Unnamed: 0 int64 0 350k | level_0 int64 0 351k | ApplicationNumber int64 9.75M 96.1M | ArtUnit int64 1.6k 3.99k | Abstract stringlengths 1 8.37k | Claims stringlengths 3 292k | abstract-claims stringlengths 68 293k | TechCenter int64 1.6k 3.9k |
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11,500 | 11,500 | 14,885,289 | 2,884 | Infrared sensing systems having improved vibration cancelation, and methods of achieving improved vibration cancelation. In one example, an infrared sensing system includes an infrared sensor configured to produce a sensor output signal representative of a response of the infrared sensor to infrared excitation and vibration excitation, an accelerometer configured to provide an acceleration signal responsive to the vibration excitation, and a controller, including an adaptive digital filter, coupled to the infrared sensor and to the accelerometer, and configured to receive the acceleration signal and to adjust coefficients of the adaptive digital filter so as to minimize coherence between a residual signal and the acceleration signal, the residual signal being a difference between the sensor output signal and a filter output signal from the adaptive digital filter. | 1. An infrared (IR) sensing system comprising:
an IR sensor configured to produce a sensor output signal representative of a response of the IR sensor to an IR signature of interest and vibration excitation; a reference sensor configured to provide a reference signal responsive to the vibration excitation; and a controller, including an adaptive digital filter, coupled to the IR sensor and to the reference sensor, and configured to receive the reference signal and to adjust coefficients of the adaptive digital filter so as to minimize coherence between a residual signal and the reference signal, the residual signal being a difference between the sensor output signal and a filter output signal from the adaptive digital filter. 2. The IR sensing system of claim 1 wherein the reference sensor is an accelerometer and the reference signal is an acceleration signal. 3. The IR sensing system of claim 2 wherein the IR sensor and the accelerometer are disposed proximate one another on a movable platform. 4. The IR sensing system of claim 3 wherein the accelerometer is coupled to a housing of the IR sensor. 5. The IR sensing system of claim 2 wherein the controller is configured to implement a least-mean-square algorithm to minimize a portion of the sensor output signal that is correlated with the acceleration signal, thereby minimizing the coherence. 6. The IR sensing system of claim 5 wherein the controller is further configured to receive the residual signal. 7. The IR sensing system of claim 1 wherein the controller is configured to receive the residual signal and to implement a least-mean-square algorithm to minimize a portion of the sensor output signal that is correlated with the reference signal, thereby minimizing the coherence. 8. An infrared (IR) sensing system comprising:
an IR sensor configured to produce a sensor output signal representative of a response of the IR sensor to an IR event and vibration excitation; at least one accelerometer configured to provide an acceleration signal responsive to the vibration excitation; and a controller, including an adaptive digital filter, coupled to the IR sensor and to the at least one accelerometer, and configured to receive the acceleration signal and to adjust coefficients of the adaptive digital filter so as to minimize coherence between a residual signal and the acceleration signal, the residual signal being a difference between the sensor output signal and a filter output signal from the adaptive digital filter. 9. The IR sensing system of claim 8 wherein the controller is configured to implement a least-mean-square algorithm to minimize a portion of the sensor output signal that is correlated with the acceleration signal, thereby minimizing the coherence. 10. The IR sensing system of claim 8 wherein the controller is further configured to receive the residual signal. 11. The IR sensing system of claim 8 wherein the at least one accelerometer is coupled to a housing of the IR sensor. 12. A method of providing vibration cancelation in an infrared (IR) sensing system, the method comprising:
receiving a sensor output signal from an IR sensor, the sensor output signal being representative of a response of the IR sensor to an IR signature of interest and vibration excitation; receiving at an input to an adaptive digital filter a reference signal from a reference sensor, the reference signal being responsive to the vibration excitation; producing a residual signal by taking a difference between the sensor output signal and a filter output signal from the adaptive digital filter; and adjusting coefficients of the adaptive digital filter so as to minimize coherence between the residual signal and the reference signal. 13. The method of claim 12 wherein the reference sensor is an accelerometer and the reference signal is an acceleration signal. 14. The method of claim 13 wherein adjusting the coefficients includes applying a least-mean-square algorithm to minimize a portion of the sensor output signal that is correlated with the acceleration signal, thereby minimizing the coherence between the residual signal and the acceleration signal. | Infrared sensing systems having improved vibration cancelation, and methods of achieving improved vibration cancelation. In one example, an infrared sensing system includes an infrared sensor configured to produce a sensor output signal representative of a response of the infrared sensor to infrared excitation and vibration excitation, an accelerometer configured to provide an acceleration signal responsive to the vibration excitation, and a controller, including an adaptive digital filter, coupled to the infrared sensor and to the accelerometer, and configured to receive the acceleration signal and to adjust coefficients of the adaptive digital filter so as to minimize coherence between a residual signal and the acceleration signal, the residual signal being a difference between the sensor output signal and a filter output signal from the adaptive digital filter.1. An infrared (IR) sensing system comprising:
an IR sensor configured to produce a sensor output signal representative of a response of the IR sensor to an IR signature of interest and vibration excitation; a reference sensor configured to provide a reference signal responsive to the vibration excitation; and a controller, including an adaptive digital filter, coupled to the IR sensor and to the reference sensor, and configured to receive the reference signal and to adjust coefficients of the adaptive digital filter so as to minimize coherence between a residual signal and the reference signal, the residual signal being a difference between the sensor output signal and a filter output signal from the adaptive digital filter. 2. The IR sensing system of claim 1 wherein the reference sensor is an accelerometer and the reference signal is an acceleration signal. 3. The IR sensing system of claim 2 wherein the IR sensor and the accelerometer are disposed proximate one another on a movable platform. 4. The IR sensing system of claim 3 wherein the accelerometer is coupled to a housing of the IR sensor. 5. The IR sensing system of claim 2 wherein the controller is configured to implement a least-mean-square algorithm to minimize a portion of the sensor output signal that is correlated with the acceleration signal, thereby minimizing the coherence. 6. The IR sensing system of claim 5 wherein the controller is further configured to receive the residual signal. 7. The IR sensing system of claim 1 wherein the controller is configured to receive the residual signal and to implement a least-mean-square algorithm to minimize a portion of the sensor output signal that is correlated with the reference signal, thereby minimizing the coherence. 8. An infrared (IR) sensing system comprising:
an IR sensor configured to produce a sensor output signal representative of a response of the IR sensor to an IR event and vibration excitation; at least one accelerometer configured to provide an acceleration signal responsive to the vibration excitation; and a controller, including an adaptive digital filter, coupled to the IR sensor and to the at least one accelerometer, and configured to receive the acceleration signal and to adjust coefficients of the adaptive digital filter so as to minimize coherence between a residual signal and the acceleration signal, the residual signal being a difference between the sensor output signal and a filter output signal from the adaptive digital filter. 9. The IR sensing system of claim 8 wherein the controller is configured to implement a least-mean-square algorithm to minimize a portion of the sensor output signal that is correlated with the acceleration signal, thereby minimizing the coherence. 10. The IR sensing system of claim 8 wherein the controller is further configured to receive the residual signal. 11. The IR sensing system of claim 8 wherein the at least one accelerometer is coupled to a housing of the IR sensor. 12. A method of providing vibration cancelation in an infrared (IR) sensing system, the method comprising:
receiving a sensor output signal from an IR sensor, the sensor output signal being representative of a response of the IR sensor to an IR signature of interest and vibration excitation; receiving at an input to an adaptive digital filter a reference signal from a reference sensor, the reference signal being responsive to the vibration excitation; producing a residual signal by taking a difference between the sensor output signal and a filter output signal from the adaptive digital filter; and adjusting coefficients of the adaptive digital filter so as to minimize coherence between the residual signal and the reference signal. 13. The method of claim 12 wherein the reference sensor is an accelerometer and the reference signal is an acceleration signal. 14. The method of claim 13 wherein adjusting the coefficients includes applying a least-mean-square algorithm to minimize a portion of the sensor output signal that is correlated with the acceleration signal, thereby minimizing the coherence between the residual signal and the acceleration signal. | 2,800 |
11,501 | 11,501 | 15,484,979 | 2,872 | An electronic device may have transparent members such as display cover layers and camera windows. A transparent member such as a sapphire member may be provided with an antireflection coating. The antireflection coating may have a stack of dielectric thin-film interference filter layers that form a thin-film interference filter that suppresses visible light reflections. The stack of dielectric thin-film interference filter layers may have thicknesses and materials that provide the thin-film interference filter and coating with low light reflection properties while enhancing scratch resistance. An adhesion layer may be used to help adhere the stack of thin-film interference filter layer to the transparent member. An antismudge coating such as a fluoropolymer coating may be used to reduce smudging. Graded layers and layers with elevated hardness values may be used in the coating. | 1. An electronic device, comprising:
a visible light camera; a transparent member that overlaps the visible light camera; and a visible light antireflection coating on the transparent member that includes a stack of thin-film interference filter layers including an uppermost thin-film interference filter layer and a lowermost thin-film interference filter layer that is between the uppermost thin-film interference layer and the transparent member, wherein the uppermost thin-film interference filter layer is a silicon oxide layer having a thickness of less than 80 nm. 2. The electronic device defined in claim 1 wherein the transparent member is a sapphire member. 3. The electronic device defined in claim 2 wherein the stack of thin-film interference filter layers includes a second-to-top thin-film interference filter layer that is adjacent to the uppermost thin-film interference filter layer and that has a Knoop hardness of greater than 1000 and a thickness of at least 120 nm. 4. The electronic device defined in claim 3 further comprises a graded index adhesion layer between the lowermost thin-film interference filter layer and the sapphire member. 5. The electronic device defined in claim 4 wherein the graded adhesion layer includes a graded mixture of aluminum oxide and silicon oxide. 6. The electronic device defined in claim 3 wherein the second-to-top thin-film interference layer is a layer of silicon nitride. 7. The electronic device defined in claim 2 wherein the stack of thin-film interference filter layers comprises a plurality of silicon oxide layers and wherein each of the plurality of silicon oxide layers has a thickness of less than 60 nm. 8. The electronic device defined in claim 7 wherein the stack of thin-film interference filter layers includes a second-to-top thin-film interference filter layer that is adjacent to the uppermost thin-film interference filter layer and wherein the second-to-top thin-film interference filter layer is a layer of silicon nitride. 9. The electronic device defined in claim 7 wherein the visible light antireflection coating has a thickness of less than 300 nm and comprises:
an antismudge layer on the uppermost thin-film interference filter layer; and
an adhesion layer between the lowermost thin-film interference filter layer and the sapphire member. 10. An electronic device, comprising:
a light-based component; a transparent member that overlaps the light-based component; and a visible light antireflection coating on the transparent member that includes a stack of thin-film interference filter layers including a lowermost thin-film interference filter layer, an uppermost thin-film interference filter layer formed from silicon oxide, and a second-to-top thin-film interference filter layer that is adjacent to the uppermost thin-film interference filter layer, wherein the second-to-top thin-film interference filter layer is formed from a material having a Knoop hardness of at least 1000 and that has a thickness of at least 120 nm. 11. The electronic device defined in claim 10 wherein the visible light antireflection coating has a thickness of less than 300 nm. 12. The electronic device defined in claim 11 wherein the stack of thin-film interference filter layers comprises a plurality of silicon oxide layers each having a thickness of less than 60 nm. 13. The electronic device defined in claim 12 wherein the transparent member comprises a sapphire member and wherein the light-based component comprises a camera. 14. The electronic device defined in claim 13 wherein the uppermost thin-film interference filter layer has a thickness of less than 80 nm. 15. The electronic device defined in claim 10 wherein the second-to-top thin-film interference filter layer comprises a layer selected from the group consisting of: a titanium dioxide layer, a niobium oxide layer, a tantalum oxide layer, a zirconium oxide layer, a hafnium oxide layer, a silicon nitride layer, and a yttrium oxide layer, an aluminum oxide layer, an aluminum nitride layer, and a carbon layer. 16. An electronic device, comprising:
a light-based component; a transparent member that overlaps the light-based component; and a visible light antireflection coating on the transparent member that includes a stack of thin-film interference filter layers, wherein the visible light antireflection coating has a thickness of less than 300 nm and wherein the stack of thin-film interference filter layers comprises a plurality of silicon oxide layers each having a thickness of less than 60 nm. 17. The electronic device defined in claim 16 wherein the light-based device comprises a camera. 18. The electronic device defined in claim 17 wherein the stack of thin-film interference filter layers includes a lowermost thin-film interference filter layer and an uppermost thin-film interference filter layer, wherein the lowermost thin-film interference filter layer is interposed between the uppermost thin-film interference filter layer and the transparent member, and wherein the stack of thin-film interference filter layers further comprises a second-to-top thin-film interference filter layer that is adjacent to the uppermost thin-film interference layer, wherein the second-to-top thin-film interference filter layer is formed from a layer of material having a Knoop hardness of at least 1000 and a thickness of at least 120 nm. 19. The electronic device defined in claim 18 wherein the uppermost thin-film interference filter layer comprises a silicon oxide layer and wherein the visible light antireflection coating further comprises a fluoropolymer layer on the uppermost thin-film interference filter layer. 20. The electronic device defined in claim 19 wherein the transparent member comprises a sapphire member. | An electronic device may have transparent members such as display cover layers and camera windows. A transparent member such as a sapphire member may be provided with an antireflection coating. The antireflection coating may have a stack of dielectric thin-film interference filter layers that form a thin-film interference filter that suppresses visible light reflections. The stack of dielectric thin-film interference filter layers may have thicknesses and materials that provide the thin-film interference filter and coating with low light reflection properties while enhancing scratch resistance. An adhesion layer may be used to help adhere the stack of thin-film interference filter layer to the transparent member. An antismudge coating such as a fluoropolymer coating may be used to reduce smudging. Graded layers and layers with elevated hardness values may be used in the coating.1. An electronic device, comprising:
a visible light camera; a transparent member that overlaps the visible light camera; and a visible light antireflection coating on the transparent member that includes a stack of thin-film interference filter layers including an uppermost thin-film interference filter layer and a lowermost thin-film interference filter layer that is between the uppermost thin-film interference layer and the transparent member, wherein the uppermost thin-film interference filter layer is a silicon oxide layer having a thickness of less than 80 nm. 2. The electronic device defined in claim 1 wherein the transparent member is a sapphire member. 3. The electronic device defined in claim 2 wherein the stack of thin-film interference filter layers includes a second-to-top thin-film interference filter layer that is adjacent to the uppermost thin-film interference filter layer and that has a Knoop hardness of greater than 1000 and a thickness of at least 120 nm. 4. The electronic device defined in claim 3 further comprises a graded index adhesion layer between the lowermost thin-film interference filter layer and the sapphire member. 5. The electronic device defined in claim 4 wherein the graded adhesion layer includes a graded mixture of aluminum oxide and silicon oxide. 6. The electronic device defined in claim 3 wherein the second-to-top thin-film interference layer is a layer of silicon nitride. 7. The electronic device defined in claim 2 wherein the stack of thin-film interference filter layers comprises a plurality of silicon oxide layers and wherein each of the plurality of silicon oxide layers has a thickness of less than 60 nm. 8. The electronic device defined in claim 7 wherein the stack of thin-film interference filter layers includes a second-to-top thin-film interference filter layer that is adjacent to the uppermost thin-film interference filter layer and wherein the second-to-top thin-film interference filter layer is a layer of silicon nitride. 9. The electronic device defined in claim 7 wherein the visible light antireflection coating has a thickness of less than 300 nm and comprises:
an antismudge layer on the uppermost thin-film interference filter layer; and
an adhesion layer between the lowermost thin-film interference filter layer and the sapphire member. 10. An electronic device, comprising:
a light-based component; a transparent member that overlaps the light-based component; and a visible light antireflection coating on the transparent member that includes a stack of thin-film interference filter layers including a lowermost thin-film interference filter layer, an uppermost thin-film interference filter layer formed from silicon oxide, and a second-to-top thin-film interference filter layer that is adjacent to the uppermost thin-film interference filter layer, wherein the second-to-top thin-film interference filter layer is formed from a material having a Knoop hardness of at least 1000 and that has a thickness of at least 120 nm. 11. The electronic device defined in claim 10 wherein the visible light antireflection coating has a thickness of less than 300 nm. 12. The electronic device defined in claim 11 wherein the stack of thin-film interference filter layers comprises a plurality of silicon oxide layers each having a thickness of less than 60 nm. 13. The electronic device defined in claim 12 wherein the transparent member comprises a sapphire member and wherein the light-based component comprises a camera. 14. The electronic device defined in claim 13 wherein the uppermost thin-film interference filter layer has a thickness of less than 80 nm. 15. The electronic device defined in claim 10 wherein the second-to-top thin-film interference filter layer comprises a layer selected from the group consisting of: a titanium dioxide layer, a niobium oxide layer, a tantalum oxide layer, a zirconium oxide layer, a hafnium oxide layer, a silicon nitride layer, and a yttrium oxide layer, an aluminum oxide layer, an aluminum nitride layer, and a carbon layer. 16. An electronic device, comprising:
a light-based component; a transparent member that overlaps the light-based component; and a visible light antireflection coating on the transparent member that includes a stack of thin-film interference filter layers, wherein the visible light antireflection coating has a thickness of less than 300 nm and wherein the stack of thin-film interference filter layers comprises a plurality of silicon oxide layers each having a thickness of less than 60 nm. 17. The electronic device defined in claim 16 wherein the light-based device comprises a camera. 18. The electronic device defined in claim 17 wherein the stack of thin-film interference filter layers includes a lowermost thin-film interference filter layer and an uppermost thin-film interference filter layer, wherein the lowermost thin-film interference filter layer is interposed between the uppermost thin-film interference filter layer and the transparent member, and wherein the stack of thin-film interference filter layers further comprises a second-to-top thin-film interference filter layer that is adjacent to the uppermost thin-film interference layer, wherein the second-to-top thin-film interference filter layer is formed from a layer of material having a Knoop hardness of at least 1000 and a thickness of at least 120 nm. 19. The electronic device defined in claim 18 wherein the uppermost thin-film interference filter layer comprises a silicon oxide layer and wherein the visible light antireflection coating further comprises a fluoropolymer layer on the uppermost thin-film interference filter layer. 20. The electronic device defined in claim 19 wherein the transparent member comprises a sapphire member. | 2,800 |
11,502 | 11,502 | 16,031,195 | 2,875 | A light bulb includes a light bulb body that has a bulbous portion that narrows into a neck portion. The neck portion extends into a base portion. An array of LEDs is mounted in the bulbous portion. One or more solar photovoltaic panels are mounted in or on the neck portion. A battery is disposed in the light bulb body, which powers the LEDs and which is charged by the one or more solar photovoltaic panels. | 1. A light bulb comprising:
a light bulb body comprising a bulbous portion that narrows into a neck portion, said neck portion extending into a base portion; an array of LEDs mounted in said bulbous portion; one or more solar photovoltaic panels mounted inside said neck portion; and a battery disposed in said light bulb body that powers said LEDs and which is charged by said one or more solar photovoltaic panels, and wherein said one or more solar photovoltaic panels extend from said neck portion into part of said bulbous portion. 2. The light bulb according to claim 1, wherein said one or more solar photovoltaic panels face radially outwards about a central axis of said light bulb body, the central axis extending from said base portion through said neck portion to said bulbous portion. 3. The light bulb according to claim 1, wherein said neck portion and said one or more solar photovoltaic panels are curved. 4. The light bulb according to claim 1, wherein said neck portion and said one or more solar photovoltaic panels are curved with similar curvatures. 5. The light bulb according to claim 1, wherein said one or more solar photovoltaic panels comprise discrete solar photovoltaic panels spaced from one another about a central axis of said light bulb body, the central axis extending from said base portion through said neck portion to said bulbous portion. 6. The light bulb according to claim 1, wherein said one or more solar photovoltaic panels comprise a single solar photovoltaic panel that curves around a central axis of said light bulb body, the central axis extending from said base portion through said neck portion to said bulbous portion. 7. The light bulb according to claim 1, wherein said one or more solar photovoltaic panels extend from said base portion through said neck portion into part of said bulbous portion. 8. The light bulb according to claim 1, wherein said base portion comprises mounting structure for mounting said light bulb body to a support. 9. A light bulb comprising:
a light bulb body comprising a bulbous portion that narrows into a neck portion, said neck portion extending into a base portion; an array of LEDs mounted in said bulbous portion; one or more solar photovoltaic panels mounted inside said neck portion; and a battery disposed in said light bulb body that powers said LEDs and which is charged by said one or more solar photovoltaic panels, wherein said one or more solar photovoltaic panels face radially outwards about a central axis of said light bulb body, the central axis extending from said base portion through said neck portion to said bulbous portion. 10. A light bulb comprising:
a light bulb body comprising a bulbous portion that narrows into a neck portion, said neck portion extending into a base portion; an array of LEDs mounted in said bulbous portion; one or more solar photovoltaic panels mounted inside said neck portion; and a battery disposed in said light bulb body that powers said LEDs and which is charged by said one or more solar photovoltaic panels, wherein said neck portion and said one or more solar photovoltaic panels are curved. | A light bulb includes a light bulb body that has a bulbous portion that narrows into a neck portion. The neck portion extends into a base portion. An array of LEDs is mounted in the bulbous portion. One or more solar photovoltaic panels are mounted in or on the neck portion. A battery is disposed in the light bulb body, which powers the LEDs and which is charged by the one or more solar photovoltaic panels.1. A light bulb comprising:
a light bulb body comprising a bulbous portion that narrows into a neck portion, said neck portion extending into a base portion; an array of LEDs mounted in said bulbous portion; one or more solar photovoltaic panels mounted inside said neck portion; and a battery disposed in said light bulb body that powers said LEDs and which is charged by said one or more solar photovoltaic panels, and wherein said one or more solar photovoltaic panels extend from said neck portion into part of said bulbous portion. 2. The light bulb according to claim 1, wherein said one or more solar photovoltaic panels face radially outwards about a central axis of said light bulb body, the central axis extending from said base portion through said neck portion to said bulbous portion. 3. The light bulb according to claim 1, wherein said neck portion and said one or more solar photovoltaic panels are curved. 4. The light bulb according to claim 1, wherein said neck portion and said one or more solar photovoltaic panels are curved with similar curvatures. 5. The light bulb according to claim 1, wherein said one or more solar photovoltaic panels comprise discrete solar photovoltaic panels spaced from one another about a central axis of said light bulb body, the central axis extending from said base portion through said neck portion to said bulbous portion. 6. The light bulb according to claim 1, wherein said one or more solar photovoltaic panels comprise a single solar photovoltaic panel that curves around a central axis of said light bulb body, the central axis extending from said base portion through said neck portion to said bulbous portion. 7. The light bulb according to claim 1, wherein said one or more solar photovoltaic panels extend from said base portion through said neck portion into part of said bulbous portion. 8. The light bulb according to claim 1, wherein said base portion comprises mounting structure for mounting said light bulb body to a support. 9. A light bulb comprising:
a light bulb body comprising a bulbous portion that narrows into a neck portion, said neck portion extending into a base portion; an array of LEDs mounted in said bulbous portion; one or more solar photovoltaic panels mounted inside said neck portion; and a battery disposed in said light bulb body that powers said LEDs and which is charged by said one or more solar photovoltaic panels, wherein said one or more solar photovoltaic panels face radially outwards about a central axis of said light bulb body, the central axis extending from said base portion through said neck portion to said bulbous portion. 10. A light bulb comprising:
a light bulb body comprising a bulbous portion that narrows into a neck portion, said neck portion extending into a base portion; an array of LEDs mounted in said bulbous portion; one or more solar photovoltaic panels mounted inside said neck portion; and a battery disposed in said light bulb body that powers said LEDs and which is charged by said one or more solar photovoltaic panels, wherein said neck portion and said one or more solar photovoltaic panels are curved. | 2,800 |
11,503 | 11,503 | 15,225,165 | 2,884 | A flame detector includes a beam splitter to split mid-wave infrared radiation (MWIR) and long-wave infrared radiation (LWIR) into an MWIR component and an LWIR component. An MWIR detector detects the MWIR component and an LWIR detector detects the LWIR component. The flame detector analyzes the MWIR component to determine the presence of a flame and analyzes the LAIR component to determine whether the system is functioning properly. | 1. A system comprising:
a lens through which one or more of mid-wave infrared radiation (MWIR), long-wave infrared radiation (LWIR), and visible/near infrared radiation (VIS/NIR) pass; a beam splitter to split the MWIR, the LWIR, and the VIS/NIR into one or more of an MWIR component, an LWIR component, and a VIS/NIR component; an MWIR detector for receiving the MWIR component; one or more of an LWIR detector for receiving the LWIR component and a visible/near infrared (VIS/NIR) detector for receiving the VIS/NIR component, wherein the LWIR detector and the VIS/NIR detector are standalone units separate from the MWIR detector; and a computer processor coupled to the MWIR detector, the LWIR detector, and the VIS/NIR detector; wherein the MWIR detector is operable to detect the MWIR component; wherein the LWIR detector is operable to detect the LWIR component; wherein the VIS/NIR detector is operable to detect the VIS/NIR component; wherein the computer processor is operable to analyze the MWIR component and to determine a presence of a flame; and wherein the computer processor is operable to analyze one or more of the LWIR component and the VIS/NIR component and to determine whether the system is functioning properly. 2. The system of claim 1, wherein the MWIR detector comprises a bolometer array and a filter-window operable to permit only the MWIR component to reach the bolometer array. 3. The system of claim 1, wherein the VIS/NIR detector comprises a near infrared light camera. 4. The system of claim 1, wherein the MWIR detector is positioned at an approximately 90 degree angle from the LWIR detector or the MWIR detector is positioned at an approximately 90 degree angle from the VIS/NIR detector. 5. The system of claim 1, wherein the MWIR detector comprises an MWIR camera, the LWIR detector comprises an LWIR camera, and the VIS/NIR detector comprises a VIS/NIR camera. 6. The system of claim 1, wherein the analysis of the LWIR component and the analysis of the VIS/NIR component comprises an analysis of a thermal background. 7. The system of claim 1, wherein one or more of the LWIR detector and the VIS/NIR detector determine if the system is functioning properly by determining that the lens is operable, that the LWIR detector or the VIS/NIR detector is operable, that there is an obstruction in a field of view of the LWIR detector or the VIS/NIR detector, or that there is a presence of a hot object in the field of view of the LWIR detector or the VIS/NIR detector that is interpreted as a flame; and comprising an MWIR emitting element for determining the functionality of the MWIR detector. 8. The system of claim 1, wherein the LWIR detector does not include a filter or other device for attenuating the LWIR component. 9. The system of claim 1, wherein the MWIR detector comprises a carbon dioxide filter. 10. The system of claim 1, comprising a lens positioned between the beam splitter and one or more of the LWIR detector and the VIS/NIR detector. 11. The system of claim 1, wherein the beam splitter comprises one or more of a silicon beam splitter, a silicon short pass beam splitter, or a chromium on aluminum oxide beam splitter. 12. The system of claim 1, wherein one or more of the MWIR detector, the LWIR detector, and the VIS/NIR detector are commercial off the shelf products. 13. A system comprising:
a beam splitter to split mid-wave infrared radiation (MWIR) and long-wave infrared radiation (LWIR) into an MWIR component and an LWIR component; an MWIR detector for receiving the MWIR component; an LWIR detector for receiving the LWIR component, wherein the LWIR detector is a standalone unit separate from the MWIR detector; and a computer processor coupled to the MWIR detector and the LWIR detector; wherein the MWIR detector is operable to detect the MWIR component; wherein the LWIR detector is operable to detect the LWIR component; wherein the computer processor is operable to analyze the MWIR component and to determine a presence of a flame; and wherein the computer processor is operable to analyze the LWIR component to determine whether the system is functioning properly. 14. The system of claim 13, comprising a lens through which one or more of the MWIR component and the LWIR component pass. 15. The system of claim 13, wherein the beam splitter is operable to split visible/near infrared radiation (VIS/NIR) into a VIS/NIR component. 16. The system of claim 15, comprising a visible/near infrared (VIS/NIR) detector for receiving the VIS/NIR component. 17. The system of claim 16, wherein the computer processor is coupled to the VIS/NIR detector; wherein the VIS/NIR detector is operable to detect the VIS/NIR component; and wherein the computer processor is operable to analyze the VIS/NIR component and to determine whether the system is functioning properly. 18. The system of claim 13, wherein the MWIR detector comprises a bolometer array and a filter-window operable to permit only the MWIR component to reach the bolometer array; and wherein the MWIR detector, the LWIR detector, or the VIS/NIR detector are commercial off the shelf products. 19. The system of claim 16, wherein the MWIR detector is positioned at an approximately 90 degree angle from the LWIR detector or the MWIR detector is positioned at an approximately 90 degree angle from the VIS/NIR detector. 20. The system of claim 14, wherein one or more of the LWIR detector and the VIS/NIR detector determine if the system is functioning properly by determining that the lens is operable, that the LWIR detector or the VIS/NIR detector is operable, that there is an obstruction in a field of view of the LWIR detector or the VIS/NIR detector, that there is a presence of a hot object in the field of view of the LWIR detector or the VIS/NIR detector that is interpreted as a flame. | A flame detector includes a beam splitter to split mid-wave infrared radiation (MWIR) and long-wave infrared radiation (LWIR) into an MWIR component and an LWIR component. An MWIR detector detects the MWIR component and an LWIR detector detects the LWIR component. The flame detector analyzes the MWIR component to determine the presence of a flame and analyzes the LAIR component to determine whether the system is functioning properly.1. A system comprising:
a lens through which one or more of mid-wave infrared radiation (MWIR), long-wave infrared radiation (LWIR), and visible/near infrared radiation (VIS/NIR) pass; a beam splitter to split the MWIR, the LWIR, and the VIS/NIR into one or more of an MWIR component, an LWIR component, and a VIS/NIR component; an MWIR detector for receiving the MWIR component; one or more of an LWIR detector for receiving the LWIR component and a visible/near infrared (VIS/NIR) detector for receiving the VIS/NIR component, wherein the LWIR detector and the VIS/NIR detector are standalone units separate from the MWIR detector; and a computer processor coupled to the MWIR detector, the LWIR detector, and the VIS/NIR detector; wherein the MWIR detector is operable to detect the MWIR component; wherein the LWIR detector is operable to detect the LWIR component; wherein the VIS/NIR detector is operable to detect the VIS/NIR component; wherein the computer processor is operable to analyze the MWIR component and to determine a presence of a flame; and wherein the computer processor is operable to analyze one or more of the LWIR component and the VIS/NIR component and to determine whether the system is functioning properly. 2. The system of claim 1, wherein the MWIR detector comprises a bolometer array and a filter-window operable to permit only the MWIR component to reach the bolometer array. 3. The system of claim 1, wherein the VIS/NIR detector comprises a near infrared light camera. 4. The system of claim 1, wherein the MWIR detector is positioned at an approximately 90 degree angle from the LWIR detector or the MWIR detector is positioned at an approximately 90 degree angle from the VIS/NIR detector. 5. The system of claim 1, wherein the MWIR detector comprises an MWIR camera, the LWIR detector comprises an LWIR camera, and the VIS/NIR detector comprises a VIS/NIR camera. 6. The system of claim 1, wherein the analysis of the LWIR component and the analysis of the VIS/NIR component comprises an analysis of a thermal background. 7. The system of claim 1, wherein one or more of the LWIR detector and the VIS/NIR detector determine if the system is functioning properly by determining that the lens is operable, that the LWIR detector or the VIS/NIR detector is operable, that there is an obstruction in a field of view of the LWIR detector or the VIS/NIR detector, or that there is a presence of a hot object in the field of view of the LWIR detector or the VIS/NIR detector that is interpreted as a flame; and comprising an MWIR emitting element for determining the functionality of the MWIR detector. 8. The system of claim 1, wherein the LWIR detector does not include a filter or other device for attenuating the LWIR component. 9. The system of claim 1, wherein the MWIR detector comprises a carbon dioxide filter. 10. The system of claim 1, comprising a lens positioned between the beam splitter and one or more of the LWIR detector and the VIS/NIR detector. 11. The system of claim 1, wherein the beam splitter comprises one or more of a silicon beam splitter, a silicon short pass beam splitter, or a chromium on aluminum oxide beam splitter. 12. The system of claim 1, wherein one or more of the MWIR detector, the LWIR detector, and the VIS/NIR detector are commercial off the shelf products. 13. A system comprising:
a beam splitter to split mid-wave infrared radiation (MWIR) and long-wave infrared radiation (LWIR) into an MWIR component and an LWIR component; an MWIR detector for receiving the MWIR component; an LWIR detector for receiving the LWIR component, wherein the LWIR detector is a standalone unit separate from the MWIR detector; and a computer processor coupled to the MWIR detector and the LWIR detector; wherein the MWIR detector is operable to detect the MWIR component; wherein the LWIR detector is operable to detect the LWIR component; wherein the computer processor is operable to analyze the MWIR component and to determine a presence of a flame; and wherein the computer processor is operable to analyze the LWIR component to determine whether the system is functioning properly. 14. The system of claim 13, comprising a lens through which one or more of the MWIR component and the LWIR component pass. 15. The system of claim 13, wherein the beam splitter is operable to split visible/near infrared radiation (VIS/NIR) into a VIS/NIR component. 16. The system of claim 15, comprising a visible/near infrared (VIS/NIR) detector for receiving the VIS/NIR component. 17. The system of claim 16, wherein the computer processor is coupled to the VIS/NIR detector; wherein the VIS/NIR detector is operable to detect the VIS/NIR component; and wherein the computer processor is operable to analyze the VIS/NIR component and to determine whether the system is functioning properly. 18. The system of claim 13, wherein the MWIR detector comprises a bolometer array and a filter-window operable to permit only the MWIR component to reach the bolometer array; and wherein the MWIR detector, the LWIR detector, or the VIS/NIR detector are commercial off the shelf products. 19. The system of claim 16, wherein the MWIR detector is positioned at an approximately 90 degree angle from the LWIR detector or the MWIR detector is positioned at an approximately 90 degree angle from the VIS/NIR detector. 20. The system of claim 14, wherein one or more of the LWIR detector and the VIS/NIR detector determine if the system is functioning properly by determining that the lens is operable, that the LWIR detector or the VIS/NIR detector is operable, that there is an obstruction in a field of view of the LWIR detector or the VIS/NIR detector, that there is a presence of a hot object in the field of view of the LWIR detector or the VIS/NIR detector that is interpreted as a flame. | 2,800 |
11,504 | 11,504 | 15,633,337 | 2,831 | A connector assembly having a pin and a housing. The pin having an insulator layer or material separating two adjacent electrical contacts. The electrical contacts can each include a contact band and a tab extending from the contact band. An electrical contact can be established with a spring contact and the contact band can at least partially surrounds the insulator around the lengthwise axis of the pin. Two electrical contacts can be positioned in an axial or longitudinal offset configuration. | 1. A connector assembly comprising:
a pin comprising an insulator material and an electrical contact; a housing comprising an exterior surface and an interior surface defining a bore; a spring contact; a direction of insertion of said pin into said bore of said housing; wherein the pin comprises an axis in the direction of insertion; wherein the electrical contact comprises a contact band where contact is to be established with the spring contact, said contact band at least partially surrounds the insulator material around the axis of the pin; wherein said electrical contact comprises a tab extending from the contact band and along at least a length of the pin; and wherein the spring contact establishes an electrical path between the pin and the housing when the pin is inserted into the bore of the housing. 2. The connector assembly according to claim 1, wherein the electrical contact is a first electrical contact and the spring contact is a first spring contact; and
further comprising a second electrical contact and a second spring contact. 3. The connector assembly according to claim 2, wherein the pin comprises two spaced apart pin grooves including a first pin groove and a second pin groove and wherein the first electrical contact is located in the first pin groove and the second electrical contact is located in the second pin groove. 4. The connector assembly according to claim 1, wherein the spring contact is retained with a housing groove of the housing prior to insertion of the pin into the bore of the housing. 5. The connector assembly according to claim 1, wherein the spring contact is retained with a groove of the pin prior to insertion of the pin into the bore of the housing. 6. The connector assembly according to claim 1, wherein the tab of the electrical contact is connected to a source. 7. The connector assembly according to claim 1, wherein the tab of the electrical contact is connected to a receiver. 8. The connector assembly according to claim 1, wherein the contact band of the electrical contact and a contact band of a second electrical contact comprises are offset longitudinally. 9. The connector assembly according to claim 1, wherein the electrical contact is stamped from a metal sheet or the spring contact is a canted coil spring. 10. The connector assembly according to claim 1, wherein the contact band defines a plane and wherein the tab has an extension portion extending orthogonally to the plane. 11. The connector assembly according to claim 1, wherein the pin and the contact element are formed by insert molding. 12. The connector assembly according to claim 1, wherein the electrical contact is formed by metal injection molding or is molded by metal injection. 13. The connector assembly according to claim 1, wherein the electrical contact comprises copper or a copper alloy. 14. A method of using the connector assembly of claim 1, comprising the step of separating the pin from the bore of the housing. 15. A method of making the connector assembly of claim 1, comprising the step of assembling the contact assembly to the pin. 16. A connector assembly comprising:
a housing comprising an exterior surface and an interior surface defining a bore; a pin located in the bore of the housing, the pin comprising a tip section and a tail section, said tip section having a diameter that is larger than a diameter of the tail section; a spring contact contacting a contact band of an electrical contact, said electrical contact comprising a tab extending from the contact band and said spring contact and said contact band located inside the bore of the housing; and wherein said tab extends along a length of said tail section of said and is orthogonal to a plane defined by the contact band. 17. The connector assembly of claim 16, wherein the contact band is located in a pin groove of the pin. 18. The connector assembly of claim 17, wherein said tab is embedded inside said tail section. 19. The connector assembly of claim 17, wherein said contact band has a gap and two side edges defining the gap. 20. The connector assembly of claim 16, further comprising a second spring contact and a second contact band of a second contact element, said second spring contact and said second contact band located in the bore of the housing. 21. The connector assembly of claim 16, wherein the spring contact is located in a pin groove of the pin and a second spring contact is located in a housing groove of the housing. | A connector assembly having a pin and a housing. The pin having an insulator layer or material separating two adjacent electrical contacts. The electrical contacts can each include a contact band and a tab extending from the contact band. An electrical contact can be established with a spring contact and the contact band can at least partially surrounds the insulator around the lengthwise axis of the pin. Two electrical contacts can be positioned in an axial or longitudinal offset configuration.1. A connector assembly comprising:
a pin comprising an insulator material and an electrical contact; a housing comprising an exterior surface and an interior surface defining a bore; a spring contact; a direction of insertion of said pin into said bore of said housing; wherein the pin comprises an axis in the direction of insertion; wherein the electrical contact comprises a contact band where contact is to be established with the spring contact, said contact band at least partially surrounds the insulator material around the axis of the pin; wherein said electrical contact comprises a tab extending from the contact band and along at least a length of the pin; and wherein the spring contact establishes an electrical path between the pin and the housing when the pin is inserted into the bore of the housing. 2. The connector assembly according to claim 1, wherein the electrical contact is a first electrical contact and the spring contact is a first spring contact; and
further comprising a second electrical contact and a second spring contact. 3. The connector assembly according to claim 2, wherein the pin comprises two spaced apart pin grooves including a first pin groove and a second pin groove and wherein the first electrical contact is located in the first pin groove and the second electrical contact is located in the second pin groove. 4. The connector assembly according to claim 1, wherein the spring contact is retained with a housing groove of the housing prior to insertion of the pin into the bore of the housing. 5. The connector assembly according to claim 1, wherein the spring contact is retained with a groove of the pin prior to insertion of the pin into the bore of the housing. 6. The connector assembly according to claim 1, wherein the tab of the electrical contact is connected to a source. 7. The connector assembly according to claim 1, wherein the tab of the electrical contact is connected to a receiver. 8. The connector assembly according to claim 1, wherein the contact band of the electrical contact and a contact band of a second electrical contact comprises are offset longitudinally. 9. The connector assembly according to claim 1, wherein the electrical contact is stamped from a metal sheet or the spring contact is a canted coil spring. 10. The connector assembly according to claim 1, wherein the contact band defines a plane and wherein the tab has an extension portion extending orthogonally to the plane. 11. The connector assembly according to claim 1, wherein the pin and the contact element are formed by insert molding. 12. The connector assembly according to claim 1, wherein the electrical contact is formed by metal injection molding or is molded by metal injection. 13. The connector assembly according to claim 1, wherein the electrical contact comprises copper or a copper alloy. 14. A method of using the connector assembly of claim 1, comprising the step of separating the pin from the bore of the housing. 15. A method of making the connector assembly of claim 1, comprising the step of assembling the contact assembly to the pin. 16. A connector assembly comprising:
a housing comprising an exterior surface and an interior surface defining a bore; a pin located in the bore of the housing, the pin comprising a tip section and a tail section, said tip section having a diameter that is larger than a diameter of the tail section; a spring contact contacting a contact band of an electrical contact, said electrical contact comprising a tab extending from the contact band and said spring contact and said contact band located inside the bore of the housing; and wherein said tab extends along a length of said tail section of said and is orthogonal to a plane defined by the contact band. 17. The connector assembly of claim 16, wherein the contact band is located in a pin groove of the pin. 18. The connector assembly of claim 17, wherein said tab is embedded inside said tail section. 19. The connector assembly of claim 17, wherein said contact band has a gap and two side edges defining the gap. 20. The connector assembly of claim 16, further comprising a second spring contact and a second contact band of a second contact element, said second spring contact and said second contact band located in the bore of the housing. 21. The connector assembly of claim 16, wherein the spring contact is located in a pin groove of the pin and a second spring contact is located in a housing groove of the housing. | 2,800 |
11,505 | 11,505 | 15,176,272 | 2,859 | A vehicle includes a traction battery. The vehicle further includes a controller programmed to generate a capacity estimate of the traction battery and, in response to an amount of energy supplied to the traction battery during a charge cycle being less than an estimated amount of energy stored in the traction battery during the charge cycle, detect that the capacity of the traction battery has changed and alter an operating strategy of the traction battery until the capacity estimate is updated. | 1. A vehicle power system comprising:
a controller programmed to operate a traction battery within a first state of charge range and, in response to an amount of energy supplied to the traction battery during a charge cycle being less than an estimated amount of energy stored in the traction battery during the charge cycle, operate the traction battery within a second state of charge range that is narrower than the first state of charge range. 2. The system of claim 1 wherein the controller is further programmed to estimate an amount of energy stored in the traction battery during the charge cycle as a product of a capacity estimate and an area under a curve representing open-circuit voltage as a function of state of charge over a state of charge interval corresponding to the charge cycle. 3. The system of claim 1 wherein the controller is further programmed to estimate the amount of energy supplied to the traction battery as an integration of a product of a traction battery terminal voltage and a battery current during the charge cycle. 4. The system of claim 1 wherein the controller is further programmed to, in response to the amount of energy supplied being less than the estimated amount of energy stored, trigger an estimation cycle to update a capacity estimate of the traction battery. 5. The system of claim 4 wherein the controller is further programmed to, in response to completion of the estimation cycle, operate the traction battery within a third state of charge range that is based on the capacity estimate. 6. The system of claim 1 wherein the controller is further programmed to estimate a state of charge of the traction battery according to a weighted function of a voltage-based state of charge estimate and a current-based state of charge estimate and, in response to the amount of energy supplied being less than the estimated amount of energy stored, increase a first weighting factor associated with the voltage-based state of charge estimate and decrease a second weighting factor associated with the current-based state of charge estimate. 7. The system of claim 1 wherein a maximum state of charge associated with the second state of charge range is less than a maximum state of charge associated with the first state of charge range. 8. A method comprising:
operating by a controller a traction battery of a vehicle such that a state of charge is within a state of charge operating range; and narrowing by the controller the state of charge operating range in response to an amount of energy supplied to the traction battery during a charge cycle being less than an estimated amount of energy stored in the traction battery during the charge cycle. 9. The method of claim 8 further comprising estimating by the controller a capacity of the traction battery in response to the amount of energy supplied being less than the estimated amount of energy stored. 10. The method of claim 8 further comprising estimating by the controller the amount of energy supplied as an integration of a product of a traction battery terminal voltage and a battery current during the charge cycle. 11. The method of claim 8 further comprising estimating by the controller the amount of energy stored in the traction battery during the charge cycle as a product of a capacity estimate and an area under a curve representing open-circuit voltage as a function of state of charge over a state of charge interval corresponding to the charge cycle. 12. The method of claim 8 further comprising estimating by the controller the state of charge of the traction battery according to a weighted function of a voltage-based state of charge estimate and a current-based state of charge estimate. 13. The method of claim 12 further comprising, in response to the amount of energy supplied being less than the estimated amount of energy stored, increasing a first weighting factor associated with the voltage-based state of charge estimate and decreasing a second weighting factor associated with the current-based state of charge estimate. 14. A vehicle comprising:
a traction battery; and a controller programmed to operate the traction battery within a state of charge operating range defined by an upper limit and a lower limit and, in response to an amount of energy supplied to the traction battery during a charge cycle being less than an estimated amount of energy stored in the traction battery during the charge cycle, reduce the upper limit. 15. The vehicle of claim 14 wherein the controller is further programmed to estimate the amount of energy stored in the traction battery during the charge cycle as a product of a capacity estimate of the traction battery and an area under a curve representing open-circuit voltage as a function of state of charge over a state of charge interval corresponding to the charge cycle. 16. The vehicle of claim 14 wherein the controller is further programmed to estimate the amount of energy supplied to the traction battery as an integration of a product of a traction battery terminal voltage and a battery current during the charge cycle. 17. The vehicle of claim 14 wherein the controller is further programmed to, in response to the amount of energy supplied being less than the estimated amount of energy stored, increase the lower limit. 18. The vehicle of claim 14 wherein the controller is further programmed to, in response to the amount of energy supplied being less than the estimated amount of energy stored, initiate an estimation cycle for a battery capacity estimate. 19. The vehicle of claim 18 wherein the controller is further programmed to, in response to completion of the estimation cycle, change the upper limit based on the battery capacity estimate. 20. The vehicle of claim 14 wherein the controller is further programmed to estimate a state of charge of the traction battery according to a weighted function of a voltage-based state of charge estimate and a current-based state of charge estimate and, in response to the amount of energy supplied being less than the estimated amount of energy stored, increase a first weighting factor associated with the voltage-based state of charge estimate and decrease a second weighting factor associated with the current-based state of charge estimate. | A vehicle includes a traction battery. The vehicle further includes a controller programmed to generate a capacity estimate of the traction battery and, in response to an amount of energy supplied to the traction battery during a charge cycle being less than an estimated amount of energy stored in the traction battery during the charge cycle, detect that the capacity of the traction battery has changed and alter an operating strategy of the traction battery until the capacity estimate is updated.1. A vehicle power system comprising:
a controller programmed to operate a traction battery within a first state of charge range and, in response to an amount of energy supplied to the traction battery during a charge cycle being less than an estimated amount of energy stored in the traction battery during the charge cycle, operate the traction battery within a second state of charge range that is narrower than the first state of charge range. 2. The system of claim 1 wherein the controller is further programmed to estimate an amount of energy stored in the traction battery during the charge cycle as a product of a capacity estimate and an area under a curve representing open-circuit voltage as a function of state of charge over a state of charge interval corresponding to the charge cycle. 3. The system of claim 1 wherein the controller is further programmed to estimate the amount of energy supplied to the traction battery as an integration of a product of a traction battery terminal voltage and a battery current during the charge cycle. 4. The system of claim 1 wherein the controller is further programmed to, in response to the amount of energy supplied being less than the estimated amount of energy stored, trigger an estimation cycle to update a capacity estimate of the traction battery. 5. The system of claim 4 wherein the controller is further programmed to, in response to completion of the estimation cycle, operate the traction battery within a third state of charge range that is based on the capacity estimate. 6. The system of claim 1 wherein the controller is further programmed to estimate a state of charge of the traction battery according to a weighted function of a voltage-based state of charge estimate and a current-based state of charge estimate and, in response to the amount of energy supplied being less than the estimated amount of energy stored, increase a first weighting factor associated with the voltage-based state of charge estimate and decrease a second weighting factor associated with the current-based state of charge estimate. 7. The system of claim 1 wherein a maximum state of charge associated with the second state of charge range is less than a maximum state of charge associated with the first state of charge range. 8. A method comprising:
operating by a controller a traction battery of a vehicle such that a state of charge is within a state of charge operating range; and narrowing by the controller the state of charge operating range in response to an amount of energy supplied to the traction battery during a charge cycle being less than an estimated amount of energy stored in the traction battery during the charge cycle. 9. The method of claim 8 further comprising estimating by the controller a capacity of the traction battery in response to the amount of energy supplied being less than the estimated amount of energy stored. 10. The method of claim 8 further comprising estimating by the controller the amount of energy supplied as an integration of a product of a traction battery terminal voltage and a battery current during the charge cycle. 11. The method of claim 8 further comprising estimating by the controller the amount of energy stored in the traction battery during the charge cycle as a product of a capacity estimate and an area under a curve representing open-circuit voltage as a function of state of charge over a state of charge interval corresponding to the charge cycle. 12. The method of claim 8 further comprising estimating by the controller the state of charge of the traction battery according to a weighted function of a voltage-based state of charge estimate and a current-based state of charge estimate. 13. The method of claim 12 further comprising, in response to the amount of energy supplied being less than the estimated amount of energy stored, increasing a first weighting factor associated with the voltage-based state of charge estimate and decreasing a second weighting factor associated with the current-based state of charge estimate. 14. A vehicle comprising:
a traction battery; and a controller programmed to operate the traction battery within a state of charge operating range defined by an upper limit and a lower limit and, in response to an amount of energy supplied to the traction battery during a charge cycle being less than an estimated amount of energy stored in the traction battery during the charge cycle, reduce the upper limit. 15. The vehicle of claim 14 wherein the controller is further programmed to estimate the amount of energy stored in the traction battery during the charge cycle as a product of a capacity estimate of the traction battery and an area under a curve representing open-circuit voltage as a function of state of charge over a state of charge interval corresponding to the charge cycle. 16. The vehicle of claim 14 wherein the controller is further programmed to estimate the amount of energy supplied to the traction battery as an integration of a product of a traction battery terminal voltage and a battery current during the charge cycle. 17. The vehicle of claim 14 wherein the controller is further programmed to, in response to the amount of energy supplied being less than the estimated amount of energy stored, increase the lower limit. 18. The vehicle of claim 14 wherein the controller is further programmed to, in response to the amount of energy supplied being less than the estimated amount of energy stored, initiate an estimation cycle for a battery capacity estimate. 19. The vehicle of claim 18 wherein the controller is further programmed to, in response to completion of the estimation cycle, change the upper limit based on the battery capacity estimate. 20. The vehicle of claim 14 wherein the controller is further programmed to estimate a state of charge of the traction battery according to a weighted function of a voltage-based state of charge estimate and a current-based state of charge estimate and, in response to the amount of energy supplied being less than the estimated amount of energy stored, increase a first weighting factor associated with the voltage-based state of charge estimate and decrease a second weighting factor associated with the current-based state of charge estimate. | 2,800 |
11,506 | 11,506 | 14,791,429 | 2,849 | A control node enables distributed grid control. The control node monitors power generation and power demand at a point of common coupling (PCC) between a utility power grid and all devices downstream from the PCC. The control node can have one or more consumer nodes, which can be or include customer premises, and one or more energy sources connected downstream. The control node monitors and controls the interface via the PCC from the same side of the PCC as the power generation and power demand. The control can include adjusting the interface between the control node and the central grid management via the PCC to maintain compliance with grid regulations at the PCC. | 1. A method for controlling a power grid, comprising:
monitoring power generation and power demand at a point of common coupling (PCC) to a utility power grid with a control node, on a same side of the PCC as the power generation and power demand, and on an opposite side of the PCC as central grid management; and adjusting an interface between the control node and the central grid management via the PCC to maintain compliance with grid regulations at the PCC. 2. The method of claim 1, wherein the PCC comprises a connection of a customer premises to the grid. 3. The method of claim 1, wherein the PCC comprises a connection to the grid of a neighborhood containing multiple customer premises. 4. The method of claim 1, wherein the PCC comprises a transformer of the grid. 5. The method of claim 1, wherein the PCC includes at least one additional PCC downstream from the grid. 6. The method of claim 1, wherein monitoring the power generation comprises monitoring power generated by a renewable energy source at a customer premises. 7. The method of claim 1, wherein adjusting the interface comprises adjusting a phase offset of reactive power at the PCC. 8. The method of claim 7, wherein adjusting the phase offset of the reactive power comprises changing an amount of reactive power output via the PCC to the grid from power generation resources on the same side of the PCC. 9. The method of claim 1, wherein adjusting the interface comprises adjusting an amount of real power output via the PCC to the grid from power generation resources on the same side of the PCC. 10. The method of claim 1, wherein monitoring comprises receiving dispatch information from the grid management. 11. An apparatus for controlling a power grid, comprising:
a grid connector to couple to the power grid at a point of common coupling (PCC) for a consumer node; a controller to monitor power generation and power demand at the PCC on a side of the PCC of the consumer node; and a power converter to adjust an interface between the apparatus and central grid management via the PCC to maintain compliance with grid regulations at the PCC from the side of the PCC of the consumer node. 12. The apparatus of claim 11, wherein the PCC comprises a connection point including a connection to the grid of a customer premises to the grid, a connection to the grid of a subsection of the grid containing multiple customer premises, a connection of a neighborhood to the grid, or a transformer of the grid infrastructure. 13. The apparatus of claim 11, wherein the controller is to monitor the power generation including monitoring power generated by a renewable energy source at the consumer node. 14. The apparatus of claim 11, wherein the power converter is to adjust the interface including adjusting a reactive power component of power as seen from the power grid at the PCC. 15. The apparatus of claim 11, wherein the power converter is to adjust the interface including adjusting a real power component of power as seen from the power grid at the PCC. 16. A power metering device, comprising:
a grid connector to couple to the power grid at a point of common coupling (PCC) for a consumer node; a controller to monitor power generation and power demand at the PCC on a side of the PCC of the consumer node; and I/O (input/output) to connect to a power converter, the controller to send one or more signals via the I/O to the power converter to cause the power converter to adjust an interface between the apparatus and central grid management via the PCC to maintain compliance with grid regulations at the PCC from the side of the PCC of the consumer node in response to monitoring by the power metering device. 17. The power metering device of claim 16, wherein the PCC comprises a connection point including a connection to the grid of a customer premises to the grid, a connection to the grid of a subsection of the grid containing multiple customer premises, a connection of a neighborhood to the grid, or a transformer of the grid infrastructure. 18. The power metering device of claim 16, wherein the controller is to monitor the power generation including monitoring power generated by a renewable energy source at the consumer node. 19. The power metering device of claim 16, wherein the controller is to send a signal via the I/O to cause the power converter to adjust the interface including adjusting a reactive power component of power as seen from the power grid at the PCC. 20. The power metering device of claim 16, wherein the controller is to send a signal via the I/O to cause the power converter to adjust the interface including adjusting a real power component of power as seen from the power grid at the PCC. | A control node enables distributed grid control. The control node monitors power generation and power demand at a point of common coupling (PCC) between a utility power grid and all devices downstream from the PCC. The control node can have one or more consumer nodes, which can be or include customer premises, and one or more energy sources connected downstream. The control node monitors and controls the interface via the PCC from the same side of the PCC as the power generation and power demand. The control can include adjusting the interface between the control node and the central grid management via the PCC to maintain compliance with grid regulations at the PCC.1. A method for controlling a power grid, comprising:
monitoring power generation and power demand at a point of common coupling (PCC) to a utility power grid with a control node, on a same side of the PCC as the power generation and power demand, and on an opposite side of the PCC as central grid management; and adjusting an interface between the control node and the central grid management via the PCC to maintain compliance with grid regulations at the PCC. 2. The method of claim 1, wherein the PCC comprises a connection of a customer premises to the grid. 3. The method of claim 1, wherein the PCC comprises a connection to the grid of a neighborhood containing multiple customer premises. 4. The method of claim 1, wherein the PCC comprises a transformer of the grid. 5. The method of claim 1, wherein the PCC includes at least one additional PCC downstream from the grid. 6. The method of claim 1, wherein monitoring the power generation comprises monitoring power generated by a renewable energy source at a customer premises. 7. The method of claim 1, wherein adjusting the interface comprises adjusting a phase offset of reactive power at the PCC. 8. The method of claim 7, wherein adjusting the phase offset of the reactive power comprises changing an amount of reactive power output via the PCC to the grid from power generation resources on the same side of the PCC. 9. The method of claim 1, wherein adjusting the interface comprises adjusting an amount of real power output via the PCC to the grid from power generation resources on the same side of the PCC. 10. The method of claim 1, wherein monitoring comprises receiving dispatch information from the grid management. 11. An apparatus for controlling a power grid, comprising:
a grid connector to couple to the power grid at a point of common coupling (PCC) for a consumer node; a controller to monitor power generation and power demand at the PCC on a side of the PCC of the consumer node; and a power converter to adjust an interface between the apparatus and central grid management via the PCC to maintain compliance with grid regulations at the PCC from the side of the PCC of the consumer node. 12. The apparatus of claim 11, wherein the PCC comprises a connection point including a connection to the grid of a customer premises to the grid, a connection to the grid of a subsection of the grid containing multiple customer premises, a connection of a neighborhood to the grid, or a transformer of the grid infrastructure. 13. The apparatus of claim 11, wherein the controller is to monitor the power generation including monitoring power generated by a renewable energy source at the consumer node. 14. The apparatus of claim 11, wherein the power converter is to adjust the interface including adjusting a reactive power component of power as seen from the power grid at the PCC. 15. The apparatus of claim 11, wherein the power converter is to adjust the interface including adjusting a real power component of power as seen from the power grid at the PCC. 16. A power metering device, comprising:
a grid connector to couple to the power grid at a point of common coupling (PCC) for a consumer node; a controller to monitor power generation and power demand at the PCC on a side of the PCC of the consumer node; and I/O (input/output) to connect to a power converter, the controller to send one or more signals via the I/O to the power converter to cause the power converter to adjust an interface between the apparatus and central grid management via the PCC to maintain compliance with grid regulations at the PCC from the side of the PCC of the consumer node in response to monitoring by the power metering device. 17. The power metering device of claim 16, wherein the PCC comprises a connection point including a connection to the grid of a customer premises to the grid, a connection to the grid of a subsection of the grid containing multiple customer premises, a connection of a neighborhood to the grid, or a transformer of the grid infrastructure. 18. The power metering device of claim 16, wherein the controller is to monitor the power generation including monitoring power generated by a renewable energy source at the consumer node. 19. The power metering device of claim 16, wherein the controller is to send a signal via the I/O to cause the power converter to adjust the interface including adjusting a reactive power component of power as seen from the power grid at the PCC. 20. The power metering device of claim 16, wherein the controller is to send a signal via the I/O to cause the power converter to adjust the interface including adjusting a real power component of power as seen from the power grid at the PCC. | 2,800 |
11,507 | 11,507 | 15,329,052 | 2,853 | A printer may comprise a printhead comprising a number of nozzles, an immiscible fluid applicator, and a processor to instruct the immiscible fluid applicator to apply immiscible fluid onto the surface of the printhead to cap the number of nozzles. A printer subassembly may comprise an immiscible fluid applicator to wipe a layer of immiscible fluid onto a surface of a printhead. A printer may comprise a page wide array printhead, an immiscible fluid applicator to wipe a layer of immiscible fluid over a printhead to cap nozzles over the width of the printhead, and a controller to instruct the printhead to print after the layer of immiscible fluid has been applied over the printhead so that ink ejects through the immiscible fluid while non-used nozzles remain capped by the immiscible fluid layer. | 1. A printer comprising:
a printhead comprising a number of nozzles; an immiscible fluid applicator; and a processor to instruct the immiscible fluid applicator to apply immiscible fluid to the surface of the printhead to cap the number of nozzles. 2. The printer of claim 1, in which the immiscible fluid applicator comprises a wick. 3. The printer of claim 2, in which the wick is to supply an amount of immiscible fluid to a wiper and in which the wiper is to wipe the amount of immiscible fluid onto the surface of the printhead. 4. The printer of claim 2, in which the immiscible fluid applicator further comprises a wiper to wipe the printhead after immiscible fluid has been applied to the printhead by the wick to leave an amount of immiscible fluid on the printhead. 5. The printer of claim 1, in which the immiscible fluid applicator comprises a roller to supply an amount of immiscible fluid to the surface of the printhead. 6. The printer of claim 5, in which the immiscible fluid applicator further comprises an immiscible fluid supply to supply an amount of immiscible fluid to the roller. 7. The printer of claim 5, in which the immiscible fluid applicator further comprises a wick to supply an amount of immiscible fluid to the roller. 8. The printer of claim 1, in which the immiscible fluid applicator comprises a wiper comprising an immiscible fluid channel in which the wiper wipes across the surface of the printhead while the immiscible fluid channel in the wiper ejects an amount of immiscible fluid. 9. The printer of claim 1, in which the immiscible fluid applicator comprises a porous web-wipe to apply an amount of immiscible fluid onto the surface of the printhead. 10. The printer of claim 9, in which the immiscible fluid applicator further comprises a blade to squeegee an amount of immiscible fluid from the web-wipe and onto the surface of the printhead. 11. A printer subassembly comprising:
an immiscible fluid applicator to wipe a layer of immiscible fluid onto a surface of a printhead. 12. The printer subassembly of claim 11, in which the immiscible fluid applicator comprises a roller in which the roller supplies an amount of immiscible fluid to the surface of the printhead. 13. The printer subassembly of claim 11, in which the immiscible fluid applicator comprises a wiper comprising an immiscible fluid channel in which the wiper wipes across the surface of the printhead while the immiscible fluid channel in the rubber wiper ejects an amount of immiscible fluid. 14. The printer subassembly of claim 9, in which the immiscible fluid applicator comprises a porous web-wipe to supply an amount of immiscible fluid onto the surface of the printhead from a porous web-wipe. 15. A printer comprising:
a page wide array printhead; an immiscible fluid applicator to wipe a layer of immiscible fluid over a printhead to cap nozzles over the width of the printhead; and a controller to instruct the printhead to print after the layer of immiscible fluid has been applied over the printhead so that ink ejects through the immiscible fluid while non-used nozzles remain capped by the immiscible fluid layer. | A printer may comprise a printhead comprising a number of nozzles, an immiscible fluid applicator, and a processor to instruct the immiscible fluid applicator to apply immiscible fluid onto the surface of the printhead to cap the number of nozzles. A printer subassembly may comprise an immiscible fluid applicator to wipe a layer of immiscible fluid onto a surface of a printhead. A printer may comprise a page wide array printhead, an immiscible fluid applicator to wipe a layer of immiscible fluid over a printhead to cap nozzles over the width of the printhead, and a controller to instruct the printhead to print after the layer of immiscible fluid has been applied over the printhead so that ink ejects through the immiscible fluid while non-used nozzles remain capped by the immiscible fluid layer.1. A printer comprising:
a printhead comprising a number of nozzles; an immiscible fluid applicator; and a processor to instruct the immiscible fluid applicator to apply immiscible fluid to the surface of the printhead to cap the number of nozzles. 2. The printer of claim 1, in which the immiscible fluid applicator comprises a wick. 3. The printer of claim 2, in which the wick is to supply an amount of immiscible fluid to a wiper and in which the wiper is to wipe the amount of immiscible fluid onto the surface of the printhead. 4. The printer of claim 2, in which the immiscible fluid applicator further comprises a wiper to wipe the printhead after immiscible fluid has been applied to the printhead by the wick to leave an amount of immiscible fluid on the printhead. 5. The printer of claim 1, in which the immiscible fluid applicator comprises a roller to supply an amount of immiscible fluid to the surface of the printhead. 6. The printer of claim 5, in which the immiscible fluid applicator further comprises an immiscible fluid supply to supply an amount of immiscible fluid to the roller. 7. The printer of claim 5, in which the immiscible fluid applicator further comprises a wick to supply an amount of immiscible fluid to the roller. 8. The printer of claim 1, in which the immiscible fluid applicator comprises a wiper comprising an immiscible fluid channel in which the wiper wipes across the surface of the printhead while the immiscible fluid channel in the wiper ejects an amount of immiscible fluid. 9. The printer of claim 1, in which the immiscible fluid applicator comprises a porous web-wipe to apply an amount of immiscible fluid onto the surface of the printhead. 10. The printer of claim 9, in which the immiscible fluid applicator further comprises a blade to squeegee an amount of immiscible fluid from the web-wipe and onto the surface of the printhead. 11. A printer subassembly comprising:
an immiscible fluid applicator to wipe a layer of immiscible fluid onto a surface of a printhead. 12. The printer subassembly of claim 11, in which the immiscible fluid applicator comprises a roller in which the roller supplies an amount of immiscible fluid to the surface of the printhead. 13. The printer subassembly of claim 11, in which the immiscible fluid applicator comprises a wiper comprising an immiscible fluid channel in which the wiper wipes across the surface of the printhead while the immiscible fluid channel in the rubber wiper ejects an amount of immiscible fluid. 14. The printer subassembly of claim 9, in which the immiscible fluid applicator comprises a porous web-wipe to supply an amount of immiscible fluid onto the surface of the printhead from a porous web-wipe. 15. A printer comprising:
a page wide array printhead; an immiscible fluid applicator to wipe a layer of immiscible fluid over a printhead to cap nozzles over the width of the printhead; and a controller to instruct the printhead to print after the layer of immiscible fluid has been applied over the printhead so that ink ejects through the immiscible fluid while non-used nozzles remain capped by the immiscible fluid layer. | 2,800 |
11,508 | 11,508 | 14,094,776 | 2,865 | The invention relates to the method, device, and a machine-readable data carrier used for building a geological model of oil or other mineral deposit. In particular, the invention refers to the method, device, and machine-readable data carrier used for determining the position of marker depth coordinates in wells W from a reference group of wells at the building of a geological model. A technical result is the improved accuracy of the evaluation of parameters used in the building of a geological model describing the location of oil or other deposits. The invention makes it possible, for markers chosen as an initial solution, to calculate the marker depth in each well to maximize the total correlation. For each marker in the set, a functional is defined as the sum of correlation coefficients of a set of well-logging methods for pairs of wells located within a specified distance from one another. | 1. A computer-implemented method for determining a position of coordinates of a marker depth in well W for building of a geological model of a deposit, the computer-implemented method comprising:
1) determining wells W and wells located within a specified neighborhood of the well W, the radius of the neighborhood being R; 2) determining the values of the mark of marker depth {zi}, i=0, . . . , n in each well W and in wells located within a specified neighborhood of the well; 3) evaluating the functional C in points where the value of marker depth {zi} is known; 4) composing gradient vectors in points where the value of marker depth {zi} is known; 5) smoothing the gradient vector by replacing each component of the gradient vector in the well W by the mean value of components of gradient vector in wells in the neighborhood with radius R; 6) searching for a value of the functional C greater than the previously found value of the functional C within a segment of specified length starting from the marker depth mark {zi} in the direction of the gradient vector with the current value of marker depth mark {zi} assumed determined if no such value is found; 7) improving the obtained value of marker depth mark {zi} by searching for a larger value of marker depth {zi} within the specified step; 8) smoothing the gradient vector for the marker depth mark {zi}, at which the functional C is maximal, by replacing each component of the gradient vector in well W by the mean value of components of the gradient vector in wells in the neighborhood with radius R reduced by a specified value; 9) sorting the marker depth marks {zi} by depth; and 10) reiterating the steps 4)-10) of the method until a larger value of functional C is found. 2. The computer-implemented method according to claim 1, characterized in that the smoothing is performed by moving-average procedure, the smoothing coefficient being a radius of window. 3. A computerized system for determining a position of marker depth coordinates in wells W of a reference group of wells at the building of a geological model of a deposit, the computerized system comprising:
one or a plurality of processors; input/output moduli (I/O); a machine-readable data carrier (memory), containing a program code, which induces the processor or processors to implement steps comprising: 1) determining well W and wells located within a specified neighborhood of the well W, the neighborhood radius being R; 2) determining the marker depth mark {zi}, i=0, . . . , n in each well W and wells located within a specified neighborhood of the well W; 3) evaluating the functional C in points, for which the value of marker depth mark {zi} is available; 4) forming gradient vectors for the points, for which the value of marker depth mark {zi} is available; 5) smoothing the gradient vector by replacing each component of the gradient vector in well W by the mean value of components of gradient vector in wells in the neighborhood with radius R; 6) searching for a value of the functional C greater than the previously found value of the functional C within a segment of specified length starting from the marker depth mark {zi} in the direction of the gradient vector with the current value of marker depth mark {zi} assumed determined when no such value is found; 7) improving the obtained value of marker depth mark {zi} by searching for a larger value of marker depth {zi} within the specified step; 8) smoothing the gradient vector for the marker depth mark {zi} at which the functional C is maximal by replacing each component of the gradient vector in well W by the mean value of components of gradient vector in the wells in the neighborhood with radius R reduced by a specified value; 9) sorting the marker depth marks {zi} by depth; and 10) reiterating the steps 4)-10) of the method until a larger value of the functional C is found. 4. The computerized system according to claim 3, characterized in that the smoothing is performed by moving-average procedure, the smoothing coefficient being the radius of window. 5. A non-transitory computer-readable medium embodying a asset of instructions, which, when executed by one or more processors, cause the one or more processors to perform a computer-implemented method for determining a position of coordinates of a marker depth in well W for building of a geological model of a deposit, the computer-implemented method comprising:
1) determining wells W and wells located within a specified neighborhood of the well W, the radius of the neighborhood being R; 2) determining the values of the mark of marker depth {zi}, i=0, . . . , n in each well W and in wells located within a specified neighborhood of the well; 3) evaluating the functional C in points where the value of marker depth {zi} is known; 4) composing gradient vectors in points where the value of marker depth {zi} is known; 5) smoothing the gradient vector by replacing each component of the gradient vector in the well W by the mean value of components of gradient vector in wells in the neighborhood with radius R; 6) searching for a value of the functional C greater than the previously found value of the functional C within a segment of specified length starting from the marker depth mark {zi} in the direction of the gradient vector with the current value of marker depth mark {zi} assumed determined if no such value is found; 7) improving the obtained value of marker depth mark {zi} by searching for a larger value of marker depth {zi} within the specified step; 8) smoothing the gradient vector for the marker depth mark {zi}, at which the functional C is maximal, by replacing each component of the gradient vector in well W by the mean value of components of the gradient vector in wells in the neighborhood with radius R reduced by a specified value; 9) sorting the marker depth marks {zi} by depth; and 10) reiterating the steps 4)-10) of the method until a larger value of functional C is found. 6. The non-transitory computer-readable medium according to claim 5, characterized in that the smoothing is performed by moving-average procedure, the smoothing coefficient being a radius of window. | The invention relates to the method, device, and a machine-readable data carrier used for building a geological model of oil or other mineral deposit. In particular, the invention refers to the method, device, and machine-readable data carrier used for determining the position of marker depth coordinates in wells W from a reference group of wells at the building of a geological model. A technical result is the improved accuracy of the evaluation of parameters used in the building of a geological model describing the location of oil or other deposits. The invention makes it possible, for markers chosen as an initial solution, to calculate the marker depth in each well to maximize the total correlation. For each marker in the set, a functional is defined as the sum of correlation coefficients of a set of well-logging methods for pairs of wells located within a specified distance from one another.1. A computer-implemented method for determining a position of coordinates of a marker depth in well W for building of a geological model of a deposit, the computer-implemented method comprising:
1) determining wells W and wells located within a specified neighborhood of the well W, the radius of the neighborhood being R; 2) determining the values of the mark of marker depth {zi}, i=0, . . . , n in each well W and in wells located within a specified neighborhood of the well; 3) evaluating the functional C in points where the value of marker depth {zi} is known; 4) composing gradient vectors in points where the value of marker depth {zi} is known; 5) smoothing the gradient vector by replacing each component of the gradient vector in the well W by the mean value of components of gradient vector in wells in the neighborhood with radius R; 6) searching for a value of the functional C greater than the previously found value of the functional C within a segment of specified length starting from the marker depth mark {zi} in the direction of the gradient vector with the current value of marker depth mark {zi} assumed determined if no such value is found; 7) improving the obtained value of marker depth mark {zi} by searching for a larger value of marker depth {zi} within the specified step; 8) smoothing the gradient vector for the marker depth mark {zi}, at which the functional C is maximal, by replacing each component of the gradient vector in well W by the mean value of components of the gradient vector in wells in the neighborhood with radius R reduced by a specified value; 9) sorting the marker depth marks {zi} by depth; and 10) reiterating the steps 4)-10) of the method until a larger value of functional C is found. 2. The computer-implemented method according to claim 1, characterized in that the smoothing is performed by moving-average procedure, the smoothing coefficient being a radius of window. 3. A computerized system for determining a position of marker depth coordinates in wells W of a reference group of wells at the building of a geological model of a deposit, the computerized system comprising:
one or a plurality of processors; input/output moduli (I/O); a machine-readable data carrier (memory), containing a program code, which induces the processor or processors to implement steps comprising: 1) determining well W and wells located within a specified neighborhood of the well W, the neighborhood radius being R; 2) determining the marker depth mark {zi}, i=0, . . . , n in each well W and wells located within a specified neighborhood of the well W; 3) evaluating the functional C in points, for which the value of marker depth mark {zi} is available; 4) forming gradient vectors for the points, for which the value of marker depth mark {zi} is available; 5) smoothing the gradient vector by replacing each component of the gradient vector in well W by the mean value of components of gradient vector in wells in the neighborhood with radius R; 6) searching for a value of the functional C greater than the previously found value of the functional C within a segment of specified length starting from the marker depth mark {zi} in the direction of the gradient vector with the current value of marker depth mark {zi} assumed determined when no such value is found; 7) improving the obtained value of marker depth mark {zi} by searching for a larger value of marker depth {zi} within the specified step; 8) smoothing the gradient vector for the marker depth mark {zi} at which the functional C is maximal by replacing each component of the gradient vector in well W by the mean value of components of gradient vector in the wells in the neighborhood with radius R reduced by a specified value; 9) sorting the marker depth marks {zi} by depth; and 10) reiterating the steps 4)-10) of the method until a larger value of the functional C is found. 4. The computerized system according to claim 3, characterized in that the smoothing is performed by moving-average procedure, the smoothing coefficient being the radius of window. 5. A non-transitory computer-readable medium embodying a asset of instructions, which, when executed by one or more processors, cause the one or more processors to perform a computer-implemented method for determining a position of coordinates of a marker depth in well W for building of a geological model of a deposit, the computer-implemented method comprising:
1) determining wells W and wells located within a specified neighborhood of the well W, the radius of the neighborhood being R; 2) determining the values of the mark of marker depth {zi}, i=0, . . . , n in each well W and in wells located within a specified neighborhood of the well; 3) evaluating the functional C in points where the value of marker depth {zi} is known; 4) composing gradient vectors in points where the value of marker depth {zi} is known; 5) smoothing the gradient vector by replacing each component of the gradient vector in the well W by the mean value of components of gradient vector in wells in the neighborhood with radius R; 6) searching for a value of the functional C greater than the previously found value of the functional C within a segment of specified length starting from the marker depth mark {zi} in the direction of the gradient vector with the current value of marker depth mark {zi} assumed determined if no such value is found; 7) improving the obtained value of marker depth mark {zi} by searching for a larger value of marker depth {zi} within the specified step; 8) smoothing the gradient vector for the marker depth mark {zi}, at which the functional C is maximal, by replacing each component of the gradient vector in well W by the mean value of components of the gradient vector in wells in the neighborhood with radius R reduced by a specified value; 9) sorting the marker depth marks {zi} by depth; and 10) reiterating the steps 4)-10) of the method until a larger value of functional C is found. 6. The non-transitory computer-readable medium according to claim 5, characterized in that the smoothing is performed by moving-average procedure, the smoothing coefficient being a radius of window. | 2,800 |
11,509 | 11,509 | 14,663,921 | 2,848 | A wiring board includes a first wiring layer formed on one surface of a core layer, a first insulating layer formed on the one surface of the core layer so as to cover the first wiring layer, a via wiring embedded in the first insulating layer, a second wiring layer formed on a first surface of the first insulating layer, and a second insulating layer thinner than the first insulating layer formed on the first surface of the first insulating layer so as to cover the second wiring layer. The first wiring layer comprises a pad and a plane layer provided around the pad. One end surface of the via wiring is exposed from the first surface of the first insulating layer and directly bonded to the second wiring layer. The other end surface of the via wiring is directly bonded to the pad in the first insulating layer. | 1. A wiring board comprising:
a core layer, a first wiring layer formed on one surface of the core layer, a first insulating layer formed on the one surface of the core layer so as to cover the first wiring layer, a via wiring embedded in the first insulating layer, a second wiring layer formed on a first surface of the first insulating layer, the first surface being an opposite surface of a surface in contact with the core layer; and a second insulating layer formed on the first surface of the first insulating layer so as to cover the second wiring layer, the second insulating layer being thinner than the first insulating layer, wherein the first wiring layer comprises a pad and a plane layer provided around the pad, one end surface of the via wiring is exposed from the first surface of the first insulating layer and directly bonded to the second wiring layer, and the other end surface of the via wiring is directly bonded to the pad in the first insulating layer. 2. The wiring board according to claim 1, wherein the first surface of the first insulating layer is a polished surface. 3. The wiring board according to claim 1, wherein the plane layer is connected to a ground or a power supply. 4. The wiring board according to claim 1, wherein the one end surface of the via wiring is flush with the first surface of the first insulating layer. 5. The wiring board according to claim 1, wherein the second wiring layer has a structure where an electrolytic plating layer is formed on a seed layer, and
the one end surface of the via wiring is directly bonded to the seed layer constituting the second wiring layer. 6. The wiring board according to claim 1, wherein the first insulating layer contains a filler, and
the second insulating layer contains a smaller amount of filler than the first insulating layer or does not contain any filler. 7. The wiring board according to claim 1, comprising:
a third wiring layer formed on the other surface of the core layer; a third insulating layer formed on the other surface of the core layer so as to cover the third wiring layer; a fourth wiring layer formed on a second surface of the third insulating layer, the second surface being an opposite surface of a surface in contact with the core layer, and a solder resist layer formed on the second surface of the third insulating layer so as to selectively expose the fourth wiring layer. 8. The wiring board according to claim 7, wherein the second insulating layer has an electronic component mounting surface on which an electronic component is mounted, and
the solder resist layer has an external connection terminal surface on which an external connection terminal is formed. 9. The wiring board according to claim 7, wherein the third wiring layer comprises a pad and a plane layer provided around the pad, and
the pad of the third wiring layer is connected to the pad of the first wiring layer through a through wiring penetrating the core layer. 10. The wiring board according to claim 7, wherein a resin forming the first insulating layer and the third insulating layer is non-photosensitive, and
a resin forming the second insulating layer and the solder resist layer is photosensitive. 11. The wiring board according to claim 7, wherein an elastic modulus of the first insulating layer and the third insulating layer is smaller than that of the core layer, and
an elastic modulus of the second insulating layer and the solder resist layer is smaller than that of the first insulating layer and the third insulating layer. 12. The wiring board according to claim 7, wherein a thermal expansion coefficient of the first insulating layer and the third insulating layer is greater than that of the core layer, and
a thermal expansion coefficient of the second insulating layer and the solder resist layer is greater than that of the first insulating layer and the third insulating layer. 13. The wiring board according to claim 1, wherein a wiring density of the second wiring layer is higher than a wiring density of the first wiring layer. 14. The wiring board according to claim 1, wherein a thickness of the second insulating g layer is approximately 5 to 10 m and a thickness of the first insulating layer is approximately 20 to 45 μm. | A wiring board includes a first wiring layer formed on one surface of a core layer, a first insulating layer formed on the one surface of the core layer so as to cover the first wiring layer, a via wiring embedded in the first insulating layer, a second wiring layer formed on a first surface of the first insulating layer, and a second insulating layer thinner than the first insulating layer formed on the first surface of the first insulating layer so as to cover the second wiring layer. The first wiring layer comprises a pad and a plane layer provided around the pad. One end surface of the via wiring is exposed from the first surface of the first insulating layer and directly bonded to the second wiring layer. The other end surface of the via wiring is directly bonded to the pad in the first insulating layer.1. A wiring board comprising:
a core layer, a first wiring layer formed on one surface of the core layer, a first insulating layer formed on the one surface of the core layer so as to cover the first wiring layer, a via wiring embedded in the first insulating layer, a second wiring layer formed on a first surface of the first insulating layer, the first surface being an opposite surface of a surface in contact with the core layer; and a second insulating layer formed on the first surface of the first insulating layer so as to cover the second wiring layer, the second insulating layer being thinner than the first insulating layer, wherein the first wiring layer comprises a pad and a plane layer provided around the pad, one end surface of the via wiring is exposed from the first surface of the first insulating layer and directly bonded to the second wiring layer, and the other end surface of the via wiring is directly bonded to the pad in the first insulating layer. 2. The wiring board according to claim 1, wherein the first surface of the first insulating layer is a polished surface. 3. The wiring board according to claim 1, wherein the plane layer is connected to a ground or a power supply. 4. The wiring board according to claim 1, wherein the one end surface of the via wiring is flush with the first surface of the first insulating layer. 5. The wiring board according to claim 1, wherein the second wiring layer has a structure where an electrolytic plating layer is formed on a seed layer, and
the one end surface of the via wiring is directly bonded to the seed layer constituting the second wiring layer. 6. The wiring board according to claim 1, wherein the first insulating layer contains a filler, and
the second insulating layer contains a smaller amount of filler than the first insulating layer or does not contain any filler. 7. The wiring board according to claim 1, comprising:
a third wiring layer formed on the other surface of the core layer; a third insulating layer formed on the other surface of the core layer so as to cover the third wiring layer; a fourth wiring layer formed on a second surface of the third insulating layer, the second surface being an opposite surface of a surface in contact with the core layer, and a solder resist layer formed on the second surface of the third insulating layer so as to selectively expose the fourth wiring layer. 8. The wiring board according to claim 7, wherein the second insulating layer has an electronic component mounting surface on which an electronic component is mounted, and
the solder resist layer has an external connection terminal surface on which an external connection terminal is formed. 9. The wiring board according to claim 7, wherein the third wiring layer comprises a pad and a plane layer provided around the pad, and
the pad of the third wiring layer is connected to the pad of the first wiring layer through a through wiring penetrating the core layer. 10. The wiring board according to claim 7, wherein a resin forming the first insulating layer and the third insulating layer is non-photosensitive, and
a resin forming the second insulating layer and the solder resist layer is photosensitive. 11. The wiring board according to claim 7, wherein an elastic modulus of the first insulating layer and the third insulating layer is smaller than that of the core layer, and
an elastic modulus of the second insulating layer and the solder resist layer is smaller than that of the first insulating layer and the third insulating layer. 12. The wiring board according to claim 7, wherein a thermal expansion coefficient of the first insulating layer and the third insulating layer is greater than that of the core layer, and
a thermal expansion coefficient of the second insulating layer and the solder resist layer is greater than that of the first insulating layer and the third insulating layer. 13. The wiring board according to claim 1, wherein a wiring density of the second wiring layer is higher than a wiring density of the first wiring layer. 14. The wiring board according to claim 1, wherein a thickness of the second insulating g layer is approximately 5 to 10 m and a thickness of the first insulating layer is approximately 20 to 45 μm. | 2,800 |
11,510 | 11,510 | 15,702,648 | 2,841 | An electronic device may have polymer structures such as polymer electronic device structures, gaskets for forming seals between display cover layers and housing structures, polymer structures that fill gaps between housing walls, adhesive, adhesive tapes, and other structures with polymer. To prevent degradation of the polymer from exposure to fatty acids and other potentially harmful materials, a protective enzyme may be incorporated into one or more of the polymer structures. The protective enzyme may be a lipoxygenase enzyme or other enzyme that degrades harmful substances such as fatty acids and thereby neutralizes the harmful substances and prevents damage to the polymer structures. | 1. An electronic device, comprising:
a housing; a display mounted in the housing; and a polymer gasket in a gap between the housing and the display, wherein the polymer gasket includes a protective enzyme. 2. The electronic device defined in claim 1 wherein the protective enzyme comprises a lipoxygenase enzyme. 3. The electronic device defined in claim 2 wherein the display comprises a pixel array and a display cover layer that covers the pixel array and wherein the polymer gasket is interposed between the housing and the display cover layer. 4. An electronic device, comprising:
a first structure; a second structure; a gasket; a first double-sided adhesive tape layer between the first structure and the gasket; and a second double-sided adhesive tape layer between the second structure and the gasket, wherein the first and second double-sized adhesive tape layers include an enzyme. 5. The electronic device defined in claim 4 wherein the enzyme comprises a lipoxygenase enzyme. 6. The electronic device defined in claim 5 wherein the first structure comprises a housing structure. 7. The electronic device defined in claim 6 wherein the second structure comprises a display cover layer. 8. The electronic device defined in claim 7 further comprising a pixel array that is covered by the display cover layer, wherein the housing structure comprises a metal housing wall. 9. An electronic device, comprising:
a first structure; a second structure; a layer of adhesive that couples the first structure to the second structure; and an enzyme that prevents degradation of the layer of adhesive. 10. The electronic device defined in claim 9 wherein the enzyme comprises a lipoxygenase enzyme. 11. The electronic device defined in claim 10 wherein the enzyme is in the adhesive. 12. The electronic device defined in claim 10 wherein the first and second structures are separated by a gap and wherein the layer of adhesive is in the gap, the electronic device further comprising a material in the gap adjacent to the layer of adhesive, wherein the enzyme is in the material that is in the gap adjacent to the layer of adhesive. 13. The electronic device defined in claim 12 further comprising a coating that covers the material that is in the gap adjacent to the layer of adhesive. 14. The electronic device defined in claim 13 wherein the coating comprises a fluoropolymer coating. 15. The electronic device defined in claim 10 wherein the first structure comprises an electronic device housing structure. 16. The electronic device defined in claim 15 wherein the second structure comprises an electronic device housing structure. 17. The electronic device defined in claim 10 further comprising a polymer material that is adjacent to the layer of adhesive, wherein the enzyme is in the polymer material and is not in the layer of adhesive. 18. The electronic device defined in claim 17 further comprising a hydrophobic coating that covers the polymer material. 19. The electronic device defined in claim 10 wherein the first structure comprises a polymer structure and wherein the enzyme is in the polymer structure. 20. The electronic device defined in claim 10 wherein the first and second structures comprise electronic device housing structures and wherein the enzyme is in the adhesive. | An electronic device may have polymer structures such as polymer electronic device structures, gaskets for forming seals between display cover layers and housing structures, polymer structures that fill gaps between housing walls, adhesive, adhesive tapes, and other structures with polymer. To prevent degradation of the polymer from exposure to fatty acids and other potentially harmful materials, a protective enzyme may be incorporated into one or more of the polymer structures. The protective enzyme may be a lipoxygenase enzyme or other enzyme that degrades harmful substances such as fatty acids and thereby neutralizes the harmful substances and prevents damage to the polymer structures.1. An electronic device, comprising:
a housing; a display mounted in the housing; and a polymer gasket in a gap between the housing and the display, wherein the polymer gasket includes a protective enzyme. 2. The electronic device defined in claim 1 wherein the protective enzyme comprises a lipoxygenase enzyme. 3. The electronic device defined in claim 2 wherein the display comprises a pixel array and a display cover layer that covers the pixel array and wherein the polymer gasket is interposed between the housing and the display cover layer. 4. An electronic device, comprising:
a first structure; a second structure; a gasket; a first double-sided adhesive tape layer between the first structure and the gasket; and a second double-sided adhesive tape layer between the second structure and the gasket, wherein the first and second double-sized adhesive tape layers include an enzyme. 5. The electronic device defined in claim 4 wherein the enzyme comprises a lipoxygenase enzyme. 6. The electronic device defined in claim 5 wherein the first structure comprises a housing structure. 7. The electronic device defined in claim 6 wherein the second structure comprises a display cover layer. 8. The electronic device defined in claim 7 further comprising a pixel array that is covered by the display cover layer, wherein the housing structure comprises a metal housing wall. 9. An electronic device, comprising:
a first structure; a second structure; a layer of adhesive that couples the first structure to the second structure; and an enzyme that prevents degradation of the layer of adhesive. 10. The electronic device defined in claim 9 wherein the enzyme comprises a lipoxygenase enzyme. 11. The electronic device defined in claim 10 wherein the enzyme is in the adhesive. 12. The electronic device defined in claim 10 wherein the first and second structures are separated by a gap and wherein the layer of adhesive is in the gap, the electronic device further comprising a material in the gap adjacent to the layer of adhesive, wherein the enzyme is in the material that is in the gap adjacent to the layer of adhesive. 13. The electronic device defined in claim 12 further comprising a coating that covers the material that is in the gap adjacent to the layer of adhesive. 14. The electronic device defined in claim 13 wherein the coating comprises a fluoropolymer coating. 15. The electronic device defined in claim 10 wherein the first structure comprises an electronic device housing structure. 16. The electronic device defined in claim 15 wherein the second structure comprises an electronic device housing structure. 17. The electronic device defined in claim 10 further comprising a polymer material that is adjacent to the layer of adhesive, wherein the enzyme is in the polymer material and is not in the layer of adhesive. 18. The electronic device defined in claim 17 further comprising a hydrophobic coating that covers the polymer material. 19. The electronic device defined in claim 10 wherein the first structure comprises a polymer structure and wherein the enzyme is in the polymer structure. 20. The electronic device defined in claim 10 wherein the first and second structures comprise electronic device housing structures and wherein the enzyme is in the adhesive. | 2,800 |
11,511 | 11,511 | 14,900,814 | 2,834 | A control module for an electric motor having a stator that includes a first surface, wherein cooling fluid is arranged to flow within the stator for providing cooling to the first surface, the power module comprising a power device having switching elements for controlling current flow in coil windings mounted on the stator; a control device for controlling the operation of the switching devices; a housing with a first side for mounting to the first surface of the stator, wherein the first side of the housing includes an aperture for allowing a portion of the power device to be in contract with the first surface of the stator when the housing is mounted to the first surface for providing cooling to the switching elements, wherein the control device is arranged to be mounted in the housing on an opposite side of the power device to the first side of the housing and an elastomer is located over the power device and the control device for providing an electrical insulation barrier over the switches on the power device and electrical components on the control device. | 1. A control module for an electric motor having a stator that includes a first surface, wherein cooling fluid is arranged to flow within the stator for providing cooling to the first surface, the control module comprising a power device having switching elements for controlling current flow in coil windings mounted on the stator; a control device for controlling the operation of the switching elements; a housing with a first side for mounting to the first surface of the stator, wherein the first side of the housing includes an aperture for allowing a portion of the power device to be in contract with the first surface of the stator when the housing is mounted to the first surface for providing cooling to the switching elements, wherein the control device is arranged to be mounted in the housing on an opposite side of the power device to the first side of the housing and an elastomer is located over the power device and the control device for providing an electrical insulation barrier over the switches on the power device and electrical components on the control device. 2. A control module according to claim 1, wherein the elastomer located over the power device is arranged to provide structural support to the control device. 3. A control module according to claim 1, wherein the elastomer is a silicon rubber. 4. A control module according to claim 1, wherein the power device includes an inverter for controlling current flow in a first set of coil windings mounted on the stator. 5. A control module according to claim 1, wherein the power device includes a first inverter for controlling current flow in a first set of coil windings mounted on the stator and a second inverter for controlling current flow in a second set of coil windings mounted on the stator. 6. An electric motor having a control module, the electric motor having a stator that includes a first surface, wherein cooling fluid is arranged to flow within the stator for providing cooling to the first surface, the control module comprising a power device having switching elements for controlling current flow in coil windings mounted on the stator; a control device for controlling the operation of the switching elements; a housing with a first side for mounting to the first surface of the stator, wherein the first side of the housing includes an aperture for allowing a portion of the power device to be in contract with the first surface of the stator when the housing is mounted to the first surface for providing cooling to the switching elements, wherein the control device is arranged to be mounted in the housing on an opposite side of the power device to the first side of the housing and an elastomer is located over the power device and the control device for providing an electrical insulation barrier over the switches on the power device and electrical components on the control device. 7. A method of assembling a control module for an electric motor having a stator that includes a first surface, wherein cooling fluid is arranged to flow within the stator for providing cooling to the first surface, the method comprising mounting a power device having switching elements for controlling current flow in coil windings mounted on the stator in a housing having a first side for mounting to the first surface of the stator, wherein a section of the power device is exposed through an aperture formed in the first side of the housing; mounting a control device for controlling the operation of the switching elements in the housing on an opposite side of the power device to the first side of the housing; and inserting an elastomer in the housing for providing an electrical insulation barrier over the switches on the power device and electrical components on the control device. 8. A method according to claim 7, wherein the elastomer is inserted between the power device and control device for providing structural support to the control device. | A control module for an electric motor having a stator that includes a first surface, wherein cooling fluid is arranged to flow within the stator for providing cooling to the first surface, the power module comprising a power device having switching elements for controlling current flow in coil windings mounted on the stator; a control device for controlling the operation of the switching devices; a housing with a first side for mounting to the first surface of the stator, wherein the first side of the housing includes an aperture for allowing a portion of the power device to be in contract with the first surface of the stator when the housing is mounted to the first surface for providing cooling to the switching elements, wherein the control device is arranged to be mounted in the housing on an opposite side of the power device to the first side of the housing and an elastomer is located over the power device and the control device for providing an electrical insulation barrier over the switches on the power device and electrical components on the control device.1. A control module for an electric motor having a stator that includes a first surface, wherein cooling fluid is arranged to flow within the stator for providing cooling to the first surface, the control module comprising a power device having switching elements for controlling current flow in coil windings mounted on the stator; a control device for controlling the operation of the switching elements; a housing with a first side for mounting to the first surface of the stator, wherein the first side of the housing includes an aperture for allowing a portion of the power device to be in contract with the first surface of the stator when the housing is mounted to the first surface for providing cooling to the switching elements, wherein the control device is arranged to be mounted in the housing on an opposite side of the power device to the first side of the housing and an elastomer is located over the power device and the control device for providing an electrical insulation barrier over the switches on the power device and electrical components on the control device. 2. A control module according to claim 1, wherein the elastomer located over the power device is arranged to provide structural support to the control device. 3. A control module according to claim 1, wherein the elastomer is a silicon rubber. 4. A control module according to claim 1, wherein the power device includes an inverter for controlling current flow in a first set of coil windings mounted on the stator. 5. A control module according to claim 1, wherein the power device includes a first inverter for controlling current flow in a first set of coil windings mounted on the stator and a second inverter for controlling current flow in a second set of coil windings mounted on the stator. 6. An electric motor having a control module, the electric motor having a stator that includes a first surface, wherein cooling fluid is arranged to flow within the stator for providing cooling to the first surface, the control module comprising a power device having switching elements for controlling current flow in coil windings mounted on the stator; a control device for controlling the operation of the switching elements; a housing with a first side for mounting to the first surface of the stator, wherein the first side of the housing includes an aperture for allowing a portion of the power device to be in contract with the first surface of the stator when the housing is mounted to the first surface for providing cooling to the switching elements, wherein the control device is arranged to be mounted in the housing on an opposite side of the power device to the first side of the housing and an elastomer is located over the power device and the control device for providing an electrical insulation barrier over the switches on the power device and electrical components on the control device. 7. A method of assembling a control module for an electric motor having a stator that includes a first surface, wherein cooling fluid is arranged to flow within the stator for providing cooling to the first surface, the method comprising mounting a power device having switching elements for controlling current flow in coil windings mounted on the stator in a housing having a first side for mounting to the first surface of the stator, wherein a section of the power device is exposed through an aperture formed in the first side of the housing; mounting a control device for controlling the operation of the switching elements in the housing on an opposite side of the power device to the first side of the housing; and inserting an elastomer in the housing for providing an electrical insulation barrier over the switches on the power device and electrical components on the control device. 8. A method according to claim 7, wherein the elastomer is inserted between the power device and control device for providing structural support to the control device. | 2,800 |
11,512 | 11,512 | 15,705,017 | 2,814 | An electrostatic discharge, ESD, protection structure (200) formed within a semiconductor substrate of an integrated circuit device (600). The integrated circuit device (600) comprising: a radio frequency domain (632); a digital domain (610). The ESD protection structure (200) further includes an intermediate domain located between the radio frequency domain (632) and the digital domain (610) that comprises at least one radio frequency, RF, passive or active device that exhibits an impedance characteristic that increases as a frequency of operation increases. | 1. An electrostatic discharge, ESD, protection structure formed within a semiconductor substrate of an integrated circuit device; the integrated circuit device comprising:
a radio frequency domain; a digital domain; and
the ESD protection structure characterized by:
an intermediate analog domain, located between the radio frequency domain and the digital domain, which comprises at least one radio frequency, RF, passive or active device that exhibits an impedance characteristic that increases as a radio frequency of operation increases. 2. The ESD protection structure of claim 1, wherein the at least one RF passive or active device comprises at least one ESD inductor(s). 3. The ESD protection structure of claim 1, wherein the at least one RF passive or active device is located within an input ring or output ring located between the radio frequency domain and the digital domain. 4. The ESD protection structure of claim 3, wherein the input ring or output ring comprises a plurality of antiparallel diodes configured to provide coupling between different ground domains associated with at least one of: the radio frequency domain, the digital domain. 5. The ESD protection structure of claim 1, wherein the intermediate analog domain also comprises at least two pairs of back-to-back ESD diodes coupled to the at least one RF passive or active device thereby reducing a junction capacitance at higher frequencies. 6. The ESD protection structure of claim 2, wherein the at least one ESD inductor(s) comprise a metal shielding located underneath the ESD inductor(s) and configured to reduce a capacitance effect of the at least one ESD inductor(s). 7. The ESD protection structure of claim 1, wherein the at least one RF passive or active device is integrated on a die and configured to isolate noise between domains and components in an ESD protection network. 8. The ESD protection structure of claim 1, wherein the radio frequency domain and the at least one RF passive or active device is configured to operate between 1-2.5 GHz. | An electrostatic discharge, ESD, protection structure (200) formed within a semiconductor substrate of an integrated circuit device (600). The integrated circuit device (600) comprising: a radio frequency domain (632); a digital domain (610). The ESD protection structure (200) further includes an intermediate domain located between the radio frequency domain (632) and the digital domain (610) that comprises at least one radio frequency, RF, passive or active device that exhibits an impedance characteristic that increases as a frequency of operation increases.1. An electrostatic discharge, ESD, protection structure formed within a semiconductor substrate of an integrated circuit device; the integrated circuit device comprising:
a radio frequency domain; a digital domain; and
the ESD protection structure characterized by:
an intermediate analog domain, located between the radio frequency domain and the digital domain, which comprises at least one radio frequency, RF, passive or active device that exhibits an impedance characteristic that increases as a radio frequency of operation increases. 2. The ESD protection structure of claim 1, wherein the at least one RF passive or active device comprises at least one ESD inductor(s). 3. The ESD protection structure of claim 1, wherein the at least one RF passive or active device is located within an input ring or output ring located between the radio frequency domain and the digital domain. 4. The ESD protection structure of claim 3, wherein the input ring or output ring comprises a plurality of antiparallel diodes configured to provide coupling between different ground domains associated with at least one of: the radio frequency domain, the digital domain. 5. The ESD protection structure of claim 1, wherein the intermediate analog domain also comprises at least two pairs of back-to-back ESD diodes coupled to the at least one RF passive or active device thereby reducing a junction capacitance at higher frequencies. 6. The ESD protection structure of claim 2, wherein the at least one ESD inductor(s) comprise a metal shielding located underneath the ESD inductor(s) and configured to reduce a capacitance effect of the at least one ESD inductor(s). 7. The ESD protection structure of claim 1, wherein the at least one RF passive or active device is integrated on a die and configured to isolate noise between domains and components in an ESD protection network. 8. The ESD protection structure of claim 1, wherein the radio frequency domain and the at least one RF passive or active device is configured to operate between 1-2.5 GHz. | 2,800 |
11,513 | 11,513 | 15,101,145 | 2,837 | A ropeless elevator system ( 80 ) is disclosed. The ropeless elevator system ( 80 ) includes a plurality of hoistways ( 22, 26, 72 ) in which a plurality of elevator cars ( 24 ) circulate to a plurality of floors. Each hoistway ( 22, 26, 72 ) is assigned to a single direction of travel for the elevator cars ( 24 ). The single direction of travel is either upward or downward. A first quantity of upward hoistways ( 86 ) is unequal to a second quantity of downward hoistways ( 88 ), and a speed of each of the plurality of elevator cars ( 24 ) in the upward hoistways ( 86 ) is greater than a speed of each of the plurality of elevator cars in the downward hoistways ( 88 ). | 1. A ropeless elevator system (70) comprising:
a plurality of hoistways (22, 26, 72) in which a plurality of elevator cars (24) circulate to a plurality of floors, each hoistway (22, 26, 72) assigned to a single direction of travel for the elevator cars (24), wherein the single direction of travel is either upward or downward, wherein a first quantity of upward hoistways (86) is unequal to a second quantity of downward hoistways (88), and wherein a speed of each of the plurality of elevator cars (24) in the upward hoistways (86) is greater than a speed of each of the plurality of elevator cars (24)in the downward hoistways (88). 2. The ropeless elevator system of claim 1, wherein the first quantity of upward hoistways (86) is greater than the second quantity of downward hoistways (88). 3. The ropeless elevator system of claim 1, wherein the second quantity of downward hoistways (88) is greater than the first quantity of upward hoistways (86). 4. The ropeless elevator system of claim 1, wherein the single direction of travel for the elevator cars (24) is dynamically assignable. 5. The ropeless elevator system of claim 4, wherein the single direction of travel for the elevator cars (24) in each hoistway is assigned according to a first assignment and later re-assigned according to a subsequent assignment. 6. The ropeless elevator system of claim 1, wherein each elevator car (24) has a control unit (84) in communication with a control system (82), the control system (82) programmed to dynamically assign each hoistway to the single direction of travel and to communicate to the control units (84) the direction of travel of each hoistway. 7. The ropeless elevator system of claim 1, further comprising a transfer station (34, 36) positioned across the plurality of hoistways (22, 26, 72), each elevator car (24) moveable from one hoistway to an adjacent hoistway by way of the transfer station (34, 36). 8. The ropeless elevator system of claim 8, wherein the transfer station (34, 36) includes at least two vertical levels (90, 92) to support simultaneous transfer of the elevator cars from different hoistways (22, 72) to a same hoistway (26). 9. The ropeless elevator system of claim 1, wherein the plurality of elevator cars (24) do not have an air pressurization system. 10. A method (140) for dispatching a plurality of elevator cars (24) within a plurality of hoistways (22, 26, 72) in an elevator system (70), the elevator system (70) having a control system (82) communicating with a control unit (84) positioned in each of the elevator cars (24), the method (140) comprising:
assigning to each hoistway (22, 26, 72) a single direction of travel for the elevator cars (24), wherein the single direction is either upward or downward; moving the elevator cars (24) at a higher speed within the upward hoistways (86) than within the downward hoistways (88); changing the assignment for the direction of travel in at least one of the plurality of hoistways (22, 26, 72); and re-assigning to the at least one of the plurality of hoistways (22, 26, 72) the changed assignment for the direction of travel. 11. The method of claim 10, wherein assigning to each hoistway a single direction of travel for the elevator cars (24) includes assigning more hoistways in the upward direction of travel than in the downward direction of travel. 12. The method of claim 10, wherein assigning to each hoistway a single direction of travel for the elevator cars (24) includes assigning each hoistway in the upward direction of travel adjacent to a hoistway in the downward direction of travel. 13. The method of claim 10, wherein changing the assignment for the directions of travel within the plurality of hoistways includes analyzing a usage pattern of the elevator system (70). 14. The method of claim 10, further comprising the control system (82) communicating to the control unit (84) in each elevator car (24) the assignment for the directions of travel of each hoistway. 15. The method of claim 14, further comprising the control system (82) communicating to the control unit (84) in each elevator car (24) the different assignment for the directions of travel when the plurality of hoistways are re-assigned. 16. A ropeless elevator system (70) comprising:
a first hoistway (22) in which a plurality of elevator cars (24) travel upward; a second hoistway (26) in which the plurality of elevator cars (24) travel downward; a third hoistway (72) in which the plurality of elevator cars (24) travel upward, the first hoistway (22) and the third hoistway (72) positioned adjacent to the second hoistway (26); an upper transfer station (34) positioned above the first hoistway (22), the second hoistway (26), and the third hoistway (72); and a lower transfer station (36) positioned below the first hoistway (22), the second hoistway (26), and the third hoistway (72), the plurality of elevator cars (24) moveable between the first hoistway (22), the second hoistway (26), and the third hoistway (72) by way of the upper transfer station (34) or the lower transfer station (36), wherein a maximum allowable speed of each elevator car (24) travelling within the first hoistway (22) and the third hoistway (72) is greater than a maximum allowable speed of each elevator car (24) travelling within the second hoistway (26). 17. The ropeless elevator system of claim 16, wherein the upper transfer station (34) and the lower transfer station (36) each include two levels (90, 92) to support simultaneous transfer of the elevator cars (24) from the first and third hoistways (22, 72) to the second hoistway (26). 18. The ropeless elevator system of claim 16, further comprising a control unit (84) mounted in each elevator car (24), the control unit (84) in communication with a control system (82) programmed to dispatch the plurality of elevator cars (24) within the first, second, and third hoistways (22, 26, 72). 19. The ropeless elevator system of claim 18, wherein the upper transfer station (34) and the lower transfer station (36) each include only one level, and wherein the control system (82) is further programmed to transfer the elevator cars (24) from the first hoistway (22) to the second hoistway (26) at a different time than the elevator cars transfer from the third hoistway (72) to the second hoistway (26). 20. The ropeless elevator system of claim 18, wherein the control system (82) is further programmed to change a direction of travel of the elevator cars (24) within the first, second, and third hoistways (22, 26, 72). | A ropeless elevator system ( 80 ) is disclosed. The ropeless elevator system ( 80 ) includes a plurality of hoistways ( 22, 26, 72 ) in which a plurality of elevator cars ( 24 ) circulate to a plurality of floors. Each hoistway ( 22, 26, 72 ) is assigned to a single direction of travel for the elevator cars ( 24 ). The single direction of travel is either upward or downward. A first quantity of upward hoistways ( 86 ) is unequal to a second quantity of downward hoistways ( 88 ), and a speed of each of the plurality of elevator cars ( 24 ) in the upward hoistways ( 86 ) is greater than a speed of each of the plurality of elevator cars in the downward hoistways ( 88 ).1. A ropeless elevator system (70) comprising:
a plurality of hoistways (22, 26, 72) in which a plurality of elevator cars (24) circulate to a plurality of floors, each hoistway (22, 26, 72) assigned to a single direction of travel for the elevator cars (24), wherein the single direction of travel is either upward or downward, wherein a first quantity of upward hoistways (86) is unequal to a second quantity of downward hoistways (88), and wherein a speed of each of the plurality of elevator cars (24) in the upward hoistways (86) is greater than a speed of each of the plurality of elevator cars (24)in the downward hoistways (88). 2. The ropeless elevator system of claim 1, wherein the first quantity of upward hoistways (86) is greater than the second quantity of downward hoistways (88). 3. The ropeless elevator system of claim 1, wherein the second quantity of downward hoistways (88) is greater than the first quantity of upward hoistways (86). 4. The ropeless elevator system of claim 1, wherein the single direction of travel for the elevator cars (24) is dynamically assignable. 5. The ropeless elevator system of claim 4, wherein the single direction of travel for the elevator cars (24) in each hoistway is assigned according to a first assignment and later re-assigned according to a subsequent assignment. 6. The ropeless elevator system of claim 1, wherein each elevator car (24) has a control unit (84) in communication with a control system (82), the control system (82) programmed to dynamically assign each hoistway to the single direction of travel and to communicate to the control units (84) the direction of travel of each hoistway. 7. The ropeless elevator system of claim 1, further comprising a transfer station (34, 36) positioned across the plurality of hoistways (22, 26, 72), each elevator car (24) moveable from one hoistway to an adjacent hoistway by way of the transfer station (34, 36). 8. The ropeless elevator system of claim 8, wherein the transfer station (34, 36) includes at least two vertical levels (90, 92) to support simultaneous transfer of the elevator cars from different hoistways (22, 72) to a same hoistway (26). 9. The ropeless elevator system of claim 1, wherein the plurality of elevator cars (24) do not have an air pressurization system. 10. A method (140) for dispatching a plurality of elevator cars (24) within a plurality of hoistways (22, 26, 72) in an elevator system (70), the elevator system (70) having a control system (82) communicating with a control unit (84) positioned in each of the elevator cars (24), the method (140) comprising:
assigning to each hoistway (22, 26, 72) a single direction of travel for the elevator cars (24), wherein the single direction is either upward or downward; moving the elevator cars (24) at a higher speed within the upward hoistways (86) than within the downward hoistways (88); changing the assignment for the direction of travel in at least one of the plurality of hoistways (22, 26, 72); and re-assigning to the at least one of the plurality of hoistways (22, 26, 72) the changed assignment for the direction of travel. 11. The method of claim 10, wherein assigning to each hoistway a single direction of travel for the elevator cars (24) includes assigning more hoistways in the upward direction of travel than in the downward direction of travel. 12. The method of claim 10, wherein assigning to each hoistway a single direction of travel for the elevator cars (24) includes assigning each hoistway in the upward direction of travel adjacent to a hoistway in the downward direction of travel. 13. The method of claim 10, wherein changing the assignment for the directions of travel within the plurality of hoistways includes analyzing a usage pattern of the elevator system (70). 14. The method of claim 10, further comprising the control system (82) communicating to the control unit (84) in each elevator car (24) the assignment for the directions of travel of each hoistway. 15. The method of claim 14, further comprising the control system (82) communicating to the control unit (84) in each elevator car (24) the different assignment for the directions of travel when the plurality of hoistways are re-assigned. 16. A ropeless elevator system (70) comprising:
a first hoistway (22) in which a plurality of elevator cars (24) travel upward; a second hoistway (26) in which the plurality of elevator cars (24) travel downward; a third hoistway (72) in which the plurality of elevator cars (24) travel upward, the first hoistway (22) and the third hoistway (72) positioned adjacent to the second hoistway (26); an upper transfer station (34) positioned above the first hoistway (22), the second hoistway (26), and the third hoistway (72); and a lower transfer station (36) positioned below the first hoistway (22), the second hoistway (26), and the third hoistway (72), the plurality of elevator cars (24) moveable between the first hoistway (22), the second hoistway (26), and the third hoistway (72) by way of the upper transfer station (34) or the lower transfer station (36), wherein a maximum allowable speed of each elevator car (24) travelling within the first hoistway (22) and the third hoistway (72) is greater than a maximum allowable speed of each elevator car (24) travelling within the second hoistway (26). 17. The ropeless elevator system of claim 16, wherein the upper transfer station (34) and the lower transfer station (36) each include two levels (90, 92) to support simultaneous transfer of the elevator cars (24) from the first and third hoistways (22, 72) to the second hoistway (26). 18. The ropeless elevator system of claim 16, further comprising a control unit (84) mounted in each elevator car (24), the control unit (84) in communication with a control system (82) programmed to dispatch the plurality of elevator cars (24) within the first, second, and third hoistways (22, 26, 72). 19. The ropeless elevator system of claim 18, wherein the upper transfer station (34) and the lower transfer station (36) each include only one level, and wherein the control system (82) is further programmed to transfer the elevator cars (24) from the first hoistway (22) to the second hoistway (26) at a different time than the elevator cars transfer from the third hoistway (72) to the second hoistway (26). 20. The ropeless elevator system of claim 18, wherein the control system (82) is further programmed to change a direction of travel of the elevator cars (24) within the first, second, and third hoistways (22, 26, 72). | 2,800 |
11,514 | 11,514 | 15,003,856 | 2,891 | An integrated circuit has a substrate, a circuit, a core structure, a first encapsulation layer, a second encapsulation layer, and an oxide layer. The circuit includes transistors with active regions developed on the substrate and a metal layer formed above the active regions to provide interconnections for the transistors. The core structure is formed above the metal layer. The first encapsulation layer covers the core structure, and it has a first thermal expansion coefficient. The second encapsulation layer covers the first encapsulation layer over the core structure, and it has a second thermal expansion coefficient that is different from the first thermal expansion coefficient. As a part of the stress relief structure, the oxide layer is formed above the second encapsulation layer. The oxide layer includes an oxide thickness sufficient to mitigate a thermal stress between the first and second encapsulation layers. | 1. An integrated circuit, comprising:
a substrate; a circuit having transistors with active regions developed on the substrate and a metal layer formed above the active regions to provide interconnections for the transistors; a core structure formed above the metal layer; a first encapsulation layer covering the core structure and having a first thermal expansion coefficient; a second encapsulation layer covering the first encapsulation layer over the core structure and having a second thermal expansion coefficient different from the first thermal expansion coefficient; and an oxide layer formed above the second encapsulation layer, the oxide layer having an oxide thickness sufficient to mitigate a thermal stress between the first and second encapsulation layers. 2. The integrated circuit of claim 1, wherein:
the first encapsulation layer includes a titanium layer; and the second encapsulation layer includes a nitride layer. 3. The integrated circuit of claim 1, further comprising:
an insulating layer formed between the first encapsulation layer and the metal layer to insulate the circuit from the core structure; 4. The integrated circuit of claim 1, wherein:
the core structure has a longitudinal length extending in parallel with a surface of the substrate; the second encapsulation layer has an encapsulation thickness defining a stress ratio of the thermal stress with the longitudinal length of the core structure; and the oxide thickness of the oxide layer correlates to the stress ratio. 5. The integrated circuit of claim 4, wherein the oxide thickness of the oxide layer is proportional to the stress ratio. 6. The integrated circuit of claim 4, wherein the stress ratio is defined by the encapsulation thickness, the longitudinal length, the first thermal expansion coefficient, and the second thermal expansion coefficient. 7. The integrated circuit of claim 1, wherein:
the second encapsulation layer has an encapsulation thickness; and the oxide thickness of the oxide layer is greater than 85% of the encapsulation thickness. 8. The integrated circuit of claim 1, wherein:
the core structure defines a plateau protruding above the metal layer; the oxide layer includes:
a first silicon oxide layer formed from a silane precursor, the first silicon oxide layer conforming to a contour of the plateau; and
a second silicon oxide layer formed from a tetraethyl orthosilicate (TEOS) precursor, the second silicon oxide layer positioned above the first silicon oxide layer and conforming to a surface of the substrate. 9. The integrated circuit of claim 1, wherein the core structure includes a magnetic core having:
nickel iron (NiFe) layers; and insulating layers interleaving with the NiFe layers. 10. An integrated fluxgate device, comprising:
a substrate; a circuit having transistors with active regions developed on the substrate and a metal layer formed above the active regions to provide interconnections for the transistors; a fluxgate having:
a magnetic core formed above the metal layer;
a titanium layer covering the magnetic core; and
a nitride layer covering the titanium layer over the magnetic core;
a first silicon oxide layer formed from a silane precursor, the first silicon oxide layer positioned above the nitride layer; and a second silicon oxide layer formed from a tetraethyl orthosilicate (TEOS) precursor, the second silicon oxide layer positioned above the first silicon oxide layer. 11. The integrated fluxgate device of claim 10, wherein:
the magnetic core has a longitudinal length extending in parallel with a surface of the substrate; the nitride layer has a first thickness defining a stress ratio with the longitudinal length of the magnetic core; and the first silicon oxide layer has a second thickness correlating to the stress ratio. 12. The integrated fluxgate device of claim 11, wherein the second thickness of the first silicon oxide layer is proportional to the stress ratio. 13. The integrated fluxgate device of claim 11, wherein the stress ratio is defined by the first thickness, the longitudinal length, a first thermal expansion coefficient of the titanium layer, and a second expansion coefficient of the nitride layer. 14. The integrated fluxgate device of claim 10, wherein:
the nitride layer has a first thickness; and the first silicon oxide layer has a second thickness within a 15% variance of the nitride layer. 15. The integrated fluxgate device of claim 10, wherein:
the magnetic core defines a plateau protruding above the metal layer; the first silicon oxide layer conforms to a contour of the plateau; and the second silicon oxide layer conforms to a surface of the substrate. 16. A method for fabricating an integrated circuit, the method comprising:
forming a circuit having transistors with active regions developed on a substrate and a metal layer positioned above the active regions for interconnecting the transistors; forming a core structure above the metal layer; forming a first encapsulation layer covering the core structure and having a first thermal expansion coefficient; forming a second encapsulation layer covering the first encapsulation layer over the core structure and having a second thermal expansion coefficient different from the first thermal expansion coefficient; and forming an oxide layer above the second encapsulation layer and having an oxide thickness sufficient to mitigate a thermal stress between the first and second encapsulation layers. 17. The method of claim 16, wherein:
the forming the second encapsulation layer includes depositing a nitride material to form the second encapsulation layer using a chemical vapor deposition (CVD) tool at a first CVD temperature; and the forming the oxide layer includes depositing a silane precursor to form the oxide layer using the CVD tool at a second CVD temperature near to the first CVD temperature. 18. The method of claim 17, wherein the first CVD temperature is approximately 400° C., and the second CVD temperature is approximately 350° C. 19. The method of claim 16, wherein:
the forming the second encapsulation layer includes depositing a nitride material to form the second encapsulation layer using a chemical vapor deposition (CVD) tool for a first duration; and the forming the oxide layer includes depositing a silane precursor to form the oxide layer using the CVD tool for a second duration following the first duration and substantially equal to the first duration. 20. The method of claim 16, wherein the forming the oxide layer includes:
forming a first silicon oxide layer with a silane precursor subsequent to the forming of the second encapsulation layer without substantial cooling, the first silicon oxide layer conforming to a contour of the core structure; and forming a second silicon oxide layer with a tetraethyl orthosilicate (TEOS) precursor subsequent to the forming of the first silicon oxide layer and with substantial cooling, the second silicon oxide layer positioned above the first silicon oxide layer and conforming to a surface of the substrate. | An integrated circuit has a substrate, a circuit, a core structure, a first encapsulation layer, a second encapsulation layer, and an oxide layer. The circuit includes transistors with active regions developed on the substrate and a metal layer formed above the active regions to provide interconnections for the transistors. The core structure is formed above the metal layer. The first encapsulation layer covers the core structure, and it has a first thermal expansion coefficient. The second encapsulation layer covers the first encapsulation layer over the core structure, and it has a second thermal expansion coefficient that is different from the first thermal expansion coefficient. As a part of the stress relief structure, the oxide layer is formed above the second encapsulation layer. The oxide layer includes an oxide thickness sufficient to mitigate a thermal stress between the first and second encapsulation layers.1. An integrated circuit, comprising:
a substrate; a circuit having transistors with active regions developed on the substrate and a metal layer formed above the active regions to provide interconnections for the transistors; a core structure formed above the metal layer; a first encapsulation layer covering the core structure and having a first thermal expansion coefficient; a second encapsulation layer covering the first encapsulation layer over the core structure and having a second thermal expansion coefficient different from the first thermal expansion coefficient; and an oxide layer formed above the second encapsulation layer, the oxide layer having an oxide thickness sufficient to mitigate a thermal stress between the first and second encapsulation layers. 2. The integrated circuit of claim 1, wherein:
the first encapsulation layer includes a titanium layer; and the second encapsulation layer includes a nitride layer. 3. The integrated circuit of claim 1, further comprising:
an insulating layer formed between the first encapsulation layer and the metal layer to insulate the circuit from the core structure; 4. The integrated circuit of claim 1, wherein:
the core structure has a longitudinal length extending in parallel with a surface of the substrate; the second encapsulation layer has an encapsulation thickness defining a stress ratio of the thermal stress with the longitudinal length of the core structure; and the oxide thickness of the oxide layer correlates to the stress ratio. 5. The integrated circuit of claim 4, wherein the oxide thickness of the oxide layer is proportional to the stress ratio. 6. The integrated circuit of claim 4, wherein the stress ratio is defined by the encapsulation thickness, the longitudinal length, the first thermal expansion coefficient, and the second thermal expansion coefficient. 7. The integrated circuit of claim 1, wherein:
the second encapsulation layer has an encapsulation thickness; and the oxide thickness of the oxide layer is greater than 85% of the encapsulation thickness. 8. The integrated circuit of claim 1, wherein:
the core structure defines a plateau protruding above the metal layer; the oxide layer includes:
a first silicon oxide layer formed from a silane precursor, the first silicon oxide layer conforming to a contour of the plateau; and
a second silicon oxide layer formed from a tetraethyl orthosilicate (TEOS) precursor, the second silicon oxide layer positioned above the first silicon oxide layer and conforming to a surface of the substrate. 9. The integrated circuit of claim 1, wherein the core structure includes a magnetic core having:
nickel iron (NiFe) layers; and insulating layers interleaving with the NiFe layers. 10. An integrated fluxgate device, comprising:
a substrate; a circuit having transistors with active regions developed on the substrate and a metal layer formed above the active regions to provide interconnections for the transistors; a fluxgate having:
a magnetic core formed above the metal layer;
a titanium layer covering the magnetic core; and
a nitride layer covering the titanium layer over the magnetic core;
a first silicon oxide layer formed from a silane precursor, the first silicon oxide layer positioned above the nitride layer; and a second silicon oxide layer formed from a tetraethyl orthosilicate (TEOS) precursor, the second silicon oxide layer positioned above the first silicon oxide layer. 11. The integrated fluxgate device of claim 10, wherein:
the magnetic core has a longitudinal length extending in parallel with a surface of the substrate; the nitride layer has a first thickness defining a stress ratio with the longitudinal length of the magnetic core; and the first silicon oxide layer has a second thickness correlating to the stress ratio. 12. The integrated fluxgate device of claim 11, wherein the second thickness of the first silicon oxide layer is proportional to the stress ratio. 13. The integrated fluxgate device of claim 11, wherein the stress ratio is defined by the first thickness, the longitudinal length, a first thermal expansion coefficient of the titanium layer, and a second expansion coefficient of the nitride layer. 14. The integrated fluxgate device of claim 10, wherein:
the nitride layer has a first thickness; and the first silicon oxide layer has a second thickness within a 15% variance of the nitride layer. 15. The integrated fluxgate device of claim 10, wherein:
the magnetic core defines a plateau protruding above the metal layer; the first silicon oxide layer conforms to a contour of the plateau; and the second silicon oxide layer conforms to a surface of the substrate. 16. A method for fabricating an integrated circuit, the method comprising:
forming a circuit having transistors with active regions developed on a substrate and a metal layer positioned above the active regions for interconnecting the transistors; forming a core structure above the metal layer; forming a first encapsulation layer covering the core structure and having a first thermal expansion coefficient; forming a second encapsulation layer covering the first encapsulation layer over the core structure and having a second thermal expansion coefficient different from the first thermal expansion coefficient; and forming an oxide layer above the second encapsulation layer and having an oxide thickness sufficient to mitigate a thermal stress between the first and second encapsulation layers. 17. The method of claim 16, wherein:
the forming the second encapsulation layer includes depositing a nitride material to form the second encapsulation layer using a chemical vapor deposition (CVD) tool at a first CVD temperature; and the forming the oxide layer includes depositing a silane precursor to form the oxide layer using the CVD tool at a second CVD temperature near to the first CVD temperature. 18. The method of claim 17, wherein the first CVD temperature is approximately 400° C., and the second CVD temperature is approximately 350° C. 19. The method of claim 16, wherein:
the forming the second encapsulation layer includes depositing a nitride material to form the second encapsulation layer using a chemical vapor deposition (CVD) tool for a first duration; and the forming the oxide layer includes depositing a silane precursor to form the oxide layer using the CVD tool for a second duration following the first duration and substantially equal to the first duration. 20. The method of claim 16, wherein the forming the oxide layer includes:
forming a first silicon oxide layer with a silane precursor subsequent to the forming of the second encapsulation layer without substantial cooling, the first silicon oxide layer conforming to a contour of the core structure; and forming a second silicon oxide layer with a tetraethyl orthosilicate (TEOS) precursor subsequent to the forming of the first silicon oxide layer and with substantial cooling, the second silicon oxide layer positioned above the first silicon oxide layer and conforming to a surface of the substrate. | 2,800 |
11,515 | 11,515 | 15,018,364 | 2,859 | A self-charging all electric vehicle comprising three or four banks of batteries, FIG. 1 and FIG. 1 A, to power in rotation, one or two at a time, the prime mover 12 , a permanent magnet direct current motor. A three-wire direct current generator 13 which provides two 125 voltages to charge simultaneously two banks of batteries 10 and 250 volts to power the traction motors FIG. 4 and FIG. 5 for producing rotational energy. The generator is driven by the drive shaft of the prime mover. | 1. We claim a self-charging all electric vehicle, comprising:
a. three banks of batteries to power in rotation, one at a time, the prime mover, or b. four banks of batteries to power in rotation, two at a time connected in series, the prime mover, c. a prime mover which is a permanent magnet brushless direct current motor that drives the three-wire direct current generator, d. a three-wire direct current generator which provides two 125 voltages from either side of the neutral wire to charge simultaneously two banks of batteries and 250 volts to power the traction motors, e. front and front and rear traction motors for producing rotational energy, and f. means for controllably coupling rotational energy from the traction motors to the wheels, whereby the vehicle will be self-propelled to roll along a surface, g. the floating charge method for charging the banks of batteries two at a time, h. the constant potential method for charging the banks of batteries two at a time. | A self-charging all electric vehicle comprising three or four banks of batteries, FIG. 1 and FIG. 1 A, to power in rotation, one or two at a time, the prime mover 12 , a permanent magnet direct current motor. A three-wire direct current generator 13 which provides two 125 voltages to charge simultaneously two banks of batteries 10 and 250 volts to power the traction motors FIG. 4 and FIG. 5 for producing rotational energy. The generator is driven by the drive shaft of the prime mover.1. We claim a self-charging all electric vehicle, comprising:
a. three banks of batteries to power in rotation, one at a time, the prime mover, or b. four banks of batteries to power in rotation, two at a time connected in series, the prime mover, c. a prime mover which is a permanent magnet brushless direct current motor that drives the three-wire direct current generator, d. a three-wire direct current generator which provides two 125 voltages from either side of the neutral wire to charge simultaneously two banks of batteries and 250 volts to power the traction motors, e. front and front and rear traction motors for producing rotational energy, and f. means for controllably coupling rotational energy from the traction motors to the wheels, whereby the vehicle will be self-propelled to roll along a surface, g. the floating charge method for charging the banks of batteries two at a time, h. the constant potential method for charging the banks of batteries two at a time. | 2,800 |
11,516 | 11,516 | 15,156,183 | 2,846 | An induction motor controller is provided. The induction motor controller includes a first module that derives a commanded stator voltage vector, in a stator flux reference frame, via a rotor flux regulator loop and a torque regulator loop, which process at least partially in the stator flux reference frame. The induction motor controller includes a second module that processes the commanded stator voltage vector to produce AC (alternating current) power for an induction motor. | 1. An induction motor controller, comprising:
a first module that derives a commanded stator voltage vector, in a stator flux reference frame, via a rotor flux regulator loop and a torque regulator loop, which process at least partially in the stator flux reference frame; and a second module that processes the commanded stator voltage vector to produce AC (alternating current) power for an induction motor. 2. The induction motor controller of claim 1, wherein:
the second module transforms the commanded stator voltage vector from the stator flux reference frame to a phase voltage reference frame, applying vector rotation according to a stator flux angle; the second module generates pulse width modulation switching controls for a DC (direct current) to AC inverter from the commanded stator voltage vector as transformed to the phase voltage reference frame; and the second module generates three-phase AC power for the induction motor from the pulse width modulation switching controls. 3. The induction motor controller of claim 1, further comprising:
a third module that produces a torque, a stator flux angle, a rotor flux, a stator current vector expressed in the stator flux reference frame, and a rotor current vector expressed in the stator flux reference frame, from a stator voltage vector expressed in a phase voltage reference frame, a stator current of at least two phases, and a rotational speed of a rotor of the induction motor. 4. The induction motor controller of claim 3, wherein:
the rotor flux is coupled from the third module to a flux regulator of the first module; the torque is coupled from the third module to a torque regulator of the first module; the stator flux angle is coupled from the third module to the second module; the stator voltage vector expressed in the phase voltage reference frame is produced by the second module from the commanded stator voltage vector expressed in the stator flux reference frame; and the stator current of at least two phases is provided by the second module. 5. The induction motor controller of claim 1, further comprising:
a third module that applies a rotor flux current model and a rotor flux voltage model to generate a rotor flux and a torque, wherein the rotor flux regulator loop includes the rotor flux as an input to the first module, and the torque regulator loop includes the torque as an input to the first module. 6. The induction motor controller of claim 1, further comprising:
a fourth module that generates a commanded torque and a commanded rotor flux, limiting the commanded torque to less than or equal to a maximum commanded torque and limiting the commanded rotor flux to greater than or equal to a minimum commanded rotor flux and less than or equal to a maximum commanded rotor flux, the commanded torque and the commanded rotor flux coupled as inputs to the first module. 7. The induction motor controller of claim 1, wherein:
the first module includes a torque regulator that processes a portion of the torque regulator loop and produces a projection of the commanded stator voltage vector onto a quadrature axis in the stator flux reference frame; and the first module includes a rotor flux regulator that processes a portion of the rotor flux regulator loop and produces a projection of the commanded stator voltage vector onto a direct axis in the stator flux reference frame. 8. An induction motor controller, comprising:
a torque regulator that processes in a stator flux reference frame a commanded torque, a torque, a commanded rotor flux, and a rotational speed of a rotor of an induction motor, to produce a commanded stator voltage projected onto a quadrature axis in the stator flux reference frame; a rotor flux regulator that processes in the stator flux reference frame the commanded rotor flux and a rotor flux, to produce the commanded stator voltage projected onto a direct axis in the stator flux reference frame; and a stator flux reference frame to phase voltage reference frame vector rotation module that applies a stator flux angle to transform the commanded stator voltage, as projected onto the direct axis and the quadrature axis, from a first vector expressed in the stator flux reference frame to a second vector expressed in the phase voltage reference frame. 9. The induction motor controller of claim 8, further comprising:
a flux and torque estimator that generates the stator flux angle, the rotor flux, the torque, a rotor current vector expressed in the stator flux reference frame, and a stator current vector expressed in the stator flux reference frame, from a stator voltage vector expressed in the phase voltage reference frame, a stator current of at least two phases, and the rotational speed of the rotor; and the flux and torque estimator including a phase voltage reference frame to stator flux reference frame vector rotation module that transforms current vectors from the phase voltage reference frame to the stator flux reference frame. 10. The induction motor controller of claim 8, further comprising a flux and torque estimator that includes:
a stator phase current reference frame to phase voltage reference frame vector rotation module that transforms a stator current of at least two phases to a stator current vector expressed in the phase voltage reference frame; a rotor flux current model that generates a first rotor flux vector expressed in the phase voltage reference frame from the stator current vector expressed in the phase voltage reference frame and the rotational speed of the rotor; a rotor flux voltage model that generates a second rotor flux vector expressed in the phase voltage reference frame from a stator voltage vector expressed in the phase voltage reference frame, the stator current vector expressed in the phase voltage reference frame, and an estimation correction factor; an estimator regulator that generates the estimation correction factor from the first rotor flux vector expressed in the phase voltage reference frame and the second rotor flux vector expressed in the phase voltage reference frame; a rotor flux magnitude calculator that generates the rotor flux from the first rotor flux vector expressed in the phase voltage reference frame; a stator flux calculator that generates a stator flux vector expressed in the phase voltage reference frame from the second rotor flux vector expressed in the phase voltage reference frame and the stator current vector expressed in the phase voltage reference frame; a rotor current calculator that generates a rotor current vector expressed in the phase voltage reference frame from the first rotor flux vector expressed in the phase voltage reference frame and the stator flux vector expressed in the phase voltage reference frame; a torque calculator that generates the torque from the stator current vector expressed in the phase voltage reference frame and the stator flux vector expressed in the phase voltage reference frame; a stator flux angle calculator that generates the stator flux angle from the stator flux vector expressed in the phase voltage reference frame; and a phase voltage reference frame to stator flux reference frame vector rotation module that generates the rotor current vector expressed in the stator flux reference frame and the stator current vector expressed in the stator flux reference frame, from the rotor current vector expressed in the phase voltage reference frame, the stator current vector expressed in the phase voltage reference frame, and the stator flux angle. 11. The induction motor controller of claim 10, wherein:
the estimator regulator includes a PI (proportional-integral) controller; the stator flux calculator includes a model of inductances for windings of the induction motor; the stator flux reference frame to phase voltage reference frame vector rotation module performs a second transformation that is an inverse of a first transformation performed by the phase voltage reference frame to stator flux reference frame vector rotation module; and each of the rotor flux current model, the rotor flux voltage model, the rotor flux magnitude calculator, the rotor current calculator, the stator flux calculator, the torque calculator and the stator flux angle calculator is lookup-table-based or real-time-calculation-based. 12. The induction motor controller of claim 8, further comprising:
a space vector modulation module that generates pulse width modulation (PWM) switching controls, and generates a stator voltage vector expressed in the phase voltage reference frame, from the commanded stator voltage received as the second vector and a DC (direct current) voltage of a power source; and a DC to AC (alternating current) inverter that generates three-phase AC power for the induction motor from the PWM switching controls. 13. The induction motor controller of claim 8, further comprising:
a flux and torque limiter that generates a minimum commanded rotor flux, a maximum commanded rotor flux, and a maximum commanded torque, from a stator current vector expressed in the stator flux reference frame, a rotor current vector expressed in the stator flux reference frame, an inverter temperature, a motor temperature, and the rotational speed of the rotor. 14. The induction motor controller of claim 8, further comprising a flux and torque limiter that includes:
a rotor current limiter that generates a maximum rotor current from the rotational speed of the rotor, a rotor current vector expressed in the stator flux reference frame, and a motor temperature; a field weakener that generates a maximum stator flux from the rotational speed of the rotor and a DC (direct current) voltage of a power source; a stator current limiter that generates a maximum stator current from the rotational speed of the rotor, a stator current vector expressed in the stator flux reference frame, and an inverter temperature; a low rotor flux limiter that generates a minimum commanded rotor flux from the maximum rotor current and the rotational speed of the rotor; a high rotor flux limiter that generates a maximum commanded rotor flux from the maximum stator flux and the maximum stator current; a stator-based torque limiter that generates a maximum stator-based commanded torque from the maximum stator flux and the maximum stator current; a rotor-based torque limiter that generates a maximum rotor-based commanded torque from the maximum rotor current and the maximum commanded rotor flux; and a final torque limiter that generates a maximum commanded torque from the maximum rotor-based commanded torque and the maximum stator-based commanded torque; wherein each of the rotor current limiter, the field weakener, the stator current limiter, the low rotor flux limiter, the high rotor flux limiter, the stator-based torque limiter, and the rotor-based torque limiter is lookup-table-based or real-time-calculation-based. 15. The induction motor controller of claim 8, further comprising a flux and torque limiter that includes:
a rotor current limiter that decreases a maximum rotor current in response to an increased motor temperature; a field weakener that decreases a maximum stator flux in response to the rotational speed of the rotor exceeding a base speed and further decreases the maximum stator flux in response to a decreasing DC (direct current) voltage of a power source; a stator current limiter that decreases a maximum stator current in response to an increased inverter temperature; a low rotor flux limiter that sets a minimum commanded rotor flux consistent with readiness to accelerate the rotor; a high rotor flux limiter that sets a maximum commanded rotor flux based upon the maximum stator flux and the maximum stator current; a stator-based torque limiter that sets a maximum stator-based commanded torque based upon a product of the maximum stator flux and the maximum stator current; a rotor-based torque limiter that sets a maximum rotor-based commanded torque based upon a product of the maximum rotor current and the maximum commanded rotor flux; and a final torque limiter that sets a maximum commanded torque selected as a lesser of the maximum rotor-based commanded torque and the maximum stator-based commanded torque. 16. The induction motor controller of claim 8, further comprising:
a torque command generator that generates the commanded torque from a maximum commanded torque and an initial commanded torque, the maximum commanded torque applied to the initial commanded torque as a torque limit; and a rotor flux command generator that generates the commanded rotor flux from a minimum commanded rotor flux, a maximum commanded rotor flux, and the commanded torque, the minimum commanded rotor flux and the maximum commanded rotor flux applied to the commanded rotor flux as flux limits. 17. The induction motor controller of claim 8, wherein:
the torque regulator includes a proportional-integral (PI) controller having a difference between the commanded torque and the torque as an input; and the torque regulator includes a feedforward summation having as inputs an output of the PI controller and a product of the commanded rotor flux and the rotational speed of the rotor, the feedforward summation having as an output the commanded stator voltage projected onto the quadrature axis in the stator flux reference frame. 18. The induction motor controller of claim 8, wherein:
the rotor flux regulator includes a proportional-integral-derivative (PID) controller having as inputs the commanded rotor flux and the rotor flux, and having as an output the commanded stator voltage projected onto the direct axis in the stator flux reference frame. 19. A method of controlling an induction motor, comprising:
generating a stator voltage vector, in a stator flux reference frame, the generating including,
generating a quadrature axis projection of a commanded stator voltage vector expressed in the stator flux reference frame from a commanded torque, a torque, a commanded rotor flux, and a rotational speed of a rotor of the induction motor; and
generating a direct axis projection of the commanded stator voltage vector expressed in the stator flux reference frame from the commanded rotor flux and a rotor flux, wherein the stator voltage vector, in the stator flux reference frame, includes the direct axis projection of the commanded stator voltage vector and the quadrature axis projection of the commanded stator voltage vector;
transforming the stator voltage vector from the stator flux reference frame to a phase voltage reference frame; and producing alternating current (AC) power for an induction motor, from the stator voltage vector of the phase voltage reference frame, wherein at least one step of the method is performed by a processor. 20. The method of claim 19, wherein generating the quadrature axis projection of the commanded stator voltage vector expressed in the stator flux reference frame includes:
subtracting the torque from the commanded torque to form a torque error; adding a first term proportional to the torque error and a second term proportional to an integral of the torque error to form a PI (proportional-integral) controller output; multiplying the rotational speed of the rotor by the commanded rotor flux to form a feedforward quantity; and adding the feedforward quantity to the PI controller output to form the quadrature axis projection of the commanded stator voltage vector expressed in the stator flux reference frame. | An induction motor controller is provided. The induction motor controller includes a first module that derives a commanded stator voltage vector, in a stator flux reference frame, via a rotor flux regulator loop and a torque regulator loop, which process at least partially in the stator flux reference frame. The induction motor controller includes a second module that processes the commanded stator voltage vector to produce AC (alternating current) power for an induction motor.1. An induction motor controller, comprising:
a first module that derives a commanded stator voltage vector, in a stator flux reference frame, via a rotor flux regulator loop and a torque regulator loop, which process at least partially in the stator flux reference frame; and a second module that processes the commanded stator voltage vector to produce AC (alternating current) power for an induction motor. 2. The induction motor controller of claim 1, wherein:
the second module transforms the commanded stator voltage vector from the stator flux reference frame to a phase voltage reference frame, applying vector rotation according to a stator flux angle; the second module generates pulse width modulation switching controls for a DC (direct current) to AC inverter from the commanded stator voltage vector as transformed to the phase voltage reference frame; and the second module generates three-phase AC power for the induction motor from the pulse width modulation switching controls. 3. The induction motor controller of claim 1, further comprising:
a third module that produces a torque, a stator flux angle, a rotor flux, a stator current vector expressed in the stator flux reference frame, and a rotor current vector expressed in the stator flux reference frame, from a stator voltage vector expressed in a phase voltage reference frame, a stator current of at least two phases, and a rotational speed of a rotor of the induction motor. 4. The induction motor controller of claim 3, wherein:
the rotor flux is coupled from the third module to a flux regulator of the first module; the torque is coupled from the third module to a torque regulator of the first module; the stator flux angle is coupled from the third module to the second module; the stator voltage vector expressed in the phase voltage reference frame is produced by the second module from the commanded stator voltage vector expressed in the stator flux reference frame; and the stator current of at least two phases is provided by the second module. 5. The induction motor controller of claim 1, further comprising:
a third module that applies a rotor flux current model and a rotor flux voltage model to generate a rotor flux and a torque, wherein the rotor flux regulator loop includes the rotor flux as an input to the first module, and the torque regulator loop includes the torque as an input to the first module. 6. The induction motor controller of claim 1, further comprising:
a fourth module that generates a commanded torque and a commanded rotor flux, limiting the commanded torque to less than or equal to a maximum commanded torque and limiting the commanded rotor flux to greater than or equal to a minimum commanded rotor flux and less than or equal to a maximum commanded rotor flux, the commanded torque and the commanded rotor flux coupled as inputs to the first module. 7. The induction motor controller of claim 1, wherein:
the first module includes a torque regulator that processes a portion of the torque regulator loop and produces a projection of the commanded stator voltage vector onto a quadrature axis in the stator flux reference frame; and the first module includes a rotor flux regulator that processes a portion of the rotor flux regulator loop and produces a projection of the commanded stator voltage vector onto a direct axis in the stator flux reference frame. 8. An induction motor controller, comprising:
a torque regulator that processes in a stator flux reference frame a commanded torque, a torque, a commanded rotor flux, and a rotational speed of a rotor of an induction motor, to produce a commanded stator voltage projected onto a quadrature axis in the stator flux reference frame; a rotor flux regulator that processes in the stator flux reference frame the commanded rotor flux and a rotor flux, to produce the commanded stator voltage projected onto a direct axis in the stator flux reference frame; and a stator flux reference frame to phase voltage reference frame vector rotation module that applies a stator flux angle to transform the commanded stator voltage, as projected onto the direct axis and the quadrature axis, from a first vector expressed in the stator flux reference frame to a second vector expressed in the phase voltage reference frame. 9. The induction motor controller of claim 8, further comprising:
a flux and torque estimator that generates the stator flux angle, the rotor flux, the torque, a rotor current vector expressed in the stator flux reference frame, and a stator current vector expressed in the stator flux reference frame, from a stator voltage vector expressed in the phase voltage reference frame, a stator current of at least two phases, and the rotational speed of the rotor; and the flux and torque estimator including a phase voltage reference frame to stator flux reference frame vector rotation module that transforms current vectors from the phase voltage reference frame to the stator flux reference frame. 10. The induction motor controller of claim 8, further comprising a flux and torque estimator that includes:
a stator phase current reference frame to phase voltage reference frame vector rotation module that transforms a stator current of at least two phases to a stator current vector expressed in the phase voltage reference frame; a rotor flux current model that generates a first rotor flux vector expressed in the phase voltage reference frame from the stator current vector expressed in the phase voltage reference frame and the rotational speed of the rotor; a rotor flux voltage model that generates a second rotor flux vector expressed in the phase voltage reference frame from a stator voltage vector expressed in the phase voltage reference frame, the stator current vector expressed in the phase voltage reference frame, and an estimation correction factor; an estimator regulator that generates the estimation correction factor from the first rotor flux vector expressed in the phase voltage reference frame and the second rotor flux vector expressed in the phase voltage reference frame; a rotor flux magnitude calculator that generates the rotor flux from the first rotor flux vector expressed in the phase voltage reference frame; a stator flux calculator that generates a stator flux vector expressed in the phase voltage reference frame from the second rotor flux vector expressed in the phase voltage reference frame and the stator current vector expressed in the phase voltage reference frame; a rotor current calculator that generates a rotor current vector expressed in the phase voltage reference frame from the first rotor flux vector expressed in the phase voltage reference frame and the stator flux vector expressed in the phase voltage reference frame; a torque calculator that generates the torque from the stator current vector expressed in the phase voltage reference frame and the stator flux vector expressed in the phase voltage reference frame; a stator flux angle calculator that generates the stator flux angle from the stator flux vector expressed in the phase voltage reference frame; and a phase voltage reference frame to stator flux reference frame vector rotation module that generates the rotor current vector expressed in the stator flux reference frame and the stator current vector expressed in the stator flux reference frame, from the rotor current vector expressed in the phase voltage reference frame, the stator current vector expressed in the phase voltage reference frame, and the stator flux angle. 11. The induction motor controller of claim 10, wherein:
the estimator regulator includes a PI (proportional-integral) controller; the stator flux calculator includes a model of inductances for windings of the induction motor; the stator flux reference frame to phase voltage reference frame vector rotation module performs a second transformation that is an inverse of a first transformation performed by the phase voltage reference frame to stator flux reference frame vector rotation module; and each of the rotor flux current model, the rotor flux voltage model, the rotor flux magnitude calculator, the rotor current calculator, the stator flux calculator, the torque calculator and the stator flux angle calculator is lookup-table-based or real-time-calculation-based. 12. The induction motor controller of claim 8, further comprising:
a space vector modulation module that generates pulse width modulation (PWM) switching controls, and generates a stator voltage vector expressed in the phase voltage reference frame, from the commanded stator voltage received as the second vector and a DC (direct current) voltage of a power source; and a DC to AC (alternating current) inverter that generates three-phase AC power for the induction motor from the PWM switching controls. 13. The induction motor controller of claim 8, further comprising:
a flux and torque limiter that generates a minimum commanded rotor flux, a maximum commanded rotor flux, and a maximum commanded torque, from a stator current vector expressed in the stator flux reference frame, a rotor current vector expressed in the stator flux reference frame, an inverter temperature, a motor temperature, and the rotational speed of the rotor. 14. The induction motor controller of claim 8, further comprising a flux and torque limiter that includes:
a rotor current limiter that generates a maximum rotor current from the rotational speed of the rotor, a rotor current vector expressed in the stator flux reference frame, and a motor temperature; a field weakener that generates a maximum stator flux from the rotational speed of the rotor and a DC (direct current) voltage of a power source; a stator current limiter that generates a maximum stator current from the rotational speed of the rotor, a stator current vector expressed in the stator flux reference frame, and an inverter temperature; a low rotor flux limiter that generates a minimum commanded rotor flux from the maximum rotor current and the rotational speed of the rotor; a high rotor flux limiter that generates a maximum commanded rotor flux from the maximum stator flux and the maximum stator current; a stator-based torque limiter that generates a maximum stator-based commanded torque from the maximum stator flux and the maximum stator current; a rotor-based torque limiter that generates a maximum rotor-based commanded torque from the maximum rotor current and the maximum commanded rotor flux; and a final torque limiter that generates a maximum commanded torque from the maximum rotor-based commanded torque and the maximum stator-based commanded torque; wherein each of the rotor current limiter, the field weakener, the stator current limiter, the low rotor flux limiter, the high rotor flux limiter, the stator-based torque limiter, and the rotor-based torque limiter is lookup-table-based or real-time-calculation-based. 15. The induction motor controller of claim 8, further comprising a flux and torque limiter that includes:
a rotor current limiter that decreases a maximum rotor current in response to an increased motor temperature; a field weakener that decreases a maximum stator flux in response to the rotational speed of the rotor exceeding a base speed and further decreases the maximum stator flux in response to a decreasing DC (direct current) voltage of a power source; a stator current limiter that decreases a maximum stator current in response to an increased inverter temperature; a low rotor flux limiter that sets a minimum commanded rotor flux consistent with readiness to accelerate the rotor; a high rotor flux limiter that sets a maximum commanded rotor flux based upon the maximum stator flux and the maximum stator current; a stator-based torque limiter that sets a maximum stator-based commanded torque based upon a product of the maximum stator flux and the maximum stator current; a rotor-based torque limiter that sets a maximum rotor-based commanded torque based upon a product of the maximum rotor current and the maximum commanded rotor flux; and a final torque limiter that sets a maximum commanded torque selected as a lesser of the maximum rotor-based commanded torque and the maximum stator-based commanded torque. 16. The induction motor controller of claim 8, further comprising:
a torque command generator that generates the commanded torque from a maximum commanded torque and an initial commanded torque, the maximum commanded torque applied to the initial commanded torque as a torque limit; and a rotor flux command generator that generates the commanded rotor flux from a minimum commanded rotor flux, a maximum commanded rotor flux, and the commanded torque, the minimum commanded rotor flux and the maximum commanded rotor flux applied to the commanded rotor flux as flux limits. 17. The induction motor controller of claim 8, wherein:
the torque regulator includes a proportional-integral (PI) controller having a difference between the commanded torque and the torque as an input; and the torque regulator includes a feedforward summation having as inputs an output of the PI controller and a product of the commanded rotor flux and the rotational speed of the rotor, the feedforward summation having as an output the commanded stator voltage projected onto the quadrature axis in the stator flux reference frame. 18. The induction motor controller of claim 8, wherein:
the rotor flux regulator includes a proportional-integral-derivative (PID) controller having as inputs the commanded rotor flux and the rotor flux, and having as an output the commanded stator voltage projected onto the direct axis in the stator flux reference frame. 19. A method of controlling an induction motor, comprising:
generating a stator voltage vector, in a stator flux reference frame, the generating including,
generating a quadrature axis projection of a commanded stator voltage vector expressed in the stator flux reference frame from a commanded torque, a torque, a commanded rotor flux, and a rotational speed of a rotor of the induction motor; and
generating a direct axis projection of the commanded stator voltage vector expressed in the stator flux reference frame from the commanded rotor flux and a rotor flux, wherein the stator voltage vector, in the stator flux reference frame, includes the direct axis projection of the commanded stator voltage vector and the quadrature axis projection of the commanded stator voltage vector;
transforming the stator voltage vector from the stator flux reference frame to a phase voltage reference frame; and producing alternating current (AC) power for an induction motor, from the stator voltage vector of the phase voltage reference frame, wherein at least one step of the method is performed by a processor. 20. The method of claim 19, wherein generating the quadrature axis projection of the commanded stator voltage vector expressed in the stator flux reference frame includes:
subtracting the torque from the commanded torque to form a torque error; adding a first term proportional to the torque error and a second term proportional to an integral of the torque error to form a PI (proportional-integral) controller output; multiplying the rotational speed of the rotor by the commanded rotor flux to form a feedforward quantity; and adding the feedforward quantity to the PI controller output to form the quadrature axis projection of the commanded stator voltage vector expressed in the stator flux reference frame. | 2,800 |
11,517 | 11,517 | 14,068,478 | 2,832 | A bezentropic bladeless turbine has a bladeless rotor, a bladeless stator, and a CD nozzle that feeds a rectified molecular, supersonic flow of gas and/or steam into the rotor. Spiral channels are provided in the rotor, which serve to maintain and sustain the rectified molecular flow of the working fluid through the rotor. An energy booster device is assembled at the exit of the CD nozzle, to increase the efficiency of the CD nozzle. The rotor is attached to an output shaft, to convert the kinetic energy of the working fluid to mechanical work. Various fluids, such as steam, Freon, wind, may be used as the working fluid. | 1-18. (canceled) 19. Apparatus for generating mechanical work from a working fluid, the apparatus comprising:
a stator; a rotor mounted within the stator having at least one working-fluid in-feed opening; an output shaft that is rotated by the working fluid flowing through the rotor; a plurality of Archimedean spiral channels mounted within the rotor and wound around the output shaft, each Archimedean spiral channel having a channel opening; and a CD nozzle for receiving the working fluid, the CD nozzle having converging nozzle inlet and a diverging nozzle exit, the nozzle exit having a shape that corresponds with a shape of the channel opening; wherein the exit opening of the CD nozzle and the working-fluid in-feed opening are in close proximity to each other and the working fluid is ejected from the nozzle exit as a supersonic, flow having a mono-directional molecular order of the working fluid and injected through the working-fluid in-feed opening on the rotor into the plurality of Archimedean spiral channels; wherein the CD nozzle and the Archimedean spiral channels together ensure that the mono-directional molecular order of the working fluid is maintained, thereby reducing entropic losses in the working fluid to a minimum. 2. The apparatus of claim 2, wherein the shape of the nozzle exit is flattened. 3. The apparatus of claim 1, wherein the working-fluid in-feed opening on the rotor includes more than one working-fluid in-feed opening. 4. The apparatus of claim 3, wherein the more than one working-fluid in-feed opening includes a first in-feed opening and a second in-feed opening, the two openings spaced 180 degrees apart. 5. The apparatus of claim 1 further comprising an energy booster device that is provided at the nozzle exit, wherein the energy booster device injects preheated steam into the supersonic rectified flow of the working fluid at the nozzle exit. 6. The apparatus of claim 5, wherein the energy booster device has a length that corresponds at least to a length of the flattened shape of the nozzle exit, the length of the energy booster device being perforated with small openings through which the pre-heated steam is forced into the supersonic, rectified flow of the working fluid, and wherein the pre-heated steam spontaneously flashes into saturated steam, thereby increasing a volume of the working fluid as the working fluid enters the rotor. 7. The apparatus of claim 6, wherein the CD nozzle and the energy booster device are constructed as a single component, with the energy booster device mounted at the nozzle exit. 8. The apparatus of claim 1, wherein the stator is cylindrical and the rotor is rotatably mounted within the stator, the rotor having two end disks that extend radially relative a longitudinal axis of the output shaft, and wherein the spiral channels are formed by sheets having two side edges, the sheets wound in a spiral about the output shaft with the two side edges affixed respectively to the end disks, so as to form the Archimedean spiral channels with the channel opening extending parallel to the longitudinal axis of the output shaft. 9. The apparatus of claim 1, wherein the working fluid becomes spent working fluid as it passes through the spiral channels and wherein the spent working fluid is removed from the rotor. 10. The apparatus of claim 1, wherein the working fluid is steam. 11. The apparatus of claim 1, wherein the working fluid is Freon. 12. The apparatus of claim 1, wherein the working fluid is hydrogen. 13. The apparatus of claim 1, wherein the working fluid is wind. 14. A method of generating mechanical work or thrust, the method comprising the steps of:
a) providing a working fluid that has a mono-directional molecular order; b) providing a rotor having Archimedean spirals; c) providing an output shaft that is coupled to the rotor; and d) injecting the working fluid into the Archimedean spirals of the rotor;
wherein the mono-directional molecular order of the working fluid is sustained and maintained throughout a passage of the working fluid through the Archimedean spirals. 15. The method of claim 14, wherein the step of providing a working fluid includes the step of:
a1) providing a steam generator and using steam as the working fluid. 16. The method of claim 14, wherein the step of providing a working fluid includes the step of:
a2) providing a Freon steam boiler and using Freon falls as the working fluid. 17. A method of providing a rectified flow of a working fluid, the method comprising the steps of:
a) forcing the working fluid through a device that creates a molecularly ordered flow; b) introducing the molecularly ordered flow into Archimedean spiral channels that maintain and sustain the molecularly ordered flow; and c) applying the working fluid to apparatus for generating mechanical work. | A bezentropic bladeless turbine has a bladeless rotor, a bladeless stator, and a CD nozzle that feeds a rectified molecular, supersonic flow of gas and/or steam into the rotor. Spiral channels are provided in the rotor, which serve to maintain and sustain the rectified molecular flow of the working fluid through the rotor. An energy booster device is assembled at the exit of the CD nozzle, to increase the efficiency of the CD nozzle. The rotor is attached to an output shaft, to convert the kinetic energy of the working fluid to mechanical work. Various fluids, such as steam, Freon, wind, may be used as the working fluid.1-18. (canceled) 19. Apparatus for generating mechanical work from a working fluid, the apparatus comprising:
a stator; a rotor mounted within the stator having at least one working-fluid in-feed opening; an output shaft that is rotated by the working fluid flowing through the rotor; a plurality of Archimedean spiral channels mounted within the rotor and wound around the output shaft, each Archimedean spiral channel having a channel opening; and a CD nozzle for receiving the working fluid, the CD nozzle having converging nozzle inlet and a diverging nozzle exit, the nozzle exit having a shape that corresponds with a shape of the channel opening; wherein the exit opening of the CD nozzle and the working-fluid in-feed opening are in close proximity to each other and the working fluid is ejected from the nozzle exit as a supersonic, flow having a mono-directional molecular order of the working fluid and injected through the working-fluid in-feed opening on the rotor into the plurality of Archimedean spiral channels; wherein the CD nozzle and the Archimedean spiral channels together ensure that the mono-directional molecular order of the working fluid is maintained, thereby reducing entropic losses in the working fluid to a minimum. 2. The apparatus of claim 2, wherein the shape of the nozzle exit is flattened. 3. The apparatus of claim 1, wherein the working-fluid in-feed opening on the rotor includes more than one working-fluid in-feed opening. 4. The apparatus of claim 3, wherein the more than one working-fluid in-feed opening includes a first in-feed opening and a second in-feed opening, the two openings spaced 180 degrees apart. 5. The apparatus of claim 1 further comprising an energy booster device that is provided at the nozzle exit, wherein the energy booster device injects preheated steam into the supersonic rectified flow of the working fluid at the nozzle exit. 6. The apparatus of claim 5, wherein the energy booster device has a length that corresponds at least to a length of the flattened shape of the nozzle exit, the length of the energy booster device being perforated with small openings through which the pre-heated steam is forced into the supersonic, rectified flow of the working fluid, and wherein the pre-heated steam spontaneously flashes into saturated steam, thereby increasing a volume of the working fluid as the working fluid enters the rotor. 7. The apparatus of claim 6, wherein the CD nozzle and the energy booster device are constructed as a single component, with the energy booster device mounted at the nozzle exit. 8. The apparatus of claim 1, wherein the stator is cylindrical and the rotor is rotatably mounted within the stator, the rotor having two end disks that extend radially relative a longitudinal axis of the output shaft, and wherein the spiral channels are formed by sheets having two side edges, the sheets wound in a spiral about the output shaft with the two side edges affixed respectively to the end disks, so as to form the Archimedean spiral channels with the channel opening extending parallel to the longitudinal axis of the output shaft. 9. The apparatus of claim 1, wherein the working fluid becomes spent working fluid as it passes through the spiral channels and wherein the spent working fluid is removed from the rotor. 10. The apparatus of claim 1, wherein the working fluid is steam. 11. The apparatus of claim 1, wherein the working fluid is Freon. 12. The apparatus of claim 1, wherein the working fluid is hydrogen. 13. The apparatus of claim 1, wherein the working fluid is wind. 14. A method of generating mechanical work or thrust, the method comprising the steps of:
a) providing a working fluid that has a mono-directional molecular order; b) providing a rotor having Archimedean spirals; c) providing an output shaft that is coupled to the rotor; and d) injecting the working fluid into the Archimedean spirals of the rotor;
wherein the mono-directional molecular order of the working fluid is sustained and maintained throughout a passage of the working fluid through the Archimedean spirals. 15. The method of claim 14, wherein the step of providing a working fluid includes the step of:
a1) providing a steam generator and using steam as the working fluid. 16. The method of claim 14, wherein the step of providing a working fluid includes the step of:
a2) providing a Freon steam boiler and using Freon falls as the working fluid. 17. A method of providing a rectified flow of a working fluid, the method comprising the steps of:
a) forcing the working fluid through a device that creates a molecularly ordered flow; b) introducing the molecularly ordered flow into Archimedean spiral channels that maintain and sustain the molecularly ordered flow; and c) applying the working fluid to apparatus for generating mechanical work. | 2,800 |
11,518 | 11,518 | 15,475,368 | 2,835 | An electronic component assembly includes a substrate having a first face and an opposed second face. One or more electronic components are coupled with either or both of the first and second faces. A filler interface heat transfer system is coupled with the substrate. The filler interface heat transfer system includes at least one enclosure shell coupled with one of the first or second faces. The at least one enclosure shell surrounds a filler cavity including the one or more electronic components therein. A heat transfer filler is within the filler cavity, the heat transfer filler includes a contoured filler profile conforming to at least the one or more electronic components. | 1. An electronic device comprising:
a device housing; a substrate within the device housing and coupled with the device housing; one or more electronic components coupled with the substrate, the one or more electronic components and the substrate include a composite profile; and a filler interface heat transfer system coupled with the one or more electronic components, the filler interface heat transfer system includes:
at least one enclosure shell coupled with the substrate, the at least one enclosure shell surrounds a filler cavity, the one or more electronic components and the composite profile,
a heat transfer filler within the filler cavity, the heat transfer filler includes a contoured filler profile conformed along and engaged along the composite profile, and
a distributive heat path including the heat transfer filler and the at least one enclosure shell, the distributive heat path is configured to distribute heat from the one or more electronic components into the heat transfer filler and the at least one enclosure shell and transfer heat from the heat transfer filler and the at least one enclosure shell to the device housing. 2. The device of claim 1, wherein the heat transfer filler consists of one of a phase change material or a heat transfer fluid. 3. The device of claim 1, wherein the at least one enclosure shell is coupled with the device housing. 4. The device of claim 3, wherein the at least one enclosure shell is coupled in surface to surface contact with the device housing. 5. The device of claim 3, wherein the at least one enclosure shell is coupled with the device housing with one or more heat pipes. 6. The device of claim 1, wherein the at least one enclosure shell seals the heat transfer filler within the filler cavity and isolates the remainder of the device housing from the heat transfer filler. 7. The device of claim 1, wherein the one or more electronic components include a component profile and the contoured filler profile is greater than the component profile. 8. The device of claim 1, wherein contoured filler profile is conformed along and engaged along an enclosure profile of the at least one enclosure shell. 9. The device of claim 1, wherein the at least one enclosure shell includes a protective frame surrounding at least the one or more electronic components. 10. The device of claim 1, wherein the at least one enclosure shell includes a first enclosure shell and a second enclosure shell, the filler cavities of the first and second enclosure shells are filled with the heat transfer filler, and
the heat transfer filler in the first and second enclosure shells is in communication through one or more filler communication ports. 11. The device of claim 1, wherein the device housing consists of one of a mobile phone housing, tablet housing, smartphone housing, laptop housing, two in one device housing, desktop computer housing, or server node housing. 12. An electronic component assembly comprising:
a substrate having a first face and an opposed second face; one or more electronic components coupled with either or both of the first and second faces; and a filler interface heat transfer system coupled with the substrate, the filler interface heat transfer system includes:
at least one enclosure shell coupled with one of the first or second faces, the at least one enclosure shell surrounds a filler cavity including the one or more electronic components therein, and
a heat transfer filler within the filler cavity, the heat transfer filler includes a contoured filler profile conforming to at least the one or more electronic components. 13. The assembly of claim 12, wherein the heat transfer filler surrounds the one or more electronic components and is distributed across the substrate within the enclosure shell. 14. The assembly of claim 12, wherein the contoured filler profile conforms to an enclosure profile of the at least one enclosure shell. 15. The assembly of claim 12, wherein the one or more electronic components include a component profile and the contoured filler profile is greater than the component profile. 16. The assembly of claim 12, wherein the heat transfer filler consists of at least one of a phase change material or a heat transfer fluid. 17. The assembly of claim 12, wherein the at least one enclosure shell seals the heat transfer filler within the filler cavity and retains the contoured filler profile in conformation to at least the one or more electronic components. 18. The assembly of claim 12, wherein the at least one enclosure shell includes a first enclosure shell and a second enclosure shell, the filler cavities of the first and second enclosure shells are filled with the heat transfer filler, and
the heat transfer filler in the first and second enclosure shells is in communication through one or more filler communication ports. 19. The assembly of claim 18, wherein the first enclosure shell is on the first face of the substrate and the second enclosure shell is on the opposed second face of the substrate, and
the one or more filler communication ports extend through the substrate. 20. A method for making an electronic device comprising:
coupling an enclosure shell with a substrate, the enclosure shell includes a filler cavity having one or more electronic components coupled with the substrate therein; and interfacing a heat transfer filler with the one or more electronic components in the filler cavity, interfacing includes:
delivering the heat transfer filler to the filler cavity through a filler inflow port extending into the filler cavity,
conforming the heat transfer filler to at least a component profile of the one or more electronic components, and
sealing the enclosure shell filled with the heat transfer filler. 21. The method of claim 20, wherein coupling the enclosure shell with the substrate includes soldering the enclosure shell to the substrate. 22. The method of claim 20, wherein the enclosure shell includes first and second enclosure shells, and delivering the heat transfer filler to the filler cavity includes:
delivering the heat transfer filler to the filler cavity of the first enclosure shell through the filler inflow port, and delivering the heat transfer filler to the filler cavity of the second enclosure shell through a filler communication port extending between the first and second enclosure shells. 23. The method of claim 20, wherein conforming the heat transfer filler to at least the component profile includes fluidly surrounding each of the one or more electronic components. 24. The method of claim 20, wherein interfacing the heat transfer filler with the one or more electronic components in the filler cavity includes conforming the heat transfer filler to the enclosure profile of the enclosure shell. 25. The method of claim 20 comprising coupling the enclosure shell with a device housing, the device housing including the substrate and the one or more electronic components therein. | An electronic component assembly includes a substrate having a first face and an opposed second face. One or more electronic components are coupled with either or both of the first and second faces. A filler interface heat transfer system is coupled with the substrate. The filler interface heat transfer system includes at least one enclosure shell coupled with one of the first or second faces. The at least one enclosure shell surrounds a filler cavity including the one or more electronic components therein. A heat transfer filler is within the filler cavity, the heat transfer filler includes a contoured filler profile conforming to at least the one or more electronic components.1. An electronic device comprising:
a device housing; a substrate within the device housing and coupled with the device housing; one or more electronic components coupled with the substrate, the one or more electronic components and the substrate include a composite profile; and a filler interface heat transfer system coupled with the one or more electronic components, the filler interface heat transfer system includes:
at least one enclosure shell coupled with the substrate, the at least one enclosure shell surrounds a filler cavity, the one or more electronic components and the composite profile,
a heat transfer filler within the filler cavity, the heat transfer filler includes a contoured filler profile conformed along and engaged along the composite profile, and
a distributive heat path including the heat transfer filler and the at least one enclosure shell, the distributive heat path is configured to distribute heat from the one or more electronic components into the heat transfer filler and the at least one enclosure shell and transfer heat from the heat transfer filler and the at least one enclosure shell to the device housing. 2. The device of claim 1, wherein the heat transfer filler consists of one of a phase change material or a heat transfer fluid. 3. The device of claim 1, wherein the at least one enclosure shell is coupled with the device housing. 4. The device of claim 3, wherein the at least one enclosure shell is coupled in surface to surface contact with the device housing. 5. The device of claim 3, wherein the at least one enclosure shell is coupled with the device housing with one or more heat pipes. 6. The device of claim 1, wherein the at least one enclosure shell seals the heat transfer filler within the filler cavity and isolates the remainder of the device housing from the heat transfer filler. 7. The device of claim 1, wherein the one or more electronic components include a component profile and the contoured filler profile is greater than the component profile. 8. The device of claim 1, wherein contoured filler profile is conformed along and engaged along an enclosure profile of the at least one enclosure shell. 9. The device of claim 1, wherein the at least one enclosure shell includes a protective frame surrounding at least the one or more electronic components. 10. The device of claim 1, wherein the at least one enclosure shell includes a first enclosure shell and a second enclosure shell, the filler cavities of the first and second enclosure shells are filled with the heat transfer filler, and
the heat transfer filler in the first and second enclosure shells is in communication through one or more filler communication ports. 11. The device of claim 1, wherein the device housing consists of one of a mobile phone housing, tablet housing, smartphone housing, laptop housing, two in one device housing, desktop computer housing, or server node housing. 12. An electronic component assembly comprising:
a substrate having a first face and an opposed second face; one or more electronic components coupled with either or both of the first and second faces; and a filler interface heat transfer system coupled with the substrate, the filler interface heat transfer system includes:
at least one enclosure shell coupled with one of the first or second faces, the at least one enclosure shell surrounds a filler cavity including the one or more electronic components therein, and
a heat transfer filler within the filler cavity, the heat transfer filler includes a contoured filler profile conforming to at least the one or more electronic components. 13. The assembly of claim 12, wherein the heat transfer filler surrounds the one or more electronic components and is distributed across the substrate within the enclosure shell. 14. The assembly of claim 12, wherein the contoured filler profile conforms to an enclosure profile of the at least one enclosure shell. 15. The assembly of claim 12, wherein the one or more electronic components include a component profile and the contoured filler profile is greater than the component profile. 16. The assembly of claim 12, wherein the heat transfer filler consists of at least one of a phase change material or a heat transfer fluid. 17. The assembly of claim 12, wherein the at least one enclosure shell seals the heat transfer filler within the filler cavity and retains the contoured filler profile in conformation to at least the one or more electronic components. 18. The assembly of claim 12, wherein the at least one enclosure shell includes a first enclosure shell and a second enclosure shell, the filler cavities of the first and second enclosure shells are filled with the heat transfer filler, and
the heat transfer filler in the first and second enclosure shells is in communication through one or more filler communication ports. 19. The assembly of claim 18, wherein the first enclosure shell is on the first face of the substrate and the second enclosure shell is on the opposed second face of the substrate, and
the one or more filler communication ports extend through the substrate. 20. A method for making an electronic device comprising:
coupling an enclosure shell with a substrate, the enclosure shell includes a filler cavity having one or more electronic components coupled with the substrate therein; and interfacing a heat transfer filler with the one or more electronic components in the filler cavity, interfacing includes:
delivering the heat transfer filler to the filler cavity through a filler inflow port extending into the filler cavity,
conforming the heat transfer filler to at least a component profile of the one or more electronic components, and
sealing the enclosure shell filled with the heat transfer filler. 21. The method of claim 20, wherein coupling the enclosure shell with the substrate includes soldering the enclosure shell to the substrate. 22. The method of claim 20, wherein the enclosure shell includes first and second enclosure shells, and delivering the heat transfer filler to the filler cavity includes:
delivering the heat transfer filler to the filler cavity of the first enclosure shell through the filler inflow port, and delivering the heat transfer filler to the filler cavity of the second enclosure shell through a filler communication port extending between the first and second enclosure shells. 23. The method of claim 20, wherein conforming the heat transfer filler to at least the component profile includes fluidly surrounding each of the one or more electronic components. 24. The method of claim 20, wherein interfacing the heat transfer filler with the one or more electronic components in the filler cavity includes conforming the heat transfer filler to the enclosure profile of the enclosure shell. 25. The method of claim 20 comprising coupling the enclosure shell with a device housing, the device housing including the substrate and the one or more electronic components therein. | 2,800 |
11,519 | 11,519 | 15,179,183 | 2,875 | Provided is a light fixture comprising: a) a body, the body having a central portion and two side portions, each of the two side portions situated on one side of the central portion, the two side portions and the central portions running parallel to each other, the central portion recessed in an upward direction in relation to the two side portions, the recess of the central portion forming a ballast room inside of the body; b) two end caps, each end cap attached to an end of the body; c) a plurality of LED (light emitting diode) boards attached to an inside of the side portions of the body; d) one or more ballasts inside of the ballast room; e) a ballast room cover for covering the ballast room; and f) two rectangular-shaped lenses, each lens covering the LED boards attached to the side portion of the body. Each lens can contact the body on one of its long sides and contact the ballast room cover on its other long side. | 1. A light fixture comprising:
a) a body, the body having a central portion and two side portions, each of the two side portions situated on one side of the central portion, the two side portions and the central portions running parallel to each other, the central portion recessed in an upward direction in relation to the two side portions, the recess of the central portion forming a ballast room inside of the body; b) two end caps, each end cap attached to an end of the body; c) a plurality of LED (light emitting diode) boards attached to an inside of the side portions of the body; d) one or more ballasts inside of the ballast room; e) a ballast room cover for covering the ballast room; and f) two rectangular-shaped lenses, each lens covering the LED boards attached to the side portion of the body. 2. The light fixture of claim 1, wherein each lens contacts the body on one of its long sides and contacts the ballast room cover on its other long side. 3. The light fixture of claim 1, wherein the body is fabricated from a single piece of metal. 4. The light fixture of claim 1, wherein the body has a vertical portion on each side of the central portion that is perpendicular to the side portions, and defines a height of the recess. 6. The light fixture of claim 1, further comprising a plurality of heat vents on the ballast room cover and the body. 7. The light fixture of claim 1, further comprising an opening on the room cover for attachment of a motion sensor. 8. The light fixture of claim 1, further comprising a motion sensor attached to the opening on the room cover or the end cap. 9. The light fixture of claim 1, further comprising upwardly extending hang members on the end cap. 10. The light fixture of claim 1, further comprising a wire cover placed inside of the body at each end of body in a transverse direction. 11. The light fixture of claim 10, wherein the ballast room cover is attached to the wire cover. 12. The light fixture of claim 11, wherein the wire cover has a portion which is elevated in relation to the two side portions, the ballast room cover attached to the elevated portion. 13. The light fixture of claim 11, wherein the ballast room cover has a side portion that covers a gap between the two side portions and the elevated wire cover portion. 14. The light fixture of claim 11, wherein the ballast room cover has a side portion that covers a gap between the two side portions of the body and the lenses. 15. The light fixture of claim 11, further comprising a lower side portion on the body configured for the lenses to rest on, the lower side portion configured to hold the lenses in a horizontal plane in conjunction with a slot on the ballast room cover. 16. The light fixture of claim 1, wherein the ballast cover has a horizontal portion with heat vents, the horizontal portion having an elevation facing the body that is less than an elevation facing away from the body. 17. The light fixture of claim 1, wherein the ballast cover has two L-shaped legs configured to hold the lenses on one long side of the lens. 18. The light fixture of claim 17, wherein the ballast cover further comprises a lens holder on each L-shaped leg to create a slot for placement of the lens. 19. A light fixture comprising:
a) a body; b) two end caps, each end cap attached to an end of the body; c) a plurality of LED (light emitting diode) boards attached to the side portions of the body; d) one or more ballasts inside of the ballast room; e) a ballast room cover for covering the ballast room; and f) two rectangular-shaped lenses, each lens covering the LED boards attached to the side portion of the body; wherein the lenses are maintained in the light fixture by the body on one long side of the lens and the ballast room cover on the other parallel long side of the lens. 20. The light fixture of claim 19, further comprising a wire cover placed in a transverse direction in relation to the body, the ballast room cover attached to the wire cover. | Provided is a light fixture comprising: a) a body, the body having a central portion and two side portions, each of the two side portions situated on one side of the central portion, the two side portions and the central portions running parallel to each other, the central portion recessed in an upward direction in relation to the two side portions, the recess of the central portion forming a ballast room inside of the body; b) two end caps, each end cap attached to an end of the body; c) a plurality of LED (light emitting diode) boards attached to an inside of the side portions of the body; d) one or more ballasts inside of the ballast room; e) a ballast room cover for covering the ballast room; and f) two rectangular-shaped lenses, each lens covering the LED boards attached to the side portion of the body. Each lens can contact the body on one of its long sides and contact the ballast room cover on its other long side.1. A light fixture comprising:
a) a body, the body having a central portion and two side portions, each of the two side portions situated on one side of the central portion, the two side portions and the central portions running parallel to each other, the central portion recessed in an upward direction in relation to the two side portions, the recess of the central portion forming a ballast room inside of the body; b) two end caps, each end cap attached to an end of the body; c) a plurality of LED (light emitting diode) boards attached to an inside of the side portions of the body; d) one or more ballasts inside of the ballast room; e) a ballast room cover for covering the ballast room; and f) two rectangular-shaped lenses, each lens covering the LED boards attached to the side portion of the body. 2. The light fixture of claim 1, wherein each lens contacts the body on one of its long sides and contacts the ballast room cover on its other long side. 3. The light fixture of claim 1, wherein the body is fabricated from a single piece of metal. 4. The light fixture of claim 1, wherein the body has a vertical portion on each side of the central portion that is perpendicular to the side portions, and defines a height of the recess. 6. The light fixture of claim 1, further comprising a plurality of heat vents on the ballast room cover and the body. 7. The light fixture of claim 1, further comprising an opening on the room cover for attachment of a motion sensor. 8. The light fixture of claim 1, further comprising a motion sensor attached to the opening on the room cover or the end cap. 9. The light fixture of claim 1, further comprising upwardly extending hang members on the end cap. 10. The light fixture of claim 1, further comprising a wire cover placed inside of the body at each end of body in a transverse direction. 11. The light fixture of claim 10, wherein the ballast room cover is attached to the wire cover. 12. The light fixture of claim 11, wherein the wire cover has a portion which is elevated in relation to the two side portions, the ballast room cover attached to the elevated portion. 13. The light fixture of claim 11, wherein the ballast room cover has a side portion that covers a gap between the two side portions and the elevated wire cover portion. 14. The light fixture of claim 11, wherein the ballast room cover has a side portion that covers a gap between the two side portions of the body and the lenses. 15. The light fixture of claim 11, further comprising a lower side portion on the body configured for the lenses to rest on, the lower side portion configured to hold the lenses in a horizontal plane in conjunction with a slot on the ballast room cover. 16. The light fixture of claim 1, wherein the ballast cover has a horizontal portion with heat vents, the horizontal portion having an elevation facing the body that is less than an elevation facing away from the body. 17. The light fixture of claim 1, wherein the ballast cover has two L-shaped legs configured to hold the lenses on one long side of the lens. 18. The light fixture of claim 17, wherein the ballast cover further comprises a lens holder on each L-shaped leg to create a slot for placement of the lens. 19. A light fixture comprising:
a) a body; b) two end caps, each end cap attached to an end of the body; c) a plurality of LED (light emitting diode) boards attached to the side portions of the body; d) one or more ballasts inside of the ballast room; e) a ballast room cover for covering the ballast room; and f) two rectangular-shaped lenses, each lens covering the LED boards attached to the side portion of the body; wherein the lenses are maintained in the light fixture by the body on one long side of the lens and the ballast room cover on the other parallel long side of the lens. 20. The light fixture of claim 19, further comprising a wire cover placed in a transverse direction in relation to the body, the ballast room cover attached to the wire cover. | 2,800 |
11,520 | 11,520 | 15,816,446 | 2,839 | Generally speaking, a pulse generation unit can aid load transient response for a DC-to-DC converter. In some examples, a pulse generation unit is coupled to an output voltage of the DC-to-DC converter. The pulse generation unit includes a transient sensing unit and a clock augmentation unit. The transient sensing unit monitors the output of the DC-to-DC converter. When the transient sensing unit detects a load transient, the transient sensing unit generates an additional clock pulse. The clock augmentation unit augments an existing clock signal to include the additional clock pulse. | 1. A circuit comprising:
a converter circuit configured to generate an output voltage; a fixed frequency clock circuit configured to generate fixed frequency clock pulses, wherein an existing clock signal includes the fixed frequency clock pulses; a driver circuit configured to operate at least one switch, wherein the driver circuit operates the at least one switch in response to pulse width modulation (PWM) pulses, wherein the PWM pulses are triggered by the fixed frequency clock pulses generated by the fixed frequency clock; and a pulse generation circuit coupled to the converter circuit, the pulse generation circuit including:
a transient sensing circuit configured to monitor the output voltage of the converter circuit, and configured to generate a signal indicating that an additional clock pulse is needed, wherein the additional clock pulse is in addition to the fixed frequency clock pulses generated by the fixed frequency clock circuit; and
a clock augmentation circuit configured to generate an augmented clock signal, wherein the augmented clock signal includes the existing clock signal and the additional clock pulse. 2. The circuit of claim 1, wherein the additional clock pulse is triggers an additional PWM pulse. 3. The circuit of claim 1, further comprising a filter circuit. 4. A circuit comprising:
a converter circuit configured to produce an output voltage; a fixed frequency clock circuit configured to generate fixed frequency clock pulses, wherein an existing clock signal comprises the fixed frequency clock pulses; a driver circuit configured to operate at least one switch; and a pulse generation circuit, wherein the pulse generation circuit is electrically coupled to the converter circuit, and wherein the pulse generation circuit comprises:
an amplifier circuit, wherein the amplifier circuit has a reference voltage source and the output voltage as inputs;
a filter circuit;
an offset generator circuit configured to generate an offset output based, at least in part, on the reference voltage source and the output voltage; and
a comparator circuit configured to generate a comparator output based, at least in part, on the offset output and a common voltage;
wherein the pulse generation circuit is configured to generate an additional clock pulse based, at least in part, on the comparator output, wherein the additional clock pulse is in addition to the fixed frequency clock pulses generated by the fixed frequency clock circuit. 5. The circuit of claim 4, wherein the driver circuit is configured to operate the at least one switch in response to pulse width modulation (PWM) pulses, wherein the PWM pulses are triggered by the fixed frequency clock pulses generated by the fixed frequency clock pulses and the additional clock pulse. 6. The circuit of claim 4, wherein the pulse generation circuit is configured to generate an augmented clock signal, wherein the augmented clock signal includes the fixed frequency clock pulses generated by the fixed frequency clock and the additional clock pulse. 7. The circuit of claim 4, wherein the converter circuit is a DC to DC converter. 8. The circuit of claim 4, wherein the filter circuit is a high pass filter. 9. The circuit of claim 4, wherein the amplifier is configured to amplify the reference voltage source and output voltage by seven to ten times. 10. The circuit of claim 4, wherein the driver circuit is configured to close the at least one switch in response to pulse width modulation (PWM) pulses. 11. A method for augmenting a clock signal of a converter in response to a load transient condition, the method comprising:
receiving, from the converter circuit, an output voltage; amplifying, by an amplifier circuit, the output voltage and a reference voltage source; generating, by an offset generator circuit based on the output voltage and the reference voltage source, an offset output; comparing, by a comparator circuit, the offset output and a common voltage; generating, in response to a determination that the offset output is greater than the common voltage, an additional clock pulse, wherein the additional clock pulse is in addition to fixed frequency clock pulses generated by a fixed frequency clock. 12. The method of claim 11, wherein the additional clock pulse and the fixed frequency clock pulses trigger pulse with modulation (PWM) pulses for the converter circuit. 13. The method of claim 11, wherein the comparing by the comparator circuit comprises comparing by a DC-to-DC converter. 14. The method of claim 11 further comprising:
producing, by the fixed frequency clock, an existing clock signal. 15. The method of claim 14, further comprising generating an augmented clock signal, wherein the augmented clock signal comprises the existing clock signal and the additional clock pulse. 16. The method of claim 11, further comprising amplifying, by the amplifier circuit, the reference voltage source and output voltage by seven to ten times. 17. The method of claim 11, wherein the converter circuit comprises a switch, and the method further comprises causing, by the additional clock pulse, the switch to close. 18. The method of claim 17, wherein the causing the switch to close comprises causing a transistor to close. | Generally speaking, a pulse generation unit can aid load transient response for a DC-to-DC converter. In some examples, a pulse generation unit is coupled to an output voltage of the DC-to-DC converter. The pulse generation unit includes a transient sensing unit and a clock augmentation unit. The transient sensing unit monitors the output of the DC-to-DC converter. When the transient sensing unit detects a load transient, the transient sensing unit generates an additional clock pulse. The clock augmentation unit augments an existing clock signal to include the additional clock pulse.1. A circuit comprising:
a converter circuit configured to generate an output voltage; a fixed frequency clock circuit configured to generate fixed frequency clock pulses, wherein an existing clock signal includes the fixed frequency clock pulses; a driver circuit configured to operate at least one switch, wherein the driver circuit operates the at least one switch in response to pulse width modulation (PWM) pulses, wherein the PWM pulses are triggered by the fixed frequency clock pulses generated by the fixed frequency clock; and a pulse generation circuit coupled to the converter circuit, the pulse generation circuit including:
a transient sensing circuit configured to monitor the output voltage of the converter circuit, and configured to generate a signal indicating that an additional clock pulse is needed, wherein the additional clock pulse is in addition to the fixed frequency clock pulses generated by the fixed frequency clock circuit; and
a clock augmentation circuit configured to generate an augmented clock signal, wherein the augmented clock signal includes the existing clock signal and the additional clock pulse. 2. The circuit of claim 1, wherein the additional clock pulse is triggers an additional PWM pulse. 3. The circuit of claim 1, further comprising a filter circuit. 4. A circuit comprising:
a converter circuit configured to produce an output voltage; a fixed frequency clock circuit configured to generate fixed frequency clock pulses, wherein an existing clock signal comprises the fixed frequency clock pulses; a driver circuit configured to operate at least one switch; and a pulse generation circuit, wherein the pulse generation circuit is electrically coupled to the converter circuit, and wherein the pulse generation circuit comprises:
an amplifier circuit, wherein the amplifier circuit has a reference voltage source and the output voltage as inputs;
a filter circuit;
an offset generator circuit configured to generate an offset output based, at least in part, on the reference voltage source and the output voltage; and
a comparator circuit configured to generate a comparator output based, at least in part, on the offset output and a common voltage;
wherein the pulse generation circuit is configured to generate an additional clock pulse based, at least in part, on the comparator output, wherein the additional clock pulse is in addition to the fixed frequency clock pulses generated by the fixed frequency clock circuit. 5. The circuit of claim 4, wherein the driver circuit is configured to operate the at least one switch in response to pulse width modulation (PWM) pulses, wherein the PWM pulses are triggered by the fixed frequency clock pulses generated by the fixed frequency clock pulses and the additional clock pulse. 6. The circuit of claim 4, wherein the pulse generation circuit is configured to generate an augmented clock signal, wherein the augmented clock signal includes the fixed frequency clock pulses generated by the fixed frequency clock and the additional clock pulse. 7. The circuit of claim 4, wherein the converter circuit is a DC to DC converter. 8. The circuit of claim 4, wherein the filter circuit is a high pass filter. 9. The circuit of claim 4, wherein the amplifier is configured to amplify the reference voltage source and output voltage by seven to ten times. 10. The circuit of claim 4, wherein the driver circuit is configured to close the at least one switch in response to pulse width modulation (PWM) pulses. 11. A method for augmenting a clock signal of a converter in response to a load transient condition, the method comprising:
receiving, from the converter circuit, an output voltage; amplifying, by an amplifier circuit, the output voltage and a reference voltage source; generating, by an offset generator circuit based on the output voltage and the reference voltage source, an offset output; comparing, by a comparator circuit, the offset output and a common voltage; generating, in response to a determination that the offset output is greater than the common voltage, an additional clock pulse, wherein the additional clock pulse is in addition to fixed frequency clock pulses generated by a fixed frequency clock. 12. The method of claim 11, wherein the additional clock pulse and the fixed frequency clock pulses trigger pulse with modulation (PWM) pulses for the converter circuit. 13. The method of claim 11, wherein the comparing by the comparator circuit comprises comparing by a DC-to-DC converter. 14. The method of claim 11 further comprising:
producing, by the fixed frequency clock, an existing clock signal. 15. The method of claim 14, further comprising generating an augmented clock signal, wherein the augmented clock signal comprises the existing clock signal and the additional clock pulse. 16. The method of claim 11, further comprising amplifying, by the amplifier circuit, the reference voltage source and output voltage by seven to ten times. 17. The method of claim 11, wherein the converter circuit comprises a switch, and the method further comprises causing, by the additional clock pulse, the switch to close. 18. The method of claim 17, wherein the causing the switch to close comprises causing a transistor to close. | 2,800 |
11,521 | 11,521 | 14,127,719 | 2,884 | In order to improve fluorescence measurements, there is provided an apparatus and, a method and a computer program for optical analysis of an associated tissue sample, the apparatus comprising a spectrometer comprising an optical detector, a light source, a first light emitter 219 arranged for emitting photons into the associated tissue sample, a first light collector 221 arranged for receiving photons from the associated tissue sample, a second light emitter 223 , a second light collector 225 , wherein a reflectance spectrum is obtained via the first light emitter 219 and collector 221 and a fluorescence spectrum is obtained via the second light emitter 223 and collector 225 , and where a first distance d1 between the first light emitter and collector is larger than a second distance d2 between the second light emitter and collector. By combining the data thus obtained, an intrinsic fluorescence spectrum may be obtained. | 1. An apparatus for optical analysis of an associated tissue sample, the apparatus comprising:
a spectrometer comprising an optical detector, a light source, a first light emitter arranged for emitting photons into the associated tissue sample, a first light collector arranged for receiving photons from the associated tissue sample, a second light emitter arranged for emitting photons into the associated tissue sample, a second light collector arranged for receiving photons from the associated tissue sample, and
where the spectrometer, the light source, the first light emitter and the first light collector are arranged for obtaining a first set of data representative of a spectrum chosen from the group comprising: a reflectance spectrum, a transmission spectrum and an absorption spectrum of the associated tissue sample, and where the spectrometer, the light source, the second light emitter and the second light collector are arranged for obtaining a second set of data representative of a fluorescence spectrum of the associated tissue sample, and the apparatus further comprising
a processor arranged for:
receiving the first set of data, and to determine a wavelength-dependent set of scattering and/or absorption coefficients from the first set of data, and to determine a distortion parameter accordingly,
receiving the second set of data, and
determining a third set of data representative of an intrinsic fluorescence spectrum of the associated tissue sample based on the second set of data and the distortion parameter,
wherein a first distance between the first light emitter and the first light collector is substantially larger than a second distance between the second light emitter and the second light collector, and wherein a first volume of the associated tissue sample which is probed during the measuring the first set of data substantially overlaps a second volume of the associated tissue sample which is probed during the measuring of the second set of data. 2. An apparatus according to claim 1, the apparatus further comprising:
a database comprising a predetermined table of correction factors which enables determination of a third set of data being based on the first set of measured data and the second set of measured data,
and the processor further being arranged for:
accessing the database, and
wherein the determining the third set of data representative of an intrinsic fluorescence spectrum of the associated tissue is furthermore based on the predetermined table of correction factors. 3. An apparatus according to claim 1, wherein each one of the first light emitter, the first light collector, the second light emitter and the second light collector may be a distal end of a light guide. 4. An apparatus according to claim 1, wherein the first light emitter, the first light collector, the second light emitter and the second light collector are comprised within an interventional device. 5. An apparatus according to claim 1, wherein the first distance between the first light emitter and the first light collector is more than 1 mm. 6. An apparatus according to claim 1, wherein the second distance between the second light emitter and the second light collector is less than 1 mm. 7. An apparatus according to claim 1, wherein the second light emitter and the second light collector coincide. 8. An apparatus according to claim 1, wherein a smallest distance between the first light emitter and the first light collector, respectively, and the second light emitter and the second light collector is smaller than the first distance between the first light emitter and the first light collector. 9. An apparatus according to claim 1, wherein the first light collector coincides with the second light collector. 10. (canceled) 11. An apparatus according to claim 2, wherein the database further comprises:
predetermined fourth set of data representative of a predetermined fluorescence spectrum, and wherein the processor is further arranged for determining a first parameter being indicative of a concentration of a biomolecule in the associated tissue sample based on the third set of data and the fourth set of data. 12. A method for optical analysis of an associated tissue sample, the method comprising:
measuring a first set of data representative of a spectrum chosen from the group comprising: a reflectance spectrum, a transmission spectrum and an absorption spectrum of the associated tissue sample, determining a wavelength-dependent set of scattering and/or absorption coefficients from the first set of data, determining a distortion parameter according to the wavelength-dependent set of scattering and/or absorption coefficients, measuring a second set of data representative of a fluorescence spectrum of the associated tissue sample, and determining third set of data representative of an intrinsic fluorescence spectrum of the associated tissue sample based on the second set of data and the distortion parameter,
where the measuring the first set of data comprises emitting photons from a first light emitter, and collecting photons at a first light collector, and
where the measuring the second set of data comprises emitting photons from a second light emitter, and collecting photons at a second light collector,
wherein a first distance between the first light emitter and the first light collector is substantially larger than a second distance between the second light emitter and the second light collector, and wherein a first volume of the associated tissue sample which is probed during the measuring of the first set of data substantially overlaps a second volume of the associated tissue sample which is probed during the measuring of the second set of data. 13. (canceled) 14. A method according to claim 12 for optical analysis of an associated tissue sample, wherein the second volume is substantially a subset of the first volume. 15. (canceled) | In order to improve fluorescence measurements, there is provided an apparatus and, a method and a computer program for optical analysis of an associated tissue sample, the apparatus comprising a spectrometer comprising an optical detector, a light source, a first light emitter 219 arranged for emitting photons into the associated tissue sample, a first light collector 221 arranged for receiving photons from the associated tissue sample, a second light emitter 223 , a second light collector 225 , wherein a reflectance spectrum is obtained via the first light emitter 219 and collector 221 and a fluorescence spectrum is obtained via the second light emitter 223 and collector 225 , and where a first distance d1 between the first light emitter and collector is larger than a second distance d2 between the second light emitter and collector. By combining the data thus obtained, an intrinsic fluorescence spectrum may be obtained.1. An apparatus for optical analysis of an associated tissue sample, the apparatus comprising:
a spectrometer comprising an optical detector, a light source, a first light emitter arranged for emitting photons into the associated tissue sample, a first light collector arranged for receiving photons from the associated tissue sample, a second light emitter arranged for emitting photons into the associated tissue sample, a second light collector arranged for receiving photons from the associated tissue sample, and
where the spectrometer, the light source, the first light emitter and the first light collector are arranged for obtaining a first set of data representative of a spectrum chosen from the group comprising: a reflectance spectrum, a transmission spectrum and an absorption spectrum of the associated tissue sample, and where the spectrometer, the light source, the second light emitter and the second light collector are arranged for obtaining a second set of data representative of a fluorescence spectrum of the associated tissue sample, and the apparatus further comprising
a processor arranged for:
receiving the first set of data, and to determine a wavelength-dependent set of scattering and/or absorption coefficients from the first set of data, and to determine a distortion parameter accordingly,
receiving the second set of data, and
determining a third set of data representative of an intrinsic fluorescence spectrum of the associated tissue sample based on the second set of data and the distortion parameter,
wherein a first distance between the first light emitter and the first light collector is substantially larger than a second distance between the second light emitter and the second light collector, and wherein a first volume of the associated tissue sample which is probed during the measuring the first set of data substantially overlaps a second volume of the associated tissue sample which is probed during the measuring of the second set of data. 2. An apparatus according to claim 1, the apparatus further comprising:
a database comprising a predetermined table of correction factors which enables determination of a third set of data being based on the first set of measured data and the second set of measured data,
and the processor further being arranged for:
accessing the database, and
wherein the determining the third set of data representative of an intrinsic fluorescence spectrum of the associated tissue is furthermore based on the predetermined table of correction factors. 3. An apparatus according to claim 1, wherein each one of the first light emitter, the first light collector, the second light emitter and the second light collector may be a distal end of a light guide. 4. An apparatus according to claim 1, wherein the first light emitter, the first light collector, the second light emitter and the second light collector are comprised within an interventional device. 5. An apparatus according to claim 1, wherein the first distance between the first light emitter and the first light collector is more than 1 mm. 6. An apparatus according to claim 1, wherein the second distance between the second light emitter and the second light collector is less than 1 mm. 7. An apparatus according to claim 1, wherein the second light emitter and the second light collector coincide. 8. An apparatus according to claim 1, wherein a smallest distance between the first light emitter and the first light collector, respectively, and the second light emitter and the second light collector is smaller than the first distance between the first light emitter and the first light collector. 9. An apparatus according to claim 1, wherein the first light collector coincides with the second light collector. 10. (canceled) 11. An apparatus according to claim 2, wherein the database further comprises:
predetermined fourth set of data representative of a predetermined fluorescence spectrum, and wherein the processor is further arranged for determining a first parameter being indicative of a concentration of a biomolecule in the associated tissue sample based on the third set of data and the fourth set of data. 12. A method for optical analysis of an associated tissue sample, the method comprising:
measuring a first set of data representative of a spectrum chosen from the group comprising: a reflectance spectrum, a transmission spectrum and an absorption spectrum of the associated tissue sample, determining a wavelength-dependent set of scattering and/or absorption coefficients from the first set of data, determining a distortion parameter according to the wavelength-dependent set of scattering and/or absorption coefficients, measuring a second set of data representative of a fluorescence spectrum of the associated tissue sample, and determining third set of data representative of an intrinsic fluorescence spectrum of the associated tissue sample based on the second set of data and the distortion parameter,
where the measuring the first set of data comprises emitting photons from a first light emitter, and collecting photons at a first light collector, and
where the measuring the second set of data comprises emitting photons from a second light emitter, and collecting photons at a second light collector,
wherein a first distance between the first light emitter and the first light collector is substantially larger than a second distance between the second light emitter and the second light collector, and wherein a first volume of the associated tissue sample which is probed during the measuring of the first set of data substantially overlaps a second volume of the associated tissue sample which is probed during the measuring of the second set of data. 13. (canceled) 14. A method according to claim 12 for optical analysis of an associated tissue sample, wherein the second volume is substantially a subset of the first volume. 15. (canceled) | 2,800 |
11,522 | 11,522 | 14,918,309 | 2,864 | Various implementations are directed to using chlorophyll data for a marine environment. In one implementation, a non-transitory computer-readable medium may have stored thereon computer-executable instructions which, when executed by a computer, cause the computer to receive chlorophyll data from one or more chlorophyll sensors disposed on a vessel in real-time or substantially near real-time, where the chlorophyll data corresponds to a marine environment proximate to the vessel. The computer-executable instructions may also cause the computer to analyze the received chlorophyll data to determine one or more real-time or substantially near real-time chlorophyll concentrations of the marine environment. The computer-executable instructions may further cause the computer to generate a display based on the real-time or substantially near real-time chlorophyll concentrations. | 1. A non-transitory computer-readable medium having stored thereon computer-executable instructions which, when executed by a computer, cause the computer to:
receive chlorophyll data from one or more chlorophyll sensors disposed on a vessel in real-time or substantially near real-time, wherein the chlorophyll data corresponds to a marine environment proximate to the vessel; analyze the received chlorophyll data to determine one or more real-time or substantially near real-time chlorophyll concentrations of the marine environment; and generate a display based on the real-time or substantially near real-time chlorophyll concentrations. 2. The non-transitory computer-readable medium of claim 1, wherein the generated display comprises one or more visual representations of the one or more real-time or substantially near real-time chlorophyll concentrations combined with a chart map of the marine environment. 3. The non-transitory computer-readable medium of claim 2, wherein the chart map comprises a real-time or substantially near real-time representation of the marine environment, and wherein the chart map includes a symbol representing a real-time or substantially near real-time location of the vessel in the marine environment. 4. The non-transitory computer-readable medium of claim 2, wherein each visual representation corresponds to a different range of the one or more real-time or substantially near real-time chlorophyll concentrations, and wherein each visual representation is shown as a different color on the chart map. 5. The non-transitory computer-readable medium of claim 1, wherein the program instructions which, when executed by the computer, cause the computer to generate the display, further comprise program instructions which, when executed by the computer, cause the computer to generate one or more alerts indicating whether the one or more real-time or substantially near real-time chlorophyll concentrations have changed by a predetermined amount or a predetermined percentage in a predetermined amount of time. 6. The non-transitory computer-readable medium of claim 1, wherein the one or more chlorophyll sensors are mounted to a hull of the vessel, to a transom of the vessel, or to a motor of the vessel. 7. The non-transitory computer-readable medium of claim 1, wherein the one or more chlorophyll sensors include a fluorometer. 8. The non-transitory computer-readable medium of claim 1, wherein the program instructions which, when executed by the computer, cause the computer to receive the chlorophyll data, further comprise program instructions which, when executed by the computer, cause the computer to receive the chlorophyll data at predetermined intervals. 9. The non-transitory computer-readable medium of claim 1, wherein the program instructions which, when executed by the computer, cause the computer to analyze the received chlorophyll data, further comprise program instructions which, when executed by the computer, cause the computer to analyze the received chlorophyll data continuously as the vessel traverses the marine environment. 10. The non-transitory computer-readable medium of claim 1, wherein the computer-executable instructions which, when executed by a computer, further cause the computer to transmit the generated display to a server computing system, a cloud computing system, or combinations thereof. 11. The non-transitory computer-readable medium of claim 1, wherein the computer-executable instructions which, when executed by a computer, further cause the computer to display the generated display using a multi-function display (MFD) device. 12. A system comprising:
one or more chlorophyll sensors configured to be disposed on a vessel, wherein one or more sensors are configured to acquire chlorophyll data corresponding to a marine environment proximate to the vessel; a marine electronics device, comprising:
a processor;
a memory comprising a plurality of program instructions which, when executed by the processor, cause the processor to:
receive the chlorophyll data from the one or more chlorophyll sensors in real-time or substantially near real-time;
analyze the received chlorophyll data to determine one or more real-time or substantially near real-time chlorophyll concentrations of the marine environment; and
generate a display based on the real-time or substantially near real-time chlorophyll concentrations. 13. The system of claim 12, wherein the generated display comprises one or more visual representations of the one or more real-time or substantially near real-time chlorophyll concentrations combined with a chart map of the marine environment. 14. The system of claim 13, wherein the chart map comprises a real-time or substantially near real-time representation of the marine environment, and wherein the chart map includes a symbol representing a real-time or substantially near real-time location of the vessel in the marine environment. 15. The system of claim 13, wherein each visual representation corresponds to a different range of the one or more real-time or substantially near real-time chlorophyll concentrations, and wherein each visual representation is shown as a different color on the chart map. 16. The system of claim 12, wherein the generated display comprises one or more alerts indicating whether the one or more real-time or substantially near real-time chlorophyll concentrations have changed by a predetermined amount or a predetermined percentage for a predetermined range of distance. 17. A non-transitory computer-readable medium having stored thereon computer-executable instructions which, when executed by a computer, cause the computer to:
receive chlorophyll data from one or more chlorophyll sensors disposed on a vessel in real-time or substantially near real-time, wherein the chlorophyll data corresponds to a marine environment proximate to the vessel; analyze the received chlorophyll data to determine one or more real-time or substantially near real-time chlorophyll concentrations of the marine environment; and generate one or more alerts based on the real-time or substantially near real-time chlorophyll concentrations. 18. The non-transitory computer-readable medium of claim 17, wherein the program instructions which, when executed by the computer, cause the computer to generate the one or more alerts, further comprise program instructions which, when executed by the computer, cause the computer generate the one or more alerts based on whether the one or more real-time or substantially near real-time chlorophyll concentrations have changed by a predetermined amount or a predetermined percentage in comparison to a predetermined value. 19. The non-transitory computer-readable medium of claim 17, wherein the one or more alerts are configured to be displayed using a display element. 20. The non-transitory computer-readable medium of claim 17, wherein the one or more alerts comprise one or more audio alerts. | Various implementations are directed to using chlorophyll data for a marine environment. In one implementation, a non-transitory computer-readable medium may have stored thereon computer-executable instructions which, when executed by a computer, cause the computer to receive chlorophyll data from one or more chlorophyll sensors disposed on a vessel in real-time or substantially near real-time, where the chlorophyll data corresponds to a marine environment proximate to the vessel. The computer-executable instructions may also cause the computer to analyze the received chlorophyll data to determine one or more real-time or substantially near real-time chlorophyll concentrations of the marine environment. The computer-executable instructions may further cause the computer to generate a display based on the real-time or substantially near real-time chlorophyll concentrations.1. A non-transitory computer-readable medium having stored thereon computer-executable instructions which, when executed by a computer, cause the computer to:
receive chlorophyll data from one or more chlorophyll sensors disposed on a vessel in real-time or substantially near real-time, wherein the chlorophyll data corresponds to a marine environment proximate to the vessel; analyze the received chlorophyll data to determine one or more real-time or substantially near real-time chlorophyll concentrations of the marine environment; and generate a display based on the real-time or substantially near real-time chlorophyll concentrations. 2. The non-transitory computer-readable medium of claim 1, wherein the generated display comprises one or more visual representations of the one or more real-time or substantially near real-time chlorophyll concentrations combined with a chart map of the marine environment. 3. The non-transitory computer-readable medium of claim 2, wherein the chart map comprises a real-time or substantially near real-time representation of the marine environment, and wherein the chart map includes a symbol representing a real-time or substantially near real-time location of the vessel in the marine environment. 4. The non-transitory computer-readable medium of claim 2, wherein each visual representation corresponds to a different range of the one or more real-time or substantially near real-time chlorophyll concentrations, and wherein each visual representation is shown as a different color on the chart map. 5. The non-transitory computer-readable medium of claim 1, wherein the program instructions which, when executed by the computer, cause the computer to generate the display, further comprise program instructions which, when executed by the computer, cause the computer to generate one or more alerts indicating whether the one or more real-time or substantially near real-time chlorophyll concentrations have changed by a predetermined amount or a predetermined percentage in a predetermined amount of time. 6. The non-transitory computer-readable medium of claim 1, wherein the one or more chlorophyll sensors are mounted to a hull of the vessel, to a transom of the vessel, or to a motor of the vessel. 7. The non-transitory computer-readable medium of claim 1, wherein the one or more chlorophyll sensors include a fluorometer. 8. The non-transitory computer-readable medium of claim 1, wherein the program instructions which, when executed by the computer, cause the computer to receive the chlorophyll data, further comprise program instructions which, when executed by the computer, cause the computer to receive the chlorophyll data at predetermined intervals. 9. The non-transitory computer-readable medium of claim 1, wherein the program instructions which, when executed by the computer, cause the computer to analyze the received chlorophyll data, further comprise program instructions which, when executed by the computer, cause the computer to analyze the received chlorophyll data continuously as the vessel traverses the marine environment. 10. The non-transitory computer-readable medium of claim 1, wherein the computer-executable instructions which, when executed by a computer, further cause the computer to transmit the generated display to a server computing system, a cloud computing system, or combinations thereof. 11. The non-transitory computer-readable medium of claim 1, wherein the computer-executable instructions which, when executed by a computer, further cause the computer to display the generated display using a multi-function display (MFD) device. 12. A system comprising:
one or more chlorophyll sensors configured to be disposed on a vessel, wherein one or more sensors are configured to acquire chlorophyll data corresponding to a marine environment proximate to the vessel; a marine electronics device, comprising:
a processor;
a memory comprising a plurality of program instructions which, when executed by the processor, cause the processor to:
receive the chlorophyll data from the one or more chlorophyll sensors in real-time or substantially near real-time;
analyze the received chlorophyll data to determine one or more real-time or substantially near real-time chlorophyll concentrations of the marine environment; and
generate a display based on the real-time or substantially near real-time chlorophyll concentrations. 13. The system of claim 12, wherein the generated display comprises one or more visual representations of the one or more real-time or substantially near real-time chlorophyll concentrations combined with a chart map of the marine environment. 14. The system of claim 13, wherein the chart map comprises a real-time or substantially near real-time representation of the marine environment, and wherein the chart map includes a symbol representing a real-time or substantially near real-time location of the vessel in the marine environment. 15. The system of claim 13, wherein each visual representation corresponds to a different range of the one or more real-time or substantially near real-time chlorophyll concentrations, and wherein each visual representation is shown as a different color on the chart map. 16. The system of claim 12, wherein the generated display comprises one or more alerts indicating whether the one or more real-time or substantially near real-time chlorophyll concentrations have changed by a predetermined amount or a predetermined percentage for a predetermined range of distance. 17. A non-transitory computer-readable medium having stored thereon computer-executable instructions which, when executed by a computer, cause the computer to:
receive chlorophyll data from one or more chlorophyll sensors disposed on a vessel in real-time or substantially near real-time, wherein the chlorophyll data corresponds to a marine environment proximate to the vessel; analyze the received chlorophyll data to determine one or more real-time or substantially near real-time chlorophyll concentrations of the marine environment; and generate one or more alerts based on the real-time or substantially near real-time chlorophyll concentrations. 18. The non-transitory computer-readable medium of claim 17, wherein the program instructions which, when executed by the computer, cause the computer to generate the one or more alerts, further comprise program instructions which, when executed by the computer, cause the computer generate the one or more alerts based on whether the one or more real-time or substantially near real-time chlorophyll concentrations have changed by a predetermined amount or a predetermined percentage in comparison to a predetermined value. 19. The non-transitory computer-readable medium of claim 17, wherein the one or more alerts are configured to be displayed using a display element. 20. The non-transitory computer-readable medium of claim 17, wherein the one or more alerts comprise one or more audio alerts. | 2,800 |
11,523 | 11,523 | 15,879,180 | 2,859 | A pedestal type device that functions as a non-limiting example charger comprises a connection portion that is constituted by a connection plug and a cover. The cover is supported so as to be movable up and down through a second hole of a placement portion. Furthermore, a convex portion that is protruded toward a front side is provided in a center of a lower end portion of a rear support portion. Two first projections are formed on an upper surface of the cover, and a first hole is formed between them. The connection plug is supported so as to be movable up and down through a third hole. If the convex portion is fitted into a first concave portion formed in a rear surface of electronic device when the electronic device is placed on the placement portion, the first projections are respectively fitted into two third concave portions formed on an undersurface of the electronic device, whereby the cover is pushed down. Therefore, the connection plug is inserted into the depths of a connector of the electronic device. | 1. A charger that charges an electronic device that includes a first connection terminal, a first fitting portion on a first surface, and a second fitting portion on a second surface different from the first surface, the charger comprising:
a third fitting portion configured to be fitted to the first fitting portion; a fourth fitting portion configured to be fitted to the second fitting portion simultaneously with the third fitting portion being fitted to the first fitting portion; a second connection terminal configured to be electrically connected to the first connection terminal of the electronic device simultaneously with the fourth fitting portion being fitted to the second fitting portion; and a placement portion that includes the third fitting portion, the fourth fitting portion and the second connection terminal, and the placement portion is configured to receive the electronic device and hold the electronic device in a predetermined orientation. 2. The charger of claim 1, wherein the fourth fitting portion is a projection and the second fitting portion is a recess configured to receive the projection. 3. The charger of claim 1, wherein the fourth fitting portion includes two projections and the second fitting portion includes two recesses configured to receive the two projections. 4. The charger of claim 3, wherein the second connection terminal is between the two projections. 5. The charger of claim 3, wherein the second connection terminal is centered between the two projections. 6. The charger of claim 1, further comprising a support surface configured to support a rear side of the electronic device while the electronic device is received in the placement portion. 7. The charger of claim 6, wherein the third fitting portion is a protrusion protruding away from the support surface and the first fitting portion is a recess configured to receive the protrusion. 8. The charger of claim 1, wherein the first connection terminal and the second connection terminal are configured to engage in an engaging direction; and the third fitting portion is configured to partially engage with the first fitting portion due to movement of the charger and the electronic device towards each other along the engaging direction before the first connection terminal and the second connection terminal are engaged. 9. The charger of claim 8, further comprising a support surface configured to support a rear side of the electronic device while the electronic device is received in the placement portion, and the engaging direction is parallel to the support surface. 10. The charger of claim 1, wherein the first surface intersects the second surface orthogonally or substantially orthogonally. 11. The charger of claim 1, wherein the third fitting portion is configured to control a position of the electronic device relative to the placement portion, and the fourth fitting portion is configured to control a position of the first connection terminal relative to the second connection terminal. 12. The charger of claim 1, wherein the second fitting portion and the fourth fitting portion are configured to engage in an engaging direction, and the fourth fitting portion includes a projection having an inclined surface that is inclined to the engaging direction. 13. The charger of claim 12, wherein the fourth fitting portion includes a projection in a shape of cone or truncated cone. 14. The charger of claim 1, wherein the first connection terminal and the second connection terminal are configured to engage in an engaging direction; and the fourth fitting portion is configured to partially engage with the second fitting portion due to movement of the charger and the electronic device towards each other along the engaging direction before the first connection terminal and the second connection terminal are completely engaged. 15. A charger that charges an electronic device that includes a first connection terminal, a first recess on a first surface, and a second recess on a second surface different from the first surface, the charger comprising:
a first protrusion shaped to be received within the first recess; a second protrusion shaped to be received within the second recess simultaneously with the first protrusion being within the first recess; a second connection terminal configured to be electrically connected to the first connection terminal of the electronic device simultaneously with the second protrusion being received within the second recess; and a placement portion that includes the first protrusion, the second protrusion and the second connection terminal, and the placement portion is configured to receive the electronic device and hold the electronic device in a predetermined orientation. 16. The charger of claim 15, further comprising a third protrusion with the same shape as the second protrusion and shaped to be received in a third recess on the second surface of the electronic device. 17. The charger of claim 16, wherein the second connection terminal is between the second protrusion and the third protrusion. 18. The charger of claim 16, wherein the second connection terminal is centered between the second protrusion and the third protrusion. 19. The charger of claim 15, further comprising a support surface configured to support a rear side of the electronic device while the electronic device is received in the placement portion. 20. The charger of claim 19, wherein the first protrusion protrudes away from the support surface. 21. The charger of claim 15, wherein the first connection terminal and the second connection terminal are configured to engage in an engaging direction; and the first protrusion is configured to be partially received within the first recess due to movement of the charger and the electronic device towards each other along the engaging direction before the first connection terminal and the second connection terminal are engaged. 22. The charger of claim 21, further comprising a support surface configured to support a rear side of the electronic device while the electronic device is received in the placement portion, and the engaging direction is parallel to the support surface. 23. The charger of claim 15, wherein the first surface intersects the second surface orthogonally or substantially orthogonally. 24. The charger of claim 15, wherein the first protrusion is configured to control a position of the electronic device relative to the placement portion, and the second protrusion is configured to control a position of the first connection terminal relative to the second connection terminal. 25. The charger of claim 15, wherein the second recess and the second protrusion are configured to engage in an engaging direction, and the second protrusion has an inclined surface that is inclined to the engaging direction. 26. The charger of claim 25, wherein the second protrusion includes a cone or truncated cone. 27. The charger of claim 15, wherein the first connection terminal and the second connection terminal are configured to engage in an engaging direction; and the second protrusion is configured to partially engage with the second recess due to movement of the charger and the electronic device towards each other along the engaging direction before the first connection terminal and the second connection terminal are completely engaged. | A pedestal type device that functions as a non-limiting example charger comprises a connection portion that is constituted by a connection plug and a cover. The cover is supported so as to be movable up and down through a second hole of a placement portion. Furthermore, a convex portion that is protruded toward a front side is provided in a center of a lower end portion of a rear support portion. Two first projections are formed on an upper surface of the cover, and a first hole is formed between them. The connection plug is supported so as to be movable up and down through a third hole. If the convex portion is fitted into a first concave portion formed in a rear surface of electronic device when the electronic device is placed on the placement portion, the first projections are respectively fitted into two third concave portions formed on an undersurface of the electronic device, whereby the cover is pushed down. Therefore, the connection plug is inserted into the depths of a connector of the electronic device.1. A charger that charges an electronic device that includes a first connection terminal, a first fitting portion on a first surface, and a second fitting portion on a second surface different from the first surface, the charger comprising:
a third fitting portion configured to be fitted to the first fitting portion; a fourth fitting portion configured to be fitted to the second fitting portion simultaneously with the third fitting portion being fitted to the first fitting portion; a second connection terminal configured to be electrically connected to the first connection terminal of the electronic device simultaneously with the fourth fitting portion being fitted to the second fitting portion; and a placement portion that includes the third fitting portion, the fourth fitting portion and the second connection terminal, and the placement portion is configured to receive the electronic device and hold the electronic device in a predetermined orientation. 2. The charger of claim 1, wherein the fourth fitting portion is a projection and the second fitting portion is a recess configured to receive the projection. 3. The charger of claim 1, wherein the fourth fitting portion includes two projections and the second fitting portion includes two recesses configured to receive the two projections. 4. The charger of claim 3, wherein the second connection terminal is between the two projections. 5. The charger of claim 3, wherein the second connection terminal is centered between the two projections. 6. The charger of claim 1, further comprising a support surface configured to support a rear side of the electronic device while the electronic device is received in the placement portion. 7. The charger of claim 6, wherein the third fitting portion is a protrusion protruding away from the support surface and the first fitting portion is a recess configured to receive the protrusion. 8. The charger of claim 1, wherein the first connection terminal and the second connection terminal are configured to engage in an engaging direction; and the third fitting portion is configured to partially engage with the first fitting portion due to movement of the charger and the electronic device towards each other along the engaging direction before the first connection terminal and the second connection terminal are engaged. 9. The charger of claim 8, further comprising a support surface configured to support a rear side of the electronic device while the electronic device is received in the placement portion, and the engaging direction is parallel to the support surface. 10. The charger of claim 1, wherein the first surface intersects the second surface orthogonally or substantially orthogonally. 11. The charger of claim 1, wherein the third fitting portion is configured to control a position of the electronic device relative to the placement portion, and the fourth fitting portion is configured to control a position of the first connection terminal relative to the second connection terminal. 12. The charger of claim 1, wherein the second fitting portion and the fourth fitting portion are configured to engage in an engaging direction, and the fourth fitting portion includes a projection having an inclined surface that is inclined to the engaging direction. 13. The charger of claim 12, wherein the fourth fitting portion includes a projection in a shape of cone or truncated cone. 14. The charger of claim 1, wherein the first connection terminal and the second connection terminal are configured to engage in an engaging direction; and the fourth fitting portion is configured to partially engage with the second fitting portion due to movement of the charger and the electronic device towards each other along the engaging direction before the first connection terminal and the second connection terminal are completely engaged. 15. A charger that charges an electronic device that includes a first connection terminal, a first recess on a first surface, and a second recess on a second surface different from the first surface, the charger comprising:
a first protrusion shaped to be received within the first recess; a second protrusion shaped to be received within the second recess simultaneously with the first protrusion being within the first recess; a second connection terminal configured to be electrically connected to the first connection terminal of the electronic device simultaneously with the second protrusion being received within the second recess; and a placement portion that includes the first protrusion, the second protrusion and the second connection terminal, and the placement portion is configured to receive the electronic device and hold the electronic device in a predetermined orientation. 16. The charger of claim 15, further comprising a third protrusion with the same shape as the second protrusion and shaped to be received in a third recess on the second surface of the electronic device. 17. The charger of claim 16, wherein the second connection terminal is between the second protrusion and the third protrusion. 18. The charger of claim 16, wherein the second connection terminal is centered between the second protrusion and the third protrusion. 19. The charger of claim 15, further comprising a support surface configured to support a rear side of the electronic device while the electronic device is received in the placement portion. 20. The charger of claim 19, wherein the first protrusion protrudes away from the support surface. 21. The charger of claim 15, wherein the first connection terminal and the second connection terminal are configured to engage in an engaging direction; and the first protrusion is configured to be partially received within the first recess due to movement of the charger and the electronic device towards each other along the engaging direction before the first connection terminal and the second connection terminal are engaged. 22. The charger of claim 21, further comprising a support surface configured to support a rear side of the electronic device while the electronic device is received in the placement portion, and the engaging direction is parallel to the support surface. 23. The charger of claim 15, wherein the first surface intersects the second surface orthogonally or substantially orthogonally. 24. The charger of claim 15, wherein the first protrusion is configured to control a position of the electronic device relative to the placement portion, and the second protrusion is configured to control a position of the first connection terminal relative to the second connection terminal. 25. The charger of claim 15, wherein the second recess and the second protrusion are configured to engage in an engaging direction, and the second protrusion has an inclined surface that is inclined to the engaging direction. 26. The charger of claim 25, wherein the second protrusion includes a cone or truncated cone. 27. The charger of claim 15, wherein the first connection terminal and the second connection terminal are configured to engage in an engaging direction; and the second protrusion is configured to partially engage with the second recess due to movement of the charger and the electronic device towards each other along the engaging direction before the first connection terminal and the second connection terminal are completely engaged. | 2,800 |
11,524 | 11,524 | 15,299,791 | 2,859 | A pedestal type device that functions as anon-limiting example charger comprises a connection portion that is constituted by a connection plug and a cover. The cover is supported so as to be movable up and down through a second hole of a placement portion. Furthermore, a convex portion that is protruded toward a front side is provided in a center of a lower end portion of a rear support portion. Two first projections are formed on an upper surface of the cover, and a first hole is formed between them. The connection plug is supported so as to be movable up and down through a third hole. If the convex portion is fitted into a first concave portion formed in a rear surface of electronic device when the electronic device is placed on the placement portion, the first projections are respectively fitted into two third concave portions formed on an undersurface of the electronic device, whereby the cover is pushed down. Therefore, the connection plug is inserted into the depths of a connector of the electronic device. | 1. A charger that charges an electronic device while placing the same on a placement portion, comprising:
a second fitting portion configured to be fitted to a first fitting portion on a first surface of the electronic device; a fourth fitting portion configured to be fitted to a third fitting portion on a second surface that is different from the first surface of the electronic device in a state where the first fitting portion is fitted to the second fitting portion; and a second connection terminal configured to be electrically connected to a first connection terminal of the electronic device in conjunction with the fourth fitting portion. 2. The charger according to claim 1, wherein the first surface intersects the second surface orthogonally or substantively orthogonally. 3. The charger according to claim 1, wherein the second fitting portion functions as a first positioning member that determines a position of the electronic device to the placement portion, and the fourth fitting portion functions as a second positioning member that determines a position of the first connection terminal to the second connection terminal. 4. The charger according to claim 1, wherein a fitting precision of the second fitting portion and the first fitting portion is lower than a fitting precision of the third fitting portion and the fourth fitting portion. 5. The charger according to claim 1, wherein the second fitting portion is in a position configured to fit to the first fitting portion prior to the fourth fitting portion is fitted to the third fitting portion when placing the electronic device on the placement portion. 6. The charger according to claim 1, wherein the fourth fitting portion is movable in a direction perpendicular to a direction that the electronic device is placed on the placement portion. 7. The charger according to claim 1, further comprising an elastic body that is disposed between the fourth fitting portion and a main body of the charger. 8. The charger according to claim 1, wherein the second connection terminal is disposed between two fourth fitting portions. 9. The charger according to claim 1, further comprising a movable member that surrounds at least the second connection terminal, and configured to move in a first direction that the electronic device is placed on the placement portion. 10. The charger according to claim 9, wherein the fourth fitting portion is on a surface of the movable member. 11. The charger according to claim 10, wherein the fourth fitting portion includes a projection having an inclined surface that is inclined to the first direction. 12. The charger according to claim 10, wherein the fourth fitting portion includes a projection in a shape of cone or truncated cone. 13. The charger according to claim 9, further comprising a first support member that supports the second connection terminal movably in a second direction perpendicular to the first direction; and a second support member that is different from the first support member, and supports the movable member movably in at least the second direction, wherein
when the third fitting portion is fitted to the fourth fitting portion, the second connection terminal is moved in the second direction as the movable member is moved in the second direction. 14. The charger according to claim 13 wherein each of the first support member and the second support member includes an elastic body. 15. A charger that charges an electronic device that has a first fitting portion and a first connection terminal, and is placed on a placement portion of the Charger, comprising:
a second fitting portion configured to be fitted to the first fitting portion; a second connection terminal configured to be electrically connected to the first connection terminal; and a movable member that is movable in a direction perpendicular to a direction that the electronic device is placed on the placement portion in conjunction with the second fitting portion, and surrounds of the second connection terminal. 16. A charging system comprising an electronic device and a charger that charges the electronic device placed on a placement portion, wherein
the electronic device comprises
a first fitting portion on a first surface, and
a second fitting portion on a second surface that is different from the first surface and a first connection terminal, and
the charger comprises
a third fitting portion configured to be is fitted to the first fitting portion,
a fourth fitting portion configured to be fitted to the second fitting portion in a state where the first fitting portion is fitted to the third fitting portion, and
a second connection terminal configured to be electrically connected to the first connection terminal of the electronic device in conjunction with the fourth fitting portion. | A pedestal type device that functions as anon-limiting example charger comprises a connection portion that is constituted by a connection plug and a cover. The cover is supported so as to be movable up and down through a second hole of a placement portion. Furthermore, a convex portion that is protruded toward a front side is provided in a center of a lower end portion of a rear support portion. Two first projections are formed on an upper surface of the cover, and a first hole is formed between them. The connection plug is supported so as to be movable up and down through a third hole. If the convex portion is fitted into a first concave portion formed in a rear surface of electronic device when the electronic device is placed on the placement portion, the first projections are respectively fitted into two third concave portions formed on an undersurface of the electronic device, whereby the cover is pushed down. Therefore, the connection plug is inserted into the depths of a connector of the electronic device.1. A charger that charges an electronic device while placing the same on a placement portion, comprising:
a second fitting portion configured to be fitted to a first fitting portion on a first surface of the electronic device; a fourth fitting portion configured to be fitted to a third fitting portion on a second surface that is different from the first surface of the electronic device in a state where the first fitting portion is fitted to the second fitting portion; and a second connection terminal configured to be electrically connected to a first connection terminal of the electronic device in conjunction with the fourth fitting portion. 2. The charger according to claim 1, wherein the first surface intersects the second surface orthogonally or substantively orthogonally. 3. The charger according to claim 1, wherein the second fitting portion functions as a first positioning member that determines a position of the electronic device to the placement portion, and the fourth fitting portion functions as a second positioning member that determines a position of the first connection terminal to the second connection terminal. 4. The charger according to claim 1, wherein a fitting precision of the second fitting portion and the first fitting portion is lower than a fitting precision of the third fitting portion and the fourth fitting portion. 5. The charger according to claim 1, wherein the second fitting portion is in a position configured to fit to the first fitting portion prior to the fourth fitting portion is fitted to the third fitting portion when placing the electronic device on the placement portion. 6. The charger according to claim 1, wherein the fourth fitting portion is movable in a direction perpendicular to a direction that the electronic device is placed on the placement portion. 7. The charger according to claim 1, further comprising an elastic body that is disposed between the fourth fitting portion and a main body of the charger. 8. The charger according to claim 1, wherein the second connection terminal is disposed between two fourth fitting portions. 9. The charger according to claim 1, further comprising a movable member that surrounds at least the second connection terminal, and configured to move in a first direction that the electronic device is placed on the placement portion. 10. The charger according to claim 9, wherein the fourth fitting portion is on a surface of the movable member. 11. The charger according to claim 10, wherein the fourth fitting portion includes a projection having an inclined surface that is inclined to the first direction. 12. The charger according to claim 10, wherein the fourth fitting portion includes a projection in a shape of cone or truncated cone. 13. The charger according to claim 9, further comprising a first support member that supports the second connection terminal movably in a second direction perpendicular to the first direction; and a second support member that is different from the first support member, and supports the movable member movably in at least the second direction, wherein
when the third fitting portion is fitted to the fourth fitting portion, the second connection terminal is moved in the second direction as the movable member is moved in the second direction. 14. The charger according to claim 13 wherein each of the first support member and the second support member includes an elastic body. 15. A charger that charges an electronic device that has a first fitting portion and a first connection terminal, and is placed on a placement portion of the Charger, comprising:
a second fitting portion configured to be fitted to the first fitting portion; a second connection terminal configured to be electrically connected to the first connection terminal; and a movable member that is movable in a direction perpendicular to a direction that the electronic device is placed on the placement portion in conjunction with the second fitting portion, and surrounds of the second connection terminal. 16. A charging system comprising an electronic device and a charger that charges the electronic device placed on a placement portion, wherein
the electronic device comprises
a first fitting portion on a first surface, and
a second fitting portion on a second surface that is different from the first surface and a first connection terminal, and
the charger comprises
a third fitting portion configured to be is fitted to the first fitting portion,
a fourth fitting portion configured to be fitted to the second fitting portion in a state where the first fitting portion is fitted to the third fitting portion, and
a second connection terminal configured to be electrically connected to the first connection terminal of the electronic device in conjunction with the fourth fitting portion. | 2,800 |
11,525 | 11,525 | 14,198,923 | 2,893 | A method and structure of an image sensor device including a read out integrated circuit (ROIC) and a photodiode array (PDA). An embodiment may include a package substrate having a recess and a raised pedestal within the recess; a read out integrated circuit (ROIC) physically attached to the raised pedestal; a photodiode array (PDA) physically attached to the ROIC and electrically coupled therewith; and a printed circuit board (PCB) within the recess in the package substrate, wherein the PCB has an opening therein and the raised pedestal at least partially extends through the opening in the PCB. | 1. An image sensor, comprising:
a package substrate comprising a recess and a raised pedestal within the recess; a read out integrated circuit (ROIC) physically attached to the raised pedestal; a photodiode array (PDA) physically attached to the ROIC and electrically coupled therewith; and a printed circuit board (PCB) within the recess in the package substrate, wherein the PCB has an opening therein and the raised pedestal at least partially extends through the opening in the PCB. 2. The image sensor of claim 1, further comprising an encapsulation layer that environmentally seals a surface of the PCB within the package substrate. 3. The image sensor of claim 2, further comprising an electrical connector electrically coupled to the PCB, wherein the electrical connector extends from the circuit board through the encapsulation layer to provide an external package electrical connection to the PCB. 4. The image sensor of claim 2, wherein the encapsulation layer is formed on a first side of the package substrate and the device further comprises an electrical connector electrically coupled to the PCB and extending from a second side of the package substrate that is opposite the first side to provide an external package electrical connection to the PCB. 5. The image sensor of claim 2, further comprising an optically transparent window attached to the PDA, wherein the encapsulation layer physically contacts the optically transparent window. 6. The image sensor of claim 1, further comprising a plurality of bond wires that electrically couple the PCB to the ROIC, wherein the PDA is flip chip mounted to the ROIC and the plurality of bond wires are electrically coupled to the PDA through the ROIC. 7. The image sensor of claim 1, wherein the ROIC, the PDA, and the PCB are received within the recess in the package substrate in their entirety. 8. A method for forming an image sensor, comprising:
attaching a printed circuit board (PCB) within a recess in a package substrate such that a raised pedestal within the recess of the package substrate at least partially extends through an opening within the PCB; attaching a read out integrated circuit (ROIC) to the raised pedestal of the package substrate; attaching a photodiode array (PDA) to the ROIC, wherein the PDA is electrically coupled to the ROIC; and electrically coupling the ROIC to the PCB. 9. The method of claim 8, further comprising dispensing an encapsulation layer within the recess in the package substrate to environmentally seal a surface of the PCB within the package substrate. 10. The method of claim 9, further comprising physically contacting an electrical connector with the encapsulation layer during the dispensing of the encapsulation layer wherein, subsequent to dispensing the encapsulation layer, the electrical connector extends through the encapsulation layer to provide an external package electrical connection to the PCB. 11. The method of claim 9, further comprising dispensing the encapsulation layer on a first side of the package substrate such that an electrical connector extends from a second side of the package substrate that is opposite the first side and the electrical connector provides an external package electrical connection to the PCB. 12. The method of claim 9, further comprising attaching an optically transparent window to a surface of the PDA, wherein the dispensing of the encapsulation layer physically contacts the optically transparent window with the encapsulation layer. 13. The method of claim 8, further comprising:
flip chip mounting the PDA to the ROIC; and electrically coupling the PCB to the PDA by using a plurality of bond wires to couple the PCB to the ROIC. 14. The method of claim 8, further comprising placing the ROIC, the PDA, and the PCB in their entireties within the recess in the package substrate. 15. The method of claim 14 wherein, subsequent to the attaching of the PCB within the recess in the package substrate, the ROIC to the raised pedestal of the package substrate, and the PDA to the ROIC, the PCB surrounds the ROIC and the PDA through 360 degrees. | A method and structure of an image sensor device including a read out integrated circuit (ROIC) and a photodiode array (PDA). An embodiment may include a package substrate having a recess and a raised pedestal within the recess; a read out integrated circuit (ROIC) physically attached to the raised pedestal; a photodiode array (PDA) physically attached to the ROIC and electrically coupled therewith; and a printed circuit board (PCB) within the recess in the package substrate, wherein the PCB has an opening therein and the raised pedestal at least partially extends through the opening in the PCB.1. An image sensor, comprising:
a package substrate comprising a recess and a raised pedestal within the recess; a read out integrated circuit (ROIC) physically attached to the raised pedestal; a photodiode array (PDA) physically attached to the ROIC and electrically coupled therewith; and a printed circuit board (PCB) within the recess in the package substrate, wherein the PCB has an opening therein and the raised pedestal at least partially extends through the opening in the PCB. 2. The image sensor of claim 1, further comprising an encapsulation layer that environmentally seals a surface of the PCB within the package substrate. 3. The image sensor of claim 2, further comprising an electrical connector electrically coupled to the PCB, wherein the electrical connector extends from the circuit board through the encapsulation layer to provide an external package electrical connection to the PCB. 4. The image sensor of claim 2, wherein the encapsulation layer is formed on a first side of the package substrate and the device further comprises an electrical connector electrically coupled to the PCB and extending from a second side of the package substrate that is opposite the first side to provide an external package electrical connection to the PCB. 5. The image sensor of claim 2, further comprising an optically transparent window attached to the PDA, wherein the encapsulation layer physically contacts the optically transparent window. 6. The image sensor of claim 1, further comprising a plurality of bond wires that electrically couple the PCB to the ROIC, wherein the PDA is flip chip mounted to the ROIC and the plurality of bond wires are electrically coupled to the PDA through the ROIC. 7. The image sensor of claim 1, wherein the ROIC, the PDA, and the PCB are received within the recess in the package substrate in their entirety. 8. A method for forming an image sensor, comprising:
attaching a printed circuit board (PCB) within a recess in a package substrate such that a raised pedestal within the recess of the package substrate at least partially extends through an opening within the PCB; attaching a read out integrated circuit (ROIC) to the raised pedestal of the package substrate; attaching a photodiode array (PDA) to the ROIC, wherein the PDA is electrically coupled to the ROIC; and electrically coupling the ROIC to the PCB. 9. The method of claim 8, further comprising dispensing an encapsulation layer within the recess in the package substrate to environmentally seal a surface of the PCB within the package substrate. 10. The method of claim 9, further comprising physically contacting an electrical connector with the encapsulation layer during the dispensing of the encapsulation layer wherein, subsequent to dispensing the encapsulation layer, the electrical connector extends through the encapsulation layer to provide an external package electrical connection to the PCB. 11. The method of claim 9, further comprising dispensing the encapsulation layer on a first side of the package substrate such that an electrical connector extends from a second side of the package substrate that is opposite the first side and the electrical connector provides an external package electrical connection to the PCB. 12. The method of claim 9, further comprising attaching an optically transparent window to a surface of the PDA, wherein the dispensing of the encapsulation layer physically contacts the optically transparent window with the encapsulation layer. 13. The method of claim 8, further comprising:
flip chip mounting the PDA to the ROIC; and electrically coupling the PCB to the PDA by using a plurality of bond wires to couple the PCB to the ROIC. 14. The method of claim 8, further comprising placing the ROIC, the PDA, and the PCB in their entireties within the recess in the package substrate. 15. The method of claim 14 wherein, subsequent to the attaching of the PCB within the recess in the package substrate, the ROIC to the raised pedestal of the package substrate, and the PDA to the ROIC, the PCB surrounds the ROIC and the PDA through 360 degrees. | 2,800 |
11,526 | 11,526 | 15,910,775 | 2,882 | Embodiments of the present disclosure generally relate to apparatuses and systems for performing photolithography processes. More particularly, compact illumination tools for projecting an image onto a substrate are provided. In one embodiment, an illumination tool includes a microLED array including one or more microLEDs. Each microLED produces at least one light beam. The illumination tool also includes a beamsplitter adjacent the microLED array, a camera adjacent the beamsplitter, and a projection optics system adjacent the beamsplitter. | 1. An illumination tool, comprising:
a microLED array, wherein the microLED array comprises one or more microLED, wherein each microLED produces at least one light beam; a beamsplitter adjacent the microLED array; a camera adjacent the beamsplitter; and a projection optics system adjacent the beamsplitter. 2. The illumination tool of claim 1 further comprising a projection lens adjacent the projection optics system. 3. The illumination tool of claim 2, wherein the projection lens comprises a focus group. 4. The illumination tool of claim 3, wherein the projection lens further comprises a window coupled to the focus group. 5. The illumination tool of claim 4, further comprising a focus monitor adjacent the focus group and the projection optics system. 6. The illumination tool of claim 1, further comprising a focus sensor adjacent the camera. 7. The illumination tool of claim 1, further comprising a distortion compensator coupled to the projection optics system. 8. The illumination tool of claim 7, wherein the distortion compensator is disposed between the projection lens and the beamsplitter. 9. An illumination tool, comprising:
a microLED array, wherein the microLED array comprises one or more microLED, wherein each microLED produces at least one light beam; a beamsplitter adjacent the microLED array; a camera adjacent the beamsplitter; a projection optics system adjacent the beamsplitter; and a projection lens coupled to the projection optics system. 10. The illumination tool of claim 9, wherein the projection lens further comprises a focus group. 11. The illumination tool of claim 9, wherein the projection lens further comprises a window coupled to the focus group. 12. The illumination tool of claim 10, further comprising a focus sensor adjacent the camera. 13. The illumination tool of claim 11, wherein the focus sensor and camera are coupled orthogonally to the beamsplitter. 14. The illumination tool of claim 13, further comprising:
a mounting plate, the microLED array, the beamsplitter, and the projection optics system are coupled to the mounting plate. 15. The illumination tool of claim 14, further comprising a distortion compensator coupled to the projection optics system. 16. An illumination tool system, comprising:
one or more stages, wherein the two or more stages are configured to hold one or more substrates; and one or more illumination tools for patterning the one or more substrates, wherein each illumination tool comprises:
a microLED array, wherein the microLED array comprises one or more microLED, wherein each microLED produces at least one light beam;
a beamsplitter adjacent the microLED array;
a camera adjacent the beamsplitter; and
a projection optics system adjacent the beamsplitter. 17. The illumination tool system of claim 16, wherein the projection lens further comprises a focus group. 18. The illumination tool system of claim 17, wherein the projection lens further comprises a window coupled to the focus group. 19. The illumination tool system of claim 17, further comprising a focus sensor coupled to the camera. 20. The illumination tool system of claim 17, further comprising a mounting plate, the microLED array, the beamsplitter, and the projection optics system are coupled to the mounting plate. | Embodiments of the present disclosure generally relate to apparatuses and systems for performing photolithography processes. More particularly, compact illumination tools for projecting an image onto a substrate are provided. In one embodiment, an illumination tool includes a microLED array including one or more microLEDs. Each microLED produces at least one light beam. The illumination tool also includes a beamsplitter adjacent the microLED array, a camera adjacent the beamsplitter, and a projection optics system adjacent the beamsplitter.1. An illumination tool, comprising:
a microLED array, wherein the microLED array comprises one or more microLED, wherein each microLED produces at least one light beam; a beamsplitter adjacent the microLED array; a camera adjacent the beamsplitter; and a projection optics system adjacent the beamsplitter. 2. The illumination tool of claim 1 further comprising a projection lens adjacent the projection optics system. 3. The illumination tool of claim 2, wherein the projection lens comprises a focus group. 4. The illumination tool of claim 3, wherein the projection lens further comprises a window coupled to the focus group. 5. The illumination tool of claim 4, further comprising a focus monitor adjacent the focus group and the projection optics system. 6. The illumination tool of claim 1, further comprising a focus sensor adjacent the camera. 7. The illumination tool of claim 1, further comprising a distortion compensator coupled to the projection optics system. 8. The illumination tool of claim 7, wherein the distortion compensator is disposed between the projection lens and the beamsplitter. 9. An illumination tool, comprising:
a microLED array, wherein the microLED array comprises one or more microLED, wherein each microLED produces at least one light beam; a beamsplitter adjacent the microLED array; a camera adjacent the beamsplitter; a projection optics system adjacent the beamsplitter; and a projection lens coupled to the projection optics system. 10. The illumination tool of claim 9, wherein the projection lens further comprises a focus group. 11. The illumination tool of claim 9, wherein the projection lens further comprises a window coupled to the focus group. 12. The illumination tool of claim 10, further comprising a focus sensor adjacent the camera. 13. The illumination tool of claim 11, wherein the focus sensor and camera are coupled orthogonally to the beamsplitter. 14. The illumination tool of claim 13, further comprising:
a mounting plate, the microLED array, the beamsplitter, and the projection optics system are coupled to the mounting plate. 15. The illumination tool of claim 14, further comprising a distortion compensator coupled to the projection optics system. 16. An illumination tool system, comprising:
one or more stages, wherein the two or more stages are configured to hold one or more substrates; and one or more illumination tools for patterning the one or more substrates, wherein each illumination tool comprises:
a microLED array, wherein the microLED array comprises one or more microLED, wherein each microLED produces at least one light beam;
a beamsplitter adjacent the microLED array;
a camera adjacent the beamsplitter; and
a projection optics system adjacent the beamsplitter. 17. The illumination tool system of claim 16, wherein the projection lens further comprises a focus group. 18. The illumination tool system of claim 17, wherein the projection lens further comprises a window coupled to the focus group. 19. The illumination tool system of claim 17, further comprising a focus sensor coupled to the camera. 20. The illumination tool system of claim 17, further comprising a mounting plate, the microLED array, the beamsplitter, and the projection optics system are coupled to the mounting plate. | 2,800 |
11,527 | 11,527 | 15,649,341 | 2,882 | Embodiments of the present disclosure generally relate to apparatuses and systems for performing photolithography processes. More particularly, compact illumination tools for projecting an image onto a substrate are provided. In one embodiment, an illumination tool includes a microLED array including one or more microLEDs. Each microLED produces at least one light beam. The illumination tool also includes a beamsplitter adjacent the microLED array, one or more refractory lens components adjacent the beam splitter, and a projection lens adjacent the one or more refractory lens components. The mounting plate advantageously provides for compact alignment in a system having a plurality of illumination tools, each of which is easily removable and replaceable. | 1. An illumination tool, comprising:
a microLED array, wherein the microLED array comprises one or more microLED, wherein each microLED produces at least one light beam; a beamsplitter adjacent the microLED array; one or more refractory lens components adjacent the beamsplitter; and a projection lens adjacent the one or more refractory lens components. 2. The illumination tool of claim 1, wherein the projection lens further comprises:
a focus group; and a window. 3. The illumination tool of claim 2, further comprising:
a focus sensor; and a camera. 4. The illumination tool of claim 3, wherein the focus sensor and camera are disposed adjacent the beamsplitter. 5. The illumination tool of claim 4, further comprising:
a light dump. 6. The illumination tool of claim 5, further comprising:
a light level sensor. 7. The illumination tool of claim 6, further comprising:
a distortion compensator. 8. The illumination tool of claim 7, wherein the distortion compensator is disposed between the projection lens and the beamsplitter. 9. An illumination tool, comprising:
a microLED array, wherein the microLED array comprises one or more microLED, wherein each microLED produces at least one light beam; a beamsplitter adjacent the microLED array; one or more refractory lens components adjacent the beamsplitter; a projection lens adjacent the one or more refractory lens components; and a distortion compensator disposed between the projection lens and the beamsplitter. 10. The illumination tool of claim 9, wherein the projection lens further comprises:
a focus group; and a window. 11. The illumination tool of claim 10, further comprising:
a focus sensor; and a camera. 12. The illumination tool of claim 11, wherein the focus sensor and camera are coupled orthogonally to the beamsplitter. 13. The illumination tool of claim 12, further comprising:
a light dump. 14. The illumination tool of claim 13, further comprising:
a mounting plate, wherein the frustrated cube assembly, the microLED array, the beamsplitter, and the one or more refractory lens components are coupled to the mounting plate. 15. The illumination tool of claim 14, further comprising:
a light level sensor. 16. An illumination tool system, comprising:
two or more stages, wherein the two or more stages are configured to hold one or more substrates; and a plurality of illumination tools for patterning the one or more substrates, wherein each illumination tool comprises:
a microLED array, wherein the microLED array comprises one or more microLED, wherein each microLED produces at least one light beam;
a beamsplitter adjacent the microLED array;
one or more refractory lens components adjacent the beam splitter; and
a projection lens adjacent the one or more refractory lens components. 17. The illumination tool system of claim 16, wherein the projection lens further comprises:
a focus group; and a window. 18. The illumination tool system of claim 17, further comprising:
a focus sensor; and a camera. 19. The illumination tool system of claim 18, wherein the focus sensor and camera are coupled orthogonally to the beamsplitter. 20. The illumination tool system of claim 19, further comprising:
a light dump. | Embodiments of the present disclosure generally relate to apparatuses and systems for performing photolithography processes. More particularly, compact illumination tools for projecting an image onto a substrate are provided. In one embodiment, an illumination tool includes a microLED array including one or more microLEDs. Each microLED produces at least one light beam. The illumination tool also includes a beamsplitter adjacent the microLED array, one or more refractory lens components adjacent the beam splitter, and a projection lens adjacent the one or more refractory lens components. The mounting plate advantageously provides for compact alignment in a system having a plurality of illumination tools, each of which is easily removable and replaceable.1. An illumination tool, comprising:
a microLED array, wherein the microLED array comprises one or more microLED, wherein each microLED produces at least one light beam; a beamsplitter adjacent the microLED array; one or more refractory lens components adjacent the beamsplitter; and a projection lens adjacent the one or more refractory lens components. 2. The illumination tool of claim 1, wherein the projection lens further comprises:
a focus group; and a window. 3. The illumination tool of claim 2, further comprising:
a focus sensor; and a camera. 4. The illumination tool of claim 3, wherein the focus sensor and camera are disposed adjacent the beamsplitter. 5. The illumination tool of claim 4, further comprising:
a light dump. 6. The illumination tool of claim 5, further comprising:
a light level sensor. 7. The illumination tool of claim 6, further comprising:
a distortion compensator. 8. The illumination tool of claim 7, wherein the distortion compensator is disposed between the projection lens and the beamsplitter. 9. An illumination tool, comprising:
a microLED array, wherein the microLED array comprises one or more microLED, wherein each microLED produces at least one light beam; a beamsplitter adjacent the microLED array; one or more refractory lens components adjacent the beamsplitter; a projection lens adjacent the one or more refractory lens components; and a distortion compensator disposed between the projection lens and the beamsplitter. 10. The illumination tool of claim 9, wherein the projection lens further comprises:
a focus group; and a window. 11. The illumination tool of claim 10, further comprising:
a focus sensor; and a camera. 12. The illumination tool of claim 11, wherein the focus sensor and camera are coupled orthogonally to the beamsplitter. 13. The illumination tool of claim 12, further comprising:
a light dump. 14. The illumination tool of claim 13, further comprising:
a mounting plate, wherein the frustrated cube assembly, the microLED array, the beamsplitter, and the one or more refractory lens components are coupled to the mounting plate. 15. The illumination tool of claim 14, further comprising:
a light level sensor. 16. An illumination tool system, comprising:
two or more stages, wherein the two or more stages are configured to hold one or more substrates; and a plurality of illumination tools for patterning the one or more substrates, wherein each illumination tool comprises:
a microLED array, wherein the microLED array comprises one or more microLED, wherein each microLED produces at least one light beam;
a beamsplitter adjacent the microLED array;
one or more refractory lens components adjacent the beam splitter; and
a projection lens adjacent the one or more refractory lens components. 17. The illumination tool system of claim 16, wherein the projection lens further comprises:
a focus group; and a window. 18. The illumination tool system of claim 17, further comprising:
a focus sensor; and a camera. 19. The illumination tool system of claim 18, wherein the focus sensor and camera are coupled orthogonally to the beamsplitter. 20. The illumination tool system of claim 19, further comprising:
a light dump. | 2,800 |
11,528 | 11,528 | 15,313,325 | 2,853 | An exemplary paddle includes a central shaft having a first end and a second end. One or more lateral blades extend laterally from the central shaft, and each lateral blade including a geared end positioned adjacent the central shaft and a distal end opposite the geared end. Each lateral blade provides a blade gear at the geared end. A drive shaft is movably positioned within the central shaft and operatively coupled to the one or more lateral blades such that rotation of the drive shaft about a central axis rotates the one or more lateral blades about a corresponding one or more blade axes. The one or more lateral blades are able to move between a horizontal position and a vertical position via independent actuation. | 1. A paddle, comprising:
a central shaft having a first end and a second end; one or more lateral blades extending laterally from the central shaft, each lateral blade including a geared end positioned adjacent the central shaft and a distal end opposite the geared end, wherein each lateral blade provides a blade gear at the geared end; and a drive shaft movably positioned within the central shaft and operatively coupled to the one or more lateral blades such that rotation of the drive shaft about a central axis rotates the one or more lateral blades about a corresponding one or more blade axes, the one or more lateral blades being movable between a horizontal position and a vertical position. 2. The paddle of claim 1, wherein the one or more lateral blades are grouped into one or more blade sets, each blade set including at least one lateral blade and being spaced from any adjacent blade sets along an axial height of the central shaft. 3. The paddle of claim 2, wherein the one or more blade sets each include two lateral blades extending from the central shaft in opposite directions. 4. The paddle of claim 2, wherein the one or more blade sets includes at least two blade sets and the drive shaft includes at least two concentric drive shafts independently rotatable about the central axis, each concentric drive shaft being operatively coupled to a corresponding one of the at least two blade sets. 5. The paddle of claim 2, wherein the one or more blade sets includes at least two blade sets, and wherein the at least two blade sets are angularly offset from each other about an outer circumference of the central shaft. 6. The paddle of claim 2, wherein the one or more blade sets includes at least two blade sets and the drive shaft is separated into at least two drive shaft portions each engageable with a corresponding one of the at least two blade sets. 7. The paddle of claim 1, wherein the drive shaft provides one or more drive gears engageable with the one or more lateral blades at the blade gear of each lateral blade. 8. The paddle of claim 7, wherein the one or more drive gears and the blade gear of each lateral blade comprise complimentary bevel gears. 9. The paddle of claim 1, further comprising:
a base positioned at the second end of the central shaft; and opposing sidewall blades extending vertically from the base. 10. The paddle of claim 9, wherein the distal end of each lateral blade is rotatably mounted to one of the opposing sidewall blades. 11. An assembly, comprising:
a pressure vessel; a canister positioned within the pressure vessel; a paddle positioned within the canister and including:
a central shaft;
one or more lateral blades extending laterally from the central shaft; and
a drive shaft movably positioned within the central shaft and operatively coupled to the one or more lateral blades such that rotation of the drive shaft about a central axis rotates the one or more lateral blades about a corresponding one or more blade axes;
one or more drivers operatively coupled to the drive shaft to rotate the drive shaft about the central axis and thereby rotate the one or more lateral blades about the corresponding one or more blade axes, wherein the one or more lateral blades are movable between a horizontal position and a vertical position; and one or more torque sensors operatively coupled to the one or more drivers to measure torque assumed by the one or more drivers via the drive shaft. 12. The assembly of claim 11, further comprising a pedestal arranged within the pressure vessel adjacent a bottom of the pressure vessel, the canister being seated on the pedestal within the pressure vessel and the pedestal being driven in rotation with a pedestal driver. 13. The assembly of claim 11, wherein the one or more lateral blades are grouped into one or more blade sets, each blade set including at least one lateral blade and being spaced from any adjacent blade sets along an axial height of the central shaft. 14. The assembly of claim 13, wherein the one or more blade sets includes at least two blade sets and the drive shaft includes at least two concentric drive shafts independently rotatable about the central axis, and wherein the one or more drivers includes at least two drivers and each concentric drive shaft is operatively coupled to a corresponding one of the at least two blade sets and a corresponding one of the at least two drivers. 15. The assembly of claim 14, wherein the one or more torque sensors include at least two torque sensors, and wherein the at least two torque sensors are operatively coupled to the corresponding one of the at least two drivers. 16. The assembly of claim 11, further comprising a coupling positionable within the pressure vessel to operatively couple upper portions of the drive shaft to lower portions of the drive shaft. 17. A method, comprising:
rotating a canister within a pressure vessel, the canister having a paddle positioned therein that includes a central shaft, one or more lateral blades extending laterally from the central shaft, and a drive shaft movably positioned within the central shaft and operatively coupled to the one or more lateral blades; moving the one or more lateral blades through a fluid composition present within the canister as the canister rotates; rotating the drive shaft about a central axis with one or more drivers operatively coupled to the drive shaft and thereby rotating the one or more lateral blades about a corresponding one or more blade axes of the one or more lateral blades; and measuring torque assumed by the one or more drivers via the drive shaft with one or more torque sensors operatively coupled to the one or more drivers to measure torque assumed by the one or more drivers. 18. The method of claim 17, wherein rotating the canister within the pressure vessel comprises:
positioning the canister within the pressure vessel upon a pedestal arranged within the pressure; and rotating the pedestal and the canister with a pedestal driver operatively coupled to the pedestal via a pedestal drive shaft. 19. The method of claim 17, wherein rotating the one or more lateral blades about the corresponding one or more blade axes comprises rotating the one or more lateral blades between a horizontal position and a vertical position. 20. The method of claim 17, further comprising simulating one or more downhole conditions within the pressure vessel, the one or more downhole conditions being at least one of temperature and pressure. 21. The method of claim 20, further comprising measuring one or more parameters of the fluid composition at the one or more downhole conditions, the one or more parameters being at least one of rheology, thickening time, and transition time of the fluid composition. 22. The method of claim 21, further comprising:
actuating the one or more of the drivers to rotate the drive shaft about the central axis and thereby rotating the one or more lateral blades to a different angular configuration; and measuring the one or more parameters of the fluid composition at the one or more downhole conditions while the one or more lateral blades are in the different angular configuration. | An exemplary paddle includes a central shaft having a first end and a second end. One or more lateral blades extend laterally from the central shaft, and each lateral blade including a geared end positioned adjacent the central shaft and a distal end opposite the geared end. Each lateral blade provides a blade gear at the geared end. A drive shaft is movably positioned within the central shaft and operatively coupled to the one or more lateral blades such that rotation of the drive shaft about a central axis rotates the one or more lateral blades about a corresponding one or more blade axes. The one or more lateral blades are able to move between a horizontal position and a vertical position via independent actuation.1. A paddle, comprising:
a central shaft having a first end and a second end; one or more lateral blades extending laterally from the central shaft, each lateral blade including a geared end positioned adjacent the central shaft and a distal end opposite the geared end, wherein each lateral blade provides a blade gear at the geared end; and a drive shaft movably positioned within the central shaft and operatively coupled to the one or more lateral blades such that rotation of the drive shaft about a central axis rotates the one or more lateral blades about a corresponding one or more blade axes, the one or more lateral blades being movable between a horizontal position and a vertical position. 2. The paddle of claim 1, wherein the one or more lateral blades are grouped into one or more blade sets, each blade set including at least one lateral blade and being spaced from any adjacent blade sets along an axial height of the central shaft. 3. The paddle of claim 2, wherein the one or more blade sets each include two lateral blades extending from the central shaft in opposite directions. 4. The paddle of claim 2, wherein the one or more blade sets includes at least two blade sets and the drive shaft includes at least two concentric drive shafts independently rotatable about the central axis, each concentric drive shaft being operatively coupled to a corresponding one of the at least two blade sets. 5. The paddle of claim 2, wherein the one or more blade sets includes at least two blade sets, and wherein the at least two blade sets are angularly offset from each other about an outer circumference of the central shaft. 6. The paddle of claim 2, wherein the one or more blade sets includes at least two blade sets and the drive shaft is separated into at least two drive shaft portions each engageable with a corresponding one of the at least two blade sets. 7. The paddle of claim 1, wherein the drive shaft provides one or more drive gears engageable with the one or more lateral blades at the blade gear of each lateral blade. 8. The paddle of claim 7, wherein the one or more drive gears and the blade gear of each lateral blade comprise complimentary bevel gears. 9. The paddle of claim 1, further comprising:
a base positioned at the second end of the central shaft; and opposing sidewall blades extending vertically from the base. 10. The paddle of claim 9, wherein the distal end of each lateral blade is rotatably mounted to one of the opposing sidewall blades. 11. An assembly, comprising:
a pressure vessel; a canister positioned within the pressure vessel; a paddle positioned within the canister and including:
a central shaft;
one or more lateral blades extending laterally from the central shaft; and
a drive shaft movably positioned within the central shaft and operatively coupled to the one or more lateral blades such that rotation of the drive shaft about a central axis rotates the one or more lateral blades about a corresponding one or more blade axes;
one or more drivers operatively coupled to the drive shaft to rotate the drive shaft about the central axis and thereby rotate the one or more lateral blades about the corresponding one or more blade axes, wherein the one or more lateral blades are movable between a horizontal position and a vertical position; and one or more torque sensors operatively coupled to the one or more drivers to measure torque assumed by the one or more drivers via the drive shaft. 12. The assembly of claim 11, further comprising a pedestal arranged within the pressure vessel adjacent a bottom of the pressure vessel, the canister being seated on the pedestal within the pressure vessel and the pedestal being driven in rotation with a pedestal driver. 13. The assembly of claim 11, wherein the one or more lateral blades are grouped into one or more blade sets, each blade set including at least one lateral blade and being spaced from any adjacent blade sets along an axial height of the central shaft. 14. The assembly of claim 13, wherein the one or more blade sets includes at least two blade sets and the drive shaft includes at least two concentric drive shafts independently rotatable about the central axis, and wherein the one or more drivers includes at least two drivers and each concentric drive shaft is operatively coupled to a corresponding one of the at least two blade sets and a corresponding one of the at least two drivers. 15. The assembly of claim 14, wherein the one or more torque sensors include at least two torque sensors, and wherein the at least two torque sensors are operatively coupled to the corresponding one of the at least two drivers. 16. The assembly of claim 11, further comprising a coupling positionable within the pressure vessel to operatively couple upper portions of the drive shaft to lower portions of the drive shaft. 17. A method, comprising:
rotating a canister within a pressure vessel, the canister having a paddle positioned therein that includes a central shaft, one or more lateral blades extending laterally from the central shaft, and a drive shaft movably positioned within the central shaft and operatively coupled to the one or more lateral blades; moving the one or more lateral blades through a fluid composition present within the canister as the canister rotates; rotating the drive shaft about a central axis with one or more drivers operatively coupled to the drive shaft and thereby rotating the one or more lateral blades about a corresponding one or more blade axes of the one or more lateral blades; and measuring torque assumed by the one or more drivers via the drive shaft with one or more torque sensors operatively coupled to the one or more drivers to measure torque assumed by the one or more drivers. 18. The method of claim 17, wherein rotating the canister within the pressure vessel comprises:
positioning the canister within the pressure vessel upon a pedestal arranged within the pressure; and rotating the pedestal and the canister with a pedestal driver operatively coupled to the pedestal via a pedestal drive shaft. 19. The method of claim 17, wherein rotating the one or more lateral blades about the corresponding one or more blade axes comprises rotating the one or more lateral blades between a horizontal position and a vertical position. 20. The method of claim 17, further comprising simulating one or more downhole conditions within the pressure vessel, the one or more downhole conditions being at least one of temperature and pressure. 21. The method of claim 20, further comprising measuring one or more parameters of the fluid composition at the one or more downhole conditions, the one or more parameters being at least one of rheology, thickening time, and transition time of the fluid composition. 22. The method of claim 21, further comprising:
actuating the one or more of the drivers to rotate the drive shaft about the central axis and thereby rotating the one or more lateral blades to a different angular configuration; and measuring the one or more parameters of the fluid composition at the one or more downhole conditions while the one or more lateral blades are in the different angular configuration. | 2,800 |
11,529 | 11,529 | 15,204,631 | 2,839 | A semiconductor device includes a current monitor circuit to measure a load current. A controller controls drive signals having a signal phase to operate a synchronous rectifier (SR) circuit based on the measured load current from the current monitor circuit. The controller applies a first control phase sequence to control the signal phase to the SR circuit if the measured load current is above a predetermined current threshold. The controller applies a second control phase sequence to control the signal phase to the SR circuit if the measured load current is equal or below the predetermined current threshold. | 1. A semiconductor device comprising:
a current monitor circuit to measure a load current; and a controller to control drive signals having a signal phase to operate a synchronous rectifier (SR) circuit based on the measured load current from the current monitor circuit, the controller applies a first control phase sequence to control the signal phase to the SR circuit if the measured load current is above a predetermined current threshold and applies a second control phase sequence to control the signal phase to the SR circuit if the measured load current is equal or below the predetermined current threshold. 2. The semiconductor device of claim 1, wherein the current monitor circuit includes a current amplifier, a Hall sensor, or a sense resistor to measure the load current. 3. The semiconductor device of claim 1, wherein the controller includes an analog to digital converter (ADC) to determine a value of the load current with respect to the predetermined current threshold. 4. The semiconductor device of claim 1, further comprising a first transistor switch device and a second transistor switch device that operate in the SR circuit to rectify an alternating current (AC) output voltage from a transformer to drive the load current to a load. 5. The semiconductor device of claim 4, wherein the drive signals from the controller are driven via a gate driver circuit to inputs of the first and second transistor devices. 6. The semiconductor device of claim 4, wherein the second control phase sequence turns off each of the first and second transistor devices if the output voltage from the transformer is turned off. 7. The semiconductor device of claim 6, wherein the second control phase pulses the second transistor device on only if the output from the transformer is positive. 8. The semiconductor device of claim 6, wherein the second control phase pulses the first transistor device on only if the output from the transformer is negative. 9. The semiconductor device of claim 4, further comprising a primary side switching circuit to drive the transformer, wherein the primary side switching circuit is operated by the controller. 10. The semiconductor device of claim 9, wherein the primary side switching circuit and the SR circuit are configured as a phase-shift full bridge power converter. 11. The semiconductor device of claim 1, wherein the predetermined current threshold is set to about twenty amperes. 12. A circuit comprising:
a first transistor switch device and a second transistor switch device that operate as synchronous rectifier (SR) circuit to rectify an alternating current (AC) output voltage from a transformer to drive a load current to a load; a current monitor circuit to measure the load current; and a controller to control a signal phase applied to the first and the second transistor devices to operate the SR circuit based on the measured load current from the current monitor circuit, the controller applies a first control phase sequence to control the signal phase if the measured load current is above a predetermined current threshold and applies a second control phase sequence to control the signal phase if the measured load current is equal or below the predetermined current threshold, the second control phase sequence turns off each of the first and second transistor devices if the output voltage from the transformer is turned off. 13. The circuit of claim 12, wherein the second control phase pulses the second transistor device on only if the output from the transformer is positive. 14. The circuit of claim 12, wherein the second control phase pulses the first transistor device on only if the output from the transformer is negative. 15. The circuit of claim 12, further comprising a primary side switching circuit to drive the transformer, the primary side switching circuit operated by the controller. 16. The circuit of claim 15, wherein the primary side switching circuit and the SR circuit are configured as a phase-shift full bridge power converter. 17. A method comprising:
measuring a load current in a synchronous rectifier (SR) circuit via a controller; controlling a signal phase, via the controller, to operate the SR circuit based on the measured load current; applying a first control phase sequence, via the controller, to control the signal phase to the SR circuit if the measured load current is above a predetermined current threshold; and applying a second control phase sequence, via the controller, to control the signal phase to the SR circuit if the measured load current is equal or below the predetermined current threshold. 18. The method of claim 17, further comprising turning off each of a first and a second transistor device in the SR circuit, via the controller, if an output voltage driving the SR circuit is off. 19. The method of claim 18, further comprising pulsing the second transistor device on, via the controller, only if the output voltage driving the SR circuit is positive. 20. The method of claim 18, further comprising pulsing the first transistor device on, via the controller, only if the output voltage driving the SR circuits is negative. | A semiconductor device includes a current monitor circuit to measure a load current. A controller controls drive signals having a signal phase to operate a synchronous rectifier (SR) circuit based on the measured load current from the current monitor circuit. The controller applies a first control phase sequence to control the signal phase to the SR circuit if the measured load current is above a predetermined current threshold. The controller applies a second control phase sequence to control the signal phase to the SR circuit if the measured load current is equal or below the predetermined current threshold.1. A semiconductor device comprising:
a current monitor circuit to measure a load current; and a controller to control drive signals having a signal phase to operate a synchronous rectifier (SR) circuit based on the measured load current from the current monitor circuit, the controller applies a first control phase sequence to control the signal phase to the SR circuit if the measured load current is above a predetermined current threshold and applies a second control phase sequence to control the signal phase to the SR circuit if the measured load current is equal or below the predetermined current threshold. 2. The semiconductor device of claim 1, wherein the current monitor circuit includes a current amplifier, a Hall sensor, or a sense resistor to measure the load current. 3. The semiconductor device of claim 1, wherein the controller includes an analog to digital converter (ADC) to determine a value of the load current with respect to the predetermined current threshold. 4. The semiconductor device of claim 1, further comprising a first transistor switch device and a second transistor switch device that operate in the SR circuit to rectify an alternating current (AC) output voltage from a transformer to drive the load current to a load. 5. The semiconductor device of claim 4, wherein the drive signals from the controller are driven via a gate driver circuit to inputs of the first and second transistor devices. 6. The semiconductor device of claim 4, wherein the second control phase sequence turns off each of the first and second transistor devices if the output voltage from the transformer is turned off. 7. The semiconductor device of claim 6, wherein the second control phase pulses the second transistor device on only if the output from the transformer is positive. 8. The semiconductor device of claim 6, wherein the second control phase pulses the first transistor device on only if the output from the transformer is negative. 9. The semiconductor device of claim 4, further comprising a primary side switching circuit to drive the transformer, wherein the primary side switching circuit is operated by the controller. 10. The semiconductor device of claim 9, wherein the primary side switching circuit and the SR circuit are configured as a phase-shift full bridge power converter. 11. The semiconductor device of claim 1, wherein the predetermined current threshold is set to about twenty amperes. 12. A circuit comprising:
a first transistor switch device and a second transistor switch device that operate as synchronous rectifier (SR) circuit to rectify an alternating current (AC) output voltage from a transformer to drive a load current to a load; a current monitor circuit to measure the load current; and a controller to control a signal phase applied to the first and the second transistor devices to operate the SR circuit based on the measured load current from the current monitor circuit, the controller applies a first control phase sequence to control the signal phase if the measured load current is above a predetermined current threshold and applies a second control phase sequence to control the signal phase if the measured load current is equal or below the predetermined current threshold, the second control phase sequence turns off each of the first and second transistor devices if the output voltage from the transformer is turned off. 13. The circuit of claim 12, wherein the second control phase pulses the second transistor device on only if the output from the transformer is positive. 14. The circuit of claim 12, wherein the second control phase pulses the first transistor device on only if the output from the transformer is negative. 15. The circuit of claim 12, further comprising a primary side switching circuit to drive the transformer, the primary side switching circuit operated by the controller. 16. The circuit of claim 15, wherein the primary side switching circuit and the SR circuit are configured as a phase-shift full bridge power converter. 17. A method comprising:
measuring a load current in a synchronous rectifier (SR) circuit via a controller; controlling a signal phase, via the controller, to operate the SR circuit based on the measured load current; applying a first control phase sequence, via the controller, to control the signal phase to the SR circuit if the measured load current is above a predetermined current threshold; and applying a second control phase sequence, via the controller, to control the signal phase to the SR circuit if the measured load current is equal or below the predetermined current threshold. 18. The method of claim 17, further comprising turning off each of a first and a second transistor device in the SR circuit, via the controller, if an output voltage driving the SR circuit is off. 19. The method of claim 18, further comprising pulsing the second transistor device on, via the controller, only if the output voltage driving the SR circuit is positive. 20. The method of claim 18, further comprising pulsing the first transistor device on, via the controller, only if the output voltage driving the SR circuits is negative. | 2,800 |
11,530 | 11,530 | 15,036,434 | 2,844 | An ignition system including a spark plug control unit adapted to control at least two coil stages to provide a current to a spark plug, including two stages including a first transformer including a first primary winding inductively coupled to a first secondary winding; a second transformer including a second primary winding inductively coupled to a second secondary winding; the control unit enabled to simultaneously switch on and off two corresponding switches to maintain a continuous ignition fire, and includes a step-down converter stage with a switch and a diode. The method includes i) switching off the switch; and ii) toggling the two corresponding switches. | 1-10. (canceled) 11. A method of controlling an ignition system, said ignition system including a spark plug control unit adapted to control at least two coil stages so as to successively energise and de-energise said at least two coil stages to provide a current to a spark plug, including two stages comprising a first transformer including a first primary winding inductively coupled to a first secondary winding; a second transformer including a second primary winding inductively coupled to a second secondary winding; said spark plug control unit enabled to simultaneously energize and deenergize said first primary winding and said second primary winding by simultaneously switching on and off two corresponding switches to sequentially energize and de-energize said first primary winding and said second primary winding by sequentially switching on and off both of said two corresponding switches to maintain a continuous ignition fire, and includes a step-down converter stage located between said spark plug control unit and said at least two coil stages, said step-down converter including a switch and a diode, said spark plug control unit being enabled to switch off said switch, wherein the method provides control to limit a secondary current peak at the end of a Coupled Multi-Charge period, comprising the steps of, at the end of the Coupled Multi-Charge period:
i) switching off said switch; and ii) toggling said two corresponding switches. 12. A method as claimed in claim 1 further comprising:
iii) measuring the primary current after step i),
wherein step ii) is implemented dependent on the measured primary current. 13. A method as claimed in claim 12 further comprising:
iv) measuring a secondary current after step ii) and comparing said secondary current with a threshold; and
vii) when it is determined said secondary current is below said threshold, repeating steps ii) to iii). 14. A method as claimed in claim 12 further comprising waiting for a minimum time between said toggling. 15. A method as claimed in claim 14 wherein step iii) comprises:
a) setting a secondary current threshold value dependent on said measured primary current;
b) comparing said secondary current threshold value with a minimum value, and if said secondary current threshold value is above said minimum value, toggling said two corresponding switches. 16. A method as claimed in claim 12 wherein a secondary current threshold is a function of said measured primary current, a battery voltage, and a secondary current amplitude during a down ramping cycle. 17. A method as claimed in claim 16 wherein said secondary current amplitude during the down ramping cycle is set and stored in the spark plug control unit. 18. A method as claimed in claim 16 wherein said secondary current threshold, Isth, is based on the equation: said secondary current threshold=a measured secondary current/a transformer ratio−the down ramping cycle. 19. A method as claimed in any of claims 1 wherein voltage on a low side of one or more of said at least two coil stages is determined, compared with a threshold, and if said voltage on said low side of said one or more of said at least two coil stages is above said threshold, switching said switch off and switching both of said two corresponding switches on. 20. A method as claimed in claim 11 including the step of measuring secondary voltages, comparing the secondary voltages with a threshold and if any of the secondary voltages are above the threshold, controlling the switching of at least one of said switch and said two corresponding switches. | An ignition system including a spark plug control unit adapted to control at least two coil stages to provide a current to a spark plug, including two stages including a first transformer including a first primary winding inductively coupled to a first secondary winding; a second transformer including a second primary winding inductively coupled to a second secondary winding; the control unit enabled to simultaneously switch on and off two corresponding switches to maintain a continuous ignition fire, and includes a step-down converter stage with a switch and a diode. The method includes i) switching off the switch; and ii) toggling the two corresponding switches.1-10. (canceled) 11. A method of controlling an ignition system, said ignition system including a spark plug control unit adapted to control at least two coil stages so as to successively energise and de-energise said at least two coil stages to provide a current to a spark plug, including two stages comprising a first transformer including a first primary winding inductively coupled to a first secondary winding; a second transformer including a second primary winding inductively coupled to a second secondary winding; said spark plug control unit enabled to simultaneously energize and deenergize said first primary winding and said second primary winding by simultaneously switching on and off two corresponding switches to sequentially energize and de-energize said first primary winding and said second primary winding by sequentially switching on and off both of said two corresponding switches to maintain a continuous ignition fire, and includes a step-down converter stage located between said spark plug control unit and said at least two coil stages, said step-down converter including a switch and a diode, said spark plug control unit being enabled to switch off said switch, wherein the method provides control to limit a secondary current peak at the end of a Coupled Multi-Charge period, comprising the steps of, at the end of the Coupled Multi-Charge period:
i) switching off said switch; and ii) toggling said two corresponding switches. 12. A method as claimed in claim 1 further comprising:
iii) measuring the primary current after step i),
wherein step ii) is implemented dependent on the measured primary current. 13. A method as claimed in claim 12 further comprising:
iv) measuring a secondary current after step ii) and comparing said secondary current with a threshold; and
vii) when it is determined said secondary current is below said threshold, repeating steps ii) to iii). 14. A method as claimed in claim 12 further comprising waiting for a minimum time between said toggling. 15. A method as claimed in claim 14 wherein step iii) comprises:
a) setting a secondary current threshold value dependent on said measured primary current;
b) comparing said secondary current threshold value with a minimum value, and if said secondary current threshold value is above said minimum value, toggling said two corresponding switches. 16. A method as claimed in claim 12 wherein a secondary current threshold is a function of said measured primary current, a battery voltage, and a secondary current amplitude during a down ramping cycle. 17. A method as claimed in claim 16 wherein said secondary current amplitude during the down ramping cycle is set and stored in the spark plug control unit. 18. A method as claimed in claim 16 wherein said secondary current threshold, Isth, is based on the equation: said secondary current threshold=a measured secondary current/a transformer ratio−the down ramping cycle. 19. A method as claimed in any of claims 1 wherein voltage on a low side of one or more of said at least two coil stages is determined, compared with a threshold, and if said voltage on said low side of said one or more of said at least two coil stages is above said threshold, switching said switch off and switching both of said two corresponding switches on. 20. A method as claimed in claim 11 including the step of measuring secondary voltages, comparing the secondary voltages with a threshold and if any of the secondary voltages are above the threshold, controlling the switching of at least one of said switch and said two corresponding switches. | 2,800 |
11,531 | 11,531 | 15,631,151 | 2,832 | A propulsion system for an unmanned underwater vehicle includes a turbine engine having a combustor, a turbine, and a mechanical output shaft. The propulsion system further includes an electrical generator having a rotational input connected to the mechanical output shaft, and a poly phase electrical output. A direct current (DC) bus is connected to the poly phase electrical output via a rectifier/inverter. A DC to alternating current (AC) motor drive includes a DC input and a poly phase motor drive output, and a motor connected to the poly phase motor drive output. | 1. A propulsion system for an unmanned underwater vehicle comprising:
a turbine engine including a combustor, a turbine, and a mechanical output shaft; an electrical generator including a rotational input connected to the mechanical output shaft, and a poly phase electrical output; a direct current (DC) bus connected to the poly phase electrical output via a rectifier/inverter; a DC to alternating current (AC) motor drive including a DC input and a poly phase motor drive output; a motor connected to the poly phase motor drive output; and a controller controllably coupled to the electrical generator, the rectifier/inverter, and the DC to AC motor drive, wherein the controller is configured to cause the propulsion system to operate in a range mode by providing direct current (DC) power to the DC bus from the electrical energy storage system, providing DC power from the DC bus to the DC to alternating current (AC) motor drive, and driving the motor in a range mode and configured to cause the propulsion system to entering a sprint mode of operations by initiating operations of a turbine engine and providing poly phase AC power to the rectifier/inverter, converting AC power to DC power using the rectifier/inverter, providing DC power to the DC to AC motor drive, and driving the motor. 2. The propulsion system of claim 1, further comprising an electrical energy storage system connected to the DC bus and configured to provide electrical power to the DC bus. 3. The propulsion system of claim 2, wherein the electrical energy storage system is connected to the DC bus via a DC to DC converter. 4. The propulsion system of claim 3, wherein the electrical energy storage system includes one of a chemical battery, lithium ion battery, fuel cell stack and an ultracapacitor. 5. The propulsion system of claim 3, wherein the electrical energy storage system is rechargeable. 6. The propulsion system of claim 2, wherein a magnitude of power provided by the electrical energy storage system to the DC bus is at least one order of magnitude less than a magnitude of power provided to the DC bus from the electrical generator. 7. The propulsion system of claim 1, wherein the poly phase electrical output of the electrical generator is a three phase output. 8. (canceled) 9. The propulsion system of claim 1, wherein the rectifier/inverter is an active rectifier/inverter. 10. The propulsion system of claim 1, wherein the rectifier/inverter is bi-directional. 11. The propulsion system of claim 1, wherein the propulsion system is disposed in a torpedo. 12. The propulsion system of claim 1, wherein the mechanical output is connected to a propulsor. 13. A method for propelling an unmanned underwater vehicle comprising:
selecting a mode of operations from at least a range mode and a sprint mode; providing direct current (DC) power to a DC bus from an electrical energy storage system, providing DC power from the DC bus to a DC to alternating current (AC) motor drive, and driving a motor in response to selecting a range mode; entering the sprint mode of operations by initiating operations of a turbine engine and providing poly phase AC power to a rectifier/inverter, converting AC power to DC power using the rectifier/inverter, providing DC power to the DC to AC motor drive, and driving the motor in response to selecting a sprint mode. 14. The method of claim 13, wherein providing poly phase AC power to the rectifier/inverter comprises providing a rotation input to an electrical generator from a turbine engine, wherein an output of the electrical generator is connected to the rectifier/inverter. 15. The method of claim 14, further comprising converting DC power from the DC bus to AC power using the rectifier/inverter, driving the electrical generator in a motor mode, and using rotation from the electrical generator to begin turbine operations in response to the unmanned underwater vehicle transitioning from the range mode to the sprint mode. 16. The method of claim 13, further comprising recharging the electrical energy storage system during the sprint mode of operations. 17. The method of claim 13, wherein the unmanned underwater vehicle initially selects the range mode of operations. 18. The method of claim 13, further comprising powering at least one high energy electrical system from the DC bus during the sprint mode. 19. An unmanned underwater vehicle comprising:
at least one fuel storage tank; a propulsion system including:
a turbine engine;
an alternating current (AC) generator mechanically connected to the turbine engine;
a rectifier/inverter connecting the AC generator to a direct current (DC) bus;
a DC to AC motor driver connected to the DC bus and providing a poly phase AC output to an electrical motor; and
a propulsor mechanically connected to the electrical motor. 20. The unmanned underwater vehicle of claim 19, wherein the propulsion system further includes an electrical energy storage system connected to the DC bus via a DC to DC converter and configured to provide DC power to the DC bus. 21. The method of claim 13, further comprising driving the motor exclusively using power provided from the electrical energy storage system during the range mode of operations. 22. The method of claim 13, wherein initiating operations of the turbine comprises operating an electrical generator in a motor mode using power from the electrical energy storage system. 23. The propulsion system of claim 1, further comprising a high energy electrical system connected to the DC bus, and configured to receive operational power from the generator while the turbine is operating. | A propulsion system for an unmanned underwater vehicle includes a turbine engine having a combustor, a turbine, and a mechanical output shaft. The propulsion system further includes an electrical generator having a rotational input connected to the mechanical output shaft, and a poly phase electrical output. A direct current (DC) bus is connected to the poly phase electrical output via a rectifier/inverter. A DC to alternating current (AC) motor drive includes a DC input and a poly phase motor drive output, and a motor connected to the poly phase motor drive output.1. A propulsion system for an unmanned underwater vehicle comprising:
a turbine engine including a combustor, a turbine, and a mechanical output shaft; an electrical generator including a rotational input connected to the mechanical output shaft, and a poly phase electrical output; a direct current (DC) bus connected to the poly phase electrical output via a rectifier/inverter; a DC to alternating current (AC) motor drive including a DC input and a poly phase motor drive output; a motor connected to the poly phase motor drive output; and a controller controllably coupled to the electrical generator, the rectifier/inverter, and the DC to AC motor drive, wherein the controller is configured to cause the propulsion system to operate in a range mode by providing direct current (DC) power to the DC bus from the electrical energy storage system, providing DC power from the DC bus to the DC to alternating current (AC) motor drive, and driving the motor in a range mode and configured to cause the propulsion system to entering a sprint mode of operations by initiating operations of a turbine engine and providing poly phase AC power to the rectifier/inverter, converting AC power to DC power using the rectifier/inverter, providing DC power to the DC to AC motor drive, and driving the motor. 2. The propulsion system of claim 1, further comprising an electrical energy storage system connected to the DC bus and configured to provide electrical power to the DC bus. 3. The propulsion system of claim 2, wherein the electrical energy storage system is connected to the DC bus via a DC to DC converter. 4. The propulsion system of claim 3, wherein the electrical energy storage system includes one of a chemical battery, lithium ion battery, fuel cell stack and an ultracapacitor. 5. The propulsion system of claim 3, wherein the electrical energy storage system is rechargeable. 6. The propulsion system of claim 2, wherein a magnitude of power provided by the electrical energy storage system to the DC bus is at least one order of magnitude less than a magnitude of power provided to the DC bus from the electrical generator. 7. The propulsion system of claim 1, wherein the poly phase electrical output of the electrical generator is a three phase output. 8. (canceled) 9. The propulsion system of claim 1, wherein the rectifier/inverter is an active rectifier/inverter. 10. The propulsion system of claim 1, wherein the rectifier/inverter is bi-directional. 11. The propulsion system of claim 1, wherein the propulsion system is disposed in a torpedo. 12. The propulsion system of claim 1, wherein the mechanical output is connected to a propulsor. 13. A method for propelling an unmanned underwater vehicle comprising:
selecting a mode of operations from at least a range mode and a sprint mode; providing direct current (DC) power to a DC bus from an electrical energy storage system, providing DC power from the DC bus to a DC to alternating current (AC) motor drive, and driving a motor in response to selecting a range mode; entering the sprint mode of operations by initiating operations of a turbine engine and providing poly phase AC power to a rectifier/inverter, converting AC power to DC power using the rectifier/inverter, providing DC power to the DC to AC motor drive, and driving the motor in response to selecting a sprint mode. 14. The method of claim 13, wherein providing poly phase AC power to the rectifier/inverter comprises providing a rotation input to an electrical generator from a turbine engine, wherein an output of the electrical generator is connected to the rectifier/inverter. 15. The method of claim 14, further comprising converting DC power from the DC bus to AC power using the rectifier/inverter, driving the electrical generator in a motor mode, and using rotation from the electrical generator to begin turbine operations in response to the unmanned underwater vehicle transitioning from the range mode to the sprint mode. 16. The method of claim 13, further comprising recharging the electrical energy storage system during the sprint mode of operations. 17. The method of claim 13, wherein the unmanned underwater vehicle initially selects the range mode of operations. 18. The method of claim 13, further comprising powering at least one high energy electrical system from the DC bus during the sprint mode. 19. An unmanned underwater vehicle comprising:
at least one fuel storage tank; a propulsion system including:
a turbine engine;
an alternating current (AC) generator mechanically connected to the turbine engine;
a rectifier/inverter connecting the AC generator to a direct current (DC) bus;
a DC to AC motor driver connected to the DC bus and providing a poly phase AC output to an electrical motor; and
a propulsor mechanically connected to the electrical motor. 20. The unmanned underwater vehicle of claim 19, wherein the propulsion system further includes an electrical energy storage system connected to the DC bus via a DC to DC converter and configured to provide DC power to the DC bus. 21. The method of claim 13, further comprising driving the motor exclusively using power provided from the electrical energy storage system during the range mode of operations. 22. The method of claim 13, wherein initiating operations of the turbine comprises operating an electrical generator in a motor mode using power from the electrical energy storage system. 23. The propulsion system of claim 1, further comprising a high energy electrical system connected to the DC bus, and configured to receive operational power from the generator while the turbine is operating. | 2,800 |
11,532 | 11,532 | 14,336,741 | 2,859 | Electric and plug-in hybrid vehicles include a traction battery to provide vehicle power. The battery may be operated in a charge-depleting mode and require recharging from an external power source. Fast charging of the traction battery is achieved by allowing a charging voltage greater than a recommended charging voltage. The charging voltage is based on the charging current and an internal resistance of the traction battery. The resistance value may be estimated during charging to allow a dynamic maximum charging voltage. Charging may be terminated based on voltage, temperature, state of charge or time criteria. The fast charging allows the traction battery to be charged in a relatively fast period of time. | 1. A battery charging system comprising:
at least one controller programmed to sustain charging of a battery cell until a cell voltage exceeds a recommended maximum voltage by an amount defined by a charging current and a battery resistance such that the cell voltage continues to increase during charging without a constant voltage phase. 2. The charging system of claim 1 wherein the charging current is a generally constant current selected to cause the battery to acquire charge at a predetermined rate. 3. The charging system of claim 2 wherein the predetermined rate is a 15 C charge rate. 4. The charging system of claim 1 wherein the charging current is based on a generally constant charge power level. 5. The charging system of claim 1 wherein the at least one controller is further programmed to estimate the battery resistance. 6. The charging system of claim 1 wherein the charging current includes an alternating current (AC) component and a direct current (DC) component such that a magnitude of the AC component is less than a magnitude of the DC component, and the at least one controller is further programmed to estimate the battery resistance based on the magnitude of the AC component and an AC voltage magnitude. 7. The charging system of claim 1 wherein the recommended maximum voltage is a battery cell manufacturer defined maximum recommended voltage for a lithium-based battery cell. 8. The charging system of claim 1 wherein the recommended maximum voltage is 4.2 volts. 9. A method of charging a battery cell comprising:
charging, by a controller, the battery cell at a generally constant current selected to cause the battery cell to acquire charge at a predetermined rate such that a battery voltage continues to increase during charging without a constant voltage phase; and terminating the charging when the battery voltage exceeds a recommended maximum voltage by an amount defined by the current and a battery resistance. 10. The method of claim 9 wherein the predetermined rate is a 15 C charge rate. 11. The method of claim 9 further comprising estimating, by the controller, the battery resistance based on one or more voltage and current measurements. 12. The method of claim 9 further comprising adding an alternating current to the generally constant current such that an alternating current magnitude is less than a magnitude of the generally constant current, and estimating, by the controller, the battery resistance based on the alternating current magnitude and an alternating voltage magnitude. 13. The method of claim 9 wherein the recommended maximum voltage is 4.2 volts. 14. A battery charging system comprising:
at least one controller programmed to
sustain charging of a battery cell at a generally constant current selected to cause the battery cell to acquire charge at a predetermined rate, and
discontinue charging when a cell voltage exceeds a recommended maximum voltage by an amount defined by the current and a battery resistance to cause an immediate decrease in the cell voltage by approximately the amount. 15. The charging system of claim 14 wherein the predetermined rate is such that the battery cell charges from 0 percent state of charge to 100 percent state of charge in less than 5 minutes. 16. The charging system of claim 14 wherein the amount is a product of the generally constant current and the battery resistance. 17. The charging system of claim 14 wherein the recommended maximum voltage is a manufacturer defined maximum voltage limit for a lithium-based battery cell. 18. The charging system of claim 14 wherein the at least one controller is further programmed to add an alternating current component to the generally constant current such that an alternating current magnitude is less than a magnitude of the generally constant current, and estimate the battery resistance based on the alternating current magnitude and an alternating voltage magnitude. 19. The charging system of claim 14 wherein the at least one controller is further programmed to discontinue charging if a temperature of the battery cell is greater than a predetermined temperature. 20. The battery charging system of claim 14 wherein the at least one controller is further programmed to discontinue charging if the cell voltage does not exceed the recommended maximum voltage by the amount within a predetermined period of time. | Electric and plug-in hybrid vehicles include a traction battery to provide vehicle power. The battery may be operated in a charge-depleting mode and require recharging from an external power source. Fast charging of the traction battery is achieved by allowing a charging voltage greater than a recommended charging voltage. The charging voltage is based on the charging current and an internal resistance of the traction battery. The resistance value may be estimated during charging to allow a dynamic maximum charging voltage. Charging may be terminated based on voltage, temperature, state of charge or time criteria. The fast charging allows the traction battery to be charged in a relatively fast period of time.1. A battery charging system comprising:
at least one controller programmed to sustain charging of a battery cell until a cell voltage exceeds a recommended maximum voltage by an amount defined by a charging current and a battery resistance such that the cell voltage continues to increase during charging without a constant voltage phase. 2. The charging system of claim 1 wherein the charging current is a generally constant current selected to cause the battery to acquire charge at a predetermined rate. 3. The charging system of claim 2 wherein the predetermined rate is a 15 C charge rate. 4. The charging system of claim 1 wherein the charging current is based on a generally constant charge power level. 5. The charging system of claim 1 wherein the at least one controller is further programmed to estimate the battery resistance. 6. The charging system of claim 1 wherein the charging current includes an alternating current (AC) component and a direct current (DC) component such that a magnitude of the AC component is less than a magnitude of the DC component, and the at least one controller is further programmed to estimate the battery resistance based on the magnitude of the AC component and an AC voltage magnitude. 7. The charging system of claim 1 wherein the recommended maximum voltage is a battery cell manufacturer defined maximum recommended voltage for a lithium-based battery cell. 8. The charging system of claim 1 wherein the recommended maximum voltage is 4.2 volts. 9. A method of charging a battery cell comprising:
charging, by a controller, the battery cell at a generally constant current selected to cause the battery cell to acquire charge at a predetermined rate such that a battery voltage continues to increase during charging without a constant voltage phase; and terminating the charging when the battery voltage exceeds a recommended maximum voltage by an amount defined by the current and a battery resistance. 10. The method of claim 9 wherein the predetermined rate is a 15 C charge rate. 11. The method of claim 9 further comprising estimating, by the controller, the battery resistance based on one or more voltage and current measurements. 12. The method of claim 9 further comprising adding an alternating current to the generally constant current such that an alternating current magnitude is less than a magnitude of the generally constant current, and estimating, by the controller, the battery resistance based on the alternating current magnitude and an alternating voltage magnitude. 13. The method of claim 9 wherein the recommended maximum voltage is 4.2 volts. 14. A battery charging system comprising:
at least one controller programmed to
sustain charging of a battery cell at a generally constant current selected to cause the battery cell to acquire charge at a predetermined rate, and
discontinue charging when a cell voltage exceeds a recommended maximum voltage by an amount defined by the current and a battery resistance to cause an immediate decrease in the cell voltage by approximately the amount. 15. The charging system of claim 14 wherein the predetermined rate is such that the battery cell charges from 0 percent state of charge to 100 percent state of charge in less than 5 minutes. 16. The charging system of claim 14 wherein the amount is a product of the generally constant current and the battery resistance. 17. The charging system of claim 14 wherein the recommended maximum voltage is a manufacturer defined maximum voltage limit for a lithium-based battery cell. 18. The charging system of claim 14 wherein the at least one controller is further programmed to add an alternating current component to the generally constant current such that an alternating current magnitude is less than a magnitude of the generally constant current, and estimate the battery resistance based on the alternating current magnitude and an alternating voltage magnitude. 19. The charging system of claim 14 wherein the at least one controller is further programmed to discontinue charging if a temperature of the battery cell is greater than a predetermined temperature. 20. The battery charging system of claim 14 wherein the at least one controller is further programmed to discontinue charging if the cell voltage does not exceed the recommended maximum voltage by the amount within a predetermined period of time. | 2,800 |
11,533 | 11,533 | 14,954,660 | 2,844 | A method of configuring and managing a DALI network includes displaying rows of cells on a display of a mobile device. The cells are associated with addresses on DALI networks. The method further includes selecting, by the mobile device, a DALI controller, where DALI controller is connected to a DALI network. The method also includes detecting, by the DALI controller, DALI devices that are on the DALI network, where the DALI devices are controlled by the DALI controller. The DALI controller is configured to detect the DALI devices in response to a request from the mobile device. The method further includes displaying, within some or all cells in the row of cells displayed on the display of the mobile device, icons representing the DALI devices, where each cell having an icon displayed therein is associated with an address of a respective DALI device on the DALI network. | 1. A method of configuring and managing a Digital Addressable Lighting Interface (“DALI”) network, the method comprising:
displaying rows of cells on a display of a mobile device, wherein the cells are associated with addresses on DALI networks;
selecting, by the mobile device, a DALI controller, wherein the DALI controller is connected to a DALI network;
detecting, by the DALI controller, DALI devices that are on the DALI network, wherein the DALI devices are controlled by the DALI controller and wherein the DALI controller is configured to detect the DALI devices in response to a request from the mobile device; and
displaying, within some or all cells in the row of cells displayed on the display of the mobile device, icons representing the DALI devices, wherein each cell having an icon displayed therein is associated with an address of a respective DALI device on the DALI network. 2. The method of claim 1, wherein the rows of cells are displayed in a grid pattern. 3. The method of claim 1, further comprising establishing, by the mobile device, a network connection with the DALI network via a wireless network. 4. The method of claim 1, wherein, within each cell, an address that is associated with the cell is displayed by the mobile device, the address being a network address on the DALI network. 5. The method of claim 1, wherein the DALI devices include one or more LED lighting fixtures and one or more fluorescent lighting fixtures. 6. The method of claim 1, further comprising searching, by the mobile device, for the one or more DALI controllers before the step of selecting the DALI controller. 7. The method of claim 6, wherein the searching for the one or more DALI controllers is performed in response to a user touching a find icon displayed on the display of the mobile device. 8. The method of claim 1, further comprising changing, by the DALI controller, an address of a DALI device on the DALI network in response to a user dragging and dropping, on the display device, an icon from a first cell to a second cell, wherein the first cell is associated with a first address on the DALI network, wherein the second cell is associated with a second address on the DALI network, and wherein the icon represents the DALI device. 9. The method of claim 1, further comprising visually identifying a DALI device on the DALI network in response to a cell of the rows of cells associated with an address of the DALI device on the DALI network being selected, wherein touching the cell associated with the address of the DALI device causes the mobile devices to send a message to the DALI controller to instruct the DALI device to emit a flashing light. 10. The method of claim 1, further comprising displaying, by the mobile device, a conflict icon in a cell displayed on the display of the mobile device and associated with an address that is assigned to multiple DALI devices on the DALI network. 11. The method of claim 1, wherein the step of detecting the DALI devices that are on the DALI network is performed in response to performing the step of selecting the DALI controller from a list of one or more DALI controllers displayed on the display of the mobile device. 12. The method of claim 1, further comprising adding, by the DALI controller, a DALI device in a DALI group in response to a cell and the DALI group from a list of DALI groups displayed on the display of the mobile device being selected, wherein the cell is associated with the address of the DALI device. 13. The method of claim 1, further comprising visually identifying one or more DALI devices that are in a DALI group in response to the DALI group being selected the mobile device, wherein the DALI group is selected by the mobile device in response to a user input provided via the display of the mobile device, wherein the one or more DALI devices emit a flashing light in response to the DALI controller addressing the one or more DALI devices using a group address of the DALI group. 14. A method of configuring and managing a Digital Addressable Lighting Interface (“DALI”) network, the method comprising:
displaying a grid view of cells on a display of a mobile device, wherein the cells are displayed in a grid pattern;
selecting, by the mobile device, a DALI controller, wherein the DALI controller is connected to a DALI network;
detecting, by the DALI controller, DALI devices that are on the DALI network, wherein the DALI devices are controlled by the DALI controller and wherein the DALI controller is configured to detect the DALI devices in response to a request from the mobile device importing a floor plan of an area into the mobile device, wherein the DALI devices are located in the area; and
displaying, within some or all of the cells displayed on the display of the mobile device, icons representing the DALI devices, wherein each cell having an icon displayed therein is associated with an address of a respective DALI device on the DALI network. 15. The method of claim 14, further comprising displaying, by the mobile device, a floor-plan view on the display of the mobile device, wherein the floor-plan view includes the floor plan of the area and DALI devices located in the area. 16. The method of claim 15, further comprising displaying a close-up view of the floor plan on the display of the mobile device, wherein one or more DALI devices that belong to another DALI group are excluded from the close-up view. 17. The method of claim 14, further comprising adding, by the DALI controller, a DALI device in a DALI group in response to a cell associated with an address of the DALI device being and the DALI group from a list of DALI groups displayed on the display of the mobile device being selected. 18. The method of claim 17, further comprising:
in response to the adding of the DALI device into the DALI group, displaying, by the mobile device, a portion of the floor plan on the display of the mobile device, wherein one or more DALI devices that, according to the floor plan, are in the DALI group are identified in the portion of the floor plan; and associating, by the mobile device, a particular DALI device of the one or more DALI devices with the address of the DALI device that is added into the DALI group. 19. A computer program product for configuring and managing a Digital Addressable Lighting Interface (“DALI”) network, the computer program product stored in a nontransitory tangible computer readable medium and comprising instructions that, when executed:
display rows of cells on a display of a mobile device, wherein the rows of cells are displayed in a grid pattern;
detect DALI devices that are on a DALI network, wherein the DALI devices are controlled by a DALI controller; and
display, within some or all of the cells of the row of cells, icons representing the DALI devices, wherein each cell having an icon displayed therein is associated with an address of a respective DALI device on the DALI network. 20. The computer program product of claim 19, further comprising instructions that, when executed, change an address of a DALI device on the DALI network in response to a user dragging and dropping, on the display of the mobile device, an icon representing the DALI device from a first cell to a second cell. | A method of configuring and managing a DALI network includes displaying rows of cells on a display of a mobile device. The cells are associated with addresses on DALI networks. The method further includes selecting, by the mobile device, a DALI controller, where DALI controller is connected to a DALI network. The method also includes detecting, by the DALI controller, DALI devices that are on the DALI network, where the DALI devices are controlled by the DALI controller. The DALI controller is configured to detect the DALI devices in response to a request from the mobile device. The method further includes displaying, within some or all cells in the row of cells displayed on the display of the mobile device, icons representing the DALI devices, where each cell having an icon displayed therein is associated with an address of a respective DALI device on the DALI network.1. A method of configuring and managing a Digital Addressable Lighting Interface (“DALI”) network, the method comprising:
displaying rows of cells on a display of a mobile device, wherein the cells are associated with addresses on DALI networks;
selecting, by the mobile device, a DALI controller, wherein the DALI controller is connected to a DALI network;
detecting, by the DALI controller, DALI devices that are on the DALI network, wherein the DALI devices are controlled by the DALI controller and wherein the DALI controller is configured to detect the DALI devices in response to a request from the mobile device; and
displaying, within some or all cells in the row of cells displayed on the display of the mobile device, icons representing the DALI devices, wherein each cell having an icon displayed therein is associated with an address of a respective DALI device on the DALI network. 2. The method of claim 1, wherein the rows of cells are displayed in a grid pattern. 3. The method of claim 1, further comprising establishing, by the mobile device, a network connection with the DALI network via a wireless network. 4. The method of claim 1, wherein, within each cell, an address that is associated with the cell is displayed by the mobile device, the address being a network address on the DALI network. 5. The method of claim 1, wherein the DALI devices include one or more LED lighting fixtures and one or more fluorescent lighting fixtures. 6. The method of claim 1, further comprising searching, by the mobile device, for the one or more DALI controllers before the step of selecting the DALI controller. 7. The method of claim 6, wherein the searching for the one or more DALI controllers is performed in response to a user touching a find icon displayed on the display of the mobile device. 8. The method of claim 1, further comprising changing, by the DALI controller, an address of a DALI device on the DALI network in response to a user dragging and dropping, on the display device, an icon from a first cell to a second cell, wherein the first cell is associated with a first address on the DALI network, wherein the second cell is associated with a second address on the DALI network, and wherein the icon represents the DALI device. 9. The method of claim 1, further comprising visually identifying a DALI device on the DALI network in response to a cell of the rows of cells associated with an address of the DALI device on the DALI network being selected, wherein touching the cell associated with the address of the DALI device causes the mobile devices to send a message to the DALI controller to instruct the DALI device to emit a flashing light. 10. The method of claim 1, further comprising displaying, by the mobile device, a conflict icon in a cell displayed on the display of the mobile device and associated with an address that is assigned to multiple DALI devices on the DALI network. 11. The method of claim 1, wherein the step of detecting the DALI devices that are on the DALI network is performed in response to performing the step of selecting the DALI controller from a list of one or more DALI controllers displayed on the display of the mobile device. 12. The method of claim 1, further comprising adding, by the DALI controller, a DALI device in a DALI group in response to a cell and the DALI group from a list of DALI groups displayed on the display of the mobile device being selected, wherein the cell is associated with the address of the DALI device. 13. The method of claim 1, further comprising visually identifying one or more DALI devices that are in a DALI group in response to the DALI group being selected the mobile device, wherein the DALI group is selected by the mobile device in response to a user input provided via the display of the mobile device, wherein the one or more DALI devices emit a flashing light in response to the DALI controller addressing the one or more DALI devices using a group address of the DALI group. 14. A method of configuring and managing a Digital Addressable Lighting Interface (“DALI”) network, the method comprising:
displaying a grid view of cells on a display of a mobile device, wherein the cells are displayed in a grid pattern;
selecting, by the mobile device, a DALI controller, wherein the DALI controller is connected to a DALI network;
detecting, by the DALI controller, DALI devices that are on the DALI network, wherein the DALI devices are controlled by the DALI controller and wherein the DALI controller is configured to detect the DALI devices in response to a request from the mobile device importing a floor plan of an area into the mobile device, wherein the DALI devices are located in the area; and
displaying, within some or all of the cells displayed on the display of the mobile device, icons representing the DALI devices, wherein each cell having an icon displayed therein is associated with an address of a respective DALI device on the DALI network. 15. The method of claim 14, further comprising displaying, by the mobile device, a floor-plan view on the display of the mobile device, wherein the floor-plan view includes the floor plan of the area and DALI devices located in the area. 16. The method of claim 15, further comprising displaying a close-up view of the floor plan on the display of the mobile device, wherein one or more DALI devices that belong to another DALI group are excluded from the close-up view. 17. The method of claim 14, further comprising adding, by the DALI controller, a DALI device in a DALI group in response to a cell associated with an address of the DALI device being and the DALI group from a list of DALI groups displayed on the display of the mobile device being selected. 18. The method of claim 17, further comprising:
in response to the adding of the DALI device into the DALI group, displaying, by the mobile device, a portion of the floor plan on the display of the mobile device, wherein one or more DALI devices that, according to the floor plan, are in the DALI group are identified in the portion of the floor plan; and associating, by the mobile device, a particular DALI device of the one or more DALI devices with the address of the DALI device that is added into the DALI group. 19. A computer program product for configuring and managing a Digital Addressable Lighting Interface (“DALI”) network, the computer program product stored in a nontransitory tangible computer readable medium and comprising instructions that, when executed:
display rows of cells on a display of a mobile device, wherein the rows of cells are displayed in a grid pattern;
detect DALI devices that are on a DALI network, wherein the DALI devices are controlled by a DALI controller; and
display, within some or all of the cells of the row of cells, icons representing the DALI devices, wherein each cell having an icon displayed therein is associated with an address of a respective DALI device on the DALI network. 20. The computer program product of claim 19, further comprising instructions that, when executed, change an address of a DALI device on the DALI network in response to a user dragging and dropping, on the display of the mobile device, an icon representing the DALI device from a first cell to a second cell. | 2,800 |
11,534 | 11,534 | 15,049,621 | 2,849 | Power management techniques in distributed communication systems in which the power available at a remote unit (RU) is measured and compared to the power requirements of the RU. Voltage and current are measured for two dummy loads at the RU and these values are used to solve for the output voltage of the power supply and the resistance of the wires. From these values, a maximum power available may be calculated and compared to power requirements of the RU. | 1. A remote unit for use in a distributed communication system, comprising:
at least one antenna configured to transmit radio frequency signals into a coverage area; a power input configured to receive a power signal from a power distribution module through a power medium; a power over Ethernet integrated circuit (POE IC) configured to measure voltage and current from the power input; and a control system configured to:
open a services switch between the power input and a real load;
instruct the POE IC to close a first switch coupling a first load resistance to the power input;
instruct the POE IC to measure a first voltage and a first current associated with the first load resistance;
instruct the POE IC to open the first switch and close a second switch coupling a second load resistance to the power input;
instruct the POE IC to measure a second voltage and a second current associated with the second load resistance; and
calculate an available power for the remote unit. 2. The remote unit of claim 1, further comprising the services switch, the first switch and the second switch. 3. The remote unit of claim 1, wherein the POE IC comprises a current sensor. 4. The remote unit of claim 1, wherein the POE IC comprises a voltage sensor. 5. The remote unit of claim 1, wherein the remote unit is configured to receive communication signals from a fiber infrastructure. 6. The remote unit of claim 1, wherein the control system is configured to generate an alert if available power is insufficient for all services at the remote unit. 7. The remote unit of claim 1, wherein the control system is further configured to shut off a service if power is insufficient for all services. 8. The remote unit of claim 1, wherein the control system is further configured to reduce transmission power for one or more services if power is insufficient for all services. 9. The remote unit of claim 1, wherein:
the POE IC comprises at least one of a current sensor and a voltage sensor; the control system is configured to reduce transmission power for one or more services if power is insufficient for all services; and the remote unit comprises a plurality of service modules configured to provide the services at the remote unit, the plurality of service modules comprising service modules selected from the group consisting of: cellular service, radio frequency communications, WiFi, Ethernet, and location based services. 10. The remote unit of claim 1, further comprising a plurality of service modules configured to provide the services at the remote unit. 11. The remote unit of claim 10, wherein the plurality of service modules comprises service modules selected from the group consisting of: cellular service, radio frequency communications, WiFi, Ethernet, and location based services. 12. The remote unit of claim 1, wherein the first load resistance comprises approximately 680 Ω and the second load resistance comprises approximately 4.7 kΩ. 13. A method of managing power in a remote unit of a distributed communication system, the method comprising:
opening a services switch associated with a real load; while a first switch associated with a first resistance is closed, measuring a first voltage and first current associated with the first resistance; while a second switch associated with a second resistance is closed, measuring a second voltage and a second current associated with the second resistance; and calculating an available power for the remote unit based on the first current, the first voltage, the second current and the second voltage. 14. The method of claim 13, further comprising closing the first switch after opening the services switch. 15. The method of claim 13, further comprising opening the first switch after measuring the first voltage and the first current. 16. The method of claim 13, further comprising closing the second switch after opening the services switch. 17. The method of claim 13, further comprising opening the second switch after measuring the second voltage and the second current. 18. The method of claim 17, further comprising closing the services switch after opening the second switch. 19. The method of claim 13, wherein measuring comprises measuring with sensors within a power over Ethernet integrated circuit (POE IC). 20. A distributed communication system, comprising a plurality of remote units, each remote unit comprising:
at least one antenna configured to transmit radio frequency signals into a coverage area; a power input configured to receive a power signal from a power distribution module through a power medium; a power over Ethernet integrated circuit (POE IC) configured to measure voltage and current from the power input; and a control system configured to:
open a services switch between the power input and a real load;
instruct the POE IC to close a first switch coupling a first load resistance to the power input;
instruct the POE IC to measure a first voltage and a first current associated with the first load resistance;
instruct the POE IC to open the first switch and close a second switch coupling a second load resistance to the power input;
instruct the POE IC to measure a second voltage and a second current associated with the second load resistance; and
calculate an available power for the remote unit. | Power management techniques in distributed communication systems in which the power available at a remote unit (RU) is measured and compared to the power requirements of the RU. Voltage and current are measured for two dummy loads at the RU and these values are used to solve for the output voltage of the power supply and the resistance of the wires. From these values, a maximum power available may be calculated and compared to power requirements of the RU.1. A remote unit for use in a distributed communication system, comprising:
at least one antenna configured to transmit radio frequency signals into a coverage area; a power input configured to receive a power signal from a power distribution module through a power medium; a power over Ethernet integrated circuit (POE IC) configured to measure voltage and current from the power input; and a control system configured to:
open a services switch between the power input and a real load;
instruct the POE IC to close a first switch coupling a first load resistance to the power input;
instruct the POE IC to measure a first voltage and a first current associated with the first load resistance;
instruct the POE IC to open the first switch and close a second switch coupling a second load resistance to the power input;
instruct the POE IC to measure a second voltage and a second current associated with the second load resistance; and
calculate an available power for the remote unit. 2. The remote unit of claim 1, further comprising the services switch, the first switch and the second switch. 3. The remote unit of claim 1, wherein the POE IC comprises a current sensor. 4. The remote unit of claim 1, wherein the POE IC comprises a voltage sensor. 5. The remote unit of claim 1, wherein the remote unit is configured to receive communication signals from a fiber infrastructure. 6. The remote unit of claim 1, wherein the control system is configured to generate an alert if available power is insufficient for all services at the remote unit. 7. The remote unit of claim 1, wherein the control system is further configured to shut off a service if power is insufficient for all services. 8. The remote unit of claim 1, wherein the control system is further configured to reduce transmission power for one or more services if power is insufficient for all services. 9. The remote unit of claim 1, wherein:
the POE IC comprises at least one of a current sensor and a voltage sensor; the control system is configured to reduce transmission power for one or more services if power is insufficient for all services; and the remote unit comprises a plurality of service modules configured to provide the services at the remote unit, the plurality of service modules comprising service modules selected from the group consisting of: cellular service, radio frequency communications, WiFi, Ethernet, and location based services. 10. The remote unit of claim 1, further comprising a plurality of service modules configured to provide the services at the remote unit. 11. The remote unit of claim 10, wherein the plurality of service modules comprises service modules selected from the group consisting of: cellular service, radio frequency communications, WiFi, Ethernet, and location based services. 12. The remote unit of claim 1, wherein the first load resistance comprises approximately 680 Ω and the second load resistance comprises approximately 4.7 kΩ. 13. A method of managing power in a remote unit of a distributed communication system, the method comprising:
opening a services switch associated with a real load; while a first switch associated with a first resistance is closed, measuring a first voltage and first current associated with the first resistance; while a second switch associated with a second resistance is closed, measuring a second voltage and a second current associated with the second resistance; and calculating an available power for the remote unit based on the first current, the first voltage, the second current and the second voltage. 14. The method of claim 13, further comprising closing the first switch after opening the services switch. 15. The method of claim 13, further comprising opening the first switch after measuring the first voltage and the first current. 16. The method of claim 13, further comprising closing the second switch after opening the services switch. 17. The method of claim 13, further comprising opening the second switch after measuring the second voltage and the second current. 18. The method of claim 17, further comprising closing the services switch after opening the second switch. 19. The method of claim 13, wherein measuring comprises measuring with sensors within a power over Ethernet integrated circuit (POE IC). 20. A distributed communication system, comprising a plurality of remote units, each remote unit comprising:
at least one antenna configured to transmit radio frequency signals into a coverage area; a power input configured to receive a power signal from a power distribution module through a power medium; a power over Ethernet integrated circuit (POE IC) configured to measure voltage and current from the power input; and a control system configured to:
open a services switch between the power input and a real load;
instruct the POE IC to close a first switch coupling a first load resistance to the power input;
instruct the POE IC to measure a first voltage and a first current associated with the first load resistance;
instruct the POE IC to open the first switch and close a second switch coupling a second load resistance to the power input;
instruct the POE IC to measure a second voltage and a second current associated with the second load resistance; and
calculate an available power for the remote unit. | 2,800 |
11,535 | 11,535 | 15,001,534 | 2,849 | Apparatus and method for controlling reactive power. In one embodiment, the apparatus comprises a bidirectional power converter comprising a switched mode cycloconverter for generating AC power having a desired amount of a reactive power component. | 1. Apparatus for controlling reactive power comprising:
a bidirectional power converter comprising a switched mode cycloconverter for generating AC power having a desired amount of a reactive power component. 2. The apparatus of claim 1, wherein the bidirectional power converter generates the desired amount of the reactive power component as determined by a reactive power control schedule. 3. The apparatus of claim 2, wherein the reactive power control schedule comprises a list of reactive power amounts and a corresponding time of day for generating each reactive power amount of the list of reactive power amounts. 4. The apparatus of claim 2, wherein the reactive power control schedule comprises a schedule of reactive power to be generated as a function of one or more of AC grid voltage, bidirectional power converter output power, change in AC grid voltage, or a fixed value. 5. The apparatus of claim 1, wherein the bidirectional power converter is a static VAr compensator. 6. The apparatus of claim 1, wherein the switched mode cycloconverter is a single-phase cycloconverter. 7. The apparatus of claim 1, wherein the switched mode cycloconverter is a three-phase cycloconverter. 8. A method of controlling reactive power comprising:
determining a desired amount of a reactive power component to be generated; and generating AC power, using a switched mode cycloconverter, having the desired amount of the reactive power component. 9. The method of claim 8, further comprising receiving a reactive power control schedule, wherein the desired amount of the reactive power component is determined based on the reactive power control schedule. 10. The method of claim 9, wherein the reactive power control schedule comprises a list of reactive power amounts and a corresponding time of day for generating each reactive power amount of the list of reactive power amounts. 11. The method of claim 9, wherein the reactive power control schedule comprises a schedule of reactive power to be generated as a function of one or more of AC grid voltage, power converter output power, change in AC grid voltage, or a fixed value. 12. The method of claim 8, wherein the cycloconverter is part of a bidirectional power converter, and wherein the bidirectional power converter is a static VAr compensator. 13. The method of claim 8, wherein the switched mode cycloconverter is a single-phase cycloconverter. 14. The method of claim 8, wherein the switched mode cycloconverter is a three-phase cycloconverter. 15. A system for controlling reactive power, comprising:
a DC source for generating DC power; and a bidirectional power converter, coupled to the DC source for receiving the DC power, comprising a switched mode cycloconverter for generating AC power having a desired amount of a reactive power component. 16. The system of claim 15, wherein the bidirectional power converter generates the desired amount of the reactive power component as determined by a reactive power control schedule. 17. The system of claim 16, wherein the reactive power control schedule comprises a list of reactive power amounts and a corresponding time of day for generating each reactive power amount of the list of reactive power amounts. 18. The system of claim 16, wherein the reactive power control schedule comprises a schedule of reactive power to be generated as a function of one or more of AC grid voltage, bidirectional power converter output power, change in AC grid voltage, or a fixed value. 19. The system of claim 15, wherein the switched mode cycloconverter is a single-phase cycloconverter. 20. The system of claim 15, wherein the switched mode cycloconverter is a three-phase cycloconverter. | Apparatus and method for controlling reactive power. In one embodiment, the apparatus comprises a bidirectional power converter comprising a switched mode cycloconverter for generating AC power having a desired amount of a reactive power component.1. Apparatus for controlling reactive power comprising:
a bidirectional power converter comprising a switched mode cycloconverter for generating AC power having a desired amount of a reactive power component. 2. The apparatus of claim 1, wherein the bidirectional power converter generates the desired amount of the reactive power component as determined by a reactive power control schedule. 3. The apparatus of claim 2, wherein the reactive power control schedule comprises a list of reactive power amounts and a corresponding time of day for generating each reactive power amount of the list of reactive power amounts. 4. The apparatus of claim 2, wherein the reactive power control schedule comprises a schedule of reactive power to be generated as a function of one or more of AC grid voltage, bidirectional power converter output power, change in AC grid voltage, or a fixed value. 5. The apparatus of claim 1, wherein the bidirectional power converter is a static VAr compensator. 6. The apparatus of claim 1, wherein the switched mode cycloconverter is a single-phase cycloconverter. 7. The apparatus of claim 1, wherein the switched mode cycloconverter is a three-phase cycloconverter. 8. A method of controlling reactive power comprising:
determining a desired amount of a reactive power component to be generated; and generating AC power, using a switched mode cycloconverter, having the desired amount of the reactive power component. 9. The method of claim 8, further comprising receiving a reactive power control schedule, wherein the desired amount of the reactive power component is determined based on the reactive power control schedule. 10. The method of claim 9, wherein the reactive power control schedule comprises a list of reactive power amounts and a corresponding time of day for generating each reactive power amount of the list of reactive power amounts. 11. The method of claim 9, wherein the reactive power control schedule comprises a schedule of reactive power to be generated as a function of one or more of AC grid voltage, power converter output power, change in AC grid voltage, or a fixed value. 12. The method of claim 8, wherein the cycloconverter is part of a bidirectional power converter, and wherein the bidirectional power converter is a static VAr compensator. 13. The method of claim 8, wherein the switched mode cycloconverter is a single-phase cycloconverter. 14. The method of claim 8, wherein the switched mode cycloconverter is a three-phase cycloconverter. 15. A system for controlling reactive power, comprising:
a DC source for generating DC power; and a bidirectional power converter, coupled to the DC source for receiving the DC power, comprising a switched mode cycloconverter for generating AC power having a desired amount of a reactive power component. 16. The system of claim 15, wherein the bidirectional power converter generates the desired amount of the reactive power component as determined by a reactive power control schedule. 17. The system of claim 16, wherein the reactive power control schedule comprises a list of reactive power amounts and a corresponding time of day for generating each reactive power amount of the list of reactive power amounts. 18. The system of claim 16, wherein the reactive power control schedule comprises a schedule of reactive power to be generated as a function of one or more of AC grid voltage, bidirectional power converter output power, change in AC grid voltage, or a fixed value. 19. The system of claim 15, wherein the switched mode cycloconverter is a single-phase cycloconverter. 20. The system of claim 15, wherein the switched mode cycloconverter is a three-phase cycloconverter. | 2,800 |
11,536 | 11,536 | 14,749,379 | 2,851 | Systems and methods for dynamically sizing inter-kernel communication channels implemented on an integrated circuit (IC) are provided. Implementation characteristics of the channels, predication, and kernel scheduling imbalances may factor into properly sizing the channels for self-synchronization, resulting in optimized steady-state throughput. | 1. A tangible, non-transitory, machine-readable-medium, comprising machine readable instructions to:
convert a high level program into a low level program, wherein the low level program comprises a first kernel, a second kernel, and an inter-kernel channel that enables inter-channel communication between the first kernel and the second kernel; size the inter-kernel channel based upon one or more program implementation factors, predication factors, kernel scheduling imbalance factors, or any combination thereof; and provide the low level program to an integrated circuit for implementation on the integrated circuit. 2. The machine-readable-medium of claim 1, wherein the instructions to size the inter-kernel channel comprise instructions to:
size the inter-kernel channel based upon a latency of the inter-kernel channel. 3. The machine-readable-medium of claim 2, wherein the instructions to size the inter-kernel channel comprise instructions to:
size the inter-kernel channel, such that a minimum depth of the inter-kernel channel is greater than the latency of the inter-kernel channel. 4. The machine-readable-medium of claim 1, wherein the instructions to size the inter-kernel channel comprise instructions to:
size the inter-kernel channel based upon predication of the inter-kernel channel reads, writes, or both. 5. The machine-readable-medium of claim 4, wherein the instructions to size the inter-kernel channel comprise instructions to:
size the inter-kernel channel, such that a capacity of the inter-kernel channel is equal to or greater than an initial capacity of the inter-kernel channel plus a latency of the inter-kernel channel. 6. The machine-readable-medium of claim 1, wherein the instructions to size the inter-kernel channel comprise instructions to:
size the inter-kernel channel based upon scheduling imbalances between the first kernel and the second kernel. 7. The machine-readable-medium of claim 6, wherein the instructions to size the inter-kernel channel comprise instructions to:
construct an integer linear programming problem to size the inter-kernel channel. 8. The machine-readable-medium of claim 7, wherein the instructions to construct the integer linear programming problem comprise instructions to:
determine a maximum latency to reach a read portion of the inter-kernel channel (hereinafter max_latency(read)); determine a maximum latency to reach a write portion of the inter-kernel channel (hereinafter max_latency(write)); determine a minimum capacity that can be live prior to a read at the inter-kernel channel (hereinafter min_capacity(read)); determine a minimum capacity that can be live prior to a write to a kernel from the inter-kernel channel (hereinafter min_capacity(write)); determine a first kernel scheduling slack variable, the first kernel slack variable representing a delayed start of the first kernel relative to the second kernel; determine a second kernel scheduling slack variable, the second kernel slack variable representing a delayed start of the second kernel relative to the first kernel; apply a constraint for the inter-kernel channel, such that a slack variable from the first kernel scheduling slack variable or the second kernel scheduling slack variable corresponding to a reading kernel minus a slack variable from the first kernel scheduling slack variable or the second kernel scheduling slack variable corresponding to a writing kernel is greater than or equal to the max_latency(read) minus the min_capacity(write); define and minimize a cost function for the first kernel and the second kernel, wherein the cost function for the first kernel and the second kernel is defined as a sum of widths of all inter-channel kernels having a read in the respective first kernel or second kernel minus a sum of all inter-kernel channels having a write in the respective first kernel or second kernel; and set a depth of the inter-kernel channel to equal to the slack variable for the reading kernel minus the slack variable for the writing kernel plus max_latency(read) minus min_capacity(write). 9. The machine-readable-medium of claim 1, wherein the instructions to size the inter-kernel channel comprise instructions to:
size the inter-kernel channel based upon at least two of: a latency of the inter-kernel channel, predication, and scheduling imbalances of the first and second kernels. 10. The machine-readable-medium of claim 1, wherein the low level program comprises a plurality of inter-kernel channels, and the machine readable instructions comprise instructions to size two or more of the plurality of inter-kennel channels sizing, based upon a latency of a respective inter-kernel channel being sized, predication of the respective inter-kernel channel being sized, scheduling imbalances between kernels at endpoints of the respective inter-kernel channel being sized, or any combination thereof. 11. An integrated circuit (IC) device comprising:
programmable logic comprising an implementation of one or more inter-kernel channels, wherein at least a subset of the one or more inter-kernel channels was sized by a compiler or programmable logic design software, based upon one or more program implementation factors, predication factors, kernel scheduling imbalance factors, or any combination thereof. 12. The IC device of claim 11, wherein the programmable logic comprises at least one partial reconfiguration (PR) block comprising a physical location on the IC that can be reconfigured during runtime of the IC. 13. The IC device of claim 11, wherein at least a subset of the one or more inter-kernel channels comprise a first-in-first-out (FIFO) buffer. 14. The IC device of claim 11, wherein the at least a subset of the one or more inter-kernel channels is sized based upon a latency of a respective inter-kernel channel being sized. 15. The IC device of claim 11, wherein the at least a subset of the one or more inter-kernel channels is sized based upon predication of a respective inter-kernel channel being sized. 16. The IC device of claim 11, wherein the at least a subset of the one or more inter-kernel channels is sized based upon scheduling imbalances of kernels connected to a respective inter-kernel channel being sized. 17. The IC device of claim 11, wherein the at least a subset of the one or more inter-kernel channels is sized based upon a latency of a respective inter-kernel channel being sized, predication of the respective inter-kernel channel being sized, and scheduling imbalances of kernels connected to the respective inter-kernel channel being sized. 18. A method, comprising:
sizing, via a compiler, one or more inter-kernel channels based upon one or more program implementation factors, predication factors, kernel scheduling imbalance factors, or any combination thereof determined by the compiler; and providing sizing information regarding the sizing to an integrated circuit for implementation of the inter-kernel channel on the integrated circuit, according to the sizing. 19. The method of claim 18, wherein the sizing of the one or more inter-kernel channels is based upon a latency of a respective inter-kernel channel being sized, predication of the respective inter-kernel channel being sized, scheduling imbalances of kernels connected to the respective inter-kernel channel being sized, or any combination thereof. 20. The method of claim 19, comprising sizing at least one inter-kernel channel based upon the scheduling imbalances using an integer linear programming problem, by:
determining a maximum latency to reach a read portion of the at least one inter-kernel channel (hereinafter max_latency(read)); determining a maximum latency to reach a write portion of the at least one inter-kernel channel (hereinafter max_latency(write)); determining a minimum capacity that can be live prior to a read at the at least one inter-kernel channel (hereinafter min_capacity(read)); determining a minimum capacity that can be live prior to a write to a kernel from the at least one inter-kernel channel (hereinafter min_capacity(write)); determining a first kernel scheduling slack variable, the first kernel slack variable representing a delayed start of a first kernel relative to a second kernel, where the first kernel and second kernel are associated with the at least one inter-kernel channel; determining a second kernel scheduling slack variable, the second kernel slack variable representing a delayed start of the second kernel relative to the first kernel; applying a constraint for the at least one inter-kernel channel, such that a slack variable from the first kernel scheduling slack variable or the second kernel scheduling slack variable corresponding to a reading kernel minus a slack variable from the first kernel scheduling slack variable or the second kernel scheduling slack variable corresponding to a writing kernel is greater than or equal to the max_latency(read) minus the min_capacity(write); defining and minimizing a cost function for the first kernel and the second kernel, wherein the cost function for the first kernel and the second kernel is defined as a sum of widths of all inter-channel kernels having a read in the respective first kernel or second kernel minus a sum of all inter-kernel channels having a write in the respective first kernel or second kernel; and setting a depth of the at least one inter-kernel channel to equal to the slack variable for the reading kernel minus the slack variable for the writing kernel plus max_latency(read) minus min_capacity(write). | Systems and methods for dynamically sizing inter-kernel communication channels implemented on an integrated circuit (IC) are provided. Implementation characteristics of the channels, predication, and kernel scheduling imbalances may factor into properly sizing the channels for self-synchronization, resulting in optimized steady-state throughput.1. A tangible, non-transitory, machine-readable-medium, comprising machine readable instructions to:
convert a high level program into a low level program, wherein the low level program comprises a first kernel, a second kernel, and an inter-kernel channel that enables inter-channel communication between the first kernel and the second kernel; size the inter-kernel channel based upon one or more program implementation factors, predication factors, kernel scheduling imbalance factors, or any combination thereof; and provide the low level program to an integrated circuit for implementation on the integrated circuit. 2. The machine-readable-medium of claim 1, wherein the instructions to size the inter-kernel channel comprise instructions to:
size the inter-kernel channel based upon a latency of the inter-kernel channel. 3. The machine-readable-medium of claim 2, wherein the instructions to size the inter-kernel channel comprise instructions to:
size the inter-kernel channel, such that a minimum depth of the inter-kernel channel is greater than the latency of the inter-kernel channel. 4. The machine-readable-medium of claim 1, wherein the instructions to size the inter-kernel channel comprise instructions to:
size the inter-kernel channel based upon predication of the inter-kernel channel reads, writes, or both. 5. The machine-readable-medium of claim 4, wherein the instructions to size the inter-kernel channel comprise instructions to:
size the inter-kernel channel, such that a capacity of the inter-kernel channel is equal to or greater than an initial capacity of the inter-kernel channel plus a latency of the inter-kernel channel. 6. The machine-readable-medium of claim 1, wherein the instructions to size the inter-kernel channel comprise instructions to:
size the inter-kernel channel based upon scheduling imbalances between the first kernel and the second kernel. 7. The machine-readable-medium of claim 6, wherein the instructions to size the inter-kernel channel comprise instructions to:
construct an integer linear programming problem to size the inter-kernel channel. 8. The machine-readable-medium of claim 7, wherein the instructions to construct the integer linear programming problem comprise instructions to:
determine a maximum latency to reach a read portion of the inter-kernel channel (hereinafter max_latency(read)); determine a maximum latency to reach a write portion of the inter-kernel channel (hereinafter max_latency(write)); determine a minimum capacity that can be live prior to a read at the inter-kernel channel (hereinafter min_capacity(read)); determine a minimum capacity that can be live prior to a write to a kernel from the inter-kernel channel (hereinafter min_capacity(write)); determine a first kernel scheduling slack variable, the first kernel slack variable representing a delayed start of the first kernel relative to the second kernel; determine a second kernel scheduling slack variable, the second kernel slack variable representing a delayed start of the second kernel relative to the first kernel; apply a constraint for the inter-kernel channel, such that a slack variable from the first kernel scheduling slack variable or the second kernel scheduling slack variable corresponding to a reading kernel minus a slack variable from the first kernel scheduling slack variable or the second kernel scheduling slack variable corresponding to a writing kernel is greater than or equal to the max_latency(read) minus the min_capacity(write); define and minimize a cost function for the first kernel and the second kernel, wherein the cost function for the first kernel and the second kernel is defined as a sum of widths of all inter-channel kernels having a read in the respective first kernel or second kernel minus a sum of all inter-kernel channels having a write in the respective first kernel or second kernel; and set a depth of the inter-kernel channel to equal to the slack variable for the reading kernel minus the slack variable for the writing kernel plus max_latency(read) minus min_capacity(write). 9. The machine-readable-medium of claim 1, wherein the instructions to size the inter-kernel channel comprise instructions to:
size the inter-kernel channel based upon at least two of: a latency of the inter-kernel channel, predication, and scheduling imbalances of the first and second kernels. 10. The machine-readable-medium of claim 1, wherein the low level program comprises a plurality of inter-kernel channels, and the machine readable instructions comprise instructions to size two or more of the plurality of inter-kennel channels sizing, based upon a latency of a respective inter-kernel channel being sized, predication of the respective inter-kernel channel being sized, scheduling imbalances between kernels at endpoints of the respective inter-kernel channel being sized, or any combination thereof. 11. An integrated circuit (IC) device comprising:
programmable logic comprising an implementation of one or more inter-kernel channels, wherein at least a subset of the one or more inter-kernel channels was sized by a compiler or programmable logic design software, based upon one or more program implementation factors, predication factors, kernel scheduling imbalance factors, or any combination thereof. 12. The IC device of claim 11, wherein the programmable logic comprises at least one partial reconfiguration (PR) block comprising a physical location on the IC that can be reconfigured during runtime of the IC. 13. The IC device of claim 11, wherein at least a subset of the one or more inter-kernel channels comprise a first-in-first-out (FIFO) buffer. 14. The IC device of claim 11, wherein the at least a subset of the one or more inter-kernel channels is sized based upon a latency of a respective inter-kernel channel being sized. 15. The IC device of claim 11, wherein the at least a subset of the one or more inter-kernel channels is sized based upon predication of a respective inter-kernel channel being sized. 16. The IC device of claim 11, wherein the at least a subset of the one or more inter-kernel channels is sized based upon scheduling imbalances of kernels connected to a respective inter-kernel channel being sized. 17. The IC device of claim 11, wherein the at least a subset of the one or more inter-kernel channels is sized based upon a latency of a respective inter-kernel channel being sized, predication of the respective inter-kernel channel being sized, and scheduling imbalances of kernels connected to the respective inter-kernel channel being sized. 18. A method, comprising:
sizing, via a compiler, one or more inter-kernel channels based upon one or more program implementation factors, predication factors, kernel scheduling imbalance factors, or any combination thereof determined by the compiler; and providing sizing information regarding the sizing to an integrated circuit for implementation of the inter-kernel channel on the integrated circuit, according to the sizing. 19. The method of claim 18, wherein the sizing of the one or more inter-kernel channels is based upon a latency of a respective inter-kernel channel being sized, predication of the respective inter-kernel channel being sized, scheduling imbalances of kernels connected to the respective inter-kernel channel being sized, or any combination thereof. 20. The method of claim 19, comprising sizing at least one inter-kernel channel based upon the scheduling imbalances using an integer linear programming problem, by:
determining a maximum latency to reach a read portion of the at least one inter-kernel channel (hereinafter max_latency(read)); determining a maximum latency to reach a write portion of the at least one inter-kernel channel (hereinafter max_latency(write)); determining a minimum capacity that can be live prior to a read at the at least one inter-kernel channel (hereinafter min_capacity(read)); determining a minimum capacity that can be live prior to a write to a kernel from the at least one inter-kernel channel (hereinafter min_capacity(write)); determining a first kernel scheduling slack variable, the first kernel slack variable representing a delayed start of a first kernel relative to a second kernel, where the first kernel and second kernel are associated with the at least one inter-kernel channel; determining a second kernel scheduling slack variable, the second kernel slack variable representing a delayed start of the second kernel relative to the first kernel; applying a constraint for the at least one inter-kernel channel, such that a slack variable from the first kernel scheduling slack variable or the second kernel scheduling slack variable corresponding to a reading kernel minus a slack variable from the first kernel scheduling slack variable or the second kernel scheduling slack variable corresponding to a writing kernel is greater than or equal to the max_latency(read) minus the min_capacity(write); defining and minimizing a cost function for the first kernel and the second kernel, wherein the cost function for the first kernel and the second kernel is defined as a sum of widths of all inter-channel kernels having a read in the respective first kernel or second kernel minus a sum of all inter-kernel channels having a write in the respective first kernel or second kernel; and setting a depth of the at least one inter-kernel channel to equal to the slack variable for the reading kernel minus the slack variable for the writing kernel plus max_latency(read) minus min_capacity(write). | 2,800 |
11,537 | 11,537 | 15,410,113 | 2,832 | An exemplary gas turbine engine assembly includes a first spool having a first turbine operatively mounted to a first turbine shaft, and a second spool having a second turbine operatively mounted to a second turbine shaft. The first and second turbines are mounted for rotation about a common rotational axis within an engine static structure. The first and second turbine shafts are coaxial with one another. First and second towershafts are respectively coupled to the first and second turbine shafts. An accessory drive gearbox has a set of gears. A compressor is driven by the first towershaft. The engine assembly further includes a starter generator assembly, and a transmission coupling the starter generator assembly to the first set of gears. The transmission is transitionable between a first mode where the starter generator assembly is driven at a first speed relative to the second towershaft, and a second mode where the starter generator assembly is driven at a different, second speed relative to the second towershaft. | 1. A gas turbine engine assembly comprising:
a first spool having a first turbine operatively mounted to a first turbine shaft; a second spool having a second turbine operatively mounted to a second turbine shaft, the first and second turbines mounted for rotation about a common rotational axis within an engine static structure, the first and second turbine shafts coaxial with one another; first and second towershafts respectively coupled to the first and second turbine shafts; an accessory drive gearbox with a set of gears; a compressor driven by the first towershaft; a starter generator assembly; and a transmission coupling the starter generator assembly to the first set of gears, the transmission transitionable between a first mode where the starter generator assembly is driven at a first speed relative to the second towershaft, and a second mode where the starter generator assembly is driven at a different, second speed relative to the second towershaft. 2. The gas turbine engine assembly of claim 1, wherein the first and second turbine shafts are outer and inner shafts, respectively, and the first and second turbines are high and low pressure turbines, respectively. 3. The gas turbine engine assembly of claim 2, wherein the first towershaft is configured to rotate at a higher speed than the second towershaft. 4. The gas turbine engine assembly of claim 1, wherein the transmission is further transitionable to a third mode where the starter generator assembly is driven at a different, third speed relative to the second towershaft. 5. The gas turbine engine assembly of claim 4, wherein the transmission is further transitionable to at least one fourth mode where the starter generator assembly is driven at a fourth speed relative to the second towershaft, the fourth speed different than each of the first, second, and third speeds. 6. The gas turbine engine assembly of claim 1, further comprising:
a first clutch disposed between the first towershaft and the starter generator assembly, the first clutch configured to enable the starter generator assembly to drive the first spool through the accessory drive gearbox; and a second clutch disposed between the second towershaft and the starter generator assembly, the second clutch configured to enable the second spool to drive the starter generator assembly through the accessory drive gearbox. 7. The gas turbine engine assembly of claim 6, wherein the first clutch and the second clutch are one-way mechanical clutch devices. 8. The gas turbine engine assembly of claim 1, wherein the compressor is a boost compressor of an intercooled cooling air system. 9. The gas turbine engine assembly of claim 8, further comprising a compressor section having a downstream most end and a cooling air tap at a location spaced upstream from said downstream most end, wherein the cooling air tap is passed through at least one boost compressor and at least one heat exchanger, and then passed to a turbine section to cool the turbine section. 10. The gas turbine engine assembly of claim 1, further comprising a fan driven by a speed reduction device, wherein the speed reduction device is driven by the second turbine shaft. 11. The gas turbine engine assembly of claim 1, wherein the starter generator assembly comprises a first variable frequency generator and a second variable frequency generator. 12. The gas turbine engine assembly of claim 1, wherein the starter generator assembly comprises a first integrated drive generator and a second integrated drive generator. 13. A method of operating a gas turbine engine, comprising:
driving a first spool with a starter through a first towershaft and a first clutch to start the engine; driving a starter generator assembly through an accessory gearbox through a second clutch with a second towershaft coupled to a second spool once the engine is started; and driving a compressor through the accessory gearbox with the first towershaft once the engine is started. 14. The method of claim 13, further comprising decoupling the starter from the first spool once the first spool reaches an engine idle speed. 15. The method of claim 14, wherein the decoupling includes rotating the second towershaft at a speed greater than that of the starter. 16. The method of claim 13, wherein the compressor is a boost compressor of an intercooled cooling air system. 17. The method of claim 16, further comprising a compressor section having a downstream most end and a cooling air tap at a location spaced upstream from said downstream most end, wherein the cooling air tap is passed through at least one boost compressor and at least one heat exchanger, and then passed to a turbine section to cool the turbine section. 18. The method of claim 13, further comprising:
driving the starter generator through a transmission in a first mode so that the starter generator assembly is rotated at a first speed relative to the second towershaft; and transitioning the transmission to a second mode so that the starter generator is driven by the second towershaft and rotated at a different, second speed relative to the second towershaft. 19. The method of claim 18, further comprising transitioning the transmission to a third mode; and driving the transmission with the second towershaft to rotate the starter generator assembly at a different, third speed relative to the second towershaft. 20. The method of claim 13, further comprising driving a fan through a speed reduction device with a shaft of the second spool. | An exemplary gas turbine engine assembly includes a first spool having a first turbine operatively mounted to a first turbine shaft, and a second spool having a second turbine operatively mounted to a second turbine shaft. The first and second turbines are mounted for rotation about a common rotational axis within an engine static structure. The first and second turbine shafts are coaxial with one another. First and second towershafts are respectively coupled to the first and second turbine shafts. An accessory drive gearbox has a set of gears. A compressor is driven by the first towershaft. The engine assembly further includes a starter generator assembly, and a transmission coupling the starter generator assembly to the first set of gears. The transmission is transitionable between a first mode where the starter generator assembly is driven at a first speed relative to the second towershaft, and a second mode where the starter generator assembly is driven at a different, second speed relative to the second towershaft.1. A gas turbine engine assembly comprising:
a first spool having a first turbine operatively mounted to a first turbine shaft; a second spool having a second turbine operatively mounted to a second turbine shaft, the first and second turbines mounted for rotation about a common rotational axis within an engine static structure, the first and second turbine shafts coaxial with one another; first and second towershafts respectively coupled to the first and second turbine shafts; an accessory drive gearbox with a set of gears; a compressor driven by the first towershaft; a starter generator assembly; and a transmission coupling the starter generator assembly to the first set of gears, the transmission transitionable between a first mode where the starter generator assembly is driven at a first speed relative to the second towershaft, and a second mode where the starter generator assembly is driven at a different, second speed relative to the second towershaft. 2. The gas turbine engine assembly of claim 1, wherein the first and second turbine shafts are outer and inner shafts, respectively, and the first and second turbines are high and low pressure turbines, respectively. 3. The gas turbine engine assembly of claim 2, wherein the first towershaft is configured to rotate at a higher speed than the second towershaft. 4. The gas turbine engine assembly of claim 1, wherein the transmission is further transitionable to a third mode where the starter generator assembly is driven at a different, third speed relative to the second towershaft. 5. The gas turbine engine assembly of claim 4, wherein the transmission is further transitionable to at least one fourth mode where the starter generator assembly is driven at a fourth speed relative to the second towershaft, the fourth speed different than each of the first, second, and third speeds. 6. The gas turbine engine assembly of claim 1, further comprising:
a first clutch disposed between the first towershaft and the starter generator assembly, the first clutch configured to enable the starter generator assembly to drive the first spool through the accessory drive gearbox; and a second clutch disposed between the second towershaft and the starter generator assembly, the second clutch configured to enable the second spool to drive the starter generator assembly through the accessory drive gearbox. 7. The gas turbine engine assembly of claim 6, wherein the first clutch and the second clutch are one-way mechanical clutch devices. 8. The gas turbine engine assembly of claim 1, wherein the compressor is a boost compressor of an intercooled cooling air system. 9. The gas turbine engine assembly of claim 8, further comprising a compressor section having a downstream most end and a cooling air tap at a location spaced upstream from said downstream most end, wherein the cooling air tap is passed through at least one boost compressor and at least one heat exchanger, and then passed to a turbine section to cool the turbine section. 10. The gas turbine engine assembly of claim 1, further comprising a fan driven by a speed reduction device, wherein the speed reduction device is driven by the second turbine shaft. 11. The gas turbine engine assembly of claim 1, wherein the starter generator assembly comprises a first variable frequency generator and a second variable frequency generator. 12. The gas turbine engine assembly of claim 1, wherein the starter generator assembly comprises a first integrated drive generator and a second integrated drive generator. 13. A method of operating a gas turbine engine, comprising:
driving a first spool with a starter through a first towershaft and a first clutch to start the engine; driving a starter generator assembly through an accessory gearbox through a second clutch with a second towershaft coupled to a second spool once the engine is started; and driving a compressor through the accessory gearbox with the first towershaft once the engine is started. 14. The method of claim 13, further comprising decoupling the starter from the first spool once the first spool reaches an engine idle speed. 15. The method of claim 14, wherein the decoupling includes rotating the second towershaft at a speed greater than that of the starter. 16. The method of claim 13, wherein the compressor is a boost compressor of an intercooled cooling air system. 17. The method of claim 16, further comprising a compressor section having a downstream most end and a cooling air tap at a location spaced upstream from said downstream most end, wherein the cooling air tap is passed through at least one boost compressor and at least one heat exchanger, and then passed to a turbine section to cool the turbine section. 18. The method of claim 13, further comprising:
driving the starter generator through a transmission in a first mode so that the starter generator assembly is rotated at a first speed relative to the second towershaft; and transitioning the transmission to a second mode so that the starter generator is driven by the second towershaft and rotated at a different, second speed relative to the second towershaft. 19. The method of claim 18, further comprising transitioning the transmission to a third mode; and driving the transmission with the second towershaft to rotate the starter generator assembly at a different, third speed relative to the second towershaft. 20. The method of claim 13, further comprising driving a fan through a speed reduction device with a shaft of the second spool. | 2,800 |
11,538 | 11,538 | 14,992,662 | 2,871 | According to one embodiment, a display device includes a display panel including a first surface and a second surface on an opposite side to the first surface, configured to display an image on the second surface, a cover glass includes a third surface and a fourth surface on an opposite side to the third surface, the third surface facing the second surface of the display panel, an adhesive layer configured to fix the display panel and the cover glass to each other and an optical film fixed to the fourth surface of the cover glass. | 1. A display device comprising:
a display panel comprising a first surface and a second surface on an opposite side to the first surface, configured to display an image on the second surface; a cover glass comprising a third surface and a fourth surface on an opposite side to the third surface, the third surface facing the second surface of the display panel; an adhesive layer configured to fix the display panel and the cover glass to each other; and an optical film fixed to the fourth surface of the cover glass. 2. The display device of claim 1, wherein
the display panel comprises a first substrate, a second substrate opposing the first substrate and a liquid crystal layer held between the first substrate and the second substrate, and the optical film comprises a polarizer. 3. The display device of claim 2, wherein
the first substrate comprises a pixel electrode provided for every pixel on a side opposing the second substrate, a common electrode opposing a plurality of pixel electrodes, and an interlayer insulating film interposed between the pixel electrodes and the common electrode. 4. The display device of claim 1, further comprising a detection electrode between the display panel and the cover glass, configured to detect an object approaching or contacting the optical film. 5. The display device of claim 1, further comprising an antistatic layer between the display panel and the cover glass. 6. The display device of claim 5, wherein
the antistatic layer is formed on the second or third surface. 7. The display device of claim 1, wherein the adhesive layer is an antistatic layer. 8. The display device of claim 5, wherein the antistatic layer has a sheet resistance of 108Ω/□ or more. 9. The display device of claim 1, further comprising a detection electrode configured to detect an object approaching or contacting the optical film, and an antistatic layer, between the display panel and the cover glass,
wherein more, the detection electrode has a sheet resistance value of 1/100 or less of that of the antistatic layer. 10. The display device of claim 1, wherein the cover glass is formed from untempered glass. | According to one embodiment, a display device includes a display panel including a first surface and a second surface on an opposite side to the first surface, configured to display an image on the second surface, a cover glass includes a third surface and a fourth surface on an opposite side to the third surface, the third surface facing the second surface of the display panel, an adhesive layer configured to fix the display panel and the cover glass to each other and an optical film fixed to the fourth surface of the cover glass.1. A display device comprising:
a display panel comprising a first surface and a second surface on an opposite side to the first surface, configured to display an image on the second surface; a cover glass comprising a third surface and a fourth surface on an opposite side to the third surface, the third surface facing the second surface of the display panel; an adhesive layer configured to fix the display panel and the cover glass to each other; and an optical film fixed to the fourth surface of the cover glass. 2. The display device of claim 1, wherein
the display panel comprises a first substrate, a second substrate opposing the first substrate and a liquid crystal layer held between the first substrate and the second substrate, and the optical film comprises a polarizer. 3. The display device of claim 2, wherein
the first substrate comprises a pixel electrode provided for every pixel on a side opposing the second substrate, a common electrode opposing a plurality of pixel electrodes, and an interlayer insulating film interposed between the pixel electrodes and the common electrode. 4. The display device of claim 1, further comprising a detection electrode between the display panel and the cover glass, configured to detect an object approaching or contacting the optical film. 5. The display device of claim 1, further comprising an antistatic layer between the display panel and the cover glass. 6. The display device of claim 5, wherein
the antistatic layer is formed on the second or third surface. 7. The display device of claim 1, wherein the adhesive layer is an antistatic layer. 8. The display device of claim 5, wherein the antistatic layer has a sheet resistance of 108Ω/□ or more. 9. The display device of claim 1, further comprising a detection electrode configured to detect an object approaching or contacting the optical film, and an antistatic layer, between the display panel and the cover glass,
wherein more, the detection electrode has a sheet resistance value of 1/100 or less of that of the antistatic layer. 10. The display device of claim 1, wherein the cover glass is formed from untempered glass. | 2,800 |
11,539 | 11,539 | 15,656,173 | 2,894 | It is an object to provide a semiconductor device including a thin film transistor with favorable electric properties and high reliability, and a method for manufacturing the semiconductor device with high productivity. In an inverted staggered (bottom gate) thin film transistor, an oxide semiconductor film containing In, Ga, and Zn is used as a semiconductor layer, and a buffer layer formed using a metal oxide layer is provided between the semiconductor layer and a source and drain electrode layers. The metal oxide layer is intentionally provided as the buffer layer between the semiconductor layer and the source and drain electrode layers, whereby ohmic contact is obtained. | 1. (canceled) 2. A semiconductor device comprising:
a thin film transistor comprising:
a gate electrode;
a gate insulating layer over the gate electrode;
an oxide semiconductor layer over the gate insulating layer;
a first metal oxide layer over the oxide semiconductor layer;
a first conductive layer over the first metal oxide layer;
a second metal oxide layer over the oxide semiconductor layer; and
a second conductive layer over the second metal oxide layer; and
an insulating layer over the oxide semiconductor layer, the insulating layer being in contact with a top surface of the oxide semiconductor layer, wherein a gap between the first metal oxide layer and the second metal oxide layer is smaller than a gap between the first conductive layer and the second conductive layer, and wherein a top surface of a first portion of the first metal oxide layer is in contact with the first conductive layer, and a top surface and a side surface of an end portion of the first metal oxide layer is not in contact with the first conductive layer. 3. The semiconductor device according to claim 2, further comprising:
a pixel electrode electrically connected to the oxide semiconductor layer through the first metal oxide layer and the first conductive layer or through the second metal oxide layer and the second conductive layer. 4. The semiconductor device according to claim 2, wherein the top surface of the first portion and the top surface of the end portion are at the same level. 5. The semiconductor device according to claim 2, further comprising:
a barrier metal between the gate electrode and a substrate over which the thin film transistor is located, wherein the barrier metal is capable of preventing diffusion of the gate electrode. 6. A semiconductor device comprising:
a thin film transistor comprising:
a gate electrode;
a gate insulating layer over the gate electrode;
an oxide semiconductor layer over the gate insulating layer;
a first metal oxide layer over the oxide semiconductor layer;
a first conductive layer over the first metal oxide layer;
a second metal oxide layer over the oxide semiconductor layer; and
a second conductive layer over the second metal oxide layer; and
an insulating layer over the oxide semiconductor layer, the first metal oxide layer, the first conductive layer, the second metal oxide layer and the second conductive layer, the insulating layer being in contact with a top surface of the oxide semiconductor layer, wherein a gap between the first metal oxide layer and the second metal oxide layer is smaller than a gap between the first conductive layer and the second conductive layer, wherein the gate electrode comprises copper, wherein the gate insulating layer comprises a first gate insulating layer and a second gate insulating layer over the first gate insulating layer, wherein the first gate insulating layer is a silicon nitride film or a silicon nitride oxide film, and wherein a top surface of a first portion of the first metal oxide layer is in contact with the first conductive layer, and a top surface and a side surface of an end portion of the first metal oxide layer is not in contact with the first conductive layer. 7. The semiconductor device according to claim 6, further comprising:
a pixel electrode electrically connected to the oxide semiconductor layer through the first metal oxide layer and the first conductive layer or through the second metal oxide layer and the second conductive layer. 8. The semiconductor device according to claim 6, wherein the first gate insulating layer is the silicon nitride oxide film, and the silicon nitride oxide film comprises more nitrogen than oxygen. 9. The semiconductor device according to claim 6, further comprising:
a pixel electrode electrically connected to the oxide semiconductor layer through the first metal oxide layer and the first conductive layer or through the second metal oxide layer and the second conductive layer. 10. The semiconductor device according to claim 6, wherein the top surface of the first portion and the top surface of the end portion are at the same level. 11. The semiconductor device according to claim 6, further comprising:
a barrier metal between the gate electrode and a substrate over which the thin film transistor is located, wherein the barrier metal is capable of preventing diffusion of the gate electrode. 12. A semiconductor device comprising:
a thin film transistor comprising:
a gate electrode;
a gate insulating layer over the gate electrode;
an oxide semiconductor layer over the gate insulating layer;
a first conductive layer over the oxide semiconductor layer;
a second conductive layer over the first conductive layer;
a third conductive layer over the second conductive layer;
a fourth conductive layer over the oxide semiconductor layer;
a fifth conductive layer over the fourth conductive layer; and
a sixth conductive layer over the fifth conductive layer; and
an insulating layer over the oxide semiconductor layer, the insulating layer being in contact with a top surface of the oxide semiconductor layer, wherein a gap between the first conductive layer and the fourth conductive layer is smaller than a gap between the second conductive layer and the fifth conductive layer, wherein the gap between the first conductive layer and the fourth conductive layer is smaller than a gap between the third conductive layer and the sixth conductive layer, and wherein a top surface of a first portion of the first conductive layer is in contact with the second conductive layer, and a top surface and a side surface of an end portion of the first conductive layer is not in contact with the second conductive layer. 13. The semiconductor device according to claim 12, further comprising:
a pixel electrode electrically connected to the oxide semiconductor layer through the first conductive layer, the second conductive layer and the third conductive layer or through the fourth conductive layer, the fifth conductive layer and the sixth conductive layer. 13. (canceled) 14. The semiconductor device according to claim 12, wherein the gate electrode comprises copper. 15. A semiconductor device comprising:
a thin film transistor comprising:
a gate electrode;
a gate insulating layer over the gate electrode;
an oxide semiconductor layer over the gate insulating layer;
a first layered structure electrically connected to the oxide semiconductor layer; and
a second layered structure electrically connected to the oxide semiconductor layer; and
an insulating layer over the oxide semiconductor layer, the first layered structure and the second layered structure, the insulating layer being in contact with a top surface of the oxide semiconductor layer, wherein the first layered structure comprises:
a first conductive layer over the oxide semiconductor layer;
a second conductive layer over the first conductive layer; and
a third conductive layer over the second conductive layer,
wherein the second layered structure comprises:
a fourth conductive layer over the oxide semiconductor layer;
a fifth conductive layer over the fourth conductive layer; and
a sixth conductive layer over the fifth conductive layer,
wherein a gap between the first conductive layer and the fourth conductive layer is smaller than a gap between the second conductive layer and the fifth conductive layer, wherein the gap between the first conductive layer and the fourth conductive layer is smaller than a gap between the third conductive layer and the sixth conductive layer, wherein the first layered structure comprises copper, wherein the second layered structure comprises copper, wherein the gate insulating layer comprises a first gate insulating layer and a second gate insulating layer over the first gate insulating layer, wherein the first gate insulating layer is a silicon nitride film or a silicon nitride oxide film, and wherein a top surface of a first portion of the first conductive layer is in contact with the second conductive layer, and a top surface and a side surface of an end portion of the first conductive layer is not in contact with the second conductive layer. 16. The semiconductor device according to claim 15, further comprising:
a pixel electrode electrically connected to the oxide semiconductor layer through the first conductive layer, the second conductive layer and the third conductive layer or through the fourth conductive layer, the fifth conductive layer and the sixth conductive layer. 17. The semiconductor device according to claim 15, wherein the first gate insulating layer is the silicon nitride oxide film, and the silicon nitride oxide film comprises more nitrogen than oxygen. 18. The semiconductor device according to claim 15, wherein the top surface of the first portion and the top surface of the end portion are at the same level. 19. The semiconductor device according to claim 15, wherein the gate electrode comprises copper. 20. The semiconductor device according to claim 19, further comprising:
a barrier metal between the gate electrode and a substrate over which the thin film transistor is located, wherein the barrier metal is capable of preventing diffusion of the gate electrode. 21. The semiconductor device according to claim 20, wherein the barrier metal is a nitride film of one selected from the group consisting of titanium, molybdenum, chromium, tantalum, tungsten, and aluminum. 22. The semiconductor device according to claim 12, wherein the top surface of the first portion and the top surface of the end portion are at the same level. | It is an object to provide a semiconductor device including a thin film transistor with favorable electric properties and high reliability, and a method for manufacturing the semiconductor device with high productivity. In an inverted staggered (bottom gate) thin film transistor, an oxide semiconductor film containing In, Ga, and Zn is used as a semiconductor layer, and a buffer layer formed using a metal oxide layer is provided between the semiconductor layer and a source and drain electrode layers. The metal oxide layer is intentionally provided as the buffer layer between the semiconductor layer and the source and drain electrode layers, whereby ohmic contact is obtained.1. (canceled) 2. A semiconductor device comprising:
a thin film transistor comprising:
a gate electrode;
a gate insulating layer over the gate electrode;
an oxide semiconductor layer over the gate insulating layer;
a first metal oxide layer over the oxide semiconductor layer;
a first conductive layer over the first metal oxide layer;
a second metal oxide layer over the oxide semiconductor layer; and
a second conductive layer over the second metal oxide layer; and
an insulating layer over the oxide semiconductor layer, the insulating layer being in contact with a top surface of the oxide semiconductor layer, wherein a gap between the first metal oxide layer and the second metal oxide layer is smaller than a gap between the first conductive layer and the second conductive layer, and wherein a top surface of a first portion of the first metal oxide layer is in contact with the first conductive layer, and a top surface and a side surface of an end portion of the first metal oxide layer is not in contact with the first conductive layer. 3. The semiconductor device according to claim 2, further comprising:
a pixel electrode electrically connected to the oxide semiconductor layer through the first metal oxide layer and the first conductive layer or through the second metal oxide layer and the second conductive layer. 4. The semiconductor device according to claim 2, wherein the top surface of the first portion and the top surface of the end portion are at the same level. 5. The semiconductor device according to claim 2, further comprising:
a barrier metal between the gate electrode and a substrate over which the thin film transistor is located, wherein the barrier metal is capable of preventing diffusion of the gate electrode. 6. A semiconductor device comprising:
a thin film transistor comprising:
a gate electrode;
a gate insulating layer over the gate electrode;
an oxide semiconductor layer over the gate insulating layer;
a first metal oxide layer over the oxide semiconductor layer;
a first conductive layer over the first metal oxide layer;
a second metal oxide layer over the oxide semiconductor layer; and
a second conductive layer over the second metal oxide layer; and
an insulating layer over the oxide semiconductor layer, the first metal oxide layer, the first conductive layer, the second metal oxide layer and the second conductive layer, the insulating layer being in contact with a top surface of the oxide semiconductor layer, wherein a gap between the first metal oxide layer and the second metal oxide layer is smaller than a gap between the first conductive layer and the second conductive layer, wherein the gate electrode comprises copper, wherein the gate insulating layer comprises a first gate insulating layer and a second gate insulating layer over the first gate insulating layer, wherein the first gate insulating layer is a silicon nitride film or a silicon nitride oxide film, and wherein a top surface of a first portion of the first metal oxide layer is in contact with the first conductive layer, and a top surface and a side surface of an end portion of the first metal oxide layer is not in contact with the first conductive layer. 7. The semiconductor device according to claim 6, further comprising:
a pixel electrode electrically connected to the oxide semiconductor layer through the first metal oxide layer and the first conductive layer or through the second metal oxide layer and the second conductive layer. 8. The semiconductor device according to claim 6, wherein the first gate insulating layer is the silicon nitride oxide film, and the silicon nitride oxide film comprises more nitrogen than oxygen. 9. The semiconductor device according to claim 6, further comprising:
a pixel electrode electrically connected to the oxide semiconductor layer through the first metal oxide layer and the first conductive layer or through the second metal oxide layer and the second conductive layer. 10. The semiconductor device according to claim 6, wherein the top surface of the first portion and the top surface of the end portion are at the same level. 11. The semiconductor device according to claim 6, further comprising:
a barrier metal between the gate electrode and a substrate over which the thin film transistor is located, wherein the barrier metal is capable of preventing diffusion of the gate electrode. 12. A semiconductor device comprising:
a thin film transistor comprising:
a gate electrode;
a gate insulating layer over the gate electrode;
an oxide semiconductor layer over the gate insulating layer;
a first conductive layer over the oxide semiconductor layer;
a second conductive layer over the first conductive layer;
a third conductive layer over the second conductive layer;
a fourth conductive layer over the oxide semiconductor layer;
a fifth conductive layer over the fourth conductive layer; and
a sixth conductive layer over the fifth conductive layer; and
an insulating layer over the oxide semiconductor layer, the insulating layer being in contact with a top surface of the oxide semiconductor layer, wherein a gap between the first conductive layer and the fourth conductive layer is smaller than a gap between the second conductive layer and the fifth conductive layer, wherein the gap between the first conductive layer and the fourth conductive layer is smaller than a gap between the third conductive layer and the sixth conductive layer, and wherein a top surface of a first portion of the first conductive layer is in contact with the second conductive layer, and a top surface and a side surface of an end portion of the first conductive layer is not in contact with the second conductive layer. 13. The semiconductor device according to claim 12, further comprising:
a pixel electrode electrically connected to the oxide semiconductor layer through the first conductive layer, the second conductive layer and the third conductive layer or through the fourth conductive layer, the fifth conductive layer and the sixth conductive layer. 13. (canceled) 14. The semiconductor device according to claim 12, wherein the gate electrode comprises copper. 15. A semiconductor device comprising:
a thin film transistor comprising:
a gate electrode;
a gate insulating layer over the gate electrode;
an oxide semiconductor layer over the gate insulating layer;
a first layered structure electrically connected to the oxide semiconductor layer; and
a second layered structure electrically connected to the oxide semiconductor layer; and
an insulating layer over the oxide semiconductor layer, the first layered structure and the second layered structure, the insulating layer being in contact with a top surface of the oxide semiconductor layer, wherein the first layered structure comprises:
a first conductive layer over the oxide semiconductor layer;
a second conductive layer over the first conductive layer; and
a third conductive layer over the second conductive layer,
wherein the second layered structure comprises:
a fourth conductive layer over the oxide semiconductor layer;
a fifth conductive layer over the fourth conductive layer; and
a sixth conductive layer over the fifth conductive layer,
wherein a gap between the first conductive layer and the fourth conductive layer is smaller than a gap between the second conductive layer and the fifth conductive layer, wherein the gap between the first conductive layer and the fourth conductive layer is smaller than a gap between the third conductive layer and the sixth conductive layer, wherein the first layered structure comprises copper, wherein the second layered structure comprises copper, wherein the gate insulating layer comprises a first gate insulating layer and a second gate insulating layer over the first gate insulating layer, wherein the first gate insulating layer is a silicon nitride film or a silicon nitride oxide film, and wherein a top surface of a first portion of the first conductive layer is in contact with the second conductive layer, and a top surface and a side surface of an end portion of the first conductive layer is not in contact with the second conductive layer. 16. The semiconductor device according to claim 15, further comprising:
a pixel electrode electrically connected to the oxide semiconductor layer through the first conductive layer, the second conductive layer and the third conductive layer or through the fourth conductive layer, the fifth conductive layer and the sixth conductive layer. 17. The semiconductor device according to claim 15, wherein the first gate insulating layer is the silicon nitride oxide film, and the silicon nitride oxide film comprises more nitrogen than oxygen. 18. The semiconductor device according to claim 15, wherein the top surface of the first portion and the top surface of the end portion are at the same level. 19. The semiconductor device according to claim 15, wherein the gate electrode comprises copper. 20. The semiconductor device according to claim 19, further comprising:
a barrier metal between the gate electrode and a substrate over which the thin film transistor is located, wherein the barrier metal is capable of preventing diffusion of the gate electrode. 21. The semiconductor device according to claim 20, wherein the barrier metal is a nitride film of one selected from the group consisting of titanium, molybdenum, chromium, tantalum, tungsten, and aluminum. 22. The semiconductor device according to claim 12, wherein the top surface of the first portion and the top surface of the end portion are at the same level. | 2,800 |
11,540 | 11,540 | 15,272,900 | 2,853 | The invention concerns a corrugator machine with an intermediate web dispensing device for dispensing an intermediate web, a top layer dispensing device for dispensing a top layer, a printing arrangement located downstream of the top layer dispensing device for printing the top layer, a device located downstream of the intermediate web dispensing device and the printing arrangement for producing a corrugated board web laminated on one side from the intermediate web and the top layer, a lamination web dispensing device for dispensing a lamination web, and a connection device for connecting the corrugated board web laminated on one side and the lamination web with each other whilst forming an at least three-layered corrugated board web. | 1. A corrugator machine for producing corrugated board, with
a) an intermediate web dispensing device (3) for dispensing an intermediate web (15), b) a top layer dispensing device (2) for dispensing a top layer (9), c) a printing arrangement located downstream of the top layer dispensing device (2) for printing the top layer (9), d) a device (1) located downstream of the intermediate web dispensing device (3) and the printing arrangement for producing a corrugated board web (68) laminated on one side from the intermediate web (15) and the top layer (9), e) a lamination web dispensing device (78) for dispensing a lamination web (84), and f) a connection device (90) for connecting the corrugated board web (68) laminated on one side and the lamination web (84) with each other whilst forming an at least three-layered corrugated board web (94). 2. A corrugator machine according to claim 1, wherein the top layer dispensing device (2) is designed as a splice device for dispensing an endless top layer (9). 3. A corrugator machine according to claim 1, wherein the printing arrangement is arranged at least in part above the top layer dispensing device (2). 4. A corrugator machine according to claim 1, wherein the printing arrangement is arranged at least mostly above the top layer dispensing device (2). 5. A corrugator machine according to claim 1, wherein the printing arrangement extends at least in some areas above the top layer dispensing device (2). 6. A corrugator machine according to claim 1, wherein the printing arrangement comprises a printing device (27) for printing the top layer (9). 7. A corrugator machine according to claim 6, wherein the printing device (27) is designed as an inkjet printing device. 8. A corrugator machine according to claim 6, wherein the printing arrangement comprises a print drying device (32) for drying the top layer (9), located downstream of the printing device (27). 9. A corrugator machine according to claim 1, wherein a heating device (61) for pre-heating the top layer (9) is arranged between the printing arrangement and the device (1) for producing a corrugated board web (68) laminated on one side. 10. A corrugator machine according to claim 1, wherein a top layer rewinding means for rewinding the top layer (9) is arranged between the printing arrangement and the device (1) for producing a corrugated board web (68) laminated on one side. 11. A corrugator machine according to claim 1, characterised by at least one support frame (62; 62 a) for supporting at least a part of the printing arrangement. 12. A corrugator machine according to claim 11, wherein the at least one support frame (62; 62 a) is designed separately from a corrugator machine bridge (95) that supports a storage device (77) for storing the corrugated board web (68) laminated on one side. 13. A corrugator machine according to claim 12, wherein at least one vibration decoupling element (96) for at least partially vibration decoupling the at least one support frame (62 a) from the corrugator machine bridge (95) is arranged between the at least one support frame (62 a) and the corrugator machine bridge (95). 14. A corrugator machine according to claim 12, wherein at least one vibration decoupling element (96) for completely vibration decoupling the at least one support frame (62 a) from the corrugator machine bridge (95) is arranged between the at least one support frame (62 a) and the corrugator machine bridge (95) 15. A corrugator machine according to claim 1, wherein the printing device (27) applies water-based inkjet ink to the top layer (9) and is then equipped with a water-based varnish, wherein the varnish is applied to the top layer (9) with at least one of the group comprising a conventional coating module and an inkjet printing device. | The invention concerns a corrugator machine with an intermediate web dispensing device for dispensing an intermediate web, a top layer dispensing device for dispensing a top layer, a printing arrangement located downstream of the top layer dispensing device for printing the top layer, a device located downstream of the intermediate web dispensing device and the printing arrangement for producing a corrugated board web laminated on one side from the intermediate web and the top layer, a lamination web dispensing device for dispensing a lamination web, and a connection device for connecting the corrugated board web laminated on one side and the lamination web with each other whilst forming an at least three-layered corrugated board web.1. A corrugator machine for producing corrugated board, with
a) an intermediate web dispensing device (3) for dispensing an intermediate web (15), b) a top layer dispensing device (2) for dispensing a top layer (9), c) a printing arrangement located downstream of the top layer dispensing device (2) for printing the top layer (9), d) a device (1) located downstream of the intermediate web dispensing device (3) and the printing arrangement for producing a corrugated board web (68) laminated on one side from the intermediate web (15) and the top layer (9), e) a lamination web dispensing device (78) for dispensing a lamination web (84), and f) a connection device (90) for connecting the corrugated board web (68) laminated on one side and the lamination web (84) with each other whilst forming an at least three-layered corrugated board web (94). 2. A corrugator machine according to claim 1, wherein the top layer dispensing device (2) is designed as a splice device for dispensing an endless top layer (9). 3. A corrugator machine according to claim 1, wherein the printing arrangement is arranged at least in part above the top layer dispensing device (2). 4. A corrugator machine according to claim 1, wherein the printing arrangement is arranged at least mostly above the top layer dispensing device (2). 5. A corrugator machine according to claim 1, wherein the printing arrangement extends at least in some areas above the top layer dispensing device (2). 6. A corrugator machine according to claim 1, wherein the printing arrangement comprises a printing device (27) for printing the top layer (9). 7. A corrugator machine according to claim 6, wherein the printing device (27) is designed as an inkjet printing device. 8. A corrugator machine according to claim 6, wherein the printing arrangement comprises a print drying device (32) for drying the top layer (9), located downstream of the printing device (27). 9. A corrugator machine according to claim 1, wherein a heating device (61) for pre-heating the top layer (9) is arranged between the printing arrangement and the device (1) for producing a corrugated board web (68) laminated on one side. 10. A corrugator machine according to claim 1, wherein a top layer rewinding means for rewinding the top layer (9) is arranged between the printing arrangement and the device (1) for producing a corrugated board web (68) laminated on one side. 11. A corrugator machine according to claim 1, characterised by at least one support frame (62; 62 a) for supporting at least a part of the printing arrangement. 12. A corrugator machine according to claim 11, wherein the at least one support frame (62; 62 a) is designed separately from a corrugator machine bridge (95) that supports a storage device (77) for storing the corrugated board web (68) laminated on one side. 13. A corrugator machine according to claim 12, wherein at least one vibration decoupling element (96) for at least partially vibration decoupling the at least one support frame (62 a) from the corrugator machine bridge (95) is arranged between the at least one support frame (62 a) and the corrugator machine bridge (95). 14. A corrugator machine according to claim 12, wherein at least one vibration decoupling element (96) for completely vibration decoupling the at least one support frame (62 a) from the corrugator machine bridge (95) is arranged between the at least one support frame (62 a) and the corrugator machine bridge (95) 15. A corrugator machine according to claim 1, wherein the printing device (27) applies water-based inkjet ink to the top layer (9) and is then equipped with a water-based varnish, wherein the varnish is applied to the top layer (9) with at least one of the group comprising a conventional coating module and an inkjet printing device. | 2,800 |
11,541 | 11,541 | 15,237,834 | 2,856 | A system and method for detecting a shaft break in a turbofan gas turbine engine includes sensing fan rotational speed and sensing turbine engine rotational speed. A rate of change of rotational speed difference between the sensed fan rotational speed and the sensed turbine engine rotational speed is determined in a processor, and a determination that a shaft break has occurred is made in the processor based at least in part on the rate of change of the rotational speed difference. | 1. A method for detecting a shaft break in a turbofan gas turbine engine, the turbofan engine including at least a fan and a turbine, the method comprising the steps of:
sensing fan rotational speed; sensing turbine engine rotational speed; determining, in a processor, a rate of change of rotational speed difference between the sensed fan rotational speed and the sensed turbine engine rotational speed; and determining, in the processor, that a shaft break has occurred based at least in part on the rate of change of the rotational speed difference. 2. The method of claim 1, wherein the step of determining the rate of change of rotational speed difference comprises:
subtracting, in the processor, the sensed turbine engine rotational speed from the sensed fan rotational speed to determine a rotational speed difference; and determining, in the processor, the rate of change of rotational speed difference. 3. The method of claim 2, wherein the step of determining that a shaft break has occurred comprises:
comparing the rate of change of rotational speed difference to a predetermined threshold value; and determining that the shaft break has occurred if the rate of change of rotational speed difference is less than or equal to the predetermined threshold value. 4. The method of claim 2, wherein the step of determining the rate of change of rotational speed difference comprises filtering the rotational speed difference through a first-order high-pass filter. 5. The method of claim 1, wherein the step of determining that a shaft break has occurred comprises:
calculating a square of the rate of change of rotational speed difference; filtering the square of the rate of change of rotational speed difference through a first-order lag filter to provide a squared and filtered rate of change; comparing the squared and filtered rate of change to a predetermined threshold value; and determining that the shaft break has occurred if the squared and filtered rate of change is greater than or equal to the predetermined threshold value. 6. The method of claim 1, wherein the step of determining that a shaft break has occurred comprises:
filtering the rate of change of rotational speed difference through a first-order lag filter to provide a filtered rate of change; calculating a square of the filtered rate of change to provide a filtered and squared rate of change; comparing the filtered and squared rate of change to a predetermined threshold value; and determining that the shaft break has occurred if the filtered and squared rate of change is greater than or equal to the predetermined threshold value. 7. The method of claim 1, wherein the step of determining that a shaft break has occurred comprises:
calculating a square of the rate of change of rotational speed difference; filtering the square of the rate of change of rotational speed difference through a first first-order lag filter to provide a squared and filtered rate of change; filtering the rate of change of rotational speed difference through a second first-order lag filter to provide a filtered rate of change; calculating a square of the filtered rate of change to provide a filtered and squared rate of change; subtracting the filtered and squared rate of change from the squared and filtered rate of change to provide a variance value; comparing the variance value to a predetermined threshold value; and determining that the shaft break has occurred if the variance value is greater than or equal to the predetermined threshold value. 8. The method of claim 1, further comprising:
correcting sensed fan rotational speed and the sensed turbine engine rotational speed for at least one of temperature and pressure. 9. The method of claim 1, wherein the step of determining the rate of change of rotational speed difference comprises:
determining, in the processor, fan rotational speed rate of change; determining, in the processor, turbine engine rotational speed rate of change; and subtracting, in the processor, the turbine engine rotational speed rate of change from the fan rotational speed rate of change. 10. The method of claim 9, further comprising:
correcting the fan rotational speed rate of change and the turbine engine rotational speed rate of change for at least one of temperature and pressure. 11. A turbofan gas turbine engine shaft break detection system for a turbofan engine that includes at least a fan and a turbine, the system comprising:
a fan rotational speed sensor configured to sense fan rotational speed and supply a fan rotational speed signal representative thereof; a turbine engine rotational engine speed sensor configured to sense turbine engine rotational speed and supply a turbine engine rotational speed signal representative thereof; a processor coupled to receive the fan rotational speed signal and the turbine engine rotational speed signal and configured, upon receipt thereof, to:
determine a rate of change of rotational speed difference between the sensed fan rotational speed and the sensed turbine engine rotational speed; and
determine that a shaft break has occurred based at least in part on the rate of change of the rotational speed difference. 12. The system of claim 11, wherein the processor is configured to determine the rate of change of rotational speed difference by:
subtracting, in the processor, the sensed turbine engine rotational speed from the sensed fan rotational speed to determine a rotational speed difference; and determining, in the processor, the rate of change of rotational speed difference. 13. The system of claim 12, wherein the processor is configured to determine that a shaft break has occurred by:
comparing the rate of change of rotational speed difference to a predetermined threshold value; and determining that the shaft break has occurred if the rate of change of rotational speed difference is less than or equal to the predetermined threshold value. 14. The system of claim 12, wherein the processor is configured to determine the rate of change of rotational speed difference by filtering the rotational speed difference through a first-order high-pass filter. 15. The system of claim 11, wherein the processor is configured to determine that a shaft break has occurred by:
calculating a square of the rate of change of rotational speed difference; filtering the square of the rate of change of rotational speed difference through a first-order lag filter to provide a squared and filtered rate of change; comparing the squared and filtered rate of change to a predetermined threshold value; and determining that the shaft break has occurred if the squared and filtered rate of change is greater than or equal to the predetermined threshold value. 16. The system of claim 1, wherein the processor is configured to determine that a shaft break has occurred by:
filtering the rate of change of rotational speed difference through a first-order lag filter to provide a filtered rate of change; calculating a square of the filtered rate of change to provide a filtered and squared rate of change; comparing the filtered and squared rate of change to a predetermined threshold value; and determining that the shaft break has occurred if the filtered and squared rate of change is greater than or equal to the predetermined threshold value. 17. The system of claim 11, wherein the processor is configured to determine that a shaft break has occurred by:
calculating a square of the rate of change of rotational speed difference; filtering the square of the rate of change of rotational speed difference through a first first-order lag filter to provide a squared and filtered rate of change; filtering the rate of change of rotational speed difference through a second first-order lag filter to provide a filtered rate of change; calculating a square of the filtered rate of change to provide a filtered and squared rate of change; subtracting the filtered and squared rate of change from the squared and filtered rate of change to provide a variance value; comparing the variance value to a predetermined threshold value; and determining that the shaft break has occurred if the variance value is greater than or equal to the predetermined threshold value. 18. The system of claim 1, wherein the processor is further configured to correct sensed fan rotational speed and the sensed turbine engine rotational speed for at least one of temperature and pressure. 19. The system of claim 11, wherein the processor is configured to determine the rate of change of rotational speed difference by:
determining, in the processor, fan rotational speed rate of change; determining, in the processor, turbine engine rotational speed rate of change; and subtracting, in the processor, the turbine engine rotational speed rate of change from the fan rotational speed rate of change. 20. The system of claim 19, wherein the processor is further configured to correct the fan rotational speed rate of change and the turbine engine rotational speed rate of change for at least one of temperature and pressure. | A system and method for detecting a shaft break in a turbofan gas turbine engine includes sensing fan rotational speed and sensing turbine engine rotational speed. A rate of change of rotational speed difference between the sensed fan rotational speed and the sensed turbine engine rotational speed is determined in a processor, and a determination that a shaft break has occurred is made in the processor based at least in part on the rate of change of the rotational speed difference.1. A method for detecting a shaft break in a turbofan gas turbine engine, the turbofan engine including at least a fan and a turbine, the method comprising the steps of:
sensing fan rotational speed; sensing turbine engine rotational speed; determining, in a processor, a rate of change of rotational speed difference between the sensed fan rotational speed and the sensed turbine engine rotational speed; and determining, in the processor, that a shaft break has occurred based at least in part on the rate of change of the rotational speed difference. 2. The method of claim 1, wherein the step of determining the rate of change of rotational speed difference comprises:
subtracting, in the processor, the sensed turbine engine rotational speed from the sensed fan rotational speed to determine a rotational speed difference; and determining, in the processor, the rate of change of rotational speed difference. 3. The method of claim 2, wherein the step of determining that a shaft break has occurred comprises:
comparing the rate of change of rotational speed difference to a predetermined threshold value; and determining that the shaft break has occurred if the rate of change of rotational speed difference is less than or equal to the predetermined threshold value. 4. The method of claim 2, wherein the step of determining the rate of change of rotational speed difference comprises filtering the rotational speed difference through a first-order high-pass filter. 5. The method of claim 1, wherein the step of determining that a shaft break has occurred comprises:
calculating a square of the rate of change of rotational speed difference; filtering the square of the rate of change of rotational speed difference through a first-order lag filter to provide a squared and filtered rate of change; comparing the squared and filtered rate of change to a predetermined threshold value; and determining that the shaft break has occurred if the squared and filtered rate of change is greater than or equal to the predetermined threshold value. 6. The method of claim 1, wherein the step of determining that a shaft break has occurred comprises:
filtering the rate of change of rotational speed difference through a first-order lag filter to provide a filtered rate of change; calculating a square of the filtered rate of change to provide a filtered and squared rate of change; comparing the filtered and squared rate of change to a predetermined threshold value; and determining that the shaft break has occurred if the filtered and squared rate of change is greater than or equal to the predetermined threshold value. 7. The method of claim 1, wherein the step of determining that a shaft break has occurred comprises:
calculating a square of the rate of change of rotational speed difference; filtering the square of the rate of change of rotational speed difference through a first first-order lag filter to provide a squared and filtered rate of change; filtering the rate of change of rotational speed difference through a second first-order lag filter to provide a filtered rate of change; calculating a square of the filtered rate of change to provide a filtered and squared rate of change; subtracting the filtered and squared rate of change from the squared and filtered rate of change to provide a variance value; comparing the variance value to a predetermined threshold value; and determining that the shaft break has occurred if the variance value is greater than or equal to the predetermined threshold value. 8. The method of claim 1, further comprising:
correcting sensed fan rotational speed and the sensed turbine engine rotational speed for at least one of temperature and pressure. 9. The method of claim 1, wherein the step of determining the rate of change of rotational speed difference comprises:
determining, in the processor, fan rotational speed rate of change; determining, in the processor, turbine engine rotational speed rate of change; and subtracting, in the processor, the turbine engine rotational speed rate of change from the fan rotational speed rate of change. 10. The method of claim 9, further comprising:
correcting the fan rotational speed rate of change and the turbine engine rotational speed rate of change for at least one of temperature and pressure. 11. A turbofan gas turbine engine shaft break detection system for a turbofan engine that includes at least a fan and a turbine, the system comprising:
a fan rotational speed sensor configured to sense fan rotational speed and supply a fan rotational speed signal representative thereof; a turbine engine rotational engine speed sensor configured to sense turbine engine rotational speed and supply a turbine engine rotational speed signal representative thereof; a processor coupled to receive the fan rotational speed signal and the turbine engine rotational speed signal and configured, upon receipt thereof, to:
determine a rate of change of rotational speed difference between the sensed fan rotational speed and the sensed turbine engine rotational speed; and
determine that a shaft break has occurred based at least in part on the rate of change of the rotational speed difference. 12. The system of claim 11, wherein the processor is configured to determine the rate of change of rotational speed difference by:
subtracting, in the processor, the sensed turbine engine rotational speed from the sensed fan rotational speed to determine a rotational speed difference; and determining, in the processor, the rate of change of rotational speed difference. 13. The system of claim 12, wherein the processor is configured to determine that a shaft break has occurred by:
comparing the rate of change of rotational speed difference to a predetermined threshold value; and determining that the shaft break has occurred if the rate of change of rotational speed difference is less than or equal to the predetermined threshold value. 14. The system of claim 12, wherein the processor is configured to determine the rate of change of rotational speed difference by filtering the rotational speed difference through a first-order high-pass filter. 15. The system of claim 11, wherein the processor is configured to determine that a shaft break has occurred by:
calculating a square of the rate of change of rotational speed difference; filtering the square of the rate of change of rotational speed difference through a first-order lag filter to provide a squared and filtered rate of change; comparing the squared and filtered rate of change to a predetermined threshold value; and determining that the shaft break has occurred if the squared and filtered rate of change is greater than or equal to the predetermined threshold value. 16. The system of claim 1, wherein the processor is configured to determine that a shaft break has occurred by:
filtering the rate of change of rotational speed difference through a first-order lag filter to provide a filtered rate of change; calculating a square of the filtered rate of change to provide a filtered and squared rate of change; comparing the filtered and squared rate of change to a predetermined threshold value; and determining that the shaft break has occurred if the filtered and squared rate of change is greater than or equal to the predetermined threshold value. 17. The system of claim 11, wherein the processor is configured to determine that a shaft break has occurred by:
calculating a square of the rate of change of rotational speed difference; filtering the square of the rate of change of rotational speed difference through a first first-order lag filter to provide a squared and filtered rate of change; filtering the rate of change of rotational speed difference through a second first-order lag filter to provide a filtered rate of change; calculating a square of the filtered rate of change to provide a filtered and squared rate of change; subtracting the filtered and squared rate of change from the squared and filtered rate of change to provide a variance value; comparing the variance value to a predetermined threshold value; and determining that the shaft break has occurred if the variance value is greater than or equal to the predetermined threshold value. 18. The system of claim 1, wherein the processor is further configured to correct sensed fan rotational speed and the sensed turbine engine rotational speed for at least one of temperature and pressure. 19. The system of claim 11, wherein the processor is configured to determine the rate of change of rotational speed difference by:
determining, in the processor, fan rotational speed rate of change; determining, in the processor, turbine engine rotational speed rate of change; and subtracting, in the processor, the turbine engine rotational speed rate of change from the fan rotational speed rate of change. 20. The system of claim 19, wherein the processor is further configured to correct the fan rotational speed rate of change and the turbine engine rotational speed rate of change for at least one of temperature and pressure. | 2,800 |
11,542 | 11,542 | 15,462,881 | 2,811 | In a described example, an integrated circuit (IC) package includes an IC die disposed on a die attach pad; a plurality of leads electrically connected to terminals on the IC die, the leads including a base metal; and molding compound material encapsulating portions of the IC die, the die attach pads, and the plurality of leads; the plurality of leads having a solder joint reinforcement tab. The solder joint reinforcement tabs include a first side, a second side opposite to the first side, a third side, a fourth side opposite to and in parallel to the third side, a fifth side forming an end portion of the solder joint reinforcement tab, the solder joint reinforcement tabs including a solderable metal layer on the second, third and fourth sides and on portions of the fifth side. | 1. An integrated circuit (IC) package, comprising:
an IC die disposed on a die attach pad; a plurality of leads electrically connected to terminals on the IC die, each of the plurality of leads including a base metal; and molding compound material covering portions of the IC die, the die attach pad, and the plurality of leads; the plurality of leads including a solder joint reinforcement tab extending from a periphery of the IC package, the solder joint reinforcement tab including a first side extending longitudinally in a first direction, a second side opposite to and in parallel to the first side, a third side that is oriented in a second direction perpendicular to the first direction, a fourth side opposite to and in parallel to the third side, a fifth side forming an end portion of the solder joint reinforcement tab, the solder joint reinforcement tab including a solderable metal layer on the second, third and fourth sides and on portions of the fifth side. 2. The IC package of claim 1, in which the IC package is one selected from a Small Outline No-Lead (SON) package and a Quad Flat No-Lead (QFN) package. 3. The IC package of claim 1, in which the solder joint reinforcement tabs include lead frame material extending outward from the periphery of IC package. 4. The IC package of claim 1, in which the solder joint reinforcement tabs include the solderable metal layer including at least one selected from nickel, gold, palladium, and alloys thereof. 5. The IC package of claim 1, in which the solder joint reinforcement tabs have a thickness in a range of about 30 μm to 50 μm. 6. The IC package of claim 1, in which the solder joint reinforcement tabs have a length extending from the periphery of the IC package in a range of about 30 μm to 70 μm. 7. The IC package of claim 1, in which a portion of the solder joint reinforcement tabs projects horizontally outward from a base of the IC package. 8. The IC package of claim 1, in which a portion of the solder joint reinforcement tabs projects outward from the base of the IC package and extends alongside a vertical sidewall of the IC package. 9. An integrated circuit (IC) package, comprising:
molding compound covering portions of an IC die attached to a die pad, leads formed from lead frame material, and electrical connections formed between terminals of the IC die and the leads formed from lead frame material; and a solder joint reinforcement tab that projects outward from one of the leads beyond a periphery of the IC package, in which the solder joint reinforcement tab has a first side longitudinally oriented in a first direction, a second side opposite to and in parallel with the first side, a third side oriented in a second direction perpendicular to the first side, a fourth side opposite to and in parallel with the third side, and a fifth side forming an end portion of the solder joint reinforcement tab, and the solder joint reinforcement tab includes a lead frame base metal with a solderable metal layer on the second, third, and fourth sides and a portion of the fifth side. 10. The IC package of claim 9, in which the solder joint reinforcement tab includes saw street lead frame material. 11. The IC package of claim 9, in which the solder joint reinforcement tab includes the solderable metal layer that is one selected from: a layer of nickel, a layer of gold, a layer of palladium, and a layer of nickel plus a layer of palladium. 12. The IC package of claim 9, in which the solder joint reinforcement tab has a thickness in a range of about 30 μm to 50 μm. 13. The IC package of claim 9, in which the solder joint reinforcement tab has a length extending longitudinally in the first direction from a periphery of the IC package of about 30 μm to 70 μm. 14. The IC package of claim 9, in which the solder joint reinforcement tab projects horizontally from a base of the IC package. 15. The IC package of claim 9, in which the solder joint reinforcement tab extends alongside a vertical sidewall of the IC package. 16. A method for forming an integrated circuit (IC) package, comprising:
providing an embedded lead frame strip of lead frame material having a first side and a second side opposite the first side with integrated circuit (IC) dies attached to the first side of the lead frame strip and encapsulated in molding compound material, the integrated circuit dies spaced apart by saw street regions; from the first side of the embedded lead frame strip, in a saw street between ones of the IC dies, making a first cut of a first width through the molding compound and into the first side of the lead frame strip, leaving a thin band of the lead frame material and molding compound material in the saw street between adjacent IC dies; making a second cut of a second width less than the first width through the thin band of the lead frame material and molding compound material in the saw street to form a ledge of saw street material comprised of a plurality of solder joint reinforcement tabs separated by molding compound material; and removing the molding compound material from between the solder joint reinforcement tabs. 17. The method of claim 16, in which the thin band of the lead frame material and molding compound material has a thickness in a range of 30 μm to 50 μm. 18. The method of claim 16, in which the solder joint reinforcement tabs have a length extending longitudinally in a first direction from a periphery of the IC package in a range of about 30 μm to 70 μm, and the solder joint reinforcement tabs have a first side oriented in the first direction, a second side opposite to and in parallel with the first side, a third side oriented in a second direction perpendicular to the first side, a fourth side opposite to and in parallel with the third side, and a fifth side forming an end portion of the solder joint reinforcement tab, the second side, third side and the fourth side being covered by a solderable metal layer, and the fifth side being partially covered by the solderable metal layer. 19. The method of claim 18, further including bending the solder joint reinforcement tabs into a vertical orientation against a side of the molding compound of the packaged integrated circuit. 20. The method of claim 16, in which the packaged integrated circuit is a Quad Flat No Lead (QFN) packaged integrated circuit. | In a described example, an integrated circuit (IC) package includes an IC die disposed on a die attach pad; a plurality of leads electrically connected to terminals on the IC die, the leads including a base metal; and molding compound material encapsulating portions of the IC die, the die attach pads, and the plurality of leads; the plurality of leads having a solder joint reinforcement tab. The solder joint reinforcement tabs include a first side, a second side opposite to the first side, a third side, a fourth side opposite to and in parallel to the third side, a fifth side forming an end portion of the solder joint reinforcement tab, the solder joint reinforcement tabs including a solderable metal layer on the second, third and fourth sides and on portions of the fifth side.1. An integrated circuit (IC) package, comprising:
an IC die disposed on a die attach pad; a plurality of leads electrically connected to terminals on the IC die, each of the plurality of leads including a base metal; and molding compound material covering portions of the IC die, the die attach pad, and the plurality of leads; the plurality of leads including a solder joint reinforcement tab extending from a periphery of the IC package, the solder joint reinforcement tab including a first side extending longitudinally in a first direction, a second side opposite to and in parallel to the first side, a third side that is oriented in a second direction perpendicular to the first direction, a fourth side opposite to and in parallel to the third side, a fifth side forming an end portion of the solder joint reinforcement tab, the solder joint reinforcement tab including a solderable metal layer on the second, third and fourth sides and on portions of the fifth side. 2. The IC package of claim 1, in which the IC package is one selected from a Small Outline No-Lead (SON) package and a Quad Flat No-Lead (QFN) package. 3. The IC package of claim 1, in which the solder joint reinforcement tabs include lead frame material extending outward from the periphery of IC package. 4. The IC package of claim 1, in which the solder joint reinforcement tabs include the solderable metal layer including at least one selected from nickel, gold, palladium, and alloys thereof. 5. The IC package of claim 1, in which the solder joint reinforcement tabs have a thickness in a range of about 30 μm to 50 μm. 6. The IC package of claim 1, in which the solder joint reinforcement tabs have a length extending from the periphery of the IC package in a range of about 30 μm to 70 μm. 7. The IC package of claim 1, in which a portion of the solder joint reinforcement tabs projects horizontally outward from a base of the IC package. 8. The IC package of claim 1, in which a portion of the solder joint reinforcement tabs projects outward from the base of the IC package and extends alongside a vertical sidewall of the IC package. 9. An integrated circuit (IC) package, comprising:
molding compound covering portions of an IC die attached to a die pad, leads formed from lead frame material, and electrical connections formed between terminals of the IC die and the leads formed from lead frame material; and a solder joint reinforcement tab that projects outward from one of the leads beyond a periphery of the IC package, in which the solder joint reinforcement tab has a first side longitudinally oriented in a first direction, a second side opposite to and in parallel with the first side, a third side oriented in a second direction perpendicular to the first side, a fourth side opposite to and in parallel with the third side, and a fifth side forming an end portion of the solder joint reinforcement tab, and the solder joint reinforcement tab includes a lead frame base metal with a solderable metal layer on the second, third, and fourth sides and a portion of the fifth side. 10. The IC package of claim 9, in which the solder joint reinforcement tab includes saw street lead frame material. 11. The IC package of claim 9, in which the solder joint reinforcement tab includes the solderable metal layer that is one selected from: a layer of nickel, a layer of gold, a layer of palladium, and a layer of nickel plus a layer of palladium. 12. The IC package of claim 9, in which the solder joint reinforcement tab has a thickness in a range of about 30 μm to 50 μm. 13. The IC package of claim 9, in which the solder joint reinforcement tab has a length extending longitudinally in the first direction from a periphery of the IC package of about 30 μm to 70 μm. 14. The IC package of claim 9, in which the solder joint reinforcement tab projects horizontally from a base of the IC package. 15. The IC package of claim 9, in which the solder joint reinforcement tab extends alongside a vertical sidewall of the IC package. 16. A method for forming an integrated circuit (IC) package, comprising:
providing an embedded lead frame strip of lead frame material having a first side and a second side opposite the first side with integrated circuit (IC) dies attached to the first side of the lead frame strip and encapsulated in molding compound material, the integrated circuit dies spaced apart by saw street regions; from the first side of the embedded lead frame strip, in a saw street between ones of the IC dies, making a first cut of a first width through the molding compound and into the first side of the lead frame strip, leaving a thin band of the lead frame material and molding compound material in the saw street between adjacent IC dies; making a second cut of a second width less than the first width through the thin band of the lead frame material and molding compound material in the saw street to form a ledge of saw street material comprised of a plurality of solder joint reinforcement tabs separated by molding compound material; and removing the molding compound material from between the solder joint reinforcement tabs. 17. The method of claim 16, in which the thin band of the lead frame material and molding compound material has a thickness in a range of 30 μm to 50 μm. 18. The method of claim 16, in which the solder joint reinforcement tabs have a length extending longitudinally in a first direction from a periphery of the IC package in a range of about 30 μm to 70 μm, and the solder joint reinforcement tabs have a first side oriented in the first direction, a second side opposite to and in parallel with the first side, a third side oriented in a second direction perpendicular to the first side, a fourth side opposite to and in parallel with the third side, and a fifth side forming an end portion of the solder joint reinforcement tab, the second side, third side and the fourth side being covered by a solderable metal layer, and the fifth side being partially covered by the solderable metal layer. 19. The method of claim 18, further including bending the solder joint reinforcement tabs into a vertical orientation against a side of the molding compound of the packaged integrated circuit. 20. The method of claim 16, in which the packaged integrated circuit is a Quad Flat No Lead (QFN) packaged integrated circuit. | 2,800 |
11,543 | 11,543 | 13,745,714 | 2,862 | A pedometer with a three-axis accelerometer provides reliable step counts while worn on the wrist. Three-axis accelerometer data is combined into a single combined data stream. Each positive slope region around an inflection point in the combined data stream that has positive slope, a magnitude that exceeds an amplitude threshold value and that spans a time period that exceeds a time threshold value is identified. Each negative slope region around an inflection point in the combined data stream that has negative slope, a magnitude that exceeds an amplitude threshold value and that spans a time period that exceeds a time threshold value is identified. A step count is incremented for each occurrence of an identified positive slope region that is separated by an identified negative slope region as a step. | 1. A device for counting steps, the device comprising:
a three-axis accelerometer; and a processor coupled to receive three-axis data from the three-axis accelerometer; wherein the processor is configured to determine a number of steps taken by a user of the device by:
combining the three-axis data into a single combined data stream;
identifying each positive slope region around an inflection point in the combined data stream having a time period that exceeds a time threshold value, a positive slope, and a magnitude that exceeds an amplitude threshold value;
identifying each negative slope region around an inflection point in the combined data stream having a time period that exceeds a time threshold value, a negative slope, and a magnitude that exceeds an amplitude threshold value; and
counting each occurrence of an identified positive slope region that is separated by an identified negative slope region as a step. 2. The device of claim 1, wherein the processor is further configured to store the three axis data in three circular buffers, and to iteratively perform a finite impulse response (FIR) polynomial filter operation on the three axis data in each of the three circular buffers. 3. The device of claim 1, further comprising a transmitter coupled to the processor configured to transmit step information to a remote display device. 4. A method for counting steps using a three-axis accelerometer, the method comprising:
receiving three-axis data from the three-axis accelerometer; combining the three-axis data into a single combined data stream; identifying each positive slope region around an inflection point in the combined data stream having a time period that exceeds a time threshold value, a positive slope, and a magnitude that exceeds an amplitude threshold value; identifying each negative slope region around an inflection point in the combined data stream having a time period that exceeds a time threshold value, a negative slope, and a magnitude that exceeds an amplitude threshold value; incrementing a step count for each occurrence of an identified positive slope region that is separated by an identified negative slope region as a step; and displaying the step count. 5. The method of claim 4, wherein the three axis data is received into three circular buffers, the method further comprises filtering the three-axis data in an iterative manner using a finite impulse response (FIR) polynomial filter operation on each axis of data in the three circular buffers. 6. A device for counting steps using a device worn by a user, the device comprising:
means for receiving three-axis data from a three-axis accelerometer in the device; means for combining the three-axis data into a single combined data stream; means for identifying each positive slope region around an inflection point in the combined data stream having a time period that exceeds a time threshold value, a positive slope, and a magnitude that exceeds an amplitude threshold value; means for identifying each negative slope region around an inflection point in the combined data stream having a time period that exceeds a time threshold value, a negative slope, and a magnitude that exceeds an amplitude threshold value; means for incrementing a step count for each occurrence of an identified positive slope region that is separated by an identified negative slope region as a step; and means for displaying the step count. 7. The device of claim 6, further comprising means for filtering the three-axis data in an iterative manner using a finite impulse response (FIR) polynomial filter operation on each axis of data. | A pedometer with a three-axis accelerometer provides reliable step counts while worn on the wrist. Three-axis accelerometer data is combined into a single combined data stream. Each positive slope region around an inflection point in the combined data stream that has positive slope, a magnitude that exceeds an amplitude threshold value and that spans a time period that exceeds a time threshold value is identified. Each negative slope region around an inflection point in the combined data stream that has negative slope, a magnitude that exceeds an amplitude threshold value and that spans a time period that exceeds a time threshold value is identified. A step count is incremented for each occurrence of an identified positive slope region that is separated by an identified negative slope region as a step.1. A device for counting steps, the device comprising:
a three-axis accelerometer; and a processor coupled to receive three-axis data from the three-axis accelerometer; wherein the processor is configured to determine a number of steps taken by a user of the device by:
combining the three-axis data into a single combined data stream;
identifying each positive slope region around an inflection point in the combined data stream having a time period that exceeds a time threshold value, a positive slope, and a magnitude that exceeds an amplitude threshold value;
identifying each negative slope region around an inflection point in the combined data stream having a time period that exceeds a time threshold value, a negative slope, and a magnitude that exceeds an amplitude threshold value; and
counting each occurrence of an identified positive slope region that is separated by an identified negative slope region as a step. 2. The device of claim 1, wherein the processor is further configured to store the three axis data in three circular buffers, and to iteratively perform a finite impulse response (FIR) polynomial filter operation on the three axis data in each of the three circular buffers. 3. The device of claim 1, further comprising a transmitter coupled to the processor configured to transmit step information to a remote display device. 4. A method for counting steps using a three-axis accelerometer, the method comprising:
receiving three-axis data from the three-axis accelerometer; combining the three-axis data into a single combined data stream; identifying each positive slope region around an inflection point in the combined data stream having a time period that exceeds a time threshold value, a positive slope, and a magnitude that exceeds an amplitude threshold value; identifying each negative slope region around an inflection point in the combined data stream having a time period that exceeds a time threshold value, a negative slope, and a magnitude that exceeds an amplitude threshold value; incrementing a step count for each occurrence of an identified positive slope region that is separated by an identified negative slope region as a step; and displaying the step count. 5. The method of claim 4, wherein the three axis data is received into three circular buffers, the method further comprises filtering the three-axis data in an iterative manner using a finite impulse response (FIR) polynomial filter operation on each axis of data in the three circular buffers. 6. A device for counting steps using a device worn by a user, the device comprising:
means for receiving three-axis data from a three-axis accelerometer in the device; means for combining the three-axis data into a single combined data stream; means for identifying each positive slope region around an inflection point in the combined data stream having a time period that exceeds a time threshold value, a positive slope, and a magnitude that exceeds an amplitude threshold value; means for identifying each negative slope region around an inflection point in the combined data stream having a time period that exceeds a time threshold value, a negative slope, and a magnitude that exceeds an amplitude threshold value; means for incrementing a step count for each occurrence of an identified positive slope region that is separated by an identified negative slope region as a step; and means for displaying the step count. 7. The device of claim 6, further comprising means for filtering the three-axis data in an iterative manner using a finite impulse response (FIR) polynomial filter operation on each axis of data. | 2,800 |
11,544 | 11,544 | 15,106,011 | 2,847 | A transmission cable includes a conductor or a bundle of conductors extending along a longitudinal axis, which is circumferentially covered by an insulation layer having an extruded insulation material, whereby the transmission cable passes the electrical type test as specified in Cigré TB496, whereby the rated voltage U 0 is 450 kV or more. The type test includes subjecting the power cable to a DC voltage of 1.85*U 0 during 10 to 15 cycles at negative polarity, followed by a polarity reversal with another 10 to 15 cycles at positive polarity at a DC voltage of 1.85*U 0 , followed by additional 2 to 5 cycles during at least 4 to 10 days at positive polarity, and wherein U 0 is 450 kV, or 525 kV, or more. | 1. A transmission cable comprises a conductor or a bundle of conductors extending along a longitudinal axis, which is circumferentially covered by an insulation layer comprising an extruded insulation material, wherein the extruded insulation material comprises a crosslinked polymer composition, which is obtained by crosslinking a polymer composition, which polymer comprises a polyolefin, peroxide and sulphur containing antioxidant, wherein the crosslinked polymer composition has an Oxidation Induction Time, determined according to ASTM-D3895, ISO/CD 11357 and EN 728 using a Differential Scanning Calorimeter (DSC), which Oxidation Induction Time corresponds to Z minutes, and comprises an amount of peroxide by-products which corresponds to W ppm determined according to BTM2222 using HPLC, wherein
Z 1 ≦Z≦Z 2 , W 1 ≦W≦W 2, and W≦p−270*Z, wherein Z1 is 0, Z2 is 60, W1 is 0 and W2 is 9500, and p is 18500 and wherein the crosslinked polymer composition does not comprise 2,4-diphenyl-4-methyl-1-pentene and whereby the transmission cable passes the electrical type test as specified in Cigré TB496, whereby the rated voltage U0 is 450 kV, or more. 2. The transmission cable according to claim 1 comprising concentrically arranged:
an inner electrical conductor,
a first semiconducting layer circumferentially covering the conductor,
a layer of electrical insulation layer comprising the extruded insulation material circumferentially covering the first semiconducting layer,
a second semiconducting layer circumferentially covering the first layer of polymer-based electrical insulator, and
optionally a jacketing layer and armor covering the outer wall of the second semiconducting layer,
whereby the transmission cable passes the electrical type test as specified in Cigré TB496, whereby the rated voltage U0 is 450 kV, or more. 3. The transmission cable according to claim 1, wherein the type test comprises subjecting the transmission cable to a DC voltage of substantially 1.85*U0 for at least 30 days, and wherein U0 is 450 kV, or more. 4. The transmission cable according to claim 1, wherein the type test comprises subjecting the transmission cable to a DC voltage of 1.85*U0 during 5 to 25 cycles at negative polarity, followed by a polarity reversal with another 5 to 25 cycles at positive polarity at a DC voltage of 1.85*U0, followed by additional 2 to 15 cycles during at least 4 to 15 days at positive polarity, and wherein U0 is 450 kV, or more. 5. The transmission cable according to claim 1, wherein U0 is 450 kV, or above. 6. The transmission cable according to claim 1, wherein U0 is 525 kV, or more. 7. The transmission cable according to claim 1, wherein the conductivity of the extruded insulation material at 30 kV/mm and 70° C. is between 0.01 and 60 fS/m. 8. The transmission cable according to claim 1, wherein Z1 is 2, Z2 is 20, W2 is 9000, and p is 16000. 9. An extruded insulation material circumferentially covering the transmission cable of claim 1. | A transmission cable includes a conductor or a bundle of conductors extending along a longitudinal axis, which is circumferentially covered by an insulation layer having an extruded insulation material, whereby the transmission cable passes the electrical type test as specified in Cigré TB496, whereby the rated voltage U 0 is 450 kV or more. The type test includes subjecting the power cable to a DC voltage of 1.85*U 0 during 10 to 15 cycles at negative polarity, followed by a polarity reversal with another 10 to 15 cycles at positive polarity at a DC voltage of 1.85*U 0 , followed by additional 2 to 5 cycles during at least 4 to 10 days at positive polarity, and wherein U 0 is 450 kV, or 525 kV, or more.1. A transmission cable comprises a conductor or a bundle of conductors extending along a longitudinal axis, which is circumferentially covered by an insulation layer comprising an extruded insulation material, wherein the extruded insulation material comprises a crosslinked polymer composition, which is obtained by crosslinking a polymer composition, which polymer comprises a polyolefin, peroxide and sulphur containing antioxidant, wherein the crosslinked polymer composition has an Oxidation Induction Time, determined according to ASTM-D3895, ISO/CD 11357 and EN 728 using a Differential Scanning Calorimeter (DSC), which Oxidation Induction Time corresponds to Z minutes, and comprises an amount of peroxide by-products which corresponds to W ppm determined according to BTM2222 using HPLC, wherein
Z 1 ≦Z≦Z 2 , W 1 ≦W≦W 2, and W≦p−270*Z, wherein Z1 is 0, Z2 is 60, W1 is 0 and W2 is 9500, and p is 18500 and wherein the crosslinked polymer composition does not comprise 2,4-diphenyl-4-methyl-1-pentene and whereby the transmission cable passes the electrical type test as specified in Cigré TB496, whereby the rated voltage U0 is 450 kV, or more. 2. The transmission cable according to claim 1 comprising concentrically arranged:
an inner electrical conductor,
a first semiconducting layer circumferentially covering the conductor,
a layer of electrical insulation layer comprising the extruded insulation material circumferentially covering the first semiconducting layer,
a second semiconducting layer circumferentially covering the first layer of polymer-based electrical insulator, and
optionally a jacketing layer and armor covering the outer wall of the second semiconducting layer,
whereby the transmission cable passes the electrical type test as specified in Cigré TB496, whereby the rated voltage U0 is 450 kV, or more. 3. The transmission cable according to claim 1, wherein the type test comprises subjecting the transmission cable to a DC voltage of substantially 1.85*U0 for at least 30 days, and wherein U0 is 450 kV, or more. 4. The transmission cable according to claim 1, wherein the type test comprises subjecting the transmission cable to a DC voltage of 1.85*U0 during 5 to 25 cycles at negative polarity, followed by a polarity reversal with another 5 to 25 cycles at positive polarity at a DC voltage of 1.85*U0, followed by additional 2 to 15 cycles during at least 4 to 15 days at positive polarity, and wherein U0 is 450 kV, or more. 5. The transmission cable according to claim 1, wherein U0 is 450 kV, or above. 6. The transmission cable according to claim 1, wherein U0 is 525 kV, or more. 7. The transmission cable according to claim 1, wherein the conductivity of the extruded insulation material at 30 kV/mm and 70° C. is between 0.01 and 60 fS/m. 8. The transmission cable according to claim 1, wherein Z1 is 2, Z2 is 20, W2 is 9000, and p is 16000. 9. An extruded insulation material circumferentially covering the transmission cable of claim 1. | 2,800 |
11,545 | 11,545 | 15,819,142 | 2,831 | An electrical connector includes a unitary base elongated along a longitudinal direction. A first tongue extends forwardly from the base and has a uniform thickness along the longitudinal direction. The first tongue comprises a plurality of spaced apart first contacts. A second tongue extends forwardly from the base and comprises a plurality of spaced apart second contacts. The first and second tongues define a gap therebetween that extends from a front edge of one of the first and second tongues toward the unitary base. | 1. An electrical connector comprising a unitary insulative housing defining an elongated slot bound by opposing first and second major surfaces and comprising a blade extending from a back surface of the slot toward a front of the slot and disposed between and spaced apart from the first and second major surfaces, a first plurality of contacts disposed on the first major surface and facing the blade, a second plurality of contacts disposed on the second major surface and facing the blade. 2. The electrical connector of claim 1, wherein the blade does not carry any contacts. | An electrical connector includes a unitary base elongated along a longitudinal direction. A first tongue extends forwardly from the base and has a uniform thickness along the longitudinal direction. The first tongue comprises a plurality of spaced apart first contacts. A second tongue extends forwardly from the base and comprises a plurality of spaced apart second contacts. The first and second tongues define a gap therebetween that extends from a front edge of one of the first and second tongues toward the unitary base.1. An electrical connector comprising a unitary insulative housing defining an elongated slot bound by opposing first and second major surfaces and comprising a blade extending from a back surface of the slot toward a front of the slot and disposed between and spaced apart from the first and second major surfaces, a first plurality of contacts disposed on the first major surface and facing the blade, a second plurality of contacts disposed on the second major surface and facing the blade. 2. The electrical connector of claim 1, wherein the blade does not carry any contacts. | 2,800 |
11,546 | 11,546 | 15,162,115 | 2,894 | A device includes an epitaxially grown crystalline material within an area confined by an insulator. A surface of the crystalline material has a reduced roughness. One example includes obtaining a surface with reduced roughness by creating process parameters which result in the dominant growth component of the crystal to be supplied laterally from side walls of the insulator. In a preferred embodiment, the area confined by the insulator is an opening in the insulator having an aspect ratio sufficient to trap defects using an ART technique. | 1. A semiconductor structure comprising:
a trench having at least two sidewalls, an insulating layer formed on said at least two sidewalls, the trench having a bottom formed of a crystalline substrate; and an epitaxial crystalline material within the trench, the crystalline material being lattice-mismatched with the crystalline substrate and having a top surface with a root mean square surface roughness of 5 nm or less, the top surface of the crystalline material being a distinct surface from sidewalls of the crystalline material, the top surface of the crystalline material having a facet. 2. The semiconductor structure of claim 1, wherein the facet extends from one of said at least two sidewalls to another of said at least two sidewalls. 3. The semiconductor structure of claim 1, wherein the top surface has multiple facets extending from one of said at least two sidewalls to another of said at least two sidewalls. 4. The semiconductor structure of claim 1, wherein the insulating layer is a substantially planar layer formed atop the crystalline substrate. 5. The semiconductor structure of claim 1, wherein the insulating layer is a conformal layer extending into recesses formed within the crystalline substrate. 6. The semiconductor structure of claim 1, wherein the trench has an aspect ratio of at least one. 7. The semiconductor structure of claim 1, wherein the insulating layer is an oxide. 8. The semiconductor structure of claim 1, wherein the crystalline material comprises a material selected from the group consisting essentially of a group IV element or alloy, a group III-V compound, a group III-N compound, a group II-VI compound, and a combination thereof. 9. The semiconductor structure of claim 1, wherein the top surface of the crystalline material has a root mean square surface roughness of 3 nm or less. 10. The semiconductor structure of claim 1, wherein the top surface of the crystalline material has a root mean square surface roughness of about 1 nm or less. 11. The semiconductor structure of claim 1, wherein the top surface of the crystalline material has a root mean square surface roughness of no greater than 0.55 nm. 12. A structure comprising:
an insulator having an opening to a crystalline substrate, the opening being defined by non-crystalline sidewalls, the non-crystalline sidewalls including a first non-crystalline sidewall and a second non-crystalline sidewall; and a crystalline material within the opening of the insulator, the crystalline material being lattice-mismatched with the crystalline substrate, the crystalline material having a top surface with a root mean square surface roughness of 5 nm or less, the top surface of the crystalline material extending from the first non-crystalline sidewall to the second non-crystalline sidewall. 13. The structure of claim 12, wherein the top surface of the crystalline material comprises a facet. 14. The structure of claim 13, wherein the facet extends from the first non-crystalline sidewall to the second non-crystalline sidewall. 15. The structure of claim 13, wherein the top surface has multiple facets extending from the first non-crystalline sidewall to the second non-crystalline sidewall. 16. The structure of claim 12, wherein an aspect ratio of the opening is one or greater. 17. The structure of claim 12, wherein a width of the opening is one of 400 nm or less. 18. The structure of claim 12 further comprising:
an additional crystalline material grown upon the top surface of the crystalline material. 19. A structure comprising:
a confined area on a substrate, the confined area defined by an opening to the substrate, the opening having a sidewall comprising an oxide material; and a first crystalline material on the confined area of the substrate, the first crystalline material having a top surface with a root mean square surface roughness of 5 nm or less, the top surface extending from a first sidewall of the first crystalline material to a second sidewall of the first crystalline material, at least one of the first and second sidewalls of the first crystalline material being parallel to the sidewall of the oxide material. 20. The structure of claim 19, wherein the substrate comprises a second crystalline material, the confined area comprising the second crystalline material, the second crystalline material being lattice mismatched to the first crystalline material. | A device includes an epitaxially grown crystalline material within an area confined by an insulator. A surface of the crystalline material has a reduced roughness. One example includes obtaining a surface with reduced roughness by creating process parameters which result in the dominant growth component of the crystal to be supplied laterally from side walls of the insulator. In a preferred embodiment, the area confined by the insulator is an opening in the insulator having an aspect ratio sufficient to trap defects using an ART technique.1. A semiconductor structure comprising:
a trench having at least two sidewalls, an insulating layer formed on said at least two sidewalls, the trench having a bottom formed of a crystalline substrate; and an epitaxial crystalline material within the trench, the crystalline material being lattice-mismatched with the crystalline substrate and having a top surface with a root mean square surface roughness of 5 nm or less, the top surface of the crystalline material being a distinct surface from sidewalls of the crystalline material, the top surface of the crystalline material having a facet. 2. The semiconductor structure of claim 1, wherein the facet extends from one of said at least two sidewalls to another of said at least two sidewalls. 3. The semiconductor structure of claim 1, wherein the top surface has multiple facets extending from one of said at least two sidewalls to another of said at least two sidewalls. 4. The semiconductor structure of claim 1, wherein the insulating layer is a substantially planar layer formed atop the crystalline substrate. 5. The semiconductor structure of claim 1, wherein the insulating layer is a conformal layer extending into recesses formed within the crystalline substrate. 6. The semiconductor structure of claim 1, wherein the trench has an aspect ratio of at least one. 7. The semiconductor structure of claim 1, wherein the insulating layer is an oxide. 8. The semiconductor structure of claim 1, wherein the crystalline material comprises a material selected from the group consisting essentially of a group IV element or alloy, a group III-V compound, a group III-N compound, a group II-VI compound, and a combination thereof. 9. The semiconductor structure of claim 1, wherein the top surface of the crystalline material has a root mean square surface roughness of 3 nm or less. 10. The semiconductor structure of claim 1, wherein the top surface of the crystalline material has a root mean square surface roughness of about 1 nm or less. 11. The semiconductor structure of claim 1, wherein the top surface of the crystalline material has a root mean square surface roughness of no greater than 0.55 nm. 12. A structure comprising:
an insulator having an opening to a crystalline substrate, the opening being defined by non-crystalline sidewalls, the non-crystalline sidewalls including a first non-crystalline sidewall and a second non-crystalline sidewall; and a crystalline material within the opening of the insulator, the crystalline material being lattice-mismatched with the crystalline substrate, the crystalline material having a top surface with a root mean square surface roughness of 5 nm or less, the top surface of the crystalline material extending from the first non-crystalline sidewall to the second non-crystalline sidewall. 13. The structure of claim 12, wherein the top surface of the crystalline material comprises a facet. 14. The structure of claim 13, wherein the facet extends from the first non-crystalline sidewall to the second non-crystalline sidewall. 15. The structure of claim 13, wherein the top surface has multiple facets extending from the first non-crystalline sidewall to the second non-crystalline sidewall. 16. The structure of claim 12, wherein an aspect ratio of the opening is one or greater. 17. The structure of claim 12, wherein a width of the opening is one of 400 nm or less. 18. The structure of claim 12 further comprising:
an additional crystalline material grown upon the top surface of the crystalline material. 19. A structure comprising:
a confined area on a substrate, the confined area defined by an opening to the substrate, the opening having a sidewall comprising an oxide material; and a first crystalline material on the confined area of the substrate, the first crystalline material having a top surface with a root mean square surface roughness of 5 nm or less, the top surface extending from a first sidewall of the first crystalline material to a second sidewall of the first crystalline material, at least one of the first and second sidewalls of the first crystalline material being parallel to the sidewall of the oxide material. 20. The structure of claim 19, wherein the substrate comprises a second crystalline material, the confined area comprising the second crystalline material, the second crystalline material being lattice mismatched to the first crystalline material. | 2,800 |
11,547 | 11,547 | 15,137,048 | 2,883 | An apparatus includes one or more optical waveguides, one or more first micro-lenses, and one or more second micro-lenses. The one or more optical waveguides are formed in a substrate and are configured to convey respective optical signals between first ends and second ends of the optical waveguides. The one or more first micro-lenses are disposed on the respective first ends of the optical waveguides and are configured to couple the optical signals between the first ends and respective first optical elements. The one or more second micro-lenses are disposed on the respective second ends of the optical waveguides and are configured to couple the optical signals between the second ends and respective second optical elements. | 1. An optical interconnect to direct optical signals between first and second ferrules of optical fibers, comprising:
a substrate; a first optical interface, configured to connect to the first ferrule of optical fibers, located on a first face of the substrate; a second optical interface, configured to connect to the second ferrule of optical fibers, located on a second face of the substrate; a plurality of optical waveguides, which are formed in the substrate and are configured to convey respective optical signals between the first optical interface and the second optical interface; one or more first micro-lenses, which are disposed on respective first ends of the optical waveguides and are configured to couple the optical signals between the first ends and the first ferrule; and one or more second micro-lenses, which are disposed on respective second ends of the optical waveguides and are configured to couple the optical signals between the second ends and the second ferrule, wherein each of the plurality of waveguides includes at least one horizontal bend and wherein the at least one horizontal bends of the plurality of waveguides are included in a single plane. 2. The optical interconnect according to claim 1, wherein the first micro-lenses are disposed on a face of the substrate, and wherein the first ends of the optical waveguides terminate at a predefined distance from the face of the substrate, opposite the first micro-lenses. 3. The optical interconnect according to claim 1, and comprising a mechanical fixture that fixes the first optical elements at a predefined distance from the respective first micro-lenses, so as to form an air gap between the first optical elements and the first micro-lenses. 4. The optical interconnect according to claim 1, wherein the at least one horizontal bend of each of the plurality of waveguides bends at least 30° off a straight line. 5. The optical interconnect according to claim 1, wherein each optical waveguide comprises a plurality of horizontal bends within the single plane. 6. The optical interconnect according to claim 1, wherein the plurality of optical waveguides include optical waveguides having different lengths. 7. The optical interconnect according to claim 1, wherein the plurality of optical waveguides include optical waveguides having different lengths within the single plane. 8. The optical interconnect according to claim 1, comprising a third optical interface and an additional plurality of optical waveguides formed in the substrate and configured to convey respective optical signals between the first optical interface and the third optical interface, wherein the additional plurality of optical waveguides includes respective bends includes in an additional single plane. 9. The optical interconnect according to claim 1, wherein the optical waveguides comprise waveguides formed in the substrate by etching grooves on the layers of optical materials, filling the etched grooves with a second optical material with an index of refraction higher than that of the layers, and subsequently bonding the layers together. 10. The optical interconnect according to claim 1, wherein the first face is parallel with the second face. 11. The optical interconnect according to claim 1, wherein the first face is perpendicular to the second face. 12. The optical interconnect according to claim 1, wherein the plurality of optical waveguides include optical reflectors formed in the waveguides to implement the horizontal bends. 13. The optical interconnect according to claim 12, wherein the optical reflectors formed in the waveguides comprise parabolic optical reflectors. 14. The optical interconnect according to claim 12, wherein the optical reflectors formed in the waveguides comprise straight optical reflectors. 15. The optical interconnect according to claim 12, wherein the optical reflectors formed in the waveguides comprise curved concave optical reflectors. 16. The optical interconnect according to claim 12, wherein the optical reflectors comprise optical reflectors formed by etching the waveguides in the substrate. 17. A method for forming an optical interconnect to direct optical signals between first and second ferrules of optical fibers, comprising:
providing a substrate; forming in the substrate a plurality of optical waveguides, for conveying respective optical signals between first ends and second ends of the optical waveguides; disposing one or more first micro-lenses on the respective first ends of the optical waveguides, for coupling the optical signals between the first ends and respective first optical elements; and disposing one or more second micro-lenses on the respective second ends of the optical waveguides, for coupling the optical signals between the second ends and respective second optical elements, wherein each of the plurality of waveguides includes at least one horizontal bend and wherein the at least one horizontal bends of the plurality of waveguides are included in a single plane. 18. The method according to claim 17, wherein disposing the first micro-lenses comprises placing the first micro-lenses on a face of the substrate, and wherein forming the optical waveguides comprises terminating the first ends of the optical waveguides at a predefined distance from the face of the substrate, opposite the first micro-lenses. 19. The method according to claim 17, wherein forming the optical waveguides comprises forming waveguides each including a plurality of horizontal bends. 20. The method according to claim 17, wherein forming the optical waveguides comprise forming optical waveguides having different lengths. 21. The method according to claim 17, wherein forming the optical waveguides comprise forming a first subset of the optical waveguides whose second ends lie on a first face of the substrate, and forming a second subset of the optical waveguides whose second ends lie on a second face of the substrate, different from the first face. | An apparatus includes one or more optical waveguides, one or more first micro-lenses, and one or more second micro-lenses. The one or more optical waveguides are formed in a substrate and are configured to convey respective optical signals between first ends and second ends of the optical waveguides. The one or more first micro-lenses are disposed on the respective first ends of the optical waveguides and are configured to couple the optical signals between the first ends and respective first optical elements. The one or more second micro-lenses are disposed on the respective second ends of the optical waveguides and are configured to couple the optical signals between the second ends and respective second optical elements.1. An optical interconnect to direct optical signals between first and second ferrules of optical fibers, comprising:
a substrate; a first optical interface, configured to connect to the first ferrule of optical fibers, located on a first face of the substrate; a second optical interface, configured to connect to the second ferrule of optical fibers, located on a second face of the substrate; a plurality of optical waveguides, which are formed in the substrate and are configured to convey respective optical signals between the first optical interface and the second optical interface; one or more first micro-lenses, which are disposed on respective first ends of the optical waveguides and are configured to couple the optical signals between the first ends and the first ferrule; and one or more second micro-lenses, which are disposed on respective second ends of the optical waveguides and are configured to couple the optical signals between the second ends and the second ferrule, wherein each of the plurality of waveguides includes at least one horizontal bend and wherein the at least one horizontal bends of the plurality of waveguides are included in a single plane. 2. The optical interconnect according to claim 1, wherein the first micro-lenses are disposed on a face of the substrate, and wherein the first ends of the optical waveguides terminate at a predefined distance from the face of the substrate, opposite the first micro-lenses. 3. The optical interconnect according to claim 1, and comprising a mechanical fixture that fixes the first optical elements at a predefined distance from the respective first micro-lenses, so as to form an air gap between the first optical elements and the first micro-lenses. 4. The optical interconnect according to claim 1, wherein the at least one horizontal bend of each of the plurality of waveguides bends at least 30° off a straight line. 5. The optical interconnect according to claim 1, wherein each optical waveguide comprises a plurality of horizontal bends within the single plane. 6. The optical interconnect according to claim 1, wherein the plurality of optical waveguides include optical waveguides having different lengths. 7. The optical interconnect according to claim 1, wherein the plurality of optical waveguides include optical waveguides having different lengths within the single plane. 8. The optical interconnect according to claim 1, comprising a third optical interface and an additional plurality of optical waveguides formed in the substrate and configured to convey respective optical signals between the first optical interface and the third optical interface, wherein the additional plurality of optical waveguides includes respective bends includes in an additional single plane. 9. The optical interconnect according to claim 1, wherein the optical waveguides comprise waveguides formed in the substrate by etching grooves on the layers of optical materials, filling the etched grooves with a second optical material with an index of refraction higher than that of the layers, and subsequently bonding the layers together. 10. The optical interconnect according to claim 1, wherein the first face is parallel with the second face. 11. The optical interconnect according to claim 1, wherein the first face is perpendicular to the second face. 12. The optical interconnect according to claim 1, wherein the plurality of optical waveguides include optical reflectors formed in the waveguides to implement the horizontal bends. 13. The optical interconnect according to claim 12, wherein the optical reflectors formed in the waveguides comprise parabolic optical reflectors. 14. The optical interconnect according to claim 12, wherein the optical reflectors formed in the waveguides comprise straight optical reflectors. 15. The optical interconnect according to claim 12, wherein the optical reflectors formed in the waveguides comprise curved concave optical reflectors. 16. The optical interconnect according to claim 12, wherein the optical reflectors comprise optical reflectors formed by etching the waveguides in the substrate. 17. A method for forming an optical interconnect to direct optical signals between first and second ferrules of optical fibers, comprising:
providing a substrate; forming in the substrate a plurality of optical waveguides, for conveying respective optical signals between first ends and second ends of the optical waveguides; disposing one or more first micro-lenses on the respective first ends of the optical waveguides, for coupling the optical signals between the first ends and respective first optical elements; and disposing one or more second micro-lenses on the respective second ends of the optical waveguides, for coupling the optical signals between the second ends and respective second optical elements, wherein each of the plurality of waveguides includes at least one horizontal bend and wherein the at least one horizontal bends of the plurality of waveguides are included in a single plane. 18. The method according to claim 17, wherein disposing the first micro-lenses comprises placing the first micro-lenses on a face of the substrate, and wherein forming the optical waveguides comprises terminating the first ends of the optical waveguides at a predefined distance from the face of the substrate, opposite the first micro-lenses. 19. The method according to claim 17, wherein forming the optical waveguides comprises forming waveguides each including a plurality of horizontal bends. 20. The method according to claim 17, wherein forming the optical waveguides comprise forming optical waveguides having different lengths. 21. The method according to claim 17, wherein forming the optical waveguides comprise forming a first subset of the optical waveguides whose second ends lie on a first face of the substrate, and forming a second subset of the optical waveguides whose second ends lie on a second face of the substrate, different from the first face. | 2,800 |
11,548 | 11,548 | 14,674,546 | 2,839 | The invention is related to a method of initiating a regenerative converter ( 1 ) and corresponding converter ( 1 ) including a line bridge ( 2 ) and a machine bridge ( 3 ), which are interconnected via a DC intermediate circuit ( 8 A, 8 B). The method comprises charging, through the line bridge ( 2 ) and while the machine bridge ( 3 ) remains inactive, the DC intermediate circuit ( 8 A, 8 B) to a target voltage ( 14 ) higher than peak value of the mains voltage ( 13 ). | 1. A method of initiating a regenerative converter including a line bridge and a machine bridge, which are interconnected via a DC intermediate circuit,
the method comprising:
charging, through the line bridge and while the machine bridge remains inactive, the DC intermediate circuit to a target voltage higher than peak value of the mains voltage. 2. The method according to claim 1, wherein the converter includes line current filtering inductors arranged in series between line bridge AC output terminals and the mains. 3. The method according to claim 2, the method comprising:
charging the DC intermediate circuit by switching one or more of the low-side and/or the high-side switches of the line bridge with a preselected pulse pattern. 4. The method according to claim 2 or 3, the method comprising:
charging the DC intermediate circuit by switching only subset of the switches of the line bridge. 5. The method according to claim 4, the method comprising:
charging the DC intermediate circuit by switching only one or more of the low-side switches or alternatively only one or more of the high-side switches of the line bridge. 6. The method according to claim 1, the method comprising:
observing the DC intermediate circuit voltage starting normal converter operation when the DC intermediate circuit voltage reaches a threshold value. 7. A regenerative converter, comprising:
a line bridge for connecting to the mains; a machine bridge for connecting to the windings of an electric machine; a DC intermediate circuit connecting together the line bridge and the machine bridge; a control coupled to both the line bridge and the machine bridge, the control being configured to: cause, while the machine bridge remains inactive, the line bridge to charge the DC intermediate circuit to a target voltage higher than peak value of the mains voltage. 8. The regenerative converter according to claim 7, wherein the converter includes line current filtering inductors arranged in series between the line bridge AC output terminals and the mains connection. 9. The regenerative converter according to claim 8, wherein the control comprises a memory for storing a preselected pulse pattern of the control pulses for one or more of the low-side switches and/or high-side switches of the line bridge;
and wherein the control is configured to cause switching with the preselected pulse pattern of one or more of the low-side switches and/or high-side switches of the line bridge. 10. The regenerative converter according to claim 8 or 9, wherein the line bridge comprises low-side and high-side switches arranged as legs, and wherein the control is configured to cause the line bridge to charge the DC intermediate circuit by switching only subset of the switches. 11. The regenerative converter according to claim 10, wherein the control is configured to cause the line bridge to charge the DC intermediate circuit by switching only one or more of the low-side switches or alternatively only one or more of the high-side switches of the line bridge. 12. The regenerative converter according to claim 7, wherein the control comprises a feedback channel for observing the DC intermediate circuit voltage,
and wherein the control is configured to start normal converter operation when the DC intermediate circuit reaches a threshold value. 13. The regenerative converter according to claim 7, wherein the regenerative converter is a frequency converter. 14. The method according to claim 2, the method comprising:
observing the DC intermediate circuit voltage starting normal converter operation when the DC intermediate circuit voltage reaches a threshold value. 15. The method according to claim 3, the method comprising:
observing the DC intermediate circuit voltage starting normal converter operation when the DC intermediate circuit voltage reaches a threshold value. 16. The method according to claim 4, the method comprising:
observing the DC intermediate circuit voltage starting normal converter operation when the DC intermediate circuit voltage reaches a threshold value. | The invention is related to a method of initiating a regenerative converter ( 1 ) and corresponding converter ( 1 ) including a line bridge ( 2 ) and a machine bridge ( 3 ), which are interconnected via a DC intermediate circuit ( 8 A, 8 B). The method comprises charging, through the line bridge ( 2 ) and while the machine bridge ( 3 ) remains inactive, the DC intermediate circuit ( 8 A, 8 B) to a target voltage ( 14 ) higher than peak value of the mains voltage ( 13 ).1. A method of initiating a regenerative converter including a line bridge and a machine bridge, which are interconnected via a DC intermediate circuit,
the method comprising:
charging, through the line bridge and while the machine bridge remains inactive, the DC intermediate circuit to a target voltage higher than peak value of the mains voltage. 2. The method according to claim 1, wherein the converter includes line current filtering inductors arranged in series between line bridge AC output terminals and the mains. 3. The method according to claim 2, the method comprising:
charging the DC intermediate circuit by switching one or more of the low-side and/or the high-side switches of the line bridge with a preselected pulse pattern. 4. The method according to claim 2 or 3, the method comprising:
charging the DC intermediate circuit by switching only subset of the switches of the line bridge. 5. The method according to claim 4, the method comprising:
charging the DC intermediate circuit by switching only one or more of the low-side switches or alternatively only one or more of the high-side switches of the line bridge. 6. The method according to claim 1, the method comprising:
observing the DC intermediate circuit voltage starting normal converter operation when the DC intermediate circuit voltage reaches a threshold value. 7. A regenerative converter, comprising:
a line bridge for connecting to the mains; a machine bridge for connecting to the windings of an electric machine; a DC intermediate circuit connecting together the line bridge and the machine bridge; a control coupled to both the line bridge and the machine bridge, the control being configured to: cause, while the machine bridge remains inactive, the line bridge to charge the DC intermediate circuit to a target voltage higher than peak value of the mains voltage. 8. The regenerative converter according to claim 7, wherein the converter includes line current filtering inductors arranged in series between the line bridge AC output terminals and the mains connection. 9. The regenerative converter according to claim 8, wherein the control comprises a memory for storing a preselected pulse pattern of the control pulses for one or more of the low-side switches and/or high-side switches of the line bridge;
and wherein the control is configured to cause switching with the preselected pulse pattern of one or more of the low-side switches and/or high-side switches of the line bridge. 10. The regenerative converter according to claim 8 or 9, wherein the line bridge comprises low-side and high-side switches arranged as legs, and wherein the control is configured to cause the line bridge to charge the DC intermediate circuit by switching only subset of the switches. 11. The regenerative converter according to claim 10, wherein the control is configured to cause the line bridge to charge the DC intermediate circuit by switching only one or more of the low-side switches or alternatively only one or more of the high-side switches of the line bridge. 12. The regenerative converter according to claim 7, wherein the control comprises a feedback channel for observing the DC intermediate circuit voltage,
and wherein the control is configured to start normal converter operation when the DC intermediate circuit reaches a threshold value. 13. The regenerative converter according to claim 7, wherein the regenerative converter is a frequency converter. 14. The method according to claim 2, the method comprising:
observing the DC intermediate circuit voltage starting normal converter operation when the DC intermediate circuit voltage reaches a threshold value. 15. The method according to claim 3, the method comprising:
observing the DC intermediate circuit voltage starting normal converter operation when the DC intermediate circuit voltage reaches a threshold value. 16. The method according to claim 4, the method comprising:
observing the DC intermediate circuit voltage starting normal converter operation when the DC intermediate circuit voltage reaches a threshold value. | 2,800 |
11,549 | 11,549 | 15,144,037 | 2,875 | The present disclosure provides a solid state lighting fixture that can be used in outdoor and indoor recessed lighting applications. The solid state lighting fixture has a recessed housing configured to be installed in a recess, and a solid state light assembly capable of being secured to the housing outside the recess. The solid state light assembly is at least partially made of a heat dissipating material capable transferring heat generated by the solid state light assembly to ambient air. | 1. An SSL fixture comprising:
a recessed housing configured to be installed in a recess; and an SSL assembly capable of being secured to the recessed housing outside the recess, the SSL assembly being at least partially made of a heat dissipating material capable transferring heat generated by the SSL assembly to ambient air. 2. The SSL fixture of claim 1, wherein the SSL assembly comprises:
an external housing; and an SSL light engine secured within a recess within the external housing and having one or more SSL light elements mounted to a light engine board, wherein the external housing is made of the heat dissipating material capable transferring heat generated by the SSL light engine to ambient air. 3. The SSL fixture of claim 2, wherein the SSL assembly further comprises a cover positioned over the SSL light engine and secured to the external housing. 4. The SSL fixture of claim 2, wherein the heat dissipating material comprises cast aluminum. 5. The SSL fixture of claim 1, wherein the recessed housing comprises:
a driver compartment including dimmable drivers; and a junction box, the junction box being partitioned into a first compartment for alternating current (AC) wiring and a second compartment for low voltage wiring electrically coupled to the dimmable drivers. 6. The SSL fixture of claim 1, further comprising:
dimmable drivers; and a thermal regulation circuit electrically coupled to the dimmable drivers, the thermal regulation circuit causing the dimmable drivers to reduce wattage used by an SSL light engine in response to a detected increase in temperature of the SSL light engine above a predefined threshold temperature. 7. The SSL fixture of claim 1, wherein the recessed housing is secured to the SSL assembly with at least two screws. 8. The SSL fixture of claim 2, further comprising:
a lens secured on a distal side of the light engine with regard to recessed housing. 9. The SSL fixture of claim 8, wherein the lens is a diffusing lens. 10. An SSL assembly comprising:
an external housing; and an SSL light engine secured within a recess within the external housing and having one or more SSL light elements mounted to a light engine board; wherein the external housing is made of a heat dissipating material capable transferring heat generated by the SSL light engine to ambient air. 11. The SSL assembly of claim 10, further comprising:
a cover positioned over the SSL light engine and secured to the external housing. 12. The SSL assembly of claim 10, wherein the heat dissipating material comprises cast aluminum. 13. The SSL assembly of claim 10, further comprising:
at least two screws to secure the SSL assembly to a recessed housing configured to be installed in a recess. 14. The SSL assembly of claim 13, further comprising:
a lens positioned on a distal side of the SSL light engine with regard to the recessed housing. 15. The SSL assembly of claim 14, wherein the lens is a diffusing lens. 16. The SSL fixture of claim 10, wherein the SSL light engine is adaptable to operate at a plurality of different wattages. 17. An SSL fixture comprising:
a recessed housing configured to be installed in a recess; and an SSL assembly having an SSL light engine with one or more SSL light elements, the SSL assembly capable of being secured to the recessed housing outside the recess; dimmable drivers electrically coupled to the SSL light elements; and a thermal regulation circuit electrically coupled to the dimmable drivers, the thermal regulation circuit causing the dimmable drivers to reduce wattage used by the SSL light engine in response to a detected increase in temperature of the SSL light engine above at least one predefined threshold temperature. 18. The SSL fixture of claim 17, wherein the thermal regulation circuit causes the dimmable drivers to reduce wattage used by a SSL light engine in an inversely proportional response to a detected increase in temperature of the SSL light engine above a predefined threshold temperature. 19. The SSL fixture of claim 17, wherein the recessed housing is secured to the SSL assembly with at least two screws. 20. The SSL fixture of claim 17, further comprising:
a diffusing lens positioned on a distal side of the SSL assembly with regard to the recessed housing. | The present disclosure provides a solid state lighting fixture that can be used in outdoor and indoor recessed lighting applications. The solid state lighting fixture has a recessed housing configured to be installed in a recess, and a solid state light assembly capable of being secured to the housing outside the recess. The solid state light assembly is at least partially made of a heat dissipating material capable transferring heat generated by the solid state light assembly to ambient air.1. An SSL fixture comprising:
a recessed housing configured to be installed in a recess; and an SSL assembly capable of being secured to the recessed housing outside the recess, the SSL assembly being at least partially made of a heat dissipating material capable transferring heat generated by the SSL assembly to ambient air. 2. The SSL fixture of claim 1, wherein the SSL assembly comprises:
an external housing; and an SSL light engine secured within a recess within the external housing and having one or more SSL light elements mounted to a light engine board, wherein the external housing is made of the heat dissipating material capable transferring heat generated by the SSL light engine to ambient air. 3. The SSL fixture of claim 2, wherein the SSL assembly further comprises a cover positioned over the SSL light engine and secured to the external housing. 4. The SSL fixture of claim 2, wherein the heat dissipating material comprises cast aluminum. 5. The SSL fixture of claim 1, wherein the recessed housing comprises:
a driver compartment including dimmable drivers; and a junction box, the junction box being partitioned into a first compartment for alternating current (AC) wiring and a second compartment for low voltage wiring electrically coupled to the dimmable drivers. 6. The SSL fixture of claim 1, further comprising:
dimmable drivers; and a thermal regulation circuit electrically coupled to the dimmable drivers, the thermal regulation circuit causing the dimmable drivers to reduce wattage used by an SSL light engine in response to a detected increase in temperature of the SSL light engine above a predefined threshold temperature. 7. The SSL fixture of claim 1, wherein the recessed housing is secured to the SSL assembly with at least two screws. 8. The SSL fixture of claim 2, further comprising:
a lens secured on a distal side of the light engine with regard to recessed housing. 9. The SSL fixture of claim 8, wherein the lens is a diffusing lens. 10. An SSL assembly comprising:
an external housing; and an SSL light engine secured within a recess within the external housing and having one or more SSL light elements mounted to a light engine board; wherein the external housing is made of a heat dissipating material capable transferring heat generated by the SSL light engine to ambient air. 11. The SSL assembly of claim 10, further comprising:
a cover positioned over the SSL light engine and secured to the external housing. 12. The SSL assembly of claim 10, wherein the heat dissipating material comprises cast aluminum. 13. The SSL assembly of claim 10, further comprising:
at least two screws to secure the SSL assembly to a recessed housing configured to be installed in a recess. 14. The SSL assembly of claim 13, further comprising:
a lens positioned on a distal side of the SSL light engine with regard to the recessed housing. 15. The SSL assembly of claim 14, wherein the lens is a diffusing lens. 16. The SSL fixture of claim 10, wherein the SSL light engine is adaptable to operate at a plurality of different wattages. 17. An SSL fixture comprising:
a recessed housing configured to be installed in a recess; and an SSL assembly having an SSL light engine with one or more SSL light elements, the SSL assembly capable of being secured to the recessed housing outside the recess; dimmable drivers electrically coupled to the SSL light elements; and a thermal regulation circuit electrically coupled to the dimmable drivers, the thermal regulation circuit causing the dimmable drivers to reduce wattage used by the SSL light engine in response to a detected increase in temperature of the SSL light engine above at least one predefined threshold temperature. 18. The SSL fixture of claim 17, wherein the thermal regulation circuit causes the dimmable drivers to reduce wattage used by a SSL light engine in an inversely proportional response to a detected increase in temperature of the SSL light engine above a predefined threshold temperature. 19. The SSL fixture of claim 17, wherein the recessed housing is secured to the SSL assembly with at least two screws. 20. The SSL fixture of claim 17, further comprising:
a diffusing lens positioned on a distal side of the SSL assembly with regard to the recessed housing. | 2,800 |
11,550 | 11,550 | 14,518,013 | 2,829 | An electronic device is based on a single crystal semiconductor substrate. A cavity is formed in the semiconductor substrate. Further, a movably suspended mass is defined by one or more trenches extending from one side of the semiconductor substrate to the cavity. A first electrode layer is provided on the suspended mass. Further, a cover layer covering the suspended mass is provided. The cover layer includes a second electrode layer arranged opposite to the first electrode layer and spaced therefrom by a gap. | 1. An electronic device, comprising:
a single crystal semiconductor substrate; a cavity formed in the semiconductor substrate; a movably suspended mass defined in the semiconductor substrate by one or more trenches extending from one side of the semiconductor substrate to the cavity; a first electrode layer on the suspended mass; and a cover layer covering the suspended mass and including a second electrode layer arranged opposite to the first electrode layer and spaced therefrom by a gap. 2. The electronic device according to claim 1,
wherein the first electrode layer includes a first set of comb like electrode fingers; wherein the second electrode layer includes a second set of comb like electrode fingers. 3. The electronic device according to claim 2;
wherein the suspended mass is moveable at least between a first position, in which each electrode finger of the first set is aligned with an electrode finger of the second set, and a second position, in which each electrode finger of the first set is aligned with a space between two electrode fingers of the second set. 4. The device according to claim 2,
wherein the first electrode layer comprises recesses separating electrode fingers of the first set of comb like electrode fingers. 5. The device according to claim 2,
wherein the second electrode layer comprises recesses separating electrode fingers of the second set of comb like electrode fingers. 6. The device according to claim 2,
wherein the first set of comb like electrode fingers comprises first electrode fingers connected to a first voltage terminal and second electrode fingers connected to a second voltage terminal. 7. The device according to claim 6,
wherein an arrangement of the first electrode fingers of the first set of comb like electrode fingers is asymmetric with respect to an arrangement of the second electrode fingers of the first set of comb like electrode fingers. 8. The device according to claim 2,
wherein the second set of comb like electrode fingers comprises first electrode fingers operable to be charged according to a first polarity and second electrode fingers operable to be charged according to a second polarity which is opposite to the first polarity. 9. The device according to claim 1,
wherein the second electrode layer comprises an electret layer with electrodes embedded in a dielectric material. 10. The device according to claim 1,
wherein the device is an electromechanical acceleration sensor. 11. The device according to claim 1,
wherein the device is an electromechanical energy harvester. 12. A method of manufacturing an electronic device, the method comprising:
forming a cavity in a single crystal semiconductor substrate; defining a movably suspended mass by one or more trenches extending from one side of the semiconductor substrate to the cavity; providing a first electrode layer on the suspended mass;
and
providing a cover layer covering the suspended mass and including a second electrode layer arranged opposite to the first electrode layer and spaced therefrom by a gap. 13. The method according to claim 12,
wherein the first electrode layer includes a first set of comb like electrode fingers; and wherein the second electrode layer includes a second set of comb like electrode fingers. 14. The method according to claim 13;
wherein the suspended mass is moveable at least between a first position, in which each electrode finger of the first set is aligned with an electrode finger of the second set, and a second position, in which each electrode finger of the first set is aligned with a space between two electrode fingers of the second set. 15. The method according to claim 13,
wherein the first electrode layer comprises recesses separating electrode fingers of the first set of comb like electrode fingers. 16. The method according to claim 13,
wherein the second electrode layer comprises recesses separating electrode fingers of the first set of comb like electrode fingers. 17. The method according to claim 13,
wherein the first set of comb like electrode fingers comprises first electrode fingers connected to a first voltage terminal and second electrode fingers connected to a second voltage terminal. 18. The method according to claim 17,
wherein an arrangement of the first electrode fingers of the first set of comb like electrode fingers is asymmetric with respect to an arrangement of the second electrode fingers of the first set of comb like electrode fingers. 19. The method according to claim 13,
wherein the second set of comb like electrode fingers comprises first electrode fingers operable to be charged according to a first polarity and second electrode fingers operable to be charged according to a second polarity which is opposite to the first polarity. 20. The method according to claim 12,
wherein the semiconductor substrate is formed of silicon and the cavity is formed by a silicon-on-nothing process. | An electronic device is based on a single crystal semiconductor substrate. A cavity is formed in the semiconductor substrate. Further, a movably suspended mass is defined by one or more trenches extending from one side of the semiconductor substrate to the cavity. A first electrode layer is provided on the suspended mass. Further, a cover layer covering the suspended mass is provided. The cover layer includes a second electrode layer arranged opposite to the first electrode layer and spaced therefrom by a gap.1. An electronic device, comprising:
a single crystal semiconductor substrate; a cavity formed in the semiconductor substrate; a movably suspended mass defined in the semiconductor substrate by one or more trenches extending from one side of the semiconductor substrate to the cavity; a first electrode layer on the suspended mass; and a cover layer covering the suspended mass and including a second electrode layer arranged opposite to the first electrode layer and spaced therefrom by a gap. 2. The electronic device according to claim 1,
wherein the first electrode layer includes a first set of comb like electrode fingers; wherein the second electrode layer includes a second set of comb like electrode fingers. 3. The electronic device according to claim 2;
wherein the suspended mass is moveable at least between a first position, in which each electrode finger of the first set is aligned with an electrode finger of the second set, and a second position, in which each electrode finger of the first set is aligned with a space between two electrode fingers of the second set. 4. The device according to claim 2,
wherein the first electrode layer comprises recesses separating electrode fingers of the first set of comb like electrode fingers. 5. The device according to claim 2,
wherein the second electrode layer comprises recesses separating electrode fingers of the second set of comb like electrode fingers. 6. The device according to claim 2,
wherein the first set of comb like electrode fingers comprises first electrode fingers connected to a first voltage terminal and second electrode fingers connected to a second voltage terminal. 7. The device according to claim 6,
wherein an arrangement of the first electrode fingers of the first set of comb like electrode fingers is asymmetric with respect to an arrangement of the second electrode fingers of the first set of comb like electrode fingers. 8. The device according to claim 2,
wherein the second set of comb like electrode fingers comprises first electrode fingers operable to be charged according to a first polarity and second electrode fingers operable to be charged according to a second polarity which is opposite to the first polarity. 9. The device according to claim 1,
wherein the second electrode layer comprises an electret layer with electrodes embedded in a dielectric material. 10. The device according to claim 1,
wherein the device is an electromechanical acceleration sensor. 11. The device according to claim 1,
wherein the device is an electromechanical energy harvester. 12. A method of manufacturing an electronic device, the method comprising:
forming a cavity in a single crystal semiconductor substrate; defining a movably suspended mass by one or more trenches extending from one side of the semiconductor substrate to the cavity; providing a first electrode layer on the suspended mass;
and
providing a cover layer covering the suspended mass and including a second electrode layer arranged opposite to the first electrode layer and spaced therefrom by a gap. 13. The method according to claim 12,
wherein the first electrode layer includes a first set of comb like electrode fingers; and wherein the second electrode layer includes a second set of comb like electrode fingers. 14. The method according to claim 13;
wherein the suspended mass is moveable at least between a first position, in which each electrode finger of the first set is aligned with an electrode finger of the second set, and a second position, in which each electrode finger of the first set is aligned with a space between two electrode fingers of the second set. 15. The method according to claim 13,
wherein the first electrode layer comprises recesses separating electrode fingers of the first set of comb like electrode fingers. 16. The method according to claim 13,
wherein the second electrode layer comprises recesses separating electrode fingers of the first set of comb like electrode fingers. 17. The method according to claim 13,
wherein the first set of comb like electrode fingers comprises first electrode fingers connected to a first voltage terminal and second electrode fingers connected to a second voltage terminal. 18. The method according to claim 17,
wherein an arrangement of the first electrode fingers of the first set of comb like electrode fingers is asymmetric with respect to an arrangement of the second electrode fingers of the first set of comb like electrode fingers. 19. The method according to claim 13,
wherein the second set of comb like electrode fingers comprises first electrode fingers operable to be charged according to a first polarity and second electrode fingers operable to be charged according to a second polarity which is opposite to the first polarity. 20. The method according to claim 12,
wherein the semiconductor substrate is formed of silicon and the cavity is formed by a silicon-on-nothing process. | 2,800 |
11,551 | 11,551 | 14,701,217 | 2,895 | Methods and systems that estimate a degree of abnormality of a complex system based on historical time-series data representative of the complex system's past behavior and using the historical degree of abnormality to determine whether or not a degree of abnormality determined from current time-series data representative of the same complex system's current behavior is worthy of attention. The time-series data may be metric data that represents behavior of a complex system as a result of successive measurements of the complex system made over time or in a time interval. A degree of abnormality represents the amount by which the time-series data violates a threshold. The larger the degree of abnormality of the current time-series data is from the historical degree of abnormality, the larger the violation of the thresholds and the greater the probability the violation in the current time-series data is worthy of attention. | 1. A method stored in one or more data-storage devices and executed using one or more processors of a computing environment to estimate a degree of abnormality of a complex system, the method comprising:
computing estimated upper-threshold and lower-threshold historical degrees of abnormality based on historical time-series data, the historical time-series data represents one of past behavior, performance, and usage of the complex system retrieved from a data-storage device; computing estimated current degree of abnormality based on current time-series data, the current time-series data represents one of current behavior, performance, and usage of the complex system retrieved from a data-storage device; and comparing the estimated current degree of abnormality with one of the estimated upper-threshold and lower-threshold historical degrees of abnormality to determine whether one of the current behavior, performance, and usage of the complex system is abnormal. 2. The method of claim 1, wherein computing the estimated historical degree of abnormality further comprises
computing upper and lower combined sets of abnormalities based on the historical time-series data; for each set of abnormalities,
forming a histogram of the set of abnormalities;
computing an empirical probability density function based on the histogram;
computing a cumulative distribution based on the empirical probability;
computing an inverse empirical cumulative distribution based on the empirical cumulative distribution, the inverse empirical cumulative distribution is one of an upper-threshold abnormality degree component of the upper-threshold historical degree of abnormality and a lower-threshold abnormality degree component of the lower-threshold historical degree of abnormality;
forming the upper-threshold estimated historical degree of abnormality based the upper-threshold abnormality degree components; and forming the lower-threshold estimated historical degree of abnormality based the lower-threshold abnormality degree components. 3. The method of claim 2, wherein computing the upper and lower combined sets of abnormalities further comprises:
forming upper-threshold combined set of abnormalities, the upper-threshold combined set of abnormalities having one of a set of historical upper-threshold event distances and a set of historical upper-threshold distance metrics and one of a set of historical upper-threshold event durations and a set of historical upper-threshold event counts; and forming lower-threshold combined set of abnormalities, the upper-threshold combined set of abnormalities having one of a set of historical lower-threshold event distances and a set of historical lower-threshold distance metrics and one of a set of historical lower-threshold event durations and a set of historical lower-threshold event counts. 4. The method of claim 2, wherein the cumulative distribution further comprises one of an empirical cumulative distribution and a parametric cumulative distribution. 5. The method of claim 1, wherein computing the estimated current degree of abnormality further comprises:
computing a current distance metric for data values of the current time-series that violates one of an upper threshold and a lower threshold; computing one of a current count and a current duration of the data values of the current time-series that violates one of an upper threshold and a lower threshold; and forming the estimated current degree of abnormality based on the current distance metric and one of the current count and the current duration. 6. The method of claim 1, wherein comparing the estimated current degree of abnormality with one of the estimated upper-threshold and lower-threshold historical degrees of abnormality further comprises:
when the estimated current degree of abnormality corresponds to an upper-threshold event, comparing the estimated current degree of abnormality with the estimated upper-threshold historical degree of abnormality; when the estimated current degree of abnormality corresponds to a lower-threshold event, comparing the estimated current degree of abnormality with the estimated lower-threshold historical degree of abnormality; and generating an alert when a current distance metric and one of a current count and a current duration of the estimated current degree of abnormality are greater than the abnormality degree components one of the upper-threshold historical degree of abnormality and lower-threshold degree of historical degree of abnormality. 7. A system to estimate a degree of abnormality of a complex system, the system comprising:
one or more processors; one or more data-storage devices; and machine-readable instructions stored in the data-storage devices and executed using the one or more processors, the machine-readable instructions
computing estimated upper-threshold and lower-threshold historical degrees of abnormality based on historical time-series data, the historical time-series data represents one of past behavior, performance, and usage of the complex system retrieved from a data-storage device;
computing estimated current degree of abnormality based on current time-series data, the current time-series data represents one of current behavior, performance, and usage of the complex system retrieved from a data-storage device; and
comparing the estimated current degree of abnormality with one of the estimated upper-threshold and lower-threshold historical degrees of abnormality to determine whether one of the current behavior, performance, and usage of the complex system is abnormal. 8. The system of claim 7, wherein computing the estimated historical degree of abnormality further comprises
computing upper and lower combined sets of abnormalities based on the historical time-series data; for each set of abnormalities,
forming a histogram of the set of abnormalities;
computing an empirical probability density function based on the histogram;
computing a cumulative distribution based on the empirical probability;
computing an inverse empirical cumulative distribution based on the empirical cumulative distribution, the inverse empirical cumulative distribution is one of an upper-threshold abnormality degree component of the upper-threshold historical degree of abnormality and a lower-threshold abnormality degree component of the lower-threshold historical degree of abnormality;
forming the upper-threshold estimated historical degree of abnormality based the upper-threshold abnormality degree components; and forming the lower-threshold estimated historical degree of abnormality based the lower-threshold abnormality degree components. 9. The method of claim 8, wherein computing the upper and lower combined sets of abnormalities further comprises:
forming upper-threshold combined set of abnormalities, the upper-threshold combined set of abnormalities having one of a set of historical upper-threshold event distances and a set of historical upper-threshold distance metrics and one of a set of historical upper-threshold event durations and a set of historical upper-threshold event counts; and forming lower-threshold combined set of abnormalities, the upper-threshold combined set of abnormalities having one of a set of historical lower-threshold event distances and a set of historical lower-threshold distance metrics and one of a set of historical lower-threshold event durations and a set of historical lower-threshold event counts. 10. The method of claim 8, wherein the cumulative distribution further comprises one of an empirical cumulative distribution and a parametric cumulative distribution. 11. The method of claim 7, wherein computing the estimated current degree of abnormality further comprises:
computing a current distance metric for data values of the current time-series that violates one of an upper threshold and a lower threshold; computing one of a current count and a current duration of the data values of the current time-series that violates one of an upper threshold and a lower threshold; and forming the estimated current degree of abnormality based on the current distance metric and one of the current count and the current duration. 12. The method of claim 7, wherein comparing the estimated current degree of abnormality with one of the estimated upper-threshold and lower-threshold historical degrees of abnormality further comprises:
when the estimated current degree of abnormality corresponds to an upper-threshold event, comparing the estimated current degree of abnormality with the estimated upper-threshold historical degree of abnormality; when the estimated current degree of abnormality corresponds to a lower-threshold event, comparing the estimated current degree of abnormality with the estimated lower-threshold historical degree of abnormality; and generating an alert when a current distance metric and one of a current count and a current duration of the estimated current degree of abnormality are greater than the abnormality degree components one of the upper-threshold historical degree of abnormality and lower-threshold degree of historical degree of abnormality. 13. A method stored in one or more data-storage devices and executed using one or more processors of a computing environment to estimate a degree of abnormality of a complex system, the method comprising:
determining upper-threshold events and lower-threshold event in historical time-series data; for each upper and lower threshold event,
computing a normalized total relative distance,
computing a median of the normalized total relative distances, and
computing a mean of the normalized total relative distances; and
computing one of an upper-threshold cumulative distribution and lower-threshold cumulative distribution for current time-series data based on the median and mean of the normalized total relative distance, the cumulative distribution is the estimate of the degree of abnormality. 14. The method of claim 13, wherein determining the upper-threshold events in the historical time-series data further comprises:
for each data value of the historical time-series greater than the upper threshold, computing a relative distance; and forming an upper-threshold event, each upper-threshold event corresponds to set of consecutive relative distances. 15. The method of claim 13, wherein determining the lower-threshold events in the historical time-series data further comprises:
for each data value of the historical time-series greater than the lower threshold, computing a relative distance; and forming a lower-threshold event, each lower-threshold event corresponds to set of consecutive relative distances. 16. The method of claim 13, wherein computing a normalized total relative distance further comprises integrating over the relative distances comprising one of an upper-threshold event and a lower-threshold event. 17. The method of claim 13, wherein computing the cumulative distribution for the current data further comprises:
determining one of an upper-threshold event and a lower-threshold event in the current time-series data; computing a total relative distance of one of the upper-threshold event and the lower-threshold event; normalizing the total relative distance based on the event counts of the event; and computing a value for the cumulative distribution based on the normalized total relative distance of the event, the value is the degree of abnormality of the current time-series data. 18. A computer-readable medium encoded with machine-readable instructions that implement a method carried out by one or more processors of a computer system to perform the operations of
determining upper-threshold events and lower-threshold event in historical time-series data; for each upper and lower threshold event,
computing a normalized total relative distance,
computing a median of the normalized total relative distances, and
computing a mean of the normalized total relative distances; and
computing one of an upper-threshold cumulative distribution and lower-threshold cumulative distribution for current time-series data based on the median and mean of the normalized total relative distance, the cumulative distribution is the estimate of the degree of abnormality. 19. The computer-readable medium of claim 18, wherein determining the upper-threshold events in the historical time-series data further comprises:
for each data value of the historical time-series greater than the upper threshold, computing a relative distance; and forming an upper-threshold event, each upper-threshold event corresponds to set of consecutive relative distances. 20. The computer-readable medium of claim 18, wherein determining the lower-threshold events in the historical time-series data further comprises:
for each data value of the historical time-series greater than the lower threshold, computing a relative distance; and forming a lower-threshold event, each lower-threshold event corresponds to set of consecutive relative distances. 21. The computer-readable medium of claim 18, wherein computing a normalized total relative distance further comprises integrating over the relative distances comprising one of an upper-threshold event and a lower-threshold event. 22. The computer-readable medium of claim 18, wherein computing the cumulative distribution for the current data further comprises:
determining one of an upper-threshold event and a lower-threshold event in the current time-series data; computing a total relative distance of one of the upper-threshold event and the lower-threshold event; normalizing the total relative distance based on the event counts of the event; and computing a value for the cumulative distribution based on the normalized total relative distance of the event, the value is the degree of abnormality of the current time-series data. | Methods and systems that estimate a degree of abnormality of a complex system based on historical time-series data representative of the complex system's past behavior and using the historical degree of abnormality to determine whether or not a degree of abnormality determined from current time-series data representative of the same complex system's current behavior is worthy of attention. The time-series data may be metric data that represents behavior of a complex system as a result of successive measurements of the complex system made over time or in a time interval. A degree of abnormality represents the amount by which the time-series data violates a threshold. The larger the degree of abnormality of the current time-series data is from the historical degree of abnormality, the larger the violation of the thresholds and the greater the probability the violation in the current time-series data is worthy of attention.1. A method stored in one or more data-storage devices and executed using one or more processors of a computing environment to estimate a degree of abnormality of a complex system, the method comprising:
computing estimated upper-threshold and lower-threshold historical degrees of abnormality based on historical time-series data, the historical time-series data represents one of past behavior, performance, and usage of the complex system retrieved from a data-storage device; computing estimated current degree of abnormality based on current time-series data, the current time-series data represents one of current behavior, performance, and usage of the complex system retrieved from a data-storage device; and comparing the estimated current degree of abnormality with one of the estimated upper-threshold and lower-threshold historical degrees of abnormality to determine whether one of the current behavior, performance, and usage of the complex system is abnormal. 2. The method of claim 1, wherein computing the estimated historical degree of abnormality further comprises
computing upper and lower combined sets of abnormalities based on the historical time-series data; for each set of abnormalities,
forming a histogram of the set of abnormalities;
computing an empirical probability density function based on the histogram;
computing a cumulative distribution based on the empirical probability;
computing an inverse empirical cumulative distribution based on the empirical cumulative distribution, the inverse empirical cumulative distribution is one of an upper-threshold abnormality degree component of the upper-threshold historical degree of abnormality and a lower-threshold abnormality degree component of the lower-threshold historical degree of abnormality;
forming the upper-threshold estimated historical degree of abnormality based the upper-threshold abnormality degree components; and forming the lower-threshold estimated historical degree of abnormality based the lower-threshold abnormality degree components. 3. The method of claim 2, wherein computing the upper and lower combined sets of abnormalities further comprises:
forming upper-threshold combined set of abnormalities, the upper-threshold combined set of abnormalities having one of a set of historical upper-threshold event distances and a set of historical upper-threshold distance metrics and one of a set of historical upper-threshold event durations and a set of historical upper-threshold event counts; and forming lower-threshold combined set of abnormalities, the upper-threshold combined set of abnormalities having one of a set of historical lower-threshold event distances and a set of historical lower-threshold distance metrics and one of a set of historical lower-threshold event durations and a set of historical lower-threshold event counts. 4. The method of claim 2, wherein the cumulative distribution further comprises one of an empirical cumulative distribution and a parametric cumulative distribution. 5. The method of claim 1, wherein computing the estimated current degree of abnormality further comprises:
computing a current distance metric for data values of the current time-series that violates one of an upper threshold and a lower threshold; computing one of a current count and a current duration of the data values of the current time-series that violates one of an upper threshold and a lower threshold; and forming the estimated current degree of abnormality based on the current distance metric and one of the current count and the current duration. 6. The method of claim 1, wherein comparing the estimated current degree of abnormality with one of the estimated upper-threshold and lower-threshold historical degrees of abnormality further comprises:
when the estimated current degree of abnormality corresponds to an upper-threshold event, comparing the estimated current degree of abnormality with the estimated upper-threshold historical degree of abnormality; when the estimated current degree of abnormality corresponds to a lower-threshold event, comparing the estimated current degree of abnormality with the estimated lower-threshold historical degree of abnormality; and generating an alert when a current distance metric and one of a current count and a current duration of the estimated current degree of abnormality are greater than the abnormality degree components one of the upper-threshold historical degree of abnormality and lower-threshold degree of historical degree of abnormality. 7. A system to estimate a degree of abnormality of a complex system, the system comprising:
one or more processors; one or more data-storage devices; and machine-readable instructions stored in the data-storage devices and executed using the one or more processors, the machine-readable instructions
computing estimated upper-threshold and lower-threshold historical degrees of abnormality based on historical time-series data, the historical time-series data represents one of past behavior, performance, and usage of the complex system retrieved from a data-storage device;
computing estimated current degree of abnormality based on current time-series data, the current time-series data represents one of current behavior, performance, and usage of the complex system retrieved from a data-storage device; and
comparing the estimated current degree of abnormality with one of the estimated upper-threshold and lower-threshold historical degrees of abnormality to determine whether one of the current behavior, performance, and usage of the complex system is abnormal. 8. The system of claim 7, wherein computing the estimated historical degree of abnormality further comprises
computing upper and lower combined sets of abnormalities based on the historical time-series data; for each set of abnormalities,
forming a histogram of the set of abnormalities;
computing an empirical probability density function based on the histogram;
computing a cumulative distribution based on the empirical probability;
computing an inverse empirical cumulative distribution based on the empirical cumulative distribution, the inverse empirical cumulative distribution is one of an upper-threshold abnormality degree component of the upper-threshold historical degree of abnormality and a lower-threshold abnormality degree component of the lower-threshold historical degree of abnormality;
forming the upper-threshold estimated historical degree of abnormality based the upper-threshold abnormality degree components; and forming the lower-threshold estimated historical degree of abnormality based the lower-threshold abnormality degree components. 9. The method of claim 8, wherein computing the upper and lower combined sets of abnormalities further comprises:
forming upper-threshold combined set of abnormalities, the upper-threshold combined set of abnormalities having one of a set of historical upper-threshold event distances and a set of historical upper-threshold distance metrics and one of a set of historical upper-threshold event durations and a set of historical upper-threshold event counts; and forming lower-threshold combined set of abnormalities, the upper-threshold combined set of abnormalities having one of a set of historical lower-threshold event distances and a set of historical lower-threshold distance metrics and one of a set of historical lower-threshold event durations and a set of historical lower-threshold event counts. 10. The method of claim 8, wherein the cumulative distribution further comprises one of an empirical cumulative distribution and a parametric cumulative distribution. 11. The method of claim 7, wherein computing the estimated current degree of abnormality further comprises:
computing a current distance metric for data values of the current time-series that violates one of an upper threshold and a lower threshold; computing one of a current count and a current duration of the data values of the current time-series that violates one of an upper threshold and a lower threshold; and forming the estimated current degree of abnormality based on the current distance metric and one of the current count and the current duration. 12. The method of claim 7, wherein comparing the estimated current degree of abnormality with one of the estimated upper-threshold and lower-threshold historical degrees of abnormality further comprises:
when the estimated current degree of abnormality corresponds to an upper-threshold event, comparing the estimated current degree of abnormality with the estimated upper-threshold historical degree of abnormality; when the estimated current degree of abnormality corresponds to a lower-threshold event, comparing the estimated current degree of abnormality with the estimated lower-threshold historical degree of abnormality; and generating an alert when a current distance metric and one of a current count and a current duration of the estimated current degree of abnormality are greater than the abnormality degree components one of the upper-threshold historical degree of abnormality and lower-threshold degree of historical degree of abnormality. 13. A method stored in one or more data-storage devices and executed using one or more processors of a computing environment to estimate a degree of abnormality of a complex system, the method comprising:
determining upper-threshold events and lower-threshold event in historical time-series data; for each upper and lower threshold event,
computing a normalized total relative distance,
computing a median of the normalized total relative distances, and
computing a mean of the normalized total relative distances; and
computing one of an upper-threshold cumulative distribution and lower-threshold cumulative distribution for current time-series data based on the median and mean of the normalized total relative distance, the cumulative distribution is the estimate of the degree of abnormality. 14. The method of claim 13, wherein determining the upper-threshold events in the historical time-series data further comprises:
for each data value of the historical time-series greater than the upper threshold, computing a relative distance; and forming an upper-threshold event, each upper-threshold event corresponds to set of consecutive relative distances. 15. The method of claim 13, wherein determining the lower-threshold events in the historical time-series data further comprises:
for each data value of the historical time-series greater than the lower threshold, computing a relative distance; and forming a lower-threshold event, each lower-threshold event corresponds to set of consecutive relative distances. 16. The method of claim 13, wherein computing a normalized total relative distance further comprises integrating over the relative distances comprising one of an upper-threshold event and a lower-threshold event. 17. The method of claim 13, wherein computing the cumulative distribution for the current data further comprises:
determining one of an upper-threshold event and a lower-threshold event in the current time-series data; computing a total relative distance of one of the upper-threshold event and the lower-threshold event; normalizing the total relative distance based on the event counts of the event; and computing a value for the cumulative distribution based on the normalized total relative distance of the event, the value is the degree of abnormality of the current time-series data. 18. A computer-readable medium encoded with machine-readable instructions that implement a method carried out by one or more processors of a computer system to perform the operations of
determining upper-threshold events and lower-threshold event in historical time-series data; for each upper and lower threshold event,
computing a normalized total relative distance,
computing a median of the normalized total relative distances, and
computing a mean of the normalized total relative distances; and
computing one of an upper-threshold cumulative distribution and lower-threshold cumulative distribution for current time-series data based on the median and mean of the normalized total relative distance, the cumulative distribution is the estimate of the degree of abnormality. 19. The computer-readable medium of claim 18, wherein determining the upper-threshold events in the historical time-series data further comprises:
for each data value of the historical time-series greater than the upper threshold, computing a relative distance; and forming an upper-threshold event, each upper-threshold event corresponds to set of consecutive relative distances. 20. The computer-readable medium of claim 18, wherein determining the lower-threshold events in the historical time-series data further comprises:
for each data value of the historical time-series greater than the lower threshold, computing a relative distance; and forming a lower-threshold event, each lower-threshold event corresponds to set of consecutive relative distances. 21. The computer-readable medium of claim 18, wherein computing a normalized total relative distance further comprises integrating over the relative distances comprising one of an upper-threshold event and a lower-threshold event. 22. The computer-readable medium of claim 18, wherein computing the cumulative distribution for the current data further comprises:
determining one of an upper-threshold event and a lower-threshold event in the current time-series data; computing a total relative distance of one of the upper-threshold event and the lower-threshold event; normalizing the total relative distance based on the event counts of the event; and computing a value for the cumulative distribution based on the normalized total relative distance of the event, the value is the degree of abnormality of the current time-series data. | 2,800 |
11,552 | 11,552 | 14,917,447 | 2,895 | A mobile data storage device ( 102 ) may be housed in a mobile computing device ( 142 ) without an active cooling feature. The mobile data storage device ( 102 ) can have at least a controller ( 122 ) configured to delay command execution in response to a predicted mobile data storage device ( 102 ) temperature. The controller ( 122 ) can insert a plurality of delays into a command queue to prevent the mobile data storage device ( 102 ) from reaching the predicted mobile data storage device ( 102 ) temperature. | 1. An apparatus comprising a mobile data storage device housed in a mobile computing device without an active cooling feature, the mobile data storage device comprising a controller configured to delay execution of at least one command in response to a predicted mobile data storage device temperature. 2. The apparatus of claim 1, wherein the mobile data storage device is a hard disk drive. 3. The apparatus of claim 1, wherein the mobile computing device is a laptop computer. 4. The apparatus of claim 1, wherein the mobile computing device is a tablet computer. 5. The apparatus of claim 1, wherein the mobile data storage device comprises a cache memory connected to the controller, the cache memory storing a command queue comprising the at least one command. 6. The apparatus of claim 1, wherein the mobile data storage device comprises a mobile enablement kit configured to recognize the presence of an active cooling feature. 7. The apparatus of claim 6, wherein the mobile enable kit comprises a dynamic data driver configured to connect the controller with at least one peripheral component. 8. The apparatus of claim 1, wherein the controller is connected to a fall protection circuit configured to provide the predicted change. 9. A method comprising:
housing a mobile data storage device in a mobile computing device, the mobile computing device configured without an active cooling feature, the mobile data storage device comprising a controller; predicting a mobile data storage device temperature with the controller; and inserting at least one interval in a command queue to delay execution of at least one command in response to the predicted mobile data storage device temperature. 10. The method of claim 9, wherein the mobile data storage device temperature is predicted based on a derived thermal profile of logged mobile data storage device temperatures and activities. 11. The method of claim 10, wherein the derived thermal profile predicts one or more operating temperatures and power consumption corresponding to the execution of at least some of the commands in the command queue. 12. The method of claim 9, wherein a plurality of intervals are inserted into the command queue. 13. The method of claim 12, wherein a first interval has a first duration that differs from a second duration of a second interval. 14. The method of claim 9, wherein the at least one interval corresponds with a reduction in rotating speed of a data storage medium incorporated in the mobile data storage device. 15. The method of claim 9, wherein the at least one intervals are removed in response to the mobile data storage device falling below a threshold operating temperature. 16. The method of claim 9, wherein the controller inserts a plurality of intervals to delay the execution of any commands present in the command queue until a maximum predicted mobile data storage device temperature is below a threshold operating temperature. 17. The method of claim 16, wherein the controller flushes at least one command in the command queue in response to the maximum predicted mobile data storage device temperature being above the threshold operating temperature. 18. An apparatus comprising a mobile data storage device housed in a mobile computing device without an active cooling feature, the mobile data storage device comprising a controller configured to delay execution of at least one command in response to a predicted mobile data storage device temperature corresponding to a command queue. 19. The apparatus of claim 17, wherein the predicted mobile data storage device temperature is 40° C. or above. 20. The apparatus of claim 17, wherein the mobile data storage device comprises at least one data storage medium and at least one transducing head suspended proximal the at least one data storage medium. | A mobile data storage device ( 102 ) may be housed in a mobile computing device ( 142 ) without an active cooling feature. The mobile data storage device ( 102 ) can have at least a controller ( 122 ) configured to delay command execution in response to a predicted mobile data storage device ( 102 ) temperature. The controller ( 122 ) can insert a plurality of delays into a command queue to prevent the mobile data storage device ( 102 ) from reaching the predicted mobile data storage device ( 102 ) temperature.1. An apparatus comprising a mobile data storage device housed in a mobile computing device without an active cooling feature, the mobile data storage device comprising a controller configured to delay execution of at least one command in response to a predicted mobile data storage device temperature. 2. The apparatus of claim 1, wherein the mobile data storage device is a hard disk drive. 3. The apparatus of claim 1, wherein the mobile computing device is a laptop computer. 4. The apparatus of claim 1, wherein the mobile computing device is a tablet computer. 5. The apparatus of claim 1, wherein the mobile data storage device comprises a cache memory connected to the controller, the cache memory storing a command queue comprising the at least one command. 6. The apparatus of claim 1, wherein the mobile data storage device comprises a mobile enablement kit configured to recognize the presence of an active cooling feature. 7. The apparatus of claim 6, wherein the mobile enable kit comprises a dynamic data driver configured to connect the controller with at least one peripheral component. 8. The apparatus of claim 1, wherein the controller is connected to a fall protection circuit configured to provide the predicted change. 9. A method comprising:
housing a mobile data storage device in a mobile computing device, the mobile computing device configured without an active cooling feature, the mobile data storage device comprising a controller; predicting a mobile data storage device temperature with the controller; and inserting at least one interval in a command queue to delay execution of at least one command in response to the predicted mobile data storage device temperature. 10. The method of claim 9, wherein the mobile data storage device temperature is predicted based on a derived thermal profile of logged mobile data storage device temperatures and activities. 11. The method of claim 10, wherein the derived thermal profile predicts one or more operating temperatures and power consumption corresponding to the execution of at least some of the commands in the command queue. 12. The method of claim 9, wherein a plurality of intervals are inserted into the command queue. 13. The method of claim 12, wherein a first interval has a first duration that differs from a second duration of a second interval. 14. The method of claim 9, wherein the at least one interval corresponds with a reduction in rotating speed of a data storage medium incorporated in the mobile data storage device. 15. The method of claim 9, wherein the at least one intervals are removed in response to the mobile data storage device falling below a threshold operating temperature. 16. The method of claim 9, wherein the controller inserts a plurality of intervals to delay the execution of any commands present in the command queue until a maximum predicted mobile data storage device temperature is below a threshold operating temperature. 17. The method of claim 16, wherein the controller flushes at least one command in the command queue in response to the maximum predicted mobile data storage device temperature being above the threshold operating temperature. 18. An apparatus comprising a mobile data storage device housed in a mobile computing device without an active cooling feature, the mobile data storage device comprising a controller configured to delay execution of at least one command in response to a predicted mobile data storage device temperature corresponding to a command queue. 19. The apparatus of claim 17, wherein the predicted mobile data storage device temperature is 40° C. or above. 20. The apparatus of claim 17, wherein the mobile data storage device comprises at least one data storage medium and at least one transducing head suspended proximal the at least one data storage medium. | 2,800 |
11,553 | 11,553 | 13,760,669 | 2,883 | A fiber optic multiport includes a housing, a multi-fiber connector coupled to the housing, a plurality of optical fibers, extensions, and ports connected to distal ends of the extensions. The housing defines an enclosure and includes interlocking structure that seals off the enclosure from the environment. The plurality of optical fibers are connected to and extend from the multi-fiber connector into the enclosure. The extensions have proximal ends attached to the housing and the extensions project away from the housing. The extensions support sub-sets of the plurality of optical fibers, and the extensions are flexible such that the extensions may bend independently of one another. | 1. A fiber optic multiport, comprising:
a housing, wherein the housing defines an enclosure, and wherein the housing comprises interlocking structure that seals off the enclosure from the environment; a multi-fiber connector coupled to the housing; a plurality of optical fibers connected to and extending from the multi-fiber connector into the enclosure; extensions having proximal ends attached to the housing, the extensions projecting away from the housing, wherein the extensions support sub-sets of the plurality of optical fibers, and wherein the extensions are flexible such that the extensions may bend independently of one another; and ports connected to distal ends of the extensions. 2. The multiport of claim 1, wherein at least two of the extensions are the same lengths as one another. 3. The multiport of claim 2, wherein at least two of the extensions are different lengths from one another. 4. The multiport of claim 3, wherein the multiport comprises at least two groups of the extensions, wherein extensions within each group are the same length as one another, and wherein lengths of extensions differ between the two groups, whereby sets of ports corresponding to the two groups of extensions are staggered relative to one another from the housing. 5. The multiport of claim 4, wherein the multiport comprises three groups of extensions with four extensions in each group such that the multiport comprises twelve ports that are arranged in three staggered sets. 6. The multiport of claim 4, wherein ports within each set are coupled to one another with a collar. 7. The multiport of claim 6, wherein the housing has a face from which the extensions project, and wherein the area of the face is less than the net area of forward end-faces of the sets of ports. 8. The multiport of claim 1, wherein the enclosure comprises guides and wherein slack of the plurality of optical fibers is routed by the guides. 9. The multiport of claim 8, wherein the guides comprise round features over which the slack is routed to control bending of the slack. 10. The multiport of claim 8, wherein the slack comprises a length of optical fiber that is at least 50 millimeters. 11. The multiport of claim 8, wherein one or more of the optical fibers continuously extends between the multi-fiber connector and a respective one of the ports without splicing therebetween. 12. The multiport of claim 1, wherein the interlocking structure of the housing comprises pieces that define walls of the enclosure, and wherein edges of the pieces are mortised together to seal the enclosure. 13. The multiport of claim 1, wherein the multi-fiber connector is integrated with the housing by way of a flange interfacing a groove, the flange and groove extending around the multi-fiber connector and along an interior edge of the housing such that the interface of the flange and groove seals the integration of the multi-fiber connector with the housing and axially secures the multi-fiber connector, and wherein the flange and groove are adjoined by a pin and slot that orient the multi-fiber connector and limit rotation relative to the housing. 14. A fiber optic multiport, comprising:
a housing, wherein the housing defines an enclosure; a multi-fiber connector coupled to the housing; a plurality of optical fibers connected to and extending from the multi-fiber connector into the enclosure; extensions having a proximal end attached to the housing, the extensions projecting away from a face of the housing, wherein the extensions support sub-sets of the plurality of optical fibers; and ports connected to distal ends of the extensions, wherein the area of the face of the housing is less than the net area of forward end-faces of the ports. 15. The multiport of claim 14, wherein the multi-fiber connector is rigidly fixed directly to the housing and wherein the ports are attached to the housing by way of the extensions, which are flexible such that the extensions may bend independently of one another. 16. The multiport of claim 14, wherein the housing comprises interlocking structure that seals off the enclosures from the environment, wherein the multi-fiber connector is integrated with the housing by way of a flange interfacing a groove, the flange and groove extending around the multi-fiber connector and along an interior edge of the housing such that the interface of the flange and groove seals the integration of the multi-fiber connector with the housing and axially secures the multi-fiber connector, and wherein the flange and groove are adjoined by a pin and slot that orient that multi-fiber connector and limit rotation relative to the housing. 17. The multiport of claim 16, wherein the interlocking structure of the housing comprises pieces that define walls of the enclosure, wherein edges of the pieces are mortised together to seal the enclosure. 18. A fiber optic multiport, comprising:
a housing, wherein the housing defines an enclosure; a multi-fiber connector integrated with the housing; a plurality of optical fibers connected to and extending from the multi-fiber connector into the enclosure, one or more guides in the enclosure, wherein slack of the plurality of optical fibers is routed by the one or more guides; extensions having a proximal end attached to the housing, the extensions projecting away from the housing, wherein the extensions support sub-sets of the plurality of optical fibers, and wherein the extensions are flexible such that the extensions may bend independently of one another; and ports connected to distal ends of the extensions. 19. The multiport of claim 18, wherein the one or more guides comprise one or more round features over which the slack is routed, and wherein the slack comprises a length of optical fiber that is at least 50 millimeters. 20. The multiport of claim 19, wherein one or more of the optical fibers continuously extends between the multi-fiber connector and a respective one of the ports without splicing therebetween. | A fiber optic multiport includes a housing, a multi-fiber connector coupled to the housing, a plurality of optical fibers, extensions, and ports connected to distal ends of the extensions. The housing defines an enclosure and includes interlocking structure that seals off the enclosure from the environment. The plurality of optical fibers are connected to and extend from the multi-fiber connector into the enclosure. The extensions have proximal ends attached to the housing and the extensions project away from the housing. The extensions support sub-sets of the plurality of optical fibers, and the extensions are flexible such that the extensions may bend independently of one another.1. A fiber optic multiport, comprising:
a housing, wherein the housing defines an enclosure, and wherein the housing comprises interlocking structure that seals off the enclosure from the environment; a multi-fiber connector coupled to the housing; a plurality of optical fibers connected to and extending from the multi-fiber connector into the enclosure; extensions having proximal ends attached to the housing, the extensions projecting away from the housing, wherein the extensions support sub-sets of the plurality of optical fibers, and wherein the extensions are flexible such that the extensions may bend independently of one another; and ports connected to distal ends of the extensions. 2. The multiport of claim 1, wherein at least two of the extensions are the same lengths as one another. 3. The multiport of claim 2, wherein at least two of the extensions are different lengths from one another. 4. The multiport of claim 3, wherein the multiport comprises at least two groups of the extensions, wherein extensions within each group are the same length as one another, and wherein lengths of extensions differ between the two groups, whereby sets of ports corresponding to the two groups of extensions are staggered relative to one another from the housing. 5. The multiport of claim 4, wherein the multiport comprises three groups of extensions with four extensions in each group such that the multiport comprises twelve ports that are arranged in three staggered sets. 6. The multiport of claim 4, wherein ports within each set are coupled to one another with a collar. 7. The multiport of claim 6, wherein the housing has a face from which the extensions project, and wherein the area of the face is less than the net area of forward end-faces of the sets of ports. 8. The multiport of claim 1, wherein the enclosure comprises guides and wherein slack of the plurality of optical fibers is routed by the guides. 9. The multiport of claim 8, wherein the guides comprise round features over which the slack is routed to control bending of the slack. 10. The multiport of claim 8, wherein the slack comprises a length of optical fiber that is at least 50 millimeters. 11. The multiport of claim 8, wherein one or more of the optical fibers continuously extends between the multi-fiber connector and a respective one of the ports without splicing therebetween. 12. The multiport of claim 1, wherein the interlocking structure of the housing comprises pieces that define walls of the enclosure, and wherein edges of the pieces are mortised together to seal the enclosure. 13. The multiport of claim 1, wherein the multi-fiber connector is integrated with the housing by way of a flange interfacing a groove, the flange and groove extending around the multi-fiber connector and along an interior edge of the housing such that the interface of the flange and groove seals the integration of the multi-fiber connector with the housing and axially secures the multi-fiber connector, and wherein the flange and groove are adjoined by a pin and slot that orient the multi-fiber connector and limit rotation relative to the housing. 14. A fiber optic multiport, comprising:
a housing, wherein the housing defines an enclosure; a multi-fiber connector coupled to the housing; a plurality of optical fibers connected to and extending from the multi-fiber connector into the enclosure; extensions having a proximal end attached to the housing, the extensions projecting away from a face of the housing, wherein the extensions support sub-sets of the plurality of optical fibers; and ports connected to distal ends of the extensions, wherein the area of the face of the housing is less than the net area of forward end-faces of the ports. 15. The multiport of claim 14, wherein the multi-fiber connector is rigidly fixed directly to the housing and wherein the ports are attached to the housing by way of the extensions, which are flexible such that the extensions may bend independently of one another. 16. The multiport of claim 14, wherein the housing comprises interlocking structure that seals off the enclosures from the environment, wherein the multi-fiber connector is integrated with the housing by way of a flange interfacing a groove, the flange and groove extending around the multi-fiber connector and along an interior edge of the housing such that the interface of the flange and groove seals the integration of the multi-fiber connector with the housing and axially secures the multi-fiber connector, and wherein the flange and groove are adjoined by a pin and slot that orient that multi-fiber connector and limit rotation relative to the housing. 17. The multiport of claim 16, wherein the interlocking structure of the housing comprises pieces that define walls of the enclosure, wherein edges of the pieces are mortised together to seal the enclosure. 18. A fiber optic multiport, comprising:
a housing, wherein the housing defines an enclosure; a multi-fiber connector integrated with the housing; a plurality of optical fibers connected to and extending from the multi-fiber connector into the enclosure, one or more guides in the enclosure, wherein slack of the plurality of optical fibers is routed by the one or more guides; extensions having a proximal end attached to the housing, the extensions projecting away from the housing, wherein the extensions support sub-sets of the plurality of optical fibers, and wherein the extensions are flexible such that the extensions may bend independently of one another; and ports connected to distal ends of the extensions. 19. The multiport of claim 18, wherein the one or more guides comprise one or more round features over which the slack is routed, and wherein the slack comprises a length of optical fiber that is at least 50 millimeters. 20. The multiport of claim 19, wherein one or more of the optical fibers continuously extends between the multi-fiber connector and a respective one of the ports without splicing therebetween. | 2,800 |
11,554 | 11,554 | 14,731,857 | 2,883 | A fiber optic multiport includes a housing, a multi-fiber connector coupled to the housing, a plurality of optical fibers, extensions, and ports connected to distal ends of the extensions. The housing defines an enclosure and may seal off the enclosure from the environment. The plurality of optical fibers are connected to and extend from the multi-fiber connector into the enclosure. The extensions have proximal ends attached to the housing and the extensions project away from the housing. The extensions support sub-sets of the plurality of optical fibers, and the extensions are flexible such that the extensions may bend independently of one another. | 1. A fiber optic multiport, comprising:
a housing, wherein the housing defines an enclosure; a plurality of optical fibers extending into the enclosure; extensions having a proximal end attached to the housing, the extensions projecting away from a face of the housing, wherein the extensions support sub-sets of the plurality of optical fibers; and ports connected to distal ends of the extensions, wherein an area of the face of the housing is less than a net area of forward end-faces of the ports. 2. The multiport of claim 1, wherein the net area of forward end-faces of the ports is at least twice the area of the face of the housing. 3. The multiport of claim 1, wherein the ports are attached to the housing by way of the extensions, which are flexible such that the extensions may bend independently of one another. 4. The multiport of claim 1, further including a connector positioned on an extension. 5. The multiport of claim 1, further including a connector coupled to the housing. 6. The multiport of claim 1, wherein the housing comprises interlocking structure that seals off the enclosure from the environment. 7. The multiport of claim 1, wherein the enclosure is filled with a potting material. 8. The multiport of claim 1, wherein the housing further comprises an extension organizer. 9. A fiber optic multiport, comprising:
a housing, wherein the housing defines an enclosure with a face; a plurality of optical fibers extending into the enclosure, one or more guides in the enclosure, wherein slack of the plurality of optical fibers is routed by the one or more guides; extensions having a proximal end attached to the housing, the extensions projecting away from the housing from the face, wherein the extensions support sub-sets of the plurality of optical fibers, and wherein the extensions are flexible such that the extensions may bend independently of one another; and ports connected to distal ends of the extensions, wherein an area of the face of the housing is less than a net area of forward end-faces of the ports. 10. The multiport of claim 9, wherein the net area of forward end-faces of the ports is at least twice the area of the face of the housing. 11. The multiport of claim 9, further including a connector positioned on an extension. 12. The multiport of claim 9, further including a connector coupled to the housing. 13. The multiport of claim 9, wherein the housing comprises interlocking structure that seals off the enclosure from the environment. 14. The multiport of claim 9, wherein the enclosure is filled with a potting material. 15. The multiport of claim 9, wherein the housing further comprises an extension organizer. 16. A fiber optic multiport, comprising:
a housing, wherein the housing defines an enclosure, and wherein the housing comprises interlocking structure that seals off the enclosure from the environment; a connector; a plurality of optical fibers disposed within the enclosure; extensions having proximal ends attached to the housing, the extensions projecting away from the housing, wherein the extensions support sub-sets of the plurality of optical fibers, and wherein the extensions are flexible such that the extensions may bend independently of one another; and ports connected to distal ends of the extensions. 17. The multiport of claim 16, wherein the housing has a face from which the extensions project, and wherein the area of the face is less than the net area of forward end-faces of the sets of ports. 18. The multiport of claim 17, wherein the net area of forward end-faces of the sets of ports is at least twice the area of the face of the housing. 19. The multiport of claim 16, wherein the connector positioned on an extension. 20. The multiport of claim 16, wherein the connector coupled to the housing. 21. The multiport of claim 16, wherein the enclosure is filled with a potting material. 22. The multiport of claim 16, wherein the housing further comprises an extension organizer. 23. The multiport of claim 16, wherein the connector is integrated with the housing by way of a flange interfacing a groove, the flange and groove extending around the connector and along an interior edge of the housing such that the interface of the flange and groove seals the integration of the connector with the housing and axially secures the connector, and wherein the flange and groove are adjoined by a pin and slot that orient the multi-fiber connector and limit rotation relative to the housing. 24. A fiber optic multiport, comprising:
a housing, wherein the housing defines an enclosure and a face, and wherein the housing comprises interlocking structure that seals off the enclosure from the environment; a plurality of optical fibers extending into the enclosure; extensions having proximal ends attached to the housing, the extensions projecting away from the housing, wherein the extensions support sub-sets of the plurality of optical fibers, and wherein the extensions are flexible such that the extensions may bend independently of one another, wherein the multiport comprises at least two groups of the extensions, wherein extensions within each group are the same length as one another, and wherein lengths of extensions differ between the two groups, whereby sets of ports corresponding to the two groups of extensions are staggered relative to one another from the housing; and ports connected to distal ends of the extensions, wherein ports within each set are coupled to one another with a collar, wherein the extensions project from the face of the housing, and wherein an area of the face is less than a net area of forward end-faces of the sets of ports. 25. The multiport of claim 24, wherein at least two of the extensions are the same lengths as one another. 26. The multiport of claim 24, wherein the net area of forward end-faces of the sets of ports is at least twice the area of the face of the housing. | A fiber optic multiport includes a housing, a multi-fiber connector coupled to the housing, a plurality of optical fibers, extensions, and ports connected to distal ends of the extensions. The housing defines an enclosure and may seal off the enclosure from the environment. The plurality of optical fibers are connected to and extend from the multi-fiber connector into the enclosure. The extensions have proximal ends attached to the housing and the extensions project away from the housing. The extensions support sub-sets of the plurality of optical fibers, and the extensions are flexible such that the extensions may bend independently of one another.1. A fiber optic multiport, comprising:
a housing, wherein the housing defines an enclosure; a plurality of optical fibers extending into the enclosure; extensions having a proximal end attached to the housing, the extensions projecting away from a face of the housing, wherein the extensions support sub-sets of the plurality of optical fibers; and ports connected to distal ends of the extensions, wherein an area of the face of the housing is less than a net area of forward end-faces of the ports. 2. The multiport of claim 1, wherein the net area of forward end-faces of the ports is at least twice the area of the face of the housing. 3. The multiport of claim 1, wherein the ports are attached to the housing by way of the extensions, which are flexible such that the extensions may bend independently of one another. 4. The multiport of claim 1, further including a connector positioned on an extension. 5. The multiport of claim 1, further including a connector coupled to the housing. 6. The multiport of claim 1, wherein the housing comprises interlocking structure that seals off the enclosure from the environment. 7. The multiport of claim 1, wherein the enclosure is filled with a potting material. 8. The multiport of claim 1, wherein the housing further comprises an extension organizer. 9. A fiber optic multiport, comprising:
a housing, wherein the housing defines an enclosure with a face; a plurality of optical fibers extending into the enclosure, one or more guides in the enclosure, wherein slack of the plurality of optical fibers is routed by the one or more guides; extensions having a proximal end attached to the housing, the extensions projecting away from the housing from the face, wherein the extensions support sub-sets of the plurality of optical fibers, and wherein the extensions are flexible such that the extensions may bend independently of one another; and ports connected to distal ends of the extensions, wherein an area of the face of the housing is less than a net area of forward end-faces of the ports. 10. The multiport of claim 9, wherein the net area of forward end-faces of the ports is at least twice the area of the face of the housing. 11. The multiport of claim 9, further including a connector positioned on an extension. 12. The multiport of claim 9, further including a connector coupled to the housing. 13. The multiport of claim 9, wherein the housing comprises interlocking structure that seals off the enclosure from the environment. 14. The multiport of claim 9, wherein the enclosure is filled with a potting material. 15. The multiport of claim 9, wherein the housing further comprises an extension organizer. 16. A fiber optic multiport, comprising:
a housing, wherein the housing defines an enclosure, and wherein the housing comprises interlocking structure that seals off the enclosure from the environment; a connector; a plurality of optical fibers disposed within the enclosure; extensions having proximal ends attached to the housing, the extensions projecting away from the housing, wherein the extensions support sub-sets of the plurality of optical fibers, and wherein the extensions are flexible such that the extensions may bend independently of one another; and ports connected to distal ends of the extensions. 17. The multiport of claim 16, wherein the housing has a face from which the extensions project, and wherein the area of the face is less than the net area of forward end-faces of the sets of ports. 18. The multiport of claim 17, wherein the net area of forward end-faces of the sets of ports is at least twice the area of the face of the housing. 19. The multiport of claim 16, wherein the connector positioned on an extension. 20. The multiport of claim 16, wherein the connector coupled to the housing. 21. The multiport of claim 16, wherein the enclosure is filled with a potting material. 22. The multiport of claim 16, wherein the housing further comprises an extension organizer. 23. The multiport of claim 16, wherein the connector is integrated with the housing by way of a flange interfacing a groove, the flange and groove extending around the connector and along an interior edge of the housing such that the interface of the flange and groove seals the integration of the connector with the housing and axially secures the connector, and wherein the flange and groove are adjoined by a pin and slot that orient the multi-fiber connector and limit rotation relative to the housing. 24. A fiber optic multiport, comprising:
a housing, wherein the housing defines an enclosure and a face, and wherein the housing comprises interlocking structure that seals off the enclosure from the environment; a plurality of optical fibers extending into the enclosure; extensions having proximal ends attached to the housing, the extensions projecting away from the housing, wherein the extensions support sub-sets of the plurality of optical fibers, and wherein the extensions are flexible such that the extensions may bend independently of one another, wherein the multiport comprises at least two groups of the extensions, wherein extensions within each group are the same length as one another, and wherein lengths of extensions differ between the two groups, whereby sets of ports corresponding to the two groups of extensions are staggered relative to one another from the housing; and ports connected to distal ends of the extensions, wherein ports within each set are coupled to one another with a collar, wherein the extensions project from the face of the housing, and wherein an area of the face is less than a net area of forward end-faces of the sets of ports. 25. The multiport of claim 24, wherein at least two of the extensions are the same lengths as one another. 26. The multiport of claim 24, wherein the net area of forward end-faces of the sets of ports is at least twice the area of the face of the housing. | 2,800 |
11,555 | 11,555 | 15,772,487 | 2,849 | A printed circuit board (PCB) includes one or more voltage rails and an integrated voltage regulator (IVR) electrically coupled to supply current to a voltage rail. The PCB also includes a PCB current source electrically coupled to supply a supplementary current to the voltage rail. | 1. A printed circuit board (PCB), comprising:
one or more voltage rails; an integrated voltage regulator (IVR) electrically coupled to supply current to a voltage rail; and a PCB current source electrically coupled to supply a supplementary current to the voltage rail. 2. The PCB of claim 1, wherein a magnitude of current supplied to the voltage rail by the IVR is reduced by a magnitude of supplementary current provided by the PCB current source. 3. The PCB of claim 1, wherein the IVR comprises one or more pins to couple to the PCB current source. 4. The PCB of claim 3, wherein the PCB current source provides the supplemental current to the voltage rail via the one or more pins. 5. The PCB of claim 1, wherein the PCB current source comprises:
a switching power converter to generate the supplemental current; and control logic to control delivery of the supplemental current by the switching power regulator to the voltage rail. 6. The PCB of claim 5, wherein the control logic comprises a voltage sensor to monitor a voltage provided by the IVR. 7. The PCB of claim 6, wherein the current supplied by the PCB current source is varied as a function of the voltage provided by the IVR that is sensed by the voltage sensor. 8. The PCB of claim 5, wherein the control logic receives one or more signals to supply the supplemental current from IC die power management circuitry. 9. The PCB of claim 5, wherein the control logic is coupled to IC control pins to receive one or more signals to supply the supplemental current from IC die power management circuitry. 10. A printed circuit board (PCB) current source, comprising:
a power converter to generate a supplemental current source to a voltage rail coupled to an integrated voltage regulator (IVR); and control logic to control delivery of the supplemental current by the power regulator to the voltage rail. 11. The PCB current source of claim 10, wherein the control logic comprises a voltage sensor to monitor a voltage provided by the IVR. 12. The PCB current source of claim 11, wherein the current supplied by the PCB current source is varied as a function of the voltage provided by the IVR that is sensed by the voltage sensor. 13. The PCB current source of claim 10, wherein the control logic receives one or more signals to supply the supplemental current from IC die power management circuitry. 14. The PCB current source of claim 10, wherein the control logic is coupled to IC control pins to receive one or more signals to supply the supplemental current from IC die power management circuitry. 15. An integrated voltage regulator (IVR) electrically, comprising:
a first set of pins electrically coupled to supply current to a voltage rail; and a second set of pins coupled to receive a supplemental current from an external current source. 16. The IVR of claim 15, wherein the supplemental current is supplied to the voltage rail. 17. The IVR of claim 15, wherein a magnitude of current supplied to the voltage rail by the IVR is reduced by a magnitude of supplementary current provided by the external current source. 18. The IVR of claim 17 further comprising:
a first phase to supply the current to the power rail; and
second phase to supply the current to the power rail. 19. A printed circuit board (PCB), comprising:
a voltage regulator; an integrated circuit (IC) die coupled to the voltage regulator, including:
one or more voltage rails; and
an integrated voltage regulator (IVR) electrically coupled to supply current to a voltage rail; and
a PCB current source electrically coupled to supply a supplementary current to the voltage rail. 20. The PCB of claim 19, wherein a magnitude of current supplied to the voltage rail by the IVR is reduced by a magnitude of supplementary current provided by the PCB current source. 21. The PCB of claim 19, wherein the IVR comprises one or more pins to couple to the PCB current source. 22. The PCB of claim 21, wherein the PCB current source provides the supplemental current to the voltage rail via the one or more pins. 23. The PCB of claim 19, wherein the PCB current source comprises:
a switching power converter to generate the supplemental current; and control logic to control delivery of the supplemental current by the switching power regulator to the voltage rail. 24. The PCB of claim 23, wherein the control logic comprises a voltage sensor to monitor a voltage provided by the IVR. | A printed circuit board (PCB) includes one or more voltage rails and an integrated voltage regulator (IVR) electrically coupled to supply current to a voltage rail. The PCB also includes a PCB current source electrically coupled to supply a supplementary current to the voltage rail.1. A printed circuit board (PCB), comprising:
one or more voltage rails; an integrated voltage regulator (IVR) electrically coupled to supply current to a voltage rail; and a PCB current source electrically coupled to supply a supplementary current to the voltage rail. 2. The PCB of claim 1, wherein a magnitude of current supplied to the voltage rail by the IVR is reduced by a magnitude of supplementary current provided by the PCB current source. 3. The PCB of claim 1, wherein the IVR comprises one or more pins to couple to the PCB current source. 4. The PCB of claim 3, wherein the PCB current source provides the supplemental current to the voltage rail via the one or more pins. 5. The PCB of claim 1, wherein the PCB current source comprises:
a switching power converter to generate the supplemental current; and control logic to control delivery of the supplemental current by the switching power regulator to the voltage rail. 6. The PCB of claim 5, wherein the control logic comprises a voltage sensor to monitor a voltage provided by the IVR. 7. The PCB of claim 6, wherein the current supplied by the PCB current source is varied as a function of the voltage provided by the IVR that is sensed by the voltage sensor. 8. The PCB of claim 5, wherein the control logic receives one or more signals to supply the supplemental current from IC die power management circuitry. 9. The PCB of claim 5, wherein the control logic is coupled to IC control pins to receive one or more signals to supply the supplemental current from IC die power management circuitry. 10. A printed circuit board (PCB) current source, comprising:
a power converter to generate a supplemental current source to a voltage rail coupled to an integrated voltage regulator (IVR); and control logic to control delivery of the supplemental current by the power regulator to the voltage rail. 11. The PCB current source of claim 10, wherein the control logic comprises a voltage sensor to monitor a voltage provided by the IVR. 12. The PCB current source of claim 11, wherein the current supplied by the PCB current source is varied as a function of the voltage provided by the IVR that is sensed by the voltage sensor. 13. The PCB current source of claim 10, wherein the control logic receives one or more signals to supply the supplemental current from IC die power management circuitry. 14. The PCB current source of claim 10, wherein the control logic is coupled to IC control pins to receive one or more signals to supply the supplemental current from IC die power management circuitry. 15. An integrated voltage regulator (IVR) electrically, comprising:
a first set of pins electrically coupled to supply current to a voltage rail; and a second set of pins coupled to receive a supplemental current from an external current source. 16. The IVR of claim 15, wherein the supplemental current is supplied to the voltage rail. 17. The IVR of claim 15, wherein a magnitude of current supplied to the voltage rail by the IVR is reduced by a magnitude of supplementary current provided by the external current source. 18. The IVR of claim 17 further comprising:
a first phase to supply the current to the power rail; and
second phase to supply the current to the power rail. 19. A printed circuit board (PCB), comprising:
a voltage regulator; an integrated circuit (IC) die coupled to the voltage regulator, including:
one or more voltage rails; and
an integrated voltage regulator (IVR) electrically coupled to supply current to a voltage rail; and
a PCB current source electrically coupled to supply a supplementary current to the voltage rail. 20. The PCB of claim 19, wherein a magnitude of current supplied to the voltage rail by the IVR is reduced by a magnitude of supplementary current provided by the PCB current source. 21. The PCB of claim 19, wherein the IVR comprises one or more pins to couple to the PCB current source. 22. The PCB of claim 21, wherein the PCB current source provides the supplemental current to the voltage rail via the one or more pins. 23. The PCB of claim 19, wherein the PCB current source comprises:
a switching power converter to generate the supplemental current; and control logic to control delivery of the supplemental current by the switching power regulator to the voltage rail. 24. The PCB of claim 23, wherein the control logic comprises a voltage sensor to monitor a voltage provided by the IVR. | 2,800 |
11,556 | 11,556 | 14,494,982 | 2,839 | Example embodiments of the systems and methods of CCM primary-side regulation disclosed herein subtract an estimate of the secondary IR drop from each output voltage sample. This allows a fixed sample instant to be set (with regard to the beginning of the off or flyback interval), and removes the need to hunt for or adjust to an optimum sample instant, or one with minimum IR drop error. The estimate of the IR drop may be adjusted on a cycle-by-cycle basis, based on the commanded primary peak current, knowing that the peak secondary current will be directly proportional by the turns ratio of the transformer. For improved accuracy, an adjustment may be made for the decay of secondary current during the delay to the sample instant, if the inductance value is known. | 1. A system comprising:
a voltage converter comprising a flyback transformer with at least a primary winding, a secondary winding and a dedicated bias/sense winding; a primary side switch; and a flyback controller configured to sample an output voltage at a fixed time during a secondary decay period and modulate the primary switch based on an adjustment to the sampled output voltage. 2. The system of claim 1, wherein the output voltage is sampled in continuous conduction mode. 3. The system of claim 1, wherein the adjustment comprises a prediction of offset error in sensed bias winding voltage. 4. The system of claim 3, wherein the offset error in sensed bias winding voltage comprises an equivalent series resistance of an output capacitor, an effective resistance of an output rectifier, and a winding resistive drop due to flow of secondary current. 5. The system of claim 1, wherein the flyback controller comprises memory comprising instructions for adjusting the modulation of the switch using a look up table. 6. The system of claim 1, wherein the sampled output voltage is derived from the bias/sense winding. 7. The system of claim 1, wherein the sampled output voltage is derived from the primary winding. 8. A method comprising:
sampling an output voltage of a flyback voltage converter; adjusting a reference based on a predicted error in the sensed output voltage; and modulating at least one of a switching frequency and a peak current based on power demand. 9. The method of claim 8, further comprising sampling the output voltage in continuous conduction mode. 10. The method of claim 8, wherein the predicted error comprises an error due to an equivalent series resistance of an output capacitor, an effective resistance of an output rectifier, and a resistive drop due to flow of secondary current. 11. The method of claim 8, wherein the sensed output voltage is derived from a sense winding on a flyback transformer. 12. The method of claim 8, wherein the sensed output voltage is derived from a primary winding on a flyback transformer. 13. The method of claim 11, further comprising modulating the switching frequency or peak current using a lookup table. 14. The method of claim 8, further comprising estimating a secondary resistance by adjusting commanded peak primary current from a low level to a high level for at least one switching cycle and determining a delta in successive output voltage samples. 15. A voltage converter module comprising:
a flyback transformer with at least a primary winding, a secondary winding, and a dedicated bias/sense winding; a primary side switch; and a flyback controller configured to sample an output voltage at a fixed time during a secondary decay period and modulate the primary switch based on an adjustment to the sampled output voltage. 16. The voltage converter module of claim 15, wherein the output voltage is sampled in continuous conduction mode. 17. The voltage converter module of claim 15, wherein the adjustment comprises a prediction of offset error in sensed bias winding voltage. 18. The voltage converter module of claim 17, wherein the offset error in sensed bias winding voltage comprises an equivalent series resistance of an output capacitor, an effective resistance of an output rectifier, and a resistive drop due to flow of secondary current. 19. The system of claim 15, wherein the sensed output voltage is derived from at least one of the primary winding and the sense winding. 20. The system of claim 15, wherein the flyback controller comprises memory comprising instructions for adjusting the modulation of the switch using a look up table. | Example embodiments of the systems and methods of CCM primary-side regulation disclosed herein subtract an estimate of the secondary IR drop from each output voltage sample. This allows a fixed sample instant to be set (with regard to the beginning of the off or flyback interval), and removes the need to hunt for or adjust to an optimum sample instant, or one with minimum IR drop error. The estimate of the IR drop may be adjusted on a cycle-by-cycle basis, based on the commanded primary peak current, knowing that the peak secondary current will be directly proportional by the turns ratio of the transformer. For improved accuracy, an adjustment may be made for the decay of secondary current during the delay to the sample instant, if the inductance value is known.1. A system comprising:
a voltage converter comprising a flyback transformer with at least a primary winding, a secondary winding and a dedicated bias/sense winding; a primary side switch; and a flyback controller configured to sample an output voltage at a fixed time during a secondary decay period and modulate the primary switch based on an adjustment to the sampled output voltage. 2. The system of claim 1, wherein the output voltage is sampled in continuous conduction mode. 3. The system of claim 1, wherein the adjustment comprises a prediction of offset error in sensed bias winding voltage. 4. The system of claim 3, wherein the offset error in sensed bias winding voltage comprises an equivalent series resistance of an output capacitor, an effective resistance of an output rectifier, and a winding resistive drop due to flow of secondary current. 5. The system of claim 1, wherein the flyback controller comprises memory comprising instructions for adjusting the modulation of the switch using a look up table. 6. The system of claim 1, wherein the sampled output voltage is derived from the bias/sense winding. 7. The system of claim 1, wherein the sampled output voltage is derived from the primary winding. 8. A method comprising:
sampling an output voltage of a flyback voltage converter; adjusting a reference based on a predicted error in the sensed output voltage; and modulating at least one of a switching frequency and a peak current based on power demand. 9. The method of claim 8, further comprising sampling the output voltage in continuous conduction mode. 10. The method of claim 8, wherein the predicted error comprises an error due to an equivalent series resistance of an output capacitor, an effective resistance of an output rectifier, and a resistive drop due to flow of secondary current. 11. The method of claim 8, wherein the sensed output voltage is derived from a sense winding on a flyback transformer. 12. The method of claim 8, wherein the sensed output voltage is derived from a primary winding on a flyback transformer. 13. The method of claim 11, further comprising modulating the switching frequency or peak current using a lookup table. 14. The method of claim 8, further comprising estimating a secondary resistance by adjusting commanded peak primary current from a low level to a high level for at least one switching cycle and determining a delta in successive output voltage samples. 15. A voltage converter module comprising:
a flyback transformer with at least a primary winding, a secondary winding, and a dedicated bias/sense winding; a primary side switch; and a flyback controller configured to sample an output voltage at a fixed time during a secondary decay period and modulate the primary switch based on an adjustment to the sampled output voltage. 16. The voltage converter module of claim 15, wherein the output voltage is sampled in continuous conduction mode. 17. The voltage converter module of claim 15, wherein the adjustment comprises a prediction of offset error in sensed bias winding voltage. 18. The voltage converter module of claim 17, wherein the offset error in sensed bias winding voltage comprises an equivalent series resistance of an output capacitor, an effective resistance of an output rectifier, and a resistive drop due to flow of secondary current. 19. The system of claim 15, wherein the sensed output voltage is derived from at least one of the primary winding and the sense winding. 20. The system of claim 15, wherein the flyback controller comprises memory comprising instructions for adjusting the modulation of the switch using a look up table. | 2,800 |
11,557 | 11,557 | 14,957,836 | 2,842 | A combination receptacle including a wireless power transmitter electrically coupled to a power source, wherein the wireless power transmitter is structured to receive power from the power source and to wirelessly transmit said power, a socket electrically coupled to the power source, wherein the socket is structured to receive power from the power source and to physically and electrically connect to a power cord to provide the power to a wired device electrically coupled to the power cord, and an enclosure structured to house the wireless power transmitter and the socket. | 1. A combination receptacle, comprising:
a wireless power transmitter electrically coupled to a power source, wherein the wireless power transmitter is structured to receive power from the power source and to wirelessly transmit said power; a socket electrically coupled to the power source, wherein the socket is structured to receive power from the power source and to physically and electrically connect to a power cord to provide the power to a wired device electrically coupled to the power cord; and an enclosure structured to house the wireless power transmitter and the socket. 2. The combination receptacle of claim 1, further comprising:
terminals structured to electrically couple to the power source, wherein the wireless power transmitter and the socket are structured to receive power from the power source via the terminals. 3. The combination receptacle of claim 2, wherein the terminals are wire leads. 4. The combination receptacle of claim 1, wherein the wireless power transmitter includes transmitter coil and a transmitter power converter; and wherein the transmitter power converter is structured to convert the power from the power source for wireless transmission via the transmitter coil. 5. The combination receptacle of claim 4, wherein the wireless power transmitter includes a second enclosure structured to house the transmitter coil and the transmitter power converter. 6. The combination receptacle of claim 1, further comprising:
a pair of brackets coupled to the enclosure at a top portion thereof and a bottom portion thereof, respectively, and wherein the pair of brackets are structured to couple the combination receptacle to an electrical box. 7. The combination receptacle of claim 1, wherein the power source is an alternating current power source. 8. The combination receptacle of claim 7, wherein the power source is a 120 VAC alternating current power source. 9. A wireless power system, comprising:
a power source; and a combination receptacle including:
a wireless power transmitter electrically coupled to the power source, wherein the wireless power transmitter is structured to receive power from the power source and to wirelessly transmit said power;
a socket electrically coupled to the power source, wherein the socket is structured to receive power from the power source and to physically and electrically connect to a power cord to provide power via the power cord; and
an enclosure structured to house the wireless power transmitter and the socket. 10. The wireless power system of claim 9, further comprising:
a wired device structured to receive power from the socket via the power cord; and a wireless device structured to receive power wirelessly transmitted from the wireless power transmitter, wherein the wireless device includes a wireless power transmitter integrated into the wireless device and being structured to receive the wireless power transmitted from the wireless power transmitter. 11. The wireless power system of claim 10, wherein the wireless device is a smartphone. 12. The wireless power system of claim 9, further comprising:
a first wired device structured to receive power from the socket via the power cord; a wireless power receiver structured to receive the wireless power transmitted from the wireless power transmitted; and a second wired device structured to electrically connect to the wireless receive power from the wireless receiver via a wired connection and to receive power from the wireless power receiver via the wired connection. 13. The wireless power system of claim 12, wherein the wired connection includes a universal serial bus connector or a lightning connector. 14. The wireless power system of claim 12, wherein the wireless power receiver is an adapter; and wherein the second wired device is a smartphone. 15. The wireless power system of claim 9, wherein the combination receptacle further comprises:
terminals structured to electrically couple to the power source, and wherein the wireless power transmitter and the socket are structured to receive power from the power source via the terminals. 16. The wireless power system of claim 15, wherein the terminals are wire leads. 17. The wireless power system of claim 9, wherein the wireless power transmitter includes transmitter coil and a transmitter power converter; and wherein the transmitter power converter is structured to convert the power from the power source for wireless transmission via the transmitter coil. 18. The wireless power system of claim 17, wherein the wireless power transmitter includes a second enclosure structured to house the transmitter coil and the transmitter power converter. 19. The wireless power system of claim 9, wherein the combination receptacle of claim 1, further comprises:
a pair of brackets coupled to the enclosure at a top portion thereof and a bottom portion thereof, respectively, wherein the pair of brackets are structured to couple the combination receptacle to an electrical box. 20. The wireless power system of claim 9, wherein the power source is an alternating current power source. | A combination receptacle including a wireless power transmitter electrically coupled to a power source, wherein the wireless power transmitter is structured to receive power from the power source and to wirelessly transmit said power, a socket electrically coupled to the power source, wherein the socket is structured to receive power from the power source and to physically and electrically connect to a power cord to provide the power to a wired device electrically coupled to the power cord, and an enclosure structured to house the wireless power transmitter and the socket.1. A combination receptacle, comprising:
a wireless power transmitter electrically coupled to a power source, wherein the wireless power transmitter is structured to receive power from the power source and to wirelessly transmit said power; a socket electrically coupled to the power source, wherein the socket is structured to receive power from the power source and to physically and electrically connect to a power cord to provide the power to a wired device electrically coupled to the power cord; and an enclosure structured to house the wireless power transmitter and the socket. 2. The combination receptacle of claim 1, further comprising:
terminals structured to electrically couple to the power source, wherein the wireless power transmitter and the socket are structured to receive power from the power source via the terminals. 3. The combination receptacle of claim 2, wherein the terminals are wire leads. 4. The combination receptacle of claim 1, wherein the wireless power transmitter includes transmitter coil and a transmitter power converter; and wherein the transmitter power converter is structured to convert the power from the power source for wireless transmission via the transmitter coil. 5. The combination receptacle of claim 4, wherein the wireless power transmitter includes a second enclosure structured to house the transmitter coil and the transmitter power converter. 6. The combination receptacle of claim 1, further comprising:
a pair of brackets coupled to the enclosure at a top portion thereof and a bottom portion thereof, respectively, and wherein the pair of brackets are structured to couple the combination receptacle to an electrical box. 7. The combination receptacle of claim 1, wherein the power source is an alternating current power source. 8. The combination receptacle of claim 7, wherein the power source is a 120 VAC alternating current power source. 9. A wireless power system, comprising:
a power source; and a combination receptacle including:
a wireless power transmitter electrically coupled to the power source, wherein the wireless power transmitter is structured to receive power from the power source and to wirelessly transmit said power;
a socket electrically coupled to the power source, wherein the socket is structured to receive power from the power source and to physically and electrically connect to a power cord to provide power via the power cord; and
an enclosure structured to house the wireless power transmitter and the socket. 10. The wireless power system of claim 9, further comprising:
a wired device structured to receive power from the socket via the power cord; and a wireless device structured to receive power wirelessly transmitted from the wireless power transmitter, wherein the wireless device includes a wireless power transmitter integrated into the wireless device and being structured to receive the wireless power transmitted from the wireless power transmitter. 11. The wireless power system of claim 10, wherein the wireless device is a smartphone. 12. The wireless power system of claim 9, further comprising:
a first wired device structured to receive power from the socket via the power cord; a wireless power receiver structured to receive the wireless power transmitted from the wireless power transmitted; and a second wired device structured to electrically connect to the wireless receive power from the wireless receiver via a wired connection and to receive power from the wireless power receiver via the wired connection. 13. The wireless power system of claim 12, wherein the wired connection includes a universal serial bus connector or a lightning connector. 14. The wireless power system of claim 12, wherein the wireless power receiver is an adapter; and wherein the second wired device is a smartphone. 15. The wireless power system of claim 9, wherein the combination receptacle further comprises:
terminals structured to electrically couple to the power source, and wherein the wireless power transmitter and the socket are structured to receive power from the power source via the terminals. 16. The wireless power system of claim 15, wherein the terminals are wire leads. 17. The wireless power system of claim 9, wherein the wireless power transmitter includes transmitter coil and a transmitter power converter; and wherein the transmitter power converter is structured to convert the power from the power source for wireless transmission via the transmitter coil. 18. The wireless power system of claim 17, wherein the wireless power transmitter includes a second enclosure structured to house the transmitter coil and the transmitter power converter. 19. The wireless power system of claim 9, wherein the combination receptacle of claim 1, further comprises:
a pair of brackets coupled to the enclosure at a top portion thereof and a bottom portion thereof, respectively, wherein the pair of brackets are structured to couple the combination receptacle to an electrical box. 20. The wireless power system of claim 9, wherein the power source is an alternating current power source. | 2,800 |
11,558 | 11,558 | 14,433,555 | 2,837 | Provided is a magneto-impedance element (an MI element) which can attain an increase in output power and size reduction. In the MI element of the present invention, a detection coil ( 13 ) winding around a magneto-sensitive wire ( 12 ) provided above a substrate ( 11 ) comprises a first wiring part ( 131 ) comprising film-shaped electrically conductive bodies formed along a flat surface of the substrate and crossing the magneto-sensitive wire; a second wiring part ( 132 ) comprising film-shaped electrically conductive bodies formed on an opposite side of the magneto-sensitive wire to the first wiring part and crossing the magneto-sensitive wire; and a connecting part ( 133, 134 ) comprising columnar or tubular electrically conductive bodies surrounded by an electrically insulating part at both lateral sides of the magneto-sensitive wire and extending in a normal direction of the substrate so as to connect predetermined positions of the first wiring part and those of the second wiring part. Upon providing the connecting part, the wiring parts can be formed with a high resolution and the MI element can attain both a fine pitch of a detection coil, that is, an increase in output power and size reduction. | 1. A magneto-impedance element, comprising
a substrate; a magneto-sensitive wire provided above the substrate; a detection coil winding around the magneto-sensitive wire; and an electrically insulating part fixing the magneto-sensitive wire and the detection coil; wherein the detection coil has
a first wiring part comprising film-shaped electrically conductive bodies formed along a flat surface of the substrate and crossing the magneto-sensitive wire;
a second wiring part comprising film-shaped electrically conductive bodies formed on an opposite side of the magneto-sensitive wire to the first wiring part and crossing the magneto-sensitive wire; and
a connecting part comprising columnar or tubular electrically conductive bodies surrounded by the electrically insulating part at both lateral sides of the magneto-sensitive wire and extending in a normal direction of the substrate so as to connect predetermined positions of the first wiring part and those of the second wiring part. 2. The magneto-impedance element according to claim 1, wherein the second wiring part is formed approximately in parallel with the flat surface of the substrate. 3. The magneto-impedance element according to claim 1, wherein
the electrically insulating part comprises a first insulating part formed on the first wiring part, an intermediate insulating part formed on the first insulating part and having the magneto-sensitive wire buried therein, and a second insulating part formed on the intermediate insulating part; the connecting part comprises a first connecting part penetrating the first insulating part in the normal direction of the substrate and connected to the predetermined positions of the first wiring part, an intermediate connecting part penetrating the intermediate insulating part in the normal direction of the substrate at both the lateral sides of the magneto-sensitive wire and connected to the first connecting part, and a second connecting part penetrating the second insulating part in the normal direction of the substrate and connected to the intermediate connecting part and the predetermined positions of the second wiring part; and the intermediate connecting part has a greater column or tube thickness than the first connecting part or the second connecting part. 4. The magneto-impedance element according to any one of claim 1, wherein adjacent ones of the columnar or tubular conductive bodies of the connecting part along the extending direction of the magneto-sensitive wire have different gaps with the magneto-sensitive wire. 5. A method for producing a magneto-impedance element comprising a substrate, a magneto-sensitive wire provided above the substrate, a detection coil winding around the magneto-sensitive wire, and an electrically insulating part fixing the magneto-sensitive wire and the detection coil, comprising
a first-wiring-layer forming step for forming, on a flat surface of the substrate, a first wiring layer to serve as a first wiring part comprising film-shaped electrically conductive bodies capable of crossing the magneto-sensitive wire; an intermediate-layer forming step for forming, on the first wiring layer, an intermediate layer including the electrically insulating part and a connecting part comprising columnar or tubular electrically conductive bodies penetrating the electrically insulating part located at both lateral sides of the magneto-sensitive wire in a normal direction of the substrate; and a second-wiring-layer forming step for forming, on the intermediate layer, a second wiring layer to serve as a second wiring part comprising film-shaped electrically conductive bodies crossing the magneto-sensitive wire; the detection coil being constituted by connecting predetermined positions of the first wiring part and those of the second wiring part by the connecting part. 6. The method for producing the magneto-sensitive element according to claim 5, wherein
the intermediate-layer forming step comprises
a first-insulating-layer forming step for forming a first insulating layer to serve as a first insulating part on the first wiring layer;
a connecting-part forming step for forming a first connecting part penetrating the first insulating layer in the normal direction of the substrate and connected to the predetermined positions of the first wiring part, an intermediate connecting part connected to the first connecting part and extending in the normal direction of the substrate at both the lateral sides of the magneto-sensitive wire, and a second connecting part connected to the intermediate connecting part, extending in the normal direction of the substrate and capable of being connected to the predetermined positions of the second wiring part;
an intermediate-insulating-layer forming step for forming, on the first insulating layer, an intermediate insulating layer to serve as an intermediate insulating part having the magneto-sensitive wire buried therein; and
a second-insulating-layer forming step for forming, on the intermediate insulating layer, a second insulating layer to serve as a second insulating part surrounding the second connecting part;
the first insulating layer, the intermediate insulating layer and the second insulating layer constitute the electrically insulating part; and the first connecting part, the intermediate connecting part and the second connecting part constitute the connecting part. | Provided is a magneto-impedance element (an MI element) which can attain an increase in output power and size reduction. In the MI element of the present invention, a detection coil ( 13 ) winding around a magneto-sensitive wire ( 12 ) provided above a substrate ( 11 ) comprises a first wiring part ( 131 ) comprising film-shaped electrically conductive bodies formed along a flat surface of the substrate and crossing the magneto-sensitive wire; a second wiring part ( 132 ) comprising film-shaped electrically conductive bodies formed on an opposite side of the magneto-sensitive wire to the first wiring part and crossing the magneto-sensitive wire; and a connecting part ( 133, 134 ) comprising columnar or tubular electrically conductive bodies surrounded by an electrically insulating part at both lateral sides of the magneto-sensitive wire and extending in a normal direction of the substrate so as to connect predetermined positions of the first wiring part and those of the second wiring part. Upon providing the connecting part, the wiring parts can be formed with a high resolution and the MI element can attain both a fine pitch of a detection coil, that is, an increase in output power and size reduction.1. A magneto-impedance element, comprising
a substrate; a magneto-sensitive wire provided above the substrate; a detection coil winding around the magneto-sensitive wire; and an electrically insulating part fixing the magneto-sensitive wire and the detection coil; wherein the detection coil has
a first wiring part comprising film-shaped electrically conductive bodies formed along a flat surface of the substrate and crossing the magneto-sensitive wire;
a second wiring part comprising film-shaped electrically conductive bodies formed on an opposite side of the magneto-sensitive wire to the first wiring part and crossing the magneto-sensitive wire; and
a connecting part comprising columnar or tubular electrically conductive bodies surrounded by the electrically insulating part at both lateral sides of the magneto-sensitive wire and extending in a normal direction of the substrate so as to connect predetermined positions of the first wiring part and those of the second wiring part. 2. The magneto-impedance element according to claim 1, wherein the second wiring part is formed approximately in parallel with the flat surface of the substrate. 3. The magneto-impedance element according to claim 1, wherein
the electrically insulating part comprises a first insulating part formed on the first wiring part, an intermediate insulating part formed on the first insulating part and having the magneto-sensitive wire buried therein, and a second insulating part formed on the intermediate insulating part; the connecting part comprises a first connecting part penetrating the first insulating part in the normal direction of the substrate and connected to the predetermined positions of the first wiring part, an intermediate connecting part penetrating the intermediate insulating part in the normal direction of the substrate at both the lateral sides of the magneto-sensitive wire and connected to the first connecting part, and a second connecting part penetrating the second insulating part in the normal direction of the substrate and connected to the intermediate connecting part and the predetermined positions of the second wiring part; and the intermediate connecting part has a greater column or tube thickness than the first connecting part or the second connecting part. 4. The magneto-impedance element according to any one of claim 1, wherein adjacent ones of the columnar or tubular conductive bodies of the connecting part along the extending direction of the magneto-sensitive wire have different gaps with the magneto-sensitive wire. 5. A method for producing a magneto-impedance element comprising a substrate, a magneto-sensitive wire provided above the substrate, a detection coil winding around the magneto-sensitive wire, and an electrically insulating part fixing the magneto-sensitive wire and the detection coil, comprising
a first-wiring-layer forming step for forming, on a flat surface of the substrate, a first wiring layer to serve as a first wiring part comprising film-shaped electrically conductive bodies capable of crossing the magneto-sensitive wire; an intermediate-layer forming step for forming, on the first wiring layer, an intermediate layer including the electrically insulating part and a connecting part comprising columnar or tubular electrically conductive bodies penetrating the electrically insulating part located at both lateral sides of the magneto-sensitive wire in a normal direction of the substrate; and a second-wiring-layer forming step for forming, on the intermediate layer, a second wiring layer to serve as a second wiring part comprising film-shaped electrically conductive bodies crossing the magneto-sensitive wire; the detection coil being constituted by connecting predetermined positions of the first wiring part and those of the second wiring part by the connecting part. 6. The method for producing the magneto-sensitive element according to claim 5, wherein
the intermediate-layer forming step comprises
a first-insulating-layer forming step for forming a first insulating layer to serve as a first insulating part on the first wiring layer;
a connecting-part forming step for forming a first connecting part penetrating the first insulating layer in the normal direction of the substrate and connected to the predetermined positions of the first wiring part, an intermediate connecting part connected to the first connecting part and extending in the normal direction of the substrate at both the lateral sides of the magneto-sensitive wire, and a second connecting part connected to the intermediate connecting part, extending in the normal direction of the substrate and capable of being connected to the predetermined positions of the second wiring part;
an intermediate-insulating-layer forming step for forming, on the first insulating layer, an intermediate insulating layer to serve as an intermediate insulating part having the magneto-sensitive wire buried therein; and
a second-insulating-layer forming step for forming, on the intermediate insulating layer, a second insulating layer to serve as a second insulating part surrounding the second connecting part;
the first insulating layer, the intermediate insulating layer and the second insulating layer constitute the electrically insulating part; and the first connecting part, the intermediate connecting part and the second connecting part constitute the connecting part. | 2,800 |
11,559 | 11,559 | 14,345,296 | 2,831 | An electrical contact includes a longitudinal first body portion, a longitudinal second body portion, a terminal portion, and a contact portion. The longitudinal first body portion has a terminal end, a first transition end opposite the terminal end, and a major surface generally lying in a first plane. The longitudinal second body portion has a contact end, a second transition end opposite the contact end, and a major surface generally lying in a second plane intersecting the first plane. The contact end is distal to the first transition end. The terminal portion extends from the first body portion at the terminal end. The contact portion extends from the second body portion at the contact end. | 1. An electrical contact comprising:
a longitudinal first body portion having a terminal end, a first transition end opposite the terminal end, and a major surface generally lying in a first plane; a longitudinal second body portion having a contact end, a second transition end opposite the contact end, and a major surface generally lying in a second plane intersecting the first plane, the contact end being distal to the first transition end; a terminal portion extending from the first body portion at the terminal end; and a contact portion extending from the second body portion at the contact end. 2-15. (canceled) 16. The electrical contact of claim 1, wherein an angle between the first plane and the second plane is more than about 15°. 17. The electrical contact of claim 1, wherein an angle between the first plane and the second plane is more than about 60°. 18. The electrical contact of claim 1, wherein an angle between the first plane and the second plane is about 90°. 19. The electrical contact of claim 1 further comprising a transition portion disposed between the first body portion and the second body portion. 20. The electrical contact of claim 19, wherein the transition portion is a generally U-shaped portion. 21. The electrical contact of claim 19, wherein the transition portion includes a coined portion configured to facilitate positioning of the second body portion with respect to the first body portion. 22. The electrical contact of claim 1, wherein the first body portion is configured to facilitate broadside coupling of the electrical contact, and the second body portion is configured to facilitate edge coupling of the electrical contact. 23. The electrical contact of claim 1, wherein the terminal portion is configured to provide one of a surface-mount connection and a through-hole connection. 24. The electrical contact of claim 1, wherein the second body portion is resilient. 25. An electrical connector comprising a plurality of the electrical contacts of claim 1. 26. The electrical connector of claim 25, wherein the first body portion of each electrical contact is positioned to facilitate broadside coupling between adjacent electrical contacts, and the second body portion of each electrical contact is positioned to facilitate edge coupling between adjacent electrical contacts. 27. The electrical connector of claim 25, wherein the electrical contacts are arranged in a ground-signal-signal-ground (G-S-S-G) arrangement. 28. The electrical connector of claim 25, wherein the electrical contacts are arranged in a ground-signal-ground-signal (G-S-G-S) arrangement. 29. An electrical connector comprising:
an insulative body having a front face; a tongue extending from the front face in a direction away from the insulative body, the tongue having a top tongue surface and a bottom tongue surface; and one set of electrical contacts disposed in one set of tongue slots incorporated at the top tongue surface of the tongue and another set of electrical contacts disposed in another set of tongue slots incorporated at the bottom tongue surface of the tongue, wherein the tongue slots incorporated at the bottom tongue surface are aligned to the tongue slots incorporated at the top tongue surface, and wherein each electrical contact includes:
a longitudinal first body portion having a terminal end, a first transition end opposite the terminal end, and a major surface generally lying in a first plane;
a longitudinal second body portion having a contact end, a second transition end opposite the contact end, and a major surface generally lying in a second plane intersecting the first plane, the contact end being distal to the first transition end;
a terminal portion extending from the first body portion at the terminal end; and
a contact portion extending from the second body portion at the contact end. 30. The electrical connector of claim 29 further comprising a lateral slot in the insulative body configured to receive a ground member, wherein the ground member comprises a lateral portion which is inserted into the lateral slot, a tail portion for attaching the electrical connector to a printed circuit board, and a body portion connecting the lateral portion to the tail portion. 31. The electrical connector of claim 30, wherein the lateral slot is between the one set of tongue slots and the other set of tongue slots. 32. The electrical connector of claim 30, wherein the second body portion extends substantially along a width of the lateral portion. 33. The electrical connector of claim 29, wherein the first body portion of each electrical contact is positioned to facilitate broadside coupling between adjacent electrical contacts, and the second body portion of each electrical contact is positioned to facilitate edge coupling between adjacent electrical contacts. 34. The electrical connector of claim 29, wherein the electrical contacts are arranged in a ground-signal-signal-ground (G-S-S-G) arrangement. 35. The electrical connector of claim 29, wherein the electrical contacts are arranged in a ground-signal-ground-signal (G-S-G-S) arrangement. 36. An electrical connector system comprising the electrical connector of claim 29, and a mating connector comprising:
an insulative housing having a top, a bottom, and two side walls interconnecting to define a mating slot for receiving a complementary connector; one set of electrical contacts disposed in one set of channels incorporated at the top of the insulative housing, and another set of electrical contacts disposed in another set of channels incorporated at the bottom of the insulative housing; and a shielding device located between the one set of electrical contacts and the other set of electrical contacts. 37. An electrical contact comprising:
a longitudinal first body portion configured for broadside coupling; and a longitudinal second body portion configured for edge coupling and extending from the longitudinal first body portion, such that an S21 of the electrical contact is less than about 2 dB for frequencies less than about 10 GHz. 38. An electrical contact comprising:
a longitudinal first body portion configured for broadside coupling; and a longitudinal second body portion configured for edge coupling and extending from the longitudinal first body portion, such that an impedance of the electrical contact is between about 40Ω and about 60Ω for a single ended application, and between about 80Ω and about 120Ω for a differential application. 39. An electrical contact comprising:
a longitudinal first body portion configured for broadside coupling; and a longitudinal second body portion configured for edge coupling and extending from the longitudinal first body portion, such that a crosstalk of the electrical contact is less than about −30 dB for frequencies up to about 20 GHz. 40. The electrical contact of claim 37, wherein a broader side of the longitudinal first body portion generally defines a first plane and a broader side of the longitudinal second body portion generally defines a second plane intersecting the first plane. 41. The electrical contact of claim 40 further comprising a generally U-shaped transition portion connecting the longitudinal first and second body portions, wherein a major surface of the transition portion generally lies in the first plane. 42. An electrical connector comprising a plurality of the electrical contacts of claim 37. 43. An electrical connector comprising:
an insulative body; and at least one electrical contact disposed in the insulative body and comprising:
a longitudinal first body portion configured for broadside coupling; and
a longitudinal second body portion configured for edge coupling and extending from the first body portion,
wherein the second body portion remains in a fixed position when engaged with a mating electrical contact. 44. The electrical connector of claim 43, wherein a width of the second body portion is greater than a thickness of the second body portion. 45. An electrical contact comprising:
a longitudinal first body portion configured for broadside coupling; and a longitudinal second body portion configured for edge coupling and extending transversely from the first body portion. 46. An electrical contact comprising:
a longitudinal first body portion configured for broadside coupling; and a longitudinal second body portion configured for edge coupling and extending from the first body portion, such that the first body portion is within a projected width of the second body portion when viewed from a top of the electrical contact. | An electrical contact includes a longitudinal first body portion, a longitudinal second body portion, a terminal portion, and a contact portion. The longitudinal first body portion has a terminal end, a first transition end opposite the terminal end, and a major surface generally lying in a first plane. The longitudinal second body portion has a contact end, a second transition end opposite the contact end, and a major surface generally lying in a second plane intersecting the first plane. The contact end is distal to the first transition end. The terminal portion extends from the first body portion at the terminal end. The contact portion extends from the second body portion at the contact end.1. An electrical contact comprising:
a longitudinal first body portion having a terminal end, a first transition end opposite the terminal end, and a major surface generally lying in a first plane; a longitudinal second body portion having a contact end, a second transition end opposite the contact end, and a major surface generally lying in a second plane intersecting the first plane, the contact end being distal to the first transition end; a terminal portion extending from the first body portion at the terminal end; and a contact portion extending from the second body portion at the contact end. 2-15. (canceled) 16. The electrical contact of claim 1, wherein an angle between the first plane and the second plane is more than about 15°. 17. The electrical contact of claim 1, wherein an angle between the first plane and the second plane is more than about 60°. 18. The electrical contact of claim 1, wherein an angle between the first plane and the second plane is about 90°. 19. The electrical contact of claim 1 further comprising a transition portion disposed between the first body portion and the second body portion. 20. The electrical contact of claim 19, wherein the transition portion is a generally U-shaped portion. 21. The electrical contact of claim 19, wherein the transition portion includes a coined portion configured to facilitate positioning of the second body portion with respect to the first body portion. 22. The electrical contact of claim 1, wherein the first body portion is configured to facilitate broadside coupling of the electrical contact, and the second body portion is configured to facilitate edge coupling of the electrical contact. 23. The electrical contact of claim 1, wherein the terminal portion is configured to provide one of a surface-mount connection and a through-hole connection. 24. The electrical contact of claim 1, wherein the second body portion is resilient. 25. An electrical connector comprising a plurality of the electrical contacts of claim 1. 26. The electrical connector of claim 25, wherein the first body portion of each electrical contact is positioned to facilitate broadside coupling between adjacent electrical contacts, and the second body portion of each electrical contact is positioned to facilitate edge coupling between adjacent electrical contacts. 27. The electrical connector of claim 25, wherein the electrical contacts are arranged in a ground-signal-signal-ground (G-S-S-G) arrangement. 28. The electrical connector of claim 25, wherein the electrical contacts are arranged in a ground-signal-ground-signal (G-S-G-S) arrangement. 29. An electrical connector comprising:
an insulative body having a front face; a tongue extending from the front face in a direction away from the insulative body, the tongue having a top tongue surface and a bottom tongue surface; and one set of electrical contacts disposed in one set of tongue slots incorporated at the top tongue surface of the tongue and another set of electrical contacts disposed in another set of tongue slots incorporated at the bottom tongue surface of the tongue, wherein the tongue slots incorporated at the bottom tongue surface are aligned to the tongue slots incorporated at the top tongue surface, and wherein each electrical contact includes:
a longitudinal first body portion having a terminal end, a first transition end opposite the terminal end, and a major surface generally lying in a first plane;
a longitudinal second body portion having a contact end, a second transition end opposite the contact end, and a major surface generally lying in a second plane intersecting the first plane, the contact end being distal to the first transition end;
a terminal portion extending from the first body portion at the terminal end; and
a contact portion extending from the second body portion at the contact end. 30. The electrical connector of claim 29 further comprising a lateral slot in the insulative body configured to receive a ground member, wherein the ground member comprises a lateral portion which is inserted into the lateral slot, a tail portion for attaching the electrical connector to a printed circuit board, and a body portion connecting the lateral portion to the tail portion. 31. The electrical connector of claim 30, wherein the lateral slot is between the one set of tongue slots and the other set of tongue slots. 32. The electrical connector of claim 30, wherein the second body portion extends substantially along a width of the lateral portion. 33. The electrical connector of claim 29, wherein the first body portion of each electrical contact is positioned to facilitate broadside coupling between adjacent electrical contacts, and the second body portion of each electrical contact is positioned to facilitate edge coupling between adjacent electrical contacts. 34. The electrical connector of claim 29, wherein the electrical contacts are arranged in a ground-signal-signal-ground (G-S-S-G) arrangement. 35. The electrical connector of claim 29, wherein the electrical contacts are arranged in a ground-signal-ground-signal (G-S-G-S) arrangement. 36. An electrical connector system comprising the electrical connector of claim 29, and a mating connector comprising:
an insulative housing having a top, a bottom, and two side walls interconnecting to define a mating slot for receiving a complementary connector; one set of electrical contacts disposed in one set of channels incorporated at the top of the insulative housing, and another set of electrical contacts disposed in another set of channels incorporated at the bottom of the insulative housing; and a shielding device located between the one set of electrical contacts and the other set of electrical contacts. 37. An electrical contact comprising:
a longitudinal first body portion configured for broadside coupling; and a longitudinal second body portion configured for edge coupling and extending from the longitudinal first body portion, such that an S21 of the electrical contact is less than about 2 dB for frequencies less than about 10 GHz. 38. An electrical contact comprising:
a longitudinal first body portion configured for broadside coupling; and a longitudinal second body portion configured for edge coupling and extending from the longitudinal first body portion, such that an impedance of the electrical contact is between about 40Ω and about 60Ω for a single ended application, and between about 80Ω and about 120Ω for a differential application. 39. An electrical contact comprising:
a longitudinal first body portion configured for broadside coupling; and a longitudinal second body portion configured for edge coupling and extending from the longitudinal first body portion, such that a crosstalk of the electrical contact is less than about −30 dB for frequencies up to about 20 GHz. 40. The electrical contact of claim 37, wherein a broader side of the longitudinal first body portion generally defines a first plane and a broader side of the longitudinal second body portion generally defines a second plane intersecting the first plane. 41. The electrical contact of claim 40 further comprising a generally U-shaped transition portion connecting the longitudinal first and second body portions, wherein a major surface of the transition portion generally lies in the first plane. 42. An electrical connector comprising a plurality of the electrical contacts of claim 37. 43. An electrical connector comprising:
an insulative body; and at least one electrical contact disposed in the insulative body and comprising:
a longitudinal first body portion configured for broadside coupling; and
a longitudinal second body portion configured for edge coupling and extending from the first body portion,
wherein the second body portion remains in a fixed position when engaged with a mating electrical contact. 44. The electrical connector of claim 43, wherein a width of the second body portion is greater than a thickness of the second body portion. 45. An electrical contact comprising:
a longitudinal first body portion configured for broadside coupling; and a longitudinal second body portion configured for edge coupling and extending transversely from the first body portion. 46. An electrical contact comprising:
a longitudinal first body portion configured for broadside coupling; and a longitudinal second body portion configured for edge coupling and extending from the first body portion, such that the first body portion is within a projected width of the second body portion when viewed from a top of the electrical contact. | 2,800 |
11,560 | 11,560 | 13,549,293 | 2,857 | A base unit includes a sensor calibration function. When a user communicatively couples a consumer electronic device having a sensor to the base unit, a controller at the base unit retrieves a calibration reference value for the sensor and/or a sensor algorithm that utilizes data output by the sensor. The base unit then sends the calibration reference value to the consumer electronic device to set a sensor calibration parameter associated with the sensor and/or the sensor algorithm. | 1. A method of setting a sensor calibration parameter for a sensor in a consumer electronic device, the method comprising:
communicatively coupling a base unit to a first consumer electronic device having a sensor; and setting a sensor calibration parameter of the sensor while communicatively coupled to the first consumer electronic device. 2. The method of claim 1 wherein setting a sensor calibration parameter comprises sending a calibration reference value for the sensor calibration parameter to the first consumer electronic device. 3. The method of claim 2 wherein the base unit comprises a battery charger configured to send the calibration reference value to the first consumer electronic device via an electrical connection electrically connecting the battery charger to the first consumer electronic device. 4. The method of claim 2 wherein the base unit comprises a wireless charging platform configured to wirelessly transmit the calibration reference value to the first consumer electronic device via a wireless communications link. 5. The method of claim 2 wherein the base unit comprises a dock configured to send the calibration reference value to the first electronic device via an electrical connection coupling the battery charger to the first consumer electronic device. 6. The method of claim 2 further comprising receiving the calibration reference value as user input. 7. The method of claim 2 further comprising:
receiving data transmitted by the first consumer electronic device while the first consumer electronic device is communicatively coupled to the base unit; and
obtaining the calibration reference value based on the received data. 8. The method of claim 7 wherein obtaining the calibration reference value based on the received data comprises retrieving the calibration reference value from a memory at the base unit. 9. The method of claim 7 wherein obtaining the calibration reference value comprises retrieving the calibration reference value from a network server via a communications interface at the base unit. 10. The method of claim 1 further comprising:
communicatively coupling the sensor calibration function to a second consumer electronic device having a sensor;
reading a calibration reference value from the second consumer electronic device; and
setting the sensor calibration parameter of the sensor in the first consumer electronic device based on the calibration reference value read from the second consumer electronic device while communicatively coupled to the second consumer electronic device. 11. The method of claim 1 wherein setting a sensor calibration parameter comprises sending a calibration reference value to set the sensor calibration parameter of a sensor algorithm that operates on data output by the sensor to the first consumer electronic device. 12. A base unit having a sensor calibration function, the base unit comprising:
a base configured to communicatively couple to a first consumer electronic device having a sensor; and a controller configured to set a sensor calibration parameter of the sensor while communicatively coupled to the first consumer electronic device. 13. The base unit of claim 12 wherein the controller is configured to set the sensor calibration parameter by sending a calibration reference value to the first consumer electronic device. 14. The base unit of claim 13 wherein the base unit comprises a battery charger configured to send the calibration reference value to the first consumer electronic device via an electrical connection electrically connecting the battery charger to the first consumer electronic device. 15. The base unit of claim 13 wherein the base unit comprises a wireless charging platform having a wireless transceiver, and wherein the controller is further configured to transmit the calibration reference value to the first consumer electronic device via the transceiver. 16. The base unit of claim 13 wherein the base unit comprises a dock, and wherein the controller is further configured to send the calibration reference value to the first consumer electronic device via an electrical connection connecting the dock to the first consumer electronic device. 17. The base unit of claim 13 further comprising a user interface configured to receive the calibration reference value as user input. 18. The base unit of claim 13 wherein the controller is further configured to:
receive data transmitted by the first consumer electronic device; and
obtain the calibration reference value based on the received data. 19. The base unit of claim 18 further comprising a communications interface connecting the base unit to a network server, and wherein the controller is further configured to retrieve the calibration reference value from the network server. 20. The base unit of claim 12 wherein the base unit is further configured to communicatively couple to a second consumer electronic device having a sensor, and wherein the controller is further configured to:
read a calibration reference value from the second consumer electronic device; and
set the sensor calibration parameter at the first consumer electronic device based on the calibration reference value. | A base unit includes a sensor calibration function. When a user communicatively couples a consumer electronic device having a sensor to the base unit, a controller at the base unit retrieves a calibration reference value for the sensor and/or a sensor algorithm that utilizes data output by the sensor. The base unit then sends the calibration reference value to the consumer electronic device to set a sensor calibration parameter associated with the sensor and/or the sensor algorithm.1. A method of setting a sensor calibration parameter for a sensor in a consumer electronic device, the method comprising:
communicatively coupling a base unit to a first consumer electronic device having a sensor; and setting a sensor calibration parameter of the sensor while communicatively coupled to the first consumer electronic device. 2. The method of claim 1 wherein setting a sensor calibration parameter comprises sending a calibration reference value for the sensor calibration parameter to the first consumer electronic device. 3. The method of claim 2 wherein the base unit comprises a battery charger configured to send the calibration reference value to the first consumer electronic device via an electrical connection electrically connecting the battery charger to the first consumer electronic device. 4. The method of claim 2 wherein the base unit comprises a wireless charging platform configured to wirelessly transmit the calibration reference value to the first consumer electronic device via a wireless communications link. 5. The method of claim 2 wherein the base unit comprises a dock configured to send the calibration reference value to the first electronic device via an electrical connection coupling the battery charger to the first consumer electronic device. 6. The method of claim 2 further comprising receiving the calibration reference value as user input. 7. The method of claim 2 further comprising:
receiving data transmitted by the first consumer electronic device while the first consumer electronic device is communicatively coupled to the base unit; and
obtaining the calibration reference value based on the received data. 8. The method of claim 7 wherein obtaining the calibration reference value based on the received data comprises retrieving the calibration reference value from a memory at the base unit. 9. The method of claim 7 wherein obtaining the calibration reference value comprises retrieving the calibration reference value from a network server via a communications interface at the base unit. 10. The method of claim 1 further comprising:
communicatively coupling the sensor calibration function to a second consumer electronic device having a sensor;
reading a calibration reference value from the second consumer electronic device; and
setting the sensor calibration parameter of the sensor in the first consumer electronic device based on the calibration reference value read from the second consumer electronic device while communicatively coupled to the second consumer electronic device. 11. The method of claim 1 wherein setting a sensor calibration parameter comprises sending a calibration reference value to set the sensor calibration parameter of a sensor algorithm that operates on data output by the sensor to the first consumer electronic device. 12. A base unit having a sensor calibration function, the base unit comprising:
a base configured to communicatively couple to a first consumer electronic device having a sensor; and a controller configured to set a sensor calibration parameter of the sensor while communicatively coupled to the first consumer electronic device. 13. The base unit of claim 12 wherein the controller is configured to set the sensor calibration parameter by sending a calibration reference value to the first consumer electronic device. 14. The base unit of claim 13 wherein the base unit comprises a battery charger configured to send the calibration reference value to the first consumer electronic device via an electrical connection electrically connecting the battery charger to the first consumer electronic device. 15. The base unit of claim 13 wherein the base unit comprises a wireless charging platform having a wireless transceiver, and wherein the controller is further configured to transmit the calibration reference value to the first consumer electronic device via the transceiver. 16. The base unit of claim 13 wherein the base unit comprises a dock, and wherein the controller is further configured to send the calibration reference value to the first consumer electronic device via an electrical connection connecting the dock to the first consumer electronic device. 17. The base unit of claim 13 further comprising a user interface configured to receive the calibration reference value as user input. 18. The base unit of claim 13 wherein the controller is further configured to:
receive data transmitted by the first consumer electronic device; and
obtain the calibration reference value based on the received data. 19. The base unit of claim 18 further comprising a communications interface connecting the base unit to a network server, and wherein the controller is further configured to retrieve the calibration reference value from the network server. 20. The base unit of claim 12 wherein the base unit is further configured to communicatively couple to a second consumer electronic device having a sensor, and wherein the controller is further configured to:
read a calibration reference value from the second consumer electronic device; and
set the sensor calibration parameter at the first consumer electronic device based on the calibration reference value. | 2,800 |
11,561 | 11,561 | 16,023,277 | 2,849 | Several circuits and methods for transferring an input data signal in a digital isolator are disclosed. In an embodiment, the digital isolator includes an isolation element, input circuit, and output circuit. The isolation element includes at least one input node and at least one output node, the input circuit is electronically coupled to the input node and generates modulated differential data signals based on modulating the input data signal on a carrier signal. The input circuit operates using a first supply voltage with respect to a first ground. The output circuit is electronically coupled to the output node to receive the modulated differential data signals, operates using a second supply voltage with respect to a second ground and includes a frequency-shift keying demodulator configured to generate a demodulated data signal in response to detection of presence of the carrier signal. The output circuit further generates an output data signal. | 1. An output circuit for use in an isolation device, the output circuit comprising:
a filter circuit including:
a filter input;
a filter output;
a first resistor coupled between the filter input and an output ground node;
a capacitor coupled between the filter input and the filter output; and
a second resistor coupled between the filter output and an output supply node; and
a demodulation circuit coupled to the filter output. 2. The output circuit of claim 1, wherein:
the filter input includes first and second filter inputs; the filter output includes first and second filter outputs; the first resistor includes: a third resistor coupled between the first filter input and the output ground node, and a fourth resistor coupled between the second filter input and the output ground node; the capacitor includes: a first capacitor coupled between the first filter input and the first filter output, and a second capacitor coupled between the second filter input and the second filter output; and the second resistor includes: a fifth resistor coupled between the first filter output and the output supply node, and a sixth resistor coupled between the second filter output and the output supply node. 3. The output circuit of claim 2, further comprising:
an amplifier coupled between the filter circuit and the demodulation circuit, the amplifier including:
a first input coupled to the first filter output;
a second input coupled to the second filter output; and
an output coupled to the demodulation circuit. 4. The output circuit of claim 1, wherein the demodulation circuit includes a frequency-shift keying (FSK) demodulator. 5. The output circuit of claim 1, wherein the demodulation circuit includes:
a switching capacitor coupled between a switch node and the output ground node; a first switch coupled between the switch node and the output ground node; a second switch coupled between the switch node and a compensation node; a pull-up element coupled between the output supply node and the compensation node; an averaging capacitor coupled between the compensation node and the output ground node; and a comparator having a non-inverting input coupled to the compensation node, an inverting input coupled to a reference voltage node, and a demodulation output. 6. The output circuit of claim 5, wherein the pull-up element includes a pull-up resistor. 7. The output circuit of claim 5, wherein the pull-up element includes a current source. 8. The output circuit of claim 5, wherein the demodulation circuit includes:
a first reference resistor coupled between the output supply node and the reference voltage node; and a second reference resistor coupled between the reference voltage node and the output ground node. 9. The output circuit of claim 5, wherein the first switch is controlled by a first phase signal based on a modulation signal from the filter output, and the second switch is controlled by a second phase signal complementary to, and non-overlapping with, the first phase signal. 10. The output circuit of claim 9, wherein the demodulation circuit includes a break before make circuit configured to generate the first and second phase signals based on the modulation signal. 11. An output circuit for use in an isolation device, the output circuit comprising:
a filter circuit including a filter input configured to receive a modulation signal, and a filter output configured to output a filtered modulation signal; and a demodulation circuit including:
a switching capacitor coupled between a switch node and an output ground node;
a first switch, coupled between the switch node and the output ground node, and controlled by a first phase signal based on the filtered modulation signal;
a second switch, coupled between the switch node and a compensation node, and controlled by a second phase signal complementary to, and non-overlapping with, the first phase signal;
a pull-up element coupled between an output supply node and the compensation node;
an averaging capacitor coupled between the compensation node and the output ground node; and
a comparator having a non-inverting input coupled to the compensation node, an inverting input coupled to a reference voltage node, and a demodulation output. 12. The output circuit of claim 11, wherein the pull-up element includes a pull-up resistor. 13. The output circuit of claim 11, wherein the pull-up element includes a current source. 14. The output circuit of claim 11, wherein the demodulation circuit includes:
a first reference resistor coupled between the output supply node and the reference voltage node; and a second reference resistor coupled between the reference voltage node and the output ground node. 15. The output circuit of claim 11, wherein the demodulation circuit includes a break before make circuit configured to generate the first and second phase signals based on the filtered modulation signal. 16. An isolation device comprising:
an input circuit, coupled between an input supply node and an input ground node, and having an input configured to receive an input data signal, and an output configured to output a modulation signal; an isolation element having a first terminal coupled to the output of the input circuit, and a second terminal; a filter circuit including a filter input coupled to the second terminal of the isolation element, and a filter output configured to output a filtered modulation signal; and a demodulation circuit including:
a switching capacitor coupled between a switch node and an output ground node isolated from the input ground node;
a first switch, coupled between the switch node and the output ground node, and controlled by a first phase signal based on the filtered modulation signal;
a second switch, coupled between the switch node and a compensation node, and controlled by a second phase signal complementary to, and non-overlapping with, the first phase signal;
a pull-up element coupled between the compensation node and an output supply node isolated from the input supply node;
an averaging capacitor coupled between the compensation node and the output ground node; and
a comparator having a non-inverting input coupled to the compensation node, an inverting input coupled to a reference voltage node, and a demodulation output. 17. The isolation device of claim 16, wherein the pull-up element includes a pull-up resistor. 18. The isolation device of claim 16, wherein the pull-up element includes a current source. 19. The isolation device of claim 16, wherein the demodulation circuit includes:
a first reference resistor coupled between the output supply node and the reference voltage node; and a second reference resistor coupled between the reference voltage node and the output ground node. 20. The isolation device of claim 16, wherein the demodulation circuit includes a break before make circuit configured to generate the first and second phase signals based on the filtered modulation signal. | Several circuits and methods for transferring an input data signal in a digital isolator are disclosed. In an embodiment, the digital isolator includes an isolation element, input circuit, and output circuit. The isolation element includes at least one input node and at least one output node, the input circuit is electronically coupled to the input node and generates modulated differential data signals based on modulating the input data signal on a carrier signal. The input circuit operates using a first supply voltage with respect to a first ground. The output circuit is electronically coupled to the output node to receive the modulated differential data signals, operates using a second supply voltage with respect to a second ground and includes a frequency-shift keying demodulator configured to generate a demodulated data signal in response to detection of presence of the carrier signal. The output circuit further generates an output data signal.1. An output circuit for use in an isolation device, the output circuit comprising:
a filter circuit including:
a filter input;
a filter output;
a first resistor coupled between the filter input and an output ground node;
a capacitor coupled between the filter input and the filter output; and
a second resistor coupled between the filter output and an output supply node; and
a demodulation circuit coupled to the filter output. 2. The output circuit of claim 1, wherein:
the filter input includes first and second filter inputs; the filter output includes first and second filter outputs; the first resistor includes: a third resistor coupled between the first filter input and the output ground node, and a fourth resistor coupled between the second filter input and the output ground node; the capacitor includes: a first capacitor coupled between the first filter input and the first filter output, and a second capacitor coupled between the second filter input and the second filter output; and the second resistor includes: a fifth resistor coupled between the first filter output and the output supply node, and a sixth resistor coupled between the second filter output and the output supply node. 3. The output circuit of claim 2, further comprising:
an amplifier coupled between the filter circuit and the demodulation circuit, the amplifier including:
a first input coupled to the first filter output;
a second input coupled to the second filter output; and
an output coupled to the demodulation circuit. 4. The output circuit of claim 1, wherein the demodulation circuit includes a frequency-shift keying (FSK) demodulator. 5. The output circuit of claim 1, wherein the demodulation circuit includes:
a switching capacitor coupled between a switch node and the output ground node; a first switch coupled between the switch node and the output ground node; a second switch coupled between the switch node and a compensation node; a pull-up element coupled between the output supply node and the compensation node; an averaging capacitor coupled between the compensation node and the output ground node; and a comparator having a non-inverting input coupled to the compensation node, an inverting input coupled to a reference voltage node, and a demodulation output. 6. The output circuit of claim 5, wherein the pull-up element includes a pull-up resistor. 7. The output circuit of claim 5, wherein the pull-up element includes a current source. 8. The output circuit of claim 5, wherein the demodulation circuit includes:
a first reference resistor coupled between the output supply node and the reference voltage node; and a second reference resistor coupled between the reference voltage node and the output ground node. 9. The output circuit of claim 5, wherein the first switch is controlled by a first phase signal based on a modulation signal from the filter output, and the second switch is controlled by a second phase signal complementary to, and non-overlapping with, the first phase signal. 10. The output circuit of claim 9, wherein the demodulation circuit includes a break before make circuit configured to generate the first and second phase signals based on the modulation signal. 11. An output circuit for use in an isolation device, the output circuit comprising:
a filter circuit including a filter input configured to receive a modulation signal, and a filter output configured to output a filtered modulation signal; and a demodulation circuit including:
a switching capacitor coupled between a switch node and an output ground node;
a first switch, coupled between the switch node and the output ground node, and controlled by a first phase signal based on the filtered modulation signal;
a second switch, coupled between the switch node and a compensation node, and controlled by a second phase signal complementary to, and non-overlapping with, the first phase signal;
a pull-up element coupled between an output supply node and the compensation node;
an averaging capacitor coupled between the compensation node and the output ground node; and
a comparator having a non-inverting input coupled to the compensation node, an inverting input coupled to a reference voltage node, and a demodulation output. 12. The output circuit of claim 11, wherein the pull-up element includes a pull-up resistor. 13. The output circuit of claim 11, wherein the pull-up element includes a current source. 14. The output circuit of claim 11, wherein the demodulation circuit includes:
a first reference resistor coupled between the output supply node and the reference voltage node; and a second reference resistor coupled between the reference voltage node and the output ground node. 15. The output circuit of claim 11, wherein the demodulation circuit includes a break before make circuit configured to generate the first and second phase signals based on the filtered modulation signal. 16. An isolation device comprising:
an input circuit, coupled between an input supply node and an input ground node, and having an input configured to receive an input data signal, and an output configured to output a modulation signal; an isolation element having a first terminal coupled to the output of the input circuit, and a second terminal; a filter circuit including a filter input coupled to the second terminal of the isolation element, and a filter output configured to output a filtered modulation signal; and a demodulation circuit including:
a switching capacitor coupled between a switch node and an output ground node isolated from the input ground node;
a first switch, coupled between the switch node and the output ground node, and controlled by a first phase signal based on the filtered modulation signal;
a second switch, coupled between the switch node and a compensation node, and controlled by a second phase signal complementary to, and non-overlapping with, the first phase signal;
a pull-up element coupled between the compensation node and an output supply node isolated from the input supply node;
an averaging capacitor coupled between the compensation node and the output ground node; and
a comparator having a non-inverting input coupled to the compensation node, an inverting input coupled to a reference voltage node, and a demodulation output. 17. The isolation device of claim 16, wherein the pull-up element includes a pull-up resistor. 18. The isolation device of claim 16, wherein the pull-up element includes a current source. 19. The isolation device of claim 16, wherein the demodulation circuit includes:
a first reference resistor coupled between the output supply node and the reference voltage node; and a second reference resistor coupled between the reference voltage node and the output ground node. 20. The isolation device of claim 16, wherein the demodulation circuit includes a break before make circuit configured to generate the first and second phase signals based on the filtered modulation signal. | 2,800 |
11,562 | 11,562 | 15,802,268 | 2,811 | An axis conversion technique is provided for the milling of lamellae for TEM analysis that includes a sputter deposition to prevent warpage of the axis-converted lamellae. | 1. A method, comprising:
milling a semiconductor device along a first axis to form a first-axis-directed lamella; depositing the first-axis-directed lamella with a strengthening material to form a coated first-axis-directed lamella; milling the coated first axis-directed lamella along a second axis to form a second-axis-directed lamella. 2. The method of claim 1, wherein depositing the strengthening material comprises sputter depositing the strengthening material, the method further comprising:
imaging the second axis-directed lamella with transmission electron microscopy to detect a fault in the semiconductor device. 3. The method of claim 1, wherein the semiconductor device is a fin-shaped field effect transistor (FinFET), and wherein milling the semiconductor device along the first axis comprises milling parallel to a longitudinal axis of a gate such that the first-axis-directed lamella is a y-directed lamella, and wherein the sputter depositing comprises a sputter depositing with carbon. 4. The method of claim 3, wherein milling the coated first-axis-directed lamella comprises milling parallel to a longitudinal axis of a fin such that the second-axis-directed lamella is an x-directed lamella. 5. The method of claim 1, wherein the semiconductor device is a fin-shaped field effect transistor (FinFET), and wherein milling the semiconductor device along the first axis comprises milling parallel to a longitudinal axis of a fin such that the first-axis-directed lamella is an x-directed lamella. 6. The method of claim 5, wherein milling the coated first-axis-directed lamella comprises milling parallel to a longitudinal axis of a gate such that the second-axis-directed lamella is a y-directed lamella. 7. The method of claim 1, further comprising marking the first-axis-directed lamella with a marker adjacent a region-of-interest (ROI) prior to the coating. 8. The method of claim 7, wherein marking the first-axis-directed lamella with a metallic marker comprises a tungsten electron beam depositing of at least one tungsten marker. 9. The method of claim 1, wherein coating the first-axis-directed lamella comprises sputtering the first-axis-directed lamella with a metal. 10. An axis-converted lamella of a semiconductor device, comprising:
a first-axis-directed face along a region of interest (ROI) of the semiconductor device; a pair of second-axis-directed faces substantially orthogonal to the first-axis-directed face; and a strengthening material layer covering only the pair of second-axis-directed faces. 11. The axis-converted lamella of claim 10, wherein the semiconductor device is a fin-shaped field effect transistor (FinFET), and wherein the first-axis-directed face is aligned parallel to a longitudinal axis of a fin, and wherein the pair of second-axis-directed faces are aligned parallel to a longitudinal axis of a gate. 12. The axis-converted lamella of claim 10, wherein the strengthening material is a sputter-deposited strengthening material and the semiconductor device is a fin-shaped field effect transistor (FinFET), and wherein the first-axis-directed face is aligned parallel to a longitudinal axis of a gate, and wherein the pair of second-axis-directed faces are aligned parallel to a longitudinal axis of a fin. 13. The axis-converted lamella of claim 10, wherein the semiconductor device is a nanowire device. 14. The axis-converted lamella of claim 10, wherein the semiconductor device is a planar CMOS transistor. 15. An axis-converted lamella of a fin-shaped field effect transistor (FinFET), comprising;
a portion of a fin, wherein the portion has a first pair of faces that are parallel to a longitudinal axis of a gate associated with the fin and has a second pair of faces that are parallel to a longitudinal axis of the fin; and a sputter-deposited strengthening material covering the first pair of faces. 16. The axis-converted lamella of claim 15, wherein the strengthening material comprises sputter-deposited carbon. 17. The axis-converted lamella of claim 15, further comprising:
a portion of a substrate at a base of the portion of the fin; and an ion-beam deposited marker on the portion of the substrate. 18. An axis-converted lamella of a fin-shaped field effect transistor (FinFET), comprising;
a portion of a fin, wherein the portion has a first pair of faces that are parallel to a longitudinal axis of a gate associated with the fin and has a second pair of faces that are parallel to a longitudinal axis of the fin; and a sputter-deposited strengthening material covering the second pair of faces. 19. The axis-converted lamella of claim 18, wherein the sputter-deposited strengthening material comprises sputter-deposited carbon. 20. The axis-converted lamella of claim 18, further comprising:
a portion of a substrate at a base of the portion of the fin; and an electron-beam deposited marker on the portion of the substrate. | An axis conversion technique is provided for the milling of lamellae for TEM analysis that includes a sputter deposition to prevent warpage of the axis-converted lamellae.1. A method, comprising:
milling a semiconductor device along a first axis to form a first-axis-directed lamella; depositing the first-axis-directed lamella with a strengthening material to form a coated first-axis-directed lamella; milling the coated first axis-directed lamella along a second axis to form a second-axis-directed lamella. 2. The method of claim 1, wherein depositing the strengthening material comprises sputter depositing the strengthening material, the method further comprising:
imaging the second axis-directed lamella with transmission electron microscopy to detect a fault in the semiconductor device. 3. The method of claim 1, wherein the semiconductor device is a fin-shaped field effect transistor (FinFET), and wherein milling the semiconductor device along the first axis comprises milling parallel to a longitudinal axis of a gate such that the first-axis-directed lamella is a y-directed lamella, and wherein the sputter depositing comprises a sputter depositing with carbon. 4. The method of claim 3, wherein milling the coated first-axis-directed lamella comprises milling parallel to a longitudinal axis of a fin such that the second-axis-directed lamella is an x-directed lamella. 5. The method of claim 1, wherein the semiconductor device is a fin-shaped field effect transistor (FinFET), and wherein milling the semiconductor device along the first axis comprises milling parallel to a longitudinal axis of a fin such that the first-axis-directed lamella is an x-directed lamella. 6. The method of claim 5, wherein milling the coated first-axis-directed lamella comprises milling parallel to a longitudinal axis of a gate such that the second-axis-directed lamella is a y-directed lamella. 7. The method of claim 1, further comprising marking the first-axis-directed lamella with a marker adjacent a region-of-interest (ROI) prior to the coating. 8. The method of claim 7, wherein marking the first-axis-directed lamella with a metallic marker comprises a tungsten electron beam depositing of at least one tungsten marker. 9. The method of claim 1, wherein coating the first-axis-directed lamella comprises sputtering the first-axis-directed lamella with a metal. 10. An axis-converted lamella of a semiconductor device, comprising:
a first-axis-directed face along a region of interest (ROI) of the semiconductor device; a pair of second-axis-directed faces substantially orthogonal to the first-axis-directed face; and a strengthening material layer covering only the pair of second-axis-directed faces. 11. The axis-converted lamella of claim 10, wherein the semiconductor device is a fin-shaped field effect transistor (FinFET), and wherein the first-axis-directed face is aligned parallel to a longitudinal axis of a fin, and wherein the pair of second-axis-directed faces are aligned parallel to a longitudinal axis of a gate. 12. The axis-converted lamella of claim 10, wherein the strengthening material is a sputter-deposited strengthening material and the semiconductor device is a fin-shaped field effect transistor (FinFET), and wherein the first-axis-directed face is aligned parallel to a longitudinal axis of a gate, and wherein the pair of second-axis-directed faces are aligned parallel to a longitudinal axis of a fin. 13. The axis-converted lamella of claim 10, wherein the semiconductor device is a nanowire device. 14. The axis-converted lamella of claim 10, wherein the semiconductor device is a planar CMOS transistor. 15. An axis-converted lamella of a fin-shaped field effect transistor (FinFET), comprising;
a portion of a fin, wherein the portion has a first pair of faces that are parallel to a longitudinal axis of a gate associated with the fin and has a second pair of faces that are parallel to a longitudinal axis of the fin; and a sputter-deposited strengthening material covering the first pair of faces. 16. The axis-converted lamella of claim 15, wherein the strengthening material comprises sputter-deposited carbon. 17. The axis-converted lamella of claim 15, further comprising:
a portion of a substrate at a base of the portion of the fin; and an ion-beam deposited marker on the portion of the substrate. 18. An axis-converted lamella of a fin-shaped field effect transistor (FinFET), comprising;
a portion of a fin, wherein the portion has a first pair of faces that are parallel to a longitudinal axis of a gate associated with the fin and has a second pair of faces that are parallel to a longitudinal axis of the fin; and a sputter-deposited strengthening material covering the second pair of faces. 19. The axis-converted lamella of claim 18, wherein the sputter-deposited strengthening material comprises sputter-deposited carbon. 20. The axis-converted lamella of claim 18, further comprising:
a portion of a substrate at a base of the portion of the fin; and an electron-beam deposited marker on the portion of the substrate. | 2,800 |
11,563 | 11,563 | 13,520,376 | 2,884 | An X-ray tube is provided adapted to generate X-ray beams, comprising a first and a second deflection device mounted external or internal to the X-ray tube between a cathode and an anode in a diagonal manner for focal spot deflection in a combined x- and y-direction. The first and second deflection devices are triggered alternately such that only one deflection device is activated at a time. The first and second deflection devices may be triggered according to a predetermined switching sequence, e.g. producing a predetermined deflection pattern of the focal spot. Thereby, an improved x- and z-flying focal spot methodology is provided. | 1. An X-ray tube (10) adapted to generate X-ray beams, comprising
a first deflection device (50) for focal spot deflection in a combined x- and y-direction, and a second deflection device (52) for focal spot deflection in a combined x- and y-direction, wherein the first and second deflection devices are arranged diagonally relative to an y-axis of the X-ray tube (10). 2. The X-ray tube of claim 1, wherein the first deflection device (50) and second deflection device (52) include an electromagnetic dipole each. 3. The X-ray tube of claim 1, wherein the first deflection device (50) and second deflection device (52) are mounted between a cathode (44) and an anode (38) of the X-ray tube (10) at the same position in z-direction. 4. The X-ray tube of claim 1, wherein the X-ray tube (10) is adapted for exclusively activating the first deflection device (50) or second deflection device (52) 5. The X-ray tube of claim 1, wherein the first deflection device (50) is operated to generate a field out of the group consisting of a static field, a dynamic field and a static field superimposed by a dynamic field. 6. The X-ray tube of claim 1, wherein the second deflection device (52) is operated to generate a field out of the group consisting of a static field, a dynamic field and a static field superimposed by a dynamic field. 7. The X-ray tube of claim 1, comprising a cathode (44) having one or more filaments. 8. An X-ray system (2) comprising
an X-ray tube (10) according to claim 1, a detector (20) for the detection of X-ray beams, and a data processing unit (26). 9. The X-ray system of claim 8, further comprising a drive control unit (24) controlling a motion of the X-ray tube (10) and detector (20) relative to an object of interest (18), and controlling a motion of the object of interest. 10. A method for method of operating an X-ray system (2) having an X-ray tube (10) and a detector (20), comprising the step:
alternately deflecting an electron beam in the X-ray tube (10) diagonally in x- and y-direction, by means of alternately controlling (58) exclusively the first deflection device (50) or the second deflection device (52) according to a predetermined switching sequence. 11. The method according to claim 10, wherein the deflection of the focal spot according to the switching sequence is conducted in a way that no spot of the focal track is tracked more than once during one switching sequence. 12. The method according to claim 10, further comprising the step:
positioning the X-ray tube (10) and the detector (20) relative to the object of interest. 13. A computer program element including instructions which, when executed on a data processing unit (26) of an X-ray system (2) according to claim 8, causing the first deflection device (50) or the second deflection device (52) of the X-ray tube (10) of the X-ray system (2) to alternately deflect the focal spot of the electron beam diagonally in the x-direction and y-dircction at the same time according to a predetermined switching sequence. 14. The computer program element of claim 13, further including instructions for processing signals received from the detector (20), to generate images of an object of interest (18), and for illustrating the images on a display (32). 15. The computer program element of claim 13, further including instructions for controlling motion of the X-ray tube (10) and detector (20) relative to an object of interest (18), and for controlling motion of the object of interest relative to the X-ray tube and detector. | An X-ray tube is provided adapted to generate X-ray beams, comprising a first and a second deflection device mounted external or internal to the X-ray tube between a cathode and an anode in a diagonal manner for focal spot deflection in a combined x- and y-direction. The first and second deflection devices are triggered alternately such that only one deflection device is activated at a time. The first and second deflection devices may be triggered according to a predetermined switching sequence, e.g. producing a predetermined deflection pattern of the focal spot. Thereby, an improved x- and z-flying focal spot methodology is provided.1. An X-ray tube (10) adapted to generate X-ray beams, comprising
a first deflection device (50) for focal spot deflection in a combined x- and y-direction, and a second deflection device (52) for focal spot deflection in a combined x- and y-direction, wherein the first and second deflection devices are arranged diagonally relative to an y-axis of the X-ray tube (10). 2. The X-ray tube of claim 1, wherein the first deflection device (50) and second deflection device (52) include an electromagnetic dipole each. 3. The X-ray tube of claim 1, wherein the first deflection device (50) and second deflection device (52) are mounted between a cathode (44) and an anode (38) of the X-ray tube (10) at the same position in z-direction. 4. The X-ray tube of claim 1, wherein the X-ray tube (10) is adapted for exclusively activating the first deflection device (50) or second deflection device (52) 5. The X-ray tube of claim 1, wherein the first deflection device (50) is operated to generate a field out of the group consisting of a static field, a dynamic field and a static field superimposed by a dynamic field. 6. The X-ray tube of claim 1, wherein the second deflection device (52) is operated to generate a field out of the group consisting of a static field, a dynamic field and a static field superimposed by a dynamic field. 7. The X-ray tube of claim 1, comprising a cathode (44) having one or more filaments. 8. An X-ray system (2) comprising
an X-ray tube (10) according to claim 1, a detector (20) for the detection of X-ray beams, and a data processing unit (26). 9. The X-ray system of claim 8, further comprising a drive control unit (24) controlling a motion of the X-ray tube (10) and detector (20) relative to an object of interest (18), and controlling a motion of the object of interest. 10. A method for method of operating an X-ray system (2) having an X-ray tube (10) and a detector (20), comprising the step:
alternately deflecting an electron beam in the X-ray tube (10) diagonally in x- and y-direction, by means of alternately controlling (58) exclusively the first deflection device (50) or the second deflection device (52) according to a predetermined switching sequence. 11. The method according to claim 10, wherein the deflection of the focal spot according to the switching sequence is conducted in a way that no spot of the focal track is tracked more than once during one switching sequence. 12. The method according to claim 10, further comprising the step:
positioning the X-ray tube (10) and the detector (20) relative to the object of interest. 13. A computer program element including instructions which, when executed on a data processing unit (26) of an X-ray system (2) according to claim 8, causing the first deflection device (50) or the second deflection device (52) of the X-ray tube (10) of the X-ray system (2) to alternately deflect the focal spot of the electron beam diagonally in the x-direction and y-dircction at the same time according to a predetermined switching sequence. 14. The computer program element of claim 13, further including instructions for processing signals received from the detector (20), to generate images of an object of interest (18), and for illustrating the images on a display (32). 15. The computer program element of claim 13, further including instructions for controlling motion of the X-ray tube (10) and detector (20) relative to an object of interest (18), and for controlling motion of the object of interest relative to the X-ray tube and detector. | 2,800 |
11,564 | 11,564 | 14,869,249 | 2,856 | An access door that includes a scanning mechanism for a containment system, a containment system having the same, and a method for leak testing a filter installed in the containment system are described herein. In one embodiment, a containment system is disclosed that includes a housing having a downstream test section access port selectively sealed by a downstream test section access door. A displacement assembly is coupled to the downstream test section access door and is operable to move a plurality of probes disposed in the housing relative to the test section access door. | 1. A containment system comprising:
a housing configured to hold a filter in a position that separates an upstream section from a downstream test section, the housing having a filter access port for replacing a filter disposed in the housing, the housing having a downstream test section access port formed in the housing communicating with the downstream test section; a filter access door configured to selectively seal the filter access port; a downstream test section access door configured to selectively seal the downstream test section access port; a plurality of probes coupled to the downstream test section access door; and a displacement assembly coupled to the downstream test section access door, the displacement assembly operable to move the probes relative to the test section access door. 2. The containment system of claim 1, wherein the displacement assembly is an automatic displacement assembly. 3. The containment system of claim 1, wherein the displacement assembly is a manual displacement assembly. 4. The containment system of claim 1, wherein the downstream test section access door further comprises sealing member to selectively seal the downstream test section access port. 5. The containment system of claim 1, wherein the housing further comprises a control mechanism for controlling the displacement assembly from outside the housing. 6. The containment system of claim 5, wherein the control mechanism is routed through a sample port defined through the downstream test section access door. 7. A downstream test section access door comprising:
a door assembly configured to selectively seal a containment system access port; a plurality of probes configured to obtain air samples; and a displacement assembly coupled to the test section access door, the displacement assembly operable to move the probes relative to the test section access door. 8. The downstream test section access door of claim 7 further comprising:
a plurality of sample ports formed through the downstream test section access door, the sample ports coupled to the probes. 9. The downstream test section access door of claim 8 further comprising:
a control mechanism attached to an exterior of the downstream test section access door, configured to operate the displacement assembly. 10. The downstream test section access door of claim 9, wherein the displacement assembly is an automatic displacement assembly. 11. The downstream test section access door of claim 9, wherein the displacement assembly is a manual displacement assembly. 12. A method for testing a filter disposed in a containment system, comprising:
flowing air into the containment system and through a filter disposed in the containment system; and scanning the filter with a plurality of probes mounted to a door of the containment housing. 13. The method of claim 12 further comprising:
replacing a convention a door of the containment housing with the door having the plurality of probes coupled thereto. 14. The method of claim 12 further comprising:
routing samples obtained through the probes to test equipment through sample ports formed through the door. 15. The method of claim 12, wherein scanning the filter further comprises:
automatically moving the probes to scan the filter without opening the door. 16. The method of claim 12, wherein scanning the filter further comprises:
manually moving the probes to scan the filter without opening the door. 17. A containment system comprising:
a housing configured to hold a filter in a position that separates an upstream section from a downstream test section, the housing having a filter access port for replacing a filter disposed in the housing, the housing having a downstream test section access port formed in the housing communicating with the downstream test section; a downstream test section access door configured to selectively seal the downstream test section access port; a displacement assembly disposed in the housing; a plurality of probes disposed in the downstream test section and non-intrusively displaceable by the displacement assembly; a filter access door configured to selectively seal the filter access port; a plurality of sample ports formed through the downstream test section access door, the sample ports coupled to the probes by tubing. 18. The containment system of claim 17, wherein the displacement assembly is coupled to the housing. 19. The containment system of claim 17, wherein the displacement assembly is adjustable to fit securely in the housing. | An access door that includes a scanning mechanism for a containment system, a containment system having the same, and a method for leak testing a filter installed in the containment system are described herein. In one embodiment, a containment system is disclosed that includes a housing having a downstream test section access port selectively sealed by a downstream test section access door. A displacement assembly is coupled to the downstream test section access door and is operable to move a plurality of probes disposed in the housing relative to the test section access door.1. A containment system comprising:
a housing configured to hold a filter in a position that separates an upstream section from a downstream test section, the housing having a filter access port for replacing a filter disposed in the housing, the housing having a downstream test section access port formed in the housing communicating with the downstream test section; a filter access door configured to selectively seal the filter access port; a downstream test section access door configured to selectively seal the downstream test section access port; a plurality of probes coupled to the downstream test section access door; and a displacement assembly coupled to the downstream test section access door, the displacement assembly operable to move the probes relative to the test section access door. 2. The containment system of claim 1, wherein the displacement assembly is an automatic displacement assembly. 3. The containment system of claim 1, wherein the displacement assembly is a manual displacement assembly. 4. The containment system of claim 1, wherein the downstream test section access door further comprises sealing member to selectively seal the downstream test section access port. 5. The containment system of claim 1, wherein the housing further comprises a control mechanism for controlling the displacement assembly from outside the housing. 6. The containment system of claim 5, wherein the control mechanism is routed through a sample port defined through the downstream test section access door. 7. A downstream test section access door comprising:
a door assembly configured to selectively seal a containment system access port; a plurality of probes configured to obtain air samples; and a displacement assembly coupled to the test section access door, the displacement assembly operable to move the probes relative to the test section access door. 8. The downstream test section access door of claim 7 further comprising:
a plurality of sample ports formed through the downstream test section access door, the sample ports coupled to the probes. 9. The downstream test section access door of claim 8 further comprising:
a control mechanism attached to an exterior of the downstream test section access door, configured to operate the displacement assembly. 10. The downstream test section access door of claim 9, wherein the displacement assembly is an automatic displacement assembly. 11. The downstream test section access door of claim 9, wherein the displacement assembly is a manual displacement assembly. 12. A method for testing a filter disposed in a containment system, comprising:
flowing air into the containment system and through a filter disposed in the containment system; and scanning the filter with a plurality of probes mounted to a door of the containment housing. 13. The method of claim 12 further comprising:
replacing a convention a door of the containment housing with the door having the plurality of probes coupled thereto. 14. The method of claim 12 further comprising:
routing samples obtained through the probes to test equipment through sample ports formed through the door. 15. The method of claim 12, wherein scanning the filter further comprises:
automatically moving the probes to scan the filter without opening the door. 16. The method of claim 12, wherein scanning the filter further comprises:
manually moving the probes to scan the filter without opening the door. 17. A containment system comprising:
a housing configured to hold a filter in a position that separates an upstream section from a downstream test section, the housing having a filter access port for replacing a filter disposed in the housing, the housing having a downstream test section access port formed in the housing communicating with the downstream test section; a downstream test section access door configured to selectively seal the downstream test section access port; a displacement assembly disposed in the housing; a plurality of probes disposed in the downstream test section and non-intrusively displaceable by the displacement assembly; a filter access door configured to selectively seal the filter access port; a plurality of sample ports formed through the downstream test section access door, the sample ports coupled to the probes by tubing. 18. The containment system of claim 17, wherein the displacement assembly is coupled to the housing. 19. The containment system of claim 17, wherein the displacement assembly is adjustable to fit securely in the housing. | 2,800 |
11,565 | 11,565 | 15,888,805 | 2,831 | Modular two-prong polarized electrical plugs and plug adaptors provided with indicia modules that can be inserted into recesses on the plug housings and adaptor bodies. The indicia modules include indicia elements. By inserting the indicia modules on the proper sides of the plug housings or adaptor bodies, the tops of the plugs and adaptors can be readily identified for purposes of verifying the orientation of the plugs and plug adaptors when and after plugging them into electrical outlets. | 1. A modular two-prong polarized electrical plug that provides for visual confirmation of proper orientation with respect to a polarized electrical receptacle or outlet before and after being plugged into the outlet which comprises:
a plug housing having a top and a bottom and a front face; an electrically conductive polarized prong or blade that extends outward from front face of the plug housing; an electrically conductive non-polarized prong or blade that extends outward from the front face of the plug housing; and an indicia module having an indicia element provided thereon which indicial module is configured to be attached to indicia module receiving structures provided on both the top and bottom of the plug housing. 2. The modular two-prong polarized electrical plug of claim 1, wherein the receiving structures provided on both the top and bottom of the plug housing comprise recesses formed in the top and bottom of the plug housing. 3. The modular two-prong polarized electrical plug of claim 1, wherein the receiving structures provided on both the top and bottom of the plug housing comprise flat portions. 4. The modular two-prong polarized electrical plug of claim 1, wherein the indicia element has a three-dimensional shape. 5. The modular two-prong polarized electrical plug of claim 1, wherein the indicia element is a different color than that plug housing. 6. The modular two-prong polarized electrical plug of claim 1, wherein the indicia element comprises one of a geometric shape, a non-geometric shape, a symbol, a logo, a pattern and a word. 7. A modular polarized electrical plug adaptor configured to be coupled to a polarized two-prong electrical plug which polarized electrical plug adaptor provides for visual confirmation of proper orientation with respect to a polarized electrical receptacle or outlet before and after being plugged into the outlet and which polarized electrical plug adaptor comprises:
a body having a top and a bottom and a front and a back; an electrically conductive polarized prong or blade that extends outward from the front of the body; an electrically conductive non-polarized prong or blade that extends outward from the front of the body; a polarized socket provided in the back of the body; a non-polarized socket provided in the back of the body, said polarized socket and non-polarized socket being configured to receive a two-prong polarized electrical plug therein; electrical conductive elements within the body that connect the polarized socket to the polarized prong or blade and connect the non-polarized socket to the non-polarized prong or blade; and an indicia module having an indicia element provided thereon which indicia module is configured to be received in which indicial module is configured to be attached to indicia module receiving structures provided on both the top and bottom of the body. 8. A modular polarized electrical plug adaptor according to claim 7, wherein the receiving structures provided on both the top and bottom of the plug housing comprise recesses formed in the top and bottom of the plug housing. 9. A modular polarized electrical plug adaptor according to claim 7, wherein the receiving structures provided on both the top and bottom of the plug housing comprise flat portions. 10. A modular polarized electrical plug adaptor according to claim 7, wherein the indicia element has a three-dimensional shape. 11. A modular polarized electrical plug adaptor according to claim 7, wherein the indicia element is a different color than that plug housing. 12. A modular polarized electrical plug adaptor according to claim 7, wherein the indicia element comprises one of a geometric shape, a non-geometric shape, a symbol, a logo, a pattern and a word. 13. A kit for marking the top of a two-prong polarized electrical plug which comprises:
a two-prong polarized electrical plus that includes:
a plug housing having a top and a bottom and a front face;
an electrically conductive polarized prong or blade that extends outward from front face of the plug housing; and
an electrically conductive non-polarized prong or blade that extends outward from the front face of the plug housing; and
at least one indicia module having an indicial element provided thereon which at least one indicial module is configured to be attached to indicia module receiving structures provided on both the top and bottom of the plug housing. 14. A kit for marking the top of a two-prong polarized electrical plug according to claim 13, wherein the receiving structures provided on both the top and bottom of the plug housing comprise recesses formed in the top and bottom of the plug housing. 15. A kit for marking the top of a two-prong polarized electrical plug according to claim 13, wherein the receiving structures provided on both the top and bottom of the plug housing comprise flat portions. 16. A kit for marking the top of a two-prong polarized electrical plug according to claim 13, wherein the indicia element has a three-dimensional shape. 17. A kit for marking the top of a two-prong polarized electrical plug according to claim 13, wherein the indicia element is a different color than that plug housing. 18. A kit for marking the top of a two-prong polarized electrical plug according to claim 13, wherein the indicia element comprises one of a geometric shape, a non-geometric shape, a symbol, a logo, a pattern and a word. 19. A kit for marking the top of a two-prong polarized electrical plug according to claim 13, wherein the at least one indicia module comprises two or more indicia modules that have different indicia elements. 20. A kit for marking the top of a two-prong polarized electrical plug according to claim 19, wherein one of the indicia modules is blank and does not include an indicia element. | Modular two-prong polarized electrical plugs and plug adaptors provided with indicia modules that can be inserted into recesses on the plug housings and adaptor bodies. The indicia modules include indicia elements. By inserting the indicia modules on the proper sides of the plug housings or adaptor bodies, the tops of the plugs and adaptors can be readily identified for purposes of verifying the orientation of the plugs and plug adaptors when and after plugging them into electrical outlets.1. A modular two-prong polarized electrical plug that provides for visual confirmation of proper orientation with respect to a polarized electrical receptacle or outlet before and after being plugged into the outlet which comprises:
a plug housing having a top and a bottom and a front face; an electrically conductive polarized prong or blade that extends outward from front face of the plug housing; an electrically conductive non-polarized prong or blade that extends outward from the front face of the plug housing; and an indicia module having an indicia element provided thereon which indicial module is configured to be attached to indicia module receiving structures provided on both the top and bottom of the plug housing. 2. The modular two-prong polarized electrical plug of claim 1, wherein the receiving structures provided on both the top and bottom of the plug housing comprise recesses formed in the top and bottom of the plug housing. 3. The modular two-prong polarized electrical plug of claim 1, wherein the receiving structures provided on both the top and bottom of the plug housing comprise flat portions. 4. The modular two-prong polarized electrical plug of claim 1, wherein the indicia element has a three-dimensional shape. 5. The modular two-prong polarized electrical plug of claim 1, wherein the indicia element is a different color than that plug housing. 6. The modular two-prong polarized electrical plug of claim 1, wherein the indicia element comprises one of a geometric shape, a non-geometric shape, a symbol, a logo, a pattern and a word. 7. A modular polarized electrical plug adaptor configured to be coupled to a polarized two-prong electrical plug which polarized electrical plug adaptor provides for visual confirmation of proper orientation with respect to a polarized electrical receptacle or outlet before and after being plugged into the outlet and which polarized electrical plug adaptor comprises:
a body having a top and a bottom and a front and a back; an electrically conductive polarized prong or blade that extends outward from the front of the body; an electrically conductive non-polarized prong or blade that extends outward from the front of the body; a polarized socket provided in the back of the body; a non-polarized socket provided in the back of the body, said polarized socket and non-polarized socket being configured to receive a two-prong polarized electrical plug therein; electrical conductive elements within the body that connect the polarized socket to the polarized prong or blade and connect the non-polarized socket to the non-polarized prong or blade; and an indicia module having an indicia element provided thereon which indicia module is configured to be received in which indicial module is configured to be attached to indicia module receiving structures provided on both the top and bottom of the body. 8. A modular polarized electrical plug adaptor according to claim 7, wherein the receiving structures provided on both the top and bottom of the plug housing comprise recesses formed in the top and bottom of the plug housing. 9. A modular polarized electrical plug adaptor according to claim 7, wherein the receiving structures provided on both the top and bottom of the plug housing comprise flat portions. 10. A modular polarized electrical plug adaptor according to claim 7, wherein the indicia element has a three-dimensional shape. 11. A modular polarized electrical plug adaptor according to claim 7, wherein the indicia element is a different color than that plug housing. 12. A modular polarized electrical plug adaptor according to claim 7, wherein the indicia element comprises one of a geometric shape, a non-geometric shape, a symbol, a logo, a pattern and a word. 13. A kit for marking the top of a two-prong polarized electrical plug which comprises:
a two-prong polarized electrical plus that includes:
a plug housing having a top and a bottom and a front face;
an electrically conductive polarized prong or blade that extends outward from front face of the plug housing; and
an electrically conductive non-polarized prong or blade that extends outward from the front face of the plug housing; and
at least one indicia module having an indicial element provided thereon which at least one indicial module is configured to be attached to indicia module receiving structures provided on both the top and bottom of the plug housing. 14. A kit for marking the top of a two-prong polarized electrical plug according to claim 13, wherein the receiving structures provided on both the top and bottom of the plug housing comprise recesses formed in the top and bottom of the plug housing. 15. A kit for marking the top of a two-prong polarized electrical plug according to claim 13, wherein the receiving structures provided on both the top and bottom of the plug housing comprise flat portions. 16. A kit for marking the top of a two-prong polarized electrical plug according to claim 13, wherein the indicia element has a three-dimensional shape. 17. A kit for marking the top of a two-prong polarized electrical plug according to claim 13, wherein the indicia element is a different color than that plug housing. 18. A kit for marking the top of a two-prong polarized electrical plug according to claim 13, wherein the indicia element comprises one of a geometric shape, a non-geometric shape, a symbol, a logo, a pattern and a word. 19. A kit for marking the top of a two-prong polarized electrical plug according to claim 13, wherein the at least one indicia module comprises two or more indicia modules that have different indicia elements. 20. A kit for marking the top of a two-prong polarized electrical plug according to claim 19, wherein one of the indicia modules is blank and does not include an indicia element. | 2,800 |
11,566 | 11,566 | 14,661,624 | 2,884 | A calibration system for an image plate used to detect high-energy particles produced by a radioisotope includes a casing and an image plate holder disposed at least partially inside the casing. The image plate is retained by the image plate holder inside the casing. A calibration source generates energy inside the casing to prepare the image plate for detection. | 1. A calibration system for an image plate used to detect high-energy particles produced by a radioisotope, comprising:
a casing; an image plate holder disposed at least partially inside said casing, wherein the image plate is retained by said image plate holder inside said casing; and a calibration source that generates energy inside said casing. 2. The system as in claim 1, further comprising an access port through said casing, wherein said image plate holder fits through said access port. 3. The system as in claim 1, further comprising a handle operably connected to said image plate holder, wherein said handle extends at least partially outside of said casing. 4. The system as in claim 1, further comprising an image plate detent between said casing and said image plate holder. 5. The system as in claim 1, further comprising a heat sink proximate to said calibration source. 6. The system as in claim 1, further comprising an interlock inside said casing and operably engaged with said image plate holder, wherein said interlock has a first condition when said image plate holder is fully inserted in said casing. 7. The system as in claim 6, wherein said interlock has a second condition when said image plate holder is not fully inserted into said casing. 8. The system as in claim 1, wherein said calibration source is an ultraviolet light. 9. The system as in claim 1, wherein said casing is impervious to ambient light. 10. A calibration system for an image plate used to detect high-energy particles produced by a radioisotope, comprising:
a casing; an image plate holder disposed at least partially inside said casing, wherein the image plate is retained by said image plate holder inside said casing; an index on said image plate holder for locating said image plate holder in said casing; and a calibration source that generates energy inside said casing. 11. The system as in claim 10, further comprising an access port through said casing, wherein said image plate holder fits through said access port. 12. The system as in claim 10, further comprising an image plate detent that engages with said index on said image plate holder. 13. The system as in claim 10, further comprising a heat sink proximate to said calibration source. 14. The system as in claim 10, further comprising an interlock inside said casing and operably engaged with said image plate holder, wherein said interlock has a first condition when said image plate holder is fully inserted in said casing. 15. The system as in claim 14, wherein said interlock has a second condition when said image plate holder is not fully inserted into said casing. 16. The system as in claim 10, wherein said calibration source is an ultraviolet light. 17. A calibration system for an image plate used to detect high-energy particles produced by a radioisotope, comprising:
a casing; an image plate holder disposed at least partially inside said casing, wherein the image plate is retained by said image plate holder inside said casing; an access port through said casing, wherein said image plate holder fits through said access port; an index on said image plate holder for locating said image plate holder in said casing; an image plate detent that engages with said index on said image plate holder; and a calibration source that generates energy inside said casing. 18. The system as in claim 17, further comprising a heat sink proximate to said calibration source. 19. The system as in claim 17, further comprising an interlock inside said casing and operably engaged with said image plate holder, wherein said interlock has a first condition when said image plate holder is fully inserted in said casing. 20. The system as in claim 17, wherein said interlock has a second condition when said image plate holder is not fully inserted into said casing. | A calibration system for an image plate used to detect high-energy particles produced by a radioisotope includes a casing and an image plate holder disposed at least partially inside the casing. The image plate is retained by the image plate holder inside the casing. A calibration source generates energy inside the casing to prepare the image plate for detection.1. A calibration system for an image plate used to detect high-energy particles produced by a radioisotope, comprising:
a casing; an image plate holder disposed at least partially inside said casing, wherein the image plate is retained by said image plate holder inside said casing; and a calibration source that generates energy inside said casing. 2. The system as in claim 1, further comprising an access port through said casing, wherein said image plate holder fits through said access port. 3. The system as in claim 1, further comprising a handle operably connected to said image plate holder, wherein said handle extends at least partially outside of said casing. 4. The system as in claim 1, further comprising an image plate detent between said casing and said image plate holder. 5. The system as in claim 1, further comprising a heat sink proximate to said calibration source. 6. The system as in claim 1, further comprising an interlock inside said casing and operably engaged with said image plate holder, wherein said interlock has a first condition when said image plate holder is fully inserted in said casing. 7. The system as in claim 6, wherein said interlock has a second condition when said image plate holder is not fully inserted into said casing. 8. The system as in claim 1, wherein said calibration source is an ultraviolet light. 9. The system as in claim 1, wherein said casing is impervious to ambient light. 10. A calibration system for an image plate used to detect high-energy particles produced by a radioisotope, comprising:
a casing; an image plate holder disposed at least partially inside said casing, wherein the image plate is retained by said image plate holder inside said casing; an index on said image plate holder for locating said image plate holder in said casing; and a calibration source that generates energy inside said casing. 11. The system as in claim 10, further comprising an access port through said casing, wherein said image plate holder fits through said access port. 12. The system as in claim 10, further comprising an image plate detent that engages with said index on said image plate holder. 13. The system as in claim 10, further comprising a heat sink proximate to said calibration source. 14. The system as in claim 10, further comprising an interlock inside said casing and operably engaged with said image plate holder, wherein said interlock has a first condition when said image plate holder is fully inserted in said casing. 15. The system as in claim 14, wherein said interlock has a second condition when said image plate holder is not fully inserted into said casing. 16. The system as in claim 10, wherein said calibration source is an ultraviolet light. 17. A calibration system for an image plate used to detect high-energy particles produced by a radioisotope, comprising:
a casing; an image plate holder disposed at least partially inside said casing, wherein the image plate is retained by said image plate holder inside said casing; an access port through said casing, wherein said image plate holder fits through said access port; an index on said image plate holder for locating said image plate holder in said casing; an image plate detent that engages with said index on said image plate holder; and a calibration source that generates energy inside said casing. 18. The system as in claim 17, further comprising a heat sink proximate to said calibration source. 19. The system as in claim 17, further comprising an interlock inside said casing and operably engaged with said image plate holder, wherein said interlock has a first condition when said image plate holder is fully inserted in said casing. 20. The system as in claim 17, wherein said interlock has a second condition when said image plate holder is not fully inserted into said casing. | 2,800 |
11,567 | 11,567 | 15,263,997 | 2,813 | An embodiment is to include an inverted staggered (bottom gate structure) thin film transistor in which an oxide semiconductor film containing In, Ga, and Zn is used as a semiconductor layer and a buffer layer is provided between the semiconductor layer and a source and drain electrode layers. The buffer layer having higher carrier concentration than the semiconductor layer is provided intentionally between the source and drain electrode layers and the semiconductor layer, whereby an ohmic contact is formed. | 1. (canceled) 2. A semiconductor device comprising:
an oxide semiconductor film comprising indium and oxygen, the oxide semiconductor film comprising a channel formation region; a first conductive film over and electrically connected to the oxide semiconductor film; and a second conductive film over and electrically connected to the oxide semiconductor film, wherein the oxide semiconductor film comprises an end portion, a groove portion, and a portion between the groove portion and the end portion, wherein a thickness of the portion is larger than a thickness of the groove portion and larger than a thickness of the end portion, and wherein the oxide semiconductor film extends beyond a side edge of one of the first conductive film and the second conductive film, the extended portion of the oxide semiconductor film being the end portion. 3. The semiconductor device according to claim 2, wherein the oxide semiconductor film has a carrier concentration lower than 1×1017 atoms/cm3. 4. The semiconductor device according to claim 2, wherein the oxide semiconductor film comprises an In—Ga—Zn—O-based oxide semiconductor. 5. An electronic appliance comprising the semiconductor device according to claim 2, wherein the electronic appliance is configured to read a program or data stored in a recording medium to display it on a display portion. 6. A semiconductor device comprising:
an oxide semiconductor film comprising indium and oxygen, the oxide semiconductor film comprising a channel formation region; a first conductive film electrically connected to the oxide semiconductor film with a first film comprising oxide interposed therebetween; and a second conductive film electrically connected to the oxide semiconductor film with a second film comprising oxide interposed therebetween, wherein the oxide semiconductor film comprises an end portion, a groove portion, and a portion between the groove portion and the end portion, wherein a thickness of the portion is larger than a thickness of the groove portion and larger than a thickness of the end portion, and wherein the oxide semiconductor film extends beyond a side edge of one of the first film and the second film, the extended portion of the oxide semiconductor film being the end portion. 7. The semiconductor device according to claim 6,
wherein the first film is not in contact with a top surface of the end portion, and wherein the second film is not in contact with a top surface of the end portion. 8. The semiconductor device according to claim 6, wherein each of the first film and the second film comprises In, Ga, and Zn. 9. The semiconductor device according to claim 6, wherein each of the first film and the second film comprises magnesium, aluminum, titanium, iron, tin, calcium, germanium, scandium, yttrium, zirconium, hafnium, boron, thallium, or lead. 10. The semiconductor device according to claim 6, wherein the oxide semiconductor film comprises an In—Ga—Zn—O-based oxide semiconductor. 11. An electronic appliance comprising the semiconductor device according to claim 6, wherein the electronic appliance is configured to read a program or data stored in a recording medium to display it on a display portion. 12. A semiconductor device comprising:
an oxide semiconductor film comprising indium and oxygen, the oxide semiconductor film comprising a channel formation region; a first copper film electrically connected to the oxide semiconductor film with a first film comprising oxide interposed therebetween; and a second copper film electrically connected to the oxide semiconductor film with a second film comprising oxide interposed therebetween, wherein the oxide semiconductor film comprises an end portion, a groove portion, and a portion between the groove portion and the end portion, wherein a thickness of the portion is larger than a thickness of the groove portion and larger than a thickness of the end portion, wherein the oxide semiconductor film extends beyond a side edge of one of the first film and the second film, the extended portion of the oxide semiconductor film being the end portion, wherein a first gap between the first film and the second film is smaller than a second gap between the first copper film and the second copper film, and wherein the first gap is a distance between an upper end portion of the first film and an upper end portion of the second film, and the second gap is a distance between a lower end portion of the first copper film and a lower end portion of second copper film. 13. The semiconductor device according to claim 12,
wherein the first film is not in contact with a top surface of the end portion, and wherein the second film is not in contact with a top surface of the end portion. 14. The semiconductor device according to claim 12, wherein each of the first film and the second film comprises In, Ga, and Zn. 15. The semiconductor device according to claim 12, wherein each of the first film and the second film comprises magnesium, aluminum, titanium, iron, tin, calcium, germanium, scandium, yttrium, zirconium, hafnium, boron, thallium, or lead. 16. The semiconductor device according to claim 12, wherein the oxide semiconductor film comprises an In—Ga—Zn—O-based oxide semiconductor. 17. An electronic appliance comprising the semiconductor device according to claim 12, wherein the electronic appliance is configured to read a program or data stored in a recording medium to display it on a display portion. 18. A semiconductor device comprising:
an oxide semiconductor film comprising indium and oxygen, the oxide semiconductor film comprising a channel formation region; a first copper film electrically connected to the oxide semiconductor film with a first film comprising oxide interposed therebetween; and a second copper film electrically connected to the oxide semiconductor film with a second film comprising oxide interposed therebetween, wherein the oxide semiconductor film comprises an end portion, a groove portion, and a portion between the groove portion and the end portion, wherein a thickness of the portion is larger than a thickness of the groove portion and larger than a thickness of the end portion, wherein the oxide semiconductor film extends beyond a side edge of one of the first film and the second film, the extended portion of the oxide semiconductor film being the end portion, wherein a first gap between the first film and the second film is smaller than a second gap between the first copper film and the second copper film, wherein the first gap is a distance between an upper end portion of the first film and an upper end portion of the second film, and the second gap is a distance between a lower end portion of the first copper film and a lower end portion of second copper film, and wherein the oxide semiconductor film has a carrier concentration lower than 1×1017 atoms/cm3. 19. The semiconductor device according to claim 18,
wherein the first film is not in contact with a top surface of the end portion, and wherein the second film is not in contact with a top surface of the end portion. 20. The semiconductor device according to claim 18, wherein each of the first film and the second film comprises In, Ga, and Zn. 21. The semiconductor device according to claim 18, wherein each of the first film and the second film comprises magnesium, aluminum, titanium, iron, tin, calcium, germanium, scandium, yttrium, zirconium, hafnium, boron, thallium, or lead. 22. The semiconductor device according to claim 18, wherein the oxide semiconductor film comprises an In—Ga—Zn—O-based oxide semiconductor. 23. An electronic appliance comprising the semiconductor device according to claim 18, wherein the electronic appliance is configured to read a program or data stored in a recording medium to display it on a display portion. | An embodiment is to include an inverted staggered (bottom gate structure) thin film transistor in which an oxide semiconductor film containing In, Ga, and Zn is used as a semiconductor layer and a buffer layer is provided between the semiconductor layer and a source and drain electrode layers. The buffer layer having higher carrier concentration than the semiconductor layer is provided intentionally between the source and drain electrode layers and the semiconductor layer, whereby an ohmic contact is formed.1. (canceled) 2. A semiconductor device comprising:
an oxide semiconductor film comprising indium and oxygen, the oxide semiconductor film comprising a channel formation region; a first conductive film over and electrically connected to the oxide semiconductor film; and a second conductive film over and electrically connected to the oxide semiconductor film, wherein the oxide semiconductor film comprises an end portion, a groove portion, and a portion between the groove portion and the end portion, wherein a thickness of the portion is larger than a thickness of the groove portion and larger than a thickness of the end portion, and wherein the oxide semiconductor film extends beyond a side edge of one of the first conductive film and the second conductive film, the extended portion of the oxide semiconductor film being the end portion. 3. The semiconductor device according to claim 2, wherein the oxide semiconductor film has a carrier concentration lower than 1×1017 atoms/cm3. 4. The semiconductor device according to claim 2, wherein the oxide semiconductor film comprises an In—Ga—Zn—O-based oxide semiconductor. 5. An electronic appliance comprising the semiconductor device according to claim 2, wherein the electronic appliance is configured to read a program or data stored in a recording medium to display it on a display portion. 6. A semiconductor device comprising:
an oxide semiconductor film comprising indium and oxygen, the oxide semiconductor film comprising a channel formation region; a first conductive film electrically connected to the oxide semiconductor film with a first film comprising oxide interposed therebetween; and a second conductive film electrically connected to the oxide semiconductor film with a second film comprising oxide interposed therebetween, wherein the oxide semiconductor film comprises an end portion, a groove portion, and a portion between the groove portion and the end portion, wherein a thickness of the portion is larger than a thickness of the groove portion and larger than a thickness of the end portion, and wherein the oxide semiconductor film extends beyond a side edge of one of the first film and the second film, the extended portion of the oxide semiconductor film being the end portion. 7. The semiconductor device according to claim 6,
wherein the first film is not in contact with a top surface of the end portion, and wherein the second film is not in contact with a top surface of the end portion. 8. The semiconductor device according to claim 6, wherein each of the first film and the second film comprises In, Ga, and Zn. 9. The semiconductor device according to claim 6, wherein each of the first film and the second film comprises magnesium, aluminum, titanium, iron, tin, calcium, germanium, scandium, yttrium, zirconium, hafnium, boron, thallium, or lead. 10. The semiconductor device according to claim 6, wherein the oxide semiconductor film comprises an In—Ga—Zn—O-based oxide semiconductor. 11. An electronic appliance comprising the semiconductor device according to claim 6, wherein the electronic appliance is configured to read a program or data stored in a recording medium to display it on a display portion. 12. A semiconductor device comprising:
an oxide semiconductor film comprising indium and oxygen, the oxide semiconductor film comprising a channel formation region; a first copper film electrically connected to the oxide semiconductor film with a first film comprising oxide interposed therebetween; and a second copper film electrically connected to the oxide semiconductor film with a second film comprising oxide interposed therebetween, wherein the oxide semiconductor film comprises an end portion, a groove portion, and a portion between the groove portion and the end portion, wherein a thickness of the portion is larger than a thickness of the groove portion and larger than a thickness of the end portion, wherein the oxide semiconductor film extends beyond a side edge of one of the first film and the second film, the extended portion of the oxide semiconductor film being the end portion, wherein a first gap between the first film and the second film is smaller than a second gap between the first copper film and the second copper film, and wherein the first gap is a distance between an upper end portion of the first film and an upper end portion of the second film, and the second gap is a distance between a lower end portion of the first copper film and a lower end portion of second copper film. 13. The semiconductor device according to claim 12,
wherein the first film is not in contact with a top surface of the end portion, and wherein the second film is not in contact with a top surface of the end portion. 14. The semiconductor device according to claim 12, wherein each of the first film and the second film comprises In, Ga, and Zn. 15. The semiconductor device according to claim 12, wherein each of the first film and the second film comprises magnesium, aluminum, titanium, iron, tin, calcium, germanium, scandium, yttrium, zirconium, hafnium, boron, thallium, or lead. 16. The semiconductor device according to claim 12, wherein the oxide semiconductor film comprises an In—Ga—Zn—O-based oxide semiconductor. 17. An electronic appliance comprising the semiconductor device according to claim 12, wherein the electronic appliance is configured to read a program or data stored in a recording medium to display it on a display portion. 18. A semiconductor device comprising:
an oxide semiconductor film comprising indium and oxygen, the oxide semiconductor film comprising a channel formation region; a first copper film electrically connected to the oxide semiconductor film with a first film comprising oxide interposed therebetween; and a second copper film electrically connected to the oxide semiconductor film with a second film comprising oxide interposed therebetween, wherein the oxide semiconductor film comprises an end portion, a groove portion, and a portion between the groove portion and the end portion, wherein a thickness of the portion is larger than a thickness of the groove portion and larger than a thickness of the end portion, wherein the oxide semiconductor film extends beyond a side edge of one of the first film and the second film, the extended portion of the oxide semiconductor film being the end portion, wherein a first gap between the first film and the second film is smaller than a second gap between the first copper film and the second copper film, wherein the first gap is a distance between an upper end portion of the first film and an upper end portion of the second film, and the second gap is a distance between a lower end portion of the first copper film and a lower end portion of second copper film, and wherein the oxide semiconductor film has a carrier concentration lower than 1×1017 atoms/cm3. 19. The semiconductor device according to claim 18,
wherein the first film is not in contact with a top surface of the end portion, and wherein the second film is not in contact with a top surface of the end portion. 20. The semiconductor device according to claim 18, wherein each of the first film and the second film comprises In, Ga, and Zn. 21. The semiconductor device according to claim 18, wherein each of the first film and the second film comprises magnesium, aluminum, titanium, iron, tin, calcium, germanium, scandium, yttrium, zirconium, hafnium, boron, thallium, or lead. 22. The semiconductor device according to claim 18, wherein the oxide semiconductor film comprises an In—Ga—Zn—O-based oxide semiconductor. 23. An electronic appliance comprising the semiconductor device according to claim 18, wherein the electronic appliance is configured to read a program or data stored in a recording medium to display it on a display portion. | 2,800 |
11,568 | 11,568 | 14,266,361 | 2,872 | The disclosure relates to methods for the fabrication of randomly arranged, antireflective structures on surfaces of optical substrates and to optics having antireflective coatings comprising random surface structures. | 1. An optic having an antireflective surface comprising:
a substrate, a buffer layer deposited on at least one side of the substrate, and a plurality of surface structures formed by reactive ion etching of the buffer-coated substrate, wherein the plurality of structures are configured to reduce reflection of electromagnetic radiation having an incident angle from 0° to 70° over a region of at least 2.0 octaves within the electromagnetic spectrum region of 350 nm to 18,000 nm. 2. The optic of claim 1 wherein the structures are configured to reduce reflection within the electromagnetic spectrum region of 3,000 nm to 18,000 nm. 3. The optic of claim 1 wherein the buffer layer comprises AlN, SiO2, ZrO2, or Si3N4. 4. The optic of claim 3 wherein the buffer layer comprises AlN. 5. The optic of claim 1 wherein the ratio of the mean height of structures to mean base-base spacing of adjacent structures is from 4 to 12. 6. The optic of claim 1 wherein the substrate comprises ZnS, ZnSe, Ge, GaAs, GaP, CdTe, HgCdTe, BaF2, CaF2, CaF2As, Y2O3, MgO, AlON, spinel, sapphire, or fused silica. 7. The optic of claim 6 wherein the substrate comprises ZnS or ZnSe. 8. The optic of claim 1 further comprising a second buffer layer deposited on a second side of the substrate opposite the first side, and a second plurality of surface structures formed by reactive ion etching of the second buffer-coated substrate, wherein the second plurality of structures are configured to reduce reflection of electromagnetic radiation having an incident angle from 0° to 70° over a region of at least 2.0 octaves within the electromagnetic spectrum region of 350 nanometers (nm) to 18,000 nm. 9. The optic of claim 1 wherein the substrate comprises a non planar surface. 10. The optic of claim 8 wherein the substrate comprises a non planar surface. 11. A method of forming a plurality of random surface structures on an optical substrate, comprising:
(a) providing a substrate; (b) depositing a buffer layer on a surface of the substrate; (c) depositing a metal film on the buffer layer; (d) heating to effect annealing of the metal into randomly arranged nanoparticles; (e) dry etching the buffer-coated substrate; and (f) performing a wet etch to remove metal nanoparticles. 12. The method of claim 11 wherein the ratio of mean height to mean base-base spacing of the formed surface structures is from 3 to 12. 13. The method of claim 12, wherein the height of the formed surface structures is from 0.5 μm to 3.5 μm. 14. The method of claim 11 wherein the frustum parameters of the formed structures are from 0 to 0.8. 15. The method of claim 14 wherein the frustum parameters are from 0 to 0.4. 16. The method of claim 11, wherein the metal film is deposited to an initial thickness of between 4 nm and 20 nm 17. A method of forming a plurality of random surface structures on an optical substrate, comprising:
(a) providing a substrate comprising ZnSe; (b) depositing a buffer layer comprising AlN on a surface of the substrate; (c) depositing a metal film comprising Ni on the buffer layer; (d) heating to effect annealing of the Ni into randomly arranged nanoparticles; (e) dry etching the buffer-coated substrate; and (f) wet etching to remove metal nanoparticles. | The disclosure relates to methods for the fabrication of randomly arranged, antireflective structures on surfaces of optical substrates and to optics having antireflective coatings comprising random surface structures.1. An optic having an antireflective surface comprising:
a substrate, a buffer layer deposited on at least one side of the substrate, and a plurality of surface structures formed by reactive ion etching of the buffer-coated substrate, wherein the plurality of structures are configured to reduce reflection of electromagnetic radiation having an incident angle from 0° to 70° over a region of at least 2.0 octaves within the electromagnetic spectrum region of 350 nm to 18,000 nm. 2. The optic of claim 1 wherein the structures are configured to reduce reflection within the electromagnetic spectrum region of 3,000 nm to 18,000 nm. 3. The optic of claim 1 wherein the buffer layer comprises AlN, SiO2, ZrO2, or Si3N4. 4. The optic of claim 3 wherein the buffer layer comprises AlN. 5. The optic of claim 1 wherein the ratio of the mean height of structures to mean base-base spacing of adjacent structures is from 4 to 12. 6. The optic of claim 1 wherein the substrate comprises ZnS, ZnSe, Ge, GaAs, GaP, CdTe, HgCdTe, BaF2, CaF2, CaF2As, Y2O3, MgO, AlON, spinel, sapphire, or fused silica. 7. The optic of claim 6 wherein the substrate comprises ZnS or ZnSe. 8. The optic of claim 1 further comprising a second buffer layer deposited on a second side of the substrate opposite the first side, and a second plurality of surface structures formed by reactive ion etching of the second buffer-coated substrate, wherein the second plurality of structures are configured to reduce reflection of electromagnetic radiation having an incident angle from 0° to 70° over a region of at least 2.0 octaves within the electromagnetic spectrum region of 350 nanometers (nm) to 18,000 nm. 9. The optic of claim 1 wherein the substrate comprises a non planar surface. 10. The optic of claim 8 wherein the substrate comprises a non planar surface. 11. A method of forming a plurality of random surface structures on an optical substrate, comprising:
(a) providing a substrate; (b) depositing a buffer layer on a surface of the substrate; (c) depositing a metal film on the buffer layer; (d) heating to effect annealing of the metal into randomly arranged nanoparticles; (e) dry etching the buffer-coated substrate; and (f) performing a wet etch to remove metal nanoparticles. 12. The method of claim 11 wherein the ratio of mean height to mean base-base spacing of the formed surface structures is from 3 to 12. 13. The method of claim 12, wherein the height of the formed surface structures is from 0.5 μm to 3.5 μm. 14. The method of claim 11 wherein the frustum parameters of the formed structures are from 0 to 0.8. 15. The method of claim 14 wherein the frustum parameters are from 0 to 0.4. 16. The method of claim 11, wherein the metal film is deposited to an initial thickness of between 4 nm and 20 nm 17. A method of forming a plurality of random surface structures on an optical substrate, comprising:
(a) providing a substrate comprising ZnSe; (b) depositing a buffer layer comprising AlN on a surface of the substrate; (c) depositing a metal film comprising Ni on the buffer layer; (d) heating to effect annealing of the Ni into randomly arranged nanoparticles; (e) dry etching the buffer-coated substrate; and (f) wet etching to remove metal nanoparticles. | 2,800 |
11,569 | 11,569 | 15,381,259 | 2,851 | A vehicle includes an energy storage configured to store electric energy for at least propulsion of the vehicle, an energy storage thermal system configured to provide thermal conditioning of the energy storage, and a coupling configured to receive thermal conditioning of the energy storage from a thermal system external to the vehicle. The coupling provides thermal conditioning of the energy storage while charging when available from the thermal system external to the vehicle. The energy storage thermal system provides thermal conditioning of the energy storage while charging when the thermal system external to the vehicle is not available. | 1. A vehicle comprising:
an energy storage configured to store electric energy for at least propulsion of the vehicle; an energy storage thermal system configured to provide thermal conditioning of the energy storage; and a coupling configured to receive thermal conditioning of the energy storage from a thermal system external to the vehicle, wherein the coupling provides thermal conditioning of the energy storage while charging when available from the thermal system external to the vehicle; and wherein the energy storage thermal system provides thermal conditioning of the energy storage while charging when the thermal system external to the vehicle is not available. | A vehicle includes an energy storage configured to store electric energy for at least propulsion of the vehicle, an energy storage thermal system configured to provide thermal conditioning of the energy storage, and a coupling configured to receive thermal conditioning of the energy storage from a thermal system external to the vehicle. The coupling provides thermal conditioning of the energy storage while charging when available from the thermal system external to the vehicle. The energy storage thermal system provides thermal conditioning of the energy storage while charging when the thermal system external to the vehicle is not available.1. A vehicle comprising:
an energy storage configured to store electric energy for at least propulsion of the vehicle; an energy storage thermal system configured to provide thermal conditioning of the energy storage; and a coupling configured to receive thermal conditioning of the energy storage from a thermal system external to the vehicle, wherein the coupling provides thermal conditioning of the energy storage while charging when available from the thermal system external to the vehicle; and wherein the energy storage thermal system provides thermal conditioning of the energy storage while charging when the thermal system external to the vehicle is not available. | 2,800 |
11,570 | 11,570 | 15,119,484 | 2,853 | The present invention provides digital printing inks comprising one or more acrylamides. Particularly preferred are inks containing diacetone acrylamide. The inks of the invention show good cure speed, blocking resistance, tack free cure, stability and resistance to blocking, and adhesion to the substrate. The inks of the invention are useful for replacing the currently used inks containing odiferous and toxic components. | 1. A digital printing ink comprising:
a) 0.5-60 wt % of an acrylamide material or blends thereof; b) 0-80 wt % of a monofunctional acrylate monomer or blends thereof; c) 0-10 wt % of a difunctional acrylate monomer or blends thereof; d) 0-5 wt % of a trifunctional or higher acrylate monomer or blends thereof; e) 0.1-25 wt % of a photoinitiator or blends thereof; f) 0-18 wt % of an amine synergist; g) 0-5 wt % of N-vinyl compounds; h) 0-80 wt % water; i) 0-50 wt % of an acrylated polyurethane dispersion; and j) 0-30 wt % of a water-compatible organic solvent;
wherein the composition contains no N-vinyl caprolactam, N-vinyl pyrrolidone, or N-acryloyl morpholine. 2. (canceled) 3. The ink of claim 1, wherein the acrylamide material is selected from the group consisting of diacetone acrylamide, N-isobutoxymethyl acrylamide, N-isopropyl acrylamide, N,N′-methylene bisacrylamide, or 2-(prop-2-enamido)ethylacetate, or a combination thereof. 4. The ink of claim 1, wherein at least a portion of the acrylamide material is diacetone acrylamide, or wherein the majority of the acrylamide material is diacetone acrylamide, or wherein all of the acrylamide material is diacetone acrylamide. 5. (canceled) 6. The ink of claim 1, wherein the monofunctional acrylate monomer, or blends thereof, comprises no more than 25 wt % of isobornyl acrylate, t-butyl cyclohexyl acrylate or 3,3,5-trimethyl cyclohexyl acrylate. 7. The ink of claim 1, wherein the monofunctional monomer, or blends thereof, comprises 0.1-20 wt %, or 0.1-10 wt %, or 0.1-5 wt % of isobornyl acrylate, t-butyl cyclohexyl acrylate and 3,3,5-trimethyl cyclohexyl acrylate. 8. (canceled) 9. (canceled) 10. The ink of claim 1, wherein the monofunctional monomer, or blends thereof, contains no isobornyl acrylate, t-butyl cyclohexyl acrylate or 3,3,5-trimethyl cyclohexyl acrylate. 11. The ink of claim 1, containing no N-vinyl compounds. 12. The ink of claim 1, containing no difunctional or higher monomers. 13. The ink of claim 1, wherein the photoinitiator is present in an amount of 0.1-20 wt %. 14. The ink of claim 1, wherein the water is present in an amount of 20-70 wt %. 15. The ink of claim 1, wherein the acrylamide material is present in an amount of 1-40 wt %, or 1-30 wt %, or 1-20 wt %, or 1-10 wt %, or 1-5 wt %. 16. (canceled) 17. (canceled) 18. (canceled) 19. (canceled) 20. The ink of claim 1, further comprising a colorant. 21. The ink of claim 1, further comprising one or more additives selected from the group consisting of stabilizers, surfactants, defoamers, slip additives, wetting additives and synergists. 22. An ink according to claim 1, wherein the ink is an ink jet ink. 23. An ink according to claim 1, wherein the ink is an aerosol jet ink. 24. A method of making a digital ink, comprising mixing:
a) 0.5-60 wt % of an acrylamide material or blends thereof; b) 0-80 wt % of a monofunctional acrylate monomer or blends thereof; c) 0-10 wt % of a difunctional acrylate monomer or blends thereof; d) 0-5 wt % of a trifunctional or higher acrylate monomer or blends thereof; e) 0.1-25 wt % of a photoinitiator or blends thereof; f) 0-18 wt % of an amine synergist; g) 0-5 wt % of N-vinyl compounds; h) 0-80 wt % water; i) 0-50 wt % of an acrylated polyurethane dispersion; and j) 0-30 wt % of a water-compatible organic solvent;
wherein the composition contains no N-vinyl caprolactam, N-vinyl pyrrolidone, or N-acryloyl morpholine. 25. (canceled) 26. Use of the digital ink of claim 1, comprising printing the ink onto a substrate. 27. A printed article comprising the digital ink of claim 1. 28. The digital printing ink of claim 1, wherein the ink is water-based, and comprises 0.5-60 wt % of an acrylamide material or blends thereof, 15-50 wt % of an acrylated polyurethane dispersion, and 1-80 wt % water. 29. (canceled) 30. (canceled) 31. (canceled) 32. (canceled) 33. (canceled) 34. (canceled) 35. (canceled) 36. (canceled) 37. (canceled) 38. The ink of claim 28, wherein the acrylated polyurethane dispersion is present in an amount of 20-30 wt %. 39. (canceled) 40. (canceled) 41. (canceled) 42. The ink of claim 28, wherein the water is present in an amount of 20-80 wt %, or 60-70 wt %, or 30-70 wt %, or 40-50 wt %, or 20-30 wt %. 43. (canceled) 44. (canceled) 45. (canceled) 46. (canceled) 47. The ink of claim 28, wherein the solvent is present in an amount of 1-30 wt %, or 1-20 wt %. 48. (canceled) 49. The ink of claim 28, wherein the acrylamide material is present in an amount of 0.5-40 wt %, or 0.5-30 wt %, or 0.5-20 wt %, or 0.5-10 wt %, or 0.5-5 wt %. 50. (canceled) 51. (canceled) 52. (canceled) 53. (canceled) 54. (canceled) 55. (canceled) 56. (canceled) 57. (canceled) 58. (canceled) 59. (canceled) 60. (canceled) 61. (canceled) | The present invention provides digital printing inks comprising one or more acrylamides. Particularly preferred are inks containing diacetone acrylamide. The inks of the invention show good cure speed, blocking resistance, tack free cure, stability and resistance to blocking, and adhesion to the substrate. The inks of the invention are useful for replacing the currently used inks containing odiferous and toxic components.1. A digital printing ink comprising:
a) 0.5-60 wt % of an acrylamide material or blends thereof; b) 0-80 wt % of a monofunctional acrylate monomer or blends thereof; c) 0-10 wt % of a difunctional acrylate monomer or blends thereof; d) 0-5 wt % of a trifunctional or higher acrylate monomer or blends thereof; e) 0.1-25 wt % of a photoinitiator or blends thereof; f) 0-18 wt % of an amine synergist; g) 0-5 wt % of N-vinyl compounds; h) 0-80 wt % water; i) 0-50 wt % of an acrylated polyurethane dispersion; and j) 0-30 wt % of a water-compatible organic solvent;
wherein the composition contains no N-vinyl caprolactam, N-vinyl pyrrolidone, or N-acryloyl morpholine. 2. (canceled) 3. The ink of claim 1, wherein the acrylamide material is selected from the group consisting of diacetone acrylamide, N-isobutoxymethyl acrylamide, N-isopropyl acrylamide, N,N′-methylene bisacrylamide, or 2-(prop-2-enamido)ethylacetate, or a combination thereof. 4. The ink of claim 1, wherein at least a portion of the acrylamide material is diacetone acrylamide, or wherein the majority of the acrylamide material is diacetone acrylamide, or wherein all of the acrylamide material is diacetone acrylamide. 5. (canceled) 6. The ink of claim 1, wherein the monofunctional acrylate monomer, or blends thereof, comprises no more than 25 wt % of isobornyl acrylate, t-butyl cyclohexyl acrylate or 3,3,5-trimethyl cyclohexyl acrylate. 7. The ink of claim 1, wherein the monofunctional monomer, or blends thereof, comprises 0.1-20 wt %, or 0.1-10 wt %, or 0.1-5 wt % of isobornyl acrylate, t-butyl cyclohexyl acrylate and 3,3,5-trimethyl cyclohexyl acrylate. 8. (canceled) 9. (canceled) 10. The ink of claim 1, wherein the monofunctional monomer, or blends thereof, contains no isobornyl acrylate, t-butyl cyclohexyl acrylate or 3,3,5-trimethyl cyclohexyl acrylate. 11. The ink of claim 1, containing no N-vinyl compounds. 12. The ink of claim 1, containing no difunctional or higher monomers. 13. The ink of claim 1, wherein the photoinitiator is present in an amount of 0.1-20 wt %. 14. The ink of claim 1, wherein the water is present in an amount of 20-70 wt %. 15. The ink of claim 1, wherein the acrylamide material is present in an amount of 1-40 wt %, or 1-30 wt %, or 1-20 wt %, or 1-10 wt %, or 1-5 wt %. 16. (canceled) 17. (canceled) 18. (canceled) 19. (canceled) 20. The ink of claim 1, further comprising a colorant. 21. The ink of claim 1, further comprising one or more additives selected from the group consisting of stabilizers, surfactants, defoamers, slip additives, wetting additives and synergists. 22. An ink according to claim 1, wherein the ink is an ink jet ink. 23. An ink according to claim 1, wherein the ink is an aerosol jet ink. 24. A method of making a digital ink, comprising mixing:
a) 0.5-60 wt % of an acrylamide material or blends thereof; b) 0-80 wt % of a monofunctional acrylate monomer or blends thereof; c) 0-10 wt % of a difunctional acrylate monomer or blends thereof; d) 0-5 wt % of a trifunctional or higher acrylate monomer or blends thereof; e) 0.1-25 wt % of a photoinitiator or blends thereof; f) 0-18 wt % of an amine synergist; g) 0-5 wt % of N-vinyl compounds; h) 0-80 wt % water; i) 0-50 wt % of an acrylated polyurethane dispersion; and j) 0-30 wt % of a water-compatible organic solvent;
wherein the composition contains no N-vinyl caprolactam, N-vinyl pyrrolidone, or N-acryloyl morpholine. 25. (canceled) 26. Use of the digital ink of claim 1, comprising printing the ink onto a substrate. 27. A printed article comprising the digital ink of claim 1. 28. The digital printing ink of claim 1, wherein the ink is water-based, and comprises 0.5-60 wt % of an acrylamide material or blends thereof, 15-50 wt % of an acrylated polyurethane dispersion, and 1-80 wt % water. 29. (canceled) 30. (canceled) 31. (canceled) 32. (canceled) 33. (canceled) 34. (canceled) 35. (canceled) 36. (canceled) 37. (canceled) 38. The ink of claim 28, wherein the acrylated polyurethane dispersion is present in an amount of 20-30 wt %. 39. (canceled) 40. (canceled) 41. (canceled) 42. The ink of claim 28, wherein the water is present in an amount of 20-80 wt %, or 60-70 wt %, or 30-70 wt %, or 40-50 wt %, or 20-30 wt %. 43. (canceled) 44. (canceled) 45. (canceled) 46. (canceled) 47. The ink of claim 28, wherein the solvent is present in an amount of 1-30 wt %, or 1-20 wt %. 48. (canceled) 49. The ink of claim 28, wherein the acrylamide material is present in an amount of 0.5-40 wt %, or 0.5-30 wt %, or 0.5-20 wt %, or 0.5-10 wt %, or 0.5-5 wt %. 50. (canceled) 51. (canceled) 52. (canceled) 53. (canceled) 54. (canceled) 55. (canceled) 56. (canceled) 57. (canceled) 58. (canceled) 59. (canceled) 60. (canceled) 61. (canceled) | 2,800 |
11,571 | 11,571 | 15,327,296 | 2,815 | This thin film transistor has a gate electrode, a gate insulating film, an oxide semiconductor thin film, an etch stop layer for protecting the oxide semiconductor thin film, a source and drain electrodes, and a passivation film in this order on a substrate. The oxide semiconductor thin film is formed of an oxide configured from In, Ga and Sn as metal elements, and O, and has an amorphous structure, and the etch stop layer and/or the passivation film includes SiNx. The thin film transistor has an extremely high mobility of approximately 40 cm 2 /Vs or more. | 1. A thin film transistor comprising a gate electrode, a gate insulating film, an oxide semiconductor thin film, an etch stop layer for protecting the oxide semiconductor thin film, a source/drain electrode, and a passivation film on a substrate in this order,
wherein the oxide semiconductor thin film is formed of an oxide constituted by metal elements of In, Ga, and Sn and O and has an amorphous structure, and an atomic ratio of each of the metal elements relative to all the In, Ga, and Sn satisfies formulae (1) to (3) below, and at least one of the etch stop layer and the passivation film contains SiNx.
0.30≦In/(In+Ga+Sn)≦0.50 (1)
0.20≦Ga/(In+Ga+Sn)≦0.30 (2)
0.25≦Sn/(In+Ga+Sn)≦0.45 (3) 2. The thin film transistor according to claim 1, wherein at least part of the oxide semiconductor thin film is crystallized. 3. The thin film transistor according to claim 1, wherein the passivation film contains SiNx, and both ends of the oxide semiconductor thin film in a channel length direction and in a channel width direction are in contact with the etch stop layer. 4. The thin film transistor according to claim 2, wherein the passivation film contains SiNx, and both ends of the oxide semiconductor thin film in a channel length direction and in a channel width direction are in contact with the etch stop layer. | This thin film transistor has a gate electrode, a gate insulating film, an oxide semiconductor thin film, an etch stop layer for protecting the oxide semiconductor thin film, a source and drain electrodes, and a passivation film in this order on a substrate. The oxide semiconductor thin film is formed of an oxide configured from In, Ga and Sn as metal elements, and O, and has an amorphous structure, and the etch stop layer and/or the passivation film includes SiNx. The thin film transistor has an extremely high mobility of approximately 40 cm 2 /Vs or more.1. A thin film transistor comprising a gate electrode, a gate insulating film, an oxide semiconductor thin film, an etch stop layer for protecting the oxide semiconductor thin film, a source/drain electrode, and a passivation film on a substrate in this order,
wherein the oxide semiconductor thin film is formed of an oxide constituted by metal elements of In, Ga, and Sn and O and has an amorphous structure, and an atomic ratio of each of the metal elements relative to all the In, Ga, and Sn satisfies formulae (1) to (3) below, and at least one of the etch stop layer and the passivation film contains SiNx.
0.30≦In/(In+Ga+Sn)≦0.50 (1)
0.20≦Ga/(In+Ga+Sn)≦0.30 (2)
0.25≦Sn/(In+Ga+Sn)≦0.45 (3) 2. The thin film transistor according to claim 1, wherein at least part of the oxide semiconductor thin film is crystallized. 3. The thin film transistor according to claim 1, wherein the passivation film contains SiNx, and both ends of the oxide semiconductor thin film in a channel length direction and in a channel width direction are in contact with the etch stop layer. 4. The thin film transistor according to claim 2, wherein the passivation film contains SiNx, and both ends of the oxide semiconductor thin film in a channel length direction and in a channel width direction are in contact with the etch stop layer. | 2,800 |
11,572 | 11,572 | 14,146,973 | 2,837 | Magnetic component assemblies for circuit boards include magnetic cores formed with a gap and preformed conductive windings sliding assembled to the cores via the gaps. The gaps in the cores are filled with a magnetic material to enhance the magnetic performance. The magnetic component assemblies may define power inductors. | 1. A surface mount magnetic component assembly comprising:
a magnetic core fabricated from a first magnetic material, the magnetic core having at least one gap formed therein; a conductive winding extending through the at least one gap; and a second magnetic material, separately provided from the magnetic core, filling the gap. 2. The surface mount magnetic component assembly of claim 1, wherein the first magnetic material comprises a ferrite material and the second magnetic material comprises a non-ferrite material. 3. The surface mount magnetic component assembly of claim 2, wherein the ferrite material comprises ferrite particles mixed with a polymer to form a distributed gap material. 4. The surface mount magnetic component assembly of claim 2, wherein the second magnetic material comprises metal particles mixed with a polymer to form a distributed gap material. 5. The surface mount magnetic component assembly of claim 1, wherein the magnetic core comprises a single piece core and the conductive winding comprises a preformed winding. 6. The surface mount magnetic component assembly of claim 1, wherein the magnetic core includes opposed top and bottom side walls and opposing lateral side walls, and the gap extends partially between the opposing lateral side walls. 7. The surface mount magnetic component assembly of claim 6, wherein the magnetic core piece further has opposing longitudinal side walls, and wherein the gap extends to the longitudinal side walls. 8. The surface mount magnetic component assembly of claim 6, wherein the gap extends parallel to the top side wall. 9. The surface mount magnetic component assembly of claim 6, wherein the gap extends perpendicularly to the top side wall. 10. The surface mount magnetic component assembly of claim 6, wherein the gap is open to the bottom side wall. 11. The surface mount magnetic component assembly of claim 6, wherein the magnetic core has a U-shaped cross section. 12. The surface mount magnetic component assembly of claim 6, wherein the magnetic core has a T-shaped cross section. 13. The surface mount magnetic component assembly of claim 1, wherein the conductive winding is preformed and separately provided from the magnetic core. 14. The surface mount magnetic component assembly of claim 1, wherein the conductive winding has a main winding section, terminal sections extending perpendicularly to the main winding section, and surface mount terminal sections extending perpendicularly to the main winding section. 15. The surface mount magnetic component assembly of claim 14, wherein the gap has a thickness, the gap thickness being greater than a thickness of the main winding section, whereby the main winding section can be slidably inserted into the gap. 16. The surface mount magnetic component assembly of claim 14, wherein the gap has a width, and at least one of the surface mount terminal sections has a width greater than the gap width. 17. The surface mount magnetic component assembly of claim 1, wherein the assembly defines a power inductor. 18. A surface mount magnetic component assembly comprising:
a single magnetic core piece fabricated from a first magnetic material comprising first magnetic powder particles mixed with a polymer, the single magnetic core piece having a gap formed therein; a conductive winding comprising a main winding section and surface mount terminal sections, the main winding section extending through the gap; and a second magnetic material filling the gap, the second magnetic material separately provided from the magnetic core and a having second magnetic powder particles mixed with a polymer; wherein one of the magnetic powder materials in the first and second magnetic materials comprises ferrite particles and the other of the magnetic powder materials in the first and second magnetic powder materials comprises non-ferrite particles. 19. The surface mount magnetic component assembly of claim 18 wherein the single magnetic core piece has a U-shape. 20. The surface mount magnetic component assembly of claim 18 wherein the single magnetic core piece has a T-shape. 21. The surface mount magnetic component assembly of claim 18, wherein the conductive winding is preformed from the single magnetic core piece. 22. The surface mount magnetic component assembly of claim 18, wherein the assembly defines a power inductor. 23. A surface mount magnetic component assembly comprising:
a single magnetic core piece fabricated from a first magnetic material comprising first magnetic powder particles mixed with a polymer, the single magnetic core piece having a gap formed therein; a preformed conductive winding comprising a main winding section extending through the gap and opposed terminal sections extending perpendicular to the main winding section, the opposed terminal sections extending externally to the single magnetic core piece; and a second magnetic material filling the gap, the second magnetic material separately provided from the magnetic core and a having second magnetic powder particles mixed with a polymer; wherein one of the magnetic powder materials in the first and second magnetic materials comprises ferrite particles and the other of the magnetic powder materials in the first and second magnetic powder materials comprises non-ferrite particles; and wherein the assembly defines a power inductor. 24. A surface mount magnetic component assembly comprising:
a magnetic core fabricated as a single piece from a first magnetic material, the magnetic core having opposed top and bottom side walls and at least one non-magnetic gap formed therein and extending between the opposed top and bottom side walls; a conductive winding extending through the at least one non-magnetic gap; and a second magnetic material, separately provided from the magnetic core, applied to the non-magnetic gap. 25. The surface mount magnetic component assembly of claim 24, wherein the second magnetic material is applied to the non-magnetic gap in one of a liquid form, a semisolid form, or solid form. 26. The surface mount magnetic component assembly of claim 24, wherein the second magnetic material is applied to the non-magnetic gap in one of a ribbon or tape configuration. 27. The surface mount magnetic component assembly of claim 24, wherein at least a portion of the magnetic core has a U-shaped cross section. 28. The surface mount magnetic component assembly of claim 24, wherein at least a portion of the single magnetic core piece has a T-shaped cross section. 29. The surface mount magnetic component assembly of claim 24, wherein the conductive winding is preformed from the single magnetic core piece. 30. The surface mount magnetic component assembly of claim 24, wherein the assembly defines a power inductor. 31. The surface mount magnetic component assembly of claim 24, wherein the magnetic core further includes opposing lateral side walls, and wherein the non-magnetic gap extends partially between the opposing lateral side walls. 32. The surface mount magnetic component assembly of claim 24, wherein the magnetic core further includes opposing longitudinal side walls, and wherein the non-magnetic gap extends to the longitudinal side walls. 33. The surface mount magnetic component assembly of claim 24, wherein the non-magnetic gap extends parallel to the top side wall. 34. The surface mount magnetic component assembly of claim 24, wherein the non-magnetic gap extends perpendicularly to the top side wall. 35. The surface mount magnetic component assembly of claim 24, wherein the non-magnetic gap is open to the bottom side wall. 36. The surface mount magnetic component assembly of claim 24, wherein the conductive winding has a main winding section, terminal sections extending perpendicularly to the main winding section, and surface mount terminal sections extending perpendicularly to the main winding section. 37. The surface mount magnetic component assembly of claim 36, wherein the non-magnetic gap has a thickness, the gap thickness being greater than a thickness of the main winding section, whereby the main winding section can be slidably inserted into the non-magnetic gap. 38. The surface mount magnetic component assembly of claim 24, wherein the non-magnetic gap has a width, and at least one of the surface mount terminal sections has a width greater than the gap width. 39. The surface mount magnetic component assembly of claim 24, wherein the second magnetic material has different magnetic properties than the first magnetic material. 40. The surface mount magnetic component assembly of claim 24, wherein the bottom side wall of the magnetic core is flat. 41. The surface mount magnetic component assembly of claim 24, wherein the bottom side wall includes a projecting guide surface. | Magnetic component assemblies for circuit boards include magnetic cores formed with a gap and preformed conductive windings sliding assembled to the cores via the gaps. The gaps in the cores are filled with a magnetic material to enhance the magnetic performance. The magnetic component assemblies may define power inductors.1. A surface mount magnetic component assembly comprising:
a magnetic core fabricated from a first magnetic material, the magnetic core having at least one gap formed therein; a conductive winding extending through the at least one gap; and a second magnetic material, separately provided from the magnetic core, filling the gap. 2. The surface mount magnetic component assembly of claim 1, wherein the first magnetic material comprises a ferrite material and the second magnetic material comprises a non-ferrite material. 3. The surface mount magnetic component assembly of claim 2, wherein the ferrite material comprises ferrite particles mixed with a polymer to form a distributed gap material. 4. The surface mount magnetic component assembly of claim 2, wherein the second magnetic material comprises metal particles mixed with a polymer to form a distributed gap material. 5. The surface mount magnetic component assembly of claim 1, wherein the magnetic core comprises a single piece core and the conductive winding comprises a preformed winding. 6. The surface mount magnetic component assembly of claim 1, wherein the magnetic core includes opposed top and bottom side walls and opposing lateral side walls, and the gap extends partially between the opposing lateral side walls. 7. The surface mount magnetic component assembly of claim 6, wherein the magnetic core piece further has opposing longitudinal side walls, and wherein the gap extends to the longitudinal side walls. 8. The surface mount magnetic component assembly of claim 6, wherein the gap extends parallel to the top side wall. 9. The surface mount magnetic component assembly of claim 6, wherein the gap extends perpendicularly to the top side wall. 10. The surface mount magnetic component assembly of claim 6, wherein the gap is open to the bottom side wall. 11. The surface mount magnetic component assembly of claim 6, wherein the magnetic core has a U-shaped cross section. 12. The surface mount magnetic component assembly of claim 6, wherein the magnetic core has a T-shaped cross section. 13. The surface mount magnetic component assembly of claim 1, wherein the conductive winding is preformed and separately provided from the magnetic core. 14. The surface mount magnetic component assembly of claim 1, wherein the conductive winding has a main winding section, terminal sections extending perpendicularly to the main winding section, and surface mount terminal sections extending perpendicularly to the main winding section. 15. The surface mount magnetic component assembly of claim 14, wherein the gap has a thickness, the gap thickness being greater than a thickness of the main winding section, whereby the main winding section can be slidably inserted into the gap. 16. The surface mount magnetic component assembly of claim 14, wherein the gap has a width, and at least one of the surface mount terminal sections has a width greater than the gap width. 17. The surface mount magnetic component assembly of claim 1, wherein the assembly defines a power inductor. 18. A surface mount magnetic component assembly comprising:
a single magnetic core piece fabricated from a first magnetic material comprising first magnetic powder particles mixed with a polymer, the single magnetic core piece having a gap formed therein; a conductive winding comprising a main winding section and surface mount terminal sections, the main winding section extending through the gap; and a second magnetic material filling the gap, the second magnetic material separately provided from the magnetic core and a having second magnetic powder particles mixed with a polymer; wherein one of the magnetic powder materials in the first and second magnetic materials comprises ferrite particles and the other of the magnetic powder materials in the first and second magnetic powder materials comprises non-ferrite particles. 19. The surface mount magnetic component assembly of claim 18 wherein the single magnetic core piece has a U-shape. 20. The surface mount magnetic component assembly of claim 18 wherein the single magnetic core piece has a T-shape. 21. The surface mount magnetic component assembly of claim 18, wherein the conductive winding is preformed from the single magnetic core piece. 22. The surface mount magnetic component assembly of claim 18, wherein the assembly defines a power inductor. 23. A surface mount magnetic component assembly comprising:
a single magnetic core piece fabricated from a first magnetic material comprising first magnetic powder particles mixed with a polymer, the single magnetic core piece having a gap formed therein; a preformed conductive winding comprising a main winding section extending through the gap and opposed terminal sections extending perpendicular to the main winding section, the opposed terminal sections extending externally to the single magnetic core piece; and a second magnetic material filling the gap, the second magnetic material separately provided from the magnetic core and a having second magnetic powder particles mixed with a polymer; wherein one of the magnetic powder materials in the first and second magnetic materials comprises ferrite particles and the other of the magnetic powder materials in the first and second magnetic powder materials comprises non-ferrite particles; and wherein the assembly defines a power inductor. 24. A surface mount magnetic component assembly comprising:
a magnetic core fabricated as a single piece from a first magnetic material, the magnetic core having opposed top and bottom side walls and at least one non-magnetic gap formed therein and extending between the opposed top and bottom side walls; a conductive winding extending through the at least one non-magnetic gap; and a second magnetic material, separately provided from the magnetic core, applied to the non-magnetic gap. 25. The surface mount magnetic component assembly of claim 24, wherein the second magnetic material is applied to the non-magnetic gap in one of a liquid form, a semisolid form, or solid form. 26. The surface mount magnetic component assembly of claim 24, wherein the second magnetic material is applied to the non-magnetic gap in one of a ribbon or tape configuration. 27. The surface mount magnetic component assembly of claim 24, wherein at least a portion of the magnetic core has a U-shaped cross section. 28. The surface mount magnetic component assembly of claim 24, wherein at least a portion of the single magnetic core piece has a T-shaped cross section. 29. The surface mount magnetic component assembly of claim 24, wherein the conductive winding is preformed from the single magnetic core piece. 30. The surface mount magnetic component assembly of claim 24, wherein the assembly defines a power inductor. 31. The surface mount magnetic component assembly of claim 24, wherein the magnetic core further includes opposing lateral side walls, and wherein the non-magnetic gap extends partially between the opposing lateral side walls. 32. The surface mount magnetic component assembly of claim 24, wherein the magnetic core further includes opposing longitudinal side walls, and wherein the non-magnetic gap extends to the longitudinal side walls. 33. The surface mount magnetic component assembly of claim 24, wherein the non-magnetic gap extends parallel to the top side wall. 34. The surface mount magnetic component assembly of claim 24, wherein the non-magnetic gap extends perpendicularly to the top side wall. 35. The surface mount magnetic component assembly of claim 24, wherein the non-magnetic gap is open to the bottom side wall. 36. The surface mount magnetic component assembly of claim 24, wherein the conductive winding has a main winding section, terminal sections extending perpendicularly to the main winding section, and surface mount terminal sections extending perpendicularly to the main winding section. 37. The surface mount magnetic component assembly of claim 36, wherein the non-magnetic gap has a thickness, the gap thickness being greater than a thickness of the main winding section, whereby the main winding section can be slidably inserted into the non-magnetic gap. 38. The surface mount magnetic component assembly of claim 24, wherein the non-magnetic gap has a width, and at least one of the surface mount terminal sections has a width greater than the gap width. 39. The surface mount magnetic component assembly of claim 24, wherein the second magnetic material has different magnetic properties than the first magnetic material. 40. The surface mount magnetic component assembly of claim 24, wherein the bottom side wall of the magnetic core is flat. 41. The surface mount magnetic component assembly of claim 24, wherein the bottom side wall includes a projecting guide surface. | 2,800 |
11,573 | 11,573 | 11,827,654 | 2,847 | A system is provided having a superconductive cable (KA) which consists of a superconductive inner conductor ( 1 ), a screen arranged concentrically therewith and a dielectric applied ( 3 ) between the inner conductor and the screen. The screen (S) is constructed from a superconductive part ( 4 ) and a part ( 5 ) consisting of an electrically highly conductive material enclosing the latter, and in which the screen is enclosed with the inclusion of an intermediate space ( 9 ), used for feeding a liquid refrigerant through, by a cryostat (KR) which consists of two stainless steel tubes ( 6, 7 ) extending concentrically with one another and separated from one another by an intermediate space ( 8 ). In order to protect against abrasion of metallic parts, the surface of the screen (S) of the cable (KA), which is enclosed by the cryostat (KR), and/or of the cryostat (KR) is provided all around on its inner surface with a liner layer ( 10 ) made of an abrasion-resistant material with a lower friction coefficient compared with steel, which, when it encloses the screen (S) of the cable (KA), is permeable for the refrigerant. | 1. System having a superconductive cable comprising:
a superconductive inner conductor; a screen arranged concentrically therewith; and a dielectric applied between the inner conductor and the screen, in which the screen is constructed from a superconductive part and a part made from an electrically highly conductive material enclosing the latter, and in which the screen is enclosed with the inclusion of an intermediate space, used for feeding a liquid refrigerant through, by a cryostat which has two stainless steel tubes extending concentrically with one another and separated from one another by an intermediate space, which is evacuated and provided with superinsulation, wherein the surface of the screen of the cable, which is enclosed by the cryostat, and/or of the cryostat is provided all around on its inner surface with a liner layer made of an abrasion-resistant material with a lower friction coefficient compared with steel, and a corresponding liner layer enclosing the screen of the cable is permeable for the refrigerant. 2. System according to claim 1, wherein the liner layer is made from bronze. 3. System according to claim 1, wherein the liner layer enclosing the screen of the cable includes a bronze strip wound around the screen with a gap. 4. System according to claim 1, wherein at least the inner tube of the cryostat, facing the screen of the cable, is corrugated transversely to its longitudinal direction. | A system is provided having a superconductive cable (KA) which consists of a superconductive inner conductor ( 1 ), a screen arranged concentrically therewith and a dielectric applied ( 3 ) between the inner conductor and the screen. The screen (S) is constructed from a superconductive part ( 4 ) and a part ( 5 ) consisting of an electrically highly conductive material enclosing the latter, and in which the screen is enclosed with the inclusion of an intermediate space ( 9 ), used for feeding a liquid refrigerant through, by a cryostat (KR) which consists of two stainless steel tubes ( 6, 7 ) extending concentrically with one another and separated from one another by an intermediate space ( 8 ). In order to protect against abrasion of metallic parts, the surface of the screen (S) of the cable (KA), which is enclosed by the cryostat (KR), and/or of the cryostat (KR) is provided all around on its inner surface with a liner layer ( 10 ) made of an abrasion-resistant material with a lower friction coefficient compared with steel, which, when it encloses the screen (S) of the cable (KA), is permeable for the refrigerant.1. System having a superconductive cable comprising:
a superconductive inner conductor; a screen arranged concentrically therewith; and a dielectric applied between the inner conductor and the screen, in which the screen is constructed from a superconductive part and a part made from an electrically highly conductive material enclosing the latter, and in which the screen is enclosed with the inclusion of an intermediate space, used for feeding a liquid refrigerant through, by a cryostat which has two stainless steel tubes extending concentrically with one another and separated from one another by an intermediate space, which is evacuated and provided with superinsulation, wherein the surface of the screen of the cable, which is enclosed by the cryostat, and/or of the cryostat is provided all around on its inner surface with a liner layer made of an abrasion-resistant material with a lower friction coefficient compared with steel, and a corresponding liner layer enclosing the screen of the cable is permeable for the refrigerant. 2. System according to claim 1, wherein the liner layer is made from bronze. 3. System according to claim 1, wherein the liner layer enclosing the screen of the cable includes a bronze strip wound around the screen with a gap. 4. System according to claim 1, wherein at least the inner tube of the cryostat, facing the screen of the cable, is corrugated transversely to its longitudinal direction. | 2,800 |
11,574 | 11,574 | 15,269,004 | 2,832 | An improved ocean wave energy collecting apparatus for extracting power, comprised of a plurality of module members in a lattice formation, moored as a group to the seabed via tether(s), each module reacting to each adjacent module, and to the apparatus' seabed mooring, in response to the orbital motion of water particles in ocean waves. A collection of modules is arranged and interconnected in crystal-like lattice layers, such that each module has rotation and/or linear motion in relation to an adjacent module as ocean wave energy passes, and is captured, by the apparatus. | 1. An apparatus for extracting power from wave motion in seawater over a sea floor, comprising:
a lattice structure comprised of a plurality of modules, said plurality of modules arranged into a plurality of layers, including an upper layer of modules and a lower layer of modules, said upper layer of modules being buoyant and said lower layer of modules being negatively buoyant in said seawater, each module being attached to at least one module vertically and at least one module horizontally to form the lattice structure; and a plurality of connecting members, each said connecting member connected to adjacent modules at respective connection points, and adapted for rotation around each said respective connection point; a mooring anchor attached to the sea floor; a tether attached between the anchor and the lattice structure; and a motion transducer adapted to convert rotational motion of said connecting members relative to said modules to electrical energy. 2. The apparatus according to claim 1, wherein at least one connecting member comprises telescoped tubes adapted to change length in response to the wave motion. 3. The apparatus according to claim 1, wherein at least one of the connection points is a universal joint permitting rotation of said connecting member around x, y, and z axes. 4. The apparatus according to claim 1, wherein at least one of the modules is provided with a vane for orienting the modules with respect to an oncoming direction of the waves. 5. The apparatus according to claim 1, further comprising an electrical cable transporting electrical current from said apparatus to land. 6. The apparatus according to claim 1, wherein the motion transducer comprises generators within a majority of the modules in the lattice. 7. The apparatus according to claim 1, wherein each module comprises a plurality of connection points. 8. The apparatus according to claim 7, wherein each module comprises four connection points, and wherein each of said connection points is adapted for attachment to one end of a connecting member. 9. The apparatus according to claim 1, wherein the tether comprises a linear and/or non-linear spring element. 10. The apparatus according to claim 1, wherein the tether is attached between the anchor and the upper layer of the lattice structure; between the anchor and the lower layer of the lattice structure; or between the anchor and the upper and lower layers of the lattice structure. 11. The apparatus according to claim 1, wherein the lattice has a front side facing oncoming waves and wherein the apparatus further comprises a second tether; and
wherein
the tether is attached between the anchor and the upper layer of the lattice structure; and
the second tether is attached between the anchor and the lower layer of the lattice structure. 12. The apparatus according to claim 10, wherein the tether, the second tether, or both is provided with a linear and/or nonlinear spring element. 13. The apparatus according to claim 1, further comprising lateral connecting members connected between two modules in the upper layer, the lower layer, or both. 14. The apparatus according to claim 1, wherein the connecting members have an adjustable length adapted to adjust a vertical distance between the upper layer and the lower layer of the lattice in accordance with wave conditions of the ocean waves. 15. The apparatus according to claim 1, wherein said plurality of layers includes at least one layer of modules between said upper and lower layers. 16. The apparatus according to claim 1, comprising a plurality of tethers connected to the lattice structure and to a common point on the sea floor, orienting the modules with respect to an oncoming direction of the waves. 17. The apparatus according to claim 1, wherein the plurality of modules is arranged in a crystalline pattern. 18. The apparatus according to claim 17, wherein the plurality of modules is arranged in a face centered cubic or body centered cubic crystalline pattern. | An improved ocean wave energy collecting apparatus for extracting power, comprised of a plurality of module members in a lattice formation, moored as a group to the seabed via tether(s), each module reacting to each adjacent module, and to the apparatus' seabed mooring, in response to the orbital motion of water particles in ocean waves. A collection of modules is arranged and interconnected in crystal-like lattice layers, such that each module has rotation and/or linear motion in relation to an adjacent module as ocean wave energy passes, and is captured, by the apparatus.1. An apparatus for extracting power from wave motion in seawater over a sea floor, comprising:
a lattice structure comprised of a plurality of modules, said plurality of modules arranged into a plurality of layers, including an upper layer of modules and a lower layer of modules, said upper layer of modules being buoyant and said lower layer of modules being negatively buoyant in said seawater, each module being attached to at least one module vertically and at least one module horizontally to form the lattice structure; and a plurality of connecting members, each said connecting member connected to adjacent modules at respective connection points, and adapted for rotation around each said respective connection point; a mooring anchor attached to the sea floor; a tether attached between the anchor and the lattice structure; and a motion transducer adapted to convert rotational motion of said connecting members relative to said modules to electrical energy. 2. The apparatus according to claim 1, wherein at least one connecting member comprises telescoped tubes adapted to change length in response to the wave motion. 3. The apparatus according to claim 1, wherein at least one of the connection points is a universal joint permitting rotation of said connecting member around x, y, and z axes. 4. The apparatus according to claim 1, wherein at least one of the modules is provided with a vane for orienting the modules with respect to an oncoming direction of the waves. 5. The apparatus according to claim 1, further comprising an electrical cable transporting electrical current from said apparatus to land. 6. The apparatus according to claim 1, wherein the motion transducer comprises generators within a majority of the modules in the lattice. 7. The apparatus according to claim 1, wherein each module comprises a plurality of connection points. 8. The apparatus according to claim 7, wherein each module comprises four connection points, and wherein each of said connection points is adapted for attachment to one end of a connecting member. 9. The apparatus according to claim 1, wherein the tether comprises a linear and/or non-linear spring element. 10. The apparatus according to claim 1, wherein the tether is attached between the anchor and the upper layer of the lattice structure; between the anchor and the lower layer of the lattice structure; or between the anchor and the upper and lower layers of the lattice structure. 11. The apparatus according to claim 1, wherein the lattice has a front side facing oncoming waves and wherein the apparatus further comprises a second tether; and
wherein
the tether is attached between the anchor and the upper layer of the lattice structure; and
the second tether is attached between the anchor and the lower layer of the lattice structure. 12. The apparatus according to claim 10, wherein the tether, the second tether, or both is provided with a linear and/or nonlinear spring element. 13. The apparatus according to claim 1, further comprising lateral connecting members connected between two modules in the upper layer, the lower layer, or both. 14. The apparatus according to claim 1, wherein the connecting members have an adjustable length adapted to adjust a vertical distance between the upper layer and the lower layer of the lattice in accordance with wave conditions of the ocean waves. 15. The apparatus according to claim 1, wherein said plurality of layers includes at least one layer of modules between said upper and lower layers. 16. The apparatus according to claim 1, comprising a plurality of tethers connected to the lattice structure and to a common point on the sea floor, orienting the modules with respect to an oncoming direction of the waves. 17. The apparatus according to claim 1, wherein the plurality of modules is arranged in a crystalline pattern. 18. The apparatus according to claim 17, wherein the plurality of modules is arranged in a face centered cubic or body centered cubic crystalline pattern. | 2,800 |
11,575 | 11,575 | 15,131,283 | 2,872 | A roll of multilayer optical film is described. The roll includes a substantially uniaxially-oriented multilayer optical film, where at least one layer of the multilayer optical film has indices of refraction in a length direction and a thickness direction that are substantially the same, but substantially different from an index of refraction in a width direction. | 1. A stretcher for processing a film, the stretcher comprising:
means for receiving a film; means for grasping edge portions of the film; means for conveying the film in a machine direction; and means for moving the opposing edge portions along diverging, substantially parabolic paths to form a stretched film. 2. An apparatus for processing a film, the apparatus comprising:
conveying means for conveying a film along a machine direction within a stretching region of the apparatus, the conveying means comprising gripping means for holding opposing edge portions of the film, a portion of the conveying means providing diverging curvilinear paths to stretch the film; and isolated takeaway means for grasping opposing takeaway regions of the film and taking the film from the conveyor directly from the stretching region and conveying the film further along in the machine direction. 3. The apparatus of claim 2, further comprising slitting means for slitting a stretched portion of the film between the opposing edge portions and the opposing takeaway regions to form selvages. | A roll of multilayer optical film is described. The roll includes a substantially uniaxially-oriented multilayer optical film, where at least one layer of the multilayer optical film has indices of refraction in a length direction and a thickness direction that are substantially the same, but substantially different from an index of refraction in a width direction.1. A stretcher for processing a film, the stretcher comprising:
means for receiving a film; means for grasping edge portions of the film; means for conveying the film in a machine direction; and means for moving the opposing edge portions along diverging, substantially parabolic paths to form a stretched film. 2. An apparatus for processing a film, the apparatus comprising:
conveying means for conveying a film along a machine direction within a stretching region of the apparatus, the conveying means comprising gripping means for holding opposing edge portions of the film, a portion of the conveying means providing diverging curvilinear paths to stretch the film; and isolated takeaway means for grasping opposing takeaway regions of the film and taking the film from the conveyor directly from the stretching region and conveying the film further along in the machine direction. 3. The apparatus of claim 2, further comprising slitting means for slitting a stretched portion of the film between the opposing edge portions and the opposing takeaway regions to form selvages. | 2,800 |
11,576 | 11,576 | 15,441,857 | 2,842 | A power module apparatus includes a power substrate, at least one power device electrically connected to the power substrate and a gate-source board mounted relative to the power substrate, the gate-source board electrically connected to the at least one power device, a housing secured to the power substrate, and a clamping circuit electrically connected to the at least one power device. The clamping circuit being configured to reduce a voltage charge up at a gate of the at least one power device to within 8 V of a desired voltage. | 1. A power module apparatus, comprising:
a power substrate; at least one power device electrically connected to the power substrate; a gate-source board mounted relative to the power substrate, the gate-source board electrically connected to the at least one power device; a housing secured to the power substrate; a clamping circuit electrically connected to the at least one power device; and the clamping circuit being configured to reduce a voltage charge up at a gate of the at least one power device to within 8 V of a desired voltage. 2. The power module apparatus of claim 1, wherein the clamping circuit comprises a Miller clamp. 3. The power module apparatus of claim 1,
wherein the clamping circuit is configured to clamp an input to the gate of the at least one power device; and wherein the clamping circuit is integrated in the power module apparatus and the clamping circuit is arranged with at least one of the following: a base plate, the power substrate, one of at least two power contacts, the at least one power device, the gate-source board, gate drive connectors, and the housing. 4. The power module apparatus of claim 2, wherein the clamping circuit is configured to clamp a voltage at the gate of the at least one power device to less than 8 V peak to peak. 5. The power module apparatus of claim 4,
wherein the clamping circuit comprises a transistor discretely holding the at least one power device off; wherein the transistor is connected to the gate of the at least one power device; and wherein the transistor is connected to at least one of the following: a source/emitter of the at least one power device and a negative voltage bias (−V). 6. The power module apparatus of claim 1, further comprising a sense and control circuit electrically connected to the clamping circuit, the sense and control circuit configured to control the clamping circuit as a function of a driver control signal. 7. The power module apparatus of claim 6, wherein the sense and control circuit is configured to control the clamping circuit as a function of the driver control signal based on a falling edge delay and rising edge pass through operation. 8. The power module apparatus of claim 1 wherein the clamping circuit is configured to reduce the voltage charge up at the gate of the at least one power device by at least 10%. 9. The power module apparatus of claim 1, wherein the clamping circuit is configured to reduce a voltage charge up at a gate of the at least one power device to within 6 V of a desired voltage. 10. A power module apparatus, comprising:
a power substrate positioned relative to a base plate; at least one power device electrically connected to at least two power contacts; a gate-source board mounted relative to the power substrate, the gate-source board electrically connected to the at least one power device; a clamping circuit electrically connected to the at least one power device, the clamping circuit configured to clamp an input to a gate of the at least one power device, wherein the clamping circuit is configured to clamp a voltage at the gate of the at least one power device to less than 10 V peak to peak. 11. The power module apparatus of claim 10, wherein the clamping circuit comprises a Miller clamp. 12. The power module apparatus of claim 10, wherein the clamping circuit is integrated in the power module apparatus and the clamping circuit is arranged with at least one of the following: the base plate, the power substrate, one of the at least two power contacts, the at least one power device, the gate-source board, gate drive connectors, and a housing. 13. The power module apparatus of claim 11,
wherein the clamping circuit comprises a transistor discretely holding the at least one power device off; wherein the transistor is connected to the gate of the at least one power device; and wherein the transistor is connected to at least one of the following: a source/emitter of the at least one power device and a negative voltage bias (−V). 14. The power module apparatus of claim 13, wherein the clamping circuit is configured to clamp a voltage at the gate of the at least one power device to less than 8 V peak to peak. 15. The power module apparatus of claim 10, further comprising a sense and control circuit electrically connected to the clamping circuit, the sense and control circuit configured to control the clamping circuit as a function of a driver control signal. 16. A power module apparatus, comprising:
a power substrate positioned relative to a base plate; at least one power device electrically connected to at least two power contacts; a gate-source board mounted relative to the power substrate, the gate-source board electrically connected to the at least one power device; and a clamping circuit electrically connected to the at least one power device, the clamping circuit configured to clamp an input to a gate of the at least one power device, wherein the clamping circuit is configured to reduce a voltage charge up at the gate of the at least one power device by at least 10%. 17. The power module apparatus of claim 16, wherein the clamping circuit comprises a Miller clamp. 18. The power module apparatus of claim 16, wherein the clamping circuit is integrated in the power module apparatus and the clamping circuit is arranged with at least one of the following: the base plate, the power substrate, one of the at least two power contacts, the at least one power device, the gate-source board, gate drive connectors, and a housing. 19. The power module apparatus of claim 17,
wherein the clamping circuit comprises a transistor discretely holding the at least one power device off; wherein the transistor is connected to the gate of the at least one power device; and wherein the transistor is connected to at least one of the following: a source/emitter of the at least one power device and a negative voltage bias (−V). 20. The power module apparatus of claim 16, wherein the clamping circuit is configured to reduce the voltage charge up at the gate of the at least one power device by at least 30%. | A power module apparatus includes a power substrate, at least one power device electrically connected to the power substrate and a gate-source board mounted relative to the power substrate, the gate-source board electrically connected to the at least one power device, a housing secured to the power substrate, and a clamping circuit electrically connected to the at least one power device. The clamping circuit being configured to reduce a voltage charge up at a gate of the at least one power device to within 8 V of a desired voltage.1. A power module apparatus, comprising:
a power substrate; at least one power device electrically connected to the power substrate; a gate-source board mounted relative to the power substrate, the gate-source board electrically connected to the at least one power device; a housing secured to the power substrate; a clamping circuit electrically connected to the at least one power device; and the clamping circuit being configured to reduce a voltage charge up at a gate of the at least one power device to within 8 V of a desired voltage. 2. The power module apparatus of claim 1, wherein the clamping circuit comprises a Miller clamp. 3. The power module apparatus of claim 1,
wherein the clamping circuit is configured to clamp an input to the gate of the at least one power device; and wherein the clamping circuit is integrated in the power module apparatus and the clamping circuit is arranged with at least one of the following: a base plate, the power substrate, one of at least two power contacts, the at least one power device, the gate-source board, gate drive connectors, and the housing. 4. The power module apparatus of claim 2, wherein the clamping circuit is configured to clamp a voltage at the gate of the at least one power device to less than 8 V peak to peak. 5. The power module apparatus of claim 4,
wherein the clamping circuit comprises a transistor discretely holding the at least one power device off; wherein the transistor is connected to the gate of the at least one power device; and wherein the transistor is connected to at least one of the following: a source/emitter of the at least one power device and a negative voltage bias (−V). 6. The power module apparatus of claim 1, further comprising a sense and control circuit electrically connected to the clamping circuit, the sense and control circuit configured to control the clamping circuit as a function of a driver control signal. 7. The power module apparatus of claim 6, wherein the sense and control circuit is configured to control the clamping circuit as a function of the driver control signal based on a falling edge delay and rising edge pass through operation. 8. The power module apparatus of claim 1 wherein the clamping circuit is configured to reduce the voltage charge up at the gate of the at least one power device by at least 10%. 9. The power module apparatus of claim 1, wherein the clamping circuit is configured to reduce a voltage charge up at a gate of the at least one power device to within 6 V of a desired voltage. 10. A power module apparatus, comprising:
a power substrate positioned relative to a base plate; at least one power device electrically connected to at least two power contacts; a gate-source board mounted relative to the power substrate, the gate-source board electrically connected to the at least one power device; a clamping circuit electrically connected to the at least one power device, the clamping circuit configured to clamp an input to a gate of the at least one power device, wherein the clamping circuit is configured to clamp a voltage at the gate of the at least one power device to less than 10 V peak to peak. 11. The power module apparatus of claim 10, wherein the clamping circuit comprises a Miller clamp. 12. The power module apparatus of claim 10, wherein the clamping circuit is integrated in the power module apparatus and the clamping circuit is arranged with at least one of the following: the base plate, the power substrate, one of the at least two power contacts, the at least one power device, the gate-source board, gate drive connectors, and a housing. 13. The power module apparatus of claim 11,
wherein the clamping circuit comprises a transistor discretely holding the at least one power device off; wherein the transistor is connected to the gate of the at least one power device; and wherein the transistor is connected to at least one of the following: a source/emitter of the at least one power device and a negative voltage bias (−V). 14. The power module apparatus of claim 13, wherein the clamping circuit is configured to clamp a voltage at the gate of the at least one power device to less than 8 V peak to peak. 15. The power module apparatus of claim 10, further comprising a sense and control circuit electrically connected to the clamping circuit, the sense and control circuit configured to control the clamping circuit as a function of a driver control signal. 16. A power module apparatus, comprising:
a power substrate positioned relative to a base plate; at least one power device electrically connected to at least two power contacts; a gate-source board mounted relative to the power substrate, the gate-source board electrically connected to the at least one power device; and a clamping circuit electrically connected to the at least one power device, the clamping circuit configured to clamp an input to a gate of the at least one power device, wherein the clamping circuit is configured to reduce a voltage charge up at the gate of the at least one power device by at least 10%. 17. The power module apparatus of claim 16, wherein the clamping circuit comprises a Miller clamp. 18. The power module apparatus of claim 16, wherein the clamping circuit is integrated in the power module apparatus and the clamping circuit is arranged with at least one of the following: the base plate, the power substrate, one of the at least two power contacts, the at least one power device, the gate-source board, gate drive connectors, and a housing. 19. The power module apparatus of claim 17,
wherein the clamping circuit comprises a transistor discretely holding the at least one power device off; wherein the transistor is connected to the gate of the at least one power device; and wherein the transistor is connected to at least one of the following: a source/emitter of the at least one power device and a negative voltage bias (−V). 20. The power module apparatus of claim 16, wherein the clamping circuit is configured to reduce the voltage charge up at the gate of the at least one power device by at least 30%. | 2,800 |
11,577 | 11,577 | 13,928,538 | 2,856 | A method of non-destructively evaluating a thickness of a coating layer on a turbine engine component includes directing an acoustic wave into the turbine engine component, the acoustic wave including a frequency and a wavelength, receiving a return time-domain signal reflected from the turbine engine component, and transforming the time-domain signal into a frequency-domain signal. The method further includes subtracting a baseline signal from the frequency-domain signal and determining a local minimum frequency of the baseline-subtracted frequency-domain signal. Still further, the method includes calculating the thickness of the coating layer based on the determined local minimum frequency. Additional evaluation methods including ones based on resistivity, terahertz, and microwave are further disclosed. | 1. A method of non-destructively evaluating a thickness of a coating layer on a turbine engine component, the method comprising:
directing an acoustic wave into the turbine engine component, the acoustic wave comprising a frequency and a wavelength; receiving a return time-domain signal reflected from the turbine engine component; transforming the time-domain signal into a frequency-domain signal; subtracting a baseline signal from the frequency-domain signal; determining a local minimum frequency of the baseline-subtracted frequency-domain signal; and calculating the thickness of the coating layer based on the determined local minimum frequency. 2. The method of claim 1, wherein directing the acoustic wave comprises directing an ultrasonic acoustic wave. 3. The method of claim 2, wherein directing the ultrasonic wave is performed using an ultrasonic transducer. 4. The method of claim 2, wherein receiving the return time-domain signal is performed using an ultrasonic transducer. 5. The method of claim 1, wherein calculating the thickness of the coating layer comprises calculating the thickness of a coating layer having a thickness of 50 microns or less. 6. The method of claim 1, wherein calculating the thickness of the coating layer comprises calculating the thickness of a coating layer disposed over a bond coat, which in turn is disposed on the turbine engine component. 7. The method of claim 1, wherein the baseline signal is determined from an uncoated turbine engine component. 8. A method of non-destructively evaluating a thickness of a coating layer on a turbine engine component, the method comprising:
placing first and second probes on an outer surface of the coating layer, wherein the first and second probes are separated by a first distance, and wherein the first and second probes are configured to generate an electrical current in the coating layer; placing third a fourth probes on the outer surface of the coating layer in a location that is between the first and second probes, wherein the third and fourth probes are separated by a second distance that is less than the first distance, and wherein the third and fourth probes are configured to measure an electrical resistivity in the coating layer; generating an electrical current in the coating layer using the first and second probes; measuring the electrical resistivity of the coating layer using the third and fourth probes; and calculating the thickness of the coating layer based on the measured electrical resistivity. 9. The method of claim 8, wherein the first, second, third, and fourth probes are placed on the coating layer in a substantially linear fashion. 10. The method of claim 8, wherein the first, second, third, and fourth probes are configured to make ohmic contact with the coating layer. 11. The method of claim 8, wherein generating the electrical current comprises generating an electrical current that is about 1 μA or less for desired ohmic contact as an example. 12. The method of claim 11, measuring the electrical resistivity comprises ensuring that desired generated voltage is about 100 mV or less. 13. The method of claim 11, wherein the thickness of the coating layer is less than half of either the first or second distances. 14. The method of claim 8, wherein calculating the thickness of the coating layer comprises calculating the thickness of a coating layer disposed over a bond coat, which in turn is disposed on the turbine engine component. | A method of non-destructively evaluating a thickness of a coating layer on a turbine engine component includes directing an acoustic wave into the turbine engine component, the acoustic wave including a frequency and a wavelength, receiving a return time-domain signal reflected from the turbine engine component, and transforming the time-domain signal into a frequency-domain signal. The method further includes subtracting a baseline signal from the frequency-domain signal and determining a local minimum frequency of the baseline-subtracted frequency-domain signal. Still further, the method includes calculating the thickness of the coating layer based on the determined local minimum frequency. Additional evaluation methods including ones based on resistivity, terahertz, and microwave are further disclosed.1. A method of non-destructively evaluating a thickness of a coating layer on a turbine engine component, the method comprising:
directing an acoustic wave into the turbine engine component, the acoustic wave comprising a frequency and a wavelength; receiving a return time-domain signal reflected from the turbine engine component; transforming the time-domain signal into a frequency-domain signal; subtracting a baseline signal from the frequency-domain signal; determining a local minimum frequency of the baseline-subtracted frequency-domain signal; and calculating the thickness of the coating layer based on the determined local minimum frequency. 2. The method of claim 1, wherein directing the acoustic wave comprises directing an ultrasonic acoustic wave. 3. The method of claim 2, wherein directing the ultrasonic wave is performed using an ultrasonic transducer. 4. The method of claim 2, wherein receiving the return time-domain signal is performed using an ultrasonic transducer. 5. The method of claim 1, wherein calculating the thickness of the coating layer comprises calculating the thickness of a coating layer having a thickness of 50 microns or less. 6. The method of claim 1, wherein calculating the thickness of the coating layer comprises calculating the thickness of a coating layer disposed over a bond coat, which in turn is disposed on the turbine engine component. 7. The method of claim 1, wherein the baseline signal is determined from an uncoated turbine engine component. 8. A method of non-destructively evaluating a thickness of a coating layer on a turbine engine component, the method comprising:
placing first and second probes on an outer surface of the coating layer, wherein the first and second probes are separated by a first distance, and wherein the first and second probes are configured to generate an electrical current in the coating layer; placing third a fourth probes on the outer surface of the coating layer in a location that is between the first and second probes, wherein the third and fourth probes are separated by a second distance that is less than the first distance, and wherein the third and fourth probes are configured to measure an electrical resistivity in the coating layer; generating an electrical current in the coating layer using the first and second probes; measuring the electrical resistivity of the coating layer using the third and fourth probes; and calculating the thickness of the coating layer based on the measured electrical resistivity. 9. The method of claim 8, wherein the first, second, third, and fourth probes are placed on the coating layer in a substantially linear fashion. 10. The method of claim 8, wherein the first, second, third, and fourth probes are configured to make ohmic contact with the coating layer. 11. The method of claim 8, wherein generating the electrical current comprises generating an electrical current that is about 1 μA or less for desired ohmic contact as an example. 12. The method of claim 11, measuring the electrical resistivity comprises ensuring that desired generated voltage is about 100 mV or less. 13. The method of claim 11, wherein the thickness of the coating layer is less than half of either the first or second distances. 14. The method of claim 8, wherein calculating the thickness of the coating layer comprises calculating the thickness of a coating layer disposed over a bond coat, which in turn is disposed on the turbine engine component. | 2,800 |
11,578 | 11,578 | 14,299,186 | 2,838 | A multi-phase transformer type DC-DC converter. In one embodiment, the multi-phase transformer type DC-DC converter includes a plurality of DC-DC converters comprising a plurality of transformers, respectively, wherein the plurality of DC-DC converters are coupled in parallel between an input and an output. A circuit is coupled to the plurality of DC-DC converters and configured to generate a plurality of clock signals for use by the plurality of DC-DC converters, respectively, wherein the plurality of clock signals are phase shifted with respect to each other. | 1. An isolated DC-DC converter comprising:
N full-bridge drivers, where N is greater than 1, for driving primary sides of N voltage and current transformers, respectively; N full rectifiers coupled to secondary sides of the N voltage and current transformers, respectively, for driving an output to an output voltage; wherein the N full-bridge drivers are controlled by respective sets of pulse width modulation (PWM) signals, wherein the sets of PWM signals are phase shifted with respect to each other, wherein the phase the sets of PWM signals depends on N, and wherein the sets of multiple PWM signals enable interleaving operation of the N full-bridge drivers; wherein no direct current (DC) connection connects the primary and secondary sides of the voltage and current transformers. 2. The isolated DC-DC converter of claim 1 further comprising N circuits for generating first voltages, wherein the first voltages are proportional to current flow into the primary sides of respective voltage and current transformers. 3. The isolated DC-DC converter of claim 2 wherein widths of first PWM signals in respective sets of PWM signals, depend on the first voltages, respectively. 4. The isolated DC-DC converter of claim 3 further comprising:
N PWM generators for generating the N sets of PWM signals, respectively;
a circuit for generating an error voltage as a function of the output voltage and a target output voltage;
wherein the N PWM generators comprise N comparators, respectively, for comparing the error voltage with respective first voltages. 5. The isolated DC-DC converter of claim 3 wherein the N circuits comprise N current sense transformers, respectively, for generating the first voltages, respectively. 6. A non-isolated DC-DC converter comprising:
N full-bridge drivers, where N is greater than 1, for driving primary sides of N voltage and current transformers, respectively; N full rectifiers coupled to secondary sides of the N voltage and current transformers, respectively, for driving an output to an output voltage; wherein the N full-bridge drivers are controlled by respective sets of pulse width modulation (PWM) signals, wherein the sets of PWM signals are phase shifted with respect to each other, wherein the phase the sets of PWM signals depends on N, and wherein the sets of multiple PWM signals enable interleaving operation of the N full-bridge drivers; wherein a direct current (DC) connection exists the primary and secondary sides of the voltage and current transformers. 7. The non-isolated DC-DC converter of claim 6 further comprising N circuits for generating first voltages, wherein the first voltages are proportional to current flow into the primary sides of respective voltage and current transformers. 8. The non-isolated DC-DC converter of claim 7 wherein widths of first PWM signals in respective sets of PWM signals, depend on the first voltages, respectively. 9. The non-isolated DC-DC converter of claim 8 further comprising:
N PWM generators for generating the N sets of PWM signals, respectively;
a circuit for generating an error voltage as a function of the output voltage and a target output voltage;
wherein the N PWM generators comprise N comparators, respectively, for comparing the error voltage with respective first voltages. 10. The non-isolated DC-DC converter of claim 7 wherein the N circuits comprise current mirror(s) for generating currents that are proportional to the currents flowing into the primary sides of respective voltage and current transformers. 11. An apparatus comprising:
a plurality of DC-DC converters comprising a plurality of transformers, respectively, wherein the plurality of DC-DC converters are coupled in parallel between an input and an output; a circuit coupled to the plurality of DC-DC converters and configured to generate a plurality of clock signals for use by the plurality of DC-DC converters, respectively, wherein the plurality of clock signals are phase shifted with respect to each other. 12. The apparatus of claim 11 wherein the circuit is configured to generate a control signal for controlling the plurality of DC-DC converters, wherein the control signal is generated as a function of a voltage at the output. 13. The apparatus of claim 12 wherein the plurality of DC-DC converters comprise a plurality of PWM signal generators, respectively, for generating first PWM signals, respectively, for controlling the plurality of transformers, respectively. 14. The apparatus of claim 13 wherein the plurality of DC-DC converters comprise a plurality of first switches, respectively, for selectively coupling the input to a plurality of first terminals, respectively of the transformers, respectively, in accordance with the first PWM signals, respectively. 15. The apparatus of claim 14 wherein the plurality of first PWM signals are phase shifted with respect to each other. 16. The apparatus of claim 15 wherein the phase shift between the plurality of first PWM signals equals the phase shift between the plurality of clock signals. 17. The apparatus of claim 16 wherein a width of each of the first PWM signals depends on the control signal. 18. The apparatus of claim 17 wherein the DC-DC converters comprise a plurality of circuits, respectively, for generating first voltages, respectively, which are proportional to current flow to the plurality of transformers, respectively, wherein the width of the plurality of first PWM signals depends the first voltages, respectively. 19. The apparatus of claim 11 wherein each of the transformers comprises a primary winding and a secondary winding, wherein the primary winding is directly or indirectly coupled to a first ground terminal, but not a second ground terminal, and wherein the secondary winding is directly or indirectly coupled to the second ground terminal, but not the first ground terminal, wherein the first and second ground terminals are electrically isolated from each other. 20. The apparatus of claim 11 wherein each of the transformers comprises a primary winding and a secondary winding, wherein the primary winding is directly or indirectly coupled to a common ground terminal. | A multi-phase transformer type DC-DC converter. In one embodiment, the multi-phase transformer type DC-DC converter includes a plurality of DC-DC converters comprising a plurality of transformers, respectively, wherein the plurality of DC-DC converters are coupled in parallel between an input and an output. A circuit is coupled to the plurality of DC-DC converters and configured to generate a plurality of clock signals for use by the plurality of DC-DC converters, respectively, wherein the plurality of clock signals are phase shifted with respect to each other.1. An isolated DC-DC converter comprising:
N full-bridge drivers, where N is greater than 1, for driving primary sides of N voltage and current transformers, respectively; N full rectifiers coupled to secondary sides of the N voltage and current transformers, respectively, for driving an output to an output voltage; wherein the N full-bridge drivers are controlled by respective sets of pulse width modulation (PWM) signals, wherein the sets of PWM signals are phase shifted with respect to each other, wherein the phase the sets of PWM signals depends on N, and wherein the sets of multiple PWM signals enable interleaving operation of the N full-bridge drivers; wherein no direct current (DC) connection connects the primary and secondary sides of the voltage and current transformers. 2. The isolated DC-DC converter of claim 1 further comprising N circuits for generating first voltages, wherein the first voltages are proportional to current flow into the primary sides of respective voltage and current transformers. 3. The isolated DC-DC converter of claim 2 wherein widths of first PWM signals in respective sets of PWM signals, depend on the first voltages, respectively. 4. The isolated DC-DC converter of claim 3 further comprising:
N PWM generators for generating the N sets of PWM signals, respectively;
a circuit for generating an error voltage as a function of the output voltage and a target output voltage;
wherein the N PWM generators comprise N comparators, respectively, for comparing the error voltage with respective first voltages. 5. The isolated DC-DC converter of claim 3 wherein the N circuits comprise N current sense transformers, respectively, for generating the first voltages, respectively. 6. A non-isolated DC-DC converter comprising:
N full-bridge drivers, where N is greater than 1, for driving primary sides of N voltage and current transformers, respectively; N full rectifiers coupled to secondary sides of the N voltage and current transformers, respectively, for driving an output to an output voltage; wherein the N full-bridge drivers are controlled by respective sets of pulse width modulation (PWM) signals, wherein the sets of PWM signals are phase shifted with respect to each other, wherein the phase the sets of PWM signals depends on N, and wherein the sets of multiple PWM signals enable interleaving operation of the N full-bridge drivers; wherein a direct current (DC) connection exists the primary and secondary sides of the voltage and current transformers. 7. The non-isolated DC-DC converter of claim 6 further comprising N circuits for generating first voltages, wherein the first voltages are proportional to current flow into the primary sides of respective voltage and current transformers. 8. The non-isolated DC-DC converter of claim 7 wherein widths of first PWM signals in respective sets of PWM signals, depend on the first voltages, respectively. 9. The non-isolated DC-DC converter of claim 8 further comprising:
N PWM generators for generating the N sets of PWM signals, respectively;
a circuit for generating an error voltage as a function of the output voltage and a target output voltage;
wherein the N PWM generators comprise N comparators, respectively, for comparing the error voltage with respective first voltages. 10. The non-isolated DC-DC converter of claim 7 wherein the N circuits comprise current mirror(s) for generating currents that are proportional to the currents flowing into the primary sides of respective voltage and current transformers. 11. An apparatus comprising:
a plurality of DC-DC converters comprising a plurality of transformers, respectively, wherein the plurality of DC-DC converters are coupled in parallel between an input and an output; a circuit coupled to the plurality of DC-DC converters and configured to generate a plurality of clock signals for use by the plurality of DC-DC converters, respectively, wherein the plurality of clock signals are phase shifted with respect to each other. 12. The apparatus of claim 11 wherein the circuit is configured to generate a control signal for controlling the plurality of DC-DC converters, wherein the control signal is generated as a function of a voltage at the output. 13. The apparatus of claim 12 wherein the plurality of DC-DC converters comprise a plurality of PWM signal generators, respectively, for generating first PWM signals, respectively, for controlling the plurality of transformers, respectively. 14. The apparatus of claim 13 wherein the plurality of DC-DC converters comprise a plurality of first switches, respectively, for selectively coupling the input to a plurality of first terminals, respectively of the transformers, respectively, in accordance with the first PWM signals, respectively. 15. The apparatus of claim 14 wherein the plurality of first PWM signals are phase shifted with respect to each other. 16. The apparatus of claim 15 wherein the phase shift between the plurality of first PWM signals equals the phase shift between the plurality of clock signals. 17. The apparatus of claim 16 wherein a width of each of the first PWM signals depends on the control signal. 18. The apparatus of claim 17 wherein the DC-DC converters comprise a plurality of circuits, respectively, for generating first voltages, respectively, which are proportional to current flow to the plurality of transformers, respectively, wherein the width of the plurality of first PWM signals depends the first voltages, respectively. 19. The apparatus of claim 11 wherein each of the transformers comprises a primary winding and a secondary winding, wherein the primary winding is directly or indirectly coupled to a first ground terminal, but not a second ground terminal, and wherein the secondary winding is directly or indirectly coupled to the second ground terminal, but not the first ground terminal, wherein the first and second ground terminals are electrically isolated from each other. 20. The apparatus of claim 11 wherein each of the transformers comprises a primary winding and a secondary winding, wherein the primary winding is directly or indirectly coupled to a common ground terminal. | 2,800 |
11,579 | 11,579 | 14,832,724 | 2,865 | Computing systems and methods for geosciences collaboration are disclosed. In one embodiment, a method for geosciences collaboration includes obtaining a first set of geosciences information from a first computer system of the plurality of computer systems; distributing the first set of geosciences information from the first computer system to at least a second computer system; receiving a user input from the second computer system of the plurality of computer systems, the user input entered manually by a user; providing the user input to the first computer system; in response to providing the user input to the first computer system, receiving a revised set of geosciences information from the first computer system; and repeating the receiving a user input, the providing the user input, and the receiving the revised set of geosciences information until the revised set of geosciences information is determined to satisfy accuracy criteria. | 1. A non-transitory computer readable storage medium storing one or more programs for execution by one or more processors of a geosciences collaboration system, the one or more programs including instructions for:
communicating, over a data network, with a plurality of computer systems that includes a first computer system and a second computer system, wherein the first computer system is located remotely from the second computer system; obtaining a first set of geosciences information from the first computer system; distributing the first set of geosciences information from the first computer system to at least the second computer system; receiving a manually entered user input from the second computer system; providing the manually entered user input to the first computer system; in response to providing the manually entered user input to the first computer system, receiving a revised set of geosciences information from the first computer system, wherein the revised set of geosciences information is distinct from the first set of geosciences information; and repeating the receiving a manually entered user input, the providing the manually entered user input, and the receiving the revised set of geosciences information until the revised set of geosciences information is determined to satisfy accuracy criteria. 2. The computer readable storage medium of claim 1, including:
distributing the first set of geosciences information from the first computer system to the plurality of computer systems including the second computer system. 3. The computer readable storage medium of claim 1, wherein the plurality of computer systems is located remotely from the geosciences collaboration system. 4. The computer readable storage medium of claim 1, wherein the first computer system is located remotely from the geosciences collaboration system. 5. The computer readable storage medium of claim 1, wherein the first set of geosciences information includes information for one or more of: seismic survey design, seismic modeling, and seismic analysis, seismic interpretation, stratigraphic interpretation, velocity and property modeling, seismic processing, quality control, reservoir modeling and simulation, well planning, drilling operations, drilling monitoring, production operations, and production monitoring. 6. The computer readable storage medium of claim 1, wherein the manually entered user input includes a movement gesture to reorient portions of a geoscience collaboration workspace, including moving a seismic cube from a perspective view to a lateral view. 7. The computer readable storage medium of claim 6, wherein the movement gesture corresponds to a movement of a user's fingers and the movement of the user's fingers is encoded in three-dimensional coordinates. 8. The computer readable storage medium of claim 1, wherein the manually entered user input initiates zooming a seismic volume on the first computer system while the first computer system is in a first mode and the user input initiates selecting items within the seismic volume while the first computer system is in a second mode distinct from the first mode. 9. A non-transitory computer readable storage medium storing one or more programs for execution by one or more processors of a geosciences collaboration system, the one or more programs including instructions for:
communicating, through over a data network, with a plurality of computer systems; invoking a first geosciences application on a first computer system of the plurality of computer systems and obtaining a first set of geosciences information from the first computer system and invoking a second geosciences application on a second computer system of the plurality of computer systems and obtaining a second set of geosciences information from the second computer system, at least one of the first computer system and the second computer system located remotely from the geosciences collaboration system; and distributing the first set of geosciences information obtained from the first computer system to the plurality of computer systems and the second set of geosciences information obtained from the second computer system to the plurality of computer systems, and receiving feedback on the second set of geosciences information from the first computer system and receiving feedback on the first set of geosciences information from the second computer system. 10. The computer readable storage medium of claim 9, wherein the first geosciences application is the same as the second geosciences application. 11. The computer readable storage medium of claim 9, wherein the first computer system is located remotely from the geosciences collaboration system. 12. The computer readable storage medium of claim 9, including receiving feedback on the second set of geosciences information from the first geosciences application on the first computer system and receiving feedback on the first set of geosciences information from the second geosciences application on the second computer system. 13. The computer readable storage medium of claim 9, wherein the second computer system is located in an oilfield support center. 14. The computer readable storage medium of claim 13, wherein the first computer system is located on one of: a drilling rig and a seismic vessel. 15. The computer readable storage medium of claim 9, wherein the first computer system and the second computer system are configured to share collaboration context directly between the first computer system and the second computer system without sharing the collaboration context with the geosciences collaboration system. 16. The computer readable storage medium of claim 15, wherein the collaboration context includes application information. 17. The computer readable storage medium of claim 9, including distributing the first set of geosciences information obtained from the first computer system to the plurality of computer systems including the first computer system and the second set of geosciences information obtained from the second computer system to the plurality of computer systems including the second computer system. 18. A non-transitory computer readable storage medium storing one or more programs for execution by one or more processors of a first computer system, the one or more programs including instructions for:
obtaining a first set of geosciences information; sending the first set of geosciences information to a geosciences collaboration system; receiving from the geosciences collaboration system a manually entered user input entered into a second computer system located remotely from the first computer system; after receiving from the geosciences collaboration system the user input:
obtaining a revised set of geosciences information that is distinct from the first set of geosciences information; and
sending the revised set of geosciences information to the geosciences collaboration system; and
repeating the receiving a manually entered user input, the obtaining the revised set of geosciences information, and the sending the revised set of geosciences information until the revised set of geosciences information is determined to satisfy accuracy criteria. 19. The computer readable storage medium of claim 18, wherein the first computer system is located remotely from the geosciences collaboration system. 20. The computer readable storage medium of claim 18, wherein the first set of geosciences information includes information for one or more of: seismic survey design, seismic modeling, and seismic analysis, seismic interpretation, stratigraphic interpretation, velocity and property modeling, seismic processing, quality control, reservoir modeling and simulation, well planning, drilling operations, drilling monitoring, production operations, and production monitoring. 21. The computer readable storage medium of claim 18, wherein the manually entered user input includes a movement gesture to reorient portions of a geoscience collaboration workspace, including moving a seismic cube from a perspective view to a lateral view. 22. The computer readable storage medium of claim 21, wherein the movement gesture corresponds to a movement of a user's fingers and the movement of the user's fingers is encoded in three-dimensional coordinates. 23. The computer readable storage medium of claim 18, wherein the manually entered user input initiates zooming a seismic volume on the first computer system while the first computer system is in a first mode and the user input initiates selecting items within the seismic volume while the first computer system is in a second mode distinct from the first mode. 24. A non-transitory computer readable storage medium storing one or more programs for execution by one or more processors of a first computer system, the one or more programs including instructions for:
receiving an invocation of a first geosciences application from a geosciences collaboration system; obtaining a first set of geosciences information; sending the first set of geosciences information to the geosciences collaboration system; receiving from the geosciences collaboration system a second set of geosciences information, wherein the second set of geosciences information is obtained by the geosciences collaboration system from a second geosciences application on a second computer system, located remotely from the first computer system, the second geosciences application on the second computer system having been invoked by the geosciences collaboration system; receiving from the geosciences collaboration system feedback on the first set of geosciences information; and sending from the first computer system to the geosciences collaboration system feedback on the second set of geosciences information. 25. The computer readable storage medium of claim 24, wherein the first geosciences application is the same as the second geosciences application. 26. The computer readable storage medium of claim 24, wherein the first computer system is located remotely from the geosciences collaboration system and the second computer system is located remotely from the geosciences collaboration system. 27. The computer readable storage medium of claim 24, wherein the feedback on the second set of geosciences information is sent by the first geosciences application on the first computer system and the feedback on the first set of geosciences information is sent by the second geosciences application on the second computer system. 28. The computer readable storage medium of claim 24, wherein the second computer system is located in an oilfield support center. 29. The computer readable storage medium of claim 28, wherein the first computer system is located on one of: a drilling rig and a seismic vessel. 30. The computer readable storage medium of claim 24, wherein the first computer system and the second computer system are configured to share collaboration context directly between the first computer system and the second computer system without sharing the collaboration context with the geosciences collaboration system. 31. The computer readable storage medium of claim 30, wherein the collaboration context includes application information. 32. The computer readable storage medium of claim 24, wherein the geosciences collaboration system is configured for distributing the first set of geosciences information obtained from the first computer system to the plurality of computer systems including the first computer system and the second set of geosciences information obtained from the second computer system to the plurality of computer systems including the second computer system. | Computing systems and methods for geosciences collaboration are disclosed. In one embodiment, a method for geosciences collaboration includes obtaining a first set of geosciences information from a first computer system of the plurality of computer systems; distributing the first set of geosciences information from the first computer system to at least a second computer system; receiving a user input from the second computer system of the plurality of computer systems, the user input entered manually by a user; providing the user input to the first computer system; in response to providing the user input to the first computer system, receiving a revised set of geosciences information from the first computer system; and repeating the receiving a user input, the providing the user input, and the receiving the revised set of geosciences information until the revised set of geosciences information is determined to satisfy accuracy criteria.1. A non-transitory computer readable storage medium storing one or more programs for execution by one or more processors of a geosciences collaboration system, the one or more programs including instructions for:
communicating, over a data network, with a plurality of computer systems that includes a first computer system and a second computer system, wherein the first computer system is located remotely from the second computer system; obtaining a first set of geosciences information from the first computer system; distributing the first set of geosciences information from the first computer system to at least the second computer system; receiving a manually entered user input from the second computer system; providing the manually entered user input to the first computer system; in response to providing the manually entered user input to the first computer system, receiving a revised set of geosciences information from the first computer system, wherein the revised set of geosciences information is distinct from the first set of geosciences information; and repeating the receiving a manually entered user input, the providing the manually entered user input, and the receiving the revised set of geosciences information until the revised set of geosciences information is determined to satisfy accuracy criteria. 2. The computer readable storage medium of claim 1, including:
distributing the first set of geosciences information from the first computer system to the plurality of computer systems including the second computer system. 3. The computer readable storage medium of claim 1, wherein the plurality of computer systems is located remotely from the geosciences collaboration system. 4. The computer readable storage medium of claim 1, wherein the first computer system is located remotely from the geosciences collaboration system. 5. The computer readable storage medium of claim 1, wherein the first set of geosciences information includes information for one or more of: seismic survey design, seismic modeling, and seismic analysis, seismic interpretation, stratigraphic interpretation, velocity and property modeling, seismic processing, quality control, reservoir modeling and simulation, well planning, drilling operations, drilling monitoring, production operations, and production monitoring. 6. The computer readable storage medium of claim 1, wherein the manually entered user input includes a movement gesture to reorient portions of a geoscience collaboration workspace, including moving a seismic cube from a perspective view to a lateral view. 7. The computer readable storage medium of claim 6, wherein the movement gesture corresponds to a movement of a user's fingers and the movement of the user's fingers is encoded in three-dimensional coordinates. 8. The computer readable storage medium of claim 1, wherein the manually entered user input initiates zooming a seismic volume on the first computer system while the first computer system is in a first mode and the user input initiates selecting items within the seismic volume while the first computer system is in a second mode distinct from the first mode. 9. A non-transitory computer readable storage medium storing one or more programs for execution by one or more processors of a geosciences collaboration system, the one or more programs including instructions for:
communicating, through over a data network, with a plurality of computer systems; invoking a first geosciences application on a first computer system of the plurality of computer systems and obtaining a first set of geosciences information from the first computer system and invoking a second geosciences application on a second computer system of the plurality of computer systems and obtaining a second set of geosciences information from the second computer system, at least one of the first computer system and the second computer system located remotely from the geosciences collaboration system; and distributing the first set of geosciences information obtained from the first computer system to the plurality of computer systems and the second set of geosciences information obtained from the second computer system to the plurality of computer systems, and receiving feedback on the second set of geosciences information from the first computer system and receiving feedback on the first set of geosciences information from the second computer system. 10. The computer readable storage medium of claim 9, wherein the first geosciences application is the same as the second geosciences application. 11. The computer readable storage medium of claim 9, wherein the first computer system is located remotely from the geosciences collaboration system. 12. The computer readable storage medium of claim 9, including receiving feedback on the second set of geosciences information from the first geosciences application on the first computer system and receiving feedback on the first set of geosciences information from the second geosciences application on the second computer system. 13. The computer readable storage medium of claim 9, wherein the second computer system is located in an oilfield support center. 14. The computer readable storage medium of claim 13, wherein the first computer system is located on one of: a drilling rig and a seismic vessel. 15. The computer readable storage medium of claim 9, wherein the first computer system and the second computer system are configured to share collaboration context directly between the first computer system and the second computer system without sharing the collaboration context with the geosciences collaboration system. 16. The computer readable storage medium of claim 15, wherein the collaboration context includes application information. 17. The computer readable storage medium of claim 9, including distributing the first set of geosciences information obtained from the first computer system to the plurality of computer systems including the first computer system and the second set of geosciences information obtained from the second computer system to the plurality of computer systems including the second computer system. 18. A non-transitory computer readable storage medium storing one or more programs for execution by one or more processors of a first computer system, the one or more programs including instructions for:
obtaining a first set of geosciences information; sending the first set of geosciences information to a geosciences collaboration system; receiving from the geosciences collaboration system a manually entered user input entered into a second computer system located remotely from the first computer system; after receiving from the geosciences collaboration system the user input:
obtaining a revised set of geosciences information that is distinct from the first set of geosciences information; and
sending the revised set of geosciences information to the geosciences collaboration system; and
repeating the receiving a manually entered user input, the obtaining the revised set of geosciences information, and the sending the revised set of geosciences information until the revised set of geosciences information is determined to satisfy accuracy criteria. 19. The computer readable storage medium of claim 18, wherein the first computer system is located remotely from the geosciences collaboration system. 20. The computer readable storage medium of claim 18, wherein the first set of geosciences information includes information for one or more of: seismic survey design, seismic modeling, and seismic analysis, seismic interpretation, stratigraphic interpretation, velocity and property modeling, seismic processing, quality control, reservoir modeling and simulation, well planning, drilling operations, drilling monitoring, production operations, and production monitoring. 21. The computer readable storage medium of claim 18, wherein the manually entered user input includes a movement gesture to reorient portions of a geoscience collaboration workspace, including moving a seismic cube from a perspective view to a lateral view. 22. The computer readable storage medium of claim 21, wherein the movement gesture corresponds to a movement of a user's fingers and the movement of the user's fingers is encoded in three-dimensional coordinates. 23. The computer readable storage medium of claim 18, wherein the manually entered user input initiates zooming a seismic volume on the first computer system while the first computer system is in a first mode and the user input initiates selecting items within the seismic volume while the first computer system is in a second mode distinct from the first mode. 24. A non-transitory computer readable storage medium storing one or more programs for execution by one or more processors of a first computer system, the one or more programs including instructions for:
receiving an invocation of a first geosciences application from a geosciences collaboration system; obtaining a first set of geosciences information; sending the first set of geosciences information to the geosciences collaboration system; receiving from the geosciences collaboration system a second set of geosciences information, wherein the second set of geosciences information is obtained by the geosciences collaboration system from a second geosciences application on a second computer system, located remotely from the first computer system, the second geosciences application on the second computer system having been invoked by the geosciences collaboration system; receiving from the geosciences collaboration system feedback on the first set of geosciences information; and sending from the first computer system to the geosciences collaboration system feedback on the second set of geosciences information. 25. The computer readable storage medium of claim 24, wherein the first geosciences application is the same as the second geosciences application. 26. The computer readable storage medium of claim 24, wherein the first computer system is located remotely from the geosciences collaboration system and the second computer system is located remotely from the geosciences collaboration system. 27. The computer readable storage medium of claim 24, wherein the feedback on the second set of geosciences information is sent by the first geosciences application on the first computer system and the feedback on the first set of geosciences information is sent by the second geosciences application on the second computer system. 28. The computer readable storage medium of claim 24, wherein the second computer system is located in an oilfield support center. 29. The computer readable storage medium of claim 28, wherein the first computer system is located on one of: a drilling rig and a seismic vessel. 30. The computer readable storage medium of claim 24, wherein the first computer system and the second computer system are configured to share collaboration context directly between the first computer system and the second computer system without sharing the collaboration context with the geosciences collaboration system. 31. The computer readable storage medium of claim 30, wherein the collaboration context includes application information. 32. The computer readable storage medium of claim 24, wherein the geosciences collaboration system is configured for distributing the first set of geosciences information obtained from the first computer system to the plurality of computer systems including the first computer system and the second set of geosciences information obtained from the second computer system to the plurality of computer systems including the second computer system. | 2,800 |
11,580 | 11,580 | 14,954,963 | 2,846 | Systems and methods are disclosed for detecting position measurement errors for an electric motor. An exemplary system may include a position sensor configured to measure a position of a rotor of the electric motor. The system may also include an error detector configured to detect an offset between the position measured by the position sensor and an actual position of the rotor. The error detector may include a signal injector configured to inject a probing signal to a stator of the electric motor. The error detector may also include a signal sampler configured to sample a response signal from the stator of the electric motor. The error detector may be configured to derive the offset based on the response signal. | 1. A system for controlling an electric motor, the system comprising:
a position sensor configured to measure a position of a rotor of the electric motor; an error detector configured to detect an offset between the position measured by the position sensor and an actual position of the rotor, the error detector including:
a signal injector configured to inject a probing signal to a stator of the electric motor, wherein the probing signal includes a high frequency current signal; and
a signal sampler configured to sample a response signal from the stator of the electric motor;
wherein the error detector is configured to derive the offset based on the response signal; and a current regulator, wherein:
the signal injector is configured to inject the probing signal by inputting a current command in a reference frame to the current regulator; and
the signal sampler is configured to sample the response signal by receiving a voltage command in the reference frame from the current regulator. 2. The system of claim 1, wherein the error detector is configured to:
demodulate the response signal; filter the demodulated response signal; and apply a gain factor to the filtered and demodulated response signal to derive the offset. 3. (canceled) 4. The system of claim 1, wherein the high frequency current signal has a frequency in a range between 300 Hz and 800 Hz. 5. (canceled) 6. The system of claim 1, wherein the error detector is configured to detect the offset when the rotor of the electric motor is in a stall position. 7. The system of claim 1, wherein the error detector is configured to detect the offset when a speed of the rotor of the electric motor is below a predetermined threshold. 8. The system of claim 1, wherein the error detector is configured to supply the detected offset to the position sensor to correct the position measured by the position sensor. 9. A method for detecting position measurement errors for an electric motor, the method comprising:
measuring, by a position sensor, a position of a rotor of the electric motor; injecting a probing signal to a stator of the electric motor by inputting a current command in a reference frame to a current regulator, wherein the probing signal includes a high frequency current signal; sampling a response signal from the stator of the electric motor by receiving a voltage command in the reference frame from the current regulator; and deriving, based on the response signal, an offset between the position measured by the position sensor and an actual position of the rotor. 10. The method of claim 9, further comprising:
demodulating the response signal; filtering the demodulated response signal; and applying a gain factor to the filtered and demodulated response signal to derive the offset. 11. (canceled) 12. The method of claim 9, wherein the high frequency current signal has a frequency in a range between 300 Hz and 800 Hz. 13. (canceled) 14. The method of claim 9, wherein injecting the probing signal includes:
injecting the probing signal when the rotor of the electric motor is in a stall position. 15. The method of claim 9, wherein injecting the probing signal includes:
injecting the probing signal when a speed of the rotor of the electric motor is below a predetermined threshold. 16. The method of claim 9, further comprising:
supplying the offset to the position sensor to correct the position measured by the position sensor. 17. A motor system, comprising:
an electric motor including a rotor and a stator; and a motor control system configured to control the electric motor, the motor control system including:
a position sensor configured to measure a position of the rotor;
an error detector configured to detect an offset between the position measured by the position sensor and an actual position of the rotor, the error detector including:
a signal injector configured to inject a probing signal to the stator, wherein the probing signal includes a high frequency current signal; and
a signal sampler configured to sample a response signal from the stator;
wherein the error detector is configured to derive the offset based on the response signal; and
a current regulator, wherein:
the signal injector is configured to inject the probing signal by inputting a current command in a reference frame to the current regulator; and
the signal sampler is configured to sample the response signal by receiving a voltage command in the reference frame from the current regulator. 18. The motor system of claim 17, wherein the electric motor includes a synchronous electric motor. 19. The motor system of claim 18, wherein the electric motor includes an interior permanent magnet (IPM) motor. 20. A chassis for a vehicle, the chassis comprising:
a propulsion system for providing motive torques to at least one wheel of the vehicle, the propulsion system comprising:
an energy storage device configured to store electric energy;
an electric motor including a rotor and a stator; and
a motor control system configured to control energy transfer between the energy storage device and the electric motor, the motor control system including:
a position sensor configured to measure a position of the rotor;
an error detector configured to detect an offset between the position measured by the position sensor and an actual position of the rotor, the error detector including:
a signal injector configured to inject a probing signal to the stator, wherein the probing signal includes a high frequency current signal; and
a signal sampler configured to sample a response signal from the stator;
wherein the error detector is configured to derive the offset based on the response signal; and
a current regulator, wherein:
the signal injector is configured to inject the probing signal by inputting a current command in a reference frame to the current regulator; and
the signal sampler is configured to sample the response signal by receiving a voltage command in the reference frame from the current regulator. | Systems and methods are disclosed for detecting position measurement errors for an electric motor. An exemplary system may include a position sensor configured to measure a position of a rotor of the electric motor. The system may also include an error detector configured to detect an offset between the position measured by the position sensor and an actual position of the rotor. The error detector may include a signal injector configured to inject a probing signal to a stator of the electric motor. The error detector may also include a signal sampler configured to sample a response signal from the stator of the electric motor. The error detector may be configured to derive the offset based on the response signal.1. A system for controlling an electric motor, the system comprising:
a position sensor configured to measure a position of a rotor of the electric motor; an error detector configured to detect an offset between the position measured by the position sensor and an actual position of the rotor, the error detector including:
a signal injector configured to inject a probing signal to a stator of the electric motor, wherein the probing signal includes a high frequency current signal; and
a signal sampler configured to sample a response signal from the stator of the electric motor;
wherein the error detector is configured to derive the offset based on the response signal; and a current regulator, wherein:
the signal injector is configured to inject the probing signal by inputting a current command in a reference frame to the current regulator; and
the signal sampler is configured to sample the response signal by receiving a voltage command in the reference frame from the current regulator. 2. The system of claim 1, wherein the error detector is configured to:
demodulate the response signal; filter the demodulated response signal; and apply a gain factor to the filtered and demodulated response signal to derive the offset. 3. (canceled) 4. The system of claim 1, wherein the high frequency current signal has a frequency in a range between 300 Hz and 800 Hz. 5. (canceled) 6. The system of claim 1, wherein the error detector is configured to detect the offset when the rotor of the electric motor is in a stall position. 7. The system of claim 1, wherein the error detector is configured to detect the offset when a speed of the rotor of the electric motor is below a predetermined threshold. 8. The system of claim 1, wherein the error detector is configured to supply the detected offset to the position sensor to correct the position measured by the position sensor. 9. A method for detecting position measurement errors for an electric motor, the method comprising:
measuring, by a position sensor, a position of a rotor of the electric motor; injecting a probing signal to a stator of the electric motor by inputting a current command in a reference frame to a current regulator, wherein the probing signal includes a high frequency current signal; sampling a response signal from the stator of the electric motor by receiving a voltage command in the reference frame from the current regulator; and deriving, based on the response signal, an offset between the position measured by the position sensor and an actual position of the rotor. 10. The method of claim 9, further comprising:
demodulating the response signal; filtering the demodulated response signal; and applying a gain factor to the filtered and demodulated response signal to derive the offset. 11. (canceled) 12. The method of claim 9, wherein the high frequency current signal has a frequency in a range between 300 Hz and 800 Hz. 13. (canceled) 14. The method of claim 9, wherein injecting the probing signal includes:
injecting the probing signal when the rotor of the electric motor is in a stall position. 15. The method of claim 9, wherein injecting the probing signal includes:
injecting the probing signal when a speed of the rotor of the electric motor is below a predetermined threshold. 16. The method of claim 9, further comprising:
supplying the offset to the position sensor to correct the position measured by the position sensor. 17. A motor system, comprising:
an electric motor including a rotor and a stator; and a motor control system configured to control the electric motor, the motor control system including:
a position sensor configured to measure a position of the rotor;
an error detector configured to detect an offset between the position measured by the position sensor and an actual position of the rotor, the error detector including:
a signal injector configured to inject a probing signal to the stator, wherein the probing signal includes a high frequency current signal; and
a signal sampler configured to sample a response signal from the stator;
wherein the error detector is configured to derive the offset based on the response signal; and
a current regulator, wherein:
the signal injector is configured to inject the probing signal by inputting a current command in a reference frame to the current regulator; and
the signal sampler is configured to sample the response signal by receiving a voltage command in the reference frame from the current regulator. 18. The motor system of claim 17, wherein the electric motor includes a synchronous electric motor. 19. The motor system of claim 18, wherein the electric motor includes an interior permanent magnet (IPM) motor. 20. A chassis for a vehicle, the chassis comprising:
a propulsion system for providing motive torques to at least one wheel of the vehicle, the propulsion system comprising:
an energy storage device configured to store electric energy;
an electric motor including a rotor and a stator; and
a motor control system configured to control energy transfer between the energy storage device and the electric motor, the motor control system including:
a position sensor configured to measure a position of the rotor;
an error detector configured to detect an offset between the position measured by the position sensor and an actual position of the rotor, the error detector including:
a signal injector configured to inject a probing signal to the stator, wherein the probing signal includes a high frequency current signal; and
a signal sampler configured to sample a response signal from the stator;
wherein the error detector is configured to derive the offset based on the response signal; and
a current regulator, wherein:
the signal injector is configured to inject the probing signal by inputting a current command in a reference frame to the current regulator; and
the signal sampler is configured to sample the response signal by receiving a voltage command in the reference frame from the current regulator. | 2,800 |
11,581 | 11,581 | 14,912,816 | 2,832 | The present power generator includes: a rotor including a plurality of permanent magnets arranged in a rotation direction; a stator including a plurality of coils provided to face the plurality of permanent magnets, each of the plurality of coils being configured to generate AC voltage during rotation of the rotor; and a plurality of magnetic bodies respectively provided in the plurality of coils, in a direction of center axis of each of the coils, a length (Lm) of each of the magnetic bodies being set to be shorter than a length (Lc) of each of the coils. Accordingly, a larger amount of power than that in a coreless structure is generated. | 1. A power generator comprising:
a rotor including a plurality of permanent magnets arranged in a rotation direction; a stator including a plurality of coils provided to face the plurality of permanent magnets, each of the plurality of coils being configured to generate AC voltage during rotation of the rotor; and a plurality of magnetic bodies respectively provided in the plurality of coils, in a direction of center axis of each of the coils, a length of each of the magnetic bodies being shorter than a length of each of the coils. 2. The power generator according to claim 1, wherein
the plurality of permanent magnets include first and second permanent magnets arranged in the rotation direction of the rotor, and an S pole of the first permanent magnet is directed toward the stator and an N pole of the second permanent magnet is directed toward the stator. 3. The power generator according to claim 1, wherein
the plurality of permanent magnets include first to fourth permanent magnets arranged in the rotation direction of the rotor, and an S pole of the first permanent magnet is directed toward the stator, an S pole of the second permanent magnet is directed toward the first permanent magnet, an N pole of the third permanent magnet is directed toward the stator, and an N pole of the fourth permanent magnet is directed toward the third permanent magnet. 4. The power generator according to claim 1, wherein
the rotor further includes a first back yoke, and each of the plurality of permanent magnets has one end provided to face the plurality of coils, and each of the plurality of permanent magnets has the other end fixed to the first back yoke. 5. The power generator according to claim 1, wherein
the stator further includes a second back yoke, and each of the plurality of magnetic bodies has one end provided to face the plurality of permanent magnets, and each of the plurality of magnetic bodies has the other end fixed to the second back yoke. 6. The power generator according to claim 1, wherein each of the plurality of coils is a winding of an electric wire having a quadrangular cross sectional shape. 7. The power generator according to claim 1, wherein the power generator is a radial gap type. 8. The power generator according to claim 1, wherein the power generator is an axial gap type. 9. The power generator according to claim 1, wherein the power generator is used for wind power generation or water power generation. | The present power generator includes: a rotor including a plurality of permanent magnets arranged in a rotation direction; a stator including a plurality of coils provided to face the plurality of permanent magnets, each of the plurality of coils being configured to generate AC voltage during rotation of the rotor; and a plurality of magnetic bodies respectively provided in the plurality of coils, in a direction of center axis of each of the coils, a length (Lm) of each of the magnetic bodies being set to be shorter than a length (Lc) of each of the coils. Accordingly, a larger amount of power than that in a coreless structure is generated.1. A power generator comprising:
a rotor including a plurality of permanent magnets arranged in a rotation direction; a stator including a plurality of coils provided to face the plurality of permanent magnets, each of the plurality of coils being configured to generate AC voltage during rotation of the rotor; and a plurality of magnetic bodies respectively provided in the plurality of coils, in a direction of center axis of each of the coils, a length of each of the magnetic bodies being shorter than a length of each of the coils. 2. The power generator according to claim 1, wherein
the plurality of permanent magnets include first and second permanent magnets arranged in the rotation direction of the rotor, and an S pole of the first permanent magnet is directed toward the stator and an N pole of the second permanent magnet is directed toward the stator. 3. The power generator according to claim 1, wherein
the plurality of permanent magnets include first to fourth permanent magnets arranged in the rotation direction of the rotor, and an S pole of the first permanent magnet is directed toward the stator, an S pole of the second permanent magnet is directed toward the first permanent magnet, an N pole of the third permanent magnet is directed toward the stator, and an N pole of the fourth permanent magnet is directed toward the third permanent magnet. 4. The power generator according to claim 1, wherein
the rotor further includes a first back yoke, and each of the plurality of permanent magnets has one end provided to face the plurality of coils, and each of the plurality of permanent magnets has the other end fixed to the first back yoke. 5. The power generator according to claim 1, wherein
the stator further includes a second back yoke, and each of the plurality of magnetic bodies has one end provided to face the plurality of permanent magnets, and each of the plurality of magnetic bodies has the other end fixed to the second back yoke. 6. The power generator according to claim 1, wherein each of the plurality of coils is a winding of an electric wire having a quadrangular cross sectional shape. 7. The power generator according to claim 1, wherein the power generator is a radial gap type. 8. The power generator according to claim 1, wherein the power generator is an axial gap type. 9. The power generator according to claim 1, wherein the power generator is used for wind power generation or water power generation. | 2,800 |
11,582 | 11,582 | 14,099,873 | 2,853 | Disclosed herein is a material ejector (e.g., print head) geometry having alignment of material inlet channels in-line with microchannels, symmetrically disposed in a propellant flow, to obtain smooth, well-controlled, trajectories in a ballistic aerosol ejection implementation. Propellant (e.g., pressurized air) is supplied from above and below (or side-by-side) a microchannel array plane. Obviating sharp (e.g., 90 degree) corners permits propellant to flow smoothly from macroscopic source into the microchannels. | 1. An apparatus for selectively depositing a material onto a substrate, comprising:
a material ejector body defining a nozzle and an exit channel therein; a material inlet channel disposed within said nozzle and substantially uniformly spaced apart from at least first and second opposite surfaces of said nozzle to thereby define substantially symmetrical first and second flow regions between said material inlet channel and said at least two opposite surfaces of said nozzle; a material reservoir communicatively coupled to said material inlet channel for delivery of said material; a propellant source communicatively coupled to said nozzle; said material inlet channel disposed relative to said propellant source and within said nozzle such that propellant provided by said propellant source may flow substantially uniformly past said material inlet channel within said first and second flow regions; whereby material may be provided by said reservoir to said material inlet channel, carried from said material inlet channel by propellant flowing substantially uniformly past said material inlet channel within said first and second flow regions, and carried by said propellant to exit said material ejector body through said exit channel toward said substrate. 2. The apparatus of claim 1, further comprising a microchannel disposed within said exit channel. 3. The apparatus of claim 2, wherein said microchannel comprises wall structures defining a nozzle profile therein. 4. The apparatus of claim 3, wherein said wall structure comprises a longitudinal body having a proximal end and a distal end, and wherein said proximal end comprises an end treatment selected from the group consisting of: a radius planform, a wedge planform, and an angled planform. 5. The apparatus of claim 1, wherein said propellant has a flow direction through said body, and wherein said exit channel is spaced apart from said material channel in said flow direction by a distance between 10 and 100 μm. 6. The apparatus of claim 1, wherein said material is selected from the group consisting of: marking materials visible to an unaided eye; marking materials not visible to an unaided eye; surface finish material; chemical materials; biological materials; medicinal mateirals; therapeutic materials; manufacturing materials; medicine; and immunization material. 7. The apparatus of claim 1, wherein said material inlet channel is provided with at least one electrostatic transport subsystem. 8. The apparatus of claim 7, wherein said material inlet channel is provided with a plurality of independently controllable electrostatic transport subsystems. 9. The apparatus of claim 8, further comprising a plurality of material reservoirs, each said material reservoir communicatively coupled to an independently controllable electrostatic transport subsystem. 10. The apparatus of claim 7, further comprising a controller for controlling said at least one electrostatic transport subsystem as a function of propellant flow velocity between said material inlet channel and said exit channel. 11. The apparatus of claim 10, further comprising a flow sensor communicatively coupled to said controller and disposed with a region between said material inlet channel and said exit channel, said controller controlling said at least one electrostatic transport subsystem responsive to data provided by said flow sensor. 12. The apparatus of claim 1, wherein said substrate comprises a portion of a body, and further wherein said reservoir is sized and configured to contain a single dosage of a material to be administered by said apparatus to said body. 13. The apparatus of claim 1, wherein said material inlet channel is provided with at least one gating electrode disposed proximate said material reservoir. 14. The apparatus of claim 1, wherein said exit channel defines an exit flow plane, and further wherein said material inlet channel lies in said exit flow plane. 15. An apparatus for selectively depositing a particulate material onto a substrate, comprising:
a material ejector body defining a nozzle and a microchannel region therein; a microchannel disposed within said microchannel region, said microchannel comprising wall structures defining a nozzle profile; a particulate inlet channel disposed within said nozzle and substantially uniformly spaced apart from at least first and second opposite surfaces of said nozzle to thereby define substantially symmetrical first and second flow regions between said particulate inlet channel and said at least two opposite surfaces of said nozzle; at least one electrostatic particulate transport subsystem disposed with said particulate inlet channel; a particulate reservoir communicatively coupled to said particulate inlet channel for delivery of particulate material; a propellant source communicatively coupled to said nozzle; said particulate inlet channel disposed relative to said propellant source and within said nozzle such that propellant provided by said propellant source may flow substantially uniformly past said particulate inlet channel within said first and second flow regions; whereby particulate material may be provided by said particulate reservoir to said particulate inlet channel, said particulate material metered by said electrostatic particulate transport subsystem and transported from said electrostatic particulate transport subsystem by propellant flowing substantially uniformly past said particulate inlet channel within said first and second flow regions, and carried by said propellant to exit said material ejector body through said microchannel region toward said substrate. 16. The apparatus of claim 15, wherein said wall structure comprises a longitudinal body having a proximal end and a distal end, and wherein said proximal end comprises an end treatment selected from the group consisting of: a radius planform, a wedge planform, and an angled planform. 17. The apparatus of claim 15, wherein said particulate inlet channel is provided with a plurality of independently controllable electrostatic particulate transport subsystems. 18. The apparatus of claim 17, further comprising a plurality of particulate reservoirs, each said particulate reservoir communicatively coupled to an independently controllable electrostatic particulate transport subsystem. 19. The apparatus of claim 17, further comprising a controller for controlling said at least one electrostatic particulate transport subsystem as a function of propellant flow velocity between said particulate inlet channel and said microchannel region. 20. The apparatus of claim 19, further comprising a flow sensor communicatively coupled to said controlled and disposed with a region between said particulate inlet channel and said microchannel region, said controller controlling said at least one electrostatic particulate transport subsystem responsive to data provided by said flow sensor. 21. The apparatus of claim 15, wherein said microchannel region defines an exit flow plane, and further wherein said particulate inlet channel lies in said exit flow plane. | Disclosed herein is a material ejector (e.g., print head) geometry having alignment of material inlet channels in-line with microchannels, symmetrically disposed in a propellant flow, to obtain smooth, well-controlled, trajectories in a ballistic aerosol ejection implementation. Propellant (e.g., pressurized air) is supplied from above and below (or side-by-side) a microchannel array plane. Obviating sharp (e.g., 90 degree) corners permits propellant to flow smoothly from macroscopic source into the microchannels.1. An apparatus for selectively depositing a material onto a substrate, comprising:
a material ejector body defining a nozzle and an exit channel therein; a material inlet channel disposed within said nozzle and substantially uniformly spaced apart from at least first and second opposite surfaces of said nozzle to thereby define substantially symmetrical first and second flow regions between said material inlet channel and said at least two opposite surfaces of said nozzle; a material reservoir communicatively coupled to said material inlet channel for delivery of said material; a propellant source communicatively coupled to said nozzle; said material inlet channel disposed relative to said propellant source and within said nozzle such that propellant provided by said propellant source may flow substantially uniformly past said material inlet channel within said first and second flow regions; whereby material may be provided by said reservoir to said material inlet channel, carried from said material inlet channel by propellant flowing substantially uniformly past said material inlet channel within said first and second flow regions, and carried by said propellant to exit said material ejector body through said exit channel toward said substrate. 2. The apparatus of claim 1, further comprising a microchannel disposed within said exit channel. 3. The apparatus of claim 2, wherein said microchannel comprises wall structures defining a nozzle profile therein. 4. The apparatus of claim 3, wherein said wall structure comprises a longitudinal body having a proximal end and a distal end, and wherein said proximal end comprises an end treatment selected from the group consisting of: a radius planform, a wedge planform, and an angled planform. 5. The apparatus of claim 1, wherein said propellant has a flow direction through said body, and wherein said exit channel is spaced apart from said material channel in said flow direction by a distance between 10 and 100 μm. 6. The apparatus of claim 1, wherein said material is selected from the group consisting of: marking materials visible to an unaided eye; marking materials not visible to an unaided eye; surface finish material; chemical materials; biological materials; medicinal mateirals; therapeutic materials; manufacturing materials; medicine; and immunization material. 7. The apparatus of claim 1, wherein said material inlet channel is provided with at least one electrostatic transport subsystem. 8. The apparatus of claim 7, wherein said material inlet channel is provided with a plurality of independently controllable electrostatic transport subsystems. 9. The apparatus of claim 8, further comprising a plurality of material reservoirs, each said material reservoir communicatively coupled to an independently controllable electrostatic transport subsystem. 10. The apparatus of claim 7, further comprising a controller for controlling said at least one electrostatic transport subsystem as a function of propellant flow velocity between said material inlet channel and said exit channel. 11. The apparatus of claim 10, further comprising a flow sensor communicatively coupled to said controller and disposed with a region between said material inlet channel and said exit channel, said controller controlling said at least one electrostatic transport subsystem responsive to data provided by said flow sensor. 12. The apparatus of claim 1, wherein said substrate comprises a portion of a body, and further wherein said reservoir is sized and configured to contain a single dosage of a material to be administered by said apparatus to said body. 13. The apparatus of claim 1, wherein said material inlet channel is provided with at least one gating electrode disposed proximate said material reservoir. 14. The apparatus of claim 1, wherein said exit channel defines an exit flow plane, and further wherein said material inlet channel lies in said exit flow plane. 15. An apparatus for selectively depositing a particulate material onto a substrate, comprising:
a material ejector body defining a nozzle and a microchannel region therein; a microchannel disposed within said microchannel region, said microchannel comprising wall structures defining a nozzle profile; a particulate inlet channel disposed within said nozzle and substantially uniformly spaced apart from at least first and second opposite surfaces of said nozzle to thereby define substantially symmetrical first and second flow regions between said particulate inlet channel and said at least two opposite surfaces of said nozzle; at least one electrostatic particulate transport subsystem disposed with said particulate inlet channel; a particulate reservoir communicatively coupled to said particulate inlet channel for delivery of particulate material; a propellant source communicatively coupled to said nozzle; said particulate inlet channel disposed relative to said propellant source and within said nozzle such that propellant provided by said propellant source may flow substantially uniformly past said particulate inlet channel within said first and second flow regions; whereby particulate material may be provided by said particulate reservoir to said particulate inlet channel, said particulate material metered by said electrostatic particulate transport subsystem and transported from said electrostatic particulate transport subsystem by propellant flowing substantially uniformly past said particulate inlet channel within said first and second flow regions, and carried by said propellant to exit said material ejector body through said microchannel region toward said substrate. 16. The apparatus of claim 15, wherein said wall structure comprises a longitudinal body having a proximal end and a distal end, and wherein said proximal end comprises an end treatment selected from the group consisting of: a radius planform, a wedge planform, and an angled planform. 17. The apparatus of claim 15, wherein said particulate inlet channel is provided with a plurality of independently controllable electrostatic particulate transport subsystems. 18. The apparatus of claim 17, further comprising a plurality of particulate reservoirs, each said particulate reservoir communicatively coupled to an independently controllable electrostatic particulate transport subsystem. 19. The apparatus of claim 17, further comprising a controller for controlling said at least one electrostatic particulate transport subsystem as a function of propellant flow velocity between said particulate inlet channel and said microchannel region. 20. The apparatus of claim 19, further comprising a flow sensor communicatively coupled to said controlled and disposed with a region between said particulate inlet channel and said microchannel region, said controller controlling said at least one electrostatic particulate transport subsystem responsive to data provided by said flow sensor. 21. The apparatus of claim 15, wherein said microchannel region defines an exit flow plane, and further wherein said particulate inlet channel lies in said exit flow plane. | 2,800 |
11,583 | 11,583 | 15,954,904 | 2,842 | A drive circuit drives a switch that has first and second terminals and a control terminal. The drive circuit includes a discharge path, a capacitor, an AC suppressor and a DC voltage generator. The discharge path connects the control terminal and the second terminal. The capacitor has a high-potential terminal connected to the second terminal side and a low-potential terminal connected to the control terminal side. The AC suppressor has a first end connected to a part of the discharge path between the high-potential terminal the second terminal. The DC voltage generator has a connection terminal connected to a second end of the AC suppressor. The DC voltage generator regulates electric current flowing between the connection terminal and the AC suppressor so as to keep the potential of the part of the discharge path between the high-potential terminal and the second terminal higher than the potential of the low-potential terminal. | 1. A drive circuit that drives a switch,
the switch having a first terminal, a second terminal and a control terminal, the switch being configured to be turned to an ON state when a potential difference of the control terminal with respect to the second terminal becomes higher than or equal to an ON threshold voltage and turned to an OFF state when the potential difference becomes lower than an OFF threshold voltage, the switch allowing electric current to flow from the first terminal to the second terminal in the ON state and blocking electric current from flowing from the first terminal to the second terminal in the OFF state, the drive circuit comprising: a discharge path provided to connect the control terminal and the second terminal of the switch and discharge electric charge from the control terminal; a capacitor provided in the discharge path and having a high-potential terminal connected to the second terminal side and a low-potential terminal connected to the control terminal side; an AC suppressor configured to suppress an AC component of electric current, the AC suppressor having a first end and a second end, the first end being connected to a part of the discharge path between the high-potential terminal of the capacitor and the second terminal of the switch; and a DC voltage generator that generates a reference DC voltage, the DC voltage generator having a connection terminal connected to the second end of the AC suppressor, the DC voltage generator being configured to regulate electric current flowing between the connection terminal and the AC suppressor so as to keep a potential of the part of the discharge path between the high-potential terminal of the capacitor and the second terminal of the switch higher than a potential of the low-potential terminal of the capacitor. 2. The drive circuit as set forth in claim 1, wherein the AC suppressor is constituted of a resistor. 3. The drive circuit as set forth in claim 2, wherein a resistance of the resistor and a capacitance of the capacitor are set to satisfy the following relationship: Rs×Cs>Tsw, where Rs is the resistance of the resistor, Cs is the capacitance of the capacitor and Tsw is a switching period of the switch. 4. The drive circuit as set forth in claim 1, wherein the AC suppressor is constituted of an inductor. 5. The drive circuit as set forth in claim 4, wherein an inductance of the inductor and a capacitance of the capacitor are set to satisfy the following relationship: √(Ls×Cs)>Tsw, where Ls is the inductance of the inductor, Cs is the capacitance of the capacitor and Tsw is a switching period of the switch. 6. The drive circuit as set forth in claim 1, wherein the DC voltage generator comprises an operational amplifier that has:
an inverting input terminal connected to one of the first and second ends of the AC suppressor; a non-inverting input terminal to which the reference DC voltage is applied; and an output terminal that constitutes the connection terminal of the DC voltage generator. 7. The drive circuit as set forth in claim 1, further comprising a diagnoser configured to diagnose at least one of a first abnormality and a second abnormality based on a potential on the first end side of the AC suppressor, the first abnormality being an abnormality in which leakage current flowing between the control terminal and the second terminal of the switch increases, the second abnormality being an abnormality in which leakage current flowing between the high-potential terminal side and the low-potential terminal side of the capacitor increases. | A drive circuit drives a switch that has first and second terminals and a control terminal. The drive circuit includes a discharge path, a capacitor, an AC suppressor and a DC voltage generator. The discharge path connects the control terminal and the second terminal. The capacitor has a high-potential terminal connected to the second terminal side and a low-potential terminal connected to the control terminal side. The AC suppressor has a first end connected to a part of the discharge path between the high-potential terminal the second terminal. The DC voltage generator has a connection terminal connected to a second end of the AC suppressor. The DC voltage generator regulates electric current flowing between the connection terminal and the AC suppressor so as to keep the potential of the part of the discharge path between the high-potential terminal and the second terminal higher than the potential of the low-potential terminal.1. A drive circuit that drives a switch,
the switch having a first terminal, a second terminal and a control terminal, the switch being configured to be turned to an ON state when a potential difference of the control terminal with respect to the second terminal becomes higher than or equal to an ON threshold voltage and turned to an OFF state when the potential difference becomes lower than an OFF threshold voltage, the switch allowing electric current to flow from the first terminal to the second terminal in the ON state and blocking electric current from flowing from the first terminal to the second terminal in the OFF state, the drive circuit comprising: a discharge path provided to connect the control terminal and the second terminal of the switch and discharge electric charge from the control terminal; a capacitor provided in the discharge path and having a high-potential terminal connected to the second terminal side and a low-potential terminal connected to the control terminal side; an AC suppressor configured to suppress an AC component of electric current, the AC suppressor having a first end and a second end, the first end being connected to a part of the discharge path between the high-potential terminal of the capacitor and the second terminal of the switch; and a DC voltage generator that generates a reference DC voltage, the DC voltage generator having a connection terminal connected to the second end of the AC suppressor, the DC voltage generator being configured to regulate electric current flowing between the connection terminal and the AC suppressor so as to keep a potential of the part of the discharge path between the high-potential terminal of the capacitor and the second terminal of the switch higher than a potential of the low-potential terminal of the capacitor. 2. The drive circuit as set forth in claim 1, wherein the AC suppressor is constituted of a resistor. 3. The drive circuit as set forth in claim 2, wherein a resistance of the resistor and a capacitance of the capacitor are set to satisfy the following relationship: Rs×Cs>Tsw, where Rs is the resistance of the resistor, Cs is the capacitance of the capacitor and Tsw is a switching period of the switch. 4. The drive circuit as set forth in claim 1, wherein the AC suppressor is constituted of an inductor. 5. The drive circuit as set forth in claim 4, wherein an inductance of the inductor and a capacitance of the capacitor are set to satisfy the following relationship: √(Ls×Cs)>Tsw, where Ls is the inductance of the inductor, Cs is the capacitance of the capacitor and Tsw is a switching period of the switch. 6. The drive circuit as set forth in claim 1, wherein the DC voltage generator comprises an operational amplifier that has:
an inverting input terminal connected to one of the first and second ends of the AC suppressor; a non-inverting input terminal to which the reference DC voltage is applied; and an output terminal that constitutes the connection terminal of the DC voltage generator. 7. The drive circuit as set forth in claim 1, further comprising a diagnoser configured to diagnose at least one of a first abnormality and a second abnormality based on a potential on the first end side of the AC suppressor, the first abnormality being an abnormality in which leakage current flowing between the control terminal and the second terminal of the switch increases, the second abnormality being an abnormality in which leakage current flowing between the high-potential terminal side and the low-potential terminal side of the capacitor increases. | 2,800 |
11,584 | 11,584 | 14,406,480 | 2,834 | The hand machine tool according to the invention has an integrated tool or a tool holder 2 to receive a tool 4 . An electric motor 5 serves to drive the tool 4 or the tool holder 2 . A battery pack 18 for supplying power to the electric motor 5 can be pushed into a guide 23 in a first direction. A plurality of electrical contacts 31 for contacting counter contacts 32 of the battery pack 18 are disposed in a contact holder 36 . Wires 40 , which are connected in each case to one of the electrical contacts 31 , have cores which extend in a wave-like manner in the first direction 28 adjacent to the electrical contact 32. | 1-7. (canceled) 8. A hand machine tool comprising:
an integrated tool or a tool holder for accommodating a tool; an electric motor for driving the integrated tool or the tool holder; a guide insertable into a battery pack along a first direction for supplying the electric motor with power; and a contact holder, multiple electrical contacts being situated in the contact holder for contacting counter contacts of the battery pack; at least one strand connected to one of the electrical contacts and having wires having a wave-shaped progression along the first direction adjoining the electrical contact. 9. The hand machine tool as recited in claim 8 wherein the wires of the strand are braided. 10. The hand machine tool as recited in claim 8 wherein an entirety of the strand has a wave-shaped progression adjoining the electrical contact. 11. The hand machine tool as recited in claim 8 wherein the contact holder includes a terminal strip, and one end of the strand is attached in the terminal strip and another end of the strand is attached to one of the contacts. 12. The hand machine tool as recited in claim 11 wherein a length of the strand is greater than a distance of the terminal strip from the one contact. 13. The hand machine tool as recited in claim 11 wherein the strand has no insulating tubing between the terminal strip and the contact. 14. The hand machine tool as recited in claim 8 wherein the electrical contacts are movably mounted in the contact holder. | The hand machine tool according to the invention has an integrated tool or a tool holder 2 to receive a tool 4 . An electric motor 5 serves to drive the tool 4 or the tool holder 2 . A battery pack 18 for supplying power to the electric motor 5 can be pushed into a guide 23 in a first direction. A plurality of electrical contacts 31 for contacting counter contacts 32 of the battery pack 18 are disposed in a contact holder 36 . Wires 40 , which are connected in each case to one of the electrical contacts 31 , have cores which extend in a wave-like manner in the first direction 28 adjacent to the electrical contact 32.1-7. (canceled) 8. A hand machine tool comprising:
an integrated tool or a tool holder for accommodating a tool; an electric motor for driving the integrated tool or the tool holder; a guide insertable into a battery pack along a first direction for supplying the electric motor with power; and a contact holder, multiple electrical contacts being situated in the contact holder for contacting counter contacts of the battery pack; at least one strand connected to one of the electrical contacts and having wires having a wave-shaped progression along the first direction adjoining the electrical contact. 9. The hand machine tool as recited in claim 8 wherein the wires of the strand are braided. 10. The hand machine tool as recited in claim 8 wherein an entirety of the strand has a wave-shaped progression adjoining the electrical contact. 11. The hand machine tool as recited in claim 8 wherein the contact holder includes a terminal strip, and one end of the strand is attached in the terminal strip and another end of the strand is attached to one of the contacts. 12. The hand machine tool as recited in claim 11 wherein a length of the strand is greater than a distance of the terminal strip from the one contact. 13. The hand machine tool as recited in claim 11 wherein the strand has no insulating tubing between the terminal strip and the contact. 14. The hand machine tool as recited in claim 8 wherein the electrical contacts are movably mounted in the contact holder. | 2,800 |
11,585 | 11,585 | 14,109,407 | 2,853 | A method for estimating a fluid flow velocity may include receiving, with a processing device, a plurality of observations corresponding to a concentration of a constituent of a flowing fluid mixture, and computing a final estimate of an average velocity of the flowing fluid mixture based at least in part on the observations, wherein the constituent is undergoing a chemical reaction and the computing implements a reactive transport model. | 1. A system for estimating a fluid flow velocity, comprising:
an assimilative flow estimator configured to receive a plurality of observations corresponding to a concentration of a constituent of a flowing fluid mixture and compute a final estimate of an average velocity of the flowing fluid mixture based at least in part on the observations, wherein the constituent is undergoing a chemical reaction and the computing implements a reactive transport model. 2. The system of claim 1, further comprising a concentration sensor configured to sense a measured concentration of the reacting constituent at a location along a travel path of the flowing fluid mixture and send the measured concentration to the assimilative flow estimator, wherein the measured concentration is one of the observations. 3. The system of claim 1, further comprising: a preliminary flow generator configured to generate an initial estimate of the average velocity of the flowing fluid mixture, wherein the final estimate further is based at least in part on the initial estimate. 4. The system of claim 3, further comprising an uncertainty generator configured to receive an estimate of the accuracy of the observations, wherein the final estimate further is based at least in part on the estimate. 5. The system of claim 1, wherein the reactive transport model comprises the following partial differential equation:
∂
C
(
x
,
t
)
∂
t
=
-
u
(
t
)
∂
C
(
x
,
t
)
∂
x
+
K
(
u
(
t
)
)
C
(
x
,
t
)
,
where u is the velocity of the flowing fluid mixture, C(x,t) is the concentration of the reacting constituent at a location, x, and time, t, and the concentration decays according to the first order constant, K. 6. The system of claim 1, wherein the reactive transport model comprises an iterative algorithm including the following partial differential equation:
∂t C+u(t)∂x C−K(u)C=e(x,t),C(0,x)=C 0 +e b(x)
where C0 is a given initial concentration, e is the model error and eb models an error in the initial condition, and the concentration decays according to a function of the velocity, K(u). 7. The system of claim 1, wherein the constituent is chlorine and the flowing fluid mixture includes water. 8. A computer program product for estimating a fluid flow velocity, the computer program product comprising:
a computer readable storage medium having program code embodied therewith, the program code executable by a computer to implement: receiving a plurality of observations corresponding to a concentration of a constituent of a flowing fluid mixture; and computing a final estimate of an average velocity of the flowing fluid mixture based at least in part on the observations, wherein the constituent is undergoing a chemical reaction and the computing implements a reactive transport model. 9. The computer program product of claim 8, the program code further executable by a computer to implement:
generating an initial estimate of the average velocity of the flowing fluid mixture, wherein the final estimate further is based at least in part on the initial estimate. 10. The computer program product of claim 9, the program code further executable by a computer to implement:
receiving an estimate of the accuracy of the observations, wherein the final estimate further is based at least in part on the estimate. 11. The computer program product of claim 8, wherein the reactive transport model comprises the following partial differential equation:
∂
C
(
x
,
t
)
∂
t
=
-
u
(
t
)
∂
C
(
x
,
t
)
∂
x
+
K
(
u
(
t
)
)
C
(
x
,
t
)
,
where u is the velocity of the flowing fluid mixture, C(x, t) is the concentration of the reacting constituent at a location, x, and time, t, and the concentration decays according to the first order constant, K. 12. The computer program product of claim 8, wherein the reactive transport model comprises an iterative algorithm including the following partial differential equations:
∂t C+u(t)∂x C−K(u)C=e(x,t),C(0,x)=C 0 +e b(x)
where C0 is a given initial concentration, e is the model error and eb models an error in the initial condition, and the concentration decays according to a function of the velocity, K(u). 13. The computer program product of claim 8, wherein the constituent is chlorine and the flowing fluid mixture includes water. | A method for estimating a fluid flow velocity may include receiving, with a processing device, a plurality of observations corresponding to a concentration of a constituent of a flowing fluid mixture, and computing a final estimate of an average velocity of the flowing fluid mixture based at least in part on the observations, wherein the constituent is undergoing a chemical reaction and the computing implements a reactive transport model.1. A system for estimating a fluid flow velocity, comprising:
an assimilative flow estimator configured to receive a plurality of observations corresponding to a concentration of a constituent of a flowing fluid mixture and compute a final estimate of an average velocity of the flowing fluid mixture based at least in part on the observations, wherein the constituent is undergoing a chemical reaction and the computing implements a reactive transport model. 2. The system of claim 1, further comprising a concentration sensor configured to sense a measured concentration of the reacting constituent at a location along a travel path of the flowing fluid mixture and send the measured concentration to the assimilative flow estimator, wherein the measured concentration is one of the observations. 3. The system of claim 1, further comprising: a preliminary flow generator configured to generate an initial estimate of the average velocity of the flowing fluid mixture, wherein the final estimate further is based at least in part on the initial estimate. 4. The system of claim 3, further comprising an uncertainty generator configured to receive an estimate of the accuracy of the observations, wherein the final estimate further is based at least in part on the estimate. 5. The system of claim 1, wherein the reactive transport model comprises the following partial differential equation:
∂
C
(
x
,
t
)
∂
t
=
-
u
(
t
)
∂
C
(
x
,
t
)
∂
x
+
K
(
u
(
t
)
)
C
(
x
,
t
)
,
where u is the velocity of the flowing fluid mixture, C(x,t) is the concentration of the reacting constituent at a location, x, and time, t, and the concentration decays according to the first order constant, K. 6. The system of claim 1, wherein the reactive transport model comprises an iterative algorithm including the following partial differential equation:
∂t C+u(t)∂x C−K(u)C=e(x,t),C(0,x)=C 0 +e b(x)
where C0 is a given initial concentration, e is the model error and eb models an error in the initial condition, and the concentration decays according to a function of the velocity, K(u). 7. The system of claim 1, wherein the constituent is chlorine and the flowing fluid mixture includes water. 8. A computer program product for estimating a fluid flow velocity, the computer program product comprising:
a computer readable storage medium having program code embodied therewith, the program code executable by a computer to implement: receiving a plurality of observations corresponding to a concentration of a constituent of a flowing fluid mixture; and computing a final estimate of an average velocity of the flowing fluid mixture based at least in part on the observations, wherein the constituent is undergoing a chemical reaction and the computing implements a reactive transport model. 9. The computer program product of claim 8, the program code further executable by a computer to implement:
generating an initial estimate of the average velocity of the flowing fluid mixture, wherein the final estimate further is based at least in part on the initial estimate. 10. The computer program product of claim 9, the program code further executable by a computer to implement:
receiving an estimate of the accuracy of the observations, wherein the final estimate further is based at least in part on the estimate. 11. The computer program product of claim 8, wherein the reactive transport model comprises the following partial differential equation:
∂
C
(
x
,
t
)
∂
t
=
-
u
(
t
)
∂
C
(
x
,
t
)
∂
x
+
K
(
u
(
t
)
)
C
(
x
,
t
)
,
where u is the velocity of the flowing fluid mixture, C(x, t) is the concentration of the reacting constituent at a location, x, and time, t, and the concentration decays according to the first order constant, K. 12. The computer program product of claim 8, wherein the reactive transport model comprises an iterative algorithm including the following partial differential equations:
∂t C+u(t)∂x C−K(u)C=e(x,t),C(0,x)=C 0 +e b(x)
where C0 is a given initial concentration, e is the model error and eb models an error in the initial condition, and the concentration decays according to a function of the velocity, K(u). 13. The computer program product of claim 8, wherein the constituent is chlorine and the flowing fluid mixture includes water. | 2,800 |
11,586 | 11,586 | 15,344,145 | 2,837 | Detecting vibrato bar technique for a string instrument can include analyzing, using a processor, a note signal of the string instrument to detect a selected instrumental technique from a plurality of instrumental techniques, analyzing, using the processor, a noise signal of the string instrument to detect a change in frequency of the noise signal, and generating, using the processor, a vibrato bar event responsive to detecting the selected instrumental technique and the change in frequency of the noise signal. | 1. A method of detecting vibrato bar technique, comprising:
analyzing, using a processor, a note signal of a string instrument to detect a selected instrumental technique from a plurality of instrumental techniques; analyzing, using the processor, a noise signal of the string instrument to detect a change in frequency of the noise signal; and generating, using the processor, a vibrato bar event responsive to detecting the selected instrumental technique and the change in frequency of the noise signal. 2. The method of claim 1, wherein the selected instrumental technique involves a change in frequency of the note signal. 3. The method of claim 1, wherein the note signal and the noise signal are analyzed for a same time interval. 4. The method of claim 1, further comprising:
determining a direction of movement of a vibrato bar based upon a direction of change in frequency of at least one of the note signal or the noise signal. 5. The method of claim 1, wherein the selected instrumental technique is a bend or a release. 6. The method of claim 1, further comprising:
storing the noise signal in a memory for analysis. 7. The method of claim 6, wherein the analyzing the noise signal comprises:
recalling the noise signal for a same time interval as the note signal; and analyzing the noise signal for the change in frequency during the same time interval. 8. The method of claim 1, wherein the noise signal includes a plurality of noise signals, wherein each noise signal of the plurality of noise signals is for a different string of the string instrument. 9. The method of claim 1, further comprising:
detecting the note signal and the noise signal from a plurality of received signals. 10. The method of claim 1, wherein the note signal is for a first string of the string instrument sounding a note and the noise signal is for a second string of the string instrument not sounding a note. 11. A method of detecting vibrato bar technique, comprising:
detecting, using a processor, a note signal and a noise signal from a plurality of signals from a string instrument; analyzing, using the processor, a time interval of the note signal to detect an instrumental technique involving a change in frequency of the note signal occurring within the time interval; analyzing, in response to detecting the instrumental technique and using the processor, the noise signal for the time interval to detect a change in frequency of the noise signal; and generating, using the processor, a vibrato bar event in response to a detection of the instrumental technique and the change in frequency of the noise signal. 12. A system for detecting vibrato bar technique, comprising:
a processor configured to:
analyze a note signal of a string instrument to detect a selected instrumental technique from a plurality of instrumental techniques;
analyze a noise signal of the string instrument to detect a change in frequency of the noise signal; and
generate a vibrato bar event responsive to detecting the selected instrumental technique and the change in frequency of the noise signal. 13. The system of claim 12, wherein the selected instrumental technique involves a change in frequency of the note signal. 14. The system of claim 12, wherein the note signal and the noise signal are analyzed for a same time interval. 15. The system of claim 12, wherein the processor is further configured to:
determine a direction of movement of a vibrato bar based upon a direction of change in frequency of at least one of the note signal or the noise signal. 16. The system of claim 12, wherein the selected instrumental technique is a bend or a release. 17. The system of claim 12, wherein the processor is further configured to:
store the noise signal in a memory for analysis. 18. The system of claim 17, wherein the processor is configured to recall the noise signal for a same time interval as the note signal and analyze the noise signal for the change in frequency during the same time interval. 19. The system of claim 12, wherein the noise signal includes a plurality of noise signals, wherein each noise signal of the plurality of noise signals is for a different string of the string instrument. 20. The system of claim 12, wherein the processor is further configured to:
detect the note signal and the noise signal from a plurality of received signals. 21. The system of claim 12, wherein the note signal is for a first string of the string instrument sounding a note and the noise signal is for a second string of the string instrument not sounding a note. 22. A system for detecting vibrato bar technique, comprising:
a processor configured to:
determine a note signal and a noise signal from a plurality of signals from a string instrument;
analyze a time interval of the note signal to detect an instrumental technique involving a change in frequency of the note signal occurring within the time interval;
analyze, in response to detecting the instrumental technique, the noise signal for the time interval to detect a change in frequency of the noise signal; and
generate a vibrato bar event in response to a detection of the instrumental technique and the change in frequency of the noise signal. 23. A computer program product for detecting vibrato bar technique, the computer program product comprising a computer readable storage medium having program instructions embodied therewith, the program instructions executable by a processor to cause the processor to:
analyze, using the processor, a note signal of a string instrument to detect a selected instrumental technique from a plurality of instrumental techniques; analyze, using the processor, a noise signal of the string instrument to detect a change in frequency of the noise signal; and generate, using the processor, a vibrato bar event responsive to detecting the selected instrumental technique and the change in frequency of the noise signal. 24. The computer program product of claim 23, wherein the selected instrumental technique involves a change in frequency of the note signal. 25. The computer program product of claim 23, wherein the note signal and the noise signal are analyzed for a same time interval. | Detecting vibrato bar technique for a string instrument can include analyzing, using a processor, a note signal of the string instrument to detect a selected instrumental technique from a plurality of instrumental techniques, analyzing, using the processor, a noise signal of the string instrument to detect a change in frequency of the noise signal, and generating, using the processor, a vibrato bar event responsive to detecting the selected instrumental technique and the change in frequency of the noise signal.1. A method of detecting vibrato bar technique, comprising:
analyzing, using a processor, a note signal of a string instrument to detect a selected instrumental technique from a plurality of instrumental techniques; analyzing, using the processor, a noise signal of the string instrument to detect a change in frequency of the noise signal; and generating, using the processor, a vibrato bar event responsive to detecting the selected instrumental technique and the change in frequency of the noise signal. 2. The method of claim 1, wherein the selected instrumental technique involves a change in frequency of the note signal. 3. The method of claim 1, wherein the note signal and the noise signal are analyzed for a same time interval. 4. The method of claim 1, further comprising:
determining a direction of movement of a vibrato bar based upon a direction of change in frequency of at least one of the note signal or the noise signal. 5. The method of claim 1, wherein the selected instrumental technique is a bend or a release. 6. The method of claim 1, further comprising:
storing the noise signal in a memory for analysis. 7. The method of claim 6, wherein the analyzing the noise signal comprises:
recalling the noise signal for a same time interval as the note signal; and analyzing the noise signal for the change in frequency during the same time interval. 8. The method of claim 1, wherein the noise signal includes a plurality of noise signals, wherein each noise signal of the plurality of noise signals is for a different string of the string instrument. 9. The method of claim 1, further comprising:
detecting the note signal and the noise signal from a plurality of received signals. 10. The method of claim 1, wherein the note signal is for a first string of the string instrument sounding a note and the noise signal is for a second string of the string instrument not sounding a note. 11. A method of detecting vibrato bar technique, comprising:
detecting, using a processor, a note signal and a noise signal from a plurality of signals from a string instrument; analyzing, using the processor, a time interval of the note signal to detect an instrumental technique involving a change in frequency of the note signal occurring within the time interval; analyzing, in response to detecting the instrumental technique and using the processor, the noise signal for the time interval to detect a change in frequency of the noise signal; and generating, using the processor, a vibrato bar event in response to a detection of the instrumental technique and the change in frequency of the noise signal. 12. A system for detecting vibrato bar technique, comprising:
a processor configured to:
analyze a note signal of a string instrument to detect a selected instrumental technique from a plurality of instrumental techniques;
analyze a noise signal of the string instrument to detect a change in frequency of the noise signal; and
generate a vibrato bar event responsive to detecting the selected instrumental technique and the change in frequency of the noise signal. 13. The system of claim 12, wherein the selected instrumental technique involves a change in frequency of the note signal. 14. The system of claim 12, wherein the note signal and the noise signal are analyzed for a same time interval. 15. The system of claim 12, wherein the processor is further configured to:
determine a direction of movement of a vibrato bar based upon a direction of change in frequency of at least one of the note signal or the noise signal. 16. The system of claim 12, wherein the selected instrumental technique is a bend or a release. 17. The system of claim 12, wherein the processor is further configured to:
store the noise signal in a memory for analysis. 18. The system of claim 17, wherein the processor is configured to recall the noise signal for a same time interval as the note signal and analyze the noise signal for the change in frequency during the same time interval. 19. The system of claim 12, wherein the noise signal includes a plurality of noise signals, wherein each noise signal of the plurality of noise signals is for a different string of the string instrument. 20. The system of claim 12, wherein the processor is further configured to:
detect the note signal and the noise signal from a plurality of received signals. 21. The system of claim 12, wherein the note signal is for a first string of the string instrument sounding a note and the noise signal is for a second string of the string instrument not sounding a note. 22. A system for detecting vibrato bar technique, comprising:
a processor configured to:
determine a note signal and a noise signal from a plurality of signals from a string instrument;
analyze a time interval of the note signal to detect an instrumental technique involving a change in frequency of the note signal occurring within the time interval;
analyze, in response to detecting the instrumental technique, the noise signal for the time interval to detect a change in frequency of the noise signal; and
generate a vibrato bar event in response to a detection of the instrumental technique and the change in frequency of the noise signal. 23. A computer program product for detecting vibrato bar technique, the computer program product comprising a computer readable storage medium having program instructions embodied therewith, the program instructions executable by a processor to cause the processor to:
analyze, using the processor, a note signal of a string instrument to detect a selected instrumental technique from a plurality of instrumental techniques; analyze, using the processor, a noise signal of the string instrument to detect a change in frequency of the noise signal; and generate, using the processor, a vibrato bar event responsive to detecting the selected instrumental technique and the change in frequency of the noise signal. 24. The computer program product of claim 23, wherein the selected instrumental technique involves a change in frequency of the note signal. 25. The computer program product of claim 23, wherein the note signal and the noise signal are analyzed for a same time interval. | 2,800 |
11,587 | 11,587 | 15,591,611 | 2,894 | Solder-bumped semiconductor substrates (e.g., semiconductor wafers) and methods for forming solder bumped semiconductor substrates are provided, in which solder bumps are formed on a semiconductor substrate using preformed solder balls having different compositions and/or sizes. Two or more solder balls masks are successively utilized to place different types of preformed solder balls (differing in composition and/or size) into corresponding cavities of a solder ball fixture, and thereby form an array of different types of preformed solder balls arranged in the solder ball fixture. The array of preformed solder balls in the solder ball fixture are then transferred to corresponding contact pads of a semiconductor substrate (e.g., semiconductor wafer) using a single solder reflow process. This process allows different types of preformed solder bumps to be bonded to a semiconductor substrate at the same time using a single solder reflow process. | 1. A substrate comprising solder bumps formed by a process comprising:
placing a first solder ball mask on a solder ball fixture, wherein the solder ball fixture comprises a first array of cavities and a second array of cavities formed in a surface of the solder ball fixture, wherein the first solder ball mask comprises a first array of openings aligned to the first array of cavities of the solder ball fixture; utilizing the first solder ball mask to place a first set of preformed solder balls into the first array of cavities through the first array of openings, wherein the first solder ball mask prevents the first set of preformed solder balls from being placed into the second array of cavities of the solder ball fixture; removing the first solder ball mask from the solder ball fixture, and placing a second solder ball mask on the solder ball fixture, wherein the second solder ball mask comprises a second array of openings aligned to the second array of cavities of the solder ball fixture; utilizing the second solder ball mask to place a second set of preformed solder balls into the second array of cavities through the second array of openings; removing the second solder ball mask from the solder ball fixture; placing a substrate on the solder ball fixture, wherein the substrate comprises a first array of contact pads aligned to, and in contact with, the first set of preformed solder balls disposed in the first array of cavities of the solder ball fixture, and wherein the substrate comprises a second array of contact pads aligned to, and in contact with, the second set of preformed solder balls disposed in the second array of cavities of the solder ball fixture: performing a solder reflow process while the substrate is placed on the solder ball fixture to heat the preformed solder balls and bond the first set of preformed solder balls to the first array of contact pads of the substrate and bond the second set of preformed solder balls to the second array of contact pads of the substrate; and removing the solder ball fixture from the semiconductor substrate after the solder reflow process is completed; wherein the first and second sets of preformed solder balls differ in size, wherein the preformed solder balls of the first set of preformed solder balls have a diameter D1, wherein the preformed solder balls of the second set of preformed solder balls have a diameter D2, wherein D2 is greater than D1; and wherein the first array of cavities and the second array of cavities formed in the surface of the solder ball fixture are sized and shaped such that top portions of each of the first and second sets of preformed solder balls, which protrude from the first and second arrays of cavities past the surface of the solder ball fixture, are coplanar. 2. The substrate of claim 1, wherein the first array of openings of the first solder mask and the first array of cavities of the solder ball fixture are sized and shaped to allow the first set of preformed solder balls to pass through the first array of openings and fit within the first array of cavities, and wherein the second array of openings of the second solder mask and the second array of cavities of the solder ball fixture are sized and shaped to allow the second set of preformed solder balls to pass through the second array of openings and fit within the second array of cavities. 3. The substrate of claim 1, wherein a surface area of each contact pad of the first array of contact pads is less than a surface area of each contact pad of the second array of contact pads. 4. The substrate of claim 1, wherein the first and second sets of preformed solder balls differ in composition, wherein the first set of preformed solder balls have a first composition type, and wherein the second set of preformed solder balls have a second composition type. 5. The substrate of claim 4, wherein at least one of the first composition type and the second composition type comprises a preformed solder ball comprising a copper core with electroplated solder covering the copper core. 6. The substrate of claim 1, wherein the substrate comprises a semiconductor wafer. 7. The substrate of claim 1, wherein the solder ball fixture has a CTE (coefficient of thermal expansion) that is matched to a CTE of the substrate. 8. A substrate, comprising:
a first array of contact pads comprising a first array of preformed solder balls bonded thereto; a second array of contact pads comprising a second array of preformed solder balls bonded thereto; wherein the first array of preformed solder balls comprises preformed solder balls having a first composition; and wherein the second array of preformed solder balls comprises preformed solder balls having a second composition, wherein the first and second compositions are different. 9. The substrate of claim 8, wherein the preformed solder balls of the first array of preformed solder balls comprise a copper core with electroplated solder encapsulating the copper core. 10. The substrate of claim 8, wherein the preformed solder balls of the first array of preformed solder balls have a first diameter, wherein the preformed solder balls of the second array of preformed solder balls have second diameter, which is different from the first diameter. 11. The substrate of claim 8, wherein the substrate comprises a semiconductor wafer. 12. The substrate of claim 8, wherein a surface area of each contact pad of the first array of contact pads is less than a surface area of each contact pad of the second array of contact pads. | Solder-bumped semiconductor substrates (e.g., semiconductor wafers) and methods for forming solder bumped semiconductor substrates are provided, in which solder bumps are formed on a semiconductor substrate using preformed solder balls having different compositions and/or sizes. Two or more solder balls masks are successively utilized to place different types of preformed solder balls (differing in composition and/or size) into corresponding cavities of a solder ball fixture, and thereby form an array of different types of preformed solder balls arranged in the solder ball fixture. The array of preformed solder balls in the solder ball fixture are then transferred to corresponding contact pads of a semiconductor substrate (e.g., semiconductor wafer) using a single solder reflow process. This process allows different types of preformed solder bumps to be bonded to a semiconductor substrate at the same time using a single solder reflow process.1. A substrate comprising solder bumps formed by a process comprising:
placing a first solder ball mask on a solder ball fixture, wherein the solder ball fixture comprises a first array of cavities and a second array of cavities formed in a surface of the solder ball fixture, wherein the first solder ball mask comprises a first array of openings aligned to the first array of cavities of the solder ball fixture; utilizing the first solder ball mask to place a first set of preformed solder balls into the first array of cavities through the first array of openings, wherein the first solder ball mask prevents the first set of preformed solder balls from being placed into the second array of cavities of the solder ball fixture; removing the first solder ball mask from the solder ball fixture, and placing a second solder ball mask on the solder ball fixture, wherein the second solder ball mask comprises a second array of openings aligned to the second array of cavities of the solder ball fixture; utilizing the second solder ball mask to place a second set of preformed solder balls into the second array of cavities through the second array of openings; removing the second solder ball mask from the solder ball fixture; placing a substrate on the solder ball fixture, wherein the substrate comprises a first array of contact pads aligned to, and in contact with, the first set of preformed solder balls disposed in the first array of cavities of the solder ball fixture, and wherein the substrate comprises a second array of contact pads aligned to, and in contact with, the second set of preformed solder balls disposed in the second array of cavities of the solder ball fixture: performing a solder reflow process while the substrate is placed on the solder ball fixture to heat the preformed solder balls and bond the first set of preformed solder balls to the first array of contact pads of the substrate and bond the second set of preformed solder balls to the second array of contact pads of the substrate; and removing the solder ball fixture from the semiconductor substrate after the solder reflow process is completed; wherein the first and second sets of preformed solder balls differ in size, wherein the preformed solder balls of the first set of preformed solder balls have a diameter D1, wherein the preformed solder balls of the second set of preformed solder balls have a diameter D2, wherein D2 is greater than D1; and wherein the first array of cavities and the second array of cavities formed in the surface of the solder ball fixture are sized and shaped such that top portions of each of the first and second sets of preformed solder balls, which protrude from the first and second arrays of cavities past the surface of the solder ball fixture, are coplanar. 2. The substrate of claim 1, wherein the first array of openings of the first solder mask and the first array of cavities of the solder ball fixture are sized and shaped to allow the first set of preformed solder balls to pass through the first array of openings and fit within the first array of cavities, and wherein the second array of openings of the second solder mask and the second array of cavities of the solder ball fixture are sized and shaped to allow the second set of preformed solder balls to pass through the second array of openings and fit within the second array of cavities. 3. The substrate of claim 1, wherein a surface area of each contact pad of the first array of contact pads is less than a surface area of each contact pad of the second array of contact pads. 4. The substrate of claim 1, wherein the first and second sets of preformed solder balls differ in composition, wherein the first set of preformed solder balls have a first composition type, and wherein the second set of preformed solder balls have a second composition type. 5. The substrate of claim 4, wherein at least one of the first composition type and the second composition type comprises a preformed solder ball comprising a copper core with electroplated solder covering the copper core. 6. The substrate of claim 1, wherein the substrate comprises a semiconductor wafer. 7. The substrate of claim 1, wherein the solder ball fixture has a CTE (coefficient of thermal expansion) that is matched to a CTE of the substrate. 8. A substrate, comprising:
a first array of contact pads comprising a first array of preformed solder balls bonded thereto; a second array of contact pads comprising a second array of preformed solder balls bonded thereto; wherein the first array of preformed solder balls comprises preformed solder balls having a first composition; and wherein the second array of preformed solder balls comprises preformed solder balls having a second composition, wherein the first and second compositions are different. 9. The substrate of claim 8, wherein the preformed solder balls of the first array of preformed solder balls comprise a copper core with electroplated solder encapsulating the copper core. 10. The substrate of claim 8, wherein the preformed solder balls of the first array of preformed solder balls have a first diameter, wherein the preformed solder balls of the second array of preformed solder balls have second diameter, which is different from the first diameter. 11. The substrate of claim 8, wherein the substrate comprises a semiconductor wafer. 12. The substrate of claim 8, wherein a surface area of each contact pad of the first array of contact pads is less than a surface area of each contact pad of the second array of contact pads. | 2,800 |
11,588 | 11,588 | 14,290,780 | 2,858 | An embodiment of a magnetic-field sensor includes a magnetic-field sensor arrangement and a magnetic body which has, for example, a non-convex cross-sectional area with regard to a cross-sectional plane running through the magnetic body, the magnetic body having an inhomogeneous magnetization. | 1. A magnetic-field sensor comprising:
a magnetic-field sensor arrangement; and a magnetic body, the magnetic body comprising an inhomogeneous magnetization. 2. The magnetic-field sensor as claimed in claim 1, wherein the magnetic body comprises a non-convex cross-sectional area with respect to a cross-sectional plane running through it. 3. The magnetic-field sensor as claimed in claim 2, wherein the magnetic body comprises a recess resulting in the non-convex cross-sectional area. 4. The magnetic-field sensor as claimed in claim 3, wherein the recess comprises, with respect to the cross-sectional area, a demarcation line which is at least partly ellipsoidal, circular or polygonal. 5. The magnetic-field sensor as claimed in claim 4, wherein the demarcation line is at least partly polygonal and comprises at least three vertices. 6. The magnetic-field sensor as claimed in claim 4, wherein the demarcation line of the recess is mirror-symmetrical with respect to a symmetry line running within the cross-sectional plane. 7. The magnetic-field sensor as claimed in claim 6, wherein the magnetic-field sensor arrangement comprises a substrate comprising a main surface, the symmetry line intersecting the main surface of the substrate at an angle of between 75° and 105° in relation to the main surface of the substrate. 8. The magnetic-field sensor as claimed in claim 3, wherein the magnetic body comprises the recess on a side facing the magnetic-field sensor arrangement. 9. The magnetic-field sensor as claimed in claim 1, wherein the magnetic body comprises the inhomogeneous magnetization in at least 50% of a volume of the magnetic body. 10. The magnetic-field sensor as claimed in claim 1, wherein the magnetic body comprises a radial magnetization directed at a central point. 11. The magnetic-field sensor as claimed in claim 10, wherein the magnetic body comprises the radial magnetization in at least 50% of a volume of the magnetic body. 12. The magnetic-field sensor as claimed in claim 1, wherein the magnetic body comprises an azimuthal magnetization which is tangentially directed with respect to a connecting line to a central point. 13. The magnetic-field sensor as claimed in claim 12, wherein the magnetic body comprises the azimuthal magnetization in at least 50% of a volume of the magnetic body. 14. The magnetic-field sensor as claimed in claim 1, wherein the magnetic body comprises a maximum deviation of a magnitude of the inhomogeneous magnetization of the magnetic body, the deviation being smaller than or equal to 20% of a maximum magnitude of the inhomogeneous magnetization of the magnetic body. 15. The magnetic-field sensor as claimed in claim 1, wherein the magnetic-field sensor arrangement comprises a first magnetic-field sensor element and a second magnetic-field sensor element, the first magnetic-field sensor element being arranged, with respect to the magnetic body, such that the first magnetic-field sensor element is exposed, with regard to a predetermined spatial direction, to a first magnetic flux density caused by the magnetic body and being within a first flux density range, and the second magnetic-field sensor element being arranged, with respect to the magnetic body, such that the second magnetic-field sensor element is exposed, with regard to the predetermined spatial direction, to a second magnetic flux density caused by the magnetic body and being within a second flux density range. 16. The magnetic-field sensor as claimed in claim 15, wherein the first flux density range and the second flux density range enable operation of the first and second magnetic-field sensor elements outside a saturation range. 17. The magnetic-field sensor as claimed in claim 15, wherein the first and second flux density ranges only comprise values smaller than or equal to 20 mT in magnitude. 18. The magnetic-field sensor as claimed in claim 15, wherein the first and second magnetic-field sensor elements are magneto-resistive sensor elements. 19. The magnetic-field sensor as claimed in claim 15, wherein the first and second magnetic-field sensor elements are arranged on a substrate, and wherein the predetermined spatial direction is parallel to a main surface of the substrate. 20. The magnetic-field sensor as claimed in claim 1, wherein the magnetic body is annular or comprises an annular section. 21. A method of producing a magnetic-field sensor, comprising:
providing a magnetic body, the magnetic body comprising an inhomogeneous magnetization, first and second spatial areas with regard to the magnetic body existing, so that in the first spatial area, a first magnetic flux density caused by the magnetic body is within a first flux density range with regard to a predetermined spatial direction, and so that in the second spatial area, a second magnetic flux density is caused by the magnetic body with regard to the predetermined spatial direction, which is within a second flux density range; and arranging a magnetic-field sensor arrangement comprising first and second magnetic-field sensor elements, so that the first magnetic-field sensor element is arranged in the first spatial area, and the second magnetic-field sensor element is arranged in the second spatial area. 22. The method as claimed in claim 21, wherein the magnetic body comprising a non-convex cross-sectional area with respect to a cross-sectional plane running through the magnetic body is provided. 23. The method as claimed in claim 21, further comprising determining the first and second spatial areas with regard to the magnetic body. 24. The method as claimed in claim 21, wherein the first and second spatial areas are cubic, wherein the first and second spatial areas comprise lengths of between 300 μm and 2000 μm with regard to the predetermined spatial direction, and wherein the first and second spatial areas comprise lengths of at least 100 μm with regard to a first spatial direction perpendicular to the predetermined spatial direction. 25. A program comprising a program code for performing a method of producing a magnetic-field sensor, the method comprising:
providing a magnetic body, the magnetic body comprising an inhomogeneous magnetization, first and second spatial areas with regard to the magnetic body existing, so that in the first spatial area, a first magnetic flux density caused by the magnetic body is within a first flux density range with regard to a predetermined spatial direction, and so that in the second spatial area, a second magnetic flux density is caused by the magnetic body with regard to the predetermined spatial direction, which is within a second flux density range; and arranging a magnetic-field sensor arrangement comprising first and second magnetic-field sensor elements, so that the first magnetic-field sensor element is arranged in the first spatial area, and the second magnetic-field sensor element is arranged in the second spatial area, when the program runs on a processor. | An embodiment of a magnetic-field sensor includes a magnetic-field sensor arrangement and a magnetic body which has, for example, a non-convex cross-sectional area with regard to a cross-sectional plane running through the magnetic body, the magnetic body having an inhomogeneous magnetization.1. A magnetic-field sensor comprising:
a magnetic-field sensor arrangement; and a magnetic body, the magnetic body comprising an inhomogeneous magnetization. 2. The magnetic-field sensor as claimed in claim 1, wherein the magnetic body comprises a non-convex cross-sectional area with respect to a cross-sectional plane running through it. 3. The magnetic-field sensor as claimed in claim 2, wherein the magnetic body comprises a recess resulting in the non-convex cross-sectional area. 4. The magnetic-field sensor as claimed in claim 3, wherein the recess comprises, with respect to the cross-sectional area, a demarcation line which is at least partly ellipsoidal, circular or polygonal. 5. The magnetic-field sensor as claimed in claim 4, wherein the demarcation line is at least partly polygonal and comprises at least three vertices. 6. The magnetic-field sensor as claimed in claim 4, wherein the demarcation line of the recess is mirror-symmetrical with respect to a symmetry line running within the cross-sectional plane. 7. The magnetic-field sensor as claimed in claim 6, wherein the magnetic-field sensor arrangement comprises a substrate comprising a main surface, the symmetry line intersecting the main surface of the substrate at an angle of between 75° and 105° in relation to the main surface of the substrate. 8. The magnetic-field sensor as claimed in claim 3, wherein the magnetic body comprises the recess on a side facing the magnetic-field sensor arrangement. 9. The magnetic-field sensor as claimed in claim 1, wherein the magnetic body comprises the inhomogeneous magnetization in at least 50% of a volume of the magnetic body. 10. The magnetic-field sensor as claimed in claim 1, wherein the magnetic body comprises a radial magnetization directed at a central point. 11. The magnetic-field sensor as claimed in claim 10, wherein the magnetic body comprises the radial magnetization in at least 50% of a volume of the magnetic body. 12. The magnetic-field sensor as claimed in claim 1, wherein the magnetic body comprises an azimuthal magnetization which is tangentially directed with respect to a connecting line to a central point. 13. The magnetic-field sensor as claimed in claim 12, wherein the magnetic body comprises the azimuthal magnetization in at least 50% of a volume of the magnetic body. 14. The magnetic-field sensor as claimed in claim 1, wherein the magnetic body comprises a maximum deviation of a magnitude of the inhomogeneous magnetization of the magnetic body, the deviation being smaller than or equal to 20% of a maximum magnitude of the inhomogeneous magnetization of the magnetic body. 15. The magnetic-field sensor as claimed in claim 1, wherein the magnetic-field sensor arrangement comprises a first magnetic-field sensor element and a second magnetic-field sensor element, the first magnetic-field sensor element being arranged, with respect to the magnetic body, such that the first magnetic-field sensor element is exposed, with regard to a predetermined spatial direction, to a first magnetic flux density caused by the magnetic body and being within a first flux density range, and the second magnetic-field sensor element being arranged, with respect to the magnetic body, such that the second magnetic-field sensor element is exposed, with regard to the predetermined spatial direction, to a second magnetic flux density caused by the magnetic body and being within a second flux density range. 16. The magnetic-field sensor as claimed in claim 15, wherein the first flux density range and the second flux density range enable operation of the first and second magnetic-field sensor elements outside a saturation range. 17. The magnetic-field sensor as claimed in claim 15, wherein the first and second flux density ranges only comprise values smaller than or equal to 20 mT in magnitude. 18. The magnetic-field sensor as claimed in claim 15, wherein the first and second magnetic-field sensor elements are magneto-resistive sensor elements. 19. The magnetic-field sensor as claimed in claim 15, wherein the first and second magnetic-field sensor elements are arranged on a substrate, and wherein the predetermined spatial direction is parallel to a main surface of the substrate. 20. The magnetic-field sensor as claimed in claim 1, wherein the magnetic body is annular or comprises an annular section. 21. A method of producing a magnetic-field sensor, comprising:
providing a magnetic body, the magnetic body comprising an inhomogeneous magnetization, first and second spatial areas with regard to the magnetic body existing, so that in the first spatial area, a first magnetic flux density caused by the magnetic body is within a first flux density range with regard to a predetermined spatial direction, and so that in the second spatial area, a second magnetic flux density is caused by the magnetic body with regard to the predetermined spatial direction, which is within a second flux density range; and arranging a magnetic-field sensor arrangement comprising first and second magnetic-field sensor elements, so that the first magnetic-field sensor element is arranged in the first spatial area, and the second magnetic-field sensor element is arranged in the second spatial area. 22. The method as claimed in claim 21, wherein the magnetic body comprising a non-convex cross-sectional area with respect to a cross-sectional plane running through the magnetic body is provided. 23. The method as claimed in claim 21, further comprising determining the first and second spatial areas with regard to the magnetic body. 24. The method as claimed in claim 21, wherein the first and second spatial areas are cubic, wherein the first and second spatial areas comprise lengths of between 300 μm and 2000 μm with regard to the predetermined spatial direction, and wherein the first and second spatial areas comprise lengths of at least 100 μm with regard to a first spatial direction perpendicular to the predetermined spatial direction. 25. A program comprising a program code for performing a method of producing a magnetic-field sensor, the method comprising:
providing a magnetic body, the magnetic body comprising an inhomogeneous magnetization, first and second spatial areas with regard to the magnetic body existing, so that in the first spatial area, a first magnetic flux density caused by the magnetic body is within a first flux density range with regard to a predetermined spatial direction, and so that in the second spatial area, a second magnetic flux density is caused by the magnetic body with regard to the predetermined spatial direction, which is within a second flux density range; and arranging a magnetic-field sensor arrangement comprising first and second magnetic-field sensor elements, so that the first magnetic-field sensor element is arranged in the first spatial area, and the second magnetic-field sensor element is arranged in the second spatial area, when the program runs on a processor. | 2,800 |
11,589 | 11,589 | 15,131,230 | 2,892 | A semiconductor device includes a semiconductor substrate having a principal surface, and an insulating film formed on the principal surface and continuously covering a top surface of a first boundary region and a top surface of a second boundary region, the first boundary region including a boundary between a well layer and a RESURF layer, the second boundary region including a boundary between the RESURF layer and a first impurity region. The semiconductor device further includes a plurality of lower field plates formed in the insulating film in such a manner that the plurality of lower field plates do not lie directly above the first and second boundary regions, and a plurality of upper field plates formed on the insulating film in such a manner that the plurality of upper field plates do not lie directly above the first and second boundary regions. | 1. A semiconductor device comprising:
a semiconductor substrate having a principal surface; a first impurity region of a first conductivity type formed in said semiconductor substrate; a well layer of a second conductivity type formed in said semiconductor substrate along said principal surface; a channel stopper of said first conductivity type formed in said semiconductor substrate away from said well layer and along said principal surface; and a RESURF layer formed in said semiconductor substrate between said well layer and said channel stopper and along said principal surface, and having an impurity concentration of said second conductivity type which gradually decreases away from said well layer toward said channel stopper. 2. The semiconductor device according to claim 1, wherein said RESURF layer is formed of a plurality of regions of said second conductivity type which are closely spaced on the well layer side of said semiconductor substrate and widely spaced on the channel stopper side of said semiconductor substrate. 3. The semiconductor device according to claim 1, wherein said RESURF layer is formed of a plurality of regions of said second conductivity type which gradually decrease in area and in depth from said principal surface as said plurality of regions are located further away from said well layer toward said channel stopper. 4. A semiconductor device comprising:
a semiconductor substrate having a principal surface; a first impurity region of a first conductivity type formed in said semiconductor substrate; a RESURF layer of a second conductivity type formed in said semiconductor substrate and along said principal surface; a well layer of said second conductivity type formed in said semiconductor substrate adjacent said RESURF layer and along said principal surface; a concentration gradient reducing section formed in the portion of said well layer adjacent said RESURF layer in such a manner that the impurity concentration gradient of said second conductivity type between said well layer and said RESURF layer is reduced; and a gate wire formed directly above said concentration gradient reducing section. 5. The semiconductor device according to claim 4, further comprising an emitter grounding electrode formed directly above said concentration gradient reducing section and connected to an emitter electrode. | A semiconductor device includes a semiconductor substrate having a principal surface, and an insulating film formed on the principal surface and continuously covering a top surface of a first boundary region and a top surface of a second boundary region, the first boundary region including a boundary between a well layer and a RESURF layer, the second boundary region including a boundary between the RESURF layer and a first impurity region. The semiconductor device further includes a plurality of lower field plates formed in the insulating film in such a manner that the plurality of lower field plates do not lie directly above the first and second boundary regions, and a plurality of upper field plates formed on the insulating film in such a manner that the plurality of upper field plates do not lie directly above the first and second boundary regions.1. A semiconductor device comprising:
a semiconductor substrate having a principal surface; a first impurity region of a first conductivity type formed in said semiconductor substrate; a well layer of a second conductivity type formed in said semiconductor substrate along said principal surface; a channel stopper of said first conductivity type formed in said semiconductor substrate away from said well layer and along said principal surface; and a RESURF layer formed in said semiconductor substrate between said well layer and said channel stopper and along said principal surface, and having an impurity concentration of said second conductivity type which gradually decreases away from said well layer toward said channel stopper. 2. The semiconductor device according to claim 1, wherein said RESURF layer is formed of a plurality of regions of said second conductivity type which are closely spaced on the well layer side of said semiconductor substrate and widely spaced on the channel stopper side of said semiconductor substrate. 3. The semiconductor device according to claim 1, wherein said RESURF layer is formed of a plurality of regions of said second conductivity type which gradually decrease in area and in depth from said principal surface as said plurality of regions are located further away from said well layer toward said channel stopper. 4. A semiconductor device comprising:
a semiconductor substrate having a principal surface; a first impurity region of a first conductivity type formed in said semiconductor substrate; a RESURF layer of a second conductivity type formed in said semiconductor substrate and along said principal surface; a well layer of said second conductivity type formed in said semiconductor substrate adjacent said RESURF layer and along said principal surface; a concentration gradient reducing section formed in the portion of said well layer adjacent said RESURF layer in such a manner that the impurity concentration gradient of said second conductivity type between said well layer and said RESURF layer is reduced; and a gate wire formed directly above said concentration gradient reducing section. 5. The semiconductor device according to claim 4, further comprising an emitter grounding electrode formed directly above said concentration gradient reducing section and connected to an emitter electrode. | 2,800 |
11,590 | 11,590 | 14,917,595 | 2,835 | A heat transfer interface structure and a method of manufacturing the same are disclosed. A substrate has a plurality of raised features formed on at least one surface the substrate. The raised features are deformable under a compressive force and have respective openings at end portions thereof. A thickness of a raised feature at the end portion thereof is smaller than a thickness of the raised feature at an intermediate portion of the raised feature. | 1. A thermally conductive heat transfer interface structure comprising a substrate having a first surface and a second surface and a plurality of raised features formed on at least one of the first surface and the second surface of the substrate, the raised features being deformable under a compressive force, wherein some of the raised features have an opening at a respective end portion thereof; and
wherein a thickness of a raised feature at said end portion is smaller than a thickness of the raised feature at an intermediate portion of the raised feature. 2. The heat transfer interface structure of claim 1, wherein, one or more raised features each comprise a first height corresponding to a first location on the end portion thereof and a second height corresponding to a second location on the end portion thereof, wherein a height is a distance from a plane defined by the substrate to a parallel plane passing through a location on end portion. 3. The heat transfer interface structure of claim 1, wherein a raised feature has a wall and the wall comprises roughness on an outer surface thereof. 4. An apparatus comprising an electric component capable of generating heat, a heat dissipater component and a heat transfer interface structure, the heat transfer interface structure comprising a substrate having a first surface and a second surface and a plurality of raised features formed on at least one of the first surface and the second surface of the substrate, the raised features being deformable under a compressive force;
wherein some of the raised features have an opening at a respective end portion thereof; wherein a thickness of a raised feature at said end portion is smaller than a thickness of the raised feature at an intermediate portion of the raised feature; and wherein said heat transfer interfaced structure is located between the electric component and the dissipater component. 5. The apparatus of claim 4, wherein one or more raised features each comprise a first height corresponding to a first location on the end portion thereof and a second height corresponding to a second location on the end portion thereof, wherein a height is a distance from a plane defined by the substrate to a parallel plane passing through a location on end portion. 6. The apparatus of claim 4, wherein a raised feature has a wall and the wall comprises roughness on an outer surface thereof. 7. A method, comprising:
placing a deformable sheet of thermally conductive material between two dies each comprising at least one of a projection and a cavity on a respective surface, wherein a projection has a matching shape and dimensions with a cavity; moving a die toward the other such that a projection nests within a corresponding opposite cavity and such that a compressive force is applied to the deformable sheet located between the projection and the cavity to produce a raised feature in the deformable sheet, the raised feature having an opening at a respective end portion thereof; wherein a thickness of a raised feature at said end portion is smaller than a thickness of the raised feature at an intermediate portion of the raised feature. 8. The method of claim 7, comprising:
exerting a force by a projection on the deformable sheet, causing the deformable sheet to undergo a deformation in the proximity of a point of contact between the projection and the deformable sheet; wherein said deformation is produced by causing a material yield in the deformable sheet at said point of contact to cause the thickness of a raised feature at said end portion become smaller than a thickness of the raised feature at an intermediate portion of the raised feature. 9. The method of claim 8, further comprising fracturing the deformable sheet to produce an opening in the end portion of the raised feature. 10. The method of claim 7, wherein the dies have roughness on the respective outer surface thereof, such roughness being configured to transfer unevenness associated to the roughness thereon to a surface of the raised features as the deformable sheet is deformed. | A heat transfer interface structure and a method of manufacturing the same are disclosed. A substrate has a plurality of raised features formed on at least one surface the substrate. The raised features are deformable under a compressive force and have respective openings at end portions thereof. A thickness of a raised feature at the end portion thereof is smaller than a thickness of the raised feature at an intermediate portion of the raised feature.1. A thermally conductive heat transfer interface structure comprising a substrate having a first surface and a second surface and a plurality of raised features formed on at least one of the first surface and the second surface of the substrate, the raised features being deformable under a compressive force, wherein some of the raised features have an opening at a respective end portion thereof; and
wherein a thickness of a raised feature at said end portion is smaller than a thickness of the raised feature at an intermediate portion of the raised feature. 2. The heat transfer interface structure of claim 1, wherein, one or more raised features each comprise a first height corresponding to a first location on the end portion thereof and a second height corresponding to a second location on the end portion thereof, wherein a height is a distance from a plane defined by the substrate to a parallel plane passing through a location on end portion. 3. The heat transfer interface structure of claim 1, wherein a raised feature has a wall and the wall comprises roughness on an outer surface thereof. 4. An apparatus comprising an electric component capable of generating heat, a heat dissipater component and a heat transfer interface structure, the heat transfer interface structure comprising a substrate having a first surface and a second surface and a plurality of raised features formed on at least one of the first surface and the second surface of the substrate, the raised features being deformable under a compressive force;
wherein some of the raised features have an opening at a respective end portion thereof; wherein a thickness of a raised feature at said end portion is smaller than a thickness of the raised feature at an intermediate portion of the raised feature; and wherein said heat transfer interfaced structure is located between the electric component and the dissipater component. 5. The apparatus of claim 4, wherein one or more raised features each comprise a first height corresponding to a first location on the end portion thereof and a second height corresponding to a second location on the end portion thereof, wherein a height is a distance from a plane defined by the substrate to a parallel plane passing through a location on end portion. 6. The apparatus of claim 4, wherein a raised feature has a wall and the wall comprises roughness on an outer surface thereof. 7. A method, comprising:
placing a deformable sheet of thermally conductive material between two dies each comprising at least one of a projection and a cavity on a respective surface, wherein a projection has a matching shape and dimensions with a cavity; moving a die toward the other such that a projection nests within a corresponding opposite cavity and such that a compressive force is applied to the deformable sheet located between the projection and the cavity to produce a raised feature in the deformable sheet, the raised feature having an opening at a respective end portion thereof; wherein a thickness of a raised feature at said end portion is smaller than a thickness of the raised feature at an intermediate portion of the raised feature. 8. The method of claim 7, comprising:
exerting a force by a projection on the deformable sheet, causing the deformable sheet to undergo a deformation in the proximity of a point of contact between the projection and the deformable sheet; wherein said deformation is produced by causing a material yield in the deformable sheet at said point of contact to cause the thickness of a raised feature at said end portion become smaller than a thickness of the raised feature at an intermediate portion of the raised feature. 9. The method of claim 8, further comprising fracturing the deformable sheet to produce an opening in the end portion of the raised feature. 10. The method of claim 7, wherein the dies have roughness on the respective outer surface thereof, such roughness being configured to transfer unevenness associated to the roughness thereon to a surface of the raised features as the deformable sheet is deformed. | 2,800 |
11,591 | 11,591 | 14,716,658 | 2,853 | Frits for use in analytical instrument systems, including liquid chromatography systems, particularly HPLC and UHPLC systems, and methods of making and using the frits, are provided. The frits can have multiple layers, which may have different surface finishes on different surfaces. | 1. A frit for use in a liquid chromatography system, comprising at least a first layer of a first film and at least a second layer of a second film, wherein the first film and the second film each have a first side having a first finish and a second side having a second finish, and wherein the at least a first layer of the first film and the at least a second layer of the second film are oriented such that the first side of the at least a second layer of the second film is positioned against the second side of the at least a first layer of the first film, and wherein the at least a second layer of the second film defines a channel from the first side of the at least a second layer of the second film to the second side of the at least a second layer of the second film. 2. The frit according to claim 1, wherein the first film and the second film are the same. 3. The frit according to claim 1, wherein at least a portion of the first finish comprises a matte finish. 4. The frit according to claim 3, wherein the matte finish has an Ra value of between about 25 μ-in and about 70 μ-in. 5. The frit according to claim 4, wherein the matte finish has an Ra value of about 45 μ-in. 6. The frit according to claim 3, wherein the matte finish has an Rz value of between about 150 μ-in and about 360 μ-in. 7. The frit according to claim 6, wherein the matte finish has an Rz value of about 270 μ-in. 8. The frit according to claim 3, wherein the matte finish is substantially random or non-uniform. 9. The frit according to claim 3, wherein the matte finish has a lay to it. 10. The frit according to claim 1, wherein at least a portion of the second finish comprises a matte finish. 11. The frit according to claim 10, wherein the matte finish is substantially random or non-uniform. 12. The frit according to claim 10, wherein the matte finish has a lay to it. 13. The frit according to claim 1, wherein at least a portion of the second finish is a gloss finish. 14. The frit according to claim 13, wherein the gloss finish has an Ra value of between about 0.5 μ-in and about 3.0 μ-in. 15. The fit according to claim 14, wherein the gloss finish has an Ra value of about 1.5 μ-in. 16. The frit according to claim 13, wherein the gloss finish has an Rz value of between about 5 μ-in and about 30 μ-in. 17. The frit according to claim 16, wherein the gloss finish has an Rz value of about 12.5 μ-in. 18. The frit according to claim 1, wherein the first film or the second film comprises a biocompatible material. 19. The frit according to claim 18, wherein the first film and the second film comprises a biocompatible material. 20. The frit according to claim 18, wherein the first film or the second film comprises polyetheretherketone. 21. The frit according to claim 1, wherein the first film and the second film have a thickness of between about 25 μm and about 250 μm. 22. The frit according to claim 1, further comprising at least a third layer of a third film having a first side having a first finish and a second side having a second finish, oriented such that the first side of the at least a third layer of the third film is positioned against the second side of the at least a second layer of the second film, and wherein the at least a third layer of the third film defines a channel from the first side of the at least a third layer of the third film to the second side of the at least a third layer of the third film. 23. The frit according to claim 22, wherein the first film, the second film and the third film are the same. 24. The frit according to claim 22, further comprising at least a fourth layer of a fourth film having a first side having a first finish and a second side having a second finish, oriented such that the first side of the at least a fourth layer of the fourth film is positioned against the second side of the at least a third layer of the third film, and wherein the at least a fourth layer of the fourth film defines a channel from the first side of the at least a fourth layer of the fourth film to the second side of the at least a fourth layer of the fourth film. 25. The frit according to claim 24, wherein the first film, the second film, the third film and the fourth film are the same. 26. The frit according to claim 24, further comprising at least a fifth layer of a fifth film having a first side having a first finish and a second side having a second finish, oriented such that the first side of the at least a fifth layer of the fifth film is positioned against the second side of the at least a fourth layer of the fourth film, and wherein the at least a fifth layer of the fifth film defines a channel from the first side of the at least a fifth layer of the fifth film to the second side of the at least a fifth layer of the fifth film. 27. The frit according to claim 26, wherein the first film, the second film, the third film, the fourth film and the fifth film are the same. 28. The frit according to claim 26, further comprising at least a sixth layer of a sixth film having a first side having a first finish and a second side having a second finish, oriented such that the first side of the at least a sixth layer of the sixth film is positioned against the second side of the at least a fifth layer of the fifth film, and wherein the at least a sixth layer of the sixth film defines a channel from the first side of the at least a sixth layer of the sixth film to the second side of the at least a sixth layer of the sixth film. 29. The frit according to claim 28, wherein the first film, the second film, the third film, the fourth film, the fifth film and the sixth film are the same. 30. The frit according to claim 28, further comprising at least a seventh layer of a seventh film having a first side having a first finish and a second side having a second finish, oriented such that the first side of the at least a seventh layer of the seventh film is positioned against the second side of the at least a sixth layer of the sixth film, and wherein the at least a seventh layer of the seventh film defines a channel from the first side of the at least a seventh layer of the seventh film to the second side of the at least a seventh layer of the seventh film. 31. The frit according to claim 30, wherein the first film, the second film, the third film, the fourth film, the fifth film, the sixth film and the seventh film are the same. 32. The frit according to claim 1, wherein the fit has a thickness of between about 0.02 inches and about 0.08 inches. 33. The frit according to claim 1, wherein the first side of the at least a first layer of the first film defines at least a first fluid path. 34. The frit according to claim 1, wherein the at least a first layer of the first film defines a channel from the first side of the at least a first layer of the first film to the second side of the at least a first layer of the first film. 35. The frit according to claim 1, wherein the frit comprises a circular shape. 36. The fit according to claim 1, wherein the frit has an adjustable micron rating. 37. The frit according to claim 1, wherein the frit can be cleaned by decompression during a back flush operation. 38. An analytical instrument system comprising at least one frit comprising at least a first layer of a first film and at least a second layer of a second film, wherein the first film and the second film each have a first side having a first finish and a second side having a second finish, and wherein the at least a first layer of the first film and the at least a second layer of the second film are oriented such that the first side of the at least a second layer of the second film is positioned against the second side of the at least a first layer of the first film, and wherein the at least a second layer of the second film defines a channel from the first side of the at least a second layer of the second film to the second side of the at least a second layer of the second film. 39. The analytical instrument system according to claim 38, wherein the first film and the second film are the same. 40. The analytical instrument system according to claim 38, wherein said analytical instrument system comprises an ultra high pressure or ultra high performance liquid chromatography or ion chromatography system. 41. A method of making a frit for use in a liquid chromatography system, comprising attaching at least a first layer of a first film to at least a second layer of a second film, wherein the first film and the second film each have a first side having a first finish and a second side having a second finish, and wherein the at least a first layer of the first film and the at least a second layer of the second film are oriented such that the first side of the at least a second layer of the second film is positioned against the second side of the at least a first layer of the first film, and providing a channel from the first side of the at least a second layer of the second film to the second side of the at least a second layer of the second film. 42. The method of claim 41, wherein the first film and the second film are the same. 43. The method according to claim 41, wherein the step of attaching the at least a first layer of the first film to the at least a second layer of the film uses laser welding, compression or encapsulation. 44. The method according to claim 41, wherein the step of providing a channel uses drilling, punching, laser cutting, water jet cutting or machining. 45. The method according to claim 41, wherein at least a portion of the first finish comprises a matte finish. 46. The method according to claim 45, wherein the matte finish is substantially random or non-uniform. 47. The method according to claim 46, wherein the substantially random or non-uniform matte finish is produced by a shot peen, bead blast or powder blast process. 48. The method according to claim 45, wherein the matte finish has a lay to it. 49. The method according to claim 48, wherein the matte finish with a lay to it is produced by a grinding process. 50. The method according to claim 41, wherein at least a portion of the second finish comprises a matte finish. 51. The method according to claim 50, wherein the matte finish is substantially random or non-uniform. 52. The method according to claim 51, wherein the substantially random or non-uniform matte finish is produced by a shot peen, bead blast or powder blast process. 53. The method according to claim 50, wherein the matte finish has a lay to it. 54. The method according to claim 53, wherein the matte finish with a lay to it is produced by a grinding process. 55. The method according to claim 41, wherein at least a portion of the second finish comprises a gloss finish. 56. The method according to claim 41, wherein the first side of the at least a first layer of the first film defines at least a first fluid path. 57. The method according to claim 56, wherein the at least a first fluid path is produced by embossing, stamping, forming, molding, machining, or cutting. 58. A frit for use in a liquid chromatography system, comprising a central porous region surrounded by an outer solid region. 59. The frit according to claim 58, wherein the central porous region is shorter than the outer solid region in a direction of fluid flow through the frit. 60. The frit according to claim 59, wherein the central porous region is between about 0.005 inches to about 0.03 inches shorter than the outer solid region in the direction of fluid flow through the frit. 61. The frit according to claim 60, wherein the central porous region is about 0.01 inches shorter than the outer solid region in the direction of fluid flow through the frit. 62. The frit according to claim 58, wherein said frit comprises a biocompatible material. 63. The frit according to claim 62, wherein said frit comprises polyetheretherketone. 64. The frit according to claim 58, wherein said frit has a thickness of between about 0.03 inches and about 0.1 inches. 65. An analytical instrument system comprising at least one frit comprising a central porous region surrounded by an outer solid region. 66. The analytical instrument system according to claim 65, wherein the central porous region is shorter than the outer solid region in a direction of fluid flow through the frit. 67. The analytical instrument system according to claim 65, wherein said analytical instrument system comprises an ultra high pressure or ultra high performance liquid chromatography or ion chromatography system. 68. A method of making a frit for use in a liquid chromatography system, comprising:
a) placing a porous material into a press, wherein a first portion of the press comes into contact with a central portion of the porous material and a second portion of the press comes into contact with an outer portion of the porous material, and wherein the first portion of the press extends further than the second portion of the press; b) operating the press for at least a first time to compress the porous material, resulting in a central portion of the porous material that is shorter than the outer portion of the porous material; c) further pressing the outer portion of the porous material to increase the density of the outer portion of the porous material; and d) heating the outer portion of the porous material to solidify the porous material in the outer portion, thereby creating a fit comprising a porous central portion and a solid outer portion, wherein the porous central region is shorter than the solid outer portion in a direction of fluid flow through the frit. | Frits for use in analytical instrument systems, including liquid chromatography systems, particularly HPLC and UHPLC systems, and methods of making and using the frits, are provided. The frits can have multiple layers, which may have different surface finishes on different surfaces.1. A frit for use in a liquid chromatography system, comprising at least a first layer of a first film and at least a second layer of a second film, wherein the first film and the second film each have a first side having a first finish and a second side having a second finish, and wherein the at least a first layer of the first film and the at least a second layer of the second film are oriented such that the first side of the at least a second layer of the second film is positioned against the second side of the at least a first layer of the first film, and wherein the at least a second layer of the second film defines a channel from the first side of the at least a second layer of the second film to the second side of the at least a second layer of the second film. 2. The frit according to claim 1, wherein the first film and the second film are the same. 3. The frit according to claim 1, wherein at least a portion of the first finish comprises a matte finish. 4. The frit according to claim 3, wherein the matte finish has an Ra value of between about 25 μ-in and about 70 μ-in. 5. The frit according to claim 4, wherein the matte finish has an Ra value of about 45 μ-in. 6. The frit according to claim 3, wherein the matte finish has an Rz value of between about 150 μ-in and about 360 μ-in. 7. The frit according to claim 6, wherein the matte finish has an Rz value of about 270 μ-in. 8. The frit according to claim 3, wherein the matte finish is substantially random or non-uniform. 9. The frit according to claim 3, wherein the matte finish has a lay to it. 10. The frit according to claim 1, wherein at least a portion of the second finish comprises a matte finish. 11. The frit according to claim 10, wherein the matte finish is substantially random or non-uniform. 12. The frit according to claim 10, wherein the matte finish has a lay to it. 13. The frit according to claim 1, wherein at least a portion of the second finish is a gloss finish. 14. The frit according to claim 13, wherein the gloss finish has an Ra value of between about 0.5 μ-in and about 3.0 μ-in. 15. The fit according to claim 14, wherein the gloss finish has an Ra value of about 1.5 μ-in. 16. The frit according to claim 13, wherein the gloss finish has an Rz value of between about 5 μ-in and about 30 μ-in. 17. The frit according to claim 16, wherein the gloss finish has an Rz value of about 12.5 μ-in. 18. The frit according to claim 1, wherein the first film or the second film comprises a biocompatible material. 19. The frit according to claim 18, wherein the first film and the second film comprises a biocompatible material. 20. The frit according to claim 18, wherein the first film or the second film comprises polyetheretherketone. 21. The frit according to claim 1, wherein the first film and the second film have a thickness of between about 25 μm and about 250 μm. 22. The frit according to claim 1, further comprising at least a third layer of a third film having a first side having a first finish and a second side having a second finish, oriented such that the first side of the at least a third layer of the third film is positioned against the second side of the at least a second layer of the second film, and wherein the at least a third layer of the third film defines a channel from the first side of the at least a third layer of the third film to the second side of the at least a third layer of the third film. 23. The frit according to claim 22, wherein the first film, the second film and the third film are the same. 24. The frit according to claim 22, further comprising at least a fourth layer of a fourth film having a first side having a first finish and a second side having a second finish, oriented such that the first side of the at least a fourth layer of the fourth film is positioned against the second side of the at least a third layer of the third film, and wherein the at least a fourth layer of the fourth film defines a channel from the first side of the at least a fourth layer of the fourth film to the second side of the at least a fourth layer of the fourth film. 25. The frit according to claim 24, wherein the first film, the second film, the third film and the fourth film are the same. 26. The frit according to claim 24, further comprising at least a fifth layer of a fifth film having a first side having a first finish and a second side having a second finish, oriented such that the first side of the at least a fifth layer of the fifth film is positioned against the second side of the at least a fourth layer of the fourth film, and wherein the at least a fifth layer of the fifth film defines a channel from the first side of the at least a fifth layer of the fifth film to the second side of the at least a fifth layer of the fifth film. 27. The frit according to claim 26, wherein the first film, the second film, the third film, the fourth film and the fifth film are the same. 28. The frit according to claim 26, further comprising at least a sixth layer of a sixth film having a first side having a first finish and a second side having a second finish, oriented such that the first side of the at least a sixth layer of the sixth film is positioned against the second side of the at least a fifth layer of the fifth film, and wherein the at least a sixth layer of the sixth film defines a channel from the first side of the at least a sixth layer of the sixth film to the second side of the at least a sixth layer of the sixth film. 29. The frit according to claim 28, wherein the first film, the second film, the third film, the fourth film, the fifth film and the sixth film are the same. 30. The frit according to claim 28, further comprising at least a seventh layer of a seventh film having a first side having a first finish and a second side having a second finish, oriented such that the first side of the at least a seventh layer of the seventh film is positioned against the second side of the at least a sixth layer of the sixth film, and wherein the at least a seventh layer of the seventh film defines a channel from the first side of the at least a seventh layer of the seventh film to the second side of the at least a seventh layer of the seventh film. 31. The frit according to claim 30, wherein the first film, the second film, the third film, the fourth film, the fifth film, the sixth film and the seventh film are the same. 32. The frit according to claim 1, wherein the fit has a thickness of between about 0.02 inches and about 0.08 inches. 33. The frit according to claim 1, wherein the first side of the at least a first layer of the first film defines at least a first fluid path. 34. The frit according to claim 1, wherein the at least a first layer of the first film defines a channel from the first side of the at least a first layer of the first film to the second side of the at least a first layer of the first film. 35. The frit according to claim 1, wherein the frit comprises a circular shape. 36. The fit according to claim 1, wherein the frit has an adjustable micron rating. 37. The frit according to claim 1, wherein the frit can be cleaned by decompression during a back flush operation. 38. An analytical instrument system comprising at least one frit comprising at least a first layer of a first film and at least a second layer of a second film, wherein the first film and the second film each have a first side having a first finish and a second side having a second finish, and wherein the at least a first layer of the first film and the at least a second layer of the second film are oriented such that the first side of the at least a second layer of the second film is positioned against the second side of the at least a first layer of the first film, and wherein the at least a second layer of the second film defines a channel from the first side of the at least a second layer of the second film to the second side of the at least a second layer of the second film. 39. The analytical instrument system according to claim 38, wherein the first film and the second film are the same. 40. The analytical instrument system according to claim 38, wherein said analytical instrument system comprises an ultra high pressure or ultra high performance liquid chromatography or ion chromatography system. 41. A method of making a frit for use in a liquid chromatography system, comprising attaching at least a first layer of a first film to at least a second layer of a second film, wherein the first film and the second film each have a first side having a first finish and a second side having a second finish, and wherein the at least a first layer of the first film and the at least a second layer of the second film are oriented such that the first side of the at least a second layer of the second film is positioned against the second side of the at least a first layer of the first film, and providing a channel from the first side of the at least a second layer of the second film to the second side of the at least a second layer of the second film. 42. The method of claim 41, wherein the first film and the second film are the same. 43. The method according to claim 41, wherein the step of attaching the at least a first layer of the first film to the at least a second layer of the film uses laser welding, compression or encapsulation. 44. The method according to claim 41, wherein the step of providing a channel uses drilling, punching, laser cutting, water jet cutting or machining. 45. The method according to claim 41, wherein at least a portion of the first finish comprises a matte finish. 46. The method according to claim 45, wherein the matte finish is substantially random or non-uniform. 47. The method according to claim 46, wherein the substantially random or non-uniform matte finish is produced by a shot peen, bead blast or powder blast process. 48. The method according to claim 45, wherein the matte finish has a lay to it. 49. The method according to claim 48, wherein the matte finish with a lay to it is produced by a grinding process. 50. The method according to claim 41, wherein at least a portion of the second finish comprises a matte finish. 51. The method according to claim 50, wherein the matte finish is substantially random or non-uniform. 52. The method according to claim 51, wherein the substantially random or non-uniform matte finish is produced by a shot peen, bead blast or powder blast process. 53. The method according to claim 50, wherein the matte finish has a lay to it. 54. The method according to claim 53, wherein the matte finish with a lay to it is produced by a grinding process. 55. The method according to claim 41, wherein at least a portion of the second finish comprises a gloss finish. 56. The method according to claim 41, wherein the first side of the at least a first layer of the first film defines at least a first fluid path. 57. The method according to claim 56, wherein the at least a first fluid path is produced by embossing, stamping, forming, molding, machining, or cutting. 58. A frit for use in a liquid chromatography system, comprising a central porous region surrounded by an outer solid region. 59. The frit according to claim 58, wherein the central porous region is shorter than the outer solid region in a direction of fluid flow through the frit. 60. The frit according to claim 59, wherein the central porous region is between about 0.005 inches to about 0.03 inches shorter than the outer solid region in the direction of fluid flow through the frit. 61. The frit according to claim 60, wherein the central porous region is about 0.01 inches shorter than the outer solid region in the direction of fluid flow through the frit. 62. The frit according to claim 58, wherein said frit comprises a biocompatible material. 63. The frit according to claim 62, wherein said frit comprises polyetheretherketone. 64. The frit according to claim 58, wherein said frit has a thickness of between about 0.03 inches and about 0.1 inches. 65. An analytical instrument system comprising at least one frit comprising a central porous region surrounded by an outer solid region. 66. The analytical instrument system according to claim 65, wherein the central porous region is shorter than the outer solid region in a direction of fluid flow through the frit. 67. The analytical instrument system according to claim 65, wherein said analytical instrument system comprises an ultra high pressure or ultra high performance liquid chromatography or ion chromatography system. 68. A method of making a frit for use in a liquid chromatography system, comprising:
a) placing a porous material into a press, wherein a first portion of the press comes into contact with a central portion of the porous material and a second portion of the press comes into contact with an outer portion of the porous material, and wherein the first portion of the press extends further than the second portion of the press; b) operating the press for at least a first time to compress the porous material, resulting in a central portion of the porous material that is shorter than the outer portion of the porous material; c) further pressing the outer portion of the porous material to increase the density of the outer portion of the porous material; and d) heating the outer portion of the porous material to solidify the porous material in the outer portion, thereby creating a fit comprising a porous central portion and a solid outer portion, wherein the porous central region is shorter than the solid outer portion in a direction of fluid flow through the frit. | 2,800 |
11,592 | 11,592 | 14,324,269 | 2,883 | Fiber optic connectors are provided that include a substrate having a groove therein, an optical fiber that is at least partly in the groove, an optical mode field converter or other focusing reflector that is positioned to receive an optical signal that is output from the optical fiber and a housing that surrounds the substrate and the optical fiber. | 1. A fiber optic connector, comprising:
a substrate having a groove therein; an optical fiber that is at least partly in the groove; an optical mode field converter that is positioned to receive an optical signal that is output from the optical fiber; a housing that surrounds the substrate and the optical fiber. 2. The fiber optic connector of claim 1, wherein the optical mode field converter is at least partially within the groove in the substrate. 3. The fiber optic connector of claim 1, wherein at least a portion of the groove has a generally U-shaped cross-section, a generally V-shaped cross-section or a generally semi-circular cross-section. 4. The fiber optic connector of claim 1, wherein the optical mode field converter is configured to expand a first light field output by the optical fiber into a second, larger area light field, and is configured to compress a third light field received at a light field input/output port of the fiber optic connector into a fourth, smaller area light field that is input to the optical fiber. 5. The fiber optic connector of claim 1, wherein the optical mode field converter comprises a concave mirror or a Holographic Bragg Grating reflector. 6. The fiber optic connector of claim 1, wherein the groove extends beyond an end of the optical fiber, and wherein the groove includes a reflective sidewall that is configured to receive light output from the optical fiber or light reflected by the optical mode field converter. 7. The fiber optic connector of claim 1, wherein the optical fiber comprises an optical fiber pigtail. 8. The fiber optic connector of claim 7, in combination with a fiber optic cable that includes a second optical fiber, at least one strength member and a jacket, wherein the optical fiber pigtail is fused to the second optical fiber and the fiber optic connector is mounted on or partially within the fiber optic cable to provide a connectorized fiber optic cable. 9. The fiber optic connector of claim 1, wherein the optical fiber comprises an optical fiber of a fiber optic cable that further includes at least one strength member and a jacket to provide a connectorized fiber optic cable. 10. The fiber optic connector of claim 1, wherein the substrate has a front edge, a rear edge and a pair of side edges, and wherein a first end of the groove is at the rear edge of the substrate and a second end of the groove is at one of the side edges of the substrate. 11. The fiber optic connector of claim 1, wherein the substrate has a front edge, a rear edge and a pair of side edges, and wherein a first end of the groove is at the rear edge of the substrate and a second end of the groove is also at the rear edge of the substrate. 12. The fiber optic connector of claim 1, wherein the groove includes at least one curved or angled section. 13. The fiber optic connector of claim 1, wherein a portion of the optical fiber that is within the groove defines a first longitudinal axis, and wherein a light input/output port of the fiber optic connector is offset from the first longitudinal axis. 14. A fiber optic connection, comprising:
a first fiber optic connector that has a first housing, a first optical fiber that extends from a rear surface of the first housing, and a first light input/output port within a side surface of the first housing; a second fiber optic connector that has a second housing, a second optical fiber that extends from a rear surface of the second housing, and a second light input/output port within a side surface of the second housing; wherein the first and second fiber optic connectors are mounted in a side-by-side fashion and the first and second light input/output ports are in optical communication with each other. 15. The fiber optic connection of claim 14, wherein the first optical fiber and the second optical fiber are positioned side-by-side. 16. The fiber optic connection of claim 14, wherein the first optical fiber is positioned within a first groove in a first substrate that is mounted in the first housing, and the second optical fiber is positioned within a second groove in a second substrate that is mounted in the second housing, 17. The fiber optic connection of claim 16, wherein a first optical mode field converter is positioned to receive an optical signal that is output from the first optical fiber and a second optical mode field converter is positioned to receive the optical signal and inject it into the second optical fiber. 18. The fiber optic connection of claim 17, wherein the first and second optical fibers comprise few-mode optical fibers for the optical signal, and wherein the optical signal passes as a multi-mode optical signal between the first and second optical mode field converters. 19. The fiber optic connection of claim 15, wherein the first optical mode field converter is within the first groove and the second optical mode field converter is within the second groove. 20. The fiber optic connection of claim 15, wherein the first substrate includes silicon and wherein the first optical mode field converter is formed at least partly in a sidewall of the first groove. 21. A fiber optic multiplexer/de-multiplexer, comprising:
a single core optical fiber; a Holographic Bragg Grating reflector that is positioned to directly or indirectly receive an output of the single core optical fiber; and a plurality of optical fiber transmission mediums that are positioned to directly or indirectly receive a plurality of signals output by the Holographic Bragg Grating reflector. 22. The fiber optic multiplexer/de-multiplexer of claim 21, wherein the plurality of optical fiber transmission mediums comprise a plurality of cores of a multi-core optical fiber. 23. The fiber optic multiplexer/de-multiplexer of claim 21, wherein the plurality of optical fiber transmission mediums comprise a plurality of additional single core optical fibers. 24. The fiber optic multiplexer/de-multiplexer of claim 21, wherein the plurality of optical fiber transmission mediums each receive a respective one of a plurality of optical signals that are wave division multiplexed onto the single core optical fiber. | Fiber optic connectors are provided that include a substrate having a groove therein, an optical fiber that is at least partly in the groove, an optical mode field converter or other focusing reflector that is positioned to receive an optical signal that is output from the optical fiber and a housing that surrounds the substrate and the optical fiber.1. A fiber optic connector, comprising:
a substrate having a groove therein; an optical fiber that is at least partly in the groove; an optical mode field converter that is positioned to receive an optical signal that is output from the optical fiber; a housing that surrounds the substrate and the optical fiber. 2. The fiber optic connector of claim 1, wherein the optical mode field converter is at least partially within the groove in the substrate. 3. The fiber optic connector of claim 1, wherein at least a portion of the groove has a generally U-shaped cross-section, a generally V-shaped cross-section or a generally semi-circular cross-section. 4. The fiber optic connector of claim 1, wherein the optical mode field converter is configured to expand a first light field output by the optical fiber into a second, larger area light field, and is configured to compress a third light field received at a light field input/output port of the fiber optic connector into a fourth, smaller area light field that is input to the optical fiber. 5. The fiber optic connector of claim 1, wherein the optical mode field converter comprises a concave mirror or a Holographic Bragg Grating reflector. 6. The fiber optic connector of claim 1, wherein the groove extends beyond an end of the optical fiber, and wherein the groove includes a reflective sidewall that is configured to receive light output from the optical fiber or light reflected by the optical mode field converter. 7. The fiber optic connector of claim 1, wherein the optical fiber comprises an optical fiber pigtail. 8. The fiber optic connector of claim 7, in combination with a fiber optic cable that includes a second optical fiber, at least one strength member and a jacket, wherein the optical fiber pigtail is fused to the second optical fiber and the fiber optic connector is mounted on or partially within the fiber optic cable to provide a connectorized fiber optic cable. 9. The fiber optic connector of claim 1, wherein the optical fiber comprises an optical fiber of a fiber optic cable that further includes at least one strength member and a jacket to provide a connectorized fiber optic cable. 10. The fiber optic connector of claim 1, wherein the substrate has a front edge, a rear edge and a pair of side edges, and wherein a first end of the groove is at the rear edge of the substrate and a second end of the groove is at one of the side edges of the substrate. 11. The fiber optic connector of claim 1, wherein the substrate has a front edge, a rear edge and a pair of side edges, and wherein a first end of the groove is at the rear edge of the substrate and a second end of the groove is also at the rear edge of the substrate. 12. The fiber optic connector of claim 1, wherein the groove includes at least one curved or angled section. 13. The fiber optic connector of claim 1, wherein a portion of the optical fiber that is within the groove defines a first longitudinal axis, and wherein a light input/output port of the fiber optic connector is offset from the first longitudinal axis. 14. A fiber optic connection, comprising:
a first fiber optic connector that has a first housing, a first optical fiber that extends from a rear surface of the first housing, and a first light input/output port within a side surface of the first housing; a second fiber optic connector that has a second housing, a second optical fiber that extends from a rear surface of the second housing, and a second light input/output port within a side surface of the second housing; wherein the first and second fiber optic connectors are mounted in a side-by-side fashion and the first and second light input/output ports are in optical communication with each other. 15. The fiber optic connection of claim 14, wherein the first optical fiber and the second optical fiber are positioned side-by-side. 16. The fiber optic connection of claim 14, wherein the first optical fiber is positioned within a first groove in a first substrate that is mounted in the first housing, and the second optical fiber is positioned within a second groove in a second substrate that is mounted in the second housing, 17. The fiber optic connection of claim 16, wherein a first optical mode field converter is positioned to receive an optical signal that is output from the first optical fiber and a second optical mode field converter is positioned to receive the optical signal and inject it into the second optical fiber. 18. The fiber optic connection of claim 17, wherein the first and second optical fibers comprise few-mode optical fibers for the optical signal, and wherein the optical signal passes as a multi-mode optical signal between the first and second optical mode field converters. 19. The fiber optic connection of claim 15, wherein the first optical mode field converter is within the first groove and the second optical mode field converter is within the second groove. 20. The fiber optic connection of claim 15, wherein the first substrate includes silicon and wherein the first optical mode field converter is formed at least partly in a sidewall of the first groove. 21. A fiber optic multiplexer/de-multiplexer, comprising:
a single core optical fiber; a Holographic Bragg Grating reflector that is positioned to directly or indirectly receive an output of the single core optical fiber; and a plurality of optical fiber transmission mediums that are positioned to directly or indirectly receive a plurality of signals output by the Holographic Bragg Grating reflector. 22. The fiber optic multiplexer/de-multiplexer of claim 21, wherein the plurality of optical fiber transmission mediums comprise a plurality of cores of a multi-core optical fiber. 23. The fiber optic multiplexer/de-multiplexer of claim 21, wherein the plurality of optical fiber transmission mediums comprise a plurality of additional single core optical fibers. 24. The fiber optic multiplexer/de-multiplexer of claim 21, wherein the plurality of optical fiber transmission mediums each receive a respective one of a plurality of optical signals that are wave division multiplexed onto the single core optical fiber. | 2,800 |
11,593 | 11,593 | 14,453,435 | 2,841 | A device can include a processor; memory operatively coupled to the processor; a keyboard housing that includes a keyboard accessible to the processor and an extractable extension; and a display housing that includes a display operatively coupled to the processor and a keyboard housing recess, where, in a compact orientation, the keyboard housing seats in the keyboard housing recess and where, in an extended orientation, the keyboard housing and the extractable extension extend to form a base that supports the display housing at a viewing angle with respect to the base. | 1. A device comprising:
a processor; memory operatively coupled to the processor; a keyboard housing that comprises a keyboard accessible to the processor and an extractable extension; and a display housing that comprises a display operatively coupled to the processor and a keyboard housing recess, wherein, in a compact orientation, the keyboard housing seats in the keyboard housing recess and wherein, in an extended orientation, the keyboard housing and the extractable extension extend to form a base that supports the display housing at a viewing angle with respect to the base. 2. The device of claim 1 comprising a hinge that operatively couples the keyboard housing and the display housing. 3. The device of claim 2 wherein the keyboard housing pivots about the hinge to orient the keyboard housing in a recessed state that corresponds to the compact orientation or a base state that corresponds to the extended orientation. 4. The device of claim 3 wherein the keyboard housing is pivotable about the hinge by a pivot angle greater than 180 degrees. 5. The device of claim 1 wherein, in the extended orientation, the keyboard housing is positioned on a display side of the display housing and wherein the extractable extension is extended away from the keyboard housing and positioned on a non-display side of the display housing. 6. The device of claim 1 wherein the keyboard housing comprises a plurality of extractable extensions. 7. The device of claim 1 wherein the extractable extension comprises a keyboard cover. 8. The device of claim 1 comprising a swivel mechanism that swivels the keyboard housing with respect to the display housing to orient keys of the keyboard. 9. The device of claim 8 wherein, in the compact orientation, the keys of the keyboard are oriented inwardly and wherein, in the extended orientation, the keys of the keyboard are oriented upwardly. 10. The device of claim 1 comprising an intermediate orientation wherein the keyboard housing, with the extractable extension in an unextracted state, is positioned to form an angle with respect to the display housing. 11. The device of claim 1 wherein the keyboard comprises depressible keys. 12. The device of claim 1 wherein the keyboard comprises a touch-sensitive panel. 13. The device of claim 1 wherein the display comprises a touch-sensitive display. 14. The device of claim 1 comprising wireless communication circuitry that at least in part operatively couples the keyboard of the keyboard housing to the processor. 15. A device comprising:
a processor; memory operatively coupled to the processor; a keyboard housing that comprises a keyboard accessible to the processor; and a display housing that comprises a display operatively coupled to the processor and a keyboard housing recess, wherein, in a compact orientation, the keyboard housing seats in the keyboard housing recess and wherein, in an extended orientation, the keyboard housing forms a base, in part on a display side of the display housing and in part on a non-display side of the display housing, that supports the display housing at a viewing angle with respect to the base. 16. The device of claim 15 wherein the display housing comprises a slot that, in the extended orientation, receives the keyboard housing. 17. The device of claim 16 wherein the keyboard housing comprises a channel that seats the keyboard housing with respect to a portion of the display housing that at least in part defines the slot. 18. The device of claim 16 wherein the keyboard housing comprises feet. 19. The device of claim 15 comprising wireless communication circuitry that at least in part operatively couples the keyboard of the keyboard housing to the processor. 20. A device comprising:
a processor; memory operatively coupled to the processor; a keyboard housing that comprises a keyboard and a first keyboard interface; and a display housing that comprises a display operatively coupled to the processor, a second keyboard interface and a keyboard housing recess, wherein, in a compact orientation, the keyboard housing seats in the keyboard housing recess and wherein, in an extended orientation, the keyboard housing forms a base that supports the display housing at a viewing angle with respect to the base and the first keyboard interface electrically contacts the second keyboard interface. | A device can include a processor; memory operatively coupled to the processor; a keyboard housing that includes a keyboard accessible to the processor and an extractable extension; and a display housing that includes a display operatively coupled to the processor and a keyboard housing recess, where, in a compact orientation, the keyboard housing seats in the keyboard housing recess and where, in an extended orientation, the keyboard housing and the extractable extension extend to form a base that supports the display housing at a viewing angle with respect to the base.1. A device comprising:
a processor; memory operatively coupled to the processor; a keyboard housing that comprises a keyboard accessible to the processor and an extractable extension; and a display housing that comprises a display operatively coupled to the processor and a keyboard housing recess, wherein, in a compact orientation, the keyboard housing seats in the keyboard housing recess and wherein, in an extended orientation, the keyboard housing and the extractable extension extend to form a base that supports the display housing at a viewing angle with respect to the base. 2. The device of claim 1 comprising a hinge that operatively couples the keyboard housing and the display housing. 3. The device of claim 2 wherein the keyboard housing pivots about the hinge to orient the keyboard housing in a recessed state that corresponds to the compact orientation or a base state that corresponds to the extended orientation. 4. The device of claim 3 wherein the keyboard housing is pivotable about the hinge by a pivot angle greater than 180 degrees. 5. The device of claim 1 wherein, in the extended orientation, the keyboard housing is positioned on a display side of the display housing and wherein the extractable extension is extended away from the keyboard housing and positioned on a non-display side of the display housing. 6. The device of claim 1 wherein the keyboard housing comprises a plurality of extractable extensions. 7. The device of claim 1 wherein the extractable extension comprises a keyboard cover. 8. The device of claim 1 comprising a swivel mechanism that swivels the keyboard housing with respect to the display housing to orient keys of the keyboard. 9. The device of claim 8 wherein, in the compact orientation, the keys of the keyboard are oriented inwardly and wherein, in the extended orientation, the keys of the keyboard are oriented upwardly. 10. The device of claim 1 comprising an intermediate orientation wherein the keyboard housing, with the extractable extension in an unextracted state, is positioned to form an angle with respect to the display housing. 11. The device of claim 1 wherein the keyboard comprises depressible keys. 12. The device of claim 1 wherein the keyboard comprises a touch-sensitive panel. 13. The device of claim 1 wherein the display comprises a touch-sensitive display. 14. The device of claim 1 comprising wireless communication circuitry that at least in part operatively couples the keyboard of the keyboard housing to the processor. 15. A device comprising:
a processor; memory operatively coupled to the processor; a keyboard housing that comprises a keyboard accessible to the processor; and a display housing that comprises a display operatively coupled to the processor and a keyboard housing recess, wherein, in a compact orientation, the keyboard housing seats in the keyboard housing recess and wherein, in an extended orientation, the keyboard housing forms a base, in part on a display side of the display housing and in part on a non-display side of the display housing, that supports the display housing at a viewing angle with respect to the base. 16. The device of claim 15 wherein the display housing comprises a slot that, in the extended orientation, receives the keyboard housing. 17. The device of claim 16 wherein the keyboard housing comprises a channel that seats the keyboard housing with respect to a portion of the display housing that at least in part defines the slot. 18. The device of claim 16 wherein the keyboard housing comprises feet. 19. The device of claim 15 comprising wireless communication circuitry that at least in part operatively couples the keyboard of the keyboard housing to the processor. 20. A device comprising:
a processor; memory operatively coupled to the processor; a keyboard housing that comprises a keyboard and a first keyboard interface; and a display housing that comprises a display operatively coupled to the processor, a second keyboard interface and a keyboard housing recess, wherein, in a compact orientation, the keyboard housing seats in the keyboard housing recess and wherein, in an extended orientation, the keyboard housing forms a base that supports the display housing at a viewing angle with respect to the base and the first keyboard interface electrically contacts the second keyboard interface. | 2,800 |
11,594 | 11,594 | 15,427,968 | 2,827 | Described is an apparatus, for spin state element device, which comprises: a variable resistive magnetic (VRM) device to receive a magnetic control signal to adjust resistance of the VRM device; and a magnetic logic gating (MLG) device, coupled to the VRM device, to receive a magnetic logic input and perform logic operation on the magnetic logic input and to drive an output magnetic signal based on the resistance of the VRM device. Described is a magnetic de-multiplexer which comprises: a first VRM device to receive a magnetic control signal to adjust resistance of the first VRM; a second VRM device to receive the magnetic control signal to adjust resistance of the second VRM device; and an MLG device, coupled to the first and second VRM devices, the MLG device having at least two output magnets to output magnetic signals based on the resistances of the first and second VRM devices. | 1. An apparatus comprising:
an input magnet; an output magnet; a channel coupled to the input and output magnets; and a magnetic junction having a free magnetic layer coupled to the input and the output magnet. 2. The apparatus of claim 1, wherein the input and output magnets have free magnetizations. 3. The apparatus of claim 1, wherein the magnetic junction is a spin valve. 4. The apparatus of claim 1, wherein a magnetic control node is coupled to the free magnetic layer of the magnetic junction. 5. The apparatus of claim 4, wherein the magnetic control node is to provide a spin current. 6. The apparatus of claim 1 comprises a layer coupled to the free magnetic layer of the magnetic junction and the input and output magnets. 7. The apparatus of claim 6, wherein the layer is a spin-scramble layer that makes electron current from the free magnetic layer of the magnetic junction polarized. 8. The apparatus of claim 7, wherein the layer includes one of ruthenium or thallium. 9. The apparatus of claim 1, wherein a portion of the channel is coupled to ground. 10. The apparatus of claim 1, wherein the magnetic junction comprise a fixed magnetic layer coupled to a power supply node. 11. The apparatus of claim 10 comprises a layer which includes one of: Pt or Mn, wherein the layer is adjacent to the fixed magnetic layer. 12. The apparatus of claim 10, wherein the fixed magnetic layer includes one of: Co, Fe, or B. 13. The apparatus of claim 10 comprises a metal layer coupled between the fixed magnetic layer and the free magnetic layer. 14. The apparatus of claim 13, wherein the metal layer includes Cu. 15. The apparatus of claim 1 comprises:
a first contact layer positioned between the input magnet and the free magnetic layer; and
a second contact layer positioned between the output magnet and the free magnetic layer. 16. A method comprising:
forming an input magnet; forming an output magnet; forming a channel coupled to the input and output magnets; and forming a magnetic junction having a free magnetic layer coupled to the input and the output magnet. 17. The method of claim 16, wherein the input and output magnets have free magnetizations, wherein the magnetic junction is a spin valve. 18. The method of claim 16 coupling a magnetic control node the free magnetic layer of the magnetic junction, wherein the magnetic control node is to provide a spin current. 19. The method of claim 16 comprises forming a layer coupled to the free magnetic layer of the magnetic junction and the input and output magnets, wherein the layer is a spin-scramble layer that makes electron current from the free magnetic layer of the magnetic junction polarized, and wherein the layer includes one of ruthenium or thallium. 20. A system comprising:
a memory; a processor coupled to the memory, the processor including:
a magnetic state logic;
a magnetic state register coupled to the a magnetic state logic; and
magnetic output logic coupled to the magnetic state register, wherein one of the magnetic state logic, magnetic state register, or magnetic output logic includes: an input magnet; an output magnet; a channel coupled to the input and output magnets; and a magnetic junction having a free magnetic layer coupled to the input and the output magnet; and a wireless interface for allowing the processor to communicate with another device. 21. The system of claim 22, wherein the magnetic state logic is a magnetic D-flip-flip. | Described is an apparatus, for spin state element device, which comprises: a variable resistive magnetic (VRM) device to receive a magnetic control signal to adjust resistance of the VRM device; and a magnetic logic gating (MLG) device, coupled to the VRM device, to receive a magnetic logic input and perform logic operation on the magnetic logic input and to drive an output magnetic signal based on the resistance of the VRM device. Described is a magnetic de-multiplexer which comprises: a first VRM device to receive a magnetic control signal to adjust resistance of the first VRM; a second VRM device to receive the magnetic control signal to adjust resistance of the second VRM device; and an MLG device, coupled to the first and second VRM devices, the MLG device having at least two output magnets to output magnetic signals based on the resistances of the first and second VRM devices.1. An apparatus comprising:
an input magnet; an output magnet; a channel coupled to the input and output magnets; and a magnetic junction having a free magnetic layer coupled to the input and the output magnet. 2. The apparatus of claim 1, wherein the input and output magnets have free magnetizations. 3. The apparatus of claim 1, wherein the magnetic junction is a spin valve. 4. The apparatus of claim 1, wherein a magnetic control node is coupled to the free magnetic layer of the magnetic junction. 5. The apparatus of claim 4, wherein the magnetic control node is to provide a spin current. 6. The apparatus of claim 1 comprises a layer coupled to the free magnetic layer of the magnetic junction and the input and output magnets. 7. The apparatus of claim 6, wherein the layer is a spin-scramble layer that makes electron current from the free magnetic layer of the magnetic junction polarized. 8. The apparatus of claim 7, wherein the layer includes one of ruthenium or thallium. 9. The apparatus of claim 1, wherein a portion of the channel is coupled to ground. 10. The apparatus of claim 1, wherein the magnetic junction comprise a fixed magnetic layer coupled to a power supply node. 11. The apparatus of claim 10 comprises a layer which includes one of: Pt or Mn, wherein the layer is adjacent to the fixed magnetic layer. 12. The apparatus of claim 10, wherein the fixed magnetic layer includes one of: Co, Fe, or B. 13. The apparatus of claim 10 comprises a metal layer coupled between the fixed magnetic layer and the free magnetic layer. 14. The apparatus of claim 13, wherein the metal layer includes Cu. 15. The apparatus of claim 1 comprises:
a first contact layer positioned between the input magnet and the free magnetic layer; and
a second contact layer positioned between the output magnet and the free magnetic layer. 16. A method comprising:
forming an input magnet; forming an output magnet; forming a channel coupled to the input and output magnets; and forming a magnetic junction having a free magnetic layer coupled to the input and the output magnet. 17. The method of claim 16, wherein the input and output magnets have free magnetizations, wherein the magnetic junction is a spin valve. 18. The method of claim 16 coupling a magnetic control node the free magnetic layer of the magnetic junction, wherein the magnetic control node is to provide a spin current. 19. The method of claim 16 comprises forming a layer coupled to the free magnetic layer of the magnetic junction and the input and output magnets, wherein the layer is a spin-scramble layer that makes electron current from the free magnetic layer of the magnetic junction polarized, and wherein the layer includes one of ruthenium or thallium. 20. A system comprising:
a memory; a processor coupled to the memory, the processor including:
a magnetic state logic;
a magnetic state register coupled to the a magnetic state logic; and
magnetic output logic coupled to the magnetic state register, wherein one of the magnetic state logic, magnetic state register, or magnetic output logic includes: an input magnet; an output magnet; a channel coupled to the input and output magnets; and a magnetic junction having a free magnetic layer coupled to the input and the output magnet; and a wireless interface for allowing the processor to communicate with another device. 21. The system of claim 22, wherein the magnetic state logic is a magnetic D-flip-flip. | 2,800 |
11,595 | 11,595 | 14,781,423 | 2,857 | Apparatus and techniques are described, such as for obtaining information indicative of a formation resistivity near a casing, such as using an array laterolog apparatus. For example, raw measurements received from a well tool in a borehole near a casing may indicate a resistivity of a geologic formation through which the borehole extends. Any errors or interference in the raw measurements caused by the proximity of the well tool to the casing may be removed to eliminate the casing effect on the raw measurements. In some examples, a signal and formation libraries that include casing specific parameters may be used in conjunction with non-casing optimized signal and formation libraries to perform correction mapping of raw measurements. The corrections and their application to the raw measurements may be based on the position of a well logging tool with respect to a casing termination point. | 1. A method for obtaining information indicative of a formation resistivity, comprising:
positioning a well logging tool within a borehole in a subterranean geologic formation; inducing at least one of a voltage and a current in the formation using the well logging tool; receiving a raw measurement at the well logging tool corresponding to the at least one induced voltage and current; calculating a casing-corrected measurement using the received raw measurement; and wherein calculating the casing-corrected measurement includes removing a casing interference from the raw measurement. 2. The method of claim 1, comprising:
determining a location of a casing termination point with respect to the well logging tool in the borehole; wherein calculating the casing-corrected measurement comprises obtaining the casing-corrected measurement based at least in part on the location of the casing termination point with respect to the well logging tool; and processing casing-corrected measurement to obtain a casing-corrected processed measurement. 3. The method of claim 2, where obtaining the corrected raw measurements comprising:
applying a signal library of modeled measurements to the raw measurement, the signal library of modeled measurements corresponding to formation and casing parameters including formation resistivity and at least one of location of the well logging tool in the borehole with respect to the casing termination point, casing diameter, borehole diameter, mud resistivity, formation resistivity anisotropy, formation radial resistivity profile. 4. The method of claim 1, wherein obtaining the corrected processed measurement comprises:
selecting optimized processing parameters based at least in part on a position of the well logging tool within the borehole; and processing the raw measurement to obtain a corrected processed measurement using the optimized processing parameters. 5. The method of claim 4, wherein selecting optimized processing parameters comprises selecting a window defining a range of depths with respect to the casing termination point in the borehole based on the determination of the location of the well logging tool with respect to a casing termination point in the borehole. 6. The method of claim 5, comprising:
optimizing the window with respect to the center of the well logging tool. 7. The method of claim 6, wherein optimizing the window with respect to the center of the well logging tool includes maximizing the length of the window such that the casing termination point is not included in the window. 8. The method of claim 2, wherein obtaining the casing-corrected processed measurement comprises:
processing the raw measurement to obtain a processed measurement; and correcting the processed measurement to obtain the casing-corrected processed measurement. 9. The method of claim 3, wherein obtaining a corrected processed measurement comprises applying a signal library of modeled processed measurements, the signal library of modeled processed measurements including formation resistivity and at least one of location of the well logging tool in the borehole with respect to the casing termination point, casing diameter, borehole diameter, mud resistivity, formation resistivity anisotropy, formation radial resistivity profile. 10. The method of claim 1, comprising:
determining a resistivity of the formation at locations above the casing termination point using information about the electrical excitation, and the raw measurement. 11. The method of claim 1, comprising:
determining a resistivity of the formation at locations below the casing termination point using information about the electrical excitation, and the raw measurement. 12. The method of claim 1, wherein determining the location of the well logging tool with respect to the casing termination point includes determining a relative position of the well logging tool with respect to the casing based at least in part on a depth of the well logging tool. 13. The method of claim 1, wherein the well logging tool is part of a bottom-hole assembly that includes resistivity logging tools, or a through bit logging assembly. 14. The method of claim 1, wherein the well logging tool is part of a wireline tool string. 15. The method of claim 1, wherein the well logging tool is an induction tool. 16. The method of claim 1, wherein the well logging tool is a galvanic tool. 17. The method of claim 1, wherein raw measurement correction is performed during a logging operation. 18. The method of claim 1, further comprising storing the raw measurement from the monitor electrodes obtained at a plurality of positions proximate to the casing termination point of the borehole in a reading log. 19. A non-transitory processor-readable medium including instructions that, when executed by one or more processors, cause one or more processors to:
determine a location of a casing termination point with respect to a well logging tool positioned in a subterranean geologic formation; induce at least one of a voltage and a current in the formation using the well logging tool; receive a raw measurement at the well logging tool corresponding to the at least one induced voltage and current; and calculate a casing-corrected measurement using the received raw measurement that removes a casing interference from the raw measurement. 20. The non-transitory processor-readable medium of claim 19, the instructions to obtain a corrected processed measurement comprise instructions to:
process the raw measurement to obtain a processed measurement; and correct the processed measurement to obtain the casing-corrected processed measurement. 21. The non-transitory processor-readable medium of claim 19, further comprise instructions to:
determine a resistivity of the formation at locations above the casing termination point using information about the electrical excitation, and the raw measurement. 22. The non-transitory processor-readable medium of claim 19, further comprise instructions to:
determine a resistivity of the formation at locations below the casing termination point using information about the electrical excitation, and the raw measurement. 23. A method for correcting a formation conductivity measurement comprising:
determining a location of a casing termination point with respect to a raw measurement resulting from the excitation using monitor electrodes the well logging tool in the borehole, the raw measurement received in response to an electrical excitation from a well logging tool in a borehole to a geologic formation through which the borehole extends; and obtaining a corrected processed measurement to remove a casing interference reflected in the raw measurement based at least in part on the location of the casing termination point with respect to the well logging tool. 24. The method of claim 23, comprising:
determining a resistivity of the formation at locations above the casing termination point using information about the electrical excitation, and the raw measurement. 25. The method of claim 23, comprising:
determining a resistivity of the formation at locations below the casing termination point using information about the electrical excitation, and the raw measurement. 26. The method of claim 23, comprising:
applying a signal library of modeled raw measurements to the raw measurement, the signal library of modeled raw measurements corresponding to formation and casing parameters comprising location of the well logging tool in the borehole with respect to the casing termination point and formation resistivity. 27. The method of claim 23, comprising:
selecting a window defining a range of depths with respect to the casing termination point in the borehole based on the determination of the location of the well logging tool with respect to a casing termination point in the borehole; and optimizing the window with respect to the center of the well logging tool includes maximizing the length of the window such that the casing termination point is not included in the window. 28. An apparatus, comprising:
a well logging tool body; an array of electrodes located on the well logging tool body, the array of electrodes including:
respective excitation electrodes and respective monitor electrodes, coupled from a borehole to a geologic formation through which the borehole extends when the tool body is located within the borehole; and
a processor circuit coupled to the excitation electrodes using an excitation circuit, and coupled to the monitor electrodes using a measurement circuit, the processor circuit programmed to:
control the excitation circuit to generate an electrical excitation from the well logging tool coupled to the geologic formation through excitation electrodes on the well logging tool;
control the measurement circuit to receive from the geologic formation induced voltages resulting from the excitation using monitor electrodes; and
correct the induced voltages to remove a casing interference created in the induced voltages based at least in part on the location of the well logging tool body with respect to a casing end point. 29. The apparatus of claim 28, wherein the well logging tool body is part of a wireline tool string. 30. The apparatus of claim 28, wherein the well logging tool body is an induction tool. 31. The apparatus of claim 28, wherein the well logging tool body is a galvanic tool. 32. A processor-readable medium including instructions that, when performed by a processor circuit, cause the processor circuit to:
position a well logging tool within a borehole in a subterranean geologic formation; induce at least one of a voltage and a current in the formation using the well logging tool; receive a raw measurement at the well logging tool corresponding to the at least one induced voltage and current; calculate a casing-corrected measurement using the received raw measurement; and wherein to calculate the casing-corrected measurement includes removing a casing interference from the raw measurement. 33. A processor-readable medium including instructions that, when performed by a processor circuit, cause the processor circuit to:
determine a location of a casing termination point with respect to a raw measurement resulting from the excitation using monitor electrodes the well logging tool in the borehole, the raw measurement received in response to an electrical excitation from a well logging tool in a borehole to a geologic formation through which the borehole extends; and obtain a corrected processed measurement to remove a casing interference reflected in the raw measurement based at least in part on the location of the casing termination point with respect to the well logging tool. | Apparatus and techniques are described, such as for obtaining information indicative of a formation resistivity near a casing, such as using an array laterolog apparatus. For example, raw measurements received from a well tool in a borehole near a casing may indicate a resistivity of a geologic formation through which the borehole extends. Any errors or interference in the raw measurements caused by the proximity of the well tool to the casing may be removed to eliminate the casing effect on the raw measurements. In some examples, a signal and formation libraries that include casing specific parameters may be used in conjunction with non-casing optimized signal and formation libraries to perform correction mapping of raw measurements. The corrections and their application to the raw measurements may be based on the position of a well logging tool with respect to a casing termination point.1. A method for obtaining information indicative of a formation resistivity, comprising:
positioning a well logging tool within a borehole in a subterranean geologic formation; inducing at least one of a voltage and a current in the formation using the well logging tool; receiving a raw measurement at the well logging tool corresponding to the at least one induced voltage and current; calculating a casing-corrected measurement using the received raw measurement; and wherein calculating the casing-corrected measurement includes removing a casing interference from the raw measurement. 2. The method of claim 1, comprising:
determining a location of a casing termination point with respect to the well logging tool in the borehole; wherein calculating the casing-corrected measurement comprises obtaining the casing-corrected measurement based at least in part on the location of the casing termination point with respect to the well logging tool; and processing casing-corrected measurement to obtain a casing-corrected processed measurement. 3. The method of claim 2, where obtaining the corrected raw measurements comprising:
applying a signal library of modeled measurements to the raw measurement, the signal library of modeled measurements corresponding to formation and casing parameters including formation resistivity and at least one of location of the well logging tool in the borehole with respect to the casing termination point, casing diameter, borehole diameter, mud resistivity, formation resistivity anisotropy, formation radial resistivity profile. 4. The method of claim 1, wherein obtaining the corrected processed measurement comprises:
selecting optimized processing parameters based at least in part on a position of the well logging tool within the borehole; and processing the raw measurement to obtain a corrected processed measurement using the optimized processing parameters. 5. The method of claim 4, wherein selecting optimized processing parameters comprises selecting a window defining a range of depths with respect to the casing termination point in the borehole based on the determination of the location of the well logging tool with respect to a casing termination point in the borehole. 6. The method of claim 5, comprising:
optimizing the window with respect to the center of the well logging tool. 7. The method of claim 6, wherein optimizing the window with respect to the center of the well logging tool includes maximizing the length of the window such that the casing termination point is not included in the window. 8. The method of claim 2, wherein obtaining the casing-corrected processed measurement comprises:
processing the raw measurement to obtain a processed measurement; and correcting the processed measurement to obtain the casing-corrected processed measurement. 9. The method of claim 3, wherein obtaining a corrected processed measurement comprises applying a signal library of modeled processed measurements, the signal library of modeled processed measurements including formation resistivity and at least one of location of the well logging tool in the borehole with respect to the casing termination point, casing diameter, borehole diameter, mud resistivity, formation resistivity anisotropy, formation radial resistivity profile. 10. The method of claim 1, comprising:
determining a resistivity of the formation at locations above the casing termination point using information about the electrical excitation, and the raw measurement. 11. The method of claim 1, comprising:
determining a resistivity of the formation at locations below the casing termination point using information about the electrical excitation, and the raw measurement. 12. The method of claim 1, wherein determining the location of the well logging tool with respect to the casing termination point includes determining a relative position of the well logging tool with respect to the casing based at least in part on a depth of the well logging tool. 13. The method of claim 1, wherein the well logging tool is part of a bottom-hole assembly that includes resistivity logging tools, or a through bit logging assembly. 14. The method of claim 1, wherein the well logging tool is part of a wireline tool string. 15. The method of claim 1, wherein the well logging tool is an induction tool. 16. The method of claim 1, wherein the well logging tool is a galvanic tool. 17. The method of claim 1, wherein raw measurement correction is performed during a logging operation. 18. The method of claim 1, further comprising storing the raw measurement from the monitor electrodes obtained at a plurality of positions proximate to the casing termination point of the borehole in a reading log. 19. A non-transitory processor-readable medium including instructions that, when executed by one or more processors, cause one or more processors to:
determine a location of a casing termination point with respect to a well logging tool positioned in a subterranean geologic formation; induce at least one of a voltage and a current in the formation using the well logging tool; receive a raw measurement at the well logging tool corresponding to the at least one induced voltage and current; and calculate a casing-corrected measurement using the received raw measurement that removes a casing interference from the raw measurement. 20. The non-transitory processor-readable medium of claim 19, the instructions to obtain a corrected processed measurement comprise instructions to:
process the raw measurement to obtain a processed measurement; and correct the processed measurement to obtain the casing-corrected processed measurement. 21. The non-transitory processor-readable medium of claim 19, further comprise instructions to:
determine a resistivity of the formation at locations above the casing termination point using information about the electrical excitation, and the raw measurement. 22. The non-transitory processor-readable medium of claim 19, further comprise instructions to:
determine a resistivity of the formation at locations below the casing termination point using information about the electrical excitation, and the raw measurement. 23. A method for correcting a formation conductivity measurement comprising:
determining a location of a casing termination point with respect to a raw measurement resulting from the excitation using monitor electrodes the well logging tool in the borehole, the raw measurement received in response to an electrical excitation from a well logging tool in a borehole to a geologic formation through which the borehole extends; and obtaining a corrected processed measurement to remove a casing interference reflected in the raw measurement based at least in part on the location of the casing termination point with respect to the well logging tool. 24. The method of claim 23, comprising:
determining a resistivity of the formation at locations above the casing termination point using information about the electrical excitation, and the raw measurement. 25. The method of claim 23, comprising:
determining a resistivity of the formation at locations below the casing termination point using information about the electrical excitation, and the raw measurement. 26. The method of claim 23, comprising:
applying a signal library of modeled raw measurements to the raw measurement, the signal library of modeled raw measurements corresponding to formation and casing parameters comprising location of the well logging tool in the borehole with respect to the casing termination point and formation resistivity. 27. The method of claim 23, comprising:
selecting a window defining a range of depths with respect to the casing termination point in the borehole based on the determination of the location of the well logging tool with respect to a casing termination point in the borehole; and optimizing the window with respect to the center of the well logging tool includes maximizing the length of the window such that the casing termination point is not included in the window. 28. An apparatus, comprising:
a well logging tool body; an array of electrodes located on the well logging tool body, the array of electrodes including:
respective excitation electrodes and respective monitor electrodes, coupled from a borehole to a geologic formation through which the borehole extends when the tool body is located within the borehole; and
a processor circuit coupled to the excitation electrodes using an excitation circuit, and coupled to the monitor electrodes using a measurement circuit, the processor circuit programmed to:
control the excitation circuit to generate an electrical excitation from the well logging tool coupled to the geologic formation through excitation electrodes on the well logging tool;
control the measurement circuit to receive from the geologic formation induced voltages resulting from the excitation using monitor electrodes; and
correct the induced voltages to remove a casing interference created in the induced voltages based at least in part on the location of the well logging tool body with respect to a casing end point. 29. The apparatus of claim 28, wherein the well logging tool body is part of a wireline tool string. 30. The apparatus of claim 28, wherein the well logging tool body is an induction tool. 31. The apparatus of claim 28, wherein the well logging tool body is a galvanic tool. 32. A processor-readable medium including instructions that, when performed by a processor circuit, cause the processor circuit to:
position a well logging tool within a borehole in a subterranean geologic formation; induce at least one of a voltage and a current in the formation using the well logging tool; receive a raw measurement at the well logging tool corresponding to the at least one induced voltage and current; calculate a casing-corrected measurement using the received raw measurement; and wherein to calculate the casing-corrected measurement includes removing a casing interference from the raw measurement. 33. A processor-readable medium including instructions that, when performed by a processor circuit, cause the processor circuit to:
determine a location of a casing termination point with respect to a raw measurement resulting from the excitation using monitor electrodes the well logging tool in the borehole, the raw measurement received in response to an electrical excitation from a well logging tool in a borehole to a geologic formation through which the borehole extends; and obtain a corrected processed measurement to remove a casing interference reflected in the raw measurement based at least in part on the location of the casing termination point with respect to the well logging tool. | 2,800 |
11,596 | 11,596 | 15,091,089 | 2,822 | A higher-current device is implemented by increasing cross-sectional areas of terminals while securing solderability during mounting. The device makes securing of a creepage distance between terminals compatible with a reduction in package size. A semiconductor device 1 is provided with a package 2 , a semiconductor circuit 3 , a control circuit 6 , a plurality of main terminals 7 and control terminals 8 . Each main terminal 7 is configured of a plurality of subterminals S 1 , S 2 and S 3 arranged at mutually neighboring positions and projecting from the package 2 . Distal end portions of the subterminals S 1 , S 2 and S 3 making up the same main terminal 7 are bent toward a mounting surface on which the semiconductor device 1 is mounted and the bending positions of the subterminals S 1 , S 2 and S 3 are configured to differ between the mutually neighboring subterminals S 1 and S 2 , and subterminals S 2 and S 3. | 1. A semiconductor device comprising:
a package making up a contour; a semiconductor circuit that is accommodated in the package and controls a main current according to a control signal from outside; a control terminal that projects from the package and inputs a control signal to the semiconductor circuit; and a plurality of main terminals that are terminals that carry a main current to the semiconductor circuit and have different functions for the semiconductor circuit, wherein at least one main terminal of the main terminals are configured of a plurality of subterminals projecting from the package at mutually neighboring positions, and distal end portions of the subterminals making up the same main terminal are bent toward a mounting surface on which the semiconductor device is mounted and bending positions of the subterminals are caused to differ between the mutually neighboring subterminals. 2. The semiconductor device according to claim 1, wherein an interval size between two mutually neighboring subterminals making up the same main terminal is set to be smaller than an interval size between two mutually neighboring main terminals. 3. The semiconductor device according to claim 1,
wherein the main terminal comprises a base portion that projects from the package, and the plurality of subterminals making up the main terminal project from the base portion. 4. The semiconductor device according to claim 1, wherein the semiconductor circuit is a multi-phase inverter circuit with at least three or more phases. 5. The semiconductor device according to claim 1, wherein at least part of the semiconductor circuit is configured of a wide band gap semiconductor of any one of silicon carbide (SiC), nitride gallium (GaN) and diamond. | A higher-current device is implemented by increasing cross-sectional areas of terminals while securing solderability during mounting. The device makes securing of a creepage distance between terminals compatible with a reduction in package size. A semiconductor device 1 is provided with a package 2 , a semiconductor circuit 3 , a control circuit 6 , a plurality of main terminals 7 and control terminals 8 . Each main terminal 7 is configured of a plurality of subterminals S 1 , S 2 and S 3 arranged at mutually neighboring positions and projecting from the package 2 . Distal end portions of the subterminals S 1 , S 2 and S 3 making up the same main terminal 7 are bent toward a mounting surface on which the semiconductor device 1 is mounted and the bending positions of the subterminals S 1 , S 2 and S 3 are configured to differ between the mutually neighboring subterminals S 1 and S 2 , and subterminals S 2 and S 3.1. A semiconductor device comprising:
a package making up a contour; a semiconductor circuit that is accommodated in the package and controls a main current according to a control signal from outside; a control terminal that projects from the package and inputs a control signal to the semiconductor circuit; and a plurality of main terminals that are terminals that carry a main current to the semiconductor circuit and have different functions for the semiconductor circuit, wherein at least one main terminal of the main terminals are configured of a plurality of subterminals projecting from the package at mutually neighboring positions, and distal end portions of the subterminals making up the same main terminal are bent toward a mounting surface on which the semiconductor device is mounted and bending positions of the subterminals are caused to differ between the mutually neighboring subterminals. 2. The semiconductor device according to claim 1, wherein an interval size between two mutually neighboring subterminals making up the same main terminal is set to be smaller than an interval size between two mutually neighboring main terminals. 3. The semiconductor device according to claim 1,
wherein the main terminal comprises a base portion that projects from the package, and the plurality of subterminals making up the main terminal project from the base portion. 4. The semiconductor device according to claim 1, wherein the semiconductor circuit is a multi-phase inverter circuit with at least three or more phases. 5. The semiconductor device according to claim 1, wherein at least part of the semiconductor circuit is configured of a wide band gap semiconductor of any one of silicon carbide (SiC), nitride gallium (GaN) and diamond. | 2,800 |
11,597 | 11,597 | 14,611,298 | 2,884 | An auto-positioning apparatus for an x-ray imaging system has a transport apparatus that is configured to position an x-ray source relative to a detector. A processor is configured to receive exam data that indicates an exam type and patient data that is indicative of patient height. The processor determines the present position of the first transport apparatus and determines an imaging position according to the exam data and patient data. The processor provides a positioning signal to the transport apparatus to move the x-ray source to the imaging position. | 1. An auto-positioning apparatus for an x-ray imaging system, the auto-positioning apparatus comprising:
a first transport apparatus configured to automatically move and position an x-ray source relative to a detector; and a processor communicatively coupled to the first transport apparatus, the processor programmed to:
retrieve electronically stored data identifying an exam type;
retrieve electronically stored patient data including data identifying a height of a patient to be imaged;
determine a current position of the x-ray source and determine a source imaging position according to the retrieved data identifying the exam type and the patient data; and
provide a first positioning signal to the first transport apparatus to move the x-ray source from its current position to the source imaging position. 2. The apparatus of claim 1, further comprising a second transport apparatus configured to automatically move and position the detector,
wherein the processor is communicatively coupled to the second transport apparatus, and wherein the processor is further programmed to:
determine a current position of the detector and determine a detector imaging position according to the retrieved data identifying the exam type and the patient data; and
provide a second positioning signal to the second transport apparatus to move the detector from its current position to the detector imaging position. 3. The apparatus of claim 2, wherein the second transport apparatus is further configured to position a bucky device. 4. The apparatus of claim 1, further comprising an operator interface configured to receive entry of the patient data. 5. The apparatus of claim 4, wherein the operator interface is further configured to receive entry of default height data representing a patient population to be imaged by the imaging system. 6. The apparatus of claim 1, wherein the first positioning signal identifies both a three dimensional spatial translation and an angle. 7. The apparatus of claim 1, wherein the source imaging position includes a height position of the x-ray source, and wherein the first transport apparatus further comprises a telescoping arm coupled to the x-ray source for moving the x-ray source to the height position. 8. The apparatus of claim 1, wherein the first transport apparatus is further configured to automatically move and position the detector. 9. The apparatus of claim 1, wherein the processor is further programmed to automatically electronically store data identifying a new position of the x-ray source corresponding to one or more manual adjustments to the position of the x-ray source made by an operator of the apparatus. 10. The apparatus of claim 1, wherein the processor is further programmed to retrieve electronically stored position data to determine the source imaging position. 11. The apparatus of claim 2, wherein the processor is further programmed to retrieve electronically stored position data to determine the source imaging position, the detector imaging position, or a combination thereof. 12. A machine implemented method for acquiring an x-ray of a patient, the method comprising:
obtaining an electronic instruction that identifies an exam type from a set of electronically stored exam types; obtaining an electronically stored height value representing a patient population; determining source spatial coordinates to position an x-ray source according to the identified exam type and the obtained height value; providing a first signal to a first actuator to automatically move and position the x-ray source according to the determined source spatial coordinates; and displaying the x-ray image acquired with the x-ray source positioned at the determined source spatial coordinates. 13. The method of claim 12, further comprising:
determining detector spatial coordinates to position an x-ray detector according to the identified exam type and the obtained height value; and providing a second signal to a second actuator to automatically move and position the x-ray detector according to the determined detector spatial coordinates. 14. The method of claim 12, wherein automatically positioning the x-ray source comprises homing the x-ray source at a reference home position. 15. The method of claim 12, further comprising recording an operator adjustment to the determined spatial coordinates in an electronic memory. 16. The method of claim 12, further comprising recording spatial positions of one or more physical obstacles that may block movement of the x-ray source. 17. The method of claim 16, wherein determining spatial coordinates further comprises determining coordinates for moving the x-ray source to avoid the one or more physical obstacles. 18. The method of claim 12, wherein determining spatial coordinates further comprises scaling the spatial coordinates according to an age of the patient. 19. A method for positioning an x-ray source, the method comprising:
obtaining data that identifies one exam type from a plurality of available exam types; obtaining a height value associated with a patient to be imaged by the x-ray source; determining spatial coordinates associated with an imaging position of the x-ray source according to the identified exam type and obtained height value; providing a signal to an actuator configured to interpret the signal and move the x-ray source to the imaging position; storing adjusted spatial coordinates obtained from an operator adjustment to the imaging position; and displaying an x-ray image of the patient acquired with the x-ray source positioned at the adjusted spatial coordinates. 20. The method of claim 19, further comprising electronically storing the adjusted spatial coordinates in association with data identifying the patient. | An auto-positioning apparatus for an x-ray imaging system has a transport apparatus that is configured to position an x-ray source relative to a detector. A processor is configured to receive exam data that indicates an exam type and patient data that is indicative of patient height. The processor determines the present position of the first transport apparatus and determines an imaging position according to the exam data and patient data. The processor provides a positioning signal to the transport apparatus to move the x-ray source to the imaging position.1. An auto-positioning apparatus for an x-ray imaging system, the auto-positioning apparatus comprising:
a first transport apparatus configured to automatically move and position an x-ray source relative to a detector; and a processor communicatively coupled to the first transport apparatus, the processor programmed to:
retrieve electronically stored data identifying an exam type;
retrieve electronically stored patient data including data identifying a height of a patient to be imaged;
determine a current position of the x-ray source and determine a source imaging position according to the retrieved data identifying the exam type and the patient data; and
provide a first positioning signal to the first transport apparatus to move the x-ray source from its current position to the source imaging position. 2. The apparatus of claim 1, further comprising a second transport apparatus configured to automatically move and position the detector,
wherein the processor is communicatively coupled to the second transport apparatus, and wherein the processor is further programmed to:
determine a current position of the detector and determine a detector imaging position according to the retrieved data identifying the exam type and the patient data; and
provide a second positioning signal to the second transport apparatus to move the detector from its current position to the detector imaging position. 3. The apparatus of claim 2, wherein the second transport apparatus is further configured to position a bucky device. 4. The apparatus of claim 1, further comprising an operator interface configured to receive entry of the patient data. 5. The apparatus of claim 4, wherein the operator interface is further configured to receive entry of default height data representing a patient population to be imaged by the imaging system. 6. The apparatus of claim 1, wherein the first positioning signal identifies both a three dimensional spatial translation and an angle. 7. The apparatus of claim 1, wherein the source imaging position includes a height position of the x-ray source, and wherein the first transport apparatus further comprises a telescoping arm coupled to the x-ray source for moving the x-ray source to the height position. 8. The apparatus of claim 1, wherein the first transport apparatus is further configured to automatically move and position the detector. 9. The apparatus of claim 1, wherein the processor is further programmed to automatically electronically store data identifying a new position of the x-ray source corresponding to one or more manual adjustments to the position of the x-ray source made by an operator of the apparatus. 10. The apparatus of claim 1, wherein the processor is further programmed to retrieve electronically stored position data to determine the source imaging position. 11. The apparatus of claim 2, wherein the processor is further programmed to retrieve electronically stored position data to determine the source imaging position, the detector imaging position, or a combination thereof. 12. A machine implemented method for acquiring an x-ray of a patient, the method comprising:
obtaining an electronic instruction that identifies an exam type from a set of electronically stored exam types; obtaining an electronically stored height value representing a patient population; determining source spatial coordinates to position an x-ray source according to the identified exam type and the obtained height value; providing a first signal to a first actuator to automatically move and position the x-ray source according to the determined source spatial coordinates; and displaying the x-ray image acquired with the x-ray source positioned at the determined source spatial coordinates. 13. The method of claim 12, further comprising:
determining detector spatial coordinates to position an x-ray detector according to the identified exam type and the obtained height value; and providing a second signal to a second actuator to automatically move and position the x-ray detector according to the determined detector spatial coordinates. 14. The method of claim 12, wherein automatically positioning the x-ray source comprises homing the x-ray source at a reference home position. 15. The method of claim 12, further comprising recording an operator adjustment to the determined spatial coordinates in an electronic memory. 16. The method of claim 12, further comprising recording spatial positions of one or more physical obstacles that may block movement of the x-ray source. 17. The method of claim 16, wherein determining spatial coordinates further comprises determining coordinates for moving the x-ray source to avoid the one or more physical obstacles. 18. The method of claim 12, wherein determining spatial coordinates further comprises scaling the spatial coordinates according to an age of the patient. 19. A method for positioning an x-ray source, the method comprising:
obtaining data that identifies one exam type from a plurality of available exam types; obtaining a height value associated with a patient to be imaged by the x-ray source; determining spatial coordinates associated with an imaging position of the x-ray source according to the identified exam type and obtained height value; providing a signal to an actuator configured to interpret the signal and move the x-ray source to the imaging position; storing adjusted spatial coordinates obtained from an operator adjustment to the imaging position; and displaying an x-ray image of the patient acquired with the x-ray source positioned at the adjusted spatial coordinates. 20. The method of claim 19, further comprising electronically storing the adjusted spatial coordinates in association with data identifying the patient. | 2,800 |
11,598 | 11,598 | 15,162,888 | 2,835 | A heat dissipating antenna comprised of a low-attenuating heat spreader bonded to a high frequency antenna or antenna array.
An integrated circuit with a wireless integrated circuit chip, and a heat dissipating antenna coupled to the wireless integrated circuit chip. A method of forming a heat dissipating antenna. | 1-20. (canceled) 21. An apparatus comprising:
a substrate; at least one integrated circuit attached to the substrate; an antenna attached to the at least one integrated circuit; and a first heat spreader attached to the antenna. 22. The apparatus of claim 21 further comprising a second heat spreader attached to the substrate. 23. The apparatus of claim 21 further comprising at least one electrical component attached to the substrate. 24. The apparatus of claim 21, wherein the first heat spreader is attached to the antenna using a heat conductive epoxy. 25. The apparatus of claim 21, wherein the first heat spreader is a parallel plate heat spreader. 26. The apparatus of claim 21, wherein the first heat spreader is a flat plate heat spreader. 27. The apparatus of claim 21, wherein the first heat spreader is a parallel pillar heat spreader. 28. The apparatus of claim 21, wherein the first heat spreader is composed of dielectric material. 29. The apparatus of claim 28, wherein the dielectric material is one of aluminum nitride, beryllium oxide, aluminum oxide, silicon carbide, and boron nitride. 30. The apparatus of claim 21, wherein the at least one integrated circuit is one of a radio frequency chip and a baseband chip. 31. The apparatus of claim 22, wherein the second heat spreader is one of a parallel plate heat spreader, a flat plate heat spreader, and a parallel pillar heat spreader. 32. The apparatus of claim 22, wherein the second heat spreader is composed of dielectric material. 33. An apparatus comprising:
a substrate; at least one integrated circuit attached to the substrate; and an antenna structure attached to the at least one integrated circuit, the antenna structure comprising:
an antenna; and
a first heat spreader electrically connected to the antenna. 34. The apparatus of claim 33 further comprising a second heat spreader attached to the substrate. 35. The apparatus of claim 33 further comprising at least one electrical component attached to the substrate. 36. The apparatus of claim 33, wherein the first heat spreader is composed of dielectric material. 37. The apparatus of claim 36, wherein the dielectric material is one of aluminum nitride, beryllium oxide, aluminum oxide, silicon carbide, and boron nitride. 38. The apparatus of claim 33, wherein the antenna structure comprises an array of antennas. 39. An apparatus comprising:
a substrate; at least one integrated circuit attached to the substrate; an antenna attached to the at least one integrated circuit; and a first heat spreader directly attached to the antenna using a conductive epoxy. 40. The apparatus of claim 39 further comprising a second heat spreader attached to the substrate. | A heat dissipating antenna comprised of a low-attenuating heat spreader bonded to a high frequency antenna or antenna array.
An integrated circuit with a wireless integrated circuit chip, and a heat dissipating antenna coupled to the wireless integrated circuit chip. A method of forming a heat dissipating antenna.1-20. (canceled) 21. An apparatus comprising:
a substrate; at least one integrated circuit attached to the substrate; an antenna attached to the at least one integrated circuit; and a first heat spreader attached to the antenna. 22. The apparatus of claim 21 further comprising a second heat spreader attached to the substrate. 23. The apparatus of claim 21 further comprising at least one electrical component attached to the substrate. 24. The apparatus of claim 21, wherein the first heat spreader is attached to the antenna using a heat conductive epoxy. 25. The apparatus of claim 21, wherein the first heat spreader is a parallel plate heat spreader. 26. The apparatus of claim 21, wherein the first heat spreader is a flat plate heat spreader. 27. The apparatus of claim 21, wherein the first heat spreader is a parallel pillar heat spreader. 28. The apparatus of claim 21, wherein the first heat spreader is composed of dielectric material. 29. The apparatus of claim 28, wherein the dielectric material is one of aluminum nitride, beryllium oxide, aluminum oxide, silicon carbide, and boron nitride. 30. The apparatus of claim 21, wherein the at least one integrated circuit is one of a radio frequency chip and a baseband chip. 31. The apparatus of claim 22, wherein the second heat spreader is one of a parallel plate heat spreader, a flat plate heat spreader, and a parallel pillar heat spreader. 32. The apparatus of claim 22, wherein the second heat spreader is composed of dielectric material. 33. An apparatus comprising:
a substrate; at least one integrated circuit attached to the substrate; and an antenna structure attached to the at least one integrated circuit, the antenna structure comprising:
an antenna; and
a first heat spreader electrically connected to the antenna. 34. The apparatus of claim 33 further comprising a second heat spreader attached to the substrate. 35. The apparatus of claim 33 further comprising at least one electrical component attached to the substrate. 36. The apparatus of claim 33, wherein the first heat spreader is composed of dielectric material. 37. The apparatus of claim 36, wherein the dielectric material is one of aluminum nitride, beryllium oxide, aluminum oxide, silicon carbide, and boron nitride. 38. The apparatus of claim 33, wherein the antenna structure comprises an array of antennas. 39. An apparatus comprising:
a substrate; at least one integrated circuit attached to the substrate; an antenna attached to the at least one integrated circuit; and a first heat spreader directly attached to the antenna using a conductive epoxy. 40. The apparatus of claim 39 further comprising a second heat spreader attached to the substrate. | 2,800 |
11,599 | 11,599 | 15,646,127 | 2,826 | A semiconductor module includes a substrate having a metallized first side and a metallized second side opposing the metallized first side. A semiconductor die is attached to the metallized first side of the substrate. A plurality of cooling structures are welded to the metallized second side of the substrate. Each of the cooling structures includes a plurality of distinct weld beads disposed in a stacked arrangement extending away from the substrate. The substrate can be electrically conductive or insulating. Corresponding methods of manufacturing such semiconductor modules and substrates with such welded cooling structures are also provided. | 1. A semiconductor module support member, comprising:
a substrate having a metallized side; and a plurality of cooling structures welded to the metallized side of the substrate, each of the cooling structures comprising a plurality of distinct weld beads disposed in a stacked arrangement extending away from the substrate. 2. The semiconductor module support member of claim 1, wherein at least some of the weld beads have a curved exterior surface. 3. The semiconductor module support member of claim 1, wherein one or more weld beads of at least some of the cooling structures are non-uniformly shaped with respect to the other weld beads in the same cooling structure. 4. The semiconductor module support member of claim 1, wherein the weld bead of each cooling structure disposed furthest from the substrate has a proximal end welded to the weld bead next furthest from the substrate and a rounded distal end. 5. The semiconductor module support member of claim 1, wherein the substrate comprises an isolation material having a first metallized side and a second metallized side opposing the first metallized side, and wherein the cooling structures are welded to one of the metallized sides of the isolation material. 6. The semiconductor module support member of claim 1, wherein the metallized side of the substrate and the weld beads comprise aluminum. 7. The semiconductor module support member of claim 1, wherein at least some of the stacked arrangements of weld beads are columnar. 8. The semiconductor module support member of claim 7, wherein at least some of the columnar stacked arrangements of weld beads have different diameters and lengths. 9. The semiconductor module support member of claim 1, wherein a first end of each stacked arrangement is attached to the metallized side and a second end of each stacked arrangement is free standing. 10. A semiconductor module, comprising:
a substrate having a metallized first side and a metallized second side opposing the metallized first side; a semiconductor die attached to the metallized first side of the substrate; and a plurality of cooling structures welded to the metallized second side of the substrate, each of the cooling structures comprising a plurality of distinct weld beads disposed in a stacked arrangement extending away from the substrate. 11. The semiconductor module of claim 10, further comprising a cooler attached to a periphery of the metallized second side of the substrate, the periphery being free of the cooling structures, wherein the cooling structures extend away from the substrate into a recessed region of the cooler. 12. The semiconductor module of claim 11, further comprising a mold compound encapsulating the semiconductor die at the metallized first side of the substrate. 13. The semiconductor module of claim 10, further comprising:
a mold compound encapsulating the semiconductor die and the substrate; an additional substrate embedded in the mold compound above the metallized first side of the substrate and spaced apart from the semiconductor die by part of the mold compound, the additional substrate having a first side facing the semiconductor die and an opposing second side; and a plurality of cooling structures welded to the second side of the additional substrate, each of the cooling structures comprising a plurality of distinct weld beads disposed in a stacked arrangement extending away from the additional substrate, wherein the cooling structures welded to the second side of each substrate protrude out of the mold compound. 14. The semiconductor module of claim 10, wherein the metallized second side of the substrate and the weld beads comprise aluminum. 15. The semiconductor module of claim 10, wherein the metallized first side of the substrate comprises a different material than the metallized second side of the substrate, and wherein the weld beads comprise the same material as the metallized second side. 16. The semiconductor module of claim 10, wherein the plurality of cooling structures is electrically isolated from the semiconductor die by the substrate. 17. The semiconductor module of claim 10, wherein a first end of each stacked arrangement is attached to the metallized side and a second end of each stacked arrangement is free standing. | A semiconductor module includes a substrate having a metallized first side and a metallized second side opposing the metallized first side. A semiconductor die is attached to the metallized first side of the substrate. A plurality of cooling structures are welded to the metallized second side of the substrate. Each of the cooling structures includes a plurality of distinct weld beads disposed in a stacked arrangement extending away from the substrate. The substrate can be electrically conductive or insulating. Corresponding methods of manufacturing such semiconductor modules and substrates with such welded cooling structures are also provided.1. A semiconductor module support member, comprising:
a substrate having a metallized side; and a plurality of cooling structures welded to the metallized side of the substrate, each of the cooling structures comprising a plurality of distinct weld beads disposed in a stacked arrangement extending away from the substrate. 2. The semiconductor module support member of claim 1, wherein at least some of the weld beads have a curved exterior surface. 3. The semiconductor module support member of claim 1, wherein one or more weld beads of at least some of the cooling structures are non-uniformly shaped with respect to the other weld beads in the same cooling structure. 4. The semiconductor module support member of claim 1, wherein the weld bead of each cooling structure disposed furthest from the substrate has a proximal end welded to the weld bead next furthest from the substrate and a rounded distal end. 5. The semiconductor module support member of claim 1, wherein the substrate comprises an isolation material having a first metallized side and a second metallized side opposing the first metallized side, and wherein the cooling structures are welded to one of the metallized sides of the isolation material. 6. The semiconductor module support member of claim 1, wherein the metallized side of the substrate and the weld beads comprise aluminum. 7. The semiconductor module support member of claim 1, wherein at least some of the stacked arrangements of weld beads are columnar. 8. The semiconductor module support member of claim 7, wherein at least some of the columnar stacked arrangements of weld beads have different diameters and lengths. 9. The semiconductor module support member of claim 1, wherein a first end of each stacked arrangement is attached to the metallized side and a second end of each stacked arrangement is free standing. 10. A semiconductor module, comprising:
a substrate having a metallized first side and a metallized second side opposing the metallized first side; a semiconductor die attached to the metallized first side of the substrate; and a plurality of cooling structures welded to the metallized second side of the substrate, each of the cooling structures comprising a plurality of distinct weld beads disposed in a stacked arrangement extending away from the substrate. 11. The semiconductor module of claim 10, further comprising a cooler attached to a periphery of the metallized second side of the substrate, the periphery being free of the cooling structures, wherein the cooling structures extend away from the substrate into a recessed region of the cooler. 12. The semiconductor module of claim 11, further comprising a mold compound encapsulating the semiconductor die at the metallized first side of the substrate. 13. The semiconductor module of claim 10, further comprising:
a mold compound encapsulating the semiconductor die and the substrate; an additional substrate embedded in the mold compound above the metallized first side of the substrate and spaced apart from the semiconductor die by part of the mold compound, the additional substrate having a first side facing the semiconductor die and an opposing second side; and a plurality of cooling structures welded to the second side of the additional substrate, each of the cooling structures comprising a plurality of distinct weld beads disposed in a stacked arrangement extending away from the additional substrate, wherein the cooling structures welded to the second side of each substrate protrude out of the mold compound. 14. The semiconductor module of claim 10, wherein the metallized second side of the substrate and the weld beads comprise aluminum. 15. The semiconductor module of claim 10, wherein the metallized first side of the substrate comprises a different material than the metallized second side of the substrate, and wherein the weld beads comprise the same material as the metallized second side. 16. The semiconductor module of claim 10, wherein the plurality of cooling structures is electrically isolated from the semiconductor die by the substrate. 17. The semiconductor module of claim 10, wherein a first end of each stacked arrangement is attached to the metallized side and a second end of each stacked arrangement is free standing. | 2,800 |
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