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<DM6PR11MB31622313B095B7441827AA21D73EA@DM6PR11MB3162.namprd11.prod.outlook.com> |
Message-ID: <MN2PR07MB65264DF81E5485249E5A474CCB3EA@MN2PR07MB6526.namprd07.prod.outlook.com> |
Hello All, |
Thanks for all the good comments and suggestions. |
As several of you (and our own EHS) suggested, we have entrusted the cylinder to our toxic waste removal company. We are still a bit leery of sending out a potentially pressurized cylinder (albeit a small one) to be disposed of by possibly rough methods, but that is what was recommended. |
If we hear any additional news about it's final disposition, I'll be sure to let everyone know. |
Again, thanks for all the help and good recommendations. |
Mac Hathaway |
Harvard CNS |
________________________________ |
From: Collins, Deon <deonc69 at illinois.edu> |
Sent: Thursday, July 20, 2023 2:55 PM |
To: Hathaway, Malcolm R <hathaway at cns.fas.harvard.edu>; Labnetwork Mailing List <labnetwork at mtl.mit.edu> |
Subject: RE: TTIP Cylinder Overheated - Request for Advise |
I would have the bottle disposed of ASAP. The structural integrity of the cylinder has been compromised. |
Deon D. Collins |
FACILITY MANAGER |
The Grainger College Of Engineering UIUC |
Holonyak Micro & Nanotechnology Lab |
208 N Wright St Rm. 1114 | MC-249 |
Urbana, IL 61801 |
217-300-7531 | deonc69 at illinois.edu<mailto:deonc69 at illinois.edu> |
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Under the Illinois Freedom of Information Act any written communication to or from university employees regarding university business is a public record and may be subject to public disclosure. |
Life is not about watching other people live it. It?s about you living your own! |
From: labnetwork <labnetwork-bounces at mtl.mit.edu> On Behalf Of Hathaway, Malcolm R |
Sent: Tuesday, July 18, 2023 4:52 PM |
To: Labnetwork Mailing List <labnetwork at mtl.mit.edu> |
Subject: [labnetwork] TTIP Cylinder Overheated - Request for Advise |
Hey all, |
We (not CNS, but another lab) have an issue with a TTIP cylinder (Cambridge Nano/swagelok-style) which got over-heated to an unknown temp, whereupon the bottle acquired a bulge. It was closed at the time, and so is still under pressure to an unknown degree. The bottle label melted, for reference. |
Questions: |
Are the contents likely to be decomposition products? |
Would these products be flammable or explosive? |
Can a bottle burst under the flexural stress of slow depressurization? |
Is there a safe way to depressurize? |
We came up with the idea of attaching a second valve (these are all VCR), and alternating opening inner valve (then closing) and opening outer valve (then closing), to step-wise vent the bottle. Has anyone heard of such a technique causing the bottle to burst along the way? |
Suggestion welcome. |
Mac |
-- |
Mac Hathaway |
Senior Process and Systems Engineer |
Harvard Center for Nanoscale Systems |
11 Oxford St. |
Cambridge, MA 02138 |
617-495-9012 |
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From manuel.lozano at csic.es Mon Jul 24 06:37:58 2023 |
From: manuel.lozano at csic.es (Manuel Lozano) |
Date: Mon, 24 Jul 2023 12:37:58 +0200 |
Subject: [labnetwork] SiC wafers processed in AMI P500 |
Message-ID: <d761f2b0-0f69-435d-3bc1-4ce663c6ea95@csic.es> |
Dear Colleagues, |
we have an old Applied Materials P500 LPCVD that we use for SiO2 deposition. The robotic arm is intended for 6 inches wafers. We have been using it with 4 inches SiC wafers for many years using a pocket wafer, we etched a 4 inches pocket on a 6 inches Si wafer, and that worked perfectly. |
We have now moved to 6 inches SiC wafers, therefore we do not need the pocket wafer more. Nevertheless, when we tried to process the wafers directly we discovered that the robotic arm does not recognize the presence of the wafer, as SiC is transparent, and refuses to load them. |
We tried using different materials deposited in the backside to make the wafer opaque (resist, metal, polysilicon), but the result is not satisfactory as the quality of the surface is degraded. |
The equipment is very old and it is not longer maintained by AMI, so we can not ask for reprogramming? the robot software. |
Does any of you have experience with processing transparent wafer with robotic arms? Do you foresee any solution? |
We will appreciate any suggestion |
Best regards |
Manuel |
---------------------------------------------------------------------------------- |
Prof. Manuel Lozano |
Centro Nacional de Microelectronica IMB-CNM (CSIC) |
Campus UAB, C/ Til?lers, s/n |
08193 Bellaterra, Barcelona, Spain |
tel.: +34 93 594 77 00 ext. 2120 |
email: manuel.lozano at csic.es |
---------------------------------------------------------------------------------- |
From Peter.Lomax at ed.ac.uk Mon Jul 24 09:00:53 2023 |
From: Peter.Lomax at ed.ac.uk (Peter Lomax) |
Date: Mon, 24 Jul 2023 13:00:53 +0000 |
Subject: [labnetwork] SiC wafers processed in AMI P500 |
In-Reply-To: <d761f2b0-0f69-435d-3bc1-4ce663c6ea95@csic.es> |
References: <d761f2b0-0f69-435d-3bc1-4ce663c6ea95@csic.es> |
Message-ID: <PAVPR05MB99046F4FE36DAF0387C101F9C802A@PAVPR05MB9904.eurprd05.prod.outlook.com> |
Hi, |
On our STS PECVD for transparent material we have to cheat and put a piece of tin foil over the sensor. |
Best |
Peter |
-----Original Message----- |
From: labnetwork <labnetwork-bounces at mtl.mit.edu> On Behalf Of Manuel Lozano |
Sent: 24 July 2023 11:38 |
To: labnetwork at mtl.mit.edu |
Subject: [labnetwork] SiC wafers processed in AMI P500 |
This email was sent to you by someone outside the University. |
You should only click on links or attachments if you are certain that the email is genuine and the content is safe. |
Dear Colleagues, |
we have an old Applied Materials P500 LPCVD that we use for SiO2 deposition. The robotic arm is intended for 6 inches wafers. We have been using it with 4 inches SiC wafers for many years using a pocket wafer, we etched a 4 inches pocket on a 6 inches Si wafer, and that worked perfectly. |
We have now moved to 6 inches SiC wafers, therefore we do not need the pocket wafer more. Nevertheless, when we tried to process the wafers directly we discovered that the robotic arm does not recognize the presence of the wafer, as SiC is transparent, and refuses to load them. |
We tried using different materials deposited in the backside to make the wafer opaque (resist, metal, polysilicon), but the result is not satisfactory as the quality of the surface is degraded. |
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