Unnamed: 0 int64 0 350k | level_0 int64 0 351k | ApplicationNumber int64 9.75M 96.1M | ArtUnit int64 1.6k 3.99k | Abstract stringlengths 1 8.37k | Claims stringlengths 3 292k | abstract-claims stringlengths 68 293k | TechCenter int64 1.6k 3.9k |
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11,700 | 11,700 | 15,537,193 | 2,813 | A barrier film laminate ( 1 ) comprising an organic layer ( 4 ) that is situated in between two inorganic layers ( 2,3 ). The organic layer comprises submicron getter particles ( 5 ) at an amount between 0.01 and 0.9% by weight. The barrier film laminate can be used for encapsulating organic electronic devices such as OLEDs. The long term homogenous transparency makes this laminate in particular suited for protecting the light emitting side of an OLED. | 1. A barrier film laminate comprising a first inorganic layer, a second inorganic layer and a first organic layer comprising submicron getter particles, the organic layer being situated in between the first and the second inorganic layer wherein the first inorganic layer, the second inorganic layer, and the first organic layer are all optically transparent, characterised in that the amount of submicron getter particles in the organic layer is between 0.01 and 0.9% by weight of the organic layer. 2. The barrier film laminate according to claim 1, comprising a third inorganic layer and a second organic layer comprising submicron getter particles at an amount between 0.01 and 0.9% by weight of the second organic layer, wherein the second organic layer is situated in between the first inorganic layer and the third inorganic layer such that the barrier film laminate comprises an alternating stack of organic and inorganic layers. 3. The barrier film laminate according to claim 2, wherein the amount of submicron getter particles in the first organic layer is between 0.01 and 0.5% by weight of the first organic layer. 4. The barrier film laminate according to claim 1, wherein the number averaged particle size of the submicron getter particles in the only organic layer or in one or more of the organic layers is 200 nanometre or less. 5. The barrier film laminate according to claim 1, wherein the submicron getter particles comprise calcium oxide, barium oxide, magnesium oxide, or strontium oxide. 6. The barrier film laminate according to claim 5, wherein the submicron getter particles are embedded in a radiation cured organic material. 7. The barrier film laminate according to claim 5, comprising calcium oxide submicron getter particles. 8. The barrier film laminate according to claim 1, comprising a substrate. 9. The barrier film laminate according to claim 8, wherein the substrate is a flexible substrate. 10. The barrier film laminate according to claim 8, wherein the substrate is optically transparent. 11. An encapsulated organic electronic device comprising a bare organic electronic device and a barrier film laminate according to claim 1. 12. The encapsulated organic electronic device according to claim 11, wherein the bare organic electronic device is situated in between the substrate and the barrier film laminate. 13. The encapsulated organic electronic device according to claim 11, wherein the barrier film laminate is situated in between the substrate and the bare organic electronic device. 14. The encapsulated organic electronic device according to claim 11, wherein the organic electronic device comprises an organic light emitting diode. | A barrier film laminate ( 1 ) comprising an organic layer ( 4 ) that is situated in between two inorganic layers ( 2,3 ). The organic layer comprises submicron getter particles ( 5 ) at an amount between 0.01 and 0.9% by weight. The barrier film laminate can be used for encapsulating organic electronic devices such as OLEDs. The long term homogenous transparency makes this laminate in particular suited for protecting the light emitting side of an OLED.1. A barrier film laminate comprising a first inorganic layer, a second inorganic layer and a first organic layer comprising submicron getter particles, the organic layer being situated in between the first and the second inorganic layer wherein the first inorganic layer, the second inorganic layer, and the first organic layer are all optically transparent, characterised in that the amount of submicron getter particles in the organic layer is between 0.01 and 0.9% by weight of the organic layer. 2. The barrier film laminate according to claim 1, comprising a third inorganic layer and a second organic layer comprising submicron getter particles at an amount between 0.01 and 0.9% by weight of the second organic layer, wherein the second organic layer is situated in between the first inorganic layer and the third inorganic layer such that the barrier film laminate comprises an alternating stack of organic and inorganic layers. 3. The barrier film laminate according to claim 2, wherein the amount of submicron getter particles in the first organic layer is between 0.01 and 0.5% by weight of the first organic layer. 4. The barrier film laminate according to claim 1, wherein the number averaged particle size of the submicron getter particles in the only organic layer or in one or more of the organic layers is 200 nanometre or less. 5. The barrier film laminate according to claim 1, wherein the submicron getter particles comprise calcium oxide, barium oxide, magnesium oxide, or strontium oxide. 6. The barrier film laminate according to claim 5, wherein the submicron getter particles are embedded in a radiation cured organic material. 7. The barrier film laminate according to claim 5, comprising calcium oxide submicron getter particles. 8. The barrier film laminate according to claim 1, comprising a substrate. 9. The barrier film laminate according to claim 8, wherein the substrate is a flexible substrate. 10. The barrier film laminate according to claim 8, wherein the substrate is optically transparent. 11. An encapsulated organic electronic device comprising a bare organic electronic device and a barrier film laminate according to claim 1. 12. The encapsulated organic electronic device according to claim 11, wherein the bare organic electronic device is situated in between the substrate and the barrier film laminate. 13. The encapsulated organic electronic device according to claim 11, wherein the barrier film laminate is situated in between the substrate and the bare organic electronic device. 14. The encapsulated organic electronic device according to claim 11, wherein the organic electronic device comprises an organic light emitting diode. | 2,800 |
11,701 | 11,701 | 15,437,485 | 2,846 | A propulsion system is described that includes an electrical bus, a generator configured to provide electrical power to the electrical bus, a plurality of propulsory configured to provide thrust by simultaneously being driven by the electrical power at the electrical bus, and a controller. The controller is configured to synchronize a rotational speed of an individual propulsor from the plurality of propulsory with a rotational speed of the generator after the individual propulsor has become unsynchronized with the rotational speed of the generator by controlling at least one of the rotational speed of the generator, nozzle area of the individual propulsor, or a pitch angle of the individual propulsor. | 1. A propulsion system, comprising:
an electrical bus; a generator configured to provide electrical power to the electrical bus; a propulsor configured to provide thrust by simultaneously being driven by the electrical power at the electrical bus; and a controller configured to synchronize a rotational speed of the propulsor with a rotational speed of the generator after the propulsor has become unsynchronized with the rotational speed of the generator by controlling at least one of the rotational speed of the generator, nozzle area of the propulsor, and a pitch angle of the propulsor, 2. The propulsion system of claim 1, wherein the controller is further configured to disengage the propulsor from the electrical bus prior to controlling the rotational speed of the generator, the nozzle area of the propulsor, or the pitch angle of the propulsor. 3. The propulsion system of claim 2, wherein the controller is further configured to reengage the propulsor to the electrical bus in response to determining the rotational speed of the individual propulsor is synchronized with the rotational speed of the generator. 4. The propulsion system of claim 2, further comprising:
an interrupt switch that is operable by the controller to engage and disengage the propulsor to and from the electrical bus. 5. The propulsion system of claim 1, wherein the controller is configured to synchronize the rotational speed of the propulsor with the rotational speed of the generator by at least one of: increasing a throttle setting of the generator to increase the rotational speed of the propulsor, decreasing the pitch angle of the individual propulsor relative to an angle of attack of the propulsor to increase the rotational speed of the individual propulsor, or varying the nozzle area of the propulsor to increase the rotational speed of the propulsor by changing a back pressure of the propulsor. 6. The propulsion system of claim I, further comprising one or more additional propulsors, wherein the controller is further configured to maintain each of the one or more additional propulsors at a desired thrust point while synchronizing the rotational speed of the propulsor with the rotational speed of the generator. 7. A method comprising:
determining, by a controller of a propulsion system, whether a frequency of an individual propulsor from a plurality of propulsors is synchronized with a frequency of a generator that is driving the plurality of propulsors; and responsive to determining that the frequency of the individual propulsors is not synchronized with the frequency of the generator, controlling, by the controller, at least one of the rotational speed of the generator, nozzle area of the individual propulsor, and a pitch angle of the individual propulsor to synchronize the rotational speed of the individual propulsor with the rotational speed of the generator. 8. The method of claim 7, further comprising disengaging, by the controller, the individual propulsor from an electrical bus shared between the plurality of propulsors and the generator prior to controlling the rotational speed of the generator, the nozzle area of the individual propulsor, or the pitch angle of the individual propulsor to synchronize the rotational speed of the individual propulsor with the rotational speed of the generator. 9. The method of claim 8, further comprising reengaging, by the controller, the individual propulsor to the electrical bus in response to determining the rotational speed of the individual propulsor is synchronized with the rotational speed of the generator. 10. The method of claim 7, wherein synchronizing the rotational speed of the individual propulsor with the rotational speed of the generator includes decreasing the pitch angle control of the individual propulsor relative to an angle of attack of the individual propulsor to increase the rotational speed of the individual propulsor or varying the nozzle area of the individual propulsor to increase the rotational speed of the individual propulsor. 11. The method of claim 7, wherein synchronizing the rotational speed of the individual propulsor with the rotational speed of the generator includes increasing the rotational speed of the generator to increase the rotational speed of the individual propulsor. 12. The method of claim 7, wherein synchronizing the rotational speed of the individual propulsor with the rotational speed of the generator includes decreasing the pitch angle control of the individual propulsor and increasing the rotational speed of the generator to increase the rotational speed of the individual propulsor. 13. The method of claim 7, further comprising:
maintaining, by the controller, each propulsor from the plurality of propulsors, other than the individual propulsor, at a desired thrust point while synchronizing the frequency of the individual propulsor with the frequency of the generator. 14. The method of claim 13, further comprising:
maintaining, by the controller, each remaining propulsor from the plurality of propulsors, other than the individual propulsor, at the desired thrust point while synchronizing the frequency of the individual propulsor with the frequency of the generator by controlling a respective pitch angle of each remaining propulsor to maintain the desired thrust point. 15. The method of claim 14, further comprising:
controlling, by the controller, at least one of the respective pitch angle or nozzle area of each remaining propulsor to maintain the desired thrust point by varying the respective pitch angle or nozzle area of each remaining propulsor in an opposite direction of a direction at which the controller varies the pitch angle or nozzle area of the individual propulsor. 16. The method of claim 7, wherein synchronizing the frequency of the individual propulsor with the frequency of the generator includes pitch angle control of the individual propulsor prior to a simultaneous pitch angle control and rotational speed control of the generator to increase the rotational speed of the individual propulsor. 17. A system comprising:
means for determining whether a frequency of an individual propulsor from a plurality of propulsors of a propulsion system is synchronized with a frequency of a generator and means for controlling, in response to determining that the frequency of the individual propulsor is not synchronized with the frequency of the generator, at least one of the rotational speed of the generator, a pitch angle of the individual propulsor, and propulsor nozzle area to synchronize the frequency of the individual propulsor with the frequency of the generator. 18. The system of claim 17, further comprising:
means for disengaging the individual propulsor from an electrical bus shared between the plurality of propulsors and the generator prior to controlling the rotational speed of the generator or the pitch angle or nozzle area of the individual propulsor to synchronize the frequency of the individual propulsor with the frequency of the generator by controlling; and means for reengaging the individual propulsor to the electrical bus in response to determining the rotational speed of the individual propulsor is synchronized with the rotational speed of the generator. 19. The system of claim 17, wherein the means for synchronizing the frequency of the individual propulsor with the frequency of the generator include at least one of:
means for decreasing the pitch angle of the individual propulsor relative to an angle of attack of the individual propulsor, or increasing the rotational speed of the generator to increase the rotational speed of the individual propulsor. 20. The system of claim 17, further comprising:
means for maintaining each propulsor from the plurality of propulsors, other than the individual propulsor, at a desired thrust point while synchronizing the frequency of the individual propulsor with the frequency of the generator. | A propulsion system is described that includes an electrical bus, a generator configured to provide electrical power to the electrical bus, a plurality of propulsory configured to provide thrust by simultaneously being driven by the electrical power at the electrical bus, and a controller. The controller is configured to synchronize a rotational speed of an individual propulsor from the plurality of propulsory with a rotational speed of the generator after the individual propulsor has become unsynchronized with the rotational speed of the generator by controlling at least one of the rotational speed of the generator, nozzle area of the individual propulsor, or a pitch angle of the individual propulsor.1. A propulsion system, comprising:
an electrical bus; a generator configured to provide electrical power to the electrical bus; a propulsor configured to provide thrust by simultaneously being driven by the electrical power at the electrical bus; and a controller configured to synchronize a rotational speed of the propulsor with a rotational speed of the generator after the propulsor has become unsynchronized with the rotational speed of the generator by controlling at least one of the rotational speed of the generator, nozzle area of the propulsor, and a pitch angle of the propulsor, 2. The propulsion system of claim 1, wherein the controller is further configured to disengage the propulsor from the electrical bus prior to controlling the rotational speed of the generator, the nozzle area of the propulsor, or the pitch angle of the propulsor. 3. The propulsion system of claim 2, wherein the controller is further configured to reengage the propulsor to the electrical bus in response to determining the rotational speed of the individual propulsor is synchronized with the rotational speed of the generator. 4. The propulsion system of claim 2, further comprising:
an interrupt switch that is operable by the controller to engage and disengage the propulsor to and from the electrical bus. 5. The propulsion system of claim 1, wherein the controller is configured to synchronize the rotational speed of the propulsor with the rotational speed of the generator by at least one of: increasing a throttle setting of the generator to increase the rotational speed of the propulsor, decreasing the pitch angle of the individual propulsor relative to an angle of attack of the propulsor to increase the rotational speed of the individual propulsor, or varying the nozzle area of the propulsor to increase the rotational speed of the propulsor by changing a back pressure of the propulsor. 6. The propulsion system of claim I, further comprising one or more additional propulsors, wherein the controller is further configured to maintain each of the one or more additional propulsors at a desired thrust point while synchronizing the rotational speed of the propulsor with the rotational speed of the generator. 7. A method comprising:
determining, by a controller of a propulsion system, whether a frequency of an individual propulsor from a plurality of propulsors is synchronized with a frequency of a generator that is driving the plurality of propulsors; and responsive to determining that the frequency of the individual propulsors is not synchronized with the frequency of the generator, controlling, by the controller, at least one of the rotational speed of the generator, nozzle area of the individual propulsor, and a pitch angle of the individual propulsor to synchronize the rotational speed of the individual propulsor with the rotational speed of the generator. 8. The method of claim 7, further comprising disengaging, by the controller, the individual propulsor from an electrical bus shared between the plurality of propulsors and the generator prior to controlling the rotational speed of the generator, the nozzle area of the individual propulsor, or the pitch angle of the individual propulsor to synchronize the rotational speed of the individual propulsor with the rotational speed of the generator. 9. The method of claim 8, further comprising reengaging, by the controller, the individual propulsor to the electrical bus in response to determining the rotational speed of the individual propulsor is synchronized with the rotational speed of the generator. 10. The method of claim 7, wherein synchronizing the rotational speed of the individual propulsor with the rotational speed of the generator includes decreasing the pitch angle control of the individual propulsor relative to an angle of attack of the individual propulsor to increase the rotational speed of the individual propulsor or varying the nozzle area of the individual propulsor to increase the rotational speed of the individual propulsor. 11. The method of claim 7, wherein synchronizing the rotational speed of the individual propulsor with the rotational speed of the generator includes increasing the rotational speed of the generator to increase the rotational speed of the individual propulsor. 12. The method of claim 7, wherein synchronizing the rotational speed of the individual propulsor with the rotational speed of the generator includes decreasing the pitch angle control of the individual propulsor and increasing the rotational speed of the generator to increase the rotational speed of the individual propulsor. 13. The method of claim 7, further comprising:
maintaining, by the controller, each propulsor from the plurality of propulsors, other than the individual propulsor, at a desired thrust point while synchronizing the frequency of the individual propulsor with the frequency of the generator. 14. The method of claim 13, further comprising:
maintaining, by the controller, each remaining propulsor from the plurality of propulsors, other than the individual propulsor, at the desired thrust point while synchronizing the frequency of the individual propulsor with the frequency of the generator by controlling a respective pitch angle of each remaining propulsor to maintain the desired thrust point. 15. The method of claim 14, further comprising:
controlling, by the controller, at least one of the respective pitch angle or nozzle area of each remaining propulsor to maintain the desired thrust point by varying the respective pitch angle or nozzle area of each remaining propulsor in an opposite direction of a direction at which the controller varies the pitch angle or nozzle area of the individual propulsor. 16. The method of claim 7, wherein synchronizing the frequency of the individual propulsor with the frequency of the generator includes pitch angle control of the individual propulsor prior to a simultaneous pitch angle control and rotational speed control of the generator to increase the rotational speed of the individual propulsor. 17. A system comprising:
means for determining whether a frequency of an individual propulsor from a plurality of propulsors of a propulsion system is synchronized with a frequency of a generator and means for controlling, in response to determining that the frequency of the individual propulsor is not synchronized with the frequency of the generator, at least one of the rotational speed of the generator, a pitch angle of the individual propulsor, and propulsor nozzle area to synchronize the frequency of the individual propulsor with the frequency of the generator. 18. The system of claim 17, further comprising:
means for disengaging the individual propulsor from an electrical bus shared between the plurality of propulsors and the generator prior to controlling the rotational speed of the generator or the pitch angle or nozzle area of the individual propulsor to synchronize the frequency of the individual propulsor with the frequency of the generator by controlling; and means for reengaging the individual propulsor to the electrical bus in response to determining the rotational speed of the individual propulsor is synchronized with the rotational speed of the generator. 19. The system of claim 17, wherein the means for synchronizing the frequency of the individual propulsor with the frequency of the generator include at least one of:
means for decreasing the pitch angle of the individual propulsor relative to an angle of attack of the individual propulsor, or increasing the rotational speed of the generator to increase the rotational speed of the individual propulsor. 20. The system of claim 17, further comprising:
means for maintaining each propulsor from the plurality of propulsors, other than the individual propulsor, at a desired thrust point while synchronizing the frequency of the individual propulsor with the frequency of the generator. | 2,800 |
11,702 | 11,702 | 13,822,922 | 2,865 | This application discloses a background subtraction-mediated data dependent acquisition method useful in mass spectrometry analysis. The method includes subtraction of background data from precursor ion spectra of a sample in real-time to obtain mass data of component(s) of interest and performs data-dependent acquisition on the component(s) of interest based on the resultant mass data from the background subtraction step. The present invention also encompasses mass spectrometer systems capable of background subtraction-mediated data-dependent acquisition and computer programs adapted for use in the background-subtraction-mediated data-dependent acquisition. The invention thus provides highly sensitive data-dependent acquisition for minor components of interest in a sample. | 1-54. (canceled) 55. A method of analyzing mass spectrum of a sample, comprising the steps of:
acquiring an original mass spectrum of the sample with a first mass spectrometric acquisition function at a chromatographic time point, wherein the original mass spectrum comprises m/z and intensity information of detected ion peaks at the chromatographic time point; defining sections of data in a background data set at the chromatographic time specified in the acquiring step to form defined sections of the background data set; and conducting background subtraction for ions in the original mass spectrum using ion information in the defined sections of the background data set, resulting in a current background-subtracted mass spectrum; wherein the background subtraction occurs in real time before performing an immediate subsequent event of a data-dependent acquisition function of the sample. 56. The method of claim 55, wherein the subtracting comprises substantially removing ion signals of background components from the original mass spectrum, thus allowing selective data-dependent acquisitions for components of interest in the sample. 57. The method of claim 55, wherein the defining comprises defining sections of data in a background data set at the m/z information specified in the acquiring step. 58. The method of claim 55, wherein the defining comprises applying a chromatographic fluctuation time window and a mass precision window around ion peaks in the background data set. 59. The method of claim 58, wherein the chromatographic fluctuation time window and the mass precision window are variable windows. 60. The method of claim 55, wherein the current background-subtracted mass spectrum is obtained through reconstruction of the original mass spectrum at the chromatographic time point after subtracting ion signals of background components corresponding to the defined sections of the background data set from the original mass spectrum. 61. The method of claim 55, wherein the background subtraction is carried out by subtracting background data in the specified chromatographic fluctuation time window and mass precision window from the original mass spectrum of the sample at the chromatographic time point. 62. The method of claim 55, further comprising the steps of:
obtaining at least one background data set comprising information on m/z of ions, chromatographic time, and ion peak intensity; specifying a chromatographic fluctuation time window and a mass precision window; and conducting a separation and mass spectrometry analysis on the sample to be tested, wherein said analysis comprises the first mass spectrometric acquisition function. 63. The method of claim 62, wherein the background data set is acquired prior to the separation and mass spectrometry analysis on the sample to be tested. 64. The method of claim 62, wherein the first mass spectrometric acquisition function is kept the same or equivalent as the acquisition of the background data set. 65. The method of claim 55, wherein the background subtraction comprises contrasting between ion peak intensities in the defined sections of the background data and ion peak intensities in the original mass spectrum of the sample. 66. The method of claim 65, wherein the contrasting comprises dividing ion peak intensities in the defined sections of the background data and ion peak intensities in the original mass spectrum of the sample. 67. The method of claim 55, wherein the background subtraction comprises applying a scale factor to intensities of the defined background data prior to conducting the subtracting. 68. The method of claim 55, further comprising choosing mass signal(s) at the chromatographic time point for conducting an immediate subsequent event of a data-dependent acquisition function, wherein the choosing is based on at least the information of the current background-subtracted mass spectrum, whereby the information of the current background-subtracted mass spectrum allows the event of the data-dependent acquisition to be selective for components of interest in the sample. 69. The method of claim 68, wherein a choice of mass signal(s) is defined as the current highest intensity mass signal(s) in the current background-subtracted spectrum. 70. The method of claim 68, wherein a choice of mass signal(s) is selected from current fast-rising mass signals in background-subtracted mass spectral data of the first mass spectrometric acquisition function. 71. The method of claim 68, wherein the choice of mass signal is selected based on the fast rising peaks of a base peak ion chromatogram of background-subtracted mass spectral data of the first mass spectrometric acquisition function. 72. The method of claim 68, wherein the immediate subsequent event of data-dependent acquisition is a MS/MS acquisition event. 73. The method of claim 68, wherein the immediate subsequent event of data-dependent acquisition is a sample fractionation event generating fractions for further analysis. 74. The method of claims 55, wherein the sample is a biological sample comprising a plurality of components in the background that are difficult to separate from the component(s) of interest. 75. The method of claim 74, wherein the biological sample comprises one or more components of interest selected from the ground consisting of drugs of abuse, metabolites, pharmaceuticals, forensic chemicals, pesticides, peptides, proteins, and nucleotides. 76. A system for analyzing a sample of interest, comprising:
a separation module for separating components in a sample; and a mass spectrometer for detecting ions of components in the sample and acquiring a sample data set, the mass spectrometer comprising a data-dependent acquisition module and a system controller that comprises a background-subtracting module, and the system controller being configured to cause the system to perform the method of claim 55. 77. The system of claim 76, further comprising a data storage module where background data obtained from a control sample is stored prior to acquisition of the sample of interest. 78. The system of claim 77, wherein the background subtraction module accepts the sample data set from the mass spectrometer, retrieves the background data from the data storage module, and subtracts the background data from the sample data set by operation of a computing algorithm. 79. The system of claim 78, wherein the sample dataset is a precursor or parent mass dataset of the sample of interest. 80. The system of claim 78, wherein the background subtraction module subtracts the background data from the sample data set to generate a background-subtracted mass spectral data set consisting essentially of mass data of component(s) of interest, and the data-dependent acquisition module uses the background-subtracted mass spectral dataset to determine a choice of mass signal(s) to direct events of data-dependent acquisition of the sample of interest in real time. 81. The system of claim 78, wherein said subtracting comprises subtracting a plurality of background data from a plurality of sample data sets before acquiring a plurality of subsequent data-dependent data sets of the sample of interest through interaction between the data-dependent acquisition module and the background subtraction module. 82. The system of claim 76, wherein the system is an LC-MS/MS system. 83. The system of claim 76, wherein the system comprises a high-resolution mass spectrometer. | This application discloses a background subtraction-mediated data dependent acquisition method useful in mass spectrometry analysis. The method includes subtraction of background data from precursor ion spectra of a sample in real-time to obtain mass data of component(s) of interest and performs data-dependent acquisition on the component(s) of interest based on the resultant mass data from the background subtraction step. The present invention also encompasses mass spectrometer systems capable of background subtraction-mediated data-dependent acquisition and computer programs adapted for use in the background-subtraction-mediated data-dependent acquisition. The invention thus provides highly sensitive data-dependent acquisition for minor components of interest in a sample.1-54. (canceled) 55. A method of analyzing mass spectrum of a sample, comprising the steps of:
acquiring an original mass spectrum of the sample with a first mass spectrometric acquisition function at a chromatographic time point, wherein the original mass spectrum comprises m/z and intensity information of detected ion peaks at the chromatographic time point; defining sections of data in a background data set at the chromatographic time specified in the acquiring step to form defined sections of the background data set; and conducting background subtraction for ions in the original mass spectrum using ion information in the defined sections of the background data set, resulting in a current background-subtracted mass spectrum; wherein the background subtraction occurs in real time before performing an immediate subsequent event of a data-dependent acquisition function of the sample. 56. The method of claim 55, wherein the subtracting comprises substantially removing ion signals of background components from the original mass spectrum, thus allowing selective data-dependent acquisitions for components of interest in the sample. 57. The method of claim 55, wherein the defining comprises defining sections of data in a background data set at the m/z information specified in the acquiring step. 58. The method of claim 55, wherein the defining comprises applying a chromatographic fluctuation time window and a mass precision window around ion peaks in the background data set. 59. The method of claim 58, wherein the chromatographic fluctuation time window and the mass precision window are variable windows. 60. The method of claim 55, wherein the current background-subtracted mass spectrum is obtained through reconstruction of the original mass spectrum at the chromatographic time point after subtracting ion signals of background components corresponding to the defined sections of the background data set from the original mass spectrum. 61. The method of claim 55, wherein the background subtraction is carried out by subtracting background data in the specified chromatographic fluctuation time window and mass precision window from the original mass spectrum of the sample at the chromatographic time point. 62. The method of claim 55, further comprising the steps of:
obtaining at least one background data set comprising information on m/z of ions, chromatographic time, and ion peak intensity; specifying a chromatographic fluctuation time window and a mass precision window; and conducting a separation and mass spectrometry analysis on the sample to be tested, wherein said analysis comprises the first mass spectrometric acquisition function. 63. The method of claim 62, wherein the background data set is acquired prior to the separation and mass spectrometry analysis on the sample to be tested. 64. The method of claim 62, wherein the first mass spectrometric acquisition function is kept the same or equivalent as the acquisition of the background data set. 65. The method of claim 55, wherein the background subtraction comprises contrasting between ion peak intensities in the defined sections of the background data and ion peak intensities in the original mass spectrum of the sample. 66. The method of claim 65, wherein the contrasting comprises dividing ion peak intensities in the defined sections of the background data and ion peak intensities in the original mass spectrum of the sample. 67. The method of claim 55, wherein the background subtraction comprises applying a scale factor to intensities of the defined background data prior to conducting the subtracting. 68. The method of claim 55, further comprising choosing mass signal(s) at the chromatographic time point for conducting an immediate subsequent event of a data-dependent acquisition function, wherein the choosing is based on at least the information of the current background-subtracted mass spectrum, whereby the information of the current background-subtracted mass spectrum allows the event of the data-dependent acquisition to be selective for components of interest in the sample. 69. The method of claim 68, wherein a choice of mass signal(s) is defined as the current highest intensity mass signal(s) in the current background-subtracted spectrum. 70. The method of claim 68, wherein a choice of mass signal(s) is selected from current fast-rising mass signals in background-subtracted mass spectral data of the first mass spectrometric acquisition function. 71. The method of claim 68, wherein the choice of mass signal is selected based on the fast rising peaks of a base peak ion chromatogram of background-subtracted mass spectral data of the first mass spectrometric acquisition function. 72. The method of claim 68, wherein the immediate subsequent event of data-dependent acquisition is a MS/MS acquisition event. 73. The method of claim 68, wherein the immediate subsequent event of data-dependent acquisition is a sample fractionation event generating fractions for further analysis. 74. The method of claims 55, wherein the sample is a biological sample comprising a plurality of components in the background that are difficult to separate from the component(s) of interest. 75. The method of claim 74, wherein the biological sample comprises one or more components of interest selected from the ground consisting of drugs of abuse, metabolites, pharmaceuticals, forensic chemicals, pesticides, peptides, proteins, and nucleotides. 76. A system for analyzing a sample of interest, comprising:
a separation module for separating components in a sample; and a mass spectrometer for detecting ions of components in the sample and acquiring a sample data set, the mass spectrometer comprising a data-dependent acquisition module and a system controller that comprises a background-subtracting module, and the system controller being configured to cause the system to perform the method of claim 55. 77. The system of claim 76, further comprising a data storage module where background data obtained from a control sample is stored prior to acquisition of the sample of interest. 78. The system of claim 77, wherein the background subtraction module accepts the sample data set from the mass spectrometer, retrieves the background data from the data storage module, and subtracts the background data from the sample data set by operation of a computing algorithm. 79. The system of claim 78, wherein the sample dataset is a precursor or parent mass dataset of the sample of interest. 80. The system of claim 78, wherein the background subtraction module subtracts the background data from the sample data set to generate a background-subtracted mass spectral data set consisting essentially of mass data of component(s) of interest, and the data-dependent acquisition module uses the background-subtracted mass spectral dataset to determine a choice of mass signal(s) to direct events of data-dependent acquisition of the sample of interest in real time. 81. The system of claim 78, wherein said subtracting comprises subtracting a plurality of background data from a plurality of sample data sets before acquiring a plurality of subsequent data-dependent data sets of the sample of interest through interaction between the data-dependent acquisition module and the background subtraction module. 82. The system of claim 76, wherein the system is an LC-MS/MS system. 83. The system of claim 76, wherein the system comprises a high-resolution mass spectrometer. | 2,800 |
11,703 | 11,703 | 15,810,844 | 2,846 | A system and method for sensing rotor position of a three-phase permanent magnet synchronous motor (PMSM) includes a controller coupled with the PMSM and causing a plurality of voltage pulses to be applied thereto. A timer and/or an analog-to-digital converter is coupled with the PMSM and measures a plurality of values (measured values) from a three-phase inverter coupled with the PMSM. Each measured value may correspond with one of the plurality of voltage pulses and includes a current value or time value corresponding with an inductance of the PMSM. One or more logic elements calculates, based on the measured values and on one or more position algorithms, a position of a rotor of the PMSM relative to a stator of the PMSM. The system is configured to calculate the position of the rotor when the rotor is in a stopped configuration and when the rotor is in a rotating configuration. | 1. A system for sensing rotor position of a motor, the system comprising:
a controller configured to couple with a delta configuration three-phase permanent magnet synchronous motor (PMSM), the controller configured to cause a plurality of voltage pulses to be applied to the PMSM; an analog-to-digital converter (ADC) configured to be coupled with the PMSM and with the controller and configured to measure a plurality of values (measured values) from a three-phase inverter configured to couple with the PMSM, each of the measured values corresponding with one of the plurality of voltage pulses each applied for a predetermined constant time interval and comprising a current value corresponding with an inductance of the PMSM; and one or more logic elements configured to calculate, using one or more position algorithms, a position of a rotor of the PMSM relative to a stator of the PMSM; wherein the one or more position algorithms employ a least squares method with the measured values to calculate the position of the rotor when the rotor is in a stopped configuration and when the rotor is in a rotating configuration. 2. The system of claim 1, wherein the one or more logic elements are coupled with one or more shunt resistors that are coupled with the three-phase inverter. 3. The system of claim 1, wherein the system is configured to calculate a position of a rotor of a PMSM that is not controlled using vector control (field-oriented control). 4. The system of claim 1, wherein the PMSM comprises a surface permanent magnet synchronous motor (SPMSM). 5. The system of claim 1, wherein the PMSM comprises an interior permanent magnet synchronous motor (IPMSM). 6. The system of claim 1, wherein the one or more logic elements calculate the position of the rotor within 30 degrees of accuracy. 7. The system of claim 1, wherein the one or more position algorithms include
tan
-
1
(
∑
i
=
1
N
sin
(
2
α
i
)
y
i
∑
i
=
1
N
cos
(
2
α
i
)
y
i
)
wherein each αi includes a value between 0 and 2π and wherein each yi includes one of the measured values. 8. The system of claim 1, wherein the system is configured to calculate a position of a rotor of a PMSM that is controlled using vector control (field-oriented control). 9. A system for sensing rotor position of a motor, the system, comprising:
a controller configured to couple with a delta configuration three-phase permanent magnet synchronous motor (PMSM), the controller configured to cause a plurality of voltage pulses to be applied to the PMSM; a timer coupled with the at least one shunt resistor configured to couple with the PMSM and also configured to measure a plurality of values (measured values), each of the measured values corresponding with one of the plurality of voltage pulses and comprising a time value corresponding with an inductance of the PMSM; and one or more logic elements coupled with the timer and configured to calculate, using one or more position algorithms, a position of a rotor of the PMSM relative to a stator of the PMSM; wherein the one or more position algorithms employ a least squares method with the plurality of measured values and a plurality of measuring current vector phase values to calculate the position of the rotor when the rotor is in a stopped configuration and when the rotor is in a rotating configuration. 10. The system of claim 9, wherein the one or more logic elements calculate the position of the rotor within 30 degrees of accuracy. 11. The system of claim 9, wherein the system is configured to calculate a position of a rotor of a PMSM that is not controlled using vector control (field-oriented control). 12. The system of claim 9, wherein the system comprises the timer, an analog to digital converter (ADC), a comparator, and a multiplexer each coupled with the one or more logic elements. 13. The system of claim 9, wherein the system further comprises a sample and hold element (S/H) and an analog multiplexer (AMUX) coupled with the one or more logic elements. 14. The system of claim 9, wherein the one or more position algorithms include
tan
-
1
(
∑
i
=
1
N
-
sin
(
2
α
i
)
y
i
∑
i
=
1
N
-
cos
(
2
α
i
)
y
i
)
wherein each αi includes a value between 0 and 2π and wherein each yi includes one of the measured values. 15. A method for sensing rotor position of a motor, the method, comprising:
providing a controller and one of a timer and an analog-to-digital converter (ADC) configured to couple with a delta configuration three-phase permanent magnet synchronous motor (PMSM); applying, using the controller, a plurality of voltage pulses to the PMSM; measuring, with the one of the timer and the ADC, a plurality of values (measured values) from a three-phase inverter coupled with the PMSM, each of the measured values corresponding with one of the plurality of voltage pulses and comprising one of a current value corresponding with an inductance of the PMSM and a time value corresponding with an inductance of the PMSM, and; calculating, with one or more logic elements coupled with the PMSM, using one or more position algorithms, a position of a rotor of the PMSM relative to a stator of the PMSM; wherein the one or more position algorithms employ a least squares method with the plurality of values to calculate the position of the rotor when the rotor is in a stopped configuration and when the rotor is in a rotating configuration; and wherein the one or more logic elements are configured to calculate a position of a rotor of a PMSM that is not controlled using vector control (field-oriented control). 16. The method of claim 15, wherein the one or more position algorithms includes one of
tan
-
1
(
∑
i
=
1
N
-
sin
(
2
α
i
)
y
i
∑
i
=
1
N
-
cos
(
2
α
i
)
y
i
)
and
tan
-
1
(
∑
i
=
1
N
sin
(
2
α
i
)
y
i
∑
i
=
1
N
cos
(
2
α
i
)
y
i
)
wherein each αi includes a value between 0 and 2π and wherein each yi includes one of the measured values. 17. The method of claim 15, further comprising calculating, with the one or more logic elements, the position of the rotor relative to the stator when the rotor is in the stopped configuration. 18. The method of claim 15, further comprising coupling the timer with the PMSM and toggling the timer between a start configuration and a stop configuration using a signal processor in response to an input from a comparator. 19. The method of claim 15, further comprising coupling the ADC with the PMSM, converting an analog signal from the three-phase inverter to a digital signal using the ADC, and communicating the digital signal from the ADC to the one or more logic elements. 20. The method of claim 15, wherein the measured values are measured using one or more elements coupled with one or more shunt resistors that are coupled with the three-phase inverter. | A system and method for sensing rotor position of a three-phase permanent magnet synchronous motor (PMSM) includes a controller coupled with the PMSM and causing a plurality of voltage pulses to be applied thereto. A timer and/or an analog-to-digital converter is coupled with the PMSM and measures a plurality of values (measured values) from a three-phase inverter coupled with the PMSM. Each measured value may correspond with one of the plurality of voltage pulses and includes a current value or time value corresponding with an inductance of the PMSM. One or more logic elements calculates, based on the measured values and on one or more position algorithms, a position of a rotor of the PMSM relative to a stator of the PMSM. The system is configured to calculate the position of the rotor when the rotor is in a stopped configuration and when the rotor is in a rotating configuration.1. A system for sensing rotor position of a motor, the system comprising:
a controller configured to couple with a delta configuration three-phase permanent magnet synchronous motor (PMSM), the controller configured to cause a plurality of voltage pulses to be applied to the PMSM; an analog-to-digital converter (ADC) configured to be coupled with the PMSM and with the controller and configured to measure a plurality of values (measured values) from a three-phase inverter configured to couple with the PMSM, each of the measured values corresponding with one of the plurality of voltage pulses each applied for a predetermined constant time interval and comprising a current value corresponding with an inductance of the PMSM; and one or more logic elements configured to calculate, using one or more position algorithms, a position of a rotor of the PMSM relative to a stator of the PMSM; wherein the one or more position algorithms employ a least squares method with the measured values to calculate the position of the rotor when the rotor is in a stopped configuration and when the rotor is in a rotating configuration. 2. The system of claim 1, wherein the one or more logic elements are coupled with one or more shunt resistors that are coupled with the three-phase inverter. 3. The system of claim 1, wherein the system is configured to calculate a position of a rotor of a PMSM that is not controlled using vector control (field-oriented control). 4. The system of claim 1, wherein the PMSM comprises a surface permanent magnet synchronous motor (SPMSM). 5. The system of claim 1, wherein the PMSM comprises an interior permanent magnet synchronous motor (IPMSM). 6. The system of claim 1, wherein the one or more logic elements calculate the position of the rotor within 30 degrees of accuracy. 7. The system of claim 1, wherein the one or more position algorithms include
tan
-
1
(
∑
i
=
1
N
sin
(
2
α
i
)
y
i
∑
i
=
1
N
cos
(
2
α
i
)
y
i
)
wherein each αi includes a value between 0 and 2π and wherein each yi includes one of the measured values. 8. The system of claim 1, wherein the system is configured to calculate a position of a rotor of a PMSM that is controlled using vector control (field-oriented control). 9. A system for sensing rotor position of a motor, the system, comprising:
a controller configured to couple with a delta configuration three-phase permanent magnet synchronous motor (PMSM), the controller configured to cause a plurality of voltage pulses to be applied to the PMSM; a timer coupled with the at least one shunt resistor configured to couple with the PMSM and also configured to measure a plurality of values (measured values), each of the measured values corresponding with one of the plurality of voltage pulses and comprising a time value corresponding with an inductance of the PMSM; and one or more logic elements coupled with the timer and configured to calculate, using one or more position algorithms, a position of a rotor of the PMSM relative to a stator of the PMSM; wherein the one or more position algorithms employ a least squares method with the plurality of measured values and a plurality of measuring current vector phase values to calculate the position of the rotor when the rotor is in a stopped configuration and when the rotor is in a rotating configuration. 10. The system of claim 9, wherein the one or more logic elements calculate the position of the rotor within 30 degrees of accuracy. 11. The system of claim 9, wherein the system is configured to calculate a position of a rotor of a PMSM that is not controlled using vector control (field-oriented control). 12. The system of claim 9, wherein the system comprises the timer, an analog to digital converter (ADC), a comparator, and a multiplexer each coupled with the one or more logic elements. 13. The system of claim 9, wherein the system further comprises a sample and hold element (S/H) and an analog multiplexer (AMUX) coupled with the one or more logic elements. 14. The system of claim 9, wherein the one or more position algorithms include
tan
-
1
(
∑
i
=
1
N
-
sin
(
2
α
i
)
y
i
∑
i
=
1
N
-
cos
(
2
α
i
)
y
i
)
wherein each αi includes a value between 0 and 2π and wherein each yi includes one of the measured values. 15. A method for sensing rotor position of a motor, the method, comprising:
providing a controller and one of a timer and an analog-to-digital converter (ADC) configured to couple with a delta configuration three-phase permanent magnet synchronous motor (PMSM); applying, using the controller, a plurality of voltage pulses to the PMSM; measuring, with the one of the timer and the ADC, a plurality of values (measured values) from a three-phase inverter coupled with the PMSM, each of the measured values corresponding with one of the plurality of voltage pulses and comprising one of a current value corresponding with an inductance of the PMSM and a time value corresponding with an inductance of the PMSM, and; calculating, with one or more logic elements coupled with the PMSM, using one or more position algorithms, a position of a rotor of the PMSM relative to a stator of the PMSM; wherein the one or more position algorithms employ a least squares method with the plurality of values to calculate the position of the rotor when the rotor is in a stopped configuration and when the rotor is in a rotating configuration; and wherein the one or more logic elements are configured to calculate a position of a rotor of a PMSM that is not controlled using vector control (field-oriented control). 16. The method of claim 15, wherein the one or more position algorithms includes one of
tan
-
1
(
∑
i
=
1
N
-
sin
(
2
α
i
)
y
i
∑
i
=
1
N
-
cos
(
2
α
i
)
y
i
)
and
tan
-
1
(
∑
i
=
1
N
sin
(
2
α
i
)
y
i
∑
i
=
1
N
cos
(
2
α
i
)
y
i
)
wherein each αi includes a value between 0 and 2π and wherein each yi includes one of the measured values. 17. The method of claim 15, further comprising calculating, with the one or more logic elements, the position of the rotor relative to the stator when the rotor is in the stopped configuration. 18. The method of claim 15, further comprising coupling the timer with the PMSM and toggling the timer between a start configuration and a stop configuration using a signal processor in response to an input from a comparator. 19. The method of claim 15, further comprising coupling the ADC with the PMSM, converting an analog signal from the three-phase inverter to a digital signal using the ADC, and communicating the digital signal from the ADC to the one or more logic elements. 20. The method of claim 15, wherein the measured values are measured using one or more elements coupled with one or more shunt resistors that are coupled with the three-phase inverter. | 2,800 |
11,704 | 11,704 | 15,494,890 | 2,837 | An air core reactor for use in an electric power transmission and distribution system or in an electric power system of an electrical plant is provided. The air core reactor comprises an electrically insulated support structure, an outer surface of a coil of windings configured to operate at a potential and isolated to ground or other potentials by the electrically insulated support structure and a projectile resistant cylinder that attaches directly to the outer surface of the coil of windings. The projectile resistant cylinder is configured as an integrated barrier to provide a first measure of survivability to the air core reactor such that the integrated barrier enables a continued operation of equipment after a threat has been eliminated. | 1. An air core reactor for use in an electric power transmission and distribution system or in an electric power system of an electrical plant, the air core reactor comprising:
an electrically insulated support structure;
an outer surface of a coil of windings configured to operate at a potential and isolated to ground or other potentials by the electrically insulated support structure; and
a projectile resistant cylinder that attaches directly to the outer surface of the coil of windings, the projectile resistant cylinder is configured as an integrated barrier to provide a first measure of survivability to the air core reactor such that the integrated barrier enables a continued operation of equipment after a threat has been eliminated. 2. The air core reactor of claim 1, wherein the integrated barrier is sacrificial in nature so as to improve survivability of the air core reactor during an incident and not to remain operating indefinitely with any damage incurred during hostility. 3. The air core reactor of claim 1, wherein the integrated barrier in conjunction with either a composite rod or a hollow composite station post insulating component to give a second measure of survivability to the air core reactor. 4. The air core reactor of claim 1, wherein the integrated barrier includes three layers. 5. The air core reactor of claim 3, wherein the three layers include:
an outer binding layer; a middle fragmentation layer next to the outer binding layer; and an inner absorption layer to sandwich the middle fragmentation layer between the outer binding layer and the inner absorption layer. 6. The air core reactor of claim 1, wherein the integrated barrier includes an outer binding layer configured to make the air core reactor appear nondescript from a typical air core reactor. 7. The air core reactor of claim 6, wherein the outer binding layer comprises fiberglass roving and epoxy resin. 8. The air core reactor of claim 1, wherein the integrated barrier includes a middle fragmentation layer configured to disperse energy of a projectile via fragmenting the projectile. 9. The air core reactor of claim 8, wherein the middle fragmentation layer comprises a ceramic material. 10. The air core reactor of claim 1, wherein the integrated barrier includes an inner absorption layer configured to decelerate fragments of a projectile and absorb any remaining energy. 11. The air core reactor of claim 10, wherein the inner absorption layer comprises a combination of fiberglass roving, reinforced cloths and epoxy resin. 12. An air core reactor for use in an electric power transmission and distribution system or in an electric power system of an electrical plant, the air core reactor comprising:
a projectile resistant cylinder that attaches directly to an outer surface of a coil of windings, the projectile resistant cylinder is configured as an integrated barrier to provide a first measure of survivability to the air core reactor such that the integrated barrier enables a continued operation of equipment after a threat has been eliminated, wherein the integrated barrier includes:
an outer binding layer,
a middle fragmentation layer next to the outer binding layer, and
an inner absorption layer to sandwich the middle fragmentation layer between the outer binding layer and the inner absorption layer. 13. The air core reactor of claim 12, wherein the outer binding layer is configured to make the air core reactor appear nondescript from a typical air core reactor. 14. The air core reactor of claim 13, wherein the outer binding layer comprises fiberglass roving and epoxy resin. 15. The air core reactor of claim 14, wherein the middle fragmentation layer is configured to disperse energy of a projectile via fragmenting the projectile. 16. The air core reactor of claim 15, wherein the middle fragmentation layer comprises a ceramic material. 17. The air core reactor of claim 16, wherein the inner absorption layer is configured to decelerate fragments of a projectile and absorb any remaining energy. 18. The air core reactor of claim 17, wherein the inner absorption layer comprises a combination of fiberglass roving, reinforced cloths and epoxy resin. 19. A method of shielding an air core reactor, the method comprising:
providing a projectile resistant cylinder that attaches directly to an outer surface of a coil of windings, the projectile resistant cylinder is configured as an integrated barrier to provide a first measure of survivability to the air core reactor such that the integrated barrier enables a continued operation of equipment after a threat has been eliminated, wherein the integrated barrier includes: an outer binding layer, a middle fragmentation layer next to the outer binding layer, and an inner absorption layer to sandwich the middle fragmentation layer between the outer binding layer and the inner absorption layer. 20. The method of claim 19, wherein the outer binding layer is configured to make the air core reactor appear nondescript from a typical air core reactor,
wherein the middle fragmentation layer is configured to disperse energy of a projectile via fragmenting the projectile, and wherein the inner absorption layer is configured to decelerate fragments of a projectile and absorb any remaining energy. | An air core reactor for use in an electric power transmission and distribution system or in an electric power system of an electrical plant is provided. The air core reactor comprises an electrically insulated support structure, an outer surface of a coil of windings configured to operate at a potential and isolated to ground or other potentials by the electrically insulated support structure and a projectile resistant cylinder that attaches directly to the outer surface of the coil of windings. The projectile resistant cylinder is configured as an integrated barrier to provide a first measure of survivability to the air core reactor such that the integrated barrier enables a continued operation of equipment after a threat has been eliminated.1. An air core reactor for use in an electric power transmission and distribution system or in an electric power system of an electrical plant, the air core reactor comprising:
an electrically insulated support structure;
an outer surface of a coil of windings configured to operate at a potential and isolated to ground or other potentials by the electrically insulated support structure; and
a projectile resistant cylinder that attaches directly to the outer surface of the coil of windings, the projectile resistant cylinder is configured as an integrated barrier to provide a first measure of survivability to the air core reactor such that the integrated barrier enables a continued operation of equipment after a threat has been eliminated. 2. The air core reactor of claim 1, wherein the integrated barrier is sacrificial in nature so as to improve survivability of the air core reactor during an incident and not to remain operating indefinitely with any damage incurred during hostility. 3. The air core reactor of claim 1, wherein the integrated barrier in conjunction with either a composite rod or a hollow composite station post insulating component to give a second measure of survivability to the air core reactor. 4. The air core reactor of claim 1, wherein the integrated barrier includes three layers. 5. The air core reactor of claim 3, wherein the three layers include:
an outer binding layer; a middle fragmentation layer next to the outer binding layer; and an inner absorption layer to sandwich the middle fragmentation layer between the outer binding layer and the inner absorption layer. 6. The air core reactor of claim 1, wherein the integrated barrier includes an outer binding layer configured to make the air core reactor appear nondescript from a typical air core reactor. 7. The air core reactor of claim 6, wherein the outer binding layer comprises fiberglass roving and epoxy resin. 8. The air core reactor of claim 1, wherein the integrated barrier includes a middle fragmentation layer configured to disperse energy of a projectile via fragmenting the projectile. 9. The air core reactor of claim 8, wherein the middle fragmentation layer comprises a ceramic material. 10. The air core reactor of claim 1, wherein the integrated barrier includes an inner absorption layer configured to decelerate fragments of a projectile and absorb any remaining energy. 11. The air core reactor of claim 10, wherein the inner absorption layer comprises a combination of fiberglass roving, reinforced cloths and epoxy resin. 12. An air core reactor for use in an electric power transmission and distribution system or in an electric power system of an electrical plant, the air core reactor comprising:
a projectile resistant cylinder that attaches directly to an outer surface of a coil of windings, the projectile resistant cylinder is configured as an integrated barrier to provide a first measure of survivability to the air core reactor such that the integrated barrier enables a continued operation of equipment after a threat has been eliminated, wherein the integrated barrier includes:
an outer binding layer,
a middle fragmentation layer next to the outer binding layer, and
an inner absorption layer to sandwich the middle fragmentation layer between the outer binding layer and the inner absorption layer. 13. The air core reactor of claim 12, wherein the outer binding layer is configured to make the air core reactor appear nondescript from a typical air core reactor. 14. The air core reactor of claim 13, wherein the outer binding layer comprises fiberglass roving and epoxy resin. 15. The air core reactor of claim 14, wherein the middle fragmentation layer is configured to disperse energy of a projectile via fragmenting the projectile. 16. The air core reactor of claim 15, wherein the middle fragmentation layer comprises a ceramic material. 17. The air core reactor of claim 16, wherein the inner absorption layer is configured to decelerate fragments of a projectile and absorb any remaining energy. 18. The air core reactor of claim 17, wherein the inner absorption layer comprises a combination of fiberglass roving, reinforced cloths and epoxy resin. 19. A method of shielding an air core reactor, the method comprising:
providing a projectile resistant cylinder that attaches directly to an outer surface of a coil of windings, the projectile resistant cylinder is configured as an integrated barrier to provide a first measure of survivability to the air core reactor such that the integrated barrier enables a continued operation of equipment after a threat has been eliminated, wherein the integrated barrier includes: an outer binding layer, a middle fragmentation layer next to the outer binding layer, and an inner absorption layer to sandwich the middle fragmentation layer between the outer binding layer and the inner absorption layer. 20. The method of claim 19, wherein the outer binding layer is configured to make the air core reactor appear nondescript from a typical air core reactor,
wherein the middle fragmentation layer is configured to disperse energy of a projectile via fragmenting the projectile, and wherein the inner absorption layer is configured to decelerate fragments of a projectile and absorb any remaining energy. | 2,800 |
11,705 | 11,705 | 15,328,354 | 2,875 | The invention provides a lamp ( 1 ) comprising a light source ( 10 ), and a light transmissive heat pipe ( 251 ) configured to dissipate thermal energy from the light source ( 10 ), wherein the heat pipe ( 251 ) has an internal surface ( 53 ) and includes a heat pipe working fluid ( 252 ), wherein the heat pipe ( 251 ) further includes a flexible conduit ( 270 ) configured as wick, wherein the flexible conduit ( 270 ) comprises a flexible conduit connection part ( 271 a ), an outer face ( 273 ), a longitudinal channel ( 274 ) with an opening at an end ( 271, 272 ), and at least one side opening ( 275 ) in the outer face ( 273 ) to the longitudinal channel ( 274 ), wherein the flexible conduit ( 270 ) is connected at the flexible conduit connection part ( 271 a ) with the internal surface ( 53 ) at a first position ( 51 ). | 1. A lamp comprising a light source, configured to generate light source light, and a light transmissive heat pipe configured to dissipate thermal energy from the light source, wherein at least part of the heat pipe is transmissive for at least part of the light source light and wherein the light source is configured to provide at least part of the light source light downstream from the heat pipe, wherein the heat pipe has an internal surface and includes a heat pipe working fluid, wherein the heat pipe further includes a flexible conduit configured as wick, wherein the flexible conduit comprises a flexible conduit connection part, an outer face, a longitudinal channel with an opening at an end, and at least one side opening in the outer face to the longitudinal channel, wherein the flexible conduit is connected at the flexible conduit connection part with the internal surface at a first position, and wherein the light source is configured external from the light transmissive heat pipe. 2. The lamp according to claim 1, wherein the longitudinal channel has an equivalent circular diameter selected from the range of 10-1000 μm. 3. The lamp according to claim 1, wherein the flexible conduit has a length which is large enough to be in physical contact with a part of the internal surface most remote from the first position. 4. The lamp according to claim 1, wherein the flexible conduit is provided by a helical structure and wherein the side opening is a helically shaped side opening provided by said helical structure, wherein the helical structure has a diameter selected from the range of 5-500 μm. 5. The lamp according to claim 1, wherein the side opening has a smallest dimension selected from the range of 0.1-500 μm. 6. The lamp according to claim 1, wherein the flexible conduit comprises a plurality of side openings. 7. The lamp according to claim 1, wherein the flexible conduit comprises a light transmissive material. 8. The lamp according to claim 1, wherein the flexible conduit is connected at the flexible conduit connection part with the internal surface at the first position via a sol-gel coating. 9. The lamp according to claim 1, comprising:
a solid state light source and a first envelope at least partially enclosing the solid state light source, thereby forming a first cavity hosting said solid state light source, wherein at least part of the first envelope is transmissive for visible light generated by the solid state light source; a second envelope at least partially enclosing the first envelope, wherein the first envelope and the second envelope provide a second cavity at least partially enclosing the solid state light source, wherein at least part of the second envelope is transmissive for visible light generated by the solid state light source and transmitted through the first envelope into the second cavity, wherein the second cavity is configured as said heat pipe comprising said heat pipe working fluid. 10. The lamp according to claim 9, further comprising a solid state light source support in thermal contact with the first envelope at the first position. 11. The lamp according to claim 9, wherein the solid state light source support includes a heat sink, and wherein the heat sink is in physical contact with the first envelope at the first position. 12. The lamp according to claim 9, wherein one or more of the first envelope and the second envelope comprise a material independently selected from the group consisting of glass, a translucent ceramic, and a light transmissive polymer, and wherein the second envelope has the shape of a bulb lamp, a candle lamp, or a tubular lamp. 13. The lamp according to claim 9, wherein the heat pipe working fluid comprises one or more of H2O, methanol, ethanol, 1-propanol, isopropanol, butanol, acetone, and ammonia. 14. A light transmissive heat pipe configured to dissipate thermal energy from a light source, wherein at least part of the heat pipe is transmissive for visible light, wherein the heat pipe has an internal surface and includes a heat pipe working fluid, wherein the heat pipe further includes a flexible conduit configured as wick, wherein the flexible conduit comprises a flexible conduit connection part, an outer face, a longitudinal channel with an opening at an end, and at least one side opening in the outer face to the longitudinal channel, wherein the flexible conduit is connected at the flexible conduit connection part with the internal surface at a first position. 15. The light transmissive heat pipe according to claim 14, wherein the longitudinal channel has an equivalent circular diameter selected from the range of 10-1000 μm, wherein the flexible conduit is provided by a helical structure and wherein the side opening is a helically shaped side opening provided by said helical structure wherein the helical structure has a diameter selected from the range of 5-500 μm, and wherein the side opening has a smallest dimension selected from the range of 0.1-500 μm. 16. A luminaire comprising at least one lamp according claim 1. | The invention provides a lamp ( 1 ) comprising a light source ( 10 ), and a light transmissive heat pipe ( 251 ) configured to dissipate thermal energy from the light source ( 10 ), wherein the heat pipe ( 251 ) has an internal surface ( 53 ) and includes a heat pipe working fluid ( 252 ), wherein the heat pipe ( 251 ) further includes a flexible conduit ( 270 ) configured as wick, wherein the flexible conduit ( 270 ) comprises a flexible conduit connection part ( 271 a ), an outer face ( 273 ), a longitudinal channel ( 274 ) with an opening at an end ( 271, 272 ), and at least one side opening ( 275 ) in the outer face ( 273 ) to the longitudinal channel ( 274 ), wherein the flexible conduit ( 270 ) is connected at the flexible conduit connection part ( 271 a ) with the internal surface ( 53 ) at a first position ( 51 ).1. A lamp comprising a light source, configured to generate light source light, and a light transmissive heat pipe configured to dissipate thermal energy from the light source, wherein at least part of the heat pipe is transmissive for at least part of the light source light and wherein the light source is configured to provide at least part of the light source light downstream from the heat pipe, wherein the heat pipe has an internal surface and includes a heat pipe working fluid, wherein the heat pipe further includes a flexible conduit configured as wick, wherein the flexible conduit comprises a flexible conduit connection part, an outer face, a longitudinal channel with an opening at an end, and at least one side opening in the outer face to the longitudinal channel, wherein the flexible conduit is connected at the flexible conduit connection part with the internal surface at a first position, and wherein the light source is configured external from the light transmissive heat pipe. 2. The lamp according to claim 1, wherein the longitudinal channel has an equivalent circular diameter selected from the range of 10-1000 μm. 3. The lamp according to claim 1, wherein the flexible conduit has a length which is large enough to be in physical contact with a part of the internal surface most remote from the first position. 4. The lamp according to claim 1, wherein the flexible conduit is provided by a helical structure and wherein the side opening is a helically shaped side opening provided by said helical structure, wherein the helical structure has a diameter selected from the range of 5-500 μm. 5. The lamp according to claim 1, wherein the side opening has a smallest dimension selected from the range of 0.1-500 μm. 6. The lamp according to claim 1, wherein the flexible conduit comprises a plurality of side openings. 7. The lamp according to claim 1, wherein the flexible conduit comprises a light transmissive material. 8. The lamp according to claim 1, wherein the flexible conduit is connected at the flexible conduit connection part with the internal surface at the first position via a sol-gel coating. 9. The lamp according to claim 1, comprising:
a solid state light source and a first envelope at least partially enclosing the solid state light source, thereby forming a first cavity hosting said solid state light source, wherein at least part of the first envelope is transmissive for visible light generated by the solid state light source; a second envelope at least partially enclosing the first envelope, wherein the first envelope and the second envelope provide a second cavity at least partially enclosing the solid state light source, wherein at least part of the second envelope is transmissive for visible light generated by the solid state light source and transmitted through the first envelope into the second cavity, wherein the second cavity is configured as said heat pipe comprising said heat pipe working fluid. 10. The lamp according to claim 9, further comprising a solid state light source support in thermal contact with the first envelope at the first position. 11. The lamp according to claim 9, wherein the solid state light source support includes a heat sink, and wherein the heat sink is in physical contact with the first envelope at the first position. 12. The lamp according to claim 9, wherein one or more of the first envelope and the second envelope comprise a material independently selected from the group consisting of glass, a translucent ceramic, and a light transmissive polymer, and wherein the second envelope has the shape of a bulb lamp, a candle lamp, or a tubular lamp. 13. The lamp according to claim 9, wherein the heat pipe working fluid comprises one or more of H2O, methanol, ethanol, 1-propanol, isopropanol, butanol, acetone, and ammonia. 14. A light transmissive heat pipe configured to dissipate thermal energy from a light source, wherein at least part of the heat pipe is transmissive for visible light, wherein the heat pipe has an internal surface and includes a heat pipe working fluid, wherein the heat pipe further includes a flexible conduit configured as wick, wherein the flexible conduit comprises a flexible conduit connection part, an outer face, a longitudinal channel with an opening at an end, and at least one side opening in the outer face to the longitudinal channel, wherein the flexible conduit is connected at the flexible conduit connection part with the internal surface at a first position. 15. The light transmissive heat pipe according to claim 14, wherein the longitudinal channel has an equivalent circular diameter selected from the range of 10-1000 μm, wherein the flexible conduit is provided by a helical structure and wherein the side opening is a helically shaped side opening provided by said helical structure wherein the helical structure has a diameter selected from the range of 5-500 μm, and wherein the side opening has a smallest dimension selected from the range of 0.1-500 μm. 16. A luminaire comprising at least one lamp according claim 1. | 2,800 |
11,706 | 11,706 | 14,988,318 | 2,837 | A saturation resistant electromagnetic device may include a core in which a magnetic flux is generable and an opening through the core. A spacer may be disposed within the opening and may extend through the core. The spacer may define a channel through the core. A primary conductor winding may be received in the channel of the spacer and may extend through the core. An electric current flowing through the primary conductor winding generates a magnetic field about the primary conductor winding. The magnetic field includes electromagnetic energy. The spacer may include a configuration to absorb a predetermined portion of the electromagnetic energy and a remaining portion of the electromagnetic energy is absorbed by the core to generate a magnetic flux flow in the core. | 1. A saturation resistant electromagnetic device (100, 200, 302, 400), comprising:
a core (102) in which a magnetic flux (104) is generable; an opening (110) through the core; a spacer (114) disposed within the opening and extending through the core, the spacer defining a channel (116) through the core; and a primary conductor winding (120) received in the channel of the spacer and extending through the core, wherein an electric current flowing through the primary conductor winding generates a magnetic field about the primary conductor winding, the magnetic field comprising electromagnetic energy and the spacer comprising a configuration (124) to absorb a predetermined portion of the electromagnetic energy and a remaining portion of the electromagnetic energy being absorbed by the core to generate a magnetic flux flow in the core. 2. The saturation resistant electromagnetic device of claim 1, wherein the configuration of the spacer is adapted to decrease a magnetic coupling between the primary conductor winding and the core by a preset amount that prevents saturation of the core. 3. The saturation resistant electromagnetic device of claim 1, wherein the configuration of the spacer defines a magnetic flux resistive and absorbing volume (300). 4. The saturation resistant electromagnetic device of claim 1, wherein the spacer comprises a non-magnetic material. 5. The saturation resistant electromagnetic device of claim 1, wherein the spacer comprises a material that includes a magnetic flux resistive property or a magnetic flux absorbing property. 6. The saturation resistant electromagnetic device of claim 1, wherein the spacer is impregnated with a selected concentration of electrically conductive or semi-conductive particles (304) that causes a certain absorption of the magnetic flux and conversion of the magnetic flux to heat energy that prevents saturation of the core. 7. The saturation resistant electromagnetic device of claim 6, wherein the electrically conductive or semi-conductive particles comprise at least one of carbon particles, aluminum particles and iron particles. 8. The saturation resistant electromagnetic device of claim 1, wherein the spacer comprises a predetermined thickness (T) between an outer wall (126) that abuts an inner surface (128) of the core and an inner wall (130) that defines the channel. 9. The saturation resistant electromagnetic device of claim 8, wherein the predetermined thickness of the spacer is greater than or equal to a thickness of the core. 10. The saturation resistant electromagnetic device of claim 1, wherein a magnetic field density is less at an inner surface of the core while a total magnetic flux generated by the current in the primary conductor winding is unchanged. 11. The saturation resistant electromagnetic device of claim 1, wherein the core is an elongated core comprising one of a one-piece structure and a laminated structure (106) including a plurality of plates (108) stacked on one another. 12. A saturation resistant electromagnetic device (100, 200, 302, 400), comprising:
a core (102) in which a magnetic flux is generable; an opening (110) through the core, a cross-section of the opening defining an elongated slot (112); a spacer (114) disposed within the opening and extending through the core, the spacer defining a channel (116) through the core, a cross-section of the channel defining an elongated aperture (118); and a primary conductor winding (120) received in the channel of the spacer and extending through the core, wherein an electric current flowing through the primary conductor winding generates a magnetic field about the primary conductor winding, the magnetic field comprising electromagnetic energy and the spacer comprising a configuration (124) to absorb a predetermined portion of the electromagnetic energy and a remaining portion of the electromagnetic energy being absorbed by the core to generate a magnetic flux flow in the core. 13. The saturation resistant electromagnetic device of claim 12, wherein the configuration of the spacer is adapted to decrease a magnetic coupling between the primary conductor winding and the core by a preset amount that prevents saturation of the core. 14. The saturation resistant electromagnetic device of claim 13, wherein the spacer comprises a non-magnetic material. 15. The saturation resistant electromagnetic device of claim 13, wherein the spacer comprises a material that includes a magnetic flux resistive property or a magnetic flux absorbing property. 16. The saturation resistant electromagnetic device of claim 15, wherein the spacer is impregnated with a selected concentration of electrically conductive or semi-conductive particles (304) that causes a certain absorption of the magnetic flux and conversion of the magnetic flux to heat energy that prevents saturation of the core. 17. A method (500) for preventing saturation of an electromagnetic device, comprising:
providing a core in which a magnetic flux is generable (502); disposing a spacer within an opening in the core and extending the spacer through the core, the spacer defining a channel through the core (504); extending a primary conductor winding through the channel of the spacer and extending the primary conductor winding through the core (506); and passing an electric current through the primary conductor winding to generate a magnetic field about the primary conductor winding (512), the magnetic field comprising electromagnetic energy and the spacer comprising a configuration to absorb a predetermined portion of the electromagnetic energy and a remaining portion of the electromagnetic energy being absorbed by the core to generate a magnetic flux flow in the core. 18. The method of claim 17, further comprising configuring the spacer to decrease a magnetic coupling between the primary conductor winding and the core by a preset amount that prevents saturation of the core. 19. The method of claim 18, wherein configuring the spacer comprises including a material in the spacer that includes a magnetic flux resistive property or a magnetic flux absorbing property. 20. The method of claim 19, wherein configuring the spacer comprises impregnating the spacer with a selected concentration of electrically conductive or semi-conductive particles (304) that causes a certain absorption of the magnetic flux and conversion of the magnetic flux to heat energy that prevents saturation of the core. | A saturation resistant electromagnetic device may include a core in which a magnetic flux is generable and an opening through the core. A spacer may be disposed within the opening and may extend through the core. The spacer may define a channel through the core. A primary conductor winding may be received in the channel of the spacer and may extend through the core. An electric current flowing through the primary conductor winding generates a magnetic field about the primary conductor winding. The magnetic field includes electromagnetic energy. The spacer may include a configuration to absorb a predetermined portion of the electromagnetic energy and a remaining portion of the electromagnetic energy is absorbed by the core to generate a magnetic flux flow in the core.1. A saturation resistant electromagnetic device (100, 200, 302, 400), comprising:
a core (102) in which a magnetic flux (104) is generable; an opening (110) through the core; a spacer (114) disposed within the opening and extending through the core, the spacer defining a channel (116) through the core; and a primary conductor winding (120) received in the channel of the spacer and extending through the core, wherein an electric current flowing through the primary conductor winding generates a magnetic field about the primary conductor winding, the magnetic field comprising electromagnetic energy and the spacer comprising a configuration (124) to absorb a predetermined portion of the electromagnetic energy and a remaining portion of the electromagnetic energy being absorbed by the core to generate a magnetic flux flow in the core. 2. The saturation resistant electromagnetic device of claim 1, wherein the configuration of the spacer is adapted to decrease a magnetic coupling between the primary conductor winding and the core by a preset amount that prevents saturation of the core. 3. The saturation resistant electromagnetic device of claim 1, wherein the configuration of the spacer defines a magnetic flux resistive and absorbing volume (300). 4. The saturation resistant electromagnetic device of claim 1, wherein the spacer comprises a non-magnetic material. 5. The saturation resistant electromagnetic device of claim 1, wherein the spacer comprises a material that includes a magnetic flux resistive property or a magnetic flux absorbing property. 6. The saturation resistant electromagnetic device of claim 1, wherein the spacer is impregnated with a selected concentration of electrically conductive or semi-conductive particles (304) that causes a certain absorption of the magnetic flux and conversion of the magnetic flux to heat energy that prevents saturation of the core. 7. The saturation resistant electromagnetic device of claim 6, wherein the electrically conductive or semi-conductive particles comprise at least one of carbon particles, aluminum particles and iron particles. 8. The saturation resistant electromagnetic device of claim 1, wherein the spacer comprises a predetermined thickness (T) between an outer wall (126) that abuts an inner surface (128) of the core and an inner wall (130) that defines the channel. 9. The saturation resistant electromagnetic device of claim 8, wherein the predetermined thickness of the spacer is greater than or equal to a thickness of the core. 10. The saturation resistant electromagnetic device of claim 1, wherein a magnetic field density is less at an inner surface of the core while a total magnetic flux generated by the current in the primary conductor winding is unchanged. 11. The saturation resistant electromagnetic device of claim 1, wherein the core is an elongated core comprising one of a one-piece structure and a laminated structure (106) including a plurality of plates (108) stacked on one another. 12. A saturation resistant electromagnetic device (100, 200, 302, 400), comprising:
a core (102) in which a magnetic flux is generable; an opening (110) through the core, a cross-section of the opening defining an elongated slot (112); a spacer (114) disposed within the opening and extending through the core, the spacer defining a channel (116) through the core, a cross-section of the channel defining an elongated aperture (118); and a primary conductor winding (120) received in the channel of the spacer and extending through the core, wherein an electric current flowing through the primary conductor winding generates a magnetic field about the primary conductor winding, the magnetic field comprising electromagnetic energy and the spacer comprising a configuration (124) to absorb a predetermined portion of the electromagnetic energy and a remaining portion of the electromagnetic energy being absorbed by the core to generate a magnetic flux flow in the core. 13. The saturation resistant electromagnetic device of claim 12, wherein the configuration of the spacer is adapted to decrease a magnetic coupling between the primary conductor winding and the core by a preset amount that prevents saturation of the core. 14. The saturation resistant electromagnetic device of claim 13, wherein the spacer comprises a non-magnetic material. 15. The saturation resistant electromagnetic device of claim 13, wherein the spacer comprises a material that includes a magnetic flux resistive property or a magnetic flux absorbing property. 16. The saturation resistant electromagnetic device of claim 15, wherein the spacer is impregnated with a selected concentration of electrically conductive or semi-conductive particles (304) that causes a certain absorption of the magnetic flux and conversion of the magnetic flux to heat energy that prevents saturation of the core. 17. A method (500) for preventing saturation of an electromagnetic device, comprising:
providing a core in which a magnetic flux is generable (502); disposing a spacer within an opening in the core and extending the spacer through the core, the spacer defining a channel through the core (504); extending a primary conductor winding through the channel of the spacer and extending the primary conductor winding through the core (506); and passing an electric current through the primary conductor winding to generate a magnetic field about the primary conductor winding (512), the magnetic field comprising electromagnetic energy and the spacer comprising a configuration to absorb a predetermined portion of the electromagnetic energy and a remaining portion of the electromagnetic energy being absorbed by the core to generate a magnetic flux flow in the core. 18. The method of claim 17, further comprising configuring the spacer to decrease a magnetic coupling between the primary conductor winding and the core by a preset amount that prevents saturation of the core. 19. The method of claim 18, wherein configuring the spacer comprises including a material in the spacer that includes a magnetic flux resistive property or a magnetic flux absorbing property. 20. The method of claim 19, wherein configuring the spacer comprises impregnating the spacer with a selected concentration of electrically conductive or semi-conductive particles (304) that causes a certain absorption of the magnetic flux and conversion of the magnetic flux to heat energy that prevents saturation of the core. | 2,800 |
11,707 | 11,707 | 13,997,247 | 2,884 | A security feature for protecting valuable documents, in particular for ensuring the authenticity of valuable documents, comprises a luminescent pigment which has a host lattice doped with a first luminophore and a second luminophore, with an excitation energy of the first luminophore being transferable to the second luminophore. However, in the case of the luminescent pigment according to the invention, the excitation energy is not transferred completely from the first luminophore to the second, but rather only partially. The incomplete transfer of the excitation energy is achieved by selecting suitable amount-of-substance fractions of the first and the second luminophores on the luminescent pigment. As a result of the incomplete transfer of the excitation energy, the luminescent light that is emitted by the luminescent pigment also has, in addition to a luminescence peak of the second luminophore, a luminescence peak of the first luminophore. | 1.-15. (canceled) 16. A security feature for safeguarding value documents, comprising:
a luminescence pigment that has a host lattice doped with a first luminophore and a second luminophore and that is optically excitable to emit luminescence light, wherein the luminescence pigment is configured that an excitation energy of the first luminophore generated through optical excitation of the luminescence pigment is transferable to the second luminophore through an interaction between the first luminophore and the second luminophore, wherein the substance amount fraction of the first luminophore in the luminescence pigment and the substance amount fraction of the second luminophore in the luminescence pigment are chosen such that the luminescence light of the luminescence pigment has a luminescence spectrum with a first luminescence peak emitted by the first luminophore and a second luminescence peak emitted by the second luminophore, wherein the share of the peak intensity of the second luminescence peak is at least 20% and at most 80%, preferably at least 30% and at most 70%, particularly preferably at least 40% and at most 60% in the sum of the peak intensities of the first and of the second luminescence peak. 17. The security feature according to claim 16, wherein the peak intensity of the first luminescence peak and the peak intensity of the second luminescence peak have an intensity ratio to each other that is intrinsically defined by the composition of the luminescence pigment. 18. The security feature according to claim 16, wherein the first and second luminophores are respectively substantially homogeneously distributed in a volume region of the host lattice, which volume region is both doped with the first luminophore and with the second luminophore. 19. The security feature according to claim 16, wherein the components of the luminescence pigment, in particular the host lattice and the first and the second luminophore, are chosen such that these with changed substance amount fraction of the second luminophore tend to completely transfer the excitation energy from the first to the second luminophore. 20. The security feature according to claim 16, wherein through a change of the substance amount fraction of the second luminophore, the peak intensities of the first and second luminescence peaks are changeable in mutually opposite fashion. 21. The security feature according to claim 16, wherein the peak wavelengths of the first and second luminescence peaks are spectrally spaced apart from each other by at least 20 nm, preferably at least 30 nm. 22. The security feature according to claim 16, wherein the interaction through which the excitation energy is transferable from the first luminophore to the second luminophore and takes place within a volume region of the host lattice, which volume region is both doped with the first luminophore and with the second luminophore. 23. The security feature according to claim 16, wherein the excitation energy of the first luminophore is transferable from the first luminophore to the second luminophore through a radiationless interaction. 24. The security feature according to claim 16, wherein the peak wavelengths of the first and second luminescence peaks lie in the near infrared spectral region, in particular in the spectral region between 750 nm and 2900 nm, preferably between 800 nm and 2200 nm. 25. The security feature according to claim 16, wherein the first and/or the second luminophores are chosen from the rare earth ions, in particular from the rare earth ions erbium, holmium, neodymium, thulium, ytterbium. 26. The security feature according to claim 16, wherein the host lattice is configured as an inorganic host lattice, wherein the host lattice is in particular a host lattice with a garnet structure or with a perovskite structure or an oxide or a mixed lattice with oxide ions, for example a tungstate or phosphate or niobate or tantalate or silicate or aluminate. 27. A security element or printing ink, which has a security feature according to claim 16. 28. A value document or security paper, which has a security element and/or a printing ink according to claim 27. 29. A method for proving a security feature according to claim 16, comprising
irradiating the security feature with light of a spectral region in which the luminescence pigment of the security feature absorbs, in order to optically excite the luminescence pigment to emit the luminescence light, and detecting intensities of the first and second luminescence peak contained in the luminescence spectrum of the luminescence light, and evaluating the detected intensities of the first and second luminescence peak to prove the security feature. 30. The method according to claim 29, wherein through the irradiating of the security feature an excitation energy of the first luminophore is generated, which is partly transferred from the first luminophore to the second luminophore, the excitation energy of the first luminophore
being generated directly through selective optical excitation of the first luminophore, and/or being generated through optical excitation of the host lattice and subsequent transfer of the excitation energy from the host lattice to the first luminophore. | A security feature for protecting valuable documents, in particular for ensuring the authenticity of valuable documents, comprises a luminescent pigment which has a host lattice doped with a first luminophore and a second luminophore, with an excitation energy of the first luminophore being transferable to the second luminophore. However, in the case of the luminescent pigment according to the invention, the excitation energy is not transferred completely from the first luminophore to the second, but rather only partially. The incomplete transfer of the excitation energy is achieved by selecting suitable amount-of-substance fractions of the first and the second luminophores on the luminescent pigment. As a result of the incomplete transfer of the excitation energy, the luminescent light that is emitted by the luminescent pigment also has, in addition to a luminescence peak of the second luminophore, a luminescence peak of the first luminophore.1.-15. (canceled) 16. A security feature for safeguarding value documents, comprising:
a luminescence pigment that has a host lattice doped with a first luminophore and a second luminophore and that is optically excitable to emit luminescence light, wherein the luminescence pigment is configured that an excitation energy of the first luminophore generated through optical excitation of the luminescence pigment is transferable to the second luminophore through an interaction between the first luminophore and the second luminophore, wherein the substance amount fraction of the first luminophore in the luminescence pigment and the substance amount fraction of the second luminophore in the luminescence pigment are chosen such that the luminescence light of the luminescence pigment has a luminescence spectrum with a first luminescence peak emitted by the first luminophore and a second luminescence peak emitted by the second luminophore, wherein the share of the peak intensity of the second luminescence peak is at least 20% and at most 80%, preferably at least 30% and at most 70%, particularly preferably at least 40% and at most 60% in the sum of the peak intensities of the first and of the second luminescence peak. 17. The security feature according to claim 16, wherein the peak intensity of the first luminescence peak and the peak intensity of the second luminescence peak have an intensity ratio to each other that is intrinsically defined by the composition of the luminescence pigment. 18. The security feature according to claim 16, wherein the first and second luminophores are respectively substantially homogeneously distributed in a volume region of the host lattice, which volume region is both doped with the first luminophore and with the second luminophore. 19. The security feature according to claim 16, wherein the components of the luminescence pigment, in particular the host lattice and the first and the second luminophore, are chosen such that these with changed substance amount fraction of the second luminophore tend to completely transfer the excitation energy from the first to the second luminophore. 20. The security feature according to claim 16, wherein through a change of the substance amount fraction of the second luminophore, the peak intensities of the first and second luminescence peaks are changeable in mutually opposite fashion. 21. The security feature according to claim 16, wherein the peak wavelengths of the first and second luminescence peaks are spectrally spaced apart from each other by at least 20 nm, preferably at least 30 nm. 22. The security feature according to claim 16, wherein the interaction through which the excitation energy is transferable from the first luminophore to the second luminophore and takes place within a volume region of the host lattice, which volume region is both doped with the first luminophore and with the second luminophore. 23. The security feature according to claim 16, wherein the excitation energy of the first luminophore is transferable from the first luminophore to the second luminophore through a radiationless interaction. 24. The security feature according to claim 16, wherein the peak wavelengths of the first and second luminescence peaks lie in the near infrared spectral region, in particular in the spectral region between 750 nm and 2900 nm, preferably between 800 nm and 2200 nm. 25. The security feature according to claim 16, wherein the first and/or the second luminophores are chosen from the rare earth ions, in particular from the rare earth ions erbium, holmium, neodymium, thulium, ytterbium. 26. The security feature according to claim 16, wherein the host lattice is configured as an inorganic host lattice, wherein the host lattice is in particular a host lattice with a garnet structure or with a perovskite structure or an oxide or a mixed lattice with oxide ions, for example a tungstate or phosphate or niobate or tantalate or silicate or aluminate. 27. A security element or printing ink, which has a security feature according to claim 16. 28. A value document or security paper, which has a security element and/or a printing ink according to claim 27. 29. A method for proving a security feature according to claim 16, comprising
irradiating the security feature with light of a spectral region in which the luminescence pigment of the security feature absorbs, in order to optically excite the luminescence pigment to emit the luminescence light, and detecting intensities of the first and second luminescence peak contained in the luminescence spectrum of the luminescence light, and evaluating the detected intensities of the first and second luminescence peak to prove the security feature. 30. The method according to claim 29, wherein through the irradiating of the security feature an excitation energy of the first luminophore is generated, which is partly transferred from the first luminophore to the second luminophore, the excitation energy of the first luminophore
being generated directly through selective optical excitation of the first luminophore, and/or being generated through optical excitation of the host lattice and subsequent transfer of the excitation energy from the host lattice to the first luminophore. | 2,800 |
11,708 | 11,708 | 14,399,779 | 2,875 | A light emitting arrangement ( 100 ) is provided, comprising: -a solid state light source ( 101, 201 ) adapted to emit primary light; and -a wavelength converting member ( 105, 205 ) arranged to receive said primary light and capable of converting said primary light into secondary light, the wavelength converting member and the solid state light source being mutually spaced apart; and a non-absorbing, partially transparent reflector ( 106, 206 ) arranged on a light output side of the wavelength converting member. The reflector hides the color of the phosphor and may give the arrangement a silver or golden metallic appearance, which is more desirable for many applications. By using a non-absorbing reflector, efficiency is high and also less phosphor is required, which further contributes to the improved visual appearance. | 1. A light emitting arrangement comprising:
a solid state light source adapted to emit primary light; and a wavelength converting member arranged to receive said primary light and capable of converting said primary light into secondary light, the wavelength converting member and the solid state light source being mutually spaced apart; and a non-absorbing, partially transparent reflector arranged on a light output side of the wavelength converting member, wherein primary light emitted by the solid state light source and secondary light produced by the wavelength converting member can be transmitted the non-absorbing, partially transparent reflector to exit the light emitting arrangement, and wherein the non-absorbing, partially transparent reflector has uniform reflectivity of light over the wavelength range of from 400 nm to 800 nm. 2. (canceled) 3. The light emitting arrangement according to claim 1, wherein the non-absorbing, partially transparent reflector comprises a stack of non-absorbing layers. 4. The light emitting arrangement according to claims 2, wherein each layer of said stack of non-absorbing layers has a uniform reflectivity over the wavelength range of from 400 nm to 800 nm. 5. The light emitting arrangement according to claim 1, wherein the non-absorbing, partially transparent reflector is non-metallic. 6. The light emitting arrangement according to claim 1, wherein the non-absorbing, partially transparent reflector comprises at least one non-absorbing layer comprising a material selected from dielectric materials, glass and plastic materials. 7. The light emitting arrangement according to claim 6, wherein said plastic material is selected from polycarbonate, poly methyl methacrylate, polyethylene terephthalate, and polyethylene naphthtalate. 8. The light emitting arrangement according to claim 1, wherein the non-absorbing, partially transparent reflector is a specular reflector. 9. The light emitting arrangement according to claim 1, wherein the non-absorbing, partially transparent reflector has a reflectivity in the range of from 20% to 60%. 10. The light emitting arrangement according to claim 1, comprising a light mixing chamber defined by a reflective bottom portion and at least one reflective side wall. 11. The light emitting arrangement according to claim 10, wherein the non-absorbing, partially transparent reflector forms a light exit window through which light may exit the light mixing chamber. 12. The light emitting arrangement according to claim 1, wherein the wavelength converting member is arranged on a surface of the non-absorbing, partially transparent reflector facing towards the solid state light source. 13. The light emitting arrangement according to claim 10, wherein the wavelength converting member is arranged on said reflective bottom portion and said solid state light source is arranged on said reflective side wall. 14. A lamp comprising a light emitting arrangement according to claim 1. 15. A luminaire comprising at least one light emitting arrangement according to claim 1. | A light emitting arrangement ( 100 ) is provided, comprising: -a solid state light source ( 101, 201 ) adapted to emit primary light; and -a wavelength converting member ( 105, 205 ) arranged to receive said primary light and capable of converting said primary light into secondary light, the wavelength converting member and the solid state light source being mutually spaced apart; and a non-absorbing, partially transparent reflector ( 106, 206 ) arranged on a light output side of the wavelength converting member. The reflector hides the color of the phosphor and may give the arrangement a silver or golden metallic appearance, which is more desirable for many applications. By using a non-absorbing reflector, efficiency is high and also less phosphor is required, which further contributes to the improved visual appearance.1. A light emitting arrangement comprising:
a solid state light source adapted to emit primary light; and a wavelength converting member arranged to receive said primary light and capable of converting said primary light into secondary light, the wavelength converting member and the solid state light source being mutually spaced apart; and a non-absorbing, partially transparent reflector arranged on a light output side of the wavelength converting member, wherein primary light emitted by the solid state light source and secondary light produced by the wavelength converting member can be transmitted the non-absorbing, partially transparent reflector to exit the light emitting arrangement, and wherein the non-absorbing, partially transparent reflector has uniform reflectivity of light over the wavelength range of from 400 nm to 800 nm. 2. (canceled) 3. The light emitting arrangement according to claim 1, wherein the non-absorbing, partially transparent reflector comprises a stack of non-absorbing layers. 4. The light emitting arrangement according to claims 2, wherein each layer of said stack of non-absorbing layers has a uniform reflectivity over the wavelength range of from 400 nm to 800 nm. 5. The light emitting arrangement according to claim 1, wherein the non-absorbing, partially transparent reflector is non-metallic. 6. The light emitting arrangement according to claim 1, wherein the non-absorbing, partially transparent reflector comprises at least one non-absorbing layer comprising a material selected from dielectric materials, glass and plastic materials. 7. The light emitting arrangement according to claim 6, wherein said plastic material is selected from polycarbonate, poly methyl methacrylate, polyethylene terephthalate, and polyethylene naphthtalate. 8. The light emitting arrangement according to claim 1, wherein the non-absorbing, partially transparent reflector is a specular reflector. 9. The light emitting arrangement according to claim 1, wherein the non-absorbing, partially transparent reflector has a reflectivity in the range of from 20% to 60%. 10. The light emitting arrangement according to claim 1, comprising a light mixing chamber defined by a reflective bottom portion and at least one reflective side wall. 11. The light emitting arrangement according to claim 10, wherein the non-absorbing, partially transparent reflector forms a light exit window through which light may exit the light mixing chamber. 12. The light emitting arrangement according to claim 1, wherein the wavelength converting member is arranged on a surface of the non-absorbing, partially transparent reflector facing towards the solid state light source. 13. The light emitting arrangement according to claim 10, wherein the wavelength converting member is arranged on said reflective bottom portion and said solid state light source is arranged on said reflective side wall. 14. A lamp comprising a light emitting arrangement according to claim 1. 15. A luminaire comprising at least one light emitting arrangement according to claim 1. | 2,800 |
11,709 | 11,709 | 15,795,439 | 2,838 | A switched mode power supply comprises a control signal generator arranged to generate first and second control signals via first and second outputs, respectively, which are coupled to respective first and second inputs of a switching stage, by means of respective first and second control signal paths. The switching stage is arranged to, responsive to the first and second control signals, alternately charge and discharge the reactive element by coupling it alternately to first and second supply voltages. An adjustable delay stage in one of the first and second signal paths is arranged to control an adjustable delay so that a first delay experienced by the first control signal passing from the control signal generator's first output to the switching stage's first input is substantially equal to a second delay experienced by the second control signal passing from the control signal generator's second output to the switching stage's second input. | 1. A switched mode power supply comprising:
a reactive element comprising a first terminal and a second terminal, the second terminal being configured to provide an output voltage for the switched mode power supply; a switching stage having first and second inputs, the switching stage being configured to charge and discharge the reactive element, via the first terminal, during first charging time periods and first discharging time periods, respectively, dependent on first and second control signals applied to the first and second inputs, respectively; a control signal generator arranged to generate the first and second control signals at the first and second inputs, respectively, via respective first and second control signal paths, wherein the first control signal path is configured to deliver the first control signal to the first input of the switching stage at a first drive voltage, during the first charging time periods, and wherein the first control signal path is coupled to the first node and is arranged to determine the first drive voltage dependent on a difference between a first node voltage at a first node, in the first control signal path, and a voltage at the first terminal of the reactive element; a first capacitive element coupled between the reactive element and the first node; a voltage regulator coupled to the first node and configured to control the first node voltage; a delay detector arranged to determine a relative delay between the first and second control signals, through the first and second control signal paths; and an adjustable delay stage in one of the first and second control signal paths, the adjustable delay stage being configured to control an adjustable delay to compensate for the relative delay. 2. The switched mode power supply of claim 1, wherein the switching stage is configured to:
(a) during the first charging time periods, responsive to the first control signal, couple the reactive element to a first supply voltage for charging the reactive element, and responsive to the second control signal, decouple the reactive element from a second supply voltage lower than the first supply voltage, the first supply voltage being lower than the first drive voltage, (b) during the first discharging time periods, responsive to the first control signal, decouple the reactive element from the first supply voltage, and responsive to the second control signal, couple the reactive element to the second supply voltage for discharging the reactive element, and (c) during decoupling time periods, responsive to the first control signal, decouple the reactive element from the first supply voltage, and responsive to the second control signal, decouple the reactive element from the second supply voltage;
wherein the first charging time periods and the first discharging time periods alternate and are each spaced apart by one of the decoupling time periods; and
wherein the switched power supply further comprises a first charging diode coupled between the first node and a third power supply rail at a third supply voltage higher than the second supply voltage, and arranged for charging the first capacitive element from the third supply voltage; and
wherein the voltage regulator is coupled to a fourth power supply rail at a fourth supply voltage higher than the third supply voltage and is configured to control the first node voltage dependent on the fourth supply voltage. 3. The switched mode power supply of claim 2, wherein the switching stage comprises:
a first n-channel transistor coupled between the first terminal of the reactive element and a first power supply rail at the first supply voltage and having a first gate coupled to the first input of the switching stage, and a second n-channel transistor coupled between the first terminal of the reactive element and a second power supply rail at the second supply voltage and having a second gate coupled to the second input of the switching stage; wherein the first n-channel transistor is arranged, responsive to the first control signal, to couple the first terminal of the reactive element to a first power supply rail at the first supply voltage during the first charging time periods and to decouple the first terminal of the reactive element from the first power supply rail during the first discharging time periods and the decoupling time periods; wherein the second n-channel transistor is arranged, responsive to the second control signal, to decouple the first terminal of the reactive element from a second power supply rail at the second supply voltage during the first charging time periods and the decoupling time periods and to couple the first terminal of the reactive element to the second power supply rail during the first discharging time periods. 4. The switched mode power supply of claim 3, wherein the first control signal path comprises a first power supply input coupled to the first node and a second power supply input coupled to the first terminal of the reactive element. 5. The switched mode power supply of claim 4, comprising:
a second capacitive element having a first terminal coupled to the first terminal of the reactive element and a second terminal coupled to a second node; and a second charging diode coupled between the second node and the fourth power supply rail and arranged for charging the second capacitive element from the fourth supply voltage; wherein the voltage regulator comprises a first regulator terminal coupled to the second node, a second regulator output coupled to the first node, and a third regulator terminal coupled to the first terminal of the reactive element, and wherein the voltage regulator is arranged to control the first node voltage dependent on a difference between a second node voltage at the second node and the voltage at the first terminal of the reactive element. 6. The switched mode power supply of claim 1, wherein the reactive element comprises an inductive element coupled between the first and second terminals, and an output capacitive element coupled to the second terminal. 7. The switched mode power supply of claim 1, wherein the delay detector comprises a delay detection capacitive element coupled to a charge control circuit, wherein the charge control circuit is arranged to alternately charge the delay detection capacitive element during second charging time periods of duration dependent on the first delay and discharge the delay detection capacitive element during second discharging time periods of duration dependent on the second delay, and wherein the delay indication signal is dependent on a voltage across the delay detection capacitive element. 8. The switched mode power supply of claim 7, wherein the charge control circuit comprises:
a first comparison circuit arranged to determine the duration of the second charging time periods dependent on a time difference between the first control signal at the first output of the control signal generator and the first control signal at the first input of the switching stage; and a second comparison circuit arranged to determine the duration of the second discharging time periods dependent on a time difference between the second control signal at the second output of the control signal generator and the second control signal at the second input of the switching stage. 9. The switched mode power supply of claim 8, wherein the first comparison circuit is a logical AND gate and the second comparison circuit is a logical AND gate. 10. The switched mode power supply of claim 7, wherein the charge control circuit comprises:
a third n-channel transistor coupled to a third node; a fourth n-channel transistor coupled to a third node; wherein the charge control circuit is arranged to generate a shadow signal at the third node by switching the third n-channel transistor responsive to the first control signal at the first input of the switching stage and switching the fourth n-channel transistor responsive to the second control signal at the second input of the switching stage; a first comparison circuit arranged to determine the duration of the second charging time periods dependent on a time difference between the first control signal at the first output of the control signal generator and the shadow signal; and a second comparison circuit arranged to determine the duration of the second discharging time periods dependent on a time difference between the second control signal at the second output of the control signal generator and the shadow signal. 11. The switched mode power supply of claim 10, wherein the first comparison circuit is a logical AND gate and the second comparison circuit is a logical AND gate. 12. An amplifier comprising the switched mode power supply of claim 1. 13. A wireless communication device comprising the amplifier of claim 1. 14. A switched mode power supply comprising:
a reactive element comprising a first terminal, for charging and discharging the reactive element, and a second terminal, for an output voltage; a switching stage having a first input and a second input; and a control signal generator arranged to generate a first control signal at a first output of the control signal generator and a second control signal at a second output of the control signal generator, wherein the first output of the control signal generator is coupled to the first input of the switching stage by means of a first control signal path and the second output of the control signal generator is coupled to the second input of the switching stage by means of a second control signal path; wherein the switching stage is arranged to
(a) during first charging time periods, responsive to the first control signal, couple the reactive element to a first supply voltage for charging the reactive element, and responsive to the second control signal, decouple the reactive element from a second supply voltage lower than the first supply voltage,
(b) during first discharging time periods, responsive to the first control signal, decouple the reactive element from the first supply voltage, and responsive to the second control signal, couple the reactive element to the second supply voltage for discharging the reactive element, and
(c) during decoupling time periods, responsive to the first control signal, decouple the reactive element from the first supply voltage, and responsive to the second control signal, decouple the reactive element from the second supply voltage,
wherein the first charging time periods and the first discharging time periods alternate and are each spaced apart by one of the decoupling time periods;
a first capacitive element having a first terminal coupled to the first terminal of the reactive element and a second terminal coupled to a first node, wherein the first control signal path is coupled to the first node and is arranged to determine the first drive voltage dependent on a difference between a first node voltage at the first node and a voltage at the first terminal of the reactive element, the first drive voltage being the voltage at which the first control signal is delivered to the first input of the switching stage during the first charging time periods; a first charging diode coupled between the first node and a third power supply rail at a third supply voltage higher than the second supply voltage, and arranged for charging the first capacitive element from the third supply voltage; a voltage regulator coupled to the first node and to a fourth power supply rail at a fourth supply voltage higher than the third supply voltage, wherein the voltage regulator is arranged to control the first node voltage dependent on the fourth supply voltage; a delay detector arranged to generate a delay indicator signal indicative of a relative delay between the first control signal at the first input of the switching stage and the second control signal at the second input of the switching stage; and an adjustable delay stage in one of the first and second control signal paths and arranged to, responsive to the delay indicator signal, control an adjustable delay so that a first delay experienced by the first control signal passing from the first output of the control signal generator to the first input of the switching stage is substantially equal to a second delay experienced by the second control signal passing from the second output of the control signal generator to the second input of the switching stage. 15. The switched mode power supply of claim 14, wherein the reactive element comprises an inductive element coupled between the first and second terminals, and an output capacitive element coupled to the second terminal. 16. The switched mode power supply of claim 14, the switching stage comprising:
a first n-channel transistor coupled between a first terminal of the reactive element and a first power supply rail at the first supply voltage and having a first gate coupled to the first input of the switching stage, and a second n-channel transistor coupled between the first terminal of the reactive element and a second power supply rail at the second supply voltage and having a second gate coupled to the second input of the switching stage; wherein the first n-channel transistor is arranged, responsive to the first control signal, to couple the first terminal of the reactive element to a first power supply rail at the first supply voltage during the first charging time periods and to decouple the first terminal of the reactive element from the first power supply rail during the first discharging time periods and the decoupling time periods; wherein the second n-channel transistor is arranged, responsive to the second control signal, to decouple the first terminal of the reactive element from a second power supply rail at the second supply voltage during the first charging time periods and the decoupling time periods and to couple the first terminal of the reactive element to the second power supply rail during the first discharging time periods, and wherein the first control signal path is arranged to deliver the first control signal to the first input of the switching stage at, during the first charging time periods, at the first drive voltage, such that the first drive voltage is higher than the first supply voltage. | A switched mode power supply comprises a control signal generator arranged to generate first and second control signals via first and second outputs, respectively, which are coupled to respective first and second inputs of a switching stage, by means of respective first and second control signal paths. The switching stage is arranged to, responsive to the first and second control signals, alternately charge and discharge the reactive element by coupling it alternately to first and second supply voltages. An adjustable delay stage in one of the first and second signal paths is arranged to control an adjustable delay so that a first delay experienced by the first control signal passing from the control signal generator's first output to the switching stage's first input is substantially equal to a second delay experienced by the second control signal passing from the control signal generator's second output to the switching stage's second input.1. A switched mode power supply comprising:
a reactive element comprising a first terminal and a second terminal, the second terminal being configured to provide an output voltage for the switched mode power supply; a switching stage having first and second inputs, the switching stage being configured to charge and discharge the reactive element, via the first terminal, during first charging time periods and first discharging time periods, respectively, dependent on first and second control signals applied to the first and second inputs, respectively; a control signal generator arranged to generate the first and second control signals at the first and second inputs, respectively, via respective first and second control signal paths, wherein the first control signal path is configured to deliver the first control signal to the first input of the switching stage at a first drive voltage, during the first charging time periods, and wherein the first control signal path is coupled to the first node and is arranged to determine the first drive voltage dependent on a difference between a first node voltage at a first node, in the first control signal path, and a voltage at the first terminal of the reactive element; a first capacitive element coupled between the reactive element and the first node; a voltage regulator coupled to the first node and configured to control the first node voltage; a delay detector arranged to determine a relative delay between the first and second control signals, through the first and second control signal paths; and an adjustable delay stage in one of the first and second control signal paths, the adjustable delay stage being configured to control an adjustable delay to compensate for the relative delay. 2. The switched mode power supply of claim 1, wherein the switching stage is configured to:
(a) during the first charging time periods, responsive to the first control signal, couple the reactive element to a first supply voltage for charging the reactive element, and responsive to the second control signal, decouple the reactive element from a second supply voltage lower than the first supply voltage, the first supply voltage being lower than the first drive voltage, (b) during the first discharging time periods, responsive to the first control signal, decouple the reactive element from the first supply voltage, and responsive to the second control signal, couple the reactive element to the second supply voltage for discharging the reactive element, and (c) during decoupling time periods, responsive to the first control signal, decouple the reactive element from the first supply voltage, and responsive to the second control signal, decouple the reactive element from the second supply voltage;
wherein the first charging time periods and the first discharging time periods alternate and are each spaced apart by one of the decoupling time periods; and
wherein the switched power supply further comprises a first charging diode coupled between the first node and a third power supply rail at a third supply voltage higher than the second supply voltage, and arranged for charging the first capacitive element from the third supply voltage; and
wherein the voltage regulator is coupled to a fourth power supply rail at a fourth supply voltage higher than the third supply voltage and is configured to control the first node voltage dependent on the fourth supply voltage. 3. The switched mode power supply of claim 2, wherein the switching stage comprises:
a first n-channel transistor coupled between the first terminal of the reactive element and a first power supply rail at the first supply voltage and having a first gate coupled to the first input of the switching stage, and a second n-channel transistor coupled between the first terminal of the reactive element and a second power supply rail at the second supply voltage and having a second gate coupled to the second input of the switching stage; wherein the first n-channel transistor is arranged, responsive to the first control signal, to couple the first terminal of the reactive element to a first power supply rail at the first supply voltage during the first charging time periods and to decouple the first terminal of the reactive element from the first power supply rail during the first discharging time periods and the decoupling time periods; wherein the second n-channel transistor is arranged, responsive to the second control signal, to decouple the first terminal of the reactive element from a second power supply rail at the second supply voltage during the first charging time periods and the decoupling time periods and to couple the first terminal of the reactive element to the second power supply rail during the first discharging time periods. 4. The switched mode power supply of claim 3, wherein the first control signal path comprises a first power supply input coupled to the first node and a second power supply input coupled to the first terminal of the reactive element. 5. The switched mode power supply of claim 4, comprising:
a second capacitive element having a first terminal coupled to the first terminal of the reactive element and a second terminal coupled to a second node; and a second charging diode coupled between the second node and the fourth power supply rail and arranged for charging the second capacitive element from the fourth supply voltage; wherein the voltage regulator comprises a first regulator terminal coupled to the second node, a second regulator output coupled to the first node, and a third regulator terminal coupled to the first terminal of the reactive element, and wherein the voltage regulator is arranged to control the first node voltage dependent on a difference between a second node voltage at the second node and the voltage at the first terminal of the reactive element. 6. The switched mode power supply of claim 1, wherein the reactive element comprises an inductive element coupled between the first and second terminals, and an output capacitive element coupled to the second terminal. 7. The switched mode power supply of claim 1, wherein the delay detector comprises a delay detection capacitive element coupled to a charge control circuit, wherein the charge control circuit is arranged to alternately charge the delay detection capacitive element during second charging time periods of duration dependent on the first delay and discharge the delay detection capacitive element during second discharging time periods of duration dependent on the second delay, and wherein the delay indication signal is dependent on a voltage across the delay detection capacitive element. 8. The switched mode power supply of claim 7, wherein the charge control circuit comprises:
a first comparison circuit arranged to determine the duration of the second charging time periods dependent on a time difference between the first control signal at the first output of the control signal generator and the first control signal at the first input of the switching stage; and a second comparison circuit arranged to determine the duration of the second discharging time periods dependent on a time difference between the second control signal at the second output of the control signal generator and the second control signal at the second input of the switching stage. 9. The switched mode power supply of claim 8, wherein the first comparison circuit is a logical AND gate and the second comparison circuit is a logical AND gate. 10. The switched mode power supply of claim 7, wherein the charge control circuit comprises:
a third n-channel transistor coupled to a third node; a fourth n-channel transistor coupled to a third node; wherein the charge control circuit is arranged to generate a shadow signal at the third node by switching the third n-channel transistor responsive to the first control signal at the first input of the switching stage and switching the fourth n-channel transistor responsive to the second control signal at the second input of the switching stage; a first comparison circuit arranged to determine the duration of the second charging time periods dependent on a time difference between the first control signal at the first output of the control signal generator and the shadow signal; and a second comparison circuit arranged to determine the duration of the second discharging time periods dependent on a time difference between the second control signal at the second output of the control signal generator and the shadow signal. 11. The switched mode power supply of claim 10, wherein the first comparison circuit is a logical AND gate and the second comparison circuit is a logical AND gate. 12. An amplifier comprising the switched mode power supply of claim 1. 13. A wireless communication device comprising the amplifier of claim 1. 14. A switched mode power supply comprising:
a reactive element comprising a first terminal, for charging and discharging the reactive element, and a second terminal, for an output voltage; a switching stage having a first input and a second input; and a control signal generator arranged to generate a first control signal at a first output of the control signal generator and a second control signal at a second output of the control signal generator, wherein the first output of the control signal generator is coupled to the first input of the switching stage by means of a first control signal path and the second output of the control signal generator is coupled to the second input of the switching stage by means of a second control signal path; wherein the switching stage is arranged to
(a) during first charging time periods, responsive to the first control signal, couple the reactive element to a first supply voltage for charging the reactive element, and responsive to the second control signal, decouple the reactive element from a second supply voltage lower than the first supply voltage,
(b) during first discharging time periods, responsive to the first control signal, decouple the reactive element from the first supply voltage, and responsive to the second control signal, couple the reactive element to the second supply voltage for discharging the reactive element, and
(c) during decoupling time periods, responsive to the first control signal, decouple the reactive element from the first supply voltage, and responsive to the second control signal, decouple the reactive element from the second supply voltage,
wherein the first charging time periods and the first discharging time periods alternate and are each spaced apart by one of the decoupling time periods;
a first capacitive element having a first terminal coupled to the first terminal of the reactive element and a second terminal coupled to a first node, wherein the first control signal path is coupled to the first node and is arranged to determine the first drive voltage dependent on a difference between a first node voltage at the first node and a voltage at the first terminal of the reactive element, the first drive voltage being the voltage at which the first control signal is delivered to the first input of the switching stage during the first charging time periods; a first charging diode coupled between the first node and a third power supply rail at a third supply voltage higher than the second supply voltage, and arranged for charging the first capacitive element from the third supply voltage; a voltage regulator coupled to the first node and to a fourth power supply rail at a fourth supply voltage higher than the third supply voltage, wherein the voltage regulator is arranged to control the first node voltage dependent on the fourth supply voltage; a delay detector arranged to generate a delay indicator signal indicative of a relative delay between the first control signal at the first input of the switching stage and the second control signal at the second input of the switching stage; and an adjustable delay stage in one of the first and second control signal paths and arranged to, responsive to the delay indicator signal, control an adjustable delay so that a first delay experienced by the first control signal passing from the first output of the control signal generator to the first input of the switching stage is substantially equal to a second delay experienced by the second control signal passing from the second output of the control signal generator to the second input of the switching stage. 15. The switched mode power supply of claim 14, wherein the reactive element comprises an inductive element coupled between the first and second terminals, and an output capacitive element coupled to the second terminal. 16. The switched mode power supply of claim 14, the switching stage comprising:
a first n-channel transistor coupled between a first terminal of the reactive element and a first power supply rail at the first supply voltage and having a first gate coupled to the first input of the switching stage, and a second n-channel transistor coupled between the first terminal of the reactive element and a second power supply rail at the second supply voltage and having a second gate coupled to the second input of the switching stage; wherein the first n-channel transistor is arranged, responsive to the first control signal, to couple the first terminal of the reactive element to a first power supply rail at the first supply voltage during the first charging time periods and to decouple the first terminal of the reactive element from the first power supply rail during the first discharging time periods and the decoupling time periods; wherein the second n-channel transistor is arranged, responsive to the second control signal, to decouple the first terminal of the reactive element from a second power supply rail at the second supply voltage during the first charging time periods and the decoupling time periods and to couple the first terminal of the reactive element to the second power supply rail during the first discharging time periods, and wherein the first control signal path is arranged to deliver the first control signal to the first input of the switching stage at, during the first charging time periods, at the first drive voltage, such that the first drive voltage is higher than the first supply voltage. | 2,800 |
11,710 | 11,710 | 13,193,265 | 2,859 | A dual mode wireless power module for a device includes a wireless transceiver and a wireless power transceiver circuit. The wireless transceiver circuit is operable to communicate peripheral power information indicating a wireless power configuration. The wireless power transceiver circuit is operable to determine, based upon the power information, a power status of another device identified by the peripheral power information. When the power status of the another device is favorable, the wireless power transceiver circuit is placed in a wireless power receive mode in which the wireless power transceiver circuit converts wireless power into a voltage. When the power status of the another device is unfavorable, the wireless power transceiver circuit is placed in a wireless power transmit mode in which the wireless power transceiver circuit converts a power source of the device into the wireless power. | 1. A dual mode wireless power module for a device comprises:
a wireless transceiver operable to:
communicate peripheral power information indicating a wireless power configuration; and
a wireless power transceiver circuit operable to:
determine, based upon the power information, a power status of another device identified by the peripheral power information,
when the power status of the another device is favorable, the wireless power transceiver circuit is placed in a wireless power receive mode, wherein the wireless power transceiver circuit converts received wireless power into a voltage; and
when the power status of the another device is unfavorable, the wireless power transceiver circuit is placed in a wireless power transmit mode, wherein the wireless power transceiver circuit converts a power source of the device into wireless power for transmission. 2. The dual mode wireless power module of claim 1, wherein the peripheral information comprises:
power source identifier; wireless power capability; device power priority; and at least one of:
communication protocol;
input data;
input command;
output data; and
output command. 3. The dual mode wireless power module of claim 2, wherein the power status is favorable when the another device is coupled to an external, substantially constant, power source, as indicated by the power source identifier. 4. The dual mode wireless power module of claim 1, wherein the power status is favorable and unfavorable to place the dual mode wireless power module in a duplex mode of operation, wherein the wireless power transceiver circuit converts the received wireless power from the another device into the voltage, and converts the power source of the device into the wireless power for transmission to yet another device. 5. The dual mode wireless power module of claim 1, wherein the power status is favorable when the voltage strength of a battery of the another device is substantially greater than that of another battery local to the wireless power transceiver circuit. 6. The dual mode wireless power module of claim 1, wherein the wireless power transceiver is further operable to:
communicate information regarding the wireless power received by the dual mode wireless power module; and cause the wireless power transceiver circuit to disengage the wireless power when a signal strength of the wireless power falls below a threshold. 7. The dual mode wireless power module of claim 6, wherein the information regarding the wireless power comprises at least one of:
control channel protocol; frequency of the wireless power; impedance matching parameters; and resonant frequency tuning parameters. 8. The dual mode wireless power module of claim 1 wherein the primary device includes a computer; and
the another device including at least one of:
a keyboard,
a mouse,
a track ball,
a game controller,
a cell phone,
a hard drive,
a memory device,
a digital camera, and
a personal A/V player;
a medical device; and
a data collection device with remote readout. 9. The dual mode wireless power module of claim 1 wherein the wireless power produces one of an inductive coupling or a resonant inductive coupling. 10. A handheld device comprises:
a battery; a battery charger operable to utilize a supply voltage to charge the battery; a wireless transceiver operable to:
communicate power information indicating a wireless power configuration; and
a dual mode wireless power transceiver circuit operable to:
determine, based upon the power information, a power status of another device identified by the power information,
when the power status of the another device is favorable, the wireless power transceiver circuit is placed in a wireless power receive mode, wherein the dual mode wireless power transceiver circuit converts wireless power into the supply voltage; and
when the power status of the another device is unfavorable, the dual mode wireless power transceiver circuit is placed in wireless power transmit mode, wherein the wireless power transceiver circuit converts a power source of the device into the wireless power; and
a processing module operable to coordinate:
the charging of the battery when the dual mode wireless power transceiver circuit is in the power receive mode; and
the communicating of the power information. 11. The handheld device of claim 10, wherein the power information comprises:
power source identifier; wireless power capability; device power priority; and at least one of:
communication protocol;
input data;
input command;
output data; and
output command. 12. The handheld device of claim 10, wherein the power status is favorable when the another device is coupled to an external power source, as indicated by the power source identifier, wherein the external power source is substantially constant. 13. The handheld device of claim 10, wherein the power status is favorable when the voltage strength of a battery of the another device is substantially greater than that of a battery local to the wireless power transceiver circuit. 14. The handheld device of claim 10, wherein the wireless power transceiver is further operable to:
communicate information regarding the wireless power received by the dual mode wireless power module; and cause the wireless power transceiver circuit to disengage the wireless power when a signal strength of the wireless power falls below a threshold. 15. The handheld device of claim 14, wherein the information regarding the wireless power comprises at least one of:
control channel protocol; frequency of the wireless power; impedance matching parameters; and resonant frequency tuning parameters. 16. The handheld device of claim 10 wherein the device includes a computer; and
the another device including at least one of:
a keyboard,
a mouse,
a track ball,
a game controller,
a cell phone,
a hard drive,
a memory device,
a digital camera,
a personal A/V player;
a medical device; and
a data collection device with remote readout. 17. An integrated circuit (IC) comprises:
at least a portion of a wireless power transceiver circuit that is operable to:
convert a wireless power into a supply voltage; and
convert a power source into the wireless power; and
at least a portion of a battery charger that is operable to charge a battery based on the supply voltage; a wireless transceiver operable to:
communicate control channel information regarding the wireless power with another wireless power transmitter circuit of a device; and
communicate at least one of data and command with the device; and
a processing module operable to
determine, based upon the data, a power status of another device identified by the peripheral power information,
when the power status of the another device is favorable, the wireless power transceiver circuit is placed in a power receive mode, wherein the dual mode wireless power transceiver circuit converts the wireless power into the supply voltage; and
when the power status of the another device is unfavorable, the dual mode wireless power transceiver circuit is placed in a power transmit mode, wherein the wireless power transceiver circuit converts a power source of the device into the wireless power;
coordinate the charging of the battery with the supply voltage when the dual mode wireless power transceiver is in a receive mode;
coordinate conversion of the wireless power into the supply voltage; and
coordinate communication of the control channel information with the device. 18. The IC of claim 17, wherein the processing module is further operable to:
execute a function corresponding to the at least one of the data and the command. 19. The IC of claim 17 further comprises:
at least a portion of the dual power conversion transceiver circuit that is operable to convert the supply voltage into a second wireless power. 20. The IC of claim 17, wherein the control channel information regarding the wireless power comprises one or more of:
control channel protocol; frequency of the wireless power; impedance matching parameters; and resonant frequency tuning parameters. | A dual mode wireless power module for a device includes a wireless transceiver and a wireless power transceiver circuit. The wireless transceiver circuit is operable to communicate peripheral power information indicating a wireless power configuration. The wireless power transceiver circuit is operable to determine, based upon the power information, a power status of another device identified by the peripheral power information. When the power status of the another device is favorable, the wireless power transceiver circuit is placed in a wireless power receive mode in which the wireless power transceiver circuit converts wireless power into a voltage. When the power status of the another device is unfavorable, the wireless power transceiver circuit is placed in a wireless power transmit mode in which the wireless power transceiver circuit converts a power source of the device into the wireless power.1. A dual mode wireless power module for a device comprises:
a wireless transceiver operable to:
communicate peripheral power information indicating a wireless power configuration; and
a wireless power transceiver circuit operable to:
determine, based upon the power information, a power status of another device identified by the peripheral power information,
when the power status of the another device is favorable, the wireless power transceiver circuit is placed in a wireless power receive mode, wherein the wireless power transceiver circuit converts received wireless power into a voltage; and
when the power status of the another device is unfavorable, the wireless power transceiver circuit is placed in a wireless power transmit mode, wherein the wireless power transceiver circuit converts a power source of the device into wireless power for transmission. 2. The dual mode wireless power module of claim 1, wherein the peripheral information comprises:
power source identifier; wireless power capability; device power priority; and at least one of:
communication protocol;
input data;
input command;
output data; and
output command. 3. The dual mode wireless power module of claim 2, wherein the power status is favorable when the another device is coupled to an external, substantially constant, power source, as indicated by the power source identifier. 4. The dual mode wireless power module of claim 1, wherein the power status is favorable and unfavorable to place the dual mode wireless power module in a duplex mode of operation, wherein the wireless power transceiver circuit converts the received wireless power from the another device into the voltage, and converts the power source of the device into the wireless power for transmission to yet another device. 5. The dual mode wireless power module of claim 1, wherein the power status is favorable when the voltage strength of a battery of the another device is substantially greater than that of another battery local to the wireless power transceiver circuit. 6. The dual mode wireless power module of claim 1, wherein the wireless power transceiver is further operable to:
communicate information regarding the wireless power received by the dual mode wireless power module; and cause the wireless power transceiver circuit to disengage the wireless power when a signal strength of the wireless power falls below a threshold. 7. The dual mode wireless power module of claim 6, wherein the information regarding the wireless power comprises at least one of:
control channel protocol; frequency of the wireless power; impedance matching parameters; and resonant frequency tuning parameters. 8. The dual mode wireless power module of claim 1 wherein the primary device includes a computer; and
the another device including at least one of:
a keyboard,
a mouse,
a track ball,
a game controller,
a cell phone,
a hard drive,
a memory device,
a digital camera, and
a personal A/V player;
a medical device; and
a data collection device with remote readout. 9. The dual mode wireless power module of claim 1 wherein the wireless power produces one of an inductive coupling or a resonant inductive coupling. 10. A handheld device comprises:
a battery; a battery charger operable to utilize a supply voltage to charge the battery; a wireless transceiver operable to:
communicate power information indicating a wireless power configuration; and
a dual mode wireless power transceiver circuit operable to:
determine, based upon the power information, a power status of another device identified by the power information,
when the power status of the another device is favorable, the wireless power transceiver circuit is placed in a wireless power receive mode, wherein the dual mode wireless power transceiver circuit converts wireless power into the supply voltage; and
when the power status of the another device is unfavorable, the dual mode wireless power transceiver circuit is placed in wireless power transmit mode, wherein the wireless power transceiver circuit converts a power source of the device into the wireless power; and
a processing module operable to coordinate:
the charging of the battery when the dual mode wireless power transceiver circuit is in the power receive mode; and
the communicating of the power information. 11. The handheld device of claim 10, wherein the power information comprises:
power source identifier; wireless power capability; device power priority; and at least one of:
communication protocol;
input data;
input command;
output data; and
output command. 12. The handheld device of claim 10, wherein the power status is favorable when the another device is coupled to an external power source, as indicated by the power source identifier, wherein the external power source is substantially constant. 13. The handheld device of claim 10, wherein the power status is favorable when the voltage strength of a battery of the another device is substantially greater than that of a battery local to the wireless power transceiver circuit. 14. The handheld device of claim 10, wherein the wireless power transceiver is further operable to:
communicate information regarding the wireless power received by the dual mode wireless power module; and cause the wireless power transceiver circuit to disengage the wireless power when a signal strength of the wireless power falls below a threshold. 15. The handheld device of claim 14, wherein the information regarding the wireless power comprises at least one of:
control channel protocol; frequency of the wireless power; impedance matching parameters; and resonant frequency tuning parameters. 16. The handheld device of claim 10 wherein the device includes a computer; and
the another device including at least one of:
a keyboard,
a mouse,
a track ball,
a game controller,
a cell phone,
a hard drive,
a memory device,
a digital camera,
a personal A/V player;
a medical device; and
a data collection device with remote readout. 17. An integrated circuit (IC) comprises:
at least a portion of a wireless power transceiver circuit that is operable to:
convert a wireless power into a supply voltage; and
convert a power source into the wireless power; and
at least a portion of a battery charger that is operable to charge a battery based on the supply voltage; a wireless transceiver operable to:
communicate control channel information regarding the wireless power with another wireless power transmitter circuit of a device; and
communicate at least one of data and command with the device; and
a processing module operable to
determine, based upon the data, a power status of another device identified by the peripheral power information,
when the power status of the another device is favorable, the wireless power transceiver circuit is placed in a power receive mode, wherein the dual mode wireless power transceiver circuit converts the wireless power into the supply voltage; and
when the power status of the another device is unfavorable, the dual mode wireless power transceiver circuit is placed in a power transmit mode, wherein the wireless power transceiver circuit converts a power source of the device into the wireless power;
coordinate the charging of the battery with the supply voltage when the dual mode wireless power transceiver is in a receive mode;
coordinate conversion of the wireless power into the supply voltage; and
coordinate communication of the control channel information with the device. 18. The IC of claim 17, wherein the processing module is further operable to:
execute a function corresponding to the at least one of the data and the command. 19. The IC of claim 17 further comprises:
at least a portion of the dual power conversion transceiver circuit that is operable to convert the supply voltage into a second wireless power. 20. The IC of claim 17, wherein the control channel information regarding the wireless power comprises one or more of:
control channel protocol; frequency of the wireless power; impedance matching parameters; and resonant frequency tuning parameters. | 2,800 |
11,711 | 11,711 | 15,867,943 | 2,842 | A clock delay circuit includes an output to provide an output clock signal which is a delayed version of an input clock signal. The clock delay circuit includes a latch whose output provides the output clock signal. A delay control circuit provides a third clock signal. The latch includes a first input to receive the input clock signal and a second input to receive the third clock signal. The amount of delay provided by the latch is dependent upon the duty cycle of the third clock signal. | 1. A clock delay circuit comprising:
an output to provide an output clock signal which is a delayed version of an input clock signal; a delay control circuit including an output for providing a third clock signal having a duty cycle; a latch including a first input to receive the input clock signal, a second input to receive the third clock signal, and an output to provide the output clock signal, wherein a delay between the input clock signal and the output clock signal is dependent upon the duty cycle of the third clock signal. 2. A circuit of claim 1, wherein the delay control circuit comprises:
a capacitor; a charging state rate control circuit, the charging state rate control circuit controls a charging state rate of the capacitor, the duty cycle of the third clock signal is dependent upon a charging state rate of the capacitor. 3. A circuit of claim 2 wherein the charging state rate control circuit includes a comparison circuit including a first input to receive a signal indicative of a desired delay between the input clock signal and the output clock signal and a second input to receive a signal indicative of a measured delay between the input clock signal and the output clock signal, wherein the output the charging state rate control circuit adjusts the charging state rate of the capacitor based on a comparison by the comparison circuit of the first input of the comparison circuit and the second input of the comparison circuit. 4. The circuit of claim 2 wherein the delay control circuit further comprises a first circuit having a first input to receive a clock signal and a second input coupled to the capacitor, an output of the first circuit provides the third clock signal. 5. The circuit of claim 4 wherein the first circuit performs at least a logical AND function of the first input and the second input of the first circuit. 6. The circuit of claim 2 wherein the charging state rate control circuit comprises:
a pulse generator including a first input to receive the output clock signal and a second input to receive the input clock signal, an output of the pulse generator providing an output signal indicative of a delay difference between the input clock signal and the output clock signal;
a pulse to voltage converter circuit for converting the output signal of the pulse generator to a DC signal indicative of a measured delay between the output clock signal and the input clock signal. 7. The circuit of claim 2 wherein the charging state rate control circuit includes an inverter including a first input for receiving a clock signal, an output coupled to the capacitor, and a second input coupled to a first circuit having an input to receive a signal indicative of a desired delay between the input clock signal and the output clock signal. 8. The circuit of claim 7 further comprising:
a dual edge detector circuit for providing at its output, pulses at rising edges of the input clock signal and pulses at falling edges of the input clock signal, wherein a frequency of the clock signal received at the input of the inverter is a frequency of an output of the dual edge detector circuit. 9. The circuit of claim 8 further comprising:
a pulse holding circuit having a first input coupled to the output of the dual edge detector circuit and a second input coupled to an output of the delay control circuit, the output of the pulse holding circuit providing the clock signal to the input of the inverter. 10. The circuit of claim 7 wherein the clock signal received at the first input of the inverter is the input clock signal. 11. withdrawn. 12. The circuit of claim 7 wherein the inverter includes a first transistor, a second transistor, and a third transistor coupled in series, a control terminal of the third transistor is coupled to the output of the first circuit to control its conductivity based on a voltage level of the output of the first circuit, wherein the conductivity of the third transistor controls the charging state rate of the capacitor. 13. The circuit of claim 12 wherein the first circuit includes a second input to receive a signal indicative of a measured delay between the input clock signal and the output clock signal, wherein the output the charging state rate control circuit adjusts the charging state rate of the capacitor based on a comparison by the first circuit of the input of the first circuit and the second input of the first circuit. 14. The circuit of claim 2 wherein the charging state rate control circuit controls a discharge rate of the capacitor. 15. The clock delay circuit of claim 1 wherein a frequency of the third clock signal is twice the frequency of the input clock signal. 16. The circuit of claim 1 wherein the delay between the input clock signal and output clock signal is programmable by a select signal provided to the delay control circuit. 17. The circuit of claim 1 wherein the delay control circuit further comprises:
a first capacitor;
a second capacitor;
a first charging state rate control circuit, the first charging state rate control circuit controls a charging state rate of the first capacitor, the duty cycle of the third clock signal is dependent upon a charging state rate of the first capacitor;
a second charging state rate control circuit, the second charging state rate control circuit controls a charging state rate of the second capacitor, the duty cycle of the third clock signal is dependent upon a charging state rate of the second capacitor. 18. The circuit of claim 17 wherein the delay control circuit further comprises:
a first circuit having a first input to receive the input clock signal and a second input coupled to the first capacitor;
a second circuit having a first input to receive an inverted version of the input clock signal and a second input coupled to the second capacitor;
a third circuit having a first input to receive an output of the first circuit, a second input to receive an output of the second circuit, and an output to provide the third clock signal. 19. The circuit of claim 1 wherein the latch is a D flip-flop, the first input of the latch is a data input, and the second input of the latch is a clock input. 20. withdrawn 21. (canceled) 22. The circuit of claim 1 wherein the delay control circuit includes circuitry to adjust the duty cycle of the third clock signal to adjust the delay between the input clock signal and the output clock signal. | A clock delay circuit includes an output to provide an output clock signal which is a delayed version of an input clock signal. The clock delay circuit includes a latch whose output provides the output clock signal. A delay control circuit provides a third clock signal. The latch includes a first input to receive the input clock signal and a second input to receive the third clock signal. The amount of delay provided by the latch is dependent upon the duty cycle of the third clock signal.1. A clock delay circuit comprising:
an output to provide an output clock signal which is a delayed version of an input clock signal; a delay control circuit including an output for providing a third clock signal having a duty cycle; a latch including a first input to receive the input clock signal, a second input to receive the third clock signal, and an output to provide the output clock signal, wherein a delay between the input clock signal and the output clock signal is dependent upon the duty cycle of the third clock signal. 2. A circuit of claim 1, wherein the delay control circuit comprises:
a capacitor; a charging state rate control circuit, the charging state rate control circuit controls a charging state rate of the capacitor, the duty cycle of the third clock signal is dependent upon a charging state rate of the capacitor. 3. A circuit of claim 2 wherein the charging state rate control circuit includes a comparison circuit including a first input to receive a signal indicative of a desired delay between the input clock signal and the output clock signal and a second input to receive a signal indicative of a measured delay between the input clock signal and the output clock signal, wherein the output the charging state rate control circuit adjusts the charging state rate of the capacitor based on a comparison by the comparison circuit of the first input of the comparison circuit and the second input of the comparison circuit. 4. The circuit of claim 2 wherein the delay control circuit further comprises a first circuit having a first input to receive a clock signal and a second input coupled to the capacitor, an output of the first circuit provides the third clock signal. 5. The circuit of claim 4 wherein the first circuit performs at least a logical AND function of the first input and the second input of the first circuit. 6. The circuit of claim 2 wherein the charging state rate control circuit comprises:
a pulse generator including a first input to receive the output clock signal and a second input to receive the input clock signal, an output of the pulse generator providing an output signal indicative of a delay difference between the input clock signal and the output clock signal;
a pulse to voltage converter circuit for converting the output signal of the pulse generator to a DC signal indicative of a measured delay between the output clock signal and the input clock signal. 7. The circuit of claim 2 wherein the charging state rate control circuit includes an inverter including a first input for receiving a clock signal, an output coupled to the capacitor, and a second input coupled to a first circuit having an input to receive a signal indicative of a desired delay between the input clock signal and the output clock signal. 8. The circuit of claim 7 further comprising:
a dual edge detector circuit for providing at its output, pulses at rising edges of the input clock signal and pulses at falling edges of the input clock signal, wherein a frequency of the clock signal received at the input of the inverter is a frequency of an output of the dual edge detector circuit. 9. The circuit of claim 8 further comprising:
a pulse holding circuit having a first input coupled to the output of the dual edge detector circuit and a second input coupled to an output of the delay control circuit, the output of the pulse holding circuit providing the clock signal to the input of the inverter. 10. The circuit of claim 7 wherein the clock signal received at the first input of the inverter is the input clock signal. 11. withdrawn. 12. The circuit of claim 7 wherein the inverter includes a first transistor, a second transistor, and a third transistor coupled in series, a control terminal of the third transistor is coupled to the output of the first circuit to control its conductivity based on a voltage level of the output of the first circuit, wherein the conductivity of the third transistor controls the charging state rate of the capacitor. 13. The circuit of claim 12 wherein the first circuit includes a second input to receive a signal indicative of a measured delay between the input clock signal and the output clock signal, wherein the output the charging state rate control circuit adjusts the charging state rate of the capacitor based on a comparison by the first circuit of the input of the first circuit and the second input of the first circuit. 14. The circuit of claim 2 wherein the charging state rate control circuit controls a discharge rate of the capacitor. 15. The clock delay circuit of claim 1 wherein a frequency of the third clock signal is twice the frequency of the input clock signal. 16. The circuit of claim 1 wherein the delay between the input clock signal and output clock signal is programmable by a select signal provided to the delay control circuit. 17. The circuit of claim 1 wherein the delay control circuit further comprises:
a first capacitor;
a second capacitor;
a first charging state rate control circuit, the first charging state rate control circuit controls a charging state rate of the first capacitor, the duty cycle of the third clock signal is dependent upon a charging state rate of the first capacitor;
a second charging state rate control circuit, the second charging state rate control circuit controls a charging state rate of the second capacitor, the duty cycle of the third clock signal is dependent upon a charging state rate of the second capacitor. 18. The circuit of claim 17 wherein the delay control circuit further comprises:
a first circuit having a first input to receive the input clock signal and a second input coupled to the first capacitor;
a second circuit having a first input to receive an inverted version of the input clock signal and a second input coupled to the second capacitor;
a third circuit having a first input to receive an output of the first circuit, a second input to receive an output of the second circuit, and an output to provide the third clock signal. 19. The circuit of claim 1 wherein the latch is a D flip-flop, the first input of the latch is a data input, and the second input of the latch is a clock input. 20. withdrawn 21. (canceled) 22. The circuit of claim 1 wherein the delay control circuit includes circuitry to adjust the duty cycle of the third clock signal to adjust the delay between the input clock signal and the output clock signal. | 2,800 |
11,712 | 11,712 | 13,819,287 | 2,865 | A method is provided for controlling an electric apparatus having a sensor unit, the apparatus being operated in a first potential motion mode and/or in a second potential motion mode; a sensor signal being generated in the sensor unit; the first information and/or the second information being calculated as function of the sensor signal, as a function of a requirement for providing a first information with respect to the presence of the first potential motion mode and/or a second information with respect to the presence of the second potential motion mode. | 1-10. (canceled) 11. A method for controlling an electric apparatus having a sensor unit, the apparatus being operated in at least one of a first potential motion mode and a second potential motion mode, the method comprising:
generating a sensor signal in the sensor unit; and calculating, as a function of a requirement for providing at least one of the first information with respect to a presence of the first potential motion mode and the second information with respect to the presence of the second potential motion mode, at least one of a first information and a second information as a function of the sensor signal. 12. The method as recited in claim 11, further comprising:
determining at least one of a first event corresponding to the first potential motion mode and a second event corresponding to the second potential motion mode in a processing unit as a function of the sensor signal, at least one of the first event and the second event being used for at least one of triggering and controlling calibration of the sensor signal. 13. The method as recited in claim 11, wherein, for the generating of the sensor signal in the sensor unit, at least one of an acceleration sensor, a magnetic field sensor, a gyroscope, a pressure sensor and an approach sensor, are used. 14. The method as recited in claim 11, further comprising:
filtering and storing the sensor signal, a first frequency bandwidth being stored in a first memory unit, and a second frequency bandwidth being stored in a second memory unit, wherein for at least one of determining the first event, the first memory unit being accessed and for determining the second event, the second memory unit being accessed. 15. The method as recited in claim 11, further comprising: at least one of calibrating and correcting the sensor signal, a 0 g offset correction being carried out. 16. The method as recited in claim 11, wherein the requirement for providing the at least one of the first information and the second information is produced by an application. 17. The method as recited in claim 11, wherein the requirement for providing the at least one of the first information and the second information is produced by a user input. 18. A device for controlling an electric apparatus, the device including a sensor unit, wherein the apparatus is able to be operated in a first potential motion mode or in a second potential motion mode, and a sensor signal being producible in the sensor unit, wherein the device is configured to, as a function of a requirement for providing a first information with respect to the presence of the first potential motion mode and a second information with respect to the presence of the second potential motion mode, calculate at least one of the first information and the second information as a function of the sensor signal. 19. The device as recited in claim 18, wherein the sensor unit includes at least one of an acceleration sensor, a magnetic field sensor, a gyroscope, a pressure sensor, and an approach sensor. 20. The device as recited in claim 18, further comprising:
a processing unit, wherein in the processing unit is configured, as a function of the sensor signal, to determine at least one of a first event corresponding to the first potential motion mode, and a second event corresponding to the second potential motion mode, at least one of the first event and the second event being usable for at least one of triggering and controlling calibration of the sensor signal. | A method is provided for controlling an electric apparatus having a sensor unit, the apparatus being operated in a first potential motion mode and/or in a second potential motion mode; a sensor signal being generated in the sensor unit; the first information and/or the second information being calculated as function of the sensor signal, as a function of a requirement for providing a first information with respect to the presence of the first potential motion mode and/or a second information with respect to the presence of the second potential motion mode.1-10. (canceled) 11. A method for controlling an electric apparatus having a sensor unit, the apparatus being operated in at least one of a first potential motion mode and a second potential motion mode, the method comprising:
generating a sensor signal in the sensor unit; and calculating, as a function of a requirement for providing at least one of the first information with respect to a presence of the first potential motion mode and the second information with respect to the presence of the second potential motion mode, at least one of a first information and a second information as a function of the sensor signal. 12. The method as recited in claim 11, further comprising:
determining at least one of a first event corresponding to the first potential motion mode and a second event corresponding to the second potential motion mode in a processing unit as a function of the sensor signal, at least one of the first event and the second event being used for at least one of triggering and controlling calibration of the sensor signal. 13. The method as recited in claim 11, wherein, for the generating of the sensor signal in the sensor unit, at least one of an acceleration sensor, a magnetic field sensor, a gyroscope, a pressure sensor and an approach sensor, are used. 14. The method as recited in claim 11, further comprising:
filtering and storing the sensor signal, a first frequency bandwidth being stored in a first memory unit, and a second frequency bandwidth being stored in a second memory unit, wherein for at least one of determining the first event, the first memory unit being accessed and for determining the second event, the second memory unit being accessed. 15. The method as recited in claim 11, further comprising: at least one of calibrating and correcting the sensor signal, a 0 g offset correction being carried out. 16. The method as recited in claim 11, wherein the requirement for providing the at least one of the first information and the second information is produced by an application. 17. The method as recited in claim 11, wherein the requirement for providing the at least one of the first information and the second information is produced by a user input. 18. A device for controlling an electric apparatus, the device including a sensor unit, wherein the apparatus is able to be operated in a first potential motion mode or in a second potential motion mode, and a sensor signal being producible in the sensor unit, wherein the device is configured to, as a function of a requirement for providing a first information with respect to the presence of the first potential motion mode and a second information with respect to the presence of the second potential motion mode, calculate at least one of the first information and the second information as a function of the sensor signal. 19. The device as recited in claim 18, wherein the sensor unit includes at least one of an acceleration sensor, a magnetic field sensor, a gyroscope, a pressure sensor, and an approach sensor. 20. The device as recited in claim 18, further comprising:
a processing unit, wherein in the processing unit is configured, as a function of the sensor signal, to determine at least one of a first event corresponding to the first potential motion mode, and a second event corresponding to the second potential motion mode, at least one of the first event and the second event being usable for at least one of triggering and controlling calibration of the sensor signal. | 2,800 |
11,713 | 11,713 | 15,070,231 | 2,891 | A self-aligned via interconnect structures and methods of manufacturing thereof are disclosed. The method includes forming a wiring structure in a dielectric material. The method further includes forming a cap layer over a surface of the wiring structure and the dielectric material. The method further includes forming an opening in the cap layer to expose a portion of the wiring structure. The method further includes selectively growing a metal or metal-alloy via interconnect structure material on the exposed portion of the wiring structure, through the opening in the cap layer. The method further includes forming an upper wiring structure in electrical contact with the metal or metal-alloy via interconnect structure. | 1. A structure comprising a self-aligned cobalt interconnect structure between and in electrical contact with an upper wiring layer and a lower wiring layer, the self-aligned cobalt interconnect structure is an overgrowth of cobalt within an opening of a dielectric cap material on the lower wiring layer. 2. The structure of claim 1, wherein the self-aligned cobalt interconnect structure is a lateral growth on a surface of the dielectric cap. 3. The structure of claim 1, wherein:
an interface between the self-aligned cobalt interconnect structure and the lower wiring layer is devoid of a barrier material and a liner material; and an interface between the self-aligned cobalt interconnect structure and the upper wiring layer includes a barrier material and a liner material. 4. The structure of claim 1, wherein the lower wiring layer is formed in a dielectric layer. 5. The structure of claim 4, further comprising a barrier/liner material formed between the dielectric layer and the lower wiring layer. 6. The structure of claim 5, wherein the barrier liner material is a combination of a barrier material and a liner material. 7. The structure of claim 6, wherein the barrier material is TaN or TiN and the liner material is Ta, Ti or Co. 8. The structure of claim 6, wherein the dielectric cap material is deposited material on the lower wiring layer and the dielectric layer. 9. The structure of claim 8, wherein the dielectric cap material is dielectric hard mask layer. 10. The structure of claim 9, wherein the opening in the dielectric cap material is a slot pattern, crossing over a segment of the lower wiring layer to expose a portion thereof. 11. The structure of claim 10, wherein the slot pattern is orthogonal to the lower wiring layer. 12. The structure of claim 11, wherein an interlevel dielectric material is deposited on the self-aligned cobalt interconnect structure and the upper wiring layer is formed in a trench of the interlevel dielectric material. 13. The structure of claim 12, wherein the trench is lined with a barrier/liner material. | A self-aligned via interconnect structures and methods of manufacturing thereof are disclosed. The method includes forming a wiring structure in a dielectric material. The method further includes forming a cap layer over a surface of the wiring structure and the dielectric material. The method further includes forming an opening in the cap layer to expose a portion of the wiring structure. The method further includes selectively growing a metal or metal-alloy via interconnect structure material on the exposed portion of the wiring structure, through the opening in the cap layer. The method further includes forming an upper wiring structure in electrical contact with the metal or metal-alloy via interconnect structure.1. A structure comprising a self-aligned cobalt interconnect structure between and in electrical contact with an upper wiring layer and a lower wiring layer, the self-aligned cobalt interconnect structure is an overgrowth of cobalt within an opening of a dielectric cap material on the lower wiring layer. 2. The structure of claim 1, wherein the self-aligned cobalt interconnect structure is a lateral growth on a surface of the dielectric cap. 3. The structure of claim 1, wherein:
an interface between the self-aligned cobalt interconnect structure and the lower wiring layer is devoid of a barrier material and a liner material; and an interface between the self-aligned cobalt interconnect structure and the upper wiring layer includes a barrier material and a liner material. 4. The structure of claim 1, wherein the lower wiring layer is formed in a dielectric layer. 5. The structure of claim 4, further comprising a barrier/liner material formed between the dielectric layer and the lower wiring layer. 6. The structure of claim 5, wherein the barrier liner material is a combination of a barrier material and a liner material. 7. The structure of claim 6, wherein the barrier material is TaN or TiN and the liner material is Ta, Ti or Co. 8. The structure of claim 6, wherein the dielectric cap material is deposited material on the lower wiring layer and the dielectric layer. 9. The structure of claim 8, wherein the dielectric cap material is dielectric hard mask layer. 10. The structure of claim 9, wherein the opening in the dielectric cap material is a slot pattern, crossing over a segment of the lower wiring layer to expose a portion thereof. 11. The structure of claim 10, wherein the slot pattern is orthogonal to the lower wiring layer. 12. The structure of claim 11, wherein an interlevel dielectric material is deposited on the self-aligned cobalt interconnect structure and the upper wiring layer is formed in a trench of the interlevel dielectric material. 13. The structure of claim 12, wherein the trench is lined with a barrier/liner material. | 2,800 |
11,714 | 11,714 | 15,856,147 | 2,839 | Operating switching power converters based on peak current through the switching element. At least some of the example embodiments are controllers for buck-type power converters including a gate drive terminal, a feedback terminal, and a drain current terminal. The controllers are configured to generate variable frequency gate drive signals applied to the gate drive terminal, the frequency controlled based on a time-varying reference signal that controls peak current through a switching transistor, and the frequency controlled based on a feedback signal received on the feedback terminal proportional to a sampled output voltage. | 1. A controller for a buck-type power converter, the controller comprising:
a gate drive terminal; a feedback terminal; a drain current terminal; a reference signal circuit, the reference signal circuit configured to create a time-varying reference signal with a modulation period that is constant; a set-reset (SR) flip-flop, the SR flip-flop has a set input, a reset input, and an SR output, the SR output coupled to the gate drive terminal of the controller; a first comparator that has a first input, a second input, and a comparator output, the comparator output coupled to the set input of the SR flip-flop; a reference voltage coupled to the first input of the first comparator, and the feedback terminal coupled to the second input of the first comparator; a second comparator that has a first input, a second input, and a comparator output, the comparator output of the second comparator coupled to the reset input of the SR flip-flop; and the drain current terminal coupled to the first input of the second comparator, and the time-varying reference signal coupled to the second input of the second comparator; wherein the controller is configured to assert the gate drive terminal when a feedback signal on the feedback terminal crosses the reference voltage, and the controller is configured to de-assert the gate drive terminal when a drain current signal on the drain current terminal crosses the time-varying reference signal. 2. The controller of claim 1 wherein the reference signal circuit further comprises an analog circuit configured to create the time-varying reference signal. 3. The controller of claim 1 wherein the reference signal circuit further comprises a digital circuit configured to create the time-varying reference signal. 4. The controller of claim 1 wherein the reference signal circuit is configured to create a triangle wave. 5. The controller of claim 1 wherein the reference signal circuit is configured to create at least one selected from a group comprising: the time-varying reference signal in the form of a triangle wave; and the time-varying reference signal in the form of a saw tooth wave. 6. The controller of claim 1:
wherein the first comparator output is coupled directly to the set input of the SR flip-flop; and wherein the comparator output of the second comparator is coupled directly to the reset input of the SR flip-flop. 7.-14. (canceled) 15. A gate-drive controller comprising:
a gate drive terminal configured to couple to the gate of a transistor; a feedback terminal configured to couple to a capacitor; a drain current terminal; a reference signal circuit configured to create a time-varying reference signal with a modulation period that is unaffected by switching frequency of a gate drive signal; a bistable multivibrator, the bistable multivibrator has a set input, a reset input, and an output, the bistable multivibrator coupled to the gate drive terminal; a first comparator that has a first input, a second input, and a comparator output, the comparator output coupled to the set input of the bistable multivibrator; a reference voltage coupled to the first input of the first comparator, and the feedback terminal coupled to the second input of the first comparator; a second comparator that has a first input, a second input, and a comparator output, the comparator output of the second comparator coupled to the reset input of the bistable multivibrator; and the drain current terminal coupled to the first input of the second comparator, and the time-varying reference signal coupled to the second input of the second comparator; wherein the gate-drive controller is configured to assert the gate drive terminal when a feedback signal on the feedback terminal crosses the reference voltage, and the controller is configured to de-assert the gate drive terminal when a drain current signal on the drain current terminal crosses the time-varying reference signal. 16. The gate-drive controller of claim 15 wherein the reference signal circuit further comprises an analog circuit configured to create the time-varying reference signal. 17. The gate-drive controller of claim 15 wherein the reference signal circuit further comprises a digital circuit configured to create the time-varying reference signal. 18. The gate-drive controller of claim 15 wherein the reference signal circuit is configured to create a triangle wave. 19. The gate-drive controller of claim 15 wherein the reference signal circuit is configured to create at least one selected from a group comprising: the time-varying reference signal in the form of a triangle wave; and the time-varying reference signal in the form of a saw tooth wave. 20. The gate-drive controller of claim 15:
wherein the first comparator output is coupled directly to the set input of the bistable multivibrator; and wherein the comparator output of the second comparator is coupled directly to the reset input of the bistable multivibrator. 21. The controller of claim 1 wherein the reference signal circuit is configured to create the time-varying reference signal in the form of a sinusoid having the modulation period. 22. The controller of claim 1 wherein the controller is configured to operate the buck-type power converter in discontinuous current mode. 23. The gate-drive controller of claim 15 wherein the reference signal circuit is configured to create the time-varying reference signal in the form of a sinusoid. 24. The gate-drive controller of claim 15 wherein the gate-drive controller is configured to operate a buck-type power converter in discontinuous current mode. 25. A buck-type power converter comprising:
a transistor defining a gate, a source, and a drain, the drain coupled to a voltage input; an inductor defining a first lead and a second lead, the first lead coupled to the source, and the second lead coupled to a positive terminal of a voltage output; a first diode defining an anode and a cathode, the anode coupled to a negative terminal of the voltage output, and the anode coupled to the first lead of the inductor; a voltage sample circuit comprising a second diode defining an anode and a cathode, a voltage divider defining a first lead and second lead, and a capacitor defining a first lead and a second lead, the second diode coupled in series with the voltage divider, the capacitor in parallel with the voltage divider, an anode of the second diode coupled to the second lead of the inductor, and the second lead of the voltage divider and the second lead of the capacitor coupled to the first lead of the inductor; a means for sensing current flow through the transistor, the means for sensing defines a current sense output; a gate-drive controller comprising:
a gate drive terminal coupled to the gate of the transistor;
a feedback terminal coupled to the voltage sample circuit;
a drain current terminal coupled to the current sense output;
a reference signal circuit configured to create a time-varying reference signal with a modulation period that is constant;
a bistable multivibrator, the bistable multivibrator defining a set input, a reset input, and an output, the bistable multivibrator coupled to the gate drive terminal;
a first comparator that has a first input, a second input, and a comparator output, the comparator output coupled to the set input of the bistable multivibrator;
a reference voltage coupled to the first input of the first comparator, and the feedback terminal coupled to the second input of the first comparator;
a second comparator that has a first input, a second input, and a comparator output, the comparator output of the second comparator coupled to the reset input of the bistable multivibrator; and
the drain current terminal coupled to the first input of the second comparator, and the time-varying reference signal coupled to the second input of the second comparator;
wherein the controller is configured to generate a variable frequency gate drive signal applied to the gate drive terminal from the SR output, the frequency controlled based on the time-varying reference signal and a feedback signal received on the feedback terminal. 26. The buck-type power converter of claim 25 wherein the gate-drive controller is configured to assert the gate drive terminal when a feedback signal on the feedback terminal crosses the reference voltage, and the controller is configured to de-assert the gate drive terminal when a drain current signal on the drain current terminal crosses the time-varying reference signal. 27. The buck-type power converter of claim 25 wherein the reference signal circuit is configured to create at least one selected from a group comprising: the time-varying reference signal in the form of a triangle wave; and the time-varying reference signal in the form of a saw tooth wave. 28. The buck-type power converter of claim 25:
wherein the first comparator output is coupled directly to the set input of the bistable multivibrator; and wherein the comparator output of the second comparator is coupled directly to the reset input of the bistable multivibrator. | Operating switching power converters based on peak current through the switching element. At least some of the example embodiments are controllers for buck-type power converters including a gate drive terminal, a feedback terminal, and a drain current terminal. The controllers are configured to generate variable frequency gate drive signals applied to the gate drive terminal, the frequency controlled based on a time-varying reference signal that controls peak current through a switching transistor, and the frequency controlled based on a feedback signal received on the feedback terminal proportional to a sampled output voltage.1. A controller for a buck-type power converter, the controller comprising:
a gate drive terminal; a feedback terminal; a drain current terminal; a reference signal circuit, the reference signal circuit configured to create a time-varying reference signal with a modulation period that is constant; a set-reset (SR) flip-flop, the SR flip-flop has a set input, a reset input, and an SR output, the SR output coupled to the gate drive terminal of the controller; a first comparator that has a first input, a second input, and a comparator output, the comparator output coupled to the set input of the SR flip-flop; a reference voltage coupled to the first input of the first comparator, and the feedback terminal coupled to the second input of the first comparator; a second comparator that has a first input, a second input, and a comparator output, the comparator output of the second comparator coupled to the reset input of the SR flip-flop; and the drain current terminal coupled to the first input of the second comparator, and the time-varying reference signal coupled to the second input of the second comparator; wherein the controller is configured to assert the gate drive terminal when a feedback signal on the feedback terminal crosses the reference voltage, and the controller is configured to de-assert the gate drive terminal when a drain current signal on the drain current terminal crosses the time-varying reference signal. 2. The controller of claim 1 wherein the reference signal circuit further comprises an analog circuit configured to create the time-varying reference signal. 3. The controller of claim 1 wherein the reference signal circuit further comprises a digital circuit configured to create the time-varying reference signal. 4. The controller of claim 1 wherein the reference signal circuit is configured to create a triangle wave. 5. The controller of claim 1 wherein the reference signal circuit is configured to create at least one selected from a group comprising: the time-varying reference signal in the form of a triangle wave; and the time-varying reference signal in the form of a saw tooth wave. 6. The controller of claim 1:
wherein the first comparator output is coupled directly to the set input of the SR flip-flop; and wherein the comparator output of the second comparator is coupled directly to the reset input of the SR flip-flop. 7.-14. (canceled) 15. A gate-drive controller comprising:
a gate drive terminal configured to couple to the gate of a transistor; a feedback terminal configured to couple to a capacitor; a drain current terminal; a reference signal circuit configured to create a time-varying reference signal with a modulation period that is unaffected by switching frequency of a gate drive signal; a bistable multivibrator, the bistable multivibrator has a set input, a reset input, and an output, the bistable multivibrator coupled to the gate drive terminal; a first comparator that has a first input, a second input, and a comparator output, the comparator output coupled to the set input of the bistable multivibrator; a reference voltage coupled to the first input of the first comparator, and the feedback terminal coupled to the second input of the first comparator; a second comparator that has a first input, a second input, and a comparator output, the comparator output of the second comparator coupled to the reset input of the bistable multivibrator; and the drain current terminal coupled to the first input of the second comparator, and the time-varying reference signal coupled to the second input of the second comparator; wherein the gate-drive controller is configured to assert the gate drive terminal when a feedback signal on the feedback terminal crosses the reference voltage, and the controller is configured to de-assert the gate drive terminal when a drain current signal on the drain current terminal crosses the time-varying reference signal. 16. The gate-drive controller of claim 15 wherein the reference signal circuit further comprises an analog circuit configured to create the time-varying reference signal. 17. The gate-drive controller of claim 15 wherein the reference signal circuit further comprises a digital circuit configured to create the time-varying reference signal. 18. The gate-drive controller of claim 15 wherein the reference signal circuit is configured to create a triangle wave. 19. The gate-drive controller of claim 15 wherein the reference signal circuit is configured to create at least one selected from a group comprising: the time-varying reference signal in the form of a triangle wave; and the time-varying reference signal in the form of a saw tooth wave. 20. The gate-drive controller of claim 15:
wherein the first comparator output is coupled directly to the set input of the bistable multivibrator; and wherein the comparator output of the second comparator is coupled directly to the reset input of the bistable multivibrator. 21. The controller of claim 1 wherein the reference signal circuit is configured to create the time-varying reference signal in the form of a sinusoid having the modulation period. 22. The controller of claim 1 wherein the controller is configured to operate the buck-type power converter in discontinuous current mode. 23. The gate-drive controller of claim 15 wherein the reference signal circuit is configured to create the time-varying reference signal in the form of a sinusoid. 24. The gate-drive controller of claim 15 wherein the gate-drive controller is configured to operate a buck-type power converter in discontinuous current mode. 25. A buck-type power converter comprising:
a transistor defining a gate, a source, and a drain, the drain coupled to a voltage input; an inductor defining a first lead and a second lead, the first lead coupled to the source, and the second lead coupled to a positive terminal of a voltage output; a first diode defining an anode and a cathode, the anode coupled to a negative terminal of the voltage output, and the anode coupled to the first lead of the inductor; a voltage sample circuit comprising a second diode defining an anode and a cathode, a voltage divider defining a first lead and second lead, and a capacitor defining a first lead and a second lead, the second diode coupled in series with the voltage divider, the capacitor in parallel with the voltage divider, an anode of the second diode coupled to the second lead of the inductor, and the second lead of the voltage divider and the second lead of the capacitor coupled to the first lead of the inductor; a means for sensing current flow through the transistor, the means for sensing defines a current sense output; a gate-drive controller comprising:
a gate drive terminal coupled to the gate of the transistor;
a feedback terminal coupled to the voltage sample circuit;
a drain current terminal coupled to the current sense output;
a reference signal circuit configured to create a time-varying reference signal with a modulation period that is constant;
a bistable multivibrator, the bistable multivibrator defining a set input, a reset input, and an output, the bistable multivibrator coupled to the gate drive terminal;
a first comparator that has a first input, a second input, and a comparator output, the comparator output coupled to the set input of the bistable multivibrator;
a reference voltage coupled to the first input of the first comparator, and the feedback terminal coupled to the second input of the first comparator;
a second comparator that has a first input, a second input, and a comparator output, the comparator output of the second comparator coupled to the reset input of the bistable multivibrator; and
the drain current terminal coupled to the first input of the second comparator, and the time-varying reference signal coupled to the second input of the second comparator;
wherein the controller is configured to generate a variable frequency gate drive signal applied to the gate drive terminal from the SR output, the frequency controlled based on the time-varying reference signal and a feedback signal received on the feedback terminal. 26. The buck-type power converter of claim 25 wherein the gate-drive controller is configured to assert the gate drive terminal when a feedback signal on the feedback terminal crosses the reference voltage, and the controller is configured to de-assert the gate drive terminal when a drain current signal on the drain current terminal crosses the time-varying reference signal. 27. The buck-type power converter of claim 25 wherein the reference signal circuit is configured to create at least one selected from a group comprising: the time-varying reference signal in the form of a triangle wave; and the time-varying reference signal in the form of a saw tooth wave. 28. The buck-type power converter of claim 25:
wherein the first comparator output is coupled directly to the set input of the bistable multivibrator; and wherein the comparator output of the second comparator is coupled directly to the reset input of the bistable multivibrator. | 2,800 |
11,715 | 11,715 | 12,866,269 | 2,853 | The incorporation of a polycarbodiimide into a printing ink or varnish considerably enhances the hot machine wash resistance and wet adhesion of the dried ink or varnish, making it especially suitable for use in printing value documents, such as banknotes. | 1. A printing ink or varnish containing a multifunctional polycarbodiimide. 2. A water-based printing ink or varnish according to claim 1. 3. A printing ink or varnish according to claim 1, which comprises hardenable polymer or resin, a solvent therefore and, in the case of an ink, a colourant, where the polymer or resin is: a polycarbonate polyurethanes; a polyether or polyester polycarbonate polyurethane copolymer; a natural resin; an acrylic resin, an acrylic copolymer; or a vinyl acrylic resin. 4. A printing ink or varnish according to claim 3, in which the polymer or resin is a polycarbonate polyurethane and/or a polyether or polyester polycarbonate polyurethane copolymer. 5. A printing ink or varnish according to claim 4, in which the polyurethane is aliphatic. 6. A printing ink or varnish according to claim 1, in which the polycarbodiimide is a water-dispersible multifunctional polycarbodiimide. 7. A process for printing a value document, in which the document is printed using a printing ink or varnish according to claim 1. 8. A process according to claim 7, in which the value document is a banknote. | The incorporation of a polycarbodiimide into a printing ink or varnish considerably enhances the hot machine wash resistance and wet adhesion of the dried ink or varnish, making it especially suitable for use in printing value documents, such as banknotes.1. A printing ink or varnish containing a multifunctional polycarbodiimide. 2. A water-based printing ink or varnish according to claim 1. 3. A printing ink or varnish according to claim 1, which comprises hardenable polymer or resin, a solvent therefore and, in the case of an ink, a colourant, where the polymer or resin is: a polycarbonate polyurethanes; a polyether or polyester polycarbonate polyurethane copolymer; a natural resin; an acrylic resin, an acrylic copolymer; or a vinyl acrylic resin. 4. A printing ink or varnish according to claim 3, in which the polymer or resin is a polycarbonate polyurethane and/or a polyether or polyester polycarbonate polyurethane copolymer. 5. A printing ink or varnish according to claim 4, in which the polyurethane is aliphatic. 6. A printing ink or varnish according to claim 1, in which the polycarbodiimide is a water-dispersible multifunctional polycarbodiimide. 7. A process for printing a value document, in which the document is printed using a printing ink or varnish according to claim 1. 8. A process according to claim 7, in which the value document is a banknote. | 2,800 |
11,716 | 11,716 | 12,161,472 | 2,815 | A method for treating an oxygen-containing semiconductor wafer, and semiconductor component. One embodiment provides a first side, a second side opposite the first side. A first semiconductor region adjoins the first side. A second semiconductor region adjoins the second side. The second side of the wafer is irridated such that lattice vacancies arise in the second semiconductor region. A first thermal process is carried out the duration of which is chosen such that oxygen agglomerates form in the second semiconductor region and that lattice vacancies diffuse from the first semiconductor region into the second semiconductor region. | 1.-72. (canceled) 73. A method comprising:
providing an oxygen-containing semiconductor wafer including a first side, a second side opposite the first side, a first semiconductor region adjoining the first side, and a second semiconductor region adjoining the second side; irradiating the second side of the wafer such that lattice vacancies arise in the second semiconductor region; and carrying out a first thermal process forming oxygen agglomerates in the second semiconductor region and lattice vacancies diffuse from the first semiconductor region into the second semiconductor region. 74. The method of claim 73, comprising wherein the temperature during the thermal process is between 780° C. and 1020° C. 75. The method of claim 73, comprising:
heating the wafer to a first temperature during the thermal process for a first time duration; and heating the wafer to a second temperature greater than the first temperature for a second time duration, which is longer than the first time duration. 76. The method of claim 73, comprising:
before irradiating the second side of the wafer, carrying out a second thermal process, and exposing at least the first side to a moist and/or oxidizing atmosphere. 77. The method of claim 73, comprising producing trenches which extend into the wafer proceeding from the second side. 78. A method comprising:
providing an oxygen-containing semiconductor wafer including a first side, a second side opposite the first side, a first semiconductor region adjoining the first side, and a second semiconductor region adjoining the second side, wherein a low-vacancy semiconductor zone is formed in the first semiconductor region; irradiating the second side of the wafer with protons or helium ions, such that lattice vacancies arise in the second semiconductor region; and carrying out a first thermal process, wherein the wafer is heated to temperatures of between 700° C. and 1100° C. and the duration of which is chosen such that oxygen agglomerates form in the second semiconductor region and that lattice vacancies diffuse from the first semiconductor region into the second semiconductor region. 79. The method of claim 78, comprising:
heating the wafer, during the thermal process, to a temperature of between 790° C. and 810° C. for a first time duration, which is shorter than ten hours; and heating to a temperature of between 985° C. and 1015° C. for a second time duration, which is longer than ten hours. 80. The method of claim 78, comprising:
before irradiating the second side of the wafer, carrying out a second thermal process, wherein the wafer is heated to a temperature of greater than 1000° C., and wherein at least the first side is exposed to a moist and/or oxidizing atmosphere. 81. The method of claim 78, comprising after irradiating the second side of the wafer and before the first thermal process:
carrying out a further thermal process, wherein the wafer is heated to temperatures of between 350° C. and 450° C. 82. The method of claim 78, comprising producing, before irradiating the wafer, trenches which extend into the wafer proceeding from the second side. 83. The method of claim 78, comprising:
carrying out a third thermal process, wherein at least the first semiconductor zone is heated in such a way that oxygen atoms outdiffuse from said first semiconductor zone via the first side of the wafer. 84. The method of claim 78, comprising:
after carrying out the first thermal process, producing an n-doped semiconductor zone in the first semiconductor zone; irradiating the wafer with protons via at least one of the first and second sides, thus giving rise to crystal defects in the first semiconductor zone; and carrying out a further thermal process, wherein the wafer is heated to temperatures of between 400° C. and 570° C. at least in the region of the first side, such that hydrogen-induced donors arise. 85. The method of claim 78, comprising choosing the duration and the temperature of the further thermal process such that the n-doped semiconductor zone has in a vertical direction of the semiconductor body at least over 60% of its vertical extent an at least approximately homogeneous doping produced by the proton irradiation. 86. The method of claim 85, comprising choosing the duration and the temperature of the further thermal process such that the n-doped semiconductor zone has in a vertical direction of the semiconductor body at least over 80% of its vertical extent an at least approximately homogeneous doping produced by the proton irradiation. 87. The method of claim 78, comprising:
after carrying out the second thermal process, producing an n-doped semiconductor zone in the first semiconductor zone; irradiating the wafer with protons via at least one of the first and second sides, thus giving rise to crystal defects in the first semiconductor zone; and carrying out a further thermal process, in which the wafer is heated to temperatures of between 400° C. and 570° C. at least in the region of the first side, such that hydrogen-induced donors arise. 88. The method of claim 78, wherein irradiating the wafer with protons comprises at least two irradiation processes wherein the wafer is irradiated with protons having a different irradiation energy. 89. The method of claim 78, comprising:
the production of an n-doped field stop zone in the wafer; irradiating the wafer with protons via at least one of the first and second sides, thus giving rise to crystal defects in the first semiconductor zone; and carrying out a thermal process wherein the wafer is heated to temperatures of between 350° C. and 550° C., such that a field stop zone with hydrogen-induced donors arises. 90. The method of claim 89, comprising effecting the proton irradiation for producing the field stop zone via the second side, and heating the wafer to temperatures of between 350° C. and 420° C. 91. The method of claim 89, comprising employing a plurality of irradiation steps with a plurality of irradiation energies for the production of the field stop zone. 92. A method for producing an n-doped zone in a semiconductor wafer comprising:
a first side; a second side opposite the first side; and a first semiconductor zone low in oxygen precipitates and adjoining the first side, comprising:
implanting protons into the wafer via the first side, thus giving rise to crystal defects in the first semiconductor zone and whereby protons are implanted right into an end-of-range region—dependent on an implantation energy—within the semiconductor wafer;
carrying out a further thermal process, wherein the wafer is heated to temperatures of between 400° C. and 570° C. at least in the region of the first side, such that an n-doped semiconductor zone with hydrogen-induced donors arises, and wherein the duration and the temperature are chosen such that protons diffuse from the end-of-range region in a direction of the first side, such that the n-doped semiconductor zone has a region of at least approximately homogeneous doping which extends in a vertical direction of the semiconductor body at least over 60% of a distance between the end-of-range region and the first side and which has an at least approximately homogeneous doping produced by the proton implantation, such that a ratio between maximum doping concentration and minimum doping concentration in the region of homogeneous doping is a maximum of 3. 93. The method of claim 92, comprising choosing the duration and the temperature of the further thermal process such that the region of at least approximately homogeneous doping extends over 80% of a distance between the end-of-range region and the first side. 94. A vertical power semiconductor component comprising:
a semiconductor body having a semiconductor substrate produced according to the Czochralski method, wherein the semiconductor substrate has a semiconductor zone low in oxygen precipitates; and a component zone designed to take up a reverse voltage when the component is driven in the off state and arranged at least in sections in the semiconductor zone low in oxygen precipitates, and has an n-type basic doping formed by hydrogen-induced donors. 95. The semiconductor component of claim 94, comprising wherein the semiconductor body has an epitaxial layer applied to the semiconductor substrate, and wherein the zone which takes up the reverse voltage is arranged in sections in the epitaxial layer. 96. The semiconductor component of claim 94, comprising a MOSFET or an IGBT having a drift zone, forming the zone which takes up the reverse voltage. 97. The semiconductor component of claim 94, comprising a thyristor or a diode having an n-type base, forming the zone which takes up the reverse voltage. | A method for treating an oxygen-containing semiconductor wafer, and semiconductor component. One embodiment provides a first side, a second side opposite the first side. A first semiconductor region adjoins the first side. A second semiconductor region adjoins the second side. The second side of the wafer is irridated such that lattice vacancies arise in the second semiconductor region. A first thermal process is carried out the duration of which is chosen such that oxygen agglomerates form in the second semiconductor region and that lattice vacancies diffuse from the first semiconductor region into the second semiconductor region.1.-72. (canceled) 73. A method comprising:
providing an oxygen-containing semiconductor wafer including a first side, a second side opposite the first side, a first semiconductor region adjoining the first side, and a second semiconductor region adjoining the second side; irradiating the second side of the wafer such that lattice vacancies arise in the second semiconductor region; and carrying out a first thermal process forming oxygen agglomerates in the second semiconductor region and lattice vacancies diffuse from the first semiconductor region into the second semiconductor region. 74. The method of claim 73, comprising wherein the temperature during the thermal process is between 780° C. and 1020° C. 75. The method of claim 73, comprising:
heating the wafer to a first temperature during the thermal process for a first time duration; and heating the wafer to a second temperature greater than the first temperature for a second time duration, which is longer than the first time duration. 76. The method of claim 73, comprising:
before irradiating the second side of the wafer, carrying out a second thermal process, and exposing at least the first side to a moist and/or oxidizing atmosphere. 77. The method of claim 73, comprising producing trenches which extend into the wafer proceeding from the second side. 78. A method comprising:
providing an oxygen-containing semiconductor wafer including a first side, a second side opposite the first side, a first semiconductor region adjoining the first side, and a second semiconductor region adjoining the second side, wherein a low-vacancy semiconductor zone is formed in the first semiconductor region; irradiating the second side of the wafer with protons or helium ions, such that lattice vacancies arise in the second semiconductor region; and carrying out a first thermal process, wherein the wafer is heated to temperatures of between 700° C. and 1100° C. and the duration of which is chosen such that oxygen agglomerates form in the second semiconductor region and that lattice vacancies diffuse from the first semiconductor region into the second semiconductor region. 79. The method of claim 78, comprising:
heating the wafer, during the thermal process, to a temperature of between 790° C. and 810° C. for a first time duration, which is shorter than ten hours; and heating to a temperature of between 985° C. and 1015° C. for a second time duration, which is longer than ten hours. 80. The method of claim 78, comprising:
before irradiating the second side of the wafer, carrying out a second thermal process, wherein the wafer is heated to a temperature of greater than 1000° C., and wherein at least the first side is exposed to a moist and/or oxidizing atmosphere. 81. The method of claim 78, comprising after irradiating the second side of the wafer and before the first thermal process:
carrying out a further thermal process, wherein the wafer is heated to temperatures of between 350° C. and 450° C. 82. The method of claim 78, comprising producing, before irradiating the wafer, trenches which extend into the wafer proceeding from the second side. 83. The method of claim 78, comprising:
carrying out a third thermal process, wherein at least the first semiconductor zone is heated in such a way that oxygen atoms outdiffuse from said first semiconductor zone via the first side of the wafer. 84. The method of claim 78, comprising:
after carrying out the first thermal process, producing an n-doped semiconductor zone in the first semiconductor zone; irradiating the wafer with protons via at least one of the first and second sides, thus giving rise to crystal defects in the first semiconductor zone; and carrying out a further thermal process, wherein the wafer is heated to temperatures of between 400° C. and 570° C. at least in the region of the first side, such that hydrogen-induced donors arise. 85. The method of claim 78, comprising choosing the duration and the temperature of the further thermal process such that the n-doped semiconductor zone has in a vertical direction of the semiconductor body at least over 60% of its vertical extent an at least approximately homogeneous doping produced by the proton irradiation. 86. The method of claim 85, comprising choosing the duration and the temperature of the further thermal process such that the n-doped semiconductor zone has in a vertical direction of the semiconductor body at least over 80% of its vertical extent an at least approximately homogeneous doping produced by the proton irradiation. 87. The method of claim 78, comprising:
after carrying out the second thermal process, producing an n-doped semiconductor zone in the first semiconductor zone; irradiating the wafer with protons via at least one of the first and second sides, thus giving rise to crystal defects in the first semiconductor zone; and carrying out a further thermal process, in which the wafer is heated to temperatures of between 400° C. and 570° C. at least in the region of the first side, such that hydrogen-induced donors arise. 88. The method of claim 78, wherein irradiating the wafer with protons comprises at least two irradiation processes wherein the wafer is irradiated with protons having a different irradiation energy. 89. The method of claim 78, comprising:
the production of an n-doped field stop zone in the wafer; irradiating the wafer with protons via at least one of the first and second sides, thus giving rise to crystal defects in the first semiconductor zone; and carrying out a thermal process wherein the wafer is heated to temperatures of between 350° C. and 550° C., such that a field stop zone with hydrogen-induced donors arises. 90. The method of claim 89, comprising effecting the proton irradiation for producing the field stop zone via the second side, and heating the wafer to temperatures of between 350° C. and 420° C. 91. The method of claim 89, comprising employing a plurality of irradiation steps with a plurality of irradiation energies for the production of the field stop zone. 92. A method for producing an n-doped zone in a semiconductor wafer comprising:
a first side; a second side opposite the first side; and a first semiconductor zone low in oxygen precipitates and adjoining the first side, comprising:
implanting protons into the wafer via the first side, thus giving rise to crystal defects in the first semiconductor zone and whereby protons are implanted right into an end-of-range region—dependent on an implantation energy—within the semiconductor wafer;
carrying out a further thermal process, wherein the wafer is heated to temperatures of between 400° C. and 570° C. at least in the region of the first side, such that an n-doped semiconductor zone with hydrogen-induced donors arises, and wherein the duration and the temperature are chosen such that protons diffuse from the end-of-range region in a direction of the first side, such that the n-doped semiconductor zone has a region of at least approximately homogeneous doping which extends in a vertical direction of the semiconductor body at least over 60% of a distance between the end-of-range region and the first side and which has an at least approximately homogeneous doping produced by the proton implantation, such that a ratio between maximum doping concentration and minimum doping concentration in the region of homogeneous doping is a maximum of 3. 93. The method of claim 92, comprising choosing the duration and the temperature of the further thermal process such that the region of at least approximately homogeneous doping extends over 80% of a distance between the end-of-range region and the first side. 94. A vertical power semiconductor component comprising:
a semiconductor body having a semiconductor substrate produced according to the Czochralski method, wherein the semiconductor substrate has a semiconductor zone low in oxygen precipitates; and a component zone designed to take up a reverse voltage when the component is driven in the off state and arranged at least in sections in the semiconductor zone low in oxygen precipitates, and has an n-type basic doping formed by hydrogen-induced donors. 95. The semiconductor component of claim 94, comprising wherein the semiconductor body has an epitaxial layer applied to the semiconductor substrate, and wherein the zone which takes up the reverse voltage is arranged in sections in the epitaxial layer. 96. The semiconductor component of claim 94, comprising a MOSFET or an IGBT having a drift zone, forming the zone which takes up the reverse voltage. 97. The semiconductor component of claim 94, comprising a thyristor or a diode having an n-type base, forming the zone which takes up the reverse voltage. | 2,800 |
11,717 | 11,717 | 15,388,726 | 2,849 | Described are various techniques that can minimize the use of high-voltage devices in a unity-gain buffer that can be used in a high voltage application, while providing a circuit that generates an output that is an accurately buffered version of the input. | 1. A circuit for use with high voltage supply nodes, wherein voltages of the high voltage supply nodes are large enough to exceed a voltage capability of a low voltage transistor structure in the circuit but not large enough to exceed a voltage capability of a high voltage transistor structure in the circuit, and voltages of low voltage supply nodes are low enough to accommodate a voltage capability of a low voltage transistor structure in the circuit, the circuit comprising:
a buffer circuit for providing substantially unity gain to an input signal applied thereto, the buffer including:
a current source with high-voltage capability configured to couple to a first high voltage supply node;
a current sink with high-voltage capability configured to couple to a second high voltage supply node;
a low voltage circuit coupled to low voltage supply nodes between the current source and the current sink, the low voltage circuit including:
a differential stage having a first input and a second input, the first input configured to receive the input signal and the second input configured to receive a representation of an output of the buffer circuit; and
an output transistor circuit connected in a follower configuration and coupled to the output of the differential stage, the output transistor circuit configured to provide the output voltage of the buffer circuit. 2. The circuit of claim 1, wherein the differential stage includes a transconductance amplifier. 3. The circuit of claim 1, wherein the transconductance amplifier includes a plurality of transistors connected in a cascode configuration. 4. The circuit of claim 1, wherein the output transistor circuit includes a field effect transistor. 5. The circuit of claim 4, wherein the field effect transistor is a low-voltage field effect transistor, and wherein the output transistor circuit further comprises:
a high-voltage field effect transistor coupled in series with the low-voltage field effect transistor to protect the low-voltage field effect transistor. 6. The circuit of claim 4, wherein the output transistor circuit further comprises:
a voltage level shifting device coupled to a source terminal of the field effect transistor. 7. The circuit of claim 6, wherein the voltage level shifting device includes a diode-connected transistor. 8. The circuit of claim 1, wherein the output transistor circuit includes a single high-voltage field effect transistor. 9. The circuit of claim 1, wherein the output transistor circuit includes a high voltage transistor. 10. The circuit of claim 1, wherein the output transistor circuit includes a bipolar-junction transistor. 11. The circuit of claim 1, wherein the buffer circuit is configured to dynamically bias the current sink at a higher current if a current of the output transistor circuit begins to decrease. 12. The circuit of claim 11, further comprising:
a dynamic low voltage bias transistor coupled to the current sink and configured to dynamically bias the current sink. 13. The circuit of claim 1, wherein the buffer circuit is configured to dynamically bias the current source at a higher current if a current of the output transistor circuit begins to decrease. 14. The circuit of claim 13, further comprising:
a dynamic low voltage bias transistor coupled to the current source and configured to dynamically bias the current sink. 15. The circuit of claim 1, wherein the current source includes a low voltage transistor and a high voltage transistor. 16. A buffer circuit for providing substantially unity gain to an input signal applied thereto and for use with high voltage supply nodes, wherein voltages of the high voltage supply nodes are large enough to exceed a voltage capability of a low voltage transistor structure in the circuit but not large enough to exceed a voltage capability of a high voltage transistor structure in the circuit, and voltages of low voltage supply nodes are low enough to accommodate a voltage capability of a low voltage transistor structure in the circuit, the buffer circuit comprising:
a current source with high-voltage capability configured to couple to a first high voltage supply node;
a current sink with high-voltage capability configured to couple to a second high voltage supply node;
a low voltage circuit coupled to low voltage supply nodes between the current source and the current sink, the low voltage circuit including:
a differential stage having a first input and a second input, the first input configured to receive the input signal and the second input configured to receive a representation of an output of the buffer circuit; and
an output transistor circuit connected in a follower configuration and coupled to the output of the differential stage, the output transistor circuit configured to provide the output voltage of the buffer circuit. 17. The circuit of claim 16, wherein the differential stage includes a transconductance amplifier. 18. The circuit of claim 16, wherein the transconductance amplifier includes a plurality of transistors connected in a cascode configuration. 19. The circuit of claim 16, wherein the output transistor circuit includes a field effect transistor. 20. A method for providing substantially unity gain to an input signal applied thereto and for use with high voltage supply nodes, wherein voltages of the high voltage supply nodes are large enough to exceed a voltage capability of a low voltage transistor structure in the circuit but not large enough to exceed a voltage capability of a high voltage transistor structure in the circuit, and voltages of low voltage supply nodes are low enough to accommodate a voltage capability of a low voltage transistor structure in a circuit, the method comprising:
coupling a current source with high-voltage capability to a first high voltage supply node; coupling a current sink with high-voltage capability to a second high voltage supply node; coupling a low voltage circuit to low voltage supply nodes between the current source and the current sink, the low voltage circuit including a differential stage having a first input and a second input; receiving the input signal using the first input and receiving a representation of an output of the buffer circuit using the second input; coupling an output transistor circuit connected in a follower configuration to the output of the differential stage; and providing, using the output transistor circuit, the output voltage of the buffer circuit. | Described are various techniques that can minimize the use of high-voltage devices in a unity-gain buffer that can be used in a high voltage application, while providing a circuit that generates an output that is an accurately buffered version of the input.1. A circuit for use with high voltage supply nodes, wherein voltages of the high voltage supply nodes are large enough to exceed a voltage capability of a low voltage transistor structure in the circuit but not large enough to exceed a voltage capability of a high voltage transistor structure in the circuit, and voltages of low voltage supply nodes are low enough to accommodate a voltage capability of a low voltage transistor structure in the circuit, the circuit comprising:
a buffer circuit for providing substantially unity gain to an input signal applied thereto, the buffer including:
a current source with high-voltage capability configured to couple to a first high voltage supply node;
a current sink with high-voltage capability configured to couple to a second high voltage supply node;
a low voltage circuit coupled to low voltage supply nodes between the current source and the current sink, the low voltage circuit including:
a differential stage having a first input and a second input, the first input configured to receive the input signal and the second input configured to receive a representation of an output of the buffer circuit; and
an output transistor circuit connected in a follower configuration and coupled to the output of the differential stage, the output transistor circuit configured to provide the output voltage of the buffer circuit. 2. The circuit of claim 1, wherein the differential stage includes a transconductance amplifier. 3. The circuit of claim 1, wherein the transconductance amplifier includes a plurality of transistors connected in a cascode configuration. 4. The circuit of claim 1, wherein the output transistor circuit includes a field effect transistor. 5. The circuit of claim 4, wherein the field effect transistor is a low-voltage field effect transistor, and wherein the output transistor circuit further comprises:
a high-voltage field effect transistor coupled in series with the low-voltage field effect transistor to protect the low-voltage field effect transistor. 6. The circuit of claim 4, wherein the output transistor circuit further comprises:
a voltage level shifting device coupled to a source terminal of the field effect transistor. 7. The circuit of claim 6, wherein the voltage level shifting device includes a diode-connected transistor. 8. The circuit of claim 1, wherein the output transistor circuit includes a single high-voltage field effect transistor. 9. The circuit of claim 1, wherein the output transistor circuit includes a high voltage transistor. 10. The circuit of claim 1, wherein the output transistor circuit includes a bipolar-junction transistor. 11. The circuit of claim 1, wherein the buffer circuit is configured to dynamically bias the current sink at a higher current if a current of the output transistor circuit begins to decrease. 12. The circuit of claim 11, further comprising:
a dynamic low voltage bias transistor coupled to the current sink and configured to dynamically bias the current sink. 13. The circuit of claim 1, wherein the buffer circuit is configured to dynamically bias the current source at a higher current if a current of the output transistor circuit begins to decrease. 14. The circuit of claim 13, further comprising:
a dynamic low voltage bias transistor coupled to the current source and configured to dynamically bias the current sink. 15. The circuit of claim 1, wherein the current source includes a low voltage transistor and a high voltage transistor. 16. A buffer circuit for providing substantially unity gain to an input signal applied thereto and for use with high voltage supply nodes, wherein voltages of the high voltage supply nodes are large enough to exceed a voltage capability of a low voltage transistor structure in the circuit but not large enough to exceed a voltage capability of a high voltage transistor structure in the circuit, and voltages of low voltage supply nodes are low enough to accommodate a voltage capability of a low voltage transistor structure in the circuit, the buffer circuit comprising:
a current source with high-voltage capability configured to couple to a first high voltage supply node;
a current sink with high-voltage capability configured to couple to a second high voltage supply node;
a low voltage circuit coupled to low voltage supply nodes between the current source and the current sink, the low voltage circuit including:
a differential stage having a first input and a second input, the first input configured to receive the input signal and the second input configured to receive a representation of an output of the buffer circuit; and
an output transistor circuit connected in a follower configuration and coupled to the output of the differential stage, the output transistor circuit configured to provide the output voltage of the buffer circuit. 17. The circuit of claim 16, wherein the differential stage includes a transconductance amplifier. 18. The circuit of claim 16, wherein the transconductance amplifier includes a plurality of transistors connected in a cascode configuration. 19. The circuit of claim 16, wherein the output transistor circuit includes a field effect transistor. 20. A method for providing substantially unity gain to an input signal applied thereto and for use with high voltage supply nodes, wherein voltages of the high voltage supply nodes are large enough to exceed a voltage capability of a low voltage transistor structure in the circuit but not large enough to exceed a voltage capability of a high voltage transistor structure in the circuit, and voltages of low voltage supply nodes are low enough to accommodate a voltage capability of a low voltage transistor structure in a circuit, the method comprising:
coupling a current source with high-voltage capability to a first high voltage supply node; coupling a current sink with high-voltage capability to a second high voltage supply node; coupling a low voltage circuit to low voltage supply nodes between the current source and the current sink, the low voltage circuit including a differential stage having a first input and a second input; receiving the input signal using the first input and receiving a representation of an output of the buffer circuit using the second input; coupling an output transistor circuit connected in a follower configuration to the output of the differential stage; and providing, using the output transistor circuit, the output voltage of the buffer circuit. | 2,800 |
11,718 | 11,718 | 15,355,183 | 2,892 | First and second machine tools machine a workpiece and transmit machine status information each representing the status thereof to a server. A measurement device measures the workpiece machined by the first machine tool and transmits workpiece information representing a status of a defective workpiece to the server. The server includes a machining accuracy defect countermeasure database storing the status of the defective workpiece and a corresponding maintenance content, a machine status database storing the machine status information on the first and second machine tools, and a notification unit that extracts the maintenance content corresponding to the status of the defective workpiece when the status of the workpiece included in the workpiece information and the status of the defective workpiece included in the machining accuracy defect countermeasure database are similar to each other, and that outputs a notification recommending execution of the extracted maintenance content in the second machine tool when the machine status information on the first machine tool and the machine status information on the second machine tool are similar to each other. | 1. A recommended maintenance notification system comprising:
a first machine tool and a second machine tool that machine a workpiece according to a machining program; a measurement device that measures at least the workpiece machined by the first machine tool; and a server, wherein the first machine tool and the second machine tool transmit machine status information each representing a status thereof to the server, the measurement device transmits workpiece information representing a status of the workpiece that becomes defective after being machined by the first machine tool, to the server, the server includes: a machining accuracy defect countermeasure database that represents a database in which an occurrence case of a machining defect and a countermeasure thereto are accumulated, the database storing a status of a defective workpiece and a corresponding maintenance content; a machine status database that stores the machine status information on the first machine tool and the second machine tool; and a notification unit that extracts the maintenance content corresponding to the status of the defective workpiece when the status of the workpiece included in the workpiece information and the status of the defective workpiece included in the machining accuracy defect countermeasure database are similar to each other, and that outputs a notification recommending execution of the extracted maintenance content in the second machine tool when the machine status information on the first machine tool and the machine status information on the second machine tool are similar to each other. 2. The recommended maintenance notification system according to claim 1, wherein
the workpiece information includes the status of the workpiece and an identifier of the first machine tool, the machining accuracy defect countermeasure database includes the status of the defective workpiece, a monitored spot of a machine tool, and a maintenance content corresponding to the monitored spot, the machine status database includes the identifier of the first machine tool, a monitored spot of the first machine tool, a status of the monitored spot of the first machine tool, an identifier of the second machine tool, a monitored spot of the second machine tool, and a status of the monitored spot of the second machine tool, and the notification unit: extracts the maintenance content corresponding to the status of the defective workpiece from the machining accuracy defect countermeasure database when the status of the workpiece included in the workpiece information and the status of the defective workpiece included in the machining accuracy defect countermeasure database are similar to each other and when the monitored spot of the first machine tool included in the machine status database and the monitored spot of the machine tool included in the machining accuracy defect countermeasure database match each other; extracts the identifier of the second machine tool when the monitored spot of the first machine tool and the monitored spot of the second machine tool match each other and the status of the monitored spot of the first machine tool and the status of the monitored spot of the second machine tool match each other in the machine status database; and outputs the notification recommending the execution of the extracted maintenance content in the second machine tool represented by the identifier of the second machine tool. 3. The recommended maintenance notification system according to claim 1, wherein
the status of the workpiece included in the workpiece information and the status of the defective workpiece included in the machining accuracy defect countermeasure database each include a measurement point and a measurement dimension, and the notification unit determines that the status of the workpiece included in the workpiece information and the status of the defective workpiece included in the machining accuracy defect countermeasure database are similar to each other when a difference in the measurement dimension at the measurement point falls within a prescribed threshold. 4. The recommended maintenance notification system according to claim 1, wherein
the machine information database includes information for specifying a tool or a jig as the monitored spot of the first machine tool and the monitored spot of the second machine tool, and includes used hours, the number of uses, a temperature, or a pressure of the tool or the jig as the status of the monitored spot of the first machine tool and the status of the monitored spot of the second machine tool, and the notification unit determines that the machine status information on the first machine tool and the machine status information on the second machine tool are similar to each other when a difference in the used hours, the number of uses, the temperature, or the pressure of the tool or the jig falls within a prescribed threshold. 5. The recommended maintenance notification system according to claim 1, wherein
the server further includes a display unit that displays the notification from the notification unit. 6. The recommended maintenance notification system according to claim 1, wherein
the second machine tool further includes a display unit that displays the notification from the notification unit. 7. A recommended maintenance notification system comprising:
a machining accuracy defect countermeasure database that represents a database in which an occurrence case of a machining defect and a countermeasure thereto are accumulated, the database storing a status of a defective workpiece and a corresponding maintenance content; a machine status database that stores machine status information on a first machine tool and a second machine tool; and a notification unit that receives workpiece information representing a status of a workpiece that becomes defective after being machined by the first machine tool, that extracts the maintenance content corresponding to the status of the defective workpiece when the status of the workpiece included in the workpiece information and the status of the defective workpiece included in the machining accuracy defect countermeasure database are similar to each other, and that outputs a notification recommending execution of the extracted maintenance content in the second machine tool when the machine status information on the first machine tool and the machine status information on the second machine tool are similar to each other. | First and second machine tools machine a workpiece and transmit machine status information each representing the status thereof to a server. A measurement device measures the workpiece machined by the first machine tool and transmits workpiece information representing a status of a defective workpiece to the server. The server includes a machining accuracy defect countermeasure database storing the status of the defective workpiece and a corresponding maintenance content, a machine status database storing the machine status information on the first and second machine tools, and a notification unit that extracts the maintenance content corresponding to the status of the defective workpiece when the status of the workpiece included in the workpiece information and the status of the defective workpiece included in the machining accuracy defect countermeasure database are similar to each other, and that outputs a notification recommending execution of the extracted maintenance content in the second machine tool when the machine status information on the first machine tool and the machine status information on the second machine tool are similar to each other.1. A recommended maintenance notification system comprising:
a first machine tool and a second machine tool that machine a workpiece according to a machining program; a measurement device that measures at least the workpiece machined by the first machine tool; and a server, wherein the first machine tool and the second machine tool transmit machine status information each representing a status thereof to the server, the measurement device transmits workpiece information representing a status of the workpiece that becomes defective after being machined by the first machine tool, to the server, the server includes: a machining accuracy defect countermeasure database that represents a database in which an occurrence case of a machining defect and a countermeasure thereto are accumulated, the database storing a status of a defective workpiece and a corresponding maintenance content; a machine status database that stores the machine status information on the first machine tool and the second machine tool; and a notification unit that extracts the maintenance content corresponding to the status of the defective workpiece when the status of the workpiece included in the workpiece information and the status of the defective workpiece included in the machining accuracy defect countermeasure database are similar to each other, and that outputs a notification recommending execution of the extracted maintenance content in the second machine tool when the machine status information on the first machine tool and the machine status information on the second machine tool are similar to each other. 2. The recommended maintenance notification system according to claim 1, wherein
the workpiece information includes the status of the workpiece and an identifier of the first machine tool, the machining accuracy defect countermeasure database includes the status of the defective workpiece, a monitored spot of a machine tool, and a maintenance content corresponding to the monitored spot, the machine status database includes the identifier of the first machine tool, a monitored spot of the first machine tool, a status of the monitored spot of the first machine tool, an identifier of the second machine tool, a monitored spot of the second machine tool, and a status of the monitored spot of the second machine tool, and the notification unit: extracts the maintenance content corresponding to the status of the defective workpiece from the machining accuracy defect countermeasure database when the status of the workpiece included in the workpiece information and the status of the defective workpiece included in the machining accuracy defect countermeasure database are similar to each other and when the monitored spot of the first machine tool included in the machine status database and the monitored spot of the machine tool included in the machining accuracy defect countermeasure database match each other; extracts the identifier of the second machine tool when the monitored spot of the first machine tool and the monitored spot of the second machine tool match each other and the status of the monitored spot of the first machine tool and the status of the monitored spot of the second machine tool match each other in the machine status database; and outputs the notification recommending the execution of the extracted maintenance content in the second machine tool represented by the identifier of the second machine tool. 3. The recommended maintenance notification system according to claim 1, wherein
the status of the workpiece included in the workpiece information and the status of the defective workpiece included in the machining accuracy defect countermeasure database each include a measurement point and a measurement dimension, and the notification unit determines that the status of the workpiece included in the workpiece information and the status of the defective workpiece included in the machining accuracy defect countermeasure database are similar to each other when a difference in the measurement dimension at the measurement point falls within a prescribed threshold. 4. The recommended maintenance notification system according to claim 1, wherein
the machine information database includes information for specifying a tool or a jig as the monitored spot of the first machine tool and the monitored spot of the second machine tool, and includes used hours, the number of uses, a temperature, or a pressure of the tool or the jig as the status of the monitored spot of the first machine tool and the status of the monitored spot of the second machine tool, and the notification unit determines that the machine status information on the first machine tool and the machine status information on the second machine tool are similar to each other when a difference in the used hours, the number of uses, the temperature, or the pressure of the tool or the jig falls within a prescribed threshold. 5. The recommended maintenance notification system according to claim 1, wherein
the server further includes a display unit that displays the notification from the notification unit. 6. The recommended maintenance notification system according to claim 1, wherein
the second machine tool further includes a display unit that displays the notification from the notification unit. 7. A recommended maintenance notification system comprising:
a machining accuracy defect countermeasure database that represents a database in which an occurrence case of a machining defect and a countermeasure thereto are accumulated, the database storing a status of a defective workpiece and a corresponding maintenance content; a machine status database that stores machine status information on a first machine tool and a second machine tool; and a notification unit that receives workpiece information representing a status of a workpiece that becomes defective after being machined by the first machine tool, that extracts the maintenance content corresponding to the status of the defective workpiece when the status of the workpiece included in the workpiece information and the status of the defective workpiece included in the machining accuracy defect countermeasure database are similar to each other, and that outputs a notification recommending execution of the extracted maintenance content in the second machine tool when the machine status information on the first machine tool and the machine status information on the second machine tool are similar to each other. | 2,800 |
11,719 | 11,719 | 13,950,372 | 2,862 | A method for estimating a remaining useful life of a system includes monitoring sensor data from sensors deployed within a system. A plurality of features are extracted from the sensor data. Tree graphs are generated including mathematical operators and features as nodes and a advanced feature is produced from each of the tree graphs by transforming the tree graphs into equations. A recursive operation including analyzing a fitness of each of the advanced features, performing crossover/mutation on the tree graphs, producing advanced features from the altered tree graphs, and analyzing the fitness of the altered tree graphs to produce at least one final advanced feature is performed. A remaining useful life of the system is calculated based on the final advanced feature. | 1. A method for estimating a remaining useful life of a system, comprising:
monitoring sensor data from a plurality of sensors deployed within a system; extracting a plurality of simple features from the monitored sensor data, each simple feature representing a function calculated from the sensor data; generating a population including a plurality of individual tree graphs, each tree graph including mathematical operators as non-terminal nodes and at least two of the plurality of simple features as terminal nodes; producing a advanced feature from each of the individual tree graphs of the population by transforming the tree graphs into equations in which the mathematical operators are operators in the equation and the at least two simple features are operands; recursively analyzing a fitness of each of the advanced features to act as a prognostic feature for assessing the system, altering the tree graphs by performing crossover or mutation, producing advanced features from the altered tree graphs, and analyzing the fitness of the altered tree graphs to produce at least one final advanced feature; and calculating a remaining useful life of the system based on the at least one final advanced feature. 2. The method of claim 1, wherein the method is performed after it is discovered that none of the plurality of simple features is sufficiently fit to calculating the remaining useful life of the system. 3. The method of claim 1, wherein the system is an electromechanical system or an industrial facility. 4. The method of claim 1, wherein the sensor data includes a temperature sensor or a vibrational sensor. 5. The method of claim 1, wherein the plurality of simple features includes a root mean squared feature. 6. The method of claim 1, wherein each of the individual tree graphs are of a fixed depth. 7. The method of claim 1, wherein each of the individual tree graphs have a fixed initial depth and the depth of each tree graph increases during subsequent recursion. 8. The method of claim 1, wherein the mathematical operators include addition, subtraction, multiplication, division, or square root. 9. The method of claim 1, wherein in transforming the tree graphs into equations, the hierarchy of the tree graph determines the order in which each of the equations is arranged. 10. The method of claim 1, wherein monotonicity is calculated in analyzing a fitness of each of the advanced features to act as a prognostic feature for assessing the system. 11. The method of claim 1, wherein a structure of each of the individual tree graphs is generated at random. 12. The method of claim 1, wherein in generating the population of individual tree graphs, the mathematical operators and the at least two of the plurality of simple features are selected at random. 13. The method of claim 1, wherein a determination as to whether and how to perform crossover or mutation on each of the tree graphs is made at random with respect to each tree graph. 14. The method of claim 1, wherein alterations that reduce analyzed fitness are undone and alterations that increase analyzed fitness are preserved. 15. The method of claim 1, wherein recursion is continued until a maximum number of iterations have been performed. 16. The method of claim 1, wherein recursion is continued until fitness of at least one of the advanced features is maximized. 17. A computer system comprising:
a processor; and a non-transitory, tangible, program storage medium, readable by the computer system, embodying a program of instructions executable by the processor to perform method steps for estimating a remaining useful life of a system, the method comprising: monitoring sensor data from a plurality of sensors deployed within a system; extracting a plurality of simple features from the monitored sensor data, each simple feature representing a function calculated from the sensor data; utilizing genetic programming to produce at least one advanced feature from the plurality of simple features; and calculating a remaining useful life of the system based on the at least one advanced feature. 18. The method of claim 17, wherein utilizing genetic programming to produce at least one advanced feature from the plurality of simple features, comprises:
generating a population including a plurality of individual tree graphs, each tree graph including mathematical operators as non-terminal nodes and at least two of the plurality of simple features as terminal nodes; producing a advanced feature candidate from each of the individual tree graphs of the population by transforming the tree graphs into equations in which the mathematical operators are operators in the equation and the at least two simple features are operands; and recursively analyzing a fitness of each of the advanced feature candidates to act as a prognostic feature for assessing the system, altering the tree graphs by performing crossover or mutation, producing advanced features candidates from the altered tree graphs, and analyzing the fitness of the altered tree graphs to produce the at least one advanced feature. 19. A method for estimating a remaining useful life of a system, comprising:
monitoring sensor data from a plurality of sensors deployed within a system; utilizing each of a set of simple features to attempt to predict a remaining useful life of a system, each simple feature representing a function calculated from the sensor data, wherein when it is determined that none of the simple features is sufficiently fit to predict the remaining useful life of the system: genetic programming is utilized to produce at least one advanced feature from the plurality of simple features; and a remaining useful life of the system is calculated based on the at least one advanced feature. 20. The method of claim 19, wherein utilizing genetic programming to produce at least one advanced feature from the plurality of simple features, comprises:
generating a population including a plurality of individual tree graphs, each tree graph including mathematical operators as non-terminal nodes and at least two of the plurality of simple features as terminal nodes; producing a advanced feature candidate from each of the individual tree graphs of the population by transforming the tree graphs into equations in which the mathematical operators are operators in the equation and the at least two simple features are operands; and recursively analyzing a fitness of each of the advanced feature candidates to act as a prognostic feature for assessing the system, altering the tree graphs by performing crossover or mutation, producing advanced features candidates from the altered tree graphs, and analyzing the fitness of the altered tree graphs to produce the at least one advanced feature. | A method for estimating a remaining useful life of a system includes monitoring sensor data from sensors deployed within a system. A plurality of features are extracted from the sensor data. Tree graphs are generated including mathematical operators and features as nodes and a advanced feature is produced from each of the tree graphs by transforming the tree graphs into equations. A recursive operation including analyzing a fitness of each of the advanced features, performing crossover/mutation on the tree graphs, producing advanced features from the altered tree graphs, and analyzing the fitness of the altered tree graphs to produce at least one final advanced feature is performed. A remaining useful life of the system is calculated based on the final advanced feature.1. A method for estimating a remaining useful life of a system, comprising:
monitoring sensor data from a plurality of sensors deployed within a system; extracting a plurality of simple features from the monitored sensor data, each simple feature representing a function calculated from the sensor data; generating a population including a plurality of individual tree graphs, each tree graph including mathematical operators as non-terminal nodes and at least two of the plurality of simple features as terminal nodes; producing a advanced feature from each of the individual tree graphs of the population by transforming the tree graphs into equations in which the mathematical operators are operators in the equation and the at least two simple features are operands; recursively analyzing a fitness of each of the advanced features to act as a prognostic feature for assessing the system, altering the tree graphs by performing crossover or mutation, producing advanced features from the altered tree graphs, and analyzing the fitness of the altered tree graphs to produce at least one final advanced feature; and calculating a remaining useful life of the system based on the at least one final advanced feature. 2. The method of claim 1, wherein the method is performed after it is discovered that none of the plurality of simple features is sufficiently fit to calculating the remaining useful life of the system. 3. The method of claim 1, wherein the system is an electromechanical system or an industrial facility. 4. The method of claim 1, wherein the sensor data includes a temperature sensor or a vibrational sensor. 5. The method of claim 1, wherein the plurality of simple features includes a root mean squared feature. 6. The method of claim 1, wherein each of the individual tree graphs are of a fixed depth. 7. The method of claim 1, wherein each of the individual tree graphs have a fixed initial depth and the depth of each tree graph increases during subsequent recursion. 8. The method of claim 1, wherein the mathematical operators include addition, subtraction, multiplication, division, or square root. 9. The method of claim 1, wherein in transforming the tree graphs into equations, the hierarchy of the tree graph determines the order in which each of the equations is arranged. 10. The method of claim 1, wherein monotonicity is calculated in analyzing a fitness of each of the advanced features to act as a prognostic feature for assessing the system. 11. The method of claim 1, wherein a structure of each of the individual tree graphs is generated at random. 12. The method of claim 1, wherein in generating the population of individual tree graphs, the mathematical operators and the at least two of the plurality of simple features are selected at random. 13. The method of claim 1, wherein a determination as to whether and how to perform crossover or mutation on each of the tree graphs is made at random with respect to each tree graph. 14. The method of claim 1, wherein alterations that reduce analyzed fitness are undone and alterations that increase analyzed fitness are preserved. 15. The method of claim 1, wherein recursion is continued until a maximum number of iterations have been performed. 16. The method of claim 1, wherein recursion is continued until fitness of at least one of the advanced features is maximized. 17. A computer system comprising:
a processor; and a non-transitory, tangible, program storage medium, readable by the computer system, embodying a program of instructions executable by the processor to perform method steps for estimating a remaining useful life of a system, the method comprising: monitoring sensor data from a plurality of sensors deployed within a system; extracting a plurality of simple features from the monitored sensor data, each simple feature representing a function calculated from the sensor data; utilizing genetic programming to produce at least one advanced feature from the plurality of simple features; and calculating a remaining useful life of the system based on the at least one advanced feature. 18. The method of claim 17, wherein utilizing genetic programming to produce at least one advanced feature from the plurality of simple features, comprises:
generating a population including a plurality of individual tree graphs, each tree graph including mathematical operators as non-terminal nodes and at least two of the plurality of simple features as terminal nodes; producing a advanced feature candidate from each of the individual tree graphs of the population by transforming the tree graphs into equations in which the mathematical operators are operators in the equation and the at least two simple features are operands; and recursively analyzing a fitness of each of the advanced feature candidates to act as a prognostic feature for assessing the system, altering the tree graphs by performing crossover or mutation, producing advanced features candidates from the altered tree graphs, and analyzing the fitness of the altered tree graphs to produce the at least one advanced feature. 19. A method for estimating a remaining useful life of a system, comprising:
monitoring sensor data from a plurality of sensors deployed within a system; utilizing each of a set of simple features to attempt to predict a remaining useful life of a system, each simple feature representing a function calculated from the sensor data, wherein when it is determined that none of the simple features is sufficiently fit to predict the remaining useful life of the system: genetic programming is utilized to produce at least one advanced feature from the plurality of simple features; and a remaining useful life of the system is calculated based on the at least one advanced feature. 20. The method of claim 19, wherein utilizing genetic programming to produce at least one advanced feature from the plurality of simple features, comprises:
generating a population including a plurality of individual tree graphs, each tree graph including mathematical operators as non-terminal nodes and at least two of the plurality of simple features as terminal nodes; producing a advanced feature candidate from each of the individual tree graphs of the population by transforming the tree graphs into equations in which the mathematical operators are operators in the equation and the at least two simple features are operands; and recursively analyzing a fitness of each of the advanced feature candidates to act as a prognostic feature for assessing the system, altering the tree graphs by performing crossover or mutation, producing advanced features candidates from the altered tree graphs, and analyzing the fitness of the altered tree graphs to produce the at least one advanced feature. | 2,800 |
11,720 | 11,720 | 14,972,709 | 2,856 | A gas sensor 100 includes a housing 110 and with a measuring element 10 . The measuring element 10 has a heating coil 20 , which is coated with a catalytically active or inactive ceramic 30 . The ceramic 30 contains a fibrous material. The fibrous material may be, for example, a glass fiber material. | 1. A gas sensor comprising:
a housing; and a measuring element connected to the housing, the measuring element comprising a heating coil coated with a catalytically active or inactive ceramic, wherein the ceramic contains a fibrous material. 2. A gas sensor in accordance with claim 1, wherein the fibrous material comprises one or more fibrous material selected from the group containing glass fibers, microfibers and nanofibers. 3. A gas sensor in accordance with claim 2, wherein the fibrous material comprises glass fibers comprising one or more of quartz glass, borosilicate and alkali silicate. 4. A gas sensor in accordance with claim 1, wherein the heating coil comprises a wire comprised of a noble metal or a noble metal alloy, wherein the wire is selected from the group containing platinum, palladium, rhodium, iridium, ruthenium, osmium, tungsten, copper, silver, nickel and alloys containing platinum, palladium, rhodium, iridium, ruthenium, osmium, tungsten, copper, silver, nickel. 5. A gas sensor in accordance with claim 1, wherein the ceramic contains a catalyst selected from the group containing platinum, palladium, rhodium, iridium and ruthenium, oxides of platinum, palladium, rhodium, iridium and ruthenium, mixtures containing platinum, palladium, rhodium, iridium and ruthenium, mixtures of oxides of platinum, palladium, rhodium, iridium and ruthenium and mixtures containing platinum, palladium, rhodium, iridium and ruthenium with oxides of platinum, palladium, rhodium, iridium and ruthenium. 6. A gas sensor in accordance with claim 1, wherein the ceramic contains a support prepared from nanoparticles, which contain a material that is selected from the group containing metal oxides, metalloid oxides, oxides of the transition metals, combinations of metal, metalloid and transition metal oxides. 7. A gas sensor in accordance with claim 6, wherein the nanoparticles contain a material that is selected from among oxides of aluminum, boron, titanium, zirconium, hafnium, yttrium, cerium and silicon, zirconium oxide and combinations or mixtures of two or more of aluminum, boron, titanium, zirconium, hafnium, yttrium, cerium, silicon oxides and zirconium oxide. 8. A gas sensor in accordance with claim 1, wherein a percentage by weight of the fibrous material relative to the ceramic is at least 0.1% or more. 9. A gas sensor in accordance with claim 1, wherein the percentage by weight of the fibrous material relative to the ceramic is at most 25%. 10. A gas sensor in accordance with claim 1, wherein the percentage by weight of the fibrous material relative to the ceramic is at least 0.5% and at most 10%. 11. A measuring element for a gas sensor, the measuring element comprising a heating coil coated with a ceramic, wherein the ceramic contains a fibrous material. 12. A measuring element in accordance with claim 11, wherein the heating coil comprises a wire consisting of noble metal or a noble metal alloy selected from the group containing platinum, palladium, rhodium, iridium, ruthenium, osmium, tungsten, copper, silver, nickel and alloys containing platinum, palladium, rhodium, iridium, ruthenium, osmium, tungsten, copper, silver, nickel. 13. A measuring element in accordance with claim 11, wherein:
the ceramic contains a catalyst and a support; the catalyst is selected from the group containing platinum, palladium, rhodium, iridium, ruthenium as well as oxides of platinum, palladium, rhodium, iridium, ruthenium; the support is prepared from nanoparticles, of nanoparticle material selected from the group containing metal oxides, metalloid oxides, oxides of the transition metals, combinations of two or more of metal, metalloid and transition metal oxides. 14. A method for preparing a measuring element comprising a heating coil coated with a catalytically active or inactive ceramic, wherein the ceramic contains a fibrous material for a gas sensor comprising a housing and a measuring element connected to the housing, the method comprising the steps of:
providing a heating coil; preparing a coating solution; applying the coating solution; drying the coating solution; repeating the steps of applying the coating solution and drying the coating solution until a bead has formed; and calcining the bead. 15. A method in accordance with claim 14, wherein steps of repeating the steps of applying the coating solution and drying the coating solution until a bead has formed; and
calcining the bead comprises the application of a heating current. 16. A method in accordance with claim 14, wherein the of preparing a coating solution comprises the steps of:
preparing a raw support mass; adding the fibrous material to the raw mass. 17. A method in accordance with claim 16, wherein:
the raw support mass and the added fibrous material are mixed to form a mixture; and the mixture of raw support mass and fibrous material is suspended. 18. A method in accordance with claim 14, wherein step of providing a heating coil comprises the steps of embedding the heating coil in a skeleton of fibrous material. | A gas sensor 100 includes a housing 110 and with a measuring element 10 . The measuring element 10 has a heating coil 20 , which is coated with a catalytically active or inactive ceramic 30 . The ceramic 30 contains a fibrous material. The fibrous material may be, for example, a glass fiber material.1. A gas sensor comprising:
a housing; and a measuring element connected to the housing, the measuring element comprising a heating coil coated with a catalytically active or inactive ceramic, wherein the ceramic contains a fibrous material. 2. A gas sensor in accordance with claim 1, wherein the fibrous material comprises one or more fibrous material selected from the group containing glass fibers, microfibers and nanofibers. 3. A gas sensor in accordance with claim 2, wherein the fibrous material comprises glass fibers comprising one or more of quartz glass, borosilicate and alkali silicate. 4. A gas sensor in accordance with claim 1, wherein the heating coil comprises a wire comprised of a noble metal or a noble metal alloy, wherein the wire is selected from the group containing platinum, palladium, rhodium, iridium, ruthenium, osmium, tungsten, copper, silver, nickel and alloys containing platinum, palladium, rhodium, iridium, ruthenium, osmium, tungsten, copper, silver, nickel. 5. A gas sensor in accordance with claim 1, wherein the ceramic contains a catalyst selected from the group containing platinum, palladium, rhodium, iridium and ruthenium, oxides of platinum, palladium, rhodium, iridium and ruthenium, mixtures containing platinum, palladium, rhodium, iridium and ruthenium, mixtures of oxides of platinum, palladium, rhodium, iridium and ruthenium and mixtures containing platinum, palladium, rhodium, iridium and ruthenium with oxides of platinum, palladium, rhodium, iridium and ruthenium. 6. A gas sensor in accordance with claim 1, wherein the ceramic contains a support prepared from nanoparticles, which contain a material that is selected from the group containing metal oxides, metalloid oxides, oxides of the transition metals, combinations of metal, metalloid and transition metal oxides. 7. A gas sensor in accordance with claim 6, wherein the nanoparticles contain a material that is selected from among oxides of aluminum, boron, titanium, zirconium, hafnium, yttrium, cerium and silicon, zirconium oxide and combinations or mixtures of two or more of aluminum, boron, titanium, zirconium, hafnium, yttrium, cerium, silicon oxides and zirconium oxide. 8. A gas sensor in accordance with claim 1, wherein a percentage by weight of the fibrous material relative to the ceramic is at least 0.1% or more. 9. A gas sensor in accordance with claim 1, wherein the percentage by weight of the fibrous material relative to the ceramic is at most 25%. 10. A gas sensor in accordance with claim 1, wherein the percentage by weight of the fibrous material relative to the ceramic is at least 0.5% and at most 10%. 11. A measuring element for a gas sensor, the measuring element comprising a heating coil coated with a ceramic, wherein the ceramic contains a fibrous material. 12. A measuring element in accordance with claim 11, wherein the heating coil comprises a wire consisting of noble metal or a noble metal alloy selected from the group containing platinum, palladium, rhodium, iridium, ruthenium, osmium, tungsten, copper, silver, nickel and alloys containing platinum, palladium, rhodium, iridium, ruthenium, osmium, tungsten, copper, silver, nickel. 13. A measuring element in accordance with claim 11, wherein:
the ceramic contains a catalyst and a support; the catalyst is selected from the group containing platinum, palladium, rhodium, iridium, ruthenium as well as oxides of platinum, palladium, rhodium, iridium, ruthenium; the support is prepared from nanoparticles, of nanoparticle material selected from the group containing metal oxides, metalloid oxides, oxides of the transition metals, combinations of two or more of metal, metalloid and transition metal oxides. 14. A method for preparing a measuring element comprising a heating coil coated with a catalytically active or inactive ceramic, wherein the ceramic contains a fibrous material for a gas sensor comprising a housing and a measuring element connected to the housing, the method comprising the steps of:
providing a heating coil; preparing a coating solution; applying the coating solution; drying the coating solution; repeating the steps of applying the coating solution and drying the coating solution until a bead has formed; and calcining the bead. 15. A method in accordance with claim 14, wherein steps of repeating the steps of applying the coating solution and drying the coating solution until a bead has formed; and
calcining the bead comprises the application of a heating current. 16. A method in accordance with claim 14, wherein the of preparing a coating solution comprises the steps of:
preparing a raw support mass; adding the fibrous material to the raw mass. 17. A method in accordance with claim 16, wherein:
the raw support mass and the added fibrous material are mixed to form a mixture; and the mixture of raw support mass and fibrous material is suspended. 18. A method in accordance with claim 14, wherein step of providing a heating coil comprises the steps of embedding the heating coil in a skeleton of fibrous material. | 2,800 |
11,721 | 11,721 | 15,223,476 | 2,828 | The invention relates to a laser handpiece 1, an exchangeable fiber-optic insert 10, and a control unit 70 therefor. The laser handpiece 1 comprises a optical waveguide 35, which is connected to a light coupling site in a base member 21 and in which the application element 10 for laser light is exchangeably attached to the base member 21. The base member 21 is mounted in a sleeve-type grip 3 for axial displacement therein. The light guide 10 can be wound around a control device 70 which has an annular gap 73 for this purpose and a lower housing part 75 which is offset from an upper housing part 74. An exchangeable fiber-optic insert 10, 27 acting as an application element is provided with a sleeve 80 serving as protection during transportation and as an assembling tool. | 1-25. (canceled) 26. A laser handpiece, comprising an optical waveguide, wherein said optical waveguide is fixed to a light coupling site in a base member, an application element for laser light is attached to said base member and the base member is mounted in a sleeve-type grip for axial displacement therein. 27. The laser handpiece as defined in claim 26, wherein said sleeve-type grip consists of several parts and comprises a finger pad region, a supporting region, and an adjustment region. 28. The laser handpiece as defined in claim 26, wherein a position of the base member in relation to the sleeve-type grip is locked or restrained. 29. The laser handpiece as defined in claim 28, wherein said base member has a sliding knob projecting through said sleeve-type grip. 30. The laser handpiece as defined in claim 29, wherein said sliding knob is movable against a force of a spring from a first, restrained position to a second, displaced position. 31. The laser handpiece as defined in claim 26, wherein at least one pushbutton for switching on the laser light is provided, which can be actuated via a keypad having a length of at least 20 mm. 32. The laser handpiece as defined in claim 31, wherein the pushbutton is mounted on said base member and is covered by a rotatable lever mounted on said sleeve-type grip. 33. The laser handpiece as defined in claim 32, wherein said pushbutton on said base member is secured against unintentional actuation when said sleeve-type grip has been removed. 34. The laser handpiece as defined in claim 33, wherein a securing mechanism for securing said pushbutton is formed by a raised surface, by side ridges extending in a longitudinal direction and having a height and spacing such that accidental actuation by a user is not possible or substantially avoided. 35. The laser handpiece as defined in any one of claim 31, wherein said pushbutton for switching on the laser light can be connected to an evaluation unit. 36. The laser handpiece as defined in any one of claims 31, wherein the at least one pushbutton includes a plurality of redundant pushbuttons. 37. The laser handpiece as defined in claim 31, wherein the base member has a sensor oriented toward the light path in said base member and adapted to recognize light having a wavelength of the light supplied by said waveguide and wherein a signal can be transmitted to an evaluation unit. 38. The laser handpiece as defined in claim 31, wherein the at least one pushbutton includes a plurality of redundant pushbuttons. 39. The laser handpiece as defined in claim 26, wherein said application element for laser light is exchangeably mounted in the base member. 40. The laser handpiece as defined in any one of claim 26, wherein said optical waveguide is accommodated in a handpiece hose, and the handpiece hose is connected to said base member and is freely movable relatively to said sleeve-type grip. | The invention relates to a laser handpiece 1, an exchangeable fiber-optic insert 10, and a control unit 70 therefor. The laser handpiece 1 comprises a optical waveguide 35, which is connected to a light coupling site in a base member 21 and in which the application element 10 for laser light is exchangeably attached to the base member 21. The base member 21 is mounted in a sleeve-type grip 3 for axial displacement therein. The light guide 10 can be wound around a control device 70 which has an annular gap 73 for this purpose and a lower housing part 75 which is offset from an upper housing part 74. An exchangeable fiber-optic insert 10, 27 acting as an application element is provided with a sleeve 80 serving as protection during transportation and as an assembling tool.1-25. (canceled) 26. A laser handpiece, comprising an optical waveguide, wherein said optical waveguide is fixed to a light coupling site in a base member, an application element for laser light is attached to said base member and the base member is mounted in a sleeve-type grip for axial displacement therein. 27. The laser handpiece as defined in claim 26, wherein said sleeve-type grip consists of several parts and comprises a finger pad region, a supporting region, and an adjustment region. 28. The laser handpiece as defined in claim 26, wherein a position of the base member in relation to the sleeve-type grip is locked or restrained. 29. The laser handpiece as defined in claim 28, wherein said base member has a sliding knob projecting through said sleeve-type grip. 30. The laser handpiece as defined in claim 29, wherein said sliding knob is movable against a force of a spring from a first, restrained position to a second, displaced position. 31. The laser handpiece as defined in claim 26, wherein at least one pushbutton for switching on the laser light is provided, which can be actuated via a keypad having a length of at least 20 mm. 32. The laser handpiece as defined in claim 31, wherein the pushbutton is mounted on said base member and is covered by a rotatable lever mounted on said sleeve-type grip. 33. The laser handpiece as defined in claim 32, wherein said pushbutton on said base member is secured against unintentional actuation when said sleeve-type grip has been removed. 34. The laser handpiece as defined in claim 33, wherein a securing mechanism for securing said pushbutton is formed by a raised surface, by side ridges extending in a longitudinal direction and having a height and spacing such that accidental actuation by a user is not possible or substantially avoided. 35. The laser handpiece as defined in any one of claim 31, wherein said pushbutton for switching on the laser light can be connected to an evaluation unit. 36. The laser handpiece as defined in any one of claims 31, wherein the at least one pushbutton includes a plurality of redundant pushbuttons. 37. The laser handpiece as defined in claim 31, wherein the base member has a sensor oriented toward the light path in said base member and adapted to recognize light having a wavelength of the light supplied by said waveguide and wherein a signal can be transmitted to an evaluation unit. 38. The laser handpiece as defined in claim 31, wherein the at least one pushbutton includes a plurality of redundant pushbuttons. 39. The laser handpiece as defined in claim 26, wherein said application element for laser light is exchangeably mounted in the base member. 40. The laser handpiece as defined in any one of claim 26, wherein said optical waveguide is accommodated in a handpiece hose, and the handpiece hose is connected to said base member and is freely movable relatively to said sleeve-type grip. | 2,800 |
11,722 | 11,722 | 15,783,239 | 2,813 | Implementations of semiconductor packages may include: a wafer having a first side and a second side, a solder pad coupled to the first side of the wafer, a through silicon via (TSV) extending from the second side of the wafer to the solder pad a metal layer around the walls of the TSV, and a low melting temperature solder in the TSV. The low melting temperature solder may also be coupled to the metal layer. The low melting temperature solder may couple to the solder pad through an opening in a base layer metal of the solder pad. | 1. A semiconductor package comprising:
a wafer comprising a first side and a second side; a solder pad coupled to the first side of the wafer, the solder pad comprising a layer of low melting temperature solder thereon; a through silicon via (TSV) extending from the second side of the wafer to the solder pad; a metal layer around the walls of the TSV; and a low melting temperature solder in the TSV and coupled to the metal layer; wherein the low melting temperature solder couples to the layer of low melting temperature solder on the solder pad through an opening in a base layer metal of the solder pad. 2. The semiconductor package of claim 1, wherein the low melting temperature solder and the solder pad are configured to allow contaminants and water vapor to pass through an opening in the solder pad and the low melting temperature solder created when the wafer is heated above a melting temperature of the low melting temperature solder. 3. The semiconductor package of claim 2, wherein the low melting temperature solder melts before 105° C. 4. The semiconductor package of claim 2, wherein the wafer is not heated above 260° C. 5. The semiconductor package of claim 1, wherein a glass lid is coupled over the wafer. 6. The semiconductor package of claim 1, wherein the semiconductor package is an image sensor chip scale package (CSP). 7. The semiconductor package of claim 1, further comprising a ball grid array coupled to the second side of the wafer. 8-20. (canceled) 21. A semiconductor package comprising:
a wafer comprising a first side and a second side; a solder pad coupled to the first side of the wafer; a through silicon via (TSV) extending from the second side of the wafer to the solder pad; a metal layer around the walls of the TSV; and a solder with a melting point lower than 105° C. comprised in the TSV and coupled to the metal layer; wherein the low melting temperature solder couples to the solder pad through an opening in a base layer metal of the solder pad. 22. The semiconductor package of claim 21, wherein the low melting temperature solder and the solder pad are configured to allow contaminants and water vapor to pass through an opening in the solder pad and the low melting temperature solder created when the wafer is heated above a melting temperature of the low melting temperature solder. 23. The semiconductor package of claim 21, wherein the wafer is not heated above 260° C. 24. The semiconductor package of claim 21, wherein a glass lid is coupled over the wafer. 25. The semiconductor package of claim 21, wherein the semiconductor package is an image sensor chip scale package (CSP). 26. The semiconductor package of claim 21, further comprising a ball grid array coupled to the second side of the wafer. | Implementations of semiconductor packages may include: a wafer having a first side and a second side, a solder pad coupled to the first side of the wafer, a through silicon via (TSV) extending from the second side of the wafer to the solder pad a metal layer around the walls of the TSV, and a low melting temperature solder in the TSV. The low melting temperature solder may also be coupled to the metal layer. The low melting temperature solder may couple to the solder pad through an opening in a base layer metal of the solder pad.1. A semiconductor package comprising:
a wafer comprising a first side and a second side; a solder pad coupled to the first side of the wafer, the solder pad comprising a layer of low melting temperature solder thereon; a through silicon via (TSV) extending from the second side of the wafer to the solder pad; a metal layer around the walls of the TSV; and a low melting temperature solder in the TSV and coupled to the metal layer; wherein the low melting temperature solder couples to the layer of low melting temperature solder on the solder pad through an opening in a base layer metal of the solder pad. 2. The semiconductor package of claim 1, wherein the low melting temperature solder and the solder pad are configured to allow contaminants and water vapor to pass through an opening in the solder pad and the low melting temperature solder created when the wafer is heated above a melting temperature of the low melting temperature solder. 3. The semiconductor package of claim 2, wherein the low melting temperature solder melts before 105° C. 4. The semiconductor package of claim 2, wherein the wafer is not heated above 260° C. 5. The semiconductor package of claim 1, wherein a glass lid is coupled over the wafer. 6. The semiconductor package of claim 1, wherein the semiconductor package is an image sensor chip scale package (CSP). 7. The semiconductor package of claim 1, further comprising a ball grid array coupled to the second side of the wafer. 8-20. (canceled) 21. A semiconductor package comprising:
a wafer comprising a first side and a second side; a solder pad coupled to the first side of the wafer; a through silicon via (TSV) extending from the second side of the wafer to the solder pad; a metal layer around the walls of the TSV; and a solder with a melting point lower than 105° C. comprised in the TSV and coupled to the metal layer; wherein the low melting temperature solder couples to the solder pad through an opening in a base layer metal of the solder pad. 22. The semiconductor package of claim 21, wherein the low melting temperature solder and the solder pad are configured to allow contaminants and water vapor to pass through an opening in the solder pad and the low melting temperature solder created when the wafer is heated above a melting temperature of the low melting temperature solder. 23. The semiconductor package of claim 21, wherein the wafer is not heated above 260° C. 24. The semiconductor package of claim 21, wherein a glass lid is coupled over the wafer. 25. The semiconductor package of claim 21, wherein the semiconductor package is an image sensor chip scale package (CSP). 26. The semiconductor package of claim 21, further comprising a ball grid array coupled to the second side of the wafer. | 2,800 |
11,723 | 11,723 | 15,550,477 | 2,884 | To improve accuracy of distance measurement using a Z pixel having the same size as size of a visible light pixel. In a solid-state imaging apparatus, a visible light converting block includes a plurality of visible light converting units in which light receiving faces for receiving visible light are disposed and configured to generate electric charges in accordance with a light receiving amount of the received visible light, and a visible light electric charge holding unit configured to exclusively hold the electric charges respectively generated by the plurality of visible light converting units in periods different from each other. An infrared light converting block includes a plurality of infrared light converting units in which light receiving faces which have substantially the same size as size of the light receiving faces of the visible light converting units and which receive infrared light are disposed and configured to generate electric charges in accordance with a light receiving amount of the received infrared light, and an infrared light electric charge holding unit configured to collectively and simultaneously hold the electric charges respectively generated by the plurality of infrared light converting units. | 1. A solid-state imaging apparatus comprising:
a visible light converting block that includes a plurality of visible light converting units in which light receiving faces for receiving visible light are disposed and configured to generate electric charges in accordance with a light receiving amount of the received visible light, and a visible light electric charge holding unit configured to exclusively hold the electric charges respectively generated by the plurality of visible light converting units in periods different from each other; and an infrared light converting block that includes a plurality of infrared light converting units in which light receiving faces which have substantially the same size as size of the light receiving faces of the visible light converting units and which receive infrared light are disposed and configured to generate electric charges in accordance with a light receiving amount of the received infrared light, and an infrared light electric charge holding unit configured to collectively and simultaneously hold the electric charges respectively generated by the plurality of infrared light converting units. 2. The solid-state imaging apparatus according to claim 1, wherein the visible light converting block includes the four visible light converting units and the visible light electric charge holding unit. 3. The solid-state imaging apparatus according to claim 2, wherein the infrared light converting block includes the four infrared light converting units and the infrared light electric charge holding unit. 4. The solid-state imaging apparatus according to claim 2, wherein the infrared light converting block includes:
the two infrared light converting units; the two visible light converting units; and the infrared light electric charge holding unit configured to collectively and simultaneously hold the electric charges respectively generated by the two infrared light converting units in the case of holding the electric charges generated by the two infrared light converting units, and exclusively hold the electric charges respectively generated by the two visible light converting units in periods different from each other in the case of holding the electric charges generated by the two visible light converting units.) 5. The solid-state imaging apparatus according to claim 2, wherein the visible light converting block includes the visible light electric charge holding unit and the four visible light converting units in which a red light converting unit which is the visible light converting unit configured to generate the electric charge in accordance with red light, a green light converting unit which is the visible light converting unit configured to generate the electric charge in accordance with green light, and a blue light converting unit which is the visible light converting unit configured to generate the electric charge in accordance with blue light are arranged in a Bayer array. 6. The solid-state imaging apparatus according to claim 2, wherein the visible light converting block includes a red light converting unit which is the visible light converting unit configured to generate the electric charge in accordance with red light, a green light converting unit which is the visible light converting unit configured to generate the electric charge in accordance with green light, a blue light converting unit which is the visible light converting unit configured to generate the electric charge in accordance with blue light, a white light converting unit which is the visible light converting unit configured to generate the electric charge in accordance with white light, and the visible light electric charge holding unit. 7. The solid-state imaging apparatus according to claim 1, wherein the infrared light converting block further includes an infrared light electric charge transferring unit configured to transfer the electric charges respectively generated by the plurality of infrared light converting units to the infrared light electric charge holding unit by conducting electricity between the plurality of infrared light converting units and the infrared light electric charge holding unit at a same time. 8. The solid-state imaging apparatus according to claim 1, further comprising an infrared light signal generating unit configured to generate a signal in accordance with the electric charge held in the infrared light electric charge holding unit. 9. An imaging system comprising:
an infrared light emitting unit configured to emit infrared light to a subject; a visible light converting block that includes a plurality of visible light converting units in which light receiving faces for receiving visible light are disposed and configured to generate electric charges in accordance with a light receiving amount of the received visible light, and a visible light electric charge holding unit configured to exclusively hold the electric charges respectively generated by the plurality of visible light converting units in periods different from each other; an infrared light converting block that includes a plurality of infrared light converting units in which light receiving faces which have substantially the same size as size of the light receiving faces of the visible light converting units and which receive infrared light emitted and reflected by the subject are disposed and configured to generate electric charges in accordance with a light receiving amount of the received infrared light, and an infrared light electric charge holding unit configured to collectively and simultaneously hold the electric charges respectively generated by the plurality of infrared light converting units; an infrared light signal generating unit configured to generate a signal in accordance with the electric charge held in the infrared light electric charge holding unit; and a distance measurement unit configured to measure a distance to the subject by measuring a time period from the emission at the infrared light emitting unit to the light reception at the infrared light converting unit of the infrared light converting block on the basis of the generated signal. 10. A distance measurement method comprising:
an infrared light emitting step of emitting infrared light to a subject; an infrared light signal generating step of generating a signal in accordance with electric charges held in an infrared light electric charge holding unit in an infrared light converting block including a plurality of infrared light converting units in which light receiving faces which have substantially the same size as size of light receiving faces of visible light converting units in a visible light converting block and which receive infrared light emitted and reflected by the subject are disposed and configured to generate electric charges in accordance with a light receiving amount of the received infrared light and the infrared light electric charge holding unit configured to collectively and simultaneously hold the electric charges respectively generated by the plurality of infrared light converting units, the visible light converting block including a plurality of visible light converting units in which the light receiving faces for receiving visible light are disposed and configured to generate electric charges in accordance with a light receiving amount of the received visible light and a visible light electric charge holding unit configured to exclusively hold the electric charges respectively generated by the plurality of visible light converting units in periods different from each other; and a distance measurement step of measuring a distance to the subject by measuring a time period from emission of the infrared light to the light reception at the infrared light converting unit of the infrared light block on the basis of the generated signal. | To improve accuracy of distance measurement using a Z pixel having the same size as size of a visible light pixel. In a solid-state imaging apparatus, a visible light converting block includes a plurality of visible light converting units in which light receiving faces for receiving visible light are disposed and configured to generate electric charges in accordance with a light receiving amount of the received visible light, and a visible light electric charge holding unit configured to exclusively hold the electric charges respectively generated by the plurality of visible light converting units in periods different from each other. An infrared light converting block includes a plurality of infrared light converting units in which light receiving faces which have substantially the same size as size of the light receiving faces of the visible light converting units and which receive infrared light are disposed and configured to generate electric charges in accordance with a light receiving amount of the received infrared light, and an infrared light electric charge holding unit configured to collectively and simultaneously hold the electric charges respectively generated by the plurality of infrared light converting units.1. A solid-state imaging apparatus comprising:
a visible light converting block that includes a plurality of visible light converting units in which light receiving faces for receiving visible light are disposed and configured to generate electric charges in accordance with a light receiving amount of the received visible light, and a visible light electric charge holding unit configured to exclusively hold the electric charges respectively generated by the plurality of visible light converting units in periods different from each other; and an infrared light converting block that includes a plurality of infrared light converting units in which light receiving faces which have substantially the same size as size of the light receiving faces of the visible light converting units and which receive infrared light are disposed and configured to generate electric charges in accordance with a light receiving amount of the received infrared light, and an infrared light electric charge holding unit configured to collectively and simultaneously hold the electric charges respectively generated by the plurality of infrared light converting units. 2. The solid-state imaging apparatus according to claim 1, wherein the visible light converting block includes the four visible light converting units and the visible light electric charge holding unit. 3. The solid-state imaging apparatus according to claim 2, wherein the infrared light converting block includes the four infrared light converting units and the infrared light electric charge holding unit. 4. The solid-state imaging apparatus according to claim 2, wherein the infrared light converting block includes:
the two infrared light converting units; the two visible light converting units; and the infrared light electric charge holding unit configured to collectively and simultaneously hold the electric charges respectively generated by the two infrared light converting units in the case of holding the electric charges generated by the two infrared light converting units, and exclusively hold the electric charges respectively generated by the two visible light converting units in periods different from each other in the case of holding the electric charges generated by the two visible light converting units.) 5. The solid-state imaging apparatus according to claim 2, wherein the visible light converting block includes the visible light electric charge holding unit and the four visible light converting units in which a red light converting unit which is the visible light converting unit configured to generate the electric charge in accordance with red light, a green light converting unit which is the visible light converting unit configured to generate the electric charge in accordance with green light, and a blue light converting unit which is the visible light converting unit configured to generate the electric charge in accordance with blue light are arranged in a Bayer array. 6. The solid-state imaging apparatus according to claim 2, wherein the visible light converting block includes a red light converting unit which is the visible light converting unit configured to generate the electric charge in accordance with red light, a green light converting unit which is the visible light converting unit configured to generate the electric charge in accordance with green light, a blue light converting unit which is the visible light converting unit configured to generate the electric charge in accordance with blue light, a white light converting unit which is the visible light converting unit configured to generate the electric charge in accordance with white light, and the visible light electric charge holding unit. 7. The solid-state imaging apparatus according to claim 1, wherein the infrared light converting block further includes an infrared light electric charge transferring unit configured to transfer the electric charges respectively generated by the plurality of infrared light converting units to the infrared light electric charge holding unit by conducting electricity between the plurality of infrared light converting units and the infrared light electric charge holding unit at a same time. 8. The solid-state imaging apparatus according to claim 1, further comprising an infrared light signal generating unit configured to generate a signal in accordance with the electric charge held in the infrared light electric charge holding unit. 9. An imaging system comprising:
an infrared light emitting unit configured to emit infrared light to a subject; a visible light converting block that includes a plurality of visible light converting units in which light receiving faces for receiving visible light are disposed and configured to generate electric charges in accordance with a light receiving amount of the received visible light, and a visible light electric charge holding unit configured to exclusively hold the electric charges respectively generated by the plurality of visible light converting units in periods different from each other; an infrared light converting block that includes a plurality of infrared light converting units in which light receiving faces which have substantially the same size as size of the light receiving faces of the visible light converting units and which receive infrared light emitted and reflected by the subject are disposed and configured to generate electric charges in accordance with a light receiving amount of the received infrared light, and an infrared light electric charge holding unit configured to collectively and simultaneously hold the electric charges respectively generated by the plurality of infrared light converting units; an infrared light signal generating unit configured to generate a signal in accordance with the electric charge held in the infrared light electric charge holding unit; and a distance measurement unit configured to measure a distance to the subject by measuring a time period from the emission at the infrared light emitting unit to the light reception at the infrared light converting unit of the infrared light converting block on the basis of the generated signal. 10. A distance measurement method comprising:
an infrared light emitting step of emitting infrared light to a subject; an infrared light signal generating step of generating a signal in accordance with electric charges held in an infrared light electric charge holding unit in an infrared light converting block including a plurality of infrared light converting units in which light receiving faces which have substantially the same size as size of light receiving faces of visible light converting units in a visible light converting block and which receive infrared light emitted and reflected by the subject are disposed and configured to generate electric charges in accordance with a light receiving amount of the received infrared light and the infrared light electric charge holding unit configured to collectively and simultaneously hold the electric charges respectively generated by the plurality of infrared light converting units, the visible light converting block including a plurality of visible light converting units in which the light receiving faces for receiving visible light are disposed and configured to generate electric charges in accordance with a light receiving amount of the received visible light and a visible light electric charge holding unit configured to exclusively hold the electric charges respectively generated by the plurality of visible light converting units in periods different from each other; and a distance measurement step of measuring a distance to the subject by measuring a time period from emission of the infrared light to the light reception at the infrared light converting unit of the infrared light block on the basis of the generated signal. | 2,800 |
11,724 | 11,724 | 15,354,537 | 2,837 | A sound barrier panel comprising a substantially planer first wall, with a plurality of apertures defined in the first wall, a non-apertured second wall, a crown connecting the first wall to the second wall, a base connecting the first wall to the second wall, a panel interior defined by a spacing between the first wall, the second wall, the crown, and the base, a sound absorbing material disposed in the panel interior, and the second wall being contoured such that at least one continuous gap is formed between an inner surface of the second wall and the sound absorbing material, wherein the first wall, the second wall, the crown, and the base are formed of a pultruded material. | 1. A sound barrier panel comprising:
a substantially planar first wall, with a plurality of apertures defined in the first wall; a non-apertured second wall; a crown connecting the first wall to the second wall, a base connecting the first wall to the second wall, a panel interior defined by a spacing between the first wall, the second wall, the crown, and the base; a sound absorbing material disposed in the panel interior; and the second wall being contoured such that at least one continuous gap is formed between an inner surface of the second wall and the sound absorbing material; wherein the first wall, the second wall, the crown, and the base are formed of a pultruded material. 2. The sound barrier panel of claim 1 further comprising a tongue defined on one of the crown and the base, and a groove defined on the other of the crown and the base, wherein the tongue matingly fits within the groove. 3. The sound barrier panel of claim 2 wherein the tongue fits within the groove with a transition fit. 4. The sound barrier panel of claim 2 further comprising a shoulder adjacent to the tongue and a foot adjacent to the groove. 5. The sound barrier panel of claim 2 wherein the tongue is between one of one half and one third of the width of the sound barrier panel. 6. The sound barrier panel of claim 1 wherein the second wall has at least one indentation, the indentation spacing the sound absorbing material from a planar portion of the second wall creating the at least one gap. 7. The sound barrier panel of claim 1 wherein a sum volume of the at least one gaps preferably occupies between 3.0% and 35.0% of the panel interior. 8. The sound barrier panel of claim 1 wherein the apertures cover between 22% and 30% of a surface area of the first wall. 9. The sound barrier panel of claim 1 wherein the apertures are circular and have a diameter between 0.25 inches and 1.25 inches. 10. The sound barrier panel of claim 1 further comprising a plurality of uninterrupted wall columns of material on the first wall uninterrupted by apertures, the uninterrupted wall columns extending along the first wall from above an uppermost aperture to below a bottommost aperture. 11. The sound barrier panel of claim 10, wherein at least one of the plurality of uninterrupted wall columns is between ½ and 1 1/10 as wide as a diameter of the apertures. 12. The sound barrier panel of claim 1 wherein the sound barrier panel is flame resistant. 13. The sound barrier panel of claim 1 wherein the first wall, the second wall, the crown, and the base are formed of fiberglass. 14. The sound barrier panel of claim 1 wherein the sound absorbing material is mineral wool, and the sound absorbing material is adjacent to the first wall. 15. (canceled) 16. The sound barrier panel of claim 1 wherein the sound barrier panel has a Noise Reduction Coefficient (NRC) measurement of above 0.95 and a Sound Transmission Class (STC) measurement of above 30.0. 17. The sound barrier panel of claim 1 wherein the sound barrier panel measures between 1.5 inches and 5.0 inches wide, between 6.0 inches and 24.0 inches high, and between 4 feet and 24 feet long. 18. The sound barrier panel of claim 1 further comprising a phenolic coating over an exterior of the first wall, the second wall, the crown, and the base. 19. The sound barrier of claim 1 further comprising a plurality of acoustic diffusers formed on an interior surface of the second wall. 20. The sound barrier of claim 1, wherein a cross-section of the second wall has a shiplap shape. 21. A sound barrier panel comprising:
a substantially planar first wall, with a plurality of circular through apertures defined in the first wall, and covering between 22% and 30% of a surface area of the first wall a non-apertured second wall; a crown connecting the first wall to the second wall, a base connecting the first wall to the second wall, a panel interior defined by a spacing between the first wall, the second wall, the crown, and the base; a sound absorbing material disposed in the panel interior; and the second wall being contoured such that at least one continuous gap is formed between an inner surface of the second wall and the sound absorbing material; wherein the first wall, the second wall, the crown, and the base are formed of pultruded fiberglass, are of unitary construction, and with the exception of the apertures have a substantially fixed cross sectional profile. | A sound barrier panel comprising a substantially planer first wall, with a plurality of apertures defined in the first wall, a non-apertured second wall, a crown connecting the first wall to the second wall, a base connecting the first wall to the second wall, a panel interior defined by a spacing between the first wall, the second wall, the crown, and the base, a sound absorbing material disposed in the panel interior, and the second wall being contoured such that at least one continuous gap is formed between an inner surface of the second wall and the sound absorbing material, wherein the first wall, the second wall, the crown, and the base are formed of a pultruded material.1. A sound barrier panel comprising:
a substantially planar first wall, with a plurality of apertures defined in the first wall; a non-apertured second wall; a crown connecting the first wall to the second wall, a base connecting the first wall to the second wall, a panel interior defined by a spacing between the first wall, the second wall, the crown, and the base; a sound absorbing material disposed in the panel interior; and the second wall being contoured such that at least one continuous gap is formed between an inner surface of the second wall and the sound absorbing material; wherein the first wall, the second wall, the crown, and the base are formed of a pultruded material. 2. The sound barrier panel of claim 1 further comprising a tongue defined on one of the crown and the base, and a groove defined on the other of the crown and the base, wherein the tongue matingly fits within the groove. 3. The sound barrier panel of claim 2 wherein the tongue fits within the groove with a transition fit. 4. The sound barrier panel of claim 2 further comprising a shoulder adjacent to the tongue and a foot adjacent to the groove. 5. The sound barrier panel of claim 2 wherein the tongue is between one of one half and one third of the width of the sound barrier panel. 6. The sound barrier panel of claim 1 wherein the second wall has at least one indentation, the indentation spacing the sound absorbing material from a planar portion of the second wall creating the at least one gap. 7. The sound barrier panel of claim 1 wherein a sum volume of the at least one gaps preferably occupies between 3.0% and 35.0% of the panel interior. 8. The sound barrier panel of claim 1 wherein the apertures cover between 22% and 30% of a surface area of the first wall. 9. The sound barrier panel of claim 1 wherein the apertures are circular and have a diameter between 0.25 inches and 1.25 inches. 10. The sound barrier panel of claim 1 further comprising a plurality of uninterrupted wall columns of material on the first wall uninterrupted by apertures, the uninterrupted wall columns extending along the first wall from above an uppermost aperture to below a bottommost aperture. 11. The sound barrier panel of claim 10, wherein at least one of the plurality of uninterrupted wall columns is between ½ and 1 1/10 as wide as a diameter of the apertures. 12. The sound barrier panel of claim 1 wherein the sound barrier panel is flame resistant. 13. The sound barrier panel of claim 1 wherein the first wall, the second wall, the crown, and the base are formed of fiberglass. 14. The sound barrier panel of claim 1 wherein the sound absorbing material is mineral wool, and the sound absorbing material is adjacent to the first wall. 15. (canceled) 16. The sound barrier panel of claim 1 wherein the sound barrier panel has a Noise Reduction Coefficient (NRC) measurement of above 0.95 and a Sound Transmission Class (STC) measurement of above 30.0. 17. The sound barrier panel of claim 1 wherein the sound barrier panel measures between 1.5 inches and 5.0 inches wide, between 6.0 inches and 24.0 inches high, and between 4 feet and 24 feet long. 18. The sound barrier panel of claim 1 further comprising a phenolic coating over an exterior of the first wall, the second wall, the crown, and the base. 19. The sound barrier of claim 1 further comprising a plurality of acoustic diffusers formed on an interior surface of the second wall. 20. The sound barrier of claim 1, wherein a cross-section of the second wall has a shiplap shape. 21. A sound barrier panel comprising:
a substantially planar first wall, with a plurality of circular through apertures defined in the first wall, and covering between 22% and 30% of a surface area of the first wall a non-apertured second wall; a crown connecting the first wall to the second wall, a base connecting the first wall to the second wall, a panel interior defined by a spacing between the first wall, the second wall, the crown, and the base; a sound absorbing material disposed in the panel interior; and the second wall being contoured such that at least one continuous gap is formed between an inner surface of the second wall and the sound absorbing material; wherein the first wall, the second wall, the crown, and the base are formed of pultruded fiberglass, are of unitary construction, and with the exception of the apertures have a substantially fixed cross sectional profile. | 2,800 |
11,725 | 11,725 | 15,696,226 | 2,884 | In a method for the spectrally resolved measurement of optical properties of samples, a sample is arranged at a measurement position, and light is generated using a light source. Spectral components of the light are transmitted as excitation light in a first optical path to the sample. Light that has been emitted or transmitted by the sample is transmitted in a second optical path to a detector. A tunable monochromator is arranged in the first optical path and/or in the second optical path. A spectrum of the emitted or transmitted light is recorded over an effective spectral range by shifting a spectral passage range of the tunable monochromator. The method is characterized in that light in the form of light pulses with a specifiable pulse frequency is used. The spectral passage range of the tunable monochromator is shifted at a shifting speed continuously from an initial wavelength to an end wavelength for recording a spectrum. The pulse frequency of the light is synchronized with the shifting speed of the spectral passage range by way of a control such that a plurality of measurements of the emitted or transmitted light takes place within the effective spectral range at a corresponding plurality of spectral support points. | 1. A method for the spectrally resolved measurement of optical properties of samples, the method comprising the acts of:
arranging a sample at a measurement position; generating light using a light source; transmitting spectral components of the light as excitation light in a first optical path to the sample; and transmitting light that has been emitted or transmitted by the sample in a second optical path to a detector; wherein a tunable monochromator is arranged in the first optical path and/or in the second optical path; recording a spectrum of the emitted or transmitted light over an effective spectral range by shifting a spectral passage range of the tunable monochromator, wherein light in the form of light pulses with a specifiable pulse frequency is used; the spectral passage range of the tunable monochromator is shifted at a shifting speed continuously from an initial wavelength to an end wavelength for recording a spectrum; and the pulse frequency of the light is synchronized with the shifting speed of the spectral passage range by way of a controller such that a plurality of measurements of the emitted or transmitted light takes place within the effective spectral range at a corresponding plurality of spectral support points. 2. The method according to claim 1, wherein excitation light is radiated onto the sample in the form of light pulses with a specifiable pulse frequency, wherein excitation light in the form of light pulses with a specifiable pulse frequency is generated by way of a pulsed light source. 3. The method according to claim 2, wherein the spectral passage range is shifted continuously at a constant shifting speed from the starting position to the end position. 4. The method according to claim 1, wherein the spectral passage range is shifted continuously at a constant shifting speed from the starting position to the end position. 5. The method according to claim 1, wherein the spectral passage range is shifted at a varying shifting speed from the starting position to the end position, wherein the shifting speed is varied in dependence on at least one property of the spectrum. 6. The method according to claim 5, wherein the spectral passage range is shifted at a varying shifting speed from the starting position to the end position, wherein the shifting speed is varied in dependence on at least one property of the spectrum. 7. The method according to claim 5, wherein an intensity change in the detected light between successive spectral support points is ascertained during the shifting of the passage range, and the shifting speed of the passage range is changed in dependence on the intensity change. 8. The method according to claim 5, wherein, before recording of a spectrum begins, parameters of a speed variation function are preset, and the shifting speed is controlled in accordance with the speed variation function. 9. The method according to claim 5, wherein a control or regulation of the shifting speed is performed inversely proportionally to the intensity change between successive spectral support points such that spectral ranges with relatively strong intensity changes are travelled with a relatively smaller shifting speed and a correspondingly higher density of the support points, and spectral ranges having relatively weaker intensity changes are travelled with relatively greater shifting speed and a lower density of the support points. 10. The method according to claim 7, wherein a control or regulation of the shifting speed is performed inversely proportionally to the intensity change between successive spectral support points such that spectral ranges with relatively strong intensity changes are travelled with a relatively smaller shifting speed and a correspondingly higher density of the support points, and spectral ranges having relatively weaker intensity changes are travelled with relatively greater shifting speed and a lower density of the support points. 11. The method according to claim 8, wherein a control or regulation of the shifting speed is performed inversely proportionally to the intensity change between successive spectral support points such that spectral ranges with relatively strong intensity changes are travelled with a relatively smaller shifting speed and a correspondingly higher density of the support points, and spectral ranges having relatively weaker intensity changes are travelled with relatively greater shifting speed and a lower density of the support points. 12. The method according to claim 1, wherein the recording of a spectrum over the effective spectral range is repeated at least once with the same synchronization of the pulse frequency with the shifting speed of the spectral passage range, and the measurement values obtained for each of the recordings are added in wavelength-correct fashion. 13. A system for spectrally resolved measurement of optical properties of samples, comprising:
a sample holding device for arranging a sample at a measurement position; a light source for generating light; a detector; a control unit; a first optical path for transmitting spectral components of the light as excitation light to the sample; a second optical path for transmitting light that has been emitted or transmitted by the sample to the detector; a tunable monochromator which is controllable by the control unit arranged in the first optical path and/or in the second optical path; wherein the system is configured to record a spectrum of the emitted or transmitted light over an effective spectral range by shifting a spectral passage range of the tunable monochromator, wherein the control unit has an operating mode for recording a spectrum in which the control unit is configured such that:
the system is controlled such that light in the form of light pulses with specifiable pulse frequency is used;
the spectral passage range of the tunable monochromator is shifted at a shifting speed continuously from an initial wavelength to an end wavelength for recording a spectrum; and
the pulse frequency of the light is synchronized with the shifting speed of the spectral passage range by way of a control such that a plurality of measurements of the emitted or transmitted light takes place within the effective spectral range at a corresponding plurality of spectral support points. 14. The system according to claim 13, wherein during the operation mode, the light source is controlled such that excitation light in the form of light pulses with a specifiable pulse frequency is generated. 15. The system according to claim 14, wherein the tunable monochromator is a dispersive monochromator with an adjustable dispersive element, or a tunable filter monochromator, or a tunable interference monochromator. 16. The system according to claim 13, wherein the tunable monochromator is a dispersive monochromator with an adjustable dispersive element, or a tunable filter monochromator, or a tunable interference monochromator. 17. The system according to claim 13, wherein the system is integrated in a multitechnology reader. 18. The system according to claim 14, wherein the system is integrated in a multitechnology reader. 19. The system according to claim 15, wherein the system is integrated in a multitechnology reader. | In a method for the spectrally resolved measurement of optical properties of samples, a sample is arranged at a measurement position, and light is generated using a light source. Spectral components of the light are transmitted as excitation light in a first optical path to the sample. Light that has been emitted or transmitted by the sample is transmitted in a second optical path to a detector. A tunable monochromator is arranged in the first optical path and/or in the second optical path. A spectrum of the emitted or transmitted light is recorded over an effective spectral range by shifting a spectral passage range of the tunable monochromator. The method is characterized in that light in the form of light pulses with a specifiable pulse frequency is used. The spectral passage range of the tunable monochromator is shifted at a shifting speed continuously from an initial wavelength to an end wavelength for recording a spectrum. The pulse frequency of the light is synchronized with the shifting speed of the spectral passage range by way of a control such that a plurality of measurements of the emitted or transmitted light takes place within the effective spectral range at a corresponding plurality of spectral support points.1. A method for the spectrally resolved measurement of optical properties of samples, the method comprising the acts of:
arranging a sample at a measurement position; generating light using a light source; transmitting spectral components of the light as excitation light in a first optical path to the sample; and transmitting light that has been emitted or transmitted by the sample in a second optical path to a detector; wherein a tunable monochromator is arranged in the first optical path and/or in the second optical path; recording a spectrum of the emitted or transmitted light over an effective spectral range by shifting a spectral passage range of the tunable monochromator, wherein light in the form of light pulses with a specifiable pulse frequency is used; the spectral passage range of the tunable monochromator is shifted at a shifting speed continuously from an initial wavelength to an end wavelength for recording a spectrum; and the pulse frequency of the light is synchronized with the shifting speed of the spectral passage range by way of a controller such that a plurality of measurements of the emitted or transmitted light takes place within the effective spectral range at a corresponding plurality of spectral support points. 2. The method according to claim 1, wherein excitation light is radiated onto the sample in the form of light pulses with a specifiable pulse frequency, wherein excitation light in the form of light pulses with a specifiable pulse frequency is generated by way of a pulsed light source. 3. The method according to claim 2, wherein the spectral passage range is shifted continuously at a constant shifting speed from the starting position to the end position. 4. The method according to claim 1, wherein the spectral passage range is shifted continuously at a constant shifting speed from the starting position to the end position. 5. The method according to claim 1, wherein the spectral passage range is shifted at a varying shifting speed from the starting position to the end position, wherein the shifting speed is varied in dependence on at least one property of the spectrum. 6. The method according to claim 5, wherein the spectral passage range is shifted at a varying shifting speed from the starting position to the end position, wherein the shifting speed is varied in dependence on at least one property of the spectrum. 7. The method according to claim 5, wherein an intensity change in the detected light between successive spectral support points is ascertained during the shifting of the passage range, and the shifting speed of the passage range is changed in dependence on the intensity change. 8. The method according to claim 5, wherein, before recording of a spectrum begins, parameters of a speed variation function are preset, and the shifting speed is controlled in accordance with the speed variation function. 9. The method according to claim 5, wherein a control or regulation of the shifting speed is performed inversely proportionally to the intensity change between successive spectral support points such that spectral ranges with relatively strong intensity changes are travelled with a relatively smaller shifting speed and a correspondingly higher density of the support points, and spectral ranges having relatively weaker intensity changes are travelled with relatively greater shifting speed and a lower density of the support points. 10. The method according to claim 7, wherein a control or regulation of the shifting speed is performed inversely proportionally to the intensity change between successive spectral support points such that spectral ranges with relatively strong intensity changes are travelled with a relatively smaller shifting speed and a correspondingly higher density of the support points, and spectral ranges having relatively weaker intensity changes are travelled with relatively greater shifting speed and a lower density of the support points. 11. The method according to claim 8, wherein a control or regulation of the shifting speed is performed inversely proportionally to the intensity change between successive spectral support points such that spectral ranges with relatively strong intensity changes are travelled with a relatively smaller shifting speed and a correspondingly higher density of the support points, and spectral ranges having relatively weaker intensity changes are travelled with relatively greater shifting speed and a lower density of the support points. 12. The method according to claim 1, wherein the recording of a spectrum over the effective spectral range is repeated at least once with the same synchronization of the pulse frequency with the shifting speed of the spectral passage range, and the measurement values obtained for each of the recordings are added in wavelength-correct fashion. 13. A system for spectrally resolved measurement of optical properties of samples, comprising:
a sample holding device for arranging a sample at a measurement position; a light source for generating light; a detector; a control unit; a first optical path for transmitting spectral components of the light as excitation light to the sample; a second optical path for transmitting light that has been emitted or transmitted by the sample to the detector; a tunable monochromator which is controllable by the control unit arranged in the first optical path and/or in the second optical path; wherein the system is configured to record a spectrum of the emitted or transmitted light over an effective spectral range by shifting a spectral passage range of the tunable monochromator, wherein the control unit has an operating mode for recording a spectrum in which the control unit is configured such that:
the system is controlled such that light in the form of light pulses with specifiable pulse frequency is used;
the spectral passage range of the tunable monochromator is shifted at a shifting speed continuously from an initial wavelength to an end wavelength for recording a spectrum; and
the pulse frequency of the light is synchronized with the shifting speed of the spectral passage range by way of a control such that a plurality of measurements of the emitted or transmitted light takes place within the effective spectral range at a corresponding plurality of spectral support points. 14. The system according to claim 13, wherein during the operation mode, the light source is controlled such that excitation light in the form of light pulses with a specifiable pulse frequency is generated. 15. The system according to claim 14, wherein the tunable monochromator is a dispersive monochromator with an adjustable dispersive element, or a tunable filter monochromator, or a tunable interference monochromator. 16. The system according to claim 13, wherein the tunable monochromator is a dispersive monochromator with an adjustable dispersive element, or a tunable filter monochromator, or a tunable interference monochromator. 17. The system according to claim 13, wherein the system is integrated in a multitechnology reader. 18. The system according to claim 14, wherein the system is integrated in a multitechnology reader. 19. The system according to claim 15, wherein the system is integrated in a multitechnology reader. | 2,800 |
11,726 | 11,726 | 15,612,664 | 2,833 | Connector assemblies having a housing, a pin, and a spring length having two free ends are used as a mechanical connector to secure two objects or components together or an electrical connector for placing two sources in electrical communication with one another. The spring length can be a canted coil spring in which the two free ends are not connected to one another and the coils can have an elliptical shape or a complex coil shape. The spring length can be used with a retaining component, can be used in a recessed slot formed with the housing or the pin, or both with a retaining component and with a recessed slot. | 1. A connector assembly comprising:
an housing comprising a body with a wall thickness; a retaining component comprising a ring, a finger, and a spring length with two free ends that are spaced from one another located with the finger, and a pin with a tapered insertion end is positioned through the ring; and wherein the spring length with two free ends contact the pin and the finger. 2. The connector assembly of claim 1, wherein the pin comprises a recessed slot and the spring length is positioned, at least in part, in the recessed slot. 3. The connector assembly of claim 1, wherein the ring of the retaining component has a gap. 4. The connector assembly of claim 1, wherein the finger is a first finger and the spring length is a first spring length; and further comprising a second finger connected to the ring and a second spring length; and wherein the second spring length is located with the second finger. 5. The connector assembly of claim 2, wherein the recessed slot comprises two sidewalls, a bottom wall located between the two sidewalls, and two end walls connected to the two sidewalls. 6. The connector assembly of claim 5, wherein at least one of the two sidewalls is a tapered sidewall and is tapered relative to the bottom wall. 7. The connector assembly of claim 1, wherein the ring contacts an interior surface of the housing before the pin is inserted in a bore of the housing or the ring contacts the pin before the pin is inserted in a bore of the housing. 8. The connector assembly of claim 6, wherein the recessed slot is a first recessed slot, and further comprising a second recessed slot located on the pin, said second recessed slot comprising two sidewalls. 9. The connector assembly of claim 1, wherein the finger is unitarily formed with the ring. 10. The connector assembly of claim 9, wherein the finger has a first bend, a second bend, and a free end that points in a direction of the ring and away from the second bend. 11. The connector assembly of claim 1, wherein the spring length is a canted coil spring length comprising a plurality of interconnected coils all canted in a same general direction and the housing has a round housing wall or has a polygonal shaped housing wall. 12. The connector assembly of claim 1, wherein the retaining component is formed from a wire or by stamping a metal sheet with one or more cutting dies. 13. The connector assembly of claim 1, wherein the finger has a bend connected to the ring and a free end pointing away from the ring and having a bent retaining tip. 14. The connector assembly of claim 1, wherein the housing comprises a body with a wall thickness, an exterior surface, and an interior surface defining a bore; and wherein a recessed slot is formed with the housing or the pin. 15. The connector assembly of claim 14, wherein the pin is rotatable about a lengthwise axis of the pin to separate from the bore of the housing. 16. A connector assembly comprising:
an housing comprising a body with a wall thickness, an exterior surface, and an interior surface defining a bore; a pin comprising a tapered insertion end and an exterior surface; a spring length having free ends that are not connected positioned in a slot and the spring length is located between and in contact with the interior surface of the housing and the pin to complete an electrical path. 17. The connector assembly of claim 16, wherein the slot formed in the wall thickness of the housing or in the pin. 18. The connector assembly of claim 17, wherein the slot has two sidewalls and a bottom wall located therebetween. 19. The connector assembly of claim 16, further comprising a retaining component comprising a ring and a finger extending from the ring, and wherein the spring length is located with the finger. 20. The connector assembly of claim 16, wherein the housing has a unitarily formed finger. 21. The connector assembly of claim 18, wherein the two sidewalls are generally parallel to one another or at least one of the two sidewalls is a tapered sidewall and is tapered relative to the bottom wall. 22. The connector assembly of claim 16, wherein the pin is rotatable about a lengthwise axis of the pin to separate from the housing. 23. The connector assembly of claim 16, wherein the pin has a round cross-sectional shape or a polygonal shape. 24. The connector assembly of claim 16, wherein the spring length is a first spring length, and further comprising a second spring length having two free ends and the second spring length being spaced from the first spring length. 25. A method of using a connector assembly comprising:
inserting a pin having a tapered insertion end into a bore of a housing having an exterior surface and an interior surface or inserting a pin having a tapered insertion into a bore of a ring of retaining component having two fingers extending from the ring; contacting a spring length having two free ends that are not connected with the interior surface of the housing and the pin or contacting two spring lengths each with two free ends and each mounted on a respective one of the two fingers of the retaining component with the pin; wherein the spring length or the two spring lengths each is a canted coil spring comprising a plurality of interconnected coils. 26. The method of claim 25, wherein the ring of the retaining component is fastened to a hardware. | Connector assemblies having a housing, a pin, and a spring length having two free ends are used as a mechanical connector to secure two objects or components together or an electrical connector for placing two sources in electrical communication with one another. The spring length can be a canted coil spring in which the two free ends are not connected to one another and the coils can have an elliptical shape or a complex coil shape. The spring length can be used with a retaining component, can be used in a recessed slot formed with the housing or the pin, or both with a retaining component and with a recessed slot.1. A connector assembly comprising:
an housing comprising a body with a wall thickness; a retaining component comprising a ring, a finger, and a spring length with two free ends that are spaced from one another located with the finger, and a pin with a tapered insertion end is positioned through the ring; and wherein the spring length with two free ends contact the pin and the finger. 2. The connector assembly of claim 1, wherein the pin comprises a recessed slot and the spring length is positioned, at least in part, in the recessed slot. 3. The connector assembly of claim 1, wherein the ring of the retaining component has a gap. 4. The connector assembly of claim 1, wherein the finger is a first finger and the spring length is a first spring length; and further comprising a second finger connected to the ring and a second spring length; and wherein the second spring length is located with the second finger. 5. The connector assembly of claim 2, wherein the recessed slot comprises two sidewalls, a bottom wall located between the two sidewalls, and two end walls connected to the two sidewalls. 6. The connector assembly of claim 5, wherein at least one of the two sidewalls is a tapered sidewall and is tapered relative to the bottom wall. 7. The connector assembly of claim 1, wherein the ring contacts an interior surface of the housing before the pin is inserted in a bore of the housing or the ring contacts the pin before the pin is inserted in a bore of the housing. 8. The connector assembly of claim 6, wherein the recessed slot is a first recessed slot, and further comprising a second recessed slot located on the pin, said second recessed slot comprising two sidewalls. 9. The connector assembly of claim 1, wherein the finger is unitarily formed with the ring. 10. The connector assembly of claim 9, wherein the finger has a first bend, a second bend, and a free end that points in a direction of the ring and away from the second bend. 11. The connector assembly of claim 1, wherein the spring length is a canted coil spring length comprising a plurality of interconnected coils all canted in a same general direction and the housing has a round housing wall or has a polygonal shaped housing wall. 12. The connector assembly of claim 1, wherein the retaining component is formed from a wire or by stamping a metal sheet with one or more cutting dies. 13. The connector assembly of claim 1, wherein the finger has a bend connected to the ring and a free end pointing away from the ring and having a bent retaining tip. 14. The connector assembly of claim 1, wherein the housing comprises a body with a wall thickness, an exterior surface, and an interior surface defining a bore; and wherein a recessed slot is formed with the housing or the pin. 15. The connector assembly of claim 14, wherein the pin is rotatable about a lengthwise axis of the pin to separate from the bore of the housing. 16. A connector assembly comprising:
an housing comprising a body with a wall thickness, an exterior surface, and an interior surface defining a bore; a pin comprising a tapered insertion end and an exterior surface; a spring length having free ends that are not connected positioned in a slot and the spring length is located between and in contact with the interior surface of the housing and the pin to complete an electrical path. 17. The connector assembly of claim 16, wherein the slot formed in the wall thickness of the housing or in the pin. 18. The connector assembly of claim 17, wherein the slot has two sidewalls and a bottom wall located therebetween. 19. The connector assembly of claim 16, further comprising a retaining component comprising a ring and a finger extending from the ring, and wherein the spring length is located with the finger. 20. The connector assembly of claim 16, wherein the housing has a unitarily formed finger. 21. The connector assembly of claim 18, wherein the two sidewalls are generally parallel to one another or at least one of the two sidewalls is a tapered sidewall and is tapered relative to the bottom wall. 22. The connector assembly of claim 16, wherein the pin is rotatable about a lengthwise axis of the pin to separate from the housing. 23. The connector assembly of claim 16, wherein the pin has a round cross-sectional shape or a polygonal shape. 24. The connector assembly of claim 16, wherein the spring length is a first spring length, and further comprising a second spring length having two free ends and the second spring length being spaced from the first spring length. 25. A method of using a connector assembly comprising:
inserting a pin having a tapered insertion end into a bore of a housing having an exterior surface and an interior surface or inserting a pin having a tapered insertion into a bore of a ring of retaining component having two fingers extending from the ring; contacting a spring length having two free ends that are not connected with the interior surface of the housing and the pin or contacting two spring lengths each with two free ends and each mounted on a respective one of the two fingers of the retaining component with the pin; wherein the spring length or the two spring lengths each is a canted coil spring comprising a plurality of interconnected coils. 26. The method of claim 25, wherein the ring of the retaining component is fastened to a hardware. | 2,800 |
11,727 | 11,727 | 15,145,825 | 2,813 | Described herein are photon counting devices comprising direct mode detectors with improved signal to noise ratios which are suitable for use in X-ray imaging devices, and other imaging devices. | 1. A photon counting device comprising:
a detector comprising;
a Group II-VI semiconductor layer located between a cathode electrode and an anode electrode; and a metal oxide layer comprising a metal oxide, wherein
the metal oxide comprises a metal that is different from metals present in the Group II-VI semiconductor layer;
the metal oxide is selected from the group consisting of aluminum oxide (Al2O3), gallium oxide (Ga2O3), hafnium oxide (HfO2), zirconium oxide (ZrO2), magnesium oxide (MgO), and combinations thereof; and
a thickness of the metal oxide layer ranges from about 0.1 nm to about 5 nm. 2. The photon counting device of claim 1, wherein the metal oxide layer is located between the cathode electrode and the Group II-VI semiconductor layer. 3. The photon counting device of claim 1, wherein metal oxide layer comprises Al2O3, MgO, or a combination thereof. 4. The photon counting device of claim 1, wherein metal oxide layer comprises Al2O3. 5. The photon counting device of claim 1, wherein the thickness of the metal oxide layer ranges from about 0.1 nm to about 3 nm. 6.-7. (canceled) 8. The photon counting device of claim 1, wherein the metal oxide layer reduces passage of leakage current. 9. The photon counting device of claim 1, wherein the Group II-VI semiconductor has Formula I:
A TeyZ(1-y) I;
wherein A is Cd, Zn, Hg, Mg, or Mn, or a combination thereof; Z is O, S or Se, or a combination thereof; and y ranges from 0 to 1. 10. The photon counting device of claim 9, wherein the Group II-VI semiconductor layer comprises CdTe, CdZnTe, CdZnTeSe, CdZnTeSeS, CdZnTeSeO, CdZnTeSeSO, CdTeSe, CdTeSSe, HgCdTe, HgZnTe, CdZnMgTe or combinations thereof. 11. The photon counting device of claim 1, wherein the Group II-VI semiconductor is a CZT semiconductor. 12. The photon counting device of claim 1, wherein the Group II-VI semiconductor is a CZT semiconductor and the metal oxide is Al2O3. 13. An X-ray imaging device comprising a detector according to claim 1. 14. A method for fabricating a detector comprising a Group II-VI semiconductor layer, the method comprising depositing a metal oxide layer comprising a metal oxide, between a cathode electrode and the semiconductor layer of an X-ray detector, wherein
the metal oxide comprises a metal that is different from metals present in the Group II-VI semiconductor layer; the metal oxide is selected from the group consisting of Al2O3, Ga2O3, HfO2, ZrO2, MgO and combinations thereof; and a thickness of the metal oxide layer ranges from about 0.1 nm to about 5 nm. 15. The method of claim 14, wherein metal oxide layer comprises Al2O3 or MgO or combinations thereof. 16. The method of claim 14, wherein metal oxide layer comprises Al2O3. 17. The method of claim 14, wherein metal oxide layer is deposited by atomic layer deposition. 18. The method of claim 14, wherein the metal oxide layer reduces passage of leakage current. 19. The method of claim 14, wherein the Group II-VI semiconductor has Formula I:
A TeyZ(1-y) I;
wherein A is Cd, Zn, Hg, Mg, or Mn, or a combination thereof; Z is O, S or Se, or a combination thereof; and y ranges from 0 to 1. 20. The method of claim 14, wherein the Group II-VI semiconductor is a CZT semiconductor and the metal oxide is Al2O3. 21. The photon counting device of claim 1, wherein a surface of the Group II-VI semiconductor layer comprises a pre-existing oxide and the metal oxide layer is disposed on the pre-existing oxide. 22. The photon counting device of claim 1, wherein the pre-existing oxide comprises metals which are the same as the metals present in the Group II-VI semiconductor. | Described herein are photon counting devices comprising direct mode detectors with improved signal to noise ratios which are suitable for use in X-ray imaging devices, and other imaging devices.1. A photon counting device comprising:
a detector comprising;
a Group II-VI semiconductor layer located between a cathode electrode and an anode electrode; and a metal oxide layer comprising a metal oxide, wherein
the metal oxide comprises a metal that is different from metals present in the Group II-VI semiconductor layer;
the metal oxide is selected from the group consisting of aluminum oxide (Al2O3), gallium oxide (Ga2O3), hafnium oxide (HfO2), zirconium oxide (ZrO2), magnesium oxide (MgO), and combinations thereof; and
a thickness of the metal oxide layer ranges from about 0.1 nm to about 5 nm. 2. The photon counting device of claim 1, wherein the metal oxide layer is located between the cathode electrode and the Group II-VI semiconductor layer. 3. The photon counting device of claim 1, wherein metal oxide layer comprises Al2O3, MgO, or a combination thereof. 4. The photon counting device of claim 1, wherein metal oxide layer comprises Al2O3. 5. The photon counting device of claim 1, wherein the thickness of the metal oxide layer ranges from about 0.1 nm to about 3 nm. 6.-7. (canceled) 8. The photon counting device of claim 1, wherein the metal oxide layer reduces passage of leakage current. 9. The photon counting device of claim 1, wherein the Group II-VI semiconductor has Formula I:
A TeyZ(1-y) I;
wherein A is Cd, Zn, Hg, Mg, or Mn, or a combination thereof; Z is O, S or Se, or a combination thereof; and y ranges from 0 to 1. 10. The photon counting device of claim 9, wherein the Group II-VI semiconductor layer comprises CdTe, CdZnTe, CdZnTeSe, CdZnTeSeS, CdZnTeSeO, CdZnTeSeSO, CdTeSe, CdTeSSe, HgCdTe, HgZnTe, CdZnMgTe or combinations thereof. 11. The photon counting device of claim 1, wherein the Group II-VI semiconductor is a CZT semiconductor. 12. The photon counting device of claim 1, wherein the Group II-VI semiconductor is a CZT semiconductor and the metal oxide is Al2O3. 13. An X-ray imaging device comprising a detector according to claim 1. 14. A method for fabricating a detector comprising a Group II-VI semiconductor layer, the method comprising depositing a metal oxide layer comprising a metal oxide, between a cathode electrode and the semiconductor layer of an X-ray detector, wherein
the metal oxide comprises a metal that is different from metals present in the Group II-VI semiconductor layer; the metal oxide is selected from the group consisting of Al2O3, Ga2O3, HfO2, ZrO2, MgO and combinations thereof; and a thickness of the metal oxide layer ranges from about 0.1 nm to about 5 nm. 15. The method of claim 14, wherein metal oxide layer comprises Al2O3 or MgO or combinations thereof. 16. The method of claim 14, wherein metal oxide layer comprises Al2O3. 17. The method of claim 14, wherein metal oxide layer is deposited by atomic layer deposition. 18. The method of claim 14, wherein the metal oxide layer reduces passage of leakage current. 19. The method of claim 14, wherein the Group II-VI semiconductor has Formula I:
A TeyZ(1-y) I;
wherein A is Cd, Zn, Hg, Mg, or Mn, or a combination thereof; Z is O, S or Se, or a combination thereof; and y ranges from 0 to 1. 20. The method of claim 14, wherein the Group II-VI semiconductor is a CZT semiconductor and the metal oxide is Al2O3. 21. The photon counting device of claim 1, wherein a surface of the Group II-VI semiconductor layer comprises a pre-existing oxide and the metal oxide layer is disposed on the pre-existing oxide. 22. The photon counting device of claim 1, wherein the pre-existing oxide comprises metals which are the same as the metals present in the Group II-VI semiconductor. | 2,800 |
11,728 | 11,728 | 15,960,537 | 2,849 | In described examples, a first power switching circuit receives a power switching control signal and activates a first power switch in response to the power switching control signal. A second power switching circuit receives the power switching control, activates a second power switch in response to the power switching control signal, and determines a first power switching delay in response to temperature indications of the first and second power switches. The second power switching circuit activates the second power switch at a first delayed time after the activation of the first power switch, where the first delayed time follows the activation of the first power switch by the determined first power switching delay. | 1. An apparatus, comprising:
a first power switching circuit coupled to receive a power switching control signal and arranged to activate a first power switch in response to the power switching control signal; and a second power switching circuit coupled to receive the power switching control signal, arranged to activate a second power switch in response to the power switching control signal, and arranged to determine a first power switching delay in response to a temperature indication of the second switch and in response to a combined temperature indication of the first and second power switches, wherein the second power switching circuit is arranged to activate the second power switch at a first delayed time after the activation of the first power switch, and wherein the first delayed time follows the activation of the first power switch by the determined first power switching delay. 2. The apparatus of claim 1, wherein the first power switching circuit is further arranged to determine a second power switching delay in response to a temperature indication of the first switch and in response to the combined temperature indication of the first and second power switches, wherein the first power switching circuit is arranged to activate the first power switch at a second delayed time after the activation of the second power switch, and wherein the second delayed time follows the activation of the second power switch by the determined second power switching delay. 3. The apparatus of claim 2, wherein the first and second power switching circuits are arranged on separate dies. 4. The apparatus of claim 2, wherein the temperature indication of the first power switch is generated in response to a temperature-dependent voltage generated in response to a temperature of the first power switch, and wherein the temperature indication of the second power switch is generated in response to a temperature-dependent voltage generated in response to a temperature of the second power switch. 5. The apparatus of claim 2, wherein the temperature indications of the first and second power switches are respectively first and second temperature indication currents, wherein the first and second temperature indication currents are summed to generate the combined temperature indication. 6. The apparatus of claim 5, wherein the first power switching circuit is coupled to a first differential amplifier that is arranged to control the second power switching delay in response to a amplifying a difference of the temperature indication of the first power switch and the combined temperature indication. 7. The apparatus of claim 6, wherein the second power switching circuit is coupled to a second differential amplifier that is arranged to control the first power switching delay in response to a amplifying a difference of the temperature indication of the second power switch and the combined temperature indication. 8. The apparatus of claim 7, wherein the second power switching circuit includes a capacitor for generating a delayed power switching control signal in response to the output of the second differential amplifier and in response to an assertion of the power switching control signal. 9. The apparatus of claim 2, wherein the power switching control signal is a high-side power switching control signal, and wherein the apparatus of claim 2 comprises:
a third power switching coupled to receive a low-side power switching control signal, arranged to activate a third power switch in response to the power switching control signal, and arranged to determine a third power switching delay in response to a temperature indication of the third switch and in response to a combined temperature indication of the third and fourth power switches, wherein the third power switching circuit is arranged to activate the third power switch at a third delayed time after the activation of the third power switch, and wherein the third delayed time follows the activation of the third power switch by the determined third power switching delay; and
a fourth power switching circuit coupled to receive the low-side power switching control signal, arranged to activate a fourth power switch in response to the power switching control signal, and arranged to determine a fourth power switching delay in response to a temperature indication of the fourth switch and in response to a combined temperature indication of the third and fourth power switches, wherein the fourth power switching circuit is arranged to activate the fourth power switch at a fourth delayed time after the activation of the fourth power switch, and wherein the fourth delayed time follows the activation of the fourth power switch by the determined fourth power switching delay. 10. The apparatus of claim 9, wherein drains of the first and second power switches and drains of the third and fourth power switches are coupled to a common switched node, wherein the sources of the first and second power switches are coupled to a high-side power supply rail, and wherein the sources of the third and fourth power switches are coupled to a low-side power supply rail. 11. The apparatus of claim 10, wherein the high-side power switching control signals are generated by a pulse-width modulator (PWM) coupled to the common switched mode. 12. The apparatus of claim 11, wherein the low-side power switching control signals are generated by the pulse-width modulator (PWM) coupled to the common switched mode. 13. The apparatus of claim 11, wherein the temperature indication of the first power switch is generated in response to integrating the temperature-dependent voltage generated in response to a temperature of a die of the first power switch, and wherein the temperature indication of the second power switch is generated in response to integrating the temperature-dependent voltage generated in response to a temperature of a die of the second power switch. 14. The apparatus of claim 1, comprising the first and second power switches. 15. A system, comprising:
a first temperature sensing element thermally coupled to a first power switch and arranged to generate a temperature indication of the first power switch; a second temperature sensing element thermally coupled to a second power switch and arranged to generate a temperature indication of the second power switch; a first power switching circuit coupled to receive a power switching control signal and arranged to control the first power switch in response to the power switching signal; and a second power switching circuit coupled to receive the power switching control signal, coupled to receive the temperature indication of the second power switch, and arranged to generate a first power switching delay in response to the temperature indications of the first and second power switches, wherein the second power switch is activated in response to the first power switching delay, and wherein drains of the first and second power switches are coupled to a common switched node. 16. The system of claim 15, wherein the first power switching circuit is arranged to generate a second power switching delay in response to the temperature indications of the first and second power switches, and wherein the first power switch is activated in response to the second power switching delay. 17. The system of claim 16, comprising a pulse-width modulator circuit arranged to generate the power switching control signal in response to a voltage generated at the common switched node. 18. A method, comprising:
generating a first temperature indication in response to a temperature of a first power switch; generating a second temperature indication in response to a temperature of a second power switch; receiving a power switching control signal for activating the first and second power switches; delaying the received power switching control signal in response to the temperature indications of the first and second power switches; and activating the second power switch in response to the delayed power switching control signal. 19. The method of claim 18, wherein the first power switch is on a first die, and wherein the second power switch is on a second die. 20. The method of claim 19, further comprising summing respective currents generated in response to the first and second temperature indications, wherein the respective currents generated in response to the first and second temperature indications are summed at a node common to the first and second dies, wherein the respective currents generated in response to the first and second temperature indications are summed to generate an average temperature indication, and wherein the received power switching control signal is delayed in response to the average temperature indication. | In described examples, a first power switching circuit receives a power switching control signal and activates a first power switch in response to the power switching control signal. A second power switching circuit receives the power switching control, activates a second power switch in response to the power switching control signal, and determines a first power switching delay in response to temperature indications of the first and second power switches. The second power switching circuit activates the second power switch at a first delayed time after the activation of the first power switch, where the first delayed time follows the activation of the first power switch by the determined first power switching delay.1. An apparatus, comprising:
a first power switching circuit coupled to receive a power switching control signal and arranged to activate a first power switch in response to the power switching control signal; and a second power switching circuit coupled to receive the power switching control signal, arranged to activate a second power switch in response to the power switching control signal, and arranged to determine a first power switching delay in response to a temperature indication of the second switch and in response to a combined temperature indication of the first and second power switches, wherein the second power switching circuit is arranged to activate the second power switch at a first delayed time after the activation of the first power switch, and wherein the first delayed time follows the activation of the first power switch by the determined first power switching delay. 2. The apparatus of claim 1, wherein the first power switching circuit is further arranged to determine a second power switching delay in response to a temperature indication of the first switch and in response to the combined temperature indication of the first and second power switches, wherein the first power switching circuit is arranged to activate the first power switch at a second delayed time after the activation of the second power switch, and wherein the second delayed time follows the activation of the second power switch by the determined second power switching delay. 3. The apparatus of claim 2, wherein the first and second power switching circuits are arranged on separate dies. 4. The apparatus of claim 2, wherein the temperature indication of the first power switch is generated in response to a temperature-dependent voltage generated in response to a temperature of the first power switch, and wherein the temperature indication of the second power switch is generated in response to a temperature-dependent voltage generated in response to a temperature of the second power switch. 5. The apparatus of claim 2, wherein the temperature indications of the first and second power switches are respectively first and second temperature indication currents, wherein the first and second temperature indication currents are summed to generate the combined temperature indication. 6. The apparatus of claim 5, wherein the first power switching circuit is coupled to a first differential amplifier that is arranged to control the second power switching delay in response to a amplifying a difference of the temperature indication of the first power switch and the combined temperature indication. 7. The apparatus of claim 6, wherein the second power switching circuit is coupled to a second differential amplifier that is arranged to control the first power switching delay in response to a amplifying a difference of the temperature indication of the second power switch and the combined temperature indication. 8. The apparatus of claim 7, wherein the second power switching circuit includes a capacitor for generating a delayed power switching control signal in response to the output of the second differential amplifier and in response to an assertion of the power switching control signal. 9. The apparatus of claim 2, wherein the power switching control signal is a high-side power switching control signal, and wherein the apparatus of claim 2 comprises:
a third power switching coupled to receive a low-side power switching control signal, arranged to activate a third power switch in response to the power switching control signal, and arranged to determine a third power switching delay in response to a temperature indication of the third switch and in response to a combined temperature indication of the third and fourth power switches, wherein the third power switching circuit is arranged to activate the third power switch at a third delayed time after the activation of the third power switch, and wherein the third delayed time follows the activation of the third power switch by the determined third power switching delay; and
a fourth power switching circuit coupled to receive the low-side power switching control signal, arranged to activate a fourth power switch in response to the power switching control signal, and arranged to determine a fourth power switching delay in response to a temperature indication of the fourth switch and in response to a combined temperature indication of the third and fourth power switches, wherein the fourth power switching circuit is arranged to activate the fourth power switch at a fourth delayed time after the activation of the fourth power switch, and wherein the fourth delayed time follows the activation of the fourth power switch by the determined fourth power switching delay. 10. The apparatus of claim 9, wherein drains of the first and second power switches and drains of the third and fourth power switches are coupled to a common switched node, wherein the sources of the first and second power switches are coupled to a high-side power supply rail, and wherein the sources of the third and fourth power switches are coupled to a low-side power supply rail. 11. The apparatus of claim 10, wherein the high-side power switching control signals are generated by a pulse-width modulator (PWM) coupled to the common switched mode. 12. The apparatus of claim 11, wherein the low-side power switching control signals are generated by the pulse-width modulator (PWM) coupled to the common switched mode. 13. The apparatus of claim 11, wherein the temperature indication of the first power switch is generated in response to integrating the temperature-dependent voltage generated in response to a temperature of a die of the first power switch, and wherein the temperature indication of the second power switch is generated in response to integrating the temperature-dependent voltage generated in response to a temperature of a die of the second power switch. 14. The apparatus of claim 1, comprising the first and second power switches. 15. A system, comprising:
a first temperature sensing element thermally coupled to a first power switch and arranged to generate a temperature indication of the first power switch; a second temperature sensing element thermally coupled to a second power switch and arranged to generate a temperature indication of the second power switch; a first power switching circuit coupled to receive a power switching control signal and arranged to control the first power switch in response to the power switching signal; and a second power switching circuit coupled to receive the power switching control signal, coupled to receive the temperature indication of the second power switch, and arranged to generate a first power switching delay in response to the temperature indications of the first and second power switches, wherein the second power switch is activated in response to the first power switching delay, and wherein drains of the first and second power switches are coupled to a common switched node. 16. The system of claim 15, wherein the first power switching circuit is arranged to generate a second power switching delay in response to the temperature indications of the first and second power switches, and wherein the first power switch is activated in response to the second power switching delay. 17. The system of claim 16, comprising a pulse-width modulator circuit arranged to generate the power switching control signal in response to a voltage generated at the common switched node. 18. A method, comprising:
generating a first temperature indication in response to a temperature of a first power switch; generating a second temperature indication in response to a temperature of a second power switch; receiving a power switching control signal for activating the first and second power switches; delaying the received power switching control signal in response to the temperature indications of the first and second power switches; and activating the second power switch in response to the delayed power switching control signal. 19. The method of claim 18, wherein the first power switch is on a first die, and wherein the second power switch is on a second die. 20. The method of claim 19, further comprising summing respective currents generated in response to the first and second temperature indications, wherein the respective currents generated in response to the first and second temperature indications are summed at a node common to the first and second dies, wherein the respective currents generated in response to the first and second temperature indications are summed to generate an average temperature indication, and wherein the received power switching control signal is delayed in response to the average temperature indication. | 2,800 |
11,729 | 11,729 | 14,912,380 | 2,812 | Compositions, systems, and methods are described for implanting silicon and/or silicon ions in a substrate, involving generation of silicon and/or silicon ions from corresponding silicon precursor compositions, and implantation of the silicon and/or silicon ions in the substrate. | 1. A method of implanting silicon and/or silicon ions in a substrate, comprising:
generating silicon or silicon-containing ions from a composition comprising silicon precursor selected from the group consisting of: (a) monosilanes of the formula SiR1R2R3R4 wherein each of R1, R2, R3, and R4 can independently be: H; halogen (F, Cl, Br, I); hydroxy; alkoxy; acetoxy; amino; alkyl of the formula CnH2n-1 wherein n=1-10, optionally substituted with hydroxy, alkoxy, acetoxy, and/or amino; cycloalkyl, bi- and polycycloalkyl, of the formula CnH2n-1 wherein n=1-10, optionally substituted with hydroxy, alkoxy, acetoxy, and/or amino; alkenyl of the formula CnH2n including a C═C bond, wherein n=1-10, optionally substituted with hydroxy, alkoxy, acetoxy, and/or amino; aryl, including phenyl and aromatic moieties; alkylene including functionality of the formula ═CH2 and C R1R2 wherein each of R1 and R2 is as specified above, optionally substituted with hydroxy, alkoxy, acetoxy, and/or amino; alkylyne, including functionalities of the formulae ≡CH and ≡CR wherein R is C1-C10 alkyl, hydroxyl, halogen, or amino derivative of alkyl; or acyloxyl of the formula —OOCR wherein R is C1-C10 alkyl, hydroxyl, halogen, or amino derivative of alkyl; (b) di- and polysilanes of the formula SinHy comprising at least one Si—Si bond, wherein n=1-8, and y=2n+2 for unbranched and branched chains, and y=2n for cyclic compounds and corresponding substituted di- and polysilanes of the formula SinR1R2 . . . Ry wherein n=1-8 and each of R1, R2 . . . Ry is as specified for each of R1, R2, R3, and R4 above; (c) bridged silicon precursors of the formula H3Si—X—SiH3, wherein X is —CR1R2—, GeR1R2—, —NR—, —PR—, —O—, —S—, —S R1R2—, and —Se—, wherein each of R, R1, and R2 is as specified above, and corresponding substituted silicon precursors of the formula R1R2R3Si—X—SiR4R5R6 wherein X is as described above and each of R1, R2 . . . R6 is as specified for each of R1, R2, R3, and R4 above; (d) polybridged, branched and cyclic silicon precursors of the formula H3Si—X—SiH2—Y—SiH2— . . . Z—SiH3, or otherwise containing Si—Si bonds, wherein X is —CR1R2—, GeR1R2—, —NR—, —PR—, —O—, —S—, —S R1R2—, and —Se—, wherein each of R, R1, and R2 is as specified above, and corresponding substituted branched silicon precursors wherein X, Y, and Z═C or N, and corresponding cyclic silicon precursors; (e) silenes of the formula H2Si═SiH2, and corresponding substituted silenes of the formula R1R2Si═SiR3R4 wherein R1, R2, R3, and R4 are as specified above; and (f) silynes of the formula HSi≡SiH, and correspondingly substituted silynes of the formula R1Si≡SiR2 wherein R1 and R2 are as specified above; (g) cluster silicon compounds; (h) premixtures or co-flow mixtures comprising one or more of the foregoing precursors; and (i) one or more of the foregoing precursors, wherein said composition comprises gas that is isotopically enriched above natural abundance in at least one isotope thereof; wherein said composition does not consist solely of (1) silicon tetrafluoride, (2) silane, (3) silicon tetrafluoride and silane mixture, or (4) silicon tetrafluoride, xenon and hydrogen; and implanting silicon or silicon ions in the substrate. 2. The method of claim 1, comprising ionizing the silicon precursor to generate the silicon and/or ions. 3. The method of claim 2, wherein said ionizing is carried out so as to generate an ion beam of silicon dopant species, and said ion beam of said silicon dopant species is accelerated by electric field to implant silicon ions in a substrate. 4.-5. (canceled) 6. The method of claim 1, wherein the silicon precursor and a second gas are co-flowed to an implantation process tool. 7. The method of claim 1, wherein the silicon precursor and a second gas are present in said composition as a mixture. 8.-10. (canceled) 11. The method of claim 1, wherein the silicon precursor is isotopically enriched above natural abundance in at least one isotope of silicon. 12. (canceled) 13. The method of claim 1, wherein the silicon precursor is isotopically enriched above natural abundance in 29Si. 14. The method of claim 1, wherein the silicon precursor is isotopically enriched in 29Si to a level of at least 10%, 15%, 20%, 25%, 30%, 35%, 40%, 45%, 50%, 55%, 60%, 65%, 70%, 75%, 80%, 85%, 90%, 95%, 97%, 98%, 99%, or more, up to 100%, based on the total isotopic species present in the silicon precursor material. 15. (canceled) 16. The method of claim 1, wherein the silicon precursor is co-flowed to the ionizing with a co-flow gas. 17. The method of claim 16, wherein the co-flow gas is selected from the group consisting of hydrides, halogens (fluorine, bromine, chlorine, iodine), halide compounds and complexes, carbon monoxide, carbon dioxide, carbonyl fluoride, xenon, xenon difluoride, oxygen, nitrogen, argon, neon, krypton, helium, SiF4, SiH4, Si2H6, methyl silanes, fluorosilanes, chlorosilanes, hydrogen selenide, hydrogen sulfide, diborane, methane, ammonia, phosphine, and arsine. 18. The method of claim 1, wherein the silicon precursor composition comprises a gas other than the silicon precursor, and wherein said other gas is isotopically enriched above natural abundance in at least one isotope thereof. 19. (canceled) 20. The method of claim 1, wherein the silicon precursor composition comprises silicon precursor selected from the group consisting of:
(a) silicon-containing precursors selected from the group consisting of:
(i) monomers of the formula Si(R1R2R3R4) or (R1R2)Si: (silylenes);
(ii) dimers of the formula [Si(R1R2R3)]2;
(iii) trimers of the formula [Si(R1R2)]3; and
(iv) tetramers of the formula [Si(R1)]4,
wherein R1, R2, R3 and R4 are each independently selected from: C1-C8 alkyl; silyl; amino; amido; imido; C1-C8 alkoxy; siloxy; halo; mono-, di-, and tri-alkylsilyl, wherein alkyl is C1-C8 alkyl; mono- and di-alkylamino, wherein alkyl is C1-C8 alkyl; (b) bipyridine and alkyne silane adducts; (c) silicon selenides comprising silicon directly bonded to selenium (Si—Se bonds), and (d) precursors (a)-(c) that have been isotopically enriched above natural abundance in at least one silicon isotope. 21.-23. (canceled) 24. A method of implanting silicon ions in a substrate, comprising:
(a) ionizing a silicon precursor comprising silicon tetrafluoride, SiF4, wherein the silicon tetrafluoride is co-flowed or premixed with a fluororeaction suppressor; and (b) implanting silicon ions from said ionizing in the substrate. 25. The method of claim 24, wherein the fluororeaction suppressor comprises at least one of (i) hydrogen, (ii) hydride gas, and (iii) nitrogen. 26.-62. (canceled) 63. A gas mixture for ion implantation of silicon and/or silicon ions, comprising silicon tetrafluoride and hydrogen, wherein the amount of hydrogen in the gas mixture is from 0.01% to 30% by volume, based on total volume of silicon tetrafluoride and hydrogen. 64. The gas mixture of claim 63, wherein the amount of hydrogen in the gas mixture is from 2% to 20% by volume, based on total volume of silicon tetrafluoride and hydrogen. 65. The gas mixture of claim 63, as provided in a gas supply vessel. 66. The gas mixture of claim 63, wherein the silicon tetrafluoride is isotopically enriched above natural abundance in at least one isotope of silicon. 67. A method of implanting silicon and/or silicon ions in a substrate, comprising ionizing silicon tetrafluoride in a gas mixture comprising silicon tetrafluoride and hydrogen, and implanting silicon and/or silicon ions from said ionizing in the substrate, wherein the amount of hydrogen in the gas mixture is from 0.01% to 30% by volume, based on total volume of silicon tetrafluoride and hydrogen. 68. The method of claim 67, wherein the amount of hydrogen in the gas mixture is from 2% to 20% by volume, based on total volume of silicon tetrafluoride and hydrogen. 69. The method of claim 67, wherein the silicon tetrafluoride is isotopically enriched above natural abundance in at least one isotope of silicon. | Compositions, systems, and methods are described for implanting silicon and/or silicon ions in a substrate, involving generation of silicon and/or silicon ions from corresponding silicon precursor compositions, and implantation of the silicon and/or silicon ions in the substrate.1. A method of implanting silicon and/or silicon ions in a substrate, comprising:
generating silicon or silicon-containing ions from a composition comprising silicon precursor selected from the group consisting of: (a) monosilanes of the formula SiR1R2R3R4 wherein each of R1, R2, R3, and R4 can independently be: H; halogen (F, Cl, Br, I); hydroxy; alkoxy; acetoxy; amino; alkyl of the formula CnH2n-1 wherein n=1-10, optionally substituted with hydroxy, alkoxy, acetoxy, and/or amino; cycloalkyl, bi- and polycycloalkyl, of the formula CnH2n-1 wherein n=1-10, optionally substituted with hydroxy, alkoxy, acetoxy, and/or amino; alkenyl of the formula CnH2n including a C═C bond, wherein n=1-10, optionally substituted with hydroxy, alkoxy, acetoxy, and/or amino; aryl, including phenyl and aromatic moieties; alkylene including functionality of the formula ═CH2 and C R1R2 wherein each of R1 and R2 is as specified above, optionally substituted with hydroxy, alkoxy, acetoxy, and/or amino; alkylyne, including functionalities of the formulae ≡CH and ≡CR wherein R is C1-C10 alkyl, hydroxyl, halogen, or amino derivative of alkyl; or acyloxyl of the formula —OOCR wherein R is C1-C10 alkyl, hydroxyl, halogen, or amino derivative of alkyl; (b) di- and polysilanes of the formula SinHy comprising at least one Si—Si bond, wherein n=1-8, and y=2n+2 for unbranched and branched chains, and y=2n for cyclic compounds and corresponding substituted di- and polysilanes of the formula SinR1R2 . . . Ry wherein n=1-8 and each of R1, R2 . . . Ry is as specified for each of R1, R2, R3, and R4 above; (c) bridged silicon precursors of the formula H3Si—X—SiH3, wherein X is —CR1R2—, GeR1R2—, —NR—, —PR—, —O—, —S—, —S R1R2—, and —Se—, wherein each of R, R1, and R2 is as specified above, and corresponding substituted silicon precursors of the formula R1R2R3Si—X—SiR4R5R6 wherein X is as described above and each of R1, R2 . . . R6 is as specified for each of R1, R2, R3, and R4 above; (d) polybridged, branched and cyclic silicon precursors of the formula H3Si—X—SiH2—Y—SiH2— . . . Z—SiH3, or otherwise containing Si—Si bonds, wherein X is —CR1R2—, GeR1R2—, —NR—, —PR—, —O—, —S—, —S R1R2—, and —Se—, wherein each of R, R1, and R2 is as specified above, and corresponding substituted branched silicon precursors wherein X, Y, and Z═C or N, and corresponding cyclic silicon precursors; (e) silenes of the formula H2Si═SiH2, and corresponding substituted silenes of the formula R1R2Si═SiR3R4 wherein R1, R2, R3, and R4 are as specified above; and (f) silynes of the formula HSi≡SiH, and correspondingly substituted silynes of the formula R1Si≡SiR2 wherein R1 and R2 are as specified above; (g) cluster silicon compounds; (h) premixtures or co-flow mixtures comprising one or more of the foregoing precursors; and (i) one or more of the foregoing precursors, wherein said composition comprises gas that is isotopically enriched above natural abundance in at least one isotope thereof; wherein said composition does not consist solely of (1) silicon tetrafluoride, (2) silane, (3) silicon tetrafluoride and silane mixture, or (4) silicon tetrafluoride, xenon and hydrogen; and implanting silicon or silicon ions in the substrate. 2. The method of claim 1, comprising ionizing the silicon precursor to generate the silicon and/or ions. 3. The method of claim 2, wherein said ionizing is carried out so as to generate an ion beam of silicon dopant species, and said ion beam of said silicon dopant species is accelerated by electric field to implant silicon ions in a substrate. 4.-5. (canceled) 6. The method of claim 1, wherein the silicon precursor and a second gas are co-flowed to an implantation process tool. 7. The method of claim 1, wherein the silicon precursor and a second gas are present in said composition as a mixture. 8.-10. (canceled) 11. The method of claim 1, wherein the silicon precursor is isotopically enriched above natural abundance in at least one isotope of silicon. 12. (canceled) 13. The method of claim 1, wherein the silicon precursor is isotopically enriched above natural abundance in 29Si. 14. The method of claim 1, wherein the silicon precursor is isotopically enriched in 29Si to a level of at least 10%, 15%, 20%, 25%, 30%, 35%, 40%, 45%, 50%, 55%, 60%, 65%, 70%, 75%, 80%, 85%, 90%, 95%, 97%, 98%, 99%, or more, up to 100%, based on the total isotopic species present in the silicon precursor material. 15. (canceled) 16. The method of claim 1, wherein the silicon precursor is co-flowed to the ionizing with a co-flow gas. 17. The method of claim 16, wherein the co-flow gas is selected from the group consisting of hydrides, halogens (fluorine, bromine, chlorine, iodine), halide compounds and complexes, carbon monoxide, carbon dioxide, carbonyl fluoride, xenon, xenon difluoride, oxygen, nitrogen, argon, neon, krypton, helium, SiF4, SiH4, Si2H6, methyl silanes, fluorosilanes, chlorosilanes, hydrogen selenide, hydrogen sulfide, diborane, methane, ammonia, phosphine, and arsine. 18. The method of claim 1, wherein the silicon precursor composition comprises a gas other than the silicon precursor, and wherein said other gas is isotopically enriched above natural abundance in at least one isotope thereof. 19. (canceled) 20. The method of claim 1, wherein the silicon precursor composition comprises silicon precursor selected from the group consisting of:
(a) silicon-containing precursors selected from the group consisting of:
(i) monomers of the formula Si(R1R2R3R4) or (R1R2)Si: (silylenes);
(ii) dimers of the formula [Si(R1R2R3)]2;
(iii) trimers of the formula [Si(R1R2)]3; and
(iv) tetramers of the formula [Si(R1)]4,
wherein R1, R2, R3 and R4 are each independently selected from: C1-C8 alkyl; silyl; amino; amido; imido; C1-C8 alkoxy; siloxy; halo; mono-, di-, and tri-alkylsilyl, wherein alkyl is C1-C8 alkyl; mono- and di-alkylamino, wherein alkyl is C1-C8 alkyl; (b) bipyridine and alkyne silane adducts; (c) silicon selenides comprising silicon directly bonded to selenium (Si—Se bonds), and (d) precursors (a)-(c) that have been isotopically enriched above natural abundance in at least one silicon isotope. 21.-23. (canceled) 24. A method of implanting silicon ions in a substrate, comprising:
(a) ionizing a silicon precursor comprising silicon tetrafluoride, SiF4, wherein the silicon tetrafluoride is co-flowed or premixed with a fluororeaction suppressor; and (b) implanting silicon ions from said ionizing in the substrate. 25. The method of claim 24, wherein the fluororeaction suppressor comprises at least one of (i) hydrogen, (ii) hydride gas, and (iii) nitrogen. 26.-62. (canceled) 63. A gas mixture for ion implantation of silicon and/or silicon ions, comprising silicon tetrafluoride and hydrogen, wherein the amount of hydrogen in the gas mixture is from 0.01% to 30% by volume, based on total volume of silicon tetrafluoride and hydrogen. 64. The gas mixture of claim 63, wherein the amount of hydrogen in the gas mixture is from 2% to 20% by volume, based on total volume of silicon tetrafluoride and hydrogen. 65. The gas mixture of claim 63, as provided in a gas supply vessel. 66. The gas mixture of claim 63, wherein the silicon tetrafluoride is isotopically enriched above natural abundance in at least one isotope of silicon. 67. A method of implanting silicon and/or silicon ions in a substrate, comprising ionizing silicon tetrafluoride in a gas mixture comprising silicon tetrafluoride and hydrogen, and implanting silicon and/or silicon ions from said ionizing in the substrate, wherein the amount of hydrogen in the gas mixture is from 0.01% to 30% by volume, based on total volume of silicon tetrafluoride and hydrogen. 68. The method of claim 67, wherein the amount of hydrogen in the gas mixture is from 2% to 20% by volume, based on total volume of silicon tetrafluoride and hydrogen. 69. The method of claim 67, wherein the silicon tetrafluoride is isotopically enriched above natural abundance in at least one isotope of silicon. | 2,800 |
11,730 | 11,730 | 14,194,527 | 2,846 | A vehicle torque safety monitor is provided. The safety monitor includes a vehicle power estimator configured to estimate a first mechanical power of a first electric motor and a second mechanical power of a second electric motor. The safety monitor includes an energy storage system power estimator and limiter, configured to estimate electrical power provided by an energy storage system, at least a portion of the electrical power converting to the first mechanical power and the second mechanical power. The system includes a vehicle power monitor, configured to indicate an inconsistency in the first mechanical power, the second mechanical power, and the electrical power. | 1. A vehicle torque safety monitor, comprising:
a vehicle power estimator configured to estimate a first mechanical power of a first electric motor and a second mechanical power of a second electric motor; an energy storage system power estimator and limiter, configured to estimate electrical power provided by an energy storage system, at least a portion of the electrical power converting to the first mechanical power and the second mechanical power; and a vehicle power monitor, configured to indicate an inconsistency in the first mechanical power, the second mechanical power, and the electrical power. 2. The vehicle torque safety monitor of claim 1, further comprising:
a vehicle power command estimator, configured to estimate commanded vehicle power as commanded to the first electric motor and the second electric motor; and the vehicle power monitor, further configured to indicate an inconsistency among the first mechanical power, the second mechanical power, the electrical power, and the commanded vehicle power. 3. The vehicle torque safety monitor of claim 1, further comprising:
the vehicle power estimator configured to receive a first estimated torque and a first estimated rotational speed of the first electric motor, and a second estimated torque and a second estimated rotational speed of the second electric motor, wherein an estimate of the first mechanical power is based upon the first estimated torque and the first estimated rotational speed, and wherein an estimate of the second mechanical power is based upon the second estimated torque and the second estimated rotational speed. 4. The vehicle torque safety monitor of claim 1, further comprising:
the energy storage system power estimator and limiter configured to receive a DC voltage parameter and a DC current parameter from an energy storage system, wherein an estimate of the electrical power is based upon the DC voltage parameter and the DC current parameter. 5. The vehicle torque safety monitor of claim 1, wherein:
the vehicle power estimator is configured to couple to a first motor drive unit and a second motor drive unit; the energy storage system power estimator and limiter is configured to couple to the energy storage system; and the vehicle power monitor is configured to couple to at least one monitor or processor of a vehicle control unit. 6. The vehicle torque safety monitor of claim 1, wherein:
the vehicle power estimator is configured to provide a vehicle power parameter to the vehicle power monitor; the energy storage system power estimator and limiter is configured to provide an energy storage system power parameter to the vehicle power monitor; and the vehicle power monitor is configured to provide a status parameter to or in a vehicle control unit. 7. The vehicle torque safety monitor of claim 1, further comprising:
the vehicle power monitor configured to couple to one of a split torque command generator or a torque command generator, and to cooperate therewith to adjust a commanded torque in response to the inconsistency. 8. A vehicle control unit, comprising:
a split torque command generator configured to couple to a first electric motor and to a second electric motor, the first electric motor and the second electric motor providing motive power for an all-wheel drive vehicle, the split torque command generator configured to direct the first electric motor to produce a first torque and direct the second electric motor to produce a second torque; and a vehicle torque safety monitor coupled to the split torque command generator, the vehicle torque safety monitor configured to:
estimate mechanical power produced by each of the first electric motor and the second electric motor;
estimate electrical power provided for conversion to mechanical power by the first electric motor and the second electric motor; and
cooperate with the split torque command generator to alter at least one of the first torque and the second torque, in response to a discrepancy in the mechanical power and the electrical power. 9. The vehicle control unit of claim 8, wherein altering at least one of the first torque and the second torque includes directing the first electric motor to produce a first reduced torque or directing the second electric motor to produce a second reduced torque. 10. The vehicle control unit of claim 8, further comprising:
a first torque safety monitor coupled to the split torque command generator and configured to couple to the first electric motor, the first torque safety monitor configured to decrease AC (alternating current) electrical power sent to the first electric motor in response to an estimated torque of the first electric motor differing from a commanded torque of the first electric motor by more than a first set amount; and a second torque safety monitor coupled to the split torque command generator and configured to couple to the second electric motor, the second torque safety monitor configured to decrease AC (alternating current) electrical power sent to the second electric motor in response to an estimated torque of the second electric motor differing from a commanded torque of the second electric motor by more than a second set amount. 11. The vehicle control unit of claim 8, wherein the discrepancy includes a discrepancy between the electrical power and a sum of the mechanical power produced by the first electric motor and the mechanical power produced by the second electric motor. 12. The vehicle control unit of claim 8, wherein the vehicle torque safety monitor is further configured to:
estimate a total commanded vehicle power; and cooperate with the split torque command generator to alter the at least one of the first torque and the second torque, in response to a discrepancy between the total commanded vehicle power and at least one of the mechanical power and the electrical power. 13. A method for monitoring power in an all-wheel drive vehicle having a plurality of electric motors, the method comprising:
calculating a first mechanical power produced by a first electric motor of the all-wheel drive vehicle; calculating a second mechanical power produced by a second electric motor of the all-wheel drive vehicle; calculating electrical power provided for production of the first mechanical power and the second mechanical power; calculating commanded vehicle power, as commanded to the first electric motor and the second electric motor; and determining whether the first mechanical power, the second mechanical power, the electrical power, and the commanded vehicle power are consistent; and reporting an inconsistency, in response to determining the inconsistency among the first mechanical power, the second mechanical power, the electrical power, and the commanded vehicle power, wherein at least one step of the method is performed by a processor. 14. The method of claim 13, wherein:
calculating the first mechanical power includes multiplying an estimated torque of the first electric motor by a rotational speed of the first electric motor; and calculating the second mechanical power includes multiplying an estimated torque of the second electric motor by a rotational speed of the second electric motor. 15. The method of claim 13, wherein calculating the electrical power includes multiplying a DC (direct current) voltage by a DC current. 16. The method of claim 13, wherein calculating the electrical power includes multiplying a DC (direct current) voltage by a DC current, for each of a first branch providing a first electrical power for the first electric motor and a second branch providing a second electrical power for the second electric motor. 17. The method of claim 13, wherein calculating commanded vehicle power includes adding a first commanded torque from a first motor drive unit coupled to the first electric motor, and a second commanded torque from a second motor drive unit coupled to the second electric motor. 18. The method of claim 13, wherein determining whether the first mechanical power, the second mechanical power, the electrical power, and the commanded vehicle power are consistent includes the electrical power, the commanded vehicle power, and a sum of the first mechanical power and the second mechanical power being in agreement to within one of: a predetermined range or a predetermined ratio. 19. The method of claim 13, wherein the inconsistency includes disagreement among any two of:
the electrical power; the commanded vehicle power; and a sum of the first mechanical power and the second mechanical power. 20. The method of claim 13, wherein the inconsistency includes disagreement among any two of:
a ratio of (a) the first mechanical power to (b) the second mechanical power; a ratio of (c) a first electrical power provided for production of the first mechanical power to (d) a second electrical power provided for production of the second mechanical power; and a ratio of (e) the commanded vehicle power, as commanded to the first electric motor, to (f) the commanded vehicle power, as commanded to the second electric motor. | A vehicle torque safety monitor is provided. The safety monitor includes a vehicle power estimator configured to estimate a first mechanical power of a first electric motor and a second mechanical power of a second electric motor. The safety monitor includes an energy storage system power estimator and limiter, configured to estimate electrical power provided by an energy storage system, at least a portion of the electrical power converting to the first mechanical power and the second mechanical power. The system includes a vehicle power monitor, configured to indicate an inconsistency in the first mechanical power, the second mechanical power, and the electrical power.1. A vehicle torque safety monitor, comprising:
a vehicle power estimator configured to estimate a first mechanical power of a first electric motor and a second mechanical power of a second electric motor; an energy storage system power estimator and limiter, configured to estimate electrical power provided by an energy storage system, at least a portion of the electrical power converting to the first mechanical power and the second mechanical power; and a vehicle power monitor, configured to indicate an inconsistency in the first mechanical power, the second mechanical power, and the electrical power. 2. The vehicle torque safety monitor of claim 1, further comprising:
a vehicle power command estimator, configured to estimate commanded vehicle power as commanded to the first electric motor and the second electric motor; and the vehicle power monitor, further configured to indicate an inconsistency among the first mechanical power, the second mechanical power, the electrical power, and the commanded vehicle power. 3. The vehicle torque safety monitor of claim 1, further comprising:
the vehicle power estimator configured to receive a first estimated torque and a first estimated rotational speed of the first electric motor, and a second estimated torque and a second estimated rotational speed of the second electric motor, wherein an estimate of the first mechanical power is based upon the first estimated torque and the first estimated rotational speed, and wherein an estimate of the second mechanical power is based upon the second estimated torque and the second estimated rotational speed. 4. The vehicle torque safety monitor of claim 1, further comprising:
the energy storage system power estimator and limiter configured to receive a DC voltage parameter and a DC current parameter from an energy storage system, wherein an estimate of the electrical power is based upon the DC voltage parameter and the DC current parameter. 5. The vehicle torque safety monitor of claim 1, wherein:
the vehicle power estimator is configured to couple to a first motor drive unit and a second motor drive unit; the energy storage system power estimator and limiter is configured to couple to the energy storage system; and the vehicle power monitor is configured to couple to at least one monitor or processor of a vehicle control unit. 6. The vehicle torque safety monitor of claim 1, wherein:
the vehicle power estimator is configured to provide a vehicle power parameter to the vehicle power monitor; the energy storage system power estimator and limiter is configured to provide an energy storage system power parameter to the vehicle power monitor; and the vehicle power monitor is configured to provide a status parameter to or in a vehicle control unit. 7. The vehicle torque safety monitor of claim 1, further comprising:
the vehicle power monitor configured to couple to one of a split torque command generator or a torque command generator, and to cooperate therewith to adjust a commanded torque in response to the inconsistency. 8. A vehicle control unit, comprising:
a split torque command generator configured to couple to a first electric motor and to a second electric motor, the first electric motor and the second electric motor providing motive power for an all-wheel drive vehicle, the split torque command generator configured to direct the first electric motor to produce a first torque and direct the second electric motor to produce a second torque; and a vehicle torque safety monitor coupled to the split torque command generator, the vehicle torque safety monitor configured to:
estimate mechanical power produced by each of the first electric motor and the second electric motor;
estimate electrical power provided for conversion to mechanical power by the first electric motor and the second electric motor; and
cooperate with the split torque command generator to alter at least one of the first torque and the second torque, in response to a discrepancy in the mechanical power and the electrical power. 9. The vehicle control unit of claim 8, wherein altering at least one of the first torque and the second torque includes directing the first electric motor to produce a first reduced torque or directing the second electric motor to produce a second reduced torque. 10. The vehicle control unit of claim 8, further comprising:
a first torque safety monitor coupled to the split torque command generator and configured to couple to the first electric motor, the first torque safety monitor configured to decrease AC (alternating current) electrical power sent to the first electric motor in response to an estimated torque of the first electric motor differing from a commanded torque of the first electric motor by more than a first set amount; and a second torque safety monitor coupled to the split torque command generator and configured to couple to the second electric motor, the second torque safety monitor configured to decrease AC (alternating current) electrical power sent to the second electric motor in response to an estimated torque of the second electric motor differing from a commanded torque of the second electric motor by more than a second set amount. 11. The vehicle control unit of claim 8, wherein the discrepancy includes a discrepancy between the electrical power and a sum of the mechanical power produced by the first electric motor and the mechanical power produced by the second electric motor. 12. The vehicle control unit of claim 8, wherein the vehicle torque safety monitor is further configured to:
estimate a total commanded vehicle power; and cooperate with the split torque command generator to alter the at least one of the first torque and the second torque, in response to a discrepancy between the total commanded vehicle power and at least one of the mechanical power and the electrical power. 13. A method for monitoring power in an all-wheel drive vehicle having a plurality of electric motors, the method comprising:
calculating a first mechanical power produced by a first electric motor of the all-wheel drive vehicle; calculating a second mechanical power produced by a second electric motor of the all-wheel drive vehicle; calculating electrical power provided for production of the first mechanical power and the second mechanical power; calculating commanded vehicle power, as commanded to the first electric motor and the second electric motor; and determining whether the first mechanical power, the second mechanical power, the electrical power, and the commanded vehicle power are consistent; and reporting an inconsistency, in response to determining the inconsistency among the first mechanical power, the second mechanical power, the electrical power, and the commanded vehicle power, wherein at least one step of the method is performed by a processor. 14. The method of claim 13, wherein:
calculating the first mechanical power includes multiplying an estimated torque of the first electric motor by a rotational speed of the first electric motor; and calculating the second mechanical power includes multiplying an estimated torque of the second electric motor by a rotational speed of the second electric motor. 15. The method of claim 13, wherein calculating the electrical power includes multiplying a DC (direct current) voltage by a DC current. 16. The method of claim 13, wherein calculating the electrical power includes multiplying a DC (direct current) voltage by a DC current, for each of a first branch providing a first electrical power for the first electric motor and a second branch providing a second electrical power for the second electric motor. 17. The method of claim 13, wherein calculating commanded vehicle power includes adding a first commanded torque from a first motor drive unit coupled to the first electric motor, and a second commanded torque from a second motor drive unit coupled to the second electric motor. 18. The method of claim 13, wherein determining whether the first mechanical power, the second mechanical power, the electrical power, and the commanded vehicle power are consistent includes the electrical power, the commanded vehicle power, and a sum of the first mechanical power and the second mechanical power being in agreement to within one of: a predetermined range or a predetermined ratio. 19. The method of claim 13, wherein the inconsistency includes disagreement among any two of:
the electrical power; the commanded vehicle power; and a sum of the first mechanical power and the second mechanical power. 20. The method of claim 13, wherein the inconsistency includes disagreement among any two of:
a ratio of (a) the first mechanical power to (b) the second mechanical power; a ratio of (c) a first electrical power provided for production of the first mechanical power to (d) a second electrical power provided for production of the second mechanical power; and a ratio of (e) the commanded vehicle power, as commanded to the first electric motor, to (f) the commanded vehicle power, as commanded to the second electric motor. | 2,800 |
11,731 | 11,731 | 14,904,301 | 2,849 | A method for controlling the power of a system, and a device for controlling the power of a system, the system having an electric energy source, electric consumers, an energy store, an inverter, and a charge controller, the system being connected via an interconnected power sensor to the in particular public AC electric power supply, and the power sensor may be used for ascertaining the power withdrawn by the system from the in particular public AC electric power supply, or for ascertaining a corresponding quantity, such as the active power withdrawn from the in particular public AC electric power supply, the sensor signal being transmitted to a controller which regulates the power withdrawn from the in particular public AC electric power supply toward zero by appropriate actuation of the inverter and the charge controller. | 1-13. (canceled) 14. A method for controlling a power of a system that includes an electric energy source, an electric consumer, an energy store, an inverter, and a charge controller, the method comprising:
connecting the system via an interconnected power sensor to a public AC electric power supply, the power sensor capable of one of:
ascertaining a power withdrawn by the system from the public AC electric power supply, and
ascertaining a quantity corresponding to the withdrawn power; and
transmitting a sensor signal to a controller that regulates a power supply from the public AC electric power supply toward zero by appropriate actuation of the inverter and the charge controller. 15. The method as recited in claim 14, wherein the corresponding quantity includes an active power withdrawn from the public AC electric power supply. 16. The method as recited in claim 14, wherein the energy source includes one of a photovoltaic system and a regenerative energy source. 17. The method as recited in claim 16, wherein the regenerative energy store includes wind power. 18. The method as recited in claim 14, wherein the inverter and the charge controller are activated alternatively. 19. The method as recited in claim 14, wherein if a pholtovoltaically generated electric power exceeds a power of the consumer, the controller controls the charge controller in such a way that excess power is routed to the energy store and only power that is in excess thereof is injected into the public AC electric power supply, the inverter at least one of being switched into a quiescent state, being deactivated, and being switched off by the controller. 20. The method as recited in claim 14, wherein if a photovoltaically generated electric power drops below a power of the consumer, the controller controls the inverter in such a way that the consumer is supplied with power from the energy store, the controller at least one of switching the charge controller into a quiescent state, deactivating the charge controller, and switching the charge controller off. 21. The method as recited in claim 20, wherein only an electric power required in excess of the photovoltaically generated electric power will be withdrawn from the public AC electric power supply. 22. The method as recited in claim 14, wherein at least one of:
the controller has a filter, and an ON-delay means is situated in a control path from the controller to at least one of the charge controller and the inverter. 23. The method as recited in claim 14, wherein a hysteresis is taken into account when actuating at least one of the charge controller and the inverter. 24. The method as recited in claim 14, wherein a signal electronics system of the inverter carries out a charge control for the energy store. 25. The method as recited in claim 24, wherein the signal electronics system is situated in a housing of the inverter. 26. The method as recited in claim 14, further comprising:
providing a sensor for detecting a temperature of the energy store; and supplying a sensor signal of the temperature detecting sensor to a signal electronics system of the inverter, so that a temperature-dependent charge control is able to be implemented for the energy store. 27. A device for controlling a power of a system that includes an electric energy source, an electric consumer, an energy store, an inverter, and a charge controller, the device comprising:
a power sensor interconnected between the system and a public AC electric power supply, the power sensor one of:
ascertaining a power withdrawn by the system from the public AC electric power supply, and
ascertaining a quantity corresponding to the withdrawn power, wherein a sensor signal from the power sensor is supplied to a controller which controls the power withdrawn from the public AC electric power supply towards zero by appropriate control of at least one of the inverter and the charge controller via a control path. 28. The device as recited in claim 27, wherein the corresponding quantity includes an active power withdrawn from the public AC electric power supply. 29. The device as recited in claim 27, wherein the controller includes a housing disposed in a signal electronics system. 30. The device as recited in claim 27, wherein the control path from a direction of the controller has a selector switch, so that either the inverter or the charge controller is activated. 31. The device as recited in claim 30, wherein a hysteresis is provided during the activation, and wherein an ON-delay element is situated in the control path from the controller to at least one of the charge controller and the inverter. 32. The device as recited in claim 27, wherein a signal electronics system of the inverter is situated inside a housing of the inverter. 33. The device as recited in claim 27, further comprising:
a sensor for detecting a temperature of the energy store, wherein a sensor signal of the temperature detecting sensor is supplied to a signal electronics system of the inverter, so that a temperature-dependent charge control is able to be implemented for the energy store. | A method for controlling the power of a system, and a device for controlling the power of a system, the system having an electric energy source, electric consumers, an energy store, an inverter, and a charge controller, the system being connected via an interconnected power sensor to the in particular public AC electric power supply, and the power sensor may be used for ascertaining the power withdrawn by the system from the in particular public AC electric power supply, or for ascertaining a corresponding quantity, such as the active power withdrawn from the in particular public AC electric power supply, the sensor signal being transmitted to a controller which regulates the power withdrawn from the in particular public AC electric power supply toward zero by appropriate actuation of the inverter and the charge controller.1-13. (canceled) 14. A method for controlling a power of a system that includes an electric energy source, an electric consumer, an energy store, an inverter, and a charge controller, the method comprising:
connecting the system via an interconnected power sensor to a public AC electric power supply, the power sensor capable of one of:
ascertaining a power withdrawn by the system from the public AC electric power supply, and
ascertaining a quantity corresponding to the withdrawn power; and
transmitting a sensor signal to a controller that regulates a power supply from the public AC electric power supply toward zero by appropriate actuation of the inverter and the charge controller. 15. The method as recited in claim 14, wherein the corresponding quantity includes an active power withdrawn from the public AC electric power supply. 16. The method as recited in claim 14, wherein the energy source includes one of a photovoltaic system and a regenerative energy source. 17. The method as recited in claim 16, wherein the regenerative energy store includes wind power. 18. The method as recited in claim 14, wherein the inverter and the charge controller are activated alternatively. 19. The method as recited in claim 14, wherein if a pholtovoltaically generated electric power exceeds a power of the consumer, the controller controls the charge controller in such a way that excess power is routed to the energy store and only power that is in excess thereof is injected into the public AC electric power supply, the inverter at least one of being switched into a quiescent state, being deactivated, and being switched off by the controller. 20. The method as recited in claim 14, wherein if a photovoltaically generated electric power drops below a power of the consumer, the controller controls the inverter in such a way that the consumer is supplied with power from the energy store, the controller at least one of switching the charge controller into a quiescent state, deactivating the charge controller, and switching the charge controller off. 21. The method as recited in claim 20, wherein only an electric power required in excess of the photovoltaically generated electric power will be withdrawn from the public AC electric power supply. 22. The method as recited in claim 14, wherein at least one of:
the controller has a filter, and an ON-delay means is situated in a control path from the controller to at least one of the charge controller and the inverter. 23. The method as recited in claim 14, wherein a hysteresis is taken into account when actuating at least one of the charge controller and the inverter. 24. The method as recited in claim 14, wherein a signal electronics system of the inverter carries out a charge control for the energy store. 25. The method as recited in claim 24, wherein the signal electronics system is situated in a housing of the inverter. 26. The method as recited in claim 14, further comprising:
providing a sensor for detecting a temperature of the energy store; and supplying a sensor signal of the temperature detecting sensor to a signal electronics system of the inverter, so that a temperature-dependent charge control is able to be implemented for the energy store. 27. A device for controlling a power of a system that includes an electric energy source, an electric consumer, an energy store, an inverter, and a charge controller, the device comprising:
a power sensor interconnected between the system and a public AC electric power supply, the power sensor one of:
ascertaining a power withdrawn by the system from the public AC electric power supply, and
ascertaining a quantity corresponding to the withdrawn power, wherein a sensor signal from the power sensor is supplied to a controller which controls the power withdrawn from the public AC electric power supply towards zero by appropriate control of at least one of the inverter and the charge controller via a control path. 28. The device as recited in claim 27, wherein the corresponding quantity includes an active power withdrawn from the public AC electric power supply. 29. The device as recited in claim 27, wherein the controller includes a housing disposed in a signal electronics system. 30. The device as recited in claim 27, wherein the control path from a direction of the controller has a selector switch, so that either the inverter or the charge controller is activated. 31. The device as recited in claim 30, wherein a hysteresis is provided during the activation, and wherein an ON-delay element is situated in the control path from the controller to at least one of the charge controller and the inverter. 32. The device as recited in claim 27, wherein a signal electronics system of the inverter is situated inside a housing of the inverter. 33. The device as recited in claim 27, further comprising:
a sensor for detecting a temperature of the energy store, wherein a sensor signal of the temperature detecting sensor is supplied to a signal electronics system of the inverter, so that a temperature-dependent charge control is able to be implemented for the energy store. | 2,800 |
11,732 | 11,732 | 15,103,344 | 2,886 | Methods and apparatus ( 100 ) for profiling a beam of a light emitting semiconductor device. The apparatus comprises a light emitting semiconductor device ( 102 ) comprising an active region ( 108 ) formed on a substrate ( 104 ) and configured to generate light when a suitable electrical current is applied to contacts on an upper surface of the device and a light emitting surface ( 110 ) defined by a lower surface of the substrate opposite the contacts. The apparatus further comprises a transmission medium ( 112 ) comprising a first surface ( 114 ) in contact with at least part of the light emitting surface of the semiconductor device and a diffusion surface ( 116 ), opposite the first surface, and configured to diffuse light emitted from the micro-LED and transmitted through the transmission medium. | 1. An apparatus for profiling a beam of a light emitting semiconductor device, comprising:
a light emitting semiconductor device comprising an active region formed on a substrate and configured to generate light when a suitable electrical current is applied to contacts on an upper surface of the device, and a light emitting surface defined by a lower surface of the substrate opposite the contacts; and a transmission medium comprising a first surface in contact with at least part of the light emitting surface of the semiconductor device and a diffusion surface, opposite the first surface, and configured to diffuse light emitted from the semiconductor device and transmitted through the transmission medium. 2. An apparatus according to claim 1, wherein the transmission medium has a thickness of 3 mm or greater. 3. An apparatus according to claim 1, wherein the transmission medium has a refractive index substantially equal to a refractive index of the substrate of the light emitting semiconductor device, such that there is substantially no reflection at the interface between the transmission medium and the substrate of the light emitting semiconductor device. 4-8. (canceled) 9. An apparatus according to any claim 1, further comprising a pair of probes configured to apply an electrical current to the contacts of the light emitting semiconductor device for causing the active layer to generate light. 10. An apparatus according to claim 1, further comprising a camera configured to capture an image of light at the diffusion surface that has been emitted from the light emitting semiconductor device. 11. An apparatus according to claim 10, wherein the camera comprises a lens with a magnification factor of less than 1. 12. An apparatus according to claim 10, wherein the transmission medium has a refractive index and a thickness configured to present at the diffusion surface the light emitted from the light emitting semiconductor device, wherein the image falls within a field of view of the camera. 13. An apparatus according to claim 11, wherein the thickness of the transmission medium is greater than a depth of field of the lens of the camera. 14. An apparatus according to claim 10, further comprising a controller, the controller comprising a beam profiler configured to process an image, captured by the camera, of light at the diffusion surface to determine an angle to a normal of light that would be emitted into air from the light emitting surface of the light emitting semiconductor device. 15-16. (canceled) 17. An apparatus according to claim 14 further comprising a power meter configured to determine a power of the light at the diffusion surface and to transmit data indicative of the determined power to the beam profiler. 18. An apparatus according to claim 17, wherein the power meter is offset from the camera, the apparatus further comprising a beam splitter configured to direct a portion of the beam emitted from the semiconductor device to the power meter. 19. An apparatus according to claim 14, wherein the beam profiler is configured to determine a power of the light at the diffusion surface based on an intensity of a pixel of the image. 20. An apparatus according to claim 19, wherein the beam profiler is configured to determine an angle into air at which the light forming the pixel would be transmitted by the light emitting semiconductor device using:
sin
-
1
[
n
1
n
2
sin
(
tan
-
1
(
w
h
)
)
]
wherein, n1 is a refractive index of the substrate, n2 is a refractive index of the transmission medium, w is a distance of the pixel from a centre of the light at the diffusion surface and h is the thickness of the transmission medium. 21. An apparatus according to claim 14, when dependent on claim 9, wherein the controller comprises a profiling manager configured to coordinate the operation of the pair of probes and the camera, such that the camera captures an image during a time when the probes are applying an electrical current to the light emitting semiconductor device. 22. (canceled) 23. An apparatus according to claim 1, comprising a plurality of light emitting semiconductor devices grown on a silicon wafer, wherein the first surface of the transmission medium is in contact with the light emitting surfaces of more than one of the plurality of light emitting semiconductor devices. 24. (canceled) 25. A method for profiling a beam of a light emitting semiconductor device, the method comprising:
applying an electrical current to contacts on an upper surface of a light emitting semiconductor device, the light emitting semiconductor device comprising an active region formed on a substrate and a light emitting surface defined by a lower surface of the substrate opposite the contacts; transmitting light emitted from the light emitting semiconductor device through a transmission medium comprising a first surface in contact with at least part of the light emitting surface of the light emitting semiconductor device and a diffusion surface, opposite the first surface, and configured to diffuse light emitted from the light emitting semiconductor device and transmitted through the transmission medium; and determining intensity power of light that would be emitted into air from the light emitting semiconductor device at one or more angles with respect to a normal. 26. A method for profiling a beam of a light emitting semiconductor device, the method comprising:
processing, by a beam profiler, an image to determine intensity power of light that would be emitted into air from the light emitting semiconductor device at one or more angles with respect to a normal, the image comprising light emitted from a light emitting semiconductor device comprising an active region formed on a substrate and configured to generate light when a suitable electrical current is applied to contacts on an upper surface of the device, and a light emitting surface defined by a surface of the substrate opposite the contacts, the light further being transmitted through a transmission medium comprising a first surface in contact with at least part of the light emitting surface of the light emitting semiconductor device and a diffusion surface, opposite the first surface, and configured to diffuse light emitted from the light emitting semiconductor device and transmitted through the transmission medium. 27. A method according to claim 26, wherein the beam profiler is configured to determine an angle into air at which light forming a pixel of the image would be transmitted by the light emitting semiconductor device using:
sin
-
1
[
n
1
n
2
sin
(
tan
-
1
(
w
h
)
)
]
wherein, n1 is a refractive index of the substrate, n2 is a refractive index of the transmission medium, w is a distance of the pixel from a centre of the light at the diffusion surface and h is the thickness of the transmission medium. 28. A non-transitory computer readable medium comprising computer readable code configured, when read by a computer, to carry out the method according to claim 26. 29. A computer program comprising computer readable code configured, when read by a computer, to carry out the method according to claim 26. 30-32. (canceled) | Methods and apparatus ( 100 ) for profiling a beam of a light emitting semiconductor device. The apparatus comprises a light emitting semiconductor device ( 102 ) comprising an active region ( 108 ) formed on a substrate ( 104 ) and configured to generate light when a suitable electrical current is applied to contacts on an upper surface of the device and a light emitting surface ( 110 ) defined by a lower surface of the substrate opposite the contacts. The apparatus further comprises a transmission medium ( 112 ) comprising a first surface ( 114 ) in contact with at least part of the light emitting surface of the semiconductor device and a diffusion surface ( 116 ), opposite the first surface, and configured to diffuse light emitted from the micro-LED and transmitted through the transmission medium.1. An apparatus for profiling a beam of a light emitting semiconductor device, comprising:
a light emitting semiconductor device comprising an active region formed on a substrate and configured to generate light when a suitable electrical current is applied to contacts on an upper surface of the device, and a light emitting surface defined by a lower surface of the substrate opposite the contacts; and a transmission medium comprising a first surface in contact with at least part of the light emitting surface of the semiconductor device and a diffusion surface, opposite the first surface, and configured to diffuse light emitted from the semiconductor device and transmitted through the transmission medium. 2. An apparatus according to claim 1, wherein the transmission medium has a thickness of 3 mm or greater. 3. An apparatus according to claim 1, wherein the transmission medium has a refractive index substantially equal to a refractive index of the substrate of the light emitting semiconductor device, such that there is substantially no reflection at the interface between the transmission medium and the substrate of the light emitting semiconductor device. 4-8. (canceled) 9. An apparatus according to any claim 1, further comprising a pair of probes configured to apply an electrical current to the contacts of the light emitting semiconductor device for causing the active layer to generate light. 10. An apparatus according to claim 1, further comprising a camera configured to capture an image of light at the diffusion surface that has been emitted from the light emitting semiconductor device. 11. An apparatus according to claim 10, wherein the camera comprises a lens with a magnification factor of less than 1. 12. An apparatus according to claim 10, wherein the transmission medium has a refractive index and a thickness configured to present at the diffusion surface the light emitted from the light emitting semiconductor device, wherein the image falls within a field of view of the camera. 13. An apparatus according to claim 11, wherein the thickness of the transmission medium is greater than a depth of field of the lens of the camera. 14. An apparatus according to claim 10, further comprising a controller, the controller comprising a beam profiler configured to process an image, captured by the camera, of light at the diffusion surface to determine an angle to a normal of light that would be emitted into air from the light emitting surface of the light emitting semiconductor device. 15-16. (canceled) 17. An apparatus according to claim 14 further comprising a power meter configured to determine a power of the light at the diffusion surface and to transmit data indicative of the determined power to the beam profiler. 18. An apparatus according to claim 17, wherein the power meter is offset from the camera, the apparatus further comprising a beam splitter configured to direct a portion of the beam emitted from the semiconductor device to the power meter. 19. An apparatus according to claim 14, wherein the beam profiler is configured to determine a power of the light at the diffusion surface based on an intensity of a pixel of the image. 20. An apparatus according to claim 19, wherein the beam profiler is configured to determine an angle into air at which the light forming the pixel would be transmitted by the light emitting semiconductor device using:
sin
-
1
[
n
1
n
2
sin
(
tan
-
1
(
w
h
)
)
]
wherein, n1 is a refractive index of the substrate, n2 is a refractive index of the transmission medium, w is a distance of the pixel from a centre of the light at the diffusion surface and h is the thickness of the transmission medium. 21. An apparatus according to claim 14, when dependent on claim 9, wherein the controller comprises a profiling manager configured to coordinate the operation of the pair of probes and the camera, such that the camera captures an image during a time when the probes are applying an electrical current to the light emitting semiconductor device. 22. (canceled) 23. An apparatus according to claim 1, comprising a plurality of light emitting semiconductor devices grown on a silicon wafer, wherein the first surface of the transmission medium is in contact with the light emitting surfaces of more than one of the plurality of light emitting semiconductor devices. 24. (canceled) 25. A method for profiling a beam of a light emitting semiconductor device, the method comprising:
applying an electrical current to contacts on an upper surface of a light emitting semiconductor device, the light emitting semiconductor device comprising an active region formed on a substrate and a light emitting surface defined by a lower surface of the substrate opposite the contacts; transmitting light emitted from the light emitting semiconductor device through a transmission medium comprising a first surface in contact with at least part of the light emitting surface of the light emitting semiconductor device and a diffusion surface, opposite the first surface, and configured to diffuse light emitted from the light emitting semiconductor device and transmitted through the transmission medium; and determining intensity power of light that would be emitted into air from the light emitting semiconductor device at one or more angles with respect to a normal. 26. A method for profiling a beam of a light emitting semiconductor device, the method comprising:
processing, by a beam profiler, an image to determine intensity power of light that would be emitted into air from the light emitting semiconductor device at one or more angles with respect to a normal, the image comprising light emitted from a light emitting semiconductor device comprising an active region formed on a substrate and configured to generate light when a suitable electrical current is applied to contacts on an upper surface of the device, and a light emitting surface defined by a surface of the substrate opposite the contacts, the light further being transmitted through a transmission medium comprising a first surface in contact with at least part of the light emitting surface of the light emitting semiconductor device and a diffusion surface, opposite the first surface, and configured to diffuse light emitted from the light emitting semiconductor device and transmitted through the transmission medium. 27. A method according to claim 26, wherein the beam profiler is configured to determine an angle into air at which light forming a pixel of the image would be transmitted by the light emitting semiconductor device using:
sin
-
1
[
n
1
n
2
sin
(
tan
-
1
(
w
h
)
)
]
wherein, n1 is a refractive index of the substrate, n2 is a refractive index of the transmission medium, w is a distance of the pixel from a centre of the light at the diffusion surface and h is the thickness of the transmission medium. 28. A non-transitory computer readable medium comprising computer readable code configured, when read by a computer, to carry out the method according to claim 26. 29. A computer program comprising computer readable code configured, when read by a computer, to carry out the method according to claim 26. 30-32. (canceled) | 2,800 |
11,733 | 11,733 | 14,967,679 | 2,813 | A non-blended dataset related to a same surveyed area as a blended dataset is used to deblend the blended dataset. The non-blended dataset may be used to calculate a model dataset emulating the blended dataset, or may be transformed in a model domain and used to derive sparseness weights, model domain masking, scaling or shaping functions used to deblend the blended dataset. | 1. A seismic data deblending method, comprising:
obtaining a first non-blended dataset and a second blended dataset related to a same surveyed area; calculating a model dataset emulating the second blended dataset based on the first non-blended dataset; and deblending the second blended dataset using the model dataset. 2. The method of claim 1, wherein the first non-blended dataset is the result of deblending of a blended dataset. 3. The method of claim 1, wherein the model dataset is calculated by interpolating data in the first dataset to match source and receiver positions of data in the second dataset. 4. The method of claim 3, wherein the model dataset is used to mitigate cross-talk noise in the second blended dataset by:
blending the model dataset to form a continuous recording trace; pseudo-blending the continuous recording trace; calculating a cross-talk estimate based on the pseudo-blended continuous recording trace; and subtracting the cross-talk noise from the second blended dataset. 5. The method of claim 3, further comprising:
generating a changemap including anticipated signal to blend noise ratios evaluated based on the model dataset. 6. The method of claim 5, wherein the changemap is used to derive space-time sparseness weights used to deblend the second blended dataset. 7. The method of claim 5, wherein the changemap is used to derive filters to be applied to the second blended dataset. 8. The method of claim 1, wherein
the model dataset is calculated by numerically blending the first non-blended dataset based on locations and times extracted from the second blended dataset, and the deblending includes comparing blend noise of the blended first non-blended dataset and the second blended dataset. 9. A method for deblending seismic data, the method comprising:
obtaining a first non-blended dataset and a second blended dataset related to a same surveyed area; transforming the first non-blended dataset in a model domain; and deblending the second blended dataset using the transformed first dataset. 10. The method of claim 9, wherein the second blended dataset is deblended by an inversion method using sparseness weights derived from the transformed first dataset. 11. The method of claim 9, wherein the deblending of the second blended dataset is performed using an anti-leakage/matching method. 12. The method of claim 9, wherein the deblending of the second blended dataset is performed using a model domain masking, scaling or shaping function derived using the transformed first dataset. 13. A seismic data processing apparatus comprising:
an interface configured to obtain a first non-blended dataset and a second blended dataset related to a same surveyed area; and a data processing unit including one or more processors and configured
to calculate a model dataset emulating the second blended dataset based on the first non-blended dataset; and
to deblend the second blended dataset using the model dataset. 14. The apparatus of claim 13, wherein the data processing unit is configured to calculate the model dataset by interpolating data in the first non-blended dataset to match data positions in the second blended dataset. 15. The apparatus of claim 13, wherein the data processing unit is configured to mitigate cross-talk noise in the second blended dataset using the model dataset by:
blending the model dataset to form a continuous recording trace; pseudo-blending the continuous recording trace; calculate a cross-talk estimate based on the pseudo-blended continuous recording trace; and subtracting the cross-talk noise from the second blended dataset. 16. The apparatus of claim 13, wherein the data processing unit is configured:
to generate a changemap including anticipated signal to blend noise ratios evaluated based on the model dataset, and to derive space-time sparseness weights used to deblend the second blended dataset or filters to be applied to the second blended dataset, based on the changemap. 17. The apparatus of claim 13, wherein the data processing unit is configured
to calculate the model dataset by numerically blending the first non-blended dataset based on locations and times extracted from the second blended dataset, and to compare blend noise of the blended first dataset and the second blended dataset while deblending the second blended dataset. 18. The apparatus of claim 13, wherein the data processing unit is further configured:
to transform the first non-blended dataset in a model domain; and to deblend the second blended dataset using the transformed first dataset. 19. The apparatus of claim 18, wherein the data processing unit is configured
to deblend the second dataset by an inversion method using sparseness weights derived from the transformed first dataset, to deblend the second blended dataset using an anti-leakage/matching method, and/or to deblend the second blended dataset using a model domain masking, scaling or shaping function derived using the transformed first dataset. 20. The apparatus of claim 13, further comprising a non-transitory computer readable recording medium storing executable codes, which when executed by the data processing unit make the data processing unit to calculate the model dataset emulating the second blended dataset based on the first dataset, and to deblend the second blended dataset using the model dataset. | A non-blended dataset related to a same surveyed area as a blended dataset is used to deblend the blended dataset. The non-blended dataset may be used to calculate a model dataset emulating the blended dataset, or may be transformed in a model domain and used to derive sparseness weights, model domain masking, scaling or shaping functions used to deblend the blended dataset.1. A seismic data deblending method, comprising:
obtaining a first non-blended dataset and a second blended dataset related to a same surveyed area; calculating a model dataset emulating the second blended dataset based on the first non-blended dataset; and deblending the second blended dataset using the model dataset. 2. The method of claim 1, wherein the first non-blended dataset is the result of deblending of a blended dataset. 3. The method of claim 1, wherein the model dataset is calculated by interpolating data in the first dataset to match source and receiver positions of data in the second dataset. 4. The method of claim 3, wherein the model dataset is used to mitigate cross-talk noise in the second blended dataset by:
blending the model dataset to form a continuous recording trace; pseudo-blending the continuous recording trace; calculating a cross-talk estimate based on the pseudo-blended continuous recording trace; and subtracting the cross-talk noise from the second blended dataset. 5. The method of claim 3, further comprising:
generating a changemap including anticipated signal to blend noise ratios evaluated based on the model dataset. 6. The method of claim 5, wherein the changemap is used to derive space-time sparseness weights used to deblend the second blended dataset. 7. The method of claim 5, wherein the changemap is used to derive filters to be applied to the second blended dataset. 8. The method of claim 1, wherein
the model dataset is calculated by numerically blending the first non-blended dataset based on locations and times extracted from the second blended dataset, and the deblending includes comparing blend noise of the blended first non-blended dataset and the second blended dataset. 9. A method for deblending seismic data, the method comprising:
obtaining a first non-blended dataset and a second blended dataset related to a same surveyed area; transforming the first non-blended dataset in a model domain; and deblending the second blended dataset using the transformed first dataset. 10. The method of claim 9, wherein the second blended dataset is deblended by an inversion method using sparseness weights derived from the transformed first dataset. 11. The method of claim 9, wherein the deblending of the second blended dataset is performed using an anti-leakage/matching method. 12. The method of claim 9, wherein the deblending of the second blended dataset is performed using a model domain masking, scaling or shaping function derived using the transformed first dataset. 13. A seismic data processing apparatus comprising:
an interface configured to obtain a first non-blended dataset and a second blended dataset related to a same surveyed area; and a data processing unit including one or more processors and configured
to calculate a model dataset emulating the second blended dataset based on the first non-blended dataset; and
to deblend the second blended dataset using the model dataset. 14. The apparatus of claim 13, wherein the data processing unit is configured to calculate the model dataset by interpolating data in the first non-blended dataset to match data positions in the second blended dataset. 15. The apparatus of claim 13, wherein the data processing unit is configured to mitigate cross-talk noise in the second blended dataset using the model dataset by:
blending the model dataset to form a continuous recording trace; pseudo-blending the continuous recording trace; calculate a cross-talk estimate based on the pseudo-blended continuous recording trace; and subtracting the cross-talk noise from the second blended dataset. 16. The apparatus of claim 13, wherein the data processing unit is configured:
to generate a changemap including anticipated signal to blend noise ratios evaluated based on the model dataset, and to derive space-time sparseness weights used to deblend the second blended dataset or filters to be applied to the second blended dataset, based on the changemap. 17. The apparatus of claim 13, wherein the data processing unit is configured
to calculate the model dataset by numerically blending the first non-blended dataset based on locations and times extracted from the second blended dataset, and to compare blend noise of the blended first dataset and the second blended dataset while deblending the second blended dataset. 18. The apparatus of claim 13, wherein the data processing unit is further configured:
to transform the first non-blended dataset in a model domain; and to deblend the second blended dataset using the transformed first dataset. 19. The apparatus of claim 18, wherein the data processing unit is configured
to deblend the second dataset by an inversion method using sparseness weights derived from the transformed first dataset, to deblend the second blended dataset using an anti-leakage/matching method, and/or to deblend the second blended dataset using a model domain masking, scaling or shaping function derived using the transformed first dataset. 20. The apparatus of claim 13, further comprising a non-transitory computer readable recording medium storing executable codes, which when executed by the data processing unit make the data processing unit to calculate the model dataset emulating the second blended dataset based on the first dataset, and to deblend the second blended dataset using the model dataset. | 2,800 |
11,734 | 11,734 | 14,720,202 | 2,853 | Methods and apparatus to determine compound meter failure are disclosed. One disclosed example apparatus includes a receiver to receive fluid flow rate data from a first fluid flow rate meter on a first channel of a compound utility meter and a second fluid flow rate meter on a second channel of the compound utility meter. The example apparatus also includes a processor communicatively coupled to the receiver, where the processor is to determine a failure condition of the compound utility meter based on the flow rate data received from the first and second fluid flow rate meters. | 1. An apparatus comprising:
a receiver to receive fluid flow rate data from a first fluid flow rate meter on a first channel of a compound utility meter and a second fluid flow rate meter on a second channel of the compound utility meter; and a processor communicatively coupled to the receiver, wherein the processor is to determine a failure condition of the compound utility meter based on the flow rate data received from the first and second fluid flow rate meters. 2. The apparatus as defined in claim 1, further including a network interface to transmit an alert when the failure condition is out of an acceptable range. 3. The apparatus as defined in claim 2, wherein the alert transmitted as an SMS message. 4. The apparatus as defined in claim 1, wherein the processor is integral with the compound utility meter. 5. The apparatus as defined in claim 1, wherein the failure condition is determined based on whether the flow rate data indicates one or more of that a first flow rate of the first channel has exceeded a first threshold or that a second flow rate of the second channel is below a second threshold. 6. The apparatus as defined in claim 1, wherein the failure condition is based on an amount of flow through the first or second channels over a time duration. 7. The apparatus as defined in claim 1, wherein the flow rate data includes indications of whether the first or second flow rate meters have made measurements out of their respective threshold ranges over a defined time duration. 8. The apparatus as defined in claim 1, wherein the compound utility meter includes a bypass valve. 9. The apparatus as defined in claim 1, wherein the processor is located in a data analyzer. 10. A method comprising:
receiving first flow rate data from a first fluid flow rate meter that is on a first channel of a compound utility meter; receiving second flow rate data from a second fluid flow rate meter that is on a second channel of the compound utility meter; and determining, via a processor, a failure condition of the compound utility meter based on the first and second flow rate data. 11. The method as defined in claim 10, wherein determining the failure condition of the compound utility meter is based on whether the first flow rate data indicates that a first flow rate of the first channel has exceeded a first threshold, or that a second flow rate of a the second channel is below a second threshold. 12. The method as defined in claim 10, further including transmitting the failure condition to a data collection network. 13. The method as defined in claim 10, further including transmitting an alert when the failure condition of the compound utility meter indicates a failure of the compound utility meter. 14. A tangible machine readable medium having instructions stored thereon, which when executed, cause a machine to:
receive flow rate data from a plurality of flow meters of a compound utility meter; and determine a failure condition of the compound utility meter based on the flow rate data. 15. The machine readable medium as defined in claim 14, which when executed, further cause a machine to transmit an alert when the failure condition indicates a failure of the compound utility meter. 16. The machine readable medium as defined in claim 14, wherein the failure condition is determined based on whether the flow rate data indicates that a flow meter of the plurality of flow meters has been out of a respective threshold range. 17. The machine readable medium as defined in claim 14, wherein the flow rate data includes time histories of the flow meters. 18. The machine readable medium as defined in claim 14, wherein the failure condition is determined based on whether any of the flow meters are beyond a respective threshold for a specified time duration. | Methods and apparatus to determine compound meter failure are disclosed. One disclosed example apparatus includes a receiver to receive fluid flow rate data from a first fluid flow rate meter on a first channel of a compound utility meter and a second fluid flow rate meter on a second channel of the compound utility meter. The example apparatus also includes a processor communicatively coupled to the receiver, where the processor is to determine a failure condition of the compound utility meter based on the flow rate data received from the first and second fluid flow rate meters.1. An apparatus comprising:
a receiver to receive fluid flow rate data from a first fluid flow rate meter on a first channel of a compound utility meter and a second fluid flow rate meter on a second channel of the compound utility meter; and a processor communicatively coupled to the receiver, wherein the processor is to determine a failure condition of the compound utility meter based on the flow rate data received from the first and second fluid flow rate meters. 2. The apparatus as defined in claim 1, further including a network interface to transmit an alert when the failure condition is out of an acceptable range. 3. The apparatus as defined in claim 2, wherein the alert transmitted as an SMS message. 4. The apparatus as defined in claim 1, wherein the processor is integral with the compound utility meter. 5. The apparatus as defined in claim 1, wherein the failure condition is determined based on whether the flow rate data indicates one or more of that a first flow rate of the first channel has exceeded a first threshold or that a second flow rate of the second channel is below a second threshold. 6. The apparatus as defined in claim 1, wherein the failure condition is based on an amount of flow through the first or second channels over a time duration. 7. The apparatus as defined in claim 1, wherein the flow rate data includes indications of whether the first or second flow rate meters have made measurements out of their respective threshold ranges over a defined time duration. 8. The apparatus as defined in claim 1, wherein the compound utility meter includes a bypass valve. 9. The apparatus as defined in claim 1, wherein the processor is located in a data analyzer. 10. A method comprising:
receiving first flow rate data from a first fluid flow rate meter that is on a first channel of a compound utility meter; receiving second flow rate data from a second fluid flow rate meter that is on a second channel of the compound utility meter; and determining, via a processor, a failure condition of the compound utility meter based on the first and second flow rate data. 11. The method as defined in claim 10, wherein determining the failure condition of the compound utility meter is based on whether the first flow rate data indicates that a first flow rate of the first channel has exceeded a first threshold, or that a second flow rate of a the second channel is below a second threshold. 12. The method as defined in claim 10, further including transmitting the failure condition to a data collection network. 13. The method as defined in claim 10, further including transmitting an alert when the failure condition of the compound utility meter indicates a failure of the compound utility meter. 14. A tangible machine readable medium having instructions stored thereon, which when executed, cause a machine to:
receive flow rate data from a plurality of flow meters of a compound utility meter; and determine a failure condition of the compound utility meter based on the flow rate data. 15. The machine readable medium as defined in claim 14, which when executed, further cause a machine to transmit an alert when the failure condition indicates a failure of the compound utility meter. 16. The machine readable medium as defined in claim 14, wherein the failure condition is determined based on whether the flow rate data indicates that a flow meter of the plurality of flow meters has been out of a respective threshold range. 17. The machine readable medium as defined in claim 14, wherein the flow rate data includes time histories of the flow meters. 18. The machine readable medium as defined in claim 14, wherein the failure condition is determined based on whether any of the flow meters are beyond a respective threshold for a specified time duration. | 2,800 |
11,735 | 11,735 | 16,181,793 | 2,822 | The object of the technique disclosed in the specification is to provide a technique in which the production cost is reduced without impairing the mechanical strength of the resin, and the heat radiation is improved. The semiconductor device relates to the technique disclosed in the specification includes an insulating substrate, a semiconductor element disposed on an upper surface of the insulating substrate, a case connected to the insulating substrate, such that the semiconductor element is accommodated inside thereof, and resin filled inside of the case, such that the semiconductor element is embedded, on the upper surface of the resin in the inside of the case, a first concave part is formed, the first concave part is formed at a position covering an entire of the semiconductor element in plan view. | 1. A semiconductor device, comprising:
an insulating substrate;
a semiconductor element disposed on an upper surface of the insulating substrate;
a case connected to the insulating substrate, such that the semiconductor element is accommodated inside thereof; and
resin filled inside of the case, such that the semiconductor element is embedded, wherein
on the upper surface of the resin in the inside of the case, a first concave part is formed, and
the first concave part is formed at a position covering an entire of the semiconductor element in plan view. 2. The semiconductor device according to claim 1, further comprising:
at least one wiring electrically connected to the semiconductor element, wherein the resin is filled such that the at least one wiring is embedded. 3. The semiconductor device according to claim 1, further comprising:
a second concave part is formed on a bottom surface of the first concave part. 4. The semiconductor device according to claim 3, wherein at least one of the first concave part and the second concave part has a tapered side surface. 5. The semiconductor device according to claim 1, wherein
the semiconductor element is formed of a wide-gap including SiC. 6. A method of manufacturing a semiconductor device, comprising:
filling resin inside of a case accommodating a semiconductor element such that the semiconductor element disposed on an upper surface of an insulating substrate is embedded; on an upper surface of the resin that is filled, disposing a metal mold for the resin; performing thermosetting treatment on the resin with the metal meld being disposed; and removing the metal mold after the thermosetting treatment, wherein on the upper surface of the resin, a first concave part is formed, and the first concave part is formed at a position covering an entire of the semiconductor element in plan view. 7. The method of manufacturing a semiconductor device according to claim 6, wherein the metal mold is subjected to Ni-plating. 8. The method of manufacturing a semiconductor device according to claim 6, wherein the metal mold is made of metal having a higher linear thermal expansion coefficient than that of the resin. 9. The method of manufacturing a semiconductor device according to claim 6, wherein the semiconductor element is formed of a wide-gap including SiC. 10. The semiconductor device according to claim 2, wherein
a second concave part is further formed on a bottom surface of the first concave part. 11. The semiconductor device according to claim 2, wherein
the semiconductor element is formed of a wide-gap including SiC. 12. The semiconductor device according to claim 3, wherein
the semiconductor element is formed of a wide-gap including SiC. 13. The semiconductor device according to claim 4, wherein
the semiconductor element is formed of a wide-gap including SiC. 14. The method of manufacturing a semiconductor device according to claim 7, wherein
the metal mold is made of metal having a higher linear thermal expansion coefficient than that of the resin. 15. The method of manufacturing a semiconductor device according to claim 7, wherein
the semiconductor element is formed of a wide-gap including SiC. 16. The method of manufacturing a semiconductor device according to claim 8, wherein
the semiconductor element is formed of a wide-gap including SiC. | The object of the technique disclosed in the specification is to provide a technique in which the production cost is reduced without impairing the mechanical strength of the resin, and the heat radiation is improved. The semiconductor device relates to the technique disclosed in the specification includes an insulating substrate, a semiconductor element disposed on an upper surface of the insulating substrate, a case connected to the insulating substrate, such that the semiconductor element is accommodated inside thereof, and resin filled inside of the case, such that the semiconductor element is embedded, on the upper surface of the resin in the inside of the case, a first concave part is formed, the first concave part is formed at a position covering an entire of the semiconductor element in plan view.1. A semiconductor device, comprising:
an insulating substrate;
a semiconductor element disposed on an upper surface of the insulating substrate;
a case connected to the insulating substrate, such that the semiconductor element is accommodated inside thereof; and
resin filled inside of the case, such that the semiconductor element is embedded, wherein
on the upper surface of the resin in the inside of the case, a first concave part is formed, and
the first concave part is formed at a position covering an entire of the semiconductor element in plan view. 2. The semiconductor device according to claim 1, further comprising:
at least one wiring electrically connected to the semiconductor element, wherein the resin is filled such that the at least one wiring is embedded. 3. The semiconductor device according to claim 1, further comprising:
a second concave part is formed on a bottom surface of the first concave part. 4. The semiconductor device according to claim 3, wherein at least one of the first concave part and the second concave part has a tapered side surface. 5. The semiconductor device according to claim 1, wherein
the semiconductor element is formed of a wide-gap including SiC. 6. A method of manufacturing a semiconductor device, comprising:
filling resin inside of a case accommodating a semiconductor element such that the semiconductor element disposed on an upper surface of an insulating substrate is embedded; on an upper surface of the resin that is filled, disposing a metal mold for the resin; performing thermosetting treatment on the resin with the metal meld being disposed; and removing the metal mold after the thermosetting treatment, wherein on the upper surface of the resin, a first concave part is formed, and the first concave part is formed at a position covering an entire of the semiconductor element in plan view. 7. The method of manufacturing a semiconductor device according to claim 6, wherein the metal mold is subjected to Ni-plating. 8. The method of manufacturing a semiconductor device according to claim 6, wherein the metal mold is made of metal having a higher linear thermal expansion coefficient than that of the resin. 9. The method of manufacturing a semiconductor device according to claim 6, wherein the semiconductor element is formed of a wide-gap including SiC. 10. The semiconductor device according to claim 2, wherein
a second concave part is further formed on a bottom surface of the first concave part. 11. The semiconductor device according to claim 2, wherein
the semiconductor element is formed of a wide-gap including SiC. 12. The semiconductor device according to claim 3, wherein
the semiconductor element is formed of a wide-gap including SiC. 13. The semiconductor device according to claim 4, wherein
the semiconductor element is formed of a wide-gap including SiC. 14. The method of manufacturing a semiconductor device according to claim 7, wherein
the metal mold is made of metal having a higher linear thermal expansion coefficient than that of the resin. 15. The method of manufacturing a semiconductor device according to claim 7, wherein
the semiconductor element is formed of a wide-gap including SiC. 16. The method of manufacturing a semiconductor device according to claim 8, wherein
the semiconductor element is formed of a wide-gap including SiC. | 2,800 |
11,736 | 11,736 | 15,693,056 | 2,846 | Control circuitry of a motor drive provides commands for operation of power circuitry in cooperation with peripheral circuits and devices, such as converters, inverters, feedback precharge circuits, feedback devices, interfaces, and so forth. The communications with the devices is handled by fiber optic communications circuitry that implements a flexible scheme of dynamic interval communication depending upon the capabilities and design of the peripheral circuit or device. The communication may be in accordance with a plurality of predetermined schemes, each having different data transfer rates, data allocations, and so forth. The schemes may each set communications protocols (e.g., timing) over a high speed interface between the fiber optic communications circuitry on one side and over fiber optic cables to the peripherals on another side. | 1. A system comprising:
converter circuitry to convert incoming three-phase power to DC power; inverter circuitry to convert the DC power to three-phase controlled frequency AC power to drive a motor; control circuitry coupled to the inverter circuitry and configured to apply control signals to the inverter circuitry for conversion of the DC power to the controlled frequency AC power; and communications circuitry comprising a bandwidth manager and coupled for data communication between the control circuitry and a plurality of peripheral devices including at least the inverter circuitry, wherein the bandwidth manager of the communications circuitry implements a dynamic interval communications protocol having a plurality of data transfer schemes each having different respective data transfer intervals and data allocations. 2. The system of claim 1, wherein the bandwidth manager of the communications circuitry is configured to select the data transfer scheme based upon the capabilities of each peripheral device. 3. The system of claim 1, wherein the communications circuitry is fiber optic communications circuitry, and is configured to be coupled to the peripheral devices via respective fiber optic conductors. 4. The system of claim 1, wherein each data transfer scheme comprises timing for transfer of data between the control circuitry and the communications circuitry via high speed interface lines, and then from the communications circuitry to the peripheral devices. 5. The system of claim 1, wherein the communications circuitry comprises onboard safety circuitry configured to monitor and control the safety functions of the system. 6. The system of claim 1, wherein the data transfer schemes comprise three different schemes having nominal data transfer message intervals of 62.5 μs, 125 μs, and 250 μs. 7. The system of claim 1, wherein the communications circuitry comprises a plurality of expansion ports. 8. The system of claim 7, wherein each expansion port, in operation, is fitted with an expansion card allowing coupling of additional peripheral devices. 9. A system comprising:
converter circuitry to convert incoming three-phase power to DC power; inverter circuitry to convert the DC power to three-phase controlled frequency AC power to drive a motor; control circuitry coupled to the inverter circuitry and configured to apply control signals to the inverter circuitry for conversion of the DC power to the controlled frequency AC power; and fiber optic communications circuitry coupled for data communication between the control circuitry and a plurality of peripheral devices including at least the inverter circuitry, wherein the control circuitry implements a dynamic interval communications protocol having a plurality of data transfer schemes each having different respective data transfer intervals and data allocations. 10. The system of claim 9, wherein the fiber optic communications circuitry is configured by the control circuitry to select the data transfer scheme based upon the capabilities of each peripheral device. 11. The system of claim 9, wherein the fiber optic communications circuitry is configured to be coupled to the peripheral devices via respective fiber optic conductors. 12. The system of claim 9, wherein each data transfer scheme comprises timing for transfer of data between the control circuitry and the fiber optic communications circuitry via high speed interface lines, and then from the fiber optic communications circuitry to the peripheral devices via fiber optic conductors. 13. The system of claim 9, wherein the fiber optic communications circuitry comprises onboard safety circuitry configured to monitor and control the safety functions of the system. 14. The system of claim 9, wherein the data transfer schemes comprise three different schemes having nominal data transfer message intervals of 62.5 μs, 125 μs, and 250 μs. 15. The system of claim 9, wherein the fiber optic communications circuitry comprises a plurality of expansion ports, wherein each expansion port, in operation, is fitted with an expansion card allowing coupling of additional peripheral devices via additional fiber optic conductors. 16. A method comprising:
converting incoming three-phase power to DC power using converter circuitry; inverting the DC power to three-phase controlled frequency AC power to drive a motor using inverter circuitry; controlling the inverting circuitry via control circuitry; communicating between the control circuitry and peripheral devices including at least the inverter circuitry using fiber optic communications circuitry, wherein the fiber optic communications circuitry implements a dynamic interval communications protocol having a plurality of data transfer schemes each having different respective data transfer intervals and data allocations. 17. The method of claim 16, wherein the fiber optic communications circuitry is configured by the control circuitry to select the data transfer scheme based upon the capabilities of each peripheral device. 18. The method of claim 16, wherein the fiber optic communications circuitry comprises a plurality of expansion ports, wherein each expansion port, in operation, is fitted with an expansion card allowing coupling of additional peripheral devices via additional fiber optic conductors. 19. The method of claim 16, wherein the fiber optic communications circuitry comprises onboard safety circuitry configured to monitor and control the safety functions of the system. 20. The method of claim 16, wherein the data transfer schemes comprise three different schemes having nominal data transfer message intervals of 62.5 μs, 125 μs, and 250 μs. | Control circuitry of a motor drive provides commands for operation of power circuitry in cooperation with peripheral circuits and devices, such as converters, inverters, feedback precharge circuits, feedback devices, interfaces, and so forth. The communications with the devices is handled by fiber optic communications circuitry that implements a flexible scheme of dynamic interval communication depending upon the capabilities and design of the peripheral circuit or device. The communication may be in accordance with a plurality of predetermined schemes, each having different data transfer rates, data allocations, and so forth. The schemes may each set communications protocols (e.g., timing) over a high speed interface between the fiber optic communications circuitry on one side and over fiber optic cables to the peripherals on another side.1. A system comprising:
converter circuitry to convert incoming three-phase power to DC power; inverter circuitry to convert the DC power to three-phase controlled frequency AC power to drive a motor; control circuitry coupled to the inverter circuitry and configured to apply control signals to the inverter circuitry for conversion of the DC power to the controlled frequency AC power; and communications circuitry comprising a bandwidth manager and coupled for data communication between the control circuitry and a plurality of peripheral devices including at least the inverter circuitry, wherein the bandwidth manager of the communications circuitry implements a dynamic interval communications protocol having a plurality of data transfer schemes each having different respective data transfer intervals and data allocations. 2. The system of claim 1, wherein the bandwidth manager of the communications circuitry is configured to select the data transfer scheme based upon the capabilities of each peripheral device. 3. The system of claim 1, wherein the communications circuitry is fiber optic communications circuitry, and is configured to be coupled to the peripheral devices via respective fiber optic conductors. 4. The system of claim 1, wherein each data transfer scheme comprises timing for transfer of data between the control circuitry and the communications circuitry via high speed interface lines, and then from the communications circuitry to the peripheral devices. 5. The system of claim 1, wherein the communications circuitry comprises onboard safety circuitry configured to monitor and control the safety functions of the system. 6. The system of claim 1, wherein the data transfer schemes comprise three different schemes having nominal data transfer message intervals of 62.5 μs, 125 μs, and 250 μs. 7. The system of claim 1, wherein the communications circuitry comprises a plurality of expansion ports. 8. The system of claim 7, wherein each expansion port, in operation, is fitted with an expansion card allowing coupling of additional peripheral devices. 9. A system comprising:
converter circuitry to convert incoming three-phase power to DC power; inverter circuitry to convert the DC power to three-phase controlled frequency AC power to drive a motor; control circuitry coupled to the inverter circuitry and configured to apply control signals to the inverter circuitry for conversion of the DC power to the controlled frequency AC power; and fiber optic communications circuitry coupled for data communication between the control circuitry and a plurality of peripheral devices including at least the inverter circuitry, wherein the control circuitry implements a dynamic interval communications protocol having a plurality of data transfer schemes each having different respective data transfer intervals and data allocations. 10. The system of claim 9, wherein the fiber optic communications circuitry is configured by the control circuitry to select the data transfer scheme based upon the capabilities of each peripheral device. 11. The system of claim 9, wherein the fiber optic communications circuitry is configured to be coupled to the peripheral devices via respective fiber optic conductors. 12. The system of claim 9, wherein each data transfer scheme comprises timing for transfer of data between the control circuitry and the fiber optic communications circuitry via high speed interface lines, and then from the fiber optic communications circuitry to the peripheral devices via fiber optic conductors. 13. The system of claim 9, wherein the fiber optic communications circuitry comprises onboard safety circuitry configured to monitor and control the safety functions of the system. 14. The system of claim 9, wherein the data transfer schemes comprise three different schemes having nominal data transfer message intervals of 62.5 μs, 125 μs, and 250 μs. 15. The system of claim 9, wherein the fiber optic communications circuitry comprises a plurality of expansion ports, wherein each expansion port, in operation, is fitted with an expansion card allowing coupling of additional peripheral devices via additional fiber optic conductors. 16. A method comprising:
converting incoming three-phase power to DC power using converter circuitry; inverting the DC power to three-phase controlled frequency AC power to drive a motor using inverter circuitry; controlling the inverting circuitry via control circuitry; communicating between the control circuitry and peripheral devices including at least the inverter circuitry using fiber optic communications circuitry, wherein the fiber optic communications circuitry implements a dynamic interval communications protocol having a plurality of data transfer schemes each having different respective data transfer intervals and data allocations. 17. The method of claim 16, wherein the fiber optic communications circuitry is configured by the control circuitry to select the data transfer scheme based upon the capabilities of each peripheral device. 18. The method of claim 16, wherein the fiber optic communications circuitry comprises a plurality of expansion ports, wherein each expansion port, in operation, is fitted with an expansion card allowing coupling of additional peripheral devices via additional fiber optic conductors. 19. The method of claim 16, wherein the fiber optic communications circuitry comprises onboard safety circuitry configured to monitor and control the safety functions of the system. 20. The method of claim 16, wherein the data transfer schemes comprise three different schemes having nominal data transfer message intervals of 62.5 μs, 125 μs, and 250 μs. | 2,800 |
11,737 | 11,737 | 12,309,664 | 2,878 | In one aspect of the present invention, a method is provided for communicating radiation pressure provided by a light wave. The method entails positioning a reflective prism ( 606, 607 ) having a near total reflective surface, including an initial transparent surface ( 614 A, 614 B) and a pair of reflective surfaces ( 612 ) each positioned at an angle relative to the initial transparent surface. Then, a light wave is directed toward the reflective prism, such that the light wave is generally normal to the transparent surface and passes therethrough. The light wave further reflects from the first and then the second reflective surface and exits the prism through the transparent surface. In this way, radiation pressure communicated by the relecting light wave acts on the prism. | 1. A method of communicating radiation pressure provided by a light wave, said method comprising the steps of:
positioning a reflective prism having a near total reflective surface (NTRS), including a transparent surface and a pair of reflective surfaces each reflective surface positioned at an angle relative to the transparent surface; and directing a light wave toward the reflective prism, such that the light wave is generally normal to the transparent surface and passes therethrough, whereby the light wave further reflects from the first and then the second reflective surface and exits the prism through the transparent surface, whereby radiation pressure communicated by the reflecting light wave acts on the reflective prism. 2. The method of claim 1, wherein the reflective surfaces are positioned such that the light wave reflects thereupon at a generally 90° angle to an incident angle and exits the prism at a generally normal angle to the transparent surface. 3. The method of claim 1, wherein the directing step is repeated a plurality of times such that radiation pressure communicated by the light waves repeatedly acts upon the reflective prism. 4. The method of claim 3, further comprising an optic switch and a containment chamber that includes the reflective prism, the optic switch, and a second reflective mirror, said directing step further including introducing a light wave into the containment chamber, said introducing step including directing the introduced light wave in the direction of the first reflective surface, thereby contacting the reflective prism and reflecting therefrom and causing radiation pressure to act on the NTRS, whereby the reflected light wave is caused to travel along a predetermined reflective light path such that the reflected light wave reflects against the second reflective mirror, and returns in the direction of the initial reflective light path such that the light wave is again caused to reflect against the reflective prism, and such that the light wave continues to propagate along the predetermined light path for a plurality of cycles and radiation pressure to repeatedly act upon the reflective prism, wherein the reflective surface is provided by a quartz prism having the near total reflection surface (NTRS). 5. The method of claim 1, wherein the light wave is selectively directed from a light source along a predetermined light path, whereby the light wave passes through the transparent surface to reflect against each of the reflective surfaces at 45° angles and exit the prism generally normal to the transparent surface, such that the light wave is red-shifted to reduce residual heat. 6. A method of communicating radiation pressure provided by a light wave, said method comprising the steps of:
providing a containment chamber for containing propagation of a light wave; positioning, in a first location of the containment chamber, a first reflective surface and, in a second location of the containment chamber, a second reflective surface, whereby the locations and orientations of the first and second reflective surfaces are predetermined to define, at least partially, a predetermined reflective light path; providing a first prism and positioning the first prism such that at least one face of the first prism forms a boundary of the containment chamber; and introducing a light wave into the containment chamber, said introducing step including directing the introduced light wave in the direction of the first reflective surface, thereby contacting the first reflective surface and causing radiation pressure to act on the first reflective surface, and then to reflect against the first reflective surface, whereby the reflected light wave is caused to travel along the predetermined reflective light path such that the reflected light wave reflects against the second reflective surface, and returns in the direction of the initial reflective light path such that the light wave is again caused to reflect against the first reflective surface, and such that the light wave continues to propagate between the reflective surfaces along the predetermined light path for a plurality of cycles and radiation pressure to repeatedly act upon the first reflective surface, wherein at least one of the reflective surfaces is provided by a mirror having a near total reflective surface (NTRS). 7. The method of claim 6, wherein said introducing step includes directing the light wave into the prism through said one face, by opening said one face of the prism such that the light wave enters the containment chamber through said one face and, after the light wave enters the containment chamber, closing said one face. 8. The method of claim 7, further comprising providing a second prism and positioning the second prism such that one face of the second prism is positioned adjacent said one face of the first prism, wherein said step of opening said one face includes compressing said one face of the first prism toward said one face of the second prism, such that the compressed faces form a transparent interface between the first and second prisms. 9. The method of claim 6, wherein the first reflective surface is provided by a reflective prism having an initial reflective surface providing the first reflective surface and a return reflective surface positioned so that a light wave reflecting off the first reflective surface is reflected thereon in a direction away from the prism, and such that said introducing step causes propagation of the light wave between the initial reflective surface, the return reflective surface and, at least, the second reflective surface. 10. The method of claim 9, wherein the prism is a movable prism. 11. The method of claim 10, further comprising the step of repeating said introducing step with respect to another light wave, whereby repeated contact of the surfaces of the prism with the light wave causes radiation pressure to move the movable prism along a predetermined path. 12. The method of claim 9, wherein the NTRS includes a transparent surface, the initial reflective surface, and the return reflective surface, the NTRS being positioned relative to the light wave such that the light wave enters the prism by passing through the transparent surface, reflects from the first reflective surface and the return reflective surface, and exits through the transparent surface. 13. An apparatus for communicating radiation pressure provided by a light wave, said apparatus comprising:
a containment chamber configured to contain the propagation of light waves; an optic switch selectively operable in an open mode and a close mode, wherein said optic switch in open mode allows a light wave to enter said containment chamber and said optic switch in close mode prevents escape of the light wave from the containment chamber; and a reflective mirror positioned at one end of said containment chamber, said reflective mirror having a near total reflective surface (NTRS); wherein the optic switch and reflective mirror are positioned such that said optic switch is operable to introduce a light wave into the containment chamber in the direction of the reflective mirror such that the light wave reflects against the NTRS to cause radiation pressure to act on the reflective mirror. 14. The apparatus of claim 13, wherein the reflective mirror is a quartz prism having an initial reflective surface and a return reflective surface. 15. The apparatus of claim 14, wherein the prism further includes a transparent surface where through a light wave enters the prism to contact the reflective surfaces and where through a light wave exits the prism. 16. The apparatus of claim 15, wherein each of the reflective surfaces is positioned at generally 45° to the transparent surface. 17. The apparatus of claim 16, wherein the reflective surfaces are positioned such that the light wave reflects thereupon at a generally 90° angle to an incident angle and exits the prism at a generally normal angle to the transparent surface. 18. The apparatus of claim 13, wherein the mirror has a plurality of NTRS. 19. The apparatus of claim 18, wherein the reflective mirror is a quartz prism having a plurality of NTRS, the NTRS being arranged concentrically and adjacent one another. 20. The apparatus of claim 1, further comprising:
a first prism positioned in said containment chamber such that a volume of said first prism provides a portion of said containment chamber and such that one face of said first prism provides a gate for said optic switch; and a second prism adjacent said containment chamber such that a face of said second prism is positioned adjacent said one face of said first prism, and such that compression between said first and second prisms operates said optic switch between said open and close modes. 21. The apparatus of claim 20, further comprising a piezoelectric actuator associated with the optic switch and operable to drive compression of the first and second prisms between open and close modes. 22. A method of communicating radiation pressure provided by a light wave, said method comprising the steps of:
providing a containment chamber for containing propagation of a light wave; positioning, in a first location of the containment chamber, a mirror having a near total reflective surface (NTRS) and, in a second location of the containment chamber, a second reflective surface; providing a first prism and positioning the first prism such that at least one face of the first prism forms a boundary of the containment chamber; providing a second prism and positioning the second prism such that one face of the second prism is positioned adjacent said one face of the first prism; receiving, in the second prism, a light wave from an external source; and introducing the light wave from the second prism into the containment chamber, including directing the introduced light wave in the direction of the NTRS, thereby contacting the NTRS to cause radiation pressure to act on the NTRS, whereby the light wave reflects from the NTRS along a predetermined reflective light path to reflect against the second reflective surface, and returns in the direction of the initial reflective light path to reflect against the NTRS, whereby the light wave repeatedly contacts and reflects against the NTRS causing radiation pressure to act thereon. 23. The method of claim 22, wherein said introducing step includes directing the light wave into the containment chamber through said one face of the first prism by opening said one face of the prism such that the light wave enters the containment chamber through said one face and, after the light wave enters the containment chamber, closing said one face, and wherein said step of opening said one face includes compressing said one face of the first prism toward said one face of the second prism, such that the compressed faces form a transparent interface between the first and second prisms; and
repeating the introducing step, including the opening step, to cause radiation pressure to act on the mirror. 24. The method of claim 22, further comprising the step of:
multiplying the light wave a plurality of times, in the second prism prior to said introducing step, thereby increasing the intensity of the light wave introduced into the containment chamber, wherein said multiplying step includes splitting the light wave and resulting split light waves within the second prism prior to said introduction step, whereby resulting light waves having compressed beam lengths after splitting. 25. An apparatus for communicating radiation pressure provided by a light wave, said apparatus comprising:
a reflective prism having a near total reflective surface (NTRS), the reflective prism being a quartz prism having an initial transparent surface and a pair of reflective surfaces; and a light wave source positioned to direct a light wave in a direction of the reflective prism and generally normal to the transparent surface such that the light wave passes through the transparent surface and reflects from the reflective surfaces, thereby causing radiation pressure communicated by the light wave to act on the NTRS. 26. The apparatus of claim 25, wherein the NTRS includes a transparent surface positioned generally normal to a path of the directed light wave and two reflective surfaces each positioned at 45° to the transparent surface. 27. The apparatus of claim 25, wherein the light wave source includes an optic switch selectively operable to direct the light wave along a predetermined light path to the reflective mirror and normal to the transparent surface. 28. The apparatus of claim 27, further including a containment chamber configured to contain the propagation of the light wave therein. 29. The apparatus of claim 28, wherein the optic switch includes a first prism positioned in said containment chamber such that a volume of said firs prism provides a portion of said containment chamber and such that one face of said first prism provides a gate for said optic switch; and
a second prism adjacent said containment chamber such that a face of said second prism is positioned adjacent said one face of said first prism, and such that compression between said first and second prisms operates said optic switch between said open and close modes. | In one aspect of the present invention, a method is provided for communicating radiation pressure provided by a light wave. The method entails positioning a reflective prism ( 606, 607 ) having a near total reflective surface, including an initial transparent surface ( 614 A, 614 B) and a pair of reflective surfaces ( 612 ) each positioned at an angle relative to the initial transparent surface. Then, a light wave is directed toward the reflective prism, such that the light wave is generally normal to the transparent surface and passes therethrough. The light wave further reflects from the first and then the second reflective surface and exits the prism through the transparent surface. In this way, radiation pressure communicated by the relecting light wave acts on the prism.1. A method of communicating radiation pressure provided by a light wave, said method comprising the steps of:
positioning a reflective prism having a near total reflective surface (NTRS), including a transparent surface and a pair of reflective surfaces each reflective surface positioned at an angle relative to the transparent surface; and directing a light wave toward the reflective prism, such that the light wave is generally normal to the transparent surface and passes therethrough, whereby the light wave further reflects from the first and then the second reflective surface and exits the prism through the transparent surface, whereby radiation pressure communicated by the reflecting light wave acts on the reflective prism. 2. The method of claim 1, wherein the reflective surfaces are positioned such that the light wave reflects thereupon at a generally 90° angle to an incident angle and exits the prism at a generally normal angle to the transparent surface. 3. The method of claim 1, wherein the directing step is repeated a plurality of times such that radiation pressure communicated by the light waves repeatedly acts upon the reflective prism. 4. The method of claim 3, further comprising an optic switch and a containment chamber that includes the reflective prism, the optic switch, and a second reflective mirror, said directing step further including introducing a light wave into the containment chamber, said introducing step including directing the introduced light wave in the direction of the first reflective surface, thereby contacting the reflective prism and reflecting therefrom and causing radiation pressure to act on the NTRS, whereby the reflected light wave is caused to travel along a predetermined reflective light path such that the reflected light wave reflects against the second reflective mirror, and returns in the direction of the initial reflective light path such that the light wave is again caused to reflect against the reflective prism, and such that the light wave continues to propagate along the predetermined light path for a plurality of cycles and radiation pressure to repeatedly act upon the reflective prism, wherein the reflective surface is provided by a quartz prism having the near total reflection surface (NTRS). 5. The method of claim 1, wherein the light wave is selectively directed from a light source along a predetermined light path, whereby the light wave passes through the transparent surface to reflect against each of the reflective surfaces at 45° angles and exit the prism generally normal to the transparent surface, such that the light wave is red-shifted to reduce residual heat. 6. A method of communicating radiation pressure provided by a light wave, said method comprising the steps of:
providing a containment chamber for containing propagation of a light wave; positioning, in a first location of the containment chamber, a first reflective surface and, in a second location of the containment chamber, a second reflective surface, whereby the locations and orientations of the first and second reflective surfaces are predetermined to define, at least partially, a predetermined reflective light path; providing a first prism and positioning the first prism such that at least one face of the first prism forms a boundary of the containment chamber; and introducing a light wave into the containment chamber, said introducing step including directing the introduced light wave in the direction of the first reflective surface, thereby contacting the first reflective surface and causing radiation pressure to act on the first reflective surface, and then to reflect against the first reflective surface, whereby the reflected light wave is caused to travel along the predetermined reflective light path such that the reflected light wave reflects against the second reflective surface, and returns in the direction of the initial reflective light path such that the light wave is again caused to reflect against the first reflective surface, and such that the light wave continues to propagate between the reflective surfaces along the predetermined light path for a plurality of cycles and radiation pressure to repeatedly act upon the first reflective surface, wherein at least one of the reflective surfaces is provided by a mirror having a near total reflective surface (NTRS). 7. The method of claim 6, wherein said introducing step includes directing the light wave into the prism through said one face, by opening said one face of the prism such that the light wave enters the containment chamber through said one face and, after the light wave enters the containment chamber, closing said one face. 8. The method of claim 7, further comprising providing a second prism and positioning the second prism such that one face of the second prism is positioned adjacent said one face of the first prism, wherein said step of opening said one face includes compressing said one face of the first prism toward said one face of the second prism, such that the compressed faces form a transparent interface between the first and second prisms. 9. The method of claim 6, wherein the first reflective surface is provided by a reflective prism having an initial reflective surface providing the first reflective surface and a return reflective surface positioned so that a light wave reflecting off the first reflective surface is reflected thereon in a direction away from the prism, and such that said introducing step causes propagation of the light wave between the initial reflective surface, the return reflective surface and, at least, the second reflective surface. 10. The method of claim 9, wherein the prism is a movable prism. 11. The method of claim 10, further comprising the step of repeating said introducing step with respect to another light wave, whereby repeated contact of the surfaces of the prism with the light wave causes radiation pressure to move the movable prism along a predetermined path. 12. The method of claim 9, wherein the NTRS includes a transparent surface, the initial reflective surface, and the return reflective surface, the NTRS being positioned relative to the light wave such that the light wave enters the prism by passing through the transparent surface, reflects from the first reflective surface and the return reflective surface, and exits through the transparent surface. 13. An apparatus for communicating radiation pressure provided by a light wave, said apparatus comprising:
a containment chamber configured to contain the propagation of light waves; an optic switch selectively operable in an open mode and a close mode, wherein said optic switch in open mode allows a light wave to enter said containment chamber and said optic switch in close mode prevents escape of the light wave from the containment chamber; and a reflective mirror positioned at one end of said containment chamber, said reflective mirror having a near total reflective surface (NTRS); wherein the optic switch and reflective mirror are positioned such that said optic switch is operable to introduce a light wave into the containment chamber in the direction of the reflective mirror such that the light wave reflects against the NTRS to cause radiation pressure to act on the reflective mirror. 14. The apparatus of claim 13, wherein the reflective mirror is a quartz prism having an initial reflective surface and a return reflective surface. 15. The apparatus of claim 14, wherein the prism further includes a transparent surface where through a light wave enters the prism to contact the reflective surfaces and where through a light wave exits the prism. 16. The apparatus of claim 15, wherein each of the reflective surfaces is positioned at generally 45° to the transparent surface. 17. The apparatus of claim 16, wherein the reflective surfaces are positioned such that the light wave reflects thereupon at a generally 90° angle to an incident angle and exits the prism at a generally normal angle to the transparent surface. 18. The apparatus of claim 13, wherein the mirror has a plurality of NTRS. 19. The apparatus of claim 18, wherein the reflective mirror is a quartz prism having a plurality of NTRS, the NTRS being arranged concentrically and adjacent one another. 20. The apparatus of claim 1, further comprising:
a first prism positioned in said containment chamber such that a volume of said first prism provides a portion of said containment chamber and such that one face of said first prism provides a gate for said optic switch; and a second prism adjacent said containment chamber such that a face of said second prism is positioned adjacent said one face of said first prism, and such that compression between said first and second prisms operates said optic switch between said open and close modes. 21. The apparatus of claim 20, further comprising a piezoelectric actuator associated with the optic switch and operable to drive compression of the first and second prisms between open and close modes. 22. A method of communicating radiation pressure provided by a light wave, said method comprising the steps of:
providing a containment chamber for containing propagation of a light wave; positioning, in a first location of the containment chamber, a mirror having a near total reflective surface (NTRS) and, in a second location of the containment chamber, a second reflective surface; providing a first prism and positioning the first prism such that at least one face of the first prism forms a boundary of the containment chamber; providing a second prism and positioning the second prism such that one face of the second prism is positioned adjacent said one face of the first prism; receiving, in the second prism, a light wave from an external source; and introducing the light wave from the second prism into the containment chamber, including directing the introduced light wave in the direction of the NTRS, thereby contacting the NTRS to cause radiation pressure to act on the NTRS, whereby the light wave reflects from the NTRS along a predetermined reflective light path to reflect against the second reflective surface, and returns in the direction of the initial reflective light path to reflect against the NTRS, whereby the light wave repeatedly contacts and reflects against the NTRS causing radiation pressure to act thereon. 23. The method of claim 22, wherein said introducing step includes directing the light wave into the containment chamber through said one face of the first prism by opening said one face of the prism such that the light wave enters the containment chamber through said one face and, after the light wave enters the containment chamber, closing said one face, and wherein said step of opening said one face includes compressing said one face of the first prism toward said one face of the second prism, such that the compressed faces form a transparent interface between the first and second prisms; and
repeating the introducing step, including the opening step, to cause radiation pressure to act on the mirror. 24. The method of claim 22, further comprising the step of:
multiplying the light wave a plurality of times, in the second prism prior to said introducing step, thereby increasing the intensity of the light wave introduced into the containment chamber, wherein said multiplying step includes splitting the light wave and resulting split light waves within the second prism prior to said introduction step, whereby resulting light waves having compressed beam lengths after splitting. 25. An apparatus for communicating radiation pressure provided by a light wave, said apparatus comprising:
a reflective prism having a near total reflective surface (NTRS), the reflective prism being a quartz prism having an initial transparent surface and a pair of reflective surfaces; and a light wave source positioned to direct a light wave in a direction of the reflective prism and generally normal to the transparent surface such that the light wave passes through the transparent surface and reflects from the reflective surfaces, thereby causing radiation pressure communicated by the light wave to act on the NTRS. 26. The apparatus of claim 25, wherein the NTRS includes a transparent surface positioned generally normal to a path of the directed light wave and two reflective surfaces each positioned at 45° to the transparent surface. 27. The apparatus of claim 25, wherein the light wave source includes an optic switch selectively operable to direct the light wave along a predetermined light path to the reflective mirror and normal to the transparent surface. 28. The apparatus of claim 27, further including a containment chamber configured to contain the propagation of the light wave therein. 29. The apparatus of claim 28, wherein the optic switch includes a first prism positioned in said containment chamber such that a volume of said firs prism provides a portion of said containment chamber and such that one face of said first prism provides a gate for said optic switch; and
a second prism adjacent said containment chamber such that a face of said second prism is positioned adjacent said one face of said first prism, and such that compression between said first and second prisms operates said optic switch between said open and close modes. | 2,800 |
11,738 | 11,738 | 15,595,440 | 2,881 | A system and method using an inflatable jacket over the compression paddle of a mammography and/or tomosynthesis system to enhance imaging and improve patient comfort in x-ray breast imaging. | 1.-27. (canceled) 28. A method of imaging a breast with x-rays comprising:
supporting the breast on a breast platform and proximate an inflatable element; compressing the breast with a compression paddle; detecting an event associated with the compression of the breast; based on the detection of the event, selectively adjusting a degree of inflation of the inflatable element against the breast; imaging the compressed breast with x-ray; and generating x-ray images of the breast. 29. The method of claim 28, wherein the event comprises the compression paddle reaching a predetermined position. 30. The method of claim 29, wherein the predetermined position is measured relative to at least one of the breast and the breast platform. 31. The method of claim 28, wherein the event comprises reaching a specified pressure on the breast. 32. The method of claim 31, wherein adjusting the degree of inflation comprises increasing an internal pressure of the inflatable element. 33. The method of claim 30, further comprising re-positioning the breast after the detection of the event. 34. An x-ray breast imaging system comprising:
a breast platform configured to support a patient's breast for imaging; a compression paddle supported for movement toward the breast platform to compress the breast, the compression paddle having a front wall configured to be adjacent the patient's chest wall when the patient's breast is supported for imaging, and an underside configured to be adjacent the patient's breast when the patient's breast is supported for imaging; and a paddle jacket removably secured to the compression paddle, said jacket comprising:
an inflatable chamber disposed between the compression paddle and the patient's breast when the patient's breast is supported for imaging; and
a seam disposed (a) between the front wall and the patient's chest wall when the patient's breast is supported for imaging, and (b) between the underside and the patient's breast when the patient's breast is supported for imaging. 35. The x-ray breast imaging system of claim 34, wherein the seam extends at least partially along the underside such that the inflatable chamber is not disposed between the front wall and the patient's chest wall when the patient's breast is supported for imaging. 36. The x-ray breast imaging system of claim 34, wherein the paddle jacket comprises a top wall and a bottom wall that at least partially defines the inflatable chamber, wherein the top wall and the bottom wall are fused so as to form the seam. 37. The x-ray breast imaging system of claim 36, wherein the inflatable chamber is defined by the top wall, the bottom wall, and the seam. 38. The x-ray breast imaging system of claim 34 wherein the paddle jacket further comprises a clipping member configured to releasably clip the seam to the front wall of the compression paddle. 39. The x-ray breast imaging system of claim 34, further comprising a fluid conduit in fluid flow communication with the inflatable chamber. 40. The x-ray breast imaging system of claim 39, further comprising a fluid control unit releasably coupled with the fluid conduit to selectively supply fluid to the inflatable chamber through the fluid conduit and thereby selectively inflate the inflatable chamber. 41. An x-ray breast imaging system comprising:
a breast platform configured to support a patient's breast for imaging; a compression paddle supported for movement toward the breast platform to compress the breast; a paddle jacket removably secured proximate the underside of the compression paddle, said jacket comprising a first inflatable chamber and a second inflatable chamber; a first fluid conduit that is in fluid flow communication with the first inflatable chamber; a second fluid conduit that is in fluid flow communication with the second inflatable chamber; and a fluid control unit releasably coupled with the first fluid conduit and the second fluid conduit to selectively inflate the first inflatable chamber and the second inflatable chamber to different pressures. 42. The x-ray breast imaging system of claim 41, wherein the paddle jacket comprises a partition disposed between the first inflatable chamber and the second inflatable chamber. 43. The x-ray breast imaging system of claim 41, wherein the compression paddle comprises a front wall configured to be adjacent the patient's chest wall when the patient's breast is supported for imaging, and an underside configured to be adjacent the patient's breast when the patient's breast is supported for imaging. 44. The x-ray breast imaging system of claim 43, wherein the first inflatable chamber is disposed proximate the underside when the patient's breast is supported for imaging. 45. The x-ray breast imaging system of claim 44, wherein the second inflatable chamber is disposed proximate the underside when the patient's breast is supported for imaging. 46. The x-ray breast imaging system of claim 43, wherein the first inflatable chamber is disposed proximate a forward portion of the underside when the patient's breast is supported for imaging. 47. The x-ray breast imaging system of claim 46, wherein the second inflatable chamber is disposed proximate a rearward portion of the compression paddle when the patient's breast is supported for imaging. | A system and method using an inflatable jacket over the compression paddle of a mammography and/or tomosynthesis system to enhance imaging and improve patient comfort in x-ray breast imaging.1.-27. (canceled) 28. A method of imaging a breast with x-rays comprising:
supporting the breast on a breast platform and proximate an inflatable element; compressing the breast with a compression paddle; detecting an event associated with the compression of the breast; based on the detection of the event, selectively adjusting a degree of inflation of the inflatable element against the breast; imaging the compressed breast with x-ray; and generating x-ray images of the breast. 29. The method of claim 28, wherein the event comprises the compression paddle reaching a predetermined position. 30. The method of claim 29, wherein the predetermined position is measured relative to at least one of the breast and the breast platform. 31. The method of claim 28, wherein the event comprises reaching a specified pressure on the breast. 32. The method of claim 31, wherein adjusting the degree of inflation comprises increasing an internal pressure of the inflatable element. 33. The method of claim 30, further comprising re-positioning the breast after the detection of the event. 34. An x-ray breast imaging system comprising:
a breast platform configured to support a patient's breast for imaging; a compression paddle supported for movement toward the breast platform to compress the breast, the compression paddle having a front wall configured to be adjacent the patient's chest wall when the patient's breast is supported for imaging, and an underside configured to be adjacent the patient's breast when the patient's breast is supported for imaging; and a paddle jacket removably secured to the compression paddle, said jacket comprising:
an inflatable chamber disposed between the compression paddle and the patient's breast when the patient's breast is supported for imaging; and
a seam disposed (a) between the front wall and the patient's chest wall when the patient's breast is supported for imaging, and (b) between the underside and the patient's breast when the patient's breast is supported for imaging. 35. The x-ray breast imaging system of claim 34, wherein the seam extends at least partially along the underside such that the inflatable chamber is not disposed between the front wall and the patient's chest wall when the patient's breast is supported for imaging. 36. The x-ray breast imaging system of claim 34, wherein the paddle jacket comprises a top wall and a bottom wall that at least partially defines the inflatable chamber, wherein the top wall and the bottom wall are fused so as to form the seam. 37. The x-ray breast imaging system of claim 36, wherein the inflatable chamber is defined by the top wall, the bottom wall, and the seam. 38. The x-ray breast imaging system of claim 34 wherein the paddle jacket further comprises a clipping member configured to releasably clip the seam to the front wall of the compression paddle. 39. The x-ray breast imaging system of claim 34, further comprising a fluid conduit in fluid flow communication with the inflatable chamber. 40. The x-ray breast imaging system of claim 39, further comprising a fluid control unit releasably coupled with the fluid conduit to selectively supply fluid to the inflatable chamber through the fluid conduit and thereby selectively inflate the inflatable chamber. 41. An x-ray breast imaging system comprising:
a breast platform configured to support a patient's breast for imaging; a compression paddle supported for movement toward the breast platform to compress the breast; a paddle jacket removably secured proximate the underside of the compression paddle, said jacket comprising a first inflatable chamber and a second inflatable chamber; a first fluid conduit that is in fluid flow communication with the first inflatable chamber; a second fluid conduit that is in fluid flow communication with the second inflatable chamber; and a fluid control unit releasably coupled with the first fluid conduit and the second fluid conduit to selectively inflate the first inflatable chamber and the second inflatable chamber to different pressures. 42. The x-ray breast imaging system of claim 41, wherein the paddle jacket comprises a partition disposed between the first inflatable chamber and the second inflatable chamber. 43. The x-ray breast imaging system of claim 41, wherein the compression paddle comprises a front wall configured to be adjacent the patient's chest wall when the patient's breast is supported for imaging, and an underside configured to be adjacent the patient's breast when the patient's breast is supported for imaging. 44. The x-ray breast imaging system of claim 43, wherein the first inflatable chamber is disposed proximate the underside when the patient's breast is supported for imaging. 45. The x-ray breast imaging system of claim 44, wherein the second inflatable chamber is disposed proximate the underside when the patient's breast is supported for imaging. 46. The x-ray breast imaging system of claim 43, wherein the first inflatable chamber is disposed proximate a forward portion of the underside when the patient's breast is supported for imaging. 47. The x-ray breast imaging system of claim 46, wherein the second inflatable chamber is disposed proximate a rearward portion of the compression paddle when the patient's breast is supported for imaging. | 2,800 |
11,739 | 11,739 | 15,903,486 | 2,837 | An improved magnetic switch assembly ( 16 ) has a housing ( 24 ), a first electrode ( 40 ) positioned within the housing ( 24 ), a second electrode ( 42 ), and a magnetically movable component ( 48 ) located within the housing ( 24 ) and shiftable between a first position in simultaneous contact with electrodes ( 40, 42 ), and a second position out of such simultaneous contact. The electrode ( 40 ) has a radially enlarged contact section ( 44, 58 ) adjacent the free end thereof which prevents hangup or sticking of component ( 48 ) in the first position. | 1. A magnetic switch assembly comprising a housing, an elongated first electrode extending into said housing, a second electrode spaced from the first electrode, and a component within said housing shiftable between first and second switch positions depending upon the magnetic condition acting upon said component, said first switch position being when the component is in simultaneous contact with the first and second electrodes, said second switch position being when the component is out of such simultaneous contact, said first electrode having an elongated section with a free end, a cross-sectional area, and a corresponding longitudinal axis, said first electrode further including an enlarged section of greater cross-sectional area proximal to said free end, said enlarged section having a first end adjacent said free end and an opposed second end spaced from said first end and axially spaced from said free end, with a first contact surface extending between said first and second ends, the cross-sectional area of said enlarged section at said second end thereof being greater than the cross-sectional area of said first electrode, said second electrode presenting a second contact surface spaced from said first contact surface, said component, in said first switch position thereof, simultaneously contacting said first and second contact surfaces. 2. The assembly of claim 1, said elongated section of said first electrode being of constant cross-sectional area throughout the length thereof. 3. The assembly of claim 1, said elongated section of said first electrode being cylindrical, and said enlarged section of said first electrode being frustoconical. 4. The assembly of claim 1, the chord between said first and second contact surfaces being transverse to said longitudinal axis. 5. The assembly of claim 4, said chord being perpendicular to said longitudinal axis. 6. The assembly of claim 4, said component, in said first switch position thereof, having portions of the component on opposite sides of said chord. 7. The assembly of claim 1, said longitudinal axis being upright. 8. The assembly of claim 1, said second electrode being a part of said housing. 9. The assembly of claim 1, said second contact surface converging toward said first contact surface. 10. The assembly of claim 1, said component, in said first switch position thereof, having portions of the component on opposite sides of said second end of said enlarged section. | An improved magnetic switch assembly ( 16 ) has a housing ( 24 ), a first electrode ( 40 ) positioned within the housing ( 24 ), a second electrode ( 42 ), and a magnetically movable component ( 48 ) located within the housing ( 24 ) and shiftable between a first position in simultaneous contact with electrodes ( 40, 42 ), and a second position out of such simultaneous contact. The electrode ( 40 ) has a radially enlarged contact section ( 44, 58 ) adjacent the free end thereof which prevents hangup or sticking of component ( 48 ) in the first position.1. A magnetic switch assembly comprising a housing, an elongated first electrode extending into said housing, a second electrode spaced from the first electrode, and a component within said housing shiftable between first and second switch positions depending upon the magnetic condition acting upon said component, said first switch position being when the component is in simultaneous contact with the first and second electrodes, said second switch position being when the component is out of such simultaneous contact, said first electrode having an elongated section with a free end, a cross-sectional area, and a corresponding longitudinal axis, said first electrode further including an enlarged section of greater cross-sectional area proximal to said free end, said enlarged section having a first end adjacent said free end and an opposed second end spaced from said first end and axially spaced from said free end, with a first contact surface extending between said first and second ends, the cross-sectional area of said enlarged section at said second end thereof being greater than the cross-sectional area of said first electrode, said second electrode presenting a second contact surface spaced from said first contact surface, said component, in said first switch position thereof, simultaneously contacting said first and second contact surfaces. 2. The assembly of claim 1, said elongated section of said first electrode being of constant cross-sectional area throughout the length thereof. 3. The assembly of claim 1, said elongated section of said first electrode being cylindrical, and said enlarged section of said first electrode being frustoconical. 4. The assembly of claim 1, the chord between said first and second contact surfaces being transverse to said longitudinal axis. 5. The assembly of claim 4, said chord being perpendicular to said longitudinal axis. 6. The assembly of claim 4, said component, in said first switch position thereof, having portions of the component on opposite sides of said chord. 7. The assembly of claim 1, said longitudinal axis being upright. 8. The assembly of claim 1, said second electrode being a part of said housing. 9. The assembly of claim 1, said second contact surface converging toward said first contact surface. 10. The assembly of claim 1, said component, in said first switch position thereof, having portions of the component on opposite sides of said second end of said enlarged section. | 2,800 |
11,740 | 11,740 | 15,261,351 | 2,844 | An optical device includes a light source with at least two radiation sources, and at least two layers of wavelength-modifying materials excited by the radiation sources that emit radiation in at least two predetermined wavelengths. Embodiments include a first plurality of n radiation sources configured to emit radiation at a first wavelength. The first plurality of radiation sources are in proximity to a second plurality of m of radiation sources configured to emit radiation at a second wavelength, the second wavelength being shorter than the first wavelength. The ratio between m and n is predetermined. The disclosed optical device also comprises at least two wavelength converting layers such that a first wavelength converting layer is configured to absorb a portion of radiation emitted by the second radiation sources, and a second wavelength converting layer configured to absorb a portion of radiation emitted by the second radiation sources. | 1. A light-emitting system comprising:
at least one first light-emitting source configured to emit a first radiation, said first radiation being blue light having a first wavelength; at least one second light-emitting source configured to emit a second radiation, said second radiation being violet light having a second wavelength shorter than said first wavelength; one or more wavelength-converting materials disposed to absorb at least a portion of said first or second radiations, and configured to emit a converted radiation having one or more wavelengths longer than said first or second wavelengths such that said system emits emitted light comprising a blend of two or more of said first, second and converted radiations; and at least one driving circuit for selectively powering said at least one first and second light-emitting sources to adjust said blend of said emitted light. 2. The system of claim 1, wherein said at least one driving circuit is configured to be controlled to vary power to said at least one first light-emitting source and said at least one second light-emitting source, respectively. 3. The system of claim 1, wherein said at least one driving circuit is configured to selectively brighten, dim, or turn off at least one of said at least one first light-emitting source or said at least one second light-emitting source based on a selected output of said emitted light. 4. The system of claim 1, wherein said at least one driving circuit is configured to vary power to one of said at least one first light-emitting source or said at least one second light-emitting source, while maintaining power to the other of said at least one first light-emitting source or said at least one second light-emitting source. 5. The system of claim 1 wherein said at least one driving circuit is configured to power said at least one first light-emitting source or said at least one second light-emitting source based on a ratio of power being delivered to said at least one first light-emitting source to power being delivered to said at least one second light-emitting source. 6. The system of claim 1, wherein said at least one driving circuit is configured to power said at least one first light-emitting source and said at least one second light-emitting source such that said emitted light has essentially a constant luminance. 7. The system of claim 1, wherein said at least one driving circuit is configured to power said at least one first light-emitting source and said at least one second light-emitting source such that said emitted light has a color rendering index which is maintained above a predetermined value. 8. The system of claim 1, wherein said at least one driving circuit is configured to power said at least one first light-emitting source and said at least one second light-emitting source such that said emitted light has a color rendering index and a luminance which are varied according to predetermined values. 9. The system of claim 1, wherein said at least one driving circuit is configured to power, selectively, said at least one first light-emitting source and said at least one second light-emitting source at predetermined times. 10. The system of claim 1 wherein said emitted light comprises a blend of only said first and converted radiations or a blend of only said second and converted radiations. 11. The system of claim 1 wherein said wavelength-converting material is disposed in patterned shapes. 12. The system of claim 11, further comprising more than one patterned shapes, wherein said patterned shapes are optically isolated from each other. 13. The system of claim 12, where said optical isolation is provided by optical elements. 14. The system of claim 13, wherein said optical elements are reflective elements disposed between said patterned shapes. 15. The system of claim 1, wherein said wavelength-converting materials include a first material substantially emitting light in a range of about 500 nm to about 600 nm and a second material substantially emitting light in a range of about 600 nm to about 700 nm. 16. The system of claim 15, wherein said at least one first light-emitting source comprises a plurality of said first light-emitting sources, or said at least one second light-emitting source comprises a plurality of second light-emitting sources, said first and second light-emitting sources being configured with said first and second materials in at least one of a first pattern or a second pattern, in said first pattern, a first portion of said first light-emitting sources is patterned with said first material and a second portion of said first light-emitting sources is patterned with said second material, said first and second portions being different, and, in said second pattern, a third portion of said second light-emitting sources is patterned with said first material and a fourth portion of said second light-emitting sources is patterned with said second material, said third and fourth portions being different. 17. The system of claim 1 further comprising at least one third light-emitting source configured to emit light having a third wavelength within a range of about 600 nm to 660 nm. 18. The system of claim 1, wherein said at least one first light-emitting source has a wavelength of 430 nm to about 490; and wherein said at least one second light-emitting source has a wavelength of greater than 405 nm. 19. The system of claim 1, further comprising an optical element configured to suppress a fraction of said emitted light in a predetermined wavelength range. 20. The system of claim 19, wherein said optical element is one or more of a light-absorbing element, a light-reflecting element, or a wavelength-converting element. 21. The system of claim 19, wherein said optical element is positioned to selectively suppress a fraction of said emitted light. 22. A light-emitting system comprising:
at least one blue light-emitting source; at least one violet light-emitting source; one or more phosphors to absorb at least a portion of light from at least one of said blue or violet light-emitting sources, and emit light of one or more different wavelengths; and one or more drivers for selectively driving said at least one blue and violet light-emitting sources, said one or more drivers being configured to brighten or dim said at least one blue light-emitting source relative to said at least one violet light-emitting source, or to turn off said at least one blue light-emitting source while powering said at least one violet light-emitting source. 23. The system of claim 22, wherein said blue light-emitting source has a wavelength of 420 nm to about 490; and wherein said violet light-emitting source has a wavelength of 380 nm to about 430 nm. 24. A method of using a light-emitting device, said device comprising at least one blue light-emitting source, at least one violet light-emitting source, one or more phosphors to absorb at least a portion of light from at least one of said blue or violet light-emitting sources and emit light of one or more different wavelengths, and one or more drivers for selectively driving a first electrical power into said blue light-emitting source, and a second electrical power into said violet light-emitting sources, said method comprising:
selectively driving said blue and said violet light-emitting sources during a first period according to a first ratio of said first power to said second power; and selectively driving said blue and said violet light-emitting source during a second period according to a second ratio of said first power to said second power; wherein said first ratio is larger than said second ratio. 25. The method of claim 24, wherein said device emits essentially white light during said first and second periods. 26. The method of claim 24, wherein selectively driving said blue and said violet light-emitting sources during said second period comprises decreasing said first power relative to said second power to obtain said second ratio. 27. The method of claim 26, wherein said second power remains essentially the same for said first and second ratios. 28. A method of varying light output using a light-emitting device, said device comprising at least one blue light-emitting source, at least one violet light-emitting source, one or more phosphors, said device emitting light having an emitted spectral power distribution (SPD), said method comprising:
operating said light-emitting device during a first period such that a first fraction of said SPD is in a wavelength range of about 430 nm to 490 nm; and operating said light-emitting device during a second period such that a second fraction of said SPD is in said wavelength range, wherein said second fraction is less than said first fraction. 29. The method of claim 28, wherein said light-emitting device comprises one or more drivers for selectively driving said blue and violet light-emitting sources, and wherein operating said light-emitting device during said second period comprises diming said at least one blue emitting source relative to said at least one violet light-emitting source, or turning off said at least one blue light-emitting source while powering said at least one violet light-emitting source. 30. The method of claim 28, wherein said light-emitting device further comprises an optical element configured to suppress a fraction of said first wavelength, and wherein operating said light-emitting device during said second period comprises using said optical element to block a portion of said first wavelength. | An optical device includes a light source with at least two radiation sources, and at least two layers of wavelength-modifying materials excited by the radiation sources that emit radiation in at least two predetermined wavelengths. Embodiments include a first plurality of n radiation sources configured to emit radiation at a first wavelength. The first plurality of radiation sources are in proximity to a second plurality of m of radiation sources configured to emit radiation at a second wavelength, the second wavelength being shorter than the first wavelength. The ratio between m and n is predetermined. The disclosed optical device also comprises at least two wavelength converting layers such that a first wavelength converting layer is configured to absorb a portion of radiation emitted by the second radiation sources, and a second wavelength converting layer configured to absorb a portion of radiation emitted by the second radiation sources.1. A light-emitting system comprising:
at least one first light-emitting source configured to emit a first radiation, said first radiation being blue light having a first wavelength; at least one second light-emitting source configured to emit a second radiation, said second radiation being violet light having a second wavelength shorter than said first wavelength; one or more wavelength-converting materials disposed to absorb at least a portion of said first or second radiations, and configured to emit a converted radiation having one or more wavelengths longer than said first or second wavelengths such that said system emits emitted light comprising a blend of two or more of said first, second and converted radiations; and at least one driving circuit for selectively powering said at least one first and second light-emitting sources to adjust said blend of said emitted light. 2. The system of claim 1, wherein said at least one driving circuit is configured to be controlled to vary power to said at least one first light-emitting source and said at least one second light-emitting source, respectively. 3. The system of claim 1, wherein said at least one driving circuit is configured to selectively brighten, dim, or turn off at least one of said at least one first light-emitting source or said at least one second light-emitting source based on a selected output of said emitted light. 4. The system of claim 1, wherein said at least one driving circuit is configured to vary power to one of said at least one first light-emitting source or said at least one second light-emitting source, while maintaining power to the other of said at least one first light-emitting source or said at least one second light-emitting source. 5. The system of claim 1 wherein said at least one driving circuit is configured to power said at least one first light-emitting source or said at least one second light-emitting source based on a ratio of power being delivered to said at least one first light-emitting source to power being delivered to said at least one second light-emitting source. 6. The system of claim 1, wherein said at least one driving circuit is configured to power said at least one first light-emitting source and said at least one second light-emitting source such that said emitted light has essentially a constant luminance. 7. The system of claim 1, wherein said at least one driving circuit is configured to power said at least one first light-emitting source and said at least one second light-emitting source such that said emitted light has a color rendering index which is maintained above a predetermined value. 8. The system of claim 1, wherein said at least one driving circuit is configured to power said at least one first light-emitting source and said at least one second light-emitting source such that said emitted light has a color rendering index and a luminance which are varied according to predetermined values. 9. The system of claim 1, wherein said at least one driving circuit is configured to power, selectively, said at least one first light-emitting source and said at least one second light-emitting source at predetermined times. 10. The system of claim 1 wherein said emitted light comprises a blend of only said first and converted radiations or a blend of only said second and converted radiations. 11. The system of claim 1 wherein said wavelength-converting material is disposed in patterned shapes. 12. The system of claim 11, further comprising more than one patterned shapes, wherein said patterned shapes are optically isolated from each other. 13. The system of claim 12, where said optical isolation is provided by optical elements. 14. The system of claim 13, wherein said optical elements are reflective elements disposed between said patterned shapes. 15. The system of claim 1, wherein said wavelength-converting materials include a first material substantially emitting light in a range of about 500 nm to about 600 nm and a second material substantially emitting light in a range of about 600 nm to about 700 nm. 16. The system of claim 15, wherein said at least one first light-emitting source comprises a plurality of said first light-emitting sources, or said at least one second light-emitting source comprises a plurality of second light-emitting sources, said first and second light-emitting sources being configured with said first and second materials in at least one of a first pattern or a second pattern, in said first pattern, a first portion of said first light-emitting sources is patterned with said first material and a second portion of said first light-emitting sources is patterned with said second material, said first and second portions being different, and, in said second pattern, a third portion of said second light-emitting sources is patterned with said first material and a fourth portion of said second light-emitting sources is patterned with said second material, said third and fourth portions being different. 17. The system of claim 1 further comprising at least one third light-emitting source configured to emit light having a third wavelength within a range of about 600 nm to 660 nm. 18. The system of claim 1, wherein said at least one first light-emitting source has a wavelength of 430 nm to about 490; and wherein said at least one second light-emitting source has a wavelength of greater than 405 nm. 19. The system of claim 1, further comprising an optical element configured to suppress a fraction of said emitted light in a predetermined wavelength range. 20. The system of claim 19, wherein said optical element is one or more of a light-absorbing element, a light-reflecting element, or a wavelength-converting element. 21. The system of claim 19, wherein said optical element is positioned to selectively suppress a fraction of said emitted light. 22. A light-emitting system comprising:
at least one blue light-emitting source; at least one violet light-emitting source; one or more phosphors to absorb at least a portion of light from at least one of said blue or violet light-emitting sources, and emit light of one or more different wavelengths; and one or more drivers for selectively driving said at least one blue and violet light-emitting sources, said one or more drivers being configured to brighten or dim said at least one blue light-emitting source relative to said at least one violet light-emitting source, or to turn off said at least one blue light-emitting source while powering said at least one violet light-emitting source. 23. The system of claim 22, wherein said blue light-emitting source has a wavelength of 420 nm to about 490; and wherein said violet light-emitting source has a wavelength of 380 nm to about 430 nm. 24. A method of using a light-emitting device, said device comprising at least one blue light-emitting source, at least one violet light-emitting source, one or more phosphors to absorb at least a portion of light from at least one of said blue or violet light-emitting sources and emit light of one or more different wavelengths, and one or more drivers for selectively driving a first electrical power into said blue light-emitting source, and a second electrical power into said violet light-emitting sources, said method comprising:
selectively driving said blue and said violet light-emitting sources during a first period according to a first ratio of said first power to said second power; and selectively driving said blue and said violet light-emitting source during a second period according to a second ratio of said first power to said second power; wherein said first ratio is larger than said second ratio. 25. The method of claim 24, wherein said device emits essentially white light during said first and second periods. 26. The method of claim 24, wherein selectively driving said blue and said violet light-emitting sources during said second period comprises decreasing said first power relative to said second power to obtain said second ratio. 27. The method of claim 26, wherein said second power remains essentially the same for said first and second ratios. 28. A method of varying light output using a light-emitting device, said device comprising at least one blue light-emitting source, at least one violet light-emitting source, one or more phosphors, said device emitting light having an emitted spectral power distribution (SPD), said method comprising:
operating said light-emitting device during a first period such that a first fraction of said SPD is in a wavelength range of about 430 nm to 490 nm; and operating said light-emitting device during a second period such that a second fraction of said SPD is in said wavelength range, wherein said second fraction is less than said first fraction. 29. The method of claim 28, wherein said light-emitting device comprises one or more drivers for selectively driving said blue and violet light-emitting sources, and wherein operating said light-emitting device during said second period comprises diming said at least one blue emitting source relative to said at least one violet light-emitting source, or turning off said at least one blue light-emitting source while powering said at least one violet light-emitting source. 30. The method of claim 28, wherein said light-emitting device further comprises an optical element configured to suppress a fraction of said first wavelength, and wherein operating said light-emitting device during said second period comprises using said optical element to block a portion of said first wavelength. | 2,800 |
11,741 | 11,741 | 14,787,069 | 2,855 | An optical computing device and method for determining and/or monitoring temperature and temperature variation data in real-time by deriving the data from the output of an optical element. | 1. A method utilizing an optical computing device to determine temperature of a sample, the method comprising:
deploying an optical computing device into an environment, the optical computing device comprising an optical element and a detector; optically interacting electromagnetic radiation with a sample to produce sample-interacted light; optically interacting the optical element with the sample-interacted light to generate optically-interacted light which corresponds to a characteristic of the sample; generating a signal that corresponds to the optically-interacted light through utilization of the detector; and determining a temperature of the sample using the signal. 2. A method as defined in claim 1, wherein the environment is a wellbore. 3. A method as defined in claim 1, wherein the optical element is an Integrated Computational Element. 4. A method as defined in claim 1, wherein the temperature of the sample is determined in real-time. 5. A method as defined in claim 1, further comprising generating the electromagnetic radiation using an electromagnetic radiation source. 6. A method as defined in claim 1, wherein the electromagnetic radiation emanates from the sample. 7. A method as defined in claim 1, wherein determining the temperature of the sample is achieved using a signal processor communicably coupled to the detector. 8. A method as defined in claim 1, wherein deploying the optical computing device further comprises deploying the optical computing device as part of a downhole tool or casing extending along a wellbore. 9. A method as defined in claim 1, further comprising generating an alert signal in response to the temperature of the sample. 10. An optical computing device to determine temperature of a sample, comprising:
electromagnetic radiation that optically interacts with a sample to produce sample-interacted light; a first optical element that optically interacts with the sample-interacted light to produce optically-interacted light which corresponds to a characteristic of the sample; and a detector positioned to measure the optically-interacted light and thereby generate a signal utilized to determine a temperature of the sample. 11. An optical computing device as defined in claim 10, wherein the sample is at least one of a wellbore fluid, downhole tool or rock formation. 12. An optical computing device as defined in claim 10, further comprising an electromagnetic radiation source that generates the electromagnetic radiation. 13. An optical computing device as defined in claim 10, wherein the electromagnetic radiation is radiation emanating from the sample. 14. An optical computing device as defined in claim 10, further comprising a signal processor communicably coupled to the detector to computationally determine the temperature of the sample in real-time. 15. An optical computing device as defined in claim 10, wherein the optical element is an Integrated Computational Element. 16. An optical computing device as defined in claim 10, wherein the characteristic of the sample is at least one of a C1 hydrocarbon, C2 hydrocarbon, C3 hydrocarbon or C4 hydrocarbon. 17. An optical computing device as defined in claim 10, wherein the optical computing device comprises part of a downhole tool or casing extending along a wellbore. 18. A method utilizing an optical computing device to determine temperature of a sample, the method comprising:
deploying an optical computing device into an environment; and determining a temperature of the sample present within the environment using the optical computing device. 19. A method as defined in claim 18, wherein the environment is a wellbore. 20. A method as defined in claim 18, wherein the optical element is an Integrated Computational Element. | An optical computing device and method for determining and/or monitoring temperature and temperature variation data in real-time by deriving the data from the output of an optical element.1. A method utilizing an optical computing device to determine temperature of a sample, the method comprising:
deploying an optical computing device into an environment, the optical computing device comprising an optical element and a detector; optically interacting electromagnetic radiation with a sample to produce sample-interacted light; optically interacting the optical element with the sample-interacted light to generate optically-interacted light which corresponds to a characteristic of the sample; generating a signal that corresponds to the optically-interacted light through utilization of the detector; and determining a temperature of the sample using the signal. 2. A method as defined in claim 1, wherein the environment is a wellbore. 3. A method as defined in claim 1, wherein the optical element is an Integrated Computational Element. 4. A method as defined in claim 1, wherein the temperature of the sample is determined in real-time. 5. A method as defined in claim 1, further comprising generating the electromagnetic radiation using an electromagnetic radiation source. 6. A method as defined in claim 1, wherein the electromagnetic radiation emanates from the sample. 7. A method as defined in claim 1, wherein determining the temperature of the sample is achieved using a signal processor communicably coupled to the detector. 8. A method as defined in claim 1, wherein deploying the optical computing device further comprises deploying the optical computing device as part of a downhole tool or casing extending along a wellbore. 9. A method as defined in claim 1, further comprising generating an alert signal in response to the temperature of the sample. 10. An optical computing device to determine temperature of a sample, comprising:
electromagnetic radiation that optically interacts with a sample to produce sample-interacted light; a first optical element that optically interacts with the sample-interacted light to produce optically-interacted light which corresponds to a characteristic of the sample; and a detector positioned to measure the optically-interacted light and thereby generate a signal utilized to determine a temperature of the sample. 11. An optical computing device as defined in claim 10, wherein the sample is at least one of a wellbore fluid, downhole tool or rock formation. 12. An optical computing device as defined in claim 10, further comprising an electromagnetic radiation source that generates the electromagnetic radiation. 13. An optical computing device as defined in claim 10, wherein the electromagnetic radiation is radiation emanating from the sample. 14. An optical computing device as defined in claim 10, further comprising a signal processor communicably coupled to the detector to computationally determine the temperature of the sample in real-time. 15. An optical computing device as defined in claim 10, wherein the optical element is an Integrated Computational Element. 16. An optical computing device as defined in claim 10, wherein the characteristic of the sample is at least one of a C1 hydrocarbon, C2 hydrocarbon, C3 hydrocarbon or C4 hydrocarbon. 17. An optical computing device as defined in claim 10, wherein the optical computing device comprises part of a downhole tool or casing extending along a wellbore. 18. A method utilizing an optical computing device to determine temperature of a sample, the method comprising:
deploying an optical computing device into an environment; and determining a temperature of the sample present within the environment using the optical computing device. 19. A method as defined in claim 18, wherein the environment is a wellbore. 20. A method as defined in claim 18, wherein the optical element is an Integrated Computational Element. | 2,800 |
11,742 | 11,742 | 15,954,353 | 2,899 | A semiconductor device has an interposer including a plurality of conductive vias formed through the interposer. A first semiconductor die is disposed over the interposer. A second semiconductor die is disposed over a first substrate. The first semiconductor die and second semiconductor die are power semiconductor devices. The interposer is disposed over the second semiconductor die opposite the first substrate. A second substrate is disposed over the first semiconductor die opposite the interposer. The first substrate and second substrate provide heat dissipation from the first semiconductor die and second semiconductor die from opposite sides of the semiconductor device. A plurality of first and second interconnect pads is formed in a pattern over the first semiconductor die and second semiconductor die. The second interconnect pads have a different area than the first interconnect pads to aid with alignment when stacking the assembly. | 1. A semiconductor device, comprising:
a substrate; a plurality of first interconnect pads formed over a surface of the substrate; and a plurality of second interconnect pads formed over the surface of the substrate, wherein the second interconnect pads have an area different from an area of the first interconnect pads, and the first interconnect pads and second interconnect pads are electrically common and arranged in an identifiable pattern for alignment. 2. The semiconductor device of claim 1, wherein the identifiable pattern includes rows of the first interconnect pads. 3. The semiconductor device of claim 1, wherein the identifiable pattern includes alternating offset ones of the first interconnect pads. 4. The semiconductor device of claim 1, wherein the identifiable pattern includes the first interconnect pads interposed between the second interconnect pads. 5. The semiconductor device of claim 1, further including a transistor formed within the substrate. 6. The semiconductor device of claim 1, further includes a plurality of bumps formed over the first interconnect pads and second interconnect pads. 7. A semiconductor device, comprising:
a substrate; and a plurality of interconnect pads formed in an identifiable pattern over a surface of the substrate, wherein first ones of the interconnect pads have an area different from an area of second ones of the interconnect pads. 8. The semiconductor device of claim 7, wherein the interconnect pads are electrically common. 9. The semiconductor device of claim 7, wherein the identifiable pattern includes rows of the interconnect pads. 10. The semiconductor device of claim 7, wherein the identifiable pattern includes alternating offset ones of the interconnect pads. 11. The semiconductor device of claim 7, wherein the identifiable pattern includes the first ones of the interconnect pads interposed between the second ones of the interconnect pads. 12. The semiconductor device of claim 7, further including a transistor formed within the substrate. 13. The semiconductor device of claim 7, further includes a plurality of bumps formed over the interconnect pads. 14. A method of making a semiconductor device, comprising:
providing a substrate; forming a plurality of first interconnect pads over a surface of the substrate; and forming a plurality of second interconnect pads over the surface of the substrate, wherein the second interconnect pads have an area different from an area of the first interconnect pads, and the first interconnect pads and second interconnect pads are arranged in an identifiable pattern. 15. The method of claim 14, wherein the first interconnect pads and second interconnect pads are electrically common. 16. The method of claim 14, wherein the identifiable pattern includes rows of the first interconnect pads. 17. The method of claim 14, wherein the identifiable pattern includes alternating offset ones of the first interconnect pads. 18. The method of claim 14, wherein the identifiable pattern includes the first interconnect pads interposed between the second interconnect pads. 19. The method of claim 14, further including forming a transistor within the substrate. 20. The method of claim 14, further includes forming a plurality of bumps over the first interconnect pads and second interconnect pads. | A semiconductor device has an interposer including a plurality of conductive vias formed through the interposer. A first semiconductor die is disposed over the interposer. A second semiconductor die is disposed over a first substrate. The first semiconductor die and second semiconductor die are power semiconductor devices. The interposer is disposed over the second semiconductor die opposite the first substrate. A second substrate is disposed over the first semiconductor die opposite the interposer. The first substrate and second substrate provide heat dissipation from the first semiconductor die and second semiconductor die from opposite sides of the semiconductor device. A plurality of first and second interconnect pads is formed in a pattern over the first semiconductor die and second semiconductor die. The second interconnect pads have a different area than the first interconnect pads to aid with alignment when stacking the assembly.1. A semiconductor device, comprising:
a substrate; a plurality of first interconnect pads formed over a surface of the substrate; and a plurality of second interconnect pads formed over the surface of the substrate, wherein the second interconnect pads have an area different from an area of the first interconnect pads, and the first interconnect pads and second interconnect pads are electrically common and arranged in an identifiable pattern for alignment. 2. The semiconductor device of claim 1, wherein the identifiable pattern includes rows of the first interconnect pads. 3. The semiconductor device of claim 1, wherein the identifiable pattern includes alternating offset ones of the first interconnect pads. 4. The semiconductor device of claim 1, wherein the identifiable pattern includes the first interconnect pads interposed between the second interconnect pads. 5. The semiconductor device of claim 1, further including a transistor formed within the substrate. 6. The semiconductor device of claim 1, further includes a plurality of bumps formed over the first interconnect pads and second interconnect pads. 7. A semiconductor device, comprising:
a substrate; and a plurality of interconnect pads formed in an identifiable pattern over a surface of the substrate, wherein first ones of the interconnect pads have an area different from an area of second ones of the interconnect pads. 8. The semiconductor device of claim 7, wherein the interconnect pads are electrically common. 9. The semiconductor device of claim 7, wherein the identifiable pattern includes rows of the interconnect pads. 10. The semiconductor device of claim 7, wherein the identifiable pattern includes alternating offset ones of the interconnect pads. 11. The semiconductor device of claim 7, wherein the identifiable pattern includes the first ones of the interconnect pads interposed between the second ones of the interconnect pads. 12. The semiconductor device of claim 7, further including a transistor formed within the substrate. 13. The semiconductor device of claim 7, further includes a plurality of bumps formed over the interconnect pads. 14. A method of making a semiconductor device, comprising:
providing a substrate; forming a plurality of first interconnect pads over a surface of the substrate; and forming a plurality of second interconnect pads over the surface of the substrate, wherein the second interconnect pads have an area different from an area of the first interconnect pads, and the first interconnect pads and second interconnect pads are arranged in an identifiable pattern. 15. The method of claim 14, wherein the first interconnect pads and second interconnect pads are electrically common. 16. The method of claim 14, wherein the identifiable pattern includes rows of the first interconnect pads. 17. The method of claim 14, wherein the identifiable pattern includes alternating offset ones of the first interconnect pads. 18. The method of claim 14, wherein the identifiable pattern includes the first interconnect pads interposed between the second interconnect pads. 19. The method of claim 14, further including forming a transistor within the substrate. 20. The method of claim 14, further includes forming a plurality of bumps over the first interconnect pads and second interconnect pads. | 2,800 |
11,743 | 11,743 | 15,492,041 | 2,852 | A toner detection device includes sensor cases, optical sensors, a cleaning member, a motor, and a control unit. The sensor cases include detection surfaces and are placed on wall surfaces of a hopper container. The optical sensors are housed in the sensor cases and detect presence or absence of toner at a specified elevation through the detection surfaces. The cleaning member slides and rubs on the detection surfaces. The motor moves the cleaning member. In case where the cleaning member is to be stopped, the control unit controls the motor so as to stop the cleaning member in a region in which the cleaning member does not come into contact with the detection surfaces. | 1. A powder detection device comprising:
a sensor case that is provided on a wall surface of a powder container which contains powder and that includes a transparent detection surface which is placed so as to face inward in the powder container; an optical sensor that is housed in the sensor case and that detects presence or absence of the powder at an elevation at which the optical sensor is placed, through the detection surface; a cleaning member that slides and rubs on an outer surface of the detection surface; a drive unit that moves the cleaning member; and a control unit that controls the drive unit so as to stop the cleaning member in a region in which the cleaning member does not come into contact with the detection surface, in case where the cleaning member is to be stopped. 2. The powder detection device according to claim 1, wherein
the sensor case further includes a step surface that adjoins the detection surface with a step portion between and that is placed at a position more distant from the cleaning member than the detection surface, and the cleaning member includes a flexible member that slides and rubs on the detection surface and a support member that supports the flexible member, and the cleaning member is configured to move in a moving region including a region facing the detection surface and a region facing the step surface. 3. The powder detection device according to claim 2, wherein the flexible member is made to avoid coming into contact with surfaces the flexible member can face, while the cleaning member is stopped. 4. The powder detection device according to claim 1, wherein the control unit samples output values from the optical sensor at uniform intervals while the cleaning member is moving, and the control unit determines that the powder is contained up to the elevation in the powder container on condition that a sampling count for the output value indicating a light interception state among a specified count of sampling is equal to or greater than a specified threshold. 5. The powder detection device according to claim 1, wherein the control unit samples output values from the optical sensor at uniform intervals while the cleaning member is moving, and the control unit stops the cleaning member after a specified time has elapsed since a transition from a light interception period in which a light path of the optical sensor is intercepted to a transmissive period in which the light path of the optical sensor is transmissive in case where the cleaning member is to be stopped. 6. The powder detection device according to claim 5, wherein the control unit determines that the transition from the light interception period to the transmissive period has been made, on condition that the output value indicating a light interception state is consecutively sampled a plurality of times and that the output value indicating a transmissive state is thereafter consecutively sampled a plurality of times. 7. A toner replenishment device, wherein
the powder is toner, the toner replenishment device includes the powder detection device according to claim 1 and the powder container, and the powder container includes a receiving port which receives supply of the toner from a toner cartridge detachably attached to the powder container and a discharge port through which the toner supplied from the toner cartridge is discharged toward a development tank to be replenished with the toner after the toner is temporarily stored. | A toner detection device includes sensor cases, optical sensors, a cleaning member, a motor, and a control unit. The sensor cases include detection surfaces and are placed on wall surfaces of a hopper container. The optical sensors are housed in the sensor cases and detect presence or absence of toner at a specified elevation through the detection surfaces. The cleaning member slides and rubs on the detection surfaces. The motor moves the cleaning member. In case where the cleaning member is to be stopped, the control unit controls the motor so as to stop the cleaning member in a region in which the cleaning member does not come into contact with the detection surfaces.1. A powder detection device comprising:
a sensor case that is provided on a wall surface of a powder container which contains powder and that includes a transparent detection surface which is placed so as to face inward in the powder container; an optical sensor that is housed in the sensor case and that detects presence or absence of the powder at an elevation at which the optical sensor is placed, through the detection surface; a cleaning member that slides and rubs on an outer surface of the detection surface; a drive unit that moves the cleaning member; and a control unit that controls the drive unit so as to stop the cleaning member in a region in which the cleaning member does not come into contact with the detection surface, in case where the cleaning member is to be stopped. 2. The powder detection device according to claim 1, wherein
the sensor case further includes a step surface that adjoins the detection surface with a step portion between and that is placed at a position more distant from the cleaning member than the detection surface, and the cleaning member includes a flexible member that slides and rubs on the detection surface and a support member that supports the flexible member, and the cleaning member is configured to move in a moving region including a region facing the detection surface and a region facing the step surface. 3. The powder detection device according to claim 2, wherein the flexible member is made to avoid coming into contact with surfaces the flexible member can face, while the cleaning member is stopped. 4. The powder detection device according to claim 1, wherein the control unit samples output values from the optical sensor at uniform intervals while the cleaning member is moving, and the control unit determines that the powder is contained up to the elevation in the powder container on condition that a sampling count for the output value indicating a light interception state among a specified count of sampling is equal to or greater than a specified threshold. 5. The powder detection device according to claim 1, wherein the control unit samples output values from the optical sensor at uniform intervals while the cleaning member is moving, and the control unit stops the cleaning member after a specified time has elapsed since a transition from a light interception period in which a light path of the optical sensor is intercepted to a transmissive period in which the light path of the optical sensor is transmissive in case where the cleaning member is to be stopped. 6. The powder detection device according to claim 5, wherein the control unit determines that the transition from the light interception period to the transmissive period has been made, on condition that the output value indicating a light interception state is consecutively sampled a plurality of times and that the output value indicating a transmissive state is thereafter consecutively sampled a plurality of times. 7. A toner replenishment device, wherein
the powder is toner, the toner replenishment device includes the powder detection device according to claim 1 and the powder container, and the powder container includes a receiving port which receives supply of the toner from a toner cartridge detachably attached to the powder container and a discharge port through which the toner supplied from the toner cartridge is discharged toward a development tank to be replenished with the toner after the toner is temporarily stored. | 2,800 |
11,744 | 11,744 | 14,031,877 | 2,864 | A method for predicting a pressure window for drilling a borehole in a formation includes: obtaining a pore pressure related data value of the formation using a data acquisition tool; predicting pore pressure uncertainty from the pore pressure related data value of the formation using a processor; estimating uncertainty of a pressure window for drilling fluid using the predicted pore pressure uncertainty using a processor; and applying the estimated uncertainty to the pressure window to provide a modified pressure window using a processor. | 1. A method for predicting a pressure window for drilling a borehole in a formation, the method comprising:
obtaining a pore pressure related data value of the formation using a data acquisition tool; predicting pore pressure uncertainty from the pore pressure related data value of the formation using a processor; estimating uncertainty of a pressure window for drilling fluid using the predicted pore pressure uncertainty using a processor; and applying the estimated uncertainty to the pressure window to provide a modified pressure window using a processor. 2. The method according to claim 1, further comprising defining an operating margin and applying the operating margin to the modified pressure window to provide an operating pressure window using a processor. 3. The method according to claim 2, further comprising monitoring at least one equivalent of drilling fluid pressure and determining if the monitored drilling fluid pressure equivalent is within equivalents of an upper bound and a lower bound of the operating pressure window. 4. The method according to claim 2, further comprising:
defining a drilling parameter for drilling a borehole in the formation within the operating pressure window using a processor; and drilling into the formation using a drilling tool and the operating pressure window for the drilling fluid. 5. The method according to claim 4, wherein the drilling parameter comprises at least one of a drilling fluid density, a drilling fluid flow rate, an equivalent circulating drilling fluid density, an equivalent static drilling fluid density, and a standpipe pressure. 6. The method according to claim 1, further comprising determining at least one pore pressure related trendline using the pore pressure related data value and extrapolating the at least one pore pressure related trendline. 7. The method according to claim 6, wherein the pore pressure related value is obtained from a pore pressure related log acquired by the data acquisition tool. 8. The method according to claim 6, wherein the formation comprises a normal compaction zone and an overpressure zone below the normal compaction zone and method further comprises determining the at least one pore pressure related trendline from data from the normal compaction zone and extrapolating the at least one pore pressure related trendline into the overpressure zone. 9. The method according to claim 6, wherein the pore pressure uncertainty accounts for at least one selection from a group consisting of instrument error, equipment calibration error, statistical error of measurement apparatus or method, regression error of trendlines when the trendline comprises a plurality of trendlines, and variation of trendlines when the trendline comprises a plurality of trendlines. 10. The method according to claim 9, further comprising identifying a correlation between pore pressure uncertainty and the uncertainty of the pore pressure related data value using data from at least two previously drilled boreholes and wherein calculating the pore pressure uncertainty further comprises using the uncertainty of the pore pressure related data value and the correlation. 11. The method according to claim 6, further comprising deriving a representative pore pressure related trendline from the at least one pore pressure related trendline. 12. The method according to claim 6, wherein the at least one pore pressure related trendline comprises a plurality of pore pressure related trendlines and the method further comprising determining an upper bound line having an upper bound line slope and a lower bound line having a lower bound line slope, wherein the upper bound line slope is less than a slope of the plurality of pore pressure related trendlines and the slope of the plurality of pore pressure related trendlines is less than the lower bound line slope, the upper bound line indicating positive uncertainty with respect to the pore pressure related trendline and the lower bound line indicating negative uncertainty with respect to the pore pressure related trendline. 13. The method according to claim 12, wherein the upper bound line is a function of an uncertainty of the plurality of pore pressure trendlines and the lower bound line is a function of an uncertainty of the plurality of pore pressure trendlines. 14. The method according to claim 6, wherein the at least one pore pressure related trendline comprises a plurality of pore pressure related trendlines and the method further comprising determining an upper bound line having an upper bound line slope and a lower bound line having a lower bound line slope, wherein the upper bound line is a pore pressure related trendline in the plurality of pore pressure related trendlines having a minimum slope and the lower bound line is a pore pressure line in the plurality of pore pressure related trendlines having a maximum slope. 15. The method according to claim 1, wherein calculating pore pressure uncertainty in the overpressure zone comprises calculating a Q-factor by solving:
Q
=
z
(
Δ
R
N
*
)
,
where d/dz is the derivative of ΔR*N with depth z, and
ΔR*N=log10 R N u−log10 R N l
represents the difference between the upper (RN u) and lower (RN l) bounds at depth z that envelope an estimate of a pore pressure related value. 16. The method according to claim 15, wherein Q=constant value q. 17. The method according to claim 1, wherein the pressure window is defined at least in part by a fracture gradient, a pore pressure gradient, and a collapse gradient and the pore pressure uncertainty affects at least partly one of the fracture gradient and the collapse gradient. 18. An apparatus for predicting a pore pressure window for drilling a borehole in a formation, the apparatus comprising:
a data acquisition tool configured to perform formation measurements related to pore pressure of the formation at a plurality of depths in the borehole; and a processor in communication with the downhole tool and configured to implement a method comprising at least one of the steps:
obtaining a pore pressure related data value of the formation from the data acquisition tool;
predicting pore pressure uncertainty from the pore pressure related data value of the formation;
estimating uncertainty of a pressure window for drilling fluid using the predicted pore pressure uncertainty; and
applying the estimated uncertainty to the pressure window to provide a modified pressure window. 19. The apparatus according to claim 18, wherein the processor is further configured to:
define an operating margin and apply the operating margin to the modified pressure window to provide an operating pressure window; and define a drilling parameter for drilling a borehole in the formation within the operating pressure window. 20. The apparatus according to claim 19, further comprising a drilling tool configured to drill the borehole within the operating pressure window. 21. The apparatus according to claim 19, further comprising a controller configured to control a drilling fluid pump or a drilling fluid control valve to maintain drilling fluid pressure equivalent within the operating pressure window. 22. The apparatus according to claim 19, further comprising a controller configured to control a drilling fluid flow control valve to maintain drilling fluid pressure within the operating pressure window. 23. The apparatus according to claim 19, further comprising a drilling fluid sensor configured to sense a drilling fluid parameter and to provide input to a controller configured to provide an output to maintain drilling fluid pressure within the operating pressure window. 24. The apparatus according to claim 18, wherein the data acquisition tool comprises a downhole tool comprising at least one of a gamma ray tool, a resistivity tool, a dielectric permittivity tool, a density tool, a neutron porosity tool, a pulsed neutron tool, a nuclear magnetic resonance tool, and an acoustic tool. 25. The apparatus according to claim 18, wherein the data acquisition tool is configured to acquire formation data at the surface of the formation. | A method for predicting a pressure window for drilling a borehole in a formation includes: obtaining a pore pressure related data value of the formation using a data acquisition tool; predicting pore pressure uncertainty from the pore pressure related data value of the formation using a processor; estimating uncertainty of a pressure window for drilling fluid using the predicted pore pressure uncertainty using a processor; and applying the estimated uncertainty to the pressure window to provide a modified pressure window using a processor.1. A method for predicting a pressure window for drilling a borehole in a formation, the method comprising:
obtaining a pore pressure related data value of the formation using a data acquisition tool; predicting pore pressure uncertainty from the pore pressure related data value of the formation using a processor; estimating uncertainty of a pressure window for drilling fluid using the predicted pore pressure uncertainty using a processor; and applying the estimated uncertainty to the pressure window to provide a modified pressure window using a processor. 2. The method according to claim 1, further comprising defining an operating margin and applying the operating margin to the modified pressure window to provide an operating pressure window using a processor. 3. The method according to claim 2, further comprising monitoring at least one equivalent of drilling fluid pressure and determining if the monitored drilling fluid pressure equivalent is within equivalents of an upper bound and a lower bound of the operating pressure window. 4. The method according to claim 2, further comprising:
defining a drilling parameter for drilling a borehole in the formation within the operating pressure window using a processor; and drilling into the formation using a drilling tool and the operating pressure window for the drilling fluid. 5. The method according to claim 4, wherein the drilling parameter comprises at least one of a drilling fluid density, a drilling fluid flow rate, an equivalent circulating drilling fluid density, an equivalent static drilling fluid density, and a standpipe pressure. 6. The method according to claim 1, further comprising determining at least one pore pressure related trendline using the pore pressure related data value and extrapolating the at least one pore pressure related trendline. 7. The method according to claim 6, wherein the pore pressure related value is obtained from a pore pressure related log acquired by the data acquisition tool. 8. The method according to claim 6, wherein the formation comprises a normal compaction zone and an overpressure zone below the normal compaction zone and method further comprises determining the at least one pore pressure related trendline from data from the normal compaction zone and extrapolating the at least one pore pressure related trendline into the overpressure zone. 9. The method according to claim 6, wherein the pore pressure uncertainty accounts for at least one selection from a group consisting of instrument error, equipment calibration error, statistical error of measurement apparatus or method, regression error of trendlines when the trendline comprises a plurality of trendlines, and variation of trendlines when the trendline comprises a plurality of trendlines. 10. The method according to claim 9, further comprising identifying a correlation between pore pressure uncertainty and the uncertainty of the pore pressure related data value using data from at least two previously drilled boreholes and wherein calculating the pore pressure uncertainty further comprises using the uncertainty of the pore pressure related data value and the correlation. 11. The method according to claim 6, further comprising deriving a representative pore pressure related trendline from the at least one pore pressure related trendline. 12. The method according to claim 6, wherein the at least one pore pressure related trendline comprises a plurality of pore pressure related trendlines and the method further comprising determining an upper bound line having an upper bound line slope and a lower bound line having a lower bound line slope, wherein the upper bound line slope is less than a slope of the plurality of pore pressure related trendlines and the slope of the plurality of pore pressure related trendlines is less than the lower bound line slope, the upper bound line indicating positive uncertainty with respect to the pore pressure related trendline and the lower bound line indicating negative uncertainty with respect to the pore pressure related trendline. 13. The method according to claim 12, wherein the upper bound line is a function of an uncertainty of the plurality of pore pressure trendlines and the lower bound line is a function of an uncertainty of the plurality of pore pressure trendlines. 14. The method according to claim 6, wherein the at least one pore pressure related trendline comprises a plurality of pore pressure related trendlines and the method further comprising determining an upper bound line having an upper bound line slope and a lower bound line having a lower bound line slope, wherein the upper bound line is a pore pressure related trendline in the plurality of pore pressure related trendlines having a minimum slope and the lower bound line is a pore pressure line in the plurality of pore pressure related trendlines having a maximum slope. 15. The method according to claim 1, wherein calculating pore pressure uncertainty in the overpressure zone comprises calculating a Q-factor by solving:
Q
=
z
(
Δ
R
N
*
)
,
where d/dz is the derivative of ΔR*N with depth z, and
ΔR*N=log10 R N u−log10 R N l
represents the difference between the upper (RN u) and lower (RN l) bounds at depth z that envelope an estimate of a pore pressure related value. 16. The method according to claim 15, wherein Q=constant value q. 17. The method according to claim 1, wherein the pressure window is defined at least in part by a fracture gradient, a pore pressure gradient, and a collapse gradient and the pore pressure uncertainty affects at least partly one of the fracture gradient and the collapse gradient. 18. An apparatus for predicting a pore pressure window for drilling a borehole in a formation, the apparatus comprising:
a data acquisition tool configured to perform formation measurements related to pore pressure of the formation at a plurality of depths in the borehole; and a processor in communication with the downhole tool and configured to implement a method comprising at least one of the steps:
obtaining a pore pressure related data value of the formation from the data acquisition tool;
predicting pore pressure uncertainty from the pore pressure related data value of the formation;
estimating uncertainty of a pressure window for drilling fluid using the predicted pore pressure uncertainty; and
applying the estimated uncertainty to the pressure window to provide a modified pressure window. 19. The apparatus according to claim 18, wherein the processor is further configured to:
define an operating margin and apply the operating margin to the modified pressure window to provide an operating pressure window; and define a drilling parameter for drilling a borehole in the formation within the operating pressure window. 20. The apparatus according to claim 19, further comprising a drilling tool configured to drill the borehole within the operating pressure window. 21. The apparatus according to claim 19, further comprising a controller configured to control a drilling fluid pump or a drilling fluid control valve to maintain drilling fluid pressure equivalent within the operating pressure window. 22. The apparatus according to claim 19, further comprising a controller configured to control a drilling fluid flow control valve to maintain drilling fluid pressure within the operating pressure window. 23. The apparatus according to claim 19, further comprising a drilling fluid sensor configured to sense a drilling fluid parameter and to provide input to a controller configured to provide an output to maintain drilling fluid pressure within the operating pressure window. 24. The apparatus according to claim 18, wherein the data acquisition tool comprises a downhole tool comprising at least one of a gamma ray tool, a resistivity tool, a dielectric permittivity tool, a density tool, a neutron porosity tool, a pulsed neutron tool, a nuclear magnetic resonance tool, and an acoustic tool. 25. The apparatus according to claim 18, wherein the data acquisition tool is configured to acquire formation data at the surface of the formation. | 2,800 |
11,745 | 11,745 | 15,912,241 | 2,839 | In described examples, a circuit includes a first, a second, and a third resonant power converter. Each of the first, second, and third resonant power converters includes a respective periodic signal generator, a respective resonant network, and a respective rectifier. Each periodic signal generator is coupled to receive a direct-current (DC) power input and a respective phase signal. Each resonant network is coupled to receive a sinusoidal output current from the respective periodic signal generator. Each rectifier is coupled to receive a sinusoidal output current from the respective resonant network. The circuit further includes a current summer coupled to receive a rectified current from each respective rectifier. | 1. A circuit, comprising:
a first resonant power converters; a second resonant power converters; a third resonant power converter; and a current summer coupled to receive a first rectified current from the first resonant power converter, a second rectified current from the second resonant power converter, and a third rectified current from the third resonant power converter; wherein the first, second, and third power converters each include a first diode, a second diode, a first capacitor, and a second capacitor arranged in a voltage doubler configuration. 2. The circuit of claim 21, wherein the current summer is connected to an output of the first rectifier, an output of the second rectifier, and an output of the third rectifier. 3. The circuit of claim 21, wherein a first alternating-current (AC) component of the first sinusoidal output current, a second AC component of the second sinusoidal output current, and a third AC component of the third sinusoidal output current are mutually reduced by the current summer. 4. The circuit of claim 21, wherein the first phase signal indicates a phase difference of 120 degrees from a phase indicated by the second phase signal and a phase difference of 240 degrees from a phase indicated by the third phase signal. 5. (canceled) 6. The circuit of claim 21, further comprising a phase generator for generating the first, second, and third phase signals, wherein the first phase signal indicates a phase difference of 120 degrees from a phase indicated by the second phase signal and a phase difference of 240 degrees from a phase indicated by the third phase signal. 7. The circuit of claim 21, wherein the DC power input is generated by a DC power supply. 8. The circuit of claim 21, further comprising a resistive load for converting a sum of the first, second, and third rectified currents into an output voltage. 9. The circuit of claim 21, comprising a controller for generating the first, second, and third phase signals, wherein the each of the first, second, and third phase signals is separated from one another by a phase interval that is an integer multiple of 60 degrees. 10. A circuit, comprising:
a first resonant power converter, including:
a first periodic signal generator coupled to receive a direct-current (DC) power input and a first phase signal,
a first resonant network coupled to receive a first periodic voltage from the first periodic signal generator wherein the first periodic voltage includes a first voltage for a first time period and a second voltage for a second time period, and
a first rectifier coupled to receive a first sinusoidal output current from the first resonant network;
a second resonant power converter, including:
a second periodic signal generator coupled to receive the DC power input and a second phase signal,
a second resonant network coupled to receive a second periodic voltage from the second periodic signal generator wherein the second periodic voltage includes a first voltage for a first time period and a second voltage for a second time period, and
a second rectifier coupled to receive a second sinusoidal output current from the second resonant network;
a third resonant power converter, including:
a third periodic signal generator coupled to receive the DC power input and a third phase signal,
a third resonant network coupled to receive a third periodic voltage from the third periodic signal generator wherein the third periodic voltage includes a first voltage for a first time period and a second voltage for a second time period, and
a third rectifier coupled to receive a third sinusoidal output current from the third resonant network; and
a current summer coupled to receive a first rectified current from the first rectifier, a second rectified current from the second rectifier, and a third rectified current from the third rectifier wherein the first, second, and third rectifiers each include a first second diode arranged in a voltage doubler configuration. 11. (canceled) 12. A system, comprising:
a controller for generating first, second, and third phase signals; a first resonant power converter, including,
a first periodic signal generator for generating a first periodic voltage in response to a direct-current (DC) power input and the first phase signal wherein the first periodic voltage includes a first voltage for a first time period and a second voltage for a second time period,
a first resonant network for generating a first sinusoidal output current in response to the first periodic voltage, and
a first rectifier for rectifying the first sinusoidal output current to generate a first rectified current;
a second resonant power converter, including,
a second periodic signal generator for generating a second periodic voltage in response to the DC power input and the second phase signal wherein the second periodic voltage includes a first voltage for a first time period and a second voltage for a second time period,
a second resonant network for generating a second sinusoidal output current in response to the second periodic voltage, and
a second rectifier for rectifying the second sinusoidal output current to generate a second rectified current;
a third resonant power converter, including,
a third periodic signal generator for generating a third periodic voltage in response to the DC power input and the third phase signal wherein the third periodic voltage includes a first voltage for a first time period and a second voltage for a second time period,
a third resonant network for generating a third sinusoidal output current in response to the third periodic voltage, and
a third rectifier for rectifying the third sinusoidal output current to generate a third rectified current; and
a current summer for generating a total output current in response to summing the first, second, and third rectified currents; wherein the first, second, and third rectifiers each include a first, a second diode, a first capacitor, and a second capacitor arranged in a voltage doubler configuration. 13. The system of claim 12, wherein the controller is arranged to generate the first, second, and third phase signals, and wherein the first phase signal indicates a phase difference of 120 degrees from a phase indicated by the second phase signal, and wherein the first phase signal indicates a phase difference of 240 degrees from a phase indicated by the third phase signal. 14. The system of claim 12, wherein the controller is arranged to generate fourth, fifth, and sixth phase signals. 15. (canceled) 16. The system of claim 14, further comprising:
a fourth resonant power converter, including:
a fourth periodic signal generator for generating a fourth periodic voltage in response to the DC power input and the fourth phase signal wherein the fourth periodic voltage includes a first voltage for a first time period and a second voltage for a second time period,
a fourth resonant network for generating a fourth sinusoidal output current in response to the fourth periodic voltage, and
a fourth rectifier for rectifying the fourth sinusoidal output current to generate a fourth rectified current;
a fifth resonant power converter, including:
a fifth periodic signal generator for generating a fifth periodic voltage in response to the DC power input and the fifth phase signal wherein the fifth periodic voltage includes a first voltage for a first time period and a second voltage for a second time period,
a fifth resonant network for generating a fifth sinusoidal output current in response to the fifth periodic voltage, and
a fifth rectifier for rectifying the fifth sinusoidal output current to generate a fifth rectified current; and
a sixth resonant power converter, including:
a sixth periodic signal generator for generating a sixth periodic voltage in response to the DC power input and the sixth phase signal wherein the sixth periodic voltage includes a first voltage for a first time period and a second voltage for a second time period,
a sixth resonant network for generating a sixth sinusoidal output current in response to the sixth periodic voltage, and
a sixth rectifier for rectifying the sixth sinusoidal output current to generate a sixth rectified current,
wherein the current summer is arranged to generate the total output current in response to summing the first, second, third, fourth, fifth, and sixth rectified currents. 17. A method comprising:
generating a first periodic voltage in response to a direct-current (DC) power input and a first phase signal wherein the first periodic voltage includes a first voltage for a first time period and a second voltage for a second time period; generating a first sinusoidal output current in response to the first periodic voltage; rectifying the first sinusoidal output current to generate a first rectified current; generating a second periodic voltage in response to the DC power input and a second phase signal wherein the second periodic voltage includes a first voltage for a first time period and a second voltage for a second time period; generating a second sinusoidal output current in response to the second periodic voltage; rectifying the second sinusoidal output current to generate a second rectified current; generating a third periodic voltage in response to the DC power input and a third phase signal wherein the third periodic voltage includes a first voltage for a first time period and a second voltage for a second time period; generating a third sinusoidal output current in response to the third periodic voltage; rectifying the third sinusoidal output current to generate a third rectified current; generating a total output current in response to summing the first, second, and third rectified currents; and doubling an output voltage derived from the total output current using a voltage doubler circuit. 18. The method of claim 17, comprising generating the first, second, and third phase signals. 19. The method of claim 18, wherein the first, second, and third phase signals are generated to differ in phase from one another by 120 degrees. 20. (canceled) 21. The circuit of claim 1,
wherein the first resonant power converter, includes:
a first periodic signal generator coupled to receive a direct-current (DC) power input and a first phase signal,
a first resonant network coupled to receive a first periodic voltage from the first periodic signal generator wherein the first periodic voltage includes a first voltage for a first time period and a second voltage for a second time period, and
a first rectifier coupled to receive a first sinusoidal output current from the first resonant network;
wherein the second resonant power converter includes:
a second periodic signal generator coupled to receive the DC power input and a second phase signal,
a second resonant network coupled to receive a second periodic voltage from the second periodic signal generator wherein the second periodic voltage includes a first voltage for a first time period and a second voltage for a second time period, and
a second rectifier coupled to receive a second sinusoidal output current from the second resonant network;
wherein the third resonant power converter includes:
a third periodic signal generator coupled to receive the DC power input and a third phase signal,
a third resonant network coupled to receive a third periodic voltage from the third periodic signal generator wherein the third periodic voltage includes a first voltage for a first time period and a second voltage for a second time period, and
a third rectifier coupled to receive a third sinusoidal output current from the third resonant network; and
wherein the current summer is coupled to receive the first rectified current from the first rectifier, the second rectified current from the second rectifier, and the third rectified current from the third rectifier. 22. The circuit of claim 10, wherein the current summer is connected to an output of the first rectifier, an output of the second rectifier, and an output of the third rectifier. 23. The circuit of claim 10, wherein the DC power input is generated by a DC power supply. 24. The circuit of claim 7, wherein the DC power supply includes:
a first terminal connected to the first, second, and third periodic signal generators, and a second terminal directly connected to capacitors of the first, second, and third resonant networks. | In described examples, a circuit includes a first, a second, and a third resonant power converter. Each of the first, second, and third resonant power converters includes a respective periodic signal generator, a respective resonant network, and a respective rectifier. Each periodic signal generator is coupled to receive a direct-current (DC) power input and a respective phase signal. Each resonant network is coupled to receive a sinusoidal output current from the respective periodic signal generator. Each rectifier is coupled to receive a sinusoidal output current from the respective resonant network. The circuit further includes a current summer coupled to receive a rectified current from each respective rectifier.1. A circuit, comprising:
a first resonant power converters; a second resonant power converters; a third resonant power converter; and a current summer coupled to receive a first rectified current from the first resonant power converter, a second rectified current from the second resonant power converter, and a third rectified current from the third resonant power converter; wherein the first, second, and third power converters each include a first diode, a second diode, a first capacitor, and a second capacitor arranged in a voltage doubler configuration. 2. The circuit of claim 21, wherein the current summer is connected to an output of the first rectifier, an output of the second rectifier, and an output of the third rectifier. 3. The circuit of claim 21, wherein a first alternating-current (AC) component of the first sinusoidal output current, a second AC component of the second sinusoidal output current, and a third AC component of the third sinusoidal output current are mutually reduced by the current summer. 4. The circuit of claim 21, wherein the first phase signal indicates a phase difference of 120 degrees from a phase indicated by the second phase signal and a phase difference of 240 degrees from a phase indicated by the third phase signal. 5. (canceled) 6. The circuit of claim 21, further comprising a phase generator for generating the first, second, and third phase signals, wherein the first phase signal indicates a phase difference of 120 degrees from a phase indicated by the second phase signal and a phase difference of 240 degrees from a phase indicated by the third phase signal. 7. The circuit of claim 21, wherein the DC power input is generated by a DC power supply. 8. The circuit of claim 21, further comprising a resistive load for converting a sum of the first, second, and third rectified currents into an output voltage. 9. The circuit of claim 21, comprising a controller for generating the first, second, and third phase signals, wherein the each of the first, second, and third phase signals is separated from one another by a phase interval that is an integer multiple of 60 degrees. 10. A circuit, comprising:
a first resonant power converter, including:
a first periodic signal generator coupled to receive a direct-current (DC) power input and a first phase signal,
a first resonant network coupled to receive a first periodic voltage from the first periodic signal generator wherein the first periodic voltage includes a first voltage for a first time period and a second voltage for a second time period, and
a first rectifier coupled to receive a first sinusoidal output current from the first resonant network;
a second resonant power converter, including:
a second periodic signal generator coupled to receive the DC power input and a second phase signal,
a second resonant network coupled to receive a second periodic voltage from the second periodic signal generator wherein the second periodic voltage includes a first voltage for a first time period and a second voltage for a second time period, and
a second rectifier coupled to receive a second sinusoidal output current from the second resonant network;
a third resonant power converter, including:
a third periodic signal generator coupled to receive the DC power input and a third phase signal,
a third resonant network coupled to receive a third periodic voltage from the third periodic signal generator wherein the third periodic voltage includes a first voltage for a first time period and a second voltage for a second time period, and
a third rectifier coupled to receive a third sinusoidal output current from the third resonant network; and
a current summer coupled to receive a first rectified current from the first rectifier, a second rectified current from the second rectifier, and a third rectified current from the third rectifier wherein the first, second, and third rectifiers each include a first second diode arranged in a voltage doubler configuration. 11. (canceled) 12. A system, comprising:
a controller for generating first, second, and third phase signals; a first resonant power converter, including,
a first periodic signal generator for generating a first periodic voltage in response to a direct-current (DC) power input and the first phase signal wherein the first periodic voltage includes a first voltage for a first time period and a second voltage for a second time period,
a first resonant network for generating a first sinusoidal output current in response to the first periodic voltage, and
a first rectifier for rectifying the first sinusoidal output current to generate a first rectified current;
a second resonant power converter, including,
a second periodic signal generator for generating a second periodic voltage in response to the DC power input and the second phase signal wherein the second periodic voltage includes a first voltage for a first time period and a second voltage for a second time period,
a second resonant network for generating a second sinusoidal output current in response to the second periodic voltage, and
a second rectifier for rectifying the second sinusoidal output current to generate a second rectified current;
a third resonant power converter, including,
a third periodic signal generator for generating a third periodic voltage in response to the DC power input and the third phase signal wherein the third periodic voltage includes a first voltage for a first time period and a second voltage for a second time period,
a third resonant network for generating a third sinusoidal output current in response to the third periodic voltage, and
a third rectifier for rectifying the third sinusoidal output current to generate a third rectified current; and
a current summer for generating a total output current in response to summing the first, second, and third rectified currents; wherein the first, second, and third rectifiers each include a first, a second diode, a first capacitor, and a second capacitor arranged in a voltage doubler configuration. 13. The system of claim 12, wherein the controller is arranged to generate the first, second, and third phase signals, and wherein the first phase signal indicates a phase difference of 120 degrees from a phase indicated by the second phase signal, and wherein the first phase signal indicates a phase difference of 240 degrees from a phase indicated by the third phase signal. 14. The system of claim 12, wherein the controller is arranged to generate fourth, fifth, and sixth phase signals. 15. (canceled) 16. The system of claim 14, further comprising:
a fourth resonant power converter, including:
a fourth periodic signal generator for generating a fourth periodic voltage in response to the DC power input and the fourth phase signal wherein the fourth periodic voltage includes a first voltage for a first time period and a second voltage for a second time period,
a fourth resonant network for generating a fourth sinusoidal output current in response to the fourth periodic voltage, and
a fourth rectifier for rectifying the fourth sinusoidal output current to generate a fourth rectified current;
a fifth resonant power converter, including:
a fifth periodic signal generator for generating a fifth periodic voltage in response to the DC power input and the fifth phase signal wherein the fifth periodic voltage includes a first voltage for a first time period and a second voltage for a second time period,
a fifth resonant network for generating a fifth sinusoidal output current in response to the fifth periodic voltage, and
a fifth rectifier for rectifying the fifth sinusoidal output current to generate a fifth rectified current; and
a sixth resonant power converter, including:
a sixth periodic signal generator for generating a sixth periodic voltage in response to the DC power input and the sixth phase signal wherein the sixth periodic voltage includes a first voltage for a first time period and a second voltage for a second time period,
a sixth resonant network for generating a sixth sinusoidal output current in response to the sixth periodic voltage, and
a sixth rectifier for rectifying the sixth sinusoidal output current to generate a sixth rectified current,
wherein the current summer is arranged to generate the total output current in response to summing the first, second, third, fourth, fifth, and sixth rectified currents. 17. A method comprising:
generating a first periodic voltage in response to a direct-current (DC) power input and a first phase signal wherein the first periodic voltage includes a first voltage for a first time period and a second voltage for a second time period; generating a first sinusoidal output current in response to the first periodic voltage; rectifying the first sinusoidal output current to generate a first rectified current; generating a second periodic voltage in response to the DC power input and a second phase signal wherein the second periodic voltage includes a first voltage for a first time period and a second voltage for a second time period; generating a second sinusoidal output current in response to the second periodic voltage; rectifying the second sinusoidal output current to generate a second rectified current; generating a third periodic voltage in response to the DC power input and a third phase signal wherein the third periodic voltage includes a first voltage for a first time period and a second voltage for a second time period; generating a third sinusoidal output current in response to the third periodic voltage; rectifying the third sinusoidal output current to generate a third rectified current; generating a total output current in response to summing the first, second, and third rectified currents; and doubling an output voltage derived from the total output current using a voltage doubler circuit. 18. The method of claim 17, comprising generating the first, second, and third phase signals. 19. The method of claim 18, wherein the first, second, and third phase signals are generated to differ in phase from one another by 120 degrees. 20. (canceled) 21. The circuit of claim 1,
wherein the first resonant power converter, includes:
a first periodic signal generator coupled to receive a direct-current (DC) power input and a first phase signal,
a first resonant network coupled to receive a first periodic voltage from the first periodic signal generator wherein the first periodic voltage includes a first voltage for a first time period and a second voltage for a second time period, and
a first rectifier coupled to receive a first sinusoidal output current from the first resonant network;
wherein the second resonant power converter includes:
a second periodic signal generator coupled to receive the DC power input and a second phase signal,
a second resonant network coupled to receive a second periodic voltage from the second periodic signal generator wherein the second periodic voltage includes a first voltage for a first time period and a second voltage for a second time period, and
a second rectifier coupled to receive a second sinusoidal output current from the second resonant network;
wherein the third resonant power converter includes:
a third periodic signal generator coupled to receive the DC power input and a third phase signal,
a third resonant network coupled to receive a third periodic voltage from the third periodic signal generator wherein the third periodic voltage includes a first voltage for a first time period and a second voltage for a second time period, and
a third rectifier coupled to receive a third sinusoidal output current from the third resonant network; and
wherein the current summer is coupled to receive the first rectified current from the first rectifier, the second rectified current from the second rectifier, and the third rectified current from the third rectifier. 22. The circuit of claim 10, wherein the current summer is connected to an output of the first rectifier, an output of the second rectifier, and an output of the third rectifier. 23. The circuit of claim 10, wherein the DC power input is generated by a DC power supply. 24. The circuit of claim 7, wherein the DC power supply includes:
a first terminal connected to the first, second, and third periodic signal generators, and a second terminal directly connected to capacitors of the first, second, and third resonant networks. | 2,800 |
11,746 | 11,746 | 15,926,312 | 2,848 | In a described example, an electrical apparatus includes a substrate having a first surface and lead pads on the first surface of the substrate for surface mounting components. A ribbon wire bond is provided having open ends and a central portion between the open ends, the open ends of the ribbon wire bond connected to the lead pads. An electrical component is bonded to the central portion of the ribbon wire bond. The central portion of the ribbon wire bond and the electrical component are spaced from the first surface of the substrate. | 1. An electrical apparatus, comprising:
a substrate having a first surface; lead pads on the first surface of the substrate; a ribbon wire bond having open ends connected to the lead pads and at least one central portion between the open ends; and an electrical component bonded to the at least one central portion of the ribbon wire bond, wherein the at least one central portion of the ribbon wire bond and the electrical component are spaced from the first surface of the substrate. 2. The electrical apparatus of claim 1 wherein the ribbon wire bond is a U-shaped ribbon wire bond having legs at the open ends with ends of the legs bent parallel to the lead pads on the substrate, the legs extending from the open ends to the central portion and the central portion of the U-shaped ribbon wire bond straightened and parallel to the ends of the legs. 3. The electrical apparatus of claim 1 wherein the ribbon wire bond is U-shaped ribbon wire bond with legs at open ends of the U-shaped ribbon wire bond and having ends of the legs bent perpendicular to the first surface and extending into a surface of the lead pads, and the legs extending from the open ends to the central portion, the central portion of the U-shaped ribbon wire bond perpendicular to the ends of the legs. 4. The electrical apparatus of claim 1 wherein the ribbon wire bond is a W-shaped ribbon wire bond with ends of legs at an open end bent parallel to the lead pads on the substrate, and with central portions on points of the W of the W-shaped ribbon wire bond parallel to the ends of the legs. 5. The electrical apparatus of claim 1 wherein the ribbon wire bond is a W-shaped ribbon wire bond with ends of legs at the open ends of the W-shaped ribbon wire bond bent perpendicular to the first surface of the substrate and inserted into a surface of the lead pads, and with points of the W of the W-shaped ribbon wire bond flattened to form central portions that are perpendicular to the ends of the legs. 6. The electrical apparatus of claim 1 wherein the electrical component mounted on the ribbon wire bond is an inductor. 7. The electrical apparatus of claim 1 wherein the electrical component mounted on the ribbon wire bond is a transformer. 8. The electrical apparatus of claim 1 wherein the electrical component mounted on the ribbon wire bond is a bulk acoustic wave device. 9. The electrical apparatus of claim 1, wherein the substrate is a printed circuit board (PCB). 10. The electrical apparatus of claim 9 wherein the electrical component mounted on the ribbon wire bond is a sub printed circuit board (sub-PCB) with one or more electrical components mounted on it. 11. The electrical apparatus of claim 1 wherein the substrate is a lead frame. 12. A method for making an electrical apparatus, comprising:
making a ribbon wire bond with a shape that is one selected from a group consisting essentially of a U-shape and a W-shape, the ribbon wire bond having at least one central portion between open ends; soldering the open ends of the ribbon wire bond to lead pads on a first surface of a substrate; and mounting an electrical component to the at least one central portion of the ribbon wire bond, the electrical component and the at least one central portion spaced from the first surface of the substrate. 13. The method of claim 12 wherein the ribbon wire bond is a U-shaped ribbon wire bond with ends of legs of open ends of the U-shaped ribbon wire bond bent parallel to the lead pads and with the central portion of the U-shaped ribbon wire bond parallel with the ends of the legs. 14. The method of claim 12 wherein the ribbon wire bond is a U-shaped ribbon wire bond with ends of legs of an open end of the U-shaped ribbon wire bond bent perpendicular to the first surface of the substrate and inserted into through-holes in the lead pads. 15. The method of claim 12 wherein the ribbon wire bond is a W-shaped ribbon wire bond with ends of legs of an open end of the W-shaped ribbon wire bond bent parallel to lead pads on a surface of the substrate. 16. The method of claim 12 wherein the ribbon wire bond is a through-hole mount, W-shaped ribbon wire bond with ends of legs of the open ends of the W-shaped ribbon wire bond perpendicular to a surface of the substrate and extending into the surface of the substrate through the lead pads. 17. The method of claim 12 wherein mounting an electrical component further comprises soldering a terminal of the electrical component to the central portion of the ribbon wire bond. 18. A method of making a ribbon wire bond comprising:
opening a stamping die consisting of a first half and a second half configured to bend a wire into a ribbon wire bond; inserting a wire between the first half and second half of the open stamping die; closing the stamping die and bending the wire to form the ribbon wire bond and to detach the ribbon wire bond from the wire; and re-opening the stamping die and removing the ribbon wire bond. 19. The method of claim 18, and further comprising:
making the stamping die to accommodate at least two wires between the first half and second half when the stamping die is opened; inserting at least two bond wires between the first half and second half; closing the stamping die to form at least two ribbon wire bonds and to detach them from the wires; and opening the stamping die and removing at least two ribbon wire bonds. 20. The method of claim 18 wherein the ribbon wire bond is a surface mount ribbon wire bond. 21. The method of claim 18 wherein the ribbon wire bond is a through-hole ribbon wire bond. 22. The method of claim 18 wherein the ribbon wire bond is a U-shaped ribbon wire bond. 23. The method of claim 18 wherein the ribbon wire bond is a W-shaped ribbon wire bond. | In a described example, an electrical apparatus includes a substrate having a first surface and lead pads on the first surface of the substrate for surface mounting components. A ribbon wire bond is provided having open ends and a central portion between the open ends, the open ends of the ribbon wire bond connected to the lead pads. An electrical component is bonded to the central portion of the ribbon wire bond. The central portion of the ribbon wire bond and the electrical component are spaced from the first surface of the substrate.1. An electrical apparatus, comprising:
a substrate having a first surface; lead pads on the first surface of the substrate; a ribbon wire bond having open ends connected to the lead pads and at least one central portion between the open ends; and an electrical component bonded to the at least one central portion of the ribbon wire bond, wherein the at least one central portion of the ribbon wire bond and the electrical component are spaced from the first surface of the substrate. 2. The electrical apparatus of claim 1 wherein the ribbon wire bond is a U-shaped ribbon wire bond having legs at the open ends with ends of the legs bent parallel to the lead pads on the substrate, the legs extending from the open ends to the central portion and the central portion of the U-shaped ribbon wire bond straightened and parallel to the ends of the legs. 3. The electrical apparatus of claim 1 wherein the ribbon wire bond is U-shaped ribbon wire bond with legs at open ends of the U-shaped ribbon wire bond and having ends of the legs bent perpendicular to the first surface and extending into a surface of the lead pads, and the legs extending from the open ends to the central portion, the central portion of the U-shaped ribbon wire bond perpendicular to the ends of the legs. 4. The electrical apparatus of claim 1 wherein the ribbon wire bond is a W-shaped ribbon wire bond with ends of legs at an open end bent parallel to the lead pads on the substrate, and with central portions on points of the W of the W-shaped ribbon wire bond parallel to the ends of the legs. 5. The electrical apparatus of claim 1 wherein the ribbon wire bond is a W-shaped ribbon wire bond with ends of legs at the open ends of the W-shaped ribbon wire bond bent perpendicular to the first surface of the substrate and inserted into a surface of the lead pads, and with points of the W of the W-shaped ribbon wire bond flattened to form central portions that are perpendicular to the ends of the legs. 6. The electrical apparatus of claim 1 wherein the electrical component mounted on the ribbon wire bond is an inductor. 7. The electrical apparatus of claim 1 wherein the electrical component mounted on the ribbon wire bond is a transformer. 8. The electrical apparatus of claim 1 wherein the electrical component mounted on the ribbon wire bond is a bulk acoustic wave device. 9. The electrical apparatus of claim 1, wherein the substrate is a printed circuit board (PCB). 10. The electrical apparatus of claim 9 wherein the electrical component mounted on the ribbon wire bond is a sub printed circuit board (sub-PCB) with one or more electrical components mounted on it. 11. The electrical apparatus of claim 1 wherein the substrate is a lead frame. 12. A method for making an electrical apparatus, comprising:
making a ribbon wire bond with a shape that is one selected from a group consisting essentially of a U-shape and a W-shape, the ribbon wire bond having at least one central portion between open ends; soldering the open ends of the ribbon wire bond to lead pads on a first surface of a substrate; and mounting an electrical component to the at least one central portion of the ribbon wire bond, the electrical component and the at least one central portion spaced from the first surface of the substrate. 13. The method of claim 12 wherein the ribbon wire bond is a U-shaped ribbon wire bond with ends of legs of open ends of the U-shaped ribbon wire bond bent parallel to the lead pads and with the central portion of the U-shaped ribbon wire bond parallel with the ends of the legs. 14. The method of claim 12 wherein the ribbon wire bond is a U-shaped ribbon wire bond with ends of legs of an open end of the U-shaped ribbon wire bond bent perpendicular to the first surface of the substrate and inserted into through-holes in the lead pads. 15. The method of claim 12 wherein the ribbon wire bond is a W-shaped ribbon wire bond with ends of legs of an open end of the W-shaped ribbon wire bond bent parallel to lead pads on a surface of the substrate. 16. The method of claim 12 wherein the ribbon wire bond is a through-hole mount, W-shaped ribbon wire bond with ends of legs of the open ends of the W-shaped ribbon wire bond perpendicular to a surface of the substrate and extending into the surface of the substrate through the lead pads. 17. The method of claim 12 wherein mounting an electrical component further comprises soldering a terminal of the electrical component to the central portion of the ribbon wire bond. 18. A method of making a ribbon wire bond comprising:
opening a stamping die consisting of a first half and a second half configured to bend a wire into a ribbon wire bond; inserting a wire between the first half and second half of the open stamping die; closing the stamping die and bending the wire to form the ribbon wire bond and to detach the ribbon wire bond from the wire; and re-opening the stamping die and removing the ribbon wire bond. 19. The method of claim 18, and further comprising:
making the stamping die to accommodate at least two wires between the first half and second half when the stamping die is opened; inserting at least two bond wires between the first half and second half; closing the stamping die to form at least two ribbon wire bonds and to detach them from the wires; and opening the stamping die and removing at least two ribbon wire bonds. 20. The method of claim 18 wherein the ribbon wire bond is a surface mount ribbon wire bond. 21. The method of claim 18 wherein the ribbon wire bond is a through-hole ribbon wire bond. 22. The method of claim 18 wherein the ribbon wire bond is a U-shaped ribbon wire bond. 23. The method of claim 18 wherein the ribbon wire bond is a W-shaped ribbon wire bond. | 2,800 |
11,747 | 11,747 | 14,952,958 | 2,894 | Contact bumps between a contact pad and a substrate can include a rough surface that can mate with the material of the substrate. The rough surface can enhance the bonding strength of the contacts, for example, against shear and tension forces, especially for flexible systems such as smart cards. | 1. A contact connection, comprising:
a contact pad,
wherein the contact pad comprises a surface;
a contact bump,
wherein the contact bump is coupled to the surface,
wherein the contact bump comprises a rough surface,
wherein the contact bump comprises one or more protuberances arranged along a periphery of the surface. 2. A contact connection as in claim 1,
wherein the rough surface comprises a roughness having a peak-to-valley height greater than 0.01 microns and smaller than 20 microns. 3. A contact connection as in claim 1,
wherein the rough surface comprises a precipitation of a deposited material during a formation of the contact bump. 4. A contact connection as in claim 1,
wherein the rough surface comprises irregularities of a deposited material during a formation of the contact bump. 5. A contact connection as in claim 1,
wherein the one or more protuberances comprise distinct protuberances with overlapping bases around the periphery. 6. A contact connection as in claim 1,
wherein the contact bump further comprises at least one protuberance inside the periphery. 7. A contact connection as in claim 1,
wherein the contact bump is configured to be bonded with a terminal end of an antenna. 8. A contact connection as in claim 1,
wherein the contact bump is formed on a contact pad of an RFID device. 9. A contact connection, comprising:
a first substrate,
wherein the first substrate comprises a surface area;
a second substrate; a contact bump electrically connecting the first substrate and the second substrate,
wherein the contact bump is coupled to the surface area,
wherein the contact bump comprises a rough surface,
wherein the contact bump comprises one or more protuberances arranged along a periphery of the surface area,
wherein the one or more protuberances are at least partially embedded in the second substrate. 10. A contact connection as in claim 9,
wherein the contact bump is formed on the surface area before connecting with the second substrate. 11. A contact connection as in claim 9,
wherein the hardness of the contact bump is higher than the hardness of the second substrate. 12. A contact connection as in claim 9,
wherein the contact bump comprises a structure configured to drive away materials in the second substrate to facilitate a strong surface interaction. 13. A method for forming a contact connection, the method comprising:
placing a contact bump facing a contact pad,
wherein the contact bump comprises a rough surface,
wherein the material of the contact bump has a higher hardness than the material of the contact pad;
applying a force on the contact bump or on the contact pad,
wherein the force comprises a substantially constant component and an oscillatory component. 14. A method as in claim 13,
wherein the contact bump comprises one or more protuberances arranged along a periphery of the surface, wherein the rough surface comprises a roughness having a peak-to-valley height greater than 0.01 microns and smaller than 100 microns. 15. A method as in claim 13, further comprising:
depositing a material on a surface to form the contact bump under deposition conditions for the material to precipitate to form spherical conglomerates of the contact bump. 16. A method as in claim 13,
wherein the substantially constant component comprises a pressing force, wherein the oscillatory component comprises an ultrasonic vibration. 17. A method as in claim 13,
wherein applying a force comprises pressing a vibrational assembly on the contact bump or on the contact pad, wherein the vibrational assembly comprises a vibration in a direction parallel to the pressing force. 18. A method as in claim 17, further comprising:
laser irradiating the vibrational assembly before pressing on the contact bump or on the contact pad. 19. A method as in claim 13, further comprising:
applying a layer of adhesive on a surface of the contact pad or on a surface of the contact bump. 20. A method as in claim 13, further comprising:
applying a layer of adhesive on a surface of the contact pad or on a surface of the contact bump, applying an ultraviolet radiation on the layer of adhesive. | Contact bumps between a contact pad and a substrate can include a rough surface that can mate with the material of the substrate. The rough surface can enhance the bonding strength of the contacts, for example, against shear and tension forces, especially for flexible systems such as smart cards.1. A contact connection, comprising:
a contact pad,
wherein the contact pad comprises a surface;
a contact bump,
wherein the contact bump is coupled to the surface,
wherein the contact bump comprises a rough surface,
wherein the contact bump comprises one or more protuberances arranged along a periphery of the surface. 2. A contact connection as in claim 1,
wherein the rough surface comprises a roughness having a peak-to-valley height greater than 0.01 microns and smaller than 20 microns. 3. A contact connection as in claim 1,
wherein the rough surface comprises a precipitation of a deposited material during a formation of the contact bump. 4. A contact connection as in claim 1,
wherein the rough surface comprises irregularities of a deposited material during a formation of the contact bump. 5. A contact connection as in claim 1,
wherein the one or more protuberances comprise distinct protuberances with overlapping bases around the periphery. 6. A contact connection as in claim 1,
wherein the contact bump further comprises at least one protuberance inside the periphery. 7. A contact connection as in claim 1,
wherein the contact bump is configured to be bonded with a terminal end of an antenna. 8. A contact connection as in claim 1,
wherein the contact bump is formed on a contact pad of an RFID device. 9. A contact connection, comprising:
a first substrate,
wherein the first substrate comprises a surface area;
a second substrate; a contact bump electrically connecting the first substrate and the second substrate,
wherein the contact bump is coupled to the surface area,
wherein the contact bump comprises a rough surface,
wherein the contact bump comprises one or more protuberances arranged along a periphery of the surface area,
wherein the one or more protuberances are at least partially embedded in the second substrate. 10. A contact connection as in claim 9,
wherein the contact bump is formed on the surface area before connecting with the second substrate. 11. A contact connection as in claim 9,
wherein the hardness of the contact bump is higher than the hardness of the second substrate. 12. A contact connection as in claim 9,
wherein the contact bump comprises a structure configured to drive away materials in the second substrate to facilitate a strong surface interaction. 13. A method for forming a contact connection, the method comprising:
placing a contact bump facing a contact pad,
wherein the contact bump comprises a rough surface,
wherein the material of the contact bump has a higher hardness than the material of the contact pad;
applying a force on the contact bump or on the contact pad,
wherein the force comprises a substantially constant component and an oscillatory component. 14. A method as in claim 13,
wherein the contact bump comprises one or more protuberances arranged along a periphery of the surface, wherein the rough surface comprises a roughness having a peak-to-valley height greater than 0.01 microns and smaller than 100 microns. 15. A method as in claim 13, further comprising:
depositing a material on a surface to form the contact bump under deposition conditions for the material to precipitate to form spherical conglomerates of the contact bump. 16. A method as in claim 13,
wherein the substantially constant component comprises a pressing force, wherein the oscillatory component comprises an ultrasonic vibration. 17. A method as in claim 13,
wherein applying a force comprises pressing a vibrational assembly on the contact bump or on the contact pad, wherein the vibrational assembly comprises a vibration in a direction parallel to the pressing force. 18. A method as in claim 17, further comprising:
laser irradiating the vibrational assembly before pressing on the contact bump or on the contact pad. 19. A method as in claim 13, further comprising:
applying a layer of adhesive on a surface of the contact pad or on a surface of the contact bump. 20. A method as in claim 13, further comprising:
applying a layer of adhesive on a surface of the contact pad or on a surface of the contact bump, applying an ultraviolet radiation on the layer of adhesive. | 2,800 |
11,748 | 11,748 | 15,124,616 | 2,872 | A stripe-shaped grid provided on a transparent substrate is made from dielectrics or semiconductors. For each linear segment of the grid, a gap (t) on one side of the linear segment, and an opposite gap (T) on an opposite side of the linear segment materially satisfy the relation t<T in a periodic fashion. The phase of s-polarized light propagating between two linear segments that are adjacent to each other over the narrow gap (t) is delayed by at least π/2 relative to s-polarized light propagating between two linear segments that are adjacent to each other over the wider gap (T). As a result, the former s-polarized light and the latter s-polarized light weaken each other and become attenuated. | 1. A grid polarizer comprising:
a transparent substrate; and a stripe-shaped grid provided on the transparent substrate, the grid including a plurality of linear segments, the grid being made from dielectrics or semiconductors, the grid being having portions that satisfy, in effect, relation of t<T in a periodic fashion, where for each said linear segment of the grid, t represents a first gap between the linear segment concerned and an adjacent linear segment on one side of the linear segment concerned, and T represents a second gap between the linear segment concerned and another adjacent linear segment on an opposite side of the linear segment concerned, a ratio of t/T having a value that causes a phase of a dense part propagating light to delay at least π/2 relative to a phase of a coarse part propagating light, where polarized light that has an electric field component in a length direction of each said linear segment of the grid is s-polarized light, the s-polarized light propagating between two linear segments that are adjacent to each other over the first gap t is the dense part propagating light, and the s-polarized light propagating between two linear segments that are adjacent to each other over the second gap T is the coarse part propagating light. 2. The grid polarizer according to claim 1, wherein the grid includes a plurality of pairs of said linear segments provided on the transparent substrate, with each said pair being constituted by two adjacent said linear segments,
the s-polarized light propagating between the two linear segments of each said pair being the dense part propagating light, and a distance between the two linear segments of each said pair being the first gap t, the s-polarized light propagating between each two adjacent pairs being the coarse part propagating light, and a distance between the each two adjacent pairs being the second gap T, the first gap t being a distance measured at a light exit of the dense part propagating light, and the second gap T being a distance measured at a light exit of the coarse part propagating light. 3. The grid polarizer according to claim 2, wherein the distance between the two linear segments in each said pair gradually decreases in a propagating direction of the dense part propagating light. 4. A photo-alignment apparatus comprising:
a light source; and a grid polarizer according to claim 1, the grid polarizer being disposed between a light irradiation area, where a photo-alignment film is placed, and the light source. 5. The grid polarizer according to claim 2, wherein the distance between the two linear segments in each said pair is constant in a propagating direction of the dense part propagating light. 6. The grid polarizer according to claim 1, wherein the first gap t is from 30 nm to 40 nm. 7. The grid polarizer according to claim 1, wherein the grid is made from titanium oxide, and the transparent substrate is made from silica. 8. The grid polarizer according to claim 1, wherein said plurality of linear segments stand vertically from the transparent substrate. 9. The grid polarizer according to claim 1, wherein said plurality of linear segments stand slant from the transparent substrate. 10. A photo-alignment apparatus comprising:
a light source; and a grid polarizer according to claim 2, the grid polarizer being disposed between a light irradiation area, where a photo-alignment film is placed, and the light source. 11. A photo-alignment apparatus comprising:
a light source; and a grid polarizer according to claim 3, the grid polarizer being disposed between a light irradiation area, where a photo-alignment film is placed, and the light source. 12. A grid polarizer comprising:
a transparent substrate; and a stripe-shaped grid provided on the transparent substrate, the grid being made from dielectrics or semiconductors, the grid including a plurality of linear segments arranged on the transparent substrate at uneven intervals, the uneven intervals being repeated in a periodic fashion, the uneven intervals including at least one first intervals and a second interval, the uneven intervals being decided such that polarized light beam passing between the linear segments arranged at said at least one first interval delays π/2 or more, in terms of phase, relative to polarized light beam passing between the linear segments arranged at the second interval. | A stripe-shaped grid provided on a transparent substrate is made from dielectrics or semiconductors. For each linear segment of the grid, a gap (t) on one side of the linear segment, and an opposite gap (T) on an opposite side of the linear segment materially satisfy the relation t<T in a periodic fashion. The phase of s-polarized light propagating between two linear segments that are adjacent to each other over the narrow gap (t) is delayed by at least π/2 relative to s-polarized light propagating between two linear segments that are adjacent to each other over the wider gap (T). As a result, the former s-polarized light and the latter s-polarized light weaken each other and become attenuated.1. A grid polarizer comprising:
a transparent substrate; and a stripe-shaped grid provided on the transparent substrate, the grid including a plurality of linear segments, the grid being made from dielectrics or semiconductors, the grid being having portions that satisfy, in effect, relation of t<T in a periodic fashion, where for each said linear segment of the grid, t represents a first gap between the linear segment concerned and an adjacent linear segment on one side of the linear segment concerned, and T represents a second gap between the linear segment concerned and another adjacent linear segment on an opposite side of the linear segment concerned, a ratio of t/T having a value that causes a phase of a dense part propagating light to delay at least π/2 relative to a phase of a coarse part propagating light, where polarized light that has an electric field component in a length direction of each said linear segment of the grid is s-polarized light, the s-polarized light propagating between two linear segments that are adjacent to each other over the first gap t is the dense part propagating light, and the s-polarized light propagating between two linear segments that are adjacent to each other over the second gap T is the coarse part propagating light. 2. The grid polarizer according to claim 1, wherein the grid includes a plurality of pairs of said linear segments provided on the transparent substrate, with each said pair being constituted by two adjacent said linear segments,
the s-polarized light propagating between the two linear segments of each said pair being the dense part propagating light, and a distance between the two linear segments of each said pair being the first gap t, the s-polarized light propagating between each two adjacent pairs being the coarse part propagating light, and a distance between the each two adjacent pairs being the second gap T, the first gap t being a distance measured at a light exit of the dense part propagating light, and the second gap T being a distance measured at a light exit of the coarse part propagating light. 3. The grid polarizer according to claim 2, wherein the distance between the two linear segments in each said pair gradually decreases in a propagating direction of the dense part propagating light. 4. A photo-alignment apparatus comprising:
a light source; and a grid polarizer according to claim 1, the grid polarizer being disposed between a light irradiation area, where a photo-alignment film is placed, and the light source. 5. The grid polarizer according to claim 2, wherein the distance between the two linear segments in each said pair is constant in a propagating direction of the dense part propagating light. 6. The grid polarizer according to claim 1, wherein the first gap t is from 30 nm to 40 nm. 7. The grid polarizer according to claim 1, wherein the grid is made from titanium oxide, and the transparent substrate is made from silica. 8. The grid polarizer according to claim 1, wherein said plurality of linear segments stand vertically from the transparent substrate. 9. The grid polarizer according to claim 1, wherein said plurality of linear segments stand slant from the transparent substrate. 10. A photo-alignment apparatus comprising:
a light source; and a grid polarizer according to claim 2, the grid polarizer being disposed between a light irradiation area, where a photo-alignment film is placed, and the light source. 11. A photo-alignment apparatus comprising:
a light source; and a grid polarizer according to claim 3, the grid polarizer being disposed between a light irradiation area, where a photo-alignment film is placed, and the light source. 12. A grid polarizer comprising:
a transparent substrate; and a stripe-shaped grid provided on the transparent substrate, the grid being made from dielectrics or semiconductors, the grid including a plurality of linear segments arranged on the transparent substrate at uneven intervals, the uneven intervals being repeated in a periodic fashion, the uneven intervals including at least one first intervals and a second interval, the uneven intervals being decided such that polarized light beam passing between the linear segments arranged at said at least one first interval delays π/2 or more, in terms of phase, relative to polarized light beam passing between the linear segments arranged at the second interval. | 2,800 |
11,749 | 11,749 | 15,795,586 | 2,881 | An ion source is provided that includes a gas source for supplying a gas, and an ionization chamber defining a longitudinal axis extending therethrough and including an exit aperture along a side wall of the ionization chamber. The ion source also includes one or more extraction electrodes at the exit aperture of the ionization chamber for extracting ions from the ionization chamber in the form of an ion beam. At least one of the extraction electrodes comprises a set of discrete rods forming a plurality of slits in the at least one extraction electrode for enabling at least one of increasing a current of the ion beam or controlling an angle of extraction of the ion beam from the ionization chamber. Each rod in the set of discrete rods is parallel to the longitudinal axis of the ionization chamber. | 1. An ion source comprising:
a gas source for supplying a gas; an ionization chamber defining a longitudinal axis extending therethrough and including an exit aperture along a side wall of the ionization chamber, the ionization chamber adapted to form a plasma from the gas, wherein the plasma generates a plurality of ions; and one or more extraction electrodes at the exit aperture of the ionization chamber for extracting the plurality of ions from the ionization chamber in the form of an ion beam, at least one of the extraction electrodes comprises a set of discrete rods forming a plurality of slits in the at least one extraction electrode for enabling at least one of increasing a current of the ion beam or controlling an angle of extraction of the ion beam from the ionization chamber, wherein each rod in the set of discrete rods is parallel to the longitudinal axis of the ionization chamber. 2. The ion source of claim 1, wherein one end of each rod in the set of discrete rods for the at least one extraction electrode is fixed and another end of each rod in the set of discrete rods is slideable. 3. The ion source of claim 2, wherein a cross section of each of the rods is square. 4. The ion source of claim 3, wherein the one or more extraction electrodes include a plasma electrode. 5. The ion source of claim 4, wherein the cross section of each rod in the set of discrete rods for the plasma electrode is situated at an angle relative to the cross section of each rod in a set of discrete rods for another extraction electrode. 6. The ion source of claim 5, wherein the angle is about 45 degrees. 7. The ion source claim 1, wherein at least one of the one or more extraction electrodes is configured to physically contact a conductive elastic member connected to a vacuum chamber within which the ion source is installed, the conductive elastic member configured to set a voltage of the at least one electrode. 8. The ion source of claim 7, wherein the at least one electrode is a suppression electrode or a puller electrode. 9. The ion source of claim 1, wherein at least one of the one or more extraction electrodes is configured to physically contact a conductive rod connected to a vacuum chamber within which the ion source is installed, the conductive rod configured to set a voltage of the at least one electrode. 10. The ion source of claim 9, wherein the at least one electrode is a suppression electrode or a puller electrode. 11. The ion source of claim 9, wherein a first end of the conductive rod is in physical contact with the at least one electrode and a second end of the conductive rod is in communication with a spring assembly configured to adjust a position of the at least one electrode by imparting a force on the at least one electrode via the conductive rod. 12. The ion source of claim 1, wherein the ion beam is provided to an analyzer magnet comprising a chamber that defines a curved path between a first end and a second end, the ion source located external to the analyzer magnet adjacent to the first end. 13. The ion source of claim 12, wherein the analyzer magnet comprises a mass resolving slit disposed in the chamber and adjacent to the second end. 14. The ion source of claim 13, wherein the analyzer magnet comprises a magnetic focusing lens having at least a portion disposed outside of the chamber, the magnetic focusing lens configured to focus, defocus or wiggle the ion beam in a non-dispersive plane after the ion beam passes through the mass resolving slit. 15. The ion source of claim 14, wherein the magnetic focusing lens comprises an upper zone having a pair of upper magnetic coils and a lower zone having a pair of lower magnetic coils. 16. The ion source of claim 15, wherein the chamber of the analyzer magnet defines a curved central beam axis, and widths of the chamber perpendicular to the curved central beam axis vary along the curved central beam axis such that a width of the first end is larger than a width of the second end. 17. The ion source of claim 16, wherein the magnetic focusing lens is located adjacent to the narrower second end. 18. The ion source of claim 15, wherein at least one of applied current or a magnetic field direction of the pair of upper magnetic coils or the pair of lower magnetic coils is adjustable to provide the focus, defocus or wiggle function. 19. The ion source of claim 16, wherein a second magnetic focusing lens is disposed outside of the chamber of the analyzer magnet adjacent to the first end. 20. The ion source of claim 19, wherein the mass resolving slit is located between the first magnetic focusing lens and the second magnetic focusing lens. 21. The ion source of claim 1, wherein the ionization chamber is elongated and the longitudinal axis extends along an elongated length of the ionization chamber. | An ion source is provided that includes a gas source for supplying a gas, and an ionization chamber defining a longitudinal axis extending therethrough and including an exit aperture along a side wall of the ionization chamber. The ion source also includes one or more extraction electrodes at the exit aperture of the ionization chamber for extracting ions from the ionization chamber in the form of an ion beam. At least one of the extraction electrodes comprises a set of discrete rods forming a plurality of slits in the at least one extraction electrode for enabling at least one of increasing a current of the ion beam or controlling an angle of extraction of the ion beam from the ionization chamber. Each rod in the set of discrete rods is parallel to the longitudinal axis of the ionization chamber.1. An ion source comprising:
a gas source for supplying a gas; an ionization chamber defining a longitudinal axis extending therethrough and including an exit aperture along a side wall of the ionization chamber, the ionization chamber adapted to form a plasma from the gas, wherein the plasma generates a plurality of ions; and one or more extraction electrodes at the exit aperture of the ionization chamber for extracting the plurality of ions from the ionization chamber in the form of an ion beam, at least one of the extraction electrodes comprises a set of discrete rods forming a plurality of slits in the at least one extraction electrode for enabling at least one of increasing a current of the ion beam or controlling an angle of extraction of the ion beam from the ionization chamber, wherein each rod in the set of discrete rods is parallel to the longitudinal axis of the ionization chamber. 2. The ion source of claim 1, wherein one end of each rod in the set of discrete rods for the at least one extraction electrode is fixed and another end of each rod in the set of discrete rods is slideable. 3. The ion source of claim 2, wherein a cross section of each of the rods is square. 4. The ion source of claim 3, wherein the one or more extraction electrodes include a plasma electrode. 5. The ion source of claim 4, wherein the cross section of each rod in the set of discrete rods for the plasma electrode is situated at an angle relative to the cross section of each rod in a set of discrete rods for another extraction electrode. 6. The ion source of claim 5, wherein the angle is about 45 degrees. 7. The ion source claim 1, wherein at least one of the one or more extraction electrodes is configured to physically contact a conductive elastic member connected to a vacuum chamber within which the ion source is installed, the conductive elastic member configured to set a voltage of the at least one electrode. 8. The ion source of claim 7, wherein the at least one electrode is a suppression electrode or a puller electrode. 9. The ion source of claim 1, wherein at least one of the one or more extraction electrodes is configured to physically contact a conductive rod connected to a vacuum chamber within which the ion source is installed, the conductive rod configured to set a voltage of the at least one electrode. 10. The ion source of claim 9, wherein the at least one electrode is a suppression electrode or a puller electrode. 11. The ion source of claim 9, wherein a first end of the conductive rod is in physical contact with the at least one electrode and a second end of the conductive rod is in communication with a spring assembly configured to adjust a position of the at least one electrode by imparting a force on the at least one electrode via the conductive rod. 12. The ion source of claim 1, wherein the ion beam is provided to an analyzer magnet comprising a chamber that defines a curved path between a first end and a second end, the ion source located external to the analyzer magnet adjacent to the first end. 13. The ion source of claim 12, wherein the analyzer magnet comprises a mass resolving slit disposed in the chamber and adjacent to the second end. 14. The ion source of claim 13, wherein the analyzer magnet comprises a magnetic focusing lens having at least a portion disposed outside of the chamber, the magnetic focusing lens configured to focus, defocus or wiggle the ion beam in a non-dispersive plane after the ion beam passes through the mass resolving slit. 15. The ion source of claim 14, wherein the magnetic focusing lens comprises an upper zone having a pair of upper magnetic coils and a lower zone having a pair of lower magnetic coils. 16. The ion source of claim 15, wherein the chamber of the analyzer magnet defines a curved central beam axis, and widths of the chamber perpendicular to the curved central beam axis vary along the curved central beam axis such that a width of the first end is larger than a width of the second end. 17. The ion source of claim 16, wherein the magnetic focusing lens is located adjacent to the narrower second end. 18. The ion source of claim 15, wherein at least one of applied current or a magnetic field direction of the pair of upper magnetic coils or the pair of lower magnetic coils is adjustable to provide the focus, defocus or wiggle function. 19. The ion source of claim 16, wherein a second magnetic focusing lens is disposed outside of the chamber of the analyzer magnet adjacent to the first end. 20. The ion source of claim 19, wherein the mass resolving slit is located between the first magnetic focusing lens and the second magnetic focusing lens. 21. The ion source of claim 1, wherein the ionization chamber is elongated and the longitudinal axis extends along an elongated length of the ionization chamber. | 2,800 |
11,750 | 11,750 | 15,387,044 | 2,841 | An adhesive member is disclosed. The adhesive member includes a first release element, a second release element and a body. The body includes a first adhesive surface and a second adhesive surface. The body also includes a first end face and a second end face. The first end face forms an acute angle with the first release element located on the body. The second end face faces the first end face and forms an obtuse angle with the second release element of the body. | 1. An adhesive member comprising:
a first release element; a second release element; and a body having a first adhesive surface and a second adhesive surface, wherein said body includes
a first end face that forms an acute angle with said first release element; and
a second end face that forms an obtuse angle with said second release element. 2. The adhesive member of claim 1, wherein said first release element is removably attached to said first adhesive surface. 3. The adhesive member of claim 2, wherein said second release element is removably attached to said second adhesive surface. 4. The adhesive member of claim 1, wherein a length along which said first release element projects from the side that said acute angle has been formed relative to said first end face of said body is different from a length along which said second release element projects from the side that said obtuse angle has been formed relative to said second end face of said body. 5. The adhesive member of claim 1, wherein said body is made of thermal rubber for heat dissipation. 6. An electronic device comprising:
a first chassis having a keyboard; and a second chassis connected to said first chassis, wherein said second chassis includes a display and an antenna, wherein said antenna is attached to said chassis via an adhesive body having a first adhesive surface and a second adhesive surface, wherein said adhesive body includes
a first end face that forms an acute angle with said first adhesive surface; and
a second end face that forms an obtuse angle with said second adhesive surface. 7. The electronic device of claim 1, wherein said adhesive body is made of thermal rubber for heat dissipation. | An adhesive member is disclosed. The adhesive member includes a first release element, a second release element and a body. The body includes a first adhesive surface and a second adhesive surface. The body also includes a first end face and a second end face. The first end face forms an acute angle with the first release element located on the body. The second end face faces the first end face and forms an obtuse angle with the second release element of the body.1. An adhesive member comprising:
a first release element; a second release element; and a body having a first adhesive surface and a second adhesive surface, wherein said body includes
a first end face that forms an acute angle with said first release element; and
a second end face that forms an obtuse angle with said second release element. 2. The adhesive member of claim 1, wherein said first release element is removably attached to said first adhesive surface. 3. The adhesive member of claim 2, wherein said second release element is removably attached to said second adhesive surface. 4. The adhesive member of claim 1, wherein a length along which said first release element projects from the side that said acute angle has been formed relative to said first end face of said body is different from a length along which said second release element projects from the side that said obtuse angle has been formed relative to said second end face of said body. 5. The adhesive member of claim 1, wherein said body is made of thermal rubber for heat dissipation. 6. An electronic device comprising:
a first chassis having a keyboard; and a second chassis connected to said first chassis, wherein said second chassis includes a display and an antenna, wherein said antenna is attached to said chassis via an adhesive body having a first adhesive surface and a second adhesive surface, wherein said adhesive body includes
a first end face that forms an acute angle with said first adhesive surface; and
a second end face that forms an obtuse angle with said second adhesive surface. 7. The electronic device of claim 1, wherein said adhesive body is made of thermal rubber for heat dissipation. | 2,800 |
11,751 | 11,751 | 15,692,969 | 2,846 | Control circuitry of a motor drive provides commands for operation of power circuitry based at least in part on signals exchanged with functional circuits, such as for system data and control data, such as feedback of motor or system parameters. The functional circuits may operate at different data rates, with different interrupt intervals, depending upon their capabilities. The control circuitry accommodates all of these flexibly. A physical backplane printed circuit board comprising independent data lines for each functional circuit allows for independent configuration of the data rates, interrupt intervals and communications between the control circuitry and the functional circuits. | 1. A system comprising:
converter circuitry to convert incoming three-phase power to DC power; inverter circuitry to convert the DC power to three-phase controlled frequency AC power to drive a motor; a plurality of functional circuits each configured to carry out a control, monitoring, or feedback operation with respect to a driven motor or load; control circuitry coupled to the inverter circuitry and configured to receive feedback signals, apply control signals to the inverter circuitry for conversion of the DC power to the controlled frequency AC power, and supply variable control events and/or system events to the functional circuits; and a physical backplane providing data communication between the control circuitry and the functional circuits, the physical backplane having separate and independent conductive data lines for each functional circuit, thus allowing data transfer between the control circuitry and each functional circuit at different data transfer rates, wherein the physical backplane comprises a dedicated functional circuit support board configured for data transmission only, and wherein the control circuitry employs one or more different control event intervals and/or system event intervals with each functional circuit. 2. The system of claim 1, wherein the functional circuits comprise first and second functional circuits having respective clock circuits that implement control and/or monitoring events at respective rates different from one another. 3. The system of claim 2, wherein the first and second functional circuits communicate data with the control circuitry at different rates across their respective conductive data lines of the physical backplane. 4. The system of claim 1, wherein the control circuitry comprises a control board that is coupled directly to the backplane. 5. The system of claim 1, wherein functional circuits each comprise a respective circuit board coupled through a respective receptacle to a respective conductive data line on the physical backplane. 6. The system of claim 1, wherein the control circuitry is also coupled to the converter circuitry to control conversion of the incoming three-phase power to DC power. 7. A system comprising:
converter circuitry to convert incoming three-phase power to DC power; inverter circuitry to convert the DC power to three-phase controlled frequency AC power to drive a motor; a plurality of functional circuits each configured to carry out a control, monitoring, or feedback operation with respect to a driven motor or load; control circuitry coupled to the inverter circuitry and configured to receive feedback signals, apply control signals to the inverter circuitry for conversion of the DC power to the controlled frequency AC power, and supply variable control events and/or system events to the functional circuits; and an option bus comprising one or more physical backplanes providing data communication between the control circuitry and the functional circuits, wherein the physical backplanes comprise dedicated functional circuit support boards configured for data transmission only, the physical backplanes having separate and independent conductive data lines for each functional circuit, thus allowing data transfer between the control circuitry and each functional circuit at different data transfer rates and different control event intervals and system event intervals to be employed with each functional circuit. 8. The system of claim 7, wherein the option bus comprises additional device connections beyond the physical backplane. 9. The system of claim 8, wherein the additional device connections connect a human interface module to the control circuitry. 10. The system of claim 7, wherein the functional circuits comprise first and second functional circuits having respective clock circuits that implement control and/or monitoring events at respective rates different from one another. 11. The system of claim 10, wherein the first and second functional circuits communicate data with the control circuitry at different rates across their respective conductive data lines of the physical backplane. 12. The system of claim 7, wherein the control circuitry chooses the clock rates, and thus data transfer rates, for each respective functional circuit based on the optimal performance for each respective functional circuit. 13. The system of claim 7, wherein the control circuitry comprises a control board that is coupled directly to the backplane. 14. The system of claim 7, wherein functional circuits each comprise a respective circuit board coupled through a respective receptacle to a respective conductive data line on the physical backplane. 15. The system of claim 7, wherein the control circuitry is also coupled to the converter circuitry to control conversion of the incoming three-phase power to DC power. 16. A method comprising:
converting incoming three-phase power to DC power using converter circuitry; inverting the DC power to three-phase controlled frequency AC power to drive a motor using inverter circuitry; controlling the inverting circuitry via control circuitry; and carrying out control, monitoring, or feedback operations using a plurality of functional circuits coupled to the control circuitry via a physical backplane, comprising a dedicated functional circuit support board configured for data transmission only, having separate and independent conductive data lines for each functional circuit, thus allowing data transfer between the control circuitry and each functional circuit at different data transfer rates and different control event intervals and system event intervals to be employed with each functional circuit. 17. The method of claim 16, wherein the control circuitry comprises a control board that is coupled directly to the backplane. 18. The method of claim 16, wherein functional circuits each comprise a respective circuit board coupled through a respective receptacle to a respective conductive data line on the physical backplane. 19. The method of claim 16, wherein the control circuitry is also coupled to the converter circuitry to control conversion of the incoming three-phase power to DC power. 20. The method of claim 16, wherein the control circuitry chooses the clock rates, and thus data transfer rates, for each respective functional circuit based on the optimal performance for each respective functional circuit. | Control circuitry of a motor drive provides commands for operation of power circuitry based at least in part on signals exchanged with functional circuits, such as for system data and control data, such as feedback of motor or system parameters. The functional circuits may operate at different data rates, with different interrupt intervals, depending upon their capabilities. The control circuitry accommodates all of these flexibly. A physical backplane printed circuit board comprising independent data lines for each functional circuit allows for independent configuration of the data rates, interrupt intervals and communications between the control circuitry and the functional circuits.1. A system comprising:
converter circuitry to convert incoming three-phase power to DC power; inverter circuitry to convert the DC power to three-phase controlled frequency AC power to drive a motor; a plurality of functional circuits each configured to carry out a control, monitoring, or feedback operation with respect to a driven motor or load; control circuitry coupled to the inverter circuitry and configured to receive feedback signals, apply control signals to the inverter circuitry for conversion of the DC power to the controlled frequency AC power, and supply variable control events and/or system events to the functional circuits; and a physical backplane providing data communication between the control circuitry and the functional circuits, the physical backplane having separate and independent conductive data lines for each functional circuit, thus allowing data transfer between the control circuitry and each functional circuit at different data transfer rates, wherein the physical backplane comprises a dedicated functional circuit support board configured for data transmission only, and wherein the control circuitry employs one or more different control event intervals and/or system event intervals with each functional circuit. 2. The system of claim 1, wherein the functional circuits comprise first and second functional circuits having respective clock circuits that implement control and/or monitoring events at respective rates different from one another. 3. The system of claim 2, wherein the first and second functional circuits communicate data with the control circuitry at different rates across their respective conductive data lines of the physical backplane. 4. The system of claim 1, wherein the control circuitry comprises a control board that is coupled directly to the backplane. 5. The system of claim 1, wherein functional circuits each comprise a respective circuit board coupled through a respective receptacle to a respective conductive data line on the physical backplane. 6. The system of claim 1, wherein the control circuitry is also coupled to the converter circuitry to control conversion of the incoming three-phase power to DC power. 7. A system comprising:
converter circuitry to convert incoming three-phase power to DC power; inverter circuitry to convert the DC power to three-phase controlled frequency AC power to drive a motor; a plurality of functional circuits each configured to carry out a control, monitoring, or feedback operation with respect to a driven motor or load; control circuitry coupled to the inverter circuitry and configured to receive feedback signals, apply control signals to the inverter circuitry for conversion of the DC power to the controlled frequency AC power, and supply variable control events and/or system events to the functional circuits; and an option bus comprising one or more physical backplanes providing data communication between the control circuitry and the functional circuits, wherein the physical backplanes comprise dedicated functional circuit support boards configured for data transmission only, the physical backplanes having separate and independent conductive data lines for each functional circuit, thus allowing data transfer between the control circuitry and each functional circuit at different data transfer rates and different control event intervals and system event intervals to be employed with each functional circuit. 8. The system of claim 7, wherein the option bus comprises additional device connections beyond the physical backplane. 9. The system of claim 8, wherein the additional device connections connect a human interface module to the control circuitry. 10. The system of claim 7, wherein the functional circuits comprise first and second functional circuits having respective clock circuits that implement control and/or monitoring events at respective rates different from one another. 11. The system of claim 10, wherein the first and second functional circuits communicate data with the control circuitry at different rates across their respective conductive data lines of the physical backplane. 12. The system of claim 7, wherein the control circuitry chooses the clock rates, and thus data transfer rates, for each respective functional circuit based on the optimal performance for each respective functional circuit. 13. The system of claim 7, wherein the control circuitry comprises a control board that is coupled directly to the backplane. 14. The system of claim 7, wherein functional circuits each comprise a respective circuit board coupled through a respective receptacle to a respective conductive data line on the physical backplane. 15. The system of claim 7, wherein the control circuitry is also coupled to the converter circuitry to control conversion of the incoming three-phase power to DC power. 16. A method comprising:
converting incoming three-phase power to DC power using converter circuitry; inverting the DC power to three-phase controlled frequency AC power to drive a motor using inverter circuitry; controlling the inverting circuitry via control circuitry; and carrying out control, monitoring, or feedback operations using a plurality of functional circuits coupled to the control circuitry via a physical backplane, comprising a dedicated functional circuit support board configured for data transmission only, having separate and independent conductive data lines for each functional circuit, thus allowing data transfer between the control circuitry and each functional circuit at different data transfer rates and different control event intervals and system event intervals to be employed with each functional circuit. 17. The method of claim 16, wherein the control circuitry comprises a control board that is coupled directly to the backplane. 18. The method of claim 16, wherein functional circuits each comprise a respective circuit board coupled through a respective receptacle to a respective conductive data line on the physical backplane. 19. The method of claim 16, wherein the control circuitry is also coupled to the converter circuitry to control conversion of the incoming three-phase power to DC power. 20. The method of claim 16, wherein the control circuitry chooses the clock rates, and thus data transfer rates, for each respective functional circuit based on the optimal performance for each respective functional circuit. | 2,800 |
11,752 | 11,752 | 15,493,735 | 2,891 | An LED wafer includes LED dies on an LED substrate. The LED wafer and a carrier wafer are joined. The LED wafer that is joined to the carrier wafer is shaped. Wavelength conversion material is applied to the LED wafer that is shaped. Singulation is performed to provide multiple LED dies that are joined to a single carrier die. The multiple LED dies on the single carrier die are connected in series and/or in parallel by interconnection in the LED dies and/or in the single carrier die. The singulated devices may be mounted in an LED fixture to provide high light output per unit area. Related devices and fabrication methods are described. | 1. A lighting device comprising:
a substrate comprising an inner face, an outer face opposing the inner face, and a thickness; an array of LEDs supported by the substrate proximate to the inner face, wherein the array of LEDs comprises a plurality of anode contacts and a plurality of cathode contacts in conductive electrical communication with the array of LEDs, and the array of LEDs is arranged to transmit LED emissions through the substrate to exit the outer face; a carrier comprising a plurality of anode pads in conductive electrical communication with the plurality of anode contacts, and comprising a plurality of cathode pads in conductive electrical communication with the plurality of cathode contacts; and a plurality of reflective features; wherein the array of LEDs is arranged between the substrate and the carrier; and wherein at least a portion of each reflective feature of the plurality of reflective features is arranged between different LEDs of the array of LEDs. 2. The lighting device of claim 1, further comprising a plurality of trenches defined in the inner face of the substrate, wherein the at least a portion of each reflective feature of the plurality of reflective features extends into a different trench of the plurality of trenches. 3. The lighting device of claim 1, wherein the plurality of reflective features is embodied in at least one internal interconnection layer. 4. The lighting device of claim 1, further comprising a plurality of recesses formed in the substrate, wherein each recess of the plurality of recesses extends from the outer face in a direction toward the inner face, and each recess is substantially registered with a boundary between adjacent LEDs of the array of LEDs. 5. The lighting device of claim 4, wherein each recess of the plurality of recesses extends through less than an entirety of the thickness of the substrate. 6. The lighting device of claim 1, further comprising a wavelength conversion material arranged on or over the outer face of the substrate. 7. The lighting device of claim 6, further comprising a protective layer that is devoid of wavelength conversion material and that is arranged over the wavelength conversion material. 8. The lighting device of claim 1, wherein the outer face of the substrate comprises textural features. 9. The lighting device of claim 8, further comprising a wavelength conversion material arranged on or over the textural features of the outer face of the substrate. 10. The lighting device of claim 1, wherein the substrate comprises a growth substrate on which epitaxial layers forming the array of LEDs were grown. 11. The lighting device of claim 1, further comprising an insulating material arranged between the array of LEDs and the plurality of reflective features. 12. The lighting device of claim 1, wherein the plurality of reflective features comprises at least one metal. 13. The lighting device of claim 1, wherein the carrier comprises at least one reflector structure configured to reflect emissions of the plurality of LEDs toward the outer face of the substrate. 14. The lighting device of claim 1, wherein the plurality of anode contacts and the plurality of cathode contacts are substantially coplanar. 15. The lighting device of claim 1, further comprising a housing, wherein the lighting device is devoid of a dome between the array of LEDs and the housing. 16. The lighting device of claim 1, wherein:
the carrier comprises an inner surface and an outer surface that opposes the inner surface; the plurality of anode pads and the plurality of cathode pads are arranged on or along the inner surface; and the carrier further comprises a plurality of device anodes and a plurality of device cathodes arranged on or along the outer surface. 17. The lighting device of claim 1, wherein each LED of the array of LEDs comprises a flip-chip configuration. 18. A method for fabricating a lighting device, the method comprising:
growing epitaxial layers over an inner face of a growth substrate and defining a plurality of trenches in the epitaxial layers to produce an array of LEDs; providing a plurality of anode contacts and a plurality of cathode contacts in conductive electrical communication with the array of LEDs; forming a plurality of reflective features in the plurality of trenches; and mounting the array of LEDs over a carrier, including establishing conductive electrical communication between the plurality of anode contacts and a plurality of anode pads of the carrier, and establishing conductive electrical communication between the plurality of cathode contacts and a plurality of cathode pads of the carrier. 19. The method of claim 18, further comprising thinning the growth substrate after said growing of the epitaxial layers. 20. The method of claim 18, wherein the growth substrate further comprises an outer face that opposes the inner face, and the method further comprises defining a plurality of recesses in the growth substrate in a direction extending from the outer face toward the inner face. 21. The method of claim 18, wherein the growth substrate further comprises an outer face that opposes the inner face, and the method further comprises depositing a wavelength conversion material on or over the outer face. 22. The method of claim 18, further comprising forming at least one insulating layer in the plurality of trenches prior to said forming of the plurality of reflective features in the plurality of trenches. | An LED wafer includes LED dies on an LED substrate. The LED wafer and a carrier wafer are joined. The LED wafer that is joined to the carrier wafer is shaped. Wavelength conversion material is applied to the LED wafer that is shaped. Singulation is performed to provide multiple LED dies that are joined to a single carrier die. The multiple LED dies on the single carrier die are connected in series and/or in parallel by interconnection in the LED dies and/or in the single carrier die. The singulated devices may be mounted in an LED fixture to provide high light output per unit area. Related devices and fabrication methods are described.1. A lighting device comprising:
a substrate comprising an inner face, an outer face opposing the inner face, and a thickness; an array of LEDs supported by the substrate proximate to the inner face, wherein the array of LEDs comprises a plurality of anode contacts and a plurality of cathode contacts in conductive electrical communication with the array of LEDs, and the array of LEDs is arranged to transmit LED emissions through the substrate to exit the outer face; a carrier comprising a plurality of anode pads in conductive electrical communication with the plurality of anode contacts, and comprising a plurality of cathode pads in conductive electrical communication with the plurality of cathode contacts; and a plurality of reflective features; wherein the array of LEDs is arranged between the substrate and the carrier; and wherein at least a portion of each reflective feature of the plurality of reflective features is arranged between different LEDs of the array of LEDs. 2. The lighting device of claim 1, further comprising a plurality of trenches defined in the inner face of the substrate, wherein the at least a portion of each reflective feature of the plurality of reflective features extends into a different trench of the plurality of trenches. 3. The lighting device of claim 1, wherein the plurality of reflective features is embodied in at least one internal interconnection layer. 4. The lighting device of claim 1, further comprising a plurality of recesses formed in the substrate, wherein each recess of the plurality of recesses extends from the outer face in a direction toward the inner face, and each recess is substantially registered with a boundary between adjacent LEDs of the array of LEDs. 5. The lighting device of claim 4, wherein each recess of the plurality of recesses extends through less than an entirety of the thickness of the substrate. 6. The lighting device of claim 1, further comprising a wavelength conversion material arranged on or over the outer face of the substrate. 7. The lighting device of claim 6, further comprising a protective layer that is devoid of wavelength conversion material and that is arranged over the wavelength conversion material. 8. The lighting device of claim 1, wherein the outer face of the substrate comprises textural features. 9. The lighting device of claim 8, further comprising a wavelength conversion material arranged on or over the textural features of the outer face of the substrate. 10. The lighting device of claim 1, wherein the substrate comprises a growth substrate on which epitaxial layers forming the array of LEDs were grown. 11. The lighting device of claim 1, further comprising an insulating material arranged between the array of LEDs and the plurality of reflective features. 12. The lighting device of claim 1, wherein the plurality of reflective features comprises at least one metal. 13. The lighting device of claim 1, wherein the carrier comprises at least one reflector structure configured to reflect emissions of the plurality of LEDs toward the outer face of the substrate. 14. The lighting device of claim 1, wherein the plurality of anode contacts and the plurality of cathode contacts are substantially coplanar. 15. The lighting device of claim 1, further comprising a housing, wherein the lighting device is devoid of a dome between the array of LEDs and the housing. 16. The lighting device of claim 1, wherein:
the carrier comprises an inner surface and an outer surface that opposes the inner surface; the plurality of anode pads and the plurality of cathode pads are arranged on or along the inner surface; and the carrier further comprises a plurality of device anodes and a plurality of device cathodes arranged on or along the outer surface. 17. The lighting device of claim 1, wherein each LED of the array of LEDs comprises a flip-chip configuration. 18. A method for fabricating a lighting device, the method comprising:
growing epitaxial layers over an inner face of a growth substrate and defining a plurality of trenches in the epitaxial layers to produce an array of LEDs; providing a plurality of anode contacts and a plurality of cathode contacts in conductive electrical communication with the array of LEDs; forming a plurality of reflective features in the plurality of trenches; and mounting the array of LEDs over a carrier, including establishing conductive electrical communication between the plurality of anode contacts and a plurality of anode pads of the carrier, and establishing conductive electrical communication between the plurality of cathode contacts and a plurality of cathode pads of the carrier. 19. The method of claim 18, further comprising thinning the growth substrate after said growing of the epitaxial layers. 20. The method of claim 18, wherein the growth substrate further comprises an outer face that opposes the inner face, and the method further comprises defining a plurality of recesses in the growth substrate in a direction extending from the outer face toward the inner face. 21. The method of claim 18, wherein the growth substrate further comprises an outer face that opposes the inner face, and the method further comprises depositing a wavelength conversion material on or over the outer face. 22. The method of claim 18, further comprising forming at least one insulating layer in the plurality of trenches prior to said forming of the plurality of reflective features in the plurality of trenches. | 2,800 |
11,753 | 11,753 | 15,003,891 | 2,886 | This invention relates to a system and method to improve the signal to noise ratio (SNR) of optical spectrometers that are limited by nonrandom or fixed pattern noise. A signal from a sample is collected using a short test exposure, a total observation time to maximize SNR is calculated, and the total observation time is achieved by averaging multiple exposures whose time is selected based on the time dependent noise structure of the detector. Moreover, with a priori knowledge of the time dependent noise structure of the spectrometer, this method is easily automatable and can maximize SNR for a spectrum of an unknown compound without any user input. | 1. A system to minimize nonrandom electronic noise, the system comprising:
a source configured to emit electromagnetic radiation for an exposure; a detector configured to receive at least a portion of the electromagnetic radiation from the source, wherein the detector is configured to output a signal based on the exposure of electromagnetic radiation received by the detector for the exposure; a control system in communication with both the source and detector, wherein the control system is configured to control the exposure of electromagnetic radiation from the source and receive and interpret signals from the detector; wherein the source is configured by the control system to emit electromagnetic radiation for a predefined length of time for the exposure, wherein the predefined length of time is based on noise characteristics of the system to minimize nonrandom electronic noise; and wherein the control system in configured to output a waveform by averaging multiple exposures based on signals received from the detector. 2. The system of claim 1, wherein:
the source is configured by the control system to emit a test exposure of electromagnetic radiation to be received by the detector; and the control system being configured to calculate the predefined length of time based on the test exposure received by the detector. 3. The system of claim 1, wherein the predefined length of time is calculated based on the ratio of signal-to-noise to exposure time of the system. 4. The system of claim 1, wherein the predefined length of time is set at the time of manufacture of the system. 5. The system of claim 1, wherein the system is a Raman spectrometer. 6. The system of claim 1, wherein the system is a Fluorescence spectrometer. 7. The system of claim 1, wherein the system is a ultra-violet or visible spectrometer. 8. The system of claim 1, wherein the system is an emission spectrometer. 9. A method to minimize nonrandom electronic noise for a spectroscopy system having a source and detector, the method comprising the steps of:
emitting a plurality of exposures of electromagnetic radiation from the source, wherein a time for each exposure of the plurality of exposures is a predefined length of time, wherein the predefined length of time is based on noise characteristics of the spectroscopy system to minimize nonrandom electronic noise; receiving by the detector at least a portion of the electromagnetic radiation from the source for each exposure; and calculating a waveform by averaging plurality of exposures received by the detector. 10. The method of claim 9, further comprising the steps of:
emitting a test exposure of electromagnetic radiation to be received by the detector; and calculating the predefined length of time based on the test exposure received by the detector. 11. The method of claim 9, wherein the predefined length of time is calculated based on the ratio of signal-to-noise to exposure time of the system. 12. The method of claim 9, wherein the predefined length of time is set at the time of manufacture of the system. 13. The method of claim 9, wherein the system is a Raman spectrometer. 14. The method of claim 9, wherein the system is a Fluorescence spectrometer. 15. The method of claim 9, wherein the system is a ultra-violet or visible spectrometer. 16. The method of claim 9, wherein the system is an emission spectrometer. | This invention relates to a system and method to improve the signal to noise ratio (SNR) of optical spectrometers that are limited by nonrandom or fixed pattern noise. A signal from a sample is collected using a short test exposure, a total observation time to maximize SNR is calculated, and the total observation time is achieved by averaging multiple exposures whose time is selected based on the time dependent noise structure of the detector. Moreover, with a priori knowledge of the time dependent noise structure of the spectrometer, this method is easily automatable and can maximize SNR for a spectrum of an unknown compound without any user input.1. A system to minimize nonrandom electronic noise, the system comprising:
a source configured to emit electromagnetic radiation for an exposure; a detector configured to receive at least a portion of the electromagnetic radiation from the source, wherein the detector is configured to output a signal based on the exposure of electromagnetic radiation received by the detector for the exposure; a control system in communication with both the source and detector, wherein the control system is configured to control the exposure of electromagnetic radiation from the source and receive and interpret signals from the detector; wherein the source is configured by the control system to emit electromagnetic radiation for a predefined length of time for the exposure, wherein the predefined length of time is based on noise characteristics of the system to minimize nonrandom electronic noise; and wherein the control system in configured to output a waveform by averaging multiple exposures based on signals received from the detector. 2. The system of claim 1, wherein:
the source is configured by the control system to emit a test exposure of electromagnetic radiation to be received by the detector; and the control system being configured to calculate the predefined length of time based on the test exposure received by the detector. 3. The system of claim 1, wherein the predefined length of time is calculated based on the ratio of signal-to-noise to exposure time of the system. 4. The system of claim 1, wherein the predefined length of time is set at the time of manufacture of the system. 5. The system of claim 1, wherein the system is a Raman spectrometer. 6. The system of claim 1, wherein the system is a Fluorescence spectrometer. 7. The system of claim 1, wherein the system is a ultra-violet or visible spectrometer. 8. The system of claim 1, wherein the system is an emission spectrometer. 9. A method to minimize nonrandom electronic noise for a spectroscopy system having a source and detector, the method comprising the steps of:
emitting a plurality of exposures of electromagnetic radiation from the source, wherein a time for each exposure of the plurality of exposures is a predefined length of time, wherein the predefined length of time is based on noise characteristics of the spectroscopy system to minimize nonrandom electronic noise; receiving by the detector at least a portion of the electromagnetic radiation from the source for each exposure; and calculating a waveform by averaging plurality of exposures received by the detector. 10. The method of claim 9, further comprising the steps of:
emitting a test exposure of electromagnetic radiation to be received by the detector; and calculating the predefined length of time based on the test exposure received by the detector. 11. The method of claim 9, wherein the predefined length of time is calculated based on the ratio of signal-to-noise to exposure time of the system. 12. The method of claim 9, wherein the predefined length of time is set at the time of manufacture of the system. 13. The method of claim 9, wherein the system is a Raman spectrometer. 14. The method of claim 9, wherein the system is a Fluorescence spectrometer. 15. The method of claim 9, wherein the system is a ultra-violet or visible spectrometer. 16. The method of claim 9, wherein the system is an emission spectrometer. | 2,800 |
11,754 | 11,754 | 15,048,536 | 2,894 | A method of monitoring laser power in an additive manufacturing process in which a build beam generated by a laser source is used to selectively fuse or cure material to form a workpiece. The method includes: splitting off a predetermined percentage of the build beam to define a sample beam, and directing the sample beam to a sensor; using the sensor to generate a signal proportional to the power of the sample beam; and scaling the signal from the sensor to generate a laser power measurement representative of a power level of the build beam. | 1. A method of monitoring laser power in an additive manufacturing process in which a build beam generated by a laser source is used to selectively fuse or cure material to form a workpiece, the method comprising:
splitting off a predetermined percentage of the build beam to define a sample beam, and directing the sample beam to a sensor; using the sensor to generate a signal proportional to the power of the sample beam; and scaling the signal from the sensor to generate a laser power measurement representative of a power level of the build beam. 2. The method of claim 1 wherein the build beam is split via transmission through a reflective optic. 3. The method of claim 1 further comprising comparing the laser power measurement to a rated power of the laser source. 4. The method of claim 1 further comprising controlling at least one aspect of the additive manufacturing process in response to the laser power measurement. 5. The method of claim 4 wherein the step of controlling includes taking a discrete action in response to the laser power measurement exceeding one or more predetermined laser power limits. 6. The method of claim 5 wherein the one or more predetermined laser power limits includes a maximum difference between the laser power measurements and a desired laser power. 7. The method of claim 3 wherein the step of controlling includes changing at least one process parameter of the additive manufacturing process. 8. The method of claim 1 wherein the sensor comprises a solid state semiconductor detector. 9. The method of claim 1 wherein the sensor comprises a photomultiplier tube. 10. A method of making a workpiece, comprising:
depositing material in a build chamber; directing a build beam generated by a laser source to selectively fuse or cure the material in a pattern corresponding to a cross-sectional layer of the workpiece; splitting off a predetermined percentage of the build beam to define a sample beam, and directing the sample beam to a sensor; using the sensor to generate a signal proportional to a power of the sample beam; scaling the signal from the sensor to generate a laser power measurement representative of a power level of the build beam; and controlling at least one aspect of making the workpiece in response to the laser power measurement. 11. The method of claim 10 further comprising repeating in a cycle the steps of depositing and fusing to build up the workpiece in a layer-by layer fashion. 12. The method of claim 10 wherein the step of controlling includes taking a discrete action in response to the laser power measurement exceeding one or more predetermined laser power limits. 13. The method of claim 12 wherein one or more of the predetermined laser power limits include a maximum difference between actual laser power and a desired laser power. 14. The method of claim 10 further comprising comparing the laser power measurement to a rated power of the laser source. 15. The method of claim 10 wherein the build beam is split via transmission through a reflective optic. 16. The method of claim 10 wherein the sensor comprises a solid state semiconductor detector. 17. The method of claim 10 wherein the sensor comprises a photomultiplier tube. 18. An apparatus for making a workpiece, comprising:
a build chamber; a laser source operable to generate a build beam; a beam steering apparatus operable to direct the build beam so as to selectively fuse or cure material in the build chamber, in a pattern corresponding to a cross-sectional layer of the workpiece; a beam splitter disposed between the laser source and the beam steering apparatus, the beam splitter operable to split off a predetermined percentage of the build beam to define a sample beam; and a sensor positioned to receive the sample beam, the sensor operable to generate a signal proportional to the power of the sample beam. 19. The apparatus of claim 18 wherein the beam splitter comprises a dielectric mirror, a prism, or a metallic mirror. | A method of monitoring laser power in an additive manufacturing process in which a build beam generated by a laser source is used to selectively fuse or cure material to form a workpiece. The method includes: splitting off a predetermined percentage of the build beam to define a sample beam, and directing the sample beam to a sensor; using the sensor to generate a signal proportional to the power of the sample beam; and scaling the signal from the sensor to generate a laser power measurement representative of a power level of the build beam.1. A method of monitoring laser power in an additive manufacturing process in which a build beam generated by a laser source is used to selectively fuse or cure material to form a workpiece, the method comprising:
splitting off a predetermined percentage of the build beam to define a sample beam, and directing the sample beam to a sensor; using the sensor to generate a signal proportional to the power of the sample beam; and scaling the signal from the sensor to generate a laser power measurement representative of a power level of the build beam. 2. The method of claim 1 wherein the build beam is split via transmission through a reflective optic. 3. The method of claim 1 further comprising comparing the laser power measurement to a rated power of the laser source. 4. The method of claim 1 further comprising controlling at least one aspect of the additive manufacturing process in response to the laser power measurement. 5. The method of claim 4 wherein the step of controlling includes taking a discrete action in response to the laser power measurement exceeding one or more predetermined laser power limits. 6. The method of claim 5 wherein the one or more predetermined laser power limits includes a maximum difference between the laser power measurements and a desired laser power. 7. The method of claim 3 wherein the step of controlling includes changing at least one process parameter of the additive manufacturing process. 8. The method of claim 1 wherein the sensor comprises a solid state semiconductor detector. 9. The method of claim 1 wherein the sensor comprises a photomultiplier tube. 10. A method of making a workpiece, comprising:
depositing material in a build chamber; directing a build beam generated by a laser source to selectively fuse or cure the material in a pattern corresponding to a cross-sectional layer of the workpiece; splitting off a predetermined percentage of the build beam to define a sample beam, and directing the sample beam to a sensor; using the sensor to generate a signal proportional to a power of the sample beam; scaling the signal from the sensor to generate a laser power measurement representative of a power level of the build beam; and controlling at least one aspect of making the workpiece in response to the laser power measurement. 11. The method of claim 10 further comprising repeating in a cycle the steps of depositing and fusing to build up the workpiece in a layer-by layer fashion. 12. The method of claim 10 wherein the step of controlling includes taking a discrete action in response to the laser power measurement exceeding one or more predetermined laser power limits. 13. The method of claim 12 wherein one or more of the predetermined laser power limits include a maximum difference between actual laser power and a desired laser power. 14. The method of claim 10 further comprising comparing the laser power measurement to a rated power of the laser source. 15. The method of claim 10 wherein the build beam is split via transmission through a reflective optic. 16. The method of claim 10 wherein the sensor comprises a solid state semiconductor detector. 17. The method of claim 10 wherein the sensor comprises a photomultiplier tube. 18. An apparatus for making a workpiece, comprising:
a build chamber; a laser source operable to generate a build beam; a beam steering apparatus operable to direct the build beam so as to selectively fuse or cure material in the build chamber, in a pattern corresponding to a cross-sectional layer of the workpiece; a beam splitter disposed between the laser source and the beam steering apparatus, the beam splitter operable to split off a predetermined percentage of the build beam to define a sample beam; and a sensor positioned to receive the sample beam, the sensor operable to generate a signal proportional to the power of the sample beam. 19. The apparatus of claim 18 wherein the beam splitter comprises a dielectric mirror, a prism, or a metallic mirror. | 2,800 |
11,755 | 11,755 | 15,212,479 | 2,862 | Mechanical and elastic rock properties of a subsurface are predicted using actual physical samples from the subsurface as an alternative to wireline data obtained from wells. Geological rock data are generated from a physical geological sample of the subsurface. These geological rock data include elemental data, mineralogical data and textural data for the subsurface. The geological rock data are used in a rock physics model to generate elastic and mechanical rock properties of the subsurface. | 1. A method for predicting mechanical and elastic rock properties of a subsurface, the method comprising:
generating geological rock data from a physical geological sample of the subsurface, the geological rock data comprising at least one of elemental data, mineralogical data and textural data for the subsurface; and using the geological rock data in a rock physics model to generate elastic and mechanical rock properties of the subsurface. 2. The method of claim 1, wherein the physical geological sample comprises a vertical borehole core, a horizontal borehole core, unconsolidated cuttings from a well, rock outcroppings or combinations thereof. 3. The method of claim 1, wherein generating the geological rock data further comprises using the physical geological sample to determine at least one of mineral volumes, macroporosity, grain size, pore size, grain geometry and pore and grain aspect ratio. 4. The method of claim 1, wherein generating the geological rock data further comprises using at least one of elemental analysis, mineralogical analysis and imaging analysis of the physical geological sample to generate the geological rock data. 5. The method of claim 1, wherein using the geological rock data in the rock physics model to generate elastic and mechanical rock properties of the subsurface further comprises:
inputting the geological rock data into the rock physics model to determine elastic properties of the subsurface; using the elastic properties of the subsurface to generate derived elastic properties of the subsurface; and using the elastic properties and derived elastic properties to generate mechanical properties for the subsurface. 6. The method of claim 5, wherein:
the elastic properties comprise bulk density, bulk moduli, shear moduli, p-wave velocity and s-wave velocity; the derived elastic properties comprise impedance and velocity ratio; and the mechanical properties comprise Young's modulus and Poisson's ratio. 7. The method of claim 1, wherein using the geological rock data in the rock physics model to generate elastic and mechanical rock properties of the subsurface further comprises using mineral types and associated volumes from the geological rock data to estimate the elastic rock properties. 8. The method of claim 1, wherein using the geological rock data in the rock physics model to generate elastic and mechanical rock properties of the subsurface further comprises using porosity data derived from images of the physical geological sample to determine dry rock properties of the subsurface. 9. The method of claim 8, wherein:
the method further comprises identifying a given fluid to be substituted into pore spaces in the physical geological sample and identifying fluid properties associated with the given fluid; and using the geological rock data in the rock physics model to generate elastic and mechanical rock properties of the subsurface further comprises using the porosity data derived from images of the physical geological sample and the fluid properties to determine saturated rock properties of the subsurface. 10. The method of claim 8, wherein:
the method further comprises obtaining actual measured porosity for the subsurface using at least one of porosity wireline logs and core plug porosity data; and using the geological rock data in the rock physics model to generate elastic and mechanical rock properties of the subsurface further comprises using the actual measured porosity to calibrate the porosity data derived from images of the physical geological sample. 11. The method of claim 1, wherein using the geological rock data in the rock physics model to generate elastic and mechanical rock properties of the subsurface further comprises using textural rock properties derived from images of the physical geological sample to model elasticity of a rock frame in the subsurface. 12. The method of claim 11, wherein:
the rock physics model comprises an inclusion-based model; and using textural rock properties derived from images further comprises using pore geometry data. 13. The method of claim 11, wherein:
the rock physics model comprises a grain-based model; and using textural rock properties derived from images further comprises using at least one of a number of contacts between grains, grain sorting, grain surface conditions and cement localization. 14. The method of claim 1, further comprising using the generated elastic and mechanical rock properties of the subsurface to determine locations of wells in the subsurface. 15. A computer-readable medium containing computer-executable code that when read by a computer causes the computer to perform a method for predicting mechanical and elastic rock properties of a subsurface, the method comprising:
generating geological rock data from a physical geological sample of the subsurface, the geological rock data comprising at least one of elemental data, mineralogical data and textural data for the subsurface; and using the geological rock data in a rock physics model to generate elastic and mechanical rock properties of the subsurface. 16. The computer readable medium of claim 15, wherein using the geological rock data in the rock physics model to generate elastic and mechanical rock properties of the subsurface further comprises:
inputting the geological rock data into the rock physics model to determine elastic properties of the subsurface, the elastic properties comprising bulk density, bulk moduli, shear moduli, p-wave velocity and s-wave velocity; using the elastic properties of the subsurface to generate derived elastic properties of the subsurface, the derived elastic properties comprising impedance and velocity ratio; and using the elastic properties and derived elastic properties to generate mechanical properties for the subsurface, the mechanical properties comprising Young's modulus and Poisson's ratio. 17. The computer readable medium of claim 15, wherein:
the method further comprises identifying a given fluid to be substituted into pore spaces in the physical geological sample and identifying fluid properties associated with the given fluid; and using the geological rock data in the rock physics model to generate elastic and mechanical rock properties of the subsurface further comprises:
using mineral types and associated volumes from the geological rock data to estimate the elastic rock properties;
using porosity data derived from images of the physical geological sample to determine dry rock properties of the subsurface; and
using the porosity data derived from images of the physical geological sample and the fluid properties to determine saturated rock properties of the subsurface. 18. The computer readable medium of claim 17, wherein:
the method further comprises obtaining actual measured porosity for the subsurface using at least one of porosity wireline logs and core plug porosity data; and using the geological rock data in the rock physics model to generate elastic and mechanical rock properties of the subsurface further comprises using the actual measured porosity to calibrate the porosity data derived from images of the physical geological sample. 19. A computing system for predicting mechanical and elastic rock properties of a subsurface, the computing system comprising:
a storage device comprising geological rock data from a physical geological sample of the subsurface, the geological rock data comprising at least one of elemental data, mineralogical data and textural data for the subsurface; and a processer in communication with the storage device and configured to use the geological rock data in a rock physics model to generate elastic and mechanical rock properties of the subsurface. 20. The computing system of claim 19, wherein the processor is further configured to:
identify a given fluid to be substituted into pore spaces in the physical geological sample; identify fluid properties associated with the given fluid; use mineral types and associated volumes from the geological rock data to estimate the elastic rock properties; use porosity data derived from images of the physical geological sample to determine dry rock properties of the subsurface; use the porosity data derived from images of the physical geological sample and the fluid properties to determine saturated rock properties of the subsurface; obtain actual measured porosity for the subsurface using at least one of porosity wireline logs and core plug porosity data; and use the geological rock data in the rock physics model to generate elastic and mechanical rock properties of the subsurface by using the actual measured porosity to calibrate the porosity data derived from images of the physical geological sample. | Mechanical and elastic rock properties of a subsurface are predicted using actual physical samples from the subsurface as an alternative to wireline data obtained from wells. Geological rock data are generated from a physical geological sample of the subsurface. These geological rock data include elemental data, mineralogical data and textural data for the subsurface. The geological rock data are used in a rock physics model to generate elastic and mechanical rock properties of the subsurface.1. A method for predicting mechanical and elastic rock properties of a subsurface, the method comprising:
generating geological rock data from a physical geological sample of the subsurface, the geological rock data comprising at least one of elemental data, mineralogical data and textural data for the subsurface; and using the geological rock data in a rock physics model to generate elastic and mechanical rock properties of the subsurface. 2. The method of claim 1, wherein the physical geological sample comprises a vertical borehole core, a horizontal borehole core, unconsolidated cuttings from a well, rock outcroppings or combinations thereof. 3. The method of claim 1, wherein generating the geological rock data further comprises using the physical geological sample to determine at least one of mineral volumes, macroporosity, grain size, pore size, grain geometry and pore and grain aspect ratio. 4. The method of claim 1, wherein generating the geological rock data further comprises using at least one of elemental analysis, mineralogical analysis and imaging analysis of the physical geological sample to generate the geological rock data. 5. The method of claim 1, wherein using the geological rock data in the rock physics model to generate elastic and mechanical rock properties of the subsurface further comprises:
inputting the geological rock data into the rock physics model to determine elastic properties of the subsurface; using the elastic properties of the subsurface to generate derived elastic properties of the subsurface; and using the elastic properties and derived elastic properties to generate mechanical properties for the subsurface. 6. The method of claim 5, wherein:
the elastic properties comprise bulk density, bulk moduli, shear moduli, p-wave velocity and s-wave velocity; the derived elastic properties comprise impedance and velocity ratio; and the mechanical properties comprise Young's modulus and Poisson's ratio. 7. The method of claim 1, wherein using the geological rock data in the rock physics model to generate elastic and mechanical rock properties of the subsurface further comprises using mineral types and associated volumes from the geological rock data to estimate the elastic rock properties. 8. The method of claim 1, wherein using the geological rock data in the rock physics model to generate elastic and mechanical rock properties of the subsurface further comprises using porosity data derived from images of the physical geological sample to determine dry rock properties of the subsurface. 9. The method of claim 8, wherein:
the method further comprises identifying a given fluid to be substituted into pore spaces in the physical geological sample and identifying fluid properties associated with the given fluid; and using the geological rock data in the rock physics model to generate elastic and mechanical rock properties of the subsurface further comprises using the porosity data derived from images of the physical geological sample and the fluid properties to determine saturated rock properties of the subsurface. 10. The method of claim 8, wherein:
the method further comprises obtaining actual measured porosity for the subsurface using at least one of porosity wireline logs and core plug porosity data; and using the geological rock data in the rock physics model to generate elastic and mechanical rock properties of the subsurface further comprises using the actual measured porosity to calibrate the porosity data derived from images of the physical geological sample. 11. The method of claim 1, wherein using the geological rock data in the rock physics model to generate elastic and mechanical rock properties of the subsurface further comprises using textural rock properties derived from images of the physical geological sample to model elasticity of a rock frame in the subsurface. 12. The method of claim 11, wherein:
the rock physics model comprises an inclusion-based model; and using textural rock properties derived from images further comprises using pore geometry data. 13. The method of claim 11, wherein:
the rock physics model comprises a grain-based model; and using textural rock properties derived from images further comprises using at least one of a number of contacts between grains, grain sorting, grain surface conditions and cement localization. 14. The method of claim 1, further comprising using the generated elastic and mechanical rock properties of the subsurface to determine locations of wells in the subsurface. 15. A computer-readable medium containing computer-executable code that when read by a computer causes the computer to perform a method for predicting mechanical and elastic rock properties of a subsurface, the method comprising:
generating geological rock data from a physical geological sample of the subsurface, the geological rock data comprising at least one of elemental data, mineralogical data and textural data for the subsurface; and using the geological rock data in a rock physics model to generate elastic and mechanical rock properties of the subsurface. 16. The computer readable medium of claim 15, wherein using the geological rock data in the rock physics model to generate elastic and mechanical rock properties of the subsurface further comprises:
inputting the geological rock data into the rock physics model to determine elastic properties of the subsurface, the elastic properties comprising bulk density, bulk moduli, shear moduli, p-wave velocity and s-wave velocity; using the elastic properties of the subsurface to generate derived elastic properties of the subsurface, the derived elastic properties comprising impedance and velocity ratio; and using the elastic properties and derived elastic properties to generate mechanical properties for the subsurface, the mechanical properties comprising Young's modulus and Poisson's ratio. 17. The computer readable medium of claim 15, wherein:
the method further comprises identifying a given fluid to be substituted into pore spaces in the physical geological sample and identifying fluid properties associated with the given fluid; and using the geological rock data in the rock physics model to generate elastic and mechanical rock properties of the subsurface further comprises:
using mineral types and associated volumes from the geological rock data to estimate the elastic rock properties;
using porosity data derived from images of the physical geological sample to determine dry rock properties of the subsurface; and
using the porosity data derived from images of the physical geological sample and the fluid properties to determine saturated rock properties of the subsurface. 18. The computer readable medium of claim 17, wherein:
the method further comprises obtaining actual measured porosity for the subsurface using at least one of porosity wireline logs and core plug porosity data; and using the geological rock data in the rock physics model to generate elastic and mechanical rock properties of the subsurface further comprises using the actual measured porosity to calibrate the porosity data derived from images of the physical geological sample. 19. A computing system for predicting mechanical and elastic rock properties of a subsurface, the computing system comprising:
a storage device comprising geological rock data from a physical geological sample of the subsurface, the geological rock data comprising at least one of elemental data, mineralogical data and textural data for the subsurface; and a processer in communication with the storage device and configured to use the geological rock data in a rock physics model to generate elastic and mechanical rock properties of the subsurface. 20. The computing system of claim 19, wherein the processor is further configured to:
identify a given fluid to be substituted into pore spaces in the physical geological sample; identify fluid properties associated with the given fluid; use mineral types and associated volumes from the geological rock data to estimate the elastic rock properties; use porosity data derived from images of the physical geological sample to determine dry rock properties of the subsurface; use the porosity data derived from images of the physical geological sample and the fluid properties to determine saturated rock properties of the subsurface; obtain actual measured porosity for the subsurface using at least one of porosity wireline logs and core plug porosity data; and use the geological rock data in the rock physics model to generate elastic and mechanical rock properties of the subsurface by using the actual measured porosity to calibrate the porosity data derived from images of the physical geological sample. | 2,800 |
11,756 | 11,756 | 15,464,959 | 2,878 | A CMOS type semiconductor image sensor module wherein a pixel aperture ratio is improved, chip use efficiency is improved and furthermore, simultaneous shutter operation by all the pixels is made possible, and a method for manufacturing such semiconductor image sensor module are provided. The semiconductor image sensor module is provided by stacking a first semiconductor chip, which has an image sensor wherein a plurality of pixels composed of a photoelectric conversion element and a transistor are arranged, and a second semiconductor chip, which has an A/D converter array. Preferably, the semiconductor image sensor module is provided by stacking a third semiconductor chip having a memory element array. Furthermore, the semiconductor image sensor module is provided by stacking the first semiconductor chip having the image sensor and a fourth semiconductor chip having an analog nonvolatile memory array. | 1. An imaging device, comprising:
a first semiconductor chip including:
a plurality of pixels arranged in a first array, respective ones of the pixels including a photoelectric conversion element disposed at a light incident side of the first semiconductor chip, and
a multilayer wiring layer disposed below the photoelectric conversion element and disposed at a side opposite the light incident side; and
a second semiconductor chip including a first circuit, wherein an area of the first semiconductor chip is comparable to an area of the second semiconductor chip, the first semiconductor chip is stacked over the second semiconductor chip such that the side opposite the light incident side of the first semiconductor chip faces a surface of the second semiconductor chip, and the first semiconductor chip and the second semiconductor chip are connected to one another via at least one of a plurality of connection portions. 2. The imaging device according to claim 1, wherein the plurality of connection portions are disposed from the multilayer wiring layer to the second semiconductor chip through the side opposite the light incident side of the first semiconductor chip. 3. The imaging device according to claim 1, wherein the first circuit includes a plurality of analog to digital converters arranged in a second array. 4. The imaging device according to claim 3, wherein the plurality of pixels are grouped in a plurality of pixel array units, and wherein a respective analog to digital converter corresponds to a corresponding pixel array unit. 5. The imaging device according to claim 3, wherein the plurality of pixels are configured to output a respective analog signal, and wherein a respective analog to digital converter is configured to receive a corresponding analog signal via at least one of the plurality of connection portions. 6. The imaging device according to claim 3, wherein the plurality of analog to digital converters respectively include a comparator and a counter. 7. The imaging device according to claim 1, wherein the first semiconductor chip includes a transistor region including transistors corresponding to each of the photoelectric conversion elements, and a photodiode region including the respective photoelectric conversion elements. 8. The imaging device according to claim 1, wherein the plurality of connection portions includes first pads formed at the side opposite the light incident side of the first semiconductor chip and second pads formed at the surface of the second semiconductor chip, and wherein a respective first pad positionally corresponds to a corresponding second pad. 9. The imaging device according to claim 1, wherein the side opposite the light incident side of the first semiconductor chip is bonded to the surface of the second semiconductor chip with an adhesive material. 10. The imaging device according to claim 1, wherein the first semiconductor chip includes a first connection portion of the plurality of connection portions, and the second semiconductor chip includes a second connection portion of the plurality of connection portions. 11. The imaging device according to claim 10, wherein the first connection portion is a first pad, and the second connection portion is a second pad. 12. The imaging device according to claim 1, further comprising a third semiconductor chip including a second circuit, wherein the second semiconductor chip is stacked over the third semiconductor chip. 13. The imaging device according to claim 12, wherein the second circuit includes a plurality of memory elements. 14. The imaging device according to claim 13, wherein the plurality of memory elements are volatile memories. 15. The imaging device according to claim 1, wherein respective ones of the pixels include a transfer transistor, a reset transistor, an amplifier transistor, and a select transistor. 16. The imaging device according to claim 1, wherein adjacent ones of the pixels share a reset transistor, an amplifier transistor, and a select transistor. 17. The imaging device according to claim 1, wherein the first semiconductor chip includes a driver circuit configured to drive the plurality of pixels, the driver circuit being adjacent to the first array. 18. The imaging device according to claim 1, wherein the first semiconductor chip includes a plurality of signal lines. 19. The imaging device according to claim 1, wherein the photoelectric conversion element is a photodiode. 20. The imaging device according to claim 1, wherein the photoelectric conversion element is a plurality of photodiodes. | A CMOS type semiconductor image sensor module wherein a pixel aperture ratio is improved, chip use efficiency is improved and furthermore, simultaneous shutter operation by all the pixels is made possible, and a method for manufacturing such semiconductor image sensor module are provided. The semiconductor image sensor module is provided by stacking a first semiconductor chip, which has an image sensor wherein a plurality of pixels composed of a photoelectric conversion element and a transistor are arranged, and a second semiconductor chip, which has an A/D converter array. Preferably, the semiconductor image sensor module is provided by stacking a third semiconductor chip having a memory element array. Furthermore, the semiconductor image sensor module is provided by stacking the first semiconductor chip having the image sensor and a fourth semiconductor chip having an analog nonvolatile memory array.1. An imaging device, comprising:
a first semiconductor chip including:
a plurality of pixels arranged in a first array, respective ones of the pixels including a photoelectric conversion element disposed at a light incident side of the first semiconductor chip, and
a multilayer wiring layer disposed below the photoelectric conversion element and disposed at a side opposite the light incident side; and
a second semiconductor chip including a first circuit, wherein an area of the first semiconductor chip is comparable to an area of the second semiconductor chip, the first semiconductor chip is stacked over the second semiconductor chip such that the side opposite the light incident side of the first semiconductor chip faces a surface of the second semiconductor chip, and the first semiconductor chip and the second semiconductor chip are connected to one another via at least one of a plurality of connection portions. 2. The imaging device according to claim 1, wherein the plurality of connection portions are disposed from the multilayer wiring layer to the second semiconductor chip through the side opposite the light incident side of the first semiconductor chip. 3. The imaging device according to claim 1, wherein the first circuit includes a plurality of analog to digital converters arranged in a second array. 4. The imaging device according to claim 3, wherein the plurality of pixels are grouped in a plurality of pixel array units, and wherein a respective analog to digital converter corresponds to a corresponding pixel array unit. 5. The imaging device according to claim 3, wherein the plurality of pixels are configured to output a respective analog signal, and wherein a respective analog to digital converter is configured to receive a corresponding analog signal via at least one of the plurality of connection portions. 6. The imaging device according to claim 3, wherein the plurality of analog to digital converters respectively include a comparator and a counter. 7. The imaging device according to claim 1, wherein the first semiconductor chip includes a transistor region including transistors corresponding to each of the photoelectric conversion elements, and a photodiode region including the respective photoelectric conversion elements. 8. The imaging device according to claim 1, wherein the plurality of connection portions includes first pads formed at the side opposite the light incident side of the first semiconductor chip and second pads formed at the surface of the second semiconductor chip, and wherein a respective first pad positionally corresponds to a corresponding second pad. 9. The imaging device according to claim 1, wherein the side opposite the light incident side of the first semiconductor chip is bonded to the surface of the second semiconductor chip with an adhesive material. 10. The imaging device according to claim 1, wherein the first semiconductor chip includes a first connection portion of the plurality of connection portions, and the second semiconductor chip includes a second connection portion of the plurality of connection portions. 11. The imaging device according to claim 10, wherein the first connection portion is a first pad, and the second connection portion is a second pad. 12. The imaging device according to claim 1, further comprising a third semiconductor chip including a second circuit, wherein the second semiconductor chip is stacked over the third semiconductor chip. 13. The imaging device according to claim 12, wherein the second circuit includes a plurality of memory elements. 14. The imaging device according to claim 13, wherein the plurality of memory elements are volatile memories. 15. The imaging device according to claim 1, wherein respective ones of the pixels include a transfer transistor, a reset transistor, an amplifier transistor, and a select transistor. 16. The imaging device according to claim 1, wherein adjacent ones of the pixels share a reset transistor, an amplifier transistor, and a select transistor. 17. The imaging device according to claim 1, wherein the first semiconductor chip includes a driver circuit configured to drive the plurality of pixels, the driver circuit being adjacent to the first array. 18. The imaging device according to claim 1, wherein the first semiconductor chip includes a plurality of signal lines. 19. The imaging device according to claim 1, wherein the photoelectric conversion element is a photodiode. 20. The imaging device according to claim 1, wherein the photoelectric conversion element is a plurality of photodiodes. | 2,800 |
11,757 | 11,757 | 15,938,164 | 2,853 | In an example, a printer ink dryer unit comprises at least one ultraviolet light source to dry a printer ink layer by causing evaporation of a solvent fluid therefrom. | 1. A printer ink dryer system comprising:
disposed with a print apparatus, at least one non-laser, ultraviolet light emitting diode (LED) as a light source to dry a printer ink layer formed by the print apparatus, the LED to dry the printer ink layer by causing evaporation of a solvent fluid therefrom. 2. The printer ink dryer system of claim 1, the light source to cause evaporation of solvent fluid from a printer ink comprising at least one colorant, in which the ultraviolet light emitted from the light source is associated with a higher colorant absorption efficiency than solvent absorption efficiency. 3. The printer ink dryer system of claim 1, in which the light source has a bandwidth of less than 30 nm. 4. The printer ink dryer system of claim 1, in which the light source has a peak wavelength of 295-405 nm 5. The printer ink dryer system of claim 1, wherein the LED has a peak wavelength of 395 nm. 6. The printer ink dryer system of claim 5, in which the light source has a bandwidth 30 nm or less. 7. The printer ink dryer system of claim 1, wherein ultraviolet light from the light source is absorbed by Cyan, Yellow, Magenta and Black pigments in the solvent fluid with a difference in absorption efficiency of less than 30%. 8. The printer ink dryer system of claim 1, wherein the non-laser LED emits radiation in a range of 300-450 nm with a bandwidth of 20-30 nm. 9. The printer ink dryer system of claim 1, in which the light source comprises an array of non-laser, ultraviolet light emitting diodes. 10. The printer ink dryer system of claim 9, wherein the array comprises ultraviolet LEDs that emit different wavebands, the printer ink dryer system to control selected LEDs in the array based on a waveband that is optimal for drying of a particular printing being printed. 11. The printer ink dryer system of claim 10, the printer ink dryer system to selectively operate LEDs in the array that provide at least a minimum absorption efficiency for all colorants in the printing being printed. 12. A printer ink drying system comprising;
a dryer unit comprising at least one non-laser, ultraviolet light emitting diode (LED) as a light source to dry a printer ink layer by causing evaporation of a solvent fluid therefrom; a printed substrate comprising undried ink, the undried ink comprising Cyan, Yellow, Magenta and Black pigments in solvent that is subject to evaporation; and a conveyor system to convey the printed substrate to the dryer unit; wherein ultraviolet light from the light source is absorbed by the Cyan, Yellow, Magenta and Black pigments with a difference in absorption efficiency of less than 30%. 13. The printer ink drying system of claim 12, in which the light source has a bandwidth of less than 30 nm. 14. The printer ink drying system of claim 13, in which the light source has a peak wavelength of 295-405 nm 15. The printer ink drying system of claim 12, wherein the LED has a peak wavelength of 395 nm. 16. The printer ink drying system of claim 15, in which the light source has a bandwidth of 30 nm or less. 17. The printer ink drying system of claim 12, wherein the non-laser LED emits radiation in a range of 300-450 nm with a bandwidth of 20-30 nm. 18. The printer ink drying system of claim 12, in which the light source comprises an array of non-laser, ultraviolet light emitting diodes. 19. The printer ink drying system of claim 18, wherein the array comprises ultraviolet LEDs that emit different wavebands, the printer ink dryer system to control selected LEDs in the array based on a waveband that is optimal for drying of a particular printing being printed. 20. The printer ink drying system of claim 19, the printer ink dryer system to selectively operate LEDs in the array that provide at least a minimum absorption efficiency for all colorants in the printing being printed. | In an example, a printer ink dryer unit comprises at least one ultraviolet light source to dry a printer ink layer by causing evaporation of a solvent fluid therefrom.1. A printer ink dryer system comprising:
disposed with a print apparatus, at least one non-laser, ultraviolet light emitting diode (LED) as a light source to dry a printer ink layer formed by the print apparatus, the LED to dry the printer ink layer by causing evaporation of a solvent fluid therefrom. 2. The printer ink dryer system of claim 1, the light source to cause evaporation of solvent fluid from a printer ink comprising at least one colorant, in which the ultraviolet light emitted from the light source is associated with a higher colorant absorption efficiency than solvent absorption efficiency. 3. The printer ink dryer system of claim 1, in which the light source has a bandwidth of less than 30 nm. 4. The printer ink dryer system of claim 1, in which the light source has a peak wavelength of 295-405 nm 5. The printer ink dryer system of claim 1, wherein the LED has a peak wavelength of 395 nm. 6. The printer ink dryer system of claim 5, in which the light source has a bandwidth 30 nm or less. 7. The printer ink dryer system of claim 1, wherein ultraviolet light from the light source is absorbed by Cyan, Yellow, Magenta and Black pigments in the solvent fluid with a difference in absorption efficiency of less than 30%. 8. The printer ink dryer system of claim 1, wherein the non-laser LED emits radiation in a range of 300-450 nm with a bandwidth of 20-30 nm. 9. The printer ink dryer system of claim 1, in which the light source comprises an array of non-laser, ultraviolet light emitting diodes. 10. The printer ink dryer system of claim 9, wherein the array comprises ultraviolet LEDs that emit different wavebands, the printer ink dryer system to control selected LEDs in the array based on a waveband that is optimal for drying of a particular printing being printed. 11. The printer ink dryer system of claim 10, the printer ink dryer system to selectively operate LEDs in the array that provide at least a minimum absorption efficiency for all colorants in the printing being printed. 12. A printer ink drying system comprising;
a dryer unit comprising at least one non-laser, ultraviolet light emitting diode (LED) as a light source to dry a printer ink layer by causing evaporation of a solvent fluid therefrom; a printed substrate comprising undried ink, the undried ink comprising Cyan, Yellow, Magenta and Black pigments in solvent that is subject to evaporation; and a conveyor system to convey the printed substrate to the dryer unit; wherein ultraviolet light from the light source is absorbed by the Cyan, Yellow, Magenta and Black pigments with a difference in absorption efficiency of less than 30%. 13. The printer ink drying system of claim 12, in which the light source has a bandwidth of less than 30 nm. 14. The printer ink drying system of claim 13, in which the light source has a peak wavelength of 295-405 nm 15. The printer ink drying system of claim 12, wherein the LED has a peak wavelength of 395 nm. 16. The printer ink drying system of claim 15, in which the light source has a bandwidth of 30 nm or less. 17. The printer ink drying system of claim 12, wherein the non-laser LED emits radiation in a range of 300-450 nm with a bandwidth of 20-30 nm. 18. The printer ink drying system of claim 12, in which the light source comprises an array of non-laser, ultraviolet light emitting diodes. 19. The printer ink drying system of claim 18, wherein the array comprises ultraviolet LEDs that emit different wavebands, the printer ink dryer system to control selected LEDs in the array based on a waveband that is optimal for drying of a particular printing being printed. 20. The printer ink drying system of claim 19, the printer ink dryer system to selectively operate LEDs in the array that provide at least a minimum absorption efficiency for all colorants in the printing being printed. | 2,800 |
11,758 | 11,758 | 15,441,870 | 2,875 | An illuminated safety helmet assembly for indicating turns and braking includes a shell that is substantially complementary to a helmet. The helmet is configured to couple to a head of a user and the shell is configured to couple to the helmet. A first power module is coupled to the shell. A first light, positioned on a right side of the shell, and a second light, positioned on a left side of the shell, are coupled proximate to a back of the shell. A third light is coupled to and is centrally positioned on the back of the shell. A controller, coupled to the shell, is operationally coupled to the first power module, the first light, the second light, and the third light. The controller is configured to selectively operationally couple the first light, the second light, and the third light to the first power module. | 1. An illuminated safety helmet assembly comprising:
a shell substantially complementary to a helmet that is configured for coupling to a head of a user, said shell being configured for coupling to the helmet; a first power module coupled to said shell; a first light coupled to and positioned on a right side of said shell proximate to a back of said shell; a second light coupled to and positioned on a left side of said shell proximate to said back of said shell; a third light coupled to and centrally positioned on said back of said shell; a controller coupled to said shell, said controller being operationally coupled to said first power module, said first light, said second light, and said third light, said controller being configured for receiving commands from the user; and wherein said controller is positioned for selectively operationally coupling said first light, said second light, and said third light, to said first power module such that the user is positioned for selectively indicating the user's intent to execute right turns and left turns and such that braking of a vehicle being operated by the user, such as a velocipede, is indicated to persons approaching the user from behind. 2. The assembly of claim 1, further including said shell being integral to the helmet. 3. The assembly of claim 1, further including said first power module comprising at least one first battery. 4. The assembly of claim 1, further including said first light and said second light being configured for intermittent illumination. 5. The assembly of claim 1, further including said first light and said second light being yellow, said third light being red. 6. The assembly of claim 1, further comprising:
said first light comprising a plurality of first light emitting diodes; said second light comprising a plurality of second light emitting diodes; and said third light comprising a plurality of third light emitting diodes. 7. The assembly of claim 1, further comprising:
a sensor configured for coupling to the vehicle, said sensor being configured for operationally coupling to a brake system of the vehicle, wherein said sensor is positioned on the vehicle such that said sensor is configured for detecting activation of the brake system of the vehicle; a control module configured for coupling to the vehicle, said control module being operationally coupled to said sensor, said control module being configured for selectively inputting requests for coupling of said first light and said second light to said first power module, said control module being configured for communicating with said controller; and wherein said control module is positioned on the vehicle such that said control module is positioned for receiving input from said sensor upon said sensor detecting the activation of the brake system of the vehicle, wherein said control module is positioned for communicating the activation of the brake system of the vehicle to said controller, wherein said controller is positioned for selectively operationally coupling said third light to said first power module for indicating the activation of the brake system to the persons approaching the user from behind, wherein said control module is positioned to communicate the requests for coupling of said first light and said second light to said first power module such that said controller is positioned for selectively operationally coupling said first light and said second light to said first power module such that said first light and said second light are configured for blinking for selectively indicating the user's intent to execute right turns and left turns to the persons approaching the user from behind. 8. The assembly of claim 7, further comprising:
said controller comprising:
a first housing defining an internal space,
a first microprocessor coupled to said first housing and positioned in said internal space, said first microprocessor being operationally coupled to said first power module, and
a first receiver coupled to said first housing and positioned in said internal space, said first receiver being operationally coupled to said first microprocessor, said first receiver being configured for wireless communication;
said control module comprising:
a second housing defining an interior space,
a second power module coupled to said second housing and positioned in said interior space,
a second microprocessor coupled to said second housing and positioned in said interior space, said second microprocessor being operationally coupled to said second power module,
a second transmitter coupled to said second housing and positioned in said interior space, said second transmitter being operationally coupled to said second microprocessor, said second transmitter being configured for wireless communication,
a left-turn button coupled to said second housing, said left-turn button being depressible, said left-turn button being operationally coupled to said second microprocessor, and
a right-turn button coupled to said second housing, said right-turn button being depressible, said right-turn button being operationally coupled to said second microprocessor; and
wherein said sensor is positioned on the vehicle such that said sensor is configured for detecting activation of the brake system of the vehicle, wherein second microprocessor is positioned for compelling said second transmitter for communicating the activation of the brake system of the vehicle to said first microprocessor via said first receiver, wherein said first microprocessor is positioned for operationally coupling said third light to said first power module for indicating the activation of the brake system to the persons approaching the user from behind, and said left-turn button and said right-turn button are positioned on said second housing such that said left-turn button and said right-turn button are positioned for selectively depressing for compelling said second microprocessor for compelling said second transmitter for communicating the left-turn signal and right-turn signal to said first microprocessor via said first receiver, wherein said first microprocessor is positioned for selectively operationally coupling said first light and said second light to said first power module such that said first light and said second light are configured for blinking for selectively indicating the user's intent to execute right turns and left turns to the persons approaching the user from behind. 9. The assembly of claim 8, further including said second power module comprising at least one second battery. 10. The assembly of claim 8, further including said first receiver and said second transmitter being Bluetooth-enabled. 11. The assembly of claim 8, further comprising:
a second receiver coupled to said first housing and positioned in said internal space, said second receiver being operationally coupled to said first microprocessor, said second receiver being global positioning system enabled; a first transmitter coupled to said first housing and positioned in said internal space, said first transmitter being operationally coupled to said first microprocessor, said first transmitter being configured for wireless communication; and wherein said second receiver is positioned in said first housing such that said second receiver is configured for receiving location coordinates of the user and for relaying the location coordinates to said first microprocessor, wherein said first microprocessor is positioned for compelling said first transmitter for transmitting the location coordinates of the user. 12. The assembly of claim 1, further including a pair of fourth lights coupled to said shell, said fourth lights being positioned singly on said back and a front of said shell proximate to a top of said shell, said fourth lights being operationally coupled to said controller, said fourth lights being configured for irregular intermittent illumination, such that said fourth lights are strobing, wherein said fourth lights are positioned on said shell such that said controller is positioned for selectively operationally coupling said fourth lights to said first power module, wherein said fourth lights are configured for selectively illuminating spaces proximate to said back and said front of said shell. 13. The assembly of claim 12, further including each said fourth light comprising a plurality of fourth light emitting diodes. 14. The assembly of claim 1, further including a pair of fifth lights, said fifth lights being positioned singly on said right side and said left side of said shell proximate to a top of said shell, said fifth lights being operationally coupled to said controller, said fifth lights being configured for intermittent illumination, wherein said fifth lights are positioned on said shell such that said controller is positioned for selectively operationally coupling said fifth lights to said first power module, wherein said fifth lights are configured for blinking for increasing the visibility of the user to persons approaching the user from either side. 15. The assembly of claim 14, further including each said fifth light comprising a plurality of fifth light emitting diodes. 16. An illuminated safety helmet assembly comprising:
a shell substantially complementary to a helmet that is configured for coupling to a head of a user, said shell being configured for coupling to the helmet, said shell being integral to the helmet; a first power module coupled to said shell, said first power module comprising at least one first battery; a first light coupled to and positioned on a right side of said shell proximate to a back of said shell, said first light being configured for intermittent illumination, said first light being yellow, said first light comprising a plurality of first light emitting diodes; a second light coupled to and positioned on a left side of said shell proximate to said back of said shell, said second light being configured for intermittent illumination, said second light being yellow, said second light comprising a plurality of second light emitting diodes; a third light coupled to and centrally positioned on said back of said shell, said third light being red, said third light comprising a plurality of third light emitting diodes; a controller coupled to said shell, said controller being operationally coupled to said first power module, said first light, said second light, and said third light, said controller being configured for receiving commands from the user such that said controller is positioned for selectively operationally coupling said first light, said second light, and said third light, to said first power module such that the user is positioned for selectively indicating the user's intent to execute right turns and left turns and such that braking of a vehicle being operated by the user, such as a velocipede, is indicated to persons approaching the user from behind, said controller comprising:
a first housing defining an internal space,
a first microprocessor coupled to said first housing and positioned in said internal space, said first microprocessor being operationally coupled to said first power module,
a first receiver coupled to said first housing and positioned in said internal space, said first receiver being operationally coupled to said first microprocessor, said first receiver being configured for wireless communication, said first receiver being Bluetooth-enabled,
a second receiver coupled to said first housing and positioned in said internal space, said second receiver being operationally coupled to said first microprocessor, said second receiver being global positioning system enabled, wherein said second receiver is positioned in said first housing such that said second receiver is configured for receiving location coordinates of the user and for relaying the location coordinates to said first microprocessor, and
a first transmitter coupled to said first housing and positioned in said internal space, said first transmitter being operationally coupled to said first microprocessor, said first transmitter being configured for wireless communication, wherein said first microprocessor is positioned for compelling said first transmitter for transmitting the location coordinates of the user;
a pair of fourth lights coupled to said shell, said fourth lights being positioned singly on said back and a front of said shell proximate to a top of said shell, said fourth lights being operationally coupled to said controller, said fourth lights being configured for irregular intermittent illumination, such that said fourth lights are strobing, wherein said fourth lights are positioned on said shell such that said controller is positioned for selectively operationally coupling said fourth lights to said first power module, wherein said fourth lights are configured for selectively illuminating spaces proximate to said back and said front of said shell, each said fourth light comprising a plurality of fourth light emitting diodes; a pair of fifth lights, said fifth lights being positioned singly on said right side and said left side of said shell proximate to said top of said shell, said fifth lights being operationally coupled to said controller, said fifth lights being configured for intermittent illumination, wherein said fifth lights are positioned on said shell such that said controller is positioned for selectively operationally coupling said fifth lights to said first power module, wherein said fifth lights are configured for blinking for increasing the visibility of the user to persons approaching the user from either side, each said fifth light comprising a plurality of fifth light emitting diodes; a sensor configured for coupling to the vehicle, said sensor being configured for operationally coupling to a brake system of the vehicle, wherein said sensor is positioned on the vehicle such that said sensor is configured for detecting activation of the brake system of the vehicle; a control module configured for coupling to the vehicle, said control module being operationally coupled to said sensor, said control module being configured for selectively inputting requests for coupling of said first light and said second light to said first power module, said control module being configured for communicating with said controller, wherein said control module is positioned on the vehicle such that said control module is positioned for receiving input from said sensor upon said sensor detecting the activation of the brake system of the vehicle, wherein said control module is positioned for communicating the activation of the brake system of the vehicle to said controller, wherein said controller is positioned for selectively operationally coupling said third light to said first power module for indicating the activation of the brake system to the persons approaching the user from behind, wherein said control module is positioned to communicate the requests for coupling of said first light and said second light to said first power module such that said controller is positioned for selectively operationally coupling said first light and said second light to said first power module such that said first light and said second light are configured for blinking for selectively indicating the user's intent to execute right turns and left turns to the persons approaching the user from behind, said control module comprising:
a second housing defining an interior space,
a second power module coupled to said second housing and positioned in said interior space, said second power module comprising at least one second battery
a second microprocessor coupled to said second housing and positioned in said interior space, said second microprocessor being operationally coupled to said second power module,
a second transmitter coupled to said second housing and positioned in said interior space, said second transmitter being operationally coupled to said second microprocessor, said second transmitter being configured for wireless communication, said second transmitter being Bluetooth-enabled,
a left-turn button coupled to said second housing, said left-turn button being depressible, said left-turn button being operationally coupled to said second microprocessor,
a right-turn button coupled to said second housing, said right-turn button being depressible, said right-turn button being operationally coupled to said second microprocessor; and
wherein said sensor is positioned on the vehicle such that said sensor is configured for detecting activation of the brake system of the vehicle, wherein second microprocessor is positioned for compelling said second transmitter for communicating the activation of the brake system of the vehicle to said first microprocessor via said first receiver, wherein said first microprocessor is positioned for operationally coupling said third light to said first power module for indicating the activation of the brake system to the persons approaching the user from behind, and said left-turn button and said right-turn button are positioned on said second housing such that said left-turn button and said right-turn button are positioned for selectively depressing for compelling said second microprocessor for compelling said second transmitter for communicating the left-turn signal and right-turn signal to said first microprocessor via said first receiver, wherein said first microprocessor is positioned for selectively operationally coupling said first light and said second light to said first power module such that said first light and said second light are configured for blinking for selectively indicating the user's intent to execute right turns and left turns to the persons approaching the user from behind, wherein said fourth lights are configured for selectively illuminating the spaces proximate to said back and said front of said shell, wherein said fifth lights are positioned on said shell such that said controller is positioned for selectively operationally coupling said fifth lights to said first power module, wherein said fifth lights are configured for blinking for increasing the visibility of the user to the persons approaching the user from either side. | An illuminated safety helmet assembly for indicating turns and braking includes a shell that is substantially complementary to a helmet. The helmet is configured to couple to a head of a user and the shell is configured to couple to the helmet. A first power module is coupled to the shell. A first light, positioned on a right side of the shell, and a second light, positioned on a left side of the shell, are coupled proximate to a back of the shell. A third light is coupled to and is centrally positioned on the back of the shell. A controller, coupled to the shell, is operationally coupled to the first power module, the first light, the second light, and the third light. The controller is configured to selectively operationally couple the first light, the second light, and the third light to the first power module.1. An illuminated safety helmet assembly comprising:
a shell substantially complementary to a helmet that is configured for coupling to a head of a user, said shell being configured for coupling to the helmet; a first power module coupled to said shell; a first light coupled to and positioned on a right side of said shell proximate to a back of said shell; a second light coupled to and positioned on a left side of said shell proximate to said back of said shell; a third light coupled to and centrally positioned on said back of said shell; a controller coupled to said shell, said controller being operationally coupled to said first power module, said first light, said second light, and said third light, said controller being configured for receiving commands from the user; and wherein said controller is positioned for selectively operationally coupling said first light, said second light, and said third light, to said first power module such that the user is positioned for selectively indicating the user's intent to execute right turns and left turns and such that braking of a vehicle being operated by the user, such as a velocipede, is indicated to persons approaching the user from behind. 2. The assembly of claim 1, further including said shell being integral to the helmet. 3. The assembly of claim 1, further including said first power module comprising at least one first battery. 4. The assembly of claim 1, further including said first light and said second light being configured for intermittent illumination. 5. The assembly of claim 1, further including said first light and said second light being yellow, said third light being red. 6. The assembly of claim 1, further comprising:
said first light comprising a plurality of first light emitting diodes; said second light comprising a plurality of second light emitting diodes; and said third light comprising a plurality of third light emitting diodes. 7. The assembly of claim 1, further comprising:
a sensor configured for coupling to the vehicle, said sensor being configured for operationally coupling to a brake system of the vehicle, wherein said sensor is positioned on the vehicle such that said sensor is configured for detecting activation of the brake system of the vehicle; a control module configured for coupling to the vehicle, said control module being operationally coupled to said sensor, said control module being configured for selectively inputting requests for coupling of said first light and said second light to said first power module, said control module being configured for communicating with said controller; and wherein said control module is positioned on the vehicle such that said control module is positioned for receiving input from said sensor upon said sensor detecting the activation of the brake system of the vehicle, wherein said control module is positioned for communicating the activation of the brake system of the vehicle to said controller, wherein said controller is positioned for selectively operationally coupling said third light to said first power module for indicating the activation of the brake system to the persons approaching the user from behind, wherein said control module is positioned to communicate the requests for coupling of said first light and said second light to said first power module such that said controller is positioned for selectively operationally coupling said first light and said second light to said first power module such that said first light and said second light are configured for blinking for selectively indicating the user's intent to execute right turns and left turns to the persons approaching the user from behind. 8. The assembly of claim 7, further comprising:
said controller comprising:
a first housing defining an internal space,
a first microprocessor coupled to said first housing and positioned in said internal space, said first microprocessor being operationally coupled to said first power module, and
a first receiver coupled to said first housing and positioned in said internal space, said first receiver being operationally coupled to said first microprocessor, said first receiver being configured for wireless communication;
said control module comprising:
a second housing defining an interior space,
a second power module coupled to said second housing and positioned in said interior space,
a second microprocessor coupled to said second housing and positioned in said interior space, said second microprocessor being operationally coupled to said second power module,
a second transmitter coupled to said second housing and positioned in said interior space, said second transmitter being operationally coupled to said second microprocessor, said second transmitter being configured for wireless communication,
a left-turn button coupled to said second housing, said left-turn button being depressible, said left-turn button being operationally coupled to said second microprocessor, and
a right-turn button coupled to said second housing, said right-turn button being depressible, said right-turn button being operationally coupled to said second microprocessor; and
wherein said sensor is positioned on the vehicle such that said sensor is configured for detecting activation of the brake system of the vehicle, wherein second microprocessor is positioned for compelling said second transmitter for communicating the activation of the brake system of the vehicle to said first microprocessor via said first receiver, wherein said first microprocessor is positioned for operationally coupling said third light to said first power module for indicating the activation of the brake system to the persons approaching the user from behind, and said left-turn button and said right-turn button are positioned on said second housing such that said left-turn button and said right-turn button are positioned for selectively depressing for compelling said second microprocessor for compelling said second transmitter for communicating the left-turn signal and right-turn signal to said first microprocessor via said first receiver, wherein said first microprocessor is positioned for selectively operationally coupling said first light and said second light to said first power module such that said first light and said second light are configured for blinking for selectively indicating the user's intent to execute right turns and left turns to the persons approaching the user from behind. 9. The assembly of claim 8, further including said second power module comprising at least one second battery. 10. The assembly of claim 8, further including said first receiver and said second transmitter being Bluetooth-enabled. 11. The assembly of claim 8, further comprising:
a second receiver coupled to said first housing and positioned in said internal space, said second receiver being operationally coupled to said first microprocessor, said second receiver being global positioning system enabled; a first transmitter coupled to said first housing and positioned in said internal space, said first transmitter being operationally coupled to said first microprocessor, said first transmitter being configured for wireless communication; and wherein said second receiver is positioned in said first housing such that said second receiver is configured for receiving location coordinates of the user and for relaying the location coordinates to said first microprocessor, wherein said first microprocessor is positioned for compelling said first transmitter for transmitting the location coordinates of the user. 12. The assembly of claim 1, further including a pair of fourth lights coupled to said shell, said fourth lights being positioned singly on said back and a front of said shell proximate to a top of said shell, said fourth lights being operationally coupled to said controller, said fourth lights being configured for irregular intermittent illumination, such that said fourth lights are strobing, wherein said fourth lights are positioned on said shell such that said controller is positioned for selectively operationally coupling said fourth lights to said first power module, wherein said fourth lights are configured for selectively illuminating spaces proximate to said back and said front of said shell. 13. The assembly of claim 12, further including each said fourth light comprising a plurality of fourth light emitting diodes. 14. The assembly of claim 1, further including a pair of fifth lights, said fifth lights being positioned singly on said right side and said left side of said shell proximate to a top of said shell, said fifth lights being operationally coupled to said controller, said fifth lights being configured for intermittent illumination, wherein said fifth lights are positioned on said shell such that said controller is positioned for selectively operationally coupling said fifth lights to said first power module, wherein said fifth lights are configured for blinking for increasing the visibility of the user to persons approaching the user from either side. 15. The assembly of claim 14, further including each said fifth light comprising a plurality of fifth light emitting diodes. 16. An illuminated safety helmet assembly comprising:
a shell substantially complementary to a helmet that is configured for coupling to a head of a user, said shell being configured for coupling to the helmet, said shell being integral to the helmet; a first power module coupled to said shell, said first power module comprising at least one first battery; a first light coupled to and positioned on a right side of said shell proximate to a back of said shell, said first light being configured for intermittent illumination, said first light being yellow, said first light comprising a plurality of first light emitting diodes; a second light coupled to and positioned on a left side of said shell proximate to said back of said shell, said second light being configured for intermittent illumination, said second light being yellow, said second light comprising a plurality of second light emitting diodes; a third light coupled to and centrally positioned on said back of said shell, said third light being red, said third light comprising a plurality of third light emitting diodes; a controller coupled to said shell, said controller being operationally coupled to said first power module, said first light, said second light, and said third light, said controller being configured for receiving commands from the user such that said controller is positioned for selectively operationally coupling said first light, said second light, and said third light, to said first power module such that the user is positioned for selectively indicating the user's intent to execute right turns and left turns and such that braking of a vehicle being operated by the user, such as a velocipede, is indicated to persons approaching the user from behind, said controller comprising:
a first housing defining an internal space,
a first microprocessor coupled to said first housing and positioned in said internal space, said first microprocessor being operationally coupled to said first power module,
a first receiver coupled to said first housing and positioned in said internal space, said first receiver being operationally coupled to said first microprocessor, said first receiver being configured for wireless communication, said first receiver being Bluetooth-enabled,
a second receiver coupled to said first housing and positioned in said internal space, said second receiver being operationally coupled to said first microprocessor, said second receiver being global positioning system enabled, wherein said second receiver is positioned in said first housing such that said second receiver is configured for receiving location coordinates of the user and for relaying the location coordinates to said first microprocessor, and
a first transmitter coupled to said first housing and positioned in said internal space, said first transmitter being operationally coupled to said first microprocessor, said first transmitter being configured for wireless communication, wherein said first microprocessor is positioned for compelling said first transmitter for transmitting the location coordinates of the user;
a pair of fourth lights coupled to said shell, said fourth lights being positioned singly on said back and a front of said shell proximate to a top of said shell, said fourth lights being operationally coupled to said controller, said fourth lights being configured for irregular intermittent illumination, such that said fourth lights are strobing, wherein said fourth lights are positioned on said shell such that said controller is positioned for selectively operationally coupling said fourth lights to said first power module, wherein said fourth lights are configured for selectively illuminating spaces proximate to said back and said front of said shell, each said fourth light comprising a plurality of fourth light emitting diodes; a pair of fifth lights, said fifth lights being positioned singly on said right side and said left side of said shell proximate to said top of said shell, said fifth lights being operationally coupled to said controller, said fifth lights being configured for intermittent illumination, wherein said fifth lights are positioned on said shell such that said controller is positioned for selectively operationally coupling said fifth lights to said first power module, wherein said fifth lights are configured for blinking for increasing the visibility of the user to persons approaching the user from either side, each said fifth light comprising a plurality of fifth light emitting diodes; a sensor configured for coupling to the vehicle, said sensor being configured for operationally coupling to a brake system of the vehicle, wherein said sensor is positioned on the vehicle such that said sensor is configured for detecting activation of the brake system of the vehicle; a control module configured for coupling to the vehicle, said control module being operationally coupled to said sensor, said control module being configured for selectively inputting requests for coupling of said first light and said second light to said first power module, said control module being configured for communicating with said controller, wherein said control module is positioned on the vehicle such that said control module is positioned for receiving input from said sensor upon said sensor detecting the activation of the brake system of the vehicle, wherein said control module is positioned for communicating the activation of the brake system of the vehicle to said controller, wherein said controller is positioned for selectively operationally coupling said third light to said first power module for indicating the activation of the brake system to the persons approaching the user from behind, wherein said control module is positioned to communicate the requests for coupling of said first light and said second light to said first power module such that said controller is positioned for selectively operationally coupling said first light and said second light to said first power module such that said first light and said second light are configured for blinking for selectively indicating the user's intent to execute right turns and left turns to the persons approaching the user from behind, said control module comprising:
a second housing defining an interior space,
a second power module coupled to said second housing and positioned in said interior space, said second power module comprising at least one second battery
a second microprocessor coupled to said second housing and positioned in said interior space, said second microprocessor being operationally coupled to said second power module,
a second transmitter coupled to said second housing and positioned in said interior space, said second transmitter being operationally coupled to said second microprocessor, said second transmitter being configured for wireless communication, said second transmitter being Bluetooth-enabled,
a left-turn button coupled to said second housing, said left-turn button being depressible, said left-turn button being operationally coupled to said second microprocessor,
a right-turn button coupled to said second housing, said right-turn button being depressible, said right-turn button being operationally coupled to said second microprocessor; and
wherein said sensor is positioned on the vehicle such that said sensor is configured for detecting activation of the brake system of the vehicle, wherein second microprocessor is positioned for compelling said second transmitter for communicating the activation of the brake system of the vehicle to said first microprocessor via said first receiver, wherein said first microprocessor is positioned for operationally coupling said third light to said first power module for indicating the activation of the brake system to the persons approaching the user from behind, and said left-turn button and said right-turn button are positioned on said second housing such that said left-turn button and said right-turn button are positioned for selectively depressing for compelling said second microprocessor for compelling said second transmitter for communicating the left-turn signal and right-turn signal to said first microprocessor via said first receiver, wherein said first microprocessor is positioned for selectively operationally coupling said first light and said second light to said first power module such that said first light and said second light are configured for blinking for selectively indicating the user's intent to execute right turns and left turns to the persons approaching the user from behind, wherein said fourth lights are configured for selectively illuminating the spaces proximate to said back and said front of said shell, wherein said fifth lights are positioned on said shell such that said controller is positioned for selectively operationally coupling said fifth lights to said first power module, wherein said fifth lights are configured for blinking for increasing the visibility of the user to the persons approaching the user from either side. | 2,800 |
11,759 | 11,759 | 15,483,504 | 2,875 | The disclosure relates to an interior trim part of a motor vehicle, which includes a support layer ( 10 ), a cover layer ( 14 ) on a front side of the support layer and an illumination unit ( 16 - 26 ) on an opposite rear side of the support layer. The support layer includes a perforation ( 12 ), which forms an illuminated structure when the illumination unit emits light through the perforation. | 1. An interior trim part of a motor vehicle, comprising:
a support layer, a cover layer on a front side of the support layer and an illumination unit on an opposite rear side of the support layer, wherein the support layer includes a perforation, which forms an illuminated structure, when the illumination unit emits light through the perforation. 2. The interior trim part according to claim 1, which is part of a roof lining or of a roof element of a panoramic or sunroof window of a motor vehicle. 3. The interior trim part according to claim 1, wherein the support layer is at least partially opaque and is only transparent in the region of the perforation. 4. The interior trim part according to claim 1, wherein the perforation comprises at least one of punctiform and linear openings, which are arranged in an irregular or regular pattern, an image or lettering. 5. The interior trim part according to claim 1, wherein the illumination unit is at least partially embedded into the rear side of the support layer. 6. The interior trim part according to claim 1, wherein the illumination unit comprises at least one of the following components: at least one LED light source, an OLED, an electroluminescence light source, a light conductor, or a light-conducting textile. 7. The interior trim part according to claim 1, wherein the illumination unit is arranged to illuminate different regions of the perforation in a time sequence, in order to produce the impression of animation or dynamics. 8. The interior trim part according to claim 7, including a control unit which is associated with the illumination unit in order to selectively illuminate different regions of the perforation. 9. The interior trim part according to claim 1, wherein the cover layer is translucent and comprises at least one of the following layers: a textile, a non-woven material, a woven material, a knitted material, a foil, a synthetic leather, a perforated leather, a foam layer, a spacer layer, a lacquer layer. 10. The interior trim part according to claim 1, wherein at least in the region of the perforation a translucent stabilizing layer is applied onto the support layer. 11. The interior trim part according to claim 10, wherein the stabilizing layer is applied to the front side of the support layer. 12. The interior trim part according to claim 10, wherein the stabilizing layer includes a translucent synthetic material film, a non-woven material, a woven material or a knitted material. 13. The interior trim part according to claim 1, wherein a covering layer is applied to the rear side of the illumination unit. 14. The interior trim part according to claim 1, wherein an image, a pattern or lettering is applied onto and/or into the cover layer. 15. The interior trim part according to claim 1, wherein the cover layer includes multiple layers. 16. The interior trim part according to claim 15, wherein images, patterns or letterings are applied in at least two layers of the cover layer. 17. An interior trim part of a motor vehicle, comprising:
at least partially opaque support layer, a cover layer on a front side of the support layer and an illumination unit on an opposite rear side of the support layer, wherein the support layer includes a perforation, which forms an illuminated structure, when the illumination unit emits light through the perforation; wherein the support layer is transparent in the region of the perforation; wherein the illumination unit is at least partially embedded into the rear side of the support layer. 18. The interior trim part according to claim 17, including a control unit associated with the illumination unit to control the illumination unit to selectively illuminate different regions of the perforation. 19. The interior trim part according to claim 18, wherein the control unit controls the illumination unit to selectively illuminate different regions of the perforation in a time sequence, to produce the impression of animation or dynamics. 20. The interior trim part of claim 17, which is an appliqué or an interior vehicle liner. | The disclosure relates to an interior trim part of a motor vehicle, which includes a support layer ( 10 ), a cover layer ( 14 ) on a front side of the support layer and an illumination unit ( 16 - 26 ) on an opposite rear side of the support layer. The support layer includes a perforation ( 12 ), which forms an illuminated structure when the illumination unit emits light through the perforation.1. An interior trim part of a motor vehicle, comprising:
a support layer, a cover layer on a front side of the support layer and an illumination unit on an opposite rear side of the support layer, wherein the support layer includes a perforation, which forms an illuminated structure, when the illumination unit emits light through the perforation. 2. The interior trim part according to claim 1, which is part of a roof lining or of a roof element of a panoramic or sunroof window of a motor vehicle. 3. The interior trim part according to claim 1, wherein the support layer is at least partially opaque and is only transparent in the region of the perforation. 4. The interior trim part according to claim 1, wherein the perforation comprises at least one of punctiform and linear openings, which are arranged in an irregular or regular pattern, an image or lettering. 5. The interior trim part according to claim 1, wherein the illumination unit is at least partially embedded into the rear side of the support layer. 6. The interior trim part according to claim 1, wherein the illumination unit comprises at least one of the following components: at least one LED light source, an OLED, an electroluminescence light source, a light conductor, or a light-conducting textile. 7. The interior trim part according to claim 1, wherein the illumination unit is arranged to illuminate different regions of the perforation in a time sequence, in order to produce the impression of animation or dynamics. 8. The interior trim part according to claim 7, including a control unit which is associated with the illumination unit in order to selectively illuminate different regions of the perforation. 9. The interior trim part according to claim 1, wherein the cover layer is translucent and comprises at least one of the following layers: a textile, a non-woven material, a woven material, a knitted material, a foil, a synthetic leather, a perforated leather, a foam layer, a spacer layer, a lacquer layer. 10. The interior trim part according to claim 1, wherein at least in the region of the perforation a translucent stabilizing layer is applied onto the support layer. 11. The interior trim part according to claim 10, wherein the stabilizing layer is applied to the front side of the support layer. 12. The interior trim part according to claim 10, wherein the stabilizing layer includes a translucent synthetic material film, a non-woven material, a woven material or a knitted material. 13. The interior trim part according to claim 1, wherein a covering layer is applied to the rear side of the illumination unit. 14. The interior trim part according to claim 1, wherein an image, a pattern or lettering is applied onto and/or into the cover layer. 15. The interior trim part according to claim 1, wherein the cover layer includes multiple layers. 16. The interior trim part according to claim 15, wherein images, patterns or letterings are applied in at least two layers of the cover layer. 17. An interior trim part of a motor vehicle, comprising:
at least partially opaque support layer, a cover layer on a front side of the support layer and an illumination unit on an opposite rear side of the support layer, wherein the support layer includes a perforation, which forms an illuminated structure, when the illumination unit emits light through the perforation; wherein the support layer is transparent in the region of the perforation; wherein the illumination unit is at least partially embedded into the rear side of the support layer. 18. The interior trim part according to claim 17, including a control unit associated with the illumination unit to control the illumination unit to selectively illuminate different regions of the perforation. 19. The interior trim part according to claim 18, wherein the control unit controls the illumination unit to selectively illuminate different regions of the perforation in a time sequence, to produce the impression of animation or dynamics. 20. The interior trim part of claim 17, which is an appliqué or an interior vehicle liner. | 2,800 |
11,760 | 11,760 | 15,354,616 | 2,844 | The invention relates to the control of networked lighting systems, particularly large scale networked lighting systems, and more specifically to an efficient transmission of messages to control luminaries of a networked lighting system. A basic idea of the invention is to provide an efficient and flexible multicast, particularly groupcast message that addresses several or a group of luminaires, and that can control the addressed luminaries in an efficient way by compressing the distributed light settings using a function in order to reduce the communicational overhead. An embodiment of the invention relates to a method for controlling a networked lighting system comprising the steps of
selecting several controllable luminaries of the networked lighting system (S 10 ), combining control information for each one of the selected luminaries to a set of control information (S 12 ), selecting at least one predetermined function for compressing the set of control information by associating an input related to a selected controllable luminary to the control information for the selected controllable luminary from the set of control information (S 14 ), creating a multicast message addressed to the selected luminaries and comprising information regarding the selected predetermined function (S 16 ), and transmitting the created multicast message (S 18 ). | 1-14. (canceled) 15. A luminary for a networked lighting system comprising:
a receiver for receiving a multicast message from a lighting controller of a networked lighting system, wherein the multicast message comprises a luminary related information field identifying several selected luminaries and a features field identifying a selected predetermined function, wherein the predetermined function has, as input values, luminaries information for a plurality of selected luminaries and, as output values, said control information for each one of the selected luminaries, a controller being configured to combine the features field of the transmitted multicast message and the own luminary information to calculate the value of the predetermined function which corresponds to a specific luminary control information and to set a lighting created by the luminary in accordance to the specific luminary control information. 16-18. (canceled) | The invention relates to the control of networked lighting systems, particularly large scale networked lighting systems, and more specifically to an efficient transmission of messages to control luminaries of a networked lighting system. A basic idea of the invention is to provide an efficient and flexible multicast, particularly groupcast message that addresses several or a group of luminaires, and that can control the addressed luminaries in an efficient way by compressing the distributed light settings using a function in order to reduce the communicational overhead. An embodiment of the invention relates to a method for controlling a networked lighting system comprising the steps of
selecting several controllable luminaries of the networked lighting system (S 10 ), combining control information for each one of the selected luminaries to a set of control information (S 12 ), selecting at least one predetermined function for compressing the set of control information by associating an input related to a selected controllable luminary to the control information for the selected controllable luminary from the set of control information (S 14 ), creating a multicast message addressed to the selected luminaries and comprising information regarding the selected predetermined function (S 16 ), and transmitting the created multicast message (S 18 ).1-14. (canceled) 15. A luminary for a networked lighting system comprising:
a receiver for receiving a multicast message from a lighting controller of a networked lighting system, wherein the multicast message comprises a luminary related information field identifying several selected luminaries and a features field identifying a selected predetermined function, wherein the predetermined function has, as input values, luminaries information for a plurality of selected luminaries and, as output values, said control information for each one of the selected luminaries, a controller being configured to combine the features field of the transmitted multicast message and the own luminary information to calculate the value of the predetermined function which corresponds to a specific luminary control information and to set a lighting created by the luminary in accordance to the specific luminary control information. 16-18. (canceled) | 2,800 |
11,761 | 11,761 | 14,441,225 | 2,857 | In a method for deghosting seismic data acquired by a marine seismic source and receiver assembly effects of seismic reflections by the water surface, known as ghost signals, are removed by a deghosting algorithm, which transforms input seismic data with the surface ghost reflections into source- and receiver-deghosted seismic data using a sparse-inversion technique both for hydrophone and/or geophone recordings, which technique includes equation (26), thereby considerably improving usuable bandwidth and giving rise to a significant imaging uplift. | 1. A method for deghosting seismic data acquired by a marine seismic source and receiver assembly, wherein effects of seismic reflections by the water surface, known as ghost signals, are removed by a deghosting algorithm which transforms input seismic data with the surface ghost reflections into source- and receiver-deghosted seismic data using a sparse-inversion technique, wherein the deghosting algorithm comprises a minimization scheme based on the formula
V (a)(ω)=D (a)(ω)−G (r)(ω)X(ω)G (s)(ω)W(ω), ∀ω
where the matrices V(a)(ω) denote residual terms such that V(a) rs(ω) is the residual at frequency ω of the signal from source s at receiver r, the matrices D(a)(ω) denote acquired data with or without multiples, the matrices X(ω) denote ghost-free data, the matrices W(ω) denote the wavelet information, and the matrices G(s,r)(ω) denote ghost functions, the latter being defined as
G (s)(x s′ , x s, ω)=∫dk ∥ e ik ∥ (x s −x s′ )γ(s)(k ⊥ , z s),
G (r)(x r , x r′, ω)=∫dk ∥ e ik ∥ (x r′ −x r )γ(r)(k ⊥ , z r),
γ(r)(k ⊥ , z r)=2i sin(k ⊥ z r),
γ(s)(k ⊥ , z s)=2i sin(k ⊥ z s)/(2i k ⊥ z s),
(ω/c)2=(k ∥)2+(k ⊥)2,
with c the p-wave velocity of the subsurface top layer and zs,r the depth of source (s) and receiver (r). 2. The method of claim 1, wherein the deghosting algorithm comprises a minimization scheme based on the formula
V (p)(ω)=D (p)(ω)−{tilde over (G)} (r)(ω)G (r)(ω)X(ω)G (s)(ω){tilde over (G)} (s)(ω)W(ω), ∀ω
where the matrices V(p)(ω) denote preconditioned residual terms defined as
V (p)(ω)={tilde over (G)} (r)(ω)V (a)(ω){tilde over (G)} (s)(ω), ∀ω,
the matrices D(p)(ω) denote preconditioned data terms defined as
D (p)(ω)={tilde over (G)} (r)(ω)D (a)(ω){tilde over (G)} (s)(ω), ∀ω,
and the matrices {tilde over (G)}(s,r)(ω) denote preconditioning functions, defined as
G
~
(
s
)
(
x
s
′
,
x
s
,
ω
)
=
∫
k
∥
k
∥
(
x
s
-
x
s
′
)
γ
~
(
s
)
(
k
⊥
,
z
s
)
,
G
~
(
r
)
(
x
r
,
x
r
′
,
ω
)
=
∫
k
∥
k
∥
(
x
r
′
-
x
r
)
γ
~
(
r
)
(
k
⊥
,
z
r
)
,
γ
~
(
r
)
=
γ
(
r
)
γ
(
r
)
2
+
ε
,
γ
~
(
s
)
=
γ
(
s
)
γ
(
s
)
2
+
ε
,
with ε<<1. 3. The method of claim 2, wherein the deghosting algorithm comprises a minimization scheme based on the formula
V (a)(ω)=D (a)(ω)−G (r)(ω)X 0(ω)G (s)(ω)W(ω)+G (r)(ω)X 0(ω)[G (r)(ω)]−1 D (a)(ω), ∀ω
where the matrices V(a)(ω) denote residual terms such that V(a) rs(ω) is the residual at frequency ω of the signal from source s at receiver r, the matrices D(a)(ω) denote acquired data with multiples, the matrices X0(ω) denote ghost-free and surface-multiple free data, the matrices W(ω) denote the wavelet information, and the matrices G(s,r)(ω) denote ghost functions, the latter being defined as
G (s)(x s′ , x s, ω)=∫dk ∥ e ik ∥ (x s −x s′ )γ(s)(k ⊥ , z s),
G (r)(x r , x r′, ω)=∫dk ∥ e ik ∥ (x r′ −x r )γ(r)(k ⊥ , z r),
γ(r)(k ⊥ , z r)=2i sin(k ⊥ z r),
γ(s)(k ⊥ , z s)=2i sin(k ⊥ z s)/(2i k ⊥ z s),
(ω/c)2=(k ∥)2+(k ⊥)2,
with c the p-wave velocity of the subsurface top layer and zs,r the depth of source (s) and receiver (r). 4. The method of claim 3, wherein the deghosting algorithm comprises a minimization scheme based on the formula
V (p)(ω)=D (p)(ω)−{tilde over (G)} (r)(ω)G (r)(ω)X0(ω)G (s)(ω){tilde over (G)} (s)(ω)W(ω)+{tilde over (G)} (r)(ω)G (r)(ω)X 0(ω)[{tilde over (G)} (r)(ω)G (r)(ω)]−1 D (p)(ω), ∀ω
where the matrices V(p)(ω) denote preconditioned residual terms defined as
V (p)(ω)={tilde over (G)} (r)(ω)V (a)(ω){tilde over (G)} (s)(ω), ∀ω,
the matrices D(p)(ω) denote preconditioned data terms defined as
D (p)(ω)={tilde over (G)} (r)(ω)D (a)(ω){tilde over (G)} (s)(ω), ∀ω,
and the matrices {tilde over (G)}(s,r)(ω) denote preconditioning functions, defined as
G
~
(
s
)
(
x
s
′
,
x
s
,
ω
)
=
∫
k
∥
k
∥
(
x
s
-
x
s
′
)
γ
~
(
s
)
(
k
⊥
,
z
s
)
,
G
~
(
r
)
(
x
r
,
x
r
′
,
ω
)
=
∫
k
∥
k
∥
(
x
r
′
-
x
r
)
γ
~
(
r
)
(
k
⊥
,
z
r
)
,
γ
~
(
r
)
=
γ
(
r
)
γ
(
r
)
2
+
ε
,
γ
~
(
s
)
=
γ
(
s
)
γ
(
s
)
2
+
ε
,
with ε<<1. 5. The method of claim 4, wherein the residual is approximated by
V (p)(ω)=D (p)(ω)−{tilde over (G)} (r)(ω)G (r)(ω)X 0(ω)G (s)(ω){tilde over (G)} (s)(ω)W(ω)+X 0(ω)D (p)(ω), ∀ω
by making the assumption that
∫dk x e ik x (x−x′){tilde over (γ)}(i)(k z , z i)γ(i)(k z , z i)˜δ(x−x′) for i=s, r,
of which the validity stems from the fact that γ(i){tilde over (γ)}(i)≈1 away from the ghost notches. | In a method for deghosting seismic data acquired by a marine seismic source and receiver assembly effects of seismic reflections by the water surface, known as ghost signals, are removed by a deghosting algorithm, which transforms input seismic data with the surface ghost reflections into source- and receiver-deghosted seismic data using a sparse-inversion technique both for hydrophone and/or geophone recordings, which technique includes equation (26), thereby considerably improving usuable bandwidth and giving rise to a significant imaging uplift.1. A method for deghosting seismic data acquired by a marine seismic source and receiver assembly, wherein effects of seismic reflections by the water surface, known as ghost signals, are removed by a deghosting algorithm which transforms input seismic data with the surface ghost reflections into source- and receiver-deghosted seismic data using a sparse-inversion technique, wherein the deghosting algorithm comprises a minimization scheme based on the formula
V (a)(ω)=D (a)(ω)−G (r)(ω)X(ω)G (s)(ω)W(ω), ∀ω
where the matrices V(a)(ω) denote residual terms such that V(a) rs(ω) is the residual at frequency ω of the signal from source s at receiver r, the matrices D(a)(ω) denote acquired data with or without multiples, the matrices X(ω) denote ghost-free data, the matrices W(ω) denote the wavelet information, and the matrices G(s,r)(ω) denote ghost functions, the latter being defined as
G (s)(x s′ , x s, ω)=∫dk ∥ e ik ∥ (x s −x s′ )γ(s)(k ⊥ , z s),
G (r)(x r , x r′, ω)=∫dk ∥ e ik ∥ (x r′ −x r )γ(r)(k ⊥ , z r),
γ(r)(k ⊥ , z r)=2i sin(k ⊥ z r),
γ(s)(k ⊥ , z s)=2i sin(k ⊥ z s)/(2i k ⊥ z s),
(ω/c)2=(k ∥)2+(k ⊥)2,
with c the p-wave velocity of the subsurface top layer and zs,r the depth of source (s) and receiver (r). 2. The method of claim 1, wherein the deghosting algorithm comprises a minimization scheme based on the formula
V (p)(ω)=D (p)(ω)−{tilde over (G)} (r)(ω)G (r)(ω)X(ω)G (s)(ω){tilde over (G)} (s)(ω)W(ω), ∀ω
where the matrices V(p)(ω) denote preconditioned residual terms defined as
V (p)(ω)={tilde over (G)} (r)(ω)V (a)(ω){tilde over (G)} (s)(ω), ∀ω,
the matrices D(p)(ω) denote preconditioned data terms defined as
D (p)(ω)={tilde over (G)} (r)(ω)D (a)(ω){tilde over (G)} (s)(ω), ∀ω,
and the matrices {tilde over (G)}(s,r)(ω) denote preconditioning functions, defined as
G
~
(
s
)
(
x
s
′
,
x
s
,
ω
)
=
∫
k
∥
k
∥
(
x
s
-
x
s
′
)
γ
~
(
s
)
(
k
⊥
,
z
s
)
,
G
~
(
r
)
(
x
r
,
x
r
′
,
ω
)
=
∫
k
∥
k
∥
(
x
r
′
-
x
r
)
γ
~
(
r
)
(
k
⊥
,
z
r
)
,
γ
~
(
r
)
=
γ
(
r
)
γ
(
r
)
2
+
ε
,
γ
~
(
s
)
=
γ
(
s
)
γ
(
s
)
2
+
ε
,
with ε<<1. 3. The method of claim 2, wherein the deghosting algorithm comprises a minimization scheme based on the formula
V (a)(ω)=D (a)(ω)−G (r)(ω)X 0(ω)G (s)(ω)W(ω)+G (r)(ω)X 0(ω)[G (r)(ω)]−1 D (a)(ω), ∀ω
where the matrices V(a)(ω) denote residual terms such that V(a) rs(ω) is the residual at frequency ω of the signal from source s at receiver r, the matrices D(a)(ω) denote acquired data with multiples, the matrices X0(ω) denote ghost-free and surface-multiple free data, the matrices W(ω) denote the wavelet information, and the matrices G(s,r)(ω) denote ghost functions, the latter being defined as
G (s)(x s′ , x s, ω)=∫dk ∥ e ik ∥ (x s −x s′ )γ(s)(k ⊥ , z s),
G (r)(x r , x r′, ω)=∫dk ∥ e ik ∥ (x r′ −x r )γ(r)(k ⊥ , z r),
γ(r)(k ⊥ , z r)=2i sin(k ⊥ z r),
γ(s)(k ⊥ , z s)=2i sin(k ⊥ z s)/(2i k ⊥ z s),
(ω/c)2=(k ∥)2+(k ⊥)2,
with c the p-wave velocity of the subsurface top layer and zs,r the depth of source (s) and receiver (r). 4. The method of claim 3, wherein the deghosting algorithm comprises a minimization scheme based on the formula
V (p)(ω)=D (p)(ω)−{tilde over (G)} (r)(ω)G (r)(ω)X0(ω)G (s)(ω){tilde over (G)} (s)(ω)W(ω)+{tilde over (G)} (r)(ω)G (r)(ω)X 0(ω)[{tilde over (G)} (r)(ω)G (r)(ω)]−1 D (p)(ω), ∀ω
where the matrices V(p)(ω) denote preconditioned residual terms defined as
V (p)(ω)={tilde over (G)} (r)(ω)V (a)(ω){tilde over (G)} (s)(ω), ∀ω,
the matrices D(p)(ω) denote preconditioned data terms defined as
D (p)(ω)={tilde over (G)} (r)(ω)D (a)(ω){tilde over (G)} (s)(ω), ∀ω,
and the matrices {tilde over (G)}(s,r)(ω) denote preconditioning functions, defined as
G
~
(
s
)
(
x
s
′
,
x
s
,
ω
)
=
∫
k
∥
k
∥
(
x
s
-
x
s
′
)
γ
~
(
s
)
(
k
⊥
,
z
s
)
,
G
~
(
r
)
(
x
r
,
x
r
′
,
ω
)
=
∫
k
∥
k
∥
(
x
r
′
-
x
r
)
γ
~
(
r
)
(
k
⊥
,
z
r
)
,
γ
~
(
r
)
=
γ
(
r
)
γ
(
r
)
2
+
ε
,
γ
~
(
s
)
=
γ
(
s
)
γ
(
s
)
2
+
ε
,
with ε<<1. 5. The method of claim 4, wherein the residual is approximated by
V (p)(ω)=D (p)(ω)−{tilde over (G)} (r)(ω)G (r)(ω)X 0(ω)G (s)(ω){tilde over (G)} (s)(ω)W(ω)+X 0(ω)D (p)(ω), ∀ω
by making the assumption that
∫dk x e ik x (x−x′){tilde over (γ)}(i)(k z , z i)γ(i)(k z , z i)˜δ(x−x′) for i=s, r,
of which the validity stems from the fact that γ(i){tilde over (γ)}(i)≈1 away from the ghost notches. | 2,800 |
11,762 | 11,762 | 14,825,243 | 2,836 | A component monitoring system structured to monitor circuit breaker assembly component characteristics is provided. The component monitoring system includes a record assembly, a number of sensor assemblies, a comparison assembly, and an output assembly. The record assembly includes selected nominal data for a selected circuit breaker component. The sensor assembly is structured to measure a number of actual component characteristics of a selected circuit breaker component and to transmit actual component characteristic output data. The comparison assembly is structured to receive an electronic signal from said record assembly and said sensor assemblies, to compare said sensor assembly actual component characteristic output data to said selected nominal data and to provide an indication signal as to whether said sensor assembly output data is acceptable when compared to the selected nominal data. The output assembly includes a communication assembly and an output device. | 1. A circuit breaker assembly component monitoring system structured to monitor circuit breaker assembly component characteristics, said system comprising:
a record assembly including selected nominal data for a selected circuit breaker component; a number of sensor assemblies structured to measure a number of actual component characteristics of a number of selected circuit breaker components and to transmit actual component characteristic output data; a comparison assembly structured to receive an electronic signal from said record assembly and said sensor assemblies, to compare said sensor assembly actual component characteristic output data to said selected nominal data and to provide an indication signal as to whether said sensor assembly output data is acceptable when compared to the selected nominal data; an output assembly including a communication assembly and an output device; said communication assembly structured to receive said indication signal from said comparison assembly and to communicate a signal to said output device; each sensor assembly in electronic communication with said comparison assembly; and said comparison assembly in electronic communication with said communication assembly. 2. The component monitoring system of claim 1 wherein:
said comparison assembly includes a processing assembly, an input/output device, and a comparison module;
said processing assembly structured to execute said comparison module; and
said comparison assembly structured to compare said sensor assembly actual component characteristic output data to said selected nominal data and to provide an indication signal representing an indication of remaining useful life for a selected circuit breaker component. 3. The component monitoring system of claim 2 wherein:
the indication of remaining useful life is calculated according to the equation:
y 1=β1ƒ1(x 1 i )+β2ƒ2(x 2 1 )+β3ƒ3(x 3 1 )+ . . . +βkƒk(x k 1 )+ε1
wherein:
y=actual component characteristic output data at certain times size (n×1)
T=Time function or forms of functions containing time (t)∈(ƒ1(t1), ƒ2(t2), . . . , ƒk((tk))
X=relation between dependent and independent variables ∈(ƒ1(x1), ƒ2(x2), . . . , ƒk ((xk))
β=Vector with k parameters forming model equation=[β1β2 . . . βk]Tƒ1(x),ƒ2(t)
ε˜N(O,σ2)=independent and identically distributed random variable (iid) ∈(ε1, ε2, ε3, . . . , εn). 4. The component monitoring system of claim 2 wherein:
the indication of remaining useful life is calculated according to the equation:
T
(
t
)
-
T
∞
=
b
a
+
(
T
i
-
T
∞
-
b
a
)
exp
(
-
at
)
wherein:
T(t)=Temperature of the system at any given time (t)
Ti=Initial temperature of the system (° C.)
T∞=Ambient temperature (° C.)
a and b are constants determined by material properties, heat source and other transient heat transfer model constants
y
1
=
β
0
X
0
+
β
1
X
1
+
ɛ
i
with
β
0
=
b
a
and
β
1
=
(
T
i
-
T
∞
-
b
a
)
where
,
X
=
exp
(
-
at
)
and
y
=
T
(
t
)
-
T
∞
. 5. The component monitoring system of claim 2 wherein:
the indication of remaining useful life is calculated according to the equation:
T
∝
VI
;
T
∝
T
∞
;
and
T
∝
1
/
u
T
=
a
+
b
×
VI
+
c
×
T
∞
+
d
u
->
β
0
=
a
;
β
1
=
b
;
β
2
=
c
;
and
β
3
=
d
wherein:
T=Temperature of the system at any given instant
I=Electric Current in Amperes and V=voltage drop in Volts constituting Joule's heating
T∞=Ambient temperature (° C.)
u=Air velocity around the conductor (in m/s). 6. The component monitoring system of claim 2 wherein said comparison module includes a stress sensor module, a control circuit monitoring module, an open/close evaluation module and charging monitoring module. 7. The component monitoring system of claim 2 wherein:
said comparison assembly includes a modular housing assembly;
said modular housing assembly including a number of sidewalls and a selectable coupling;
said modular housing assembly sidewalls defining an enclosed space; and
said processing assembly disposed within said modular housing assembly enclosed space. 8. The component monitoring system of claim 5 wherein:
said modular housing assembly includes a number of communication ports;
each said modular housing assembly communication port in electronic communication with said processing assembly; and
each said modular housing assembly communication port in electronic communication with a sensor assembly. 9. The component monitoring system of claim 1 wherein said record assembly includes initial selected nominal data and at least one of acquired selected nominal data or local acquired selected data. 10. The component monitoring system of claim 1 wherein said selected nominal data is stored as a reduced data set. 11. A circuit breaker assembly comprising:
an operating mechanism including a number of components; a component monitoring system structured to monitor circuit breaker assembly component characteristics, said component monitoring system including a record assembly, a number of sensor assemblies, a comparison assembly, and an output assembly; said record assembly including selected nominal data for a selected circuit breaker component; each sensor assembly structured to measure a number of actual component characteristics of a number of selected circuit breaker components and to transmit actual component characteristic output data; said comparison assembly structured to receive an electronic signal from said record assembly and said sensor assemblies, to compare said sensor assembly actual component characteristic output data to said selected nominal data and to provide an indication signal as to whether said sensor assembly output data is acceptable when compared to the selected nominal data; said output assembly including a communication assembly and an output device; said communication assembly structured to receive said indication signal from said comparison assembly and to communicate a signal to said output device; and each sensor assembly in electronic communication with said comparison assembly; said comparison assembly in electronic communication with said communication assembly. 12. The circuit breaker assembly of claim 11 wherein:
said comparison assembly includes a processing assembly, an input/output device, and a comparison module;
said processing assembly structured to execute said comparison module; and
said comparison assembly structured to compare said sensor assembly actual component characteristic output data to said selected nominal data and to provide an indication signal representing an indication of remaining useful life for a selected circuit breaker component. 13. The circuit breaker assembly of claim 12 wherein:
the indication of remaining useful life is calculated according to the equation:
y 1=β1ƒ1(x 1 i )+β2ƒ2(x 2 1 )+β3ƒ3(x 3 1 )+ . . . +βkƒk(x k 1 )+ε1
wherein:
y=actual component characteristic output data at certain times size (n×1)
T=Time function or forms of functions containing time (t)∈(ƒ1(t1), ƒ2 (t2), . . . , ƒk((tk))
X=relation between dependent and independent variables ∈(ƒ1(x1), ƒ2(x2), . . . , ƒk ((xk))
β=Vector with k parameters forming model equation=[β1β2 . . . βk]Tƒ1(x),ƒ2 (t)
δ˜N(O,σ2)=independent and identically distributed random variable (iid) ∈(ε1,ε2,ε3, . . . , εn). 14. The circuit breaker assembly of claim 12 wherein:
the indication of remaining useful life is calculated according to the equation:
T
(
t
)
-
T
∞
=
b
a
+
(
T
i
-
T
∞
-
b
a
)
exp
(
-
at
)
wherein:
T(t)=Temperature of the system at any given time (t)
Ti=Initial temperature of the system (° C.)
T∞=Ambient temperature (° C.)
a and b are constants determined by material properties, heat source and other transient heat transfer model constants
y
1
=
β
0
X
0
+
β
1
X
1
+
ɛ
i
with
β
0
=
b
a
and
β
1
=
(
T
i
-
T
∞
-
b
a
)
where
,
X
=
exp
(
-
at
)
and
y
=
T
(
t
)
-
T
∞
. 15. The circuit breaker assembly of claim 12 wherein:
the indication of remaining useful life is calculated according to the equation:
T
∝
VI
;
T
∝
T
∞
;
and
T
∝
1
/
u
T
=
a
+
b
×
VI
+
c
×
T
∞
+
d
u
->
β
0
=
a
;
β
1
=
b
;
β
2
=
c
;
and
β
3
=
d
wherein:
T=Temperature of the system at any given instant
I=Electric Current in Amperes and V=voltage drop in Volts constituting Joule's heating
T∞=Ambient temperature (° C.)
u=Air velocity around the conductor (in m/s). 16. The circuit breaker assembly of claim 12 wherein said comparison module includes a stress sensor module, a control circuit monitoring module, an openiclose evaluation module and charging monitoring module. 17. The circuit breaker assembly of claim 12 wherein:
said comparison assembly includes a modular housing assembly;
said modular housing assembly including a number of sidewalls and a selectable coupling;
said modular housing assembly sidewalls defining an enclosed space; and
said processing assembly disposed within said modular housing assembly enclosed space. 18. The circuit breaker assembly of claim 15 wherein:
said modular housing assembly includes a number of communication ports;
each said modular housing assembly communication port in electronic communication with said processing assembly; and
each said modular housing assembly communication port in electronic communication with a sensor assembly. 19. The circuit breaker assembly of claim 11 wherein said record assembly includes initial selected nominal data and at least one of acquired selected nominal data or local acquired selected data. 20. The circuit breaker assembly of claim 11 wherein said selected nominal data is stored as a reduced data set. | A component monitoring system structured to monitor circuit breaker assembly component characteristics is provided. The component monitoring system includes a record assembly, a number of sensor assemblies, a comparison assembly, and an output assembly. The record assembly includes selected nominal data for a selected circuit breaker component. The sensor assembly is structured to measure a number of actual component characteristics of a selected circuit breaker component and to transmit actual component characteristic output data. The comparison assembly is structured to receive an electronic signal from said record assembly and said sensor assemblies, to compare said sensor assembly actual component characteristic output data to said selected nominal data and to provide an indication signal as to whether said sensor assembly output data is acceptable when compared to the selected nominal data. The output assembly includes a communication assembly and an output device.1. A circuit breaker assembly component monitoring system structured to monitor circuit breaker assembly component characteristics, said system comprising:
a record assembly including selected nominal data for a selected circuit breaker component; a number of sensor assemblies structured to measure a number of actual component characteristics of a number of selected circuit breaker components and to transmit actual component characteristic output data; a comparison assembly structured to receive an electronic signal from said record assembly and said sensor assemblies, to compare said sensor assembly actual component characteristic output data to said selected nominal data and to provide an indication signal as to whether said sensor assembly output data is acceptable when compared to the selected nominal data; an output assembly including a communication assembly and an output device; said communication assembly structured to receive said indication signal from said comparison assembly and to communicate a signal to said output device; each sensor assembly in electronic communication with said comparison assembly; and said comparison assembly in electronic communication with said communication assembly. 2. The component monitoring system of claim 1 wherein:
said comparison assembly includes a processing assembly, an input/output device, and a comparison module;
said processing assembly structured to execute said comparison module; and
said comparison assembly structured to compare said sensor assembly actual component characteristic output data to said selected nominal data and to provide an indication signal representing an indication of remaining useful life for a selected circuit breaker component. 3. The component monitoring system of claim 2 wherein:
the indication of remaining useful life is calculated according to the equation:
y 1=β1ƒ1(x 1 i )+β2ƒ2(x 2 1 )+β3ƒ3(x 3 1 )+ . . . +βkƒk(x k 1 )+ε1
wherein:
y=actual component characteristic output data at certain times size (n×1)
T=Time function or forms of functions containing time (t)∈(ƒ1(t1), ƒ2(t2), . . . , ƒk((tk))
X=relation between dependent and independent variables ∈(ƒ1(x1), ƒ2(x2), . . . , ƒk ((xk))
β=Vector with k parameters forming model equation=[β1β2 . . . βk]Tƒ1(x),ƒ2(t)
ε˜N(O,σ2)=independent and identically distributed random variable (iid) ∈(ε1, ε2, ε3, . . . , εn). 4. The component monitoring system of claim 2 wherein:
the indication of remaining useful life is calculated according to the equation:
T
(
t
)
-
T
∞
=
b
a
+
(
T
i
-
T
∞
-
b
a
)
exp
(
-
at
)
wherein:
T(t)=Temperature of the system at any given time (t)
Ti=Initial temperature of the system (° C.)
T∞=Ambient temperature (° C.)
a and b are constants determined by material properties, heat source and other transient heat transfer model constants
y
1
=
β
0
X
0
+
β
1
X
1
+
ɛ
i
with
β
0
=
b
a
and
β
1
=
(
T
i
-
T
∞
-
b
a
)
where
,
X
=
exp
(
-
at
)
and
y
=
T
(
t
)
-
T
∞
. 5. The component monitoring system of claim 2 wherein:
the indication of remaining useful life is calculated according to the equation:
T
∝
VI
;
T
∝
T
∞
;
and
T
∝
1
/
u
T
=
a
+
b
×
VI
+
c
×
T
∞
+
d
u
->
β
0
=
a
;
β
1
=
b
;
β
2
=
c
;
and
β
3
=
d
wherein:
T=Temperature of the system at any given instant
I=Electric Current in Amperes and V=voltage drop in Volts constituting Joule's heating
T∞=Ambient temperature (° C.)
u=Air velocity around the conductor (in m/s). 6. The component monitoring system of claim 2 wherein said comparison module includes a stress sensor module, a control circuit monitoring module, an open/close evaluation module and charging monitoring module. 7. The component monitoring system of claim 2 wherein:
said comparison assembly includes a modular housing assembly;
said modular housing assembly including a number of sidewalls and a selectable coupling;
said modular housing assembly sidewalls defining an enclosed space; and
said processing assembly disposed within said modular housing assembly enclosed space. 8. The component monitoring system of claim 5 wherein:
said modular housing assembly includes a number of communication ports;
each said modular housing assembly communication port in electronic communication with said processing assembly; and
each said modular housing assembly communication port in electronic communication with a sensor assembly. 9. The component monitoring system of claim 1 wherein said record assembly includes initial selected nominal data and at least one of acquired selected nominal data or local acquired selected data. 10. The component monitoring system of claim 1 wherein said selected nominal data is stored as a reduced data set. 11. A circuit breaker assembly comprising:
an operating mechanism including a number of components; a component monitoring system structured to monitor circuit breaker assembly component characteristics, said component monitoring system including a record assembly, a number of sensor assemblies, a comparison assembly, and an output assembly; said record assembly including selected nominal data for a selected circuit breaker component; each sensor assembly structured to measure a number of actual component characteristics of a number of selected circuit breaker components and to transmit actual component characteristic output data; said comparison assembly structured to receive an electronic signal from said record assembly and said sensor assemblies, to compare said sensor assembly actual component characteristic output data to said selected nominal data and to provide an indication signal as to whether said sensor assembly output data is acceptable when compared to the selected nominal data; said output assembly including a communication assembly and an output device; said communication assembly structured to receive said indication signal from said comparison assembly and to communicate a signal to said output device; and each sensor assembly in electronic communication with said comparison assembly; said comparison assembly in electronic communication with said communication assembly. 12. The circuit breaker assembly of claim 11 wherein:
said comparison assembly includes a processing assembly, an input/output device, and a comparison module;
said processing assembly structured to execute said comparison module; and
said comparison assembly structured to compare said sensor assembly actual component characteristic output data to said selected nominal data and to provide an indication signal representing an indication of remaining useful life for a selected circuit breaker component. 13. The circuit breaker assembly of claim 12 wherein:
the indication of remaining useful life is calculated according to the equation:
y 1=β1ƒ1(x 1 i )+β2ƒ2(x 2 1 )+β3ƒ3(x 3 1 )+ . . . +βkƒk(x k 1 )+ε1
wherein:
y=actual component characteristic output data at certain times size (n×1)
T=Time function or forms of functions containing time (t)∈(ƒ1(t1), ƒ2 (t2), . . . , ƒk((tk))
X=relation between dependent and independent variables ∈(ƒ1(x1), ƒ2(x2), . . . , ƒk ((xk))
β=Vector with k parameters forming model equation=[β1β2 . . . βk]Tƒ1(x),ƒ2 (t)
δ˜N(O,σ2)=independent and identically distributed random variable (iid) ∈(ε1,ε2,ε3, . . . , εn). 14. The circuit breaker assembly of claim 12 wherein:
the indication of remaining useful life is calculated according to the equation:
T
(
t
)
-
T
∞
=
b
a
+
(
T
i
-
T
∞
-
b
a
)
exp
(
-
at
)
wherein:
T(t)=Temperature of the system at any given time (t)
Ti=Initial temperature of the system (° C.)
T∞=Ambient temperature (° C.)
a and b are constants determined by material properties, heat source and other transient heat transfer model constants
y
1
=
β
0
X
0
+
β
1
X
1
+
ɛ
i
with
β
0
=
b
a
and
β
1
=
(
T
i
-
T
∞
-
b
a
)
where
,
X
=
exp
(
-
at
)
and
y
=
T
(
t
)
-
T
∞
. 15. The circuit breaker assembly of claim 12 wherein:
the indication of remaining useful life is calculated according to the equation:
T
∝
VI
;
T
∝
T
∞
;
and
T
∝
1
/
u
T
=
a
+
b
×
VI
+
c
×
T
∞
+
d
u
->
β
0
=
a
;
β
1
=
b
;
β
2
=
c
;
and
β
3
=
d
wherein:
T=Temperature of the system at any given instant
I=Electric Current in Amperes and V=voltage drop in Volts constituting Joule's heating
T∞=Ambient temperature (° C.)
u=Air velocity around the conductor (in m/s). 16. The circuit breaker assembly of claim 12 wherein said comparison module includes a stress sensor module, a control circuit monitoring module, an openiclose evaluation module and charging monitoring module. 17. The circuit breaker assembly of claim 12 wherein:
said comparison assembly includes a modular housing assembly;
said modular housing assembly including a number of sidewalls and a selectable coupling;
said modular housing assembly sidewalls defining an enclosed space; and
said processing assembly disposed within said modular housing assembly enclosed space. 18. The circuit breaker assembly of claim 15 wherein:
said modular housing assembly includes a number of communication ports;
each said modular housing assembly communication port in electronic communication with said processing assembly; and
each said modular housing assembly communication port in electronic communication with a sensor assembly. 19. The circuit breaker assembly of claim 11 wherein said record assembly includes initial selected nominal data and at least one of acquired selected nominal data or local acquired selected data. 20. The circuit breaker assembly of claim 11 wherein said selected nominal data is stored as a reduced data set. | 2,800 |
11,763 | 11,763 | 15,107,193 | 2,865 | A system includes a memory and a processor coupled to the memory. The processor receives a description of a pressure system, including a plurality of components to be tested, where each component has a required test pressure. The processor generates a first test sequence that tests the required test pressure of each of the plurality of components, where the first test sequence includes a first number of steps. The processor also iteratively generates a second test sequence that tests the required test pressure of each of the plurality of components, where the second test sequence comprises a second number of steps. The processor stores a representation of at least one of the first test sequence and the second test sequence in the memory, and the second number of steps is less than the first number of steps. | 1. A system, comprising:
a memory; and a processor coupled to the memory, the processor configured to:
receive a description of a pressure system, including a plurality of components to be tested, each component having a required test pressure;
generate a first test sequence that tests the required test pressure of each of the plurality of components, wherein the first test sequence comprises a first number of steps;
iteratively generate a second test sequence that tests the required test pressure of each of the plurality of components, wherein the second test sequence comprises a second number of steps; and
store a representation of at least one of the first test sequence and the second test sequence in the memory;
wherein the second number of steps is less than the first number of steps. 2. The system of claim 1 further comprising a display device coupled to the processor, wherein the processor is further configured to verify that the second test sequence tests the required test pressure of each of the plurality of components and, upon verification, cause the display device to display an indication of verification. 3. The system of claim 1 wherein at least one of the plurality of components comprises more than one test side and the first and second test sequences test the required test pressure for all test sides of the one of the plurality components. 4. The system of claim 3 wherein a required test pressure for a first test side is different than a required test pressure for a second test side. 5. The system of claim 1 wherein the first test sequence includes a step that causes a rated pressure of one of the components to be exceeded and wherein the second test sequence eliminates the step that causes the rated pressure to be exceeded. 6. The system of claim 1 further comprising a display device, wherein the processor is further configured to:
receive a manual override request that alters a step of either test sequence such that the step causes a rated pressure of one of the components to be exceeded; and
as a result of a determination that the rated pressure is exceeded, cause the display device to display a warning indication. 7. A method, comprising:
receiving, by a processor, a description of a pressure system, including a plurality of components to be tested, each component having a required test pressure; generating, by the processor, a first test sequence that tests the required test pressure of each of the plurality of components, wherein the first test sequence comprises a first number of steps; and iteratively generating, by the processor, a second test sequence that tests the required test pressure of each of the plurality of components, wherein the second test sequence comprises a second number of steps; wherein the second number of steps is less than the first number of steps. 8. The method of claim 7 further comprising verifying, by the processor, that the second test sequence tests the required test pressure of each of the plurality of components and, upon verification, causing a display device to display an indication of verification. 9. The method of claim 7 wherein at least one of the plurality of components comprises more than one test side and the first and second test sequences test the required test pressure for all test sides of the one of the plurality components. 10. The method of claim 9 wherein a required test pressure for a first test side is different than a required test pressure for a second test side. 11. The method of claim 7 wherein the first test sequence includes a step that causes a rated pressure of one of the components to be exceeded and wherein the second test sequence eliminates the step that causes the rated pressure to be exceeded. 12. The method of claim 7 further comprising receiving, by the processor, a manual override request that alters a step of either test sequence such that the step causes a rated pressure of one of the components to be exceeded and, as a result of determining that the rated pressure is exceeded, causing a display device to display a warning indication. 13. A non-transitory computer-readable medium containing instructions that, when executed by a processor, cause the processor to:
receive a description of a pressure system, including a plurality of components to be tested, each component having a required test pressure; generate a first test sequence that tests the required test pressure of each of the plurality of components, wherein the first test sequence comprises a first number of steps; iteratively generate a second test sequence that tests the required test pressure of each of the plurality of components, wherein the second test sequence comprises a second number of steps; and store a representation of at least one of the first test sequence and the second test sequence in a memory; wherein the second number of steps is less than the first number of steps. 14. The non-transitory computer-readable medium of claim 13 wherein the processor is further caused to verify that the second test sequence tests the required test pressure of each of the plurality of components and, upon verification, cause a display device coupled to the processor to display an indication of verification. 15. The non-transitory computer-readable medium of claim 13 wherein at least one of the plurality of components comprises more than one test side and the first and second test sequences test the required test pressure for all test sides of the one of the plurality components. 16. The non-transitory computer-readable medium of claim 15 wherein a required test pressure for a first test side is different than a required test pressure for a second test side. 17. The non-transitory computer-readable medium of claim 13 wherein the first test sequence includes a step that causes a rated pressure of one of the components to be exceeded and wherein the second test sequence eliminates the step that causes the rated pressure to be exceeded. 18. The non-transitory computer-readable medium of claim 13 wherein the processor is further caused to:
receive a manual override request that alters a step of either test sequence such that the step causes a rated pressure of one of the components to be exceeded; and
as a result of a determination that the rated pressure is exceeded, cause a display device coupled to the processor to display a warning indication. | A system includes a memory and a processor coupled to the memory. The processor receives a description of a pressure system, including a plurality of components to be tested, where each component has a required test pressure. The processor generates a first test sequence that tests the required test pressure of each of the plurality of components, where the first test sequence includes a first number of steps. The processor also iteratively generates a second test sequence that tests the required test pressure of each of the plurality of components, where the second test sequence comprises a second number of steps. The processor stores a representation of at least one of the first test sequence and the second test sequence in the memory, and the second number of steps is less than the first number of steps.1. A system, comprising:
a memory; and a processor coupled to the memory, the processor configured to:
receive a description of a pressure system, including a plurality of components to be tested, each component having a required test pressure;
generate a first test sequence that tests the required test pressure of each of the plurality of components, wherein the first test sequence comprises a first number of steps;
iteratively generate a second test sequence that tests the required test pressure of each of the plurality of components, wherein the second test sequence comprises a second number of steps; and
store a representation of at least one of the first test sequence and the second test sequence in the memory;
wherein the second number of steps is less than the first number of steps. 2. The system of claim 1 further comprising a display device coupled to the processor, wherein the processor is further configured to verify that the second test sequence tests the required test pressure of each of the plurality of components and, upon verification, cause the display device to display an indication of verification. 3. The system of claim 1 wherein at least one of the plurality of components comprises more than one test side and the first and second test sequences test the required test pressure for all test sides of the one of the plurality components. 4. The system of claim 3 wherein a required test pressure for a first test side is different than a required test pressure for a second test side. 5. The system of claim 1 wherein the first test sequence includes a step that causes a rated pressure of one of the components to be exceeded and wherein the second test sequence eliminates the step that causes the rated pressure to be exceeded. 6. The system of claim 1 further comprising a display device, wherein the processor is further configured to:
receive a manual override request that alters a step of either test sequence such that the step causes a rated pressure of one of the components to be exceeded; and
as a result of a determination that the rated pressure is exceeded, cause the display device to display a warning indication. 7. A method, comprising:
receiving, by a processor, a description of a pressure system, including a plurality of components to be tested, each component having a required test pressure; generating, by the processor, a first test sequence that tests the required test pressure of each of the plurality of components, wherein the first test sequence comprises a first number of steps; and iteratively generating, by the processor, a second test sequence that tests the required test pressure of each of the plurality of components, wherein the second test sequence comprises a second number of steps; wherein the second number of steps is less than the first number of steps. 8. The method of claim 7 further comprising verifying, by the processor, that the second test sequence tests the required test pressure of each of the plurality of components and, upon verification, causing a display device to display an indication of verification. 9. The method of claim 7 wherein at least one of the plurality of components comprises more than one test side and the first and second test sequences test the required test pressure for all test sides of the one of the plurality components. 10. The method of claim 9 wherein a required test pressure for a first test side is different than a required test pressure for a second test side. 11. The method of claim 7 wherein the first test sequence includes a step that causes a rated pressure of one of the components to be exceeded and wherein the second test sequence eliminates the step that causes the rated pressure to be exceeded. 12. The method of claim 7 further comprising receiving, by the processor, a manual override request that alters a step of either test sequence such that the step causes a rated pressure of one of the components to be exceeded and, as a result of determining that the rated pressure is exceeded, causing a display device to display a warning indication. 13. A non-transitory computer-readable medium containing instructions that, when executed by a processor, cause the processor to:
receive a description of a pressure system, including a plurality of components to be tested, each component having a required test pressure; generate a first test sequence that tests the required test pressure of each of the plurality of components, wherein the first test sequence comprises a first number of steps; iteratively generate a second test sequence that tests the required test pressure of each of the plurality of components, wherein the second test sequence comprises a second number of steps; and store a representation of at least one of the first test sequence and the second test sequence in a memory; wherein the second number of steps is less than the first number of steps. 14. The non-transitory computer-readable medium of claim 13 wherein the processor is further caused to verify that the second test sequence tests the required test pressure of each of the plurality of components and, upon verification, cause a display device coupled to the processor to display an indication of verification. 15. The non-transitory computer-readable medium of claim 13 wherein at least one of the plurality of components comprises more than one test side and the first and second test sequences test the required test pressure for all test sides of the one of the plurality components. 16. The non-transitory computer-readable medium of claim 15 wherein a required test pressure for a first test side is different than a required test pressure for a second test side. 17. The non-transitory computer-readable medium of claim 13 wherein the first test sequence includes a step that causes a rated pressure of one of the components to be exceeded and wherein the second test sequence eliminates the step that causes the rated pressure to be exceeded. 18. The non-transitory computer-readable medium of claim 13 wherein the processor is further caused to:
receive a manual override request that alters a step of either test sequence such that the step causes a rated pressure of one of the components to be exceeded; and
as a result of a determination that the rated pressure is exceeded, cause a display device coupled to the processor to display a warning indication. | 2,800 |
11,764 | 11,764 | 15,381,873 | 2,896 | A circuit board includes a substantially planar component carrier and a microstrip which is applied to a surface of the component carrier. The microstrip extends towards a connection transition which is arranged on a lateral edge of the component carrier. A waveguide portion of an antenna element which is produced by a 3D printing process is coupled to this connection transition. | 1. A circuit board, comprising:
a substantially planar component carrier; a microstrip applied to a surface of the component carrier and extending towards a connection transition which is arranged on a lateral edge of the component carrier; and an antenna element produced by a 3D printing process and comprising a waveguide portion which is coupled to the connection transition of the component carrier. 2. The circuit board of claim 1, wherein the antenna element comprises a microstrip segment which is applied to the waveguide portion and extends on the waveguide portion as an extension of the microstrip of the component carrier. 3. The circuit board of claim 2, wherein the microstrip and the microstrip segment form a waveguide transition on the lateral edge of the component carrier. 4. The circuit board of claim 3, wherein the microstrip and the microstrip segment are electrically connected at the waveguide transition by a soldered connection or a bonding wire. 5. The circuit board of claim 1, wherein the antenna element is a horn antenna which comprises a beam funnel portion which adjoins the waveguide portion. 6. The circuit board of claim 1, wherein the component carrier comprises at least two circuit board substrates which are stacked one on top of the other. 7. The circuit board of claim 6, wherein the antenna element is connected to the waveguide portion at a lower of the at least two circuit board substrates which are stacked one on top of another. 8. The circuit board of claim 1, further comprising:
a fixing plate which mechanically connects the waveguide portion of the antenna element to the component carrier. 9. The circuit board of claim 1, wherein the waveguide portion of the antenna element is welded or bonded to the component carrier. 10. The circuit board of claim 1, wherein the waveguide portion of the antenna element is integrally formed on the component carrier by the 3D printing process. 11. A production method for a circuit board, the method comprising:
generatively manufacturing an antenna element comprising a waveguide portion and a beam funnel portion by a 3D printing process; connecting the antenna element to a substantially planar component carrier; applying a microstrip to a surface of the component carrier which extends towards a connection transition which is arranged on a lateral edge of the component carrier; and coupling the antenna element to the waveguide portion at the connection transition of the component carrier. 12. The production method of claim 11, wherein connection of the antenna element to the component carrier takes place during the 3D printing process by forming the antenna element on the component carrier. 13. The production method of claim 11, wherein connection of the antenna element to the component carrier comprises welding or bonding the waveguide portion of the antenna element to the component carrier. 14. The production method of claim 11, wherein connection of the antenna element to the component carrier comprises screwing or riveting a fixing plate, which mechanically connects the waveguide portion of the antenna element to the component carrier. 15. A circuit board, comprising:
an antenna element which is produced by a 3D printing process and comprises a waveguide portion and a substantially planar component carrier portion which is formed integrally with the waveguide portion; and a microstrip which is applied to a surface of the component carrier portion and which extends towards a connection transition which is arranged on a lateral edge of the component carrier portion. 16. The circuit board of claim 15, wherein the antenna element comprises a microstrip segment which is applied to the waveguide portion and extends on the waveguide portion as an extension of the microstrip of the component carrier portion. 17. The circuit board of claim 15, wherein the antenna element is a horn antenna which comprises a beam funnel portion which adjoins the waveguide portion. 18. A production method for a circuit board, the method comprising:
generatively manufacturing an antenna element comprising a waveguide portion, a substantially planar component carrier portion which is formed integrally with the waveguide portion, and a beam funnel portion by a 3D printing process; and applying a microstrip to a surface of the component carrier portion which extends towards a connection transition which is arranged on a lateral edge of the component carrier portion. | A circuit board includes a substantially planar component carrier and a microstrip which is applied to a surface of the component carrier. The microstrip extends towards a connection transition which is arranged on a lateral edge of the component carrier. A waveguide portion of an antenna element which is produced by a 3D printing process is coupled to this connection transition.1. A circuit board, comprising:
a substantially planar component carrier; a microstrip applied to a surface of the component carrier and extending towards a connection transition which is arranged on a lateral edge of the component carrier; and an antenna element produced by a 3D printing process and comprising a waveguide portion which is coupled to the connection transition of the component carrier. 2. The circuit board of claim 1, wherein the antenna element comprises a microstrip segment which is applied to the waveguide portion and extends on the waveguide portion as an extension of the microstrip of the component carrier. 3. The circuit board of claim 2, wherein the microstrip and the microstrip segment form a waveguide transition on the lateral edge of the component carrier. 4. The circuit board of claim 3, wherein the microstrip and the microstrip segment are electrically connected at the waveguide transition by a soldered connection or a bonding wire. 5. The circuit board of claim 1, wherein the antenna element is a horn antenna which comprises a beam funnel portion which adjoins the waveguide portion. 6. The circuit board of claim 1, wherein the component carrier comprises at least two circuit board substrates which are stacked one on top of the other. 7. The circuit board of claim 6, wherein the antenna element is connected to the waveguide portion at a lower of the at least two circuit board substrates which are stacked one on top of another. 8. The circuit board of claim 1, further comprising:
a fixing plate which mechanically connects the waveguide portion of the antenna element to the component carrier. 9. The circuit board of claim 1, wherein the waveguide portion of the antenna element is welded or bonded to the component carrier. 10. The circuit board of claim 1, wherein the waveguide portion of the antenna element is integrally formed on the component carrier by the 3D printing process. 11. A production method for a circuit board, the method comprising:
generatively manufacturing an antenna element comprising a waveguide portion and a beam funnel portion by a 3D printing process; connecting the antenna element to a substantially planar component carrier; applying a microstrip to a surface of the component carrier which extends towards a connection transition which is arranged on a lateral edge of the component carrier; and coupling the antenna element to the waveguide portion at the connection transition of the component carrier. 12. The production method of claim 11, wherein connection of the antenna element to the component carrier takes place during the 3D printing process by forming the antenna element on the component carrier. 13. The production method of claim 11, wherein connection of the antenna element to the component carrier comprises welding or bonding the waveguide portion of the antenna element to the component carrier. 14. The production method of claim 11, wherein connection of the antenna element to the component carrier comprises screwing or riveting a fixing plate, which mechanically connects the waveguide portion of the antenna element to the component carrier. 15. A circuit board, comprising:
an antenna element which is produced by a 3D printing process and comprises a waveguide portion and a substantially planar component carrier portion which is formed integrally with the waveguide portion; and a microstrip which is applied to a surface of the component carrier portion and which extends towards a connection transition which is arranged on a lateral edge of the component carrier portion. 16. The circuit board of claim 15, wherein the antenna element comprises a microstrip segment which is applied to the waveguide portion and extends on the waveguide portion as an extension of the microstrip of the component carrier portion. 17. The circuit board of claim 15, wherein the antenna element is a horn antenna which comprises a beam funnel portion which adjoins the waveguide portion. 18. A production method for a circuit board, the method comprising:
generatively manufacturing an antenna element comprising a waveguide portion, a substantially planar component carrier portion which is formed integrally with the waveguide portion, and a beam funnel portion by a 3D printing process; and applying a microstrip to a surface of the component carrier portion which extends towards a connection transition which is arranged on a lateral edge of the component carrier portion. | 2,800 |
11,765 | 11,765 | 15,231,063 | 2,875 | A face-lit waveguide illumination system employing a waveguiding substrate and one or more light sources, such as light emitting diode (LED) devices. The waveguide illumination system further includes one or more elongated light coupling elements attached to a broad-area surface of the substrate with a good optical contact and disposed in registration with the respective light sources. Light emitted by the light sources is received on the elongated light coupling elements and is propagated along the longitudinal axis of the elements in response to optical transmission and a total internal reflection resulting in coupling at least a substantial portion of such light into the waveguiding substrate. The coupled light is distributed over the waveguiding substrate and emitted from a predefined area of the substrate's surface. | 1. A face-lit waveguide illumination system, comprising:
a portion of a waveguiding substrate defined by a first broad-area surface and an opposing second broad-area surface extending substantially parallel to the first broad-area surface; a plurality of highly elongated light coupling elements distributed over the first broad-area surface and attached to the first broad-area surface with a good optical contact; a plurality of LED sources each disposed in registration with and optically coupled to a terminal end of at least one of the plurality of light coupling elements; wherein each of the light coupling elements is configured to inject light into the waveguiding substrate at an angle permitting for light propagation in the waveguiding substrate by means of a total internal reflection from at least the first and second broad-area surfaces. 2. A face-lit waveguide illumination system as recited in claim 1, wherein each of the light coupling elements is formed by a solid body of an optically transparent material and has the shape of an oblique truncated pyramid having a rectangular base surface that extends transversely with respect to a longitudinal axis of the light coupling element and forms a light input face, a terminal end surface opposite to said base surface, a first longitudinal surface that extends perpendicular or near perpendicular to said base surface and forms a primary light output face, an opposing second longitudinal surface forming a low non-zero dihedral angle with said first longitudinal surface, a third longitudinal surface that is perpendicular or near-perpendicular to the first longitudinal surface, and an opposing fourth longitudinal surface that is perpendicular or near-perpendicular to the first longitudinal surface and forms a low non-zero dihedral angle with the third longitudinal surface. 3. A face-lit waveguide illumination system as recited in claim 2, wherein said low non-zero dihedral angle is less than 5°. 4. A face-lit waveguide illumination system as recited in claim 1, wherein the terminal end comprises a generally planar light input face that forms a dihedral angle with the first broad-area surface that is greater than 70° and less than 90°. 5. A face-lit waveguide illumination system as recited in claim 1, wherein each of the plurality of light coupling elements has a length that at least 5 times and no more than 15 times greater than a height of the terminal end above the first broad-area surface. 6. A face-lit waveguide illumination system as recited in claim 1, further including a layer of an index-matched optical adhesive between at least one of the plurality of light coupling elements and the waveguiding substrate. 7. A face-lit waveguide illumination system as recited in claim 1, wherein a spacing S1 between adjacent ones of the plurality of light coupling elements is greater than 0.6 times a length L of each one of the plurality of light coupling elements. 8. A face-lit waveguide illumination system as recited in claim 1, wherein each of the light coupling elements has a taper at least in a plane perpendicular to a prevailing plane of said portion of a waveguiding substrate; 9. A face-lit waveguide illumination system as recited in claim 1, wherein each one of the plurality of light coupling elements has a taper at least in a plane parallel to a prevailing plane of said portion of a waveguiding substrate; 10. A face-lit waveguide illumination system as recited in claim 1, wherein each one of the plurality of light coupling elements is tapered in at least two orthogonal dimensions; 11. A face-lit waveguide illumination system as recited in claim 1, wherein a size of a light emitting aperture of at least one of the plurality of LED sources is greater than a thickness of the waveguiding substrate. 12. A face-lit waveguide illumination system as recited in claim 1, wherein a size of a light emitting aperture of at least one of the plurality of LED sources is at least two times greater than a thickness of the waveguiding substrate. 13. A face-lit waveguide illumination system as recited in claim 1, wherein each one of the plurality of LED sources comprises a plurality of light emitting diodes. 14. A face-lit waveguide illumination system as recited in claim 1, wherein at least a first portion of a light emitting surface of one of the plurality of LED sources is covering a terminal end of one of the plurality of light coupling elements and least a second portion of the light emitting aperture is covering a portion of an edge of the waveguiding substrate. 15. A face-lit waveguide illumination system as recited in claim 1, wherein at least one of the plurality of LED sources comprises a plurality of light emitting diodes arranged into a two-dimensional array on a common heat conducting substrate and further comprises an encapsulation layer formed by an optically transmissive material and encapsulating said plurality of light emitting diodes, wherein at least one of the plurality of light emitting diodes is positioned to illuminate a terminal end of one of the plurality of light coupling elements and at least one of the plurality of light emitting diodes is positioned to illuminate an edge of the waveguiding substrate. 16. A face-lit waveguide illumination system as recited in claim 1, wherein at least one of the plurality of light coupling elements has a curved surface. 17. A face-lit waveguide illumination system as recited in claim 1, wherein at least one of the plurality of light coupling elements has a mirrored face. 18. A face-lit waveguide illumination system as recited in claim 1, further comprising an opaque housing at least partially enclosing or surrounding at least one of the plurality of light coupling elements. 19. A face-lit waveguide illumination system as recited in claim 1, wherein at least one of the plurality of light coupling elements is disposed at a distance from all edges defining the waveguiding substrate. 20. A face-lit waveguide illumination system as recited in claim 1, wherein the waveguiding substrate comprises TIR surfaces formed in spaces between adjacent ones of the plurality of light coupling elements. | A face-lit waveguide illumination system employing a waveguiding substrate and one or more light sources, such as light emitting diode (LED) devices. The waveguide illumination system further includes one or more elongated light coupling elements attached to a broad-area surface of the substrate with a good optical contact and disposed in registration with the respective light sources. Light emitted by the light sources is received on the elongated light coupling elements and is propagated along the longitudinal axis of the elements in response to optical transmission and a total internal reflection resulting in coupling at least a substantial portion of such light into the waveguiding substrate. The coupled light is distributed over the waveguiding substrate and emitted from a predefined area of the substrate's surface.1. A face-lit waveguide illumination system, comprising:
a portion of a waveguiding substrate defined by a first broad-area surface and an opposing second broad-area surface extending substantially parallel to the first broad-area surface; a plurality of highly elongated light coupling elements distributed over the first broad-area surface and attached to the first broad-area surface with a good optical contact; a plurality of LED sources each disposed in registration with and optically coupled to a terminal end of at least one of the plurality of light coupling elements; wherein each of the light coupling elements is configured to inject light into the waveguiding substrate at an angle permitting for light propagation in the waveguiding substrate by means of a total internal reflection from at least the first and second broad-area surfaces. 2. A face-lit waveguide illumination system as recited in claim 1, wherein each of the light coupling elements is formed by a solid body of an optically transparent material and has the shape of an oblique truncated pyramid having a rectangular base surface that extends transversely with respect to a longitudinal axis of the light coupling element and forms a light input face, a terminal end surface opposite to said base surface, a first longitudinal surface that extends perpendicular or near perpendicular to said base surface and forms a primary light output face, an opposing second longitudinal surface forming a low non-zero dihedral angle with said first longitudinal surface, a third longitudinal surface that is perpendicular or near-perpendicular to the first longitudinal surface, and an opposing fourth longitudinal surface that is perpendicular or near-perpendicular to the first longitudinal surface and forms a low non-zero dihedral angle with the third longitudinal surface. 3. A face-lit waveguide illumination system as recited in claim 2, wherein said low non-zero dihedral angle is less than 5°. 4. A face-lit waveguide illumination system as recited in claim 1, wherein the terminal end comprises a generally planar light input face that forms a dihedral angle with the first broad-area surface that is greater than 70° and less than 90°. 5. A face-lit waveguide illumination system as recited in claim 1, wherein each of the plurality of light coupling elements has a length that at least 5 times and no more than 15 times greater than a height of the terminal end above the first broad-area surface. 6. A face-lit waveguide illumination system as recited in claim 1, further including a layer of an index-matched optical adhesive between at least one of the plurality of light coupling elements and the waveguiding substrate. 7. A face-lit waveguide illumination system as recited in claim 1, wherein a spacing S1 between adjacent ones of the plurality of light coupling elements is greater than 0.6 times a length L of each one of the plurality of light coupling elements. 8. A face-lit waveguide illumination system as recited in claim 1, wherein each of the light coupling elements has a taper at least in a plane perpendicular to a prevailing plane of said portion of a waveguiding substrate; 9. A face-lit waveguide illumination system as recited in claim 1, wherein each one of the plurality of light coupling elements has a taper at least in a plane parallel to a prevailing plane of said portion of a waveguiding substrate; 10. A face-lit waveguide illumination system as recited in claim 1, wherein each one of the plurality of light coupling elements is tapered in at least two orthogonal dimensions; 11. A face-lit waveguide illumination system as recited in claim 1, wherein a size of a light emitting aperture of at least one of the plurality of LED sources is greater than a thickness of the waveguiding substrate. 12. A face-lit waveguide illumination system as recited in claim 1, wherein a size of a light emitting aperture of at least one of the plurality of LED sources is at least two times greater than a thickness of the waveguiding substrate. 13. A face-lit waveguide illumination system as recited in claim 1, wherein each one of the plurality of LED sources comprises a plurality of light emitting diodes. 14. A face-lit waveguide illumination system as recited in claim 1, wherein at least a first portion of a light emitting surface of one of the plurality of LED sources is covering a terminal end of one of the plurality of light coupling elements and least a second portion of the light emitting aperture is covering a portion of an edge of the waveguiding substrate. 15. A face-lit waveguide illumination system as recited in claim 1, wherein at least one of the plurality of LED sources comprises a plurality of light emitting diodes arranged into a two-dimensional array on a common heat conducting substrate and further comprises an encapsulation layer formed by an optically transmissive material and encapsulating said plurality of light emitting diodes, wherein at least one of the plurality of light emitting diodes is positioned to illuminate a terminal end of one of the plurality of light coupling elements and at least one of the plurality of light emitting diodes is positioned to illuminate an edge of the waveguiding substrate. 16. A face-lit waveguide illumination system as recited in claim 1, wherein at least one of the plurality of light coupling elements has a curved surface. 17. A face-lit waveguide illumination system as recited in claim 1, wherein at least one of the plurality of light coupling elements has a mirrored face. 18. A face-lit waveguide illumination system as recited in claim 1, further comprising an opaque housing at least partially enclosing or surrounding at least one of the plurality of light coupling elements. 19. A face-lit waveguide illumination system as recited in claim 1, wherein at least one of the plurality of light coupling elements is disposed at a distance from all edges defining the waveguiding substrate. 20. A face-lit waveguide illumination system as recited in claim 1, wherein the waveguiding substrate comprises TIR surfaces formed in spaces between adjacent ones of the plurality of light coupling elements. | 2,800 |
11,766 | 11,766 | 15,455,810 | 2,868 | An energy supply for a test device includes an energy source configured to provide energy via an inductive element for use by test circuitry; and an energy recovery circuit electrically couplable to the energy source and configured to direct unused energy from the inductive element to the energy source. | 1. An energy supply for a test device, comprising:
an energy source configured to provide energy via an inductive element for use by test circuitry; and an energy recovery circuit electrically couplable to the energy source and configured to direct unused energy from the inductive element to the energy source. 2. The energy supply of claim 1, wherein the energy source includes an energy storage device electrically couplable to the inductive element to transfer energy into the inductive element via a first switching element. 3. The energy supply of claim 1, further comprising a diode coupled with respect to the inductive element and the test circuitry providing a return current path from the test circuitry to the inductive element. 4. The energy supply of claim 2, wherein the energy recovery circuit is electrically couplable to the energy storage device via a second switching element, and directs unused energy from the inductive element to the energy storage device to recharge the energy storage device when the second switching element is closed. 5. The energy supply of claim 3, wherein the first switching element is in open condition when the second switching element is closed and the energy recovery circuit directs unused energy from the inductive element to the energy storage device to recharge the energy storage device. 6. The energy supply of claim 3, wherein the inductive element is electrically coupled to the test circuitry via a third switching element which disconnects the test circuitry from being electrically coupled with the inductive element when the energy recovery circuit directs unused energy from the inductive element to the energy storage device. 7. The energy supply of claim 3, wherein the second switching element comprises a power MOSFET device and a diode is electrically connected in series with the MOSFET device to block a reverse current flow in the energy recovery circuit. 8. The energy supply of claim 4, and further comprising a control configured to open and close the respective switching elements. 9. The energy supply of claim 4, wherein the test circuitry includes a switching element configured to electrically couple the test circuitry to the inductive element to provide energy for testing a device under test. 10. The energy supply of claim 5, wherein the switching elements comprise at least one of a silicon controlled rectifier, a power metal oxide substrate field effect transistor (MOSFET) device, an insulated gate bipolar transistor (IGBT) device, an electro-mechanical relay, or a solid state relay. 11. The energy supply of claim 1, wherein the energy recovery circuit is configured to protect a test circuitry operatively coupled to the inductive element by diverting current from flowing into the test circuitry after a test cycle of a device under test. 12. The energy supply of claim 1, wherein the energy supply is operatively coupled to a control that controls the energy supply and the test circuitry. 13. The energy supply of claim 12, wherein the energy recovery circuit includes a current transformer to measure and transmit to the control electrical current information of the inductive element during energy recovery. 14. The energy supply of claim 2, wherein the energy storage device comprises a capacitor bank. 15. A circuit for recovering energy from testing of a device under test (DUT), comprising:
an electrical energy storage device; an inductive element connected to provide electrical energy from the electrical energy storage device to a semiconductor device under test; and an electrical energy recovery circuit coupled to the electrical energy storage device and the inductive element, the electrical energy recovery circuit operable to selectively provide electrical energy stored in the inductive element back to the electrical energy storage device. 16. An electrical test apparatus for a semiconductor device under test (DUT), comprising:
an electrical energy supply, an electrical energy reservoir, switching apparatus coupling electrical energy from the reservoir to a testing circuit that tests a DUT, and a return electrical path selectively couplable to the reservoir to couple unused energy from the reservoir to the supply after testing of the DUT. 17. A circuit for recovering energy from testing of a semiconductor device under test (DUT), comprising:
an energy storage device for storing electrical energy; a first inductive element having a first terminal and a second terminal, wherein the first terminal is electrically connectable to the energy storage device via a first switching element and the second terminal supplies electrical energy from the inductive element to the DUT; and an energy recovery circuit having an input terminal and an output terminal, the input terminal electrically connected to the second terminal of the first inductive element and the output terminal electrically connected to the energy storage device, the energy recovery circuit operable to selectively provide energy stored in the first inductive element back to the energy storage device. 18. A circuit of claim 17, further comprising:
a diode coupled with respect to the inductive element and the test circuitry providing a return current path from the test circuitry to the inductive element. 19. A method for recovering unused energy from an energy supply, which provides energy via an inductive element arranged in the energy supply for testing a device, comprising:
directing unused energy from the inductive element to the energy supply. 20. The method of claim 19, wherein said directing of the unused energy from the inductive element to the energy supply protects a test circuitry operatively coupled to the energy supply by diverting the unused energy from flowing into the test circuitry after a test cycle of a device under test. 21. The method of claim 19, further comprising:
charging an electrical energy storage device arranged in the energy supply with a power supply; discharging energy from the electrical energy storage device to the inductive element; and recharging the electrical energy storage device with the unused energy directed from the inductive element for use in a subsequent test cycle. 22. The method of claim 19, further comprising:
controlling the energy supply via a controller. 23. The method of claim 19, further comprising:
providing energy from the inductive element to a test circuitry for use in testing a device. | An energy supply for a test device includes an energy source configured to provide energy via an inductive element for use by test circuitry; and an energy recovery circuit electrically couplable to the energy source and configured to direct unused energy from the inductive element to the energy source.1. An energy supply for a test device, comprising:
an energy source configured to provide energy via an inductive element for use by test circuitry; and an energy recovery circuit electrically couplable to the energy source and configured to direct unused energy from the inductive element to the energy source. 2. The energy supply of claim 1, wherein the energy source includes an energy storage device electrically couplable to the inductive element to transfer energy into the inductive element via a first switching element. 3. The energy supply of claim 1, further comprising a diode coupled with respect to the inductive element and the test circuitry providing a return current path from the test circuitry to the inductive element. 4. The energy supply of claim 2, wherein the energy recovery circuit is electrically couplable to the energy storage device via a second switching element, and directs unused energy from the inductive element to the energy storage device to recharge the energy storage device when the second switching element is closed. 5. The energy supply of claim 3, wherein the first switching element is in open condition when the second switching element is closed and the energy recovery circuit directs unused energy from the inductive element to the energy storage device to recharge the energy storage device. 6. The energy supply of claim 3, wherein the inductive element is electrically coupled to the test circuitry via a third switching element which disconnects the test circuitry from being electrically coupled with the inductive element when the energy recovery circuit directs unused energy from the inductive element to the energy storage device. 7. The energy supply of claim 3, wherein the second switching element comprises a power MOSFET device and a diode is electrically connected in series with the MOSFET device to block a reverse current flow in the energy recovery circuit. 8. The energy supply of claim 4, and further comprising a control configured to open and close the respective switching elements. 9. The energy supply of claim 4, wherein the test circuitry includes a switching element configured to electrically couple the test circuitry to the inductive element to provide energy for testing a device under test. 10. The energy supply of claim 5, wherein the switching elements comprise at least one of a silicon controlled rectifier, a power metal oxide substrate field effect transistor (MOSFET) device, an insulated gate bipolar transistor (IGBT) device, an electro-mechanical relay, or a solid state relay. 11. The energy supply of claim 1, wherein the energy recovery circuit is configured to protect a test circuitry operatively coupled to the inductive element by diverting current from flowing into the test circuitry after a test cycle of a device under test. 12. The energy supply of claim 1, wherein the energy supply is operatively coupled to a control that controls the energy supply and the test circuitry. 13. The energy supply of claim 12, wherein the energy recovery circuit includes a current transformer to measure and transmit to the control electrical current information of the inductive element during energy recovery. 14. The energy supply of claim 2, wherein the energy storage device comprises a capacitor bank. 15. A circuit for recovering energy from testing of a device under test (DUT), comprising:
an electrical energy storage device; an inductive element connected to provide electrical energy from the electrical energy storage device to a semiconductor device under test; and an electrical energy recovery circuit coupled to the electrical energy storage device and the inductive element, the electrical energy recovery circuit operable to selectively provide electrical energy stored in the inductive element back to the electrical energy storage device. 16. An electrical test apparatus for a semiconductor device under test (DUT), comprising:
an electrical energy supply, an electrical energy reservoir, switching apparatus coupling electrical energy from the reservoir to a testing circuit that tests a DUT, and a return electrical path selectively couplable to the reservoir to couple unused energy from the reservoir to the supply after testing of the DUT. 17. A circuit for recovering energy from testing of a semiconductor device under test (DUT), comprising:
an energy storage device for storing electrical energy; a first inductive element having a first terminal and a second terminal, wherein the first terminal is electrically connectable to the energy storage device via a first switching element and the second terminal supplies electrical energy from the inductive element to the DUT; and an energy recovery circuit having an input terminal and an output terminal, the input terminal electrically connected to the second terminal of the first inductive element and the output terminal electrically connected to the energy storage device, the energy recovery circuit operable to selectively provide energy stored in the first inductive element back to the energy storage device. 18. A circuit of claim 17, further comprising:
a diode coupled with respect to the inductive element and the test circuitry providing a return current path from the test circuitry to the inductive element. 19. A method for recovering unused energy from an energy supply, which provides energy via an inductive element arranged in the energy supply for testing a device, comprising:
directing unused energy from the inductive element to the energy supply. 20. The method of claim 19, wherein said directing of the unused energy from the inductive element to the energy supply protects a test circuitry operatively coupled to the energy supply by diverting the unused energy from flowing into the test circuitry after a test cycle of a device under test. 21. The method of claim 19, further comprising:
charging an electrical energy storage device arranged in the energy supply with a power supply; discharging energy from the electrical energy storage device to the inductive element; and recharging the electrical energy storage device with the unused energy directed from the inductive element for use in a subsequent test cycle. 22. The method of claim 19, further comprising:
controlling the energy supply via a controller. 23. The method of claim 19, further comprising:
providing energy from the inductive element to a test circuitry for use in testing a device. | 2,800 |
11,767 | 11,767 | 15,414,021 | 2,817 | A semiconductor element includes, in order from top to bottom, a semiconductor layer, a light-transmissive substrate, a dielectric multilayered film, and a reflective layer containing Ag as a major component and containing a metal oxide. A method for manufacturing the semiconductor element includes: forming a semiconductor layer on a first principal surface of a light-transmissive substrate, which has a second principal surface opposite to the first principal surface; forming a dielectric multilayered film on the second principal surface of the light-transmissive substrate; and forming a reflective layer containing Ag as a major component and containing a metal oxide on a side of the dielectric multilayered film opposite the light-transmissive substrate. | 1. A semiconductor element comprising, in order from top to bottom:
a semiconductor layer; a light-transmissive substrate; a dielectric multilayered film; and a reflective layer containing Ag as a major component and containing a metal oxide. 2. The semiconductor element according to claim 1, wherein the metal oxide is at least one selected from Ga2O3, Nb2O5, and HfO2. 3. The semiconductor element according to claim 1, wherein a content of the metal oxide is at least 0.01% by mass and at most 5% by mass with respect to the total mass of the reflective layer. 4. The semiconductor element according to claim 1, wherein the metal oxide is dispersed in the reflective layer. 5. The semiconductor element according to claim 1, further comprising a first metal layer beneath the reflective layer and a second metal layer beneath the first metal layer. 6. The semiconductor element according to claim 5, wherein each of the first metal layer and the second metal layer contains an element selected from Ru, Rh, Pd, Os, Ir, Pt, Fe, Co, and Ni, as a major component. 7. The semiconductor element according to claim 6, wherein the first metal layer and the second metal layer contain different elements from each other as the respective major component. 8. The semiconductor element according to claim 5, further comprising a third metal layer containing Au as a major component beneath the second metal layer. 9. The semiconductor element according to claim 1, wherein the dielectric multilayered film contains an oxide of at least one element selected from Si, Ti, Zr, Nb, Ta, and Al as a major component. 10. The semiconductor element according to claim 1, wherein the dielectric multilayered film is a distributed Bragg reflector film. 11. The semiconductor element according to claim 1, wherein the semiconductor element is a semiconductor light emitting element. 12. A method for manufacturing a semiconductor element, comprising the steps of:
forming a semiconductor layer on a first principal surface of a light-transmissive substrate, the light-transmissive substrate having a second principal surface opposite to the first principal surface; forming a dielectric multilayered film on the second principal surface of the light-transmissive substrate; and forming a reflective layer containing Ag as a major component and containing a metal oxide on a side of the dielectric multilayered film opposite the light-transmissive substrate. 13. The method for manufacturing a semiconductor element according to claim 12, wherein the reflective layer is formed by a simultaneous sputtering method using an Ag target and a target of the metal oxide, a sputtering method using an alloy target including Ag and the metal oxide, or a vapor deposition method using an alloy deposition material including Ag and the metal oxide. 14. The method for manufacturing a semiconductor element according to claim 12, wherein the metal oxide is at least one selected from Ga2O3, Nb2O5, and HfO2. 15. The method for manufacturing a semiconductor element according to claim 12, wherein a content of the metal oxide is at least 0.01% by mass and at most 5% by mass with respect to the total mass of the reflective layer. 16. The method for manufacturing a semiconductor element according to claim 12, wherein the metal oxide is dispersed in the reflective layer. 17. The method for manufacturing a semiconductor element according to claim 12, further comprising the steps of:
after forming the reflective layer, forming a first metal layer on a side of the reflective layer opposite the dielectric multilayered film; and forming a second metal layer on a side of the first metal layer opposite the reflective layer. 18. The method for manufacturing a semiconductor element according to claim 17, wherein each of the first metal layer and the second metal layer is formed using a material containing an element selected from Ru, Rh, Pd, Os, Ir, Pt, Fe, Co, and Ni, as a major component. 19. The method for manufacturing a semiconductor element according to claim 18, wherein the first metal layer and the second metal layer are respectively formed using different materials containing different elements from each other as the respective major component. 20. The method for manufacturing a semiconductor element according to claim 17, further comprising:
after forming the second metal layer, forming a third metal layer using a material containing Au as a major component on a side of the second metal layer opposite the first metal layer. 21. The method for manufacturing a semiconductor element according to claim 12, wherein the dielectric multilayered film is formed using a material containing an oxide of at least one element selected from Si, Ti, Zr, Nb, Ta, and Al. 22. The method for manufacturing a semiconductor element according to claim 12, wherein the dielectric multilayered film is a distributed Bragg reflector film. 23. The method for manufacturing a semiconductor element according to claim 12, wherein the semiconductor element is a semiconductor light emitting element. | A semiconductor element includes, in order from top to bottom, a semiconductor layer, a light-transmissive substrate, a dielectric multilayered film, and a reflective layer containing Ag as a major component and containing a metal oxide. A method for manufacturing the semiconductor element includes: forming a semiconductor layer on a first principal surface of a light-transmissive substrate, which has a second principal surface opposite to the first principal surface; forming a dielectric multilayered film on the second principal surface of the light-transmissive substrate; and forming a reflective layer containing Ag as a major component and containing a metal oxide on a side of the dielectric multilayered film opposite the light-transmissive substrate.1. A semiconductor element comprising, in order from top to bottom:
a semiconductor layer; a light-transmissive substrate; a dielectric multilayered film; and a reflective layer containing Ag as a major component and containing a metal oxide. 2. The semiconductor element according to claim 1, wherein the metal oxide is at least one selected from Ga2O3, Nb2O5, and HfO2. 3. The semiconductor element according to claim 1, wherein a content of the metal oxide is at least 0.01% by mass and at most 5% by mass with respect to the total mass of the reflective layer. 4. The semiconductor element according to claim 1, wherein the metal oxide is dispersed in the reflective layer. 5. The semiconductor element according to claim 1, further comprising a first metal layer beneath the reflective layer and a second metal layer beneath the first metal layer. 6. The semiconductor element according to claim 5, wherein each of the first metal layer and the second metal layer contains an element selected from Ru, Rh, Pd, Os, Ir, Pt, Fe, Co, and Ni, as a major component. 7. The semiconductor element according to claim 6, wherein the first metal layer and the second metal layer contain different elements from each other as the respective major component. 8. The semiconductor element according to claim 5, further comprising a third metal layer containing Au as a major component beneath the second metal layer. 9. The semiconductor element according to claim 1, wherein the dielectric multilayered film contains an oxide of at least one element selected from Si, Ti, Zr, Nb, Ta, and Al as a major component. 10. The semiconductor element according to claim 1, wherein the dielectric multilayered film is a distributed Bragg reflector film. 11. The semiconductor element according to claim 1, wherein the semiconductor element is a semiconductor light emitting element. 12. A method for manufacturing a semiconductor element, comprising the steps of:
forming a semiconductor layer on a first principal surface of a light-transmissive substrate, the light-transmissive substrate having a second principal surface opposite to the first principal surface; forming a dielectric multilayered film on the second principal surface of the light-transmissive substrate; and forming a reflective layer containing Ag as a major component and containing a metal oxide on a side of the dielectric multilayered film opposite the light-transmissive substrate. 13. The method for manufacturing a semiconductor element according to claim 12, wherein the reflective layer is formed by a simultaneous sputtering method using an Ag target and a target of the metal oxide, a sputtering method using an alloy target including Ag and the metal oxide, or a vapor deposition method using an alloy deposition material including Ag and the metal oxide. 14. The method for manufacturing a semiconductor element according to claim 12, wherein the metal oxide is at least one selected from Ga2O3, Nb2O5, and HfO2. 15. The method for manufacturing a semiconductor element according to claim 12, wherein a content of the metal oxide is at least 0.01% by mass and at most 5% by mass with respect to the total mass of the reflective layer. 16. The method for manufacturing a semiconductor element according to claim 12, wherein the metal oxide is dispersed in the reflective layer. 17. The method for manufacturing a semiconductor element according to claim 12, further comprising the steps of:
after forming the reflective layer, forming a first metal layer on a side of the reflective layer opposite the dielectric multilayered film; and forming a second metal layer on a side of the first metal layer opposite the reflective layer. 18. The method for manufacturing a semiconductor element according to claim 17, wherein each of the first metal layer and the second metal layer is formed using a material containing an element selected from Ru, Rh, Pd, Os, Ir, Pt, Fe, Co, and Ni, as a major component. 19. The method for manufacturing a semiconductor element according to claim 18, wherein the first metal layer and the second metal layer are respectively formed using different materials containing different elements from each other as the respective major component. 20. The method for manufacturing a semiconductor element according to claim 17, further comprising:
after forming the second metal layer, forming a third metal layer using a material containing Au as a major component on a side of the second metal layer opposite the first metal layer. 21. The method for manufacturing a semiconductor element according to claim 12, wherein the dielectric multilayered film is formed using a material containing an oxide of at least one element selected from Si, Ti, Zr, Nb, Ta, and Al. 22. The method for manufacturing a semiconductor element according to claim 12, wherein the dielectric multilayered film is a distributed Bragg reflector film. 23. The method for manufacturing a semiconductor element according to claim 12, wherein the semiconductor element is a semiconductor light emitting element. | 2,800 |
11,768 | 11,768 | 15,331,915 | 2,837 | A switching converter circuit has an integrated transformer, wherein the transformer has a double loop magnetic structure with an E I core geometry, wherein the primary and secondary windings are placed side by side on the center leg of the E-part of the core, wherein the air gap is placed at the far end of the primary winding between the free end of the center leg and the I-part of the core. | 1. A switching converter circuit, comprising:
an integrated transformer, wherein the transformer includes a double loop magnetic structure having an E I core geometry, a primary winding, a secondary winding, a center leg, a core, an air gap, an E-part, and an I-part, wherein the primary and secondary windings are arranged side by side on the center leg of the E-part of the core, wherein the air gap is arranged at a far end of the primary winding between a free end of the center leg and the I-part of the core. 2. A switching converter circuit, comprising:
a double loop core including a magnetic material, and further including a first single loop and a second single loop, the loops including magnetic material, combined to form a frame-like structure sharing one center leg common to both of the loops, only one air gap being positioned between a free end of the center leg and the frame-like structure; a primary winding; and a secondary winding, wherein the primary and secondary windings are coupled by a winding of the primary and secondary windings on the center leg. 3. The circuit of claim 2, wherein the primary winding is wound on the center leg in a section close to the air gap. 4. The circuit of claim 3, wherein the secondary winding is wound on the center leg in a section at a far end from the air gap. 5. The circuit of claim 4, wherein the primary winding is wound on the center leg between the air gap and the secondary winding. 6. The circuit of claim 1, wherein the center leg has a round cross-sectional contour. 7. The circuit of claim 2, wherein the center leg has a round cross-sectional contour. 8. The circuit of claim 1, wherein the center leg has a rectangular or a quadratic cross-sectional contour. 9. The circuit of claim 2, wherein the center leg has a rectangular or a quadratic cross-sectional contour. 10. The circuit of claim 1, wherein the core includes a ferritic material. 11. The circuit of claim 1, wherein the core is made of a ferritic material. 12. The circuit of claim 2, wherein the core includes a ferritic material. 13. The circuit of claim 2, wherein the core is made of a ferritic material. 14. The circuit of claim 1, wherein the core is made of a laminated metal sheet arrangement. 15. The circuit of claim 1, wherein a diameter or geometrical outline dimension of the center leg of the core is larger than a width of the air gap. 16. The circuit of claim 15, wherein the diameter or geometrical outline dimension of the center leg of the core is larger than five times the width of the air gap. 17. The circuit of claim 1, wherein a length of the center leg is larger than a width of the air gap. 18. The converter of claim 17, wherein the length of the center leg is larger than five times the width of the air gap. | A switching converter circuit has an integrated transformer, wherein the transformer has a double loop magnetic structure with an E I core geometry, wherein the primary and secondary windings are placed side by side on the center leg of the E-part of the core, wherein the air gap is placed at the far end of the primary winding between the free end of the center leg and the I-part of the core.1. A switching converter circuit, comprising:
an integrated transformer, wherein the transformer includes a double loop magnetic structure having an E I core geometry, a primary winding, a secondary winding, a center leg, a core, an air gap, an E-part, and an I-part, wherein the primary and secondary windings are arranged side by side on the center leg of the E-part of the core, wherein the air gap is arranged at a far end of the primary winding between a free end of the center leg and the I-part of the core. 2. A switching converter circuit, comprising:
a double loop core including a magnetic material, and further including a first single loop and a second single loop, the loops including magnetic material, combined to form a frame-like structure sharing one center leg common to both of the loops, only one air gap being positioned between a free end of the center leg and the frame-like structure; a primary winding; and a secondary winding, wherein the primary and secondary windings are coupled by a winding of the primary and secondary windings on the center leg. 3. The circuit of claim 2, wherein the primary winding is wound on the center leg in a section close to the air gap. 4. The circuit of claim 3, wherein the secondary winding is wound on the center leg in a section at a far end from the air gap. 5. The circuit of claim 4, wherein the primary winding is wound on the center leg between the air gap and the secondary winding. 6. The circuit of claim 1, wherein the center leg has a round cross-sectional contour. 7. The circuit of claim 2, wherein the center leg has a round cross-sectional contour. 8. The circuit of claim 1, wherein the center leg has a rectangular or a quadratic cross-sectional contour. 9. The circuit of claim 2, wherein the center leg has a rectangular or a quadratic cross-sectional contour. 10. The circuit of claim 1, wherein the core includes a ferritic material. 11. The circuit of claim 1, wherein the core is made of a ferritic material. 12. The circuit of claim 2, wherein the core includes a ferritic material. 13. The circuit of claim 2, wherein the core is made of a ferritic material. 14. The circuit of claim 1, wherein the core is made of a laminated metal sheet arrangement. 15. The circuit of claim 1, wherein a diameter or geometrical outline dimension of the center leg of the core is larger than a width of the air gap. 16. The circuit of claim 15, wherein the diameter or geometrical outline dimension of the center leg of the core is larger than five times the width of the air gap. 17. The circuit of claim 1, wherein a length of the center leg is larger than a width of the air gap. 18. The converter of claim 17, wherein the length of the center leg is larger than five times the width of the air gap. | 2,800 |
11,769 | 11,769 | 15,270,928 | 2,891 | A gallium and nitrogen containing optical device has a base region and no more than three major planar side regions configured in a triangular arrangement provided from the base region. | 1.-14. (canceled) 15. A light emitting diode (LED) device made from the process comprising:
(a) overlaying an epitaxial structure on a substrate having planes to form a processed wafer; (b) scribing said processed wafer to form scribe lines along said planes to define a plurality of triangular portions of said processed wafer; and (c) singulating said triangular portions by breaking along said scribe lines to define an LED device having three sides along said planes of said substrate, wherein breaking creates a textured surface on one or more of said sides, said textured surface being configured to improve light extraction compared to a smooth surface. 16. The LED device of claim 15, wherein said planes are non-m-planes. 17. The LED device of claim 16, wherein said planes are a-planes. 18. The LED device of claim 17, wherein said optical device comprises no more than five sides, wherein two sides of said five sides have a triangular shape and are configured from equivalent crystal planes. 19. The LED device of claim 18, wherein said equivalent crystal planes are c-planes. 20. The LED device of claim 15, wherein all of said three sides comprise said textured surface. 21. The LED device of claim 20, wherein said three sides comprise said textured surface to facilitate a light extraction efficiency of over 80%. 22. The LED device of claim 15, wherein said textured surface comprises striations. 23. The LED device of claim 22, wherein said three sides are perpendicular to top and bottom sides of said LED device, and said striations are perpendicular to said top and bottom sides. 24. The LED device of claim 15, wherein said substrate comprises bulk GaN. 25. The LED device of claim 24, wherein said light-emitting epitaxial structure comprises GaN. 26. The LED device of claim 15, wherein said optical device has only five sides. 27. A process of preparing a light emitting diode (LED) comprising:
(a) overlaying an epitaxial structure on a substrate having planes to form a processed wafer; (b) scribing said processed wafer to form scribe lines along said planes to define a plurality of triangular portions of said processed wafer; and (c) singulating said triangular portions by breaking along said scribe lines to define an LED device having three sides along said planes of said substrate, wherein breaking creates a textured surface on one or more of said sides, said textured surface being configured to improve light extraction compared to a smooth surface. 28. The process of claim 27, wherein said planes are a-planes. 29. The process of claim 28, wherein said optical device comprises no more than five sides, wherein two sides of said five sides have a triangular shape and are configured from equivalent crystal planes. 30. The process of claim 27, wherein said three sides comprise said textured surface. to facilitate a light extraction efficiency of over 80%. 31. The process of claim 27, wherein said textured surface comprises striations. 32. The process of claim 31, wherein said three sides are perpendicular to top and bottom sides of said process, and said striations are perpendicular to said top and bottom sides. 33. The process of claim 27, wherein said substrate comprises bulk GaN. 34. The process of claim 33, wherein said light-emitting epitaxial structure comprises GaN. | A gallium and nitrogen containing optical device has a base region and no more than three major planar side regions configured in a triangular arrangement provided from the base region.1.-14. (canceled) 15. A light emitting diode (LED) device made from the process comprising:
(a) overlaying an epitaxial structure on a substrate having planes to form a processed wafer; (b) scribing said processed wafer to form scribe lines along said planes to define a plurality of triangular portions of said processed wafer; and (c) singulating said triangular portions by breaking along said scribe lines to define an LED device having three sides along said planes of said substrate, wherein breaking creates a textured surface on one or more of said sides, said textured surface being configured to improve light extraction compared to a smooth surface. 16. The LED device of claim 15, wherein said planes are non-m-planes. 17. The LED device of claim 16, wherein said planes are a-planes. 18. The LED device of claim 17, wherein said optical device comprises no more than five sides, wherein two sides of said five sides have a triangular shape and are configured from equivalent crystal planes. 19. The LED device of claim 18, wherein said equivalent crystal planes are c-planes. 20. The LED device of claim 15, wherein all of said three sides comprise said textured surface. 21. The LED device of claim 20, wherein said three sides comprise said textured surface to facilitate a light extraction efficiency of over 80%. 22. The LED device of claim 15, wherein said textured surface comprises striations. 23. The LED device of claim 22, wherein said three sides are perpendicular to top and bottom sides of said LED device, and said striations are perpendicular to said top and bottom sides. 24. The LED device of claim 15, wherein said substrate comprises bulk GaN. 25. The LED device of claim 24, wherein said light-emitting epitaxial structure comprises GaN. 26. The LED device of claim 15, wherein said optical device has only five sides. 27. A process of preparing a light emitting diode (LED) comprising:
(a) overlaying an epitaxial structure on a substrate having planes to form a processed wafer; (b) scribing said processed wafer to form scribe lines along said planes to define a plurality of triangular portions of said processed wafer; and (c) singulating said triangular portions by breaking along said scribe lines to define an LED device having three sides along said planes of said substrate, wherein breaking creates a textured surface on one or more of said sides, said textured surface being configured to improve light extraction compared to a smooth surface. 28. The process of claim 27, wherein said planes are a-planes. 29. The process of claim 28, wherein said optical device comprises no more than five sides, wherein two sides of said five sides have a triangular shape and are configured from equivalent crystal planes. 30. The process of claim 27, wherein said three sides comprise said textured surface. to facilitate a light extraction efficiency of over 80%. 31. The process of claim 27, wherein said textured surface comprises striations. 32. The process of claim 31, wherein said three sides are perpendicular to top and bottom sides of said process, and said striations are perpendicular to said top and bottom sides. 33. The process of claim 27, wherein said substrate comprises bulk GaN. 34. The process of claim 33, wherein said light-emitting epitaxial structure comprises GaN. | 2,800 |
11,770 | 11,770 | 15,811,884 | 2,849 | An integrated circuit includes a base current cancellation circuit and a complementary to absolute temperature (CTAT) circuit. The base current cancellation circuit includes a first bipolar junction transistor (BJT) and a current mirror coupled to the first BJT. The current mirror is configured to provide a mirrored current to a base electrode of the first BJT. The CTAT circuit is coupled to receive a voltage signal corresponding to a reference current of the current mirror. The CTAT circuit includes a second BJT coupled to form a base current based on the voltage signal. | 1. An integrated circuit comprising:
a base current cancellation circuit comprising: a first bipolar junction transistor (BJT), and a current mirror coupled to a base electrode of the first BJT, the current mirror configured to provide a mirrored current to the base electrode of the first BJT, wherein at the base electrode, only the base electrode is coupled to the current mirror; and a complementary to absolute temperature (CTAT) circuit coupled to receive a voltage signal corresponding to a reference current of the current mirror, the CTAT circuit comprising a second BJT coupled to form a base current based on the voltage signal. 2. The integrated circuit of claim 1, wherein the base current cancellation circuit further comprises a reference circuit coupled to the current mirror to provide the voltage signal at an output of the base current cancellation circuit. 3. The integrated circuit of claim 2, wherein the reference circuit further comprises:
a first transistor having a control electrode coupled to a collector electrode of the first BJT and a first current electrode coupled to the output of the base current cancellation circuit; and a second transistor having a first current electrode and a control electrode coupled to a second current electrode of the first transistor. 4. The integrated circuit of claim 1, wherein the current mirror further comprises:
a first P-channel transistor having a first current electrode coupled to a first voltage supply terminal; and a second P-channel transistor having a first current electrode coupled to the first voltage supply terminal and a second current electrode coupled to a control electrode of each of the first P-channel transistor and the second P-channel transistor. 5. The integrated circuit of claim 4, wherein the CTAT circuit further comprises a third P-channel transistor having a first current electrode coupled to the first voltage supply terminal, a control electrode coupled to receive the voltage signal, and a second current electrode coupled to a base electrode of the second BJT. 6. The integrated circuit of claim 5, wherein the CTAT circuit further comprises a resistor having a first terminal coupled to the base electrode of the second BJT and a second terminal coupled to a second voltage supply terminal. 7. The integrated circuit of claim 1, wherein the base current cancellation circuit further comprises a first bias transistor having a first current electrode coupled to a collector electrode of the first BJT and a control electrode coupled to receive a bias voltage, the first bias transistor to provide a first bias current. 8. The integrated circuit of claim 7, wherein the CTAT circuit further comprises a second bias transistor having a first current electrode coupled to a collector electrode of the second BJT and a control electrode coupled to receive the bias voltage, the second bias transistor to provide a second bias current. 9. The integrated circuit of claim 1, further comprising a compensation circuit coupled to a collector electrode of the second BJT. 10. An integrated circuit comprising:
a base current cancellation circuit comprising:
a first bipolar junction transistor (BJT),
a first current mirror having a first branch and a second branch, the first branch coupled to a base electrode of the first BJT and the second branch coupled to form a reference voltage signal, wherein at the base electrode, only the base electrode is coupled to the first current mirror; and
a complementary to absolute temperature (CTAT) circuit comprising:
a first transistor having a control electrode coupled to receive the reference voltage signal, and
a second BJT having a base electrode coupled to a first current electrode of the first transistor. 11. The integrated circuit of claim 10, wherein the first current mirror comprises:
a first P-channel transistor having a first current electrode coupled to a first voltage supply terminal; and a second P-channel transistor having a first current electrode coupled to the first voltage supply terminal and a second current electrode coupled to a control electrode of each of the first P-channel transistor and the second P-channel transistor. 12. The integrated circuit of claim 10, wherein the base current cancellation circuit further comprises a first bias transistor having a first current electrode coupled to a collector electrode of the first BJT and a control electrode coupled to receive a bias voltage. 13. The integrated circuit of claim 12, wherein the CTAT circuit further comprises a second bias transistor having a first current electrode coupled to a collector electrode of the second BJT and a control electrode coupled to receive the bias voltage. 14. The integrated circuit of claim 10, wherein the base current cancellation circuit further comprises a reference circuit coupled to the second branch of the first current mirror to form the reference voltage signal at an output of the base current cancellation circuit. 15. The integrated circuit of claim 14, wherein the reference circuit further comprises:
a third transistor having a control electrode coupled to a collector electrode of the first BJT and a first current electrode coupled to the output of the base current cancellation circuit; and a fourth transistor having a first current electrode and a control electrode coupled to a second current electrode of the third transistor. 16. The integrated circuit of claim 10, wherein the CTAT circuit further comprises a second current mirror having a first branch and a second branch, the first branch coupled to a base electrode of the second BJT. 17. The integrated circuit of claim 10, wherein the second BJT is formed to have substantially the same size as the first BJT. 18. An integrated circuit comprising:
a first bipolar junction transistor (BJT); a first current mirror having a first branch and a second branch, the first branch coupled to a base electrode of the first BJT and the second branch coupled to a reference circuit, wherein at the base electrode, only the base electrode is coupled to the first current mirror; a first bias transistor having a control electrode coupled to receive a bias voltage and first current electrode coupled to the reference circuit and a current electrode of the first BJT; a first transistor having a control electrode coupled to the second branch and a first current electrode coupled to a first voltage supply terminal; and a second BJT having a base electrode coupled to a second current electrode of the first transistor and a current electrode coupled to a second voltage supply terminal. 19. The integrated circuit of claim 18, wherein the reference circuit comprises:
a second transistor having a control electrode coupled to the first current electrode of the first transistor and a first current electrode coupled to the second branch; and a third transistor having a first current electrode and a control electrode coupled to a second current electrode of the second transistor and a second current electrode coupled to the second voltage supply terminal. 20. The integrated circuit of claim 18, wherein the first current mirror comprises:
a first P-channel transistor in the first branch having a first current electrode coupled to the first voltage supply terminal; and a second P-channel transistor in the second branch having a first current electrode coupled to the first voltage supply terminal and a second current electrode coupled to the reference circuit and a control electrode of each of the first P-channel transistor and the second P-channel transistor. | An integrated circuit includes a base current cancellation circuit and a complementary to absolute temperature (CTAT) circuit. The base current cancellation circuit includes a first bipolar junction transistor (BJT) and a current mirror coupled to the first BJT. The current mirror is configured to provide a mirrored current to a base electrode of the first BJT. The CTAT circuit is coupled to receive a voltage signal corresponding to a reference current of the current mirror. The CTAT circuit includes a second BJT coupled to form a base current based on the voltage signal.1. An integrated circuit comprising:
a base current cancellation circuit comprising: a first bipolar junction transistor (BJT), and a current mirror coupled to a base electrode of the first BJT, the current mirror configured to provide a mirrored current to the base electrode of the first BJT, wherein at the base electrode, only the base electrode is coupled to the current mirror; and a complementary to absolute temperature (CTAT) circuit coupled to receive a voltage signal corresponding to a reference current of the current mirror, the CTAT circuit comprising a second BJT coupled to form a base current based on the voltage signal. 2. The integrated circuit of claim 1, wherein the base current cancellation circuit further comprises a reference circuit coupled to the current mirror to provide the voltage signal at an output of the base current cancellation circuit. 3. The integrated circuit of claim 2, wherein the reference circuit further comprises:
a first transistor having a control electrode coupled to a collector electrode of the first BJT and a first current electrode coupled to the output of the base current cancellation circuit; and a second transistor having a first current electrode and a control electrode coupled to a second current electrode of the first transistor. 4. The integrated circuit of claim 1, wherein the current mirror further comprises:
a first P-channel transistor having a first current electrode coupled to a first voltage supply terminal; and a second P-channel transistor having a first current electrode coupled to the first voltage supply terminal and a second current electrode coupled to a control electrode of each of the first P-channel transistor and the second P-channel transistor. 5. The integrated circuit of claim 4, wherein the CTAT circuit further comprises a third P-channel transistor having a first current electrode coupled to the first voltage supply terminal, a control electrode coupled to receive the voltage signal, and a second current electrode coupled to a base electrode of the second BJT. 6. The integrated circuit of claim 5, wherein the CTAT circuit further comprises a resistor having a first terminal coupled to the base electrode of the second BJT and a second terminal coupled to a second voltage supply terminal. 7. The integrated circuit of claim 1, wherein the base current cancellation circuit further comprises a first bias transistor having a first current electrode coupled to a collector electrode of the first BJT and a control electrode coupled to receive a bias voltage, the first bias transistor to provide a first bias current. 8. The integrated circuit of claim 7, wherein the CTAT circuit further comprises a second bias transistor having a first current electrode coupled to a collector electrode of the second BJT and a control electrode coupled to receive the bias voltage, the second bias transistor to provide a second bias current. 9. The integrated circuit of claim 1, further comprising a compensation circuit coupled to a collector electrode of the second BJT. 10. An integrated circuit comprising:
a base current cancellation circuit comprising:
a first bipolar junction transistor (BJT),
a first current mirror having a first branch and a second branch, the first branch coupled to a base electrode of the first BJT and the second branch coupled to form a reference voltage signal, wherein at the base electrode, only the base electrode is coupled to the first current mirror; and
a complementary to absolute temperature (CTAT) circuit comprising:
a first transistor having a control electrode coupled to receive the reference voltage signal, and
a second BJT having a base electrode coupled to a first current electrode of the first transistor. 11. The integrated circuit of claim 10, wherein the first current mirror comprises:
a first P-channel transistor having a first current electrode coupled to a first voltage supply terminal; and a second P-channel transistor having a first current electrode coupled to the first voltage supply terminal and a second current electrode coupled to a control electrode of each of the first P-channel transistor and the second P-channel transistor. 12. The integrated circuit of claim 10, wherein the base current cancellation circuit further comprises a first bias transistor having a first current electrode coupled to a collector electrode of the first BJT and a control electrode coupled to receive a bias voltage. 13. The integrated circuit of claim 12, wherein the CTAT circuit further comprises a second bias transistor having a first current electrode coupled to a collector electrode of the second BJT and a control electrode coupled to receive the bias voltage. 14. The integrated circuit of claim 10, wherein the base current cancellation circuit further comprises a reference circuit coupled to the second branch of the first current mirror to form the reference voltage signal at an output of the base current cancellation circuit. 15. The integrated circuit of claim 14, wherein the reference circuit further comprises:
a third transistor having a control electrode coupled to a collector electrode of the first BJT and a first current electrode coupled to the output of the base current cancellation circuit; and a fourth transistor having a first current electrode and a control electrode coupled to a second current electrode of the third transistor. 16. The integrated circuit of claim 10, wherein the CTAT circuit further comprises a second current mirror having a first branch and a second branch, the first branch coupled to a base electrode of the second BJT. 17. The integrated circuit of claim 10, wherein the second BJT is formed to have substantially the same size as the first BJT. 18. An integrated circuit comprising:
a first bipolar junction transistor (BJT); a first current mirror having a first branch and a second branch, the first branch coupled to a base electrode of the first BJT and the second branch coupled to a reference circuit, wherein at the base electrode, only the base electrode is coupled to the first current mirror; a first bias transistor having a control electrode coupled to receive a bias voltage and first current electrode coupled to the reference circuit and a current electrode of the first BJT; a first transistor having a control electrode coupled to the second branch and a first current electrode coupled to a first voltage supply terminal; and a second BJT having a base electrode coupled to a second current electrode of the first transistor and a current electrode coupled to a second voltage supply terminal. 19. The integrated circuit of claim 18, wherein the reference circuit comprises:
a second transistor having a control electrode coupled to the first current electrode of the first transistor and a first current electrode coupled to the second branch; and a third transistor having a first current electrode and a control electrode coupled to a second current electrode of the second transistor and a second current electrode coupled to the second voltage supply terminal. 20. The integrated circuit of claim 18, wherein the first current mirror comprises:
a first P-channel transistor in the first branch having a first current electrode coupled to the first voltage supply terminal; and a second P-channel transistor in the second branch having a first current electrode coupled to the first voltage supply terminal and a second current electrode coupled to the reference circuit and a control electrode of each of the first P-channel transistor and the second P-channel transistor. | 2,800 |
11,771 | 11,771 | 15,495,245 | 2,828 | A laser system's laser light energy control and resulting dose control is improved by creating and using a set of gain estimators, one for each of a set or range of laser light pulse repetition rates. When a new repetition rate is used, its corresponding gain estimator is retrieved, used to compute the voltage to fire the laser source, and updated. The resulting generated laser light thereby avoids the convergence delay inherent in prior laser systems and, further, can repeatedly do so with subsequent specified repetition rates. | 1. A method of laser light energy control comprising:
receiving, in a laser system controller, a first laser trigger command and a voltage command; converting, by the laser system controller, the voltage command to a first energy target; determining, by the laser system controller, a first laser repetition rate based on a difference between the first laser trigger command and a previous laser trigger command; retrieving, by the laser system controller, a first repetition rate gain estimator corresponding to the first laser repetition rate; determining, by the laser system controller, a first laser voltage using the first energy target and the first repetition rate gain estimator; directing, by the laser system controller, a laser source to fire using the first laser voltage; receiving, in the laser system controller, a subsequent laser trigger command and a subsequent voltage command; converting, by the laser system controller, the subsequent voltage command to a second energy target; determining, by the laser system controller, a second laser repetition rate based on a difference between the subsequent laser trigger command and the first laser trigger command, wherein the second laser repetition rate is different than the first laser repetition rate; retrieving, by the laser system controller, a second repetition rate gain estimator corresponding to the second laser repetition rate; determining, by the laser system controller, a second laser voltage using the second energy target and the second repetition rate gain estimator; and, directing, by the laser system controller, the laser source to fire using the second laser voltage. 2. The method of claim 1 further comprising before the steps of claim 1:
setting the first repetition rate gain estimator and the second repetition rate gain estimator to a default value. 3. The method of claim 2 further comprising:
updating the first repetition rate gain estimator after directing the laser source to fire using the first laser voltage and before receiving the subsequent laser trigger command and the subsequent voltage command; and,
updating the second repetition rate gain estimator after directing the laser source to fire using the second laser voltage and before receiving any other laser trigger command and any other voltage command. 4. The method of claim 2 further comprising:
updating the first repetition rate gain estimator and the second repetition rate gain estimator after directing the laser source to fire using the first laser voltage and before receiving the subsequent laser trigger command and the subsequent voltage command; and,
updating the first repetition rate gain estimator and the second repetition rate gain estimator after directing the laser source to fire using the second laser voltage and before receiving any other laser trigger command and any other voltage command. 5. A laser system for laser light energy control comprising:
a laser system controller configured to: receive a first laser trigger command and a voltage command; convert the voltage command to a first energy target; determine a first laser repetition rate based on a difference between the first laser trigger command and a previous laser trigger command; retrieve a first repetition rate gain estimator corresponding to the first laser repetition rate; determine a first laser voltage using the first energy target and the first repetition rate gain estimator; direct a laser source to fire using the first laser voltage; receive a subsequent laser trigger command and a subsequent voltage command; convert the subsequent voltage command to a second energy target; determine a second laser repetition rate based on a difference between the subsequent laser trigger command and the first laser trigger command, wherein the second laser repetition rate is different than the first laser repetition rate; retrieve a second repetition rate gain estimator corresponding to the second laser repetition rate; determine a second laser voltage using the second energy target and the second repetition rate gain estimator; and, direct the laser source to fire using the second laser voltage. 6. The laser system of claim 5, wherein the laser system controller is further configured to set the first repetition rate gain estimator and the second repetition rate gain estimator to a default value before receiving the first laser trigger command and the voltage command. 7. The laser system of claim 6, wherein the laser system controller is further configured to:
update the first repetition rate gain estimator after directing the laser source to fire using the first laser voltage and before receiving the subsequent laser trigger command and the subsequent voltage command; and, update the second repetition rate gain estimator after directing the laser source to fire using the second laser voltage and before receiving any other laser trigger command and any other voltage command. 8. The laser system of claim 6, wherein the laser system controller is further configured to:
update the first repetition rate gain estimator and the second repetition rate gain estimator after directing the laser source to fire using the first laser voltage and before receiving the subsequent laser trigger command and the subsequent voltage command; and, update the first repetition rate gain estimator and the second repetition rate gain estimator after directing the laser source to fire using the second laser voltage and before receiving any other laser trigger command and any other voltage command. | A laser system's laser light energy control and resulting dose control is improved by creating and using a set of gain estimators, one for each of a set or range of laser light pulse repetition rates. When a new repetition rate is used, its corresponding gain estimator is retrieved, used to compute the voltage to fire the laser source, and updated. The resulting generated laser light thereby avoids the convergence delay inherent in prior laser systems and, further, can repeatedly do so with subsequent specified repetition rates.1. A method of laser light energy control comprising:
receiving, in a laser system controller, a first laser trigger command and a voltage command; converting, by the laser system controller, the voltage command to a first energy target; determining, by the laser system controller, a first laser repetition rate based on a difference between the first laser trigger command and a previous laser trigger command; retrieving, by the laser system controller, a first repetition rate gain estimator corresponding to the first laser repetition rate; determining, by the laser system controller, a first laser voltage using the first energy target and the first repetition rate gain estimator; directing, by the laser system controller, a laser source to fire using the first laser voltage; receiving, in the laser system controller, a subsequent laser trigger command and a subsequent voltage command; converting, by the laser system controller, the subsequent voltage command to a second energy target; determining, by the laser system controller, a second laser repetition rate based on a difference between the subsequent laser trigger command and the first laser trigger command, wherein the second laser repetition rate is different than the first laser repetition rate; retrieving, by the laser system controller, a second repetition rate gain estimator corresponding to the second laser repetition rate; determining, by the laser system controller, a second laser voltage using the second energy target and the second repetition rate gain estimator; and, directing, by the laser system controller, the laser source to fire using the second laser voltage. 2. The method of claim 1 further comprising before the steps of claim 1:
setting the first repetition rate gain estimator and the second repetition rate gain estimator to a default value. 3. The method of claim 2 further comprising:
updating the first repetition rate gain estimator after directing the laser source to fire using the first laser voltage and before receiving the subsequent laser trigger command and the subsequent voltage command; and,
updating the second repetition rate gain estimator after directing the laser source to fire using the second laser voltage and before receiving any other laser trigger command and any other voltage command. 4. The method of claim 2 further comprising:
updating the first repetition rate gain estimator and the second repetition rate gain estimator after directing the laser source to fire using the first laser voltage and before receiving the subsequent laser trigger command and the subsequent voltage command; and,
updating the first repetition rate gain estimator and the second repetition rate gain estimator after directing the laser source to fire using the second laser voltage and before receiving any other laser trigger command and any other voltage command. 5. A laser system for laser light energy control comprising:
a laser system controller configured to: receive a first laser trigger command and a voltage command; convert the voltage command to a first energy target; determine a first laser repetition rate based on a difference between the first laser trigger command and a previous laser trigger command; retrieve a first repetition rate gain estimator corresponding to the first laser repetition rate; determine a first laser voltage using the first energy target and the first repetition rate gain estimator; direct a laser source to fire using the first laser voltage; receive a subsequent laser trigger command and a subsequent voltage command; convert the subsequent voltage command to a second energy target; determine a second laser repetition rate based on a difference between the subsequent laser trigger command and the first laser trigger command, wherein the second laser repetition rate is different than the first laser repetition rate; retrieve a second repetition rate gain estimator corresponding to the second laser repetition rate; determine a second laser voltage using the second energy target and the second repetition rate gain estimator; and, direct the laser source to fire using the second laser voltage. 6. The laser system of claim 5, wherein the laser system controller is further configured to set the first repetition rate gain estimator and the second repetition rate gain estimator to a default value before receiving the first laser trigger command and the voltage command. 7. The laser system of claim 6, wherein the laser system controller is further configured to:
update the first repetition rate gain estimator after directing the laser source to fire using the first laser voltage and before receiving the subsequent laser trigger command and the subsequent voltage command; and, update the second repetition rate gain estimator after directing the laser source to fire using the second laser voltage and before receiving any other laser trigger command and any other voltage command. 8. The laser system of claim 6, wherein the laser system controller is further configured to:
update the first repetition rate gain estimator and the second repetition rate gain estimator after directing the laser source to fire using the first laser voltage and before receiving the subsequent laser trigger command and the subsequent voltage command; and, update the first repetition rate gain estimator and the second repetition rate gain estimator after directing the laser source to fire using the second laser voltage and before receiving any other laser trigger command and any other voltage command. | 2,800 |
11,772 | 11,772 | 15,674,243 | 2,855 | A force sensor is suitable for an electrohydraulic hitch control system of an agricultural tractor. The force sensor has an outer cylindrical part with a bore and a measuring rod fixed on one side in the bore. A central section of the cylindrical part is provided as force introduction section. Two outer sections of the cylinder part are removed equally far axially from the center of the force introduction section and are provided as abutment sections. The measuring rod is clamped in an area of the force introduction section. | 1. A force sensor, comprising:
an outer cylindrical part with a bore and a measuring rod fixed on one side in the bore; wherein: a central section of the cylindrical part is a force introduction section, two outer sections of the outer cylindrical part are abutment sections, the two outer sections are removed equally far axially from the center of the force introduction section, and the measuring rod is clamped in an area of the force introduction section. 2. The force sensor according to claim 1, wherein:
starting from the force introduction section, in an axial direction toward both sides, a conical section with decreasing material thickness of a wall of the cylindrical part and then a cone-shaped transition with increasing material thickness of the wall of the cylindrical part extend toward the abutment sections, and the conical section extends over a length that is longer than a length over which the cone-shaped transition extends. 3. The force sensor according to claim 2, wherein that a ratio of the length of the conical section to the length of the cone-shaped transition is at least 4:1. 4. The force sensor according to claim 3, wherein
a change in material thickness extends continuously at at least one of: a transition between the force introduction section and the conical section; a transition between the conical section and the cone-shaped transition; and a transition between the cone-shaped transition and the abutment section. 5. The force sensor according to claim 4, wherein the measuring rod has a conical shape. 6. The force sensor according to claim 4, further comprising:
a permanent magnet fixed to a non-clamped end of the measuring rod; and a Hall sensor inserted into a receiving section of the cylindrical part, the Hall sensor configured to detect a position change of the permanent magnet in relation to a plane radial to a longitudinal axis of the outer cylindrical part. 7. The force sensor according to claim 6, further comprising:
a circuit board accommodated in the receiving section of the outer cylindrical part, the circuit board having evaluation electronics for the Hall sensor. 8. The force sensor according to claim 7, wherein the evaluation electronics on the circuit board are configured to convert a sensor signal into an analog current or voltage signal which corresponds to an actual force signal. 9. The force sensor according to claim 7, wherein the evaluation electronics on the circuit board are configured to convert a sensor signal into a digital actual force signal. 10. The force sensor according to claim 9, wherein the evaluation electronics on the circuit board include a field bus interface configured to enable the sensor to be incorporated into a higher-order digital electrohydraulic hitch control system. 11. The force sensor according to claim 1, wherein the force sensor is configured for use with an electrohydraulic hitch control system of an agricultural tractor. 12. The force sensor according to claim 3, wherein the ratio is at least 6:1, 8:1 or 10:1. 13. The force sensor according to claim 4, wherein the change in material thickness is in the form of rounding. 14. The force sensor according to claim 5, wherein the measuring rod has at least two shoulders for a screw-in tool. 15. The force sensor according to claim 10, wherein the field base interface is a CAN bus interface. | A force sensor is suitable for an electrohydraulic hitch control system of an agricultural tractor. The force sensor has an outer cylindrical part with a bore and a measuring rod fixed on one side in the bore. A central section of the cylindrical part is provided as force introduction section. Two outer sections of the cylinder part are removed equally far axially from the center of the force introduction section and are provided as abutment sections. The measuring rod is clamped in an area of the force introduction section.1. A force sensor, comprising:
an outer cylindrical part with a bore and a measuring rod fixed on one side in the bore; wherein: a central section of the cylindrical part is a force introduction section, two outer sections of the outer cylindrical part are abutment sections, the two outer sections are removed equally far axially from the center of the force introduction section, and the measuring rod is clamped in an area of the force introduction section. 2. The force sensor according to claim 1, wherein:
starting from the force introduction section, in an axial direction toward both sides, a conical section with decreasing material thickness of a wall of the cylindrical part and then a cone-shaped transition with increasing material thickness of the wall of the cylindrical part extend toward the abutment sections, and the conical section extends over a length that is longer than a length over which the cone-shaped transition extends. 3. The force sensor according to claim 2, wherein that a ratio of the length of the conical section to the length of the cone-shaped transition is at least 4:1. 4. The force sensor according to claim 3, wherein
a change in material thickness extends continuously at at least one of: a transition between the force introduction section and the conical section; a transition between the conical section and the cone-shaped transition; and a transition between the cone-shaped transition and the abutment section. 5. The force sensor according to claim 4, wherein the measuring rod has a conical shape. 6. The force sensor according to claim 4, further comprising:
a permanent magnet fixed to a non-clamped end of the measuring rod; and a Hall sensor inserted into a receiving section of the cylindrical part, the Hall sensor configured to detect a position change of the permanent magnet in relation to a plane radial to a longitudinal axis of the outer cylindrical part. 7. The force sensor according to claim 6, further comprising:
a circuit board accommodated in the receiving section of the outer cylindrical part, the circuit board having evaluation electronics for the Hall sensor. 8. The force sensor according to claim 7, wherein the evaluation electronics on the circuit board are configured to convert a sensor signal into an analog current or voltage signal which corresponds to an actual force signal. 9. The force sensor according to claim 7, wherein the evaluation electronics on the circuit board are configured to convert a sensor signal into a digital actual force signal. 10. The force sensor according to claim 9, wherein the evaluation electronics on the circuit board include a field bus interface configured to enable the sensor to be incorporated into a higher-order digital electrohydraulic hitch control system. 11. The force sensor according to claim 1, wherein the force sensor is configured for use with an electrohydraulic hitch control system of an agricultural tractor. 12. The force sensor according to claim 3, wherein the ratio is at least 6:1, 8:1 or 10:1. 13. The force sensor according to claim 4, wherein the change in material thickness is in the form of rounding. 14. The force sensor according to claim 5, wherein the measuring rod has at least two shoulders for a screw-in tool. 15. The force sensor according to claim 10, wherein the field base interface is a CAN bus interface. | 2,800 |
11,773 | 11,773 | 13,234,205 | 2,817 | An electrical fuse device is disclosed. A circuit apparatus can include the fuse device, a first circuit element and a second circuit element. The fuse includes a first contact that has a first electromigration resistance, a second contact that has a second electromigration resistance and a metal line, which is coupled to the first contact and to the second contact, that has a third electromigration resistance that is lower than the second electromigration resistance. The first circuit element is coupled to the first contact and the second circuit element coupled to the second contact. The fuse is configured to conduct a programming current from the first contact to the second contact through the metal line. Further, the programming current causes the metal line to electromigrate away from the second contact to electrically isolate the second circuit element from the first circuit element. | 1. A circuit apparatus comprising:
a fuse including a first contact that has a first electromigration resistance, a second contact that has a second electromigration resistance and a metal line, which is coupled to the first contact and to the second contact, that has a third electromigration resistance that is lower than the second electromigration resistance; a first circuit element coupled to the first contact; and a second circuit element coupled to the second contact, wherein the fuse is configured to conduct a programming current from the first contact to the second contact through the metal line and wherein the programming current causes the metal line to electromigrate away from the second contact to electrically isolate the second circuit element from the first circuit element. 2. The circuit apparatus of claim 1, wherein the programming current is a first programming current, wherein the fuse is configured to conduct a second programming current through the metal line and wherein the first programming current heats the metal line to aid the electromigration of the metal line. 3. The circuit apparatus of claim 2, wherein the metal line is coupled to a via connected to a separate level of the circuit apparatus and wherein the second programming current flows to the separate level through the via. 4. The circuit apparatus of claim 3, wherein the programming currents cause the metal line to electromigrate away from the second contact to electrically isolate the second circuit element from the separate level of the circuit apparatus. 5. The circuit apparatus of claim 1, wherein the third electromigration resistance is lower than the first electromigration resistance. 6. The circuit apparatus of claim 1, wherein the first and second contacts are tungsten contacts and wherein the metal line is a copper line. 7. The circuit apparatus of claim 1, wherein a thickness of the metal line between the first and second contacts, from any cross-sectional viewing angle, is constant. 8. An electric fuse device comprising:
a first contact that has a first electromigration resistance; a second contact that has a second electromigration resistance; and a metal line, which is coupled to the first contact and to the second contact, that has a third electromigration resistance that is lower than the second electromigration resistance, wherein the device is configured to conduct a programming current from the first contact to the second contact through the metal line and wherein the programming current causes the metal line to electromigrate away from the second contact to program the device. 9. The electric fuse device of claim 8, wherein the programming current is a first programming current, wherein the device is configured to conduct a second programming current through the metal line and wherein the first programming current heats the metal line to aid the electromigration of the metal line. 10. The electric fuse device of claim 9, wherein the first programming current heats the metal line to a temperature that is between 40° C. and 350° C. 11. The electric fuse device of claim 8, wherein the third electromigration resistance is lower than the first electromigration resistance. 12. The electric fuse device of claim 11, wherein the first and second electromigration resistances are equal. 13. The electric fuse device of claim 12, wherein the first and second contacts are tungsten contacts and wherein the metal line is a copper line. 14. The electric fuse device of claim 8, wherein a thickness of the metal line between the first and second contacts, from any cross-sectional viewing angle, is constant. 15. A method for programming an electrical fuse device comprising:
coupling a cathode element to a contact that is connected to a metal line; coupling an anode element to the metal line; and activating the anode and cathode elements to apply a programming current through the contact and the metal line such that the metal line electromigrates away from the contact as a result of said activating. 16. The method of claim 15, wherein the contact is a first contact, wherein the coupling the anode element further comprises coupling the anode element to a second contact such that the activating causes the programming current to flow between the second contact and the first contact through the metal line. 17. The method of claim 16, wherein the programming current is a first programming current and wherein the method further comprises:
coupling a second cathode element and a second anode element to the metal line, wherein the activating comprises activating the second cathode element and the second anode element to apply a second programming current through the metal line, wherein the first programming current heats the metal line to aid the electromigration of the metal line. 18. The method of claim 17, wherein the coupling the second cathode element further comprises coupling the second cathode element to the metal line through a via connected to a separate level of a circuit and wherein the second programming current flows to the separate level through the via. 19. The method of claim 16, wherein the first and second contacts are tungsten contacts and wherein the metal line is a copper line. 20. The method of claim 16, wherein a thickness of the metal line between the first and second contacts, from any cross-sectional viewing angle, is constant. 21. A method for fabricating a fuse device comprising:
forming a first contact in a first aperture of an insulator and a second contact in a second aperture of the insulator; forming a metal line over the insulator, the first contact and the second contact; coupling a cathode element to the second contact and coupling an anode element to the first contact such that activating the anode and cathode elements applies a programming current through the metal line such that the metal line electromigrates away from the second contact as a result of said activating. 22. The method of claim 21, wherein the programming current is a first programming current, and wherein the method further comprises:
coupling a second cathode element and a second anode element to the metal line such that activation of the second cathode element and the second anode element applies a second programming current through the metal line, wherein the first programming current heats the metal line to aid the electromigration of the metal line. 23. The method of claim 22, further comprising:
forming a via over the metal line, wherein the coupling the second cathode element further comprises coupling the second cathode element to the metal line through the via and wherein the second programming current flows through the via. 24. The method of claim 21, wherein the first and second contacts are tungsten contacts and wherein the metal line is a copper line. 25. The method of claim 21, wherein a thickness of the metal line between the first and second contacts, from any cross-sectional viewing angle, is constant. | An electrical fuse device is disclosed. A circuit apparatus can include the fuse device, a first circuit element and a second circuit element. The fuse includes a first contact that has a first electromigration resistance, a second contact that has a second electromigration resistance and a metal line, which is coupled to the first contact and to the second contact, that has a third electromigration resistance that is lower than the second electromigration resistance. The first circuit element is coupled to the first contact and the second circuit element coupled to the second contact. The fuse is configured to conduct a programming current from the first contact to the second contact through the metal line. Further, the programming current causes the metal line to electromigrate away from the second contact to electrically isolate the second circuit element from the first circuit element.1. A circuit apparatus comprising:
a fuse including a first contact that has a first electromigration resistance, a second contact that has a second electromigration resistance and a metal line, which is coupled to the first contact and to the second contact, that has a third electromigration resistance that is lower than the second electromigration resistance; a first circuit element coupled to the first contact; and a second circuit element coupled to the second contact, wherein the fuse is configured to conduct a programming current from the first contact to the second contact through the metal line and wherein the programming current causes the metal line to electromigrate away from the second contact to electrically isolate the second circuit element from the first circuit element. 2. The circuit apparatus of claim 1, wherein the programming current is a first programming current, wherein the fuse is configured to conduct a second programming current through the metal line and wherein the first programming current heats the metal line to aid the electromigration of the metal line. 3. The circuit apparatus of claim 2, wherein the metal line is coupled to a via connected to a separate level of the circuit apparatus and wherein the second programming current flows to the separate level through the via. 4. The circuit apparatus of claim 3, wherein the programming currents cause the metal line to electromigrate away from the second contact to electrically isolate the second circuit element from the separate level of the circuit apparatus. 5. The circuit apparatus of claim 1, wherein the third electromigration resistance is lower than the first electromigration resistance. 6. The circuit apparatus of claim 1, wherein the first and second contacts are tungsten contacts and wherein the metal line is a copper line. 7. The circuit apparatus of claim 1, wherein a thickness of the metal line between the first and second contacts, from any cross-sectional viewing angle, is constant. 8. An electric fuse device comprising:
a first contact that has a first electromigration resistance; a second contact that has a second electromigration resistance; and a metal line, which is coupled to the first contact and to the second contact, that has a third electromigration resistance that is lower than the second electromigration resistance, wherein the device is configured to conduct a programming current from the first contact to the second contact through the metal line and wherein the programming current causes the metal line to electromigrate away from the second contact to program the device. 9. The electric fuse device of claim 8, wherein the programming current is a first programming current, wherein the device is configured to conduct a second programming current through the metal line and wherein the first programming current heats the metal line to aid the electromigration of the metal line. 10. The electric fuse device of claim 9, wherein the first programming current heats the metal line to a temperature that is between 40° C. and 350° C. 11. The electric fuse device of claim 8, wherein the third electromigration resistance is lower than the first electromigration resistance. 12. The electric fuse device of claim 11, wherein the first and second electromigration resistances are equal. 13. The electric fuse device of claim 12, wherein the first and second contacts are tungsten contacts and wherein the metal line is a copper line. 14. The electric fuse device of claim 8, wherein a thickness of the metal line between the first and second contacts, from any cross-sectional viewing angle, is constant. 15. A method for programming an electrical fuse device comprising:
coupling a cathode element to a contact that is connected to a metal line; coupling an anode element to the metal line; and activating the anode and cathode elements to apply a programming current through the contact and the metal line such that the metal line electromigrates away from the contact as a result of said activating. 16. The method of claim 15, wherein the contact is a first contact, wherein the coupling the anode element further comprises coupling the anode element to a second contact such that the activating causes the programming current to flow between the second contact and the first contact through the metal line. 17. The method of claim 16, wherein the programming current is a first programming current and wherein the method further comprises:
coupling a second cathode element and a second anode element to the metal line, wherein the activating comprises activating the second cathode element and the second anode element to apply a second programming current through the metal line, wherein the first programming current heats the metal line to aid the electromigration of the metal line. 18. The method of claim 17, wherein the coupling the second cathode element further comprises coupling the second cathode element to the metal line through a via connected to a separate level of a circuit and wherein the second programming current flows to the separate level through the via. 19. The method of claim 16, wherein the first and second contacts are tungsten contacts and wherein the metal line is a copper line. 20. The method of claim 16, wherein a thickness of the metal line between the first and second contacts, from any cross-sectional viewing angle, is constant. 21. A method for fabricating a fuse device comprising:
forming a first contact in a first aperture of an insulator and a second contact in a second aperture of the insulator; forming a metal line over the insulator, the first contact and the second contact; coupling a cathode element to the second contact and coupling an anode element to the first contact such that activating the anode and cathode elements applies a programming current through the metal line such that the metal line electromigrates away from the second contact as a result of said activating. 22. The method of claim 21, wherein the programming current is a first programming current, and wherein the method further comprises:
coupling a second cathode element and a second anode element to the metal line such that activation of the second cathode element and the second anode element applies a second programming current through the metal line, wherein the first programming current heats the metal line to aid the electromigration of the metal line. 23. The method of claim 22, further comprising:
forming a via over the metal line, wherein the coupling the second cathode element further comprises coupling the second cathode element to the metal line through the via and wherein the second programming current flows through the via. 24. The method of claim 21, wherein the first and second contacts are tungsten contacts and wherein the metal line is a copper line. 25. The method of claim 21, wherein a thickness of the metal line between the first and second contacts, from any cross-sectional viewing angle, is constant. | 2,800 |
11,774 | 11,774 | 15,951,470 | 2,826 | An image sensor including a semiconductor layer. A light absorber layer couples with the semiconductor layer at a pixel of the image sensor and absorbs incident light to substantially prevent the incident light from entering the semiconductor layer. The light absorber layer heats a depletion region of the semiconductor layer in response to absorbing the incident light, creating electron/hole pairs. The light absorber layer may include one or more narrow bandgap materials. | 1. An image sensor, comprising:
a semiconductor layer, and; a light absorber layer coupled with the semiconductor layer at a pixel of the image sensor, the light absorber layer configured to absorb a predetermined range of wavelengths of incident light and to substantially prevent all of the predetermined range of wavelengths of incident light from entering the semiconductor layer; wherein the light absorber layer is configured to heat a region of the semiconductor layer. 2. The image sensor of claim 1, further comprising:
a microlens, the light absorber layer coupled between the microlens and the semiconductor layer, the microlens configured to refract the incident light towards the light absorber layer; and a guide coupled between the microlens and the light absorber layer and configured to convey the refracted light to the light absorber layer. 3. The image sensor of claim 1, wherein the image sensor comprises a backside integrated (BSI) sensor. 4. The image sensor of claim 1, wherein the light absorber layer is positioned between two shallow trenches in the semiconductor layer, each shallow trench extending only partially through the semiconductor layer from a backside of the semiconductor layer towards a frontside of the semiconductor layer. 5. The image sensor of claim 1, wherein the light absorber layer is positioned between two deep trenches of the semiconductor layer, each deep trench extending fully through the semiconductor layer from a backside of the semiconductor layer through to a frontside of the semiconductor layer. 6. The image sensor of claim 1, further comprising an anti-reflective coating coupled to the light absorption layer. 7. The image sensor of claim 2, wherein a length of the light absorbing layer is at least as long as a length of the microlens at an end of the microlens adjacent to the semiconductor layer. 8. The image sensor of claim 1, wherein the light absorber layer is configured to create electron/hole pairs in the heated region. 9. An image sensor, comprising:
a photodiode comprised at least partially within a semiconductor layer; a light absorber layer coupled with the photodiode, the light absorber layer configured to absorb incident light within predetermined wavelengths to substantially prevent the predetermined wavelengths of incident light from passing from the light absorber layer to the photodiode; and at least one dielectric layer directly coupled with the semiconductor layer; wherein the light absorber layer is configured to heat a region of the semiconductor layer. 10. The image sensor of claim 9, wherein the light absorber layer is comprised at a backside of the semiconductor layer, wherein the at least one dielectric layer comprises a frontside dielectric layer and a backside dielectric layer, wherein the backside dielectric layer is located at the backside of the semiconductor layer; wherein a focusing element is comprised proximate the backside dielectric layer and is configured to focus the incident light through the backside dielectric layer towards the light absorber layer; and wherein the frontside dielectric layer is comprised at a frontside of the semiconductor layer opposite the backside of the semiconductor layer. 11. The image sensor of claim 9, wherein the light absorber layer is comprised at a frontside of the semiconductor layer; the at least one dielectric layer comprises a frontside dielectric layer coupled at the frontside of the semiconductor layer; and a focusing element is comprised proximate the frontside dielectric layer and is configured to focus the incident light through the frontside dielectric layer towards the light absorber layer. 12. The image sensor of claim 9, wherein the light absorber layer is configured to create electron/hole pairs in the heated region. 13. An image sensor, comprising:
a semiconductor layer, and; substantially all of a first side of a light absorber layer directly coupled with the semiconductor layer at a pixel of the image sensor, the light absorber layer configured to absorb a predetermined range of wavelengths of incident light and to substantially prevent all of the predetermined range of wavelengths of incident light from entering the semiconductor layer; wherein the light absorber layer is configured to heat a region of the semiconductor layer. 14. The image sensor of claim 13, further comprising:
a microlens, the light absorber layer coupled between the microlens and the semiconductor layer, the microlens configured to refract the incident light towards the light absorber layer; and a guide coupled between the microlens and the light absorber layer and configured to convey the refracted light to the light absorber layer. 15. The image sensor of claim 13, wherein the image sensor comprises a backside integrated (BSI) sensor. 16. The image sensor of claim 13, wherein the light absorber layer is positioned between two shallow trenches in the semiconductor layer, each shallow trench extending only partially through the semiconductor layer from a backside of the semiconductor layer towards a frontside of the semiconductor layer. 17. The image sensor of claim 13, wherein the light absorber layer is positioned between two deep trenches of the semiconductor layer, each deep trench extending fully through the semiconductor layer from a backside of the semiconductor layer through to a frontside of the semiconductor layer. 18. The image sensor of claim 13, further comprising an anti-reflective coating coupled to the light absorption layer. 19. The image sensor of claim 14, wherein a length of the light absorbing layer is at least as long as a length of the microlens at an end of the microlens adjacent to the semiconductor layer. 20. The image sensor of claim 14, wherein the light absorber layer is configured to create electron/hole pairs in the heated region. | An image sensor including a semiconductor layer. A light absorber layer couples with the semiconductor layer at a pixel of the image sensor and absorbs incident light to substantially prevent the incident light from entering the semiconductor layer. The light absorber layer heats a depletion region of the semiconductor layer in response to absorbing the incident light, creating electron/hole pairs. The light absorber layer may include one or more narrow bandgap materials.1. An image sensor, comprising:
a semiconductor layer, and; a light absorber layer coupled with the semiconductor layer at a pixel of the image sensor, the light absorber layer configured to absorb a predetermined range of wavelengths of incident light and to substantially prevent all of the predetermined range of wavelengths of incident light from entering the semiconductor layer; wherein the light absorber layer is configured to heat a region of the semiconductor layer. 2. The image sensor of claim 1, further comprising:
a microlens, the light absorber layer coupled between the microlens and the semiconductor layer, the microlens configured to refract the incident light towards the light absorber layer; and a guide coupled between the microlens and the light absorber layer and configured to convey the refracted light to the light absorber layer. 3. The image sensor of claim 1, wherein the image sensor comprises a backside integrated (BSI) sensor. 4. The image sensor of claim 1, wherein the light absorber layer is positioned between two shallow trenches in the semiconductor layer, each shallow trench extending only partially through the semiconductor layer from a backside of the semiconductor layer towards a frontside of the semiconductor layer. 5. The image sensor of claim 1, wherein the light absorber layer is positioned between two deep trenches of the semiconductor layer, each deep trench extending fully through the semiconductor layer from a backside of the semiconductor layer through to a frontside of the semiconductor layer. 6. The image sensor of claim 1, further comprising an anti-reflective coating coupled to the light absorption layer. 7. The image sensor of claim 2, wherein a length of the light absorbing layer is at least as long as a length of the microlens at an end of the microlens adjacent to the semiconductor layer. 8. The image sensor of claim 1, wherein the light absorber layer is configured to create electron/hole pairs in the heated region. 9. An image sensor, comprising:
a photodiode comprised at least partially within a semiconductor layer; a light absorber layer coupled with the photodiode, the light absorber layer configured to absorb incident light within predetermined wavelengths to substantially prevent the predetermined wavelengths of incident light from passing from the light absorber layer to the photodiode; and at least one dielectric layer directly coupled with the semiconductor layer; wherein the light absorber layer is configured to heat a region of the semiconductor layer. 10. The image sensor of claim 9, wherein the light absorber layer is comprised at a backside of the semiconductor layer, wherein the at least one dielectric layer comprises a frontside dielectric layer and a backside dielectric layer, wherein the backside dielectric layer is located at the backside of the semiconductor layer; wherein a focusing element is comprised proximate the backside dielectric layer and is configured to focus the incident light through the backside dielectric layer towards the light absorber layer; and wherein the frontside dielectric layer is comprised at a frontside of the semiconductor layer opposite the backside of the semiconductor layer. 11. The image sensor of claim 9, wherein the light absorber layer is comprised at a frontside of the semiconductor layer; the at least one dielectric layer comprises a frontside dielectric layer coupled at the frontside of the semiconductor layer; and a focusing element is comprised proximate the frontside dielectric layer and is configured to focus the incident light through the frontside dielectric layer towards the light absorber layer. 12. The image sensor of claim 9, wherein the light absorber layer is configured to create electron/hole pairs in the heated region. 13. An image sensor, comprising:
a semiconductor layer, and; substantially all of a first side of a light absorber layer directly coupled with the semiconductor layer at a pixel of the image sensor, the light absorber layer configured to absorb a predetermined range of wavelengths of incident light and to substantially prevent all of the predetermined range of wavelengths of incident light from entering the semiconductor layer; wherein the light absorber layer is configured to heat a region of the semiconductor layer. 14. The image sensor of claim 13, further comprising:
a microlens, the light absorber layer coupled between the microlens and the semiconductor layer, the microlens configured to refract the incident light towards the light absorber layer; and a guide coupled between the microlens and the light absorber layer and configured to convey the refracted light to the light absorber layer. 15. The image sensor of claim 13, wherein the image sensor comprises a backside integrated (BSI) sensor. 16. The image sensor of claim 13, wherein the light absorber layer is positioned between two shallow trenches in the semiconductor layer, each shallow trench extending only partially through the semiconductor layer from a backside of the semiconductor layer towards a frontside of the semiconductor layer. 17. The image sensor of claim 13, wherein the light absorber layer is positioned between two deep trenches of the semiconductor layer, each deep trench extending fully through the semiconductor layer from a backside of the semiconductor layer through to a frontside of the semiconductor layer. 18. The image sensor of claim 13, further comprising an anti-reflective coating coupled to the light absorption layer. 19. The image sensor of claim 14, wherein a length of the light absorbing layer is at least as long as a length of the microlens at an end of the microlens adjacent to the semiconductor layer. 20. The image sensor of claim 14, wherein the light absorber layer is configured to create electron/hole pairs in the heated region. | 2,800 |
11,775 | 11,775 | 15,109,092 | 2,887 | Optical films are disclosed. More particularly, optical films including a collimating reflective polarizer are disclosed. The optical films are useful in backlights, and in particular backlight recycling cavities. Constructions suitable with both edge-lit and direct-lit backlights are disclosed. | 1. An optical film, comprising:
a collimating reflective polarizer; and an array of concave microlenses disposed on a major surface of the collimating reflective polarizer. 2. An optical film, comprising:
an optical substrate having a first and second major surface; a collimating reflective polarizer disposed on the first major surface of the optical substrate; and an array of concave microlenses disposed on the second major surface of the optical substrate. 3. The optical film of claim 1, wherein the collimating reflective polarizer has a transmission along a pass axis at normal incidence of Tpassnormal for p-pol light and a transmission along a pass axis at 60 degrees incidence of Tpass60 for p-pol light, and a ratio of Tpass60 to Tpassnormal is less than 0.75. 4. The optical film of claim 1, wherein each microlens in the array of concave microlenses has an aspect ratio of about 0.5. 5. The optical film of claim 1, wherein each microlens in the array of concave microlenses has an aspect ratio of less than about 0.5. 6. The optical film of claim 1, further comprising microfeatures disposed on a surface of the collimating reflective polarizer not disposed on the array of concave microlenses. 7. The optical film of claim 2, further comprising microfeatures disposed on a surface of the collimating reflective polarizer not disposed on the optical substrate. 8. The optical film of claim 6, wherein the microfeatures include beads. 9. An edge-lit backlight assembly, comprising:
the optical film of claim 1; and a lightguide; wherein the lightguide is disposed proximate the array of concave microlenses. 10. A direct-lit backlight assembly, comprising:
the optical film of claim 1; and one or more light sources; wherein the one or more light sources are disposed proximate the array of concave microlenses. 11. The optical film of claim 2, wherein the collimating reflective polarizer has a transmission along a pass axis at normal incidence of Tpassnormal for p-pol light and a transmission along a pass axis at 60 degrees incidence of Tpass60 for p-pol light, and a ratio of Tpass60 to Tpassnormal is less than 0.75. 12. The optical film of claim 2, wherein each microlens in the array of concave microlenses has an aspect ratio of about 0.5. 13. The optical film of claim 2, wherein each microlens in the array of concave microlenses has an aspect ratio of less than about 0.5. 14. The optical film of claim 7, wherein the microfeatures include beads. 15. An edge-lit backlight assembly, comprising:
the optical film of claim 2; and a lightguide; wherein the lightguide is disposed proximate the array of concave microlenses. 16. A direct-lit backlight assembly, comprising:
the optical film of claim 2; and one or more light sources; wherein the one or more light sources are disposed proximate the array of concave microlenses. | Optical films are disclosed. More particularly, optical films including a collimating reflective polarizer are disclosed. The optical films are useful in backlights, and in particular backlight recycling cavities. Constructions suitable with both edge-lit and direct-lit backlights are disclosed.1. An optical film, comprising:
a collimating reflective polarizer; and an array of concave microlenses disposed on a major surface of the collimating reflective polarizer. 2. An optical film, comprising:
an optical substrate having a first and second major surface; a collimating reflective polarizer disposed on the first major surface of the optical substrate; and an array of concave microlenses disposed on the second major surface of the optical substrate. 3. The optical film of claim 1, wherein the collimating reflective polarizer has a transmission along a pass axis at normal incidence of Tpassnormal for p-pol light and a transmission along a pass axis at 60 degrees incidence of Tpass60 for p-pol light, and a ratio of Tpass60 to Tpassnormal is less than 0.75. 4. The optical film of claim 1, wherein each microlens in the array of concave microlenses has an aspect ratio of about 0.5. 5. The optical film of claim 1, wherein each microlens in the array of concave microlenses has an aspect ratio of less than about 0.5. 6. The optical film of claim 1, further comprising microfeatures disposed on a surface of the collimating reflective polarizer not disposed on the array of concave microlenses. 7. The optical film of claim 2, further comprising microfeatures disposed on a surface of the collimating reflective polarizer not disposed on the optical substrate. 8. The optical film of claim 6, wherein the microfeatures include beads. 9. An edge-lit backlight assembly, comprising:
the optical film of claim 1; and a lightguide; wherein the lightguide is disposed proximate the array of concave microlenses. 10. A direct-lit backlight assembly, comprising:
the optical film of claim 1; and one or more light sources; wherein the one or more light sources are disposed proximate the array of concave microlenses. 11. The optical film of claim 2, wherein the collimating reflective polarizer has a transmission along a pass axis at normal incidence of Tpassnormal for p-pol light and a transmission along a pass axis at 60 degrees incidence of Tpass60 for p-pol light, and a ratio of Tpass60 to Tpassnormal is less than 0.75. 12. The optical film of claim 2, wherein each microlens in the array of concave microlenses has an aspect ratio of about 0.5. 13. The optical film of claim 2, wherein each microlens in the array of concave microlenses has an aspect ratio of less than about 0.5. 14. The optical film of claim 7, wherein the microfeatures include beads. 15. An edge-lit backlight assembly, comprising:
the optical film of claim 2; and a lightguide; wherein the lightguide is disposed proximate the array of concave microlenses. 16. A direct-lit backlight assembly, comprising:
the optical film of claim 2; and one or more light sources; wherein the one or more light sources are disposed proximate the array of concave microlenses. | 2,800 |
11,776 | 11,776 | 15,183,927 | 2,883 | According to embodiments described herein, a coated optical fiber may include a first coated optical fiber segment, a second coated optical fiber segment, and a splice-junction coating. The end portion of the first fiber segment and the end portion of the second fiber segment may abut one another end-to-end. The splice-junction coating may encapsulate the first end portion and the second end portion and contact the at least one coating of the first coated optical fiber segment and the at least one coating of second coated optical fiber segment. The splice-junction coating may be a cured polymer product of a precursor composition. The precursor composition may include from 0 wt % to 1 wt % of total oligomers and at least 90 wt % of total monomers. A Young's modulus of the cured polymer product may be greater than or equal to 1800 MPa. | 1. A coated optical fiber comprising:
a first coated optical fiber segment comprising a first fiber segment and at least one coating disposed on the first fiber segment, wherein at least one coating has been removed from an end portion of the first fiber segment; a second coated optical fiber segment comprising a second fiber segment and at least one coating disposed on the second fiber segment, wherein at least one coating has been removed from an end portion of the second fiber segment, and wherein the end portion of the first fiber segment and the end portion of the second fiber segment abut one another end-to-end; and a splice-junction coating that encapsulates the end portion of the first fiber segment and the end portion of the second fiber segment and contacts the at least one coating of the first coated optical fiber segment and the at least one coating of the second coated optical fiber segment, wherein the splice-junction coating is a cured polymer product of a precursor composition, the precursor composition comprising: from 0 wt % to 1 wt % of total oligomers; and at least 90 wt % of total monomers;
wherein a Young's modulus of the cured polymer product is greater than or equal to 1800 MPa. 2. The coated optical fiber of claim 1, wherein the precursor composition comprises from 2 wt % to 10 wt % of an N-vinyl amide monomer. 3. The coated optical fiber of claim 1, wherein the precursor composition comprises from 8 wt % to 10 wt % of an N-vinyl amide monomer. 4. The coated optical fiber of claim 1, wherein a gap forms between the splice-junction coating and the at least one coating of the first coated optical fiber segment at a rate of less than about 20% under a tensile stress of about 350 kpsi. 5. The coated optical fiber of claim 1, wherein a gap does not form between the splice-junction coating and the at least one coating of the first coated optical fiber segment under a tensile stress of about 350 kpsi. 6. The coated optical fiber of claim 1, wherein the precursor composition does not comprise an oligomer. 7. The coated optical fiber of claim 1, wherein the N-vinyl amide is N-vinyl caprolactam. 8. The coated optical fiber of claim 1, wherein the precursor composition comprises:
from 70 wt % to 90 wt % of ethoxylated bisphenol A diacrylate; and from 10 wt % to 20 wt % of epoxy acrylate formed by adding acrylate to bisphenol A diglycidylether. 9. The coated optical fiber of claim 1, wherein the precursor composition comprises from 1 wt % to 5 wt % of one or more photo initiators. 10. The coated optical fiber of claim 1, wherein the precursor composition comprises a slip additive. 11. The coated optical fiber of claim 1, wherein the precursor composition comprises from 0.1 parts per hundred to 2 parts per hundred of one or more adhesion promoters. 12. The coated optical fiber of claim 1, wherein the precursor composition comprises a coloring agent. 13. A coated optical fiber comprising:
a first coated optical fiber segment comprising a first fiber segment and at least one coating disposed on the first fiber segment, wherein at least one coating has been removed from an end portion of the first fiber segment; a second coated optical fiber segment comprising a second fiber segment and at least one coating disposed on the second fiber segment, wherein at least one coating has been removed from an end portion of the second fiber segment, and wherein the end portion of the first fiber segment and the end portion of the second fiber segment abut one another end-to-end; and a splice-junction coating that encapsulates the end portion of the first fiber segment and the end portion of the second fiber segment and contacts the at least one coating of the first coated optical fiber segment and the at least one coating of the second coated optical fiber segment, wherein the splice-junction coating is a cured polymer product of a precursor composition, the precursor composition comprising: from 70 wt % to 90 wt % of ethoxylated bisphenol A diacrylate; from 10 wt % to 20 wt % of epoxy acrylate formed by adding acrylate to bisphenol A diglycidylether; from 2 wt % to 10 wt % of N-vinyl caprolactam; and from 1 wt % to 5 wt % of UV curable photoinitiator. 14. The coated optical fiber of claim 13, wherein the precursor composition comprises from 0 wt % to 1 wt % of total oligomers. 15. The coated optical fiber of claim 13, wherein the precursor composition comprises a coloring agent. 16. A method of re-coating an optical fiber at a splice junction, the method comprising:
providing a first coated optical fiber segment comprising a first fiber segment and at least one coating disposed on the first fiber segment, wherein at least one coating has been removed from an end portion of the first fiber segment; providing a second coated optical fiber segment comprising a second fiber segment and at least one coating disposed on the second fiber segment, wherein at least one coating has been removed from an end portion of the second fiber segment, and wherein the end portion of the first fiber segment and the end portion of the second fiber segment abut one another end-to-end; applying a coating composition to the end portion of the first fiber segment and the end portion of the second fiber segment to encapsulate the end portion of the first fiber segment and the end portion of the second fiber segment, the coating composition contacting at least one coating of the first coated optical fiber segment and at least one coating of the second coated optical fiber segment; and curing the coating composition to form a cured splice-junction coating having a Young's modulus of at least about 1800 MPa;
wherein the coating composition comprises:
from 0 wt % to 1 wt % of total oligomers; and
at least 90 wt % of total monomers. 17. The method of claim 16, wherein the coating composition comprises from 2 wt % to 10 wt % of an N-vinyl amide monomer. 18. The method of claim 16, further comprising:
removing the at least one coating from the end portion of the first optical fiber segment; and removing the at least one coating from the end portion of the second optical fiber segment. 19. The method of claim 16, wherein the coating composition does not comprise an oligomer. 20. The method of claim 16, wherein the N-vinyl amide is N-vinyl caprolactam. 21. The method of claim 16, wherein the coating composition comprises from 70 wt % to 90 wt % of ethoxylated bisphenol A diacrylate and from 10 wt % to 20 wt % of epoxy acrylate formed by adding acrylate to bisphenol A diglycidylether. 22. The method of claim 16, wherein the coating composition comprises from 1 wt % to 5 wt % of one or more photoinitiators. 23. The method of claim 16, wherein the coating composition comprises a coloring agent. | According to embodiments described herein, a coated optical fiber may include a first coated optical fiber segment, a second coated optical fiber segment, and a splice-junction coating. The end portion of the first fiber segment and the end portion of the second fiber segment may abut one another end-to-end. The splice-junction coating may encapsulate the first end portion and the second end portion and contact the at least one coating of the first coated optical fiber segment and the at least one coating of second coated optical fiber segment. The splice-junction coating may be a cured polymer product of a precursor composition. The precursor composition may include from 0 wt % to 1 wt % of total oligomers and at least 90 wt % of total monomers. A Young's modulus of the cured polymer product may be greater than or equal to 1800 MPa.1. A coated optical fiber comprising:
a first coated optical fiber segment comprising a first fiber segment and at least one coating disposed on the first fiber segment, wherein at least one coating has been removed from an end portion of the first fiber segment; a second coated optical fiber segment comprising a second fiber segment and at least one coating disposed on the second fiber segment, wherein at least one coating has been removed from an end portion of the second fiber segment, and wherein the end portion of the first fiber segment and the end portion of the second fiber segment abut one another end-to-end; and a splice-junction coating that encapsulates the end portion of the first fiber segment and the end portion of the second fiber segment and contacts the at least one coating of the first coated optical fiber segment and the at least one coating of the second coated optical fiber segment, wherein the splice-junction coating is a cured polymer product of a precursor composition, the precursor composition comprising: from 0 wt % to 1 wt % of total oligomers; and at least 90 wt % of total monomers;
wherein a Young's modulus of the cured polymer product is greater than or equal to 1800 MPa. 2. The coated optical fiber of claim 1, wherein the precursor composition comprises from 2 wt % to 10 wt % of an N-vinyl amide monomer. 3. The coated optical fiber of claim 1, wherein the precursor composition comprises from 8 wt % to 10 wt % of an N-vinyl amide monomer. 4. The coated optical fiber of claim 1, wherein a gap forms between the splice-junction coating and the at least one coating of the first coated optical fiber segment at a rate of less than about 20% under a tensile stress of about 350 kpsi. 5. The coated optical fiber of claim 1, wherein a gap does not form between the splice-junction coating and the at least one coating of the first coated optical fiber segment under a tensile stress of about 350 kpsi. 6. The coated optical fiber of claim 1, wherein the precursor composition does not comprise an oligomer. 7. The coated optical fiber of claim 1, wherein the N-vinyl amide is N-vinyl caprolactam. 8. The coated optical fiber of claim 1, wherein the precursor composition comprises:
from 70 wt % to 90 wt % of ethoxylated bisphenol A diacrylate; and from 10 wt % to 20 wt % of epoxy acrylate formed by adding acrylate to bisphenol A diglycidylether. 9. The coated optical fiber of claim 1, wherein the precursor composition comprises from 1 wt % to 5 wt % of one or more photo initiators. 10. The coated optical fiber of claim 1, wherein the precursor composition comprises a slip additive. 11. The coated optical fiber of claim 1, wherein the precursor composition comprises from 0.1 parts per hundred to 2 parts per hundred of one or more adhesion promoters. 12. The coated optical fiber of claim 1, wherein the precursor composition comprises a coloring agent. 13. A coated optical fiber comprising:
a first coated optical fiber segment comprising a first fiber segment and at least one coating disposed on the first fiber segment, wherein at least one coating has been removed from an end portion of the first fiber segment; a second coated optical fiber segment comprising a second fiber segment and at least one coating disposed on the second fiber segment, wherein at least one coating has been removed from an end portion of the second fiber segment, and wherein the end portion of the first fiber segment and the end portion of the second fiber segment abut one another end-to-end; and a splice-junction coating that encapsulates the end portion of the first fiber segment and the end portion of the second fiber segment and contacts the at least one coating of the first coated optical fiber segment and the at least one coating of the second coated optical fiber segment, wherein the splice-junction coating is a cured polymer product of a precursor composition, the precursor composition comprising: from 70 wt % to 90 wt % of ethoxylated bisphenol A diacrylate; from 10 wt % to 20 wt % of epoxy acrylate formed by adding acrylate to bisphenol A diglycidylether; from 2 wt % to 10 wt % of N-vinyl caprolactam; and from 1 wt % to 5 wt % of UV curable photoinitiator. 14. The coated optical fiber of claim 13, wherein the precursor composition comprises from 0 wt % to 1 wt % of total oligomers. 15. The coated optical fiber of claim 13, wherein the precursor composition comprises a coloring agent. 16. A method of re-coating an optical fiber at a splice junction, the method comprising:
providing a first coated optical fiber segment comprising a first fiber segment and at least one coating disposed on the first fiber segment, wherein at least one coating has been removed from an end portion of the first fiber segment; providing a second coated optical fiber segment comprising a second fiber segment and at least one coating disposed on the second fiber segment, wherein at least one coating has been removed from an end portion of the second fiber segment, and wherein the end portion of the first fiber segment and the end portion of the second fiber segment abut one another end-to-end; applying a coating composition to the end portion of the first fiber segment and the end portion of the second fiber segment to encapsulate the end portion of the first fiber segment and the end portion of the second fiber segment, the coating composition contacting at least one coating of the first coated optical fiber segment and at least one coating of the second coated optical fiber segment; and curing the coating composition to form a cured splice-junction coating having a Young's modulus of at least about 1800 MPa;
wherein the coating composition comprises:
from 0 wt % to 1 wt % of total oligomers; and
at least 90 wt % of total monomers. 17. The method of claim 16, wherein the coating composition comprises from 2 wt % to 10 wt % of an N-vinyl amide monomer. 18. The method of claim 16, further comprising:
removing the at least one coating from the end portion of the first optical fiber segment; and removing the at least one coating from the end portion of the second optical fiber segment. 19. The method of claim 16, wherein the coating composition does not comprise an oligomer. 20. The method of claim 16, wherein the N-vinyl amide is N-vinyl caprolactam. 21. The method of claim 16, wherein the coating composition comprises from 70 wt % to 90 wt % of ethoxylated bisphenol A diacrylate and from 10 wt % to 20 wt % of epoxy acrylate formed by adding acrylate to bisphenol A diglycidylether. 22. The method of claim 16, wherein the coating composition comprises from 1 wt % to 5 wt % of one or more photoinitiators. 23. The method of claim 16, wherein the coating composition comprises a coloring agent. | 2,800 |
11,777 | 11,777 | 13,971,308 | 2,829 | A micro-electromechanical device and method of manufacture are disclosed. A sacrificial layer is formed on a silicon substrate. A metal layer is formed on a top surface of the sacrificial layer. Soft magnetic material is electrolessly deposited on the metal layer to manufacture the micro-electromechanical device. The sacrificial layer is removed to produce a metal beam separated from the silicon substrate by a space. | 1. A micro-electromechanical device, comprising:
a wafer substrate; a metal layer coupled to at least one support structure to be suspended with respect to the wafer substrate; and a soft magnetic material electrolessly deposited on the metal layer. 2. The micro-electromechanical device of claim 1 further comprising an active metal surface on the metal layer wherein the soft magnetic material is electrolessly deposited on the active metal surface. 3. The micro-electromechanical device of claim 2, wherein the active metal surface further comprises palladium. 4. The micro-electromechanical device of claim 1, wherein the suspended metal beam is created by forming a portion of the metal layer on a sacrificial layer of the wafer and another portion of the metal layer on the at least one support structure; and removing the sacrificial layer. 5. The micro-electromechanical device of claim 4, wherein the sacrificial layer includes one of: a sacrificial metal layer; a sacrificial photoresist layer; and a portion of the wafer substrate. 6. The micro-electromechanical device of claim 4, wherein the sacrificial layer is removed from the metal layer at one of: prior to electrolessly depositing the soft magnetic material, and after electrolessly depositing the soft magnetic material. 7. The micro-electromechanical device of claim 1 further comprising a second metal beam supported by the first metal beam, wherein the second metal beam includes a soft magnetic material electrolessly deposited on the second metal beam. 8. The micro-electromechanical device of claim 1, wherein the soft magnetic material is one of: a high-resistivity material, a cobalt-based alloy, and cobalt-tungsten-phosphorus. | A micro-electromechanical device and method of manufacture are disclosed. A sacrificial layer is formed on a silicon substrate. A metal layer is formed on a top surface of the sacrificial layer. Soft magnetic material is electrolessly deposited on the metal layer to manufacture the micro-electromechanical device. The sacrificial layer is removed to produce a metal beam separated from the silicon substrate by a space.1. A micro-electromechanical device, comprising:
a wafer substrate; a metal layer coupled to at least one support structure to be suspended with respect to the wafer substrate; and a soft magnetic material electrolessly deposited on the metal layer. 2. The micro-electromechanical device of claim 1 further comprising an active metal surface on the metal layer wherein the soft magnetic material is electrolessly deposited on the active metal surface. 3. The micro-electromechanical device of claim 2, wherein the active metal surface further comprises palladium. 4. The micro-electromechanical device of claim 1, wherein the suspended metal beam is created by forming a portion of the metal layer on a sacrificial layer of the wafer and another portion of the metal layer on the at least one support structure; and removing the sacrificial layer. 5. The micro-electromechanical device of claim 4, wherein the sacrificial layer includes one of: a sacrificial metal layer; a sacrificial photoresist layer; and a portion of the wafer substrate. 6. The micro-electromechanical device of claim 4, wherein the sacrificial layer is removed from the metal layer at one of: prior to electrolessly depositing the soft magnetic material, and after electrolessly depositing the soft magnetic material. 7. The micro-electromechanical device of claim 1 further comprising a second metal beam supported by the first metal beam, wherein the second metal beam includes a soft magnetic material electrolessly deposited on the second metal beam. 8. The micro-electromechanical device of claim 1, wherein the soft magnetic material is one of: a high-resistivity material, a cobalt-based alloy, and cobalt-tungsten-phosphorus. | 2,800 |
11,778 | 11,778 | 14,027,027 | 2,858 | Sonde devices for providing magnetic field signals for use with utility locators or other devices are disclosed. In one embodiment a sonde device includes a housing, a core comprising a plurality of core sections, and one or more support structures, which may include windings. Circuit and/or power supply elements may be disposed fully or partially within the core to control generation of predefined magnetic field frequencies and waveforms. | 1. A sonde device, comprising:
a housing; a core including:
a plurality of core section elements; and
a support structure for positioning the core section elements; and
a winding disposed about the core structure. 2. The sonde device of claim 1, wherein the core section elements are arc core section elements. 3. The sonde device of claim 1, wherein the core section elements comprise ferrite. 4. The sonde device of claim 1, wherein the core section elements comprise steel. 5. The sonde device of claim 1, wherein the core section elements have a rectangular cross-sectional shape. 6. The sonde device of claim 1, wherein the plurality of core section elements comprises four or more core section elements. 7. The sonde device of claim 1, wherein the core further includes a battery and a circuit element for providing current to the winding to generate an output magnetic field signal. 8. The sonde device of claim 7, wherein the battery and the circuit element are disposed at least partially within a volume enclosed by the plurality of core section elements. 9. The sonde device of claim 7, wherein the circuit element includes circuitry for generating the current to provide the output magnetic field signals at two or more frequencies. 10. The sonde device of claim 9, wherein the output signal is switched between the two or more frequencies. 11. The sonde device of claim 1, wherein one or more signal or power wires are disposed in an axial gap between ones of the plurality of core section elements. 12. The sonde device of claim 1, wherein the support structure comprises a non-conductive tubular structure. 13. The sonde device of claim 12, wherein the non-conductive tubular structure is a fiberglass structure. 14. The sonde device of claim 1, wherein the winding comprises a single winding. 15. The sonde device of claim 1, wherein the winding comprises a primary and a secondary winding. 16. The sonde device of claim 1, further comprising one or more lights to indicate a sonde status. 17. The sonde device of claim 16, wherein the one or more lights include a color light. 18. The sonde device of claim 1, further comprising a transmitter circuit configured to communicate data to an enabled locator device. 19. The sonde device of claim 18, wherein the communicated data includes sonde signal strength data. 20. The sonde device of claim 1, further comprising a multi-color lighting device, wherein the lighting device provides a color corresponding to an operating frequency of the sonde. 21. The sonde device of claim 20, wherein the multi-color lighting device comprises an red green blue (RGB) light and a color control circuit for generating the color corresponding to the operating frequency based on a signal provided from a processing element of the sonde. 22. The sonde device of claim 20, wherein battery status information is provided from the lighting device. 23. The sonde device of claim 22, wherein the battery status information includes a low power status, and the lower power status may be provided with a specific color of light and/or a unique flashing light sequence. 24. The sonde device of claim 22, wherein the battery status information includes a fully charged power status, and the fully charged status is indicated with a specific color of light or a unique flashing light sequence. 25. The sonde device of claim 1, wherein the sonde includes a passage for allowing materials to be pumped through or removed to facilitate jetting or drilling. 26. The sonde device of claim 1, further comprising a transmitter or transceiver module configured to send and/or receive data. 27. The sonde device of claim 26, wherein the transmitter or transceiver module is configured to send data defining a sonde orientation from a horizontal or vertical axis. 28. The sonde device of claim 26, wherein the transmitter or transceiver module is configured to send data defining a sonde signal strength or output power level or other output signal characteristic such as phase, frequency, amplitude, or modulation type. 29. The sonde device of claim 1, wherein the sonde includes a precision time reference circuit for providing a time reference for tracking phase of a generated signal. 30. The sonde device of claim 1, wherein the sonde includes a circuit for receiving an electromagnetic field signal and charging a battery using the received electromagnetic field signal. 31. The sonde device of claim 1, wherein the sonde includes an inductive charging circuit and a rechargeable battery coupled to the inductive charging circuit. 32. The sonde device of claim 1, further comprising a magnetic switch and a circuit coupled to the magnetic switch to activate or de-activate the sonde responsive to a switching action of the magnetic switch. 33. The sonde device of claim 1, wherein the frequency of an output of the sonde may be switched at a predefined or selected rate. 34. The sonde device of claim 33, wherein multiple output frequencies are provided and wherein two or more of the multiple output frequencies are phase locked to a common clock. 35. The sonde device of claim 34, wherein two or more of the multiple output frequencies are integer multiples. 36. The sonde device of claim 34, wherein one or more of the multiple output frequencies are multiples of two of one or more other output frequencies. 37. The sonde device of claim 1, wherein the plurality of core section elements comprise multiple lengthwise core sections. 38. The sonde device of claim 37, wherein circumferential breaks between core sections of a first row of core sections are staggered with circumferential breaks between core sections of a second row of core sections. | Sonde devices for providing magnetic field signals for use with utility locators or other devices are disclosed. In one embodiment a sonde device includes a housing, a core comprising a plurality of core sections, and one or more support structures, which may include windings. Circuit and/or power supply elements may be disposed fully or partially within the core to control generation of predefined magnetic field frequencies and waveforms.1. A sonde device, comprising:
a housing; a core including:
a plurality of core section elements; and
a support structure for positioning the core section elements; and
a winding disposed about the core structure. 2. The sonde device of claim 1, wherein the core section elements are arc core section elements. 3. The sonde device of claim 1, wherein the core section elements comprise ferrite. 4. The sonde device of claim 1, wherein the core section elements comprise steel. 5. The sonde device of claim 1, wherein the core section elements have a rectangular cross-sectional shape. 6. The sonde device of claim 1, wherein the plurality of core section elements comprises four or more core section elements. 7. The sonde device of claim 1, wherein the core further includes a battery and a circuit element for providing current to the winding to generate an output magnetic field signal. 8. The sonde device of claim 7, wherein the battery and the circuit element are disposed at least partially within a volume enclosed by the plurality of core section elements. 9. The sonde device of claim 7, wherein the circuit element includes circuitry for generating the current to provide the output magnetic field signals at two or more frequencies. 10. The sonde device of claim 9, wherein the output signal is switched between the two or more frequencies. 11. The sonde device of claim 1, wherein one or more signal or power wires are disposed in an axial gap between ones of the plurality of core section elements. 12. The sonde device of claim 1, wherein the support structure comprises a non-conductive tubular structure. 13. The sonde device of claim 12, wherein the non-conductive tubular structure is a fiberglass structure. 14. The sonde device of claim 1, wherein the winding comprises a single winding. 15. The sonde device of claim 1, wherein the winding comprises a primary and a secondary winding. 16. The sonde device of claim 1, further comprising one or more lights to indicate a sonde status. 17. The sonde device of claim 16, wherein the one or more lights include a color light. 18. The sonde device of claim 1, further comprising a transmitter circuit configured to communicate data to an enabled locator device. 19. The sonde device of claim 18, wherein the communicated data includes sonde signal strength data. 20. The sonde device of claim 1, further comprising a multi-color lighting device, wherein the lighting device provides a color corresponding to an operating frequency of the sonde. 21. The sonde device of claim 20, wherein the multi-color lighting device comprises an red green blue (RGB) light and a color control circuit for generating the color corresponding to the operating frequency based on a signal provided from a processing element of the sonde. 22. The sonde device of claim 20, wherein battery status information is provided from the lighting device. 23. The sonde device of claim 22, wherein the battery status information includes a low power status, and the lower power status may be provided with a specific color of light and/or a unique flashing light sequence. 24. The sonde device of claim 22, wherein the battery status information includes a fully charged power status, and the fully charged status is indicated with a specific color of light or a unique flashing light sequence. 25. The sonde device of claim 1, wherein the sonde includes a passage for allowing materials to be pumped through or removed to facilitate jetting or drilling. 26. The sonde device of claim 1, further comprising a transmitter or transceiver module configured to send and/or receive data. 27. The sonde device of claim 26, wherein the transmitter or transceiver module is configured to send data defining a sonde orientation from a horizontal or vertical axis. 28. The sonde device of claim 26, wherein the transmitter or transceiver module is configured to send data defining a sonde signal strength or output power level or other output signal characteristic such as phase, frequency, amplitude, or modulation type. 29. The sonde device of claim 1, wherein the sonde includes a precision time reference circuit for providing a time reference for tracking phase of a generated signal. 30. The sonde device of claim 1, wherein the sonde includes a circuit for receiving an electromagnetic field signal and charging a battery using the received electromagnetic field signal. 31. The sonde device of claim 1, wherein the sonde includes an inductive charging circuit and a rechargeable battery coupled to the inductive charging circuit. 32. The sonde device of claim 1, further comprising a magnetic switch and a circuit coupled to the magnetic switch to activate or de-activate the sonde responsive to a switching action of the magnetic switch. 33. The sonde device of claim 1, wherein the frequency of an output of the sonde may be switched at a predefined or selected rate. 34. The sonde device of claim 33, wherein multiple output frequencies are provided and wherein two or more of the multiple output frequencies are phase locked to a common clock. 35. The sonde device of claim 34, wherein two or more of the multiple output frequencies are integer multiples. 36. The sonde device of claim 34, wherein one or more of the multiple output frequencies are multiples of two of one or more other output frequencies. 37. The sonde device of claim 1, wherein the plurality of core section elements comprise multiple lengthwise core sections. 38. The sonde device of claim 37, wherein circumferential breaks between core sections of a first row of core sections are staggered with circumferential breaks between core sections of a second row of core sections. | 2,800 |
11,779 | 11,779 | 14,409,525 | 2,834 | A printed circuit board and an electric filter. The printed circuit board is arranged to accommodate an electric circuitry on one side, and an electrically conductive material on the other side which forms a common ground point with the electric circuitry and a device contacting the conductive material. The electric filter for filtering electric signals of a DC motor includes a freewheeling diode coupled in parallel to the motor, a capacitor coupled in parallel to the motor, where a ground terminal of the capacitor is coupled to a chassis of the motor, a low pass filter including a ferrite bead and another capacitor is connected to each motor terminal (M+, M−), and a resistor-capacitor filter is coupled in parallel to the motor. | 1. A printed circuit board comprising:
an electric circuitry on one side of the printed circuit board, and an electrically conductive material on another side of the printed circuit board which forms a common ground point for the electric circuitry and a device contacting the conductive material. 2. The printed circuit board of claim 1, wherein said other side of the printed circuit board is coated with the electrically conductive material. 3. The printed circuit board of claim 1, wherein the electric circuitry is an electric filter for filtering electrical signals of a direct current (DC) motor, and said other side is arranged with the conductive material for contacting a chassis of the motor in order to accomplish a ground point common to the chassis and the electric filter. 4. The printed circuit board of claim 1, further being arranged such that the side of the board arranged with a conductive material fully contacts the device which the board is arranged to contact. 5. The printed circuit board of claim 1, further being arranged with ventholes for dissipating heat from the device arranged to contact the conductive material. 6. The printed circuit board of claim 5, wherein the ventholes are circular. 7. The printed circuit board of claim 1, wherein physical layout of the electric circuitry arranged to be accommodated on the board is such that it is symmetrically arranged around a central axis (CA) of the board. 8. An electric filter for filtering electric signals of a direct current (DC) motor, the electric filter comprising:
a freewheeling diode (D1) coupled in parallel to the motor; an X2Y capacitor (C4) coupled in parallel to the motor, wherein a ground terminal (MGND) of the X2Y capacitor is coupled to a chassis of the motor; a low pass filter comprising a ferrite bead (L1, L2) and a capacitor (C1, C2) connected to each motor terminal (M+, M−); and a resistor-capacitor, (RC), filter (R1, C3) coupled in parallel to the motor. 9. A printed circuit board assembly comprising:
printed circuit board comprising:
an electric circuitry on one side of the printed circuit board configured as an electric filter for filtering electric signals of a DC motor, and
an electrically conductive material on another side of the printed circuit board which forms a common ground point for the electric circuitry and a device contacting the conductive material,
wherein the device contacting the conductive material is the DC motor. 10. The printed circuit board assembly of claim 9,
wherein the conductive material of the printed circuit board contacts a chassis of the DC motor. 11. The printed circuit board assembly of claim 10, further comprising:
a pair of cables connected to the printed circuit board and connected to motor terminals (M+, M−) of the DC motor for conducting a pulse width modulation (PWM) signal between the printed circuit board and the DC motor, wherein the cables are intertwined with each other. 12. The printed circuit board assembly of claim 10,
wherein the printed circuit board assembly and the DC motor are arranged in a vacuum cleaner. 13. The printed circuit board assembly of claim 10,
wherein the printed circuit board assembly and the DC motor are arranged in a nozzle of a vacuum cleaner. 14. The printed circuit board assembly of claim 10,
wherein the printed circuit board assembly and the DC motor are arranged in a fan unit of a vacuum cleaner. | A printed circuit board and an electric filter. The printed circuit board is arranged to accommodate an electric circuitry on one side, and an electrically conductive material on the other side which forms a common ground point with the electric circuitry and a device contacting the conductive material. The electric filter for filtering electric signals of a DC motor includes a freewheeling diode coupled in parallel to the motor, a capacitor coupled in parallel to the motor, where a ground terminal of the capacitor is coupled to a chassis of the motor, a low pass filter including a ferrite bead and another capacitor is connected to each motor terminal (M+, M−), and a resistor-capacitor filter is coupled in parallel to the motor.1. A printed circuit board comprising:
an electric circuitry on one side of the printed circuit board, and an electrically conductive material on another side of the printed circuit board which forms a common ground point for the electric circuitry and a device contacting the conductive material. 2. The printed circuit board of claim 1, wherein said other side of the printed circuit board is coated with the electrically conductive material. 3. The printed circuit board of claim 1, wherein the electric circuitry is an electric filter for filtering electrical signals of a direct current (DC) motor, and said other side is arranged with the conductive material for contacting a chassis of the motor in order to accomplish a ground point common to the chassis and the electric filter. 4. The printed circuit board of claim 1, further being arranged such that the side of the board arranged with a conductive material fully contacts the device which the board is arranged to contact. 5. The printed circuit board of claim 1, further being arranged with ventholes for dissipating heat from the device arranged to contact the conductive material. 6. The printed circuit board of claim 5, wherein the ventholes are circular. 7. The printed circuit board of claim 1, wherein physical layout of the electric circuitry arranged to be accommodated on the board is such that it is symmetrically arranged around a central axis (CA) of the board. 8. An electric filter for filtering electric signals of a direct current (DC) motor, the electric filter comprising:
a freewheeling diode (D1) coupled in parallel to the motor; an X2Y capacitor (C4) coupled in parallel to the motor, wherein a ground terminal (MGND) of the X2Y capacitor is coupled to a chassis of the motor; a low pass filter comprising a ferrite bead (L1, L2) and a capacitor (C1, C2) connected to each motor terminal (M+, M−); and a resistor-capacitor, (RC), filter (R1, C3) coupled in parallel to the motor. 9. A printed circuit board assembly comprising:
printed circuit board comprising:
an electric circuitry on one side of the printed circuit board configured as an electric filter for filtering electric signals of a DC motor, and
an electrically conductive material on another side of the printed circuit board which forms a common ground point for the electric circuitry and a device contacting the conductive material,
wherein the device contacting the conductive material is the DC motor. 10. The printed circuit board assembly of claim 9,
wherein the conductive material of the printed circuit board contacts a chassis of the DC motor. 11. The printed circuit board assembly of claim 10, further comprising:
a pair of cables connected to the printed circuit board and connected to motor terminals (M+, M−) of the DC motor for conducting a pulse width modulation (PWM) signal between the printed circuit board and the DC motor, wherein the cables are intertwined with each other. 12. The printed circuit board assembly of claim 10,
wherein the printed circuit board assembly and the DC motor are arranged in a vacuum cleaner. 13. The printed circuit board assembly of claim 10,
wherein the printed circuit board assembly and the DC motor are arranged in a nozzle of a vacuum cleaner. 14. The printed circuit board assembly of claim 10,
wherein the printed circuit board assembly and the DC motor are arranged in a fan unit of a vacuum cleaner. | 2,800 |
11,780 | 11,780 | 15,728,106 | 2,881 | An x-ray breast imaging system comprising a compression paddle in which the compression paddle comprises a front wall and a bottom wall. The front wall is configured to be adjacent and face a chest wall of a patient during imaging and the bottom wall configured to be adjacent a length of a top of a compressed breast. The bottom wall extends away from the patient's chest wall, wherein the bottom wall comprises a first portion and a second portion such that the second portion is between the front wall and the first portion. The first portion is generally non-coplanar to the second portion, wherein the compression paddle is movable along a craniocaudal axis. The x-ray breast imaging system also comprises a non-rigid jacket releasably secured to the compression paddle, the non-rigid jacket positioned between the compression paddle and the patient. | 1. An x-ray breast imaging system comprising:
an x-ray source; an x-ray detector; a breast support platform disposed between the x-ray source and the x-ray detector; a compression paddle disposed between the x-ray source and the breast support platform, the compression paddle comprising:
a front wall configured to be adjacent and face a chest wall of a patient during imaging;
a bottom wall configured to extend away from the patient's chest wall and to be adjacent a length of a top of a compressed breast, wherein the bottom wall comprises a central portion and two outer edge portions, wherein the central portion is disposed at an angle to the breast support platform, and wherein the compression paddle is movable; and
a first axis substantially orthogonal to the front wall. 2. The x-ray breast imaging system of claim 1, wherein the two outer edge portions define a reference plane, and wherein the central portion is disposed above the reference plane so as to define a concave surface extending from a first outer edge portion to the central portion to a second outer edge portion. 3. The x-ray breast imaging system of claim 2, wherein and the reference plane is substantially parallel to the breast support. 4. The x-ray breast imaging system of claim 1, wherein the central portion of the bottom wall is pitched along the first axis from a high point proximate the front wall. 5. The x-ray breast imaging system of claim 1, wherein the compression paddle is adapted to be disposed in:
a compressing position wherein the compressed breast is disposed between the compression paddle and the breast platform; and a non-compressing position wherein the compressed breast is not disposed between the compression paddle and the breast platform, and wherein the bottom wall comprises a substantially similar contour in both the compressing position and non-compressing position. 6. The x-ray breast imaging system of claim 4, wherein a distance between the central portion and the reference plane is substantially identical in both the compressing position and the non-compressing position. 7. The x-ray breast imaging system of claim 1, wherein movement of the compression paddle is selected from a group consisting of movable only along a craniocaudal axis, movable only laterally, and combinations thereof 8. The x-ray breast imaging system of claim 1, wherein the x-ray source is configured to selectively emit an imaging x-ray beam, and wherein the x-ray source is configured to move along an arc. 9. The x-ray imaging system of claim 8, wherein the x-ray breast imaging system is a breast tomosynthesis x-ray breast imaging system. 10. A compression paddle for an x-ray breast imaging system comprising:
a front wall configured to be adjacent and face a chest wall of a patient during imaging; and a bottom wall configured to be adjacent a length of a top of a compressed breast, the bottom wall extending away from the patient's chest wall and comprising two outer edge portions and a central portion non-coplanar with the two outer edge portions, wherein the central portion is disposed at an angle to the two outer edge portions. 11. The compression paddle of claim 10, further comprising a non-rigid material spanning the two outer edge portions. 12. The compression paddle of claim 10, further comprising an intermediate portion disposed between the front wall and the central portion and comprising a radius having a generally smooth curvature. 13.-14. (canceled) 15. The compression paddle of claim 12, wherein the bottom wall has a concave portion and a convex portion relative to the compressed breast. 16. The compression paddle of claim 15, wherein the convex portion is where the bottom wall meets the intermediate portion. 17. (canceled) 18. The compression paddle any of claim 10, wherein the front wall is slightly off-angle from vertical. 19.-33. (canceled) 34. The compression paddle of claim 10, further comprising a side wall disposed proximate each of the two outer edge portions. 35. The compression paddle of claim 34, wherein the outer edge portions define a reference plane and wherein the sidewalls comprise a sidewall height above the reference plane. 36. The compression paddle of claim 35, wherein the front wall comprises a front wall height above the reference plane, wherein the front wall height is greater than the sidewall height. 37. The compression paddle of claim 10, further comprising a bracket for releasably securing the compression paddle to the imaging system. 38. The compression paddle of claim 35, wherein the reference plane is substantially parallel to an axis of the compression paddle. | An x-ray breast imaging system comprising a compression paddle in which the compression paddle comprises a front wall and a bottom wall. The front wall is configured to be adjacent and face a chest wall of a patient during imaging and the bottom wall configured to be adjacent a length of a top of a compressed breast. The bottom wall extends away from the patient's chest wall, wherein the bottom wall comprises a first portion and a second portion such that the second portion is between the front wall and the first portion. The first portion is generally non-coplanar to the second portion, wherein the compression paddle is movable along a craniocaudal axis. The x-ray breast imaging system also comprises a non-rigid jacket releasably secured to the compression paddle, the non-rigid jacket positioned between the compression paddle and the patient.1. An x-ray breast imaging system comprising:
an x-ray source; an x-ray detector; a breast support platform disposed between the x-ray source and the x-ray detector; a compression paddle disposed between the x-ray source and the breast support platform, the compression paddle comprising:
a front wall configured to be adjacent and face a chest wall of a patient during imaging;
a bottom wall configured to extend away from the patient's chest wall and to be adjacent a length of a top of a compressed breast, wherein the bottom wall comprises a central portion and two outer edge portions, wherein the central portion is disposed at an angle to the breast support platform, and wherein the compression paddle is movable; and
a first axis substantially orthogonal to the front wall. 2. The x-ray breast imaging system of claim 1, wherein the two outer edge portions define a reference plane, and wherein the central portion is disposed above the reference plane so as to define a concave surface extending from a first outer edge portion to the central portion to a second outer edge portion. 3. The x-ray breast imaging system of claim 2, wherein and the reference plane is substantially parallel to the breast support. 4. The x-ray breast imaging system of claim 1, wherein the central portion of the bottom wall is pitched along the first axis from a high point proximate the front wall. 5. The x-ray breast imaging system of claim 1, wherein the compression paddle is adapted to be disposed in:
a compressing position wherein the compressed breast is disposed between the compression paddle and the breast platform; and a non-compressing position wherein the compressed breast is not disposed between the compression paddle and the breast platform, and wherein the bottom wall comprises a substantially similar contour in both the compressing position and non-compressing position. 6. The x-ray breast imaging system of claim 4, wherein a distance between the central portion and the reference plane is substantially identical in both the compressing position and the non-compressing position. 7. The x-ray breast imaging system of claim 1, wherein movement of the compression paddle is selected from a group consisting of movable only along a craniocaudal axis, movable only laterally, and combinations thereof 8. The x-ray breast imaging system of claim 1, wherein the x-ray source is configured to selectively emit an imaging x-ray beam, and wherein the x-ray source is configured to move along an arc. 9. The x-ray imaging system of claim 8, wherein the x-ray breast imaging system is a breast tomosynthesis x-ray breast imaging system. 10. A compression paddle for an x-ray breast imaging system comprising:
a front wall configured to be adjacent and face a chest wall of a patient during imaging; and a bottom wall configured to be adjacent a length of a top of a compressed breast, the bottom wall extending away from the patient's chest wall and comprising two outer edge portions and a central portion non-coplanar with the two outer edge portions, wherein the central portion is disposed at an angle to the two outer edge portions. 11. The compression paddle of claim 10, further comprising a non-rigid material spanning the two outer edge portions. 12. The compression paddle of claim 10, further comprising an intermediate portion disposed between the front wall and the central portion and comprising a radius having a generally smooth curvature. 13.-14. (canceled) 15. The compression paddle of claim 12, wherein the bottom wall has a concave portion and a convex portion relative to the compressed breast. 16. The compression paddle of claim 15, wherein the convex portion is where the bottom wall meets the intermediate portion. 17. (canceled) 18. The compression paddle any of claim 10, wherein the front wall is slightly off-angle from vertical. 19.-33. (canceled) 34. The compression paddle of claim 10, further comprising a side wall disposed proximate each of the two outer edge portions. 35. The compression paddle of claim 34, wherein the outer edge portions define a reference plane and wherein the sidewalls comprise a sidewall height above the reference plane. 36. The compression paddle of claim 35, wherein the front wall comprises a front wall height above the reference plane, wherein the front wall height is greater than the sidewall height. 37. The compression paddle of claim 10, further comprising a bracket for releasably securing the compression paddle to the imaging system. 38. The compression paddle of claim 35, wherein the reference plane is substantially parallel to an axis of the compression paddle. | 2,800 |
11,781 | 11,781 | 14,404,328 | 2,862 | Improved systematic inversion methodology applied to formation testing data interpretation with spherical, radial and/or cylindrical flow models is disclosed. A method of determining a parameter of a formation of interest at a desired location comprises directing a formation tester to the desired location in the formation of interest and obtaining data from the desired location in the formation of interest. The obtained data relates to a first parameter at the desired location of the formation of interest. The obtained data is regressed to determine a second parameter at the desired location of the formation of interest. Regressing the obtained data comprises using a method selected from a group consisting of a deterministic approach, a probabilistic approach, and an evolutionary approach. | 1. A method of determining a parameter of a formation of interest at a desired location comprising:
directing a formation tester to the desired location in the formation of interest; obtaining data from the desired location in the formation of interest,
wherein the obtained data relates to a first parameter at the desired location of the formation of interest; and
regressing the obtained data to determine a second parameter at the desired location of the formation of interest,
wherein regressing the obtained data comprises using a method selected from a group consisting of a deterministic approach, a probabilistic approach, and an evolutionary approach. 2. The method of claim 1, wherein the first parameter is a pressure at the desired location in the formation of interest. 3. The method of claim 2, wherein the second parameter is selected from a group consisting of actual reservoir pressure, fluid mobility, skin factor, formation porosity and fluid compressibility. 4. The method of claim 1, wherein regressing the obtained data comprises using a deterministic approach and wherein the deterministic approach comprises using a Levenberg-Marquardt algorithm. 5. The method of claim 4, further comprising applying a Gauss-Newton approximation of a Hessian matrix to the first parameter at the desired location to determine the second parameter at the desired location of the formation of interest. 6. The method of claim 1, wherein regressing the obtained data comprises using a probabilistic approach and wherein the probabilistic approach comprises using a Bayesian learning algorithm. 7. The method of claim 1, wherein regressing the obtained data comprises using an evolutionary approach and wherein the evolutionary approach comprises using one or more genetic parameters selected from a group consisting of selection, mutation, and crossover to determine the second parameter at the desired location of the formation of interest. 8. The method of claim 1, wherein the formation tester comprises a first probe and a second probe, wherein obtaining data from the desired location in the formation of interest comprises obtaining a first set of data using the first probe and obtaining a second set of data using the second probe. 9. An information handling system having a computer readable medium, wherein the computer readable medium contains instructions to:
obtain data from a formation tester at a desired location in the formation of interest,
wherein the obtained data relates to a first parameter at the desired location of the formation of interest; and
regress the obtained data to determine a second parameter at the desired location of the formation of interest,
wherein regressing the obtained data comprises using a method selected from the group consisting of a deterministic approach, a probabilistic approach, and an evolutionary approach. 10. The information handling system of claim 9, wherein the first parameter is a pressure at the desired location in the formation of interest. 11. The information handling system of claim 10, wherein the second parameter is selected from a group consisting of actual reservoir pressure, fluid mobility, skin factor, formation porosity and fluid compressibility. 12. The information handling system of claim 9, wherein regressing the obtained data comprises using a deterministic approach and wherein the deterministic approach comprises using a Levenberg-Marquardt algorithm. 13. The information handling system of claim 12, further comprising applying a Gauss-Newton approximation of a Hessian matrix to the first parameter at the desired location to determine the second parameter at the desired location of the formation of interest. 14. The information handling system of claim 9, wherein regressing the obtained data comprises using a probabilistic approach and wherein the probabilistic approach comprises using a Bayesian learning algorithm. 15. The information handling system of claim 9, wherein regressing the obtained data comprises using an evolutionary approach and wherein the evolutionary approach comprises using one or more genetic parameters selected from a group consisting of selection, mutation, and crossover to determine the second parameter at the desired location of the formation of interest. 16. A method of estimating a desired parameter of a formation of interest comprising:
measuring a first parameter of the formation of interest; using a relationship between the first parameter of the formation of interest and the desired parameter of the formation of interest to obtain an estimate of the desired parameter of the formation of interest,
wherein using the relationship between the first parameter of the formation of interest and the desired parameter of the formation of interest comprises regressing the first parameter of the formation of interest using a method selected from a group consisting of a deterministic approach, a probabilistic approach, and an evolutionary approach. 17. The method of claim 16, wherein the first parameter is a pressure at a desired location in the formation of interest. 18. The method of claim 17, wherein the desired parameter is selected from a group consisting of actual reservoir pressure, fluid mobility, skin factor, formation porosity and fluid compressibility. 19. The method of claim 16, wherein regressing the obtained data comprises using a deterministic approach and wherein the deterministic approach comprises using a Levenberg-Marquardt algorithm. 20. The method of claim 19, wherein the Levenberg-Marquardt algorithm comprises using at least one of a Jacobian matrix and an approximate Jacobian. 21. The method of claim 19, further comprising applying a Gauss-Newton approximation of a Hessian matrix to the first parameter at the desired location to determine the desired parameter at the desired location of the formation of interest. 22. The method of claim 16, wherein regressing the obtained data comprises using a probabilistic approach and wherein the probabilistic approach comprises using a Bayesian learning algorithm. 23. The method of claim 16, wherein regressing the obtained data comprises using an evolutionary approach and wherein the evolutionary approach comprises using one or more genetic parameters selected from a group consisting of selection, mutation, and crossover to determine the desired parameter at the desired location of the formation of interest. | Improved systematic inversion methodology applied to formation testing data interpretation with spherical, radial and/or cylindrical flow models is disclosed. A method of determining a parameter of a formation of interest at a desired location comprises directing a formation tester to the desired location in the formation of interest and obtaining data from the desired location in the formation of interest. The obtained data relates to a first parameter at the desired location of the formation of interest. The obtained data is regressed to determine a second parameter at the desired location of the formation of interest. Regressing the obtained data comprises using a method selected from a group consisting of a deterministic approach, a probabilistic approach, and an evolutionary approach.1. A method of determining a parameter of a formation of interest at a desired location comprising:
directing a formation tester to the desired location in the formation of interest; obtaining data from the desired location in the formation of interest,
wherein the obtained data relates to a first parameter at the desired location of the formation of interest; and
regressing the obtained data to determine a second parameter at the desired location of the formation of interest,
wherein regressing the obtained data comprises using a method selected from a group consisting of a deterministic approach, a probabilistic approach, and an evolutionary approach. 2. The method of claim 1, wherein the first parameter is a pressure at the desired location in the formation of interest. 3. The method of claim 2, wherein the second parameter is selected from a group consisting of actual reservoir pressure, fluid mobility, skin factor, formation porosity and fluid compressibility. 4. The method of claim 1, wherein regressing the obtained data comprises using a deterministic approach and wherein the deterministic approach comprises using a Levenberg-Marquardt algorithm. 5. The method of claim 4, further comprising applying a Gauss-Newton approximation of a Hessian matrix to the first parameter at the desired location to determine the second parameter at the desired location of the formation of interest. 6. The method of claim 1, wherein regressing the obtained data comprises using a probabilistic approach and wherein the probabilistic approach comprises using a Bayesian learning algorithm. 7. The method of claim 1, wherein regressing the obtained data comprises using an evolutionary approach and wherein the evolutionary approach comprises using one or more genetic parameters selected from a group consisting of selection, mutation, and crossover to determine the second parameter at the desired location of the formation of interest. 8. The method of claim 1, wherein the formation tester comprises a first probe and a second probe, wherein obtaining data from the desired location in the formation of interest comprises obtaining a first set of data using the first probe and obtaining a second set of data using the second probe. 9. An information handling system having a computer readable medium, wherein the computer readable medium contains instructions to:
obtain data from a formation tester at a desired location in the formation of interest,
wherein the obtained data relates to a first parameter at the desired location of the formation of interest; and
regress the obtained data to determine a second parameter at the desired location of the formation of interest,
wherein regressing the obtained data comprises using a method selected from the group consisting of a deterministic approach, a probabilistic approach, and an evolutionary approach. 10. The information handling system of claim 9, wherein the first parameter is a pressure at the desired location in the formation of interest. 11. The information handling system of claim 10, wherein the second parameter is selected from a group consisting of actual reservoir pressure, fluid mobility, skin factor, formation porosity and fluid compressibility. 12. The information handling system of claim 9, wherein regressing the obtained data comprises using a deterministic approach and wherein the deterministic approach comprises using a Levenberg-Marquardt algorithm. 13. The information handling system of claim 12, further comprising applying a Gauss-Newton approximation of a Hessian matrix to the first parameter at the desired location to determine the second parameter at the desired location of the formation of interest. 14. The information handling system of claim 9, wherein regressing the obtained data comprises using a probabilistic approach and wherein the probabilistic approach comprises using a Bayesian learning algorithm. 15. The information handling system of claim 9, wherein regressing the obtained data comprises using an evolutionary approach and wherein the evolutionary approach comprises using one or more genetic parameters selected from a group consisting of selection, mutation, and crossover to determine the second parameter at the desired location of the formation of interest. 16. A method of estimating a desired parameter of a formation of interest comprising:
measuring a first parameter of the formation of interest; using a relationship between the first parameter of the formation of interest and the desired parameter of the formation of interest to obtain an estimate of the desired parameter of the formation of interest,
wherein using the relationship between the first parameter of the formation of interest and the desired parameter of the formation of interest comprises regressing the first parameter of the formation of interest using a method selected from a group consisting of a deterministic approach, a probabilistic approach, and an evolutionary approach. 17. The method of claim 16, wherein the first parameter is a pressure at a desired location in the formation of interest. 18. The method of claim 17, wherein the desired parameter is selected from a group consisting of actual reservoir pressure, fluid mobility, skin factor, formation porosity and fluid compressibility. 19. The method of claim 16, wherein regressing the obtained data comprises using a deterministic approach and wherein the deterministic approach comprises using a Levenberg-Marquardt algorithm. 20. The method of claim 19, wherein the Levenberg-Marquardt algorithm comprises using at least one of a Jacobian matrix and an approximate Jacobian. 21. The method of claim 19, further comprising applying a Gauss-Newton approximation of a Hessian matrix to the first parameter at the desired location to determine the desired parameter at the desired location of the formation of interest. 22. The method of claim 16, wherein regressing the obtained data comprises using a probabilistic approach and wherein the probabilistic approach comprises using a Bayesian learning algorithm. 23. The method of claim 16, wherein regressing the obtained data comprises using an evolutionary approach and wherein the evolutionary approach comprises using one or more genetic parameters selected from a group consisting of selection, mutation, and crossover to determine the desired parameter at the desired location of the formation of interest. | 2,800 |
11,782 | 11,782 | 14,998,148 | 2,859 | A system includes a power withdrawal point on a power supply network and a vehicle for the corded charging of a traction battery at the power withdrawal point. The vehicle includes a charging electronics unit for charging, and is electrically connectable to the vehicle-external power withdrawal point via a charging cable. The charging cable is configured as a cable connected outside the vehicle to a station charging device for a charging process, or as a cable charging device. The station charging device or the cable charging device, respectively, is electrically connected to the power withdrawal point when a charging connection has been established, and the power withdrawal point can supply an alternating current respectively via the station charging device or via the cable charging device for charging. The station charging device or the cable charging device, respectively, is electrically connected to the charging electronics unit via a pilot line when the charging connection has been established, where the charging process is controllable by an electric pilot signal applied via the pilot line. The charging electronics unit detects physical parameters of the pilot signal via the pilot line, physical parameters of the power supply network at the power withdrawal point via the charging current lines, and physical parameters of the station charging device or of the cable charging device via the pilot line, respectively, during a charging process so as to produce a parameter data set characterizing the power withdrawal point. | 1. A system comprising a power withdrawal point on a power supply network and comprising a vehicle for the corded charging of a traction battery of the vehicle at the power withdrawal point, the vehicle having a charging electronics unit for charging, and the vehicle being electrically connectable to the vehicle-external power withdrawal point via a charging cable for the charging process, wherein
the charging cable is configured as one of (i) a cable connected outside the vehicle to a station charging device for a charging process, and (ii) a cable charging device; the station charging device or the cable charging device is respectively electrically connected to the power withdrawal point when a charging connection has been established, and the power withdrawal point can supply an alternating current for charging via the station charging device or via the cable charging device, respectively; the supplied alternating current is respectively conducted from the station charging device or from the cable charging device over charging current lines of the charging cable for charging; the station charging device or the cable charging device is respectively electrically connected to the charging electronics unit via a pilot line when the charging connection has been established; the charging process is controllable by an electric pilot signal applied via the pilot line; and the charging electronics unit detects physical parameters of the pilot signal via the pilot line, physical parameters of the power supply network at the power withdrawal point via the charging current lines, and physical parameters of the station charging device or of the cable charging device via the pilot line, respectively, during a charging process so as to produce a parameter data set characterizing the power withdrawal point. 2. The system according to claim 1, wherein
the vehicle comprises a GPS-based navigation system; and the parameter data set includes location data of the power withdrawal point. 3. The system according to claim 2, wherein
the location data is detectable by the GPS navigation system; and the location data is detectable by way of driving route identification when a GPS signal is not available. 4. The system according to claim 1, wherein
the produced parameter data set is stored by the charging electronics unit as a characterization data set of the power withdrawal point in a memory of at least one of the charging electronics unit and a central vehicle memory. 5. The system according to claim 2, wherein
the produced parameter data set is stored by the charging electronics unit as a characterization data set of the power withdrawal point in a memory of at least one of the charging electronics unit and a central vehicle memory. 6. The system according to claim 3, wherein
the produced parameter data set is stored by the charging electronics unit as a characterization data set of the power withdrawal point in a memory of at least one of the charging electronics unit and a central vehicle memory. 7. A system, comprising:
a plurality of power withdrawal points according to claim 1; a plurality of vehicles according to claim 1; and a characterization data set about a particular one of the plurality of power withdrawal points stored by the charging electronics unit of a respective one of the plurality of vehicles. 8. The system according to claim 7, wherein
one of the plurality of vehicles compares produced parameter data set to the stored characterization data set during a charging process; and the charging electronics unit generates an identification signal for the characterization data set that corresponds to the produced parameter data set. 9. The system according to claim 8, wherein
the comparison of the produced parameter data set to the stored characterization data set is carried out according to a statistical classification method. 10. The system according to claim 8, wherein
the charging process is controlled in an optimized manner with respect to a charging strategy when an identification signal is generated. 11. The system according to claim 8, wherein
the charging process is billed by the power provider with respect to the identified power withdrawal point when an identification signal is generated. 12. The system according to claim 7, wherein
the characterization data set is exchanged between at least two vehicles of the plurality of vehicles via data communication. 13. The system according to claim 8, wherein
the characterization data set is exchanged between at least two vehicles of the plurality of vehicles via data communication. | A system includes a power withdrawal point on a power supply network and a vehicle for the corded charging of a traction battery at the power withdrawal point. The vehicle includes a charging electronics unit for charging, and is electrically connectable to the vehicle-external power withdrawal point via a charging cable. The charging cable is configured as a cable connected outside the vehicle to a station charging device for a charging process, or as a cable charging device. The station charging device or the cable charging device, respectively, is electrically connected to the power withdrawal point when a charging connection has been established, and the power withdrawal point can supply an alternating current respectively via the station charging device or via the cable charging device for charging. The station charging device or the cable charging device, respectively, is electrically connected to the charging electronics unit via a pilot line when the charging connection has been established, where the charging process is controllable by an electric pilot signal applied via the pilot line. The charging electronics unit detects physical parameters of the pilot signal via the pilot line, physical parameters of the power supply network at the power withdrawal point via the charging current lines, and physical parameters of the station charging device or of the cable charging device via the pilot line, respectively, during a charging process so as to produce a parameter data set characterizing the power withdrawal point.1. A system comprising a power withdrawal point on a power supply network and comprising a vehicle for the corded charging of a traction battery of the vehicle at the power withdrawal point, the vehicle having a charging electronics unit for charging, and the vehicle being electrically connectable to the vehicle-external power withdrawal point via a charging cable for the charging process, wherein
the charging cable is configured as one of (i) a cable connected outside the vehicle to a station charging device for a charging process, and (ii) a cable charging device; the station charging device or the cable charging device is respectively electrically connected to the power withdrawal point when a charging connection has been established, and the power withdrawal point can supply an alternating current for charging via the station charging device or via the cable charging device, respectively; the supplied alternating current is respectively conducted from the station charging device or from the cable charging device over charging current lines of the charging cable for charging; the station charging device or the cable charging device is respectively electrically connected to the charging electronics unit via a pilot line when the charging connection has been established; the charging process is controllable by an electric pilot signal applied via the pilot line; and the charging electronics unit detects physical parameters of the pilot signal via the pilot line, physical parameters of the power supply network at the power withdrawal point via the charging current lines, and physical parameters of the station charging device or of the cable charging device via the pilot line, respectively, during a charging process so as to produce a parameter data set characterizing the power withdrawal point. 2. The system according to claim 1, wherein
the vehicle comprises a GPS-based navigation system; and the parameter data set includes location data of the power withdrawal point. 3. The system according to claim 2, wherein
the location data is detectable by the GPS navigation system; and the location data is detectable by way of driving route identification when a GPS signal is not available. 4. The system according to claim 1, wherein
the produced parameter data set is stored by the charging electronics unit as a characterization data set of the power withdrawal point in a memory of at least one of the charging electronics unit and a central vehicle memory. 5. The system according to claim 2, wherein
the produced parameter data set is stored by the charging electronics unit as a characterization data set of the power withdrawal point in a memory of at least one of the charging electronics unit and a central vehicle memory. 6. The system according to claim 3, wherein
the produced parameter data set is stored by the charging electronics unit as a characterization data set of the power withdrawal point in a memory of at least one of the charging electronics unit and a central vehicle memory. 7. A system, comprising:
a plurality of power withdrawal points according to claim 1; a plurality of vehicles according to claim 1; and a characterization data set about a particular one of the plurality of power withdrawal points stored by the charging electronics unit of a respective one of the plurality of vehicles. 8. The system according to claim 7, wherein
one of the plurality of vehicles compares produced parameter data set to the stored characterization data set during a charging process; and the charging electronics unit generates an identification signal for the characterization data set that corresponds to the produced parameter data set. 9. The system according to claim 8, wherein
the comparison of the produced parameter data set to the stored characterization data set is carried out according to a statistical classification method. 10. The system according to claim 8, wherein
the charging process is controlled in an optimized manner with respect to a charging strategy when an identification signal is generated. 11. The system according to claim 8, wherein
the charging process is billed by the power provider with respect to the identified power withdrawal point when an identification signal is generated. 12. The system according to claim 7, wherein
the characterization data set is exchanged between at least two vehicles of the plurality of vehicles via data communication. 13. The system according to claim 8, wherein
the characterization data set is exchanged between at least two vehicles of the plurality of vehicles via data communication. | 2,800 |
11,783 | 11,783 | 15,133,893 | 2,856 | A seismic detection element for a micromechanical sensor, having a first functional layer, a second functional layer and a third functional layer, the second functional layer being situated between the first functional layer and the third functional layer; a defined number of cavities being developed in the second functional layer; reinforcement elements being situated between the cavities, which are firmly connected to the first functional layer and to the third functional layer. | 1. A seismic detection element for a micromechanical sensor, comprising:
a first functional layer, a second functional layer and a third functional layer, the second functional layer being situated between the first functional layer and the third functional layer, the second functional layer having a defined number of cavities; reinforcement elements situated between the cavities, the reinforcement elements being firmly connected to the first functional layer and to the third functional layer. 2. The seismic detection element as recited in claim 1, wherein the first functional layer has a first perforation and the third functional layer has a second perforation. 3. The seismic detection element as recited in claim 2, wherein diameters of the second perforation are definably smaller than diameters of the first perforation. 4. The seismic detection element as recited in claim 2, wherein diameters of the second perforation are essentially identical to diameters of the first perforation. 5. The seismic detection element as recited in claim 1, wherein the seismic detection element is an asymmetrically designed rocker device of a Z sensor. 6. The seismic detection element as recited in claim 5, wherein the asymmetry, of the rocker device is designed as at least one of a geometric asymmetry and a mass asymmetry, of the rocker device. 7. The seismic detection element as recited in claim 5, wherein the cavities are in at least one of the rocker arms of the rocker device. 8. The seismic detection element as recited in claim 1, wherein the reinforcement elements are connected at least in pointwise fashion to the first and third functional layers. 9. A micromechanical sensor having a seismic detection element, the seismic detection element comprising:
a first functional layer, a second functional layer and a third functional layer, the second functional layer being situated between the first functional layer and the third functional layer, the second functional layer having a defined number of cavities; reinforcement elements situated between the cavities, the reinforcement elements being firmly connected to the first functional layer and to the third functional layer. 10. A method for manufacturing a seismic detection element for a micromechanical sensor, comprising:
forming a third functional layer; forming by sections a second functional layer on the third functional layer; and forming a first functional layer on the third functional layer and the second functional layer. | A seismic detection element for a micromechanical sensor, having a first functional layer, a second functional layer and a third functional layer, the second functional layer being situated between the first functional layer and the third functional layer; a defined number of cavities being developed in the second functional layer; reinforcement elements being situated between the cavities, which are firmly connected to the first functional layer and to the third functional layer.1. A seismic detection element for a micromechanical sensor, comprising:
a first functional layer, a second functional layer and a third functional layer, the second functional layer being situated between the first functional layer and the third functional layer, the second functional layer having a defined number of cavities; reinforcement elements situated between the cavities, the reinforcement elements being firmly connected to the first functional layer and to the third functional layer. 2. The seismic detection element as recited in claim 1, wherein the first functional layer has a first perforation and the third functional layer has a second perforation. 3. The seismic detection element as recited in claim 2, wherein diameters of the second perforation are definably smaller than diameters of the first perforation. 4. The seismic detection element as recited in claim 2, wherein diameters of the second perforation are essentially identical to diameters of the first perforation. 5. The seismic detection element as recited in claim 1, wherein the seismic detection element is an asymmetrically designed rocker device of a Z sensor. 6. The seismic detection element as recited in claim 5, wherein the asymmetry, of the rocker device is designed as at least one of a geometric asymmetry and a mass asymmetry, of the rocker device. 7. The seismic detection element as recited in claim 5, wherein the cavities are in at least one of the rocker arms of the rocker device. 8. The seismic detection element as recited in claim 1, wherein the reinforcement elements are connected at least in pointwise fashion to the first and third functional layers. 9. A micromechanical sensor having a seismic detection element, the seismic detection element comprising:
a first functional layer, a second functional layer and a third functional layer, the second functional layer being situated between the first functional layer and the third functional layer, the second functional layer having a defined number of cavities; reinforcement elements situated between the cavities, the reinforcement elements being firmly connected to the first functional layer and to the third functional layer. 10. A method for manufacturing a seismic detection element for a micromechanical sensor, comprising:
forming a third functional layer; forming by sections a second functional layer on the third functional layer; and forming a first functional layer on the third functional layer and the second functional layer. | 2,800 |
11,784 | 11,784 | 15,523,184 | 2,852 | According to one example, there is provided an imaging system that comprises a housing, a rotatable polygon comprising multiple mirrored facets located in the housing, a laser to generate a laser beam to shine onto the polygon mirror and to reflect onto a target, and wherein, in use, the density of gas within the housing is such that turbulence-related optical distortion within the housing is not greater than a predetermined limit. | 1. An imaging system, comprising:
a housing; a rotatable polygon comprising multiple mirrored facets located in the housing; a laser to generate a laser beam to shine onto the polygon mirror and to reflect onto a target; wherein, in use, the density of gas within the housing is such that turbulence-related optical distortion within the housing is not greater than a predetermined limit. 2. The imaging system of claim 1, wherein the housing is hermetic or substantially hermetic, and wherein the imaging system further comprises:
a pump connected to the housing through a conduit; and a pump controller to control the pump to remove air from the housing to reduce the air pressure within the housing to a predetermined level. 3. The imaging system of claim 2, wherein the air pressure is reduced to a level such that turbulence-related optical distortion within the housing does not adversely affect a laser beam passing through the turbulence. 4. The imaging system of claim 2, wherein the pump controller controls the pump to reduce the air pressure within the housing to not below about 0.1 atmospheres. 5. The imaging system of claim 1, wherein the housing hermetic and is filled with a lighter than air gas or gaseous mix. 6. The imaging system of claim 5, wherein the density of the lighter than air gas or gaseous mix has a density that mitigates the effects of any turbulence-related optical distortion for the imaging system. 7. The imaging system of claim 1, wherein the target is a photoconductor of an electrostatic printing system, and wherein the angle of the laser beam reflected from the polygon mirror between resolvable pixels on the photoconductor is less than or equal to about 10 arcseconds. 8. The imaging system of claim 1, wherein, in use, the polygon mirror is rotated at a speed of greater than 20000 RPM. 9. The imaging system of claim 1, further comprising an air bearing on which the polygon mirror is mount, the air bearing being located within the housing. 10. An electrostatic printing system, comprising:
an imaging system housing; a rotatable polygon comprising multiple mirrored facets located in the housing; a laser to generate a laser beam to shine onto the polygon mirror and to reflect onto a photoconductor member; wherein the density of gas within the housing is such that, when the mirror is rotating at high-speed, turbulence-related optical distortion within the housing does not adversely affect the laser beam. 11. The printing system of claim 10, wherein the housing is hermetic to a high degree, and the printing system further comprises:
a pump in fluid communication with gas within the housing; and a pump controller to control the pump to reduce the pressure within the housing to within a predetermined range. 12. The printing system of claim 11, wherein the pump controller is to control the pump to reduce the pressure within the housing to a pressure greater that 0.1 atmospheres. 13. The printing system of claim 10, wherein the angle of the reflected laser beam between resolvable pixels on the photoconductor is less than or equal to about 10 arcseconds. 14. The printing system of claim 10, wherein the mirror is mounted on an air bearing located within the housing. 15. The printing system of claim 10, wherein the housing is hermetic and is filled with a lighter than air gas or gaseous mix. | According to one example, there is provided an imaging system that comprises a housing, a rotatable polygon comprising multiple mirrored facets located in the housing, a laser to generate a laser beam to shine onto the polygon mirror and to reflect onto a target, and wherein, in use, the density of gas within the housing is such that turbulence-related optical distortion within the housing is not greater than a predetermined limit.1. An imaging system, comprising:
a housing; a rotatable polygon comprising multiple mirrored facets located in the housing; a laser to generate a laser beam to shine onto the polygon mirror and to reflect onto a target; wherein, in use, the density of gas within the housing is such that turbulence-related optical distortion within the housing is not greater than a predetermined limit. 2. The imaging system of claim 1, wherein the housing is hermetic or substantially hermetic, and wherein the imaging system further comprises:
a pump connected to the housing through a conduit; and a pump controller to control the pump to remove air from the housing to reduce the air pressure within the housing to a predetermined level. 3. The imaging system of claim 2, wherein the air pressure is reduced to a level such that turbulence-related optical distortion within the housing does not adversely affect a laser beam passing through the turbulence. 4. The imaging system of claim 2, wherein the pump controller controls the pump to reduce the air pressure within the housing to not below about 0.1 atmospheres. 5. The imaging system of claim 1, wherein the housing hermetic and is filled with a lighter than air gas or gaseous mix. 6. The imaging system of claim 5, wherein the density of the lighter than air gas or gaseous mix has a density that mitigates the effects of any turbulence-related optical distortion for the imaging system. 7. The imaging system of claim 1, wherein the target is a photoconductor of an electrostatic printing system, and wherein the angle of the laser beam reflected from the polygon mirror between resolvable pixels on the photoconductor is less than or equal to about 10 arcseconds. 8. The imaging system of claim 1, wherein, in use, the polygon mirror is rotated at a speed of greater than 20000 RPM. 9. The imaging system of claim 1, further comprising an air bearing on which the polygon mirror is mount, the air bearing being located within the housing. 10. An electrostatic printing system, comprising:
an imaging system housing; a rotatable polygon comprising multiple mirrored facets located in the housing; a laser to generate a laser beam to shine onto the polygon mirror and to reflect onto a photoconductor member; wherein the density of gas within the housing is such that, when the mirror is rotating at high-speed, turbulence-related optical distortion within the housing does not adversely affect the laser beam. 11. The printing system of claim 10, wherein the housing is hermetic to a high degree, and the printing system further comprises:
a pump in fluid communication with gas within the housing; and a pump controller to control the pump to reduce the pressure within the housing to within a predetermined range. 12. The printing system of claim 11, wherein the pump controller is to control the pump to reduce the pressure within the housing to a pressure greater that 0.1 atmospheres. 13. The printing system of claim 10, wherein the angle of the reflected laser beam between resolvable pixels on the photoconductor is less than or equal to about 10 arcseconds. 14. The printing system of claim 10, wherein the mirror is mounted on an air bearing located within the housing. 15. The printing system of claim 10, wherein the housing is hermetic and is filled with a lighter than air gas or gaseous mix. | 2,800 |
11,785 | 11,785 | 14,291,159 | 2,899 | Conventional semiconductor devices have a problem that it is difficult to prevent the short circuit between chips and to improve accuracy in temperature detection with the controlling semiconductor chips. In a semiconductor device of the present invention, a first mount region to which a driving semiconductor chip is fixedly attached and a second mount region to which a controlling semiconductor chip is fixedly attached are formed isolated from each other. A projecting area is formed in the first mount region, and the projecting area protrudes into the second mount region. The controlling semiconductor chip is fixedly attached to the top surfaces of the projecting area and the second mount region by use of an insulating adhesive sheet material. This structure prevents the short circuit between the two chips, and improves accuracy in temperature detection with the controlling semiconductor chip. | 1. (canceled) 2. (canceled) 3. (canceled) 4. (canceled) 5. (canceled) 6. (canceled) 7. A semiconductor device comprising:
at least a mount region; leads placed near the mount region; a first semiconductor chip fixedly attached to a top surface of the mount region; a sheet material comprising an insulating adhesive applied to a top side of the sheet material, wherein the sheet material is adhered by the insulating adhesive to a back surface of the mount region in a way that closes an opening formed in the mount region; a second semiconductor chip fixedly attached to the top side of the sheet material inside the opening by the insulating adhesive, wherein the second semiconductor chip is configured to control the first semiconductor chip; and a resin sealing body covering at least part of the mount region, the leads, and the first and second semiconductor chips. 8. The semiconductor device according to claim 7, wherein the second semiconductor chip includes a thermal shutdown circuit configured to detect and control a temperature of the first semiconductor chip. 9. The semiconductor device according to claim 8, wherein the sheet material comprises any one of a polyimide tape, a silicone tape and a DAF material. 10. The semiconductor device according to claim 9, wherein the second semiconductor chip is placed on a portion of the sheet material, the portion being away from an end portion of the opening. 11. The semiconductor device according to claim 7, wherein the second semiconductor chip has a footprint that is smaller than the opening formed in the mount region. 12. The semiconductor device according to claim 7, wherein the sheet material comprises a polyimide tape. 13. The semiconductor device according to claim 7, wherein the first semiconductor chip is wire bonded to the second semiconductor chip. 14. The semiconductor device according to claim 7, wherein the opening formed in the mount region is enclosed by the mount region. 15. The semiconductor device according to claim 7, wherein the first semiconductor chip is spaced apart from the mount region. 16. A semiconductor device comprising:
a lead frame; an opening in the lead frame; a plurality of leads extending from the lead frame; an insulating adhesive sheet fixed to a first side of the lead frame, wherein a portion of the adhesive sheet extends over the opening in the lead frame; a first semiconductor chip fixed to the portion of the insulating adhesive sheet extending over the opening in the lead frame, wherein the first semiconductor chip extends from the insulating adhesive sheet through the opening in the lead frame; and an encapsulating resin at least partially encapsulating the first semiconductor chip, the insulating adhesive sheet, and the lead frame. 17. The semiconductor device of claim 16, wherein the opening in the lead frame has a polygonal shape. 18. The semiconductor device of claim 17, wherein the first semiconductor chip has a footprint with a polygonal shape that is the same as the polygonal shape of the lead frame. 19. The semiconductor device of claim 16, wherein the first semiconductor chip is electrically coupled to one or more of the plurality of leads. 20. The semiconductor device of claim 16, wherein the insulating adhesive sheet covers an entire surface area of the opening in the lead frame. 21. The semiconductor device of claim 16, wherein the first semiconductor chip is spaced apart from the lead frame. 22. The semiconductor device of claim 16, wherein the insulating adhesive sheet material is formed of any one of a polyimide tape, a silicone tape and a DAF material. 23. The semiconductor device of claim 16, wherein the semiconductor device further comprises a second semiconductor chip fixed to a second side of the lead frame and spaced apart from the opening in the lead frame. 24. The semiconductor device of claim 23, wherein the first semiconductor chip includes a thermal shutdown circuit configured to detect and control a temperature of the second semiconductor chip. 25. The semiconductor device of claim 16, wherein the first semiconductor chip is laterally aligned over a center of the opening and spaced apart from each edge of the opening in the lead frame. 26. A method of making a semiconductor device, the method comprising:
providing a lead frame comprising:
a plurality of leads extending from the lead frame; and
an opening extending through the lead frame from a first side of the lead frame to a second side of the lead frame;
fixing an insulating adhesive sheet to a second side of the lead frame, wherein the insulating adhesive sheet extends over the opening in the lead frame; disposing a semiconductor chip through the opening in the lead frame such that the semiconductor chip adheres to the insulating adhesive sheet; and embedding at least a portion of the lead frame, the semiconductor chip, and the adhesive sheet in an encapsulating resin. | Conventional semiconductor devices have a problem that it is difficult to prevent the short circuit between chips and to improve accuracy in temperature detection with the controlling semiconductor chips. In a semiconductor device of the present invention, a first mount region to which a driving semiconductor chip is fixedly attached and a second mount region to which a controlling semiconductor chip is fixedly attached are formed isolated from each other. A projecting area is formed in the first mount region, and the projecting area protrudes into the second mount region. The controlling semiconductor chip is fixedly attached to the top surfaces of the projecting area and the second mount region by use of an insulating adhesive sheet material. This structure prevents the short circuit between the two chips, and improves accuracy in temperature detection with the controlling semiconductor chip.1. (canceled) 2. (canceled) 3. (canceled) 4. (canceled) 5. (canceled) 6. (canceled) 7. A semiconductor device comprising:
at least a mount region; leads placed near the mount region; a first semiconductor chip fixedly attached to a top surface of the mount region; a sheet material comprising an insulating adhesive applied to a top side of the sheet material, wherein the sheet material is adhered by the insulating adhesive to a back surface of the mount region in a way that closes an opening formed in the mount region; a second semiconductor chip fixedly attached to the top side of the sheet material inside the opening by the insulating adhesive, wherein the second semiconductor chip is configured to control the first semiconductor chip; and a resin sealing body covering at least part of the mount region, the leads, and the first and second semiconductor chips. 8. The semiconductor device according to claim 7, wherein the second semiconductor chip includes a thermal shutdown circuit configured to detect and control a temperature of the first semiconductor chip. 9. The semiconductor device according to claim 8, wherein the sheet material comprises any one of a polyimide tape, a silicone tape and a DAF material. 10. The semiconductor device according to claim 9, wherein the second semiconductor chip is placed on a portion of the sheet material, the portion being away from an end portion of the opening. 11. The semiconductor device according to claim 7, wherein the second semiconductor chip has a footprint that is smaller than the opening formed in the mount region. 12. The semiconductor device according to claim 7, wherein the sheet material comprises a polyimide tape. 13. The semiconductor device according to claim 7, wherein the first semiconductor chip is wire bonded to the second semiconductor chip. 14. The semiconductor device according to claim 7, wherein the opening formed in the mount region is enclosed by the mount region. 15. The semiconductor device according to claim 7, wherein the first semiconductor chip is spaced apart from the mount region. 16. A semiconductor device comprising:
a lead frame; an opening in the lead frame; a plurality of leads extending from the lead frame; an insulating adhesive sheet fixed to a first side of the lead frame, wherein a portion of the adhesive sheet extends over the opening in the lead frame; a first semiconductor chip fixed to the portion of the insulating adhesive sheet extending over the opening in the lead frame, wherein the first semiconductor chip extends from the insulating adhesive sheet through the opening in the lead frame; and an encapsulating resin at least partially encapsulating the first semiconductor chip, the insulating adhesive sheet, and the lead frame. 17. The semiconductor device of claim 16, wherein the opening in the lead frame has a polygonal shape. 18. The semiconductor device of claim 17, wherein the first semiconductor chip has a footprint with a polygonal shape that is the same as the polygonal shape of the lead frame. 19. The semiconductor device of claim 16, wherein the first semiconductor chip is electrically coupled to one or more of the plurality of leads. 20. The semiconductor device of claim 16, wherein the insulating adhesive sheet covers an entire surface area of the opening in the lead frame. 21. The semiconductor device of claim 16, wherein the first semiconductor chip is spaced apart from the lead frame. 22. The semiconductor device of claim 16, wherein the insulating adhesive sheet material is formed of any one of a polyimide tape, a silicone tape and a DAF material. 23. The semiconductor device of claim 16, wherein the semiconductor device further comprises a second semiconductor chip fixed to a second side of the lead frame and spaced apart from the opening in the lead frame. 24. The semiconductor device of claim 23, wherein the first semiconductor chip includes a thermal shutdown circuit configured to detect and control a temperature of the second semiconductor chip. 25. The semiconductor device of claim 16, wherein the first semiconductor chip is laterally aligned over a center of the opening and spaced apart from each edge of the opening in the lead frame. 26. A method of making a semiconductor device, the method comprising:
providing a lead frame comprising:
a plurality of leads extending from the lead frame; and
an opening extending through the lead frame from a first side of the lead frame to a second side of the lead frame;
fixing an insulating adhesive sheet to a second side of the lead frame, wherein the insulating adhesive sheet extends over the opening in the lead frame; disposing a semiconductor chip through the opening in the lead frame such that the semiconductor chip adheres to the insulating adhesive sheet; and embedding at least a portion of the lead frame, the semiconductor chip, and the adhesive sheet in an encapsulating resin. | 2,800 |
11,786 | 11,786 | 14,318,256 | 2,859 | Devices and methods are used to bridge between standard wireless charging protocols and proprietary wireless charging protocols utilized in auditory prostheses. Such devices are portable and can enable a recipient to charge her device whenever wireless power is available. Additionally, the recipient can change settings on her prosthesis, via the bridge device, while her prosthesis is charging. | 1. An apparatus comprising:
a first induction device for receiving a first wireless charging protocol having a first frequency; a second induction device for transmitting a second wireless charging protocol having a second frequency; and a conversion circuit operably connected to the first induction device and the second induction device for converting the first wireless charging protocol to the second wireless charging protocol. 2. The apparatus of claim 1, further comprising a housing, wherein the first induction device and the conversion circuit are disposed within the housing. 3. The apparatus of claim 2, further comprising a third induction device disposed remote from the housing and connected to the conversion circuit with a cable. 4. The apparatus of claim 2, wherein the first induction device comprises a receiver coil and the second induction device comprises a transmitter coil. 5. The apparatus of claim 2, wherein the first induction device is disposed about an outer perimeter of the second induction device. 6. The apparatus of claim 1, wherein the second induction device comprises a plurality of second induction devices. 7. The apparatus of claim 1, further comprising at least one of a battery and a power cable. 8. The apparatus of claim 1, further comprising an input disposed on the housing. 9. The apparatus of claim 8, wherein the input comprises at least one of a microphone, a button, a switch, a port, and a graphic user interface. 10. A method comprising:
receiving, from a wireless charger device, a first wireless charging protocol having a first frequency; converting the first wireless charging protocol to a second wireless charging protocol having a second frequency; and transmitting, to a first portable device, the second wireless charging protocol. 11. The method of claim 10, further comprising:
identifying the first portable device; and selecting the second wireless charging protocol based at least in part on the identified first portable device. 12. The method of claim 11, wherein the identifying operation comprises receiving a signal from the first portable device. 13. The method of claim 10, further comprising receiving an input signal. 14. The method of claim 13, further comprising transmitting a data signal to the first portable device based at least in part on the input signal. 15. The method of claim 13, further comprising:
converting the first wireless charging protocol to a third wireless charging protocol having a third frequency; and transmitting, to a third portable device, the third wireless charging protocol. 16. The method of claim 15, wherein the third wireless charging protocol is substantially similar to the first wireless charging protocol. 17. The method of claim 15, wherein transmitting the second wireless charging protocol to the first portable device and transmitting the third wireless charging protocol to the second portable device occurs simultaneously. 18. An apparatus comprising:
a first device for receiving a first wireless charging protocol; a conversion circuit for converting the first charging protocol into a second wireless charging protocol; and a second device for transmitting the second wireless charging protocol. 19. The apparatus of claim 18, wherein the first wireless charging protocol is based at least in part on energy received from an induction device, a battery, and a building power source. 20. The apparatus of claim 20, wherein the first device and the second device each comprise coils. | Devices and methods are used to bridge between standard wireless charging protocols and proprietary wireless charging protocols utilized in auditory prostheses. Such devices are portable and can enable a recipient to charge her device whenever wireless power is available. Additionally, the recipient can change settings on her prosthesis, via the bridge device, while her prosthesis is charging.1. An apparatus comprising:
a first induction device for receiving a first wireless charging protocol having a first frequency; a second induction device for transmitting a second wireless charging protocol having a second frequency; and a conversion circuit operably connected to the first induction device and the second induction device for converting the first wireless charging protocol to the second wireless charging protocol. 2. The apparatus of claim 1, further comprising a housing, wherein the first induction device and the conversion circuit are disposed within the housing. 3. The apparatus of claim 2, further comprising a third induction device disposed remote from the housing and connected to the conversion circuit with a cable. 4. The apparatus of claim 2, wherein the first induction device comprises a receiver coil and the second induction device comprises a transmitter coil. 5. The apparatus of claim 2, wherein the first induction device is disposed about an outer perimeter of the second induction device. 6. The apparatus of claim 1, wherein the second induction device comprises a plurality of second induction devices. 7. The apparatus of claim 1, further comprising at least one of a battery and a power cable. 8. The apparatus of claim 1, further comprising an input disposed on the housing. 9. The apparatus of claim 8, wherein the input comprises at least one of a microphone, a button, a switch, a port, and a graphic user interface. 10. A method comprising:
receiving, from a wireless charger device, a first wireless charging protocol having a first frequency; converting the first wireless charging protocol to a second wireless charging protocol having a second frequency; and transmitting, to a first portable device, the second wireless charging protocol. 11. The method of claim 10, further comprising:
identifying the first portable device; and selecting the second wireless charging protocol based at least in part on the identified first portable device. 12. The method of claim 11, wherein the identifying operation comprises receiving a signal from the first portable device. 13. The method of claim 10, further comprising receiving an input signal. 14. The method of claim 13, further comprising transmitting a data signal to the first portable device based at least in part on the input signal. 15. The method of claim 13, further comprising:
converting the first wireless charging protocol to a third wireless charging protocol having a third frequency; and transmitting, to a third portable device, the third wireless charging protocol. 16. The method of claim 15, wherein the third wireless charging protocol is substantially similar to the first wireless charging protocol. 17. The method of claim 15, wherein transmitting the second wireless charging protocol to the first portable device and transmitting the third wireless charging protocol to the second portable device occurs simultaneously. 18. An apparatus comprising:
a first device for receiving a first wireless charging protocol; a conversion circuit for converting the first charging protocol into a second wireless charging protocol; and a second device for transmitting the second wireless charging protocol. 19. The apparatus of claim 18, wherein the first wireless charging protocol is based at least in part on energy received from an induction device, a battery, and a building power source. 20. The apparatus of claim 20, wherein the first device and the second device each comprise coils. | 2,800 |
11,787 | 11,787 | 16,182,528 | 2,835 | A Colored Circuit Breaker System for any existing and/or new circuit breaker panel structured and arranged to use specific, coded colors, at the point of manufacture, to identify individual circuits and breakers, easily identifying which breaker goes to which component. | 1. In a circuit breaker including a main body having two electrical conductors and a circuit breaking switch therebetween, the improvement comprising:
wherein said main body is formed having a color to represent an area or system being supplied power thereto, such that when a problem occurs in said area or system the proper circuit breaker is more easily discernable. 2. The improved circuit breaker of claim 1, wherein said main body is injection molded plastic having said color impregnated therein. 3. The improved circuit breaker of claim 1, wherein said color is chosen from a list of colors consisting of:
orange;
wherein said orange color is used to represent an area to be provided electricity chosen from a list of areas to be provided electricity consisting of construction, research, fiber optics systems, and auto repair and maintenance;
green;
wherein said green color is used to represent an area to be provided electricity chosen from a list of areas to be provided electricity consisting of a hospital, healthcare, nurse call stations, and critical circuits;
purple;
wherein said purple color is used to represent systems to be provided electricity chosen from a list of systems to be provided electricity consisting of specialty wiring systems, and security systems;
red;
wherein said red color is used to represent systems to be provided electricity chosen from a list of systems to be provided electricity consisting of emergency circuits, and fire alarm and security systems;
yellow;
wherein said yellow color is used to represent an area to be provided electricity chosen from a list of areas to be provided electricity consisting of high voltage wiring, caution, and special equipment; and
blue;
wherein said blue color is used to represent systems to be provided electricity chosen from a list of systems to be provided electricity consisting of low voltage wiring, data, video communications, and network security. 4. An improved circuit breaker set comprising:
a plurality of circuit breakers including:
at least one circuit breaker formed having an orange color;
wherein said orange color is used to represent an area to be provided electricity chosen from a list of areas to be provided electricity consisting of construction, research, fiber optics systems, and auto repair and maintenance;
at least one circuit breaker formed having an green color;
wherein said green color is used to represent an area to be provided electricity chosen from a list of areas to be provided electricity consisting of a hospital, healthcare, nurse call stations, and critical circuits;
at least one circuit breaker formed having an purple color;
wherein said purple color is used to represent systems to be provided electricity chosen from a list of systems to be provided electricity consisting of specialty wiring systems, and security systems;
at least one circuit breaker formed having an red color;
wherein said red color is used to represent systems to be provided electricity chosen from a list of systems to be provided electricity consisting of emergency circuits, and fire alarm and security systems;
at least one circuit breaker formed having an yellow color;
wherein said yellow color is used to represent an area to be provided electricity chosen from a list of areas to be provided electricity consisting of high voltage wiring, caution, and special equipment; and
at least one circuit breaker formed having an blue color;
wherein said blue color is used to represent systems to be provided electricity chosen from a list of systems to be provided electricity consisting of low voltage wiring, data, video communications, and network security. 5. An improved circuit breaker set of claim 4, further comprising:
at least one circuit breaker formed having a black color;
wherein said black color is used to represent standard power circuits to be provided electricity thereto. 6. An improved circuit breaker system comprising:
a plurality of circuit breakers including:
at least one circuit breaker formed having an orange color;
wherein said orange color is used to represent an area to be provided electricity chosen from a list of areas to be provided electricity consisting of construction, research, fiber optics systems, and auto repair and maintenance;
at least one circuit breaker formed having an green color;
wherein said green color is used to represent an area to be provided electricity chosen from a list of areas to be provided electricity consisting of a hospital, healthcare, nurse call stations, and critical circuits;
at least one circuit breaker formed having an purple color;
wherein said purple color is used to represent systems to be provided electricity chosen from a list of systems to be provided electricity consisting of specialty wiring systems, and security systems;
at least one circuit breaker formed having an red color;
wherein said red color is used to represent systems to be provided electricity chosen from a list of systems to be provided electricity consisting of emergency circuits, and fire alarm and security systems;
at least one circuit breaker formed having an yellow color;
wherein said yellow color is used to represent an area to be provided electricity chosen from a list of areas to be provided electricity consisting of high voltage wiring, caution, and special equipment; and
at least one circuit breaker formed having an blue color;
wherein said blue color is used to represent systems to be provided electricity chosen from a list of systems to be provided electricity consisting of low voltage wiring, data, video communications, and network security;
a circuit breaker box;
wherein said circuit breaker box is adapted to securely and releasably hold said plurality of circuit breakers therein in a spaced relationship; and
a plurality of electrical wires comprising:
at least one electrical wire formed having an orange color;
wherein said at least one orange colored electrical wire is used supply power to and from said at least one orange colored circuit breaker;
at least one electrical wire formed having an green color;
wherein said at least one green colored electrical wire is used supply power to and from said at least one green colored circuit breaker;
at least one electrical wire formed having an purple color;
wherein said at least one purple colored electrical wire is used supply power to and from said at least one purple colored circuit breaker;
at least one electrical wire formed having an red color;
wherein said at least one red colored electrical wire is used supply power to and from said at least one red colored circuit breaker;
at least one electrical wire formed having an yellow color;
wherein said at least one yellow colored electrical wire is used supply power to and from said at least one yellow colored circuit breaker; and
at least one electrical wire formed having an blue color;
wherein said at least one blue colored electrical wire is used supply power to and from said at least one blue colored circuit breaker. 7. An improved circuit breaker system of claim 6, further comprising:
at least one circuit breaker formed having a black color;
wherein said black color is used to represent standard power circuits to be provided electricity thereto. 8. An improved circuit breaker system of claim 7, further comprising:
at least one electrical wire formed having an black color;
wherein said at least one black colored electrical wire is used supply power to and from said at least one black colored circuit breaker. 9. An improved circuit breaker system of claim 6, further comprising:
at least one electrical wire formed having an white color;
wherein said at least one white colored electrical wire is used supply power to and from said at least one black colored circuit breaker. | A Colored Circuit Breaker System for any existing and/or new circuit breaker panel structured and arranged to use specific, coded colors, at the point of manufacture, to identify individual circuits and breakers, easily identifying which breaker goes to which component.1. In a circuit breaker including a main body having two electrical conductors and a circuit breaking switch therebetween, the improvement comprising:
wherein said main body is formed having a color to represent an area or system being supplied power thereto, such that when a problem occurs in said area or system the proper circuit breaker is more easily discernable. 2. The improved circuit breaker of claim 1, wherein said main body is injection molded plastic having said color impregnated therein. 3. The improved circuit breaker of claim 1, wherein said color is chosen from a list of colors consisting of:
orange;
wherein said orange color is used to represent an area to be provided electricity chosen from a list of areas to be provided electricity consisting of construction, research, fiber optics systems, and auto repair and maintenance;
green;
wherein said green color is used to represent an area to be provided electricity chosen from a list of areas to be provided electricity consisting of a hospital, healthcare, nurse call stations, and critical circuits;
purple;
wherein said purple color is used to represent systems to be provided electricity chosen from a list of systems to be provided electricity consisting of specialty wiring systems, and security systems;
red;
wherein said red color is used to represent systems to be provided electricity chosen from a list of systems to be provided electricity consisting of emergency circuits, and fire alarm and security systems;
yellow;
wherein said yellow color is used to represent an area to be provided electricity chosen from a list of areas to be provided electricity consisting of high voltage wiring, caution, and special equipment; and
blue;
wherein said blue color is used to represent systems to be provided electricity chosen from a list of systems to be provided electricity consisting of low voltage wiring, data, video communications, and network security. 4. An improved circuit breaker set comprising:
a plurality of circuit breakers including:
at least one circuit breaker formed having an orange color;
wherein said orange color is used to represent an area to be provided electricity chosen from a list of areas to be provided electricity consisting of construction, research, fiber optics systems, and auto repair and maintenance;
at least one circuit breaker formed having an green color;
wherein said green color is used to represent an area to be provided electricity chosen from a list of areas to be provided electricity consisting of a hospital, healthcare, nurse call stations, and critical circuits;
at least one circuit breaker formed having an purple color;
wherein said purple color is used to represent systems to be provided electricity chosen from a list of systems to be provided electricity consisting of specialty wiring systems, and security systems;
at least one circuit breaker formed having an red color;
wherein said red color is used to represent systems to be provided electricity chosen from a list of systems to be provided electricity consisting of emergency circuits, and fire alarm and security systems;
at least one circuit breaker formed having an yellow color;
wherein said yellow color is used to represent an area to be provided electricity chosen from a list of areas to be provided electricity consisting of high voltage wiring, caution, and special equipment; and
at least one circuit breaker formed having an blue color;
wherein said blue color is used to represent systems to be provided electricity chosen from a list of systems to be provided electricity consisting of low voltage wiring, data, video communications, and network security. 5. An improved circuit breaker set of claim 4, further comprising:
at least one circuit breaker formed having a black color;
wherein said black color is used to represent standard power circuits to be provided electricity thereto. 6. An improved circuit breaker system comprising:
a plurality of circuit breakers including:
at least one circuit breaker formed having an orange color;
wherein said orange color is used to represent an area to be provided electricity chosen from a list of areas to be provided electricity consisting of construction, research, fiber optics systems, and auto repair and maintenance;
at least one circuit breaker formed having an green color;
wherein said green color is used to represent an area to be provided electricity chosen from a list of areas to be provided electricity consisting of a hospital, healthcare, nurse call stations, and critical circuits;
at least one circuit breaker formed having an purple color;
wherein said purple color is used to represent systems to be provided electricity chosen from a list of systems to be provided electricity consisting of specialty wiring systems, and security systems;
at least one circuit breaker formed having an red color;
wherein said red color is used to represent systems to be provided electricity chosen from a list of systems to be provided electricity consisting of emergency circuits, and fire alarm and security systems;
at least one circuit breaker formed having an yellow color;
wherein said yellow color is used to represent an area to be provided electricity chosen from a list of areas to be provided electricity consisting of high voltage wiring, caution, and special equipment; and
at least one circuit breaker formed having an blue color;
wherein said blue color is used to represent systems to be provided electricity chosen from a list of systems to be provided electricity consisting of low voltage wiring, data, video communications, and network security;
a circuit breaker box;
wherein said circuit breaker box is adapted to securely and releasably hold said plurality of circuit breakers therein in a spaced relationship; and
a plurality of electrical wires comprising:
at least one electrical wire formed having an orange color;
wherein said at least one orange colored electrical wire is used supply power to and from said at least one orange colored circuit breaker;
at least one electrical wire formed having an green color;
wherein said at least one green colored electrical wire is used supply power to and from said at least one green colored circuit breaker;
at least one electrical wire formed having an purple color;
wherein said at least one purple colored electrical wire is used supply power to and from said at least one purple colored circuit breaker;
at least one electrical wire formed having an red color;
wherein said at least one red colored electrical wire is used supply power to and from said at least one red colored circuit breaker;
at least one electrical wire formed having an yellow color;
wherein said at least one yellow colored electrical wire is used supply power to and from said at least one yellow colored circuit breaker; and
at least one electrical wire formed having an blue color;
wherein said at least one blue colored electrical wire is used supply power to and from said at least one blue colored circuit breaker. 7. An improved circuit breaker system of claim 6, further comprising:
at least one circuit breaker formed having a black color;
wherein said black color is used to represent standard power circuits to be provided electricity thereto. 8. An improved circuit breaker system of claim 7, further comprising:
at least one electrical wire formed having an black color;
wherein said at least one black colored electrical wire is used supply power to and from said at least one black colored circuit breaker. 9. An improved circuit breaker system of claim 6, further comprising:
at least one electrical wire formed having an white color;
wherein said at least one white colored electrical wire is used supply power to and from said at least one black colored circuit breaker. | 2,800 |
11,788 | 11,788 | 14,485,574 | 2,829 | A semiconductor device comprises a plurality of device features formed on a substrate and a plurality of dummy features formed on the substrate and across an open region between the device features. Adjacent device features are spaced apart by a distance of 100 microns or more. Each device feature includes a barrier island and a metal layer on top of the barrier island. Each dummy feature has a structure that corresponds to the structure of the barrier island. This abstract is provided to comply with rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims. | 1. A semiconductor device, comprising:
a plurality of device features formed on a substrate, wherein each device feature includes a barrier island and a metal layer on top of the barrier island and wherein adjacent device features are spaced apart by a distance of 100 microns or more; and a plurality of dummy features formed on the substrate and across an open region between and among the device features of the plurality, wherein a structure of each dummy corresponds to a structure to the barrier island. 2. The device of claim 1, wherein the barrier island is made from titanium nitride (TiN), titanium (Ti), indium tin oxide (ITO) or silicon dioxide (SiO2). 3. The device of claim 1, wherein the metal layer is made from Nickel (Ni), Chromium (Cr), Iron (Fe) or Gold (Au). 4. The device of claim 1, wherein two adjacent dummy features are spaced apart by a distance approximately equal to a characteristic size of the dummy feature. 5. The device of claim 1, wherein each device feature further includes an emitter structure formed on top of the metal layer. 6. The device of claim 1, wherein the emitter structure includes a carbon nanotube. 7. The device of claim 6, wherein the substrate is a doped semiconductor material. 8. The device of claim 1, wherein adjacent device features are spaced apart by a distance between about 100 microns and about 1 millimeter (1000 microns). In one implementation. 9. The device of claim 1, wherein adjacent device features are spaced apart by a distance between about 100 microns and about 500 microns. 10. A method, comprising:
forming a barrier layer on a substrate; patterning the barrier layer to form a plurality of first barrier islands and second barrier islands identical to the first barrier islands, wherein the first barrier islands are provided at locations of device features to be formed and the second barrier islands are provided across an open region between the device features to be formed; forming an oxide layer over the first and second barrier islands and the substrate; patterning the oxide layer to expose the first barrier islands; depositing a metal layer over the exposed first barrier islands and the oxide layer; and performing chemical mechanical polishing (CMP) on the metal layer so that only portions of the metal layer on top of the first barrier islands are left to form the device features. 11. The method of claim 10, wherein the barrier layer is made from titanium nitride (TiN), titanium (Ti), indium tin oxide (ITO) or silicon dioxide (SiO2). 12. The method of claim 10, wherein the metal layer is made from Nickel (Ni), Chromium (Cr), Iron (Fe) or Gold (Au). 13. The method of claim 10, wherein two adjacent second barrier islands are spaced apart by a distance approximately equal to a characteristic size of the second barrier island. 14. The method of claim 10, wherein two adjacent dummy features are spaced apart by a distance approximately equal to a characteristic size of the dummy feature. 15. The method of claim 10, further comprising forming an emitter structure on the metal layer the metal layer on top of one or more of the first barrier islands. 16. The method of claim 10, wherein the emitter structure includes a carbon nanotube. 17. The method of claim 16, wherein the substrate is a doped semiconductor material. 18. The method of claim 10, wherein adjacent device features are spaced apart by a distance between about 100 microns and about 1 millimeter (1000 microns). In one implementation. 19. The method of claim 10, wherein adjacent device features are spaced apart by a distance between about 100 microns and about 500 microns. | A semiconductor device comprises a plurality of device features formed on a substrate and a plurality of dummy features formed on the substrate and across an open region between the device features. Adjacent device features are spaced apart by a distance of 100 microns or more. Each device feature includes a barrier island and a metal layer on top of the barrier island. Each dummy feature has a structure that corresponds to the structure of the barrier island. This abstract is provided to comply with rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.1. A semiconductor device, comprising:
a plurality of device features formed on a substrate, wherein each device feature includes a barrier island and a metal layer on top of the barrier island and wherein adjacent device features are spaced apart by a distance of 100 microns or more; and a plurality of dummy features formed on the substrate and across an open region between and among the device features of the plurality, wherein a structure of each dummy corresponds to a structure to the barrier island. 2. The device of claim 1, wherein the barrier island is made from titanium nitride (TiN), titanium (Ti), indium tin oxide (ITO) or silicon dioxide (SiO2). 3. The device of claim 1, wherein the metal layer is made from Nickel (Ni), Chromium (Cr), Iron (Fe) or Gold (Au). 4. The device of claim 1, wherein two adjacent dummy features are spaced apart by a distance approximately equal to a characteristic size of the dummy feature. 5. The device of claim 1, wherein each device feature further includes an emitter structure formed on top of the metal layer. 6. The device of claim 1, wherein the emitter structure includes a carbon nanotube. 7. The device of claim 6, wherein the substrate is a doped semiconductor material. 8. The device of claim 1, wherein adjacent device features are spaced apart by a distance between about 100 microns and about 1 millimeter (1000 microns). In one implementation. 9. The device of claim 1, wherein adjacent device features are spaced apart by a distance between about 100 microns and about 500 microns. 10. A method, comprising:
forming a barrier layer on a substrate; patterning the barrier layer to form a plurality of first barrier islands and second barrier islands identical to the first barrier islands, wherein the first barrier islands are provided at locations of device features to be formed and the second barrier islands are provided across an open region between the device features to be formed; forming an oxide layer over the first and second barrier islands and the substrate; patterning the oxide layer to expose the first barrier islands; depositing a metal layer over the exposed first barrier islands and the oxide layer; and performing chemical mechanical polishing (CMP) on the metal layer so that only portions of the metal layer on top of the first barrier islands are left to form the device features. 11. The method of claim 10, wherein the barrier layer is made from titanium nitride (TiN), titanium (Ti), indium tin oxide (ITO) or silicon dioxide (SiO2). 12. The method of claim 10, wherein the metal layer is made from Nickel (Ni), Chromium (Cr), Iron (Fe) or Gold (Au). 13. The method of claim 10, wherein two adjacent second barrier islands are spaced apart by a distance approximately equal to a characteristic size of the second barrier island. 14. The method of claim 10, wherein two adjacent dummy features are spaced apart by a distance approximately equal to a characteristic size of the dummy feature. 15. The method of claim 10, further comprising forming an emitter structure on the metal layer the metal layer on top of one or more of the first barrier islands. 16. The method of claim 10, wherein the emitter structure includes a carbon nanotube. 17. The method of claim 16, wherein the substrate is a doped semiconductor material. 18. The method of claim 10, wherein adjacent device features are spaced apart by a distance between about 100 microns and about 1 millimeter (1000 microns). In one implementation. 19. The method of claim 10, wherein adjacent device features are spaced apart by a distance between about 100 microns and about 500 microns. | 2,800 |
11,789 | 11,789 | 14,894,909 | 2,872 | The invention is for a glasses frame to lenses for a user's eye. The frame has a first and second lens holding portions adapted to each hold a lens, the portions having at least one hinge between them. A first arm extends from the first lens holding portion on an edge thereof distal from the hinge, and a second arm extends from the second lens holding portion on another edge thereof distal from the hinge. The glasses frame has an unfolded position whereby the first and second lens holding portions are extended on said hinge to enable location of the lenses in front of each eye and the arms extend backward from the frame to engage with a head of the user, and a folded position whereby the first and second lens holding portions are contracted about the hinge to lie toward or adjacent each other and the arms fold such that a free end of each folds towards the hinge to thereby capture and retain the glasses frame to an elongate object. | 1. A glasses frame adapted to hold at least a pair of lenses, one each for an eye of a user, comprising or including,
A first lens holding portion and a second lens holding portion adapted to each hold a said lens, having at least one hinge therebetween, A first arm extending from said first lens holding portion on an edge thereof distal from said hinge, and a second arm extending from said second lens holding portion on an edge thereof distal from said hinge, Wherein said glasses frame has an unfolded position whereby said first lens holding portion and said second lens holding portion are extended on said hinge to enable location of said lenses in front of each said eye and said arms extend backward from said frame to engage with a head of said user, and a folded position whereby said first lens holding portion and said second lens holding portion are contracted about said hinge to lie toward or adjacent each other and said arms fold such that a free end of each folds towards said hinge to thereby enable capture and retention of said glasses frame to an elongate object. 2. A glasses frame as claimed in claim 1 wherein an axis of movement of said at least one hinge is substantially perpendicular to a major surface of said first and second lens holding portions when in said unfolded position. 3. A glasses frame as claimed in claim 1 wherein an axis of movement of said at least one hinge is substantially parallel to a major surface of said first and second lens holding portions when in said unfolded position. 4. A glasses frame as claimed in any one of claims 1 to 3 wherein said first lens holding portion and said second lens holding portion when in said folded position lie side by side each other. 5. A glasses frame as claimed in any one of claims 1 to 3 wherein said first lens holding portion and said second lens holding portion when in said folded position lie substantially one on top of each other. 6. A glasses frame as claimed in any one of claims 1 to 5 wherein said first and said second arm extend substantially parallel to each other at least when in said unfolded position. 7. A glasses frame as claimed in any one of claims 1 to 6 wherein said arms at least in part comprise a bi-stable material that extends for said unfolded position, and that folds or wraps for said folded position. 8. A glasses frame as claimed in claim 7 wherein said bi-stable material is a plastics, composites or metal material. 9. A glasses frame as claimed in either of claim 7 or 8 wherein said bi-stable material is coated with a soft or rubber like material. 10. A glasses frame as claimed in any one of claims 1 to 9 wherein each said lens holding portion extends substantially all the way about each said lens. 11. A glasses frame as claimed in any one of claims 1 to 10 wherein each said lens holding portion extends only part way around each said lens. 12. A glasses frame as claimed in any one of claims 1 to 11 wherein each said lens holding portion is a unitary part. 13. A glasses frame as claimed in any one of claims 1 to 11 wherein each said lens holding portion is comprised of multiple parts. 14. A glasses frame as claimed in any one of claims 1 to 13 wherein said at least one hinge is at least in part biased to either or both said folded or unfolded positions. 15. A glasses frame as claimed in any one of claims 1 to 14 wherein said glasses frame can lock or be retained in either or both said folded and said unfolded positions. 16. A glasses frame as claimed in claim 15 wherein said lock or retention is at least in part achieved by said at least one hinge. 17. A glasses frame as claimed in any one of claims 1 to 16 wherein at least when in said folded position said lenses are substantially covered, for example to prevent them becoming contaminated or scratched. 18. A glasses frame as claimed in any one of claims 1 to 17 wherein there are two said hinges. 19. A glasses frame as claimed in any one of claims 1 to 18 wherein said hinge has two hinge axes distal from each other and connected therebetween by a hinge portion. 20. A glasses frame as claimed in claim 19 wherein said hinge axes are parallel to each other and line parallel to said major surface. 21. A glasses frame as claimed in claim 18 wherein each of said two hinges is located either side of a nose piece that is intermediate each of said lens holding portions. 22. A glasses frame as claimed in any one of claims 1 to 21 wherein each said arm portion is selectively detachable from their respective said lens holding portion. 23. A glasses frame as claimed in any one of claims 1 to 22 wherein said lenses are selected from any one or more of
prescription lenses,
sunglass lenses, and
protective lenses. 24. A glasses frame as claimed in any one of claims 1 to 23 wherein said elongate object is a part of a user's body, for example an arm, wrist or leg. 25. A glasses frame as claimed in any one of claims 1 to 23 wherein said elongate object is a strap, handle or similar. 26. A glasses frame as claimed in any one of claims 1 to 25 wherein said arms angle or curve inwardly toward each other when in the unfolded position. 27. A glasses frame, comprising or including,
A first lens holding portion and a second lens holding position located either side of at least one hinge therebetween, A first arm extending from said first lens holding portion at a location distal from said hinge, A second arm extending from said second lens holding portion at a location distal from said hinge, Said glasses frame having, a first position whereby said lens holding portions and said arms are extended to enable location of said glasses frame on an users head, and a folded position whereby said lens holding portions are rotated to locate adjacent one another, and said arms can curl to thereby hold said glasses frame to an elongate object. 28. A glasses frame as claimed in claim 28 wherein said lens holding portions and said arms in act in conjunction to hold said glasses frame to said elongate object. 29. A method of use of a glasses frame, comprising or including the steps of,
Folding a first lens holding portion and a second lens holding portion about a hinge therebetween such that said lens holding portions lie adjacent one another, Folding a first arm, extending from said first lens holding portion and a second arm extending from said second lens holding portion, Allowing said folded first arm and said folded second arm to wrap or otherwise locate about an elongate object, And vice versa, Such that said glasses frame can be stored in a folded position on said elongate object, and then unfolded for use. 30. A glasses frame as described herein with reference to any one or more of the accompanying drawings. 31. A method of use of a glasses frame as described herein with reference to any one or more of the accompanying drawings. | The invention is for a glasses frame to lenses for a user's eye. The frame has a first and second lens holding portions adapted to each hold a lens, the portions having at least one hinge between them. A first arm extends from the first lens holding portion on an edge thereof distal from the hinge, and a second arm extends from the second lens holding portion on another edge thereof distal from the hinge. The glasses frame has an unfolded position whereby the first and second lens holding portions are extended on said hinge to enable location of the lenses in front of each eye and the arms extend backward from the frame to engage with a head of the user, and a folded position whereby the first and second lens holding portions are contracted about the hinge to lie toward or adjacent each other and the arms fold such that a free end of each folds towards the hinge to thereby capture and retain the glasses frame to an elongate object.1. A glasses frame adapted to hold at least a pair of lenses, one each for an eye of a user, comprising or including,
A first lens holding portion and a second lens holding portion adapted to each hold a said lens, having at least one hinge therebetween, A first arm extending from said first lens holding portion on an edge thereof distal from said hinge, and a second arm extending from said second lens holding portion on an edge thereof distal from said hinge, Wherein said glasses frame has an unfolded position whereby said first lens holding portion and said second lens holding portion are extended on said hinge to enable location of said lenses in front of each said eye and said arms extend backward from said frame to engage with a head of said user, and a folded position whereby said first lens holding portion and said second lens holding portion are contracted about said hinge to lie toward or adjacent each other and said arms fold such that a free end of each folds towards said hinge to thereby enable capture and retention of said glasses frame to an elongate object. 2. A glasses frame as claimed in claim 1 wherein an axis of movement of said at least one hinge is substantially perpendicular to a major surface of said first and second lens holding portions when in said unfolded position. 3. A glasses frame as claimed in claim 1 wherein an axis of movement of said at least one hinge is substantially parallel to a major surface of said first and second lens holding portions when in said unfolded position. 4. A glasses frame as claimed in any one of claims 1 to 3 wherein said first lens holding portion and said second lens holding portion when in said folded position lie side by side each other. 5. A glasses frame as claimed in any one of claims 1 to 3 wherein said first lens holding portion and said second lens holding portion when in said folded position lie substantially one on top of each other. 6. A glasses frame as claimed in any one of claims 1 to 5 wherein said first and said second arm extend substantially parallel to each other at least when in said unfolded position. 7. A glasses frame as claimed in any one of claims 1 to 6 wherein said arms at least in part comprise a bi-stable material that extends for said unfolded position, and that folds or wraps for said folded position. 8. A glasses frame as claimed in claim 7 wherein said bi-stable material is a plastics, composites or metal material. 9. A glasses frame as claimed in either of claim 7 or 8 wherein said bi-stable material is coated with a soft or rubber like material. 10. A glasses frame as claimed in any one of claims 1 to 9 wherein each said lens holding portion extends substantially all the way about each said lens. 11. A glasses frame as claimed in any one of claims 1 to 10 wherein each said lens holding portion extends only part way around each said lens. 12. A glasses frame as claimed in any one of claims 1 to 11 wherein each said lens holding portion is a unitary part. 13. A glasses frame as claimed in any one of claims 1 to 11 wherein each said lens holding portion is comprised of multiple parts. 14. A glasses frame as claimed in any one of claims 1 to 13 wherein said at least one hinge is at least in part biased to either or both said folded or unfolded positions. 15. A glasses frame as claimed in any one of claims 1 to 14 wherein said glasses frame can lock or be retained in either or both said folded and said unfolded positions. 16. A glasses frame as claimed in claim 15 wherein said lock or retention is at least in part achieved by said at least one hinge. 17. A glasses frame as claimed in any one of claims 1 to 16 wherein at least when in said folded position said lenses are substantially covered, for example to prevent them becoming contaminated or scratched. 18. A glasses frame as claimed in any one of claims 1 to 17 wherein there are two said hinges. 19. A glasses frame as claimed in any one of claims 1 to 18 wherein said hinge has two hinge axes distal from each other and connected therebetween by a hinge portion. 20. A glasses frame as claimed in claim 19 wherein said hinge axes are parallel to each other and line parallel to said major surface. 21. A glasses frame as claimed in claim 18 wherein each of said two hinges is located either side of a nose piece that is intermediate each of said lens holding portions. 22. A glasses frame as claimed in any one of claims 1 to 21 wherein each said arm portion is selectively detachable from their respective said lens holding portion. 23. A glasses frame as claimed in any one of claims 1 to 22 wherein said lenses are selected from any one or more of
prescription lenses,
sunglass lenses, and
protective lenses. 24. A glasses frame as claimed in any one of claims 1 to 23 wherein said elongate object is a part of a user's body, for example an arm, wrist or leg. 25. A glasses frame as claimed in any one of claims 1 to 23 wherein said elongate object is a strap, handle or similar. 26. A glasses frame as claimed in any one of claims 1 to 25 wherein said arms angle or curve inwardly toward each other when in the unfolded position. 27. A glasses frame, comprising or including,
A first lens holding portion and a second lens holding position located either side of at least one hinge therebetween, A first arm extending from said first lens holding portion at a location distal from said hinge, A second arm extending from said second lens holding portion at a location distal from said hinge, Said glasses frame having, a first position whereby said lens holding portions and said arms are extended to enable location of said glasses frame on an users head, and a folded position whereby said lens holding portions are rotated to locate adjacent one another, and said arms can curl to thereby hold said glasses frame to an elongate object. 28. A glasses frame as claimed in claim 28 wherein said lens holding portions and said arms in act in conjunction to hold said glasses frame to said elongate object. 29. A method of use of a glasses frame, comprising or including the steps of,
Folding a first lens holding portion and a second lens holding portion about a hinge therebetween such that said lens holding portions lie adjacent one another, Folding a first arm, extending from said first lens holding portion and a second arm extending from said second lens holding portion, Allowing said folded first arm and said folded second arm to wrap or otherwise locate about an elongate object, And vice versa, Such that said glasses frame can be stored in a folded position on said elongate object, and then unfolded for use. 30. A glasses frame as described herein with reference to any one or more of the accompanying drawings. 31. A method of use of a glasses frame as described herein with reference to any one or more of the accompanying drawings. | 2,800 |
11,790 | 11,790 | 15,794,198 | 2,881 | A multi-layer multi-leaf collimation system includes at least a two layers of collimation leaves. The first multi-leaf collimator layer is configured to primarily perform a first function to affect a radiation beam traveling from a radiation source to a target and a second multi-leaf collimator layer is configured to primarily perform a second function, different from the first function, to affect the radiation beam for the administration of a treatment plan. | 1. An apparatus for radiation modulation in radiation therapy comprising:
a first multi-leaf collimator layer configured to primarily perform a first function o affect a radiation beam traveling from a radiation source to a target; and a second multi-leaf collimator layer configured to primarily perform a second function, different from the first function, to affect the radiation beam; wherein the second multi-leaf collimator layer has a higher maximum speed constraint relative to the first multi-leaf collimator layer. 2. The apparatus of claim 1 wherein the first function comprises shaping the radiation beam. 3. The apparatus of claim 2 wherein shaping the radiation beam comprises forming a first aperture according to a profile of a target area of a treatment plan to block out radiation outside of the target area. 4. The apparatus of claim 1 wherein the second function comprises modulating a fluence distribution of the radiation beam. 5. The apparatus of claim 4 wherein modulating the fluence distribution comprises modulating a second aperture to vary radiation intensities in different regions within a target area according to a treatment plan. 6. The apparatus of claim 1 wherein the first multi-leaf collimator layer substantially differs from the second multi-leaf collimator layer in one or more of leaf transmission, penumbra width, maximum leaf speed, and median leaf width. 7. The apparatus of claim 1 wherein the first multi-leaf collimator layer comprises leaves with widths between 2 mm and 2 cm and the second multi-leaf collimator layer comprises leaves with widths between 5 mm and 5 cm. 8. An apparatus for radiation modulation in intensity modulated radiation treatment comprising:
a first multi-leaf collimator layer comprising a first set of leaves configured to affect a radiation beam traveling from a radiation source to a target; and a second multi-leaf collimator layer comprising a second set of leaves configured to affect the radiation beam along with the first multi-leaf collimator layer, wherein a median width of the second set of leaves is substantially larger than a median width of the first set of leaves; and wherein the second multi-leaf collimator layer has a higher maximum speed constraint relative to the first multi-leaf collimator layer. 9. The apparatus of claim 8 wherein the median width of the first set of leaves is between 2 mm to 2 cm. 10. The apparatus of claim 8 wherein the median width of the second set of leaves is between 5 mm to 5 cm. 11. The apparatus of claim 8 wherein the first multi-leaf collimator layer is configured to primarily perform a first function and the second multi-leaf collimator layer is configured to primarily perform a second function, different from the first function, to affect the radiation beam. 12. The apparatus of claim 11 wherein the first function comprises shaping the radiation beam to conform to a target area. 13. The apparatus of claim 11 wherein the second function comprises modulating a fluence distribution of the radiation beam. 14. The apparatus of claim 8 wherein the first multi-leaf collimator layer substantially differs from the second multi-leaf collimator layer in one or more of leaf transmission, penumbra width, and maximum leaf speed. 15. A method for radiation modulation in radiation therapy comprising:
controlling a first multi-leaf collimator layer that comprises a part of a discrete multi-leaf collimator to primarily perform a first function, according to a first maximum speed constraint, to affect a radiation beam traveling from a radiation source to a target; and controlling a second multi-leaf collimator layer that also comprises an integral part of the discrete multi-leaf collimator to primarily perform a second function, different from the first function, to affect the radiation beam according to a second maximum speed constraint higher than the first maximum speed constraint. 16. The method of claim 15 wherein the first function comprises shaping the radiation beam to conform to a target area. 17. The method of claim 15 wherein controlling the first multi-leaf collimator layer comprises forming a first aperture according to a profile of a target area of a treatment plan to block out radiation outside of the target area. 18. The method of claim 15 wherein the second function comprises modulating a fluence distribution of the radiation beam. 19. The method of claim 15 wherein controlling the second multi-leaf collimator layer comprises modulating a second aperture to vary radiation intensities in different regions within a target area according to a treatment plan. 20. The method of claim 15 wherein the first multi-leaf collimator layer substantially differs from the second multi-leaf collimator layer in one or more of leaf transmission, penumbra width, maximum leaf speed, and median leaf width. 21. The apparatus of claim 1, wherein a movement of the first multi-leaf collimator layer is controlled to perform the first function according to the first maximum speed constraint of the first multi-leaf collimator layer, and a movement of the second multi-leaf collimator layer is controlled to perform the second function according to the second maximum speed constraint of the second multi-leaf collimator layer. | A multi-layer multi-leaf collimation system includes at least a two layers of collimation leaves. The first multi-leaf collimator layer is configured to primarily perform a first function to affect a radiation beam traveling from a radiation source to a target and a second multi-leaf collimator layer is configured to primarily perform a second function, different from the first function, to affect the radiation beam for the administration of a treatment plan.1. An apparatus for radiation modulation in radiation therapy comprising:
a first multi-leaf collimator layer configured to primarily perform a first function o affect a radiation beam traveling from a radiation source to a target; and a second multi-leaf collimator layer configured to primarily perform a second function, different from the first function, to affect the radiation beam; wherein the second multi-leaf collimator layer has a higher maximum speed constraint relative to the first multi-leaf collimator layer. 2. The apparatus of claim 1 wherein the first function comprises shaping the radiation beam. 3. The apparatus of claim 2 wherein shaping the radiation beam comprises forming a first aperture according to a profile of a target area of a treatment plan to block out radiation outside of the target area. 4. The apparatus of claim 1 wherein the second function comprises modulating a fluence distribution of the radiation beam. 5. The apparatus of claim 4 wherein modulating the fluence distribution comprises modulating a second aperture to vary radiation intensities in different regions within a target area according to a treatment plan. 6. The apparatus of claim 1 wherein the first multi-leaf collimator layer substantially differs from the second multi-leaf collimator layer in one or more of leaf transmission, penumbra width, maximum leaf speed, and median leaf width. 7. The apparatus of claim 1 wherein the first multi-leaf collimator layer comprises leaves with widths between 2 mm and 2 cm and the second multi-leaf collimator layer comprises leaves with widths between 5 mm and 5 cm. 8. An apparatus for radiation modulation in intensity modulated radiation treatment comprising:
a first multi-leaf collimator layer comprising a first set of leaves configured to affect a radiation beam traveling from a radiation source to a target; and a second multi-leaf collimator layer comprising a second set of leaves configured to affect the radiation beam along with the first multi-leaf collimator layer, wherein a median width of the second set of leaves is substantially larger than a median width of the first set of leaves; and wherein the second multi-leaf collimator layer has a higher maximum speed constraint relative to the first multi-leaf collimator layer. 9. The apparatus of claim 8 wherein the median width of the first set of leaves is between 2 mm to 2 cm. 10. The apparatus of claim 8 wherein the median width of the second set of leaves is between 5 mm to 5 cm. 11. The apparatus of claim 8 wherein the first multi-leaf collimator layer is configured to primarily perform a first function and the second multi-leaf collimator layer is configured to primarily perform a second function, different from the first function, to affect the radiation beam. 12. The apparatus of claim 11 wherein the first function comprises shaping the radiation beam to conform to a target area. 13. The apparatus of claim 11 wherein the second function comprises modulating a fluence distribution of the radiation beam. 14. The apparatus of claim 8 wherein the first multi-leaf collimator layer substantially differs from the second multi-leaf collimator layer in one or more of leaf transmission, penumbra width, and maximum leaf speed. 15. A method for radiation modulation in radiation therapy comprising:
controlling a first multi-leaf collimator layer that comprises a part of a discrete multi-leaf collimator to primarily perform a first function, according to a first maximum speed constraint, to affect a radiation beam traveling from a radiation source to a target; and controlling a second multi-leaf collimator layer that also comprises an integral part of the discrete multi-leaf collimator to primarily perform a second function, different from the first function, to affect the radiation beam according to a second maximum speed constraint higher than the first maximum speed constraint. 16. The method of claim 15 wherein the first function comprises shaping the radiation beam to conform to a target area. 17. The method of claim 15 wherein controlling the first multi-leaf collimator layer comprises forming a first aperture according to a profile of a target area of a treatment plan to block out radiation outside of the target area. 18. The method of claim 15 wherein the second function comprises modulating a fluence distribution of the radiation beam. 19. The method of claim 15 wherein controlling the second multi-leaf collimator layer comprises modulating a second aperture to vary radiation intensities in different regions within a target area according to a treatment plan. 20. The method of claim 15 wherein the first multi-leaf collimator layer substantially differs from the second multi-leaf collimator layer in one or more of leaf transmission, penumbra width, maximum leaf speed, and median leaf width. 21. The apparatus of claim 1, wherein a movement of the first multi-leaf collimator layer is controlled to perform the first function according to the first maximum speed constraint of the first multi-leaf collimator layer, and a movement of the second multi-leaf collimator layer is controlled to perform the second function according to the second maximum speed constraint of the second multi-leaf collimator layer. | 2,800 |
11,791 | 11,791 | 15,680,399 | 2,845 | An apparatus for an antenna assembly, which can be used for a mobile application such as on an aircraft, can include a housing defining an interior. A first antenna, such as a WAAS GPS antenna, can mount within the interior to operate at a first frequency. A second antenna, such as an L-band monopole antenna, can mount within the interior of the housing. A trap coupled to the second antenna can be tuned to the first frequency to prevent signal loss caused by the second antenna. | 1. An antenna assembly for an aircraft comprising:
a housing defining an interior and including a bottom forming a ground plane; a WAAS GPS antenna mounted within the interior and operating at a first frequency; an L-band monopole antenna mounted within the interior and extending from the ground plane; and a trap coupled to the L-band monopole antenna and tuned to the first frequency of the WAAS GPS antenna; wherein the trap operates to prevent the L-band monopole antenna from affecting gain and radiation patterns of the WAAS GPS antenna at the first frequency. 2. The antenna assembly of claim 1 wherein the first frequency is about 1575 MHz. 3. The antenna assembly of claim 1 wherein the L-band monopole antenna operates in a frequency range between 1 GHz and 1.2 GHz. 4. The antenna assembly of claim 1 wherein the trap is positioned at a center of a longitudinal length of the L-band monopole antenna. 5. The antenna assembly of claim 4 wherein the trap includes an inductor and a capacitor. 6. The antenna assembly of claim 5 wherein the trap is tuned to about 1575 MHz. 7. The antenna assembly of claim 1 wherein the ground plane is a common ground plane to both the WAAS GPS antenna and the L-band monopole antenna. 8. The antenna assembly of claim 1 wherein the L-band monopole antenna is coated in Silver. 9. The antenna assembly of claim 1 wherein the L-band monopole antenna includes a rod having a decreased diameter, separating the L-band monopole antenna into an upper portion and a lower portion. 10. The antenna assembly of claim 9 wherein the rod forms an inductor for the trap. 11. The antenna assembly of claim 10 wherein a capacitor is provided at the rod, to form the trap with the inductor. 12. The antenna assembly of claim 1 wherein the trap provides for a voltage standing wave ratio of at least 10:1 at about 1575 MHz frequency. 13. An antenna assembly for an aircraft comprising:
a housing defining an interior; a first antenna mounted within the interior and operating at a first frequency; a second antenna mounted within the interior; and a trap coupled to the second antenna and tuned to the first frequency of the first antenna; wherein the trap operates to prevent the second antenna from affecting gain and radiation patterns of the first antenna at the first frequency. 14. The antenna assembly of claim 13 wherein the first frequency is about 1575 MHz. 15. The antenna assembly of claim 13 wherein the second antenna operates in a frequency range between 1 GHz and 1.2 GHz. 16. The antenna assembly of claim 13 wherein the trap includes an inductor and a capacitor. 17. The antenna assembly of claim 13 further comprising a ground plate enclosing the interior, wherein the ground plate is common to both the first antenna and the second antenna. 18. A dual function antenna comprising a WAAS GPS antenna and an L-band monopole antenna coupled to a common ground plate, and including a trap coupled to the L-band monopole antenna to prevent the L-band monopole antenna from affecting gain and radiation patterns of the WAAS GPS antenna. 19. The dual function antenna of claim 18 wherein the WAAS GPS antenna operates a frequency of about 1575 MHz and the trap is tuned to about 1575 MHz. 20. The dual function antenna of claim 18 wherein the L-band monopole antenna can operate as any of a transponder, an ADS-B, or a DME. | An apparatus for an antenna assembly, which can be used for a mobile application such as on an aircraft, can include a housing defining an interior. A first antenna, such as a WAAS GPS antenna, can mount within the interior to operate at a first frequency. A second antenna, such as an L-band monopole antenna, can mount within the interior of the housing. A trap coupled to the second antenna can be tuned to the first frequency to prevent signal loss caused by the second antenna.1. An antenna assembly for an aircraft comprising:
a housing defining an interior and including a bottom forming a ground plane; a WAAS GPS antenna mounted within the interior and operating at a first frequency; an L-band monopole antenna mounted within the interior and extending from the ground plane; and a trap coupled to the L-band monopole antenna and tuned to the first frequency of the WAAS GPS antenna; wherein the trap operates to prevent the L-band monopole antenna from affecting gain and radiation patterns of the WAAS GPS antenna at the first frequency. 2. The antenna assembly of claim 1 wherein the first frequency is about 1575 MHz. 3. The antenna assembly of claim 1 wherein the L-band monopole antenna operates in a frequency range between 1 GHz and 1.2 GHz. 4. The antenna assembly of claim 1 wherein the trap is positioned at a center of a longitudinal length of the L-band monopole antenna. 5. The antenna assembly of claim 4 wherein the trap includes an inductor and a capacitor. 6. The antenna assembly of claim 5 wherein the trap is tuned to about 1575 MHz. 7. The antenna assembly of claim 1 wherein the ground plane is a common ground plane to both the WAAS GPS antenna and the L-band monopole antenna. 8. The antenna assembly of claim 1 wherein the L-band monopole antenna is coated in Silver. 9. The antenna assembly of claim 1 wherein the L-band monopole antenna includes a rod having a decreased diameter, separating the L-band monopole antenna into an upper portion and a lower portion. 10. The antenna assembly of claim 9 wherein the rod forms an inductor for the trap. 11. The antenna assembly of claim 10 wherein a capacitor is provided at the rod, to form the trap with the inductor. 12. The antenna assembly of claim 1 wherein the trap provides for a voltage standing wave ratio of at least 10:1 at about 1575 MHz frequency. 13. An antenna assembly for an aircraft comprising:
a housing defining an interior; a first antenna mounted within the interior and operating at a first frequency; a second antenna mounted within the interior; and a trap coupled to the second antenna and tuned to the first frequency of the first antenna; wherein the trap operates to prevent the second antenna from affecting gain and radiation patterns of the first antenna at the first frequency. 14. The antenna assembly of claim 13 wherein the first frequency is about 1575 MHz. 15. The antenna assembly of claim 13 wherein the second antenna operates in a frequency range between 1 GHz and 1.2 GHz. 16. The antenna assembly of claim 13 wherein the trap includes an inductor and a capacitor. 17. The antenna assembly of claim 13 further comprising a ground plate enclosing the interior, wherein the ground plate is common to both the first antenna and the second antenna. 18. A dual function antenna comprising a WAAS GPS antenna and an L-band monopole antenna coupled to a common ground plate, and including a trap coupled to the L-band monopole antenna to prevent the L-band monopole antenna from affecting gain and radiation patterns of the WAAS GPS antenna. 19. The dual function antenna of claim 18 wherein the WAAS GPS antenna operates a frequency of about 1575 MHz and the trap is tuned to about 1575 MHz. 20. The dual function antenna of claim 18 wherein the L-band monopole antenna can operate as any of a transponder, an ADS-B, or a DME. | 2,800 |
11,792 | 11,792 | 15,572,703 | 2,875 | The present invention provides a light emitting diode(s), LED, light strip arranged for providing improved color consistency over its length. The LED light strip comprises LED strings positioned along the length of the LED light strip and powered in parallel, for emitting, for example, red, green, blue and white light. The resistance of the supply and return traces, in combination with variations in the current drawn by or the forward voltage of the various LED and resistors used in the LED strings of different color, causes a voltage drop along these traces leading to inconsistent color rendering. By adjusting the resistivity of the traces, such as through providing return paths having different resistances for LED strings of different color, the consistency of the color rendering can be improved. | 1. A light emitting diode(s), LED, light strip comprising:
a first plurality of LED strings positioned along a length of the LED strip and arranged for being powered in parallel through a first supply path and a first return path, each LED string of the first plurality of LED strings comprising at least one LED of a first type of LED and at least one resistive component of a first type, a second plurality of LED strings positioned along the length of the LED strip and further arranged for being powered in parallel through a second supply path and a second return path, each LED string of the second plurality of LED strings comprising at least one LED of a second type of LED different from the first type of LED, and at least one resistive component of a second type, at least three electrical conductors positioned along the length of the LED strip, wherein a first set of at least two electrical conductors of the at least three electrical conductors are arranged to provide the first supply path and the first return path for the first plurality of LED strings, and a second set of at least two electrical conductors of the at least three electrical conductors are arranged to provide the second supply path and the second return path for the second plurality of LED strings and wherein the three electrical conductors are arranged such that the resistance of the combined supply path and return path of a LED string of the first plurality of LED strings is different from the resistance of the combined supply path and return path of a LED string of the second plurality of LED strings characterized in that the first plurality of LED strings and the second plurality of LED strings have different electrical characteristics in at least one of a forward voltage of the LED comprised in the LED string and a drive current of the LED string; and wherein the first plurality of LED strings comprise a LED type with a higher forward voltage than the LED type comprised in the second plurality of LED strings, and wherein the resistance of the combined supply path and return path of a LED string of the first plurality of LED strings is less than the resistance of the combined supply path and return path of a LED string of the second plurality of LED strings; or wherein the first plurality of LED strings has a higher drive current than the second plurality of LED strings, and wherein the resistance of the combined supply path and return path of a LED string of the first plurality of LED strings is greater than the resistance of the combined supply path and return path of a LED string of the second plurality of LED strings. 2. The LED light strip according to claim 1, wherein the at least three electrical conductors are of the same material, and wherein the cross section area of at least one the at least three electrical conductors is different from the other electrical conductor(s) of the at least three electrical conductors. 3. The LED light strip according to claim 2, wherein the three electrical conductors are traces on a printed circuit board, preferably a flexible printed circuit board, and the width of at least one the at least three electrical conductors is different from the other electrical conductor(s) of the at least three electrical conductors. 4. The LED light strip according to claim 3, wherein the width of each electrical conductor of the at least three electrical conductors remains the same along the length of the LED light strip. 5. The LED light strip according to claim 1, wherein a first electrical conductor of the at least three electrical conductors is both the first supply path as well as the second supply path, or alternatively the first return path as well as the second return path. 6. (canceled) 7. (canceled) 8. The LED light strip according to claim 1, wherein the first type of LED is arranged for emitting a first color of light and the second type of LED is arranged for emitting a second color of light, different from the first color of light. 9. The LED light strip according to claim 8, wherein the first type of LED is arranged for emitting white light, and wherein the first type of LED, when the LED light strip is powered, draws more current than the second type of LED. 10. The LED strip according to claim 8, wherein the first type of LED is arranged for emitting red light, and wherein the first type of LED, when the LED light strip is powered, has a lower forward voltage than the second type of LED. 11. A system comprising a LED light strip according to claim 1, and further comprising a driver for powering the LED light strip. 12. A method of manufacturing a LED light strip, the method comprising:
printing at least three traces on a circuit board, the at least three traces arranged for providing at least three electrical conductors positioned along the length of the LED strip, populating the circuit board with a least
a first plurality of LED strings positioned along a length of the LED strip and arranged for being powered in parallel through a first supply path and a first return path, each LED string of the first plurality of LED strings comprising at least one LED of a first type and at least one resistive component of a first type,
a second plurality of LED strings positioned along the length of the LED strip and further arranged for being powered in parallel through a second supply path and a second return path, each LED string of the second plurality of LED strings comprising at least one LED of a second type, different from the first type of LED, and at least one resistive component of a second type,
wherein a first set of at least two electrical conductors of the at least three electrical conductors are arranged to provide the first supply path and the first return path for the first plurality of LED strings, and a second set of at least two electrical conductors of the at least three electrical conductors are arranged to provide the second supply path and the second return path for the second plurality of LED strings; and wherein the three electrical conductors are arranged such that the resistance of the combined supply path and return path of a LED string of the first plurality of LED strings is different from the resistance of the combined supply path and return path of a LED string of the second plurality of LED strings; characterized in that the LED of a first type and the LED of a second type have different electrical characteristics in at least one of a forward voltage of the LED and a drive current of the LED; and wherein the first plurality of LED strings comprise a LED type with a higher forward voltage than the LED type comprised in the second plurality of LED strings, and wherein the resistance of the combined supply path and return path of a LED string of the first plurality of LED strings is less than the resistance of the combined supply path and return path of a LED string of the second plurality of LED strings; or wherein the first plurality of LED strings has a higher drive current than the second plurality of LED strings, and wherein the resistance of the combined supply path and return path of a LED string of the first plurality of LED strings is greater than the resistance of the combined supply path and return path of a LED string of the second plurality of LED strings. 13. The method of manufacturing a LED light strip according to claim 12, wherein the three electrical conductors are of the same material, and wherein the dimensions, preferably the width, of each of the at least three electrical conductors is adapted such that the resistance of each of the at least three electrical conductors relative to the other of the at least three electrical conductors provides that the voltage drop over the first set of at least two electrical conductors matches the voltage drop over the second set of at least two electrical conductors. | The present invention provides a light emitting diode(s), LED, light strip arranged for providing improved color consistency over its length. The LED light strip comprises LED strings positioned along the length of the LED light strip and powered in parallel, for emitting, for example, red, green, blue and white light. The resistance of the supply and return traces, in combination with variations in the current drawn by or the forward voltage of the various LED and resistors used in the LED strings of different color, causes a voltage drop along these traces leading to inconsistent color rendering. By adjusting the resistivity of the traces, such as through providing return paths having different resistances for LED strings of different color, the consistency of the color rendering can be improved.1. A light emitting diode(s), LED, light strip comprising:
a first plurality of LED strings positioned along a length of the LED strip and arranged for being powered in parallel through a first supply path and a first return path, each LED string of the first plurality of LED strings comprising at least one LED of a first type of LED and at least one resistive component of a first type, a second plurality of LED strings positioned along the length of the LED strip and further arranged for being powered in parallel through a second supply path and a second return path, each LED string of the second plurality of LED strings comprising at least one LED of a second type of LED different from the first type of LED, and at least one resistive component of a second type, at least three electrical conductors positioned along the length of the LED strip, wherein a first set of at least two electrical conductors of the at least three electrical conductors are arranged to provide the first supply path and the first return path for the first plurality of LED strings, and a second set of at least two electrical conductors of the at least three electrical conductors are arranged to provide the second supply path and the second return path for the second plurality of LED strings and wherein the three electrical conductors are arranged such that the resistance of the combined supply path and return path of a LED string of the first plurality of LED strings is different from the resistance of the combined supply path and return path of a LED string of the second plurality of LED strings characterized in that the first plurality of LED strings and the second plurality of LED strings have different electrical characteristics in at least one of a forward voltage of the LED comprised in the LED string and a drive current of the LED string; and wherein the first plurality of LED strings comprise a LED type with a higher forward voltage than the LED type comprised in the second plurality of LED strings, and wherein the resistance of the combined supply path and return path of a LED string of the first plurality of LED strings is less than the resistance of the combined supply path and return path of a LED string of the second plurality of LED strings; or wherein the first plurality of LED strings has a higher drive current than the second plurality of LED strings, and wherein the resistance of the combined supply path and return path of a LED string of the first plurality of LED strings is greater than the resistance of the combined supply path and return path of a LED string of the second plurality of LED strings. 2. The LED light strip according to claim 1, wherein the at least three electrical conductors are of the same material, and wherein the cross section area of at least one the at least three electrical conductors is different from the other electrical conductor(s) of the at least three electrical conductors. 3. The LED light strip according to claim 2, wherein the three electrical conductors are traces on a printed circuit board, preferably a flexible printed circuit board, and the width of at least one the at least three electrical conductors is different from the other electrical conductor(s) of the at least three electrical conductors. 4. The LED light strip according to claim 3, wherein the width of each electrical conductor of the at least three electrical conductors remains the same along the length of the LED light strip. 5. The LED light strip according to claim 1, wherein a first electrical conductor of the at least three electrical conductors is both the first supply path as well as the second supply path, or alternatively the first return path as well as the second return path. 6. (canceled) 7. (canceled) 8. The LED light strip according to claim 1, wherein the first type of LED is arranged for emitting a first color of light and the second type of LED is arranged for emitting a second color of light, different from the first color of light. 9. The LED light strip according to claim 8, wherein the first type of LED is arranged for emitting white light, and wherein the first type of LED, when the LED light strip is powered, draws more current than the second type of LED. 10. The LED strip according to claim 8, wherein the first type of LED is arranged for emitting red light, and wherein the first type of LED, when the LED light strip is powered, has a lower forward voltage than the second type of LED. 11. A system comprising a LED light strip according to claim 1, and further comprising a driver for powering the LED light strip. 12. A method of manufacturing a LED light strip, the method comprising:
printing at least three traces on a circuit board, the at least three traces arranged for providing at least three electrical conductors positioned along the length of the LED strip, populating the circuit board with a least
a first plurality of LED strings positioned along a length of the LED strip and arranged for being powered in parallel through a first supply path and a first return path, each LED string of the first plurality of LED strings comprising at least one LED of a first type and at least one resistive component of a first type,
a second plurality of LED strings positioned along the length of the LED strip and further arranged for being powered in parallel through a second supply path and a second return path, each LED string of the second plurality of LED strings comprising at least one LED of a second type, different from the first type of LED, and at least one resistive component of a second type,
wherein a first set of at least two electrical conductors of the at least three electrical conductors are arranged to provide the first supply path and the first return path for the first plurality of LED strings, and a second set of at least two electrical conductors of the at least three electrical conductors are arranged to provide the second supply path and the second return path for the second plurality of LED strings; and wherein the three electrical conductors are arranged such that the resistance of the combined supply path and return path of a LED string of the first plurality of LED strings is different from the resistance of the combined supply path and return path of a LED string of the second plurality of LED strings; characterized in that the LED of a first type and the LED of a second type have different electrical characteristics in at least one of a forward voltage of the LED and a drive current of the LED; and wherein the first plurality of LED strings comprise a LED type with a higher forward voltage than the LED type comprised in the second plurality of LED strings, and wherein the resistance of the combined supply path and return path of a LED string of the first plurality of LED strings is less than the resistance of the combined supply path and return path of a LED string of the second plurality of LED strings; or wherein the first plurality of LED strings has a higher drive current than the second plurality of LED strings, and wherein the resistance of the combined supply path and return path of a LED string of the first plurality of LED strings is greater than the resistance of the combined supply path and return path of a LED string of the second plurality of LED strings. 13. The method of manufacturing a LED light strip according to claim 12, wherein the three electrical conductors are of the same material, and wherein the dimensions, preferably the width, of each of the at least three electrical conductors is adapted such that the resistance of each of the at least three electrical conductors relative to the other of the at least three electrical conductors provides that the voltage drop over the first set of at least two electrical conductors matches the voltage drop over the second set of at least two electrical conductors. | 2,800 |
11,793 | 11,793 | 15,339,040 | 2,841 | An electronic device is provided that includes a display unit, a memory storing program instructions, a processor to execute the program instructions in connection with operating the electronic device, and a main body unit housing the memory and processor. The display unit is rotatably mounted to the main body unit. The main body unit has a sidewall divided into first and second sidewall segments that are moved relative to one another corresponding to the main body unit being shifted between active and storage states. An interface component is mounted within the sidewall of the main body unit. The interface component includes members spaced apart from one another by gaps. The members are moved relative to one another between an operative position corresponding to the main body unit in the active state and a collapsed position corresponding to the main body unit in the storage state. | 1. An electronic device comprising:
a display unit; memory storing program instructions; a processor to execute the program instructions in connection with operating the electronic device; a main body unit housing the memory and processor, the display unit rotatably mounted to the main body unit, the main body unit having a sidewall divided into first and second sidewall segments that are moved relative to one another in connection with the main body unit being shifted between active and storage states; and an interface component mounted within the sidewall of the main body unit, the interface component including members spaced apart from one another by gaps, the members being moved relative to one another between an operative position and a collapsed position, the operative position corresponding to the active state, the collapsed position corresponding to the storage state. 2. The electronic device of claim 1, wherein the interface component represents an electrical connector that is divided into first and second shells that mate with one another, the members on the first shell align with corresponding members on the second shell when in the operative position, the members on the first shell being offset to fit between the members on the second shell when in the collapsed position. 3. The electronic device of claim 1, wherein the members are movable relative to one another between aligned and interleaved arrangements. 4. The electronic device of claim 1, wherein the interface component has a first height corresponding to the operative position, the interface component having a second height corresponding the collapsed position, wherein the second height is less than the first height. 5. The electronic device of claim 1, wherein the interface component represents a ventilation component and the members represent fins within the ventilation component, the fins spaced apart by the gaps at a first orientation in connection with the operative position, the fins collapsing into the gaps in a second orientation in connection with the collapsed position. 6. The electronic device of claim 5, wherein the fins rotate between the first and second orientations. 7. The electronic device of claim 1, wherein the sidewall is movable between first and second heights in connection with the main body unit being movable between the active and storage states. 8. The electronic device of claim 1, wherein the interface component represents an electrical connector divided into first and second shells that are pivotally connected to each other and surround a gap, wherein the members on the first shell align with corresponding members on the second shell in a first orientation in connection with the operative position, the first and second shells collapsing into the gap in a second orientation in connection with the collapsed position. 9. The electronic device of claim 8, wherein the first and second shells pivot between the first and second orientations. 10. The electronic device of claim 1 wherein the interface component has a predetermined standard form factor envelop in the operative position. 11. An electronic device comprising:
a display unit; a main body unit, the display unit rotatably mounted to the main body unit, the main body unit having a sidewall divided into first and second sidewall segments that are movable relative to one another corresponding to the main body unit being movable between active and storage states; and an interface component mounted within the sidewall of the main body unit, wherein the segments move relative to one another such that the sidewall shifts between first and second heights corresponding to the main body unit being movable between the active and storage states. 12. The electronic device of claim 11, wherein the first sidewall segment is nested inside the second sidewall segment when the main body unit is in the storage state. 13. The electronic device of claim 11, wherein the interface component represents a HDMI connector divided into first and second shells that mate with one another, wherein the first and second shells include members, wherein the members on the first shell align with corresponding members on the second shell in an operative position corresponding to the main body unit being in the active state, wherein the members on the first shell being offset to fit between the members on the second shell in a collapsed position corresponding to the main body unit being in the storage state. 14. The electronic device of claim 11, wherein the interface component represents a ventilation component, wherein the ventilation component includes fins, wherein the fins are spaced apart by gaps in a first orientation in connection with the main body unit being in the active state, the fins collapsing into the gaps in a second orientation in connection with the main body unit being in the storage state, wherein the fins rotate between the first and second orientations. 15. The electronic device of claim 11, wherein the interface component represents a USB connector divided into first and second shells that are pivotally connected to each other and surround a gap, wherein the members on the first shell align with corresponding members on the second shell in a first orientation corresponding to the USB connector being in the active state, the first and second shells collapsing into the gap in a second orientation corresponding to the USB connector being in the storage state. 16. A method comprising:
providing an electronic device with a display unit rotatably mounted to a main body unit; positioning the display unit and the main body unit in an operative position, the display unit rotatable from the operative position toward the main body unit to a storage position of the electronic device; and providing a first segment of a sidewall of the main body unit to be movable relative to a second segment of the sidewall of the main body unit to reduce the height of the main body unit. 17. The method of claim 16, comprising providing spaced apart members of an interface component mounted within the sidewall to be movable relative to one another to allow the first and second segments of the sidewall of the main body unit to move relative to each other to reduce the height of the main body unit. 18. The method of claim 16, wherein the first segment is movable, relative to the second segment, to a position inside of the second segment. 19. The method of claim 16, further comprising providing an interface component in the sidewall, wherein the interface component represents an electrical connector divided into first and second shells that are pivotally connected to each other and surround a gap, wherein positioning the display unit and the main body unit in an operative position includes aligning members on the first shell with corresponding members on the second shell, wherein moving the first segment relative to the second segment includes pivoting the first shell relative to the second shell such that the first and second shells collapse into the gap to reduce the height of the main body unit. 20. The method of claim 16, further comprising providing an interface component in the sidewall, wherein the interface component represents a connector divided into first and second shells that mate with one another and surround a gap, wherein positioning the display unit and the main body unit in an operative position for use includes aligning members on the first shell with corresponding members on the second shell, wherein moving the first segment relative to the second segment includes moving the first shell to an offset position relative to the second shell such that the a member of the first shell fits into the gap to reduce the height of the main body unit. | An electronic device is provided that includes a display unit, a memory storing program instructions, a processor to execute the program instructions in connection with operating the electronic device, and a main body unit housing the memory and processor. The display unit is rotatably mounted to the main body unit. The main body unit has a sidewall divided into first and second sidewall segments that are moved relative to one another corresponding to the main body unit being shifted between active and storage states. An interface component is mounted within the sidewall of the main body unit. The interface component includes members spaced apart from one another by gaps. The members are moved relative to one another between an operative position corresponding to the main body unit in the active state and a collapsed position corresponding to the main body unit in the storage state.1. An electronic device comprising:
a display unit; memory storing program instructions; a processor to execute the program instructions in connection with operating the electronic device; a main body unit housing the memory and processor, the display unit rotatably mounted to the main body unit, the main body unit having a sidewall divided into first and second sidewall segments that are moved relative to one another in connection with the main body unit being shifted between active and storage states; and an interface component mounted within the sidewall of the main body unit, the interface component including members spaced apart from one another by gaps, the members being moved relative to one another between an operative position and a collapsed position, the operative position corresponding to the active state, the collapsed position corresponding to the storage state. 2. The electronic device of claim 1, wherein the interface component represents an electrical connector that is divided into first and second shells that mate with one another, the members on the first shell align with corresponding members on the second shell when in the operative position, the members on the first shell being offset to fit between the members on the second shell when in the collapsed position. 3. The electronic device of claim 1, wherein the members are movable relative to one another between aligned and interleaved arrangements. 4. The electronic device of claim 1, wherein the interface component has a first height corresponding to the operative position, the interface component having a second height corresponding the collapsed position, wherein the second height is less than the first height. 5. The electronic device of claim 1, wherein the interface component represents a ventilation component and the members represent fins within the ventilation component, the fins spaced apart by the gaps at a first orientation in connection with the operative position, the fins collapsing into the gaps in a second orientation in connection with the collapsed position. 6. The electronic device of claim 5, wherein the fins rotate between the first and second orientations. 7. The electronic device of claim 1, wherein the sidewall is movable between first and second heights in connection with the main body unit being movable between the active and storage states. 8. The electronic device of claim 1, wherein the interface component represents an electrical connector divided into first and second shells that are pivotally connected to each other and surround a gap, wherein the members on the first shell align with corresponding members on the second shell in a first orientation in connection with the operative position, the first and second shells collapsing into the gap in a second orientation in connection with the collapsed position. 9. The electronic device of claim 8, wherein the first and second shells pivot between the first and second orientations. 10. The electronic device of claim 1 wherein the interface component has a predetermined standard form factor envelop in the operative position. 11. An electronic device comprising:
a display unit; a main body unit, the display unit rotatably mounted to the main body unit, the main body unit having a sidewall divided into first and second sidewall segments that are movable relative to one another corresponding to the main body unit being movable between active and storage states; and an interface component mounted within the sidewall of the main body unit, wherein the segments move relative to one another such that the sidewall shifts between first and second heights corresponding to the main body unit being movable between the active and storage states. 12. The electronic device of claim 11, wherein the first sidewall segment is nested inside the second sidewall segment when the main body unit is in the storage state. 13. The electronic device of claim 11, wherein the interface component represents a HDMI connector divided into first and second shells that mate with one another, wherein the first and second shells include members, wherein the members on the first shell align with corresponding members on the second shell in an operative position corresponding to the main body unit being in the active state, wherein the members on the first shell being offset to fit between the members on the second shell in a collapsed position corresponding to the main body unit being in the storage state. 14. The electronic device of claim 11, wherein the interface component represents a ventilation component, wherein the ventilation component includes fins, wherein the fins are spaced apart by gaps in a first orientation in connection with the main body unit being in the active state, the fins collapsing into the gaps in a second orientation in connection with the main body unit being in the storage state, wherein the fins rotate between the first and second orientations. 15. The electronic device of claim 11, wherein the interface component represents a USB connector divided into first and second shells that are pivotally connected to each other and surround a gap, wherein the members on the first shell align with corresponding members on the second shell in a first orientation corresponding to the USB connector being in the active state, the first and second shells collapsing into the gap in a second orientation corresponding to the USB connector being in the storage state. 16. A method comprising:
providing an electronic device with a display unit rotatably mounted to a main body unit; positioning the display unit and the main body unit in an operative position, the display unit rotatable from the operative position toward the main body unit to a storage position of the electronic device; and providing a first segment of a sidewall of the main body unit to be movable relative to a second segment of the sidewall of the main body unit to reduce the height of the main body unit. 17. The method of claim 16, comprising providing spaced apart members of an interface component mounted within the sidewall to be movable relative to one another to allow the first and second segments of the sidewall of the main body unit to move relative to each other to reduce the height of the main body unit. 18. The method of claim 16, wherein the first segment is movable, relative to the second segment, to a position inside of the second segment. 19. The method of claim 16, further comprising providing an interface component in the sidewall, wherein the interface component represents an electrical connector divided into first and second shells that are pivotally connected to each other and surround a gap, wherein positioning the display unit and the main body unit in an operative position includes aligning members on the first shell with corresponding members on the second shell, wherein moving the first segment relative to the second segment includes pivoting the first shell relative to the second shell such that the first and second shells collapse into the gap to reduce the height of the main body unit. 20. The method of claim 16, further comprising providing an interface component in the sidewall, wherein the interface component represents a connector divided into first and second shells that mate with one another and surround a gap, wherein positioning the display unit and the main body unit in an operative position for use includes aligning members on the first shell with corresponding members on the second shell, wherein moving the first segment relative to the second segment includes moving the first shell to an offset position relative to the second shell such that the a member of the first shell fits into the gap to reduce the height of the main body unit. | 2,800 |
11,794 | 11,794 | 15,253,978 | 2,832 | A turbine engine is described that includes an intake, an inlet duct configured to receive fluid from the intake, and an outer bypass duct configured to receive fluid from the intake. The turbine engine further includes a drive shaft, a tower shaft mechanically coupled to the drive shaft, and an electric generator mechanically coupled to the tower shaft. The electric generator is located between the inlet duct and the outer bypass duct. | 1. A turbine engine comprising:
an intake; an inlet duct configured to receive fluid from the intake; an outer bypass duct configured to receive fluid from the intake; a drive shaft; a tower shaft mechanically coupled to the drive shaft; and an electric generator mechanically coupled to the tower shaft, wherein the electric generator is located between the inlet duct and the outer bypass duct. 2. The turbine engine of claim 1, further comprising a compressor, wherein the tower shaft passes through the compressor, wherein the compressor is configured to compress fluid traveling through the inlet duct. 3. The turbine engine of claim 2, wherein the compressor is beneath the outer bypass duct, wherein the electric generator is located between the compressor and the outer bypass duct. 4. The turbine engine of claim 1, wherein the outer bypass duct comprises a bleed configured to provide cooling to the electric generator. 5. The turbine engine of claim 1, wherein the drive shaft comprises a low-pressure shaft. 6. The turbine engine of claim 1, wherein the tower shaft is mechanically coupled to the drive shaft by a gearbox. 7. The turbine engine of claim 1, further comprising a fuel jacket configured to absorb heat from the electric generator. 8. The turbine engine of claim 1, wherein the electric generator comprises:
a first component comprising a magnet, wherein the first component is coupled to the tower shaft; and a second component comprising a winding, wherein the second component is coupled to the compressor. 9. The turbine engine of claim 1, wherein the electric generator is mechanically coupled to the tower shaft by a gearbox. 10. The turbine engine of claim 1, wherein the electric generator is configured to deliver electricity to a fuel pump or a hydraulic pump. 11. A method comprising:
receiving, at an electric generator located between an inlet duct and an outer bypass duct of a turbine engine, via a tower shaft mechanically coupled to a drive shaft of the turbine engine, mechanical power; generating, based on the mechanical power received from the tower shaft, electrical power; outputting the electrical power to an electrical load. 12. The method of claim 11, further comprising:
receiving fluid from the outer bypass duct to cool the electric generator; and transferring heat from the electric generator to the fluid from the outer bypass duct. 13. The method of claim 1, further comprising:
receiving fuel in a fuel jacket; and transferring heat from the electric generator to the fuel in the fuel jacket. 14. The method of claim 11, wherein receiving mechanical power via the tower shaft comprises receiving mechanical power at the electric generator via a gearbox mechanically coupled to the tower shaft. 15. An electric generator module comprising:
a mechanical input configured to:
connect to a tower shaft that is mechanically coupled to a drive shaft of a turbine engine, wherein the tower shaft protrudes through a cavity of the turbine engine located between an inlet duct of the turbine engine and an outer bypass duct of the turbine engine, and
receive mechanical power from the tower shaft;
a power generation component configured to produce electrical power from mechanical power received by the mechanical input; and an electrical output configured to output the electrical power produced by the power generation component to an electrical load. 16. The electric generator module of claim 15, wherein the power generation component comprises:
a first component comprising a magnet, wherein the first component is configured to mechanically couple to the tower shaft; and a second component comprising a winding, wherein the second component is configured to mechanically couple to a compressor of the turbine engine. 17. The electric generator module of claim 15, further comprising a first heat exchanger configured to transfer heat from the electric generator module to fuel in a fuel jacket. 18. The electric generator module of claim 15, further comprising a second heat exchanger configured to transfer heat from the electric generator module to fluid from the outer bypass duct. 19. The electric generator module of claim 15, wherein:
the first component is configured to mechanically couple to the tower shaft by at least a gearbox; the first component is configured to rotate; and the second component is configured to not rotate. 20. The electric generator module of claim 15, wherein:
the tower shaft is configured to pass through a compressor; the compressor is configured to compress fluid traveling through the inlet duct; the compressor is configured to be positioned beneath the outer bypass duct; and the electric generator module is located between the compressor and the outer bypass duct. | A turbine engine is described that includes an intake, an inlet duct configured to receive fluid from the intake, and an outer bypass duct configured to receive fluid from the intake. The turbine engine further includes a drive shaft, a tower shaft mechanically coupled to the drive shaft, and an electric generator mechanically coupled to the tower shaft. The electric generator is located between the inlet duct and the outer bypass duct.1. A turbine engine comprising:
an intake; an inlet duct configured to receive fluid from the intake; an outer bypass duct configured to receive fluid from the intake; a drive shaft; a tower shaft mechanically coupled to the drive shaft; and an electric generator mechanically coupled to the tower shaft, wherein the electric generator is located between the inlet duct and the outer bypass duct. 2. The turbine engine of claim 1, further comprising a compressor, wherein the tower shaft passes through the compressor, wherein the compressor is configured to compress fluid traveling through the inlet duct. 3. The turbine engine of claim 2, wherein the compressor is beneath the outer bypass duct, wherein the electric generator is located between the compressor and the outer bypass duct. 4. The turbine engine of claim 1, wherein the outer bypass duct comprises a bleed configured to provide cooling to the electric generator. 5. The turbine engine of claim 1, wherein the drive shaft comprises a low-pressure shaft. 6. The turbine engine of claim 1, wherein the tower shaft is mechanically coupled to the drive shaft by a gearbox. 7. The turbine engine of claim 1, further comprising a fuel jacket configured to absorb heat from the electric generator. 8. The turbine engine of claim 1, wherein the electric generator comprises:
a first component comprising a magnet, wherein the first component is coupled to the tower shaft; and a second component comprising a winding, wherein the second component is coupled to the compressor. 9. The turbine engine of claim 1, wherein the electric generator is mechanically coupled to the tower shaft by a gearbox. 10. The turbine engine of claim 1, wherein the electric generator is configured to deliver electricity to a fuel pump or a hydraulic pump. 11. A method comprising:
receiving, at an electric generator located between an inlet duct and an outer bypass duct of a turbine engine, via a tower shaft mechanically coupled to a drive shaft of the turbine engine, mechanical power; generating, based on the mechanical power received from the tower shaft, electrical power; outputting the electrical power to an electrical load. 12. The method of claim 11, further comprising:
receiving fluid from the outer bypass duct to cool the electric generator; and transferring heat from the electric generator to the fluid from the outer bypass duct. 13. The method of claim 1, further comprising:
receiving fuel in a fuel jacket; and transferring heat from the electric generator to the fuel in the fuel jacket. 14. The method of claim 11, wherein receiving mechanical power via the tower shaft comprises receiving mechanical power at the electric generator via a gearbox mechanically coupled to the tower shaft. 15. An electric generator module comprising:
a mechanical input configured to:
connect to a tower shaft that is mechanically coupled to a drive shaft of a turbine engine, wherein the tower shaft protrudes through a cavity of the turbine engine located between an inlet duct of the turbine engine and an outer bypass duct of the turbine engine, and
receive mechanical power from the tower shaft;
a power generation component configured to produce electrical power from mechanical power received by the mechanical input; and an electrical output configured to output the electrical power produced by the power generation component to an electrical load. 16. The electric generator module of claim 15, wherein the power generation component comprises:
a first component comprising a magnet, wherein the first component is configured to mechanically couple to the tower shaft; and a second component comprising a winding, wherein the second component is configured to mechanically couple to a compressor of the turbine engine. 17. The electric generator module of claim 15, further comprising a first heat exchanger configured to transfer heat from the electric generator module to fuel in a fuel jacket. 18. The electric generator module of claim 15, further comprising a second heat exchanger configured to transfer heat from the electric generator module to fluid from the outer bypass duct. 19. The electric generator module of claim 15, wherein:
the first component is configured to mechanically couple to the tower shaft by at least a gearbox; the first component is configured to rotate; and the second component is configured to not rotate. 20. The electric generator module of claim 15, wherein:
the tower shaft is configured to pass through a compressor; the compressor is configured to compress fluid traveling through the inlet duct; the compressor is configured to be positioned beneath the outer bypass duct; and the electric generator module is located between the compressor and the outer bypass duct. | 2,800 |
11,795 | 11,795 | 15,334,459 | 2,849 | A micro-electrical-mechanical system (MEMS) resonator device includes at least one functionalization material arranged over at least a central portion, but less than an entirety, of a top side electrode. For an active region exhibiting greatest sensitivity at a center point and reduced sensitivity along its periphery, omitting functionalization material over at least one peripheral portion of a resonator active region prevents analyte binding in regions of lowest sensitivity. The at least one functionalization material extends a maximum length in a range of from about 20% to about 95% of an active area length and extends a maximum width in a range of from about 50% to 100% of an active area width. Methods for fabricating MEMS resonator devices are also provided. | 1. A micro-electrical-mechanical system (MEMS) resonator device comprising:
a substrate; a bulk acoustic wave resonator structure arranged over at least a portion of the substrate, the bulk acoustic wave resonator structure including a piezoelectric material, a top side electrode arranged over a portion of the piezoelectric material, and a bottom side electrode arranged between the piezoelectric material and the substrate, wherein a portion of the piezoelectric material is arranged between the top side electrode and the bottom side electrode to form an active region, the top side electrode comprises an active area portion that overlaps the bottom side electrode and is coincident with the active region, the active area portion includes an active area width, and the active area portion includes an active area length extending perpendicular to the active area width; and at least one functionalization material arranged over at least a central portion of the top side electrode, wherein the at least one functionalization material extends a maximum length in a range of from about 20% to about 95% of the active area length and extends a maximum width in a range of from about 50% to 100% of the active area width. 2. The MEMS resonator device of claim 1, wherein the maximum width of the at least one functionalization material exceeds the maximum length thereof. 3. The MEMS resonator device of claim 1, further comprising a self-assembled monolayer arranged between the top side electrode and the at least one functionalization material. 4. The MEMS resonator device of claim 1, further comprising an interface layer arranged between the top side electrode and the at least one functionalization material. 5. The MEMS resonator device of claim 4, wherein the top side electrode comprises a non-noble metal, and the MEMS resonator device further comprises a hermeticity layer arranged between the interface layer and the top side electrode. 6. The MEMS resonator device of claim 4, further comprising a self-assembled monolayer arranged between the interface layer and the at least one functionalization material. 7. The MEMS resonator device of claim 1, wherein the at least one functionalization material comprises a specific binding material or a non-specific binding material. 8. The MEMS resonator device of claim 1, wherein the piezoelectric material comprises a c-axis having an orientation distribution that is predominantly non-parallel to normal of a face of the substrate. 9. The MEMS resonator device of claim 1, further comprising at least one acoustic reflector element arranged between the substrate and the bulk acoustic wave resonator structure. 10. The MEMS resonator device of claim 1, wherein the substrate defines a recess, and the MEMS resonator device further comprises a support layer arranged between the bulk acoustic wave resonator structure and the recess, wherein the active region is arranged over at least a portion of the support layer and at least a portion of the recess. 11. The MEMS resonator device of claim 1, further comprising a blocking layer arranged over a portion of the piezoelectric material non-coincident with the active region. 12. A sensor comprising the MEMS resonator device of claim 1. 13. A fluidic device comprising the MEMS resonator device of claim 1, and a fluidic passage containing the active region and arranged to conduct a flow of liquid to contact the at least one functionalization material, wherein the fluidic passage is arranged to conduct the flow of liquid from an inlet port upstream of the active region toward the active region in a direction that is substantially parallel to the active area length. 14. The fluidic device of claim 13, wherein the at least one functionalization material is arranged in a shape comprising a leading edge, wherein a center point of the leading edge is arranged between the inlet port and a center point of the active region. 15. A method for biological or chemical sensing, the method comprising:
supplying a fluid containing a target species into the fluidic passage of the fluidic device according to claim 13, wherein said supplying is configured to cause at least some of the target species to bind to the at least one functionalization material; inducing a bulk acoustic wave in the active region; and sensing a change in at least one of a frequency property, a magnitude property, or a phase property of the bulk acoustic wave resonator structure to indicate at least one of presence or quantity of target species bound to the at least one functionalization material. 16. A method for fabricating a micro-electrical-mechanical system (MEMS) resonator device, the method comprising:
forming a bulk acoustic wave resonator structure including a piezoelectric material, a top side electrode arranged over a portion of the piezoelectric material, and a bottom side electrode arranged between the piezoelectric material and a substrate, wherein a portion of the piezoelectric material is arranged between the top side electrode and the bottom side electrode to form an active region, the top side electrode comprises an active area portion that overlaps the bottom side electrode and is coincident with the active region, the active area portion includes an active area width, and the active area portion includes an active area length extending perpendicular to the active area width; and depositing at least one functionalization material arranged over at least a central portion of the top side electrode, wherein the at least one functionalization material extends a maximum length in a range of from about 20% to about 95% of the active area length and extends a maximum width in a range of from about 50% to 100% of the active area width. 17. The method of claim 16, further comprising forming a self-assembled monolayer over at least a portion of the top side electrode prior to said depositing of the at least one functionalization material, wherein the at least one functionalization material is arranged over at least a portion of the self-assembled monolayer. 18. The method of claim 17, wherein the forming of a self-assembled monolayer over at least a portion of the top side electrode comprises:
applying the self-assembled monolayer over the top side electrode; arranging a first mechanical mask over the self-assembled monolayer, wherein the first mechanical mask defines at least one first aperture through which at least one first portion of the self-assembled monolayer is exposed; and transmitting electromagnetic radiation comprising a peak wavelength in a range of from about 150 nm to 400 nm through the at least one first aperture to interact with the at least one first portion of the self-assembled monolayer to promote removal of the at least one first portion of the self-assembled monolayer. 19. The method of claim 18, further comprising:
arranging a second mechanical mask over at least a portion of the bulk acoustic wave resonator structure including the active region, wherein the second mechanical mask defines at least one second aperture through which at least one second portion of the self-assembled monolayer is exposed; and applying a blocking layer through the at least one second aperture to the at least one second portion of the self-assembled monolayer. 20. The method of claim 16, further comprising forming at least one wall over a portion of the bulk acoustic wave resonator structure and defining a fluidic passage overlying the active region, wherein the fluidic passage is arranged to conduct a flow of liquid from an inlet port upstream of the active region toward the active region in a direction that is substantially parallel to the active area length, and the fluidic passage is arranged to conduct the flow of liquid to contact the at least one functionalization material. | A micro-electrical-mechanical system (MEMS) resonator device includes at least one functionalization material arranged over at least a central portion, but less than an entirety, of a top side electrode. For an active region exhibiting greatest sensitivity at a center point and reduced sensitivity along its periphery, omitting functionalization material over at least one peripheral portion of a resonator active region prevents analyte binding in regions of lowest sensitivity. The at least one functionalization material extends a maximum length in a range of from about 20% to about 95% of an active area length and extends a maximum width in a range of from about 50% to 100% of an active area width. Methods for fabricating MEMS resonator devices are also provided.1. A micro-electrical-mechanical system (MEMS) resonator device comprising:
a substrate; a bulk acoustic wave resonator structure arranged over at least a portion of the substrate, the bulk acoustic wave resonator structure including a piezoelectric material, a top side electrode arranged over a portion of the piezoelectric material, and a bottom side electrode arranged between the piezoelectric material and the substrate, wherein a portion of the piezoelectric material is arranged between the top side electrode and the bottom side electrode to form an active region, the top side electrode comprises an active area portion that overlaps the bottom side electrode and is coincident with the active region, the active area portion includes an active area width, and the active area portion includes an active area length extending perpendicular to the active area width; and at least one functionalization material arranged over at least a central portion of the top side electrode, wherein the at least one functionalization material extends a maximum length in a range of from about 20% to about 95% of the active area length and extends a maximum width in a range of from about 50% to 100% of the active area width. 2. The MEMS resonator device of claim 1, wherein the maximum width of the at least one functionalization material exceeds the maximum length thereof. 3. The MEMS resonator device of claim 1, further comprising a self-assembled monolayer arranged between the top side electrode and the at least one functionalization material. 4. The MEMS resonator device of claim 1, further comprising an interface layer arranged between the top side electrode and the at least one functionalization material. 5. The MEMS resonator device of claim 4, wherein the top side electrode comprises a non-noble metal, and the MEMS resonator device further comprises a hermeticity layer arranged between the interface layer and the top side electrode. 6. The MEMS resonator device of claim 4, further comprising a self-assembled monolayer arranged between the interface layer and the at least one functionalization material. 7. The MEMS resonator device of claim 1, wherein the at least one functionalization material comprises a specific binding material or a non-specific binding material. 8. The MEMS resonator device of claim 1, wherein the piezoelectric material comprises a c-axis having an orientation distribution that is predominantly non-parallel to normal of a face of the substrate. 9. The MEMS resonator device of claim 1, further comprising at least one acoustic reflector element arranged between the substrate and the bulk acoustic wave resonator structure. 10. The MEMS resonator device of claim 1, wherein the substrate defines a recess, and the MEMS resonator device further comprises a support layer arranged between the bulk acoustic wave resonator structure and the recess, wherein the active region is arranged over at least a portion of the support layer and at least a portion of the recess. 11. The MEMS resonator device of claim 1, further comprising a blocking layer arranged over a portion of the piezoelectric material non-coincident with the active region. 12. A sensor comprising the MEMS resonator device of claim 1. 13. A fluidic device comprising the MEMS resonator device of claim 1, and a fluidic passage containing the active region and arranged to conduct a flow of liquid to contact the at least one functionalization material, wherein the fluidic passage is arranged to conduct the flow of liquid from an inlet port upstream of the active region toward the active region in a direction that is substantially parallel to the active area length. 14. The fluidic device of claim 13, wherein the at least one functionalization material is arranged in a shape comprising a leading edge, wherein a center point of the leading edge is arranged between the inlet port and a center point of the active region. 15. A method for biological or chemical sensing, the method comprising:
supplying a fluid containing a target species into the fluidic passage of the fluidic device according to claim 13, wherein said supplying is configured to cause at least some of the target species to bind to the at least one functionalization material; inducing a bulk acoustic wave in the active region; and sensing a change in at least one of a frequency property, a magnitude property, or a phase property of the bulk acoustic wave resonator structure to indicate at least one of presence or quantity of target species bound to the at least one functionalization material. 16. A method for fabricating a micro-electrical-mechanical system (MEMS) resonator device, the method comprising:
forming a bulk acoustic wave resonator structure including a piezoelectric material, a top side electrode arranged over a portion of the piezoelectric material, and a bottom side electrode arranged between the piezoelectric material and a substrate, wherein a portion of the piezoelectric material is arranged between the top side electrode and the bottom side electrode to form an active region, the top side electrode comprises an active area portion that overlaps the bottom side electrode and is coincident with the active region, the active area portion includes an active area width, and the active area portion includes an active area length extending perpendicular to the active area width; and depositing at least one functionalization material arranged over at least a central portion of the top side electrode, wherein the at least one functionalization material extends a maximum length in a range of from about 20% to about 95% of the active area length and extends a maximum width in a range of from about 50% to 100% of the active area width. 17. The method of claim 16, further comprising forming a self-assembled monolayer over at least a portion of the top side electrode prior to said depositing of the at least one functionalization material, wherein the at least one functionalization material is arranged over at least a portion of the self-assembled monolayer. 18. The method of claim 17, wherein the forming of a self-assembled monolayer over at least a portion of the top side electrode comprises:
applying the self-assembled monolayer over the top side electrode; arranging a first mechanical mask over the self-assembled monolayer, wherein the first mechanical mask defines at least one first aperture through which at least one first portion of the self-assembled monolayer is exposed; and transmitting electromagnetic radiation comprising a peak wavelength in a range of from about 150 nm to 400 nm through the at least one first aperture to interact with the at least one first portion of the self-assembled monolayer to promote removal of the at least one first portion of the self-assembled monolayer. 19. The method of claim 18, further comprising:
arranging a second mechanical mask over at least a portion of the bulk acoustic wave resonator structure including the active region, wherein the second mechanical mask defines at least one second aperture through which at least one second portion of the self-assembled monolayer is exposed; and applying a blocking layer through the at least one second aperture to the at least one second portion of the self-assembled monolayer. 20. The method of claim 16, further comprising forming at least one wall over a portion of the bulk acoustic wave resonator structure and defining a fluidic passage overlying the active region, wherein the fluidic passage is arranged to conduct a flow of liquid from an inlet port upstream of the active region toward the active region in a direction that is substantially parallel to the active area length, and the fluidic passage is arranged to conduct the flow of liquid to contact the at least one functionalization material. | 2,800 |
11,796 | 11,796 | 15,814,482 | 2,872 | Polarizing beam splitter plates and systems incorporating such beam splitter plates are described. The polarizing beam splitter plate includes a first substrate and a multilayer optical film reflective polarizer that is disposed on the first substrate. The polarizing beam splitter plate includes a first outermost major surface and an opposing second outermost major surface that makes an angle of less than about 20 degrees with the first outermost major surface. The polarizing beam splitter plate is adapted to reflect an imaged light received from an imager towards a viewer or screen with the reflected imaged light having an effective pixel resolution of less than 12 microns. | 1. A multilayer optical film reflective polarizer configured to substantially reflect light having a first polarization state and substantially transmit light having an orthogonal second polarization state, the reflective polarizer having a surface roughness Ra of less than 45 nm or a surface roughness Rq of less than 80 nm. 2. The multilayer optical film reflective polarizer of claim 1 having a surface roughness Ra of less than 40 nm or a surface roughness Rq of less than 70 nm. 3. The multilayer optical film reflective polarizer configured to reflect an incident image light having the first polarization state with the reflected image light having an effective pixel resolution of less than 12 microns. 4. A multilayer optical film reflective polarizer configured to substantially reflect light having a first polarization state and substantially transmit light having an orthogonal second polarization state, the multilayer optical film reflective polarizer configured to reflect an incident image light having the first polarization state with the reflected image light having an effective pixel resolution of less than 12 microns. 5. The multilayer optical film reflective polarizer of claim 4 having a surface roughness Ra of less than 45 nm or a surface roughness Rq of less than 80 nm. 6. The multilayer optical film reflective polarizer of claim 4 having a surface roughness Ra of less than 40 nm or a surface roughness Rq of less than 70 nm. | Polarizing beam splitter plates and systems incorporating such beam splitter plates are described. The polarizing beam splitter plate includes a first substrate and a multilayer optical film reflective polarizer that is disposed on the first substrate. The polarizing beam splitter plate includes a first outermost major surface and an opposing second outermost major surface that makes an angle of less than about 20 degrees with the first outermost major surface. The polarizing beam splitter plate is adapted to reflect an imaged light received from an imager towards a viewer or screen with the reflected imaged light having an effective pixel resolution of less than 12 microns.1. A multilayer optical film reflective polarizer configured to substantially reflect light having a first polarization state and substantially transmit light having an orthogonal second polarization state, the reflective polarizer having a surface roughness Ra of less than 45 nm or a surface roughness Rq of less than 80 nm. 2. The multilayer optical film reflective polarizer of claim 1 having a surface roughness Ra of less than 40 nm or a surface roughness Rq of less than 70 nm. 3. The multilayer optical film reflective polarizer configured to reflect an incident image light having the first polarization state with the reflected image light having an effective pixel resolution of less than 12 microns. 4. A multilayer optical film reflective polarizer configured to substantially reflect light having a first polarization state and substantially transmit light having an orthogonal second polarization state, the multilayer optical film reflective polarizer configured to reflect an incident image light having the first polarization state with the reflected image light having an effective pixel resolution of less than 12 microns. 5. The multilayer optical film reflective polarizer of claim 4 having a surface roughness Ra of less than 45 nm or a surface roughness Rq of less than 80 nm. 6. The multilayer optical film reflective polarizer of claim 4 having a surface roughness Ra of less than 40 nm or a surface roughness Rq of less than 70 nm. | 2,800 |
11,797 | 11,797 | 15,321,296 | 2,893 | A field effect transistor having a channel that comprises three-dimensional graphene foam. The subject matter of the invention concerns a three dimensional field-effect transistor having a channel based on graphene foam and the use of ionic liquid as a gate. The graphene foam is made of a three-dimensional network of single and double layer graphene that extends in all the three dimensions. Metal contacts on either end of the graphene foam form the drain and source contacts of the transistor. | 1. An apparatus comprising a field effect transistor having a channel that comprises three-dimensional graphene foam. 2. The apparatus of claim 1, further comprising an ionic liquid, wherein said ionic liquid bathes said foam. 3. The apparatus of claim 2, wherein said ionic liquid comprises 1-Butyl-3-methylimidazolium hexafluorophosphate. 4. The apparatus of claim 1, wherein said foam comprises bilayer graphene. 5. The apparatus of claim 1, wherein said foam comprises monolayer graphene. 6. The apparatus of claim 1, further comprising a hydrophilic agent on said graphene. 7. The apparatus of claim 6, wherein said agent comprises HfO2. 8. The apparatus of claim 1, further comprising a sensor, wherein variation in a property of said transistor forms a basis for a measurement by said sensor. 9. The apparatus of claim 8, wherein said sensor comprises a biological sensor. 10. The apparatus of claim 9, wherein said biological sensor is configured for in vivo measurements. 11. The apparatus of claim 8, wherein said sensor comprises a chemical sensor. 12. The apparatus of claim 8, wherein said sensor comprises strain sensor. 13. The apparatus of claim 8, wherein said sensor comprises pH sensor. 14. The apparatus of claim 1, further comprising a scaffold, said scaffold incorporating said transistor therein. | A field effect transistor having a channel that comprises three-dimensional graphene foam. The subject matter of the invention concerns a three dimensional field-effect transistor having a channel based on graphene foam and the use of ionic liquid as a gate. The graphene foam is made of a three-dimensional network of single and double layer graphene that extends in all the three dimensions. Metal contacts on either end of the graphene foam form the drain and source contacts of the transistor.1. An apparatus comprising a field effect transistor having a channel that comprises three-dimensional graphene foam. 2. The apparatus of claim 1, further comprising an ionic liquid, wherein said ionic liquid bathes said foam. 3. The apparatus of claim 2, wherein said ionic liquid comprises 1-Butyl-3-methylimidazolium hexafluorophosphate. 4. The apparatus of claim 1, wherein said foam comprises bilayer graphene. 5. The apparatus of claim 1, wherein said foam comprises monolayer graphene. 6. The apparatus of claim 1, further comprising a hydrophilic agent on said graphene. 7. The apparatus of claim 6, wherein said agent comprises HfO2. 8. The apparatus of claim 1, further comprising a sensor, wherein variation in a property of said transistor forms a basis for a measurement by said sensor. 9. The apparatus of claim 8, wherein said sensor comprises a biological sensor. 10. The apparatus of claim 9, wherein said biological sensor is configured for in vivo measurements. 11. The apparatus of claim 8, wherein said sensor comprises a chemical sensor. 12. The apparatus of claim 8, wherein said sensor comprises strain sensor. 13. The apparatus of claim 8, wherein said sensor comprises pH sensor. 14. The apparatus of claim 1, further comprising a scaffold, said scaffold incorporating said transistor therein. | 2,800 |
11,798 | 11,798 | 14,697,860 | 2,849 | A RF switching arrangement ( 400 ) is described including a bias swap circuit ( 30 ). The bias swap circuit switches the bias voltage dependent on the state of the RF switch. This improves the performance of the RF switch without requiring charge pump circuitry. | 1. A RF switching circuit for coupling an antenna to a RF circuit, the RF switching circuit having a first mode of operation and a second mode of operation and comprising:
a switch arranged to switchably couple a RF signal input to a RF signal output, the switch comprising a first transistor having a first terminal, a second terminal, and a control terminal; a bias swapping circuit having a bias voltage output coupled to the first terminal and the second terminal; wherein the bias swapping circuit is operable to switch the bias voltage output between a first bias voltage value and a second bias voltage value in response to a change in the mode of operation of the RF switching circuit. 2. The RF switching circuit of claim 1 further comprising: a mode controller coupled to the bias swapping circuit and the control terminal and operable to switch the RF switching circuit between the first mode of operation and the second mode of operation. 3. The RF switching circuit of claim 1 further comprising a RF signal power detector coupled to the bias swapping circuit and at least one of the RF signal input and the RF signal output, and wherein the bias swapping circuit is further operable to vary the voltage on the bias voltage output in response to a change in the detected RF signal power. 4. The RF switching circuit of claim 1 further comprising a power supply detector coupled to the bias swapping circuit, wherein the bias swapping circuit is further operable to vary the voltage on the bias voltage output in response to a change in the detected power supply voltage and/or current. 5. The RF switching circuit of claim 1 further comprising a temperature sensor coupled to the bias swapping circuit, wherein the bias swapping circuit is further operable to vary the voltage on the bias voltage output in response to a change in the detected temperature. 6. The RF switching circuit of claim 1, wherein the switch comprises at least one further transistor arranged in series with the first transistor, and wherein the control terminal of the first transistor is coupled to a control terminal of the at least one further transistor and the bias swap circuit output is coupled to a first terminal and a second terminal of the at least one further transistor. 7. The RF switching circuit of claim 1 wherein each transistor further comprises a bootstrap element coupled to each transistor control terminal. 8. The RF switching circuit of claim 7 wherein the bootstrap element comprises one of a resistor and an inductor. 9. The RF switching circuit of claim 1 further comprising: a first decoupling capacitor arranged between the RF signal input and the switch and a second decoupling capacitor arranged between the RF signal output and the switch. 10. The RF switching circuit of claim 9 further comprising a shunt transistor coupled to the RF signal input. 11. The RF switching circuit of claim 1 further comprising a RF input terminal, a RF output terminal and an antenna terminal, wherein
the bias swapping circuit further comprises a second bias voltage output,
the switch further comprises a second transistor, the second transistor having a first terminal, a second terminal and a control terminal, wherein the second transistor first terminal is coupled to an RF output terminal, the second transistor second terminal is coupled to the antenna terminal, the second transistor first terminal and second transistor second terminal are coupled to the second bias voltage output, the first transistor first terminal is coupled to the RF input terminal, and the first transistor second terminal is coupled to the antenna terminal; wherein the RF switching circuit is operable to either
couple the RF input terminal to the antenna terminal or to couple the antenna terminal to the RF output terminal, and
the bias swapping circuit is operable to swap the first bias voltage value and the second bias voltage value between the first bias voltage output and the second bias voltage in response to a change in operating mode of the RF switching circuit. 12. A RF transceiver comprising the RF switching circuit of any of claim 1. 13. An integrated circuit comprising the RF transceiver of claim 12. 14. A mobile device comprising the RF switching circuit of claim 1. 15. A mobile device comprising the RF switching circuit of any of claim 9, an antenna, and a RF transceiver wherein the RF input terminal is coupled to an output of the RF transceiver, and the RF output terminal is coupled to an input of the RF transceiver, and the antenna is coupled to the antenna terminal. | A RF switching arrangement ( 400 ) is described including a bias swap circuit ( 30 ). The bias swap circuit switches the bias voltage dependent on the state of the RF switch. This improves the performance of the RF switch without requiring charge pump circuitry.1. A RF switching circuit for coupling an antenna to a RF circuit, the RF switching circuit having a first mode of operation and a second mode of operation and comprising:
a switch arranged to switchably couple a RF signal input to a RF signal output, the switch comprising a first transistor having a first terminal, a second terminal, and a control terminal; a bias swapping circuit having a bias voltage output coupled to the first terminal and the second terminal; wherein the bias swapping circuit is operable to switch the bias voltage output between a first bias voltage value and a second bias voltage value in response to a change in the mode of operation of the RF switching circuit. 2. The RF switching circuit of claim 1 further comprising: a mode controller coupled to the bias swapping circuit and the control terminal and operable to switch the RF switching circuit between the first mode of operation and the second mode of operation. 3. The RF switching circuit of claim 1 further comprising a RF signal power detector coupled to the bias swapping circuit and at least one of the RF signal input and the RF signal output, and wherein the bias swapping circuit is further operable to vary the voltage on the bias voltage output in response to a change in the detected RF signal power. 4. The RF switching circuit of claim 1 further comprising a power supply detector coupled to the bias swapping circuit, wherein the bias swapping circuit is further operable to vary the voltage on the bias voltage output in response to a change in the detected power supply voltage and/or current. 5. The RF switching circuit of claim 1 further comprising a temperature sensor coupled to the bias swapping circuit, wherein the bias swapping circuit is further operable to vary the voltage on the bias voltage output in response to a change in the detected temperature. 6. The RF switching circuit of claim 1, wherein the switch comprises at least one further transistor arranged in series with the first transistor, and wherein the control terminal of the first transistor is coupled to a control terminal of the at least one further transistor and the bias swap circuit output is coupled to a first terminal and a second terminal of the at least one further transistor. 7. The RF switching circuit of claim 1 wherein each transistor further comprises a bootstrap element coupled to each transistor control terminal. 8. The RF switching circuit of claim 7 wherein the bootstrap element comprises one of a resistor and an inductor. 9. The RF switching circuit of claim 1 further comprising: a first decoupling capacitor arranged between the RF signal input and the switch and a second decoupling capacitor arranged between the RF signal output and the switch. 10. The RF switching circuit of claim 9 further comprising a shunt transistor coupled to the RF signal input. 11. The RF switching circuit of claim 1 further comprising a RF input terminal, a RF output terminal and an antenna terminal, wherein
the bias swapping circuit further comprises a second bias voltage output,
the switch further comprises a second transistor, the second transistor having a first terminal, a second terminal and a control terminal, wherein the second transistor first terminal is coupled to an RF output terminal, the second transistor second terminal is coupled to the antenna terminal, the second transistor first terminal and second transistor second terminal are coupled to the second bias voltage output, the first transistor first terminal is coupled to the RF input terminal, and the first transistor second terminal is coupled to the antenna terminal; wherein the RF switching circuit is operable to either
couple the RF input terminal to the antenna terminal or to couple the antenna terminal to the RF output terminal, and
the bias swapping circuit is operable to swap the first bias voltage value and the second bias voltage value between the first bias voltage output and the second bias voltage in response to a change in operating mode of the RF switching circuit. 12. A RF transceiver comprising the RF switching circuit of any of claim 1. 13. An integrated circuit comprising the RF transceiver of claim 12. 14. A mobile device comprising the RF switching circuit of claim 1. 15. A mobile device comprising the RF switching circuit of any of claim 9, an antenna, and a RF transceiver wherein the RF input terminal is coupled to an output of the RF transceiver, and the RF output terminal is coupled to an input of the RF transceiver, and the antenna is coupled to the antenna terminal. | 2,800 |
11,799 | 11,799 | 15,213,157 | 2,846 | An actuator including a motor with a configurable topology and a switching array operably coupled to the motor. The switching array is adapted to configure the topology of the motor. The switching array may include a first set of switches for configuring the topology of the motor to a Y-configuration or a Δ-configuration and a second set of switches for configuring the topology of the motor to eliminate one or more stator poles of the motor. The switching array may further include a third set of switches for configuring the topology of the motor to activate a number of windings on each of a plurality of stator poles of the motor. | 1. (canceled) 2. An actuator, comprising:
a motor with a configurable topology; and a switching array operably coupled to the motor, the switching array adapted to configure the topology of the motor; wherein the switching array includes a first set of switches for configuring the topology of the motor to a Y-configuration or a Δ-configuration and a second set of switches for configuring the topology of the motor, the motor having a number of active stator poles, to eliminate half of the active stator poles of the motor. 3. The actuator of claim 2, wherein the second set of switches are configured to further eliminate half of the remaining active stator poles of the motor. 4. The actuator of claim 2, wherein the first set of switches is configured such that, in a default topology, the motor is in the Y-configuration. 5. The actuator of claim 2, wherein the switching array further includes a third set of switches for configuring the topology of the motor to activate a number of windings on each of a plurality of stator poles of the motor. 6. The actuator of claim 5, wherein the number of windings on each of the plurality of stator poles include a first part and a second part and wherein the third set of switches activates just the first part of the windings on each of the plurality of stator poles, just the second part of the windings on each of the plurality of stator poles, or both the first and second parts of the windings on each of the plurality of stator poles. 7. The actuator of claim 6, wherein the first part includes a first number of windings and the second part includes a second number of windings, the first number being different than the second number. 8. An actuator, comprising:
a motor with a configurable topology; and a switching array operably coupled to the motor, the switching array adapted to configure the topology of the motor; wherein the switching array includes a first set of switches for configuring the topology of the motor to a Y-configuration or a Δ-configuration and a second set of switches for configuring the topology of the motor to activate a number of windings on each of a plurality of stator poles of the motor. 9. The actuator of claim 8, wherein the number of windings on each of the plurality of stator poles include a first part and a second part and wherein the second set of switches activates just the first part of the windings on each of the plurality of stator poles, just the second part of the windings on each of the plurality of stator poles, or both the first and second parts of the windings on each of the plurality of stator poles. 10. The actuator of claim 9, wherein the first part includes a first number of windings and the second part includes a second number of windings, the first number being different than the second number. 11. The actuator of claim 8, wherein the first set of switches is configured such that, in a default topology, the motor is in the Y-configuration. 12. The actuator of claim 8, wherein the switching array further includes a third set of switches for configuring the topology of the motor, the motor having a number of active stator poles, to eliminate half of the active stator poles of the motor. 13. The actuator of claim 12, wherein the third set of switches are configured to further eliminate half of the remaining active stator poles of the motor. 14. An actuator, comprising:
a motor with a configurable topology; and a switching array operably coupled to the motor, the switching array adapted to configure the topology of the motor; wherein the switching array includes a first set of switches for configuring the topology of the motor, the motor having a number of active stator poles, to eliminate half of the active stator poles of the motor and a second set of switches for configuring the topology of the motor to activate a number of windings on each of the stator poles of the motor. 15. The actuator of claim 14, wherein the number of windings on each of the stator poles includes a first part and a second part and wherein the second set of switches activates just the first part of the windings on each of the plurality of stator poles, just the second part of the windings on each of the plurality of stator poles, or both the first and second parts of the windings on each of the plurality of stator poles. 16. The actuator of claim 15, wherein the first part includes a first number of windings and the second part includes a second number of windings, the first number and the second number being different. 17. The actuator of claim 14, wherein the first set of switches are further configured to eliminate half of the remaining active stator poles of the motor. 18. The actuator of claim 14, wherein the switching array further includes a third set of switches for configuring the topology of the motor to a Y-configuration or a Δ-configuration. 19. The actuator of claim 18, wherein the third set of switches is configured such that, in a default topology, the motor is in the Y-configuration. 20. An actuator, comprising:
a motor with a configurable topology; a switching array operably coupled to the motor, the switching array adapted to configure the topology of the motor; a digital valve positioner (DVP) operably connected to the switching array; wherein the switching array includes a first set of switches for configuring the topology of the motor to a Y-configuration or a Δ-configuration, a second set of switches for configuring the topology of the motor to eliminate one or more stator poles of the motor, and a third set of switches for configuring the topology of the motor to activate a number of windings on each of a plurality of stator poles of the motor; and wherein the DVP commands switching of the first, second, and third sets of switches. 21. The actuator of claim 20, wherein the DVP is configured to command current in the windings to be zero amps and, upon reaching approximately zero amps, the controller is configured to send a command to the switching array to configure the topology of the motor. 22. The actuator of claim 20, further comprising a snubber for each switch of the first, second, and third sets of switches;
wherein the DVP is configured to send a command to the switching array to configure the topology of the motor at a non-zero current. 23. The actuator of claim 20, wherein the switching array is configured to sense a current in the windings;
wherein the DVP is configured to send a command to the switching array to configure the topology of the motor; and wherein the switching array configures the topology of the motor when the switching array senses that the current in the windings is crossing zero amps. 24. An actuator, comprising:
a motor with a configurable topology; and a switching array operably coupled to the motor, the switching array adapted to configure the topology of the motor; wherein, for a given voltage, the motor topology includes at least a first set speed in a first topology, a second set speed in a second topology, and a third set speed in a third topology, each of the set speeds being a no-load, maximum speed of the motor for each of the respective topologies, the first set speed being the slowest set speed and providing the highest torque of the motor topology, the second set speed providing the fastest set speed of the motor topology, and the third set speed being faster than the first set speed. 25. An actuator, comprising:
a motor with a configurable topology; and a switching array operably coupled to the motor, the switching array adapted to configure the topology of the motor; wherein the motor topology includes a first set speed in a first topology and a second set speed in a second topology, each set speed being a no-load, maximum speed of the motor for each respective topology, the second set speed being between twelve and fifteen times higher than the first set speed. | An actuator including a motor with a configurable topology and a switching array operably coupled to the motor. The switching array is adapted to configure the topology of the motor. The switching array may include a first set of switches for configuring the topology of the motor to a Y-configuration or a Δ-configuration and a second set of switches for configuring the topology of the motor to eliminate one or more stator poles of the motor. The switching array may further include a third set of switches for configuring the topology of the motor to activate a number of windings on each of a plurality of stator poles of the motor.1. (canceled) 2. An actuator, comprising:
a motor with a configurable topology; and a switching array operably coupled to the motor, the switching array adapted to configure the topology of the motor; wherein the switching array includes a first set of switches for configuring the topology of the motor to a Y-configuration or a Δ-configuration and a second set of switches for configuring the topology of the motor, the motor having a number of active stator poles, to eliminate half of the active stator poles of the motor. 3. The actuator of claim 2, wherein the second set of switches are configured to further eliminate half of the remaining active stator poles of the motor. 4. The actuator of claim 2, wherein the first set of switches is configured such that, in a default topology, the motor is in the Y-configuration. 5. The actuator of claim 2, wherein the switching array further includes a third set of switches for configuring the topology of the motor to activate a number of windings on each of a plurality of stator poles of the motor. 6. The actuator of claim 5, wherein the number of windings on each of the plurality of stator poles include a first part and a second part and wherein the third set of switches activates just the first part of the windings on each of the plurality of stator poles, just the second part of the windings on each of the plurality of stator poles, or both the first and second parts of the windings on each of the plurality of stator poles. 7. The actuator of claim 6, wherein the first part includes a first number of windings and the second part includes a second number of windings, the first number being different than the second number. 8. An actuator, comprising:
a motor with a configurable topology; and a switching array operably coupled to the motor, the switching array adapted to configure the topology of the motor; wherein the switching array includes a first set of switches for configuring the topology of the motor to a Y-configuration or a Δ-configuration and a second set of switches for configuring the topology of the motor to activate a number of windings on each of a plurality of stator poles of the motor. 9. The actuator of claim 8, wherein the number of windings on each of the plurality of stator poles include a first part and a second part and wherein the second set of switches activates just the first part of the windings on each of the plurality of stator poles, just the second part of the windings on each of the plurality of stator poles, or both the first and second parts of the windings on each of the plurality of stator poles. 10. The actuator of claim 9, wherein the first part includes a first number of windings and the second part includes a second number of windings, the first number being different than the second number. 11. The actuator of claim 8, wherein the first set of switches is configured such that, in a default topology, the motor is in the Y-configuration. 12. The actuator of claim 8, wherein the switching array further includes a third set of switches for configuring the topology of the motor, the motor having a number of active stator poles, to eliminate half of the active stator poles of the motor. 13. The actuator of claim 12, wherein the third set of switches are configured to further eliminate half of the remaining active stator poles of the motor. 14. An actuator, comprising:
a motor with a configurable topology; and a switching array operably coupled to the motor, the switching array adapted to configure the topology of the motor; wherein the switching array includes a first set of switches for configuring the topology of the motor, the motor having a number of active stator poles, to eliminate half of the active stator poles of the motor and a second set of switches for configuring the topology of the motor to activate a number of windings on each of the stator poles of the motor. 15. The actuator of claim 14, wherein the number of windings on each of the stator poles includes a first part and a second part and wherein the second set of switches activates just the first part of the windings on each of the plurality of stator poles, just the second part of the windings on each of the plurality of stator poles, or both the first and second parts of the windings on each of the plurality of stator poles. 16. The actuator of claim 15, wherein the first part includes a first number of windings and the second part includes a second number of windings, the first number and the second number being different. 17. The actuator of claim 14, wherein the first set of switches are further configured to eliminate half of the remaining active stator poles of the motor. 18. The actuator of claim 14, wherein the switching array further includes a third set of switches for configuring the topology of the motor to a Y-configuration or a Δ-configuration. 19. The actuator of claim 18, wherein the third set of switches is configured such that, in a default topology, the motor is in the Y-configuration. 20. An actuator, comprising:
a motor with a configurable topology; a switching array operably coupled to the motor, the switching array adapted to configure the topology of the motor; a digital valve positioner (DVP) operably connected to the switching array; wherein the switching array includes a first set of switches for configuring the topology of the motor to a Y-configuration or a Δ-configuration, a second set of switches for configuring the topology of the motor to eliminate one or more stator poles of the motor, and a third set of switches for configuring the topology of the motor to activate a number of windings on each of a plurality of stator poles of the motor; and wherein the DVP commands switching of the first, second, and third sets of switches. 21. The actuator of claim 20, wherein the DVP is configured to command current in the windings to be zero amps and, upon reaching approximately zero amps, the controller is configured to send a command to the switching array to configure the topology of the motor. 22. The actuator of claim 20, further comprising a snubber for each switch of the first, second, and third sets of switches;
wherein the DVP is configured to send a command to the switching array to configure the topology of the motor at a non-zero current. 23. The actuator of claim 20, wherein the switching array is configured to sense a current in the windings;
wherein the DVP is configured to send a command to the switching array to configure the topology of the motor; and wherein the switching array configures the topology of the motor when the switching array senses that the current in the windings is crossing zero amps. 24. An actuator, comprising:
a motor with a configurable topology; and a switching array operably coupled to the motor, the switching array adapted to configure the topology of the motor; wherein, for a given voltage, the motor topology includes at least a first set speed in a first topology, a second set speed in a second topology, and a third set speed in a third topology, each of the set speeds being a no-load, maximum speed of the motor for each of the respective topologies, the first set speed being the slowest set speed and providing the highest torque of the motor topology, the second set speed providing the fastest set speed of the motor topology, and the third set speed being faster than the first set speed. 25. An actuator, comprising:
a motor with a configurable topology; and a switching array operably coupled to the motor, the switching array adapted to configure the topology of the motor; wherein the motor topology includes a first set speed in a first topology and a second set speed in a second topology, each set speed being a no-load, maximum speed of the motor for each respective topology, the second set speed being between twelve and fifteen times higher than the first set speed. | 2,800 |
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