Unnamed: 0 int64 0 350k | level_0 int64 0 351k | ApplicationNumber int64 9.75M 96.1M | ArtUnit int64 1.6k 3.99k | Abstract stringlengths 1 8.37k | Claims stringlengths 3 292k | abstract-claims stringlengths 68 293k | TechCenter int64 1.6k 3.9k |
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11,900 | 11,900 | 15,457,416 | 2,861 | In an embodiment, an ice-prevention dam for a pitot tube includes a body and a head. The body includes a notch having a substantially planar back, and the head extends from the body and has a substantially planar side that is substantially parallel to the back of the notch. Such a dam can prevent ice accumulation in a ... | 1. A dam for a pitot tube, the dam comprising:
a body including a notch having a substantially planar back; and a head extending from the body and having a substantially planar side that is substantially parallel to the back of the notch. 2. The dam of claim 1 wherein the body has a substantially cylindrical shape. 3. ... | In an embodiment, an ice-prevention dam for a pitot tube includes a body and a head. The body includes a notch having a substantially planar back, and the head extends from the body and has a substantially planar side that is substantially parallel to the back of the notch. Such a dam can prevent ice accumulation in a ... | 2,800 |
11,901 | 11,901 | 13,852,825 | 2,883 | A fiber optic cable includes a tube, a stack of fiber optic ribbons twisting along a lengthwise axis through the tube, a support, and water-blocking tape positioned at least partially around the stack, between the stack and the tube. The support and water-blocking tape provide an elevated portion of the water-blocking ... | 1. A fiber optic cable, comprising:
a tube having an interior; a stack of fiber optic ribbons extending through the interior of the tube, wherein the stack twists along a lengthwise axis of the tube; a water-blocking tape positioned at least partially around the stack between the stack and the tube, in the interior of ... | A fiber optic cable includes a tube, a stack of fiber optic ribbons twisting along a lengthwise axis through the tube, a support, and water-blocking tape positioned at least partially around the stack, between the stack and the tube. The support and water-blocking tape provide an elevated portion of the water-blocking ... | 2,800 |
11,902 | 11,902 | 14,802,066 | 2,855 | An apparatus for detecting a physical variable has a first sensor unit and a second sensor unit. The first sensor unit detects a physical variable on the basis of a first detection principle. Furthermore, the second sensor unit detects the physical variable on the basis of a second detection principle. In this case, th... | 1. An apparatus for detecting a physical variable, having the following features:
a first sensor unit which is designed to detect a physical variable on the basis of a first detection principle; and a second sensor unit which is designed to detect the physical variable on the basis of a second detection principle, the ... | An apparatus for detecting a physical variable has a first sensor unit and a second sensor unit. The first sensor unit detects a physical variable on the basis of a first detection principle. Furthermore, the second sensor unit detects the physical variable on the basis of a second detection principle. In this case, th... | 2,800 |
11,903 | 11,903 | 14,757,918 | 2,859 | A method of wirelessly charging batteries of devices includes detecting at least two devices being simultaneously present on a charging mat. It is determined, for each of the at least two devices, whether the device is compatible with a wireless charging standard. It is determined, for each of the two devices, whether ... | 1. A method of wirelessly charging batteries of devices, comprising:
detecting at least two devices being simultaneously present on a charging mat; determining, for each of the at least two devices, whether the device is compatible with a wireless charging standard; determining, for each of the at least two devices, wh... | A method of wirelessly charging batteries of devices includes detecting at least two devices being simultaneously present on a charging mat. It is determined, for each of the at least two devices, whether the device is compatible with a wireless charging standard. It is determined, for each of the two devices, whether ... | 2,800 |
11,904 | 11,904 | 15,435,777 | 2,834 | An electric machine includes a stator carrying two sets of multiphase windings. The sets are electrically isolated from each other and have an angular space displacement of A° electric corresponding to a torque ripple of harmonic order N. Responsive to current flow through the sets with a phase shift of A° electric, N±... | 1. An electric machine comprising:
a stator carrying two sets of multiphase windings electrically isolated from each other and having an angular space displacement of A° electric corresponding to a torque ripple of harmonic order N such that, responsive to current flowing through the sets with a phase shift of A° elect... | An electric machine includes a stator carrying two sets of multiphase windings. The sets are electrically isolated from each other and have an angular space displacement of A° electric corresponding to a torque ripple of harmonic order N. Responsive to current flow through the sets with a phase shift of A° electric, N±... | 2,800 |
11,905 | 11,905 | 15,397,485 | 2,836 | The systems and methods described herein relate to an adapter driver board for parallel operation of power modules. The systems and methods receive an electrical signal at an input interface of a high voltage adapter board. The systems and methods further deliver the electrical signals to first and second switches alon... | 1. A system comprising:
a high voltage adapter board coupled to a first module and a second module, wherein the first module is conductively coupled to a first terminal of the high voltage adapter board, a first conductive trace extending along the high voltage adapter board and is conductively coupled to the first ter... | The systems and methods described herein relate to an adapter driver board for parallel operation of power modules. The systems and methods receive an electrical signal at an input interface of a high voltage adapter board. The systems and methods further deliver the electrical signals to first and second switches alon... | 2,800 |
11,906 | 11,906 | 15,216,398 | 2,886 | Apparatus and associated methods relate to sampling a large volume of a cloud atmosphere so as to obtain a large signal response from even a sparse distribution of water droplets in the cloud atmosphere. Such a volume can be probed by projecting an uncollimated optical beam into the cloud atmosphere and sampling the si... | 1. A system for measuring cloud conditions comprising:
a laser diode configured to generate a pulse of light energy; a transmitter fiber configured to receive the generated pulse of light energy and to project the received pulse of light energy into a cloud atmosphere, the projected pulse of light energy projected over... | Apparatus and associated methods relate to sampling a large volume of a cloud atmosphere so as to obtain a large signal response from even a sparse distribution of water droplets in the cloud atmosphere. Such a volume can be probed by projecting an uncollimated optical beam into the cloud atmosphere and sampling the si... | 2,800 |
11,907 | 11,907 | 16,174,361 | 2,839 | Systems and methods for balancing phase currents of the phases of a multiphase converter include alternately connecting the phases during respective intervals to an input current and sampling, at a node of the multiphase converter that is common to the phases, the input current provided to the phases to obtain respecti... | 1. A method for balancing phase currents of a plurality of phases of a multiphase converter, the method comprising:
alternately connecting the phases during respective intervals to an input current; generating trigger signals at successive time instants respectively for the phases, wherein the trigger signals are synch... | Systems and methods for balancing phase currents of the phases of a multiphase converter include alternately connecting the phases during respective intervals to an input current and sampling, at a node of the multiphase converter that is common to the phases, the input current provided to the phases to obtain respecti... | 2,800 |
11,908 | 11,908 | 15,229,616 | 2,839 | A method may include monitoring an input power supply, monitoring an inductance of an inductor of a boost converter, monitoring one or more other characteristics of the boost converter, and calculating a target peak inductor current based on the input power supply voltage, the inductance, the one or more other characte... | 1. A method comprising:
monitoring an input power supply voltage of a power supply; monitoring an inductance of an inductor of a boost converter comprising the inductor; monitoring one or more other characteristics of the boost converter; and calculating a target peak inductor current based on the input power supply vo... | A method may include monitoring an input power supply, monitoring an inductance of an inductor of a boost converter, monitoring one or more other characteristics of the boost converter, and calculating a target peak inductor current based on the input power supply voltage, the inductance, the one or more other characte... | 2,800 |
11,909 | 11,909 | 15,289,943 | 2,883 | A fiber optic cable includes a cable core of core elements and a protective sheath surrounding the core elements, an armor surrounding the cable core, the armor comprising a single overlap portion when the fiber optic cable is viewed in cross-section, and a jacket surrounding the armor, the jacket having at least two l... | 1. A fiber optic cable, comprising:
a cable core of core elements and a protective sheath surrounding the core elements, wherein the protective sheath is continuous peripherally around the core elements, forming a continuous closed loop when viewed in cross-section, and continuous lengthwise along a length of the cable... | A fiber optic cable includes a cable core of core elements and a protective sheath surrounding the core elements, an armor surrounding the cable core, the armor comprising a single overlap portion when the fiber optic cable is viewed in cross-section, and a jacket surrounding the armor, the jacket having at least two l... | 2,800 |
11,910 | 11,910 | 15,622,241 | 2,864 | The orientation of the symmetry axis of an underground formation including an HTI layer is determined by comparing azimuthal Fourier coefficient of inversion results in distinct source-receiver azimuth ranges with values expected from the HTI assumption. A branch-stacking technique or prior knowledge may be used to sel... | 1. A method for determining orientation of stress or cracks in an underground formation including a horizontally transverse isotropic, HTI, layer, the method comprising:
performing isotropic elastic inversions on portions of seismic data acquired during a seismic survey of the underground formation to obtain values of ... | The orientation of the symmetry axis of an underground formation including an HTI layer is determined by comparing azimuthal Fourier coefficient of inversion results in distinct source-receiver azimuth ranges with values expected from the HTI assumption. A branch-stacking technique or prior knowledge may be used to sel... | 2,800 |
11,911 | 11,911 | 14,574,743 | 2,859 | A charging device for charging a charge storage device includes a coupling device for coupling a connector for charging the charge storage device, an optical waveguide for illuminating the coupling device and/or for indicating a state of charge of the charge storage device, and a light source for coupling light into th... | 1. A charging device for charging a charge storage device, comprising:
a coupling device for coupling a connector for charging the charge storage device; an optical waveguide configured to illuminate the coupling device and/or to indicate a state of charge of the charge storage device; and a light source configured to ... | A charging device for charging a charge storage device includes a coupling device for coupling a connector for charging the charge storage device, an optical waveguide for illuminating the coupling device and/or for indicating a state of charge of the charge storage device, and a light source for coupling light into th... | 2,800 |
11,912 | 11,912 | 15,927,442 | 2,842 | An integrated circuit having at least one electrically-controlled control loop that includes one or more loop error amplifiers also includes an analog-to-digital converter having both an input that operably couples to two inputs of each loop error amplifier and an output that couples to an off-chip hardware component c... | 1. An integrated circuit comprising:
an electrically-controlled control loop that includes a loop error amplifier; an analog-to-digital converter having an input that selectively operably couples to two inputs of the loop error amplifier and an output; and a contact pad that is operably coupled to the output of the ana... | An integrated circuit having at least one electrically-controlled control loop that includes one or more loop error amplifiers also includes an analog-to-digital converter having both an input that operably couples to two inputs of each loop error amplifier and an output that couples to an off-chip hardware component c... | 2,800 |
11,913 | 11,913 | 14,497,920 | 2,815 | A layer of P-metal material having a work function of about 4.3 or 4.4 eV or less is formed over a high-k dielectric layer. Portions of the N-metal layer are converted to P-metal materials by introducing additives such as O, C, N, Si or others to produce a P-metal material having an increased work function of about 4.7... | 1. A method for forming a semiconductor device comprising:
forming an N-metal layer suitable for use as a gate electrode for N-metal semiconductor devices, over a surface of a substrate; converting portions of said N-metal layer to P-metal portions suitable for use as gate electrodes in P-metal semiconductor devices; a... | A layer of P-metal material having a work function of about 4.3 or 4.4 eV or less is formed over a high-k dielectric layer. Portions of the N-metal layer are converted to P-metal materials by introducing additives such as O, C, N, Si or others to produce a P-metal material having an increased work function of about 4.7... | 2,800 |
11,914 | 11,914 | 15,308,489 | 2,837 | This ferroelectric thin film comprises lead zirconate titanate niobate. In said ferroelectric thin film, the ratio (a) of number of moles of lead to the total number of moles of zirconium, titanium, and niobium is greater than or equal to 100%; the ratio (b) of the number of moles of niobium to the total number of mole... | 1. A ferroelectric thin film comprising lead niobate titanate zirconate, wherein
a ratio “a” of lead to a sum of zirconium, titanium, and niobium is 100% or more by mol ratio, a ratio “b” of niobium to the sum of zirconium, titanium, and niobium is 10% or more but 20% or less by mol ratio, a ratio “c” of zirconium to a... | This ferroelectric thin film comprises lead zirconate titanate niobate. In said ferroelectric thin film, the ratio (a) of number of moles of lead to the total number of moles of zirconium, titanium, and niobium is greater than or equal to 100%; the ratio (b) of the number of moles of niobium to the total number of mole... | 2,800 |
11,915 | 11,915 | 14,964,248 | 2,894 | A flip-chip on leadframe package includes a leadframe having a plurality of leads with each lead including an inner leadfinger portion, wherein at least a landing region of all of the inner leadfinger portions are in a single common level (or plane) and include etched areas providing bump pads having concave landing si... | 1. An integrated circuit (IC) package, comprising:
a leadframe comprising a plurality of leads with each said lead including an inner leadfinger portion, wherein at least a landing region of all of said inner leadfinger portions include partially-etched areas providing bump pads having concave landing sites (landing si... | A flip-chip on leadframe package includes a leadframe having a plurality of leads with each lead including an inner leadfinger portion, wherein at least a landing region of all of the inner leadfinger portions are in a single common level (or plane) and include etched areas providing bump pads having concave landing si... | 2,800 |
11,916 | 11,916 | 15,611,218 | 2,852 | A method of operating a particulate matter sensor includes accumulating particulate matter on the sensor, thereby changing resistance between electrodes of the sensor. The sensor provides a signal that varies based upon an amount of the particulate matter on the sensor and includes a measurement cycle that includes a d... | 1. A method of operating a particulate matter sensor having a pair of spaced apart electrodes, said method comprising the steps of:
accumulating particulate matter on said particulate matter sensor, thereby changing resistance between said pair of spaced apart electrodes, wherein said particulate matter sensor provides... | A method of operating a particulate matter sensor includes accumulating particulate matter on the sensor, thereby changing resistance between electrodes of the sensor. The sensor provides a signal that varies based upon an amount of the particulate matter on the sensor and includes a measurement cycle that includes a d... | 2,800 |
11,917 | 11,917 | 15,424,958 | 2,853 | A printing apparatus, such as a large-scale ink jet printer, includes two removable, interchangeable dryer modules, which may be operated separately or in series. Each dryer module permits a sheet or web to pass therethrough in a process direction. Each dryer module includes a lamp mount, suitable for holding one or mo... | 1. A dryer module for use in printing, comprising:
a cabinet forming a chamber with a top portion and a bottom portion; the cabinet defining a plurality of sheet slots, for passage of a sheet through the chamber in a process direction; a lamp mount, suitable for holding one or more lamps, slidably disposed relative to ... | A printing apparatus, such as a large-scale ink jet printer, includes two removable, interchangeable dryer modules, which may be operated separately or in series. Each dryer module permits a sheet or web to pass therethrough in a process direction. Each dryer module includes a lamp mount, suitable for holding one or mo... | 2,800 |
11,918 | 11,918 | 15,629,610 | 2,872 | A process for creating wiring on a curved surface, such as the surface of a contact lens, includes the following. Creating a groove or trench in the curved surface. Forming a seed layer on the surface and on the groove. Removing the seed layer from the surface while leaving some or all of it in the groove. Depositing c... | 1. A method for creating conductive traces on a curved surface of a contact lens, the method comprising:
creating a groove in a curved surface of a contact lens material; forming a seed layer on the curved surface and on the groove; removing the seed layer from the curved surface, and leaving some seed layer within the... | A process for creating wiring on a curved surface, such as the surface of a contact lens, includes the following. Creating a groove or trench in the curved surface. Forming a seed layer on the surface and on the groove. Removing the seed layer from the surface while leaving some or all of it in the groove. Depositing c... | 2,800 |
11,919 | 11,919 | 15,945,489 | 2,848 | A method and device are provided. The device includes a system component that has a circuit board that includes a cable connection portion. The cable connection portion is disposed on and extends along a mounting surface, and includes board pads disposed on the mounting surface within the cable connection portion. The ... | 1. A system for surface mounting cable connections comprising:
one or more cables having a planar connector end, the planar connector end having a connector surface, the connector surface having connector pads disposed thereon, the connector pads in electrical communication with cable traces, the connector pads includi... | A method and device are provided. The device includes a system component that has a circuit board that includes a cable connection portion. The cable connection portion is disposed on and extends along a mounting surface, and includes board pads disposed on the mounting surface within the cable connection portion. The ... | 2,800 |
11,920 | 11,920 | 15,634,952 | 2,841 | An apparatus can include a processor; memory accessible by the processor; a first housing that includes a first display operatively coupled to the processor; a second display operatively coupled to the processor and operatively coupled to a mechanism that rotates the second display with respect to the first display; a ... | 1. An apparatus comprising:
a processor; memory accessible by the processor; a first housing that comprises a first display operatively coupled to the processor; a second display operatively coupled to the processor and operatively coupled to a mechanism that rotates the second display with respect to the first display... | An apparatus can include a processor; memory accessible by the processor; a first housing that includes a first display operatively coupled to the processor; a second display operatively coupled to the processor and operatively coupled to a mechanism that rotates the second display with respect to the first display; a ... | 2,800 |
11,921 | 11,921 | 15,593,486 | 2,881 | Compositions, methods, and apparatus are described for carrying out nitrogen ion implantation, which avoid the incidence of severe glitching when the nitrogen ion implantation is followed by another ion implantation operation susceptible to glitching, e.g., implantation of arsenic and/or phosphorus ionic species. The n... | 1. A nitrogen ion implantation composition for combating glitching in an ion implantation system when nitrogen ion implantation is followed by another ion implantation operation susceptible to glitching when following the nitrogen ion implantation, the nitrogen ion implantation composition comprising nitrogen (N2) dopa... | Compositions, methods, and apparatus are described for carrying out nitrogen ion implantation, which avoid the incidence of severe glitching when the nitrogen ion implantation is followed by another ion implantation operation susceptible to glitching, e.g., implantation of arsenic and/or phosphorus ionic species. The n... | 2,800 |
11,922 | 11,922 | 14,653,990 | 2,859 | A hand-held power tool rechargeable battery is provided which includes at least one first rechargeable battery cell and at least one inductive charging unit which includes at least one inductive charging coil for charging the at least one first rechargeable battery cell. It is provided that the at least one first recha... | 1.-17. (canceled) 18. A hand-held power tool rechargeable battery, comprising:
at least one first rechargeable battery cell; and at least one inductive charging unit that includes at least one inductive charging coil for charging the at least one first rechargeable battery cell, wherein the at least one first rechargea... | A hand-held power tool rechargeable battery is provided which includes at least one first rechargeable battery cell and at least one inductive charging unit which includes at least one inductive charging coil for charging the at least one first rechargeable battery cell. It is provided that the at least one first recha... | 2,800 |
11,923 | 11,923 | 15,487,226 | 2,846 | A drive circuit is provided and includes a rectification circuit, a buck converter, a first inverter, and a second inverter. The rectification circuit is configured to rectify a first AC voltage signal to generate a rectified voltage signal. The buck converter is configured to downconvert the rectified voltage signal t... | 1. A drive circuit comprising:
a rectification circuit configured to rectify a first alternating current (AC) voltage signal to generate a rectified voltage signal; a buck converter configured to downconvert the rectified voltage signal to a direct current (DC) voltage signal, wherein the DC voltage signal is supplied ... | A drive circuit is provided and includes a rectification circuit, a buck converter, a first inverter, and a second inverter. The rectification circuit is configured to rectify a first AC voltage signal to generate a rectified voltage signal. The buck converter is configured to downconvert the rectified voltage signal t... | 2,800 |
11,924 | 11,924 | 15,825,486 | 2,897 | A semiconductor device forming a bidirectional switch includes a carrier, first and second semiconductor elements arranged on the carrier, a first row of terminals arranged along a first side face of the carrier, a second row of terminals arranged along a second side face of the carrier opposite the first side face, an... | 1. A semiconductor device forming a bidirectional switch, the semiconductor device comprising:
a carrier; a first semiconductor chip and a second semiconductor chip arranged on the carrier; a first row of terminals arranged along a first side face of the carrier; a second row of terminals arranged along a second side f... | A semiconductor device forming a bidirectional switch includes a carrier, first and second semiconductor elements arranged on the carrier, a first row of terminals arranged along a first side face of the carrier, a second row of terminals arranged along a second side face of the carrier opposite the first side face, an... | 2,800 |
11,925 | 11,925 | 14,318,658 | 2,865 | A method for determining power output levels of a plurality of nodes in an electric power system includes receiving, at a first node of the plurality of nodes, voltage information and multipliers of all neighboring nodes of the first node within the electric power system, determining, by the first node, a local power g... | 1. A method for determining power output levels of a plurality of nodes in an electric power system comprising:
receiving, at a first node of the plurality of nodes, voltage information and multipliers of all neighboring nodes of the first node within the electric power system; determining, by the first node, a local p... | A method for determining power output levels of a plurality of nodes in an electric power system includes receiving, at a first node of the plurality of nodes, voltage information and multipliers of all neighboring nodes of the first node within the electric power system, determining, by the first node, a local power g... | 2,800 |
11,926 | 11,926 | 15,182,309 | 2,875 | Electronic devices may include displays. A display may include backlight components that provide backlight illumination for the display. Backlight components may include a light guide plate that distributes light from a light source across the display. Display chassis structures may be used to support display layers an... | 1. An electronic device, comprising:
a display having a display layer; a light source configured to provide light; a light guide plate configured to receive the light and to provide the light to the display as backlight illumination; and a plastic display chassis on which a portion of the display layer is mounted, wher... | Electronic devices may include displays. A display may include backlight components that provide backlight illumination for the display. Backlight components may include a light guide plate that distributes light from a light source across the display. Display chassis structures may be used to support display layers an... | 2,800 |
11,927 | 11,927 | 14,376,707 | 2,836 | An energy production system with energy store and method for operating an energy production system, solar cells, particularly a module including solar cells, being connected to an inverter, especially at its DC-side terminal, the inverter being connected at its terminal on the alternating-voltage side to a power consum... | 1-15. (canceled) 16. An energy production system, comprising:
an energy store; an inverter; a solar generator connected to the inverter, wherein a terminal on an alternating-voltage side of the inverter is connected to at least one of a power consumer and an AC system; and a power converter connected, in parallel to th... | An energy production system with energy store and method for operating an energy production system, solar cells, particularly a module including solar cells, being connected to an inverter, especially at its DC-side terminal, the inverter being connected at its terminal on the alternating-voltage side to a power consum... | 2,800 |
11,928 | 11,928 | 15,347,392 | 2,834 | A permanent magnet embedded rotating electrical machine such that permanent magnets of a multiple of poles are embedded in an interior of a rotor of which one pole is configured by two permanent magnets has a rotor such that an outer periphery of the rotor and a magnet embedding hole housing the permanent magnet commun... | 1. A permanent magnet embedded rotating electrical machine comprising:
a rotor comprised of a plurality of stacked rotor steel plates, the rotor having
a plurality of poles, each of the poles configured by two permanent magnets embedded in an interior of the rotor, and
in each of the plurality of poles, two magnet embe... | A permanent magnet embedded rotating electrical machine such that permanent magnets of a multiple of poles are embedded in an interior of a rotor of which one pole is configured by two permanent magnets has a rotor such that an outer periphery of the rotor and a magnet embedding hole housing the permanent magnet commun... | 2,800 |
11,929 | 11,929 | 15,824,816 | 2,835 | Carriers may be adapted, or configured, to allow devices received thereby to move towards and away from an interface end region. When devices are positioned proximate the interface end region of the carriers, interfaces of the devices may be presented by the carriers for operable coupling to an enclosure. When devices ... | 1. A carrier comprising:
a first side rail and a second side rail spaced apart from the first side rail to receive a device therebetween, the first and second side rails extending from a forward end region to an interface end region; and a first movable portion movably coupled to the first side rail and a second movabl... | Carriers may be adapted, or configured, to allow devices received thereby to move towards and away from an interface end region. When devices are positioned proximate the interface end region of the carriers, interfaces of the devices may be presented by the carriers for operable coupling to an enclosure. When devices ... | 2,800 |
11,930 | 11,930 | 15,674,266 | 2,894 | A method for fabricating a transistor on a semiconductor wafer includes providing a partial transistor containing a gate stack, extension regions, and source/drain sidewalls, The method also includes performing a source/drain implant of the semiconductor wafer, forming a cap layer over the semiconductor wafer, and perf... | 1. An integrated circuit comprising:
a silicon oxide liner film in contact with annealed source/drain regions and a gate electrode of a transistor; and a cap layer comprising silicon and nitrogen in contact with said silicon oxide liner film; wherein said cap layer contains an electrically neutral species. 2. integrate... | A method for fabricating a transistor on a semiconductor wafer includes providing a partial transistor containing a gate stack, extension regions, and source/drain sidewalls, The method also includes performing a source/drain implant of the semiconductor wafer, forming a cap layer over the semiconductor wafer, and perf... | 2,800 |
11,931 | 11,931 | 14,516,802 | 2,834 | A stator for a rotating electric machine includes an annular stator core, a stator coil and a resin adhesive. The stator coil is formed of a plurality of electric wires that are mounted on the stator core so as to be received in slots of the stator core. The resin adhesive is filled in the slots of the stator core to f... | 1. A stator for a rotating electric machine, the stator comprising:
an annular stator core having a plurality of slots formed therein, the slots being spaced from one another in a circumferential direction of the stator core; a stator coil formed of a plurality of electric wires that are mounted on the stator core so a... | A stator for a rotating electric machine includes an annular stator core, a stator coil and a resin adhesive. The stator coil is formed of a plurality of electric wires that are mounted on the stator core so as to be received in slots of the stator core. The resin adhesive is filled in the slots of the stator core to f... | 2,800 |
11,932 | 11,932 | 15,532,253 | 2,844 | Systems, and methods are described herein for identifying and/or controlling influence and/or potential influence of one or more signals on one or more properties of light emitted by one or more lighting units ( 100 ). In various embodiments, one or more signals may be identified that influence, or potentially influenc... | 1. A computing device comprising:
one or more processors; a wireless communication interface operably coupled with the one or more processors; and memory operably coupled with the one or more processors, the memory storing instructions that, in response to execution of the instructions by the one or more processors, ca... | Systems, and methods are described herein for identifying and/or controlling influence and/or potential influence of one or more signals on one or more properties of light emitted by one or more lighting units ( 100 ). In various embodiments, one or more signals may be identified that influence, or potentially influenc... | 2,800 |
11,933 | 11,933 | 15,911,350 | 2,827 | An embodiment of a semiconductor apparatus may include technology to convert an analog voltage level of a memory cell of a multi-level memory to a multi-bit digital value, and determine a single-bit value of the memory cell based on the multi-bit digital value. Some embodiments may also include technology to track a te... | 1. An electronic processing system, comprising:
a processor; multi-level memory communicatively coupled to the processor; an analog-to-digital converter communicatively coupled to the multi-level memory to convert an analog voltage level of a memory cell of the multi-level memory to a corresponding multi-bit digital va... | An embodiment of a semiconductor apparatus may include technology to convert an analog voltage level of a memory cell of a multi-level memory to a multi-bit digital value, and determine a single-bit value of the memory cell based on the multi-bit digital value. Some embodiments may also include technology to track a te... | 2,800 |
11,934 | 11,934 | 14,653,227 | 2,862 | A method for determining a mass of fuel injected into an internal combustion engine cylinder provided with a pressure sensor, includes: determining the temperature prevailing in the cylinder and amount heat released from the measured pressure; integrating amounts of heat released over a predetermined time interval to d... | 1. A method for determining a mass of fuel injected into a cylinder of an internal combustion engine, said cylinder being equipped with a sensor able to detect the pressure predominating in the interior thereof, the method comprising the following steps:
determining, from the pressure measured, firstly the correspondin... | A method for determining a mass of fuel injected into an internal combustion engine cylinder provided with a pressure sensor, includes: determining the temperature prevailing in the cylinder and amount heat released from the measured pressure; integrating amounts of heat released over a predetermined time interval to d... | 2,800 |
11,935 | 11,935 | 15,956,231 | 2,814 | An electronic package includes a first layer having a first surface, the first layer includes a first device having a first electrical node, and a first contact pad in electrical communication with the first electrical node and positioned within the first surface. The package includes a second layer having a second sur... | 1. A stackable electronic package comprising:
a bottom surface and a top surface, wherein the following elements are positioned between the bottom surface and the top surface:
an electronic component having a surface that forms a first portion of the bottom surface, the electronic component comprising first and second ... | An electronic package includes a first layer having a first surface, the first layer includes a first device having a first electrical node, and a first contact pad in electrical communication with the first electrical node and positioned within the first surface. The package includes a second layer having a second sur... | 2,800 |
11,936 | 11,936 | 13,754,025 | 2,872 | Certain example embodiments of this invention relate to sputtered aluminum second surface mirrors with permanent protective coatings optionally provided thereto, and/or methods of making the same. A mirror coating supported by a substrate may include, for example, first and second dielectric layers sandwiching a metall... | 1. A mirror, comprising:
a glass substrate; a multilayer thin film coating supported by the substrate, the multilayer thin film coating comprising, in order moving away from the substrate:
a first dielectric layer,
a metallic or substantially metallic layer comprising aluminum, and
a second dielectric layer; and
a pro... | Certain example embodiments of this invention relate to sputtered aluminum second surface mirrors with permanent protective coatings optionally provided thereto, and/or methods of making the same. A mirror coating supported by a substrate may include, for example, first and second dielectric layers sandwiching a metall... | 2,800 |
11,937 | 11,937 | 15,597,769 | 2,896 | A semiconductor device with a substrate, a low defect layer formed in a fixed position relative to the substrate, and a barrier layer comprising III-N semiconductor material formed on the low-defect layer and forming an electron gas in the low-defect layer. The device also has a source contact, a drain contact, and a g... | 1. A semiconductor device, comprising:
a substrate of a first conductivity type; a gallium-nitride layer formed over the substrate; a barrier layer comprising III-N semiconductor material formed on the gallium-nitride layer; a doped layer of a second, opposite conductivity type between the gallium-nitride layer and the... | A semiconductor device with a substrate, a low defect layer formed in a fixed position relative to the substrate, and a barrier layer comprising III-N semiconductor material formed on the low-defect layer and forming an electron gas in the low-defect layer. The device also has a source contact, a drain contact, and a g... | 2,800 |
11,938 | 11,938 | 12,888,181 | 2,859 | An intelligent battery charge equalization and monitoring system may assist in the management of battery string health by detecting individual batteries within a string that may need servicing. The system may detect a battery within a string that is charged to a higher voltage than other batteries within the string and... | 1. A method, comprising:
receiving a plurality of voltage characteristics, wherein each voltage characteristic of the plurality of voltage characteristics is associated with a corresponding battery in a charging string of batteries; calculating a target voltage characteristic associated with each battery in the chargin... | An intelligent battery charge equalization and monitoring system may assist in the management of battery string health by detecting individual batteries within a string that may need servicing. The system may detect a battery within a string that is charged to a higher voltage than other batteries within the string and... | 2,800 |
11,939 | 11,939 | 15,437,409 | 2,863 | Various embodiments for using three-dimensional representations for defect-related applications are provided. One computer-implemented method for determining one or more inspection parameters for a wafer inspection recipe includes generating a three-dimensional representation of one or more layers of a wafer based on d... | 1. A computer-implemented method for determining one or more inspection parameters for a wafer inspection recipe, comprising:
generating a three-dimensional representation of one or more layers of a wafer based on design data; and determining one or more inspection parameters for a wafer inspection recipe based on the ... | Various embodiments for using three-dimensional representations for defect-related applications are provided. One computer-implemented method for determining one or more inspection parameters for a wafer inspection recipe includes generating a three-dimensional representation of one or more layers of a wafer based on d... | 2,800 |
11,940 | 11,940 | 16,013,397 | 2,818 | Implementations of semiconductor packages may include: a heat sink including a plurality of projections extending from a first side of the heat sink and a die having a first side and a second side. The first side of the die may be coupled directly to a second side of the heat sink through a thermally conductive and ele... | 1. A semiconductor package comprising:
a heat sink comprising a plurality of projections extending from a first side of the heat sink; a die comprising a first side and a second side, the first side of the die coupled directly to a second side of the heat sink through a thermally conductive and electrically isolating m... | Implementations of semiconductor packages may include: a heat sink including a plurality of projections extending from a first side of the heat sink and a die having a first side and a second side. The first side of the die may be coupled directly to a second side of the heat sink through a thermally conductive and ele... | 2,800 |
11,941 | 11,941 | 15,818,156 | 2,836 | A power adapter and method of use wherein a power adapter provided with a power supply portion and human detection and cooling circuitry may be cooled and/or disabled upon detection of a human proximate the power adapter. In use, a voltage regulator integrated circuit of the power adapter is disabled if an overload tem... | 1. A power adapter, comprising:
a power supply portion coupled to human detection and cooling circuitry via an enable/disable input of a voltage regulator integrated circuit of the power supply portion; the voltage regulator integrated circuit provided with a temperature sensor; and the human detection and cooling circ... | A power adapter and method of use wherein a power adapter provided with a power supply portion and human detection and cooling circuitry may be cooled and/or disabled upon detection of a human proximate the power adapter. In use, a voltage regulator integrated circuit of the power adapter is disabled if an overload tem... | 2,800 |
11,942 | 11,942 | 13,780,773 | 2,832 | A dual magnetic phase stator lamination for use in stator permanent magnet electric machines is disclosed. The permanent magnet electrical machine includes a rotor mounted for rotation about a central axis and a stator positioned about the rotor and comprising a plurality of stator laminations, wherein each of the stat... | 1. A permanent magnet electrical machine comprising:
a rotor mounted for rotation about a central axis; and a stator positioned about the rotor and comprising a plurality of stator laminations, wherein each of the stator laminations is composed of a dual magnetic phase material and includes:
a first stator lamination p... | A dual magnetic phase stator lamination for use in stator permanent magnet electric machines is disclosed. The permanent magnet electrical machine includes a rotor mounted for rotation about a central axis and a stator positioned about the rotor and comprising a plurality of stator laminations, wherein each of the stat... | 2,800 |
11,943 | 11,943 | 15,380,724 | 2,863 | A system and method for detecting a phase-to-ground fault in an AC electrical machine operates to receive measurements of three-phase voltages and currents provided to the AC electrical machine, compute at least one of a zero sequence component and a negative sequence component of voltage and current from the three-pha... | 1. A controller configured to detect a phase-to-ground fault in an AC electrical machine, the controller comprising a processor programmed to:
receive measurements of three-phase voltages and currents provided to the AC electrical machine, the measurements being received from voltage and current sensors associated with... | A system and method for detecting a phase-to-ground fault in an AC electrical machine operates to receive measurements of three-phase voltages and currents provided to the AC electrical machine, compute at least one of a zero sequence component and a negative sequence component of voltage and current from the three-pha... | 2,800 |
11,944 | 11,944 | 15,468,992 | 2,865 | Machine health can be monitored using multiple sensors. For example, a computing device can determine a target sensor to monitor from among multiple sensors associated with the machine. The computing device can determine magnitude values for a particular component of a time series associated with the target sensor. The... | 1. A system comprising:
a machine; a plurality of sensors coupled to the machine for detecting characteristics of the machine; a processing device communicatively coupled to the plurality of sensors; and a memory device on which instructions executable by the processing device are stored for causing the processing devi... | Machine health can be monitored using multiple sensors. For example, a computing device can determine a target sensor to monitor from among multiple sensors associated with the machine. The computing device can determine magnitude values for a particular component of a time series associated with the target sensor. The... | 2,800 |
11,945 | 11,945 | 15,577,738 | 2,834 | A drive device includes an electric motor and a gear unit that is driven by the electric motor. The electric motor has a laminated stator core which includes stator windings and is accommodated in a stator housing. The stator housing has recesses that are axially uninterrupted, i.e. in particular in the direction of th... | 1-15. (canceled) 16. A drive device, comprising:
a gear unit; and an electric motor adapted to drive the gear unit, the electric motor including a laminated stator core which has stator windings and is accommodated in a stator housing; wherein the stator housing is surrounded by and/or radially surrounded by a housing,... | A drive device includes an electric motor and a gear unit that is driven by the electric motor. The electric motor has a laminated stator core which includes stator windings and is accommodated in a stator housing. The stator housing has recesses that are axially uninterrupted, i.e. in particular in the direction of th... | 2,800 |
11,946 | 11,946 | 13,954,557 | 2,883 | An optical network architecture can include a first pair of tapered mixing rods and a second pair of tapered mixing rods. A first plurality of plastic optical fibers is communicatively coupled from the first pair of tapered mixing rods to a first plurality of line replaceable components, and a second plurality of plast... | 1. An optical network architecture comprising:
a first pair of tapered mixing rods; a second pair of tapered mixing rods; a first plurality of plastic optical fibers communicatively coupled from the first pair of tapered mixing rods to a first plurality of line replaceable units; a second plurality of plastic optical f... | An optical network architecture can include a first pair of tapered mixing rods and a second pair of tapered mixing rods. A first plurality of plastic optical fibers is communicatively coupled from the first pair of tapered mixing rods to a first plurality of line replaceable components, and a second plurality of plast... | 2,800 |
11,947 | 11,947 | 15,572,308 | 2,845 | A body-wearable antenna system is described that comprises at least two antenna elements ( 2, 4 ) arranged to be mountable in a substantially equi-spaced distributed array around a user's body. Each antenna element is a directional type antenna and the antenna system is configurable such that when worn the antenna elem... | 1. A body-wearable antenna system capable of operating in transmit and receive, comprising at least two antenna elements arranged to be mountable in a substantially equi-spaced distributed array around a user's body, wherein each antenna element is a directional type antenna and wherein the antenna system is configured... | A body-wearable antenna system is described that comprises at least two antenna elements ( 2, 4 ) arranged to be mountable in a substantially equi-spaced distributed array around a user's body. Each antenna element is a directional type antenna and the antenna system is configurable such that when worn the antenna elem... | 2,800 |
11,948 | 11,948 | 15,533,514 | 2,864 | In an example, a method of anticipating maintenance in a printing device includes determining an inertial reference signal of a printer carriage and measuring a current inertial signal of the printer carriage. The method includes cross-correlating the inertial reference signal with the current inertial signal and deter... | 1. A method of anticipating maintenance in a printing device, the method comprising:
determining an inertial reference signal of a printer carriage; measuring a current inertial signal of the printer carriage; cross-correlating the inertial reference signal with the current inertial signal; and determining from the cro... | In an example, a method of anticipating maintenance in a printing device includes determining an inertial reference signal of a printer carriage and measuring a current inertial signal of the printer carriage. The method includes cross-correlating the inertial reference signal with the current inertial signal and deter... | 2,800 |
11,949 | 11,949 | 15,171,404 | 2,855 | An integrated capstan for use in fiber processing and testing apparatus. The integrated capstan features a fiber-engaging material that provides a contact surface for fibers. The hardness of the contact surface is controlled to minimize transfer of stress to the fibers to prevent damage to fiber coatings or fiber splic... | 1. An integrated capstan comprising:
a capstan; and a fiber-engaging material, said fiber-engaging material formed on the surface of said capstan, said fiber-engaging material having a hardness in the range from 40 Shore 00 to 70 Shore 00. 2. The integrated capstan of claim 1, wherein said capstan includes a channel, s... | An integrated capstan for use in fiber processing and testing apparatus. The integrated capstan features a fiber-engaging material that provides a contact surface for fibers. The hardness of the contact surface is controlled to minimize transfer of stress to the fibers to prevent damage to fiber coatings or fiber splic... | 2,800 |
11,950 | 11,950 | 15,381,229 | 2,835 | An electronic apparatus includes a display subassembly including display device that visually presents information and a connector, a base subassembly including a housing having a connector recess that receives the connector of the display subassembly, and one or more processors that control presentation of the informa... | 1. An electronic apparatus comprising:
a display subassembly including display device that visually presents information and a connector; a base subassembly including a housing having a connector recess that receives the connector of the display subassembly; and one or more processors that control presentation of the i... | An electronic apparatus includes a display subassembly including display device that visually presents information and a connector, a base subassembly including a housing having a connector recess that receives the connector of the display subassembly, and one or more processors that control presentation of the informa... | 2,800 |
11,951 | 11,951 | 15,049,833 | 2,822 | A system and method is provided for enhancing hydrocarbon production. The method and system involve geochemistry analysis and include multiply substituted isotopologue and position specific isotope geochemistry. The method and system involve using clumped isotope and position-specific isotope signatures to enhance rese... | 1. A method for enhancing hydrocarbon production comprising:
providing a field deployable system in fluid communication with a subsurface formation, wherein the field deployable system is configured to determine a geochemical signature of a sample based on clumped isotope and/or position specific isotope geochemistry a... | A system and method is provided for enhancing hydrocarbon production. The method and system involve geochemistry analysis and include multiply substituted isotopologue and position specific isotope geochemistry. The method and system involve using clumped isotope and position-specific isotope signatures to enhance rese... | 2,800 |
11,952 | 11,952 | 15,001,187 | 2,837 | Embodiments described herein provide devices, systems, and techniques for generating a magnetic field pattern that includes a plurality of magnetic poles. In specific embodiments, a magnetic device is disclosed which generates a magnetic field pattern including two magnetic poles of the same polarity on both ends, or s... | 1. A magnetic device, comprising:
a base that includes an upper surface, a lower surface, and an inner wall and an outer wall that are sandwiched between the upper surface and the lower surface,
wherein the upper surface includes a first opening defined by the upper edge of the inner wall, the lower surface includes a ... | Embodiments described herein provide devices, systems, and techniques for generating a magnetic field pattern that includes a plurality of magnetic poles. In specific embodiments, a magnetic device is disclosed which generates a magnetic field pattern including two magnetic poles of the same polarity on both ends, or s... | 2,800 |
11,953 | 11,953 | 15,476,812 | 2,817 | A display may have an array of organic light-emitting diodes that form an active area on a flexible substrate. Metal traces may extend between the active area and an inactive area of the flexible substrate. Display driver circuitry such as a display driver integrated circuit may be coupled to the inactive area. The met... | 1. A display, comprising:
a flexible substrate; an array of pixels that form an active area on the flexible substrate; metal traces that extend from the active area to an inactive area on the flexible substrate across a bend region on the flexible substrate, wherein the flexible substrate is folded over against itself ... | A display may have an array of organic light-emitting diodes that form an active area on a flexible substrate. Metal traces may extend between the active area and an inactive area of the flexible substrate. Display driver circuitry such as a display driver integrated circuit may be coupled to the inactive area. The met... | 2,800 |
11,954 | 11,954 | 16,381,982 | 2,848 | A system to effectuate improved transfer of semiconductor die. A first frame secures a first substrate having the semiconductor die. A second frame secures a second substrate adjacent the first substrate. A needle is disposed adjacent to the first frame. The needle includes: a longitudinal surface extending in a direct... | 1. A method of effectuating improved transfer of a semiconductor die from a wafer tape, the method comprising:
positioning the wafer tape having the semiconductor die thereon, the semiconductor die being disposed on a first side of the wafer tape; positioning a substrate adjacent to the wafer tape; selecting, based, at... | A system to effectuate improved transfer of semiconductor die. A first frame secures a first substrate having the semiconductor die. A second frame secures a second substrate adjacent the first substrate. A needle is disposed adjacent to the first frame. The needle includes: a longitudinal surface extending in a direct... | 2,800 |
11,955 | 11,955 | 15,946,697 | 2,814 | A thin-film transistor (TFT) array substrate including: a first conductive layer selected from an active layer, a gate electrode, a source electrode, and a drain electrode of a TFT; a second conductive layer in a layer different from the first conductive layer; and a connection node coupling the first conductive layer ... | 1. A thin-film transistor (TFT) array substrate comprising:
a switching TFT comprising a source electrode and a drain electrode; a driving TFT comprising a gate electrode connected to one of the source electrode and the drain electrode of the switching TFT; an initialization power line connected to the other one of the... | A thin-film transistor (TFT) array substrate including: a first conductive layer selected from an active layer, a gate electrode, a source electrode, and a drain electrode of a TFT; a second conductive layer in a layer different from the first conductive layer; and a connection node coupling the first conductive layer ... | 2,800 |
11,956 | 11,956 | 14,766,414 | 2,894 | A semiconductor device according to the present invention includes a mount substrate, an adhesive applied to the mount substrate, and a device having its lower surface bonded to the mount substrate with the adhesive. The surface roughness of a side surface upper portion of the device is lower than that of a side surfac... | 1. A semiconductor device comprising:
a mount substrate; an adhesive applied to the mount substrate; and a device having its lower surface bonded to the mount substrate with the adhesive, wherein the surface roughness of a side surface upper portion of the device is lower than that of a side surface lower portion of th... | A semiconductor device according to the present invention includes a mount substrate, an adhesive applied to the mount substrate, and a device having its lower surface bonded to the mount substrate with the adhesive. The surface roughness of a side surface upper portion of the device is lower than that of a side surfac... | 2,800 |
11,957 | 11,957 | 15,648,325 | 2,841 | Portable electronic devices are provided. Each device may be formed from two parts. A first part may be provided with components such as a display, a touch screen, a cover glass, and a frame. A second part may be provided with a plastic housing, circuit boards containing electrical components, and a bezel. Engagement m... | 1. An electronic device having front and rear surfaces, comprising:
a housing having a glass member that forms at least part of the rear surface; a touch-sensitive display having a cover layer that forms at least part of the front surface; and a frame that attaches the display to the housing, wherein the frame includes... | Portable electronic devices are provided. Each device may be formed from two parts. A first part may be provided with components such as a display, a touch screen, a cover glass, and a frame. A second part may be provided with a plastic housing, circuit boards containing electrical components, and a bezel. Engagement m... | 2,800 |
11,958 | 11,958 | 15,461,286 | 2,841 | A component for an electronic device include a housing and a plastic substrate. The plastic substrate is disposed in, and adjacent to, the housing, A thermoplastic overlayer is insert molded into the housing. The plastic substrate is disposed between the housing and the thermoplastic overlayer after the insert molding.... | 1. A component for an electronic device, the component comprising:
a housing; a plastic substrate, disposed adjacent to the housing; and a thermoplastic overlayer, insert molded into the housing; wherein the plastic substrate is disposed between the housing and the thermoplastic overlayer; wherein the thermoplastic ove... | A component for an electronic device include a housing and a plastic substrate. The plastic substrate is disposed in, and adjacent to, the housing, A thermoplastic overlayer is insert molded into the housing. The plastic substrate is disposed between the housing and the thermoplastic overlayer after the insert molding.... | 2,800 |
11,959 | 11,959 | 15,850,999 | 2,899 | Methods of fabricating a thick oxide feature on a semiconductor wafer include forming a oxide layer having a thickness of at least six micrometers and depositing a photoresist layer on the oxide layer. The oxide layer has a first etch rate of X with a given etchant, the photoresist layer has a second etch rate of Y wit... | 1. A method of fabricating a thick oxide feature on a semiconductor wafer, the method comprising:
forming a oxide layer having a thickness of at least six micrometers, the oxide layer having a first etch rate of X with a given etchant; depositing a photoresist layer on the oxide layer, the photoresist layer having a se... | Methods of fabricating a thick oxide feature on a semiconductor wafer include forming a oxide layer having a thickness of at least six micrometers and depositing a photoresist layer on the oxide layer. The oxide layer has a first etch rate of X with a given etchant, the photoresist layer has a second etch rate of Y wit... | 2,800 |
11,960 | 11,960 | 15,223,136 | 2,822 | The present disclosure includes textured memory cell structures and method of forming the same. In one or more embodiments, a memory cell includes a buffer portion formed on an amorphous portion and an active portion formed on the buffer portion, wherein the active portion is textured with a single out of plane orienta... | 1. A memory element, comprising:
an amorphous portion; a buffer portion formed on the amorphous portion, wherein the buffer portion is a chalcogenide and wherein the buffer portion is textured with a single out of plane orientation; and an active portion formed on the buffer portion, wherein the active portion is textu... | The present disclosure includes textured memory cell structures and method of forming the same. In one or more embodiments, a memory cell includes a buffer portion formed on an amorphous portion and an active portion formed on the buffer portion, wherein the active portion is textured with a single out of plane orienta... | 2,800 |
11,961 | 11,961 | 12,757,251 | 2,858 | A method of navigation includes receiving a magnetic field signal from a magnetic field transducer, the magnetic field signal proportional to sensed magnetic fields associated with magnetic field sources, in a processor, processing the magnetic field signal to determine magnetic field axes of rotation corresponding to ... | 1. A method of navigation, comprising:
receiving a magnetic field signal from a magnetic field transducer, the magnetic field signal proportional to sensed magnetic fields associated with a plurality of magnetic field sources; in a processor, processing the magnetic field signal to determine a plurality of magnetic fie... | A method of navigation includes receiving a magnetic field signal from a magnetic field transducer, the magnetic field signal proportional to sensed magnetic fields associated with magnetic field sources, in a processor, processing the magnetic field signal to determine magnetic field axes of rotation corresponding to ... | 2,800 |
11,962 | 11,962 | 15,988,262 | 2,813 | Implementations of a method of singulating a plurality of die from a semiconductor substrate may include: forming a damage layer beneath a surface of a die street where the die street connects a plurality of semiconductor die formed on a semiconductor substrate. The method may include mounting the semiconductor substra... | 1. A method of singulating a plurality of die from a semiconductor substrate, the method comprising:
forming a damage layer beneath a surface of a die street, the die street connecting a plurality of semiconductor die, the plurality of semiconductor die formed on the semiconductor substrate; mounting the semiconductor ... | Implementations of a method of singulating a plurality of die from a semiconductor substrate may include: forming a damage layer beneath a surface of a die street where the die street connects a plurality of semiconductor die formed on a semiconductor substrate. The method may include mounting the semiconductor substra... | 2,800 |
11,963 | 11,963 | 13,524,253 | 2,892 | A multi-chip modular wafer level package of a high voltage unit for an implantable cardiac defibrillator includes one or more high voltage (HV) component chips encapsulated with other components thereof in a polymer mold compound of a single reconstituted wafer, wherein all interconnect segments are preferably located ... | 1. A multi-chip modular wafer level package of a high voltage unit for an implantable cardiac defibrillator, the package comprising:
a high voltage (HV) component chip including a first contact surface located on a first side thereof, and a second contact surface located on a second side thereof, the second side of the... | A multi-chip modular wafer level package of a high voltage unit for an implantable cardiac defibrillator includes one or more high voltage (HV) component chips encapsulated with other components thereof in a polymer mold compound of a single reconstituted wafer, wherein all interconnect segments are preferably located ... | 2,800 |
11,964 | 11,964 | 16,225,003 | 2,842 | A light emitting diode (LED) luminaire device includes an LED housing with one or more LED modules. Each LED module includes one or more LED arrays and a control circuit. The LED luminaire device also includes an antenna that is electrically connected to a contact surface, a plurality of contacts electrically connected... | 1. A light emitting diode (LED) luminaire device, comprising:
an LED housing comprising one or more LED modules, wherein each LED module comprises one or more LED arrays and a control circuit; an antenna that is electrically connected to a contact surface; a plurality of contacts electrically connected to one of either... | A light emitting diode (LED) luminaire device includes an LED housing with one or more LED modules. Each LED module includes one or more LED arrays and a control circuit. The LED luminaire device also includes an antenna that is electrically connected to a contact surface, a plurality of contacts electrically connected... | 2,800 |
11,965 | 11,965 | 15,396,530 | 2,813 | Heat dissipation technology in a die stack is disclosed. In one example, an electronic device comprises a pair of electrically coupled dies; and a heat spreader disposed between the pair of dies and electrically isolated from an electrical connection between the pair of dies. | 1. An electronic device, comprising:
a pair of electrically coupled dies; and a heat spreader disposed between the pair of dies and electrically isolated from an electrical connection between the pair of dies. 2. The electronic device of claim 1, wherein at least a portion of the heat spreader is exposed from between t... | Heat dissipation technology in a die stack is disclosed. In one example, an electronic device comprises a pair of electrically coupled dies; and a heat spreader disposed between the pair of dies and electrically isolated from an electrical connection between the pair of dies.1. An electronic device, comprising:
a pair ... | 2,800 |
11,966 | 11,966 | 16,245,718 | 2,847 | Coated articles are provided comprising:
(a) a substrate that demonstrates electrical conductivity; and (b) a coating layer applied to at least one surface of the substrate;
wherein the coating layer demonstrates push-through electrical connectivity. The coated articles are particularly suitable for use in... | 1. A coated article comprising:
(a) a substrate that demonstrates electrical conductivity; and (b) a coating layer applied to at least one surface of the substrate; wherein the coating layer demonstrates push-through electrical connectivity. 2. The coated article of claim 1 wherein the substrate comprises an electrical... | Coated articles are provided comprising:
(a) a substrate that demonstrates electrical conductivity; and (b) a coating layer applied to at least one surface of the substrate;
wherein the coating layer demonstrates push-through electrical connectivity. The coated articles are particularly suitable for use in... | 2,800 |
11,967 | 11,967 | 14,615,821 | 2,882 | An illumination module configured for mounting at a vehicle includes at least one illumination source and an optic. The optic is a three dimensional single formed optic that is formed such that, when the illumination source is operated and when the illumination module is disposed at a side of a vehicle, the optic provi... | 1. An illumination module for a vehicle, said illumination module configured for mounting at a side of a vehicle, said illumination module comprising:
at least one illumination source and an optic; wherein said optic comprises a three dimensional single formed optic that is formed such that, when said at least one illu... | An illumination module configured for mounting at a vehicle includes at least one illumination source and an optic. The optic is a three dimensional single formed optic that is formed such that, when the illumination source is operated and when the illumination module is disposed at a side of a vehicle, the optic provi... | 2,800 |
11,968 | 11,968 | 13,812,853 | 2,837 | The present invention relates to an electromechanical transducer comprising a dielectric elastomer with contact by a first electrode and a second electrode, wherein the dielectric elastomer comprises a polyurethane polymer. In this case, the polyurethane polymer comprises at least one polyester and/or polycarbonate uni... | 1. An electromechanical converter, including a dielectric elastomer which is in contact with a first electrode and a second electrode, in which the dielectric elastomer comprises a polyurethane polymer, wherein the polyurethane polymer can be obtained by reacting
A) trifunctional polyisocyanate having a biuret and/or i... | The present invention relates to an electromechanical transducer comprising a dielectric elastomer with contact by a first electrode and a second electrode, wherein the dielectric elastomer comprises a polyurethane polymer. In this case, the polyurethane polymer comprises at least one polyester and/or polycarbonate uni... | 2,800 |
11,969 | 11,969 | 15,652,590 | 2,875 | A lens diffusing light emitted from a light source includes a concave light-incident surface, a light guide portion, and a light-emitting surface. The light-incident surface includes a plane portion opposed to the light source and an optical function portion that is formed on the plane portion and one of scatters and d... | 1. (canceled) 2. A lens configured to diffuse light emitted from a light source, the lens comprising:
a concave light-incident surface including a plane portion opposed to the light source and an optical function portion that is formed on the plane portion and scatters the light, wherein at least a portion of the light... | A lens diffusing light emitted from a light source includes a concave light-incident surface, a light guide portion, and a light-emitting surface. The light-incident surface includes a plane portion opposed to the light source and an optical function portion that is formed on the plane portion and one of scatters and d... | 2,800 |
11,970 | 11,970 | 15,668,509 | 2,831 | Example retainer apparatus and related methods are disclosed. An example retainer apparatus disclosed herein includes a post having a first end attachable to a wall plate cover opening of an outlet and a second end opposite the first end. The example retainer apparatus also includes a plug retainer to be removably coup... | 1. A retainer comprising:
a post having a first end to be received by an opening of a wall plate cover of an outlet and a second end opposite the first end; and a plug retainer to be removably coupled to the post, the plug retainer to move relative to the post between the first end of the post and the second end of the... | Example retainer apparatus and related methods are disclosed. An example retainer apparatus disclosed herein includes a post having a first end attachable to a wall plate cover opening of an outlet and a second end opposite the first end. The example retainer apparatus also includes a plug retainer to be removably coup... | 2,800 |
11,971 | 11,971 | 14,825,917 | 2,875 | An aircraft beacon light unit has an operating light emission distribution. The operating light emission distribution has a first light emission opening angle of at least 150° in a first cross-sectional plane, and a second light emission opening angle of at most 180° in a second cross-sectional plane orthogonal to the ... | 1. Aircraft beacon light unit with an operating light emission distribution, wherein the operating light emission distribution has
a first light emission opening angle of at least 150° in a first cross-sectional plane, and a second light emission opening angle of at most 180° in a second cross-sectional plane orthogona... | An aircraft beacon light unit has an operating light emission distribution. The operating light emission distribution has a first light emission opening angle of at least 150° in a first cross-sectional plane, and a second light emission opening angle of at most 180° in a second cross-sectional plane orthogonal to the ... | 2,800 |
11,972 | 11,972 | 15,702,717 | 2,855 | Spatially-distributed resonant MEMS sensors are coordinated to generate frequency-modulated signals indicative of regional contact forces, ambient conditions and/or environmental composition. | 1. A sensing apparatus comprising:
a first surface; a plurality of resonant MEMS devices each disposed in physical contact with a respective region of the first surface and having a mechanical resonance frequency that varies according to deflection of the first surface in the respective region of physical contact; and ... | Spatially-distributed resonant MEMS sensors are coordinated to generate frequency-modulated signals indicative of regional contact forces, ambient conditions and/or environmental composition.1. A sensing apparatus comprising:
a first surface; a plurality of resonant MEMS devices each disposed in physical contact with a... | 2,800 |
11,973 | 11,973 | 15,630,185 | 2,896 | A display device component includes an optical waveguide having a surface; a first material formed on a portion of the surface of the optical waveguide; and a second material formed on a portion of the first material. The first material has light scattering properties. | 1. A display device component comprising:
an optical waveguide having a first surface and a second surface; and a first marking material formed, in an image-wise manner, on said first surface of said optical waveguide to create a plurality of image regions having said first marking material, said first marking material... | A display device component includes an optical waveguide having a surface; a first material formed on a portion of the surface of the optical waveguide; and a second material formed on a portion of the first material. The first material has light scattering properties.1. A display device component comprising:
an optica... | 2,800 |
11,974 | 11,974 | 15,665,069 | 2,836 | In a system and method for operating a system, a drive is connectable to a supply-voltage source, especially an AC-voltage source, with the aid of an apparatus, in particular a control unit, via electric lines installed in the system, and information is transmittable between the control unit and the drive, using the li... | 1-28. (canceled) 29. A system, comprising:
an apparatus, including a control unit, connectable to a multi-phase AC supply-voltage source; and a device connected to the apparatus via a plurality of lines, each line corresponding to a respective phase of the AC supply-voltage source, each line adapted to supply AC voltag... | In a system and method for operating a system, a drive is connectable to a supply-voltage source, especially an AC-voltage source, with the aid of an apparatus, in particular a control unit, via electric lines installed in the system, and information is transmittable between the control unit and the drive, using the li... | 2,800 |
11,975 | 11,975 | 14,359,550 | 2,859 | A hand tool case includes at least one first inductive charge receiving area and at least one first adjustment unit which is provided for changing a position and/or a size of at least the first inductive charge receiving area. | 1-9. (canceled) 10. A hand tool case, comprising:
at least one first inductive charge receiving area; and at least one first adjustment unit for changing at least one of a position and a size of at least the first inductive charge receiving area. 11. The hand tool case as recited in claim 10, wherein the at least one f... | A hand tool case includes at least one first inductive charge receiving area and at least one first adjustment unit which is provided for changing a position and/or a size of at least the first inductive charge receiving area.1-9. (canceled) 10. A hand tool case, comprising:
at least one first inductive charge receivin... | 2,800 |
11,976 | 11,976 | 13,617,584 | 2,819 | A heterostructure semiconductor device includes a first active layer and a second active layer disposed on the first active layer. A two-dimensional electron gas layer is formed between the first and second active layers. A first gate dielectric layer is disposed on the second active layer. A second gate dielectric lay... | 1. A heterostructure semiconductor device comprising:
a first active layer; a second active layer disposed on the first active layer, a two-dimensional electron gas layer forming between the first and second active layers; a first gate dielectric layer disposed on the second active layer; a second gate dielectric layer... | A heterostructure semiconductor device includes a first active layer and a second active layer disposed on the first active layer. A two-dimensional electron gas layer is formed between the first and second active layers. A first gate dielectric layer is disposed on the second active layer. A second gate dielectric lay... | 2,800 |
11,977 | 11,977 | 15,539,851 | 2,836 | An arrangement for power distribution on a vessel, having: a first DC bus operating at a first medium voltage; at least one second DC bus operating at a second medium voltage and having no direct connection with the first DC bus; a first AC bus operating at a low voltage; a first inverter coupled between the first DC b... | 1. An arrangement for power distribution on a vessel, comprising:
a first DC bus operating at a first medium voltage; at least one second DC bus operating at a second medium voltage and having no direct connection with the first DC bus; a first AC bus operating at a low voltage; a first inverter coupled between the fir... | An arrangement for power distribution on a vessel, having: a first DC bus operating at a first medium voltage; at least one second DC bus operating at a second medium voltage and having no direct connection with the first DC bus; a first AC bus operating at a low voltage; a first inverter coupled between the first DC b... | 2,800 |
11,978 | 11,978 | 16,169,029 | 2,837 | Wireless communication system and method powered by an energy harvester. At least some of the example embodiments are methods including: receiving a burst of electrical energy from an energy harvester that produces the burst of electrical energy from mechanical energy, the burst of electrical energy the result of a sin... | 1. A method of operating a transceiver comprising:
receiving a burst of electrical energy from an energy harvester that produces the burst of electrical energy from mechanical energy, the burst of electrical energy the result of a single actuation of the energy harvester; rectifying the burst of electrical energy to cr... | Wireless communication system and method powered by an energy harvester. At least some of the example embodiments are methods including: receiving a burst of electrical energy from an energy harvester that produces the burst of electrical energy from mechanical energy, the burst of electrical energy the result of a sin... | 2,800 |
11,979 | 11,979 | 15,546,070 | 2,835 | In one implementation, a system for a memory cooling pad includes a first thermal interface material coupled to a second thermal interface material by a liner material configured to position the first thermal interface material on a first side of a memory unit and to position the second thermal interface material on a ... | 1. A system for a memory cooling pad, comprising:
a first thermal interface material coupled to a second thermal interface material by a liner material configured to position the first thermal interface material on a first side of a memory unit and to position the second thermal interface material on a second side of t... | In one implementation, a system for a memory cooling pad includes a first thermal interface material coupled to a second thermal interface material by a liner material configured to position the first thermal interface material on a first side of a memory unit and to position the second thermal interface material on a ... | 2,800 |
11,980 | 11,980 | 16,104,600 | 2,894 | In an embodiment, an assembly includes an electronic component, a fixing member, a resilient member and a substrate having a first surface. The electronic component includes a heat-generating semiconductor device, a die pad and a plastic housing. The heat-generating semiconductor device is mounted on a first surface of... | 1. An assembly, comprising:
an electronic component comprising:
a heat-generating semiconductor device;
a die pad; and
a plastic housing;
wherein the heat-generating semiconductor device is mounted on a first surface of the die pad and the die pad is at least partially embedded in the plastic housing;
a fixing member;... | In an embodiment, an assembly includes an electronic component, a fixing member, a resilient member and a substrate having a first surface. The electronic component includes a heat-generating semiconductor device, a die pad and a plastic housing. The heat-generating semiconductor device is mounted on a first surface of... | 2,800 |
11,981 | 11,981 | 15,741,397 | 2,844 | The invention provides a lighting unit, comprising a light source and a light sensor arrangement. An optical feedback path is provided from the light source (or another light source in the same overall system) to the light sensor arrangement. The light source is turned on in response to an external input and is maintai... | 1. A lighting unit, comprising:
a light source; a light sensor arrangement; and an optical feedback path from the light source to the light sensor arrangement, wherein the lighting unit is adapted to receive a first external input from a source external to the lighting unit for turning on the light source; wherein the ... | The invention provides a lighting unit, comprising a light source and a light sensor arrangement. An optical feedback path is provided from the light source (or another light source in the same overall system) to the light sensor arrangement. The light source is turned on in response to an external input and is maintai... | 2,800 |
11,982 | 11,982 | 15,577,737 | 2,834 | A drive device includes an electric motor and a gear unit that is driven by the electric motor. The electric motor has a laminated stator core which includes stator windings and is accommodated in a stator housing. The stator housing has recesses that are axially uninterrupted, i.e. in particular in the direction of th... | 1-15. (canceled) 16. A drive device, comprising:
a gear unit; and an electric motor adapted to drive the gear unit, the electric motor including a laminated stator core which has stator windings and is accommodated in a stator housing; wherein the stator housing includes recesses that are axially uninterrupted, the sta... | A drive device includes an electric motor and a gear unit that is driven by the electric motor. The electric motor has a laminated stator core which includes stator windings and is accommodated in a stator housing. The stator housing has recesses that are axially uninterrupted, i.e. in particular in the direction of th... | 2,800 |
11,983 | 11,983 | 15,062,113 | 2,853 | There is described a sheet-fed or web-fed printing press for numbering and varnishing of security documents, including banknotes, comprising: —a numbering group ( 02 ) comprising at least one numbering unit ( 21, 22 ) for numbering printed material in the form of individual sheets or successive portions of a continuous... | 1.-21. (canceled) 22. A sheet-fed or web-fed printing press for numbering and varnishing of security documents, including banknotes, comprising:
a numbering group comprising at least one numbering unit for numbering printed material in the form of individual sheets or successive portions of a continuous web carrying mu... | There is described a sheet-fed or web-fed printing press for numbering and varnishing of security documents, including banknotes, comprising: —a numbering group ( 02 ) comprising at least one numbering unit ( 21, 22 ) for numbering printed material in the form of individual sheets or successive portions of a continuous... | 2,800 |
11,984 | 11,984 | 15,945,649 | 2,848 | In one embodiment, a semiconductor package may be formed having a first side and a second side that is substantially opposite to the first side. An embodiment may include forming an attachment clip extending substantially laterally between the first and second sides wherein the attachment clip is positioned near a dist... | 1-12. (canceled) 13. A method of forming a semiconductor package comprising:
forming a first side of the package substantially parallel to a second side of the package; forming a first attachment clip extending between the first and second sides and positioned near a first end of the first and second sides wherein the ... | In one embodiment, a semiconductor package may be formed having a first side and a second side that is substantially opposite to the first side. An embodiment may include forming an attachment clip extending substantially laterally between the first and second sides wherein the attachment clip is positioned near a dist... | 2,800 |
11,985 | 11,985 | 15,339,114 | 2,856 | Methods that provide wrinkle characterization and performance prediction for wrinkled composite structures using automated structural analysis. In accordance with some embodiments, the method combines the use of B-scan ultrasound data, automated optical measurement of wrinkles and geometry of cross-sections, and finite... | 1. A method for calibrating an ultrasonic inspection system, comprising:
(a) forming a multiplicity of reference standards made of composite material, each reference standard having at least one wrinkle; (b) collecting ultrasonic B-scan data from the multiplicity of reference standards using an ultrasonic inspection sy... | Methods that provide wrinkle characterization and performance prediction for wrinkled composite structures using automated structural analysis. In accordance with some embodiments, the method combines the use of B-scan ultrasound data, automated optical measurement of wrinkles and geometry of cross-sections, and finite... | 2,800 |
11,986 | 11,986 | 16,107,942 | 2,813 | A system for reconstructing wafer maps of semiconductor wafers includes: a processor; and memory having instructions stored thereon that, when executed by the processor, cause the processor to: receive test data of a wafer at sparse sampling locations of the wafer, the sparse sampling locations being selected based on ... | 1. A system for reconstructing wafer maps of semiconductor wafers, comprising:
a processor; and memory having instructions stored thereon that, when executed by the processor, cause the processor to:
receive test data of a wafer at sparse sampling locations of the wafer, the sparse sampling locations being selected bas... | A system for reconstructing wafer maps of semiconductor wafers includes: a processor; and memory having instructions stored thereon that, when executed by the processor, cause the processor to: receive test data of a wafer at sparse sampling locations of the wafer, the sparse sampling locations being selected based on ... | 2,800 |
11,987 | 11,987 | 14,362,139 | 2,884 | The present invention relates to radiation detector ( 2 ) comprising a radiation sensitive semiconductor element ( 10 ) generating electron-hole pairs in response to an irradiation with radiation ( 3 ), an anode electrode( 20 ) arranged on a first surface ( 11 ) of the semiconductor element ( 10 ) facing away from the ... | 1. A radiation detector comprising:
a radiation sensitive semiconductor element generating electron-hole pairs in response to an irradiation with X-ray or gamma radiation, an anode electrode arranged on a first surface of the semiconductor element, said anode electrode being segmented into anode segments representing a... | The present invention relates to radiation detector ( 2 ) comprising a radiation sensitive semiconductor element ( 10 ) generating electron-hole pairs in response to an irradiation with radiation ( 3 ), an anode electrode( 20 ) arranged on a first surface ( 11 ) of the semiconductor element ( 10 ) facing away from the ... | 2,800 |
11,988 | 11,988 | 15,145,943 | 2,884 | A method is disclosed for generating an image. An embodiment of the method includes detecting a first projection data set via a first group of detector units, the first group including a first plurality of first detector units, each having more than a given number of detector elements; detecting a second projection dat... | 1. A method for generating an image, comprising:
detecting a first projection data set via a first group of detector units, the first group including a first plurality of first detector units, the first detector units each including more than a given number of detector elements, wherein the first detector units are eac... | A method is disclosed for generating an image. An embodiment of the method includes detecting a first projection data set via a first group of detector units, the first group including a first plurality of first detector units, each having more than a given number of detector elements; detecting a second projection dat... | 2,800 |
11,989 | 11,989 | 15,704,146 | 2,861 | The present disclosure relates to a method for monitoring the function of a sensor arrangement with at least two measuring points, wherein a sensor is arranged at each measuring point to determine at least one process variable of a medium, comprising the steps of contacting the medium with the sensors, determining a te... | 1. A method for monitoring the function of a sensor arrangement with at least two measuring points, comprising the steps:
contacting a medium with a sensor of the sensor arrangement, wherein the sensor arrangement includes a sensor arranged at each measuring point to determine at least one process variable of the mediu... | The present disclosure relates to a method for monitoring the function of a sensor arrangement with at least two measuring points, wherein a sensor is arranged at each measuring point to determine at least one process variable of a medium, comprising the steps of contacting the medium with the sensors, determining a te... | 2,800 |
11,990 | 11,990 | 15,837,857 | 2,818 | Implementations of semiconductor packages may include: one or more die having a first side and a second side opposite the first side; the first side of the die may include one or more external connection points; a layer of one or more metals comprised on the second side of the one or more die; a second layer of one or ... | 1. A semiconductor package comprising:
one or more die comprising a first side and a second side opposite the first side, the first side of the die comprising one or more external connection points; a layer of one or more metals comprised on the second side of the one or more die; a second layer of one or more metals c... | Implementations of semiconductor packages may include: one or more die having a first side and a second side opposite the first side; the first side of the die may include one or more external connection points; a layer of one or more metals comprised on the second side of the one or more die; a second layer of one or ... | 2,800 |
11,991 | 11,991 | 15,825,493 | 2,811 | OLED device structures are provided that include an OLED, a high index optical layer (HOL), a thin film barrier disposed over the high index optical layer, and a low index optical layer (LOL) disposed over the thin film barrier. It is shown that such devices provide acceptable color emission that is at least comparable... | 1. A device comprising:
a substrate; an OLED disposed over the substrate and comprising a first emissive layer configured to emit light of a first color; a high index optical layer having a refractive index of not less than 1.7 disposed over the OLED; a thin film barrier disposed over the high index optical layer; and ... | OLED device structures are provided that include an OLED, a high index optical layer (HOL), a thin film barrier disposed over the high index optical layer, and a low index optical layer (LOL) disposed over the thin film barrier. It is shown that such devices provide acceptable color emission that is at least comparable... | 2,800 |
11,992 | 11,992 | 12,850,940 | 2,878 | A photon engine and variations thereof and methods of operating the photon engines, the photon engines comprising a primary prism and a secondary prism, the method and apparatus repeatedly imparting linear momentum to multiple reflective surfaces of the photon engine communicating with an energy system. | 1. A method of operating a photon engine to produce linear momentum, the method comprising:
positioning a primary back face of a primary prism comprising a first transparent optical medium having a first index of refraction adjacent to and spaced apart from a secondary back face of a secondary prism comprising a second... | A photon engine and variations thereof and methods of operating the photon engines, the photon engines comprising a primary prism and a secondary prism, the method and apparatus repeatedly imparting linear momentum to multiple reflective surfaces of the photon engine communicating with an energy system.1. A method of o... | 2,800 |
11,993 | 11,993 | 14,766,346 | 2,865 | A method, system, and sensor for air flow sensing. The system can include a cantilever, a transducer, and a processing module. The method can include measuring beam deflections of one or more cantilevers, extracting information about air flow, and determining one or more of an airspeed, an angle of attack, and a sidesl... | 1. A method for air flow sensing, comprising:
measuring beam deflections of a cantilever; extracting information about air flow; and determining one or more of an airspeed, an angle of attack, and a sideslip, from the extracted information. 2. The method of claim 1, further comprising generating calibration data from b... | A method, system, and sensor for air flow sensing. The system can include a cantilever, a transducer, and a processing module. The method can include measuring beam deflections of one or more cantilevers, extracting information about air flow, and determining one or more of an airspeed, an angle of attack, and a sidesl... | 2,800 |
11,994 | 11,994 | 14,120,486 | 2,853 | An improved device for exposing an emulsion-coated screen to light comprises an array of ultraviolet light-emitting diodes (UV-LEDs); a positive impression of the artwork to be printed; a relatively-flat transparent plate disposed between the array of UV-LEDs and the positive impression; a screen coated with a light-cu... | 1. A device for exposing an emulsion stratum to light comprising plural sources of ultraviolet light closely adjacent the emulsion stratum. 2. A device for exposing an emulsion-coated screen to light comprising plural ultraviolet light-emitting diodes closely adjacent the emulsion-coated screen. 3. Plural ultraviolet l... | An improved device for exposing an emulsion-coated screen to light comprises an array of ultraviolet light-emitting diodes (UV-LEDs); a positive impression of the artwork to be printed; a relatively-flat transparent plate disposed between the array of UV-LEDs and the positive impression; a screen coated with a light-cu... | 2,800 |
11,995 | 11,995 | 15,503,115 | 2,896 | Method and apparatus for hardware coil compression is disclosed. The coils in an array configured for the same region of interest are grouped into sub-arrays. The coils of each sub-array are pre-combined with a hardware combiner before further processing. The pre-combination converter composed of the pre-combiners is f... | 1-13. (canceled) 14. A method of channel compression for magnetic resonance imaging (MRI), comprising:
pre-combining, using n′ pre-combiners, n outputs (C1, C2, . . . Cn) from n coils of an n coil array configured for imaging the same region of interest (ROI) to obtain fewer n′ pre-combination outputs, where n′ is an i... | Method and apparatus for hardware coil compression is disclosed. The coils in an array configured for the same region of interest are grouped into sub-arrays. The coils of each sub-array are pre-combined with a hardware combiner before further processing. The pre-combination converter composed of the pre-combiners is f... | 2,800 |
11,996 | 11,996 | 15,707,257 | 2,839 | A power converter circuit includes a power stage that includes a transformer and a switch. The switch can be controlled in response to a PWM signal to provide a primary current through a primary winding of the transformer to induce a secondary current in a secondary winding of the transformer to generate an output volt... | 1. A power converter circuit comprising:
a power stage comprising a transformer and a switch, the switch being controlled in response to a pulse-width modulation (PWM) signal to provide a primary current through a primary winding of the transformer to induce a secondary current in a secondary winding of the transformer... | A power converter circuit includes a power stage that includes a transformer and a switch. The switch can be controlled in response to a PWM signal to provide a primary current through a primary winding of the transformer to induce a secondary current in a secondary winding of the transformer to generate an output volt... | 2,800 |
11,997 | 11,997 | 12,875,873 | 2,829 | LED packages and LED displays utilizing the LED packages are disclosed, with the LED packages arranged to provide good contrast between the different pixels in an LED display while not reducing the perceived luminous flux or brightness of the display. One embodiment of an LED package comprises an LED chip and conversio... | 1. A light emitting diode (LED) package, comprising:
an LED chip and conversion material arranged to convert at least some light emitted from said LED chip, said package emitting light from said conversion material or a combination of light from said conversion material and said LED chip; a reflective area around said ... | LED packages and LED displays utilizing the LED packages are disclosed, with the LED packages arranged to provide good contrast between the different pixels in an LED display while not reducing the perceived luminous flux or brightness of the display. One embodiment of an LED package comprises an LED chip and conversio... | 2,800 |
11,998 | 11,998 | 15,204,096 | 2,872 | A dielectrophoretic display is shifted from a low frequency closed state to a high frequency open state via at least one, and preferably several, intermediate frequency states; the use of such multiple frequency steps reduces flicker during the transition. A second type of dielectrophoretic display has a light-transmis... | 1. A dielectrophoretic display comprising:
a dielectrophoretic medium comprising a fluid and a plurality of at least one type of particle within the fluid, the particles being movable through the fluid on application of an electric field to the dielectrophoretic medium; at least one light-transmissive electrode dispose... | A dielectrophoretic display is shifted from a low frequency closed state to a high frequency open state via at least one, and preferably several, intermediate frequency states; the use of such multiple frequency steps reduces flicker during the transition. A second type of dielectrophoretic display has a light-transmis... | 2,800 |
11,999 | 11,999 | 15,605,356 | 2,835 | A power fuse assembly includes a fuse mounting, a fuse unit, and a hinge assembly. The fuse unit is configured to carry current from a line connection to a load connection. The hinge assembly is configured to be removeably coupled to the fuse unit and to allow rotation of the fuse unit relative to the fuse mounting. Th... | 1. A power fuse assembly comprising:
a fuse mounting; a fuse unit configured to carry current from a line connection to a load connection; a hinge assembly removably coupling the fuse unit to the fuse mounting to allow rotation of the fuse unit relative to the fuse mounting, the hinge assembly including:
an inlet confi... | A power fuse assembly includes a fuse mounting, a fuse unit, and a hinge assembly. The fuse unit is configured to carry current from a line connection to a load connection. The hinge assembly is configured to be removeably coupled to the fuse unit and to allow rotation of the fuse unit relative to the fuse mounting. Th... | 2,800 |
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