srobertsphd/mit-labnetwork · Datasets at Hugging Face

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> Sent from my iPhone
>
> > On Jul 14, 2023, at 7:55 PM, Ningzhi Xie <nzxie at uw.edu> wrote:
> >
> > ?
> > Dear College,
> >
> > I am using the DISCO DAD 321 Wafer Dicing Saw and VT07 SD400 blade to
> dice a 460?m sapphire (Al2O3) wafer. It seems the wafer is too hard that I
> get into trouble of frequently breaking the dicing blade. I have tried
> lowing the spin speed to 12000rpm, the cutting speed to 1mm/s, and only cut
> into half of the wafer (230?m) but still got the blade broken. I am
> wondering if you have any good suggestions on sapphire wafer dicing.
> >
> > Thank you very much.
> >
> > Best regards,
> > Ningzhi Xie
> > Department of Electrical and Computer Engineering
> > University of Washington
> > _______________________________________________
> > labnetwork mailing list
> > labnetwork at mtl.mit.edu
> > https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork
>
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From hollingshead.19 at osu.edu Mon Jul 17 10:58:39 2023
From: hollingshead.19 at osu.edu (Hollingshead, Dave)
Date: Mon, 17 Jul 2023 14:58:39 +0000
Subject: [labnetwork] Dicing sapphire wafer
In-Reply-To: <CABPY1FOEUmzbrU_0Ae7UOm8NPFKXQ+yu+XrqqE6KG9TiFoubsg@mail.gmail.com>
References: <CACHUCwJfbFp2ZJyZY8THMkeNuUff-FY-4fxgLNHzcYjm5S3+BQ@mail.gmail.com>
<2EF2CE86-A2E7-4D73-9EFB-87B8B2DE66E2@cns.fas.harvard.edu>
<CABPY1FOEUmzbrU_0Ae7UOm8NPFKXQ+yu+XrqqE6KG9TiFoubsg@mail.gmail.com>
Message-ID: <SA1PR01MB65449402854252833FB461E6F33BA@SA1PR01MB6544.prod.exchangelabs.com>
Hi Ningzhi,
We dice sapphire quite a bit. Our dicing owner had the following comments (we have an ADT 7122):
We have had good luck dicing sapphire with the following recipe:
Feed rate = 1mm/sec
Spindle Speed = 18krpm
Cut depth = 200um/pass.
I have not had great luck with Disco resin blades for dicing sapphire. We typically use ADT or Asahi resin blades.
A couple questions:
What is the OD of the blade?
Is the spray water positioned correctly on the blade as it is cutting? (not enough cooling, too much heat = increased blade load and wear)
Is the substrate round or rectangular? Substrate diameter/dimensions?
How far outside the substate edge does the blade begin the cutting process? (typical is 10mm)
-Dave
Dave Hollingshead
Manager, Research Operations
The Ohio State University
Nanotech West Labs
Suite 100, 1381 Kinnear Rd, Columbus, OH 43212
614.292.1355 Office
hollingshead.19 at osu.edu<mailto:hollingshead.19 at osu.edu> / nanotech.osu.edu<http://nanotech.osu.edu>
Pronouns: he/him/his
From: labnetwork <labnetwork-bounces at mtl.mit.edu> On Behalf Of Vahid R. Adineh
Sent: Sunday, July 16, 2023 20:52
To: Ningzhi Xie <nzxie at uw.edu>
Cc: labnetwork at mtl.mit.edu
Subject: Re: [labnetwork] Dicing sapphire wafer
Dear Ningzhi, Regarding your inquiry about sapphire cutting, our current practice involves setting a depth of <0.?2mm per cut (e.?g.?, 3-pass cuts for a 0.?5mm thickness sapphire wafer) with a spindle revolution of 15K and a cutting speed of
Dear Ningzhi,
Regarding your inquiry about sapphire cutting, our current practice involves setting a depth of <0.2mm per cut (e.g., 3-pass cuts for a 0.5mm thickness sapphire wafer) with a spindle revolution of 15K and a cutting speed of 1 mm/s. To minimise blade vibrations, we utilise blades with smaller outer diameters, specifically the P1A851 SDC320R10MB01 (52x0.3x40) for sapphire wafers.
We are currently equipped with the DAD3350, which incorporates automatic blade dressing. However, in the past, when using the DAD321, we were performing manual blade dressing after every 5 cuts. This involved unloading the sapphire wafer after 5 cuts, performing the blade dressing on a dressing board installed on a separate tape, reloading the sapphire wafer, and then resuming the dicing process.
I hope this information proves helpful to you.
Thank you,
Vahid
On Sat, Jul 15, 2023 at 10:42?PM Deng, Jiangdong <jdeng at cns.fas.harvard.edu<mailto:jdeng at cns.fas.harvard.edu>> wrote:
1mm/s is too fast for sapphire. Typically we use 0.1 or 0.2 mm/s and 20k RPM. Blade thickness should be 0.3 mm ( no thinner than 0.2 mm). Please also check the disco service, and they usually will give you very good suggestions.
-JD @ CNS of Harvard
Sent from my iPhone
> On Jul 14, 2023, at 7:55 PM, Ningzhi Xie <nzxie at uw.edu<mailto:nzxie at uw.edu>> wrote:
>
> ?
> Dear College,
>
> I am using the DISCO DAD 321 Wafer Dicing Saw and VT07 SD400 blade to dice a 460?m sapphire (Al2O3) wafer. It seems the wafer is too hard that I get into trouble of frequently breaking the dicing blade. I have tried lowing the spin speed to 12000rpm, the cutting speed to 1mm/s, and only cut into half of the wafer (230?m) but still got the blade broken. I am wondering if you have any good suggestions on sapphire wafer dicing.
>
> Thank you very much.
>
> Best regards,
> Ningzhi Xie
> Department of Electrical and Computer Engineering
> University of Washington
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu<mailto:labnetwork at mtl.mit.edu>
> https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork<https://urldefense.com/v3/__https:/mtl.mit.edu/mailman/listinfo.cgi/labnetwork__;!!KGKeukY!1p8_UUGS7UAWqbkMwafHz-Mkod679hyisNIOY86TQ1HQs7z-3UgFT38HxAxrDQSdcTCAL-gLWsXcaL4Fet12apF1zQ$>
_______________________________________________
labnetwork mailing list
labnetwork at mtl.mit.edu<mailto:labnetwork at mtl.mit.edu>
https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork<https://urldefense.com/v3/__https:/mtl.mit.edu/mailman/listinfo.cgi/labnetwork__;!!KGKeukY!1p8_UUGS7UAWqbkMwafHz-Mkod679hyisNIOY86TQ1HQs7z-3UgFT38HxAxrDQSdcTCAL-gLWsXcaL4Fet12apF1zQ$>
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> Sent from my iPhone

>

> > On Jul 14, 2023, at 7:55 PM, Ningzhi Xie <nzxie at uw.edu> wrote:

> >

> > ?

> > Dear College,

> >

> > I am using the DISCO DAD 321 Wafer Dicing Saw and VT07 SD400 blade to

> dice a 460?m sapphire (Al2O3) wafer. It seems the wafer is too hard that I

> get into trouble of frequently breaking the dicing blade. I have tried

> lowing the spin speed to 12000rpm, the cutting speed to 1mm/s, and only cut

> into half of the wafer (230?m) but still got the blade broken. I am

> wondering if you have any good suggestions on sapphire wafer dicing.

> >

> > Thank you very much.

> >

> > Best regards,

> > Ningzhi Xie

> > Department of Electrical and Computer Engineering

> > University of Washington

> > _______________________________________________

> > labnetwork mailing list

> > labnetwork at mtl.mit.edu

> > https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork

> _______________________________________________

> labnetwork mailing list

> labnetwork at mtl.mit.edu

> https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork

>

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From hollingshead.19 at osu.edu Mon Jul 17 10:58:39 2023

From: hollingshead.19 at osu.edu (Hollingshead, Dave)

Date: Mon, 17 Jul 2023 14:58:39 +0000

Subject: [labnetwork] Dicing sapphire wafer

In-Reply-To: <CABPY1FOEUmzbrU_0Ae7UOm8NPFKXQ+yu+XrqqE6KG9TiFoubsg@mail.gmail.com>

References: <CACHUCwJfbFp2ZJyZY8THMkeNuUff-FY-4fxgLNHzcYjm5S3+BQ@mail.gmail.com>

<2EF2CE86-A2E7-4D73-9EFB-87B8B2DE66E2@cns.fas.harvard.edu>

<CABPY1FOEUmzbrU_0Ae7UOm8NPFKXQ+yu+XrqqE6KG9TiFoubsg@mail.gmail.com>

Message-ID: <SA1PR01MB65449402854252833FB461E6F33BA@SA1PR01MB6544.prod.exchangelabs.com>

Hi Ningzhi,

We dice sapphire quite a bit. Our dicing owner had the following comments (we have an ADT 7122):

We have had good luck dicing sapphire with the following recipe:

Feed rate = 1mm/sec

Spindle Speed = 18krpm

Cut depth = 200um/pass.

I have not had great luck with Disco resin blades for dicing sapphire. We typically use ADT or Asahi resin blades.

A couple questions:

What is the OD of the blade?

Is the spray water positioned correctly on the blade as it is cutting? (not enough cooling, too much heat = increased blade load and wear)

Is the substrate round or rectangular? Substrate diameter/dimensions?

How far outside the substate edge does the blade begin the cutting process? (typical is 10mm)

-Dave

Dave Hollingshead

Manager, Research Operations

The Ohio State University

Nanotech West Labs

Suite 100, 1381 Kinnear Rd, Columbus, OH 43212

614.292.1355 Office

hollingshead.19 at osu.edu<mailto:hollingshead.19 at osu.edu> / nanotech.osu.edu<http://nanotech.osu.edu>

Pronouns: he/him/his

From: labnetwork <labnetwork-bounces at mtl.mit.edu> On Behalf Of Vahid R. Adineh

Sent: Sunday, July 16, 2023 20:52

To: Ningzhi Xie <nzxie at uw.edu>

Cc: labnetwork at mtl.mit.edu

Subject: Re: [labnetwork] Dicing sapphire wafer

Dear Ningzhi, Regarding your inquiry about sapphire cutting, our current practice involves setting a depth of <0.?2mm per cut (e.?g.?, 3-pass cuts for a 0.?5mm thickness sapphire wafer) with a spindle revolution of 15K and a cutting speed of

Dear Ningzhi,

Regarding your inquiry about sapphire cutting, our current practice involves setting a depth of <0.2mm per cut (e.g., 3-pass cuts for a 0.5mm thickness sapphire wafer) with a spindle revolution of 15K and a cutting speed of 1 mm/s. To minimise blade vibrations, we utilise blades with smaller outer diameters, specifically the P1A851 SDC320R10MB01 (52x0.3x40) for sapphire wafers.

We are currently equipped with the DAD3350, which incorporates automatic blade dressing. However, in the past, when using the DAD321, we were performing manual blade dressing after every 5 cuts. This involved unloading the sapphire wafer after 5 cuts, performing the blade dressing on a dressing board installed on a separate tape, reloading the sapphire wafer, and then resuming the dicing process.

I hope this information proves helpful to you.

Thank you,

Vahid

On Sat, Jul 15, 2023 at 10:42?PM Deng, Jiangdong <jdeng at cns.fas.harvard.edu<mailto:jdeng at cns.fas.harvard.edu>> wrote:

1mm/s is too fast for sapphire. Typically we use 0.1 or 0.2 mm/s and 20k RPM. Blade thickness should be 0.3 mm ( no thinner than 0.2 mm). Please also check the disco service, and they usually will give you very good suggestions.

-JD @ CNS of Harvard

Sent from my iPhone

> On Jul 14, 2023, at 7:55 PM, Ningzhi Xie <nzxie at uw.edu<mailto:nzxie at uw.edu>> wrote:

>

> ?

> Dear College,

>

> I am using the DISCO DAD 321 Wafer Dicing Saw and VT07 SD400 blade to dice a 460?m sapphire (Al2O3) wafer. It seems the wafer is too hard that I get into trouble of frequently breaking the dicing blade. I have tried lowing the spin speed to 12000rpm, the cutting speed to 1mm/s, and only cut into half of the wafer (230?m) but still got the blade broken. I am wondering if you have any good suggestions on sapphire wafer dicing.

>

> Thank you very much.

>

> Best regards,

> Ningzhi Xie

> Department of Electrical and Computer Engineering

> University of Washington

> _______________________________________________

> labnetwork mailing list

> labnetwork at mtl.mit.edu<mailto:labnetwork at mtl.mit.edu>

> https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork<https://urldefense.com/v3/__https:/mtl.mit.edu/mailman/listinfo.cgi/labnetwork__;!!KGKeukY!1p8_UUGS7UAWqbkMwafHz-Mkod679hyisNIOY86TQ1HQs7z-3UgFT38HxAxrDQSdcTCAL-gLWsXcaL4Fet12apF1zQ$>

_______________________________________________

labnetwork mailing list

labnetwork at mtl.mit.edu<mailto:labnetwork at mtl.mit.edu>

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