire wafer
In-Reply-To: <CACHUCwJfbFp2ZJyZY8THMkeNuUff-FY-4fxgLNHzcYjm5S3+BQ@mail.gmail.com>
References: <CACHUCwJfbFp2ZJyZY8THMkeNuUff-FY-4fxgLNHzcYjm5S3+BQ@mail.gmail.com>
Message-ID: <1298238230.16280351.1689417834636.JavaMail.zimbra@polymtl.ca>
Hi Ningzhi
We dice sapphire wafer at Poly using a resinoid blade, grit size of 45 microns minimum (sometime 75 microns), cutting speed lower than your at 0.4 mm/s, spindle speed at 22 KRPM and we don't have issue.
Sample thickness is the same as yours, and we cut it in one pass.
Hope this help
Best
Chris
Christophe Cl?ment
Technicien laboratoire
Laboratoire de microfabrication (LMF)
Groupe des Couches Minces (GCM) [ http://www.gcmlab.ca/ \| www.gcmlab.ca ]
Ecole Polytechnique de Montr?al [ http://www.polymtl.ca/ \| www.polymtl.ca ]
D?partement de g?nie physique
* 2900 Boulevard Edouard Monpetit
Pavillon JAB
Campus de l'Universit? de Montr?al
Montr?al (Qu?bec) H3T 1J4
8 [ mailto:christophe.clement at polymtl.ca \| christophe.clement at polymtl.ca ]
( 514 340 4711 #2417
Fax : 514 340 5195
De: "Ningzhi Xie" <nzxie at uw.edu>
?: labnetwork at mtl.mit.edu
Envoy?: Vendredi 14 Juillet 2023 19:08:20
Objet: [labnetwork] Dicing sapphire wafer
Dear College,
I am using the DISCO DAD 321 Wafer Dicing Saw and VT07 SD400 blade to dice a 460?m sapphire (Al2O3) wafer. It seems the wafer is too hard that I get into trouble of frequently breaking the dicing blade. I have tried lowing the spin speed to 12000rpm, the cutting speed to 1mm/s, and only cut into half of the wafer (230?m) but still got the blade broken. I am wondering if you have any good suggestions on sapphire wafer dicing.
Thank you very much.
Best regards,
Ningzhi Xie
Department of Electrical and Computer Engineering
University of Washington
_______________________________________________
labnetwork mailing list
labnetwork at mtl.mit.edu
https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork
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From v.r.adineh at gmail.com Sun Jul 16 20:51:46 2023
From: v.r.adineh at gmail.com (Vahid R. Adineh)
Date: Mon, 17 Jul 2023 10:51:46 +1000
Subject: [labnetwork] Dicing sapphire wafer
In-Reply-To: <2EF2CE86-A2E7-4D73-9EFB-87B8B2DE66E2@cns.fas.harvard.edu>
References: <CACHUCwJfbFp2ZJyZY8THMkeNuUff-FY-4fxgLNHzcYjm5S3+BQ@mail.gmail.com>
<2EF2CE86-A2E7-4D73-9EFB-87B8B2DE66E2@cns.fas.harvard.edu>
Message-ID: <CABPY1FOEUmzbrU_0Ae7UOm8NPFKXQ+yu+XrqqE6KG9TiFoubsg@mail.gmail.com>
Dear Ningzhi,
Regarding your inquiry about sapphire cutting, our current practice
involves setting a depth of <0.2mm per cut (e.g., 3-pass cuts for a 0.5mm
thickness sapphire wafer) with a spindle revolution of 15K and a cutting
speed of 1 mm/s. To minimise blade vibrations, we utilise blades with
smaller outer diameters, specifically the P1A851 SDC320R10MB01 (52x0.3x40)
for sapphire wafers.
We are currently equipped with the DAD3350, which incorporates automatic
blade dressing. However, in the past, when using the DAD321, we were
performing manual blade dressing after every 5 cuts. This involved
unloading the sapphire wafer after 5 cuts, performing the blade dressing on
a dressing board installed on a separate tape, reloading the sapphire
wafer, and then resuming the dicing process.
I hope this information proves helpful to you.
Thank you,
Vahid
On Sat, Jul 15, 2023 at 10:42?PM Deng, Jiangdong <jdeng at cns.fas.harvard.edu>
wrote:
> 1mm/s is too fast for sapphire. Typically we use 0.1 or 0.2 mm/s and 20k
> RPM. Blade thickness should be 0.3 mm ( no thinner than 0.2 mm). Please
> also check the disco service, and they usually will give you very good
> suggestions.
>
> -JD @ CNS of Harvard
>

> Dear College,

>

> I am using the DISCO DAD 321 Wafer Dicing Saw and VT07 SD400 blade to dice

> a 460?m sapphire (Al2O3) wafer. It seems the wafer is too hard that I get

> into trouble of frequently breaking the dicing blade. I have tried lowing

> the spin speed to 12000rpm, the cutting speed to 1mm/s, and only cut into

> half of the wafer (230?m) but still got the blade broken. I am wondering if

> you have any good suggestions on sapphire wafer dicing.

>

> Thank you very much.

>

> Best regards,

> Ningzhi Xie

> Department of Electrical and Computer Engineering

> University of Washington

> _______________________________________________

> labnetwork mailing list

> labnetwork at mtl.mit.edu

> https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork

>

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From christophe.clement at polymtl.ca Sat Jul 15 06:43:54 2023

From: christophe.clement at polymtl.ca (Christophe =?utf-8?Q?Cl=C3=A9ment?=)

Date: Sat, 15 Jul 2023 06:43:54 -0400 (EDT)

Subject: [labnetwork] Dicing sapphire wafer

In-Reply-To: <CACHUCwJfbFp2ZJyZY8THMkeNuUff-FY-4fxgLNHzcYjm5S3+BQ@mail.gmail.com>

References: <CACHUCwJfbFp2ZJyZY8THMkeNuUff-FY-4fxgLNHzcYjm5S3+BQ@mail.gmail.com>

Message-ID: <1298238230.16280351.1689417834636.JavaMail.zimbra@polymtl.ca>

Hi Ningzhi

We dice sapphire wafer at Poly using a resinoid blade, grit size of 45 microns minimum (sometime 75 microns), cutting speed lower than your at 0.4 mm/s, spindle speed at 22 KRPM and we don't have issue.

Sample thickness is the same as yours, and we cut it in one pass.

Hope this help

Best

Chris

Christophe Cl?ment

Technicien laboratoire

Laboratoire de microfabrication (LMF)

Groupe des Couches Minces (GCM) [ http://www.gcmlab.ca/ | www.gcmlab.ca ]

Ecole Polytechnique de Montr?al [ http://www.polymtl.ca/ | www.polymtl.ca ]

D?partement de g?nie physique

* 2900 Boulevard Edouard Monpetit

Pavillon JAB

Campus de l'Universit? de Montr?al

Montr?al (Qu?bec) H3T 1J4

8 [ mailto:christophe.clement at polymtl.ca | christophe.clement at polymtl.ca ]

( 514 340 4711 #2417

Fax : 514 340 5195

De: "Ningzhi Xie" <nzxie at uw.edu>

?: labnetwork at mtl.mit.edu

Envoy?: Vendredi 14 Juillet 2023 19:08:20

Objet: [labnetwork] Dicing sapphire wafer

Dear College,

I am using the DISCO DAD 321 Wafer Dicing Saw and VT07 SD400 blade to dice a 460?m sapphire (Al2O3) wafer. It seems the wafer is too hard that I get into trouble of frequently breaking the dicing blade. I have tried lowing the spin speed to 12000rpm, the cutting speed to 1mm/s, and only cut into half of the wafer (230?m) but still got the blade broken. I am wondering if you have any good suggestions on sapphire wafer dicing.

Thank you very much.

Best regards,

Ningzhi Xie

Department of Electrical and Computer Engineering

University of Washington

_______________________________________________

labnetwork mailing list

labnetwork at mtl.mit.edu

https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork

-------------- next part --------------

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From v.r.adineh at gmail.com Sun Jul 16 20:51:46 2023

From: v.r.adineh at gmail.com (Vahid R. Adineh)

Date: Mon, 17 Jul 2023 10:51:46 +1000

Subject: [labnetwork] Dicing sapphire wafer

In-Reply-To: <2EF2CE86-A2E7-4D73-9EFB-87B8B2DE66E2@cns.fas.harvard.edu>

References: <CACHUCwJfbFp2ZJyZY8THMkeNuUff-FY-4fxgLNHzcYjm5S3+BQ@mail.gmail.com>

<2EF2CE86-A2E7-4D73-9EFB-87B8B2DE66E2@cns.fas.harvard.edu>

Message-ID: <CABPY1FOEUmzbrU_0Ae7UOm8NPFKXQ+yu+XrqqE6KG9TiFoubsg@mail.gmail.com>

Dear Ningzhi,

Regarding your inquiry about sapphire cutting, our current practice

involves setting a depth of <0.2mm per cut (e.g., 3-pass cuts for a 0.5mm

thickness sapphire wafer) with a spindle revolution of 15K and a cutting

speed of 1 mm/s. To minimise blade vibrations, we utilise blades with

smaller outer diameters, specifically the P1A851 SDC320R10MB01 (52x0.3x40)

for sapphire wafers.

We are currently equipped with the DAD3350, which incorporates automatic

blade dressing. However, in the past, when using the DAD321, we were

performing manual blade dressing after every 5 cuts. This involved

unloading the sapphire wafer after 5 cuts, performing the blade dressing on

a dressing board installed on a separate tape, reloading the sapphire

wafer, and then resuming the dicing process.

I hope this information proves helpful to you.

Thank you,

Vahid

On Sat, Jul 15, 2023 at 10:42?PM Deng, Jiangdong <jdeng at cns.fas.harvard.edu>

wrote:

> 1mm/s is too fast for sapphire. Typically we use 0.1 or 0.2 mm/s and 20k

> RPM. Blade thickness should be 0.3 mm ( no thinner than 0.2 mm). Please

> also check the disco service, and they usually will give you very good

> suggestions.

>

> -JD @ CNS of Harvard

>